Sony Hcd C5 Users Manual

HCD-C5 to the manual 9b93600f-c148-4d4f-b428-f79cf892dfc6

2015-01-23

: Sony Sony-Hcd-C5-Users-Manual-297930 sony-hcd-c5-users-manual-297930 sony pdf

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HCD-C5
AEP Model
UK Model
E Model
Australian Model
SERVICE MANUAL
MICRO HI-FI COMPONENT SYSTEM
Sony Corporation
Home Audio Company
Shinagawa Tec Service Manual Production Group
9-873-244-02
2001I1600-1
© 2001.9
SPECIFICATIONS
Ver 1.1 2001. 09
HCD-C5 is the Amplifier, CD player, MD
Deck and Tuner section in CMT-C5.
Model Name Using Similar Mechanism New
CD Mechanism Type TN-CCD1001Z
Base Unit Name TT BASE ASSY
Optical Pick-up Name OPTIMA-720L1E
Model Name Using Similar Mechanism New
MD Mechanism Type MDM-7B4M
Optical Pick-up Name KMS-260E/Z-NP
CD
Section
MD
Section
Amplifier section
European model:
DIN power output (rated): 15 + 15 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
20 + 20 W
(6 ohms at 1 kHz, 10%
THD)
Music power output (reference):
45 + 45 W
Australian model:
The following measured at 230 V AC, 60 Hz
DIN power output (rated): 15 + 15 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
20 + 20 W
(6 ohms at 1 kHz, 10%
THD)
Other models:
The following measured at 220 V AC, 60 Hz
DIN power output (rated): 15 + 15 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
20 + 20 W
(6 ohms at 1 kHz, 10%
THD)
Inputs
TAPE IN (stereo minijack):
Sensitivity 250 mV,
impedance 47 kilohms
DIGITAL OPTICAL IN (Supported sampling
frequencies: 32 kHz, 44.1 kHz and 48 kHz)
Outputs
TAPE OUT (stereo minijack):
Sensitivity 250 mV,
impedance 1 kilohmes
PHONES (stereo minijack):
Accepts headphones with
an impedance of 8 ohms
or more
CD player section
System Compact disc and digital
audio system
Laser Semiconductor laser
(λ = 780 nm)
Emission
duration: continuous
Frequency response 2 Hz – 20 kHz
MD deck section
System MiniDisc digital audio
system
Laser Semiconductor laser
(λ=780 nm)
Emission duration:
continuous
Sampling frequency 44.1 kHz
Frequency response 5 Hz – 20 kHz
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range 87.5 – 108.0 MHz
(50-kHz step)
Antenna FM wire antenna
Antenna terminals 75 ohm unbalanced
Intermediate frequency 10.7 MHz
AM tuner section
Tuning range
European model: 531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
Other models: 530 – 1,710 kHz
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
Antenna AM loop antenna, external
antenna terminal
Intermediate frequency 450 kHz
General
Power requirements
European model: 230 V AC, 50/60 Hz
Australian model: 230 V AC, 50/60 Hz
Other models: 220 V AC , 50/60 Hz
Power consumption
European model: See the nameplate
0.5 W (at the power
saving mode)
Other models: See the nameplate
Dimensions (w/h/d) Approx. 145 × 125 ×
273 mm incl. projecting
parts and controls
Mass Approx. 4.5 kg
Supplied accessories Remote commander (1)
AM loop antenna (1)
FM wire antenna (1)
Design and specifications are subject to change
without notice.
2
HCD-C5
SELF-DIAGNOSIS FUNCTION
The self-diagnosis function consists of error codes for customers, which are displayed automatically when errors occur,
and error codes, which show the error history in the test mode during servicing. For details on how to view error codes
for the customer, refer to the following box in the instruction manual. For details on how to check error codes during
servicing, refer to the following “Procedure for using the Self-Diagnosis Function (Error History Display Mode)”.
Self-diagnosis display
This system has a Self-diagnosis display
function to let you know if there is a system
malfunction. The display shows a code made
up of 3 or 5 letters and a message alternately to
show you the problem. To solve the problem
refer to the following list. If any problem
persists, consult your nearest Sony dealer.
C11/Protected
The MD is protected against erasure.
cRemove the MD and slide the tab to close the
slot (see page 18).
C12/Cannot Copy
You tried to record a CD or MD with a format that
the system does not support, such as a CD-ROM.
cRemove the disc and turn off the system once,
then turn it on again.
C13/REC Error
Recording could not be performed properly.
cMove the system to a stable place, and start
recording over from the beginning.
The MD is dirty or scratched, or the MD does not
meet the standards.
cReplace the MD and start recording over from
the beginning.
C13/Read Error
The MD deck cannot read the disc information
properly.
cRemove the MD once, then load it again.
E0101/LASER NG
There is a problem with the optical pickup.
cThe optical pickup may have failed. Consult your
nearest Sony dealer.
C14/Toc Error
The MD deck cannot read the disc information
properly.
cReplace the MD.
Erase all the recorded contents of the MD using
All Erase Function (see page 29).
C41/Cannot Copy
The sound source is a copy of a commercially
available music software, or you tried to record a
CD-R (Recordable CD).
cThe Serial Copy Management System prevents
making a digital copy (see page 48). You cannot
record a CD-R.
C71/Check OPT-IN
This appears momentarily because of the signal of
the digital broadcast during recording.
cThere is no affect on the recorded contents.
No component is connected to the DIGITAL
OPTICAL IN jack, or a digital component is not
connected properly.
cConnect a digital component to the DIGITAL
OPTICAL IN jack properly using a digital
connecting cable (not supplied, see page 43).
The connected digital component is not turned on.
cSee the operating instructions supplied with the
connected component and confirm whether the
component is turned on.
The digital connecting cable connected to the
DIGITAL OPTICAL IN jack is pulled out, or the
connected digital component is turned off during
digital recording.
cConnect the cable, or turn on the digital
component.
E0001/MEMORY NG
There is an error in the internal data that the system
needs in order to operate.
cConsult your nearest Sony dealer.
3
HCD-C5
TABLE OF CONTENTS
SELF-DIAGNOSIS FUNCTION ..................................... 2
1. SERVICING NOTES ............................................... 4
2. GENERAL ................................................................... 7
3. DISASSEMBLY ......................................................... 9
4. TEST MODE ............................................................... 24
5. ELECTRICAL ADJUSTMENTS
CD Section ...................................................................... 33
MD Section ..................................................................... 34
6. DIAGRAMS
6-1. NOTE FOR PRINTED WIRING BOARDS AND
SCHEMATIC DIAGRAMS ............................................ 45
– Wave forms................................................................... 45
– Circuit Boards Location............................................... 45
6-2. Block Diagram – CD Servo Section – ............................ 46
6-3. Block Diagram – MD Servo Section – ........................... 47
6-4. Block Diagram – MAIN Section – ................................. 48
6-5. Printed Wiring Boards – CD Section – .......................... 49
6-6. Schematic Diagram – CD Section – ............................... 50
6-7. Printed Wiring Board – BD (MD) Board – .................... 51
6-8. Schematic Diagram – BD (MD) Board (1/2) – .............. 52
6-9. Schematic Diagram – BD (MD) Board (2/2) – .............. 53
6-10. Printed Wiring Board – MD DIGITAL Board – ............ 54
6-11. Schematic Diagram – MD DIGITAL Board – ............... 55
6-12. Printed Wiring Board – UCOM Board – ........................ 56
6-13. Schematic Diagram – UCOM Board – ........................... 57
6-14. Printed Wiring Boards – AUDIO Section –.................... 58
6-15. Schematic Diagram – AUDIO Section – ........................ 59
6-16. Printed Wiring Board – PANEL Board – ....................... 60
6-17. Schematic Diagram – PANEL Board – .......................... 61
6-18. Printed Wiring Boards – POWER Section – .................. 62
6-19. Schematic Diagram – POWER Section – ...................... 63
6-20. IC Block Diagrams ......................................................... 64
6-21. IC Pin Function Description ........................................... 68
7. EXPLODED VIEWS ................................................ 76
8. ELECTRICAL PARTS LIST .............................. 86
4
HCD-C5 SECTION 1
SERVICING NOTE
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the bottom
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of soldering iron around 270˚C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
FOR CD
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
FOR MD
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
This caution
label is
located inside
the unit.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
5
HCD-C5
SERVICE POSITION OF THE CD MECHANISM DECK
SERVICE POSITION OF THE MD MECHANISM DECK
CD MECHANISM DECK
(TN-CCD1001Z)
STAND
BD (CD) BOAR
D
UCOM BOARD
CN101
CN204
MD MECHANISM (MDM-7B4M)
MD DIGITAL BOARD
AUDIO BOARD
UCOM BOARD
BD (CD) BOARD
BD (MD) BOARD
CN102
CN102
CN201
CN701
CN103
CN702
CN703
CN601
CN101
CN201
CN204
CN203
PANEL BOARD
6
HCD-C5
JIG FOR CHECKING BD (MD) BOARD WAVEFORM
The special jig (J-2501-196-A) is useful for checking the waveform of the BD (MD) board. The names of terminals and the checking items
to be performed are shown as follows.
I+3V : For measuring IOP (Check the deterioration of the optical pick-up laser)
IOP : For measuring IOP (Check the deterioration of the optical pick-up laser)
GND : Ground
TE : Tracking error signal (Traverse adjustment)
FE : Focus error signal
VC : Reference level for checking the signal
RF : RF signal (Check jitter)
I+3V
CN105
IOP
TE
VC
GND FE RF
I+3V
IOP
GND
TE
FE
VC
RF
I+3V
IOP
GND
TE
FE
VC
RF
1
7
for 7
B
7
HCD-C5
SECTION 2
GENERAL
4
Parts Identification
The items are arranged in alphabetical order.
Refer to the pages indicated in parentheses () for details.
Main unit
12
3
4
5
678
9
0
qa
CD SYNC HIGH 7 (19, 51)
CD SYNC NORMAL 8 (19)
CD Z 2 (10, 51)
FUNCTION qa (9, 11, 13, 14, 16,
21–37, 44)
MD Z 6 (15, 18, 26)
REC/REC IT 8 (20, 21, 24, 26,
44, 51)
Remote sensor 9
TUNING +/– 5 (36, 37)
VOL +/– q; (40)
BUTTON DESCRIPTIONS
@/1 (power) 1 (7, 18, 26, 27, 37,
40, 42)
u 3 (9–11, 14–16, 19, 20, 25,
44)
x 4 (10, 11, 15, 16, 19–21, 26,
44)
. > 5 (10, 11, 13, 15, 16,
22–35)
m M 5 (10, 15, 30, 32)
This section is extracted
from instruction manual.
8
HCD-C5
Parts Identification
5
Remote control
1234
5
6
7
qa
qs
qd
qf
qg
qhqjqkql
w;
wa
ws
wd
wf
wg
wh
wj
wk
8
9
0
CD x qh (10)
CD X ws (10)
CD N wd (9, 11, 20)
CLEAR 9 (11, 16, 28, 38)
CLOCK/TIMER SELECT 6
(41, 42)
CLOCK/TIMER SET 7 (8, 40,
41)
CURSOR T/t wh (8, 13, 28)
DBFB qf (39)
DISPLAY wk (8, 12, 17, 38)
ENTER/YES 8 (8, 11, 13, 14,
16, 21–36, 38, 40–42)
FM MODE qj (37)
FUNCTION w; (9, 11, 13, 14, 16,
19, 21–37, 44)
Letter/Number buttons wj (10,
13, 15, 16, 27, 28, 37)
MD x qs (15)
MD X wf (15)
MD N wg (14, 16, 19, 20, 25)
MENU/NO q; (13, 14, 22–26,
28–36)
NAME EDIT/SELECT 3 (13,
27, 28, 38)
PLAY MODE qk (9, 11, 14, 16,
26, 34, 35)
PRESET EQ qg (39)
REPEAT qj (10, 15)
SCROLL 5 (12, 14, 17, 28)
SLEEP 1 (39)
TIME 2 (8, 11, 12, 16, 17)
TUNER BAND wa (36, 37)
TUNING MODE qk (36, 37)
TUNING +/– ql (36, 37)
VOL +/– qd (40)
BUTTON DESCRIPTIONS
@/1 (power) 4 (7, 18, 26, 27, 37,
40, 42)
. > qa (10, 11, 13–16, 22–
35, 40–42)
–/+ qa (8, 40, 42)
m M wh (10, 15, 30, 32, 42)
Setting the time
1
Turn on the system.
2
Press CLOCK/TIMER SET on the
remote.
If you are setting the clock for the first time,
go to step 5.
3
Press – or + (. or >) on the
remote repeatedly until “CLOCK SET?”
appears in the display.
4
Press ENTER/YES on the remote.
The day indication flashes.
5
Press – or + (. or >) on the
remote repeatedly to set the day, and
then press ENTER/YES or CURSORt
on the remote.
The hour indication flashes.
6
Press – or + (. or >) on the
remote to set the hour, and then press
ENTER/YES or CURSORt on the
remote.
The minute indication flashes.
7
Press – or + (. or >) on the
remote repeatedly to set the minute,
and then press ENTER/YES on the
remote.
If you made a mistake
Press TCURSOR or CURSORt on the
remote until the indication you wish to change
(day, hour, minute) flashes, and then change
the setting.
To reset the time
Start over from step 1.
9
HCD-C5
SECTION 3
DISASSEMBLY
• This set can be disassembled in the order shown below.
• The dotted square with arrow ( →) prompts you to move to the next job when all of the works within the dotted square ( ) are
completed.
10
HCD-C5
Note: Follow the disassembly procedure in the numerical order given.
3-1. BOTTOM PLATE, CASE
3-2. PANEL BOARD
2
three screws
(+BVTT 3 x 5)
1
four screws
(+BVTT 3 x 5)
5
claw
6
case
3
bottom plate
A
A
4
screw
(+BVTT 3 x 5)
7
six screws
(+B 2 x 6)
9
PANEL board
8
two claws
3
screw (+K 3 x 6)
2
screw
(+K 3 x 6)
1
two screws
(+BVTT 3 x 5)
4
screw
(+BVTT 3 x 5
)
5
ground wire
6
wire (flat type)
(16 core) (CN201)
11
HCD-C5
3-3. CD MECHANISM DECK (TN-CCD1001Z), BD (CD) BOARD
1
two screws
(+BVTT 3 x 5)
q;
screw
(+BVTT 2 x 5)
9
two screws
(+BVTT 2.6 x 5)
6
four screws
(+BVTT 3 x 5)
3
two screws
(+BVTT 3 x 5)
4
screw
(+BVTT 3 x 5)
2
screw
(+BVTT 3 x 5)
qs
cushion (A)
qa
bracket (CD), foot (felt)
qd
CD mechanism deck
(TN-CCD1001Z)
5
wire (flat type) (29 core)
(CN204)
7
board to board connector
8
BD (CD) boar
d
CN103
CN1
12
HCD-C5
3-4. CONNECTOR BOARD
5
FPC holder
6
screw
(+P 2 x 2.5)
7
wire clamper
8
CONNECTOR boar
d
4
Remove the soldering.
1
Remove solderings
starting from the
left LOADING (+),
(–), red and black.
2
Remove solderings starting from the left
green, yellow, orange, red and brown.
3
Remove solderings starting from
the top left SPINDLE (+), (–), FD
MOTOR (+), (–) and the LIMIT
switch that has no polarity.
13
HCD-C5
3-5. FRONT BRACKET SECTION, LOADING MOTOR ASSY (M902)
1
FPC holder
B
2
screw
(M 2 x 2.5)
4
screw
(+P 2 x 3.0)
1
wire clamper
3
Move down the gear mount
bracket in the direction of the
arrow
B
.
6
screw
(+P 2 x 3)
7
screw
(M 2 x 4)
A
8
Remove it in the direction of
the arrow
A
from the left side
when viewed from the rear of
the front bracket.
5
Remove the two
hang-up springs (FZ).
3
three claws
2
loading belt
4
Raise the
CONNECTOR board.
Note during re-assembling
When re-assembling, align the positions as shown.
1
front backet section
2
Remove two solderings.
3
loading motor assy (M902)
14
HCD-C5
3-6. SW BOARD
1
eleven claws
3
2
Release it from
the detents.
1
Remove two solderings.
5
Remove two solderings.
9
Remove five solderings.
3
Remove two solderings.
7
Remove two solderings.
2
switch (S3)
(Disc Existence, Chucking, Releasing detect)
q;
SW board
(BRN)
(RED)
4
switch (S2)
(12cm Disc/12cm
Disc Eject End detect)
6
switch (S1)
(Disc IN/8cm Disc detect)
8
switch (S4)
(8cm Disc Eject End detect)
(ORG)
(YEL)
(GRN)
15
HCD-C5
3-8. REAR DAMPER BRACKET
3-7. FEED MOTOR ASSY (M903)
2
Remove the
soldering.
4
pulley gear
3
1
two screws
(+P 2 x 10)
5
screw
(+P 2 x 3.0)
6
FD gear bracke
t
7
feed motor assy
(M903)
2
screw
(+P 2 x 2.5)
4
screw
(+P 2 x 3)
3
two screws
(+P 2 x 3)
1
wire clamper
5
rear damper bracket
16
HCD-C5
3-9. OPTICAL PICK-UP (OPTIMA-720L1E), SCREW GUIDE, FEED SCREW ASSY, etc.
3-10. OPTICAL PICK-UP (OPTIMA-720L1E)
2
two screws
(+P 2 x 10)
4
screw
(+P 2 x 10)
3
feed motor assy (M903),
FD gear bracket, etc.
A
5
Slant the CONNECTOR board
in the direction of the arrow
A
.
1
pick-up flexible board
6
optical pick-up (OPTIMA-720L1E),
screw guide,
feed screw assy, etc.
2
screw
(+P 1.7 x 6)
6
screw
(+P 1.4 x 2)
7
pulley guide spring
3
detent spring
4
pulley M
8
optical pick-up
(OPTIMA-720L1E)
5
feed screw assy
1
screw guide
17
HCD-C5
3-11. BASE SECTION
5
two screws
(+P2 x 5)
4
Remove solderings from
the damper pins.
2
Remove the two damper
pins toward inside.
3
Slant the base block in the
direction of the arrow
B
and remove the base
block from the main unit in
a manner that the lock pin
passes through the groove
of the holder (L) as shown.
2
base section
(
2
Remove the base block while the
mechanism is in the Loading IN state.)
lock pin
holder (L)
1
pick-up flexible
board
2
Remove the two hang-up
springs (FZ) as shown.
1
Move the holder (L) in the
direction of the arrow
A
.
A
B
3
Remove the two hang-up
springs (R) as shown.
1
Remove solderings.
18
HCD-C5
3-13. JACK BOARD, HP BOARD, REAR COVER
3-12. SPINDLE MOTOR ASSY (M904)
4
two screws
(+P 1.7 x 2.2)
5
turn table
1
clip arm spring (L)
2
clip arm spring
3
open to direction of the arrow
A
A
6
washer
7
spindle motor
8
spindle motor assy
(M904)
3
three screws
(+BV 3 x 8)
2
four screws
(+BV 3 x 12)
1
screw
(+BVTT 3 x 5)
8
two screw
s
(+B 4 x 16)
q;
rear cover
3
JACK board
1
two screws
(+BV 3 x 8)
9
two nuts
(N4)
5
connector
(CN109)
6
connector
(CN110)
2
connector
(CN107)
4
screw
(+PTPWH 3 x 8)
7
HP board
D.C.fa
n
(M901)
Note for re-installation-1
When installing the rear cover,
be careful that the three harnesses
coming from
“
2
Connector (CN107)”,
“
5
Connector (CN109)”,
“
6
Connector (CN110)”,
and the harness coming from the
DC fan (M901) must not contact the
heat sink (IC902) and the diode
(D981) and the heat sink (IC904).
heat sink (IC902)
POWER board
diode (D981)
Note for re-installation-2
When installing the rear cover, be careful that the three
harnesses coming from
“
2
Connector (CN107)”,
“
5
Connector (CN109)”,
“
6
Connector (CN110)”,
and the harness coming from the D.C. fan (M901) must not
be pinched by the rear cover, the UCOM board, power
transformer (T900) and tuner pack.
19
HCD-C5
3-14. TUNER PACK, D. C. FAN (M901)
1
screw
(+BV 3 x 8)
3
tuner pack
(After slanted toward outside,
remove it straight up toward outside.)
2
wire (flat type)
(11 core or 15 core)
wire (flat type)
(11 core or 15 core)
tuner pack
4
connector
(CN105)
AUDIO board
CN106
5
D.C. fa
n
(M901)
D.C.fan (M901)
Note for re-installation
When installing the tuner pack, insert the three harnesses
connected to CN105 and connected to CN106 and
connected to CN108 of the AUDIO board, in between the
flat cable (11 core or 15 core) and the tuner pack in the
direction of the arrow so that the flat cable
(11 core or 15 core) must be inserted.
CN108
CN105
3-15. UCOM BOARD, AMP POWER BOARD
4
two screws
(+BVTT 3 x 5)
9
UCOM board
CN205
CN206
CN901
CN852
8
AMP POWER baord
1
wire (flat type)
(19 core) (CN101)
2
wire (flat type)
(19 core) (CN203)
7
board to board
connector
6
wire (flat type)
(16 core) (CN201)
5
board to board
connector
3
connector
(CN851)
A
A
Note for re-installation
(routing the harnesses)
Be careful that the two harnesses between
CN995 and CN992 of the power transformer
(T900) and the POWER board must not
contact the heat sink (IC902) on the POWER
board and the flat cable (19 core) that
is inserted to CN203 on the UCOM board.
wire (flat type)
(19 core)
CN203
CN851
CN995
CN992 power transformer (T900)
POWER baord
AMP POWER
board
UCOM board
heat sink (IC902)
20
HCD-C5
3-16. AUDIO BOARD, POWER BOARD, POWER TRANSFORMER (T900) (1)
1
two screws
(+BVTT 3 x 5)
3
four screws
(+BVTT 3 x 5)
2
screw
(+BV 3 x 8)
5
connector
(CN102)
4
two screws
(+BVTT 3 x 5)
6
AUDIO board, POWER boad,
power transformer (T900 ), etc.
CN103
8
tuner pack
CN902
7
wire (flat type) (11 core)
(from tuner pack)
qf
board to board
connector
qh
AUDIO board
9
connector (CN105)
qg
POWER board
4
power transforme
r
(T900)
5
connector (CN991)
2
connector (CN992)
qs
insulated plates (POWER)
qd
insulated plates (POWER) 2
qa
nylon rivet (DIA 3.5)
1
connector (CN995)
3
clamp
6
power cord
q;
D.C.fan (M901)
3-17. AUDIO BOARD, POWER BOARD, POWER TRANSFORMER (T900) (2)
21
HCD-C5
3-18. MD MECHANISM DECK (MDM-7B4M), MD DIGITAL BOARD
7
two screws
(+BVTT 3 x 5)
8
MD DIGITAL board
4
shield (MD2)
qf
MD mechanism deck
(MDM-7B4M)
1
four screws
(+BVTT 3 x 5)
9
shield (MD1)
2
two screws
(+BVTT 3 x 5)
5
wire (flat type)
(17 core) (CN703)
qa
four insulators
6
wire (flat type)
(27 core) (CN702)
q;
four screws, step
qs
screw
(+BTN 1.7 x 3)
qd
ground wire
3
ground
wire
Slant the shield (MD1), shield (MD2) and
the MD DIGITAL board in the direction of
the arrow and remove the two
2
screws (+BVTT 3 x 5).
3-19. HOLDER ASSY
1
tension spring (holder)
3
holder assy
2
hoo
k
22
HCD-C5
3-21. LOADING MOTOR (M703), SPINDLE MOTOR (M701), SLED MOTOR (M702)
3-20. BD (MD) BOARD
M702
M701
M703
S102
1
Remove two solderings.
(sled)
2
Remove two solderings.
(spindle)
3
Remove two
solderings.
(loading)
4
Remove three solderings.
5
two screws
(+BP TRI 2 x 6 CZN)
8
BD (MD) board
7
connector (CN104)
6
flexible board
(CN101)
7
spindle motor (M701)
5
loading motor (M703)
9
sled motor (M702
)
1
lever (head)
3
torsion spring (spindle)
2
belt (loading)
4
two screws
(+PWH 1.7 x 3.5)
6
three tapping screws (M1.7)
8
two screws
(+PWH 1.7 x 3.5
)
23
HCD-C5
3-22. OVER WRITE HEAD
1
screw (+P 1.7 x 6)
2
over write hrad
(HR901)
3
screw
(+BP TRI 2 x 6 CZN
)
5
screw (+KTP 2 x 6)
1
screw
(+BP TRI 2 x 6 CZN)
8
main shaft
6
7
2
base (BU-D)
4
base (BU-A)
9
flexible board
q;
optical pick-up (for MD)
3-23. OP-SUB SECTION
24
HCD-C5
[Factory Preset Mode]
∗This mode clears all data including preset data stored in the
RAM to initial conditions. Excute this mode when returning
the set to the customer.
Procedure:
1. Press the ?/1 button to turn the power on.
2. Press the FUNCTION z button to set the CD function.
(except the TUNER function)
3. Press three buttons VOL + , CD Z and MD Z
simultaneously.
4. The message “COLD RESET” blinks and the present contents
are reset to the default values.
[Version and Destination Display Mode]
∗The version or destination is displayed.
Procedure:
1. Press the ?/1 button to turn the power on.
2. To enter the test mode, press the three buttons VOL + , x
and MD Z simultaneously.
3. The model and destination are displayed.
4. Press the REC/REC IT/NORMAL and u buttons simul-
taneously.
5. The version is displayed as “STR/CD V . ”.
6. Press the REC/REC IT/NORMAL and u buttons simul-
taneously.
7. The version is displayed as “MD V . ”.
8. Press the REC/REC IT/NORMAL and u buttons simul-
taneously, then the mode returns to step 3.
9. To exit from this mode, press the ?/1 button to turn the
power off.
[FL Tube Test Mode]
∗All fluorecent segments and LEDs are tested.
Procedure:
1. Press the ?/1 button to turn the power on.
2. To enter the test mode, press three buttons VOL + , x and
./m TUNING - simultaneously.
3. All segments and LEDs are turned on.
4. Press the REC/REC IT/NORMAL and u buttons simul-
taneously.
5. All segments are turned off (All LEDs still lit).
6. Press the REC/REC IT/NORMAL and u buttons simul-
taneously.
7. Almost half segments are turned on. (PATTERN 1)
8. Press the REC/REC IT/NORMAL and u buttons simul-
taneously.
9. The segments which are turned on in step 7 are turned off,
then remaining segments are turned on. (PATTERN 2)
10. Press the REC/REC IT/NORMAL and u buttons simul-
taneously, the mode returms to step 3 and all segments are
turned on.
11. To exit from this mode, press the ?/1 button to turn the
power off.
[Key Test Mode]
∗Keyboard check.
Procedure:
1. Press the ?/1 button to turn the power on.
2. To enter the test mode, press three buttons VOL + , x and
>/M TUNING + simultaneously.
3. In the key test mode, the fluorecent indicator displays
“KEY00”.
4. Each time a button is pressed, “KEY ” value increases.
However, once a button is pressed, it is no longer taken into
account.
5. To exit from this mode, press three buttons simultaneously as
step 2 , or disconnect the power cord.
[Amp Test Mode]
Procedure:
1. Press the ?/1 button to turn the power on.
2. Press three buttons VOL - , CD Z and MD Z simulta-
neously.
3. Press two buttons REC/REC IT/NORMAL and x simulta-
neously.
4. The message “7 [TESTMIN]” is displayed for a few seconds.
5. Press two buttons REC/REC IT/NORMAL and x simulta-
neously again.
6. Each time two buttons are depressed, the display changes as
“8 [TESTMID]” , “9 [TESTMAX]”, and “10 [TESTSUR]” .
7. Press the VOL + button, the display changes “VOLUME 21”
to “VOLUME MAX”.
8. Press the VOL - button, the display changes “VOLUME 21”
to “VOLUME MIN”.
9. To exit from this mode, press the ?/1 button to turn the
power off and cold reset is executed.
[CD Test Mode]
∗The CD system versions are displayed.
Procedure:
1. Press the ?/1 button to turn the power on.
2. Press the FUNCTION z button to set the CD function.
3. Press three buttons of VOL + , x and CD SYNC HIGH
simultaneusly.
4. The message “dut CD VER” is displayed.
5. Press the CD Z button and the version “CD . ” is dis-
played.
6. Press the >/M TUNING + button and “CDSYS ”
is displayed.
7. Each time the >/M TUNING + button is depressed ,
the display changes as “CDMA S”, “CDBD O”, “CDCD M”.
8. By depressing the ./m TUNING - button the versions
are displayed in reverse.
9. To exit this mode, press the ?/1 button to turn the power off.
SECTION 4
TEST MODE
25
HCD-C5
[CD Aging Mode]
Procedure:
1. Press the ?/1 button to turn the power on.
2. Press the FUNCTION z button to set the CD function, and
insert a disc.
3. Press three buttons of VOL - , CD Z and
>/M TUNING + simultaneusly.
4. The message “Eject” is displayed, a disc is ejected and in-
serted again automatically.
5. The sequence during the CD aging mode is following as be-
low.
CD aging mode sequence:
6. To exit this mode , press the ?/1 button to turn the power
off.
[CD/MD Aging Mode]
∗Aging of CD and MD is performed at the same time.
Procedure:
1. Press the ?/1 button to turn the power on.
2. Press the FUNCTION z button to set the CD function.
3. Insert a disc (CD) and a recordable disc (MD).
4. Press three buttons of VOL + , u and MD Z
simultaneusly.
5. The message “Eject” is displayed and aging started.
6. The sequence of CD aging is same as the CD aging mode,
however the MD aging is repetition of changing the track after
a few seconds recording.
7. The number of aging is displayed in hexadecimal. For example,
AGING00000011 means the 17th rouine of aging.
8. To exit this mode, press the ?/1 button to turn the power off,
or press three buttons of VOL + , CD Z and MD Z simul-
taneously and cold reset is executed.
CD disc eject
CD disc in
TOC reading
Playback the first track
Playback the last track
Display the number of aging
MD SECITON
Note 1: About “R”
As this unit has only a few buttons, some operations require
the use of remote commander (RM-SC5BEN/provided with
unit: 1-476-649-21) buttons. These operations are indicated
as “R” in this manual.
Example: MENU/NO “R” ...Press the MENU/NO button of
the remote commander.
Note 2: Incorrect operations may be performed if the MD test mode
is not entered properly.
In this case, press the ?/1 button to turn the power off, and
retry to enter the MD test mode.
1. PRECAUTIONS FOR USE OF TEST MODE
•As operations related to loading will be performed regardless of
the test mode operations being performed, be sure to check that
the disc is stopped before setting and removing it.
Even if the MD Z button is pressed while the disc is rotating
during continuous playback, continuous recording, etc., the disc
will not stop rotating.
Therefore, it will be ejected while rotating.
Be sure to press the MD Z button after pressing the
MENU/NO “R” button and the rotation of disc is stopped.
1-1. Recording laser emission mode and operating
buttons
•Continuous recording mode (CREC 1MODE)
•Laser power check mode (LDPWR CHECK)
•Laser power adjustment mode (LDPWR ADJUST)
•Comparison with initial Iop value written in nonvolatile memory
(Iop Compare)
•Write current Iop value in read nonvolatile memory using mi-
croprocessor (Iop NV Save)
•Traverse (MO) check (EF MO CHECK)
•Traverse (MO) adjustment (EF MO ADJUST)
•When pressing the REC/REC IT button.
2. SETTING THE TEST MODE
The following is the method of entering the test mode.
Procedure: 1. Press the ?/1 button to turn the power on.
2. Press the FUNCTION z button to set the MD
function.
3. Press three buttons of VOL - , x , and
CD SYNC HIGH (MD) simulta neously.
When the test mode is set, “[Check]” will be
displayed. Pressing the
. “R” or > “R” button between the
following three groups; ··· Tt [Check] Tt
[Service] Tt [Develop] Tt ···.
Note: Do not use the test mode in the [Develop] group.
If used, the unit may not operate normally.
If the [Develop] group is set accidentally, press the
MENU/NO “R” button immediately to exit the [Develop] group.
3. RELEASING THE TEST MODE
Procedure 1: Press the REPEAT “R” button to display “Initial-
ize”, then release the MD test mode.
Procedure 2: Press two button of VOL - and MD Z to display
“Intialize”, then release the MD test mode.
26
HCD-C5
4. BASIC OPERATIONS OF THE TEST MODE
All operations are performed using the . “R” , > “R” , ENTER/YES “R” and MENU/NO “R” .
The functions of these buttons are as follows.
5. SELECTING THE TEST MODE
There are 26 types of test modes as shown below. The groups can be switched by pressing the . “R” or > “R” button.
After selecting the group to be used, press the ENTER/YES “R” button. After setting a certain group, pressing the . “R” or
> “R” button switches modes shown below.
Refer to “Group” in the table for details can be selected.
All items used for servicing can be treated using group [Service]. So be carefully not to enter other groups by mistake.
Note: Do not use the test mode in the [Develop] group.
If used, the unit may not operate normally.
If the [Develop] group is set accidentally, press the MENU/NO “R” button immediately to exit the [Develop] group.
•For details of each adjustment mode, refer to “5. Electrical Adjustments”.
For details of “Err Display”, refer to “Self-Diagnosis Function” on page 2.
•If a different mode has been selected by mistake, press the MENU/NO “R” button to release that mode.
•Modes with (×) in the Mark column are not used for servicing and therefore are not described in detail. If these modes are set
accidentally, press the MENU/NO “R” button to release the mode immediately.
Display
AUTO CHECK
Err Display
TEMP ADJUST
LDPWR ADJUST
Iop Write
Iop NV Save
EF MO ADJUST
EF CD ADJUST
FBIAS ADJUST
AG Set (MO)
AG Set (CD)
TEMP CHECK
LDPWR CHECK
EF MO CHECK
EF CD CHECK
FBIAS CHECK
ScurveCHECK
VERIFYMODE
DETRK CHECK
0920 CHECK
Iop Read
Iop Compare
ADJ CLEAR
INFORMATION
CPLAY1MODE
CREC 1MODE
Details
Automatic self-diagnosis
Error history display, clear
Temperature compensation offset adjustment
Laser power adjustment
Iop data writing
Writes current Iop value in read nonvolatile memory using microprocessor
Traverse (MO) adjustment
Traverse (CD) adjustment
Focus bias adjustment
Auto gain output level adjustment (MO)
Auto gain output level adjustment (CD)
Temperature compensation offset check
Laser power check
Traverse (MO) check
Traverse (CD) check
Focus bias check
S-curve check
Nonvolatile memory check
Detrack check
Most circumference check
Iop data display
Comparison with initial Iop value written in nonvolatile memory
Initialization of nonvolatile memory for adjustment values
Display of microprocessor version, etc.
Continuous playback mode
Continuous recording mode
No.
C01
C02
C03
C04
C05
C06
C07
C08
C09
C10
C11
C12
C13
C14
C15
C16
C17
C18
C19
C25
C26
C27
C28
C31
C34
C35
Mark Group
Check Service
Function name Function
. “R” ,> “R” buttons Changes parameters and modes
ENTER/YES “R” button Proceeds onto the next step. Finalizes input
MENU/NO “R” button Returns to previous step. Stops operations
27
HCD-C5
5-1. Operating the Continuous Playback Mode
1. Entering the continuous playback mode
(1) Set the disc in the unit. (Whichever recordable discs or discs
for playback only are available)
(2) Press the . “R” or > “R” button to display
“CPLAY1MODE” (C34).
(3) Press the ENTER/YES “R”button to change the display
to “CPLAY1MID”.
(4) When access completes, the display changes to “C =
AD = )”.
Note: The numbers “ ” displayed show you error rates and ADER.
2. Changing the parts to be played back
(1) Press the ENTER/YES “R”button during continuous play-
back to change the display as below.
When pressed another time, the parts to be played back can
be moved.
(2) When access completes, the display changes to “C =
AD = )”.
Note: The numbers “ ” displayed show you error rates and ADER.
3. Ending the continuous playback mode
(1) Press the MENU/NO “R” button. The display will change
to “CPLAY1MODE” (C34).
(2) Press the MD Z button and take out the disc.
Note: The playback start addresses for IN, MID, and OUT
are as follows.
IN : 40h cluster
MID : 300h cluster
OUT : 700h cluster
“CPLAY1MID” t “CPLAY1OUT” t “CPLAY1IN”
5-2. Operating the Continuous Recording Mode (Use
only when performing self-recording/palyback
check)
1. Entering the continuous recording mode
(1) Set a recordable disc in the unit.
(2) Press the . “R” or > “R” button to display “CREC
1MODE” (C35).
(3) Press the ENTER/YES “R” button to change the display to
“CREC 1MID”.
(4) When access completes, the display changes to “CREC 1(
)” and “ REC ” is displayed.
Note: The numbers “ ” displayed shows you the recording posi-
tion addresses.
2. Changing the parts to be recorded
(1) When the ENTER/YES “R”button is pressed during con-
tinuous recording, the display changes as below.
When pressed another time, the parts to be recorded can be
changed. “ REC ” goes off.
(2) When access completes, the display changes to “CREC 1(
)” and “ REC ” is displayed.
Note: The numbers “ ” displayed shows you the recording posi-
tion addresses.
3. Ending the continuous recording mode
(1) Press the MENU/NO “R” button. The display changes to
“CREC 1MODE” (C35) and “ REC ” goes off.
(2) Press the MD Z button and take out the disc.
Note 1: The recording start addresses for IN, MID, and OUT are
as follows.
IN : 40h cluster
MID : 300h cluster
OUT : 700h cluster
Note 2: The MENU/NO “R”button can be used to stop recording
anytime.
Note 3: Do not perform continuous recording for long periods of
time above 5 minutes.
Note 4: During continuous recording, be careful not to apply vi-
bration.
“CREC 1MID” t “CREC 1OUT” t “CREC 1IN”
REC
REC
REC
REC
28
HCD-C5
Function
u
x
M “R”
m “R”
x + >/M TUNING +
VOL - + CD Z
MD Z
REPEAT “R”
Contents
Sets continuous playback when this is pressed in the STOP state. When this is pressed during continu-
ous playback, playback position moves.
Stops continuous playback and continuous recording
The sled moves to the outer circumference only when this is pressed
The sled moves to the inner circumference only when this is pressed
Switches the spindle servo mode (CLV S y CLV A)
Switches the displayed contents each time the button is pressed
Ejects the disc
Releases the test mode
7. AUTOMATIC SELF-DIAGNOSIS FUNCTION
This test mode performs CREC and CPLAY automatically for mainly checking the characteristics of the optical pick-up.
To perform this test mode, the laser power must first be checked.
Perform AUTO CHECK after the laser power check and Iop Compare.
Procedure:
1. Press the . “R”or > “R”button to display “AUTO CHECK” (C01).
2. Press the ENTER/YES “R”button. If “LDPWR ” is displayed, it means that the laser power check has not been
performed. In this case, perform the laser power check and Iop Compare, and then repeat from enter the MD test mode.
3. If a disc is in the mechanical deck, it will be ejected forcibly.
“DISC IN” will be displayed in this case. Load a test disc (MDW-74/GA-1) which can be recorded.
4. If a disc is loaded at step 3, the check will start automatically.
5. When “XX CHECK” is displayed, the item corresponding to XX will be performed.
When “060 CHECK” completes, the disc loaded at step 3 will be ejected. “DISC IN” will be displayed. Load the check disc
(TDYS-1).
6. When the disc is loaded in step 5, the check will automatically be resumed from “07 CHECK”.
7. After completing to test item 12 (“oC CHECK”), check OK or NG will be displayed. If all items are OK, “CHK ALL OK” will
be displayed. If any item is NG, it will be displayed as “NG:xxxx”.
When “CHK ALL OK” is displayed, it means that the optical pick-up is normal. Check the operations of other parts (spindle
motor, sled motor, etc.).
When displayed as “NG:xxxx”, it means that the optical pick-up is faulty. In this case, replace the optical pick-up.
8. INFORMATION
Display the software version.
Procedure:
1. Press the . “R”or > “R”button to display “INFORMATION” (C31).
2. Press the ENTER/YES “R”button.
3. The software version will be displayed.
4. Press the MENU/NO “R”button to end this mode.
6. FUNCTIONS OF OTHER BUTTONS
29
HCD-C5
IOP DATA RECORDING AND DISPLAY WHEN OPTI-
CAL PICK-UP AND NON-VOLATILE MEMORY (IC195
OF BD (MD) BOARD) ARE REPLACED
The IOP value labeled on the optical pick-up can be recorded in
the non-volatile memory. By recording the value, it will eliminate
the need to look at the value on the label of the optical pick-up.
When replacing the optical pick-up or non-volatile memory (IC195
of BD (MD) board), record the IOP value on the optical pick-up
according to the following procedure.
Record Procedure:
1. Press the ?/1 button to turn the power on.
2. Press the FUNCTION z button to set the MD function.
3. Press three buttons of VOL - , x and CD SYNC HIGH ,
simultaneously to enter the MD test mode and display
“[Check]”.
4. Press the . “R” or > “R” button to display
“[Service]”.
5. Press the ENTER/YES “R” button to display “AUTO
CHECK”, and press the > “R” button to display “Iop
Write”.
6. Press the ENTER/YES “R” button.
7. The display becomes “Ref= @@@.@” (@ is an arbitrary num-
ber) and the numbers which can be changed will blink.
8. Input the IOP value written on the optical pick-up.
To select the number : Press the
. “R”or > “R”button.
To select the digit : Press two buttons of VOL - and
CD Z simultaneously.
9. When the ENTER/YES “R”button is pressed, the display
becomes “Measu=@@@.@” (@ is an arbitrary number).
10. As the adjustment results are recorded for the step 9 value.
Leave it as it is and press the ENTER/YES “R” button.
11. “Complete!” will be displayed momentarily. The value will
be recorded in the non-volatile memory and the display will
become “Iop Write”.
12. Press the REPEAT “R” button, or press two buttons of
VOL - and MD Z simultaneously. to complete. “Initialize”
will be displayed and release the MD test mode.
Display Precedure:
1. Press the ?/1 button to turn the power on.
2. Press the FUNCTION z button to set the MD function.
3. Press three buttons of VOL - , x , and CD SYNC HIGH
simultaneously to enter the MD test mode and display
“[Check]”.
4. Press the . “R” or > “R” button to display “[Ser-
vice]”.
5. Press the ENTER/YES “R” button to display “AUTO
CHECK”, and press the > “R” button to display “Iop Read”.
6. Press the ENTER/YES “R” button.
7. “@@.@/##.#” is displayed and the recorded contents are dis-
played.
@@.@ : Indicates the Iop value labeled on the pick-up.
##.# : Indicates the Iop value after adjustment.
8. Press the REPEAT “R” button to complete. “Initialize” will
be displayed and release the MD test mode.
WHEN MEMORY NG IS DISPLAYED
If the nonvolatile memory data is abnormal, “E001 MEMORY NG”
will be displayed so that the MD deck does not continue opera-
tions. In this case, set the test mode promptly and perform the
following procedure.
Procedure:
1. Enter the MD test mode.
2. Normally a message for selecting the test mode will be displayed.
However if the nonvolatile memory is abnormal, the following
will be displayed “INIT EEP?”.
3. Press the x and MD Z buttons simultaneously.
4. Press the . “R” or > “R” button to display “MDM-7B4M”.
5. Press the ENTER/YES “R”button. If the nonvolatile memory is
successfully overwritten, the normal MD test mode will be set
and a message to select the MD test mode will be displayed.
30
HCD-C5
CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTS IN MD
Before performing repairs, perform the following checks to determine the faulty locations up to a certain extent.
Details of the procedures are described in “5 Electrical Adjustments”.
•0.9 mW power
Specified value : figure1
•7.0 mW power
Specified value : figure2
Iop (at 7.0mW)
•Labeled on the optical pick-up
Iop value ± 10mA
•Unsatisfactory if displayed as “NG: XXXX”
(X is an arbitrary number)
•Unsatisfactory if displayed as “T=@@ (##) [NG]”
(@@, ## are both arbitrary numbers)
Laser power check
(6-2 : See page 37)
Auto check
(6-4 : See page 38)
Temperature
compensation
offset check
(6-1 : See page 37)
Criteria for Determination
(Unsatisfactory if specified value is not satisfied)
•Clean the optical pick-up
•Adjust again
•Replace the optical pick-up
•Replace the optical pick-up
•Replace the optical pick-up
•Check for disconnection of the circuits around D101
(BD (MD) board)
•Check the signals around IC101, IC151, CN102, CN103
(BD (MD) board)
Measure if unsatisfactory
Note:
The criteria for determination above is intended merely to determine if satisfactory or not, and does not serve as the specified value for adjust-
ments.
When performing adjustments, use the specified values for adjustments.
Figure1:
Figure2:
RETRY CAUSE DISPLAY MODE IN MD
•In this test mode, the causes for retry of the unit during recording can be displayed on the fluorescent indicator tube. During
playback, the “track mode” for obtaining track information will be set.
This is useful for locating the faulty part of the unit.
•The following will be displayed :
During recording and stop : Retry cause, number of retries, and number of retry errors.
During playback : Information such as type of disc played, part played, copyright.
These are displayed in hexadecimal.
Precedure:
1. Load a recordable disc whose contents can be erased into the unit.
2. Press the MENU/NO “R” button. When “Edit Menu” is displayed on the fluorescent indicator tube, press the
. “R”or > “R” button to display “All Erase?”.
3. Press the ENTER/YES “R” button.
4. When “All Erase??” is displayed on the fluorescent indicator tube.
5. Press the ENTER/YES “R” button to display “Complete!”.
6. Press the REC/REC IT button to start recording. Then press the u button and start recording. If recording cannot be performed,
press the FUNCTION z button and set a different function.
7. Press three buttons of VOL - , u and CD SYNC HIGH simultaneously to enter the retry cause display mode.
8. To check the “track mode”, press the u button to start playback.
9. To release this mode, press the ?/1 button to turn the power off. When “TOC” goes off, disconnect the power plug from the
outlet.
If the test mode cannot be released, refer to “Factory Preset” on page 24.
SPECIFIED VALUE KMS-260B
KMS-260E 6.8 to 7.2 mW
7.0 to 7.5 mW
SPECIFIED VALUE KMS-260B
KMS-260E 0.85 to 0.91 mW
0.90 to 0.96 mW
31
HCD-C5
Reading the Retry Cause Display
Reading the Display:
Convert the hexadecimal display into binary display. If more than two causes, they will be added.
Example
When 42 is displayed:
Higher bit: 4 = 0100 t b6
Lower bit : 2 = 0010 t b1
In this case, the retry cause is combined of “CLV unlock” and “ader5”.
When A2 is displayed:
Higher bit: A = 1010 t b7 + b5
Lower bit : 2 = 0010 t b1
The retry cause in this case is combined of “Access fault”, “IVR rec error”, and “ader5”.
Hexadecimal
01
02
04
08
10
20
40
80
Hexadecimal
Bit
Binary
Occurring conditions
When track jump (shock) is detected
When ADER was counted more than five times
continuously
When ADIP address is not continuous
When DIN unlock is detected
When not in focus
When ABCD signal level exceeds the specified range
When CLV is unlocked
When access operation is not performed normally
Cause of Retry
shock
ader5
Discontinuous address
DIN unlock
FCS incorrect
IVR rec erraor
CLV unlock
Access fault
Higher Bits
84218421
b7 b6 b5 b4 b3 b2 b1 b0
00000001
00000010
00000100
00001000
00010000
00100000
01000000
10000000
Lower Bits
Fig. 1 Reading the Test Mode Display
(During recording and stop)
RTs@@c##e**
fluorescent indicator tube
@@ : Cause of retry
## : Number of retries
** : Number of retry errors
Fig. 2 Reading the Test Mode Display
(During playback)
@@ ###** $$
fluorescent indicator tube
@@ : Parts No. (name of area named on TOC)
## : Cluster
** : Sector
$$ : Track mode (Track information such as
copyright information of each part)
32
HCD-C5
Reading the Display:
Convert the hexadecimal display into binary display. If more than two causes, they will be added.
Example When 84 is displayed:
Higher bit: 8 = 1000 t b7
Lower bit : 4 = 0100 t b2
In this case, as b2 and b7 are 1 and others are 0, it can be determined that the retry cause is combined of “Emphasis OFF”, “Monaural”,
“Original”, “Copyright”, and “Write allowed”.
Example When 07 is displayed:
Higher bit: 0 = 0000 t All 0
Lower bit : 7 = 0111 t b0 + b1 + b2
In this case, as b0, b1, and b2 are 1 and others are 0, it can be determined that the retry cause is combined of “Emphasis ON”, “Stereo”,
“Original”, “Copyright”, and “Write prohibited”.
Hexadecimal
t
Binary Conversion Table
Hexadecimal Binary Hexadecimal Binary
0 0000 8 1000
1 0001 9 1001
2 0010 A 1010
3 0011 B 1011
4 0100 C 1100
5 0101 D 1101
6 0110 E 1110
7 0111 F 1111
Hexadecimal
01
02
04
08
10
20
40
80
Hexadecimal
Bit
Binary
When 0
Emphasis OFF
Monaural
This is 2-bit display. Normally 01.
01:Normal audio. Others:Invalid
Audio (Normal)
Original
Copyright
Write prohibited
Higher Bit
84218421
b7 b6 b5 b4 b3 b2 b1 b0
00000001
00000010
00000100
00001000
00010000
00100000
01000000
10000000
Lower Bits
When 1
Emphasis ON
Stereo
Invalid
Digital copy
No copyright
Write allowed
Details
Reading the Retry Cause Display
33
HCD-C5
SECTION 5
ELECTRICAL ADJUSTMENTS
CD SECTION
Note 1:
1. CD Block is basically designed to operate without adjustment. There-
fore, check each item in order given.
2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated.
3. Use an oscilloscope with more than 10MΩ impedance.
4. Clean the object lens by an applicator with neutral detergent when the
signal level is low than specified value with the following checks.
Note 2:
As the laser diode in the optical pick-up (OPTIMA-720L1E) is easily
damaged by static electricity, solder the laser tap of the flexible
board when handling it. Before disconnecting the connector, solder
first. Before connecting the connector, be careful not to remove the
solder. Also take adequate measures to prevent damage by static
electricity. Handle the flexible board with care as it breaks easily.
RF Level Check
Connection:
Procedure:
1. Connect an oscilloscope to test point TP (RFAC) and TP (DVC
1.65V) on the BD (CD) board.
2. Turn the power on.
3. Put the disc (YEDS-18) in to playback the number five track.
4. Confirm that oscilloscope waveform is clear and check RF sig-
nal level is correct or not.
Note: A clear RF signal waveform means that the shape “◊” can be clearly
distinguished at the center of the waveform.
RF signal waveform
Checking Location: BD (CD) board
+
–
BD (CD) board
TP (RFAC)
TP (DVC 1.65V)
oscilloscope
(AC range)
VOLT/DIV: 200 m
V
TIME/DIV: 500 ns
level: 1.1
±
0.3 Vp-p
pick-up
frexible board
laser tap
Checking Location:
– BD (CD) BOARD –
TP
(RFAC)
TP
(DVC 1.65V)
IC103
IC101
34
HCD-C5
Other faults are suspected.
Check the mechanism parts (spindle motor, sled motor, etc.).
Start
NG
NG
NG
OK
OK
OK
Laser Power Check
6-2.
(See page 37)
6-3.
(See page 37)
6-4.
(See page 38)
Iop Compare
Auto Check Replace optical pick-up or MDM-7B4B
MD SECTION
Note 1:About “R”
As this unit has only a few buttons, some operations require the use of remote commander (RM-SC5BEN/provided with unit: 1-476-649-11)
buttons. These operations are indicated as “R” in this manual.
Example: MENU/NO “R” ...Press the MENU/NO button of the remote commander.
Note 2:Incorrect operations may be performed if the MD test mode is not entered properly.
In this case, press the ?/1 button to turn the power off, and retry to enter the MD test mode.
1. PARTS REPLACEMENT AND ADJUSTMENT
If malfunctions caused by optical pick-up such as sound skipping are suspected, follow the following check.
Check before replacement
35
HCD-C5
6-4. Auto Check
(See page 38)
YES
NO
NO
NO
NO
NO
NO
NO
YES
YES
YES
YES
YES
YES
Replace IC195
Replace OP or IC195
Replace IC101, IC195, or D101
11. Iop NV SAVE (See page 41)
Replace OP, IC190, or IC195
Replace OP, IC102, IC190,
or IC195
Replace OP, IC101, IC151,
or IC195
Replace OP
After turning off and then on the power,
initialize the EEPROM
For details, refer to “WHEN MEMORY NG IS DIS-
PLAYED” in Section 4. TEST MODE (See page 29)
•Abbreviation
OP: optical pick-up
7.INITIAL SETTING OF ADJUSTMENT VALUE
(See page 40)
9.TEMPERATURE COMPENSATION OFFSET
ADJUSTMENT (See page 40)
10. LASER POWER ADJUSTMENT (See page 40)
12.TRAVERSE ADJUSTMENT (See page 41)
13.FOCUS BIAS ADJUSTMENT (See page 43)
16.AUTO GAIN CONTROL OUTPUT LEVEL
ADJUSTMENT (See page 44)
8.RECORDING AND DISPLAYING THE IOP
INFORMATION (See page 40)
End adjustments
Start
Adjustment flow
36
HCD-C5
2. PRECAUTIONS FOR CHECKING LASER DIODE
EMISSION
To check the emission of the laser diode during adjustments, never
view directly from the top as this may lose your eye-sight.
3.
PRECAUTIONS FOR USE OF OPTICAL PICK-UP
(KMS-260B/260E)
As the laser diode in the optical pick-up is easily damaged by static
electricity, solder the laser tap of the flexible board when handling
it.
Before disconnecting the connector, solder first. Before connecting
the connector, be careful not to remove the solder. Also take adequate
measures to prevent damage by static electricity. Handle the flexible
board with care as it breaks easily.
Optical pick-up flexible board
pick-up flexible boar
d
laser tap
4. PRECAUTIONS FOR ADJUSTMENTS
1. When replacing the following parts, perform the adjustments
and checks with in the order shown in the following table.
2. Set the MD test mode when performing adjustments.
After completing the adjustments, exit the MD test mode.
Perform the adjustments and checks in “Group Service” of the
MD test mode.
3. Perform the adjustments to be needed in the order shown.
4. Use the following tools and measuring devices.
•Check Disc (TDYS-1) (Part No. : 4-963-646-01)
•Test Disk (MDW-74/GA-1) (Part No. : 4-229-747-01)
•Laser power meter LPM-8001 (Part No. : J-2501-046-A)
or MD Laser power meter 8010S (Part No. : J-2501-145-A)*1
•Oscilloscope (Measure after performing CAL of prove.)
•Digital voltmeter
•Thermometer
•Jig for checking BD (MD) board waveform
(Part No. : J-2501-196-A)
5. When observing several signals on the oscilloscope, etc.,
make sure that VC and ground do not connect inside the
oscilloscope.
(VC and ground will become short-circuited.)
6. Using the above jig enables the waveform to be checked without
the need to solder.
(Refer to Servicing Notes on page 6.)
7. As the disc used will affect the adjustment results, make sure
that no dusts nor fingerprints are attached to it.
*1Laser power meter
When performing laser power checks and adjustment (electrical
adjustment), use of the new MD laser power meter 8010S (Part
No. J-2501-145-A) instead of the conventional laser power
meter is convenient.
It sharply reduces the time and trouble to set the laser power
meter sensor onto the objective lens of optical pick-up.
7. Initial setting of adjustment value
8. Recording of Iop information
9. Temperature compensation
offset adjustment
10. Laser power adjustment
11. Iop NV Save
12. Traverse adjustment
13. Focus bias adjustment
16. Auto gain control output level
adjustment
6-4.AUTO CHECK
Optical
Pick-up IC101 IC102 IC151 IC190 IC195 D101
Parts to be replaced
Adjustment
37
HCD-C5
5. USING THE CONTINUOUSLY RECORDED DISC
* This disc is used in focus bias adjustment and error rate check.
The following describes how to create a continuous recording
disc.
1. Insert a disc (blank disc) commercially available.
2. Press the . “R” or > “R” button and display “CREC 1MODE”
(C35).
3. Press the ENTER/YES “R” button again to display “CREC 1
MID”.
Display “CREC 1(0300)” and start to recording.
4. Complete recording within 5 minutes.
5. Press the MENU/NO “R” button and stop recording .
6. Press the MD Z button and remove the disc.
The above has been how to create a continuous recorded data for
the focus bias adjustment and error rate check.
Note: Be careful not to apply vibration during continuous recording.
6. CHECKS PRIOR TO REPAIRS
These checks are performed before replacing parts according to
“approximate specifications” to determine the faulty locations. For
details, refer to “Checks Prior to Parts Replacement and Adjustments
in MD” (see page 30).
6-1. Temperature Compensation Offset Check
When performing adjustments, set the internal temperature and room
temperature to 22 to 28ºC.
Procedure:
1. Press the . “R” or > “R” button to display “TEMP
CHECK” (C12).
2. Press the ENTER/YES “R” button.
3. “T=@@(##) [OK]” should be displayed. If “T=@@ (##) [NG]”
is displayed, it means that the results are bad.
(@@ indicates the current value set, and ## indicates the value
written in the non-volatile memory.)
6-2. Laser Power Check
Before starting adjustment;
The laser power adjustment value changes depending upon the types
of the optical pick-up (KMS-260B or KMS-260E).
Check the type of the optical pick-up before starting adjustment.
(See the illustrations “The method of identifying the optical pick-
up” on page 41)
Before checking, check the Iop value of the optical pick-up.
(Refer to 8. Recording and Displaying the Iop Information (see page
40))
Connection:
Procedure:
1. Set the laser power meter on the objective lens of the optical
pick-up. (When it cannot be set properly, press the m “R” button
or M “R” button to move the optical pick-up.)
Connect the digital volt meter to CN105 pin 1 (I+3V) and
CN105 pin 2 (IOP).
2. Then, press the . “R” or > “R” button and display
“LDPWR CHECK” (C13).
3. Press the ENTER/YES “R” button once and display “LD 0.9mW$
”. Check that the reading of the laser power meter becomes
specified value.
4. Press the ENTER/YES “R”button once more and display “ LD
7.0mW$ ”. Check that the reading the laser power meter and
digital volt meter satisfy the specified value.
Specified Value:
Laser power meter reading :
Digital voltmeter reading : Optical pick-up displayed value ± 10%
5. Press the MENU/NO “R” button and display “LDPWR
CHECK” (C13) and stop the laser emission.
(The MENU/NO “R” button is effective at all times to stop the
laser emission.)
Note: After step 4, each time the ENTER/YES “R” button is pressed, the
display will be switched to “LD 0.7W$ ”and “LD 6.2mW$ ”
“LD WP $ ”. Nothing needs to be performed here.
Checking Location: BD (MD) board (see page 44)
6-3. Iop Compare
The current Iop value at laser power 7.0 mW output and reference
Iop value (set at shipment) written in the nonvolatile memory are
compared, and the rate of increase/decrease will be displayed in
percentage.
Note: Perform this function with the optical pick-up set at room tempera-
ture.
Procedure:
1. Press the . “R” or > “R” button to display “Iop Compare”
(C27).
2. Press the ENTER/YES “R” button and start measurements.
3. When measurements complete, the display changes to “± xx%
yy”.
xx is the percentage of increase/decrease, and OK or NG is
displayed at yy to indicate whether the percentage of increase/
decrease is within the allowable range.
4. Press the MENU/NO “R” button to end.
Optical pick-up
objective lens
laser
power mete
r
+
–
BD (MD) board
digital voltmete
r
CN105 pin
1
(I+3V)
CN105 pin
2
(IOP)
KMS260B
20101
H0576
lOP = 57.6 mA in this case
lOP (mA) = Digital voltmeter reading (mV)/1 (
Ω
)
(Optical pick-up label)
For details of the method for
checking this value, refer to
“8. Recording and Displaying
the Iop Information”
SPECIFIED VALUE KMS-260B
KMS-260E
0.85 to 0.91 mW
0.90 to 0.96 mW
KMS-260B
KMS-260E
7.0 to 0.2 mW
7.25 to 0.25 mW
38
HCD-C5
6-4. Auto Check
This test mode performs CREC and CPLAY automatically for
mainly checking the characteristics of the optical pick-up. To perform
this test mode, the laser power must first be checked. Perform Auto
Check after the laser power check and Iop compare.
Procedure:
1. Press the . “R” or > “R” button to display “AUTO CHECK”
(C01).
2. Press the ENTER/YES “R” button. If “LDPWR ” is
displayed, it means that the laser power check has not been
performed. In this case, perform the laser power check and Iop
Compare, and then repeat from enter the MD test mode.
3. If a disc is in the mechanical deck, it will be ejected forcibly.
“DISC IN” will be displayed in this case. Load a test disc (MDW-
74/GA-1) which can be recorded.
4. If a disc is loaded at step 3, the check will start automatically.
5. When “XX CHECK” is displayed, the item corresponding to
XX will be performed.
When “06 CHECK” completes, the disc loaded at step 3 will be
ejected. “DISC IN” will be displayed. Load the check disc
(TDYS-1).
6. When the disc is loaded in the step 5, the check will automatically
be resumed from “07 CHECK”.
7. After completing to test item 12 (“oC CHECK”), check OK or
NG will be displayed. If all items are OK, “CHK ALL OK” will
be displayed. If any item is NG, it will be displayed as
“NG:xxxx”.
When “CHK ALL OK” is displayed, it means that the optical pick-
up is normal. Check the operations of other parts (spindle motor,
sled motor, etc.).
When displayed as “NG:xxxx”, it means that the optical pick-up is
faulty. In this case, replace the optical pick-up.
6-5. Other Checks
All the following checks are performed by the Auto Check mode.
They therefore need not be performed in normal operation.
6-6. Traverse Check
6-7. Focus Bias Check
6-8. C PLAY Check
6-9. Self-Recording/Playback Check
6-6. Traverse Check
Note 1:Data will be erased during MO reading if a recorded disc is
used in this adjustment.
Note 2:If the traverse waveform is not clear, connect the oscilloscope
as shown in the following figure so that it can be seen more
clearly.
Connection:
Procedure:
1. Connect an oscilloscope to CN105 pin 4 (TE) and CN105 pin
6 (VC) on the BD (MD) board.
2. Load a disc (any available on the market). (Refer to Note 1)
3. Press the M “R”button to move the optical pick-up outside
the pit.
4. Press the . “R”or > “R”button to display “EF MO
CHECK”(C14).
5. Press the ENTER/YES “R”button to display “EFB = MO-
R”. (Laser power READ power/Focus servo ON/tracking servo
OFF/spindle (S) servo ON)
6. Observe the waveform of the oscilloscope, and check that the
specified value is satisfied. Do not press the . “R” or
> “R”button.
(Read power traverse checking)
Traverse Waveform
7. Press the ENTER/YES “R” button to display “EFB = MO-
W”.
8. Observe the waveform of the oscilloscope, and check that the
specified value is satisfied. Do not press the . “R” or
> “R”button. (Write power traverse checking)
Traverse Waveform
+
–
oscilloscope
(DC range)
10 pF
330 k
Ω
CN105 pin
4
(TE)
CN105 pin
6
(VC)
BD (MD) board
A
B
VC
Specified value : Below 10% offset value
Offset value (%) = X 100
I
A – B
I
2 (A + B)
A
B
VC
Specified value : Below 10% offset value
Offset value (%) = X 100
I
A – B
I
2 (A + B)
+
–
oscilloscope
(DC range)
V: 0.1 V/div
H: 10 ms/div
BD (MD) board
CN105 pin
4
(TE)
CN105 pin
6
(VC)
39
HCD-C5
9. Press the ENTER/YES “R”button to display “EFB = MO-
P”.
Then, the optical pick-up moves to the pit area automatically
and servo is imposed.
10. Observe the waveform of the oscilloscope, and check that the
specified value is satisfied. Do not press the . “R” or
> “R”button.
Traverse Waveform
11. Press the ENTER/YES “R”button to display “EF MO CHECK”
(C14).
The disc stops rotating automatically.
12. Press the MD Z button and take out the disc.
13. Load the check disc (TDYS-1).
14. Press the . “R”or > “R”button and display “EF CD
CHECK” (C15).
15. Press the ENTER/YES “R”button to display “EFB = CD”.
Servo is imposed automatically.
16. Observe the waveform of the oscilloscope, and check that the
specified value is satisfied. Do not press the . “R” or
> “R”button.
Traverse Waveform
17. Press the ENTER/YES “R”button to display “EF CD
CHECK” (C15).
18. Press the MD Z button and take out the check disc (TDYS-1).
Checking Location: BD (MD) board (see page 44)
6-7. Focus Bias Check
Change the focus bias and check the focus tolerance amount.
Procedure:
1. Load the test disc (MDW-74/GA-1).
2. Press the . “R” or > “R” button to display “CPLAY
1MODE” (C34).
3. Press the ENTER/YES “R”button to display “CPLAY 1MID”.
4. Press the MENU/NO “R”button when “C = AD =
” is displayed.
5. Press the . “R” or > “R” button to display “FBIAS
CHECK” (C16).
A
B
VC
Specified value : Below 10% offset value
Offset value (%) = X 100
I
A – B
I
2 (A + B)
A
B
VC
Specified value : Below 10% offset value
Offset value (%) = X 100
I
A – B
I
2 (A + B)
6. Press the ENTER/YES “R”button to display “ / c =
”.
The first four digits indicate the C1 error rate, the two digits
after [/] indicate ADER, and the 2 digits after [c =] indicate the
focus bias value.
Check that the C1 error is below 20 and ADER is below 2.
7. Press the ENTER/YES “R” button to display “ / b =
”.
Check that the C1 error is about 100 and ADER is below 2.
8. Press the ENTER/YES “R” button to display “ / a =
”.
Check that the C1 error is about 100 and ADER is below 2.
9. Press the MENU/NO “R” button, then press the MD Z button
and take out the test disc.
6-8. C PLAY Check
MO Error Rate Check
Procedure:
1. Load the test disc (MDW-74/GA-1).
2. Press the . “R” or > “R” button to display “CPLAY
1MODE” (C34).
3. Press the ENTER/YES “R” button to display “CPLAY 1MID”.
4. The display changes to “C = AD = ”.
5. If the C1 error rate is below 20, check that ADER is 00.
6. Press the MENU/NO “R” button to stop playback, then press
the MD Z button and take out the test disc.
CD Error Rate Check
Procedure:
1. Load the check disc (TDYS-1).
2. Press the . “R” or > “R” button to display “CPLAY
1MODE” (C34).
3. Press the ENTER/YES “R” button to display “CPLAY 1MID”.
4. The display changes to “C = AD = )”.
5. Check that the C1 error rate is below 20.
6. Press the MENU/NO “R” button to stop playback, then press
the MD Z button and take out the check disc.
6-9. Self-Recording/playback Check
Prepare a continuous recording disc using the unit to be repaired
and check the error rate.
Procedure:
1. Load a recordable disc (blank disc).
2. Press the . “R” or > “R” button to display “CREC
1MODE” (C34).
3. Press the ENTER/YES “R” button to display “CREC 1MID”.
4. When recording starts, “ REC ” and display “CREC 1 @@@@”
(@@@@ is the address).
5. About 1 minute later, press the MENU/NO “R” button to stop
continuous recording.
6. Press the . “R” or > “R” button to display “CPLAY
1 MODE” (C34).
7. Press the ENTER/YES “R”button to display “CPLAY 1
MID”.
8. “C = AD = )” will be displayed.
9. Check that the C1 error becomes below 20 and the AD error
below 2.
10. Press the MENU/NO “R”button to stop playback, then press
the MD Z button and take out the disc.
REC
40
HCD-C5
7. INITIAL SETTING OF ADJUSTMENT VALUE
Note:
Mode which sets the adjustment results recorded in the non-volatile memory
to the initial setting value. However the results of the temperature compen-
sation offset adjustment will not change to the initial setting value.
If initial setting is performed, perform all adjustments again excluding the
temperature compensation offset adjustment.
For details of the initial setting, refer to “4. Precautions for Adjustments”
(See page 36) and execute the initial setting before the adjustment as re-
quired.
Procedure:
1. Press the . “R”or > “R”button to display “ADJ
CLEAR” (C28).
2. Press the ENTER/YES “R”button. “Complete!” will be
displayed momentarily and initial setting will be executed, after
which “ADJ CLEAR” (C28) will be displayed.
8. RECORDING AND DISPLAYING THE IOP
INFORMATION
The IOP data can be recorded in the non-volatile memory. The IOP
value on the optical pick-up label and the IOP value after the
adjustment will be recorded. Recording these data eliminates the
need to read the label on the optical pick-up.
Recording Procedure:
1. Press the . “R” or > “R” button to display “Iop Write”
(C05), and press the ENTER/YES “R” button.
2. The display becomes “Ref=@@@.@” (@ is an arbitrary
number) and the numbers which can be changed will blink.
3. Input the IOP value on the optical pick-up label.
To select the number : Press the . “R” or > “R” button.
To select the digit : Press two buttons of VOL - and
CD Z simultaneously.
4. When the ENTER/YES “R” button is pressed, the display
becomes “Measu=@@@.@” (@ is an arbitrary number).
5. As the adjustment results are recorded for the step 4 value. Leave
it as it is and press the ENTER/YES “R” button.
6. “Complete!” will be displayed momentarily. The value will be
recorded in the non-volatile memory and the display will become
“Iop Write” (C05).
Display Procedure:
1. Press the . “R” or > “R” button to display “Iop
Read”(C26) and press the ENTER/YES “R” button.
2. “@@.@/##.#” is displayed and the recorded contents are
displayed.
@@.@ indicates the IOP value on the optical pick-up label.
##.# indicates the IOP value after adjustment
3. To end, press the MENU/NO “R” button to display “Iop Read”
(C26).
9. TEMPERATURE COMPENSATION OFFSET
ADJUSTMENT
Save the temperature data at that time in the non-volatile memory
as 25 ˚C reference data.
Note:
1. Usually, do not perform this adjustment.
2. Perform this adjustment in an ambient temperature of 22 ˚C to 28 ˚C. Per-
form it immediately after the power is turned on when the internal tempera-
ture of the unit is the same as the ambient temperature of 22 ˚C to 28 ˚C.
3. When D101 has been replaced, perform this adjustment after the tem-
perature of this part has become the ambient temperature.
Procedure:
1. Press the . “R” or > “R” button to display “TEMP
ADJUST” (C03).
2. Press the ENTER/YES “R” button to select the “TEMP
ADJUST” mode.
3. “TEMP = [OK]” and the current temperature data will be
displayed.
4. To save the data, press the ENTER/YES “R” button.
When not saving the data, press the MENU/NO “R” button.
5. When the ENTER/YES “R” button is pressed, “TEMP =
SAVE” will be displayed and turned back to “TEMP ADJUST”
(C03) display then. When the MENU/NO “R” button is pressed,
“TEMP ADJUST” (C03) will be displayed immediately.
Specified Value:
The “TEMP = ” should be within “E0 - EF”, “F0 - FF”, “00 -
0F”, “10 - 1F” and “20 - 2F”.
10.LASER POWER ADJUSTMENT
Before starting adjustment;
The laser power adjustment value changes depending upon the types
of the optical pick-up (KMS-260B or KMS-260E).
Check the type of the optical pick-up before starting adjustment.
(See the illustrations “The method of identifying the optical pick-
up on page 41.)
Check the IOP value of the optical pick-up before adjustments.
(Refer to 8. Recording and Displaying the Iop Information)
Connection:
Procedure:
1. Insert the laser power meter probe into the disc insertion slot
and set it on top of the objective lens of the optical pick-up.
(When it cannot be set properly, press the m “R” button or
M “R” button to move the optical pick-up)
Connect the digital voltmeter to CN105 pin 1 (I+3V) and
CN105pin 2 (IOP) on the BD (MD) board.
2. Press the . “R” or > “R” button to display “LDPWR
ADJUST” (C04).
(Laser power : For adjustment)
3. Press the ENTER/YES “R” button once to display “LD 0.9 mW
$ ”.
4. Press the . “R” or > “R” button until the laser power
meter reading matches with the specified value as described in
the following table.
Press the ENTER/YES “R” button after setting the range knob
of the laser power meter, and save the adjustment results.
(“LD SAVE $ ” will be displayed for a moment)
5. Then “LD 7.0 mW $ ” will be displayed.
+
–
BD (MD) board
digital voltmeter
CN105 pin
1
(I+3V)
CN105 pin
2
(IOP)
Optical pick-up
objective lens
laser
power meter
SPECIFIED VALUE KMS-260B
KMS-260E
0.85 to 0.91 mW
0.90 to 0.96 mW
41
HCD-C5
6. Press the . “R” or > “R” button so that the reading
of the laser power meter becomes the specified value, press the
ENTER/YES “R” button to save it.
Note: Do not perform the emission with 8.4 mW more than 15 seconds
continuously.
7. Then, press the . “R” or > “R” button to display
“LDPWR CHECK” (C13).
8. Press the ENTER/YES “R” button once to display “LD
0.9mW$ ”. Check that the reading of the laser power meter
matches with the specified value as described in the following
table.
9. Press the ENTER/YES “R” button once more to display “LD
8.4mW$ ”. Check that the reading the laser power meter and
digital voltmeter satisfy the specified value.
Note down the digital voltmeter reading value.
Specified Value:
Laser power meter reading :
Digital voltmeter reading :
Value on the optical pick-up label ±10%
10. Press the MENU/NO “R” button to display “LDPWR CHECK”
(C13) and stop the laser emission.
(The MENU/NO “R” button is effective at all times to stop the
laser emission)
11. Press the . “R” or > “R” button to display “Iop Write”
(C05).
12. Press the ENTER/YES “R”button. When the display becomes
“Ref=@@@.@” (@ is an arbitrary number), press the
ENTER/YES “R” button to display “Measu=@@@.@” (@ is
an arbitrary number).
13. The numbers which can be changed will blink. Input the Iop
value noted down at step 9.
To select the number : Press the . “R” or > “R” button.
To select the digit :Press two buttons of VOL - and
CD Z simultaneously.
14.
When the ENTER/YES “R” button is pressed, “Complete!” will
be displayed momentarily. The value will be recorded in the non-
volatile memory and the display will become “Iop Write” (C05).
Note: After step 9, each time the ENTER/YES “R” button is pressed, the
display will be switched to “LD 0.7mW$ ”, “LD 6.2mW$ ”
and “LD WP ” Nothing needs to be performed here.
The method of identifying the optical pick-up
(KMS-260B/260E)
11.Iop NV SAVE
Write the reference values in the nonvolatile memory to perform
“Iop compare”. As this involves rewriting the reference values, do
not perform this procedure except when adjusting the laser power
during replacement of the optical pick-up and when replacing the
IC102. Otherwise the optical pick-up check may deteriorate.
Note:
Perform this function with the optical pick-up set at room temperature.
Procedure:
1.
Press the . “R” or > “R” button to display “Iop NV Save”
(C06).
2. Press the ENTER/YES “R”button and display “Iop [stop]”.
3. After the display changes to “Iop =xxsave?”, press the
ENTER/YES “R”button.
4. After “Complete!” is displayed momentarily, the display changes
to “Iop 7.0 mW”.
5. After the display changes to “Iop=yysave?”, press the
ENTER/YES “R”button.
6. When “Complete!” is displayed, it means that Iop NV saving
has been completed.
12. TRAVERSE ADJUSTMENT
Note 1: Data will be erased during MO reading if a recorded disc is
used in this adjustment.
Note 2: If the traverse waveform is not clear, connect the oscilloscope
as shown in the following figure so that it can be seen more
clearly.
Connection:
SPECIFIED VALUE KMS-260B
KMS-260E
6.9 to 7.1 mW
7.2 to 7.3 mW
SPECIFIED VALUE KMS-260B
KMS-260E
0.85 to 0.91 mW
0.90 to 0.96 mW
KMS260B
20101
H0576
lOP = 57.6 mA in this case
lOP (mA) = Digital voltmeter reading (mV)/1 (
Ω
)
(Optical pick-up label)
For details of the method for
checking this value, refer to
“8. Recording and Displaying
the Iop Information”
SPECIFIED VALUE KMS-260B
KMS-260E
7.0 to 0.2 mW
7.25 to 0.25 mW
UV adhesive agent
Optical pick-up
(KMS-260B/260E)
Pink : KMS-260B
White : KMS-260E
UV adhesive agent =
+
–
oscilloscope
(DC range)
10 pF
330 k
Ω
CN105 pin
4
(TE)
CN105 pin
6
(VC)
BD (MD) board
+
–
oscilloscope
(DC range)
V: 0.1 V/div
H: 10 ms/div
BD (MD) board
CN105 pin
4
(TE)
CN105 pin
6
(VC)
42
HCD-C5
Procedure:
1. Connect an oscilloscope to CN105 pin 4 (TE) and CN105 pin
6 (VC) on the BD (MD) board.
2. Load a disc (any available on the market). (Refer to Note 1)
3. Press the M “R” button to move the optical pick-up outside
the pit.
4. Press the . “R” or > “R” button to display “EF MO
ADJUST” (C07).
5.
Press the ENTER/YES “R”button to display “EFB =
MO-
R”.
(Laser power READ power/Focus servo ON/tracking servo
OFF/spindle (S) servo ON)
6. Press the . “R” or > “R” button so that the waveform of
the oscilloscope becomes the specified value.
(When the . “R” or > “R” button is pressed, the
of
“EFB=
” changes and the waveform changes) In this adjustment,
waveform varies at intervals of approx. 2%. Adjust the waveform
so that the specified value is satisfied as much as possible.
(Read power traverse adjustment)
Traverse Waveform
7. Press the ENTER/YES “R” button and save the result of
adjustment to the non-volatile memory (“EFB = SAVE”
will be displayed for a moment. Then “EFB = MO-W” will
be displayed).
8. Press the . “R” or > “R” button so that the waveform of
the oscilloscope becomes the specified value.
(When the . “R” or > “R” button is pressed, the of
“EFB= ” changes and the waveform changes) In this
adjustment, waveform varies at intervals of approx. 2%. Adjust
the waveform so that the specified value is satisfied as much as
possible. (Write power traverse adjustment)
Traverse Waveform
9. Press the ENTER/YES “R” button, and save the adjustment
results in the non-volatile memory. (“EFB = SAVE” will be
displayed for a moment)
10. “EFB = MO-P” will be displayed.
The optical pick-up moves to the pit area automatically and
servo is imposed.
A
B
VC
Specification A = B
11. Press the . “R” or > “R” button until the waveform of
the oscilloscope moves closer to the specified value.
In this adjustment, waveform varies at intervals of approx. 2%.
Adjust the waveform so that the specified value is satisfied as
much as possible.
Traverse Waveform
12. Press the ENTER/YES “R” button, and save the adjustment
results in the non-volatile memory. (“EFB = SAVE” will be
displayed for a moment)
Next “EF MO ADJUST” (C07) is displayed. The disc stops
rotating automatically.
13. Press the MD Z button and take out the disc.
14. Load the check disc (TDYS-1).
15. Press the . “R” or > “R” button to display “EF CD
ADJUST” (C08).
16. Press the ENTER/YES “R” button to display “EFB = CD”.
Servo is imposed automatically.
17. Press the . “R” or > “R” button so that the waveform of
the oscilloscope moves closer to the specified value.
In this adjustment, waveform varies at intervals of approx. 2%.
Adjust the waveform so that the specified value is satisfied as
much as possible.
Traverse Waveform
18. Press the ENTER/YES “R” button, display “EFB = SAVE”
for a moment and save the adjustment results in the non-volatile
memory.
Next “EF CD ADJUST” (C08) will be displayed.
19. Press the MD Z button and take out the check disc.
Adjustment Location: BD (MD) board (see page 44)
A
B
VC
Specification A = B
A
B
VC
Specification A = B
A
B
VC
Specification A = B
43
HCD-C5
14. ERROR RATE CHECK
14-1. CD Error Rate Check
Procedure:
1. Load the check disc (TDYS-1).
2. Press the . “R” or > “R” button and display “CPLAY 1
MODE” (C34).
3. Press the ENTER/YES “R”button and display “CPLAY 1
MID”.
4. The display changes to “C = AD = )”.
5. Check that the C1 error rate is below 20.
6. Press the MENU/NO “R” button to stop playback, then press
the MD Z button and take out the check disc.
14-2. MO Error Rate Check
Procedure:
1. Load the continuously-recorded disc. (Refer to “5. USING THE
CONTINUOUSLY RECORDED DISC” (See page 37))
2. Press the . “R” or > “R” button to display “CPLAY 1
MODE” (C34).
3. Press the ENTER/YES “R”button to display “CPLAY 1MID”.
4. The display changes to “C1 = AD = )”.
5. If the C1 error rate is below 20, check that ADER is 00.
6. Press the MENU/NO “R”button to stop playback, then press
the MD Z button and take out the disc.
15. FOCUS BIAS CHECK
Change the focus bias and check the focus tolerance amount.
Procedure:
1. Load the continuously-recorded disc. (Refer to “5. USING
THE CONTINUOUSLY RECORDED DISC” (See page 37))
2. Press the . “R” or > “R” button to display “CPLAY 1
MODE” (C34).
3. Press the ENTER/YES “R” button twice to display “CPLAY
1 MID”.
4. Press the MENU/NO “R” button when “C1 = AD =
)” is displayed.
5. Press the . “R” or > “R” button to display “FBIAS
CHECK” (C16).
6. Press the ENTER/YES “R” button to display “ / c =
”.
The first four digits indicate the C1 error rate, the two digits
after “/ ” indicate ADER, and the 2 digits after “c =” indicate
the focus bias value.
Check that the C1 error is below 20 and ADER is below 2.
7. Press the ENTER/YES “R” button and display “ / b
= ”.
Check that the C1 error is about 100 and ADER is below 2.
8. Press the ENTER/YES “R” button and display “ / a
= ”.
Check that the C1 error is about 100 and ADER is below 2
9. Press the MENU/NO “R” button, then press the MD Z button
and take out the disc.
Note: If the C1 error and ADER are above other than the specified
value at points a (step 8. in the above) or b (step 7. in the above),
the focus bias adjustment may not have been carried out prop-
erly. Adjust from the beginning again.
C1 error
about
220
BCA
Focus bias value
13. FOCUS BIAS ADJUSTMENT
Procedure:
1. Load the continuously-recorded disc. (Refer to “5. USING
THE CONTINUOUSLY RECORDED DISC” (See page 37))
2. Press the . “R” or > “R” button to display “CPLAY 1
MODE” (C34).
3. Press the ENTER/YES “R”button to display “CPLAY 1MID”.
4. Press the MENU/NO “R”button when “C = = ” is
displayed.
5. Press the . “R” or > “R” button to display “FBIAS
ADJUST” (C09).
6. Press the ENTER/YES “R” button to display “ / a =
T”.
The first four digits indicate the C1 error rate, the two digits
after “/ ” indicate ADER, and the 2 digits after “a =” indicate
the focus bias value.
7. Press the > “R” button and find the focus bias value at
which the C1 error rate becomes about 220 (refer to Note 2).
8. Press the ENTER/YES “R” button to display “ / b =
T”.
9. Press the . “R” button and find the focus bias value at
which the C1 error rate becomes about 220.
10. Press the ENTER/YES “R” button to display “ / c =
T”.
11. Check that the C1 error rate is below 20 and ADER is 00. Then
press the ENTER/YES “R” button.
12. If the “( )” in “ - - ( )” is above 20, press the
ENTER/YES “R” button.
If below 20, press the MENU/NO “R” button and repeat the
adjustment from step 2.
13. Press thet MD Z button and take out the disc.
Note 1: The relation between the C1 error and focus bias is as shown in
the following figure. Find points A and B in the following figure
using the above adjustment. The focal point position C is auto-
matically calculated from points A and B.
Note 2: As the C1 error rate changes, perform the adjustment using the
average value.
44
HCD-C5
16. AUTO GAIN CONTROL OUTPUT LEVEL ADJUSTMENT
Be sure to perform this adjustment when the optical pick-up is replaced.
If the adjustment results becomes “Adjust NG!”, the optical pick-up may be faulty or the servo system circuits may be abnormal.
16-1. CD Auto Gain Control Output Level Adjustment
Procedure:
1. Load the check disc (TDYS-1).
2. Press the . m “R” or M > “R” button to display “AG Set (CD)” (C11).
3. When the ENTER/YES “R” button is pressed, the adjustment will be performed automatically.
“Complete!” will then be displayed momentarily when the value is recorded in the non-volatile memory, after which the
display changes to “AG Set (CD)” (C11).
4. Press the MD Z button and take out the check disc.
16-2. MO Auto Gain Control Output Level Adjustment
Procedure:
1. Load the test disc (MDW-74/GA-1).
2. Press the . “R” or > “R” button to display “AG Set (MO)” (C10).
3. When the ENTER/YES “R” button is pressed, the adjustment will be performed automatically.
“Complete!” will then be displayed momentarily when the value is recorded in the non-volatile memory, after which the
display changes to “AG Set (MO)” (C10).
4. Press the MD Z button and take out the test disc.
Adjustment and checking Loacation:
Note: It is useful to use the jig for checking the waveform. (Refer to Servicing Notes on page 6)
D101
CN101
– BD (MD) BOARD (Component Side) –
IC101
CN105
IC151
IC190
1
7
1. I+3V
2. IOP
3. GND
4. TE
5. FE
6. VC
7. RF
– BD (MD) BOARD (Conductor Side) –
4545
HCD-C5
C
B
These are omitted.
E
Q
Note on Printed Wiring Boards:
•X: parts extracted from the component side.
•a: Through hole.
•Y: parts extracted from the conductor side.
•b: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• Indication of transistor.
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specified.
•5: fusible resistor.
•C: panel designation.
•A: B+ Line.
•B: B– Line.
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F: FM
J: CD (ANALOG)
c: CD (DIGITAL)
p: PB (MD)
l: REC (MD)
I: DIGITAL IN (OPTICAL)
E: PB (TAPE)
G: REC (TAPE)
• Circuit Boards Location
6-1. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
(In addition to this, the necessary note is printed in each block)
SECTION 6
DIAGRAMS
• Waveforms
B
These are omitted.
CE
Q
POWER board
HP board
AUDIO board
JACK boar
d
PANEL board
1
IC101 us XTAO
2
IC101 ek (RF)
3
IC101 ef (FE)
(Play mode)
7
IC501 eh XT2
5
IC151 o; (FS4)
VOLT/DIV : 1V AC
TIME/DIV : 20 nsec
6
IC701 qd XOUT
VOLT/DIV : 1V AC
TIME/DIV : 40 nsec VOLT/DIV : 1V AC
TIME/DIV : 40 nsec
VOLT/DIV : 1V AC
TIME/DIV : 20
µ
sec
4
IC101 wh (TE)
(Play mode)
8
IC501 ek X2
29.5
µ
s
4.0Vp-p
3.5Vp-p
176.4kHz
1.3Vp-p
3.2 Vp-p
100 ns
0.2Vp-p
30.5
µ
s
3.2Vp-p
1.6Vp-p
3.1 Vp-p
50 ns
BD (CD) boar
d
AMP POWER boardUCOM board
SW board
CONNECTOR board
BD (MD) board MD DIGITAL board
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component A) the parts face are indicated.
•Abbreviation
AUS : Australian model
HK : Hong Kong model
KR : Korean model
Ver 1.1 2001.09
4646
HCD-C5
6-2. BLOCK DIAGRAM – CD SERVO SECTION –
• Signal Path
: CD (DIGITAL)
:DIGITAL IN (OPTICAL)
OPTICAL PICK-UP
BLOCK
OPTIMA-720L1E
VA
9
VB
VE
VF
LD
1/2VCC
VCC +5V
GND
MD
VR
LD
DRIVE
Q101
RF AMP
DIGITAL
OPTICAL
IN
IC103
VC
27
VFC
25
B
7
A
6
C
8
D
9
E
10
F
11
LD
1
PD
2
VC
IC102
MOTOR/COIL DRIVER
VO1(+)
14
VO1(-)
13
12
11
15
16
M
M
FEED
MOTOR
18
17
M
SPINDLE
MOTOR
F+
FOCUS
COIL
TRACKING
COIL
F-
TR+
TR-
2
OPIN1(+)
3
OPIN1(-)
5
6
27
26
23 MDP
25
SRDR
30
SFDR
29
TRDR
32
TFDR
31
FRDR
34
FFDR
33
DIGITAL SIGNAL PROCESSOR
IC101
DIGITAL SERVO,
64
D OUT
RFAC
50
28
RFDCO
15
26
RFAC
16FE
18TE
12
SW
17
FEI
29
RFDCI
RFDC
43
FE
39
TE
41
SE
VCC
RV101
40
4
DATA DATA
6
CLOK CLK
5
XLAT XLT
76
SQSO SQSO
7
SENS SENS
26 SSTP
19 TE_BAL
2
XRST
69
XTSL
MASTER CONTROL
IC501(1/2)
CXD-DATA
7
8
SCLK
77
SQCK
SCLK
15
SCOR SCOR
71
XTAI
72
XTAO
CXD-CLK
8
CXD-XLT
11
SUBQ
15
SENSE
14
SCLK
17
SCOR
95
CTRL1
CTRL1(1-2) 18
LDON
LDON 13
BDRST
XRST 29
27
26
7
9
4
2
PWM1
PWM1 12
PWM2
PWM2 19
PWM3
PWM3 20
VO2(+)
VO2(-)
VO4(+)
VO4(-)
VO3(-)
VO3(+)
OPIN2(+)
OPIN(2-)
OPIN4(+)
OPIN4(-)
OPIN3(-)
A
MD
SERVO
SECTION
(Page 47)
RFC
SWITCH
Q102
IC221
+3.3V
REG
Q103,D101
SELECTOR
5
4
6
9
10
8
13 11
12
X201
33.8688MHz
S5
LIMIT
IN
SWITCH
+5V
+5V
+3.3V
DIN, OPTO
3
1
2
8
4
6
2
3
7
10
5
1
SD+
SD-
SP+
SP-
IC222
OPTO
SW1
30
SW2
31
SW3
32
SW4
S1 (Disc IN/8cm Disc Detect)
S2
(12cm Disc/12cm Disc Eject End Detect)
S3 (Disc Existence, Chacking, Releasing Detect)
S4 (8cm Disc Eject End Detect) 33
IC1102
LOADING MOTOR DRIVER
RIN
FIN OUT1
OUT2
LODPOS
LODNEG
M902
(LOADING)
M903
M904
DIGITAL
OPTICAL
INPUT
4747
HCD-C5
6-3. BLOCK DIAGRAM – MD SERVO SECTION –
• Signal Path
: PB (MD)
: REC (MD)
: CD (DIGITAL)
: CD (ANALOG)
F
C B
DA
E
I J
J
I
B
A
C
D
E
F
DETECTOR
J
I
A
B
C
D
E
F
LDPD
LASER DIODE
ILCC
PD
OPTICAL PICK-UP
(KMS-260B)
Q121, 122
AUTOMATIC
POWER CONTROL
APC
PD
APCREF
AT
AMP B.P.F.
WBL
ADFM ADIN ADFG
ABCD
AMP
ABCD
FE
TE
SE
F0CNT
WBL
3T
EQ
COMMAND
SWDT
SCLK
XLAT
RFO RF AGC
& EQ
AGCI
EQ
RF
IC101
RF AMP,
FOCUS/TRACKING ERROR AMP
TEMP
MORFO
MORFI
3T
WBL
AUX
PEAK
BOTM
IC141
FOCUS/TRACKING COIL DRIVER,
SPINDLE/SLED MOTOR DRIVER
OUT4F
OUT4R
M701
(SPINDLE)
OUT2F
OUT2R
M702
(SLED)
OUT1F
OUT1R
OUT3F
OUT3R
FCS+
FCS–
TRK+
TRK–
2-AXIS
DEVICE
(TRACKING)
(FOCUS)
IN4R
IN4F
IN2F
IN2R
IN1F
IN1R
IN3F
IN3R
MOD
SPFD
SPRD
APCREF
SFDR
SRDR
FFDR
FRDR
TFDR
TRDR
PSB
PWM GENERATOR
FROM CPU
INTERFACE
IC151 (2/2)
DIGITAL SERVO
SIGNAL PROCESSOR
RECP
AUX1
ABCD
FE
TE
SE
PEAK
BOTM
XLRF
CKRF
DTRF
XLAT
SCLK
SWDT
FILI
PCO
CLTV
FILO
EFMO ADDT
DADTI
IC151 (1/2)
TX
ASYO
ASYI
RFI
SCTX
HR901
OVER WRITE HEAD
ADFG
F0CNT
SPFD
SPRD
SAMPLING
RATE
CONVERTER
DIGITAL
AUDIO
INTERFACE
DIN0
DOUT
IC151 (1/2)
DIGITAL SIGNAL PROCESSOR,
EFM/ACIRC ENCODER/DECODER,
SHOCK PROOF MEMORY CONTROLLER,
ATRAC ENCODER/DECODER
INTERNAL BUS
DADT
XBCK
LRCK
FS256
OSCI
OSCO
DQSY
SQSY
XINT
SENS
SRDT
SWDT
SCLK
XLAT
MNT0
MNT1
MNT2
MNT3
SWDT
SCLK
XLAT
P-DOWN
SHOCK (MNT1)
XBUSY (MNT2)
DIG-RST
SQSY
DQSY
LDON
WRPWR
MOD
XINT
SENS
SRDT
LOAD-IN
LOAD-OUT
RIN
FIN
OUT1
OUT2
VREF
IC871
LOADING
MOTOR DRIVER
M703
(LOADING)
DQ1 – DQ4
A0 – A9
D0 – D3
A00 – A09
XOE
XWE
XRAS
XCAS
OE
WE
RAS
CAS
IC153
D-RAM
DIN1
IC701
MASTER CONTROLLER
HF MODULE
REFLECT
PROTECT
LOAD-LO
WP
VINL
VINR
SPDIF-LOCK
DA-RESET
SLICER-SEL
MUTE
EEP-DATA
EEP-CLK
EEP-WP
ADPDWN
XOUT
XIN
VOUTL
VOUTR
SCL
SDA
M+7V
65
15
13
82
OPTSEL OPTO
81
7
3
1
8
15 16 33 37 29
49
51
55
61
44
89 I2C-DAT 30
SPDIF-CUT
I2C-CLK I2C-DATA
I2C-CLK
R-CH
MD-L
29
I2C-BUSY I2C-BUSY
23
53
LIMIT-IN
OUT-SW
PWON
MUTE
SLICER-SEL
RESET
LOCK
(LIMIT IN)
(OUT)
(PLAY)
(REC)
PLAY-SW
REC-SW
XBCKI
LRCKI
11
9
8
4
1
2
3
48 47
46 40
33
38
37
36
32
35
34
26
28
181716
20
12
3029
5
6
7
10
Q101
LASER ON
SWITCH
LD/PD
AMP
I-V
AMP
I-V
AMP
FOCUS
ERROR AMP
TRACKING
ERROR AMP
RF AMP
B.P.F.
PEAK &
BOTTOM
6
8
92
91
88
89
86
85
81
80
83 13 67 65 66 75 74 63 64
82
27
25
21
23
12
10
14
15
19
18
29
30
3
4
16
MM
M
AUTOMATIC
POWER
CONTROL
DIGITAL SERVO
SIGNAL
PROCESS
ANALOG MUX
A/D CONVERTER
SERIAL/PARALLEL
CONVERTER,
DECODER
AUTO
SEQUENCER
V-I
CONVERTER
Q131 - 134
HF MODULE
SWITCH
100
60
59
62
61
53
54
57
78
79
94 93
10
12 11 14 9 8 5 6 7 1 2 3 4 43
47
16
29
27
28
26
21
20
19
23
24
22
25
17
46
44
22
3
4
23
15 68
ADIP
DEMODULATOR/
DECODER
SPINDLE
SERVO
COMPA-
RATOR
PLL
FILTER
SUBCODE
PROCESSOR
EFM/ACIRC
ENCODER/DECODER
SHOCK PROOF
MEMORY CONTROLLER
ATRAC
ENCODER/DECODER
CPU
INTERFACE MONITOR
CONTROL
18
57
12
52
54
56
20 25 58 32 33 50 59 48 1931
XRST
CLOCK
GENERATOR
48, 49, 50, 51
1, 2, 24, 25
34 – 31, 36 – 40, 45
5, 9 – 12, 14 – 18
67 66
9 7
1
VCC 6
4 2
13 1211
M
Q871, 872
REFERENCE
VOLTAGE SWITCH
BCK
WS
SPDIF0
SPDIF1
IIS-OUT-BCK
IIS-OUT-WS
CLKOUT SYSCLK
DATAO
DOUT
DADTI
XBCKI
LRCKI
DIN
IOP
S101
S103
S104
S105
S102
43 -A
LD+3.3V
IC102
WAVEFORM
SHAPER
X720
10MHz
XOUT-T
XIN-T 10
11
X717
32kHz
47
45
60
76
78
79
80 21
1
13
12
7
6
5
IC195
EEPROM
R-CH
REC-L
DIN , OPTO
IC211
D/A
CONVERTER
IC201
A/D
CONVERTER
22
VDDA (DAC) 32
18
Q211
DOUT
DIN
DIN
MUTE
DATAI
XBCKI
LRCKI
XBCKI
LRCKI
LD+3V
X171
90MHz
IOP
3 1 +5VLD+3.3 V +3.3V
REG
IC190
CD
SERVO
SECTION
(Page 46)
MAIN
SECTION
(Page 48)
MAIN
SECTION
(Page 48)
VC
VC VC
15
14 TEMPI
TEMPR
SWITCH
Q861
SWITCH
Q201,202
+B
SWITCH
BUP+3.3V 35
IC861
RESET
S-RST
A
B
C
D
MAIN
SECTION
(Page 48)
PDOWN , MUTE
PDOWN
D101
TEMP
SENSOR
+3.3V
72
I2C-DATA,I2C-CLK,
I2C-BUSY
IC181, Q181 182
OVER WRITE
HEAD DRIVE
(REFLECT
→ PROTECT)
4848
HCD-C5
6-4. BLOCK DIAGRAM – MAIN SECTION –
: FM
: CD(ANALOG)
• Signal Path
• R-CH is omitted due to same as L-CH.
: PB(MD)
: REC(MD)
: PB(TAPE)
: REC(TAPE)
TUNER PACK
TC
MD-L
REC-L
38
IC301
SOUND PROCESSOR
35
REC
25
OUT
L-CH
R-CH
CL
DO
DI
CE
TUNED
STEREO
MUTE
R-CH
IC501 (2/2)
MASTER CONTROL
IC601
FL DRIVER
FL601
FLUORESCENT
INDICATOR TUBE
52
PRE-MUTE
56
SPK-RELAY
AC-CUT
RESET
34
CD/MD
37
ST
39
LAT
CLK
DATA
22 21
Q341
MUTING
Q331
MUTING
Q101
MUTING MUTING
SWITCH
Q202
H/P
DETECT
Q232
Q991
RELAY
DRIVER
RESET
SWITCH
Q941
VOL-DATA
VOL-CLK
VOL-CE
64
63
PLL-CLK
PLL-DI(ST UCOM)
PLL-DO(UCOM ST)
PLL-CE
TUNED
STEREO
ST-MUTE
43
45
44
46
49
48
47
+
–
5
IC302
HEADPHONE AMP
67
R-CH J103
PWR-RELAY
PHONES
REC-MUTE
54
91
D982-985
D851
-30V
REG
B+
SWITCH
Q911,912
CD+5V
D971-974
D981
CD+10V
ST+10V
T900
MAIN
TRANSFORMER
T901
SUB
TRANSFORMER
+B
-B
+10V
REG
IC901
3 1
C
AC IN
SYS +5V
R-CH
J102
J101
31
IC941
AC-DET
D942
RESET
MD
SERVO
SECTION
(Page 47)
B
D
PDOWN
MUTE
MD
SERVO
SECTION
(Page 47)
D961-964
+5V
REG
IC905
3 1
+5.6V
REG
IC907
3
2
1
MD H/M+5V
CDM+5V
+7V
REG
IC903
3 1
CD+7V
PRE+7V
+5V
REG
IC902
3 1
MDM+5V
LED+5V
FL -30V
VF
VF
VF
VF
+4V
REG
IC906
RY991
3 1
MD-PWR
D992
D993
D941
D926
D927
D925
POWER AMP
69
BDPWR 28
DMUTE
70
24
R-CH
Q971
+5V
REG
IC904
3 1
Q311 D343
26
B-O
27
B-I
28
V-O
DBFB
SWITCH
Q102
SWITCH
SWITCH
SWITCH
Q601
SWITCH
Q602
SWITCH
62
20
FAN
DRIVER
Q103
(D.C. FAN)
BACKUP
+5V/+2.7V
SYS +5V
A +3.3V
MD D+3.3V
BUP +3.3V
BT921
(RECHARGEABLE)
A-MUTE
A-MUTE
RELAY
AMP-L
35
36
39
38
5
1
4
6
2
16
14
13
15
92
3
IC212
I2C BUS BUFFER
+5V
LX
LY
SX
SY
21
65
4
3
X502
32.768kHz
X501
20MHz
6
3
7
2
PCPON
SCL
SDA
57 HELP
60 KBD-CHK
XT1
XT2
X1
X2
FL-DATA
FL-CLK
FL-CE
12
DIG0 16G
DIG15 01G
DIG1
ı
DIG14
15G
ı
02G
SEG0
ı
SEG34
P01
ı
P35
61
FL-RST
SDATA
SCK
CS
RST
I2C-CLK
I2C-DATA
PCLINK-INSERTED
I2C-DATA, I2C-CLK, I2C-BUSY
MD
SERVO
SECTION
(Page 47)
77
FUNCTION
KEY
S602-605
KEY1
78
FUNCTION
KEY
S606-609
KEY2
79
FUNCTION
KEY
S610-613
KEY3
94
1
IC602
REMOTE
SENSOR SIRCS
93 KEY-RM
Q211
Q212
CN207
PC LINK
I2C-BUSY
CLK
DATA
SIRCS/
POWERKEY
DETECT
Q221-224
72
65
Q604
D601
(STANDBY)
D602-610
(KEY BACK LIGHT)
ON/STANDBY
LED
11
ı
1
64
ı
62
•
6
ı
19
21
ı
55
59
ı
33
31
ı
24
•
5
20
3
8
2
L
CN208
LED
DRIVER
ANTENA
FM75Ω
AM
ı
`/1
M901
TAPE
IN
OUT
SPEAKER
4949
HCD-C5
6-5. PRINTED WIRING BOARDS – CD SECTION –
IC103
IC102
IC1102
IC101
DVC1.65V
RFAC
(Page 56)
SW BOARD
CONNECTOR BOARD
14
113
26
1-682-100-
+
M902
LOADING
MOTOR
+
M904
SPINDLE
MOTOR
M903
S5
(LIMIT IN)
FEED
MOTOR
+
GRN
YEL
ORG
RED
BRN
CN1
GRN
S4
(8cm Disc Eject End Detect)
S1
(Disc IN/8cm Disc Detect)
S2
(12cm Disc/12cm Disc
Eject End Detect)
S3
(Disc Existence, Chacking,
Releasing Detect)
YEL
ORG
RED
BRN
(OPTIMA-720L1E)
1-682-099-
• See page 45 for Circuit Boards Location.
Ref. No. Location
D101 D-2
IC101 D-3
IC102 A-2
IC103 A-4
IC1102 B-1
Q101 B-4
Q102 A-3
Q103 D-2
•Semiconductor
Location
5050
HCD-C5
IC B/D
IC B/D
IC B/D
IC B/D
TR-
TR+
F-
F+
(Page 57)
(8cm Disc Eject End Detect)
(12cm Disc/12cm Disc Eject End Detect)
(Disc IN/8cm Disc Detect)
(Disc Existence, Chacking, Releasing Detect)
M
N
O
6-6. SCHEMATIC DIAGRAM – CD SECTION –• See page 45 for Wavefoms. • See page 64 for IC Pin Function Description.
5151
HCD-C5
BD (MD) BOARD (SIDE A)
OPTICAL PICK - UP
HR901
OVER
WRITE HEAD
BLOCK
(KMS-260E/Z-NP)
E
E
EE
1
34
5
R162
R153
TO
MD DIGITAL
BOARD
CN703
(Page 54)
TO
MD DIGITAL
BOARD
CN702
(Page 54)
D C
13
4
E
5
S102
PROTECT
REFLECT
M703
M701
E
E
E
M702
C174
C173
X171
R177
BD (MD) BOARD (SIDE B)
17
IC190
IC141
IC151
IC153
IC102
IC101
IC181
IC195
6-7. PRINTED WIRING BOARD – BD (MD) BOARD –• See page 45 for Circuit Boards Location.
Ref. No. Location
D181 D-3
D183 D-3
IC101 A-3
IC102 B-3
IC141 C-1
IC151 C-2
IC153 C-3
IC181 D-3
IC190 D-1
IC195 D-2
Q121 B-3
Q122 B-3
Q181 C-3
Q182 D-3
•Semiconductor
Location
Side B
Ref. No. Location
D101 A-1
Q101 B-1
Q131 B-1
Q132 B-1
Q133 B-1
Q134 B-1
•Semiconductor
Location
Side A
5252
HCD-C5
IC B/D
2
3
4
(MD)
(KMS-260E/Z-NP)
0
BH6519FS-E2
M701
M702
(MD)
(MD)
(MD)
(Page 53)
(Page 53)
(Page 53)
6-8. SCHEMATIC DIAGRAM – BD (MD) BOARD (1/2) –• See page 45 for Wavefoms. • See page 65 for IC Block Diagrams. • See page 68 for IC Pin Function Description.
5353
HCD-C5
5
(MD)
C
D
MD
702
703
MD
153
4400D
EFM /ACIRC EONCODER / DECODER,
SHOCK PROOF MEMORY CONTROLLER,
ATRAC ENCODER / DECODER
,
M703
(MD)
(MD)
(MD)
(Page 55)
(Page 55)
(Page 52)
(Page 52)
(Page 52)
6-9. SCHEMATIC DIAGRAM – BD (MD) BOARD (2/2) –• See page 45 for Wavefoms. • See page 69 for IC Pin Function Description.
5454
HCD-C5
IC701
IC871
IC861
IC201 IC211
(Page 58)
(Page 51)
(Page 51)
(Page 56)
6-10. PRINTED WIRING BOARD – MD DIGITAL BOARD –• See page 45 for Circuit Boards Location.
Ref. No. Location
D211 A-3
IC201 B-1
IC211 B-2
IC701 D-2
IC861 D-5
IC871 D-5
Q201 D-7
Q202 C-7
Q211 A-2
Q861 D-5
Q871 D-3
Q872 C-3
•Semiconductor
Location
5555
HCD-C5
IC B/D
IC B/D
IC B/D
IC B/D
10K
1/16W
10K 1/16W
(Page 59)
(Page 53)(Page 53)
(2/2)(2/2)
(Page 57)
6-11. SCHEMATIC DIAGRAM – MD DIGITAL BOARD –• See page 45 for Wavefoms. • See page 65, 66 for IC Block Diagrams. • See page 72 for IC Pin Function Description.
5656
HCD-C5
6-12. PRINTED WIRING BOARD – UCOM BOARD – • See page 45 for Circuit Boards Location.
Ref. No. Location
• Semiconductor Location
Ref. No. Location
D214 B-1
D221 C-9
D222 B-9
D232 D-1
D513 B-9
D910 D-3
D923 B-3
D924 B-3
D925 D-4
D926 D-4
D927 D-4
D941 D-4
D942 D-4
D943 D-5
IC212 C-3
IC221 A-1
IC222 A-1
IC501 D-6
IC941 D-5
Q202 D-4
Q211 C-3
Q212 C-3
Q221 B-9
Q222 C-9
Q223 C-9
Q224 B-9
Q232 D-2
Q911 B-4
Q912 B-4
Q941 D-4
IC222
IC221
IC212
IC941
IC501
(Page 58) (Page 62)
(Page 60)
(Page 49)
(Page 58)
(Page 54)
(Page 62)
DIGITAL
OPTICAL
INPUT
SPEAKERS
12
12
(HK,KR,AUS)
(AEP,UK)
Ver 1.1 2001.09
5757
HCD-C5
IC B/D
DIGITAL
OPTICAL INPUT
SPEAKER
(Page 59)
(Page 63)
(Page 50) (Page 55) (Page 59)
(Page 61)
(Page 63)
D232
ISS355
TE-17
C241
4.7
16V
470 1/16W
1000
6.3V
FB537
BLM21B102S
(AEP,UK)
R538 10k
(HK,KR,AUS)
6-13. SCHEMATIC DIAGRAM – UCOM BOARD –• See page 45 for Wavefoms. • See page 67 for IC Block Diagrams. • See page 74 for IC Pin Function Description.
Ver 1.1 2001.09
5858
HCD-C5
IC302
IC301
(Page 54) (Page 62)
(Page 56)
(Page 56)
B
12
12
OUT
IN
TAPE
(AEP,UK)
(AEP,UK)
(AEP,UK)
(AEP,UK)
(AEP,UK,KR)
6-14. PRINTED WIRING BOARDS – AUDIO SECTION –• See page 45 for Circuit Boards Location.
Ref. No. Location
•Semiconductor Location
Ref. No. Location
D101 B-6
D111 D-5
D301 C-4
D103 B-6
D343 B-5
D393 B-5
IC301 B-2
IC302 B-4
Q101 B-6
Q102 B-6
Q103 A-7
Q151 C-6
Q311 C-1
Q331 B-3
Q361 B-3
Q381 B-3
Ver 1.1 2001.09
5959
HCD-C5
IC B/D
TAPE
OUT
IN
(Page 57)
(Page 57)
(Page 63)
(Page 55)
B
+5V
FM SIGNAL OUT
RDS INT
RDS DATA
RDS INT
RDS DATA
RDS INT
RDS DATA
C111
10 10V
D111
MTZJ-T-77-5.1B
R111
330
D301
1SS355TE
-17
(AEP,UK,KR)
(AEP,UK)
(AEP,UK)
6-15. SCHEMATIC DIAGRAM – AUDIO SECTION –• See page 64 for IC Block Diagrams.
Ver 1.1 2001.09
6060
HCD-C5
IC601
IC602
(Page 56)
6-16. PRINTED WIRING BOARD – PANEL BOARD –• See page 45 for Circuit Boards Location.
Ref. No. Location
D601 A-5
D602 B-5
D603 B-5
D604 C-5
D605 A-1
D606 B-1
D607 B-1
D608 C-1
D609 C-1
D610 D-1
IC601 B-3
IC602 C-5
Q601 C-3
Q602 B-3
Q604 D-3
•Semiconductor
Location
6161
HCD-C5
IC B/D
(Page 57)
6-17. SCHEMATIC DIAGRAM – PANEL BOARD –• See page 67 for IC Block Diagrams.
6262
HCD-C5
IC907
IC905
IC903
IC901
IC906
IC904
IC902
(Page 56)
(Page 58)
12
12
B
(Page 56)
T900
MAIN
TRANSFORMER
SUB
TRANSFORMER
EB902 EB901
6-18. PRINTED WIRING BOARDS – POWER SECTION –• See page 45 for Circuit Boards Location.
Ref. No. Location
•Semiconductor Location
Ref. No. Location
D906 D-4
D921 E-5
D961 D-3
D962 D-3
D963 D-3
D964 D-3
D971 A-2
D972 B-2
D973 A-2
D974 B-2
D975 A-2
D976 A-1
D981 A-5
D982 A-3
D983 A-3
D984 A-2
D985 A-2
D991 C-2
D992 E-3
D993 E-2
IC901 B-2
IC902 A-3
IC903 B-4
IC904 C-4
IC905 D-4
IC906 D-4
IC907 E-5
Q971 B-2
Q991 E-3
6363
HCD-C5
(Page 57)
(Page 59)
(Page 57)
B
1.8k
1/10W
T4AL/250V
T4AL/250V
6-19. SCHEMATIC DIAGRAM – POWER SECTION –
Ver 1.1 2001.09
6464
HCD-C5
6-20. IC BLOCK DIAGRAMS
RW/ROM
RW/ROM
EQ ON/OFF
VOFST
VOFST
DVC
VC
VC
VC
RW/ROM
VC
DVC
30
29
28
+
–
+
–
DVC
VCC
DVC
27
26
25
24
RW/ROM
EQ
23
22
21
20
19
RFAC
VCA
VCC
+
–
DVC
+
–
+
–
RW/ROM
VC
RW/ROM
DVC
+
–
3
A
B
C
D
B
C
A
A
A
B
C
D
BCD D
+
–
1
2APC AMP
5
6
7
8
9
4RFAC
SUMMING
AMP
RW/ROM
APC-OFF
(Hi-Z)
RW/ROM
(H/L)
VOFST
VC
RW/ROM
+
–
10
11
GM
GM
18
17
16
B
D
A
C
13
14
15
12
EQ IN
LD
PD
GND
A
B
C
D
AC SUM
E
F
DVCC
DVC
RFAC
SW
DC OFST
RFDCI
RFDCO
VC
RFC
VFC
BST
RFG
VCC
CEI
CE
TE BAL
TE
FEI
FE
IC103 CXA2581N-T4 (BD (CD) BOARD)
2
3
1
5
OPIN2 +
6
OPIN2 –
7
OPOUT2
8
GND
9
STBY1
4
BIAS IN
OPIN1 +
OPIN1 –
OPOUT1
11
12
13
14
10
PowVcc1
VO2 (–)
VO2 (+)
VO1 (–)
VO1 (+)
OPIN3 +
OPIN3 –
OPOUT3
GND
STBY2
PreVcc
OPIN4 +
OPIN4 –
OPOUT4
PowVcc2
VO3 (–)
VO3 (+)
VO4 (–)
VO4 (+)
Vcc
STAND BY
CH1 2 3
Level
Shift
Level
Shift Level
Shift
Vcc
STAND BY
CH4
Vcc
Level
Shift
27
26
28
24
23
22
21
20
25
18
17
16
15
19
10k
10k
10k
10k
10k
10k 10k 10k
10k
10k
10k
10k
10k
10k
20k
10k
10k
10k
10k
10k 10k
10k
10k 10k
IC102 BA5982FP-E2 (BD (CD) BOARD)
CE
RFDC
ADIO
IGEN
ASYO
ASYI
RFAC
CLTV
FILO
FILI
PCO
BIAS
VCTL
V16M
VPCO
TE
ASYE
MD2
DOUT
LRCK
PCMD
BCK
EMPH
XTSL
XTAI
XTAO
SOUT
SOCK
XOLT
SQSO
SQCK
SCSY
SBSO
EXCK
XRST
MUTE
DATA
XLAT
CLOK
SENS
SCLK
ATSK
WFCK
XUGF
XPCK
GFS
C2PO
SCOR
CAM
WDCK
COUT
MIRR
SE
FE
VC
TES1
TEST
FFDR
TRDR
TFDR
SRDR
SFDR
FSTO
SSTP
LOCK
PWMI
FOK
FRDR
MDP
DFCT
CLOCK
GENERATOR
ASYMMETRY
CORRECTOR
DIGITAL
PLL
CPU
INTERFACE
INTERFACE
CORRECTOR
PROCESSOR
SUB CODE
RAM
32K
DEMODURATOR
EFM
ERROR
D/A
DIGITAL
OUT
INTERFACE
SERVO
INTERFACE
SERVO
AUTO
MIRR
DFCT
FOK
SERVO
FOCUS
SERVO DSP
SERVO
SERVO
SLED
TRACKING
FOCUS PWM
GENERATOR
GENERATOR
GENERATOR
SLED PWM
TRACKING PWM
A/D
CONVERTER
OPAMP
ANALOG SW
PWM GENERATOR
DIGITAL
CLV
SERVO BLOCK
IC101 CXD3068Q (BD (CD) BOARD)
22
23
24
25
26
27
28
29
30
31
33
34
35
36
37
38
39
40
41
42
21
20 CPU
INTERFACE
+
–
+
–
+
–
+
–
+
–
+
–
+
–
+
–
32
18
19
17
16
15
14
13
12
10
9
8
7
6
5
4
3
2
1
+
–
+
–
+
–
+
–
+
–
+
–
11
BB
AMP2
BB
AMP1
FIN
AMP2
FIN
AMP1
TONE
AMP2
TONE
AMP1
BASS
AMP2
BASS
AMP1
MIX
AMP2
MIX
AMP1
BUFF
AMP2
BUFF
AMP1
MIC
AMP
VREF
AGND
AVDD
A
AB
B
BASS BOOST SW
BASS BOOST SW
SURROUND SW
CLK
DVDD
AVDD
OUT2
INBB2
NFBB2
FBB2
VOL IN2
TONE OUT2
FTRE2
NFBAS2
INBAS2
REC OUT2
IN2D
IN2C
IN2B
IN2A
MIC IN
VREFO
AGND
FBAS2
DATA
LATCH
OUT1
DGND
INBB1
NFBB1
FBB1
VOL IN1
TONE OUT1
FTRE1
NFBAS1
INBAS1
REC OUT1
IN1D
IN1C
IN1B
IN1A
SUR C
SUR R
VREFI
FBAS1
REF AMP
IC301 M62428AFP600C (AUDIO BOARD)
65
HCD-C5
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
GND
VG
IN4R
IN4F
VM4
OUT4F
PGND4
OUT4R
VM34
OUT3R
PGND3
OUT3F
VM3
IN3F
IN3R
PSB
CAPA–
CAPA+
IN2R
IN2F
VM2
OUT2F
PGND2
OUT2R
VM12
OUT1R
PGND1
OUT1F
VM1
IN1F
IN1R
VDD
CHARGE
PUMP.
OSC
INTERFACE AMP
INTERFACE AMP
AMP
INTERFACE
PREDRIVEPREDRIVE
PREDRIVEPREDRIVE
AMP
INTERFACE
AMPAMPAMP
VDD
PSB
AMP
IC141 BH6519FS-E2 (BD (MD) BOARD)
1 2 3 4 5 6 7 8 9
CONTROL LOGIC
TSD
VREF
OUT2
OUT1
RNF
VM
VCC
FIN
GND
RIN
IC1102 BA6956AN (BD (CD) BOARD)
IC871 BA6956AN (MD DIGITAL BOARD)
3
2
1
15
16
VINR
4VREF (N)
5VREF (P)
6SFOR
7PWON
8SYSCLK
VREF
VINL
VSSA
14 FSEL
13 DATAO
12 WS
11 BCK
10 VSSD
9 VDDD
VDDA
+
–
+
–
ADC
( )
ADC
( )
DECIMATION
FILTER
DIGITAL
INTERFACE
DC-
CANCELLATION
FILTER
CLOCK
CONTROL
IC201 µDA1360TS (MD DIGITAL BOARD)
66
HCD-C5
3
2
1
32
33
VSSD
4VSSD (C)
5L3DATA
6L3CLOCK
7DATAI
8BCKI
9WSI
10L3MODE
11NC
VDDD (C)
RESET
VDDA (PLL)
31 VSSA (PLL)
27 VDDA
26 VSSA
25 VSSA (DAC)
24 VREF
23
12
TC
BCKO
29
30
CLKOUT
28 NC
PREEM1
MUTE
44
RTCB
43
VDDD
42
PREEM0
41
NC
40
NC
37
WSO
36
DATAO
39
TEST2
38
NC
35
SELSTATIC
34
TEST1
13
SELCHAN
14
NC
15
SPDIF0
16
SPDIF1
17
VDDA (DAC)
18
VOUT L
19
SELCLK
20
SELSPDIF
21
LOCK
22
VOUT R
L3
INTERFACE
IEC 958
DECODER
DATA
OUTPUT
INTERFACE CLOCK
AND
TIMING
CIRCUIT
DATA
INPUT
INTERFACE
AUDIO FEATURE PROCESSOR
INTERPOLATOR
NOISE SHAPER
DAC DAC
IC211 µDA1350AH (MD DIGITAL BOARD)
12 3 45
+
–
INTERRUPT SIGNAL
GENERATING BLOCK
RESET SIGNAL
GENERATING BLOCK
+
–
GND INT RESET CD VCC
COM
COM
IC861 M62016L (MD DIGITAL BOARD)
67
HCD-C5
INDICATION
CODE
RESISTOR
(8BIT x 16)
DECODER
(35BIT x 16)
DECODER
(35BIT x 16)
CODE/COMMAND
CONTROL
CIRCUIT
INDICATION
CONTROL
RESISTOR
INDICATION
CONTROLLER
DIGITAL
OUTPUT
CIRCUIT
CODE
WRITE
SERIAL
RECEIVE
CIRCUIT
OUTPUT
PORT
(2BIT)
CLOCK
GENERATOR
CIRCUIT
RAM WRITE
CODE SELECT
DIG12
|
DIG15
V
CC
2
SEG0
|
SEG26
V
SS
XIN
XOUT
V
CC
1
RES
DIG11
|
DIG0
CS
CLK
DATA
SEG35
|
SEG27
P1
P0
14
15
16
17
18
19
20
21
22
23
|
31
13
1
|
12
SEGMENT OUTPUT CIRCUIT
59
|
33
60
32
VP
64
|
61
IC601 M66004M8FP-200D (PANEL BOARD)
1234
8765
N.C.
LX
SX
GND
Vcc
LY
SY
N.C.
Buffer
Buffer
IC212 BA8274F-E2 (UCOM BOARD)
68
HCD-C5
6-21. IC PIN FUNCTION DESCRIPTION
•IC101 CXA2523AR (RF AMP, FOCUS/TRACKING ERROR AMP) (BD (MD) BOARD)
I/OPin NamePin No. Description
I
I
O
I
I
—
I
O
I
I
I
I
I
O
I
O
I
I
—
I
O
I
O
O
I
I
O
O
O
O
O
O
O
I
I
O
I
I
O
I
O
I
O
I
J
VC
A to F
PD
APC
APCREF
GND
TEMPI
TEMPR
SWDT
SCLK
XLAT
XSTBY
F0CNT
VREF
EQADJ
3TADJ
VCC
WBLADJ
TE
CSLED
SE
ADFM
ADIN
ADAGC
ADFG
AUX
FE
ABCD
BOTM
PEAK
RF
RFAGC
AGCI
COMPO
COMPP
ADDC
OPO
OPN
RFO
MORFI
MORFO
1
2
3
4 to 9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
I-V converted RF signal I input from the optical pick-up block detector
I-V converted RF signal J input from the optical pick-up block detector
Middle point voltage (+1.65V) generation output terminal
Signal input from the optical pick-up detector
Light amount monitor input from the optical pick-up block laser diode
Laser amplifier output terminal to the automatic power control circuit
Reference voltage input for setting laser power from the CXD2662R (IC151)
Ground terminal
Connected to the temperature sensor
Output terminal for a temperature sensor reference voltage
Writing serial data input from the CXD2662R (IC151)
Serial data transfer clock signal input from the CXD2662R (IC151)
Serial data latch pulse signal input from the CXD2662R (IC151)
Standby signal input terminal “L”: standby (fixed at “H” in this set)
Center frequency control voltage input terminal of internal circuit (BPF22, BPF3T, EQ) input
from the CXD2662R (IC151)
Reference voltage output terminal Not used (open)
Center frequency setting terminal for the internal circuit (EQ)
Center frequency setting terminal for the internal circuit (BPF3T)
Power supply terminal (+3.3V)
Center frequency setting terminal for the internal circuit (BPF22)
Tracking error signal output to the CXD2662R (IC151)
Connected to the external capacitor for low-pass filter of the sled error signal
Sled error signal output to the CXD2662R (IC151)
FM signal output of the ADIP
Receives a ADIP FM signal in AC coupling
Connected to the external capacitor for ADIP AGC
ADIP duplex signal (22.05 kHz ± 1 kHz) output to the CXD2662R (IC151)
Auxiliary signal (I3 signal/temperature signal) output to the CXD2662R (IC151)
Focus error signal output to the CXD2662R (IC151)
Light amount signal (ABCD) output to the CXD2662R (IC151)
Light amount signal (RF/ABCD) bottom hold output to the CXD2662R (IC151)
Light amount signal (RF/ABCD) peak hold output to the CXD2662R (IC151)
Playback EFM RF signal output to the CXD2662R (IC151)
Connected to the external capacitor for RF auto gain control circuit
Receives a RF signal in AC coupling
User comparator output terminal Not used (open)
User comparator input terminal Not used (fixed at “L”)
Connected to the external capacitor for cutting the low band of the ADIP amplifier
User operational amplifier output terminal Not used (open)
User operational amplifier inversion input terminal Not used (fixed at “L”)
RF signal output terminal
Receives a MO RF signal in AC coupling
MO RF signal output terminal
69
HCD-C5
•IC151 CXD2662R
•(DIGITAL SIGNAL PROCESSOR, EFM/ACIRC ENCODER/DECODER, SHOCK PROOF MEMORY CONTROLLER,
ATRAC ENCODER/DECODER) (BD (MD) BOARD)
I/OPin NamePin No. Description
O
O
O
O
I
I (S)
I (S)
O (3)
O (3)
I (S)
O
O
I
O
O
I
O
I
I
I
O
I
I
I
I
O
O
O
O
—
O
O
O
O
—
O
O
O
O
O
MNT0 (FOK)
MNT1 (SHCK)
MNT2 (XBUSY)
MNT3 (SLOC)
SWDT
SCLK
XLAT
SRDT
SENS
XRST
SQSY
DQSY
RECP
XINT
TX
OSCI
OSCO
XTSL
DIN0
DIN1
DOUT
DATI
LRCKI
XBCKI
ADDT
DADT
LRCK
XBCK
FS256
DVDD
A03 to A00
A10
A04 to A08
A11
DVSS
XOE
XCAS
A09
XRAS
XWE
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31 to 34
35
36 to 40
41
42
43
44
45
46
47
Focus OK signal output terminal “H” is output when focus is on (“L”: NG) Not used (open)
Track jump detection signal output to the MD mechanism controller (IC1001)
Busy monitor signal output to the MD mechanism controller (IC1001)
Spindle servo lock status monitor signal output to the MD mechanism controller (IC1001) (open)
Writing serial data signal input from the MD mechanism controller (IC1001)
Serial data transfer clock signal input from the MD mechanism controller (IC1001)
Serial data latch pulse signal input from the MD mechanism controller (IC1001)
Reading serial data signal output to the MD mechanism controller (IC1001)
Internal status (SENSE) output to the MD mechanism controller (IC1001)
Reset signal input from the MD mechanism controller (IC1001) “L”: reset
Subcode Q sync (SCOR) output to the MD mechanism controller (IC1001)
“L” is output every 13.3 msec Almost all, “H” is output
Digital In U-bit CD format subcode Q sync (SCOR) output to the MD mechanism controller
(IC1001) “L” is output every 13.3 msec Almost all, “H” is output
Laser power selection signal input from the MD mechanism controller (IC1001)
“L”: playback mode, “H”: recording mode
Interrupt status output to the MD mechanism controller (IC1001)
Magnetic head on/off signal output to the over write head drive (IC181)
System clock signal (90.3168 MHz) input terminal
System clock signal (512Fs=90.3168 MHz) output terminal Not used (open)
Input terminal for the system clock frequency setting
“L”: 45.1584 MHz, “H”: 90.3168 MHz (fixed at “H” in this set)
Digital audio signal input terminal when recording mode Not used
Digital audio signal input terminal when recording mode
Digital audio signal output terminal when playback mode
Recording data input from the A/D converter (IC1005)
L/R sampling clock signal (44.1 kHz) input from the D/A converter (IC1006), A/D converter
(IC1005)
Bit clock signal (2.8224 MHz) input from the D/A converter (IC1006), A/D converter (IC1005)
Recording data input terminal Not used (fixed at “L”)
Playback data output terminal Not used (open)
L/R sampling clock signal (44.1 kHz) output terminal Not used (open)
Bit clock signal (2.8224 MHz) output terminal Not used (open)
Clock signal (11.2896 MHz) output terminal Not used (open)
Power supply terminal (+3.3V) (digital system)
Address signal output to the D-RAM (IC152)
Address signal output to the D-RAM (IC152) (open)
Address signal output to the D-RAM (IC152)
Address signal output to the external D-RAM Not used (open)
Ground terminal (digital system)
Output enable signal output to the D-RAM (IC152) “L” active
Column address strobe signal output to the D-RAM (IC152) “L” active
Address signal output to the D-RAM (IC152)
Row address strobe signal output to the D-RAM (IC152) “L” active
Write enable signal output to the D-RAM (IC152) “L” active
* I (S) stands for schmitt input, I (A) for analog input, O (3) for 3-state output, and O (A) for analog output in the column I/O.
70
HCD-C5
I/OPin NamePin No. Description
I/O
I/O
I/O
I/O
I (S)
O
I (A)
—
I (A)
I (A)
—
O (3)
I (A)
O (A)
I (A)
I (A)
I (A)
I (A)
I (A)
I (A)
I (A)
O (A)
—
I (A)
I (A)
—
I (A)
I (A)
I (A)
I
I (S)
O
O
O
O
O
O
O
O
—
O
O
O
O
O
O
D1
D0
D2
D3
MVCI
ASYO
ASYI
AVDD
BIAS
RFI
AVSS
PCO
FILI
FILO
CLTV
PEAK
BOTM
ABCD
FE
AUX1
VC
ADIO
AVDD
ADRT
ADRB
AVSS
SE
TE
DCHG
TEST4
ADFG
F0CNT
XLRF
CKRF
DTRF
APCREF
TEST0
TRDR
TFDR
DVDD
FFDR
FRDR
FS4
SRDR
SFDR
SPRD
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
Two-way data bus with the D-RAM (IC152)
Digital in PLL oscillation input from the external VCO Not used (fixed at “L”)
Playback EFM full-swing output terminal
Playback EFM asymmetry comparator voltage input terminal
Power supply terminal (+3.3V) (analog system)
Playback EFM asymmetry circuit constant current input terminal
Playback EFM RF signal input from the CXA2523AR (IC101)
Ground terminal (analog system)
Phase comparison output for master clock of the recording/playback EFM master PLL
Filter input for master clock of the recording/playback master PLL
Filter output for master clock of the recording/playback master PLL
Internal VCO control voltage input of the recording/playback master PLL
Light amount signal (RF/ABCD) peak hold input from the CXA2523AR (IC101)
Light amount signal (RF/ABCD) bottom hold input from the CXA2523AR (IC101)
Light amount signal (ABCD) input from the CXA2523AR (IC101)
Focus error signal input from the CXA2523AR (IC101)
Auxiliary signal (I3 signal/temperature signal) input from the CXA2523AR (IC101)
Middle point voltage (+1.65V) input from the CXA2523AR (IC101)
Monitor output of the A/D converter input signal Not used (open)
Power supply terminal (+3.3V) (analog system)
A/D converter operational range upper limit voltage input terminal (fixed at “H” in this set)
A/D converter operational range lower limit voltage input terminal (fixed at “L” in this set)
Ground terminal (analog system)
Sled error signal input from the CXA2523AR (IC101)
Tracking error signal input from the CXA2523AR (IC101)
Connected to the +3.3V power supply
nput terminal for the test Not used (fixed at “H”)
ADIP duplex FM signal (22.05 kHz ± 1 kHz) input from the CXA2523AR (IC101)
Filter f0 control signal output to the CXA2523AR (IC101)
Serial data latch pulse signal output to the CXA2523AR (IC101)
Serial data transfer clock signal output to the CXA2523AR (IC101)
Writing serial data output to the CXA2523AR (IC101)
Control signal output to the reference voltage generator circuit for the laser automatic power
control
Input terminal for the test Not used (open)
Tracking servo drive PWM signal (–) output to the BH6511FS (IC141)
Tracking servo drive PWM signal (+) output to the BH6511FS (IC141)
Power supply terminal (+3.3V) (digital system)
Focus servo drive PWM signal (+) output to the BH6511FS (IC141)
Focus servo drive PWM signal (–) output to the BH6511FS (IC141)
Clock signal (176.4 kHz) output terminal (X’tal system) Not used (open)
Sled servo drive PWM signal (–) output to the BH6511FS (IC141)
Sled servo drive PWM signal (+) output to the BH6511FS (IC141)
Spindle servo drive PWM signal (–) output to the BH6511FS (IC141)
* I (S) stands for schmitt input, I (A) for analog input, O (3) for 3-state output, and O (A) for analog output in the column I/O.
71
HCD-C5
I/OPin NamePin No. Description
O
I (S)
I
I
I
—
O
SPFD
FGIN
TEST1
TEST2
TEST3
DVSS
EFMO
94
95
96
97
98
99
100
Spindle servo drive PWM signal (+) output to the BH6511FS (IC141)
Input terminal for the test (fixed at “L”)
Ground terminal (digital system)
EFM signal output terminal when recording mode
* I (S) stands for schmitt input, I (A) for analog input, O (3) for 3-state output, and O (A) for analog output in the column I/O.
72
HCD-C5
I/OPin NamePin No. Description
—
—
—
—
—
—
—
I
I
I
O
I
O
—
I
—
I
I
I
I
—
—
O
—
I
—
—
—
I/O
I/O
O
I
O
—
—
—
—
—
—
—
—
I
O
I
O
I
I
(FLDT)
(FLCK)
(LEVEL-L)
(LEVEL-R)
—
BYTE
CNVSS
XIN-T
XOUT-T
S-RST
XOUT
VSS
XIN
VCC
NMI
DQSY
P-DOWN
SQSY
(KB-CLK)
(KB-DATA)
I2C-BUSY
(A1-OUT)
XINT
(BEEP)
(XELT)
(I2C-POWER)
I2C-CLK
I2C-DAT
SWDT
SRDT
SCLK
(KB-CLK-CTL)
(CLIP-TX0)
(CLIP-RX0)
(CLIP-CLK0)
(MUTE)
(ADA-RESET)
(ADA-LATCH)
EPM
(CLIP-SEL)
—
PROTECT
EEP-CLK
CE
EEP-WP
XBUSY(MNT2)
OUT-SW
1
2
3
4
5 to 7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
Not used
Not used
Not used
Not used
Not used
Data bus changed signal input (Connected to ground)
Processor mode selection terminal
Not used
Not used
System reset input
Main clock output (10MHz)
Ground
Main clock input (10MHz)
Power supply
Fixed at H (Pull-up)
Digital in sync signal input (Record system)
Power down detection signal input (L:Power down)
ADIP (MO) sync signal or subcode Q (PIT) sync signal input from the CXD2662R
(Playback system)
Not used
Not used
I2C cable connect check signal output
Not used
Interrupt status signal input from the CXD2662R
Not used
Not used
Not used
I2C serial clock input/output
I2C serial data input/output
Writing data signal output to the serial bus
Reading data signal input from the serial bus
Clock signal output to the serial bus
Not used
Not used
Not used
Not used
Not used
Not used
Not used
Not used (Pull-down)
Not used
Not used
Recording protection tab detection signal input from the protection detection switch (H:Protect)
Clock signal output to the EEP-ROM
Fixed at H (Pull-up)
Write protect signal output to the EEP ROM (L:Write enable)
Busy signal input from the CXD2662R
Detection signal input from the loading out detection switch
•IC701 M30803MG-A03FP MASTER CONTROLLER (MD DIGITAL BOARD)
73
HCD-C5
I/OPin NamePin No. Description
O
I
O
I
O
I
O
O
I
I
I/O
I
—
—
—
O
O
O
—
—
I
I
O
—
O
—
O
O
I
O
O
—
—
—
—
—
I
—
—
—
I
—
—
XLATCH
PLAY-SW
D-RESET
REC—SW
WRPWR
LIMIT—IN
MOD
LDON
SENS
SHOCK(MNT1)
EEP—DATA
REFLECT
VCC
—
VSS
LOAD—LO
LOAD—OUT
LOAD—IN
(MODEL0)
(MODEL1)
MODEL2
MODEL3
SPDIF—CUT
—
DAC—MUTE
LINE—MUTE
DA—RESET
SLICER—SEL
SPDIF—LOCK
OPTSEL
ADPDWN
—
TP1
TP2
TP3
TP4
IOP
—
AVSS
—
VREF
AVCC
—
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73 to 75
76
77
78
79
80
81
82
83 to 84
85
86
87
88
89
90 to 95
96
97
98
99
100
Lacth signal output to the DSP IC
Detection signal input from the playback position detection switch (L:PLAY)
Digital reset signal output to the CXD2662R and the motor driver (L:Reset)
Detection signal input from the recording position detection switch (L:REC)
Write power ON/OFF signal output (L:OFF, H:ON)
Detection signal input from the limit switch (L:Sled limit-in, H:Sled limit-out)
Modulation signal output to the laser diode (L:OFF, H:ON)
Laser ON/OFF control signal output (H:Laser ON)
SENS signal input from the CXD2662R
Track jump signal input from the CXD2662R
Data signal input/output terminal with the EEP-ROM
Disc reflection rate detection input from the reflect detection switch
(H:Disc with low reflection rate)
Power supply (+3.3V)
Not used
Ground
Loading motor voltage control signal output (L:High voltage, H:Low voltage)
Loading motor control signal output (H:Out)
Loading motor control signal output (H:In)
Not used
Not used
Model setting input terminal
Model setting input terminal
Power control signal output for the PLL power supply of the D/A converter
Not used
Muting signal output to the D/A converter
Not used
Reset signal output to the D/A converter (L:Active)
IEC958 input select signal output to the D/A converter
LOCK signal input from the D/A converter
Optical input selection signal output
Power control signal output to the A/D converter
Not used
Not used
Not used
Not used
Not used
Optical pick-up voltage (current) detect signal input
Not used
Ground (Analog)
Not used
Reference voltage input terminal
Power supply (Analog)
Not used
74
HCD-C5
I/OPin NamePin No. Description
O
O
I/O
O
I/O
O
O
O
—
—
O
O
O
I
I
O
O
O
O
O
—
O
O
O
O
O
O
O
O
I
I
I
I
I
I
—
—
—
I
—
—
O
O
O
I
O
O
I
I
I
FL-DATA
FL-CLK
SDA
FL-CE
SCL
FL-RST
CXD-DATA
CXD-CLK
EVDD
EVSS
CXD-XLT
PWM1
LDON
SENSE
SUBQ
CHECK
SCLK
CTRL1
PWM2
PWM3
VPP
SP-MUTE
1-4
DMUTE
AMUTE
LODNEG
LODPOS
BDPWR
BDRST
SW1
SW2
SW3(ENC-A)
SW4(ENC-B)
RESET
XT1
XT2
REGC
X2
X1
VSS
VDD
CLKOUT
PLL-CLK
PLL-DO(µCOM-ST)
PLL-DI(ST-µCOM)
PLL-CE
ST-MUTE
STEREO
TUNED
RDS-DATA
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
FL tube data signal output
FL tube clock signal output
IIC data signal input or output
FL tube enable signal output
IIC clock signal input or output
FL tube reset signal output
Data signal output to DSP
Clock signal output to DSP
Power supply for I/O port
Ground for I/O port
Latch signal output to DSP
PWM1 signal output
Laser power control signal output
CD SENSE signal input
CD SUBQ signal input
Not used (open)
CD SUBQ clock signal output
CTRL1 (setting double speed) signal output
PWM2 signal output
PWM3 signal output
Not used
Not used (open)
Not used (open)
Muting signal output to DAC
Not used (open)
Loading motor control signal output
Loading motor control signal output
CD power control signal output
CD reset signal output
Loading switch signal input
Loading switch signal input
Loading switch signal input
Loading switch signal input
Systen reset input
Sub clock input
Sub clock output
Terminal for regulator clock
Main system clock output
Main system clock input
Ground
Power supply
Clock output (open)
Tuner clock signal output
Tuner data signal output
Tuner data signal input
Tuner chip enable signal output
Tuner muting signal output
Stereo tuning signal input
TUNED detect signal input
RDS data signal input
•IC501 µPD703032AYGF-M01-3BA MASTER CONTROL (UCOM BOARD)
75
HCD-C5
I/OPin NamePin No. Description
I
O
O
O
O
O
I/O
—
—
I
I
O
O
O
O
O
I
O
O
O
O
O
O
—
—
—
I
I
I
I
I
I
I
I
I
I
I
I
O
I
I
I
I
I
I
I
—
—
—
—
PROTECT
PRE-MUTE
PWR-MUTE
REC-MUTE
HP-MUTE
SPK-RELAY
HELP
BVDD
BVSS
KBD-CHK
KBD-DATA
VOL-CE
VOL-CLK
VOL-DATA
LED
FAN-ON
HP-IN
IO-RST
PWR-RELAY
MD-PWR
FL-ON
ON/STANDBY
DIMMER
AVDD
AVSS
AVREF
KEY1
KEY2
KEY3
ADJ
DEST1
DEST2
DEST3
DEST4
MODEL1
MODEL2
DEVICE1
DEVICE2
KBD-CLKO
KBD-CLKI
AC-CUT
PCPON
KEY-RM
SIRCS
SCOR
RDS-CLK
IO-DI
IO-DO
IO-CLK
IO-CE
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
Not used (pull-up)
Pre-amplifier muting signal output
Not used (open)
REC output muting signal output
Not used (open)
Speaker relay control signal output
IIC busy signal input or output
Power supply for bus interface
Ground for bus interface
PC LINK inserted detect signal input
Key board data input (pull-up)
Volume latch signal output to the sound processor
Volume clock signal output to the sound processor
Volume data signal output to the sound processor
LED control signal output
Not used (open)
Headphone detect signal input (pull-down)
Not used (open)
Power relay control signal output
MD power control signal output
Not used (open)
STANDBY LED control signal output
Not used (open)
Analog power supply
Analog ground
Analog reference voltage
Key input signal from function switch
Key input signal from function switch
Key input signal from function switch
Adjust mode input (pull-up)
Destination setting input
Destination setting input
Destination setting input
Destination setting input
Model setting input
Model setting input
Device setting input
Device setting input
Keyboard clock output (pull-up)
Keyboard clock input (pull-up)
AC off detect signal input
PC power detect signal input for PC LINK
Remote control receiver or power key detect signal input
Remote control receiver data signal input
CD Q-data request signal input
RDS clock signal input
Not used (open)
Not used (open)
Not used (open)
Not used (open)
NOTE:
• -XX, -X mean standardized parts, so they may
have some differences from the original one.
• Items marked “*” are not stocked since they
are seldom required for routine service. Some
delay should be anticipated when ordering these
items.
• The mechanical parts with no reference number
in the exploded views are not supplied.
• Hardware (# mark) list and accessories and
packing materials are given in the last of this
parts list.
• Abbreviation
AUS : Australian model
HK : Hong Kong model
KR : Korean model
SECTION 7
EXPLODED VIEWS
76
HCD-C5
The components identified by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specified.
1 1-757-791-11 WIRE (FLAT TYPE) (16 CORE)
2 4-233-859-01 CASE
3 4-886-865-01 CUSHION (A)
4 A-4476-934-A BD BOARD, COMPLETE
5 4-235-553-01 SPACER (A)
6 1-773-289-11 WIRE (FLAT TYPE) (29 CORE)
7-1. OVERALL SECTION
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
7 7-685-903-21 SCREW +PTPWH 3X8 (TYPE2)
8 1-681-712-11 HP BOARD
9 4-233-862-11 COVER, REAR (AEP,UK,KR)
9 4-233-862-21 COVER, REAR (AUS,HK)
10 1-681-381-11 JACK BOARD
∗11 4-930-336-71 FOOT (FELT)
chassis section
front panel section
b
a
a
b
not supplied
TM-CCD1001Z
not supplied
#1
#1
#1
#1
#1
#1
#4
#3
#5
#
7
#6
#7
#8
#1
#1
#1
#2
#2
#1
1
23
4
11
5
6
8
7
9
10
11
c
c
Ver 1.1 2001.09
77
HCD-C5
7-2. FRONT PANEL SECTION
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
51 X-4953-691-1 PANEL ASSY (B), FRONT
52 4-942-636-01 EMBLEM (NO.3.5), SONY
53 4-233-846-01 ESCUTCHEON (MD)
54 4-233-847-01 ESCUTCHEON (CD)
55 4-233-840-01 PANEL, FRONT
56 A-4476-936-A PANEL BOARD, COMPLETE
57 4-228-323-01 SPRING (MD)
58 4-228-335-11 LID (MD)
not supplied
not supplied
not supplied
not supplied
#9
#9
#9
#10
51
53 52
54
55
56
58
57
78
HCD-C5
7-3. CHASSIS SECTION-1
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
101 A-4476-947-A UCOM BOARD, COMPLETE (AEP,UK)
101 A-4727-413-A UCOM BOARD, COMPLETE (AUS, HK.KR)
102 1-681-380-11 AMP POWER BOARD
103 3-703-244-00 BUSHING (2104), CORD
0104 1-696-847-11 CORD, POWER (AUS)
0104 1-769-079-21 CORD, POWER (KR)
0104 1-777-071-21 CORD, POWER (AEP,UK,HK)
105 1-769-943-11 WIRE (FLAT TYPE) (11CORE) (AUS, HK.KR)
105 1-773-007-11 WIRE (FLAT TYPE) (15 CORE) (AEP,UK)
106 1-693-529-11 TUNER PACK (FM/AM) (AEP,UK)
106 1-693-531-11 TUNER PACK (FM/AM) (AUS,HK)
106 1-693-536-11 TUNER PACK (FM/AM) (KR)
107 A-4476-948-A POWER BOARD, COMPLETE (AEP,UK,AUS)
107 A-4727-414-A POWER BOARD, COMPLETE (HK,KR)
108 1-773-110-11 WIRE (FLAT TYPE) (19 CORE)
109 A-4476-938-A AUDIO BOARD, COMPLETE (AUS,HK,KR)
109 A-4476-949-A AUDIO BOARD, COMPLETE (AEP,UK)
110 3-701-748-00 CLAMP
111 4-812-134-31 RIVET (DIA. 3.5), NYLON
112 4-234-235-01 INSULATED PLATE (POWER)
113 4-937-971-01 CUSHION
114 4-237-035-01 INSULATED PLATE (POWER) 2
M901 1-698-997-11 FAN, D.C.
0T900 1-437-239-11 TRANSFORMER, POWER (AEP,UK,AUS)
0T900 1-437-241-11 TRANSFORMER, POWER (HK,KR)
d
d
#1
#1
#7
#1
#1
T900
M901
101
102
103
112
111
104
105
106
107
108
109
110
113
not
supplied
114
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
Ver 1.1 2001.09
79
HCD-C5
7-4. CHASSIS SECTION-2
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
151 4-231-555-01 INSULATOR
152 4-228-643-21 SCREW (+BVTTWH M3), STEP
154 1-773-138-11 WIRE (FLAT TYPE) (19 CORE)
155 A-4725-732-A MD DIGITAL BOARD, COMPLETE
156 1-757-079-11 WIRE (FLAT TYPE) (17 CORE)
157 1-757-080-11 WIRE (FLAT TYPE) (27 CORE)
158 4-231-113-01 SCREW (1.7X3), BTN
not supplied
not supplie
d
not
supplied
not
supplied
MDM-7B4M
#1
#1
#1
152
151
154
158
155
156
157
80
HCD-C5
7-5. CD MECHANISM DECK SECTION (TN-CCD1001Z)
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
401 4-236-062-01 PIN, DAMPER
402 4-236-087-01 SPRING (FZ), HANG UP
403 4-236-114-01 BELT, LOADING
404 4-236-088-01 SPRING (R), HANG UP
405 4-236-101-01 DAMPER (J)
406 1-682-100-11 CONNECTOR BOARD
407 4-236-105-01 HOLDER, FPC
408 1-682-101-11 PICK-UP FLEXIBLE BOARD
409 1-815-750-11 CONNECTOR
M902 X-4954-023-1 MOTOR ASSY, LOADING
#11
#12
#12
#14
#11
#11
#11
M902
#13
not
supplied
not
supplied
not
supplied
401
402
402
401
403
404
404
405
406
407
408
409
front bracket
section
base section
chassis section
a
a
81
HCD-C5
7-6. CD MECHANISM DECK SECTI – FRONT BRACKET SECTION (TN-CCD1001Z)
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
451 4-236-112-01 SPRING (R), LOADING PULLEY
452 4-236-115-01 BRACKET (J), FRONT
453 4-236-111-01 SPRING (L), LOADING PULLEY
454 4-236-106-01 BRACKET, GEAR MOUNT
455 4-236-108-01 GEAR (3), LOADING
456 4-236-107-01 GEAR (2), LOADING
457 4-236-118-01 WASHER (117)
458 4-236-116-01 WASHER (113)
459 4-236-110-01 ROLLER, LOADING
460 X-4954-024-1 SHAFT ASSY, LOADING ROLLER
461 4-236-117-01 WASHER, WAVE
462 4-236-109-01 GEAR (5), LOADING
#11
not
supplied
not supplied
not supplied
not
supplied
451
452
453
454 455
456
457
458
458
459
460
461
462
not supplied
82
HCD-C5
7-7. CD MECHANISM DECK SECTION – BASE SECTION (TN-CCD1001Z)
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
501 X-4954-022-1 SCREW ASSY, FEED
502 4-236-104-01 SPRING, PULLEY GUIDE
0503 1-758-631-11 OPTICAL PICK-UP BLOCK (OPTIMA-720L1E)
504 4-236-092-01 GUIDE, PULLEY
505 4-236-094-01 PULLEY (M)
506 4-236-095-01 SPRING, DETENT
507 4-236-101-01 DAMPER (J)
508 X-4954-025-1 BASE ASSY, TT
509 4-236-097-01 CLAMP
510 4-236-100-01 PLATE, CLAMP
511 4-236-099-01 RETAINER, 8CM STOPPER
512 4-236-102-01 SPRING (L), CLIP ARM
513 4-236-098-01 STOPPER, 8CM
514 4-236-096-01 SPRING, CLIP ARM
515 4-236-103-01 GUIDE, SCREW
516 4-236-090-01 BASE, FM
517 4-236-091-01 BRACKET, FD GEAR
518 4-236-093-01 SPRING, THRUST
519 4-236-089-01 GEAR, PULLEY
S5 1-786-212-11 SWITCH (DETECTION) (LIMIT IN)
M903 X-4954-020-1 MOTOR ASSY, FEED
M904 X-4954-021-1 MOTOR ASSY, SPINDLE
#15
#19
#17
#17
#17
#17
#16
#13
#18
#20
M903
M904
not supplied
not
supplied
not supplied
S5
501
502
503
505
506
507
507 508
509
510 511
512
514
515
516
513
504
517
518
519
e
e
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
83
HCD-C5
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
551 4-236-085-01 ARM, SLIDE
552 4-236-086-01 SPRING, SLIDE ARM
553 4-236-073-01 ARM (R), S
554 4-236-074-01 SPRING, S ARM
555 4-236-064-01 HOLDER, S ARM
556 4-236-063-01 HOLDER, UPPER
557 4-236-113-01 ACTUATOR, SWITCH
558 1-682-099-11 SW BOARD
559 4-236-065-01 ARM (L), S
560 4-236-080-01 ARM (R), HOLDER
561 4-236-082-01 HOLDER (R)
562 4-236-084-01 SPRING, LOADING GEAR
563 4-236-083-01 GEAR (6), LOADING
564 4-236-081-01 HOLDER (L)
565 4-236-079-01 ARM (L), HOLDER
566 4-236-077-01 SPRING, TRIGGER
567 4-236-076-01 TRIGGER (Z)
568 4-236-078-01 ARM, TRIGGER
569 4-236-075-01 LEVER, TRIGGER
S1 1-786-214-11 SWITCH (DETECTION)
(Disc IN/8cm Disc detect)
S2 1-786-213-11 SWITCH (DETECTION)
(12cm Disc/12cm Disc Eject End detect)
S3 1-786-213-11 SWITCH (DETECTION)
(Disc Existence, Chucking, Releasing detect)
S4 1-786-214-11 SWITCH (DETECTION) (8cm Disc Eject detect)
7-8. CD MECHANISM DECK SECTION – CHASSIS SECTION (TN-CCD1001Z)
#11
S3
S1
S4
S2
not
supplied
551
552
553
554
555
556
557
559
560
561
562
563
564
565
554
558
566
567
568
569
84
HCD-C5
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
∗701 4-996-267-01 BASE (BU-D)
702 4-231-319-01 SCREW (2X6) CZN, +B (P) TRI
703 4-226-994-01 GUIDE (L)
704 A-4735-075-A HOLDER ASSY
705 X-4952-665-1 SPRING (SHT) ASSY, LEAF
706 4-227-002-01 GEAR, PULLEY
707 3-372-761-01 SCREW (M1.7), TAPPING
708 4-2270-250-1 BELT (LOADING)
710 4-229-533-01 SPRING (STOPPER), TORSION
711 4-227-012-01 SPRING (HOLDER), TENSION
713 4-226-995-01 SLIDER (EJ)
714 4-227-013-01 SPRING (EJ), TENSION
715 4-226-996-01 LIMITTER (EJ)
716 4-226-997-04 SLIDER
717 4-226-998-01 LEVER (CHG)
718 4-227-007-01 GEAR (SB)
719 4-227-006-01 GEAR (SA)
720 4-226-999-01 LEVER (HEAD)
721 A-4680-638-B PLATE (HOLDER) ASSY, RETAINER
7-9. MD MECHANISM DECK SECTION-1 (MDM-7B4M)
708
707
706
702
701
720
707
702
711
710
not
supplied
713
714
715
716
719
718
717
705
703
704
not supplied
#21
not supplied
not supplied
721
85
HCD-C5
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
751 4-231-319-01 SCREW (2X6) CZN, +B (P) TRI
752 3-372-761-01 SCREW (M1.7), TAPPING
753 4-227-008-01 GEAR (SC)
754 4-227-009-01 GEAR (SD)
755 4-226-989-01 CHASSIS
756 4-232-270-01 SCREW (1.7X3.5), +PWH
757 4-226-993-01 RACK
758 4-227-014-01 SPRING (RACK), COMPRESSION
759 1-678-514-11 FLEXIBLE BOARD
0760 A-4672-541-A MINI DISK OPTICAL PICK-UP (KMS-260B)
761 4-988-560-01 SCREW (+P 1.7X6)
762 4-996-265-01 SHAFT, MAIN
763 4-226-992-01 BASE, SL
764 4-227-023-01 SPRING (SPINDLE), TORSION
765 4-227-004-01 GEAR (LC)
766 4-227-005-01 GEAR (LD)
767 4-226-990-01 BASE (BU-A)
768 A-4726-344-A BD (MD) BOARD, COMPLETE
HR901 1-500-670-11 HEAD, OVER WRITE
M701 A-4672-898-A MOTOR ASSY, SPINDLE
M702 A-4735-076-A MOTOR ASSY, SLED
M703 A-4735-074-A MOTOR ASSY, LOADING
S102 1-771-957-11 SWITCH, PUSH (2 KEY) (REFLECT→PROTECT)
7-10. MD MECHANISM DECK SECTION-2 – (MDM-7B4M)
761
760
759
758
757
763
762
761
756
751
752
753 754
752
751
768
767
751
752
756
HR901
S102
M701
M703
M702
#22
#22
752
755
764 765
766
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
NOTE:
• Due to standardization, replacements in the
parts list may be different from the parts
specified in the diagrams or the components
used on the set.
• -XX, -X mean standardized parts, so they
may have some difference from the original
one.
• Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.
• CAPACITORS:
uF: µF
• RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable
• COILS
uH: µH
• SEMICONDUCTORS
In each case, u: µ, for example:
uA...: µA... , uPA... , µPA... ,
uPB... , µPB... , uPC... , µPC... ,
uPD..., µPD...
When indicating parts by reference number,
please include the board name.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
86
SECTION 8
ELECTRICAL PARTS LIST
HCD-C5
The components identified by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specified.
• Abbreviation
AUS : Australian model
HK : Hong Kong model
KR : Korean model
1-681-380-11 AMP POWER BOARD
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
< CAPACITOR >
C851 1-136-165-00 FILM 0.1uF 5.00% 50V
C852 1-136-165-00 FILM 0.1uF 5.00% 50V
C853 1-128-549-11 ELECT 3300uF 20.00% 35V
C854 1-128-549-11 ELECT 3300uF 20.00% 35V
< CONNECTOR >
CN851 1-564-506-11 PLUG, CONNECTOR 3P
CN852 1-779-939-11 CONNECTOR, BOARD TO BOARD 7P
< DIODE >
D851 8-719-028-23 DIODE D3SBA20-4101
< FUSE >
0F851 1-533-471-11 FUSE, GLASS TUBE (DIA. 5) T4AL/250V
0F852 1-533-471-11 FUSE, GLASS TUBE (DIA. 5) T4AL/250V
< FUSE HOLDER >
FH851 1-533-293-11 FUSE HOLDER
FH852 1-533-293-11 FUSE HOLDER
FH853 1-533-293-11 FUSE HOLDER
FH854 1-533-293-11 FUSE HOLDER
< RESISTOR >
R851 1-260-107-11 CARBON 4.7K 5% 1/2W
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
A-4476-938-A AUDIO BOARD, COMPLETE (AUS,HK,KR)
A-4476-949-A AUDIO BOARD, COMPLETE (AEP,UK)
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
< CAPACITOR >
C102 1-162-962-11 CERAMIC CHIP 470PF 10% 50V
C111 1-124-227-00 ELECT 10uF 20% 10V
(AEP,UK)
C121 1-164-156-00 CERAMIC CHIP 0.1 25V
C152 1-162-962-11 CERAMIC CHIP 470PF 10% 50V
C301 1-124-257-00 ELECT 2.2uF 20% 50V
C302 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C303 1-124-257-00 ELECT 2.2uF 20% 50V
C304 1-162-965-11 CERAMIC CHIP 0.0015uF 10% 50V
C305 1-124-257-00 ELECT 2.2uF 20% 50V
C309 1-124-261-00 ELECT 10uF 20% 50V
C310 1-124-261-00 ELECT 10uF 20% 50V
C311 1-124-261-00 ELECT 10uF 20% 50V
C312 1-136-165-00 FILM 0.1uF 5.00% 50V
C313 1-124-464-11 ELECT 0.22uF 20% 50V
C314 1-137-365-11 MYLAR 0.0015uF 5.00% 50V
C315 1-124-261-00 ELECT 10uF 20% 50V
C316 1-136-165-00 FILM 0.1uF 5.00% 50V
C317 1-136-165-00 FILM 0.1uF 5.00% 50V
C321 1-124-261-00 ELECT 10uF 20% 50V
C322 1-124-261-00 ELECT 10uF 20% 50V
C323 1-124-261-00 ELECT 10uF 20% 50V
C324 1-128-057-11 ELECT 330uF 20.00% 6.3V
C325 1-137-367-11 MYLAR 0.0033uF 5.00% 50V
C326 1-162-960-11 CERAMIC CHIP 220PF 10% 50V
C331 1-124-257-00 ELECT 2.2uF 20% 50V
C332 1-119-772-11 ELECT 47uF 20% 25V
C333 1-119-772-11 ELECT 47uF 20% 25V
C334 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C335 1-119-772-11 ELECT MELF 47uF 20.00% 35V
C336 1-124-257-00 ELECT 2.2uF 20% 50V
C344 1-124-465-00 ELECT 0.47uF 20% 50V
C351 1-124-257-00 ELECT 2.2uF 20% 50V
C352 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C353 1-124-257-00 ELECT 2.2uF 20% 50V
C354 1-162-965-11 CERAMIC CHIP 0.0015uF 10% 50V
C355 1-124-257-00 ELECT 2.2uF 20% 50V
C359 1-124-261-00 ELECT 10uF 20% 50V
C360 1-124-261-00 ELECT 10uF 20% 50V
C361 1-124-261-00 ELECT 10uF 20% 50V
C362 1-136-165-00 FILM 0.1uF 5.00% 50V
C363 1-124-464-11 ELECT 0.22uF 20% 50V
C364 1-137-365-11 MYLAR 0.0015uF 5.00% 50V
C365 1-124-261-00 ELECT 10uF 20% 50V
C366 1-136-165-00 FILM 0.1uF 5.00% 50V
C367 1-136-165-00 FILM 0.1uF 5.00% 50V
C381 1-124-257-00 ELECT 2.2uF 20% 50V
C382 1-119-772-11 ELECT 47uF 20% 25V
C383 1-119-772-11 ELECT 47uF 20% 25V
C384 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
< CONNECTOR >
CN101 1-784-780-11 CONNECTOR, FFC 19P
∗CN102 1-568-936-11 PIN, CONNECTOR 9P
CN103 1-778-240-11 CONNECTOR, BOARD TO BOARD 5P
CN104 1-568-830-11 CONNECTOR, FFC 11P (AUS,HK,KR)
CN104 1-784-776-11 CONNECTOR, FFC 15P (AEP,UK)
AMP AUDIO
Ver 1.1 2001.09
87
HCD-C5
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
CN105 1-564-506-11 PLUG, CONNECTOR 3P
∗CN106 1-568-934-11 PIN, CONNECTOR 7P
∗CN108 1-568-943-11 PIN, CONNECTOR 5P
< DIODE >
D101 8-719-200-82 DIODE 11ES2-TA1B
D103 8-719-988-61 DIODE 1SS355TE-17
D111 8-719-923-34 DIODE MTZJ-T-77-5.1B (AEP,UK)
D301 8-719-988-61 DIODE 1SS355TE-17
D343 8-719-988-61 DIODE 1SS355TE-17
D393 8-719-988-61 DIODE 1SS355TE-17
< TERMINAL >
EPT102 1-537-771-21 TERMINAL BOARD, GROUND
< IC >
IC301 8-759-494-40 IC M62428AFP600C
IC302 8-759-167-88 IC NJM4565D (AEP,UK)
< CONDUCTOR >
JR303 1-216-864-11 METAL CHIP 0 5% 1/16W
JR304 1-216-864-11 METAL CHIP 0 5% 1/16W
JR305 1-216-864-11 METAL CHIP 0 5% 1/16W
JR306 1-216-864-11 METAL CHIP 0 5% 1/16W
< TRANSISTOR >
Q101 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6
Q102 8-729-424-08 TRANSISTOR UN2111-TX
Q103 8-729-120-28 TRANSISTOR 2SC3052EF-T1-LEF
Q151 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6
Q311 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6
Q331 8-729-046-97 TRANSISTOR 2SD1938(F)-T(TX).SO
Q361 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6
Q381 8-729-046-97 TRANSISTOR 2SD1938(F)-T(TX).SO
< RESISTOR >
R102 1-216-821-11 METAL CHIP 1K 5% 1/16W
R103 1-216-833-11 METAL CHIP 10K 5% 1/16W
R104 1-216-821-11 METAL CHIP 1K 5% 1/16W
R105 1-216-845-11 METAL CHIP 100K 5% 1/16W
R111 1-247-819-11 CARBON 330 5% 1/4W
(AEP,UK)
R112 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R152 1-216-821-11 METAL CHIP 1K 5% 1/16W
R153 1-216-833-11 METAL CHIP 10K 5% 1/16W
R154 1-216-821-11 METAL CHIP 1K 5% 1/16W
R155 1-216-845-11 METAL CHIP 100K 5% 1/16W
R302 1-216-821-11 METAL CHIP 1K 5% 1/16W
R303 1-216-845-11 METAL CHIP 100K 5% 1/16W
R304 1-216-821-11 METAL CHIP 1K 5% 1/16W
R309 1-216-845-11 METAL CHIP 100K 5% 1/16W
R312 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R313 1-218-296-11 RES-CHIP 75K 5% 1/16W
R314 1-216-839-11 METAL CHIP 33K 5% 1/16W
R315 1-216-857-11 METAL CHIP 1M 5% 1/16W
R316 1-249-441-11 CARBON 100K 5% 1/4W
R317 1-216-837-11 METAL CHIP 22K 5% 1/16W
R321 1-216-839-11 METAL CHIP 33K 5% 1/16W
R322 1-216-857-11 METAL CHIP 1M 5% 1/16W
R323 1-216-821-11 METAL CHIP 1K 5% 1/16W
R324 1-216-821-11 METAL CHIP 1K 5% 1/16W
R325 1-216-821-11 METAL CHIP 1K 5% 1/16W
R326 1-216-831-11 METAL CHIP 6.8K 5% 1/16W
R327 1-249-433-11 CARBON 22K 5% 1/4W
R331 1-216-821-11 METAL CHIP 1K 5% 1/16W
R332 1-216-833-11 METAL CHIP 10K 5% 1/16W
R333 1-216-833-11 METAL CHIP 10K 5% 1/16W
R334 1-216-821-11 METAL CHIP 1K 5% 1/16W
R335 1-216-835-11 METAL CHIP 15K 5% 1/16W
R336 1-216-833-11 METAL CHIP 10K 5% 1/16W
R338 1-216-845-11 METAL CHIP 100K 5% 1/16W
0R339 1-249-405-11 CARBON 100 5% 1/4WF
R340 1-216-845-11 METAL CHIP 100K 5% 1/16W
R341 1-216-845-11 METAL CHIP 100K 5% 1/16W
R343 1-216-845-11 METAL CHIP 100K 5% 1/16W
R344 1-247-903-00 CARBON 1M 5% 1/4W
R352 1-216-821-11 METAL CHIP 1K 5% 1/16W
R353 1-216-845-11 METAL CHIP 100K 5% 1/16W
R354 1-216-821-11 METAL CHIP 1K 5% 1/16W
R359 1-216-845-11 METAL CHIP 100K 5% 1/16W
R362 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R363 1-218-296-11 RES-CHIP 75K 5% 1/16W
R364 1-216-839-11 METAL CHIP 33K 5% 1/16W
R365 1-216-857-11 METAL CHIP 1M 5% 1/16W
R366 1-249-441-11 CARBON 100K 5% 1/4W
R367 1-216-837-11 METAL CHIP 22K 5% 1/16W
R381 1-216-821-11 METAL CHIP 1K 5% 1/16W
R382 1-216-833-11 METAL CHIP 10K 5% 1/16W
R383 1-216-833-11 METAL CHIP 10K 5% 1/16W
R384 1-216-821-11 METAL CHIP 1K 5% 1/16W
R385 1-216-835-11 METAL CHIP 15K 5% 1/16W
R386 1-216-833-11 METAL CHIP 10K 5% 1/16W
R388 1-216-845-11 METAL CHIP 100K 5% 1/16W
R393 1-216-845-11 METAL CHIP 100K 5% 1/16W
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
A-4476-934-A BD (CD) BOARD, COMPLETE
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
7-685-852-04 SCREW +BVTT 2X5 (S)
< CAPACITOR >
C101 1-164-315-11 CERAMIC CHIP 470PF 5.00% 50V
C102 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C103 1-164-315-11 CERAMIC CHIP 470PF 5.00% 50V
C104 1-162-967-11 CERAMIC CHIP 0.0033uF 10% 50V
C107 1-162-921-11 CERAMIC CHIP 33PF 5% 50V
C108 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C109 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C110 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C111 1-124-589-11 ELECT 47uF 20% 16V
C112 1-124-589-11 ELECT 47uF 20% 16V
AUDIO BD (CD)
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
Ver 1.1 2001.09
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
88
HCD-C5
C113 1-124-584-00 ELECT 100uF 20% 10V
C114 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C115 1-124-589-11 ELECT 47uF 20% 16V
C117 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C118 1-115-156-11 CERAMIC CHIP 1uF 10V
C119 1-115-156-11 CERAMIC CHIP 1uF 10V
C120 1-126-513-11 ELECT 47uF 20.00% 6.3V
C154 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C159 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V
C161 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C162 1-162-974-11 CERAMIC CHIP 0.01uF 50V
C164 1-128-499-11 ELECT 220uF 20.00% 16V
C180 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C181 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C182 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C183 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C184 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V
C185 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V
C186 1-126-934-11 ELECT 220uF 20.00% 10V
C187 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C188 1-162-974-11 CERAMIC CHIP 0.01uF 50V
C191 1-165-176-11 CERAMIC CHIP 0.047uF 10.00% 16V
C192 1-165-176-11 CERAMIC CHIP 0.047uF 10.00% 16V
C193 1-165-176-11 CERAMIC CHIP 0.047uF 10.00% 16V
C194 1-165-176-11 CERAMIC CHIP 0.047uF 10.00% 16V
C201 1-126-934-11 ELECT 220uF 20.00% 10V
C202 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C203 1-162-915-11 CERAMIC CHIP 10PF 0.5PF 50V
C204 1-162-915-11 CERAMIC CHIP 10PF 0.5PF 50V
C205 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C206 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C209 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C211 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C212 1-162-965-11 CERAMIC CHIP 0.0015uF 10% 50V
C213 1-162-967-11 CERAMIC CHIP 0.0033uF 10% 50V
C215 1-117-863-11 CERAMIC CHIP 0.47uF 10.00% 6.3V
C216 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C221 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C222 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C224 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C227 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C228 1-115-156-11 CERAMIC CHIP 1uF 10V
C229 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C230 1-126-382-11 ELECT 100uF 20.00% 6.3V
C231 1-126-934-11 ELECT 220uF 20.00% 10V
C234 1-162-974-11 CERAMIC CHIP 0.01uF 50V
C235 1-162-974-11 CERAMIC CHIP 0.01uF 50V
C236 1-117-863-11 CERAMIC CHIP 0.47uF 10.00% 6.3V
C237 1-117-863-11 CERAMIC CHIP 0.47uF 10.00% 6.3V
C240 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C1109 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C1110 1-126-934-11 ELECT 220uF 20.00% 10V
C1111 1-162-974-11 CERAMIC CHIP 0.01uF 50V
< CONNECTOR >
CN101 1-784-751-11 CONNECTOR, FFC 29P
CN103 1-815-510-11 CONNECTOR, BOARD TO BOARD 26P
< DIODE >
D101 8-719-056-77 DIODE UDZ-TE-17-3.9B
< FERRITE BEAD >
FB101 1-500-445-21 FERRITE 0uH
< IC >
IC101 8-752-408-73 IC CXD3068Q
IC102 8-759-536-50 IC BA5982FP-E2
IC103 8-752-089-74 IC CXA2581N-T4
IC1102 8-759-598-69 IC BA6956AN
< CONDUCTOR >
JR201 1-216-864-11 METAL CHIP 0 5% 1/16W
< TRANSISTOR >
Q101 8-729-049-31 TRANSISTOR 2SB710A-RTX
Q102 8-729-015-74 TRANSISTOR UN5111-TX
Q103 8-729-920-85 TRANSISTOR 2SD1664-T100-QR
< RESISTOR >
R102 1-216-835-11 METAL CHIP 15K 5% 1/16W
R103 1-216-845-11 METAL CHIP 100K 5% 1/16W
R104 1-216-835-11 METAL CHIP 15K 5% 1/16W
R105 1-216-821-11 METAL CHIP 1K 5% 1/16W
R109 1-216-846-11 METAL CHIP 120K 5% 1/16W
R111 1-216-846-11 METAL CHIP 120K 5% 1/16W
R113 1-216-827-11 METAL CHIP 3.3K 5% 1/16W
R114 1-216-845-11 METAL CHIP 100K 5% 1/16W
R115 1-216-841-11 METAL CHIP 47K 5% 1/16W
R116 1-216-841-11 METAL CHIP 47K 5% 1/16W
R117 1-216-847-11 METAL CHIP 150K 5% 1/16W
R118 1-216-835-11 METAL CHIP 15K 5% 1/16W
R120 1-216-849-11 METAL CHIP 220K 5% 1/16W
R122 1-216-845-11 METAL CHIP 100K 5% 1/16W
R123 1-216-797-11 METAL CHIP 10 5% 1/16W
R124 1-216-798-11 RES-CHIP 12 5% 1/16W
R125 1-216-834-11 METAL CHIP 12K 5% 1/16W
R126 1-216-834-11 METAL CHIP 12K 5% 1/16W
R158 1-216-833-11 METAL CHIP 10K 5% 1/16W
R159 1-216-841-11 METAL CHIP 47K 5% 1/16W
R162 1-216-847-11 METAL CHIP 150K 5% 1/16W
R180 1-216-845-11 METAL CHIP 100K 5% 1/16W
R181 1-216-846-11 METAL CHIP 120K 5% 1/16W
R182 1-216-843-11 METAL CHIP 68K 5% 1/16W
R183 1-216-843-11 METAL CHIP 68K 5% 1/16W
R184 1-216-849-11 METAL CHIP 220K 5% 1/16W
R185 1-216-849-11 METAL CHIP 220K 5% 1/16W
R186 1-216-843-11 METAL CHIP 68K 5% 1/16W
R187 1-216-843-11 METAL CHIP 68K 5% 1/16W
R188 1-216-849-11 METAL CHIP 220K 5% 1/16W
R189 1-216-849-11 METAL CHIP 220K 5% 1/16W
R190 1-216-837-11 METAL CHIP 22K 5% 1/16W
R191 1-216-837-11 METAL CHIP 22K 5% 1/16W
R192 1-216-837-11 METAL CHIP 22K 5% 1/16W
R193 1-216-837-11 METAL CHIP 22K 5% 1/16W
BD (CD)
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
89
HCD-C5
R196 1-216-839-11 METAL CHIP 33K 5% 1/16W
R197 1-216-839-11 METAL CHIP 33K 5% 1/16W
R198 1-216-839-11 METAL CHIP 33K 5% 1/16W
R199 1-216-839-11 METAL CHIP 33K 5% 1/16W
R201 1-216-839-11 METAL CHIP 33K 5% 1/16W
R202 1-216-833-11 METAL CHIP 10K 5% 1/16W
R203 1-216-845-11 METAL CHIP 100K 5% 1/16W
R204 1-216-827-11 METAL CHIP 3.3K 5% 1/16W
R205 1-216-821-11 METAL CHIP 1K 5% 1/16W
R206 1-216-833-11 METAL CHIP 10K 5% 1/16W
R207 1-216-857-11 METAL CHIP 1M 5% 1/16W
R212 1-216-813-11 METAL CHIP 220 5% 1/16W
R215 1-216-864-11 METAL CHIP 0 5% 1/16W
R216 1-216-813-11 METAL CHIP 220 5% 1/16W
R217 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R218 1-216-821-11 METAL CHIP 1K 5% 1/16W
R219 1-216-833-11 METAL CHIP 10K 5% 1/16W
R220 1-216-864-11 METAL CHIP 0 5% 1/16W
R221 1-216-813-11 METAL CHIP 220 5% 1/16W
R226 1-216-809-11 METAL CHIP 100 5% 1/16W
R227 1-216-845-11 METAL CHIP 100K 5% 1/16W
R228 1-216-853-11 METAL CHIP 470K 5% 1/16W
R229 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
R230 1-216-789-11 METAL CHIP 2.2 5% 1/16W
R231 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
R302 1-216-837-11 METAL CHIP 22K 5% 1/16W
R303 1-216-837-11 METAL CHIP 22K 5% 1/16W
R304 1-216-837-11 METAL CHIP 22K 5% 1/16W
R305 1-216-837-11 METAL CHIP 22K 5% 1/16W
R1133 1-216-813-11 METAL CHIP 220 5% 1/16W
R1134 1-216-821-11 METAL CHIP 1K 5% 1/16W
< NETWORK >
RN201 1-233-576-11 RES, CHIP NETWORK 100
RN202 1-233-576-11 RES, CHIP NETWORK 100
< VARIABLE RESISTOR >
RV101 1-238-602-11 RES, ADJ, CARBON 47K
< VIBRATOR >
X201 1-579-834-11 VIBRATOR, CRYSTAL 33.8688MHz
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
A-4726-344-A BD (MD) BOARD, COMPLETE
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
< CAPACITOR >
C101 1-135-259-11 TANTAL. CHIP 10uF 20.00% 6.3V
C102 1-135-259-11 TANTAL. CHIP 10uF 20.00% 6.3V
C103 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C104 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V
C105 1-115-416-11 CERAMIC CHIP 0.001uF 5.00% 25V
C106 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C107 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C108 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V
C109 1-164-677-11 CERAMIC CHIP 0.033uF 10.00% 16V
C110 1-163-038-00 CERAMIC CHIP 0.1uF 25V
C111 1-117-720-11 CERAMIC CHIP 4.7uF 10V
C112 1-110-563-11 CERAMIC CHIP 0.068uF 10.00% 16V
C113 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V
C114 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V
C115 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V
C116 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V
C117 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C118 1-165-176-11 CERAMIC CHIP 0.047uF 10.00% 16V
C119 1-165-176-11 CERAMIC CHIP 0.047uF 10.00% 16V
C120 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C121 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C125 1-117-720-11 CERAMIC CHIP 4.7uF 10V
C128 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C131 1-117-720-11 CERAMIC CHIP 4.7uF 10V
C132 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C133 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C141 1-126-206-11 ELECT CHIP 100uF 20% 6.3V
C142 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C143 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C144 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C145 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C151 1-117-370-11 CERAMIC CHIP 10uF 10V
C152 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C153 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C154 1-126-206-11 ELECT CHIP 100uF 20% 6.3V
C155 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C156 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C157 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C158 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C159 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C160 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C161 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C162 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C163 1-125-891-11 CERAMIC CHIP 0.47uF 10.00% 10V
C164 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C165 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V
C166 1-125-891-11 CERAMIC CHIP 0.47uF 10.00% 10V
C167 1-164-245-11 CERAMIC CHIP 0.015uF 10.00% 25V
C169 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C173 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C174 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C180 1-117-370-11 CERAMIC CHIP 10uF 10V
C181 1-126-206-11 ELECT CHIP 100uF 20% 6.3V
C182 1-163-038-00 CERAMIC CHIP 0.1uF 25V
C183 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C184 1-117-970-11 ELECT CHIP 22uF 20.00% 10V
C185 1-131-872-11 CERAMIC CHIP 1000PF 10% 630V
C191 1-126-206-11 ELECT CHIP 100uF 20% 6.3V
C192 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C193 1-126-206-11 ELECT CHIP 100uF 20% 6.3V
C194 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C195 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C196 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C1401 1-117-720-11 CERAMIC CHIP 4.7uF 10V
BD (CD) BD (MD)
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
90
HCD-C5
< CONNECTOR >
CN101 1-766-833-21 CONNECTOR, FFC/FPC (ZIF) 21P
CN102 1-784-835-21 CONNECTOR,FFC(LIF(NON-ZIF))27P
CN103 1-784-869-21 CONNECTOR,FFC(LIF(NON-ZIF))17P
∗CN104 1-580-055-21 PIN, CONNECTOR (SMD) 2P
CN105 1-784-859-21 CONNECTOR, FFC(LIF(NON-ZIF))7P
< DIODE >
D101 8-719-988-61 DIODE 1SS355TE-17
D181 8-719-080-81 DIODE FS1J6
D183 8-719-080-81 DIODE FS1J6
< IC >
IC101 8-752-080-95 IC CXA2523AR
IC102 8-759-473-51 IC TLV2361CDBV
IC141 8-759-836-79 IC BH6519FS-E2
IC151 8-752-404-64 IC CXD2662R
IC153 8-759-671-27 IC MSM51V4400D-10TSK-FS
IC181 8-759-481-17 IC MC74ACT08DTR2
IC190 8-759-677-64 IC L88M35T
IC195 8-759-640-41 IC BR24C08F-E2
< CONDUCTOR >
JW201 1-216-295-00 SHORT 0
JW202 1-216-295-00 SHORT 0
JW203 1-216-295-00 SHORT 0
JW903 1-216-295-00 SHORT 0
JW904 1-216-295-00 SHORT 0
< CONDUCTOR / FERRITE BEAD >
L101 1-500-245-11 FERRITE 0uH
L102 1-500-245-11 FERRITE 0uH
L103 1-500-245-11 FERRITE 0uH
L105 1-414-235-22 FERRITE 0uH
L106 1-500-245-11 FERRITE 0uH
L121 1-500-245-11 FERRITE 0uH
L122 1-500-245-11 FERRITE 0uH
L131 1-500-245-11 FERRITE 0uH
L141 1-216-296-11 SHORT 0
L142 1-216-296-11 SHORT 0
L143 1-216-296-11 SHORT 0
L144 1-216-296-11 SHORT 0
L145 1-216-296-11 SHORT 0
L146 1-469-855-21 FERRITE 0uH
L147 1-469-855-21 FERRITE 0uH
L161 1-500-245-11 FERRITE 0uH
L171 1-500-245-11 FERRITE 0uH
L180 1-469-855-21 FERRITE 0uH
L181 1-469-855-21 FERRITE 0uH
L182 1-500-245-11 FERRITE 0uH
L183 1-216-296-11 SHORT 0
L184 1-216-296-11 SHORT 0
< TRANSISTOR >
Q101 8-729-403-35 TRANSISTOR UN5113-TX
Q121 8-729-403-35 TRANSISTOR UN5113-TX
Q122 8-729-101-07 TRANSISTOR 2SB798-T1DK
Q131 8-729-026-53 TRANSISTOR 2SA1576A-T106-QR
Q132 8-729-903-10 TRANSISTOR FMW1-T-148
Q133 8-729-402-93 TRANSISTOR UN5214-TX
Q134 8-729-402-93 TRANSISTOR UN5214-TX
Q181 8-729-018-75 TRANSISTOR 2SJ278MYTR
Q182 8-729-017-65 TRANSISTOR 2SK1764KYTR
< RESISTOR >
R101 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R102 1-216-853-11 METAL CHIP 470K 5% 1/16W
R103 1-216-863-11 RES-CHIP 3.3M 5% 1/16W
R104 1-216-853-11 METAL CHIP 470K 5% 1/16W
R105 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
R106 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
R107 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
R108 1-216-833-11 METAL CHIP 10K 5% 1/16W
R109 1-216-845-11 METAL CHIP 100K 5% 1/16W
R110 1-216-845-11 METAL CHIP 100K 5% 1/16W
R111 1-216-833-11 METAL CHIP 10K 5% 1/16W
R112 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R113 1-216-833-11 METAL CHIP 10K 5% 1/16W
R114 1-216-827-11 METAL CHIP 3.3K 5% 1/16W
R115 1-216-833-11 METAL CHIP 10K 5% 1/16W
R116 1-216-839-11 METAL CHIP 33K 5% 1/16W
R117 1-216-837-11 METAL CHIP 22K 5% 1/16W
R118 1-218-855-11 METAL CHIP 2.2K 0.5% 1/16W
R119 1-218-863-11 METAL CHIP 4.7K 0.5% 1/16W
R120 1-218-889-11 METAL CHIP 56K 0.5% 1/16W
R121 1-218-863-11 METAL CHIP 4.7K 0.5% 1/16W
R122 1-218-855-11 METAL CHIP 2.2K 0.5% 1/16W
R123 1-216-819-11 METAL CHIP 680 5% 1/16W
R124 1-216-809-11 METAL CHIP 100 5% 1/16W
R125 1-216-815-11 METAL CHIP 330 5% 1/16W
R126 1-216-819-11 METAL CHIP 680 5% 1/16W
R127 1-216-845-11 METAL CHIP 100K 5% 1/16W
R128 1-219-724-11 METAL CHIP 1 1% 1/4W
R129 1-216-298-00 METAL CHIP 2.2 5% 1/10W
R130 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R131 1-216-833-11 METAL CHIP 10K 5% 1/16W
R132 1-216-839-11 METAL CHIP 33K 5% 1/16W
R133 1-216-821-11 METAL CHIP 1K 5% 1/16W
R134 1-216-821-11 METAL CHIP 1K 5% 1/16W
R135 1-216-821-11 METAL CHIP 1K 5% 1/16W
R136 1-216-302-00 METAL CHIP 2.7 5% 1/10W
R138 1-216-833-11 METAL CHIP 10K 5% 1/16W
R150 1-216-833-11 METAL CHIP 10K 5% 1/16W
R151 1-216-833-11 METAL CHIP 10K 5% 1/16W
R153 1-216-833-11 METAL CHIP 10K 5% 1/16W
R155 1-216-864-11 METAL CHIP 0 5% 1/16W
R156 1-216-864-11 METAL CHIP 0 5% 1/16W
R158 1-216-809-11 METAL CHIP 100 5% 1/16W
R162 1-216-833-11 METAL CHIP 10K 5% 1/16W
R167 1-216-833-11 METAL CHIP 10K 5% 1/16W
R168 1-216-845-11 METAL CHIP 100K 5% 1/16W
R169 1-216-855-11 METAL CHIP 680K 5% 1/16W
R170 1-216-827-11 METAL CHIP 3.3K 5% 1/16W
R171 1-216-821-11 METAL CHIP 1K 5% 1/16W
R173 1-216-821-11 METAL CHIP 1K 5% 1/16W
R174 1-216-811-11 METAL CHIP 150 5% 1/16W
R177 1-216-805-11 METAL CHIP 47 5% 1/16W
R179 1-216-295-00 SHORT 0
R181 1-216-841-11 METAL CHIP 47K 5% 1/16W
R182 1-216-841-11 METAL CHIP 47K 5% 1/16W
BD (MD)
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
91
HCD-C5
R183 1-216-841-11 METAL CHIP 47K 5% 1/16W
R184 1-220-942-11 METAL CHIP 3.3 1% 1/4
R185 1-220-942-11 METAL CHIP 3.3 1% 1/4
R195 1-216-833-11 METAL CHIP 10K 5% 1/16W
R196 1-216-833-11 METAL CHIP 10K 5% 1/16W
R197 1-216-833-11 METAL CHIP 10K 5% 1/16W
R218 1-216-864-11 METAL CHIP 0 5% 1/16W
< SWITCH >
S101 1-762-596-21 SWITCH, PUSH (1 KEY) (LIMIT-IN)
S103 1-771-956-21 SWITCH, PUSH (1 KEY) (OUT)
S104 1-771-955-21 SWITCH, PUSH (1 KEY) (PLAY)
S105 1-771-955-21 SWITCH, PUSH (1 KEY) (REC)
< VIBRATOR >
X171 1-781-569-21 OSCILLATOR, CRYSTAL 90MHz
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
1-682-100-11 CONNECTOR BOARD
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
< CONNECTOR >
CN1 1-815-750-11 CONNECTOR
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
1-681-712-11 HP BOARD
∗∗∗∗∗∗∗∗∗
< CAPACITOR >
C337 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C338 1-162-294-31 CERAMIC 0.001uF 10% 50V
C339 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
< CONNECTOR >
∗CN109 1-568-954-11 PIN, CONNECTOR 5P
CN110 1-506-469-11 PIN, CONNECTOR 4P
< JACK >
J103 1-794-702-11 JACK, HEADPHONE (PHONES)
< TRANSISTOR >
Q341 8-729-046-97 TRANSISTOR 2SD1938(F)-T(TX).SO
Q391 8-729-046-97 TRANSISTOR 2SD1938(F)-T(TX).SO
< RESISTOR >
R337 1-249-407-11 CARBON 150 5% 1/4W F
R342 1-249-429-11 CARBON 10K 5% 1/4W
R387 1-249-407-11 CARBON 150 5% 1/4W F
R392 1-216-833-11 METAL CHIP 10K 5% 1/16W
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
1-681-381-11 JACK BOARD
∗∗∗∗∗∗∗∗∗∗∗
< CAPACITOR >
C101 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C122 1-162-964-11 CERAMIC CHIP 1000PF 50V
(AEP,UK,KR)
C151 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
< CONNECTOR >
∗CN107 1-568-934-11 PIN, CONNECTOR 7P
< JACK >
J101 1-793-439-11 JACK (SMALL TYPE) (TAPE OUT)
J102 1-793-439-11 JACK (SMALL TYPE) (TAPE IN)
< RESISTOR >
R101 1-216-845-11 METAL CHIP 100K 5% 1/16W
R151 1-216-845-11 METAL CHIP 100K 5% 1/16W
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
A-4725-732-A MD DIGITAL BOARD, COMPLETE
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
< CAPACITOR >
C200 1-124-584-00 ELECT 100uF 20% 10V
C201 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C202 1-124-589-11 ELECT 47uF 20% 16V
C203 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C204 1-124-261-00 ELECT 10uF 20% 50V
C205 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C207 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C208 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C211 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C212 1-124-584-00 ELECT 100uF 20% 10V
C213 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C214 1-124-261-00 ELECT 10uF 20% 50V
C215 1-124-261-00 ELECT 10uF 20% 50V
C216 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C217 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C218 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C219 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C221 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C222 1-124-589-11 ELECT 47uF 20% 16V
C223 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C701 1-124-584-00 ELECT 100uF 20% 10V
C702 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C703 1-126-245-11 ELECT 330uF 20.00% 6.3V
C704 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C705 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C706 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C707 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C719 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C723 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C726 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C730 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C738 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C740 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C742 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C743 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C748 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C749 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C751 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C756 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C791 1-164-156-11 CERAMIC CHIP 0.1uF 25V
BD (MD) CONNECTOR MD DIGITALHP JACK
Ver 1.1 2001.09
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
92
HCD-C5
C843 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C861 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C862 1-115-869-11 ELECT 0.33uF 20.00% 50V
C863 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C864 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C871 1-124-584-00 ELECT 100uF 20% 10V
C872 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C873 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
< CONNECTOR >
CN201 1-790-669-21 PIN, CONNECTOR (PC BOARD) 9P
CN701 1-784-741-11 CONNECTOR, FFC 19P
CN702 1-784-384-11 CONNECTOR, FFC/FPC 27P
CN703 1-784-376-11 CONNECTOR, FFC/FPC 17P
< DIODE >
D211 8-719-104-34 DIODE 1S2835-T1
< FERRITE BEAD / CONDUCTOR >
FB217 1-469-116-21 FERRITE 0UH
FB701 1-469-324-21 FERRITE 0UH
FB702 1-469-324-21 FERRITE 0UH
FB703 1-469-324-21 FERRITE 0UH
FB704 1-216-864-11 METAL CHIP 0 5% 1/16W
< IC >
IC201 8-759-675-78 IC UDA1360TS/N1.118
IC211 8-759-675-77 IC UDA1350AH
IC701 6-800-339-01 IC M30803MG-A03FP
IC861 8-759-481-02 IC M62016L
IC871 8-759-598-69 IC BA6956AN
< CONDUCTOR >
JR210 1-216-296-11 SHORT 0
< COIL >
L701 1-412-533-21 INDUCTOR 47uH
< TRANSISTOR >
Q201 8-729-421-22 TRANSISTOR UN2211-TX
Q202 8-729-026-49 TRANSISTOR 2SA1037AK-T146-QR
Q211 8-729-424-08 TRANSISTOR UN2111-TX
Q861 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6
Q871 8-729-421-22 TRANSISTOR UN2211-TX
Q872 8-729-602-36 TRANSISTOR 2SA1602TP-1EF
< RESISTOR >
R201 1-218-272-11 RES-CHIP 5.1K 5% 1/16W
R202 1-218-272-11 RES-CHIP 5.1K 5% 1/16W
R211 1-216-813-11 METAL CHIP 220 5% 1/16W
R213 1-216-833-11 METAL CHIP 10K 5% 1/16W
R214 1-216-809-11 METAL CHIP 100 5% 1/16W
R215 1-216-833-11 METAL CHIP 10K 5% 1/16W
R216 1-216-833-11 METAL CHIP 10K 5% 1/16W
R217 1-216-809-11 METAL CHIP 100 5% 1/16W
R218 1-216-809-11 METAL CHIP 100 5% 1/16W
R219 1-216-809-11 METAL CHIP 100 5% 1/16W
R220 1-216-817-11 METAL CHIP 470 5% 1/16W
R221 1-216-809-11 METAL CHIP 100 5% 1/16W
R222 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
R223 1-216-833-11 METAL CHIP 10K 5% 1/16W
R701 1-216-817-11 METAL CHIP 470 5% 1/16W
R702 1-216-809-11 METAL CHIP 100 5% 1/16W
R717 1-216-833-11 METAL CHIP 10K 5% 1/16W
R724 1-216-833-11 METAL CHIP 10K 5% 1/16W
R726 1-216-831-11 METAL CHIP 6.8K 5% 1/16W
R727 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R730 1-216-833-11 METAL CHIP 10K 5% 1/16W
R743 1-216-833-11 METAL CHIP 10K 5% 1/16W
R749 1-216-833-11 METAL CHIP 10K 5% 1/16W
R751 1-216-833-11 METAL CHIP 10K 5% 1/16W
R752 1-216-833-11 METAL CHIP 10K 5% 1/16W
R754 1-216-833-11 METAL CHIP 10K 5% 1/16W
R767 1-216-833-11 METAL CHIP 10K 5% 1/16W
R768 1-216-833-11 METAL CHIP 10K 5% 1/16W
R786 1-216-833-11 METAL CHIP 10K 5% 1/16W
R787 1-216-833-11 METAL CHIP 10K 5% 1/16W
R815 1-216-837-11 METAL CHIP 22K 5% 1/16W
R816 1-216-841-11 METAL CHIP 47K 5% 1/16W
R824 1-216-809-11 METAL CHIP 100 5% 1/16W
R861 1-216-849-11 METAL CHIP 220K 5% 1/16W
R862 1-216-845-11 METAL CHIP 100K 5% 1/16W
R863 1-216-837-11 METAL CHIP 22K 5% 1/16W
R871 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R872 1-216-824-11 METAL CHIP 1.8K 5% 1/16W
R873 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
< VIBRATOR >
X720 1-579-175-11 VIBRATOR, CERAMIC 10MHz
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
A-4476-936-A PANEL BOARD, COMPLETE
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
4-233-850-01 HOLDER (FL)
< CAPACITOR >
C603 1-124-247-11 ELECT 10uF 20.00% 35V
C623 1-162-306-11 CERAMIC 0.01uF 30.00% 16V
C624 1-162-282-31 CERAMIC 100PF 10% 50V
C626 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C635 1-124-247-11 ELECT 10uF 20.00% 35V
C636 1-126-153-11 ELECT 22uF 20% 6.3V
C637 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C640 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C641 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C642 1-162-306-11 CERAMIC 0.01uF 30.00% 16V
C643 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C646 1-165-319-91 CERAMIC CHIP 0.1uF 50V
C647 1-162-290-31 CERAMIC 470PF 10% 50V
C648 1-162-286-31 CERAMIC 220PF 10.00% 50V
C649 1-162-286-31 CERAMIC 220PF 10.00% 50V
C650 1-162-286-31 CERAMIC 220PF 10.00% 50V
C651 1-162-286-31 CERAMIC 220PF 10.00% 50V
C652 1-162-286-31 CERAMIC 220PF 10.00% 50V
C653 1-162-286-31 CERAMIC 220PF 10.00% 50V
C654 1-162-286-31 CERAMIC 220PF 10.00% 50V
PANELMD DIGITAL
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
93
HCD-C5
C655 1-162-286-31 CERAMIC 220PF 10.00% 50V
C656 1-162-286-31 CERAMIC 220PF 10.00% 50V
C657 1-162-286-31 CERAMIC 220PF 10.00% 50V
C658 1-162-286-31 CERAMIC 220PF 10.00% 50V
C659 1-162-286-31 CERAMIC 220PF 10.00% 50V
C660 1-162-286-31 CERAMIC 220PF 10.00% 50V
C661 1-162-286-31 CERAMIC 220PF 10.00% 50V
C662 1-162-286-31 CERAMIC 220PF 10.00% 50V
C664 1-124-247-11 ELECT 10uF 20.00% 35V
C665 1-124-589-11 ELECT 47uF 20% 16V
< CONNECTOR >
∗CN601 1-784-738-11 CONNECTOR, FFC 16P
< DIODE >
D601 8-719-300-71 DIODE SEL2210R-TP3 (?/1)
D602 8-719-072-76 DIODE SEL5E23C-TP15 (FUNCTIONz)
D603 8-719-072-76 DIODE SEL5E23C-TP15 (VOL +)
D604 8-719-072-76 DIODE SEL5E23C-TP15 (VOL –)
D605 8-719-072-76 DIODE SEL5E23C-TP15 (CDZ)
D606 8-719-072-76 DIODE SEL5E23C-TP15 (u)
D607 8-719-072-76 DIODE SEL5E23C-TP15 (x)
D608 8-719-072-76 DIODE SEL5E23C-TP15 (>)
D609 8-719-072-76 DIODE SEL5E23C-TP15 (.)
D610 8-719-072-76 DIODE SEL5E23C-TP15 (MDZ)
< FILTER >
FL601 1-518-755-11 INDICATOR TUBE, FLUORESCENT
< IC >
IC601 8-759-297-23 IC M66004M8FP-200D
IC602 8-759-827-69 IC NJL63H400A-1 (g)
< TRANSISTOR >
Q601 8-729-120-28 TRANSISTOR 2SC3052EF-T1-LEF
Q602 8-729-120-28 TRANSISTOR 2SC3052EF-T1-LEF
Q604 8-729-120-28 TRANSISTOR 2SC3052EF-T1-LEF
< RESISTOR >
R601 1-249-441-11 CARBON 100K 5% 1/4W
R602 1-249-441-11 CARBON 100K 5% 1/4W
R603 1-249-417-11 CARBON 1K 5% 1/4W
R604 1-249-417-11 CARBON 1K 5% 1/4W
R607 1-249-441-11 CARBON 100K 5% 1/4W
R608 1-216-838-11 METAL CHIP 27K 5% 1/16W
R609 1-216-821-11 METAL CHIP 1K 5% 1/16W
R610 1-216-821-11 METAL CHIP 1K 5% 1/16W
R611 1-216-821-11 METAL CHIP 1K 5% 1/16W
R612 1-216-821-11 METAL CHIP 1K 5% 1/16W
R614 1-216-813-11 METAL CHIP 220 5% 1/16W
R615 1-216-813-11 METAL CHIP 220 5% 1/16W
R616 1-216-813-11 METAL CHIP 220 5% 1/16W
R617 1-216-813-11 METAL CHIP 220 5% 1/16W
R618 1-216-809-11 METAL CHIP 100 5% 1/16W
R619 1-216-813-11 METAL CHIP 220 5% 1/16W
R620 1-216-813-11 METAL CHIP 220 5% 1/16W
R621 1-216-813-11 METAL CHIP 220 5% 1/16W
R622 1-216-813-11 METAL CHIP 220 5% 1/16W
R623 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R624 1-249-433-11 CARBON 22K 5% 1/4W
R639 1-216-797-11 METAL CHIP 10 5% 1/16W
R640 1-249-413-11 CARBON 470 5% 1/4W
R641 1-216-819-11 METAL CHIP 680 5% 1/16W
R642 1-216-821-11 METAL CHIP 1K 5% 1/16W
R643 1-216-817-11 METAL CHIP 470 5% 1/16W
R644 1-216-819-11 METAL CHIP 680 5% 1/16W
R645 1-216-821-11 METAL CHIP 1K 5% 1/16W
R646 1-216-817-11 METAL CHIP 470 5% 1/16W
R647 1-216-819-11 METAL CHIP 680 5% 1/16W
R648 1-216-821-11 METAL CHIP 1K 5% 1/16W
< SWITCH >
S602 1-762-875-21 SWITCH, KEYBOARD
(REC/REC IT/CD SYNC NORMAL)
S603 1-762-875-21 SWITCH, KEYBOARD (VOL –)
S604 1-762-875-21 SWITCH, KEYBOARD (VOL +)
S605 1-762-875-21 SWITCH, KEYBOARD (FUNCTIONz)
S606 1-762-875-21 SWITCH, KEYBOARD (?/1)
S607 1-762-875-21 SWITCH, KEYBOARD (CDZ)
S608 1-762-875-21 SWITCH, KEYBOARD (u)
S609 1-762-875-21 SWITCH, KEYBOARD (x)
S610 1-762-875-21 SWITCH, KEYBOARD (CD SYNC HIGH)
S611 1-762-875-21 SWITCH, KEYBOARD (MDZ)
S612 1-762-875-21 SWITCH, KEYBOARD (./m/TUNING–)
S613 1-762-875-21 SWITCH, KEYBOARD (>/M/TUNING+)
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
A-4427-414-A POWER BOARD, COMPLETE (HK,KR)
A-4476-948-A POWER BOARD, COMPLETE (AEP,UK,AUS)
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
< CAPACITOR >
C902 1-126-767-11 ELECT 1000uF 20.00% 16V
C903 1-126-964-11 ELECT 10uF 20.00% 50V
C904 1-126-916-11 ELECT 1000uF 20.00% 6.3V
C905 1-126-964-11 ELECT 10uF 20.00% 50V
C906 1-126-926-11 ELECT 1000uF 20.00% 10V
C907 1-126-964-11 ELECT 10uF 20.00% 50V
C908 1-126-935-11 ELECT 470uF 20.00% 10V
C909 1-126-964-11 ELECT 10uF 20.00% 50V
C910 1-126-916-11 ELECT 1000uF 20.00% 6.3V
C912 1-126-916-11 ELECT 1000uF 20.00% 6.3V
C914 1-126-935-11 ELECT 470uF 20.00% 10V
C922 1-126-933-11 ELECT 100uF 20.00% 16V
C961 1-136-165-00 FILM 0.1uF 5.00% 50V
C962 1-126-944-11 ELECT 3300uF 20.00% 25V
C971 1-136-165-00 FILM 0.1uF 5.00% 50V
C974 1-126-968-11 ELECT 100uF 20.00% 50V
C975 1-126-964-11 ELECT 10uF 20.00% 50V
C976 1-126-964-11 ELECT 10uF 20.00% 50V
C981 1-136-165-00 FILM 0.1uF 5.00% 50V
C982 1-136-165-00 FILM 0.1uF 5.00% 50V
C983 1-135-933-11 ELECT 22000uF 20% 16V
C984 1-128-548-11 ELECT 4700uF 20.00% 25V
0C991 1-113-925-11 CERAMIC 0.01uF 20.00% 250V
C992 1-126-963-11 ELECT 4.7uF 20.00% 50V
PANEL POWER
Ver 1.1 2001.09
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
94
HCD-C5
< CONNECTOR >
∗CN901 1-770-732-11 CONNECTOR, BOARD TO BOARD 15P
CN902 1-778-241-11 CONNECTOR, BOARD TO BOARD 5P
CN991 1-564-321-00 PIN, CONNECTOR 2P
∗CN992 1-564-321-21 PIN, CONNECTOR 2P
∗CN995 1-564-511-11 PLUG, CONNECTOR 8P
< DIODE >
D906 8-719-991-33 DIODE 1SS133T-77
D921 8-719-200-82 DIODE 11ES2-TA1B
D961 8-719-200-82 DIODE 11ES2-TA1B
D962 8-719-200-82 DIODE 11ES2-TA1B
D963 8-719-200-82 DIODE 11ES2-TA1B
D964 8-719-200-82 DIODE 11ES2-TA1B
D971 8-719-200-82 DIODE 11ES2-TA1B
D972 8-719-200-82 DIODE 11ES2-TA1B
D973 8-719-200-82 DIODE 11ES2-TA1B
D974 8-719-200-82 DIODE 11ES2-TA1B
D975 8-719-982-24 DIODE MTZJ-T-77-33A
D976 8-719-921-40 DIODE MTZJ-T-77-4.7A
D981 8-719-028-23 DIODE D3SBA20-4101
D982 8-719-200-82 DIODE 11ES2-TA1B
D983 8-719-200-82 DIODE 11ES2-TA1B
D984 8-719-200-82 DIODE 11ES2-TA1B
D985 8-719-200-82 DIODE 11ES2-TA1B
D991 8-719-991-33 DIODE 1SS133T-77
D992 8-719-991-33 DIODE 1SS133T-77
D993 8-719-991-33 DIODE 1SS133T-77
< BRACKET >
EB901 4-924-906-21 BRACKET (MT)
EB902 4-924-906-21 BRACKET (MT)
< IC >
IC901 8-759-231-57 IC TA7810S
IC902 8-759-701-75 IC NJM7805FA
IC903 8-759-450-49 IC uPC2907HF
IC904 8-759-701-75 IC NJM7805FA
IC905 8-759-701-75 IC NJM7805FA
IC906 8-759-686-72 IC uPC29L04J-T
IC907 8-759-647-11 IC uPC2905HF
< LINE FILTER >
0LF991 1-419-625-11 COIL, LINE FILTER
< TRANSISTOR >
Q971 8-729-141-83 TRANSISTOR 2SB1375
Q991 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6
< RESISTOR >
0R971 1-219-153-11 FUSIBLE 10 5% 1/4W
R972 1-260-103-11 CARBON 2.2K 5% 1/2W
R973 1-249-429-11 CARBON 10K 5% 1/4W
R974 1-249-413-11 CARBON 470 5% 1/4W
R975 1-249-413-11 CARBON 470 5% 1/4W
0R981 1-219-120-81 FUSIBLE 0.15 5% 1/4W
0R982 1-240-877-11 FUSIBLE 0.15 5% 1/2W
R991 1-249-429-11 CARBON 10K 5% 1/4W
R992 1-216-833-11 METAL CHIP 10K 5% 1/16W
R993 1-249-413-11 CARBON 470 5% 1/4W
R994 1-249-413-11 CARBON 470 5% 1/4W
R995 1-216-055-11 METAL CHIP 1.8K 5% 1/10W
R995 1-216-827-11 METAL CHIP 3.3K 5% 1/16W
R996 1-247-791-91 CARBON 22 5% 1/4W
< RELAY >
0RY991 1-755-276-11 RELAY, POWER
< TRANSFORMER >
0T901 1-437-243-11 TRANSFORMER, POWER (SUB) (AEP,UK,AUS)
0T901 1-437-245-11 TRANSFORMER, POWER (SUB) (HK,KR)
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
1-682-099-11 SW BOARD
∗∗∗∗∗∗∗∗∗
< SWITCH >
S1 1-786-214-11 SWITCH (DETECTION)
(Disc IN/8cm Disc Detect)
S2 1-786-212-11 SWITCH (DETECTION)
(12cm Disc/12cm Disc Eject End Detect)
S3 1-786-213-11 SWITCH (DETECTION)
(Disc Existence, Chaking, Releasing Detect)
S4 1-786-214-11 SWITCH (DETECTION)
(8cm Disc Eject End Detect)
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
A-4427-413-A UCOM BOARD, COMPLETE (AUS,HK,KR)
A-4476-947-A UCOM BOARD, COMPLETE (AEP,UK)
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
∗4-363-146-00 HEAT SINK, V.OUT
7-685-646-79 SCREW +BVTP 3X8 TYPE2 N-S
< LITHIUM BATTERY >
BT921 1-528-938-11 BATTERY, LITHIUM ION SECONDARY
< CAPACITOR >
C201 1-126-176-11 ELECT 220uF 20% 10V
C202 1-119-774-11 ELECT 100uF 20.00% 16V
C203 1-164-159-11 CERAMIC 0.1uF 50V
C204 1-104-665-11 ELECT 100uF 20.00% 10V
C206 1-119-941-11 ELECT 470uF 20.00% 6.3V
C208 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C211 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C212 1-162-294-31 CERAMIC 0.001uF 10% 50V
C213 1-162-294-31 CERAMIC 0.001uF 10% 50V
C216 1-126-786-11 ELECT 47uF 20.00% 16V
C222 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C223 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C224 1-136-165-00 FILM 0.1uF 5.00% 50V
C225 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C226 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
POWER SW UCOM
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
Ver 1.1 2001.09
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
95
HCD-C5
C231 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C241 1-127-820-11 CERAMIC 4.7uF 16V
C243 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C244 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C294 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C501 1-126-916-11 ELECT 1000uF 20.00% 6.3V
C502 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C503 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C504 1-126-160-11 ELECT 1uF 20% 50V
C505 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C506 1-164-159-11 CERAMIC 0.1uF 50V
C507 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C509 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C510 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C535 1-162-917-11 CERAMIC CHIP 15PF 5% 50V
C536 1-162-920-11 CERAMIC CHIP 27PF 5% 50V
C911 1-164-159-11 CERAMIC 0.1uF 50V
C941 1-126-964-11 ELECT 10uF 20.00% 50V
C942 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C943 1-164-156-11 CERAMIC CHIP 0.1uF 25V
< CONNECTOR >
∗CN201 1-784-738-11 CONNECTOR, FFC 16P
CN202 1-784-780-11 CONNECTOR, FFC 19P
CN203 1-764-698-11 SOCKET, CONNECTOR (NON ZIF)19P
CN204 1-568-844-11 CONNECTOR, FFC 29P
CN205 1-766-956-11 CONNECTOR, BOARD TO BOARD 15P
∗CN206 1-774-813-11 CONNECTOR, BOARD TO BOARD 7P
CN207 1-774-136-11 CONNECTOR, ROUND TYPE 6P
CN208 1-774-281-11 CONNECTOR (DIN) 8P
CN209 1-774-281-11 CONNECTOR (DIN) 8P
CN212 1-506-469-11 PIN, CONNECTOR 4P
< DIODE >
D214 8-719-988-61 DIODE 1SS355TE-17
D221 8-719-988-61 DIODE 1SS355TE-17
D222 8-719-988-61 DIODE 1SS355TE-17
D232 8-719-988-61 DIODE 1SS355TE-17
D513 8-719-988-61 DIODE 1SS355TE-17
D910 8-719-921-40 DIODE MTZJ-T-77-4.7B
D923 8-719-991-33 DIODE 1SS133T-77
D924 8-719-991-33 DIODE 1SS133T-77
D925 8-719-988-61 DIODE 1SS355TE-17
D926 8-719-988-61 DIODE 1SS355TE-17
D927 8-719-988-61 DIODE 1SS355TE-17
D941 8-719-988-61 DIODE 1SS355TE-17
D942 8-719-988-61 DIODE 1SS355TE-17
D943 8-719-988-61 DIODE 1SS355TE-17
< TERMINAL >
EPT101 1-537-770-21 TERMINAL BOARD, GROUND
< CONDUCTOR / COIL >
FB201 1-216-864-11 METAL CHIP 0 5% 1/16W
FB202 1-216-864-11 METAL CHIP 0 5% 1/16W
FB205 1-216-864-11 METAL CHIP 0 5% 1/16W
FB211 1-412-473-21 INDUCTOR 0uH
FB212 1-216-864-11 METAL CHIP 0 5% 1/16W
FB213 1-216-864-11 METAL CHIP 0 5% 1/16W
FB214 1-216-864-11 METAL CHIP 0 5% 1/16W
FB222 1-216-864-11 METAL CHIP 0 5% 1/16W
FB537 1-414-813-21 EMI FERRITE (SMD)
< IC >
IC212 8-759-683-99 IC BA8274F-E2
IC221 8-749-017-36 IC TORX-179
IC222 8-759-548-57 IC SN74LV00ANSR
IC501 6-800-396-01 IC uPD703032AYGF-M01-3BA
IC941 8-759-637-58 IC PST592C-T
< CONDUCTOR >
JR200 1-216-864-11 METAL CHIP 0 5% 1/16W
JR203 1-216-864-11 METAL CHIP 0 5% 1/16W
JR205 1-216-864-11 METAL CHIP 0 5% 1/16W
JR208 1-216-864-11 METAL CHIP 0 5% 1/16W
JR209 1-216-864-11 METAL CHIP 0 5% 1/16W
JR210 1-216-864-11 METAL CHIP 0 5% 1/16W
JR212 1-216-864-11 METAL CHIP 0 5% 1/16W
JR213 1-216-864-11 METAL CHIP 0 5% 1/16W
JR214 1-216-864-11 METAL CHIP 0 5% 1/16W
JR215 1-216-864-11 METAL CHIP 0 5% 1/16W
JR216 1-216-864-11 METAL CHIP 0 5% 1/16W
JR217 1-216-864-11 METAL CHIP 0 5% 1/16W
JR219 1-216-864-11 METAL CHIP 0 5% 1/16W
JR225 1-216-864-11 METAL CHIP 0 5% 1/16W
JR226 1-216-864-11 METAL CHIP 0 5% 1/16W
JR227 1-216-864-11 METAL CHIP 0 5% 1/16W
< CONDUCTOR >
L551 1-216-864-11 METAL CHIP 0 5% 1/16W
L552 1-216-864-11 METAL CHIP 0 5% 1/16W
< TRANSISTOR >
Q202 8-729-424-08 TRANSISTOR UN2111-TX
Q211 8-729-025-28 TRANSISTOR 2SK1828TE85L
Q212 8-729-025-28 TRANSISTOR 2SK1828TE85L
Q221 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6
Q222 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6
Q223 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6
Q224 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6
Q232 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6
Q911 8-729-421-22 TRANSISTOR UN2211-TX
Q912 8-729-040-20 TRANSISTOR RT1P137L-TP
Q941 8-729-120-28 TRANSISTOR 2SC1623-T1-L5L6
< RESISTOR >
R212 1-249-429-11 CARBON 10K 5% 1/4W
R213 1-216-833-11 METAL CHIP 10K 5% 1/16W
R214 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
R215 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
R217 1-216-833-11 METAL CHIP 10K 5% 1/16W
R218 1-216-845-11 METAL CHIP 100K 5% 1/16W
R219 1-249-417-11 CARBON 1K 5% 1/4W
R221 1-249-413-11 CARBON 470 5% 1/4W
R222 1-216-809-11 METAL CHIP 100 5% 1/16W
R224 1-216-853-11 METAL CHIP 470K 5% 1/16W
UCOM
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
96
HCD-C5
R225 1-216-841-11 METAL CHIP 47K 5% 1/16W
R226 1-216-853-11 METAL CHIP 470K 5% 1/16W
R227 1-216-841-11 METAL CHIP 47K 5% 1/16W
R228 1-216-841-11 METAL CHIP 47K 5% 1/16W
R236 1-249-429-11 CARBON 10K 5% 1/4W
R242 1-247-807-31 CARBON 100 5% 1/4W
R243 1-216-821-11 METAL CHIP 1K 5% 1/16W
R244 1-216-845-11 METAL CHIP 100K 5% 1/16W
R245 1-216-845-11 METAL CHIP 100K 5% 1/16W
R292 1-247-807-31 CARBON 100 5% 1/4W
R501 1-247-807-31 CARBON 100 5% 1/4W
R502 1-247-807-31 CARBON 100 5% 1/4W
R503 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
R504 1-247-807-31 CARBON 100 5% 1/4W
R505 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
R506 1-247-807-31 CARBON 100 5% 1/4W
R507 1-247-807-31 CARBON 100 5% 1/4W
R508 1-216-809-11 METAL CHIP 100 5% 1/16W
R509 1-216-833-11 METAL CHIP 10K 5% 1/16W
R510 1-216-833-11 METAL CHIP 10K 5% 1/16W
R511 1-247-807-31 CARBON 100 5% 1/4W
R512 1-247-887-00 CARBON 220K 5% 1/4W
R513 1-247-807-31 CARBON 100 5% 1/4W
R514 1-247-807-31 CARBON 100 5% 1/4W
R515 1-247-807-31 CARBON 100 5% 1/4W
R516 1-216-837-11 METAL CHIP 22K 5% 1/16W
R517 1-247-807-31 CARBON 100 5% 1/4W
R518 1-247-807-31 CARBON 100 5% 1/4W
R519 1-247-887-00 CARBON 220K 5% 1/4W
R520 1-249-421-11 CARBON 2.2K 5% 1/4W
R521 1-216-833-11 METAL CHIP 10K 5% 1/16W
R522 1-216-833-11 METAL CHIP 10K 5% 1/16W
R523 1-216-833-11 METAL CHIP 10K 5% 1/16W
R524 1-216-809-11 METAL CHIP 100 5% 1/16W
R525 1-216-833-11 METAL CHIP 10K 5% 1/16W
R526 1-247-807-31 CARBON 100 5% 1/4W
R527 1-247-807-31 CARBON 100 5% 1/4W
R528 1-249-429-11 CARBON 10K 5% 1/4W
R529 1-247-807-31 CARBON 100 5% 1/4W
R530 1-249-417-11 CARBON 1K 5% 1/4W
R531 1-249-417-11 CARBON 1K 5% 1/4W
R532 1-249-417-11 CARBON 1K 5% 1/4W
R533 1-249-417-11 CARBON 1K 5% 1/4W
R535 1-249-429-11 CARBON 10K 5% 1/4W
R536 1-216-851-11 METAL CHIP 330K 5% 1/16W
R538 1-249-429-11 CARBON 10K 5% 1/4W
R543 1-216-809-11 METAL CHIP 100 5% 1/16W
R544 1-216-809-11 METAL CHIP 100 5% 1/16W
R545 1-216-821-11 METAL CHIP 1K 5% 1/16W
R546 1-216-809-11 METAL CHIP 100 5% 1/16W
R547 1-216-809-11 METAL CHIP 100 5% 1/16W
R548 1-216-809-11 METAL CHIP 100 5% 1/16W
R549 1-216-809-11 METAL CHIP 100 5% 1/16W
R550 1-216-809-11 METAL CHIP 100 5% 1/16W
R551 1-249-429-11 CARBON 10K 5% 1/4W
R554 1-216-809-11 METAL CHIP 100 5% 1/16W
R556 1-249-421-11 CARBON 2.2K 5% 1/4W
R557 1-216-833-11 METAL CHIP 10K 5% 1/16W
R558 1-216-833-11 METAL CHIP 10K 5% 1/16W
R559 1-216-833-11 METAL CHIP 10K 5% 1/16W
R560 1-249-417-11 CARBON 1K 5% 1/4W
R561 1-249-417-11 CARBON 1K 5% 1/4W
R562 1-216-809-11 METAL CHIP 100 5% 1/16W
R563 1-216-809-11 METAL CHIP 100 5% 1/16W
R564 1-216-809-11 METAL CHIP 100 5% 1/16W
R565 1-216-835-11 METAL CHIP 15K 5% 1/16W
R566 1-216-835-11 METAL CHIP 15K 5% 1/16W
R567 1-249-429-11 CARBON 10K 5% 1/4W
R568 1-216-835-11 METAL CHIP 15K 5% 1/16W
R569 1-216-809-11 METAL CHIP 100 5% 1/16W
R570 1-216-809-11 METAL CHIP 100 5% 1/16W
R572 1-216-823-11 METAL CHIP 1.5K 5% 1/16W
R577 1-216-821-11 METAL CHIP 1K 5% 1/16W
R578 1-216-821-11 METAL CHIP 1K 5% 1/16W
R579 1-216-821-11 METAL CHIP 1K 5% 1/16W
R580 1-216-833-11 METAL CHIP 10K 5% 1/16W
R581 1-216-833-11 METAL CHIP 10K 5% 1/16W
R583 1-216-833-11 METAL CHIP 10K 5% 1/16W
R584 1-216-833-11 METAL CHIP 10K 5% 1/16W
(AEP,UK)
R585 1-216-833-11 METAL CHIP 10K 5% 1/16W
R586 1-216-833-11 METAL CHIP 10K 5% 1/16W
R587 1-216-833-11 METAL CHIP 10K 5% 1/16W
R588 1-216-833-11 METAL CHIP 10K 5% 1/16W
R590 1-249-417-11 CARBON 1K 5% 1/4W
R591 1-249-437-11 CARBON 47K 5% 1/4W
R592 1-216-821-11 METAL CHIP 1K 5% 1/16W
R593 1-216-833-11 METAL CHIP 10K 5% 1/16W
R594 1-216-821-11 METAL CHIP 1K 5% 1/16W
R595 1-249-417-11 CARBON 1K 5% 1/4W
R596 1-216-821-11 METAL CHIP 1K 5% 1/16W
R597 1-216-809-11 METAL CHIP 100 5% 1/16W
R910 1-260-103-11 CARBON 2.2K 5% 1/2W
R911 1-216-864-11 METAL CHIP 0 5% 1/16W
R921 1-216-813-11 METAL CHIP 220 5% 1/16W
R941 1-216-817-11 METAL CHIP 470 5% 1/16W
R942 1-216-833-11 METAL CHIP 10K 5% 1/16W
R943 1-216-841-11 METAL CHIP 47K 5% 1/16W
R946 1-216-837-11 METAL CHIP 22K 5% 1/16W
R947 1-216-841-11 METAL CHIP 47K 5% 1/16W
< VIBRATOR >
X501 1-760-014-31 VIBRATOR, CERAMIC 20MHz
X502 1-567-098-41 VIBRATOR, CRYSTAL 32.768kHz
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
MISCELLANEOUS
∗∗∗∗∗∗∗∗∗∗∗∗∗∗
1 1-757-791-11 WIRE (FLAT TYPE) (16 CORE)
6 1-773-289-11 WIRE (FLAT TYPE) (29 CORE)
0104 1-696-847-11 CORD, POWER (AUS)
0104 1-769-079-21 CORD, POWER (KR)
0104 1-777-071-21 CORD, POWER (AEP,UK,HK)
105 1-769-943-11 WIRE (FLAT TYPE) (11CORE) (AUS,HK,KR)
105 1-773-007-11 WIRE (FLAT TYPE) (15 CORE) (AEP,UK)
106 1-693-529-11 TUNER PACK (FM/AM) (AEP,UK)
106 1-693-531-11 TUNER PACK (FM/AM) (AUS,HK)
106 1-693-536-11 TUNER PACK (FM/AM) (KR)
UCOM
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
Ver 1.1 2001.09
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
97
HCD-C5
108 1-773-110-11 WIRE (FLAT TYPE) (19 CORE)
154 1-773-138-11 WIRE (FLAT TYPE) (19 CORE)
156 1-757-079-11 WIRE (FLAT TYPE) (17 CORE)
157 1-757-080-11 WIRE (FLAT TYPE) (27 CORE)
408 1-682-101-11 PICK-UP FLEXIBLE BOARD
0503 1-758-631-11 OPTICAL PICK-UP (OPTIMA-720L1E)
759 1-678-514-11 FLEXIBLE BOARD
0760 A-4672-541-A OPTICAL PICK-UP (KMS-260B)
HR901 1-500-670-11 HEAD, OVER WRITE
M701 A-4672-898-A MOTOR ASSY, SPINDLE
M702 A-4735-076-A MOTOR ASSY, SLED
M703 A-4735-074-A MOTOR ASSY, LOADING
M901 1-698-997-11 FAN, D.C.
M902 X-4954-023-1 MOTOR ASSY, LOADING
M903 X-4954-020-1 MOTOR ASSY, FEED
M904 X-4954-021-1 MOTOR ASSY, SPINDLE
S1 1-786-214-11 SWITCH (DETECTION)
(Disc IN/8cm Disc detect)
S2 1-786-213-11 SWITCH (DETECTION)
(12cm Disc/12cm Disc Eject End detect)
S3 1-786-213-11 SWITCH (DETECTION)
(Disc Existence, Chucking, Releasing detect)
S4 1-786-214-11 SWITCH (DETECTION) (8cm Disc Eject detect)
S5 1-786-212-11 SWITCH (DETECTION) (LIMIT IN)
S102 1-771-957-11 SWITCH, PUSH (2 KEY) (REFLECT→PROTECT)
0T900 1-437-239-11 TRANSFORMER, POWER (AEP,UK,AUS)
0T900 1-437-241-11 TRANSFORMER, POWER (HK,KR)
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
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HARDWARE LIST
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#1 7-685-870-01 SCREW +BVTT 3X5 (S)
#2 7-685-245-19 SCREW +KTP 3X6 TYPE2 NON-SLIT
#3 7-685-852-04 SCREW +BVTT 2X5 (S)
#4 7-685-861-01 SCREW +BVTT 2.6X5 (S)
#5 7-685-648-79 SCREW +BVTP 3X12 TYPE2 N-S
#6 7-682-565-09 SCREW +B 4X16
#7 7-685-646-79 SCREW +BVTP 3X8 TYPE2 N-S
#8 7-684-024-04 N 4, TYPE 2
#9 7-685-104-19 SCREW +P 2X6 TYPE2 NON-SLIT
#10 7-685-504-19 SCREW +BTP 2X6 TYPE2 N-S
#11 7-685-101-11 SCREW +P 2X3 NON-SLIT TYPE2
#12 7-685-103-19 SCREW +P 2X5 TYPE2 NON-SLIT
#13 7-627-553-38 SCREW, PRECISION +P 2X3
#14 7-627-553-28 SCREW, PRECISION +P 2X2.5
#15 7-627-553-17 PRECISION SCREW +P 2X2 TYPE 3
#16 7-627-553-78 SCREW, PRECISION +P 2X10
#17 7-627-553-68 SCREW, PRECISION +P 2X6 TYPE3
#18 7-627-552-77 SCREW, PRECISION +P 1.7X6
#19 7-627-552-88 SCREW, PRECISION +P 1.7X2.2
#20 7-627-551-18 SCREW, PRECISION +P 1.4X2
#21 7-685-850-04 SCREW +BVTT 2X3 (S)
#22 7-685-204-19 SCREW +KTP 2X6 TYPE2 NON-SLIT
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
Ver 1.1 2001.09
REVISION HISTORY
Clicking the version allows you to jump to the revised page.
Also, clicking the version at the upper right on the revised page allows you to jump to the next revised
page.
Ver. Date Description of Revision
1.1 2001.09 Addition of Australian, Hong Kong and Korean models.
1.0 2001.07 New
HCD-C5

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