Silicon Laboratories Finland BGM111 Blue Gecko BGM111 Bluetooth Smart Module User Manual

Silicon Laboratories Finland Oy Blue Gecko BGM111 Bluetooth Smart Module

Contents

User Manual

Blue Gecko BGM111 Bluetooth® SmartModule Data SheetThe BGM111 is a Bluetooth® Smart module targeted for Bluetooth Smart applicationswhere good RF performance, low power consumption and easy application developmentare key requirements. At +8 dBm TX power BGM111 has best-in-class RF performanceand can provide long range, robust Bluetooth Smart connectivity.The BGM111 integrates all of the necessary elements required for a Bluetooth Smartapplication: Bluetooth radio, software stack and GATT based profiles and it can alsohost end user applications, which means no external microcontroller is required in size,price or power constrained devices. The BGM111 Bluetooth Smart module also hashighly flexible hardware interfaces to connect to different peripherals or sensors.Although the BGM111 Bluetooth Smart Module is targeted at applications requiring highRF performance, it still has ultra-low power consumption and can be operated using astandard 3V coin cell battery.BGM111 can be used in a wide variety of applications:KEY FEATURES• Bluetooth 4.1 Compliant (Bluetooth Smart)• Software upgradable to Bluetooth 4.2• TX power: up to +8 dBm• RX sensitivity: down to -92 dBm• Range: up to 200 meters•CPU core: 32-bit ARM® Cortex-M4• Flash memory: 256 kB• RAM: 32 kB• Autonomous Hardware Crypto Acceleratorand True Random Number Generator• Integrated DC-DC Converter• Health and Fitness• Point-of-Sales• Consumer Electronics• Automotive Aftermarket• Industrial and Home Automation• Otherssilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96
1. Feature ListThe highlighted features are listed below.Bluetooth Features• Bluetooth 4.1 Compliant• Software Upgradable to Bluetooth 4.2• Central and Peripheral Roles• Up to 6 x BLE Connections in Central RoleRadio Features• Integrated Antenna• TX Power (+8 dBm)• RX Sensitivity (-92 dBm)• Up to 200 meters LoS rangeSoftware Features• Integrated Bluetooth Smart Stack• Any GATT based Bluetooth Smart Profile• 100 kbps throughput over BLE•BGAPI™ serial protocol over UART for modem (NCP) usage•BGLIB™ host library which implements BGAPI serial protocol•BGScript™ script and C programming for standalone usage•Profile Toolkit™ for creating GATT based servicesHarware Interfaces• UART host interface• 2 x SPI, UART and 2 x I2C peripheral interfaces• Up to 25 x GPIO with interrupts• 4 x 12-bit ADC and 1 x 12-bit IDAC• Internal temperature sensor• Internal battery voltage measurement option• Clock generator• Real-time counterMCU Features•ARM® Cortex-M4F• 40 MHz• 32 kB RAM• 256 kB Flash• Advanced cryptography supportElectrical Characteristics• Supply voltage: 1.8 V to 3.8 V with DC-DC bypass mode• Supply voltage: 2.4 V to 3.8 V when using DC-DC• 8.7 mA TX current at 0 dBM• 8.8 mA RX current• 63 μA/MHz @ Energy Mode 0• 1.4 μA EM2 deep sleep currentEnvironmental/Regulatory• Temperature range: -40C to +85C• Bluetooth, CE, FCC and IC, Japan and South-Korea qualifiedDimensions• W x L x H: 12.9 mm x 15.0 mm x 2.2 mmBlue Gecko BGM111 Bluetooth® Smart Module Data SheetFeature Listsilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 1
2. Ordering InformationBGM111A256V1 (orderable part number) is the product code for a pre-production (non-certified) version of the Module based on rev A2SoC. This (V1) product code is updated to production version (V2) when the logos of the official CE and FCC certifications are markedinto the Module’s metallic RF shield and the SoC used inside the Module is in mass production. The product code of the productionversion with the certification markings is BGM111A256V2R (1000 pcs cut reel) and BGM111A256V2 (100 pcs cut reel).Note: The only visual difference between pre-production (V1) and production module (V2) versions will be the certification codes prin-ted on the RF shield. Silicon Labs reserves the right to deliver BGM111A256V2R or BGM111A256V2 (production version) for custom-ers ordering BGM111A256V1R or BGM111A256V1. Part Number Description FeaturesBGM111A256V1 BGM111 Bluetooth Smart Mod-ule with internal chip antennaRadio: Bluetooth Smart 4.1, +8 dBm TXCut reel Core: ARM Cortex M4Memory: 32 kB RAM/256 kB flashAntenna: chipPackaging: 100 pcs cut reelStatus: pre-production samplesProduction PN: BGM111A256V2BGM111A256V1R BGM111 Bluetooth Smart Mod-ule with internal chip antennaRadio: Bluetooth Smart 4.1, +8 dBm TXFull reel Core: ARM Cortex M4Memory: 32 kB RAM/256 kB flashAntenna: chipPackaging: 1000 pcs tape and reelStatus: pre-production samplesProduction PN: BGM111A256V2RSLWSTK6101A Blue Gecko Bluetooth SmartModule Wireless DevelopmentKit (WSTK)BGM111 Radio BoardWSTK Main BoardExpansion Board (buttons, leds, accelerometer, joystick)AccessoriesBGM111A256V2 BGM111 Bluetooth Smart Mod-ule with internal chip antennaSee BGM111A256V1Cut reelBGM111A256V2R BGM111 Bluetooth Smart Mod-ule with internal chip antennaSee BGM111A256V1RFull reelSLWSTK6101B Blue Gecko Bluetooth SmartModule Wireless DevelopmentKit (WSTK)BGM111 Radio Board and BGM113 Radio BoardWSTK Main BoardExpansion Board (buttons, leds, accelerometer, joystick)AccessoriesBlue Gecko BGM111 Bluetooth® Smart Module Data SheetOrdering Informationsilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 2
3. InterfacesThis section describes the features and functionalities of the interfaces and peripherals.3.1 USARTThe Universal Synchronous/Asynchronous Receiver/Transmitter is a flexible serial I/O module. It supports full duplex asynchronousUART communication with hardware flow control as well as SPI.If UART is used as BGAPI serial protocol host interface it is strongly recommended to use RTS and CTS signals for reliable data trans-mission.Figure 3.1. USART3.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART)The unique LEUART™ provides two-way UART communication on a strict power budget. Only a 32.768 kHz clock is needed to allowUART communication up to 9600 baud. The LEUART includes all necessary hardware to make asynchronous serial communicationpossible with a minimum of software intervention and energy consumption.3.3 I2CThe I2C module provides an interface between the MCU and a serial I2C bus. It is capable of acting as both a master and a slave.Standard-mode, fast-mode and fast-mode plus speeds are supported, allowing transmission rates from 10 kbit/s up to 1 Mbit/s.Figure 3.2. I2C3.4 Timer/Counter (TIMER)TIMER peripherals count events, generate PWM outputs. The core of each TIMER is a 16-bit counter.Blue Gecko BGM111 Bluetooth® Smart Module Data SheetInterfacessilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 3
3.5 Real Time CounterThe Real Time Counter is a 32-bit counter providing timekeeping in all energy modes and it is capable of providing system wake-up atuser defined instances. The RTCC includes 128 bytes of general purpose data retention, allowing easy and convenient data storage inall energy modes.3.6 Low Energy Timer (LETIMER)The unique LETIMER™ is a 16-bit timer that is available in energy mode EM2 DeepSleep in addition to EM1 Sleep and EM0 Active.This allows it to be used for timing and output generation when most of the device is powered down, allowing simple tasks to be per-formed while the power consumption of the system is kept at an absolute minimum. The LETIMER can be used to output a variety ofwaveforms with minimal software intervention.3.7 Ultra Low Power Wake-Up Timer (CRYOTIMER)The CRYOTIMER is a 32-bit counter that is capable of running in all energy modes. It can be clocked by either the 32.768 kHz crystaloscillator (LFXO), the 32.768 kHz RC oscillator (LFRCO) or the 1 kHz RC oscillator (ULFRCO). It can provide periodic Wakeup eventsand PRS signals which can be used to wake up peripherals from any energy mode. The CRYOTIMER provides a wide range of inter-rupt periods, facilitating flexible ultra-low energy operation.3.8 Pulse Counter (PCNT)The Pulse Counter (PCNT) peripheral can be used for counting pulses on a single input or to decode quadrature encoded inputs.3.9 General Purpose Input/Output (GPIO)BGM111 has 25 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or input. Moreadvanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO pin. TheGPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to severalGPIO pins on the device. The GPIO subsystem supports asynchronous external pin interrupts.When configured as GPIO output drive strength can be applied to pins on port by port basis and it can be either 1 mA or 10 mA.3.10 Analog Comparator (ACMP)The Analog Comparator is used to compare the voltage of two analog inputs, with a digital output indicating which input voltage is high-er. Inputs are selected from among internal references and external pins. The tradeoff between response time and current consumptionis configurable by software. The ACMP can also be used to monitor the supply voltage from software. An interrupt can be generatedwhen the supply falls below or rises above a programmable threshold.3.11 Analog to Digital Converter (ADC)The ADC is a Successive Approximation Register (SAR) architecture, with a resolution of up to 12 bits up to 1 Msamples/sec. The out-put sample resolution is configurable and additional resolution is possible using integrated hardware for averaging over multiple sam-ples. The ADC includes integrated voltage references and an integrated temperature sensor. Inputs are selectable from a wide range ofsource, including pins configurable as either single-ended or differential.3.12 Digital to Analog Current Converter (IDAC)The Digital to Analog Current Converter can source or sink a configurable constant current. This current can be driven on an output pinor routed to the selected ADC input pin for capacitive sensing. The current is programmable between 0.05 μA and 64 μA with severalranges with various step sizes.3.13 Integrated DC-DC Converter (DC-DC)The DC-DC buck converter covers a wide range of load currents and provides high efficiency in energy modes EM0, EM1, EM2 andEM3. The converter operates in active and bypass operating modes. Bypass mode may be entered when the input voltage is too lowfor efficient operation of the DC-DC converter. In Bypass mode, the DC-DC input supply is internally connected directly to its outputthrough a low resistance switch. Bypass mode also supports in-rush current limiting to avoid dipping the input supply due to excessivecurrent transients.Note:• When DC/DC is enabled, supply voltage range is 2.4V to 3.8V.• When DC/DC is disabled, supply voltage range is 1.8V to 3.8V. Blue Gecko BGM111 Bluetooth® Smart Module Data SheetInterfacessilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 4
4. AntennaThis section contain design guidelines and recommendations for the BGM111 antenna.4.1 PCB Design GuidelinesFor optimal performance of the BGM111, please follow the following guidelines:• Place the module at the edge of the PCB as shown in the the figure below.• Do not place any metal (traces, components, battery etc.) within the clearance area of the antenna.• Connect all the GND pins directly to a solid GND plane.• Place the GND vias as close to the GND pins as possible.• Do not place plastic or any other dielectric material in touch with the antenna.Figure 4.1. Recommended Layout for BGM111Blue Gecko BGM111 Bluetooth® Smart Module Data SheetAntennasilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 5
Figure 4.2. Poor Layouts for BGM111Figure 4.3. Impact of the Size of GND Plane to the BGM111 Range4.2 Effect of Plastic and Metal MaterialsDo not place plastic or any other dielectric material in touch with the antenna.Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended dis-tance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCBground planes.4.3 Locating the Module Close to Human BodyNote: Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thusreducing range. Blue Gecko BGM111 Bluetooth® Smart Module Data SheetAntennasilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 6
5. Hardware Design GuidelinesThe BMG111 is an easy-to-use module with regard to hardware application design but certain design guidelines must be followed toguarantee optimal performance. These guidelines are listed in the next sub-sections.5.1 Power Supply RequirementsCoin cell batteries cannot withstand high peak currents (e.g. higher than 15 mA). If the peak current exceeds 15 mA it’s recommendedto place 47 - 100 µF capacitor in parallel with the coin cell battery to improve the battery life time. Notice that the total current consump-tion of your application is a combination of the radio, peripherals and MCU current consumption so you must take all of these into ac-count. BGM111 should be powered by a unipolar supply voltage with nominal value of 3.3 V. Operating voltage range of the module is2.4 - 3.8 V when using the built-in DC/DC converter.External high frequency bypass capacitors are not needed because the module contains the required supply filter capacitors. However,care should be taken to prevent strong switching noise from being superimposed on the supply line. Such noise can be generated e.g.by on-board charge pump converters used in RS232 level shifters. If this type of switching noise is present, a power filter circuit on theVDD input is recommended. Note that there is a total of about 4.8 µF of low ESR ceramic capacitors on the VDD line inside the module.When using low-dropout linear regulators to generate a regulated supply for the VDD line, the stability of the regulator with the low ESRprovided by these capacitors should be checked. Many linear regulators and also some switched mode regulators are not stable whenusing ceramic output capacitors. The datasheet of the regulator typically lists recommendations concerning suitable capacitors includ-ing data on ESR range and/or stability curves. A regulator which is stated “stable with ceramic capacitors” is recommended.5.2 Power Saving FunctionsEM power saving modes are automatically controlled by the firmware and it always enters the lowest possible power save mode possi-ble depending on the radio, peripheral and software activity.5.3 Reset FunctionsThe BGM111 can be reset by three different methods: by pulling the RESET line low, by the internal watchdog timer or software com-mand. The reset state in BGM111 does not provide any power saving functionality and thus is not recommended as a means to con-serve power. BGM111 has an internal system power-up reset function. The RESET pin includes an on-chip pull-up resistor and cantherefore be left unconnected if no external reset switch or source is needed.5.4 Debug and Firmware UpdatesThis section contains information on debug and firmware update methods.5.4.1 JTAGIt is recommended to expose the JTAG debug pins in your own hardware design for firmware update and debug purposes. The follow-ing table lists the required pins for JTAG connection.The debug pins have pull-down and pull-up enabled by default, so leaving them enabled may increase current consumption if left con-nected to supply or ground. If enabling the JTAG pins the module must be power cycled to enable a SWD debug session.Table 5.1. JTAG PadsPAD NAME PAD NUMBER JTAG SIGNAL NAME COMMENTSPF3 24 TDI This pin is disabled after reset. Once enabled the pin has a built-in pull-up.PF2 23 TDO This pin is disabled after resetPF1 22 TMS Pin is enabled after reset and has a built-in pull-upPF0 21 TCK Pin is enabled after reset and has a built-in pull-down5.4.2 DFUIt is also possible to update the firmware over UART using DFU protocol. However the bootloader cannot be updated using DFU butrequires that the firmware is updated using JTAG.Blue Gecko BGM111 Bluetooth® Smart Module Data SheetHardware Design Guidelinessilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 7
6. Bluetooth Stack SoftwareSilicon Labs’ Bluetooth Smart Software is a complete Bluetooth Smart software stack for the BGM111 Bluetooth Smart module. Thesoftware implements a full Bluetooth LE compatible stack and L2CAP, RFCOMM, SMP and ATT protocols along with any GATT basedBluetooth Smart profiles.The Bluetooth Smart Ready Software also is supported by a complete SDK for developing Bluetooth Smart applications using either anexternal host with the BGAPI™ serial protocol over UART or fully standalone applications based on a simple scripting language calledBGScript™.Several profiles and software project examples are offered as part of the Bluetooth Smart SDK to help expedite the development ofBluetooth Smart compatible end-user products.The main parts of the Bluetooth Smart software stack are shown below.Figure 6.1. Bluetooth Smart Ready Software StackNote: To learn more about the Bluetooth Smart software stack, the SDK, and the APIs please read QSG108: Blue Gecko BluetoothSmart Software Quick-Start Guide. Blue Gecko BGM111 Bluetooth® Smart Module Data SheetBluetooth Stack Softwaresilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 8
7. Host InterfaceThis section contains information about the host interface available on the BGM111 module.7.1 UARTThe BGM111 can be controlled over the UART interface as a peripheral to an external processor. In order for the communication to bereliable, hardware flow control signals (RTS and CTS) must be present between the host and the module. For baud rates exceeding115200 kbps the controlling processor should have a clock frequency accurate to within 1% in order for the UART signaling to workreliably.When UART is used as a host interface (network co-processor mode) two optional I/O pins can be used either to wake-up the BGM111from EM2 sleep mode when the host has commands or data to send or alternatively to wake-up the host when the BGM111 has eventsor data to the host.Default UART settings are listed below:Table 7.1. BGM111 UART Interface Default SettingsParameter Default settingUART baud rate 115200 kbsRTS/CTS flow control EnabledData bits 8Parity NoneStop bits 1The figure below shows the recommended layout for connecting BGM111 with an external host.Note: A programming connector as shown in the figure below must be available in the design for BGM111 firmware update. Figure 7.1. Connecting BGM111 with an external hostBlue Gecko BGM111 Bluetooth® Smart Module Data SheetHost Interfacesilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 9
8. Electrical CharacteristicsTable 8.1. Absolute Maximum RatingsParameter Min Max UnitStorage temperature -50 150 °CVDD -0.3 3.8 V5 V tolerant GPIO voltages -0.3 5.251VOther terminal voltages -0.3 VDD+0.3 VNote:1. 5.25 V or VDD + 2 V, whichever is less. Table 8.2. Recommended Operating ConditionsRating Min Max UnitOperating Temperature Range -40 85 °CVDD (when using internal DC/DC) 2.4 3.8 VVDD (when DC/DC is in bypass mode) 1.8 3.8 VVDD (when operating ADC or DAC) 1.8 3.8 VBlue Gecko BGM111 Bluetooth® Smart Module Data SheetElectrical Characteristicssilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 10
Logic Signal CharacteristicsTable 8.3. I/O Terminal Electrical CharacteristicsI/O Terminals Min Typ Max UnitInput voltage levelsVIL input logic level low 1.7 V ≤ VDD ≤ 3.6V-0.3 ─ 0.3VDD VVIH input logic level high 1.7 V ≤ VDD ≤ 3.6V0.7 VDD ─ VDD + 0.3 VOutput Voltage LevelsVOL output logic level low, Vdd = 3.3 V, Iol= 3 mA, weak driver─ ─ 0.2 x VDD VVOH output logic level high Vdd = 3.3 V,Ioh = -3 mA, weak driver0.8 x VDD ─ ─ VVOH output logic level high Vdd = 3.3 V,Ioh = 20 mA, strong driver─ ─ 0.2 x VDD VVOH output logic level high Vdd = 3.3 V,Ioh = -20 mA, strong driver0.8 x VDD ─ ─ VTable 8.4. Reset Signal CharacteristicsPower-on Reset Min Typ Max UnitPower on reset threshold (rising edge) 1.84 1.92 2.00 VPower on reset threshold (falling edge) 1.80 1.88 1.96 VRESET signal pulse width (pulled low) 500 ─ ─ nsTable 8.5. Analog Digital Converter (ADC) CharacteristicsPower-on Reset Min Typ Max UnitADC input impedance ─ 670 ─ kohmADC input voltage range 0 ─ 2 x VREF VResolution (Programmable) 6 ─ 12 bitsSampling Rate ─ ─ 1 MSpsOffset Error ─ 1 ─ LSBDifferential nonlinearity error -1 ─ 1 LSBIntegral nonlinearity error -3 ─ 3 LSBTable 8.6. Current Digital Analog Converter (IDAC) CharacteristicsPower-on Reset Min Typ Max UnitSteps per range ─ 31 ─DAC output current range (range 0) 0.05 ─ 1.6 μADAC output current range (range 1) 1.6 ─ 4.6 μADAC output current range (range 2) 0.5 ─ 16 μABlue Gecko BGM111 Bluetooth® Smart Module Data SheetElectrical Characteristicssilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 11
Power-on Reset Min Typ Max UnitDAC output current range (range 3) 2 ─ 64 μATotal error (continuous mode) -1 ─ 1 %Total error (duty cycle mode) -2 ─ 2 %Settling time to 1% (range changed) ─ ─ 5 μsSettling time to 1% (step changed) ─ ─ 1 μsPower ConsumptionTable 8.7. Typical Power Consumption of Different Operating ModesOperation State Current Unit DescriptionTransmit, +8 dBm, 1 Mbps 26.3 mA Continous packet transmission (averagevalue)Transmit, 0 dBm 8.8 mA Continous packet transmission (averagevalue)Receive 8.7 mA Continous packet receive (average value)Radio off, CPU active TBD µA/MHzRadio off, CPU idle TBD µA/MHzEM2 sleep mode 1.4 µA RTC running, full RAM retentionEM3 sleep mode TBD µAEM4 sleep mode TBD µAShutdown mode TBD µA RTC running, 128B RAM retentionFull shutdown mode TBD µA No RTC, no RAM retentionTable 8.8. Typical Power Consumption in Practical Use CasesOperating Mode Current UnitLE advertising, discoverable TBD µALE connected, master TBD µALE connected, slave TBD µABlue Gecko BGM111 Bluetooth® Smart Module Data SheetElectrical Characteristicssilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 12
9. RF CharacteristicsTable 9.1. Supported Frequencies and ChannelsParameter Min Max UnitFrequency 2402 2480 MHzTable 9.2. Typical Receiver SensitivityPacket type -40 °C 20 °C 85 °C UnitLE TBD -92 TBD dBmTable 9.3. Transmitter Output Power at Maximum SettingModulation type Min Typ Max UnitLE +6.5 +8 +9 dBm9.1 Antenna CharacteristicsTable 9.4. BGM111 Antenna Efficiency and Peak GainParameter With optimal layout NoteEfficiency -2 dB Efficiency and peak gain depend on the application PCB layoutand mechanical designPeak gain +1 dBiBlue Gecko BGM111 Bluetooth® Smart Module Data SheetRF Characteristicssilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 13
9.2 2D Radiation Pattern PlotsFigure 9.1. Typical 2D Radiation Pattern – Front ViewFigure 9.2. Typical 2D Radiation Pattern – Side ViewBlue Gecko BGM111 Bluetooth® Smart Module Data SheetRF Characteristicssilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 14
Figure 9.3. Typical 2D Radiation Pattern – Top ViewBlue Gecko BGM111 Bluetooth® Smart Module Data SheetRF Characteristicssilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 15
10. PinoutThis section contains a description of the BGM111 pin-out. Each pin may have one or more functions which are all listed in tables. Thepin-out is shown in the figure below.Figure 10.1. BGM111 Pinout (Top View)10.1 Power, Ground, and Reset PinsPower supply, ground, and reset signal related pins are listed in the table below.Table 10.1. Power, Ground, and Reset PinsPad Number Function Description29 VDD Module power supply1, 12, 20, 31 GND Ground, connected together internally but should all be connected directly to a solid ground plane with viasin close proximity to the pads, especially on the antenna end.30 RESET Module reset signal. Pulling RESET low will reset the internal processor. This pin has an internal pull-up andcan be left floating if not needed.Blue Gecko BGM111 Bluetooth® Smart Module Data SheetPinoutsilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 16
10.2 GPIO PinsThe 25 GPIO pins of BGM111 module are organized into ports with up to 16 pins each. These GPIO pins can individually be configuredas either an output or input. More advanced configurations like open-drain, open-source, and glitch-filtering can be configured for eachindividual GPIO pin. GPIO pins can also be overridden by peripheral pin connections like TIMER PWM outputs or USART communica-tion, which can be routed to several locations on the device. The GPIO supports up to 16 asynchronous external pin interrupts, whichenable interrupts from any pin on the device. Also, the input value of a pin can be routed through the Peripheral Reflex System to otherperipherals. Except for a few special functions, the internal signal crossbar allows various peripheral functions to be assigned freely toany GPIO pad, simplifying application board layout.Table 10.2. BGM111 GPIO Assignments Related to Functionalities and PeripheralsGPIO AssignmentsPort Name PA PB PC PD PF CommentPort Pin 0 1 2 3 4 5 11 13 6 7 8 9 10 11 13 14 15 0 1 2 3 4 5 6 7Pad Number 5 6 7 8 9 10 11 13 14 15 16 17 18 19 2 3 4 21 22 23 24 25 26 27 28BOOTLOADERBOOT_RX •BOOT_TX •DEBUGDBG_SWCLKTCK •DBG_SWDIOTMS •DBG_SWO • • • •DBG_TDI •DBG_TDO •WAKE UPGPIO_EM4WU0 •GPIO_EM4WU1 •GPIO_EM4WU4 •GPIO_EM4WU8 •GPIO_EM4WU9 •GPIO_EM4WU12 •I2CI2CO_SCL • • • • • • • • • • • • • • • • • • • • • • • • •I2CO_SDA • • • • • • • • • • • • • • • • • • • • • • • • •USART 0 UART SPIUS0_CTS US0_CLK • • • • • • • • • • • • • • • • • • • • • • • • • CTS CLKUS0_RTS US0_CS • • • • • • • • • • • • • • • • • • • • • • • • • RTS CSUS0_RX MISO • • • • • • • • • • • • • • • • • • • • • • • • • RX MISOUS0_TX MOSI • • • • • • • • • • • • • • • • • • • • • • • • • TX MOSIUSART 1 UART SPIUS1_CTS US1_CLK • • • • • • • • • • • • • • • • • • • • • • • • • CTS CLKUS1_RTS US1_CS • • • • • • • • • • • • • • • • • • • • • • • • • RTS CSBlue Gecko BGM111 Bluetooth® Smart Module Data SheetPinoutsilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 17
GPIO AssignmentsPort Name PA PB PC PD PF CommentPort Pin 0 1 2 3 4 5 11 13 6 7 8 9 10 11 13 14 15 0 1 2 3 4 5 6 7Pad Number 5 6 7 8 9 10 11 13 14 15 16 17 18 19 2 3 4 21 22 23 24 25 26 27 28US1_RX MISO • • • • • • • • • • • • • • • • • • • • • • • • • RX MISOUS1_TX MOSI • • • • • • • • • • • • • • • • • • • • • • • • • TX MOSILEUART 0LEU0_RX • • • • • • • • • • • • • • • • • • • • • • • • •LEU0_TX • • • • • • • • • • • • • • • • • • • • • • • • •TIMERTIM0_CC0 • • • • • • • • • • • • • • • • • • • • • • • • •TIM0_CC1 • • • • • • • • • • • • • • • • • • • • • • • • •TIM0_CC2 • • • • • • • • • • • • • • • • • • • • • • • • •TIM0_CDTI0 • • • • • • • • • • • • • • • • • • • • • • • • •TIM0_CDTI1 • • • • • • • • • • • • • • • • • • • • • • • • •TIM0_CDTI2 • • • • • • • • • • • • • • • • • • • • • • • • •TIM1_CC0 • • • • • • • • • • • • • • • • • • • • • • • • •TIM1_CC1 • • • • • • • • • • • • • • • • • • • • • • • • •TIM1_CC2 • • • • • • • • • • • • • • • • • • • • • • • • •TIM1_CC3 • • • • • • • • • • • • • • • • • • • • • • • • •LOW ENERGY TIMERLETIM0_OUT0 • • • • • • • • • • • • • • • • • • • • • • • • •LETIM0_OUT1 • • • • • • • • • • • • • • • • • • • • • • • • •ACMP01X • • • • • • •1Y • • • • • • •2X • • • • • • •2Y • • • • • • •3X • • • •3Y • • • • • • •4X • • • • • • •4Y • • • •ACMP 11X • • • • • • •1Y • • • • • • •2X • • • • • • •2Y • • • • • • •3X • • • •Blue Gecko BGM111 Bluetooth® Smart Module Data SheetPinoutsilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 18
GPIO AssignmentsPort Name PA PB PC PD PF CommentPort Pin 0 1 2 3 4 5 11 13 6 7 8 9 10 11 13 14 15 0 1 2 3 4 5 6 7Pad Number 5 6 7 8 9 10 11 13 14 15 16 17 18 19 2 3 4 21 22 23 24 25 26 27 283Y • • • • • • •4X • • • • • • •4Y • • • • ENDADC01X • • • • • • •1Y • • • • • • •2X • • • • • • •2Y • • • • • • •3X • • • •3Y • • • • • • •4X • • • • • • •4Y • • • •IDAC01X • • • •1Y • • • • • • •PULSE COUNTERPCNT0_S0IN • • • • • • • • • • • • • • • • • • • • • • • • •PCNT0_S1IN • • • • • • • • • • • • • • • • • • • • • • • • •CLOCK MANAGEMENTCMU_CLK0 • • • • • •CMU_CLK1 • • • • • •Blue Gecko BGM111 Bluetooth® Smart Module Data SheetPinoutsilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 19
11. Physical DimensionsFigure 11.1. Module Physical DimensionsFigure 11.2. Module Recommended PCB Pad PatternBlue Gecko BGM111 Bluetooth® Smart Module Data SheetPhysical Dimensionssilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 20
Figure 11.3. Module Side View DimensionsBlue Gecko BGM111 Bluetooth® Smart Module Data SheetPhysical Dimensionssilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 21
12. Soldering RecommendationsThe BGM111 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the ther-mal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the data-sheet of particular solder paste for profile configurations.The following recommendations for soldering the module to ensure reliable solder joint and operation of the module after soldering.Since the profile used is process and layout dependent, the optimum profile should be studied case by case. Thus following recommen-dation should be taken as a starting point guide.• Refer to technical documentations of particular solder paste for profile configurations• Avoid using more than one flow.• Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of 150 μm stencilthickness is recommended.• Aperture size of the stencil should be 1:1 with the pad size.• A low residue, “no clean” solder paste should be used due to low mounted height of the component.• If the vias used on the application board have a diameter larger than 0.3 mm, it is recommended to mask them at the module side toprevent solder wicking through the via holes. Solders have a tendency to fill holes and leave voids in the thermal pad solder junction,as well as form solder balls on the other side of the application board which can in some cases be problematic.Blue Gecko BGM111 Bluetooth® Smart Module Data SheetSoldering Recommendationssilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 22
13. CertificationsNote: Some of the certifications for the BGM111 Bluetooth Smart Module are pending.13.1 DisclaimerBluetooth specification and CE power spectral density requirements limit the absolute maximum TXP of Bluetooth LE devices to 10dBm in all conditions. In FCC SAR testing is not required in any end product installation if the TXP is lower than 9 mW. In order to becompliant with these regulations in all conditions, BGM111 has been certified with nominal 8 dBm TXP. Manipulation of the TXP tohigher values than 8 dBm is not allowed.13.2 BluetoothBluetooth qualifications for the BGM111 Bluetooth Smart Module are pending.13.3 CEThe BGM111 Bluetooth Smart Module is in conformity with the essential requirements and other relevant requirements of the R&TTEDirective (1999/5/EC). This device is compliant with the following standards:• Safety: EN 60950• EMC: EN 301 489• Spectrum: EN 300 328A formal DoC is available from www.silabs.com.13.4 FCCThis device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:1. This device may not cause harmful interference, and2. This device must accept any interference received, including interference that may cause undesirable operation.Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment.FCC RF Radiation Exposure Statement:This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specif-ic operating instructions for satisfying RF exposure compliance. This transmitter meets both portable and mobile limits as demonstratedin the RF Exposure Analysis. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitterexcept in accordance with FCC multi-transmitter product procedures. As long as the above condition is met, further transmitter testingwill not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance require-ments required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).OEM Responsibilities to comply with FCC RegulationsThe BGM111 Bluetooth Smart Module has been certified for integration into products only by OEM integrators under the following con-dition:• The antenna(s) must be installed such that a minimum separation distance of 0 mm is maintained between the radiator (antenna)and all persons at all times.• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accord-ance with FCC multi-transmitter product procedures.Blue Gecko BGM111 Bluetooth® Smart Module Data SheetCertificationssilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 23
As long as the conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsiblefor testing their end-product for any additional compliance requirements required with this module installed (for example, digital deviceemissions, PC peripheral requirements, etc.).Note:In the event that this condition cannot be met (for certain configurations or co-location with another transmitter), then the FCC authori-zation is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integratorwill be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product LabelingThe BGM111 Bluetooth Smart Module is labeled with its own FCC ID. If the FCC ID is not visible when the module is installed insideanother device, then the outside of the device into which the module is installed must also display a label referring to the enclosedmodule. In that case, the final end product must be labeled in a visible area with the following:"Contains Transmitter Module FCC ID: QOQBGM111"or"Contains FCC ID: QOQBGM111"The OEM integrator must not provide information to the end user regarding how to install or remove this RF module or change RFrelated parameters in the user manual of the end product.Blue Gecko BGM111 Bluetooth® Smart Module Data SheetCertificationssilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 24
13.5 ICIC (English)This radio transmitter has been approved by Industry Canada to operate with the embedded chip antenna. Other antenna types arestrictly prohibited for use with this device.This device complies with Industry Canada’s license-exempt RSS standards. Operation is subject to the following two conditions:1. This device may not cause interference; and2. This device must accept any interference, including interference that may cause undesired operation of the device.RF Exposure StatementException from routine SAR evaluation limits are given in RSS-102 Issue 5. BGM111 Bluetooth Smart Module meets the given require-ments when the minimum separation distance to human body is 15 mm. RF exposure or SAR evaluation is not required when the sepa-ration distance is 15 mm or more. If the separation distance is less than 15 mm the OEM integrator is responsible for evaluating theSAR.OEM Responsibilities to comply with IC RegulationsThe BGM111 Bluetooth Smart Module has been certified for integration into products only by OEM integrators under the following con-ditions:• The antenna(s) must be installed such that a minimum separation distance of 15 mm is maintained between the radiator (antenna)and all persons at all times.• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter.As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still respon-sible for testing their end-product for any additional compliance requirements required with this module installed (for example, digitaldevice emissions, PC peripheral requirements, etc.).Note: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the ICauthorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integra-tor will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate IC authorization. End Product LabelingThe BGM111 Bluetooth Smart module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside anotherdevice, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. Inthat case, the final end product must be labeled in a visible area with the following:"Contains Transmitter Module IC: 5123A-BGM111"or"Contains IC: 5123A-BGM111"The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module orchange RF related parameters in the user manual of the end product.IC (Francais)Cet émetteur radio (IC : 5123A-BGM111) a reçu l'approbation d'Industrie Canada pour une exploitation avec l'antenne puce incorporée.Il est strictement interdit d'utiliser d'autres types d'antenne avec cet appareil.Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation estautorisée aux deux conditions suivantes:1. L’appareil ne doit pas produire de brouillage;2. L’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettrele fonctionnement.Déclaration relative à l'exposition aux radiofréquences (RF)Les limites applicables à l’exemption de l’évaluation courante du DAS sont énoncées dans le CNR 102, 5e édition. L'appareil BGM111répond aux exigences données quand la distance de séparation minimum par rapport au corps humain est inférieure ou égale à 15mm. L'évaluation de l'exposition aux RF ou du DAS n'est pas requise quand la distance de séparation est de 15 mm ou plus. Si ladistance de séparation est inférieure à 15 mm, il incombe à l'intégrateur FEO d'évaluer le DAS.Responsabilités du FEO ayant trait à la conformité avec les règlements ICBlue Gecko BGM111 Bluetooth® Smart Module Data SheetCertificationssilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 25
Le module BGM111 a été certifié pour une intégration dans des produits uniquement par les intégrateurs FEO dans les conditions sui-vantes:• La ou les antennes doivent être installées de telle façon qu'une distance de séparation minimum de 15 mm soit maintenue entre leradiateur (antenne) et toute personne à tout moment.• Le module émetteur ne doit pas être installé au même endroit ou fonctionner conjointement avec toute autre antenne ou émetteur.Dès lors que les deux conditions ci-dessus sont respectées, d'autres tests de l'émetteur ne sont pas obligatoires. Cependant, il in-combe toujours à l'intégrateur FEO de tester la conformité de son produit final vis-à-vis de toute exigence supplémentaire avec ce mod-ule installé (par exemple, émissions de dispositifs numériques, exigences relatives aux matériels périphériques PC, etc).Note: S'il s'avère que ces conditions ne peuvent être respectées (pour certaines configurations ou la colocation avec un autre émet-teur), alors l'autorisation IC n'est plus considérée comme valide et l'identifiant IC ne peut plus être employé sur le produit final. Dansces circonstances, l'intégrateur FEO aura la responsabilité de réévaluer le produit final (y compris l'émetteur) et d'obtenir une autorisa-tion IC distincte. Étiquetage du produit finalL'étiquette du module BGM111 porte son propre identifiant IC. Si l'identifiant IC n'est pas visible quand le module est installé à l'intér-ieur d'un autre appareil, l'extérieur de l'appareil dans lequel le module est installé doit aussi porter une étiquette faisant référence aumodule qu'il contient. Dans ce cas, une étiquette comportant les informations suivantes doit être collée sur une partie visible du produitfinal."Contient le module émetteur IC: 5123A-BGM111"or"Contient IC : 5123A-BGM111"L'intégrateur FEO doit être conscient de ne pas fournir d'informations à l'utilisateur final permettant d'installer ou de retirer ce moduleRF ou de changer les paramètres liés aux RF dans le mode d'emploi du produit final.13.6 MIC JapanThe certification of BGM111 Bluetooth Smart Module in Japan is pending.Certification number: TBD.Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their hostequipment can place the certification mark and certification number (the same marking/number as depicted on the label of the radiomodule) on the outside of the host equipment. The certification mark and certification number must be placed close to the text in theJapanese language which is provided below. This change in the Radio Law has been made in order to enable users of the combinationof host and radio module to verify if they are actually using a radio device which is approved for use in Japan.Figure 13.1. Text to be placed on the housing of the end-user deviceTranslation of the text in the figure above:“This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification underthe Radio Law.”13.7 KC South-KoreaThe certification of BGM111 Bluetooth Smart Module in South-Korea is pending.Certification number: TBD.Blue Gecko BGM111 Bluetooth® Smart Module Data SheetCertificationssilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 26
14. Revision HistoryRevision 0.96February 10th, 2016• Ordering information updated• FCC and IC codes corrected.Revision 0.95January 28th, 2016• Certification status updated.• Current consumption figures added.• New block diagram.Revision 0.94• Disclaimer section added to Certificates main section.• Technical specification tables TBD values edited partially.Revision 0.93• Added a schematics to show connection principle with external host.Revision 0.92• Corrected supply voltage range.Revision 0.91• Style Changes.Revision 0.90• Preliminary.Blue Gecko BGM111 Bluetooth® Smart Module Data SheetRevision Historysilabs.com | Smart. Connected. Energy-friendly. Rev. 0.96 | 27
Table of Contents1. Feature List ................................12. Ordering Information ............................23. Interfaces.................................33.1 USART ................................33.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART) ...........33.3 I2C .................................33.4 Timer/Counter (TIMER) ..........................33.5 Real Time Counter ............................43.6 Low Energy Timer (LETIMER) ........................43.7 Ultra Low Power Wake-Up Timer (CRYOTIMER) ..................43.8 Pulse Counter (PCNT) ...........................43.9 General Purpose Input/Output (GPIO)......................43.10 Analog Comparator (ACMP) ........................43.11 Analog to Digital Converter (ADC).......................43.12 Digital to Analog Current Converter (IDAC) ...................43.13 Integrated DC-DC Converter (DC-DC) .....................44. Antenna .................................54.1 PCB Design Guidelines ..........................54.2 Effect of Plastic and Metal Materials ......................64.3 Locating the Module Close to Human Body ....................65. Hardware Design Guidelines .........................75.1 Power Supply Requirements .........................75.2 Power Saving Functions ..........................75.3 Reset Functions .............................75.4 Debug and Firmware Updates ........................75.4.1 JTAG ................................75.4.2 DFU ................................76. Bluetooth Stack Software...........................87. Host Interface ...............................97.1 UART ................................98. Electrical Characteristics .......................... 109. RF Characteristics ............................ 139.1 Antenna Characteristics ..........................139.2 2D Radiation Pattern Plots .........................1410. Pinout ................................ 1610.1 Power, Ground, and Reset Pins .......................16Table of Contents 28
10.2 GPIO Pins ..............................1711. Physical Dimensions ........................... 2012. Soldering Recommendations ........................ 2213. Certifications .............................. 2313.1 Disclaimer...............................2313.2 Bluetooth ...............................2313.3 CE .................................2313.4 FCC.................................2313.5 IC .................................2513.6 MIC Japan ..............................2613.7 KC South-Korea.............................2614. Revision History............................. 27Table of Contents 29
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