Sierra Wireless HL7688 Wireless module User Manual

Sierra Wireless Inc. Wireless module

User manual

4119272
2.0
August 16, 2016
AirPrime HL7688
Product Technical Specification
4119272 Rev 2.0 August 16, 2016 2
Product Technical Specification
Important Notice
Due to the nature of wireless communications, transmission and reception of data can never be
guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant
delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used
in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used
in situations where failure to transmit or receive data could result in damage of any kind to the user or
any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless
accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or
received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or
receive such data.
Safety and Hazards
Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without
proper device certifications. These areas include environments where cellular radio can interfere such
as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to
any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere
with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is
on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When
operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard
systems.
Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door
is open. Sierra Wireless modems may be used at this time.
The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of
a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In
some states and provinces, operating such communications devices while in control of a vehicle is an
offence.
Limitations of Liability
This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or
implied, including any implied warranties of merchantability, fitness for a particular purpose, or
noninfringement. The recipient of the manual shall endorse all risks arising from its use.
The information in this manual is subject to change without notice and does not represent a
commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES
SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL,
GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING,
BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR
REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS
PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY
THIRD PARTY.
Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability
arising under or in connection with the Sierra Wireless product, regardless of the number of events,
occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the
Sierra Wireless product.
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Product Technical Specification
Patents
This product may contain technology developed by or for Sierra Wireless Inc.
This product includes technology licensed from QUALCOMM®.
This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents
licensed from InterDigital Group and MMP Portfolio Licensing.
Copyright
© 2016 Sierra Wireless. All rights reserved.
Trademarks
Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO®, ALEOS® and the Sierra Wireless and
Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries.
Watcher® is a registered trademark of NETGEAR, Inc., used under license.
Windows® and Windows Vista® are registered trademarks of Microsoft Corporation.
Macintosh® and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other
countries.
QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license.
Other trademarks are the property of their respective owners.
Contact Information
Sales information and technical support,
including warranty and returns
Web: sierrawireless.com/company/contact-us/
Global toll-free number: 1-877-687-7795
6:00 am to 6:00 pm PST
Corporate and product information Web: sierrawireless.com
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Product Technical Specification
Document History
Version Date Updates
1.0 May 23, 2016 Creation
1.1 May 26, 2016
Updated:
Table 2 General Features
1.8.2 Regulatory
3.16.2 RF Performances
1.2 May 30, 2016
Updated:
Figure 2 Mechanical Overview
4 Mechanical Drawings
2.0 August 16, 2016 Updated section 7 FCC Regulations
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Contents
1.INTRODUCTION .................................................................................................. 10
1.1.Common Flexible Form Factor (CF3) ............................................................................. 10
1.2.Physical Dimensions ..................................................................................................... 10
1.3.General Features .......................................................................................................... 11
1.4.Architecture ................................................................................................................... 13
1.5.Interfaces ...................................................................................................................... 14
1.6.Connection Interface ..................................................................................................... 14
1.7.ESD .............................................................................................................................. 15
1.8.Environmental and Certifications ................................................................................... 15
1.8.1.Environmental Specifications ................................................................................. 15
1.8.2.Regulatory ............................................................................................................. 16
1.8.3.RoHS Directive Compliant ..................................................................................... 16
1.8.4.Disposing of the Product ........................................................................................ 16
1.9.References .................................................................................................................... 16
2.PAD DEFINITION ................................................................................................. 17
2.1.Pad Configuration (Top View, Through Module) ........................................................... 22
3.DETAILED INTERFACE SPECIFICATIONS ....................................................... 23
3.1.Power Supply ................................................................................................................ 23
3.2.Current Consumption .................................................................................................... 23
3.3.VGPIO ........................................................................................................................... 24
3.4.BAT_RTC ...................................................................................................................... 2 5
3.5.SIM Interface ................................................................................................................. 25
3.5.1.UIM1_DET ............................................................................................................. 26
3.6.USB .............................................................................................................................. 26
3.7.Electrical Information for Digital I/O ............................................................................... 26
3.8.General Purpose Input/Output (GPIO) .......................................................................... 27
3.9.Main Serial Link (UART1) .............................................................................................. 28
3.10.POWER-ON Signal (PWR_ON_N) ................................................................................ 28
3.11.Reset Signal (RESET_IN_N) ........................................................................................ 29
3.12.Analog to Digital Converter (ADC1) ............................................................................... 30
3.13.Clock Interface .............................................................................................................. 3 0
3.14.PCM .............................................................................................................................. 31
3.15.Debug Interfaces ........................................................................................................... 32
3.15.1.Trace Debug .......................................................................................................... 32
3.15.2.JTAG ...................................................................................................................... 33
3.16.RF Interface .................................................................................................................. 33
3.16.1.RF Connection ....................................................................................................... 33
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Product Technical Specification
3.16.2.RF Performances ................................................................................................... 34
3.16.3.TX_ON Indicator (TX_ON) ..................................................................................... 34
4.MECHANICAL DRAWINGS ................................................................................. 36
5.DESIGN GUIDELINES ......................................................................................... 39
5.1.Power-Up Sequence ..................................................................................................... 39
5.2.Module Switch-Off ......................................................................................................... 40
5.3.Emergency Power OFF ................................................................................................. 40
5.4.Sleep Mode Management ............................................................................................. 40
5.4.1.Using UART1 ......................................................................................................... 40
5.4.2.Using USB ............................................................................................................. 41
5.5.Power Supply Design .................................................................................................... 41
5.6.ESD Guidelines for SIM Card ........................................................................................ 41
5.7.ESD Guidelines for USB ............................................................................................... 42
6.RELIABILITY SPECIFICATION ........................................................................... 43
6.1.Reliability Compliance ................................................................................................... 43
6.2.Reliability Prediction Model ........................................................................................... 43
6.2.1.Life Stress Test ...................................................................................................... 43
6.2.2.Environmental Resistance Stress Tests ................................................................. 44
6.2.3.Corrosive Resistance Stress Tests ........................................................................ 44
6.2.4.Thermal Resistance Cycle Stress Tests ................................................................. 45
6.2.5.Mechanical Resistance Stress Tests ..................................................................... 47
6.2.6.Handling Resistance Stress Tests ......................................................................... 48
7.FCC REGULATIONS ........................................................................................... 50
8.ORDERING INFORMATION ................................................................................ 52
9.TERMS AND ABBREVIATIONS .......................................................................... 53
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List of Figures
Figure 1.Architecture Overview ................................................................................................... 13
Figure 2.Mechanical Overview .................................................................................................... 14
Figure 3.Pad Configuration ......................................................................................................... 22
Figure 4.PCM Timing Waveform ................................................................................................. 32
Figure 5.TX_ON State During Transmission ............................................................................... 35
Figure 6.Mechanical Drawing ...................................................................................................... 36
Figure 7.Dimensions Drawing ..................................................................................................... 37
Figure 8.Footprint ........................................................................................................................ 38
Figure 9.PWR_ON_N Sequence with VGPIO Information .......................................................... 39
Figure 10.Power OFF Sequence for PWR_ON_N, VGPIO ........................................................... 40
Figure 11.Voltage Limiter Example ............................................................................................... 41
Figure 12.EMC and ESD Components Close to the SIM .............................................................. 42
Figure 13.ESD Protection for USB ................................................................................................ 42
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List of Tables
Table 1.Supported Bands/Connectivity ...................................................................................... 10
Table 2.General Features .......................................................................................................... 11
Table 3.ESD Specifications ........................................................................................................ 15
Table 4.Environmental Specifications ........................................................................................ 15
Table 5.Regulation Compliance ................................................................................................. 16
Table 6.Pad Definition ................................................................................................................ 17
Table 7.Power Supply ................................................................................................................ 23
Table 8.Current Consumption .................................................................................................... 23
Table 9.Current Consumption per Power Supply ....................................................................... 24
Table 10.VGPIO Electrical Characteristics ................................................................................... 24
Table 11.BAT_RTC Electrical Characteristics .............................................................................. 25
Table 12.UIM1 Pad Description ................................................................................................... 25
Table 13.Electrical Characteristics of UIM1.................................................................................. 26
Table 14.USB Pad Description .................................................................................................... 26
Table 15.Digital I/O Electrical Characteristics .............................................................................. 27
Table 16.GPIO Pad Description ................................................................................................... 27
Table 17.UART1 Pad Description ................................................................................................ 28
Table 18.PWR_ON_N Electrical Characteristics .......................................................................... 29
Table 19.RESET_IN_N Electrical Characteristics ........................................................................ 29
Table 20.ADC Interface Pad Description ..................................................................................... 30
Table 21.ADC Electrical Characteristics ...................................................................................... 30
Table 22.Clock Interface Pad Description .................................................................................... 30
Table 23.PCM Interface Pad Description ..................................................................................... 31
Table 24.PCM Electrical Characteristics ...................................................................................... 31
Table 25.Trace Debug Pad Description ....................................................................................... 32
Table 26.JTAG Pad Description ................................................................................................... 33
Table 27.RF Main Connection ..................................................................................................... 33
Table 28.RF Diversity Connection ............................................................................................... 33
Table 29.Conducted RX Sensitivity – UMTS Bands ..................................................................... 34
Table 30.Conducted RX Sensitivity – LTE Bands ........................................................................ 34
Table 31.TX_ON Indicator Pad Description ................................................................................. 34
Table 32.TX_ON Characteristics ................................................................................................. 34
Table 33.Standards Conformity ................................................................................................... 43
Table 34.Life Stress Test ............................................................................................................. 4 3
Table 35.Environmental Resistance Stress Tests ........................................................................ 44
Table 36.Corrosive Resistance Stress Tests ............................................................................... 44
Table 37.Thermal Resistance Cycle Stress Tests ........................................................................ 45
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Product Technical Specification
Table 38.Mechanical Resistance Stress Tests ............................................................................. 47
Table 39.Handling Resistance Stress Tests ................................................................................ 48
Table 40.Ordering Information ..................................................................................................... 52
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1. Introduction
This document is the Product Technical Specification for the AirPrime HL7688 Embedded Module. It
defines the high level product features and illustrates the interfaces for these features. This document
is intended to cover the hardware aspects of the product, including electrical and mechanical.
The AirPrime HL7688 belongs to the AirPrime HL Series from Essential Connectivity Module family.
These are industrial grade Embedded Wireless Modules that provide data connectivity on wireless
networks (as listed in Table 1 Supported Bands/Connectivity).
The HL7688 supports a large variety of interfaces such as USB 2.0, UART and GPIOs to provide
customers with the highest level of flexibility in implementing high-end solutions.
Table 1. Supported Bands/Connectivity
RF Band Transmit Band (Tx) Receive Band (Rx) Maximum Output Power
LTE B2 1850 to 1910 MHz 1930 to 1990 MHz 23 dBm (+/- 2dBm) Class 3bis
LTE B4 1710 to 1755 MHz 2110 to 2155 MHz 23 dBm (+/- 2dBm) Class 3bis
LTE B5 824 to 849 MHz 869 to 894 MHz 23 dBm (+/- 2dBm) Class 3bis
LTE B17 704 to 716 MHz 734 to 746 MHz 23 dBm (+/- 2dBm) Class 3bis
UMTS B2 1850 to 1910 MHz 1930 to 1990 MHz 23 dBm (+/- 2dBm) Class 3bis
UMTS B5 824 to 849 MHz 869 to 894 MHz 23 dBm (+/- 2dBm) Class 3bis
1.1. Common Flexible Form Factor (CF3)
The AirPrime HL7688 belongs to the Common Flexible Form Factor (CF3) family of modules. This
family consists of a series of WWAN modules that share the same mechanical dimensions (same
width and length with varying thicknesses) and footprint. The CF3 form factor provides a unique
solution to a series of problems faced commonly in the WWAN module space as it:
Accommodates multiple radio technologies (from 2G to LTE advanced) and band groupings
Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions
Offers electrical and functional compatibility
Provides Direct Mount as well as Socketability depending on customer needs
1.2. Physical Dimensions
AirPrime HL7688 modules are compact, robust, fully shielded modules with the following dimensions:
Length: 23 mm
Width: 22 mm
Thickness: 2.5 mm
Weight: 3.5 g
Note: Dimensions specified above are typical values.
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Product Technical Specification Introduction
1.3. General Features
The table below summarizes the AirPrime HL7688 features.
Table 2. General Features
Feature Description
Physical
Small form factor (146-pad solderable LGA pad) – 23mm x 22mm x
2.5mm (nominal)
Complete body shielding
RF connection pads (RF main interface)
Baseband signals connection
Electrical Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V
RF
Quad-band LTE:
LTE B2: 1900 PCS
LTE B4: 1700 AWS
LTE B5: 850 CLR
LTE B17: 700
Dual-band UMTS:
UMTS B2: 1900 PCS
UMTS B5: 850 CLR
SIM interface
Dual SIM Single Standby (DSSS)
1.8V/3V support
SIM extraction / hot plug detection
SIM/USIM support
Conforms with ETSI UICC Specifications
Supports SIM application tool kit with proactive SIM commands
Application interface
NDIS NIC interface support (Windows XP, Windows 7, Windows 8,
Windows CE, Linux)
Multiple non-multiplexed USB channel support
Dial-up networking
USB selective suspend to maximize power savings
CMUX multiplexing over UART*
AT command interface – 3GPP 27.007 standard, plus proprietary
extended AT commands
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Product Technical Specification Introduction
Feature Description
Protocol Stack
Single mode LTE operation:
LTE FDD, bandwidth 1.4-20 MHz
System Release: 3GPP Rel. 9
Category 1 (up to 10 Mbit/s in downlink, 5 Mbit/s in uplink)
Rx Diversity
Max modulation 64 QAM DL, 16 QAM UL
Intra-frequency and inter-frequency mobility
SMS over SGs and IMS
SON ANR
Public Warning System PWS
HSDPA (High Speed Downlink Packet Access)
Evolved High Speed Downlink Packet Access (HSDPA+)
Compliant with 3GPP Release 9
Up to Category 24 (DC, 42.2Mbps)
Continuous Packet Connectivity (CPC)
Enhance fractional DPCH
IPv6 support
HSUPA (High Speed Uplink Packet Access)
Compliant with 3GPP Release 9
Category 7 (11.5Mbps)
Robust Header Compression (RoHC)
RXDIV Performance Enhancements
Type 3i (HSDPA)
HSPA Enhancements
MAC-ehs Rel. 7
HSDPA Enhanced CELL_FACH/PCH states
HSUPA Enhanced CELL_FACH states (eFACH) Rel 8
MAC-i/is Rel.8
Serving cell change enhancements Rel. 8
SMS
SMS over SGs and IMS
SMS MO and MT
SMS saving to SIM card or ME storage
SMS reading from SIM card or ME storage
SMS sorting
SMS concatenation
SMS Status Report
SMS replacement support
SMS storing rules (support of AT+CNMI, AT+CNMA)
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Product Technical Specification Introduction
Feature Description
Connectivity
Multiple (up to 20) cellular packet data profiles
Sleep mode for minimum idle power draw
Mobile-originated PDP context activation / deactivation
Support QoS profile
Release 97 – Precedence Class, Reliability Class, Delay Class, Peak
Throughput, Mean Throughput
Release 99 QoS negotiation – Background, Interactive, and
Streaming
Static and Dynamic IP address. The network may assign a fixed IP
address or dynamically assign one using DHCP (Dynamic Host
Configuration Protocol).
Supports PAP and CHAP authentication protocols
PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context
RFC1144 TCP/IP header compression
Environmental
Operating temperature ranges (industrial grade):
Class A: -30°C to +70°C
Class B: -40°C to +85°C
RTC Real Time Clock (RTC) with calendar
1.4. Architecture
The figure below presents an overview of the AirPrime HL7688’s internal architecture and external
interfaces.
AirPrime HL7688
Memory
(Flash + RAM)
SAW
Filters
26MHz 32.768KHz
UART x 1
Trace Debug (5 pins)
VBATT
GND
VGPIO
BAT_RTC
GPIO x 12
RESET_IN
RF Main
JTAG
LGA-
146
Baseband
SIM1
MCU DSP
PMU RF
Analog Baseband
Peripherals
LGA-
146
26M_CLKOUT
32K_CLKOUT
PWR_ON
Dulpexer
PA
USB
Antenna
Switch
Antenna
Switch
RX_LTE RF RF DIV
TX_LTE
RFRX_LTE
ADC x 1
PCM
TX_ON
Figure 1. Architecture Overview
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Product Technical Specification Introduction
1.5. Interfaces
The AirPrime HL7688 module provides the following interfaces and peripheral connectivity:
1x 8-wire UART
1x – Active Low RESET
1x – USB 2.0
1x – Backup Battery Interface
2x – System Clock Out
1x – Active Low POWER-ON
1x – 1.8V/3V SIM
1x – JTAG Interface
12x – GPIOs (2 of which have multiplexes)
1x – Main Antenna
1x – RX Diversity Antenna
1x VGPIO
1x TX_ON
1x ADC
1x PCM
1x – Debug Interface
1.6. Connection Interface
The AirPrime HL7688 module is an LGA form factor device. All electrical and mechanical connections
are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB.
Figure 2. Mechanical Overview
The 146 pads have the following distribution:
66 inner signal pads, 1x0.5mm, pitch 0.8mm
1 reserved test point (do not connect), 1.0mm diameter
7 test point (JTAG), 0.8mm diameter, 1.20mm pitch
64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm
4 inner corner ground pads, 1x1mm
4 outer corner ground pads, 1x0.9mm
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Product Technical Specification Introduction
1.7. ESD
Refer to the following table for ESD Specifications.
Note: Information specified in the following table is preliminary and subject to change.
Table 3. ESD Specifications
Category Connection Specification
Operational RF ports IEC-61000-4-2 – Level (Electrostatic Discharge Immunity Test)
Non-operational Host connector
interface
Unless otherwise specified:
JESD22-A114 +/- 1kV Human Body Model
JESD22-A115 +/- 200V Machine Model
JESD22-C101C +/- 250V Charged Device Model
Signals
SIM connector Adding ESD protection is highly recommended at the point where
the USIM contacts are exposed, and for any other signals that
would be subjected to ESD by the user.
Other host signals
1.8. Environmental and Certifications
1.8.1. Environmental Specifications
The environmental specification for both operating and storage conditions are defined in the table
below.
Table 4. Environmental Specifications
Conditions Range
Operating Class A -30°C to +70°C
Operating Class B -40°C to +85°C
Storage -40°C to +85°C
Class A is defined as the operating temperature ranges that the device:
Shall exhibit normal function during and after environmental exposure.
Shall meet the minimum requirements of 3GPP or appropriate wireless standards.
Class B is defined as the operating temperature ranges that the device:
Shall remain fully functional during and after environmental exposure
Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even
when one or more environmental constraint exceeds the specified tolerance.
Unless otherwise stated, full performance should return to normal after the excessive
constraint(s) have been removed.
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Product Technical Specification Introduction
1.8.2. Regulatory
The AirPrime HL7688 is compliant with FCC regulations.
FCC compliance will be reflected on the AirPrime HL7688 label.
Table 5. Regulation Compliance
Document Current Version Description
GCF-CC v3.56.1 or later GCF Conformance Certification Criteria
NAPRD.03 V5.22 or later North American Program Reference Document
FCC Part 22, 24, 27 NA Federal Communications Commission
1.8.3. RoHS Directive Compliant
The AirPrime HL7688 module is compliant with RoHS Directive 2011/65/EU which sets limits for the
use of certain restricted hazardous substances. This directive states that “from 1st July 2006, new
electrical and electronic equipment put on the market does not contain lead, mercury, cadmium,
hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)”.
1.8.4. Disposing of the Product
This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical
and Electronic Equipment (WEEE). As such, this product must not be disposed of at a
municipal waste collection point. Please refer to local regulations for directions on how
to dispose of this product in an environmental friendly manner.
1.9. References
[1] AirPrime HL Series Customer Process Guidelines
Reference Number: 4114330
[2] AirPrime HL7688 AT Commands Interface Guide
Reference Number: TBD
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2. Pad Definition
AirPrime HL7688 pads are divided into 3 functional categories.
Core functions and associated pads cover all the mandatory features for M2M connectivity and will be available by default across all CF3 family of
modules. These Core functions are always available and always at the same physical pad locations. A customer platform using only these functions
and associated pads is guaranteed to be forward and/or backward compatible with the next generation of CF3 modules.
Extension functions and associated pads bring additional capabilities to the customer. Whenever an Extension function is available on a module, it
is always at the same pad location.
Custom functions and associated pads are specific to a given module, and make an opportunistic use of specific chipset functions and I/Os.
Custom features should be used with caution as there is no guarantee that the custom functions available on a given module will be available on
other CF3 modules.
Other pads marked as “not connected” or “reserved” should not be used.
Table 6. Pad Definition
Pad # Signal Name Function I/O Active
Low / High
Power Supply
Domain
Recommendation
for Unused Pads Type
1 GPIO1 General purpose input/output I/O 1.8V Left Open Extension
2 UART1_RI /
TRACE_DATA3 UART1 Ring indicator / Trace data 3 O 1.8V Connect to test point Core / Custom
3 UART1_RTS UART1 Request to send I L 1.8V Connect to test point Core
4 UART1_CTS UART1 Clear to send O L 1.8V Connect to test point Core
5 UART1_TX UART1 Transmit data I 1.8V Connect to test point Core
6 UART1_RX UART1 Receive data O 1.8V Connect to test point Core
7 UART1_DTR UART1 Data terminal ready I L 1.8V Connect to test point Core
8 UART1_DCD /
TRACE_DATA1 UART1 Data carrier detect / Trace data 1 O L 1.8V Connect to test point Core / Custom
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Product Technical Specification Pad Definition
Pad # Signal Name Function I/O Active
Low / High
Power Supply
Domain
Recommendation
for Unused Pads Type
9 UART1_DSR /
TRACE_DATA0 UART1 Data set ready / Trace data 0 O L 1.8V Connect to test point Core / Custom
10 GPIO2 / TRACE_DATA2 General purpose input/output / Trace data 2 I/O 1.8V Connect to test point Core / Custom
11 RESET_IN_N Input reset signal I L 1.8V Left Open Core
12 USB_D- USB Data Negative (Low / Full Speed) I/O 3.3V Connect to test point Extension
USB Data Negative (High Speed) 0.38V
13 USB_D+ USB Data Positive (Low / Full Speed) I/O 3.3V Connect to test point Extension
USB Data Positive (High Speed) 0.38V
14 NC Not Connected (Reserved for future use) Left Open Not connected
15 NC Not Connected (Reserved for future use) Left Open Not connected
16 USB_VBUS USB VBUS I 5V Connect to test point Extension
17 NC Not Connected (Reserved for future use) Left Open Not connected
18 NC Not Connected (Reserved for future use) Left Open Not connected
19 NC Not Connected (Reserved for future use) Left Open Not connected
20 NC Not Connected (Reserved for future use) Left Open Not connected
21 BAT_RTC Power supply for RTC backup I/O 1.8V Left Open Extension
22 26M_CLKOUT 26MHz System Clock Output O 1.8V Left Open Extension
23 32K_CLKOUT 32.768kHz System Clock Output O 1.8V Left Open Extension
24 ADC1 Analog to digital converter I 1.2V Left Open Extension
25 NC Not Connected (Reserved for future use) Left Open Not connected
26 UIM1_VCC 1.8V/3V SIM1 Power supply O 1.8V/3V Mandatory
connection Core
27 UIM1_CLK 1.8V/3V SIM1 Clock O 1.8V/3V Mandatory
connection Core
28 UIM1_DATA 1.8V/3V SIM1 Data I/O 1.8V/3V Mandatory
connection Core
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Product Technical Specification Pad Definition
Pad # Signal Name Function I/O Active
Low / High
Power Supply
Domain
Recommendation
for Unused Pads Type
29 UIM1_RESET 1.8V/3V SIM1 Reset O L 1.8V/3V Mandatory
connection Core
30 GND Ground 0V 0V Mandatory
connection Extension
31 RF_DIV RF Input - Diversity Mandatory
connection Extension
32 GND Ground 0V 0V Mandatory
connection Extension
33 PCM_OUT PCM data out O 1.8V Left Open Extension
34 PCM_IN PCM data in I 1.8V Left Open Extension
35 PCM_SYNC PCM sync out I/O 1.8V Left Open Extension
36 PCM_CLK PCM clock I/O 1.8V Left Open Extension
37 GND Ground 0V 0V Mandatory
connection Core
38 NC Not Connected (Reserved for future use) Left Open Not connected
39 GND Ground 0V 0V Mandatory
connection Core
40 GPIO7 General purpose input/output I/O 1.8V Left Open Core
41 GPIO8 / TRACE_CLK General purpose input/output / Trace clock I/O 1.8V Connect to test point Core/Custom
42 NC Not Connected (Reserved for future use) Left Open Not connected
43 NC Not Connected (Reserved for future use) Left Open Not connected
44 GPIO13 General purpose input/output O 1.8V Left Open Extension
45 VGPIO GPIO voltage output O 1.8V Left Open Core
46 GPIO6 General purpose input/output I/O 1.8V Left Open Core
47 NC Not Connected (Reserved for future use) Left Open Not connected
48 GND Ground 0V 0V Mandatory
connection Core
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Product Technical Specification Pad Definition
Pad # Signal Name Function I/O Active
Low / High
Power Supply
Domain
Recommendation
for Unused Pads Type
49 RF_MAIN RF Input/output Mandatory
connection Core
50 GND Ground 0V 0V Mandatory
connection Core
51 GPIO14 General purpose input/output I 1.8V Left Open Extension
52 GPIO10 General purpose input/output I/O 1.8V Left Open Extension
53 GPIO11 General purpose input/output I/O 1.8V Left Open Extension
54 GPIO15 General purpose input/output I/O 1.8V Left Open Extension
55 NC Not Connected (Reserved for future use) Left Open Not connected
56 NC Not Connected (Reserved for future use) Left Open Not connected
57 NC Not Connected (Reserved for future use) Left Open Not connected
58 NC Not Connected (Reserved for future use) Left Open Not connected
59 PWR_ON Active Low Power On control signal I L 1.8V Mandatory
connection Core
60 TX_ON TX indicator O 2.3V Left Open Extension
61 VBATT_PA Power supply (refer to section 3.1 Power
Supply for more information) I
3.2V (min)
3.7V (typ)
4.5V (max)
Mandatory
connection Core
62 VBATT_PA Power supply (refer to section 3.1 Power
Supply for more information) I
3.2V (min)
3.7V (typ)
4.5V (max)
Mandatory
connection Core
63 VBATT Power supply I
3.2V (min)
3.7V (typ)
4.5V (max)
Mandatory
connection Core
64 UIM1_DET UIM1 Detection I/O H 1.8V Left Open Core
65 GPIO4 General purpose input/output I/O H 1.8V Left Open Extension
66 GPIO5 General purpose input/output I/O 1.8V Left Open Extension
67-70 GND Ground GND 0V Core
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Product Technical Specification Pad Definition
Pad # Signal Name Function I/O Active
Low / High
Power Supply
Domain
Recommendation
for Unused Pads Type
71 - 166 Note: These pads are not available on the AirPrime HL7688 module.
167 - 234 GND Ground GND 0V Core
236 JTAG_RESET JTAG RESET I L 1.8V Left Open Extension
237 JTAG_TCK JTAG Test Clock I 1.8V Left Open Extension
238 JTAG_TDO JTAG Test Data Output O 1.8V Left Open Extension
239 JTAG_TMS JTAG Test Mode Select I 1.8V Left Open Extension
240 JTAG_TRST JTAG Test Reset I L 1.8V Left Open Extension
241 JTAG_TDI JTAG Test Data Input I 1.8V Left Open Extension
242 JTAG_RTCK JTAG Returned Test Clock O 1.8V Left Open Extension
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Product Technical Specification Pad Definition
2.1. Pad Configuration (Top View, Through Module)
Figure 3. Pad Configuration
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3. Detailed Interface Specifications
Note: If not specified, all electrical values are given for VBATT=3.7V and an operating temperature of
25°C.
For standard applications, VBATT and VBATT_PA must be tied externally to the same power
supply. For some specific applications, AirPrime HL7688 modules support separate VBATT and
VBATT_PA connection if requirements below are fulfilled.
3.1. Power Supply
The AirPrime HL7688 modules is supplied through the VBATT signal with the following
characteristics.
Table 7. Power Supply
Supply Minimum Typical Maximum
VBATT voltage (V) 3.2* 3.7 4.5
VBATT_PA voltage (V) Full Specification 3.2* 3.7 4.5
VBATT_PA voltage (V) Extended Range 2.8 3.7 4.5
* This value has to be guaranteed during the burst.
Note: Load capacitance for VBATT is around 32µF ± 20% embedded inside the module.
Load capacitance for VBATT_PA is around 10µF ± 20% embedded inside the module.
3.2. Current Consumption
The following table lists the current consumption of the AirPrime HL7688 at different conditions.
Note: The following data is with USB disconnected to achieve the lowest current consumption. An
additional 0.6mA will be consumed if USB is connected.
Typical values are defined for VBATT/VBATT_PA at 3.7V and 25°C, for 50 impedance at all RF
ports. Maximum values are provided for VSWR3:1 with worst conditions among supported ranges
of voltages and temperature.
Table 8. Current Consumption
Parameter Minimum Typical Maximum Unit
Off mode 95 110 202 µA
Sleep mode – LTE
DRX = 1.28s
USB = disconnected
Band 2 1.2 1.4 6.2 mA
Band 4 1.2 1.4 6.2 mA
Band 5 1.2 1.4 6.2 mA
Band 17 1.2 1.4 6.2 mA
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Product Technical Specification Detailed Interface Specifications
Parameter Minimum Typical Maximum Unit
LTE in
communication mode
(TX Max)
Band 2 630 650 895 mA
Band 4 510 610 945 mA
Band 5 440 520 745 mA
Band 17 540 560 780 mA
UMTS (TX Max) Band 2 570 660 770 mA
Band 5 400 460 500 mA
Table 9. Current Consumption per Power Supply
Parameter (at nominal voltage, 3.7 V) Typical Unit
VBATT_BB
LTE in communication mode (TX Max)
USB = disconnected
Band 2 214 mA
Band 4 207 mA
Band 5 211 mA
Band 17 218 mA
UMTS (TX Max)
USB = disconnected
Band 2 124 mA
Band 5 118 mA
VBATT_PA
LTE in communication mode (TX Max)
USB = disconnected
Band 2 436 mA
Band 4 403 mA
Band 5 309 mA
Band 17 342 mA
UMTS (TX Max)
USB = disconnected
Band 2 536 mA
Band 5 342 mA
3.3. VGPIO
The VGPIO output can be used to:
Pull-up signals such as I/Os
Supply the digital transistors driving LEDs
The VGPIO output is available when the AirPrime HL7688 module is switched ON.
Table 10. VGPIO Electrical Characteristics
Parameter Minimum Typical Maximum Remarks
Voltage level (V) 1.7 1.8 1.9 Both active mode and sleep mode
Current capability
Active Mode (mA) - - 50 Power management support up to 50mA
output in Active mode
Current capability
Sleep Mode (mA) - - 3 Power management support up to 3mA
output in Sleep mode
Rise Time(ms) - - 1.5 Start-Up time from 0V
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Product Technical Specification Detailed Interface Specifications
3.4. BAT_RTC
The AirPrime HL7688 module provides an input/output to connect a Real Time Clock power supply.
This pad is used as a back-up power supply for the internal Real Time Clock. The RTC is supported
when VBATT is available but a back-up power supply is needed to save date and hour when VBATT
is switched off.
If VBATT is available, the back-up battery can be charged by the internal 1.8V power supply regulator.
Table 11. BAT_RTC Electrical Characteristics
Parameter Minimum Typical Maximum Unit
Input voltage - 1.8 - V
Input current consumption - 2.5 (TBC) - µA
Output voltage -5% 1.8 +5% V
Max charging current (@VBATT=3.7V) - 25 - mA
Note: When used with the HL Series snap-in socket, or when compatibility with HL6528x is needed,
Sierra Wireless recommends adding a 10µF capacitor to the BAT_RTC pad.
3.5. SIM Interface
The AirPrime HL7688 has one physical SIM interface, UIM1, which has optional support for dual SIM
application with an external SIM switch.
The UIM1 interface allows control of a 1.8V/3V SIM and is fully compliant with GSM 11.11
recommendations concerning SIM functions.
The five signals used by this interface are as follows:
UIM1_VCC: power supply
UIM1_CLK: clock
UIM1_DATA: I/O port
UIM1_RESET: reset
UIM1_DET: SIM detection
Table 12. UIM1 Pad Description
Pad # Signal Name Description
26 UIM1_VCC 1.8V/3V SIM1 Power supply
27 UIM1_CLK 1.8V/3V SIM1 Clock
28 UIM1_DATA 1.8V/3V SIM1 Data
29 UIM1_RESET 1.8V/3V SIM1 Reset
64 UIM1_DET UIM1 Detection
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Product Technical Specification Detailed Interface Specifications
Table 13. Electrical Characteristics of UIM1
Parameter Minimum Typical Maximum Remarks
UIM1 Interface Voltage (V)
(VCC,CLK,IO,RST)
- 2.9 - The appropriate output voltage
is auto detected and selected by
software.
- 1.80 -
UIM1 Detect - 1.80 - High active
UIM1_VCC Current (mA) - - 10 Max output current in sleep
mode = 3 mA
UIM1_VCC Line Regulation
(mV/V) - - 50 At Iout_Max
UIM1_VCC Power-up Setting
Time (µs) from power down - 10 -
3.5.1. UIM1_DET
UIM1_DET is used to detect and notify the application about the insertion and removal of a SIM
device in the SIM socket connected to the SIM interface. When a SIM is inserted, the state of
UIM1_DET transitions from logic 0 to logic 1. Inversely, when a SIM is removed, the state of
UIM1_DET transitions from logic 1 to logic 0.
3.6. USB
The AirPrime HL7688 has one USB interface.
Table 14. USB Pad Description
Pad Number Signal Name I/O Function
12 USB_D- I/O USB Data Negative
13 USB_D+ I/O USB Data Positive
16 USB_VBUS I USB VBUS
Note: When the 5V USB supply is not available, connect USB_VBUS to VBATT to supply the USB
interface.
3.7. Electrical Information for Digital I/O
The AirPrime HL7688 supports two groups of digital interfaces with varying current drain limits. The
following list enumerates these interface groupings and the following table enumerates the electrical
characteristics of each digital interface.
Group 1 (6mA current drain limit)
GPIO2, GPIO4, GPIO6, GPIO8, GPIO10, GPIO11, GPIO13, GPIO14, GPIO15
Group 2 (1mA current drain limit)
GPIO1, GPIO5, GPIO7
UART1
JTAG
PCM
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Product Technical Specification Detailed Interface Specifications
Table 15. Digital I/O Electrical Characteristics
Parameter Symbol Minimum Typical Maximum Remarks
Input Current-High(µA) IIH - - 240
Input Current-Low(µA) IIL - - 240
Group 1 DC Output Current-High (mA) IOH - - 6
DC Output Current-Low (mA) IOL -6 - -
Group 2 DC Output Current-High (mA) IOH - - 1
DC Output Current-Low (mA) IOL -1 - -
Input Voltage-High(V) VIH 1.19 - 2.10
Input Voltage-Low(V) VIL -0.20 - 0.38
Output Voltage-High(V) VOH 1.35 - - IOH = -6mA
VOH 1.50 - - IOH = -0.1mA
Output Voltage-Low(V) VOL - - 0.35 I
OH = 6mA
VOL - - 0.2 I
OH = 0.1mA
3.8. General Purpose Input/Output (GPIO)
The AirPrime HL7688 module provides 12 GPIOs, 2 of which have multiplexes.
Table 16. GPIO Pad Description
Pad Number Signal Name Multiplex I/O Power Supply Domain
1 GPIO1 I/O 1.8V
10 GPIO2 TRACE_DATA2 I/O 1.8V
40 GPIO7 I/O 1.8V
41 GPIO8 TRACE_CLK I/O 1.8V
44 GPIO13 I/O 1.8V
46 GPIO6 I/O 1.8V
51 GPIO14 I/O 1.8V
52 GPIO10 I/O 1.8V
53 GPIO11 I/O 1.8V
54 GPIO15 I/O 1.8V
65 GPIO4 I/O 1.8V
66 GPIO5 I/O 1.8V
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Product Technical Specification Detailed Interface Specifications
3.9. Main Serial Link (UART1)
The main serial link (UART1) is used for communication between the AirPrime HL7688 module and a
PC or host processor. It consists of a flexible 8-wire serial interface that complies with RS-232
interface.
The supported baud rates of the UART1 are 300, 1200, 2400, 4800, 9600, 19200, 38400, 57600,
115200, 230400, 460800, 500000, 750000, 921600, 1843200, 3000000 and 3250000 bit/s.
The signals used by UART1 are as follows:
TX data (UART1_TX)
RX data (UART1_RX)
Request To Send (UART1_RTS)
Clear To Send (UART1_CTS)
Data Terminal Ready (UART1_DTR)
Data Set Ready (UART1_DSR)
Data Carrier Detect (UART1_DCD)
Ring Indicator (UART1_RI)
Note: Signal names are according to PC view.
UART1 pad description is summarized in the table below.
Table 17. UART1 Pad Description
Pad # Signal Name* I/O* Description
2 UART1_RI O Signal incoming calls (data only), SMS, etc.
3 UART1_RTS I Request to send
4 UART1_CTS O AirPrime HL7688 is ready to receive AT commands
5 UART1_TX I Transmit data
6 UART1_RX O Receive data
7 UART1_DTR I (active low)
Prevents the AirPrime HL7688 from entering sleep mode,
switches between data mode and command mode, and
wakes the module up.
8 UART1_DCD O Signal data connection in progress
9 UART1_DSR O Signal UART interface is ON
* According to PC view.
3.10. POWER-ON Signal (PWR_ON_N)
A low level signal has to be provided to switch the AirPrime HL7688 module ON.
It is internally connected to the permanent 1.8V supply regulator inside the HL7688 via a pull-up
resistor. Once VBAT is supplied to the HL7688 module, this 1.8V supply regulator will be enabled and
so the PWR_ON_N signal is by default at high level.
The PWR_ON_N signal’s characteristics are listed in the table below.
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Product Technical Specification Detailed Interface Specifications
Table 18. PWR_ON_N Electrical Characteristics
Parameter Minimum Typical Maximum
Input Voltage-Low (V) - 0.51
Input Voltage-High (V) 1.33 - 2.2
Power-up period (ms) from PWR_ON_N falling edge 2000 - -
PWR_ON_N assertion time (ms) 25
Note: As PWR_ON_N is internally pulled up with 47k, an open collector or open drain transistor must be
used for ignition.
VGPIO is an output from the module that can be used to check if the module is active.
When VGPIO = 0V, the module is OFF
When VGPIO = 1.8V, the module is ON (it can be in idle, communication or sleep mode)
Note: PWR_ON_N signal cannot be used to power the module off. To power the module off, use AT
command AT+CPWROFF.
3.11. Reset Signal (RESET_IN_N)
To reset the module, a low level pulse must be sent on the RESET_IN_N pad for 20ms. This action
will immediately restart the AirPrime HL7688 module with the PWR_ON_N signal at low level. (If the
PWR_ON_N signal is at high level, the module will be powered off.) As RESET_IN_N is internally
pulled up, an open collector or open drain transistor has to be used to control this signal.
The RESET_IN_N signal will reset the registers of the CPU and reset the RAM memory as well, for
the next power on.
Note: As RESET_IN_N is referenced to the VRTC (200k pull-up resistor to VRTC 1.8V) an open
collector or open drain transistor has to be used to control this signal.
Table 19. RESET_IN_N Electrical Characteristics
Parameter Minimum Typical Maximum
Input Voltage-Low (V) - 0.51
Input Voltage-High (V) 1.33 - 2.2
Reset assertion time (ms) 20 - -
Power-up period (ms) from RESET_IN_N falling edge* 2000 - -
* With the PWR_ON_N Signal at low level
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Product Technical Specification Detailed Interface Specifications
3.12. Analog to Digital Converter (ADC1)
One Analog to Digital Converter input, ADC1, is provided by the AirPrime HL7688 module. This
converter is a 10-bit resolution ADC ranging from 0 to 1.2V.
The following table describes the pad description of the ADC interface.
Table 20. ADC Interface Pad Description
Pad Number Signal Name I/O Description
24 ADC1 I Analog to digital converter
Typical ADC1 use is for monitoring external voltage; wherein an application is used to safely power
OFF an external supply in case of overvoltage.
Table 21. ADC Electrical Characteristics
Parameter Minimum Typical Maximum Remarks
ADC1 Resolution (bits) - 10 -
Input Voltage Range (V) 0 - 1.2 General purpose input
Update rate per channel (kHz) - - 125
Integral Nonlinearity (bits) - - ±2 LSB
Offset Error (bits) - - ±1 LSB
Gain 849 853 858
Input Resistance (MΩ) 1 - -
Input Capacitance (pF) - 1 -
3.13. Clock Interface
The AirPrime HL7688 module supports two digital clock interfaces.
The following table describes the pad description of the clock out interfaces.
Table 22. Clock Interface Pad Description
Pad Number Signal Name I/O I/O Type Description
22 26M_CLKOUT O 1.8V 26MHz Digital Clock output
23 32K_CLKOUT O 1.8V 32.768kHz Digital Clock output
Enabling or disabling the clock out feature can be done using AT commands. For more information
about AT commands, refer to document [2] AirPrime HL7688 AT Commands Interface Guide.
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Product Technical Specification Detailed Interface Specifications
3.14. PCM
The Digital Audio (PCM) Interface allows connectivity with standard audio peripherals. It can be used,
for example, to connect an external audio codec.
The programmability of this interface allows addressing a large range of audio peripherals.
The signals used by the Digital Audio Interface are as follows:
PCM_SYNC: The frame synchronization signal delivers an 8 kHz frequency pulse that
synchronizes the frame data in and the frame data out.
PCM_CLK: The frame bit clock signal controls data transfer with the audio peripheral.
PCM_OUT: The frame “data out” relies on the selected configuration mode.
PCM_IN: The frame “data in” relies on the selected configuration mode.
The PCM interface is a high speed full duplex interface that can be used to send and receive digital
audio data to external audio ICs. The Digital Audio Interface also features the following:
PCM master or slave
16 bits data word length, linear mode
MSB first
Configurable PCM bit clock rate on 256kHz, 384kHz or 512kHz
Long frame sync
The following table describes the pad description of the PCM interface.
Table 23. PCM Interface Pad Description
Pad Number Signal Name I/O Description
33 PCM_OUT O PCM data out
34 PCM_IN I PCM data in
35 PCM_SYNC I/O PCM sync out
36 PCM_CLK I/O PCM clock
Refer to the following table for the electrical characteristics of the digital audio interface.
Table 24. PCM Electrical Characteristics
Signal Description Minimum Typical Maximum Unit
Tsync_low +
Tsync_high PCM-SYNC period 125 µs
Tsync_low PCM-SYNC low time 62.5 µs
Tsync_high PCM-SYNC high time 62.5 µs
TCLK-cycle PCM-CLK period (T) 1.95 2.6 3.9 µs
TIN-setup PCM-IN setup time 59.6 ns
TIN-hold PCM-IN hold time 12 ns
TOUT-delay PCM-OUT delay time 21.6 ns
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Product Technical Specification Detailed Interface Specifications
Signal Description Minimum Typical Maximum Unit
TSYNC-delay PCM-SYNC output delay -24 31.2 ns
The following figure shows the PCM timing waveform.
Figure 4. PCM Timing Waveform
3.15. Debug Interfaces
The AirPrime HL7688 module provides 2 interfaces for a powerful debug system.
3.15.1. Trace Debug
The AirPrime HL7688 module provides a Trace Debug interface, providing real-time instruction and
data trace of the modem core.
Table 25. Trace Debug Pad Description
Pad Number Signal Name Function Multiplex
2 TRACE_DATA3 Trace data 3
8 TRACE_DATA1 Trace data 1
9 TRACE_DATA0 Trace data 0
10 TRACE_DATA2 Trace data 2 GPIO2
41 TRACE_CLK Trace clock GPIO8
Note: It is strongly recommended to provide access to this interface through Test Points.
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Product Technical Specification Detailed Interface Specifications
3.15.2. JTAG
The JTAG interface provides debug access to the core of the AirPrime HL7688. These JTAG signals
are accessible through solder-able test points.
Table 26. JTAG Pad Description
Pad Number Signal Name Function
236 JTAG_RESET JTAG RESET
237 JTAG_TCK JTAG Test Clock
238 JTAG_TDO JTAG Test Data Output
239 JTAG_TMS JTAG Test Mode Select
240 JTAG_TRST JTAG Test Reset
241 JTAG_TDI JTAG Test Data Input
242 JTAG_RTCK JTAG Returned Test Clock
Note: It is recommended to provide access through Test Points to this interface the JTAG pads (for
Failure Analysis debugging). All signals listed in table above shall be outputs on the customer board
to allow JTAG debugging.
3.16. RF Interface
The RF interface of the HL7688 module allows the transmission of RF signals. This interface has a
50Ω nominal impedance.
3.16.1. RF Connection
A 50Ω stripline can be used to connect to standard RF connectors such as SMA, UFL, etc. for
antenna connection.
Table 27. RF Main Connection
Pad Number RF Signal Impedance VSWR Rx (max) VSWR Tx (max)
49 RF_MAIN 50Ω 1.5:1 1.5:1
Table 28. RF Diversity Connection
Pad Number RF Signal Impedance VSWR Rx (max) VSWR Tx (max)
31 RF_DIV 50Ω 1.5:1 ---
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Product Technical Specification Detailed Interface Specifications
3.16.2. RF Performances
Note: Values in the tables below are preliminary and subject to change.
Table 29. Conducted RX Sensitivity – UMTS Bands
Frequency Band
Conducted Rx Sensitivity (dBm)
Primary (Typical) Secondary (Typical)
Band 2 0.1% BER 12.2 kbps -109.5 -110.0
Band 5 -110.0 -110.5
4G RF performances are compliant with 3GPP recommendation TS 36.101.
Table 30. Conducted RX Sensitivity – LTE Bands
Frequency Band
Conducted Rx Sensitivity (dBm)
Primary (Typical) Secondary (Typical) SIMO (Typical)
LTE B2 Full RB; BW: 20 MHz* -93 -94 -97
LTE B4 Full RB; BW: 20 MHz* -95 -95 -98
LTE B5 Full RB; BW: 10 MHz* -98 -99 -101
LTE B17 Full RB; BW: 10 MHz* -98 -99 -101
* Sensitivity values scale with bandwidth: x_MHz_Sensitivity = 10 MHz_Sensitivity – 10*log (10 MHz/x_MHz)
3.16.3. TX_ON Indicator (TX_ON)
The AirPrime HL7688 module provides a signal, TX_ON, for TX indication. The TX_ON is a 2.3V
signal and its status signal depends on the module transmitter state.
Refer to the following table for the status of the TX_ON signal depending on the embedded module’s
state.
Table 31. TX_ON Indicator Pad Description
Pad Number Signal Name Function I/O Type Power Supply Domain
60 TX_ON TX indicator O 2.3V
Table 32. TX_ON Characteristics
Parameter Minimum Typical Maximum
Tadvance 30µs
Tdelay 10µs
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Product Technical Specification Detailed Interface Specifications
Figure 5. TX_ON State During Transmission
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4. Mechanical Drawings
Figure 6. Mechanical Drawing
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Product Technical Specification Mechanical Drawings
Figure 7. Dimensions Drawing
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Product Technical Specification Mechanical Drawings
Figure 8. Footprint
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5. Design Guidelines
5.1. Power-Up Sequence
Apply a LOW level logic to the PWR_ON_N pad (pad 59); within approximately 25ms, VGPIO will
appear to be at 1.8V. Either UART1 or the USB interface could be used to send AT commands. The
AT command interface is available in about 7 seconds after PWR_ON_N for either UART1 or USB.
When using UART1, the AT command interface is available after the transition of UART1_CTS from
high to low level.
When using a USB connection, the HL7688 will start communicating with the host after USB
enumeration. The time when AT commands can be sent will depend on the initialization time on the
USB host.
Figure 9. PWR_ON_N Sequence with VGPIO Information
Note: As PWR_ON_N is internally pulled up with 47k, an open collector or open drain transistor must be
used for ignition.
The PWR_ON_N pad has the minimum assertion time requirement of 25ms, with LOW active. Once
the valid power on trigger is detected, the PWR_ON_N pad status can be left open.
The maximum inrush current is 1.3 A and lasts less than 1.5 ms.
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Product Technical Specification Design Guidelines
5.2. Module Switch-Off
AT command AT+CPWROFF enables the user to properly switch the AirPrime HL7688 module off.
Figure 10. Power OFF Sequence for PWR_ON_N, VGPIO
Note: PWR_ON_N is internally pulled up by 47k to 1.8V.
5.3. Emergency Power OFF
If required, the module can be switched off by controlling the RESET_IN_N pad (pad 11). This must
only be used in emergency situations if the system freezes (not responding to AT commands).
To perform an emergency power off, a low level pulse must be sent on the RESET_IN_N pad for
20ms while the PWR_ON_N signal is inactive (high level). This action will immediately shut the
HL7688 module down and the registers of the CPU and RAM memory will be reset for the next power
on.
5.4. Sleep Mode Management
5.4.1. Using UART1
AT command AT+KSLEEP enables sleep mode configuration.
AT+KSLEEP=0:
The module is active when DTR signal is active (low electrical level).
When DTR is deactivated (high electrical level), the module enters sleep mode after a while.
On DTR activation (low electrical level), the module wakes up.
AT+KSLEEP=1:
The module determines when it enters sleep mode (when no more tasks are running).
“0x00” character on the serial link wakes the module up.
AT+KSLEEP=2:
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Product Technical Specification Design Guidelines
The module never enters sleep mode.
5.4.2. Using USB
Use AT+KSLEEP=1 to allows the module to automatically enter sleep mode while the USB interface is
in use.
5.5. Power Supply Design
The AirPrime HL7688 module should not be supplied with voltage over 4.5V even temporarily or
however briefly.
If the system’s main board power supply unit is unstable or if the system’s main board is supplied with
over 4.5V, even in the case of transient voltage presence on the circuit, the module’s power amplifier
may be severely damaged.
To avoid such issues, add a voltage limiter to the module’s power supply lines so that VBATT and
VBATT_PA signal pads will never receive a voltage surge over 4.5V. The voltage limiter can be as
simple as a Zener diode with decoupling capacitors as shown in the diagram below.
Figure 11. Voltage Limiter Example
5.6. ESD Guidelines for SIM Card
Decoupling capacitors must be added according to the drawings below as close as possible to the
SIM card connectors on UIM1_CLK, UIM1_RST, UIM1_VCC, UIM1_DATA and UIM1_DET signals to
avoid EMC issues and to comply with the requirements of ETSI and 3GPP standards covering the
SIM electrical interface.
A typical schematic including SIM detection is provided below.
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Product Technical Specification Design Guidelines
Figure 12. EMC and ESD Components Close to the SIM
5.7. ESD Guidelines for USB
When the USB interface is externally accessible, it is required to have ESD protection on the
USB_VBUS, USB_D+ and USB_D- signals.
Figure 13. ESD Protection for USB
Note: It is not recommended to have an ESD diode with feedback path from USB_VBUS to either
USB_D+ or USB_D-.
Sierra Wireless recommends using a 90Ω DLP0NSN900HL2L EMC filter and an RCLAMP0503N or
ESD5V3U2U-03LRH ESD diode.
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6. Reliability Specification
AirPrime HL7688 modules are tested against the Sierra Wireless Industrial Reliability Specification
defined below.
6.1. Reliability Compliance
The AirPrime HL7688 module connected on a development kit board application is compliant with the
following requirements.
Table 33. Standards Conformity
Abbreviation Definition
IEC International Electro technical Commission
ISO International Organization for Standardization
6.2. Reliability Prediction Model
6.2.1. Life Stress Test
The following tests the AirPrime HL7688 module’s product performance.
Table 34. Life Stress Test
Designation Condition
Performance Test
PT3T & PTRT
Standard: N/A
Special conditions:
Temperature:
Class A: -30°C to +70°C
Class B: -40°C to +85°C
Rate of temperature change: ± 3°C/min
Recovery time: 3 hours
Operating conditions: Powered
Duration: 14 days
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Product Technical Specification Reliability Specification
6.2.2. Environmental Resistance Stress Tests
The following tests the AirPrime HL7688 module’s resistance to extreme temperature.
Table 35. Environmental Resistance Stress Tests
Designation Condition
Cold Test Active
COTA
Standard: IEC 680068-2-1, Test Ad
Special conditions:
Temperature: -40°C
Temperature variation: 1°C/min
Operating conditions: Powered ON with a power cycle of 1 minute ON and
2 minutes OFF
Duration: 3 days
Resistance to Heat Test
RH
Standard: IEC 680068-2-2, Test Bb
Special conditions:
Temperature: +85°C
Temperature variation: 1°C/min
Operating conditions: Powered ON with a power cycle of 15 minutes ON
and 15 minutes OFF
Duration: 50 days
6.2.3. Corrosive Resistance Stress Tests
The following tests the AirPrime HL7688 module’s resistance to corrosive atmosphere.
Table 36. Corrosive Resistance Stress Tests
Designation Condition
Humidity Test
HUT
Standard: IEC 60068-2-3, Test Ca
Special conditions:
Temperature: +65°C
RH: 95%
Temperature variation: 3 +/- 0.6°C/min
Operating conditions: Powered on, DUT is powered up for 15 minutes and
OFF for 15 minutes
Duration: 10 days
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Product Technical Specification Reliability Specification
Designation Condition
Component Solder Wettability
CSW
Standard: JESD22 – B102, Method 1/Condition C, Solderability Test
Method
Special conditions:
Test method: Dip and Look Test with Steam preconditioning 8
h+/-15min. dip for 5 +0/-0.5 seconds
Operating conditions: Un-powered
Duration: 1 day
Moist Heat Cyclic Test
MHCT
Standard: IEC 60068-2-30, Test Db
Special conditions:
Upper temperature: +40 ± 2°C
Lower temperature: +25 ± 5°C
RH:
Upper temperature: 93%
Lower temperature: 95%
Number of cycles: 21 (1 cycle/24 hours)
Temperature Variation: 3 +/- 0.6°C/min
Operating conditions: Powered ON for 15 minutes during each 3 hours
ramp up and 3 hours ramp down (in middle) for every cycle
Duration: 21 days
6.2.4. Thermal Resistance Cycle Stress Tests
The following tests the AirPrime HL7688 module’s resistance to extreme temperature cycling.
Table 37. Thermal Resistance Cycle Stress Tests
Designation Condition
Thermal Shock Test
TSKT
Standard: IEC 60068-2-14, Test Na
Special conditions:
Temperature: -30°C to +80°C
Temperature Variation: less than 30s
Number of cycles: 600
Dwell Time: 10 minutes
Operating conditions: Un-powered
Duration: 9 days
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Product Technical Specification Reliability Specification
Designation Condition
Temperature Change
TCH
Standard: IEC 60068-2-14, Test Nb
Special conditions:
Temperature: -40°C to +90°C
Temperature Variation: 3 +/- 0.6°C/min
Number of cycles: 400
Dwell Time: 10 minutes
Operating conditions: Un-powered
Duration: 29 days
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Product Technical Specification Reliability Specification
6.2.5. Mechanical Resistance Stress Tests
The following tests the AirPrime HL7688 module’s resistance to vibrations and mechanical shocks.
Table 38. Mechanical Resistance Stress Tests
Designation Condition
Sinusoidal Vibration Test
SVT
Standard: IEC 60068-2-6, Test Fc
Special conditions:
Frequency range: 16 Hz to 1000 Hz
Displacement: 0.35mm (peak-peak)
Acceleration:
5G from 16 to 62 Hz
3G from 62 to 200 Hz
1G from 200 to 1000 Hz
Sweep rate: 1 octave / cycle
Number of Sweep: 20 sweeps/axis
Sweep direction: +/- X,+/- Y, +/- Z
Operating conditions: Un-powered
Duration: 2 days
Random Vibration Test
RVT
Standard: IEC 60068-2-64, Test Fh
Special conditions:
Frequency range: 10 Hz – 2000 Hz
Power Spectral Density in [(m/s²)²/Hz]
0.1 g2/Hz at 10Hz
0.01 g2/Hz at 250Hz
0.005 g2/Hz at 1000Hz
0.005 g2/Hz at 2000Hz
Peak factor: 3
Duration per Axis: 1 hr / axis
Operating conditions: Un-powered
Duration: 1 day
Mechanical Shock Test Standard: IEC 60068-2-27, Test Ea
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Product Technical Specification Reliability Specification
Designation Condition
MST
Special conditions:
Shock Test 1:
Wave form: Half sine
Peak acceleration: 30g
Duration: 11ms
Number of shocks: 8
Direction: ±X, ±Y, ±Z
Shock Test 2:
Wave form: Half sine
Peak acceleration: 100g
Duration: 6ms
Number of shocks: 3
Direction: ±X, ±Y, ±Z
Operating conditions: Un-powered
Duration: 72 hours
6.2.6. Handling Resistance Stress Tests
The following tests the AirPrime HL7688 module’s resistance to handling malfunctions and damage.
Table 39. Handling Resistance Stress Tests
Designation Condition
ESDC Test
Standard: JESD22-A114, JESD22-A115, JESD22-C101
Special conditions:
HBM (Human Body Model): 1KV (Class 1C)
MM (Machine Model): 200V
CDM (Charged Device Model): 250V (Class II)
Operating conditions: Powered
Duration: 3 days
ESD Test
Standard: IEC 61000-4-2
Special conditions:
Contact Voltage: ±2kV, ±4kV, ±6kV
Air Voltage: ±2kV, ±4kV, ±8kV
Operating conditions: Powered
Duration: 3 days
Free Fall Test
FFT 1
Standard : IEC 60068-2-32, Test Ed
Special conditions:
Number of drops: 2 drops per unit
Height: 1m
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Product Technical Specification Reliability Specification
Designation Condition
Operating conditions: Un-powered
Duration: 6 hours
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7. FCC Regulations
The AirPrime HL7688 module has been granted modular approval for mobile applications. Integrators
may use the HL7688 module in their final products without additional FCC certification if they meet the
following conditions. Otherwise, additional FCC approvals must be obtained.
1. At least 20 cm separation distance between the antenna and the user’s body must be
maintained at all times.
2. To comply with FCC regulations limiting both maximum RF output power and human
exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only
exposure condition must not exceed:
9.01 dBi in Band 2
6.00 dBi in Band 4
10.41 dBi in Band 5
9.74 dBi in Band 17
3. The HL7688 module must not transmit simultaneously with other collocated radio transmitters
within a host device.
4. The RF signal must be routed on the application board using tracks with a 50Ω characteristic
impedance. Basically, the characteristic impedance depends on the dielectric, the track width
and the ground plane spacing. In order to respect this constraint, Sierra Wireless
recommends using MicroStrip or StripLine structure and computing the Tracks width with a
simulation tool (like AppCad shown in the figure below and that is available free of charge at
http://www.agilent.com).
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Product Technical Specification FCC Regulations
If a multi-layered PCB is used, the RF path on the board must not cross any signal (digital,
analog or supply).
If necessary, use StripLine structure and route the digital line(s) "outside" the RF structure. An
example of proper routing is shown in the figure below.
Stripline and Coplanar design requires having a correct ground plane at both sides.
Consequently, it is necessary to add some vias along the RF path. It is recommended to use
Stripline design if the RF path is fairly long (more than 3cm), since MicroStrip design is not
shielded. Consequently, the RF signal (when transmitting) may interfere with neighbouring
electronics (AF amplifier, etc.). In the same way, the neighbouring electronics (micro-
controllers, etc.) may degrade the reception performances. The antenna connector is
intended to be directly connected to a 50Ω antenna and no matching is needed.
5. A label must be affixed to the outside of the end product into which the HL7688 module is
incorporated, with a statement similar to the following:
This device contains FCC ID: N7NHL7688
6. A user manual with the end product must clearly indicate the operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure
guidelines.
The end product with an embedded HL7688 module may also need to pass the FCC Part 15
unintentional emission testing requirements and be properly authorized per FCC Part 15.
Note: If this module is intended for use in a portable device, you are responsible for separate approval to
satisfy the SAR requirements of FCC Part 2.1093.
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8. Ordering Information
Table 40. Ordering Information
Model Name Description Part Number
HL7688 HL7688 embedded module Contact Sierra Wireless for the latest SKU
DEV-KIT HL Series Development Kit 6000620
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9. Terms and Abbreviations
Abbreviation Definition
ADC Analog to Digital Converter
AGC Automatic Gain Control
AT Attention (prefix for modem commands)
CDMA Code Division Multiple Access
CF3 Common Flexible Form Factor
CLK Clock
CODEC Coder Decoder
CPU Central Processing Unit
DAC Digital to Analog Converter
DTR Data Terminal Ready
EGNOS European Geostationary Navigation Overlay Service
EMC Electromagnetic Compatibility
EMI Electromagnetic Interference
EN Enable
ESD Electrostatic Discharges
ETSI European Telecommunications Standards Institute
FDMA Frequency-division multiple access
GAGAN GPS aided geo augmented navigation
GLONASS Global Navigation Satellite System
GND Ground
GNSS Global Navigation Satellite System
GPIO General Purpose Input Output
GPRS General Packet Radio Service
GSM Global System for Mobile communications
Hi Z High impedance (Z)
IC Integrated Circuit
IMEI International Mobile Equipment Identification
I/O Input / Output
LED Light Emitting Diode
LNA Low Noise Amplifier
MAX Maximum
MIN Minimum
MSAS Multi-functional Satellite Augmentation System
N/A Not Applicable
PA Power Amplifier
PC Personal Computer
PCB Printed Circuit Board
PCL Power Control Level
PLL Phase Lock Loop
PWM Pulse Width Modulation
QZSS Quasi-Zenith Satellite System
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Product Technical Specification Terms and Abbreviations
Abbreviation Definition
RF Radio Frequency
RFI Radio Frequency Interference
RMS Root Mean Square
RST Reset
RTC Real Time Clock
RX Receive
SCL Serial Clock
SDA Serial Data
SIM Subscriber Identification Module
SMD Surface Mounted Device/Design
SPI Serial Peripheral Interface
SW Software
PSRAM Pseudo Static RAM
TBC To Be Confirmed
TBD To Be Defined
TP Test Point
TX Transmit
TYP Typical
UART Universal Asynchronous Receiver-Transmitter
UICC Universal Integrated Circuit Card
USB Universal Serial Bus
UIM User Identity Module
VBATT Main Supply Voltage from Battery or DC adapter
VSWR Voltage Standing Wave Ratio
WAAS Wide Area Augmentation System

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