Telit Communications S p A CE910B-DUAL CDMA Module User Manual CE910 Family Hardware User Guide

Telit Communications S.p.A. CDMA Module CE910 Family Hardware User Guide

CE910B DUAL User Manual PDF Download & Text

User Manual

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Document ID	2816411
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Document Description	User Manual
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Date Submitted	2015-11-19 00:00:00
Date Available	2015-11-19 00:00:00
Creation Date	2015-10-27 11:12:00
Document Lastmod	2015-10-27 11:12:00
Document Title	CE910 Family Hardware User Guide
Document Author:	issac

CE910 Series Hardware User
Guide
1vv0301010 Rev.11 – 2015-10-27
CE910 Family Hardware User Guide
1vv0301010 Rev.11 – 2015-10-27
APPLICABILITY TABLE
PRODUCT
CE910-DUAL
CE910-SC
CE910B-DUAL
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Page 2 of 75
CE910 Family Hardware User Guide
1vv0301010 Rev.11 – 2015-10-27
SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no
liability resulting from any inaccuracies or omissions in this document, or from use of the information
obtained herein. The information in this document has been carefully checked and is believed to be
entirely reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves
the right to make changes to any products described herein and reserves the right to revise this
document and to make changes from time to time in content hereof with no obligation to notify any
person of revisions or changes. Telit does not assume any liability arising out of the application or use
of any product, software, or circuit described herein; neither does it convey license under its patent
rights or the rights of others.
It is possible that this publication may contain references to, or information about Telit products
(machines and programs), programming, or services that are not announced in your country. Such
references or information must not be construed to mean that Telit intends to announce such Telit
products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described in this instruction manual may be, include or
describe copyrighted Telit material, such as computer programs stored in semiconductor memories or
other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive
rights for copyrighted material, including the exclusive right to copy, reproduce in any form,
distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted
material of Telit and its licensors contained herein or in the Telit products described in this instruction
manual may not be copied, reproduced, distributed, merged or modified in any manner without the
express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights,
patents or patent applications of Telit, as arises by operation of law in the sale of a product.
Computer Software Copyrights
The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may
include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor
memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party
supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive
right to copy or reproduce in any form the copyrighted computer program. Accordingly, any
copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products
described in this instruction manual may not be copied (reverse engineered) or reproduced in any
manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the
purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or
otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party
supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation
of law in the sale of a product.
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CE910 Family Hardware User Guide
1vv0301010 Rev.11 – 2015-10-27
Usage and Disclosure Restrictions
License Agreements
The software described in this document is the property of Telit and its licensors. It is furnished by
express license agreement only and may be used only in accordance with the terms of such an
agreement.
Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by
law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a
retrieval system, or translated into any language or computer language, in any form or by any means,
without prior written permission of Telit
High Risk Materials
Components, units, or third-party products used in the product described herein are NOT fault-tolerant
and are NOT designed, manufactured, or intended for use as on-line control equipment in the
following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities,
Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or
Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed
or implied warranty of fitness for such High Risk Activities.
Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service
names are the property of their respective owners.
Copyright © Telit Communications S.p.A.
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1vv0301010 Rev.11 – 2015-10-27
Contents
1.
Introduction ...................................................... 8
1.1.
Scope .......................................................... 8
1.2.
Audience ....................................................... 8
1.3.
Contact Information, Support ................................... 8
1.4.
Document Organization .......................................... 9
1.5.
Text Conventions .............................................. 10
1.6.
Related Documents ............................................. 10
2.
General Product Description ...................................... 11
2.1.
Overview ...................................................... 11
2.2.
Product Specifications ........................................ 12
2.3.
RoHS Compliance ............................................... 12
3.
CE910 Module Connections ......................................... 13
3.1.
Pin-Out ....................................................... 13
3.1.1.
3.1.2.
4.
LGA Pads Layout(CE910-DUAL & CE910B-DUAL) ....................... 18
LGA Pads Layout(CE910-SC) ....................................... 19
Hardware Commands ................................................ 20
4.1.
Turning on the CE910 module ................................... 20
4.1.1.
4.2.
Initialization and Activation State ............................. 20
Turning off the CE910 module .................................. 24
4.2.1.
4.2.2.
Turning OFF by AT Command ....................................... 24
Turning OFF by tying low ON_OFF* ................................ 25
4.3.
Summary of Turning ON and OFF the Module ...................... 26
4.4.
Hardware Unconditional Shutdown ............................... 28
5.
Power Supply ..................................................... 31
5.1.
Power Supply Requirements ..................................... 31
5.2.
Power Consumption ............................................. 32
5.3.
General Design Rules .......................................... 33
5.3.1.
5.3.2.
5.3.3.
5.3.4.
Electrical Design Guidelines ....................................
+ 5V Input Source Power Supply Design Guidelines ................
+12V Input Source Power Supply Design Guidelines ................
Battery Source Power Supply Design Guidelines ...................
33
33
34
35
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5.3.5.
5.3.6.
6.
Thermal Design Guidelines ....................................... 35
Power Supply PCB layout Guidelines .............................. 36
Antenna .......................................................... 38
6.1.
CDMA Antenna Requirements ..................................... 38
6.2.
CDMA antenna – PCB line Guidelines ............................ 39
6.3.
CDMA Antenna installation Guidelines ............................ 39
7.
USB Port ......................................................... 41
8.
Serial Port ...................................................... 42
8.1.
Modem Serial Port 1 ........................................... 43
8.2.
Modem Serial Port 2 ........................................... 45
8.3.
RS232 Level Translation ....................................... 46
9.
Audio Section Overview ........................................... 47
9.1.
Analog Audio Interface(AVI) ................................... 47
9.1.1.
9.1.2.
9.1.3.
9.2.
MIC Connection .................................................. 48
LIN-IN Connection ............................................... 49
EAR Connection .................................................. 50
Digital Voice Interface(DVI) .................................. 51
9.2.1.
CODEC Example ................................................... 51
10. General Purpose I/O .............................................. 52
10.1.
Logic Level Specification ................................... 53
10.2.
Using a GPIO Pad as Input ................................... 53
10.3.
Using a GPIO Pad as Output .................................. 54
10.4.
Indication of Network Service Availability .................. 54
10.5.
RTC Bypass Output ........................................... 55
10.6.
VAUX/PWRMON Power Output .................................... 55
11. ADC section ...................................................... 57
11.1.
Description ................................................. 57
11.2.
Using ADC Converter ......................................... 57
12. Test Point ....................................................... 58
13. Mounting CE910 on the Application ................................ 59
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13.1.
General ..................................................... 59
13.2.
Module Finishing & Dimensions ............................... 59
13.3.
Recommended foot print for the application .................. 60
13.4.
Stencil ..................................................... 61
13.5.
PCB Pad Design .............................................. 61
13.6.
Recommendations for PCB Pad Dimensions (mm) ................. 61
13.7.
Solder Paste ................................................ 63
13.7.1.
Solder Reflow .................................................. 63
14. Packing System ................................................... 65
14.1.
Moisture Sensibility ........................................ 67
15. Application Design Guide ......................................... 68
15.1.
Download and Debug Port ..................................... 68
16. Conformity Assessment Issues(Problèmes d'évaluation de conformité)69
17. Safety Recommendations ........................................... 73
18. Document History ................................................. 74
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CE910 Family Hardware User Guide
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1.
Introduction
1.1.
Scope
The aim of this document is the description of typical hardware solutions useful for developing a
product with the Telit CE910 module.
1.2.
Audience
This document is intended for Telit customers who are about to implement their applications using
our CE910 modules.
1.3.
Contact Information, Support
For general contact, technical support, to report documentation errors and to order manuals, contact
Telit Technical Support Center (TTSC) at:
TS-EMEA@telit.com
TS-NORTHAMERICA@telit.com
TS-LATINAMERICA@telit.com
TS-APAC@telit.com
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where to buy the Telit modules or for recommendations on accessories
and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit Technical
Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Please keep us informed of comments and
suggestions for improvements.
Telit appreciates feedback from the users of our information.
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1.4.
Document Organization
This document contains the following chapters:
Chapter 1: “Introduction” provides a scope for this document, target audience, contact and support
information, and text conventions.
Chapter 2: “General Product Description” gives an overview of the features of the product.
Chapter 3: “CE910 Module Connections” deals with the pin out configuration and layout.
Chapter 4: “Hardware Commands” How to operate the module via hardware.
Chapter 5: “Power supply” Power supply requirements and general design rules.
Chapter 6: “Antenna” The antenna connection and board layout design are the most important parts in
the full product design.
Chapter 7: “USB Port” The USB port on the Telit CE910 is the core of the interface between the
module and OEM hardware.
Chapter 8: “Serial ports” Refers to the serial ports of the Telit CE910.
Chapter 9: “Audio Section overview” Refers to the audio blocks of the Base Band Chip of the CE910
Telit Module.
Chapter 10: “General Purpose I/O” How the general purpose I/O pads can be configured.
Chapter 11: “ADC section” Deals with this one kind of converter.
Chapter 12: “Test Point” Deals with Test Point.
Chapter 13: “Mounting CE910 on the Application” Mechanical dimensions and
recommendations on how to mount the module on the user’s board.
Chapter 14: “Packing System” Deals with packing system.
Chapter 15: “Application Design Guide” Deals with the design of host system for download or
upgrade.
Chapter 16: “Conformity Assessment Issues” provides some fundamental hints about the conformity
assessment that the final application might need.
Chapter 17: “Safety Recommendation” provides some safety recommendations that must be followed
by the customer in the design of the application that makes use of the Telit CE910.
Chapter 18: “Document History” provides document revision history of the Telit CE910.
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1.5.
Text Conventions
Danger – This information MUST be followed or catastrophic equipment failure or bodily injury
may occur.
Caution or Warning – Alerts the user to important points about integrating the module. If these
points are not followed, the module and end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful when integrating the
module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
1.6.
Related Documents

CE910 Software User Guide, 1vv0301011

CE910 AT Commands Reference Guide, 80399ST10111A

Telit EVK2 User Guide, 1vv0300704
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Page 10 of 75
CE910 Family Hardware User Guide
1vv0301010 Rev.11 – 2015-10-27
2.
General Product Description
2.1.
Overview
The aim of this document is the description of typical hardware solutions useful for developing a
product with the Telit CE910 module.
In this document all the basic functions of a mobile device will be taken into account; for each one of
them a proper hardware solution will be suggested and eventually the wrong solutions and common
errors to be avoided will be evidenced. Obviously this document cannot embrace all hardware
solutions and products that may be designed. Avoiding the discussed wrong solutions must be
considered as mandatory. While the suggested hardware configurations must not be considered
mandatory, the information given must be used as a guide and a starting point for properly developing
a product with the Telit CE910 module.
NOTE:
The integration of the CDMA 1xRTT module within a user application must be done according to the
design rules described in this manual.
The information presented in this document is believed to be accurate and reliable. However, no
responsibility is assumed by Telit Communication S.p.A. for its use, such as any infringement of
patents or other rights of third parties. No license is granted by implication or otherwise under any
patent rights of Telit Communication S.p.A. other than for circuitry embodied in Telit products. This
document is subject to change without notice.
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CE910 Family Hardware User Guide
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2.2.
Product Specifications
Air Interface
Frequency Bands
Data Service
Max. RF out power
Typical conducted sensitivity
CE910 Specifications
CDMA 1xRTT
CE910-DUAL : 800/1900MHz
CE910-SC : 800MHz
CE910B-DUAL : 800/1900MHz (BC0/BC10/BC1)
CDMA 1xRTT: 153.6 Kbps (full-duplex)
 CDMA BC0: Power class 3 (24.5dBm) for 1xRTT
 CDMA BC1: Power class 2 (24.5dBm) for 1xRTT
 CDMA BC10 : Power class 2 (24.5dBm) for 1xRTT
 CDMA BC0: –108dBm
 CDMA BC1: –107dBm
 CDMA BC10: -108dBm
28.2mm(L) x 28.2mm(W) x 2.05mm(T)
3.7g
Device dimensions
Weight
Storage and Operating
–40 ~ +85°C
Temperature Range
Normal operating voltage
3.4 ~ 4.2V
range
1.8V
IO voltage
 144 Land-Grid-Array interface
 10 general I/O ports maximum including multifunctional I/Os
 State LED output
Interface
 1 A/D converter
 Full RS232 CMOS UART: baud rate up to 4Mbps
 Reserved two wires CMOS UART for debugging
 USB 2.0: baud rate up to 12Mbps
Primary antenna, 800/1900MHz
Antenna
 Analog audio interface ( 1 EAR/MIC)
Audio
SMS (MO/MT)
Message
CE910-DUAL & CE910B-DUAL:
 Regulatory: FCC, IC
 Carrier: Verizon, Sprint, Aeris
Approvals
CE910-SC:
 Regulatory: SRRC, CCC
2.3.
RoHS Compliance
As a part of Telit’s corporate policy of environmental protection, the CE910 complies with the RoHS
(Restriction of Hazardous Substances) directive of the European Union (EU directive 2002/95/EG).
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CE910 Family Hardware User Guide
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3.
CE910 Module Connections
3.1.
Pin-Out
Pin
Signal
I/O
Function
USB FS 2.0 Communication Port
I/O USB differential Data(+)
B15 USB_D+
I/O USB differential Data(-)
C15 USB_DI
Power for the internal USB transceiver
A13 VUSB
Asynchronous UART – Prog. / data +HW Flow Control
Serial data input from DTE
N15 C103/TXD
Serial data output to DTE
M15 C104/RXD
Input for (DTR) from DTE
M14 C108/DTR
Input for (RTS) from DTE
L14 C105/RTS
Output for (CTS) to DTE
P15 C106/CTS
Output for (DCD) to DTE
N14 C109/DCD
Output for (DSR) to DTE
P14 C107/DSR
Output for (RI) to DTE
R14 C125/RING
Asynchronous Auxiliary UART
Auxiliary UART (TX Data to DTE)
D15 TX_AUX
Auxiliary UART (RX Data from DTE)
E15 RX_AUX
RUIM Interface(*NOTE)
Reserved but applicable only to RUIM variant :
RUIMVCC
A3
Power supply for the RUIM
Reserved but applicable only to RUIM variant :
RUIMIO
I/O
A5
RUIM Data I/O
Reserved but applicable only to RUIM variant :
RUIMCLK
A6
RUIM Clock
Reserved but applicable only to RUIM variant :
RUIMRST
A7
RUIM Reset
Digital Voice interface
DVI_WA0
I/O Digital Voice interface (WA0)
B9
DVI_RX
Digital Voice interface (RX)
B6
DVI_TX
Digital Voice interface (TX)
B7
DVI_CLK
I/O
Digital Voice interface (CLK)
B8
Analog Voice Interface
EAR+
AO Earphone signal output, phase +
B2
EARAO Earphone signal output, phase B3
MIC+
AI
Microphone input, phase +
B4
MICAI
Microphone input, phase B5
Digital IO
GPIO_01
I/O GPIO_01 / STAT LED
C8
GPIO_02
I/O GPIO_02
C9
I/O GPIO_03
C10 GPIO_03
Type
5V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
1.8/3V
1.8/3V
1.8/3V
1.8/3V
1.8V
1.8V
1.8V
1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
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Pin
Signal
C11 GPIO_04
B14 GPIO_05
C12 GPIO_06
C13 GPIO_07
K15 GPIO_08
L15 GPIO_09
G15 GPIO_10
ADC Section
ADC_IN1
B1
RF Section
Antenna
K1
Miscellaneous Functions
R13 HW_SHUTDOWN*
R12 ON_OFF*
C14 VRTC
R11
VAUX/PWRMON
Test Point
TP1
C3
TP2
C4
TP3
C5
TP4
C6
TP5
C7
TP6
D3
TP7
E3
Power Supply
VBATT
M1
VBATT
M2
VBATT_PA
N1
VBATT_PA
N2
VBATT_PA
P1
VBATT_PA
P2
GND
E1
GND
G1
GND
H1
GND
J1
GND
L1
GND
A2
GND
E2
GND
F2
GND
G2
GND
H2
GND
J2
GND
K2
GND
L2
GND
R2
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GPIO_04
GPIO_05
GPIO_06
GPIO_07
GPIO_08
GPIO_09
GPIO_10
AI
Analog to Digital converter input
A/D
I/O
CDMA Antenna (50Ohm)
RF
Hardware Unconditional Shutdown
Input Command for Power ON
RTC Power
Supply Output for external accessories / Power
ON Monitor
Function
Test Point
Test Point
Test Point
Test Point
Test Point
Test Point
Test Point
Main Power Supply (Baseband)
Main Power Supply (Baseband)
Main Power Supply (Radio PA)
Main Power Supply (Radio PA)
Main Power Supply (Radio PA)
Main Power Supply (Radio PA)
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Type
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
Pull up to VBATT
CMOS 1.8V
Power
1.8V
TP
TP
TP
TP
TP
TP
TP
Power
Power
Power
Power
Power
Power
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Pin
Signal
GND
M3
GND
N3
GND
P3
GND
R3
GND
D4
GND
M4
GND
N4
GND
P4
GND
R4
GND
N5
GND
P5
GND
R5
GND
N6
GND
P6
GND
R6
GND
P8
GND
R8
GND
P9
P10 GND
R10 GND
M12 GND
B13 GND
P13 GND
E14 GND
Reserved
Reserved
C1
Reserved
D1
Reserved
F1
Reserved
C2
Reserved
D2
Reserved
F3
Reserved
G3
Reserved
H3
Reserved
J3
Reserved
K3
Reserved
L3
Reserved
A4
Reserved
N7
Reserved
P7
Reserved
R7
Reserved
A8
Reserved
N8
Reserved
A9
Reserved
N9
Reserved
R9
A10 Reserved
I/O
Function
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Type
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Pin
B10
N10
A11
B11
N11
P11
A12
B12
D12
N12
P12
D13
E13
F13
G13
H13
J13
K13
L13
M13
N13
A14
D14
F14
G14
H14
J14
K14
F15
H15
J15
Signal
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
I/O
Function
Type
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
*NOTE:
RUIM interface is reserved for Verizon/Sprint/Aeris variants and it is applicable only to RUIM
variant of CE910 (CE910-SC).
WARNING:
Reserved pins must not be connected.
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NOTE:
The following table is listing the main Pinout differences between the CE910 variants.
Product
BC0
BC10
BC1
Notes
CE910-DUAL
Yes
No
Yes
Reserved pads: A3, A5, A6, A7
CE910-SC
Yes
No
No
CE910B-DUAL
Yes
Yes
Yes
Reserved pads: A3, A5, A6, A7
NOTE:
If not used, almost all pins not in use must be left disconnected. The only exceptions are the following
pins:
PAD
M1,M2,N1,N2,P1,P2
E1,G1,H1,J1,L1,A2,E2,F2,G2,H2
J2,K2,L2,R2,M3,N3,P3,R3,D4
M4,N4,P4,R4,N5,P5,R5,N6,P6
R6,P8,R8,P9,P10,R10,M12,B13
P13,E14
R12
R13
B15
C15
A13
N15
M15
Signal
VBATT&VBATT_PA
L14
C105/RTS
P15
D15
E15
K1
C3,C4,C5,C6,C7,D3,E3
C106/CTS
TX_AUX
RX_AUX
Main Antenna
Test Point
Notes
GND
ON/OFF*
HW_SHUTDOWN*
USB_D+
USB_DVUSB
C103/TXD
C104/RXD
If not used it should be connected to a Test point.
If not used it should be connected to a Test point.
If not used it should be connected to a Test point.
If not used it should be connected to a Test point.
If not used it should be connected to a Test point.
If the flow control is not used it should be
connected to GND.
If not used it should be connected to a Test point.
If not used it should be connected to a Test point.
If not used it should be connected to a Test point.
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3.1.1.
LGA Pads Layout(CE910-DUAL & CE910B-DUAL)
Top View
NOTE:
The pin defined as RES must be considered RESERVED and not connected on any pin in the
application. The related area on the application has to be kept empty.
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3.1.2.
LGA Pads Layout(CE910-SC)
Top View
NOTE:
The pin defined as RES must be considered RESERVED and not connected on any pin in the
application. The related area on the application has to be kept empty.
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4.
Hardware Commands
4.1.
Turning on the CE910 module
To turn on the CE910, the pad ON_OFF* must be tied low for at least 1.5 second and then released.
The maximum current that can be drained from the ON_OFF* pad is 0.1 mA.
A simple circuit to power on the module is illustrated below:
4.1.1.
Initialization and Activation State
Upon turning on CE910 module, the CE910 module is not active yet because the boot sequence of
CE910 is still executing internally. It takes about 10 seconds to complete the initialization of the
module internally.
For this reason, it would be useless to try to access CE910 during the Initialization state as below. The
CE910 module needs at least 10 seconds after the PWRMON goes High to become operational by
reaching the activation state.
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During the Initialization state, any kind of AT-command is not available. DTE must wait for the
Activation state to communicate with CE910.
To check if the CE910 has powered on, the hardware line VAUX/PWRMON must be monitored.
When VAUX/PWRMON goes high, the module has powered on.
NOTE:
Do not use any pull up resistor on the ON_OFF* line. It is pulled up with 200kΩ internally. Using a
pull up resistor may bring latch up problems on the CE910 power regulator and improper power
on/off of the module. The line ON_OFF* must be connected only in open collector configuration.
NOTE:
In this document all the lines are inverted. Active low signals are labeled with a name that ends with
"*" or with a bar over the name.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level
signal applied to the digital pins of the CE910 module when the module is powered OFF or during an
ON/OFF transition.
For example:
1. To drive the ON_OFF* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT1):
2. To drive the ON_OFF* pad directly with an ON/OFF button:
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A flow chart the proper turn on procedure is displayed below:
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A flow chart showing the AT commands managing procedure is displayed below:
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4.2.
Turning off the CE910 module
Turning off the device can be done in two ways:

via AT command (see CE910 Software User Guide, AT#SHDN)

by tying low pin ON_OFF*
Either ways, the device issues a detach request to network informing that the device will not be
reachable any more.
To turn OFF the CE910 the pad ON_OFF* must be tied low for at least 2.5 seconds and then released.
TIP:
To check if the device has powered off, hardware line PWRMON must be monitored.
The device is powered off when PWRMON goes low.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level
signal applied to the digital pins of the CE910 when the module is powered OFF or during an
ON/OFF transition.
4.2.1.
Turning OFF by AT Command
The CE910 can be shut down by a software command.
When a shutdown command is sent, the CE910 goes into the finalization state and will shut down
PWRMON at the end of this state. The period of the finalization state can vary according to the state
of the CE910 so it cannot be fixed definitely.
Normally it will be 10 seconds after sending a shutdown command and DTE should monitor the status
of PWRMON to see the actual power off.
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4.2.2.
Turning OFF by tying low ON_OFF*
To turn OFF the CE910 the pad ON_OFF* must be tied low for at least 2 seconds and then released.
The same circuitry and timing for the power on must be used.
When the hold time of ON_OFF* is above 2 seconds, the CE910 goes into the finalization state and
will shut down PWRMON at the end of this state.
The period of the finalization state can vary according to the state of the CE910 so it cannot be fixed
definitely.
Normally it will be 10 seconds after releasing ON_OFF* and DTE should monitor the status of
PWRMON to see the actual power off.
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4.3.
Summary of Turning ON and OFF the Module
The chart below describes the overall sequences for turning ON and OFF the module.
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The following flow chart shows the proper turn off procedure:
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4.4.
Hardware Unconditional Shutdown
The Unconditional shutdown of the module could be activated using the HW_SHUTDOWN*
line(pad R13).
WARNING:
The hardware unconditional shutdown must NOT be used during normal operation of the device since
it does not detach the device from the network. It shall be used as an emergency exit procedure.
To unconditionally shutdown the CE910, the pad HW_SHUTDOWN* must be tied low for at least
800 milliseconds and then released.
NOTE:
Do not use any pull up resistor on the HW_SHUTDOWN* line nor any totem pole digital output. It is
pulled up internally to VBATT with 57kΩ. Using an external pull up resistor may bring latch up
problems on the CE910 power regulator and improper functioning of the module.
The line HW_SHUTDOWN* must be connected only in open collector configuration.
The HW_SHUTDOWN* will generate an unconditional shutdown of the module without an
automatic restart.
The module will shutdown but will NOT perform the detach from the cellular network.
To proper power on again the module please refer to 4.1 Turning ON the CE910.
TIP:
The unconditional hardware shutdown must always be implemented on the boards and the software
must use it only as an emergency exit procedure.
A simple circuit to unconditionally shutdown the module is illustrated below:
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For example:
Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole output of a +3/5 V
microcontroller (uP_OUT2):
NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the CE910 when the module is powered OFF or during an
ON/OFF transition.
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In the following flow chart is detailed the proper restart procedure:
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5.
Power Supply
The power supply circuitry and board layout are a very important part in the full product design and
they strongly reflect on the product’s overall performance. Read carefully the requirements and the
guidelines that follow for a proper design.
5.1.
Power Supply Requirements
The external power supply must be connected to VBATT & VBATT_PA signals and must fulfill the
following requirements:
Power Supply
Nominal Supply Voltage
Normal Operating Voltage range
Extended Operating Voltage range
3.8V
3.4V ~ 4.2V
3.4V ~ 4.5V
NOTE:
The Operating Voltage Range MUST never be exceeded. Special care must be taken when designing
the application’s power supply section to avoid having an excessive voltage drop.
If the voltage drop is exceeding the limits it could cause a Power Off of the module.
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5.2.
Power Consumption
CE910
Average
Mode Description
(mA)
140uA(*1)
Power off current (Typical)
No call in progress (slot cycle index=2)
Standby mode
AT+CFUN=1
29
Normal mode; full functionality of the module
Disabled TX and RX; modules is not registered on the
AT+CFUN=4
27
network
Full functionality with power saving;
AT+CFUN=5
1.1(* )
Module registered on the network can receive
incoming call sand SMS
A call in progress
Tx and Rx mode
Max Power Mode
750
CDMA 1x voice/data call
Mode
(*1)The off current is the total supply current from the main battery with the XO regulator ON,
19.2MHz XO ON and others are OFF.
(*2) Standby current consumption depends on network configuration or module configuration.
The current consumption value for CFUN= 5 is measured under slot cycle index=2.
TIP:
The electrical design for the power supply should be made ensuring it will be capable of a peak
current output of at least 1A.
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5.3.
General Design Rules
The principal guidelines for the Power Supply Design embrace three different design steps:
5.3.1.

the electrical design

the thermal design

the PCB layout
Electrical Design Guidelines
The electrical design of the power supply depends strongly on the power source where this power is
drained. We will distinguish them into three categories:
5.3.2.

+5V input (typically PC internal regulator output)

+12V input (typically automotive)

Battery
+ 5V Input Source Power Supply Design Guidelines

The desired output for the power supply is 3.8V, hence there is not a big difference
between the input source and the desired output so a linear regulator can be used. A
switching power supply will not be suitable because of the low drop-out requirements.

When using a linear regulator, a proper heat sink must be provided in order to dissipate
the power generated.

A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the
current absorption peaks close to the CE910. A 100μF tantalum capacitor is usually suited.

Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is
rated at least 10V.

A protection diode must be inserted close to the power input in order to save the CE910
from power polarity inversion.
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An example of a linear regulator with 5V input:
5.3.3.
+12V Input Source Power Supply Design Guidelines

The desired output for the power supply is 3.8V, hence due to the big difference between
the input source and the desired output, a linear regulator is not suitable and must not be
used. A switching power supply would be preferable because of its better efficiency,
especially with the 1A peak current load represented by CE910.

When using a switching regulator, a 500 kHz or more switching frequency regulator is
preferable because of its smaller inductor size and its faster transient response. This
allows the regulator to respond quickly to the current peaks absorption.

In any case, the frequency and switching design selection is related to the application to
be developed due to the fact the switching frequency could also generate EMC
interferences.

For car PB battery the input voltage can rise up to 15.8V and this must be kept in mind
when choosing components: all components in the power supply must withstand this
voltage.

A bypass low ESR capacitor of adequate capacity must be provided in order to cut the
current absorption peaks. A 100μF tantalum capacitor is usually suited for this.

Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is
rated at least 10V.

For car applications a spike protection diode must be inserted close to the power input in
order to clean the supply from spikes.

A protection diode must be inserted close to the power input in order to save the CE910
from power polarity inversion. This can be the same diode as for spike protection.
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An example of switching regulator with 12V input is in the schematic below:
5.3.4.
Battery Source Power Supply Design Guidelines
The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V.
A single 3.7V lithium-ion cell battery type is ideal to supply power to the Telit CE910 module.
WARNING:
The three battery cells (Ni/Cd or Ni/MH 3.6V nom. battery types or 4V PB types) MUST NOT be
used directly because their maximum voltage can rise over the absolute maximum voltage for the
CE910 and cause damage. USE only Li-Ion battery types.
5.3.5.

A bypass low (usually a 100uF tantalum) ESR capacitor with adequate capacity must be
provided in order to cut the current absorption peaks.

Make sure the low ESR capacitor (usually a tantalum) is rated at least 10V.

A protection diode must be inserted close to the power input in order to protect the CE910
module from power polarity inversions when connecting the battery.

The battery capacity must be at least 500mAh in order to withstand the current peaks of
1A. The suggested battery capacity is from 500mAh to 1000mAh.
Thermal Design Guidelines
The thermal design for the power supply heat sink must be done with the following specifications:
Average current consumption during CDMA 1x @PWR level max : 750 mA
NOTE:
The average consumption during transmissions depends on the power level at which the device is
requested to transmit via the network. The average current consumption hence varies significantly.
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Considering the very low current during idle, especially if the Power Saving function is enabled, it is
possible to consider from the thermal point of view that the device absorbs current significantly only
during calls.
If we assume that the device stays in transmission for short periods of time (a few minutes) and then
remains for quite a long time in idle (one hour), then the power supply always has time to cool down
between the calls and the heat sink could be smaller than the calculated for 750mA maximum RMS
current. There could even be a simple chip package (no heat sink).
Moreover in average network conditions the device is requested to transmit at a lower power level
than the maximum and hence the current consumption will be less than 750 mA (usually around 300
mA).
For these reasons the thermal design is rarely a concern and the simple ground plane where the power
supply chip is placed can be enough to ensure a good thermal condition and avoid overheating.
The heat generated by the CE910 must be taken into consideration during transmission at 24.5dBm
max during calls. This generated heat will be mostly conducted to the ground plane under the CE910.
The application must be able to dissipate heat.
In the CDMA 1x mode, since CE910 emits RF signals continuously during transmission, special
attention must be paid to how to dissipate the heat generated.
The current consumption will be up to about 750mA in CDMA 1x continuously at the maximum TX
output power (24.5dBm). Thus, you must arrange the area on the application PCB must be as large as
possible under CE910.
The CE910 must be mounted on the large ground area of the application board and make many
ground vias to dissipate the heat.
5.3.6.
Power Supply PCB layout Guidelines
As seen in the electrical design guidelines, the power supply must have a low ESR capacitor on the
output to cut the current peaks and a protection diode on the input to protect the supply from spikes
and polarity inversion. The placement of these components is crucial for the correct operation of the
circuitry. A misplaced component can be useless or can even decrease the power supply performance.

The bypass low ESR capacitor must be placed close to the Telit CE910 power input pads,
or if the power supply is a switching type, the capacitor can be placed close to the
inductor to cut the ripple if the PCB trace from the capacitor to CE910 is wide enough to
ensure a drop-less connection even during the 1A current peaks.

The protection diode must be placed close to the input connector where the power source
is drained.

The PCB traces from the input connector to the power regulator IC must be wide enough
to ensure no voltage drops occur when the 1A current peaks are absorbed. While a
voltage drop of hundreds of mV may be acceptable from the power loss point of view, the
same voltage drop may not be acceptable from the noise point of view. If the application
does not have an audio interface but only uses the data feature of the Telit CE910, then
this noise is not as disruptive and the power supply layout design can be more forgiving.
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
The PCB traces to CE910 and the Bypass capacitor must be wide enough to ensure no
significant voltage drops occur when the 1A current peaks are absorbed. This is a must
for the same above-mentioned reasons. Try to keep this trace as short as possible.

The PCB traces connecting the switching output to the inductor and the switching diode
must be kept as short as possible by placing the inductor and the diode very close to the
power switching IC (only for switching power supply). This is done in order to reduce the
radiated field (noise) at the switching frequency (usually 100-500 kHz).

The use of a good common ground plane is suggested.

The placement of the power supply on the board must be done in a way to guarantee that
the high current return paths in the ground plane are not overlapped with any noise
sensitive circuitry such as the microphone amplifier/buffer or earphone amplifier.
The power supply input cables must be kept separate from noise sensitive lines such as
microphone/earphone cables.
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6.
Antenna
The antenna connection and board layout design are the most important parts in the full product
design and they strongly reflect on the product’s overall performance. Read carefully and follow the
requirements and the guidelines for a proper design.
6.1.
CDMA Antenna Requirements
The antenna for a Telit CE910 device must fulfill the following requirements:
CE910 Specifications
Depending on the frequency band(s) provided by the
network operator, the customer must use the most suitable
antenna for that/those band(s)
70 MHz in CDMA BC0
53 MHz in CDMA BC10
140 MHz in CDMA BC1
Gain < 5.12dBi in CDMA BC0
Gain < 5.12dBi in CDMA BC10
Gain < 6.12dBi in CDMA BC1
50 Ohm
> 24.5dBm Average Power in CDMA
≤ 5:1 (Limit to avoid permanent damage)
≤ 2:1 (Limit to fulfill all regulatory requirement)
Frequency range
Bandwidth
Gain
Impedance
Input power
VSWR absolute max
VSWR recommended
When using the Telit CE910, since there’s no antenna connector on the module, the antenna must be
connected to the CE910 antenna pad (K1) by means of a transmission line implemented in the PCB.
In the case that the antenna is not directly connected at the antenna pad of the CE910, then a PCB line
is required. This transmission line shall fulfill the following requirements:
Antenna Line on PCB Requirements
Characteristic Impedance
50Ohm
Max Attenuation
0.3dB
Coupling with other signals shall be avoided
Cold End (Ground Plane) of antenna shall be equipotential to the CE910 ground pads
Furthermore if the device is developed for the US and/or Canada market, it must comply with the
FCC and/or IC approval requirements:
This device is to be used only for mobile and fixed application. The antenna(s) used for this
transmitter must be installed to provide a separation distance of at least 20 cm from all persons and
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must not be co-located or operating in conjunction with any other antenna or transmitter. End-Users
must be provided with transmitter operation conditions for satisfying RF exposure compliance. OEM
integrators must ensure that the end user has no manual instructions to remove or install the CE910
module. Antennas used for this OEM module must not exceed 5dBi gain for mobile and fixed
operating configurations.
6.2.
CDMA antenna – PCB line Guidelines













6.3.
Make sure that the transmission line’s characteristic impedance is 50ohm.
Keep line on the PCB as short as possible since the antenna line loss shall be less than around
0.3dB.
Line geometry should have uniform characteristics, constant cross section, avoid meanders and
abrupt curves.
Any kind of suitable geometry/structure can be used for implementing the printed transmission
line afferent the antenna.
If a Ground plane is required in line geometry, that plane has to be continuous and sufficiently
extended so the geometry can be as similar as possible to the related canonical model.
Keep, if possible, at least one layer of the PCB used only for the Ground plane; If possible, use
this layer as reference Ground plane for the transmission line.
It is wise to surround (on both sides) the PCB transmission line with Ground. Avoid having
other signal tracks facing directly the antenna line track.
Avoid crossing any un-shielded transmission line footprint with other tracks on different layers.
The Ground surrounding the antenna line on PCB has to be strictly connected to the main
Ground plane by means of via holes (once per 2mm at least) placed close to the ground edges
facing line track.
Place EM noisy devices as far as possible from CE910 antenna line.
Keep the antenna line far away from the CE910 power supply lines.
If EM noisy devices are present on the PCB hosting the CE910, such as fast switching ICs, take
care of shielding them with a metal frame cover.
If EM noisy devices are not present around the line use of geometries like Micro strip or
Grounded Coplanar Waveguide are preferred since they typically ensure less attenuation when
compared to a Strip line having same length.
CDMA Antenna installation Guidelines




Install the antenna in a place covered by the CDMA signal.
If the device antenna in the application is located greater then 20cm from the human body and
there are no co-located transmitters then the Telit FCC/IC approvals can be re-used by the end
product.
Antenna shall not be installed inside metal cases.
Antenna shall be installed also according to antenna manufacture instructions.
WARNING:
Consider a mechanical design and a low-capacitance ESD protection device to protect CE910 or
customer specific requirements from ESD event to Antenna port (K1).
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7.
USB Port
The CE910 module includes a Universal Serial Bus (USB) transceiver, which operates at USB Fullspeed (12Mbits/sec) and slave mode only.
It is compliant with the USB 2.0 specification and can be used for diagnostic monitoring, control and
data transfers.
The table below describes the USB interface signals:
Pin
B15
C15
A13
Signal
USB_D+
USB_DVUSB
I/O
I/O
I/O
Function
USB differential Data(+)
USB differential Data(-)
Power for the internal USB transceiver
Type
5V
The USB_DPLUS and USB_DMINUS signals have a clock rate of 60MHz. The signal traces should
be routed carefully. Trace lengths, number of vias and capacitive loading should be minimized. The
impedance value should be as close as possible to 100 Ohms differential.
The table below describes the VUSB specification:
Parameter
Input voltage
Input current
Min
4.4V
50mA
Max
5.0V
WARNING:
Consider a mechanical design and a low-capacitance ESD protection device to protect CE910 or
customer specific requirements from ESD event to USB lines (B15, C15 and A13).
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8.
Serial Port
The serial ports on the Telit CE910 are the interface between the module and OEM hardware.
2 serial ports are available on the module:


Modem Serial Port 1 (Main)
Modem Serial Port 2 (Auxiliary)
Several configurations can be designed for the serial port on the OEM hardware.
The most common are:



RS232 PC comport
Microcontroller UART@1.8V(Universal Asynchronous Receiver Transmit)
Microcontroller UART@5V or other voltages different from 1.8V
Depending on the type of serial port on the OEM hardware, a level translator circuit may be needed to
make the system work.
On the CE910 the ports are CMOS 1.8V.
The electrical characteristics of the serial port are explained in the following tables:
Absolute Maximum Ratings -Not Functional
Parameter
Input level on non-power pin with respect to ground
Min
-0.3
Max
+2.3V
Operating Range - Interface levels (1.8V CMOS)
Parameter
Input high level
Input low level
Output high level
Output low level
Min
1.5V
0V
1.35V
0V
Max
2.1 V
0.35V
1.8V
0.45V
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8.1.
Modem Serial Port 1
The serial port 1 on the CE910 is a +1.8V UART with all 7 RS232 signals.
It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.
RS232
Pin #
Signal
CE910
Pad No.
C109/DCD
N14
Data Carrier Detect
C104/RXD
M15
Transmit line *see Note
C103/TXD
N15
Receive line *see Note
C108/DTR
M14
Data Terminal Ready
GND
C107/DSR
P14
Data Set Ready
C106/CTS
P15
Clear to Send
C105/RTS
L14
Request to Send
C125/RI
R14
Ring Indicator
Function
Usage
Output from the CE910 that
indicates the carrier presence
Output transmit line of the CE910
UART
Input receive of the CE910 UART
Input to the CE910 that controls
the DTE READY condition
GND
Output from the CE910 that
indicates the module is ready
Output from the CE910 that
controls the hardware flow control
Input to the CE910 that controls
the hardware flow control
Output from the CE910 that
indicates the incoming call
condition
The following table shows the typical value(pulled inside the baseband chipset) and status for input
lines in all module states:
Signal/State
OFF
RESET
ON
Powersaving
PU tied to
unknown
Pull Down
(21K~210K)
Pull Down
(21K~210K)
Pull Up
(39K~390K)
Pull Up
(39K~390K)
Pull Up
(39K~390K)
1.8V
TXD
RTS
DTR
NOTE:
According to V.24, RX/TX signal names are referred to the application side. Therefore, on the CE910
side these signals are on the opposite direction:
TXD on the application side will be connected to the receive line (here named C103/TXD)
RXD in the application side will be connected to the transmit line (here named C104/RXD)
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NOTE:
For minimum implementation, only the TXD and RXD lines must be connected, the other lines can be
left open provided a software flow control is implemented.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level
signal applied to the digital pins of the CE910 when the module is powered off or during an ON/OFF
transition.
NOTE:
High-speed UART supports up to 4Mbps. Please refer to the AT command User Guide in detail.
WARNING:
Consider a mechanical design and a low-capacitance ESD protection device to protect CE910 or
customer specific requirements from ESD event to UART port (M15, N15, P15 and L14).
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8.2.
Modem Serial Port 2
The secondary serial port on the CE910 is a CMOS 1.8V with only RX and TX signals.
The signals of the CE910 serial port are:
PAD
D15
E15
Signal
TX_AUX
RX_AUX
I/O
Function
Auxiliary UART (TX data to DTE)
Auxiliary UART (RX data from DTE)
Type
CMOS 1.8V
CMOS 1.8V
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level
signal applied to the digital pins of the CE910 when the module is powered off or during an ON/OFF
transition.
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8.3.
RS232 Level Translation
In order to interface the Telit CE910 with a PC com port or a RS232 (EIA/TIA-232) application, a
level translator is required. This level translator must:


Invert the electrical signal in both directions
Change the level from 0/1.8V to +/-15V
Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels
on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level translator.
Note that the negative signal voltage must be less than 0V and hence some sort of level translation is
always required. The simplest way to translate the levels and invert the signal is by using a single chip
level translator. There is a multitude of them, differing in the number of drivers and receivers and in
the levels (be sure to get a true RS232 level translator not a RS485 or other standards). By convention
the driver is the level translator from the 0-1.8V UART to the RS232 level. The receiver is the
translator from the RS232 level to 0-1.8V UART.
In order to translate the whole set of control lines of the UART you will need:


5 drivers
3 receivers
An example of RS232 level adaption circuitry could be accomplished using a MAXIM transceiver
(MAX218). In this case the chipset is capable of translating directly from 1.8V to the RS232 levels
(Example on 4 signals only).
The RS232 serial port lines are usually connected to a DB9 connector with the following layout:
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9.
Audio Section Overview
The CE910 provides an analog audio interface and digital audio interface.
9.1.
Analog Audio Interface(AVI)
The CE910 provides an analog audio interface; one differential input for audio to be
transmitted(Uplink) and a balanced output for audio to be received(Downlink).
The bias for the microphone has to be as clean as possible; the first connection (single ended) is
preferable since the Vmic noise and ground noise are fed into the input as common mode and then
rejected. This sounds strange; usually the connection to use in order to reject the common mode is the
balanced one. In this situation we have to recall that the microphone is a sound to current transducer,
so the resistor is the current to tension transducer, so finally the resistor feeds the input in balanced
way even if the configuration, from a microphone point of view, seems to be un-balanced.
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9.1.1.
MIC Connection
If a “balanced way” is anyway desired, much more care has to be taken to VMIC noise and ground
noise.
TIP: Since the J-FET transistor inside the microphone acts as RF-detector-amplifier, ask vendor for a
microphone with anti-EMI capacitor (usually a 33pF or a 10pF capacitor placed across the output
terminals inside the case).
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9.1.2.
LIN-IN Connection
If the audio source is not a mike but a different device, the following connections can be done. Place
100nF capacitor in series with both inputs, so the DC current is blocked. Place the 33pF-100Ohm33pF RF-filter, in order to prevent some EMI field to get into the high impedance high gain MIC
inputs. Since the input is differential, the common mode voltage noise between the two (different)
grounds is rejected, provided that both AF_IN+ & AF_IN- are connected directly onto the source.
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9.1.3.
EAR Connection
The audio output of the CE910 is balanced, this is helpful to double the level and to reject common
mode (click and pop are common mode and therefore rejected). These outputs can drive directly a
small loudspeaker with electrical impedance not lower than 32Ohm.
TIP: in order to get the maximum audio level at a given output voltage level (dBspl/Vrms), the
following breaking through procedure can be used. Have the loudspeaker as close as you can to the
listener (this simplify also the echo cancelling); choose the loudspeaker with the higher sensitivity
(dBspl per W); choose loudspeakers with the impedance close to the limit in order to feed more
power inside the transducer (it increases the W/Vrms ratio). If this were not enough, an external
amplifier should be used.
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9.2.
Digital Voice Interface(DVI)
The product is providing one Digital Audio Interface (DVI) on the following Pins:
Pin
Signal
I/O
Function
B9
DVI_WA0
I/O
Digital Voice interface (WA0)
B6
DVI_RX
Digital Voice interface (RX)
B7
DVI_TX
Digital Voice interface (TX)
B8
DVI_CLK
I/O
Digital Voice interface (CLK)
Type
1.8V
9.2.1.
CODEC Example
Please refer to the Digital Voice Interface Application note.
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10.
General Purpose I/O
The CE910 module is provided by a set of Digital Input / Output pins
Input pads can only be read; they report the digital value (high or low) present on the pad at the read
time.
Output pads can only be written or queried and set the value of the pad output.
An alternate function pad is internally controlled by the CE910 firmware and acts depending on the
function implemented.
The following GPIOs are available on the CE910:
Pin
Signal
I/O
Function
Type
Default
State
Note
C8
GPIO_01
I/O
Configurable GPIO
CMOS 1.8V
INPUT
Alternate function
STAT_LED
C9
C10
C11
B14
C12
C13
K15
L15
G15
GPIO_02
GPIO_03
GPIO_04
GPIO_05
GPIO_06
GPIO_07
GPIO_08
GPIO_09
GPIO_10
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Configurable GPIO
Configurable GPIO
Configurable GPIO
Configurable GPIO
Configurable GPIO
Configurable GPIO
Configurable GPIO
Configurable GPIO
Configurable GPIO
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
INPUT
INPUT
INPUT
INPUT
INPUT
INPUT
INPUT
INPUT
INPUT
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10.1.
Logic Level Specification
Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels.
The following table shows the logic level specifications used in the CE910 interface circuits:
Absolute Maximum Ratings -Not Functional
Parameter
Input level on any digital pin (CMOS 1.8) with respect to ground
Min
-0.3V
Max
2.3V
Operating Range - Interface levels (1.8V CMOS)
Parameter
Input high level
Input low level
Output high level
Output low level
Min
1.5V
0.0V
1.35V
0.0V
Max
2.1V
0.35V
1.8V
0.45V
Current characteristics
Parameter
Output Current
Input Current
10.2.
Typical
2mA
30uA
Using a GPIO Pad as Input
The GPIO pads, when used as inputs, can be connected to a digital output of another device and report
its status, provided this device has interface levels compatible with the 1.8V CMOS levels of the
GPIO.
If the digital output of the device to be connected with the GPIO input pad has interface levels
different from the 1.8V CMOS, then it can be buffered with an open collector transistor with a 47KΩ
pull-up resistor to 1.8V.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level
signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF
transition.
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10.3.
Using a GPIO Pad as Output
The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware.
When set as outputs, the pads have a push-pull output and therefore the pull-up resistor may be
omitted.
10.4.
Indication of Network Service Availability
The STAT_LED pin status shows information on the network service availability and Call status. In
the CE910 modules, the STAT_LED usually needs an external transistor to drive an external LED.
Because of the above, the status indicated in the following table is reversed with respect to the pin
status:
LED status
Permanently off
Fast blinking
(Period 1s, Ton 0,5s)
Slow blinking
(Period 3s, Ton 0,3s)
Permanently on
Device Status
Device off
Net search / Not registered / turning off
Registered full service
a call is active
A schematic example could be:
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10.5.
RTC Bypass Output
The VRTC pin brings out the Real Time Clock supply but it is NOT separate from the rest of the
digital part. So unlike other Telit’s products, CE910 series cannot support RTC function if VBATT is
not supplied. In this reason xE910 RTC Backup Application Note is NOT valid for CE910.
In summary in order to use RTC function with CE910, VBATT must be supplied from the application.
VRTC also supplies reference power to help CE910 check the time from SMPL (Sudden Momentary
Power Loss).
So it is recommended as best practice to connect VRTC to a shunt capacitor (VRTC to GND) and the
acceptable capacitor value is:
Parameter
Keep-alive capacitor
on Pad no. = C14
Min
6.8uF
NOTE:
VBATT must be supplied in order to use RTC function.
NOTE:
It is recommended to add a keep-alive capacitor on VRTC.
WARNING:
NO devices must be powered from this pin.
10.6.
VAUX/PWRMON Power Output
A regulated power supply output is provided in order to supply small devices from the module. This
output is active when the module is ON and goes OFF when the module is shut down. The operating
range characteristics of the supply are:
Operating Range – VAUX/PWRMON power supply
Parameter
Output voltage
Output current
Min
1.77V
Typical
1.8V
Max
1.83V
200mA
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Output bypass capacitor
(Inside the module)
2.2μF
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11.
ADC section
11.1.
Description
The on board ADC is 12-bit converter. It is able to read a voltage level in the range of 0 ~ 1.2 volts
applied on the ADC pin input and store and convert it into 12 bit word.
Parameter
Input Voltage range
AD conversion
Resolution
Input Resistance
Min
Max
1.2
12
< 1
Units
Volt
bits
mV
Mohm
The CE910 provides one Analog to Digital Converter.
The input line is named as ADC_IN1 and it is available on pad B1.
11.2.
Using ADC Converter
An AT command is available to use the ADC function.
The command is AT#ADC=1,2. The read value is expressed in mV
Refer to SW User Guide or AT Commands Reference Guide for the full description of this function.
WARNING:
The ADC value read by AT command may present a certain level when it’s open(not loaded). It is not
an actual error and the ADC value is valid only if any input is asserted to ADC_IN1
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12.
Test Point
These pins are needed in order to analyze CE910 on the application board.
The signals of the CE910 are:
PAD
C3
C4
C5
C6
C7
D3
E3
Signal
TP1
TP2
TP3
TP4
TP5
TP6
TP7
I/O
Function
Test Point
Test Point
Test Point
Test Point
Test Point
Test Point
Test Point
Type
TP
TP
TP
TP
TP
TP
TP
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13.
Mounting CE910 on the Application
13.1.
General
The CE910 has been designed in order to be compliant with a standard lead-free SMT process.
13.2.
Module Finishing & Dimensions
The CE910 overall dimensions are:

Length :
28.2 mm

Width :
28.2 mm

Thickness :
2.05 mm

Weight :
4.7 g
Top view
Bottom view
(Dimensions in mm)
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13.3.
Recommended foot print for the application
144 pins
< Top View >
In order to easily rework the CE910 it is suggested to consider having a 1.5 mm placement inhibit
area around the module on the application.
It is also suggested, as a common rule for an SMT component, to avoid having a mechanical part of
the application in direct contact with the module.
NOTE:
In the customer application, the region under WIRING INHIBIT (see figure) must be clear from
signal or ground paths.
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13.4.
Stencil
Stencil’s apertures layout can be the same as the recommended footprint (1:1). A suggested thickness
of stencil foil ≥ 120 µm.
13.5.
PCB Pad Design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
Copper pad
Solder mask
Copper pad
PCB
Solder Mask Defined
13.6.
Non Solder Mask Defined
Recommendations for PCB Pad Dimensions (mm)
The recommendation for the PCB pads dimensions are described in the following image(dimensions
in mm)
It is not recommended to place via or micro-via not covered by solder resist in an area of 0.3 mm
around the pads unless it carries the same signal as the pad itself (see following figure).
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Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB Pad Surfaces:
Finish
Electro-less Ni / Immersion Au
Layer thickness (um)
3 ~ 7 / 0.05 ~ 0.15
Properties
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free process.
This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder
paste on the described surface plating is better compared to lead-free solder paste.
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13.7.
Solder Paste
Solder Paste
Lead free
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after
assembly.
13.7.1. Solder Reflow
The following is the recommended solder reflow profile:
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Pb-Free Assembly
3℃/second max
150℃
200℃
60 ~ 180 seconds
Tsmax to TL
- Ramp-up Rate
3℃/second max
Time maintained above:
- Temperature (TL)
- Time (tL)
217℃
60 ~150 seconds
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Profile Feature
Pb-Free Assembly
Peak Temperature (TP)
245 +0/-5℃
Time within 5℃ of actual Peak Temperature (tP)
10 ~30 seconds
Ramp-down Rate
6 ℃/sec max
Time 25℃ to Peak Temperature
8 minutes max
NOTE:
All temperatures refer to topside of the package, measured on the package body surface.
WARNING:
The CE910 module withstands one reflow process only.
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14.
Packing System
The CE910 modules are packaged on trays of 20 pieces each. These trays can be used in SMT
processes for pick & place handling.
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14.1.
Moisture Sensibility
The CE910 is a Moisture Sensitive Device level 3, in accordance with standard IPC/JEDEC J-STD020, take care all the relative requirements for using this kind of components.
Moreover, the customer has to take care of the following conditions:
a) Calculated shelf life in sealed bag: 12 months at < 40°C and 90% relative humidity (RH).
b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD033A paragraph 5.
c) The maximum time between the opening of the sealed bag and the reflow process must be
168hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected
d) Baking is required if conditions b) or c) are not respected
e)
Baking is required if the humidity indicator inside the bag indicates 10% RH or more
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15.
Application Design Guide
15.1.
Download and Debug Port
One of the following options should be chosen in the design of host system in order to download or
upgrade the Telit’s software and debug CE910 when CE910 is already mounted on a host system.
CASE I:
Users who use both of UART and USB interfaces to communicate with CE910
Must implement a download method in a host system for upgrading CE910 when it’s mounted.
CASE II:
Users who use USB interface only to communicate with CE910
Must arrange UART port in a host system for debugging or upgrading CE910 when it’s mounted.
CASE III:
Users who use UART interface only to communicate with CE910
Must arrange USB port in a host system for debugging or upgrading CE910 when it’s mounted.
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16.
Conformity Assessment Issues(Problèmes
d'évaluation de conformité)
The CE910 is FCC/IC Approved as module to be installed in other devices. This device should be
used only for fixed and mobile applications and if the final product after integration is intended for
portable use, a new application and FCC is required.
Le CE910 est approuvé FCC/IC comme module à installer dans d'autres dispositifs. Ce dispositif doit
être utilisé uniquement pour des applications fixes et mobiles et si le produit fini est prévu après
intégration pour un usage portatif, une nouvelle application et la FCC est requise
The user is cautioned that this device should be used only as specified within this manual to meet RF
exposure requirements.
L'utilisateur est averti que ce dispositif doit être utilisé uniquement comme spécifié dans ce manuel
pour répondre aux normes d'exposition aux ondes rf.
Use of this device in a manner inconsistent with this manual could lead to excessive RF exposure
conditions.
L'utilisation de ce dispositif en quelque sorte contradictoire avec ce manuel a pu mener aux états
excessifs d'exposition de rf.
The CE910 is conforming to the following US Directives:
• Use of RF Spectrum. Standards: FCC47 Part 22&24
• EMC Standards: FCC47 Part 15
Le CE910 est conforme aux directives suivantes des USA
• Utilisation de spectre de rf. Normes : FCC47 partie 22&24
• Normes d'EMC : FCC47 partie 15
This device complies with Part 15 of the FCC Rules and complies with industry Canada licenseexempt RSS standard(s)
Ce dispositif est conforme à la partie 15 des règles FCC et est conforme avec l'industrie au Canada
exempts de licence standard RSS (s)
Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference, including interference that may cause undesired
operation of the device.
Le fonctionnement est sujet aux deux conditions suivantes :
(1) ce dispositif peut ne pas causer l'interférence nocive, et
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(2) ce dispositif doit accepter aucune interférence, y compris un interférence qui pourrait
causer le fonctionnement non désiré du dispositif.
The user must refer to below information to meet the FCC/IC's RF exposure rules and regulations
when they design:
Lors de la conception, l'utilisateur doit se référer à l'information ci-dessous pour remplir les
conditions et règlementations FCC/IC' d’exposition aux ondes RF:
• The system antenna(s) used for this transmitter must be installed to provide a separation
distance of at least 20 cm from all the persons and must not be co-located or operating in
conjunction with any other antenna or transmitter.
Le système d’antenne utilisé pour cet émetteur doit être installé à une distance d’au moins de
20 cm de toute personne et ne doit pas être co-implanté ou opérer en même temps que
n'importe quelle autre antenne ou émetteur.
• The system antenna(s) used for this module must not exceed 5.12dBi in CDMA BC0&BC10
and 6.12dBi in CDMA BC1 for mobile and fixed or mobile operating configurations.
Le système d’ antenne utilisé pour ce module ne doit pas dépasser 5.12dBi en CDMA
BC0&BC10 et 6.12dBi en CDMA BC1 pour des configurations mobiles et fixes ou des
configurations opérant en mode mobile.
• Users and installers must be provided with antenna installation instructions and transmitter
operating conditions for satisfying RF exposure compliance.
Manufacturers of mobile, fixed or portable devices incorporating this module are advised to
clarify any regulatory questions and to have their complete product tested and approved for
FCC compliance.
Les instructions d’installation de l’antenne ainsi que les conditions de fonctionnement de
l’émetteur doivent être remis aux utilisateurs et aux installateurs conformément à la
règlementation sur l’exposition aux ondes rf. Des fabricants des dispositifs mobiles, fixes ou
portables incorporant ce module sont invités à clarifier toutes les questions de normalisation
et à avoir leur produit complètement testé pour la mise en conformité FCC.
• CE910 is intended for the OEM integrator only.
CE910 est prévu pour l'intégrateur OEM seulement.
• The user is required to see the Grant of Equipment document for other restrictions.
L'utilisateur doit se referrer au document « Grant of equipment » pour d'autres restrictions.
• CE910 must be operated and used with a locally approved access point.
CE910 doit être actionné et utilisé avec un point d'accès localement approuvé.
• The radio transmitters (CE910-DUAL IC ID: 5131A-CE910DUAL & CE910B-DUAL IC ID:
5131A-CE910BDUAL) have been approved by Industry Canada to operate with the antenna
type listed in this manual with the maximum permissible gain and required antenna
impedance for each antenna type indicated. Antenna types not included in this list, having a
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
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gain greater than the maximum gain indicated for that type, are strictly prohibited for use
with this device.
L'émetteur radio (CE910-DUAL identification d'IC : 5131A-CE910DUAL & CE910BDUAL identification d'IC : 5131A-CE910BDUAL) a été approuvé par Industry Canada pour
fonctionner avec le type d'antenne énuméré dans ce manuel avec le gain autorisé maximum et
l'impédance d’antenne exigée pour chaque type d'antenne indiqué. Les types d'antenne non
inclus dans cette liste, ayant un gain supérieur au gain maximum indiqué pour ce type, sont
strictement interdits pour un usage avec ce dispositif.
The following regulatory and safety notices must be published in documentation supplied to the
end user of the product or system incorporating an adapter in compliance with local regulations.
•
Host system including CE910 must be labeled with
“Contains transmitter module with
CE910-DUAL FCC ID: RI7CE910-DUAL and IC ID: 5131A-CE910DUAL
CE910B-DUAL FCC ID: RI7CE910B-DUAL and IC ID: 5131A-CE910BDUAL”
Les notices de normalisation et de sécurité doivent se trouver dans la documentation fournie à
l'utilisateur du produit ou du système incorporant un adaptateur conforme aux règlementations
locales.
•
Le système hôte comprenant CE910 doit être marqué avec « Contient un module
émetteur avec
CE910-DUAL IDENTIFICATION FCC : RI7CE910-DUAL et identification IC :
5131A-CE910DUAL
CE910B-DUAL IDENTIFICATION FCC : RI7CE910B-DUAL et identification IC :
5131A-CE910BDUAL »
NOTE:
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected
•Consult the dealer or an experienced radio/TV technician for help.
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CE910 Family Hardware User Guide
1vv0301010 Rev.11 – 2015-10-27
WARNING:
Changes or modifications to this equipment not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.
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CE910 Family Hardware User Guide
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17.
Safety Recommendations
READ CAREFULLY
Be sure the use of this product is allowed in the country and in the environment required. The use of
this product may be dangerous and has to be avoided in the following areas:
 Where it can interfere with other electronic devices in environments such as hospitals, airports,
aircrafts, etc.
 Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is the
responsibility of the user to enforce the country’s regulations and the specific environmental
regulation.
Do not disassemble the product; any evidence of tampering will compromise the warranty validity.
Follow the instructions of the hardware user guides for a correct wiring of the product. The product
has to be supplied with a stabilized voltage source and the wiring has to conform to the security and
fire prevention regulations. The product has to be handled with care, avoiding any contact with the
pads because electrostatic discharges may damage the product itself.
The system integrator is responsible for the functioning of the final product; therefore, care has to be
taken with the external components of the module as well as of any project or installation issue
because of the risk of disturbing the CDMA network or external devices or having impact on security.
Should there be any doubt, please refer to the technical documentation and the regulations in force.
Every module has to be equipped with a proper antenna with specific characteristics. The antenna has
to be installed with care in order to avoid any interference with other electronic devices and has to
guarantee a minimum distance from the body (20 cm). In case this requirement cannot be satisfied,
the system integrator has to assess the final product against SAR regulations.
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Page 73 of 75
CE910 Family Hardware User Guide
1vv0301010 Rev.11 – 2015-10-27
18.
Document History
Revision
Date
2012-07-12
2012-08-06
2012-12-20
2013-04-08
2013-04-16
2013-06-03
2013-12-12
2014-08-13
2014-11-10
10
2015-02-09
2015-05-15
Changes
Initial release for MKT sample
8.1 Modem Serial Port1: added input resistances for input lines
10.5 RTC Bypass Output : updated application information
2.2 Product Specifications updated : Device dimensions
3.1 Pin-out : Auxiliary UART and RUIM IF added,
LGA Pads Layout updated
4.2 Turning off the CE910 updated
4.4 Hardware Unconditional Shutdown updated
5.1 Power Supply Requirement updated
7 USB Port updated
8 Serial Port updated
12.2 Module Finishing & Dimensions updated
13. Packing System updated
13.1 Moisture Sensibility updated
14. Application Design Guide updated
5.1 Power Supply Requirement updated : added the extended
operating voltage range
8.1 Modem Serial Port updated
9. Audio section overview updated
Added information for CE910-SC
14. Application Design Guide updated
12.4 Stencil updated
2.2 Product Specifications
- Storage and Operating Temperature Range updated
2.2 Product Specification update
9.1.1 MIC Connection update.
10.5 RTC Bypass Output : updated application information
12.7 Solder reflow information updated
15 Conformity Assessment Issues update
2.2 Product Specification update :Device weight
4.1 Turning on the CE910 updated
4.2 Turning off the CE910 updated
4.4 Hardware Unconditional Shutdown updated
5.2 Power consumption updated
11. ADC section updated
3.1 Pin Out updated
10.5 RTC Bypass output updated
12. Test Point updated
12.2 Module Finishing & Dimensions
3.1 Pin Out updated
8.1 Modem Serial Port updated
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Page 74 of 75
CE910 Family Hardware User Guide
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11
2015-10-27
Added CE910B-DUAL
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Page 75 of 75

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Title                           : CE910 Family Hardware User Guide
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Subject                         : DE910-DUAL Hardware User Guide - Preliminary
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Telit Communications S p A CE910B-DUAL CDMA Module User Manual CE910 Family Hardware User Guide

Telit Communications S.p.A. CDMA Module CE910 Family Hardware User Guide

User Manual

FCC ID Filing: RI7CE910B-DUAL

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