THALES DIS AlS Deutschland TC63 Quadband GSM/GPRS Module User Manual TC63
Gemalto M2M GmbH Quadband GSM/GPRS Module TC63
Users Manual
TC63 Hardware Interface Description
Strictly confidential / Draft s
TC63_HD_V00.432 Page 2 of 97 11.05.2005
Document Name: TC63 Hardware Interface Description
Version: 00.432
Date: May 11, 2005
DocId: TC63_HD_V00.432
Status: Strictly confidential / Draft
General note
Product is deemed accepted by Recipient and is provided without interface to Recipient´s products.
The Product constitutes pre-release version and code and may be changed substantially before
commercial release. The Product is provided on an “as is” basis only and may contain deficiencies or
inadequacies. The Product is provided without warranty of any kind, express or implied. To the
maximum extent permitted by applicable law, Siemens further disclaims all warranties, including
without limitation any implied warranties of merchantability, fitness for a particular purpose and
noninfringement of third-party rights. The entire risk arising out of the use or performance of the
Product and documentation remains with Recipient. This Product is not intended for use in life support
appliances, devices or systems where a malfunction of the product can reasonably be expected to
result in personal injury. Applications incorporating the described product must be designed to be in
accordance with the technical specifications provided in these guidelines. Failure to comply with any
of the required procedures can result in malfunctions or serious discrepancies in results. Furthermore,
all safety instructions regarding the use of mobile technical systems, including GSM products, which
also apply to cellular phones must be followed. Siemens AG customers using or selling this product
for use in any applications do so at their own risk and agree to fully indemnify Siemens for any
damages resulting from illegal use or resale. To the maximum extent permitted by applicable law, in
no event shall Siemens or its suppliers be liable for any consequential, incidental, direct, indirect,
punitive or other damages whatsoever (including, without limitation, damages for loss of business
profits, business interruption, loss of business information or data, or other pecuniary loss) arising out
the use of or inability to use the Product, even if Siemens has been advised of the possibility of such
damages. Subject to change without notice at any time.
Copyright
Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its
contents and communication thereof to others without express authorization are prohibited. Offenders
will be held liable for payment of damages. All rights created by patent grant or registration of a utility
model or design patent are reserved.
Copyright © Siemens AG 2005
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Contents
0 Document History .........................................................................................................7
1 Introduction...................................................................................................................8
1.1 Related Documents ...............................................................................................8
1.2 Terms and Abbreviations.......................................................................................9
1.3 Type Approval......................................................................................................12
1.4 Safety Precautions...............................................................................................14
2 Product Concept .........................................................................................................16
2.1 Key Features at a Glance ....................................................................................16
2.2 TC63 System Overview .......................................................................................19
2.3 Circuit Concept ....................................................................................................20
3 Application Interface...................................................................................................21
3.1 Operating Modes .................................................................................................22
3.2 Power Supply.......................................................................................................24
3.2.1 Minimizing Power Losses ......................................................................24
3.2.2 Measuring the Supply Voltage VBATT+ ....................................................25
3.2.3 Monitoring Power Supply by AT Command ...........................................25
3.3 Power Up / Power Down Scenarios.....................................................................26
3.3.1 Turn on TC63.........................................................................................26
3.3.1.1 Turn on TC63 Using Ignition Line IGT ...................................................26
3.3.1.2 Turn on TC63 Using the VCHARGE Signal...........................................28
3.3.1.3 Reset TC63 via AT+CFUN Command ...................................................29
3.3.1.4 Reset or Turn off TC63 in Case of Emergency......................................29
3.3.2 Turn off TC63.........................................................................................30
3.3.2.1 Turn off TC63 Using AT Command .......................................................30
3.3.2.2 Leakage Current in Power Down Mode .................................................31
3.3.3 Automatic Shutdown ..............................................................................32
3.3.3.1 Temperature Dependent Shutdown.......................................................32
3.3.3.2 Temperature Control during Emergency call .........................................33
3.3.3.3 Undervoltage Shutdown if Battery NTC is Present ................................33
3.3.3.4 Undervoltage Shutdown if no Battery NTC is Present ...........................34
3.3.3.5 Overvoltage Shutdown...........................................................................34
3.4 Automatic GPRS Multislot Class Change............................................................35
3.5 Charging Control..................................................................................................36
3.5.1 Hardware Requirements ........................................................................36
3.5.2 Software Requirements .........................................................................36
3.5.3 Battery Pack Requirements ...................................................................36
3.5.4 Batteries Recommended for Use with TC63..........................................38
3.5.5 Charger Requirements...........................................................................38
3.5.6 Implemented Charging Technique.........................................................38
3.5.7 Operating Modes during Charging.........................................................39
3.6 Summary of State Transitions (Except SLEEP Mode).........................................41
3.7 RTC Backup ........................................................................................................42
3.8 SIM Interface .......................................................................................................43
3.9 Serial Interface ASC0 ..........................................................................................44
3.10 Serial Interface ASC1 ..........................................................................................46
3.11 USB Interface ......................................................................................................47
3.11.1 Installing the USB Modem Driver...........................................................48
3.12 I2C Interface .........................................................................................................50
3.13 Audio Interfaces...................................................................................................52
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3.13.1 Speech Processing................................................................................53
3.13.2 Microphone Circuit.................................................................................53
3.13.2.1 Single-ended Microphone Input.............................................................53
3.13.2.2 Differential Microphone Input.................................................................54
3.13.2.3 Line Input Configuration with OpAmp ....................................................55
3.13.3 Loudspeaker Circuit...............................................................................56
3.13.4 Digital Audio Interface DAI.....................................................................57
3.14 Control Signals ....................................................................................................59
3.14.1 Synchronization Signal ..........................................................................59
3.14.2 Using the SYNC Pin to Control a Status LED........................................60
4 Antenna Interface........................................................................................................61
4.1 Antenna Installation .............................................................................................61
4.2 Antenna Pad ........................................................................................................63
4.2.1 Suitable Cable Types.............................................................................63
4.3 Antenna Connector..............................................................................................64
5 Electrical, Reliability and Radio Characteristics......................................................68
5.1 Absolute Maximum Ratings .................................................................................68
5.2 Operating Temperatures......................................................................................68
5.3 Pin Assignment and Signal Description...............................................................69
5.4 Power Supply Ratings .........................................................................................75
5.5 Electrostatic Discharge ........................................................................................78
5.6 Reliability Characteristics.....................................................................................79
6 Mechanics....................................................................................................................80
6.1 Mechanical Dimensions of TC63 .........................................................................80
6.2 Mounting TC63 to the Application Platform .........................................................82
6.3 Board-to-Board Application Connector ................................................................83
7 Sample Application.....................................................................................................86
8 Reference Approval ....................................................................................................88
8.1 Reference Equipment for Type Approval.............................................................88
8.2 Compliance with FCC Rules and Regulations.....................................................89
9 Appendix......................................................................................................................90
9.1 List of Parts and Accessories ..............................................................................90
9.2 Fasteners and Fixings for Electronic Equipment .................................................92
9.2.1 Fasteners from German Supplier ETTINGER GmbH ............................92
9.3 Data Sheets of Recommended Batteries ............................................................95
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Tables
Table 1: Overview of operating modes................................................................................... 22
Table 2: Temperature dependent behavior ............................................................................ 33
Table 3: Specifications of battery packs suitable for use with TC63 ...................................... 37
Table 4: Comparison Charge-only and Charge mode............................................................ 40
Table 5: AT commands available in Charge-only mode......................................................... 40
Table 6: State transitions of TC63 (except SLEEP mode) .....................................................41
Table 7: Signals of the SIM interface (board-to-board connector) ......................................... 43
Table 8: DCE-DTE wiring of ASC0......................................................................................... 45
Table 9: DCE-DTE wiring of ASC1......................................................................................... 46
Table 10: Overview of DAI pin functions ................................................................................57
Table 11: Return loss in the active band ................................................................................61
Table 12: Product specifications of U.FL-R-SMT connector .................................................. 64
Table 13: Material and finish of U.FL-R-SMT connector and recommended plugs ...............65
Table 14: Ordering information for Hirose U.FL Series .......................................................... 67
Table 15: Absolute maximum ratings under non-operating conditions .................................. 68
Table 16: Operating temperatures ......................................................................................... 68
Table 17: Signal description...................................................................................................70
Table 18: Power supply ratings .............................................................................................. 75
Table 19: Current consumption during Tx burst for GSM 850MHz and GSM 900MHz..........76
Table 20: Current consumption during Tx burst for GSM 1800MHz and GSM 1900MHz......77
Table 21: Measured electrostatic values................................................................................78
Table 22: Summary of reliability test conditions ..................................................................... 79
Table 23: Technical specifications of Molex board-to-board connector .................................83
Table 24: List of parts and accessories..................................................................................90
Table 25: Molex sales contacts (subject to change) ..............................................................91
Table 26: Hirose sales contacts (subject to change)..............................................................91
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Figures
Figure 1: TC63 system overview............................................................................................ 19
Figure 2: TC63 block diagram ................................................................................................20
Figure 3: Power supply limits during transmit burst................................................................ 25
Figure 4: Position of the reference points BATT+ and GND .................................................. 25
Figure 5: Power-on with operating voltage at BATT+ applied before activating IGT.............. 27
Figure 6: Power-on with IGT held low before switching on operating voltage at BATT+ .......28
Figure 7: Signal states during turn-off procedure ...................................................................31
Figure 8: Battery pack circuit diagram....................................................................................37
Figure 9: RTC supply from capacitor...................................................................................... 42
Figure 10: RTC supply from rechargeable battery .................................................................42
Figure 11: RTC supply from non-chargeable battery .............................................................42
Figure 12: Serial interface ASC0............................................................................................ 44
Figure 13: Serial interface ASC1............................................................................................ 46
Figure 14: USB circuit ............................................................................................................47
Figure 15: I2C interface connected to VCC of application .....................................................50
Figure 16: I2C interface connected to VEXT line of TC63 ..................................................... 51
Figure 17: Audio block diagram.............................................................................................. 52
Figure 18: Single ended microphone input............................................................................. 53
Figure 19: Differential microphone input ................................................................................54
Figure 20: Line input configuration with OpAmp .................................................................... 55
Figure 21: Differential loudspeaker configuration...................................................................56
Figure 22: Single ended loudspeaker configuration............................................................... 56
Figure 23: PCM interface application ..................................................................................... 57
Figure 24: PCM timing............................................................................................................ 58
Figure 25: SYNC signal during transmit burst ........................................................................ 59
Figure 26: LED Circuit (Example)...........................................................................................60
Figure 27: Never use antenna connector and antenna pad at the same time ....................... 62
Figure 28: Restricted area around antenna pad..................................................................... 62
Figure 29: Mechanical dimensions of U.FL-R-SMT connector...............................................64
Figure 30: U.FL-R-SMT connector with U.FL-LP-040 plug ....................................................65
Figure 31: U.FL-R-SMT connector with U.FL-LP-066 plug ....................................................65
Figure 32: Specifications of U.FL-LP-(V)-040(01) plug .......................................................... 66
Figure 33: Pin assignment (component side of TC63) ........................................................... 69
Figure 34: TC63 – top view .................................................................................................... 80
Figure 35: Dimensions of TC63.............................................................................................. 81
Figure 36: Molex board-to-board connector 52991-0808 on TC63 ........................................ 84
Figure 37: Mating board-to-board connector 53748-0808 on application ..............................85
Figure 38: TC63 sample application (draft) ............................................................................87
Figure 39: Reference equipment for Type Approval .............................................................. 88
Figure 40: Lithium Ion battery from VARTA ...........................................................................96
Figure 41: Lithium Polymer battery from VARTA ................................................................... 97
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0 Document History
Preceding document: "TC63 Hardware Interface Description" Version 00.192
New document: "TC63 Hardware Interface Description" Version 00.432
Chapter What is new
Throughout
manual
IGT line needs to be driven low for at least 400ms
2.1, 3.3.1.4,
3.6 5.3
Modified description of EMERG_RST line: EMERG_RST and additional activation of
IGT will reset TC63. EMERG_RST without activation of IGT will switch TC63 off.
2.1 Added 7-bit addressing to list of I2C features.
Corrected module’s weight.
3.1 New chapter: Operating Modes
3.2.1 Added description for undervoltage shutdown in IDLE and SLEEP mode.
3.3.1 Added remarks on different operating modes.
3.3.3.3 Added remark on shutdown threshold in IDLE mode.
3.3.3.5 Orderly shutdown in case of overvoltage - added maximum voltage value.
Further details on overvoltage shutdown.
3.5.2 New chapter to describe requirements to control end of charging.
3.5.4 Updated recommended battery specifications.
3.5.6 Corrected current value in case of undervoltage charging.
3.5.7 Added remarks on how to switch the module off when in Charging-only mode and how
to switch to other operating modes. No automatic shutdown in Charge-only mode.
Updated list of AT commands.
Removed AT^SMSO from list of AT commands supported in Charge-only mode.
3.6 New chapter: Summary of State Transitions (Except SLEEP Mode)
3.12 Added 7-bit addressing and remark on AT^SSPI command.
3.13 Corrected figure “Audio block diagram”.
3.13.4 Updated description of the DAI.
3.14.1 Updated forward time of SYNC signal during transmit burst.
4.1 Corrected figure “Never use antenna connector and antenna pad at the same time”.
5.1 Added conditions for absolute maximum ratings.
5.2 Added remark on temperature tolerances.
5.4 New chapter: Power Supply Ratings
6.1 Updated Figure 35.
8.1 Changed figure “Reference equipment for type approval”
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1 Introduction
This document describes the hardware of the Siemens TC63 module that connects to the
cellular device application and the air interface. It helps you quickly retrieve interface
specifications, electrical and mechanical details and information on the requirements to be
considered for integrating further components.
1.1 Related Documents
[1] TC63 AT Command Set
[2] TC63 Release Notes 00.432
[3] DSB75 Support Box - Evaluation Kit for Siemens Cellular Engines
[4] Application 07: Rechargeable Lithium Batteries in GSM Applications
[5] Multiplexer User's Guide (not yet available)
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1.2 Terms and Abbreviations
Abbreviation Description
ADC Analog-to-Digital Converter
AGC Automatic Gain Control
ANSI American National Standards Institute
ARFCN Absolute Radio Frequency Channel Number
ARP Antenna Reference Point
ASC0 / ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of
TC63
B Thermistor Constant
B2B Board-to-board connector
BER Bit Error Rate
BTS Base Transceiver Station
CB or CBM Cell Broadcast Message
CE Conformité Européene (European Conformity)
CHAP Challenge Handshake Authentication Protocol
CPU Central Processing Unit
CS Coding Scheme
CSD Circuit Switched Data
CTS Clear to Send
DAC Digital-to-Analog Converter
DAI Digital Audio Interface
dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law
DCE Data Communication Equipment (typically modems, e.g. Siemens GSM engine)
DCS 1800 Digital Cellular System, also referred to as PCN
DRX Discontinuous Reception
DSB Development Support Box
DSP Digital Signal Processor
DSR Data Set Ready
DTE Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM
application)
DTR Data Terminal Ready
DTX Discontinuous Transmission
EFR Enhanced Full Rate
EGSM Enhanced GSM
EIRP Equivalent Isotropic Radiated Power
EMC Electromagnetic Compatibility
ERP Effective Radiated Power
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Abbreviation Description
ESD Electrostatic Discharge
ETS European Telecommunication Standard
FCC Federal Communications Commission (U.S.)
FDMA Frequency Division Multiple Access
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GPRS General Packet Radio Service
GSM Global Standard for Mobile Communications
HiZ High Impedance
HR Half Rate
I/O Input/Output
IC Integrated Circuit
IMEI International Mobile Equipment Identity
ISO International Standards Organization
ITU International Telecommunications Union
kbps kbits per second
LED Light Emitting Diode
Li-Ion / Li+ Lithium-Ion
Li battery Rechargeable Lithium Ion or Lithium Polymer battery
Mbps Mbits per second
MMI Man Machine Interface
MO Mobile Originated
MS Mobile Station (GSM engine), also referred to as TE
MSISDN Mobile Station International ISDN number
MT Mobile Terminated
NTC Negative Temperature Coefficient
OEM Original Equipment Manufacturer
PA Power Amplifier
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCL Power Control Level
PCM Pulse Code Modulation
PCN Personal Communications Network, also referred to as DCS 1800
PCS Personal Communication System, also referred to as GSM 1900
PDU Protocol Data Unit
PLL Phase Locked Loop
PPP Point-to-point protocol
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Abbreviation Description
PSK Phase Shift Keying
PSU Power Supply Unit
R&TTE Radio and Telecommunication Terminal Equipment
RAM Random Access Memory
RF Radio Frequency
RMS Root Mean Square (value)
ROM Read-only Memory
RTC Real Time Clock
RTS Request to Send
Rx Receive Direction
SAR Specific Absorption Rate
SD Secure Digital
SELV Safety Extra Low Voltage
SIM Subscriber Identification Module
SMS Short Message Service
SRAM Static Random Access Memory
TA Terminal adapter (e.g. GSM engine)
TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
Tx Transmit Direction
UART Universal asynchronous receiver-transmitter
URC Unsolicited Result Code
USB Universal Serial Bus
USSD Unstructured Supplementary Service Data
VSWR Voltage Standing Wave Ratio
Phonebook abbreviations
FD SIM fixdialing phonebook
LD SIM last dialing phonebook (list of numbers most recently dialed)
MC Mobile Equipment list of unanswered MT calls (missed calls)
ME Mobile Equipment phonebook
ON Own numbers (MSISDNs) stored on SIM or ME
RC Mobile Equipment list of received calls
SM SIM phonebook
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1.3 Type Approval
TC63 is designed to comply with the directives and standards listed below. Please note that
the product is still in a pre-release state and, therefore, type approval and testing procedures
have not yet been completed.
European directives
99/05/EC “Directive of the European Parliament and of the council of 9 March
1999 on radio equipment and telecommunications terminal
equipment and the mutual recognition of their conformity”, in short
referred to as R&TTE Directive 1999/5/EC
89/336/EC Directive on electromagnetic compatibility
73/23/EC Directive on electrical equipment designed for use within certain
voltage limits (Low Voltage Directive)
Standards of North American Type Approval
CFR Title 47 “Code of Federal Regulations, Part 22 and Part 24 (Telecommuni-
cations, PCS)”; US Equipment Authorization FCC
UL 60 950 “Product Safety Certification” (Safety requirements)
NAPRD.03 “Overview of PCS Type certification review board
Mobile Equipment Type Certification and IMEI control”
PCS Type Certification Review board (PTCRB), Version 3.1.0
RSS133 (Issue2) Canadian Standard
Standards of European Type Approval
3GPP TS 51.010-1 “Digital cellular telecommunications system (Phase 2); Mobile
Station (MS) conformance specification”
ETSI EN 301 511 “V7.0.1 (2000-12) Candidate Harmonized European Standard
(Telecommunications series) Global System for Mobile
communications (GSM); Harmonized standard for mobile stations in
the GSM 900 and DCS 1800 bands covering essential requirements
under article 3.2 of the R&TTE directive (1999/5/EC) (GSM 13.11
version 7.0.1 Release 1998)”
GCF-CC “Global Certification Forum - Certification Criteria” V3.16.0
ETSI EN 301 489-1 “V1.2.1 Candidate Harmonized European Standard
(Telecommunications series) Electro Magnetic Compatibility and
Radio spectrum Matters (ERM); Electro Magnetic Compatibility
(EMC) standard for radio equipment and services; Part 1: Common
Technical Requirements”
ETSI EN 301 489-7 “V1.1.1 Candidate Harmonized European Standard
(Telecommunications series) Electro Magnetic Compatibility and
Radio spectrum Matters (ERM); Electro Magnetic Compatibility
(EMC) standard for radio equipment and services; Part 7: Specific
conditions for mobile and portable radio and ancillary equipment of
digital cellular radio telecommunications systems (GSM and DCS)”
EN 60 950 Safety of information technology equipment (2000)
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Requirements of quality
IEC 60068 Environmental testing
DIN EN 60529 IP codes
Compliance with international rules and regulations
Manufacturers of mobile or fixed devices incorporating TC63 modules are advised to have
their completed product tested and approved for compliance with all applicable national and
international regulations. As a quad-band GSM/GPRS engine designed for use on any GSM
network in the world, TC63 is required to pass all approvals relevant to operation on the
European and North American markets. For the North American market this includes the
Rules and Regulations of the Federal Communications Commission (FCC) and PTCRB, for
the European market the R&TTE Directives and GCF Certification Criteria must be fully
satisfied.
The FCC Equipment Authorization granted to the TC63 Siemens reference application is
valid only for the equipment described in Section 8.1.
SAR requirements specific to portable mobiles
Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM
module must be in accordance with the guidelines for human exposure to radio frequency
energy. This requires the Specific Absorption Rate (SAR) of portable TC63 based
applications to be evaluated and approved for compliance with national and/or international
regulations.
Since the SAR value varies significantly with the individual product design manufacturers are
advised to submit their product for approval if designed for portable use. For European and
US markets the relevant directives are mentioned below. It is the responsibility of the
manufacturer of the final product to verify whether or not further standards, recommendations
or directives are in force outside these areas.
Products intended for sale on US markets
ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to
Electromagnetic Fields (EMFs) from Mobile Telecommunication
Equipment (MTE) in the frequency range 30MHz - 6GHz
Products intended for sale on European markets
EN 50360 Product standard to demonstrate the compliance of mobile phones
with the basic restrictions related to human exposure to
electromagnetic fields (300MHz - 3GHz)
Note: Usage of TC63 in a fixed, mobile or portable application is not allowed without a
new FCC certification.
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1.4 Safety Precautions
The following safety precautions must be observed during all phases of the operation, usage,
service or repair of any cellular terminal or mobile incorporating TC63. Manufacturers of the
cellular terminal are advised to convey the following safety information to users and
operating personnel and to incorporate these guidelines into all manuals supplied with the
product. Failure to comply with these precautions violates safety standards of design,
manufacture and intended use of the product. Siemens AG assumes no liability for
customer’s failure to comply with these precautions.
When in a hospital or other health care facility, observe the restrictions on the
use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so
by the guidelines posted in sensitive areas. Medical equipment may be
sensitive to RF energy.
The operation of cardiac pacemakers, other implanted medical equipment
and hearing aids can be affected by interference from cellular terminals or
mobiles placed close to the device. If in doubt about potential danger, contact
the physician or the manufacturer of the device to verify that the equipment is
properly shielded. Pacemaker patients are advised to keep their hand-held
mobile away from the pacemaker, while it is on.
Switch off the cellular terminal or mobile before boarding an aircraft. Make
sure it cannot be switched on inadvertently. The operation of wireless
appliances in an aircraft is forbidden to prevent interference with
communications systems. Failure to observe these instructions may lead to
the suspension or denial of cellular services to the offender, legal action, or
both.
Do not operate the cellular terminal or mobile in the presence of flammable
gases or fumes. Switch off the cellular terminal when you are near petrol
stations, fuel depots, chemical plants or where blasting operations are in
progress. Operation of any electrical equipment in potentially explosive
atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency
energy while switched on. Remember that interference can occur if it is used
close to TV sets, radios, computers or inadequately shielded equipment.
Follow any special regulations and always switch off the cellular terminal or
mobile wherever forbidden, or when you suspect that it may cause
interference or danger.
Road safety comes first! Do not use a hand-held cellular terminal or mobile
when driving a vehicle, unless it is securely mounted in a holder for
speakerphone operation. Before making a call with a hand-held terminal or
mobile, park the vehicle.
Speakerphones must be installed by qualified personnel. Faulty installation or
operation can constitute a safety hazard.
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SOS
IMPORTANT!
Cellular terminals or mobiles operate using radio signals and cellular
networks. Because of this, connection cannot be guaranteed at all times
under all conditions. Therefore, you should never rely solely upon any
wireless device for essential communications, for example emergency calls.
Remember, in order to make or receive calls, the cellular terminal or mobile
must be switched on and in a service area with adequate cellular signal
strength.
Some networks do not allow for emergency calls if certain network services or
phone features are in use (e.g. lock functions, fixed dialing etc.). You may
need to deactivate those features before you can make an emergency call.
Some networks require that a valid SIM card be properly inserted in the
cellular terminal or mobile.
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2 Product Concept
2.1 Key Features at a Glance
Feature Implementation
General
Frequency bands Quad band: GSM 850/900/1800/1900MHz
GSM class Small MS
Output power
(according to
Release 99, V5)
Class 4 (+33dBm ±2dB) for EGSM850
Class 4 (+33dBm ±2dB) for EGSM900
Class 1 (+30dBm ±2dB) for GSM1800
Class 1 (+30dBm ±2dB) for GSM1900
The values stated above are maximum limits. According to
Release 99, Version 5, the maximum output power in a multislot
configuration may be lower. The nominal reduction of maximum
output power varies with the number of uplink timeslots used and
amounts to 3.0dB for 2Tx, 4.8dB for 3Tx and 6.0dB for 4Tx.
Power supply 3.2V to 4.5V
Power consumption Sleep mode: max. TBD
Power down mode: typically 50µA
Operating temperature -30°C to +65°C ambient temperature
Auto switch-off at +90°C board temperature (preliminary)
Physical Dimensions: 33.9mm x 44.6mm x max. 3.5mm
Weight: approx. 7.5g
GSM / GPRS features
Data transfer GPRS
• Multislot Class 12
• Full PBCCH support
• Mobile Station Class B
• Coding Scheme 1 – 4
CSD
• V.110, RLP, non-transparent
• 2.4, 4.8, 9.6, 14.4kbps
• USSD
PPP-stack for GPRS data transfer
SMS • Point-to-point MT and MO
• Cell broadcast
• Text and PDU mode
• Storage: SIM card plus 25 SMS locations in mobile equipment
• Transmission of SMS alternatively over CSD or GPRS.
Preferred mode can be user defined.
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Feature Implementation
Fax Group 3; Class 1
Audio Speech codecs:
• Half rate HR (ETS 06.20)
• Full rate FR (ETS 06.10)
• Enhanced full rate EFR (ETS 06.50/06.60/06.80)
• Adaptive Multi Rate AMR
Speakerphone operation
Echo cancellation, noise suppression
DTMF
7 ringing tones
Software
AT commands AT-Hayes GSM 07.05 and 07.07, Siemens
AT commands for RIL compatibility (NDIS/RIL)
MicrosoftTM compatibility RIL / NDIS for Pocket PC and Smartphone
SIM Application Toolkit SAT Release 99
TCP/IP stack Access by AT commands
IP addresses IP version 6
Remote SIM Access TC63 supports Remote SIM Access. RSA enables TC63 to use a
remote SIM card via its serial interface, in addition to the SIM card
locally attached to the dedicated lines of the application interface.
In a vehicle mounted scenario, for example, this allows the driver
to access a mobile phone brought into the car from a car-
embedded phone. The connection between both phones can be a
Bluetooth wireless link or a serial link, e.g. via the car cradle.
The necessary protocols and procedures are implemented
according to the “SIM Access Profile Interoperability Specification
of the Bluetooth Special Interest Group”.
Firmware update Download over serial interface ASC0
Download over SIM interface
Download over USB
Interfaces
2 serial interfaces
ASC0
• 8-wire modem interface with status and control lines,
unbalanced, asynchronous
• 1.2kbps to 460kbps
• Autobauding TBD
• Supports RTS0/CTS0 hardware handshake and software
XON/XOFF flow control.
• Multiplex ability according to GSM 07.10 Multiplexer Protocol.
ASC1
• 4-wire, unbalanced asynchronous interface
• 1.2kbps to 460kbps
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Feature Implementation
• Autobauding TBD
• Supports RTS1/CTS1 hardware handshake and software
XON/XOFF flow control
USB Supports a USB 2.0 Full Speed (12Mbit/s) slave interface.
I2C I2C bus for 7-bit addressing and transmission rates up to 400kbps.
Programmable with AT^SSPI command.
Audio • 2 analog interfaces
• 1 digital interface (PCM)
SIM interface Supported SIM cards: 3V, 1.8V
Antenna 50Ohms. External antenna can be connected via antenna
connector or solderable pad.
Module interface 80-pin board-to-board connector
Power on/off, Reset
Power on/off • Switch-on by hardware pin IGT
• Switch-off by AT command (AT^SMSO)
• Automatic switch-off in case of critical temperature and
voltage conditions.
Reset • Orderly shutdown and reset by AT command
• Emergency reset by hardware pins EMERG_RST and IGT.
Special features
Charging Supports management of rechargeable Lithium Ion and Lithium
Polymer batteries
Real time clock Timer functions via AT commands
Phonebook SIM and phone
Evaluation kit
DSB75 DSB75 Evaluation Board designed to test and type approve
Siemens cellular engines and provide a sample configuration for
application engineering.
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2.2 TC63 System Overview
User Application
TC63
Antenna
Interface
Application Interface
USB SIM Serial 1
(
Modem)
Analog
Audio
Digital
Audio Charge Power
Supply
USB
Host
I2C
Slave
SIM card
Headphones
or Headset
Audio
Codec
UART
Serial 2
Charger
Charging
circuit
I
2
C
Figure 1: TC63 system overview
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2.3 Circuit Concept
Figure 2 shows a block diagram of the TC63 module and illustrates the major functional
components:
Baseband block:
• Digital baseband processor with DSP
• Analog processor with power supply unit (PSU)
• Flash / SRAM (stacked)
• Application interface (board-to-board connector)
RF section:
• RF transceiver
• RF power amplifier
• RF front end
• Antenna connector
Digital Baseband
Processor with DSP
Analog Controller
with PSU
BATT+
GND
IGT
EM ERG_ RS T
ASC (0)
5
SIM Interface
CCIN
CCRST
CCIO
CCCLK
CCVCC
D(0:15)
A(0 :24)
RD; WR; CS; WAIT
RF Control Bus
Interface
RF - Baseband
NTC
BATT_TEMP
VDDLP
SYN C
RF Part
Transceiver
RF Power
Amplifier
SRAM
Flash
6
8
TC63
Application Interface (80 pins)
I / Q
4
Au di o a na log
10
SD Card
USB
3
I2C
2
VEX T
ISEN SE
VSE NSE
VC HA RGE
CHARGEGATE
3
RESET
Reset
BATTYPE
TE M P2
REFCHG
ASC (1 )4
26MHz
Front End
DAI
7
8
PWR _IN D
Measuring
Network
32.768kHz
26MHz
RTC
Figure 2: TC63 block diagram
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3 Application Interface
TC63 is equipped with an 80-pin board-to-board connector that connects to the external
application. The host interface incorporates several sub-interfaces described in the following
chapters:
• Power supply - see Section 3.2
• Charger interface – Section 3.5
• SIM interface - see Section 3.8
• Serial interface ASC0 - see Section 3.9
• Serial interface ASC1 - see Section 3.10
• Serial interface USB - see Section 3.11.
• Serial interface I²C - see Section 3.12
• Two analog audio interfaces - see Section 3.13
• Digital audio interface (DAI) - see Section 3.13 and 3.13.4
• Status and control lines: IGT, EMERG_RST, PWR_IND, SYNC - see Table 17
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3.1 Operating Modes
The table below briefly summarizes the various operating modes referred to in the following
chapters.
Table 1: Overview of operating modes
GSM / GPRS SLEEP Various power save modes set with AT+CFUN
command.
Software is active to minimum extent. If the module was
registered to the GSM network in IDLE mode, it is
registered and paging with the BTS in SLEEP mode,
too. Power saving can be chosen at different levels:
The NON-CYCLIC SLEEP mode (AT+CFUN=0)
disables the AT interface. The CYCLIC SLEEP modes
AT+CFUN=7 and 9 alternatively activate and deactivate
the AT interfaces to allow permanent access to all AT
commands.
GSM IDLE Software is active. Once registered to the GSM
network, paging with BTS is carried out. The module is
ready to send and receive.
GSM TALK Connection between two subscribers is in progress.
Power consumption depends on network coverage
individual settings, such as DTX off/on, FR/EFR/HR,
hopping sequences, antenna.
GPRS IDLE Module is ready for GPRS data transfer, but no data is
currently sent or received. Power consumption depends
on network settings and GPRS configuration (e.g.
multislot settings).
Normal operation
GPRS DATA GPRS data transfer in progress. Power consumption
depends on network settings (e.g. power control level),
uplink / downlink data rates, GPRS configuration (e.g.
used multislot settings) and reduction of maximum
output power.
POWER DOWN Normal shutdown after sending the AT^SMSO command.
The Power Supply disconnects the supply voltage from the baseband part of
the circuit. Only a voltage regulator is active for powering the RTC. Software is
not active. Interfaces are not accessible.
Operating voltage (connected to BATT+) remains applied.
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Airplane mode Airplane mode shuts down the radio part of the module, causes the module to
log off from the GSM/GPRS network and disables all AT commands whose
execution requires a radio connection.
Airplane mode can be controlled by using the AT commands AT^SCFG and
AT+CALA:
• With AT^SCFG=MEopMode/Airplane/OnStart the module can be configured
to enter the Airplane mode each time when switched on or reset.
• The parameter AT^SCFG=MEopMode/Airplane can be used to switch back
and forth between Normal mode and Airplane mode any time during
operation.
• Setting an alarm time with AT+CALA followed by AT^SMSO wakes the
module up into Airplane mode at the scheduled time.
Charge-only mode Limited operation for battery powered applications. Enables charging while
module is detached from GSM network. Limited number of AT commands is
accessible. Charge-only mode applies when the charger is connected if the
module was powered down with AT^SMSO.
Charge mode
during normal
operation
Normal operation (SLEEP, IDLE, TALK, GPRS IDLE, GPRS DATA) and
charging running in parallel. Charge mode changes to Charge-only mode when
the module is powered down before charging has been completed.
See Table 6 for the various options proceeding from one mode to another.
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3.2 Power Supply
TC63 needs to be connected to a power supply at the B2B connector (5 pins each BATT+
and GND).
The power supply of TC63 has to be a single voltage source at BATT+. It must be able to
provide the peak current during the uplink transmission.
All the key functions for supplying power to the device are handled by the power
management section of the analog controller. This IC provides the following features:
• Stabilizes the supply voltages for the GSM baseband using low drop linear voltage
regulators.
• Switches the module's power voltages for the power up and down procedures.
• Delivers, across the VEXT pin, a regulated voltage for an external application. This
voltage is not available in Power-down mode.
• SIM switch to provide SIM power supply.
3.2.1 Minimizing Power Losses
When designing the power supply for your application please pay specific attention to power
losses. Ensure that the input voltage VBATT+ never drops below 3.2V on the TC63 board, not
even in a transmit burst where current consumption can rise to typical peaks of 2A. It should
be noted that TC63 switches off when exceeding these limits. Any voltage drops that may
occur in a transmit burst should not exceed 400mV.
The measurement network monitors outburst and inburst values. The drop is the difference
of both values. The maximum drop (Dmax) since the last start of the module will be saved. In
IDLE and SLEEP mode, the module switches off if the minimum battery voltage (Vbattmin) is
reached.
Example:
VImin = 3.2V
Dmax = 0.35V
Vbattmin = VImin + Dmax
Vbattmin = 3.2V + 0.35V = 3.55V
The best approach to reducing voltage drops is to use a board-to-board connection as
recommended, and a low impedance power source. The resistance of the power supply lines
on the host board and of a battery pack should also be considered.
Note: If the application design requires an adapter cable between both board-to-board
connectors, use a flex cable as short as possible in order to minimize power
losses.
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Example: If the length of the flex cable reaches the maximum length of 100mm, this
connection may cause, for example, a resistance of 30m in the BATT+ line and
30m in the GND line. As a result, a 2A transmit burst would add up to a total
voltage drop of 120mV. Plus, if a battery pack is involved, further losses may
occur due to the resistance across the battery lines and the internal resistance of
the battery including its protection circuit.
Figure 3: Power supply limits during transmit burst
3.2.2 Measuring the Supply Voltage VBATT+
The reference points for measuring the supply voltage VBATT+ on the module are BATT+ and
GND, both accessible at a capacitor located close to the board-to-board connector of the
module.
Figure 4: Position of the reference points BATT+ and GND
3.2.3 Monitoring Power Supply by AT Command
To monitor the supply voltage you can also use the AT^SBV command which returns the
value related to the reference points BATT+ and GND.
The module continuously measures the voltage at intervals depending on the operating
mode of the RF interface. The duration of measuring ranges from 0.5s in TALK/DATA mode
to 50s when TC63 is in IDLE mode or Limited Service (deregistered). The displayed voltage
(in mV) is averaged over the last measuring period before the AT^SBV command was
executed.
Transmit
burst 2A
Transmit
burst 2A
Ripple
Drop
min. 3.2V
BATT+
Reference
point
BATT+
Reference
point GND
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3.3 Power Up / Power Down Scenarios
In general, be sure not to turn on TC63 while it is beyond the safety limits of voltage and
temperature stated in Chapter 5. TC63 would immediately switch off after having started and
detected these inappropriate conditions. In extreme cases this can cause permanent
damage to the module.
3.3.1 Turn on TC63
TC63 can be started in a variety of ways as described in the following sections:
• Hardware driven start-up by IGT line: starts Normal mode or Airplane mode (see Section
3.3.1.1)
• Software controlled reset by AT+CFUN command: starts Normal or Airplane mode (see
Section 3.3.1.3)
• Hardware driven start-up by VCHARGE line: starts charging algorithm and Charge-only
mode (see Section 3.3.1.2)
• Wake-up from Power-down mode by using RTC interrupt: starts Airplane mode
The option whether to start into Normal mode or Airplane mode depends on the settings
made with the AT^SCFG command or AT+CALA. With AT+CALA, followed by AT^SMSO the
module can be configured to restart into Airplane mode at a scheduled alarm time. Switching
back and forth between Normal mode and Airplane mode is possible any time during
operation by using the AT^SCFG command.
After startup or mode change the following URCs indicate the module’s ready state:
• “SYSSTART” indicates that the module has entered Normal mode.
• “^SYSSTART AIRPLANE MODE” indicates that the module has entered Airplane mode.
• “^SYSSTART CHARGE ONLY MODE” indicates that the module has entered the
Charge-only mode.
Detailed explanations on AT^SCFG, AT+CFUN, AT+CALA and Airplane mode can be found
in [1].
3.3.1.1 Turn on TC63 Using Ignition Line IGT
When the TC63 module is in Power-down mode, it can be started to Normal mode or
Airplane mode by driving the IGT (ignition) line to ground. This must be accomplished with an
open drain/collector driver to avoid current flowing into this pin.
The module will start up when both of the following two conditions are met:
• The supply voltage applied at BATT+ must be in the operating range.
• The IGT line needs to be driven low for at least 400ms.
Considering different strategies of host application design the figures below show two
approaches to meet this requirement: The example in Figure 5 assumes that IGT is activated
after BATT+ has already been applied. The example in Figure 6 assumes that IGT is held
low before BATT+ is switched on. In either case, to power on the module, ensure that low
state of IGT takes at least 400ms from the moment the voltage at BATT+ is available.
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If configured to a fix baud rate (AT+IPR0), the module will send the URC “^SYSSTART” or
“^SYSSTART AIRPLANE MODE” to notify that it is ready to operate. If autobauding is
enabled (AT+IPR=0) there will be no notification.
EMERG_RST
VEXT
TXD0/TXD1/RTS0/RST1/DTR0 (driven by the application)
CTS0/CTS1/DSR0/DCD0
ca. 500 ms
Serial interfaces
ASC0 and ASC1
Undefined Active
PWR_IND
t = 400ms
min
120ms
BATT+
IGT
HiZ
Figure 5: Power-on with operating voltage at BATT+ applied before activating IGT
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EMERG_RST
PWR_IND
t = 400ms
min
120ms
BATT+
IGT
HiZ
VEXT
TXD0/TXD1/RTS0/RST1/DTR0 (driven by the application)
CTS0/CTS1/DSR0/DCD0
ca. 500 ms
Serial interfaces
ASC0 and ASC1
Undefined Active
Figure 6: Power-on with IGT held low before switching on operating voltage at BATT+
3.3.1.2 Turn on TC63 Using the VCHARGE Signal
As detailed in Section 3.5.7, the charging adapter can be connected regardless of the
module’s operating mode.
If the charger is connected to the charger input of the external charging circuit and the
module’s VCHARGE pin while TC63 is off, and the battery voltage is above the undervoltage
lockout threshold, processor controlled fast charging starts (see Section 3.5.6). TC63 enters
a restricted mode, referred to as Charge-only mode where only the charging algorithm will be
launched.
During the Charge-only mode TC63 is neither logged on to the GSM network nor are the
serial interfaces fully accessible. To switch to normal operation and log on to the GSM
network, the IGT line needs to be activated as described in Section 3.3.1.
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3.3.1.3 Reset TC63 via AT+CFUN Command
To reset and restart the TC63 module use the command AT+CFUN. You can enter
AT+CFUN=,1 or AT+CFUN=x,1, where x may be in the range from 0 to 9. See [1] for details.
If configured to a fix baud rate (AT+IPR0), the module will send the URC “^SYSSTART” or
“^SYSSTART AIRPLANE MODE to notify that it is ready to operate. If autobauding is
enabled (AT+IPR=0) there will be no notification. To register to the network SIM PIN
authentication is necessary after restart.
3.3.1.4 Reset or Turn off TC63 in Case of Emergency
Caution: Use the EMERG_RST pin only when, due to serious problems, the software is not
responding for more than 5 seconds. Pulling the EMERG_RST pin causes the loss of all
information stored in the volatile memory. Therefore, this procedure is intended only for use
in case of emergency, e.g. if TC63 does not respond, if reset or shutdown via AT command
fails.
The EMERG_RST signal is available on the application interface. To control the
EMERG_RST line it is recommended to use an open drain / collector driver.
The EMERG_RST line can be used to switch off or to reset the module. In any case the
EMERG_RST line must be pulled to ground for ≥10ms. Then, after releasing the
EMERG_RST line additional activation of IGT for 400 ms will reset the module. If IGT is not
activated for 400 ms the module switches off. In this case, it can be restarted any time as
described in section 3.3.1.1.
After hardware driven restart, notification via “^SYSSTART” or “^SYSSTART AIRPLANE”
URC is the same as in case of restart by IGT or AT command. To register to the network SIM
PIN authentication is necessary after restart.
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3.3.2 Turn off TC63
TC63 can be turned off as follows:
• Normal shutdown: Software controlled by AT^SMSO command
• Automatic shutdown: Takes effect if board or battery temperature is out of range or if
undervoltage or overvoltage conditions occur.
3.3.2.1 Turn off TC63 Using AT Command
The best and safest approach to powering down TC63 is to issue the AT^SMSO command.
This procedure lets TC63 log off from the network and allows the software to enter into a
secure state and safe data before disconnecting the power supply. The mode is referred to
as Power-down mode. In this mode, only the RTC stays active.
Before switching off the device sends the following response:
^SMSO: MS OFF
OK
^SHUTDOWN
After sending AT^SMSO do not enter any other AT commands. There are two ways to verify
when the module turns off:
• Wait for the URC “^SHUTDOWN”. It indicates that data have been stored non-volatile
and the module turns off in less than 1 second.
• Also, you can monitor the PWR_IND pin. High state of PWR_IND definitely indicates that
the module is switched off.
Be sure not to disconnect the supply voltage VBATT+ before the URC “^SHUTDOWN” has
been issued and the PWR_IND signal has gone high. Otherwise you run the risk of losing
data. Signal states during turn-off are shown in Figure 7.
While TC63 is in Power-down mode the application interface is switched off and must not be
fed from any other source. Therefore, your application must be designed to avoid any current
flow into any digital pins of the application interface, especially of the serial interfaces. No
special care is required for the USB interface which is protected from reverse current.
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VEXT See note 1
TXD0/TXD1/RTS0/RTS1/DTR0 (driven by the application)
Serial interfaces
ASC0 and ASC1
Undefined
Active
PWR_IND
CTS0/CTS1/DSR0/DTR0
Figure 7: Signal states during turn-off procedure
Note 1: Depending on capacitance load from host application
3.3.2.2 Leakage Current in Power Down Mode
The leakage current in Power Down mode varies depending on the following conditions:
• If the supply voltage at BATT+ was disconnected and then applied again without starting
up the TC63 module, the leakage current ranges between 90µA and 100µA.
• If the TC63 module is started and afterwards powered down with AT^SMSO, then the
leakage current is only 50µA.
Therefore, in order to minimize the leakage current take care to start up the module at least
once before it is powered down.
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3.3.3 Automatic Shutdown
Automatic shutdown takes effect if
• the TC63 board is exceeding the critical limits of overtemperature or undertemperature
• the battery is exceeding the critical limits of overtemperature or undertemperature
• undervoltage or overvoltage is detected
See Charge-only mode described in section 3.5.7 for exceptions.
The automatic shutdown procedure is equivalent to the Power-down initiated with the
AT^SMSO command, i.e. TC63 logs off from the network and the software enters a secure
state avoiding loss of data.
Alert messages transmitted before the device switches off are implemented as Unsolicited
Result Codes (URCs). The presentation of these URCs can be enabled or disabled with the
two AT commands AT^SBC and AT^SCTM. The URC presentation mode varies with the
condition, please see Chapters 3.3.3.1 to 3.3.3.4 for details. For further instructions on AT
commands refer to [1].
3.3.3.1 Temperature Dependent Shutdown
The board temperature is constantly monitored by an internal NTC resistor located on the
PCB. The NTC that detects the battery temperature must be part of the battery pack circuit
as described in 3.5.3 The values detected by either NTC resistor are measured directly on
the board or the battery and therefore, are not fully identical with the ambient temperature.
Each time the board or battery temperature goes out of range or back to normal, TC63
instantly displays an alert (if enabled).
• URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such
as protecting the module from exposure to extreme conditions. The presentation of the
URCs depends on the settings selected with the AT^SCTM write command:
AT^SCTM=1: Presentation of URCs is always enabled.
AT^SCTM=0 (default): Presentation of URCs is enabled for 15 seconds time after
start-up of TC63. After 15 seconds operation, the presentation will be disabled, i.e. no
alert messages can be generated.
• URCs indicating the level "2" or "-2" are instantly followed by an orderly shutdown. The
presentation of these URCs is always enabled, i.e. they will be output even though the
factory setting AT^SCTM=0 was never changed.
The maximum temperature ratings are stated in Table 16. Refer to Table 2 for the associated
URCs. All statements are based on test conditions according to IEC 60068-2-2 (still air).
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Table 2: Temperature dependent behavior
Sending temperature alert (15s after TC63 start-up, otherwise only if URC presentation enabled)
^SCTM_A: 1 Caution: Tamb of battery close to overtemperature limit.
^SCTM_B: 1 Caution: Tamb of board close to overtemperature limit.
^SCTM_A: -1 Caution: Tamb of battery close to undertemperature limit.
^SCTM_B: -1 Caution: Tamb of board close to undertemperature limit.
^SCTM_A: 0 Battery back to uncritical temperature range.
^SCTM_B: 0 Board back to uncritical temperature range.
Automatic shutdown (URC appears no matter whether or not presentation was enabled)
^SCTM_A: 2 Alert: Tamb of battery equal or beyond overtemperature limit. TC63 switches off.
^SCTM_B: 2 Alert: Tamb of board equal or beyond overtemperature limit. TC63 switches off.
^SCTM_A: -2 Alert: Tamb of battery equal or below undertemperature limit. TC63 switches off.
^SCTM_B: -2 Alert: Tamb of board equal or below undertemperature limit. TC63 switches off.
3.3.3.2 Temperature Control during Emergency call
If the temperature limit is exceeded while an emergency call is in progress the engine
continues to measure the temperature, but deactivates the shutdown functionality. If the
temperature is still out of range when the call ends, the module switches off immediately
(without another alert message).
3.3.3.3 Undervoltage Shutdown if Battery NTC is Present
In applications where the module’s charging technique is used and an NTC is connected to
the BATT_TEMP terminal, the software constantly monitors the applied voltage. If the
measured battery voltage is no more sufficient to set up a call the following URC will be
presented:
^SBC: Undervoltage.
The message will be reported, for example, when the user attempts to make a call while the
voltage is close to the shutdown threshold of 3.2V and further power loss is caused during
the transmit burst. In IDLE mode, the shutdown threshold is the sum of the module’s
minimum supply voltage (3.2V) and the value of the maximum voltage drop resulting from
earlier calls. This means that in IDLE mode the actual shutdown threshold may be higher
than 3.2V. Therefore, to properly calculate the actual shutdown threshold application
manufacturers are advised to measure the maximum voltage drops that may occur during
transmit bursts.
To remind the user that the battery needs to be charged soon, the URC appears several
times before the module switches off.
To enable or disable the URC use the AT^SBC command. The URC will be enabled when
you enter the write command and specify the current consumption of your host application.
Step by step instructions are provided in [1].
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3.3.3.4 Undervoltage Shutdown if no Battery NTC is Present
The undervoltage protection is also effective in applications, where no NTC connects to the
BATT_TEMP terminal. Thus, you can take advantage of this feature even though the
application handles the charging process or TC63 is fed by a fixed supply voltage. All you
need to do is executing the write command AT^SBC=<current> which automatically enables
the presentation of URCs. You do not need to specify <current>.
Whenever the supply voltage falls below the value of 3.2V the URC
^SBC: Undervoltage
appears several times before the module switches off.
3.3.3.5 Overvoltage Shutdown
The overvoltage shutdown threshold is 100mV above the maximum supply voltage VBATT+
specified in Table 18.
When the supply voltage approaches the overvoltage shutdown threshold the module will
send the following URC
^SBC: Overvoltage warning
This alert is sent once.
When the overvoltage shutdown threshold is exceeded the module will send the URC
^SBC: Overvoltage shutdown
before it shuts down cleanly.
Keep in mind that several TC63 components are directly linked to BATT+ and, therefore, the
supply voltage remains applied at major parts of TC63, even if the module is switched off.
Especially the power amplifier is very sensitive to high voltage and might even be destroyed.
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3.4 Automatic GPRS Multislot Class Change
Temperature control is also effective for operation in GPRS Multislot Class 10 and GPRS
Multislot Class 12. If the board temperature increases to the limit specified for restricted
operation1) while data are transmitted over GPRS, the module automatically reverts:
• from GPRS Multislot Class 12 (4Tx slots) to GPRS Multislot Class 8 (1Tx)
• from GPRS Multislot Class 10 (2Tx slots) to GPRS Multislot Class 8 (1Tx)
This reduces the power consumption and, consequently, causes the board’s temperature to
decrease. Once the temperature drops to a value of 5 degrees below the limit of restricted
operation, TC63 returns to the higher Multislot Class. If the temperature stays at the critical
level or even continues to rise, TC63 will not switch back to the higher class.
After a transition from GPRS Multislot Class 12 or 10 to GPRS Multislot Class 8 a possible
switchback to GPRS Multislot Class 12 or 10 is blocked for one minute.
Please note that there is not one single cause of switching over to a lower Multislot Class.
Rather it is the result of an interaction of several factors, such as the board temperature that
depends largely on the ambient temperature, the operating mode and the transmit power.
Furthermore, take into account that there is a delay until the network proceeds to a lower or,
accordingly, higher Multislot Class. The delay time is network dependent. In extreme cases,
if it takes too much time for the network and the temperature cannot drop due to this delay,
the module may even switch off as described in Section 3.3.3.1.
1) See Table 16 for temperature limits known as restricted operation.
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3.5 Charging Control
TC63 integrates a charging management for rechargeable Lithium Ion and Lithium Polymer
batteries. You can skip this chapter if charging is not your concern, or if you are not using the
implemented charging algorithm.
The following sections contain an overview of charging and battery specifications. Please
refer to [4] for greater detail, especially regarding requirements for batteries and chargers,
appropriate charging circuits, recommended batteries and an analysis of operational issues
typical of battery powered GSM/GPRS applications.
3.5.1 Hardware Requirements
TC63 has no on-board charging circuit. To benefit from the implemented charging
management you are required to install a charging circuit within your application according to
the Figure 38.
3.5.2 Software Requirements
Use the command AT^SBC, parameter <current>, to enter the current consumption of the
host application. This information enables the TC63 module to correctly determine the end of
charging and terminate charging automatically when the battery is fully charged. If the
<current> value is inaccurate and the application draws a current higher than the final charge
current, either charging will not be terminated or the battery fails to reach its maximum
voltage. Therefore, the termination condition is defined as: final charge current (50mA) plus
current consumption of the external application. If used the current flowing over the VEXT pin
of the application interface (typically 2.9V) must be added, too.
The parameter <current> is volatile, meaning that the factory default (0mA) is restored each
time the module is powered down or reset. Therefore, for better control of charging, it is
recommended to enter the value every time the module is started.
See [1] for details on AT^SBC.
3.5.3 Battery Pack Requirements
The charging algorithm has been optimized for rechargeable Lithium batteries that meet the
characteristics listed below and in Table 3. It is recommended that the battery pack you want
to integrate into your TC63 application is compliant with these specifications. This ensures
reliable operation, proper charging and, particularly, allows you to monitor the battery
capacity using the AT^SBC command. Failure to comply with these specifications might
cause AT^SBC to deliver incorrect battery capacity values.
• Li-Ion or Lithium Polymer battery pack specified for a maximum charging voltage of 4.2V
and a recommended capacity of 1000 to 1200mAh.
• Since charging and discharging largely depend on the battery temperature, the battery
pack should include an NTC resistor. If the NTC is not inside the battery it must be in
thermal contact with the battery. The NTC resistor must be connected between
BATT_TEMP and GND.
The B value of the NTC should be in the range: 10kΩ +5% @ 25°C, B25/85 = 3423K to B
=3435K ± 3% (alternatively acceptable: 10kΩ +2% @ 25°C, B25/50 = 3370K +3%). Please
note that the NTC is indispensable for proper charging, i.e. the charging process will not
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start if no NTC is present.
• Ensure that the pack incorporates a protection circuit capable of detecting overvoltage
(protection against overcharging), undervoltage (protection against deep discharging)
and overcurrent. Due to the discharge current profile typical of GSM applications, the
circuit must be insensitive to pulsed current.
• On the TC63 module, a built-in measuring circuit constantly monitors the supply voltage.
In the event of undervoltage, it causes TC63 to power down. Undervoltage thresholds are
specific to the battery pack and must be evaluated for the intended model. When you
evaluate undervoltage thresholds, consider both the current consumption of TC63 and of
the application circuit.
• The internal resistance of the battery and the protection should be as low as possible. It
is recommended not to exceed 150m, even in extreme conditions at low temperature.
The battery cell must be insensitive to rupture, fire and gassing under extreme conditions
of temperature and charging (voltage, current).
• The battery pack must be protected from reverse pole connection. For example, the
casing should be designed to prevent the user from mounting the battery in reverse
orientation.
• It is recommended that the battery pack be approved to satisfy the requirements of CE
conformity.
Figure 8 shows the circuit diagram of a typical battery
pack design that includes the protection elements
described above.
Figure 8: Battery pack circuit diagram
Table 3: Specifications of battery packs suitable for use with TC63
Battery type Rechargeable Lithium Ion or Lithium Polymer battery
Nominal voltage 3.6V / 3.7V
Capacity Recommended: 1000mAh to 1200mAh
Minimum: 500mAh
NTC 10k ± 5% @ 25°C
approx. 5k @ 45°C
approx. 26.2k @ 0°C
B value range: B (25/85)=3423K to B =3435K ± 3%
Overcharge detection voltage 4.325 ± 0.025V
Overdischarge detection voltage 2.5 ± 0.05V
Overcurrent detection 3 ± 0.5A
Overcurrent detection delay time 4 ~ 16ms
Short detection delay time 50µs
Internal resistance <130m
Note: A maximum internal resistance of 150m should not be
exceeded even after 500 cycles and under extreme conditions.
to BATT_TEMP to GND
NTC
Polyfuse
ϑ
Protection Circuit
+-
Battery cell
to BATT+
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3.5.4 Batteries Recommended for Use with TC63
When you choose a battery for your TC63 application you can take advantage of one of the
following two batteries offered by VARTA Microbattery GmbH. Both batteries meet all
requirements listed above. They have been thoroughly tested by Siemens, proved to be
suited for TC63, and are CE approved.
• LIP 633450A1B PCM.STB, type Lithium Ion
This battery is listed in the standard product range of VARTA. It is incorporated in a
shrink sleeve and has been chosen for integration into the reference setup submitted for
Type Approval of Siemens GSM modules.
• LPP 503759CA PCM.NTC.LT50, type Lithium Polymer
This battery has been especially designed by VARTA for use with Siemens GSM
modules. It has the same properties as the above Li-Ion battery, except that it is type
Polymer, is smaller and comes without casing.
Specifications, construction drawings and sales contacts for both VARTA batteries can be
found in Section 9.3.
3.5.5 Charger Requirements
For using the implemented charging algorithm and the reference charging circuit
recommended in [4] and in Figure 38, the charger has to meet the following requirements:
Output voltage: 5.2Volts ±0.2V (stabilized voltage)
Output current: 500mA
Chargers with a higher output current are acceptable, but please
consider that only 500mA will be applied when a 0.3Ohms shunt
resistor is connected between VSENSE and ISENSE. See [4] for
further details.
3.5.6 Implemented Charging Technique
If all requirements listed above are met (appropriate external charging circuit of application,
battery pack, charger, AT^SBC settings) then charging is enabled in various stages
depending on the battery condition:
Trickle charging:
• Trickle charge current flows over the VCHARGE line.
• Trickle charging is done when a charger is present (connected to VCHARGE) and the
battery is deeply discharged or has undervoltage. If deeply discharged (Deep Discharge
Lockout at VBATT+= 0…2.5V) the battery is charged with 5mA, in case of undervoltage
(Undervoltage Lockout at VBATT+= 2.5…3.2V) it is charged with 30mA
Software controlled charging:
• Controlled over the CHARGEGATE.
• Temperature conditions: 0°C to 45°C
• Software controlled charging is done when the charger is present (connected to
VCHARGE) and the battery voltage is at least above the undervoltage threshold.
Software controlled charging passes the following stages:
- Power ramp: Depending on the discharge level of the battery (i.e. the measured battery
voltage VBATT+) the software adjusts the maximum charge current for charging the
battery. The duration of power ramp charging is very short (less than 30 seconds).
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- Fast charging: Battery is charged with constant current (approx. 500mA) until the
battery voltage reaches 4.2V (approx. 80% of the battery capacity).
- Top-up charging: The battery is charged with constant voltage of 4.2V at stepwise
reducing charge current until full battery capacity is reached.
• The duration of software controlled charging depends on the battery capacity and the
level of discharge.
3.5.7 Operating Modes during Charging
Of course, the battery can be charged regardless of the engine's operating mode. When the
GSM module is in Normal mode (SLEEP, IDLE, TALK, GPRS IDLE or GPRS DATA mode), it
remains operational while charging is in progress (provided that sufficient voltage is applied).
The charging process during the Normal mode is referred to as Charge mode.
If the charger is connected to the charger input of the external charging circuit and the
module’s VCHARGE pin while TC63 is in Power-down mode, TC63 goes into Charge-only
mode.
While the charger remains connected it is not possible to switch the module off by using the
AT^SMSO command or the automatic shutdown mechanism. Instead the following applies:
• If the module is in Normal mode and the charger is connected (Charge mode) the
AT^SMSO command causes the module to shut down shortly and then start into the
Charge-only mode.
• In Charge-only mode the AT^SMSO command is not usable.
• In Charge-only mode the module neither switches off when the battery or the module
exceeds the critical limits of overtemperature or undertemperature.
In these cases you can only switch the module off by disconnecting the charger.
To proceed from Charge-only mode to another operating mode you have the following
options:
• To switch from Charge-only mode to Normal mode drive the ignition line (IGT) to ground
for 1 second.
• To switch from Charge-only mode to Airplane mode enter the command
AT^SCFG=MEopMode/Airplane,on.
• If AT^SCFG=MEopMode/Airplane/OnStart,on is set, driving the ignition line (IGT)
activates the Airplane mode.
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Table 4: Comparison Charge-only and Charge mode
How to activate mode
Description of mode
Charge mode
Connect charger to charger input of host
application charging circuit and module’s
VCHARGE pin while TC63 is
• operating, e.g. in IDLE or TALK mode
• in SLEEP mode
• Battery can be charged while GSM module
remains operational and registered to the
GSM network.
• In IDLE and TALK mode, the serial interfaces
are accessible. All AT commands can be
used to full extent.
NOTE: If the module operates at maximum
power level (PCL5) and GPRS Class 12 at the
same time the current consumption is higher than
the current supplied by the charger.
Charge-only mode
Connect charger to charger input of host
application charging circuit and module’s
VCHARGE pin while TC63 is
• in Power-down mode
• in Normal mode: Connect charger to
the VCHARGE pin, then enter
AT^SMSO.
NOTE: While trickle charging is in
progress, be sure that the host
application is switched off. If the
application is fed from the trickle charge
current the module might be prevented
from proceeding to software controlled
charging since the current would not be
sufficient.
• Battery can be charged while GSM engine is
deregistered from GSM network.
• Charging runs smoothly due to constant
current consumption.
• The AT interface is accessible and allows to
use the commands listed below.
Table 5: AT commands available in Charge-only mode
AT command Use
AT+CALA Set alarm time, configure Airplane mode.
AT+CCLK Set date and time of RTC.
AT^SBC Query status of charger connection. Enable / disable “^SBC” URCs.
AT^SBV Monitor supply voltage.
AT^SCTM Query temperature range, enable/disable URCs to report critical temperature
ranges
AT^SCFG Enable/disable parameters MEopMode/Airplane or MEopMode/Airplane/OnStart
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3.6 Summary of State Transitions (Except SLEEP Mode)
Table 6: State transitions of TC63 (except SLEEP mode)
The table shows how to proceed from one mode to another (grey column = present mode, white columns = intended modes)
Further mode ÎÎÎ
Present mode
POWER DOWN Normal mode**) Charge-only mode*) Airplane mode
POWER DOWN
mode
--- If AT^SCFG=MeOpMode/
Airplane/OnStart,off:
IGT >400 ms at low level
Connect charger to VCHARGE If AT^SCFG=MeOpMode/
Airplane/OnStart,on:
IGT >400 ms at low level
Regardless of AT^SCFG
configuration: scheduled wake-up set
with AT+CALA.
Normal mode**) AT^SMSO --- AT^SMSO if charger is
connected
AT^SCFG=MeOpMode/
Airplane,on.
If AT^SCFG=MeOpMode/
Airplane/OnStart,on:
AT+CFUN=x,1
or EMERG_RST + IGT >400 ms.
Charge-only mode *) Disconnect charger If AT^SCFG=MeOpMode/
Airplane/OnStart,off:
IGT >1s at low level
--- AT^SCFG=MeOpMode/
Airplane,on.
If AT^SCFG=MeOpMode/
Airplane/OnStart,on: IGT >1s at low
level
Airplane mode AT^SMSO AT^SCFG=MeOpMode/
Airplane,off
AT^SMSO if charger is
connected
---
*) See section 3.5.7 for details on the charging mode **) Normal mode covers TALK, DATA, GPRS, IDLE and SLEEP modes
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3.7 RTC Backup
The internal Real Time Clock of TC63 is supplied from a separate voltage regulator in the
analog controller which is also active when TC63 is in POWER DOWN status. An alarm
function is provided that allows to wake up TC63 to Airplane mode without logging on to the
GSM network.
In addition, you can use the VDDLP pin on the board-to-board connector to backup the RTC
from an external capacitor or a battery (rechargeable or non-chargeable). The capacitor is
charged by the BATT+ line of TC63. If the voltage supply at BATT+ is disconnected the RTC
can be powered by the capacitor. The size of the capacitor determines the duration of
buffering when no voltage is applied to TC63, i.e. the larger the capacitor the longer TC63
will save the date and time.
A serial 1k resistor placed on the board next to VDDLP limits the charge current of an
empty capacitor or battery.
The following figures show various sample configurations. Please refer to Table 17 for the
parameters required.
Baseband
processor
RTC
PSU
+
BATT+
1k
B2B
VDDLP
Figure 9: RTC supply from capacitor
RTC
+
BATT+
1k
B2B
VDDLP
Baseband
processor PSU
Figure 10: RTC supply from rechargeable battery
RTC +
+
BATT+
1k
VDDLP
B2B
Baseband
processor PSU
Figure 11: RTC supply from non-chargeable battery
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3.8 SIM Interface
The baseband processor has an integrated SIM interface compatible with the ISO 7816 IC
Card standard. This is wired to the host interface (board-to-board connector) in order to be
connected to an external SIM card holder. Six pins on the board-to-board connector are
reserved for the SIM interface.
The SIM interface supports 3V and 1.8V SIM cards. Please refer to Table 17 for electrical
specifications of the SIM interface lines depending on whether a 3V or 1.8V SIM card is
used.
The CCIN pin serves to detect whether a tray (with SIM card) is present in the card holder.
Using the CCIN pin is mandatory for compliance with the GSM 11.11 recommendation if the
mechanical design of the host application allows the user to remove the SIM card during
operation. To take advantage of this feature, an appropriate SIM card detect switch is
required on the card holder. For example, this is true for the model supplied by Molex, which
has been tested to operate with TC63 and is part of the Siemens reference equipment
submitted for type approval. See Chapter 8 for Molex ordering numbers.
Table 7: Signals of the SIM interface (board-to-board connector)
Signal Description
CCGND Separate ground connection for SIM card to improve EMC.
Be sure to use this ground line for the SIM interface rather than any other ground pin or
plane on the module. A design example for grounding the SIM interface is shown in
Figure 38.
CCCLK Chipcard clock, various clock rates can be set in the baseband processor.
CCVCC SIM supply voltage.
CCIO Serial data line, input and output.
CCRST Chipcard reset, provided by baseband processor.
CCIN Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is
removed during operation the SIM interface is shut down immediately to prevent
destruction of the SIM. The CCIN pin is active low.
The CCIN pin is mandatory for applications that allow the user to remove the SIM card
during operation.
The CCIN pin is solely intended for use with a SIM card. It must not be used for any other
purposes. Failure to comply with this requirement may invalidate the type approval of
TC63.
The total cable length between the board-to-board connector pins on TC63 and the pins of
the external SIM card holder must not exceed 100mm in order to meet the specifications of
3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.
To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both
lines are not placed closely next to each other. A useful approach is using the CCGND line to
shield the CCIO line from the CCCLK line.
Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered
after removing the SIM card during operation.
Also, no guarantee can be given for properly initializing any SIM card that the user
inserts after having removed a SIM card during operation. In this case, the application
must restart TC63.
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3.9 Serial Interface ASC0
TC63 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-
T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28.
The significant levels are 0V (for low data bit or active state) and 2.9V (for high data bit or
inactive state). For electrical characteristics please refer to Table 17.
TC63 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it
communicates with the customer application (DTE) using the following signals:
• Port TXD @ application sends data to the module’s TXD0 signal line
• Port RXD @ application receives data from the module’s RXD0 signal line
GSM module (DCE) Application (DTE)
TXD
RXD
RTS
CTS
RING
DCD
DSR
DTR
TXD0
RXD0
RTS0
CTS0
RING0
DCD0
DSR0
DTR0
Figure 12: Serial interface ASC0
Features
• Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in
addition, the modem control lines DTR0, DSR0, DCD0 and RING0.
• ASC0 is primarily designed for controlling voice calls, transferring CSD, fax and GPRS
data and for controlling the GSM engine with AT commands.
• Full Multiplex capability allows the interface to be partitioned into three virtual channels,
yet with CSD and fax services only available on the first logical channel. Please note that
when the ASC0 interface runs in Multiplex mode, ASC1 cannot be used. For more details
on Multiplex mode see [5].
• The DTR0 signal will only be polled once per second from the internal firmware of TC63.
• The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited
Result Code). It can also be used to send pulses to the host application, for example to
wake up the application from power saving state. See [1] for details on how to configure
the RING0 line by AT^SCFG.
• By default, configured for 8 data bits, no parity and 1 stop bit. The setting can be
changed using the AT command AT+ICF and, if required, AT^STPB. For details see [1].
• ASC0 can be operated at bit rates from 300bps to 460800bps.
• Autobauding supports the following bit rates: TBD.
• Autobauding is not compatible with multiplex mode.
• Supports RTS0/CTS0 hardware flow control and XON/XOFF software flow control.
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Table 8: DCE-DTE wiring of ASC0
DCE DTE V.24
circuit Pin function Signal direction Pin function Signal direction
103 TXD0 Input TXD Output
104 RXD0 Output RXD Input
105 RTS0 Input RTS Output
106 CTS0 Output CTS Input
108/2 DTR0 Input DTR Output
107 DSR0 Output DSR Input
109 DCD0 Output DCD Input
125 RING0 Output /RING Input
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3.10 Serial Interface ASC1
TC63 offers a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T
V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28.
The significant levels are 0V (for low data bit or active state) and 2.9V (for high data bit or
inactive state). For electrical characteristics please refer to Table 17.
TC63 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it
communicates with the customer application (DTE) using the following signals:
• Port TXD @ application sends data to module’s TXD1 signal line
• Port RXD @ application receives data from the module’s RXD1 signal line
GSM module (DCE) Application (DTE)
TXD
RXD
RTS
CTS
TXD1
RXD1
RTS1
CTS1
Figure 13: Serial interface ASC1
Features
• Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware
handshake.
• On ASC1 no RING line is available. The indication of URCs on the second interface
depends on the settings made with the AT^SCFG command. For details refer to [1].
• Configured for 8 data bits, no parity and 1 or 2 stop bits.
• ASC1 can be operated at bit rates from 300bps to 460800bps.
• Autobauding TBD.
• Supports RTS1/CTS1 hardware flow control and XON/XOFF software flow control.
Table 9: DCE-DTE wiring of ASC1
DCE DTE V.24
circuit Pin function Signal direction Pin function Signal direction
103 TXD1 Input TXD Output
104 RXD1 Output RXD Input
105 RTS1 Input RTS Output
106 CTS1 Output CTS Input
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3.11 USB Interface
TC63 supports a USB 2.0 Full Speed (12Mbit/s) device interface. It is primarily intended for
use as command and data interface and for downloading firmware.
The USB I/O-pins are capable of driving the signal at min 3.0V. They are 5V I/O compliant.
To properly connect the module’s USB interface to the host a USB 2.0 compatible connector
is required. Furthermore, the USB modem driver delivered with TC63 must be installed as
described below.
The USB host is responsible for supplying, across the VUSB_IN line, power to the module’s
USB interface, but not to other TC63 interfaces. This is because TC63 is designed as a self-
powered device compliant with the “Universal Serial Bus Specification Revision 2.0”1.
MCU
USB
Transceiver
lin.
Regulator
PSU
Baseband controller
GSM module
Host
22Ohms
22Ohms
1.5kOhms
USB_DP
USB_DN
VUSB_IN
5V3V
D+
D-
VBUS
GND
80 pole board-to-board connector
Figure 14: USB circuit
1 The specification is ready for download on http://www.usb.org/developers/docs/
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3.11.1 Installing the USB Modem Driver
This section assumes you are familiar with installing and configuring a modem under
Windows 2000 and Windows XP. As both operating systems use multiple methods to access
modem settings this section provides only a brief summary of the most important steps.
Take care that the “usbmodem.inf” file delivered with TC63 is at hand. Connect the USB
cable to the TC63 host application (for example the evaluation board DSB75) and the PC.
Windows detects TC63 as a new USB modem, opens the Found New Hardware Wizard and
reports that it is searching for the “Siemens AG WM USB Modem” driver. Follow the
instructions on the screen and specify the path where the “usbmodem.inf” file is located.
Windows will copy the required software to your computer and configure the modem by
assigning a free COM port. If you are already using more than one COM port then the next
free one will be allocated. Click Finish to complete the installation.
Notes for Windows 2000 only:
• During the installation procedure you will be prompted for the “usbser.sys” driver. Make
sure the file is present before you start installing the above inf file.
The “usbser.sys” file is not delivered as a single file, but must be extracted from a
Windows 2000 cabinet file. This is either the file “driver.cab” located in the “I386” folder of
the original Windows 2000 CD or a later cabinet file inside the Service Pack. SP4 for
example includes the “sp4.cab” file which can be found in its “I386” folder. The
“usbser.sys” driver from the Service Pack has priority over one provided with the
standard Windows 2000 install CD.
• It is necessary to restart Windows 2000 to make the changes take effect.
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You can find the “Siemens AG WM
USB Modem” listed under Control
Panel | Phone and Modem Options |
Modems.
Troubleshooting for installation problems
If Windows fails to
assign the next free
COM port to TC63 and,
for example, allocates a
COM port already used
by another modem you
can manually select a
free port as follows:
Open the Windows
Device Manager, select
the installed “Siemens
AG WM USB Modem”,
click Properties, select
the Advanced tab and
click Advanced Port
settings. From the
listbox COM Port
Number choose a free
port. To make the
changes take effect
disconnect and re-
connect the USB cable.
If not yet successful,
also restart Windows.
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3.12 I2C Interface
I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It
consists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK.
The TC63 module acts as a single master device, e.g. the clock I2CCLK is driven by module.
I2CDAT is a bi-directional line.
Each device connected to the bus is software addressable by a unique 7-bit address, and
simple master/slave relationships exist at all times. The module operates as master-
transmitter or as master-receiver. The customer application transmits or receives data only
on request of the module. To configure and activate the I2C interface use the AT^SSPI
command described in [1].
To configure and activate the I2C bus use the AT^SSPI command. Detailed information on
the AT^SSPI command as well explanations on the protocol and syntax required for data
transmission can be found in [1].
The I2C interface can be powered from an external supply or via the VEXT line of TC63. If
connected to the VEXT line the I2C interface will be properly shut down when the module
enters the Power-down mode. If you prefer to connect the I2C interface to an external power
supply, take care that VCC of the application is in the range of VVEXT and that the interface is
shut down when the PWR_IND signal goes high. See figures below as well as Section 7 and
Figure 38.
In the application I2CDAT and I2CCLK lines need to be connected to a positive supply
voltage via a pull-up resistor.
For electrical characteristics please refer to Table 17.
GSM module
I2CDAT
I2CCLK
GND
I2CDAT
I2CCLK
GND
Application
VCC
R
p
R
p
wVEXT
Figure 15: I2C interface connected to VCC of application
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GSM module
I2CDAT
I2CCLK
GND
I2CDAT
I2CCLK
GND
Application
VEXT
R
p
R
p
Figure 16: I2C interface connected to VEXT line of TC63
Note: Good care should be taken when creating the PCB layout of the host application: The
traces of I2CCLK and I2CDAT should be equal in length and as short as possible.
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3.13 Audio Interfaces
TC63 comprises three audio interfaces available on the board-to-board connector:
• Two analog audio interfaces, both with balanced or single-ended inputs/outputs.
• Serial digital audio interface (DAI) designed for PCM (Pulse Code Modulation).
This means you can connect up to three different audio devices, although only one interface
can be operated at a time. Using the AT^SAIC command you can easily switch back and
forth.
Analog switch
Digital
Audio
Interface
Ai
r
Interface
DSP
MUX
MU
X
D
A
MICN2
MICP2
MICN1
MICP1
USC6
USC5
USC4
USC3
USC2
AGND
USC0
USC1
D
A
EPP2
EPN2
EPP1
EPN1
VMIC
MUX
Figure 17: Audio block diagram
To suit different types of accessories the audio interfaces can be configured for different
audio modes via the AT^SNFS command. The electrical characteristics of the voiceband part
vary with the audio mode. For example, sending and receiving amplification, sidetone paths,
noise suppression etc. depend on the selected mode and can be altered with AT commands
(except for mode 1).
Both analog audio interfaces can be used to connect headsets with microphones or
speakerphones. Headsets can be operated in audio mode 3, speakerphones in audio
mode 2. Audio mode 5 can be used for a speech coder without signal pre or post processing.
When shipped from factory, all audio parameters of TC63 are set to interface 1 and audio
mode 1. This is the default configuration optimized for the Votronic HH-SI-30.3/V1.1/0
handset and used for type approving the Siemens reference configuration. Audio mode 1 has
fix parameters which cannot be modified. To adjust the settings of the Votronic handset
simply change to another audio mode.
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3.13.1 Speech Processing
The speech samples from the ADC or DAI are handled by the DSP of the baseband
controller to calculate e.g. amplifications, sidetone, echo cancellation or noise suppression
depending on the configuration of the active audio mode. These processed samples are
passed to the speech encoder. Received samples from the speech decoder are passed to
the DAC or DAI after post processing (frequency response correction, adding sidetone etc.).
Full rate, half rate, enhanced full rate, adaptive multi rate (AMR), speech and channel
encoding including voice activity detection (VAD) and discontinuous transmission (DTX) and
digital GMSK modulation are also performed on the GSM baseband processor.
3.13.2 Microphone Circuit
TC63 has two identical analog microphone inputs. There is no on-board microphone supply
circuit, except for the internal voltage supply VMIC and the dedicated audio ground line
AGND. Both lines are well suited to feed a balanced audio application or a single-ended
audio application.
The AGND line on the TC63 board is especially provided to achieve best grounding
conditions for your audio application. As there is less current flowing than through other GND
lines of the module or the application, this solution will avoid hum and buzz problems.
3.13.2.1 Single-ended Microphone Input
Figure 18 as well as Figure 38 show an example of how to integrate a single-ended
microphone input.
GSM module
R
B
V
Bias
C
K
AGND
MICNx
MICPx
VMIC
R
A
R
A
C
F
R
VMIC
RA = typ. 2k
RB = typ. 5k
RVMIC = typ. 470Ohm
Ck = typ. 100nF
CF = typ. 22µF
VMIC = typ. 2.5V
Vbias = 1.0V … 1.6V, typ. 1.5V
Figure 18: Single ended microphone input
RA has to be chosen so that the DC voltage across the microphone falls into the bias voltage
range of 1.0V to 1.6V and the microphone feeding current meets its specification.
The MICNx input is automatically self biased to the MICPx DC level. It is AC coupled via CK
to a resistive divider which is used to optimize supply noise cancellation by the differential
microphone amplifier in the module.
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The VMIC voltage should be filtered if gains larger than 20dB are used. The filter can be
attached as a simple first order RC-network (RVMIC and CF).
This circuit is well suited if the distance between microphone and module is kept short. Due
to good grounding the microphone can be easily ESD protected as its housing usually
connects to the negative terminal.
3.13.2.2 Differential Microphone Input
Figure 19 shows a differential solution for connecting an electret microphone.
GSM module
RA
RA
VBias CK
AGND
MICNx
MICPx
VMIC
CF
RVMIC
RA = typ. 1k
RVMIC = 470Ohm
CK = typ. 100nF
CF = typ. 22µF
VMIC = typ. 2.5V
Vbias = 1.0V … 1.6V, typ. 1.5V
Figure 19: Differential microphone input
The resulting DC voltage between MICPx and AGND should be in the range of 1.0V to 1.6V
to bias the input amplifier. MICNx is automatically self biased to the MICPx DC level. The
resulting AC differential voltage is then amplified in the GSM module.
The VMIC voltage should be filtered if gains larger than 20dB are used. The filter can be
attached as a simple first order RC-network (RVMIC and CF).
The advantage of this circuit is that it can be used if the application involves longer lines
between microphone and module.
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3.13.2.3 Line Input Configuration with OpAmp
Figure 20 shows an example of how to connect an opamp into the microphone circuit.
GSM module
R
A
V
Bias
C
K
AGND
MICNx
MICPx
VMIC
R
A
C
K
~
R
VMIC
C
F
RA = typ. 47k
RVMIC = 470Ohm
Ck = typ. 100nF
CF = typ. 22µF
VMIC = typ. 2.5V
Vbias = typ. ½ VMIC = 1.25V
Figure 20: Line input configuration with OpAmp
The AC source (e.g. an opamp) and its reference potential have to be AC coupled to the
MICPx resp. MICNx input terminals. The voltage divider between VMIC and AGND is
necessary to bias the input amplifier. MICNx is automatically self biased to the MICPx DC
level.
The VMIC voltage should be filtered if gains larger than 20dB are used. The filter can be
attached as a simple first order RC-network (RVMIC and CF). If a high input level and a lower
gain are applied the filter is not necessary.
If desired, MICNx via CK can also be connected to the inverse output of the AC source
instead of connecting it to the reference potential for differential line input.
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3.13.3 Loudspeaker Circuit
The GSM module comprises two analog speaker outputs: EP1 and EP2. Output EP1 is able
to drive a load of 8Ohms while the output EP2 can drive a load of 32Ohms. Each interface
can be connected in differential and in single ended configuration. See examples in Figure
21 and Figure 22.
GSM module
AGND
EPNx
EPPx
Figure 21: Differential loudspeaker configuration
Loudspeaker impedance
EPP1/EPN1
ZL = typ. 8Ohm
EPP2/EPN2
ZL = typ. 32Ohm
GSM module
AGND
EPNx
EPPx
+
Ck
Figure 22: Single ended loudspeaker configuration
Loudspeaker impedance
EPP1/EPN1
ZL = typ. 8Ohm
Ck = 220µF
EPP2/EPN2
ZL = typ. 32Ohm
Ck = 47µF
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3.13.4 Digital Audio Interface DAI
The DAI can be used to connect audio devices capable of PCM (Pulse Code Modulation), for
example a codec.
Table 10: Overview of DAI pin functions
Signal name on
B2B connector Function for PCM Interface Input/Output
DAI0 TXDAI O
DAI1 RXDAI I
DAI2 FS (Frame sync) O
DAI3 BITCLK O
DAI4 nc I
DAI5 nc I
DAI6 nc I
To clock input and output PCM samples the PCM interface delivers a bit clock (BITCLK)
which is synchronous to the GSM system clock. The frequency of the bit clock is 128±1kHz.
The frame sync signal (FS) has a frequency of 8kHz and is high for one BITCLK period. The
PCM interface is master for the bit clock and the frame sync signals.
BITCLK
FS
TXDAI
RXDAI
bitclk
frame sync
TX_data
RX_data
Codec
PCM interface of
the GSM module
Figure 23: PCM interface application
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The timing of a PCM short frame is shown in Figure 24. In PCM mode, 16-bit data are
transferred in both directions at the same time. The duration of a frame sync pulse is one
BITCLK period, starting at the rising edge of BITCLK. TXDAI data is shifted out at the next
rising edge of BITCLK. The most significant bit is transferred first. Data transmitted from
RXDAI of the internal application is sampled at the falling edge of BITCLK.
BITCLK
TXDAI
RXDAI
FS
MSB
MSB
LSB
LSB
14 13
14 13
1
1
12
12
2
2
LSB1
1LSB
MSB 14
MSB 14
125µs
Figure 24: PCM timing
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3.14 Control Signals
3.14.1 Synchronization Signal
The synchronization signal serves to indicate growing power consumption during the transmit
burst. The signal is generated by the SYNC pin (pin number 32). Please note that this pin
can adopt three different operating modes which you can select by using the AT^SSYNC
command: the mode AT^SSYNC=0 described below, and the two LED modes AT^SSYNC=1
or AT^SSYNC=2 described in [1] and Section 3.14.2.
The first function (factory default AT^SSYNC=0) is recommended if you want your
application to use the synchronization signal for better power supply control. Your platform
design must be such that the incoming signal accommodates sufficient power supply to the
TC63 module if required. This can be achieved by lowering the current drawn from other
components installed in your application.
The timing of the synchronization signal is shown below. High level of the SYNC pin
indicates increased power consumption during transmission.
Figure 25: SYNC signal during transmit burst
*) The duration of the SYNC signal is always equal, no matter whether the traffic or the
access burst are active.
Transmit burst
1 Tx 577 µs every 4.616 ms
2 Tx 1154 µs every 4.616 ms
SYNC signal
*)
t = 180 sµ
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3.14.2 Using the SYNC Pin to Control a Status LED
As an alternative to generating the synchronization signal, the SYNC pin can be configured
to drive a status LED that indicates different operating modes of the TC63 module. To take
advantage of this function the LED mode must be activated with the AT^SSYNC command
and the LED must be connected to the host application. The connected LED can be operated
in two different display modes (AT^SSYNC=1 or AT^SSYNC=2). For details please refer to
[1].
Especially in the development and test phase of an application, system integrators are
advised to use the LED mode of the SYNC pin in order to evaluate their product design and
identify the source of errors.
To operate the LED a buffer, e.g. a transistor or gate,
must be included in your application. A sample circuit
is shown in Figure 26. Power consumption in the LED
mode is the same as for the synchronization signal
mode. For details see Table 17, SYNC pin.
Figure 26: LED Circuit (Example)
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4 Antenna Interface
The RF interface has an impedance of 50. TC63 is capable of sustaining a total mismatch
at the antenna connector or pad without any damage, even when transmitting at maximum
RF power.
The external antenna must be matched properly to achieve best performance regarding
radiated power, DC-power consumption, modulation accuracy and harmonic suppression.
Antenna matching networks are not included on the TC63 PCB and should be placed in the
host application.
Regarding the return loss TC63 provides the following values in the active band:
Table 11: Return loss in the active band
State of module Return loss of module Recommended return loss of application
Receive > 8dB > 12dB
Transmit not applicable > 12dB
The connection of the antenna or other equipment must be decoupled from DC voltage. This
is necessary because the antenna connector is DC coupled to ground via an inductor for
ESD protection.
4.1 Antenna Installation
To suit the physical design of individual applications TC63 offers two alternative approaches
to connecting the antenna:
• Recommended approach: U.FL-R-SMT antenna connector from Hirose assembled on
the component side of the PCB (top view on TC63). See Section 4.3 for details.
• Antenna pad and grounding plane placed on the bottom side. See Section 4.2.
The U.FL-R-SMT connector has been chosen as antenna reference point (ARP) for the
Siemens reference equipment submitted to type approve TC63. All RF data specified
throughout this manual are related to the ARP. For compliance with the test results of the
Siemens type approval you are advised to give priority to the connector, rather than using the
antenna pad.
IMPORTANT: Both solutions can only be applied alternatively. This means, whenever an
antenna is plugged to the Hirose connector, the pad must not be used. Vice versa, if the
antenna is connected to the pad, then the Hirose connector must be left empty.
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Module
A
ntenna
50Ohm
50Ohm
U.FL
PAD
Z
Module Antenna or
measurement
equipment
50Ohm 50Ohm
U.FL
Z
PAD
Antenna connected to Hirose connector:
Antenna connected to pad:
Figure 27: Never use antenna connector and antenna pad at the same time
No matter which option you choose, ensure that the antenna pad does not come into contact
with the holding device or any other components of the host application. It needs to be
surrounded by a restricted area filled with air, which must also be reserved 0.8mm in height.
PCB
U.FL antenna connector
RF section
A
ntenna pad Restricted area
Figure 28: Restricted area around antenna pad
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4.2 Antenna Pad
The antenna can be soldered to the pad, or attached via contact springs. For proper
grounding connect the antenna to the ground plane on the bottom of TC63 which must be
connected to the ground plane of the application.
When you decide to use the antenna pad take into account that the pad has not been
intended as antenna reference point (ARP) for the Siemens TC63 type approval. The
antenna pad is provided only as an alternative option which can be used, for example, if the
recommended Hirose connection does not fit into your antenna design.
Also, consider that according to the GSM recommendations TS 45.005 and TS 51.010-01 a
50 connector is mandatory for type approval measurements. This requires GSM devices
with an integral antenna to be temporarily equipped with a suitable connector or a low loss
RF cable with adapter.
Notes on soldering:
• To prevent damage to the module and to obtain long-term solder joint properties you are
advised to maintain the standards of good engineering practice for soldering.
• Be sure to solder the antenna core to the pad and the shielding of the coax cable to the
ground plane of the module next to the antenna pad. The direction of the cable is not
relevant from the electrical point of view.
TC63 material properties:
TC63 PCB: FR4
Antenna pad: Gold plated pad
4.2.1 Suitable Cable Types
For direct solder attachment, we suggest to use the following cable types:
• RG316/U 50Ohm coaxial cable
• 1671A 50Ohm coaxial cable
Suitable cables are offered, for example, by IMS Connector Systems. For further details and
other cable types please contact http://www.imscs.com.
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4.3 Antenna Connector
TC63 uses an ultra-miniature SMT antenna connector supplied
from Hirose Ltd. The product name is:
U.FL-R-SMT
The position of the antenna connector on the TC63 board can be
seen in Figure 35.
Figure 29: Mechanical dimensions of U.FL-R-SMT connector
Table 12: Product specifications of U.FL-R-SMT connector
Item Specification Conditions
Ratings
Nominal impedance 50Ω
Rated frequency DC to 3GHz
Operating temp:-40°C to + 90°C
Operating humidity: max. 90%
Mechanical characteristics
Female contact holding
force
0.15N min Measured with a ∅ 0.475 pin
gauge
Repetitive operation Contact resistance:
Center 25mΩ
Outside 15mΩ
30 cycles of insertion and
disengagement
Vibration No momentary disconnections of
1µs;
No damage, cracks and looseness
of parts
Frequency of 10 to 100Hz, single
amplitude of 1.5mm, acceleration
of 59m/s2, for 5 cycles in the
direction of each of the 3 axes
Shock No momentary disconnections of
1µs.
No damage, cracks and looseness
of parts.
Acceleration of 735m/s2, 11ms
duration for 6 cycles in the
direction of each of the 3 axes
Environmental characteristics
Humidity resistance No damage, cracks and looseness
of parts.
Insulation resistance:
100MΩ min. at high humidity
500MΩ min. when dry
Exposure to 40°C, humidity of
95% for a total of 96 hours
Temperature cycle No damage, cracks and looseness
of parts.
Contact resistance:
Center 25mΩ
Outside 15mΩ
Temperature: +40°C → 5 to 35°C
→ +90°C → 5 to 35°C
Time: 30min → within 5min →
30min within 5min
Salt spray test No excessive corrosion 48 hours continuous exposure to
5% salt water
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Table 13: Material and finish of U.FL-R-SMT connector and recommended plugs
Part Material Finish
Shell Phosphor bronze Silver plating
Male center contact Brass Gold plating
Female center contact Phosphor bronze Gold plating
Insulator Plug: PBT
Receptacle: LCP
Black
Beige
Mating plugs and cables can be chosen from the Hirose U.FL Series. Examples are shown
below and listed in Table 14. For latest product information please contact your Hirose dealer
or visit the Hirose home page, for example http://www.hirose.com.
Figure 30: U.FL-R-SMT connector with U.FL-LP-040 plug
Figure 31: U.FL-R-SMT connector with U.FL-LP-066 plug
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In addition to the connectors illustrated above, the U.FL-LP-(V)-040(01) version is offered as
an extremely space saving solution. This plug is intended for use with extra fine cable (up to
∅ 0.81mm) and minimizes the mating height to 2mm. See Figure 32 which shows the Hirose
datasheet.
Figure 32: Specifications of U.FL-LP-(V)-040(01) plug
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Table 14: Ordering information for Hirose U.FL Series
Item Part number HRS number
Connector on TC63 U.FL-R-SMT CL331-0471-0-10
Right-angle plug shell for
∅ 0.81mm cable
U.FL-LP-040 CL331-0451-2
Right-angle plug for
∅ 0.81mm cable
U.FL-LP(V)-040 (01) CL331-053-8-01
Right-angle plug for
∅ 1.13mm cable
U.FL-LP-068 CL331-0452-5
Right-angle plug for
∅ 1.32mm cable
U.FL-LP-066 CL331-0452-5
Extraction jig E.FL-LP-N CL331-04441-9
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5 Electrical, Reliability and Radio Characteristics
5.1 Absolute Maximum Ratings
The absolute maximum ratings stated in Table 15 are stress ratings under non-operating
conditions. Stresses beyond any of these limits will cause permanent damage to TC63.
Table 15: Absolute maximum ratings under non-operating conditions
Parameter Min Max Unit
Supply voltage BATT+ -0.3 5.5 V
Voltage at digital pins -0.3 3.05 V
Voltage at analog pins -0.3 3.0 V
Voltage at VCHARGE pin -0.3 5.5 V
Voltage at CHARGEGATE pin -0.3 5.5 V
VUSB_IN -0.3 5.5
V
VSENSE 5.5
V
ISENSE 5.5
V
5.2 Operating Temperatures
Test conditions were specified in accordance with IEC 60068-2 (still air). The values stated
below are in compliance with GSM recommendation TS 51.010-01.
Table 16: Operating temperatures
Parameter Min Typ Max Unit
Ambient temperature (according to GSM 11.10) -30 +25 +65*) °C
Automatic shutdown
TC63 board temperature
Battery temperature
-30
-20
---
---
+90*)
+60
°C
Ambient temperature for charging (software controlled fast
charging)
0 --- +45 °C
Due to temperature measurement uncertainty, a tolerance on these switching off thresholds
may occur. The possible deviation is in a range of:
• ± 3°C at the overtemperature limit
• ± 5°C at the undertemperature limit
*) On TC63 the automatic overtemperature shutdown threshold is set to 90°C board
temperature. This prevents permanent damage to components on the board. Consider the
ratio of output power, supply voltage and operating temperature: to achieve Tamb max = 65°C in
GPRS Class 8 (GSM900/ GSM850) with 2W RF power the supply voltage must not be higher
than 4.2V.
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5.3 Pin Assignment and Signal Description
The Molex board-to-board connector on TC63 is an 80-pin double-row receptacle. The
names and the positions of the pins can be seen from Figure 1 which shows the top view of
TC63.
1 GND GND 80
2 nc Do not use 79
3 nc PWR_IND 78
4 GND Do not use 77
5 Do not use Do not use 76
6 Do not use Do not use 75
7 Do not use nc 74
8 nc nc 73
9 nc nc 72
10 nc nc 71
11 I2CCLK I2CDAT 70
12 VUSB_IN USB_DP 69
13 DAI5 USB_DN 68
14 ISENSE VSENSE 67
15 DAI6 VMIC 66
16 CCCLK EPN2 65
17 CCVCC EPP2 64
18 CCIO EPP1 63
19 CCRST EPN1 62
20 CCIN MICN2 61
21 CCGND MICP2 60
22 DAI4 MICP1 59
23 DAI3 MICN1 58
24 DAI2 AGND 57
25 DAI1 IGT 56
26 DAI0 EMERG_RST 55
27 BATT_TEMP DCD0 54
28 SYNC CTS1 53
29 RXD1 CTS0 52
30 RXD0 RTS1 51
31 TXD1 DTR0 50
32 TXD0 RTS0 49
33 VDDLP DSR0 48
34 VCHARGE RING0 47
35 CHARGEGATE VEXT 46
36 GND BATT+ 45
37 GND BATT+ 44
38 GND BATT+ 43
39 GND BATT+ 42
40 GND BATT+ 41
Figure 33: Pin assignment (component side of TC63)
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Please note that the reference voltages listed in Table 17 are the values measured directly
on the TC63 module. They do not apply to the accessories connected.
Table 17: Signal description
Function Signal name IO Signal form and level Comment
VImax = 4.5V
VItyp = 3.8V
VImin = 3.2V during Tx burst on board
I 2A, during Tx burst
Power
supply
BATT+ I
n Tx = n x 577µs peak current every
4.616ms
Five pins of BATT+ and GND
must be connected in parallel
for supply purposes because
higher peak currents may
occur.
Minimum voltage must not fall
below 3.2V including drop,
ripple, spikes.
Power
supply
GND Ground Application Ground
VCHARGE I
VImin = 1.015 * VBATT+
VImax = 5.45V
This line signalizes to the
processor that the charger is
connected.
If unused keep pin open.
BATT_TEMP I
Connect NTC with RNTC 10kΩ @ 25°C to
ground. See Section 3.5.3 for B value of
NTC.
Battery temperature
measurement via NTC
resistance.
NTC should be installed
inside or near battery pack to
enable proper charging and
deliver temperature values.
If unused keep pin open.
ISENSE I
VImax = 4.65V
∆VImax to VBATT+ = +0.3V at normal
condition
ISENSE is required for
measuring the charge current.
For this purpose, a shunt
resistor for current
measurement needs to be
connected between ISENSE
and VSENSE.
If unused connect pin to
VSENSE.
VSENSE I
VImax = 4.5V VSENSE must be directly
connected to BATT+ at
battery connector or external
power supply.
Charge
Interface
CHARGEGATE O VOmax = 5.5V
IOmax = 1mA
Control line to the gate of
charge FET
If unused keep pin open.
External
supply
voltage
VEXT O
Normal mode:
VOmin = 2.75V
VOtyp = 2.93V
VOmax = 3.05V
IOmax = -50mA
VEXT may be used for
application circuits, for
example to supply power for
an I2C interface
If unused keep pin open.
Not available in Power-down
mode. The external digital
logic must not cause any
spikes or glitches on voltage
VEXT.
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Function Signal name IO Signal form and level Comment
Power
indicator
PWR_IND O VIHmax = 10V
VOLmax = 0.4V at Imax = 2mA
PWR_IND (Power Indicator)
notifies the module’s on/off
state.
PWR_IND is an open
collector that needs to be
connected to an external pull-
up resistor. Low state of the
open collector indicates that
the module is on. Vice versa,
high level notifies the Power-
down mode.
Therefore, the pin may be
used to enable external
voltage regulators which
supply an external logic for
communication with the
module, e.g. level converters.
Ignition IGT I
RI 30kΩ, CI 10nF
VILmax = 0.8V at Imax = -150µA
VOHmax = 4.5V (VBATT+)
ON ~~~|____|~~~ Active Low ≥ 400ms
This signal switches the
mobile on.
This line must be driven low
by an open drain or open
collector driver.
Emergency
reset
EMERG_RST I
RI 5kΩ
VILmax = 0.2V at Imax = -0.5mA
VOHmin = 1.75V
VOHmax = 3.05V
Signal ~~~|______|~~~ Pull down ≥ 10ms
Reset or turn-off in case of
emergency: Pull down and
release EMERG_RST. Then,
activating IGT for 400ms will
reset TC63. If IGT is not
activated for 400ms, TC63
switches off.
Data stored in the volatile
memory will be lost. For
orderly software controlled
reset rather use the
AT+CFUN command (e.g.
AT+CFUN=,1).
This line must be driven by
open drain or open collector.
If unused keep pin open.
VOLmax = 0.3V at I = 0.1mA
VOHmin = 2.3V at I = -0.1mA
VOHmax = 0.05V
Synchroni-
zation
SYNC O
n Tx = n x 577µs impulse each 4.616ms,
with ___µs forward time.
There are two alternative
options for using the SYNC
pin:
a) Indicating increased
current consumption during
uplink transmission burst.
Note that the timing of the
signal is different during
handover.
b) Driving a status LED to
indicate different operating
modes of TC63. The LED
must be installed in the host
application.
If unused keep pin open.
RTC backup VDDLP I/O RI 1k
VOmax = 4.5V
VBATT+ = 4.3V:
VO = 3.2V at IO = -500µA
VBATT+ = 0V:
VI = 2.7V…4.5V at Imax= 15µA
If unused keep pin open.
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Function Signal name IO Signal form and level Comment
CCIN I
RI 100kΩ
VILmax = 0.6V at I = -25µA
VIHmin = 2.1V at I = -10µA
VOmax= 3.05V
CCRST O
RO 47Ω
VOLmax = 0.25V at I = +1mA
VOHmin = 2.5V at I = -0.5mA
VOHmax = 2.95V
CCIO I/O
RI 4.7kΩ
VILmax = 0.75V
VILmin = -0.3V
VIHmin = 2.1V
VIHmax = CCVCCmin + 0.3V = 3.05V
RO 100Ω
VOLmax = 0.3V at I = +1mA
VOHmin = 2.5V at I = -0.5mA
VOHmax = 2.95V
CCCLK O
RO 100Ω
VOLmax = 0.3V at I = +1mA
VOHmin = 2.5V at I = -0.5mA
VOHmax = 2.95V
CCVCC O VOmin = 2.75V
VOtyp = 2.85V
VOmax = 2.95V
IOmax = -20mA
SIM interface
specified for
use with 3V
SIM card
CCGND Ground
CCIN = Low, SIM card holder
closed
Maximum cable length or
copper track 100mm to SIM
card holder.
All signals of SIM interface
are protected against ESD
with a special diode array.
Usage of CCGND is
mandatory.
CCIN I
RI 100kΩ
VILmax = 0.6V at I = -25µA
VIHmin = 2.1V at I = -10µA
VOmax= 3.05V
CCRST O
RO 47Ω
VOLmax = 0.25V at I = +1mA
VOHmin = 1.45V at I = -0.5mA
VOHmax = 1.90V
CCIO I/O
RI 4.7kΩ
VILmax = 0.45V
VIHmin = 1.35V
VIHmax = CCVCCmin + 0.3V = 2.00V
RO 100Ω
VOLmax = 0.3V at I = +1mA
VOHmin = 1.45V at I = -0.5mA
VOHmax = 1.90V
CCCLK O
RO 100Ω
VOLmax = 0.3V at I = +1mA
VOHmin = 1.45V at I = -0.5mA
VOHmax = 1.90V
CCVCC O VOmin = 1.70V,
VOtyp = 1.80V
VOmax = 1.90V
IOmax = -20mA
SIM interface
specified for
use with
1.8V SIM
card
CCGND Ground
CCIN = Low, SIM card holder
closed
Maximum cable length or
copper track 100mm to SIM
card holder.
All signals of SIM interface
are protected against ESD
with a special diode array.
Usage of CCGND is
mandatory.
ASC0
Serial
interface
RXD0
TXD0
CTS0
RTS0
DTR0
DCD0
DSR0
RING0
O
I
O
I
I
O
O
O
VOLmax = 0.2V at I = 2mA
VOHmin = 2.55V at I = -0.5mA
VOHmax = 3.05V
VILmax = 0.8V
VIHmin = 2.0V
VIHmax = VEXTmin + 0.3V = 3.05V
Serial interface for AT
commands or data stream.
If lines are unused keep pins
open.
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Function Signal name IO Signal form and level Comment
ASC1
Serial
interface
RXD1
TXD1
CTS1
RTS1
O
I
O
I
VOLmax = 0.2V at I = 2mA
VOHmin = 2.55V at I = -0.5mA
VOHmax = 3.05V
VILmax = 0.8V
VIHmin = 2.0V
VIHmax = VEXTmin + 0.3V = 3.05V
Serial interface for AT
commands or data stream.
If lines are unused keep pins
open.
I2CCLK O VOLmax = 0.2V at I = 2mA
VOHmin = 2.55V at I = -0.5mA
VOHmax = 3.05V
I2C interface
I2CDAT I/O VOLmax = 0.2V at I = 2mA
VILmax = 0.8V
VIHmin = 2.0V
VIHmax = VEXTmin + 0.3V = 3.05V
I2CDAT is configured as
Open Drain and needs a pull-
up resistor in the host
application.
According to the I2C Bus
Specification Version 2.1 for
the fast mode a rise time of
max. 300ns is permitted.
There is also a maximum
VOL=0.4V at 3mA specified.
The value of the pull-up
depends on the capacitive
load of the whole system (I2C
Slave + lines). The maximum
sink current of I2CDAT and
I2CCLK is 4mA.
If lines are unused keep pins
open.
VUSB_IN I VINmin = 4.0V
VINmax = 5.25V
USB_DN I/O
USB
USB_DP I/O
Differential Output Crossover voltage
Range
VCRSmin = 1.5V, VCRSmax = 2.0V
Driver Output Resistance
ZDRVtyp = 32Ohm
If lines are unused keep pins
open.
DAI0 O
DAI1 I
DAI2 O
DAI3 O
DAI4 I
DAI5 I
Digital Audio
interface
DAI6 I
VOLmax = 0.2V at I = 2mA
VOHmin = 2.55V at I = -0.5mA
VOHmax = 3.05V
VILmax = 0.8V
VIHmin = 2.0V
VIHmax = VEXTmin + 0.3V = 3.05V
See Table 10 for details.
If unused keep pins open.
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Function Signal name IO Signal form and level Comment
VMIC O VOmin = 2.4V
VOtyp = 2.5V
VOmax = 2.6V
Imax = 2mA
Microphone supply for
customer feeding circuits
EPP2 O
EPN2 O
1.0954Vpp (differential) typical
3.4Vpp differential maximal
Audio mode TBD
Measurement conditions TBD
Minimum differential resp. single ended
load 27Ohms
The audio output can directly
operate a 32-Ohm-
loudspeaker.
If unused keep pins open.
EPP1 O
EPN1 O
1.0954Vpp (differential) typical
6.0Vp-p differential maximal
Audio mode TBD
Measurement conditions TBD
Minimum differential resp. single ended
load 7.5Ohms
The audio output can directly
operate an 8-Ohm-
loudspeaker.
If unused keep pins open.
MICP1 I
MICN1 I
MICP2 I
MICN2 I
Full Scale Input Voltage 1.578Vpp
0dBm0 Input Voltage 1.0954Vpp
At MICNx, apply external bias from 1.0V to
1.6V.
Audio mode TBD
Measurement conditions TBD
Balanced or single ended
microphone or line inputs with
external feeding circuit (using
VMIC and AGND).
If unused keep pins open.
Analog
Audio
interface
AGND Analog Ground GND level for external audio
circuits
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5.4 Power Supply Ratings
Table 18: Power supply ratings
Parameter Description Conditions Min Typ Max Unit
Supply voltage Directly measured at reference points
BATT+ and GND, see chapter 3.2.2
Voltage must stay within the min/max
values, including voltage drop, ripple,
spikes.
3.2 3.8 4.5 V
Voltage drop during
transmit burst
Normal condition, power control level
for Pout max
400 mV
BATT+
Voltage ripple Normal condition, power control level
for Pout max
@ f<200kHz
@ f>200kHz
50
2
mV
mV
IVDDLP RTC Backup @ BATT+ = 0V 25 µA OFF State
supply current POWER DOWN mode 1) 50 100 µA
SLEEP mode @ DRX = 9 TBD mA
SLEEP mode @ DRX = 5 TBD mA
SLEEP mode @ DRX = 2 TBD mA
IBATT+
Average standby
supply current2)
IDLE mode @ DRX = 2 TBD mA
1) Measured after module INIT (switch ON the module and following switch OFF);
applied voltage on BATT+ (w/o INIT) show increased POWER DOWN supply current.
2) Additional conditions:
SLEEP mode measurements started 3 minutes after switch ON the module
Averaging times: SLEEP mode - 3 minutes; IDLE mode - 1.5 minutes
Communication tester settings: no neighbor cells, no cell reselection etc.
USB interface disabled
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Table 19: Current consumption during Tx burst for GSM 850MHz and GSM 900MHz
Mode GSM call GPRS Class 8 GPRS Class10 GPRS Class 12
Timeslot configuration 1Tx / 1Rx 1Tx / 4Rx 2Tx / 3Rx 4Tx / 1Rx
Maximum possible power
(RF power nominal)
2W
(33dBm)
2W
(33dBm)
2W
(33dBm)
1W
(30dBm)
1W
(30dBm)
0.5W
(27dBm)
Radio output power
reduction with AT^SCFG,
parameter <ropr>
<ropr> = 1 ... 3
<ropr> = 1 ... 3
<ropr> = 1
<ropr> = 2 or 3
<ropr> = 1
<ropr> = 2 or 3
Current characteristics
Burst current
@ 50 antenna (typ.)
2.0A 2.0A 2.0A 1.5A 1.5A 1.3A
Burst current
@ total mismatch
3.2A 3.2A 3.2A 2.3A 2.3A 1.9A
Average current
@ 50 antenna (typ.)
335mA 385mA 610mA 485mA 810mA 710mA
Average current
@ total mismatch
485mA 535mA 910mA 685mA 1210mA 1010mA
AT parameters are given in brackets <...> and marked italic.
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Table 20: Current consumption during Tx burst for GSM 1800MHz and GSM 1900MHz
Mode GSM call GPRS Class 8 GPRS Class10 GPRS Class 12
Timeslot configuration 1Tx / 1Rx 1Tx / 4Rx 2Tx / 3Rx 4Tx / 1Rx
Maximum possible power
(RF power nominal)
1W
(30dBm)
1W
(30dBm)
1W
(30dBm)
0.5W
(27dBm)
0.5W
(27dBm)
0.25W
(24dBm)
Radio output power
reduction with AT^SCFG,
parameter <ropr>
<ropr> = 1 ... 3
<ropr> = 1 ... 3
<ropr> = 1
<ropr> = 2 or 3
<ropr> = 1
<ropr> = 2 or 3
Current characteristics
Burst current
@ 50 antenna (typ.)
1.6A 1.6A 1.6A 1.4A 1.4A 1.2A
Burst current
@ total mismatch
2.1A 2.1A 2.1A 1.75A 1.75A 1.5A
Average current
@ 50 antenna (typ.)
285mA 335mA 510mA 460mA 760mA 660mA
Average current
@ total mismatch
350mA 400mA 635mA 550mA 940mA 810mA
AT parameters are given in brackets <...> and marked italic.
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5.5 Electrostatic Discharge
The GSM engine is not protected against Electrostatic Discharge (ESD) in general.
Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive
components. Proper ESD handling and packaging procedures must be applied throughout
the processing, handling and operation of any application that incorporates a TC63 module.
Special ESD protection provided on TC63:
Antenna interface: one spark discharge line (spark gap)
SIM interface: clamp diodes for protection against overvoltage.
The remaining ports of TC63 are not accessible to the user of the final product (since they
are installed within the device) and therefore, are only protected according to the “Human
Body Model” requirements.
TC63 has been tested according to the EN 61000-4-2 standard. The measured values can
be gathered from the following table.
Table 21: Measured electrostatic values
Specification / Requirements Contact discharge Air discharge
ETSI EN 301 489-7
ESD at SIM port ± 4kV ± 8kV
ESD at antenna port ± 4kV ± 8kV
Human Body Model (Test conditions: 1.5kΩ, 100pF)
ESD at USB interface ± 1kV ± 1kV
ESD at all other interfaces ± 1kV ± 1kV
Note: Please note that the values may vary with the individual application design. For
example, it matters whether or not the application platform is grounded over external
devices like a computer or other equipment, such as the Siemens reference
application described in Chapter 8.
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5.6 Reliability Characteristics
The test conditions stated below are an extract of the complete test specifications.
Table 22: Summary of reliability test conditions
Type of test Conditions Standard
Vibration Frequency range: 10-20Hz; acceleration: 3.1mm
amplitude
Frequency range: 20-500Hz; acceleration: 5g
Duration: 2h per axis = 10 cycles; 3 axes
DIN IEC 68-2-6
Shock half-sinus Acceleration: 500g
Shock duration: 1msec
1 shock per axis
6 positions (± x, y and z)
DIN IEC 68-2-27
Dry heat Temperature: +70 ±2°C
Test duration: 16h
Humidity in the test chamber: < 50%
EN 60068-2-2 Bb ETS
300019-2-7
Temperature
change (shock)
Low temperature: -40°C ±2°C
High temperature: +85°C ±2°C
Changeover time: < 30s (dual chamber system)
Test duration: 1h
Number of repetitions: 100
DIN IEC 68-2-14 Na
ETS 300019-2-7
Damp heat cyclic High temperature: +55°C ±2°C
Low temperature: +25°C ±2°C
Humidity: 93% ±3%
Number of repetitions: 6
Test duration: 12h + 12h
DIN IEC 68-2-30 Db
ETS 300019-2-5
Cold (constant
exposure)
Temperature: -40 ±2°C
Test duration: 16h
DIN IEC 68-2-1
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6 Mechanics
6.1 Mechanical Dimensions of TC63
Figure 34 shows the top view of TC63 and provides an overview of the board's mechanical
dimensions. For further details see Figure 35.
Figure 34: TC63 – top view
Pin 80
Pin 1
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All dimensions in mm
Figure 35: Dimensions of TC63
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6.2 Mounting TC63 to the Application Platform
There are many ways to properly install TC63 in the host device. An efficient approach is to
mount the TC63 PCB to a frame, plate, rack or chassis.
Fasteners can be M2 screws plus suitable washers, circuit board spacers, or customized
screws, clamps, or brackets. In addition, the board-to-board connection can also be utilized
to achieve better support. To help you find appropriate spacers a list of selected screws and
distance sleeves for 3mm stacking height can be found in Section 9.2.
When using the two small holes take care that the screws are inserted with the screw head
on the bottom of the TC63 PCB. Screws for the large holes can be inserted from top or
bottom.
For proper grounding it is strongly recommended to use large ground plane on the bottom of
board in addition to the five GND pins of the board-to-board connector. The ground plane
may also be used to attach cooling elements, e.g. a heat sink or thermally conductive tape.
To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it
is positioned flat against the host device.
All the information you need to install an antenna is summarized in Chapter 4. Note that the
antenna pad on the bottom of the TC63 PCB must not be influenced by any other PCBs,
components or by the housing of the host device. It needs to be surrounded by a restricted
space as described in Section 4.1.
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6.3 Board-to-Board Application Connector
This section provides the specifications of the 80-pin board-to-board connector used to
connect TC63 to the external application.
Connector mounted on the TC63 module:
Type: 52991-0808 SlimStack Receptacle
80 pins, 0.50mm pitch,
for stacking heights from 3.0 to 4.0mm,
see Figure 36 for details.
Supplier: Molex
www.molex.com
Table 23: Technical specifications of Molex board-to-board connector
Parameter Specification (80-pin B2B connector)
Electrical
Number of Contacts 80
Contact spacing 0.5mm (.020")
Voltage 50V
Rated current 0.5A max per contact
Contact resistance 50m max per contact
Insulation resistance > 100M
Dielectric Withstanding Voltage 500V AC (for 1 minute)
Physical
Insulator material (housing) White glass-filled LCP plastic, flammability UL 94V 0
Contact material Plating: Gold over nickel
Insertion force 1st < 74.4N
Insertion force 30th < 65.6N
Withdrawal force 1st > 10.8N
Maximum connection cycles 30 (@ 70m max per contact)
Mating connector types for the customer's application
offered by Molex:
• 53748-0808 SlimStack Plug, 3mm stacking height,
see Figure 37 for details.
• 53916-0808 SlimStack Plug, 4mm stacking height
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Figure 36: Molex board-to-board connector 52991-0808 on TC63
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Figure 37: Mating board-to-board connector 53748-0808 on application
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7 Sample Application
Figure 38 shows a typical example of how to integrate a TC63 module into the GSM part of a
mobile application. Usage of the various host interfaces depends on the desired features of
the application.
Audio interface 1 demonstrates the balanced connection of microphone and earpiece. This
solution is particularly well suited for internal transducers. Audio interface 2 uses an
unbalanced microphone and earpiece connection typically found in headset applications.
The charging circuit is optimized for the charging stages (trickle charging and software
controlled charging) as well as the battery and charger specifications described in Section
3.5.
The PWR_IND line is an open collector that needs an external pull-up resistor which
connects to the voltage supply VCC µC of the microcontroller. Low state of the open collector
pulls the PWR_IND signal low and indicates that the TC63 module is active, high level
notifies the Power-down mode.
If the module is in Power-down mode avoid current flowing from any other source into the
module circuit, for example reverse current from high state external control lines. Therefore,
the controlling application must be designed to prevent reverse flow.
The internal pull-up resistors (Rp) of the I2C interface can be connected to an external power
supply or to the VEXT line of TC63. The advantage of this solution is that when the module
enters the Power-down mode, the I2C interface is shut down as well. If you prefer to connect
an I2C interface to an external power supply, take care that the interface is shut down when
the PWR_IND signal goes high in Power-down mode.
The EMC measures are best practice recommendations. In fact, an adequate EMC strategy
for an individual application is very much determined by the overall layout and, especially,
the position of components. For example, mounting the internal acoustic transducers directly
on the PCB eliminates the need to use the ferrite beads shown in the sample schematic.
However, when connecting cables to the module’s interfaces it is strongly recommended to
add appropriate ferrite beads for reducing RF radiation.
Disclaimer
No warranty, either stated or implied, is provided on the sample schematic diagram shown in
Figure 38 and the information detailed in this section. As functionality and compliance with
national regulations depend to a great amount on the used electronic components and the
individual application layout manufacturers are required to ensure adequate design and
operating safeguards for their products using TC63 modules.
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Rechargeable
Lithium battery
Charger
ESD
protection
NTC
2.7k
SI3441DV
0.3R
47k
100k
VCC µC
47k
EMERG_RST
PWR_IND
IGT
BATT+
VCHARGE
BATTEMP
VSENSE
ISENSE
CHARGEGATE
CCGND
CCCLK
CCIO
CCRST
CCIN
CCVCC
200nF
SIM
VMIC (2.5V)
GND
AGND
MICP1
MICP2
EPN1
EPP1
EPP2
EPN2
TC63
MICN1
MICN2
1k
1k
2.2k2.2k
5.6k
100nF
100nF
22µF
Digital Audio
7
100µF
BC847
BC847
VEXT (2.9V)
SYNC
>8R
>32R
*)
depends on final specification
CRS04
All SIM components shall be close to card holder.
1nF 27pF
0R (not mounted)
V 5.2V 0.2V
ch ar ge
+
Serial Interface
ASC0
Serial Interface
ASC1
USB
(Slave)
*)
TC63 Application
(Draft)
*)
8
3
4
*)
I2C 2
2 x R
P
470R
Figure 38: TC63 sample application (draft)
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8 Reference Approval
8.1 Reference Equipment for Type Approval
The Siemens reference setup submitted to type approve TC63 consists of the following
components:
• Siemens TC63 cellular engine
• Development Support Box DSB75
• SIM card reader integrated on DSB75
• U.FL-R-SMT antenna connector and U.FL-LP antenna cable
• Handset type Votronic HH-SI-30.3/V1.1/0
• Li-Ion battery
• PC as MMI
PC
Power supply
SIM
RS-232 DSB75
Handset
Li-Ion
battery
GSM module
Flex cable
100mm
Antenna or 50 Ω
cable to system
simulator
Antenna
Figure 39: Reference equipment for Type Approval
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8.2 Compliance with FCC Rules and Regulations
The FCC Equipment Authorization Certification for the TC63 reference application described
in Section 8.1 is listed under the
FCC identifier QIPTC63
IC: 267W-TC63
granted to Siemens AG.
The TC63 reference application registered under the above identifier is certified to be in
accordance with the following Rules and Regulations of the Federal Communications
Commission (FCC).
Power listed is ERP for Part 22 and EIRP for Part 24
“This device contains GSM and GPRS Class12 functions in the 900 and 1800MHz
Band which are not operational in U.S. Territories.
This device is to be used only for mobile and fixed applications. The antenna(s) used
for this transmitter must be installed to provide a separation distance of at least 20cm
from all persons and must not be co-located or operating in conjunction with any other
antenna or transmitter. Users and installers must be provided with antenna installation
instructions and transmitter operating conditions for satisfying RF exposure com-
pliance. Antennas used for this OEM module must not exceed 8.4dBi gain (GSM 1900)
and 2.9dBi (GSM 850) for mobile and fixed operating configurations. This device is
approved as a module to be installed in other devices.”
The FCC label of the module must be visible from the outside. If not, the host device is
required to bear a second label stating, “Contains FCC ID QIPTC63”.
IMPORTANT: Manufacturers of mobile or fixed devices incorporating TC63 modules are
advised to
• clarify any regulatory questions,
• have their completed product tested,
• have product approved for FCC compliance, and
• include instructions according to above mentioned RF exposure statements in end
product user manual.
Please note that changes or modifications not expressly approved by the party responsible
for compliance could void the user’s authority to operate the equipment.
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9 Appendix
9.1 List of Parts and Accessories
Table 24: List of parts and accessories
Description Supplier Ordering information
TC63 Siemens Siemens ordering number: L36880-N8160-A100
Siemens Car Kit Portable Siemens Siemens ordering number: L36880-N3015-A117
DSB75 Support Box Siemens Siemens ordering number: L36880-N8811-A100
Votronic Handset VOTRONIC Votronic HH-SI-30.3/V1.1/0
VOTRONIC
Entwicklungs- und Produktionsgesellschaft für
elektronische Geräte mbH
Saarbrücker Str. 8
66386 St. Ingbert
Germany
Phone: +49-(0)6 89 4 / 92 55-0
Fax: +49-(0)6 89 4 / 92 55-88
e-mail: contact@votronic.com
SIM card holder incl. push
button ejector and slide-in
tray
Molex Ordering numbers: 91228
91236
Sales contacts are listed in Table 25.
Board-to-board connector Molex Sales contacts are listed in Table 25.
U.FL-R-SMT antenna
connector
Hirose See Section 4.3 for details on U.FL-R-SMT
connector, mating plugs and cables.
Sales contacts are listed in Table 26.
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Table 25: Molex sales contacts (subject to change)
Molex
For further information
please click:
http://www.molex.com/
Molex Deutschland GmbH
Felix-Wankel-Str. 11
4078 Heilbronn-Biberach
Germany
Phone: +49-7066-9555 0
Fax: +49-7066-9555 29
Email: mxgermany@molex.com
American Headquarters
Lisle, Illinois 60532
U.S.A.
Phone: +1-800-78MOLEX
Fax: +1-630-969-1352
Molex China Distributors
Beijing,
Room 1319, Tower B,
COFCO Plaza
No. 8, Jian Guo Men Nei
Street, 100005
Beijing
P.R. China
Phone: +86-10-6526-9628
Phone: +86-10-6526-9728
Phone: +86-10-6526-9731
Fax: +86-10-6526-9730
Molex Singapore Pte. Ltd.
Jurong, Singapore
Phone: +65-268-6868
Fax: +65-265-6044
Molex Japan Co. Ltd.
Yamato, Kanagawa, Japan
Phone: +81-462-65-2324
Fax: +81-462-65-2366
Table 26: Hirose sales contacts (subject to change)
Hirose Ltd.
For further information
please click:
http://www.hirose.com
Hirose Electric (U.S.A.) Inc
2688 Westhills Court
Simi Valley, CA 93065
U.S.A.
Phone: +1-805-522-7958
Fax: +1-805-522-3217
Hirose Electric GmbH
Zeppelinstrasse 42
73760 Ostfildern
Kemnat 4
Germany
Phone: +49-711-4560-021
Fax +49-711-4560-729
E-mail info@hirose.de
Hirose Electric UK, Ltd
Crownhill Business Centre
22 Vincent Avenue,
Crownhill
Milton Keynes, MK8 OAB
Great Britain
Phone: +44-1908-305400
Fax: +44-1908-305401
Hirose Electric Co., Ltd.
5-23, Osaki 5 Chome,
Shinagawa-Ku
Tokyo 141
Japan
Phone: +81-03-3491-9741
Fax: +81-03-3493-2933
Hirose Electric Co., Ltd.
European Branche
First class Building 4F
Beechavenue 46
1119PV Schiphol-Rijk
Netherlands
Phone: +31-20-6557-460
Fax: +31-20-6557-469
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9.2 Fasteners and Fixings for Electronic Equipment
This section provides a list of suppliers and manufacturers offering fasteners and fixings for
electronic equipment and PCB mounting. The content of this section is designed to offer
basic guidance to various mounting solutions with no warranty on the accuracy and
sufficiency of the information supplied. Please note that the list remains preliminary although
it is going to be updated in later versions of this document.
9.2.1 Fasteners from German Supplier ETTINGER GmbH
Sales contact: ETTINGER GmbH
http://www.ettinger.de/main.cfm
Phone: +4981 04 66 23 – 0
Fax: +4981 04 66 23 – 0
The following tables contain only article numbers and basic parameters of the listed
components. For further detail and ordering information please contact Ettinger GmbH.
Please note that some of the listed screws, spacers and nuts are delivered with the DSB75
Support Board. See comments below.
Article number: 05.71.038
Spacer - Aluminum /
Wall thickness = 0.8mm
Length 3.0mm
Material AlMgSi-0,5
For internal diameter M2=2.0-2.3
Internal diameter d = 2.4mm
External diameter 4.0mm
Vogt AG No. x40030080.10
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Article number: 07.51.403
Insulating Spacer for M2
Self-gripping *)
Length 3.0mm
Material Polyamide 6.6
Surface Black
Internal diameter 2.2mm
External diameter 4.0mm
Flammability rating UL94-HB
*) 2 spacers are delivered with DSB75 Support Board
Article number: 05.11.209
Threaded Stud M2.5 - M2 Type E /
External thread at both ends
Length 3.0mm
Material Stainless steel X12CrMoS17
Thread 1 / Length M2.5 / 6.0mm
Thread 2 / Length M2 / 8.0mm
Width across flats 5
Recess yes
Type External / External
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Article number: 01.14.131 Screw M2 *)
DIN 84 - ISO 1207
Length 8.0mm
Material Steel 4.8
Surface Zinced A2K
Thread M2
Head diameter D = 3.8mm
Head height 1.30mm
Type Slotted cheese head screw
*) 2 screws are delivered with DSB75 Support Board
Article number: 01.14.141 Screw M2
DIN 84 - ISO 1207
Length 10.0mm
Material Steel 4.8
Surface Zinced A2K
Thread M2
Head diameter D = 3.8mm
Head height 1.30mm
Type Slotted cheese head screw
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Article number: 02.10.011 Hexagon Nut *)
DIN 934 - ISO 4032
Material Steel 4.8
Surface Zinced A2K
Thread M2
Wrench size / Ø 4
Thickness / L 1.6mm
Type Nut DIN/UNC, DIN934
*) 2 nuts are delivered with DSB75 Support Board
9.3 Data Sheets of Recommended Batteries
The following two data sheets have been provided by VARTA Microbattery GmbH.
Click here for sales contacts and further information: http://www.varta-microbattery.com
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Figure 40: Lithium
Ion battery from
VARTA
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Figure 41: Lithium
Polymer battery
from VARTA