Summit Data Communications SDCSSD40L 802.11b/g/n SDIO module User Manual SSD40NBT Hardware Integration Guide v 02
Summit Data Communications, Inc. 802.11b/g/n SDIO module SSD40NBT Hardware Integration Guide v 02
user manual
Summit Data Communications, Inc., 526 South Main Street Suite 805 Akron, OH 44311
Tel: 866-434-4300 www.summitdatacom.com
© 2006 – 2012 Summit Data Communications, Inc. All rights reserved.
Summit User’s Guide
SDC-SSD40L
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SDC-SSD40L_UsersGuide
© 2011 – 2012 Summit Data Communications, Inc. All rights reserved.
Contents
Contents ........................................................................................................................................................ 2
Scope ............................................................................................................................................................. 3
Specifications ................................................................................................................................................ 3
Recommended Operating Conditions and DC Electrical Characteristics .............................................. 7
Pin Definitions ............................................................................................................................................... 9
Integration Considerations ................................................................................................................. 11
Mechanical Specifications ........................................................................................................................... 13
Mounting................................................................................................................................................. 14
RF Layout Design Guidelines ....................................................................................................................... 15
Regulatory ................................................................................................................................................... 16
Design Implementation Requirements ................................................................................................... 16
Documentation Requirements ............................................................................................................... 19
FCC ...................................................................................................................................................... 19
Industry Canada .................................................................................................................................. 21
European Union .................................................................................................................................. 22
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Scope
This document describes key hardware aspects of the Summit SSD40L
SDIO (Secure Digital Input/Output) radio module (Model # SDC-SSD40L).
This document is intended to assist device manufacturers and related
parties with the integration of this radio into their host devices. Data in this
document are drawn from a number of sources and include information
found in the USI (WM-N-BM-01) data sheet issued in April, 2009 and the
USI (WM-N-BM-01) application note issued in January, 2010.
Please contact Summit or visit the Summit website at
www.summitdata.com to obtain the most recent version of this document.
Specifications
Feature
Description
Physical Interface
0.62 mm pitch LGA (land grid array) (0.62 GSP)
Wi-Fi Interface
1-bit or 4-bit Secure Digital I/O
Antenna Interface
Single antenna port (when mounted on an MSD40L board)
Chip Set
Broadcom BCM4319
Input Voltage Requirements
3.3 VDC ± 10% (core)
I/O Signaling Voltage
1.8/3.3 VDC ± 10%
Current Consumption
(At maximum transmit power setting)
802.11b (17 dBm output power)
Transmit: 340 mA (1040 mW)
Receive: 85 mA (254 mW)
Standby: 28 mA (TBD mW)
802.11g (15 dBm output power)
Transmit: 290 mA (726 mW)
Receive: 85 mA (254 mW)
Standby: 28 mA (TBD mW)
802.11n (14 dBm output power) (20-MHz channel)
Transmit: 280 mA (726 mW)
Receive: 77 mA (254 mW)
Standby: TBD mA (TBD mW)
Operating Temperature
-20° to 70°C (-4° to 158°F) (SDIO)
Operating Humidity
10 to 90% (non-condensing)
Storage Temperature
-30° to 85°C (-22° to 185°F)
Storage Humidity
10 to 90% (non-condensing)
Maximum Electrostatic Discharge
± 2 kV
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Feature
Description
Length
Note: Length, width, and thickness
measurements include the metal
shielding.
10 mm (0.39”)
Width
10 mm (0.39”)
Thickness
1.3 mm (0.05”)
Mounting
See “Mounting” section for more information
Wireless Media
Direct Sequence-Spread Spectrum (DSSS)
Orthogonal Frequency Divisional Multiplexing (OFDM)
Media Access Protocol
Carrier sense multiple access with collision avoidance
(CSMA/CA)
Network Architecture Types
Infrastructure and ad hoc
Network Standards
IEEE 802.11b, 802.11d, 802.11e, 802.11g, 802.11i, 802.11n
Data Rates Supported
802.11b (DSSS) 1, 2, 5.5, 11 Mbps
802.11g (OFDM) 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n (OFDM, MCS 0-7) 6.5, 7.2, 13.0, 14.4, 19.5, 21.7,
26.0, 28.9, 39.0, 43.3, 52.0, 57.8, 58.5, 65.0, 72.2 Mbps
Modulation
BPSK @ 1, 6, 6.5, 7.2 and 9 Mbps
QPSK @ 2, 12, 13, 14.4,18, 19.5 and 21.7 Mbps
CCK @ 5.5 and 11 Mbps
16-QAM @ 24, 26, 28.9, 36, 39 and 43.3 Mbps
64-QAM @ 48, 52, 54, 57.8, 58.5, 65, and 72.2 Mbps
802.11n Spatial Streams
1 (Single Input, Single Output)
2.4 GHz Frequency Bands
ETSI
2.4 GHz to 2.483 GHz
FCC
2.4 to 2.483 GHz
MIC (Japan) (formerly TELEC)
2.4 GHz to 2.495 GHz
KCC
2.4 GHz to 2.483 GHz
2.4 GHz Operating Channels
ETSI: 13 (3 non-overlapping)
FCC: 11 (3 non-overlapping)
MIC (Japan): 14 (4 non-overlapping)
KCC: 13 (3 non-overlapping)
Transmit Power Settings
Note: Maximum transmit power varies
according to individual country
regulations. All values nominal, +/-2
dBm
802.11b/g
17 dBm (50 mW)
15 dBm (30 mW)
802.11n
15 dBm (30 mW)
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Feature
Description
Typical Receiver Sensitivity
802.11b
1 Mbps
-94 dBm
2 Mbps
TBD dBm
5.5 Mbps
TBD dBm
11 Mbps
-87 dBm (PER <= 10%)
802.11g
6 Mbps
-86 dBm
9 Mbps
TBD dBm
12 Mbps
TBD dBm
18 Mbps
TBD dBm
24 Mbps
TBD dBm
36 Mbps
TBD dBm
48 Mbps
TBD dBm
54 Mbps
-73 dBm (PER <= 10%)
802.11n
6.5 Mbps
TBD dBm
7.2 Mbps
TBD dBm
13 Mbps
TBD dBm
14.4 Mbps
TBD dBm
19.5 Mbps
TBD dBm
21.7 Mbps
TBD dBm
26 Mbps
28.9 Mbps
TBD dBm
TDB dBm
39 Mbps
43.3 Mbps
52 Mbps
57.8 Mbps
58.5 Mbps
65 Mbps
72.2 Mbps
TBD dBm
TBD dBm
TBD dBm
TBD dBm
TBD dBm
-86 dBm
TBD dBm
Operating Systems Supported
Windows Mobile 6.5
Windows Mobile 6.1
Windows Mobile 6.0
Windows Mobile 5.0
Windows Embedded CE 6.0 R3
Windows Embedded CE 6.0 R2
Windows Embedded CE 6.0
Windows Embedded CE 5.0
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Feature
Description
Security
Standards
Wireless Equivalent Privacy (WEP)
Wi-Fi Protected Access (WPA)
IEEE 802.11i (WPA2)
Encryption
Wireless Equivalent Privacy (WEP, RC4 Algorithm)
Temporal Key Integrity Protocol (TKIP, RC4 Algorithm)
Advanced Encryption Standard (AES, Rijndael Algorithm)
Encryption Key Provisioning
Static (40-bit and 128-bit lengths)
Pre-Shared (PSK)
Dynamic
802.1X Extensible Authentication Protocol Types
EAP-FAST
EAP-TLS
EAP-TTLS
PEAP-GTC
PEAP-MSCHAPv2
PEAP-TLS
LEAP
Compliance
Note: These agency approvals are
pending.
ETSI Regulatory Domain
EN 300 328
EN 301 489-1
EN 301 489-17
EN 301 893
EN 60950-1
EU 2002/95/EC (RoHS)
FCC Regulatory Domain
FCC 15.247 DTS – 802.11b/g (Wi-Fi) – 2.4 GHz & 5.8 GHz
FCC 15.407 UNII – 802.11a (Wi-Fi) – 2.4 GHz & 5.4 GHz
Industry Canada
RSS-210 – 802.11a/b/g/n (Wi-Fi) – 2.4 GHz, 5.8 GHz, 5.2
GHz, and 5.4 GHz
MIC (Japan) Regulatory Domain (formerly TELEC)
Article 2 Item 19, Category WW (2.4GHz Channels 1-13)
Article 2 Item 19-2, Category GZ (2.4GHz Channel 14)
Article 2 Item 19-3 Category XW (5150-5250 W52 & 5250-
5350 W53)
Certifications
Summit is not pursuing agency, Wi-Fi Alliance, or CCX
certifications for this radio at this time.
Warranty
One-Year Warranty
All specifications are subject to change without notice
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Recommended Operating Conditions and DC Electrical Characteristics
Symbol
Parameter
Min
Typ
Max
Unit
VBATT
DC Supply Voltage
(VBATT)
2.8
3.3
5.0
V
VCC
DC Supply Voltage
3.0
3.3
3.6
V
VDD_IO
DC Supply Voltage (I/O)
1.62
1.8
1.98
V
2.97
3.3
3.63
VIL
Low Level Input Voltage
(VDDO = 3.3V)
-
-
0.8
V
VIH
High Level Input
Voltage (VDDO = 3.3V)
2.0
-
-
V
VIL
Low Level Input Voltage
(VDDO = 1.8V)
-
-
0.6
V
VIH
High Level Input
Voltage (VDDO = 1.8V)
1.1
-
-
V
VOL
Low Level Output
Voltage (100 µA load)
-
-
0.2
V
VOH
High Level Output
Voltage (-100 µA load)
VDDIO –
0.2V
-
-
V
IIL
Low Current Input
-
0.3
-
µA
IIH
High Current Input
-
0.3
-
µA
IOL
Low Current Output
(VDDO = 3.3V, VOL =
0.4V)
-
-
3.0
mA
IOH
High Current Output
(VDDO = 3.3V, VOH =
2.9V)
-
-
3.0
mA
CIN
Input Capacitance
-
-
5
pF
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SDIO Timing Diagrams
The following figure (Figure 2) and table display SDIO default mode timing.
Figure 1: SDIO Timing Diagram
Parameter
Symbol
Min
Typical
Max
Unit
Clock CLK (All values are referred to min. VIH and max. VIL)
Frequency – Data Transfer Mode
fPP
0
-
25
MHz
Frequency – Identification Mode
fOD
0
-
400
kHz
Clock Low Time
tWL
10
-
-
ns
Clock High Time
tWH
10
-
-
ns
Clock Rise Time
tTLH
-
-
10
ns
Clock Low Time
tTHL
-
-
10
ns
Inputs: CMD, DAT (referenced to CLK)
Input Setup Time
tISU
5
-
-
ns
Input Hold Time
tIH
5
-
-
ns
Outputs: CMD, DAT (referenced to CLK)
Output Delay time – Data Transfer Mode
tODLY
0
-
14
ns
Output Delay time – Identification Mode
tODLY
0
-
50
ns
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Pin Definitions
Note: In regards to GND (Ground) pins, only one must be tied down. The remaining pins identified as
GND can either be tied down or floated, depending on individual radio board design needs.
Pin
Number
Pin
Name
I/O
Voltage
Reference
Description
1
GND
-
Ground
2
GND
-
Ground
3
N/C
N/C
No Connect
4
N/C
N/C
No Connect
5
N/C
N/C
No Connect
6
N/C
N/C
No Connect
7
SYS_RST_L
I
VDDIO
Resets the radio, active low. Will be held low
for ~300nSec by a RC reset circuit when power
is applied. Do not connect when not used.
8
N/C
N/C
No Connect
9
N/C
N/C
No Connect
10
WL_GPIO_1
O
VDDIO
Wake on Wireless
Wake on Wireless is not currently supported in
the software. May be left open.
11
SDIO_SEL
I
VDDIO
SDIO Selection, hold low.
12
N/C
No Connect
13
VDDIO
-
3.3/1.8V I/O Power
This is the reference pin for all I/O signaling
pins.
It accepts 1.8VDC to 3.3VDC
14
CLK_32K
I
32k Ext Sleep Clock
Note: This pin should have a 100k pull-down
(resistor to ground).
15
SDIO_CLK
I
VDDIO
SDIO Input Clock from Host (50 MHz max)
External pull-up resistor is optional
16
GND
-I
Ground
17
SDIO_DATA_0
I/O
VDDIO
SDIO Data 0 – Internal pull-up.
External pull-up resistor required
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Pin
Number
Pin
Name
I/O
Voltage
Reference
Description
18
SDIO_DATA_2
I/O
VDDIO
SDIO Data 2 – Internal pull-up.
External pull-up resistor required
19
SDIO_CMD
I/O
VDDIO
SDIO Command – Internal pull-up.
External pull-up resistor required
20
SDIO_DATA_3
I/O
VDDIO
SDIO Data 3 – Internal pull-up.
External pull-up resistor required
21
SDIO_DATA_1
I/O
VDDIO
SDIO Data 1 – Internal pull-up.
External pull-up resistor required
22
N/C
N/C
No Connect
23
N/C
N/C
No Connect
24
BT_ACTIVE
I/O
VDDIO
No connect
Not currently supported in the firmware.
When not in use, leave open (float).
25
BT_PRIORITY
I/O
VDDIO
No connect
Not currently supported in the firmware.
When not in use, leave open (float).
26
GND
-
Ground
27
VCC3_3
-
3.3V Module Power
28
VCC3_3
-
3.3V Module Power
29
VIN_IP2LDO-L
O
Unsupported direct battery power output.
Connect to Pin 30 with a 3.3uH inductor.
30
VIN_1P2LDO
I
Unsupported direct battery power input.
Connect to Pin 29 with a 3.3uH inductor.
31
CHIP_PWD_L
I
VDDIO
Powers down the radio, active low;
4.7K pull-up resistor to VDDIO is recommended
32
BT_FREQ
I
VDDIO
Input from BT device.
Indicates that the coexistence BT is about to
transmit on a restricted channel
Tie to GND when not in use
33
WLAN_ACTIVE
O
VDDIO
Output to BT device. When high, indicates that
WLAN is transmitting or receiving.
Do not connect when not used
34
GND
-
Ground
35
GND
-
Ground
36
N/C
N/C
No Connect
37
GND
-
Ground
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Pin
Number
Pin
Name
I/O
Voltage
Reference
Description
38
N/C
N/C
No Connect
39
N/C
N/C
No Connect
40
GND
-
Ground
41
GND
-I
Ground
42
GND
-
Ground
43
N/C
N/C
No Connect
44
N/C
N/C
No Connect
45
GND
-
Ground
46
GND
-
Ground
47
GND
-
Ground
48
GND
-
Ground
49
N/C
N/C
No Connect
50
N/C
N/C
No Connect
51
N/C
N/C
No Connect
52
N/C
N/C
No Connect
53
N/C
N/C
No Connect
54
GND
-
Ground
55
GND
-
Ground
56
ANT_1
I/O
Antenna 1 (Main)
57-66
GND
-
Ground
Integration Considerations
The following Wi-Fi information should be taken into consideration when integrating the SSD40L.
Wi-Fi
Series resistors are recommended in all six SDIO lines (27-56 ohms typically):
SDIO_CLK
SDIO_CMD
SDIO_DATA_0
SDIO_DATA_1
SDIO_DATA_2
SDIO_DATA_3
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Note: Although these values may vary with the properties of your host interface and the PCB, they are a
reasonable starting point.
Note: The series resistors in the SDIO bus provide several design benefits:
- If a host controller has too high of a drive strength, then bus ringing may result. Series resistors
can reduce this ringing on the I/O lines.
- Adding 27-56 ohms of series resistance on the SDIO bus will reduce sharp transitional edges,
which may reduce EMI.
- Having the series resistors in the PCB layout allows for design flexibility; If they are later found to
be unnecessary, zero (0) ohm jumpers may be used in their place
The following are also recommended:
47 K ohm pull-ups on the CMD line and four data lines: SDIO_CMD, SDIO_DATA_0, SDIO_DATA_1,
SDIO_DATA_2, SDIO_DATA_3
Note: No pull-up is required on the CLK line.
Note: Make sure to apply the proper voltage on the VDDIO input to the SiP to match the signaling
voltage of the SDIO host interface (1.8V or 3.3V typically, but it can be anything in between these
values).
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Mechanical Specifications
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Mounting
Summit specializes in the design and manufacturing of Wi-Fi radio modules and cards. Although we
understand that every system is different, our expertise does not extend to the system level. Because of
this, we can provide only integration guidelines and not individual design reviews and approvals.
The SDC-SSD40L is a Quad Flat pack with No Leads (QFN) System in Package (SiP). Summit has
mounted this device to a PCB with a host and antenna connectors and markets that radio module as the
SDC-MSD40L. The following information results from Summit’s experience in producing the SDC-
MSD40NBT. Summit provides these data for informational purposes only and provides no warranties or
claims with regard to the applicability of this information to a particular design.
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Solder Stencil Opening for Pads: 1:1 to 1:0.9 (dependent on
solder type)
Solder Paste Type: No-Clean as the soldered part to board
clearance will not allow for adequate post solder cleaning.
Rework is technically challenging due to parts on the SIP
reflowing at the same temperature needed for rework. The
SDC-SSD40L cannot be lifted by the shield during rework.
As such, removal of part for rework is not recommended.
Reflow without removal has been successfully used to clear
shorts found during x-ray inspection.
Reflow: The SDC-SSD40L is RoHS compliant and as such is
sensitive to heat. The below graphic details a typical profile for such and device and is provided for
reference purposes.
.
RF Layout Design Guidelines
The following is a list of RF layout design guidelines and recommendation when installing a Summit radio
into your device.
Do not run antenna cables directly above or directly below the radio.
Do not place any parts or run any high speed digital lines below the radio.
If there are other radios or transmitters located on the device (such as a Bluetooth radio), place the
devices as far apart from each other as possible.
Ensure that there is the maximum allowable spacing separating the antenna connectors on the
Summit radio from the antenna. In addition, do not place antennas directly above or directly below the
radio.
Summit recommends the use of a double shielded cable for the connection between the radio and the
antenna elements.
Footprint from the
Summit MSD30/40 PCB
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Regulatory
Summit has received a Limited Modular Approval for this radio with the limitation that it must essentially
be mounted on an MSD40L layout in order to have the Summit FCC ID attached to the device.
Design Implementation Requirements
Documentation Requirements
Design Implementation Requirements
To ensure regulatory compliance when integrating the SDC-SSD40L (Model # SDC-SSD40L) into a host
device, it is necessary to follow the design implementation requirements listed below in order to have the
Summit certification ID (FCC, IC, and ETSI) applied to the device.
A. Circuit design and components selection considerations
When integrating the SDC-SSD40L (Model # SDC-SSD40L) into customer’s device, please follow the
schematic shown in appendix A. There are several key and critical implementations and components
need to exactly followed to have Summit certification ID (FCC, IC, and ETSI…) applied to the device.
REFDES
DESCRIPTION
MANUFACTURER
MANUFACTURER_PN
C1, C3, C4
CAP CERM 0.10UF 50V X7R 0603
KEMET
C0603C104K5RACTU
C2, C6
CAP CERM 100PF
TDK CORP
445-1281-1-ND
C5, C7
CAP CERM 2.2UF
AVX CORP
478-6212-1-ND
D1
DIODE SS 100V 4.0NS SOD-323F
FAIRCHILD
1N4148WS
D2
PROTECTION DIODE
LITTLEFUSE INC
PGB1010603MR
FB1, FB2
FERRITE CHIP 330 OHM 1200MA
0603
MURATA
BLM18PG331SN1D
J2
CONN RECEPT 60POS 1.5MM SMD
0.5MM
MOLEX
54722-0607-C
J1
CONN RECPT ULTRA-MINI COAX
SMD
HIROSE
U.FL-R-SMT(10)
L1
IND 3.3UH
TDK CORP
VLS3012T-3R3M1R3
R5
RES 0.0 OHM 1/10W 5% 0603 SMD
ROHM
MCR03EZPJ000
R4, R6
RES 0.0 OHM 1/10W 5% 0603 SMD
ROHM
MCR03EZPJ000
R1, R2
RES 4.7K OHM 1/10W 5% 0603 SMD
ROHM
MCR03EZPJ472
R3
RES 10K OHM 1/10W 5% 0603 SMD
ROHM
RC0603JR-0710KL
U1
MODULE XCVR 802.11A/B/G/N
BLUETOOTH SDIO
SUMMIT DATA
SDC-SSD40L
Antenna
CISCO Aironet 2.4GHz Dipole antenna
CISCO
AIR-ANT4941
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B. PCB layout considerations
The PCB board stack is shown below using 2-Layer FR4, lead-free solder finish plating, green solder
mask on both sides and white silkscreen on both sides.
Gerber files are shown below in detail.
Figure 2: Components placement and trace route on the top layer. Via hole is of 10 mils size
Figure 3: Components location of the top layer
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Figure 4: Bottom layer
On the bottom layer, a complete ground plane under the SSD40L is must to ensure the rf signal is
well referenced. Also, the RF trace impedance between the SDC-SSD40L (Pin 56) and the antenna
connector (J1) should be controlled within 50 ohm +/-10% and keep the trace as short as possible
(recommend less than 100 mils) to reduce the trace lose. Place 10 mils through via hole with distance
40 mil around the RF connector (J1) and beside the RF trace to avoid the possible radiation for
harmonic signal.
C. Antenna Specification
An external dipole antenna was tested with SSD40L to get Summit certification ID (FCC, IC, and
ETSI). Detail information will be obtained on
http://www.cisco.com/en/US/docs/wireless/antenna/installation/guide/4941.html
Note: Section 15.203 of the FCC Rules requires a unique antenna connector between the modular
transmitter and the chosen antenna. The specified antenna meets this requirement since it
uses a reverse polarity TNC connector but a length of antenna cable must be provided
between the MMCX modular transmitter connector and the reverse polarity TNC connector on
the antenna.
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D. Design and testing verification for ensuring compliance
Follow the reference design using the same components as when integrating the SDC-SSD40L.
Use the same PCB material (FR4) with the same board stake thickness (0.062”).
The RF trace between the SDC-SSD40L (Pin 56) and the antenna connector (J1) should be
controlled within 50 ohm +/-10%; keep the trace as short as possible (less than 100 mils is
recommended) to reduce the trace loss.
Place 10 mils through via hole with 40 miles distance apart.
Use TDR to confirm the RF trace is within 50 ohm +/-10%.
Use the spectrum analyzer to confirm the radiate signal is within the certification limit.
Documentation Requirements
In order to ensure regulatory compliance, when integrating the SDC-SSD40L (Model # SDC-SSD40L)
into a host device, it is necessary to meet the documentation requirements set forth by the applicable
regulatory agencies. The following sections (FCC, Industry Canada, and European Union) outline the
information that may be included in the user’s guide and external labels for the host devices into which
the SDC-SSD40L is integrated.
FCC
Note: You must place “Contains FCC ID: TWG-SDCSSD40L” on the host product in such a location that
it can be seen by an operator at the time of purchase.
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User’s Guide Requirements
As outlined in the Operational Description, the SDC-SSD40L complies with FCC Part 15 Rules for a
Modular Approval. To leverage Summit’s grant, the conditions below must be met for the host device
into which the SDC-SSD40L is integrated:
1. The antenna is installed with 20 cm maintained between the antenna and users.
2. The transmitter module is not co-located with any other transmitter or antenna that is capable of
simultaneous operation.
3. The antenna used must be a dipole antenna of gain equal to or less than 2dBi.
As long as the conditions above are met, further transmitter testing is typically not required. However,
the OEM integrator is still responsible for testing its end-product for any additional compliance
requirements required with this module installed, such as (but not limited to) digital device emissions
and PC peripheral requirements.
IMPORTANT!
In the event that the three conditions above cannot be met (for example certain
device configurations or co-location with another transmitter), then the FCC
authorization is no longer considered valid and the FCC ID cannot be used on the
final product. In these circumstances, the OEM integrator will be responsible for re-
evaluating the end product (including the transmitter) and obtaining a separate FCC
authorization.
When using Summit’s FCC grant for the SDC-SSD40L, the integrator must include specific information in
the user’s guide for the device into which the SDC-SSD40L is integrated. The integrator must not provide
information to the end user regarding how to install or remove this RF module in the user’s manual of the
device into which the SDC-SSD40L is integrated. The following FCC statements must be added in their
entirety and without modification into a prominent place in the user’s guide for the device into which the
SDC-SSD40L is integrated:
“IMPORTANT NOTE: To comply with FCC RF exposure compliance requirements, the antenna used
for this transmitter must be installed to provide a separation distance of at least 20 cm from all
persons and must not be co-located or operating in conjunction with any other antenna or
transmitter.”
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one of the following measures:
1. Reorient or relocate the receiving antenna.
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2. Increase the separation between the equipment and receiver.
3. Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
4. Consult the dealer or an experienced radio/TV technician for help.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
IMPORTANT NOTE: FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm between
the radiator & your body.
Industry Canada
Note: You must place “Contains IC ID: 6616A-SDCSSD40L” on the host product in such a location that it
can be seen by an operator at the time of purchase.
User’s Guide Requirements (for Model # SDC-SSD40L)
RF Radiation Hazard Warning
To ensure compliance with FCC and Industry Canada RF exposure requirements, this device must be
installed in a location where the antennas of the device will have a minimum distance of at least 20 cm
from all persons. Using higher gain antennas and types of antennas not certified for use with this product
is not allowed. The device shall not be co-located with another transmitter.
Installez l'appareil en veillant à conserver une distance d'au moins 20 cm entre les éléments rayonnants
et les personnes. Cet avertissement de sécurité est conforme aux limites d'exposition définies par la
norme CNR-102 at relative aux fréquences radio.
Maximum Antenna Gain – If the integrator configures the device such that the antenna is
detectable from the host product.
This radio transmitter (IC ID: 6616A-SDCSSD40L) has been approved by Industry Canada to operate
with the antenna types listed below with the maximum permissible gain and required antenna impedance
for each antenna type indicated. Antenna types not included in this list, having a gain greater than the
maximum gain indicated for that type, are strictly prohibited for use with this device.
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Le présent émetteur radio (IC ID: 6616A-SDCSSD40L) a été approuvé par Industrie Canada pour
fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal et
l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont
le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type
and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio
interference to other users, the antenna type and its gain should be so chosen that the equivalent
isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec
une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada.
Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut
choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne
dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the
following two conditions: (1) this device may not cause interference, and (2) this device must accept any
interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts
de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire
de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement.
European Union
User’s Guide Requirements
The integrator must include specific information in the user’s guide for the device into which the SDC-
SSD40L is integrated. In addition to the required FCC and IC statements outlined above, the following
R&TTE statements must be added in their entirety and without modification into a prominent place in the
user’s guide for the device into which the SDC-SSD40L is integrated:
This device complies with the essential requirements of the R&TTE Directive 1999/5/EC. The
following test methods have been applied in order to prove presumption of conformity with the
essential requirements of the R&TTE Directive 1999/5/EC:
EN60950-1:2001 A11:2004
Safety of Information Technology Equipment
EN 300 328 V1.7.1: (2006-10)
Electromagnetic compatibility and Radio spectrum Matters (ERM); Wideband Transmission
systems; Data transmission equipment operating in the 2,4 GHz ISM band and using spread
spectrum modulation techniques; Harmonized EN covering essential requirements under article
3.2 of the R&TTE Directive
EN 301 489-1 V1.6.1: (2005-09)
Electromagnetic compatibility and Radio Spectrum Matters (ERM); ElectroMagnetic Compatibility
(EMC) standard for radio equipment and services; Part 1: Common technical requirements
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EN 301 489-17 V1.2.1 (2002-08)
Electromagnetic compatibility and Radio spectrum Matters (ERM); ElectroMagnetic Compatibility
(EMC) standard for radio equipment and services; Part 17: Specific conditions for 2,4 GHz
wideband transmission systems and 5 GHz high performance RLAN equipment
EN 301 893 V1.5.1 (2008-12)
Electromagnetic compatibility and Radio spectrum Matters (ERM); Broadband Radio Access
Networks (BRAN); Specific conditions for 5 GHz high performance RLAN equipment
EU 2002/95/EC (RoHS)
Declaration of Compliance – EU Directive 2003/95/EC; Reduction of Hazardous Substances
(RoHS)
This device is a 2.4 GHz wideband transmission system (transceiver), intended for use in all EU
member states and EFTA countries, except in France and Italy where restrictive use applies.
In Italy the end-user should apply for a license at the national spectrum authorities in order to obtain
authorization to use the device for setting up outdoor radio links and/or for supplying public access to
telecommunications and/or network services.
This device may not be used for setting up outdoor radio links in France and in some areas the RF
output power may be limited to 10 mW EIRP in the frequency range of 2454 – 2483.5 MHz. For
detailed information the end-user should contact the national spectrum authority in France.
Česky
[Czech]
[Jméno výrobce] tímto prohlašuje, že tento [typ zařízení] je ve shodě se základními
požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES.
Dansk
[Danish]
Undertegnede [fabrikantens navn] erklærer herved, at følgende udstyr [udstyrets
typebetegnelse] overholder de væsentlige krav og øvrige relevante krav i direktiv
1999/5/EF.
Deutsch
[German]
Hiermit erklärt [Name des Herstellers], dass sich das Gerät [Gerätetyp] in
Übereinstimmung mit den grundlegenden Anforderungen und den übrigen
einschlägigen Bestimmungen der Richtlinie 1999/5/EG befindet.
Eesti
[Estonian]
Käesolevaga kinnitab [tootja nimi = name of manufacturer] seadme [seadme tüüp =
type of equipment] vastavust direktiivi 1999/5/EÜ põhinõuetele ja nimetatud
direktiivist tulenevatele teistele asjakohastele sätetele.
English
Hereby, [name of manufacturer], declares that this [type of equipment] is in
compliance with the essential requirements and other relevant provisions of Directive
1999/5/EC.
Español
[Spanish]
Por medio de la presente [nombre del fabricante] declara que el [clase de equipo]
cumple con los requisitos esenciales y cualesquiera otras disposiciones aplicables o
exigibles de la Directiva 1999/5/CE.
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Ελληνική
[Greek]
ΜΕ ΤΗΝ ΠΑΡΟΥΣΑ [name of manufacturer] ΔΗΛΩΝΕΙ ΟΤΙ [type of equipment]
ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ ΟΥΣΙΩΔΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ ΤΙΣ ΛΟΙΠΕΣ
ΣΧΕΤΙΚΕΣ ΔΙΑΤΑΞΕΙΣ ΤΗΣ ΟΔΗΓΙΑΣ 1999/5/ΕΚ.
Français
[French]
Par la présente [nom du fabricant] déclare que l'appareil [type d'appareil] est
conforme aux exigences essentielles et aux autres dispositions pertinentes de la
directive 1999/5/CE.
Italiano
[Italian]
Con la presente [nome del costruttore] dichiara che questo [tipo di apparecchio] è
conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla
direttiva 1999/5/CE.
Latviski
[Latvian]
Ar šo [name of manufacturer / izgatavotāja nosaukums] deklarē, ka [type of
equipment / iekārtas tips] atbilst Direktīvas 1999/5/EK būtiskajām prasībām un citiem
ar to saistītajiem noteikumiem.
Lietuvių
[Lithuanian]
Šiuo [manufacturer name] deklaruoja, kad šis [equipment type] atitinka esminius
reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas.
Nederlands
[Dutch]
Hierbij verklaart [naam van de fabrikant] dat het toestel [type van toestel] in
overeenstemming is met de essentiële eisen en de andere relevante bepalingen van
richtlijn 1999/5/EG.
Malti
[Maltese]
Hawnhekk, [isem tal-manifattur], jiddikjara li dan [il-mudel tal-prodott] jikkonforma
mal-ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-Dirrettiva
1999/5/EC.
Magyar
[Hungarian]
Alulírott, [gyártó neve] nyilatkozom, hogy a [... típus] megfelel a vonatkozó alapvetõ
követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak.
Polski
[Polish]
Niniejszym [nazwa producenta] oświadcza, że [nazwa wyrobu] jest zgodny z
zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami Dyrektywy
1999/5/EC.
Português
[Portuguese]
[Nome do fabricante] declara que este [tipo de equipamento] está conforme com os
requisitos essenciais e outras disposições da Directiva 1999/5/CE.
Slovensko
[Slovenian]
[Ime proizvajalca] izjavlja, da je ta [tip opreme] v skladu z bistvenimi zahtevami in
ostalimi relevantnimi določili direktive 1999/5/ES.
Slovensky
[Slovak]
[Meno výrobcu] týmto vyhlasuje, že [typ zariadenia] spĺňa základné požiadavky a
všetky príslušné ustanovenia Smernice 1999/5/ES.
Suomi
[Finnish]
[Valmistaja = manufacturer] vakuuttaa täten että [type of equipment = laitteen
tyyppimerkintä] tyyppinen laite on direktiivin 1999/5/EY oleellisten vaatimusten ja sitä
koskevien direktiivin muiden ehtojen mukainen.
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Svenska
[Swedish]
Härmed intygar [företag] att denna [utrustningstyp] står I överensstämmelse med de
väsentliga egenskapskrav och övriga relevanta bestämmelser som framgår av
direktiv 1999/5/EG.