Silicon Laboratories Finland EM35XA ETRX35x Series Zigbee Modules User Manual TG ETRX35x PM 010 102 trac

Telegesis

TG-ETRX35X-PM-010-102

ETRX351 and ETRX357 Product Manual

ETRX35x ZIGBEE

®

MODULES

PRODUCT MANUAL

ETRX351 and ETRX357

Table of Contents

1 INTRODUCTION ................................................................................................................. 5

1.1 Hardware Description ....................................................................................................... 5

2 PRODUCT APPROVALS ................................................................................................... 6

2.1 FCC Approvals ................................................................................................................. 6

2.1.1 FCC Labelling Requirements ........................................................................................... 6

2.2 IC (Industry Canada) Approvals ....................................................................................... 7

2.3 European Certification (ETSI)........................................................................................... 7

2.4 ICASA Approvals ............................................................................................................. 8

2.5 Australia and New Zealand (C-Tick) ................................................................................. 8

2.6 Declarations of Conformity ............................................................................................... 8

2.7 IEEE 802.15.4 .................................................................................................................. 8

2.8 The ZigBee® Protocol ...................................................................................................... 8

3 MODULE PINOUT .............................................................................................................. 9

4 HARDWARE DESCRIPTION ............................................................................................ 11

4.1 Hardware Interface ......................................................................................................... 11

5 FIRMWARE DESCRIPTION ............................................................................................. 12

5.1 Custom Firmware ........................................................................................................... 12

5.2 Software Interface .......................................................................................................... 13

6 ABSOLUTE MAXIMUM RATINGS ................................................................................... 14

6.1 Environmental Characteristics ........................................................................................ 14

6.2 Recommended Operating Conditions............................................................................. 14

7 DC ELECTRICAL CHARACTERISTICS ........................................................................... 15

8 DIGITAL I/O SPECIFICATIONS ....................................................................................... 17

9 A/D CONVERTER CHARACTERISTICS .......................................................................... 18

10 AC ELECTRICAL CHARACTERISTICS ........................................................................... 18

10.1 TX Power Characteristics ............................................................................................... 20

11 PHYSICAL DIMENSIONS ................................................................................................. 22

12 SOLDERING TEMPERATURE PROFILE (FOR REFLOW SOLDERING) ........................ 23

12.1 For Leaded Solder ......................................................................................................... 23

12.2 For Lead-free Solder ...................................................................................................... 23

13 PRODUCT LABEL DRAWING ......................................................................................... 24

14 RECOMMENDED FOOTPRINT ........................................................................................ 25

14.1 Example carrier board .................................................................................................... 26

15 RELIABILITY TESTS ........................................................................................................ 27

16 APPLICATION NOTES ..................................................................................................... 27

ETRX351 and ETRX357

16.1 Safety Precautions ......................................................................................................... 27

16.2 Design Engineering Notes .............................................................................................. 27

16.3 Storage Conditions ......................................................................................................... 28

17 PACKAGING .................................................................................................................... 28

17.1 Embossed Tape ............................................................................................................. 28

17.2 Component Orientation .................................................................................................. 29

17.3 Reel Dimensions ............................................................................................................ 29

17.4 Packaging ...................................................................................................................... 29

18 ORDERING INFORMATION ............................................................................................. 30

19 DISCLAIMER .................................................................................................................... 31

20 ROHS DECLARATION ..................................................................................................... 31

21 DATA SHEET STATUS .................................................................................................... 31

22 LIFE SUPPORT POLICY .................................................................................................. 31

23 RELATED DOCUMENTS ................................................................................................. 32

24 CONTACT INFORMATION ............................................................................................... 32

ETRX351 and ETRX357

The Telegesis ETRX351 and ETRX357 modules are low power

2.4GHz ZigBee modules, based on the latest Ember EM351

and EM357 single chip ZigBee

TM

solutions.

These 3

rd

generation modules have been designed to be

integrated into any device without the need for RF experience

and expertise. Utilizing the EmberZNet ZigBee stack, the

ETRX35x enables you to add powerful wireless networking

capability to your products and quickly bring them to market.

The module’s unique AT-style command line interface allows

designers to quickly integrate ZigBee technology without

complex software engineering. For custom application

development the ETRX35x series integrates with ease into

Ember’s InSight development environment.

Image not shown actual size; enlarged to show detail.

Module Features

• Small form factor, SMT module 25mm x 19mm

• Side Castellations for easy soldering and optical

inspection

• 2 antenna options: Integrated chip antenna or U.FL

coaxial connector

• Industry’s first ARM® Cortex-M3 based family of ZigBee

modules

• Industry standard JTAG Programming and real time

network level debugging via the Ember InSight Port

• 192kB (ETRX357) and 128kB (ETRX351) flash and

12kbytes of RAM

• Lowest Deep Sleep Current of sub 1µA and multiple

sleep modes

• Wide supply voltage range (2.1 to 3.6V)

• Optional 32.768kHz watch crystal can be added

externally

• Module ships with standard Telegesis AT-style

command interface based on the ZigBee PRO feature

set

• Can act as an End Device, Router or Coordinator

• 24 general-purpose I/O lines including analogue inputs

(all GPIOs of the EM35x are accessible)

• Firmware upgrades via serial port or over the air

(password protected)

• Hardware supported encryption (AES-128)

• CE, FCC and IC compliance, FCC modular approval

• Operating temperature range: -40

°

C to +85

°

C

• Long range version with a link budget of up to 124dB

available in the same form factor

Radio Features

• Based on the Ember EM351 or EM357 single chip

ZigBee

solutions

• 2.4GHz ISM Band

• 250kbit/s over the air data rate

• 16 channels (IEEE802.15.4 Channel 11 to 26)

• +3dBm output power ( +8dBm in boost mode)

• High sensitivity of -100dBm (-102dBm in boost mode)

typically @ 1% packet error rate

• RX Current: 26mA, TX Current: 31mA at 3dBm

• Robust Wi-Fi and Bluetooth coexistence

Suggested Applications

• AMR – ZigBee Smart Energy applications

• Wireless Alarms and Security

• Home/Building Automation

• Wireless Sensor Networks

• M2M Industrial Controls

• Lighting and ventilation control

• Remote monitoring

• Environmental monitoring and control

Development Kit

• New Development kit containing everything required to

set up a mesh network quickly and evaluate range and

performance of the ETRX35x and its long-range

version.

• AT-style software interface command dictionary can be

modified for high volume customers.

• Custom software development available upon request.

Example AT

-

Style Commands

AT+BCAST Send a Broadcast

AT+UCAST:<address> Send a Unicast

AT+EN Establish PAN network

AT+JN Join PAN

At power-up the last configuration is loaded from non-

volatile S-Registers, which can eliminate the need for an

additional host controller.

ETRX351 and ETRX357

1 Introduction

This document describes the Telegesis ETRX351 and ETRX357 ZigBee

®

modules which have

been designed to be easily integrated into another device and to provide a fast, simple and low

cost wireless mesh networking interface.

The Telegesis ETRX3 series modules are based on the Ember ZigBee

®

platform consisting of the

single chip EM351 or EM357 combined with the ZigBee

®

PRO compliant EmberZNet meshing

stack. Integration into a wide range of applications is made easy using a simple AT style

command interface and advanced hardware design.

The configurable functionality of the Telegesis AT Commandset often allows the ETRX3 series

ZigBee

®

modules to be used without an additional host microcontroller saving even more

integration time and costs. In addition to the Telegesis AT Commandset, the ETRX351 and

ETRX357 modules can be used with custom-built firmware whilst representing an ideal platform for

custom firmware development in conjunction with the Ember development kits.

No RF experience or expertise is required to add this powerful wireless networking capability to

your products. The ETRX351 and ETRX357 offer fast integration opportunities and the shortest

possible time to market for your product.

1.1 Hardware Description

The main building blocks of the ETRX351 and ETRX357 are the single chip EM351 and EM357

SoCs from Ember, a 24MHz reference crystal and RF front-end circuitry optimized for best RF

performance. The modules are available with on-board antenna or alternatively a U.FL coaxial

connector for attaching external antennae. Modules with the U.FL connector are identified by the

“HR” suffix.

The integrated antenna is an Antenova Rufa, and details of the radiation pattern etc are available

from the Antenova website [5].

Module

Chip

Flash

RAM

ETRX351

EM351

128kB

12kB

ETRX351HR

EM351

128kB

12kB

ETRX357 EM357 192kB 12kB

ETRX357HR

EM357

19

2

kB

12kB

Table 1: Memories

The ETRX351 and ETRX357 are used for ZigBee

®

(www.zigbee.org) applications. If you wish to

create your own custom firmware, and not use the pre-loaded Telegesis AT-Command interface,

you will need the Ember InSight toolchain, consisting of InSight Desktop™ together with a

comprehensive integrated development environment (IDE). The Ember development environment

is currently not suitable for developing an IEEE802.15.4-only application that does not use the

ZigBee

®

layer.

ETRX351 and ETRX357

2 Product Approvals

The ETRX351 and ETRX357 as well as the ETRX351HR and ETRX357HR have been designed to

meet all national regulations for world-wide use. In particular the following certifications have been

obtained:

2.1 FCC Approvals

The Telegesis ETRX351 and ETRX357 with integrated Antenna as well as the ETRX351HR and

the ETRX357HR including the antennae listed in Table 2: Approved Antennae

have been tested to comply with FCC CFR Part 15 (USA) The devices meet the requirements for

modular transmitter approval as detailed in the FCC public notice DA00.1407.transmitter. FCC

statement:

This device complies with Part 15 of the FCC rules. Operation is subject to the following

two conditions: (1) this device may not cause harmful interference, and (2) this device must

accept any interference received, including interference that may cause undesired

operation.

Item

Part No.

Manufacturer

Type

Gain

1 BT-Stubby EAD Ltd. [6] ¼ Wave 0dBi

2

WH

-

2400

-

U2.5

Wellhope Wireless

[7

]

½ Wave

2.5dBi

Table 2: Approved Antennae

While the applicant for a device into which the ETRX351 (ETRX357) or ETRX351HR

(ETRX357HR) with an antenna listed in Table 2 is installed is not required to obtain a new

authorization for the module, this does not preclude the possibility that some other form of

authorization or testing may be required for the end product.

The FCC requires the user to be notified that any changes or modifications made to this device

that are not expressly approved by Telegesis (UK) Ltd. may void the user's authority to operate the

equipment.

When using the ETRX351HR and ETRX357HR with approved antennae, it is required to prevent

end-users from replacing them with non-approved ones.

2.1.1 FCC Labelling Requirements

When integrating the ETRX351, ETRX357, ETRX351HR or ETRX357HR into a product it must be

ensured that the FCC labelling requirements are met. This includes a clearly visible label on the

outside of the finished product specifying the Telegesis FCC identifier (FCC ID: S4GEM35XA) as

well as the FCC notice shown on the previous page. This exterior label can use wording such as

“Contains Transmitter Module FCC ID: S4GEM35XA” or “Contains FCC ID:S4GEM35XA”

although any similar wording that expresses the same meaning may be used.

FCC ID

:

S4GEM35XA

ETRX351 and ETRX357

2.2 IC (Industry Canada) Approvals

The Telegesis ETRX351 and ETRX357 with integrated Antenna as well as the ETRX351HR and

the ETRX357HR including the antennae listed in Table 2: Approved Antennae

have been tested to comply with IC.

IC-ID: 8735A-EM35XA

The labelling requirements for Industry Cannada are similar to those of the FCC. Again a clearly

visibly lable must be placed on the outside of the finished product stating something like “Contains

Transmitter Module, IC: 8735A-EM35XA”, although any similar wording that expresses the same

meaning may be used.

The integrator is responsible for the final product to comply to IC ICES-003 and FCC Part 15, Sub.

B – Unintentional Radiators.

2.3 European Certification (ETSI)

The ETRX351, ETRX357, ETRX351HR and ETRX357HR have been certified to the following

standards:

• Radio: EN 300 328:V1.7.1

• EMC: EN 301 489-17:V2.1.1

• Safety: EN 60950-1:2005 (Ed. 2.0)

•

For this purpose the ETRX351HR and ETRX357HR have been tested with the antennae listed in

Table 2: Approved Antennae

.

If the ETRX351, ETRX357, ETRX351HR or ETRX357HR module is incorporated into an OEM

product, the OEM product manufacturer must ensure compliance of the final product to the

European Harmonised EMC, and low voltage/safety standards. A Declaration of Conformity must

be issued for each of these standards and kept on file as described in Annex II of the R&TTE

Directive. The final product must not exceed the specified power ratings, antenna specifications

and installation requirements as specified in this user manual. If any of these specifications are

exceeded in the final product then a submission must be made to a notified body for compliance

testing to all of the required standards.

The ‘CE’ marking must be applied to a visible location on any OEM product. For more information

please refer to http://ec.europa.eu/enterprise/faq/ce-mark.htm. Customers assume full

responsibility for learning and meeting the required guidelines for each country in their distribution

market.

ETRX351 and ETRX357

2.4 ICASA Approvals

The ETRX351, ETRX357, ETRX351HR and ETRX357HR have been certified to be used in South

Africa.

2.5 Australia and New Zealand (C-Tick)

The ETRX351, ETRX357, ETRX351HR and ETRX357HR have been certified to be used in

Australia and new Zealand.

2.6 Declarations of Conformity

Telegesis (UK) Ltd has issued Declarations of Conformity for all ETRX3 series ZigBee® RF

Modules, which cover Radio Emissions, EMC and Safety. These documents are available from our

website or on request.

2.7 IEEE 802.15.4

IEEE 802.15.4 is a standard for low data-rate, wireless networks (raw bit-rate within a radio packet

of 250kbps @2.4GHz) which focuses on low cost, low duty cycle, long primary battery life

applications as well as mains-powered applications. It is the basis for the open ZigBee

®

Protocol.

2.8 The ZigBee® Protocol

The ZigBee

®

Protocol is a set of standards for wireless connectivity for use between any devices

over short to medium distances. The specification was originally ratified in December 2004, paving

the way for companies to start making low-power networks a reality.

ZigBee

®

uses the IEEE 802.15.4 radio specification running on the 2.4GHz band, plus three

additional layers for networking, security and applications. What makes the specification unique is

its use of a mesh network architecture which, in bucket chain style, passes data from one node to

the next until it lands at its destination. The network is self-healing and adapts its routing as link

quality changes or nodes move. Furthermore, nodes can be defined as End Devices which do not

act as routers, but can therefore be put into a low-power sleep state.

The enhanced version of the ZigBee

®

standard (or ZigBee

®

2006) was released in December

2006, adding new features and improvements to the only global wireless communication standard

enabling the development of easily deployable low-cost, low-power, monitoring and control

products for homes, commercial buildings and industrial plant monitoring. In 2007 the ZigBee

Alliance introduced the PRO featureset which offers advantages over earlier versions, including

• Truly self healing mesh networking

• Messages can now travel up to 30 hops

• Source-Routing for improved point to multipoint message transmission

• Improved security including Trust-Centre link keys

• New message types and options

The Telegesis AT Commandset, which by default ships on all ETRX3 series products is based on

the ZigBee

®

PRO featureset. For more information on the Telegesis AT Commandset please refer

to the separate documentation at www.telegesis.com.

ETRX351 and ETRX357

3 Module Pinout

Figure 1: ETRX3 series Module Pinout (top view)

The table below gives details about the pin assignment for direct SMD soldering of the ETRX3

series modules to the application board. For more information on the alternate functions please

refer to [2]. Also refer to the Telegesis AT Commandset documentation and the Telegesis

development kit documentation to understand how the pre-programmed firmware makes use of the

individual I/Os.

All GND pads are connected within the module, but for best RF performance all of them should be

grounded externally ideally to a ground plane.

ETRX35x

Pad

N

ame

EM35x Pin

Default use

Alternate Functions

1 GND GND GND

2 PC5 {1} 11 TX_ACTIVE

3 PC6 13 O/P OSC32B, nTX_ACTIVE

4 PC7 14 O/P OSC32A, OSC32_EXT

5 PA7 {5} 18 O/P TIM1C4

6 PB3 {2,3} 19 O/P, CTS SC1nCTS, SC1SCLK, TIM2C3

7 nReset 12 nReset

8 PB4 {2,3} 20 O/P, RTS TIM2C4, SC1nRTS, SC1nSSEL

9 PA0 21 O/P TIM2C1, SC2MOSI

10 PA1 22 O/P TIM2C3, SC2SDA, SC2MISO

11 PA2 24 O/P TIM2C4, SC2SCL, SC2SCLK

12 PA3 25 O/P SC2nSSEL, TRACECLK, TIM2C2

13 GND GND GND

14 PA4 26 O/P ADC4, PTI_EN, TRACEDATA

15 PA5 {4} 27 O/P ADC5, PTI_DATA, nBOOTMODE, TRACEDATA3

16 PA6 {5} 29 O/P TIM1C3

17 PB1 {3} 30 TXD SC1MISO, SC1MOSI, SC1SDA, SC1TXD, TIM2C1

18 PB2 {3} 31 RXD SC1MISO, SC1MOSI, SC1SCL, SC1RXD, TIM2C2

19 GND GND GND

ETRX351 and ETRX357

ETRX35x

Pad

N

ame

EM35x Pin

Default use

Alternate Functions

20 GND GND GND

21 JTCK 32 SWCLK

22 PC2 33 O/P JTDO, SWO

23 PC3 34 O/P JTDI

24 PC4 35 O/P JTMS, SWDIO

25 PB0 36 I/P, IRQ VREF, IRQA, TRACECLK, TIM1CLK, TIM2MSK

26 PC1 38 ADC ADC3, SWO, TRACEDATA0

27 PC0 {5} 40 O/P JRST, IRQD, TRACEDATA1

28 PB7 {5} 41 ADC ADC2, IRQC, TIM1C2

29 PB6 {5} 42 ADC ADC1, IRQB, TIM1C1

30 PB5 43 ADC ADC0, TIM2CLK, TIM1MSK

31 GND GND GND

32 Vcc Vcc Vcc

33 GND GND GND

Table 3: Pin Information

Notes:

{1} When the alternate function is selected, TX_ACTIVE becomes an output that indicates that the

EM35x radio circuit is in transmit mode. PC5 is not usable on the long range version of the

ETRX35x as this GPIO is used internally as TX_ACTIVE to control the external RF frontend.

{2} The serial UART connections TXD, RXD, CTS and RTS are PB1, PB2, PB3 and PB4 respectively

{3} When using the Telegesis AT Commandset, RTS/CTS handshaking is selectable in firmware. See

the AT Command Manual.

{4} If PA5 is driven low at power-up or reset the module will boot up in the bootloader

{5} PA6, PA7, PB6, PB7 and PC0 can drive high current (see section 8)

See also the table “Module pads and functions” in the ETRX357 Development Kit Product Manual.

ETRX351 and ETRX357

4 Hardware Description

24MHz

EM35x

I/O

UART

I / O

programming

5

JTAG

V

cc

V

reg

RESET

BALUN

integrated

antenna

U.FL socket

rf

terminal

selection,

filtering and

matching

circuitry

LDO

1V8

1,8Vdc

A/D

LDO

1V25

Figure 2: Hardware Diagram

The ETRX351, ETRX351HR, ETRX357 and ETRX357HR are based on the Ember EM351 and

EM357 respectively. The EM351 and EM357 are fully integrated 2.4GHz ZigBee transceivers with

a 32-bit ARM

®

Cortex M3

TM

microprocessor, flash and RAM memory, and peripherals.

The industry standard serial wire and JTAG programming and debugging interfaces together with

the standard ARM system debug components help to streamline any custom software

development.

In addition to this a number of MAC functions are also implemented in hardware to help

maintaining the strict timing requirements imposed by the ZigBee and IEEE802.15.4 standards.

The new advanced power management features allow faster wakeup from sleep and new power

down modes allowing this 3

rd

generation module to offer a longer battery life than any 2

nd

generation modules on the market.

The EM35x has fully integrated voltage regulators for both required 1.8V and 1.25V supply

voltages. The voltages are monitored (brown-out detection) and the built in power-on-reset circuit

eliminates the need for any external monitoring circuitry. An optional 32.768 kHz watch crystal can

be connected externally to pads 3 and 4 in case more accurate timing is required. To utilize the

external watch crystal custom firmware is required.

4.1 Hardware Interface

All GPIO pins of the EM351 or EM357 are accessible on the module’s pads. Whether signals are

used as general purpose I/Os, or assigned to a peripheral function like ADC is set by the firmware.

When using the Telegesis AT Commandset please refer to the AT Commandset manual and the

development kit manual for this information and when developing custom firmware please refer to

the EM35x datasheet [2].

ETRX351 and ETRX357

5 Firmware Description

The modules will be pre-loaded with a standalone bootloader which supports over-the-air

bootloading as well as serial bootloading of new firmware.

In order to enter the standalone bootloader using a hardware trigger pull PA5 to ground and

power-cycle or reset the module. To avoid entering the standalone bootloader unintentionally

make sure not to pull this pin down during boot-up unless the resistance to ground is >10kΩ. (A

pull-up is not required).

In addition to the standalone bootloader the modules also contain the current release of the

Telegesis AT-style command interface as described in the Telegesis AT command dictionary and

the Telegesis user guide. Check www.telegesis.com for updates. Each module comes with a

unique 64-bit 802.15.4 identifier which is stored in non-volatile memory. The commands and

responses pass through the serial port of the ETRX35x as ASCII text, so a simple terminal

application will usually suffice. We provide Telegesis Terminal for interaction with the module but it

is not an essential feature.

The pre-loaded AT-style command interface firmware is based on the latest EmberZNet meshing

stack which implements routers/coordinators as well as (sleepy) end devices. [End devices have

no routing responsibility and therefore are allowed to go to sleep, whilst still being able to send and

receive messages via a parent router. In addition to classical sleepy and non-sleepy end devices

the module firmware also supports mobile (sleepy) end devices capable of changing their parent

quickly whenever they change their position within the network.]

A router is typically a mains powered device whilst a sleepy end device (SED) can be battery

powered.

The module is also able to act as a coordinator and Trust Centre through external host control.

The AT style command line supplies all the tools required to set up and manage a ZigBee network

by allowing easy access to the low-level functionality of the stack.

The Telegesis firmware uses the meshing and self healing EmberZNet PRO stack to overcome

many of the limitations of the tree network topology of the ZigBee® 2006 stack by using the ZigBee

PRO featureset.

The Telegesis firmware allows low-level access to physical parameters such as channel and

power level. Parameters that define the functionality of the ETRX35x module and also allow

standalone functionality are saved in non-volatile memory organised in so-called S-Registers. The

SPI and I2C buses are not supported by the current firmware release, but can be used with custom

firmware.

5.1 Custom Firmware

For high volume customers the firmware can be customised on request. In addition to this the

ETRX3 series of modules is an ideal platform for developing custom firmware. In order to develop

custom firmware the Ember Insight toolchain is required.

ETRX351 and ETRX357

5.2 Software Interface

Using the default firmware the ETRX35x is controlled using a simple AT-style command interface

and (mostly) non-volatile S-Registers. In order to get a full listing of all the available AT-

Commands, please refer to the AT command dictionary document which corresponds to the

firmware revision you intend to use.

In addition to the command dictionary there are user guides explaining the features of the firmware

in more detail. If you need to find out which firmware resides on your module simply type “ATI”

followed by a carriage return and you will be prompted with the module’s manufacturing

information.

The Development Kit manual describes how to upgrade the firmware either via a serial link or over

the air.

ETRX351 and ETRX357

6 Absolute Maximum Ratings

No.

Item

Symbol

Absolute Maximum Ratings

Unit

1 Supply voltage V

CC

-0.3 to +3.6 Vdc

2 Voltage on any Pad V

in

-0.3 to V

CC

+0.3 Vdc

3

Voltage on any

Pad

pin (PA4, PA5, PB5,

PB6, PB7, PC1), when used as an input

to the general purpose ADC with the

low voltage range selected

V

in

-0.3 to +2.0 Vdc

4 Storage temperature range T

stg

-40 to +105 °C

5 Operating temperature range T

op

-40 to +85 °C

6 Input RF level P

max

15 dBm

8 Reflow temperature T

Death

Please refer to chapter 12 °C

Table 4: Absolute Maximum Ratings

The absolute maximum ratings given above should under no circumstances be violated.

Exceeding one or more of the limiting values may cause permanent damage to the device.

Caution! ESD sensitive device. Precautions should be used when handling the device

in order to prevent permanent damage.

6.1 Environmental Characteristics

No

.

Item

Symbol

Absolute Maximum Ratings

Unit

1 ESD on any pad according to

Human Body Model (HBM) circuit

description V

THHBM

±2 kV

2 ESD on non-RF pads according to

Charged Device Model (CDM) circuit

description V

THCDM

±400 V

3 ESD on RF terminal according to

Charged Device Model (CDM) circuit

description

V

THCDM

±225 V

4 Moisture Sensitivity Level MSL MSL3

Table 5: Absolute Maximum Ratings

6.2 Recommended Operating Conditions

No.

Item

Condition /

Remark Symbol Value Unit

Min

Typ

Max

1 Supply voltage V

CC

2.1 3.6 Vdc

2 RF Input Frequency f

C

2405 2480 MHz

3 RF Input Power p

IN

0 dBm

4 Operating temperature

range T

op

-40 +85 °C

Table 6: Recommended Operating Conditions

ETRX351 and ETRX357

7 DC Electrical Characteristics

V

CC

= 3.0V, T

AMB

= 25°C, NORMAL MODE (non-Boost) unless otherwise s tated

No.

Item

Condition /

Remark Symbol Value Unit

Min

Typ

Max

1 Module supply voltage V

CC

2.1 3.6 Vdc

Deep Sleep Current

2 Quiescent current,

internal RC oscillator

disabled I

SLEEP

0.4 µA

3 Quiescent current,

internal RC oscillator

enabled I

SLEEP

0.7 µA

4 Quiescent current,

including

32.768kHz oscillator I

SLEEP

1.0 µA

5

Quiescent current

including internal RC

oscillator and 32.768kHz

oscillator

I

SLEEP

1,3 µA

Reset Current

6 Quiescent current NReset

asserted I

RESET

1.2 2.0 mA

Processor and Peripheral Currents

7 ARM

®

Cortex

TM

M3, RAM

and flash memory 25°C, 12MHz

Core clock I

MCU

6.0 mA

8 ARM

®

Cortex

TM

M3, RAM

and flash memory 25°C, 24MHz

Core clock I

MCU

7.5 mA

9 ARM

®

Cortex

TM

M3, RAM

and flash memory sleep

current

25°C, 12MHz

Core clock I

MCU

3.0 mA

10 ARM

®

Cortex

TM

M3, RAM

and flash memory sleep

current

25°C, 6MHz Core

clock I

MCU

2.0 mA

11 Serial controller current Per serial

controller at max.

clock rate I

SC

0.2 mA

12 General purpose timer

current Per timer at max.

clock rate I

TIM

0.25 mA

13 General purpose ADC

current Max. Sample rate,

DMA I

ADC

1.1 mA

RX Current

14 Radio receiver MAC and

Baseband ARM

®

Cortex

TM

M3 sleeping. I

RX

22 mA

15 Receive current

consumption Total, 12MHz

clock speed I

RX

25 mA

16 Receive current

consumption Total, 24MHz

clock speed I

RX

26.5 mA

17 Receive current

consumption

BOOST MODE

Total, 12MHz

clock speed I

RX

27 mA

18 Receive current

consumption

BOOST MODE

Total, 24MHz

clock speed I

RX

28.5 mA

TX Current

19 Transmit current

consumption at +3dBm module

output power I

TXVCC

31 mA

20 Transmit Current

consumption

BOOST MODE

at +8dBm module

output power I

TXVCC

42 mA

ETRX351 and ETRX357

21 Transmit current

consumption at +0dBm module

output power I

TXVCC

28.5 mA

22 Transmit current

consumption at min. module

output power I

TXVCC

23.5 mA

23 Wake time from deep

sleep

From wakeup

event to 1

st

instruction 100 µs

24 Shutdown time From last

instruction into

deep sleep 5 µs

Table 7: DC Electrical Characteristics

Please Note: The average current consumption during operation is dependent on the firmware

and the network load, therefore these figures are provided in the command dictionary of the

respective firmware.

ETRX351 and ETRX357

8 Digital I/O Specifications

The digital I/Os of the ETRX35x module

V

CC

= 3.0V, T

AMB

= 25°C, NORMAL MODE unless otherwise stated

No.

Item

Condition /

Remark Symbol Value Unit

Min

Typ

Max

1 Low Schmitt switching

threshold

Schmitt input

threshold going

from high to low V

SWIL

0.42 x V

CC

0.5 x V

CC

Vdc

2 High Schmitt switching

threshold

Schmitt input

threshold going

from low to high V

SWIH

0.62 x V

CC

0.8 x V

CC

MHz

3 Input current for logic 0 I

IL

-0.5 µA

4 Input current for logic 1 I

IH

0.5 µA

5 Input Pull-up resistor

value R

IPU

24 29 34 kΩ

6 Input Pull-down resistor

value R

IPD

24 29 34 kΩ

7 Output voltage for logic 0 I

OL

= 4mA (8mA) for

standard (high

current) pads V

OL

0 0.18 x V

CC

V

8 Output voltage for logic 1 I

OH

= 4mA (8mA)for

standard (high

current) pads V

OH

0.82 x V

CC

V

CC

V

9 Output Source Current Standard current

pad I

OHS

4 mA

10 Output Sink current Standard current

pad I

OLS

4 mA

11 Output Source Current High current pad I

OHH

8 mA

12 Output Sink current High current pad I

OLH

8 mA

13 Total output current I

OH

+ I

OL

40 mA

Table 8. Digital I/O Specifications

ETRX351 and ETRX357

9 A/D Converter Characteristics

The ADC is a first-order sigma-delta converter. For additional information on the ADC please refer

to section 10 of the EM35x datasheet.

No.

Item

1 A/D resolution Up to 12 bits

2 A/D sample time for 5-bit conversion 5.33µs

3 A/D sample time for 12-bit conversion 682µs

4 Reference Voltage 1.25V or Vcc

Table 9. A/D Converter Characteristics

10 AC Electrical Characteristics

V

CC

= 3.0V, T

AMB

= 25°C, NORMAL MODE measured at 50 Ω terminal load connected to the U.FL socket

No.

Receiver

Value

Unit

Min

Typ

Max

1 Frequency range 2400 2500 MHz

2 Sensitivity for 1% Packet Error Rate (PER) -100 -94 dBm

3 Sensitivity for 1% Packet Error Rate (PER) BOOST MODE -102 -96 dBm

4 Saturation (maximum input level for correct operation) 0 dBm

5 High-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 35 dB

6 Low-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 35 dB

7 2

nd

High-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 46

8 2

nd

Low-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 46

9 Channel Rejection for all other channels

(1% PER and desired signal –82dBm acc. to [1]) 40 dB

10 802.11g rejection centred at +12MHz or –13MHz

(1% PER and desired signal –82dBm acc. to [1]) 36 dB

11 Co-channel rejection

(1% PER and desired signal –82dBm acc. to [1]) -6 dBc

12 Relative frequency error

(2x40ppm required by [1]) -120 120 ppm

13 Relative timing error

(2x40ppm required by [1]) -120 120 ppm

14 Linear RSSI range 40 dB

15 Output power at highest power setting

NORMAL MODE

BOOST MODE

0

3

8 dBm

16 Output power at lowest power setting -55 dBm

17 Error vector magnitude as per IEEE802.15.4 5 15 %

18 Carrier frequency error -40 40 ppm

19 PSD mask relative

3.5MHz distance from carrier -20 dB

20 PSD mask absolute

3.5MHz distance from carrier -30 dBm

Table 10. AC Electrical Characteristics

ETRX351 and ETRX357

Please Note: For the relationship between EM35x power settings and module output power

please relate to chapter 10.1 of this document. When developing custom firmware the output

power settings described in this document relate directly to the EM35x power settings accessible

via the Ember stack API.

No.

Synthesiser Characteristics

Limit

Unit

Min

Typ

Max

22 Frequency range 2400 2500

MHz

23 Frequency resolution 11.7 kHz

24 Lock time from off state, with correct VCO DAC settings 100 µs

25 Relock time, channel change or Rx/Tx turnaround 100 µs

26 Phase noise at 100kHz offset -75dBc/Hz

27 Phase noise at 1MHz offset -100dBc/Hz

28 Phase noise at 4MHz offset -108dBc/Hz

29 Phase noise at 10MHz offset -114dBc/Hz

Table 11: Synthesiser Characteristics

No.

Power On Reset (POR) Specifications

Limit

Unit

Min

Typ

Max

30 V

CC

POR release 0.62 0.95 1.2 Vdc

31 V

CC

POR assert 0.45 0.65 0.85 Vdc

Table 12: Power On Reset Specifications

No.

nRES

ET Specifications

Limit

Unit

Min

Typ

Max

32 Reset Filter Time constant 2.1 12 16 µs

33 Reset Pulse width to guarantee a reset 26 µs

34 Reset Pulse width guaranteed not to cause reset 0 1 µs

Table 13: nReset Specifications

ETRX351 and ETRX357

10.1 TX Power Characteristics

The diagrams below show the typical output power and module current in dependency on module

EM35x power setting . Power settings above 3dBm have Boost Mode enabled. Please note that

the output power is independent of the supply voltage as the radio is supplied by an internally

regulated

voltage.

Figure 3: Output Power vs. Power Setting

ETRX351 and ETRX357

Figure 4: Module Current vs. Power Setting

ETRX351 and ETRX357

11 Physical Dimensions

Figure 5: ETRX3 Physical Dimensions

Symbol

Explanation

Typical

Distance

L Length of the module 25.0mm

W Width of the module 19.0mm

H Height of the module 3.8mm

A1 Distance centre of pad PCB edge 0.9mm

A2 Pitch 1.27mm

R1 Keep-out Zone from corner of PCB 17.5mm

R2 Keep-out Zone from corner of PCB 4.1mm

X1 Distance centre of Antenna connector PCB edge 3.8mm

X2 Distance centre of Antenna connector PCB edge 2.8mm

Table 14: ETRX3 Physical Dimensions

For ideal RF performance when using the on-board antenna, the antenna should be located at the

corner of the carrier PCB. There should be no components, tracks or copper planes in the keep-

out area which should be as large as possible. When using the U.FL RF connector the keep-out

area does not have to be obeyed. Note: The modules’ transmit/receive range will depend on the

antenna used and also the housing of the finished product.

ETRX351 and ETRX357

12 Soldering Temperature Profile (for reflow soldering)

12.1 For Leaded Solder

Recommended temperature profile

for reflow soldering

Temp

.[°C]

Time [s]

235°C max.

220 ±5°C

200°C

150 ±10°C

90 ±30s

10

±

1s

30 +20/-10s

Figure 6: Temperature Profile for Leaded Solder

12.2 For Lead-free Solder

Recommended temperature profile

for reflow soldering

Temp

.[°C]

Time [s]

230°C -250°C max.

220°C

150°C – 190°C

90 ±30s

30 +20/-10s

Figure 7: Temperature Profile for Lead-free Solder

Please Note:

Maximum number of reflow cycles: 2

Opposite-side reflow is prohibited due to the module’s weight. (i.e. you must not place the

module on the bottom / underside of your pcb and re-flow).

ETRX351 and ETRX357

13 Product Label Drawing

Figure 8: Product Label

The label dimensions are 14.0mm x 14.0 mm. The label will withstand temperatures and

chemicals used during a typical manufacturing process.

Example imprint

Description

ETRX357HR Module Order code

000001 Indication for the serial number.

090101 Production Date Code in the format YYMMDD, e.g. 090602

01 Indication for batch number

02 Indication for the hardware revision

FCC ID: S4GEM35XA FCC ID code for this product

2D-Barcode

Information in the Datamatrix 2D-Barcode are the serial number [6 characters], the Part-Order

code [12 characters], identifier for the batch number [2 characters], the identifier for the

hardware release [2 characters] and the production date code in the format Year-Month-Day

[6 characters], separated by a semicolon.

Table 15: ETRX3xx Label Details

ETRX351 and ETRX357

14 Recommended Footprint

In order to surface mount an ETRX3 series module, we recommend that you use pads which are

1mm wide and 1.2mm high. You must retain the keep-out zone shown in section 12, and ensure

that this keep-out area is free of components, copper tracks and/or copper planes/layers.

You must also ensure that there is no exposed copper on your layout which may contact with the

backside of the ETRX3 series module.

For best RF performance it is required to provide good ground connections to the ground pads of

the module. It is recommended to use multiple vias between each ground pad and a solid ground

plane to minimize inductivity in the ground path.

Figure 9: Recommended Footprint

The land pattern dimensions above serve as a guideline.

We recommend that you use the same pad dimensions for the solder paste screen as you have for

the copper pads. However these sizes and shapes may need to be varied depending on your

soldering processes and your individual production standards. We recommend a paste screen

thickness of 120µm to 150µm.

Although the undersides of the ETRX3 series modules are fully coated, no exposed copper, such

as uncovered through-hole vias, planes or tracks on your board component layer, should be

located below the ETRX3 series module in order to avoid ‘shorts’. All ETRX3 series modules use

a multilayer PCB containing an inner RF shielding ground plane, therefore there is no need to have

an additional copper plane directly under the ETRX3 series module.

ETRX351 and ETRX357

14.1 Example carrier board

Since the RF performance of the module with the on board antenna is strongly dependent on the

proper location of the module on its carrier board, Figure 10 shows the reference carrier board

which was used during testing by Telegesis.

Figure 10. Reference Board

For best performance it is recommended to locate the antenna towards the corner of the carrier

board and to respect the recommended keep-out areas as described in section 11.

Finally to provide a good reference ground to the on board antenna, the carrier board should have

a ground plane spanning no less than 40 x 40mm. In many cases a smaller ground plane will

suffice, but degradation in radio performance could be the result.

ETRX351 and ETRX357

15 Reliability Tests

The measurements below have been conducted on random samples out of mass production and

passed after the module has been exposed to standard room temperature and humidity for 1 hour.

No

Item

Limit

Condition

1 Vibration test Electrical parameter should be

in specification

a) Freq.:10~50Hz,Amplitude:1.5mm

a) 20min. / cycle,1hrs. each of XYZ axis

b) Freq.:30~100Hz, 6G

b) 20min. / cycle,1hrs. each of XYZ axis

2 Shock test the same as the above Dropped onto hard wood from height of

50cm for 3 times

3 Heat cycle test the same as the above -40°C for 30min. and +85°C for 30min.;

each temperature 300 cycles

4 Moisture test the same as the above +60°C, 90% RH, 300h

5 Low temp. test the same as the above -40°C, 300h

6 High temp. test the same as the above +85°C, 300h

Table 16: Reliability Tests

16 Application Notes

16.1 Safety Precautions

These specifications are intended to preserve the quality assurance of products as individual

components.

Before use, check and evaluate the module’s operation when mounted on your products.

Abide by these specifications when using the products. These products may short-circuit. If

electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a

short circuit occurs, then provide the following failsafe functions as a minimum:

(1) Ensure the safety of the whole system by installing a protection circuit and a protection

device.

(2) Ensure the safety of the whole system by installing a redundant circuit or another

system to prevent a single fault causing an unsafe status.

16.2 Design Engineering Notes

(1) Heat is the major cause of shortening the life of the modules. Avoid assembly and use

of the target equipment in conditions where the product’s temperature may exceed the

maximum allowable.

(2) Failure to do so may result in degrading of the product’s functions and damage to the

product.

(3) If pulses or other transient loads (a large load applied in a short time) are applied to the

products, before use, check and evaluate their operation when assembled onto your

products.

(4) These products are not intended for other uses, other than under the special conditions

shown below. Before using these products under such special conditions, check their

ETRX351 and ETRX357

performance and reliability under the said special conditions carefully, to determine

whether or not they can be used in such a manner.

(5) In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where

liquid may splash.

(6) In direct sunlight, outdoors, or in a dusty environment

(7) In an environment where condensation occurs.

(8) In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2,

SO2, H2S, NH3, and NOx)

(9) If an abnormal voltage is applied due to a problem occurring in other components or

circuits, replace these products with new products because they may not be able to

provide normal performance even if their electronic characteristics and appearances

appear satisfactory.

(10) Mechanical stress during assembly of the board and operation has to be avoided.

(11) Pressing on parts of the metal cover or fastening objects to the metal cover is not

permitted.

16.3 Storage Conditions

(1) The module must not be stressed mechanically during storage.

(2) Do not store these products in the following conditions or the performance

characteristics of the product, such as RF performance, may well be adversely

affected:

(3) Storage in salty air or in an environment with a high concentration of corrosive gas,

such as Cl2, H2S, NH3, SO2, or NOX

(4) Storage in direct sunlight

(5) Storage in an environment where the temperature may be outside the range of 5°C to

35°C range, or where the humidity may be outside th e 45 to 85% range.

(6) Storage (before assembly of the end product) of the modules for more than one year

after the date of delivery at your company even if all the above conditions (1) to (3)

have been met, should be avoided.

17 Packaging

17.1 Embossed Tape

(1) Dimension of the tape

t.b.d.

ETRX351 and ETRX357

(2) Cover tape peel force

Force direction

Speed = 300mm/min.

Cover tape peel force

=0.098～0.68N (10～70g)

θ= 10deg

(3) Empty pockets

Empty pockets

more

Components

Empty pockets

Top cover

tape

Direction of

feed

g

NB: Empty pockets in the populated area will be less than two per reel and those empty pockets

will not be consecutive.

17.2 Component Orientation

Top cover tape will not obstruct the carrier tape holes and will not extend beyond the edges

of the carrier tape

(top view)

Component Orientation

Part No.

Direction

17.3 Reel Dimensions

(4) Quantity per reel: 600 pieces

(5) Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code will be on

the reel

t.b.d.

17.4 Packaging

(6) Each reel will be packed in a hermetically-sealed bag

(7) Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code

ETRX351 and ETRX357

18 Ordering Information

Ordering/Product Code

Description

ETRX

351

ETRX357

Telegesis Wireless Mesh Networking Module with Ember

ZigBee

®

Technology:

• Based on Ember EM351 or EM357

• Telegesis AT Style Command Interpreter based on

• EmberZNet meshing and self-healing ZigBee

®

PRO

stack

•

Integrated 2.4GHz Antenna

ETRX351

HR

ETRX357HR

Telegesis Wireless Mesh Networking Module with Ember

ZigBee

®

Technology:

• Based on Ember EM351 or EM357

• Telegesis AT Style Command Interpreter based on

• EmberZNet meshing and self-healing ZigBee

®

PRO

stack

• U.FL coaxial Antenna Connector

ETRX3

DVK

Telegesis Development Kit with:

• 3 x ETRX35xDV Development Boards

• 3 x USB cables

• 2 x ETRX35x on carrier boards

• 2 x ETRX35xHR on carrier boards

• 2 x ETRX35x-LR on carrier boards

• 2 x ETRX35xHR-LR on carrier boards

• 1 x ETRX2USB USB stick

• 2 x ½-wave antennae

• 2 x ¼-wave antennae

Notes:

• Customers’ PO’s must state the Ordering/Product Code.

• There is no “blank” version of the ETRX35x modules available. All Modules are pre-

programmed with the Telegesis AT style command interpreter based on the EmberZNet

stack. (In case it is desired to program custom firmware the pre-programmed firmware can

simply be overwritten

).

ETRX351 and ETRX357

19 Disclaimer

Product and company names and logos referenced may either be trademarks or registered

trademarks of their respective companies. We reserve the right to make modifications and/or

improvements without prior notification. All information is correct at time of issue. Telegesis (UK)

Ltd does not convey any license under its patent rights or assume any responsibility for the use of

the described product

20 RoHS Declaration

Declaration of environmental compatibility for supplied products:

Hereby we declare based on the declaration of our suppliers that this product does not contain the

following substances which are banned by Directive 2002/95/EC (RoHS) or if they do, contain a

maximum concentration of 0,1% by weight in homogeneous materials for:

• Lead and lead compounds

• Mercury and mercury compounds

• Chromium (VI)

• PBB (polybrominated biphenyl) category

• PBDE (polybrominated biphenyl ether) category

And a maximum concentration of 0.01% by weight in homogeneous materials for:

• Cadmium and cadmium compounds

21 Data Sheet Status

Telegesis (UK) Ltd. reserves the right to change the specification without notice, in order to

improve the design and supply the best possible product. Please consult the most recently issued

data sheet before initiating or completing a design.

22 Life Support Policy

This product is not designed for use in life support appliances, devices, or systems where

malfunction can reasonably be expected to result in a significant personal injury to the user, or as a

critical component in any life support device or system whose failure to perform can be reasonably

expected to cause the failure of the life support device or system, or to affect its safety or

effectiveness. Customers using or selling these products for use in such applications do so at their

own risk and agree to fully indemnify Telegesis (UK) Ltd. for any damages resulting.

ETRX351 and ETRX357

23 Related Documents

[1] IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical

Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-

WPANs)

[2] Datasheet EM35x, Ember. (www.ember.com)

[3] Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors -

Low Profile 1.9mm or 2.4mm Mated Height

[4] The ZigBee® specification (www.zigbee.org)

[5] Specification for Antenova Rufa Antenna (www.antenova.com)

[6] Embedded Antenna design Ltd. (EAD Ltd.) (www.ead-ltd.com)

[7] Wellhope Communication Equipment (www.wellhope-wireless.com)

24 Contact Information

Website: www.telegesis.com

E-mail sales@telegesis.com

Telegesis (UK) Limited

Abbey Barn Business Centre

Abbey Barn Lane

High Wycombe

Bucks

HP10 9QQ

UK

Tel: +44 (0)1494 510199

Fax: +44 (0)5603 436999

Silicon Laboratories Finland EM35XA ETRX35x Series Zigbee Modules User Manual TG ETRX35x PM 010 102 trac

Telegesis (UK) Ltd ETRX35x Series Zigbee Modules TG ETRX35x PM 010 102 trac

manual

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