Simcom 201606 LTE-FDD/HSPA MODULE User Manual SIM7500A V1 00 20160817

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SIM7500A_User Manual_V1.01
Smart Machine Smart Decision
Document Title
SIM7500A_User Manual
Version
V1.01
Date
2016-07-06
Status
Released
Document Control ID
SIM7500A_User Manual_V1.01
General Notes
SIMCom offers this information as a service to its customers to support the application and
engineering efforts that use the products designed by SIMCom. The information provided is based
on the requirements specifically from the customers. SIMCom has not undertaken any independent
search for additional relevant information, including any information that may be in the customer’s
possession. Furthermore, the system validation of the product designed by SIMCom within a larger
electronic system remains the responsibility of the customer or the customer’s system integrator.
All specifications supplied herein are subject to change without notice.
Copyright
This document contains the proprietary technical information which is the property of SIMCom
Limited, copying of this document, giving it to others, the using or communication of the contents
thereof are forbidden without the official authority by SIMCom. Offenders are liable to the
payment of the damages. All rights are reserved in the event of grant of a patent or the registration
of a utility model or design. All specifications supplied herein are subject to change without notice
Copyright © SIMCom Wireless Solutions Co., Ltd. 2016
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Contents
Contents .............................................................................................................................................3
Table Index ........................................................................................................................................5
Figure Index ......................................................................................................................................6
Revision History ................................................................................................................................7
Introduction ................................................................................................................................8
1.1 Product Outline .....................................................................................................................8
1.2 Hardware Interface Overview ...............................................................................................8
1.3 Hardware Block Diagram......................................................................................................9
1.4 Functional Overview .............................................................................................................9
Package Information................................................................................................................ 11
2.1 Pin Assignment Overview ................................................................................................... 11
2.2 Pin Description ....................................................................................................................13
2.3 Mechanical Information ......................................................................................................15
2.4 Footprint Recommendation .................................................................................................16
Interface Application ...............................................................................................................17
3.1 Power Supply ......................................................................................................................17
3.1.1 Power supply Design Guide .........................................................................................17
3.1.2 Recommended Power Supply Circuit ..........................................................................18
3.1.3 Voltage Monitor ............................................................................................................19
3.2 Power on/Power off/Reset Function....................................................................................19
3.2.1 Power on.......................................................................................................................19
3.2.2 Power off ......................................................................................................................20
3.2.3 Reset Function ..............................................................................................................21
3.3 UART Interface ...................................................................................................................22
3.3.1 UART Design Guide ....................................................................................................22
3.3.2 RI and DTR Behavior...................................................................................................24
3.4 USB Interface ......................................................................................................................24
3.4.1 USB Application Guide ................................................................................................25
3.5 USIM Interface....................................................................................................................25
3.5.1 USIM Application Guide..............................................................................................26
3.5.2 SIM Card Design Guide ...............................................................................................26
3.5.3 Recommended USIM Card Holder ..............................................................................27
3.6 PCM Interface .....................................................................................................................28
3.6.1 PCM Timing .................................................................................................................28
3.6.2 PCM Application Guide ...............................................................................................29
3.7 I2C Interface........................................................................................................................30
3.7.1 I2C Design Guide .........................................................................................................30
3.8 Network Status ....................................................................................................................31
3.9 Operating Status Indication .................................................................................................31
3.10
Pin Multiplex Function ....................................................................................................31
3.11
Other interface .................................................................................................................32
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3.11.1
3.11.2
Sink Current Source ..................................................................................................32
ADC ..........................................................................................................................33
RF Specifications ......................................................................................................................34
4.1 WCDMA/LTE RF Specifications........................................................................................34
4.2 WCDMA/LTE Antenna Design Guide................................................................................35
Electrical Specifications...........................................................................................................38
5.1 Absolute Maximum Ratings................................................................................................38
5.2 Operating Conditions ..........................................................................................................38
5.3 Operating Mode ..................................................................................................................39
5.3.1 Operating Mode Definition ..........................................................................................39
5.3.2 Sleep Mode ...................................................................................................................40
5.3.3 Minimum Functionality Mode and Flight Mode ..........................................................40
5.4 Current Consumption ..........................................................................................................40
5.5 ESD Notes ...........................................................................................................................41
SMT Production Guide ...........................................................................................................42
6.1 Top and Bottom View of Module ........................................................................................42
6.2 Label Information................................................................................................................42
6.3 Typical SMT Reflow Profile ...............................................................................................43
6.4 Moisture Sensitivity Level (MSL) ......................................................................................43
6.5 Stencil Foil Design Recommendation .................................................................................44
Packaging ..................................................................................................................................45
Appendix..........................................................................................................................................47
A. Reference Design......................................................................................................................47
B. Coding Schemes and Maximum Net Data Rates over Air Interface.........................................48
C. Related Documents ...................................................................................................................50
D. Terms and Abbreviations..........................................................................................................52
E. Safety Caution ...........................................................................................................................54
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Table Index
Table 1: SIM7500 series frequency bands............................................................................................................ 8
Table 2: General features ..................................................................................................................................... 9
Table 3: Pin Definitions ..................................................................................................................................... 12
Table 4: IO parameters definition....................................................................................................................... 13
Table 5: Pin description...................................................................................................................................... 13
Table 6: VBAT Pins electronic characteristic ..................................................................................................... 17
Table 7: Recommended zener diode list............................................................................................................. 18
Table 8: Power on timing and electronic characteristic ...................................................................................... 20
Table 9: Power off timing and Electronic Characteristic.................................................................................... 21
Table 10: RESET pin electronic characteristic ................................................................................................... 22
Table 11: USIM Electronic characteristic in 1.8V mode (USIM_VDD=1.8V) .................................................. 25
Table 12: USIM Electronic characteristic 3.0V mode (USIM_VDD=2.95V) .................................................... 26
Table 13: Amphenol USIM Socket Pin Description ........................................................................................... 27
Table 14: PCM Format ....................................................................................................................................... 28
Table 15: PCM Timing Parameters .................................................................................................................... 29
Table 16: NETLIGHT pin status ........................................................................................................................ 31
Table 17: Pin definition of the STATUS............................................................................................................. 31
Table 18: Pin multiplex function list .................................................................................................................. 32
Table 19: Sink current electronic characteristic ................................................................................................. 32
Table 20: ADC Electronic Characteristics.......................................................................................................... 33
Table 21: Conducted transmission power .......................................................................................................... 34
Table 22: Operating frequencies ........................................................................................................................ 34
Table 23: Conducted receive sensitivity ............................................................................................................. 35
Table 24: Reference sensitivity (QPSK) ............................................................................................................ 35
Table 25: Trace Loss .......................................................................................................................................... 35
Table 26: Recommended TVS ........................................................................................................................... 37
Table 28: Absolute maximum ratings................................................................................................................. 38
Table 29: Recommended operating ratings ........................................................................................................ 38
Table 30: 1.8V Digital I/O characteristics* ........................................................................................................ 38
Table 31: Operating temperature ........................................................................................................................ 39
Table 32: Operating mode Definitions ............................................................................................................... 39
Table 33: Current consumption on VBAT Pins (VBAT=3.8V) .......................................................................... 40
Table 34: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%) ............................. 41
Table 35: The Description of Label Information ................................................................................................ 43
Table 36: Moisture Sensitivity Level and Floor Life ......................................................................................... 44
Table 37: Tray size ............................................................................................................................................. 45
Table 38: Small Carton size ............................................................................................................................... 46
Table 39: Big carton size .................................................................................................................................... 46
Table 40: Coding schemes and maximum net data rates over air interface ........................................................ 48
Table 41: Related documents ............................................................................................................................. 50
Table 42: Terms and Abbreviations .................................................................................................................... 52
Table 43: Safety caution ..................................................................................................................................... 54
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Figure Index
Figure 1: SIM7500 series Block Diagram ............................................................................................................ 9
Figure 2: Pin assignment overview .................................................................................................................... 11
Figure 3: Dimensions (Unit: mm) ...................................................................................................................... 15
Figure 4: Footprint recommendation (Unit: mm) ............................................................................................... 16
Figure 5: Power supply application circuit......................................................................................................... 17
Figure 6: Linear regulator reference circuit ....................................................................................................... 18
Figure 7: Switching mode power supply reference circuit ................................................................................. 18
Figure 8: Reference Power on/off Circuit .......................................................................................................... 19
Figure 9: Power on timing sequence .................................................................................................................. 20
Figure 10: Power off timing sequence ............................................................................................................... 21
Figure 11: Reference reset circuit ...................................................................................................................... 22
Figure 12: UART full modem ............................................................................................................................ 23
Figure 13: UART null Modem ........................................................................................................................... 23
Figure 14: Reference circuit of level shift .......................................................................................................... 23
Figure 15: RI behaviour（SMS and URC report） ........................................................................................... 24
Figure 16: RI behaviour（voice call） .............................................................................................................. 24
Figure 17: USB reference circuit ....................................................................................................................... 25
Figure 18: USIM interface reference circuit ...................................................................................................... 26
Figure 19: Amphenol SIM card socket .............................................................................................................. 27
Figure 20: PCM_SYNC timing.......................................................................................................................... 28
Figure 21: EXT codec to module timing ............................................................................................................ 28
Figure 22: Module to EXT codec timing ........................................................................................................... 29
Figure 23: Audio codec reference circuit ........................................................................................................... 30
Figure 24: I2C reference circuit ......................................................................................................................... 30
Figure 25: NETLIGHT reference circuit............................................................................................................ 31
Figure 26: ISINK reference circuit..................................................................................................................... 32
Figure 27: Antenna matching circuit (MAIN_ANT) .......................................................................................... 36
Figure 28: Antenna matching circuit (DIV_ANT) ............................................................................................. 36
Figure 31: Top and bottom view of Module....................................................................................................... 42
Figure 32: Label Information ............................................................................................................................. 42
Figure 33: The ramp-soak-spike Reflow Profile of Module............................................................................... 43
Figure 34: Packaging introduce ......................................................................................................................... 45
Figure 35: Module tray drawing introduce......................................................................................................... 45
Figure 36: Small carton drawing introduce ........................................................................................................ 46
Figure 37: Big carton drawing introduce ........................................................................................................... 46
Figure 38: Reference design .............................................................................................................................. 47
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Revision History
Data
Version
Description of change
Author
2016-07-06
V1.01
new
Shengwu.sun
SIM7500A_User Manual_V1.01
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1 Introduction
This document describes the electronic specifications, RF specifications, interfaces, mechanical
characteristics and testing results of the SIMCom SIM7500 series. With the help of this document
and other software application notes/user guides, users can understand and use modules to design
and develop applications quickly.
1.1
Product Outline
The SIM7500A support many air-interface standards, refer to the following table.
Table 1: SIM7500 series frequency bands
Standard
WCDMA
Frequency
SIM7500A
BAND2

BAND5

LTE-FDD B1
LTE-FDD B2

LTE-FDD B3
LTE
LTE-FDD B4

LTE-FDD B7
LTE-FDD B8
LTE-FDD B17

LTE-FDD B20
With a small physical dimension of 24*27*2.75 mm and with the functions integrated, the Module
can meet almost any space requirement in users’ applications, such as smart phones, PDA’s,
industrial handhelds, machine-to-machine, vehicle applications, etc.
1.2
Hardware Interface Overview
The interfaces that are described in detail in the next chapters include:
● Power Supply
● USB Interface
● UART Interface
● USIM Interface
● GPIO
● ADC
● Power Output
● Current Sink Source
● PCM Interface
● I2C Interface
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1.3
Hardware Block Diagram
The block diagram of the Module is shown in the figure below.
GNSS Antenna
Main Antenna
DDR
AUX Antenna
NAND
Flash
GNSS RF
GSM/WCDMA
/LTE
RF FEM
TX
WCDMA
/LTE
RF FEM
SMT Interface
Qualcomm
Chip
RX
RX
Baseband
RF
Transceiver
GSM/
WCDMA/LTE PA
USIM
UART
I2C
PCM
USB
Interrupt
GPIOs
ADC
Status LED
LDO
Sink Current Source
SYSTEM POWER
XO
19.2MHz
Power
Management
VBAT
Power On
Reset
VBAT
Figure 1: SIM7500 series Block Diagram
1.4
Functional Overview
Table 2: General features
Feature
Implementation
Power supply
Single supply voltage 3.4～4.2V
Power saving
Current in sleep mode : <5mA
Please refer to the table 1
WCDMA: Class 3 (0.25W)
LTE: Class 3 (0.25W)
Radio frequency bands
Transmitting power
Data Transmission
Throughout
HSPA+: 5.76 Mbps(UL), 42 Mbps(DL)
LTE Category 1: 10 Mbps (DL)
LTE Category 1: 5 Mbps (UL)
Antenna
WCDMA /LTE main antenna
WCDMA /LTE auxiliary antenna
SMS
MT, MO, CB, Text and PDU mode
SMS storage: USIM card or ME(default)
Transmission of SMS alternatively over CS or PS.
USIM interface
Support identity card: 1.8V/ 3V
USIM application toolkit
Support SAT class 3, GSM 11.14 Release 98
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Phonebook management
Support USAT
Support phonebook types: DC,MC,RC,SM,ME,FD,ON,LD,EN
Audio feature
Support PCM interface
Only support PCM master mode and short frame sync, 16-bit linear data
formats
UART interface
A full modem serial port by default
Baud rate: 300bps to 4Mbps(default:115200bps)
Auto-bauding baud rate: 9600,19200,38400,57600,115200bps
Can be used as the AT commands or data stream channel.
Support RTS/CTS hardware handshake
Multiplex ability according to GSM 07.10 Multiplexer Protocol.
USB
Firmware upgrade USB
Physical characteristics
Temperature range
USB 2.0 specification-compliant as a peripheral
Firmware upgrade over USB interface
USB 2.0 specification-compliant as a peripheral
Weight:4.0 g
Size:24*27*2.75mm
Normal operation temperature: -30°C to +80°C
Extended operation temperature: -40°C to +85°C*
Storage temperature -45°C to +90°C
*Note: Module is able to make and receive voice calls, data calls, SMS and make
WCDMA/HSPA+/LTE traffic in -40℃ ~ +85℃. The performance will be reduced slightly from
the 3GPP specifications if the temperature is outside the normal operating temperature range
and still within the extreme operating temperature range.
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2 Package Information
2.1
Pin Assignment Overview
GNSS_ANT
GND
GND
NETLIGHT
DBG_TXD
STATUS
GPIO_49
GPIO_37
GND
GND
MAIN_ANT
GND
52
51
50
49
48
47
46
45
44
43
GND
42
RI
41
CTS
40
DTR
39
RXD
38
TXD
37
DCD
36
RTS
35
GND
34
VBAT
33
VBAT
32
GND
SIM7500x
SDA
GND
USB_DM
USB_DP
VBUS
53
SCL
54
GND
55
DIV_ANT
56
GND
GND
All functions of the SIM7500 series will be provided through 56 pads that will be connected to the
customers’ platform. The following Figure is a high-level view of the pin assignment of the
SIM7500 series.
DBG_TXD
LTE_ACTIVE
Top View
PWRKEY
GND
15
29
GND
27
28
24
26
23
25
22
21
18
20
17
19
16
GND
30
ISINK
14
GPIO_1
SIM_VDD
ADC
GND
RESET
31
L11_1V8
13
GND
SIM_RST
PCM_OUT
12
PCM_IN
SIM_DET
PCM_SYNC
11
PCM_CLK
SIM_CLK
I2S_MCLK
10
GND
SIM_DATA
Figure 2: Pin assignment overview
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Table 3: Pin Definitions
Pin No.
Pin Name
Pin No.
Pin Name
GND
DIV_ANT
GND
SCL
SDA
GND
USB_DM
USB_DP
VBUS
10
USIM_DATA
11
USIM_CLK
12
USIM_DET
13
USIM_RST
14
USIM_VDD
15
GND
16
GND
17
MCLK
18
PCM_CLK
19
PCM_SYNC
20
PCM_IN
21
PCM_OUT
22
GND
23
L11_1V8
24
RESET
25
ADC
26
GPIO_1
27
ISINK
28
GND
29
GND
30
PWRKEY
31
GND
32
GND
33
VBAT
34
VBAT
35
GND
36
RTS
37
DCD
38
TXD
39
RXD
40
DTR
41
CTS
42
RI
43
GND
44
GND
45
MAIN_ANT
46
GND
47
GND
48*
GPIO_37
49
GPIO_49
50
STATUS
51
DBG_TXD
52
NETLIGHT
53
GND
54
GND
55
GNSS_ANT
56
GND
*Note: SIM7500A could not support GNSS Function.
Before the normal power up, pin48 cannot be pulled up.
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2.2
Pin Description
Table 4: IO parameters definition
Pin type
Description
PI
Power input
PO
Power output
AI
Analog input
AIO
Analog input/output
I/O
Bidirectional input /output
DI
Digital input
DO
Digital output
DOH
Digital output with high level
DOL
Digital output with low level
PU
Pull up
PD
Pull down
Table 5: Pin description
Pin name
Pin No.
Default
status
Description
33,34
PI
Power supply, voltage range: 3.4～
4.2V.
PO
1.8V output with Max. 50Ma
current output for external circuit,
such as level shift circuit.
Comment
Power Supply
VBAT
L11_1V8
23
GND
1, 3, 6,
15,16,22
,28,29,3
1,32,35,
43,44,46
,47,53,5
4,56
If unused, keep it
open.
Ground
System Control
PWRKEY
RESET
30
24
DI,PU
System power on/off control input,
active low.
DI, PU
System reset control input, active
low.
Default 0.8V
RESET has been
pulled up to 1.8V
via a resistor
internally.
USIM interface
USIM_DATA
10
I/O,PU
USIM Card data I/O, which has
been pulled up via a 100KR resistor
to USIM_VDD internally.
USIM_RST
13
DO
USIM Reset
SIM7500A_User Manual_V1.01
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All lines of USIM
interface should
be protected
against ESD.
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USIM_CLK
DO
USIM clock
14
PO
Power output for USIM card, its
output Voltage depends on USIM
card type automatically. Its output
current is up to 50Ma.
VBUS
DI,PD
Valid USB detection input with
3.6～5.85V detection voltage
USB_DM
I/O
Negative line of the differential,
bi-directional USB signal.
I/O
Positive line of the differential,
bi-directional USB signal.
RTS
36
DOH
Request to send
CTS
41
DI,PU
Clear to Send
RXD
39
DI,PU
Receive Data
RI
42
DOH
Ring Indicator
DCD
37
DOH
Carrier detects
TXD
DTR
38
40
DOH
DI,PU
Transmit Data
DTE get ready
SCL
DO
I2C clock output
SDA
I/O
I2C data input/output
PCM_OUT
21
DO
PCM data output.
PCM_IN
20
DI
PCM data input.
PCM_SYNC
19
DO
PCM data frame sync signal.
PCM_CLK
18
DO
PCM data bit clock.
MCLK
17
DO
Audio Master clock
NETLIGHT
52
DO
STATUS
50
DO
GPIO_1
26
IO
LED control output as network
status indication.
Operating status output.
High level: Power on and firmware
ready
Low level: Power off
GPIO
GPIO_49
49
IO
GPIO
USIM_VDD
11
USB
USB_DP
UART interface
If unused, keep
them open.
I2C interface
If unused, keep
them open.
PCM interface
If unused, please
keep them open.
GPIO
USIM_DET
12
IO
GPIO_37
48
IO
SIM7500A_User Manual_V1.01
If unused, please
keep them open.
Default: GPIO
Optional: USIM card detecting
input.
H: USIM is removed
L: USIM is inserted
GPIO
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RF interface
MAIN _ANT
45
AIO
MAIN antenna soldering pad
DIV_ANT
AI
Auxiliary antenna soldering pad
NC
55
AI
ISINK
27
AI
Ground-referenced current sink.
DGB_TXD
51
DO
Use for debug
ADC
25
AI
Analog-digital converter input
Other interface
2.3
If unused, please
keep them open.
Mechanical Information
The following figure shows the package outline drawing of Module.
Figure 3: Dimensions (Unit: mm)
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2.4
Footprint Recommendation
Figure 4: Footprint recommendation (Unit: mm)
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3 Interface Application
3.1
Power Supply
On VBAT pads, a ripple current up to 2A typically, may cause voltage drop. Therefore, the power
supply for these pads must be able to provide sufficient current up to more than 2A in order to
avoid the voltage drop of more than 300mV.
Table 6: VBAT Pins electronic characteristic
Symbol
Description
VBAT
Module power voltage
3.4
3.8
IVBAT(peak)
Module power peak current in normal mode.
1.0
IVBAT(average)
Module power average current in normal mode
IVBAT(sleep)
Power supply current in sleep mode
IVBAT(power-off)
Module power current in power off mode.
3.1.1
Min.
Typ.
Max.
Unit
4.2
Please refer to the table 34
20
uA
Power supply Design Guide
Make sure that the voltage on the VBAT pins will never drop below 3.4V.
Note: If the power supply for BAT pins can support up to 2A, using a total of more than 220uF
capacitors is recommended, or else users must use a total of 1000uF capacitors, in order to avoid
the voltage drop of more than 300mV.
Some multi-layer ceramic chip (MLCC) capacitors (0.1/1uF) with low ESR in high frequency band
can be used for EMC.
These capacitors should be put as close as possible to VBAT pads. Also, user should keep VBAT
trace on the circuit board wider than 2 mm to minimize PCB trace impedance. The following figure
shows the recommended circuit.
VBAT
VBAT
FB101
34
VBAT
33
33pF
C101
MODULE
GND
GND
220uF
C102
5.1V
500mW
32
31
Figure 5: Power supply application circuit
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In addition, in order to guard over voltage protection, it is suggested to use a zener diode with 5.1V
reverse zener voltage and more than 500mW power dissipation.
Table 7: Recommended zener diode list
No.
Manufacturer
Part Number
power dissipation
Package
On semi
MMSZ5231BT1G
500mW
SOD123
Prisemi
PZ3D4V2H
500mW
SOD323
Vishay
MMSZ4689-V
500mW
SOD123
Crownpo
CDZ55C5V1SM
500mW
0805
3.1.2
Recommended Power Supply Circuit
It is recommended that a switching mode power supply or linear regulator power supply is used. It
is important to make sure that all the components used in the power supply circuit can resist a peak
current up to 2A.
The following figure shows the linear regulator reference circuit with 5V input and 3.8V output.
FUSE
C101
100uF
C102
1uF
U101 MIC29302
Vout
Vin
On/Off
PWR_CTRL
GND
DC INPUT
VBAT
FB 5
R101
100K
+ C103
C104
330uF 100nF
R103
470R
R102
47K
Figure 6: Linear regulator reference circuit
If there is a big voltage difference between input and output for VBAT power supply, or the
efficiency is extremely important, then a switching mode power supply will be preferable. The
following figure shows the switching mode power supply reference circuit.
FUSE
C101
100uF
+ C102
1uF
PWR_CTRL
On/Off
GND
U101 LM2596- ADJ
Vin
Vout 2
DC INPUT
FB 4
FB101
L101
100uH
D102
C103
330uF
MBR360
VBAT
270 ohm@100Mhz
C104
100nF
R101
2.2K
R102
1K
Figure 7: Switching mode power supply reference circuit
Note: The Switching Mode power supply solution for VBAT must be chosen carefully against
Electro Magnetic Interference and ripple current from depraving RF performance.
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3.1.3
Voltage Monitor
To monitor the VBAT voltage, the AT command “AT+CBC” can be used.
For monitoring the VBAT voltage outside or within a special range, the AT command
“AT+CVALARM” can be used to enable the under-voltage warning function.
If users need to power off Module, when the VBAT voltage is out of a range, the AT command
“AT+CPMVT” can be used to enable under-voltage power-off function.
Note: Under-voltage warning function and under-voltage power-off function are disabled by
default. For more information about these AT commands, please refer to Document [1].
3.2
3.2.1
Power on/Power off/Reset Function
Power on
Module can be powered on by pulling the PWRKEY pin down to ground.
The PWRKEY pin has been pulled up to dVDD internally, so you does not need to pull it up
externally. It is strongly recommended to put a100nF capacitor and an ESD protection diode close
to the PWRKEY pin. Please refer to the following figure for the recommended reference circuit.
dVDD
Diode
Turn on /off
impulse
PWRKEY
100Ω
Power
On off logic
4.7K
100nF
47K
MODULE
Figure 8: Reference Power on/off Circuit
The power-on scenarios are illustrated in the following figure.
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VBAT
Ton
PWRKEY
(Input)
Ton(status)
STATUS
(Output)
Ton(uart)
UART Port
Active
Undefined
USB Port
Ton(usb)
Active
Undefined
Figure 9: Power on timing sequence
Table 8: Power on timing and electronic characteristic
Symbol
Parameter
Ton
The time of active low level impulse of PWRKEY
pin to power on module
Ton(status)
The time from power-on issue to STATUS pin
output high level(indicating power up ready )
Ton(uart)
The time from power-on issue to UART port ready
20
Ton(usb)
The time from power-on issue to USB port ready
20
VIH
Input high level voltage on PWRKEY pin
0.6
0.8
1.8
VIL
Input low level voltage on PWRKEY pin
-0.3
0.5
3.2.2
Min.
Typ.
100
500
22
Max.
Unit
ms
Power off
The following methods can be used to power off Module.
● Method 1: Power off Module by pulling the PWRKEY pin down to ground.
● Method 2: Power off Module by AT command “AT+CPOF”.
● Method 3: Over-voltage or under-voltage automatic power off. The voltage range can be set by
AT command “AT+CPMVT”.
● Method 4: Over-temperature or under-temperature automatic power off.
Note: If the temperature is outside the range of -30~+80℃, some warning will be reported via
AT port. If the temperature is outside the range of -40~+85
℃, M odule will be powered
automatically.
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For details about “AT+CPOF” and “AT+CPMVT”, please refer to Document [1].
These procedures will make modules disconnect from the network and allow the software to enter a
safe state and save data before modules are powered off completely.
The power off scenario by pulling down the PWRKEY pin is illustrated in the following figure.
Toff-on
Ton
Toff
PWRKEY
( Input )
STATUS
( Output )
Toff(status)
Toff(uart)
Active
UART Port
Undefined
Toff(usb)
Active
USB Port
Undefined
Figure 10: Power off timing sequence
Table 9: Power off timing and Electronic Characteristic
Symbol
Parameter
Toff
Time value
Unit
Min.
Typ.
Max.
The active low level time pulse on PWRKEY pin to
power off module
2.5
--
--
Toff(status)
The time from power-off issue to STATUS pin output
low level(indicating power off )*
22
Toff(uart)
The time from power-off issue to UART port off
15
Toff(usb)
The time from power-off issue to USB port off
15
Toff-on
The buffer time from power-off issue to power-on
issue
3.2.3
Reset Function
Module can be reset by pulling the RESET pin down to ground.
Note: This function is only used as an emergency reset when AT command “AT+CPOF” and the
PWRKEY pin all have lost efficacy.
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The RESET pin has been pulled up to 1.8V internally, so it does not need to be pulled up externally.
It is strongly recommended to put a100nF capacitor and an ESD protection diode close to the
RESET pin. Please refer to the following figure for the recommended reference circuit.
1.8V
Reset
impulse
RESET
100Ω
Reset
Logic
100nF
MODULE
Figure 11: Reference reset circuit
Table 10: RESET pin electronic characteristic
Symbol
Description
Min.
Treset
The active low level time impulse on
RESET pin to reset module
100
VIH
Input high level voltage
1.17
1.8
2.1
VIL
Input low level voltage
-0.3
0.8
3.3
Typ.
Max.
Unit
ms
UART Interface
Module provides a 7-wire UART (universal asynchronous serial transmission) interface as DCE
(Data Communication Equipment). AT commands and data transmission can be performed through
UART interface.
3.3.1
UART Design Guide
The following figures show the reference design.
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MODULE ( DCE)
HOST ( DTE)
TXD
RXD
TXD
RXD
RTS
CTS UART
DTR
DCD
RING
RTS
CTS
DTR
DCD
RI
UART
Figure 12: UART full modem
MODULE ( DCE)
HOST ( DTE)
TXD
RXD
TXD
RXD
RTS
CTS UART
DTR
DCD
RING
Interrupt
UART
RTS
CTS
DTR
DCD
RI
Wake up host
Figure 13: UART null Modem
The Module UART is 1.8V voltage interface. If user’s UART application circuit is a 3.3V voltage
interface, the level shifter circuits should be used for voltage matching. The TXB0108RGYR
provided by Texas Instruments is recommended. The following figure shows the voltage matching
reference design.
VDD_1V8 or
External 1V8
MODULE
100nF
100nF
VCCA VCCB
OE
GND
TXD
RXD
RTS
CTS
DTR
DCD
RI
3.3V
47K
A1
A2
A3
A4
A5
A6
A7
B1
B2
B3
B4
B5
B6
B7
A8
B8
47K
TXD_3.3V
RXD_3.3V
RTS_3.3V
CTS_3.3V
DTR_3.3V
DCD_3.3V
RI_3.3V
UART port
Figure 14: Reference circuit of level shift
To comply with RS-232-C protocol, the RS-232-C level shifter chip should be used to connect
Module to the RS-232-C interface, for example SP3238ECA, etc.
Note: Module supports the following baud rates: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400,
57600, 115200, 230400, 460800, 921600, 3200000, 3686400, 4000000bps. The default band rate
is 115200bps.
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3.3.2
RI and DTR Behavior
The RI pin can be used to interrupt output signal to inform the host controller such as application
CPU.
Normally RI will stay at high level until certain conditions such as receiving SMS, or a URC report
come in. It will then change to low level. It will stay low until the host controller clears the
interrupted event with “AT+CRIRS” AT command.
RI
Idle
Receiving SMS and any
URC report coming.
AT+CFGRI=1
Clear by AT+CRIRS
Idle
Receiving SMS .
AT+CFGRI=0
Clear by AT+CRIRS
HIGH
LOW
RI
HIGH
LOW
Figure 15: RI behaviour（SMS and URC report）
Normally RI will be kept high until a voice call, then it will output periodic rectangular wave with
5900ms low level and 100ms high level. It will output this kind of periodic rectangular wave until
the call is answered or hung up.
HIGH
LOW
RI
5900ms
Idle
Ring
100ms
Hang up
the call
Establish
the call
Idle
Figure 16: RI behaviour（voice call）
Note: For more details of AT commands about UART, please refer to document [1] and [22].
DTR pin can be used to wake Module from sleep. When Module enters sleep mode, pulling down
DTR can wake Module.
3.4
USB Interface
The Module contains a USB interface compliant with the USB2.0 specification as a peripheral, but
the USB charging function is not supported.
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3.4.1
USB Application Guide
Module can be used as a USB device. Module supports the USB suspend and resume mechanism
which can reduce power consumption. If there is no data transmission on the USB bus, Module will
enter suspend mode automatically and will be resumed by some events such as voice call, receiving
SMS, etc.
MODULE
USB
HOST
USB_VBU
USB_DM
Bead
USB_DP
GND
D1
D2 D3
VBUS
DD+
GND
USB
Figure 17: USB reference circuit
Because of the high bit rate on USB bus, more attention should be paid to the influence of the
junction capacitance of the ESD component on USB data lines. Typically, the capacitance should
be less than 1pF. It is recommended to use an ESD protection component such as ESD9L5.0ST5G
provided by On Semiconductor (www.onsemi.com ).
D3 is suggested to select the diode with anti-ESD and voltage surge function, or customer could
add a ZENER diode for surge clamping. The recommend diodes list please refer to table 7.
L is recommended (MURATA) DLW21SN371SQ2L.
Note ： The USB_DM and USB_DP nets must be traced by 90Ohm+/-10% differential
impedance.
3.5
USIM Interface
Module supports both 1.8V and 3.0V USIM Cards.
Table 11: USIM Electronic characteristic in 1.8V mode (USIM_VDD=1.8V)
Symbol
Parameter
Min.
Typ.
Max.
Unit
USIM_
VDD
LDO power output voltage
1.75
1.8
1.95
VIH
High-level input voltage
0.65*USIM_VDD
USIM_VDD +0.3
VIL
Low-level input voltage
-0.3
0.35*USIM_VDD
VOH
High-level output voltage
USIM_VDD -0.45
USIM_VDD
VOL
Low-level output voltage
0.45
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Table 12: USIM Electronic characteristic 3.0V mode (USIM_VDD=2.95V)
Symbol
Parameter
Min.
Typ.
Max.
Unit
USIM_
VDD
LDO power output voltage
2.75
2.95
3.05
VIH
High-level input voltage
0.65*USIM_VDD
USIM_VDD +0.3
VIL
Low-level input voltage
-0.3
0.25*USIM_VDD
VOH
High-level output voltage
USIM_VDD -0.45
USIM_VDD
VOL
Low-level output voltage
0.45
3.5.1
USIM Application Guide
It is recommended to use an ESD protection component such as ESDA6V1W5 produced by ST
(www.st.com ) or SMF15C produced by ON SEMI (www.onsemi.com ). Note that the USIM
peripheral circuit should be close to the USIM card socket. The following figure shows the 6-pin
SIM card holder reference circuit.
100nF
SIM CARD
USIM_VDD
USIM_RST
MODULE
USIM_CLK
51Ω
51Ω
USIM_DATA
51Ω
22pF 22pF
VCC
RST
CLK
GND
VPP
I/O
C707 10M006 512
22pF
ESDA6V1
Figure 18: USIM interface reference circuit
Note: USIM_DATA has been pulled up with a 100KΩ resistor to USIM_VDD in module. A
100nF capacitor on USIM_VDD is used to reduce interference. For more details of AT
commands about USIM, please refer to document [1].
3.5.2
SIM Card Design Guide
SIM card signal could be interferenced by some high frequency signal, it is strongly recommended
to follow these guidelines while designing:

SIM card holder should be far away from antenna

SIM traces should keep away from RF lines, VBAT and high-speed signal lines
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






3.5.3
The traces should be as short as possible
Keep SIM card holder’s GND connect to main ground directly
Shielding the SIM card signal by ground well
Recommended to place a 100nF capacitor on SIM_VDD line and keep close to the SIM
card holder
Add some TVS which parasitic capacitance should not exceed 50pF
Add 51Ω resistor to (SIM_RST/SIM_CLK/SIM_DATA) signal could enhance ESD
protection
Add 22pF capacitor to (SIM_RST/SIM_CLK/SIM_DATA) signal to induce RF signal
interference
Recommended USIM Card Holder
It is recommended to use the 6-pin USIM socket such as C707 10M006 512 produced by
Amphenol. User can visit http://www.amphenol.com for more information about the holder.
Figure 19: Amphenol SIM card socket
Table 13: Amphenol USIM Socket Pin Description
Pin
C1
C2
Signal
USIM_VDD
USIM_RST
Description
USIM Card Power supply.
USIM Card Reset.
C3
C5
C6
C7
USIM_CLK
GND
VPP
USIM_DATA
USIM Card Clock.
Connect to GND.
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3.6
PCM Interface
Module provides a PCM interface for external codec, which can be used in master mode with short
sync and 16 bits linear format.
Table 14: PCM Format
Characteristics
Specification
Line Interface Format
Linear(Fixed)
Data length
16bits(Fixed)
PCM Clock/Sync Source
Master Mode(Fixed)
PCM Clock Rate
2048 KHz (Fixed)
PCM Sync Format
Short sync(Fixed)
Data Ordering
MSB
Note: For more details about PCM AT commands, please refer to document [1].
3.6.1
PCM Timing
Module supports 2.048 MHz PCM data and sync timing for 16 bits linear format codec.
Figure 20: PCM_SYNC timing
Figure 21: EXT codec to module timing
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Figure 22: Module to EXT codec timing
Table 15: PCM Timing Parameters
Parameter
Description
Min.
Typ.
Max.
Unit
T(sync)
PCM_SYNC cycle time
–
125
–
μs
T(synch)
PCM_SYNC high level time
–
488
–
ns
T(syncl)
PCM_SYNC low level time
–
124.5
–
μs
T(clk)
PCM_CLK cycle time
–
488
–
ns
T(clkh)
PCM_CLK high level time
–
244
–
ns
T(clkl)
PCM_CLK low level time
–
244
–
ns
T(susync)
PCM_SYNC setup time high before falling edge of
PCM_CLK
–
122
–
ns
T(hsync)
PCM_SYNC hold time after falling edge of
PCM_CLK
–
366
–
ns
T(sudin)
PCM_IN setup time before falling edge of
PCM_CLK
60
–
–
ns
T(hdin)
PCM_IN hold time after falling edge of PCM_CLK
60
–
–
ns
T(pdout)
Delay from PCM_CLK rising to PCM_OUT valid
–
–
60
ns
T(zdout)
Delay from PCM_CLK falling to PCM_OUT
HIGH-Z
–
–
60
ns
3.6.2
PCM Application Guide
The following figure shows the external codec reference design.
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3.3V 3.8V VDD_1V8
VDDA
VDDSPK
VDDD
PCM_IN
ADCOUT
DACIN
FS
BCLK
PCM_OUT
PCM_SYNC
PCM_CLK
MODULE
1.3K
MICBIAS
MIC+
MIC-
MIC
MCLK
SCL
SDA
SCLK
SDIO
1uF
1uF
1.3K
MOUT
47uF
47uF
NAU8810
SPK
33pF
Figure 23: Audio codec reference circuit
Note: Module can transmit PCM data by the USB port besides the PCM interface. For more
details please refer to documents [1] and [23].
3.7
I2C Interface
Module provides a I2C interface compatible with I2C specification, version 2.1, with clock rate up
to 400 kbps. Its operation voltage is 1.8V.
3.7.1
I2C Design Guide
The following figure shows the I2C bus reference design.
SCL
SCL
SDA
SDA
GND
Module
GND
Device
Figure 24: I2C reference circuit
Note：
SDA and SCL have pull-up resistors in module. So, 2 external pull up resistors are not needed in
application circuit.
“AT+CRIIC and AT+CWIIC” AT commands could be used to read/write register values of the
I2C peripheral devices. For more details about AT commands please refer to document [1].
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3.8
Network Status
The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the
following figure.
VBAT
Module
4.7K
NETLIGHT
47K
Figure 25: NETLIGHT reference circuit
Note: The value of the resistor named “R” depends on the LED characteristic.
Table 16: NETLIGHT pin status
NETLIGHT pin status
Always On
200ms ON, 200ms OFF
800ms ON, 800ms OFF
Module status
Searching Network/Call Connect
Data Transmit
Registered network
OFF
Power off / Sleep
Note: NETLIGHT output low level as “OFF”, and high level as “ON”.
3.9
Operating Status Indication
The pin50 is for operating status indication of the module. The pin output is high when module is
powered on, and output is low when module is powered off.
Table 17: Pin definition of the STATUS
Pin name
Pin number
Description
STATUS
50
Operating status indication
Note: For timing about STATUS, please reference to the chapter “3.2 power on/down scenarios”
3.10 Pin Multiplex Function
Some pins of Module could be used for alternate function besides default function.
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Table 18: Pin multiplex function list
Pin Number Pin Name
Default Function
Alternate Function
SCL
SCL
GPIO11
SDA
SDA
GPIO10
12
USIM_DET
GPIO34
18
PCM_CLK
PCM_CLK
19
PCM_SYNC
PCM_SYNC
USIM_DET
GPIO23,SPI_CLK
I2C_SCL
GPIO20,SPI_MOSI
20
PCM_IN
PCM_IN,
21
PCM_OUT
PCM_OUT
GPIO21,SPI_MISO
GPIO22,SPI_CS_N
I2C_SDA
Note：For more details of AT commands about GPIO multiplex function, please refer to
document [1].
3.11 Other interface
3.11.1 Sink Current Source
The ISINK pin is VBAT tolerant and intended to drive some passive devices such as LCD
backlight, white LED, etc. Its output current can be up to 40 mA and be set by the AT command
“AT+ CLEDITST”.
Table 19: Sink current electronic characteristic
Symbol
Description
Min.
Typ.
Max.
Unit
VISINK
Voltage tolerant
0.5
VBAT
IISINK
Current tolerant
40
mA
ISINK is a ground-referenced current sink. The following figure shows its reference circuit.
VBAT
ISINK pin is VBAT
tolerant-suitable for driving
white LEDs
Passive
device
ISINK
MODULE
Current Controls
Figure 26: ISINK reference circuit
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Note: The sinking current can be adjusted to meet the design requirement through the AT
command “AT+ CLEDITST =<0>, ”.The “value” ranges from 0 to 8, on behalf of the
current from 0mA to 40mA by 5mA step.
3.11.2 ADC
Module has 1 dedicated ADC pins named ADC. They are available for digitizing analog signals
such as battery voltage and so on. These electronic specifications are shown in the following table.
Table 20: ADC Electronic Characteristics
Characteristics
Resolution
Input Range
Input serial resistance
Min.
Typ.
15
–
0.1
Max.
–
1.7
–
–
Unit
Bits
MΩ
Note: “AT+CADC” can be used to read the voltage of the ADC pins, for more details, please
refer to document [1].
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4 RF Specifications
4.1
WCDMA/LTE RF Specifications
Table 21: Conducted transmission power
Frequency
E-GSM900
DCS1800
E-GSM900 (8-PSK)
DCS1800 (8-PSK)
WCDMA B2
WCDMA B5
LTE-FDD B1
LTE-FDD B2
LTE-FDD B3
LTE-FDD B4
LTE-FDD B7
LTE-FDD B8
LTE-FDD B17
LTE-FDD B20
Power
33dBm ±2dB
30dBm ±2dB
27dBm ±3dB
26dBm +3/-4dB
24dBm +1/-3dB
24dBm +1/-3dB
23dBm +/-2.7dB
23dBm +/-2.7dB
23dBm +/-2.7dB
23dBm +/-2.7dB
23dBm +/-2.7dB
23dBm +/-2.7dB
23dBm +/-2.7dB
23dBm +/-2.7dB
Min.
5dBm ± 5dB
0dBm ± 5dB
5dBm ± 5dB
0dBm ±5dB
<-50dBm
<-50dBm
<-40dBm
<-40dBm
<-40dBm
<-40dBm
<-40dBm
<-40dBm
<-40dBm
<-40dBm
Table 22: Operating frequencies
Frequency
E-GSM900
DCS1800
WCDMA B2
WCDMA B5
LTE-FDD B1
LTE-FDD B2
LTE-FDD B3
LTE-FDD B4
LTE-FDD B7
LTE-FDD B8
LTE-FDD B17
LTE-FDD B20
Receiving
925～960
MHz
1805～1880 MHz
1930~1990 MHz
869~894 MHz
1920 ~1980 MHz
1930 ~1990 MHz
1710 ~1785 MHz
2110 ~2155 MHz
2500 ~2570 MHz
880 ~915 MHz
734 ~746 MHz
832 ~862 MHz
Transmission
880～915
MHz
1710～1785 MHz
1850~1910 MHz
824~849 MHz
2110 ~2170 MHz
1850 ~1910 MHz
1805 ~1880 MHz
1710 ~1755 MHz
2620~2690 MHz
925~960 MHz
704 ~716 MHz
791~821 MHz
GPS
1574.4 ～1576.44 MHz
GLONASS
1598 ～1606 MHz
BD
1559 ～1563 MHz
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Table 23: Conducted receive sensitivity
Frequency
Receive sensitivity(Typical)
Receive sensitivity(MAX)
E-GSM900
< -109dBm
3GPP
DCS1800
< -109dBm
3GPP
WCDMA B2
WCDMA B5
LTE
< -110dBm
3GPP
3GPP
3GPP
< -110dBm
See table 24
Table 24: Reference sensitivity (QPSK)
3GPP standard
E-UTRA
band
1.4 MHz
3MHz
5MHz
-100
-102.7
-99.7
-98
-101.7
-98.7
-104.7
-101.7
Test value
10MHz
3GPP standard
Duplex
10 MHz
15 MHz
20 MHz
-101.3
-95.2
-94
FDD
-95
-101
-93.2
-92
FDD
-97
-94
-100
-92.2
-91
FDD
-100
-97
-102
-95.2
-94
FDD
-98
-95
TBD
-93.2
-92
FDD
-97
-102.2
-99.2
-97
-94
-99.8
FDD
17
-97
-94
-102.4
FDD
-97
-94
TBD
20
4.2
-91.2
-90
FDD
WCDMA/LTE Antenna Design Guide
Users should connect antennas to Module’s antenna pads through the micro-strip line or other types
of RF trace. The trace impedance must be controlled in 50Ω. SIMCom recommends that the total
insertion loss between Module and antenna should meet the following requirements:
Table 25: Trace Loss
Frequency
Loss
700MHz-960MHz
<0.5dB
1710MHz-2170MHz
<0.9dB
2300MHz-2650MHz
<1.2dB
To facilitate the antenna tuning and certification test, a RF connector and an antenna matching
circuit should be added. The following figure is the recommended circuit.
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MAIN ANT
RF connector
Matching circuit
MAIN_ANT
45
GND
44
R1
R2
C2
C1
D1
MODULE
Figure 27: Antenna matching circuit (MAIN_ANT)
In above figure, the components R1,C1,C2 and R2 are used for antenna matching, the value of
components can only be achieved after the antenna tuning and usually provided by antenna vendor.
By default, the R1, R2 are 0Ω resistors, and the C1, C2 are reserved for tuning. The component D1
is a TVS for ESD protection, and it is optional for users according to application environment.
The RF test connector is used for the conducted RF performance test, and should be placed as close
as to the module’s MAIN_ANT pin. The traces impedance between Module and antenna must be
controlled in 50Ω.
Diversity antenna
Matching circuit
DIV_ANT
GND
R4
C4
R3
C3
D2
MODULE
Figure 28: Antenna matching circuit (DIV_ANT)
In above figure, R3, C3, C4 and R4 are used for auxiliary antenna matching. By default, the R3, R4
are 0Ωresistors, and the C3, C4 are reserved for tuning. D2 is a TVS for ESD protection, and it is
optional for users according to application environment.
Two TVS are recommended in the table below.
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Table 26: Recommended TVS
Package
0201
Part Number
LXES03AAA1-154
Vender
Murata
0402
LXES15AAA1-153
Murata
Note：SIMCom suggests the LTE auxiliary antenna to be kept on, since there are many high
bands in the designing of FDD-LTE. Because of the high insert loss of the RF cable and layout
lines, the receiver sensitivity of these bands above will have risk to meet the authentication
without the diversity antenna. For more details about auxiliary antenna design notice, please
refer to document [25]
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5 Electrical Specifications
5.1
Absolute Maximum Ratings
Absolute maximum rating for digital and analog pins of Module are listed in the following table:
Table 27: Absolute maximum ratings
Parameter
Voltage at VBAT
Voltage at VBUS
Voltage at digital pins (RESET,SPI,GPIO,I2C,UART,PCM)
Voltage at digital pins :USIM
Voltage at PWRKEY
5.2
Min.
-0.5
-0.5
-0.3
-0.3
-0.3
Max.
6.0
6.3
2.1
3.05
1.8
Unit
Typ.
3.8
Max.
4.2
5.25
Unit
Operating Conditions
Table 28: Recommended operating ratings
Parameter
Voltage at VBAT
Voltage at VBUS
Min.
3.4
3.6
Table 29: 1.8V Digital I/O characteristics*
Parameter
Description
Min.
Typ.
Max.
Unit
VIH
High-level input voltage
1.17
1.8
2.1
VIL
Low-level input voltage
-0.3
0.63
VOH
High-level output voltage
1.35
1.8
VOL
Low-level output voltage
0.45
IOH
High-level output current(no
pull down resistor)
IOL
Low-level output current(no pull
up resistor)
-2
IIH
Input high leakage current (no
pull down resistor)
IIL
Input low leakage current(no
pull up resistor)
-1
mA
mA
uA
uA
*Note: These parameters are for digital interface pins, such as SPI, GPIOs (NETLIGHT), I2C,
UART, PCM.
The operating temperature of Module is listed in the following table.
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Table 30: Operating temperature
Parameter
Normal operation temperature
Min.
-30
Typ.
25
Max.
80
Unit
℃
Extended operation temperature*
-40
25
85
℃
Storage temperature
-45
25
+90
℃
*Note: Module is able to make and receive voice calls, data calls, SMS and make
WCDMA/HSPA+/LTE traffic in -40℃ ~ +85℃. The performance will be reduced slightly from
the 3GPP specifications if the temperature is outside the normal operating temperature range
and still within the extreme operating temperature range.
5.3
Operating Mode
5.3.1
Operating Mode Definition
The table below summarizes the various operating modes of Module series products.
Table 31: Operating mode Definitions
Normal operation
Mode
Function
GSM/WCDMA / LTE
Sleep
In this case, the current consumption of module will be reduced to the
minimal level and the module can still receive paging message and
SMS.
GSM/WCDMA / LTE
Idle
Software is active. Module is registered to the network, and the
module is ready to communicate.
GSM/WCDMA / LTE
Talk
Connection between two subscribers is in progress. In this case, the
power consumption depends on network settings such as DTX off/on,
FR/EFR/HR, hopping sequences, antenna.
GSM/WCDMA/LTE
Standby
Module is ready for data transmission, but no data is currently sent or
received. In this case, power consumption depends on network
settings.
GPRS/EDGE/WCDM
A / LTE transmission
There is data transmission in progress. In this case, power
consumption is related to network settings (e.g. power control level);
uplink/downlink data rates, etc.
Minimum functionality
mode
AT command “AT+CFUN=0” can be used to set the module to a
minimum functionality mode without removing the power supply. In
this mode, the RF part of the module will not work and the USIM
card will not be accessible, but the serial port and USB port are still
accessible. The power consumption in this mode is lower than normal
mode.
Flight mode
AT command “AT+CFUN=4” or pulling down the FLIGHTMODE
pin can be used to set the module to flight mode without removing the
power supply. In this mode, the RF part of the module will not work
but the serial port and USB port are still accessible. The power
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consumption in this mode is lower than normal mode.
Power off
5.3.2
Module will go into power off mode by sending the AT command
“AT+CPOF” or by pulling down the PWRKEY pin normally. In this
mode the power management unit shuts down the power supply and
software is not active. The serial port and USB are is not accessible.
Sleep Mode
In sleep mode, the current consumption of module will be reduced to the minimal level, and
module can still receive paging message and SMS.
Several hardware and software conditions must be satisfied together in order to let Module enter
into sleep mode:
1. UART condition
2. USB condition
3. Software condition
Note: Before designing, pay attention to how to realize sleeping/waking function and refer to
Document [26] for more details.
5.3.3
Minimum Functionality Mode and Flight Mode
Minimum functionality mode ceases a majority function of module, thus minimizing the power
consumption. This mode is set by the AT command which provides a choice of the functionality
levels.
● AT+CFUN=0: Minimum functionality
● AT+CFUN=1: Full functionality (Default)
● AT+CFUN=4: Flight mode
If Module has been set to minimum functionality mode, the RF function and USIM card function
will be closed. In this case, the serial port and USB are still accessible, but RF function and USIM
card will be unavailable.
If Module has been set to flight mode, the RF function will be closed. In this case, the serial port
and USB are still accessible, but RF function will be unavailable.
When Module is in minimum functionality or flight mode, it can return to full functionality by the
AT command “AT+CFUN=1”.
5.4
Current Consumption
The current consumption is listed in the table below.
Table 32: Current consumption on VBAT Pins (VBAT=3.8V)
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UMTS Sleep/Idle Mode
WCDMA supply current
(without USB connection)
Sleep mode @DRX=9 Typical: 1.11
Idle mode @DRX=9 Typical: 17.5
LTE Sleep/Idle mode
LTE supply current
(without USB connection)
Sleep mode Typical: 1.56
Idle mode Typical: 22
UMTS Talk
WCDMA B2
@Power 22dBm
WCDMA B5
@Power 23.48dBm Typical: 480mA
HSDPA Data
WCDMA B2
WCDMA B5
LTE Data
@Power 24dBm Typical: TBD
@Power 24dBm Typical: TBD
LTE-FDD B2
LTE-FDD B4
LTE-FDD B17
5.5
@5 MHz
@10 MHz
@20 MHz
@5 MHz
@10 MHz
@20 MHz
@5 MHz
@10 MHz
Typical: 524mA
22.2dBm
22.7dBm
22.38dBm
23.05dBm
23.04dBm
22.83dBm
22.69dBm
22.9dBm
Typical: 589mA
Typical: 577mA
Typical: 626mA
Typical: 519mA
Typical: 556mA
Typical: 600mA
Typical: 516mA
Typical: 512mA
ESD Notes
Module is sensitive to ESD in the process of storage, transporting and assembling. Especially,
Module is mounted on the users’ mother board, The ESD components should be placed beside the
connectors which human body might touch, such as USIM card holder, audio jacks, switches and
keys, etc. The following table shows the Module ESD measurement performance without any
external ESD component.
Table 33: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)
Part
GND
Contact discharge
Air discharge
+/-6K
+/-12K
VBAT
+/-5K
+/-10K
Antenna port
+/-5K
+/-10K
USB
+/-4K
+/-8K
UART
+/-4K
+/-8K
PCM
+/-4K
+/-8K
Other PADs
+/-3K
+/-6K
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6 SMT Production Guide
6.1
Top and Bottom View of Module
Figure 29: Top and bottom view of Module
6.2
Label Information
Figure 30: Label Information
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Table 34: The Description of Label Information
No.
Description
LOGO
No.1 Pin
Project Name
Part Number
Serial Number (SN)
International Mobile Equipment Identity (IMEI)
FCC ID
QR code
6.3
Typical SMT Reflow Profile
SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only
a generic recommendation and should be adjusted to the specific application and manufacturing
constraints.
Figure 31: The ramp-soak-spike Reflow Profile of Module
Note: For more details about secondary SMT, please refer to the document [21].
6.4
Moisture Sensitivity Level (MSL)
Module is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033.
If the prescribed time limit is exceeded, users should bake modules for 192 hours in drying
equipment (<5% RH) at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not
heat-resistant, and only can be baked at 45° C.
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Table 35: Moisture Sensitivity Level and Floor Life
Moisture Sensitivity Level
(MSL)
Floor Life (out of bag) at factory ambient≤30°C/60% RH or as
stated
Unlimited at
1 year
2a
4 weeks
168 hours
72 hours
48 hours
5a
24 hours
Mandatory bake before use. After bake, it must be reflowed within the
time limit specified on the label.
≦30℃/85% RH
NOTE: IPC / JEDEC J-STD-033 standard must be followed for production and storage.
6.5
Stencil Foil Design Recommendation
The recommended thickness of stencil foil is more than 0.1mm.
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7 Packaging
Module module support tray packaging.
Figure 32: Packaging introduce
Module tray drawing：
Figure 33: Module tray drawing introduce
Table 36: Tray size
Length（±3mm）
Width（±3mm）
Module number
242.0
161.0
15
Small carton drawing：
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Figure 34: Small carton drawing introduce
Table 37: Small Carton size
Length（±10mm）
Width（±10mm）
Height（±10mm）
Module number
270
180
120
15*20=300
Big carton drawing：
Figure 35: Big carton drawing introduce
Table 38: Big carton size
Length（±10mm）
Width（±10mm）
Height（±10mm）
Module number
380
280
280
300*4=1200
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Appendix
A. Reference Design
GNSS Antenna
R102 0R
45
NC
C106
NC
C107
GND
46
GND
47
Power supply
34
VBAT
C103
1uF
C102
100uF
C101
220uF
MAIN_ANT
44
GND
GND
VBAT
33
35
GND
32
31
GND
GND
30
POWERKEY
Turn on/off pulse
GNSS_ANT
55
GND
GND
56
DIV_ANT
GND
GND
VBAT
C108
33pF
L101
NC
53
54
L102
NC
R101
Div Antenna
0R
C104
NC
C105
NC
R103 4.7K
SIM7500x
R104 47K
R105
300R
Reset pulse
NETLIGHT
C114 100NF
24
38
39
41
36
42
37
40
UART_TXD
UART_RXD
UART_CTS
UART_RTS
UART_RI
UART_DCD
UART_DTR
52
RESET
R106 10K
Network
LED Status
R107 10K
TXD
RXD
C104
4.7uF
CTS
RTS
RI
DCD
DTR
USB_VBUS
USB_DN
USB_DP
USB_VBUS
USB_DN
USB_DP
If USB interface is used， Connect
USB_VBUS to 3.6V-5.25V
SCL
SDA
C115 22PF
C116 22PF
C117 22PF
R120 22R
SIM_DATA
R121 22R
SIM_CLK
SIM_RST R122 22R
SIM_VDD
C109
100nF
ISINK
SIM_DET
ADC
GPIO_1
10 USIM_DATA
11 USIM_CLK
13 USIM_RST
14
USIM_VDD
GPIO_37
I2C_SCL
I2C_SDA
27
12
25
26
48
49
GPIO_49
STATUS 50
DBG_TXD 51
TVS
ESDA6V1W5
15
16
22
28
29
43
GND
GND
GND
GND
GND
GND
GND
PCM_IN
PCM_SYNC
PCM_OUT
PCM_CLK
I2S_MCLK
L11_1V8
20
19
21
18
17
Audio CODEC Chip
or
DSP
23
Figure 36: Reference design
Note: The UART port suggest to be used by isolated circuit .
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Power supply
Smart Machine Smart Decision
B. Coding Schemes and Maximum Net Data Rates over Air Interface
Table 39: Coding schemes and maximum net data rates over air interface
Multislot definition(GPRS/EDGE)
Slot class
10
11
12
DL slot number
GPRS coding scheme
Max data rata（4 slots）
Modulation type
CS 1 = 9.05 kb/s / time slot
36.2 kb/s
GMSK
CS 2 = 13.4 kb/s / time slot
53.6 kb/s
GMSK
CS 3 = 15.6 kb/s / time slot
62.4 kb/s
GMSK
CS 4 = 21.4 kb/s / time slot
85.6 kb/s
GMSK
EDGE coding scheme
Max data rata（4 slots）
Modulation type
MCS 1 = 8.8 kb/s/ time slot
35.2 kb/s
GMSK
MCS 2 = 11.2 kb/s/ time slot
44.8 kb/s
GMSK
MCS 3 = 14.8 kb/s/ time slot
59.2 kb/s
GMSK
MCS 4 = 17.6 kb/s/ time slot
70.4 kb/s
GMSK
MCS 5 = 22.4 kb/s/ time slot
89.6 kb/s
8PSK
MCS 6 = 29.6 kb/s/ time slot
118.4 kb/s
8PSK
MCS 7 = 44.8 kb/s/ time slot
179.2 kb/s
8PSK
MCS 8 = 54.4 kb/s/ time slot
217.6 kb/s
8PSK
MCS 9 = 59.2 kb/s/ time slot
236.8 kb/s
8PSK
HSDPA device category
Max data rate（peak）
Modulation type
Category 1
1.2Mbps
16QAM,QPSK
Category 2
1.2Mbps
16QAM,QPSK
Category 3
1.8Mbps
16QAM,QPSK
Category 4
1.8Mbps
16QAM,QPSK
Category 5
3.6Mbps
16QAM,QPSK
Category 6
3.6Mbps
16QAM,QPSK
Category 7
7.2Mbps
16QAM,QPSK
Category 8
7.2Mbps
16QAM,QPSK
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UL slot number
48
Active slot number
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Category 9
10.2Mbps
16QAM,QPSK
Category 10
14.4Mbps
16QAM,QPSK
Category 11
0.9Mbps
QPSK
Category 12
1.8Mbps
QPSK
Category 13
17.6Mbps
64QAM
Category 14
21.1Mbps
64QAM
Category 15
23.4Mbps
16QAM
Category 16
28Mbps
16QAM
Category 17
23.4Mbps
64QAM
Category 18
28Mbps
64QAM
Category 19
35.5Mbps
64QAM
Category 20
42Mbps
64QAM
Category 21
23.4Mbps
16QAM
Category 22
28Mbps
16QAM
Category 23
35.5Mbps
64QAM
Category 24
42.2Mbps
64QAM
HSUPA device category
Max data rate（peak）
Modulation type
Category 1
0.96Mbps
QPSK
Category 2
1.92Mbps
QPSK
Category 3
1.92Mbps
QPSK
Category 4
3.84Mbps
QPSK
Category 5
3.84Mbps
QPSK
Category 6
5.76Mbps
QPSK
LTE-FDD device category
(Downlink)
Max data rate（peak）
Modulation type
Category 1
10Mbps
QPSK/16QAM/64QAM
Category 2
50Mbps
QPSK/16QAM/64QAM
Category 3
100Mbps
QPSK/16QAM/64QAM
Category 4
150Mbps
QPSK/16QAM/64QAM
LTE-FDD device category
(Uplink)
Max data rate（peak）
Modulation type
Category 1
5Mbps
QPSK/16QAM
Category 2
25Mbps
QPSK/16QAM
Category 3
50Mbps
QPSK/16QAM
Category 4
50Mbps
QPSK/16QAM
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C. Related Documents
Table 40: Related documents
SN
[1]
[2]
Title
SIM7X00 Series_AT
Command Manual_V1.xx
ITU-T
Draft
new
recommendationV.25ter
[3]
GSM 07.07
[4]
GSM 07.10
[5]
GSM 07.05
[6]
GSM 11.14
[7]
GSM 11.11
[8]
GSM 03.38
[9]
GSM 11.10
[10]
3GPP TS 51.010-1
[11]
3GPP TS 34.124
[12]
3GPP TS 34.121
[13]
3GPP TS 34.123-1
[14]
3GPP TS 34.123-3
[15]
EN 301 908-02 V2.2.1
[16]
EN 301 489-24 V1.2.1
[17]
IEC/EN60950-1(2001)
[18]
3GPP TS 51.010-1
SIM7500A_User Manual_V1.01
Description
SIM7X00 Series_AT Command Manual
Serial asynchronous automatic dialing and control
Digital cellular telecommunications (Phase 2+); AT command
set for GSM Mobile Equipment (ME)
Support GSM 07.10 multiplexing protocol
Digital cellular telecommunications (Phase 2+); Use of Data
Terminal Equipment – Data Circuit terminating Equipment
(DTE – DCE) interface for Short Message Service (SMS)
and Cell Broadcast Service (CBS)
Digital cellular telecommunications system (Phase 2+);
Specification of the SIM Application Toolkit for the
Subscriber Identity Module – Mobile Equipment (SIM – ME)
interface
Digital cellular telecommunications system (Phase 2+);
Specification of the Subscriber Identity Module – Mobile
Equipment (SIM – ME) interface
Digital cellular telecommunications system (Phase 2+);
Alphabets and language-specific information
Digital cellular telecommunications system (Phase 2) ；
Mobile Station (MS) conformance specification； Part 1:
Conformance specification
Digital cellular telecommunications system (Release 5);
Mobile Station (MS) conformance specification
Electromagnetic Compatibility (EMC) for mobile terminals
and ancillary equipment.
Electromagnetic Compatibility (EMC) for mobile terminals
and ancillary equipment.
Technical Specification Group Radio Access Network;
Terminal conformance specification; Radio transmission and
reception (FDD)
User Equipment (UE) conformance specification; Part 3:
Abstract Test Suites.
Electromagnetic compatibility and Radio spectrum Matters
(ERM); Base Stations (BS) and User Equipment (UE) for
IMT-2000. Third Generation cellular networks; Part 2:
Harmonized EN for IMT-2000, CDMA Direct Spread
(UTRA FDD) (UE) covering essential requirements of article
3.2 of the R&TTE Directive
Electromagnetic compatibility and Radio Spectrum Matters
(ERM); Electromagnetic Compatibility (EMC) standard for
radio equipment and services; Part 24: Specific conditions for
IMT-2000 CDMA Direct Spread (UTRA) for Mobile and
portable (UE) radio and ancillary equipment
Safety of information technology equipment (2000)
Digital cellular telecommunications system (Release 5);
Mobile Station (MS) conformance specification
50
2016-07-06
Smart Machine Smart Decision
[19]
GCF-CC V3.23.1
[20]
2002/95/EC
[21]
Module
secondary-SMT-UGD-V1.xx
[22]
SIM7X00
Series_UART_Application
Note_V1.xx
[23]
[24]
[25]
SIM7X00 Series_USB
AUDIO_Application
Note_V1.xx
Antenna design guidelines for
diversity receiver system
SIM7X00 Series_Sleep Mode_
Application Note_V1.xx
SIM7500A_User Manual_V1.01
Global Certification Forum - Certification Criteria
Directive of the European Parliament and of the Council of
27 January 2003 on the restriction of the use of certain
hazardous substances in electrical and electronic equipment
(RoHS)
Module secondary SMT Guidelines
SIM7X00 Series_UART_Application Note
SIM7X00 Series_USB AUDIO_Application Note
Antenna design guidelines for diversity receiver system
SIM7X00 Series_Sleep Mode_ Application Note
51
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D. Terms and Abbreviations
Table 41: Terms and Abbreviations
Abbreviation
ADC
ARP
BER
BTS
CS
CSD
CTS
DAC
DRX
DSP
DTE
DTR
DTX
EFR
EGSM
EMC
ESD
ETS
EVDO
FCC
FD
FDMA
FR
GMSK
GPRS
GSM
GNSS
HR
HSPA
I2C
IMEI
LTE
MO
MS
MT
PAP
PBCCH
PCB
PCS
RF
RMS
RTC
SIM
Description
Analog-to-Digital Converter
Antenna Reference Point
Bit Error Rate
Base Transceiver Station
Coding Scheme
Circuit Switched Data
Clear to Send
Digital-to-Analog Converter
Discontinuous Reception
Digital Signal Processor
Data Terminal Equipment (typically computer, terminal, printer)
Data Terminal Ready
Discontinuous Transmission
Enhanced Full Rate
Enhanced GSM
Electromagnetic Compatibility
Electrostatic Discharge
European Telecommunication Standard
Evolution Data Only
Federal Communications Commission (U.S.)
SIM fix dialing phonebook
Frequency Division Multiple Access
Full Rate
Gaussian Minimum Shift Keying
General Packet Radio Service
Global Standard for Mobile Communications
Global Navigation Satellite System
Half Rate
High Speed Packet Access
Inter-Integrated Circuit
International Mobile Equipment Identity
Long Term Evolution
Mobile Originated
Mobile Station (GSM engine), also referred to as TE
Mobile Terminated
Password Authentication Protocol
Packet Switched Broadcast Control Channel
Printed Circuit Board
Personal Communication System, also referred to as GSM 1900
Radio Frequency
Root Mean Square (value)
Real Time Clock
Subscriber Identification Module
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SMS
SPI
SMPS
TDMA
TE
TX
UART
VSWR
SM
NC
EDGE
HSDPA
HSUPA
ZIF
WCDMA
VCTCXO
USIM
UMTS
UART
Short Message Service
serial peripheral interface
Switched-mode power supply
Time Division Multiple Access
Terminal Equipment, also referred to as DTE
Transmit Direction
Universal Asynchronous Receiver & Transmitter
Voltage Standing Wave Ratio
SIM phonebook
Not connect
Enhanced data rates for GSM evolution
High Speed Downlink Packet Access
High Speed Uplink Packet Access
Zero intermediate frequency
Wideband Code Division Multiple Access
Voltage control temperature-compensated crystal oscillator
Universal subscriber identity module
Universal mobile telecommunications system
Universal asynchronous receiver transmitter
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E. Safety Caution
Table 42: Safety caution
Marks
Requirements
When in a hospital or other health care facility, observe the restrictions about the use
of mobiles. Switch the cellular terminal or mobile off, medical equipment may be
sensitive and not operate normally due to RF energy interference.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden to
prevent interference with communication systems. Forgeting to think much of these
instructions may impact the flight safety or offend local legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any
electrical equipment in potentially explosive atmospheres can constitute a safety
hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. RF interference can occur if it is used close to TV sets, radios,
computers or other electric equipment.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when
driving a vehicle, unless it is securely mounted in a holder for hands free operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
GSM cellular terminals or mobiles operate over radio frequency signals and cellular
networks and cannot be guaranteed to connect in all conditions, especially with a
mobile fee or an invalid SIM card. While you are in this condition and need emergent
help, please remember to use emergency calls. In order to make or receive calls, the
cellular terminal or mobile must be switched on and in a service area with adequate
cellular signal strength.
Some networks do not allow for emergency call if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may have to
deactivate those features before you can make an emergency call.
Also, some networks require that a valid SIM card be properly inserted in the cellular
terminal or mobile.
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Contact us:
Shanghai SIMCom Wireless Solutions Ltd.
Add: SIM Technology Building, No.633, Jinzhong Road, Changning District, Shanghai P.R. China
200335
Tel：+86 21 3235 3300
Fax：+86 21 3235 3020
URL：www.simcomm2m.com
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Metadata Date                   : 2016:08:12 10:30:22+08:00
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Tag New Review Cycle            : 
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