Silicon Laboratories Finland WT32I Bluetooth Audio Module User Manual Product Data Sheet

Silicon Laboratories Finland Oy Bluetooth Audio Module Product Data Sheet

Data Sheet

WT32i BLUETOOTH AUDIO MODULE PRELIMINARY DATA SHEET Monday, 11 November 2013 Version 0.2
Bluegiga Technologies Oy Copyright © 2000-2013 Bluegiga Technologies All rights reserved. Bluegiga Technologies assumes no responsibility for any errors which may appear in this manual. Furthermore, Bluegiga Technologies reserves the right to alter the hardware, software, and/or specifications detailed here at any time without notice and does not make any commitment to update the information contained here. Bluegiga’s products are not authorized for use as critical components in life support devices or systems. The WRAP is a registered trademark of Bluegiga Technologies The Bluetooth trademark is owned by the Bluetooth SIG Inc., USA and is licensed to Bluegiga Technologies. All other trademarks listed herein are owned by their respective owners.
Bluegiga Technologies Oy VERSION HISTORY VERSION COMMENT 0.1 Draft 0.2 Updated product codes and contact info
Bluegiga Technologies Oy TABLE OF CONTENTS 1 WT32i Product Numbering ........................................................................................................................... 7 2 Block diagram ............................................................................................................................................... 8 3 Pinout and Terminal Description .................................................................................................................. 9 4 Electrical Characteristics ............................................................................................................................ 12 4.1 Absolute Maximum Ratings ................................................................................................................ 12 4.2 Recommended Operating Conditions ................................................................................................. 12 4.3 Digital Terminals.................................................................................................................................. 12 4.4 Audio Characteristics .......................................................................................................................... 13 4.4.1 ADC .............................................................................................................................................. 13 4.4.2 DAC .............................................................................................................................................. 13 4.4.3 A2DP Codecs............................................................................................................................... 14 4.5 RF Characteristics ............................................................................................................................... 16 4.5.1 RF Transceiver ............................................................................................................................ 16 4.5.2 Antenna Characteristics ............................................................................................................... 17 4.6 Current Consumption .......................................................................................................................... 20 5 Power Control and Regulation ................................................................................................................... 21 5.1 Reset ................................................................................................................................................... 23 5.1.1 Internal POR ................................................................................................................................ 24 6 Battery Charger .......................................................................................................................................... 26 7 GPIO and AIO Functions ............................................................................................................................ 27 7.1 iWRAP supported GPIO Functions ..................................................................................................... 27 7.2 Wi-Fi Co-existence Signals ................................................................................................................. 27 7.3 Outputting Internal Clocks ................................................................................................................... 29 7.4 Auxiliary ADC ...................................................................................................................................... 29 7.5 Software I2C Interface ........................................................................................................................ 29 8 Serial Interfaces .......................................................................................................................................... 30 8.1 UART Interface .................................................................................................................................... 30 8.1.1 Resetting Through UART Break Signal ....................................................................................... 31 8.1.2 UART Configuration While Reset is Active .................................................................................. 31 8.1.3 UART Bypass Mode .................................................................................................................... 31 8.2 USB Interface ...................................................................................................................................... 31 8.3 Programming and Debug Interface (SPI) ............................................................................................ 33 9 Audio Interfaces .......................................................................................................................................... 34 9.1 Stereo Audio Codec Interface ............................................................................................................. 34 9.1.1 ADC .............................................................................................................................................. 34 9.1.2 DAC .............................................................................................................................................. 36 9.1.3 Microphone Input ......................................................................................................................... 37
Bluegiga Technologies Oy 9.1.4 Line Input ..................................................................................................................................... 38 9.1.5 Output Stage ................................................................................................................................ 39 9.1.6 Mono Operation ........................................................................................................................... 41 9.1.7 Side Tone ..................................................................................................................................... 41 9.2 PCM Interface ..................................................................................................................................... 41 9.3 I2S Interface ........................................................................................................................................ 41 9.4 IEC 60958 Interface ............................................................................................................................ 43 10 Design Guidelines ................................................................................................................................... 45 10.1 Audio Layout Guide ..................................................................................................................... 45 10.1.1 EMC Considerations .................................................................................................................... 45 10.1.2 Choosing Capacitors and Resistors ............................................................................................ 45 10.2 RF Layout Guide .......................................................................................................................... 46 10.3 Example Application Schematics ................................................................................................. 49 11 Physical Dimensions ............................................................................................................................... 53 12 Soldering Recommendations .................................................................................................................. 55 13 Package .................................................................................................................................................. 56 14 Certification Guidance for an End Product Using WT32i........................................................................ 58 14.1 Bluetooth End Product Listing ...................................................................................................... 58 14.2 CE Approval of an End-Product ................................................................................................... 58 14.3 FCC Certification of an End Product ............................................................................................ 59 14.3.1 Co-location with Other Transmitters ............................................................................................ 60 14.4 IC Certification of an End Product ............................................................................................... 60 14.5 MIC Japan Certification of an End Product .................................................................................. 60 15 WT32i Certifications ................................................................................................................................ 60 15.1 Bluetooth ...................................................................................................................................... 60 15.2 CE ................................................................................................................................................ 60 15.3 FCC .............................................................................................................................................. 61 15.4 IC .................................................................................................................................................. 62 15.4.1 IC .................................................................................................................................................. 62 15.5 MIC Japan .................................................................................................................................... 63 15.6 KCC (South Korea) ...................................................................................................................... 63 15.7 Qualified Antenna Types for WT32i-E ......................................................................................... 63 16 Contact Information................................................................................................................................. 64
Bluegiga Technologies Oy WT32i Bluetooth® Audio Module DESCRIPTION WT32i is the latest generation of Bluetooth modules. It provides highest level of integration with integrated 2.4GHz radio, DSP, battery charger, stereo codec, and antenna ready to hit mono and stereo audio applications. WT32i is also ready to support the latest Bluetooth 3.0 standard. The embedded DSP core allows enhancement of the product with features such as advanced audio decoding (MP3, AAC, AAC+, aptX®), echo cancellation, noise reduction, and data manipulation. Bluegiga’s flexible iWRAP firmware enables device manufacturers to easily add wireless, secure, and standard-based Bluetooth connectivity into new or existing applications with very limited development and manufacturing effort. WT32i is qualified as a Bluetooth Controller Subsystem. Combining with iWRAP Host Subsystem it makes a complete Bluetooth End Product without any additional Bluetooth qualifications. WT32i has FCC, IC, MIC Japan and KCC modular certification and it is fully tested for CE minimizing the certification costs for the end product. APPLICATIONS:  High quality wireless stereo headsets  Wireless speakers  Hands-free car kits KEY FEATURES:  Plug n’ Play Bluetooth Solution for Mono and Stereo Audio Solutions  Integrated DSP, Stereo Codec, and Battery Charger  Integrated Antenna and W.FL Connector  Bluetooth 3.0 Compliant  Bluetooth, CE, FCC, IC, KCC and MIC Japan Qualified  Class 1 - Range up to 100 Meters  Temperature range from -40C to +85C  Low Power Consumption  iWRAP™ Firmware for Controlling Connections and Configuring Settings  Supported Bluetooth Profiles: A2DP, AVRCP, HFP, HFP-AG, SPP, OPP, FTP, HSP, DUN, PBAP and HID
Bluegiga Technologies Oy 1 WT32i Product Numbering WT32i-A-AI Product series Fimrware AI5 = iWRAP 5.0.2 C = custom HW version A = Chip antenna, industrial temperature range E = W.FL connector, industrial temperature range
Bluegiga Technologies Oy 2 Block diagram RAMBaseband DSPMCUKalimba DSP2.4 GHz RadioI/OBC05-MMXTAL Balanced filtter Antenna FlashUART/USB PIOAudio In/OutPCM/I2SSPIReset circuitry Figure 1: Block Diagram of WT32i BC05-MM The BlueCore®5-Multimedia External is a single-chip radio and baseband IC for Bluetooth 2.4GHz systems. It provides a fully compliant Bluetooth v3.0 specification system for data and voice. BlueCore5-Multimedia External contains the Kalimba DSP coprocessor with double the MIPS of BlueCore3-Multimedia External, supporting enhanced audio applications. XTAL Ther reference clock of WT32i is generated with 26 MHz crystal. All BC05-MM internal digital clocks are generated using a phase locked loop, which is locked to the frequency of either the 26 MHz crystal or an internally generated watchdog clock frequency of 1kHz. RESET CIRCUITRY The internal reset circuitry keeps BC05-MM in reset during boot in order for the supply voltages to stabilize. This is to prevent corruption of the flash memory during booting. Please see chapter 5.1 for more detailed description. BALANCED FILTER The internal balanced filter provides optimal impedance matching and band pass filtering in order to achieve lowest possible in-band and out-of-band emissions. ANTENNA The antenna is a ceramic chip antenna with high efficiency. The antenna is insensitive to surrounding dielectric materials and requires only a small clearance underneath which makes it compatible with previous WT32I designs and well suitable for designs with high density. FLASH 16 Mbit flash memory is used for storing the Bluetooth protocol stack and Virtual Machine applications. It can also be used as an optional external RAM for memory-intensive applications.
Bluegiga Technologies Oy Page 9 of 64 3 Pinout and Terminal Description AUDIO_OUT_N_LEFTAUDIO_OUT_P_LEFTAUDIO_OUT_P_RIGHTAUDIO_OUT_N_RIGHTGNDAUDIO_IN_N_LEFTAUDIO_IN_P_LEFTGNDAUDIO_IN_N_RIGHTAUDIO_IN_P_RIGHTMIC_BIASGNDVDD_CHGVDD_BATLED0SPI_MOSISPI_MISOSPI_CLKSPI_NCSBPCM_CLKPCM_SYNCPCM_OUTPCM_INPIO4PIO5PIO6PIO7PIO8UART_NCTSUART_NRTSRESETGNDVDD_IOUART_TXDUART_RXDPIO10PIO9USB_D+USB_D-PIO3PIO2PIO1PIO0AIO1AIO0GNDGNDGNDVREG_ENA 1234567891011121314151617GND474645444342414039383736353433323150494818192021222324252627282930 Figure 2: WT32i Pin Number Pin Name Pad Type Description 1 VREG_ENA Input SW configurable enable pin for the internal regulators 2-3, 18, 31, 39, 43, 48 GND GND GND 17 VDD_IO Power supply 1.7V - 3.6V power supply for the serial interfaces and GPIOs 37 VDD_BAT Power supply / Charger output 2.7V - 4.4V supply voltage for the internal regulators and output of the battery charger 38 VDD_CHG Power supply Nominal 5V supply voltage for the battery charger Table 1: Supply Terminal Descriptions
Bluegiga Technologies Oy Page 10 of 64 Pin Number Pin Name Pin Type Description 19 RESET RESET Active high reset. If not used, leave floating. When connected, make sure that the reset is either pulled high or floating (connected to high impedance) during boot. 5 AIO0 Configurable I/O AIO0 and AIO1 can be used to read the voltage level through the internal ADC (refer to iWRAP User Guide for details). AIO pins can also be configured to be used as general digital IO pins through PS settings. Internal clocks can be routed out through AIO pins by setting corresponding PS settings. Note that the AIO pins are powered from internal 1.5V supply so the maximum voltage level of the AIO pins is 1.5V. 6 AIO1 7 PIO0 Configurable CMOS I/O General purpose IO's can be configured with iWRAP for various functions. Each IO can be configured individually as output or input with strong or weak pull-up/-down. Using particular PS setting GPIO pins can be used to implement WiFi co-existence signaling between WT32i and a WiFi radio. Software I2C interface can be implemented for slow I2C functions such as configuring external audio codec or display. 8 PIO1 9 PIO2 10 PIO3 13 PIO9 14 PIO10 22 PIO8 23 PIO7 24 PIO6 25 PIO5 26 PIO4 11 USB_D- I/O USB data minus 12 USB_D+ I/O USB data plus with selectable internal 1.5k pull-up resistor 15 UART_RXD CMOS Input, weak internal pull-down UART data input 16 UART_TXD CMOS output, tristate, weak internal pull-up UART data output 20 UART_NRTS CMOS output, tristate, weak internal pull-up UART request to send, active low 21 UART_NCTS CMOS Input, weak internal pull-down UART clear to send, active low 32 SPI_NCSB CMOS Input, weak internal pull-down SPI chip select 33 SPI_CLK CMOS Input, weak internal pull-down SPI clock
Bluegiga Technologies Oy Page 11 of 64 34 SPI_MISO CMOS Input, weak internal pull-down SPI data input 35 SPI_MOSI CMOS output, tristate, weak internal pull-down SPI data output 36 LED0 Open drain output LED driver Table 2: Terminal Descriptions Pin Number Pin Name Pin Type Description 40 MIC_BIAS Analog 41 AUDIO_IN_P_RIGHT Analog 42 AUDIO_IN_N_RIGHT Analog 44 AUDIO_IN_P_LEFT Analog 45 AUDIO_IN_N_LEFT Analog 46 AUDIO_OUT_N_RIGHT Analog 47 AUDIO_OUT_P_RIGHT Analog 49 AUDIO_OUT_N_LEFT Analog 50 AUDIO_OUT_P_LEFT Analog 26 PCM_IN / I2S IN CMOS input, weak internal pull-down PCM or I2S data input 27 PCM_OUT / I2S_OUT CMOS outptu, tristate, weak internal pull-down PCM or I2S data output 28 PCM_SYNC / I2S_WS Bidirectional, weak internal down PCM sync or I2S word select. WT32i can operate as a PCM/I2S master providing the sync or as a slave receiving the sync 29 PCM_CLK / I2S_SCK Bidirectional, weak internal down PCM or I2S clock. WT32i can operate as a PCM/I2S master providing the clock or as a PCM slave receiving the PCM clock. I2S slave mode is not supported Table 3: Audio Terminal Descriptions
Bluegiga Technologies Oy Page 12 of 64 4 Electrical Characteristics 4.1 Absolute Maximum Ratings Min Max Unit Storage temperature range -40 +85 °C Operating temperature range -40 +85 °C VDD_IO -0.4 3.6 V VDD_BAT -0.4 4.4 V VDD_CHG -0.4 6.5 V Digital Terminal voltages VSS - 0.4V VDD + 0.4V V AIO voltages VSS - 0.4V 1.9V V Table 4: Absolute Maximum Ratings 4.2 Recommended Operating Conditions Min Max Unit Storage temperature range -40 +85 °C Operating temperature range -40 +85 °C VDD_IO 1.7 3.6 V VDD_BAT 2.7 4.4 V VDD_CHG 0 6.5 V Digital Terminal voltages 0 VDD V AIO voltages 0 1.5V V Table 5: Recommended operating conditions 4.3 Digital Terminals Input/Output Characteristic Min Max Unit VIL input logic level low -0.3 0.25 x VDD V VIL input logic level high 0.625 x VDD VDD + 0.3 V VOL output logic level low, IOL = 4.0mA 0 0.125 V VOL output logic level high, IOL = -4.0mA 0.75 x VDD VDD V Strong pull-up -100 -10 µA Strong pull-down 10 100 µA Weak pull-up -5 -0.2 µA Weak pull-down 0.2 5 µA Table 6: Digital Terminal Characteristics
Bluegiga Technologies Oy Page 13 of 64 4.4 Audio Characteristics 4.4.1 ADC Parameter Conditions Min Typ Max Unit Resolution - - - 16 Bits Input Sample Rate, Fsample - 8 - 44.1 kHz Signal to Noise Ratio, SNR Fsample 8kHz - 79 - dB 11.025kHz - 77 - dB 16kHz - 76 - dB 22.050kHz - 76 - dB 32kHz - 75 - dB 44.1kHz - 75 - dB Input full scale at maximum gain (differential) - 4 - mV rms Input full scale at minimum gain (differential) - 800 - mV rms 3dB Bandwidth - 20 - kHz Microphone mode input impedance - 6.0 - kHz THD+N @ 30mV rms input - 0.04 - % Table 7: ADC characteristics 4.4.2 DAC Parameter Conditions Min Typ Max Unit Resolution - - - 16 Bits Output Sample Rate, Fsample - 8 - 48 kHz Signal to Noise Ratio, SNR Fsample 8kHz - 95 - dB 11.025kHz - 95 - dB 16kHz - 95 - dB 22.050kHz - 95 - dB 32kHz - 95 - dB 44.1kHz - 95 - dB Output Full Voltage Swing (differential) - 750 - mV rms Allowed Load Resistive 16 - O.C. Ω Capacitive - - 500 pF
Bluegiga Technologies Oy Page 14 of 64 THD+N 16Ω Load - - 0.1 % THD+N 100Ω Load - - 0.01 % Table 8: DAC Characteristics 4.4.3 A2DP Codecs 4.4.3.1 SBC SBC codec is the default codec used for Bluetooth A2DP connections. Any Bluetooth device supporting A2DP audio profile supports SBC codec. SBC was originally design to provide reasonable good audio quality while keeping low computational complexity. SBC does not require high bit rates. Thus it works sufficiently with Bluetooth where the bandwidth and the processing power are limited. 4.4.3.2 aptX® The aptX is widely used in high quality audio devices. aptX can provide dynamic range up to 120 dB and it has the shortest coding delay (<2ms) than other coding algorithms. Using aptX® the whole system latency can be reduced significantly because unlike SBC, it does not require buffering the audio. SBC reproduces a limited audio band width whereas aptX® encode the entire frequency range of audio. aptX® is more robust and resilient coding scheme than SBC and thus re-transmits does not occur as with SBC. Both SBC and aptX® have flat frequency response up to 14 kHz. Up to 14 kHz both algorithms produce good quality audio with very little distortion. At frequencies higher than 14 kHz the benefit of aptX® becomes obvious. SBC exhibits increasing attenuation with increasing frequency but aptX® retains high reproduction quality. aptX®requires purchasing a license for each Bluetooth address and the license agreement must be done with CSR. The combination of aptX® license and the Bluetooth address is programmed into the module in the module production line. Figure 3: Frequency response of aptX and SBC codecs
Bluegiga Technologies Oy Page 15 of 64 4.4.3.3 AAC AAC (Advanced Audio Coding) achieves better sound quality than MP3 and it is the default audio format for YouTube and iPhone among others. AAC has long latency (>100ms) compared to aptX®. Because of high processing capacity requirement for encoding, WT32i does not support AAC as A2DP source. Thus WT32i can be used for receiving (A2DP sink) AAC (from iPhone for example) but it can not transmit AAC coded audio.
Bluegiga Technologies Oy Page 16 of 64 4.5 RF Characteristics 4.5.1 RF Transceiver Transceiver characteristic Min Typ Max Unit Maximum transmit power 4.5 6 7.5 dBm Minimum transmit power -17 dBm Transmit power stability over the temperature range +/- 0.5 dB Transmit power variation within the BT band 1 dB Sensitivity DH1 RT -90 dBm -40C -91 dBm +85C -86 dBm Sensitivity 3DH5 RT -83 dBm -40C -84 dBm +85C -80 dBm Table 9: Transceiver characteristics Table 10: Power control of WT32i
Bluegiga Technologies Oy Page 17 of 64 Standard Band / Frequency Min (AVG / PEAK) Typ (AVG / PEAK) Max (AVG / PEAK) Limit by the Standard (AVG / PEAK) Unit FCC part 15 transmitter spurious emissions 2nd harmonic 50 / 61 54 / 74 dBuV/m 3rd harmonic < 40 / 50 54 / 74 dBuV/m Band edge 2390MHz 54 / 74 dBuV/m Band edge 2483.5MHz 54 / 74 dBuV/m Band edge 2400MHz (conducted) -20 dBc Band edge 2483.5MHz (conducted) -20 dBc ETSI EN 300 328 transmitter spurious emissions Band edge 2400MHz -30 dBm 2nd harmonic -35 -30 dBm 3rd harmonic <-40 -30 dBm ETSI EN 300 328 receiver spurious emissions (2400 - 2479) MHz -47 dBm (1600 - 1653) MHz -47 dBm All the emissions tested with maximum 8 dBm TX power Table 11: WT32i-A spurious emissions 4.5.2 Antenna Characteristics Note: Antenna characteristics may vary depending on the mother board layout. Following characteristics have been measured using DKWT32i  Antenna efficiency -3.5 dB (45%)  Peak gain 0 dBi
Bluegiga Technologies Oy Page 18 of 64 0 dB-5 dB-10 dB-15 dB-20 dB Figure 4: Top view radiation pattern of DKWT32i -2 dB-4 dB-6 dB-8 dB-10 dB-12 dB-14 dB Figure 5: Side view radiation pattern of DKWT32i
Bluegiga Technologies Oy Page 19 of 64 -1 dB-2 dB-3 dB-4 dB-5 dB-6 dB-7 dB-8 dB-9 dB-10 dB-11 dB-12 dB Figure 6: Front view radiation pattern
Bluegiga Technologies Oy Page 20 of 64 4.6 Current Consumption Operation Mode Peak Average Unit Idle SET BT PAGEMODE 0 2000 0 12 2.0 mA SET BT PAGEMODE 0 2000 1 2.0 SET BT PAGEMODE 0 2000 2 2.0 SET BT PAGEMODE 1 2000 0 32 2.0 SET BT PAGEMODE 1 2000 1 2.1 SET BT PAGEMODE 1 2000 2 2.1 SET BT PAGEMODE 2 2000 0 23 SET BT PAGEMODE 2 2000 1 2.2 SET BT PAGEMODE 2 2000 2 2.1 SET BT PAGEMODE 3 2000 0 23 SET BT PAGEMODE 3 2000 1 2.3 SET BT PAGEMODE 3 2000 2 2.2 SET BT PAGEMODE 4 2000 0 23 SET BT PAGEMODE 4 2000 1 2.3 SET BT PAGEMODE 4 2000 2 2.2 Sleep SET BT PAGEMODE 0 2000 0 12 0.08 mA SET BT PAGEMODE 0 2000 1 0.08 SET BT PAGEMODE 0 2000 2 0.08 SET BT PAGEMODE 1 2000 0 32 0.18 SET BT PAGEMODE 1 2000 1 0.18 SET BT PAGEMODE 1 2000 2 0.18 SET BT PAGEMODE 2 2000 0 23.5 SET BT PAGEMODE 2 2000 1 0.31 SET BT PAGEMODE 2 2000 2 0.19 SET BT PAGEMODE 3 2000 0 23 SET BT PAGEMODE 3 2000 1 0.4 SET BT PAGEMODE 3 2000 2 0.29 SET BT PAGEMODE 4 2000 0 23 SET BT PAGEMODE 4 2000 1 0.4 SET BT PAGEMODE 4 2000 2 0.29 Connected, Sniff disabled SET BT SNIFF 0 20 1 8 4.7 Connected + Sniff, Master SET BT SNIFF 40 20 1 8 3.9 Connected + Sniff, Master SET BT SNIFF 1000 20 1 8 2.5 Connected + Sniff, Slave SET BT SNIFF 40 20 1 8 3.6 Connected + Sniff, Slave SET BT SNIFF 1000 20 1 8 2.5 A2DP Audio Streaming A2DP SINK, INTERNAL CODEC 75 28 mA A2DP Audio Streaming A2DP SOURCE, INTERNAL CODEC 70 23 Table 12: Current consumption of WT32i
Bluegiga Technologies Oy Page 21 of 64 5 Power Control and Regulation WT32i contains an internal battery charger and a switch mode regulator that is mainly used for internal blocks of the module. The module can be powered from a single 3.3 V supply provided that VDD_CHG is floating. Alternatively the module can be powered from a battery connected to VDD_BAT and using an external regulator for VDD_IO. 1.8 V to 3.3 V supply voltage for VDD_IO can be used to give desired signal levels for the digital interfaces of the module. USB, however, requires 3.3 V for proper operation and thus, when USB is in use, 3.3 V for VDD_IO is required. Battery ChargerInOutSwitch mode 1.8V regulatorLinear 1.5V regulatorAIORFCoreAudioFlashPIOUSBUARTPCMVDD_CHGVDD_BATVREG_ENAVDD_IO Figure 7: Power supply configuration of WT32i VDD_ENA is software configurable enable pin for the internal regulators. Using iWRAP the enable pin can be configured to 1. Latch on the internal regulators at the rising edge 2. Turn the regulators on at rising edge and turn off the regulators at falling edge 3. Latch the regulators on at the rising edge and turn off the regulators at the following rising edge GPIO can be configured to control an external regulator.
Bluegiga Technologies Oy Page 22 of 64 R1R2LDO (1.8V...3.6V)ENINVDD_BATVREG_ENAVDD_IOGPIO (holds the external LDO on)ON/OFF ButtonBattery Voltage(2.7V...4.4V)C1100k100k4u7 Figure 8: Example of making a power on/off button using the latch feature of the internal regulators iWRAP Example: Creating an on/off button with PIO2 holding the external regulator on “SET CONTROL VREGEN 2 4” (PIO is defined with a bit mask. 4 in hexadecimal is 100 in binary corresponding to PIO2) NOTE: With the configuration shown above, when doing a SW reset for the module C1 will hold the enable pin of the external regulator high until iWRAP has booted. This will prevent the module from turning off during reset. When resetting through the reset pin one has to make sure that the enable pin is held high as long as the reset pin is held active. Figure 9 shows an example how to arrange power control when on/off button is not implemented. VREG_ENA pin must not be connected to VDD_IO because leakage from VDD_BAT to VDD_IO will prevent VREG_ENA to fall low enough to turn off the internal regulators.
Bluegiga Technologies Oy Page 23 of 64 LDO (1.8V...3.6V)ENINVDD_BATVREG_ENAVDD_IOOn/Off cntrlBattery Voltage(2.7V...4.4V)LDO (1.8V...3.6V)ENINVDD_BATVREG_ENAVDD_IOOn/Off cntrlBattery Voltage(2.7V...4.4V) Figure 9: Correct and wrong connection for the power on/off control 5.1 Reset WT32i may be reset from several sources: reset pin, power on reset, a UART break character or through software configured watchdog timer. At reset, the digital I/O pins are set to inputs for bi-directional pins and outputs are tri-state. The chip status after a reset is as follows:  Warm Reset: data rate and RAM data remain available  Cold Reset: data rate and RAM data are not available Table 13 shows the pin states of WT32i on reset. Pull-up (PU) and pull-down (PD) default to weak values unless specified otherwise.
Bluegiga Technologies Oy Page 24 of 64 Pin Name / Group I/O Type No Core Voltage Reset Full Chip Reset USB Digital bi-directional N/A N/A UART_RX Digital input with PD PD PD UART_CTS UART_TX Digital output with PU PU PU UART_RTS SPI_MOSI Digital input with PD PD PD SPI_CLK SPI_MISO Digital tristate output with PD SPI_CS Digital input with PU PU PU PCM_IN Digital input with PD PD PD PCM_CLK Digital bi-directional with PD PCM_SYNC PCM_OUT Digital tri-state output with PD GPIO Digital bi-directional with PU/PD PD PD Table 13: Pin states on reset 5.1.1 Internal POR WT32i has two internal POR circuits. One is internally to the BC5 chip. In BC5 the power on reset occurs when the core supply voltage (output of the internal 1.5V regulator) falls below typically 1.26V and is released when VDD_CORE rises above typically 1.31V. Another POR circuit is embedded to the module and it keeps the module in reset until supply voltages have stabilized. This is to prevent corruption of the internal flash memory during boot. The embedded POR is shown in the figure Figure 1Figure 10. Because the POR is based on a simple RC time constant it will not work if the supply voltage ramps very slowly or if the reset pin is not connected to high impedance. It is recommended that the power ramp will not take more than 10 msec. If the reset pin is connected to a host it is good to place a diode between the host and the module as shown in Figure 11. A diode will prevent the host from pulling the reset low before the internal flash has its supply stabilized.
Bluegiga Technologies Oy Page 25 of 64 R1Reset BC05Reset22nF220kWT32iBC05 Figure 10: Embedded POR of WT32i WT32iResetHost CPUGPIO Figure 11: An example how to connect CPU GPIO to the reset pin of the module
Bluegiga Technologies Oy Page 26 of 64 6 Battery Charger The battery charger is a constant current / constant voltage charger circuit, and is suitable for lithium ion/polymer batteries only. It shares a connection to the battery terminal, VDD_BAT, with the switch-mode regulator. The charger is initially calibrated by Bluegiga Technologies to have Vfloat = 4.15V - 4.2 V. The constant current level can be varied to allow charging of different capacity batteries. WT32i allows a number of different currents to be used in the battery charger hardware. Values written to PS key 0x039b CHARGER_CURRENT in the range 1..15 specify the charger current from 40..135mA in even steps. Values outside the valid 0..15 range result in no change to the charging current. The default charging current (Key = 0) is nominally 40mA. Setting 0 is interpreted as “no-change” so it will be ignored The charger enters various states of operation as it charges a battery. These are shown below:  Off: entered when the charger is disconnected.  Trickle Charge: entered when the battery voltage is below 2.9V.  Fast Charge - Constant Current: entered when the battery voltage is above 2.9V.  Fast Charge - Constant Voltage: entered when the battery has reached Vfloat, the charger switches mode to maintain the cell voltage at Vfloat voltage by adjusting the constant charge current.  Standby: this is the state when the battery is fully charged and no charging takes place. When a voltage is applied to the charger input terminal VDD_CHG, and the battery is not fully charged, the charger will operate and a LED connected to the terminal LED0 will illuminate. By default, until the firmware is running, the LED will pulse at a low-duty cycle to minimize current consumption. The battery charger circuitry auto-detects the presence of a power source, allowing the firmware to detect when the charger is powered. Therefore, when the charger supply is not connected to VDD_CHG, the terminal must be left open circuit. The VDD_CHG pin, when not connected, must be allowed to float and not be pulled to a power rail. When the battery charger is not enabled, this pin may float to a low undefined voltage. Any DC connection will increase current consumption of the device. Capacitive components such as diodes, FETs, and ESD protection, may be connected. The battery charger is designed to operate with a permanently connected battery. If the application permits the charger input to be connected while the battery is disconnected, the VDD_BAT pin voltage may become unstable. This, in turn, may cause damage to the internal switch-mode regulator. Connecting a 470μF capacitor to VDD_BAT limits these oscillations thus preventing damage. WARNING: Use good consideration for battery safety. Do not charge with too much current. Do not charge when the temperature is above 60°C or below 0°C. WT32i is initially calibrated to stop charging when battery voltage is at 4.2 V. Do not try to charge batteries above 4.2 V. Do not short circuit the battery or discharge below 1.5 V.
Bluegiga Technologies Oy Page 27 of 64 7 GPIO and AIO Functions 7.1 iWRAP supported GPIO Functions Various GPIO functions are supported by iWRAP. These include:  Setting each GPIO state individually  Binding certain iWRAP commands to GPIO to trigger the command at either the rising or falling edge of the GPIO  Carrier detect signal to indicate an active Bluetooth connection  Implementing RS232 modem signals  iWRAP ready indicator to signal to a host that iWRAP is ready to use  UART bypass mode to route UART signals to GPIO pins instead of iWRAP  Driving low frequency pulsed signal from a GPIO Some of the functions are FW dependent. Refer to latest iWRAP user manual for the detailed information about the GPIO functions. 7.2 Wi-Fi Co-existence Signals Using few PS keys it is possible to implement HW coexistence between WiFi radio and WT32i. Figure 12 shows an example of Unity-3e coexistence between Bluegiga WF121 and WT32i. WF121WT32iWLAN DENYBT STATUSBT ACTIVE Figure 12: Example 4-wire coexistence scheme Coex Signal / Configuration Setting Description PSKEY BT_STATUS Dual signal used by WT32i to indicate transaction priority, high or low, in the time preceding a transaction, and transmission or reception activity during a transaction. Based on this PTA (Packet Traffic Arbitrator) determines if This signal is not configurable. Default is PIO5
Bluegiga Technologies Oy Page 28 of 64 it should pre-empt the WT32i transaction. BT_ACTIVE Indicates to the PTA that WT32i is initiating a transaction This signal is not configurable. Default is PIO7 WLAN_DENY Used by the PTA to deny transmission by WT32i before it starts. WT32i will abort a pending transaction if the WLAN_DENY signal is detected during a specific monitoring period. PSKEY_LC_COMBO_DISABLE_PIO_MASK (0x0028) Coexistence scheme Defines the coexistence scheme used. PSKEY_LC_COMBO_DOT11_CHANNEL_PIO_BASE (0x002A) Timing signals Defines T1 signal timing PSKEY_LC_COMBO_DOT11_T1 (0x005E) Defines T2 signal timing PSKEY_LC_COMBO_DOT11_T2 (0x005F) TX/RX PIO control Sets a GPIO to indicate TX/RX PSKEY_TXRX_PIO_CONTROL (0x0209) Figure 13: WT32i HW coexistence configuration for Unity-3e NOTE: HW coexistence only does not guarantee seamless simultaneous operation between WT32i and a WiFi radio. As an example, Bluetooth Inquiry or scanning will cut off the Wi-Fi connection. To implement an Unity-3e coexistence interface on WT32i the following PSKEY settings should be set:  PSKEY_LC_COMBO_DISABLE_PIO_MASK (0x0028) = 0x0040 0x0000 0x0000  PSKEY_LC_COMBO_DOT11_CHANNEL_PIO_BASE (0x002A) = 0x0011  PSKEY_LC_COMBO_DOT11_T1 (0x005E) = 0x0043  PSKEY_LC_COMBO_DOT11_T2 (0x005F) = 0x000A  PSKEY_TXRX_PIO_CONTROL (0x0209) = 0x0001 With these settings the pin bindings for the coexistence signals will be: Coex Signal Pin BT_STATUS PIO5 BT_ACTIVE PIO7 WLAN_DENY PIO6 BT_PERIODIC PIO4 Table 14: HW co-existence signals
Bluegiga Technologies Oy Page 29 of 64 7.3 Outputting Internal Clocks Internal clocks can be routed to either AIO0 or AIO1 by setting PS Keys. To route internal clock to AIO0 set PSKEY_AMUX_AIO0 to 0x00fe. Following table shows how to set the PSKEY_AMUX_CLOCK to get certain frequency from AIO0. AMUX_CLOCK Freq (MHz) @ AIO0 0x0014 1 0x0004 2 0x0013 3 0x0017 4 0x0003 6 0x0016 6.5 0x0007 8 0x0011 12 0x0006 13 0x0002 16 0x0009 24 0x0005 32 Table 15: Selectable internal clock frequencies from AIO0 iWRAP does not support this feature. To use this feature either the particular PS Keys must be set to each module separately or then ask for custom FW from Bluegiga. 7.4 Auxiliary ADC Simple iWRAP command can be used to read the ADC output from either of the two AIO pins. Refer to latest iWRAP user manual for the detailed information. 7.5 Software I2C Interface PIO6, PIO7 and PIO8 can be used to form a master I²C interface. The interface is formed using software to drive these lines. Therefore it is suited only to relatively slow functions such as driving a dot matrix LCD, keyboard scanner or configuring external audio codec. I2C interface requires a custom FW.
Bluegiga Technologies Oy Page 30 of 64 8 Serial Interfaces 8.1 UART Interface WT32i has a standard UART serial interface that provides a simple mechanism for communicating with other serial devices using the RS232 protocol. UART configuration parameters, such as baud rate, parity and stop bits can be configured with an iWRAP command. The hardware flow control is enabled by default. HW flow control can be disabled in HW by connecting UART_NCTS to GND and leaving UART_NRTS floating. Parameter Possible Values Baud rate Minimum 1200 baud (≤2%Error) 9600 (≤1%Error) Maximum 4Mbaud (≤1%Error) Flow control RTS/CTS or None Parity None, Odd, Even Number of stop bits 1 or 2 Bits per byte 8 Table 16: Possible UART settings iWRAP Example: Configuring local UART to 9600bps, 8 data bits, no parity and 1 stop bit SET CONTROL BAUD 9600, 8N1 (9600 = baud rate, N = No parity, 1 = 1 stop bit) Baud Rate Error 1200 1.73% 2400 1.73% 4800 1.73% 9600 -0.82% 19200 0.45% 38400 -0.18% 57600 0.03% 76800 0.14% 115200 0.03% 230400 0.03% 460800 -0.02% 921600 0.00% 1382400 -0.01% 1843200 0.00% 2764800 0.00% 3686400 0.00% Table 17: Standard Baud Rates
Bluegiga Technologies Oy Page 31 of 64 8.1.1 Resetting Through UART Break Signal The UART interface can reset WT32i on reception of a break signal. A break is identified by a continuous logic low (0V) on the UART_RX terminal. If tBRK is longer than the value, defined by PSKEY_HOSTIO_UART_RESET_TIMEOUT, a reset occurs. This feature allows a host to initialise the system to a known state. Also, WT32i can emit a break character that may be used to wake the host. Default PSKEY_HOSTIO_UART_RESET_TIMEOUT setting in WT32i is zero, which means that this feature is disabled. To use this feature, either the PS setting has to be changed for each module separately or ask for modules with custom FW with appropriate settings. 8.1.2 UART Configuration While Reset is Active The UART interface for WT32i is tristate while the chip is being held in reset. This allows the user to daisy chain devices onto the physical UART bus. The constraint on this method is that any devices connected to this bus must tristate when WT32i reset is de-asserted and the firmware begins to run. 8.1.3 UART Bypass Mode Alternatively, for devices that do not tristate the UART bus, the UART bypass mode on WT32i can be used. The default state of WT32i after reset is de-asserted; this is for the host UART bus to be connected to the WT32i UART, thereby allowing communication to WT32i via the UART. All UART bypass mode connections are implemented using CMOS technology and have signalling levels of 0V and VDD_IO. The bypass mode is enabled with a simple iWRAP command. When in bypass mode, the module is automatically set into deep sleep state indefinitely. Physical reset is required to return to normal operation mode. The current consumption of a module in bypass mode is equal to a module in standby (idle) mode. It is important for the host to ensure a clean Bluetooth disconnection of any active links before the bypass mode is invoked. Therefore, it is not possible to have active Bluetooth links while operating the bypass mode. WT12HostprocessorTestinterfaceRXDCTSRTSTXDAnotherdeviceTXRTSCTSRXUART_TXUART_RTSUART_CTSUART_RXRESETPIO5PIO6PIO7PIO4UARTWTxxWT32i Figure 14: UART bypass architecture 8.2 USB Interface WT32i has a full-speed (12Mbps) USB interface for communicating with other compatible digital devices. The USB interface on WT32i acts as an USB peripheral, responding to requests from a master host controller.
Bluegiga Technologies Oy Page 32 of 64 WT32i can be used as bus-powered or self-powered device. See the WT_USB_Design_Guide available in the Bluegiga techforum for details about the SW and HW configuration of the USB interface. WT32iVDD_IOVDD_BATVDD_IO Figure 15: Bus-powered WT32i device configuration
Bluegiga Technologies Oy Page 33 of 64 VDD_IOVDD_IOWT32i Figure 16: Self powered WT32i device configuration 8.3 Programming and Debug Interface (SPI) The synchronous serial port interface (SPI) is for interfacing with other digital devices. The SPI port can be used for system debugging. It can also be used for programming the Flash memory. SPI interface is connected by using the MOSI, MISO, CSB and CLK pins. SPI interface can not be used for any application purposes.
Bluegiga Technologies Oy Page 34 of 64 9 Audio Interfaces 9.1 Stereo Audio Codec Interface Stereo audio CODEC operates from an internal 1.5V power supply. It uses fully differential architecture in analog signal path for the best possible common mode noise rejection while effectively doubling the signal amplitude. The stereo audio bus standard I2S is supported and a software I2C interface can be implemented using GPIOs to configure an external audio CODEC. Figure 17: Stereo CODEC input and output stages 9.1.1 ADC The ADC consists of two second-order sigma-delta converters and gain stages. The gain stage consists of digital and analog gain stages which are controlled by iWRAP. The optimal combination of digital and analog gain is automatically selected by iWRAP. The analog gain stage consist selectable 24 dB preamplifier for selecting microphone or line input levels and an amplifier which can be configured in 3 dB steps. The iWRAP gain selection values are shown in the Table 19. Following sample rates are supported  8kHz  11.025kHz  16kHz  22.05kHz  24kHz  32kHz  44.1kHz
Bluegiga Technologies Oy Page 35 of 64 iWRAP Gain Setting (-27...39)dBPreamp ON = 24 dB gain (MIC input)Preamp OFF = 0 dB gain (line input) Table 18: ADC amplifier block diagram Gain Setting In iWRAP ADC Gain (dB) Preamp OFF (Line input mode) ADC GAIN (dB) Preamp ON (MIC input mode) 0 -27 -3 1 -24 0 2 -21 3 3 -18 6 4 -15 9 5 -12 12 6 -9 15 7 -6 18 8 -3 21 9 0 24 A 3 27 B 6 30 C 9 33 D 12 36 E 15 39 F 18 42 10 21 45 11 24 48 12 27 51 13 30 54 14 33 57 15 36 60 16 39 63 Table 19: ADC Gain Selection In iWRAP iWRAP Example: Setting line input with 0 dB gain “SET CONTROL PREAMP 0” ”SET CONTROL GAIN 9 x” (x is the DAC gain)
Bluegiga Technologies Oy Page 36 of 64 9.1.2 DAC The DAC consists of two second-order sigma-delta converters and gain stages. The gain stage consists of digital and analog gain stages which are controlled by iWRAP. The optimal combination of digital and analog gain is automatically selected by iWRAP. The analog gain stage consist selectable 24 dB preamplifier for selecting microphone or line input levels and an amplifier which can be configured in 3 dB steps. The iWRAP gain selection values are shown in Table 20. Following sample rates are supported  8kHz  11.025kHz  16kHz  22.05kHz  24kHz  32kHz  44.1kHz  48kHz Gain Setting In iWRAP DAC Gain (dB) 0 -42 1 -39 2 -36 3 -33 4 -30 5 -27 6 -24 7 -21 8 -18 9 -15 A -12 B -9 C -6 D -3 E 0 F 3 10 6 11 9 12 12 13 15 14 18 15 21 16 24 Table 20: DAC gain selection in iWRAP iWRAP Example: Setting output with 0 dB gain ”SET CONTROL GAIN x E” (x is the ADC gain)
Bluegiga Technologies Oy Page 37 of 64 9.1.3 Microphone Input Figure 18 shows the recommended microphone biasing. The microphone bias, MIC_BIAS, derives its power from the VDD_BAT and requires 1uF capacitor on its output (C1). The input impedance at AUDIO_IN_P_LEFT and AUDIO_IN_N_LEFT is typically 6kohm and C5 and C4 are typically 1uF. If bass roll-off is required to limit the wind noise on the microphone then C4 and C5 should be 150 nF. R2 sets the microphone load impedance and is normally in the range of 1kΩ to 2kΩ R1, C2 and C3 improve the supply rejection by decoupling supply noise from the microphone. Values should be selected as required. R1 can be connected or to the MIC_BIAS output (which is ground referenced and provides good rejection of the supply) as shown in Figure 18. MIC_BIAS is configured to provide bias only when the microphone is required. R1 may also be connected to a convenient supply, in which case the bias network is permanently enabled. WT32iMIC_BIASC1C2C3MICC4C5AUDIO_IN_N_LEFTAUDIO_IN_P_LEFTR1R2 Figure 18: Microphone connection to audio input The MIC_BIAS is like any voltage regulator and requires a minimum load to maintain regulation. The MIC_BIAS maintains regulation within the limits 0.200mA to 1.230mA. If the microphone sits below these limits, then the microphone output must be pre-loaded with a large value resistor to ground. The audio input is intended for use in the range from 1μA @ 94dB SPL to about 10μA @ 94dB SPL. With biasing resistors R1 and R2 equal to 1kΩ, this requires microphones with sensitivity between about –40dBV and –60dBV. Table 21 lists the possible voltage and current setting in iWRAP for the MIC_BIAS. Setting in iWRAP Voltage (V) Current (mA) 0 1.71 0.200 1 1.76 0.280 2 1.82 0.340 3 1.87 0.420
Bluegiga Technologies Oy Page 38 of 64 4 1.95 0.480 5 2.02 0.530 6 2.10 0.610 7 2.18 0.670 8 2.32 0.750 9 2.43 0.810 A 2.56 0.860 B 2.69 0.950 C 2.90 1.000 D 3.08 1.090 E 3.33 1.140 F 3.57 1.230 Table 21: MIC_BIAS settings in iWRAP 9.1.4 Line Input Line input mode is selected by setting the ADC preamplifier off (see chapter 9.1.1). In the line input mode the input impedance varies from 6k to 30 kohm depending on the gain setting. Figure 19 and Figure 20 show examples of line input connection with WT32i. The maximum line level rms voltage can vary from 0.3 up to 1.6 Vrms depending on the application, while the maximum for WT32i is 0.4Vrms (0.8Vrms differential). Thus it may be necessary to use a voltage divider (R1 and R2) at the input to attenuate the incoming signal. C1 and C2 are typically 1uF ceramic X7R or film type capacitors. It is a good practice to place a LC (22nH + 15pF) filter close to each input to filter out any RF noise that might couple to the audio traces. R1R2C1C2WT32iAUDIO_IN_N_LEFTAUDIO_IN_P_LEFTLine input Figure 19: Single ended line input example
Bluegiga Technologies Oy Page 39 of 64 R1R2C1C2WT32iAUDIO_IN_N_LEFTAUDIO_IN_P_LEFTLine input PLine input N Figure 20: Differential line input example 9.1.5 Output Stage The output stage digital circuitry converts the signal from 16-bit per sample, linear PCM of variable sampling frequency to bit stream, which is fed into the analogue output circuitry. The output stage circuit comprises a DAC with gain setting and class AB output stage amplifier. The output is available as a differential signal between AUDIO_OUT_N_LEFT and AUDIO_OUT_P_LEFT for left channel and AUDIO_OUT_N_RIGHT and AUDIO_OUT_P_RIGHT for right channel. The output stage is capable of driving a speaker directly when its impedance is at least 16Ω. Figure 21 show an example of differentially connected speaker and Figure 22 show an example of speaker connected single-ended. Differential (balanced) connection provides perfect common mode rejection ratio with effectively 3 dB higher amplitude so it is recommended to use differential signaling always when possible.
Bluegiga Technologies Oy Page 40 of 64 WT32iAUDIO_OUT_N_LEFTAUDIO_OUT_P_LEFT Figure 21: Differentially connected speaker WT32iAUDIO_OUT_N_LEFTAUDIO_OUT_P_LEFT C1 Figure 22: Single-ended speaker connection
Bluegiga Technologies Oy Page 41 of 64 9.1.6 Mono Operation Mono operation is a single-channel operation of the stereo codec. The left channel represents the single mono channel for audio in and audio out. In mono operation the right channel is the auxiliary mono channel that may be used in dual mono channel operation. Dual mono feature is FW dependent and iWRAP does not generally support it. 9.1.7 Side Tone In some applications it is necessary to implement side tone. This involves feeding an attenuated version of the microphone signal to the earpiece. The WT32i codec contains side tone circuitry to do this. There is no iWRAP support for the side tone but the side tone is configurable through PS Keys. To implement a side tone, either the PS setting has to be programmed for each module separately or ask for modules with custom FW with appropriate settings. The side tone hardware is configured through the following PS Keys:  PSKEY_SIDE_TONE_ENABLE  PSKEY_SIDE_TONE_GAIN  PSKEY_SIDE_TONE_AFTER_ADC  PSKEY_SIDE_TONE_AFTER_DAC 9.2 PCM Interface The audio PCM interface supports continuous transmission and reception of PCM encoded audio data over Bluetooth. PCM is a standard method used to digitise audio, particularly voice, for transmission over digital communication channels. Through its PCM interface, WT32i has hardware support for continual transmission and reception of PCM data, so reducing processor overhead. WT32i offers a bidirectional digital audio interface that routes directly into the baseband layer of the on-chip firmware. It does not pass through the HCI protocol layer. Hardware on WT32i allows the data to be sent to and received from a SCO connection. Using HCI FW up to 3 SCO connections can be supported by the PCM interface at any one time. However iWRAP supports only 1 SCO connection at a time. WT32i can operate as the PCM interface master generating PCM_SYNC and PCM_CLK or as a PCM interface slave accepting externally generated PCM_SYNC and PCM_CLK. WT32i is compatible with various clock formats, including Long Frame Sync, Short Frame Sync and GCI timing environments. WT32i supports 13-bit or 16-bit linear, 8-bit μ-law or A-law companded sample formats, and can receive and transmit on any selection of 3 of the first four slots following PCM_SYNC. The PCM configuration options are enabled by setting the PS Key PSKEY_PCM_CONFIG32. Please contact Bluegiga technical support for details about the PCM configuration. 9.3 I2S Interface The digital audio interface supports the industry standard formats for I2S, left-justified or righ justified. The interface shares the same pins as the PCM interface, which means each audio bus is mutually exclusive in its usage. The internal representation of audio samples within WT32i is 16-bit and data on SD_OUT is limited to 16-bit per channel. WT32i is not capable of generating the master clock for I2S, so it can only be used as a master with a codec that is capable of producing the master clock from the SCK.
Bluegiga Technologies Oy Page 42 of 64 WT32iWSSCKI2S_INI2S_OUTMCLK GeneratorASII2S CODEC Figure 23: I2S scheme for WT32i Bit Mask Name Description D[0] 0x0001 CONFIG_JUSTIFY_FORMAT 0 for left justified, 1 for right justified. D[1] 0x0002 CONFIG_LEFT_JUSTIFY_DELAY For left justified formats: 0 is MSB of SD data occurs in the first SCLK period following WS transition. 1 is MSB of SD data occurs in the second SCLK period. D[2] 0x0004 CONFIG_CHANNEL_POLARITY For 0, SD data is left channel when WS is high. For 1 SD data is right channel. D[3] 0x0008 CONFIG_AUDIO_ATTEN_EN For 0, 17-bit SD data is rounded down to 16bits. For 1, the audio attenuation defined in CONFIG_AUDIO_ATTEN is applied over 24bits with saturated rounding. Requires CONFIG_16_BIT_CROP_EN to be 0. D[7:4] 0x00F0 CONFIG_AUDIO_ATTEN Attenuation in 6dB steps. D[9:8] 0x0300 CONFIG_JUSTIFY_RESOLUTION Resolution of data on SD_IN, 00=16bit, 01=20bit, 10=24bit, 11=Reserved. This is required for right justified format and with left justified LSB first. D[10] 0x0400 CONFIG_16_BIT_CROP_EN For 0, 17-bit SD_IN data is rounded down to 16bits. For 1 only the most significant 16bits of data are received. Table 22: PSKEY_DIGITAL_AUDIO_CONFIG
Bluegiga Technologies Oy Page 43 of 64 Figure 24: Digital Audio Interface Modes 9.4 IEC 60958 Interface The IEC 60958 interface is a digital audio interface that uses bi-phase coding to minimize the DC content of the transmitted signal and allows the receiver to decode the clock information from the transmitted signal. The IEC 60958 specification is based on the 2 industry standards:  AES/EBU  Sony and Philips interface specification SPDIF The interface is compatible with IEC 60958-1, IEC 60958-3 and IEC 60958-4. The SPDIF interface signals are SPDIF_IN and SPDIF_OUT and are shared no the PCM interface pins. The input and output stages of the SPDIF pins can interface to:  75Ω coaxial cable with an RCA connector, see Figure 25  An optical link that uses Toslink optical components
Bluegiga Technologies Oy Page 44 of 64 Impedance matching to 75 ohmDC blockImpedance matching to 75 ohmBuff ering required to driv e 75 ohm loadDC bias f or the comparator inputComparator12U1-A74HC 14D34U1-B74HC 14D56U1-C74HC 14D98U1-D74HC14DR 1560 R, 50V, 0.06 3WR 2560 R, 50V, 0.06 3WR 3560 R, 50V, 0.06 3WR4120 R, 50V, 0.063WC 10.15 uF/10V/X5R12J1RCA_RED12J2RCA_REDR5150 R, 50V, 0.063WR6150 R, 50V, 0.063WC 2100 00 pF/25V/X7RR11470 K, 50 V, 0.063WR1210K, 50 V, 0.063 WR131.0K, 50V, 0.063 WR141.0K, 50V, 0.063 WR 1 510K, 50V, 0.063WC41uF/6.3V/X5R/10 %C51uF/6.3V/X5R/10%-+12345U3MCP6541UC60.15uF/10V/X5RC70.15uF/10V/X5RR16100 K, 50 V, 0.063W213D1ESD_PROTECTION213D2ESD_PROTECTION3V3SPD IF_ INSPD IF_ OU T3V33V3 Figure 25: Example circuit for SPDIF interface (co-axial)
Bluegiga Technologies Oy Page 45 of 64 10 Design Guidelines This chapter shows briefly the most important points to consider when making a design with WT32i. Please refer to the DKWT32i datasheet for detailed description of the development board design. 10.1 Audio Layout Guide 10.1.1 EMC Considerations To avoid RF noise coupling top the audio traces it is extremely important to make sure that there aren’t GND loops in the audio traces. Audio layout can not be compromised. RF noise that couples to audio signal lines usually demodulates down to audio band causing very unpleasant whining noise. Noise couples to signals lines either through a parasitic capacitance or by coupling to a loop. The noise that couples to a loop is proportional to the area of the loop and to the electromagnetic field flowing through the loop. Thus the noise can be minimized in two ways. Minimizing the field strength flowing through the loop by placing the signal lines far from the RF source or most importantly minimize the size of the loop by keeping the trace as short as possible and making sure that the path for the return current (usually GND) is low impedance and follows the forward current all the way as close as possible. GND vias must be placed right next to the any component GND pins and solid GND plane must follow the trace all the way from start to the end. When using fully differential signals they should be routed as differential pairs, parallel and symmetrically. Typical RF noise with Bluetooth•How the BT noise couples to audio?-1.6kHz noise1 Bluetooth slot = 625us1 ÷ 625e-6 = 1.6kHz-320Hz noise5 slot packet (A2DP profile)1 ÷ (5 × 625e-6) = 320Hz (5)* RF takes an amplifier out from it’s linear region causing demodulation of RF down to audio band. (6)RLEM field couples to a loopRLNoise couples through a parasitic capacitance Figure 26: Noise coupling schemes 10.1.2 Choosing Capacitors and Resistors Metal film resistors have lower noise than carbon resistors which makes them more suitable for high quality audio. Non-linearity of capacitors within the audio path will have an impact on the audio quality at the frequencies where the impedance of the capacitors become dominant. At higher frequencies the amplitude is not determined by the value of the capacitors but at the lower frequencies the impact of the capacitors will be seen. Ceramic capacitors should be X5R or X7R type capacitors with relative high voltage rating. The higher the capacitance value, the lower is the frequency where the non-linearity will start to have an impact. Thus it is not a bad idea to select the capacitors value bigger than necessary from the frequency response point of view. For optimal audio quality the best selection is to use film capacitors. Film capacitors have excellent linearity and they are non-polarized which makes them perfect choice for using in audio path. The drawback of film capacitors is bigger physical size and higher cost. Figure 27 shows a modulation distortion measurement when using different type of capacitors in the audio paths. Modulation distortion measures the amount of distortion between two closely located sine waves. The
Bluegiga Technologies Oy Page 46 of 64 difference between the different capacitors is obvious at low frequencies where the impedance of the capacitor is dominant. Figure 27: Modulation distortion with different type of capacitors 10.2 RF Layout Guide The chip antenna of WT32i requires only a small metal clearance area directly under the antenna. The antenna operation is dependent on the GND planes on both sides of the antenna. Minimum 15mm of GND plane must be placed on both sides of the module and the GND plane of the motherboard must reach under the edges of the module as shown in the Figure 28.
Bluegiga Technologies Oy Page 47 of 64 Min 15mm Min 15mm6mm Metal clearanceareaBoard edgeGND plane indentation 2mm GND plane indentation max 5.9 mm Figure 28: Recommended layout for WT32i Figure 29: Poor layouts for WT32i Use good layout practices to avoid excessive noise coupling to supply voltage traces or sensitive analog signal traces. If using overlapping ground planes use stitching vias separated by max 3 mm to avoid emission from the edges of the PCB. Connect all the GND pins directly to a solid GND plane and make sure that there is a low impedance path for the return current following the signal and supply traces all the way from start to the end.
Bluegiga Technologies Oy Page 48 of 64 A good practice is to dedicate one of the inner layers to a solid GND plane and one of the inner layers to supply voltage planes and traces and route all the signals on top and bottom layers of the PCB. This arrangement will make sure that any return current follows the forward current as close as possible and any loops are minimized. Layout•Supply voltage–If possible use solid power plane–Make sure that solid GND plane follows the traces all the way–Do not route supply voltage traces across separated GND regions so that the path for the return current is cut•MIC input–Place LC filtering and DC coupling capacitors symmetrically as close to audio pins as possible–Place MIC biasing resistors symmetrically as close to microhone as possible.–Make sure that the bias trace does not cross separated GND regions (DGND -> AGND) so that the path for the return current is cut. If this is not possible the do not separate GND regions but keep one solid GND plane.–Keep the trace as short as possibleSignalsGNDPowerSignalsRecommended PCB layer configuration Figure 30: Typical 4-layer PCB construction Overlapping GND layers without GND stitching vias Overlapping GND layers with GND stitching vias shielding the RF energy Figure 31: Use of stitching vias to avoid emissions from the edges of the PCB
Bluegiga Technologies Oy Page 49 of 64 10.3 Example Application Schematics 470 uF capacitor is required if it is likely thatthe battery can be removed. If the battery isnot placed and the charger is enabled, the chargerwill become unstable causing damage to the moduleThe charger LED will blink evenif the module is not powered.However, in this case the modulecan not read the calibration settingsand will be using the default minimumcurrent and voltageSPI interface for FW updates and debugging2GND3GND4GND5AIO06AIO17PIO08PIO19PIO210 PIO311 USB_DN12 USB_DP13 PIO914 PIO1015 RXD16 TXD17 3V31 8 G ND1 9 RESET2 0 RTS2 1 CTS2 2 PIO 82 3 PIO 72 4 PIO 62 5 PIO 52 6 PIO 42 7 PCM_ IN2 8 P CM _ O UT2 9 PCM_ SYNC3 0 PCM_ CL K31GND32SPI_CS33SPI_CLK34SPI_MISO35SPI_MOSI36LED037VDD_BAT38VDD_CHG39GND40MIC_BIAS41AUDIO_IN_P_RIGH42AUDIO_IN_N_RIGHT43AGND44AUDIO_IN_P_LEFT45AUDIO_IN_N_LEFT46AUDIO_OUT_N_RIGHT47AUDIO_OUT_P_RIGHT48AGND49AUDIO_OUT_N_LEFT50AUDIO_OUT_P_LEFT1MOD1WT32I1A12B14A23B2SW9D61 2R110 0K1 2R21 0 0 K1IN3EN2G ND5OUT4NRU1TPS79933C382 .2 u FC492 .2 u FC110uF3241U6MIC_WM7120ATrueC271 u FR2351 K, 50 V, 0.0 6 3WL1 15nHC1515pFC16 1uF/X7RC17 1uF/X7RL2 15nHC215pF12MOD2GENERAL_SPEAKER12MOD3GENERAL_SPEAKER1MISO3CLK5CSB23V34MOSI6GNDJ9D2R1 012 0RC23470uF/10V/20%/TANC144 u 7 /X5 R/6 .3 V/1 0 %AKD10HS MG-C19012R615 1 0R, 5 0 V, 0.0 63 W, +/-5 %3V33V3BATTERY5V_CHARGER_INPUTCHG _ L EDCHG_LEDBATTERY Figure 32: Example schematic with on/off button, silicon microphone and stereo speakers
Bluegiga Technologies Oy Page 50 of 64 During boot the diode will prevent the host pulling reset lowbefore the internal flash has its supply voltage stabilisedLine level input can be as high as 4.37 Vpp.Voltage divider is used to drop this down tobelow 1 Vpp to avoid saturation of WT32 inputNOTE: Differential audio provides excellent common mode rejection and effectively douples the amplitude. Thus it is strongly recommendable to use differential instead of single ended when ever possible2GND3GND4GND5AIO06AIO17PIO08PIO19PIO210 PIO311 USB_DN12 USB_DP13 PIO914 PIO1015 RXD16 TXD17 3V318 GND19 RESET20 RTS21 CTS22 PIO823 PIO724 PIO625 PIO526 PIO427 PCM_IN28 PCM_OUT29 PCM_SYNC30 PCM_CLK31GND32SPI_CS33SPI_CLK34SPI_MISO35SPI_MOSI36LED037VDD_BAT38VDD_CHG39GND40MIC_BIAS41AUDIO_IN_P_RIGH42AUDIO_IN_N_RIGHT43AGND44AUDIO_IN_P_LEFT45AUDIO_IN_N_LEFT46AUDIO_OUT_N_RIGHT47AUDIO_OUT_P_RIGHT48AGND49AUDIO_OUT_N_LEFT50AUDIO_OUT_P_LEFT1MOD4WT32I1IN3EN2GND5OUT4NRU2TPS79933C112.2uFC132.2uFC181uFL3 15nHC1915pFC20 1uF/X7RC21 1uF/X7RL4 15nHC2215pF1MISO3CLK5CSB23V34MOSI6GNDJ11SLEEVE3 RING2TIPJ3SJ-3523-SMT-TR1SLEEVE3RING2TIPJ2SJ-3523-SMT-TRC24 1uF/X7RC25 1uF/X7RC26330uF/6.3V/20%/TA N/ESR<10mohmC28330uF/6.3V/20%/TA N/ESR<10mohm12R31M, 50V, 0.1W, 5%12R111M, 50V, 0.1W, 5%12R127.5K, 50V, 0.063W12R157.5K, 50V, 0.063W12R162.2K, 50V, 0.063W12R172.2K, 50V, 0.063WD13V33V3ON/OFF_CNTRL_FROM_HOST5V0RESET_FROM_HOST Figure 33: Example schematic with single ended line input, single ended output and with on/off control from a host
Bluegiga Technologies Oy Page 51 of 64 Impedance matching network to avoidclick/pop when the DC level at the audiolines rises when starting audio connection.1uF in parallel with 150k equals the impedanc eof the mid rail generation circuit internally toTPA6112A2LC filtering to filter out any RF noise that mighttravel from the audio cables back to the audioamplifier input1M resistor keeps the DC lev el at GNDto avoid crack/pop when plugging in theaudio cableZobel networkMIDRAIL+--+2319784510611U7TPA6112A2C30.1uF/10V/X5R/10% C410uF/6.3V/X5R/10%12R430k12R530k12R830k12R930kC51uF/X7RC61uF/X7RC71uF/X7RC81uF/X7RC91uF/X7RC12330uF/TANTALUMC10330uF/TANTALUM1SLEEVE3RING2 TIPJ11SJ-3523-SMT-TR12R621M, 50V , 0.1W, 5%12R631M, 50V , 0.1W, 5%R68NPC570.1uF/10V/X5R/10%R69NPC580.1uF/10V/X5R/10%C591uF/X7RC601uF/X7RC6733pFC6833pFL1133nHL1233nHC695.0pFC705.0pF12R615K12R715K12R1315K12R1415K12R71150K12R52150K3V3PIO5/PA_SHTDWNA_OUT_LEFT_NA_OUT_LEFT_PA_OUT_RIGHT_PA_OUT_RIGHT_N Figure 34: Example schematic for connecting external audio PA to the stereo audio output
Bluegiga Technologies Oy Page 52 of 64 Debug header15 M I CBIAS10 M I C1L /L INE1 L12 M I C2L /L INE2 L13 M I C2R/L INE2 R14 M I C3L /L INE3 L16 M I C3R/L INE3 R11 M I C1R/L INE1 R23 HPROUT19 HPLOUT20 HPLCOM22 HPRCOM29 RIGHT_LOP30 RIGHT_LOM27 LEFT_ L OP28 LEFT_ L OM21DRVSS26AVSS_DAC17AVSS_ADC6DVSS32DVDD7IOVDD24DRVDD18DRVDD25AVDD_DAC4DIN5DOUT3WCLK2BCLK1MCLK31RESET9SDA8SCL33GND 3 4GND 3 5GND 3 6GNDU9TL V3 2 0AIC321RST2VSS3RST4M R5VDDU10M CP13 191A12B14A23B2SW1R 375.1K, 50 V, 0.063W, +/-5%C 210.1 uF/10 V/X5R /1 0%C 221u F/6.3V/X5R / 10%C 230.1 uF/10 V/X5R /1 0%C 241u F/6.3V/X5R / 10%C 250.1 uF/10 V/X5R /1 0%C 261u F/6.3 V/ X5R /1 0%C 280.1 uF/10 V/X5R /1 0%C 291u F/6.3V/X5R / 10%C 3010 uF/6. 3V/X5R / 10%C 310.1 uF/10 V/X5R /1 0%C 321u F/6.3V/X5R / 10%R384.7K, 50V, 0.063W, 5%R404.7K, 50V, 0.063W, 5%12U11RCA_RED12U12RCA_WHITEC33330uF/6.3V/20%/TAN/ESR<10 mohmC34330uF/6.3V/20%/TAN/ESR<10mohm12U15RCA_RED12U18RCA_WHITEC351uF/16V/20%C361uF/16V/20%R 641M, 50V, 0 .1W, 5%R 651M, 50V, 0 .1W, 5%R 66N PR 67N PC 530.1 uF/10 V/X5R /1 0%C 540.1 uF/10 V/X5R /1 0%12R461M, 50V, 0.1W, 5%12R491M, 50V, 0 .1W, 5% 1IN3GND2OUTU8AP731 3C 421u F/6.3V/X5R / 10%C 431u F/6.3V/X5R / 10%2GND3GND4GND5AIO06AIO17PIO08PIO19PIO210 PIO311 USB_DN12 USB_DP13 PIO914 PIO1015 RXD16 TXD17 3V318 G N D19 R ESET20 R TS21 C TS22 PIO 823 PIO 724 PIO 625 PIO 526 PIO 427 PC M_ IN28 PC M_ O U T29 PC M_ SYN C30 PC M_ C LK31GND32SPI_CS33SPI_CLK34SPI_MISO35SPI_MOSI36LED037VDD_BAT38VDD_CHG39GND40MIC_BIAS41AUDIO_IN_P_RIGH42AUDIO_IN_N_RIGHT43AGND44AUDIO_IN_P_LEFT45AUDIO_IN_N_LEFT46AUDIO_OUT_N_RIGHT47AUDIO_OUT_P_RIGHT48AGND49AUDIO_OUT_N_LEFT50AUDIO_OUT_P_LEFT1MOD1WT32I135246J73V33V33V33V3PIO7/I2C_SDAPIO6/I2C_SCLI2S_SDINI2S_SDOUTI2S_WSI2S_SCK3V33V3 Figure 35: Example schematic with an external I2S codec
Bluegiga Technologies Oy Page 53 of 64 11 Physical Dimensions 23.9 (+/-0.2) mmAntModel: WT32i-AFCC ID: QOQWT32IIC: 5123A-BGTWT32IKCC-CRM-BGT-WT32IR209-JXXXXX15.9 (+/-0.2) mm3.8 mm 9.15 mm5.6 (+/-0.2) mm 17.9 (+/-0.1) mm15.0 (+/-0.1) mm3.35 mm23.9 (+/-0.2) mm2.1 (+/-0.15) mm2.4 (+/-0.15) mm Figure 36: Physical dimensions of WT32i
Bluegiga Technologies Oy Page 54 of 64 Figure 37: Pin dimensions of WT32i, top view Figure 38: Recommended PCB land pattern for WT32i
Bluegiga Technologies Oy Page 55 of 64 12 Soldering Recommendations WT32i is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations. Bluegiga Technologies will give following recommendations for soldering the module to ensure reliable solder joint and operation of the module after soldering. Since the profile used is process and layout dependent, the optimum profile should be studied case by case. Thus following recommendation should be taken as a starting point guide. - Refer to technical documentations of particular solder paste for profile configurations - Avoid using more than one flow. - Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of 150m stencil thickness is recommended. - Aperture size of the stencil should be 1:1 with the pad size. - A low residue, “no clean” solder paste should be used due to low mounted height of the component. Figure 39: Reference reflow profile
Bluegiga Technologies Oy Page 56 of 64 13 Package Figure 40: Carrier tape dimensions
Bluegiga Technologies Oy Page 57 of 64 Figure 41: Reel dimensions
Bluegiga Technologies Oy Page 58 of 64 14 Certification Guidance for an End Product Using WT32i 14.1 Bluetooth End Product Listing The Bluetooth SIG requires for every commercially available product implementing Bluetooth technology to be listed on the Bluetooth SIG End Product Listing (EPL). For the details on how to make the end product listin, please refer to the Bluetooth End Product Listing Guide available in www.bluegiga.com. 14.2 CE Approval of an End-Product When placing the CE logo to an end-product the manufacturer declares that the product is in conformity with the requirements of the R&TTE directive. The minimum requirements for placing the CE logo to an end-product are  Declaration of Conformity signed by the manufacturer. The person who signs the DoC must be traceable  Generation of a technical construction file including o Technical information about the product o Test reports for all the relevant standards required to demonstrate that the product meets the requirements of the R&TTE directive The end-product manufacturer is fully responsible for the compliance of the end-product. The modules test reports can partly be used to demonstrate the compliance but typically all the radiated tests must be re-tested with the end product. All the conducted RF tests can be inherited from the modules test reports because the conducted RF characteristics are not dependent on the installation of the module. Standard Description Tested with the module Test required for the end product Modules test results can be inherited to the end product test report EN 300 328 RF emissions Module fully tested Radiated test cases Yes (partly) EN 301 489-1 EN 301 489-17 EMC immunity and emissions Only EM field immunity tested All the test cases relevant for the end product No EN 62479 Human exposure to EM fields Not tested. The module is compliant without testing because the TX power is less than 20 mW Evaluation required in case of multiple radios in co-location. No EN 60950 Safety Not tested because there aren’t any test cases that would concern the module Full evaluation with the end product No Table 23: CE standards summary for WT32i
Bluegiga Technologies Oy Page 59 of 64 Note: Because all the radiated emissions must be tested with the end product in any case and because the end product manufacturer is fully responsible for the compliance of the end product, any antenna can be selected for WT32i-E, not just the antenna type that Bluegiga has used in the CE approvals. 14.3 FCC Certification of an End Product In FCC there are three different levels of product authorization:  VERIFICATION o Required for digital devices. The end product manufacturer verifies device to FCC rules by performing the required tests and maintains the records in case of questions  DECLARATION OF CONFORMITY o Required for computer peripherals and receivers. The product manufacturer tests the emissions in a FCC recognized lab according to the relevant standards, maintains the records in case of questions and creates DoC which is supplied with the device. FCC logo must be placed on the product. The information about the DoC is shown in the user manual  CERTIFICATION o Required for most of the radio products. The radio has its own FCC ID and gets listed in FCC files https://apps.fcc.gov/oetcf/eas/reports/GenericSearch.cfm. The FCC ID is labeled on the product. When using modular certified module, re-certification with the end product is not needed provided that the conditions shown in the modules grant are fulfilled. The end product manufacturer is still responsible for the DoC or the Verification of the end product as required. The limitations and restrictions related to the modular certification of WT32i are described in the FCC grant of the module. If the conditions mentioned in the grant are met, then only labelling the end product with “Contains: QOQWT32I” is required. If the conditions are not met, then there are three options to remove the restriction for the end product:  Class 2 Permissive Change o Can be done either by Bluegiga or an agent authorized by Bluegiga. o The FCC ID of WT32i remains unchanged and the end product labelling requirements do not change  Change of ID o Can be done by authorization of Bluegiga o The FCC ID of WT32i is changed. o The end product is labelled according to the new FCC ID of the module (“Contains: XXXYYYY”) o NOTE: Bluegiga will not deliver modules with custom labelling.  New certification of the end product o Done by the end product manufacturer o Test reports of the module can be used to reduce the amount of testing When using WT32i-E, only the antenna types approved with the module can be used. WT32i-E is certified with a standard 2 dBi dipole. Any other type of antenna will require authorisation either through C2PC, Change of ID or new certification.
Bluegiga Technologies Oy Page 60 of 64 14.3.1 Co-location with Other Transmitters Co-location means co-transmission, not physical co-location. The radios are not considered to be in colocation when the physical separation is more than 20 cm or if the transmissions overlap less than 30 seconds. When two or more radios are in co-location human exposure must be evaluated as the sum of TX powers from all the radios transmitting simultaneously. The FCC grant of WT32i does not allow co-location so it will require authorization through C2PC, Change of ID or a new certification. 14.4 IC Certification of an End Product IC certification is much like FCC. In IC there are two types of product authorizations:  Verification  Certification When using a modular certified WT32i all that is needed, provided that WT32i is the only radio in the design, is labelling the end product with “Contains IC: 5123ABGTWT32I”. The responsibility for the radio certification remains with Bluegiga but the end product manufacturer is still responsible for the verification of the remaining parts of the product. Two main differences that are good to be aware of are:  If the TX power is less than 20 mW human exposure evaluation is not required  The test reports are valid for 1 year from the certification 14.5 MIC Japan Certification of an End Product WT32i has MIC Japan type certification and it can be used directly in the end product without need for recertification of the end product. Currently there aren’t any labelling requirements for an end product using a certified module but it is recommended to place some indication to the product that it contains certified radio module. 15 WT32i Certifications 15.1 Bluetooth TBA 15.2 CE WT32i is in conformity with the essential requirements and other relevant requirements of the R&TTE Directive (1999/5/EC). The product is conformity with the following standards and/or normative documents.  EMC (immunity only) EN 301 489-17 V2.1.1  Radiated emissions EN 300 328 V1.8.1  Safety EN60950-1:2006+A11:2009+A1:2010+A12:2011
Bluegiga Technologies Oy Page 61 of 64 15.3 FCC WT32i complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any changes or modifications not expressly approved by Bluegiga Technologies could void the user’s authority to operate the equipment. FCC RF Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter meets both portable and mobile limits as demonstrated in the RF Exposure Analysis. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. OEM Responsibilities to comply with FCC Regulations The WT32i module has been certified for integration into products only by OEM integrators under the following condition:  The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE: In the event that these conditions can not be met (for certain configurations or co-location with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid and the FCC ID and IC Certification Number can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC and Industry Canada authorization. If detachable antennas are used: This radio transmitter has been approved by FCC to operate with a 2.7 dBi dipole antenna. Any antenna of the same type and with equal or less gain can be used with WT32i-E without retesting. Antennas of a different type or higher gain will require authorization from FCC. End Product Labeling The WT32i module is labeled with its own FCC ID. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:
Bluegiga Technologies Oy Page 62 of 64 “Contains Transmitter Module FCC ID: QOQWT32I” or “Contains FCC ID: QOQWT32I” The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product 15.4 IC IC Statements: WT32i complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. End Product Labeling The WT32i module is labeled with its own IC Certification Number. If the IC Certification Number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: “Contains Transmitter Module IC: 5123A-BGTWT32I” or “Contains IC: 5123A-BGTWT32I” The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product If detachable antennas are used: This radio transmitter (identify the device by certification number, or model number ifCategory II) has been approved by Industry Canada to operate 2.7 dBi dipole antenna. Antenna types other than this, having a gain greater than 2.7 dBi, are strictly prohibited for use with this device. 15.4.1 IC Déclaration d’IC : Ce dispositif est conforme aux normes RSS exemptes de licence d’Industrie Canada. Son fonctionnement est assujetti aux deux conditions suivantes : (1) ce dispositif ne doit pas provoquer de perturbation et (2) ce dispositif doit accepter toute perturbation, y compris les perturbations qui peuvent entraîner un fonctionnement non désiré du dispositif.
Bluegiga Technologies Oy Page 63 of 64 Selon les réglementations d’Industrie Canada, cet émetteur radio ne doit fonctionner qu’avec une antenne d’une typologie spécifique et d’un gain maximum (ou inférieur) approuvé pour l’émetteur par Industrie Canada. Pour réduire les éventuelles perturbations radioélectriques nuisibles à d’autres utilisateurs, le type d’antenne et son gain doivent être choisis de manière à ce que la puissance isotrope rayonnée équivalente (P.I.R.E.) n’excède pas les valeurs nécessaires pour obtenir une communication convenable. Étiquetage du produit final Le module WT32I est étiqueté avec sa propre identification FCC et son propre numéro de certification IC. Si l’identification FCC et le numéro de certification IC ne sont pas visibles lorsque le module est installé à l’intérieur d’un autre dispositif, la partie externe du dispositif dans lequel le module est installé devra également présenter une étiquette faisant référence au module inclus. Dans ce cas, le produit final devra être étiqueté sur une zone visible avec les informations suivantes : « Contient module émetteur IC : 5123A-BGTWT32I » ou « Contient IC : 5123A-BGTWT32I » Dans le guide d’utilisation du produit final, l’intégrateur OEM doit s’abstenir de fournir des informations à l’utilisateur final portant sur les procédures à suivre pour installer ou retirer ce module RF ou pour changer les paramètres RF. 15.5 MIC Japan WT32i is has MIC Japan type approval with certification number 209-J00089. WT32i is certified as a module and it can be integrated into an end product without a need for additional MIC radio certification of the end product. 15.6 KCC (South Korea) TBA 15.7 Qualified Antenna Types for WT32i-E This device has been designed to operate with a 2.7 dBi dipole antenna. Any antenna of the same type and the same or less gain can be used without additional application to FCC.
Bluegiga Technologies Oy Page 64 of 64 16 Contact Information Sales: sales@bluegiga.com Technical Support: www.bluegiga.com/support Orders: orders@bluegiga.com WWW: www.bluegiga.com www.bluegiga.hk Head Office / Finland: Phone: +358-9-4355 060 Fax: +358-9-4355 0660 Sinikalliontie 5A 02630 ESPOO FINLAND Postal address / Finland: P.O. BOX 120 02631 ESPOO FINLAND Sales Office / USA: Phone: +1 770 291 2181 Fax: +1 770 291 2183 Bluegiga Technologies, Inc. 3235 Satellite Boulevard, Building 400, Suite 300 Duluth, GA, 30096, USA Sales Office / Hong-Kong: Phone: +852 3972 2186 Bluegiga Technologies Ltd.

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