THALES DIS AlS Deutschland PLAS9-X Cinterion Module PLAS9-X User Manual plas9 x hid

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Cinterion® PLAS9-X
Hardware Interface Overview
Version:
DocId:
00.044
PLAS9-X_HIO_v00.044
 M2M.GEMALTO.COM
Cinterion® PLAS9-X Hardware Interface Overview
Page 2 of 39
Document Name: Cinterion® PLAS9-X Hardware Interface Overview
Version:
00.044
Date:
2017-09-19
DocId:
PLAS9-X_HIO_v00.044
Status
Confidential / Preliminary
GENERAL NOTE
THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY
EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS
INFORMATION ON GEMALTO M2M PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE
SUBJECT TO CHANGE AT GEMALTO M2M'S DISCRETION. GEMALTO M2M GMBH GRANTS A NONEXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANSFER, COPY,
MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE OR
DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY
AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS IS" BASIS ONLY
AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTED
BY APPLICABLE LAW, GEMALTO M2M GMBH DISCLAIMS ALL WARRANTIES AND LIABILITIES.
THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY
REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED
ACCORDING TO GERMAN LAW.
Copyright
Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will be
held liable for payment of damages. All rights created by patent grant or registration of a utility model or
design patent are reserved.
Copyright © 2017, Gemalto M2M GmbH, a Gemalto Company
Trademark Notice
Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain
countries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned
in this document are property of their respective owners.
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Contents
39
Contents
Introduction ................................................................................................................. 6
1.1
Key Features at a Glance .................................................................................. 6
1.2
PLAS9-X System Overview ............................................................................... 9
Interface Characteristics .......................................................................................... 10
2.1
Application Interface ........................................................................................ 10
2.1.1 USB Interface...................................................................................... 10
2.1.2 UICC/SIM/USIM Interface................................................................... 11
2.1.3 Analog-to-Digital Converter (ADC)...................................................... 13
2.1.4 GPIO Interface .................................................................................... 13
2.1.5 Control Signals.................................................................................... 14
2.1.5.1 PWR_IND Signal................................................................. 14
2.1.5.2 Behavior of the RING0 Line ................................................ 14
2.1.5.3 Remote Wakeup.................................................................. 14
2.1.5.4 Low Current Indicator.......................................................... 14
2.2
GSM/UMTS/LTE Antenna Interface................................................................. 15
2.2.1 Antenna Installation ............................................................................ 16
2.2.2 RF Line Routing Design...................................................................... 17
2.2.2.1 Line Arrangement Instructions ............................................ 17
2.2.2.2 Routing Examples ............................................................... 19
2.3
Sample Application .......................................................................................... 21
Operating Characteristics ........................................................................................ 23
3.1
Operating Modes ............................................................................................. 23
3.2
Power Supply................................................................................................... 24
Mechanical Dimensions ........................................................................................... 25
4.1
Mechanical Dimensions of PLAS9-X ............................................................... 25
Regulatory and Type Approval Information ........................................................... 27
5.1
Directives and Standards................................................................................. 27
5.2
SAR requirements specific to portable mobiles ............................................... 29
5.3
Reference Equipment for Type Approval ......................................................... 30
5.4
Compliance with FCC and IC Rules and Regulations ..................................... 31
Document Information.............................................................................................. 33
6.1
Revision History ............................................................................................... 33
6.2
Related Documents ......................................................................................... 33
6.3
Terms and Abbreviations ................................................................................. 33
6.4
Safety Precaution Notes .................................................................................. 36
Appendix.................................................................................................................... 37
7.1
List of Parts and Accessories........................................................................... 37
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Tables
39
Tables
Table 1:
Table 2:
Table 3:
Table 4:
Table 5:
Table 6:
Table 7:
Table 8:
Table 9:
Table 10:
Table 11:
Table 12:

Signals of the SIM interface (SMT application interface) ...............................
Return loss in the active band........................................................................
Overview of operating modes ........................................................................
Directives .......................................................................................................
Standards of North American type approval ..................................................
Requirements of quality .................................................................................
Standards of the Ministry of Information Industry of the
People’s Republic of China ............................................................................
Toxic or hazardous substances or elements with defined concentration
limits ...............................................................................................................
Antenna gain limits for FCC and IC (TBD.) ....................................................
List of parts and accessories..........................................................................
Molex sales contacts (subject to change) ......................................................
Hirose sales contacts (subject to change) .....................................................
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27
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Figures
39
Figures
Figure 1:
Figure 2:
Figure 3:
Figure 4:
Figure 5:
Figure 6:
Figure 7:
Figure 8:
Figure 9:
Figure 10:
Figure 11:
Figure 12:
Figure 13:

PLAS9-X system overview............................................................................... 9
USB circuit ..................................................................................................... 10
First UICC/SIM/USIM interface ...................................................................... 12
Second UICC/SIM/USIM interface ................................................................. 12
Embedded Stripline line arrangement............................................................ 17
Micro-Stripline line arrangement samples...................................................... 18
Routing to application‘s RF connector ........................................................... 19
Routing to PLAS9-X evaluation module‘s RF connector................................ 20
PLAS9-X sample application.......................................................................... 22
Decoupling capacitor(s) for BATT+................................................................ 24
PLAS9-X – top and bottom view .................................................................... 25
Dimensions of PLAS9-X (all dimensions in mm)............................................ 26
Reference equipment for type approval ......................................................... 30
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1 Introduction
Introduction
This document1 describes the hardware of the Cinterion® PLAS9-X module. It helps you quickly
retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components.
1.1
Key Features at a Glance
Feature
Implementation
General
Frequency bands
GSM/GPRS/EDGE: Quad band, 850/900/1800/1900MHz
UMTS/HSPA+: Triple band, 850 (BdV), 1700 (BdIV), 1900 (BdII)
LTE (FDD): Six band, 700 (Bd12 , Bd13, Bd29 ), 850 (Bd5), 1700 (Bd4), 1900 (Bd2)
GSM class
Small MS
Output power
Class 4 (+33dBm ±2dB) for EGSM850
(according to Release 99) Class 4 (+33dBm ±2dB) for EGSM900
Class 1 (+30dBm ±2dB) for GSM1800
Class 1 (+30dBm ±2dB) for GSM1900
Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK
Class E2 (+27dBm ± 3dB) for GSM 900 8-PSK
Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK
Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK
Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdII
Class 3 (+24dBm +1/-3dB) for UMTS 1700, WCDMA FDD BdIV
Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV
Output power
(according to Release 8)
LTE (FDD):
Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD Bd12 
Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD Bd13
Class 3 (+23dBm +-2dB) for LTE 850, LTE FDD Bd5
Class 3 (+23dBm +-2dB) for LTE 1700, LTE FDD Bd4
Class 3 (+23dBm +-2dB) for LTE1900, LTE FDD Bd2
Power supply
3.3V < VBATT+ < 4.2V
Operating temperature
(board temperature)
Normal operation: -30°C to +85°C
Extended operation: -40°C to +95°C
Physical
Dimensions: 40mm x 32mm x 2.8mm
Weight: approx. 6.5g
RoHS
All hardware components fully compliant with EU RoHS Directive
1. The document is effective only if listed in the appropriate Release Notes as part of the technical documentation delivered with your Gemalto M2M product.
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1.1 Key Features at a Glance
Feature
Implementation
LTE features
3GPP Release 10
Downlink carrier aggregation (CA) to increase bandwidth, and thereby
increase bitrate:
• Maximum aggregated bandwidth: 40MHz
• Maximum number of component carriers: 2
• Inter-band FDD, non-contiguous
• Intra-band FDD, contiguous, non-contiguous
• Supported inter-band CA configurations:
CA_2A-5A (with bandwidth combination set 0),
CA_2A-12A (with bandwidth combination sets 0 and 1),
CA_2A-29A (with bandwidth combination sets 0, 1 and 2),
CA_4A-5A (with bandwidth combination sets 0 and 1),
CA_4A-12A (with bandwidth combination sets 0, 1, 2, 3 and 4),
CA_4A-29A (with bandwidth combination sets 0, 1 and 2)
• Supported intra-band CA configurations:
CA_4A-4A (with bandwidth combination set 0)
CAT 6 supported
DL 300Mbps, UL 50Mbps
2x2 MIMO in DL direction
HSPA features
3GPP Release 9
UE CAT. 14, 24
DC-HSPA+ – DL 42Mbps
HSUPA – UL 5.76Mbps
Compressed mode (CM) supported according to 3GPP TS25.212
UMTS features
3GPP Release 9
PS data rate – 384 kbps DL / 384 kbps UL
GSM / GPRS / EGPRS features
Data transfer
GPRS:
• Multislot Class 12
• Mobile Station Class B
• Coding Scheme 1 – 4
EGPRS:
• Multislot Class 12
• EDGE E2 power class for 8 PSK
• Downlink coding schemes – CS 1-4, MCS 1-9
• Uplink coding schemes – CS 1-4, MCS 1-9
• SRB loopback and test mode B
• 8-bit, 11-bit RACH
• 1 phase/2 phase access procedures
• Link adaptation and IR
• NACC, extended UL TBF
• Mobile Station Class B
SMS
Point-to-point MT and MO, Cell broadcast,
Text and PDU mode
Software
AT commands

Hayes, 3GPP TS 27.007 and 27.005, and proprietary Gemalto M2M commands
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1.1 Key Features at a Glance
Feature
Implementation
Firmware update
Generic update from host application over USB 2.0 High Speed device
interface
Interfaces
Module interface
Surface mount device with solderable connection pads (SMT application
interface).
Land grid array (LGA) technology ensures high solder joint reliability and
provides the possibility to use an optional module mounting socket.
For more information on how to integrate SMT modules see also [3]. This
application note comprises chapters on module mounting and application
layout issues as well as on additional SMT application development equipment.
Antenna
50. GSM/UMTS/LTE main antenna, UMTS/LTE Diversity/MIMO antenna
USB
USB 2.0 High Speed (480Mbit/s) device interface or
USB 3.0 Super Speed (5Gbit/s) device interface
UICC interface
2 UICC interfaces (switchable)
Supported chip cards: UICC/SIM/USIM 3V, 1.8V
RING0
Signal line to indicate URCs.
Power on/off, Reset
Power on/off
Switch-on by hardware signal IGT
Switch-off by AT command (AT^SMSO) or IGT (option)
Automatic switch-off in case of critical temperature or voltage conditions
Reset
Orderly shutdown and reset by AT command
Emergency-off
Emergency-off by hardware signal EMERG_OFF
Special Features
Antenna
SAIC (Single Antenna Interference Cancellation) / DARP (Downlink
Advanced Receiver Performance)
Rx Diversity (receiver type 3i - 64-QAM) / MIMO
GPIO
10 I/O pins of the application interface programmable as GPIO.
Programming is done via AT commands.
ADC inputs
Analog-to-Digital Converter with two unbalanced analog inputs for (external) antenna diagnosis
Evaluation kit
Evaluation module
PLAS9-X module soldered onto a dedicated PCB that can be connected
to the ALAS6A-DSB75 adapter in order to be mounted onto the DSB75.
ALAS6A-DSB75 adapter
A special adapter required to connect the PLAS9-X evaluation module to
the DSB75.
DSB75
DSB75 Development Support Board designed to test and type approve
Gemalto M2M modules and provide a sample configuration for application
engineering.
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1.2 PLAS9-X System Overview
1.2
PLAS9-X System Overview
GSM/UMTS/LTE
Antenna diversity
Antenna
diagnostic
Application
Antenna
switch
2x
GPIO
GSM/UMTS/LTE
2x
ADC
Module
GPIO
ADC
SIM
card
Host application
Power
supply
UICC
SIM
card
Power indication
(PWR_IND)
RING0
Power for application
(VEXT)
USB
IGT,
Emergency Off
On/Off
Figure 1: PLAS9-X system overview
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2 Interface Characteristics
22
Interface Characteristics
PLAS9-X is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces as well as
the RF antenna interface.
2.1
Application Interface
2.1.1
USB Interface
PLAS9-X supports a USB 3.0 Super Speed (5Gbps) device interface, and alternatively a
USB 2.0 device interface that is High Speed and Full Speed compatible. The USB interface is
primarily intended for use as command and data interface, and for downloading firmware1.
The USB host is responsible for supplying the VUSB_IN line. This line is for voltage detection
only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because
PLAS9-X is designed as a self-powered device compliant with the “Universal Serial Bus Specification Revision 3.0”2.
SMT
Module
VREG (3V075)
BATT+
lin. reg.
GND
USB part1)
2.0
USB 2.0
USB_HS
USB_DP3)
_PHY
USB_DN3)
Controller
2.0
USB_SSRX_N
USB_SSRX_P
USB_SS
USB 3.0
3.0
100nF
_PHY
USB_SSTX_N
USB_SSTX_P
Controller
100nF
VBUS
Detection only
VUSB_IN2)
1µF
Host wakeup
1)
RING0
All serial (including RS) and pull-up resistors for data lines are implemented.
2)
Since VUSB_IN is used for detection only it is recommended not to add any further blocking capacitors on
the VUSB_IN line.
3)
If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data
lines USB_DP and USB_DN. Application layout should in this case implement a differential impedance of 90 ohms for
proper signal integrity.
Figure 2: USB circuit
To properly connect the module's USB interface to the external application, a USB 3.0 or 2.0
compatible connector and cable or hardware design is required. Furthermore, the USB modem
driver distributed with PLAS9-X needs to be installed.
1. Note: For firmware download, the module enumerates new as a USB 2.0 device. Also, it is not possible
to use the USB 2.0 High Speed device mode and the USB 3.0 Super speed device mode simultaneously.
2. The specification is ready for download on http://www.usb.org/developers/docs/
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2.1 Application Interface
22
2.1.2
UICC/SIM/USIM Interface
PLAS9-X has two UICC/SIM/USIM interfaces compatible with the 3GPP 31.102 and ETSI 102
221. These are wired to the host interface in order to be connected to an external SIM card
holder. Five pads on the SMT application interface are reserved for each of the two SIM interfaces.
The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards.
The CCINx signal serves to detect whether a tray (with SIM card) is present in the card holder.
Using the CCINx signal is mandatory for compliance with the GSM 11.11 recommendation if
the mechanical design of the host application allows the user to remove the SIM card during
operation. To take advantage of this feature, an appropriate SIM card detect switch is required
on the card holder. For example, this is true for the model supplied by Molex, which has been
tested to operate with PLAS9-X and is part of the Gemalto M2M reference equipment submitted for type approval. See Chapter 7 for Molex ordering numbers.
Table 1: Signals of the SIM interface (SMT application interface)
Signal
Description
GND
Ground connection for SIM interfaces. Optionally a separate SIM ground line using e.g.,
pad P12, may be used to improve EMC.
CCCLK1
CCCLK2
Chipcard clock lines for 1st and 2nd SIM interface.
CCVCC1 SIM supply voltage lines for 1st and 2nd SIM interface.
CCVCC2
CCIO1
CCIO2
Serial data lines for 1st and 2nd SIM interface, input and output.
CCRST1 Chipcard reset lines for 1st and 2nd SIM interface.
CCRST2
CCIN1
CCIN2
Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is
removed during operation the SIM interface is shut down immediately to prevent destruction of the SIM. The CCINx signal is active low.
The CCINx signal is mandatory for applications that allow the user to remove the SIM card
during operation.
The CCINx signal is solely intended for use with a SIM card. It must not be used for any
other purposes. Failure to comply with this requirement may invalidate the type approval of
PLAS9-X.
Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after
removing the SIM card during operation. Also, no guarantee can be given for properly initializing any SIM card that the user inserts after having removed the SIM card during operation. In
this case, the application must restart PLAS9-X.
By default, only the 1st SIM interface is available and can be used. Using the AT command
AT^SCFG=”SIM/CS” it is possible to switch between the two SIM interfaces. Command settings are non-volatile - for details see [1].
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2.1 Application Interface
22
open: Card removed
closed: Card inserted
SMT application interface
CCIN1
Module
CCRST1
SIM /
UICC
1n
CCCLK1
GND
CCIO1
CCVCC1
220n
Figure 3: First UICC/SIM/USIM interface
The total cable length between the SMT application interface pads on PLAS9-X and the pads
of the external SIM card holder must not exceed 100mm in order to meet the specifications of
3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.
To avoid possible cross-talk from the CCCLKx signal to the CCIOx signal be careful that both
lines are not placed closely next to each other. A useful approach is using the GND line to
shield the CCIOx line from the CCCLKx line.
Note: Figure 3 shows how to connect a SIM card holder to the first SIM interface. With the second SIM interface some internally integrated components on the SIM circuit will have to be externally integrated as shown for the second SIM interface in Figure 4. The external components
at CCIN2 should be populated as close as possible to the signal‘s SMT pad
VEXT
22k
Module
SMT application interface
CCIN2
Open: Card removed
Closed: Card inserted
2k2
100pF
CCRST2
1nF
SIM /
UICC
CCCLK2
GND
CCIO2
10k
CCVCC2
220nF
Figure 4: Second UICC/SIM/USIM interface
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2.1 Application Interface
22
2.1.3
Analog-to-Digital Converter (ADC)
PLAS9-X provides two unbalanced ADC input lines: ADC1_IN and ADC2_IN. They can be
used to measure two independent, externally connected DC voltages in the range of 0.05V to
VBATT+.
2.1.4
GPIO Interface
PLAS9-X has 10 GPIOs for external hardware devices. Each GPIO can be configured for use
as input or output. All settings are AT command controlled.
GPIO1...GPIO10 may be configured as low current indicator signal (see Section 2.1.5.4), or
may be set as remote host wakeup lines (see Section 2.1.5.3).
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2.1 Application Interface
22
2.1.5
2.1.5.1
Control Signals
PWR_IND Signal
PWR_IND notifies the on/off state of the module. High state of PWR_IND indicates that the
module is switched off. The state of PWR_IND immediately changes to low when IGT is pulled
low. For state detection an external pull-up resistor is required.
2.1.5.2
Behavior of the RING0 Line
The RING0 line serves to indicate URCs (Unsolicited Result Code).
The RING0 line behavior and usage can be configured by AT command. For details see [1]:
AT^SCFG.
2.1.5.3
Remote Wakeup
If no call, data or message transfer is in progress, the external host application may shut down
its own module interfaces or other components in order to save power. If a call, data, or other
request (URC) arrives, the external application can be notified of this event and be woken up
again by a state transition of a configurable remote wakeup line. Available as remote wakeup
lines are all GPIO signals as well as the RING0 line. Please refer to [1]: AT^SCFG: "RemoteWakeUp/..." for details on how to configure these lines for defined wakeup events on
specified device interfaces.
2.1.5.4
Low Current Indicator
A low current indication is optionally available over a GPIO line. By default, low current indication is disabled and the GPIO pads can be configured and employed as usual.
For a GPIO pad to work as a low current indicator the feature has to be enabled by AT command (see [1]: AT^SCFG: MEopMode/PowerMgmt/LCI). By default, the GPIO6 pad is configured as LCI_IND signal.
If enabled, the GPIOx/LCI_IND signal is high when the module is sleeping.
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2.2 GSM/UMTS/LTE Antenna Interface
22
2.2
GSM/UMTS/LTE Antenna Interface
The PLAS9-X GSM/UMTS/LTE antenna interface comprises a GSM/UMTS/LTE main antenna
as well as a UMTS/LTE Rx diversity/MIMO antenna to improve signal reliability and quality1.
The interface has an impedance of 50. PLAS9-X is capable of sustaining a total mismatch at
the antenna interface without any damage, even when transmitting at maximum RF power.
The external antennas must be matched properly to achieve best performance regarding radiated power, modulation accuracy and harmonic suppression. Matching networks are not included on the PLAS9-X PCB and should be placed in the host application, if the antenna does
not have an impedance of 50.
Regarding the return loss PLAS9-X provides the following values in the active band:
Table 2: Return loss in the active band
State of module
Return loss of module
Recommended return loss of application
Receive
> 8dB
> 12dB
Transmit
not applicable
> 12dB
Idle
< 5dB
not applicable
1. By delivery default the UMTS/LTE Rx diversity/MIMO antenna is configured as available for the module
since its usage is mandatory for LTE. Please refer to [1] for details on how to configure antenna settings.
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2.2 GSM/UMTS/LTE Antenna Interface
22
2.2.1
Antenna Installation
The antenna is connected by soldering the antenna pads (ANT_MAIN; ANT_DRX_MIMO) and
their neighboring ground pads directly to the application’s PCB.
The distance between the antenna pads and their neighboring GND pads has been optimized
for best possible impedance. To prevent mismatch, special attention should be paid to these
pads on the application’ PCB.The wiring of the antenna connection, starting from the antenna
pad to the application’s antenna must result in a 50 line impedance. Line width and distance
to the GND plane need to be optimized with regard to the PCB’s layer stack. Related instructions are given in Section 2.2.2.
To prevent receiver desensitization due to interferences generated by fast transients like high
speed clocks on the external application PCB, it is recommended to realize the antenna connection line using embedded Stripline rather than Micro-Stripline technology. Please see Section 2.2.2 for instructions of how to design the antenna connection in order to achieve the
required 50 line impedance.
For type approval purposes (i.e., FCC KDB 996369 related to modular approval requirements),
an external application must connect the RF signal in one of the following ways:
• Via 50 coaxial antenna connector (common connectors are U-FL or SMA) placed as close
as possible to the module's antenna pad.
• By soldering the antenna to the antenna connection line on the application’s PCB (without
the use of any connector) as close as possible to the module’s antenna pad.
• By routing the application PCB’s antenna to the module’s antenna pad in the shortest possible way.
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2.2 GSM/UMTS/LTE Antenna Interface
22
2.2.2
2.2.2.1
RF Line Routing Design
Line Arrangement Instructions
Several dedicated tools are available to calculate line arrangements for specific applications
and PCB materials - for example from http://www.polarinstruments.com/ (commercial software)
or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software).
Embedded Stripline
This below figure shows line arrangement examples for embedded stripline.
Figure 5: Embedded Stripline line arrangement
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2.2 GSM/UMTS/LTE Antenna Interface
22
Micro-Stripline
This section gives two line arrangement examples for micro-stripline.
Figure 6: Micro-Stripline line arrangement samples
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2.2 GSM/UMTS/LTE Antenna Interface
22
2.2.2.2
Routing Examples
Interface to RF Connector
Figure 7 shows a sample connection of a module‘s antenna pad at the bottom layer of the module PCB with an application PCB‘s coaxial antenna connector. Line impedance depends on line
width, but also on other PCB characteristics like dielectric, height and layer gap. The sample
stripline width of 0.40mm is recommended for an application with a PCB layer stack resembling
the one of the PLAS9-X evaluation board. For different layer stacks the stripline width will have
to follow stripline routing rules, avoiding 90 degree corners and using the shortest distance to
the PCB’s coaxial antenna connector.
GND
GND
e.g.
ANT_
MAIN
GND
Stripline (50 ohms) on top
layer of evaluation board from
antenna pad to module edge
Width = 0.40 mm
Ground connection
GND
Edge of module PCB
50 ohms microstrip line
GND
GND
E.g., U.FL antenna
connector
Figure 7: Routing to application‘s RF connector
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2.2 GSM/UMTS/LTE Antenna Interface
22
Figure 8 shows a further sample connection of an evaluation module‘s antenna pad at the bottom layer of the PLAS9-X evaluation module PCB with the PCB‘s coaxial antenna connector.
The PLAS9-X evaluation module is part of the reference equipment used by Gemalto M2M for
type approval (see also Section 5.3).
GND
e.g.
Ant_
WGSM
GND
GND
GND
Stripline (50 ohms) on top
layer of evaluation board from
antenna pad to module edge
Width = 0,40 mm
Ground Connection
Edge of Module PCB
50 ohms micro stripline
E.g. U.FL
antennaconnector
GND
GND
Figure 8: Routing to PLAS9-X evaluation module‘s RF connector
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2.3 Sample Application
22
2.3
Sample Application
Figure 9 shows a typical example of how to integrate an PLAS9-X module with an application.
The PWR_IND line is an open collector that needs an external pull-up resistor which connects
to the voltage supply VCC µC of the microcontroller. Low state of the open collector pulls the
PWR_IND signal low and indicates that the PLAS9-X module is active, high level notifies the
Power Down mode.
If the module is in Power Down mode avoid current flowing from any other source into the module circuit, for example reverse current from high state external control lines. Therefore, the
controlling application must be designed to prevent reverse flow.
While developing SMT applications it is strongly recommended to provide test points
for certain signals, i.e., lines to and from the module - for debug and/or test purposes.
The SMT application should allow for an easy access to these signals. For details on
how to implement test points see [3].
The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for
an individual application is very much determined by the overall layout and, especially, the position of components.
Some LGA pads are connected to clocks or high speed data streams that might interfere with
the module’s antenna. The RF receiver would then be blocked at certain frequencies (self interference). The external application’s PCB tracks connected to these pads should therefore
be well shielded or kept away from the antenna. This applies especially to the USB and UICC/
SIM interfaces.
Disclaimer:
No warranty, either stated or implied, is provided on the sample schematic diagram shown in
Figure 9 and the information detailed in this section. As functionality and compliance with national regulations depend to a great amount on the used electronic components and the individual application layout manufacturers are required to ensure adequate design and operating
safeguards for their products using PLAS9-X modules.
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2.3 Sample Application
22
Figure 9: PLAS9-X sample application
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3 Operating Characteristics
24
Operating Characteristics
3.1
Operating Modes
The table below briefly summarizes the various operating modes referred to throughout the
document.
Table 3: Overview of operating modes
Mode
Function
Normal
GSM / GPRS /
operation UMTS / HSPA /
LTE SLEEP
Power saving set automatically when no call is in progress and the USB
connection is detached.
GSM / GPRS /
UMTS / HSPA /
LTE IDLE
Power saving disabled or an USB connection active, but no data transfer in progress.
GPRS DATA
GPRS data transfer in progress. Power consumption depends on network settings (e.g. power control level), uplink / downlink data rates and
GPRS configuration (e.g. used multislot settings).
EGPRS DATA
EGPRS data transfer in progress. Power consumption depends on network settings (e.g. power control level), uplink / downlink data rates and
EGPRS configuration (e.g. used multislot settings).
UMTS DATA
UMTS data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate.
HSPA DATA
HSPA data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate.
LTE DATA
LTE data transfer in progress. Power consumption depends on network
settings (e.g. TPC Pattern) and data transfer rate.
Power
Down
Normal shutdown after sending the AT^SMSO command. Software is not active. Interfaces
are not accessible. Operating voltage (connected to BATT+) remains applied. Only a voltage regulator is active for powering the RTC, as long as operating voltage applied at BATT+
does not drop below approx. 1.4V.
Airplane
mode
Airplane mode shuts down the radio part of the module, causes the module to log off from
the GSM/GPRS network and disables all AT commands whose execution requires a radio
connection.
Airplane mode can be controlled by AT command (see [1]).
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3.2 Power Supply
24
3.2
Power Supply
PLAS9-X needs to be connected to a power supply at the SMT application interface - 4 lines
BATT+, and GND. There are two separate voltage domains for BATT+:
• BATT+_RF with 2 lines for the RF power amplifier supply
• BATT+ with 2 lines for the general power management.
The main power supply from an external application has to be a single voltage source and has
to be expanded to two sub paths (star structure). Each voltage domain must be decoupled by
application with low ESR capacitors (> 47µF MLCC @ BATT+; > 4x47µF MLCC @ BATT+_RF)
as close as possible to LGA pads. Figure 10 shows a sample circuit for decoupling capacitors
for BATT+.
Module
1x
SMT interface
BATT+
BATT+_RF
BATT+
4x
Decoupling capacitors
e.g. 47µF X5R MLCC
GND
Figure 10: Decoupling capacitor(s) for BATT+
The power supply of PLAS9-X must be able to provide the peak current during the uplink transmission.
All key functions for supplying power to the device are handled by the power management IC.
It provides the following features:
• Stabilizes the supply voltages for the baseband using switching regulators and low drop linear voltage regulators.
• Switches the module's power voltages for the power-up and -down procedures.
• Delivers, across the VEXT line, a regulated voltage for an external application.
• LDO to provide SIM power supply.
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4 Mechanical Dimensions
26
Mechanical Dimensions
4.1
Mechanical Dimensions of PLAS9-X
Figure 11 shows a 3D view1 of PLAS9-X and provides an overview of the board's mechanical
dimensions. For further details see Figure 12.
Length:
40mm
Width:
32mm
Height:
2.8mm
Top view
Bottom view
Figure 11: PLAS9-X – top and bottom view
1. The coloring of the 3D view does not reflect the module’s real color.
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4.1 Mechanical Dimensions of PLAS9-X
26
Figure 12: Dimensions of PLAS9-X (all dimensions in mm)
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5 Regulatory and Type Approval Information
32
Regulatory and Type Approval Information
Note that some regulatory and type approval information is still to be defined.
5.1
Directives and Standards
PLAS9-X has been designed to comply with the directives and standards listed below.
It is the responsibility of the application manufacturer to ensure compliance of the final product
with all provisions of the applicable directives and standards as well as with the technical specifications provided in the "PLAS9-X Hardware Interface Description".1
Table 4: Directives
2002/95/EC (RoHS 1)
2011/65/EC (RoHS 2)
Directive of the European Parliament and of the Council of
27 January 2003 (and revised on 8 June 2011) on the
restriction of the use of certain hazardous substances in
electrical and electronic equipment (RoHS)
Table 5: Standards of North American type approval
CFR Title 47
Code of Federal Regulations, Part 22, Part 24; US Equipment Authorization
FCC
OET Bulletin 65
(Edition 97-01)
Evaluating Compliance with FCC Guidelines for Human Exposure to
Radiofrequency Electromagnetic Fields
UL 60 950-1
Product Safety Certification (Safety requirements)
NAPRD.03 V5.32
Overview of PCS Type certification review board Mobile Equipment Type
Certification and IMEI control
PCS Type Certification Review board (PTCRB)
RSS132, RSS133,
RSS139
Canadian Standard
Table 6: Requirements of quality
IEC 60068
Environmental testing
DIN EN 60529
IP codes
1. Manufacturers of applications which can be used in the US shall ensure that their applications have a
PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module.
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5.1 Directives and Standards
32
Table 7: Standards of the Ministry of Information Industry of the People’s Republic of China
SJ/T 11363-2006
“Requirements for Concentration Limits for Certain Hazardous Substances
in Electronic Information Products” (2006-06).
SJ/T 11364-2006
“Marking for Control of Pollution Caused by Electronic
Information Products” (2006-06).
According to the “Chinese Administration on the Control of
Pollution caused by Electronic Information Products”
(ACPEIP) the EPUP, i.e., Environmental Protection Use
Period, of this product is 20 years as per the symbol
shown here, unless otherwise marked. The EPUP is valid only as long as
the product is operated within the operating limits described in the Hardware
Interface Description.
Please see Table 8 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the
limits defined by SJ/T 11363-2006.
Table 8: Toxic or hazardous substances or elements with defined concentration limits
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5.2 SAR requirements specific to portable mobiles
32
5.2
SAR requirements specific to portable mobiles
Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module
must be in accordance with the guidelines for human exposure to radio frequency energy. This
requires the Specific Absorption Rate (SAR) of portable PLAS9-X based applications to be
evaluated and approved for compliance with national and/or international regulations.
Since the SAR value varies significantly with the individual product design manufacturers are
advised to submit their product for approval if designed for portable use. For US markets the
relevant directives are mentioned below. It is the responsibility of the manufacturer of the final
product to verify whether or not further standards, recommendations or directives are in force
outside these areas.
Products intended for sale on US markets
ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to electromagnetic
fields (EMFs) from mobile telecommunication equipment (MTE) in the
frequency range 30MHz - 6GHz
IMPORTANT:
Manufacturers of portable applications based on PLAS9-X modules are required to have their
final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable mobile.
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5.3 Reference Equipment for Type Approval
32
5.3
Reference Equipment for Type Approval
The Gemalto M2M general reference setup submitted to type approve PLAS9-X is shown in
the figure below: Figure 13 illustrates the setup for general tests and evaluation purposes. The
evaluation module can be plugged directly onto the ALAS6A-DSB75 adapter. The GSM/UMTS/
LTE test equipment is still connected via SMA connectors on the ALAS6A-DSB75 adapter. The
PC is connected via USB interface.
PC
Power Supply
X 70 0
T P 1 05
S 7 11
S 7 10
V 43 1
X 5 06
10 6
X 50 5
TXD0
V2 3 0
RX D0
V 2 3 5
UMTS /LTE
Rx Diversity /
MIMO
X 55 4
GSM/UMTS /
LTE
R ING0
DCD0
V2 3 6
DT R0
V2 3 2
S 200
X2 04
DSR0
V2 3 7
R TS 0
V2 3 3
V 2 4 4 SY N C
ALAS6ADSB75Adapter
S 20 1
X 20 6
V 2 4 3
V 2 4 2
V2 3 1
X 2 02
V 4 30
S 7 15
S 7 14
S6 01
C 41 5
X 12 2
C4 14
X 5 52 X5 51
1 X 56 1
X70 3
10
EVAL-Board
with module
10
10
X 5 11
X 51 0
S5 00
S5 02 S5 03 S50 4
S5 01
CT S0
V2 3 4
V 23 8
V 2 4 0
V 2 3 9
V 2 4 1
1 X71 0
X 6 02
C4 13
S 45 8 S 46 8 S4 65 S 46 0 S 4 50 S 45 4 S4 55
S4 67 S46 4
S 45 3
S 11 0
S4 52 S 45 7
S 46 9 S 46 6 S 46 3 S 46 2
S 11 1
S 46 1
S4 51 3
1 S 45 6
S 45 9
X 12 1
S 11 2
X1 20
X20 3
X41 0
X40 1
1 4 23
X 110
X 20 5
X 2 01
X41 1
X 40 0
X40 5
3.0
USB
DSB75
GSM / UMTS / LTE
Testequipment
Figure 13: Reference equipment for type approval
Please note that for EMC and RF performance tests, slightly different reference equipment configurations are used. If necessary, please contact Gemalto for further details.
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5.4 Compliance with FCC and IC Rules and Regulations
32
5.4
Compliance with FCC and IC Rules and Regulations
The Equipment Authorization Certification for the Gemalto M2M modules reference application
described in Section 5.3 will be registered under the following identifiers:
•
PLAS9-X:
FCC Identifier QIPPLAS9-X
Industry Canada Certification Number: 7830A-PLAS9X
Granted to Gemalto M2M GmbH
Manufacturers of mobile or fixed devices incorporating PLAS9-X modules are authorized to
use the FCC Grants and Industry Canada Certificates of the PLAS9-X modules for their own
final products according to the conditions referenced in these documents. In this case, the FCC
label of the module shall be visible from the outside, or the host device shall bear a second label
stating "Contains FCC ID: QIPPLAS9-X" and accordingly “Contains IC: 7830A-PLAS9X“. The
integration is limited to fixed or mobile categorized host devices, where a separation distance
between the antenna and any person of min. 20cm can be assured during normal operating
conditions.
For mobile and fixed operation configurations the antenna gain, including cable loss, must not
exceed the limits listed in the following Table 9 for FCC and IC.
Table 9: Antenna gain limits for FCC and IC (TBD.)
Maximum gain in operating band
FCC limit
IC limit
Unit
Band12, Band13, Band 29 700MHz (LTE)
dBi
Band 5, 850MHz (GSM/WCDMA/LTE)
dBi
Band 4, 1700MHz (WCDMA/LTE)
dBi
Band 2, 1900MHz (GSM/WCDMA/LTE)
dBi
IMPORTANT:
Manufacturers of portable applications incorporating PLAS9-X modules are required to have
their final product certified and apply for their own FCC Grant and Industry Canada Certificate
related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles (see Section 5.2 for detail).
Changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.
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5.4 Compliance with FCC and IC Rules and Regulations
32
Note: This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules and with Industry Canada license-exempt RSS
standard(s). These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
• Consult the dealer or an experienced radio/TV technician for help.
This Class B digital apparatus complies with Canadian ICES-003.
If Canadian approval is requested for devices incorporating PLAS9-X modules the above note
will have to be provided in the English and French language in the final user documentation.
Manufacturers/OEM Integrators must ensure that the final user documentation does not contain any information on how to install or remove the module from the final product.
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6 Document Information
36
Document Information
6.1
Revision History
New document: "Cinterion® PLAS9-X Hardware Interface Overview" Version 00.044
Chapter
What is new
--
Initial document setup.
6.2
[1]
[2]
[3]
[4]
[5]
Related Documents
PLAS9-X AT Command Set
PLAS9-X Release Note
Application Note 48: SMT Module Integration
Universal Serial Bus Specification Revision 3.0
Universal Serial Bus Specification Revision 2.0
6.3
Terms and Abbreviations
Abbreviation
Description
ANSI
American National Standards Institute
ARP
Antenna Reference Point
CA
Carrier Aggregation
CE
Conformité Européene (European Conformity)
CS
Coding Scheme
CS
Circuit Switched
CSD
Circuit Switched Data
DL
Download
dnu
Do not use
DRX
Discontinuous Reception
DSB
Development Support Board
DTX
Discontinuous Transmission
EDGE
Enhanced Data rates for GSM Evolution
EGSM
Extended GSM
EMC
Electromagnetic Compatibility
ESD
Electrostatic Discharge
ETS
European Telecommunication Standard
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6.3 Terms and Abbreviations
36
Abbreviation
Description
ETSI
European Telecommunications Standards Institute
FCC
Federal Communications Commission (U.S.)
FDD
Frequency Division Duplex
GPRS
General Packet Radio Service
GSM
Global Standard for Mobile Communications
HiZ
High Impedance
HSDPA
High Speed Downlink Packet Access
I/O
Input/Output
IMEI
International Mobile Equipment Identity
ISO
International Standards Organization
ITU
International Telecommunications Union
kbps
kbits per second
LED
Light Emitting Diode
LGA
Land Grid Array
LTE
Long term evolution
MBB
Moisture barrier bag
Mbps
Mbits per second
MCS
Modulation and Coding Scheme
MFBI
Multiple Frequency Band Indicator
MIMO
Multiple Input Multiple Output
MLCC
Multi Layer Ceramic Capacitor
MO
Mobile Originated
MS
Mobile Station, also referred to as TE
MSL
Moisture Sensitivity Level
MT
Mobile Terminated
nc
Not connected
NTC
Negative Temperature Coefficient
PCB
Printed Circuit Board
PCL
Power Control Level
PCS
Personal Communication System, also referred to as GSM 1900
PD
Pull Down resistor
PDU
Protocol Data Unit
PS
Packet Switched
PSK
Phase Shift Keying
PU
Pull Up resistor
QAM
Quadrature Amplitude Modulation
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6.3 Terms and Abbreviations
36
Abbreviation
Description
R&TTE
Radio and Telecommunication Terminal Equipment
RF
Radio Frequency
rfu
Reserved for future use
ROPR
Radio Output Power Reduction
RTC
Real Time Clock
Rx
Receive Direction
SAR
Specific Absorption Rate
SELV
Safety Extra Low Voltage
SIM
Subscriber Identification Module
SMD
Surface Mount Device
SMS
Short Message Service
SMT
Surface Mount Technology
SRAM
Static Random Access Memory
SRB
Signalling Radio Bearer
TE
Terminal Equipment
TPC
Transmit Power Control
TS
Technical Specification
Tx
Transmit Direction
UL
Upload
UMTS
Universal Mobile Telecommunications System
URC
Unsolicited Result Code
USB
Universal Serial Bus
UICC
USIM Integrated Circuit Card
USIM
UMTS Subscriber Identification Module
WCDMA
Wideband Code Division Multiple Access
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6.4 Safety Precaution Notes
36
6.4
Safety Precaution Notes
The following safety precautions must be observed during all phases of the operation, usage,
service or repair of any cellular terminal or mobile incorporating PLAS9-X. Manufacturers of the
cellular terminal are advised to convey the following safety information to users and operating
personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Gemalto M2M assumes no liability for customer’s failure to comply
with these precautions.
When in a hospital or other health care facility, observe the restrictions on the use of
mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guidelines posted in sensitive areas. Medical equipment may be sensitive to RF energy.
The operation of cardiac pacemakers, other implanted medical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close
to the device. If in doubt about potential danger, contact the physician or the manufacturer of the device to verify that the equipment is properly shielded. Pacemaker
patients are advised to keep their hand-held mobile away from the pacemaker, while
it is on.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it cannot be switched on inadvertently. The operation of wireless appliances in an aircraft is
forbidden to prevent interference with communications systems. Failure to observe
these instructions may lead to the suspension or denial of cellular services to the
offender, legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. Remember that interference can occur if it is used close to TV sets,
radios, computers or inadequately shielded equipment. Follow any special regulations
and always switch off the cellular terminal or mobile wherever forbidden, or when you
suspect that it may cause interference or danger.
IMPORTANT!
Cellular terminals or mobiles operate using radio signals and cellular networks.
Because of this, connection cannot be guaranteed at all times under all conditions.
Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls.
Remember, in order to make or receive calls, the cellular terminal or mobile must be
switched on and in a service area with adequate cellular signal strength.
Some networks do not allow for emergency calls if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate
those features before you can make an emergency call.
Some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile.
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7 Appendix
38
Appendix
7.1
List of Parts and Accessories
Table 10: List of parts and accessories
Description
Supplier
Ordering information
PLAS9-X
Gemalto M2M
Standard module
Gemalto M2M IMEI:
Packaging unit (ordering) number:
L30960-N5130-B100
Module label number:
L30960-N5130-B100-11
PLAS9-X Evaluation module
Gemalto M2M
Ordering number: TBD. (PLAS9)
DSB75 Support Box
Gemalto M2M
Ordering number: L36880-N8811-A100
Votronic Handset
VOTRONIC /
Gemalto M2M
Gemalto M2M ordering number: L36880-N8301-A107
Votronic ordering number: HH-SI-30.3/V1.1/0
Votronic
Entwicklungs- und Produktionsgesellschaft für elektronische Geräte mbH
Saarbrücker Str. 8
66386 St. Ingbert
Germany
Phone: +49-(0)6 89 4 / 92 55-0
Fax: +49-(0)6 89 4 / 92 55-88
Email: contact@votronic.com
SIM card holder incl. push
button ejector and slide-in
tray
Molex
Ordering numbers: 91228
91236
Sales contacts are listed in Table 11.
U.FL antenna connector
Molex or
Hirose
Sales contacts are listed in Table 11 and Table 12.
1. Note: At the discretion of Gemalto M2M, module label information can either be laser engraved on the
module’s shielding or be printed on a label adhered to the module’s shielding.
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7.1 List of Parts and Accessories
38
Table 11: Molex sales contacts (subject to change)
Molex
For further information please click:
http://www.molex.com
Molex Deutschland GmbH
Otto-Hahn-Str. 1b
69190 Walldorf
Germany
Phone: +49-6227-3091-0
Fax: +49-6227-3091-8100
Email: mxgermany@molex.com
American Headquarters
Lisle, Illinois 60532
U.S.A.
Phone: +1-800-78MOLEX
Fax: +1-630-969-1352
Molex China Distributors
Beijing,
Room 1311, Tower B, COFCO Plaza
No. 8, Jian Guo Men Nei Street, 100005
Beijing
P.R. China
Phone: +86-10-6526-9628
Fax: +86-10-6526-9730
Molex Singapore Pte. Ltd.
110, International Road
Jurong Town,
Singapore 629174
Molex Japan Co. Ltd.
1-5-4 Fukami-Higashi,
Yamato-City,
Kanagawa, 242-8585
Japan
Phone: +65-6-268-6868
Fax: +65-6-265-6044
Phone: +81-46-265-2325
Fax: +81-46-265-2365
Table 12: Hirose sales contacts (subject to change)
Hirose Ltd.
For further information please click:
http://www.hirose.com
Hirose Electric (U.S.A.) Inc
2688 Westhills Court
Simi Valley, CA 93065
U.S.A.
Phone: +1-805-522-7958
Fax: +1-805-522-3217
Hirose Electric Europe B.V.
German Branch:
Herzog-Carl-Strasse 4
73760 Ostfildern
Germany
Phone: +49-711-456002-1
Fax: +49-711-456002-299
Email: info@hirose.de
Hirose Electric Europe B.V.
UK Branch:
First Floor, St. Andrews House,
Caldecotte Lake Business Park,
Milton Keynes MK7 8LE
Great Britain
Hirose Electric Co., Ltd.
5-23, Osaki 5 Chome,
Shinagawa-Ku
Tokyo 141
Japan
Hirose Electric Europe B.V.
Hogehillweg 8
1101 CC Amsterdam Z-O
Netherlands
Phone: +44-1908-369060
Fax: +44-1908-369078
Phone: +81-03-3491-9741
Fax: +81-03-3493-2933
Phone: +31-20-6557-460
Fax: +31-20-6557-469

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39
About Gemalto
Since 1996, Gemalto has been pioneering groundbreaking M2M and IoT products that keep our
customers on the leading edge of innovation.
We work closely with global mobile network operators to ensure that Cinterion® modules evolve
in sync with wireless networks, providing a seamless migration path to protect your IoT technology
investment.
Cinterion products integrate seamlessly with Gemalto identity modules, security solutions and licensing
and monetization solutions, to streamline development timelines and provide cost efficiencies that
improve the bottom line.
For more information please visit
www.gemalto.com/m2m, www.facebook.com/gemalto, or Follow@gemaltoIoT on Twitter.
Gemalto M2M GmbH
Werinherstrasse 81
81541 Munich
Germany
 GEMALTO.COM/M2M
© Gemalto 2017. All rights reserved. Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries.
As an experienced software provider, we help customers manage connectivity, security and
quality of service for the long lifecycle of IoT solutions.

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Source Exif Data:

File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.6
Linearized                      : Yes
Author                          : chinrich
Create Date                     : 2017:09:19 11:06:23Z
Modify Date                     : 2017:09:19 15:43:38+02:00
Language                        : en
XMP Toolkit                     : Adobe XMP Core 5.6-c015 84.159810, 2016/09/10-02:41:30
Format                          : application/pdf
Title                           : plas9-x_hid.book
Creator                         : chinrich
Creator Tool                    : FrameMaker 2015.0.5
Metadata Date                   : 2017:09:19 15:43:38+02:00
Producer                        : Acrobat Distiller 11.0 (Windows)
Document ID                     : uuid:e5f059b2-e550-4935-a5e0-01040eee62f8
Instance ID                     : uuid:e46de2f7-93b8-4be3-b07f-efcc6fdad618
Page Mode                       : UseOutlines
Page Count                      : 39

EXIF Metadata provided by EXIF.tools