Sierra Wireless MC8775 Multi-Mode & Multi-Band Wireless Network MiniCard User Manual FCC submission HW Integration Guide
Sierra Wireless Inc. Multi-Mode & Multi-Band Wireless Network MiniCard FCC submission HW Integration Guide
User Manual
2130114
Rev 1.3
MC5720, MC5725, MC8755, MC8765,
MC8775 MiniCard
Hardware Integration Guide
Proprietary and Confidential
Preface
Rev 1.3 Jul.06 1
Limitation of
Liability
Theinformationinthismanualissubjecttochangewithout
noticeanddoesnotrepresentacommitmentonthepartof
SierraWireless.SIERRAWIRELESSANDITSAFFILIATES
SPECIFICALLYDISCLAIMLIABILITYFORANYANDALL
DIRECT,INDIRECT,SPECIAL,GENERAL,INCIDENTAL,
CONSEQUENTIAL,PUNITIVEOREXEMPLARYDAMAGES
INCLUDING,BUTNOTLIMITEDTO,LOSSOFPROFITSOR
REVENUEORANTICIPATEDPROFITSORREVENUE
ARISINGOUTOFTHEUSEORINABILITYTOUSEANY
SIERRAWIRELESSPRODUCT,EVENIFSIERRAWIRELESS
AND/ORITSAFFILIATESHASBEENADVISEDOFTHE
POSSIBILITYOFSUCHDAMAGESORTHEYARE
FORESEEABLEORFORCLAIMSBYANYTHIRDPARTY.
Notwithstandingtheforegoing,innoeventshallSierra
Wirelessand/oritsaffiliatesaggregateliabilityarisingunderor
inconnectionwiththeSierraWirelessproduct,regardlessof
thenumberofevents,occurrences,orclaimsgivingriseto
liability,beinexcessofthepricepaidbythepurchaserforthe
SierraWirelessproduct.
Patents Portionsofthisproductmaybecoveredbysomeorallofthe
followingUSpatents:
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6,847,830 6,876,697 6,879,585 6,886,049 6,968,171
6,985,757 7,023,878 D442,170 D459,303
andotherpatentspending.
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Copyright ©2006SierraWireless.Allrightsreserved.
MC5720/5725/8755/8765/8775 Hardware Integration Guide
22130114
Trademarks AirCardand“HeartoftheWirelessMachine”areregistered
trademarksofSierraWireless.
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thered‐tippedantenna,andWatcheraretrademarksofSierra
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Othertrademarksarethepropertyoftherespectiveowners.
Contact
Information
Consultourwebsiteforup‐to‐dateproductdescriptions,
documentation,applicationnotes,firmwareupgrades,trouble‐
shootingtips,andpressreleases:
www.sierrawireless.com
Sales Desk: Phone: 1-604-232-1488
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Rev 1.3 Jul.06 3
Table of Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
The Universal Development Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Required connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Guide organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Related documents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Power Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Overview of operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Power signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Electrostatic discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Module power states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disconnected state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Off state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Normal state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Low power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Usage models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
RF Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
RF connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Ground connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Shielding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Antenna and cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Interference and sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Power supply noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Interference from other wireless devices . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Device-generated RF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
MC5720/5725/8755/8765/8775 Hardware Integration Guide
42130114
Host/Module Communication Interface . . . . . . . . . . . . . . . . . . . . . 19
LED output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Regulatory Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Important notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Safety and hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Important compliance information for North American users . . . . . . . . . . . 22
Acronyms and Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Index 27
1
Rev 1.3 Jul.06 5
1: Introduction
SierraWireless’MiniCardmodulesformtheradiocomponent
fortheproductsinwhichtheyareembedded.MiniCardsare
availableforuseonCDMAandGSMnetworks,including:
•MC5720andMC5725—operatesonCDMAnetworksusing
theIS‐95AandCDMA1X,and1xEV‐DO(IS‐866)network
standards
•MC8755,MC8765,andMC8775—operatesonGSM
networksusingtheGSM/GPRS/EDGE/UMTS/HSDPA
networkstandards
Purpose of this guide
ThisguideaddressesissuesthataffecttheintegrationofSierra
Wirelessmodulesintohostproducts,andincludesdesign
recommendationsforthehostproducts.
Note: An understanding of network technology and experience in
integrating hardware components into electronic equipment is
assumed.
The Universal Development Kit
SierraWirelessmanufacturesaUniversalDevelopmentKit
(UDK)thatfacilitatesallphasesoftheintegrationprocess.
Thiskitisahardwaredevelopmentplatformthatisdesigned
tosupportmultiplemembersoftheWirelessEmbedded
Moduleproductfamily.Itcontainsthehardwarecomponents
thataretypicallynecessaryforevaluatinganddevelopingwith
themodule,including:
•Developmentboard
•Cables
•Antennas
•Otheraccessories
MC5720/5725/8755/8765/8775 Hardware Integration Guide
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Required connectors
Note: Contact vendors before
choosing your connectors — the
numbers included here are for
reference only. Choose
connectors that are appropriate
to your design.
Whenintegratingthesemodulesintoyourhostdevice,you
needthefollowingconnectortypes:
•RFcablethatmateswithHiroseU.FLconnector(model
U.FL#CL331‐0471‐0‐10)
•Industry‐standardmatingconnectorfor52‐pinEDGE:
SomemanufacturersincludeTyco,Foxconn,andMolex.For
example,theconnectorusedontheMC5720/MC5725/
MC8755/MC8765/MC8775UniversalDevelopmentKit
boardisaMolex67910‐0001.
•Industry‐standardUSIM/RUIMconnector:Theactual
connectoryouusedependsonhowyourdeviceexposesthe
USIM/RUIMsocket.Forexample,theUSIM/RUIM
connectorusedontheMC5720/MC5725/MC8755/MC8765/
MC8775UniversalDevelopmentKitisanITTCCM03‐3518.
Guide organization
Thisguideincludesthefollowingsections:
1. Introduction(thissection)
2. Power Interface(p.9)
Describespowercontrolsignalsusedbythemoduleand
discussesdesignissuesrelatedtopowersupply
integration.
3. RF Integration(p.13)
Describesantennaconnectionmethodsandgroundingissues,
RFinterferenceanddesenseissues.
4. Host/Module Communication Interface(p.19)
DescribestheUSBinterfaceforhost/modulecommunication,
andtheUSIM/RUIMinterfaceforhost/moduleintegration.
5. Acronyms and Definitions(p.25)
Listsacronymsanddefinitionsusedthroughoutthisguide.
6. Regulatory Information(p.21)
Describesregulatoryapprovalsandregulatoryinformation
requirements.
Note: The term "host" always refers to the host device.
Related documents
Thisguidedealsspecificallywithhardwareintegrationissues
thatareuniquetotheMC5720/5725andMC8755/8765/8775
modules.
Introduction
Rev 1.3 Jul.06 7
Table1‐1listsotherdocumentsreferencedinthisguide.
Table 1-1: Related documentation
Document title Description
AT Command Set for User
Equipment (UE) (Release 6) This 3GPP technical specification describes standard AT
commands for GSM/UMTS devices.
The document (3GPP TS 27.007) can be downloaded
from www.3gpp.org.
CDMA 1X Standard This standard describes the technical requirements for
CDMA systems, including details on sleep cycle index
(SCI) values.
The document, CDMA 2000 Series Release A (2000)
(document # TIA/EIA/IS-2000 Series, Release A) can be
ordered from www.tiaonline.org.
EM5625/MC5720 CnS
Reference (Document
2130643)
This document describes the CnS (Control and Status)
messages that are available for use with the MC5720 and
the MC5725.
EMXXXX Embedded Modem
Extended AT Command
Reference (Document
2130395)
This document describes proprietary AT commands for the
MC5720. For MC8755/MC8765/MC8775-specific
commands, see MC87xx Modem Extended AT Command
Reference (Document 2130616)
FCC Regulations - Part 15 -
Radio Frequency Devices This section of the FCC Code of Federal Regulations, Title
47 deals with radio frequency devices, including EM
shielding requirements.
The regulation can be downloaded from
http://wireless.fcc.gov.
IEC-61000-4-2 level 3 This document describes techniques for testing and
measuring electrostatic discharge (ESD) immunity.
The document can be ordered from www.iec.ch.
MC5720 MiniCard Product
Specification (Document
2130599)
This document describes the mechanical and electrical
specifications, and standards compliance of the MC5720.
MC5725 MiniCard Product
Specification (Document
2130TBD)
This document describes the mechanical and electrical
specifications, and standards compliance of the MC5725.
MC8755/8765 PCI Express
MiniCard Product
Specification (Document
2130637)
This document describes the mechanical and electrical
specifications, and standards compliance of the MC8755/
MC8765.
MC8775 PCI Express MiniCard
Product Specification
(Document 2130697)
This document describes the mechanical and electrical
specifications, and standards compliance of the MC8775.
MC5720/5725/8755/8765/8775 Hardware Integration Guide
82130114
MC87xx Modem CnS Reference
(Document 2130602) This document describes the CnS (Control and Status)
messages that are available for use with the MC8755/
MC8765/MC8775.
MC87xx Modem Extended AT
Command Reference
(Document 2130616)
This document describes proprietary AT commands for the
MC8755/MC8765/MC8775. For MC5720-specific
commands, see the EMXXXX Embedded Modem
Extended AT Command Reference (Document 2130395)
Mobile Station (MS)
Conformance Specification;
Part 4: Subscriber Interface
Module
This 3GPP technical specification describes SIM testing
methods.
The document (3GPP TS 11.10-4) can be downloaded
from www.3gpp.org.
PCI Express Mini Card
Electromechanical
Specification Revision 1.1
The document can be downloaded from www.pcisig.com.
Universal Serial Bus
Specification, Rev 2.0 The specification can be downloaded from www.usb.org.
Table 1-1: Related documentation (Continued)
Document title Description
2
Rev 1.3 Jul.06 9
2: Power Interface
Overview of operation
Note: This chapter contains information for both the CDMA (MC5720/
5725) and GSM (MC8755/8765/8775) modules.
Information that is unique to one module type is clearly identified.
Themoduleisdesignedtousea3.3V(nominal)powersupply,
providedbythehost.Itisthehost’sresponsibilitytoprovide
safeandcontinuouspowertothemoduleatalltimes;the
moduledoesNOThaveanindependentpowersupply,or
protectioncircuitstoguardagainstelectricalissues.
Themodule’spowerstateiscontrolledbythehost’sassertion/
de‐assertionoftheW_Disable#signal.Themodulealso
monitorsitssupplyvoltageandrequestsshutdownifthe
supplyisinsufficient.
Power signals
Themodulemustbeconnectedtoa3.3Vpowersupply(as
indicatedinPCIExpressMiniCardElectromechanicalSpecifi‐
cationRevision1.1).
TheMC8755/8765/8775hasmorepowerpinsthantheMC5720/
5725duetohigherpeakcurrentrequirementsforGSM
devices.
Fordetailedpinoutandvoltage/currentrequirementsofthese
modules,seetheProductSpecificationdocumentforyour
MiniCard.
Electrostatic discharge (ESD)
Youareresponsibleforensuringthatthehosthasadequate
ESDprotectionondigitalcircuitsandantennaports:
•(Operational)RFport(antennalaunchandRFconnector):
IEC‐61000‐4‐2—Level(ElectrostaticDischargeImmunityTest)
•(Non‐operational)Hostconnectorinterface:
JESD22‐A114‐B+/‐1kVHumanBodyModeland
JESD22‐C101+/‐125VChargedDeviceModel
Specificrecommendationsareprovidedwhereneededinthis
guide,however,thelevelofprotectionrequireddependson
yourapplication.
MC5720/5725/8755/8765/8775 Hardware Integration Guide
10 2130114
Note: ESD protection is highly recommended for the SIM connector
at the point where the contacts are exposed, and any other signals
from the host interface that would be subjected to ESD by the user of
the end product.
Module power states
Note: The module unit defaults
to the Normal state when
VCC3.3 is first applied in the
absence of W_Disable# control.
Atanytime,themodulewillbeinoneoffourpowerstates:
•Disconnected
Nopowertothemodule.
•Off
Powertothemodule,butthemoduleispoweredoff.
•Normal
Themoduleisactive.Severalmodesarepossible(Receive,
Transmit,Sleep,Shutdown).
•Low power (“airplane mode”)
Themoduleisactive,butRFisdisabled.
Statemachinesareimplementedinthemoduletomonitorthe
powersupplyandoperatingtemperature.
Disconnected state
Note: The difference between
the Disconnected and Off states
is that in the Off state, the
module is still connected to the
power source and draws minimal
current.
Thisstateoccurswhenthereisnopowertothemodule—the
hostpowersourceisdisconnectedfromthemoduleandall
voltagesassociatedwiththemoduleareat0V.
Whetherthehostdeviceisalsopoweredoffdependsonthe
powerraildesign.Iftheconnectionbetweenthepowerrail
andthemoduleiscontrolledbythehost,thehostcanstay
poweredonandcutthepowertoputthemodemintothe
disconnectedstate.Ifthepowerrailissharedbetweenthehost
deviceandthemodule,thehostispoweredoffwhenthe
moduleispoweredoff.
Off state
Inthisstate,thehostispoweredupandthemoduleis
powereddown(butstillconnectedtothepowersource).
Thehostkeepsthemodulepoweredoffbyasserting(driving
low)theW_Disable#signal.Inthisstate,themoduledraws
minimalcurrent.
Power Interface
Rev 1.3 Jul.06 11
Normal state
Note: This is the default state
when VCC3.3 is first applied in
the absence of W_Disable#
control.
Thisistheactivestateofthemodule.Whileinthisstate:
•Themoduleisfullypowered.
•Themoduleiscapableofplacing/receivingcallsorestab‐
lishingdataconnectionsonthewirelessnetwork.
•TheUSBinterfaceisfullyactive.
Low power mode
Inthispowerstate,RF(bothRxandTx)isdisabledinthe
module,buttheUSBinterfaceisstillactive.Thislowpower
mode(ʺairplanemodeʺ)iscontrolledbyasoftwarecommand
throughthehostinterface.
Forinstructionsonusingappropriatecommands,refertoAT
CommandSetforUserEquipment(UE)(Release6)(+CFUN=0
command),EM5625/MC5720CnSReference(Document2130643)
(CNS_RADIO_POWER[0x1075]),orMC87xxModemCnS
Reference(Document2130602)(DisableModem).
Usage models
Usagemodelscanbeusedtocalculateexpectedcurrent
consumption.AsampleusagemodelisprovidedinTable2‐1
Table 2-1: Power consumption of a sample application
Used by a field
worker (data only) Used for remote
data logging
Upload
(module Tx) 1000 kB/day 40 kB/h
Download
(module Rx) 500 kB/day 100 kB/day
Coverage /
data rate 1X / 80 kbps IS-95 / 14.4 kbps
Hours of
operation 8 / day (off 16 hrs/day) 24 / day
Total power
consumed
over 24
hours
60 mAh 200 mAh
MC5720/5725/8755/8765/8775 Hardware Integration Guide
12 2130114
Thisexamplemodelappliestoabattery‐operateddevice.In
practice,becausethemodulewillbeisolatedfromthebattery
(thehostdevicemanagesthepowersource),themAhratings
willdependonthedevice’ssupplyefficiency.
Themoduleautomaticallyentersslottedsleepmodewhen
thereisnotransmissionorreceptionoccurring(SCI=2).
Transmitpowerisassumedtobe+3dBm.
3
Rev 1.3 Jul.06 13
3: RF Integration
TheMC8755/8765/8775operatesonthefrequenciesdetailed
inTable3‐1.
RF connection
Considerthefollowingwhenattachinganantennatothe
module:
Note: To disconnect the
antenna, make sure you use the
Hirose U.FL connector removal
tool (P/N UFL-LP-N-2(01) to
prevent damage to the module
or coaxial cable assembly.
•UseaHiroseU.FLconnector(model
U.FL#CL331‐0471‐0‐10)toattachanantennatoa
connectionpointonthemodule,asshowninFigure3‐1
(ThemainRFconnectoronthetopside;thediversityRF
connectoronthebottomside).
•Matchcoaxialconnectionsbetweenthemoduleandthe
antennato50Ω.
•MinimizeRFcablelossestotheantenna;therecommended
maximumcablelossforantennacablingis0.5dB.
Table 3-1: MC8755/8765/8775 — Supported frequencies
Product Band Frequencies
(MHz)
MC8755 /
MC8765 /
MC8775
GSM 850 Tx: 824–849
Rx: 869-894
EGSM 900 Tx: 880-915
Rx: 925-960
DCS 1800 Tx: 1710-1785
Rx: 1805-1880
PCS 1900 Tx: 1850-1910
Rx: 1930-1990
MC8755 /
MC8775 Band I
UMTS 2100 Tx: 1920–1980
Rx: 2110–2170
MC8765 /
MC8775 Band II
UMTS 1900 Tx: 1850–1910
Rx: 1930–1990
Band V
UMTS 850 Tx: 824–849
Rx: 869–894
MC5720/5725/8755/8765/8775 Hardware Integration Guide
14 2130114
Figure 3-1: Antenna connection points and mounting
Ground connection
Whenconnectingthemoduletosystemground:
•Preventnoiseleakagebyestablishingaverygoodground
connectiontothemodulethroughthehostconnector.
•Connecttosystemgroundusingthetwomountingholesat
thetopofthemodule(asshowninFigure3‐1).
•MinimizegroundnoiseleakageintotheRF.
Dependingonthehostboarddesign,noisecouldpotentially
becoupledtothemodulefromthehostboard.Thisis
mainlyanissueforhostdesignsthathavesignalstraveling
alongthelengthofthemodule,orcircuitryoperatingat
bothendsofthemoduleinterconnects.
RF Integration
Rev 1.3 Jul.06 15
Shielding
ThemoduleisfullyshieldedtoprotectagainstEMIandto
ensurecompliancewithFCCPart15‐“RadioFrequency
Devices”(orequivalentregulationsinotherjurisdictions).
Note: The module shields must NOT be removed.
Antenna and cabling
Whenselectingtheantennaandcable,itiscriticaltoRFperfor‐
mancetomatchantennagainandcableloss.
Choosing the correct antenna and cabling
Considerthefollowingpointsforpropermatchingofantennas
andcabling:
•Theantenna(andassociatedcircuitry)shouldhavea
nominalimpedanceof50Ωwithareturnloss≤ 10dB
acrosseachfrequencybandofoperation.
•Thesystemgainvalueaffectsbothradiatedpowerand
regulatory(FCC,IC,CE,etc.)testresults.
Developing custom antennas
Considerthefollowingpointswhendevelopingcustom‐
designedantennas:
•AskilledRFengineershoulddothedevelopmenttoensure
thattheRFperformanceismaintained.
•Identifythebandsthatneedtobesupported,particularly
whenboththeMC5720/5725andMC8755/8765/8775willbe
installedinthesameplatform.Inthiscase,youmaywantto
developseparateantennasformaximumperformance.
Determining the antenna’s location
Considerthefollowingpointswhendecidingwheretoputthe
antenna:
•AntennalocationmayaffectRFperformance.Althoughthe
moduleisshieldedtopreventinterferenceinmostapplica‐
tions,theplacementoftheantennaisstillveryimportant—
ifthehostdeviceisinsufficientlyshielded,highlevelsof
broadbandorspuriousnoisecandegradethemodule’s
performance.
•Connectingcablesbetweenthemoduleandtheantenna
musthave50Ωimpedance.Iftheimpedanceofthemodule
ismismatched,RFperformanceisreducedsignificantly.
•Antennacablesshouldberouted,ifpossible,awayfrom
noisesources(switchingpowersupplies,LCDassemblies,
MC5720/5725/8755/8765/8775 Hardware Integration Guide
16 2130114
etc.).Ifthecablesarenearthenoisesources,thenoisemay
becoupledintotheRFcableandintotheantenna.
Disabling the diversity antenna (MC5720/5725)
IfyourhostdeviceisnotdesignedtousetheMC5720/5725’s
diversityantenna,terminatetheinterfacewithano‐connect.
Interference and sensitivity
Note: These modules are based
on ZIF (Zero Intermediate
Frequency) technologies; when
performing EMC
(Electromagnetic Compatibility)
tests, there are no IF
(Intermediate Frequency)
components from the module to
consider.
SeveralsourcesofinterferencecanaffecttheRFperformance
ofthemodule(RFdesense).Commonsourcesincludepower
supplynoiseanddevice‐generatedRF.
RFdesensecanbeaddressedthroughacombinationof
mitigationtechniquesandradiatedsensitivitymeasurement.
Power supply noise
NoiseinthepowersupplycanleadtonoiseintheRFsignal.
Thepowersupplyripplelimitforthemoduleisnomorethan
200mVp‐p1Hzto100kHz.Thislimitincludesvoltageripple
duetotransmitterburstactivity
Interference from other wireless devices
Differentwirelessdevicesoperatinginsidethehostdevicecan
causeinterferencethataffectsthemodule.
Todeterminethemostsuitablelocationsforeachantennaon
yourhostdevice,evaluateeachwirelessdevice’sradiosystem,
consideringthefollowing:
•Anyharmonics,sub‐harmonics,orcross‐productsofsignals
generatedbywirelessdevicesthatfallinthemodule’sRx
rangemaycausespuriousresponseresultingindecreased
Rxperformance.
•TheTxpowerandcorrespondingbroadbandnoiseofother
wirelessdevicesmayoverloadorincreasethenoisefloorof
themodule’sreceiver,resultinginRxdesense.
Theseverityofthisinterferencedependsontheclosenessof
theotherantennastothemodule’santenna.Todetermine
suitablelocationsforeachwirelessdevice’santenna,
thoroughlyevaluateyourhostdevice’sdesign.
RF Integration
Rev 1.3 Jul.06 17
Device-generated RF
Note: The module can cause
interference with other devices
such as hearing aids and on-
board speakers.
Wireless devices such as the
MiniCard transmit in bursts
(pulse transients), for set
durations (RF burst frequencies).
Hearing aids and speakers
convert these burst frequencies
into audible frequencies,
resulting in audible noise.
AllelectroniccomputingdevicesgenerateRFinterferencethat
cannegativelyaffectthereceivesensitivityofthemodule
(RFdesense).
Theproximityofhostelectronicstotheantennainwireless
devicescancontributetoRFdesense.Componentsthatare
mostlikelytocauseRFdesenseinclude:
•Microprocessorandmemory
•Displaypanelanddisplaydrivers
•Switching‐modepowersupplies
These,andotherhigh‐speeddevices(inparticular,the
processor)cancauseRFdesensebecausetheyrunat
frequenciesoftensofMHz.Therapidriseandfallofthese
clocksignalsgenerateshigher‐orderharmonicsthatoftenfall
withintheoperatingfrequencybandofthemodule,causing
RFdesense.
Example
Onasub‐systemrunningat40MHz,the22ndharmonicfalls
at880MHz,whichiswithinthecellularreceivefrequency
band.
Note: In practice, there are usually numerous interfering frequencies
and harmonics. The net effect can be a series of desensitized receive
channels.
MC5720/5725/8755/8765/8775 Hardware Integration Guide
18 2130114
4
Rev 1.3 Jul.06 19
4: Host/Module Communication
Interface
ThischapterprovidesinformationabouttheHost‐Module
communicationinterface(USBinterface)andlistsofextended
ATcommandsthatmaybeusefulforhardwareintegration
testing.
Note: On any given interface (USB, USIM/RUIM, etc.), leave unused
inputs and outputs as no-connects.
LED output
ThemoduledrivestheLEDoutputaccordingtothePCI‐
ExpressMiniCardspecification(summarizedinTable4‐1,
below).
Table 4-1: LED States
State Indicates Characteristics
OFF Module is not
powered. Light is turned off.
ON Module is powered
and connected, but
not transmitting or
receiving.
Light is turned on.
Slow Blink Module is powered
and searching for a
connection.
LED is flashing at a steady,
slow rate.
•250 ms ± 25% ON period
•0.2 Hz ± 25% blink rate
Intermittent
Blink Module is transmitting
or receiving. LED is flashing
intermittently, proportional to
activity on the interface.
•50% duty cycle
•3 Hz minimum blink rate
•20 Hz maximum blink
rate
MC5720/5725/8755/8765/8775 Hardware Integration Guide
20 2130114
Figure 4-1: Example LED
Current limiting Resistor
LED
VCC 3.3V
MIO
MiniCard
5
Rev 1.3 Jul.06 21
5: Regulatory Information
Important notice
Becauseofthenatureofwirelesscommunications,trans‐
missionandreceptionofdatacanneverbeguaranteed.Data
maybedelayed,corrupted(i.e.,haveerrors)orbetotallylost.
Althoughsignificantdelaysorlossesofdataarerarewhen
wirelessdevicessuchastheSierraWirelessmodemareusedin
anormalmannerwithawell‐constructednetwork,theSierra
Wirelessmodemshouldnotbeusedinsituationswherefailure
totransmitorreceivedatacouldresultindamageofanykind
totheuseroranyotherparty,includingbutnotlimitedto
personalinjury,death,orlossofproperty.SierraWirelessand
itsaffiliatesacceptnoresponsibilityfordamagesofanykind
resultingfromdelaysorerrorsindatatransmittedorreceived
usingtheSierraWirelessmodem,orforfailureoftheSierra
Wirelessmodemtotransmitorreceivesuchdata.
Safety and hazards
DonotoperateyourMC5720/MC5725/MC8755/MC8765/
MC8775modem:
•Inareaswhereblastingisinprogress
•Whereexplosiveatmospheresmaybepresentincluding
refuellingpoints,fueldepots,andchemicalplants
•Nearmedicalequipment
•Nearlifesupportequipment,oranyequipmentwhichmay
besusceptibletoanyformofradiointerference.Insuch
areas,theMC5720/MC5725/MC8755/MC8765/MC8775
modemMUSTBEPOWEREDOFF.Otherwise,the
MC5720/MC5725/MC8755/MC8765/MC8775modemcan
transmitsignalsthatcouldinterferewiththisequipment.
Inanaircraft,theMC5720/MC5725/MC8755/MC8765/MC8775
modemMUSTBEPOWEREDOFF.Otherwise,theMC5720/
MC5725/MC8755/MC8765/MC8775modemcantransmit
signalsthatcouldinterferewithvariousonboardsystemsand
maybedangeroustotheoperationoftheaircraftordisrupt
thecellularnetwork.Useofacellularphoneinanaircraftis
illegalinsomejurisdictions.Failuretoobservethisinstruction
mayleadtosuspensionordenialofcellulartelephoneservices
totheoffender,orlegalactionorboth.
MC5720/5725/8755/8765/8775 Hardware Integration Guide
22 2130114
Someairlinesmaypermittheuseofcellularphoneswhilethe
aircraftisonthegroundandthedoorisopen.TheMC5720/
MC5725/MC8755/MC8765/MC8775modemmaybeused
normallyatthistime.
Important compliance
information for North American
users
TheMC5720/MC5725/MC8755/MC8765/MC8775modemhas
beengrantedmodularapprovalformobileapplications.
IntegratorsmayusetheMC5720/MC5725/MC8755/MC8765/
MC8775modemintheirfinalproductswithoutadditional
FCC/IC(IndustryCanada)certificationiftheymeetthe
followingconditions.Otherwise,additionalFCC/IC
approvalsmustbeobtained.
1. Atleast20cmseparationdistancebetweentheantennaand
theuser’sbodymustbemaintainedatalltimes.
2. TocomplywithFCC/ICregulationslimitingbothmaximum
RFoutputpowerandhumanexposuretoRFradiation,the
maximumantennagainincludingcablelossinamobile‐only
exposureconditionmustnotexceed:
·8dBiintheCellularbandand4dBiinthePCSbandforthe
MC8755/MC8765/MC8775
·4.65dBiintheCellularbandand3.35dBiinthePCSband
fortheMC5720/MC5725
3. TheMC5720/MC5725/MC8755/MC8765/MC8775modem
anditsantennamustnotbeco‐locatedoroperatingin
conjunctionwithanyothertransmitterorantennawithina
hostdevice.
4. Alabelmustbeaffixedtotheoutsideoftheendproductinto
whichtheMC5720/MC5725/MC8755/MC8765/MC8775
modemisincorporated,withastatementsimilartothe
following:
·ForMC5720:
ThisdevicecontainsTXFCCID:N7N‐MC5720
Thisequipmentcontainsequipmentcertifiedunder
IC:2417C‐MC5720
·ForMC5725:
ThisdevicecontainsTXFCCID:N7N‐MC5725
Thisequipmentcontainsequipmentcertifiedunder
IC:2417C‐MC5725
·ForMC8755:
ThisdevicecontainsTXFCCID:N7NMC8755
Thisequipmentcontainsequipmentcertifiedunder
IC:2417C‐MC8755
Regulatory Information
Rev 1.3 Jul.06 23
·ForMC8765:
ThisdevicecontainsTXFCCID:N7NMC8765
Thisequipmentcontainsequipmentcertifiedunder
IC:2417C‐MC8765
·ForMC8775:
ThisdevicecontainsTXFCCID:N7NMC8775
Thisequipmentcontainsequipmentcertifiedunder
IC:2417C‐MC8775
5. Ausermanualwiththeendproductmustclearlyindicatethe
operatingrequirementsandconditionsthatmustbeobserved
toensurecompliancewithcurrentFCC/ICRFexposure
guidelines.
TheendproductwithanembeddedMC5720/MC5725/
MC8755/MC8765/MC8775modemmayalsoneedtopassthe
FCCPart15unintentionalemissiontestingrequirementsand
beproperlyauthorizedperFCCPart15.
Note:Ifthismoduleisintendedforuseinaportabledevice,
youareresponsibleforseparateapprovaltosatisfytheSAR
requirementsofFCCPart2.1093andICRSS‐102.
MC5720/5725/8755/8765/8775 Hardware Integration Guide
24 2130114
A
Rev 1.3 Jul.06 25
A: Acronyms and Definitions
.
Table 5-1: Acronyms and definitions
Acronym or term Definition
AGC Automatic Gain Control
BER Bit Error Rate - a measure of receive sensitivity
BLER Block Error Rate
Call Box Base Station Simulator - Agilent E8285A or 8960, Rohde &
Schwarz CMU200
CDMA Code Division Multiple Access
dB Decibel = 10 x log10 (P1/P2)
P1 is calculated power; P2 is reference power
Decibel = 20 x log10 (V1/V2)
V1 is calculated voltage, V2 is reference voltage
dBm Decibels, relative to 1 mW - Decibel(mW) = 10 x log10 (Pwr (mW)/
1mW)
DUT Device Under Test
EDGE Enhanced Data rates for GSM Evolution
EM Embedded Module
ESD ElectroStatic Discharge
FER Frame Error Rate - a measure of receive sensitivity
GPRS General Packet Radio Service
GPS Global Positioning System
GSM Global System for Mobile communications
Hz Hertz = 1 cycle/second
inrush current Peak current drawn when a device is connected or powered on
IS-2000 3G radio standards for voice and data (CDMA only)
IS-95 2G radio standards targeted for voice (cdmaONE)
LDO Low Drop Out - refers to linear regulator
MC5720 / MC5725 Sierra Wireless MiniCards used on CDMA networks
MC5720/5725/8755/8765/8775 Hardware Integration Guide
26 2130114
MC8755 / MC8765 /
MC8775 Sierra Wireless MiniCards used on GSM networks
MHz MegaHertz = 10E6 Hertz (Hertz = 1 cycle/second)
MIO Module Input/Output
MPE Maximum Permissible Exposure — the level of radiation to which a
person may be exposed without hazardous effect or adverse
biological changes
OTA Over The Air or Radiated through the antenna
PCS Personal Communication System - PCS spans the 1.9 GHz radio
spectrum
RF Radio Frequency
RMS Root Mean Square
RUIM Removable User Identity Module
SA Selective Availability
Sensitivity (Audio) Measure of lowest power signal that the receiver can measure
Sensitivity (RF) Measure of lowest power signal at the receiver input that can
provide a prescribed BER/BLER/SNR value at the receiver output.
SIM Subscriber Identity Module
SNR Signal to Noise Ratio
SOF Start of Frame - a USB function
UART Universal Asynchronous Receiver Transmitter
UDK Universal Development Kit
UMTS Universal Mobile Telecommunications System
USB Universal Serial Bus
USIM Universal Subscriber Identity Module
VCC3.3 3.3 V supply voltage
WCDMA Wideband Code Division Multiple Access — In this document, the
term “UMTS” is used instead of “WCDMA”.
XIM In this document, XIM is used as part of the contact identifiers for
the USIM/RUIM interface (XIM_VCC, XIM_CLK, etc.). It indicates
either RUIM or USIM.
Table 5-1: Acronyms and definitions
Acronym or term Definition
Rev 1.3 Jul.06 27
Index
A
acronymsanddefinitions 25–26
airplanemode 11
antenna
connectionandmountingpoints 14
connectionconsiderations 13
custom,considerations 15
diversityantenna,disabling 16
limit,matchingcoaxialconnections 13
location,considerations 15
matching,considerations 15
maximumcableloss 13
ATcommands
3GPPspecification,details 7
extended,MC5720/5725 7
extended,MC8755/8765/8775 8
lowpowermode,setting 11
C
cableloss
antenna,maximum 13
CnS
MC5720reference,details 7
MC8755/8765/8775reference,details 8
connection
grounding 14
connectors,required
EDGEmating(52‐pin) 6
host‐module 6
RF,Hirose 6
USIM/RUIM 6
current
consumption
usagemodels 11
D
DCS1800
RFparameters,MC8755/8765/8775 13
defaultstate(Normal),module 11
desense.SeeRF
disconnected,modulepowerstate 10
diversityantenna
disabling 16
E
EGSM900
RFparameters,MC8755/8765/8775 13
electrostaticdischarge.SeeESD
ESD
protectionrequirements 9–10
testingtechniquesdocument(IEC‐61000‐4‐2) 7
F
FCC
regulations,relevantsection 7
G
grounding
connectionconsiderations 14
groundloops,avoiding 15
GSM850
RFparameters,MC8755/8765/8775 13
H
Host⁄Moduleinterface 19–20
I
interference
devicegenerated 17
powersupplynoise 16
wirelessdevices 16
L
LED
example 20
state
intermittentblink 19
off 19
on 19
slowblink 19
lowpowermode
setting,ATcommands 11
lowpower,modulepowerstate 11
M
MC5720
CnSreference,details 7
productspecification 7
MC5720/5725
extendedATcommands 7
MC8755/8765
productspecification 7
MC8755/8765/8775
CnSreference,details 8
extendedATcommands 8
RFparameters 13
MC5720/5725/8755/8765/8775 Hardware Integration Guide
28 2130114
MC8775
productspecification 7
minicard
PCIExpressSpecification,details 8
SeealsoMC5720⁄5725;MC8755⁄8765⁄8775
module
powerstates 10–11
module,defaultpowermode(Normal) 11
N
noise
leakage,minimizing 14
RFinterference,powersupply 16
normal,modulepowerstate 11
O
off,modulepowerstate 10
P
PCIExpress
minicardspecificationdetails 8
PCS1900
RFparameters,MC8755/8765/8775 13
power
disconnected,characteristics 10
normal,characteristics 11
off,characteristics 10
signals,overview 9
state,disconnected 10
state,lowpower 11
state,normal 11
state,off 10
states,module 10–11
supply,RFinterference 16
powerinterface 9–12
ProductSpecificationDocument.SeePSD
PSD
MC5720⁄5725,details 7
MC8755/8765,details 7
MC8775,details 7
R
regulatoryinformation
FCC 22
limitationofliability 21
safetyandhazards 21
RF
antennacableloss,maximum 13
antennaconnection,considerations 13
cabletype,required 6
desense
device‐generated 17
integration 13–17
interference
otherdevices 17
powersupply 16
wirelessdevices 16
parameters
DCS1800 13
EGSM900 13
GSM850 13
MC8755/8765/8775 13
PCS1900 13
UMTS1900 13
UMTS2100 13
UMTS850 13
S
shielding
module,compliance 15
SIM.SeeUSIM/RUIM
T
testing
ESDimmunity,techniquesdocument(IEC‐61000‐
4‐2) 7
U
UDK.SeeUniversalDevelopmentKit
UMTS1900
RFparameters,MC8755/8765/8775 13
UMTS2100
RFparameters,MC8755/8765/8775 13
UMTS850
RFparameters,MC8755/8765/8775 13
UniversalDevelopmentKit
components,included 5
UniversalSerialBus.SeeUSB
usagemodels
currentconsumption 11
USB
specification,details 8
USIM/RUIM
connectortype,required 6