THALES DIS AlS Deutschland MC55 Transmitter module for mobile applications User Manual mc55 56 hid v0103a

Gemalto M2M GmbH Transmitter module for mobile applications mc55 56 hid v0103a

Contents

Exhibit 8 User Manual

MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 1 of 101 23.01.2004 MC55/56 Siemens Cellular Engine Version: 01.03a DocID: MC55/56_hid_v01.03a
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 2 of 101 23.01.2004 Document Name: MC55/56 Hardware Interface Description Version: 01.03a Date: January 23, 2004 DocId: MC55/56_hid_v01.03a Status: Confidential / Released General Notes Product is deemed accepted by recipient and is provided without interface to recipient’s products. The documentation and/or product are provided for testing, evaluation, integration and information purposes. The documentation and/or product are provided on an “as is” basis only and may contain deficiencies or inadequacies. The documentation and/or product are provided without warranty of any kind, express or implied. To the maximum extent permitted by applicable law, Siemens further disclaims all warranties, including without limitation any implied warranties of merchantability, completeness, fitness for a particular purpose and non-infringement of third-party rights. The entire risk arising out of the use or performance of the product and documentation remains with recipient. This product is not intended for use in life support appliances, devices or systems where a malfunction of the product can reasonably be expected to result in personal injury. Applications incorporating the described product must be designed to be in accordance with the technical specifications provided in these guidelines. Failure to comply with any of the required procedures can result in malfunctions or serious discrepancies in results. Furthermore, all safety instructions regarding the use of mobile technical systems, including GSM products, which also apply to cellular phones must be followed. Siemens or its suppliers shall, regardless of any legal theory upon which the claim is based, not be liable for any consequential, incidental, direct, indirect, punitive or other damages whatsoever (including, without limitation, damages for loss of business profits, business interruption, loss of business information or data, or other pecuniary loss) arising out the use of or inability to use the documentation and/or product, even if Siemens has been advised of the possibility of such damages. The foregoing limitations of liability shall not apply in case of mandatory liability, e.g. under the German Product Liability Act, in case of intent, gross negligence, injury of life, body or health, or breach of a condition which goes to the root of the contract. However, claims for damages arising from a breach of a condition, which goes to the root of the contract, shall be limited to the foreseeable damage, which is intrinsic to the contract, unless caused by intent or gross negligence or based on liability for injury of life, body or health. The above provision does not imply a change on the burden of proof to the detriment of the recipient. Subject to change without notice at any time. The interpretation of this general note shall be governed and construed according to German law without reference to any other substantive law. Copyright Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright © Siemens AG 2004
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 3 of 101 23.01.2004 Contents 0 Document History ...................................................................................................... 7 1 Introduction ................................................................................................................ 8 1.1 Related documents ............................................................................................. 8 1.2 Terms and abbreviations..................................................................................... 9 1.3 Type approval ....................................................................................................12 1.4 Safety precautions .............................................................................................14 2 Product concept........................................................................................................16 2.1 MC55/56 key features at a glance......................................................................17 2.2 Circuit concept ...................................................................................................20 3 Application Interface.................................................................................................22 3.1 Operating modes ...............................................................................................23 3.2 Power supply .....................................................................................................25 3.2.1 Power supply pins on the board-to-board connector.............................25 3.2.2 Minimizing power losses.......................................................................26 3.2.3 Monitoring power supply.......................................................................26 3.3 Power up / down scenarios ................................................................................27 3.3.1 Turn on MC55/56 .................................................................................27 3.3.1.1 Turn on MC55/56 using the ignition line /IGT (Power on)..........28 3.3.1.2 Timing of the ignition process ...................................................29 3.3.1.3 Turn on MC55/56 using the POWER signal ..............................30 3.3.1.4 Turn on MC55/56 using the RTC (Alarm mode) ........................30 3.3.2 Turn off MC55/56 .................................................................................32 3.3.2.1 Turn off MC55/56 using AT command ......................................32 3.3.2.2 Maximum number of turn-on / turn-off cycles ............................32 3.3.2.3 Emergency shutdown using /EMERGOFF pin...........................33 3.3.3 Automatic shutdown .............................................................................34 3.3.3.1 Temperature dependent shutdown............................................34 3.3.3.2 Temperature control during emergency call ..............................35 3.3.3.3 Undervoltage shutdown if battery NTC is present .....................35 3.3.3.4 Undervoltage shutdown if no battery NTC is present ................36 3.3.3.5 Overvoltage shutdown ..............................................................36 3.4 Automatic GPRS Multislot Class change............................................................37 3.5 Charging control.................................................................................................38 3.5.1 Battery pack characteristics..................................................................39 3.5.1.1 Recommended battery pack .....................................................40 3.5.2 Implemented charging technique..........................................................41 3.5.3 Operating modes during charging ........................................................42 3.5.4 Charger requirements ..........................................................................43 3.6 Power saving .....................................................................................................44 3.6.1 No power saving (AT+CFUN=1)...........................................................44 3.6.2 NON-CYCLIC SLEEP mode (AT+CFUN=0) .........................................44 3.6.3 CYCLIC SLEEP mode (AT+CFUN=5, 6, 7 and 8) ................................45 3.6.4 Timing of the /CTS signal in CYCLIC SLEEP modes ...........................45 3.6.5 Wake up MC55/56 from SLEEP mode .................................................47 3.7 Summary of state transitions (except SLEEP mode)..........................................48 3.8 RTC backup.......................................................................................................49 3.9 Serial interfaces .................................................................................................50
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 4 of 101 23.01.2004 3.9.1 Features supported on first and second serial interface .......................51 3.10 Audio interfaces .................................................................................................53 3.10.1 Microphone circuit ................................................................................54 3.10.2 Speech processing ...............................................................................55 3.10.3 DAI timing.............................................................................................55 3.11 SIM interface......................................................................................................57 3.11.1 Requirements for using the CCIN pin ...................................................58 3.11.2 Design considerations for SIM card holder ...........................................59 3.12 Control signals ...................................................................................................60 3.12.1 Inputs ...................................................................................................60 3.12.2 Outputs.................................................................................................61 3.12.2.1 Synchronization signal .........................................................61 3.12.2.2 Using the SYNC pin to control a status LED ........................62 3.12.2.3 Behaviour of the /RING0 line (ASC0 interface only).............63 4 Antenna interface......................................................................................................64 4.1 Antenna installation............................................................................................64 4.1.1 Antenna pad .........................................................................................66 4.1.1.1 Suitable cable types ..................................................................66 4.1.2 Hirose antenna connector ....................................................................67 5 Electrical, reliability and radio characteristics .......................................................71 5.1 Absolute maximum ratings.................................................................................71 5.2 Operating temperatures .....................................................................................71 5.3 Electrical specifications of the application interface............................................72 5.4 Power supply ratings..........................................................................................76 5.4.1 Current consumption during transmit burst...........................................77 Electrical characteristics of the voiceband part............................................................82 5.4.2 Setting audio parameters by AT commands.........................................82 5.4.3 Audio programming model ...................................................................83 5.4.4 Characteristics of audio modes ............................................................84 5.4.5 Voiceband receive path ........................................................................85 5.4.6 Voiceband transmit path.......................................................................86 5.5 Air interface........................................................................................................87 5.6 Electrostatic discharge.......................................................................................88 5.7 Reliability characteristics ....................................................................................89 6 Mechanics..................................................................................................................90 6.1 Mechanical dimensions of MC55/56...................................................................90 6.2 Mounting MC55/56 onto the application platform ...............................................92 6.3 Board-to-board connector ..................................................................................93 6.3.1 Mechanical dimensions of the Hirose DF12 connector .........................94 6.3.2 Adapter cabling ....................................................................................94 6.4 Heat sinks and thermally conductive tapes ........................................................95 6.4.1 Test conditions and results...................................................................95 7 Reference Approval ..................................................................................................97 7.1 Reference Equipment for Type Approval ...........................................................97 7.2 Compliance with FCC Rules and Regulations (MC55 only)................................98 7.3 Compliance with FCC Rules and Regulations (MC56 only)................................99 8 List of parts and accessories.................................................................................100
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 5 of 101 23.01.2004 Figures Figure 1: MC55/56 block diagram ........................................................................................21 Figure 2: Power supply limits during transmit burst ..............................................................26 Figure 3: Power-on by ignition signal....................................................................................28 Figure 4: Timing of power-on process if VDDLP is not used ................................................29 Figure 5: Timing of power-on process if VDDLP is fed from external source........................29 Figure 6: Deactivating GSM engine by /EMERGOFF signal.................................................33 Figure 7: Schematic of approved charging transistor, trickle charging and ESD protection..38 Figure 8: Battery pack circuit diagram ..................................................................................39 Figure 9: Charging process ..................................................................................................41 Figure 10: Timing of /CTS signal (example for a 2.12 s paging cycle)..................................46 Figure 11: Beginning of power saving if CFUN=5 or 7..........................................................46 Figure 12: RTC supply from capacitor..................................................................................49 Figure 13: RTC supply from rechargeable battery................................................................49 Figure 14: RTC supply from non-chargeable battery............................................................49 Figure 15: Serial interfaces ..................................................................................................50 Figure 16: Audio block diagram............................................................................................53 Figure 17: Schematic of microphone inputs .........................................................................54 Figure 18: DAI timing on transmit path .................................................................................56 Figure 19: DAI timing on receive path ..................................................................................56 Figure 20: SIM card holder of DSB45 Support Box ..............................................................59 Figure 21: Pin numbers of Molex SIM card holder on DSB45 Support Box ..........................59 Figure 22: SYNC signal during transmit burst ......................................................................61 Figure 23: LED Circuit (Example).........................................................................................62 Figure 24: Incoming voice call..............................................................................................63 Figure 25: Incoming data call ...............................................................................................63 Figure 26: URC transmission ...............................................................................................63 Figure 27: U.FL-R-SMT connector .......................................................................................64 Figure 28: Antenna pad and GND plane ..............................................................................64 Figure 29: Never use antenna connector and antenna pad at the same time.......................65 Figure 30: Restricted area around antenna pad ...................................................................65 Figure 31: Mechanical dimensions of U.FL-R-SMT connector..............................................67 Figure 32: U.FL-R-SMT connector with U.FL-LP-040 plug ...................................................68 Figure 33: U.FL-R-SMT connector with U.FL-LP-066 plug ...................................................68 Figure 34: Specifications of U.FL-LP-(V)-040(01) plug .........................................................69 Figure 35: Pin assignment (top view on MC55) ....................................................................72 Figure 36: Typical current consumption vs. power control level............................................80 Figure 37: Typical current consumption vs. return loss.........................................................81 Figure 38: AT audio programming model .............................................................................83 Figure 39: MC55/56 – top view.............................................................................................90 Figure 40: Mechanical dimensions of MC55/56....................................................................91 Figure 41: MC55/56 bottom view..........................................................................................92 Figure 42: Hirose DF12C receptacle on MC55/56 ................................................................93 Figure 43: Header Hirose DF12 series .................................................................................93 Figure 44: Mechanical dimensions of Hirose DF12 connector..............................................94 Figure 45: Reference equipment for approval ......................................................................97
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 6 of 101 23.01.2004 Tables Table 1: MC55/56 key features ............................................................................................17 Table 2: Coding schemes and maximum net data rates over air interface ...........................19 Table 3: Overview of operating modes .................................................................................23 Table 4: Power supply pins of board-to-board connector .....................................................25 Table 5: AT commands available in Alarm mode .................................................................30 Table 6: Temperature dependent behaviour.........................................................................35 Table 7: Bill of material for external charging circuit .............................................................38 Table 8: Specifications of XWODA battery pack ..................................................................40 Table 9: Comparison Charge-only and Charge mode ..........................................................42 Table 10: AT commands available in Charge-only mode......................................................43 Table 11: Wake-up events in NON-CYCLIC and CYCLIC SLEEP modes............................47 Table 12: State transitions of MC55/56 (except SLEEP mode) ............................................48 Table 13: DCE-DTE wiring of 1st serial interface .................................................................51 Table 14: DCE-DTE wiring of 2nd serial interface ................................................................52 Table 15: Signals of the SIM interface (board-to-board connector) ......................................57 Table 16: Pin assignment of Molex SIM card holder on DSB45 Support Box .......................59 Table 17: Input control signals of the MC55/56 module........................................................60 Table 18: MC55/56 synchronization signal (if SYNC pin is set to mode 0 via AT^SSYNC)...61 Table 19: Coding of the status LED......................................................................................62 Table 20: MC55/56 ring signal..............................................................................................63 Table 21: Return loss ...........................................................................................................64 Table 22: Product specifications of U.FL-R-SMT connector .................................................67 Table 23: Material and finish of U.FL-R-SMT connector and recommended plugs ...............68 Table 24: Ordering information for Hirose U.FL Series.........................................................70 Table 25: Absolute maximum ratings ...................................................................................71 Table 26: Operating temperatures........................................................................................71 Table 27: Electrical description of application interface ........................................................73 Table 28: Power supply ratings ............................................................................................76 Table 29: Audio parameters adjustable by AT command .....................................................82 Table 30: Voiceband characteristics (typical) .......................................................................84 Table 31: Voiceband receive path ........................................................................................85 Table 32: Voiceband transmit path.......................................................................................86 Table 33: Air Interface..........................................................................................................87 Table 34: Measured electrostatic values ..............................................................................88 Table 35: Summary of reliability test conditions....................................................................89 Table 36: Ordering information DF12 series.........................................................................93 Table 37: Electrical and mechanical characteristics of the Hirose DF12C connector............93 Table 38: Tested heat sinks and thermally conductive tapes and test results ......................96 Table 39: List of parts and accessories ..............................................................................100 Table 40: Molex sales contacts (subject to change) ...........................................................101 Table 41: Hirose sales contacts (subject to change) ..........................................................101
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 7 of 101 23.01.2004 0 Document History Preceding document: "MC55/56 Hardware Interface Description" Version 01.03 New document: "MC55/56 Hardware Interface Description" Version 01.03a Chapter Page What is new 7.2, 7.3 98, 99 Corrected MC55 and MC56 specific information on FFC compliance Preceding document: "MC55/56 Hardware Interface Description" Version 01.02 New document: "MC55/56 Hardware Interface Description" Version 01.03 Chapter Page What is new 1.3 12 Note on necessary FCC certification added. Updated document: "MC55/56 Hardware Interface Description" Version 01.02
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 8 of 101 23.01.2004 1 Introduction This document describes the hardware interface of the Siemens MC55/56 module that connects to the cellular device application and the air interface. As MC55/56 is intended to integrate with a wide range of application platforms, all functional components are described in great detail. This guide therefore covers all information needed to design and set up cellular applications incorporating the MC55/56 module. It aids rapid retrieval of interface specifications, electrical and mechanical details and information on the requirements to be considered for integration of further components. 1.1 Related documents [1] MC55/56 AT Command, Version 01.02 [2] MC55/56 Release Notes, Version 01.02 [3] GPRS Startup User's Guide [4] Remote-SAT User's Guide [5] DSB45 Support Box - Evaluation Kit for Siemens Cellular Engines [6] Application Note 23: Installing MC55/56 on DSB45 [7] Application Note 16: Upgrading MC45 Firmware, Version 0.5 [8] Application Note 14: Audio and Battery Parameter Download [9] Application Note 02: Audio Interface Design [10] Multiplexer User's Guide [11] Multiplex Driver Developer’s Guide for Windows 2000 and Windows XP [12] Multiplex Driver Installation Guide for Windows 2000 and Windows XP [13] Application Note 22: Using TTY / CTM equipment with MC45 [14] Application Note 24: Application Developer’s Guide Prior to using the MC55/56 engines or upgrading to a new firmware release, be sure to carefully read the latest product information. To visit the Siemens Website you can use the following link: http://www.siemens.com/wm
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 9 of 101 23.01.2004 1.2 Terms and abbreviations Abbreviation Description ADC Analog-to-Digital Converter AFC Automatic Frequency Control AGC Automatic Gain Control ANSI American National Standards Institute ARFCN Absolute Radio Frequency Channel Number ARP Antenna Reference Point ASC0 / ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of MC55/56 ASIC Application Specific Integrated Circuit B Thermistor Constant B2B Board-to-board connector BER Bit Error Rate BTS Base Transceiver Station CB or CBM Cell Broadcast Message CE Conformité Européene (European Conformity) CHAP Challenge Handshake Authentication Protocol CPU Central Processing Unit CS Coding Scheme CSD Circuit Switched Data CTS Clear to Send DAC Digital-to-Analog Converter DAI Digital Audio Interface dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law DCE Data Communication Equipment (typically modems, e.g. Siemens GSM engine) DCS 1800 Digital Cellular System, also referred to as PCN DRX Discontinuous Reception DSB Development Support Box DSP Digital Signal Processor DSR Data Set Ready DTE Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM application) DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate EGSM Enhanced GSM
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 10 of 101 23.01.2004 Abbreviation Description EMC Electromagnetic Compatibility ESD Electrostatic Discharge ETS European Telecommunication Standard FCC Federal Communications Commission (U.S.) FDMA Frequency Division Multiple Access FR Full Rate GMSK Gaussian Minimum Shift Keying GPRS General Packet Radio Service GSM Global Standard for Mobile Communications HiZ High Impedance HR Half Rate I/O Input/Output IC Integrated Circuit IMEI International Mobile Equipment Identity ISO International Standards Organization ITU International Telecommunications Union kbps kbits per second LED Light Emitting Diode Li-Ion Lithium-Ion Mbps Mbits per second MMI Man Machine Interface MO Mobile Originated MS Mobile Station (GSM engine), also referred to as TE MSISDN Mobile Station International ISDN number MT Mobile Terminated NTC Negative Temperature Coefficient OEM Original Equipment Manufacturer PA Power Amplifier PAP Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel PCB Printed Circuit Board PCL Power Control Level PCM Pulse Code Modulation PCN Personal Communications Network, also referred to as DCS 1800 PCS Personal Communication System, also referred to as GSM 1900 PDU Protocol Data Unit PLL Phase Locked Loop
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 11 of 101 23.01.2004 Abbreviation Description PPP Point-to-point protocol PSU Power Supply Unit R&TTE Radio and Telecommunication Terminal Equipment RAM Random Access Memory RF Radio Frequency RMS Root Mean Square (value) ROM Read-only Memory RTC Real Time Clock Rx Receive Direction SAR Specific Absorption Rate SELV Safety Extra Low Voltage SIM Subscriber Identification Module SMS Short Message Service SRAM Static Random Access Memory TA Terminal adapter (e.g. GSM engine) TDMA Time Division Multiple Access TE Terminal Equipment, also referred to as DTE Tx Transmit Direction UART Universal asynchronous receiver-transmitter URC Unsolicited Result Code USSD Unstructured Supplementary Service Data VSWR Voltage Standing Wave Ratio Phonebook abbreviations FD SIM fixdialing phonebook LD SIM last dialling phonebook (list of numbers most recently dialled) MC Mobile Equipment list of unanswered MT calls (missed calls) ME Mobile Equipment phonebook ON Own numbers (MSISDNs) stored on SIM or ME RC Mobile Equipment list of received calls SM SIM phonebook
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 12 of 101 23.01.2004 1.3 Type approval MC55/56 is designed to comply with the directives and standards listed below. Please note that the product is still in a pre-release state and, therefore, type approval and testing procedures have not yet been completed. European directives 99/05/EC “Directive of the European Parliament and of the council of 9 March 1999 on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity”, in short referred to as R&TTE Directive 1999/5/EC 89/336/EC Directive on electromagnetic compatibility 73/23/EC Directive on electrical equipment designed for use within certain voltage limits (Low Voltage Directive) Standards of North American Type Approval CFR Title 47 “Code of Federal Regulations, Part 2 and Part 24 (Telecommunications, PCS)” US Equipment Authorization FCC UL 60 950 “Product Safety Certification” (Safety requirements) NAPRD.3 “Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI control” PCS Type Certification Review board (PTCRB) Standards of European Type Approval 3GPP TS 51.010-1 “Digital cellular telecommunications system (Phase 2); Mobile Station (MS) conformance specification”. ETSI EN 301 511 “V7.0.1 (2000-12) Candidate Harmonized European Standard (Telecommunications series) Global System for Mobile communications (GSM); Harmonized standard for mobile stations in the GSM 900 and DCS 1800 bands covering essential requirements under article 3.2 of the R&TTE directive (1999/5/EC) (GSM 13.11 version 7.0.1 Release 1998)” GCF-CC “Global Certification Forum - Certification Criteria” ETSI EN 301 489-1 “V1.1.1 (2000-09) Candidate Harmonized European Standard (Telecommunications series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Electro Magnetic Compatibility (EMC) standard for radio equipment and services; Part 1: Common Technical Requirements” ETSI EN 301 489-7 “V1.1.1 (2000-09) Candidate Harmonized European Standard (Telecommunications series) Electro Magnetic Compatibility and
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 13 of 101 23.01.2004 Radio spectrum Matters (ERM); Electro Magnetic Compatibility (EMC) standard for radio equipment and services; Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular radio telecommunications systems (GSM and DCS)” EN 60 950 Safety of information technology equipment (2000) Requirements of quality IEC 60068 Environmental testing DIN EN 60529 IP codes Compliance with international rules and regulations Manufacturers of mobile or fixed devices incorporating MC55/56 modules are advised to have their completed product tested and approved for compliance with all applicable national and international regulations. As a tri-band GSM/GPRS engine designed for use on any GSM network in the world, MC55/56 is required to pass all approvals relevant to operation on the European and North American markets. For the North American market this includes the Rules and Regulations of the Federal Communications Commission (FCC) and PTCRB, for the European market the R&TTE Directives and GCF Certification Criteria must be fully satisfied. The FCC Equipment Authorization granted to the MC55/56 Siemens reference application is valid only for the equipment described in Chapter 7. SAR requirements specific to handheld mobiles Mobile phones, PDAs or other handheld transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of handheld MC55/56 based applications to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for handheld operation. For European and US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations of directives are in force outside these areas. Products intended for sale on US markets ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz-6GHz Products intended for sale on European markets EN 50360 Product standard to demonstrate the compliance of mobile phones with the basic restrictions related to human exposure to electromagnetic fields (300 MHz - 3 GHz) Note: Usage of MC55/56 in a handheld or portable application is not allowed without a new FCC certification.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 14 of 101 23.01.2004 1.4 Safety precautions The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating MC55/56. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Siemens AG assumes no liability for customer failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guidelines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufacturer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it cannot be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for handsfree operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Handsfree devices must be installed by qualified personnel. Faulty installation or operation can constitute a safety hazard.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 15 of 101 23.01.2004 SOS IMPORTANT! Cellular terminals or mobiles operate using radio signals and cellular networks cannot be guaranteed to connect in all conditions. Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialling etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 16 of 101 23.01.2004 2 Product concept Designed for use on any GSM network in the world, Siemens MC55 is a tri-band GSM/GPRS engine that works on the three frequencies GSM 900 MHz, GSM 1800 MHz and GSM 1900 MHz. MC56 is a tri-band GSM/GPRS engine that works on the three frequencies GSM 850MHz, GSM 1800 MHz and GSM 1900 MHz. MC55/56 features GPRS multislot class 10 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. To save space on the application platform, MC55/56 comes as an extremely slim and compact module. This makes it ideally suited for a broad range of mobile computing devices, and particularly offers easy integration with smart phones, PDAs, and other handhelds. The tiny MC55/56 module incorporates all you need to create high-performance GSM/GPRS solutions: baseband processor, power supply ASIC, complete radio frequency circuit including a power amplifier and antenna interface. The power amplifier is directly fed from the supply voltage BATT+. A compact “stacked FLASH / SRAM” device stores the MC55/56 software in the flash memory section, and static RAM section provides the additional storage capacity required by GPRS connectivity. The physical interface to the cellular application is made through a board-to-board connector. It consists of 50 pins, required for controlling the unit, transferring data and audio signals and providing power supply lines. MC55/56 comprises two serial interfaces (ASC0 and ASC1) giving you maximum flexibility for easy integration with the Man-Machine Interface (MMI). An extremely versatile audio concept offers various audio interfaces, each available on the board-to-board connector: a digital audio interface (DAI) and two analog audio interfaces. Using AT commands you can easily switch back and forth and select different audio modes. The external dual-band or triple-band antenna can be connected optionally to a connector on the top side or to a pad on the bottom side. The power saving technique minimizes current consumption to as low as 3mA. In SLEEP mode, MC55/56 is able to wake up on demand and to resume power saving automatically if no activity is required. For battery powered applications, MC55/56 features a charging control which can be used to charge a Li-Ion battery. The charging circuit must be implemented outside the module on the application platform.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 17 of 101 23.01.2004 2.1 MC55/56 key features at a glance Table 1: MC55/56 key features Feature Implementation Power supply Single supply voltage 3.3V – 4.8V Power saving Minimizes power consumption in SLEEP mode to 3mA Charging Supports charging control for Li-Ion battery Frequency bands · MC55 Tri-band: EGSM 900, GSM 1800, GSM 1900 · MC56 Tri-band: GSM 850, GSM 1800, GSM 1900 · Compliant to GSM Phase 2/2+ GSM class Small MS Transmit power · Class 4 (2W) at EGSM900 and GSM850 · Class 1 (1W) at GSM1800 and GSM 1900 GPRS connectivity · GPRS multi-slot class 10 · GPRS mobile station class B Temperature range Temperature control and auto switch-off · Normal operation: -20°C to +55°C · Restricted operation: -25°C to -20°C and +55°C to +65°C· Constant temperature control prevents damage to MC55/56 when the specified temperature is exceeded. When an emergency call is in progress the automatic temperature shutdown functionality is deactivated. DATA GPRS: CSD: WAP: · GPRS data downlink transfer: max. 85.6 kbps (see Table 2) · GPRS data uplink transfer: max. 42.8 kbps (see Table 2) · Coding scheme: CS-1, CS-2, CS-3 and CS-4 · MC55/56 supports the two protocols PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) commonly used for PPP connections. · Support of Packet Switched Broadcast Control Channel (PBCCH) allows you to benefit from enhanced GPRS performance when offered by the network operators. · CSD transmission rates: 2.4, 4.8, 9.6, 14.4 kbps, non-transparent, V.110 · Unstructured Supplementary Services Data (USSD) support · WAP compliant SMS · MT, MO, CB, Text and PDU mode · SMS storage: SIM card plus 25 SMS locations in the mobile equipment · Transmission of SMS alternatively over CSD or GPRS. Preferred mode can be user-defined. MMS MMS compliant FAX Group 3: Class 1, Class 2 SIM interface · Supported SIM card: 3V · External SIM card reader has to be connected via interface connector (note that card reader is not part of MC55/56)
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 18 of 101 23.01.2004 Feature Implementation External antenna Connected via 50 Ohm antenna connector or antenna pad Audio interfaces Two analog audio interfaces, one digital audio interface (DAI) Audio features Speech codec modes: · Half Rate (ETS 06.20) · Full Rate (ETS 06.10) · Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80) · Adaptive Multi Rate (AMR) Handsfree operation · Echo cancellation · Noise reduction Two serial interfaces: ASC0, ASC1 · 2.65V level, bi-directional bus for AT commands and data · ASC0 – full-featured 8-wire serial interface. Supports RTS0/CTS0 hardware handshake and software XON/XOFF flow control. Multiplex ability according to GSM 07.10 Multiplexer Protocol. · ASC1 - 4-wire serial interface. Supports RTS1/CTS1 hardware handshake and software XON/XOFF flow control. · Baud rate: 300bps ... 230kbps on ASC0 and ASC1 · Autobauding (on ASC0 only) detects 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400 bps Phonebook management Supported phonebook types: SM, FD, LD, MC, RC, ON, ME SIM Application Toolkit Supports SAT class 3, GSM 11.14 Release 98 Ringing tones Offers a choice of 7 different ringing tones / melodies, easily selectable with AT command Real time clock Implemented Timer function Programmable via AT command Support of TTY/CTM To benefit from TTY communication via GSM, CTM equipment can be connected to one of the three audio interfaces. Physical characteristics Size: 35+0.15 x 32.5+0.15 x 3.1+0.3 mm (including application connector) 35+0.15 x 32.5+0.15 x 2.8+0.2 mm (excluding application connector) Weight: 5.5g Firmware upgrade Firmware upgradable over serial interface and SIM interface Evaluation kit The DSB45 Support Box is an evaluation kit designed to test and type approve Siemens cellular engines and provide a sample configuration for application engineering. See Chapter 8 for ordering information.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 19 of 101 23.01.2004 Table 2: Coding schemes and maximum net data rates over air interface Coding scheme 1 Timeslot 2 Timeslots 4 Timeslots CS-1: 9.05 kbps 18.1 kbps 36.2 kbps CS-2: 13.4 kbps 26.8 kbps 53.6 kbps CS-3: 15.6 kbps 31.2 kbps 62.4 kbps CS-4: 21.4 kbps 42.8 kbps 85.6 kbps Please note that the values stated above are maximum ratings which, in practice, are influenced by a great variety of factors, primarily, for example, traffic variations and network coverage.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 20 of 101 23.01.2004 2.2 Circuit concept Figure 1 shows a block diagram of the MC55/56 module and illustrates the major functional components: GSM / GPRS baseband block: · Baseband controller operating at 26MHz · Power supply ASIC · Stacked Flash / SRAM · Application interface (board-to-board connector) GSM RF block: · Skyworks RF transceiver · Skyworks RF power amplifier / FEM · RF front end (antenna connector)
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 21 of 101 23.01.2004 PMB7850 ControllerStacked FLASH / SRAMMeasuringNetworkAdd. / Data / ControlApplication InterfaceDO767BA Power Supply ASICSKY77500 PA / FEMSKY74963 TransceiverExt.ChargingCircuitCCVCCCCIN4DAI5446EPPMICRX GSMRX PCSRX DCSTX DCS/PCSTX GSM26.0MHzNTCBS2TX_RXPAC_ENRXI/Q4TXI/Q426MHzRFCTRL3LOWVDDVDD_LPSIM I/OGNDBATT+BATT-TEMPBATT-TEMPCHARGEPOWERPOWERBATT+/EMERGOFF/IGTASC084ASC1SIM Figure 1: MC55/56 block diagram
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 22 of 101 23.01.2004 3 Application Interface MC55/56 is equipped with a 50-pin 0.5mm pitch board-to-board connector that connects to the cellular application platform. The host interface incorporates several sub-interfaces described in the following chapters: · Power supply and charging control (see Chapters 3.2 and 3.3) · Dual serial interface (see Chapter 3.9) · Two analog audio interfaces and a digital audio interface (see Chapter 3.10) · SIM interface (see Chapter 3.11) Electrical and mechanical characteristics of the board-to-board connector are specified in Chapter 6.3. Ordering information for mating connectors and cables are included.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 23 of 101 23.01.2004 3.1 Operating modes The table below briefly summarizes the various operating modes referred to in the following chapters. Table 3: Overview of operating modes Mode Function GSM / GPRS SLEEP Various powersave modes set with AT+CFUN command. Software is active to minimum extent. If the module was registered to the GSM network in IDLE mode, it is registered and paging with the BTS in SLEEP mode, too. Power saving can be chosen at different levels: The NON-CYCLIC SLEEP mode (AT+CFUN=0) disables the AT interface. The CYCLIC SLEEP modes AT+CFUN=5, 6, 7 and 8 alternatively activate and deactivate the AT interfaces to allow permanent access to all AT commands. GSM IDLE Software is active. Once registered to the GSM network, paging with BTS is carried out. The module is ready to send and receive. GSM TALK Connection between two subscribers is in progress. Power consumption depends on network coverage individual settings, such as DTX off/on, FR/EFR/HR, hopping sequences, antenna. GPRS IDLE Module is ready for GPRS data transfer, but no data is currently sent or received. Power consumption depends on network settings and GPRS configuration (e.g. multislot settings). Normal operation GPRS DATA GPRS data transfer in progress. Power consumption depends on network settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multislot settings). POWER DOWN Normal shutdown after sending the AT^SMSO command. The Power Supply ASIC (PSU-ASIC) disconnects the supply voltage from the baseband part of the circuit. Only a voltage regulator in the PSU-ASIC is active for powering the RTC. Software is not active. The serial interfaces are not accessible. Operating voltage (connected to BATT+) remains applied.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 24 of 101 23.01.2004 Mode Function Alarm mode Restricted operation launched by RTC alert function while the module is in POWER DOWN mode. Module will not be registered to GSM network. Limited number of AT commands is accessible. If application is battery powered: No charging functionality in Alarm mode. Charge-only mode Limited operation for battery powered applications. Enables charging while module is detached from GSM network. Limited number of AT commands is accessible. There are several ways to launch Charge-only mode: · From POWER DOWN mode: Connect charger to the charger input pin of the external charging circuit and the module’s POWER pin when MC55/56 was powered down by AT^SMSO. · From Normal mode: Connect charger to the charger input pin of the external charging circuit and the module’s POWER pin, then enter AT^SMSO. Charge mode during normal operation Normal operation (SLEEP, IDLE, TALK, GPRS IDLE, GPRS DATA) and charging running in parallel. Charge mode changes to Charge-only mode when the module is powered down before charging has been completed. See Table 11 and Table 12 for the various options of waking up MC55/56 and proceeding from one mode to another.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 25 of 101 23.01.2004 3.2 Power supply The power supply of MC55/56 has to be a single voltage source of VBATT+= 3.3V...4.8V. It must be able to provide sufficient current in a transmit burst which typically rises to 2A. Beyond that, the power supply must be able to account for increased current consumption if the module is exposed to inappropriate conditions, for example antenna mismatch. For further details see Chapters 3.2.2 and 5.4.1. All the key functions for supplying power to the device are handled by an ASIC power supply. The ASIC provides the following features: · Stabilizes the supply voltages for the GSM baseband using low drop linear voltage regulators. · Controls the module's power up and power down procedures. A watchdog logic implemented in the baseband processor periodically sends signals to the ASIC, allowing it to maintain the supply voltage for all digital MC55/56 components. Whenever the watchdog pulses fail to arrive constantly, the module is turned off. · Delivers, across the VDD pin, a regulated voltage of 2.9V. The output voltage VDD may be used to supply, for example, an external LED or a level shifter. However, the external circuitry must not cause any spikes or glitches on voltage VDD. This voltage is not available in POWER DOWN mode. Therefore, the VDD pin can be used to indicate whether or not MC55/56 is in POWER DOWN mode. · Provides power to the SIM interface. The RF power amplifier is driven directly from BATT+. 3.2.1 Power supply pins on the board-to-board connector Five BATT+ pins of the board-to-board connector are dedicated to connect the supply voltage, five GND pins are recommended for grounding. The values stated below must be measured directly at the reference points on the MC55/56 board (TP BATT+ and TP GND illustrated in Figure 41). The POWER and CHARGE pins serve as control signals for charging a Li-Ion battery. VDDLP can be used to back up the RTC. Table 4: Power supply pins of board-to-board connector Signal name I/O Description Parameter BATT+ I/O Positive operating voltage Reference points are the test points 3.3 V...4.8 V, Ityp £ 2 A during transmit burst The minimum operating voltage must not fall below 3.3 V, not even in case of voltage drop. GND - Ground 0 V POWER I This line signals to the processor that the charger is connected. CHARGE O Control signal for external charging transistor VDDLP I/O Can be used to back up the RTC when VBATT+ is not applied. See Chapter 3.8 UOUT,max < VBATT+ UIN = 2.0 V...5.5 V Ri = 1kW Iin,max = 30µA
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 26 of 101 23.01.2004 3.2.2 Minimizing power losses When designing the power supply for your application please pay specific attention to power losses. Ensure that the input voltage VBATT+ never drops below 3.3 V on the MC55/56 board, not even in a transmit burst where current consumption can rise to typical peaks of 2A. Any voltage drops that may occur in a transmit burst should not exceed 400mV. It should be noted that MC55/56 switches off when exceeding these limits. For further details see Chapter 5.4. The best approach to reducing voltage drops is to use a board-to-board connection as recommended, and a low impedance power source. The resistance of the power supply lines on the host board and of a battery pack should also be considered. Note: If the application design requires an adapter cable between both board-to-board connectors, use a flex cable as short as possible in order to minimize power losses. Example: If the length of the flex cable reaches the maximum length of 200mm, this connection may cause, for example, a resistance of 50m! in the BATT+ line and 50m! in the GND line. As a result, a 2A transmit burst would add up to a total voltage drop of 200mV. Plus, if a battery pack is involved, further losses may occur due to the resistance across the battery lines and the internal resistance of the battery. Figure 2: Power supply limits during transmit burst The input voltage VBATT+ must be measured directly at the test points on the MC55/56 board (TP BATT+ and TP GND illustrated in Figure 41). 3.2.3 Monitoring power supply To help you monitor the supply voltage you can use the AT^SBV command which returns the voltage measured at TP BATT+ and GND. The voltage is continuously measured at intervals depending on the operating mode on the RF interface. The duration of measuring ranges from 0.5s in TALK/DATA mode to 50s when MC55/56 is deregistered. The displayed voltage (in mV) is averaged over the last measuring period before the AT^SBV command was executed. For details please refer to [1].
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 27 of 101 23.01.2004 3.3 Power up / down scenarios In general, be sure not to turn on MC55/56 while it is out of the operating range of voltage and temperature stated in Chapters 5.2 and 5.3. MC55/56 would immediately switch off after having started and detected these inappropriate conditions. 3.3.1 Turn on MC55/56 MC55/56 can be activated in a variety of ways, which are described in the following chapters: · via ignition line /IGT: starts normal operating state (see Chapters 3.3.1.1 and 3.3.1.2) · via POWER line: starts charging algorithm (see Chapters 3.5.3 and 3.3.1.3) · via RTC interrupt: starts Alarm mode (see Chapter 3.3.1.4)
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 28 of 101 23.01.2004 3.3.1.1 Turn on MC55/56 using the ignition line /IGT (Power on) To switch on MC55/56 the /IGT (Ignition) signal needs to be driven to ground level for at least 100ms and not earlier than 10ms after the last falling edge of VDD. This can be accomplished using an open drain/collector driver in order to avoid current flowing into this pin. Software controlled/EMERGOFFca. 300ms ca. 900msSerial interfaces ASC0 and ASC1 Undefined Inactive ActiveVDDca. 60ms/TXD0/TXD1/DSR0BATT+/IGTmin. 10msmin.100ms HiZHiZ Figure 3: Power-on by ignition signal If configured to a fix baud rate, MC55/56 will send the result code ^SYSSTART to indicate that it is ready to operate. This result code does not appear when autobauding is active. See Chapter AT+IPR in [1]. In a battery operated MC55/56 application, the duration of the /IGT signal must be 1s minimum when the charger is connected and you may want to go from charging to Normal mode. For details please see Chapter 3.3.1.2
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 29 of 101 23.01.2004 3.3.1.2 Timing of the ignition process When designing your application platform take into account that powering up MC55/56 requires the following steps. · The ignition line cannot be operated until VBATT+ passes the level of 3.0V. · The ignition line shall not be operated earlier than 10ms after the last falling edge of VDD. · 10ms after VBATT+ has reached 3.0V the ignition line can be switched low. The duration of the falling edge must not exceed 1ms. · Another 100ms are required to power up the module. · Ensure that VBATT+ does not fall below 3.0V while the ignition line is driven. Otherwise the module cannot be activated. · If the VDDLP line is fed from an external power supply as explained in Chapter 3.8, the /IGT line is HiZ before the rising edge of BATT+. Figure 4: Timing of power-on process if VDDLP is not used Figure 5: Timing of power-on process if VDDLP is fed from external source 3.0V0VBATT+min. 100msmax. 1ms10ms/IGTHiZHiZ3.0V0Vmin. 100msmax. 1ms10msHiZHiZBATT+/IGT
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 30 of 101 23.01.2004 3.3.1.3 Turn on MC55/56 using the POWER signal As detailed in Chapter 3.5.3, the charging adapter can be connected regardless of the module’s operating mode (except for Alarm mode). If the charger is connected to the charger input of the external charging circuit and the module’s POWER pin while MC55/56 is off, processor controlled fast charging starts (see Chapter 3.5.2). MC55/56 enters a restricted mode, referred to as Charge-only mode where only the charging algorithm will be launched. During the Charge-only mode MC55/56 is neither logged on to the GSM network nor are the serial interfaces fully accessible. To switch to normal operation and log on to the GSM network, the /IGT line needs to be activated. 3.3.1.4 Turn on MC55/56 using the RTC (Alarm mode) Another power-on approach is to use the RTC, which is constantly supplied with power from a separate voltage regulator in the power supply ASIC. The RTC provides an alert function, which allows the MC55/56 to wake up whilst the internal voltage regulators are off. To prevent the engine from unintentionally logging into the GSM network, this procedure only enables restricted operation, referred to as Alarm mode. It must not be confused with a wake-up or alarm call that can be activated by using the same AT command, but without switching off power. Use the AT+CALA command to set the alarm time. The RTC retains the alarm time if MC55/56 was powered down by AT^SMSO. Once the alarm is timed out and executed, MC55/56 enters into the Alarm mode. This is indicated by an Unsolicited Result Code (URC) which reads: ^SYSSTART ALARM MODE Note that this URC is the only indication of the Alarm mode and will not appear when autobauding was activated (due to the missing synchronization between DTE and DCE upon start-up). Therefore, it is recommended to select a fixed baudrate before using the Alarm mode. In Alarm mode only a limited number of AT commands is available. For further instructions refer to the AT Command Set. Table 5: AT commands available in Alarm mode AT command Use AT+CALA Set alarm time AT+CCLK Set date and time of RTC AT^SBC In Alarm mode, you can only query the present current consumption and check whether or not a charger is connected. The battery capacity is returned as 0, regardless of the actual voltage (since the values measured directly on the cell are not delivered to the module). AT^SCTM Query temperature range, enable/disable URCs to report critical temperature rangesAT^SMSO Power down GSM engine For the GSM engine to change from the Alarm mode to full operation (normal operating mode) it is necessary to drive the ignition line to ground. This must be implemented in your host application as described in Chapter 3.3.1.1.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 31 of 101 23.01.2004 If your application is battery powered note that charging cannot be started while the engine is in Alarm mode, i.e. charging will not begin even though the charger connects to the charger input of the external charging circuit and the module’s POWER pin. See also Chapter 3.7 which summarizes the various options of changing the mode of operation. If your host application uses the SYNC pin to control a status LED as described in Chapter 3.12.2.2, please note that the LED is off while the GSM engine is in Alarm mode.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 32 of 101 23.01.2004 3.3.2 Turn off MC55/56 To switch the module off the following procedures may be used: · Normal shutdown procedure: Software controlled by sending the AT^SMSO command over the serial application interface. See Chapter 3.3.2.1. · Emergency shutdown: Hardware driven by switching the /EMERGOFF line of the board-to-board-connector to ground = immediate shutdown of supply voltages, only applicable if the software controlled procedure fails! See Chapter 3.3.2.3. · Automatic shutdown: See Chapter 3.3.3 a) Takes effect if undervoltage is detected. b) Takes effect if MC55/56 board temperature exceeds critical limit. 3.3.2.1 Turn off MC55/56 using AT command The best and safest approach to powering down MC55/56 is to issue the AT^SMSO command. This procedure lets MC55/56 log off from the network and allows the software to enter into a secure state and safe data before disconnecting the power supply. The mode is referred to as POWER DOWN mode. In this mode, only the RTC stays active. Before switching off the device sends the following response: ^SMSO: MS OFF OK ^SHUTDOWN After sending AT^SMSO do not enter any other AT commands. There are two ways to verify when the module turns off: · Wait for the URC “^SHUTDOWN”. It indicates that all important data have been stored to the Flash and that the complete system turns off in less than 1 second. · Also, you can monitor the VDD pin. The low state of VDD definitely indicates that the module is switched off. Be sure not to disconnect the operating voltage VBATT+ before the URC “^SHUTDOWN” has been issued and the VDD signal has gone low. Otherwise you run the risk of losing data. To avoid any problems the VDD pin it is recommended to use to monitor the POWER DOWN state. While MC55/56 is in POWER DOWN mode the application interface is switched off and must not be fed from any other source. Therefore, your application must be designed to avoid any current flow into any digital pins of the application interface. 3.3.2.2 Maximum number of turn-on / turn-off cycles Each time the module is shut down, data will be written from volatile memory to flash memory. The guaranteed maximum number of write cycles is limited to 100.000.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 33 of 101 23.01.2004 3.3.2.3 Emergency shutdown using /EMERGOFF pin Caution: Use the /EMERGOFF pin only when, due to serious problems, the software is not responding for more than 5 seconds. Pulling the /EMERGOFF pin causes the loss of all information stored in the volatile memory since power is cut off immediately. Therefore, this procedure is intended only for use in case of emergency, e.g. if MC55/56 fails to shut down properly. The /EMERGOFF signal is available on the board-to-board connector. To control the /EMERGOFF line it is recommended to use an open drain / collector driver. To turn the GSM engine off, the /EMERGOFF line has to be driven to ground for ³ 3.2s. Figure 6: Deactivating GSM engine by /EMERGOFF signal BATT+ Internal reset /EMERG-OFF Controlled by external application max. 3.2s/IGT VDD How does it work: · Voltage Vbatt+ is permanently applied to the module. · The module is active while the internal reset signal is kept at high level. During operation of MC55/56the baseband controller generates watchdog pulses at regular intervals. Once the EMERGOFF pin is grounded these watchdog pulses are cut off from the power supply ASIC. The power supply ASIC shuts down the internal supply voltages of MC55/56 after max. 3.2s and the module turns off. Consequently, the output voltage at VDD is switched off.Controlled by MC55/56 software
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 34 of 101 23.01.2004 3.3.3 Automatic shutdown Automatic shutdown takes effect if · the MC55/56 board is exceeding the critical limits of overtemperature or undertemperature · the battery is exceeding the critical limits of overtemperature or undertemperature · undervoltage is detected The automatic shutdown procedure is equivalent to the power-down initiated with the AT^SMSO command, i.e. MC55/56 logs off from the network and the software enters a secure state avoiding loss of data. NOTE: This is not true for overvoltage conditions, and if an unrecoverable hardware or software error occurs, see below for details Alert messages transmitted before the device switches off are implemented as Unsolicited Result Codes (URCs). The presentation of these URCs can be enabled or disabled with the two AT commands AT^SBC and AT^SCTM. The URC presentation mode varies with the condition, please see Chapters 3.3.3.1 to 3.3.3.4 for details. For further instructions on AT commands refer to [1]. 3.3.3.1 Temperature dependent shutdown The board temperature is constantly monitored by an internal NTC resistor located on the PCB. The NTC that detects the battery temperature must be part of the battery pack circuit as described in Chapter 3.5. The values detected by either NTC resistor are measured directly on the board or the battery and therefore, are not fully identical with the ambient temperature. Each time the board or battery temperature goes out of range or back to normal, MC55/56 instantly displays an alert (if enabled). · URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such as protecting the module from exposure to extreme conditions. The presentation of the URCs depends on the settings selected with the AT^SCTM write command: AT^SCTM=1: Presentation of URCs is always enabled. AT^SCTM=0 (default): Presentation of URCs is enabled for 15 seconds time after start-up of MC55/56. After 15 seconds operation, the presentation will be disabled, i.e. no alert messages can be generated. · URCs indicating the level "2" or "-2" are instantly followed by an orderly shutdown. The presentation of these URCs is always enabled, i.e. they will be output even though the factory setting AT^SCTM=0 was never changed. The maximum temperature ratings are stated in Table 26. Refer to Table 6 for the associated URCs. All statements are based on test conditions according to IEC 60068-2-2 (still air).
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 35 of 101 23.01.2004 Table 6: Temperature dependent behaviour Sending temperature alert (15 s after start-up, otherwise only if URC presentation enabled) ^SCTM_A: 1 Caution: Tamb of battery close to over temperature limit. ^SCTM_B: 1 Caution: Tamb of board close to over temperature limit. ^SCTM_A: -1 Caution: Tamb of battery close to under temperature limit. ^SCTM_B: -1 Caution: Tamb of board close to under temperature limit. ^SCTM_A: 0 Battery back to uncritical temperature range. ^SCTM_B: 0 Board back to uncritical temperature range. Automatic shutdown (URC appears no matter whether or not presentation was enabled) ^SCTM_A: 2 Alert: Tamb of battery equal or beyond over temperature limit. MC55/56 switches off. ^SCTM_B: 2 Alert: Tamb of board equal or beyond over temperature limit. MC55/56 switches off. ^SCTM_A: -2 Alert: Tamb of battery equal or below under temperature limit. MC55/56 switches off. ^SCTM_B: -2 Alert: Tamb of board equal or below under temperature limit. MC55/56 switches off. 3.3.3.2 Temperature control during emergency call If the temperature limit is exceeded while an emergency call is in progress the engine continues to measure the temperature and to deliver alert messages, but deactivates the shutdown functionality. Once the call is terminated the temperature control will be resumed. If the temperature is still out of range MC55/56 switches off immediately. 3.3.3.3 Undervoltage shutdown if battery NTC is present In applications where the module’s charging technique is used and an NTC is connected to the BATT_TEMP terminal, the software constantly monitors the applied voltage. If the measured battery voltage is no more sufficient to set up a call the following URC will be presented: ^SBC: Undervoltage. The message will be reported, for example, when you attempt to make a call while the voltage is close to the critical limit and further power loss is caused during the transmit burst. To remind you that the battery needs to be charged soon, the URC appears several times before the module switches off. To enable or disable the URC use the AT^SBC command. The URC will be enabled when you enter the write command and specify the power consumption of your GSM application. Step by step instructions are provided in [1].
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 36 of 101 23.01.2004 3.3.3.4 Undervoltage shutdown if no battery NTC is present The undervoltage protection is also effective in applications, where no NTC connects to the BATT_TEMP terminal. Thus, you can take advantage of this feature even though the application handles the charging process or MC55/56 is fed by a fixed supply voltage. All you need to do is executing the write command AT^SBC=<current> which automatically enables the presentation of URCs. You do not need to specify <current>. Whenever the supply voltage falls below the specified value (see Table 28) the URC ^SBC: Undervoltage appears several times before the module switches off. 3.3.3.5 Overvoltage shutdown If the supply voltage raises to VBATT+ >5.8V, or an unrecoverable hardware or software error occurs, the PSU-ASIC immediately cuts off the power supply to all components it is connected to. In contrast to undervoltage shutdown, loss of data cannot be avoided. Furthermore, there is no URC function available for overvoltage conditions, i.e. no alert will be sent prior to shutdown. Keep in mind that several MC55/56 components are directly linked to BATT+ and, therefore, power remains applied at major parts of MC55/56. Particular attention must be paid to the power amplifier which is very sensitive to high voltage and might even be destroyed. Generally, to avoid that the MC55/56 application violates GSM specifications, be sure that the supply voltage does not exceed the maximum value of 4.5V stated in Table 28.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 37 of 101 23.01.2004 3.4 Automatic GPRS Multislot Class change Temperature control is also effective for operation in GPRS Multislot Class 10. If the board temperature increases to the limit specified for restricted operation1) while data are transmitted over GPRS, the module automatically reverts from GPRS Multislot Class 10 (2 Tx) to Class 8 (1Tx). This reduces the power consumption and, consequently, causes the board’s temperature to decrease. Once the temperature drops to a value of 5 degrees below the limit of restricted operation, MC55/56 returns to the higher Multislot Class. If the temperature stays at the critical level or even continues to rise, MC55/56 will not switch back to the higher class. After a transition from Multislot Class 10 to Multislot 8 a possible switchback to Multislot Class 10 is blocked for one minute. Please note that there is not one single cause of switching over to a lower GPRS Multislot Class. Rather it is the result of an interaction of several factors, such as the board temperature that depends largely on the ambient temperature, the operating mode and the transmit power. Furthermore, take into account that there is a delay until the network proceeds to a lower or, accordingly, higher Multislot Class. The delay time is network dependent. In extreme cases, if it takes too much time for the network and the temperature cannot drop due to this delay, the module may even switch off as described in chapter 3.3.3.1. 1) See Table 26 for temperature limits known as restricted operation.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 38 of 101 23.01.2004 3.5 Charging control MC55/56 integrates a charging management for Li-Ion batteries. You can skip this chapter if charging is not your concern, or if you are not using the implemented charging algorithm. MC55/56 has no on-board charging circuit. To benefit from the implemented charging management you are required to install a charging circuit within your application. In this case, MC55/56 needs to be powered from a Li-Ion battery pack, e.g. as specified in Table 8. The module only delivers, via its POWER line and CHARGE line, the control signals needed to start and stop the charging process. The charging circuit should include a transistor and should be designed as illustrated in Figure 7. A list of parts recommended for the external circuit is given in Table 7. to BATT+Input fromcharger(5.5V - 8V)under loadCHARGE470R 1SS355CRS043k3100nF 10kSI3441DV4V3 1/5 ESDA6V1-5W6pcb sparkgapto POWERBATT_TEMP1/5 ESDA6V1-5W6 Figure 7: Schematic of approved charging transistor, trickle charging and ESD protection Table 7: Bill of material for external charging circuit Part Description First supplier Second supplier SI3441DV p-chan 2.5V (G-S) MOSFET (TSOP-6) VISHAY: SI3441DV-T1 NEC: UPA1911TE-T11SS355 100mA Si-diode (UMD2) ROHM: 1SS355TE-18 Toshiba: 1SS352TPH3 CRS04 1A Schottky diode Toshiba: CRS04 - 4V3 250mW; 200mA; 4.3V Z-Diode (SOD323) Philips: PDZ4.3B ROHM: UDZS4.3B UDZ4.3B ESDA6V1-5W6 ESD protection TRANSIL™ array STM: ESDA6V1-5W6 - 470R, 3k3, 10k Resistor, e.g. 0805 or 0603 - - 100nF Ceramic capacitor 50V - - PCB spark gap 0.2mm spark gap on PCB - -
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 39 of 101 23.01.2004 3.5.1 Battery pack characteristics The charging algorithm has been optimised for a Li-Ion battery pack that meets the characteristics listed below. It is recommended that the battery pack you want to integrate into your MC55/56 application is compliant with these specifications. This ensures reliable operation, proper charging and, particularly, allows you to monitor the battery capacity using the AT^SBC command (see [1] for details). Failure to comply with these specifications might cause AT^SBC to deliver incorrect battery capacity values. A battery pack especially designed to operate with MC55/56 modules is specified in Chapter 3.5.1.1. · Li-Ion battery pack specified for a maximum charging voltage of 4.2 V and a capacity of 800 mAh. Battery packs with a capacity down to 600 mAh or more than 800 mAh are allowed, too. · Since charging and discharging largely depend on the battery temperature, the battery pack should include an NTC resistor. If the NTC is not inside the battery it must be in thermal contact with the battery. The NTC resistor must be connected between BATT_TEMP and GND. Required NTC characteristics are: 10 kΩ +5% @ 25°C, B25/85 = 3435K +3% (alternatively acceptable: 10 kΩ +2% @ 25°C, B25/50 = 3370K +3%). Please note that the NTC is indispensable for proper charging, i.e. the charging process will not start if no NTC is present. · Ensure that the pack incorporates a protection circuit capable of detecting overvoltage (protection against overcharging), undervoltage (protection against deep discharging) and overcurrent. The circuit must be insensitive to pulsed current. · On the MC55/56 module, a built-in measuring circuit constantly monitors the supply voltage. In the event of undervoltage, it causes MC55/56 to power down. Undervoltage thresholds are specific to the battery pack and must be evaluated for the intended model. When you evaluate undervoltage thresholds, consider both the current consumption of MC55/56 and of the application circuit. · The internal resistance of the battery and the protection should be as low as possible. It is recommended not to exceed 150m", even in extreme conditions at low temperature. The battery cell must be insensitive to rupture, fire and gassing under extreme conditions of temperature and charging (voltage, current). · The battery pack must be protected from reverse pole connection. For example, the casing should be designed to prevent the user from mounting the battery in reverse orientation. · The battery pack must be approved to satisfy the requirements of CE conformity. Figure 8 shows the circuit diagram of a typical battery pack design that includes the protection elements described above. Figure 8: Battery pack circuit diagram to BATT_TEMP to GNDNTCPolyfuseJProtection Circuit+-Battery cellto BATT+
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 40 of 101 23.01.2004 3.5.1.1 Recommended battery pack The following battery pack has been especially designed for use with MC55/56 modules. Table 8: Specifications of XWODA battery pack Product name, type XWODA, Li-Ion, 3.6V, 800mAh Vendor To place orders or obtain more information please contact: Shenzhen Xwoda Electronic Co., Ltd Building C, Tongfukang Industrial Zone Shiyan Town, Bao’an District Shenzen P.R. China Contact: Waichard Tsui Phone: +86-755-27623789 ext. 370 Fax: +86-755-27623078 Email: waichard@xwoda.com.cn Nominal voltage 3.6V Capacity 800mAh NTC 10k" ± 5% @ 25°C, B (25/85)=3435K ± 3% Overcharge detection voltage 4.325 ± 0.025V Overcharge release voltage 4.075 ± 0.025V Overdischarge detection voltage 2.5 ± 0.05V Overdischarge release voltage 2.9 ± 0.5V Overcurrent detection 3 ± 0.5A Nominal working current <5µA Current of low voltage detection 0.5µA Overcurrent detection delay time 8~16ms Short detection delay time 50µs Overdischarge detection delay time 31~125ms Overcharge detection delay time 1s Internal resistance <130m"
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 41 of 101 23.01.2004 3.5.2 Implemented charging technique If the external charging circuit follows the recommendation of Figure 7, the charging process consists of trickle charging and processor controlled fast charging. For this solution, the fast charging current provided by the charger or any other external source must be limited to 500mA. Trickle charging · Trickle charging starts when the charger is connected to the charger input of the external charging circuit and the module’s POWER pin. The charging current depends on the voltage difference between the charger input of the external charging circuit and BATT+ of the module. · Trickle charging stops when the battery voltage reaches 3.6V. Fast charging · After trickle charging has raised the battery voltage to 3.2V within 60 minutes +10% from connecting the charger, the power ASIC turns on and wakes up the baseband processor. Now, processor controlled fast charging begins. If the battery voltage was already above 3.2V, processor controlled fast charging starts just after the charger was connected to the charger input of the external charging circuit and the module’s POWER pin. If MC55/56 was in POWER DOWN mode, it turns on and enters the Charge-only mode along with fast charging (see also Chapter 3.3.1.3). · Fast charging delivers a constant current until the battery voltage reaches 4.2V and then proceeds with varying charge pulses. As shown in Figure 5, the pulse duty cycle is reduced to adjust the charging procedure and prevent the voltage from overshooting beyond 4.2V. Once the pulse width reaches the minimum of 100ms and the duty cycle does not change for 2 minutes, fast charging is completed. · Fast charging can only be accomplished in a temperature range from 0°C to +45°C. 4.34.23.8Voltage3.43.0Constant current tOFF = 100 ms tON = 100 ms Time100ms 2 ... 0.1s 100ms 0.1 ... 2s Figure 9: Charging process Note: Do not connect the charger to the BATT+ lines. Only the charger input of the external charging circuit is intended as input for charging current! The POWER pin of MC55/56 is the input only for indicating a connected charger! The battery manufacturer must guarantee that the battery complies with the described charging technique.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 42 of 101 23.01.2004 What to do if software controlled charging does not start up? If trickle charging fails to raise the battery voltage to 3.2V within 60 minutes +10%, processor controlled charging does not begin. To start fast charging you can do one of the following: · Once the voltage has risen above its minimum of 3V, you can try to start software controlled charging by pulling the /IGT line to ground. · If the voltage is still below 3V, driving the /IGT line to ground switches the timer off. Without the timer running, MC55/56 will not proceed to software controlled charging. To restart the timer you are required to shortly disconnect and reconnect the charger. 3.5.3 Operating modes during charging Of course, the battery can be charged regardless of the engine's operating mode. When the GSM engine is in Normal mode (SLEEP, IDLE, TALK, GPRS IDLE or GPRS DATA mode), it remains operational while charging is in progress (provided that sufficient voltage is applied). The charging process during the Normal mode is referred to as Charge mode. If the charger is connected to the charger input of the external charging circuit and the module’s POWER pin while MC55/56 is in POWER DOWN mode, MC55/56 goes into Charge-only mode. Table 9: Comparison Charge-only and Charge mode How to activate mode Features Charge mode Connect charger to charger input of external charging circuit and module’s POWER pin while MC55/56 is · operating, e.g. in IDLE or TALK mode · in SLEEP mode · Battery can be charged while GSM engine remains operational and registered to the GSM network. · In IDLE and TALK mode, the serial interfaces are accessible. AT command set can be used to full extent. · In the NON-CYCLIC SLEEP mode, the serial interfaces are not accessible at all. During the CYCLIC SLEEP mode it can be used as described in Chapter 3.6.3. Charge-only mode Connect charger to charger input of external charging circuit and module’s POWER pin while MC55/56 is · in POWER DOWN mode · in Normal mode: Connect charger to the POWER pin, then enter AT^SMSO. IMPORTANT: While trickle charging is in progress, be sure that the application is switched off. If the application is fed from the trickle charge current the module might be prevented from proceeding to software controlled charging since the current would not be sufficient. · Battery can be charged while GSM engine is deregistered from GSM network. · Charging runs smoothly due to constant current consumption. · The AT interface is accessible and allows to use the commands listed below.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 43 of 101 23.01.2004 Features of Charge-only mode Once the GSM engine enters the Charge-only mode, the AT command interface presents an Unsolicited Result Code (URC) which reads: ^SYSSTART CHARGE-ONLY MODE Note that this URC will not appear when autobauding was activated (due to the missing synchronization between DTE and DCE upon start-up). Therefore, it is recommended to select a fixed baudrate before using the Charge-only mode. While the Charge-only mode is in progress, you can only use the AT commands listed in Table 10. For further instructions refer to the AT Command Set supplied with your GSM engine. Table 10: AT commands available in Charge-only mode AT command Use AT+CALA Set alarm time AT+CCLK Set date and time of RTC AT^SBC Monitor charging process Note: While charging is in progress, no battery capacity value is available. To query the battery capacity disconnect the charger. If the charger connects externally to the host device no charging parameters are transferred to the module. In this case, the command cannot be used. AT^SCTM Query temperature range, enable/disable URCs to report critical temperature rangesAT^SMSO Power down GSM engine To proceed from Charge-only mode to normal operation, it is necessary to drive the ignition line to ground. This must be implemented in your host application as described in Chapter 3.3.1.1. When the engine is in Alarm mode there is no direct way to start charging, i.e. charging will not begin even though the charger connects to the charger input of the external charging circuit and the module’s POWER pin. See also Chapter 3.7 which summarizes the various options of changing the mode of operation. If your host application uses the SYNC pin to control a status LED as described in Chapter 3.12.2.2, please note that the LED is off while the GSM engine is in Charge-only mode. 3.5.4 Charger requirements If you are using the implemented charging technique and the charging circuit recommended in Figure 7, the charger must be designed to meet the following requirements: a) Simple transformer power plug - Output voltage: 5.5V...8V (under load) - The charge current must be limited to 500mA - Voltage spikes that may occur while you connect or disconnect the charger must be limited. - There must not be any capacitor on the secondary side of the power plug (avoidance of current spikes at the beginning of charging) b) Supplementary requirements for a) to ensure a regulated power supply - When current is switched off a voltage peak of 10V is allowed for a maximum 1ms - When current is switched on a spike of 1.6A for 1ms is allowed
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 44 of 101 23.01.2004 3.6 Power saving SLEEP mode reduces the functionality of the MC55/56 module to a minimum and, thus, minimizes the current consumption to the lowest level. SLEEP mode is set with the AT+CFUN command which provides the choice of the functionality levels <fun>=0, 1, 5, 6, 7 or 8, all explained below. Further instructions of how to use AT+CFUN can be found in [1]. IMPORTANT: The AT+CFUN command can be executed before or after entering PIN1. Nevertheless, please keep in mind that power saving works only while the module is registered to the GSM network. If you attempt to activate power saving while the module is detached, the selected <fun> level will be set, though power saving does not take effect. To check whether power saving is on, you can query the status of AT+CFUN if you have chosen CYCLIC SLEEP mode. If available, you can take advantage of the status LED controlled by the SYNC pin (see Chapter 3.12.2.2). The LED stops flashing once the module starts power saving. The wake-up procedures are quite different depending on the selected SLEEP mode. Table 11 compares the wake-up events that can occur in NON-CYCLIC SLEEP mode and in the four CYCLIC SLEEP modes. 3.6.1 No power saving (AT+CFUN=1) The functionality level <fun>=1 is where power saving is switched off. This is the default after startup. 3.6.2 NON-CYCLIC SLEEP mode (AT+CFUN=0) If level 0 has been selected (AT+CFUN=0), the serial interface is blocked. The module shortly deactivates power saving to listen to a paging message sent from the base station and then immediately resumes power saving. Level 0 is called NON-CYCLIC SLEEP mode, since the serial interface is not alternatingly made accessible as in CYCLIC SLEEP mode. The first wake-up event fully activates the module, enables the serial interface and terminates the power saving mode. In short, it takes MC55/56 back to the highest level of functionality <fun>=1.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 45 of 101 23.01.2004 3.6.3 CYCLIC SLEEP mode (AT+CFUN=5, 6, 7 and 8) The major benefit over the NON-CYCLIC SLEEP mode is that the serial interface is not permanently blocked and that packet switched calls may go on without terminating the selected CYCLIC SLEEP mode. This allows MC55/56 to become active, for example to perform a GPRS data transfer, and to resume power saving after the GPRS data transfer is completed. The four CYCLIC SLEEP modes give you greater flexibility regarding the wake-up procedures: For example, in all CYCLIC SLEEP modes, you can enter AT+CFUN=1 to permanently wake up the module. The best choice is using CFUN=7 or 8, since in these modes MC55/56 automatically resumes power saving, after you have sent or received a short message or made a call. CFUN=5 and 6 do not offer this feature, and therefore, are only supported for compatibility with earlier releases. Please refer to Table 11 for a summary of all modes. The CYCLIC SLEEP mode is a dynamic process which alternatingly enables and disables the serial interface. By setting/resetting the /CTS signal, the module indicates to the application whether or not the UART is active. The timing of the /CTS signal is described below. Both the application and the module must be configured to use hardware flow control (RTS/CTS handshake). The default setting of MC55/56 is AT\Q0 (no flow control) which must be altered to AT\Q3. See [1] for details. Note: If both serial interfaces ASC0 and ASC1 are connected, both are synchronized. This means that SLEEP mode takes effect on both, no matter on which interface the AT command was issued. Although not explicitly stated, all explanations given in this chapter refer equally to ASC0 and ASC1, and accordingly to /CTS0 and /CTS1. 3.6.4 Timing of the /CTS signal in CYCLIC SLEEP modes The /CTS signal is enabled in synchrony with the module’s paging cycle. It goes active low each time when the module starts listening to a paging message block from the base station. The timing of the paging cycle varies with the base station. The duration of a paging interval can be calculated from the following formula: 4.615 ms (TDMA frame duration) * 51 (number of frames) * DRX value. DRX (Discontinuous Reception) is a value from 2 to 9, resulting in paging intervals from 0.47 to 2.12 seconds. The DRX value of the base station is assigned by the network operator. Each listening period causes the /CTS signal to go active low: If DRX is 2, the /CTS signal is activated every 0.47 seconds, if DRX is 3, the /CTS signal is activated every 0.71 seconds and if DRX is 9, the /CTS signal is activated every 2.1 seconds. The /CTS signal is active low for 4.6 ms. This is followed by another 4.6 ms UART activity. If the start bit of a received character is detected within these 9.2 ms, /CTS will be activated and the proper reception of the character will be guaranteed. /CTS will also be activated if any character is to be sent.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 46 of 101 23.01.2004 After the last character was sent or received the interface will remain active for another · 2 seconds, if AT+CFUN=5 or 7 or · 10 minutes, if AT+CFUN=6 or 8. In the pauses between listening to paging messages, while /CTS is high, the module resumes power saving and the AT interface is not accessible. See Figure 10 and Figure 11. 2.12 s4.6 ms 4.6 ms 4.6 ms 4.6 ms2.12 s 2.12 s/CTSAT interface disabled AT interface enabledPaging message Paging message Paging message Paging message4.6ms 4.6ms 4.6ms4.6ms Figure 10: Timing of /CTS signal (example for a 2.12 s paging cycle) Figure 11 illustrates the CFUN=5 and CFUN=7 modes, which reset the /CTS signal 2 seconds after the last character was sent or received. 2.12 s4.6 ms2 s 4.6 ms 4.6 ms2.12 s 2.12 s/CTSAT interface disabled AT interface enabled1 characterstLast characterBeginning of power savingPaging message Paging message Paging message Paging message4.6ms 4.6ms Figure 11: Beginning of power saving if CFUN=5 or 7
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 47 of 101 23.01.2004 3.6.5 Wake up MC55/56 from SLEEP mode A wake-up event is any event that switches off the SLEEP mode and causes MC55/56 to return to full functionality. In short, it takes MC55/56 back to AT+CFUN=1. Definitions of the state transitions described in Table 11: Yes = MC55/56 exits SLEEP mode. No = MC55/56 does not exit SLEEP mode. Table 11: Wake-up events in NON-CYCLIC and CYCLIC SLEEP modes Event From SLEEP mode AT+CFUN=0 to AT+CFUN=1 From SLEEP mode AT+CFUN=5 or 6 to AT+CFUN=1 From SLEEP mode AT+CFUN=7 or 8 to AT+CFUN=1 Ignition line No No No /RTS0 or /RTS1 (falling edge) Yes1) No1) No1) Unsolicited Result Code (URC) Yes Yes No Incoming voice or data call Yes Yes No Any AT command (incl. outgoing voice or data call, outgoing SMS) Not possible (UART disabled) No No Incoming SMS depending on mode selected by AT+CNMI: AT+CNMI=0,0 (= default, no indication of received SMS) AT+CNMI=1,1 (= displays URC upon receipt of SMS) No Yes No Yes No No GPRS data transfer Not possible (UART disabled) No No RTC alarm2) Yes Yes No AT+CFUN=1 Not possible (UART disabled) Yes Yes 1) During all CYCLIC SLEEP modes, /RTS0 and /RTS1 are conventionally used for flow control: The assertion of /RTS0 or /RTS1 signals that the application is ready to receive data - without waking up the module. Be aware that this behaviour is different if CFUN=0: In this case, the assertion of /RTS0 and /RTS1 serves as a wake-up event, giving the application the possibility to intentionally terminate power saving. 2) Recommendation: In NON-CYCLIC SLEEP mode, you can set an RTC alarm to wake up MC55/56 and return to full functionality. This is a useful approach because, in this mode, the AT interface is not accessible.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 48 of 101 23.01.2004 3.7 Summary of state transitions (except SLEEP mode) Table 12: State transitions of MC55/56 (except SLEEP mode) The table shows how to proceed from one mode to another (grey column = present mode, white columns = intended modes) Further mode èèè Present mode POWER DOWN Normal mode**) Charge-only mode*) Charging in normal mode*)**) Alarm mode POWER DOWN mode without charger --- /IGT >100 ms at low level Connect charger to input of ext. charging circuit and POWER pin (high level at POWER) No direct transition, but via “Charge-only mode” or “Normal mode” Wake-up from POWER DOWN mode (if activated with AT+CALA) POWER DOWN mode with charger (high level at POWER pins of MC55/56) --- /IGT >1 s at low level, if battery is fully charged 100ms < /IGT < 500ms at low level /IGT >1 s at low level Wake-up from POWER DOWN mode (if activated with AT+CALA) Normal mode**) AT^SMSO or exceptionally /EMERGOFF pin > 3.2s at low level --- No automatic transition, but via “POWER DOWN” Connect charger to POWER pin at MC55/56 (high level at POWER) AT+CALA followed by AT^SMSO. MC55/56 enters Alarm mode when specified time is reached. Charge-only mode *) Disconnect charger (MC55/56 POWER pin at low level) or AT^SMSO or exceptionally /EMERGOFF pin >3.2s at low level No automatic transition, but via “Charge in Normal mode” --- /IGT >1s at low level AT+CALA followed by AT^SMSO. MC55/56 enters Alarm mode when specified time is reached and VBATT+>3.2V Charging in normal mode*) **) AT^SMSO è “Charge-only mode”, again AT^SMSO; or exceptionally /EMERGOFF pin >3.2s at low level Disconnect charger from input of ext. charging circuit and module’s POWER pin AT^SMSO --- No direct transition Alarm mode AT^SMSO or exceptionally /EMERGOFF pin >3.2s at low level /IGT >100ms at low level No transition /IGT >100ms at low level --- *) See Chapter 3.5.3 for details on the charging mode **) Normal mode covers TALK, DATA, GPRS, IDLE and SLEEP modes
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 49 of 101 23.01.2004 3.8 RTC backup The internal Real Time Clock of MC55/56 is supplied from a separate voltage regulator in the power supply ASIC which is also active when MC55/56 is in POWER DOWN status. An alarm function is provided that allows to wake up MC55/56 without logging on to the GSM network. In addition, you can use the VDDLP pin on the board-to-board connector to backup the RTC from an external capacitor or a battery (rechargeable or non-chargeable). The capacitor is charged by the BATT+ line of MC55/56. If the voltage supply at BATT+ is disconnected the RTC can be powered by the capacitor. The size of the capacitor determines the duration of buffering when no voltage is applied to MC55/56, i.e. the greater capacitor the longer MC55/56 will save the date and time. The following figures show various sample configurations. The voltage applied at VDDLP can be in the range from 2 to 5.5V. Please refer to Table 27 for the parameters required. Baseband processor RTC PSU+BATT+ 1kB2BVDDLP Figure 12: RTC supply from capacitor RTC PSU+BATT+ 1kB2BVDDLPBaseband processor Figure 13: RTC supply from rechargeable battery RTC PSU++BATT+ 1kVDDLPB2BBaseband processor Figure 14: RTC supply from non-chargeable battery
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 50 of 101 23.01.2004 3.9 Serial interfaces MC55/56 offers two unbalanced, asynchronous serial interfaces conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or ON condition) and 2.65V (for high data bit or OFF condition). For electrical characteristics please refer to Table 37. The GSM engine is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals: ASC0 · Port /TXD @ application sends data to the module’s /TXD0 signal line · Port /RXD @ application receives data from the module’s /RXD0 signal line ASC1 · Port /TXD @ application sends data to module’s /TXD1 signal line · Port /RXD @ application receives data from the module’s /RXD1 signal line GSM module Application/TXD/RXD/RTS/CTS/RING/DCD/DSR/DTR/TXD/RXD/RTS/CTS1st serial interface(DTE)(DCE)2nd serial interfaceASC0 interfaceASC1 interface/TXD0/RXD0/RTS0/CTS0/RING0/DCD0/DSR0/DTR0/TXD1/RXD1/RTS1/CTS1 Figure 15: Serial interfaces
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 51 of 101 23.01.2004 3.9.1 Features supported on first and second serial interface ASC0 · 8-wire serial interface · Includes the data lines /TXD0 and /RXD0, the status lines /RTS0 and /CTS0 and, in addition, the modem control lines /DTR0, /DSR0, /DCD0 and /RING0. · It is primarily designed for voice calls, CSD calls, fax calls and GPRS services and for controlling the GSM engine with AT commands. Full Multiplex capability allows the interface to be partitioned into three virtual channels, yet with CSD and fax services only available on the first logical channel. Please note that when the ASC0 interface runs in Multiplex mode, ASC1 cannot be used. For more detailed characteristics see [10]. · The /DTR0 signal will only be polled once per second from the internal firmware of MC55/56. · The /RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). It can also be used to send pulses to the host application, for example to wake up the application from power saving state. For further details see Chapter 3.12.2.3. · Autobauding is only selectable on ASC0 and supports the following bit rates: 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400 bps. · Autobauding is not compatible with multiplex mode, see [10]. ASC1 · 4-wire serial interface · Includes only the data lines /TXD1 and /RXD1 plus /RTS1 and /CTS1 for hardware handshake. This interface is intended for voice calls, GPRS services and for controlling the GSM engine with AT commands. It is not suited for CSD calls, fax calls and Multiplex mode. · On ASC1 no RING line is available. The indication of URCs on the second interface depends on the settings made with the AT^SCFG command. For details refer to [1]. ASC0 and ASC1 · Both interfaces are configured for 8 data bits, no parity and 1 stop bit, and can be operated at bit rates from 300bps to 230400 bps. · XON/XOFF software flow control can be used on both interfaces (except if power saving is active). Table 13: DCE-DTE wiring of 1st serial interface DCE DTE V.24 circuit Pin function Signal direction Pin function Signal direction 103 /TXD0 Input /TXD Output 104 /RXD0 Output /RXD Input 105 /RTS0 Input /RTS Output 106 /CTS0 Output /CTS Input 108/2 /DTR0 Input /DTR Output 107 /DSR0 Output /DSR Input 109 /DCD0 Output /DCD Input 125 /RING0 Output /RING Input
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 52 of 101 23.01.2004 Table 14: DCE-DTE wiring of 2nd serial interface DCE DTE V.24 circuit Pin function Signal direction Pin function Signal direction 103 /TXD1 Input /TXD Output 104 /RXD1 Output /RXD Input 105 /RTS1 Input /RTS Output 106 /CTS1 Output /CTS Input
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 53 of 101 23.01.2004 3.10 Audio interfaces MC55/56 comprises three audio interfaces available on the board-to-board connector: · Two analog audio interfaces, each with a balanced analog microphone input and a balanced analog earpiece output. The second analog interface provides a supply circuit to feed an active microphone. · Serial digital audio interface (DAI) using PCM (Pulse Code Modulation) to encode analog voice signals into digital bit streams. This means you can connect up to three audio devices in any combination, although analogue and digital audio must not be operated at the same time. Using the AT^SAIC command you can easily switch back and forth. M U X ADC DSP DACAir InterfaceDigital Audio Interface (DAI) MICP1 MICN1 MICP2 MICN2 EPP1 EPN1 EPP2 EPN2 SCLK RXDDAI TFSDAI RFSDAI TXDDAI Figure 16: Audio block diagram MC55/56 offers six audio modes which can be selected with the AT^SNFS command, no matter which of the three interfaces is currently active. The electrical characteristics of the voiceband part vary with the audio mode. For example, sending and receiving amplification, sidetone paths, noise suppression etc. depend on the selected mode and can be altered with AT commands (except for mode 1). On each audio interface you can use all audio AT commands specified in [1] to alter parameters. The only exception are the DAC and ADC gain amplifier attenuation <outBbcGain> and <inBbcGain> which cannot be modified when the digital audio interface is used, since in this case the DAC and ADC are switched off. Please refer to Chapter 3.10 for specifications of the audio interface and an overview of the audio parameters. Detailed instructions on using AT commands are presented in the "MC55/56 AT Command Set" [1]. Table 30 on page 84 summarizes the characteristics of the various audio modes and shows what parameters are supported in each mode.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 54 of 101 23.01.2004 When shipped from factory, all audio parameters of MC55/56 are set to interface 1 and audio mode 1. This is the default configuration optimised for the Votronic HH-SI-30.3/V1.1/0 handset and used for type approving the Siemens reference configuration. Audio mode 1 has fix parameters which cannot be modified. To adjust the settings of the Votronic handset simply change to another audio mode. In transmit direction, all audio modes contain internal scaling factors (digital amplification) that are not accessible by the user. To avoid saturation with a full scale digital input signal on the DAI, and to obtain a one-to-one digital access to the speech coder in audio mode 5 and 6, it is recommended to set the parameter <inCalibrate> of the selected audio mode as follows: Audio mode 1 and 4: 23196 Audio mode 2: 17396 Audio mode 3: 21901 Audio mode 5 and 6: 21402 3.10.1 Microphone circuit Interface 1 This interface has no microphone supply circuit and therefore, has an impedance of 50kW. When connecting a microphone or another signal source to interface 1 you are required to add two 100 nF capacitors, one to each line. Interface 2 This interface comes with a microphone supply circuit and can be used to feed an active microphone. It has an impedance of 2kW. If you do not use it or if you want to connect another type of signal source, for example, an op amp or a dynamic microphone, it needs to be decoupled with capacitors. The power supply can be switched off and on by using the command AT^SNFM. For details see [1]. Figure 17 shows the microphone inputs at both analog interfaces of MC55/56. 2.65 V to ADC Power downMICP1MICN1 MICP2MICN2 1 k" 1 k"1 k" 1 k"33 µF Ri=50k" Ri=2k" Figure 17: Schematic of microphone inputs
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 55 of 101 23.01.2004 3.10.2 Speech processing The speech samples from the ADC or DAI are handled by the DSP of the baseband controller to calculate e.g. amplifications, sidetone, echo cancellation or noise suppression depending on the configuration of the active audio mode. These processed samples are passed to the speech encoder. Received samples from the speech decoder are passed to the DAC or DAI after post processing (frequency response correction, adding sidetone etc.). Full rate, half rate, enhanced full rate, adaptive multi rate (AMR), speech and channel encoding including voice activity detection (VAD) and discontinuous transmission (DTX) and digital GMSK modulation are also performed on the GSM baseband processor. Customer specific audio parameters can be evaluated and supplied by Siemens on request. These parameters can be downloaded to MC55/56 using an AT command. For further information refer to [8] or contact your Siemens distributor. 3.10.3 DAI timing To support the DAI function, MC55/56 integrates a simple five-line serial interface with one input data clock line (SCLK) and input / output data and frame lines (TXDDAI, TFSDAI, RXDDAI, RFSDAI). The serial interface is always active if the external input data clock SLCK is present, i.e. the serial interface is not clocked by the DSP of the MC55/56 baseband processor. SLCK must be supplied from the application and can be in a frequency range between 0.2 and 10 MHz. Serial transfer of 16-bit words is done in both directions. Data transfer to the application is initiated by the module through a short pulse of TFSDAI. The duration of the TFSDAI pulse is one SCLK period, starting at the rising edge of SLCK. During the following 16 SLCK cycles, the 16-bit sample will be transferred on the TXDDAI line. The next outgoing sample will be transferred after the next TFSDAI pulse which occurs every 125 µs. The TFSDAI pulse is the master clock of the sample transfer. From the rising edge of the TFSDAI pulse, the application has 100 µs to transfer the 16-bit input sample on the RXDDAI line. The rising edge of the RFSDAI pulse (supplied by the application) may coincide with the falling edge of TFSDAI or occur slightly later - it is only significant that, in any case, the transfer of the LSB input sample will be completed within the specified duration of 100 µs. Audio samples are transferred from the module to the application in an average of 125µs. This is determined by the 8kHz sampling rate, which is derived from and synchronized to the GSM network. As SLCK is independent of the GSM network, the distance between two succeeding sample transfers may vary about + 1 SLCK period. The application is required to adapt its sampling rate to the TFSDAI rate. Failure to synchronize the timing between the module and the application may cause audible pops and clicks in a conversation. The timing characteristics of both data transfer directions are shown in Figure 18 and Figure 19.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 56 of 101 23.01.2004 Note: Before starting the data transfer the clock SCLK should be available for at least three cycles. After the transfer of the LSB0 the clock SCLK should be still available for at least three cycles. SLCKRFSDAIRXDDAI(input)Internalsignal(input)(input)FlagT = 100ns to 5,000 ns Figure 18: DAI timing on transmit path SLCKTFSDAITXDDAI(input)Internalsignal(output)(output)FlagT = 100ns to 5,000 ns Figure 19: DAI timing on receive path
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 57 of 101 23.01.2004 3.11 SIM interface The baseband processor has an integrated SIM interface compatible with the ISO 7816 IC Card standard. This is wired to the host interface (board-to-board connector) in order to be connected to an external SIM card holder. Six pins on the board-to-board connector are reserved for the SIM interface. The CCIN pin serves to detect whether a tray (with SIM card) is present in the card holder. Using the CCIN pin is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during operation. See Chapter 3.11.1 for details. It is recommended that the total cable length between the board-to-board connector pins on MC55/56 and the pins of the SIM card holder does not exceed 200 mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance. Table 15: Signals of the SIM interface (board-to-board connector) Signal Description CCGND Separate ground connection for SIM card to improve EMC. CCCLK Chipcard clock, various clock rates can be set in the baseband processor. CCVCC SIM supply voltage from PSU-ASIC CCIO Serial data line, input and output. CCRST Chipcard reset, provided by baseband processor. CCIN Input on the baseband processor for detecting a SIM card tray in the holder. The CCIN pin is mandatory for applications that allow the user to remove the SIM card during operation. The CCIN pin is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of MC55/56.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 58 of 101 23.01.2004 3.11.1 Requirements for using the CCIN pin According to ISO/IEC 7816-3 the SIM interface must be immediately shut down once the SIM card is removed during operation. Therefore, the signal at the CCIN pin must go low before the SIM card contacts are mechanically detached from the SIM interface contacts. This shut-down procedure is particularly required to protect the SIM card as well as the SIM interface of MC55/56 from damage. An appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been tested to operate with MC55/56 and is part of the Siemens reference equipment submitted for type approval. Molex ordering number is 91228-0001, see also Chapter 8. The module’s startup procedure involves a SIM card initialisation performed within 1 second after getting started. An important issue is whether the initialisation procedure ends up with a high or low level of the CCIN signal: a) If, during startup of MC55/56, the CCIN signal on the SIM interface is high, then the status of the SIM card holder can be recognized each time the card is inserted or ejected. A low level of CCIN indicates that no SIM card tray is inserted into the holder. In this case, the module keeps searching, at regular intervals, for the SIM card. Once the SIM card tray with a SIM card is inserted, CCIN is taken high again. b) If, during startup of MC55/56, the CCIN signal is low, the module will also attempt to initialise the SIM card. In this case, the initialisation will only be successful when the card is present. If the SIM card initialisation has been done, but the card is no more operational or removed, then the module will never search again for a SIM card and only emergency calls can be made. Removing and inserting the SIM card during operation requires the software to be reinitialised. Therefore, after reinserting the SIM card it is necessary to restart MC55/56. It is strongly recommended to connect the contacts of the SIM card detect switch to the CCIN input and to the CCVCC output of the module as illustrated in the sample diagram in Figure 20. Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initialising any SIM card that the user inserts after having removed a SIM card during operation. In this case, the application must restart MC55/56.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 59 of 101 23.01.2004 3.11.2 Design considerations for SIM card holder The schematic below is a sample configuration that illustrates the Molex SIM card holder located on the DSB45 Support Box (evaluation kit used for type approval of the Siemens MC55/56 reference setup, see [5]). X503 is the designation used for the SIM card holder in [5]. Molex card holder GSM module Figure 20: SIM card holder of DSB45 Support Box Table 16: Pin assignment of Molex SIM card holder on DSB45 Support Box Pin no. Signal name I/O Function 1 CCVCC I Supply voltage for SIM card, generated by the GSM engine 2 CCRST I Chip card reset, prompted by the GSM engine 3 CCCLK I Chip card clock 4 CCGND - Individual ground line for the SIM card to improve EMC 5 CCVPP - Not connected 6 CCIO I/O Serial data line, bi-directional 7 CCDET1 - Connect to CCVCC 8 CCDET2 Connects to the CCIN input of the GSM engine. Serves to recognize whether a SIM card is in the holder. Pins 1 through 8 (except for 5) are the minimum requirement according to the GSM Recommendations, where pins 7 and 8 are needed for SIM card tray detection through the CCIN pin. Figure 21: Pin numbers of Molex SIM card holder on DSB45 Support Box Place the capacitors C1205 and C1206 (or instead one capacitor of 200nF) as close as possible to the pins 1 (CCVCC) and 4 (GND) of the card holder. Connect the capacitors to the pins via low resistance tracks. 45127836
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 60 of 101 23.01.2004 3.12 Control signals 3.12.1 Inputs Table 17: Input control signals of the MC55/56 module Signal Pin Pin status Function Remarks Falling edge Power up MC55/56 Ignition /IGT Left open or HiZ No operation Active low ³ 100ms (Open drain/collector driver to GND required in cellular device application). Note: If a charger and a battery is connected to the customer application the /IGT signal must be 1s minimum. Low Power down MC55/56 Emergency shutdown /EMERG-OFF Left open or HiZ No operation Active low ³ 3.2s (Open drain/collector driver required in cellular device application). At the /EMERGOFF signal the watchdog signal of the GSM engine can be traced (see description in Table 27). (HiZ = high impedance)
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 61 of 101 23.01.2004 3.12.2 Outputs 3.12.2.1 Synchronization signal The synchronization signal serves to indicate growing power consumption during the transmit burst. The signal is generated by the SYNC pin (pin number 32). Please note that this pin can adopt two different operating modes which you can select by using the AT^SSYNC command (mode 0 and 1). For details refer to the following chapter and to [1]. To generate the synchronization signal the pin needs to be configured to mode 0 (= default). This setting is recommended if you want your application to use the synchronization signal for better power supply control. Your platform design must be such that the incoming signal accommodates sufficient power supply to the MC55/56 module if required. This can be achieved by lowering the current drawn from other components installed in your application. The characteristics of the synchronization signal are explained below. Table 18: MC55/56 synchronization signal (if SYNC pin is set to mode 0 via AT^SSYNC) Function Pin Pin status Description Low No operation Synchronization SYNC High Indicates increased power consumption during transmission. Figure 22: SYNC signal during transmit burst *) The duration of the SYNC signal is always equal, no matter whether the traffic or the access burst are active. Transmit burst1 Tx 577 µs every 4.616 ms2 Tx 1154 µs every 4.616 ms300 µsSYNC signal*)
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 62 of 101 23.01.2004 3.12.2.2 Using the SYNC pin to control a status LED As an alternative to generating the synchronization signal, the SYNC pin can be used to control a status LED on your application platform. To avail of this feature you need to set the SYNC pin to mode 1 by using the AT^SSYNC command. For details see [1]. When controlled from the SYNC pin the LED can display the functions listed in Table 19. Table 19: Coding of the status LED LED mode Operating status Off MC55/56 is off or run in SLEEP, Alarm or Charge-only mode 600 ms On / 600ms Off No SIM card inserted or no PIN entered, or network search in progress, or ongoing user authentication, or network login in progress. 75 ms On / 3 s Off Logged to network (monitoring control channels and user interactions). No call in progress. 75 ms on / 75 ms Off / 75 ms On / 3 s Off One or more GPRS contexts activated. Flashing Indicates GPRS data transfer: When a GPRS transfer is in progress, the LED goes on within 1 second after data packets were exchanged. Flash duration is approximately 0.5 s. On Depending on type of call: Voice call: Connected to remote party. Data call: Connected to remote party or exchange of parameters while setting up or disconnecting a call. LED Off = SYNC pin low. LED On = SYNC pin high (if LED is connected as illustrated in Figure 23) To operate the LED a buffer, e.g. a transistor or gate, must be included in your application. A sample configuration can be gathered from Figure 23. Power consumption in the LED mode is the same as for the synchronization signal mode. For details see Table 27, SYNC pin. Figure 23: LED Circuit (Example)
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 63 of 101 23.01.2004 1s/RING0URC3.12.2.3 Behaviour of the /RING0 line (ASC0 interface only) The /RING0 line is available on the first interface (ASC0). Its behaviour depends on the type of the call received. · When a voice call comes in the /RING0 line goes low for 1s and high for another 4s. Every 5 seconds the ring string is generated and sent over the /RXD0 line. If there is a call in progress and call waiting is activated for a connected handset or handsfree device, the /RING0 line switches to ground in order to generate acoustic signals that indicate the waiting call. Figure 24: Incoming voice call · Likewise, when a Fax or data call is received, /RING0 goes low. However, in contrast to voice calls, the line remains low. Every 5 seconds the ring string is generated and sent over the /RXD0 line. Figure 25: Incoming data call · All types of Unsolicited Result Codes (URCs) also cause the /RING0 line to go low, however for 1 second only. For example, MC55/56 may be configured to output a URC upon the receipt of an SMS. As a result, if this URC type was activated with AT+CNMI=1,1, each incoming SMS causes the /RING0 line to go low. See [1] for detailed information on URCs. Figure 26: URC transmission Table 20: MC55/56 ring signal Function Pin Status Description 0 Indicates an incoming call or URC. If in NON-CYCLIC SLEEP mode CFUN=0 or CYCLIC SLEEP mode CFUN=5 or 6, the module is caused to wake up to full functionality. If CFUN=7 or 8, power saving is resumed after URC transmission or end of call. Ring indication /RING0 1 No operation 4s/RING04s1s 1s 1sRing stringRing stringRing string5s/RING0Ring stringRing stringRing string5s
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 64 of 101 23.01.2004 4 Antenna interface The RF interface has an impedance of 50". MC55/56 is capable of sustaining a total mismatch at the antenna connector or pad without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, DC-power consumption and harmonic suppression. Matching networks are not included on the MC55/56 PCB and should be placed in the host application. Regarding the return loss MC55/56 provides the following values: Table 21: Return loss State of module Return loss of module Recommended return loss of application Receive > 8dB > 12dB Transmit not applicable > 12dB Idle < 5dB not applicable The connection of the antenna or other equipment must be decoupled from DC voltage. 4.1 Antenna installation To suit the physical design of individual applications MC55/56 offers two alternative approaches to connecting the antenna: · Recommended approach: U.FL-R-SMT antenna connector from Hirose assembled on the component side of the PCB (top view on MC55/56). See Chapter 4.1.2 for details. · Antenna pad and grounding plane placed on the bottom side. See Chapter 4.1.1. Figure 27: U.FL-R-SMT connector Figure 28: Antenna pad and GND plane
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 65 of 101 23.01.2004 Module Antenna ormeasurementequipment50Ohm50OhmU.FL PADZ Module Antenna or measurement equipment 50Ohm 50OhmU.FL Z PAD The U.FL-R-SMT connector has been chosen as antenna reference point (ARP) for the Siemens reference equipment submitted to type approve MC55/56. All RF data specified throughout this manual are related to the ARP. For compliance with the test results of the Siemens type approval you are advised to give priority to the connector, rather than using the antenna pad. IMPORTANT: Both solutions can only be applied alternatively. This means, whenever an antenna is plugged to the Hirose connector, the pad must not be used. Vice versa, if the antenna is connected to the pad, then the Hirose connector must be left empty. Antenna connected to Hirose connector: Antenna connected to pad: Figure 29: Never use antenna connector and antenna pad at the same time No matter which option you choose, ensure that the antenna pad does not come into contact with the holding device or any other components of the host application. It needs to be surrounded by a restricted area filled with air, which must also be reserved 0.8 mm in height. PCB U.FL antenna connector RF section Antenna pad Restricted area Figure 30: Restricted area around antenna pad
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 66 of 101 23.01.2004 4.1.1 Antenna pad The antenna can be soldered to the pad, or attached via contact springs. To help you ground the antenna, MC55/56 comes with a grounding plane located close to the antenna pad. The positions of both pads can be seen from Figure 41. When you decide to use the antenna pad take into account that the pad has not been intended as antenna reference point (ARP) for the Siemens MC55/56 type approval. The antenna pad is provided only as an alternative option which can be used, for example, if the recommended Hirose connection does not fit into your antenna design. Also, consider that according to the GSM recommendations TS 45.005 and TS 51.010-01 a 50" connector is mandatory for type approval measurements. This requires GSM devices with an integral antenna to be temporarily equipped with a suitable connector or a low loss RF cable with adapter. To prevent damage to the module and to obtain long-term solder joint properties you are advised to maintain the standards of good engineering practice for soldering. MC55/56 material properties: MC55/56 PCB: FR4 Antenna pad: Gold plated pad 4.1.1.1 Suitable cable types For direct solder attachment, we suggest to use the following cable types: · RG316/U 50 Ohm coaxial cable · 1671A 50 Ohm coaxial cable Suitable cables are offered, for example, by IMS Connector Systems. For further details and other cable types please contact http://www.imscs.com.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 67 of 101 23.01.2004 4.1.2 Hirose antenna connector MC55/56 uses an ultra-miniature SMT antenna connector supplied from Hirose Ltd. The product name is: U.FL-R-SMT The position of the antenna connector on the MC55/56 board can be seen in Figure 40. Figure 31: Mechanical dimensions of U.FL-R-SMT connector Table 22: Product specifications of U.FL-R-SMT connector Item Specification Conditions Ratings Nominal impedance 50 W Rated frequency DC to 3 GHz Operating temp:-40°c to + 90°C Operating humidity: max. 90% Mechanical characteristics Female contact holding force 0.15 N min Measured with a Æ 0.475 pin gauge Repetitive operation Contact resistance: Centre 25 mW Outside 15mW 30 cycles of insertion and disengagement Vibration No momentary disconnections of 1 µs; No damage, cracks and looseness of parts Frequency of 10 to 100 Hz, single amplitude of 1.5 mm, acceleration of 59 m/s2, for 5 cycles in the direction of each of the 3 axes Shock No momentary disconnections of 1 µs. No damage, cracks and looseness of parts. Acceleration of 735 m/s2, 11 ms duration for 6 cycles in the direction of each of the 3 axes Environmental characteristics Humidity resistance No damage, cracks and looseness of parts. Insulation resistance: 100 MW min. at high humidity 500 MW min when dry Exposure to 40°C, humidity of 95% for a total of 96 hours Temperature cycle No damage, cracks and looseness of parts. Contact resistance: Centre 25 mW Outside 15mW Temperature: +40°C ® 5 to 35°C ® +90°C ® 5 to 35°C Time: 30 min. ® within 5 min. ® 30 min. within 5 min Salt spray test No excessive corrosion 48 hours continuous exposure to 5% salt water
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 68 of 101 23.01.2004 Table 23: Material and finish of U.FL-R-SMT connector and recommended plugs Part Material Finish Shell Phosphor bronze Silver plating Male centre contact Brass Gold plating Female centre contact Phosphor bronze Gold plating Insulator Plug: PBT Receptacle: LCP Black Beige Mating plugs and cables can be chosen from the Hirose U.FL Series. Examples are shown below and listed in Table 24. For latest product information please contact your Hirose dealer or visit the Hirose home page, for example http://www.hirose.com. Figure 32: U.FL-R-SMT connector with U.FL-LP-040 plug Figure 33: U.FL-R-SMT connector with U.FL-LP-066 plug
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 69 of 101 23.01.2004 In addition to the connectors illustrated above, the U.FL-LP-(V)-040(01) version is offered as an extremely space saving solution. This plug is intended for use with extra fine cable (up to Æ 0.81 mm) and minimizes the mating height to 2 mm. See Figure 34 which shows the Hirose datasheet. Figure 34: Specifications of U.FL-LP-(V)-040(01) plug
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 70 of 101 23.01.2004 Table 24: Ordering information for Hirose U.FL Series Item Part number HRS number Connector on MC55/56 U.FL-R-SMT CL331-0471-0-10 Right-angle plug shell for Æ 0.81 mm cable U.FL-LP-040 CL331-0451-2 Right-angle plug for Æ 0.81 mm cable U.FL-LP(V)-040 (01) CL331-053-8-01 Right-angle plug for Æ 1.13 mm cable U.FL-LP-066 CL331-0452-5 Right-angle plug for Æ 1.32 mm cable U.FL-LP-066 CL331-0452-5 Extraction jig E.FL-LP-N CL331-04441-9
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 71 of 101 23.01.2004 5 Electrical, reliability and radio characteristics 5.1 Absolute maximum ratings Absolute maximum ratings for supply voltage and voltages on digital and analog pins of MC55/56 are listed in Table 25. Exceeding these values will cause permanent damage to MC55/56. The power supply shall be compliant with the SELV safety standard defined in EN60950. The supply current must be limited according to Table 25. Table 25: Absolute maximum ratings Parameter Min Max Unit Voltage BATT+ -0.3 4.8 V Voltage at digital pins -0.3 3.3 V Voltage at analog pins -0.3 3.0 V Voltage at digital / analog pins in POWER DOWN mode -0.25 +0.25 V Voltage at POWER pin 15 V Voltage at CHARGE pin 15 V Differential load resistance between EPNx and EPPx 15 W 5.2 Operating temperatures Test conditions were specified in accordance with IEC 60068-2 (still air). The values stated below are in compliance with GSM recommendation TS 51.010-01. Table 26: Operating temperatures Parameter Min Typ Max Unit Ambient temperature (according to GSM 11.10) -20 25 55 °C Restricted operation *) -25 to -20 55 to 65 °C Automatic shutdown MC55/56 board temperature Battery temperature -29 -18 >65**) >60 °C °C Charging temperature (software controlled fast charging) 0 +45 °C *) MC55/56 works, but deviations from the GSM specification may occur. **) The MC55/56 has the automatic shutdown set to 65°C at power class 5 (GSM900/GSM850) GPRS class 8. This prevents permanent damage to components on the board. Consider the ratio of output power, supply voltage and operating temperature: To achieve Tamb max = 65°C and, for example, GSM 900 PCL5 the supply voltage must not be higher than 4.0V.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 72 of 101 23.01.2004 5.3 Electrical specifications of the application interface Please note that the reference voltages listed in Table 27 are the values measured directly on the MC55/56 module. They do not apply to the accessories connected. If an input pin is specified for Vi,h,max = 3.3V, be sure never to exceed the stated voltage. The value 3.3V is an absolute maximum rating. The Hirose DF12C board-to-board connector on MC55/56 is a 50-pin double-row receptacle. The names and the positions of the pins can be seen from Figure 35 which shows the top view of MC55. Figure 35: Pin assignment (top view on MC55) BATT+ GND BATT+ GND BATT+ GND BATT+ GND BATT+ GND VDD CHARGE /RING0 POWER /DSR0 VDDLP /RTS0 /TXD0 /DTR0 /TXD1 /RTS1 /RXD0 /CTS0 /RXD1 /CTS1 SYNC /DCD0 BATT_TEMP /EMERGOFF RFSDAI /IGT TXDDAI GND SCLK MICN1 TFSDAI MICP1 RXDDAI MICP2 CCGND MICN2 CCIN EPN1 CCRST EPP1 CCIO EPP2 CCVCC EPN2 CCCLK 2650251
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 73 of 101 23.01.2004 Table 27: Electrical description of application interface Function Signal name IO Signal form and level Comments BATT+ I VI = 3.3V to 4.8V VInorm = 4.1V Inorm # 2A, Imax < 3A (during Tx burst) Power supply GND 1 Tx, peak current 577µs every 4.616ms 2 Tx, peak current 1154µs every 4.616ms Power supply input. 5 BATT+ pins to be connected in parallel. 5 GND pins to be connected in parallel. The power supply must be able to meet the requirements of current consumption in a Tx burst (up to 3A). Sending with two timeslots doubles the duration of current pulses to 1154µs (every 4.616ms)! POWER I VImin = 3.0V VImax = 15V This line signalises to the processor that the charger is connected. If unused keep pin open. BATT_TEMP I Connect NTC with RNTC # 10kW @ 25°C to ground. Input to measure the battery temperature over NTC resistor. NTC should be installed inside or near battery pack to enable the charging algorithm and deliver temperature values. If unused keep pin open. Charge interface CHARGE O ICHARGE = -300µA ... -600µA @ 3V < VCHARGE < VLOAD This line is a current source for the charge FET with a 10kW resistance between gate and source. If unused keep pin open. External supply voltage VDD O VDDmin = 2.84V, VDDmax = 2.96V Imax = -10mA CLmax = 1µF Supply voltage, e.g. for an external LED or level shifter. The external digital logic must not cause any spikes or glitches on voltage VDD. Not available in POWER DOWN mode. VDD signalises the “ON” state of the module. If unused VDD keep pin open. VDD Low Power VDDLP I/O RI =1kW VOmax # 4.0V (output) VImin = 2.2V, VImax = 5.5V (input) IItyp = 10µA at BATT+ = 0V Mobile in POWER DOWN mode: VImin = 1.2V Supplies the RTC with power via an external capacitor or buffer battery if no VBATT+ is applied. If unused keep pin open.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 74 of 101 23.01.2004 Function Signal name IO Signal form and level Comments Ignition /IGT I RI # 100kW, CI # 1nF VILmax = 0.5V at Imax = -20µA VOpenmax = 2.3V ON ~~~|____|~~~ Active Low ³ 100ms Input to switch the mobile ON. The line must be driven low by an Open Drain or Open Collector driver. Emergency shutdown (Watchdog) /EMERGOFF I RI #22kW VILmax = 0.5V at Imax = -100µA VOpenmax = 2.73V Signal ~~~|______|~~~ Active Low ³ 3.2s Watchdog: VOLmax = 0.35V at I = 10µA VOHmin= 2.25V at I = -10µA fOmin = 0.16Hz fOmax = 1.55Hz This line must be driven by an Open Drain or Open Collector driver. Emergency shutdown deactivates the power supply to the module. The module can be reset if /IGT is activated after emergency shutdown. To switch the mobile off use the AT^SMSO command. /EMERGOFF also indicates the internal watchdog function. If unused keep pin open. VOLmax = 0.2V at I = 1mA VOHmin = 2.35V at I = -1mA VOHmax = 2.73V Synchroni-zation SYNC O 1 Tx, 877µs impulse each 4.616ms and 2 Tx, 1454µs impulse each 4.616ms, with 300µs forward time. Indicates increased current consumption during uplink transmission burst. Note that timing is different during handover. Alternatively used to control status LED (see Chapter 3.12.2.2). If unused keep pin open. CCIN I RI # 100kW VILmax = 0.5V VIHmin = 2.15V at I = 20µA, VIHmax=3.3V at I = 30µA CCRST O RO #47W VOLmax = 0.25V at I = 1mA VOHmin = 2.3V at I = -1mA VOHmax = 2.73V CCIO IO RI #10kW VILmax = 0.5V VIHmin = 1.95V, VIHmax=3.3V RO #220W VOLmax = 0.4V at I = 1mA VOHmin = 2.15V at I = -1mA VOHmin = 2.55V at I = -20µA VOHmax = 2.96V CCCLK O RO #220W VOLmax = 0.4V at I = 1mA VOHmin = 2.15V at I = -1mA VOHmax = 2.73V CCVCC O ROmax = 5W CCVCCmin = 2.84V, CCVCCmax = 2.96V Imax = -20mA SIM interface CCGND Ground CCIN = high, SIM card holder closed (no card recognition) Maximum cable length 200mm to SIM card holder. All signals of SIM interface are protected against ESD with a special diode array. Usage of CCGND is mandatory.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 75 of 101 23.01.2004 Function Signal name IO Signal form and level Comments /RXD0 O /TXD0 I /CTS0 O /RTS0 I /DTR0 I /DCD0 O /DSR0 O ASC0 interface /RING0 O VOLmax = 0.2V at I = 1mA VOHmin = 2.35V at I = -1mA VOHmax = 2.73V VILmax = 0.5V VIHmin = 1.95V, VIHmax=3.3V /DTR0, RTS0: Imax = -90µA at VIN = 0V /TXD0: Imax = -30µA at VIN = 0V First serial interface for AT commands or data stream. If unused keep pins open. /RXD1 O /TXD1 I /CTS1 O ASC1 interface /RTS1 I VOLmax = 0.2V at I = 1mA VOHmin = 2.35V at I = -1mA VOHmax = 2.73V VILmax = 0.5V VIHmin = 1.95V, VIHmax=3.3V IImax = -90µA at VIN = 0V Second serial interface for AT commands. If unused keep pins open. RFSDAI I RXDDAI I SCLK I TFSDAI O Digital audio interface TXDDAI O VOLmax = 0.2V at I = 1mA VOHmin = 2.35V at I = -1mA VOHmax = 2.73V VILmax = 0.5V VIHmin = 1.95V, VIHmax=3.3V IImax = 330µA at VIN = 3.3V If unused keep pins open. EPP2 O EPN2 O VOmax = 3.7Vpp See also Table 31. The audio output is balanced and can directly operate an earpiece. If unused keep pins open. EPP1 O EPN1 O VOmax = 3.7Vpp See also Table 31. Balanced audio output. Can be used to directly operate an earpiece. If unused keep pins open. MICP1 I MICN1 I RI # 50kW differential VImax = 1.03Vpp See also Table 32. Balanced microphone input. To be decoupled with 2 capacitors (CK = 100nF), if connected to a microphone or another device. If unused keep pins open. MICP2 I MICN2 I RI = 2kW differential VImax = 1.03Vpp See also Table 32. Balanced microphone input. Can be used to directly feed an active microphone. If used for another signal source, e.g. op amp, to be decoupled with capacitors. If unused keep pins open. Analog audio interfaces AGND Separate ground connection for external audio circuits. Explanation of signal names: P = positive, N = negative
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 76 of 101 23.01.2004 5.4 Power supply ratings Table 28: Power supply ratings Parameter Description Conditions Min Typ Max Unit Supply voltage Reference points on MC55/56: TP BATT+ and TP GND (see Figure 41). Voltage must stay within the min/max values, including voltage drop, ripple, spikes. 3.3 4.1 4.8 VVoltage drop during transmit burst Normal condition, power control level for Pout max 400 mVBATT+ Voltage ripple Normal condition, power control level for Pout max @ f<200kHz @ f>200kHz 502mVPOWER DOWN mode 50 100 µASLEEP mode @ DRX = 6 3 mAIDLE mode GSM850 EGSM 900 GSM 1800/1900 15 15 15 mATALK mode GSM850 1) EGSM 9001) GSM 1800/19002) 260 260 180 mAIDLE GPRS GSM850 EGSM 900 GSM 1800/1900 15 15 15 mADATA mode GPRS, (4 Rx, 1 Tx) E GSM850 1) GSM 9001) GSM 1800/19002) 300 300 230 mAAverage supply current3) DATA mode GPRS, (3 Rx, 2 Tx) GSM850 1) EGSM 9001) GSM 1800/19002) 450 450 330 mAIBATT+ Peak supply current (during transmission slot every 4.6ms) Power control level 1) 1.6 A1) Power control level PCL 5 2) Power control level PCL 0 3) All average supply current values @ IVDD = 0mA
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 77 of 101 23.01.2004 5.4.1 Current consumption during transmit burst The diagrams provided in Figure 36 and Figure 37 illustrate the typical current consumption of the application caused during a transmit burst. The typical peak current is shown vs. the power control level for 900 MHz, 1800 MHz and 1900 MHz and vs. the return loss of the antenna. Test conditions: All measurements have been performed at Tamb= 25°C, VBATT+ nom = 4.1V. The voltage in the transmit burst was measured with the AT^STBD=1 command, however it could just as easily be measured by using the BATT+ and GND test points on the back side of the module. The curves are for one TX slot (for example a voice call, CSD call or Class 8 GPRS). Curves for Class 10 GPRS activities (2 TX slots) are shown too. Changing the conditions, e.g. in terms of temperature or voltage, will cause different results. The current will be maximized when the maximum supply voltage is used together with a total reflection at the RF interface. Average Current GSM900 (VBATT+=4.1V)0.100.100.110.150.210.250.130.140.160.230.330.4300.050.10.150.20.250.30.350.40.450.55 7 9 1113151719Power Control LevelCurrent (Amps)1 TX - Average Current2 TX - Average Current
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 78 of 101 23.01.2004 Average Current DCS1800 (VBATT+=4.1V)0.100.100.120.130.180.130.140.160.190.2600.050.10.150.20.250.30123456789101112131415Power Control LevelCurrent (Amps)1 TX - Average Current2 TX - Average Current Average Current PCS1900 (VBATT+=4.1V)0.100.110.120.130.170.130.140.170.210.2900.050.10.150.20.250.30123456789101112131415Power Control LevelCurrent (Amps)1 TX - Average Current2 TX - Average Current
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 79 of 101 23.01.2004 Burst Current GSM900 (VBATT+=4.1V)0.30.40.681.241.60.2800.20.40.60.811.21.41.61.85 7 9 11 13 15 17 19Power Control LevelCurrent (Amps)1 TX - Peak current Burst Current DCS1800 (VBATT+=4.1V)0.270.380.240.840.5200.10.20.30.40.50.60.70.80.910123456789101112131415Power Control LevelCurrent (Amps)1 TX - Peak current
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 80 of 101 23.01.2004 Burst Current PCS1900 (VBATT+=4.1V)0.920.60.30.420.2400.10.20.30.40.50.60.70.80.910123456789101112131415Power Control LevelCurrent (Amps)1 TX - Peak current Test conditions: Tamb= 25°C, VBATT+ nom = 4.1V Figure 36: Typical current consumption vs. power control level
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 81 of 101 23.01.2004 02004006008001000120014001600Burst (max) Burst (min) Average Current (Max) Average Current (Min)Current (mA)ch.124 PCL5Service mode GSM900 ch.124 Variations in current with 0.4dB return loss (all phases) 01002003004005006007008009001000Burst (max) Burst (min) Average Current (Max) Average Current (Min)Current (mA)ch.661 PCL0Service mode PCS1900 ch.661 Variations in current with 0.6dB return loss (all phases) Test conditions: Tamb= 25°C, VBATT+ nom = 4.1V measured at TP BATT+ and GND, 1 TX slot Figure 37: Typical current consumption vs. return loss
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 82 of 101 23.01.2004 Electrical characteristics of the voiceband part 5.4.2 Setting audio parameters by AT commands The audio modes 2 to 6 can be adjusted according to the parameters listed below. Each audio mode is assigned a separate set of parameters. Table 29: Audio parameters adjustable by AT command Parameter Influence to Range Gain range Calculation inBbcGain MICP/MICN analog amplifier gain of baseband controller before ADC 0...7 0...42dB 6dB steps inCalibrate digital attenuation of input signal after ADC 0...32767 -$...0dB 20 * log (inCalibrate/ 32768) outBbcGain EPP/EPN analog output gain of baseband controller after DAC 0...3 0...-18dB 6dB steps outCalibrate[n] n = 0...4 digital attenuation of output signal after speech decoder, before summation of sidetone and DAC present for each volume step[n] 0...32767 -$...+6dB 20 * log (2 * outCalibrate[n]/ 32768) sideTone digital attenuation of sidetone is corrected internally by outBbcGain to obtain a constant sidetone independent of output volume 0...32767 -$...0dB 20 * log (sideTone/ 32768) Note: The parameters inCalibrate, outCalibrate and sideTone accept also values from 32768 to 65535. These values are internally truncated to 32767.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 83 of 101 23.01.2004 5.4.3 Audio programming model The audio programming model shows how the signal path can be influenced by varying the AT command parameters. The model is the same for all three interfaces, except for the parameters <outBbcGain> and <inBbcGain> which cannot be modified if the digital audio interface is being used, since in this case the DAC is switched off. The parameters inBbcGain and inCalibrate can be set with AT^SNFI. All the other parameters are adjusted with AT^SNFO. ADAD-¥...0dBSpeech coder0dB; -6db, -12dB; -18dB +0...42dB in 6dB steps 1k 1k 1k 1k 2,65V 10uF + sideTone AT parameters outCalibrate[n] n = 0...4 inCalibrate inBbcGain outBbcGain Speech decoderMIC2 Figure 38: AT audio programming model
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 84 of 101 23.01.2004 5.4.4 Characteristics of audio modes The electrical characteristics of the voiceband part depend on the current audio mode set with the AT^SNFS command. Table 30: Voiceband characteristics (typical) Audio mode no. AT^SNFS= 1 (Default settings, not adjustable) 2 3 4 5 6 Name Default Handset Basic Handsfree Headset User Handset Plain Codec 1 Plain Codec 2 Purpose DSB with Votronic handset Siemens Car Kit Portable Siemens Headset DSB with individual handset Direct access to speech coder Direct access to speech coder Gain setting via AT command. Defaults: inBbcGain outBbcGain Fix 4 (24dB) 1 (-6dB) Adjustable 2 (12dB) 1 (-6dB) Adjustable 5 (30dB) 2 (-12dB) Adjustable 4 (24dB) 1 (-6dB) Adjustable 0 (0dB) 0 (0dB) Adjustable 0 (0dB) 0 (0dB) Default audio interface 1 2 2 1 1 2 4) Power supply ON (2.65V) ON (2.65V) ON (2.65V) ON (2.65V) OFF (GND) OFF (GND)Sidetone ON --- Adjustable Adjustable Adjustable Adjustable Volume control OFF Adjustable Adjustable Adjustable Adjustable Adjustable Limiter (receive) ON ON ON ON --- --- Compressor (receive) --- OFF1) --- --- --- --- AGC (send) --- --- ON --- --- --- Echo control (send) Suppression Cancellation +suppression --- Suppres-sion --- --- Noise suppression2) --- up to 10dB 10dB --- --- --- MIC input signal for 0dBm0 @ 1024 Hz (default gain) 23mV 58mV 7.5mV @ -3dBm0 due to AGC 23mV 315mV 315mV EP output signal in mV rms. @ 0dBm0, 1024 Hz, no load (default gain); @ 3.14 dBm0 284mV 120mV default @ max volume 300mV default @ max volume 284mV default @ max volume 895mV 3.7Vpp 895mV 3.7Vpp Sidetone gain at default settings 22.8dB -$ dB Affected by AGC, 13dB @ 7.5mV (MIC) 22.8dB -2.5dB @ sideTone = 81923) -2.5dB @ sideTone = 81923) 1) Adaptive, receive volume increases with higher ambient noise level. The compressor can be activated by loading an application specific audio parameter set (see [8]). 2) In audio modes with noise reduction, the microphone input signal for 0dBm0 shall be measured with a sine burst signal for a tone duration of 5 seconds and a pause of 2 sec. The sine signal appears as noise and, after approx. 12 sec, is attenuated by the noise reduction by up to 10dB. 3) See AT^SNFO command in [1]. 4) Audio mode 5 and 6 are identical. With AT^SAIC, you can easily switch mode 5 to the second
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 85 of 101 23.01.2004 interface. Therefore, audio mode 6 is only kept for compatibility to earlier Siemens GSM products. Note: With regard to acoustic shock, the cellular application must be designed to avoid sending false AT commands that might increase amplification, e.g. for a high sensitive earpiece. A protection circuit should be implemented in the cellular application. 5.4.5 Voiceband receive path Test conditions: · The values specified below were tested to 1kHz and 0dB gain stage, unless otherwise stated. · Parameter setup: gs = 0dB means audio mode = 5 for EPP1 to EPN1 and 6 for EPP2 to EPN2, inBbcGain= 0, inCalibrate = 32767, outBbcGain = 0, OutCalibrate = 16384, sideTone = 0. Table 31: Voiceband receive path Parameter Min Typ Max Unit Test condition / remark Differential output voltage (peak to peak) 3.33 3.7 4.07 V from EPPx to EPNx gs = 0dB @ 3.14 dBm0 no load Differential output gain settings (gs) at 6dB stages (outBbcGain) -18 0 dB Set with AT^SNFO Fine scaling by DSP (outCalibrate) -$ 0 dB Set with AT^SNFO Output differential DC offset 100 mV gs = 0dB, outBbcGain = 0 and -6dB Differential output resistance 2 " from EPPx to EPNx Differential load capacitance 1000 pF from EPPx to EPNx Absolute gain accuracy 0.8 dB Variation due to change in temperature and life time Attenuation distortion 1 dB for 300...3900Hz, @ EPPx/EPNx (333Hz) / @ EPPx/EPNx (3.66kHz) Out-of-band discrimination 60 dB for f > 4kHz with in-band test signal@ 1kHz and 1kHz RBW gs = gain setting
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 86 of 101 23.01.2004 5.4.6 Voiceband transmit path Test conditions: · The values specified below were tested to 1kHz and 0dB gain stage, unless otherwise stated. · Parameter setup: Audio mode = 5 for MICP1 to MICN1 and 6 for MICP2 to MICN2, inBbcGain= 0, inCalibrate = 32767, outBbcGain = 0, OutCalibrate = 16384, sideTone = 0 Table 32: Voiceband transmit path Parameter Min Typ Max Unit Test condition/Remark Input voltage (peak to peak) MICP1 to MICN1, MICP2 to MICN2 1.03 V Input amplifier gain in 6dB steps (inBbcGain) 0 42 dB Set with AT^SNFI Fine scaling by DSP (inCalibrate) -$ 0 dB Set with AT^SNFI Input impedance MIC1 50 k" Input impedance MIC2 2.0 k" Microphone supply voltage ON Ri = 4k" (MIC2 only) 2.57 2.17 1.77 2.65 2.25 1.85 2.73 2.33 1.93 V V V no supply current @ 100µA @ 200µA Microphone supply voltage OFF ; Ri = 4k" (MIC2 only) 0 V Microphone supply in POWER DOWN mode See Figure 17
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 87 of 101 23.01.2004 5.5 Air interface Test conditions: All measurements have been performed at Tamb= 25°C, VBATT+ nom = 4.1V. The reference points used on MC55/56 are the BATT+ and GND contacts (test points are shown in Figure 41). Table 33: Air Interface Parameter Min Typ Max Unit GSM 850 824 849 MHz E-GSM 900 880 915 MHz Frequency range Uplink (MS ® BTS) GSM 1800 1710 1785 MHz GSM 1900 1850 1910 MHz GSM 850 869 894 MHz E-GSM 900 925 960 MHz Frequency range Downlink (BTS ® MS) GSM 1800 1805 1880 MHz GSM 1900 1930 1990 MHz GSM 850 31 33 35 dBm E-GSM 9001) 31 33 35 dBm GSM 18002) 28 30 32 dBm RF power @ ARP with 50" load GSM 1900 28 30 32 dBm GSM 850 124 E-GSM 900 174 GSM 1800 374 Number of carriers GSM 1900 299 GSM 850 45 MHz E-GSM 900 45 MHz Duplex spacing GSM 1800 95 MHz GSM 1900 80 MHz Carrier spacing 200 kHz Multiplex, Duplex TDMA / FDMA, FDD Time slots per TDMA frame 8 Frame duration 4.615 ms Time slot duration 577 µs Modulation GMSK GSM 850 -102 -107 dBm E-GSM 900 -102 -107 dBm GSM 1800 -102 -106 dBm Receiver input sensitivity @ ARP BER Class II < 2.4% GSM 1900 -102 -105.5 dBm 1) Power control level PCL 5 2) Power control level PCL 0
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 88 of 101 23.01.2004 5.6 Electrostatic discharge The GSM engine is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a MC55/56 module. Special ESD protection provided on MC55/56: Antenna interface: one spark discharge line (spark gap) SIM interface: clamp diodes for protection against overvoltage. The remaining ports of MC55/56 are not accessible to the user of the final product (since they are installed within the device) and therefore, are only protected according to the “Human Body Model” requirements. MC55/56 has been tested according to the EN 61000-4-2 standard. The measured values can be gathered from the following table. Table 34: Measured electrostatic values Specification / Requirements Contact discharge Air discharge ETSI EN 301 489-7 ESD at SIM port ± 4kV ± 8kV ESD at antenna port ± 4kV ± 8kV Human Body Model (Test conditions: 1.5 kW, 100 pF) ESD at the module ± 1kV Note: Please note that the values may vary with the individual application design. For example, it matters whether or not the application platform is grounded over external devices like a computer or other equipment, such as the Siemens reference application described in Chapter 7.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 89 of 101 23.01.2004 5.7 Reliability characteristics The test conditions stated below are an extract of the complete test specifications. Table 35: Summary of reliability test conditions Type of test Conditions Standard Vibration Frequency range: 10-20 Hz; acceleration: 3.1mm amplitude Frequency range: 20-500 Hz; acceleration: 5g Duration: 2h per axis = 10 cycles; 3 axes DIN IEC 68-2-6 Shock half-sinus Acceleration: 500g Shock duration: 1msec 1 shock per axis 6 positions (± x, y and z) DIN IEC 68-2-27 Dry heat Temperature: +70 ±2°C Test duration: 16 h Humidity in the test chamber: < 50% EN 60068-2-2 Bb ETS 300019-2-7 Temperature change (shock) Low temperature: -40°C ±2°C High temperature: +85°C ±2°C Changeover time: < 30s (dual chamber system) Test duration: 1 h Number of repetitions: 100 DIN IEC 68-2-14 Na ETS 300019-2-7 Damp heat cyclic High temperature: +55°C ±2°C Low temperature: +25°C ±2°C Humidity: 93% ±3% Number of repetitions: 6 Test duration: 12h + 12h DIN IEC 68-2-30 Db ETS 300019-2-5 Cold (constant exposure) Temperature: -40 ±2°C Test duration: 16 h DIN IEC 68-2-1
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 90 of 101 23.01.2004 6 Mechanics The following chapters describe the mechanical dimensions of MC55/56 and give recommendations for integrating MC55/56 into the host application. 6.1 Mechanical dimensions of MC55/56 Figure 39 shows the top view on MC55/56 and provides an overview of the mechanical dimensions of the board. For further details see Figure 40. Size: 35±0.15 x 32.5±0.15 x 3.1±0.3 mm (including application connector) 35±0.15 x 32.5±0.15 x 2.8±0.2 mm (excluding application connector) Weight: 5.5g Figure 39: MC55/56 – top view
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 91 of 101 23.01.2004 All dimensions in millimetres Figure 40: Mechanical dimensions of MC55/56
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 92 of 101 23.01.2004 BATT+GroundAntenna padAntenna ground Figure 41: MC55/56 bottom view 6.2 Mounting MC55/56 onto the application platform There are many ways to properly install MC55/56 in the host device. An efficient approach is to mount the MC55/56 PCB to a frame, plate, rack or chassis. Fasteners can be M1.6 or M1.8 screws plus suitable washers, circuit board spacers, or customized screws, clamps, or brackets. Screws must be inserted with the screw head on the bottom of the MC55/56 PCB. In addition, the board-to-board connection can also be utilized to achieve better support. To avoid short circuits ensure that the bottom of the MC55/56 PCB do not come into contact with the host device since there are a number of test points. Refer to Chapter 6.4 for an overview on a variety of cooling elements. Again: Particular attention should be paid to the test points. These are for manufacturing purposes only and care must be taken to avoid contacting them when grounding and attaching a heat sink to the unit. Figure 41 shows the positions of all test points. To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it is positioned flat against the host device. All the information you need to install an antenna is summarized in Chapter 4.1. Note that the antenna pad on the bottom of the MC55/56 PCB must not be influenced by any other PCBs, components or by the housing of the host device. It needs to be surrounded by a restricted space as described in Chapter 4.1.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 93 of 101 23.01.2004 6.3 Board-to-board connector This chapter provides specifications for the 50-pin board-to-board connector which serves as physical interface to the host application. The receptacle assembled on the MC55/56 PCB is type Hirose DF12C. Mating headers from Hirose are available in different stacking heights. Figure 42: Hirose DF12C receptacle on MC55/56 Figure 43: Header Hirose DF12 series Table 36: Ordering information DF12 series Item Part number Stacking height (mm) HRS number Receptacle on MC55/56 DF12C(3.0)-50DS-0.5V(81) 3 - 5 537-0694-9-81 Headers DF12 series DF12E(3.0)-50DP-0.5V(81) DF12E(3.5)-50DP-0.5V(81) DF12E(4.0)-50DP-0.5V(81) DF12E(5.0)-50DP-0.5V(81) 3.0 3.5 4.0 5.0 537-0834-6-** 537-0534-2-** 537-0559-3-** 537-0584-0-** Notes: The headers listed above are without boss and metal fitting. Please contact Hirose for details on other types of mating headers. Asterixed HRS numbers denote different types of packaging. Table 37: Electrical and mechanical characteristics of the Hirose DF12C connector Parameter Specification (50 pin board-to-board connector) Number of contacts 50 Quantity delivered 2000 connectors per tape & reel Voltage 50V Rated current 0.3A max per contact Resistance 0.05 Ohm per contact Dielectric withstanding voltage 500V RMS min Operating temperature -45°C...+125°C Contact material phosphor bronze (surface: gold plated) Insulator material PA , beige natural Stacking height 3.0 mm ; 3.5 mm ; 4.0 mm ; 5.0 mm Insertion force 21.8N Withdrawal force 1st 10N Withdrawal force 50th 10N Maximum connection cycles 50
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 94 of 101 23.01.2004 6.3.1 Mechanical dimensions of the Hirose DF12 connector Figure 44: Mechanical dimensions of Hirose DF12 connector 6.3.2 Adapter cabling The board-to-board connection is primarily intended for direct contact between both connectors. If this assembly solution does not fit into your application design ensure that the used adapter cable meets the following requirements: · Maximum length: 200 mm It is recommended that the total cable length between the board-to-board connector pins on MC55/56 and the pins of the card holder does not exceed 200 mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance. · Type of cable: Flexible cable or flexible printed circuit board designed to mate with the Hirose receptacle and headers specified above. The equipment submitted for type approving the Siemens reference setup of MC55/56 includes a 160mm adapter cable. See Chapter 7.1.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 95 of 101 23.01.2004 6.4 Heat sinks and thermally conductive tapes Thermal management solutions vary largely according to the usage of the final product and the design of the host device. Therefore, the focus of this chapter is on a brief overview of standard heat sinks and thermally conductive tapes that have been tested with MC55/56. 6.4.1 Test conditions and results Table 38 shows the results of extensive testing based on different combinations of heat sinks and thermally conductive tapes. All measurements were performed under the same test conditions: · GPRS connection, Power control level 5, GSM Band: 900MHz · GPRS Class 10 (3x downlink, 2x uplink), Coding Scheme CS-4 · VBATT+ nom = 4.2V · Ambient temperature: 55°C · The conductive tapes were attached either to entire bottom area of the module (in Table 38 referred to as “Full area”), or only to the ground pad near the power amplifier (in Table 38 referred to as “PA only”).
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 96 of 101 23.01.2004 Table 38: Tested heat sinks and thermally conductive tapes and test results Manufacturer Product name Description Rth Website Temperature reduction Conductive tape positioned on Test condition: Thermally conductive tape T2022 combined with different heat sinks (material characteristics of T2022: adhesive on both sides, silicon free, 100µm, Rth > 0,1 K/W, manufacturer: Balkhausen) Fischerelektronik SK18 65mm x 37.5mm 3.75 K/W www.fischerelektronik.de 12-15°C Full area 5-10°C PA only Fischerelektronik ICK R 19 K/W www.fischerelektronik.de 4-5°C PA only Fischerelektronik ICK C17 17 K/W www.fischerelektronik.de 3-4°C PA only Fischerelektronik SFP 060-50 Aluminium Profile 80mm x 50mm x 8mm Not specified www.fischerelektronik.de 4-6°C Full area Fischerelektronik SFP 007-50 Aluminium Profile 40mm x 50mm x 5mm Not specified www.fischerelektronik.de 1°C Full area Wakefield Spezial A&D 13mm x 5mm 32 K/W www.wakefield.com 2°C PA only Wakefield Spezial A&D 19mm x 8mm 27 K/W www.wakefield.com 2°C PA only Test condition: Heat sink SK 18 with conductive tape TAP 005 Balkhausen TAP 005 adhesive on both sides, silicon free, 125µm >0,1 K/W www.balkhausen.com 10-13°C Full area
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 97 of 101 23.01.2004 7 Reference Approval 7.1 Reference Equipment for Type Approval The Siemens reference setup submitted to type approve MC55/56 consists of the following components: · Siemens MC55/56 cellular engine · Development Support Box (DSB45) · Flex cable (160 mm) from Hirose DF12C receptacle on MC55/56 to Hirose DF12 connector on DSB45. Please note that this cable is not included in the scope of delivery of DSB45. · SIM card reader integrated on DSB45 · Handset type Votronic HH-SI-30.3/V1.1/0 · PC as MMI GSM engine PC Power supply SIMFlex cable160mm RS-232 DAI Box DSB45HandsetAcoustic tester Antenna or 50 W cable to system simulator AntennaDAI cable for acoustic measuring Figure 45: Reference equipment for approval
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 98 of 101 23.01.2004 7.2 Compliance with FCC Rules and Regulations (MC55 only) The FCC Equipment Authorization Certification for the MC55 reference application described in Chapter 7.1 is listed under the FCC identifier QIPMC55 granted to Siemens AG. The MC55 reference application registered under the above identifier is certified to be in accordance with the following Rules and Regulations of the Federal Communications Commission (FCC). “This device contains GSM 900 MHz and GSM 1800MHz functions that are not operational in U.S. Territories. This device is to be used only for mobile and fixed applications. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure com-pliance. Antennas used for this OEM module must not exceed 7dBi gain for mobile and fixed operating configurations. This device is approved as a module to be installed in other devices. Each OEM must obtain their own Certification for each device containing this module.” IMPORTANT: Manufacturers of mobile or fixed devices incorporating MC55 modules are advised to · clarify any regulatory questions, · have their completed product tested, · have product approved for FCC compliance, and · include instructions according to above mentioned RF exposure statements in end product user manual.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 99 of 101 23.01.2004 7.3 Compliance with FCC Rules and Regulations (MC56 only) The FCC Equipment Authorization Certification for the MC56 reference application described in Chapter 7.1 is listed under the FCC identifier QIPMC56 granted to Siemens AG. The MC56 reference application registered under the above identifier is certified to be in accordance with the following Rules and Regulations of the Federal Communications Commission (FCC). “This device contains GSM 1800MHz function that is not operational in U.S. Territories. This device is to be used only for mobile and fixed applications. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure com-pliance. Antennas used for this OEM module must not exceed 7dBi gain (GSM 1900) and 1.4dBi (GSM 850) for mobile and fixed operating configurations. This device is approved as a module to be installed in other devices. Each OEM must obtain their own Certification for each device containing this module.” IMPORTANT: Manufacturers of mobile or fixed devices incorporating MC56 modules are advised to · clarify any regulatory questions, · have their completed product tested, · have product approved for FCC compliance, and · include instructions according to above mentioned RF exposure statements in end product user manual.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 100 of 101 23.01.2004 8 List of parts and accessories Table 39: List of parts and accessories Description Supplier Ordering information MC55/56 Siemens Siemens ordering number: To be defined Siemens Car Kit Portable Siemens Siemens ordering number: L36880-N3015-A117 DSB45 Support Box Siemens Siemens ordering number: L36880-N8301-A100 BB35 Bootbox Siemens Siemens ordering number: L36880-N8102-A100-1 Votronic Handset VOTRONIC Votronic HH-SI-30.3/V1.1/0 VOTRONIC Entwicklungs- und Produktionsgesellschaft für elektronische Geräte mbH Saarbrücker Str. 8 D-66386 St. Ingbert Phone: 06 89 4 / 92 55-0 Fax: 06 89 4 / 92 55-88 e-mail: contact@votronic.com SIM card holder incl. push button ejector and slide-in tray Molex Ordering numbers: 91228 91236 Sales contacts are listed in Table 40. Battery cell XWODA Shenzhen Xwoda Electronic Co., Ltd To place orders or obtain more information please contact: Shenzhen Xwoda Electronic Co., Ltd Building C, Tongfukang Industrial Zone Shiyan Town, Bao’an District Shenzen P.R. China Contact: Waichard Tsui Phone: +86-755-27623789 ext. 370 Fax: +86-755-27623078 Email: waichard@xwoda.com.cn Info: Http://xwoda.com.cn DF12C board-to-board connector Hirose See Chapter 6.3 for details on receptacle on MC55/56 and mating headers. Sales contacts are listed in Table 41. U.FL-R-SMT antenna connector Hirose See Chapter 4.1.2 for details on U.FL-R-SMT connector, mating plugs and cables. Sales contacts are listed in Table 41.
MC55/56 Hardware Interface Description Confidential / Released s mo b i l e MC55/56_hid_v01.03a Page 101 of 101 23.01.2004 Table 40: Molex sales contacts (subject to change) Molex For further information please click: http://www.molex.com/ Molex Deutschland GmbH Felix-Wankel-Str. 11 4078 Heilbronn-Biberach Germany Phone: +49-7066-9555 0 Fax: +49-7066-9555 29 Email: mxgermany@molex.com American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Molex China Distributors Beijing, Room 1319, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Phone: +86-10-6526-9728 Phone: +86-10-6526-9731 Fax: +86-10-6526-9730 Molex Singapore Pte. Ltd. Jurong, Singapore Phone: +65-268-6868 Fax: +65-265-6044 Molex Japan Co. Ltd. Yamato, Kanagawa, Japan Phone: +81-462-65-2324 Fax: +81-462-65-2366 Table 41: Hirose sales contacts (subject to change) Hirose Ltd. For further information please click: http://www.hirose.com Hirose Electric (U.S.A.) Inc 2688 Westhills Court Simi Valley, CA 93065 U.S.A. Phone: +1-805-522-7958 Fax: +1-805-522-3217 Hirose Electric GmbH Zeppelinstrasse 42 73760 Ostfildern Kemnat 4 Germany Phone: +49-711-4560-021 Fax +49-711-4560-729 E-mail info@hirose.de Hirose Electric UK, Ltd Crownhill Business Centre 22 Vincent Avenue, Crownhill Milton Keynes, MK8 OAB Great Britain Phone: +44-1908-305400 Fax: +44-1908-305401 Hirose Electric Co., Ltd. 5-23, Osaki 5 Chome, Shinagawa-Ku Tokyo 141 Japan Phone: +81-03-3491-9741 Fax: +81-03-3493-2933 Hirose Electric Co., Ltd. European Branche First class Building 4F Beechavenue 46 1119PV Schiphol-Rijk Netherlands Phone: +31-20-6557-460 Fax: +31-20-6557-469

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