Telegesis EM35XA ETRX35x Series Zigbee Modules User Manual TG ETRX35x PM 010 102 trac
Telegesis (UK) Ltd ETRX35x Series Zigbee Modules TG ETRX35x PM 010 102 trac
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Telegesis
TG-ETRX35X-PM-010-102
ETRX351 and ETRX357
Product Manual
ETRX35x ZIGBEE ® MODULES
PRODUCT MANUAL
©2010 Telegesis (UK) Ltd
ETRX35x Product Manual
ETRX351 and ETRX357
Table of Contents
1.1
2.1
2.1.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
INTRODUCTION ................................................................................................................. 5
Hardware Description ....................................................................................................... 5
PRODUCT APPROVALS ................................................................................................... 6
FCC Approvals ................................................................................................................. 6
FCC Labelling Requirements ........................................................................................... 6
IC (Industry Canada) Approvals ....................................................................................... 7
European Certification (ETSI)........................................................................................... 7
ICASA Approvals ............................................................................................................. 8
Australia and New Zealand (C-Tick) ................................................................................. 8
Declarations of Conformity ............................................................................................... 8
IEEE 802.15.4 .................................................................................................................. 8
The ZigBee® Protocol ...................................................................................................... 8
MODULE PINOUT .............................................................................................................. 9
HARDWARE DESCRIPTION ............................................................................................ 11
4.1
5.1
5.2
6.1
6.2
Hardware Interface......................................................................................................... 11
FIRMWARE DESCRIPTION ............................................................................................. 12
Custom Firmware ........................................................................................................... 12
Software Interface .......................................................................................................... 13
ABSOLUTE MAXIMUM RATINGS ................................................................................... 14
Environmental Characteristics ........................................................................................ 14
Recommended Operating Conditions............................................................................. 14
DC ELECTRICAL CHARACTERISTICS ........................................................................... 15
DIGITAL I/O SPECIFICATIONS ....................................................................................... 17
A/D CONVERTER CHARACTERISTICS .......................................................................... 18
10
AC ELECTRICAL CHARACTERISTICS ........................................................................... 18
10.1
TX Power Characteristics ............................................................................................... 20
11
PHYSICAL DIMENSIONS................................................................................................. 22
12
SOLDERING TEMPERATURE PROFILE (FOR REFLOW SOLDERING) ........................ 23
12.1
12.2
For Leaded Solder ......................................................................................................... 23
For Lead-free Solder ...................................................................................................... 23
13
PRODUCT LABEL DRAWING ......................................................................................... 24
14
RECOMMENDED FOOTPRINT ........................................................................................ 25
14.1
Example carrier board .................................................................................................... 26
15
RELIABILITY TESTS ........................................................................................................ 27
16
APPLICATION NOTES ..................................................................................................... 27
©2010 Telegesis (UK) Ltd
-2-
ETRX35x Product Manual
ETRX351 and ETRX357
16.1
16.2
16.3
17
17.1
17.2
17.3
17.4
Safety Precautions ......................................................................................................... 27
Design Engineering Notes.............................................................................................. 27
Storage Conditions......................................................................................................... 28
PACKAGING .................................................................................................................... 28
Embossed Tape ............................................................................................................. 28
Component Orientation .................................................................................................. 29
Reel Dimensions ............................................................................................................ 29
Packaging ...................................................................................................................... 29
18
ORDERING INFORMATION ............................................................................................. 30
19
DISCLAIMER .................................................................................................................... 31
20
ROHS DECLARATION ..................................................................................................... 31
21
DATA SHEET STATUS .................................................................................................... 31
22
LIFE SUPPORT POLICY .................................................................................................. 31
23
RELATED DOCUMENTS ................................................................................................. 32
24
CONTACT INFORMATION............................................................................................... 32
©2010 Telegesis (UK) Ltd
-3-
ETRX35x Product Manual
ETRX351 and ETRX357
The Telegesis ETRX351 and ETRX357 modules are low power
2.4GHz ZigBee modules, based on the latest Ember EM351
TM
and EM357 single chip ZigBee solutions.
rd
These 3 generation modules have been designed to be
integrated into any device without the need for RF experience
and expertise. Utilizing the EmberZNet ZigBee stack, the
ETRX35x enables you to add powerful wireless networking
capability to your products and quickly bring them to market.
Image not shown actual size; enlarged to show detail.
The module’s unique AT-style command line interface allows
designers to quickly integrate ZigBee technology without
complex software engineering. For custom application
development the ETRX35x series integrates with ease into
Ember’s InSight development environment.
Module Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Suggested Applications
Small form factor, SMT module 25mm x 19mm
Side Castellations for easy soldering and optical
inspection
2 antenna options: Integrated chip antenna or U.FL
coaxial connector
Industry’s first ARM® Cortex-M3 based family of ZigBee
modules
Industry standard JTAG Programming and real time
network level debugging via the Ember InSight Port
192kB (ETRX357) and 128kB (ETRX351) flash and
12kbytes of RAM
Lowest Deep Sleep Current of sub 1µA and multiple
sleep modes
Wide supply voltage range (2.1 to 3.6V)
Optional 32.768kHz watch crystal can be added
externally
Module ships with standard Telegesis AT-style
command interface based on the ZigBee PRO feature
set
Can act as an End Device, Router or Coordinator
24 general-purpose I/O lines including analogue inputs
(all GPIOs of the EM35x are accessible)
Firmware upgrades via serial port or over the air
(password protected)
Hardware supported encryption (AES-128)
CE, FCC and IC compliance, FCC modular approval
°
°
Operating temperature range: -40 C to +85 C
Long range version with a link budget of up to 124dB
available in the same form factor
•
•
•
•
•
•
•
•
AMR – ZigBee Smart Energy applications
Wireless Alarms and Security
Home/Building Automation
Wireless Sensor Networks
M2M Industrial Controls
Lighting and ventilation control
Remote monitoring
Environmental monitoring and control
Development Kit
•
•
•
New Development kit containing everything required to
set up a mesh network quickly and evaluate range and
performance of the ETRX35x and its long-range
version.
AT-style software interface command dictionary can be
modified for high volume customers.
Custom software development available upon request.
Example AT-Style Commands
AT+BCAST
Send a Broadcast
AT+UCAST: Send a Unicast
AT+EN
Establish PAN network
AT+JN
Join PAN
At power-up the last configuration is loaded from nonvolatile S-Registers, which can eliminate the need for an
additional host controller.
Radio Features
• Based on the Ember EM351 or EM357 single chip
ZigBee solutions
• 2.4GHz ISM Band
• 250kbit/s over the air data rate
• 16 channels (IEEE802.15.4 Channel 11 to 26)
• +3dBm output power ( +8dBm in boost mode)
• High sensitivity of -100dBm (-102dBm in boost mode)
typically @ 1% packet error rate
• RX Current: 26mA, TX Current: 31mA at 3dBm
• Robust Wi-Fi and Bluetooth coexistence
©2010 Telegesis (UK) Ltd
-4-
ETRX35x Product Manual
ETRX351 and ETRX357
1 Introduction
This document describes the Telegesis ETRX351 and ETRX357 ZigBee® modules which have
been designed to be easily integrated into another device and to provide a fast, simple and low
cost wireless mesh networking interface.
The Telegesis ETRX3 series modules are based on the Ember ZigBee® platform consisting of the
single chip EM351 or EM357 combined with the ZigBee® PRO compliant EmberZNet meshing
stack. Integration into a wide range of applications is made easy using a simple AT style
command interface and advanced hardware design.
The configurable functionality of the Telegesis AT Commandset often allows the ETRX3 series
ZigBee® modules to be used without an additional host microcontroller saving even more
integration time and costs. In addition to the Telegesis AT Commandset, the ETRX351 and
ETRX357 modules can be used with custom-built firmware whilst representing an ideal platform for
custom firmware development in conjunction with the Ember development kits.
No RF experience or expertise is required to add this powerful wireless networking capability to
your products. The ETRX351 and ETRX357 offer fast integration opportunities and the shortest
possible time to market for your product.
1.1
Hardware Description
The main building blocks of the ETRX351 and ETRX357 are the single chip EM351 and EM357
SoCs from Ember, a 24MHz reference crystal and RF front-end circuitry optimized for best RF
performance. The modules are available with on-board antenna or alternatively a U.FL coaxial
connector for attaching external antennae. Modules with the U.FL connector are identified by the
“HR” suffix.
The integrated antenna is an Antenova Rufa, and details of the radiation pattern etc are available
from the Antenova website [5].
Module
ETRX351
ETRX351HR
ETRX357
ETRX357HR
Chip
EM351
EM351
EM357
EM357
Flash
128kB
128kB
192kB
192kB
RAM
12kB
12kB
12kB
12kB
Table 1: Memories
The ETRX351 and ETRX357 are used for ZigBee® (www.zigbee.org) applications. If you wish to
create your own custom firmware, and not use the pre-loaded Telegesis AT-Command interface,
you will need the Ember InSight toolchain, consisting of InSight Desktop™ together with a
comprehensive integrated development environment (IDE). The Ember development environment
is currently not suitable for developing an IEEE802.15.4-only application that does not use the
ZigBee® layer.
©2010 Telegesis (UK) Ltd
-5-
ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
2 Product Approvals
The ETRX351 and ETRX357 as well as the ETRX351HR and ETRX357HR have been designed to
meet all national regulations for world-wide use. In particular the following certifications have been
obtained:
2.1
FCC Approvals
The Telegesis ETRX351 and ETRX357 with integrated Antenna as well as the ETRX351HR and
the ETRX357HR including the antennae listed in Table 2: Approved Antennae
have been tested to comply with FCC CFR Part 15 (USA) The devices meet the requirements for
modular transmitter approval as detailed in the FCC public notice DA00.1407.transmitter. FCC
statement:
This device complies with Part 15 of the FCC rules. Operation is subject to the following
two conditions: (1) this device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
FCC ID: S4GEM35XA
Item
Part No.
BT-Stubby
WH-2400-U2.5
Manufacturer
EAD Ltd. [6]
Wellhope Wireless [7]
Type
¼ Wave
½ Wave
Gain
0dBi
2.5dBi
Table 2: Approved Antennae
While the applicant for a device into which the ETRX351 (ETRX357) or ETRX351HR
(ETRX357HR) with an antenna listed in Table 2 is installed is not required to obtain a new
authorization for the module, this does not preclude the possibility that some other form of
authorization or testing may be required for the end product.
The FCC requires the user to be notified that any changes or modifications made to this device
that are not expressly approved by Telegesis (UK) Ltd. may void the user's authority to operate the
equipment.
When using the ETRX351HR and ETRX357HR with approved antennae, it is required to prevent
end-users from replacing them with non-approved ones.
2.1.1
FCC Labelling Requirements
When integrating the ETRX351, ETRX357, ETRX351HR or ETRX357HR into a product it must be
ensured that the FCC labelling requirements are met. This includes a clearly visible label on the
outside of the finished product specifying the Telegesis FCC identifier (FCC ID: S4GEM35XA) as
well as the FCC notice shown on the previous page. This exterior label can use wording such as
“Contains Transmitter Module FCC ID: S4GEM35XA” or “Contains FCC ID:S4GEM35XA”
although any similar wording that expresses the same meaning may be used.
©2010 Telegesis (UK) Ltd
-6-
ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
2.2
IC (Industry Canada) Approvals
The Telegesis ETRX351 and ETRX357 with integrated Antenna as well as the ETRX351HR and
the ETRX357HR including the antennae listed in Table 2: Approved Antennae
have been tested to comply with IC.
IC-ID: 8735A-EM35XA
The labelling requirements for Industry Cannada are similar to those of the FCC. Again a clearly
visibly lable must be placed on the outside of the finished product stating something like “Contains
Transmitter Module, IC: 8735A-EM35XA”, although any similar wording that expresses the same
meaning may be used.
The integrator is responsible for the final product to comply to IC ICES-003 and FCC Part 15, Sub.
B – Unintentional Radiators.
2.3
European Certification (ETSI)
The ETRX351, ETRX357, ETRX351HR and ETRX357HR have been certified to the following
standards:
• Radio:
EN 300 328:V1.7.1
• EMC:
EN 301 489-17:V2.1.1
• Safety:
EN 60950-1:2005 (Ed. 2.0)
•
For this purpose the ETRX351HR and ETRX357HR have been tested with the antennae listed in
Table 2: Approved Antennae
If the ETRX351, ETRX357, ETRX351HR or ETRX357HR module is incorporated into an OEM
product, the OEM product manufacturer must ensure compliance of the final product to the
European Harmonised EMC, and low voltage/safety standards. A Declaration of Conformity must
be issued for each of these standards and kept on file as described in Annex II of the R&TTE
Directive. The final product must not exceed the specified power ratings, antenna specifications
and installation requirements as specified in this user manual. If any of these specifications are
exceeded in the final product then a submission must be made to a notified body for compliance
testing to all of the required standards.
The ‘CE’ marking must be applied to a visible location on any OEM product. For more information
please refer to http://ec.europa.eu/enterprise/faq/ce-mark.htm.
Customers assume full
responsibility for learning and meeting the required guidelines for each country in their distribution
market.
©2010 Telegesis (UK) Ltd
-7-
ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
2.4
ICASA Approvals
The ETRX351, ETRX357, ETRX351HR and ETRX357HR have been certified to be used in South
Africa.
2.5
Australia and New Zealand (C-Tick)
The ETRX351, ETRX357, ETRX351HR and ETRX357HR have been certified to be used in
Australia and new Zealand.
2.6
Declarations of Conformity
Telegesis (UK) Ltd has issued Declarations of Conformity for all ETRX3 series ZigBee® RF
Modules, which cover Radio Emissions, EMC and Safety. These documents are available from our
website or on request.
2.7
IEEE 802.15.4
IEEE 802.15.4 is a standard for low data-rate, wireless networks (raw bit-rate within a radio packet
of 250kbps @2.4GHz) which focuses on low cost, low duty cycle, long primary battery life
applications as well as mains-powered applications. It is the basis for the open ZigBee® Protocol.
2.8
The ZigBee® Protocol
The ZigBee® Protocol is a set of standards for wireless connectivity for use between any devices
over short to medium distances. The specification was originally ratified in December 2004, paving
the way for companies to start making low-power networks a reality.
ZigBee® uses the IEEE 802.15.4 radio specification running on the 2.4GHz band, plus three
additional layers for networking, security and applications. What makes the specification unique is
its use of a mesh network architecture which, in bucket chain style, passes data from one node to
the next until it lands at its destination. The network is self-healing and adapts its routing as link
quality changes or nodes move. Furthermore, nodes can be defined as End Devices which do not
act as routers, but can therefore be put into a low-power sleep state.
The enhanced version of the ZigBee® standard (or ZigBee® 2006) was released in December
2006, adding new features and improvements to the only global wireless communication standard
enabling the development of easily deployable low-cost, low-power, monitoring and control
products for homes, commercial buildings and industrial plant monitoring. In 2007 the ZigBee
Alliance introduced the PRO featureset which offers advantages over earlier versions, including
•
•
•
•
•
Truly self healing mesh networking
Messages can now travel up to 30 hops
Source-Routing for improved point to multipoint message transmission
Improved security including Trust-Centre link keys
New message types and options
The Telegesis AT Commandset, which by default ships on all ETRX3 series products is based on
the ZigBee® PRO featureset. For more information on the Telegesis AT Commandset please refer
to the separate documentation at www.telegesis.com.
©2010 Telegesis (UK) Ltd
-8-
ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
3 Module Pinout
Figure 1: ETRX3 series Module Pinout (top view)
The table below gives details about the pin assignment for direct SMD soldering of the ETRX3
series modules to the application board. For more information on the alternate functions please
refer to [2]. Also refer to the Telegesis AT Commandset documentation and the Telegesis
development kit documentation to understand how the pre-programmed firmware makes use of the
individual I/Os.
All GND pads are connected within the module, but for best RF performance all of them should be
grounded externally ideally to a ground plane.
ETRX35x
Pad
Name
EM35x Pin
Default use
10
11
12
13
14
15
16
17
18
19
GND
PC5 {1}
PC6
PC7
PA7 {5}
PB3 {2,3}
nReset
PB4 {2,3}
PA0
PA1
PA2
PA3
GND
PA4
PA5 {4}
PA6 {5}
PB1 {3}
PB2 {3}
GND
GND
11
13
14
18
19
12
20
21
22
24
25
GND
26
27
29
30
31
GND
GND
©2010 Telegesis (UK) Ltd
Alternate Functions
TX_ACTIVE
OSC32B, nTX_ACTIVE
OSC32A, OSC32_EXT
TIM1C4
SC1nCTS, SC1SCLK, TIM2C3
O/P
O/P
O/P
O/P, CTS
nReset
O/P, RTS
O/P
O/P
O/P
O/P
GND
O/P
O/P
O/P
TXD
RXD
GND
TIM2C4, SC1nRTS, SC1nSSEL
TIM2C1, SC2MOSI
TIM2C3, SC2SDA, SC2MISO
TIM2C4, SC2SCL, SC2SCLK
SC2nSSEL, TRACECLK, TIM2C2
ADC4, PTI_EN, TRACEDATA
ADC5, PTI_DATA, nBOOTMODE, TRACEDATA3
TIM1C3
SC1MISO, SC1MOSI, SC1SDA, SC1TXD, TIM2C1
SC1MISO, SC1MOSI, SC1SCL, SC1RXD, TIM2C2
-9-
ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
ETRX35x
Pad
Name
EM35x Pin
Default use
20
21
22
23
24
25
26
27
28
29
30
31
32
33
GND
JTCK
PC2
PC3
PC4
PB0
PC1
PC0 {5}
PB7 {5}
PB6 {5}
PB5
GND
Vcc
GND
GND
32
33
34
35
36
38
40
41
42
43
GND
Vcc
GND
GND
O/P
O/P
O/P
I/P, IRQ
ADC
O/P
ADC
ADC
ADC
GND
Vcc
GND
Alternate Functions
SWCLK
JTDO, SWO
JTDI
JTMS, SWDIO
VREF, IRQA, TRACECLK, TIM1CLK, TIM2MSK
ADC3, SWO, TRACEDATA0
JRST, IRQD, TRACEDATA1
ADC2, IRQC, TIM1C2
ADC1, IRQB, TIM1C1
ADC0, TIM2CLK, TIM1MSK
Table 3: Pin Information
Notes:
{1} When the alternate function is selected, TX_ACTIVE becomes an output that indicates that the
EM35x radio circuit is in transmit mode. PC5 is not usable on the long range version of the
ETRX35x as this GPIO is used internally as TX_ACTIVE to control the external RF frontend.
{2} The serial UART connections TXD, RXD, CTS and RTS are PB1, PB2, PB3 and PB4 respectively
{3} When using the Telegesis AT Commandset, RTS/CTS handshaking is selectable in firmware. See
the AT Command Manual.
{4} If PA5 is driven low at power-up or reset the module will boot up in the bootloader
{5} PA6, PA7, PB6, PB7 and PC0 can drive high current (see section 8)
See also the table “Module pads and functions” in the ETRX357 Development Kit Product Manual.
©2010 Telegesis (UK) Ltd
- 10 -
ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
4 Hardware Description
Vreg
Vcc
I/O
LDO
1V8
1,8Vdc
integrated
antenna
LDO
1V25
A/D
EM35x
RESET
BALUN
U.FL socket
rf
terminal
selection,
filtering and
matching
circuitry
I/O
UART
JTAG
RESET
programming
24MHz
Figure 2: Hardware Diagram
The ETRX351, ETRX351HR, ETRX357 and ETRX357HR are based on the Ember EM351 and
EM357 respectively. The EM351 and EM357 are fully integrated 2.4GHz ZigBee transceivers with
a 32-bit ARM® Cortex M3TM microprocessor, flash and RAM memory, and peripherals.
The industry standard serial wire and JTAG programming and debugging interfaces together with
the standard ARM system debug components help to streamline any custom software
development.
In addition to this a number of MAC functions are also implemented in hardware to help
maintaining the strict timing requirements imposed by the ZigBee and IEEE802.15.4 standards.
The new advanced power management features allow faster wakeup from sleep and new power
down modes allowing this 3rd generation module to offer a longer battery life than any 2nd
generation modules on the market.
The EM35x has fully integrated voltage regulators for both required 1.8V and 1.25V supply
voltages. The voltages are monitored (brown-out detection) and the built in power-on-reset circuit
eliminates the need for any external monitoring circuitry. An optional 32.768 kHz watch crystal can
be connected externally to pads 3 and 4 in case more accurate timing is required. To utilize the
external watch crystal custom firmware is required.
4.1
Hardware Interface
All GPIO pins of the EM351 or EM357 are accessible on the module’s pads. Whether signals are
used as general purpose I/Os, or assigned to a peripheral function like ADC is set by the firmware.
When using the Telegesis AT Commandset please refer to the AT Commandset manual and the
development kit manual for this information and when developing custom firmware please refer to
the EM35x datasheet [2].
©2010 Telegesis (UK) Ltd
- 11 -
ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
5 Firmware Description
The modules will be pre-loaded with a standalone bootloader which supports over-the-air
bootloading as well as serial bootloading of new firmware.
In order to enter the standalone bootloader using a hardware trigger pull PA5 to ground and
power-cycle or reset the module. To avoid entering the standalone bootloader unintentionally
make sure not to pull this pin down during boot-up unless the resistance to ground is >10kΩ. (A
pull-up is not required).
In addition to the standalone bootloader the modules also contain the current release of the
Telegesis AT-style command interface as described in the Telegesis AT command dictionary and
the Telegesis user guide. Check www.telegesis.com for updates. Each module comes with a
unique 64-bit 802.15.4 identifier which is stored in non-volatile memory. The commands and
responses pass through the serial port of the ETRX35x as ASCII text, so a simple terminal
application will usually suffice. We provide Telegesis Terminal for interaction with the module but it
is not an essential feature.
The pre-loaded AT-style command interface firmware is based on the latest EmberZNet meshing
stack which implements routers/coordinators as well as (sleepy) end devices. [End devices have
no routing responsibility and therefore are allowed to go to sleep, whilst still being able to send and
receive messages via a parent router. In addition to classical sleepy and non-sleepy end devices
the module firmware also supports mobile (sleepy) end devices capable of changing their parent
quickly whenever they change their position within the network.]
A router is typically a mains powered device whilst a sleepy end device (SED) can be battery
powered.
The module is also able to act as a coordinator and Trust Centre through external host control.
The AT style command line supplies all the tools required to set up and manage a ZigBee network
by allowing easy access to the low-level functionality of the stack.
The Telegesis firmware uses the meshing and self healing EmberZNet PRO stack to overcome
many of the limitations of the tree network topology of the ZigBee® 2006 stack by using the ZigBee
PRO featureset.
The Telegesis firmware allows low-level access to physical parameters such as channel and
power level. Parameters that define the functionality of the ETRX35x module and also allow
standalone functionality are saved in non-volatile memory organised in so-called S-Registers. The
SPI and I2C buses are not supported by the current firmware release, but can be used with custom
firmware.
5.1
Custom Firmware
For high volume customers the firmware can be customised on request. In addition to this the
ETRX3 series of modules is an ideal platform for developing custom firmware. In order to develop
custom firmware the Ember Insight toolchain is required.
©2010 Telegesis (UK) Ltd
- 12 -
ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
5.2
Software Interface
Using the default firmware the ETRX35x is controlled using a simple AT-style command interface
and (mostly) non-volatile S-Registers. In order to get a full listing of all the available ATCommands, please refer to the AT command dictionary document which corresponds to the
firmware revision you intend to use.
In addition to the command dictionary there are user guides explaining the features of the firmware
in more detail. If you need to find out which firmware resides on your module simply type “ATI”
followed by a carriage return and you will be prompted with the module’s manufacturing
information.
The Development Kit manual describes how to upgrade the firmware either via a serial link or over
the air.
©2010 Telegesis (UK) Ltd
- 13 -
ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
6 Absolute Maximum Ratings
No.
Item
Symbol
Absolute Maximum Ratings
Unit
Supply voltage
Voltage on any Pad
Voltage on any Pad pin (PA4, PA5, PB5,
PB6, PB7, PC1), when used as an input
to the general purpose ADC with the
low voltage range selected
Storage temperature range
Operating temperature range
Input RF level
Reflow temperature
VCC
Vin
-0.3 to +3.6
-0.3 to VCC +0.3
Vdc
Vdc
Vin
-0.3 to +2.0
Vdc
Tstg
Top
Pmax
TDeath
-40 to +105
-40 to +85
15
Please refer to chapter 12
°C
°C
dBm
°C
Table 4: Absolute Maximum Ratings
The absolute maximum ratings given above should under no circumstances be violated.
Exceeding one or more of the limiting values may cause permanent damage to the device.
Caution! ESD sensitive device. Precautions should be used when handling the device
in order to prevent permanent damage.
6.1
No.
Environmental Characteristics
Item
ESD on any pad according to
Human Body Model (HBM) circuit
description
ESD on non-RF pads according to
Charged Device Model (CDM) circuit
description
ESD on RF terminal according to
Charged Device Model (CDM) circuit
description
Moisture Sensitivity Level
Symbol
Absolute Maximum Ratings
Unit
VTHHBM
±2
kV
VTHCDM
±400
VTHCDM
±225
MSL
MSL3
Table 5: Absolute Maximum Ratings
6.2
No.
Recommended Operating Conditions
Condition /
Remark
Item
Symbol
Value
Min
Supply voltage
RF Input Frequency
RF Input Power
Operating temperature
range
Typ
Unit
Max
VCC
fC
pIN
2.1
2405
3.6
2480
Vdc
MHz
dBm
Top
-40
+85
°C
Table 6: Recommended Operating Conditions
©2010 Telegesis (UK) Ltd
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ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
7 DC Electrical Characteristics
VCC = 3.0V, TAMB = 25°C, NORMAL MODE (non-Boost) unless otherwise s tated
No.
Condition /
Remark
Item
Symbol
Value
Min
Module supply voltage
Deep Sleep Current
Quiescent current,
internal RC oscillator
disabled
Quiescent current,
internal RC oscillator
enabled
Quiescent current,
including
32.768kHz oscillator
Quiescent current
including internal RC
oscillator and 32.768kHz
oscillator
Reset Current
Quiescent current NReset
asserted
Processor and Peripheral Currents
®
TM
ARM Cortex M3, RAM
and flash memory
®
TM
ARM Cortex M3, RAM
and flash memory
®
TM
ARM Cortex M3, RAM
and flash memory sleep
current
®
TM
ARM Cortex M3, RAM
10
and flash memory sleep
current
11
Serial controller current
General purpose timer
current
General purpose ADC
13
current
RX Current
Radio receiver MAC and
14
Baseband
Receive current
15
consumption
Receive current
16
consumption
Receive current
17
consumption
BOOST MODE
Receive current
18
consumption
BOOST MODE
TX Current
Transmit current
19
consumption
Transmit Current
20
consumption
BOOST MODE
12
VCC
Unit
Typ
2.1
Max
3.6
Vdc
ISLEEP
0.4
µA
ISLEEP
0.7
µA
ISLEEP
1.0
µA
ISLEEP
1,3
µA
IRESET
1.2
IMCU
6.0
mA
IMCU
7.5
mA
25°C, 12MHz
Core clock
IMCU
3.0
mA
25°C, 6MHz Core
clock
IMCU
2.0
mA
ISC
0.2
mA
ITIM
0.25
mA
IADC
1.1
mA
IRX
22
mA
IRX
25
mA
IRX
26.5
mA
Total, 12MHz
clock speed
IRX
27
mA
Total, 24MHz
clock speed
IRX
28.5
mA
at +3dBm module
output power
ITXVCC
31
mA
at +8dBm module
output power
ITXVCC
42
mA
25°C, 12MHz
Core clock
25°C, 24MHz
Core clock
Per serial
controller at max.
clock rate
Per timer at max.
clock rate
Max. Sample rate,
DMA
®
mA
TM
ARM Cortex
M3 sleeping.
Total, 12MHz
clock speed
Total, 24MHz
clock speed
©2010 Telegesis (UK) Ltd
2.0
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ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
21
22
Transmit current
consumption
Transmit current
consumption
23
Wake time from deep
sleep
24
Shutdown time
at +0dBm module
output power
at min. module
output power
From wakeup
st
event to 1
instruction
From last
instruction into
deep sleep
ITXVCC
28.5
mA
ITXVCC
23.5
mA
100
µs
µs
Table 7: DC Electrical Characteristics
Please Note: The average current consumption during operation is dependent on the firmware
and the network load, therefore these figures are provided in the command dictionary of the
respective firmware.
©2010 Telegesis (UK) Ltd
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ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
8 Digital I/O Specifications
The digital I/Os of the ETRX35x module
VCC = 3.0V, TAMB = 25°C, NORMAL MODE unless otherwise stated
No.
Condition /
Remark
Item
Symbol
Value
Min
Low Schmitt switching
threshold
High Schmitt switching
threshold
Schmitt input
threshold going
from high to low
Schmitt input
threshold going
from low to high
Input current for logic 0
Input current for logic 1
Input Pull-up resistor
value
Input Pull-down resistor
value
Output voltage for logic 0
Output voltage for logic 1
Output Source Current
10
Output Sink current
11
12
13
Output Source Current
Output Sink current
Total output current
Typ
Max
VSWIL
0.42 x VCC
0.5 x VCC
Vdc
VSWIH
0.62 x VCC
0.8 x VCC
MHz
-0.5
0.5
µA
µA
IIL
IIH
IOL = 4mA (8mA) for
standard (high
current) pads
IOH = 4mA (8mA)for
standard (high
current) pads
Standard current
pad
Standard current
pad
High current pad
High current pad
Unit
RIPU
24
29
34
kΩ
RIPD
24
29
34
kΩ
VOL
0.18 x VCC
VOH
0.82 x VCC
VCC
IOHS
mA
IOLS
mA
IOHH
IOLH
IOH + IOL
40
mA
mA
mA
Table 8. Digital I/O Specifications
©2010 Telegesis (UK) Ltd
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ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
9 A/D Converter Characteristics
The ADC is a first-order sigma-delta converter. For additional information on the ADC please refer
to section 10 of the EM35x datasheet.
No.
Item
A/D resolution
A/D sample time for 5-bit conversion
A/D sample time for 12-bit conversion
Reference Voltage
Up to 12 bits
5.33µs
682µs
1.25V or Vcc
Table 9. A/D Converter Characteristics
10 AC Electrical Characteristics
VCC = 3.0V, TAMB = 25°C, NORMAL MODE measured at 50 Ω terminal load connected to the U.FL socket
No.
Receiver
Min
10
11
12
13
14
15
16
17
18
19
20
Frequency range
Sensitivity for 1% Packet Error Rate (PER)
Sensitivity for 1% Packet Error Rate (PER) BOOST MODE
Saturation (maximum input level for correct operation)
High-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
Low-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
nd
2 High-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
nd
2 Low-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
Channel Rejection for all other channels
(1% PER and desired signal –82dBm acc. to [1])
802.11g rejection centred at +12MHz or –13MHz
(1% PER and desired signal –82dBm acc. to [1])
Co-channel rejection
(1% PER and desired signal –82dBm acc. to [1])
Relative frequency error
(2x40ppm required by [1])
Relative timing error
(2x40ppm required by [1])
Linear RSSI range
Output power at highest power setting
NORMAL MODE
BOOST MODE
Output power at lowest power setting
Error vector magnitude as per IEEE802.15.4
Carrier frequency error
PSD mask relative
3.5MHz distance from carrier
PSD mask absolute
3.5MHz distance from carrier
Value
Typ
Max
-100
-102
2500
-94
-96
2400
Unit
MHz
dBm
dBm
dBm
35
dB
35
dB
46
46
40
dB
36
dB
-6
dBc
-120
120
ppm
-120
120
ppm
40
dB
-55
-40
dBm
15
40
dBm
ppm
-20
dB
-30
dBm
Table 10. AC Electrical Characteristics
©2010 Telegesis (UK) Ltd
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ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
Please Note: For the relationship between EM35x power settings and module output power
please relate to chapter 10.1 of this document. When developing custom firmware the output
power settings described in this document relate directly to the EM35x power settings accessible
via the Ember stack API.
No.
Synthesiser Characteristics
Limit
Typ
Min
22
23
24
25
26
27
28
29
Frequency range
Frequency resolution
Lock time from off state, with correct VCO DAC settings
Relock time, channel change or Rx/Tx turnaround
Phase noise at 100kHz offset
Phase noise at 1MHz offset
Phase noise at 4MHz offset
Phase noise at 10MHz offset
2400
11.7
Unit
Max
2500 MHz
kHz
100 µs
100 µs
-75dBc/Hz
-100dBc/Hz
-108dBc/Hz
-114dBc/Hz
Table 11: Synthesiser Characteristics
No.
30
31
Power On Reset (POR) Specifications
VCC POR release
VCC POR assert
Min
Limit
Typ
Max
Unit
0.62
0.45
0.95
0.65
1.2
0.85
Limit
Typ
Max
Vdc
Vdc
Table 12: Power On Reset Specifications
No.
nRESET Specifications
Min
32
33
34
Reset Filter Time constant
Reset Pulse width to guarantee a reset
Reset Pulse width guaranteed not to cause reset
2.1
26
12
Unit
16
µs
µs
µs
Table 13: nReset Specifications
©2010 Telegesis (UK) Ltd
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ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
10.1 TX Power Characteristics
The diagrams below show the typical output power and module current in dependency on module
EM35x power setting . Power settings above 3dBm have Boost Mode enabled. Please note that
the output power is independent of the supply voltage as the radio is supplied by an internally
regulated
voltage.
Figure 3: Output Power vs. Power Setting
©2010 Telegesis (UK) Ltd
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ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
Figure 4: Module Current vs. Power Setting
©2010 Telegesis (UK) Ltd
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ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
11 Physical Dimensions
Figure 5: ETRX3 Physical Dimensions
Symbol
Explanation
Typical Distance
A1
A2
R1
R2
X1
X2
Length of the module
Width of the module
Height of the module
Distance centre of pad PCB edge
Pitch
Keep-out Zone from corner of PCB
Keep-out Zone from corner of PCB
Distance centre of Antenna connector PCB edge
Distance centre of Antenna connector PCB edge
25.0mm
19.0mm
3.8mm
0.9mm
1.27mm
17.5mm
4.1mm
3.8mm
2.8mm
Table 14: ETRX3 Physical Dimensions
For ideal RF performance when using the on-board antenna, the antenna should be located at the
corner of the carrier PCB. There should be no components, tracks or copper planes in the keepout area which should be as large as possible. When using the U.FL RF connector the keep-out
area does not have to be obeyed. Note: The modules’ transmit/receive range will depend on the
antenna used and also the housing of the finished product.
©2010 Telegesis (UK) Ltd
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ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
12 Soldering Temperature Profile (for reflow soldering)
12.1 For Leaded Solder
10 ±1s
Recommended temperature profile
for reflow soldering
30 +20/-10s
235°C max.
Temp .[°C]
220 ±5°C
200°C
150 ±10°C
90 ±30s
Time [s]
Figure 6: Temperature Profile for Leaded Solder
12.2 For Lead-free Solder
Recommended temperature profile
for reflow soldering
Temp .[°C]
30 +20/-10s
230°C -250°C max.
220°C
150°C – 190°C
90 ±30s
Time [s]
Figure 7: Temperature Profile for Lead-free Solder
Please Note:
Maximum number of reflow cycles: 2
Opposite-side reflow is prohibited due to the module’s weight. (i.e. you must not place the
module on the bottom / underside of your pcb and re-flow).
©2010 Telegesis (UK) Ltd
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ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
13 Product Label Drawing
Figure 8: Product Label
The label dimensions are 14.0mm x 14.0 mm. The label will withstand temperatures and
chemicals used during a typical manufacturing process.
Example imprint
ETRX357HR
000001
090101
01
02
FCC ID: S4GEM35XA
2D-Barcode
Description
Module Order code
Indication for the serial number.
Production Date Code in the format YYMMDD, e.g. 090602
Indication for batch number
Indication for the hardware revision
FCC ID code for this product
Information in the Datamatrix 2D-Barcode are the serial number [6 characters], the Part-Order
code [12 characters], identifier for the batch number [2 characters], the identifier for the
hardware release [2 characters] and the production date code in the format Year-Month-Day
[6 characters], separated by a semicolon.
Table 15: ETRX3xx Label Details
©2010 Telegesis (UK) Ltd
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ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
14 Recommended Footprint
In order to surface mount an ETRX3 series module, we recommend that you use pads which are
1mm wide and 1.2mm high. You must retain the keep-out zone shown in section 12, and ensure
that this keep-out area is free of components, copper tracks and/or copper planes/layers.
You must also ensure that there is no exposed copper on your layout which may contact with the
backside of the ETRX3 series module.
For best RF performance it is required to provide good ground connections to the ground pads of
the module. It is recommended to use multiple vias between each ground pad and a solid ground
plane to minimize inductivity in the ground path.
Figure 9: Recommended Footprint
The land pattern dimensions above serve as a guideline.
We recommend that you use the same pad dimensions for the solder paste screen as you have for
the copper pads. However these sizes and shapes may need to be varied depending on your
soldering processes and your individual production standards. We recommend a paste screen
thickness of 120µm to 150µm.
Although the undersides of the ETRX3 series modules are fully coated, no exposed copper, such
as uncovered through-hole vias, planes or tracks on your board component layer, should be
located below the ETRX3 series module in order to avoid ‘shorts’. All ETRX3 series modules use
a multilayer PCB containing an inner RF shielding ground plane, therefore there is no need to have
an additional copper plane directly under the ETRX3 series module.
©2010 Telegesis (UK) Ltd
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ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
14.1 Example carrier board
Since the RF performance of the module with the on board antenna is strongly dependent on the
proper location of the module on its carrier board, Figure 10 shows the reference carrier board
which was used during testing by Telegesis.
Figure 10. Reference Board
For best performance it is recommended to locate the antenna towards the corner of the carrier
board and to respect the recommended keep-out areas as described in section 11.
Finally to provide a good reference ground to the on board antenna, the carrier board should have
a ground plane spanning no less than 40 x 40mm. In many cases a smaller ground plane will
suffice, but degradation in radio performance could be the result.
©2010 Telegesis (UK) Ltd
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ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
15 Reliability Tests
The measurements below have been conducted on random samples out of mass production and
passed after the module has been exposed to standard room temperature and humidity for 1 hour.
No
Item
Limit
Vibration test
Electrical parameter should be
in specification
Shock test
the same as the above
Heat cycle test
the same as the above
Moisture test
Low temp. test
High temp. test
the same as the above
the same as the above
the same as the above
Condition
a) Freq.:10~50Hz,Amplitude:1.5mm
a) 20min. / cycle,1hrs. each of XYZ axis
b) Freq.:30~100Hz, 6G
b) 20min. / cycle,1hrs. each of XYZ axis
Dropped onto hard wood from height of
50cm for 3 times
-40°C for 30min. and +85°C for 30min.;
each temperature 300 cycles
+60°C, 90% RH, 300h
-40°C, 300h
+85°C, 300h
Table 16: Reliability Tests
16 Application Notes
16.1 Safety Precautions
These specifications are intended to preserve the quality assurance of products as individual
components.
Before use, check and evaluate the module’s operation when mounted on your products.
Abide by these specifications when using the products. These products may short-circuit. If
electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a
short circuit occurs, then provide the following failsafe functions as a minimum:
(1)
Ensure the safety of the whole system by installing a protection circuit and a protection
device.
(2)
Ensure the safety of the whole system by installing a redundant circuit or another
system to prevent a single fault causing an unsafe status.
16.2 Design Engineering Notes
(1)
Heat is the major cause of shortening the life of the modules. Avoid assembly and use
of the target equipment in conditions where the product’s temperature may exceed the
maximum allowable.
(2)
Failure to do so may result in degrading of the product’s functions and damage to the
product.
(3)
If pulses or other transient loads (a large load applied in a short time) are applied to the
products, before use, check and evaluate their operation when assembled onto your
products.
(4)
These products are not intended for other uses, other than under the special conditions
shown below. Before using these products under such special conditions, check their
©2010 Telegesis (UK) Ltd
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ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
performance and reliability under the said special conditions carefully, to determine
whether or not they can be used in such a manner.
(5)
In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where
liquid may splash.
(6)
In direct sunlight, outdoors, or in a dusty environment
(7)
In an environment where condensation occurs.
(8)
In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2,
SO2, H2S, NH3, and NOx)
(9)
If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these products with new products because they may not be able to
provide normal performance even if their electronic characteristics and appearances
appear satisfactory.
(10) Mechanical stress during assembly of the board and operation has to be avoided.
(11) Pressing on parts of the metal cover or fastening objects to the metal cover is not
permitted.
16.3 Storage Conditions
(1)
The module must not be stressed mechanically during storage.
(2)
Do not store these products in the following conditions or the performance
characteristics of the product, such as RF performance, may well be adversely
affected:
(3)
Storage in salty air or in an environment with a high concentration of corrosive gas,
such as Cl2, H2S, NH3, SO2, or NOX
(4)
Storage in direct sunlight
(5)
Storage in an environment where the temperature may be outside the range of 5°C to
35°C range, or where the humidity may be outside th e 45 to 85% range.
(6)
Storage (before assembly of the end product) of the modules for more than one year
after the date of delivery at your company even if all the above conditions (1) to (3)
have been met, should be avoided.
17 Packaging
17.1 Embossed Tape
(1)
Dimension of the tape
t.b.d.
©2010 Telegesis (UK) Ltd
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ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
(2)
Cover tape peel force
Force direction
Speed = 300mm/min.
θ = 10deg
Cover tape peel force
=0.098～0.68N (10～70g)
(3)
Empty pockets
Direction of
gfeed
Empty pockets
more
Components Empty pockets Top cover
tape
NB: Empty pockets in the populated area will be less than two per reel and those empty pockets
will not be consecutive.
17.2 Component Orientation
Top cover tape will not obstruct the carrier tape holes and will not extend beyond the edges
of the carrier tape
(top view)
Part No.
Direction
Component Orientation
17.3 Reel Dimensions
(4)
Quantity per reel: 600 pieces
(5)
Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code will be on
the reel
t.b.d.
17.4 Packaging
(6)
Each reel will be packed in a hermetically-sealed bag
(7)
Marking:
Part No. / Quantity / Lot No. and manufacturer part# with bar-code
©2010 Telegesis (UK) Ltd
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ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
18 Ordering Information
Ordering/Product Code
Description
ETRX351
ETRX357
Telegesis Wireless Mesh Networking Module with Ember
ZigBee® Technology:
•
•
•
•
ETRX351HR
ETRX357HR
Telegesis Wireless Mesh Networking Module with Ember
ZigBee® Technology:
•
•
•
•
ETRX3DVK
Based on Ember EM351 or EM357
Telegesis AT Style Command Interpreter based on
EmberZNet meshing and self-healing ZigBee® PRO
stack
Integrated 2.4GHz Antenna
Based on Ember EM351 or EM357
Telegesis AT Style Command Interpreter based on
EmberZNet meshing and self-healing ZigBee® PRO
stack
U.FL coaxial Antenna Connector
Telegesis Development Kit with:
•
•
•
•
•
•
•
•
•
3 x ETRX35xDV Development Boards
3 x USB cables
2 x ETRX35x on carrier boards
2 x ETRX35xHR on carrier boards
2 x ETRX35x-LR on carrier boards
2 x ETRX35xHR-LR on carrier boards
1 x ETRX2USB USB stick
2 x ½-wave antennae
2 x ¼-wave antennae
Notes:
• Customers’ PO’s must state the Ordering/Product Code.
• There is no “blank” version of the ETRX35x modules available. All Modules are preprogrammed with the Telegesis AT style command interpreter based on the EmberZNet
stack. (In case it is desired to program custom firmware the pre-programmed firmware can
simply be overwritten).
©2010 Telegesis (UK) Ltd
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ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
19 Disclaimer
Product and company names and logos referenced may either be trademarks or registered
trademarks of their respective companies. We reserve the right to make modifications and/or
improvements without prior notification. All information is correct at time of issue. Telegesis (UK)
Ltd does not convey any license under its patent rights or assume any responsibility for the use of
the described product
20 RoHS Declaration
Declaration of environmental compatibility for supplied products:
Hereby we declare based on the declaration of our suppliers that this product does not contain the
following substances which are banned by Directive 2002/95/EC (RoHS) or if they do, contain a
maximum concentration of 0,1% by weight in homogeneous materials for:
•
•
•
•
•
Lead and lead compounds
Mercury and mercury compounds
Chromium (VI)
PBB (polybrominated biphenyl) category
PBDE (polybrominated biphenyl ether) category
And a maximum concentration of 0.01% by weight in homogeneous materials for:
•
Cadmium and cadmium compounds
21 Data Sheet Status
Telegesis (UK) Ltd. reserves the right to change the specification without notice, in order to
improve the design and supply the best possible product. Please consult the most recently issued
data sheet before initiating or completing a design.
22 Life Support Policy
This product is not designed for use in life support appliances, devices, or systems where
malfunction can reasonably be expected to result in a significant personal injury to the user, or as a
critical component in any life support device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or system, or to affect its safety or
effectiveness. Customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Telegesis (UK) Ltd. for any damages resulting.
©2010 Telegesis (UK) Ltd
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ETRX35x Preliminary Product Manual
ETRX351 and ETRX357
23 Related Documents
[1]
IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical
Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LRWPANs)
[2]
Datasheet EM35x, Ember. (www.ember.com)
[3]
Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors Low Profile 1.9mm or 2.4mm Mated Height
[4]
The ZigBee® specification (www.zigbee.org)
[5]
Specification for Antenova Rufa Antenna (www.antenova.com)
[6]
Embedded Antenna design Ltd. (EAD Ltd.) (www.ead-ltd.com)
[7]
Wellhope Communication Equipment (www.wellhope-wireless.com)
24 Contact Information
Website:
E-mail
www.telegesis.com
sales@telegesis.com
Telegesis (UK) Limited
Abbey Barn Business Centre
Abbey Barn Lane
High Wycombe
Bucks
HP10 9QQ
UK
Tel: +44 (0)1494 510199
Fax: +44 (0)5603 436999
©2010 Telegesis (UK) Ltd
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ETRX35x Preliminary Product Manual
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