THALES DIS AlS Deutschland EHS6 GSM/GPRS/ EDGE/UMTS/HSPA Module User Manual hid

Gemalto M2M GmbH GSM/GPRS/ EDGE/UMTS/HSPA Module hid

Contents

User_manual_hio

EHS6Version: 01.441DocId: EHS6_HIO_v01.441Hardware Interface Overview
GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PROD-UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANYEVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINSINFORMATION ON CINTERION PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUB-JECT TO CHANGE AT CINTERION'S DISCRETION. CINTERION WIRELESS MODULES GMBHGRANTS A NON-EXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANS-FER, COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISAS-SEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT ASSPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "ASIS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUMEXTENT PERMITTED BY APPLICABLE LAW, CINTERION WIRELESS MODULES GMBH DISCLAIMSALL WARRANTIES AND LIABILITIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIODOF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PROVIDED TO HIMIN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOV-ERNED AND CONSTRUED ACCORDING TO GERMAN LAW.CopyrightTransmittal, reproduction, dissemination and/or editing of this document as well as utilization of its con-tents and communication thereof to others without express authorization are prohibited. Offenders will beheld liable for payment of damages. All rights created by patent grant or registration of a utility model ordesign patent are reserved. Copyright © 2013, Cinterion Wireless Modules GmbH Trademark NoticeMicrosoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in theUnited States and/or other countries. All other registered trademarks or trademarks mentioned in this doc-ument are property of their respective owners.EHS6_HIO_v01.441 Page 2 of 38 2013-07-11Confidential / PreliminaryEHS6 Hardware Interface Overview2Document Name: EHS6 Hardware Interface Overview Version: 01.441Date: 2013-07-11DocId: EHS6_HIO_v01.441Status Confidential / Preliminary
EHS6 Hardware Interface Overview Contents38EHS6_HIO_v01.441 Page 3 of 38 2013-07-11Confidential / PreliminaryContents1 Introduction ................................................................................................................. 61.1 Key Features at a Glance .................................................................................. 61.2 EHS6 System Overview..................................................................................... 92 Interface Characteristics .......................................................................................... 102.1 Application Interface ........................................................................................ 102.1.1 USB Interface...................................................................................... 102.1.2 Serial Interface ASC0 ......................................................................... 112.1.3 Serial Interface ASC1 ......................................................................... 122.1.4 UICC/SIM/USIM Interface................................................................... 132.1.5 Digital Audio Interface......................................................................... 142.1.6 GPIO Interface.................................................................................... 142.1.7 I2C Interface ........................................................................................ 162.1.8 SPI Interface ....................................................................................... 162.1.9 HSIC Interface .................................................................................... 162.1.10 PWM Interfaces .................................................................................. 172.1.11 Pulse Counter ..................................................................................... 172.1.12 Status LED.......................................................................................... 172.1.13 Fast Shutdown.................................................................................... 172.2 RF Antenna Interface....................................................................................... 182.2.1 Antenna Installation ............................................................................ 192.3 Sample Application .......................................................................................... 203 Operating Characteristics ........................................................................................ 223.1 Operating Modes ............................................................................................. 223.2 Power Supply................................................................................................... 234 Mechanical Dimensions, Mounting and Packaging............................................... 244.1 Mechanical Dimensions of EHS6..................................................................... 245 Regulatory and Type Approval Information ........................................................... 265.1 Directives and Standards................................................................................. 265.2 SAR requirements specific to portable mobiles ............................................... 295.3 Reference Equipment for Type Approval......................................................... 305.4 Compliance with FCC and IC Rules and Regulations ..................................... 316 Document Information.............................................................................................. 326.1 Revision History............................................................................................... 326.2 Related Documents ......................................................................................... 326.3 Terms and Abbreviations................................................................................. 326.4 Safety Precaution Notes .................................................................................. 367 Appendix.................................................................................................................... 377.1 List of Parts and Accessories........................................................................... 37
EHS6 Hardware Interface Overview Tables38EHS6_HIO_v01.441 Page 4 of 38 2013-07-11Confidential / PreliminaryTablesTable 1: Signals of the SIM interface (SMT application interface) ...............................  13Table 2: GPIO lines and possible alternative assignment............................................  15Table 3: Return loss in the active band........................................................................  18Table 4: Overview of operating modes ........................................................................  22Table 5: Directives .......................................................................................................  26Table 6: Standards of North American type approval ..................................................  26Table 7: Standards of European type approval............................................................  26Table 8: Requirements of quality .................................................................................  27Table 9: Standards of the Ministry of Information Industry of the People’s Republic of China............................................................................  27Table 10: Toxic or hazardous substances or elements with defined concentration limits...............................................................................................................  28Table 11: List of parts and accessories..........................................................................  37Table 12: Molex sales contacts (subject to change) ......................................................  38
EHS6 Hardware Interface Overview Figures38EHS6_HIO_v01.441 Page 5 of 38 2013-07-11Confidential / PreliminaryFiguresFigure 1: EHS6 system overview ....................................................................................  9Figure 2: USB circuit .....................................................................................................  10Figure 3: Serial interface ASC0.....................................................................................  11Figure 4: Serial interface ASC1.....................................................................................  12Figure 5: External UICC/SIM/USIM card holder circuit .................................................  14Figure 6: Schematic diagram of EHS6 sample application ...........................................  21Figure 7: EHS6– top and bottom view...........................................................................  24Figure 8: Dimensions of EHS6 (all dimensions in mm).................................................  25Figure 9: Reference equipment for Type Approval .......................................................  30
EHS6 Hardware Interface Overview1 Introduction9EHS6_HIO_v01.441 Page 6 of 38 2013-07-11Confidential / Preliminary1 IntroductionThis document1 describes the hardware of the Cinterion EHS6 module. It helps you quickly re-trieve interface specifications, electrical and mechanical details and information on the require-ments to be considered for integrating further components.1.1 Key Features at a Glance1.  The document is effective only if listed in the appropriate Release Notes as part of the technicaldocumentation delivered with your Cinterion product.Feature ImplementationGeneralFrequency bands GSM/GPRS/EDGE: Quad band 850/900/1800/1900MHzUMTS/HSPA+: Five band 800/850/900/1900/2100MHzGSM class Small MSOutput power Class 4 (+33dBm ±2dB) for EGSM850Class 4 (+33dBm ±2dB) for EGSM900Class 1 (+30dBm ±2dB) for GSM1800Class 1 (+30dBm ±2dB) for GSM1900Class E2 (+27dBm ± 3dB) for GSM 850 8-PSKClass E2 (+27dBm ± 3dB) for GSM 900 8-PSKClass E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSKClass E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSKClass 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdIClass 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdIIClass 3 (+24dBm +1/-3dB) for UMTS 900, WCDMA FDD BdVIIIClass 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdVClass 3 (+24dBm +1/-3dB) for UMTS 800, WCDMA FDD BdVIPower supply 3.3V to 4.5VOperating temperature (board temperature) Normal operation: TBD.Extended operation: TBD.Physical Dimensions: 27.6mm x 25.4mm x 2.2mmWeight: approx. 3.5gRoHS All hardware components fully compliant with EU RoHS DirectiveHSPA features3GPP Release 6, 7 DL 7.2Mbps, UL 5.7MbpsHSDPA Cat.8 / HSUPA Cat.6 data ratesCompressed mode (CM) supported according to 3GPP TS25.212UMTS features3GPP Release 4 PS data rate – 384 kbps DL / 384 kbps ULCS data rate – 64 kbps DL / 64 kbps UL
EHS6 Hardware Interface Overview1.1 Key Features at a Glance9EHS6_HIO_v01.441 Page 7 of 38 2013-07-11Confidential / PreliminaryGSM/GPRS/EGPRS featuresData transfer GPRS:• Multislot Class 12• Full PBCCH support• Mobile Station Class B• Coding Scheme 1 – 4EGPRS:• Multislot Class 12• EDGE E2 power class for 8 PSK• Downlink coding schemes – CS 1-4, MCS 1-9• Uplink coding schemes – CS 1-4, MCS 1-9• SRB loopback and test mode B• 8-bit, 11-bit RACH• PBCCH support• 1 phase/2 phase access procedures• Link adaptation and IR• NACC, extended UL TBF• Mobile Station Class BCSD:• V.110, RLP, non-transparent•9.6kbps•USSDSMS Point-to-point MT and MOCell broadcastText and PDU modeStorage: SIM card plus SMS locations in mobile equipmentSoftwareAT commands Hayes 3GPP TS 27.007, TS 27.005, CinterionAT commands for RIL compatibility Java™ Open Platform Java™ Open Platform with • Java™ profile IMP-NG & CLDC 1.1 HI• Secure data transmission via HTTPS/SSL• Multi-threading programming and multi-application executionMajor benefits: seamless integration into Java applications, ease of pro-gramming, no need for application microcontroller, extremely cost-efficient hardware and software design – ideal platform for industrial GSM applica-tions.The memory space available for Java programs is around 8 MB in the flash file system and around 6MB RAM. Application code and data share the space in the flash file system and in RAM.Microsoft™ compatibility RIL for Pocket PC and Smartphone SIM Application Toolkit SAT Release 99 Firmware update Generic update from host application over ASC0 or USB modem. Feature Implementation
EHS6 Hardware Interface Overview1.1 Key Features at a Glance9EHS6_HIO_v01.441 Page 8 of 38 2013-07-11Confidential / PreliminaryInterfacesModule interface Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reli-ability and provides the possibility to use an optional module mounting socket.For more information on how to integrate SMT modules see also [3]. This application note comprises chapters on module mounting and application layout issues as well as on additional SMT application development equip-ment.USB USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s)compliant2 serial interfaces  ASC0 (shared with GPIO lines):• 8-wire modem interface with status and control lines, unbalanced, asyn-chronous• Adjustable baud rates: 1,200bps to 921,600bps• Autobauding: 1,200bps to 230,400bps• Supports RTS0/CTS0 hardware flow control.• Multiplex ability according to GSM 07.10 Multiplexer Protocol.ASC1 (shared with GPIO lines):• 4-wire, unbalanced asynchronous interface• Adjustable baud rates: 1,200bps to 921,60bps• Autobauding: 1,200bps to 230,400bps• Supports RTS1/CTS1 hardware flow controlAudio 1 digital interface (PCM), shared with GPIO linesUICC interface Supported SIM/USIM cards: 3V, 1.8V GPIO interface 14 GPIO lines shared with ASC0 lines, LED signalling, PWM functionality, fast shutdown and pulse counter4 GPIO lines shared with PCM interface4 GPIO lines shared with ASC1, SPI and HSIC interfacesI2C interface Supports I2C serial interfaceHSIC interface High-Speed Inter-Chip (HSIC) interface for USB chip-to-chip interconnect including Link Power Management (LPM) lines shared with GPIO linesSPI interface Serial peripheral interface, shared with GPIO linesAntenna interface pads 50 Power on/off, ResetPower on/off Switch-on by hardware signal ON and AUTO_ONSwitch-off by AT command Switch off by hardware signal FST_SHDN instead of AT commandAutomatic switch-off in case of critical temperature and voltage conditions Reset Orderly shutdown and reset by AT commandEmergency reset by hardware signal EMERG_RSTSpecial featuresReal time clock Timer functions via AT commandsPhonebook SIM and phoneTTY/CTM support Integrated CTM modemFeature Implementation
EHS6 Hardware Interface Overview1.2 EHS6 System Overview9EHS6_HIO_v01.441 Page 9 of 38 2013-07-11Confidential / Preliminary1.2 EHS6 System OverviewFigure 1:  EHS6 system overviewEvaluation kitEvaluation module EHS6 module soldered onto a dedicated PCB that can be connected to an adapter in order to be mounted onto the DSB75.DSB75 DSB75 Development Support Board designed to test and type approve Cinterion Wireless Modules and provide a sample configuration for applica-tion engineering. A special adapter is required to connect the EHS6 evalu-ation module to the DSB75.Feature ImplementationGPIO interfaceI2CUSBASC0 linesHSIC LPM/ ASC1/SPICONTROLRTCPOWERANTENNA (GSM/UMTS quad band)ModuleSIM interface(with SIM detection)SIM cardApplicationPower supplyBackup supplyEmergency resetON, AUTO_ONHSIC LPM/Serial interface/SPI interfaceSerial modem interface linesI2CGPIO3445252112USBAntenna1PCM Digital audio(PCM)4Status LED1DAC (PWM) PWM2Fast shutdown Fast shutdown11ADC ADC1HSIC2HSICCOUNTER Pulse counter1ASC0 lines Serial modem interface lines/ SPI interface4
EHS6 Hardware Interface Overview2 Interface Characteristics21EHS6_HIO_v01.441 Page 10 of 38 2013-07-11Confidential / Preliminary2 Interface CharacteristicsEHS6 is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface2.1.1 USB InterfaceEHS6 supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/s) compliant. The USB interface is primarily intended for use as command and data interface and for downloading firmware. The USB host is responsible for supplying the VUSB_IN line. This line is for voltage detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because EHS6 is designed as a self-powered device compliant with the “Universal Serial Bus Specifi-cation Revision 2.0”1.Figure 2:  USB circuitTo properly connect the module's USB interface to the host a USB 2.0 compatible connector is required. Furthermore, the USB modem driver distributed with EHS6 needs to be installed.1.  The specification is ready for download on http://www.usb.org/developers/docs/VBUSDPDNVREG (3V075)BATT+USB_DP2)lin. reg. GNDModuleDetection only VUSB_INUSB part1)RING0Host wakeup1) All  serial (including RS) and pull-up resistors for data lines are implemented.USB_DN2)2) If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case implement a differential impedance of 90Ohm for proper signal integrity.RSRSSMT
EHS6 Hardware Interface Overview2.1 Application Interface21EHS6_HIO_v01.441 Page 11 of 38 2013-07-11Confidential / PreliminaryWhile the USB connection is active, the module will not change into SLEEP Mode. To enable switching into SLEEP mode the USB host must bring its USB interface into Suspend state. Al-so, VUSB_IN should always be kept enabled for this functionality. See “Universal Serial Bus Specification Revision 2.0“1 for a description of the Suspend state. On incoming calls EHS6 will then generate a remote wake up request to resume the USB connection (active low).As an alternative to the regular USB remote wakeup mechanism it is possible to employ the RING0 line to wake up the host application. The benefit is that the RING0 line can wake up the host application in case of incoming calls or other events signalized by URCs while the USB interface is suspended or shut down. 2.1.2 Serial Interface ASC0EHS6 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or in-active state). EHS6 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:• Port TXD @ application sends data to the module’s TXD0 signal line• Port RXD @ application receives data from the module’s RXD0 signal lineFigure 3:  Serial interface ASC0Features:• Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition,the modem control lines DTR0, DSR0, DCD0 and RING0.• ASC0 is designed for controlling GSM/UMTS voice calls, transferring data and for control-ling the module with AT commands.• Full multiplexing capability allows the interface to be partitioned into virtual channels.• The RING0 signal serves to indicate incoming calls and other types of URCs (UnsolicitedResult Code). It can also be used to send pulses to the host application, for example to
EHS6 Hardware Interface Overview2.1 Application Interface21EHS6_HIO_v01.441 Page 12 of 38 2013-07-11Confidential / Preliminarywake up the application from power saving state. • Configured for 8 data bits, no parity and 1 stop bit. • ASC0 can be operated at fixed bit rates from 1,200bps up to 921,600bps.• Autobauding supports bit rates from 1,200bps up to 230,400bps.• Supports RTS0/CTS0 hardware flow control. The hardware hand shake line RTS0 has aninternal pull down resistor causing a low level signal, if the line is not used and open.Although hardware flow control is recommended, this allows communication by using onlyRXD and TXD lines.• Wake up from SLEEP mode by RTS0 activation (high to low transition).2.1.3 Serial Interface ASC1Four EHS6 GPIO lines can be configured as ASC1 interface signals to provide a 4-wire unbal-anced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signal-ling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). EHS6 is designed for use as a DCE. Based on the conventions for DCE-DTE connections itcommunicates with the customer application (DTE) using the following signals:• Port TXD @ application sends data to module’s TXD1 signal line• Port RXD @ application receives data from the module’s RXD1 signal lineFigure 4:  Serial interface ASC1Features• Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware hand-shake. • On ASC1 no RING line is available.• Configured for 8 data bits, no parity and 1 or 2 stop bits.• ASC1 can be operated at fixed bit rates from 1,200 bps to 921,600 bps. • Autobauding supports bit rates from 1,200bps up to 230,400bps. • Supports RTS1/CTS1 hardware flow. The hardware hand shake line RTS0 has an internalpull down resistor causing a low level signal, if the line is not used and open. Although hard-ware flow control is recommended, this allows communication by using only RXD and TXDlines.
EHS6 Hardware Interface Overview2.1 Application Interface21EHS6_HIO_v01.441 Page 13 of 38 2013-07-11Confidential / Preliminary2.1.4 UICC/SIM/USIM InterfaceEHS6 has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards.The CCIN signal serves to detect whether a tray (with SIM card) is present in the card holder. Using the CCIN signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during oper-ation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been test-ed to operate with EHS6 and is part of the Cinterion reference equipment submitted for type approval. See Section 7.1 for Molex ordering numbers.Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ-ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart EHS6.Table 1:  Signals of the SIM interface (SMT application interface)Signal DescriptionGND Separate ground connection for SIM card to improve EMC.CCCLK Chipcard clockCCVCC SIM supply voltage.CCIO Serial data line, input and output.CCRST Chipcard resetCCIN Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruc-tion of the SIM. The CCIN signal is by default low and will change to high level if a SIM card is inserted.The CCIN signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCIN signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of EHS6.
EHS6 Hardware Interface Overview2.1 Application Interface21EHS6_HIO_v01.441 Page 14 of 38 2013-07-11Confidential / PreliminaryThe figure below shows a circuit to connect an external SIM card holder.Figure 5:  External UICC/SIM/USIM card holder circuitThe total cable length between the SMT application interface pads on EHS6 and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both lines are not placed closely next to each other. A useful approach is using a GND line to shield the CCIO line from the CCCLK line.2.1.5 Digital Audio InterfaceEHS6‘s digital audio interface (DAI) can be used to connect audio devices capable of pulsecode modulation (PCM). 2.1.6 GPIO InterfaceEHS6 offers a GPIO interface with 22 GPIO lines. The GPIO lines are shared with other inter-faces resp. functions: Fast shutdown (see Section 2.1.13), status LED (see Section 2.1.12), thePWM functionality (see Section 2.1.10), an pulse counter (see Section 2.1.11), ASC0 (see Sec-tion 2.1.2), ASC1 (see Section 2.1.3), an SPI interface (see Section 2.1.8), an HSIC interface(see Section 2.1.9) and a PCM interface (see Section 2.1.5) The following table shows the configuration variants for the GPIO pads. All variants are mutu-ally exclusive, i.e. a pad configured for instance as Status LED is locked for alternative usage.SIMCCVCCCCRSTCCIOCCCLK220nF1nFCCINV180
EHS6 Hardware Interface Overview2.1 Application Interface21EHS6_HIO_v01.441 Page 15 of 38 2013-07-11Confidential / PreliminaryWhen the EHS6 starts up, all GPIO lines (except GPIO1-GPIO3 and GPIO24) are set to high-impedance state after initializing. Therefore, it is recommended to connect external pull-up orpull-down resistors to those GPIO lines that are to be used as output. This is necessary to keepthese lines from floating or driving any external devices.Table 2:  GPIO lines and possible alternative assignmentGPIO Fast Shutdown Status LED PWM Pulse Counter ASC0 ASC1 SPI HSIC PCMGPIO1 DTR0GPIO2 DCD0GPIO3 DSR0 SPI_CLKGPIO4 FST_SHDNGPIO5 Status LEDGPIO6 PWM2GPIO7 PWM1GPIO8 COUNTERGPIO11GPIO12GPIO13GPIO14GPIO15GPIO16 RXD1 MOSI AP_WAKEUPGPIO17 TXD1 MISO HOST_ACTIVEGPIO18 RTS1 CP_WAKEUPGPIO19 CTS1 SPI_CS SUSPENDGPIO20 TXDDAIGPIO21 RXDDAIGPIO22 TFSDAIGPIO23 SCLKGPIO24 RING0
EHS6 Hardware Interface Overview2.1 Application Interface21EHS6_HIO_v01.441 Page 16 of 38 2013-07-11Confidential / Preliminary2.1.7 I2C InterfaceI2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It con-sists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module actsas a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-direc-tional line. Each device connected to the bus is software addressable by a unique 7-bit ad-dress, and simple master/slave relationships exist at all times. The module operates as master-transmitter or as master-receiver. The customer application transmits or receives data only onrequest of the module.The I2C interface can be powered via the V180 line of EHS6. If connected to the V180 line, theI2C interface will properly shut down when the module enters the Power Down mode.Note: Good care should be taken when creating the PCB layout of the host application: Thetraces of I2CCLK and I2CDAT should be equal in length and as short as possible.2.1.8 SPI InterfaceFour EHS6 GPIO interface lines can be configured as Serial Peripheral Interface (SPI). TheSPI is a synchronous serial interface for control and data transfer between EHS6 and the ex-ternal application. Only one application can be connected to the SPI and the interface supportsonly master mode. The transmission rates are up to 26Mbit/s. The SPI interface comprises thetwo data lines MOSI and MISO, the clock line SPI_CLK a well as the chip select line SPI_CS.2.1.9 HSIC InterfaceThe (USB) High Speed Inter Chip Interface can be used between the module and an external application processor and is compliant to the High Speed USB 2.0 interface with 480Mbit/s. The maximum distance between module processor and external application processor should not exceed 100mm.The HSIC interface comprises 6 lines:• Two signal lines (strobe - HSIC_STRB - and data - HSIC_DATA) are used in a source syn-chronous serial interface with a 240MHz clock to provide a 480Mbps USB interface. The HSIC_STRB and HSIC_DATA lines are high-speed signals and should be routed as50Ohm impedance traces. The trace length of these signals should be balanced to mini-mize timing skew and no longer as 100mm.• Four signal lines for Link Power Management (LPM). For further power reduction, the USBHSIC interface supports LPM according to the USB 2.0 standard. The LPM defines powermanagement states and mechanisms to affect state changes that are used by theAP_WAKEUP and CP_WAKEUP signal lines to efficiently manage bus and system power.To take advantage of the LPM feature, two further signals are needed to support powermanagement state transitions - the SUSPEND and HOST_ACTIVE signals.
EHS6 Hardware Interface Overview2.1 Application Interface21EHS6_HIO_v01.441 Page 17 of 38 2013-07-11Confidential / Preliminary2.1.10 PWM InterfacesThe GPIO6 and GPIO7 interface lines can be configured as Pulse Width Modulation interfacelines PWM1 and PWM2. The PWM interface lines can be used, for example, to connect buzz-ers. The PWM1 line is shared with GPIO7 and the PWM2 line is shared with GPIO6 (for GPIOssee Section 2.1.6). GPIO and PWM functionality are mutually exclusive.2.1.11 Pulse CounterThe GPIO8 line can be configured as pulse counter line COUNTER. The pulse counter inter-face can be used, for example, as a clock (for GPIOs see Section 2.1.6).2.1.12 Status LEDThe GPIO5 interface line can be configured to drive a status LED that indicates different oper-ating modes of the module (for GPIOs see Section 2.1.6). GPIO and LED functionality are mu-tually exclusive.2.1.13 Fast ShutdownThe GPIO4 interface line can be configured as fast shutdown signal line FST_SHDN. The con-figured FST_SHDN line is an active low control signal and must be applied for at least 10ms. If unused this line can be left open because of a configured internal pull-up resistor.
EHS6 Hardware Interface Overview2.2 RF Antenna Interface21EHS6_HIO_v01.441 Page 18 of 38 2013-07-11Confidential / Preliminary2.2 RF Antenna InterfaceThe RF interface has an impedance of 50. EHS6 is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power.The external antenna must be matched properly to achieve best performance regarding radi-ated power, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the EHS6 module and should be placed in the host application if the antenna does not have an impedance of 50.Regarding the return loss EHS6 provides the following values in the active band:Table 3:  Return loss in the active bandState of module Return loss of module Recommended return loss of applicationReceive > 8dB > 12dBTransmit not applicable  > 12dB
EHS6 Hardware Interface Overview2.2 RF Antenna Interface21EHS6_HIO_v01.441 Page 19 of 38 2013-07-11Confidential / Preliminary2.2.1 Antenna InstallationThe antenna is connected by soldering the antenna pad (RF_OUT, i.e., pad #59) and its neigh-boring ground pads (GND, i.e., pads #58 and #60) directly to the application’s PCB. The anten-na pad is the antenna reference point (ARP) for EHS6. All RF data specified throughout this document is related to the ARP.The distance between the antenna RF_OUT pad (#59) and its neighboring GND pads (#58, #60) has been optimized for best possible impedance. On the application PCB, special atten-tion should be paid to these 3 pads, in order to prevent mismatch.The wiring of the antenna connection line, starting from the antenna pad to the application an-tenna should result in a 50 line impedance. Line width and distance to the GND plane needs to be optimized with regard to the PCB’s layer stack. To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the application PCB, it is recommended to realize the antenna connection line using embedded Stripline rather than Micro-Stripline technology. For type approval purposes, the use of a 50 coaxial antenna connector (U.FL-R-SMT) might be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible to EHS6‘s antenna pad.
EHS6 Hardware Interface Overview2.3 Sample Application21EHS6_HIO_v01.441 Page 20 of 38 2013-07-11Confidential / Preliminary2.3 Sample ApplicationFigure 6 shows a typical example of how to integrate a EHS6 module with an application. Us-age of the various host interfaces depends on the desired features of the application.Because of the very low power consumption design, current flowing from any other source intothe module circuit must be avoided, for example reverse current from high state external controllines. Therefore, the controlling application must be designed to prevent reverse current flow.Otherwise there is the risk of undefined states of the module during startup and shutdown oreven of damaging the module.Because of the high RF field density inside the module, it cannot be guaranteed that no selfinterference might occur, depending on frequency and the applications grounding concept. ex-cluded that in some applications dependant on the grounding concept of the customer. The po-tential interferers may be minimized by placing small capacitors (47pF) at suspected lines (e.g.RXD0, RXT0, VDDLP, and ON). While developing SMT applications it is strongly recommended to provide test pointsfor certain signals resp. lines to and from the module - for debug and/or test purposes.The SMT application should allow for an easy access to these signals. For details onhow to implement test points see [3].The EMC measures are best practice recommendations. In fact, an adequate EMC strategy foran individual application is very much determined by the overall layout and, especially, the po-sition of components. For example, mounting the internal acoustic transducers directly on thePCB eliminates the need to use the ferrite beads shown in the sample schematic. Please note that EHS6 is not intended for use with cables longer than 3m.DisclaimerNo warranty, either stated or implied, is provided on the sample schematic diagram shown inFigure 6 and the information detailed in this section. As functionality and compliance with na-tional regulations depend to a great amount on the used electronic components and the indi-vidual application layout manufacturers are required to ensure adequate design and operatingsafeguards for their products using EHS6 modules.
EHS6 Hardware Interface Overview2.3 Sample Application21EHS6_HIO_v01.441 Page 21 of 38 2013-07-11Confidential / PreliminaryFigure 6:  Schematic diagram of EHS6 sample applicationONEMERG_RSTVCOREV180IGTRESETASC0 (including GPIO1...GPIO3 for DSR0, DTR0, DCD0 and GPIO24 for RING0)/SPI_CLK (for DSR0)HSIC LPM/GPIO16...GPIO19/ASC1/SPI84CCVCCCCIOCCCLKCCINCCRSTSIMV180220nF 1nFI2CCLKI2CDAT2.2kV180GPIO4 (FST_SHDN) GPIO5 (Status LED)GPIO6 (PWM)GPIO7 (PWM)GPIO8 (COUNTER)GPIO11...GPIO15LEDGNDGNDGNDRF OUTBATT+Power supplyMain AntennaEHS6All SIM components should be close to card holder. Keep SIM wires low capacitive.*10pF *10pF* add optional 10pF for SIM protection against RF  (internal Antenna)150µF,Low ESR!33pFBlocking**Blocking**2HSICBlocking**VDDLPPWR_INDAUTO_ONBATT+53204GPIO20...GPIO23/PCM (DAI)4Blocking**VDDLP100k100k100k4.7k100k22k2.2k0R3USB
EHS6 Hardware Interface Overview3 Operating Characteristics23EHS6_HIO_v01.441 Page 22 of 38 2013-07-11Confidential / Preliminary3 Operating Characteristics3.1 Operating ModesThe table below briefly summarizes the various operating modes referred to throughout the document. Table 4:  Overview of operating modesMode FunctionNormal operation GSM / GPRS / UMTS / HSPA SLEEPPower saving set automatically when no call is in progress and the USB connection is suspended by host or not present and no active commu-nication via ASC0. GSM / GPRS / UMTS / HSPA IDLEPower saving disabled or an USB connection not suspended, but no call in progress.GSM TALK/GSM DATA Connection between two subscribers is in progress. Power consump-tion depends on the GSM network coverage and several connection settings (e.g. DTX off/on, FR/EFR/HR, hopping sequences and antenna connection). The following applies when power is to be mea-sured in TALK_GSM mode: DTX off, FR and no frequency hopping.GPRS DATA GPRS data transfer in progress. Power consumption depends on net-work settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multislot settings).EGPRS DATA EGPRS data transfer in progress. Power consumption depends on net-work settings (e.g. power control level), uplink / downlink data rates and EGPRS configuration (e.g. used multislot settings).UMTS TALK/UMTS DATA UMTS data transfer in progress. Power consumption depends on net-work settings (e.g. TPC Pattern) and data transfer rate.HSPA DATA HSPA data transfer in progress. Power consumption depends on net-work settings (e.g. TPC Pattern) and data transfer rate.Power Down Normal shutdown after sending the power down command. Only a voltage regulator is active for powering the RTC. Software is not active. Interfaces are not accessible. Operat-ing voltage (connected to BATT+) remains applied.Airplane mode Airplane mode shuts down the radio part of the module, causes the module to log off from the GSM/GPRS network and disables all AT commands whose execution requires a radio connection.Airplane mode can be controlled by AT command (see [1]).
EHS6 Hardware Interface Overview3.2 Power Supply23EHS6_HIO_v01.441 Page 23 of 38 2013-07-11Confidential / Preliminary3.2 Power SupplyEHS6 needs to be connected to a power supply at the SMT application interface (2 lines each BATT+ and GND). The power supply of EHS6 has to be a single voltage source at BATT+. It must be able to pro-vide the peak current during the uplink transmission. All the key functions for supplying power to the device are handled by the power management section of the analog controller. This IC provides the following features:• Stabilizes the supply voltages for the baseband using low drop linear voltage regulators anda DC-DC step down switching regulator.• Switches the module's power voltages for the power-up and -down procedures.• SIM switch to provide SIM power supply.
EHS6 Hardware Interface Overview4 Mechanical Dimensions, Mounting and Packaging25EHS6_HIO_v01.441 Page 24 of 38 2013-07-11Confidential / Preliminary4 Mechanical Dimensions, Mounting and Packaging4.1 Mechanical Dimensions of EHS6Figure 7 shows the top and bottom view of EHS6 and provides an overview of the board's me-chanical dimensions. For further details see Figure 8. Figure 7:  EHS6– top and bottom viewProduct labelTop viewBottom view
EHS6 Hardware Interface Overview4.1 Mechanical Dimensions of EHS625EHS6_HIO_v01.441 Page 25 of 38 2013-07-11Confidential / PreliminaryFigure 8:  Dimensions of EHS6 (all dimensions in mm)
EHS6 Hardware Interface Overview5 Regulatory and Type Approval Information31EHS6_HIO_v01.441 Page 26 of 38 2013-07-11Confidential / Preliminary5 Regulatory and Type Approval Information5.1 Directives and StandardsEHS6 is designed to comply with the directives and standards listed below.It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec-ifications provided in the "EHS6 Hardware Interface Description".11. Manufacturers of applications which can be used in the US shall ensure that their applications have aPTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module. Table 5:  Directives1999/05/EC Directive of the European Parliament and of the council of 9 March 1999 on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity (in short referred to as R&TTE Direc-tive 1999/5/EC).The product is labeled with the CE conformity mark 2002/95/EC (RoHS 1)2011/65/EC (RoHS 2) Directive of the European Parliament and of the Council of 27 January 2003 (and revised on 8 June 2011) on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)Table 6:  Standards of North American type approvalCFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommunications, PCS); US Equipment Authorization FCCOET Bulletin 65 (Edition 97-01)  Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic FieldsUL 60 950-1 Product Safety Certification (Safety requirements)NAPRD.03 V5.15 Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI controlPCS Type Certification Review board (PTCRB)RSS132 (Issue2)RSS133 (Issue5) Canadian StandardTable 7:  Standards of European type approval3GPP TS 51.010-1 Digital cellular telecommunications system (Release 7); Mobile Station (MS) conformance specification;ETSI EN 301 511 V9.0.2 Global System for Mobile communications (GSM); Harmonized standard for mobile stations in the GSM 900 and DCS 1800 bands covering essential requirements under article 3.2 of the R&TTE directive (1999/5/EC)GCF-CC V3.49 Global Certification Forum - Certification CriteriaETSI EN 301 489-01 V1.9.2 Electromagnetic Compatibility and Radio spectrum Matters (ERM); Electro-magnetic Compatibility (EMC) standard for radio equipment and services; Part 1: Common Technical Requirements
EHS6 Hardware Interface Overview5.1 Directives and Standards31EHS6_HIO_v01.441 Page 27 of 38 2013-07-11Confidential / PreliminaryETSI EN 301 489-07 V1.3.1 Electromagnetic Compatibility and Radio spectrum Matters (ERM); Electro-magnetic Compatibility (EMC) standard for radio equipment and services; Part 7: Specific conditions for mobile and portable radio and ancillary equip-ment of digital cellular radio telecommunications systems (GSM and DCS)ETSI EN 301 489-24 V1.5.1 Electromagnetic Compatibility and Radio spectrum Matters (ERM); Electro-magnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipmentETSI EN 301 908-01 V5.2.1 Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation cel-lular networks; Part 1: Harmonized EN for IMT-2000, introduction and com-mon requirements of article 3.2 of the R&TTE DirectiveETSI EN 301 908-02 V5.2.1 Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000 Third Generation cel-lular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE DirectiveEN 62311:2008 Assessment of electronic and electrical equipment related to human expo-sure restrictions for electromagnetic fields (0 Hz - 300 GHz)IEC/EN 60950-1:2006/A1:2010+A12:2012IEC 60950-1:2005/A1:2009(second edition)Safety of information technology equipmentTable 8:  Requirements of qualityIEC 60068 Environmental testingDIN EN 60529 IP codesTable 9:  Standards of the Ministry of Information Industry of the People’s Republic of ChinaSJ/T 11363-2006  “Requirements for Concentration Limits for Certain Hazardous Sub-stances in Electronic Information Products” (2006-06).SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic Information Products” (2006-06).According to the “Chinese Administration on the Control of Pollution caused by Electronic Information Products” (ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Cin-terion Wireless Modules Hardware Interface Description.Please see Table 10 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006. Table 7:  Standards of European type approval
EHS6 Hardware Interface Overview5.1 Directives and Standards31EHS6_HIO_v01.441 Page 28 of 38 2013-07-11Confidential / PreliminaryTable 10:  Toxic or hazardous substances or elements with defined concentration limits
EHS6 Hardware Interface Overview5.2 SAR requirements specific to portable mobiles31EHS6_HIO_v01.441 Page 29 of 38 2013-07-11Confidential / Preliminary5.2 SAR requirements specific to portable mobilesMobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable EHS6 based applications to be evalu-ated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For European and US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US marketsES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in thefrequency range 30MHz - 6GHz Products intended for sale on European marketsEN 50360 Product standard to demonstrate the compliance of mobile phones withthe basic restrictions related to human exposure to electromagnetic fields (300MHz - 3GHz)Please note that SAR requirements are specific only for portable devices and not for mobile devices as defined below:• Portable device:A portable device is defined as a transmitting device designed to be used so that the radi-ating structure(s) of the device is/are within 20 centimeters of the body of the user.• Mobile device:A mobile device is defined as a transmitting device designed to be used in other than fixedlocations and to generally be used in such a way that a separation distance of at least 20centimeters is normally maintained between the transmitter's radiating structure(s) and thebody of the user or nearby persons. In this context, the term ''fixed location'' means that thedevice is physically secured at one location and is not able to be easily moved to anotherlocation.
EHS6 Hardware Interface Overview5.3 Reference Equipment for Type Approval31EHS6_HIO_v01.441 Page 30 of 38 2013-07-11Confidential / Preliminary5.3 Reference Equipment for Type ApprovalThe Cinterion Wireless Modules reference setup submitted to type approve EHS6 (including a special approval adapter for the DSB75) is shown in the following figure1:Figure 9:  Reference equipment for Type Approval1.  For RF performance tests a mini-SMT/U.FL to SMA adapter with attached 6dB coaxial attenuator is cho-sen to connect the evaluation module directly to the GSM/UMTS test equipment instead of employingthe SMA antenna connectors on the EHS6-DSB75 adapter as shown in Figure 9. The following pro-ducts are recommended: Hirose SMA-Jack/U.FL-Plug conversion adapter HRMJ-U.FLP(40)(for details see see http://www.hirose-connectors.com/ or http://www.farnell.com/Aeroflex Weinschel Fixed Coaxial Attenuator Model 3T/4T (for details see http://www.aeroflex.com/ams/weinschel/pdfiles/wmod3&4T.pdf)AntennaGSM / GPRS / UMTS Antenna with 1m cable ASC0PCPower supplyGSM / GPRS / UMTSBase stationDSB75Audio test systemHandsetASC1USBCodec adapterDAIAnalog AudioApproval adapter for DSB75SMAEvaluation moduleEHS6 USBEvaluation moduleEHS6SIM cardAudio
EHS6 Hardware Interface Overview5.4 Compliance with FCC and IC Rules and Regulations31EHS6_HIO_v01.441 Page 31 of 38 2013-07-11Confidential / Preliminary5.4 Compliance with FCC and IC Rules and RegulationsThe Equipment Authorization Certification for the Cinterion Wireless Modules reference appli-cation described in Section 5.3 will be registered under the following identifiers:FCC Identifier: QIPEHS6Industry Canada Certification Number: 7830A-EHS6Granted to Cinterion Wireless Modules GmbH Manufacturers of mobile or fixed devices incorporating EHS6 modules are authorized to use the FCC Grants and Industry Canada Certificates of the EHS6 modules for their own final prod-ucts according to the conditions referenced in these documents. In this case, an FCC/ IC label of the module shall be visible from the outside, or the host device shall bear a second label stat-ing "Contains FCC ID QIPEHS6", and accordingly “Contains IC 7830A-EHS6“. The integration is limited to fixed or mobile categorised host devices, where a separation distance between the an-tenna and any person of min. 20cm can be assured during normal operating conditions. For mobile and fixed operation configurations the antenna gain, including cable loss, must not ex-ceed the limits 4.02 dBi (850 MHz) and 2.81 dBi (1900 MHz).IMPORTANT: Manufacturers of portable applications incorporating EHS6 modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate relat-ed to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles (see Section 5.2 for detail).Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with Industry Canada licence-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful inter-ference in a residential installation. This equipment generates, uses and can radiate radio fre-quency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver isconnected.• Consult the dealer or an experienced radio/TV technician for help.This Class B digital apparatus complies with Canadian ICES-003.If Canadian approval is requested for devices incorporating EHS6 modules the above note will have to be provided in the English and French language in the final user documentation. Manufacturers/OEM Integrators must ensure that the final user documentation does not con-tain any information on how to install or remove the module from the final product.
EHS6 Hardware Interface Overview6 Document Information36EHS6_HIO_v01.441 Page 32 of 38 2013-07-11Confidential / Preliminary6 Document Information6.1 Revision HistoryNew document: "EHS6 Hardware Interface Overview" Version 01.4416.2 Related Documents[1] EHS6 AT Command Set[2] EHS6 Release Note[3] Application Note 48: SMT Module Integration6.3 Terms and AbbreviationsChapter What is new-- Initial document setup.Abbreviation DescriptionADC Analog-to-digital converterAGC Automatic Gain ControlANSI American National Standards InstituteARFCN Absolute Radio Frequency Channel NumberARP Antenna Reference PointASC0/ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of EHS6B Thermistor ConstantBER Bit Error RateBTS Base Transceiver StationCB or CBM Cell Broadcast MessageCE Conformité Européene (European Conformity)CHAP Challenge Handshake Authentication ProtocolCPU Central Processing UnitCS Coding SchemeCSD Circuit Switched DataCTS Clear to SendDAC Digital-to-Analog ConverterDAI Digital Audio Interface
EHS6 Hardware Interface Overview6.3 Terms and Abbreviations36EHS6_HIO_v01.441 Page 33 of 38 2013-07-11Confidential / PreliminarydBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-lawDCE Data Communication Equipment (typically modems, e.g. Cinterion GSM module)DCS 1800 Digital Cellular System, also referred to as PCNDRX Discontinuous ReceptionDSB Development Support BoxDSP Digital Signal ProcessorDSR Data Set ReadyDTE Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM application)DTR Data Terminal ReadyDTX Discontinuous TransmissionEFR Enhanced Full RateEGSM Enhanced GSMEIRP Equivalent Isotropic Radiated PowerEMC Electromagnetic CompatibilityERP Effective Radiated PowerESD Electrostatic DischargeETS European Telecommunication StandardFCC Federal Communications Commission (U.S.)FDMA Frequency Division Multiple AccessFR Full RateGMSK Gaussian Minimum Shift KeyingGPIO General Purpose Input/OutputGPRS General Packet Radio ServiceGSM Global Standard for Mobile CommunicationsHiZ High ImpedanceHR Half RateI/O Input/OutputIC Integrated CircuitIMEI International Mobile Equipment IdentityISO International Standards OrganizationITU International Telecommunications Unionkbps kbits per secondLED Light Emitting DiodeLi-Ion/Li+ Lithium-IonLi battery Rechargeable Lithium Ion or Lithium Polymer batteryLPM Link Power ManagementMbps Mbits per secondAbbreviation Description
EHS6 Hardware Interface Overview6.3 Terms and Abbreviations36EHS6_HIO_v01.441 Page 34 of 38 2013-07-11Confidential / PreliminaryMMI Man Machine InterfaceMO Mobile OriginatedMS Mobile Station (GSM module), also referred to as TEMSISDN Mobile Station International ISDN numberMT Mobile TerminatedNTC Negative Temperature CoefficientOEM Original Equipment ManufacturerPA Power AmplifierPAP Password Authentication ProtocolPBCCH Packet Switched Broadcast Control ChannelPCB Printed Circuit BoardPCL Power Control LevelPCM Pulse Code ModulationPCN Personal Communications Network, also referred to as DCS 1800PCS Personal Communication System, also referred to as GSM 1900PDU Protocol Data UnitPLL Phase Locked LoopPPP Point-to-point protocolPSK Phase Shift KeyingPSU Power Supply UnitPWM Pulse Width ModulationR&TTE Radio and Telecommunication Terminal EquipmentRAM Random Access MemoryRF Radio FrequencyRLS Radio Link StabilityRMS Root Mean Square (value)RoHS Restriction of the use of certain hazardous substances in electrical and electronic equipment. ROM Read-only MemoryRTC Real Time ClockRTS Request to SendRx Receive DirectionSAR Specific Absorption RateSAW Surface Accoustic WaveSELV Safety Extra Low VoltageSIM Subscriber Identification ModuleSMD Surface Mount DeviceSMS Short Message ServiceAbbreviation Description
EHS6 Hardware Interface Overview6.3 Terms and Abbreviations36EHS6_HIO_v01.441 Page 35 of 38 2013-07-11Confidential / PreliminarySMT Surface Mount TechnologySPI Serial Peripheral InterfaceSRAM Static Random Access MemoryTA Terminal adapter (e.g. GSM module)TDMA Time Division Multiple AccessTE Terminal Equipment, also referred to as DTETLS Transport Layer SecurityTx Transmit DirectionUART Universal asynchronous receiver-transmitterURC Unsolicited Result CodeUSSD Unstructured Supplementary Service DataVSWR Voltage Standing Wave RatioAbbreviation Description
EHS6 Hardware Interface Overview6.4 Safety Precaution Notes36EHS6_HIO_v01.441 Page 36 of 38 2013-07-11Confidential / Preliminary6.4 Safety Precaution NotesThe following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating EHS6. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Fail-ure to comply with these precautions violates safety standards of design, manufacture and in-tended use of the product. Cinterion Wireless Modules assumes no liability for customer’s failure to comply with these precautions.When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hear-ing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both.Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any elec-trical equipment in potentially explosive atmospheres can constitute a safety hazard.Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger.Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-ing a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or opera-tion can constitute a safety hazard.IMPORTANT!Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call.Some networks require that a valid SIM card be properly inserted in the cellular termi-nal or mobile.
EHS6 Hardware Interface Overview7 Appendix38EHS6_HIO_v01.441 Page 37 of 38 2013-07-11Confidential / Preliminary7 Appendix7.1 List of Parts and AccessoriesTable 11:  List of parts and accessoriesDescription Supplier Ordering informationEHS6 Cinterion Standard module Cinterion Wireless Modules IMEI:Packaging unit (ordering) number: L30960-N2950-A100Module label number: S30960-S2950-A100-1Customer IMEI mode:Packaging unit (ordering) number: L30960-N2955-A100Module label number: S30960-S2955-A100-1DSB75 Evaluation Kit Cinterion Ordering number: L36880-N8811-A100Multi-Adapter R1 for mount-ing EHS6 evaluation mod-ules onto DSB75Cinterion Ordering number: L30960-N0010-A100Approval adapter for mount-ing EHS6 evaluation mod-ules onto DSB75Cinterion Ordering number: L30960-N2301-A100Evaluation Module Cinterion Ordering number: L30960-N2951-A100 (EHS6)Votronic Handset Votronic / Cinterion Cinterion ordering number: L36880-N8301-A107Votronic ordering number: HH-SI-30.3/V1.1/0Votronic Entwicklungs- und Produktionsgesellschaft für elek-tronische Geräte mbHSaarbrücker Str. 866386 St. IngbertGermanyPhone:  +49-(0)6 89 4 / 92 55-0Fax:  +49-(0)6 89 4 / 92 55-88Email:  contact@votronic.comSIM card holder incl. push button ejector and slide-in trayMolex Ordering numbers:  91228 91236Sales contacts are listed in Table 12.
EHS6 Hardware Interface Overview7.1 List of Parts and Accessories38EHS6_HIO_v01.441 Page 38 of 38 2013-07-11Confidential / PreliminaryTable 12:  Molex sales contacts (subject to change)MolexFor further information please click:http://www.molex.comMolex Deutschland GmbHOtto-Hahn-Str. 1b69190 WalldorfGermanyPhone: +49-6227-3091-0Fax: +49-6227-3091-8100Email:  mxgermany@molex.comAmerican HeadquartersLisle, Illinois 60532U.S.A.Phone: +1-800-78MOLEXFax: +1-630-969-1352Molex China DistributorsBeijing, Room 1311, Tower B, COFCO PlazaNo. 8, Jian Guo Men Nei Street, 100005BeijingP.R. ChinaPhone:  +86-10-6526-9628 Fax:  +86-10-6526-9730Molex Singapore Pte. Ltd.110, International RoadJurong Town, Singapore 629174Phone:  +65-6-268-6868Fax: +65-6-265-6044Molex Japan Co. Ltd.1-5-4 Fukami-Higashi,Yamato-City,Kanagawa, 242-8585 JapanPhone:  +81-46-265-2325Fax: +81-46-265-2365

Navigation menu