Sierra Wireless HL7718 HL7718 module User Manual AirPrime HL77xx Product Technical Specification

Sierra Wireless Inc. HL7718 module AirPrime HL77xx Product Technical Specification

User manual

Product Technical Specification AirPrime HL77xx 41110555 1.0 November 01, 2017
41110555 Rev 1.0 November 01, 2017 2 Product Technical Specification Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data. Safety and Hazards Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without proper device certifications. These areas include environments where cellular radio can interfere such as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems. Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. Sierra Wireless modems may be used at this time. The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence. Limitations of Liability This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or implied, including any implied warranties of merchantability, fitness for a particular purpose, or noninfringement. The recipient of the manual shall endorse all risks arising from its use. The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY. Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product.
41110555 Rev 1.0 November 01, 2017 3 Product Technical Specification Patents This product may contain technology developed by or for Sierra Wireless Inc. This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from MMP Portfolio Licensing. Copyright © 2017 Sierra Wireless. All rights reserved. Trademarks Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO®, ALEOS® and the Sierra Wireless and Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries. Watcher® is a registered trademark of NETGEAR, Inc., used under license. Windows® and Windows Vista® are registered trademarks of Microsoft Corporation. Macintosh® and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other countries. QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license. Other trademarks are the property of their respective owners. Contact Information Sales information and technical support, including warranty and returns Web: sierrawireless.com/company/contact-us/ Global toll-free number: 1-877-687-7795 6:00 am to 5:00 pm PST Corporate and product information Web: sierrawireless.com
41110555 Rev 1.0 November 01, 2017 4 Product Technical Specification Document History Version Date Updates 1.0 November 01, 2017 Creation
41110555 Rev 1.0 November 01, 2017 5 Contents 1. INTRODUCTION ................................................................................................ 10 1.1. Common Flexible Form Factor (CF3) ................................................................................ 10 1.2. Physical Dimensions ......................................................................................................... 11 1.3. General Features ............................................................................................................... 11 1.4. Architecture........................................................................................................................ 13 1.5. Interfaces ........................................................................................................................... 13 1.6. Connection Interface ......................................................................................................... 14 1.7. ESD ................................................................................................................................... 15 1.8. Environmental and Certifications ....................................................................................... 15 1.8.1. Environmental Specifications ................................................................................... 15 1.8.2. Regulatory ................................................................................................................ 16 1.8.3. RoHS Directive Compliant ....................................................................................... 16 1.8.4. Disposing of the Product .......................................................................................... 16 1.9. References ........................................................................................................................ 16 2. PAD DEFINITION ............................................................................................... 17 2.1. Pad Types .......................................................................................................................... 21 2.2. Pad Configuration (Top View, Through Module) ............................................................... 22 3. DETAILED INTERFACE SPECIFICATIONS ..................................................... 23 3.1. Power Supply..................................................................................................................... 23 3.2. Current Consumption ........................................................................................................ 24 3.3. VGPIO ............................................................................................................................... 25 3.4. USIM Interface ................................................................................................................... 25 3.4.1. UIM1_DET ............................................................................................................... 26 3.5. USB Interface .................................................................................................................... 26 3.6. Electrical Information for Digital I/O ................................................................................... 27 3.7. General Purpose Input/Output (GPIO) .............................................................................. 28 3.8. Main Serial Link (UART1) .................................................................................................. 28 3.9. Power On Signal (PWR_ON_N) ........................................................................................ 29 3.10. Reset Signal (RESET_IN_N) ............................................................................................. 30 3.11. Analog to Digital Converter (ADC)..................................................................................... 31 3.12. Clock Interface ................................................................................................................... 32 3.13. Debug Interface ................................................................................................................. 32 3.14. JTAG Interface................................................................................................................... 32 3.15. Wake Up Signal (WAKE-UP) ............................................................................................. 33 3.16. Fast Shutdown Signal (FAST_SHUTDOWN) .................................................................... 34 3.17. PWM .................................................................................................................................. 34
41110555 Rev 1.0 November 01, 2017 6 Product Technical Specification 3.18. RF Interface ....................................................................................................................... 35 3.18.1. RF Connection ......................................................................................................... 35 3.18.2. RF Performances ..................................................................................................... 35 4. MECHANICAL DRAWINGS ............................................................................... 37 5. DESIGN GUIDELINES ....................................................................................... 39 5.1. Power-Up Sequence ......................................................................................................... 39 5.2. Module Switch-Off ............................................................................................................. 39 5.3. Sleep Mode Management ................................................................................................. 39 5.4. Power Supply Design ........................................................................................................ 40 5.5. Power On Connection Examples....................................................................................... 40 5.6. USIM1 Application ............................................................................................................. 41 5.7. EMC and ESD Guidelines for USIM1 Card ....................................................................... 41 5.8. ESD Guidelines for USB .................................................................................................... 42 5.9. PWM .................................................................................................................................. 42 6. RELIABILITY SPECIFICATION (TBC) .............................................................. 44 6.1. Reliability Compliance ....................................................................................................... 44 6.2. Reliability Prediction Model ............................................................................................... 44 6.2.1. Life Stress Test ........................................................................................................ 44 6.2.2. Environmental Resistance Stress Tests .................................................................. 45 6.2.3. Corrosive Resistance Stress Tests ......................................................................... 45 6.2.4. Thermal Resistance Cycle Stress Tests .................................................................. 46 6.2.5. Mechanical Resistance Stress Tests ....................................................................... 47 6.2.6. Handling Resistance Stress Tests ........................................................................... 48 7. FCC LEGAL INFORMATION ............................................................................. 49 8. ORDERING INFORMATION .............................................................................. 51 9. TERMS AND ABBREVIATIONS ........................................................................ 52
41110555 Rev 1.0 November 01, 2017 7 List of Figures Figure 1. Architecture Overview ..................................................................................................... 13 Figure 2. Mechanical Overview (Top View and Bottom View) ....................................................... 14 Figure 3. Actual Module (Top View) ............................................................................................... 14 Figure 4. Actual Module (Bottom View) .......................................................................................... 14 Figure 5. Pad Configuration ............................................................................................................ 22 Figure 6. PWR_ON_N and PWR_OFF Sequence ......................................................................... 30 Figure 7. JTAG Timing Waveform .................................................................................................. 33 Figure 8. Relative Timing for the PWM Output ............................................................................... 34 Figure 9. Mechanical Drawing ........................................................................................................ 37 Figure 10. Dimensions and Footprint Drawing ................................................................................. 38 Figure 11. Voltage Limiter Example ................................................................................................. 40 Figure 12. PWR_ON_N Connection Example with Switch ............................................................... 40 Figure 13. PWR_ON_N Connection Example with an Open Collector Transistor ........................... 40 Figure 14. Design Application with USIM1 Slot ................................................................................ 41 Figure 15. EMC and ESD Components Close to the USIM1. .......................................................... 41 Figure 16. ESD Protection for USB .................................................................................................. 42 Figure 17. Example of an LED Driven by the PWM0 Output ........................................................... 42 Figure 18. Example of a BUZZER Driven by the PWM0 Output ...................................................... 43
41110555 Rev 1.0 November 01, 2017 8 List of Tables Table 1. Supported Bands/Connectivity ........................................................................................ 10 Table 2. General Features ............................................................................................................ 11 Table 3. ESD Specifications .......................................................................................................... 15 Table 4. Environmental Specifications .......................................................................................... 15 Table 5. Pin Definition ................................................................................................................... 17 Table 6. Pad Type Codes .............................................................................................................. 21 Table 7. Power Supply Pad Description ........................................................................................ 23 Table 8. Power Supply Electrical Characteristics .......................................................................... 23 Table 9. Low Current Consumption Mode ..................................................................................... 24 Table 10. Current Consumption ..................................................................................................... 24 Table 11. VGPIO Pad Description ................................................................................................... 25 Table 12. VGPIO Electrical Characteristics ..................................................................................... 25 Table 13. USIM1 Pad Description ................................................................................................... 26 Table 14. USIM1 Electrical Characteristics ..................................................................................... 26 Table 15. USB Pad Description ....................................................................................................... 26 Table 16. USB Electrical Characteristics ......................................................................................... 27 Table 17. Digital I/O Electrical Characteristics ................................................................................ 27 Table 18. GPIO Pad Description ..................................................................................................... 28 Table 19. UART1 Pad Description .................................................................................................. 28 Table 20. PWR_ON_N Pad Description .......................................................................................... 29 Table 21. PWR_ON_N Electrical Characteristics ........................................................................... 29 Table 22. RESET_IN_N Pad Description ........................................................................................ 30 Table 23. RESET_IN_N Electrical Characteristics .......................................................................... 31 Table 24. ADC Pad Description ...................................................................................................... 31 Table 25. ADC Electrical Characteristics ........................................................................................ 31 Table 26. Clock Interface Pad Description ...................................................................................... 32 Table 27. Software Trace Pad Description...................................................................................... 32 Table 28. JTAG Pad Description ..................................................................................................... 32 Table 29. JTAG Electrical Characteristics ....................................................................................... 33 Table 30. WAKE-UP Pad Description ............................................................................................. 33 Table 31. WAKE-UP Electrical Characteristics ............................................................................... 34 Table 32. FAST_SHUTDOWN Pad Description ............................................................................. 34 Table 33. FAST_SHUTDOWN Electrical Characteristics ............................................................... 34 Table 34. PWM Pad Description ..................................................................................................... 35 Table 35. PWM Electrical Characteristics (TBC)............................................................................. 35 Table 36. RF Pad Connection ......................................................................................................... 35 Table 37. Typical RX Sensitivity ...................................................................................................... 36
41110555 Rev 1.0 November 01, 2017 9 Product Technical Specification Table 38. Standards Conformity ...................................................................................................... 44 Table 39. Life Stress Test................................................................................................................ 44 Table 40. Environmental Resistance Stress Tests ......................................................................... 45 Table 41. Corrosive Resistance Stress Tests ................................................................................. 45 Table 42. Thermal Resistance Cycle Stress Tests ......................................................................... 46 Table 43. Mechanical Resistance Stress Tests .............................................................................. 47 Table 44. Handling Resistance Stress Tests .................................................................................. 48 Table 45. Ordering Information ....................................................................................................... 51
41110555 Rev 1.0 November 01, 2017 10 1. Introduction This document is the Product Technical Specification for the AirPrime HL77xx series of embedded modules. It defines the high-level product features and illustrates the interfaces for these features; and is intended to cover the hardware aspects of the product, including electrical and mechanical. Variants covered in this document are: • HL7718 • HL7748 • HL7749 The AirPrime HL77xx modules belong to the AirPrime HL Series from Essential Connectivity Module family. These are industrial grade Embedded Wireless Modules that provides data connectivity on LTE networks (as listed in Table 1 Supported Bands/Connectivity). The AirPrime HL77xx modules support a large variety of interfaces such as USB 2.0, UART, ADC, USIM interface, PWM and GPIOs to provide customers with the highest level of flexibility in implementing high-end solutions. Table 1. Supported Bands/Connectivity RF Band Transmit Band (Tx) Receive Band (Rx) Maximum Output Power HL7718 HL7748 HL7749 LTE B2 1850 to 1910 MHz 1930 to 1990 MHz 23dBm ± 2dBm ✓ LTE B3 1710 to 1785 MHz 1805 to 1880 MHz 23dBm ± 2dBm ✓ LTE B4 1710 to 1755 MHz 2110 to 2155 MHz 23dBm ± 2dBm ✓ LTE B12 699 to 716 MHz 729 to 746 MHz 23dBm ± 2dBm ✓ LTE B13 777 to 787 MHz 746 to 756 MHz 23dBm ± 2dBm ✓ LTE B28 703 to 748 MHz 758 to 803 MHz 23dBm ± 2dBm ✓ 1.1. Common Flexible Form Factor (CF3) The AirPrime HL77xx modules belong to the Common Flexible Form Factor (CF3) family of modules. This family consists of a series of WWAN modules that share the same mechanical dimensions (same width and length with varying thicknesses) and footprint. The CF3 form factor provides a unique solution to a series of problems faced commonly in the WWAN module space as it: • Accommodates multiple radio technologies (LTE advanced) and band groupings. • Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions. • Offers electrical and functional compatibility. • Provides Direct Mount as well as Socketability depending on customer needs.
41110555 Rev 1.0 November 01, 2017 11 Product Technical Specification Introduction 1.2. Physical Dimensions AirPrime HL77xx modules are compact, robust, fully shielded modules with the following dimensions: • Length: 23 mm • Width: 22 mm • Thickness: 2.5 mm • Weight: 2.6 g Note: Dimensions specified above are typical values. 1.3. General Features The table below summarizes the AirPrime HL77xx modules’ features. Table 2. General Features Feature Description Physical • Small form factor (146-pad solderable LGA pad) – 23mm x 22mm x 2.5mm (nominal) • Metal shield can. • RF connection pads (RF main interface) • Baseband signals connection Electrical Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V RF HL7718 (Mono-band LTE): • LTE B13 HL7748 (Tri-band LTE): • LTE B2 • LTE B4 • LTE B12 HL7749 (Dual-band LTE): • LTE B3 • LTE B28 SIM interface • Only 1.8V support for USIM1 • SIM extraction / hot plug detection • SIM/USIM support • Conforms with ETSI UICC Specifications. • Supports SIM application tool kit with proactive SIM commands Application interface • NDIS NIC interface support (Windows 7, Windows 8, Linux) • MBIM support • Multiple non-multiplexed USB channel support • Dial-up networking • USB selective suspend to maximize power savings • CMUX multiplexing over UART • AT command interface – 3GPP 27.007 standard, plus proprietary extended AT commands
41110555 Rev 1.0 November 01, 2017 12 Product Technical Specification Introduction Feature Description Protocol stack Single mode LTE operation: • LTE FDD, bandwidth 1.4-20 MHz • System Release: 3GPP Rel. 13 • Category M1 (up to 375 kbit/s in uplink, 300 kbit/s in downlink) • Max modulation 16 QAM UL/DL • Intra-frequency and inter-frequency mobility SMS • SMS over SGs • SMS MO and MT • SMS saving to SIM card or ME storage • SMS reading from SIM card or ME storage • SMS sorting • SMS concatenation • SMS Status Report • SMS replacement support • SMS storing rules (support of AT+CNMI, AT+CNMA) Connectivity • Multiple cellular packet data profiles • Sleep mode for minimum idle power draw • Mobile-originated PDP context activation / deactivation • Static and Dynamic IP address. The network may assign a fixed IP address or dynamically assign one using DHCP (Dynamic Host Configuration Protocol). • PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context • RFC1144 TCP/IP header compression Environmental Operating temperature ranges (industrial grade): • Class A: -30°C to +70°C • Class B: -40°C to +85°C RTC Real Time Clock (RTC)
41110555 Rev 1.0 November 01, 2017 13 Product Technical Specification Introduction 1.4. Architecture The figure below presents an overview of the AirPrime HL77xx modules’ internal architecture and external interfaces. Note: Dotted parts are optional depending on variant. AirPrime HL7718, HL7748 and HL774932.768KHzVGPIORESET_IN_NLGA-146 BasebandMCU DSPPMUAnalog BasebandEmbedded SIMLGA-146 PWR_ONSAW FiltersUSBFront-End Module(SAW/PA/Switch)RXRAM MemoryPeripheralsFlash MemorySIM SwitchTransceiver26MHzVBATT_PA Figure 1. Architecture Overview 1.5. Interfaces The AirPrime HL77xx modules provide the following interfaces and peripheral connectivity: • 1x - VGPIO (1.8V) • 1x - 1.8V USIM • 1x - eUICC/USIM (optional embedded SIM) • 1x - USB 2.0 • 10x - GPIOs (1 of which has a multiplex) • 1x - 8-wire UART • 1x - Active Low POWER ON • 1x - Active Low RESET • 2x - ADC • 2x - System Clock Out (32,768KHz and 26MHz) • 1x – Debug Interface
41110555 Rev 1.0 November 01, 2017 14 Product Technical Specification Introduction • 1x - JTAG Interface • 1x - Wake up signal • 1x - Fast shutdown signal • 1x - PWM • 1x - Main RF Antenna 1.6. Connection Interface The AirPrime HL77xx modules are an LGA form factor device. All electrical and mechanical connections are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB. Figure 2. Mechanical Overview (Top View and Bottom View) The 146 pads have the following distribution: • 66 inner signal pads, 1x0.5mm, pitch 0.8mm • 1 reserved test point (do not connect), 1.0mm diameter • 7 test point (JTAG), 0.8mm diameter, 1.20mm pitch • 64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm • 4 inner corner ground pads, 1x1mm • 4 outer corner ground pads, 1x0.9mm Figure 3. Actual Module (Top View) Figure 4. Actual Module (Bottom View)
41110555 Rev 1.0 November 01, 2017 15 Product Technical Specification Introduction 1.7. ESD Refer to the following table for ESD Specifications. Table 3. ESD Specifications Category Connection Specification Operational RF ports IEC-61000-4-2 — Level (Electrostatic Discharge Immunity Test) Non-operational Host connector interface Unless otherwise specified: • JESD22-A114 ± 1kV Human Body Model (TBC) • JESD22-A115 ± 200V Machine Model (TBC) • JESD22-C101C ± 250V Charged Device Model (TBC) Signals SIM connector Adding ESD protection is highly recommended at the point where the USIM contacts are exposed, and for any other signals that would be subjected to ESD by the user. Other host signals 1.8. Environmental and Certifications 1.8.1. Environmental Specifications The environmental specification for both operating and storage conditions are defined in the table below. Table 4. Environmental Specifications Conditions Range Operating Class A -30°C to +70°C Operating Class B -40°C to +85°C Storage -40°C to +85°C Class A is defined as the operating temperature ranges that the device: • Shall exhibit normal function during and after environmental exposure. • Shall meet the minimum requirements of 3GPP or appropriate wireless standards. Class B is defined as the operating temperature ranges that the device: • Shall remain fully functional during and after environmental exposure • Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even when one or more environmental constraint exceeds the specified tolerance. • Unless otherwise stated, full performance should return to normal after the excessive constraint(s) have been removed.
41110555 Rev 1.0 November 01, 2017 16 Product Technical Specification Introduction 1.8.2. Regulatory The AirPrime HL7718 and HL7748 modules will be compliant with FCC regulations, while the AirPrime HL7749 module will be compliant with RCM regulations. 1.8.3. RoHS Directive Compliant The AirPrime HL77xx modules are compliant with RoHS Directive 2011/65/EU which sets limits for the use of certain restricted hazardous substances. This directive states that “from 1st July 2006, new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)”. 1.8.4. Disposing of the Product This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical and Electronic Equipment (WEEE). As such, this product must not be disposed of at a municipal waste collection point. Please refer to local regulations for directions on how to dispose of this product in an environmental friendly manner. 1.9. References [1] AirPrime HL Series Customer Process Guidelines Reference Number: 4114330 [2] AirPrime HL77xx AT Commands Interface Guide Reference Number: 41110842 [3] AirPrime HL Series Development Kit User Guide Reference Number: 4114877
41110555 Rev 1.0 November 01, 2017 17 2. Pad Definition AirPrime HL77xx pads are divided into 2 functional categories. • Core functions and associated pads cover all the mandatory features for M2M connectivity and will be available by default across all CF3 family of modules. These Core functions are always available and always at the same physical pad locations. A customer platform using only these functions and associated pads are guaranteed to be forward and/or backward compatible with the next generation of CF3 modules. • Extension functions and associated pads bring additional capabilities to the customer. Whenever an Extension function is available on a module, it is always at the same pad location. Other pads marked as “not connected” or “reserved” should not be used. Table 5. Pin Definition Pad # Signal Name Function I/O Active Low/High Power Supply Domain Recommendation for Unused Pads Type 1 GPIO1 General purpose input/output I/O - 1.8V Left Open Extension 2 UART1_RI UART1 Ring indicator O - 1.8V Connect to test point Core 3 UART1_RTS UART1 Request to send I L 1.8V Connect to test point Core 4 UART1_CTS UART1 Clear to send O L 1.8V Connect to test point Core 5 UART1_TX UART1 Transmit data I - 1.8V Connect to test point Core 6 UART1_RX UART1 Receive data O - 1.8V Connect to test point Core 7 UART1_DTR UART1 Data terminal ready I L 1.8V Connect to test point Core 8 UART1_DCD UART1 Data carrier detect O L 1.8V Connect to test point Core 9 UART1_DSR UART1 Data set ready O L 1.8V Connect to test point Core 10 GPIO2 General purpose input/output I/O - 1.8V Connect to test point Core 11 RESET_IN_N Input reset signal I L 1.8V Left Open Core
41110555 Rev 1.0 November 01, 2017 18 Product Technical Specification Pad Definition Pad # Signal Name Function I/O Active Low/High Power Supply Domain Recommendation for Unused Pads Type 12 USB_D- USB Data Negative (Low / Full Speed) I/O - 3.3V Connect to test point Extension USB Data Negative (High Speed) 0.38V 13 USB_D+ USB Data Positive (Low / Full Speed) I/O - 3.3V Connect to test point Extension USB Data Positive (High Speed) 0.38V 14 NC Not Connected Not connected 15 NC Not Connected Not connected 16 NC Not Connected Not connected 17 NC Not Connected (Reserved for future use) Not connected 18 NC Not Connected (Reserved for future use) Not connected 19 WAKE-UP Wake Up I H 1.8V Left Open Extension 20 NC Not Connected (Reserved for future use) Not connected 21 NC Not Connected Not connected 22 GNSS_FREQ_OUT 26MHz System Clock Output O - 1.8V Left Open Extension 23 32K_CLKOUT 32.768kHz System Clock Output O - 1.8V Left Open Extension 24 ADC1 Analog to digital converter I - 1.2V Left Open Extension 25 ADC0 Analog to digital converter I - 1.2V Left Open Extension 26 UIM1_VCC 1.8V USIM1 Power supply O - 1.8V Mandatory connection Core 27 UIM1_CLK 1.8V USIM1 Clock O - 1.8V Mandatory connection Core 28 UIM1_DATA 1.8V USIM1 Data I/O - 1.8V Mandatory connection Core 29 UIM1_RESET 1.8V USIM1 Reset O L 1.8V Mandatory connection Core 30 GND Ground 0V 0V Mandatory connection Extension 31 NC Not Connected Not connected 32 GND Ground 0V 0V Mandatory connection Extension 33 PCM_OUT* PCM data out O - 1.8V Left Open Extension 34 PCM_IN* PCM data in I - 1.8V Left Open Extension 35 PCM_SYNC* PCM sync out I/O - 1.8V Left Open Extension
41110555 Rev 1.0 November 01, 2017 19 Product Technical Specification Pad Definition Pad # Signal Name Function I/O Active Low/High Power Supply Domain Recommendation for Unused Pads Type 36 PCM_CLK* PCM clock I/O - 1.8V Left Open Extension 37 GND Ground 0V 0V Mandatory connection Core 38 NC Not Connected (Reserved for future use) Not connected 39 GND Ground 0V 0V Mandatory connection Core 40 GPIO7 General purpose input/output I/O - 1.8V Left Open Core 41 GPIO8 General purpose input/output I/O - 1.8V Connect to test point Core 42 NC Not Connected (Reserved for future use) Not connected 43 NC Not Connected (Reserved for future use) Not connected 44 DEBUG_TX Debug Transmit data O 1.8V Left Open Extension 45 VGPIO GPIO voltage output O 1.8V Left Open Core 46 GPIO6 General purpose input/output I/O - 1.8V Left Open Core 47 NC Not Connected (Reserved for future use) Left Open Not connected 48 GND Ground 0V 0V Mandatory connection Core 49 RF_MAIN RF Input/output - Mandatory connection Core 50 GND Ground 0V 0V Mandatory connection Core 51 DEBUG_RX Debug Receive data I 1.8V Left Open Extension 52 GPIO10 General purpose input/output I/O - 1.8V Left Open Extension 53 GPIO11 General purpose input/output I/O - 1.8V Left Open Extension 54 GPIO15 General purpose input/output I/O - 1.8V Left Open Extension 55 NC Not Connected Not connected 56 NC Not Connected Not connected 57 NC Not Connected Not connected 58 PWM0 Pulse Width Modulation O - 1.8V/3V Left Open Extension 59 PWR_ON_N Active Low Power On control signal I L 1.8V Mandatory connection Core 60 NC Not Connected Not connected
41110555 Rev 1.0 November 01, 2017 20 Product Technical Specification Pad Definition Pad # Signal Name Function I/O Active Low/High Power Supply Domain Recommendation for Unused Pads Type 61 VBATT_PA Power supply (refer to section 3.1 Power Supply for more information) I - 3.2V (min) 3.7V (typ) 4.5V (max) Mandatory connection Core 62 VBATT_PA Power supply (refer to section 3.1 Power Supply for more information) I - 3.2V (min) 3.7V (typ) 4.5V (max) Mandatory connection Core 63 VBATT Power supply I - 3.2V (min) 3.7V (typ) 4.5V (max) Mandatory connection Core 64 UIM1_DET / GPIO3 USIM1 Detection / General purpose input/output I/O H 1.8V Left Open Core 65 FAST_SHUTDOWN Fast Shutdown I L 1.8V Left Open Extension 66 GPIO5 General purpose input/output I/O - 1.8V Left Open Extension 67-70 GND Ground GND 0V Core 71 - 166 Note: These pads are not available on the AirPrime HL77xx modules. 167 - 234 GND Ground GND 0V Core 236 JTAG_RESET JTAG RESET I L 1.8V Left Open Extension 237 JTAG_TCK JTAG Test Clock I - 1.8V Left Open Extension 238 JTAG_TDO JTAG Test Data Output O - 1.8V Left Open Extension 239 JTAG_TMS JTAG Test Mode Select I - 1.8V Left Open Extension 240 JTAG_TRST JTAG Test Reset I L 1.8V Left Open Extension 241 JTAG_TDI JTAG Test Data Input I - 1.8V Left Open Extension 242 NC Not Connected Not connected * This pad is not supported on the AirPrime HL77xx.
41110555 Rev 1.0 November 01, 2017 21 Product Technical Specification Pad Definition 2.1. Pad Types Table 6. Pad Type Codes Type Definition I Digital Input O Digital Output I/O Digital Input / Output L Active High H Active Low T Tristate T/PU Tristate with pull-up enabled T/PD Tristate with pull-down enabled PU Pull-up enabled PD Pull-down enabled N/A Not Applicable
41110555 Rev 1.0 November 01, 2017 22 Product Technical Specification Pad Definition 2.2. Pad Configuration (Top View, Through Module) 16816916717018171615141312111098764321566656463626160593435363738394041424344454648495051475857565553525470671920212223242526272829303233316968192 193 194 195 196 197 198 171191 214 215 216 217 218 199 172190 213 228 229 230 219 200 173189 212 227 234 231 220 201 174188 211 226 233 232 221 202 175187 210 225 224 223 222 203 176186 209 208 207 206 205 204 177185 184 183 182 181 180 179 178236237238239240241242GNDGPIO5FAST_SHUTDOWNUIM1_DET / GPIO3VBATTVBATT_PAVBATT_PANCPWR_ON_NPWM0NCNCNCGPIO15GPIO11GPIO10GNDGNDWAKE-UPNCNCGNSS_FREQ_OUT32K_CLKOUTADC1ADC0UIM1_VCCUIM1_CLKUIM1_DATAUIM1_RESETGNDNCGNDPCM_OUTGNDPCM_INPCM_SYNCPCM_CLKGNDNCGNDGPIO7GPIO8NCNCDEBUG_TXVGPIOGPIO6NCGNDRF_MAINGNDDEBUG_RXNCNCNCNCNCUSB_D+USB_D-RESET_IN_NGPIO2UART1_DSRUART1_DCDUART1_DTRUART1_RXUART1_TXUART1_CTSUART1_RTSUART1_RIGPIO1NCJTAG_TDIJTAG_TRSTJTAG_TMSJTAG_TDOJTAG_TCKJTAG_RESETCore pinExtension pin236237238239240241242 Figure 5. Pad Configuration
41110555 Rev 1.0 November 01, 2017 23 3. Detailed Interface Specifications Note: If not specified, all electrical values are given for VBATT=3.7V and an operating temperature of 25°C. For standard applications, VBATT and VBATT_PA must be tied externally to the same power supply. For some specific applications, AirPrime HL77xx modules support separate VBATT and VBATT_PA connections if requirements below are fulfilled. 3.1. Power Supply The AirPrime HL77xx modules are supplied through the VBATT and VBATT_PA signals. Refer to the following table for the pad description of the Power Supply interface. Table 7. Power Supply Pad Description Pad Number Signal Name I/O Description 63 VBATT I Power supply (base band) 61, 62 VBATT_PA I Power supply (radio frequency) 37, 39, 48, 67-70, 167-234 GND Ground Refer to the following table for the electrical characteristics of the Power Supply interface. Table 8. Power Supply Electrical Characteristics Supply Minimum Typical Maximum VBATT voltage (V) 3.21 3.7 4.5 VBATT_PA voltage (V) Full Specification 3.21 3.7 4.5 VBATT_PA voltage (V) Extended Range 2.82 (TBC) 3.7 4.5 1 This value must be guaranteed during the burst 2 No guarantee of 3GPP performances over extended range Note: Load capacitance for VBATT is around 37µF ± 20% (TBC) embedded inside the module. Load capacitance for VBATT_PA is around 11µF ± 20% (TBC) embedded inside the module.
41110555 Rev 1.0 November 01, 2017 24 Product Technical Specification Detailed Interface Specifications 3.2. Current Consumption The following table lists the current consumption of the AirPrime HL77xx modules at different conditions. Note: Typical values are defined for VBATT/VBATT_PA at 3.7V and 25°C, for 50Ω impedance at all RF ports with VSWR1:1 and CMW500. Maximum values are defined with worst conditions among supported ranges of voltages and temperature (50Ω, VSWR1:1 and CMW500). Table 9. Low Current Consumption Mode Parameter Typical Maximum Unit Off mode 15 TBD µA Sleep mode (deregistered from the network) 1.3 TBD mA PSM mode 100 (TBC) TBD µA Table 10. Current Consumption Parameter Band Frequency Typical Unit LTE in communication mode (TX Max) Pout=23dBm BW=10Mhz RMC mode 4RB_DL & 6RB_UL B3 1810 MHz 290 mA 1843 MHz 285 mA 1875 MHz 285 mA LTE in communication mode (TX Max) Pout=23dBm BW=10Mhz RMC mode 4RB_DL & 6RB_UL B28 763 MHz 275 mA 781 MHz 268 mA 798 MHz 260 mA LTE in communication mode (TX Max) Pout=23dBm BW=10Mhz RMC mode 4RB_DL & 6RB_UL B12 734 MHz 265 mA 738 MHz 260 mA 741 MHz 260 mA LTE in communication mode (TX Max) Pout=23dBm BW=10Mhz RMC mode 4RB_DL & 6RB_UL B2 1935 MHz 290 mA 1960 MHz 292 mA 1985 MHz 303 mA LTE in communication mode (TX Max) Pout=23dBm BW=10Mhz RMC mode 4RB_DL & 6RB_UL B4 2115 MHz 280 mA 2133 MHz 284 mA 2150 MHz 280 mA LTE in communication mode (TX Max) Pout=23dBm BW=10Mhz RMC mode 4RB_DL & 6RB_UL B13 751 MHz 250 mA
41110555 Rev 1.0 November 01, 2017 25 Product Technical Specification Detailed Interface Specifications 3.3. VGPIO The VGPIO output can be used to: • Pull-up signals such as I/Os • Supply the digital transistors driving LEDs The VGPIO output is available when the AirPrime HL77xx module is switched ON. Refer to the following table for the pad description of the VGPIO interface. Table 11. VGPIO Pad Description Pad Number Signal Name I/O Description 45 VGPIO O GPIO voltage output Refer to the following table for the electrical characteristics of the VGPIO interface. Table 12. VGPIO Electrical Characteristics Parameter Minimum Typical Maximum Remarks Voltage level (V) 1.7 1.8 1.9 Both active mode and sleep mode Current capability Active Mode (mA) - - TBD Power management support up to (TBD) mA output in Active mode Current capability Sleep Mode (mA) - - TBD Power management support up to (TBD) mA output in Sleep mode Rise Time (ms) - - TBD Start-Up time from 0V 3.4. USIM Interface The AirPrime HL77xx modules have one physical USIM interface, USIM1, and an optional internal USIM or eUICC. The USIM1 interface allows control of a 1.8V USIM and is fully compliant with GSM 11.11 recommendations concerning USIM functions. The five signals used by the UIM1 are as follows: • UIM1_VCC: Power supply • UIM1_CLK: Clock • UIM1_DATA: I/O port • UIM1_RESET: Reset • UIM1_DET/GPIO3: Hardware SIM detection Refer to the following table for the pad description of the USIM1 interface.
41110555 Rev 1.0 November 01, 2017 26 Product Technical Specification Detailed Interface Specifications Table 13. USIM1 Pad Description Pad Number Signal Name Description Multiplex 26 UIM1_VCC 1.8V USIM1 Power supply 27 UIM1_CLK 1.8V USIM1 Clock 28 UIM1_DATA 1.8V USIM1 Data 29 UIM1_RESET 1.8V USIM1 Reset 64 UIM1_DET / GPIO3 1.8V USIM1 Detection GPIO3 Refer to the following table for the electrical characteristics of the USIM1 interface. Table 14. USIM1 Electrical Characteristics Parameter Minimum Typical Maximum Remarks UIM1 Interface Voltage (V) (VCC, CLK, IO, RESET) - 1.80 - The appropriate output voltage is auto detected and selected by software. UIM1 Detect - 1.80 - High active UIM1_VCC Current (mA) - - 10 (TBC) Refer to section 5.6 USIM1 Application for a USIM application example. 3.4.1. UIM1_DET UIM1_DET is used to detect and notify the application about the insertion and removal of a USIM device in the USIM socket connected to the main USIM interface (UIM1). When a USIM is inserted, the state of UIM1_DET transitions from logic 0 to logic 1. Inversely, when a USIM is removed, the state of UIM1_DET transitions from logic 1 to logic 0. Enabling or disabling this USIM detect feature can be done using an AT command. Refer to document [2] AirPrime HL77xx AT Commands Interface Guide for more information. 3.5. USB Interface The AirPrime HL77xx modules have one Universal Serial Bus interface compliant with USB Rev 2.0 (self-powered). Refer to the following table for the pad description of the USB interface. Table 15. USB Pad Description Pad Number Signal Name I/O Function 12 USB_D- I/O USB Data Negative 13 USB_D+ I/O USB Data Positive
41110555 Rev 1.0 November 01, 2017 27 Product Technical Specification Detailed Interface Specifications Refer to the following table for the electrical characteristics of the USB interface. Table 16. USB Electrical Characteristics Parameter Minimum Typical Maximum Units Input voltage at pins USB_D+ / USB_D- 3.15 3.3 3.45 V 3.6. Electrical Information for Digital I/O The table below enumerates the electrical characteristics of the following digital interfaces: • UART • PCM • JTAG • GPIOs • RESET • PWM • WAKE_UP Table 17. Digital I/O Electrical Characteristics Parameter Description Minimum Typical Maximum Units VIH Logic High Input Voltage 0.85 x VDDIO* VDDIO* + 0.3 V VIL Logic Low Input Voltage -0.3 0.25 x VDDIO* V IIH / IIL Input Leakage Current (either Low or High, and No Pull enabled) 0.03 µA VOH Logic High Output Voltage VDDIO* – 0.45 VDDIO* V VOL Logic Low Output Voltage 0 0.8 V IOH / IOL Output Leakage Current (either Low or High) – assume no external load 0.03 µA RPU Internal Pull Down Resistor 53 89 164 KΩ RPD Internal Pull Up Resistor 54 96 189 KΩ Input Capacitance Input Pin Capacitance 7 pF * VDDIO = VGPIO = 1.8V.
41110555 Rev 1.0 November 01, 2017 28 Product Technical Specification Detailed Interface Specifications 3.7. General Purpose Input/Output (GPIO) The AirPrime HL77xx modules provide 10 GPIOs, 1 of which has a multiplex. The following table describes the pin description of the GPIO interface. Table 18. GPIO Pad Description Pad Number Signal Name Multiplex I/O Power Supply Domain 1 GPIO1 I/O 1.8V 10 GPIO2 I/O 1.8V 40 GPIO7 I/O 1.8V 41 GPIO8 I/O 1.8V 46 GPIO6 I/O 1.8V 52 GPIO10 I/O 1.8V 53 GPIO11 I/O 1.8V 54 GPIO15 I/O 1.8V 64 GPIO3 UIM1_DET I/O 1.8V 66 GPIO5 I/O 1.8V 3.8. Main Serial Link (UART1) The main serial link (UART1) is used for communication between the AirPrime HL77xx modules and a PC or host processor. It consists of a flexible 8-wire serial interface that complies with RS-232 interface. The main serial link (UART1) is an asynchronous serial interface. The signals used by UART1 are as follows: • TX data (UART1_TX) • RX data (UART1_RX) • Request To Send (UART1_RTS) • Clear To Send (UART1_CTS) • Data Terminal Ready (UART1_DTR) • Data Set Ready (UART1_DSR) • Data Carrier Detect (UART1_DCD) • Ring Indicator (UART1_RI) Note: Signal names are according to PC view. Refer to the following table for the pad description of the main serial link (UART1) interface. Table 19. UART1 Pad Description Pad Number Signal Name* I/O* Description 2 UART1_RI O Signal incoming calls (data only), SMS, etc. 3 UART1_RTS I Request to send
41110555 Rev 1.0 November 01, 2017 29 Product Technical Specification Detailed Interface Specifications Pad Number Signal Name* I/O* Description 4 UART1_CTS O The AirPrime HL77xx is ready to receive AT commands 5 UART1_TX I Transmit data 6 UART1_RX O Receive data 7 UART1_DTR I (active low) Prevents the AirPrime HL77xx from entering sleep mode, switches between data mode and command mode, and wakes the module up. 8 UART1_DCD O Signal data connection in progress 9 UART1_DSR O Signal UART interface is ON * According to PC view. Note: UART1_CTS must be left floating or set to level “0” before starting the HL77xx module. 3.9. Power On Signal (PWR_ON_N) The PWR_ON_N signal is internally connected to the permanent 1.8V supply regulator inside the AirPrime HL77xx module via a pull-up resistor. Once VBATT is supplied to the module, this 1.8V supply regulator will be enabled and so the PWR_ON_N signal is by default at high level. A low-level signal on PWR_ON_N must be provided to switch the AirPrime HL77xx module ON, and the signal must be kept at low level to keep the module ON. Refer to the following table for the pad description of the PWR_ON_N interface. Table 20. PWR_ON_N Pad Description Pad Number Signal Name I/O Description 59 PWR_ON_N I Power the AirPrime HL77xx On Refer to the following table for the electrical characteristics of the PWR_ON_N interface. Table 21. PWR_ON_N Electrical Characteristics Parameter Minimum Typical Maximum Input Voltage-Low (V) - 0.51 (TBC) Input Voltage-High (V) 1.33 (TBC) - 2.2 (TBC) Power-up period (ms) from PWR_ON_N falling edge Always set to GND - - PWR_ON_N assertion time (ms) 25 (TBC)
41110555 Rev 1.0 November 01, 2017 30 Product Technical Specification Detailed Interface Specifications VBATTVGPIO ( pin 45 )PWR_ON_NPower OFF Power ON Power OFFBase Band PMU supplyModule is OFF Module is OFF Module is ON RESET Figure 6. PWR_ON_N and PWR_OFF Sequence Note: As PWR_ON_N is internally pulled up with 1MΩ, an open collector or open drain transistor must be used for ignition. VGPIO is an output from the module that can be used to check if the module is active. • When VGPIO = 0V, the module is OFF • When VGPIO = 1.8V, the module is ON (it can be in idle, communication or sleep mode) Note: To power the module off, use AT command AT+CPOF or AT+CPWROFF. 3.10. Reset Signal (RESET_IN_N) To reset the module, a low-level pulse must be sent on the RESET_IN_N pad for 20ms (TBC). This action will immediately restart the AirPrime HL77xx module with the PWR_ON_N signal at low level. (If the PWR_ON_N signal is at high level, the module will be powered off.) As RESET_IN_N is internally pulled up, an open collector or open drain transistor should be used to control this signal. Note: As RESET_IN_N is referenced to the VGPIO signal (1kΩ pull-up resistor to VGPIO 1.8V) an open collector or open drain transistor should be used to control this signal. Refer to the following table for the pad description of the RESET_IN_N interface. Table 22. RESET_IN_N Pad Description Pad Number Signal Name I/O Description 12 RESET_IN_N I Hardware reset the module
41110555 Rev 1.0 November 01, 2017 31 Product Technical Specification Detailed Interface Specifications Refer to the following table for the electrical characteristics of the RESET_IN_N interface. Table 23. RESET_IN_N Electrical Characteristics Parameter Minimum Typical Maximum Input Voltage-Low (V) - 0.51 (TBC) Input Voltage-High (V) 1.33 (TBC) - 2.2 (TBC) Reset assertion time (ms) 20 (TBC) - - Power-up period (ms) from RESET_IN_N falling edge* 2000 (TBC) - - * With the PWR_ON_N signal at low level. 3.11. Analog to Digital Converter (ADC) Two Analog to Digital Converter inputs, ADC0 and ADC1, are provided by AirPrime HL77xx modules. These converters are 8-bits resolution ADCs ranging from 0 to 1.8V. Typical ADC use is for monitoring external voltage, wherein an application is used to safely power OFF an external supply in case of overvoltage. Refer to the following table for the pad description of the ADC interface. Table 24. ADC Pad Description Pad Number Signal Name I/O Description 24 ADC1 I Analog to digital converter 25 ADC0 I Analog to digital converter Refer to the following table for the electrical characteristics of the ADC interface. Table 25. ADC Electrical Characteristics Parameter Minimum Typical Maximum Unit Remarks ADCx Resolution - 8 - bits Conversion Rate - - 2 MHz Input Voltage Range 0 - 1.8 V General purpose input Integral Nonlinearity - ± 1 ± 2 LSB Differential Nonlinearity - ± 0.5 ± 1 LSB Offset Error - ± 1 ± 2 LSB %FS Gain Error - ± 1 ± 2 LSB %FS Input Resistance 43 52 61 kΩ Input Capacitance during sampling phase - 3 pF
41110555 Rev 1.0 November 01, 2017 32 Product Technical Specification Detailed Interface Specifications 3.12. Clock Interface The AirPrime HL77xx modules support two digital clock interfaces. Enabling or disabling the clock out feature can be done using AT commands. For more information about AT commands, refer to document [2] AirPrime HL77xx AT Commands Interface Guide. Refer to the following table for the pad description of the clock out interfaces. Table 26. Clock Interface Pad Description Pad Number Signal Name I/O I/O Type Description 22 GNSS_FREQ_OUT O 1.8V 26MHz Digital Clock output 23 32K_CLKOUT O 1.8V 32.768kHz Digital Clock output 3.13. Debug Interface The AirPrime HL77xx modules provide a 2-wire debug port interface. Table 27. Software Trace Pad Description Pad Number Signal Name* I/O* I/O Type Description 44 DEBUG_TX O 1.8V Debug Transmit Data 51 DEBUG_RX I 1.8V Debug Receive Data * According to module view. Note: It is strongly recommended to provide access through Test Points to this interface. 3.14. JTAG Interface The JTAG interface provides debug access to the core of the AirPrime HL77xx modules. These JTAG signals are accessible through solder-able test points. Refer to the following table for the pad description of the JTAG interface. Table 28. JTAG Pad Description Pad Number Signal Name Function 236 JTAG_RESET JTAG RESET 237 JTAG_TCK JTAG Test Clock 238 JTAG_TDO JTAG Test Data Output 239 JTAG_TMS JTAG Test Mode Select 240 JTAG_TRST JTAG Test Reset 241 JTAG_TDI JTAG Test Data Input Note: It is recommended to provide access through Test Points to this interface the JTAG pads (for Failure Analysis debugging). All signals listed in the table above should be outputs on the customer board to allow JTAG debugging.
41110555 Rev 1.0 November 01, 2017 33 Product Technical Specification Detailed Interface Specifications Refer to the following table for the electrical characteristics of the JTAG interface. Table 29. JTAG Electrical Characteristics Symbol Parameter Minimum Typical Maximum Unit Ftck JTAG_TCK clock period 0.038 (TBC) 26 (TBC) 78 (TBC) MHz tc2 JTAG_TCK clock period high 12 (TBC) - - ns tc3 JTAG_TCK clock period low 12 (TBC) - - ns tc4 JTAG_TDI setup time to JTAG_TCK 12 (TBC) - - ns tc5 JTAG_TDI hold time from JTAG_TCK 10 (TBC) - - ns tc6 JTAG_TDO valid before JTAG_TCK low-end - 0 (TBC) - s tc7 JTAG_TDO valid after JTAG_TCK high begin - 20 (TBC) - ns Figure 7. JTAG Timing Waveform 3.15. Wake Up Signal (WAKE-UP) The AirPrime HL77xx modules provide one WAKE-UP signal. The WAKE-UP signal is used to wake the system up from ultra-low power modes (from OFF or Sleep modes, FAST_SHUTDOWN, or after a software power off). This signal should be set to high level (external 1.8V) for at least (TBD) ms until the system is active to wake the module up from these modes. The system will not be allowed to go into ultra-low or off mode for as long as this signal is kept high. By default, the software waits for a high state to wake-up. Note: The module has an embedded pull-down on this signal. After a power off mode, the only way to restart the module is to perform a hardware power off then power on if this signal is not used. Refer to the following table for the pad description of the WAKE-UP interface. Table 30. WAKE-UP Pad Description Pad Number Signal Name I/O I/O Type Description 19 WAKE-UP I 1.8V WAKE-UP
41110555 Rev 1.0 November 01, 2017 34 Product Technical Specification Detailed Interface Specifications Refer to the following table for the electrical characteristics of the WAKE-UP interface. Table 31. WAKE-UP Electrical Characteristics I/O Type Parameter Minimum Typical Maximum Unit Digital VIL 0.3 V VIH 0.7 x VDDIO* V * VDDIO = VGPIO = 1.8 V. 3.16. Fast Shutdown Signal (FAST_SHUTDOWN) The AirPrime HL77xx modules provide one FAST_SHUTDOWN signal. Refer to the following table for the pad description of the FAST_SHUTDOWN interface. Table 32. FAST_SHUTDOWN Pad Description Pad Number Signal Name I/O I/O Type Description 65 FAST_SHUTDOWN I 1.8V Shuts down the module without deregistration from the network Refer to the following table for the electrical characteristics of the FAST_SHUTDOWN interface. Table 33. FAST_SHUTDOWN Electrical Characteristics I/O Type Parameter Minimum Typical Maximum Unit Digital VIL 0.3xVDDIO V VIH 0.7 x VDDIO V * VDDIO = VGPIO = 1.8 V. 3.17. PWM The AirPrime HL77xx modules provide one PWM signal that can be used in conjunction with an external transistor for driving a vibrator, or a backlight LED. The PWM uses two 7-bit unsigned binary numbers – one for the output period and one for the pulse width or the duty cycle. The relative timing for the PWM output is shown in the figure below. Figure 8. Relative Timing for the PWM Output
41110555 Rev 1.0 November 01, 2017 35 Product Technical Specification Detailed Interface Specifications Refer to the following table for the pad description of the PWM interface. Table 34. PWM Pad Description Pad Number Signal Name I/O I/O Type Description 58 PWM0 O 1.8V PWM output Refer to the following table for the electrical characteristics of the PWM interface. Table 35. PWM Electrical Characteristics (TBC) Parameter Conditions Minimum Typical Maximum Unit VOH High impedance load -- 1.8 - V VOL - - - 0.2 V IPEAK - - - 8 mA Frequency - 25.6 - 1625 kHz Duty cycle - 1 - 99 % 3.18. RF Interface The RF interface of the AirPrime HL77xx modules allow the transmission of RF signals. This interface has a 50Ω nominal impedance. 3.18.1. RF Connection A 50Ω (with maximum VSWR 1.1:1, and 0.5dB loss) RF track is recommended to be connected to standard RF connectors such as SMA, UFL, etc. for antenna connection. Refer to the following table for the pad description of the RF interface. Table 36. RF Pad Connection Pad Number RF Signal Impedance VSWR Rx (max) VSWR Tx (max) 49 RF_MAIN 50Ω 1.5:1 1.5:1 3.18.2. RF Performances RF performances are compliant with 3GPP recommendation TS 36.101. The following table shows typical RX sensitivity with the reference sensitivity level at 95% of the maximum throughput, using the following 3GPP test conditions: • 3GPP Pattern • QPSK modulation • 4RB_DL, 6RB_UL • 23dBm UL power
41110555 Rev 1.0 November 01, 2017 36 Product Technical Specification Detailed Interface Specifications Table 37. Typical RX Sensitivity LTE Band dBm/15kHz dBm/1.4MHz 3GPP Limit (dBm) 2 -126 -107, 4 -100.3 3 -126 -107, 4 -99.3 4 -125.5 -106, 9 -102.3 12 -125.5 -106, 9 -99.3 13 -126.5 -107, 9 -99.3 28 -126.5 -107, 9 -100.7
41110555 Rev 1.0 November 01, 2017 37 4. Mechanical Drawings Figure 9. Mechanical Drawing
41110555 Rev 1.0 November 01, 2017 38 Product Technical Specification Mechanical Drawings Figure 10. Dimensions and Footprint Drawing
41110555 Rev 1.0 November 01, 2017 39 5. Design Guidelines 5.1. Power-Up Sequence Apply voltage to the VBATT pin for at least 10 ms (TBC) prior to applying a low-level logic to the PWR_ON_N pin. Apply a low-level logic to the PWR_ON_N pin (pin 59); within approximately 25ms, VGPIO will appear to be at 1.8V. Either UART1 or the USB interface could be used to send AT commands. The AT command interface is available in about 25 seconds (TBC) after PWR_ON_N for either UART or USB. When using UART, the AT command interface is available after the transition of UART1_CTS from high to low level. When using a USB connection, the AirPrime HL77xx module will start communicating with the host after USB enumeration. The time when AT commands can be sent will depend on the initialization time on the USB host. Note: As PWR_ON_N is internally pulled up with 1MΩ, an open collector or open drain transistor must be used for ignition. 5.2. Module Switch-Off AT commands AT+CPOF and AT+CPWROFF enables the user to properly switch the AirPrime HL77xx module off. 5.3. Sleep Mode Management AT command AT+KSLEEP enables sleep mode configuration; this command can only be used with serial link UART1. AT+KSLEEP=0: • The module is active when the DTR signal is active (low electrical level). • When DTR is deactivated (high electrical level), the module enters sleep mode after a while. • On DTR activation (low electrical level), the module wakes up. AT+KSLEEP=1: • The module determines when it enters sleep mode (when no more tasks are running). • Any character on the serial link wakes the module up. The first character is lost. AT+KSLEEP=2: The module never enters sleep mode. Note: The DTR signal must only be set to low-level “0” to wake up from Sleep mode. This pin must be set to high-level “1” (1.8V) or left floating (internal pull-up) for all other modes.
41110555 Rev 1.0 November 01, 2017 40 Product Technical Specification Design Guidelines 5.4. Power Supply Design The AirPrime HL77xx module should not be supplied with voltage over 4.5V even temporarily or however briefly. If the system’s main board power supply unit is unstable or if the system’s main board is supplied over 4.5V, even in the case of transient voltage presence on the circuit, the module’s power amplifier may be severely damaged. To avoid such issues, add a voltage limiter to the module’s power supply lines so that VBATT and VBATT_PA signal pads will never receive a voltage surge over 4.5V. The voltage limiter can be as simple as a Zener diode with decoupling capacitors as shown in the diagram below. Power Supply VBATT/VBATT_PAD4040.5 pFD405C4041.5 mF ++C405150 µFC407100 nF Figure 11. Voltage Limiter Example 5.5. Power On Connection Examples Refer to the following figures for PWR_ON_N connection examples using a switch and an open collector transistor. PWR_ONXGNDSwitch123 Figure 12. PWR_ON_N Connection Example with Switch PWR_ONGNDFrom application MCU GPIO controlT1Rohm DTC144EE Figure 13. PWR_ON_N Connection Example with an Open Collector Transistor
41110555 Rev 1.0 November 01, 2017 41 Product Technical Specification Design Guidelines 5.6. USIM1 Application The AirPrime HL77xx modules support one USIM1 slot. Figure 14. Design Application with USIM1 Slot 5.7. EMC and ESD Guidelines for USIM1 Card Decoupling capacitors must be added according to the drawing below, as close as possible to the UIM1 card connectors on UIM1_CLK, UIM1_RESET, UIM1_VCC, UIM1_DATA and UIM1_DET signals to avoid EMC issues and to comply with the requirements of ETSI and 3GPP standards covering the USIM1 electrical interface. A typical schematic including USIM1 detection is provided below. Figure 15. EMC and ESD Components Close to the USIM1. Sierra Wireless recommends using a ESDALC6V1-5P6 ESD diode for D100.
41110555 Rev 1.0 November 01, 2017 42 Product Technical Specification Design Guidelines 5.8. ESD Guidelines for USB When the USB interface is externally accessible, it is required to have ESD protection on the USB_D+ and USB_D- signals. Figure 16. ESD Protection for USB Sierra Wireless recommends using the following components: • FIL400: 90Ω DLP0NSN900HL2L EMC filter • D400: RCLAMP0503N or ESD5V3U2U-03LRH ESD diode 5.9. PWM Refer to the following figures for examples of using the PWM0 signal for driving an LED or a BUZZER. Figure 17. Example of an LED Driven by the PWM0 Output The value of R607 can be harmonized depending on LED (D605) characteristics. The recommended digital transistor to use for T601 is the DTC144EE from ROHM.
41110555 Rev 1.0 November 01, 2017 43 Product Technical Specification Design Guidelines Figure 18. Example of a BUZZER Driven by the PWM0 Output The recommended MOS transistor to use for T1 is the RUM003N02 from ROHM, and the recommended diode to use for D1 is the BAS16W from NXP.
41110555 Rev 1.0 November 01, 2017 44 6. Reliability Specification (TBC) AirPrime HL77xx modules will be tested against the Sierra Wireless Industrial Reliability Specification defined below. 6.1. Reliability Compliance AirPrime HL77xx modules connected on a development kit board application are targeted to be compliant with the following requirements. Table 38. Standards Conformity Abbreviation Definition IEC International Electro technical Commission ISO International Organization for Standardization 6.2. Reliability Prediction Model 6.2.1. Life Stress Test The following tests the AirPrime HL77xx modules’ product performance. Table 39. Life Stress Test Designation Condition Performance Test PT3T & PTRT Standard: N/A Special conditions: • Temperature: ▪ Class A: -30°C to +70°C ▪ Class B: -40°C to +85°C ▪ Rate of temperature change: ± 3°C/min • Recovery time: 3 hours Operating conditions: Powered Duration: 14 days
41110555 Rev 1.0 November 01, 2017 45 Product Technical Specification Reliability Specification (TBC) 6.2.2. Environmental Resistance Stress Tests The following tests the AirPrime HL77xx modules’ resistance to extreme temperature. Table 40. Environmental Resistance Stress Tests Designation Condition Cold Test Active COTA Standard: IEC 680068-2-1, Test Ad Special conditions: • Temperature: -40°C • Temperature variation: 1°C/min Operating conditions: Powered ON with a power cycle of 1 minute ON and 2 minutes OFF Duration: 3 days Resistance to Heat Test RH Standard: IEC 680068-2-2, Test Bb Special conditions: • Temperature: +85°C • Temperature variation: 1°C/min Operating conditions: Powered ON with a power cycle of 15 minutes ON and 15 minutes OFF Duration: 50 days 6.2.3. Corrosive Resistance Stress Tests The following tests the AirPrime HL77xx modules’ resistance to corrosive atmosphere. Table 41. Corrosive Resistance Stress Tests Designation Condition Humidity Test HUT Standard: IEC 60068-2-3, Test Ca Special conditions: • Temperature: +65°C • RH: 95% • Temperature variation: 3 +/- 0.6°C/min Operating conditions: Powered on, DUT is powered up for 15 minutes and OFF for 15 minutes Duration: 10 days
41110555 Rev 1.0 November 01, 2017 46 Product Technical Specification Reliability Specification (TBC) Designation Condition Component Solder Wettability CSW Standard: JESD22 – B102, Method 1/Condition C, Solderability Test Method Special conditions: • Test method: Dip and Look Test with Steam preconditioning 8 h+/-15min. dip for 5 +0/-0.5 seconds Operating conditions: Un-powered Duration: 1 day Moist Heat Cyclic Test MHCT Standard: IEC 60068-2-30, Test Db • Special conditions: • Upper temperature: +40 ± 2°C • Lower temperature: +25 ± 5°C • RH: ▪ Upper temperature: 93% ▪ Lower temperature: 95% • Number of cycles: 21 (1 cycle/24 hours) • Temperature Variation: 3 +/- 0.6°C/min Operating conditions: Powered ON for 15 minutes during each 3 hours ramp up and 3 hours ramp down (in middle) for every cycle Duration: 21 days 6.2.4. Thermal Resistance Cycle Stress Tests The following tests the AirPrime HL77xx modules’ resistance to extreme temperature cycling. Table 42. Thermal Resistance Cycle Stress Tests Designation Condition Thermal Shock Test TSKT Standard: IEC 60068-2-14, Test Na Special conditions: • Temperature: -30°C to +80°C • Temperature Variation: less than 30s • Number of cycles: 600 • Dwell Time: 10 minutes Operating conditions: Un-powered Duration: 9 days Temperature Change TCH Standard: IEC 60068-2-14, Test Nb Special conditions: • Temperature: -40°C to +90°C • Temperature Variation: 3 +/- 0.6°C/min • Number of cycles: 400 • Dwell Time: 10 minutes Operating conditions: Un-powered Duration: 29 days
41110555 Rev 1.0 November 01, 2017 47 Product Technical Specification Reliability Specification (TBC) 6.2.5. Mechanical Resistance Stress Tests The following tests the AirPrime HL77xx modules’ resistance to vibrations and mechanical shocks. Table 43. Mechanical Resistance Stress Tests Designation Condition Sinusoidal Vibration Test SVT Standard: IEC 60068-2-6, Test Fc Special conditions: • Frequency range: 16 Hz to 1000 Hz • Displacement: 0.35mm (peak-peak) • Acceleration: ▪ 5G from 16 to 62 Hz ▪ 3G from 62 to 200 Hz ▪ 1G from 200 to 1000 Hz • Sweep rate: 1 octave / cycle • Number of Sweep: 20 sweeps/axis • Sweep direction: ±X, ±Y, ±Z Operating conditions: Un-powered Duration: 2 days Random Vibration Test RVT Standard: IEC 60068-2-64, Test Fh Special conditions: • Frequency range: 10 Hz – 2000 Hz • Power Spectral Density in [(m/s²)²/Hz] ▪ g2/Hz at 10Hz ▪ g2/Hz at 250Hz ▪ 0.005 g2/Hz at 1000Hz ▪ 0.005 g2/Hz at 2000Hz • Peak factor: 3 • Duration per Axis: 1 hr / axis Operating conditions: Un-powered Duration: 1 day Mechanical Shock Test MST Standard: IEC 60068-2-27, Test Ea Special conditions: • Shock Test 1: ▪ Wave form: Half sine ▪ Peak acceleration: 30g ▪ Duration: 11ms ▪ Number of shocks: 8 ▪ Direction: ±X, ±Y, ±Z • Shock Test 2: ▪ Wave form: Half sine ▪ Peak acceleration: 100g ▪ Duration: 6ms ▪ Number of shocks: 3 ▪ Direction: ±X, ±Y, ±Z Operating conditions: Un-powered Duration: 72 hours
41110555 Rev 1.0 November 01, 2017 48 Product Technical Specification Reliability Specification (TBC) 6.2.6. Handling Resistance Stress Tests The following tests the AirPrime HL77xx modules’ resistance to handling malfunctions and damage. Table 44. Handling Resistance Stress Tests Designation Condition ESDC Test Standard: JESD22-A114, JESD22-A115, JESD22-C101 Special conditions: • HBM (Human Body Model): 1KV (Class 1C) • MM (Machine Model): 200V • CDM (Charged Device Model): 250V (Class II) Operating conditions: Powered Duration: 3 days ESD Test Standard: IEC 61000-4-2 Special conditions: • Contact Voltage: ±2kV, ±4kV, ±6kV • Air Voltage: ±2kV, ±4kV, ±8kV Operating conditions: Powered Duration: 3 days Free Fall Test FFT 1 Standard: IEC 60068-2-32, Test Ed Special conditions: • Number of drops: 2 drops per unit • Height: 1m Operating conditions: Un-powered Duration: 6 hours
41110555 Rev 1.0 November 01, 2017 49 7. FCC Legal Information The HL7718 and HL7748 modules have been granted modular approval for mobile applications. Integrators may use the HL7718 or HL7748 modules in their final products without additional FCC certification if they meet the following conditions. Otherwise, additional FCC approvals must be obtained. 1. At least 20 cm separation distance between the antenna and the user’s body must be maintained at all times. 2. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only exposure condition must not exceed: For HL7718: 2 dBi in Band 13 For HL7748: ▪ 9.0 dBi in Band 2 ▪ 6.0 dBi in Bands 4 and 12 3. The HL7718 and HL7748 modules must not transmit simultaneously with other collocated radio transmitters within a host device. 4. The RF signal must be routed on the application board using tracks with a 50Ω characteristic impedance. Basically, the characteristic impedance depends on the dielectric, the track width and the ground plane spacing. In order to respect this constraint, Sierra Wireless recommends using MicroStrip or StripLine structure and computing the Tracks width with a simulation tool (like AppCad shown in the figure below and that is available free of charge at http://www.agilent.com).
41110555 Rev 1.0 November 01, 2017 50 Product Technical Specification FCC Legal Information If a multi-layered PCB is used, the RF path on the board must not cross any signal (digital, analog or supply). If necessary, use StripLine structure and route the digital line(s) "outside" the RF structure. An example of proper routing is shown in the figure below. Stripline and Coplanar design requires having a correct ground plane at both sides. Consequently, it is necessary to add some vias along the RF path. It is recommended to use Stripline design if the RF path is fairly long (more than 3cm), since MicroStrip design is not shielded. Consequently, the RF signal (when transmitting) may interfere with neighbouring electronics (AF amplifier, etc.). In the same way, the neighbouring electronics (micro-controllers, etc.) may degrade the reception performances. The GSM/GPRS connector is intended to be directly connected to a 50Ω antenna and no matching is needed. 5. A label must be affixed to the outside of the end product into which the HL7718 or HL7748 module is incorporated, with a statement similar to the following: This device contains FCC ID: <FCC ID as listed in the table below> Embedded Module FCC ID HL7718 N7NHL7718 HL7748 N7NHL7748 6. A user manual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. The end product with an embedded HL7718 or HL7748 module may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15. Note: If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093.
41110555 Rev 1.0 November 01, 2017 51 8. Ordering Information Table 45. Ordering Information Model Name Description Part Number HL7718 HL7718 embedded module Contact Sierra Wireless for the latest SKU HL7748 HL7748 embedded module Contact Sierra Wireless for the latest SKU HL7749 HL7749 embedded module Contact Sierra Wireless for the latest SKU DEV-KIT HL Series Development Kit 6000620
41110555 Rev 1.0 November 01, 2017 52 9. Terms and Abbreviations Abbreviation Definition ADC Analog to Digital Converter AGC Automatic Gain Control AT Attention (prefix for modem commands) CDMA Code Division Multiple Access CF3 Common Flexible Form Factor CLK Clock CODEC Coder Decoder CPU Central Processing Unit DAC Digital to Analog Converter DTR Data Terminal Ready EGNOS European Geostationary Navigation Overlay Service EMC Electro-Magnetic Compatibility EMI Electro-Magnetic Interference EN Enable ESD Electro-Static Discharges ETSI European Telecommunications Standards Institute FDMA Frequency-division multiple access GAGAN GPS aided geo augmented navigation GLONASS Global Navigation Satellite System GND Ground GNSS Global Navigation Satellite System GPIO General Purpose Input Output GPRS General Packet Radio Service GSM Global System for Mobile communications Hi Z High impedance (Z) IC Integrated Circuit IMEI International Mobile Equipment Identification I/O Input / Output LED Light Emitting Diode LNA Low Noise Amplifier MAX Maximum MIN Minimum MSAS Multi-functional Satellite Augmentation System N/A Not Applicable PA Power Amplifier PC Personal Computer PCB Printed Circuit Board PCL Power Control Level PLL Phase Lock Loop PWM Pulse Width Modulation QZSS Quasi-Zenith Satellite System
41110555 Rev 1.0 November 01, 2017 53 Product Technical Specification Terms and Abbreviations Abbreviation Definition RF Radio Frequency RFI Radio Frequency Interference RMS Root Mean Square RST Reset RTC Real Time Clock RX Receive SCL Serial Clock SDA Serial Data SIM Subscriber Identification Module SMD Surface Mounted Device/Design SPI Serial Peripheral Interface SW Software PSRAM Pseudo Static RAM TBC To Be Confirmed TBD To Be Defined TP Test Point TX Transmit TYP Typical UART Universal Asynchronous Receiver-Transmitter UICC Universal Integrated Circuit Card USB Universal Serial Bus UIM User Identity Module VBATT Main Supply Voltage from Battery or DC adapter VSWR Voltage Standing Wave Ratio WAAS Wide Area Augmentation System

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