Sierra Wireless MC8765 Multi-Mode & Multi-Band Wireless Network MiniCard User Manual HW Integration Guide

Sierra Wireless Inc. Multi-Mode & Multi-Band Wireless Network MiniCard HW Integration Guide

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2. Regulatory section of user Manual

User Manual

2130114 Rev 0.92 MC5720, MC8755, MC8765 MiniCard Hardware Integration Guide Proprietary and Confidential

Limitation of Liability Patents Copyright Preface The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY. Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product. Portions of this product may be covered by some or all of the following US patents: 5,515,013 5,629,960 5,845,216 5,847,553 5,878,234 5,890,057 5,929,815 6,169,884 6,191,741 6,199,168 6,339,405 6,359,591 6,400,336 6,643,501 6,516,204 6,561,851 6,653,979 6,697,030 6,785,830 6,845,249 6,847,830 6,876,697 6,879,585 6,886,049 D442,170 D459,303 and other patents pending. This product includes technology licensed from: Licensed by QUALCOMM Incorporated under one or more of the following United States patents and/or their counterparts in other nations: 4,901,307 5,056,109 5,101,501 5,109,390 5,228,054 5,267,261 5,267,262 5,337,338 5,414,796 5,416,797 5,490,165 5,504,773 5,506,865 5,511,073 5,535,239 5,544,196 5,568,483 5,600,754 5,657,420 5,659,569 5,710,784 5,778,338 Manufactured or sold by Sierra Wireless or its licensees under one or more patents licensed from InterDigital Group. ©2005 Sierra Wireless. All rights reserved. Rev 0.92 Nov.05 1

Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 The Universal Development Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Required connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Guide Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Related documents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Power Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Overview of operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Power signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Electrostatic discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Module power states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disconnected state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Off state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Normal state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Low power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Usage models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 RF Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 RF connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Ground connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Shielding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Antenna and cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Interference and sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Power supply noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Interference from other wireless devices . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Device-generated RF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Host/Module Communication Interface . . . . . . . . . . . . . . . . . . . . .17 Rev 0.92 Nov.05 3

MC5720/8755/8765 Hardware Integration Guide LED output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Regulatory Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Important notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Safety and hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Important compliance information for North American users . . . . . . . . . . . 20 Acronyms and Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Index 25 4 2130114

1: Introduction 1 Note: Contact vendors before choosing your connectors — the numbers included here are for reference only. Choose connectors that are appropriate to your design. Sierra Wireless’ MiniCard modules form the radio component for the products in which they are embedded. MiniCards are available for use on CDMA and GSM networks, including: • MC5720 — operates on CDMA networks using the IS‐95A and CDMA 1X, and 1xEV‐DO (IS‐866) network standards • MC8755 and MC8765 — operates on GSM networks using the GSM/GPRS/EDGE/UMTS/HSDPA network standards Purpose of this guide This guide addresses issues that affect the integration of Sierra Wireless modules into host products, and includes design recommendations for the host products. Note: An understanding of network technology and experience in integrating hardware components into electronic equipment is assumed. The Universal Development Kit Sierra Wireless manufactures a Universal Development Kit (UDK) that facilitates all phases of the integration process. This kit is a hardware development platform that is designed to support multiple members of the Wireless Embedded Module product family. It contains the hardware components that are typically necessary for evaluating and developing with the module, including: • Development board • Cables • Antennas • Other accessories Required connectors When integrating these modules into your host device, you need the following connector types: • RF cable that mates with Hirose U.FL connector (model U.FL #CL331‐0471‐0‐10) • Industry‐standard mating connector for 52‐pin EDGE: Some manufacturers include Tyco, Foxconn, and Molex. For example, the connector used on the MC5720/MC8755/ Rev 0.92 Nov.05 5

MC5720/8755/8765 Hardware Integration Guide MC8765 Universal Development Kit board is a Molex 67910‐0001. • Industry‐standard USIM/RUIM connector: The actual connector you use depends on how your device exposes the USIM/RUIM socket. For example, the USIM/RUIM connector used on the MC5720/MC8755/MC8765 Universal Development Kit is an ITT CCM03‐3518. Guide Organization This guide includes the following sections: 1. Introduction (this section) 2. Power Interface (p.9) Describes power control signals used by the module and discusses design issues related to power supply integration. 3. RF Integration (p.13) Describes antenna connection methods and grounding issues, RF interference and desense issues. 4. Host/Module Communication Interface (p.17) Describes the USB interface for host/module communication, and the USIM/RUIM interface for host/module integration. 5. Acronyms and Definitions (p.23) Lists acronyms and definitions used throughout this guide. 6. Regulatory Information (p.19) Describes regulatory approvals and regulatory information requirements. Note: The term "host" always refers to the host device. Related documents This guide deals specifically with hardware integration issues that are unique to the MC5720 and MC8755/8765 modules. Table 1‐1 lists other documents referenced in this guide. 6 2130114

Introduction Rev 0.92 Nov.05 7 Table 1-1: Related documentation Document title Description AT Command Set for User Equipment (UE) (Release 6) This 3GPP technical specification describes standard AT commands for GSM/UMTS devices. The document (3GPP TS 27.007) can be downloaded from www.3gpp.org. CDMA 1X Standard This standard describes the technical requirements for CDMA systems, including details on sleep cycle index (SCI) values. The document, CDMA 2000 Series Release A (2000) (document # TIA/EIA/IS-2000 Series, Release A) can be ordered from www.tiaonline.org. EM5625/MC5720 CnS Reference (Document 2130643) This document describes the CnS (Control and Status) messages that are available for use with the MC5720. EMXXXX Embedded Modem Extended AT Command Reference (Document 2130395) This document describes proprietary AT commands for the MC5720. For MC8755/MC8765-specific commands, see MC87xx Modem Extended AT Command Reference (Document 2130616) FCC Regulations - Part 15 -Radio Frequency Devices This section of the FCC Code of Federal Regulations, Title 47 deals with radio frequency devices, including EM shielding requirements. The regulation can be downloaded from http://wireless.fcc.gov. IEC-61000-4-2 level 3 This document describes techniques for testing and measuring electrostatic discharge (ESD) immunity. The document can be ordered from www.iec.ch. MC5720 MiniCard Product Specification (Document 2130599) This document describes the mechanical and electrical specifications, and standards compliance of the MC5720. MC8755/MC8765 PCI Express MiniCard Product Specification (Document 2130637) This document describes the mechanical and electrical specifications, and standards compliance of the MC8755/ MC8765. MC87xx Modem CnS Reference (Document 2130602) This document describes the CnS (Control and Status) messages that are available for use with the MC8755/ MC8765. MC87xx Modem Extended AT Command Reference (Document 2130616) This document describes proprietary AT commands for the MC8755/MC8765. For MC5720-specific commands, see the EMXXXX Embedded Modem Extended AT Command Reference (Document 2130395)

MC5720/8755/8765 Hardware Integration Guide 8 2130114 Mobile Station (MS) Conformance Specification; Part 4: Subscriber Interface Module This 3GPP technical specification describes SIM testing methods. The document (3GPP TS 11.10-4) can be downloaded from www.3gpp.org. PCI Express Mini Card Electromechanical Specification Revision 1.1 The document can be downloaded from www.pcisig.com. Universal Serial Bus Specification, Rev 2.0 The specification can be downloaded from www.usb.org. Table 1-1: Related documentation Document title Description

2: Power Interface 2 Overview of operation Note: This chapter contains information for both the CDMA (MC5720) and GSM (MC8755/8765) modules. Information that is unique to one module type is clearly identified. The module is designed to use a 3.3V (nominal) power supply, provided by the host. It is the host’s responsibility to provide safe and continuous power to the module at all times; the module does NOT have an independent power supply, or protection circuits to guard against electrical issues. The module’s power state is controlled by the host’s assertion/ de‐assertion of the W_Disable# signal. The module also monitors its supply voltage and requests shutdown if the supply is insufficient. Power signals The module must be connected to a 3.3V power supply (as indicated in PCI Express Mini Card Electromechanical Specifi‐cation Revision 1.1). The MC8755/8765 has more power pins than the MC5720 due to higher peak current requirements for GSM devices. For detailed pinout and voltage / current requirements of these modules, refer to MC5720 MiniCard Product Specification (Document 2130599) and MC8755/MC8765 PCI Express MiniCard Product Specification (Document 2130637). Electrostatic discharge (ESD) You are responsible for ensuring that the host has adequate ESD protection on digital circuits and antenna ports: • (Operational) RF port (antenna launch and RF connector): IEC‐61000‐4‐2 — Level (Electrostatic Discharge Immunity Test) • (Non‐operational) Host connector interface: JESD22‐A114‐B+/‐1kV Human Body Model and JESD22‐C101 +/‐125 V Charged Device Model Specific recommendations are provided where needed in this guide, however, the level of protection required depends on your application. Rev 0.92 Nov.05 9

MC5720/8755/8765 Hardware Integration Guide Note: The module unit defaults to the Normal state when VCC3.3 is first applied in the absence of W_Disable# control. Note: The difference between the Disconnected and Off states is that in the Off state, the module is still connected to the power source and draws minimal current. Note: ESD protection is highly recommended for the SIM connector at the point where the contacts are exposed, and any other signals from the host interface that would be subjected to ESD by the user of the end product. Module power states At any time, the module will be in one of four power states: • Disconnected No power to the module. • Off Power to the module, but the module is powered off. • Normal The module is active. Several modes are possible (Receive, Transmit, Sleep, Shutdown). • Low power (“airplane mode”) The module is active, but RF is disabled. State machines are implemented in the module to monitor the power supply and operating temperature. Disconnected state This state occurs when there is no power to the module — the host power source is disconnected from the module and all voltages associated with the module are at 0V. Whether the host device is also powered off depends on the power rail design. If the connection between the power rail and the module is controlled by the host, the host can stay powered on and cut the power to put the modem into the disconnected state. If the power rail is shared between the host device and the module, the host is powered off when the module is powered off. Off state In this state, the host is powered up and the module is powered down (but still connected to the power source). The host keeps the module powered off by asserting (driving low) the W_Disable# signal. In this state, the module draws minimal current. 10 2130114

Power Interface Rev 0.92 Nov.05 11 Normal state Note: This is the default state when VCC3.3 is first applied in the absence of W_Disable# control. This is the active state of the module. While in this state: • The module is fully powered. • The module is capable of placing/receiving calls or estab‐lishing data connections on the wireless network. • The USB interface is fully active. Low power mode In this power state, RF (both Rx and Tx) is disabled in the module, but the USB interface is still active. This low power mode (ʺairplane modeʺ) is controlled by a software command through the host interface. For instructions on using appropriate commands, refer to AT Command Set for User Equipment (UE) (Release 6) (+CFUN=0 command), EM5625/MC5720 CnS Reference (Document 2130643) (CNS_RADIO_POWER [0x1075]), or MC87xx Modem CnS Reference (Document 2130602) (Disable Modem). Usage models Usage models can be used to calculate expected current consumption. A sample usage model is provided in Table 2‐1. This example model applies to a battery‐operated device. In practice, because the module will be isolated from the battery (the host device manages the power source), the mAh ratings will depend on the device’s supply efficiency. Table 2-1: Power consumption of a sample application Used by a field worker (data only) Used for remote data logging Upload (module Tx) 1000 kB/day 40 kB/h Download (module Rx) 500 kB/day 100 kB/day Coverage / data rate 1X / 80 kbps IS-95 / 14.4 kbps Hours of operation 8 / day (off 16 hrs / day) 24 / day Total power consumed over 24 hours 60 mAh 200 mAh

MC5720/8755/8765 Hardware Integration Guide The module automatically enters slotted sleep mode when there is no transmission or reception occurring (SCI = 2). Transmit power is assumed to be +3 dBm . 12 2130114

3: RF Integration 3 Note: To disconnect the antenna, make sure you use the Hirose U.FL connector removal tool (P/N UFL-LP-N-2(01) to prevent damage to the module or coaxial cable assembly. RF connection Consider the following when attaching an antenna to the module: • Use a Hirose U.FL connector (model U.FL #CL331‐0471‐0‐10) to attach an antenna to a connection point on the module, as shown in Figure 3‐1 (The main RF connector on the top side; the diversity RF connector on the bottom side). • Match coaxial connections between the module and the antenna to 50 Ω. • Minimize RF cable losses to the antenna; the recommended maximum cable loss for antenna cabling is 0.5 dB. Figure 3-1: Antenna connection points and mounting holes Ground connection When connecting the module to system ground: • Prevent noise leakage by establishing a very good ground connection to the module through the host connector. • Connect to system ground using the two mounting holes at the top of the module (as shown in Figure 3‐1). • Minimize ground noise leakage into the RF. Depending on the host board design, noise could potentially be coupled to the module from the host board. This is mainly an issue for host designs that have signals traveling along the length of the module, or circuitry operating at both ends of the module interconnects. Rev 0.92 Nov.05 13

MC5720/8755/8765 Hardware Integration Guide Shielding The module is fully shielded to protect against EMI and to ensure compliance with FCC Part 15‐ “Radio Frequency Devices” (or equivalent regulations in other jurisdictions). Note: The module shields must NOT be removed. Antenna and cabling When selecting the antenna and cable, it is critical to RF perfor‐mance to match antenna gain and cable loss. Choosing the correct antenna and cabling Consider the following points for proper matching of antennas and cabling: • The antenna (and associated circuitry) should have a nominal impedance of 50 Ω with a return loss ≤ 10 dB across each frequency band of operation. • The system gain value affects both radiated power and regulatory (FCC, IC, CE, etc.) test results. Developing custom antennas Consider the following points when developing custom‐designed antennas: • A skilled RF engineer should do the development to ensure that the RF performance is maintained. • Identify the bands that need to be supported, particularly when both the MC5720 and MC8755/8765 will be installed in the same platform. In this case, you may want to develop separate antennas for maximum performance. Determining the antenna’s location Consider the following points when deciding where to put the antenna: • Antenna location may affect RF performance. Although the module is shielded to prevent interference in most applica‐tions, the placement of the antenna is still very important‐if the host device is insufficiently shielded, high levels of broadband or spurious noise can degrade the module’s performance. • Connecting cables between the module and the antenna must have 50 Ω impedance. If the impedance of the module is mismatched, RF performance is reduced significantly. • Antenna cables should be routed, if possible, away from noise sources (switching power supplies, LCD assemblies, 14 2130114

Note: These modules are based on ZIF (Zero Intermediate Frequency) technologies; when performing EMC (Electromagnetic Compatibility) tests, there are no IF (Intermediate Frequency) components from the module to consider. RF Integration etc.). If the cables are near the noise sources, the noise may be coupled into the RF cable and into the antenna. Disabling the diversity antenna (MC5720) If your host device is not designed to use the MC5720’s diversity antenna, terminate the interface with a no‐connect. Interference and sensitivity Several sources of interference can affect the RF performance of the module (RF desense). Common sources include power supply noise and device‐generated RF. RF desense can be addressed through a combination of mitigation techniques and radiated sensitivity measurement. Power supply noise Noise in the power supply can lead to noise in the RF signal. The power supply ripple limit for the module is no more than 200 mVp‐p1Hz to 100 kHz. This limit includes voltage ripple due to transmitter burst activity Interference from other wireless devices Different wireless devices operating inside the host device can cause interference that affects the module. To determine the most suitable locations for each antenna on your host device, evaluate each wireless device’s radio system, considering the following: • Any harmonics, sub‐harmonics, or cross‐products of signals generated by wireless devices that fall in the module’s Rx range may cause spurious response resulting in decreased Rx performance. • The Tx power and corresponding broadband noise of other wireless devices may overload or increase the noise floor of the module’s receiver, resulting in Rx desense. The severity of this interference depends on the closeness of the other antennas to the module’s antenna. To determine suitable locations for each wireless device’s antenna, thoroughly evaluate your host device’s design. Rev 0.92 Nov.05 15

MC5720/8755/8765 Hardware Integration Guide Note: The module can cause interference with other devices such as hearing aids and on-board speakers. Wireless devices such as the MiniCard transmit in bursts (pulse transients), for set durations (RF burst frequencies). Hearing aids and speakers convert these burst frequencies into audible frequencies, resulting in audible noise. Device-generated RF All electronic computing devices generate RF interference that can negatively affect the receive sensitivity of the module (RF desense). The proximity of host electronics to the antenna in wireless devices can contribute to RF desense. Components that are most likely to cause RF desense include: • Microprocessor and memory • Display panel and display drivers • Switching‐mode power supplies These, and other high‐speed devices (in particular, the processor) can cause RF desense because they run at frequencies of tens of MHz. The rapid rise and fall of these clock signals generates higher‐order harmonics that often fall within the operating frequency band of the module, causing RF desense. Example On a sub‐system running at 40 MHz, the 22nd harmonic falls at 880 MHz, which is within the cellular receive frequency band. Note: In practice, there are usually numerous interfering frequencies and harmonics. The net effect can be a series of desensitized receive channels. 16 2130114

44: Host/Module Communication Interface This chapter provides information about the Host‐Module communication interface (USB interface) and lists of extended AT commands that may be useful for hardware integration testing. Note: On any given interface (USB, USIM/RUIM, etc.), leave unused inputs and outputs as no-connects. LED output The module drives the LED output according to the PCI‐Express MiniCard specification (summarized in Table 4‐1, Module is transmitting LED is flashing intermittently, or receiving. proportional to activity on the interface. • 50% duty cycle • 3 Hz minimum blink rate • 20 Hz maximum blink rate Rev 0.92 Nov.05 17 below). Table 4-1: LED States State Indicates Characteristics OFF Module is not powered. Light is turned off. ON Module is powered and connected, but not transmitting or receiving. Light is turned on. Slow Blink Module is powered and searching for a connection. LED is flashing at a steady, slow rate. • 250 ms ± 25% ON period • 0.2 Hz ± 25% blink rate Intermittent Blink

MC5720/8755/8765 Hardware Integration Guide Figure 4-1: Example LED VCC 3.3V Current limiting Resistor LED MIO MiniCard 18 2130114

5: Regulatory Information 5 Important notice Because of the nature of wireless communications, trans‐mission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well‐constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless and its affiliates accept no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data. Safety and hazards Do not operate your MC5720/MC8755/MC8765 modem: • In areas where blasting is in progress • Where explosive atmospheres may be present including refuelling points, fuel depots, and chemical plants • Near medical equipment • Near life support equipment, or any equipment which may be susceptible to any form of radio interference. In such areas, the MC5720/MC8755/MC8765 modem MUST BE POWERED OFF. Otherwise, the MC5720/MC8755/ MC8765 modem can transmit signals that could interfere with this equipment. In an aircraft, the MC5720/MC8755/MC8765 modem MUST BE POWERED OFF. Otherwise, the MC5720/MC8755/MC8765 modem can transmit signals that could interfere with various onboard systems and may be dangerous to the operation of the aircraft or disrupt the cellular network. Use of a cellular phone in an aircraft is illegal in some jurisdictions. Failure to observe this instruction may lead to suspension or denial of cellular telephone services to the offender, or legal action or both. Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. The MC5720/ MC8755/MC8765 modem may be used normally at this time. Rev 0.92 Nov.05 19

MC5720/8755/8765 Hardware Integration Guide Important compliance information for North American users The MC5720/MC8755/MC8765 modem has been granted modular approval for mobile applications. Integrators may use the MC5720/MC8755/MC8765 modem in their final products without additional FCC / IC (Industry Canada) certification if they meet the following conditions. Otherwise, additional FCC / IC approvals must be obtained. 1. At least 20 cm separation distance between the antenna and the user’s body must be maintained at all times. 2. To comply with FCC / IC regulations limiting both maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile‐only exposure condition must not exceed: · 8dBi in the Cellular band and 4dBi in the PCS band for the MC8755/MC8765 · 4.65 dBi in the Cellular band and 3.35 dBi in the PCS band for the MC5720 3. The MC5720/MC8755/MC8765 modem and its antenna must not be co‐located or operating in conjunction with any other transmitter or antenna within a host device. 4. A label must be affixed to the outside of the end product into which the MC5720/MC8755/MC8765 modem is incorpo‐rated, with a statement similar to the following: · For MC5720: This device contains TX FCC ID: N7N‐MC5720 This equipment contains equipment certified under IC: 2417C‐MC5720 · For MC8755: This device contains TX FCC ID: N7NMC8755 This equipment contains equipment certified under IC: 2417C‐MC8755 · For MC8765: This device contains TX FCC ID: N7NMC8765 This equipment contains equipment certified under IC: 2417C‐MC8765 5. A user manual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC / IC RF exposure guidelines. The end product with an embedded MC5720/MC8755/MC8765 modem may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15. 20 2130114

Regulatory Information Note: If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093 and IC RSS‐102. Rev 0.92 Nov.05 21

MC5720/8755/8765 Hardware Integration Guide 22 2130114

AA: Acronyms and Definitions . Rev 0.92 Nov.05 23 Table 5-1: Acronyms and definitions Acronym or term Definition AGC Automatic Gain Control BER Bit Error Rate - a measure of receive sensitivity BLER Block Error Rate Call Box Base Station Simulator - Agilent E8285A or 8960, Rohde & Schwarz CMU200 CDMA Code Division Multiple Access dB Decibel = 10 x log10 (P1/P2) P1 is calculated power; P2 is reference power Decibel = 20 x log10 (V1/V2) V1 is calculated voltage, V2 is reference voltage dBm Decibels, relative to 1 mW - Decibel(mW) = 10 x log10 (Pwr (mW)/ 1mW) DUT Device Under Test EDGE Enhanced Data rates for GSM Evolution EM Embedded Module ESD ElectroStatic Discharge FER Frame Error Rate - a measure of receive sensitivity GPRS General Packet Radio Service GPS Global Positioning System GSM Global System for Mobile communications Hz Hertz = 1 cycle/second inrush current Peak current drawn when a device is connected or powered on IS-2000 3G radio standards for voice and data (CDMA only) IS-95 2G radio standards targeted for voice (cdmaONE) LDO Low Drop Out - refers to linear regulator MC5720 Sierra Wireless MiniCard used on CDMA networks

MC5720/8755/8765 Hardware Integration Guide 24 2130114 MC8755 / MC8765 Sierra Wireless MiniCards used on GSM networks MHz MegaHertz = 10E6 Hertz (Hertz = 1 cycle/second) MIO Module Input/Output MPE Maximum Permissible Exposure — the level of radiation to which a person may be exposed without hazardous effect or adverse biological changes OTA Over The Air or Radiated through the antenna PCS Personal Communication System - PCS spans the 1.9 GHz radio spectrum RF Radio Frequency RMS Root Mean Square RUIM Removable User Identity Module SA Selective Availability Sensitivity (Audio) Measure of lowest power signal that the receiver can measure Sensitivity (RF) Measure of lowest power signal at the receiver input that can provide a prescribed BER/BLER/SNR value at the receiver output. SIM Subscriber Identity Module SNR Signal to Noise Ratio SOF Start of Frame - a USB function UART Universal Asynchronous Receiver Transmitter UDK Universal Development Kit UMTS Universal Mobile Telecommunications System USB Universal Serial Bus USIM Universal Subscriber Identity Module VCC3.3 3.3 V supply voltage WCDMA Wideband Code Division Multiple Access — In this document, the term “UMTS” is used instead of “WCDMA”. XIM In this document, XIM is used as part of the contact identifiers for the USIM/RUIM interface (XIM_VCC, XIM_CLK, etc.). It indicates either RUIM or USIM. Table 5-1: Acronyms and definitions Acronym or term Definition

Index A acronyms and definitions 23–24 airplane mode 11 antenna connection and mounting points 13 connection considerations 13 custom, considerations 14 diversity antenna, disabling 15 limit, matching coaxial connections 13 matching, considerations 14 maximum cable loss 13 AT commands 3GPP specification, details 7 extended, MC5720 7 extended, MC8755/8765 7 low power mode, setting 11 C cable loss antenna, maximum 13 CnS MC5720 reference, details 7 MC8755 reference, details 7 connection grounding 13 connectors, required EDGE mating (52‐pin) 5 host‐module 5–6 RF, Hirose 5 USIM/RUIM 6 current consumption usage models 11 D default state (Normal), module 11 desense. See RF disconnected, module power state 10 diversity antenna disabling 15 E electrostatic discharge. See ESD ESD protection requirements 9–10 testing techniques document (IEC‐61000‐4‐2) 7 F FCC regulations, relevant section 7 G grounding connection considerations 13 ground loops, avoiding 14 H Host⁄Module interface 17–18 I interference device generated 16 power supply noise 15 wireless devices 15 L LED example 18 state intermittent blink 17 off 17 on 17 slow blink 17 low power mode setting, AT commands 11 low power, module power state 11 M MC5720 CnS reference, details 7 extended AT commands 7 product specification 7 MC8755/8765 CnS reference, details 7 extended AT commands 7 product specification 7 mini card PCI Express Specification, details 8 See also MC5720; MC8755⁄8765 module power states 10–12 module, default power mode (Normal) 11 Rev 0.92 Nov.05 25

MC5720/8755/8765 Hardware Integration Guide N noise leakage, minimizing 13 RF interference, power supply 15 normal, module power state 11 O off, module power state 10 P PCI Express mini card specification details 8 power disconnected, characteristics 10 normal, characteristics 11 off, characteristics 10 signals, overview 9 state, disconnected 10 state, low power 11 state, normal 11 state, off 10 states, module 10–12 supply, RF interference 15 power interface 9–12 Product Specification Document. See PSD PSD MC5720, details 7 MC8755/8765, details 7 R regulatory information 19–21 FCC 20 limitation of liability 19 safety and hazards 19 RF antenna cable loss, maximum 13 antenna connection, considerations 13 cable type, required 5 desense device‐generated 16 integration 13–?? interference other devices 16 power supply 15 wireless devices 15 S shielding module, compliance 14 SIM. See USIM/RUIM T testing ESD immunity, techniques document (IEC‐61000‐ 4‐2) 7 U UDK. See Universal Development Kit Universal Development Kit components, included 5 Universal Serial Bus. See USB usage models current consumption 11 USB specification, details 8 USIM/RUIM connector type, required 6 26 2130114

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