Simcom 201710 LTE-FDD/HSPA MODULE User Manual 04 SIM7600A H User Manual V1 01 20171124

SIM7600A-H_User Manual_V1.00

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Compliance Information:

FCC Compliance Statement: This device complies with Part 15 of the FCC Rules . Operation is

subject to the following two conditions: 1. This device may not cause harmful interference, and 2.

This device must accept any interference received, including interference that may cause undesired

operation. This device must accept any interference received, including interference that may cause

undesired operation. Product that is a radio transmitter is labeled with FCC ID.

FCC Caution:

(1)Exposure to Radio Frequency Radiation. This equipment must be installed and operated in

accordance with provided instructions and the antenna(s) used for this transmitter must be installed

to provide a separation distance of at least 20 cm from all persons and must not be collocated or

operating in conjunction with any other antenna or transmitter. End-users and installers must be

provided with antenna installation instructions and transmitter operating conditions for satisfying RF

exposure compliance.

(2)Any changes or modifications not expressly approved by the grantee of this device could void the

user's authority to operate the equipment.

(3)This Transmitter must not be co-located or operating in conjunction with any other antenna or

transmitter.

(4)Changes or modifications to this unit not expressly approved by the party responsible for

compliance could void the user authority to operate the equipment.

(5) the modules FCC ID is not visible when installed in the host, or (6) if the host is marketed so that

end users do not have straight forward commonly used methods for access to remove the module so

that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed

module: Contains Transmitter Module FCC ID: UDV-201710 or Contains FCC ID: UDV-201710

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Document Title SIM7600A-H_User Manual

Version V1.00

Date 2017-11-24

Status Released

Document Control ID SIM7600A-H_User Manual_V1.00

General Notes

SIMCom offers this information as a service to its customers to support the application and

engineering efforts that use the products designed by SIMCom. The information provided is based

on the requirements specifically from the customers. SIMCom has not undertaken any independent

search for additional relevant information, including any information that may be in the customer’s

possession. Furthermore, the system validation of the product designed by SIMCom within a larger

electronic system remains the responsibility of the customer or the customer’s system integrator.

All specifications supplied herein are subject to change without notice.

Copyright

This document contains the proprietary technical information which is the property of SIMCom

Limited, copying of this document, giving it to others, the using or communication of the contents

thereof are forbidden without the official authority by SIMCom. Offenders are liable to the

payment of the damages. All rights are reserved in the event of grant of a patent or the registration

of a utility model or design. All specifications supplied herein are subject to change without notice

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Contents

Contents ............................................................................................................................................. 4

Table Index ........................................................................................................................................ 6

Figure Index ...................................................................................................................................... 7

Revision History ................................................................................................................................ 8

1Introduction ................................................................................................................................ 9

1.1Product Outline ..................................................................................................................... 9

1.2Hardware Interface Overview ............................................................................................... 9

1.3Hardware Block Diagram...................................................................................................... 9

1.4Functional Overview ........................................................................................................... 10

2Package Information ............................................................................................................... 12

2.1Pin Assignment Overview ................................................................................................... 12

2.2Pin Description .................................................................................................................... 14

2.3Mechanical Information ...................................................................................................... 18

2.4Footprint Recommendation ................................................................................................. 19

3Interface Application ............................................................................................................... 20

3.1Power Supply ...................................................................................................................... 20

3.1.1Power supply Design Guide ......................................................................................... 20

3.1.2Recommended Power Supply Circuit .......................................................................... 21

3.1.3Voltage Monitor ............................................................................................................ 22

3.2Power on/Power off/Reset Function .................................................................................... 22

3.2.1Power on ....................................................................................................................... 22

3.2.2Power off ...................................................................................................................... 23

3.2.3Reset Function .............................................................................................................. 24

3.3UART Interface ................................................................................................................... 25

3.3.1UART Design Guide .................................................................................................... 25

3.3.2RI and DTR Behavior ................................................................................................... 27

3.4USB Interface ...................................................................................................................... 27

3.4.1USB Application Guide ................................................................................................ 28

3.5USIM Interface.................................................................................................................... 28

3.5.1USIM Application Guide .............................................................................................. 29

3.5.2SIM Card Design Guide ............................................................................................... 29

3.5.3Recommended USIM Card Holder .............................................................................. 30

3.6PCM Interface ..................................................................................................................... 31

3.6.1PCM Timing ................................................................................................................. 31

3.6.2PCM Application Guide ............................................................................................... 32

3.7I2C Interface ....................................................................................................................... 33

3.7.1I2C Design Guide ......................................................................................................... 33

3.8Network Status .................................................................................................................... 34

3.9Operating Status Indication ................................................................................................. 34

3.10Pin Multiplex Function .................................................................................................... 34

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3.11Other interface ................................................................................................................. 35

3.11.1Sink Current Source .................................................................................................. 35

3.11.2ADC .......................................................................................................................... 36

4RF Specifications ...................................................................................................................... 37

4.1WCDMA/LTE RF Specifications ....................................................................................... 37

4.2WCDMA/LTE Antenna Design Guide ................................................................................ 38

4.3GNSS .................................................................................................................................. 41

4.3.1GNSS Technical specification ...................................................................................... 41

4.3.2GNSS Application Guide ............................................................................................. 42

5Electrical Specifications ........................................................................................................... 44

5.1Absolute Maximum Ratings................................................................................................ 44

5.2Operating Conditions .......................................................................................................... 44

5.3Operating Mode .................................................................................................................. 45

5.3.1Operating Mode Definition .......................................................................................... 45

5.3.2Sleep Mode ................................................................................................................... 46

5.3.3Minimum Functionality Mode and Flight Mode .......................................................... 46

5.4Current Consumption .......................................................................................................... 46

5.5ESD Notes ........................................................................................................................... 47

6SMT Production Guide ........................................................................................................... 48

6.1Top and Bottom View of Module ........................................................................................ 48

6.2Typical SMT Reflow Profile ............................................................................................... 48

6.3Moisture Sensitivity Level (MSL) ...................................................................................... 49

6.4Stencil Foil Design Recommendation ................................................................................. 49

7Packaging .................................................................................................................................. 50

Appendix .......................................................................................................................................... 52

A. Reference Design ...................................................................................................................... 52

B. Coding Schemes and Maximum Net Data Rates over Air Interface......................................... 53

C. Related Documents ................................................................................................................... 55

D. Terms and Abbreviations .......................................................................................................... 57

E. Safety Caution ........................................................................................................................... 59

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Table Index

Table 1: SIM7600A-H frequency bands .............................................................................................................. 9

Table 2: General features ................................................................................................................................... 10

Table 3: Pin Definitions ..................................................................................................................................... 13

Table 4: IO parameters definition....................................................................................................................... 14

Table 5: Pin description...................................................................................................................................... 14

Table 6: VBAT Pins electronic characteristic ..................................................................................................... 20

Table 7: Recommended zener diode list ............................................................................................................. 21

Table 8: Power on timing and electronic characteristic ...................................................................................... 23

Table 9: Power off timing and Electronic Characteristic .................................................................................... 24

Table 10: RESET pin electronic characteristic ................................................................................................... 25

Table 11: USIM Electronic characteristic in 1.8V mode (USIM_VDD=1.8V) .................................................. 28

Table 12: USIM Electronic characteristic 3.0V mode (USIM_VDD=2.95V) .................................................... 29

Table 13: Amphenol USIM Socket Pin Description ........................................................................................... 30

Table 14: PCM Format ....................................................................................................................................... 31

Table 15: PCM Timing Parameters .................................................................................................................... 32

Table 16: NETLIGHT pin status ........................................................................................................................ 34

Table 17: Pin definition of the STATUS ............................................................................................................ 34

Table 18: Pin multiplex function list .................................................................................................................. 35

Table 19: Sink current electronic characteristic ................................................................................................. 35

Table 20: ADC Electronic Characteristics .......................................................................................................... 36

Table 21: Conducted transmission power .......................................................................................................... 37

Table 22: Operating frequencies ........................................................................................................................ 37

Table 23: Conducted receive sensitivity ............................................................................................................. 37

Table 24: Reference sensitivity (QPSK) ............................................................................................................ 37

Table 25: Trace Loss .......................................................................................................................................... 38

Table 26: Recommended TVS ........................................................................................................................... 39

Table 27: LNA requirements .............................................................................................................................. 43

Table 28: Absolute maximum ratings ................................................................................................................. 44

Table 29: Recommended operating ratings ........................................................................................................ 44

Table 30: 1.8V Digital I/O characteristics* ........................................................................................................ 44

Table 31: Operating temperature ........................................................................................................................ 45

Table 32: Operating mode Definitions ............................................................................................................... 45

Table 33: Current consumption on VBAT Pins (VBAT=3.8V) .......................................................................... 47

Table 34: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%) ............................. 47

Table 35: Moisture Sensitivity Level and Floor Life ......................................................................................... 49

Table 36: Tray size ............................................................................................................................................. 50

Table 37: Small Carton size ............................................................................................................................... 51

Table 38: Big carton size .................................................................................................................................... 51

Table 39: Coding schemes and maximum net data rates over air interface ........................................................ 53

Table 40: Related documents ............................................................................................................................. 55

Table 41: Terms and Abbreviations .................................................................................................................... 57

Table 42: Safety caution ..................................................................................................................................... 59

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Figure Index

Figure 1: SIM7600A-H Block Diagram ............................................................................................................. 10

Figure 2: Pin assignment overview .................................................................................................................... 12

Figure 3: Dimensions (Unit: mm) ...................................................................................................................... 18

Figure 4: Footprint recommendation (Unit: mm) ............................................................................................... 19

Figure 5: Power supply application circuit......................................................................................................... 20

Figure 6: Linear regulator reference circuit ....................................................................................................... 21

Figure 7: Switching modepower supply reference circuit .................................................................................. 21

Figure 8: ReferencePower on/offCircuit ............................................................................................................ 22

Figure 9: Power on timing sequence .................................................................................................................. 23

Figure 10: Power off timing sequence ............................................................................................................... 24

Figure 11: Reference reset circuit ...................................................................................................................... 25

Figure 12: UART full modem ............................................................................................................................ 26

Figure 13: UART null Modem ........................................................................................................................... 26

Figure 14: Reference circuit of level shift .......................................................................................................... 26

Figure 15: RI behaviour（SMS and URC report） ........................................................................................... 27

Figure 16: RI behaviour（voice call） .............................................................................................................. 27

Figure 17: USB reference circuit ....................................................................................................................... 28

Figure 18: USIM interface reference circuit ...................................................................................................... 29

Figure 19: Amphenol SIM card socket .............................................................................................................. 30

Figure 20: PCM_SYNC timing .......................................................................................................................... 31

Figure 21: EXT codec to module timing ............................................................................................................ 31

Figure 22: Module to EXT codec timing ........................................................................................................... 32

Figure 23: Audio codec reference circuit ........................................................................................................... 33

Figure 24: I2C reference circuit ......................................................................................................................... 33

Figure 25: NETLIGHT reference circuit ............................................................................................................ 34

Figure 26: ISINK reference circuit .................................................................................................................... 35

Figure 27: Antenna matching circuit (MAIN_ANT) .......................................................................................... 38

Figure 28: Antenna matching circuit (DIV_ANT) ............................................................................................. 39

Figure 29: Antenna matching circuit (MAIN_ANT) .......................................................................................... 41

Figure 30: Active antenna circuit ....................................................................................................................... 42

Figure 31: Passive antenna circuit (Default) ...................................................................................................... 42

Figure 32: Top and bottom view of Module ....................................................................................................... 48

Figure 33: The ramp-soak-spike Reflow Profile of Module............................................................................... 48

Figure 34: Packaging introduce ......................................................................................................................... 50

Figure 34: Module tray drawing introduce......................................................................................................... 50

Figure 36: Small carton drawing introduce ........................................................................................................ 51

Figure 37: Big carton drawing introduce ........................................................................................................... 51

Figure 38: Reference design .............................................................................................................................. 52

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Revision History

Data Version Description of change Author

2017-11-24 V1.00 new Shengwu.sun

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1 Introduction

This document describes the electronic specifications, RF specifications, interfaces, mechanical

characteristics and testing results of the SIMCom SIM7600A-H. With the help of this document

and other software application notes/user guides, users can understand and use modules to design

and develop applications quickly.

1.1 Product Outline

The SIM7600A-H support many air-interface standards, refer to the following table.

Table 1: SIM7600A-H frequency bands

Standard Frequency SIM7600A-H

WCDMA BAND2 

BAND5 

LTE

LTE-FDD B2 

LTE-FDD B4 

LTE-FDD B12 

With a smallphysical dimension of 30*30*2.9 mm and with the functionsintegrated, the Module

can meet almost any space requirement in users’ applications, such as smart phones, PDA’s,

industrial handhelds, machine-to-machine, vehicle applications, etc.

1.2 Hardware Interface Overview

The interfaces that are described in detail in the next chapters include:

● Power Supply

● USB Interface

● UART Interface

● USIM Interface

● GPIO

● ADC

● Power Output

● Current Sink Source

● PCM Interface

● I2C Interface

1.3 Hardware Block Diagram

The block diagram of the Module is shown in the figure below.

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GSM/WCDMA

/LTE

RF FEM

GSM/

WCDMA/LTE PA

RF

Transceiver

Baseband

XO

19.2MHz

NAND

Flash

I2C

PCM

Interrupt

Status LED

USB

USIM

Power On

Reset

UART

GPIOs

ADC

LDO

VBAT

Sink Current Source

DDR

Main Antenna

Power

Management

Qualcomm

Chip

SMT Interface

WCDMA

/LTE

RF FEM

AUX Antenna

SYSTEM POWER

VBAT

GNSS RF

GNSS Antenna

Figure 1: SIM7600A-H Block Diagram

1.4 Functional Overview

Table 2: General features

Feature Implementation

Power supply Single supply voltage 3.4～4.2V

Power saving Current in sleep mode : <5mA

Radio frequency bands Please refer to the table 1

Transmitting power WCDMA: Class 3 (0.25W)

LTE: Class 3 (0.25W)

Data Transmission

Throughout

HSPA+: 5.76 Mbps(UL), 42 Mbps(DL)

LTE Category 4: 150 Mbps (DL)

LTE Category 4: 50 Mbps (UL)

Antenna WCDMA /LTE main antenna

WCDMA /LTE auxiliary antenna

SMS

MT, MO, CB, Text and PDU mode

SMS storage: USIM card or ME(default)

Transmission of SMS alternatively over CS or PS.

USIM interface Support identity card: 1.8V/ 3V

USIM application toolkit Support SAT class 3, GSM 11.14 Release 98

Support USAT

Phonebook management Support phonebook types: DC,MC,RC,SM,ME,FD,ON,LD,EN

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Audio feature

Support PCM interface

Only support PCM master mode and short frame sync, 16-bit linear data

formats

UART interface

A full modem serial port by default

Baud rate: 300bps to 4Mbps(default:115200bps)

Auto-bauding baud rate: 9600,19200,38400,57600,115200bps

Can be used as the AT commands or data stream channel.

Support RTS/CTS hardware handshake

Multiplex ability according to GSM 07.10 Multiplexer Protocol.

USB USB 2.0 specification-compliant as a peripheral

Firmware upgrade USB Firmware upgrade over USB interface

USB 2.0 specification-compliant as a peripheral

Physical characteristics Weight:5.5g

Size:30*30*2.9mm

Temperature range

Normal operation temperature: -30°C to +80°C

Extended operation temperature: -40°C to +85°C*

Storage temperature -45°C to +90°C

*Note: Module is able to make and receive voice calls, data calls, SMS and make

WCDMA/HSPA+/LTE traffic in -40℃ ~ +85℃. The performance will be reduced slightly from

the 3GPP specifications if the temperature is outside the normal operating temperature range

and still within the extreme operating temperature range.

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2 Package Information

2.1 Pin Assignment Overview

All functions of the SIM7600A-H will be provided through 87 pads that will be connected to the

customers’ platform. The following Figure is a high-level view of the pin assignment of the

SIM7600A-H.

Figure 2: Pin assignment overview

SIM7600A

(Top View)

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Table 3: Pin Definitions

Pin No. Pin name Pin No. Pin name

1 GND 2 GND

3 PWRKEY 4 RESET

5 GND 6 SPI_CLK

7 SPI_MISO 8 SPI_MOSI

9 SPI_CS 10 GND

11 USB_VBUS 12 USB_DN

13 USB_DP 14 GND

15 VDD_1V8 16 USB_ID

17 USIM_DATA 18 USIM_RST

19 USIM_CLK 20 USIM_VDD

21 SD_CMD 22 SD_DATA0

23 SD_DATA1 24 SD_DATA2

25 SD_DATA3 26 SD_CLK

27 SDIO_DATA1 28 SDIO_DATA2

29 SDIO_CMD 30 SDIO_DATA0

31 SDIO_DATA3 32 SDIO_CLK

33 GPIO3 34 GPIO6

35 HSIC_STROBE 36 HSIC_DATA

37 GND 38 VBAT

39 VBAT 40 GND

41 GND 42 NC (RESERVED)

43 GND 44 VDD_EXT

45 ISINK 46 ADC2

47 ADC1 48 SD_DET

49 STATUS 50 GPIO43*

51 NETLIGHT 52 GPIO41

53 USIM_DET 54 FLIGHTMODE

55 SCL 56 SDA

57 GND 58 GND

59 AUX_ANT 60 GND

61 GND 62 VBAT

63 VBAT 64 GND

65 GND 66 RTS

67 CTS 68 RXD

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69 RI 70 DCD

71 TXD 72 DTR

73 PCM_OUT 74 PCM_IN

75 PCM_SYNC 76 PCM_CLK

77 GND 78 GND

79 GNSS_ANT 80 GND

81 GND 82 MAIN_ANT

83 COEX1* 84 COEX2

85 BOOT_CFG0* 86 COEX3*

87 GPIO77

*Note: Before the normal power up, pin48 cannot be pulled up.

2.2 Pin Description

Table 4: IO parameters definition

Pin type Description

PI Power input

PO Power output

AI Analog input

AIO Analog input/output

I/O Bidirectional input /output

DI Digital input

DO Digital output

DOH Digital output with high level

DOL Digital output with low level

PU Pull up

PD Pull down

Table 5: Pin description

Pin name Pin No. Default

status Description Comment

Power supply

VBAT 38,39,

62,63 PI Power supply, voltage range:

3.4～4.2V.

VDD_EXT 44 PO

LDO power output for other

external circuits with Max

150mA current output. Its

output voltage is 0V by default.

If unused, keep it

open.

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（The voltage can be

configured to 2.8V by AT

command）.

VDD_1V8 15 PO

1.8V SMPS output with Max

50mA current output for

external circuit, such as level

shift circuit.

If unused, keep it

open.

GND

1,2,5,

10,14,37

,40,41,4

3,57,58,

60,61,64

,65,77,7

8,80,81

Ground

System Control

PWRKEY 3 DI,PU System power on/off control

input, active low.

The high voltage is

0.8V;

RESET 4 DI, PU System reset control input,

active low.

RESET has been

pulled up to 1.8V via

40Kohm resistor

internally.

SD interface

SD_CMD 21 DO SDIO command

If unused, keep them

open.

SD_DATA0 22 I/O

SDIO data

SD_DATA1 23 I/O

SD_DATA2 24 I/O

SD_DATA3 25 I/O

SD_CLK 26 DO SDIO clock

USIM interface

USIM_DATA 17 I/O,PU

USIM Card data I/O, which has

been pulled up via a 100KR

resistor to USIM_VDD

internally. Do not pull it up or

down externally.

All lines of USIM

interface should be

protected against

ESD.

USIM_RST 18 DO USIM Reset

USIM_CLK 19 DO USIM clock

USIM_VDD 20 PO

Power output for USIM card,

its output Voltage depends on

USIM card type automatically.

Its output current is up to

50mA.

SPI interface

SPI_CLK 6 DO SPI clock output Only support SPI

master mode.

SPI_MISO 7 DI SPI master in/slave out data

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SPI_MOSI 8 DO SPI master out/slave in data If unused, please keep

them open.

SPI_CS 9 DO SPI chip-select output

USB

USB_VBUS 11 DI,PD Valid USB detection input with

3.0~5.25V detection voltage

USB_DN 12 I/O Negative line of the differential,

bi-directional USB signal.

USB_DP 13 I/O Positive line of the differential,

bi-directional USB signal.

USB_ID 16 DI High-speed USB ID input

K

ee

p

it o

p

en.

UART interface

RTS 66 DOH Request to send

If unused, keep them

open.

CTS 67 DI,PU Clear to Send

RXD 68 DI,PU Receive Data

RI 69 DOH Ring Indicator

DCD 70 DOH Carrier detects

TXD 71 DOH Transmit Data

DTR 72 DI,PU DTE get ready

I2C interface

SCL 55 DO I2C clock output If unused, keep open,

or else pull them up

via 4.7KΩ resistors to

1.8V.

SDA 56 I/O I2C data input/output

SDIO interface

SDIO_DATA1 27 I/O SDIO data1

For WLAN solution

SDIO_DATA2 28 I/O SDIO data2

SDIO_CMD 29 DO SDIO command

SDIO_DATA0 30 I/O SDIO data0

SDIO_DATA3 31 I/O SDIO data3

SDIO_CLK 32 DO SDIO clock

HSIC interface

HSIC_STROB

E 35 DO HSIC strobe wakeup Reserved

HSIC_DATA 36 I/O HSIC data

PCM interface

PCM_OUT 73 DO PCM data output.

If unused, please keep

them open.

PCM_IN 74 DI PCM data input.

PCM_SYNC 75 DO PCM data frame sync signal.

PCM_CLK 76 DO PCM data bit clock.

GPIO

NETLIGHT 51 DO LED control output as network

status indication.

If unused, keep them

open.

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FLIGHTMODE 54 DI,PU

Flight Mode control input.

High level(or open): Normal

Mode

Low level: Flight Mode

DO NOT PULL UP

GPIO43 DURING

NORMAL POWER

UP!

STATUS 49 DO

Operating status output.

High level: Power on and

firmware ready

Low level: Power off

GPIO41 52 IO GPIO

GPIO43 50 IO GPIO

GPIO3 33 IO GPIO

GPIO6 34 IO GPIO

SD_DET 48 IO

Default: GPIO

Optional: SD card detecting

input.

H: SD card is removed

L: SD card is inserted

USIM_DET 53 IO

Default: GPIO

Optional: USIM card detecting

input.

H: USIM is removed

L: USIM is inserted

GPIO77 87 IO GPIO

RF interface

MAIN _ANT 82 AIO MAIN antenna soldering pad

GNSS_ANT 79 AI GNSS antenna soldering pad

AUX_ANT 59 AI Auxiliary antenna soldering pad

Other interface

ISINK 45 PI Ground-referenced current sink.

If unused, please keep

them open.

ADC1 47 AI Analog-digital converter input

1

ADC2 46 AI Analog-digital converter input

2

COEX1 83 I/O

RF synchronizing between

Wi-Fi and LTE.

If unused, keep them

open.

DO NOT PULL UP

COEX1 AND COEX2

DURING NORMAL

POWER UP!

COEX2 84 I/O

COEX3 86 I/O

BOOT_CFG0 85 DI,PD

Boot configuration input.

Module will be forced into

USB download mode by

connect 85 pin to VDD_1V8

during power up.

Do place 2 test points

for debug.

DO NOT PULL UP

BOOT_CFG0

DURING NORMAL

POWER UP!

NC 42 No connection. Keep it open

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2.3 Mechanical Information

The following figure shows the package outline drawing of Module.

Figure 3: Dimensions (Unit: mm)

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2.4 Footprint Recommendation

Figure 4: Footprint recommendation (Unit: mm)

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3 Interface Application

3.1 Power Supply

On VBAT pads, a ripple current up to 2A typically, may cause voltage drop. Therefore, the power

supply for these pads must be able to provide sufficient current up to more than 2A in order to

avoid the voltage drop of more than 300mV.

Table 6: VBAT Pins electronic characteristic

Symbol Description Min. Typ. Max. Unit

VBAT Module power voltage 3.4 3.8 4.2 V

IVBAT(peak) Module power peak current in normal mode. 1.0 - 2 A

IVBAT(average) Module power average current in normal mode Please refer to the table 34

IVBAT(sleep) Power supply current in sleep mode

IVBAT(power-off) Module power current in power off mode. - - 20 uA

3.1.1 Power supply Design Guide

Make sure that the voltage on the VBAT pins will never drop below 3.4V.

Note: If the power supply for BAT pins can support up to 2A, using a total of more than 220uF

capacitors is recommended, or else users must use a total of 1000uF capacitors, in order to avoid

the voltage drop of more than 300mV.

Some multi-layer ceramic chip (MLCC) capacitors (0.1/1uF) with low ESR in high frequency band

can be used for EMC.

These capacitors should be put as close as possible to VBAT pads. Also, user should keep VBAT

trace on the circuit board wider than 2 mm to minimize PCB trace impedance. The following figure

shows the recommended circuit.

Figure 5: Power supply application circuit

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In addition, in order to guard over voltage protection, it is suggested to use a zener diode with 5.1V

reverse zener voltage and more than 500mW power dissipation.

Table 7: Recommended zener diode list

No. Manufacturer Part Number power dissipation Package

1 On semi MMSZ5231BT1G 500mW SOD123

2 Prisemi PZ3D4V2H 500mW SOD323

3 Vishay MMSZ4689-V 500mW SOD123

4 Crownpo CDZ55C5V1SM 500mW 0805

3.1.2 Recommended Power Supply Circuit

It is recommended that a switching modepower supply or linear regulator power supply is used. It

is important to make sure that all the components used in the power supply circuit can resist a peak

current up to 2A.

The following figure shows the linear regulatorreference circuit with 5V input and 3.8V output.

Figure 6: Linear regulator reference circuit

If there is a big voltage difference between input and output for VBAT power supply, orthe

efficiency is extremely important,then a switching mode power supply will be preferable. The

following figure shows theswitching mode power supply reference circuit.

Figure 7: Switching modepower supply reference circuit

Note: The Switching Mode power supply solution for VBAT must be chosen carefully against

Electro Magnetic Interference and ripple current from depraving RF performance.

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3.1.3 Volt age Monit or

To monitor the VBAT voltage, the AT command “AT+CBC” can be used.

For monitoring the VBAT voltage outside or within a special range, the AT command

“AT+CVALARM” can be used to enable the under-voltage warning function.

If users need to power off Module, when the VBAT voltage is out of a range, the AT command

“AT+CPMVT” can be used to enable under-voltage power-off function.

Note: Under-voltage warning function and under-voltage power-off function are disabled by

default. For more information about these AT commands, please refer to Document [1].

3.2 Power on/Power off/Reset Function

3.2.1 Power on

Module can be powered on by pulling the PWRKEY pin down to ground.

The PWRKEY pin has been pulled up to dVDDinternally, so you does not need to pull it up

externally. It is strongly recommended to put a100nF capacitor and an ESD protection diode close

to the PWRKEY pin. Please refer to the following figure for the recommended reference circuit.

47K

PWRKEY Power

On off logic

Diode

dVDD

MODULE

100Ω

100nF

4.7K

Turn on /off

impulse

Figure 8: ReferencePower on/off circuit

The power-on scenarios are illustrated in the following figure.

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STATUS

(Output)

Ton

VBAT

PWRKEY

(Input)

Ton(status)

UART Port Undefined Active

Ton(uart)

Undefined Active

USB Port Ton(usb)

Figure 9: Power on timing sequence

Table 8: Power on timing and electronic characteristic

Symbol Parameter Min. Typ. Max. Unit

Ton The time of active low level impulse of PWRKEY

pin to power on module 100 500 - ms

Ton(status) The time from power-on issue to STATUS pin

output high level(indicating power up ready )

22 - - s

Ton(uart) The time from power-on issue to UART port ready 20 s

Ton(usb) The time from power-on issue to USB port ready 20 s

VIH Input high level voltage on PWRKEY pin 0.6 0.8 1.8 V

VIL Input low level voltage on PWRKEY pin -0.3 0 0.5 V

3.2.2 Power off

The following methods can be used to power off Module.

● Method 1: Power off Module by pulling the PWRKEY pin down to ground.

● Method 2: Power off Module by AT command“AT+ CPO F”.

● Method 3: Over-voltage or under-voltage automatic power off. The voltage range can be set by

AT command“AT +CP M VT ”.

● Method 4: Over-temperature or under-temperature automatic power off.

Note: If the temperature is outside the range of -30~+80 , some warning will be reported via

℃

AT port. If the temperature is outside the range of -40~+85 , Module will be powered off

℃

automatically.

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For details about “AT+CPOF” and “AT+CPMVT”, please refer to Document [1].

These procedures will make modules disconnect from the network and allow the software to enter a

safe state and save data before modules are powered off completely.

The power off scenario by pulling down the PWRKEY pin is illustrated in the following figure.

(Output)

Toff

( Input )

Toff(status)

UART Port UndefinedActive

Toff(uart)

Ton

Toff-on

USB Port Undefined

Active

Toff(usb)

PWRKEY

STATUS

Figure 10: Power off timing sequence

Table 9: Power off timing and Electronic Characteristic

Symbol Parameter Time value Unit

Min. Typ. Max.

Toff The active low level time pulse on PWRKEY pin to

power off module 2.5 -- -- s

Toff(status) The time from power-off issue to STATUS pin output

low level(indicating power off )* 22 - - s

Toff(uart) The time from power-off issue to UART port off 15 - - s

Toff(usb) The time from power-off issue to USB port off 15 - - s

Toff-on The buffer time from power-off issue to power-on

issue 0 - - s

3.2.3 Reset Function

Module can be reset by pulling the RESET pin down to ground.

Note: This function is only used as an emergency reset when AT command “AT+CPOF” and the

PWRKEY pin all have lost efficacy.

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The RESET pin has been pulled up to 1.8V internally, so it does not need to be pulled up externally.

It is strongly recommended to put a100nF capacitor and an ESD protection diode close to the

RESET pin. Please refer to the following figure for the recommended reference circuit.

Figure 11: Reference reset circuit

Table 10: RESET pin electronic characteristic

Symbol Description Min. Typ. Max. Unit

Treset The active low level time impulse on

RESET pin to reset module 100 ms

VIH Input high level voltage 1.17 1.8 2.1 V

VIL Input low level voltage -0.3 0 0.8 V

3.3 UART Interface

Module provides a 7-wire UART (universalasynchronous serial transmission) interface as DCE

(Data Communication Equipment). AT commands and data transmission can be performed through

UART interface.

3.3.1 UART Design Guide

The following figures show the reference design.

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Figure 12: UART full modem

Figure 13: UART null Modem

The Module UART is 1.8V voltage interface. If user’s UART application circuit is a 3.3V voltage

interface, the level shifter circuits should be used for voltage matching. The TXB0108RGYR

provided by Texas Instruments is recommended. The following figure shows the voltage matching

reference design.

Figure 14: Reference circuit of level shift

To comply with RS-232-C protocol, the RS-232-C level shifter chip should be used to connect

Module to the RS-232-C interface, for example SP3238ECA, etc.

Note: Module supports the following baud rates: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400,

57600, 115200, 230400, 460800, 921600, 3200000, 3686400, 4000000bps. The default band rate

is 115200bps.

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3.3.2 RI and DTR Behavior

The RI pin can be used to interrupt output signal to inform the host controller such as application

CPU.

Normally RI will stay at high level until certain conditions such as receiving SMS, or a URC report

come in. It will then change to low level. It will stay low until the host controller clears the

interrupted event with “AT+CRIRS” AT command.

Figure 15: RI behaviour（SMS and URC report）

Normally RI will be kept high until a voice call, then it will output periodic rectangular wave with

5900ms low level and 100ms high level. It will output this kind of periodic rectangular wave until

the call is answered or hung up.

Figure 16: RI behaviour（voice call）

Note: For more details of AT commands about UART, please refer to document [1] and [22].

DTR pin can be used to wake Module from sleep. When Module enters sleep mode, pulling down

DTR can wake Module.

3.4 USB Interface

The Module contains a USB interface compliant with the USB2.0 specification as a peripheral, but

the USB charging function is not supported.

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3.4.1 USB Application Guide

Module can be used as a USB device. Module supports the USB suspend and resume mechanism

which can reduce power consumption. If there is no data transmission on the USB bus, Module will

enter suspend mode automatically and will be resumed by some events such as voice call, receiving

SMS, etc.

Figure 17: USB reference circuit

Because of the high bit rate on USB bus, more attention should be paid to the influence of the

junction capacitance of the ESD component on USB data lines. Typically, the capacitance should

be less than1pF. It is recommended to use an ESD protection component such as ESD9L5.0ST5G

provided by On Semiconductor (www.onsemi.com ).

D3 is suggested to select the diode with anti-ESD and voltage surge function, or customer could

add a ZENER diode for surge clamping. The recommend diodes list please refer to table 7.

L is recommended (MURATA) DLW21SN371SQ2L.

Note

：

The USB_DM and USB_DP nets must be traced by 90Ohm+/-10% differential

impedance.

3.5 USIM Interface

Module supports both 1.8V and 3.0V USIM Cards.

Table 11: USIM Electronic characteristic in 1.8V mode (USIM_VDD=1.8V)

Symbol Parameter Min. Typ. Max. Unit

USIM_

VDD LDO power output voltage 1.75 1.8 1.95 V

VIH High-level input voltage 0.65*USIM_VDD - USIM_VDD +0.3 V

VIL Low-level input voltage -0.3 0 0.35*USIM_VDD V

VOH High-level output voltage USIM_VDD -0.45 - USIM_VDD V

VOL Low-level output voltage 0 0 0.45 V

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Table 12: USIM Electronic characteristic 3.0V mode (USIM_VDD=2.95V)

Symbol Parameter Min. Typ. Max. Unit

USIM_

VDD LDO power output voltage 2.75 2.95 3.05 V

VIH High-level input voltage 0.65*USIM_VDD - USIM_VDD +0.3 V

VIL Low-level input voltage -0.3 0 0.25*USIM_VDD V

VOH High-level output voltage USIM_VDD -0.45 - USIM_VDD V

VOL Low-level output voltage 0 0 0.45 V

3.5.1 USIM Application Guide

It is recommended to use an ESD protection component such as ESDA6V1W5 produced by ST

(www.st.com ) or SMF15C produced by ON SEMI (www.onsemi.com ). Note that the USIM

peripheral circuit should be close to the USIM card socket.The following figure shows the 6-pin

SIM card holder reference circuit.

Figure 18: USIM interface reference circuit

Note: USIM_DATA has been pulled up with a100KΩ resistor to USIM_VDD in module. A 100nF

capacitor on USIM_VDD is used to reduceinterference. For more details of AT commands about

USIM, please refer to document [1].

3.5.2 SIM Card Design Guide

SIM card signal could be interferenced by some high frequency signal, it is strongly recommended

to follow these guidelines while designing:

 SIM card holder should be far away from antenna

 SIM traces should keep away from RF lines, VBAT and high-speed signal lines

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 The traces should be as short as possible

 Keep SIM card holder’s GND connect to main ground directly

 Shielding the SIM card signal by ground well

 Recommended to place a 100nF capacitor on SIM_VDD line and keep close to the SIM

card holder

 Add some TVS which parasitic capacitance should not exceed 50pF

 Add 51Ω resistor to (SIM_RST/SIM_CLK/SIM_DATA) signal could enhance ESD

protection

 Add 22pF capacitor to (SIM_RST/SIM_CLK/SIM_DATA) signal to induce RF signal

interference

3.5.3 Recommended USIM Card Holder

It is recommended to use the 6-pin USIM socket such as C707 10M006 512 produced by

Amphenol. User can visit http://www.amphenol.com for more information about the holder.

Figure 19: Amphenol SIM card socket

Table 13: Amphenol USIM Socket Pin Description

Pin Signal Description

C1 USIM_VDD USIM Card Power supply.

C2 USIM_RST USIM Card Reset.

C3 USIM_CLK USIM Card Clock.

C5 GND Connect to GND.

C6 VPP

C7 USIM_DATA USIM Card data I/O.

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3.6 PCM Interface

Module provides a PCM interface for external codec, which can be used inmaster mode with short

sync and 16 bits linear format.

Table 14: PCM Format

Note: For more details about PCM AT commands, please refer to document [1].

3.6.1 PCM Timing

Module supports 2.048 MHz PCM data and sync timing for 16 bits linear format codec.

Figure 20: PCM_SYNC timing

Figure 21: EXT codec to module timing

Characteristics Specification

LineInterfaceFormat Linear(Fixed)

Datalength 16bits(Fixed)

PCM Clock/Sync Source Master Mode(Fixed)

PCMClockRate 2048 KHz (Fixed)

PCMSyncFormat Shortsync(Fixed)

Data Ordering MSB

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Figure 22: Module to EXT codec timing

Table 15: PCM Timing Parameters

Parameter Description Min. Typ. Max. Unit

T(sync) PCM_SYNC cycle time – 125 – μs

T(synch) PCM_SYNC high level time – 488 – ns

T(syncl) PCM_SYNC low level time – 124.5 – μs

T(clk) PCM_CLK cycle time – 488 – ns

T(clkh) PCM_CLK high level time – 244 – ns

T(clkl) PCM_CLK low level time – 244 – ns

T(susync) PCM_SYNC setup time high before falling edge of

PCM_CLK – 122 – ns

T(hsync) PCM_SYNC hold time after falling edge of

PCM_CLK – 366 – ns

T(sudin) PCM_IN setup time before falling edge of

PCM_CLK 60 – – ns

T(hdin) PCM_IN hold time after falling edge of PCM_CLK 60 – – ns

T(pdout) Delay from PCM_CLK rising to PCM_OUT valid – – 60 ns

T(zdout) Delay from PCM_CLK falling to PCM_OUT

HIGH-Z – – 60 ns

3.6.2 PCM Application Guide

The following figure shows the external codec reference design.

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Figure 23: Audio codec reference circuit

Note: Module can transmit PCM data by theUSB portbesidesthe PCM interface. For more

details please refer to documents [1] and [23].

3.7 I2C Interface

Module provides a I2C interface compatible with I2C specification, version 2.1, with clock rate up

to 400 kbps. Its operation voltage is 1.8V.

3.7.1 I2C Design Guide

The following figure shows the I2C bus reference design.

Figure 24: I2C reference circuit

Note

：

SDA and SCLhave pull-up resistors in module. So, 2 external pull up resistors are not needed in

application circuit.

“AT+CRIIC and AT+CWIIC” AT commands could be used to read/write register values of the

I2C peripheral devices.For more details about AT commands please refer to document [1].

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3.8 Network Status

The NETLIGHT pin is used to control Network Status LED, its reference circuit is shown in the

following figure.

Figure 25: NETLIGHT reference circuit

Note: The value of the resistor named “R” depends on the LED characteristic.

Table 16: NETLIGHT pin status

NETLIGHT pin status Module status

Always On Searching Network/Call Connect

200ms ON, 200ms OFF Data Transmit

800ms ON, 800ms OFF Registered network

OFF Power off / Sleep

Note: NETLIGHT output low level as “OFF”, and high level as “ON”.

3.9 Operating Status Indication

The pin50 is for operating status indication of the module. The pin output is high when module is

powered on, and output is low when module is powered off.

Table 17: Pin definition of the STATUS

Pin name Pin number Description

STATUS 50 Operating status indication

Note: For timing about STATUS, please reference to the chapter “3.2 power on/down scenarios”

3.10 Pin Multiplex Function

Some pins of Module could be used for alternate function besides default function.

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Table 18: Pin multiplex function list

Note

：

For more details of AT commands about GPIO multiplex function,please refer to

document [1].

3.11 Other interface

3.11.1 Sink Current Source

The ISINK pin is VBATtolerant and intended to drive some passive devices such as LCD backlight,

white LED, etc. Its output current can be up to 40 mA and be set by the AT command “AT+

CLEDITST”.

Table 19: Sink current electronic characteristic

Symbol Description Min. Typ. Max. Unit

VISINK Voltage tolerant 0.5 - VBAT V

IISINK Current tolerant 0 - 40 mA

ISINK is a ground-referenced current sink. The following figure shows its reference circuit.

Figure 26: ISINK reference circuit

Pin Number Pin Name Default Function Alternate Function

4 SCL SCL GPIO11

5 SDA SDA GPIO10

12 USIM_DET GPIO34 USIM_DET

18 PCM_CLK PCM_CLK GPIO23,SPI_CLK

I2C_SCL

19 PCM_SYNC PCM_SYNC GPIO20,SPI_MOSI

20 PCM_IN PCM_IN, GPIO21,SPI_MISO

21 PCM_OUT PCM_OUT GPIO22,SPI_CS_N

I2C_SDA

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Note: The sinking current can be adjusted to meet the design requirement through the AT

command “AT+ CLEDITST =<0>, <value>”.The “value” ranges from 0 to 8, on behalf of the

current from 0mA to 40mA by 5mA step.

3.11.2 ADC

Module has 1 dedicated ADC pins named ADC. They are available fordigitizing analog signals

such as battery voltage and so on. These electronic specifications are shown in the following table.

Table 20: ADC Electronic Characteristics

Characteristics Min. Typ. Max. Unit

Resolution –15 – Bits

Input Range 0.1 1.7 V

Input serial resistance 1 – – MΩ

Note: “AT+CADC” can be used to read the voltage of the ADC pins, for more details, please

refer to document [1].

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4 RF Specifications

4.1 WCDMA/LTE RF Specifications

Table 21: Conducted transmission power

Frequency Power Min.

WCDMA B2 24dBm +1/-3dB <-50dBm

WCDMA B5 24dBm +1/-3dB <-50dBm

LTE-FDD B2 23dBm +/-2.7dB <-40dBm

LTE-FDD B4 23dBm +/-2.7dB <-40dBm

LTE-FDD B12 23dBm +/-2.7dB <-40dBm

Table 22: Operating frequencies

Frequency Receiving Transmission

WCDMA B2 1930~1990 MHz 1850~1910 MHz

WCDMA B5 869~894 MHz 824~849 MHz

LTE-FDD B2 1930 ~1990 MHz 1850 ~1910 MHz

LTE-FDD B4 2110~2155 MHz 1710 ~1755 MHz

LTE-FDD B12 729~746 MHz 699 ~716 MHz

Table 23: Conducted receive sensitivity

Frequency Receive sensitivity(Typical) Receive sensitivity(MAX)

WCDMA B2 < -110dBm 3GPP

WCDMA B5 < -110dBm 3GPP

LTE See table 24 3GPP

Table 24: Reference sensitivity (QPSK)

E-UTRA

band

3GPP standard Test value 3GPP standard Duplex

1.4 MHz 3MHz 5MHz 10MHz 10 MHz 15 MHz 20 MHz

2 -102.7 -99.7 -98 -95 -101 -93.2 -92 FDD

4 -104.7 -101.7 -100 -97 -102 -95.2 -94 FDD

12 -101.7 -98.7 -97 -94 -101.5 FDD

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4.2 WCDMA/LTE Antenna Design Guide

Users should connect antennas to Module’s antenna pads through the micro-strip line or other types

of RF trace. The trace impedance must be controlled in 50Ω. SIMCom recommends that the total

insertion loss between Module and antenna should meet the following requirements:

Table 25: Trace Loss

Frequency Loss

700MHz-960MHz <0.5dB

1710MHz-2170MHz <0.9dB

2300MHz-2650MHz <1.2dB

To facilitate the antenna tuning and certification test, a RF connector and an antenna matching

circuit should be added. The following figure is the recommended circuit.

Figure 27: Antenna matching circuit (MAIN_ANT)

In above figure, the components R1,C1,C2 and R2 are used for antenna matching, the value of

components can only be achieved after the antenna tuning and usually provided by antenna vendor.

By default, the R1, R2 are 0Ω resistors, and the C1, C2 are reserved for tuning. The component D1

is a TVS for ESD protection, and it is optional for users according to application environment.

The RF test connector is used for the conducted RF performance test, and should be placed as close

as to the module’s MAIN_ANT pin. The traces impedance between Module and antenna must be

controlled in 50Ω.

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Figure 28: Antenna matching circuit (DIV_ANT)

In above figure, R3, C3, C4 and R4 are used for auxiliary antenna matching. By default, the R3, R4

are 0Ωresistors, and the C3, C4 are reserved for tuning. D2 is a TVS for ESD protection, and it is

optional for users according to application environment.

Two TVS are recommended in the table below.

Table 26: Recommended TVS

Package Part Number Vender

0201 LXES03AAA1-154 Murata

0402 LXES15AAA1-153 Murata

Note

：

SIMCom suggests the LTE auxiliary antenna to be kept on, since there are many high

bands in the designing of FDD-LTE. Because of the high insert loss of the RF cable and layout

lines, the receiver sensitivity of these bands above will have risk to meet the authentication

without the diversity antenna.For more details about auxiliary antenna design notice,please

refer to document [25]

To facilitate the antenna tuning and certification test, a RF connector and an antenna matching

circuit should be added. The following figure is the recommended circuit.

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Figure 29: Antenna matching circuit (MAIN_ANT)

In figure 29, the components L106, C118, C119 and R111 or R102 are used for antenna matching,

the values of components can only be achieved after the antenna tuning and usually provided by

antenna vendor. By default, the L106,R111or R102 are 0Ω resistors, and the C118, C119 are

reserved for tuning are reserved for tuning. The RF test connector is used for the conducted RF

performance test, and should be placed as close as to the module’s MAIN_ANT pin. The traces

impedance between module and antenna must be controlled in 50Ω.

4.3 GNSS

SIM7600A-H merges GNSS satellite and network information to provide a high-availability

solution that offers industry-leading accuracy and performance. This solution performs well, even

in very challenging environmental conditions where conventional GNSS receivers fail, and

provides a platform to enable wireless operators to address both location-based services and

emergency mandates.

4.3.1 GNSS Technical specification

 Tracking sensitivity: -159 dBm（GPS）/-158 dBm（GLONASS）

 Cold-start sensitivity: -148 dBm

 Accuracy (Open Sky): 2.5m (CEP50)

 TTFF (Open Sky) : Hot start <1s, Cold start<35s

 Receiver Type: 16-channel, C/A Code

 GPS L1 Frequency: 1575.42±1.023MHz

 GLONASS: 1597.5~1605.8 MHz

 Update rate: Default 1 Hz

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 GNSS data format: NMEA-0183

 GNSS Current consumption : 100mA ((WCDMA/LTE Sleep ,in total on VBAT pins)

 GNSS antenna: Passive/Active antenna

Note: If the antenna is active type, the power should be given by main board, because there is no

power supply on GPS antenna pad. If the antenna is passive, it is suggested that the external

LNA should be used.

4.3.2 GNSS Application Guide

Users can adopt an active antenna or a passive antenna as GNSS signal transceiver. In this

document, all GNSS specification mentioned is from passive antenna. The following is the

reference circuit.

Figure 30: Active antenna circuit

Figure 31: Passive antenna circuit (Default)

In above figures, the components C1 and L1, L2 are used for antenna matching, the values of the

components can only be obtained after the antenna tuning and usually provided by antenna vendor.

C2 in Figure 29 is used for DC blocking. L3 is the matching component of the external LNA, and

the value of L3 is determined by the LNA characteristic and PCB layout. Both VDD of active

antenna and V_LNA need external power supplies which should be considered according to active

antenna and LNA characteristic. LDO/DCDC is recommended to get lower current consuming by

shutting down active antennas and LNA when GNSS is not working.

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LNA should apply the following requirements as table 28. LNA is also suggested to put near the

passive antenna.

Table 27: LNA requirements

Parameter Min Max Unit

Vdd 1.5 3.3 V

Idd 3 mA

LNA_EN 1.3 V

Gain 14 17 dB

VSWR 2

GNSS can be used by NMEA port. User can select NMEA as output through UART or USB.

NMEA sentences are automatic and no command is provided. NMEA sentences include GSV, GGA,

RMC, GSA, and VTG. Before using GNSS, user should configure SIM7600A-H in proper

operating mode by AT command. Please refer to related document for details. SIM7600A-H can

also get position location information through AT directly.

Note: GNSS is closed by default, it could be started by AT+CGPS. The AT command has two

parameters, the first is on/off, and the second is GNSS mode. Default mode is standalone mode.

AGPS mode needs more support from the mobile telecommunication network. Please refer to

document [24] for more details.

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5 Electrical Specifications

5.1 Absolute Maximum Ratings

Absolute maximumrating for digital and analog pins of Module are listed in the following table:

Table 28: Absolute maximum ratings

Parameter Min. Max. Unit

Voltage at VBAT -0.5 6.0 V

Voltage at VBUS -0.5 6.3 V

Voltage at digital pins (RESET,SPI,GPIO,I2C,UART,PCM) -0.3 2.1 V

Voltage at digital pins :USIM -0.3 3.05 V

Voltage at PWRKEY -0.3 1.8

5.2 Operating Conditions

Table 29: Recommended operating ratings

Parameter Min. Typ. Max. Unit

Voltage at VBAT 3.4 3.8 4.2 V

Voltage at VBUS 3.6 5 5.25 V

Table 30: 1.8V Digital I/O characteristics*

Parameter Description Min. Typ. Max. Unit

VIH High-level input voltage 1.17 1.8 2.1 V

VIL Low-level input voltage -0.3 0 0.63 V

VOH High-level output voltage 1.35 - 1.8 V

VOL Low-level output voltage 0 - 0.45 V

IOH High-level output current(no

pull down resistor) - 2 mA

IOL Low-level output current(no pull

up resistor) - -2 - mA

IIH Input high leakage current (no

pull down resistor) - - 1 uA

IIL Input low leakage current(no

pull up resistor) -1 - - uA

*Note: These parameters are for digital interface pins, such as SPI, GPIOs (NETLIGHT), I2C,

UART, PCM.

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The operating temperature of Module is listed in the following table.

Table 31: Operating temperature

Parameter Min. Typ. Max. Unit

Normal operation temperature -30 25 80 ℃

Extended operation temperature* -40 25 85 ℃

Storage temperature -45 25 +90 ℃

*Note: Module is able to make and receive voice calls, data calls, SMS and make

WCDMA/HSPA+/LTE traffic in -40℃ ~ +85℃. The performance will be reduced slightly from

the 3GPP specifications if the temperature is outside the normal operating temperature range

and still within the extreme operating temperature range.

5.3 Operating Mode

5.3.1 Operating Mode Definition

The table belowsummarizes the various operating modes of Module series products.

Table 32: Operating mode Definitions

Mode Function

Normal operation

GSM/WCDMA / LTE

Sleep

In this case, the current consumption of module will be reduced to the

minimal level and the module can still receive paging message and

SMS.

GSM/WCDMA / LTE

Idle

Software is active. Module is registered to the network, and the

module is ready to communicate.

GSM/WCDMA / LTE

Talk

Connection between two subscribers is in progress. In this case, the

power consumption depends on network settings such as DTX off/on,

FR/EFR/HR, hopping sequences, antenna.

GSM/WCDMA/LTE

Standby

Module is ready for data transmission, but no data is currently sent or

received. In this case, power consumption depends on network

settings.

GPRS/EDGE/WCDM

A / LTE transmission

There is data transmission in progress. In this case, power

consumption is related to network settings (e.g. power control level);

uplink/downlink data rates, etc.

Minimum functionality

mode

AT command “AT+CFUN=0” can be used to set the module to a

minimum functionality mode without removing the power supply. In

this mode, the RF part of the module will not work and the USIM

card will not be accessible, but the serial port and USB port are still

accessible. The power consumption in this mode is lower than normal

mode.

Flight mode AT command “AT+CFUN=4” or pulling down the FLIGHTMODE

pin can be used to set the module to flight mode without removing the

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power supply. In this mode, the RF part of the module will not work

but the serial port and USB port are still accessible. The power

consumption in this mode is lower than normal mode.

Power off

Module will go into power off mode by sending the AT command

“AT+CPOF” or by pulling down the PWRKEY pin normally. In this

mode the power management unit shuts down the power supply and

software is not active. The serial port and USB are is not accessible.

5.3.2 Sleep Mode

In sleep mode, the current consumption of module will be reduced to the minimal level, and

module can still receive paging message and SMS.

Several hardware and software conditions must be satisfied together in order to let Module enter

into sleep mode:

1. UART condition

2. USB condition

3. Software condition

Note: Before designing, pay attention to how to realize sleeping/waking function and refer to

Document [26] for more details.

5.3.3 Minimum Functionality Mode and Flight Mode

Minimum functionality mode ceasesa majority functionof module, thus minimizing the power

consumption. This mode is set by the AT command which provides a choice of the functionality

levels.

● AT+CFUN=0: Minimum functionality

● AT+CFUN=1: Full functionality (Default)

● AT+CFUN=4: Flight mode

If Module has been set to minimum functionality mode, the RF function and USIM card function

will be closed. In this case, the serial port and USB are still accessible, but RF function and USIM

card will be unavailable.

If Module has been set to flight mode, the RF function will be closed. In this case, the serial port

and USB are still accessible, but RF function will be unavailable.

When Module is in minimum functionality or flight mode, it can return to full functionality by the

AT command “AT+CFUN=1”.

5.4 Current Consumption

The current consumption is listed in the table below.

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Table 33: Current consumption on VBAT Pins (VBAT=3.8V)

UMTS Sleep/Idle Mode

WCDMA supply current

(without USB connection)

Sleep mode @DRX=9Typical: 1.11

Idle mode @DRX=9Typical: 17.5

LTE Sleep/Idle mode

LTE supply current

(without USB connection)

Sleep mode Typical: 1.56

Idle mode Typical: 22

UMTS Talk

WCDMA B2 @Power 22dBm Typical: 524mA

WCDMA B5 @Power 23.48dBm Typical: 480mA

HSDPA Data

WCDMA B2 @Power 24dBm Typical: TBD

WCDMA B5 @Power 24dBm Typical: TBD

LTE Data

LTE-FDD B2

@5 MHz 22.2dBm Typical: 589mA

@10 MHz 22.7dBm Typical: 577mA

@20 MHz 22.38dBm Typical: 626mA

LTE-FDD B4

@5 MHz 23.05dBm Typical: 519mA

@10 MHz 23.04dBm Typical: 556mA

@20 MHz 22.83dBm Typical: 600mA

LTE-FDD B12 @5 MHz 22.69dBm Typical: 516mA

@10 MHz 22.9dBm Typical: 512mA

5.5 ESD Notes

Module is sensitive to ESD in the process of storage, transporting and assembling. Especially,

Module is mounted on the users’ mother board, The ESD components should be placed beside the

connectors which human body might touch, such as USIM card holder, audio jacks, switches and

keys, etc. The following table shows the Module ESD measurement performance without any

external ESD component.

Table 34: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)

Part Contact discharge Air discharge

GND +/-6K +/-12K

VBAT +/-5K +/-10K

Antenna port +/-5K +/-10K

USB +/-4K +/-8K

UART +/-4K +/-8K

PCM +/-4K +/-8K

Other PADs +/-3K +/-6K

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6 SMT Production Guide

6.1 Top and Bottom View of Module

Figure 32: Top and bottom view of Module

6.2 Typical SMT Reflow Profile

SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only

a generic recommendation and should be adjusted to the specific application and manufacturing

constraints.

Figure 33: The ramp-soak-spike Reflow Profile of Module

Note: For more details about secondary SMT, please refer to the document [21].

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6.3 Moisture Sensitivity Level (MSL)

Module is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033.

If the prescribed time limit is exceeded, users should bake modules for 192 hours in drying

equipment (<5% RH) at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not

heat-resistant, and only can be baked at 45° C.

Table 35: Moisture Sensitivity Level and Floor Life

Moisture Sensitivity Level

(MSL)

Floor Life (out of bag) at factory ambient≤30°C/60% RH or as

stated

1 ≦℃

Unlimited at 30 /85% RH

2 1 year

2a 4 weeks

3 168 hours

4 72 hours

5 48 hours

5a 24 hours

6 Mandatory bake before use. After bake, it must be reflowed within the

time limit specified on the label.

NOTE: IPC / JEDEC J-STD-033 standard must be followed for production and storage.

6.4 Stencil Foil Design Recommendation

The recommended thickness of stencil foil is more than 0.1mm.

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7 Packaging

Module module support tray packaging.

Figure 34: Packaging introduce

Module tray drawing：

Figure 35: Module tray drawing introduce

Table 36: Tray size

Length（±3mm） Width（±3mm） Module number

242.0 161.0 15

Small carton drawing：

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Figure 36: Small carton drawing introduce

Table 37: Small Carton size

Length（±10mm） Width（±10mm） Height（±10mm） Module number

270 180 120 15*20=300

Big carton drawing：

Figure 37: Big carton drawing introduce

Table 38: Big carton size

Length（±10mm） Width（±10mm） Height（±10mm）Module number

380 280 280 300*4=1200

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Appendix

A. Reference Design

Figure 38: Reference design

Note: The UART port suggest to be used by isolated circuit .

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B. Coding Schemes and Maximum Net Data Rates over Air Interface

Table 39: Coding schemes and maximum net data rates over air interface

Multislot definition(GPRS/EDGE)

Slot class DL slot number UL slot number Active slot number

1 1 1 2

2 2 1 3

3 2 2 3

4 3 1 4

5 2 2 4

6 3 2 4

7 3 3 4

8 4 1 5

9 3 2 5

10 4 2 5

11 4 3 5

12 4 4 5

GPRS coding scheme Max data rata（4 slots） Modulation type

CS 1 = 9.05 kb/s / time slot 36.2 kb/s GMSK

CS 2 = 13.4 kb/s / time slot 53.6 kb/s GMSK

CS 3 = 15.6 kb/s / time slot 62.4 kb/s GMSK

CS 4 = 21.4 kb/s / time slot 85.6 kb/s GMSK

EDGE coding scheme Max data rata（4 slots） Modulation type

MCS 1 = 8.8 kb/s/ time slot 35.2 kb/s GMSK

MCS 2 = 11.2 kb/s/ time slot 44.8 kb/s GMSK

MCS 3 = 14.8 kb/s/ time slot 59.2 kb/s GMSK

MCS 4 = 17.6 kb/s/ time slot 70.4 kb/s GMSK

MCS 5 = 22.4 kb/s/ time slot 89.6 kb/s 8PSK

MCS 6 = 29.6 kb/s/ time slot 118.4 kb/s 8PSK

MCS 7 = 44.8 kb/s/ time slot 179.2 kb/s 8PSK

MCS 8 = 54.4 kb/s/ time slot 217.6 kb/s 8PSK

MCS 9 = 59.2 kb/s/ time slot 236.8 kb/s 8PSK

HSDPA device category Max data rate（peak） Modulation type

Category 1 1.2Mbps 16QAM,QPSK

Category 2 1.2Mbps 16QAM,QPSK

Category 3 1.8Mbps 16QAM,QPSK

Category 4 1.8Mbps 16QAM,QPSK

Category 5 3.6Mbps 16QAM,QPSK

Category 6 3.6Mbps 16QAM,QPSK

Category 7 7.2Mbps 16QAM,QPSK

Category 8 7.2Mbps 16QAM,QPSK

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Category 9 10.2Mbps 16QAM,QPSK

Category 10 14.4Mbps 16QAM,QPSK

Category 11 0.9Mbps QPSK

Category 12 1.8Mbps QPSK

Category 13 17.6Mbps 64QAM

Category 14 21.1Mbps 64QAM

Category 15 23.4Mbps 16QAM

Category 16 28Mbps 16QAM

Category 17 23.4Mbps 64QAM

Category 18 28Mbps 64QAM

Category 19 35.5Mbps 64QAM

Category 20 42Mbps 64QAM

Category 21 23.4Mbps 16QAM

Category 22 28Mbps 16QAM

Category 23 35.5Mbps 64QAM

Category 24 42.2Mbps 64QAM

HSUPA device category Max data rate（peak） Modulation type

Category 1 0.96Mbps QPSK

Category 2 1.92Mbps QPSK

Category 3 1.92Mbps QPSK

Category 4 3.84Mbps QPSK

Category 5 3.84Mbps QPSK

Category 6 5.76Mbps QPSK

LTE-FDD device category

(Downlink) Max data rate（peak） Modulation type

Category 1 10Mbps QPSK/16QAM/64QAM

Category 2 50Mbps QPSK/16QAM/64QAM

Category 3 100Mbps QPSK/16QAM/64QAM

Category 4 150Mbps QPSK/16QAM/64QAM

LTE-FDD device category

(Uplink) Max data rate（peak） Modulation type

Category 1 5Mbps QPSK/16QAM

Category 2 25Mbps QPSK/16QAM

Category 3 50Mbps QPSK/16QAM

Category 4 50Mbps QPSK/16QAM

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C. Related Documents

Table 40: Related documents

SN Title Description

[1] SIM7X00 Series_AT

Command Manual_V1.xx SIM7X00 Series_AT Command Manual

[2] ITU-T Draft new

recommendationV.25ter Serial asynchronous automatic dialing and control

[3] GSM 07.07 Digital cellular telecommunications (Phase 2+); AT command

set for GSM Mobile Equipment (ME)

[4] GSM 07.10 Support GSM 07.10 multiplexing protocol

[5] GSM 07.05

Digital cellular telecommunications (Phase 2+); Use of Data

Terminal Equipment – Data Circuit terminating Equipment

(DTE – DCE) interface for Short Message Service (SMS)

and Cell Broadcast Service (CBS)

[6] GSM 11.14

Digital cellular telecommunications system (Phase 2+);

Specification of the SIM Application Toolkit for the

Subscriber Identity Module – Mobile Equipment (SIM – ME)

interface

[7] GSM 11.11

Digital cellular telecommunications system (Phase 2+);

Specification of the Subscriber Identity Module – Mobile

Equipment (SIM – ME) interface

[8] GSM 03.38 Digital cellular telecommunications system (Phase 2+);

Alphabets and language-specific information

[9] GSM 11.10

Digital cellular telecommunications system (Phase 2) ；

Mobile Station (MS) conformance specification； Part 1:

Conformance specification

[10] 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5);

Mobile Station (MS) conformance specification

[11] 3GPP TS 34.124 Electromagnetic Compatibility (EMC) for mobile terminals

and ancillary equipment.

[12] 3GPP TS 34.121 Electromagnetic Compatibility (EMC) for mobile terminals

and ancillary equipment.

[13] 3GPP TS 34.123-1

Technical Specification Group Radio Access Network;

Terminal conformance specification; Radio transmission and

reception (FDD)

[14] 3GPP TS 34.123-3 User Equipment (UE) conformance specification; Part 3:

Abstract Test Suites.

[15] EN 301 908-02 V2.2.1

Electromagnetic compatibility and Radio spectrum Matters

(ERM); Base Stations (BS) and User Equipment (UE) for

IMT-2000. Third Generation cellular networks; Part 2:

Harmonized EN for IMT-2000, CDMA Direct Spread

(UTRA FDD) (UE) covering essential requirements of article

3.2 of the R&TTE Directive

[16] EN 301 489-24 V1.2.1

Electromagnetic compatibility and Radio Spectrum Matters

(ERM); Electromagnetic Compatibility (EMC) standard for

radio equipment and services; Part 24: Specific conditions for

IMT-2000 CDMA Direct Spread (UTRA) for Mobile and

portable (UE) radio and ancillary equipment

[17] IEC/EN60950-1(2001) Safety of information technology equipment (2000)

[18] 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5);

Mobile Station (MS) conformance specification

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[19] GCF-CC V3.23.1 Global Certification Forum - Certification Criteria

[20] 2002/95/EC

Directive of the European Parliament and of the Council of

27 January 2003 on the restriction of the use of certain

hazardous substances in electrical and electronic equipment

(RoHS)

[21] Module

secondary-SMT-UGD-V1.xx

Module secondary SMT Guidelines

[22] SIM7X00

Series_UART_Application

Note_V1.xx

SIM7X00 Series_UART_Application Note

[23]

SIM7X00 Series_USB

AUDIO_Application

Note_V1.xx

SIM7X00 Series_USB AUDIO_Application Note

[24] Antenna design guidelines for

diversity receiver system

Antenna design guidelines for diversity receiver system

[25] SIM7X00 Series_Sleep Mode_

Application Note_V1.xx

SIM7X00 Series_Sleep Mode_ Application Note

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D. Terms and Abbreviations

Table 41: Terms and Abbreviations

Abbreviation Description

ADC Analog-to-Digital Converter

ARP Antenna Reference Point

BER Bit Error Rate

BTS Base Transceiver Station

CS Coding Scheme

CSD Circuit Switched Data

CTS Clear to Send

DAC Digital-to-Analog Converter

DRX Discontinuous Reception

DSP Digital Signal Processor

DTE Data Terminal Equipment (typically computer, terminal, printer)

DTR Data Terminal Ready

DTX Discontinuous Transmission

EFR Enhanced Full Rate

EGSM Enhanced GSM

EMC Electromagnetic Compatibility

ESD Electrostatic Discharge

ETS European Telecommunication Standard

EVDO Evolution Data Only

FCC Federal Communications Commission (U.S.)

FD SIM fix dialing phonebook

FDMA Frequency Division Multiple Access

FR Full Rate

GMSK Gaussian Minimum Shift Keying

GPRS General Packet Radio Service

GSM Global Standard for Mobile Communications

GNSS Global Navigation Satellite System

HR Half Rate

HSPA High Speed Packet Access

I2C Inter-Integrated Circuit

IMEI International Mobile Equipment Identity

LTE Long Term Evolution

MO Mobile Originated

MS Mobile Station (GSM engine), also referred to as TE

MT Mobile Terminated

PAP Password Authentication Protocol

PBCCH Packet Switched Broadcast Control Channel

PCB Printed Circuit Board

PCS Personal Communication System, also referred to as GSM 1900

RF Radio Frequency

RMS Root Mean Square (value)

RTC Real Time Clock

SIM Subscriber Identification Module

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SMS Short Message Service

SPI serial peripheral interface

SMPS Switched-mode power supply

TDMA Time Division Multiple Access

TE Terminal Equipment, also referred to as DTE

TX Transmit Direction

UART Universal Asynchronous Receiver & Transmitter

VSWR Voltage Standing Wave Ratio

SM SIM phonebook

NC Not connect

EDGE Enhanced data rates for GSM evolution

HSDPA High Speed Downlink Packet Access

HSUPA High Speed Uplink Packet Access

ZIF Zero intermediate frequency

WCDMA Wideband Code Division Multiple Access

VCTCXO Voltage control temperature-compensated crystal oscillator

USIM Universal subscriber identity module

UMTS Universal mobile telecommunications system

UART Universal asynchronous receiver transmitter

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E. Safety Caution

Table 42: Safety caution

Marks Requirements

When in a hospital or other health care facility, observe the restrictions about the use

of mobiles. Switch the cellular terminal or mobile off, medical equipment may be

sensitive and not operate normally due to RF energy interference.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is

switched off. The operation of wireless appliances in an aircraft is forbidden to

prevent interference with communication systems. Forgeting to think much of these

instructions may impact the flight safety or offend local legal action, or both.

Do not operate the cellular terminal or mobile in the presence of flammable gases or

fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,

chemical plants or where blasting operations are in progress. Operation of any

electrical equipment in potentially explosive atmospheres can constitute a safety

hazard.

Your cellular terminal or mobile receives and transmits radio frequency energy while

switched on. RF interference can occur if it is used close to TV sets, radios,

computers or other electric equipment.

Road safety comes first! Do not use a hand-held cellular terminal or mobile when

driving a vehicle, unless it is securely mounted in a holder for hands free operation.

Before making a call with a hand-held terminal or mobile, park the vehicle.

GSM cellular terminals or mobiles operate over radio frequency signals and cellular

networks and cannot be guaranteed to connect in all conditions, especially with a

mobile fee or an invalid SIM card. While you are in this condition and need emergent

help, please remember to use emergency calls. In order to make or receive calls, the

cellular terminal or mobile must be switched on and in a service area with adequate

cellular signal strength.

Some networks do not allow for emergency call if certain network services or phone

features are in use (e.g. lock functions, fixed dialing etc.). You may have to

deactivate those features before you can make an emergency call.

Also, some networks require that a valid SIM card be properly inserted in the cellular

terminal or mobile.

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Contact us:

Shanghai SIMCom Wireless Solutions Ltd.

Add: SIM Technology Building, No.633, Jinzhong Road, Changning District, Shanghai P.R. China

200335

Tel：+86 21 3235 3300

Fax：+86 21 3235 3020

URL：www.simcomm2m.com

Simcom 201710 LTE-FDD/HSPA MODULE User Manual 04 SIM7600A H User Manual V1 01 20171124

Shanghai Simcom Ltd. LTE-FDD/HSPA MODULE 04 SIM7600A H User Manual V1 01 20171124

04 SIM7600A-H_User_Manual_V1.01_20171124

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