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GEMALTO.COM/M2MCinterion® ELS81-USHardware Interface DescriptionVersion: 01.004DocId: els81-us_hid_v01.004

Cinterion® ELS81-US Hardware Interface Description Contents107els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 3 of 107Contents1 Introduction ................................................................................................................. 91.1 Key Features at a Glance .................................................................................. 91.2 ELS81-US System Overview ........................................................................... 121.3 Circuit Concept ................................................................................................ 132 Interface Characteristics .......................................................................................... 152.1 Application Interface ........................................................................................ 152.1.1 Pad Assignment.................................................................................. 152.1.2 Signal Properties................................................................................. 172.1.2.1 Absolute Maximum Ratings ................................................ 232.1.3 USB Interface...................................................................................... 242.1.3.1 Reducing Power Consumption............................................ 252.1.4 Serial Interface ASC0 ......................................................................... 262.1.5 Serial Interface ASC1 ......................................................................... 282.1.6 UICC/SIM/USIM Interface................................................................... 302.1.6.1 Enhanced ESD Protection for SIM Interface....................... 322.1.7 RTC Backup....................................................................................... 332.1.8 GPIO Interface .................................................................................... 342.1.9 I2C Interface ........................................................................................ 362.1.10 SPI Interface ....................................................................................... 382.1.11 PWM Interfaces .................................................................................. 392.1.12 Pulse Counter ..................................................................................... 392.1.13 Control Signals.................................................................................... 392.1.13.1 Status LED .......................................................................... 392.1.13.2 Power Indication Circuit ...................................................... 402.1.13.3 Host Wakeup....................................................................... 402.1.13.4 Fast Shutdown .................................................................... 412.2 RF Antenna Interface....................................................................................... 422.2.1 Antenna Interface Specifications ........................................................ 422.2.2 Antenna Installation ............................................................................ 442.2.3 RF Line Routing Design...................................................................... 452.2.3.1 Line Arrangement Examples ............................................... 452.2.3.2 Routing Example................................................................. 502.3 Sample Application .......................................................................................... 512.3.1 Sample Level Conversion Circuit........................................................ 533 Operating Characteristics ........................................................................................ 543.1 Operating Modes ............................................................................................. 543.2 Power Up/Power Down Scenarios................................................................... 553.2.1 Turn on ELS81-US.............................................................................. 553.2.1.1 Connecting ELS81-US BATT+ Lines .................................. 553.2.1.2 Switch on ELS81-US Using ON Signal ............................... 573.2.1.3 Automatic Power On ........................................................... 583.2.2 Restart ELS81-US .............................................................................. 59

Cinterion® ELS81-US Hardware Interface Description Contents107els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 5 of 1075 Regulatory and Type Approval Information ........................................................... 935.1 Directives and Standards................................................................................. 935.2 SAR requirements specific to portable mobiles ............................................... 965.3 Reference Equipment for Type Approval......................................................... 975.4 Compliance with FCC and IC Rules and Regulations ..................................... 986 Document Information............................................................................................ 1006.1 Revision History ............................................................................................. 1006.2 Related Documents ....................................................................................... 1006.3 Terms and Abbreviations ............................................................................... 1006.4 Safety Precaution Notes ................................................................................ 1047 Appendix.................................................................................................................. 1057.1 List of Parts and Accessories......................................................................... 105

Cinterion® ELS81-US Hardware Interface Description Tables118els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 6 of 107TablesTable 1: Pad assignments............................................................................................ 16Table 2: Signal properties ............................................................................................ 17Table 3: Absolute maximum ratings............................................................................. 23Table 4: Signals of the SIM interface (SMT application interface) ............................... 30Table 5: GPIO lines and possible alternative assignment............................................ 34Table 6: Host wakeup lines.......................................................................................... 40Table 7: Return loss in the active band........................................................................ 42Table 8: RF Antenna interface UMTS/LTE (at operating temperature range) ............. 42Table 9: Overview of operating modes ........................................................................ 54Table 10: Signal states................................................................................................... 61Table 11: Temperature dependent behavior.................................................................. 64Table 12: Voltage supply ratings.................................................................................... 69Table 13: Current consumption ratings (typical ratings to be confirmed)....................... 70Table 14: Board temperature ......................................................................................... 73Table 15: Electrostatic values ........................................................................................ 74Table 16: EMI measures on the application interface.................................................... 76Table 17: Summary of reliability test conditions............................................................. 77Table 18: Reflow temperature ratings............................................................................ 84Table 19: Storage conditions ......................................................................................... 85Table 20: Directives ....................................................................................................... 93Table 21: Standards of North American type approval .................................................. 93Table 22: Standards of European type approval............................................................ 93Table 23: Requirements of quality ................................................................................. 94Table 24: Standards of the Ministry of Information Industry of the People’s Republic of China............................................................................ 94Table 25: Toxic or hazardous substances or elements with defined concentration limits ........................................................................................ 95Table 26: List of parts and accessories........................................................................ 105Table 27: Molex sales contacts (subject to change) .................................................... 106

Cinterion® ELS81-US Hardware Interface Description Figures118els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 8 of 107Figure 51: Moisture barrier bag (MBB) with imprint......................................................... 89Figure 52: Moisture Sensitivity Label .............................................................................. 90Figure 53: Humidity Indicator Card - HIC ........................................................................ 91Figure 54: Tray dimensions............................................................................................. 92Figure 55: Reference equipment for Type Approval ....................................................... 97

Cinterion® ELS81-US Hardware Interface Description1 Introduction14els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 9 of 1071 IntroductionThis document1 describes the hardware of the Cinterion® ELS81-US module. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components.1.1 Key Features at a Glance1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-mentation delivered with your Gemalto M2M product.Feature ImplementationGeneralFrequency bands UMTS/HSPA+: Triple band, 850 (BdV) / AWS (BdIV) / 1900MHz (BdII)LTE: Quad band, 700 (Bd12) / 850 (Bd5) / AWS (Bd4) / 1900MHz (Bd2)Output power (according to Release 99)Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdIIClass 3 (+24dBm +1/-3dB) for UMTS AWS, WCDMA FDD BdIVClass 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdVOutput power (according to Release 8)Class 3 (+23dBm ±2dB) for LTE 1900,LTE FDD Bd2Class 3 (+23dBm ±2dB) for LTE AWS, LTE FDD Bd4Class 3 (+23dBm ±2dB) for LTE 850, LTE FDD Bd5Class 3 (+23dBm ±2dB) for LTE 700, LTE FDD Bd12Power supply 3.0V to 4.5VOperating temperature (board temperature)Normal operation: -30°C to +85°CExtended operation: -40°C to +90°CPhysical Dimensions: 27.6mm x 25.4mm x 2.2mmWeight: approx. 4gRoHS All hardware components fully compliant with EU RoHS DirectiveLTE features3GPP Release 9 UE CAT 4 supportedDL 150Mbps, UL 50MbpsHSPA features3GPP Release 8 DL 7.2Mbps, UL 5.7MbpsHSDPA Cat.8 / HSUPA Cat.6 data ratesCompressed mode (CM) supported according to 3GPP TS25.212UMTS features3GPP Release 4 PS data rate – 384 kbps DL / 384 kbps ULCS data rate – 64 kbps DL / 64 kbps UL

Cinterion® ELS81-US Hardware Interface Description1.1 Key Features at a Glance14els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 11 of 107GPIO interface 22 GPIO lines comprising: 13 lines shared with ASC0, ASC1 and SPI lines, with network status indica-tion, PWM functionality, fast shutdown and pulse counter5 GPIO lines not sharedI2C interface Supports I2C serial interfaceSPI interface Serial peripheral interface, shared with GPIO linesAntenna interface pads 50. UMTS/LTE main antenna, UMTS/LTE Rx Diversity antennaPower on/off, ResetPower on/off Switch-on by hardware signal ONSwitch-off by AT command Switch off by hardware signal FST_SHDN instead of AT commandAutomatic switch-off in case of critical temperature or voltage conditions Reset Orderly shutdown and reset by AT commandEmergency reset by hardware signal EMERG_RSTSpecial featuresReal time clock Timer functions via AT commandsEvaluation kitEvaluation module ELS81-US module soldered onto a dedicated PCB that can be connected to an adapter in order to be mounted onto the DSB75.DSB75 DSB75 Development Support Board designed to test and type approve Gemalto M2M modules and provide a sample configuration for application engineering. A special adapter is required to connect the ELS81-US evalu-ation module to the DSB75.1. HTTP/SecureConnection over SSL version 3.0 and TLS versions 1.0, 1.1, and 1.2 are supported. For details please refer to Java User’s Guide for Cinterion ® ELS81-US. Feature Implementation

Cinterion® ELS81-US Hardware Interface Description1.2 ELS81-US System Overview14els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 12 of 1071.2 ELS81-US System OverviewFigure 1: ELS81-US system overviewGPIO interfaceI2CUSBASC0 linesASC1/SPICONTROLRTCPOWERRx diversity antenna(UMTS/LTE)ModuleSIM interface(with SIM detection)SIM cardApplicationPower supplyBackup supplyEmergency resetONSerial interface/SPI interfaceSerial modem interface linesI2CGPIO3445291112USBRx diversity1Status LED1DAC (PWM) PWM2Fast shutdown Fast shutdown11COUNTER Pulse counter1ASC0 linesSerial modem interface lines/SPI interface4Main antenna(UMTS/LTE)Main antenna1

Cinterion® ELS81-US Hardware Interface Description1.3 Circuit Concept14els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 13 of 1071.3 Circuit ConceptFigure 2 and Figure 3 show block diagrams of the ELS81-US module and illustrate the major functional components:Figure 2: ELS81-US block diagramSD1 SD2SD2 LDOsPMULDOsONReset_BBSD3I2CDATI2CCLKUSBGPIOSIMCCINLPDDR2SDRAMFLASHVDDVDDADQ0 ~ ADQ15DDR_CA _0~DDR _CA _9DDR _DQ_0~DDR _DQ_15ControlControlCCINSIMGPIOASC0USBI2CON circuitONEMERG _RSTBATT+BBRX/TXRF controlV180Baseband controller and Power managementUSIF1/GPIOFST_SHDWNASC1/GPIO/SPI USIF3

Cinterion® ELS81-US Hardware Interface Description1.3 Circuit Concept14els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 14 of 107Figure 3: ELS81-US RF section block diagramLTE / UMTSRF transceiverSKY77622SKY13525SKY13525Band2 SAW FilterBand4 SAW FilterBand5 SAW FilterBand12 SAW FilterDiversity AntennaBand2 DuplexerBand4 DuplexerBand5 DuplexerBand12 DuplexerAntennaCouplerB2_OUTB4_OUTB5_OUTB12_OUT4G_HB_IN2G/3G_HB_IN4G_LB_IN2G/3G_LB_INTQ_HTP_HTQ_LTP_LRX_M1RX_M1XRX_H4RX_H4XRX_L1RX_L1XRX_L3RX_L3X4G_HB_IN4G_HB_IN4G_HB_IN4G_HB_INTRX4TRX6TRX5TRX2TRX2TRX1TRX3TRX5PA DCDCSKY87000BATT+RFFBR_RF2MAIN_FWDMIPI26MHzRX/TXBATT+BBV180RF control

Cinterion® ELS81-US Hardware Interface Description2 Interface Characteristics53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 15 of 1072 Interface CharacteristicsELS81-US is equipped with an SMT application interface that connects to the external applica-tion. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface2.1.1 Pad Assignment The SMT application interface on the ELS81-US provides connecting pads to integrate themodule into external applications. Figure 4 shows the connecting pads’ numbering plan, thefollowing Table 1 lists the pads’ assignments.Figure 4: Numbering plan for connecting pads (bottom view) Supply pads: BATT+Control padsGND padsASC0 pads Combined GPIO/ASC1/SPI padsSIM padsI2C padsSupply pads: OtherCombined GPIO/Control pads(LED, PWM, COUNTER, FST_SHDN)USB padsGPIO pads2182172162152142132122112102092082072062052042032022013332313029282726252423222120535455565758596061626364656622322422522622722822923023123223323423523623723823924067 68 69 70 71 72 7374 75 76 77 78 79 8093 94 95 96 97 98 99100 101 102 103 104 105 10685 8689 9081 8287 8891 9283 84243244241242222221220219252245250251249248247246RF antenna padsDo not use Not connectedReservedCombined GPIO/ASC0/SPI padsADC pad

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 16 of 107Signal pads that are not used should not be connected to an external application.Please note that the reference voltages listed in Table 2 are the values measured directly onthe ELS81-US module. They do not apply to the accessories connected.Table 1: Pad assignmentsPad no. Signal name Pad no. Signal name Pad no. Signal name201 Not connected 24 GPIO22 235 USB_DN202 Not connected 25 GPIO21 236 Not connected203 GND 26 GPIO23 237 Not connected204 BATT+BB 27 I2CDAT 238 GND205 GND 28 I2CCLK 239 GPIO5/LED206 ADC1 29 GPIO17/TXD1/MISO 240 GPIO6/PWM2207 ON 30 GPIO16/RXD1/MOSI 241 GPIO7/PWM1208 GND 31 GPIO18/RTS1 242 GPIO8/COUNTER209 V180 32 GPIO19/CTS1/SPI_CS 53 BATT+RF210 RXD0 33 EMERG_RST 54 GND211 CTS0 221 GPIO12 55 GND212 TXD0 222 GPIO11 56 ANT_DRX213 GPIO24/RING0 223 GND 57 GND214 RTS0 224 Not connected 58 GND215 VDDLP 225 GND 59 ANT_MAIN216 CCRST 226 Not connected 60 GND217 CCIN 227 GND 61 GND218 CCIO 228 Not connected 62 GND219 GPIO14 229 GPIO4/FST_SHDN 63 GND220 GPIO13 230 GPIO3/DSR0/SPI_CLK 64 Not connected20 CCVCC 231 GPIO2/DCD0 65 Not connected21 CCCLK 232 GPIO1/DTR0 66 Not connected22 VCORE 233 VUSB 243 Not connected23 GPIO20 234 USB_DP 244 GPIO15Centrally located pads67 Not connected 83 GND 99 GND68 Not connected 84 GND 100 GND69 Not connected 85 GND 101 GND70 Not connected 86 GND 102 GND71 Not connected 87 Not connected 103 GND72 Not connected 88 GND 104 Not connected73 Not connected 89 GND 105 Not connected74 Do not use 90 GND 106 Not connected75 Do not use 91 Not connected 245 GND76 Not connected 92 GND 246 Not connected77 Not connected 93 GND 247 Not connected78 Not connected 94 GND 248 Not connected79 Not connected 95 GND 249 Not connected80 Not connected 96 GND 250 GND81 GND 97 GND 251 GND82 GND 98 GND 252 GND

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 17 of 1072.1.2 Signal PropertiesTable 2: Signal propertiesFunction Signal name IO Signal form and level CommentPower supplyBATT+BBBATT+RFIWCDMA activated:VImax = 4.5VVInorm = 3.8VVImin = 3.0V during Transmit active.Imax = 900mA during TxLTE activated:VImax = 4.5VVInorm = 3.8VVImin = 3.0V during Transmit active.Lines of BATT+ and GND must be connected in parallel for supply pur-poses because higher peak currents may occur.Minimum voltage must not fall below 3.0V includ-ing drop, ripple, spikes and not rise above 4.5V.BATT+BB and BATT+RF require an ultra low ESR capacitor:BATT+BB --> 150µF BATT+RF --> 150µF If using Multilayer Ceramic Chip Capacitors (MLCC) please take DC-bias into account. Note that minimum ESR value is advised at <70m. Power supplyGND Ground Application GroundExternal supply voltage V180 O Normal operation:VOnorm = 1.80V ±3%IOmax = -10mASLEEP mode Operation:VOSleep = 1.80V ±5%IOmax = -10mACLmax = 100µFV180 should be used to supply level shifters at the interfaces or to supply external application cir-cuits.VCORE and V180 may be used for the power indication circuit.Vcore and V180 are sensitive against back-powering by other sig-nals. While switched off these voltage domains must have <0.2V.If unused keep lines open.VCORE O VOnorm = 1.2V ±2.5%IOmax = -10mACLmax = 100nFSLEEP mode Operation:VOSleep = 0.90V...1.2V ±4%IOmax = -10mAIgnition ON1IVIHmax = 5V tolerantVIHmin = 1.3VVILmax = 0.5VSlew rate < 1msON ___|~~~~ This signal switches the module on, and is rising edge sensitive triggered.Internal pull down value for this signal is 100k.

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 18 of 107Emer-gency restartEMERG_RST I RI  1k, CI  1nFVOHmax = VDDLP maxVIHmin = 1.35VVILmax = 0.3V at ~200µA~~|___|~~ low impulse width > 10msThis line must be driven low by an open drain or open collector driver con-nected to GND.If unused keep line open.RTC backupVDDLP I/O VOnorm = 1.8V ±5%IOmax = -25mAVImax = 1.9VVImin = 1.0VIItyp < 1µAIt is recommended to use a serial resistor between VDDLP and a possible capacitor (bigger than 1µF). If unused keep line open.USB VUSB_IN I VImin = 3VVImax = 5.25VActive and suspend current: Imax < 100µAAll electrical characteris-tics according to USB Implementers' Forum, USB 2.0 Specification.If unused keep lines open.USB_DN I/O Full and high speed signal characteris-tics according USB 2.0 Specification.USB_DPSerial Interface ASC0RXD0 O VOLmax = 0.25V at I = 1mAVOHmin = 1.55V at I = -1mAVOHmax = 1.85VIf unused keep lines open.Note that some ASC0 lines are originally avail-able as GPIO lines. If configured as ASC0 lines, the GPIO lines are assigned as follows:GPIO1 --> DTR0GPIO2 --> DCD0GPIO3 --> DSR0GPIO24 --> RING0The DSR0 line is also shared with the SPI inter-face‘s SPI_CLK signal.Note that DCD0/GPIO2 must not be driven low during startupCTS0 ODSR0 ODCD0 ORING0 OTXD0 I VILmax = 0.35VVIHmin = 1.30V VIHmax = 1.85VRTS0 I Pull down resistor activeVILmax = 0.35V at > 50µAVIHmin = 1.30V at < 240µAVIHmax = 1.85V at < 240µADTR0 I Pull up resistor activeVILmax = 0.35V at < -200µAVIHmin = 1.30V at > -50µAVIHmax = 1.85VTable 2: Signal propertiesFunction Signal name IO Signal form and level Comment

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 19 of 107Serial Interface ASC1RXD1 O VOLmax = 0.25V at I = 1mAVOHmin = 1.55V at I = -1mAVOHmax = 1.85VVILmax = 0.35VVIHmin = 1.30V VIHmax = 1.85VIf unused keep line open.Note that the ASC1 inter-face lines are originally available as GPIO lines. If configured as ASC1 lines, the GPIO lines are assigned as follows:GPIO16 --> RXD1GPIO17 --> TXD1GPIO18 --> RTS1GPIO19 --> CTS1TXD1 IRTS1 ICTS1 OSIM card detectionCCIN I RI  110kVIHmin = 1.45V at I = 15µA, VIHmax= 1.9VVILmax = 0.3VCCIN = High, SIM card inserted. For details please refer to Section 2.1.6.If unused keep line open.3V SIM Card Inter-faceCCRST O VOLmax = 0.30V at I = 1mAVOHmin = 2.45V at I = -1mAVOHmax = 2.90VMaximum cable length or copper track to SIM card holder should not exceed 100mm.CCIO I/O VILmax = 0.50VVIHmin = 2.05VVIHmax = 2.90VVOLmax = 0.25V at I = 1mAVOHmin = 2.50V at I = -1mAVOHmax = 2.90VCCCLK O VOLmax = 0.25V at I = 1mAVOHmin = 2.40V at I = -1mAVOHmax = 2.90VCCVCC O VOmin= 2.70VVOtyp = 2.90VVOmax = 3.30VIOmax = -30mATable 2: Signal propertiesFunction Signal name IO Signal form and level Comment

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 20 of 1071.8V SIM Card Inter-faceCCRST O VOLmax = 0.25V at I = 1mAVOHmin = 1.45V at I = -1mAVOHmax = 1.90VMaximum cable length or copper track to SIM card holder should not exceed 100mm.CCIO I/O VILmax = 0.35VVIHmin = 1.25VVIHmax = 1.85VVOLmax = 0.25V at I = 1mAVOHmin = 1.50V at I = -1mAVOHmax = 1.85VCCCLK O VOLmax = 0.25V at I = 1mAVOHmin = 1.50V at I = -1mAVOHmax = 1.85VCCVCC O VOmin = 1.75V VOtyp = 1.80VVOmax = 1.85VIOmax = -30mAI2C I2CCLK IO Open drain IOVOLmin = 0.35V at Imax = 4mA (Imax = Imax external + I pull-up)VOHmax = 1.85VR external pull up min = 560VILmax = 0.35VVIHmin = 1.3VVIHmax = 1.85VAccording to the I2C Bus Specification Version 2.1 for the fast mode a rise time of max. 300ns is per-mitted. There is also a maximum VOL=0.4V at 3mA specified.The value of the pull-up depends on the capaci-tive load of the whole sys-tem (I2C Slave + lines). The maximum sink cur-rent of I2CDAT and I2CCLK is 4mA.I2C interface of the mod-ule already has internal 1KOhm pull up resistor to V180 inside the module. Please take this into con-sideration during applica-tion design. If lines are unused keep lines open.I2CDAT IOTable 2: Signal propertiesFunction Signal name IO Signal form and level Comment

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 21 of 107SPI SPI_CLK O VOLmax = 0.25V at I = 1mAVOHmin = 1.55V at I = -1mAVOHmax = 1.85VVILmax = 0.35VVIHmin = 1.30V VIHmax = 1.85VIf lines are unused keep lines open.Note that the SPI inter-face lines are originally available as GPIO lines. If configured as SPI lines, the GPIO lines are assigned as follows: GPIO3 --> SPI_CLKGPIO16 --> MOSIGPIO17 --> MISOGPIO19 --> SPI_CSMOSI OMISO ISPI_CS OGPIO interfaceGPIO1-GPIO3 IO VOLmax = 0.25V at I = 1mAVOHmin = 1.55V at I = -1mAVOHmax = 1.85VVILmax = 0.35VVIHmin = 1.30V VIHmax = 1.85VImax = ±5mAIf unused keep line open.Please note that most GPIO lines can be config-ured by AT command for alternative functions: GPIO1-GPIO3: ASC0 control lines DTR0, DCD0 and DSR0GPIO4: Fast shutdownGPIO5: Status LED lineGPIO6/GPIO7: PWMGPIO8: Pulse CounterGPIO16-GPIO19: ASC1 or SPIGPIO24: ASC0 control line RING0GPIO4 IOGPIO5 IOGPIO6 IOGPIO7 IOGPIO8 IOGPIO11-GPIO15IOGPIO16-GPIO19IOGPIO20-GPIO23IOGPIO24 IOFast shutdownFST_SHDN I VILmax = 0.35VVIHmin = 1.30V VIHmax = 1.85V~~|___|~~ low impulse width > 1msThis line must be driven low.If unused keep line open.Note that the fast shut-down line is originally available as GPIO line. If configured as fast shut-down, the GPIO line is assigned as follows:GPIO4 --> FST_SHDNStatus LED LED O VOLmax = 0.25V at I = 1mAVOHmin = 1.55V at I = -1mAVOHmax = 1.85VIf unused keep line open.Note that the LED line is originally available as GPIO line. If configured as LED line, the GPIO line is assigned as fol-lows: GPIO5 --> LEDTable 2: Signal propertiesFunction Signal name IO Signal form and level Comment

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 22 of 107PWM PWM1 O VOLmax = 0.25V at I = 1mAVOHmin = 1.55V at I = -1mAVOHmax = 1.85VIf unused keep lines open.Note that the PWM lines are originally available as GPIO lines. If configured as PWM lines, the GPIO lines are assigned as fol-lows: GPIO7 --> PWM1GPIO6 --> PWM2PWM2 OPulse counterCOUNTER I Internal up resistor activeVILmax = 0.35V at < -200µAVIHmin = 1.30V at > -50µAVIHmax = 1.85VIf unused keep line open.Note that the COUNTER line is originally available as GPIO line. If config-ured as COUNTER line, the GPIO line is assigned as follows: GPIO8 --> COUNTERADC (Analog-to-Digital Con-verter)ADC1 I RI = 1MVI = 0V ... 1.2V (valid range)VIH max = 1.2VResolution 1024 stepsTolerance 0.3%ADC can be used as input for external mea-surements.If unused keep line open.1. After the operating voltage is applied, it is required to wait at least 1 second to trigger the ON signal. Table 2: Signal propertiesFunction Signal name IO Signal form and level Comment

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 23 of 1072.1.2.1 Absolute Maximum RatingsThe absolute maximum ratings stated in Table 3 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to ELS81-US. Table 3: Absolute maximum ratings11. Positive noted current means current sourcing from ELS81-US. Negative noted current means current sourcing towards ELS81-US. Parameter Min Max UnitSupply voltage BATT+BB, BATT+RF -0.5 +5.5 VVoltage at all signal lines in Power Down mode -0.3 +0.3 VVoltage at digital lines in normal operation -0.2 V180 + 0.2 VVoltage at SIM/USIM interface, CCVCC in normal operation -0.5 +3.3 VVDDLP input voltage -0.15 2.0 VVoltage at ADC line in normal operation 0 1.2 VV180 in normal operation +1.7 +1.9 VCurrent at V180 in normal operation -0 +50 mAVCORE in normal operation +0.85 +1.25 VCurrent at VCORE in normal operation -0 +50 mAVoltage at ON signal -0.5 +6.5 VCurrent at single GPIO -5 +5 mACurrent at all GPIO -50 +50 mAVoltage at VCORE, V180 in power down mode -0.2 +0.2 V

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 24 of 1072.1.3 USB InterfaceELS81-US supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/s) compliant. The USB interface is primarily intended for use as command and data in-terface and for downloading firmware. The external application is responsible for supplying the VUSB_IN line. This line is used for ca-ble detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because ELS81-US is designed as a self-powered device compliant with the “Universal Se-rial Bus Specification Revision 2.0”1.Figure 5: USB circuitTo properly connect the module's USB interface to the external application, a USB 2.0 compat-ible connector and cable or hardware design is required. For more information on the USB re-lated signals see Table 2. Furthermore, the USB modem driver distributed with ELS81-US needs to be installed.1. The specification is ready for download on http://www.usb.org/developers/docs/VBUSDPDNVREG (3V075)BATT+USB_DP2)lin. reg.GNDModuleDetection only VUSB_INUSB part1)RING0Host wakeup1) All serial (including RS) and pull-up resistors for data lines are implemented.USB_DN2)2) If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case implement a differential impedance of 90 ohms for proper signal integrity.RSRSSMT

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 25 of 1072.1.3.1 Reducing Power ConsumptionWhile a USB connection is active, the module will never switch into SLEEP mode. Only if theUSB interface is in Suspended state or Detached (i.e., VUSB_IN = 0) is the module able toswitch into SLEEP mode thereby saving power. There are two possibilities to enable power re-duction mechanisms:• Recommended implementation of USB Suspend/Resume/Remote Wakeup:The USB host should be able to bring its USB interface into the Suspended state asdescribed in the “Universal Serial Bus Specification Revision 2.0“1. For this functionality towork, the VUSB_IN line should always be kept enabled. On incoming calls and other eventsELS81-US will then generate a Remote Wakeup request to resume the USB host controller.See also [5] (USB Specification Revision 2.0, Section 10.2.7, p.282):"If USB System wishes to place the bus in the Suspended state, it commands the Host Con-troller to stop all bus traffic, including SOFs. This causes all USB devices to enter the Sus-pended state. In this state, the USB System may enable the Host Controller to respond tobus wakeup events. This allows the Host Controller to respond to bus wakeup signaling torestart the host system."• Implementation for legacy USB applications not supporting USB Suspend/Resume:As an alternative to the regular USB suspend and resume mechanism it is possible toemploy the RING0 line to wake up the host application in case of incoming calls or eventssignalized by URCs while the USB interface is in Detached state (i.e., VUSB_IN = 0). Everywakeup event will force a new USB enumeration. Therefore, the external application has tocarefully consider the enumeration timings to avoid loosing any signalled events. For detailson this host wakeup functionality see Section 2.1.13.3. To prevent existing data call con-nections from being disconnected while the USB interface is in detached state (i.e., VUS-B_IN=0) it is possible to call AT&D0, thus ignoring the status of the DTR line (see also [1]).1. The specification is ready for download on http://www.usb.org/developers/docs/

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 26 of 1072.1.4 Serial Interface ASC0ELS81-US offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 2. For an illustration of the interface line’s startup behavior see Figure 7.ELS81-US is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:• Port TXD @ application sends data to the module’s TXD0 signal line• Port RXD @ application receives data from the module’s RXD0 signal lineFigure 6: Serial interface ASC0Features:• Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition,the modem control lines DTR0, DSR0, DCD0 and RING0.• The RING0 signal serves to indicate incoming calls and other types of URCs (UnsolicitedResult Code). It can also be used to send pulses to the host application, for example towake up the application from power saving state. • Configured for 8 data bits, no parity and 1 stop bit. • ASC0 can be operated at fixed bit rates from 1,200bps up to 921,600bps.• Autobauding supports bit rates from 1,200bps up to 230,400bps.• Supports RTS0/CTS0 hardware flow control. The hardware hand shake line RTS0 has aninternal pull down resistor causing a low level signal, if the line is not used and open.Although hardware flow control is recommended, this allows communication by using onlyRXD and TXD lines.• Wake up from SLEEP mode by RTS0 activation (high to low transition; see Section 3.3.2).Note: The ASC0 modem control lines DTR0, DCD0, DSR0 and RING0 are originally available as GPIO lines. If configured as ASC0 lines, these GPIO lines are assigned as follows: GPIO1 --> DTR0, GPIO2 --> DCD0, GPIO3 --> DSR0 and GPIO24 --> RING0. Also, DSR0 is shared with the SPI_CLK line of the SPI interface and may be configured as such. Configura-tion is done by AT command (see [1]). The configuration is non-volatile and becomes active after a module restart.

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 27 of 107The following figure shows the startup behavior of the asynchronous serial interface ASC0.For pull-up and pull-down values see Table 10.Figure 7: ASC0 startup behaviorNotes: During startup the DTR0 signal is driven active low for 500µs. It is recommended to provide a470 serial resistor for the DTR0 line to prevent shorts (high current flow).No data must be sent over the ASC0 interface before the interface is active and ready to re-ceive data (see Section 3.2.1). An external pull down to ground on the DCD0 line during the startup phase activates a specialmode for ELS81-US. In this special mode the AT command interface is not available and themodule may therefore no longer behave as expected.TXD0RXD0RTS0CTS0DTR0/GPIO1DSR0/GPIO3DCD0/GPIO2RING0/GPIO24ONEMERG_RSTPUPDPDPDPDPUPDPUPower supply activeStart upFirmware initializationCommand interface initializationInterface activeResetstateV180VCOREPDPUPUPUPDPDPD

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 28 of 1072.1.5 Serial Interface ASC1Four ELS81-US GPIO lines can be configured as ASC1 interface signals to provide a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 2. For an illustration of the interface line’s startup behavior see Figure 9. The ASC1 interface lines are originally available as GPIO lines. If configured as ASC1 lines, the GPIO lines are assigned as follows: GPIO16 --> RXD1, GPIO17 --> TXD1, GPIO18 --> RTS1 and GPIO19 --> CTS1. Configuration is done by AT command (see [1]: AT^SCFG). The configuration is non-volatile and becomes active after a module restart.ELS81-US is designed for use as a DCE. Based on the conventions for DCE-DTE connectionsit communicates with the customer application (DTE) using the following signals:• Port TXD @ application sends data to module’s TXD1 signal line• Port RXD @ application receives data from the module’s RXD1 signal lineFigure 8: Serial interface ASC1Features• Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware hand-shake. • On ASC1 no RING line is available.• Configured for 8 data bits, no parity and 1 or 2 stop bits.• ASC1 can be operated at fixed bit rates from 1,200 bps to 921,600 bps. • Autobauding supports bit rates from 1,200bps up to 230,400bps. • Supports RTS1/CTS1 hardware flow. The hardware hand shake line RTS0 has an internalpull down resistor causing a low level signal, if the line is not used and open. Although hard-ware flow control is recommended, this allows communication by using only RXD and TXDlines.

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 29 of 107The following figure shows the startup behavior of the asynchronous serial interface ASC1.*) For pull-down values see Table 10.Figure 9: ASC1 startup behaviorTXD1/GPIO17RXD1/GPIO16RTS1/GPIO18CTS1/GPIO19ONEMERG_RSTPDPDPDPDPower supply activeStart upFirmware initializationCommand interface initializationInterface activeResetstateV180VCOREPD

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 30 of 1072.1.6 UICC/SIM/USIM InterfaceELS81-US has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards. Please refer to Table 2 for electrical specifications of the UICC/SIM/USIM interface lines depending on whether a 3V or 1.8V SIM card is used.The CCIN signal serves to detect whether a tray (with SIM card) is present in the card holder. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been tested to op-erate with ELS81-US and is part of the Gemalto M2M reference equipment submitted for type approval. See Section 7.1 for Molex ordering numbers.Note [1]: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart ELS81-US.Note [2]: On the evaluation board, the CCIN signal is inverted, thus the CCIN signal is by default high and will change to a low level if a SIM card is inserted. Table 4: Signals of the SIM interface (SMT application interface)Signal DescriptionGND Separate ground connection for SIM card to improve EMC.CCCLK Chipcard clockCCVCC SIM supply voltage.CCIO Serial data line, input and output.CCRST Chipcard resetCCIN Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruc-tion of the SIM. The CCIN signal is by default low and will change to high level if a SIM card is inserted.The CCIN signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCIN signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of ELS81-US.

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 31 of 107The figure below shows a circuit to connect an external SIM card holder.Figure 10: External UICC/SIM/USIM card holder circuitThe total cable length between the SMT application interface pads on ELS81-US and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both lines are not placed closely next to each other. A useful approach is using a GND line to shield the CCIO line from the CCCLK line.An example for an optimized ESD protection for the SIM interface is shown in Section 2.1.6.1.SIMCCVCCCCRSTCCIOCCCLK220nF1nFCCINV180

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 32 of 1072.1.6.1 Enhanced ESD Protection for SIM InterfaceTo optimize ESD protection for the SIM interface it is possible to add ESD diodes to the SIM interface lines as shown in the example given in Figure 11.1The example was designed to meet ESD protection according ETSI EN 301 489-1/7: Contact discharge: ± 4kV, air discharge: ± 8kV.Figure 11: SIM interface - enhanced ESD protection1. Note that the protection diode shall have low internal capacitance less than 5pF for IO and CLK. CCRSTCCCLKCCIOCCVCCCCIN GND123654SIM_RSTSIM_CLKSIM_IOSIM_VCCSIM_DETModule

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 33 of 1072.1.7 RTC BackupThe internal Real Time Clock of ELS81-US is supplied from a separate voltage regulator in thepower supply component which is also active when ELS81-US is in Power Down mode andBATT+ is available. An alarm function is provided that allows to wake up ELS81-US withoutlogging on to the RF network. In addition, you can use the VDDLP pad to backup the RTC from an external capacitor. Thecapacitor is charged from the internal LDO of ELS81-US. If the voltage supply at BATT+ is dis-connected the RTC can be powered by the capacitor. The size of the capacitor determines theduration of buffering when no voltage is applied to ELS81-US, i.e. the greater the capacitor thelonger ELS81-US will save the date and time. The RTC can also be supplied from an externalbattery (rechargeable or non-chargeable). In this case the electrical specification of the VDDLPpad (see Section 2.1.2) has to be taken in to account.Figure 12 shows an RTC backup configuration. A serial 1k resistor has to be placed on theapplication next to VDDLP. It limits the input current of an empty capacitor or battery.Figure 12: RTC supply variantsCapacitorVDDLPProcessor and power managementLRTCRTCApplication interfaceBATT+Module1kGND

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 34 of 1072.1.8 GPIO InterfaceELS81-US offers a GPIO interface with 22 GPIO lines. The GPIO lines are shared with otherinterfaces or functions: Fast shutdown (see Section 2.1.13.4), status LED (see Section2.1.13.1), the PWM functionality (see Section 2.1.11), an pulse counter (see Section 2.1.12),ASC0 (see Section 2.1.4), ASC1 (see Section 2.1.5), an SPI interface (see Section 2.1.10). The following table shows the configuration variants for the GPIO pads. All variants are mutu-ally exclusive, i.e. a pad configured for instance as Status LED is locked for alternative usage.After startup, the above mentioned alternative GPIO line assignments can be configured usingAT commands (see [1]). The configuration is non-volatile and available after module restart.Table 5: GPIO lines and possible alternative assignmentGPIO Fast Shutdown Status LED PWM Pulse Counter ASC0 ASC1 SPIGPIO1 DTR0GPIO2 DCD0GPIO3 DSR0 SPI_CLKGPIO4 FST_SHDNGPIO5 Status LEDGPIO6 PWM2GPIO7 PWM1GPIO8 COUNTERGPIO11GPIO12GPIO13GPIO14GPIO15GPIO16 RXD1 MOSIGPIO17 TXD1 MISOGPIO18 RTS1GPIO19 CTS1 SPI_CSGPIO20GPIO21GPIO22GPIO23GPIO24 RING0

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 35 of 107The following figure shows the startup behavior of the GPIO interface. With an active state ofthe ASC0 interface (i.e. CTS0 is at low level) the initialization of the GPIO interface lines is alsofinished.*) For pull down values see Table 10.Figure 13: GPIO startup behaviorGPIO 1-8 PDCTS0ONEMERG_RSTPower supply activeStart upFirmware initializationCommand interface initializationInterface activeResetstateV180VCOREGPIO 11 - 24 PD

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 36 of 1072.1.9 I2C InterfaceI2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It con-sists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module actsas a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-direc-tional line. Each device connected to the bus is software addressable by a unique 7-bit ad-dress, and simple master/slave relationships exist at all times. The module operates as master-transmitter or as master-receiver. The customer application transmits or receives data only onrequest of the module.To configure and activate the I2C bus use the AT^SSPI command. Detailed information on theAT^SSPI command as well explanations on the protocol and syntax required for data transmis-sion can be found in [1].The I2C interface can be powered via the V180 line of ELS81-US. If connected to the V180 line,the I2C interface will properly shut down when the module enters the Power Down mode.In the application I2CDAT and I2CCLK lines need to be connected to a positive supply voltagevia a pull-up resistor. For electrical characteristics please refer to Table 2.Figure 14: I2C interface connected to V180Note: Good care should be taken when creating the PCB layout of the host application: Thetraces of I2CCLK and I2CDAT should be equal in length and as short as possible.I2CCLKI2CDATGNDI2CCLKI2CDATGNDModule ApplicationV180R pull upR pull upR pull upR pull up1KOhm1KOhm

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 37 of 107The following figure shows the startup behavior of the I2C interface. With an active state of theASC0 interface (i.e. CTS0 is at low level) the initialization of the I2C interface is also finished.Figure 15: I2C startup behaviorI2CCLKI2CDATOpen DrainOpen Drain(external pull up)(external pull up)CTSxONEMERG_RSTPower supply activeStart upFirmware initializationCommand interface initializationInterface activeResetstateV180VCORE

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 38 of 1072.1.10 SPI InterfaceFour ELS81-US GPIO interface lines can be configured as Serial Peripheral Interface (SPI).The SPI is a synchronous serial interface for control and data transfer between ELS81-US andthe external application. Only one application can be connected to the SPI and the interfacesupports only master mode. The transmission rates are up to 6.5Mbit/s. The SPI interface com-prises the two data lines MOSI and MISO, the clock line SPI_CLK a well as the chip select lineSPI_CS.The four GPIO lines can be configured as SPI interface signals as follows: GPIO3 --> SPI_CLK, GPIO16 --> MOSI, GPIO17 --> MISO and GPIO19 --> SPI_CS. The configuration is done by AT command (see [1]). It is non-volatile and becomes active after a module restart.The GPIO lines are also shared with the ASC1 signal lines and the ASC0 modem status signal line DSR0.To configure and activate the SPI interface use the AT^SSPI command. Detailed informationon the AT^SSPI command as well explanations on the SPI modes required for data transmis-sion can be found in [1].In general, SPI supports four operation modes. The modes are different in clock phase andclock polarity. The module’s SPI mode can be configured by using the AT command AT^SSPI.Make sure the module and the connected slave device works with the same SPI mode.Figure 16 shows the characteristics of the four SPI modes. The SPI modes 0 and 3 are the mostcommon used modes. For electrical characteristics please refer to Table 2.Figure 16: Characteristics of SPI modesSPI MODE 0 SPI MODE 1SPI MODE 2 SPI MODE 3Clock phaseClock polaritySPI_CSMOSISPI_CLKMISOSPI_CSMOSISPI_CLKMISOSPI_CSMOSISPI_CLKMISOSPI_CSMOSISPI_CLKMISOSample SampleSample Sample

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 39 of 1072.1.11 PWM InterfacesThe GPIO6 and GPIO7 interface lines can be configured as Pulse Width Modulation interfacelines PWM1 and PWM2. The PWM interface lines can be used, for example, to connect buzz-ers. The PWM1 line is shared with GPIO7 and the PWM2 line is shared with GPIO6 (for GPIOssee Section 2.1.8). GPIO and PWM functionality are mutually exclusive.The startup behavior of the lines is shown in Figure 13.2.1.12 Pulse CounterThe GPIO8 line can be configured as pulse counter line COUNTER. The pulse counter inter-face can be used, for example, as a clock (for GPIOs see Section 2.1.8).2.1.13 Control Signals2.1.13.1 Status LEDThe GPIO5 interface line can be configured to drive a status LED that indicates different oper-ating modes of the module (for GPIOs see Section 2.1.8). GPIO and LED functionality are mu-tually exclusive.To take advantage of this function connect an LED to the GPIO5/LED line as shown in Figure17.Figure 17: Status signaling with LED driverVCCGPIO5/LEDLEDGNDGNDR1R2R3

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 40 of 1072.1.13.2 Power Indication CircuitIn Power Down mode the maximum voltage at any digital or analog interface line must not ex-ceed +0.3V (see also Section 2.1.2.1). Exceeding this limit for any length of time might causepermanent damage to the module. It is therefore recommended to implement a power indication signal that reports the module’spower state and shows whether it is active or in Power Down mode. While the module is inPower Down mode all signals with a high level from an external application need to be set tolow state or high impedance state. The sample power indication circuit illustrated in Figure 18denotes the module’s active state with a low signal and the module’s Power Down mode witha high signal or high impedance state.Figure 18: Power indication circuit2.1.13.3 Host WakeupIf no call, data or message transfer is in progress, the host may shut down its own USB inter-face to save power. If a call or other request (URC’s, messages) arrives, the host can be noti-fied of these events and be woken up again by a state transition of the ASC0 interface‘s RING0line. This functionality should only be used with legacy USB applications not supporting the rec-ommended USB suspend and resume mechanism as described in [5] (see also Section 2.1.3.1).For more information on how to configure the RING0 line by AT^SCFG command see [1].Possible RING0 line states are listed in Table 6.Table 6: Host wakeup linesSignal I/O DescriptionRING0 O Inactive to active low transition:0 = The host shall wake up1 = No wake up request 22k10k100k100k4.7kV180VCOREPower indicationExternal power supply

Cinterion® ELS81-US Hardware Interface Description2.1 Application Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 41 of 1072.1.13.4 Fast ShutdownThe GPIO4 interface line can be configured as fast shutdown signal line FST_SHDN. The con-figured FST_SHDN line is an active low control signal and must be applied for at least 1 milli-seconds. If unused this line can be left open because of a configured internal pull-up resistor. Before setting the FST_SHDN line to low, the ON signal should be set to low (see Figure 19). Otherwise there might be back powering at the ON line in Power Down mode.The fast shutdown feature can be triggered using the AT command AT^SMSO=<fso>. For de-tails see [1].If triggered, a low impulse >1 milliseconds on the FST_SHDN line starts the fast shutdown. The fast shutdown procedure still finishes any data activities on the module's flash file system, thus ensuring data integrity, but will no longer deregister gracefully from the network, thus saving the time required for network deregistration.Figure 19: Fast shutdown timingPlease note that the normal software controlled shutdown using AT^SMSO will allow option for a fast shutdown by parameter <fso>, i.e., without network deregistration. However, in this case no URCs including shutdown URCs will be provided by the AT^SMSO command.Please also note that the fast shutdown operation does not allow the module deregister from the network, therefore, this practice is not recommended, and should not be conducted on reg-ular basis. If it is used for energy saving reason, for instance, used in battery-driven solutions that require prompt system shutdown before battery depletion, discretion is advised in such case. BATT+VCOREV180VDDLPFast shut down procedure Power downEMERG_RSTONGPIO4/FST_SHDN<15ms_

Cinterion® ELS81-US Hardware Interface Description2.2 RF Antenna Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 42 of 1072.2 RF Antenna InterfaceThe ELS81-US UMTS/LTE antenna interface comprises a UMTS/LTE main antenna as well as a UMTS/LTE Rx diversity antenna to improve signal reliability and quality1. The RF interface has an impedance of 50. ELS81-US is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power.The external antenna must be matched properly to achieve best performance regarding radi-ated power, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the ELS81-US module and should be placed in the host application if the an-tenna does not have an impedance of 50.Regarding the return loss ELS81-US provides the following values in the active band:2.2.1 Antenna Interface SpecificationsFor approval reasons it is mandatory to connect/apply the Rx diversity antenna to an existing antenna. Not connecting/applying the Rx diversity antenna does not necessarily impact the performance, but may result in approval failures. The minimum antenna efficiency should be better than 50%. 1. By delivery default the UMTS/LTE Rx diversity antenna is configured as available for the module sinceits usage is mandatory for LTE. Please refer to [1] for details on how to configure antenna settings.Table 7: Return loss in the active bandState of module Return loss of module Recommended return loss of applicationReceive > 8dB > 12dBTransmit not applicable > 12dBTable 8: RF Antenna interface UMTS/LTE (at operating temperature range1)Parameter Conditions Min. Typical Max. UnitLTE connectivity2Band 2, 4, 5,12Receiver Input Sensitivity @ARP (Dual Antenna; ch. bandwidth 5MHz)LTE 700 Band 12 (ch. band-width 5MHz)-97 -103.5 dBmLTE 850 Band 5 (ch. band-width 10MHz)-98 -104.5 dBmLTE AWS Band 4 (ch. band-width 10MHz)-100 -103 dBmLTE 1900 Band 2 (ch. band-width 10MHz) -98 -102.5 dBm

Cinterion® ELS81-US Hardware Interface Description2.2 RF Antenna Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 43 of 107RF Power @ ARP with 50Load (Board temperature < 85°C, BW:5MHz RB:25 (DL), 1 (UL) QPSK)LTE 700 Band 12 (ch. band-width 5MHz; 1RB, position low)+21 +23 dBmLTE 850 Band 5 (ch. band-width 5MHz; 1RB, position low)+21 +23 dBmLTE AWS Band 4 (ch. band-width 5MHz; 1RB, position low)+21 +23 dBmLTE 1900 Band 2 (ch. band-width 5MHz; 1RB, position low)+21 +23 dBmUMTS/HSPA connectivity2Band II, IV, VReceiver Input Sensitivity @ ARPUMTS 850 Band V -104.7 -110 dBmUMTS AWS Band IV -106.7 -108.5 dBmUMTS 1900 Band II -104.7 -110 dBmRF Power @ ARP with 50 Load(Board temperature < 85°C)UMTS 850 Band V +21 +23.5 dBmUMTS AWS Band IV +21 +23.5 dBmUMTS 1900 Band II +21 +23.5 dBm1. No active power reduction is implemented - any deviations are hardware related.2. Applies also to UMTS/LTE Rx diversity antenna.Table 8: RF Antenna interface UMTS/LTE (at operating temperature range1)Parameter Conditions Min. Typical Max. Unit

Cinterion® ELS81-US Hardware Interface Description2.2 RF Antenna Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 44 of 1072.2.2 Antenna InstallationThe antenna is connected by soldering the antenna pad (ANT_MAIN or ANT_DRX) and its neighboring ground pads (GND) directly to the application’s PCB. The antenna pads are the antenna reference points (ARP) for ELS81-US. All RF data specified throughout this document is related to the ARP.Figure 20: Antenna pads (bottom view)The distance between the antenna pad and its neighboring GND pads has been optimized for best possible impedance. To prevent mismatch, special attention should be paid to these pads on the application‘s PCB.The wiring of the antenna connection, starting from the antenna pad to the application‘s anten-na should result in a 50 line impedance. Line width and distance to the GND plane needs to be optimized with regard to the PCB’s layer stack. Some examples are given in Section 2.2.3.To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the external application PCB, it is recommended to realize the antenna con-nection line using embedded Stripline rather than Micro-Stripline technology. Please see Sec-tion 2.2.3.1 for examples of how to design the antenna connection in order to achieve the required 50 line impedance.For type approval purposes, the use of a 50 coaxial antenna connector (U.FL-R-SMT) might be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible to ELS81-US‘s antenna pad. 2182172162152142132122112102092082072062052042032022013332313029282726252423222120535455565758596061626364656622322422522622722822923023123223323423523623723823924067 68 69 70 71 72 7374 75 76 77 78 79 8093 94 95 96 97 98 99100 101 102 103 104 105 10685 8689 9081 8287 8891 9283 842432442412422222212202192522452502512492482472462728236237GNDGNDANT_MAINGNDANT_DRX

Cinterion® ELS81-US Hardware Interface Description2.2 RF Antenna Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 45 of 1072.2.3 RF Line Routing Design2.2.3.1 Line Arrangement ExamplesSeveral dedicated tools are available to calculate line arrangements for specific applicationsand PCB materials - for example from http://www.polarinstruments.com/ (commercial software)or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software).Embedded StriplineThis figure below shows a line arrangement example for embedded stripline with 65µm FR4 prepreg (type: 1080) and 710µm FR4 core (4-layer PCB).Figure 21: Embedded Stripline with 65µm prepreg (1080) and 710µm core

Cinterion® ELS81-US Hardware Interface Description2.2 RF Antenna Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 46 of 107Micro-StriplineThis section gives two line arrangement examples for micro-stripline. • Micro-Stripline on 1.0mm Standard FR4 2-Layer PCBThe following two figures show examples with different values for D1 (ground strip separa-tion).Figure 22: Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1Antenna lineGround lineGround lineApplication board

Cinterion® ELS81-US Hardware Interface Description2.2 RF Antenna Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 47 of 107Figure 23: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2Antenna lineGround lineGround lineApplication board

Cinterion® ELS81-US Hardware Interface Description2.2 RF Antenna Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 48 of 107• Micro-Stripline on 1.5mm Standard FR4 2-Layer PCBThe following two figures show examples with different values for D1 (ground strip separa-tion).Figure 24: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1Antenna lineGround lineGround lineApplication board

Cinterion® ELS81-US Hardware Interface Description2.2 RF Antenna Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 49 of 107Figure 25: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2Antenna lineGround lineGround lineApplication board

Cinterion® ELS81-US Hardware Interface Description2.2 RF Antenna Interface53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 50 of 1072.2.3.2 Routing ExampleInterface to RF ConnectorFigure 26 shows the connection of the module‘s antenna pad with an application PCB‘s coaxial antenna connector. Please note that the ELS81-US bottom plane appears mirrored, since it is viewed from ELS81-US top side. By definition the top of customer's board shall mate with the bottom of the ELS81-US module.Figure 26: Routing to application‘s RF connector - top view

Cinterion® ELS81-US Hardware Interface Description2.3 Sample Application53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 51 of 1072.3 Sample ApplicationFigure 27 shows a typical example of how to integrate a ELS81-US module with an application.Usage of the various host interfaces depends on the desired features of the application.Because of the very low power consumption design, current flowing from any other source intothe module circuit must be avoided, for example reverse current from high state external controllines. Therefore, the controlling application must be designed to prevent reverse current flow.Otherwise there is the risk of undefined states of the module during startup and shutdown oreven of damaging the module.Because of the high RF field density inside the module, it cannot be guaranteed that no selfinterference might occur, depending on frequency and the applications grounding concept. Thepotential interferers may be minimized by placing small capacitors (47pF) at suspected lines(e.g. RXD0, VDDLP, and ON). While developing SMT applications it is strongly recommended to provide test pointsfor certain signals, i.e., lines to and from the module - for debug and/or test purposes.The SMT application should allow for an easy access to these signals. For details onhow to implement test points see [3].The EMC measures are best practice recommendations. In fact, an adequate EMC strategy foran individual application is very much determined by the overall layout and, especially, the po-sition of components. Depending on the micro controller used by an external application ELS81-US‘s digital input and output lines may require level conversion. Section 2.3.1 shows a possible sample level conver-sion circuit.Note: ELS81-US is not intended for use with cables longer than 3m.DisclaimerNo warranty, either stated or implied, is provided on the sample schematic diagram shown inFigure 27 and the information detailed in this section. As functionality and compliance with na-tional regulations depend to a great amount on the used electronic components and the indi-vidual application layout manufacturers are required to ensure adequate design and operatingsafeguards for their products using ELS81-US modules.

Cinterion® ELS81-US Hardware Interface Description2.3 Sample Application53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 52 of 107Figure 27: Schematic diagram of ELS81-US sample applicationVCOREV180ASC0 (including GPIO1...GPIO3 for DSR0, DTR0, DCD0 and GPIO24 for RING0)/ SPI_CLK (for DSR0)GPIO16...GPIO19/ASC1/SPI84CCVCCCCIOCCCLKCCINCCRSTSIMV180220nF 1nFI2CCLKI2CDAT2.2k***V180GPIO4 (FST_SHDN) GPIO5 (Status LED)GPIO6 (PWM)GPIO7 (PWM)GPIO8 (COUNTER)GPIO11...GPIO15LEDGNDGNDGNDANT_MAINBATT+RFPower supplyMain antennaELS6xAll SIM components should be close to card holder. Keep SIM wires low capacitive.*10pF *10pF* add optional 10pF for SIM protection against RF (internal Antenna)150µF,Low ESR! 33pFBlocking**Blocking**Blocking**PWR_INDBATT+BB53204GPIO20...GPIO234Blocking**100k4.7k100k22k2.2k***3USB150µF,Low ESR!33pFGNDGNDANT_DRXDiversity antennaONEMERG_RSTRESETVDDLP100kVDDLPBEAD*BEAD*: It is recommended to add the BEAD as shown to the BATT+BB line. The purpose of this is to mitigate noise from baseband power supply. Note 1: BLM15PD121SN1D MURATA Ind Chip Bead (120Ohm 25% 100MHz Ferrite 1.3A) is recommended in this case. For details please visit www.murata.com.Note 2: The Bead should be placed as close as possible to the module. *** I2C interface of the module already has internal 1KOhm pull up resistor to V180 inside the module. Please take this into consideration during application design. Blocking** = For more details see Section 3.7For switch on circuit see Section 3.2.1

Cinterion® ELS81-US Hardware Interface Description2.3 Sample Application53els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 53 of 1072.3.1 Sample Level Conversion CircuitDepending on the micro controller used by an external application ELS81-US‘s digital input and output lines (i.e., ASC0, ASC1 and GPIO lines) may require level conversion. The following Fig-ure 28 shows a sample circuit with recommended level shifters for an external application‘s mi-cro controller (with VLOGIC between 3.0V...3.6V). The level shifters can be used for digital input and output lines with VOHmax=1.85V or VIHmax =1.85V.Figure 28: Sample level conversion circuit5V tolerarant5V tolerarantLow level inputLow level inputLow level inputVCC5V tolerantVCCE.g.,74VHC1GT50E.g.,NC7WZ1674LVC2G34External applicationMicro controllerVLOGIC(3.0V...3.6V)Input lines,e.g., µRXD, µCTSOutput lines,e.g., µTXD, µRTSV180 (1.8V)Digital output lines,e.g., RXDx, CTSxWireless moduleDigital input lines,e.g., TXDx, RTSx

Cinterion® ELS81-US Hardware Interface Description3 Operating Characteristics77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 54 of 1073 Operating Characteristics3.1 Operating ModesThe table below briefly summarizes the various operating modes referred to throughout the document.Table 9: Overview of operating modesMode FunctionNormal operationUMTS / HSPA / LTE SLEEPPower saving set automatically when no call is in progress and the USB connection is suspended by host or not present and no active commu-nication via ASC0. UMTS / HSPA / LTE IDLEPower saving disabled or an USB connection not suspended, but no call in progress.UMTS DATA UMTS data transfer in progress. Power consumption depends on net-work settings (e.g. TPC Pattern) and data transfer rate.HSPA DATA HSPA data transfer in progress. Power consumption depends on net-work settings (e.g. TPC Pattern) and data transfer rate.LTE DATA LTE data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate.Power DownNormal shutdown after sending the power down command. Only a voltage regulator is active for powering the RTC. Software is not active. Interfaces are not accessible. Operat-ing voltage remains applied.Airplane modeAirplane mode shuts down the radio part of the module, causes the module to log off from the network and disables all AT commands whose execution requires a radio connection.Airplane mode can be controlled by AT command (see [1]).Alarm modeRestricted operation launched by RTC alert function when the module is in Power Down mode. In Alarm mode, the module remains deregistered from the network. Limited number of AT commands is accessible.

Cinterion® ELS81-US Hardware Interface Description3.2 Power Up/Power Down Scenarios77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 55 of 1073.2 Power Up/Power Down ScenariosIn general, be sure not to turn on ELS81-US while it is beyond the safety limits of voltage and temperature stated in Section 2.1.2.1. ELS81-US immediately switches off after having started and detected these inappropriate conditions. In extreme cases this can cause permanent dam-age to the module. 3.2.1 Turn on ELS81-USELS81-US can be turned on as described in the following sections:• Connecting the operating voltage BATT+ (see Section 3.2.1.1).• Hardware driven switch on by ON line: Starts Normal mode (see Section 3.2.1.2).After startup or restart, the module will send the URC ^SYSSTART that notifies the host appli-cation that the first AT command can be sent to the module (see also [1]).3.2.1.1 Connecting ELS81-US BATT+ LinesFigure 29 shows sample external application circuits that allow to connect (and also to tempo-rarily disconnect) the module‘s BATT+ lines from the external application‘s power supply. Figure 29 illustrates the application of power employing an externally controlled microcontrol-ler. The voltage supervisory circuit ensures that the power is disconnected and applied againdepending on given thresholds.The transistor T2 mentioned in Figure 29 should have an RDS_ON value < 50m in order to min-imize voltage drops. Such circuits could be useful to maximize power savings for battery driven applications or tocompletely switch off and restart the module after a firmware update.After connecting the BATT+ lines the module can then be (re-)started as described in Section3.2.1.2 and Section 3.2.2.

Cinterion® ELS81-US Hardware Interface Description3.2 Power Up/Power Down Scenarios77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 56 of 107Figure 29: Sample circuit for applying power using an external µC3.8VModulePlace C2-C5 close to moduleµcontrollerENABLEVBATTVBATT_INC1100nFC2 47µF,X5RC3 47µF,X5RC4 47µF,X5RC5 47µF,X5RC6 47µF,X5RR1100kR2100kR3100kR610kT1T2IRML6401BC847

Cinterion® ELS81-US Hardware Interface Description3.2 Power Up/Power Down Scenarios77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 57 of 1073.2.1.2 Switch on ELS81-US Using ON SignalAfter the operating voltage BATT+ is applied, ELS81-US can be switched on by means of theON signal. The ON signal is an edge triggered signal and allows the input voltage level up to 5V. The mod-ule starts into normal mode on detecting the rising edge of the ON signal. The rising edge ofON signal must be applied at least 100 milliseconds later than BATT+. See Figure 31. The following Figure 30 shows recommendations for possible switch-on circuits.Figure 30: ON circuit optionsIt is recommended to set a serial 1kOhm resistor between the ON circuit and the external ca-pacitor or battery at the VDDLP power supply (i.e., RTC backup circuit). This serial resistor pro-tection is necessary in case the capacitor or battery has low power (is empty).With Option 2 thetypical resistor values are: R1 = 150k and R2 = 3k. But the resistor values depend on the cur-rent gain from the employed PNP resistor.Please note that the ON signal is an edge triggered signal. This implies that a micro-second high pulse on the signal line suffices to almost immediately switch on the module, as shown in Figure 31. After module startup the ON signal should always be set to low to prevent possible back powering at this pad.11. Please take due discretion when designing the filtering circuit, especially ESD, which may cause unin-tended switch on. VDDLPON1k+R1R2Option 1 Option 2RTC backup

Cinterion® ELS81-US Hardware Interface Description3.2 Power Up/Power Down Scenarios77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 58 of 107Figure 31: ON timing3.2.1.3 Automatic Power OnIf an automatic power on function is required for module application, circuit shown in eitherFigure 32 or Figure 33 is recommended.Figure 32: Automatic ON circuit based on voltage detector - option 1BATT+ONEMERG_RSTV180VCOREVDDLPRising edge only starts up the module>100msVoltage Detector*BATT+BBGNDONVDDLPGND* It is recommended to apply the 3-pin microprocessor reset monitor MAX803SQ293T1G or MAX803SQ293D3T1Gmanufactured by ON Semiconductor. Details please refer to www.onsemi.comVCC RESETGND100nF Not AssembledR110KOhmR20Ohm

Cinterion® ELS81-US Hardware Interface Description3.2 Power Up/Power Down Scenarios77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 59 of 107Figure 33: Automatic ON circuit based on voltage detector - option 23.2.2 Restart ELS81-US After startup ELS81-US can be re-started as described in the following sections:• Software controlled reset by AT+CFUN command: Starts Normal mode (see Section3.2.2.1).• Hardware controlled reset by EMERG_RST line: Starts Normal mode (see Section 3.2.2.2).3.2.2.1 Restart ELS81-US via AT+CFUN CommandTo reset and restart the ELS81-US module use the command AT+CFUN. See [1] for details. Voltage Detector*BATT+BBGNDONVDDLP* It is recommended to apply the ultra-low current voltage detector NCP303LSN28T1 manufactured by ON Semiconductor. Details please refer to www.onsemi.comInput RESETOutputGNDR110KOhm2130.1μFGND 5 CD

Cinterion® ELS81-US Hardware Interface Description3.2 Power Up/Power Down Scenarios77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 60 of 1073.2.2.2 Restart ELS81-US Using EMERG_RSTThe EMERG_RST signal is internally connected to the main module processor. A low level formore than 10ms sets the processor and with it all the other signal pads to their respective resetstate. The reset state is described in Section 3.2.3 as well as in the figures showing the startupbehavior of an interface. After releasing the EMERG-RST line, i.e., with a change of the signal level from low to high,the module restarts. The other signals continue from their reset state as if the module wasswitched on by the ON signal. Figure 34: Emergency restart timingIt is recommended to control this EMERG_RST line with an open collector transistor or an opendrain field-effect transistor.Caution: Use the EMERG_RST line only when, due to serious problems, the software is notresponding for more than 5 seconds. Pulling the EMERG_RST line causes the loss of all infor-mation stored in the volatile memory. Therefore, this procedure is intended only for use in caseof emergency, e.g. if ELS81-US does not respond, if reset or shutdown via AT command fails.BATT+ONEMERG_RSTVCOREV180VDDLP>10msSystem startedSystem started againResetstateIgnition

Cinterion® ELS81-US Hardware Interface Description3.2 Power Up/Power Down Scenarios77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 61 of 1073.2.3 Signal States after StartupTable 10 lists the states each interface signal passes through during reset phase and the firstfirmware initialization. For further firmware startup initializations the values may differ becauseof different GPIO line configurations.The reset state is reached with the rising edge of the EMERG_RST signal - either after a normal module startup (see Section 3.2.1.2) or after a reset (see Section 3.2.2.2). After the reset state has been reached the firmware initialization state begins. The firmware initialization is complet-ed as soon as the ASC0 interface lines CTS0, DSR0 and RING0 as well as the ASC1 interface line CTS1 have turned low (see Section 2.1.4 and Section 2.1.5). Now, the module is ready to receive and transmit data.Abbreviations used in above Table 10: Table 10: Signal statesSignal name Reset state First start up configurationCCIO L O / LCCRST L O / LCCCLK L O / LCCIN T / 100k PD I / PDRXD0 T / PU O / HTXD0 T / PD ICTS0 T / PU O / HRTS0 T / PU I / PDGPIO1 T / PD T / PDGPIO2 T / PD T / PDGPIO3 T / PD T / PDGPIO4 T / PD T / PDGPIO5 T / PD T / PDGPIO6 T / PD T / PDGPIO7 T / PD T / PDGPIO8 T / PD T / PDGPIO11-GPIO15 T / PD T / PDGPIO16 T / PD T / PDGPIO17 T / PD T / PDGPIO18 T / PD T / PDGPIO19 T / PD T / PDGPIO20 T / PD T / PDGPIO21 T / PD T / PDGPIO22 T / PD T / PDGPIO23 T / PD T / PDGPIO24 T / PD T / PDI2CCLK T / PU OD / PUI2CDAT T / PU OD / PUL = Low levelH = High levelT = TristateI = InputO = OutputOD = Open DrainPD = Pull down, 200µA at 1.9VPU = Pull up, -240µA at 0V

Cinterion® ELS81-US Hardware Interface Description3.2 Power Up/Power Down Scenarios77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 62 of 1073.2.4 Turn off ELS81-USTo switch the module off the following procedures may be used: •Software controlled shutdown procedure: Software controlled by sending an AT commandover the serial application interface. See Section 3.2.4.1.•Hardware controlled shutdown procedure: Hardware controlled by disconnecting the mod-ule‘s power supply lines BATT+ (see Section 3.2.1.1).•Automatic shutdown (software controlled): See Section 3.2.5- Takes effect if ELS81-US board temperature or voltage levels exceed a critical limit.3.2.4.1 Switch off ELS81-US Using AT CommandThe best and safest approach to powering down ELS81-US is to issue the appropriate AT com-mand. This procedure lets ELS81-US log off from the network and allows the software to enterinto a secure state and safe data before disconnecting the power supply. The mode is referredto as Power Down mode. In this mode, only the RTC stays active. After sending the switch offcommand AT^SMSO, be sure not to enter any further AT commands until the module was re-started. CAUTION: Be sure not to disconnect the operating voltage VBATT+ before V180 pad has gonelow. Otherwise you run the risk of losing data, or in some rare cases even to render the moduleinoperable. To monitor the V180 line, it is recommended to implement a power indication circuit as de-scribed in Section 2.1.13.2. While ELS81-US is in Power Down mode the application interface is switched off and must notbe fed from any other voltage source. Therefore, your application must be designed toavoid any current flow into any digital pads of the application interface.

Cinterion® ELS81-US Hardware Interface Description3.2 Power Up/Power Down Scenarios77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 63 of 107Figure 35: Switch off behaviorBATT+VCOREV180VDDLPAT^SMSO System power down procedure Power downEMERG_RSTON

Cinterion® ELS81-US Hardware Interface Description3.2 Power Up/Power Down Scenarios77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 64 of 1073.2.5 Automatic ShutdownAutomatic shutdown takes effect if the following event occurs:• ELS81-US board is exceeding the critical limits of overtemperature or undertemperature(see Section 3.2.5.1)• Undervoltage or overvoltage is detected (see Section 3.2.5.2 and Section 3.2.5.3)The automatic shutdown procedure is equivalent to the power-down initiated with an AT com-mand, i.e. ELS81-US logs off from the network and the software enters a secure state avoidingloss of data. 3.2.5.1 Thermal ShutdownThe board temperature is constantly monitored by an internal NTC resistor located on the PCB.The values detected by the NTC resistor are measured directly on the board and therefore, arenot fully identical with the ambient temperature. Each time the board temperature goes out of range or back to normal, ELS81-US instantly dis-plays an alert (if enabled).• URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such asprotecting the module from exposure to extreme conditions. The presentation of the URCsdepends on the settings selected with the AT^SCTM write command (for details see [1]):AT^SCTM=1: Presentation of URCs is always enabled. AT^SCTM=0 (default): Presentation of URCs is enabled during the 2 minute guard periodafter start-up of ELS81-US. After expiry of the 2 minute guard period, the presentation ofURCs will be disabled, i.e. no URCs with alert levels "1" or ''-1" will be generated.• URCs indicating the level "2" or "-2" are instantly followed by an orderly shutdown. The pre-sentation of these URCs is always enabled, i.e. they will be output even though the factorysetting AT^SCTM=0 was never changed.The maximum temperature ratings are stated in Section 3.5. Refer to Table 11 for the associ-ated URCs. Table 11: Temperature dependent behaviorSending temperature alert (2min after ELS81-US start-up, otherwise only if URC presentation enabled)^SCTM_B: 1 Board close to overtemperature limit.^SCTM_B: -1 Board close to undertemperature limit.^SCTM_B: 0 Board back to non-critical temperature range.Automatic shutdown (URC appears no matter whether or not presentation was enabled)^SCTM_B: 2 Alert: Board equal or beyond overtemperature limit. ELS81-US switches off.^SCTM_B: -2 Alert: Board equal or below undertemperature limit. ELS81-US switches off.

Cinterion® ELS81-US Hardware Interface Description3.2 Power Up/Power Down Scenarios77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 65 of 1073.2.5.2 Undervoltage ShutdownThe undervoltage shutdown threshold is the specified minimum supply voltage VBATT+ given inTable 2. When the average supply voltage measured by ELS81-US approaches the undervolt-age shutdown threshold (i.e., 0.05V offset) the module will send the following URC: ^SBC: Undervoltage WarningThe undervoltage warning is sent only once - until the next time the module is close to the un-dervoltage shutdown threshold. If the voltage continues to drop below the specified undervoltage shutdown threshold, the mod-ule will send the following URC:^SBC: Undervoltage ShutdownThis alert is sent only once before the module shuts down cleanly without sending any furthermessages.This type of URC does not need to be activated by the user. It will be output automatically whenfault conditions occur.Note: For battery powered applications it is strongly recommended to implement a BATT+ con-necting circuit as described in Section 3.2.1.1 in order to not only be able save power, but alsoto restart the module after an undervoltage shutdown where the battery is deeply discharged.Also note that the undervoltage threshold is calculated for max. 400mV voltage drops duringtransmit burst. Power supply sources for external applications should be designed to tolerate400mV voltage drops without crossing the lower limit of 3.0 V. For external applications oper-ating at the limit of the allowed tolerance the default undervoltage threshold may be adaptedby subtracting an offset. For details see [1]: AT^SCFG= "MEShutdown/sVsup/threshold".3.2.5.3 Overvoltage ShutdownThe overvoltage shutdown threshold is the specified maximum supply voltage VBATT+ given inTable 2. When the average supply voltage measured by ELS81-US approaches the overvolt-age shutdown threshold (i.e., 0.05V offset) the module will send the following URC:^SBC: Overvoltage WarningThe overvoltage warning is sent only once - until the next time the module is close to the over-voltage shutdown threshold. If the voltage continues to rise above the specified overvoltage shutdown threshold, the modulewill send the following URC:^SBC: Overvoltage ShutdownThis alert is sent only once before the module shuts down cleanly without sending any furthermessages.This type of URC does not need to be activated by the user. It will be output automatically whenfault conditions occur.Keep in mind that several ELS81-US components are directly linked to BATT+ and, therefore,the supply voltage remains applied at major parts of ELS81-US. Especially the power amplifierlinked to BATT+RF is very sensitive to high voltage and might even be destroyed.

Cinterion® ELS81-US Hardware Interface Description3.3 Power Saving77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 66 of 1073.3 Power SavingELS81-US can be configured to control power consumption:• Using the AT command AT^SPOW it is possible to specify a so-called power saving modefor the module (<mode> = 2; for details on the command see [1]). The module‘s UART inter-faces (ASC0 and ASC1) are then deactivated and will only periodically be activated to beable to listen to network paging messages as described in Section 3.3.1 and Section 3.3.2.See Section 3.3.3 for a description on how to immediately wake up ELS81-US again usingRTS0.Please note that the AT^SPOW setting has no effect on the USB interface. As long as theUSB connection is active, the module will not change into its SLEEP state to reduce its func-tionality to a minimum and thus minimizing its current consumption. To enable switchinginto SLEEP mode, the USB connection must therefore either not be present at all or theUSB host must bring its USB interface into Suspend state. Also, VUSB_IN should alwaysbe kept enabled for this functionality. See “Universal Serial Bus Specification Revision 2.0”1for a description of the Suspend state. 3.3.1 Power Saving while Attached to WCDMA NetworksThe power saving possibilities while attached to a WCDMA network depend on the paging tim-ing cycle of the base station. During normal WCDMA operation, i.e., the module is connected to a WCDMA network, the duration of a power saving period varies. It may be calculated using the following formula:t = 2DRX value * 10 ms (WCDMA frame duration). DRX (Discontinuous Reception) in WCDMA networks is a value between 6 and 9, thus result-ing in power saving intervals between 0.64 and 5.12 seconds. The DRX value of the base sta-tion is assigned by the WCDMA network operator. In the pauses between listening to paging messages, the module resumes power saving, as shown in Figure 36. Figure 36: Power saving and paging in WCDMA networksThe varying pauses explain the different potential for power saving. The longer the pause the less power is consumed.1. The specification is ready for download on http://www.usb.org/developers/docs/

Cinterion® ELS81-US Hardware Interface Description3.3 Power Saving77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 67 of 107Generally, power saving depends on the module’s application scenario and may differ from the above mentioned normal operation. The power saving interval may be shorter than 0.64 sec-onds or longer than 5.12 seconds.3.3.2 Power Saving while Attached to LTE NetworksThe power saving possibilities while attached to an LTE network depend on the paging timing cycle of the base station. During normal LTE operation, i.e., the module is connected to an LTE network, the duration of a power saving period varies. It may be calculated using the following formula:t = DRX Cycle Value * 10 ms DRX cycle value in LTE networks is any of the four values: 32, 64, 128 and 256, thus resulting in power saving intervals between 0.32 and 2.56 seconds. The DRX cycle value of the base station is assigned by the LTE network operator. In the pauses between listening to paging messages, the module resumes power saving, as shown in Figure 37. Figure 37: Power saving and paging in LTE networksThe varying pauses explain the different potential for power saving. The longer the pause the less power is consumed.Generally, power saving depends on the module’s application scenario and may differ from the above mentioned normal operation. The power saving interval may be shorter than 0.32 sec-onds or longer than 2.56 seconds.

Cinterion® ELS81-US Hardware Interface Description3.3 Power Saving77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 68 of 1073.3.3 Wake-up via RTS0RTS0 can be used to wake up ELS81-US from SLEEP mode configured with AT^SPOW. Assertion of RTS0 (i.e., toggle from inactive high to active low) serves as wake up event, thus allowing an external application to almost immediately terminate power saving. After RTS0 assertion, the CTS0 line signals module wake up, i.e., readiness of the AT command interface. It is therefore recommended to enable RTS/CTS flow control (default setting). Figure 38 shows the described RTS0 wake up mechanism. Figure 38: Wake-up via RTS0RTS0CTS0TXD0RXD0AT commandReply URCRTS assertion (falling edge)Wake up from SLEEP mode Return to SLEEP modeRTS back

Cinterion® ELS81-US Hardware Interface Description3.4 Power Supply77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 69 of 1073.4 Power SupplyELS81-US needs to be connected to a power supply at the SMT application interface - 2 lines BATT+, and GND. There are two separate voltage domains for BATT+:•BATT+BB with a line mainly for the baseband power supply.•BATT+RF with a line for the UMTS/LTE power amplifier supply.Please note that throughout the document BATT+ refers to both voltage domains and power supply lines - BATT+BB and BATT+RF.The power supply of ELS81-US has to be a single voltage source at BATT+BB and BATT+RF. It must be able to provide the peak current during the uplink transmission. All the key functions for supplying power to the device are handled by the power management section of the analog controller. This IC provides the following features:• Stabilizes the supply voltages for the baseband using low drop linear voltage regulators anda DC-DC step down switching regulator.• Switches the module's power voltages for the power-up and -down procedures.• SIM switch to provide SIM power supply.3.4.1 Power Supply RatingsTable 12 and Table 13 assemble various voltage supply and current consumption ratings of the module. Table 12: Voltage supply ratings Description Conditions Min Typ Max UnitBATT+ Supply voltage Directly measured at Module. Voltage must stay within the min/max values, including voltage drop, ripple, spikes. 3.0 4.5 VMaximum allowed voltage drop during transmit burst Normal condition, power control level for Pout max400 mVVoltage ripple Normal condition, power control level for Pout max@ f <= 250 kHz@ f > 250 kHz12090mVppmVpp

Cinterion® ELS81-US Hardware Interface Description3.4 Power Supply77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 70 of 107Table 13: Current consumption ratings (typical ratings to be confirmed)Description Conditions Typical rating UnitIVDDLP @ 1.8V OFF State supply current RTC backup @ BATT+ = 0V µAIBATT+1(i.e., sum ofBATT+BB and BATT+RF) OFF State supply current Power Down µAAverage UMTS supply currentData transfer @ maximum PoutSLEEP2 @ DRX=9(UART deactivated) USB disconnected mAUSB suspended mASLEEP2 @ DRX=8(UART deactivated) USB disconnected mAUSB suspended mASLEEP2 @ DRX=6(UART deactivated) USB disconnected mAUSB suspended mAIDLE3 @ DRX=6(UART active, but no communication) USB disconnected mAUSB active mAUMTS Data transfer Band II mAUMTS Data transfer Band IV mAUMTS Data transfer Band V mAHSPA Data transfer Band II mAHSPA Data transfer Band IV mAHSPA Data transfer Band V mA

Cinterion® ELS81-US Hardware Interface Description3.4 Power Supply77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 71 of 107IBATT+1(i.e., sum ofBATT+BB and BATT+RF) Average LTE sup-ply currentData transfer @ maximum PoutSLEEP2 @ “Paging Occasions“ = 256 USB disconnected mAUSB suspended mASLEEP2 @ “Paging Occasions“ = 128 USB disconnected mAUSB suspended mASLEEP2 @ “Paging Occasions“ = 64 USB disconnected mAUSB suspended mASLEEP2 @ “Paging Occasions“ = 32 USB disconnected mAUSB suspended mAIDLE3 @ DRX=6(UART active, but no communication) USB disconnected mAUSB active mALTE4 Data transfer Band 2 mALTE4 Data transfer Band 4 mALTE4 Data transfer Band 5 mALTE4 Data transfer Band 12 mA1. With an impedance of ZLOAD=50 at the antenna connector.Measured at 25°C at 3.8V - except for Power Down ratings that were measured at 3.0V. 2. Measurements start 6 minutes after switching ON the module,Averaging times: SLEEP mode - 3 minutes, transfer modes - 1.5 minutesCommunication tester settings: no neighbour cells, no cell reselection etc., RMC (reference measurementchannel). Note that SLEEP mode is enabled via AT command AT^SPOW=2, 1000, 33. The power save mode is disabled via AT command AT^SCFG=”MEopMode/PwrSave”, “disabled”. 4. Communication tester settings: Channel Bandwidth: 5MHzNumber of Resource Blocks: 25 (DL), 1 (UL)Modulation: QPSKTable 13: Current consumption ratings (typical ratings to be confirmed)Description Conditions Typical rating Unit

Cinterion® ELS81-US Hardware Interface Description3.4 Power Supply77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 72 of 1073.4.2 Measuring the Supply Voltage (VBATT+)To measure the supply voltage VBATT+ it is possible to define two reference points GND and BATT+. GND should be the module’s shielding, while BATT+ should be a test pad on the ex-ternal application the module is mounted on. The external BATT+ reference point has to be connected to and positioned close to the SMT application interface’s BATT+ pads 53 (BATT+RF) or 204 (BATT+BB) as shown in Figure 39.Figure 39: Position of reference points BATT+ and GND3.4.3 Monitoring Power Supply by AT CommandTo monitor the supply voltage you can also use the AT^SBV command which returns the value related to the reference points BATT+ and GND. The module continuously measures the voltage at intervals depending on the operating mode of the RF interface. The duration of measuring ranges from 0.5 seconds in TALK/DATA mode to 50 seconds when ELS81-US is in IDLE mode or Limited Service (deregistered). The dis-played voltage (in mV) is averaged over the last measuring period before the AT^SBV com-mand was executed. If the measured voltage drops below or rises above the voltage shutdown thresholds, the mod-ule will send an "^SBC" URC and shut down (for details see Section 3.2.5).Reference point GND:Module shieldingReference point BATT+:External test pad connected to and positioned closely to BATT+ pad 53 or 204. External application

Cinterion® ELS81-US Hardware Interface Description3.5 Operating Temperatures77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 73 of 1073.5 Operating TemperaturesPlease note that the module’s lifetime, i.e., the MTTF (mean time to failure) may be reduced, if operated outside the extended temperature range. See also Section 3.2.5 for information about the NTC for on-board temperature measurement,automatic thermal shutdown and alert messages.Note: Within the specified operating temperature ranges the board temperature may vary to agreat extent depending on operating mode, used frequency band, radio output power and cur-rent supply voltage. For more information regarding the module’s thermal behavior please refer to [4].Table 14: Board temperatureParameter Min Typ Max UnitNormal operation -30 +25 +85 °CExtended operation11. Extended operation allows normal mode speech calls or data transmission for limited time until automatic thermal shutdown takes effect. Within the extended temperature range (outside the normal operating temperature range) the specified electrical characteristics may be in- or decreased.-40 +90 °CAutomatic shutdown2Temperature measured on ELS81-USboard2. Due to temperature measurement uncertainty, a tolerance of ±3°C on the thresholds may occur.<-40 --- >+90 °C

Cinterion® ELS81-US Hardware Interface Description3.6 Electrostatic Discharge77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 74 of 1073.6 Electrostatic DischargeThe module is not protected against Electrostatic Discharge (ESD) in general. Consequently,it is subject to ESD handling precautions that typically apply to ESD sensitive components.Proper ESD handling and packaging procedures must be applied throughout the processing,handling and operation of any application that incorporates a ELS81-US module.An example for an enhanced ESD protection for the SIM interface is given in Section 2.1.6.1.ELS81-US has been tested according to group standard ETSI EN 301 489-1 (see Table 22) andtest standard EN 61000-4-2. Electrostatic values can be gathered from the following table.Note: The values may vary with the individual application design. For example, it matterswhether or not the application platform is grounded over external devices like a computer orother equipment, such as the Gemalto reference application described in Chapter 5.3.6.1 ESD Protection for Antenna InterfacesThe following Figure 40 shows how to implement an external ESD protection for the RF anten-na interfaces (ANT_MAIN and ANT_DRX) with either a T pad or PI pad attenuator circuit (for RF line routing design see also Section 2.2.3).Figure 40: ESD protection for RF antenna interfaceRecommended inductor types for the above sample circuits: Size 0402 SMD from Panasonic ELJRF series (22nH and 18nH inductors) or Murata LQW15AN18NJ00 (18nH inductors only).Table 15: Electrostatic valuesSpecification/Requirements Contact discharge Air dischargeEN 61000-4-2Antenna interfaces ±1kV n.a.Antenna interfaces with ESD pro-tection (see Section 3.6.1)±4kV ±8kVBATT+ ±4kV ±8kVJEDEC JESD22-A114D (Human Body Model, Test conditions: 1.5 k, 100 pF)All other interfaces ±1kV n.a.Main/Diversity Antenna18pF22nHANT_MAIN/ANT_DRX(Pad 59/56)18pFT pad attenuator circuitMain/Diversity Antenna18nHANT_MAIN/ANT_DRX(Pad 59/56)4.7pFPI pad attenuator circuit18nH

Cinterion® ELS81-US Hardware Interface Description3.7 Blocking against RF on Interface Lines77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 75 of 1073.7 Blocking against RF on Interface LinesTo reduce EMI issues there are serial resistors, or capacitors to GND, implemented on themodule for the ignition, emergency restart, and SIM interface lines (cp. Section 2.3). However,all other signal lines have no EMI measures on the module and there are no blocking measuresat the module’s interface to an external application. Dependent on the specific application design, it might be useful to implement further EMI mea-sures on some signal lines at the interface between module and application. These measuresare described below.There are five possible variants of EMI measures (A-E) that may be implemented betweenmodule and external application depending on the signal line (see Figure 41 and Table 16). Payattention not to exceed the maximum input voltages and prevent voltage overshots if using in-ductive EMC measures.The maximum value of the serial resistor should be lower than 1k on the signal line. The max-imum value of the capacitor should be lower than 50pF on the signal line. Please observe theelectrical specification of the module‘s SMT application interface and the external application‘sinterface.Figure 41: EMI circuitsNote: In case the application uses an internal RF antenna that is implemented close to theELS81-US module, Gemalto strongly recommends sufficient EMI measures, e.g. of type B orC, for each digital input or output.CGNDSMTRApplicationEMI measures ASMTRApplicationEMI measures CCGNDSMTLApplicationEMI measures ECGNDSMT ApplicationEMI measures BSMTLApplicationEMI measures D

Cinterion® ELS81-US Hardware Interface Description3.7 Blocking against RF on Interface Lines77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 76 of 107The following table lists for each signal line at the module‘s SMT application interface the EMImeasures that may be implemented.Table 16: EMI measures on the application interfaceSignal name EMI measures RemarkABCDECCIN x xCCRST x The external capacitor should be not higher than 30pF. The value of the capacitor depends on the external application.CCIO xCCCLK xRXD0 xxxxxTXD0 xxxxxCTS0 xxxxxRTS0 xxxxxGPIO1/DTR0 xxxxxGPIO2/DCD0 xxxxxGPIO3/DSR0/SPI_CLKxxxxxGPIO4/FST_SHDN xxxxxGPIO5/LED xxxxxGPIO6/PWM2 xxxxxGPIO7/PWM1 xxxxxGPIO8/COUNTER xxxxxGPIO11-GPIO15 xxxxxGPIO16/RXD1/MOSIxxxxxGPIO17/TXD1/MISOxxxxxGPIO18/RTS1 xxxxxGPIO19/CTS1/SPI_CSxxxxxGPIO20 xxxxxGPIO21 xxxxxGPIO22 xxxxxGPIO23 xxxxxGPIO24/RING0 xxxxxI2CDAT x x The rising signal edge is reduced with an additional capacitor.I2CCLK x xV180 x x xVCORE x x xBATT+RF (pad 53) x x Measures required if BATT+RF is close to internal RF antenna -e.g., 39pF blocking capacitor to groundBATT+BB (pad 204) x xVUSB x x xUSB_DP It is not allowed to use any external ESD or EMI components at this interface signal lines.USB_DN

Cinterion® ELS81-US Hardware Interface Description3.8 Reliability Characteristics77els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 77 of 1073.8 Reliability CharacteristicsThe test conditions stated below are an extract of the complete test specifications. Table 17: Summary of reliability test conditionsType of test Conditions StandardVibration Frequency range: 10-20Hz; acceleration: 5gFrequency range: 20-500Hz; acceleration: 20gDuration: 20h per axis; 3 axesDIN IEC 60068-2-611. For reliability tests in the frequency range 20-500Hz the Standard’s acceleration reference value was increased to 20g.Shock half-sinus Acceleration: 500gShock duration: 1ms1 shock per axis6 positions (± x, y and z)DIN IEC 60068-2-27Dry heat Temperature: +70 ±2°CTest duration: 16hHumidity in the test chamber: < 50%EN 60068-2-2 Bb ETS 300 019-2-7Temperature change (shock)Low temperature: -40°C ±2°CHigh temperature: +85°C ±2°CChangeover time: < 30s (dual chamber system)Test duration: 1hNumber of repetitions: 100DIN IEC 60068-2-14 NaETS 300 019-2-7Damp heat cyclic High temperature: +55°C ±2°CLow temperature: +25°C ±2°CHumidity: 93% ±3%Number of repetitions: 6Test duration: 12h + 12hDIN IEC 60068-2-30 DbETS 300 019-2-5Cold (constant exposure)Temperature: -40 ±2°CTest duration: 16hDIN IEC 60068-2-1

Cinterion® ELS81-US Hardware Interface Description4 Mechanical Dimensions, Mounting and Packaging92els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 78 of 1074 Mechanical Dimensions, Mounting and Packaging4.1 Mechanical Dimensions of ELS81-USFigure 42 shows the top and bottom view of ELS81-US and provides an overview of the board's mechanical dimensions. For further details see Figure 43. Figure 42: ELS81-US– top and bottom viewProduct labelTop viewBottom view

Cinterion® ELS81-US Hardware Interface Description4.1 Mechanical Dimensions of ELS81-US92els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 79 of 107Figure 43: Dimensions of ELS81-US (all dimensions in mm)

Cinterion® ELS81-US Hardware Interface Description4.2 Mounting ELS81-US onto the Application Platform92els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 80 of 1074.2 Mounting ELS81-US onto the Application PlatformThis section describes how to mount ELS81-US onto the PCBs, including land pattern and stencil design, board-level characterization, soldering conditions, durability and mechanical handling. For more information on issues related to SMT module integration see also [3].Note: To avoid short circuits between signal tracks on an external application's PCB and vari-ous markings at the bottom side of the module, it is recommended not to route the signal tracks on the top layer of an external PCB directly under the module, or at least to ensure that signal track routes are sufficiently covered with solder resist.4.2.1 SMT PCB Assembly4.2.1.1 Land Pattern and StencilThe land pattern and stencil design as shown below is based on Gemalto characterizations for lead-free solder paste on a four-layer test PCB and a respectively 110 µm and 150 µm thick stencil. The land pattern given in Figure 44 reflects the module‘s pad layout, including signal pads and ground pads (for pad assignment see Section 2.1.1).Figure 44: Land pattern (top view)The stencil design illustrated in Figure 45 and Figure 46 is recommended by Gemalto M2M as a result of extensive tests with Gemalto M2M Daisy Chain modules.

Cinterion® ELS81-US Hardware Interface Description4.2 Mounting ELS81-US onto the Application Platform92els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 81 of 107The central ground pads are primarily intended for stabilizing purposes, and may show some more voids than the application interface pads at the module's rim. This is acceptable, since they are electrically irrelevant.Figure 45: Recommended design for 110µm thick stencil (top view)Figure 46: Recommended design for 150µm thick stencil (top view)

Cinterion® ELS81-US Hardware Interface Description4.2 Mounting ELS81-US onto the Application Platform92els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 85 of 1074.2.4 Durability and Mechanical Handling4.2.4.1 Storage ConditionsELS81-US modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier anti-static bags. The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal stor-age time under these conditions is 12 months maximum.Table 19: Storage conditionsType Condition Unit ReferenceAir temperature: LowHigh-25+40°C IPC/JEDEC J-STD-033AHumidity relative: LowHigh1090 at 40°C%IPC/JEDEC J-STD-033AAir pressure: LowHigh70106kPa IEC TR 60271-3-1: 1K4IEC TR 60271-3-1: 1K4Movement of surrounding air 1.0 m/s IEC TR 60271-3-1: 1K4Water: rain, dripping, icing and frostingNot allowed --- ---Radiation: SolarHeat1120600W/m2ETS 300 019-2-1: T1.2, IEC 60068-2-2 BbETS 300 019-2-1: T1.2, IEC 60068-2-2 BbChemically active substances Not recommendedIEC TR 60271-3-1: 1C1LMechanically active substances Not recommendedIEC TR 60271-3-1: 1S1Vibration sinusoidal:DisplacementAccelerationFrequency range1.552-9 9-200mmm/s2HzIEC TR 60271-3-1: 1M2Shocks:Shock spectrumDurationAccelerationsemi-sinusoidal150msm/s2IEC 60068-2-27 Ea

Cinterion® ELS81-US Hardware Interface Description4.2 Mounting ELS81-US onto the Application Platform92els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 86 of 1074.2.4.2 Processing LifeELS81-US must be soldered to an application within 72 hours after opening the moisture bar-rier bag (MBB) it was stored in.As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the modules should have ambient temperatures below 30°C and a relative humidity below 60%.4.2.4.3 BakingBaking conditions are specified on the moisture sensitivity label attached to each MBB (see Figure 52 for details):• It is not necessary to bake ELS81-US, if the conditions specified in Section 4.2.4.1 and Sec-tion 4.2.4.2 were not exceeded.• It is necessary to bake ELS81-US, if any condition specified in Section 4.2.4.1 and Section4.2.4.2 was exceeded.If baking is necessary, the modules must be put into trays that can be baked to at least 125°C. Devices should not be baked in tape and reel carriers at any temperature.4.2.4.4 Electrostatic DischargeElectrostatic discharge (ESD) may lead to irreversable damage for the module. It is therefore advisable to develop measures and methods to counter ESD and to use these to control the electrostatic environment at manufacturing sites.Please refer to Section 3.6 for further information on electrostatic discharge.

Cinterion® ELS81-US Hardware Interface Description4.3 Packaging92els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 87 of 1074.3 Packaging4.3.1 Tape and ReelThe single-feed tape carrier for ELS81-US is illustrated in Figure 48. The figure also shows the proper part orientation. The tape width is 44mm and the ELS81-US modules are placed on the tape with a 32-mm pitch. The reels are 330mm in diameter with a core diameter of 100mm. Each reel contains 500 modules.4.3.1.1 OrientationFigure 48: Carrier tapeFigure 49: Reel direction44mm330mmReel direction of the completely equipped tapeDirection into SMD machineView directionPad 1Pad 1

Cinterion® ELS81-US Hardware Interface Description4.3 Packaging92els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 88 of 1074.3.1.2 Barcode LabelA barcode label provides detailed information on the tape and its contents. It is attached to the reel. Figure 50: Barcode label on tape reelBarcode label

Cinterion® ELS81-US Hardware Interface Description4.3 Packaging92els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 89 of 1074.3.2 Shipping MaterialsELS81-US is distributed in tape and reel carriers. The tape and reel carriers used to distribute ELS81-US are packed as described below, including the following required shipping materials:• Moisture barrier bag, including desiccant and humidity indicator card• Transportation box4.3.2.1 Moisture Barrier BagThe tape reels are stored inside a moisture barrier bag (MBB), together with a humidity indica-tor card and desiccant pouches - see Figure 51. The bag is ESD protected and delimits mois-ture transmission. It is vacuum-sealed and should be handled carefully to avoid puncturing or tearing. The bag protects the ELS81-US modules from moisture exposure. It should not be opened until the devices are ready to be soldered onto the application. Figure 51: Moisture barrier bag (MBB) with imprintThe label shown in Figure 52 summarizes requirements regarding moisture sensitivity, includ-ing shelf life and baking requirements. It is attached to the outside of the moisture barrier bag.

Cinterion® ELS81-US Hardware Interface Description4.3 Packaging92els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 90 of 107Figure 52: Moisture Sensitivity Label

Cinterion® ELS81-US Hardware Interface Description4.3 Packaging92els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 91 of 107MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture. The desiccant pouches should not be baked or reused once removed from the MBB.The humidity indicator card is a moisture indicator and is included in the MBB to show the ap-proximate relative humidity level within the bag. Sample humidity cards are shown in Figure 53. If the components have been exposed to moisture above the recommended limits, the units will have to be rebaked.Figure 53: Humidity Indicator Card - HICA baking is required if the humidity indicator inside the bag indicates 10% RH or more.4.3.2.2 Transportation BoxTape and reel carriers are distributed in a box, marked with a barcode label for identification purposes. A box contains two reels with 500 modules each.

Cinterion® ELS81-US Hardware Interface Description4.3 Packaging92els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 92 of 1074.3.3 TraysIf small module quantities are required, e.g., for test and evaluation purposes, ELS81-US may be distributed in trays (for dimensions see Figure 54). The small quantity trays are an alterna-tive to the single-feed tape carriers normally used. However, the trays are not designed for ma-chine processing. They contain modules to be (hand) soldered onto an external application (for information on hand soldering see [3]).Trays are packed and shipped in the same way as tape carriers, including a moisture barrier bag with desiccant and humidity indicator card as well as a transportation box (see also Section 4.3.2).Figure 54: Tray dimensions

Cinterion® ELS81-US Hardware Interface Description5 Regulatory and Type Approval Information99els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 93 of 1075 Regulatory and Type Approval Information5.1 Directives and StandardsELS81-US is designed to comply with the directives and standards listed below.It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec-ifications provided in the "ELS81-US Hardware Interface Description”.11. Manufacturers of applications which can be used in the US shall ensure that their applications have aPTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module. Table 20: Directives2014/53/EU Directive of the European Parliament and of the council of 16 April 2014 on the harmonization of the laws of the Member States relating to the making available on the market of radio equipment and repealing Directive 1999/ 05/EC.The product is labeled with the CE conformity mark.2002/95/EC (RoHS 1)2011/65/EC (RoHS 2)Directive of the European Parliament and of the Council of 27 January 2003 (and revised on 8 June 2011) on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)Table 21: Standards of North American type approvalCFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommunications, PCS); US Equipment Authorization FCCOET Bulletin 65 (Edition 97-01) Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic FieldsUL 60 950-1 Product Safety Certification (Safety requirements)NAPRD.03 V5.15 Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI controlPCS Type Certification Review board (PTCRB)RSS132 (Issue2)RSS133 (Issue5)Canadian StandardTable 22: Standards of European type approval3GPP TS 51.010-1 Digital cellular telecommunications system (Release 9); Mobile Station (MS) conformance specification;GCF-CC V3.61.2 Global Certification Forum - Certification CriteriaETSI EN 301 511V12.5.1Global System for Mobile communications (GSM); Mobile Stations (MS)equipment; Harmonized Standard covering the essential requirements ofarticle 3.2 of Directive 2014/53/EU

Cinterion® ELS81-US Hardware Interface Description5.1 Directives and Standards99els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 94 of 107Draft ETSI EN 301 489-01 V2.2.0Electromagnetic Compatibility (EMC) standard for radio equipment and ser-vices; Part 1: Common technical requirements; Harmonized Standard cov-ering the essential requirements of article 3.1(b) of Directive 2014/53/EU and the essential requirements of article 6 of Directive 2014/30/EUDraft ETSI EN 301 489-52 V1.1.0Electromagnetic Compatibility (EMC) standard for radio equipment and ser-vices; Part 52: Specific conditions for Cellular Communication Mobile and portable (UE) radio and ancillary equipment; Harmonized Standard cover-ing the essential requirements of article 3.1(b) of Directive 2014/53/EUETSI EN 301 908-1V11.1.1IMT cellular networks; Harmonized Standard covering the essential require-ments of article 3.2 of the Directive 2014/53/EU; Part 1: Introduction andcommon requirementsETSI EN 301 908-13V11.1.1 IMT cellular networks; Harmonized Standard covering the essential requirements of article 3.2 of the Directive 2014/53/EU; Part 13: Evolved Universal Terrestrial Radio Access (E-UTRA) User Equipment (UE)EN 60950-1: 2006+A11:2009+A1:2010+A12:2011+A2:2013Safety of information technology equipmentTable 23: Requirements of qualityIEC 60068 Environmental testingDIN EN 60529 IP codesTable 24: Standards of the Ministry of Information Industry of the People’s Republic of ChinaSJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Sub-stances in Electronic Information Products” (2006-06).SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic Information Products” (2006-06).According to the “Chinese Administration on the Control of Pollution caused by Electronic Information Products” (ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Gemalto M2M Hardware Interface Description.Please see Table 25 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006. Table 22: Standards of European type approval

Cinterion® ELS81-US Hardware Interface Description5.1 Directives and Standards99els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 95 of 107Table 25: Toxic or hazardous substances or elements with defined concentration limits

Cinterion® ELS81-US Hardware Interface Description5.2 SAR requirements specific to portable mobiles99els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 96 of 1075.2 SAR requirements specific to portable mobilesMobile phones, PDAs or other portable transmitters and receivers incorporating a UMTS mod-ule must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable ELS81-US based applications to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For US-markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US marketsES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in thefrequency range 30MHz - 6GHz Please note that SAR requirements are specific only for portable devices and not for mobile devices as defined below:• Portable device:A portable device is defined as a transmitting device designed to be used so that the radi-ating structure(s) of the device is/are within 20 centimeters of the body of the user.• Mobile device:A mobile device is defined as a transmitting device designed to be used in other than fixedlocations and to generally be used in such a way that a separation distance of at least 20centimeters is normally maintained between the transmitter's radiating structure(s) and thebody of the user or nearby persons. In this context, the term ''fixed location'' means that thedevice is physically secured at one location and is not able to be easily moved to anotherlocation.

Cinterion® ELS81-US Hardware Interface Description5.3 Reference Equipment for Type Approval99els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 97 of 1075.3 Reference Equipment for Type ApprovalThe Gemalto M2M reference setup submitted to type approve ELS81-US (including a special approval adapter for the DSB75) is shown in the following figure1:Figure 55: Reference equipment for Type Approval1. For RF performance tests a mini-SMT/U.FL to SMA adapter with attached 6dB coaxial attenuator is cho-sen to connect the evaluation module directly to the UMTS test equipment instead of employing the SMAantenna connectors on the ELS81-US-DSB75 adapter as shown in Figure 55. The following products arerecommended: Hirose SMA-Jack/U.FL-Plug conversion adapter HRMJ-U.FLP(40)(for details see http://www.hirose-connectors.com/ or http://www.farnell.com/Aeroflex Weinschel Fixed Coaxial Attenuator Model 3T/4T (for details see http://www.aeroflex.com/ams/weinschel/pdfiles/wmod3&4T.pdf)DSB75AH6‐AdapterSIMCard SMASMASMAUSBPCPowerSupplyLTE/GPRS/UMTSBaseStationDiversityAntennaUSBASC0MainAntennaEval_BoardELS61Eval_BoardELS61ASC1

Cinterion® ELS81-US Hardware Interface Description5.4 Compliance with FCC and IC Rules and Regulations99els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 98 of 1075.4 Compliance with FCC and IC Rules and RegulationsThe Equipment Authorization Certification for the Gemalto M2M reference application de-scribed in Section 5.3 will be registered under the following identifiers:FCC Identifier: QIPELS81-USIndustry Canada Certification Number: 7830A-ELS81USGranted to Gemalto M2M GmbH Manufacturers of mobile or fixed devices incorporating ELS81-US modules are authorized to use the FCC Grants and Industry Canada Certificates of the ELS81-US modules for their own final products according to the conditions referenced in these documents. In this case, an FCC/ IC label of the module shall be visible from the outside, or the host device shall bear a second label stating "Contains FCC ID: QIPELS81-US", and accordingly “Contains IC: 7830A-ELS81US“. The integration is limited to fixed or mobile categorized host devices, where a separation distance be-tween the antenna and any person of min. 20cm can be assured during normal operating con-ditions. For mobile and fixed operation configurations the antenna gain, including cable loss, must not exceed the limit 2.15 dBi for 700MHz, 850MHz, 1700MHz and 1900MHz.IMPORTANT: Manufacturers of portable applications incorporating ELS81-US modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for por-table mobiles (see Section 5.2 for detail).Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with Industry Canada license-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful inter-ference in a residential installation. This equipment generates, uses and can radiate radio fre-quency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver isconnected.• Consult the dealer or an experienced radio/TV technician for help.This Class B digital apparatus complies with Canadian ICES-003.

Cinterion® ELS81-US Hardware Interface Description5.4 Compliance with FCC and IC Rules and Regulations99els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 99 of 107If Canadian approval is requested for devices incorporating ELS81-US modules the below notes will have to be provided in the English and French language in the final user documen-tation. Manufacturers/OEM Integrators must ensure that the final user documentation does not contain any information on how to install or remove the module from the final product.Notes (IC): (EN) This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Opera-tion is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.(FR) Cet appareil numérique de classe B est conforme aux normes canadiennes ICES-003 et RSS-210. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interférence et (2) cet appareil doit accepter toute interférence, notamment les interférences qui peuvent affecter son fonctionnement.(EN) Radio frequency (RF) Exposure InformationThe radiated output power of the Wireless Device is below the Industry Canada (IC) radio fre-quency exposure limits. The Wireless Device should be used in such a manner such that the potential for human contact during normal operation is minimized.This device has also been evaluated and shown compliant with the IC RF Exposure limits un-der mobile exposure conditions. (antennas at least 20cm from a person‘s body).(FR) Informations concernant l'exposltion aux fréquences radio (RF)La puissance de sortie émise par l'appareil de sans fiI est inférieure à la limite d'exposition aux fréquences radio d‘Industry Canada (IC). Utilisez l'appareil de sans fil de façon à minimiser les contacts humains lors du fonctionnement normal.Ce périphérique a également été évalué et démontré conforme aux limites d'exposition aux RF d'IC dans des conditions d'exposition à des appareils mobiles (les antennes se situent à moins de 20cm du corps d'une personne).

Cinterion® ELS81-US Hardware Interface Description6 Document Information104els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 100 of 1076 Document Information6.1 Revision HistoryNew document: "Cinterion® ELS81-US Hardware Interface Description" Version 01.0046.2 Related Documents[1] ELS81-US AT Command Set[2] ELS81-US Release Note[3] Application Note 48: SMT Module Integration[4] Application Note 40: Thermal Solutions[5] Universal Serial Bus Specification Revision 2.0, April 27, 20006.3 Terms and AbbreviationsChapter What is new-- Initial document setup.Abbreviation DescriptionADC Analog-to-digital converterAGC Automatic Gain ControlANSI American National Standards InstituteARFCN Absolute Radio Frequency Channel NumberARP Antenna Reference PointASC0/ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of ELS81-USB Thermistor ConstantBER Bit Error RateBIP Bearer Independent ProtocolBTS Base Transceiver StationCB or CBM Cell Broadcast MessageCE Conformité Européene (European Conformity)CHAP Challenge Handshake Authentication ProtocolCPU Central Processing UnitCS Coding SchemeCSD Circuit Switched Data

Cinterion® ELS81-US Hardware Interface Description6.3 Terms and Abbreviations104els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 101 of 107CTS Clear to SendDAC Digital-to-Analog ConverterdBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-lawDCE Data Communication Equipment (typically modems, e.g. Gemalto M2M module)DRX Discontinuous ReceptionDSB Development Support BoxDSP Digital Signal ProcessorDSR Data Set ReadyDTE Data Terminal Equipment (typically computer, terminal, printer or, for example, UMTS application)DTR Data Terminal ReadyDTX Discontinuous TransmissionEFR Enhanced Full RateEIRP Equivalent Isotropic Radiated PowerEMC Electromagnetic CompatibilityERP Effective Radiated PowerESD Electrostatic DischargeETS European Telecommunication StandardETSI European Telecommunication Standards InstituteFCC Federal Communications Commission (U.S.)FDMA Frequency Division Multiple AccessFR Full RateGMSK Gaussian Minimum Shift KeyingGPIO General Purpose Input/OutputHiZ High ImpedanceHR Half RateI/O Input/OutputIC Integrated CircuitIMEI International Mobile Equipment IdentityISO International Standards OrganizationITU International Telecommunications Unionkbps kbits per secondLED Light Emitting DiodeLi-Ion/Li+ Lithium-IonLi battery Rechargeable Lithium Ion or Lithium Polymer batteryLPM Link Power ManagementMbps Mbits per secondMMI Man Machine InterfaceAbbreviation Description

Cinterion® ELS81-US Hardware Interface Description6.3 Terms and Abbreviations104els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 102 of 107MO Mobile OriginatedMS Mobile Station (UMTS module), also referred to as TEMSISDN Mobile Station International ISDN numberMT Mobile TerminatedNTC Negative Temperature CoefficientOEM Original Equipment ManufacturerPA Power AmplifierPAP Password Authentication ProtocolPBCCH Packet Switched Broadcast Control ChannelPCB Printed Circuit BoardPCL Power Control LevelPDU Protocol Data UnitPLL Phase Locked LoopPPP Point-to-point protocolPSK Phase Shift KeyingPSU Power Supply UnitPWM Pulse Width ModulationR&TTE Radio and Telecommunication Terminal EquipmentRAM Random Access MemoryRF Radio FrequencyRLS Radio Link StabilityRMS Root Mean Square (value)RoHS Restriction of the use of certain hazardous substances in electrical and electronic equipment. ROM Read-only MemoryRTC Real Time ClockRTS Request to SendRx Receive DirectionSAR Specific Absorption RateSAW Surface Accoustic WaveSELV Safety Extra Low VoltageSIM Subscriber Identification ModuleSMD Surface Mount DeviceSMS Short Message ServiceSMT Surface Mount TechnologySPI Serial Peripheral InterfaceSRAM Static Random Access MemoryTA Terminal adapter (e.g. UMTS module)Abbreviation Description

Cinterion® ELS81-US Hardware Interface Description6.3 Terms and Abbreviations104els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 103 of 107TDMA Time Division Multiple AccessTE Terminal Equipment, also referred to as DTETLS Transport Layer SecurityTx Transmit DirectionUART Universal asynchronous receiver-transmitterURC Unsolicited Result CodeUSSD Unstructured Supplementary Service DataVSWR Voltage Standing Wave RatioAbbreviation Description

Cinterion® ELS81-US Hardware Interface Description6.4 Safety Precaution Notes104els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 104 of 1076.4 Safety Precaution NotesThe following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating ELS81-US. Manufacturers of the cellular terminal are advised to convey the following safety information to users and oper-ating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Gemalto M2M assumes no liability for customer’s failure to comply with these precautions.When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hear-ing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both.Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any elec-trical equipment in potentially explosive atmospheres can constitute a safety hazard.Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger.Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-ing a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or opera-tion can constitute a safety hazard.IMPORTANT!Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call.Some networks require that a valid SIM card be properly inserted in the cellular termi-nal or mobile.

Cinterion® ELS81-US Hardware Interface Description7 Appendix106els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 105 of 1077 Appendix7.1 List of Parts and AccessoriesTable 26: List of parts and accessoriesDescription Supplier Ordering informationELS81-US Gemalto M2M Standard module Gemalto M2M IMEI:Packaging unit (ordering) number: L30960-N5450-A100 Module label number: L30960-N5450-A100-111. Note: At the discretion of Gemalto M2M, module label information can either be laser engraved on the module’s shielding or be printed on a label adhered to the module’s shielding. ELS81-US Evaluation Mod-uleGemalto M2M Ordering number: TBDDSB75 Evaluation Kit Gemalto M2M Ordering number: L36880-N8811-A100DSB MiniCompact Evaluation BoardGemalto M2M Ordering number: L30960-N0030-A100Starter Kit B80 Gemalto M2M Ordering Number L30960-N0040-A100Multi-Adapter R1 for mount-ing ELS81-US evaluation modules onto DSB75Gemalto M2M Ordering number: L30960-N0010-A100Approval adapter for mount-ing ELS81-US evaluation modules onto DSB75Gemalto M2M Ordering number: L30960-N2301-A100SIM card holder incl. push button ejector and slide-in trayMolex Ordering numbers: 91228 91236Sales contacts are listed in Table 27.

Cinterion® ELS81-US Hardware Interface Description7.1 List of Parts and Accessories106els81-us_hid_v01.004 2017-09-27Confidential / PreliminaryPage 106 of 107Table 27: Molex sales contacts (subject to change)MolexFor further information please click:http://www.molex.comMolex Deutschland GmbHOtto-Hahn-Str. 1b69190 WalldorfGermanyPhone: +49-6227-3091-0Fax: +49-6227-3091-8100Email: mxgermany@molex.comAmerican HeadquartersLisle, Illinois 60532U.S.A.Phone: +1-800-78MOLEXFax: +1-630-969-1352Molex China DistributorsBeijing, Room 1311, Tower B, COFCO PlazaNo. 8, Jian Guo Men Nei Street, 100005BeijingP.R. ChinaPhone: +86-10-6526-9628 Fax: +86-10-6526-9730Molex Singapore Pte. Ltd.110, International RoadJurong Town, Singapore 629174Phone: +65-6-268-6868Fax: +65-6-265-6044Molex Japan Co. Ltd.1-5-4 Fukami-Higashi,Yamato-City,Kanagawa, 242-8585 JapanPhone: +81-46-265-2325Fax: +81-46-265-2365