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AH3-W
Version:
DocId:
01.000
AH3-W_HD_v01.000
Hardware Interface Overview

AH3-W Hardware Interface Overview

Document Name:
AH3-W Hardware Interface Overview
Version:
01.000
Date:
2012-05-29
DocId:
AH3-W_HD_v01.000
Status
Confidential / Released
GENERAL NOTE
THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE N OTE PR OVIDED TOGETHER WITH PRODUCT. IN ANY
EVENT THE PROVISIONS OF THE RELEA SE NO TE SHALL PREVAIL. TH IS DOCUMENT CONTAINS INFORMATION ON CINTERION PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT
ARE S UBJECT TO CHA NGE AT CINTERION'S DISCRETION. CINTERION WIRE LESS MODULES
GMBH GRANTS A NON-EXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT
TRANSFER, COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS;
DISASSEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT
AS SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN
"AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM
EXTENT P ERMITTED BY APPLICABLE LAW, CI NTERION WIRELESS MOD ULES GMBH DISCLAIMS ALL WARRANTIES AND LIABILITIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED
PERIOD OF TIME TO OBSERVE SECRECY REGA RDING ANY INFORMAT ION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELI VERY OF THE PRODUCT. THIS GENERAL NOTE
SHALL BE GOVERNED AND CONSTRUED ACCORDING TO GERMAN LAW.
Copyright
Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will
be held liable for payment of damages. All rights created by patent grant or registration of a utility model
or design patent are reserved.
Copyright © 2012, Cinterion Wireless Modules GmbH
Trademark Notice
Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the
United States and/or other countries. All other registered trademarks or trademarks mentioned in this
document are property of their respective owners.
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Contents
42

Contents
Introduction ................................................................................................................. 6
1.1
Related Documents ........................................................................................... 6
1.2
Terms and Abbreviations ................................................................................... 6
1.3
Regulatory and Type Approval Information ....................................................... 9
1.3.1 Directives and Standards...................................................................... 9
1.3.2 SAR requirements specific to portable mobiles .................................. 12
1.3.3 SELV Requirements ........................................................................... 13
1.3.4 Safety Precautions.............................................................................. 13
Product Concept ....................................................................................................... 15
2.1
Key Features at a Glance ................................................................................ 15
2.2
AH3-W System Overview ................................................................................ 18
Application Interface................................................................................................. 19
3.1
Operating Modes ............................................................................................. 20
3.2
Power Supply................................................................................................... 21
3.3
USB Interface................................................................................................... 22
3.4
Serial Interface ASC0 ...................................................................................... 23
3.5
UICC/SIM/USIM Interface................................................................................ 25
3.6
Analog Audio Interface..................................................................................... 27
3.7
Pulse Code Modulation Interface (PCM) ......................................................... 27
3.8
Analog-to-Digital Converter (ADC)................................................................... 27
3.9
GPIO Interface ................................................................................................. 27
GPS Receiver............................................................................................................. 28
Antenna Interfaces.................................................................................................... 29
5.1
GSM/UMTS Antenna Interface ........................................................................ 29
5.1.1 RF Antenna Pad ................................................................................. 29
5.1.1.1 Pogo Pins............................................................................ 30
5.2
GPS Antenna Interface .................................................................................... 32
Mechanics.................................................................................................................. 33
6.1
Mechanical Dimensions of AH3-W .................................................................. 33
6.2
Mounting AH3-W to the Application Platform................................................... 35
6.3
Board-to-Board Application Connector ............................................................ 35
Reference Approval .................................................................................................. 39
7.1
Reference Equipment for Type Approval......................................................... 39
7.2
Compliance with FCC and IC Rules and Regulations ..................................... 40
Appendix.................................................................................................................... 41
8.1
List of Parts and Accessories........................................................................... 41
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Ta bles

Tables
Table 1:
Table 2:
Table 3:
Table 4:
Table 5:
Table 6:
Table 7:
Table 8:
Table 9:
Table 10:
Table 11:
Table 12:
Table 13:
Table 14:
Directives ......................................................................................................... 9
Standards of North American type approval .................................................... 9
Standards of European type approval.............................................................. 9
Requirements of quality ................................................................................. 10
Standards of the Ministry of Information Industry of the
People’s Republic of China ............................................................................ 10
Toxic or hazardous substances or elements with defined concentration
limits ............................................................................................................... 11
Overview of operating modes ........................................................................ 20
DCE-DTE wiring of ASC0 .............................................................................. 24
Signals of the SIM interface (board-to-board connector) ............................... 25
Return loss in the active band........................................................................ 29
Pogo pins characteristics ............................................................................... 30
Technical specifications of Molex board-to-board connector ......................... 36
List of parts and accessories.......................................................................... 41
Molex sales contacts (subject to change) ...................................................... 42
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AH3-W Hardware Interface Overview
Figures

Figures
Figure 1:
Figure 2:
Figure 3:
Figure 4:
Figure 5:
Figure 6:
Figure 7:
Figure 8:
Figure 9:
Figure 10:
Figure 11:
Figure 12:
Figure 13:
AH3-W system overview ................................................................................
USB circuit .....................................................................................................
Serial interface ASC0.....................................................................................
UICC/SIM/USIM interface ..............................................................................
RF antenna pad size ......................................................................................
Pogo pins dimensions ....................................................................................
Exploded view of module’s antenna pads mounted on Pogo pins.................
AH3-W – top view .........................................................................................
Dimensions of AH3-W (all dimensions in mm)...............................................
Mating board-to-board connector 53748-0808 on application .......................
Molex board-to-board connector 52991-0808 on AH3-W ..............................
Mating board-to-board connector 53748-0808 on application .......................
Reference equipment for type approval .........................................................
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18
22
23
26
29
30
31
33
34
36
37
38
39
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AH3-W Hardware Interface Overview
1 Introduction
14

Introduction
The document1 describes the hardware of the AH3-W module, designed to connect to a cellular
device application and the air interf ace. It helps you quickly retrieve interface specifications,
electrical and mechanical details and information on the requirements to be considered for integrating further components.
1.1
[1]
[2]
Related Documents
AH3-W AT Command Set
AH3-W Release Notes
1.2
Terms and Abbreviations
Abbreviation
Description
ANSI
American National Standards Institute
AMR
Adaptive Multirate
ARP
Antenna Reference Point
B2B
Board-to-board connector
BB
Baseband
BEP
Bit Error Probability
BTS
Base Transceiver Station
CB or CBM
Cell Broadcast Message
CE
Conformité Européene (European Conformity)
CS
Coding Scheme
CS
Circuit Switched
CSD
Circuit Switched Data
DAC
Digital-to-Analog Converter
DCS
Digital Cellular System
DL
Download
DRX
Discontinuous Reception
DSB
Development Support Board
DSP
Digital Signal Processor
DTMF
Dual Tone Multi Frequency
1.
The do cument is e ffective o nly i f l isted in th e appropriate Rel ease Notes as p art of th e techn ical
documentation delivered with your Cinterion Wireless Modules product.
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1.2 Terms and Abbreviations
14

Abbreviation
Description
DTX
Discontinuous Transmission
EDGE
Enhanced Data rates for GSM Evolution
EFR
Enhanced Full Rate
EGSM
Enhanced GSM
EMC
Electromagnetic Compatibility
ERP
Effective Radiated Power
ESD
Electrostatic Discharge
ETS
European Telecommunication Standard
ETSI
European Telecommunications Standards Institute
FCC
Federal Communications Commission (U.S.)
FDD
Frequency Division Duplex
FDMA
Frequency Division Multiple Access
FR
Full Rate
GPRS
General Packet Radio Service
GSM
Global Standard for Mobile Communications
HiZ
High Impedance
HSDPA
High Speed Downlink Packed Access
HR
Half Rate
I/O
Input/Output
IF
Intermediate Frequency
IMEI
International Mobile Equipment Identity
ISO
International Standards Organization
ITU
International Telecommunications Union
kbps
kbits per second
LED
Light Emitting Diode
Mbps
Mbits per second
MCS
Modulation and Coding Scheme
MO
Mobile Originated
MS
Mobile Station, also referred to as TE
MT
Mobile Terminated
NTC
Negative Temperature Coefficient
PBCCH
Packet Switched Broadcast Control Channel
PCB
Printed Circuit Board
PCL
Power Control Level
PCM
Pulse Code Modulation
PCS
Personal Communication System, also referred to as GSM 1900
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1.2 Terms and Abbreviations
14
Abbreviation
Description
PS
Packet Switched
PDU
Protocol Data Unit
PSK
Phase Shift Keying
QAM
Quadrature Amplitude Modulation
R&TTE
Radio and Telecommunication Terminal Equipment
RACH
Random Access Channel
RF
Radio Frequency
RTC
Real Time Clock
Rx
Receive Direction
SAR
Specific Absorption Rate
SELV
Safety Extra Low Voltage
SIM
Subscriber Identification Module
SLIC
Subscriber Line Interface Circuit
SMPL
Sudden momentary power loss
SMS
Short Message Service
SRAM
Static Random Access Memory
SRB
Signalling Radio Bearer
TA
Terminal adapter (e.g. GSM module)
TDMA
Time Division Multiple Access
TE
Terminal Equipment
TS
Technical Specification
Tx
Transmit Direction
UL
Upload
UMTS
Universal Mobile Telecommunications System
URC
Unsolicited Result Code
USB
Universal Serial Bus
UICC
USIM Integrated Circuit Card
USIM
UMTS Subscriber Identification Module
WCDMA
Wideband Code Division Multiple Access
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1.3 Regulatory and Type Approval Information
14
1.3
Regulatory and Type Approval Information
1.3.1
Directives and Standards

AH3-W has been designed to comply with the directives and standards listed below.
It is the responsibility of the application manufacturer to ensure compliance of the final product
with all provisions of the applicable directives and standards as well as with the technical specifications provided in the "AH3-W Hardware Interface Description".1
Table 1: Directives
99/05/EC
Directive of the European Parliament and of the council of 9 March 1999 on
radio equipment and telecommunications terminal equipment and the
mutual recognition of their conformity (in short referred to as R&TTE Directive 1999/5/EC).
The product is labeled with the CE conformity mark
ECE-R 10
Economic Commission for Europe (ECE) Regulation No. 10: Uniform provisions concerning the approval of vehicles with regard to electromagnetic
compatibility
2002/95/EC
Directive of the European Parliament and of the Council of
27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(RoHS)
Table 2: Standards of North American type approval
CFR Title 47
Code of Federal Regulations, Part 22, Part 24 and Part 27; US Equipment
Authorization FCC
OET Bulletin 65
(Edition 97-01)
Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic Fields
UL 60 950-1
Product Safety Certification (Safety requirements)
NAPRD.03 V5.9
Overview of PCS Type certification review board Mobile Equipment Type
Certification and IMEI control
PCS Type Certification Review board (PTCRB)
RSS132, RSS133,
RSS139
Canadian Standard
Table 3: Standards of European type approval
3GPP TS 51.010-1
Digital cellular telecommunications system (Release 7); Mobile Station
(MS) conformance specification;
ETSI EN 301 511 V9.0.2 Global System for Mobile communications (GSM); Harmonized standard for
mobile stations in the GSM 900 and DCS 1800 bands covering essential
requirements under article 3.2 of the R&TTE directive (1999/5/EC)
GCF-CC V3.43.1
1.
Global Certification Forum - Certification Criteria
Manufacturers of applications which can be used in the US shall ensure that their applications have a
PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module.
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1.3 Regulatory and Type Approval Information
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
Table 3: Standards of European type approval
ETSI EN 301 489-01
V1.8.1
Electromagnetic Compatibility and Radio spectrum Matters (ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services;
Part 1: Common Technical Requirements
ETSI EN 301 489-07
V1.3.1
Electromagnetic Compatibility and Radio spectrum Matters (ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services;
Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular radio telecommunications systems (GSM and DCS)
ETSI EN 301 489-24
V1.4.1
Electromagnetic Compatibility and Radio spectrum Matters (ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services;
Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for
Mobile and portable (UE) radio and ancillary equipment
ETSI EN 301 908-01
V4.2.1
Electromagnetic compatibility and Radio spectrum Matters (ERM); Base
Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation cellular networks; Part 1: Harmonized EN for IMT-2000, introduction and common requirements of article 3.2 of the R&TTE Directive
ETSI EN 301 908-02
V4.2.1
Electromagnetic compatibility and Radio spectrum Matters (ERM); Base
Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation cellular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct Spread
(UTRA FDD) (UE) covering essential requirements of article 3.2 of the
R&TTE Directive
EN 62311:2008
Assessment of electronic and electrical equipment related to human exposure restrictions for electromagnetic fields (0 Hz - 300 GHz)
IEC/EN 60950-1:2006
Safety of information technology equipment
Table 4: Requirements of quality
IEC 60068
Environmental testing
DIN EN 60529
IP codes
VDA Hands-free
VDA Specification for Car Hands-free Terminals, Draft, December 2004,
v1.5
Table 5: Standards of the Ministry of Information Industry of the People’s Republic of China
SJ/T 11363-2006
“Requirements for Concentration Limits for Certain Hazardous Substances
in Electronic Information Products” (2006-06).
SJ/T 11364-2006
“Marking for Control of Pollution Caused by Electronic
Information Products” (2006-06).
According to the “Chinese Administration on the Control of
Pollution caused by Electronic Information Products”
(ACPEIP) the EPUP, i.e., Environmental Protection Use
Period, of this product is 20 years as per the symbol
shown here, unless otherwise marked. The EPUP is valid only as long as
the product is operated within the operating limits described in the Cinterion
Hardware Interface Description.
Please see Table 6 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the
limits defined by SJ/T 11363-2006.
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
Table 6: Toxic or hazardous substances or elements with defined concentration limits
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1.3.2

SAR requirements specific to portable mobiles
Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module
must be in accordance with the guidelines for human exposure to radio frequency energy. This
requires the Specific Absorption Rate (SAR) of portable AH3-W based applications to be evaluated and approved for compliance with national and/or international regulations.
Since the SAR value varies significa ntly with the individual product design manufacturers are
advised to submit their product for approval if designed for portable use. For European and USmarkets the relevant directives are mentioned below. It is the responsibility of the manufacturer
of the final product to verify whether or not further standards, recommendations or directives
are in force outside these areas.
Products intended for sale on US markets
ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to electromagnetic
fields (EMFs) from mobile telecommunication equipment (MTE) in the
frequency range 30MHz - 6GHz
Products intended for sale on European markets
EN 50360
Product standard to demonstrate the compliance of mobile phones with
the basic restrictions related to human exposure to electromagnetic
fields (300MHz - 3GHz)
IMPORTANT:
Manufacturers of portable applications based on AH3-W modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate related
to the specific portable mobile. See also Section 7.2.
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1.3.3

SELV Requirements
The power supply connected t o the AH3-W module shall be in compliance with the SELV requirements defined in EN 60950-1.
1.3.4
Safety Precautions
The following safety precautions must be observed during all phases of the operation, usage,
service or repair of any cellular terminal or mobile incorporating AH3-W. Manufacturers of the
cellular terminal are advised to convey the following safety information to users and operating
personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Cinte rion Wirele ss Modules a ssumes no liability for cu stomer’s
failure to comply with these precautions.
When in a hospital or other health care facility, observe the restrictions on the use of
mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guidelines posted in sensitive areas. Medical equipment may be sensitive to RF energy.
The operation of cardiac pacemakers, other implanted medical equipment and hearing
aids can be affected by interference from cellular terminals or mobiles placed close to
the device. If in doubt about potential danger, contact the physician or the manufacturer of the device to verify that the equipment is properly shielded. Pacemaker
patients are advised to keep their hand-held mobile away from the pacemaker, while
it is on.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it cannot be switched on inadvertently. The operation of wireless appliances in an aircraft is
forbidden to prevent interference with communications systems. Failure to observe
these instructions may lead to the suspension or denial of cellular services to the
offender, legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. Remember that interference can occur if it is used close to TV sets,
radios, computers or inadequately shielded equipment. Follow any special regulations
and always switch off the cellular terminal or mobile wherever forbidden, or when you
suspect that it may cause interference or danger.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for speakerphone operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
Speakerphones must be installed by qualified personnel. Faulty installation or operation can constitute a safety hazard.
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1.3 Regulatory and Type Approval Information
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
IMPORTANT!
Cellular terminals or mobiles operate using radio signals and cellular networks.
Because of this, connection cannot be guaranteed at all times under all conditions.
Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls.
Remember, in order to make or receive calls, the cellular terminal or mobile must be
switched on and in a service area with adequate cellular signal strength.
Some networks do not allow for emergency calls if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate
those features before you can make an emergency call.
Some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile.
Bear in mind that exposure to excessive levels of noise can cause physical damage
to users! With regard to acoustic shock, the cellular application must be designed to
avoid unintentional increase of amplification, e.g. for a highly sensitive earpiece. A protection circuit should be implemented in the cellular application.
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2 Product Concept
18
Product Concept
2.1
Key Features at a Glance
Feature

Implementation
General
Frequency bands
GSM/GPRS/EDGE: Quad band, 850/900/1800/1900MHz
UMTS/HSPA+: Quad band, 800/850/900/2100MHz
UMTS diversity: Triple band, 800/850/2100MHz
GSM class
Small MS
Output power (according to Class 4 (+33dBm ±2dB) for EGSM850
Release 99)
Class 4 (+33dBm ±2dB) for EGSM900
Class 1 (+30dBm ±2dB) for GSM1800
Class 1 (+30dBm ±2dB) for GSM1900
Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK
Class E2 (+27dBm ± 3dB) for GSM 900 8-PSK
Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK
Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK
Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdI
Class 3 (+24dBm +1/-3dB) for UMTS 900, WCDMA FDD BdVIII
Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV
Class 3 (+24dBm +1/-3dB) for UMTS 800, WCDMA FDD BdVI
Power supply
3.3V < VBATT+ < 4.2V
Operating temperature
(board temperature)
Normal operation: -30°C to +85°C
Restricted operation: -40°C to +95°C
Physical
Dimensions: 53mm x 33.9mm x 3.1mm (length x width x height)
Weight: approx. 10g
RoHS
All hardware components fully compliant with EU RoHS Directive
HSPA features
3GPP Release 6, 7
DL 14.4Mbps, UL 5.7Mbps
UE CAT. 1-12 supported
Compressed mode (CM) supported according to 3GPP TS25.212
UMTS features
3GPP Release 4
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CS data rate – 64 kbps DL / 64 kbps UL
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AH3-W Hardware Interface Overview
2.1 Key Features at a Glance
18
Feature

Implementation
GSM / GPRS / EGPRS features
Data transfer
GPRS:
• Multislot Class 12
• Full PBCCH support
• Mobile Station Class B
• Coding Scheme 1 – 4
EGPRS:
• Multislot Class 12
• EDGE E2 power class for 8 PSK
• Downlink coding schemes – CS 1-4, MCS 1-9
• Uplink coding schemes – CS 1-4, MCS 1-9
• SRB loopback and test mode B
• 8-bit, 11-bit RACH, PBCCH support
• 1 phase/2 phase access procedures
• Link adaptation and IR
• NACC, extended UL TBF
• Mobile Station Class B
CSD:
• V.110, RLP, non-transparent
• 14.4kbps
• USSD
SMS
Point-to-point MT and MO
Cell broadcast
Text and PDU mode
GPS Features
Protocol
NMEA
Modes
Standalone GPS
Assisted GPS
- Control plane - E911
- User plane - gpsOneXTRA™
General
Power saving modes
Power supply for active antenna
Software
Remote SIM Access
AH3-W supports Remote SIM Access. RSA enables AH3-W to use a
remote SIM card via its serial interface and an external application, in
addition to the SIM card locally attached to the dedicated lines of the
application interface. The connection between the external application
and the remote SIM card can be a Bluetooth wireless link or a serial link.
The necessary protocols and procedures are implemented according to
the “SIM Access Profile Interoperability Specification of the Bluetooth
Special Interest Group”.
AT commands
Hayes, 3GPP TS 27.007 and 27.005, and proprietary Cinterion Wireless
Modules commands
SIM Application Toolkit
SAT Release 99
Audio
Audio speech codecs
GSM: AMR, EFR, FR, HR
3GPP: AMR
Speakerphone operation (VDA), echo cancellation, noise suppression, 9
ringing tones, TTY support
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2.1 Key Features at a Glance
18

Feature
Implementation
Firmware update
Generic update from host application over ASC0 or USB
Interfaces
Module interface
80-pin board-to-board connector
Antenna
Antenna pads for contact springs.
MainGSM/UMTS antenna, diversity antenna,(active/passive) GPS
antenna
USB
USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s)
compliant
Serial interface
ASC0:
• 8-wire m odem in terface wit h st atus and co ntrol line s, un balanced,
asynchronous
• Adjustable baud rates from 9,600bps up to 921,600bps
• Supports autobauding
• Supports RTS0/CTS0 hardware flow control
• Multiplex ability according to GSM 07.10 Multiplexer Protocol
UICC interface
Supported chip cards: UICC/SIM/USIM 3V, 1.8V
Status
Signal pin to indicate network connectivity state
Audio
1 analog interface with microphone feeding
1 digital interface (PCM)
Power on/off, Reset
Power on/off
Switch-on by hardware pin IGT
Switch-off by AT command (AT^SMSO)
Automatic switch-off in case of critical temperature or voltage conditions.
Reset
Orderly shutdown and reset by AT command
Emergency-off
Emergency-off by hardware pin EMERG_OFF if IGT is not active.
Special Features
Phonebook
SIM and phone
TTY/CTM support
Integrated CTM modem
GPIO
10 I/O pins of the application interface programmable as GPIO.
Programming is done via AT commands.
GPIO5 and GPIO7 can be configured for antenna diagnosis,
GPIO 4 as host wakeup line and GPIO6 as low current indicator
ADC inputs
Analog-to-Digital Converter with two unbalanced analog inputs for (external) antenna diagnosis.
European Emergency Call
eCall 3GPP Release 8 compliant
RLS Monitoring
Jamming Detection
Antenna
SAIC (Single Antenna Interference Cancellation) / DARP (Downlink
Advanced Receiver Performance)
RX diversity (receiver type 3i - 16-QAM)
Evaluation kit
DSB75
AH3-W_HD_v01.000
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Cinterion Wireless Modules and provide a sample configuration for application engineering. A special adapter is required to connect the module
to the DSB75.
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2.2 AH3-W System Overview
18
2.2
AH3-W System Overview
GSM/UMTS
Antenna diversity
GPS antenna
Application
Antenna
diagnostic
Antenna
switch
8x
GPIO
Host application
USIM
Analog
audio
Power
supply
Digital
audio
SIM
card
PCM codec
Module
2x
ADC
Power for application
(VEXT)
Power indication
(PWR_IND)
Serial
ASC0
Modem interface
USB
2x
GPIO
GSM/UMTS
GPS
RTC
IGT,
Emergency Off
Net state/
status
or
On/Off
Figure 1: AH3-W system overview
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3 Application Interface
28

Application Interface
AH3-W is equipped with an 80-pin board-to-board connector that connects to the external application. The host interface incorporates several sub-interfaces described in the following sections:
•
•
•
•
•
•
•
•
•
•
Operating modes - see Section 3.1
Power supply - see Section 3.2
Serial interface USB - see Section 3.3
Serial interface ASC0 - Section 3.4
UICC/SIM/USIM interface - see Section 3.5
Analog audio interface - see Section 3.6
Pulse Code Modulation interface (PCM) - see Section 3.7
Analog-to-Digital Converter (ADC) - see Section 3.8
GPIO lines - see Section 3.9
Status and control lines: IGT, EMERG_OFF, PWR_IND, STATUS - see Table 27
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3.1 Operating Modes
28
3.1

Operating Modes
The table below briefly summarizes the various operating modes referred to in the following
chapters.
Table 7: Overview of operating modes
Mode
Function
Normal
GSM /
operation GPRS / UMTS /
HSPA SLEEP
Power saving set automatically when no call is in progressand the USB
connection is suspended by host or not present and no active communication via ASC0. Also, the GPS active antenna mode has to be turned
off or set to "auto".
GSM /
GPRS / UMTS /
HSPA IDLE
Power saving disabled (see [1]: AT^SCFG "MEopMode/PwrSave",), but no call in progress.
GSM TALK/
GSM DATA
Connection between two subscribers is in progress. Power consumption depends on the GSM network coverage and several connection
settings (e.g. DTX off/on, FR/EFR/HR, hopping sequences and
antenna connection). The following applies when power is to be measured in TALK_GSM mode: DTX off, FR and no frequency hopping.
GPRS DATA
GPRS data transfer in progress. Power consumption depends on network settings (e.g. power control level), uplink / downlink data rates and
GPRS configuration (e.g. used multislot settings).
EGPRS DATA
EGPRS data transfer in progress. Power consumption depends on network settings (e.g. power control level), uplink / downlink data rates and
EGPRS configuration (e.g. used multislot settings).
UMTS TALK/
UMTS DATA
UMTS data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate.
HSPA DATA
HSPA data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate.
Power
Down
Normal shutdown after sending the AT^SMSO command. Only a voltage regulator is active
for powering the RTC. Software is not active. Interfaces are not accessible. Operating voltage (connected to BATT+) remains applied.
Airplane
mode
Airplane mode shuts down the radio part of the module, causes the module to log off from
the GSM/GPRS network and disables all AT commands whose execution requires a radio
connection.
Airplane mode can be controlled by AT command (see [1]).
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3.2 Power Supply
28
3.2

Power Supply
AH3-W needs to be connected to a power supply atthe board-to-board connector - 5 lines each
BATT+ and GND.
The power supply of AH3-W has to be a single voltage source at BATT+. It must must be able
to provide the peak current during the uplink transmission.
All key functions for supplying power to the device are handled by the power management IC.
It provides the following features:
• Stabilizes the supply voltages for the baseband using switching regulators and low drop linear voltage regulators.
• Switches the module's power voltages for the power-up and -down procedures.
• Delivers, across the VEXT pin, a regulated voltage for an external application. This voltage
is not available in Power-down mode and can be reduced via AT command to save power.
• SIM switch to provide SIM power supply.
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3.3 USB Interface
28
3.3
USB Interface
AH3-W supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/
s) compliant. The USB interface is primarily intended for use as command and data interface
and for downloading firmware.
The USB host is responsible for supplying the VUSB_IN line. This line is for voltage detection
only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because
AH3-W is designed as a self-powered device compliant with the “Universal Serial Bus Specification Revision 2.0”1.
Module
B2B
VREG (3V075)
lin. reg.
BATT+
GND
USB part1)
VBUS
Detection only
VUSB_IN
USB_DP2)
USB_DN2)
DP
DN
Host wakeup
RING0
GPIO4
1)
All serial and pull-up resistors for data lines are implemented.
If the USB interface is operated in High Speed mode (480MHz), it is recommended to take
special care routing the data lines USB_DP and USB_DN. Application layout should in this
case implement a differential impedance of 90Ohm for proper signal integrity.
2)
Figure 2: USB circuit
To properly connect the module's USB interface to the host a USB 2.0 compatible connector is
required. For more information on the USB related pins see Table 27. Furthermore, the USB
modem driver distributed with AH3-W needs to be installed.
While the USB connection is active, the module will not change into SLEEP Mode. To enable
switching into SLEEP mode the USB host must bring its USB interface into Suspend state. Also, VUSB_IN should always be kept enabled for this functionality. See “Universal Serial Bus
Specification Revision 2.0"1 for a description of the Suspend state. On incoming calls AH3-W
will then generate a remote wake up request to resume the USB connection (active low).
As an alternative to the regular USB remote wakeup mechanism it is possible to employ the
RING0 or GPIO4 line to wake up the host application. The benefit is that the RING0 or GPIO4
lines can wake up the host application in case of incoming calls or other events signalized by
URCs while the USB interface is suspended or shut down.
1.
The specification is ready for download on http://www.usb.org/developers/docs/
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3.4 Serial Interface ASC0
28
3.4

Serial Interface ASC0
AH3-W offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITUT V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28.
The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 27.
AH3-W is designed for use as a DCE. Based on the conventions for DCE-DTE connections it
communicates with the customer application (DTE) using the following signals:
• Port TXD @ application sends data to the module’s TXD0 signal line
• Port RXD @ application receives data from the module’s RXD0 signal line
Figure 3: Serial interface ASC0
Features:
• Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition,
the modem control lines DTR0, DSR0, DCD0 and RING0.
• ASC0 is designed for controlling GSM/UMTS voice calls, transferring data and for controlling the module with AT commands.
• Full multiplexing capability allows the interface to be partitioned into virtual channels.
• The RING0 signal serves to indicate incoming calls and ot her types of URCs (Unsolicited
Result Code). It can also be used to send p ulses to th e host applicat ion, for example to
wake up the application from power saving state. See [1] for details on how to configure the
RING0 line by AT^SCFG.
• Configured for 8 data bits, no parity and 1 stop bit.
• ASC0 can be operated at fixed bit rates from 9600bps up to 921600bps.
• Autobauding is supported.
• Autobauding is not compatible with multiplex mode.
• Supports RTS0/CTS0 hardware flow control.
• Wake up from SLEEP mode by RTS0 activation (high to low transition).
Note. If the ASC0 serial interface is the application’s only interface, it is suggested to connect
test points on the USB signal lines as a potential tracing possibility.
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3.4 Serial Interface ASC0
28
Table 8: DCE-DTE wiring of ASC0
V.24 circuit DCE
DTE
Line function
Signal direction
Line function
Signal direction
103
TXD0
Input
TXD
Output
104
RXD0
Output
RXD
Input
105
RTS0
Input
RTS
Output
106
CTS0
Output
CTS
Input
108/2
DTR0
Input
DTR
Output
107
DSR0
Output
DSR
Input
109
DCD0
Output
DCD
Input
125
RING0
Output
RING
Input
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3.5 UICC/SIM/USIM Interface
28
3.5

UICC/SIM/USIM Interface
AH3-W has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and
ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM
card holder. Six pins on the board-to-board connector are reserved for the SIM interface.
The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards. Please refer to Table 27 for
electrical specifications of the UICC/SIM/USIM interface lines depending on whether a 3V or
1.8V SIM card is used.
The CCIN pin serves to detect whether a tray (with SIM card) is present in the card holder. Using the CCIN pin is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during operation.
To take advantage of this feature, an appropriate SIM card detect switch is required on the card
holder. For example, this is true for the model supplied by Molex, which has been tested to operate with AH3-W and is part of the Cinterion reference equipment submitted for type approval.
See Chapter 8 for Molex ordering numbers.
Table 9: Signals of the SIM interface (board-to-board connector)
Signal
Description
CCGND
Separate ground connection for SIM card to improve EMC.
Be sure to use this ground line for the SIM interface rather than any other ground line or
plane on the module.
CCCLK
Chipcard clock
CCVCC
SIM supply voltage.
CCIO
Serial data line, input and output.
CCRST
Chipcard reset
CCIN
Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is
removed during operation the SIM interface is shut down immediately to prevent destruction of the SIM. The CCIN pin is active low.
The CCIN pin is mandatory for applications that allow the user to remove the SIM card during operation.
The CCIN pin is solely intended for use with a SIM card. It must not be used for any other
purposes. Failure to comply with this requirement may invalidate the type approval of AH3W.
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3.5 UICC/SIM/USIM Interface
28
open: Card removed
closed: Card inserted
Module
Board-to-board connector
CCIN
CCRST
CCCLK
1n
SIM /
UICC
CCGND
CCIO
CCVCC 220n
Figure 4: UICC/SIM/USIM interface
The total cable length between the board-to-board connector pins pins on AH3-W and the pins
of the external SIM card holder must not exceed 100mm in order to meet the specifications of
3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.
To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both
lines are not placed closely next to each other. A useful approach is using the CCGND line to
shield the CCIO line from the CCCLK line.
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3.6 Analog Audio Interface
28
3.6

Analog Audio Interface
AH3-W has an analog audio interface with a balanced analog microphone input and a balanced
analog earpiece output. A supply voltage and an analog ground connection are provided at
dedicated pins.
AH3-W offers six audio modes which can be selected with the AT^SNFS command. The electrical characteristics of the voiceband part vary with the audio mode. For example, sending and
receiving amplification, sidetone paths, noise suppression etc. depend on the selected mode
and can be altered with AT commands (except for mode 1).
When shipped from factory, all audio parameters ofAH3-W are set to audio mode 1. This is the
default configuration optimised for the Votronic HH-SI-30.3/V1.1/0 handset and used for type
approving the Cinterion Wireless Modules reference configuration. Audio mode 1 has fix parameters which cannot be modified. To adjust the settings of the Votronic handset simply
change to another audio mode.
3.7
Pulse Code Modulation Interface (PCM)
AH3-W’s PCM interface can be used to connect audio devices capable of pulse code modulation. The PCM functionality allows the use of a codec like the Freescale MC145483.
3.8
Analog-to-Digital Converter (ADC)
ADC is used for antenna diagnosis only.
3.9
GPIO Interface
The AH3-W has 10 GPIOs for external hardware devices. Each GPIO can be configured for
use as input or output. All settings are AT command controlled. The IO port driver has to be
open before using and configuring GPIOs. Before changing the configuration of a GPIO pin
(e.g. input to output) the pin has to be closed. If the GPIO pins are not configured or the pins/
driver were closed, the GPIO pins are high-Z with pull down resistor. If a GPIO is configured to
input, the pin has high-Z without pull resistor.
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4 GPS Receiver
28

GPS Receiver
AH3-W integrates a GPS receiver that offers the full performance of GPS technology. The GPS
receiver is able to continuously track all satellites in view, thus providing accurate satellite position data.
The integrated GPS receiver supports the NMEA protocol via USB or ASC0 interface. NMEA
is a combined electrical and data specification for communication between various (marine)
electronic devices including GPS receivers. Ithas been defined and controlled by the US based
National Marine Electronics Association. For more information on the NMEA Standard please
refer to http://www.nmea.org.
Depending on the receiver’s knowledge of last position, current time and ephemeris data, the
receiver’s startup time (i.e., TTFF = Time-To-First-Fix) may vary: If the receiver has no knowledge of its last position or time, a startup takes considerably longer than if the receiver has still
knowledge of its last position, time and almanac or has still access to valid ephimeris data and
the precise time.
By default, the GPS receiver is switched off. It has to be switched on and configured using AT
commands. For more information on how to control the GPS interface via the AT command
AT^SGPSC see [1].
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5 Antenna Interfaces
32
Antenna Interfaces
5.1
GSM/UMTS Antenna Interface
The AH3-W RF antenna interface comprises a main GSM/UMTS antenna as well as an optional UMTS Rx diversity antenna to improve signal reliability and quality1. The RF interface has
an impedance of 50. AH3-W is capable of sustaining a total mismatch at the antenna pad
without any damage, even when transmitting at maximum RF power.
The external antenna must be matched properly to achieve best performance regarding radiated power, DC-power consumption, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the AH3-W module and should be placed in the host
application.
Regarding the return loss AH3-W provides the following values in the active band:
Table 10: Return loss in the active band
State of module
Return loss of module
Recommended return loss of application
Receive
> 8dB
> 12dB
Transmit not
Idle
applicable
< 5dB
> 12dB
not applicable
The connection of the antenna or other equipment must be decoupled from DC voltage. This
is necessary because the antenna pad is DC coupled to ground via an inductor for ESD protection.
5.1.1
RF Antenna Pad
The RF antenna can be attached to the antenna pad via contact
springs such as the Rosenberger pogo pin series (Figure 5
shows the module’s RF antenna pad size; for more information
on the Pogo pin series see Section 5.1.1.1).
Note: The antenna pad resp. an SMA antenna connector soldered to the antenna pad has been chosen as antenna reference point (ARP) for the Cinterion module AH3-W type
approval.
Figure 5: RF antenna pad size
Also, consider that according to the GSM recommendations TS 45.005 and TS 51.010-01 a
50 connector is mandatory for type approval measurements. This requires GSM devices with
an integral antenna to be temporarily equipped with a suitable connector or a low loss RF cable
with adapter.
Please note that the GSM antenna must be isolated for ESD (to withstand a voltage resistance
up to 8kV air discharge).
1.
By delivery default the optional UMTS Rx diversity antenna is configured as available for the module.
Please refer to [1] for details on how to configure antenna settings.
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5.1 GSM/UMTS Antenna Interface
32
5.1.1.1

Pogo Pins
The Rosenberger pog o pins have been qu alified by Cinterion for ap plications with a 3mm
board-to-board connector stacking height. To ensure a reliable connection the module should
therefore be fixed at an equidistance of 3mm from the external application’s PCB. For details
on board-to-board connectors and stacking heights see Section 6.3. For ordering information
on the pogo pins see Section 8.1.
Figure 6 and Table 11 show the dimensions of the Pogo pins as well as some basic characteristics. For further details and a test report please contact Rosenberger.
Figure 6: Pogo pins dimensions
Table 11: Pogo pins characteristics
Parameter
Specification
Material and plating
Connector parts:
Piston
Ferrule
Spring
Isolator
Material: Brass; Plating: Gold, 0.5µm over chemical Nickel
Material: Brass; Plating: min. Gold, 0.15µm over chemical Nickel
N/A
PPS
Electrical data
Insulation resistance
> 5 x 103 M
Contact resistance
< 25m initial; after 5 cycles operational stroke
Working voltage
4V
Max. current
1.5A per pin
Mechanical data
Durability
> 5000
Max. pin travel
1.6mm
Nominal height
4.15mm
Travel vs Force
Initial: F0 = 0.2N +/-0.1N; at 3.45mm: F1 = 0.7N +/-0.15N
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5.1 GSM/UMTS Antenna Interface
32

Figure 7 shows how the module’s antenna pads may be mounted onto the Rosenberger Pogo
pins on an external application.
Pogo pins
Antenna pads
Module connected to application (antenna pads and board-to-board connector)
Figure 7: Exploded view of module’s antenna pads mounted on Pogo pins
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5.2 GPS Antenna Interface
32
5.2

GPS Antenna Interface
In addition to the RF antenna interface AH3-W also has a GPS antenna interface. See Section
6.1 to find out where the GPS antenna pad is located. The GPS pad is the same as for the RF
antenna interface (see Section 5.1.1 ).
It is possible to connect active or passive GPSantennas. In either case they must have 50Ohm
impedance. The simultaneous operation of GSM and GPS has been implemented. For electrical characteristics see Section 6.8.
Active 3V GPS antennas can be supplied via the GPS antenna interface, if the supply voltage
is switched on. This is done by AT command: AT^SGPSC="Power/Antenna" to configure the
use of an active GPS antenna and AT^SGPSC="Engine" to start the GPS receiver (for command details see [1]). The available current is limited to prevent short circuits.
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6 Mechanics
38
Mechanics
6.1
Mechanical Dimensions of AH3-W
Figure 8 shows a 3D view1 of AH3-W and provides an overview of the board's mechanical dimensions. For further details see Figure 9.
Length:
Width:
Height:
53.00mm
33.90mm
3.10mm
Pin 80
Pin 1
Pin 41
Top view
Pin 40
GSM/UMTS antenna
GPS antenna
UMTS
Rx diversity antenna
Alternate top view
Shieldings may have no perforations and varying colors
Electrical characteristics and module dimensions remain unchanged
Figure 8: AH3-W – top view
1.
The coloring of the 3D view does not reflect the module’s real color.
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6.1 Mechanical Dimensions of AH3-W
38

Figure 9: Dimensions of AH3-W (all dimensions in mm)
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6.2 Mounting AH3-W to the Application Platform
38
6.2

Mounting AH3-W to the Application Platform
There are many ways to properly install AH3-W in the host device. An efficient approach is to
mount the AH3-W PCB to a frame, plate, rack or chassis.
Fasteners ca n be M2 screws plus suita ble wa shers, circuit board s pacers, or customize d
screws, clamps, or brackets. In addition, the board-to-board connection can also be utilized to
achieve better support.
For proper grounding it is strongly recommended to use large ground plane on the bottom of
board in addition to the five GND pins of the board-to-board connector. The ground plane may
also be used to attach cooling elements, e.g. a heat sink or thermally conductive tape.
To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it is
positioned flat against the host device.
6.3
Board-to-Board Application Connector
This section provides the specifications of the 80-pin board-to-board connector used to connect
AH3-W to the external application.
Connector mounted on the AH3-W module:
Type:
Supplier:
52991-0808 SlimStack Receptacle 80 pins, 0.50mm pitch, for stacking heights of
3.0 or 4.0mm, see Figure 11 for details.
Molex, http//www.molex.com
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6.3 Board-to-Board Application Connector
38

Table 12: Technical specifications of Molex board-to-board connector
Parameter
Specification (80-pin B2B connector)
Electrical
Number of Contacts
80
Contact spacing
0.5mm (.020")
Voltage
50V
Rated current
0.5A max per contact
Contact resistance
50m max per contact
Insulation resistance
> 100M
Dielectric Withstanding Voltage
500V AC (for 1 minute)
Physical
Insulator material (housing)
White glass-filled LCP plastic, flammability UL 94V 0
Contact material
Plating: Gold over nickel
Insertion force 1st
Insertion force 30
< 74.4N
th
< 65.6N
Withdrawal force 1st
> 10.8N
Maximum connection cycles
30 (@ 70m max per contact)
Mating connector types for the customer's application offered by Molex:
Figure 10: Mating board-to-board connector 53748-0808 on application
•
•
53748-0808 SlimStack Plug, 3mm stacking height,
see Figure 12 for details.
53916-0808 SlimStack Plug, 4mm stacking height
Note: There is no inverse polarity protection for the board-to-board connector. It is therefore
very important that the board-to-board connector is connected correctly to the host application,
i.e., pin1 must be connected to pin1, pin2 to pin 2, etc. Pin assignments are listed in Section
6.5, pin locations are shown in Figure 8.
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6.3 Board-to-Board Application Connector
38

Figure 11: Molex board-to-board connector 52991-0808 on AH3-W
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6.3 Board-to-Board Application Connector
38

Figure 12: Mating board-to-board connector 53748-0808 on application
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7 Reference Approval
40
Reference Approval
7.1
Reference Equipment for Type Approval

The Cinterion Wireless Modules reference setup submitted to type approve AH3-W is shown
in the following figure1. The module is connected to the DSB75 via a special adapter and either
mounted directly onto the adapter or connected using a flex cable:
Figure 13: Reference equipment for type approval
1.
For RF performance tests a mini-SMT/U.FL to SMA adapter with attached 6dB coaxial attenuator is chosen to connect the module directly to the GSM/UMTS/GPS test equipment instead of employing the SMA
antenna connectors on the AH3-W-DSB75 adapter as shown in Figure 13. The following products are
recommended:
Hirose SMA-Jack/U.FL-Plug conversion adapter HRMJ-U.FLP(40)
(for details see see http://www.hirose-connectors.com/ or http://www.farnell.com/
Aeroflex Weinschel Fixed Coaxial Attenuator Model 3T/4T
(for details see http://www.aeroflex.com/ams/weinschel/pdfiles/wmod3&4T.pdf)
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7.2 Compliance with FCC and IC Rules and Regulations
40
7.2

Compliance with FCC and IC Rules and Regulations
The Equipment Authorization Certification for the Cinterion Wireless Modules reference application described in Section 7.1 will be registered under the following identifiers:
FCC Identifier QIPAH3-W
Industry Canada Certification Number: 7830A-AH3W
Granted to Cinterion Wireless Modules GmbH
Manufacturers of mobile or fixed devices incorporating AH3-W modules are authorized to use
the FCC Grants and Industry Canada Certificates of the AH3-W modules for their own final
products according to the conditions referenced in these documents. In this case, the FCC label of the module shall be visible from the outside, or the host device shall bear a second label
stating "Contains FCC ID QIPAH3-W", and accordingly “Contains IC 7830A-AH3W“. The integration is limited to fixed or mobile categorised host devices, where a separation distance between the antenna and any person of min. 20cm can be assured during normal operating
conditions. For mobile and fixed operation configurations the antenna gain, including cable
loss, must not exceed the limits 4,32 dBi (850 MHz) and 0,9 dBi (1900 MHz).
IMPORTANT:
Manufacturers of portable applications incorporating AH3-W modules are required to havetheir
final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable
mobiles (see Section 1.3.2 for detail).
Changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.
Note: This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates,
uses and can radiate radio frequency energy and, if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications. However, there is
no guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by turning
the equipment off and on, the user is encouraged to try to correct the interference by one or
more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
• Consult the dealer or an experienced radio/TV technician for help.
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AH3-W Hardware Interface Overview
8 Appendix
42
Appendix
8.1
List of Parts and Accessories
Table 13: List of parts and accessories
Description
Supplier
Ordering information
AH3-W
Cinterion
Standard module
Cinterion Wireless Modules IMEI:
Ordering number: L30960-N2340-A100
DSB75 Support Box
Cinterion
Ordering number: L36880-N8811-A100
DSB75-Adapter for mounting Cinterion
the AH3-W module
Ordering number: L30960-N2301-A100
Votronic Handset
VOTRONIC
Votronic HH-SI-30.3/V1.1/0
VOTRONIC
Entwicklungs- und Produktionsgesellschaft für elektronische Geräte mbH
Saarbrücker Str. 8
66386 St. Ingbert
Germany
Phone: +49-(0)6 89 4 / 92 55-0
Fax: +49-(0)6 89 4 / 92 55-88
Email: contact@votronic.com
SIM card holder incl. push
button ejector and slide-in
tray
Molex
Ordering numbers: 91228
91236
Sales contacts are listed in Table 14.
Board-to-board connector
Molex
Sales contacts are listed in Table 14.
Pogo pin series
Rosenberger
Rosenberger Hochfrequenztechnik GmbH & Co.
POB 1260
84526 Tittmoning
Germany
http://www.rosenberger.de
Ordering number: 99P307-041Z
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8.1 List of Parts and Accessories
42

Table 14: Molex sales contacts (subject to change)
Molex
For further information please click:
http://www.molex.com
Molex Deutschland GmbH
Otto-Hahn-Str. 1b
69190 Walldorf
Germany
Phone: +49-6227-3091-0
Fax: +49-6227-3091-8100
Email: mxgermany@molex.com
American Headquarters
Lisle, Illinois 60532
U.S.A.
Phone: +1-800-78MOLEX
Fax: +1-630-969-1352
Molex China Distributors
Beijing,
Room 1311, Tower B, COFCO Plaza
No. 8, Jian Guo Men Nei Street, 100005
Beijing
P.R. China
Phone: +86-10-6526-9628
Fax: +86-10-6526-9730
Molex Singapore Pte. Ltd.
110, International Road
Jurong Town,
Singapore 629174
Molex Japan Co. Ltd.
1-5-4 Fukami-Higashi,
Yamato-City,
Kanagawa, 242-8585
Japan
Phone: +65-6-268-6868
Fax: +65-6-265-6044
Phone: +81-46-265-2325
Fax: +81-46-265-2365
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