THALES DIS AlS Deutschland XT55 Transmitter module for fixed / mobile applications User Manual xt55 hw interface description

Gemalto M2M GmbH Transmitter module for fixed / mobile applications xt55 hw interface description

Contents

Exhibit 8 User manual

XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 1 of 116 15.03.2004 XT55 Siemens Cellular Engine Version: 00.02 DocID: XT55_hd_v00.02
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 2 of 116 15.03.2004 Document Name: XT55 Hardware Interface Description Version: 00.02 Date: March 15, 2004 DocId: XT55_hd_v00.02 Status: Confidential / Preliminary General note Product is deemed accepted by Recipient and is provided without interface to Recipient´s products. The Product constitutes pre-release version and code and may be changed substantially before commercial release. The Product is provided on an “as is” basis only and may contain deficiencies or inadequacies. The Product is provided without warranty of any kind, express or implied. To the maximum extent permitted by applicable law, Siemens further disclaims all warranties, including without limitation any implied warranties of merchantability, fitness for a particular purpose and noninfringement of third-party rights. The entire risk arising out of the use or performance of the Product and documentation remains with Recipient. This Product is not intended for use in life support appliances, devices or systems where a malfunction of the product can reasonably be expected to result in personal injury. Applications incorporating the described product must be designed to be in accordance with the technical specifications provided in these guidelines. Failure to comply with any of the required procedures can result in malfunctions or serious discrepancies in results. Furthermore, all safety instructions regarding the use of mobile technical systems, including GSM products, which also apply to cellular phones must be followed. Siemens AG customers using or selling this product for use in any applications do so at their own risk and agree to fully indemnify Siemens for any damages resulting from illegal use or resale. To the maximum extent permitted by applicable law, in no event shall Siemens or its suppliers be liable for any consequential, incidental, direct, indirect, punitive or other damages whatsoever (including, without limitation, damages for loss of business profits, business interruption, loss of business information or data, or other pecuniary loss) arising out the use of or inability to use the Product, even if Siemens has been advised of the possibility of such damages. Subject to change without notice at any time. Copyright Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright © Siemens AG 2004
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 3 of 116 15.03.2004 Contents 0 Document history....................................................................................................... 8 1 Introduction ................................................................................................................ 9 1.1 Related documents ............................................................................................. 9 1.2 Terms and abbreviations....................................................................................10 1.3 Type approval ....................................................................................................14 1.4 Safety precautions .............................................................................................16 2 Product concept........................................................................................................18 2.1 XT55 key features at a glance ...........................................................................19 2.2 Circuit concept ...................................................................................................22 3 GSM/GPRS application interface .............................................................................25 3.1 GSM/GPRS operating modes ............................................................................25 3.2 Power supply .....................................................................................................27 3.2.1 Power supply pins on the board-to-board connector.............................27 3.2.2 Minimizing power losses.......................................................................28 3.2.3 Monitoring power supply.......................................................................28 3.3 Power up / down scenarios ................................................................................29 3.3.1 Turn on the GSM/GPRS part of XT55 ..................................................29 3.3.1.1 Turn on the GSM/GPRS part of XT55 using the ignition line GSM_IGT (Power on)...........................................................30 3.3.1.2 Timing of the ignition process ...............................................31 3.3.1.3 Turn on the GSM/GPRS part of XT55 using the GSM_POWER signal ...........................................................32 3.3.1.4 Turn on the GSM/GPRS part of XT55 using the RTC (Alarm mode) ...................................................................................32 3.3.2 Turn off the GSM/GPRS part of XT55 ..................................................34 3.3.2.1 Turn off GSM/GPRS part of the XT55 module using AT command..............................................................................34 3.3.2.2 Maximum number of turn-on / turn-off cycles........................35 3.3.2.3 Emergency shutdown using GSM_EMERGOFF pin .............35 3.3.3 Automatic shutdown .............................................................................36 3.3.3.1 Temperature dependent shutdown .......................................36 3.3.3.2 Temperature control during emergency call..........................37 3.3.3.3 Undervoltage shutdown if battery NTC is present.................37 3.3.3.4 Undervoltage shutdown if no battery NTC is present............38 3.3.3.5 Overvoltage shutdown ..........................................................38 3.4 Automatic GPRS Multislot Class change............................................................39 3.5 GSM charging control ........................................................................................40 3.5.1 Battery pack characteristics..................................................................42 3.5.2 Recommended battery pack specification ............................................43 3.5.3 Implemented charging technique..........................................................44 3.5.4 Operating modes during charging ........................................................45 3.5.5 Charger requirements ..........................................................................46 3.6 Power saving .....................................................................................................47 3.6.1 No power saving (AT+CFUN=1)...........................................................47 3.6.2 NON-CYCLIC SLEEP mode (AT+CFUN=0) .........................................47 3.6.3 CYCLIC SLEEP mode (AT+CFUN=5, 6, 7, 8) ......................................47 3.6.4 CYCLIC SLEEP mode AT+CFUN=9 ....................................................48
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 4 of 116 15.03.2004 3.6.5 Timing of the GSM_CTS signal in CYCLIC SLEEP modes...................48 3.6.6 Wake up XT55 from SLEEP mode .......................................................50 3.7 Summary of state transitions (except SLEEP mode)..........................................52 3.8 RTC backup for GSM/GPRS part of XT55 .........................................................53 3.9 Serial interfaces of the XT55 GSM/GPRS part...................................................54 3.9.1 Features supported on the first serial interface of GSM/GPRS part (ASC0) .................................................................................................54 3.9.2 Features supported on the second serial interface of GSM/GPRS part (ASC1) .................................................................................................55 3.9.3 ASC0 and ASC1 configuration .............................................................55 3.10 Audio interfaces .................................................................................................56 3.10.1 Microphone circuit ................................................................................57 3.10.2 Speech processing ...............................................................................58 3.10.3 DAI timing.............................................................................................58 3.11 SIM interface......................................................................................................60 3.11.1 Requirements for using the GSM_CCIN pin .........................................61 3.11.2 Design considerations for SIM card holder ...........................................62 3.12 Control signals ...................................................................................................63 3.12.1 Inputs ...................................................................................................63 3.12.2 Outputs.................................................................................................64 3.12.2.1 Synchronization signal..........................................................64 3.12.2.2 Using the GSM_SYNC pin to control a status LED...............65 3.12.2.3 Behavior of the GSM_RING0 line (ASC0 interface only) ......66 4 GPS application interface.........................................................................................68 4.1 Theory of operation............................................................................................68 4.2 Technical data....................................................................................................69 4.3 GPS operating modes........................................................................................70 4.3.1 Trickle Power mode..............................................................................71 4.3.2 Comparision of Trickle Power and Push-to Fix mode ...........................72 4.4 Power supply of the XT55 GPS part ..................................................................73 4.5 General purpose input/output.............................................................................73 4.6 Serial interfaces of the XT55 GPS part ..............................................................74 4.7 GPS control signals............................................................................................74 4.8 Receiver architecture .........................................................................................75 4.9 Operation procedure ..........................................................................................76 4.10 Start-up procedures ...........................................................................................77 4.10.1 Coldstart...............................................................................................77 4.10.2 Warmstart ............................................................................................77 4.10.3 Hotstart.................................................................................................77 5 GSM and GPS antenna interfaces............................................................................78 5.1 GSM antenna installation ...................................................................................78 5.1.1 GSM antenna connector.......................................................................78 5.1.2 GSM antenna pad ................................................................................80 5.2 Installing the GPS antenna ................................................................................80 5.3 Hirose antenna connector ..................................................................................81 6 Electrical, reliability and radio characteristics .......................................................85 6.1 Absolute maximum ratings.................................................................................85 6.2 Operating temperatures .....................................................................................85 6.3 Pin description ...................................................................................................86 6.4 Power supply ratings..........................................................................................92 6.5 Current consumption during GSM/GPRS transmit burst ....................................94
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 5 of 116 15.03.2004 6.6 Electrical characteristics of the voiceband part...................................................99 6.6.1 Setting audio parameters by AT commands.........................................99 6.6.2 Audio programming model .................................................................100 6.6.3 Characteristics of audio modes ..........................................................101 6.6.4 Voiceband receive path ......................................................................102 6.6.5 Voiceband transmit path.....................................................................103 6.7 Air interface of the XT55 GSM/GPRS part .......................................................104 6.8 Electrostatic discharge.....................................................................................105 6.9 Reliability characteristics ..................................................................................106 7 Mechanics................................................................................................................107 7.1 Mechanical dimensions of XT55 ......................................................................107 7.2 Mounting XT55 onto the application platform ...................................................109 7.3 Board-to-board connector ................................................................................111 8 Reference approval.................................................................................................113 8.1 Reference equipment for type approval ...........................................................113 8.2 Compliance with FCC Rules and Regulations ..................................................114 9 List of parts and accessories.................................................................................115
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 6 of 116 15.03.2004 Figures Figure 1: Block diagram of serial interface concept..............................................................23 Figure 2: Block diagram of XT55 for SiRF Demo application................................................24 Figure 3: Block diagram of XT55 with AVL or TCP/IP application (optional).........................24 Figure 4: Power supply limits during transmit burst ..............................................................28 Figure 5: Power-on by ignition signal....................................................................................30 Figure 6: Timing of power-on process if GSM_VDDLP is not used ......................................31 Figure 7: Timing of power-on process if GSM_VDDLP is fed from external source..............31 Figure 8: Deactivating GSM engine by GSM_EMERGOFF signal........................................35 Figure 9: Schematic of approved charging transistor, trickle charging and ESD protection..40 Figure 10: Battery pack circuit diagram ................................................................................42 Figure 11: Charging process ................................................................................................44 Figure 12: Timing of CTS signal (example for a 2.12 s paging cycle)...................................49 Figure 13: Beginning of power saving if CFUN=5 or 7..........................................................49 Figure 14: RTC supply from capacitor..................................................................................53 Figure 15: RTC supply from rechargeable battery................................................................53 Figure 16: RTC supply from non-chargeable battery............................................................53 Figure 17: Audio block diagram............................................................................................56 Figure 18: Schematic of microphone inputs .........................................................................57 Figure 19: DAI timing on transmit path .................................................................................59 Figure 20: DAI timing on receive path ..................................................................................59 Figure 21: SIM card holder of DSB45 Support Box ..............................................................62 Figure 22: Pin numbers of Molex SIM card holder on DSB45 Support Box ..........................62 Figure 23: GSM_SYNC signal during transmit burst.............................................................64 Figure 24: LED Circuit (Example).........................................................................................65 Figure 25: Incoming voice call..............................................................................................66 Figure 26: Incoming data call ...............................................................................................66 Figure 27: URC transmission ...............................................................................................66 Figure 28: Theory of operation .............................................................................................68 Figure 29: Example for current in Trickle Power mode.........................................................71 Figure 30: Current comparison between Trickle Power and Push-to Fix mode ....................72 Figure 31: Example of LED circuit ........................................................................................75 Figure 32: Receiver architecture of the GPS receiver...........................................................75 Figure 33: U.FL-R-SMT connector .......................................................................................78 Figure 34: Antenna pad and GND plane ..............................................................................78 Figure 35: Never use antenna connector and antenna pad at the same time.......................79 Figure 36: Restricted area around antenna pad ...................................................................79 Figure 37: GPS antenna connector (U.FL-R-SMT connector) ..............................................80 Figure 38: Mechanical dimensions of U.FL-R-SMT connector..............................................81 Figure 39: U.FL-R-SMT connector with U.FL-LP-040 plug ...................................................82 Figure 40: U.FL-R-SMT connector with U.FL-LP-066 plug ...................................................82 Figure 41: Specifications of U.FL-LP-(V)-040(01) plug.........................................................83 Figure 42: Pin assignment (top view on XT55).....................................................................86 Figure 43: Typical current consumption vs. return loss in EGSM 900 network .....................94 Figure 44: Typical current consumption vs. return loss in GSM 1800 network......................95 Figure 45: Typical current consumption vs. return loss in GSM 1900 network......................95 Figure 46: Peak current consumption during transmit burst in EGSM 900 network ..............96 Figure 47: Peak current consumption during transmit burst in GSM 1800 network ..............96 Figure 48: Peak current consumption during transmit burst in GSM 1900 network ..............97 Figure 49: Typical current consumption vs. return loss.........................................................98 Figure 50: AT audio programming model ...........................................................................100 Figure 51: XT55 – top view ................................................................................................107
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 7 of 116 15.03.2004 Figure 52: XT55 bottom view..............................................................................................107 Figure 53: Mechanical dimensions of XT55........................................................................108 Figure 54: Mounting holes on XT55 ...................................................................................109 Figure 55: Recommended dowel........................................................................................110 Figure 56: Mechanical dimensions of Hirose DF12 connector............................................112 Figure 57: Reference equipment for approval ....................................................................113 Tables Table 1: XT55 key features ..................................................................................................19 Table 2: GSM/GPRS coding schemes and maximum net data rates over air interface ........21 Table 3: Overview of GSM/GPRS operating modes .............................................................25 Table 4: Power supply pins of board-to-board connector .....................................................27 Table 5: AT commands available in Alarm mode .................................................................32 Table 6: Temperature dependent behavior ..........................................................................37 Table 7: Bill of material for external charging circuit .............................................................41 Table 8: Specifications of recommended battery pack .........................................................43 Table 9: Comparison Charge-only and Charge mode ..........................................................45 Table 10: AT commands available in Charge-only mode......................................................46 Table 11: Wake-up events in NON-CYCLIC and CYCLIC SLEEP modes............................50 Table 12: State transitions of XT55 (except SLEEP mode) ..................................................52 Table 13: DCE-DTE wiring of 1st serial interface (GSM/GPRS part)....................................55 Table 14: DCE-DTE wiring of 2nd serial interface (GSM/GPRS part)...................................55 Table 15: Signals of the SIM interface (board-to-board connector) ......................................60 Table 16: Pin assignment of Molex SIM card holder on DSB45 Support Box .......................62 Table 17: Input control signals of the GSM/GPRS part of the XT55 module ........................63 Table 18: Coding of the status LED......................................................................................65 Table 19: ASC0 ring signal...................................................................................................67 Table 20: Return loss ...........................................................................................................78 Table 21: Product specifications of U.FL-R-SMT connector .................................................81 Table 22: Material and finish of U.FL-R-SMT connector and recommended plugs...............82 Table 23: Ordering information for Hirose U.FL Series.........................................................84 Table 24: Absolute maximum ratings (GSM/GPRS part)......................................................85 Table 25: Absolute maximum rating (GPS part) ...................................................................85 Table 26: Operating temperatures........................................................................................85 Table 27: Electrical description of application interface ........................................................87 Table 28: Power supply ratings (GSM/GPRS part)...............................................................92 Table 29: Power supply ratings (GPS part) ..........................................................................93 Table 30: Audio parameters adjustable by AT command .....................................................99 Table 31: Voiceband characteristics (typical) .....................................................................101 Table 32: Voiceband receive path ......................................................................................102 Table 33: Voiceband transmit path.....................................................................................103 Table 34: Air Interface........................................................................................................104 Table 35: Measured electrostatic values ............................................................................105 Table 36: Summary of reliability test conditions..................................................................106 Table 37: Ordering information DF12 series.......................................................................111 Table 38: Electrical and mechanical characteristics of the Hirose DF12C connector..........111 Table 39: List of parts and accessories ..............................................................................115 Table 40: Molex sales contacts (subject to change) ...........................................................116 Table 41: Hirose sales contacts (subject to change) ..........................................................116
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 8 of 116 15.03.2004 0 Document history Preceding document: "XT55 Hardware Interface Description" Version 00.01 New document: "XT55 Hardware Interface Description" Version 00.02 Chapter Page What is new Throughout this document · Maximum temperature has been changed from +65°C to +70°C. · Pins have been clearly divided into GPS and GSM pins. 1.1 9 Updated list of related documents 1.2 10 Added GPS terms abbreviations 2.1 19 Inserted new key features regarding GPS 2.2 22f Improved Figure 1, added Figure 2 and Figure 3 3.5.2 43 Deleted vendor XWODA, battery pack can be obtained from various dealers 4.1 68 New chapter: Theory of operation 4.3f 70 Detailed description of GPS operating modes 4.4 73 Added information regarding the power supply pins of the GPS part 4.5 73 New chapter: General purpose input/output 4.6 74 More information regarding the two serial interfaces of the GPS part 4.7 74 Added a complete list of GPS control signals 4.8 75 New chapter describing the functionality of the integrated GPS receiver 4.9 76 New chapter: Operation procedure 4.10 77ff Detailed description of the GPS start-up procedure, coldstart, warmstart and hotstart 6.3 86 Renamed chapter and corrected pin assignment of B2B connector
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 9 of 116 15.03.2004 1 Introduction This document describes the hardware interface of the Siemens XT55 module that connects to the cellular device application and the air interface. As XT55 is intended to integrate with a wide range of application platforms, all functional components are described in great detail. This guide therefore covers all information needed to design and set up cellular applications incorporating the XT55 module. It aids rapid retrieval of interface specifications, electrical and mechanical details and information on the requirements to be considered for integration of further components. Please note that this document refers to the GPS software version 2.2.0 and XT55 module software version 00.02. 1.1 Related documents [1] XT55 AT Command Set, Version 00.02 [2] XT55 GPS Command Specification, Version 02 [3] XT55 AVL Software Instructions User’s Guide [4] XT55 GPS Startup User's Guide [5] GPRS Startup User's Guide [6] Remote-SAT User's Guide [7] DSB45 Support Box - Evaluation Kit for Siemens Cellular Engines [8] Application Note 07: Li-Ion Batteries in GSM Applications (in preparation) [9] Application Note 16: Upgrading XT55 Firmware (in preparation) [10] Application Note 14: Audio and Battery Parameter Download (in preparation) [11] Application Note 02: Audio Interface Design (in preparation) [12] Multiplexer User's Guide [13] Multiplex Driver Developer’s Guide for Windows 2000 and Windows XP [14] Multiplex Driver Installation Guide for Windows 2000 and Windows XP [15] Application Note 24: Application Developer’s Guide Prior to using the XT55 engines or upgrading to a new firmware release, be sure to carefully read the latest product information. To visit the Siemens Website you can use the following link: http://www.siemens.com/wm
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 10 of 116 15.03.2004 1.2 Terms and abbreviations Abbreviation Description AD Analog / Digital ADC Analog-to-Digital Converter AFC Automatic Frequency Control AGC Automatic Gain Control ANSI American National Standards Institute ARFCN Absolute Radio Frequency Channel Number ARP Antenna Reference Point ASC0 / ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of XT55 ASIC Application Specific Integrated Circuit B Thermistor Constant B2B Board-to-board connector BER Bit Error Rate BTS Base Transceiver Station CB or CBM Cell Broadcast Message CE Conformité Européene (European Conformity) CHAP Challenge Handshake Authentication Protocol CPU Central Processing Unit CS Coding Scheme CSD Circuit Switched Data CTS Clear to Send DAC Digital-to-Analog Converter DAI Digital Audio Interface dBW Decibel per Watt dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law DCE Data Communication Equipment (typically modems, e.g. Siemens GSM engine) DCS 1800 Digital Cellular System, also referred to as PCN DGPS Differential GPS DOP Dilution of Precision DRX Discontinuous Reception DSB Development Support Box DSP Digital Signal Processor DSR Data Set Ready DTE Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM application) DTR Data Terminal Ready
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 11 of 116 15.03.2004 Abbreviation Description DTX Discontinuous Transmission EFR Enhanced Full Rate EGSM Enhanced GSM EMC Electromagnetic Compatibility ESD Electrostatic Discharge ETS European Telecommunication Standard FCC Federal Communications Commission (U.S.) FDMA Frequency Division Multiple Access FR Full Rate GGA GPS Fixed Data GMSK Gaussian Minimum Shift Keying GPRS General Packet Radio Service GPS Global Positioning System GSM Global Standard for Mobile Communications HiZ High Impedance HR Half Rate I/O Input/Output IC Integrated Circuit IF Intermediate Frequency IMEI International Mobile Equipment Identity ISO International Standards Organization ITU International Telecommunications Union kbps kbits per second LED Light Emitting Diode Li-Ion Lithium-Ion LNA Low Noise Amplifier Mbps Mbits per second MMI Man Machine Interface MO Mobile Originated MS Mobile Station (GSM engine), also referred to as TE MSISDN Mobile Station International ISDN number MSK Minimum Shift Key MT Mobile Terminated NTC Negative Temperature Coefficient NMEA National Maritime Electronics Association OEM Original Equipment Manufacturer PA Power Amplifier
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 12 of 116 15.03.2004 Abbreviation Description PAP Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel PCB Printed Circuit Board PCL Power Control Level PCM Pulse Code Modulation PCN Personal Communications Network, also referred to as DCS 1800 PCS Personal Communication System, also referred to as GSM 1900 PDU Protocol Data Unit PLL Phase Locked Loop PPP Point-to-point protocol PRN Pseudo-Random Noise Number – The identity of GPS satellites PSU Power Supply Unit R&TTE Radio and Telecommunication Terminal Equipment RAM Random Access Memory RF Radio Frequency RMS Root Mean Square (value) ROM Read-only Memory RP Receive Protocol RTC Real Time Clock RTCM Radio Technical Commission for Maritime Services Rx Receive Direction SA Selective Availability SAR Specific Absorption Rate SELV Safety Extra Low Voltage SIM Subscriber Identification Module SMS Short Message Service SRAM Static Random Access Memory TA Terminal adapter (e.g. GSM engine) TDMA Time Division Multiple Access TE Terminal Equipment, also referred to as DTE Tx Transmit Direction UART Universal asynchronous receiver-transmitter URC Unsolicited Result Code USSD Unstructured Supplementary Service Data VSWR Voltage Standing Wave Ratio WAAS Wide Area Augmentation System
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 13 of 116 15.03.2004 Abbreviation Description Phonebook abbreviations FD SIM fixdialing phonebook LD SIM last dialing phonebook (list of numbers most recently dialed) MC Mobile Equipment list of unanswered MT calls (missed calls) ME Mobile Equipment phonebook ON Own numbers (MSISDNs) stored on SIM or ME RC Mobile Equipment list of received calls SM SIM phonebook
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 14 of 116 15.03.2004 1.3 Type approval XT55 is designed to comply with the directives and standards listed below. Please note that the product is still in a pre-release state and, therefore, type approval and testing procedures have not yet been completed. European directives 99/05/EC “Directive of the European Parliament and of the council of 9 March 1999 on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity”, in short referred to as R&TTE Directive 1999/5/EC 89/336/EC Directive on electromagnetic compatibility 73/23/EC Directive on electrical equipment designed for use within certain voltage limits (Low Voltage Directive) Standards of North American Type Approval CFR Title 47 “Code of Federal Regulations, Part 15, Part 22 and Part 24 (Telecommunications, PCS)”; US Equipment Authorization FCC UL 60 950 “Product Safety Certification” (Safety requirements) NAPRD.03 “Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI control” PCS Type Certification Review board (PTCRB) Standards of European Type Approval 3GPP TS 51.010-1 “Digital cellular telecommunications system (Phase 2); Mobile Station (MS) conformance specification”. ETSI EN 301 511 “V7.0.1 (2000-12) Candidate Harmonized European Standard (Tele-communications series) Global System for Mobile communications (GSM); Harmonized standard for mobile stations in the GSM 900 and DCS 1800 bands covering essential requirements under article 3.2 of the R&TTE directive (1999/5/EC) (GSM 13.11 version 7.0.1 Release 1998)” GCF-CC “Global Certification Forum - Certification Criteria” V3.12.0 (Sept 2003) ETSI EN 301 489-1 “V1.1.1 (2000-09) Candidate Harmonized European Standard (Tele-communications series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Electro Magnetic Compatibility (EMC) stan-dard for radio equipment and services; Part 1: Common Technical Requirements” ETSI EN 301 489-07 “V1.1.1 Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Electro Magnetic Compatibility (EMC) standard for radio equipment and services; Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular radio tele-communications systems (GSM and DCS)” EN 60 950 Safety of information technology equipment (2000)
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 15 of 116 15.03.2004 Requirements of quality IEC 60068 Environmental testing DIN EN 60529 IP codes Compliance with international rules and regulations Manufacturers of mobile or fixed devices incorporating XT55 modules are advised to have their completed product tested and approved for compliance with all applicable national and international regulations. As a tri-band GSM/GPRS engine designed for use on any GSM network in the world, XT55 is required to pass all approvals relevant to operation on the European and North American markets. For the North American market this includes the Rules and Regulations of the Federal Communications Commission (FCC) and PTCRB, for the European market the R&TTE Directives and GCF Certification Criteria must be fully satisfied. The FCC Equipment Authorization granted to the XT55 Siemens reference application is valid only for the equipment described in Chapter 8. SAR requirements specific to handheld mobiles Mobile phones, PDAs or other handheld transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of handheld XT55 based applications to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for handheld operation. For European and US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US markets ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz-6GHz Products intended for sale on European markets EN 50360 Product standard to demonstrate the compliance of mobile phones with the basic restrictions related to human exposure to electromagnetic fields (300 MHz - 3 GHz) Note: Usage of XT55 in a handheld or portable application is not allowed without a new FCC certification.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 16 of 116 15.03.2004 1.4 Safety precautions The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating XT55. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Siemens AG assumes no liability for customer failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guidelines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufacturer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it cannot be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for handsfree operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Handsfree devices must be installed by qualified personnel. Faulty installation or operation can constitute a safety hazard.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 17 of 116 15.03.2004 SOS IMPORTANT! Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 18 of 116 15.03.2004 2 Product concept Designed for use on any GSM network in the world, Siemens XT55 is a tri-band GSM/GPRS engine that works on the three frequencies GSM 900 MHz, GSM 1800 MHz and GSM 1900 MHz and supports also GPS technology for satellite navigation. XT55 features GPRS multislot class 10 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. The compact design of the XT55 module makes it easy to integrate GSM / GPRS and GPS as an all-in-one solution. It saves significantly both time and cost for integration of additional hardware components. The integrated GPS module provides instant location information using satellite signals to enable users to ascertain where they are anywhere in the world. It consists of a fully integrated RF receiver and a 12 channel baseband. The tiny XT55 module incorporates all you need to create high-performance GSM/GPRS solutions: baseband processor, power supply ASIC, complete radio frequency circuit including a power amplifier and antenna interface. The power amplifier is directly fed from the supply voltage GSM_BATT+. A compact “stacked FLASH / SRAM” device stores the XT55 software in the flash memory section, and static RAM section provides the additional storage capacity required by GPRS connectivity. The physical interface to the cellular application is made through a board-to-board connector. It consists of 80 pins, required for controlling the unit, receiving GPS location data, transferring data and audio signals and providing power supply lines. XT55 comprises two serial GSM interfaces (ASC0 and ASC1) and two serial GPS interfaces (Serial data 1 and Serial data 2) giving you maximum flexibility for easy integration with the Man-Machine Interface (MMI). An extremely versatile audio concept offers various audio interfaces, each available on the board-to-board connector: a digital audio interface (DAI) and two analog audio interfaces. Using AT commands you can easily switch back and forth and select different audio modes. The external dual-band or triple-band GSM/GPRS antenna can be connected optionally to a connector on the top side or to a pad on the bottom side. A separate GPS antenna must be connected to the GPS part of the module in order to properly receive satellite data. For battery powered applications, XT55 features a charging control which can be used to charge a Li-Ion battery. The charging circuit must be implemented outside the module on the application platform.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 19 of 116 15.03.2004 2.1 XT55 key features at a glance Table 1: XT55 key features Feature Implementation Power supply Supply voltage 3.3V – 4.8V for the GSM / GPRS module Separate power supply source: 3.3V ± 5% for the GPS device Power saving (GSM) Minimizes power consumption in SLEEP mode to 3mA Power saving (GPS) TricklePower™ mode reduces power to < 60mW Charging Supports charging control for Li-Ion battery for the GSM/GPRS part of the module Frequency bands · Tri-band: EGSM 900, GSM 1800, GSM 1900 · Compliant to GSM Phase 2/2+ GSM class Small MS Transmit power · Class 4 (2W) at EGSM900 · Class 1 (1W) at GSM1800 and GSM 1900 GPRS connectivity · GPRS multi-slot class 10 · GPRS mobile station class B GPS features · GPS receiver with SiRFstar Ile/LP chip set · Processor type ARM7/TDMI · Sirf GSW2, version 2.2.0 Temperature range Temperature control and auto switch-off · Normal operation: -20°C to +55°C · Restricted operation: -25°C to -20°C and +55°C to +70°C· Constant temperature control prevents damage to XT55 when the specified temperature is exceeded. When an emergency call is in progress the automatic temperature shutdown functionality is deactivated. DATA GPRS: CSD: WAP: · GPRS data downlink transfer: max. 85.6 kbps (see Table 2) · GPRS data uplink transfer: max. 42.8 kbps (see Table 2 · Coding scheme: CS-1, CS-2, CS-3 and CS-4 · XT55 supports the two protocols PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) commonly used for PPP connections. · Support of Packet Switched Broadcast Control Channel (PBCCH) allows you to benefit from enhanced GPRS performance when offered by the network operators. · CSD transmission rates: 2.4, 4.8, 9.6, 14.4 kbps, non-transparent, V.110 · Unstructured Supplementary Services Data (USSD) support · WAP compliant SMS · MT, MO, CB, Text and PDU mode · SMS storage: SIM card plus 25 SMS locations in the mobile equipment · Transmission of SMS alternatively over CSD or GPRS. Preferred mode can be user-defined. MMS MMS compliant
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 20 of 116 15.03.2004 Feature Implementation FAX Group 3: Class 1, Class 2 SIM interface Supported SIM card: 3V External SIM card reader has to be connected via interface connector (note that card reader is not part of XT55) External antenna GSM / GPRS: GPS: Connected via 50 Ohm antenna connector or antenna pad Separate GPS antenna connector, see Figure 51 for details Audio interfaces Two analog audio interfaces, one digital audio interface (DAI) Audio features Speech codec modes: · Half Rate (ETS 06.20) · Full Rate (ETS 06.10) · Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80) · Adaptive Multi Rate (AMR) Handsfree operation · Echo cancellation · Noise reduction Two serial GSM interfaces: ASC0, ASC1 · 2.65V level, bi-directional bus for AT commands and data · ASC0 – full-featured 8-wire serial interface. Supports RTS0/CTS0 hardware handshake and software XON/XOFF flow control. Multiplex ability according to GSM 07.10 Multiplexer Protocol. · ASC1 - 4-wire serial interface. Supports RTS1/CTS1 hardware handshake and software XON/XOFF flow control. · Baud rate: 300bps ... 230kbps on ASC0 and ASC1 · Autobauding (on ASC0 only) detects 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400 bps Two serial GPS interfaces: SDn1, SDn2 · Baud rate: 4800, 9600 bps on SD1 and SD2 Phonebook management Supported phonebook types: SM, FD, LD, MC, RC, ON, ME SIM Application Toolkit Supports SAT class 3, GSM 11.14 Release 98 Ringing tones Offers a choice of 7 different ringing tones / melodies, easily selectable with AT command Real time clock Implemented Timer function Programmable via AT command Support of TTY/CTM To benefit from TTY communication via GSM, CTM equipment can be connected to one of the three audio interfaces. Physical characteristics Size: 35.0 ± 0.15mm x 53.0 ± 0.15mm x 5.1 ± 0.15mm Weight: 11g Firmware upgrade XT55 firmware upgradable over serial interface Evaluation kit The DSB45 Support Box is an evaluation kit designed to test and type approve Siemens cellular engines and provide a sample configuration for application engineering. See Chapter 9 for ordering information.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 21 of 116 15.03.2004 Table 2: GSM/GPRS coding schemes and maximum net data rates over air interface Coding scheme 1 Timeslot 2 Timeslots 4 Timeslots CS-1: 9.05 kbps 18.1 kbps 36.2 kbps CS-2: 13.4 kbps 26.8 kbps 53.6 kbps CS-3: 15.6 kbps 31.2 kbps 62.4 kbps CS-4: 21.4 kbps 42.8 kbps 85.6 kbps Please note that the values stated above are maximum ratings which, in practice, are influenced by a great variety of factors, primarily, for example, traffic variations and network coverage.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 22 of 116 15.03.2004 2.2 Circuit concept The XT55 module comprises the following major functional components: GSM / GPRS baseband block: · Baseband controller operating at 26MHz · Power supply ASIC · Stacked Flash / SRAM · Application interface (board-to-board connector) GSM RF block: · Skyworks RF transceiver · Skyworks RF power amplifier / FEM · RF front end (antenna connector) GPS block: · Processor Type ARM7/TDMI · Processor speeds 6MHz, 12.5 MHz, 25 MHz, 49 MHz GPS RF block: · GPS receiver with SiRFstar Ile/LP chip set
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 23 of 116 15.03.2004 Customer application 80 pin B2B Serial 0 GSM Serial 1 GPS GPS – Modul 80 pin B2B Active GPS antenna GSM – Modul ASC1 ASC0 GSM antenna GSM_TXD0 GSM_RXD0 SDI1 SDO1 XT 55 SDO2 SDI2 Serial data 2 Serial data 1 6 Modem Status lines GSM module GPS module Serial 1 GSM GSM_TXD1 GSM_RXD1GSM_RTS1GSM_CTS1 Serial 2 GPS Figure 1: Block diagram of serial interface concept
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 24 of 116 15.03.2004 Figure 2: Block diagram of XT55 for SiRF Demo application Figure 3: Block diagram of XT55 with AVL or TCP/IP application (optional)
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 25 of 116 15.03.2004 3 GSM/GPRS application interface The GSM/GPRS part of the XT55 module incorporates several sub-interfaces described in the following chapters: · Power supply and charging control (see Chapters 3.2 and 3.3) · Dual serial GSM interface (see Chapter 3.9) · Two analog audio interfaces and a digital audio interface (see Chapter 3.10) · SIM interface (see Chapter 3.11) Electrical and mechanical characteristics of the board-to-board connector are specified in Chapter 7.3. Ordering information for mating connectors and cables are included. 3.1 GSM/GPRS operating modes The table below briefly summarizes the various operating modes referred to in the following chapters. All information regarding GPS operating modes are available in Chapter 4.3. Table 3: Overview of GSM/GPRS operating modes Mode Function GSM / GPRS SLEEP Various powersave modes set with AT+CFUN command. Software is active to minimum extent. If the module was registered to the GSM network in IDLE mode, it is registered and paging with the BTS in SLEEP mode, too. Power saving can be chosen at different levels: The NON-CYCLIC SLEEP mode (AT+CFUN=0) disables the AT interface. The CYCLIC SLEEP modes AT+CFUN=5, 6, 7, 8 and 9 alternatively activate and deactivate the AT interfaces to allow permanent access to all AT commands. GSM IDLE Software is active. Once registered to the GSM network, paging with BTS is carried out. The module is ready to send and receive. GSM TALK Connection between two subscribers is in progress. Power consumption depends on network coverage individual settings, such as DTX off/on, FR/EFR/HR, hopping sequences, antenna. GPRS IDLE Module is ready for GPRS data transfer, but no data is currently sent or received. Power consumption depends on network settings and GPRS configuration (e.g. multislot settings). Normal operation GPRS DATA GPRS data transfer in progress. Power consumption depends on network settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multislot settings).
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 26 of 116 15.03.2004 Mode Function POWER DOWN Normal shutdown after sending the AT^SMSO command. The Power Supply ASIC (PSU-ASIC) disconnects the supply voltage from the baseband part of the circuit. Only a voltage regulator in the PSU-ASIC is active for powering the RTC. Software is not active. The serial interfaces are not accessible. Operating voltage (connected to GSM_BATT+) remains applied. Alarm mode Restricted operation launched by RTC alert function while the module is in POWER DOWN mode. Module will not be registered to GSM network. Limited number of AT commands is accessible. Charge-only mode Limited operation for battery powered applications. Enables charging while module is detached from GSM network. Limited number of AT commands is accessible. There are several ways to launch Charge-only mode: · From POWER DOWN mode: Connect charger to the charger input pin of the external charging circuit and the module’s GSM_POWER pin when XT55 was powered down by AT^SMSO. · From Normal mode: Connect charger to the charger input pin of the external charging circuit and the module’s GSM_POWER pin, then enter AT^SMSO. Charge mode during normal operation Normal operation (SLEEP, IDLE, TALK, GPRS IDLE, GPRS DATA) and charging running in parallel. Charge mode changes to Charge-only mode when the module is powered down before charging has been completed. See Table 11 and Table 12 for the various options of waking up the GSM/GPRS part of the XT55 module and proceeding from one mode to another.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 27 of 116 15.03.2004 3.2 Power supply The power supply for the GSM/GPRS part of the XT55 module has to be a single voltage source of VGSM_BATT+= 3.3V...4.8V. It must be able to provide sufficient current in a transmit burst which typically rises to 1.6A. All the key functions for supplying power to the device are handled by an ASIC power supply. The ASIC provides the following features: · Stabilizes the supply voltages for the GSM baseband using low drop linear voltage regulators. · Controls the module's power up and power down procedures. A watchdog logic implemented in the baseband processor periodically sends signals to the ASIC, allowing it to maintain the supply voltage for all digital XT55 components. Whenever the watchdog pulses fail to arrive constantly, the module is turned off. · Delivers, across the GSM_VDD pin, a regulated voltage of 2.9V. The output voltage GSM_VDD may be used to supply, for example, an external LED or a level shifter. However, the external circuitry must not cause any spikes or glitches on voltage GSM_VDD. This voltage is not available in POWER DOWN mode. Therefore, the GSM_VDD pin can be used to indicate whether or not GSM/GPRS part of the XT55 module is in POWER DOWN mode. · Provides power to the SIM interface. The RF power amplifier is driven directly from GSM_BATT+. 3.2.1 Power supply pins on the board-to-board connector Five GSM_BATT+ pins of the board-to-board connector are dedicated to connect the supply voltage, five GND pins are recommended for grounding. The values stated below must be measured directly at the reference points on the XT55 board (TP GSM_BATT+ and TP GND illustrated in Figure 52). The GSM_POWER and GSM_CHARGE pins serve as control signals for charging a Li-Ion battery. GSM_VDDLP can be used to back up the RTC. Table 4: Power supply pins of board-to-board connector Signal name I/O Description Parameter GSM_BATT+ I/O Positive operating voltage Reference points are the test points 3.3 V...4.8 V, Ityp £ 1.6 A during transmit burst The minimum operating voltage must not fall below 3.3 V, not even in case of voltage drop. GND - Ground 0 V GSM_POWER I This line signals to the processor that the charger is connected. GSM_CHARGE O Control signal for external charging transistor GSM_VDDLP I/O Can be used to back up the RTC when VGSM_BATT+ is not applied. See Chapter 3.8 UOUT,max < VGSM_BATT+ UIN = 2.0 V...5.5 V Ri = 1kW Iin,max = 30µA
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 28 of 116 15.03.2004 3.2.2 Minimizing power losses When designing the power supply for your application please pay specific attention to power losses. Ensure that the input voltage VGSM_BATT+ never drops below 3.3V on the GSM/GPRS part of the XT55 board, not even in a transmit burst where current consumption can rise to typical peaks of 1.6A. It should be noted that the GSM/GPRS part of the XT55 module switches off when exceeding these limits. Any voltage drops that may occur in a transmit burst should not exceed 400mV. For further details see Chapter 6.4. The best approach to reducing voltage drops is to use a board-to-board connection as recommended, and a low impedance power source. The resistance of the power supply lines on the host board and of a battery pack should also be considered. Note: If the application design requires an adapter cable between both board-to-board connectors, use a cable as short as possible in order to minimize power losses. Example: If the length of the cable reaches the maximum length of 200mm, this connection may cause, for example, a resistance of 50m! in the GSM_BATT+ line and 50m! in the GND line. As a result, a 1.6A transmit burst would add up to a total voltage drop of 160mV. Plus, if a battery pack is involved, further losses may occur due to the resistance across the battery lines and the internal resistance of the battery including its protective circuit. Transmit burst 1.6ATransmit burst 1.6ARippleDropmin. 3.3VGSM_BATT+ Figure 4: Power supply limits during transmit burst The input voltage VGSM_BATT+ must be measured directly at the test points on the XT55 board (TP GSM_BATT+ and TP GND illustrated in Figure 52). 3.2.3 Monitoring power supply To help you monitor the supply voltage you can use the AT^SBV command which returns the voltage measured at TP GSM_BATT+ and GND. The voltage is continuously measured at intervals depending on the operating mode on the RF interface. The duration of measuring ranges from 0.5s in TALK/DATA mode up to 50s when the GSM/GPRS part of the XT55 is in IDLE mode or Limited Service (deregistered). The displayed voltage (in mV) is averaged over the last measuring period before the AT^SBV command was executed. For details please refer to [1].
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 29 of 116 15.03.2004 3.3 Power up / down scenarios In general, be sure not to turn on GSM/GPRS part of the XT55 module while it is out of the operating range of voltage and temperature stated in Chapters 6.2 and 6.3. The GSM/GPRS part of the XT55 would immediately switch off after having started and detected these inappropriate conditions. 3.3.1 Turn on the GSM/GPRS part of XT55 The GSM/GPRS part of the XT55 can be activated in a variety of ways, which are described in the following chapters: · via ignition line GSM_IGT: starts normal operating state (see Chapters 3.3.1.1 and 3.3.1.2) · via GSM_POWER line: starts charging algorithm (see Chapters 3.5.4 and 3.3.1.3) · via RTC interrupt: starts Alarm mode (see Chapter 3.3.1.4)
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 30 of 116 15.03.2004 3.3.1.1 Turn on the GSM/GPRS part of XT55 using the ignition line GSM_IGT (Power on) To switch on the XT55 GSM/GPRS part the GSM_IGT (Ignition) signal needs to be driven to ground level for at least 100ms and not earlier than 10ms after the last falling edge of GSM_VDD. This can be accomplished using an open drain/collector driver in order to avoid current flowing into this pin. Software controlledGSM_EMERGOFFca. 300ms ca. 900msSerial interfaces ASC0 and ASC1 Undefined Inactive ActiveGSM_VDDca. 60msGSM_TXD0GSM_TXD1GSM_DSR0GSM_BATT+GSM_IGTmin. 10msmin.100ms HiZHiZ Figure 5: Power-on by ignition signal If configured to a fix baud rate, the GSM/GPRS part of the XT55 will send the result code ^SYSSTART to indicate that it is ready to operate. This result code does not appear when autobauding is active. See Chapter AT+IPR in [1]. In a battery operated XT55 application, the duration of the GSM_IGT signal must be 1s minimum when the charger is connected and you may want to go from Charge only mode to Normal mode. For details please see Chapter 3.3.1.2
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 31 of 116 15.03.2004 3.3.1.2 Timing of the ignition process When designing your application platform take into account that powering up the GSM/GPRS part of the XT55 module requires the following steps. · The ignition line cannot be operated until VGSM_BATT+ passes the level of 3.0V. · The ignition line shall not be operated earlier than 10ms after the last falling edge of GSM_VDD. · 10ms after VGSM_BATT+ has reached 3.0V the ignition line can be switched low. The duration of the falling edge must not exceed 1ms. · Another 100ms are required to power up the module. · Ensure that VGSM_BATT+ does not fall below 3.0V while the ignition line is driven. Otherwise the module cannot be activated. · If the GSM_VDDLP line is fed from an external power supply as explained in Chapter 3.8, the GSM_IGT line is HiZ before the rising edge of GSM_BATT+. Figure 6: Timing of power-on process if GSM_VDDLP is not used Figure 7: Timing of power-on process if GSM_VDDLP is fed from external source 3.0V0VGSM_BATT+min. 100msmax. 1ms10msGSM_IGTHiZHiZ3.0V0Vmin. 100msmax. 1ms10msHiZHiZGSM_BATT+GSM_IGT
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 32 of 116 15.03.2004 3.3.1.3 Turn on the GSM/GPRS part of XT55 using the GSM_POWER signal As detailed in Chapter 3.5.4, the charging adapter can be connected regardless of the module’s operating mode (except for Alarm mode). If the charger is connected to the charger input of the external charging circuit and the module’s GSM_POWER pin while XT55 is off, processor controlled fast charging starts (see Chapter 3.5.3). The GSM/GPRS part of XT55 enters a restricted mode, referred to as Charge-only mode where only the charging algorithm will be launched. During the Charge-only mode XT55 is neither logged on to the GSM network nor are the serial interfaces fully accessible. To switch to normal operation and log on to the GSM network, the GSM_IGT line needs to be activated. 3.3.1.4 Turn on the GSM/GPRS part of XT55 using the RTC (Alarm mode) Another power-on approach is to use the RTC, which is constantly supplied with power from a separate voltage regulator in the power supply ASIC. The RTC provides an alert function, which allows the GSM/GPRS part of the XT55 to wake up whilst the internal voltage regulators are off. To prevent the engine from unintentionally logging into the GSM network, this procedure only enables restricted operation, referred to as Alarm mode. It must not be confused with a wake-up or alarm call that can be activated by using the same AT command, but without switching off power. Use the AT+CALA command to set the alarm time. The RTC retains the alarm time if the GSM/GPRS part of XT55 was powered down by AT^SMSO. Once the alarm is timed out and executed, XT55 enters the Alarm mode. This is indicated by an Unsolicited Result Code (URC) which reads: ^SYSSTART ALARM MODE Note that this URC is the only indication of the Alarm mode and will not appear when autobauding was activated (due to the missing synchronization between DTE and DCE upon start-up). Therefore, it is recommended to select a fixed baudrate before using the Alarm mode. In Alarm mode only a limited number of AT commands is available. For further instructions refer to the AT Command Set. Table 5: AT commands available in Alarm mode AT command Function AT+CALA Set alarm time AT+CCLK Set date and time of RTC AT^SBC In Alarm mode, you can only query the present current consumption and check whether or not a charger is connected. The battery capacity is returned as 0, regardless of the actual voltage (since the values measured directly on the cell are not delivered to the module). AT^SCTM Query temperature range, enable/disable URCs to report critical temperature rangesAT^SMSO Power down GSM engine For the GSM engine to change from the Alarm mode to full operation (normal operating mode) it is necessary to drive the ignition line to ground. This must be implemented in your host application as described in Chapter 3.3.1.1.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 33 of 116 15.03.2004 If the charger is connected to the GSM_POWER line when GSM/GPRS part of the XT55 is in ALARM mode charging will start, while XT55 stays in ALARM mode. See also Chapter 3.7 which summarizes the various options of changing the mode of operation. If your host application uses the GSM_SYNC pin to control a status LED as described in Chapter 3.12.2.2, please note that the LED is off while the GSM engine is in Alarm mode.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 34 of 116 15.03.2004 3.3.2 Turn off the GSM/GPRS part of XT55 To switch the module off the following procedures may be used: · Normal shutdown procedure: Software controlled by sending the AT^SMSO command over the serial application interface. See Chapter 3.3.2.1. · Emergency shutdown: Hardware driven by switching the GSM_EMERGOFF line of the board-to-board-connector to ground = immediate shutdown of supply voltages, only applicable if the software controlled procedure fails! See Chapter 3.3.2.3. · Automatic shutdown: See Chapter 3.3.3 a) Takes effect if undervoltage is detected. b) Takes effect if XT55 board temperature exceeds critical limit. 3.3.2.1 Turn off GSM/GPRS part of the XT55 module using AT command The best and safest approach to powering down the XT55 GSM/GPRS part is to issue the AT^SMSO command. This procedure lets GSM engine log off from the network and allows the software to enter into a secure state and safe data before disconnecting the power supply. The mode is referred to as POWER DOWN mode. In this mode, only the RTC stays active. Before switching off the device sends the following response: ^SMSO: MS OFF OK ^SHUTDOWN After sending AT^SMSO do not enter any other AT commands. There are two ways to verify when the module turns off: · Wait for the URC “^SHUTDOWN”. It indicates that data have been stored non-volatile and the module turns off in less than 1 second. · Also, you can monitor the GSM_VDD pin. The low state of GSM_VDD definitely indicates that the module is switched off. Be sure not to disconnect the operating voltage VGSM_BATT+ before the URC “^SHUTDOWN” has been issued and the GSM_VDD signal has gone low. Otherwise you run the risk of losing data. While the GSM engine is in POWER DOWN mode the application interface is switched off and must not be fed from any other source. Therefore, your application must be designed to avoid any current flow into any digital pins of the application interface. Note: In POWER DOWN mode, the GSM_EMERGOFF pin, the output pins of the ASC0 interface GSM_RXD0, GSM_CTS0, GSM_DCD0, GSM_DSR0, GSM_RING0 and the output pins of the ASC1 interface GSM_RXD1 and GSM_CTS1 are switched to high impedance state. If this causes the associated input pins of your application to float, you are advised to integrate an additional resistor (100 k" – 1 M") at each line. In the case of the GSM_EMERGOFF pin use a pull-down resistor tied to GND. In the case of the serial interface pins you can either connect pull-up resistors to the GSM_VDD line, or pull-down resistors to GND.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 35 of 116 15.03.2004 3.3.2.2 Maximum number of turn-on / turn-off cycles Each time the module is shut down, data will be written from volatile memory to flash memory. The guaranteed maximum number of write cycles is limited to 100.000. 3.3.2.3 Emergency shutdown using GSM_EMERGOFF pin Caution: Use the GSM_EMERGOFF pin only when, due to serious problems, the software is not responding for more than 5 seconds. Pulling the GSM_EMERGOFF pin causes the loss of all information stored in the volatile memory since power is cut off immediately. Therefore, this procedure is intended only for use in case of emergency, e.g. if XT55 fails to shut down properly. The GSM_EMERGOFF signal is available on the board-to-board connector. To control the GSM_EMERGOFF line it is recommended to use an open drain / collector driver. To turn the GSM engine off, the GSM_EMERGOFF line has to be driven to ground for ³ 3.2s. Figure 8: Deactivating GSM engine by GSM_EMERGOFF signal GSM_BATT+ Internal reset GSM_EMERGOFF Controlled by external application max. 3.2sGSM_IGT GSM_VDD How does it work: · Voltage VGSM_BATT+ is permanently applied to the module. · The module is active while the internal reset signal is kept at high level. During operation of XT55the baseband controller generates watchdog pulses at regular intervals. Once the GSM_EMERGOFF pin is grounded these watchdog pulses are cut off from the power supply ASIC. The power supply ASIC shuts down the internal supply voltages of XT55 after max. 3.2s and the module turns off. Consequently, the output voltage at GSM_VDD is switched off. Controlled by XT55 software
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 36 of 116 15.03.2004 3.3.3 Automatic shutdown Automatic shutdown takes effect if · the XT55 board is exceeding the critical limits of overtemperature or undertemperature · the battery is exceeding the critical limits of overtemperature or undertemperature · undervoltage is detected The automatic shutdown procedure is equivalent to the power-down initiated with the AT^SMSO command, i.e. XT55 logs off from the network and the software enters a secure state avoiding loss of data. NOTE: This does not apply if overvoltage conditions or unrecoverable hardware or software errors occur (see below for details). Alert messages transmitted before the device switches off are implemented as Unsolicited Result Codes (URCs). The presentation of these URCs can be enabled or disabled with the two AT commands AT^SBC and AT^SCTM. The URC presentation mode varies with the condition, please see Chapters 3.3.3.1 to 3.3.3.4 for details. For further instructions on AT commands refer to [1]. 3.3.3.1 Temperature dependent shutdown The board temperature is constantly monitored by an internal NTC resistor located on the PCB. The NTC that detects the battery temperature must be part of the battery pack circuit as described in Chapter 3.5. The values detected by either NTC resistor are measured directly on the board or the battery and therefore, are not fully identical with the ambient temperature. Each time the board or battery temperature goes out of range or back to normal, XT55 instantly displays an alert (if enabled). · URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such as protecting the module from exposure to extreme conditions. The presentation of the URCs depends on the settings selected with the AT^SCTM write command: AT^SCTM=1: Presentation of URCs is always enabled. AT^SCTM=0 (default): Presentation of URCs is enabled for 15 seconds time after start-up of XT55. After 15 seconds operation, the presentation will be disabled, i.e. no alert messages can be generated. · URCs indicating the level "2" or "-2" are instantly followed by an orderly shutdown. The presentation of these URCs is always enabled, i.e. they will be output even though the factory setting AT^SCTM=0 was never changed. The maximum temperature ratings are stated in Table 26. Refer to Table 6 for the associated URCs. All statements are based on test conditions according to IEC 60068-2-2 (still air).
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 37 of 116 15.03.2004 Table 6: Temperature dependent behavior Sending temperature alert (15 s after start-up, otherwise only if URC presentation enabled) ^SCTM_A: 1 Caution: Tamb of battery close to over temperature limit. ^SCTM_B: 1 Caution: Tamb of board close to over temperature limit. ^SCTM_A: -1 Caution: Tamb of battery close to under temperature limit. ^SCTM_B: -1 Caution: Tamb of board close to under temperature limit. ^SCTM_A: 0 Battery back to uncritical temperature range. ^SCTM_B: 0 Board back to uncritical temperature range. Automatic shutdown (URC appears no matter whether or not presentation was enabled) ^SCTM_A: 2 Alert: Tamb of battery equal or beyond over temperature limit. XT55 switches off. ^SCTM_B: 2 Alert: Tamb of board equal or beyond over temperature limit. XT55 switches off. ^SCTM_A: -2 Alert: Tamb of battery equal or below under temperature limit. XT55 switches off. ^SCTM_B: -2 Alert: Tamb of board equal or below under temperature limit. XT55 switches off. 3.3.3.2 Temperature control during emergency call If the temperature limit is exceeded while an emergency call is in progress the engine continues to measure the temperature, but deactivates the shutdown functionality. If the temperature is still out of range when the call ends, the module switches off immediately (without another alert message). 3.3.3.3 Undervoltage shutdown if battery NTC is present In applications where the module’s charging technique is used and an NTC is connected to the GSM_BATT_TEMP terminal, the software constantly monitors the applied voltage. If the measured battery voltage is no more sufficient to set up a call the following URC will be presented: ^SBC: Undervoltage. The message will be reported, for example, when you attempt to make a call while the voltage is close to the critical limit and further power loss is caused during the transmit burst. To remind you that the battery needs to be charged soon, the URC appears several times before the module switches off. To enable or disable the URC use the AT^SBC command. The URC will be enabled when you enter the write command and specify the power consumption of your GSM application. Step by step instructions are provided in [1].
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 38 of 116 15.03.2004 3.3.3.4 Undervoltage shutdown if no battery NTC is present The undervoltage protection is also effective in applications, where no NTC connects to the GSM_BATT_TEMP terminal. Thus, you can take advantage of this feature even though the application handles the charging process or XT55 is fed by a fixed supply voltage. All you need to do is executing the write command AT^SBC=<current> which automatically enables the presentation of URCs. You do not need to specify <current>. Whenever the supply voltage falls below the specified value (see Table 28) the URC ^SBC: Undervoltage appears several times before the module switches off. 3.3.3.5 Overvoltage shutdown For overvoltage conditions, no software controlled shutdown is implemented. If the supply voltage exceeds the maximum value specified in Table 28, loss of data and even unrecoverable hardware damage can occur. Keep in mind that several XT55 components are directly linked to GSM_BATT+ and, therefore, the supply voltage remains applied at major parts of XT55. Especially the power amplifier is very sensitive to high voltage and might even be destroyed.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 39 of 116 15.03.2004 3.4 Automatic GPRS Multislot Class change Temperature control is also effective for operation in GPRS Multislot Class 10. If the board temperature increases to the limit specified for restricted operation1) while data are transmitted over GPRS, the module automatically reverts from GPRS Multislot Class 10 (2 Tx) to Class 8 (1Tx). This reduces the power consumption and, consequently, causes the board’s temperature to decrease. Once the temperature drops to a value of 5 degrees below the limit of restricted operation, XT55 returns to the higher Multislot Class. If the temperature stays at the critical level or even continues to rise, XT55 will not switch back to the higher class. After a transition from Multislot Class 10 to Multislot 8 a possible switchback to Multislot Class 10 is blocked for one minute. Please note that there is not one single cause of switching over to a lower GPRS Multislot Class. Rather it is the result of an interaction of several factors, such as the board temperature that depends largely on the ambient temperature, the operating mode and the transmit power. Furthermore, take into account that there is a delay until the network proceeds to a lower or, accordingly, higher Multislot Class. The delay time is network dependent. In extreme cases, if it takes too much time for the network and the temperature cannot drop due to this delay, the module may even switch off as described in chapter 3.3.3.1. 1) See Table 26 for temperature limits known as restricted operation.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 40 of 116 15.03.2004 3.5 GSM charging control The GSM/GPRS part of the XT55 module integrates a charging management for Li-Ion batteries. You can skip this chapter if charging is not your concern, or if you are not using the implemented charging algorithm. XT55 has no on-board charging circuit. To benefit from the implemented charging management you are required to install a charging circuit within your application. In this case, XT55 needs to be powered from a Li-Ion battery pack, e.g. as specified in Table 8. Note: The charging control described in this chapter is optimized for the GSM/GPRS part of XT55 only and does not cover the GPS part. To include the GPS part you need to change components illustrated in Figure 9, especially those of the trickle charging path (470R, 4V3, 1SS355). The module only delivers, via its GSM_POWER line and GSM_CHARGE line, the control signals needed to start and stop the charging process. The charging circuit should include a transistor and should be designed as illustrated in Figure 9. A list of parts recommended for the external circuit is given in Table 7. to GSM_BATT+Input fromcharger(5.5V - 8V)under loadCHARGE470R 1SS3553k3100nF 10kSI3441DV4V31/ 5 ESDA6V1-5W6to POWERGSM_BATT_TEMP1/ 5 ESDA6V1-5W6NTC+Battery packPCB spark gapCRS04- Figure 9: Schematic of approved charging transistor, trickle charging and ESD protection
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 41 of 116 15.03.2004 Table 7: Bill of material for external charging circuit Part Description First supplier Second supplier SI3441DV p-chan 2.5V (G-S) MOSFET (TSOP-6) VISHAY: SI3441DV-T1 NEC: UPA1911TE-T11SS355 100mA Si-diode (UMD2) ROHM: 1SS355TE-18 Toshiba: 1SS352TPH3 CRS04 1A Schottky diode Toshiba: CRS04 - 4V3 250mW; 200mA; 4.3V Z-Diode (SOD323) Philips: PDZ4.3B ROHM: UDZS4.3B UDZ4.3B ESDA6V1-5W6 ESD protection TRANSIL™ array STM: ESDA6V1-5W6 - 470R, 3k3, 10k Resistor, e.g. 0805 or 0603 - - 100nF Ceramic capacitor 50V - - PCB spark gap 0.2mm spark gap on PCB - -
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 42 of 116 15.03.2004 3.5.1 Battery pack characteristics The charging algorithm has been optimized for a Li-Ion battery pack that meets the characteristics listed below. It is recommended that the battery pack you want to integrate into your XT55 application is compliant with these specifications. This ensures reliable operation, proper charging and, particularly, allows you to monitor the battery capacity using the AT^SBC command (see [1] for details). Failure to comply with these specifications might cause AT^SBC to deliver incorrect battery capacity values. A battery pack especially designed to operate with XT55 modules is specified in Chapter 3.5.2. · Li-Ion battery pack specified for a maximum charging voltage of 4.2 V and a capacity of 800 mAh. Battery packs with a capacity down to 600 mAh or more than 800 mAh are allowed, too. · Since charging and discharging largely depend on the battery temperature, the battery pack should include an NTC resistor. If the NTC is not inside the battery it must be in thermal contact with the battery. The NTC resistor must be connected between GSM_BATT_TEMP and GND. Required NTC characteristics are: 10 kΩ +5% @ 25°C, B25/85 = 3435K +3% (alternatively acceptable: 10 kΩ +2% @ 25°C, B25/50 = 3370K +3%). Please note that the NTC is indispensable for proper charging, i.e. the charging process will not start if no NTC is present. · Ensure that the pack incorporates a protection circuit capable of detecting overvoltage (protection against overcharging), undervoltage (protection against deep discharging) and overcurrent. The circuit must be insensitive to pulsed current. · On the XT55 module, a built-in measuring circuit constantly monitors the supply voltage. In the event of undervoltage, it causes XT55 to power down. Undervoltage thresholds are specific to the battery pack and must be evaluated for the intended model. When you evaluate undervoltage thresholds, consider both the current consumption of XT55 and of the application circuit. · The internal resistance of the battery and the protection should be as low as possible. It is recommended not to exceed 150m", even in extreme conditions at low temperature. The battery cell must be insensitive to rupture, fire and gassing under extreme conditions of temperature and charging (voltage, current). · The battery pack must be protected from reverse pole connection. For example, the casing should be designed to prevent the user from mounting the battery in reverse orientation. · The battery pack must be approved to satisfy the requirements of CE conformity. Figure 10 shows the circuit diagram of a typical battery pack design that includes the protection elements described above. Figure 10: Battery pack circuit diagram to GSM_BATT_TEMP to GNDNTCPolyfuseJProtection Circuit+-Battery cellto GSM_BATT+
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 43 of 116 15.03.2004 3.5.2 Recommended battery pack specification Table 8: Specifications of recommended battery pack Nominal voltage 3.6V Capacity 800mAh NTC 10k" ± 5% @ 25°C, B (25/85)=3435K ± 3% Overcharge detection voltage 4.325 ± 0.025V Overcharge release voltage 4.075 ± 0.025V Overdischarge detection voltage 2.5 ± 0.05V Overdischarge release voltage 2.9 ± 0.5V Overcurrent detection 3 ± 0.5A Nominal working current <5µA Current of low voltage detection 0.5µA Overcurrent detection delay time 8~16ms Short detection delay time 50µs Overdischarge detection delay time 31~125ms Overcharge detection delay time 1s Internal resistance <130m"
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 44 of 116 15.03.2004 3.5.3 Implemented charging technique If the external charging circuit follows the recommendation of Figure 9, the charging process consists of trickle charging and processor controlled fast charging. For this solution, the fast charging current provided by the charger or any other external source must be limited to 500mA. Trickle charging · Trickle charging starts when the charger is connected to the charger input of the external charging circuit and the module’s GSM_POWER pin. The charging current depends on the voltage difference between the charger input of the external charging circuit and GSM_BATT+ of the module. · Trickle charging stops when the battery voltage reaches 3.6V. Fast charging · After trickle charging has raised the battery voltage to 3.2V within 60 minutes +10% from connecting the charger, the power ASIC turns on and wakes up the baseband processor. Now, processor controlled fast charging begins. If the battery voltage was already above 3.2V, processor controlled fast charging starts just after the charger was connected to the charger input of the external charging circuit and the module’s GSM_POWER pin. If the GSM/GPRS part of the XT55 was in POWER DOWN mode, it turns on and enters the Charge-only mode along with fast charging (see also Chapter 3.3.1.3). · Fast charging delivers a constant current until the battery voltage reaches 4.2V and then proceeds with varying charge pulses. As shown in Figure 5, the pulse duty cycle is reduced to adjust the charging procedure and prevent the voltage from overshooting beyond 4.2V. Once the pulse width reaches the minimum of 100ms and the duty cycle does not change for 2 minutes, fast charging is completed. · Fast charging can only be accomplished in a temperature range from 0°C to +45°C. 4.34.23.8Voltage3.43.0Constant current tOFF = 100 ms tON = 100 ms Time100ms 2 ... 0.1s 100ms 0.1 ... 2s Figure 11: Charging process
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 45 of 116 15.03.2004 Note: Do not connect the charger to the GSM_BATT+ lines. Only the charger input of the external charging circuit is intended as input for charging current! The GSM_POWER pin of XT55 is the input only for indicating a connected charger! The battery manufacturer must guarantee that the battery complies with the described charging technique. What to do if software controlled charging does not start up? If trickle charging fails to raise the battery voltage to 3.2V within 60 minutes +10%, processor controlled charging does not begin. To start fast charging you can do one of the following: · Once the voltage has risen above its minimum of 3V, you can try to start software controlled charging by pulling the GSM_IGT line to ground. · If the voltage is still below 3V, driving the GSM_IGT line to ground switches the timer off. Without the timer running, the GSM/GPRS part of the XT55 module will not proceed to software controlled charging. To restart the timer you are required to shortly disconnect and reconnect the charger. 3.5.4 Operating modes during charging Of course, the battery can be charged regardless of the engine's operating mode. When the GSM engine is in Normal mode (SLEEP, IDLE, TALK, GPRS IDLE or GPRS DATA mode), it remains operational while charging is in progress (provided that sufficient voltage is applied). The charging process during the Normal mode is referred to as Charge mode. If the charger is connected to the charger input of the external charging circuit and the module’s GSM_POWER pin while GSM/GPRS part of XT55 is in POWER DOWN mode, the GSM/GPRS part of the XT55 goes into Charge-only mode. Table 9: Comparison Charge-only and Charge mode How to activate mode Features Charge mode Connect charger to charger input of external charging circuit and module’s GSM_POWER pin while the GSM/GPRS part of the XT55 is · operating, e.g. in IDLE or TALK mode · in SLEEP mode · Battery can be charged while GSM engine remains operational and registered to the GSM network. · In IDLE and TALK mode, the serial interfaces are accessible. AT command set can be used to full extent. · In the NON-CYCLIC SLEEP mode, the serial interfaces are not accessible at all. During the CYCLIC SLEEP mode they can be used as described in Chapter 3.6.3. Charge-only mode Connect charger to charger input of external charging circuit and module’s GSM_POWER pin while the GSM/GPRS part of the XT55 is · in POWER DOWN mode · in Normal mode: Connect charger to the GSM_POWER pin, then enter AT^SMSO. IMPORTANT: While trickle charging is in progress, be sure that the application is switched off. If the application is fed from the trickle charge current the module might be prevented from proceeding to software controlled charging since the current would not be sufficient. · Battery can be charged while GSM engine is deregistered from GSM network. · Charging runs smoothly due to constant current consumption. · The AT interface is accessible and allows to use the commands listed below.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 46 of 116 15.03.2004 Features of Charge-only mode Once the GSM engine enters the Charge-only mode, the AT command interface presents an Unsolicited Result Code (URC) which reads: ^SYSSTART CHARGE-ONLY MODE Note that this URC will not appear when autobauding was activated (due to the missing synchronization between DTE and DCE upon start-up). Therefore, it is recommended to select a fixed baudrate before using the Charge-only mode. While the Charge-only mode is in progress, you can only use the AT commands listed in Table 10. For further instructions refer to the AT Command Set supplied with your GSM engine. Table 10: AT commands available in Charge-only mode AT command Function AT+CALA Set alarm time AT+CCLK Set date and time of RTC AT^SBC Monitor charging process Note: While charging is in progress, no battery capacity value is available. To query the battery capacity disconnect the charger. If the charger connects externally to the host device no charging parameters are transferred to the module. In this case, the command cannot be used. AT^SCTM Query temperature range, enable/disable URCs to report critical temperature rangesAT^SMSO Power down GSM engine To proceed from Charge-only mode to normal operation, it is necessary to drive the ignition line to ground. This must be implemented in your host application as described in Chapter 3.3.1.1. See also Chapter 3.7 which summarizes the various options of changing the mode of operation. If your host application uses the GSM_SYNC pin to control a status LED as described in Chapter 3.12.2.2, please note that the LED is off while the GSM engine is in Charge-only mode. 3.5.5 Charger requirements If you are using the implemented charging technique and the charging circuit recommended in Figure 9, the charger must be designed to meet the following requirements: a) Simple transformer power plug - Output voltage: 5.5V...8V (under load) - The charge current must be limited to 500mA - Voltage spikes that may occur while you connect or disconnect the charger must be limited. - There must not be any capacitor on the secondary side of the power plug (avoidance of current spikes at the beginning of charging) b) Supplementary requirements for a) to ensure a regulated power supply - When current is switched off a voltage peak of 10V is allowed for a maximum 1ms - When current is switched on a spike of 1.6A for 1ms is allowed
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 47 of 116 15.03.2004 3.6 Power saving SLEEP mode reduces the functionality of the GSM/GPRS part of the XT55 module to a minimum and, thus, minimizes the current consumption to the lowest level. Settings can be made using the AT+CFUN command. For details see below and [1]. SLEEP mode falls into two categories: · NON-CYCLIC SLEEP mode AT+CFUN=0 · CYCLIC SLEEP modes, selectable with AT+CFUN=5, 6, 7, 8 or 9. IMPORTANT: Please keep in mind that power saving works properly only when PIN authentication has been done. If you attempt to activate power saving while the SIM card is not inserted or the PIN not correctly entered, the selected <fun> level will be set, though power saving does not take effect. For the same reason, power saving cannot be used if the GSM/GPRS part of the XT55 operates in Alarm mode. To check whether power saving is on, you can query the status of AT+CFUN if you have chosen CYCLIC SLEEP mode. If available, you can take advantage of the status LED controlled by the GSM_SYNC pin (see Chapter 3.12.2.2). The LED stops flashing once the module starts power saving. The wake-up procedures are quite different depending on the selected SLEEP mode. Table 11 compares the wake-up events that can occur in NON-CYCLIC and CYCLIC SLEEP modes. 3.6.1 No power saving (AT+CFUN=1) The functionality level <fun>=1 is where power saving is switched off. This is the default after startup. 3.6.2 NON-CYCLIC SLEEP mode (AT+CFUN=0) If level 0 has been selected (AT+CFUN=0), the serial interface is blocked. The module shortly deactivates power saving to listen to a paging message sent from the base station and then immediately resumes power saving. Level 0 is called NON-CYCLIC SLEEP mode, since the serial interface is not alternatingly made accessible as in CYCLIC SLEEP mode. The first wake-up event fully activates the module, enables the serial interface and terminates the power saving mode. In short, it takes the GSM/GPRS part of the XT55 back to the highest level of functionality <fun>=1. GSM_RTS0 or GSM_RTS1 are not used for flow control, but to wake up the module. 3.6.3 CYCLIC SLEEP mode (AT+CFUN=5, 6, 7, 8) The major benefit over the NON-CYCLIC SLEEP mode is that the serial interface is not permanently blocked and that packet switched calls may go on without terminating the selected CYCLIC SLEEP mode. This allows the GSM/GPRS part of the XT55 to become active, for example to perform a GPRS data transfer, and to resume power saving after the GPRS data transfer is completed.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 48 of 116 15.03.2004 The CYCLIC SLEEP modes give you greater flexibility regarding the wake-up procedures: For example, in all CYCLIC SLEEP modes, you can enter AT+CFUN=1 to permanently wake up the module. In modes CFUN=7 and 8, the GSM/GPRS part of the XT55 automatically resumes power saving, after you have sent or received a short message or made a call. CFUN=5 and 6 do not offer this feature, and therefore, are only supported for compatibility with earlier releases. Please refer to Table 11 for a summary of all modes. The CYCLIC SLEEP mode is a dynamic process which alternatingly enables and disables the serial interface. By setting/resetting the GSM_CTS signal, the module indicates to the application whether or not the UART is active. The timing of GSM_CTS is described below. Both the application and the module must be configured to use hardware flow control (RTS/CTS handshake). The default setting of the GSM/GPRS part of the XT55 is AT\Q0 (no flow control) which must be altered to AT\Q3. See [1] for details. Note: If both serial interfaces ASC0 and ASC1 are connected, both are synchronized. This means that SLEEP mode takes effect on both, no matter on which interface the AT command was issued. Although not explicitly stated, all explanations given in this chapter refer equally to ASC0 and ASC1, and accordingly to GSM_CTS0 and GSM_CTS1. 3.6.4 CYCLIC SLEEP mode AT+CFUN=9 Mode AT+CFUN=9 is similar to AT+CFUN=7 or 8, but provides two additional features: · GSM_RTS0 and GSM_RTS1 are not intended for flow control (as in modes AT+CFUN=5, 6, 7 or 8), but can be used to temporarily wake up the module. This way, the module can quickly wake up and resume power saving, regardless of the GSM_CTS timing controlled by the paging cycle. · The time the module stays active after GSM_RTS was asserted or after the last character was sent or received, can be configured individually using the command AT^SCFG. Default setting is 2 seconds like in AT+CFUN=7. The entire range is from 0.5 seconds to 1 hour, selectable in tenths of seconds. For details see [1]. 3.6.5 Timing of the GSM_CTS signal in CYCLIC SLEEP modes The GSM_CTS signal is enabled in synchrony with the module’s paging cycle. It goes active low each time when the module starts listening to a paging message block from the base station. The timing of the paging cycle varies with the base station. The duration of a paging interval can be calculated from the following formula: 4.615 ms (TDMA frame duration) * 51 (number of frames) * DRX value. DRX (Discontinuous Reception) is a value from 2 to 9, resulting in paging intervals from 0.47 to 2.12 seconds. The DRX value of the base station is assigned by the network operator. Each listening period causes the GSM_CTS signal to go active low: If DRX is 2, the GSM_CTS signal is activated every 0.47 seconds, if DRX is 3, the GSM_CTS signal is activated every 0.71 seconds and if DRX is 9, the GSM_CTS signal is activated every 2.1 seconds. The GSM_CTS signal is active low for 4.6 ms. This is followed by another 4.6 ms UART activity. If the start bit of a received character is detected within these 9.2 ms, GSM_CTS will be activated and the proper reception of the character will be guaranteed.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 49 of 116 15.03.2004 GSM_CTS will also be activated if any character is to be sent. After the last character was sent or received the interface will remain active for · another 2 seconds, if AT+CFUN=5 or 7, · another 10 minutes, if AT+CFUN=6 or 8, · or for an individual time defined with AT^SCFG, if AT+CFUN=9. Assertion of GSM_RTS has the same effect. In the pauses between listening to paging messages, while GSM_CTS is high, the module resumes power saving and the AT interface is not accessible. See Figure 12 and Figure 13. 2.12 s4.6 ms 4.6 ms 4.6 ms 4.6 ms2.12 s 2.12 sGSM _ CT SAT interface disabled AT interface enabledPaging message Paging message Paging message Paging message4.6ms 4.6ms 4.6ms4.6ms Figure 12: Timing of CTS signal (example for a 2.12 s paging cycle) Figure 13 illustrates the CFUN=5 and CFUN=7 modes, which reset the GSM_CTS signal 2 seconds after the last character was sent or received. 2.12 s4.6 ms2 s 4.6 ms 4.6 ms2.12 s 2.12 sAT interface disabled AT interface enabled1 characterstLast characterBeginning of power savingPaging message Paging message Paging message Paging message4.6ms 4.6msGSM_CTS Figure 13: Beginning of power saving if CFUN=5 or 7
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 50 of 116 15.03.2004 3.6.6 Wake up XT55 from SLEEP mode A wake-up event is any event that causes the module to draw current. Depending on the selected mode the wake-up event either switches SLEEP mode off and takes XT55 back to AT+CFUN=1, or activates XT55 temporarily without leaving the current SLEEP mode. Definitions of the state transitions described in Table 11: Quit = XT55 exits SLEEP mode and returns to AT+CFUN=1. Temporary = XT55 becomes active temporarily for the duration of the event and the mode-specific follow-up time after the last character was sent or received on the serial interface. No effect: = Event is not relevant in the selected SLEEP mode. XT55 does not wake up. Table 11: Wake-up events in NON-CYCLIC and CYCLIC SLEEP modes Event Selected mode AT+CFUN=0 Selected mode AT+CFUN=5 or 6 Selected mode AT+CFUN=7, 8, 9 Ignition line No effect No effect No effect GSM_RTS0 or GSM_RTS1 1) (falling edge) Quit No effect (GSM_RTS is only used for flow control) Mode 7 and 8: No effect (GSM_RTS is only used for flow control) Mode 9: Temporary Unsolicited Result Code (URC) Quit Quit Temporary Incoming voice or data call Quit Quit Temporary Any AT command (incl. outgoing voice or data call, outgoing SMS) Not possible (UART disabled) Temporary Temporary Incoming SMS depending on mode selected by AT+CNMI: AT+CNMI=0,0 (= default, no indication of received SMS) AT+CNMI=1,1 (= displays URC upon receipt of SMS) No effect Quit No effect Quit No effect Temporary GPRS data transfer Not possible (UART disabled) Temporary Temporary RTC alarm2) Quit Quit Temporary AT+CFUN=1 Not possible (UART disabled) Quit Quit 1) During the CYCLIC SLEEP modes 5, 6, 7, and 8, GSM_RTS0 and GSM_RTS1 are conventionally used for flow control: The assertion of GSM_RTS0 or GSM_RTS1 signals that the application is ready to receive data - without waking up the module. If the module is in CFUN=0 mode the assertion of GSM_RTS0 and GSM_RTS1 serves as a wake-up event, giving the application the possibility to intentionally terminate power saving. If the module is in CFUN=9 mode, the assertion of GSM_RTS0 or
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 51 of 116 15.03.2004 GSM_RTS1 can be used to temporarily wake up XT55 for the time specified with the AT^SCFG command (default = 2s). 2) Recommendation: In NON-CYCLIC SLEEP mode, you can set an RTC alarm to wake up XT55 and return to full functionality. This is a useful approach because, in this mode, the AT interface is not accessible.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 52 of 116 15.03.2004 3.7 Summary of state transitions (except SLEEP mode) Table 12: State transitions of XT55 (except SLEEP mode) The table shows how to proceed from one GSM/GPRS mode to another (grey column = present mode, white columns = intended modes) Further mode èèè Present mode POWER DOWN Normal mode**) Charge-only mode*) Charging in normal mode*)**) Alarm mode POWER DOWN mode without charger --- GSM_IGT >100 ms at low level Connect charger to input of ext. charging circuit and GSM_POWER pin (high level at GSM_POWER) No direct transition, but via “Charge-only mode” or “Normal mode” Wake-up from POWER DOWN mode (if activated with AT+CALA) POWER DOWN mode with charger (high level at GSM_POWER pin of XT55) --- GSM_IGT >1 s at low level, if battery is fully charged 100ms < GSM_IGT < 500ms at low level GSM_IGT >1 s at low level Wake-up from POWER DOWN mode (if activated with AT+CALA) Normal mode**) AT^SMSO or exceptionally GSM_EMERGOFF pin > 3.2s at low level --- No automatic transition, but via “POWER DOWN” Connect charger to GSM_POWER pin at XT55 (high level at GSM_POWER) AT+CALA followed by AT^SMSO. XT55 enters Alarm mode when specified time is reached. Charge-only mode *) Disconnect charger (XT55 GSM_POWER pin at low level) or AT^SMSO or exceptionally GSM_EMERGOFF pin >3.2s at low level No automatic transition, but via “Charge in Normal mode” --- GSM_IGT >1s at low level AT+CALA followed by AT^SMSO. XT55 enters Alarm mode when specified time is reached and VGSM_BATT+>3.2V Charging in normal mode*) **) AT^SMSO è “Charge-only mode”, again AT^SMSO or exceptionally GSM_EMERGOFF pin >3.2s at low level Disconnect charger from input of ext. charging circuit and module’s GSM_POWER pin AT^SMSO --- No direct transition Alarm mode AT^SMSO or exceptionally GSM_EMERGOFF pin >3.2s at low level GSM_IGT >100ms at low level AT^SMSO if charger is connected GSM_IGT >100ms at low level --- *) See Chapter 3.5.4 for details on the charging mode **) Normal mode covers TALK, DATA, GPRS, IDLE and SLEEP modes
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 53 of 116 15.03.2004 3.8 RTC backup for GSM/GPRS part of XT55 The internal Real Time Clock of the XT55 GSM/GPRS part is supplied from a separate voltage regulator in the power supply ASIC which is also active when the GSM/GPRS part of the XT55 is in POWER DOWN status. An alarm function is provided that allows to wake up XT55 without logging on to the GSM network. In addition, you can use the GSM_VDDLP pin on the board-to-board connector to backup the RTC from an external capacitor or a battery (rechargeable or non-chargeable). The capacitor is charged by the GSM_BATT+ line of XT55. If the voltage supply at GSM_BATT+ is disconnected the RTC can be powered by the capacitor. The size of the capacitor determines the duration of buffering when no voltage is applied to the GSM/GPRS part of the XT55, i.e. the greater capacitor the longer the GSM/GPRS part of the XT55 will save the date and time. The following figures show various sample configurations. The voltage applied at GSM_VDDLP can be in the range from 2 to 5.5V. Please refer to Table 27 for the parameters required. Baseband processor RTC PSU+GSM_BATT+ 1kB2BGSM_VDDLP Figure 14: RTC supply from capacitor RTC PSU+GSM_BATT+ 1kB2BGSM_VDDLPBaseband processor Figure 15: RTC supply from rechargeable battery RTC PSU++GSM_BATT+ 1kGSM_VDDLPB2BBaseband processor Figure 16: RTC supply from non-chargeable battery
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 54 of 116 15.03.2004 3.9 Serial interfaces of the XT55 GSM/GPRS part The GSM/GPRS part of the XT55 module offers two unbalanced, asynchronous serial interfaces conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or ON condition) and 2.65V (for high data bit or OFF condition). For electrical characteristics please refer to Table 38. Figure 1 shows the serial interfaces of the XT55 module. The GSM engine is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals: ASC0 · Port TXD @ application sends data to the module’s GSM_TXD0 signal line · Port RXD @ application receives data from the module’s GSM_RXD0 signal line ASC1 · Port TXD @ application sends data to module’s GSM_TXD1 signal line · Port RXD @ application receives data from the module’s GSM_RXD1 signal line 3.9.1 Features supported on the first serial interface of GSM/GPRS part (ASC0) · 8-wire serial interface · Includes the data lines GSM_TXD0 and GSM_RXD0, the status lines GSM_RTS0 and GSM_CTS0 and, in addition, the modem control lines GSM_DTR0, GSM_DSR0, GSM_DCD0 and GSM_RING0. · It is primarily designed for voice calls, CSD calls, fax calls and GPRS services and for controlling the GSM engine with AT commands. Full Multiplex capability allows the interface to be partitioned into three virtual channels, yet with CSD and fax services only available on the first logical channel. Please note that when the ASC0 interface runs in Multiplex mode, ASC1 cannot be used. For more detailed characteristics see [12]. · The GSM_DTR0 signal will only be polled once per second from the internal firmware of XT55. · The GSM_RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). It can also be used to send pulses to the host application, for example to wake up the application from power saving state. For further details see Chapter 3.12.2.3. · Autobauding is only selectable on ASC0 and supports the following bit rates: 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400 bps. · Autobauding is not compatible with multiplex mode, see [12]. · ASC0 interface is intended for firmware upgrade of the GSM/GPRS part
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 55 of 116 15.03.2004 3.9.2 Features supported on the second serial interface of GSM/GPRS part (ASC1) · 4-wire serial interface · Includes only the data lines GSM_TXD1 and GSM_RXD1 plus GSM_RTS1 and GSM_CTS1 for hardware handshake. This interface is intended for voice calls, GPRS services and for controlling the GSM engine with AT commands. It is not suited for CSD calls, fax calls and Multiplex mode. · On ASC1 no GSM_RING line is available. The indication of URCs on the second interface depends on the settings made with the AT^SCFG command. For details refer to [1]. 3.9.3 ASC0 and ASC1 configuration · Both interfaces are configured for 8 data bits, no parity and 1 stop bit, and can be operated at bit rates from 300bps to 230400 bps. · XON/XOFF software flow control can be used on both interfaces (except if power saving is active). Table 13: DCE-DTE wiring of 1st serial interface (GSM/GPRS part) DCE (XT55) DTE (application) V.24 circuit Pin function Signal direction Pin function Signal direction 103 GSM_TXD0 Input /TXD Output 104 GSM_RXD0 Output /RXD Input 105 GSM_RTS0 Input /RTS Output 106 GSM_CTS0 Output /CTS Input 108/2 GSM_DTR0 Input /DTR Output 107 GSM_DSR0 Output /DSR Input 109 GSM_DCD0 Output /DCD Input 125 GSM_RING0 Output /RING Input Table 14: DCE-DTE wiring of 2nd serial interface (GSM/GPRS part) DCE (XT55) DTE (application) V.24 circuit Pin function Signal direction Pin function Signal direction 103 GSM_TXD1 Input /TXD Output 104 GSM_RXD1 Output /RXD Input 105 GSM_RTS1 Input /RTS Output 106 GSM_CTS1 Output /CTS Input
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 56 of 116 15.03.2004 3.10 Audio interfaces XT55 comprises three audio interfaces available on the board-to-board connector: · Two analog audio interfaces, each with a balanced analog microphone input and a balanced analog earpiece output. The second analog interface provides a supply circuit to feed an active microphone. · Serial digital audio interface (DAI) using PCM (Pulse Code Modulation) to encode analog voice signals into digital bit streams. This means you can connect up to three audio devices in any combination, although analog and digital audio cannot be operated at the same time. Using the AT^SAIC command you can easily switch back and forth. M U X ADC DSP DACAir InterfaceDigital Audio Interface (DAI) GSM_MICP1 GSM_MICN1 GSM_MICP2 GSM_MICN2 GSM_EPP1 GSM_EPN1 GSM_EPP2 GSM_EPN2 GSM_SCLK GSM_RXDDAI GSM_TFSDAI GSM_RFSDAI GSM_TXDDAI Figure 17: Audio block diagram XT55 offers six audio modes which can be selected with the AT^SNFS command, no matter which of the three interfaces is currently active. The electrical characteristics of the voiceband part vary with the audio mode. For example, sending and receiving amplification, sidetone paths, noise suppression etc. depend on the selected mode and can be altered with AT commands (except for mode 1). On each audio interface you can use all audio AT commands specified in [1] to alter parameters. The only exception are the DAC and ADC gain amplifier attenuation <outBbcGain> and <inBbcGain> which cannot be modified when the digital audio interface is used, since in this case the DAC and ADC are switched off. Please refer to Chapter 3.10 for specifications of the audio interface and an overview of the audio parameters. Detailed instructions on using AT commands are presented in [1]. Table 31 on page 101 summarizes the characteristics of the various audio modes and shows what parameters are supported in each mode.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 57 of 116 15.03.2004 When shipped from factory, all audio parameters of XT55 are set to interface 1 and audio mode 1. This is the default configuration optimized for the Votronic HH-SI-30.3/V1.1/0 handset and used for type approving the Siemens reference configuration. Audio mode 1 has fix parameters which cannot be modified. To adjust the settings of the Votronic handset simply change to another audio mode. In transmit direction, all audio modes contain internal scaling factors (digital amplification) that are not accessible by the user. To avoid saturation with a full scale digital input signal on the DAI, and to obtain a one-to-one digital access to the speech coder in audio mode 5 and 6, it is recommended to set the parameter <inCalibrate> of the selected audio mode as follows: Audio mode 1 and 4: 23196 Audio mode 2: 17396 Audio mode 3: 21901 Audio mode 5 and 6: 21402 3.10.1 Microphone circuit Interface 1 This interface has no microphone supply circuit and therefore, has an impedance of 50kW. When connecting a microphone or another signal source to interface 1 you are required to add two 100 nF capacitors, one to each line. Interface 2 This interface comes with a microphone supply circuit and can be used to feed an active microphone. It has an impedance of 2kW. If you do not use it or if you want to connect another type of signal source, for example, an op amp or a dynamic microphone, it needs to be decoupled with capacitors. The power supply can be switched off and on by using the command AT^SNFM. For details see [1]. Figure 18 shows the microphone inputs at both analog interfaces of XT55. 2.65 V to ADC Power down GSM_MICP1 GSM_MICN1 GSM_MICP2 GSM_MICN2 1 k" 1 k" 1 k" 1 k"33 µF Ri=50k" Ri=2k" Figure 18: Schematic of microphone inputs
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 58 of 116 15.03.2004 3.10.2 Speech processing The speech samples from the ADC or DAI are handled by the DSP of the baseband controller to calculate e.g. amplifications, sidetone, echo cancellation or noise suppression depending on the configuration of the active audio mode. These processed samples are passed to the speech encoder. Received samples from the speech decoder are passed to the DAC or DAI after post processing (frequency response correction, adding sidetone etc.). Full rate, half rate, enhanced full rate, adaptive multi rate (AMR), speech and channel encoding including voice activity detection (VAD) and discontinuous transmission (DTX) and digital GMSK modulation are also performed on the GSM baseband processor. Customer specific audio parameters can be evaluated and supplied by Siemens on request. These parameters can be downloaded to XT55 using an AT command. For further information refer to [10] or contact your Siemens distributor. 3.10.3 DAI timing To support the DAI function, XT55 integrates a simple five-line serial interface with one input data clock line (GSM_SCLK) and input / output data and frame lines (GSM_TXDDAI, GSM_TFSDAI, GSM_RXDDAI, GSM_RFSDAI). The serial interface is always active if the external input data clock GSM_SLCK is present, i.e. the serial interface is not clocked by the DSP of the XT55 baseband processor. GSM_SLCK must be supplied from the application and can be in a frequency range between 0.2 and 10 MHz. Serial transfer of 16-bit words is done in both directions. Data transfer to the application is initiated by the module via a short pulse of GSM_TFSDAI. The duration of the GSM_TFSDAI pulse is one GSM_SCLK period, starting at the rising edge of SLCK. During the following 16 SLCK cycles, the 16-bit sample will be transferred on the GSM_TXDDAI line. The next outgoing sample will be transferred after the next GSM_TFSDAI pulse which occurs every 125 µs. The GSM_TFSDAI pulse is the master clock of the sample transfer. From the rising edge of the GSM_TFSDAI pulse, the application has 100 µs to transfer the 16-bit input sample on the GSM_RXDDAI line. The rising edge of the GSM_RFSDAI pulse (supplied by the application) may coincide with the falling edge of GSM_TFSDAI or occur slightly later - it is only significant that, in any case, the transfer of the LSB input sample will be completed within the specified duration of 100 µs. Audio samples are transferred from the module to the application in an average of 125µs. This is determined by the 8kHz sampling rate, which is derived from and synchronized to the GSM network. As SLCK is independent of the GSM network, the distance between two succeeding sample transfers may vary about + 1 SLCK period. The application is required to adapt its sampling rate to the GSM_TFSDAI rate. Failure to synchronize the timing between the module and the application may cause audible pops and clicks in a conversation. The timing characteristics of both data transfer directions are shown in Figure 19 and Figure 20.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 59 of 116 15.03.2004 Note: Before starting the data transfer the clock GSM_SCLK should be available for at least three cycles. After the transfer of the LSB0 the clock GSM_SCLK should be still available for at least three cycles. GSM_SLCKGSM_RFSDAIGSM_RXDDAI(input)Internalsignal(input)(input)FlagT = 100ns to 5,000 nsminimum possible distance = 25 bit periods= T= T = TMSB15Bit14Bit13Bit12Bit11Bit10Bit9Bit8Bit7Bit6Bit5Bit4Bit3Bit2Bit1LSB0MSB15automatic reset afterreading to DAIRDinterrupt on INTOafter 3 DSP cycles< 1.5 SCLKcycles< 1 DSP cycle Figure 19: DAI timing on transmit path GSM_SLCKGSM_TFSDAIGSM_TXDDAI(input)Internalsignal(output)FlagT = 100ns to 5,000 nsminimum possible distance = 25 bit periods= T= T = TMSB15Bit14Bit13Bit12Bit11Bit10Bit9Bit8Bit7Bit6Bit5Bit4Bit3Bit2Bit1LSB0MSB15interrupt on INTOafter 3 DSP cycles<1 DSPcycles(output)<2 DSPcycles<3 SCLKcyclesautomatic reset after writing to DAITD Figure 20: DAI timing on receive path
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 60 of 116 15.03.2004 3.11 SIM interface The baseband processor has an integrated SIM interface compatible with the ISO 7816 IC Card standard. This is wired to the host interface (board-to-board connector) in order to be connected to an external SIM card holder. Six pins on the board-to-board connector are reserved for the SIM interface. The GSM_CCIN pin serves to detect whether a tray (with SIM card) is present in the card holder. Using the GSM_CCIN pin is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during operation. See Chapter 3.11.1 for details. It is recommended that the total cable length between the board-to-board connector pins on XT55 and the pins of the SIM card holder does not exceed 200 mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance. Table 15: Signals of the SIM interface (board-to-board connector) Signal Description GSM_CCGND Separate ground connection for SIM card to improve EMC. GSM_CCCLK Chipcard clock, various clock rates can be set in the baseband processor. GSM_CCVCC SIM supply voltage from PSU-ASIC GSM_CCIO Serial data line, input and output. GSM_CCRST Chipcard reset, provided by baseband processor. GSM_CCIN Input on the baseband processor for detecting a SIM card tray in the holder. The GSM_CCIN pin is mandatory for applications that allow the user to remove the SIM card during operation. The GSM_CCIN pin is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of XT55.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 61 of 116 15.03.2004 3.11.1 Requirements for using the GSM_CCIN pin According to ISO/IEC 7816-3 the SIM interface must be immediately shut down once the SIM card is removed during operation. Therefore, the signal at the GSM_CCIN pin must go low before the SIM card contacts are mechanically detached from the SIM interface contacts. This shut-down procedure is particularly required to protect the SIM card as well as the SIM interface of XT55 from damage. An appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been tested to operate with XT55 and is part of the Siemens reference equipment submitted for type approval. Molex ordering number is 91228-0001, see also Chapter 9. The module’s startup procedure involves a SIM card initialization performed within 1 second after getting started. An important issue is whether the initialization procedure ends up with a high or low level of the GSM_CCIN signal: a) If, during startup of XT55, the GSM_CCIN signal on the SIM interface is high, then the status of the SIM card holder can be recognized each time the card is inserted or ejected. A low level of GSM_CCIN indicates that no SIM card tray is inserted into the holder. In this case, the module keeps searching, at regular intervals, for the SIM card. Once the SIM card tray with a SIM card is inserted, GSM_CCIN is taken high again. b) If, during startup of XT55, the GSM_CCIN signal is low, the module will also attempt to initialize the SIM card. In this case, the initialization will only be successful when the card is present. If the SIM card initialization has been done, but the card is no more operational or removed, then the module will never search again for a SIM card and only emergency calls can be made. Removing and inserting the SIM card during operation requires the software to be reinitialized. Therefore, after reinserting the SIM card it is necessary to restart XT55. It is strongly recommended to connect the contacts of the SIM card detect switch to the GSM_CCIN input and to the GSM_CCVCC output of the module as illustrated in the sample diagram in Figure 21. Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializing any SIM card that the user inserts after having removed a SIM card during operation. In this case, the application must restart XT55.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 62 of 116 15.03.2004 3.11.2 Design considerations for SIM card holder The schematic below is a sample configuration that illustrates the Molex SIM card holder located on the DSB45 Support Box (evaluation kit used for type approval of the Siemens XT55 reference setup, see [7]). X503 is the designation used for the SIM card holder in [7]. Molex card holder GSM moduleGSM_CCVCCGSM_CCINGSM_CCIOGSM_CCCLKGSM_CCRSTGSM_CCGND Figure 21: SIM card holder of DSB45 Support Box Table 16: Pin assignment of Molex SIM card holder on DSB45 Support Box Pin no. Signal name I/O Function 1 CCVCC I Supply voltage for SIM card, generated by the GSM engine 2 CCRST I Chip card reset, prompted by the GSM engine 3 CCCLK I Chip card clock 4 CCGND - Individual ground line for the SIM card to improve EMC 5 CCVPP - Not connected 6 CCIO I/O Serial data line, bi-directional 7 CCDET1 - Connect to GSM_CCVCC 8 CCDET2 Connects to the GSM_CCIN input of the GSM engine. Serves to recognize whether a SIM card is in the holder. Pins 1 through 8 (except for 5) are the minimum requirement according to the GSM Recommendations, where pins 7 and 8 are needed for SIM card tray detection through the GSM_CCIN pin. Figure 22: Pin numbers of Molex SIM card holder on DSB45 Support Box Place the capacitors C1205 and C1206 (or instead one capacitor of 200nF) as close as possible to the pins 1 (CCVCC) and 4 (GND) of the card holder. Connect the capacitors to the pins via low resistance tracks. 45127836
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 63 of 116 15.03.2004 3.12 Control signals 3.12.1 Inputs Table 17: Input control signals of the GSM/GPRS part of the XT55 module Signal Pin Pin status Function Remarks Falling edge Power up XT55 Ignition GSM_IGT Left open or HiZ No operation Active low ³ 100ms (Open drain/collector driver to GND required in cellular device application). Note: If a charger and a battery is connected to the customer application the GSM_IGT signal must be 1s minimum. Low Power down XT55 Emergency shutdown GSM_EMERG-OFF Left open or HiZ No operation Active low ³ 3.2s (Open drain/collector driver required in cellular device application). At the GSM_EMERGOFF signal the watchdog signal of the GSM engine can be traced (see description in Table 27). (HiZ = high impedance)
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 64 of 116 15.03.2004 3.12.2 Outputs 3.12.2.1 Synchronization signal The synchronization signal serves to indicate growing power consumption during the transmit burst. The signal is generated by the GSM_SYNC pin. Please note that this pin can adopt two different operating modes which you can select by using the AT^SSYNC command (mode 0 and 1). For details refer to the following chapter and to [1]. To generate the synchronization signal the pin needs to be configured to mode 0 (= default). This setting is recommended if you want your application to use the synchronization signal for better power supply control. Your platform design must be such that the incoming signal accommodates sufficient power supply to the XT55 module if required. This can be achieved by lowering the current drawn from other components installed in your application. The timing of the synchronization signal is shown below. High level of the GSM_SYNC pin indicates increased power consumption during transmission. Figure 23: GSM_SYNC signal during transmit burst *) The duration of the GSM_SYNC signal is always equal, no matter whether the traffic or the access burst are active. Transmit burst1 Tx 577 µs every 4.616 ms2 Tx 1154 µs every 4.616 ms300 µsGSM_SYNC signal*)
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 65 of 116 15.03.2004 3.12.2.2 Using the GSM_SYNC pin to control a status LED As an alternative to generating the synchronization signal, the GSM_SYNC pin can be used to control a status LED on your application platform. To avail of this feature you need to set the GSM_SYNC pin to mode 1 by using the AT^SSYNC command. For details see [1]. When controlled from the GSM_SYNC pin the LED can display the functions listed in Table 18. Table 18: Coding of the status LED LED mode Operating status Off XT55 is off or run in SLEEP, Alarm or Charge-only mode 600 ms On / 600ms Off No SIM card inserted or no PIN entered, or network search in progress, or ongoing user authentication, or network login in progress. 75 ms On / 3 s Off Logged to network (monitoring control channels and user interactions). No call in progress. 75 ms on / 75 ms Off / 75 ms On / 3 s Off One or more GPRS contexts activated. Flashing Indicates GPRS data transfer: When a GPRS transfer is in progress, the LED goes on within 1 second after data packets were exchanged. Flash duration is approximately 0.5 s. On Depending on type of call: Voice call: Connected to remote party. Data call: Connected to remote party or exchange of parameters while setting up or disconnecting a call. LED Off = GSM_SYNC pin low. LED On = GSM_SYNC pin high (if LED is connected as illustrated in Figure 24) To operate the LED a buffer, e.g. a transistor or gate, must be included in your application. A sample configuration can be gathered from Figure 24. Power consumption in the LED mode is the same as for the synchronization signal mode. For details see Table 27, GSM_SYNC pin. Figure 24: LED Circuit (Example)
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 66 of 116 15.03.2004 1sGSM_RING0URC3.12.2.3 Behavior of the GSM_RING0 line (ASC0 interface only) The GSM_RING0 line is available on the first serial interface (ASC0). The signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). Although not mandatory for use in a host application, it is strongly suggested that you connect the GSM_RING0 line to an interrupt line of your application. In this case, the application can be designed to receive an interrupt when a falling edge on GSM_RING0 occurs. This solution is most effective, particularly, for waking up an application from power saving. Note that if the GSM_RING0 line is not wired, the application would be required to permanently poll the data and status lines of the serial interface at the expense of a higher current consumption. Therefore, utilizing the GSM_RING0 line provides an option to significantly reduce the overall current consumption of your application. The behavior of the GSM_RING0 line varies with the type of event: · When a voice call comes in the GSM_RING0 line goes low for 1s and high for another 4s. Every 5 seconds the ring string is generated and sent over the GSM_RXD0 line. If there is a call in progress and call waiting is activated for a connected handset or handsfree device, the GSM_RING0 line switches to ground in order to generate acoustic signals that indicate the waiting call. Figure 25: Incoming voice call · Likewise, when a Fax or data call is received, GSM_RING0 goes low. However, in contrast to voice calls, the line remains low. Every 5 seconds the ring string is generated and sent over the GSM_RXD0 line. Figure 26: Incoming data call · All types of Unsolicited Result Codes (URCs) also cause the GSM_RING0 line to go low, however for 1 second only. For example, XT55 may be configured to output a URC upon the receipt of an SMS. As a result, if this URC type was activated with AT+CNMI=1,1, each incoming SMS causes the GSM_RING0 line to go low. See [1] for detailed information on URCs. Figure 27: URC transmission 5sGSM_RING0Ring stringRing stringRing string5s4sGSM_RING0 4s1s 1s 1sRing stringRing stringRing string
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 67 of 116 15.03.2004 Table 19: ASC0 ring signal Function Pin Status Description 0 Indicates an incoming call or URC. If in NON-CYCLIC SLEEP mode CFUN=0 or CYCLIC SLEEP mode CFUN=5 or 6, the module is caused to wake up to full functionality. If CFUN=7 or 8, power saving is resumed after URC transmission or end of call. Ring indication GSM_RING0 1 No operation
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 68 of 116 15.03.2004 4 GPS application interface The XT55 module integrates a GPS receiver which offers the full performance of GPS technology. The GPS receiver continuously tracks all satellites in view, thus providing accurate satellite position data. The GPS block can be used even if the XT55 module is deregistered from the GSM network. 4.1 Theory of operation Figure 28: Theory of operation The XT55 GPS part is designed to use L1 Frequency (C/A Code) GPS receiver and performs the entire GPS signal processing, from antenna input to serial position data output. The processing steps involved are: · RF Section In the RF Section the GPS signal detected by the antenna is amplified, filtered and converted to an intermediate frequency (IF). An A/D converter converts the analogue intermediate frequency into a digital IF signal. · GPS Channels The received digital IF signal bit stream is passed to the baseband section, where it is fed into the correlators. It is the function of the correlators to acquire and track the satellite signals. There are 12 channels used in parallel, with each correlator looking for a characteristic PRN code sequence in the bit stream. Once the correlator has a valid signal, Pseudo range, Carrier Phase and Orbit Information can be extracted from the GPS signal. · Navigation The on-board processor is running an algorithm that calculates the position, velocity and time. This calculation is called the navigation solution. Once the navigation solution is calculated, it can be transformed into the desired coordinate system, e.g. Latitude/ Longitude/ Altitude. · Interface The data of the navigation solution are available at the serial RS-232 interface.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 69 of 116 15.03.2004 4.2 Technical data Industry leading GPS performance · 12 channel GPS receiver · Signal acquisition using 1920 time / frequency search channels · Multipath-mitigation hardware · Cold start < 45 sec Low power · Typ. 220mW without active antenna (continuous mode) · TricklePower™ mode reduces power to < 60mW · Adaptive TricklePower™ switches between full and TricklePower™ · Push to fix reduces power by as much as 98% Additional software options (can be obtained separately) · AVL (for further information refer to [3]) · TCP/IP · SiRFXtrac (high sensitivity stand alone software) · SiRFDrive (high sensitivity dead reckoning software)Protocols · SDI1/ SDO1: NMEA 9600 baud, Msg.: GLL, GGA, RMC, VTG, GSV, GSA 8 data bits, no parity, 1 stop bit · SDI2/ SDO2: RTCM, 9600 baud Specification · Position accuracy autonomous: < 10m Beacon DGPS: < 2.5m · Receiver Tracking: L1, CA code Channels: 12 Max. update rate: 10 Hz Sensitivity: -172dBW Max. Altitude: <60.000 ft Max. velocity: <1.000 knots Protocol support: NMEA, SiRF binary · Acquisition rate SnapStart: < 3 sec Hot Start: < 8 sec Warm Start: < 38 sec Cold Start: < 45 sec
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 70 of 116 15.03.2004 4.3 GPS operating modes Mode Function Normal operation The receiver is continuously running in normal Mode, as long as the operating voltage Vcc is supplied. Position fixes are generated at the maximum update rate. It is recommended to use an external backup battery to reduce the system start-up time. In case of power supply interruption and an external backup battery is connected, the receiver keeps the intern Real Time Clock running and holds the FLASH data (ephemeris and almanac data). This enables the receiver a Warm- and Hot-start. However, the cold- and warm start times of receiver do not differ significantly under good visibility conditions. Trickle Power mode Vcc is continuously supplied to the receiver in Trickle Power mode. By using a special configurable software, the user can force the receiver to acquire a position fix periodically. Between two fixes, the receiver will be in a low power mode. A backup battery is needed to be connected to the receiver for reduction the start-up times in case of Vcc interruption. The power-on scenario in Trickle Power mode on the XT55 GPS part differs from one in continuous mode. If the receiver fails to acquire satellites within a given period of time (approx. 150 sec), the receiver goes into an extended sleep phase. The duration of this sleep phase is approx. 30 sec. After that, the receiver wakes up, makes a reset and tries to acquire satellites. This procedure repeats itself until the GPS receiver can detect satellites. For further details refer to [2]. Push-to-fix mode In this mode the receiver will turn on every 30 minutes to perform a system update consisting of a GPS RTC calibration and satellite ephemeris data collection if required (i.e. a new satellite has become visible) as well as all software tasks to support SnapSart in the event of an NMI. Ephemeris collection time in general takes 18 to 30 seconds. If ephemeris data is not required the system will recalibrate and shut down. In either case, the amount of time the receiver remains off will be in proportion to how long it stayed on: Off period = On Period*(1-Duty Cycle) Duty Cycle The off period has a possible range between 10 and 7200 seconds. The default is 1800 seconds.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 71 of 116 15.03.2004 4.3.1 Trickle Power mode The default mode of XT55 GPS part is continuous mode, but the user can set the XT55 GPS part into the Trickle Power mode via input command message. The XT55 GPS part enters the trickle power mode corresponding to Figure 29 (800ms OFF Time and 200ms ON Time) as soon as valid GPS data are available. As a result the average power consumption is reduced by approximately 80 % (approximately 150mW). The settings for the trickle power mode can be modified by using the SiRFstar demo software. For example if the XT55 GPS part is configured to enter the OnTime mode each 10s for a duration of 200ms the average power consumption can be reduced up to approx. 95% (approx. 15mW, ca. 4,8mA at Vcc=3.3V). Figure 29: Example for current in Trickle Power mode For more details refer to [2].
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 72 of 116 15.03.2004 4.3.2 Comparision of Trickle Power and Push-to Fix mode A comparison of the Trickle Power and Push-to-Fix modes is shown in Figure below. This diagram shows that for position update intervals less than approximately 600 seconds (i.e. rates faster than one fix per 10 minutes), the Trickle Power mode at an update interval of 10 seconds offers a lower power solution. The user would then be required to filter the output position data to use only the data points corresponding to the desired update interval. For example, if the desired position output is at 60 second intervals, then the user would only need one out of every six position outputs at a 10 second Trickle Power update interval. Alternatively, the user could perform smoothing or averaging of the position data and provide an output at the desired rate. Figure 30: Current comparison between Trickle Power and Push-to Fix mode
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 73 of 116 15.03.2004 4.4 Power supply of the XT55 GPS part The power supply for the GPS part of the XT55 module has to be a single voltage source of VCC=3.3V ± 5%. It must be able to provide sufficient current of 250 mA. GPS_VCC: Two GPS_VCC pins of the board-to-board connector are dedicated to connect the power supply voltage, five GND pins shared with the GSM/GPRS part of the XT55 module are recommended for grounding; see Figure 42 for details. GPS_V_ANT: This pin is reserved for an external DC power supply for active antenna. The antenna bias for an external active antenna can be provided in two way to pin GPS_V_ANT. The GPS_V_ANT input voltage should be chosen according to the antenna to be used. In order to use a 5V active GPS antenna, the GPS_V_ANT has to be connected to 5V external power supply respectively. The other possibility is available when you connect the GPS_VCC_RF output (which provides 3.0V) to GPS_V_ANT, so that an antenna with 3.0V supply voltage can be used. GPS_VCC_RF: This pin is an output which provide +3.0 V DC, and can be connected to the GPS_V_ANT, to supply the connected GPS antenna. In Trickle Power and Push-To-Fix modes, GPS_VCC_RF is switched off during the sleep mode. 4.5 General purpose input/output Several I/O’s (GPS_GPIO0, GPS_GPIO1, GPS_GPIO3, GPS_GPIO5, GPS_GPIO6, GPS_GPIO7, GPS_GPIO10, GPS_GPIO13, GPS_GPIO14, GPS_GPIO15) of the CPU are connected to the hardware interface connector of the XT55 GPS receiver. They are reserved for customer specific applications. For example: · For realization a SPI-Bus · For realization an antenna indication. Not all of these pins are supported by the current GPS firmware.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 74 of 116 15.03.2004 4.6 Serial interfaces of the XT55 GPS part The GPS part of the XT55 module offers two serial interfaces: SD1 · 2-wire serial interface · Includes the SDI1 (receive) and SDO1 (transmit) lines · Depending on the used GPS protocol the following baud rates are supported: 4800, 9600 bps, for further details refer to [2] SD2 · 2-wire serial interface · Includes the SDI2 (receive) and SDO2 (transmit) lines. It is intended for communication with the GSM/ GPRS part of the XT55 module. See Figure 1 for details. · Depending on the used GPS protocol the following baud rates are supported: 4800, 9600 bps, for further details refer to [2] SD1 and SD2 · Both interfaces are configured for 8 data bits, no parity and 1 stop bit · For more detailed characteristics see [2] 4.7 GPS control signals GPS_M-RST: This pin provides an active-low reset input to the board. It causes the board to reset and start searching for satellites. Reset is an optional input and, if not utilized, it may be left open. GPS_GPIO9 (T-MARK): This pin provides 1 pulse per second output from the board, which is synchronized to within 1 microsecond of GPS time. The output is a CMOS level signal. GPS_BOOTSEL: Set this Pin to high for reprogramming the flash of the XT55 GPS part (for instance updating to a new firmware for the XT55 GPS part). GPS_RFPC0, GPS_RFPC1 These pins are input pins for Trickle-Power Mode control. They must be connected externally to GPS_GPIO8 and GPS_GPIO4. GPS_GPIO8, GPS_GPIO4: These pins are control outputs for the Trickle-Power Mode. GPS_GPIO8 must be connected to GPS_RFPC0 and GPS_GPIO4 to GPS_RFPC1. GPS_GPIO8, GPS_GPIO4 can also be used to control a LED. A possible circuit is shown in Figure 24. If the LED lights permanently the GPS receiver is searching for satellites. Is the GPS receiver in Trickle-Power Mode, the LED flashes in rhythm, i.e. the GPS receiver receives valid positions data. Timing differs between GPS_GPIO4 and GPS_GPIO8. Note: By switched off Trickle power the LED will flash permanently. The reception of satellites data can be checked by using the T-Mark, however, cannot be evaluated.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 75 of 116 15.03.2004 Figure 31: Example of LED circuit 4.8 Receiver architecture The XT55 GPS receiver is a product that features the SiRFstarII-Low Power chipset. This complete 12 channel, WAAS-enabled GPS receiver provides a vastly superior position accuracy performance in a much smaller package. The SiRFstarII architecture builds on the high-performance SiRFstarI core, adding an acquisition accelerator, differential GPS processor, multipath mitigation hardware and satellite-tracking engine. The XT55 GPS receiver delivers major advancements in GPS performance, accuracy, integration, computing power and flexibility. Antenna input LNA RF FilterGRF2i/LPRFFront-EndGSP2e/LPSignalProcessorXTALData BusAddress BusGPS-DataAGCClockReset ICFLASH1MByteTCXOGPS_VCC (+3.3 V DC)2 x PWRCTL(RFPC)T- MA RKGPS_SDI 1GPS_SDO 1GPS_SDO 2GPS_SDI 212 x GPS_GPIOGPS_M-RSTBOOTSELECTGPS_VANTGPS_VCC_RFRECEIVER ARCHITECTURERTC Figure 32: Receiver architecture of the GPS receiver GPS_RFPC0 330 WVcc = 3.3 V DCBC81747 k W GND
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 76 of 116 15.03.2004 Figure 32 above shows the block diagram of the XT55 GPS receiver architecture. The GPS module is separated into four major parts: RF frequency down-converter, digital baseband demodulation, embedded ARM microprocessor and internal GPS software stored on-board (1 MBits) Flash-Memory. The RF frequency conversion and the baseband demodulation are executed by hardware while the embedded ARM processor computes the GPS Position, Velocity and Time solution employing the internal GPS software. The purpose of the RF circuitry is to reinforce the very weak (-130dBm nominal) GPS signal, filter it and down-convert it to an Intermediate Frequency (IF) of 9.45MHz for digital processing. The SiRFstarII architecture relies on the high level of integration in the GRF2i to significantly reduce part count and circuit complexity. The IF filter is built-in as well. · The digital baseband demodulator takes the quantified GPS signal and detects the individual satellites serial data bit stream, along with the associated pseudo range. This action consists of removing spread spectrum and Doppler frequency components of the signal to obtain the serial data messages. · The embedded ARM processor monitors channel allocation, extracts the raw satellite tracking data, computes the position and time solution and sends it on a serial port for high level applications to use or processes it locally. Support functions for the microprocessor include real-time clock and reset pulse generator circuits. The internal GPS software monitors and allocates channels, computers the Position, Velocity and Time using the pseudo-range of the satellites and reformats the data to be output or used locally. The internal GPS software is a tasking based architecture driven by the 100ms interrupt generated by GPS2e internal hardware. 4.9 Operation procedure When the receiver is powered up, it steps trough a sequence of states until it can initially determine position, velocity and time. Afterwards, the satellite signals are tracked continuously and the position is calculated periodically. In order to perform a navigation solution (3D solution), the receiver needs. · Pseudo-ranges for at least 3 satellites · Ephemeris Data for the satellites it will use in the navigation solution. Note: If almanac navigation is enabled, the receiver can calculate a position without downloading ephemeris data (with a significant position error compared to an ephemeris based solution). The Initial Position Calculation is made, using a Least-Squares Algorithm. Successive Position Calculations are performed with a Kalman Filter. To generate a Position (3D solution) Calculation the receiver needs at least 4 measurements to different satellites. In order to calculate a position (Latitude/Longitude/Height), as a 2D solution with a estimated height value, then 3 different satellites are required. Pseudo-range and Carrier phase information are available to the Position Determination Algorithms if the receiver has found a SV (Acquisition) and can track the signal thereafter. Ephemeris data for a SV can be decoded from Orbit Data once the GPS signal has been acquired. Each SV transmits its own ephemeris data, the broadcast lasts for 18 seconds, repeating every 30 seconds. The receiver stores ephemeris data in battery-backed memory. This data can be used in future startup’s to improve the time to first fix (TTFF). The Ephemeris can also be supplied to the receiver via the serial port.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 77 of 116 15.03.2004 4.10 Start-up procedures The start-up strategy of the XT55 GPS part depends on the last position, current time and ephemeris data, that the receiver has stored no-board SRAM memory. There are three different start up procedures: 4.10.1 Coldstart The Coldstart take place when the receiver has no knowledge of its last position or time. In this case the GPS RTC has not been running and no valid ephemeris data or almanac data is available (The receiver has never been navigating or no battery backup memory available). 4.10.2 Warmstart This start-up procedure Warmstart is performed whenever the receiver is able to use the valid almanac data, and has not in an important manner moved since the last valid position calculation. This procedure start if the receiver has been shut off for more than 2 hours, but the last position, time and almanac are still acknowledged. This procedure allows it to announce in advance the current visible satellites. However, since ephemeris data is not available or no longer widely used, the receiver needs to wait for the ephemeris broadcast to complete. 4.10.3 Hotstart This procedure Hotstart is performed whenever the receiver still has access to valid ephemeris data and exact time. This procedure start if the receiver has been shut off for less than 2 hours and the GPS RTC has been running during that time. Furthermore, during the previous session, the receiver must have been navigating (to allow it to decode and store ephemeris data). In Hotstart, the receiver can announce in advance the currently visible satellites, and is therefore able to quickly obtain and track the signal. Due to the fact that ephemeris is already known, there is no need to wait for the ephemeris broadcast to complete.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 78 of 116 15.03.2004 5 GSM and GPS antenna interfaces 5.1 GSM antenna installation The RF interface has an impedance of 50". XT55 is capable of sustaining a total mismatch at the antenna connector or pad without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, DC-power consumption and harmonic suppression. Matching networks are not included on the XT55 PCB and should be placed in the host application. Regarding the return loss XT55 provides the following values: Table 20: Return loss State of module Return loss of module Recommended return loss of application Receive > 8dB > 12dB Transmit not applicable > 12dB Idle < 5dB not applicable The connection of the antenna or other equipment must be decoupled from DC voltage. 5.1.1 GSM antenna connector To suit the physical design of individual applications XT55 offers two alternative approaches to connecting the GSM antenna: · Recommended approach: U.FL-R-SMT antenna connector from Hirose assembled on the component side of the PCB (top view on XT55). See Chapter 5.3 for details. · Antenna pad and grounding plane placed on the bottom side. See Chapter 5.1.2. Figure 33: U.FL-R-SMT connector Figure 34: Antenna pad and GND plane Antenna pad Antenna ground
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 79 of 116 15.03.2004 Module Antenna ormeasurementequipment50Ohm50OhmU.FL PADZ Module Antenna or measurement equipment 50Ohm 50OhmU.FL Z PAD The U.FL-R-SMT connector has been chosen as antenna reference point (ARP) for the Siemens reference equipment submitted to type approve XT55. All RF data specified throughout this manual are related to the ARP. For compliance with the test results of the Siemens type approval you are advised to give priority to the connector, rather than using the antenna pad. IMPORTANT: Both solutions can only be applied alternatively. This means, whenever an antenna is plugged to the Hirose connector, the pad must not be used. Vice versa, if the antenna is connected to the pad, then the Hirose connector must be left empty. Antenna connected to Hirose connector: Antenna connected to pad: Figure 35: Never use antenna connector and antenna pad at the same time No matter which option you choose, ensure that the antenna pad does not come into contact with the holding device or any other components of the host application. It needs to be surrounded by a restricted area filled with air, which must also be reserved 0.8 mm in height. PCB U.FL antenna connector RF section Antenna pad Restricted area Figure 36: Restricted area around antenna pad
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 80 of 116 15.03.2004 5.1.2 GSM antenna pad The antenna can be soldered to the pad, or attached via contact springs. To help you ground the antenna, XT55 comes with a grounding plane located close to the antenna pad. The positions of both pads can be seen from Figure 52. When you decide to use the antenna pad take into account that the pad has not been intended as antenna reference point (ARP) for the Siemens XT55 type approval. The antenna pad is provided only as an alternative option which can be used, for example, if the recommended Hirose connection does not fit into your antenna design. Also, consider that according to the GSM recommendations TS 45.005 and TS 51.010-01 a 50" connector is mandatory for type approval measurements. This requires GSM devices with an integral antenna to be temporarily equipped with a suitable connector or a low loss RF cable with adapter. To prevent damage to the module and to obtain long-term solder joint properties you are advised to maintain the standards of good engineering practice for soldering. XT55 material properties: XT55 PCB: FR4 Antenna pad: Gold plated pad Suitable cable types: For direct solder attachment, we suggest to use the following cable types: · RG316/U 50 Ohm coaxial cable · 1671A 50 Ohm coaxial cable Suitable cables are offered, for example, by IMS Connector Systems. For further details and other cable types please contact http://www.imscs.com. 5.2 Installing the GPS antenna In order to receive satellite signals an additional GPS antenna must be connected to the GPS part of the XT55 module. The position of the GPS antenna connector can be found in Figure 37 and Figure 53. Recommended devices which can be mounted onto the Hirose connector are available in Chapter 9. Figure 37: GPS antenna connector (U.FL-R-SMT connector)
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 81 of 116 15.03.2004 5.3 Hirose antenna connector XT55 uses two ultra-miniature SMT antenna connectors (GSM and GPS antenna) supplied from Hirose Ltd. The product name is U.FL-R-SMT. The positions of both antenna connectors on the XT55 board can be seen in Figure 51. Figure 38: Mechanical dimensions of U.FL-R-SMT connector Table 21: Product specifications of U.FL-R-SMT connector Item Specification Conditions Ratings Nominal impedance 50 W Rated frequency DC to 6 GHz Operating temp: -40°C to +90°C Operating humidity: max. 90% Mechanical characteristics Female contact holding force 0.15 N min Measured with a Æ 0.475 pin gauge Repetitive operation Contact resistance: Centre 25 mW Outside 15mW 30 cycles of insertion and disengagement Vibration No momentary disconnections of 1 µs; No damage, cracks and looseness of parts Frequency of 10 to 100 Hz, single amplitude of 1.5 mm, acceleration of 59 m/s2, for 5 cycles in the direction of each of the 3 axes Shock No momentary disconnections of 1 µs. No damage, cracks and looseness of parts. Acceleration of 735 m/s2, 11 ms duration for 6 cycles in the direction of each of the 3 axes Environmental characteristics Humidity resistance No damage, cracks and looseness of parts. Insulation resistance: 100 MW min. at high humidity 500 MW min when dry Exposure to 40°C, humidity of 95% for a total of 96 hours Temperature cycle No damage, cracks and looseness of parts. Contact resistance: Centre 25 mW Outside 15mW Temperature: +40°C ® 5 to 35°C ® +90°C ® 5 to 35°C Time: 30 min. ® within 5 min. ® 30 min. ® within 5 min Salt spray test No excessive corrosion 48 hours continuous exposure to 5% salt water
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 82 of 116 15.03.2004 Table 22: Material and finish of U.FL-R-SMT connector and recommended plugs Part Material Finish Shell Phosphor bronze Silver plating Male centre contact Brass Gold plating Female centre contact Phosphor bronze Gold plating Insulator Plug: PBT Receptacle: LCP Black Beige Mating plugs and cables can be chosen from the Hirose U.FL Series. Examples are shown below and listed in Table 23. For latest product information please contact your Hirose dealer or visit the Hirose home page, for example http://www.hirose.com. Figure 39: U.FL-R-SMT connector with U.FL-LP-040 plug Figure 40: U.FL-R-SMT connector with U.FL-LP-066 plug
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 83 of 116 15.03.2004 In addition to the connectors illustrated above, the U.FL-LP-(V)-040(01) version is offered as an extremely space saving solution. This plug is intended for use with extra fine cable (up to Æ 0.81 mm) and minimizes the mating height to 2 mm. See Figure 41 which shows the Hirose datasheet. Figure 41: Specifications of U.FL-LP-(V)-040(01) plug
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 84 of 116 15.03.2004 Table 23: Ordering information for Hirose U.FL Series Item Part number HRS number Connector on XT55 U.FL-R-SMT CL331-0471-0-10 Right-angle plug shell for Æ 0.81 mm cable U.FL-LP-040 CL331-0451-2 Right-angle plug for Æ 0.81 mm cable U.FL-LP(V)-040 (01) CL331-053-8-01 Right-angle plug for Æ 1.13 mm cable U.FL-LP-066 CL331-0452-5 Right-angle plug for Æ 1.32 mm cable U.FL-LP-066 CL331-0452-5 Extraction jig E.FL-LP-N CL331-0441-9
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 85 of 116 15.03.2004 6 Electrical, reliability and radio characteristics 6.1 Absolute maximum ratings Absolute maximum ratings for supply voltage and voltages on digital and analog pins of XT55 are listed in Table 24. Exceeding these values will cause permanent damage to XT55. Table 24: Absolute maximum ratings (GSM/GPRS part) Parameter Min Max Unit Voltage GSM_BATT+ -0.3 4.8 V Voltage at digital pins -0.3 3.3 V Voltage at analog pins -0.3 3.0 V Voltage at digital / analog pins in POWER DOWN mode -0.25 +0.25 V Voltage at GSM_POWER pin 15 V Voltage at GSM_CHARGE pin 15 V Differential load resistance between EPNx and EPPx 15 W Table 25: Absolute maximum rating (GPS part) Parameter Min Max Unit Voltage at GPS_VCC 3.14 3.46 V Current at GPS_VCC_RF 25 mA 6.2 Operating temperatures Test conditions were specified in accordance with IEC 60068-2 (still air). The values stated below are in compliance with GSM recommendation TS 51.010-01. Table 26: Operating temperatures Parameter Min Typ Max Unit Ambient temperature (according to GSM 11.10) -20 25 55 °C Restricted operation *) -25 to -20 55 to 70 °C Automatic shutdown XT55 board temperature Battery temperature -29 -18 >70**) >60 °C °C Charging temperature (software controlled fast charging) 0 +45 °C *) XT55 works, but deviations from the GSM specification may occur. **) XT55 has the automatic shutdown set to 70°C at power class 5 (GSM900) GPRS class 8. This prevents permanent damage to components on the board. Consider the ratio of output power, supply voltage and operating temperature: To achieve Tamb max = 70°C and, for example, GSM 900 PCL5 the supply voltage must not be higher than 4.2V.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 86 of 116 15.03.2004 6.3 Pin description Please note that the reference voltages listed in Table 27 are the values measured directly on the XT55 module. They do not apply to the accessories connected. If an input pin is specified for VIHmax = 3.3V, be sure never to exceed the stated voltage. The value 3.3V is an absolute maximum rating. The Hirose DF12C board-to-board connector on XT55 is a 80-pin double-row receptacle. The names and the positions of the pins can be seen from Figure 42 which shows the top view of XT55. GPS_VANT 1 80 GSM_EPN2GPS_VCC_RF 2 79 GSM_EPP2 GPS_VCC 3 78 GSM_EPP1 GPS_VCC 4 77 GSM_EPN1GSM_RXDDAI 5 76 GSM_MICN2GSM_TFSDAI 6 75 GSM_MICP2GSM_SCLK 7 74 GSM_MICP1GSM_TXDDAI 8 73 GSM_MICN1GSM_RFSDAI 9 72 GSM_CCVCCNC 10 71 GSM_CCCLKNC 11 70 GSM_CCDATANC 12 69 GSM_CCRSTNC 13 68 GSM_CCIN NC 14 67 GSM_CCGNDGSM_RTS1 15 66 GSM_IGT GSM_CTS1 16 65 GSM_EMERGOFFGSM_RXD1 17 64 GSM_DCD0GSM_TXD1 18 63 GSM_CTS0 NC 19 62 GSM_DTR0GPS_GPIO15 20 61 GSM_RTS0 GPS_GPIO14 21 60 GSM_RING0GPS_GPIO13 22 59 GSM_DSR0GPS_GPIO10 23 58 GPS_TXDOGPS_GPIO9 24 57 GPS_RXDOGPS_GPIO8 25 56 GPS_SDI2 GPS_GPIO7 26 55 GPS_SDO2 GPS_GPIO6 27 54 GSM_CHARGEGPS_GPIO5 28 53 GSM_POWERGPS_GPIO4 29 52 GSM_BATT_TEMPGPS_GPIO3 30 51 GSM_SYNCGPS_GPIO1 31 50 GSM_BATT+GPS_GPIO0 32 49 GSM_BATT+GPS_SDI1 33 48 GSM_BATT+GPS_SDO1 34 47 GSM_BATT+GPS_BOOTSEL 35 46 GSM_BATT+GPS_RFPCO 36 45 GND GPS_RFPC1 37 44 GND GPS_M-RST 38 43 GND GSM_VDD 39 42 GND GSM_VDDLP 40 41 GND Figure 42: Pin assignment (top view on XT55)
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 87 of 116 15.03.2004 Table 27: Electrical description of application interface Function Signal name IO Signal form and level Comments GSM_BATT+ I VI = 3.3V to 4.8V VInorm = 4.2V Inorm # 1.6A (during Tx burst) Imax< 2A GSM power supply GND 1 Tx, peak current 577µs every 4.616ms 2 Tx, peak current 1154µs every 4.616ms Power supply input. 5 GSM_BATT+ pins to be connected in parallel. 5 GND pins to be connected in parallel. The power supply must be able to meet the requirements of current consumption in a Tx burst (up to 3A). Sending with two timeslots doubles the duration of current pulses to 1154µs (every 4.616ms)! GSM_POWER I VImin = 3.0V VImax = 15V This line signalizes to the processor that the charger is connected. If unused keep pin open. GSM_BATT_TEMP I Connect NTC with RNTC # 10kW @ 25°C to ground. Input to measure the battery temperature over NTC resistor. NTC should be installed inside or near battery pack to enable the charging algorithm and deliver temperature values. If unused keep pin open. Charge interface GSM_CHARGE O IGSM_CHARGE = -300µA ... -600µA @ 3V < VGSM_CHARGE < VLOAD This line is a current source for the charge FET with a 10kW resistance between gate and source. If unused keep pin open. External supply voltage GSM_VDD O GSM_VDDmin = 2.84V, GSM_VDDmax = 2.96V Imax = -10mA CLmax = 1µF Supply voltage, e.g. for an external LED or level shifter. The external digital logic must not cause any spikes or glitches on voltage GSM_VDD. Not available in POWER DOWN mode. GSM_VDD signalizes the “ON” state of the module. If unused GSM_VDD keep pin open. VDD Low Power GSM_VDDLP I/O RI =1kW VOmax # 4.0V (output) VImin = 2.2V, VImax = 5.5V (input) IItyp = 10µA at GSM_BATT+ = 0V Mobile in POWER DOWN mode: VImin = 1.2V Supplies the RTC with power via an external capacitor or buffer battery if no VGSM_BATT+ is applied. If unused keep pin open.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 88 of 116 15.03.2004 Function Signal name IO Signal form and level Comments Ignition GSM_IGT I RI # 100kW, CI # 1nF VILmax = 0.5V at Imax = -20µA VOpenmax = 2.3V ON ~~~|____|~~~ Active Low ³ 100ms Input to switch the mobile ON. The line must be driven low by an Open Drain or Open Collector driver. Emergency shutdown (Watchdog) GSM_EMERGOFF I RI #22kW VILmax = 0.5V at Imax = -100µA VOpenmax = 2.73V Signal ~~~|______|~~~ Active Low ³ 3.2s Watchdog: VOLmax = 0.35V at I = 10µA VOHmin= 2.25V at I = -10µA fOmin = 0.16Hz fOmax = 1.55Hz This line must be driven by an Open Drain or Open Collector driver. Emergency shutdown deactivates the power supply to the module. The module can be reset if GSM_IGT is activated after emergency shutdown. To switch the mobile off use the AT^SMSO command. To avoid floating if pin is high impedance, use pull-down resistor tied to GND. See Chapter 3.3.2.1. GSM_EMERGOFF also indicates the internal watchdog function. If unused keep pin open. VOLmax = 0.2V at I = 1mA VOHmin = 2.35V at I = -1mA VOHmax = 2.73V Indicates increased current consumption during uplink transmission burst. Note that timing is different during handover. Alternatively used to control status LED (see Chapter 3.12.2.2). If unused keep pin open. Synchroni-zation GSM_SYNC O 1 Tx, 877µs impulse each 4.616ms and 2 Tx, 1454µs impulse each 4.616ms, with 300µs forward time.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 89 of 116 15.03.2004 Function Signal name IO Signal form and level Comments GSM_CCIN I RI # 100kW VILmax = 0.5V VIHmin = 2.15V at I = 20µA, VIHmax=3.3V at I = 30µA GSM_CCRST O RO #47W VOLmax = 0.25V at I = 1mA VOHmin = 2.3V at I = -1mA VOHmax = 2.73V GSM_CCIO IO RI #10kW VILmax = 0.5V VIHmin = 1.95V, VIHmax=3.3V RO #220W VOLmax = 0.4V at I = 1mA VOHmin = 2.15V at I = -1mA VOHmin = 2.55V at I = -20µA VOHmax = 2.96V GSM_CCCLK O RO #220W VOLmax = 0.4V at I = 1mA VOHmin = 2.15V at I = -1mA VOHmax = 2.73V GSM_CCVCC O ROmax = 5W GSM_CCVCCmin = 2.84V, GSM_CCVCCmax = 2.96V Imax = -20mA SIM interface GSM_CCGND Ground GSM_CCIN = high, SIM card holder closed (no card recognition) Maximum cable length 200mm to SIM card holder. All signals of SIM interface are protected against ESD with a special diode array. Usage of GSM_CCGND is mandatory. GSM_RXD0 O GSM_TXD0 I GSM_CTS0 O GSM_RTS0 I GSM_DTR0 I GSM_DCD0 O GSM_DSR0 O ASC0 interface GSM_RING0 O VOLmax = 0.2V at I = 1mA VOHmin = 2.35V at I = -1mA VOHmax = 2.73V VILmax = 0.5V VIHmin = 1.95V, VIHmax=3.3V GSM_DTR0, GSM_RTS0: Imax = -90µA at VIN = 0V GSM_TXD0: Imax = -30µA at VIN = 0V First serial interface for AT commands or data stream. To avoid floating if output pins are high-impedance, use pull-up resistors tied to GSM_VDD or pull-down resistors tied to GND. See Chapter 3.3.2.1. If unused keep pins open. GSM_RXD1 O GSM_TXD1 I GSM_CTS1 O ASC1 interface GSM_RTS1 I VOLmax = 0.2V at I = 1mA VOHmin = 2.35V at I = -1mA VOHmax = 2.73V VILmax = 0.5V VIHmin = 1.95V, VIHmax=3.3V IImax = -90µA at VIN = 0V Second serial interface for AT commands. To avoid floating if output pins are high-impedance, use pull-up resistors tied to GSM_VDD or pull-down resistors tied to GND. See Chapter 3.3.2.1. If unused keep pins open. GSM_RFSDAI I GSM_RXDDAI I GSM_SCLK I GSM_TFSDAI O Digital audio interface GSM_TXDDAI O VOLmax = 0.2V at I = 1mA VOHmin = 2.35V at I = -1mA VOHmax = 2.73V VILmax = 0.5V VIHmin = 1.95V, VIHmax=3.3V IImax = 330µA at VIN = 3.3V If unused keep pins open.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 90 of 116 15.03.2004 Function Signal name IO Signal form and level Comments GSM_EPP2 O GSM_EPN2 O VOmax = 3.7Vpp See also Table 32. The audio output is balanced and can directly operate an earpiece. If unused keep pins open. GSM_EPP1 O GSM_EPN1 O VOmax = 3.7Vpp See also Table 32. Balanced audio output. Can be used to directly operate an earpiece. If unused keep pins open. GSM_MICP1 I GSM_MICN1 I RI # 50kW differential VImax = 1.03Vpp See also Table 33. Balanced microphone input. To be decoupled with 2 capacitors (CK = 100nF), if connected to a microphone or another device. If unused keep pins open. GSM_MICP2 I Analog audio interfaces GSM_MICN2 I RI = 2kW differential VImax = 1.03Vpp See also Table 33. Balanced microphone input. Can be used to directly feed an active microphone. If used for another signal source, e.g. op amp, to be decoupled with capacitors. If unused keep pins open. Antenna power GPS_VANT I Max. 8V DC Max. 25 mA Power supply for active antenna; in case of 3V antenna can be connected to GPS_VCC_RF Internal antenna power GPS_VCC_RF O Typ.: 3.0V ±5% DC Max: 25 mA Regulates 3V output for feeding a 3V active GPS antenna GPS power GPS_VCC I Typ.: 3.3V ±5% DC Max: 250 mA Typ. 80 mA (without feeding GPS_VCC_RF) 50 mV ripple Digital Input / Output GPS_GPIO0 I/O CMOS 3.3V DC level See Chapter 4.5 Digital Input / Output GPS_GPIO1 I/O CMOS 3.3V DC level See Chapter 4.5 Digital Input / Output GPS_GPIO3 I/O CMOS 3.3V DC level See Chapter 4.5 Digital Input / Output GPS_GPIO4 I/O CMOS 3.3V DC level Output for Trickle Power mode. Connect externally to GPS_RFPC1. Usable as LED control output, see Chapter 4.7 Digital Input / Output GPS_GPIO5 I/O CMOS 3.3V DC level See Chapter 4.5 Digital Input / Output GPS_GPIO6 I/O CMOS 3.3V DC level See Chapter 4.5 Digital Input / Output GPS_GPIO7 I/O CMOS 3.3V DC level See Chapter 4.5 Digital Input / Output GPS_GPIO8 I/O CMOS 3.3V DC level Output for Trickle Power mode. Connect externally to GPS_RFPC0. Usable as LED control output, see Chapter 4.7 Digital Input / Output GPS_GPIO9 I/O CMOS 3.3V DC level The pin provides 1 pulse per second output (T-MARK), see Chapter 4.7Explanation of signal names: P = positive, N = negative
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 91 of 116 15.03.2004 Function Signal name IO Signal form and level Comments Digital Input / Output GPS_GPIO10 I/O CMOS 3.3V DC level See Chapter 4.5 Digital Input / Output GPS_GPIO13 I/O CMOS 3.3V DC level See Chapter 4.5 Digital Input / Output GPS_GPIO14 I/O CMOS 3.3V DC level See Chapter 4.5 Digital Input / Output GPS_GPIO15 I/O CMOS 3.3V DC level See Chapter 4.5 GPS Reset GPS_M-RST I CMOS 3.3V DC level Active low reset input Serial1 Rx GPS_SDI1 I CMOS 3.3V DC level See Chapter 4.6 Serial1 Tx GPS_SDO1 I CMOS 3.3V DC level See Chapter 4.6 Digital Input GPS_BOOTSEL I CMOS 3.3V DC level For re-programming the Flash must be set to High Digital Input GPS_RFPC1 I CMOS 3.3V DC level Connect to GPS_GPIO4 Digital Input GPS_RFPC0 I CMOS 3.3V DC level Connect to GPS_GPIO8 Serial2 Rx GPS_SDI2 I CMOS 3.3V DC level See Chapter 4.6 Serial2 Tx GPS_SDO2 0 CMOS 3.3V DC level See Chapter 4.6 CMOS 3.3V level: Input High = 2.0 – 3.3 V DC; I_leakage = 2µA Input Low = 0 – 0.8 V DC, I_leakage = 2µA Output High = min. 2.4 V DC, Ioh= 2mA Output Low = max 0.4 V DC, Ioh= 2mA
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 92 of 116 15.03.2004 6.4 Power supply ratings Table 28: Power supply ratings (GSM/GPRS part) Parameter Description Conditions Min Typ Max Unit Supply voltage Reference points on XT55: TP GSM_BATT+ and TP GND (see Figure 52). Voltage must stay within the min/max values, including voltage drop, ripple, spikes. 3.3 4.2 4.8 VVoltage drop during transmit burst Normal condition, power control level for Pout max 400 mVGSM_BATT+ Voltage ripple Normal condition, power control level for Pout max @ f<200kHz @ f>200kHz 50 2 mVPOWER DOWN mode 50 100 µASLEEP mode @ DRX = 6 3 mAIDLE mode EGSM 900 GSM 1800/1900 15 15 mATALK mode EGSM 9001) GSM 1800/19002) 260 180 mAIDLE GPRS EGSM 900 GSM 1800/1900 15 15 mADATA mode GPRS, (4 Rx, 1 Tx) GSM 9001) GSM 1800/19002) 450 330 mAAverage supply current3) DATA mode GPRS, (3 Rx, 2 Tx) EGSM 9001) GSM 1800/19002) 450 330 mAIGSM_BATT+ Peak supply current (during transmission slot every 4.6ms) Power control level 1) 1.6 A1) Power control level PCL 5 2) Power control level PCL 0 3) All average supply current values @ IGSM_VDD = 0mA
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 93 of 116 15.03.2004 Table 29: Power supply ratings (GPS part) Parameter Description Conditions Min Typ Max Unit GPS_VCC Supply voltage 3.14 3.3 3.46 VIGPS_VCC Average supply current Continuous mode (without antenna feeding on GPS_VCC_RF) 80 250 mA
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 94 of 116 15.03.2004 6.5 Current consumption during GSM/GPRS transmit burst The diagrams provided in Figure 48 and Figure 49 illustrate the typical current consumption of the application caused during a transmit burst. The typical peak current is shown vs. the power control level for 900 MHz, 1800 MHz and 1900 MHz and vs. the return loss of the antenna. Test conditions: All measurements have been performed at Tamb= 25°C, VGSM_BATT+ nom = 4.1V. Reference points for measuring the voltage are the GSM_BATT+ and GND test points on the back side of the module. The curves are for one TX slot (for example a voice call, CSD call or Class 8 GPRS). Curves for Class 10 GPRS activities (2 TX slots) are shown too. Changing the conditions, e.g. in terms of temperature or voltage, will cause different results. Average Current GSM900 (VBATT+=4.1V)0.100.100.110.150.210.250.130.140.160.230.330.4300.050.10.150.20.250.30.350.40.450.55 7 9 11 13 15 17 19Power Control LevelCurrent (Amps)1 TX - Average Current2 TX - Average Current Figure 43: Typical current consumption vs. return loss in EGSM 900 network
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 95 of 116 15.03.2004 Average Current DCS1800 (VBATT+=4.1V)0.100.100.120.130.180.130.140.160.190.2600.050.10.150.20.250.30123456789101112131415Power Control LevelCurrent (Amps)1 TX - Average Current2 TX - Average Current Figure 44: Typical current consumption vs. return loss in GSM 1800 network Average Current PCS1900 (VBATT+=4.1V)0.100.110.120.130.170.130.140.170.210.2900.050.10.150.20.250.30123456789101112131415Power Control LevelCurrent (Amps)1 TX - Average Current2 TX - Average Current Figure 45: Typical current consumption vs. return loss in GSM 1900 network
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 96 of 116 15.03.2004 Burst Current GSM900 (VBATT+=4.1V)0.30.40.681.241.60.2800.20.40.60.811.21.41.61.85 7 9 11 13 15 17 19Power Control LevelCurrent (Amps)1 TX - Peak current Figure 46: Peak current consumption during transmit burst in EGSM 900 network Burst Current DCS1800 (VBATT+=4.1V)0.270.380.240.840.5200.10.20.30.40.50.60.70.80.910123456789101112131415Power Control LevelCurrent (Amps)1 TX - Peak current Figure 47: Peak current consumption during transmit burst in GSM 1800 network
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 97 of 116 15.03.2004 Burst Current PCS1900 (VBATT+=4.1V)0.920.60.30.420.2400.10.20.30.40.50.60.70.80.910123456789101112131415Power Control LevelCurrent (Amps)1 TX - Peak current Test conditions: Tamb= 25°C, VGSM_BATT+ nom = 4.1V Figure 48: Peak current consumption during transmit burst in GSM 1900 network
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 98 of 116 15.03.2004 02004006008001000120014001600Burst (max) Burst (min) Average Current (Max) Average Current (Min)Current (mA)ch.124 PCL5Service mode GSM900 ch.124 Variations in current with 0.4dB return loss (all phases) 01002003004005006007008009001000Burst (max) Burst (min) Average Current (Max) Average Current (Min)Current (mA)ch.661 PCL0Service mode PCS1900 ch.661 Variations in current with 0.6dB return loss (all phases) Test conditions: Tamb= 25°C, VGSM_BATT+ nom = 4.1V measured at TP GSM_BATT+ and GND, 1 TX slot Figure 49: Typical current consumption vs. return loss
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 99 of 116 15.03.2004 6.6 Electrical characteristics of the voiceband part 6.6.1 Setting audio parameters by AT commands The audio modes 2 to 6 can be adjusted according to the parameters listed below. Each audio mode is assigned a separate set of parameters. Table 30: Audio parameters adjustable by AT command Parameter Influence to Range Gain range Calculation inBbcGain MICP/MICN analog amplifier gain of baseband controller before ADC 0...7 0...42dB 6dB steps inCalibrate digital attenuation of input signal after ADC 0...32767 -$...0dB 20 * log (inCalibrate/ 32768) outBbcGain EPP/EPN analog output gain of baseband controller after DAC 0...3 0...-18dB 6dB steps outCalibrate[n] n = 0...4 digital attenuation of output signal after speech decoder, before summation of sidetone and DAC present for each volume step[n] 0...32767 -$...+6dB 20 * log (2 * outCalibrate[n]/ 32768) sideTone digital attenuation of sidetone is corrected internally by outBbcGain to obtain a constant sidetone independent of output volume 0...32767 -$...0dB 20 * log (sideTone/ 32768) Note: The parameters inCalibrate, outCalibrate and sideTone accept also values from 32768 to 65535. These values are internally truncated to 32767.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 100 of 116 15.03.2004 6.6.2 Audio programming model The audio programming model shows how the signal path can be influenced by varying the AT command parameters. The model is the same for all three interfaces, except for the parameters <outBbcGain> and <inBbcGain> which cannot be modified if the digital audio interface is being used, since in this case the DAC is switched off. The parameters inBbcGain and inCalibrate can be set with AT^SNFI. All the other parameters are adjusted with AT^SNFO. ADAD-¥...0dBSpeech coderneg. gain (attenuation) 0dB; -6db, -12dB; -18dB +0...42dB in 6dB steps 1k 1k 1k 1k 2.65V 10uF + <sideTone> AT parameters are given in brackets <…> and marked red and italic. <outCalibrate[n]> n = 0...4 <inCalibrate> <inBbcGain> <outBbcGain> Speech decoderGSM_MICGSM_TFSDAI, GSM_TXDDAI GSM_RFSDAI, GSM_RXDDAI GSM_MIC1 <io><ep><mic> Figure 50: AT audio programming model
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 101 of 116 15.03.2004 6.6.3 Characteristics of audio modes The electrical characteristics of the voiceband part depend on the current audio mode set with the AT^SNFS command. Table 31: Voiceband characteristics (typical) Audio mode no. AT^SNFS= 1 (Default settings, not adjustable) 2 3 4 5 6 Name Default Handset Basic Handsfree Headset User Handset Plain Codec 1 Plain Codec 2 Purpose DSB with Votronic handset Siemens Car Kit Portable Siemens Headset DSB with individual handset Direct access to speech coder Direct access to speech coder Gain setting via AT command. Defaults: inBbcGain outBbcGain Fix 4 (24dB) 1 (-6dB) Adjustable 2 (12dB) 1 (-6dB) Adjustable 5 (30dB) 2 (-12dB) Adjustable 4 (24dB) 1 (-6dB) Adjustable 0 (0dB) 0 (0dB) Adjustable 0 (0dB) 0 (0dB) Default audio interface 1 2 2 1 1 2 4) Power supply ON (2.65V) ON (2.65V) ON (2.65V) ON (2.65V) OFF (GND) OFF (GND)Sidetone ON --- Adjustable Adjustable Adjustable Adjustable Volume control OFF Adjustable Adjustable Adjustable Adjustable Adjustable Limiter (receive) ON ON ON ON --- --- Compressor (receive) --- OFF1) --- --- --- --- AGC (send) --- --- ON --- --- --- Echo control (send) Suppression Cancellation +suppression --- Suppres-sion --- --- Noise suppression2) --- up to 10dB 10dB --- --- --- MIC input signal for 0dBm0 @ 1024 Hz (default gain) 23mV 58mV 7.5mV @ -3dBm0 due to AGC 23mV 315mV 315mV EP output signal in mV rms. @ 0dBm0, 1024 Hz, no load (default gain); @ 3.14 dBm0 284mV 120mV default @ max volume 300mV default @ max volume 284mV default @ max volume 895mV 3.7Vpp 895mV 3.7Vpp Sidetone gain at default settings 22.8dB -$ dB Affected by AGC, 13dB @ 7.5mV (MIC) 22.8dB -2.5dB @ sideTone = 81923) -2.5dB @ sideTone = 81923) 1) Adaptive, receive volume increases with higher ambient noise level. The compressor can be activated by loading an application specific audio parameter set (see [10]). 2) In audio modes with noise reduction, the microphone input signal for 0dBm0 shall be measured with a sine burst signal for a tone duration of 5 seconds and a pause of 2 sec. The sine signal appears as noise and, after approx. 12 sec, is attenuated by the noise reduction by up to 10dB. 3) See AT^SNFO command in [1].
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 102 of 116 15.03.2004 4) Audio mode 5 and 6 are identical. With AT^SAIC, you can easily switch mode 5 to the second interface. Therefore, audio mode 6 is only kept for compatibility to earlier Siemens GSM products. Note: With regard to acoustic shock, the cellular application must be designed to avoid sending false AT commands that might increase amplification, e.g. for a high sensitive earpiece. A protection circuit should be implemented in the cellular application. 6.6.4 Voiceband receive path Test conditions: · The values specified below were tested to 1kHz and 0dB gain stage, unless otherwise stated. · Parameter setup: gs = 0dB means audio mode = 5 for GSM_EPP1 to GSM_EPN1 and 6 for GSM_EPP2 to GSM_EPN2, inBbcGain= 0, inCalibrate = 32767, outBbcGain = 0, OutCalibrate = 16384, sideTone = 0. Table 32: Voiceband receive path Parameter Min Typ Max Unit Test condition / remark Differential output voltage (peak to peak) 3.33 3.7 4.07 V from GSM_EPPx to GSM_EPNx gs = 0dB @ 3.14 dBm0 no load Differential output gain settings (gs) at 6dB stages (outBbcGain) -18 0 dB Set with AT^SNFO Fine scaling by DSP (outCalibrate) -$ 0 dB Set with AT^SNFO Output differential DC offset 100 mV gs = 0dB, outBbcGain = 0 and -6dB Differential output resistance 2 " from GSM_EPPx to GSM_EPNx Differential load capacitance 1000 pF from GSM_EPPx to GSM_EPNx Absolute gain accuracy 0.8 dB Variation due to change in temperature and life time Attenuation distortion 1 dB for 300...3900Hz, @ GSM_EPPx/ GSM_EPNx (333Hz) / @ GSM_EPPx/ GSM_EPNx (3.66kHz) Out-of-band discrimination 60 dB for f > 4kHz with in-band test signal@ 1kHz and 1kHz RBW gs = gain setting
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 103 of 116 15.03.2004 6.6.5 Voiceband transmit path Test conditions: · The values specified below were tested to 1kHz and 0dB gain stage, unless otherwise stated. · Parameter setup: Audio mode = 5 for GSM_MICP1 to GSM_MICN1 and 6 for GSM_MICP2 to GSM_MICN2, inBbcGain= 0, inCalibrate = 32767, outBbcGain = 0, OutCalibrate = 16384, sideTone = 0 Table 33: Voiceband transmit path Parameter Min Typ Max Unit Test condition/Remark Input voltage (peak to peak) GSM_MICP1 to GSM_MICN1, GSM_MICP2 to GSM_MICN2 1.03 V Input amplifier gain in 6dB steps (inBbcGain) 0 42 dB Set with AT^SNFI Fine scaling by DSP (inCalibrate) -$ 0 dB Set with AT^SNFI Input impedance GSM_MIC1 50 k" Input impedance GSM_MIC2 2.0 k" Microphone supply voltage ON Ri = 4k" (GSM_MIC2 only) 2.57 2.17 1.77 2.65 2.25 1.85 2.73 2.33 1.93 V V V no supply current @ 100µA @ 200µA Microphone supply voltage OFF; Ri = 4k" (GSM_MIC2 only) 0 V Microphone supply in POWER DOWN mode See Figure 18
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 104 of 116 15.03.2004 6.7 Air interface of the XT55 GSM/GPRS part Test conditions: All measurements have been performed at Tamb= 25°C, VGSM_BATT+ nom = 4.1V. The reference points used on XT55 are the GSM_BATT+ and GND contacts (test points are shown in Figure 52). Table 34: Air Interface Parameter Min Typ Max Unit E-GSM 900 880 915 MHz GSM 1800 1710 1785 MHz Frequency range Uplink (MS ® BTS) GSM 1900 1850 1910 MHz E-GSM 900 925 960 MHz GSM 1800 1805 1880 MHz Frequency range Downlink (BTS ® MS) GSM 1900 1930 1990 MHz E-GSM 900 1) 31 33 35 dBm GSM 1800 2) 28 30 32 dBm RF power @ ARP with 50" load GSM 1900 28 30 32 dBm E-GSM 900 174 GSM 1800 374 Number of carriers GSM 1900 299 E-GSM 900 45 MHz Duplex spacing GSM 1800 95 MHz GSM 1900 80 MHz Carrier spacing 200 kHz Multiplex, Duplex TDMA / FDMA, FDD Time slots per TDMA frame 8 Frame duration 4.615 ms Time slot duration 577 µs Modulation GMSK E-GSM 900 -102 -107 dBm GSM 1800 -102 -106 dBm Receiver input sensitivity @ ARP BER Class II < 2.4% GSM 1900 -102 -106 dBm 1) Power control level PCL 5 2) Power control level PCL 0
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 105 of 116 15.03.2004 6.8 Electrostatic discharge The GSM engine is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a XT55 module. Special ESD protection provided on XT55: Antenna interface: one spark discharge line (spark gap) SIM interface: clamp diodes for protection against overvoltage. The remaining ports of XT55 are not accessible to the user of the final product (since they are installed within the device) and therefore, are only protected according to the “Human Body Model” requirements. XT55 has been tested according to the EN 61000-4-2 standard. The measured values can be gathered from the following table. Table 35: Measured electrostatic values Specification / Requirements Contact discharge Air discharge ETSI EN 301 489-7 ESD at SIM port (GSM) ± 4kV ± 8kV ESD at GSM antenna port ± 4kV ± 8kV Indirect ESD to GSM/GPRS part ± 4kV - Indirect ESD to GPS part ± 4kV - Human Body Model (Test conditions: 1.5 kW, 100 pF) ESD at GPS antenna port ± 1kV ESD at all other ports ± 1kV Please note that the values may vary with the individual application design. For example, it matters whether or not the application platform is grounded over external devices like a computer or other equipment, such as the Siemens reference application described in Chapter 8.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 106 of 116 15.03.2004 6.9 Reliability characteristics The test conditions stated below are an extract of the complete test specifications. Table 36: Summary of reliability test conditions Type of test Conditions Standard Vibration Frequency range: 10-20 Hz; acceleration: 3.1mm amplitude Frequency range: 20-500 Hz; acceleration: 5g Duration: 2h per axis = 10 cycles; 3 axes DIN IEC 68-2-6 Shock half-sinus Acceleration: 500g Shock duration: 1msec 1 shock per axis 6 positions (± x, y and z) DIN IEC 68-2-27 Dry heat Temperature: +70 ±2°C Test duration: 16 h Humidity in the test chamber: < 50% EN 60068-2-2 Bb ETS 300019-2-7 Temperature change (shock) Low temperature: -40°C ±2°C High temperature: +85°C ±2°C Changeover time: < 30s (dual chamber system) Test duration: 1 h Number of repetitions: 100 DIN IEC 68-2-14 Na ETS 300019-2-7 Damp heat cyclic High temperature: +55°C ±2°C Low temperature: +25°C ±2°C Humidity: 93% ±3% Number of repetitions: 6 Test duration: 12h + 12h DIN IEC 68-2-30 Db ETS 300019-2-5 Cold (constant exposure) Temperature: -40 ±2°C Test duration: 16 h DIN IEC 68-2-1
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 107 of 116 15.03.2004 7 Mechanics The following chapters describe the mechanical dimensions of XT55 and give recommendations for integrating XT55 into the host application. 7.1 Mechanical dimensions of XT55 Figure 51 shows the top view of XT55. For further details see Figure 53. Size: 35.0 ± 0.15mm x 53.0 ± 0.15mm x 5.1 ± 0.2mm Weight: 11g Figure 51: XT55 – top view Figure 52 shows the bottom view of XT55 and marks the test points and pads for GSM antenna connection. Figure 52: XT55 bottom view Antenna ground Antenna pad TP GSM_BATT+ TP Ground GSM antenna connector GPS antenna connector
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 108 of 116 15.03.2004 3-LEFT4-BACK5.10 ±0. 20.85 ±0 . 135.00 ±0 . 152.320.2ø2 . 0 5 +0.01-0.0453.0±0.152.42.69.52.0+0.11.50.512.32.52.53.6Identificationlabel GSMIdentificationlabel GPS17.5Board-to-boardconnectorGround4.65.21.13.21.11.63.82.31.91.46.62.0Antenna pad3.0 ±0 . 214.719.22)1) max. ø 3 mm mounting area2) max. ø 3,2 mm mounting area3) 3.5 x 3.3 mm mounting area1)3)3.53.3GSM_BATT+Ground All dimensions in millimeters Figure 53: Mechanical dimensions of XT55
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 109 of 116 15.03.2004 7.2 Mounting XT55 onto the application platform There are many ways to properly install XT55 in the host device. An efficient approach is to mount the XT55 PCB to a frame, plate, rack or chassis. Fasteners can be M1.6 or M1.8 screws plus suitable washers, circuit board spacers, or customized screws, clamps, or brackets. Screws must be inserted with the screw head on the bottom of the XT55 PCB. In addition, the board-to-board connection can also be utilized to achieve better support. Particular attention must be paid to the holes marked with an arrow in Figure 52. The two holes are close to other components of XT55 and care must be taken to avoid contacting them. For example, you can insert plastic screws and plastic washers, or fasteners small enough not to protrude beyond the mounting areas specified in Figure 53. In case you wish to connect the host device using the mounting hole enclosed by the dashed line it is strongly recommended to use a plastic dowel according to Figure 55. Figure 54: Mounting holes on XT55 For proper grounding it is strongly recommended to use the ground plane on the back side in addition to the five GND pins of the board-to-board connector. To avoid short circuits ensure that the remaining sections of the XT55 PCB do not come into contact with the host device since there are a number of test points. Figure 52 shows the positions of all test points. To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it is positioned flat against the host device. All the information you need to install an antenna is summarized in Chapter 5. Note that the antenna pad on the bottom of the XT55 PCB must not be influenced by any other PCBs, components or by the housing of the host device. It needs to be surrounded by a restricted space as described in Chapter 5.1.2.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 110 of 116 15.03.2004 Figure 55: Recommended dowel
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 111 of 116 15.03.2004 7.3 Board-to-board connector This chapter provides specifications for the 80-pin board-to-board connector which serves as physical interface to the host application. The receptacle assembled on the XT55 PCB is type Hirose DF12C. Mating headers from Hirose are available in different stacking heights. Table 37: Ordering information DF12 series Item Part number Stacking height (mm) HRS number Receptacle on XT55 DF12B(3.0)-80DS-0.5V(81) 3.0 537-0733-9-81 Headers DF12 series DF12D(3.0)-80DP-0.5V(81) DF12E(3.0)-80DP-0.5V(81) 3.0 3.0 537-0803-2-81 537-0838-7-81 Notes: The headers listed above are without boss and metal fitting. Please contact Hirose for details on other types of mating headers. Asterixed HRS numbers denote different types of packaging. Table 38: Electrical and mechanical characteristics of the Hirose DF12C connector Parameter Specification (80 pin board-to-board connector) Number of contacts 80 Quantity delivered 2000 connectors per tape & reel Voltage 50V Rated current 0.3A max per contact Resistance 0.05 Ohm per contact Dielectric withstanding voltage 500V RMS min Operating temperature -45°C...+125°C Contact material phosphor bronze (surface: gold plated) Insulator material PA , beige natural Stacking height 3.0 mm Insertion force 21.8N Withdrawal force 1st 10N Withdrawal force 50th 10N Maximum connection cycles 50
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 112 of 116 15.03.2004 Figure 56: Mechanical dimensions of Hirose DF12 connector
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 113 of 116 15.03.2004 8 Reference approval 8.1 Reference equipment for type approval The Siemens reference setup submitted to type approve XT55 consists of the following components: · Siemens XT55 cellular engine · Development Support Box (DSB45) · Flex cable (160 mm) from Hirose DF12C receptacle on XT55 to Hirose DF12 connector on DSB45. Please note that this cable is not included in the scope of delivery of DSB45. · SIM card reader integrated on DSB45 · Handset type Votronic HH-SI-30.3/V1.1/0 · PC as MMI GP GSM engine PC Power supply SIMFlex cable160mm RS-232 DAI Box DSB45HandsetAcoustic tester GPS engine Antenna or 50 W cable to system simulator Antenna cable DAI cable for acoustic measuring Active GPS antenna Figure 57: Reference equipment for approval
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 114 of 116 15.03.2004 8.2 Compliance with FCC Rules and Regulations The FCC Equipment Authorization Certification for the reference application described in Chapter 8.1 is listed under the FCC identifier QIP granted to Siemens AG. The reference application registered under the above identifier is certified to be in accordance with the following Rules and Regulations of the Federal Communications Commission (FCC). “This device contains GSM 900 MHz and GSM 1800MHz functions that are not operational in U.S. Territories. This device is to be used only for mobile and fixed applications. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure com-pliance. Antennas used for this OEM module must not exceed 7dBi gain for mobile and fixed operating configurations. This device is approved as a module to be installed in other devices. Each OEM must obtain their own Certification for each device containing this module.” IMPORTANT: Manufacturers of mobile or fixed devices incorporating modules are advised to · clarify any regulatory questions, · have their completed product tested, · have product approved for FCC compliance, and · include instructions according to above mentioned RF exposure statements in end product user manual.
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 115 of 116 15.03.2004 9 List of parts and accessories Table 39: List of parts and accessories Description Supplier Ordering information XT55 module Siemens Siemens ordering number: L36880-N8380-A100 Siemens Car Kit Portable Siemens Siemens ordering number: L36880-N3015-A117 DSB45 Support Box Siemens Siemens ordering number: L36880-N8301-A100 BB35 Bootbox Siemens Siemens ordering number: L36880-N8102-A100-1 Votronic Handset VOTRONIC Votronic HH-SI-30.3/V1.1/0 VOTRONIC Entwicklungs- und Produktionsgesellschaft für elektronische Geräte mbH Saarbrücker Str. 8 66386 St. Ingbert Germany Phone: +49-(0)6 89 4 / 92 55-0 Fax: +49-(0)6 89 4 / 92 55-88 e-mail: contact@votronic.com SIM card holder incl. push button ejector and slide-in tray Molex Ordering numbers: 91228 91236 Sales contacts are listed in Table 40. DF12C board-to-board connector Hirose See Chapter 7.3 for details on receptacle on XT55 and mating headers. Sales contacts are listed in Table 41. U.FL-R-SMT antenna connector Hirose See Chapter 5.3 for details on U.FL-R-SMT connector, mating plugs and cables. Sales contacts are listed in Table 41. GPS antenna Falcom Ordering numbers: FAL-ANT-2 (combined dual band GSM antenna with active GPS antenna) FAL-ANT-3 (active GPS antenna) To place orders or obtain more information please contact: Falcom Wireless Communications GmbH Gewerbering 6 98704 Langewiesen Deutschland Telefon: (03677) 8042-0 E-Mail: info@falcom.de Info: http://www.falcom.de
XT55 Hardware Interface Description Confidential / Preliminary s mo b i l e XT55_hd_v00.02 Page 116 of 116 15.03.2004 Table 40: Molex sales contacts (subject to change) Molex For further information please click: http://www.molex.com/ Molex Deutschland GmbH Felix-Wankel-Str. 11 4078 Heilbronn-Biberach Germany Phone: +49-7066-9555 0 Fax: +49-7066-9555 29 Email: mxgermany@molex.com American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Molex China Distributors Beijing, Room 1319, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Phone: +86-10-6526-9728 Phone: +86-10-6526-9731 Fax: +86-10-6526-9730 Molex Singapore Pte. Ltd. Jurong, Singapore Phone: +65-268-6868 Fax: +65-265-6044 Molex Japan Co. Ltd. Yamato, Kanagawa, Japan Phone: +81-462-65-2324 Fax: +81-462-65-2366 Table 41: Hirose sales contacts (subject to change) Hirose Ltd. For further information please click: http://www.hirose.com Hirose Electric (U.S.A.) Inc 2688 Westhills Court Simi Valley, CA 93065 U.S.A. Phone: +1-805-522-7958 Fax: +1-805-522-3217 Hirose Electric GmbH Zeppelinstrasse 42 73760 Ostfildern Kemnat 4 Germany Phone: +49-711-4560-021 Fax +49-711-4560-729 E-mail info@hirose.de Hirose Electric UK, Ltd Crownhill Business Centre 22 Vincent Avenue, Crownhill Milton Keynes, MK8 OAB Great Britain Phone: +44-1908-305400 Fax: +44-1908-305401 Hirose Electric Co., Ltd. 5-23, Osaki 5 Chome, Shinagawa-Ku Tokyo 141 Japan Phone: +81-03-3491-9741 Fax: +81-03-3493-2933 Hirose Electric Co., Ltd. European Branch First class Building 4F Beechavenue 46 1119PV Schiphol-Rijk Netherlands Phone: +31-20-6557-460 Fax: +31-20-6557-469

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