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Gemalto M2M GmbH CAT 1 LTE Module hid elsx1 va

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User Manual

 M2M.GEMALTO.COMCinterion® ELS31-VA/ELS51-VAHardware Interface DescriptionVersion: 01.000DocId: ELS31-VA_ELS51-VA_HID_v01.000
GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PROD-UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANYEVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINSINFORMATION ON GEMALTO M2M PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARESUBJECT TO CHANGE AT GEMALTO M2M'S DISCRETION. GEMALTO M2M GMBH GRANTS A NON-EXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANSFER, COPY,MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE ORDECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLYAUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS IS" BASIS ONLYAND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTEDBY APPLICABLE LAW, GEMALTO M2M GMBH DISCLAIMS ALL WARRANTIES AND LIABILITIES.THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECYREGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIV-ERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUEDACCORDING TO GERMAN LAW.CopyrightTransmittal, reproduction, dissemination and/or editing of this document as well as utilization of its con-tents and communication thereof to others without express authorization are prohibited. Offenders will beheld liable for payment of damages. All rights created by patent grant or registration of a utility model ordesign patent are reserved. Copyright © 2017, Gemalto M2M GmbH, a Gemalto CompanyTrademark NoticeGemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certaincountries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corpora-tion in the United States and/or other countries. All other registered trademarks or trademarks mentionedin this document are property of their respective owners.ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryCinterion® ELS31-VA/ELS51-VA Hardware Interface Description2Page 2 of 106Document Name: Cinterion® ELS31-VA/ELS51-VA Hardware Interface DescriptionVersion: 01.000Date: 2017-01-04DocId: ELS31-VA_ELS51-VA_HID_v01.000Status: Confidential / Preliminary
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Contents106ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 3 of 106Contents1 Introduction ................................................................................................................. 91.1 Key Features at a Glance .................................................................................. 91.2 ELS31-VA/ELS51-VA System Overview ......................................................... 121.3 Circuit Concept ................................................................................................ 132 Interface Characteristics .......................................................................................... 142.1 Application Interface ........................................................................................ 142.1.1 Pad Assignment.................................................................................. 142.1.2 Signal Properties................................................................................. 162.1.2.1 Absolute Maximum Ratings ................................................ 212.1.3 USB Interface...................................................................................... 222.1.3.1 Interface implementation..................................................... 232.1.3.2 Reducing Power Consumption............................................ 242.1.4 Serial Interface ASC0 ......................................................................... 252.1.4.1 Serial Interface Start-up Behavior ....................................... 262.1.5 Serial Interface ASC1 ......................................................................... 272.1.6 UICC/SIM/USIM Interface................................................................... 292.1.7 Digital Audio Interface......................................................................... 312.1.8 Pulse Code Modulation Interface (PCM) ............................................ 312.1.9 Inter IC Sound Interface (I2S).............................................................. 332.1.10 GPIO Interface .................................................................................... 342.1.11 I2C Interface ........................................................................................ 362.1.12 SPI Interface ....................................................................................... 382.1.13 Pulse Counter ..................................................................................... 392.1.14 HSIC Interface (ELS51-VA Only)........................................................ 392.1.15 SDIO Interface (ELS51-VA Only)........................................................ 392.1.16 Control Signals.................................................................................... 422.1.16.1 Status LED .......................................................................... 422.1.16.2 Power Indication Circuit ...................................................... 432.1.16.3 Host Wakeup....................................................................... 432.1.16.4 Fast Shutdown .................................................................... 452.2 RF Antenna Interface....................................................................................... 462.2.1 Antenna Interface Specifications ........................................................ 462.2.2 Antenna Installation ............................................................................ 472.2.3 RF Line Routing Design...................................................................... 482.2.3.1 RF Interface Signals Circuit Diagram Example................... 482.2.3.2 Line Arrangement Examples ............................................... 492.3 Sample Application .......................................................................................... 542.3.1 Prevent Back Powering....................................................................... 562.3.2 Sample Level Conversion Circuit........................................................ 56
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Contents106ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 4 of 1063 Operating Characteristics ........................................................................................ 573.1 Operating Modes ............................................................................................. 573.2 Power Up/Power Down Scenarios................................................................... 583.2.1 Turn on ELS31-VA/ELS51-VA ............................................................ 583.2.1.1 Connecting ELS31-VA/ELS51-VA BATT Lines.................... 583.2.1.2 Switch on ELS31-VA/ELS51-VA Using ON Signal .............. 593.2.2 Restart ELS31-VA/ELS51-VA............................................................. 603.2.2.1 Restart ELS31-VA/ELS51-VA via AT+CFUN Command ..... 603.2.2.2 Restart ELS31-VA/ELS51-VA Using EMERG_RST ............ 603.2.3 Signal States after First Startup .......................................................... 623.2.4 Turn off ELS31-VA/ELS51-VA ............................................................ 633.2.4.1 Switch off ELS31-VA/ELS51-VA Using AT Command ......... 633.2.5 Automatic Shutdown ........................................................................... 643.2.5.1 Thermal Shutdown .............................................................. 643.2.5.2 Undervoltage Shutdown...................................................... 653.2.5.3 Overvoltage Shutdown........................................................ 653.3 Power Saving................................................................................................... 663.3.1 Power Saving while Attached to LTE Networks.................................. 663.3.2 Wake-up via RTS0/RTS1.................................................................... 673.4 Power Supply................................................................................................... 683.4.1 Power Supply Ratings......................................................................... 693.4.2 Minimizing Power Losses ................................................................... 703.4.3 Measuring the Supply Voltage (BATT_BB)......................................... 703.4.4 Monitoring Power Supply by AT Command ........................................ 703.5 Operating Temperatures.................................................................................. 713.6 Electrostatic Discharge .................................................................................... 723.6.1 ESD Protection for Antenna Interface................................................. 723.7 Blocking against RF on Interface Lines ........................................................... 733.8 Reliability Characteristics................................................................................. 764 Mechanical Dimensions, Mounting and Packaging............................................... 774.1 Mechanical Dimensions of ELS31-VA/ELS51-VA ........................................... 774.2 Mounting ELS31-VA/ELS51-VA onto the Application Platform........................ 794.2.1 SMT PCB Assembly ........................................................................... 794.2.1.1 Land Pattern and Stencil..................................................... 794.2.1.2 Board Level Characterization.............................................. 814.2.2 Moisture Sensitivity Level ................................................................... 814.2.3 Soldering Conditions and Temperature .............................................. 824.2.3.1 Reflow Profile ...................................................................... 824.2.3.2 Maximum Temperature and Duration.................................. 834.2.4 Durability and Mechanical Handling.................................................... 844.2.4.1 Storage Conditions.............................................................. 844.2.4.2 Processing Life.................................................................... 854.2.4.3 Baking ................................................................................. 854.2.4.4 Electrostatic Discharge ....................................................... 85
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Contents106ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 5 of 1064.3 Packaging ........................................................................................................ 864.3.1 Tape and Reel .................................................................................... 864.3.1.1 Orientation........................................................................... 864.3.1.2 Barcode Label ..................................................................... 874.3.2 Shipping Materials .............................................................................. 884.3.2.1 Moisture Barrier Bag ........................................................... 884.3.2.2 Transportation Box .............................................................. 904.3.3 Trays ................................................................................................... 915 Regulatory and Type Approval Information ........................................................... 935.1 Directives and Standards................................................................................. 935.2 SAR requirements specific to portable mobiles ............................................... 955.3 Reference Equipment for Type Approval......................................................... 965.4 Compliance with FCC and IC Rules and Regulations ..................................... 976 Document Information.............................................................................................. 996.1 Revision History ............................................................................................... 996.2 Related Documents ....................................................................................... 1006.3 Terms and Abbreviations ............................................................................... 1006.4 Safety Precaution Notes ................................................................................ 1037 Appendix.................................................................................................................. 1047.1 List of Parts and Accessories......................................................................... 104
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Tables106ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 6 of 106TablesTable 1: Pad assignments............................................................................................  15Table 2: Signal properties ............................................................................................  16Table 3: Absolute maximum ratings.............................................................................  21Table 4: Signals of the SIM interface (SMT application interface) ...............................  29Table 5: Overview of PCM pin functions......................................................................  32Table 6: Overview of I2S pin functions .........................................................................  33Table 7: GPIO lines and possible alternative assignment............................................  34Table 8: SDIO interface features..................................................................................  39Table 9: SDIO interface lines .......................................................................................  40Table 10: SDIO timings..................................................................................................  40Table 11: Host wakeup line............................................................................................  43Table 12: Return loss in the active band........................................................................  46Table 13: RF Antenna interface LTE..............................................................................  46Table 14: Overview of operating modes ........................................................................  57Table 15: Signal states...................................................................................................  62Table 16: Temperature dependent behavior..................................................................  64Table 17: Voltage supply ratings....................................................................................  69Table 18: Current consumption ratings..........................................................................  69Table 19: Board temperature .........................................................................................  71Table 20: Electrostatic values ........................................................................................  72Table 21: EMI measures on the application interface....................................................  74Table 22: Summary of reliability test conditions.............................................................  76Table 23: Reflow temperature ratings............................................................................  82Table 24: Storage conditions .........................................................................................  84Table 25: Directives .......................................................................................................  93Table 26: Standards of North American type approval ..................................................  93Table 27: Standards of Verizon type approval...............................................................  93Table 28: Standards of GCF type approval....................................................................  93Table 29: Requirements of quality .................................................................................  93Table 30: Standards of the Ministry of Information Industry of the People’s Republic of China............................................................................  94Table 31: Toxic or hazardous substances or elements with defined concentration limits...............................................................................................................  94Table 32: Antenna gain limits for FCC and IC................................................................  97Table 33: List of parts and accessories........................................................................  104Table 34: Molex sales contacts (subject to change) ....................................................  105
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Figures106ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 7 of 106FiguresFigure 1: ELS31-VA/ELS51-VA system overview.........................................................  12Figure 2: ELS31-VA/ELS51-VA baseband block diagram ............................................  13Figure 3: Numbering plan for connecting pads (bottom view).......................................  14Figure 4: USB circuit .....................................................................................................  22Figure 5: USB Additional ESD Protection Implementation............................................  23Figure 6: Serial interface ASC0.....................................................................................  25Figure 7: ASC0 startup behavior...................................................................................  26Figure 8: Serial interface ASC1.....................................................................................  27Figure 9: ASC1 startup behavior...................................................................................  28Figure 10: External UICC/SIM/USIM card holder circuit .................................................  30Figure 11: PCM timing short frame (4096KHz, 16kHz sample rate) ...............................  32Figure 12: I2S timing (slave mode) ..................................................................................  33Figure 13: GPIO startup behavior ...................................................................................  35Figure 14: I2C interface connected to V180 ....................................................................  36Figure 15: I2C startup behavior .......................................................................................  37Figure 16: Characteristics of SPI modes.........................................................................  38Figure 17: SDIO interface timing diagrams (Input/Output)..............................................  40Figure 18: Status signaling with LED driver ....................................................................  42Figure 19: Power indication circuit ..................................................................................  43Figure 20: Wake-up via RING0 .......................................................................................  44Figure 21: Fast shutdown timing .....................................................................................  45Figure 22: Antenna pads (bottom view) ..........................................................................  47Figure 23: RF interface signals example.........................................................................  48Figure 24: Embedded Stripline with 65µm prepreg (1080) and 710µm core ..................  49Figure 25: Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1 ................  50Figure 26: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2............................  51Figure 27: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1............................  52Figure 28: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2............................  53Figure 29: Schematic diagram of ELS31-VA/ELS51-VA sample application ..................  55Figure 30: Sample level conversion circuit......................................................................  56Figure 31: Sample circuit for applying power using an external µC ................................  58Figure 32: ON timing .......................................................................................................  59Figure 33: Emergency restart timing ...............................................................................  60Figure 34: Switch off behavior.........................................................................................  63Figure 35: Power saving and paging in LTE networks....................................................  66Figure 36: Wake-up via RTS0/RTS1...............................................................................  67Figure 37: Position of reference points BATT_BB/BATT_RF and GND..........................  70Figure 38: ESD protection for RF antenna interface .......................................................  72Figure 39: EMI circuits.....................................................................................................  73Figure 40: ELS31-VA/ELS51-VA– top and bottom view .................................................  77Figure 41: Dimensions of ELS31-VA/ELS51-VA (all dimensions in mm)........................  78Figure 42: Dimensions of ELS31-VA/ELS51-VA (all dimensions in mm) - bottom view .  78Figure 43: Land pattern (top view) ..................................................................................  79Figure 44: Recommended design for 120 micron thick stencil (top view, dual design)...  80Figure 45: Reflow Profile.................................................................................................  82Figure 46: Carrier tape ....................................................................................................  86Figure 47: Reel direction .................................................................................................  86Figure 48: Barcode label on tape reel .............................................................................  87Figure 49: Moisture barrier bag (MBB) with imprint.........................................................  88
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description Figures106ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 8 of 106Figure 50: Moisture Sensitivity Label ..............................................................................  89Figure 51: Humidity Indicator Card - HIC ........................................................................  90Figure 52: Small quantity tray..........................................................................................  91Figure 53: Tray to ship odd module amounts..................................................................  91Figure 54: Trays with packaging materials......................................................................  91Figure 55: Tray dimensions.............................................................................................  92Figure 56: Reference equipment for Type Approval .......................................................  96
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description1 Introduction13ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 9 of 1061 IntroductionThis document1 describes the hardware of the Cinterion® ELS31-VA and ELS51-VA modules for Verizon Networks. It helps you quickly retrieve interface specifications, electrical and me-chanical details and information on the requirements to be considered for integrating further components.The ELS31-VA and ELS51-VA modules include a baseband, a complete dual band RF front-end, memory and required circuitry to meet 3GPP E-UTRA (Long Term Evolution - LTE, Re-lease 10 set of specifications) and Verizon Wireless LTE UE specifications.The module variants differentiate a follows:- ELS31-VA provides LTE connectivity with IP Services- ELS51-VA adds a Linux execution environment available for customer applications1.1 Key Features at a Glance1.  The document is effective only if listed in the appropriate Release Notes as part of the technical docu-mentation delivered with your Gemalto M2M product.Feature ImplementationGeneralFrequency bands LTE dualband: B4, B13Output power  Class 3 (+23dBm +-2dB) for LTE AWS, LTE B4Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD B13Power supply 3.3V to 4.5VOperating temperature (board temperature)Normal operation: -30°C to +80°CExtended operation: -40°C to +90°CPhysical Dimensions: 27.60mm x 18.80mm x 2.05mmWeight: approx. 3gRoHS All hardware components fully compliant with EU RoHS DirectiveLTE features3GPP Release 9 DL 10Mbps, UL 5MbpsLTE Cat. 1 data ratesSMS Point-to-point MT and MOText modeStorage in mobile equipmentSoftwareAT commands Hayes, 3GPP TS 27.007, TS 27.005, product specificSIM Application Toolkit SAT Release 99Firmware update Generic update from host application over ASC0 or USB modemOTA over ASC0 and over USB
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description1.1 Key Features at a Glance13ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 10 of 106InterfacesModule interface Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reli-ability and allows the use of an optional module mounting socket.For more information on how to integrate SMT modules see also [4]. This application note comprises chapters on module mounting and application layout issues as well as on SMT application development equipment.USB USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s)compliant2 serial interfaces  ASC0:• 8-wire modem interface with status and control lines, unbalanced, asyn-chronous• Default baud rate: 115,200 baud• Adjustable baud rates: 4,800 to 921,600, no autobauding support• Supports RTS0/CTS0 hardware flow control. • Indication of incoming data/SMS on RING0 (can be used to wake uphost from power down modes)ASC1 (shared with GPIO lines):• 4-wire, unbalanced asynchronous interface• Default baud rate: 115,200 baud• Adjustable baud rates: 4,800bps to 921,600bps• Supports RTS1/CTS1 hardware flow controlUICC interface Supported SIM/USIM cards: 3V, 1.8VEmbedded UICC Module is prepared for an embedded UICCGPIO interface 20 pads of the application interface programmable as GPIO pads (17) or GPO pads (3):GP(I)Os can be configured as COUNTER, FST_SHDN, ASC0, ASC1, SPI, and DAI signal linesProgramming is done via AT commandsI2C interface Supports I2C serial interfaceSPI interface Supports SPI interfaceSDIO ELS51-VA only:4 wire interface.HSIC ELS51-VA only:High Speed Interchip Communication interface. ADC Analog-to-Digital Converter with one unbalanced analog input.Digitial audio interface 4 GPIO lines can be configured as PCM/I2S lines for VoLTE communica-tion.Antenna interface pads 50Ω LTE main antenna, 50LTE diversity antennaFeature Implementation
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description1.1 Key Features at a Glance13ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 11 of 106Power on/off, ResetPower on/off Switch-on by hardware signal ON Switch-off by AT command Switch off by hardware signal GPIO4/FST_SHDN instead of AT commandAutomatic switch-off in case of critical temperature and voltage conditions Reset Orderly shutdown and reset by AT commandEmergency reset by hardware signal EMERG_RSTEvaluation kitEvaluation module ELS31-VA/ELS51-VA module soldered onto a dedicated PCB that can be connected to an adapter in order to be mounted onto the DSB75.DSB75 DSB75 Development Support Board designed to test and type approve Gemalto M2M modules and provide a sample configuration for application engineering. A special adapter is required to connect the ELS31-VA/ELS51-VA evaluation module to the DSB75.Feature Implementation
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description1.2 ELS31-VA/ELS51-VA System Overview13ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 12 of 1061.2 ELS31-VA/ELS51-VA System OverviewFigure 1:  ELS31-VA/ELS51-VA system overviewGPIO interfaceI2CUSBASC0ASC0CONTROLPOWERANTENNA (LTE dual band)ModuleSIM interface(with SIM detection)SIM cardApplicationPower supplyEmergency resetONSerial modem interfaceSerial modem interfaceI2CUSBAntenna /div. AntennaGPIOsStatus LEDFST_SHDN Fast shutdownADC ADCCOUNTER Pulse counterGP(I)OsHSICSDIOHSICSDIOSPI SPISPI SPIASC1 Serial interfacePCM/DAI PCM/DAI
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description1.3 Circuit Concept13ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 13 of 1061.3 Circuit ConceptThe following figure shows block diagram of the ELS31-VA/ELS51-VA module and illustrate the major functional components (see Figure 2): Baseband block:• baseband processor and power management• serial NOR flash and LPDDR RAM memory• Application interface (SMT with connecting pads)LTE RF section:• RF transceiver • RF power amplifier/front-end module and duplexers• Receive SAW filtersFigure 2:  ELS31-VA/ELS51-VA baseband block diagramSPDTRF SwitchB13 DuplexerB4 DuplexerSPDTRF SwitchPA DC/DC PMICB13 SAWB4 SAWSQN3241B13 PAB4 PAPrimaryAntennaDiversityAntennaTCXOControlRXIF1RXIF2TXIFCLKREF512Mbit LPDDRSPI FlashELS31-V 256MbitELS51-V 512MbitSIMLevel Shifter32.768kHz XtalSQN3223GPIOSPIUARTSUSBHSICSDIOSIM
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2 Interface Characteristics56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 14 of 1062 Interface CharacteristicsELS31-VA/ELS51-VA is equipped with an SMT application interface that connects to the exter-nal application. The SMT application interface incorporates the various application interfaces as well as the RF antenna interfaces. 2.1 Application Interface2.1.1 Pad AssignmentThe SMT application interface on the ELS31-VA/ELS51-VA provides connecting pads to inte-grate the module into external applications. Figure 3 shows the connecting pads’ numberingplan, the following Table 1 lists the pads’ assignments.Figure 3:  Numbering plan for connecting pads (bottom view) 5365646362616059585756555466332122232425262728293031322010692919897969594908985 8693749987 88848379787776758281807271706968671051041031021011007344191817161514131211109876543213435363839404142434546474849505152Supply pads : BATT+Control padsGND padsASC0 padsSPI padsSIM pads RF antenna padI2C padsADC padSupply pads : OtherCombined GPIO /DAI padsCombined GPIO /Control pads(LED, COUNTER, FST_SHDN)Do not useNot connectedReservedUSB padsCombined GPIO/ASC1/HSIC padsCombined GPIO / ASC0 pads250251252245249248247246Test points , do not use HSIC pads37SDIO pads35GPIO pads
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 15 of 106Signal pads that are not used should not be connected to an external application.Please note that the reference voltages listed in Table 2 are the values measured directly onthe ELS31-VA/ELS51-VA module. They do not apply to the accessories connected. Table 1:  Pad assignments Pad no. Signal name Pad no. Signal name Pad no. Signal name1 GND 23 GPIO20/PCM_I2S_OUT 45 USB_DP2 GND 24 GPIO22/PCM_I2S_FSC 46 USB_DN3 GND 25 GPIO21/PCM_I2S_IN 47 GND4 GND 26 GPO23/PCM_I2S_CLK 48 GND5 BATT_RF 27 I2CDAT 49 GND6 GND 28 I2CCLK 50 GND7 ADC1 29 GPIO17/TXD1/HOST_ACTIVE 51 GND8 ON 30 GPIO16/RXD1/AP_WAKEUP 52 GND9 GND 31 GPIO18/RTS1/CP_WAKEUP 53 BATT_BB10 V180 32 GPIO19/CTS1/SUSPEND 54 GND11 RXD0 33 EMERG_RST 55 GND12 CTS0 34 GND 56 DIV_ANT13 TXD0 35 GPIO25 57 GND14 RING0/GPIO24 36 GPIO8/COUNTER 58 GND15 RTS0 37 GPIO7 59 RF_OUT16 Not connected 38 GPIO6 60 GND17 CCRST 39 LED/GPO5 61 GND18 CCIN 40 GPIO4/FST_SHDN 62 GND19 CCIO 41 DSR0/GPIO3 63 GND20 CCVCC 42 DCD0/GPIO2 64 GND21 CCCLK 43 DTR0/GPIO1 65 GPIO27/SPI_CS222 VCORE 44 VUSB 66 GPO26/SPI_CS1Centrally located pads67 GND 83 Do not use (test) 99 GND68 GND 84 GND 100 GND69 GND 85 GND 101 GND70 GND 86 GND 102 GND71 GND 87 Do not use (test) 103 GND72 Not connected 88 GND 104 Not connected73 GND 89 GND 105 Not connected74 Do not use (test) 90 GND 106 SPI_MOSI75 Do not use (test) 91 Do not use (test) 245 GND76 Do not use (test) 92 GND 246 HSIC_DATA77 Do not use (test) 93 SDIO0 247 HSIC_STRB78 Do not use (test) 94 SDIOCLK 248 SPI_CLK79 Not connected 95 SDIO1 249 SPI_MISO80 Do not use 96 SDIO2 250 GND81 GND 97 SDIO3 251 SDIOCMD82 GND 98 GND 252 GND
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 16 of 1062.1.2 Signal PropertiesTable 2:  Signal propertiesFunction Signal name IO Signal form and level CommentPower supplyBATT_BBBATT_RFIVImax = 4.5VVInorm = 3.8VVImin = 3.3V Imax=720mA nominal voltage 3.8V- 300 mA for BATT_RF- 420 mA for BATT_BB Lines of BATT+ and GND must be connected in parallel for supply pur-poses because higher peak currents may occur.Minimum voltage must not fall below 3.3V includ-ing drop, ripple, spikes and not rise above 4.5V.Power supplyGND Ground Application GroundExternal supply voltage V180 O VOnorm = 1.80VVOmin = 1.71 VVOmax = 1.89VIOmax = 50mACLmax = 2µFV180 may be used to supply level shifters at the interfaces or to supply external application cir-cuits.If unused keep line open.VCORE O VOnorm = 1.1VVOmin= 1.09VOmax= 1.12IOmax = 50mACLmax = 100nFIgnition ON I BATT_BB= 4.5VVIHmax =  5.5VVIHmin = 2.16VVILmax = 1.79VVILmin=0VBATT_BB= 3.3VVIHmax = 5.5VVIHmin = 1.7VVILmax = 1.3VVILmin = 0VMin low time before rising edge<=100µsRin = 380kON  ___|--|____ high level min. 100µsEdge triggered signal to switch the module on. Set this signal low before and after the startup impulse. Input is Schmitt Trigger. The ON signal can be connected to BATT_BB. In this case, the module cannot be switched off by a fast shutdown, but can only be switched off by disconnecting BATT_BB.Emergency restartEMERG_RST I VIHmax = 5.5VVIHmin = 0.85VVILmax =0.65V VILmin= 0VInternal pull-up resistorLow impulse width > 10msPulse triggered signal to reset the module. This line must be driven low by an open drain or open collector driver con-nected to GND. See also Section 3.2.2.2.If unused keep line open.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 17 of 106Fast shutdownFST_SHDN I VILmax = 0.63V VIHmin = 1.17V VIHmax = 1.85V~~|___|~~ low impulse width > 10msThis line must be driven low.If unused keep line open.Note that the fast shut-down line is originally available as GPIO line. If configured as fast shut-down, the GPIO line is assigned as follows:GPIO4 --> FST_SHDNUSB VUSB_IN I VImin = 3V VImax = 5.25VActive and suspend current: Imax < 100µAAll electrical characteris-tics according to USB Implementers' Forum, USB 2.0 Specification.If unused keep lines open.USB_DN I/O Full and high speed signal characteris-tics according USB 2.0 Specification.USB_DPSerial Interface ASC0RXD0 O VOLmax = 0.45VVOHmin = 1.35VVOHmax = 1.85VVILmax = 0.63V VILmin = -0.3VVIHmin = 1.17V VIHmax = 1.85VIf unused keep lines open.By delivery default, lines are available as ASC0 interface lines. If configured for use as GPIOs the assignment is as follows:DTR0 --> GPIO1DCD0 --> GPIO2DSR0 --> GPIO3RING0 --> GPIO24CTS0 ORING0 OTXD0 IRTS0 IDTR0 IDCD0 ODSR0 OSerial Interface ASC1RXD1 O VOLmax = 0.45VVOHmin = 1.35VVOHmax = 1.85VVILmax = 0.63V VILmin = -0.3VVIHmin = 1.17V VIHmax = 1.85VIf unused keep lines open.By delivery default, ASC1 interface lines are avail-able as GPIO lines. If configured as ASC1 lines, the GPIO lines are assigned as follows:GPIO16 --> RXD1GPIO17 --> TXD1GPIO18 --> RTS1GPIO19 --> CTS1ASC1 is available as data interface.CTS1 OTXD1 IRTS1 ITable 2:  Signal properties (Continued)Function Signal name IO Signal form and level Comment
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 18 of 106I2C I2CCLK IO VOLmax = 0.45VVOHmin = 1.35VVOHmax = 1.85VVILmax = 0.63V VILmin = -0.3VVIHmin = 1.17V VIHmax = 1.85VAccording to the I2C Bus Specification Version 2.1 for the fast mode a rise time of max. 300ns is per-mitted. There is also a maximum VOL=0.4V at 3mA specified.Minimum R external pull-up (connected to V180 power supply) is 391 Ohms. The value of the pull-up depends on the capacitive load of the whole system (I2C Slave + lines).The maximum sink cur-rent of I2CDAT and I2CCLK is 4.6mA.If lines are unused keep lines open.I2CDAT IOSPI SPI_CLK O VOLmax = 0.45VVOHmin = 1.35VVOHmax = 1.85VVILmax = 0.63V VILmin = -0.3VVIHmin = 1.17V VIHmax = 1.85VIf lines are unused keep lines open.By delivery default, the SPI CS interface lines are available as GPIO lines.If configured as SPI lines, the GPIO lines are assigned as follows:GPO26 --> SPI_CS1GPIO27 --> SPI_CS2SPI_MOSI OSPI_MISO ISPI_CS1SPI_CS2OGPIO inter-faceGPIO1-4GPIO6-22GPIO24,25, 27IO VOLmax = 0.45VVOHmin = 1.35VVOHmax = 1.85VVILmax = 0.63V VILmin = -0.3VVIHmin = 1.17V VIHmax = 1.85VIf unused keep line open.Please note that some GPIO lines are or can be can be configured by AT command for alternative functions: GPIO1-GPIO3: ASC0 control lines DTR0, DCD0, and DSR0GPIO4: FST_SHDNGPO5: LEDGPIO8: Pulse CounterGPIO16-GPIO19: ASC1, HSIC control linesGPIO20-GPO23: PCM/I2S linesGPIO24: ASC0 control line RING0GPO26-GPIO27: SPI CS signalsGPO5,23,26 OTable 2:  Signal properties (Continued)Function Signal name IO Signal form and level Comment
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 19 of 106Status LED LED  O VOLmax = 0.45VVOHmin = 1.35VVOHmax = 1.85VIf unused keep line open.By delivery default, the line is available as LED line. If configured for use as GPIO line, the LED line is assigned as follows: LED --> GPO5Pulse counterCOUNTER I VOLmax = 0.45VVOHmin = 1.35VVOHmax = 1.85VVILmax = 0.63V VILmin = -0.3VVIHmin = 1.17V VIHmax = 1.85VIf unused keep line open.By delivery default, the COUNTER line is origi-nally available as GPIO line. If configured for use as COUNTER line, the GPIO line is assigned as follows: GPIO8 --> COUNTERADC (Analog-to-Digital con-verter)ADC1 I RI = 10kOhmVI = 0V ... 2.0V Resolution 1024 stepsTolerance +/-2%ADC1 can be used as input for external mea-surements.If unused keep line open.SIM card detectionCCIN I RI  90kOhmVILmax = 0.63V VIHmin = 1.17V VIHmax = 1.85VCCIN = High, SIM card inserted. For details please refer to Section 2.1.6.If unused keep line open.3V SIM Card Inter-faceCCRST O VOHtypical = 2.065VVOHmax = 2.95VVOLtypical = 0.1V @1mAVOLmax = 0.3VMaximum cable length or copper track to SIM card holder should not exceed 100mm.CCIO I/O VILmax = 0.44V VILmin = -0.15VVIHmin = 2.065V VIHmax = 3.15VVOLtypical = 0.1V @1mAVOLmax = 0.3V VOHmin = 2.065V at I = -10µA VOHmax = 2.95VCCCLK O VOHtypical = 2.065VVOHmax = 2.95VVOLtypical = 0.1V @1mAVOLmax = 0.3VCCVCC O VOmin = 2.85V VOtyp = 2.95V VOmax = 3.10VIOmax = -50mATable 2:  Signal properties (Continued)Function Signal name IO Signal form and level Comment
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 20 of 1061.8V SIM Card  Inter-faceCCRST O VOHtypical = 1.26VVOHmax = 1.8VVOLtypical = 0.1V @1mAVOLmax = 0.3VCCIO I/O VILmax = 0.27V VILmin=-0.15VVIHmin = 1.26V VIHmax = 2VVOLtypical = 0.1V @1mAVOLmax = 0.3V VOHmin = 1.26V at I = -10µA VOHmax = 1.85VCCCLK O VOHtypical = 1.26VVOHmax = 1.8VVOLtypical = 0.1V @1mAVOLmax = 0.3VCCVCC O VOmin = 1.7V VOtyp = 1.80V VOmax = 1.9VIOmax = -50mAHSIC HSIC_DATAHSIC_STRBIO Signal characteristics according to “High-Speed Inter-Chip USB Electrical Specification”, Version 1, September 23, 2007HSIC available with ELS51-VA only.See also Section 2.1.14.SDIO SDIOCMDSDIOCLKSDIO0SDIO1SDIO2SDIO3IO VOLmax = 0.45VVOHmin = 1.35VVOHmax = 1.85VVILmax = 0.63V VIHmin = 1.17V VIHmax = 1.85VSDIO available with ELS51-VA only.See also Section 2.1.15.Digital audio interface(PCM/I2S)PCM_I2S_-CLKIVILmax = 0.63V VIHmin = 1.17V VIHmax = 1.85VIf unused keep line open.Note that the PCM inter-face lines are originally available as GPIO lines. If configured as PCM lines, the GPIO lines are assigned as follows: GPIO23 --> PCM_I2S_-CLKGPIO22 --> PCM_I2S_FSCGPIO20 --> PCM_I2S_OUTGPIO21 --> PCM_I2S_INPCM_I2S_FSCIPCM_I2S_INIPCM_I2S_OUTOVOLmax = 0.45VVOHmin = 1.35VVOHmax = 1.85VTable 2:  Signal properties (Continued)Function Signal name IO Signal form and level Comment
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 21 of 1062.1.2.1 Absolute Maximum RatingsThe absolute maximum ratings stated in Table 3 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to ELS31-VA/ELS51-VA. Table 3:  Absolute maximum ratingsParameter Min Max UnitSupply voltage BATT+BB, BATT+RF -0.3 +4.5 VVoltage at all digital lines in Power Down mode -0.3 +0.3 VVoltage at digital lines in normal operation  -0.2 2.0 VVoltage at SIM/USIM interface, CCVCC in normal operation -0.5 +3.6 VVoltage at ADC line in normal operation 0 2 VVoltage at analog lines in Power Down mode -0.3 +0.3 VV180 in normal operation +1.7 +1.9 VCurrent at V180 in normal operation 50 mACurrent at VCORE in normal operation 50 mA
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 22 of 1062.1.3 USB InterfaceELS31-VA/ELS51-VA supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/s) compliant. The USB interface is primarily intended for use as command and data interface and for downloading firmware. The VUSB line is used for cable detection only, this is to be supplied by the external device.  The USB circuitry in the ELS31-VA/ELS51-VA is designed to meet the USB 2.0 specification for self-power.2.0”1.Figure 4:  USB circuitTo properly connect the module's USB interface to the external application, a USB 2.0 compat-ible connector and cable or hardware design is required. For more information on the USB re-lated signals see Table 2. Furthermore, the USB modem driver distributed with ELS31-VA/ELS51-VA needs to be installed.1.  The specification is ready for download on http://www.usb.org/developers/docs/VBUSDPDNVREG (3V075)BATT+USB_DP2)lin. reg.GNDModuleDetection only VUSB_INUSB part1)RING0Host wakeup1) It is recommended to add EMI suppression filter (see section 2.1.3.1)USB_DN2)2) If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case implement a differential impedance of 90Ohm for proper signal integrity.SMT
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 23 of 1062.1.3.1 Interface implementationFigure 5 shows a standard USB interfacing circuit for "off board" interfacing (connection directly to a USB connector).If the USB interface is directly wired to a Host interface, the additional ESD protection (U1 on Figure 5) is not necessary, as the final product will not be a "hot swappable" item. The filter is used to offer high impedance to higher frequency components of the USB signals. This helps reduce any potential RF noise coming from these USB wires.Figure 5:  USB Additional ESD Protection ImplementationThe digital signals USB_DP and USB_DN are sensitive to track design. Make sure these sig-nals are routed with 90 Ohms differential resistance. If the host product is containing other USB interfaces, then ensure that the rules used to design those are replicated here too. An overvolt-age protection device U1 is recommended, such as ESD5V3U2U-03F.USB_DPUSB_DNGNDVUSBGND11231234234654546ELS31ELS51J1USB-Type BF1U1
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 24 of 1062.1.3.2 Reducing Power ConsumptionWhile a USB connection is active, the module will never switch into SLEEP mode. Only if the USB interface is in Suspended state or Detached (i.e., VUSB_IN = 0) is the module able to switch into SLEEP mode thereby saving power. There are two possibilities to enable power re-duction mechanisms:• Recommended implementation of USB Suspend/Resume/Remote Wakeup:The USB host should be able to bring its USB interface into the Suspended state asdescribed in the “Universal Serial Bus Specification Revision 2.0“1. For this functionality towork, the VUSB_IN line should always be kept enabled. On incoming calls and other eventsELS31-VA/ELS51-VA will then generate a Remote Wakeup request to resume the USBhost controller.See also [5] (USB Specification Revision 2.0, Section 10.2.7, p.282):"If USB System wishes to place the bus in the Suspended state, it commands the Host Con-troller to stop all bus traffic, including SOFs. This causes all USB devices to enter the Sus-pended state. In this state, the USB System may enable the Host Controller to respond tobus wakeup events. This allows the Host Controller to respond to bus wakeup signaling torestart the host system."• Implementation for legacy USB applications not supporting USB Suspend/Resume:As an alternative to the regular USB suspend and resume mechanism it is possible toemploy the RING0 line to wake up the host application in case of incoming calls or eventssignalized by URCs while the USB interface is in Detached state (i.e., VUSB_IN = 0). Everywakeup event will force a new USB enumeration. Therefore, the external application has tocarefully consider the enumeration timings to avoid loosing any signalled events. For detailson this host wakeup functionality see Section 2.1.16.3. Note: Existing data connections will not be disconnected even if the USB interface is in de-tached state. URCs will be queued during detached state, but may be signaled to the host via host wakeup line RING0.1.  The specification is ready for download on http://www.usb.org/developers/docs/
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 25 of 1062.1.4 Serial Interface ASC0ELS31-VA/ELS51-VA offers an 8-wire unbalanced, asynchronous modem interface ASC0 con-forming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 2. For an illustration of the interface line’s startup behavior see Figure 7.ELS31-VA/ELS51-VA is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:• Port TXD @ application sends data to the module’s TXD0 signal line• Port RXD @ application receives data from the module’s RXD0 signal lineFigure 6:  Serial interface ASC0Features:• Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition,the modem control lines DTR0, DSR0, DCD0 and RING0.• Configured for 8 data bits, no parity and 1 stop bit. • ASC0 can be operated at fixed bit rates from 4800bps up to 921600bps.• Supports RTS0/CTS0 hardware flow control. Communication is possible by using only RXDand TXD lines, if RTS0 is pulled low. • Wake up from SLEEP mode by RTS0 activation (high to low transition; see Section 3.3.2). The ASC0 interface is dedicated to signaling via AT commands (3GPP standard 27.007 + mod-ule specific AT commands).Note: The ASC0 modem control lines DTR0, DCD0, DSR0 and RING0 can also be configured as GPIO lines. If configured as GPIO lines, these GPIO lines are assigned as follows: DTR0 --> GPIO1, DCD0 --> GPIO2, DSR0 --> GPIO3 and RING0 --> GPIO24.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 26 of 1062.1.4.1 Serial Interface Start-up BehaviorThe following figure shows the startup behavior of the asynchronous serial interface ASC0.For pull-up and pull-down values see Table 15.Figure 7:  ASC0 startup behaviorNo data must be sent over the ASC0 interface before the interface is active and ready to re-ceive data (see Section 3.2.1). TXD0RXD0RTS0CTS0DTR0DSR0DCD0RING0ONEMERG_RSTPower supply activeStart upFirmware initializationCommand interface initializationInterface activeV180VCOREResetstate
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 27 of 1062.1.5 Serial Interface ASC1ELS31-VA/ELS51-VA provides a 4-wire unbalanced, asynchronous modem interface ASC1conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not complywith ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for highdata bit or inactive state). For electrical characteristics please refer to Table 2. For an illustra-tion of the interface line’s startup behavior see Figure 9. ASC1 can only be used as data inter-face.The ASC1 interface lines are originally available as GPIO lines. If configured as ASC1 lines, the GPIO lines are assigned as follows: GPIO16 --> RXD1, GPIO17 --> TXD1, GPIO18 --> RTS1 and GPIO19 --> CTS1. Configuration is done by AT command (see [1]: AT^SCFG). The configuration is non-volatile and becomes active after a module restart.ELS51-VA is designed for use as a DCE. Based on the conventions for DCE-DTE connectionsit communicates with the customer application (DTE) using the following signals:• Port TXD @ application sends data to module’s TXD1 signal line• Port RXD @ application receives data from the module’s RXD1 signal lineFigure 8:  Serial interface ASC1Features• Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware hand-shake. • On ASC1 no RING line is available.• Configured for 8 data bits, no parity and 1 or 2 stop bits.• ASC1 can be operated at fixed bit rates from 4800 bps to 921600 bps.• Supports RTS1/CTS1 hardware flow control. Communication is possible by using only RXDand TXD lines, if RTS1 is pulled low.• Wake up from SLEEP mode by RTS0 activation (high to low transition; see Section 3.3.2).AT commands for signaling are not supported on ASC1 interface. ASC1 is intended only fordata transfer in a Linux environment.The following figure shows the startup behavior of the asynchronous serial interface ASC1.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 28 of 106*) For pull-down values see Table 15.Figure 9:  ASC1 startup behaviorTXD1RXD1RTS1CTS1ONPower supply activeStart upFirmware initializationCommand interface initializationInterface activeV180VCOREEMERG_RSTResetstate ~ 15sec
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 29 of 1062.1.6 UICC/SIM/USIM InterfaceELS31-VA/ELS51-VA has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards. Please refer to Table 2 for electrical specifications of the UICC/SIM/USIM interface lines depending on whether a 3V or 1.8V SIM card is used.The CCIN signal serves to detect whether a tray (with SIM card) is present in the card holder. The CCIN signal must be connected to V180 for the detection to work on the module. Other-wise the SIM card can never be detected by the module.Using the CCIN signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during oper-ation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been test-ed to operate with ELS31-VA/ELS51-VA and is part of the Gemalto M2M reference equipment submitted for type approval. See Section 7.1 for Molex ordering numbers.Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ-ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart ELS31-VA/ELS51-VA.Table 4:  Signals of the SIM interface (SMT application interface)Signal DescriptionGND Separate ground connection for SIM card to improve EMC.CCCLK Chipcard clockCCVCC SIM supply voltage.CCIO Serial data line, input and output.CCRST Chipcard resetCCIN Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruc-tion of the SIM. The CCIN signal is by default low and will change to high level if a SIM card is inserted.The CCIN signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCIN signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of ELS31-VA/ELS51-VA.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 30 of 106The figure below shows a circuit to connect an external SIM card holder.Figure 10:  External UICC/SIM/USIM card holder circuitThe total cable length between the SMT application interface pads on ELS31-VA/ELS51-VA and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both lines are not placed closely next to each other. A useful approach is using a GND line to shield the CCIO line from the CCCLK line.The ELS31-VA/ELS51-VA includes embedded ESD protection for the SIM interface that com-plies to ETSI EN 301 489-1/7: Contact discharge: ± 4kV, air discharge: ± 8kV.SIMCCVCCCCRSTCCIOCCCLK220nF1nFCCINV180
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 31 of 1062.1.7 Digital Audio InterfaceELS31-VA/ELS51-VA supports a digital audio interface that can be employed either as pulse code modulation interface (see Section 2.1.8) or as inter IC sound interface (see Section 2.1.9). Operation of these interface variants is mutually exclusive, and can be configured by AT com-mand (see [1])). Default setting is pulse code modulation.2.1.8 Pulse Code Modulation Interface (PCM)Note: ELS31-VA/ELS51-VA's PCM interface is reserved for future use. Usage as digital audio interface is currently not supported.ELS31-VA/ELS51-VA's PCM interface can be used to connect audio devices capable of pulse code modulation. The PCM functionality is limited to the use of covers the use of narrowband codecs with 8kHz sample rate and wideband codecs with 16kHz sample rate onlyas well. Con-figured for wideband the The PCM interface runs at 16 kHz sample rate (62.5µs frame length), while the signal processing maintains this rate in a wideband AMR call or samples automati-cally down to 8kHz in a narrowband call. Therefore, the PCM sample rate is independent of the audio bandwidth of the call.The PCM interface has the following implementation:•Slave mode• Short frame synchronization, long frame synchronization• 8kHz and 16kHz sample rate• 256kHz, 512kHz, 2048kHz bit clock at 8kHz sample rate• 256kHz, 512kHz, 1024kHz, 4096kHz bit clock at 16kHz sample rateFor the PCM configuration the AT^SAIC command parameters <clock>, <mode>, <frame_-mode>, <ext_clk_mode> and <sample_rate> (see [1]) cannot be configured in any combina-tion. The following notes, must be considered while configuring the PCM interface:ELS31-VA/ELS51-VA’s digital audio interface can only be operated in slave mode. Therefore, the <mode> parameter must be set to <1>, and the <ext_clk_mode> be set to not permanent resp. off. Further, while in slave mode the <clock>, <frame_mode> and <sample_rate> must be set according to the characteristics of the external master. There is no automatic detection of the received clock frequency, frame length and sample rate.Four GPIOs can be configured by AT command as PCM signals: GPIO20 --> PCM_I2S_OUT, GPIO21--> PCM_I2S_IN, GPIO22 --> PCM_I2S_FSC and GPIO23 --> PCM_I2S_CLK. The setting is non-volatile and becomes active after a module restart (see also [1]).Table 5 describes the available DAI/PCM lines at the digital audio interface. For electrical de-tails see Section 2.1.2.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 32 of 106Note: PCM data is always formatted as 16-bit uncompressed two’s complement. Also, all PCM data and frame synchronization signals are written to the PCM bus on the rising clock edge and read on the falling edge.The timing of a PCM short frame is shown in Figure 11.Figure 11:  PCM timing short frame (4096KHz, 16kHz sample rate)Configured to short frame synchronization, the pulse on PCM_I2S_FSC should be one clock period wide and occur one clock before the data, using long frame the pulse should have a duty cycle of 50% starting with the first data bit. Characteristics of Audio ModesELS31-VA/ELS51-VA has various audio modes selectable with AT^SNFS (for details on AT^SNFS see [1]).Audio mode 1 with its default settings is used for type approval with the Votronic handset via the DSB75 codec adapter. The handset is adjusted for the type 3.2 low-leakage ear simulator for narrowband and wideband calls. The other modes are customer specific modes, and can as such be prepared for specific re-quirements. Table 5:  Overview of PCM pin functionsSignal name on B2B connectorSMT application interfaceSignal configuration inactiveSignal direction: SlaveDescriptionPCM_I2S_OUT PD O PCM data from ELS31-VA/ELS51-VA to external codecPCM_I2S_IN  PD I PCM data from external codec to ELS31-VA/ELS51-VA PCM_I2S_FSC  PD I Frame synchronization signal from external codecPCM_I2S_CLK  PD I Bit clock from external codecMSBMSBLSBLSB14 1314 1311121222MSBMSB62.5 µsPCM_I2S_CLKPCM_I2S_FSCPCM_I2S_OUTPCM_I2S_IN
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 33 of 1062.1.9 Inter IC Sound Interface (I2S)The I2S Interface is a standardized bidirectional I2S ("Inter-IC Sound Interface") based digital audio interface for transmission of mono voice signals for telephony services.The I2S interface can be enabled and configured using the AT command AT^SAIC (see [1]). An activation is possible only out of call and out of tone presentation. The I2S properties and capabilities comply with the requirements laid out in the Phillips I2S Bus Specifications, revised June 5, 1996.The I2S interface has the following characteristics:• Bit clock mode: Slave, requires external master clock input • Sampling rate: 8KHz (narrowband), 16KHz (wideband)• 256kHz bit clock at 8kHz sample rate• 512kHz bit clock at 16kHz sample rate• Frame length: 32 bit stereo voice signal (16 bit word length)The digital audio interface lines available for the PCM interface are also available for the I2S interface. In I2S mode they have the same electrical characteristics. Table 6 lists the available I2S interface signals, Figure 12 shows the I2S timing. Figure 12:  I2S timing (slave mode)Table 6:  Overview of I2S pin functionsSignal name on SMT application interfaceSignal configuration inactiveSignal direction: SlaveDescriptionPCM_I2S_OUT PD O I2S data from ELS31-VA/ELS51-VA to external codecPCM_I2S_IN PD I I2S data from external codec to ELS31-VA/ELS51-VA PCM_I2S_FSC  PD I Frame synchronization signal from external codec Word alignment (WS)PCM_I2S_CLK  PD I Bit clock from external codecPCM_I2S_CLKPCM_I2S_OUTPCM_I2S_INPCM_I2S_FSCMSBMSBLSBLSB14 1314 1311121222MSBMSB125 µs
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 34 of 1062.1.10 GPIO InterfaceELS31-VA/ELS51-VA offers a GPIO interface with 17 GPIO and 3 GPO lines. The lines areshared with other interfaces or functions: Fast shutdown (see Section 2.1.16.4), status LED(see Section 2.1.16.1), a pulse counter (see Section 2.1.13), ASC0 (see Section 2.1.4), ASC1(see Section 2.1.5), SPI (see Section 2.1.12), HSIC (see Section 2.1.14), and digital audio in-terface (DAI; see Section 2.1.7).The following table shows the configuration variants for the GPIO pads. All variants are mutu-ally exclusive, i.e. a pad configured for instance as Status LED is locked for alternative usage.After startup, the above mentioned alternative GPIO line assignments can be configured usingAT commands (see [1]). The configuration is non-volatile and available after module restart.Notes:• GPO5, GPO23 and GPO26 are GPOs only.Table 7:  GPIO lines and possible alternative assignmentGPIO Fast Shutdown Status LED Pulse Counter ASC0 ASC1 SPI HSIC PCMGPIO1 DTR0GPIO2 DCD0GPIO3 DSR0GPIO4 FST_SHDNGPO5 LEDGPIO6GPIO7GPIO8 COUNTERGPIO16 RXD1 AP_WAKEUPGPIO17 TXD1 HOST_ACTIVEGPIO18 RTS1 CP_WAKEUPGPIO19 CTS1 SUSPENDGPIO20 PCM_I2S_OUTGPIO21 PCM_I2S_INGPIO22 PCM_I2S_FSCGPO23 PCM_I2S_CLKGPIO24 RING0GPIO25GPO26 SPI_CS1GPIO27 SPI_CS2
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 35 of 106The following figure shows the startup behavior of the GPIO interface. With an active state ofthe ASC0 interface line CTS0, the initialization of the GPIO interface lines is also finished.*) For pull down values see Table 15.Figure 13:  GPIO startup behaviorGPIO1 - 8 Hi-ZCTS0ONEMERG_RSTPower supply activeStart upFirmware initializationCommand interface initializationInterface activeV180VCOREGPIO16 - 27 Hi-ZResetstate
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 36 of 1062.1.11 I2C InterfaceI2C is a serial, 8-bit oriented data transfer bus for bit rates up to 100kbps. It consists of two lines,the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single mas-ter device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-directional line. Eachdevice connected to the bus is software addressable by a unique 7-bit address, and simplemaster/slave relationships exist at all times. The module operates as master-transmitter or asmaster-receiver. The customer application transmits or receives data only on request of themodule.To configure and activate the I2C bus use the AT^SSPI command. Detailed information on theAT^SSPI command as well explanations on the protocol and syntax required for data transmis-sion can be found in [1].The I2C interface can be powered via the V180 line of ELS31-VA/ELS51-VA. If connected tothe V180 line, the I2C interface will properly shut down when the module enters the PowerDown mode.In the application I2CDAT and I2CCLK lines need to be connected to a positive supply voltagevia a pull-up resistor. For electrical characteristics please refer to Table 2.Figure 14:  I2C interface connected to V180Note: Good care should be taken when creating the PCB layout of the host application: Thetraces of I2CCLK and I2CDAT should be equal in length and as short as possible.I2CCLKI2CDATGNDI2CCLKI2CDATGNDModule ApplicationV180R pull upR pull upR pull upR pull up
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 37 of 106The following figure shows the startup behavior of the I2C interface. With an active state of theASC0 interface (i.e. CTS0 is at low level) the initialization of the I2C interface is also finished.Figure 15:  I2C startup behaviorI2CCLKI2CDATOpen drainOpen drain(external pull up)(external pull up)CTS0ONEMERG_RSTPower supply activeStart upFirmware initializationCommand interface initializationInterface activeV180VCOREResetstate
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 38 of 1062.1.12 SPI InterfaceThe ELS31-VA/ELS51-VA GPIO interface lines can be configured as Serial Peripheral Inter-face (SPI). The SPI is a synchronous serial interface for control and data transfer betweenELS31-VA/ELS51-VA and the external application. Only one application can be connected tothe SPI and the interface supports only master mode. The transmission rates are up to 6.5Mbit/s. The SPI interface comprises the two data lines SPI_MOSI and SPI_MISO, the clock lineSPI_CLK a well as the chip select lines SPI_CS1 and SPI_CS2.These two GPIO lines can be configured as SPI interface signals as follows: GPO26 --> SPI_CS1 and GPIO27 --> SPI_CS2. The configuration is done by AT command (see [1]). It is non-volatile and becomes active after a module restart.To configure and activate the SPI interface use the AT^SSPI command. Detailed informationon the AT^SSPI command as well explanations on the SPI modes required for data transmis-sion can be found in [1].In general, SPI supports four operation modes. The modes are different in clock phase andclock polarity. The module’s SPI mode can be configured by using the AT command AT^SSPI.Make sure the module and the connected slave device works with the same SPI mode.Figure 16 shows the characteristics of the four SPI modes. The SPI modes 0 and 3 are the mostcommon used modes. For electrical characteristics please refer to Table 2.Figure 16:  Characteristics of SPI modesSPI MODE 0 SPI MODE 1SPI MODE 2 SPI MODE 3Clock phaseClock polaritySPI_CSSPI_MOSISPI_CLKSPI_MISOSPI_CSSPI_MOSISPI_CLKSPI_MISOSPI_CSSPI_MOSISPI_CLKSPI_MISOSPI_CSSPI_MOSISPI_CLKSPI_MISOSample SampleSample Sample
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 39 of 1062.1.13 Pulse CounterThe GPIO8 line can be configured as pulse counter line COUNTER (for GPIOs see Section2.1.10). The pulse counter interface can be used, for example, as a clock - it is designed tomeasure signals from 0 to 1000 pulses per second. Note that the pulse counter works in batch-es of 8 pulses, i.e., the URC indicates the number of pulses counted in batches of 8 pulses. Formore information on how to use this feature see [1].2.1.14 HSIC Interface (ELS51-VA Only)The (USB) High Speed Inter Chip (HSIC) interface can be used between the module and an external application processor, and is compliant to the High Speed USB 2.0 interface with 480Mbit/s. The maximum distance between module processor and external application proces-sor should not exceed 100mm.The HSIC interface comprises two signal lines (strobe - HSIC_STRB - and data - HSIC_DATA) used in a source synchronous serial interface with a 240MHz clock to provide a 480Mbps USB interface. The HSIC_STRB and HSIC_DATA lines are high-speed signals and should be rout-ed as 50Ohm impedance traces. The trace length of these signals should be balanced to min-imize timing skew and be no longer than 100mm.The HSIC interface implementation complies with the USB HSIC standard “High-Speed Inter-Chip USB Electrical Specification”, Version 1, September 23, 20071.2.1.15 SDIO Interface (ELS51-VA Only)The Secure Digital Input Output (SDIO) interface can be used to for instance connect an SD card. The SDIO interface has the following features:1.  The USB specifications are ready for download on http://www.usb.org/developers/docs/usb20_docs/Table 8:  SDIO interface featuresFeature Description/ValueInterface Type SDIO/SD1 (1 data line), SDIO/SD4 (4 data lines), MMC4 (4 data lines)Voltage 1.8 VDMA Mode SDMA / ADMA1 / ADMA2Number of SLOTs 1Implement DDR mode YesCard inserted status YesSDIOCLK frequency Default Mode: 23 MHz maximumHigh Speed Mode: 46 MHz maximumUHS-I Mode: 92 MHzMax block length 2048 bytesSDIO interrupt support Yes, support SDIO/SD1, SDIO/SD4 mode interrupts
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 40 of 106Table 9 lists the six SDIO interface lines:Figure 17 illustrates the SDIO timings for data input and output, whereas the below Table 10 gives the actual timing values for the various speed modes.Figure 17:  SDIO interface timing diagrams (Input/Output)Table 9:  SDIO interface linesSignal Direction DescriptionSDIOCLK Out SD master clock output to SD/MMC/SDIO device.SDIOCMD I/O Command line.SDIO0 I/O Data lines. Only SDIO0 carries data in 1-bit SD mode, SDIO0..3 carry data in 4-bits mode.SDIO interrupt is multiplexed with SDIO1.SDIO1 I/OSDIO2 I/OSDIO3 I/OTable 10:  SDIO timingsMode Parameter Minimum MaximumNormal speedTISUInput set-up time5nsTIHInput hold time5nsTODLOutput delay time during Date Transfer Mode0ns 14nsTODLOutput delay time during Identification Mode0ns 50ns
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 41 of 106High speed TISUInput set-up time6nsTIHInput hold time2nsTODLYOutput delay time during Date Transfer Mode0ns 14nsTOHOutput hold time2.5nsUSH-1 TISUInput set-up time3nsTIHInput hold time0.8nsTODLYOutput delay time during Date Transfer Mode (SDR12, SDR25)0ns 14nsTODLYOutput delay time during Date Transfer Mode (SDR50)0ns 7.5nsTOHOutput hold time1.5nsTable 10:  SDIO timingsMode Parameter Minimum Maximum
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 42 of 1062.1.16 Control Signals2.1.16.1 Status LEDThe LED line can also be configured as GPO5 line, and can be used to drive a status LED thatindicates different operating modes of the module (for GPOs see Section 2.1.10). LED andGPO functionality are mutually exclusive.To take advantage of this function connect an LED to the LED/GPO5 line as shown in Figure18.Figure 18:  Status signaling with LED driverVCCGPO5/LEDLEDGNDGNDR1R2R3
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 43 of 1062.1.16.2 Power Indication CircuitIn Power Down mode the maximum voltage at any digital or analog interface line must not ex-ceed +0.3V (see also Section 2.1.2.1). Exceeding this limit for any length of time might causepermanent damage to the module. It is therefore recommended to implement a power indication signal that reports the module’spower state and shows whether it is active or in Power Down mode. While the module is inPower Down mode all signals with a high level from an external application need to be set tolow state or high impedance state. The sample power indication circuit illustrated in Figure 19denotes the module’s active state with a low signal and the module’s Power Down mode witha high signal or high impedance state.Figure 19:  Power indication circuit2.1.16.3 Host WakeupIf no call, data or message transfer is in progress, the host may shut down its own USB inter-face to save power. If a call or other request (URC’s, messages) arrives, the host can be noti-fied of these events and be woken up again by a state transition of the ASC0 interface‘s RING0line. This functionality should only be used with legacy USB applications not supporting the rec-ommended USB suspend and resume mechanism as described in [5] (see also Section 2.1.3.2).For more information on how to configure the RING0 line by AT^SCFG command see [1].Possible RING0 line states are listed in Table 11.Table 11:  Host wakeup lineSignal I/O DescriptionRING0 O Inactive to active low transition:0 = The host shall wake up1 = No wake up request 22k10k100k100k4.7kV180VCOREPower indicationExternal power supply
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 44 of 106Figure 20 shows the described RING0 wake up mechanism:• RING0 shall be high• After a given programmable timeout with no activity on ASC0, RTS0 will be driven high andthe host will fall asleep if RING0 remains high (note: Host shall wait at least for one UARTcharacter after RTS0 is driven high before entering sleep mode, to catch the last potentialcharacter transmission over UART)• The module will wake-up the host driving RING0 from high to low• The Host will inform the module it is ready to receive over UART by driving RTS0 to lowFigure 20:  Wake-up via RING0RING0Host wake-up event by moduleHost is ready to receive over UARTRTS0Host enters sleep mode
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.1 Application Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 45 of 1062.1.16.4 Fast ShutdownThe GPIO4 interface line can be configured as fast shutdown signal line FST_SHDN. The con-figured FST_SHDN line is an active low control signal. Before setting the FST_SHDN line to low, the ON signal should be set to low (see Figure 21). By default, the fast shutdown feature is disabled. It has to be enabled using the AT command AT^SCFG "MEShutdown/Fso". For details see [1].If enabled, a low impulse of 10 milliseconds on the FST_SHDN line starts the fast shutdown procedure.The fast shutdown procedure still finishes any data activities on the module‘s flash file system, thus ensuring data integrity, but the module will no longer deregister gracefully from the network. On-going flash access cycles (writing/deleting) will be finalized within less than 200 milliseconds. If the module is in power sleep mode, the 200 milliseconds maximum shut-down time will start after the module wakes up from sleep mode.Figure 21:  Fast shutdown timingPlease note that if enabled, the normal software controlled shutdown using AT^SMSO will alsobe a fast shutdown, i.e., without network deregistration. However, in this case no URCs includ-ing shutdown URCs will be provided by the AT^SMSO command.BATT+ONVCOREV180Fast shut down procedure Power downEMERG_RSTFST_SHDNmax. 200ms  min. 10ms
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.2 RF Antenna Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 46 of 1062.2 RF Antenna InterfaceThe RF interface has an impedance of 50Ω. ELS31-VA/ELS51-VA is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power.The external antenna must be matched properly to achieve best performance regarding radi-ated power, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the ELS31-VA/ELS51-VA module and should be placed in the host application if the antenna does not have an impedance of 50Ω.Regarding the return loss ELS31-VA/ELS51-VA provides the following values in the active band:2.2.1 Antenna Interface SpecificationsELS31-VA/ELS51-VA is equipped with two receiver ports. The sensitivity results according to Table 13 are verified by using both antenna ports according to the recommendation given in 3GPP TS 36.521-1, Chapter 7.2. The sensitivity results also depend on the selected band-width.Table 12:  Return loss in the active bandState of module Return loss of module Recommended return loss of applicationReceive > 8dB > 12dBTransmit not applicable  > 12dBTable 13:  RF Antenna interface LTEParameter Conditions Min. Typical Max. UnitLTE connectivity Band 4 and 13Static Receiver input Sensi-tivity @ ARP (ch. bandwidth 5MHz)LTE Band 4 -99.3 -103 -- dBmLTE Band 13 -99.3 -101 -- dBmRF Power @ ARP with 50 Load LTE Band 4 21 23 25 dBmLTE Band 13 21 23 25 dBm
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.2 RF Antenna Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 47 of 1062.2.2 Antenna InstallationThe antenna is connected by soldering the antenna pads (RF_OUT, pad #59 and DIV_ANT, pad 56) its neighboring ground pads (GND, i.e., pads #55, #57, #58 and #60) directly to the application’s PCB. The antenna pad is the antenna reference point (ARP) for ELS31-VA/ELS51-VA. All RF data specified throughout this document is related to the ARP.Figure 22:  Antenna pads (bottom view)The distance between the antenna RF pads and its neighboring GND pads has been optimized for best possible impedance. On the application PCB, special attention should be paid to these 3 pads, in order to prevent mismatch.The wiring of the antenna connection line, starting from the antenna pad to the application an-tenna should result in a 50Ω line impedance. Line width and distance to the GND plane needs to be optimized with regard to the PCB’s layer stack. Some examples are given in Section 2.2.3.To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the application PCB, it is recommended to realize the antenna connection line using embedded Stripline rather than Micro-Stripline technology. Please see Section 2.2.3.2 for an example.For type approval purposes, the use of a 50Ω coaxial antenna connector (U.FL-R-SMT) might be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible to ELS31-VA/ELS51-VA‘s antenna pad. 5365646362616059585756555466332122232425262728293031322010692919897969594908985 8693749987 8884837978777675828180727170696867105104103102101100734419181716151413121110987654321343536373839404142434546474849505152GNDGNDGNDGNDRF_OUTDIV_ANT251250252245249248247246
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.2 RF Antenna Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 48 of 1062.2.3 RF Line Routing Design2.2.3.1 RF Interface Signals Circuit Diagram ExampleFigure 23 is a topology reference, and it is recommended not to deviate from this circuit for your external application.The RF inter-connects called RF Port 1 and RF Port 2 are examples only. Depending on the RF antenna, the interfacing system will dictate the RF inter-connects.Figure 23:  RF interface signals examplePlease be also aware of ESD protection required on the RF interface lines. ESD protection might be utilized through the above pi-network (primarily intended for managing any additional RF optimization needs), or by additional components in series with the pi-network illustrated above. Please see Section 3.6.1 for further details.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.2 RF Antenna Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 49 of 1062.2.3.2 Line Arrangement ExamplesSeveral dedicated tools are available to calculate line arrangements for specific applicationsand PCB materials - for example from http://www.polarinstruments.com/ (commercial software)or  from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/  (free software).Embedded StriplineThis figure below shows a line arrangement example for embedded stripline with 65µm FR4 prepreg (type: 1080) and 710µm FR4 core (4-layer PCB).Figure 24:  Embedded Stripline with 65µm prepreg (1080) and 710µm core
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.2 RF Antenna Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 50 of 106Micro-StriplineThis section gives two line arrangement examples for micro-stripline. • Micro-Stripline on 1.0mm Standard FR4 2-Layer PCBThe following two figures show examples with different values for D1 (ground strip separa-tion).Figure 25:  Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1Antenna lineGround lineGround lineApplication board
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.2 RF Antenna Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 51 of 106Figure 26:  Micro-Stripline on 1.0mm Standard FR4 PCB - example 2Antenna lineGround lineGround lineApplication board
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.2 RF Antenna Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 52 of 106• Micro-Stripline on 1.5mm Standard FR4 2-Layer PCBThe following two figures show examples with different values for D1 (ground strip separa-tion).Figure 27:  Micro-Stripline on 1.5mm Standard FR4 PCB - example 1Antenna lineGround lineGround lineApplication board
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.2 RF Antenna Interface56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 53 of 106Figure 28:  Micro-Stripline on 1.5mm Standard FR4 PCB - example 2Antenna lineGround lineGround lineApplication board
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.3 Sample Application56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 54 of 1062.3 Sample ApplicationFigure 29 shows a typical example of how to integrate a ELS31-VA/ELS51-VA module with anapplication. Usage of the various host interfaces depends on the desired features of the appli-cation.Because of the high RF field density inside the module, it cannot be guaranteed that no selfinterference might occur, depending on frequency and the applications grounding concept. Thepotential interferers may be minimized by placing small capacitors (47pF) at suspected lines(e.g. RXD0, or ON). While developing SMT applications it is strongly recommended to provide test pointsfor certain signals, i.e., lines to and from the module - for debug and/or test purposes.The SMT application should allow for an easy access to these signals. For details onhow to implement test points see [4].The EMC measures are best practice recommendations. In fact, an adequate EMC strategy foran individual application is very much determined by the overall layout and, especially, the po-sition of components. For example, mounting the internal acoustic transducers directly on thePCB eliminates the need to use the ferrite beads shown in the sample schematic. Depending on the micro controller used by an external application the module‘s digital input and output lines may require level conversion. Section 2.3.2 shows a possible sample level conversion circuit.Note: ELS31-VA/ELS51-VA is not intended for use with cables longer than 3m.DisclaimerNo warranty, either stated or implied, is provided on the sample schematic diagram shown inFigure 29 and the information detailed in this section. As functionality and compliance with na-tional regulations depend to a great amount on the used electronic components and the indi-vidual application layout manufacturers are required to ensure adequate design and operatingsafeguards for their products using ELS31-VA/ELS51-VA modules.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.3 Sample Application56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 55 of 106Figure 29:  Schematic diagram of ELS31-VA/ELS51-VA sample applicationELS31/ELS51Main AntennaDiv. AntennaBATT+RFBATT+BBGPIOsLEDCOUNTERI2CCLKI2CDATGNDSDIOHSICONFST_SHUTDOWNASC0ASC1USBV180CCINCCVCCCCIOCCRSTCCCLKPower Supply33pF 33pF + 150µFLow ESR!2k2 2k2V180BlockingWiFiµC1nF 10pF10pF220nFSIMUSBInterfaces available only on ELS51
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description2.3 Sample Application56ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 56 of 1062.3.1 Prevent Back PoweringBecause of the very low power consumption design, current flowing from any other source into the module circuit must be avoided in any case, for example reverse current from high state external control lines while the module is powered down. Therefore, the controlling application must be designed to prevent reverse current flow. Otherwise there is the risk of undefined states of the module during startup and shutdown or even of damaging the module.A simple solution preventing back powering is the usage of V180 for level shifters, as Figure 30 shows.While the module is in power down mode, V180 must have a level lower than 0.3V after certain time. If this is not the case the module is fed back by the application interface - recog-nizing such a fault state is possible by V180.2.3.2 Sample Level Conversion CircuitDepending on the micro controller used by an external application the module‘s digital input and output lines (i.e., ASC0, ASC1 or GPIO lines) may require level conversion. The following Figure 30 shows a sample circuit with recommended level shifters for an external application‘s micro controller (with VLOGIC between 3.0V...3.6V). The level shifters can be used for digital input and output lines with VOHmax=1.85V or VIHmax =1.85V.Figure 30:  Sample level conversion circuitNote: Bidirectional level shifters without directions control signal are not suitable for RTS0 and DCD0 as they may force the module into a wrong state while starting up.5V tolerarantLow level inputLow level inputLow level inputVCC5V tolerantVCCE.g.,74VHC1GT5074LV1T34E.g.,74LVC2G34NC7WZ16External applicationMicro controllerVLOGIC(3.0V...3.6V)Input lines,e.g., µRXD, µCTSOutput lines,e.g., µTXD, µRTSV180 (1.8V)Digital output lines,e.g., RXDx, CTSxWireless moduleDigital input lines,e.g., TXDx, RTSx
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3 Operating Characteristics76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 57 of 1063 Operating Characteristics3.1 Operating ModesThe table below briefly summarizes the various operating modes referred to throughout thedocument. Table 14:  Overview of operating modesMode FunctionNormal opera-tionLTE IDLE No data transfer is in progress and the USB connection is suspended by host (or is not present) and no active communication via ASC0/ASC1. For power saving issues see Section 3.3. In IDLE mode, the software can be active or in SLEEP state.LTE DATA LTE data transfer in progress. Power consumption depends on network settings and data transfer rate. Power DownNormal shutdown after sending the power down command. Software is not active. Inter-faces are not accessible. Operating voltage remains applied.Airplane modeAirplane mode shuts down the radio part of the module, causes the module to log off from the LTE network and disables all AT commands whose execution requires a radio connec-tion.Airplane mode can be controlled by AT command (see [1]).In Airplane mode, the software can be active or in SLEEP state.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3.2 Power Up/Power Down Scenarios76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 58 of 1063.2 Power Up/Power Down ScenariosDo not turn on the ELS31-VA/ELS51-VA while it is beyond the safety limits of voltage and tem-perature stated in Section 2.1.2.1. ELS31-VA/ELS51-VA will immediately switch off when theseconditions are detected. In extreme cases this can cause permanent damage to the module.3.2.1 Turn on ELS31-VA/ELS51-VAELS31-VA/ELS51-VA can be turned on as described in the following sections:• Connecting the operating voltage BATT_BB and BATT_RF (see Section 3.2.1.1).• Hardware driven switch on by ON line: Starts Normal mode (see Section 3.2.1.2).After startup or restart, the module will send the URC ^SYSSTART that notifies the host appli-cation that the first AT command can be sent to the module (see also [1]).3.2.1.1 Connecting ELS31-VA/ELS51-VA BATT LinesFigure 31 shows sample external application circuits that allow to connect (and also to tempo-rarily disconnect) the module‘s BATT_BB and BATT_RF lines from the external application‘spower supply. Figure 31 illustrates the application of power using an externally controlled microcontroller. Thetransistor T2 mentioned in Figure 31 should have an RDS_ON value < 50m in order to minimizevoltage drops. Such circuits could be useful to maximize power savings for battery driven applications or tocompletely switch off and restart the module after a firmware update.After connecting the BATT_BB and BATT_RF lines the module can then be (re-)started as de-scribed in Section 3.2.1.2.Figure 31:  Sample circuit for applying power using an external µC3.8VModulePlace C2-C5 close to moduleµcontrollerENABLEBATT_BB/RFBATT_INC1100nFC2 47µF,X5RC3 47µF,X5RC4 47µF,X5RC5 47µF,X5RC6 47µF,X5RR1100kR2100kR3100kR610kT1BC857T2IRML6401
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3.2 Power Up/Power Down Scenarios76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 59 of 1063.2.1.2 Switch on ELS31-VA/ELS51-VA Using ON SignalWhen the operating voltage BATT_BB is applied, ELS31-VA/ELS51-VA can be switched on bymeans of the ON signal. The ON signal is an edge triggered signal. The module starts into normal mode on detecting arising edge at the ON signal. The subsequent high level at the ON signal should last for at least100µs. Note that if the ON signal is set to high before BATT_BB is applied, ELS31-VA/ELS51-VA may not start up correctly.Figure 32:  ON timingThe module can also start automatically and immediately after applying the VBATT by connect-ing the ON pad to BATT_BB for a so-called auto start mode. If ON is connected to BATT_BB,and the module is switched off (e.g. by calling AT^SMSO), it will immediately restart.For the auto start mode, it is recommended to set a pull-up resistor of maximum TBD.kOhmbetween the ON circuit and the BATT_BB power supply. Note: If during a power cycle or voltage drop the BATT_BB voltage level does not drop below0.5V, it may happen that the module can no longer start up properly, because its reset conditionwas not reached. This scenario can happen, if the BATT_BB supply is decoupled by big capac-itors – with a slow discharge after a sudden power drop. So, please make sure to keep the pow-er off state long enough for the capacitors to discharge below 0.5V. As a workaround it isrecommended to reset the module with EMERG_RST after startup (see also Section 3.2.2.2).If an automatic module startup is configured for the module, i.e., the ON signal is connected toBATT_BB, then the EMERG_RST signal may be generated automatically – using an externalvoltage detector - when the BATT_BB voltage does reach the valid operating voltage range.BATT_BBONV180VCORE> 250µs> 250µsEMERG_RSTHigh level 100µs min.~ 100ms
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3.2 Power Up/Power Down Scenarios76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 60 of 1063.2.2 Restart ELS31-VA/ELS51-VAAfter startup ELS31-VA/ELS51-VA can be re-started as described in the following sections:• Software controlled reset by AT+CFUN command: Starts Normal mode (see Section3.2.2.1)• Hardware controlled reset by EMERG_RST line: Starts Normal mode (see Section 3.2.2.2)3.2.2.1 Restart ELS31-VA/ELS51-VA via AT+CFUN CommandTo reset and restart the ELS31-VA/ELS51-VA module use the command AT+CFUN. See [1]for details.3.2.2.2 Restart ELS31-VA/ELS51-VA Using EMERG_RSTThe EMERG_RST signal is internally connected to the central GSM processor. A low level formore than 10 milliseconds sets the processor and with it all the other signal pads to their re-spective reset state. The reset state is described in Section 3.2.3 as well as in the figures show-ing the startup behavior of an interface.After releasing the EMERG-RST line, i.e., with a change of the signal level from low to high,the module restarts. The other signals continue from their reset state as if the module wasswitched on by the ON signal. Figure 33:  Emergency restart timingBATT_BBONEMERG_RSTVCOREV180>10msSystem startedSystem started againReset stateIgnition
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3.2 Power Up/Power Down Scenarios76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 61 of 106It is recommended to control this EMERG_RST line with an open collector transistor or an opendrain field-effect transistor.Note: It is necessary to trigger EMERG_RST after a module turn off by a sudden (incomplete)power drop, and before using ON to restart the module (see also Section 3.2.1.2).Caution: Generally, use the EMERG_RST line only when, due to serious problems, the soft-ware is not responding for more than 5 seconds. Pulling the EMERG_RST line causes the lossof all information stored in the volatile memory. Therefore, this procedure is intended only foruse in case of emergency, e.g. if ELS31-VA/ELS51-VA does not respond, if restart or shutdownvia AT command fails.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3.2 Power Up/Power Down Scenarios76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 62 of 1063.2.3 Signal States after First StartupTable 15 lists the states each interface signal passes through during reset and first firmwareinitialization. For further firmware startup initializations the values may differ because of differ-ent GPIO line configurations.The reset state is reached with the rising edge of an internal reset line - either with a normalmodule startup after about 26 milliseconds (see Section 3.2.1) or after a restart (see Section3.2.2). After the reset state has been reached the firmware initialization state begins. The firm-ware and command interface initialization is completed as soon as the ASC0 interface lineCTS0 has turned low (see Section 2.1.4). Now, the module is ready to receive and transmit data.Abbreviations used in above Table 15: Table 15:  Signal statesSignal name Default functionality Reset state First start up configurationCCIO I O / LCCRST I O / LCCCLK O / L O / LCCIN I I / PDRXD0 I / PU O / HTXD0 I ICTS0 I O / HRTS0 I I / PDGPIO1/DTR0 DTR0 T / PD I / PUGPIO2/DCD0 DCD0 T / PD O GPIO3/DSR0 DSR0 T / PD O GPIO4/FST_SHDN GPIO4 I / PD I / PUGPO5/LED LED I / PD OGPIO6  GPIO6 I / PD I / PDGPIO7  GPIO7 I / PU I / PDGPIO8/COUNTER GPIO8 I I / PDGPIO16/RXD1 GPIO16 I I / PUGPIO17/TXD1 GPIO17 I /PU I / PUGPIO18/RTS1 GPIO18 I /PU I / PUGPIO19/CTS1 GPIO19 I /PU I / PUGPIO20/PCM_I2S_OUT GPIO20 I I / PDGPIO21/PCM_I2S_IN GPIO21 I I / PDGPIO22/PCM_I2S_FSC GPIO22 I I / PDGPO23/PCM_I2S_CLK GPO23 I O / LGPIO24/RING0 RING0 T / PD OGPIO25 GPIO25 I I / PDGPO26/SPI_CS1 GPO26 I OGPIO27/SPI_CS2 GPIO27 I I / PDI2CCLK I / PD T / ODI2CDAT I / PD T / ODL = Low levelH = High levelT = TristateI = InputO = OutputOD = Open DrainPD = Pull downPU = Pull up
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3.2 Power Up/Power Down Scenarios76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 63 of 1063.2.4 Turn off ELS31-VA/ELS51-VA To switch the module off the following procedures may be used: •Software controlled shutdown procedure: Software controlled by sending an AT commandover the serial application interface. See Section 3.2.4.1.•Hardware controlled shutdown procedure: Hardware controlled by employing theFST_SHDN line. See Section 2.1.16.4.•Automatic shutdown (software controlled): See Section 3.2.5- Takes effect if ELS31-VA/ELS51-VA board temperature exceeds a critical limit.3.2.4.1 Switch off ELS31-VA/ELS51-VA Using AT CommandThe best and safest approach to powering down ELS31-VA/ELS51-VA is to issue the appropriateAT command. This procedure lets ELS31-VA/ELS51-VA log off from the network and allows thesoftware to enter into a secure state and safe data before disconnecting the power supply. Themode is referred to as Power Down mode. In this mode. Before issueing the switch off AT com-mand, the ON signal should be set to low (see Figure 34). Otherwise there might be back pow-ering at the ON line in Power Down mode.While ELS31-VA/ELS51-VA is in Power Down mode the application interface is switched off andmust not be fed from any other voltage source. Therefore, your application must be designedto avoid any current flow into any digital pads of the application interface. Figure 34:  Switch off behaviorBATT+ONVCOREV180AT^SMSO System power down procedure Power downEMERG_RST
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3.2 Power Up/Power Down Scenarios76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 64 of 1063.2.5 Automatic ShutdownAutomatic shutdown takes effect if the following event occurs:• The ELS31-VA/ELS51-VA board is exceeding the critical limits of overtemperature or under-temperature (see Section 3.2.5.1)• Undervoltage or overvoltage is detected (see Section 3.2.5.2 and Section 3.2.5.3)The automatic shutdown procedure is equivalent to the power-down initiated with an AT com-mand, i.e. ELS31-VA/ELS51-VA logs off from the network and the software enters a secure stateavoiding loss of data. 3.2.5.1 Thermal ShutdownThe board temperature is constantly monitored by an internal NTC resistor located on the PCB.The values detected by the NTC resistor are measured directly on the board and therefore, arenot fully identical with the ambient temperature. Each time the board temperature goes out of range or back to normal, ELS31-VA/ELS51-VA in-stantly displays an alert (if enabled).• URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such asprotecting the module from exposure to extreme conditions. The presentation of the URCsdepends on the settings selected with the AT^SCTM write command (for details see [1]):AT^SCTM=1: Presentation of URCs is always enabled. AT^SCTM=0 (default): Presentation of URCs is enabled during the 2 minute guard periodafter start-up of ELS31-VA/ELS51-VA. After expiry of the 2 minute guard period, the presen-tation of URCs will be disabled, i.e. no URCs with alert levels "1" or ''-1" will be generated.• URCs indicating the level "2" or "-2" are instantly followed by an orderly shutdown. The pre-sentation of these URCs is always enabled, i.e. they will be output even though the factorysetting AT^SCTM=0 was never changed.The maximum temperature ratings are stated in Section 3.5. Refer to Table 16 for the associ-ated URCs. Table 16:  Temperature dependent behaviorSending temperature alert (2min after module start-up, otherwise only if URC presentation enabled)^SCTM_B: 1 Board close to overtemperature limit.^SCTM_B: -1 Board close to undertemperature limit.^SCTM_B: 0 Board back to non-critical temperature range.Automatic shutdown (URC appears no matter whether or not presentation was enabled)^SCTM_B:  2 Alert: Board equal or beyond overtemperature limit. ELS31-VA/ELS51-VA switches off.^SCTM_B:  -2 Alert: Board equal or below undertemperature limit. ELS31-VA/ELS51-VA switches off.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3.2 Power Up/Power Down Scenarios76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 65 of 1063.2.5.2 Undervoltage ShutdownThe undervoltage shutdown threshold is the specified minimum supply voltage VBATT+ given inTable 2. When the average supply voltage measured by ELS31-VA/ELS51-VA approaches theundervoltage shutdown threshold (i.e., 0.05V offset) the module will send the following URC: ^SBC: Undervoltage WarningThe undervoltage warning is sent only once - until the next time the module is close to the un-dervoltage shutdown threshold. If the voltage continues to drop below the specified undervoltage shutdown threshold, the mod-ule will send the following URC:^SBC: Undervoltage ShutdownThis alert is sent only once before the module shuts down cleanly without sending any furthermessages.This type of URC does not need to be activated by the user. It will be output automatically whenfault conditions occur.Note: For battery powered applications it is strongly recommended to implement a BATT+ con-necting circuit as described in Section 3.2.1.1 in order to not only be able save power, but alsoto restart the module after an undervoltage shutdown where the battery is deeply discharged.Also note that the undervoltage threshold is calculated for max. 400mV voltage drops duringtransmit burst. Power supply sources for external applications should be designed to tolerate400mV voltage drops without crossing the lower limit of 3.3 V. For external applications oper-ating at the limit of the allowed tolerance the default undervoltage threshold may be adaptedby subtracting an offset. For details see [1]: AT^SCFG= "MEShutdown/sVsup/threshold".3.2.5.3 Overvoltage ShutdownThe overvoltage shutdown threshold is the specified maximum supply voltage VBATT+ given inTable 2. When the average supply voltage measured by ELS31-VA/ELS51-VA approaches theovervoltage shutdown threshold (i.e., 0.05V offset) the module will send the following URC:^SBC: Overvoltage WarningThe overvoltage warning is sent only once - until the next time the module is close to the over-voltage shutdown threshold. If the voltage continues to rise above the specified overvoltage shutdown threshold, the modulewill send the following URC:^SBC: Overvoltage ShutdownThis alert is sent only once before the module shuts down cleanly without sending any furthermessages.This type of URC does not need to be activated by the user. It will be output automatically whenfault conditions occur.Keep in mind that several module components are directly linked to BATT+ and, therefore, thesupply voltage remains applied at major parts of ELS31-VA/ELS51-VA. Especially the poweramplifier linked to BATT+RF is very sensitive to high voltage and might even be destroyed.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3.3 Power Saving76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 66 of 1063.3 Power SavingELS31-VA/ELS51-VA can be configured in two ways to control power consumption:• Being set by configuration, it is possible to specify a so-called power saving mode for themodule (for details on the command see [1]). The module's UART interfaces (ASC0 andASC1) are then deactivated and will only periodically be activated to be able to listen to net-work paging messages as described in Section 3.3.1. See Section 3.3.2 for a descriptionof how to immediately wake up ELS31-VA/ELS51-VA again using RTS0. Note: RTS0/RTS1 must to be set to high before the ELS31-VA/ELS51-VA can change intopower saving mode. Also note that the AT^SPOW setting has no effect on the USB inter-face. As long as the USB connection is active, the module will not change into its SLEEPstate to reduce its functionality to a minimum and thus minimizing its current consumption.To enable switching into SLEEP mode, the USB connection must therefore either not bepresent at all or the USB host must bring its USB interface into Suspend state. Also, VUS-B_IN should always be kept enabled for this functionality. See “Universal Serial Bus Spec-ification Revision 2.0”1 for a description of the Suspend state. • Being triggered by LTE network protocol while attached to LTE networks3.3.1 Power Saving while Attached to LTE NetworksThe power saving possibilities while attached to a LTE network depend on the paging timingcycle of the base station. During normal LTE operation, i.e., the module is connected to a LTE network, the duration ofa power saving period varies. It may be calculated using the following formula:t = DRX Cycle Value* 10 ms DRX (Discontinuous Reception) value in LTE networks is any of the four values: 32, 64, 128and 256, thus resulting in power saving intervals between 0.32 and 2.56 seconds. The DRXvalue of the base station is assigned by the LTE network operator. In the pauses between listening to paging messages, the module resumes power saving, asshown in Figure 35. Figure 35:  Power saving and paging in LTE networksThe varying pauses explain the different potential for power saving. The longer the pause theless power is consumed.Generally, power saving depends on the module’s application scenario and may differ from theabove mentioned normal operation. The power saving interval may be shorter than 0.64 sec-onds or longer than 5.12 seconds.1.  The specification is ready for download on http://www.usb.org/developers/docs/Power SavingPagingDRX Cycle0.32 - 2.56sPower SavingPagingDRX Cycle0.32 - 2.56sPower SavingPagingDRX Cycle0.32 - 2.56sPower SavingPagingDRX Cycle0.32 - 2.56s
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3.3 Power Saving76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 67 of 1063.3.2 Wake-up via RTS0/RTS1RTS0/RTS1 can be used to wake up ELS31-VA/ELS51-VA from SLEEP mode configured withAT command. Assertion of either RTS0 or RTS1 (i.e., toggle from inactive high to active low)serves as wake up event, thus allowing an external application to almost immediately terminatepower saving. After RTS0/RTS1 assertion, the CTS0/CTS1 line signals module wake up, i.e.,readiness of the AT command interface. It is therefore recommended to enable RTS/CTS flowcontrol (default setting). Figure 36 shows the described RTS0/RTS1 wake up mechanism. • RTS0/RTS1 must be high.• After a given programmable timeout (100ms up to 10s, default 5s) with no activity on ASC0and ASC1 (and no data to transmit by module to host in Linux /dev/tty driver), CTS0/CTS1will be driven high. • After a 2nd timeout (equal or greater than the duration needed to receive one character atUART baudrate; ex: ~1.05ms for 10bit @ 9600baud), and while RTS0/RTS1 remains high(which means an external application does not request the module to wake up), the modulewill enter sleep mode.• Now, the host can wake-up the module driving RTS0/RTS1 from high to low.• Module will inform the host it is ready to receive over UART by driving CTS0/CTS1 to low.Figure 36:  Wake-up via RTS0/RTS1Note: RTS0/RTS1 has to be high for ELS31-VA/ELS51-VA to be able to change into SLEEPmode.RTS0/RTS1CTS0/CTS1TXD0/TXD1RXD0/RXD1AT commandReply URCRTS assertion (falling edge)W ake up from  SLEEP m ode R e turn to  S L E E P modeRTS back high<1.05ms100ms to1 0 s100m s to10s<1.05ms SLEEP mode
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3.4 Power Supply76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 68 of 1063.4 Power SupplyELS31-VA/ELS51-VA needs to be connected to a power supply at the SMT application inter-face - 2 BATT lines and GND. There are two separate voltage domains for BATT:• BATT_BB with a line mainly for the baseband power supply.• BATT_RF with a line for the RF power amplifier supply.Please note that throughout the document BATT refers to both voltage domains and powersupply lines - BATT_BB and BATT_RF.The power supply of ELS31-VA/ELS51-VA has to be a single voltage source at BATT_BB andBATT_RF. It must be able to provide the current for all operation modes of the module. All the key functions for supplying power to the device are handled by the power managementsection of the analog controller. This IC provides the following features:• Stabilizes the supply voltages for the baseband using low drop linear voltage regulators anda DC-DC step down switching regulator.• Switches the module's power voltages for the power-up and -down procedures.• SIM switch to provide SIM power supply.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3.4 Power Supply76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 69 of 1063.4.1 Power Supply RatingsTable 17 and Table 18 assemble various voltage supply and current consumption ratings of themodule.Table 17:  Voltage supply ratingsDescription Conditions Min Typ Max UnitBATT_BBBATT_RFSupply voltage  Directly measured at Module.Voltage must stay within the min/max values, including voltage drop, ripple, spikes3.3 4.5 VVoltage ripple Normal condition, power control level for Pout max@ f <= 250 kHz@ f > 250 kHz11030mVppmVppTable 18:  Current consumption ratingsDescription Conditions Power [mW] Typical rating@ 3.8V [mA]IBATT+ Power Down Mode <15µAAiplane Mode 9.2 2.4LTE Idle RRC Paging cycle @ 2.56 s 15.2 4.0RRC Paging cycle @ 1.28 s 20.9 5.5LTE Data LTE cDRX modeNo trafficcDRX period 320ms238 62.5Cell search 38 10
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3.4 Power Supply76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 70 of 1063.4.2 Minimizing Power LossesWhen designing the power supply for your application please pay specific attention to powerlosses. Ensure that the input voltage of BATT_BB/BATT_RF never drops below 3.3V on theELS31-VA/ELS51-VA board.3.4.3 Measuring the Supply Voltage (BATT_BB)To measure the supply voltage of BATT_BB/BATT_RF it is possible to define three referencepoints GND ,BATT_BB and BATT_RF. GND should be the module’s shielding, while BAT-T_BB/BATT_RF should be a test pad on the external application the module is mounted on.The external BATT_BB/NBATT_RF reference points have to be connected to and positionedclose to the SMT application interface’s BATT pads 5 (BATT_BB) or 53 (BATT_RF) as shownin Figure 37.Figure 37:  Position of reference points BATT_BB/BATT_RF and GND3.4.4 Monitoring Power Supply by AT CommandTo monitor the supply voltage you can also use the AT^SBV command which returns the valuerelated to the reference points BATT_BB and GND. The module continuously measures the voltage at intervals depending on the operating modeof the RF interface. The duration of measuring ranges from 0.5 seconds in TALK/DATA modeto 50 seconds when ELS31-VA/ELS51-VA is in IDLE mode or Limited Service (deregistered).The displayed voltage (in mV) is averaged over the last measuring period before the AT^SBVcommand was executed. If the measured voltage drops below or rises above the voltage shutdown thresholds, the mod-ule will send an "^SBC" URC and shut down (for details see Section 3.2.5).Reference point GND:Module shieldingReference point BATT_BB/BATT_RF:External test pad connectedto and positioned closely toBATT pad 5 or 53.External application
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3.5 Operating Temperatures76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 71 of 1063.5 Operating TemperaturesPlease note that the module’s lifetime, i.e., the MTTF (mean time to failure) may be reduced, ifoperated outside the extended temperature range. See also Section 3.2.5 for information about the NTC for on-board temperature measurement,automatic thermal shutdown and alert messages.Note: Within the specified operating temperature ranges the board temperature may vary to agreat extent depending on operating mode, used frequency band, radio output power and cur-rent supply voltage.For more information regarding the module’s thermal behavior please refer to [3]. Table 19:  Board temperatureParameter Min Typ Max UnitNormal operation -30 +25 +85 °CExtended operation11. Extended operation allows normal mode speech calls or data transmission for limited time until automatic thermal shutdown takes effect. Within the extended temperature range (outside the normal operating temperature range) the specified electrical characteristics may be in- or decreased.-40 +90 °CAutomatic shutdown2Temperature measured on ELS31-VA/ELS51-VAboard2. Due to temperature measurement uncertainty, a tolerance of ±3°C on the thresholds may occur.<-40 --- >+90 °C
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3.6 Electrostatic Discharge76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 72 of 1063.6 Electrostatic DischargeThe LTE module is not protected against Electrostatic Discharge (ESD) in general. Conse-quently, it is subject to ESD handling precautions that typically apply to ESD sensitive compo-nents. Proper ESD handling and packaging procedures must be applied throughout theprocessing, handling and operation of any application that incorporates a ELS31-VA/ELS51-VAmodule.Special ESD protection complying to ETSI EN 301 489-01/-07 is provided for the SIM interfaceas also mentioned in Section 2.1.6.The remaining interfaces of ELS31-VA/ELS51-VA with the exception of the antenna interfaceare not accessible to the user of the final product (since they are installed within the device)and are therefore only protected according to the ANSI/ESDA/JEDEC JS-001-2011 require-ments.ELS31-VA/ELS51-VA has been tested according to following standards. Electrostatic valuescan be gathered from the following table.Note: The values may vary with the individual application design. For example, it matterswhether or not the application platform is grounded over external devices like a computer orother equipment, such as the Gemalto reference application described in Chapter 5.3.3.6.1 ESD Protection for Antenna InterfaceThe following Figure 38 shows how to implement an external ESD protection for the RF anten-na interface with either a T pad or PI pad attenuator circuit (for RF line routing design see alsoSection 2.2.3).Figure 38:  ESD protection for RF antenna interfacePossible inductors: Murata LQG15HS22NJ02D (22nH), and LQW15AN18NJ00 (18nH)Table 20:  Electrostatic valuesSpecification/Requirements Contact discharge Air dischargeETSI EN 301 489-01/-07SIM interface  4kV   8kVANSI/ESDA/JEDEC JS-001-2011All other SMT interfaces  1kV Human Body Model n.a.JEDEC JESD22-A114D (Human Body Model, Test conditions: 1.5 kΩ, 100 pF)All other SMT interfaces  500VCharge Device Model (CDM) n.a.Main Antenna18pF22nHRF_OUT(Pad 59)18pFT pad attenuator circuitMain Antenna18nHRF_OUT(Pad 59)4.7pFPI pad attenuator circuit18nH
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3.7 Blocking against RF on Interface Lines76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 73 of 1063.7 Blocking against RF on Interface LinesTo reduce EMI issues there are serial resistors, or capacitors to GND, implemented on themodule for the ignition, emergency restart, and SIM interface lines (cp. Section 2.3). However,all other signal lines have no EMI measures on the module and there are no blocking measuresat the module’s interface to an external application. Dependent on the specific application design, it might be useful to implement further EMI mea-sures on some signal lines at the interface between module and application. These measuresare described below.There are five possible variants of EMI measures (A-C) that may be implemented betweenmodule and external application depending on the signal line (see Figure 39 and Table 21). Payattention not to exceed the maximum input voltages and prevent voltage overshots if using in-ductive EMC measures.The maximum value of the serial resistor should be lower than 1k on the signal line. The max-imum value of the capacitor should be lower than 50pF on the signal line. Please observe theelectrical specification of the module‘s SMT application interface and the external application‘sinterface.Figure 39:  EMI circuitsNote: In case the application uses an internal antenna that is implemented close to the ELS31-VA/ELS51-VA / ELS51-VA module, Gemalto strongly recommends sufficient EMI measures,e.g. of type B or C, for each digital input or output.CGNDSMTRApplicationEMI measures ASMTRApplicationEMI measures CCGNDSMT ApplicationEMI measures B
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3.7 Blocking against RF on Interface Lines76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 74 of 106The following table lists EMI measures that may be implemented for each signal line at themodule‘s SMT application interface.Table 21:  EMI measures on the application interfaceSignal name EMI measures RemarkABCCCIN xCCRST xxxThe external capacitor should be not higher than 10pF. The value of the capacitor depends on the external application.CCIO x x xCCCLK x x xRXD0 x x xTXD0 xxxCTS0 xxxRTS0 xxxGPIO1/DTR0 x x xGPIO2/DCD0 x x xGPIO3/DSR0 x x xGPIO4/FST_SHDN x x xGPO5/LED x x xGPIO6 xxxGPIO7 xxxGPIO8/COUNTER x x xGPIO16/RXD1/AP_WAKEUP x x xGPIO17/TXD1/HOST_ACTIVE x x xGPIO18/RTS1/CP_WAKEUP x x xGPIO19/CTS1/SUSPEND x x xGPIO20/PCM_I2S_OUT x x xGPIO21/PCM_I2S_IN x x xGPIO22/PCM_I2S_FSC x x xGPO23/PCM_I2S_CLK x x xGPIO24/RING0 x x xGPIO25 xxxGPO26/SPI_CS1 x x xGPIO27/SPI_CS2 x x xI2CDAT  x The rising signal edge is reduced with an addi-tional capacitor.I2CCLK xV180 xVCORE x
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3.7 Blocking against RF on Interface Lines76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 75 of 106BATT_RF x Measures required if BATT+RF is close to internal LTE antenna -e.g., 39pF blocking capacitor to groundBATT_BB xSDIOCMD xxxSDIOCLK xxxSDIO0 xxxSDIO1 xxxSDIO2 xxxSDIO3 xxxHSIC_DATA xxxHSIC_STRB xxxTable 21:  EMI measures on the application interfaceSignal name EMI measures RemarkABC
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description3.8 Reliability Characteristics76ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 76 of 1063.8 Reliability CharacteristicsThe test conditions stated below are an extract of the complete test specifications. Table 22:  Summary of reliability test conditionsType of test Conditions StandardVibration Frequency range: 10-20Hz; acceleration: 5gFrequency range: 20-500Hz; acceleration: 20gDuration: 2h per axis; 3 axesDIN IEC 60068-2-611. For reliability tests in the frequency range 20-500Hz the Standard’s acceleration reference value was increased to 20g.Shock half-sinus Acceleration: 500gShock duration: 1ms1 shock per axis6 positions (± x, y and z)DIN IEC 60068-2-27Dry heat Temperature: +70 ±2°CTest duration: 16hHumidity in the test chamber: < 50%EN 60068-2-2 Bb ETS 300 019-2-7Temperature change (shock)Low temperature: -40°C ±2°CHigh temperature: +85°C ±2°CChangeover time: < 30s (dual chamber system)Test duration: 1hNumber of repetitions: 100DIN IEC 60068-2-14 NaETS 300 019-2-7Damp heat cyclic High temperature: +55°C ±2°CLow temperature: +25°C ±2°CHumidity: 93% ±3%Number of repetitions:  6Test duration: 12h + 12hDIN IEC 60068-2-30 DbETS 300 019-2-5Cold (constant exposure)Temperature: -40 ±2°CTest duration: 16hDIN IEC 60068-2-1
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description4 Mechanical Dimensions, Mounting and Packaging92ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 77 of 1064 Mechanical Dimensions, Mounting and PackagingThe following sections describe the mechanical dimensions of ELS31-VA/ELS51-VA and give recommendations for integrating ELS31-VA/ELS51-VA into the host application.4.1 Mechanical Dimensions of ELS31-VA/ELS51-VA Figure 40 shows the top and bottom view of ELS31-VA/ELS51-VA and provides an overview of the board's mechanical dimensions. For further details see Figure 41. Figure 40:  ELS31-VA/ELS51-VA– top and bottom viewProduct labelTop viewBottom view
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description4.1 Mechanical Dimensions of ELS31-VA/ELS51-VA92ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 78 of 106Figure 41:  Dimensions of ELS31-VA/ELS51-VA (all dimensions in mm)Figure 42:  Dimensions of ELS31-VA/ELS51-VA (all dimensions in mm) - bottom view0.118.80.127.60.31  0.04(PCB)2.05 0.1(TOTAL)TOP VIEW18.827.60.81.20.40.550.551.050.42.60.41.451.050.151.640.91.11.10.16#0550.7*&8
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description4.2 Mounting ELS31-VA/ELS51-VA onto the Application Platform92ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 79 of 1064.2 Mounting ELS31-VA/ELS51-VA onto the Application Plat-formThis section describes how to mount ELS31-VA/ELS51-VA onto the PCBs (=printed circuit boards), including land pattern and stencil design, board-level characterization, soldering con-ditions, durability and mechanical handling. For more information on issues related to SMT module integration see also [4].Note: To avoid short circuits between signal tracks on an external application's PCB and vari-ous markings at the bottom side of the module, it is recommended not to route the signal tracks on the top layer of an external PCB directly under the module, or at least to ensure that signal track routes are sufficiently covered with solder resist.4.2.1 SMT PCB Assembly4.2.1.1 Land Pattern and StencilThe land pattern and stencil design as shown below is based on Gemalto characterizations for lead-free solder paste on a four-layer test PCB and a 120 micron thick stencil. The land pattern given in Figure 43 reflects the module‘s pad layout, including signal pads and ground pads (for pad assignment see Section 2.1.1).Figure 43:  Land pattern (top view)
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description4.2 Mounting ELS31-VA/ELS51-VA onto the Application Platform92ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 80 of 106The stencil design illustrated in Figure 44 is recommended by Gemalto M2M as a result of ex-tensive tests with Gemalto M2M Daisy Chain modules. Figure 44:  Recommended design for 120 micron thick stencil (top view, dual design)
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description4.2 Mounting ELS31-VA/ELS51-VA onto the Application Platform92ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 81 of 1064.2.1.2 Board Level CharacterizationBoard level characterization issues should also be taken into account if devising an SMT pro-cess.Characterization tests should attempt to optimize the SMT process with regard to board level reliability. This can be done by performing the following physical tests on sample boards: Peel test, bend test, tensile pull test, drop shock test and temperature cycling. Sample surface mount checks are described in [4].It is recommended to characterize land patterns before an actual PCB production, taking indi-vidual processes, materials, equipment, stencil design, and reflow profile into account. For land and stencil pattern design recommendations see also Section 4.2.1.1. Optimizing the solder stencil pattern design and print process is necessary to ensure print uniformity, to decrease sol-der voids, and to increase board level reliability.Daisy chain modules for SMT characterization are available on request. For details refer to [4].Generally, solder paste manufacturer recommendations for screen printing process parame-ters and reflow profile conditions should be followed. Maximum ratings are described in Section 4.2.3.4.2.2 Moisture Sensitivity LevelELS31-VA/ELS51-VA comprises components that are susceptible to damage induced by ab-sorbed moisture.Gemalto M2M’s ELS31-VA/ELS51-VA module complies with the latest revision of the IPC/JE-DEC J-STD-020 Standard for moisture sensitive surface mount devices and is classified as MSL 4.For additional MSL (=moisture sensitivity level) related information see Section 4.2.4 and Sec-tion 4.3.2.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description4.2 Mounting ELS31-VA/ELS51-VA onto the Application Platform92ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 82 of 1064.2.3 Soldering Conditions and Temperature4.2.3.1 Reflow ProfileFigure 45:  Reflow Profile Table 23:  Reflow temperature ratings11. Please note that the reflow profile features and ratings listed above are based on the joint industry stan-dard IPC/JEDEC J-STD-020D.1, and are as such meant as a general guideline. For more information on reflow profiles and their optimization please refer to [4].Profile Feature Pb-Free AssemblyPreheat & SoakTemperature Minimum (TSmin)Temperature Maximum (TSmax)Time (tSmin to tSmax) (tS)150°C200°C60-120 secondsAverage ramp up rate (TSmax  to TP) 3K/second max.Liquidous temperature (TL)Time at liquidous (tL)217°C60-90 secondsPeak package body temperature (TP) 245°C +0/-10°CTime (tP) within 5 °C of the peak package body temperature (TP)20 seconds max.Average ramp-down rate (TP to TSmax) 3 K/second max.Time 25°C to maximum temperature 6 minutes max.TLTPtPtLtS Preheatt to maximum TimeTemperatureTSminTSmax
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description4.2 Mounting ELS31-VA/ELS51-VA onto the Application Platform92ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 83 of 1064.2.3.2 Maximum Temperature and DurationThe following limits are recommended for the SMT board-level soldering process to attach the module:• A maximum module temperature of 240°C. This specifies the temperature as measured atthe module’s top side.• A maximum duration of 15 seconds at this temperature.Please note that while the solder paste manufacturers' recommendations for best temperature and duration for solder reflow should generally be followed, the limits listed above must not be exceeded.ELS31-VA/ELS51-VA is specified for one soldering cycle only. Once ELS31-VA/ELS51-VA is removed from the application, the module will very likely be destroyed and cannot be soldered onto another application.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description4.2 Mounting ELS31-VA/ELS51-VA onto the Application Platform92ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 84 of 1064.2.4 Durability and Mechanical Handling4.2.4.1 Storage ConditionsELS31-VA/ELS51-VA modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier anti-static bags. The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Nor-mal storage time under these conditions is 12 months maximum.Table 24:  Storage conditionsType Condition Unit ReferenceAir temperature: LowHigh-25+40°C IPC/JEDEC J-STD-033AHumidity relative: LowHigh1090 at 40°C%IPC/JEDEC J-STD-033AAir pressure:   LowHigh70106kPa IEC TR 60271-3-1: 1K4IEC TR 60271-3-1: 1K4Movement of surrounding air 1.0 m/s IEC TR 60271-3-1: 1K4Water: rain, dripping, icing and frostingNot allowed --- ---Radiation:   SolarHeat1120600W/m2ETS 300 019-2-1: T1.2, IEC 60068-2-2 BbETS 300 019-2-1: T1.2, IEC 60068-2-2 BbChemically active substances Not recommendedIEC TR 60271-3-1: 1C1LMechanically active substances Not recommendedIEC TR 60271-3-1: 1S1Vibration sinusoidal:DisplacementAccelerationFrequency range1.552-9   9-200mmm/s2HzIEC TR 60271-3-1: 1M2Shocks:Shock spectrumDurationAccelerationSemi-sinusoidal150msm/s2IEC 60068-2-27 Ea
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description4.2 Mounting ELS31-VA/ELS51-VA onto the Application Platform92ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 85 of 1064.2.4.2 Processing LifeELS31-VA/ELS51-VA must be soldered to an application within 72 hours after opening the MBB (=moisture barrier bag) it was stored in.As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the modules should have ambient temperatures below 30°C and a relative humidity below 60%.4.2.4.3 BakingBaking conditions are specified on the moisture sensitivity label attached to each MBB (see Figure 50 for details):• It is not necessary to bake ELS31-VA/ELS51-VA, if the conditions specified in Section4.2.4.1 and Section 4.2.4.2 were not exceeded.• It is necessary to bake ELS31-VA/ELS51-VA, if any condition specified in Section 4.2.4.1and Section 4.2.4.2 was exceeded.If baking is necessary, the modules must be put into trays that can be baked to at least 125°C. Devices should not be baked in tape and reel carriers at any temperature.4.2.4.4 Electrostatic DischargeESD (=electrostatic discharge) may lead to irreversable damage for the module. It is therefore advisable to develop measures and methods to counter ESD and to use these to control the electrostatic environment at manufacturing sites.Please refer to Section 3.6 for further information on electrostatic discharge.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description4.3 Packaging92ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 86 of 1064.3 Packaging4.3.1 Tape and ReelThe single-feed tape carrier for ELS31-VA/ELS51-VA is illustrated in Figure 46. The figure also shows the proper part orientation. The tape width is 44 mm and the ELS31-VA/ELS51-VA mod-ules are placed on the tape with a 28-mm pitch. The reels are 330 mm in diameter with a core diameter of 100 mm. Each reel contains 500 modules.4.3.1.1 OrientationFigure 46:  Carrier tapeFigure 47:  Reel direction 44 mm 330 mm Reel direction of the completely equipped tape Direction into SMD machineView directionPad 1Pad 1
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description4.3 Packaging92ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 87 of 1064.3.1.2 Barcode LabelA barcode label provides detailed information on the tape and its contents. It is attached to the reel. Figure 48:  Barcode label on tape reelBarcode label
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description4.3 Packaging92ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 88 of 1064.3.2 Shipping MaterialsELS31-VA/ELS51-VA is distributed in tape and reel carriers. The tape and reel carriers used to distribute ELS31-VA/ELS51-VA are packed as described below, including the following re-quired shipping materials:• Moisture barrier bag, including desiccant and humidity indicator card• Transportation box4.3.2.1 Moisture Barrier BagThe tape reels are stored inside an MBB (=moisture barrier bag), together with a humidity indi-cator card and desiccant pouches - see Figure 49. The bag is ESD protected and delimits mois-ture transmission. It is vacuum-sealed and should be handled carefully to avoid puncturing or tearing. The bag protects the ELS31-VA/ELS51-VA modules from moisture exposure. It should not be opened until the devices are ready to be soldered onto the application. Figure 49:  Moisture barrier bag (MBB) with imprintThe label shown in Figure 50 summarizes requirements regarding moisture sensitivity, includ-ing shelf life and baking requirements. It is attached to the outside of the moisture barrier bag.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description4.3 Packaging92ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 89 of 106Figure 50:  Moisture Sensitivity Label
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description4.3 Packaging92ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 90 of 106MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture. The desiccant pouches should not be baked or reused once removed from the MBB.The humidity indicator card is a moisture indicator and is included in the MBB to show the ap-proximate relative humidity level within the bag. Sample humidity cards are shown in Figure 51. If the components have been exposed to moisture above the recommended limits, the units will have to be rebaked.Figure 51:  Humidity Indicator Card - HICA baking is required if the humidity indicator inside the bag indicates 10% RH or more.4.3.2.2 Transportation BoxTape and reel carriers are distributed in a box, marked with a barcode label for identification purposes. A box contains two reels with 500 modules each.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description4.3 Packaging92ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 91 of 1064.3.3 TraysIf small module quantities are required, e.g., for test and evaluation purposes, ELS31-VA/ELS51-VA may be dis-tributed in trays (for dimensions see Figure 55). The small quantity trays are an alternative to the single-feed tape carriers normally used. However, the trays are not designed for machine processing. They contain modules to be (hand) soldered onto an external application (for in-formation on hand soldering see [4]).Figure 52:  Small quantity trayTrays are packed and shipped in the same way as tape carriers, including a moisture barrier bag with desiccant and humidity indicator card as well as a transportation box (see also Section 4.3.2).Figure 53:  Tray to ship odd module amountsFigure 54:  Trays with packaging materials1:1,5
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description4.3 Packaging92ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 92 of 106Figure 55:  Tray dimensions
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description5 Regulatory and Type Approval Information98ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 93 of 1065 Regulatory and Type Approval Information5.1 Directives and StandardsELS31-VA/ELS51-VA is designed to comply with the directives and standards listed below.It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec-ifications provided in the "ELS31-VA/ELS51-VA Hardware Interface Description".Table 25:  Directives2002/95/EC (RoHS 1)2011/65/EC (RoHS 2)Directive of the European Parliament and of the Council of 27 January 2003 (and revised on 8 June 2011) on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)Table 26:  Standards of North American type approvalCFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommunications, PCS); US Equipment Authorization FCCOET Bulletin 65 (Edition 97-01) Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic FieldsUL 60 950-1 Product Safety Certification (Safety requirements)California Leadfree Man-dateCovered by European RoHS requirementsRSS132 (Issue2)RSS133 (Issue5)Canadian StandardTable 27:  Standards of Verizon type approvalVerizon Wireless Unified Module Process for Compliance Testing and Approval, October 2014Verizon Wireless Device Requirements LTE 3GPP Band 13 Network Access, October 2014Verizon Wireless Device Requirements LTE 3GPP Band 4 Network Access, October 20143GPP2 C.S0015-A v1.0  Short Message Service for spread spectrum systemsTable 28:  Standards of GCF type approval3GPP TS 51.010-1 Digital cellular telecommunications system (Release 10); Mobile Station (MS) conformance specification;GCF-CC V3.58  Global Certification Forum - Certification CriteriaTable 29:  Requirements of qualityIEC 60068 Environmental testingDIN EN 60529 IP codes
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description5.1 Directives and Standards98ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 94 of 106Table 31:  Toxic or hazardous substances or elements with defined concentration limitsTable 30:  Standards of the Ministry of Information Industry of the People’s Republic of ChinaSJ/T 11363-2006  “Requirements for Concentration Limits for Certain Hazardous Sub-stances in Electronic Information Products” (2006-06).SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic Information Products” (2006-06).According to the “Chinese Administration on the Control of Pollution caused by Electronic Information Products” (ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Gemalto M2M Hardware Interface Description.Please see Table 31 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description5.2 SAR requirements specific to portable mobiles98ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 95 of 1065.2 SAR requirements specific to portable mobilesMobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable ELS31-VA/ELS51-VA based applica-tions to be evaluated and approved for compliance with national and/or international regula-tions. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US marketsES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in thefrequency range 30MHz - 6GHz Please note that SAR requirements are specific only for portable devices and not for mobile devices as defined below:• Portable device:A portable device is defined as a transmitting device designed to be used so that the radi-ating structure(s) of the device is/are within 20 centimeters of the body of the user.• Mobile device:A mobile device is defined as a transmitting device designed to be used in other than fixedlocations and to generally be used in such a way that a separation distance of at least 20centimeters is normally maintained between the transmitter's radiating structure(s) and thebody of the user or nearby persons. In this context, the term ''fixed location'' means that thedevice is physically secured at one location and is not able to be easily moved to anotherlocation.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description5.3 Reference Equipment for Type Approval98ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 96 of 1065.3 Reference Equipment for Type ApprovalThe Gemalto M2M reference setup submitted to type approve ELS31-VA/ELS51-VA (including a special approval adapter for the DSB75) is shown in the following figure1:Figure 56:  Reference equipment for Type Approval1.  For RF performance tests a mini-SMT/U.FL to SMA adapter with attached 6dB coaxial attenuator is cho-sen to connect the evaluation module directly to the GSM/UMTS test equipment instead of employingthe SMA antenna connectors on the ELS31-VA/ELS51-VA-DSB75 adapter as shown in Figure 56. Thefollowing products are recommended: Hirose SMA-Jack/U.FL-Plug conversion adapter HRMJ-U.FLP(40)(for details see see http://www.hirose-connectors.com/ or http://www.farnell.com/Aeroflex Weinschel Fixed Coaxial Attenuator Model 3T/4T (for details see http://www.aeroflex.com/ams/weinschel/pdfiles/wmod3&4T.pdf)AntennaGSM / GPRS / UMTS Antenna with 1m cable ASC0PCPower  supplyLTEBase stationDSB75ASC1USBApproval adapter for DSB75SMAEvaluation moduleELS31ELS51USBEvaluation moduleELS31ELS51SIM cardTop viewBottom view
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description5.4 Compliance with FCC and IC Rules and Regulations98ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 97 of 1065.4 Compliance with FCC and IC Rules and RegulationsThe Equipment Authorization Certification for the Gemalto M2M reference application de-scribed in Section 5.3 will be registered under the following identifiers:• ELS31-VA:FCC Identifier: QIPELS31-VA Industry Canada Certification Number: 7830A-ELS31VA Granted to Gemalto M2M GmbH • ELS51-VA:FCC Identifier: QIPELS51-VA (not yet granted)Industry Canada Certification Number: 7830A-ELS51VA (not yet granted)Granted to Gemalto M2M GmbH Manufacturers of mobile or fixed devices incorporating ELS31-VA/ELS51-VA modules are au-thorized to use the FCC Grants and Industry Canada Certificates of the ELS31-VA/ELS51-VA modules for their own final products according to the conditions referenced in these docu-ments. In this case, an FCC/ IC label of the module shall be visible from the outside, or the host device shall bear a second label stating "Contains FCC ID: QIPELS31-VA" / "Contains FCC ID: QIPELS51-VA", and accordingly “Contains IC: 7830A-ELS31VA“ / “Contains IC: 7830A-ELS51-VA“. The integration is limited to fixed or mobile categorized host devices, where a separation distance between the antenna and any person of min. 20cm can be assured during normal op-erating conditions.For mobile and fixed operation configurations the antenna gain, including cable loss, must not exceed the limits in the following Table 28 for FCC and IC.IMPORTANT: Manufacturers of portable applications incorporating ELS31-VA/ELS51-VA modules are re-quired to have their final product certified and apply for their own FCC Grant and Industry Can-ada Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles (see Section 5.2 for detail).Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with Industry Canada license-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful inter-ference in a residential installation. This equipment generates, uses and can radiate radio fre-quency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference Table 32:  Antenna gain limits for FCC and ICOperating band FCC limit IC limit UnitMaximum gain in lower operating bands with f< 1GHz(LTE Bd13)10.4 7.4 dBiMaximum gain in higher operating bands with f=1700MHz(LTE Bd4)6.5 6.5 dBi
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description5.4 Compliance with FCC and IC Rules and Regulations98ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 98 of 106will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver isconnected.• Consult the dealer or an experienced radio/TV technician for help.This Class B digital apparatus complies with Canadian ICES-003.If Canadian approval is requested for devices incorporating ELS31VA / ELS51-VA modules the above note will have to be provided in the English and French language in the final user docu-mentation. Manufacturers/OEM Integrators must ensure that the final user documentation does not contain any information on how to install or remove the module from the final product.Notes (IC): (EN) This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Opera-tion is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.(FR) Cet appareil numérique de classe B est conforme aux normes canadiennes ICES-003 et RSS-210. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interférence et (2) cet appareil doit accepter toute interférence, notamment les interférences qui peuvent affecter son fonctionnement.(EN) Radio frequency (RF) Exposure InformationThe radiated output power of the Wireless Device is below the Industry Canada (IC) radio fre-quency exposure limits. The Wireless Device should be used in such a manner such that the potential for human contact during normal operation is minimized.This device has also been evaluated and shown compliant with the IC RF Exposure limits un-der mobile exposure conditions (antennas at least 20cm from a person‘s body).(FR) Informations concernant l'exposltion aux fréquences radio (RF)La puissance de sortie émise par l'appareil de sans fiI est inférieure à la limite d'exposition aux fréquences radio d‘Industry Canada (IC). Utilisez l'appareil de sans fil de façon à minimiser les contacts humains lors du fonctionnement normal.Ce périphérique a également été évalué et démontré conforme aux limites d'exposition aux RF d'IC dans des conditions d'exposition à des appareils mobiles (les antennes se situent à moins de 20cm du corps d'une personne).
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description6 Document Information103ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 99 of 1066 Document Information6.1 Revision HistoryNew document: "Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description" v01.000Chapter What is new-- Initial document setup.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description6.2 Related Documents103ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 100 of 1066.2 Related Documents[1] ELS31-VA/ELS51-VA AT Command Set[2] ELS31-VA/ELS51-VA Release Note[3] Application Note 40: Thermal Solutions[4] Application Note 48: SMT Module Integration[5] Universal Serial Bus Specification Revision 2.0, April 27, 20006.3 Terms and AbbreviationsAbbreviation DescriptionADC Analog-to-digital converterAGC Automatic Gain ControlANSI American National Standards InstituteARFCN Absolute Radio Frequency Channel NumberARP Antenna Reference PointASC0/ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of the moduleB Thermistor ConstantBER Bit Error RateBTS Base Transceiver StationCB or CBM Cell Broadcast MessageCE Conformité Européene (European Conformity)CHAP Challenge Handshake Authentication ProtocolCPU Central Processing UnitCS Coding SchemeCSD Circuit Switched DataCTS Clear to SendDAC Digital-to-Analog ConverterDAI Digital Audio InterfacedBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-lawDCE Data Communication Equipment (typically modems, e.g. Gemalto M2M module)DCS 1800 Digital Cellular System, also referred to as PCNDRX Discontinuous ReceptionDSB Development Support BoxDSP Digital Signal ProcessorDSR Data Set ReadyDTE Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM application)
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description6.3 Terms and Abbreviations103ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 101 of 106DTR Data Terminal ReadyDTX Discontinuous TransmissionEFR Enhanced Full RateEGSM Enhanced GSMEIRP Equivalent Isotropic Radiated PowerEMC Electromagnetic CompatibilityERP Effective Radiated PowerESD Electrostatic DischargeETS European Telecommunication StandardFCC Federal Communications Commission (U.S.)FDMA Frequency Division Multiple AccessFR Full RateGMSK Gaussian Minimum Shift KeyingGPIO General Purpose Input/OutputGPRS General Packet Radio ServiceGSM Global Standard for Mobile CommunicationsHiZ High ImpedanceHR Half RateHSIC High-Speed Inter-ChipI/O Input/OutputIC Integrated CircuitIMEI International Mobile Equipment IdentityISO International Standards OrganizationITU International Telecommunications Unionkbps kbits per secondLED Light Emitting DiodeLi-Ion/Li+ Lithium-IonLi battery Rechargeable Lithium Ion or Lithium Polymer batteryLTE Long Term EvolutionMbps Mbits per secondMMI Man Machine InterfaceMO Mobile OriginatedMS Mobile Station (GSM module), also referred to as TEMSISDN Mobile Station International ISDN numberMT Mobile TerminatedNTC Negative Temperature CoefficientOEM Original Equipment ManufacturerAbbreviation Description
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description6.3 Terms and Abbreviations103ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 102 of 106PA Power AmplifierPAP Password Authentication ProtocolPBCCH Packet Switched Broadcast Control ChannelPCB Printed Circuit BoardPCL Power Control LevelPCM Pulse Code ModulationPCN Personal Communications Network, also referred to as DCS 1800PCS Personal Communication System, also referred to as GSM 1900PLL Phase Locked LoopPPP Point-to-point protocolPSK Phase Shift KeyingPSU Power Supply UnitR&TTE Radio and Telecommunication Terminal EquipmentRAM Random Access MemoryRF Radio FrequencyRLS Radio Link StabilityRoHS Restriction of the use of certain hazardous substances in electrical and electronic equipment. RTS Request to SendRx Receive DirectionSAR Specific Absorption RateSAW Surface Acoustic WaveSDIO Secure Digital Input OutputSELV Safety Extra Low VoltageSIM Subscriber Identification ModuleSMD Surface Mount DeviceSMS Short Message ServiceSMT Surface Mount TechnologySRAM Static Random Access MemoryTA Terminal adapter (e.g. GSM module)TDMA Time Division Multiple AccessTE Terminal Equipment, also referred to as DTETLS Transport Layer SecurityTx Transmit DirectionUART Universal asynchronous receiver-transmitterURC Unsolicited Result CodeUSSD Unstructured Supplementary Service DataVSWR Voltage Standing Wave RatioAbbreviation Description
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description6.4 Safety Precaution Notes103ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 103 of 1066.4 Safety Precaution NotesThe following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating ELS31-VA/ELS51-VA. Manu-facturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manu-facture and intended use of the product. Gemalto M2M assumes no liability for customer’s fail-ure to comply with these precautions.When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hear-ing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both.Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any elec-trical equipment in potentially explosive atmospheres can constitute a safety hazard.Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger.Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-ing a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or opera-tion can constitute a safety hazard.IMPORTANT!Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call.Some networks require that a valid SIM card be properly inserted in the cellular termi-nal or mobile.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description7 Appendix105ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 104 of 1067 Appendix7.1 List of Parts and AccessoriesTable 33:  List of parts and accessoriesDescription Supplier Ordering informationELS31-VA Gemalto M2M Standard module Gemalto M2M IMEI:Packaging unit (ordering) number:L30960-N4580-A300Module label number:L30960-N4580-A300-111. Note: At the discretion of Gemalto M2M, module label information can either be laser engraved on the module’s shielding or be printed on a label adhered to the module’s shielding.ELS51-VA Gemalto M2M Standard module Gemalto M2M IMEI:Packaging unit (ordering) number:L30960-N4590-A300Module label number:L30960-N4590-A300-11ELS31-VA Evaluation Mod-uleGemalto M2M Ordering number: L30960-N4581-A300ELS51-VA Evaluation Mod-uleGemalto M2M Ordering number: L30960-N4591-A300DSB75 Evaluation Kit Gemalto M2M Ordering number: L36880-N8811-A100DSB MiniCompact Evaluation BoardGemalto M2M Ordering number: L30960-N0030-A100Starter Kit B80 Gemalto M2M Ordering Number L30960-N0040-A100Multi-Adapter R1 for mount-ing ELS31-VA/ELS51-VA evaluation modules onto DSB75Gemalto M2M Ordering number: L30960-N0010-A100Approval adapter for mount-ing ELS31-VA/ELS51-VA evaluation modules onto DSB75Gemalto M2M Ordering number: L30960-N2301-A100SIM card holder incl. push button ejector and slide-in trayMolex Ordering numbers:  91228 91236Sales contacts are listed in Table 34.
Cinterion® ELS31-VA/ELS51-VA Hardware Interface Description7.1 List of Parts and Accessories105ELS31-VA_ELS51-VA_HID_v01.000 2017-01-04Confidential / PreliminaryPage 105 of 106Table 34:  Molex sales contacts (subject to change)MolexFor further information please click:http://www.molex.comMolex Deutschland GmbHOtto-Hahn-Str. 1b69190 WalldorfGermanyPhone: +49-6227-3091-0Fax: +49-6227-3091-8100Email:  mxgermany@molex.comAmerican HeadquartersLisle, Illinois 60532U.S.A.Phone: +1-800-78MOLEXFax: +1-630-969-1352Molex China DistributorsBeijing, Room 1311, Tower B, COFCO PlazaNo. 8, Jian Guo Men Nei Street, 100005BeijingP.R. ChinaPhone:  +86-10-6526-9628 Fax:  +86-10-6526-9730Molex Singapore Pte. Ltd.110, International RoadJurong Town, Singapore 629174Phone:  +65-6-268-6868Fax: +65-6-265-6044Molex Japan Co. Ltd.1-5-4 Fukami-Higashi,Yamato-City,Kanagawa, 242-8585 JapanPhone:  +81-46-265-2325Fax: +81-46-265-2365
106 M2M.GEMALTO.COMAbout GemaltoGemalto (Euronext NL0000400653 GTO) is the world leader in digital security with 2015 annualrevenues of €3.1 billion and blue-chip customers in over 180 countries. Our 14,000+ employees operate out of 118 offices, 45 personalization and data centers, and 27 research and software development centers located in 49 countries. We are at the heart of the rapidly evolving digital society. Billions of people worldwide increasinglywant the freedom to communicate, travel, shop, bank, entertain and work - anytime, everywhere - in ways that are enjoyable and safe. Gemalto delivers on their expanding needs for personalmobile services, payment security, authenticated cloud access, identity and privacy protection,eHealthcare and eGovernment efficiency, convenient ticketing and dependable machine-to-machine (M2M) applications.Gemalto develops secure embedded software and secure products which we design and personalize. Our platforms and services manage these secure products, the confidential data they contain and the trusted end-user services they enable. Our innovations enable our clients to offertrusted and convenient digital services to billions of individuals.Gemalto thrives with the growing number of people using its solutions to interact with the digitaland wireless world.For more information please visitm2m.gemalto.com, www.facebook.com/gemalto, or Follow@gemaltom2m on twitter.Gemalto M2M GmbHWerinherstrasse 8181541 MunichGermany© Gemalto 2017. All rights reserved. Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries. April 2013

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