Telit Communications S p A GE864Q2B Quadband GSM/ GPRS Module User Manual 1vv0300875 GE864 V2 Hardware User Guide r1

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GE864 QUAD V2
and
GE864 DUAL V2
Hardware User Guide
1vv0300875 Rev.1 – 2010-03-29
GE864GE864 -QUAD V2 / GE864GE864 -DUAL V2 Hardware User Guide
1vv0300875 Rev.1 – 2010-03-29
APPLICABILITY TABLE
PRODUCT
GE864
GE864864 -QUAD V2
GE864
GE864864 -DUAL V2
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved.
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GE864GE864 -QUAD V2 / GE864GE864 -DUAL V2 Hardware User Guide
1vv0300875 Rev.1 – 2010-03-29
DISCLAIMER
The information contained in this document is the proprietary information of Telit
Communications S.p.A. and its affiliates (“TELIT”).
The contents are confidential and any disclosure to persons other than the officers,
employees, agents or subcontractors of the owner or licensee of this document,
without the prior written consent of Telit, is strictly prohibited.
Telit makes every effort to ensure the quality of the information it makes available.
Notwithstanding the foregoing, Telit does not make any warranty as to the
information contained herein, and does not accept any liability for any injury, loss or
damage of any kind incurred by use of or reliance upon the information.
Telit disclaims any and all responsibility for the application of the devices
characterized in this document, and notes that the application of the device must
comply with the safety standards of the applicable country, and where applicable,
with the relevant wiring rules.
Telit reserves the right to make modifications, additions and deletions to this
document due to typographical errors, inaccurate information, or improvements to
programs and/or equipment at any time and without notice.
Such changes will, nevertheless be incorporated into new editions of this document.
Copyright: Transmittal, reproduction, dissemination and/or editing of this document
as well as utilization of its contents and communication thereof to others without
express authorization are prohibited. Offenders will be held liable for payment of
damages. All rights are reserved.
Copyright © Telit Communications SpA 2010.©
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved.
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GE864GE864 -QUAD V2 / GE864GE864 -DUAL V2 Hardware User Guide
1vv0300875 Rev.1 – 2010-03-29
Contents
APPLICABILITY TABLE .............................................................................................................................................. 2
1.
INTRODUCTION ................................................................
................................................................................................
................................................................................................
.....................................................................
.....................................6
..... 6
1.1.
1.2.
1.3.
1.4.
1.5.
1.6.
1.7.
SCOPE .................................................................................................................................................................. 6
AUDIENCE ............................................................................................................................................................. 6
CONTACT INFORMATION, SUPPORT ........................................................................................................................ 6
DOCUMENT ORGANIZATION .................................................................................................................................... 7
TEXT CONVENTIONS .............................................................................................................................................. 8
RELATED DOCUMENTS........................................................................................................................................... 8
DOCUMENT HISTORY ............................................................................................................................................. 9
2.
OVERVIEW ................................................................
................................................................................................
................................................................................................
............................................................................
............................................ 10
3.
GE864GE864-QUAD V2 / GE864GE864- DUAL MECHANICAL DIMENSIONS
DIME NSIONS................................
NSIONS .............................................................
............................................................. 11
4.
GE864GE864-QUAD V2 / GE864GE864- DUAL V2 MODULE CONNECTIONS
CONNE CTIONS .............................................................
............................................................. 12
4.1.
PIN-OUT........................................................................................................................................................... 12
4.1.1.
BGA Balls Layout ..................................................................................................................................... 17
5.
HARDWARE COMMANDS ................................................................
................................................................................................
.....................................................................................
..................................................... 19
5.1.
5.2.
TURNING ON THE GE864-QUAD V2 / GE864-DUAL V2 ................................................................................... 19
TURNING OFF THE GE864-QUAD V2 / GE864-DUAL V2 ................................................................................. 21
5.2.1.
Hardware Unconditional Restart........................................................................................................ 22
6.
POWER
PO WER SUPPLY................................
SUPPLY ................................................................
................................................................................................
................................................................................................
...................................................................
................................... 24
6.1.
6.2.
POWER SUPPLY REQUIREMENTS ......................................................................................................................... 24
GENERAL DESIGN RULES .................................................................................................................................... 25
6.2.1.
Electrical Design Guidelines ............................................................................................................... 25
6.2.2.
Thermal Design Guidelines ................................................................................................................. 29
6.2.3.
Power Supply PCB Layout Guidelines................................................................................................ 30
6.2.4.
Parameters for ATEX Applications .................................................................................................... 31
7.
ANTENNA ................................................................
................................................................................................
................................................................................................
............................................................................
............................................ 33
7.1.
7.2.
8.
GSM ANTENNA REQUIREMENTS .......................................................................................................................... 33
GSM ANTENNA – INSTALLATION GUIDELINES ...................................................................................................... 34
LOGIC LEVEL SPECIFICATIONS
SPECIFICATIONS ................................................................
................................................................................................
..........................................................................
.......................................... 35
8.1.
9.
RESET SIGNAL .................................................................................................................................................... 36
SERIAL PORTS ................................................................
................................................................................................
................................................................................................
.....................................................................
..................................... 37
9.1.
9.2.
9.3.
10.
MODEM SERIAL PORT.................................................................................................................................... 37
RS232 LEVEL TRANSLATION ............................................................................................................................. 39
5V UART LEVEL TRANSLATION........................................................................................................................... 41
AUDIO SECTION
SECTION OVERVIEW ................................................................
................................................................................................
.............................................................................
............................................. 44
10.1. SELECTION MODE............................................................................................................................................... 44
10.2. ELECTRICAL CHARACTERISTICS ........................................................................................................................ 46
10.2.1.
Input Lines Characteristics ...................................................................................................................... 46
10.2.2.
Output Lines Characteristics.................................................................................................................... 47
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GE864GE864 -QUAD V2 / GE864GE864 -DUAL V2 Hardware User Guide
1vv0300875 Rev.1 – 2010-03-29
11.
GENERAL PURPOSE I/O ................................................................
................................................................................................
..................................................................................
.................................................. 49
11.1. GPIO LOGIC LEVELS ......................................................................................................................................... 50
11.2.
USING A GPIO PAD AS INPUT ........................................................................................................................ 51
11.3.
USING A GPIO PAD AS OUTPUT .................................................................................................................... 51
11.4.
USING THE RF TRANSMISSION CONTROL GPIO4.............................................................................................. 51
11.5.
USING THE RFTXMON OUTPUT GPIO5 .......................................................................................................... 52
USING THE ALARM OUTPUT GPIO6................................................................................................................................... 53
11.6.
USING THE BUZZER OUTPUT GPIO7 ................................................................................................................ 53
11.7.
MAGNETIC BUZZER CONCEPTS......................................................................................................................... 54
11.7.1. Short Description .................................................................................................................................. 54
11.8.1 Frequency Behavior ................................................................................................................................... 55
11.7.2. Power Supply Influence ....................................................................................................................... 55
11.7.3. Warning .................................................................................................................................................. 55
11.7.4. Working Current Influence .................................................................................................................. 56
11.8.
USING THE TEMPERATURE MONITOR FUNCTION ............................................................................................... 56
11.8.1. Short Description .................................................................................................................................. 56
11.8.2. Allowed GPIO ......................................................................................................................................... 56
11.9.
INDICATION OF NETWORK SERVICE AVAILABILITY ............................................................................................. 57
11.10.
RTC BYPASS OUT ........................................................................................................................................... 58
11.11.
DAC CONVERTER ............................................................................................................................................ 59
11.11.1.
Description ......................................................................................................................................... 59
11.11.2.
Enabling DAC ..................................................................................................................................... 59
11.11.3.
Low Pass Filter Example ................................................................................................................. 60
11.12.
ADC CONVERTER ............................................................................................................................................ 60
11.12.1.
Description ......................................................................................................................................... 60
11.12.2.
Using ADC Converter ........................................................................................................................ 61
11.13.
DEBUG OF THE GE864-QUAD V2 / GE864-DUAL V2 IN PRODUCTION ....................................................... 61
12.
ASSEMBLY THE GE864GE864- QUAD V2 / GE864GE864-DUAL V2 ON THE BOARD .............................................
............................................. 62
12.1. RECOMMENDED FOOT PRINT FOR THE APPLICATION .......................................................................................... 63
12.2. STENCIL ............................................................................................................................................................. 63
12.3. PCB PAD DESIGN ............................................................................................................................................... 64
12.4. SOLDER PASTE ................................................................................................................................................... 65
12.4.1.
GE865 Solder reflow ................................................................................................................................ 66
13.
13.1.
PACKING SYSTEM ................................................................
................................................................................................
............................................................................................
............................................................ 68
MOISTURE SENSIBILITY...................................................................................................................................... 69
14.
CONFORMITY ASSESSMENT
ASSESSMENT ISSUES ................................................................
..............................................................................................
.............................................................. 70
15.
SAFETY RECOMMENDATIONS
RECOMMENDATIONS ................................................................
................................................................................................
.........................................................................
......................................... 72
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GE864GE864 -QUAD V2 / GE864GE864 -DUAL V2 Hardware User Guide
1vv0300875 Rev.1 – 2010-03-29
1.
1.1.
Introduction
Scope
The aim of this document is the description of some hardware solutions useful for
developing a product with the Telit GE864-QUAD V2 / GE864-DUAL V2 module.
1.2.
Audience
This document is intended for Telit customers, who are integrators, about to
implement their applications using our GE864-QUAD V2 / GE864-DUAL V2 module.
1.3.
Contact Information, Support
For general contact, technical support, to report documentation errors and to order
manuals, contact Telit Technical Support Center (TTSC) at:
TS-EMEA@telit.com
TS-NORTHAMERICA@telit.com
TS-LATINAMERICA@telit.com
TS-APAC@telit.com
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where you can buy the Telit modules or for
recommendations on accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact
Telit’s Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your
comments and suggestions for improvements.
Telit appreciates feedback from the users of our information.
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GE864GE864 -QUAD V2 / GE864GE864 -DUAL V2 Hardware User Guide
1vv0300875 Rev.1 – 2010-03-29
1.4.
Document Organization
This document contains the following chapters:
Chapter 1: “Introduction” provides a scope for this document, target audience,
contact and support information, and text conventions.
Chapter 2: “Overview” provides an overview of the document.
Chapter 3: “GE864-QUAD V2 / GE864-DUAL V2 Mechanical Dimensions”
Chapter 4: “GE864-QUAD V2 / GE864-DUAL V2 Module Connections” deals with the
pin out configuration and layout.
Chapter 5: “Hardware Commands” How to control the module via hardware.
Chapter 6: “Power supply” Power supply requirements and general design rules.
Chapter 7: “Antenna” The antenna connection and board layout design are the most
important parts in the full product design
Chapter 8: “Logic Level specifications” Specific values adopted in the implementation
of logic levels for this module.
Chapter 9: “Serial ports” The serial port on the Telit GE864-QUAD V2 / GE864-DUAL
is the core of the interface between the module and OEM hardware
Chapter 10: “Audio Section overview” Refers to the audio blocks of the Base Band
Chip of the GE864-QUAD V2 / GE864-DUAL Telit Modules.
Chapter 11: “General Purpose I/O” How the general purpose I/O pads can be
configured.
Chapter 12 “DAC and ADC Section” Deals with these two kind of converters.
Chapter 13: “Mounting the GE864-QUAD V2 / GE864-DUAL V2 on the application
board” Recommendations and specifics on how to mount the module on the user’s
board.
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GE864GE864 -QUAD V2 / GE864GE864 -DUAL V2 Hardware User Guide
1vv0300875 Rev.1 – 2010-03-29
1.5.
Text Conventions
Danger – This information MUST be followed or catastrophic equipment failure
or bodily injury may occur.
Caution or Warning – Alerts the user to important points about integrating
integrating the
module, if these points are not followed, the module and end user equipment
may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful when
integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
1.6.
Related Documents
•
Telit's GSM/GPRS Family Software User Guide, 1vv0300784
•
Audio settings application note , 80000NT10007a
•
Digital voice Interface Application Note, 80000NT10004a
•
Product description, 80331ST10074a
•
SIM Holder Design Guides, 80000NT10001a
•
AT Commands Reference Guide, 80000ST10025a
•
Telit EVK2 User Guide, 1vv0300704
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved.
Page 8 of 73
GE864GE864 -QUAD V2 / GE864GE864 -DUAL V2 Hardware User Guide
1vv0300875 Rev.1 – 2010-03-29
1.7.
Document History
R e v i s io n
D ate
C h a ng e s
ISSUE#0
ISSUE#1
2010-02-03
2010-03-29
Release First ISSUE# 0
Updated Par. 5.1, Par.6.1, Par.7.1, Par.9.2,
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GE864GE864 -QUAD V2 / GE864GE864 -DUAL V2 Hardware User Guide
1vv0300875 Rev.1 – 2010-03-29
2.
Overview
In this document all the basic functions of a mobile phone are taken into account; for
each one of them a proper hardware solution is suggested and eventually the wrong
solutions and common errors to be avoided are evidenced. Obviously this document
cannot embrace the whole hardware solutions and products that may be designed.
The wrong solutions to be avoided shall be considered as mandatory, while the
suggested hardware configurations shall not be considered mandatory, instead the
information given shall be used as a guide and a starting point for properly
developing your product with the Telit GE864-QUAD V2 / GE864-DUAL V2 module. For
further hardware details that may not be explained in this document refer to the Telit
GE864-QUAD V2 / GE864-DUAL V2 Product Description document where all the
hardware information is reported.
NOTICE:
NOTICE :
(EN) The integration of the GSM/GPRS GE864-QUAD V2 / GE864-DUAL V2 cellular
module within user application shall be done according to the design rules described
in this manual.
The information presented in this document is believed to be accurate and reliable.
However, no responsibility is assumed by Telit Communications S.p.A. for its use, or
any infringement of patents or other rights of third parties which may result from its
use. No license is granted by implication or otherwise under any patent rights of Telit
Communications S.p.A. other than for circuitry embodied in Telit products. This
document is subject to change without notice.
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GE864GE864 -QUAD V2 / GE864GE864 -DUAL V2 Hardware User Guide
1vv0300875 Rev.1 – 2010-03-29
3.
GE864-QUAD V2 / GE864-DUAL Mechanical
Dimensions
The Telit GE864-QUAD V2 / GE864-DUAL V2 module overall dimensions are:
•
•
•
•
Length:
Width:
Thickness:
Weight:
30 mm
30 mm
2,9 mm
4.2g
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GE864GE864 -QUAD V2 / GE864GE864 -DUAL V2 Hardware User Guide
1vv0300875 Rev.1 – 2010-03-29
4.
GE864-QUAD V2 / GE864-DUAL V2 Module Connections
4.1.
PIN-OUT
The GE864-QUAD V2 / GE864-DUAL V2 uses 11x11 array BGA technology connection
Ball
Internal
PULL UP
Signal
I/O
Function
Type
F9
AXE
Handsfree switching
G8
MIC_HF+
AI
Handsfree mic. input; phase +, nom. level 3mVrms
Audio
G9
MIC_MT-
AI
Handset mic.signal input; phase-, nom. level 50mVrms
Audio
G10
EAR_MT+
AO
Handset earphone signal output, phase +
Audio
J8
MIC_MT+
AI
Handset mic.signal input; phase+, nom. level 50mVrms
Audio
J9
MIC_HF-
AI
Handsfree mic.input; phase -, nom. level 3mVrms
Audio
J10
EAR_HF-
AO
Handsfree ear output, phase -
Audio
H9
EAR_MT-
AO
Handset earphone signal output, phase -
Audio
H10
EAR_HF+
AO
Handsfree ear output, phase +
Audio
1,8 / 3V
Audio
100K
CMOS 2.8V
SIM card interface
C10
SIMCLK
External SIM signal – Clock
C11
SIMIN
External SIM signal - Presence (active low)
D4
SIMVCC
External SIM signal – Power supply for the SIM
Pull up 47K
1,8 / 3V
1,8 / 3V
Pull up
4.7K
D10
SIMIO
I/O
External SIM signal - Data I/O
1,8 / 3V
E9
SIMRST
External SIM signal – Reset
1,8 / 3V
D11
TX_TRACE
TX Data for debug monitor
CMOS 2.8V
F10
RX_TRACE
RX Data for debug monitor
CMOS 2.8V
Service pin shall be used to upgrade the module
from ASC1 (RX_TRACE, TX_TRACE). The pin
shall be tied low to enable the feature only in
case of a SW Update activity. It is required, for
debug purpose, to be connected
to a test pad on the final application.
CMOS 2.8V
Trace
H4
SERVICE
Prog. / Data + HW Flow Control
B6
C125/RING
Output for Ring indicator signal (RI) to DTE
CMOS 2.8V
B7
C108/DTR
Input for Data terminal ready signal (DTR) from DTE
CMOS 2.8V
D9
C109/DCD
Output for Data carrier detect signal (DCD) to DTE
CMOS 2.8V
E7
C103/TXD
Serial data input (TXD) from DTE
CMOS 2.8V
E11
C107/DSR
Output for Data set ready signal (DSR) to DTE
CMOS 2.8V
F7
C105/RTS
Input for Request to send signal (RTS) from DTE
CMOS 2.8V
F6
C106/CTS
Output for Clear to send signal (CTS) to DTE
CMOS 2.8V
H8
C104/RXD
Serial data output to DTE
CMOS 2.8V
DAC
DAC and ADC
C7
DAC_OUT
AO
Digital/Analog converter output
D/A
J11
ADC_IN1
AI
Analog/Digital converter input
A/D
H11
ADC_IN2
AI
Analog/Digital converter input
A/D
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GE864GE864 -QUAD V2 / GE864GE864 -DUAL V2 Hardware User Guide
1vv0300875 Rev.1 – 2010-03-29
Ball
Signal
I/O
Function
Internal
PULL UP
Type
Miscellaneous Functions
A2
RESET*
Reset input
D8
STAT_LED
Status indicator led
CMOS 1.8V
E2
VRTC
AO
VRTC
Power
J5
ON_OFF*
Input command for switching power ON or OFF (toggle
command). The pulse to be sent to the GE864-QUAD V2 Pull up 47K
must be equal or greater than 1 second.
Pull up to VBATT
L8
PWRMON
I/O
PWRMON
CMOS 2.8V
L4
GSM Antenna
Antenna output – 50 ohm
RF
Telit GPIO / DVI
C1
GPIO_01
I/O
GPIO_01
CMOS 2.8V
E6
GPIO_02 / JDR
I/O
GPIO_02 / JDR
CMOS 2.8V
C2
GPIO_03
I/O
GPIO_03
CMOS 2.8V
B3
GPIO_04 / TX_DISABLE
I/O
CMOS 2.8V
K8
GPIO_05 / RFTXMON
I/O
B5
GPIO_06 / ALARM
I/O
GPIO_04 / TX_DISABLE
Telit GPIO05 Configurable GPIO / Transmitter ON
monitor
Telit GPIO06 Configurable GPIO / ALARM
L9
GPIO_07 / BUZZER
I/O
Telit GPIO07 Configurable GPIO / Buzzer
CMOS 2.8V
K11
GPIO_08
I/O
GPIO_08
CMOS 2.8V
C9
GPIO_09
I/O
GPIO_09
CMOS 2.8V
H3
GPIO_10 / DVI_TX
I/O
GPIO_10 / DVI_TX
CMOS 2.8V
K7
DVI_RX
I/O
DVI_RX
CMOS 2.8V
D7
DVI_CLK
I/O
DVI_CLK
CMOS 2.8V
H5
DVI_WA0
I/O
DVI_WA0
CMOS 2.8V
CMOS 2.8V
CMOS 2.8V
Power Supply
J1
VBATT
Main power supply
Power
K1
VBATT
Main power supply
Power
J2
VBATT
Main power supply
Power
K2
VBATT
Main power supply
Power
A1
GND
Ground
Power
A11
GND
Ground
Power
D6
GND
Ground
Power
F1
GND
Ground
Power
F11
GND
Ground
Power
H1
GND
Ground
Power
H2
GND
Ground
Power
J3
GND
Ground
Power
K3
GND
Ground
Power
K4
GND
Ground
Power
K5
GND
Ground
Power
K6
GND
Ground
Power
L1
GND
Ground
Power
L2
GND
Ground
Power
L3
GND
Ground
Power
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GE864GE864 -QUAD V2 / GE864GE864 -DUAL V2 Hardware User Guide
1vv0300875 Rev.1 – 2010-03-29
Internal
PULL UP
Ball
Signal
I/O
Function
Type
L6
GND
Ground
Power
L11
GND
Ground
Power
RESERVED
A3
A4
Reserved
Reserved
A5
Reserved
A6
Reserved
A7
Reserved
A8
Reserved
A9
Reserved
A10
Reserved
B1
Reserved
B2
Reserved
B4
Reserved
B8
Reserved
B9
Reserved
B10
Reserved
B11
Reserved
C3
Reserved
C4
Reserved
C5
Reserved
C6
Reserved
C8
Reserved
D1
Reserved
D2
Reserved
D3
Reserved
D5
Reserved
E1
Reserved
E3
Reserved
E4
Reserved
E5
Reserved
E8
Reserved
E10
Reserved
F2
Reserved
F3
Reserved
F4
Reserved
F5
Reserved
F8
Reserved
G1
G2
Reserved
Reserved
G3
Reserved
G4
Reserved
G5
Reserved
G6
Reserved
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GE864GE864 -QUAD V2 / GE864GE864 -DUAL V2 Hardware User Guide
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Ball
Signal
I/O
Function
G7
Reserved
G11
Reserved
H6
Reserved
H7
Reserved
J4
J6
J7
K9
Reserved
Reserved
K10
Reserved
L5
Reserved
L7
Reserved
L10
Reserved
Internal
PULL UP
Type
Reserved
Reserved
NOTE:
The GE864-QUAD V2 / GE864-DUAL V2 Modules has only one DVI ports on the system
interface.
NOTE:
Reserved pins must not be connected.
NOTE:
RTS must be connected to the GND (on the module side) if flow control is not used.
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GE864GE864 -QUAD V2 / GE864GE864 -DUAL V2 Hardware User Guide
1vv0300875 Rev.1 – 2010-03-29
NOTE:
NOTE :
If not used, almost all pins must be left disconnected. The only exceptions are the
following pins:
Ball
Signal
Function
J1 , J2
J2 , K1, K2
VBATT
Main power supply
A1, A11, D6, F1, F11, H1,
H2, J3, K3, K4, K5,
K5 , K6, L1, GND
L2, L3, L6, L11
Ground
E7
C103/TXD
Serial data input (TXD) from DTE
H8
C104/RXD
Serial data output to DTE
F7
C105/RTS
Input for Request to send signal (RTS) from DTE
J5
ON/OFF*
Input command for switching power ON or OFF (toggle command).
A2
RESET*
Reset input
F10
RX_TRACE
RX Data for debug monitor
D11
TX_TRACE
TX Data for debug monitor
H4
SERVICE
SERVICE connection
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GE864GE864 -QUAD V2 / GE864GE864 -DUAL V2 Hardware User Guide
1vv0300875 Rev.1 – 2010-03-29
4.1.1.
BGA Balls Layout
TOP VIEW
GND
GPIO_01
GND
GND
VBATT
VBATT
GND
RESET*
GPIO_03
VRTC
GND
VBATT
VBATT
GND
GPIO_04 /
TX_DISABL
GPIO_10 /
DVI_TX
GND
GND
GND
--
SIMVCC
SERVICE
GND
GSM
Antenna
GPIO_06 /
ALARM
DVI_WA0
ON_OFF*
GND
C125/RING
GND
GPIO_02 /
JDR
C106 / CTS
GND
GND
C108 / DTR
DAC_OUT
DVI_CLK
C103 / TXD
C105 / RTS
DVI_RX
STAD_ LED
MIC_HF+
C104 / RXD
MIC_MT+
GPIO_05 /
RFTXMON
PWRMON
GPIO_09
C109 / DCD
SIMRST
AXE
MIC_MT-
EAR_MT-
MIC_HF-
GPIO_07 /
BUZZER
10
SIMCLK
SIMIO
RX_TRACE
EAR_MT+
EAR_HF+
EAR_HF-
11
GND
SIMIN
TX_TRACE
C107 / DSR
GND
ADC_IN2
ADC_IN1
GPIO_08
GND
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AUDIO Signals balls
SIM CARD interface balls
TRACE Signals balls
Prog. / data + Hw Flow Control signals balls
ADC signals balls
MISCELLANEOUS functions signals balls
TELIT GPIO balls
POWER SUPPLY VBATT balls
POWER SUPPLY GND balls
RESERVED
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5.
Hardware Commands
5.1.
Turning ON the GE864-QUAD V2 / GE864-DUAL V2
To turn the GE864-QUAD V2 / GE864-DUAL V2 on, the pad ON# must be tied low for
at least 1000ms and then released. A pulse duration less than 1000ms should also
start the power on procedure, but this is not guaranteed.
The maximum current that can be drained from the ON# pad is 0,1 mA.
A simple circuit to do it is:
TIP:
To check if the device has powered on, the hardware line PWRMON must be
monitored. After 1000ms the line raised up the device could be considered powered
on.
NOTE:
Do not use any pull up resistor on the ON# line, it is internally pulled up. Using pull
up resistor may bring to latch up problems on the GE864-QUAD V2 / GE864-DUAL V2
power regulator and improper power on/off of the module. The line ON# must be
connected only in open collector configuration.
In this document all the lines that are inverted, hence have active low signals are
labeled with a name that ends with a "#" or with a bar over the name.
NOTE:
NOTE When the power supply voltage is lower than 3.4V, to turn ON the module, the
pad ON# must be tied low for at least 3 seconds.
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For example:
1- Let us assume you need to drive the ON# pad with a totem pole output of a +3/5 V
microcontroller (uP_OUT1):
2- Let us assume you need to drive the ON# pad directly with an ON/OFF button:
A flow chart with proper turn on procedure is detailed below:
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5.2.
Turning OFF the GE864-QUAD V2 / GE864-DUAL V2
Turning off of the device can be done in three ways:
•
by software command (see GE864-QUAD V2 / GE864-DUAL V2 Software
User Guide)
•
by tying low pin ON#
Either ways, the device issues a detach request to network informing that the device will not
be reachable any more. To turn OFF the GE864-QUAD V2 / GE864-DUAL via pin ON#, this
must be tied low for at least 1000ms and then released.The same circuitry and timing for the
power on shall be used.The device shuts down after the release of the ON# pin.
The following flow chart shows the proper turnoff procedure:
TIP:
To check if the device has powered off, the hardware line PWRMON must be
monitored. When PWRMON goes low, then the device has powered off.
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5.2.1.
Hardware Unconditional Restart
WARNING:
The hardware unconditional Restart must not be used during normal operation of the
device since it does not detach the device from the network. It shall be kept as an
emergency exit procedure to be done in the rare case that the device gets stacked
waiting for some network or SIM responses.
To unconditionally Restart the GE864-QUAD V2 / GE864-DUAL V2, the pad RESET#
must be tied low for at least 200 ms and then released.
The maximum current that can be drained from the RESET# pad is 0,15 mA.
A simple circuit to do it is:
NOTE:
Do not use any pull up resistor on the RESET* line nor any totem pole digital output.
Using pull up resistor may cause latch up problems on the GE864-QUAD V2 / GE864DUAL V2 power regulator and improper functioning of the module. The line RESET*
must be connected only in open collector configuration.
TIP:
The unconditional hardware reboot must always be implemented on the boards and
the software must use it as an emergency exit procedure.
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In the following flow chart is detailed the proper restart procedure:
For example:
1- Let us assume you need to drive the RESET# pad with a totem pole output of a
+3/5 V microcontroller (uP_OUT2):
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6.
Power Supply
The power supply circuitry and board layout are a very important part in the full
product design and they strongly reflect on the product overall performances, hence
read carefully the following requirements and guidelines for a proper design.
6.1.
Power Supply Requirements
Condition
Nominal Supply Voltage
Normal operating Voltage Range
Extended operating Voltage Range
Value
3.80 V
3.40 V - 4.20 V
3.22 V – 4.50 V
The GE864-QUAD V2 / GE864-DUAL V2 power consumptions are:
GE864GE864-QUAD V2 / GE864GE864 - DUAL V2
Mode
Average (mA)
SWITCHED OFF
Switched Off
<62 uA
AT+CFUN=1
AT+CFUN=4
AT+CFUN=0 or =5
CSD TX and RX mode
GSM900 CSD PL5
DCS1800 CSD PL0
GPRS (class 10) 1TX
GSM900 PL5
DCS1800 PL0
GPRS (class 10) 2TX
GSM900 PL5
DCS1800 PL0
19.0
18.0
3.9
2.9
2.1
1.9
1.6
Mode description
Module supplied but Switched Off
IDLE mode
Normal mode: full functionality of the module
Disabled TX and RX; module is not registered on the network
Paging Multiframe 2
Paging Multiframe 4
Paging Multiframe 6
Paging Multiframe 8
Paging Multiframe 9
300
200
GSM VOICE CALL
260
170
GPRS Sending data mode
470
300
GPRS Sending data mode
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The GSM system is made in a way that the RF transmission is not continuous but it is
packed into bursts at a base frequency of about 216 Hz. The relative current peaks
can be as high as about 2A. Therefore the power supply has to be designed in order
to withstand with these current peaks without big voltage drops; this means that both
the electrical design and the board layout must be designed for this current flow.
If the layout of the PCB is not well designed, then a strong noise floor is generated on
the ground and the supply; this will reflect on all the audio paths producing an
audible and annoying noise at 216 Hz; if the voltage drop during the peak current
absorption is too much, then the device may even shutdown as a consequence of the
supply voltage drop.
TIP:
TIP :
The power supply must be designed so that it is capable of a peak current output of
at least 2 A.
TIP:
TIP the supply voltage is directly measured between VBATT and GND balls. It must
stay within the Wide Supply Voltage tolerant range including any drop voltage and
overshoot voltage (during the slot tx, for example).
NOTE:
NOTE The Operating Voltage Range MUST never be exceeded also in power off
condition; care must be taken in order to fulfill min/max voltage requirement
NOTE:
NOTE When the power supply voltage is lower than 3.4V, to turn ON the module, the
pad ON# must be tied low for at least 3 seconds.
6.2.
General Design Rules
The principal guidelines for the Power Supply Design embrace three different design
steps:
•
•
•
6.2.1.
the electrical design
the thermal design
the PCB layout.
Electrical Design Guidelines
The electrical design of the power supply depends strongly from the power source
where this power is drained. We will distinguish them into three categories:
•
•
•
+5V input (typically PC internal regulator output)
+12V input (typically automotive)
Battery
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6.2.1.1.
+ 5V input Source Power Supply Design Guidelines
•
The desired output for the power supply is 3.8V, hence there is no big
difference between the input source and the desired output. A linear
regulator can be used. A switching power supply will not be suited
because of the low drop out requirements.
•
When using a linear regulator, a proper heat sink shall be provided in
order to dissipate the power generated.
•
A Bypass low ESR capacitor of adequate capacity must be provided in
order to cut the current absorption peaks close to the GE864-QUAD V2 /
GE864-DUAL V2, a 100µF tantalum capacitor is usually suited.
•
Make sure the low ESR capacitor on the power supply output (usually a
tantalum one) is rated at least 10V.
•
A protection diode can be inserted close to the power input, in order to
save the GE864-QUAD V2 / GE864-DUAL V2 from power polarity inversion.
An example of linear regulator with 5V input is:
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6.2.1.2.
+ 12V input Source Power Supply Design Guidelines
•
The desired output for the power supply is 3.8V, hence, due to the big
difference between the input source and the desired output, a linear
regulator is not suited and shall not be used. A switching power supply
will be preferable because of its better efficiency especially with the 2A
peak current load represented by the GE864-QUAD V2 / GE864-DUAL V2.
•
When using a switching regulator, a 500kHz (or more) switching
frequency regulator is preferable, because of its smaller inductor size and
its faster transient response. This allows the regulator to respond quickly
to the current peaks absorption.
•
In any case the frequency and switching design selection is related to the
application to be developed, due to the fact that the switching frequency
could also generate EMC interferences.
•
As far as car PB battery, the input voltage can rise up to 15.8V. This must
be kept in mind when choosing components: all components in the power
supply must withstand this voltage.
•
A Bypass low ESR capacitor of adequate capacity must be provided, in
order to cut the current absorption peaks. A 100µF tantalum capacitor is
typically used.
•
Make sure the low ESR capacitor on the power supply output (usually a
tantalum one) is rated at least 10V.
•
As far as car applications, a spike protection diode must be inserted close
to the power input, in order to clean the supply from spikes.
•
A protection diode can be inserted close to the power input, in order to
save the GE864-QUAD V2 / GE864-DUAL V2 from power polarity inversion.
This can be the same diode used for spike protection.
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An example of switching regulator with 12V input is in the schematic below (split in 2
parts):
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6.2.1.3.
Battery Source Power Supply Design Guidelines
The desired nominal output for the power supply is 3.8V and the maximum voltage
allowed is 4.5V. A single 3.7V Li-Ion cell battery type is suited for supplying the power
to the Telit GE864-QUAD V2 / GE864-DUAL V2 module.
CAUTION:
The three cells Ni/Cd or Ni/MH 3,6 V Nom. Battery types or 4V PB types MUST NOT
BE USED DIRECTLY since their maximum voltage can rise over the absolute
maximum voltage for the GE864-QUAD V2 / GE864-DUAL V2 and damage it.
CAUTION:
DO NOT USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with GE864QUAD V2 / GE864-DUAL V2. Their use can lead to overvoltage on the GE864-QUAD V2
/ GE864-DUAL V2 and damage it. USE ONLY Li-Ion battery types.
A Bypass low ESR capacitor of adequate capacity must be provided, in order to cut
the current absorption peaks. A 100µF tantalum capacitor is typically used.
Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.
A protection diode can be inserted close to the power input, in order to save the
GE864-QUAD V2 / GE864-DUAL V2 from power polarity inversion. Otherwise the
battery connector must be done in a way to avoid polarity inversions when connecting
the battery.
The battery capacity must be at least 500mAh in order to withstand the current peaks
of 2A; the suggested capacity is from 500mAh to 1000mAh.
6.2.2. Thermal Design Guidelines
The thermal design for the power supply heat sink must be done with the following
specifications:
•
Average current consumption during transmission @PWR level max:
500mA
•
Average current consumption during transmission @ PWR level min:
100mA
•
Average current during Power Saving (CFUN=5): from 1.6 to 3.9mA
•
Average current during idle (Power Saving disabled): 19mA
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NOTE:
NOTE :
The average consumption during transmissions depends on the power level at which
the device is requested to transmit by the network. The average current consumption
hence varies significantly.
Considering the very low current during idle, especially if Power Saving function is
enabled, it is possible to consider from the thermal point of view that the device
absorbs current significantly only during calls.
If we assume that the device stays into transmission for short periods of time (let us
say few minutes) and then remains for a quite long time in idle (let us say one hour),
then the power supply has always the time to cool down between the calls, and the
heat sink could be smaller than the calculated one for 500mA maximum RMS
current, or even could be the simple chip package (no heat sink).
Moreover, in the average network conditions, the device is requested to transmit at a
lower power level than the maximum, hence the current consumption will be less
than 500mA, usually around 150mA.
For these reasons the thermal design is rarely a concern and the simple ground
plane where the power supply chip is placed grants a good thermal condition to avoid
overheating as well.
As far as the heat generated by the GE864-QUAD V2 / GE864-DUAL V2, you can
consider it to be during transmissions of 1W max during CSD/VOICE calls and 2W
max during class10 GPRS upload.
This generated heat will be mostly conducted to the ground plane under the GE864QUAD V2 / GE864-DUAL V2; you must ensure that your application can dissipate it.
6.2.3.
Power Supply PCB Layout Guidelines
As seen on the electrical design guidelines the power supply shall have a low ESR
capacitor on the output to cut the current peaks and a protection diode on the input
to protect the supply from spikes and polarity inversion. The placement of these
components is crucial for the correct working of the circuitry. A misplaced
component can be useless or can even decrease the power supply performances.
•
The Bypass low ESR capacitor must be placed close to the Telit GE864QUAD V2 / GE864-DUAL V2 power input pads or in the case the power
supply is a switching type it can be placed close to the inductor to cut the
ripple provided the PCB trace from the capacitor to the GE864-QUAD V2 /
GE864-DUAL V2 is wide enough to ensure a dropless connection even
during the 2A current peaks.
•
The protection diode must be placed close to the input connector where
the power source is drained.
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6.2.4.
•
The PCB traces from the input connector to the power regulator IC must
be wide enough to ensure no voltage drops occur when the 2A current
peaks are absorbed. Note that this is not made in order to save power
loss but especially to avoid the voltage drops on the power line at the
current peaks frequency of 216 Hz that will reflect on all the components
connected to that supply, introducing the noise floor at the burst base
frequency. For this reason while a voltage drop of 300-400 mV may be
acceptable from the power loss point of view, the same voltage drop may
not be acceptable from the noise point of view. If your application does not
have audio interface but only uses the data feature of the Telit GE864QUAD V2 / GE864-DUAL V2, then this noise is not so disturbing and power
supply layout design can be more forgiving.
•
The PCB traces to the GE864-QUAD V2 / GE864-DUAL V2 and the Bypass
capacitor must be wide enough to ensure no significant voltage drops
occur when the 2A current peaks are absorbed. This is for the same
reason as previous point. Try to keep this trace as short as possible.
•
The PCB traces connecting the Switching output to the inductor and the
switching diode must be kept as short as possible by placing the inductor
and the diode very close to the power switching IC (only for switching
power supply). This is done in order to reduce the radiated field (noise) at
the switching frequency (100-500 kHz usually).
•
The use of a good common ground plane is suggested.
•
The placement of the power supply on the board must be done in such a
way to guarantee that the high current return paths in the ground plane
are not overlapped to any noise sensitive circuitry as the microphone
amplifier/buffer or earphone amplifier.
•
The power supply input cables must be kept separate from noise sensitive
lines such as microphone/earphone cables.
Parameters for ATEX Applications
In order to integrate the Telit’s GE864-QUAD V2 / GE864-DUAL V2 module into an
ATEX application, the appropriate reference standard IEC EN xx and integrations
shall be followed.
Below are listed parameters and useful information to integrate the module in your
application:
•
Total capacity: 27.45 uF
•
Total inductance: 55.20 nH
•
No voltage upper than supply voltage is present in the module.
•
No step-up converters are present in the module.
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•
In abnormal conditions, the maximum RF output power may be up to 34
dBm.
For this particular application, we recommend the customer to involve TTSC (Telit
Technical Support Center) in the design phase of the application.
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7.
Antenna
The antenna connection and board layout design are the most important part in the
full product design and they strongly reflect on the product overall performances,
hence read carefully and follow the requirements and the guidelines for a proper
design.
7.1.
GSM Antenna Requirements
As suggested on the Product Description the antenna for a Telit GE864-QUAD V2 /
GE864-DUAL V2 device shall fulfill the following requirements:
ANTENNA REQUIREMENTS
Frequency range
Bandwidth
for GE864
GE 864864- QUAD V2
Bandwidth
for GE8
GE 8 6464- DUAL V2
Gain
Impedance
Input power
VSWR absolute max
VSWR recommended
Depending by frequency band(s) provided by the network operator,
the customer shall use the most suitable antenna for that/those
band(s)
70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in DCS and 140
MHz PCS band
80 MHz in GSM900 and 170 MHz in DCS
Gain < 1,4dBi in GSM 850 & 900
and < 3,0dBi DCS & PCS
50 •
> 2 W peak power
<= 10:1
<= 2:1
Furthermore if the device is developed for the US market and/or Canada market, it
shall comply to the FCC and/or IC approval requirements:
This device is to be used only for mobile and fixed application. The antenna(s) used
for this transmitter must be installed to provide a separation distance of at least 20
cm from all persons and must not be co-located or operating in conjunction with any
other antenna or transmitter. End-Users must be provided with transmitter
operation conditions for satisfying RF exposure compliance. OEM integrators must
ensure that the end user has no manual instructions to remove or install the GE864QUAD V2 / GE864-DUAL V2 module. Antennas used for this OEM module must not
exceed 3dBi gain for mobile and fixed operating configurations.
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7.2.
GSM Antenna – Installation Guidelines
•
Install the antenna in a place covered by the GSM signal.
•
The Antenna must be installed to provide a separation distance of at least
20 cm from all persons and must not be co-located or operating in
conjunction with any other antenna or transmitter;
•
Antenna shall not be installed inside metal cases
•
Antenna shall be installed also according Antenna manufacturer
instructions.
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8.
Logic Level Specifications
Where not specifically stated, all the interface circuits work at 2.8V CMOS logic
levels. The following table shows the logic level specifications used in the Telit
GE864-QUAD V2 / GE864-DUAL V2 interface circuits:
Absolute Maximum Ratings
R atings – Not Functional
Parameter
Min
Max
Input level on any
-0.3V
digital pin when on
Input voltage on
-0.3V
analog pins when on
+3.1V
+3.0 V
Operating Range – Interface Levels
Levels (2.8V CMOS)
Level
Min
Max
Input high level
2.1V
3.1V
Input low level
Output high level
Output low level
0V
2.2V
0V
0.5V
3.0V
0.35V
For 1,8V signals:
Operating Range – Interface Levels (1.8V CMOS)
Level
Min
Max
Input high level
1.6V
2.2V
Input low level
Output high level
Output low level
0V
1,65V
0V
0.4V
2.2V
0.35V
Current characteristics
Level
Output Current
Typical
1mA
Input Current
1uA
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8.1.
Reset Signal
Signal
RESET
Function
Reset
I/O
Ball Number
A2
RESET is used to reset the GE864-QUAD V2 / GE864-DUAL V2 modules. Whenever
this signal is pulled low, the GE864-QUAD V2 / GE864-DUAL V2 is reset. When the
device is reset it stops any operation. After the release of the reset GE864-QUAD V2 /
GE864-DUAL V2 is unconditionally shut down, without doing any detach operation
from the network where it is registered. This behavior is not a proper shut down
because any GSM device is requested to issue a detach request on turn off. For this
reason the Reset signal must not be used to normally shutting down the device, but
only as an emergency exit in the rare case the device remains stuck waiting for some
network response.
The RESET is internally controlled on start-up to achieve always a proper power-on
reset sequence, so there is no need to control this pin on start-up. It may only be
used to reset a device already on that is not responding to any command.
NOTE:
Do not use this signal to power off the GE864-QUAD V2 / GE864-DUAL V2. Use the
ON/OFF signal to perform this function or the AT#SHDN command.
Reset Signal Operating Levels:
Signal
RESET Input high
RESET Input low
Min
2.0V*
0V
Max
2.2V
0.2V
* this signal is internally pulled up so the pin can be left floating if not used.
If unused, this signal may be left unconnected. If used, then it must always be
connected with an open collector transistor,
transistor to permit to the internal circuitry the
power on reset and under voltage lockout functions.
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9.
Serial Ports
The serial port on the Telit GE864-QUAD V2 / GE864-DUAL V2 is the core of the
interface between the module and OEM hardware.
2 serial ports are available on the module:
•
•
9.1.
MODEM SERIAL PORT
MODEM SERIAL PORT 2 (TRACE for debug)
MODEM SERIAL PORT
Several configurations can be designed for the serial port on the OEM hardware, but
the most common are:
•
RS232 PC com port
•
microcontroller UART @ 2.8V – 3V (Universal Asynchronous Receive
Transmit)
•
microcontroller UART@ 5V or other voltages different from 2.8V
Depending from the type of serial port on the OEM hardware a level translator circuit
may be needed to make the system work. The only configuration that does not need a
level translation is the 2.8V UART.
The serial port on the GE864-QUAD V2 / GE864-DUAL V2 is a +2.8V UART with all the
7 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is
reversed) and levels. The levels for the GE864-QUAD V2 / GE864-DUAL V2 UART are
the CMOS levels:
Absolute Maximum Ratings –Not
Not Functional
Parameter
Min
Input level on any
-0.3V
digital pad when on
Input voltage on
-0.3V
analog pads when on
Max
+3.1V
+3.0 V
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Operating Range – Interface levels (2.8V CMOS)
Level
Input high level VIH
Input low level VIL
Output high level VOH
Output low level VOL
Min
2.1V
0V
2.2V
0V
Max
3.1V
0.5V
3.0V
0.35V
The table below shows the signals of the GE864-QUAD V2 / GE864-DUAL V2 serial
port:
RS232 Pin
Number
Signal
Signal
DCD –
dcd_uart
RXD –
tx_uart
TXD –
rx_uart
DTR –
dtr_uart
GND
DSR –
dsr_uart
RTS –rts_uart
CTS – cts_uart
RI – ri_uart
GE864GE864 QUAD V2 /
GE864GE864 DUAL V2
Pad
Number
Name
D9
Data Carrier Detect
H8
Transmit line *see Note
E7
Receive line *see Note
B7
Data Terminal Ready
A1,F1, H1 L1,
H2, L2, J3,
K3….
Ground
E11
Data Set Ready
F7
Request to Send
F6
Clear to Send
B6
Ring Indicator
Usage
Output from the GE864-QUAD V2 / GE864-DUAL V2 that
indicates the carrier presence
Output transmit line of GE864-QUAD V2 / GE864-DUAL V2
UART
Input receive of the GE864-QUAD V2 / GE864-DUAL V2
UART
Input to the GE864-QUAD V2 / GE864-DUAL V2 that
controls the DTE READY condition
ground
Output from the GE864-QUAD V2 / GE864-DUAL V2 that
indicates the module is ready
Input to the GE864-QUAD V2 / GE864-DUAL V2 that
controls the Hardware flow control
Output from the GE864-QUAD V2 / GE864-DUAL V2 that
controls the Hardware flow control
Output from the GE864-QUAD V2 / GE864-DUAL V2 that
indicates the incoming call condition
* NOTE:
According to V.24, RX/TX signal names are referred to the application side, therefore
on the GE864-QUAD V2 / GE864-DUAL V2 side these signal are on the opposite
direction: TXD on the application side will be connected to the receive line (here
named TXD/ rx_uart ) of the GE864-QUAD V2 / GE864-DUAL V2 serial port and
viceversa for RX.
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TIP:
For a minimum implementation, only the TXD and RXD lines can be connected, the
other lines can be left open provided a software flow control is implemented.
9.2.
RS232 Level
Level T ranslation
In order to interface the Telit GE864-QUAD V2 / GE864-DUAL V2 with a PC com port
or a RS232 (EIA/TIA-232) application a level translator is required. This level
translator must
•
invert the electrical signal in both directions
•
change the level from 0/+3V to +15/-15V
Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with
lower levels on the RS232 side (EIA/TIA-562), allowing for a lower voltage-multiplying
ratio on the level translator. Note that the negative signal voltage must be less than
0V and hence some sort of level translation is always required.
The simplest way to translate the levels and invert the signal is by using a single chip
level translator. There are a multitude of them, differing in the number of driver and
receiver and in the levels (be sure to get a true RS232 level translator not a RS485 or
other standards).
By convention the driver is the level translator from the 0/+3V UART level to the
RS232 level, while the receiver is the translator from RS232 level to 0/+3V UART.
In order to translate the whole set of control lines of the UART you will need:
•
5 driver
•
3 receiver
NOTE:
The digital input lines working at 2.8VCMOS have an absolute maximum input voltage
of 3,1V; therefore the level translator IC shall not be powered by the +3.8V supply of
the module. Instead it shall be powered from a +2.8V / +3.0V (dedicated) power
supply.
This is because in this way the level translator IC outputs on the module side (i.e.
GE864-QUAD V2 / GE864-DUAL V2 inputs) will work at +3.8V interface levels,
stressing the module inputs at its maximum input voltage.
This can be acceptable for evaluation purposes, but not on production devices.
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NOTE:
In order to be able to do in circuit reprogramming of the GE864-QUAD V2 / GE864DUAL V2 firmware, the serial port on the Telit GE864-QUAD V2 / GE864-DUAL V2
shall be available for translation into RS232 and either it is controlling device shall be
placed into tristate, disconnected or as a gateway for the serial data when module
reprogramming occurs.
Only RXD, TXD, GND, SERVICE and the On/off module turn on pad are required to the
reprogramming of the module, the other lines are unused.
All applicator shall include in their design such a way of reprogramming the GE864QUAD V2 / GE864-DUAL V2.
An example of level translation circuitry of this kind is:
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The RS232 serial port lines are usually connected to a DB9 connector with the
following layout:
9.3.
5V UART Level Translation
If the OEM application uses a microcontroller with a serial port (UART) that works at
a voltage different from 2.8 – 3V, then a circuitry has to be provided to adapt the
different levels of the two set of signals. As for the RS232 translation there are a
multitude of single chip translators. For example a possible translator circuit for a 5V
TRANSMITTER/RECEIVER can be:
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TIP:
Note that the TC7SZ07AE has open drain output; therefore the resistor R2 is
mandatory.
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NOTE:
The UART input line TXD (rx_uart) of the GE864-QUAD V2 / GE864-DUAL V2 is NOT
internally pulled up with a resistor, so there may be the need to place an external
47KΩ pull-up resistor, either the DTR (dtr_uart) and RTS (rts_uart) input lines are
not pulled up internally, so an external pull-up resistor of 47KΩ may be required.
Care must be taken to avoid latch-up on the GE864-QUAD V2 / GE864-DUAL V2 and
the use of this output line to power electronic devices shall be avoided, especially for
devices that generate spikes and noise such as switching level translators, micro
controllers, failure in any of these condition can severely compromise the GE864QUAD V2 / GE864-DUAL V2 functionality.
NOTE:
In case of reprogramming of the module has to be considered the use of the RESET
line to start correctly the activity.
The preferable configuration is having an external supply for the buffer level
translator.
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10. Audio Section Overview
The first Baseband chip was developed for the cellular phones, which needed two
separated amplifiers both in RX and in TX section.
A couple of amplifiers had to be used with internal audio transducers while the other
couple of amplifiers had to be used with external audio transducers.
To distinguish the schematic signals and the Software identifiers, two different
definitions were introduced, with the following meaning:
•
internal audio transducers 
 HS/MT
(from H andS
Set or M icroT
Telephone )
HS
•
external audio transducers 
 HF
(from H andsF
F ree )
Actually the acronyms have not the original importance.
In other words this distinction is not necessary, being the performances between the
two blocks like the same.
Only if the customer needs higher output power to drive the speaker, he needs to
adopt the Aduio2 Section ( HF ) . Otherwise the choice could be done in order to
overcome the PCB design difficulties.
For these reasons we have not changed the HS and HF acronyms, keeping them in
the Software and on the schematics.
The Base Band Chip of the GE864-QUAD V2 / GE864-DUAL V2 Telit Modules
maintains the same architecture.
For more information and suggestions refer to Telit document:
•
10.1.
Audio settings application note , 80000NT10007a
Selection mode
Only one block can be active at a time, and the activation of the requested audio
path is done via hardware ,by AXE line, or via software ,by AT#CAP command .
Moreover the Sidetone functionality could be implemented by the amplifier fitted
between the transmit path and the receive path, enabled at request in both modes.
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Balanced
Ear MT+
Single ended
EP P1
HS
Earpiece
16
Fully Differential
Audio Amplifier
Ear MTEP N1
Bias
Mic MT+
100nF
Balanced
AUDIO 1
SECTION
MIC P1
HS
Microphone
Mic MTMIC N1
Single ended
100nF
Balanced
Baseband
Audio Front End
Ear HF+
HF
Speaker
Single ended
LOUD1
Fully Differential
Audio Amplifier
Ear HFLOUD2
AUDIO 2
SECTION
Bias
Mic HF+
MICP2
100nF
Balanced
Single ended
HF
Microphone
Mic HF-
MICN2
100nF
xgaffull.skd
GE864GE864 -QUAD V2 / GE864GE864 -DUAL V2 Audio Front End Block Diagram
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10.2.
Electrical Characteristics
TIP: Being the microphone circuitry the more noise sensitive, its design and layout
must be done with particular care. Both microphone paths are balanced and the OEM
circuitry must be balanced designed to reduce the common mode noise typically
generated on the ground plane. However the customer can use the unbalanced
circuitry for its particular application.
10.2.1.
Input Lines Characteristics
“MIC_MT” and “MIC_HF” differential microphone paths
Line Coupling
Line Type
Differential input voltage
AC*
Balanced
≤ 1,03Vpp @ Mic G=0dB
Gain steps
Gain increment
6dB per step
≥ 100nF
Coupling capacitor
Differential input resistance 50KΩ
Input capacitance
• 10pF
(*) WARNING : AC means that the signals from the microphone have to be
connected to input lines of the module through capacitors which value has to
be ≥ 100nF. Not respecting this constraint, the input stages will be damaged.
WARNING: when particular OEM application needs a Single Ended Input
configuration, it is forbidden connecting the unused input directly to Ground,
but only through a 100nF capacitor. Don’t forget that the useful input signal will be
halved in Single Ended Input configuration.
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10.2.2.
Output Lines Characteristics
TIP:
TIP
We suggest driving the load differentially from both output drivers, thus the output
swing will double and the need for the output coupling capacitor avoided. However if
particular OEM application needs also a Single Ended circuitry can be implemented,
but the output power will be reduced four times .
The OEM circuitry shall be designed to reduce the common mode noise typically
generated on the ground plane and to get the maximum power output from the
device (low resistance tracks).
WARNING:
The loads are directly connected to the amplifier outputs when in Differential
configuration, through a capacitor when in Single Ended configuration.
Using a Single Ended configuration, the unused output line must be left open .
Not respecting this constraint, the output stage will be damaged.
TIP :
Remember that there are slightly different electrical performances between the two
internal audio amplifiers:
• the “Ear_MT
Ear_MT”
Ear_MT lines can directly drive a 16 Ω load at –12dBFS (**) in
Differential configuration
• the “Ear_HF”
Ear_HF lines can directly drive a 4 Ω load in Differential configurations
• There is no difference if the amplifiers drive an external amplifier
(**) 0dBFS is the normalized overall Analog Gain for each Output channel equal to
3,7Vpp differential
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“EAR_MT
EAR_MT”
EAR_MT Output Lines
line coupling
0dBFS normalized gain
AC single-ended
DC differential
3,7 Vpp differential
output load resistance
≥ 16 Ω @ -12dBFS
internal output resistance
4Ω (typical)
signal bandwidth
150 - 4000 Hz @ -3 dB
maximal full scale
differential output voltage
differential output voltage
3,7 Vpp (typical)
Rload=open circuit
925mVpp / Rload=16Ω
@ -12dBFS
volume increment
2 dB per step
volume steps
10
“EAR_HF
EAR_HF”
EAR_HF Output Lines
line coupling
output load resistance
AC single-ended
DC differential
≥8Ω
signal bandwidth
150 - 4000 Hz @ -3 dB
maximal output power
@ battery voltage ≥ 3,6V
volume increment
0.35 Wrms /8 Ω
volume steps
10
2 dB per step
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11. General Purpose I/O
The general-purpose I/O pads can be configured to act in three different ways:
•
Input
•
Output
•
Alternate function (internally controlled)
Input pads can only be read and report the digital value (high or low) present on the
pad at the read time; output pads can only be written or queried and set the value of
the pad output; an alternate function pad is internally controlled by the GE864-QUAD
V2 / GE864-DUAL V2 firmware and acts depending on the function implemented.
The following GPIO are available on the GE864-QUAD V2 / GE864-DUAL V2:
Ball
Signal
I/O
Function
Type
Input / output
current
Default
state
ON_OFF
state
During
Reset
state
C1
TGPIO_01
I/O
GPIO01
Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
E6
TGPIO_02 /
JDR
I/O
GPIO02
Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
C2
TGPIO_03
I/O
GPIO03
Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
B3
TGPIO_04 /
TXCNTRL
I/O
GPIO04
Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
K8
TGPIO_05 /
RFTXMON
I/O
GPIO05
Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
B5
TGPIO_06 /
ALARM
I/O
GPIO06
Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
L9
TGPIO_07 /
BUZZER
I/O
GPIO07
Configurable GPIO
CMOS 2.8V
1uA / 1mA
INPUT
K11
TGPIO_08
I/O
CMOS 2.8V
1uA / 1mA
INPUT
C9
TGPIO_09
I/O
CMOS 2.8V
1uA / 1mA
INPUT
H3
TGPIO_10 /
DVI_TX
I/O
CMOS 2.8V
1uA / 1mA
INPUT
GPIO08
Configurable GPIO
GPIO09
Configurable GPIO
GPIO10
Configurable GPIO
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Note
Alternate
function
(JDR)
Alternate
function (RF
Transmission
Control)
Alternate
function
(RFTXMON)
Alternate
function
(ALARM)
Alternate
function
(BUZZER)
Alternate
function
(DVI_TX)
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Not all GPIO pads support all these three modes:
11.1.
•
GPIO2 supports all three modes and can be input, output, Jamming Detect
Output (Alternate function)
•
GPIO4 supports all three modes and can be input, output, RF
Transmission Control (Alternate function)
•
GPIO5 supports all three modes and can be input, output, RFTX monitor
output (Alternate function)
•
GPIO6 supports all three modes and can be input, output, alarm output
(Alternate function)
•
GPIO7 supports all three modes and can be input, output, buzzer output
(Alternate function)
GPIO Logic Levels
Where not specifically stated, all the interface circuits work at 2.8V CMOS logic
levels.
The following tables show the logic level specifications used in the GE864-QUAD V2 /
GE864-DUAL V2 interface circuits:
Absolute Maximum Ratings –Not
Not Functional
Parameter
Min
Input level on any
-0.3V
digital pin when on
Input voltage on
-0.3V
analog pins when on
Max
+3.1V
+3.0 V
Operating Range – Interface Levels
Levels (2.8V CMOS)
Level
Min
Max
Input high level
2.1V
3.1V
Input low level
Output high level
Output low level
0V
2.2V
0V
0.5V
3.0V
0.35V
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11.2.
Using a GPIO Pad as INPUT
The GPIO pads, when used as inputs, can be connected to a digital output of another
device and report its status, provided this device has interface levels compatible with
the 2.8V CMOS levels of the GPIO.
If the digital output of the device to be connected with the GPIO input pad has
interface levels different from the 2.8V CMOS, then it can be buffered with an open
collector transistor with a 47K pull up to 2.8V, this pull up must be switched off when
the module is in off condition.
11.3.
Using a GPIO Pad as OUTPUT
The GPIO pads, when used as outputs, can drive 2.8V CMOS digital devices or
compatible hardware. When set as outputs, the pads have a push-pull output and
therefore the pull-up resistor may be omitted.
The illustration below shows the base circuit of a push-pull stage:
VDD
Q1
GPIO7
Q2
11.4.
Using the RF Transmission Control GPIO4
The GPIO4 pin, when configured as RF Transmission Control Input, permits to disable
the Transmitter when the GPIO is set to Low by the application.
In the design is necessary to add a resistor 47K pull up to 2.8V, this pull up must be
switched off when the module is in off condition.
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11.5.
Using the RFTXMON Output GPIO5
The GPIO5 pin, when configured as RFTXMON Output, is controlled by the module and
will rise when the transmitter is active and fall after the transmitter activity is
completed.
For example, if a call is started, the line will be HIGH during all the conversation and it
will be again LOW after hanged up.
The line rises up 300ms before first TX burst and will became again LOW from 500ms to
1sec after last TX burst.
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Using the Alarm Output GPIO6
The GPIO6 pad, when configured as Alarm Output, is controlled by the module and
will rise when the alarm starts and fall after the issue of a dedicated AT command.
This output can be used to power up the module controlling micro controller or
application at the alarm time, giving you the possibility to program a timely system
wake-up to achieve some periodic actions and completely turn off either the
application and the module during sleep periods, dramatically reducing the sleep
consumption to few µA.
In battery-powered devices this feature will greatly improve the autonomy of the
device.
NOTE:
During RESET the line is set to HIGH logic level.
11.6.
Using the Buzzer Output GPIO7
As Alternate Function, the GPIO7 is controlled by the firmware that depends on the
function implemented internally.
This setup places always the GPIO7 pin in OUTPUT direction and the corresponding
function must be activated properly by AT#SRP command (refer to AT commands
specification).
Also in this case, the dummy value for the pin state can be both “0” or “1”.
•
•
•
Send the command
Wait for response
Send the command
AT#GPIO=7, 1, 2:
OK
AT#SRP=3
The GPIO7 pin will be set as Alternate Function pin with its dummy logic status set to
HIGH value.
The “Alternate Function” permits your application to easily implement Buzzer
feature with some small hardware extension of your application as shown in the
sample figure below.
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TR2
SMBT2907A
+V buzzer
R1
4,7K
D1
D1N4148
C1
33pF
R2
1K
GPIO7
TR1
BCR141W
Example of Buzzer’s driving circuit
NOTE:
To correctly drive a buzzer, a driver must be provided; its characteristics depend on
the Buzzer and for them refer to your buzzer vendor.
11.7.
Magnetic Buzzer Concepts
11.7.1.
Short Description
A magnetic Buzzer is a sound-generating device with a coil located in the magnetic
circuit consisting of a permanent magnet, an iron core, a high permeable metal disk,
and a vibrating diaphragm.
Drawing of the Magnetic Buzzer
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The disk and diaphragm are attracted to the core by the magnetic field. When an
oscillating signal is moved through the coil, it produces a fluctuating magnetic field,
which vibrates the diaphragm at a frequency of the drive signal. Thus the sound is
produced relative to the frequency applied.
Diaphragm movement
1.1.1 Frequency Behavior
The frequency behavior represents the effectiveness of the reproduction of the
applied signals.
Because its performance is related to a square driving waveform (whose amplitude
varies from 0V to Vpp), if you modify the waveform (e.g. from square to sinus) the
frequency response will change.
11.7.2.
Power Supply Influence
Applying a signal whose amplitude is different from that suggested by manufacturer,
the performance change following the rule:
if resonance frequency f o increases, amplitude decreases.
Because of resonance frequency depends from acoustic design, lowering the
amplitude of the driving signal the response bandwidth tends to become narrow, and
vice versa.
Summarizing:
Vpp ↑ 
 f o ↓
Vpp ↓ 
 f o ↑
The risk is that the f o could easily fall outside of new bandwidth; consequently the
SPL could be much lower than the expected.
11.7.3.
Warning
It is very important to respect the sense of the applied voltage: never apply to the “-“
pin a voltage more positive than the “+” pin. If this happens, the diaphragm vibrates
in the opposite sense with a high probability to be expelled from its physical position,
damaging the device forever.
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11.7.4.
Working Current Influence
In the component data sheet you will find the value of MAX CURRENT that represents
the maximum average current that can flow at nominal voltage without current
limitation.
In other words it is not the peak current, which could be twice or three times higher.
If driving circuitry does not support these peak values, the SPL will never reach the
declared level or the oscillations will stop.
11.8.
Using the Temperature Monitor Function
11.8.1.
Short Description
The Temperature Monitor is a function of the module that permits to control its
internal temperature and if properly set (see the #TEMPMON command on AT
Interface guide) it raise to High Logic level a GPIO when the maximum temperature
is reached.
11.8.2.
Allowed GPIO
The AT#TEMPMON set command could be used with one of the following GPIO:
Signal
Function
Type
TGPIO_01
GPIO01 Configurable GPIO
CMOS 2.8V
Input /
output
current
1µA / 1mA
TGPIO_03
GPIO03 Configurable GPIO
CMOS 2.8V
1µA / 1mA
TGPIO_08
GPIO08 Configurable GPIO
CMOS 2.8V
1µA / 1mA
TGPIO_09
GPIO09 Configurable GPIO
CMOS 2.8V
1µA / 1mA
TGPIO_10
GPIO10 Configurable GPIO
CMOS 2.8V
1µA / 1mA
Note
The set command could be used also with one of the following GPIO but in that case
the alternate function is not usable:
Signal
Function
Type
TGPIO_02
GPIO02 Configurable GPIO
CMOS 2.8V
Input /
output
current
1µA / 1mA
TGPIO_04
GPIO04 Configurable GPIO
CMOS 2.8V
1µA / 1mA
TGPIO_05
GPIO05 Configurable GPIO
CMOS 2.8V
1µA / 1mA
Alternate function (JDR)
Alternate function (RF
Transmission Control)
Alternate function (RFTXMON)
TGPIO_07
GPIO07 Configurable GPIO
CMOS 2.8V
1µA / 1mA
Alternate function (BUZZER)
Note
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11.9.
Indication of Network Service Availability
The STAT_LED pin status shows information on the network service availability and Call
status.
In the GE864-QUAD V2 / GE864-DUAL V2 modules, the STAT_LED usually needs an external
transistor to drive an external LED.
Therefore, the status indicated in the following table is reversed with respect to the pin
status.
LED status
status
Device Status
Permanently off
Fast blinking
(Period 1s, Ton 0,5s)
Slow blinking
(Period 3s, Ton 0,3s)
Permanently on
Device off
Net search / Not registered /
turning off
Registered full service
a call is active
A schematic example could be:
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11.10.
RTC Bypass Out
The VRTC pin brings out the Real Time Clock supply, which is separate from the rest
of the digital part, allowing having only RTC going on when all the other parts of the
device are off.
To this power output a backup capacitor can be added in order to increase the RTC
autonomy during power off of the battery. NO Devices must be powered from this pin.
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11.11.
DAC Converter
11.11.1.
Description
Ball
Signal
Internal
Pull up
I/O Function
Type
DAC Converter
C7
DAC_OUT
AO
Digital/Analog converter output
D/A
The GE864-QUAD V2 / GE864-DUAL V2 module provides one Digital to Analog
Converter.
The on board DAC is a 10-bit converter, able to generate a analogue value based a
specific input in the range from 0 up to 1023. However, an external low-pass filter is
necessary.
Voltage range (filtered)
Range
Min
Max
2,6
1023
Units
Volt
Steps
The precision is 10 bits, so if we consider that the maximum voltage is 2V, the
integrated voltage could be calculated with the following formula:
Integrated output voltage
voltage = 2 * value / 1023
DAC_OUT line must be integrated (for example with a low band pass filter) in order to
obtain an analog voltage.
11.11.2.
Enabling DAC
The AT command below is available to use the DAC function:
AT#DAC[=[,]]
 – scale factor of the integrated output voltage (0–1023, with 10 bit precision),
and it must be present if =1.
=1
Refer to SW User Guide or AT Commands Reference Guide for the full description of
this function.
Refer to SW User Guide or AT Commands Reference Guide for the full description of
this function.
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NOTE:
The DAC frequency is selected internally. D/A converter must not be used during
POWERSAVING.
11.11.3.
Low Pass Filter Example
11.12.
ADC Converter
11.12.1.
Description
Ball
Signal
Internal
Pull up
I/O Function
Type
ADC Converters
Converters
J11
ADC_IN1
AI
Analog/Digital converter input
A/D
H11
ADC_IN2
AI
Analog/Digital converter input
A/D
The GE864-QUAD V2 / GE864-DUAL V2 module provides three Analog to Digital
Converter.
The on board A/D are 11-bit converter. They are able to read a voltage level in the
range of 0÷2 volts applied on the ADC pin input, store and convert it into 11 bit word.
Input Voltage range
AD conversion
Resolution
Min
Max
11
<1
Units
Volt
bits
mV
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11.12.2.
Using ADC Converter
The AT command below is available to use the ADC function:
AT#ADC=1,2
The read value is expressed in mV.
Refer to SW User Guide or AT Commands Reference Guide for the full description of
this function.
11.13.
Debug of the GE864GE864-QUAD V2 / GE864GE864-DUAL V2 in
Production
To test and debug the mounting of the GE864-QUAD V2 / GE864-DUAL, we strongly
recommend to foreseen test pads on the host PCB, in order to check the connection
between the GE864-QUAD V2 / GE864-DUAL V2 itself and the application and to test
the performance of the module connecting it with an external computer. Depending
by the customer application, these pads include, but are not limited to the following
signals:
Ball
Signal
Function
J1 , J2
J2, K1, K2
VBATT
Main power supply
A1, A11, D6, F1, F11,
H1, H2, J3, K3, K4,
GND
K5, K6, L1, L2, L3,
L6, L11
Ground
E7
C103/TXD
Serial data input (TXD) from DTE
H8
C104/RXD
Serial data output (RXD) to DTE
L8
PRWMON
Power ON Monitor
J5
ON/OFF*
Input command for switching power ON or OFF (toggle command).
A2
RESET*
Reset input
F10
RX_TRACE
RX Data for debug monitor
D11
TX_TRACE
TX Data for debug monitor
H4
SERVICE
SERVICE connection
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12. Assembly the GE864-QUAD V2 / GE864-DUAL V2 on the
Board
The Telit GE864-QUAD V2 / GE864-DUAL V2 have been designed in order to be
compliant with the standard lead-free SMT process.
Pin A1
LeadLead -free Alloy:
Surface finishing Sn/Ag/Cu for all solder pads
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12.1.
Recommended foot print for the application
In order to easily rework the GE864-QUAD V2 / GE864-DUAL V2 module is suggested
to consider on the application a 1.5mm inhibit area around the module.
It is also suggested, as common rule for a SMT component, to avoid having a
mechanical part of the application in direct contact with the module.
12.2.
Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we
suggest a thickness of stencil foil >120µm.
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12.3.
PCB pad design
Non solder mask defined” (NSMD) type is recommended for the solder pads on the
PCB.
Recommendations for PCB pad dimensions
Ball pitch [mm]
Solder resist opening diameter A [mm]
Metal pad diameter B [mm]
2,4
1,150
1 ± 0.05
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It is recommended no microvia without solder resist cover under the module and no
microvia around the pads (see following figure).
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
Electro-less Ni
/ Immersion Au
Layer thickness [µm]
3 –7 /
0.05 – 0.15
Properties
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the
lead-free process. This issue should be discussed with the PCB-supplier. Generally,
the wettability of tin-lead solder paste on the described surface plating is better
compared to lead-free solder paste.
12.4.
Solder paste
Solder paste
Lead free
Sn/Ag/Cu
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12.4.1.
GE865 Solder reflow
The following is the recommended solder reflow profile
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
Tsmax to TL
– Ramp-up Rate
Time maintained above:
– Temperature (TL)
– Time (tL)
Peak Temperature (Tp)
Time within 5°C of actual Peak
Temperature (tp)
Ramp-down Rate
Time 25°C to Peak Temperature
PbPb - Free Assembly
3°C/second max
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
245 +0/-5°C
10-30 seconds
6°C/second max.
8 minutes max.
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NOTE:
All temperatures refer to topside of the package, measured on the package body
surface
WARNING:
WARNING :
The GE865 module withstands one reflow process only.
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13.
Packing system
The GE864-QUAD V2 / GE864-DUAL V2 are packaged on trays of 20 pieces each. This
is especially suitable for the GE864-QUAD V2 / GE864-DUAL V2 according to SMT
processes for pick & place movement requirements.
Section A-A
The size of the tray is: 329 x 176mm.
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WARNING:
These trays can withstand at the maximum temperature of 65° C.
NOTE:
All temperatures refer to topside of the package, measured on the package body
surface
13.1.
Moisture sensibility
The level of moisture sensibility of GE864-QUAD V2 / GE864-DUAL V2 is “3”, in
according with standard IPC/JEDEC J-STD-020, take care all the relatives
requirements for using this kind of components.
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14. Conformity Assessment Issues
The Telit GE864-QUAD V2 has been assessed in order to satisfy the
essential requirements of the R&TTE Directive 1999/05/EC (Radio
Equipment & Telecommunications Terminal Equipments) to
demonstrate the conformity against the harmonized standards with
the final involvement of a Notified Body.
If the module is installed in conformance to the Telit installation manuals, no further
evaluation under Article 3.2 of the R&TTE Directive and do not require further involvement
of a R&TTE Directive Notified Body for the final product.
In all other cases, or if the manufacturer of the final product is in doubt, then the
equipment integrating the radio module must be assessed against Article 3.2 of the
R&TTE Directive.
In all cases the assessment of the final product must be made against the Essential
requirements of the R&TTE Directive Articles 3.1(a) and (b),
(b) Safety and EMC respectively,
and any relevant Article 3.3 requirements.
This Hardware User Guide contains all the information you may need for developing a
product meeting the R&TTE Directive.
Furthermore the GE864-QUAD V2 module is FCC Approved as module to be installed in
other devices. This device is to be used only for fixed and mobile applications. If the final
product after integration is intended for portable use, a new application and FCC is
required.
The GE864-QUAD V2 is conforming to the following US Directives:
• Use of RF Spectrum. Standards: FCC 47 Part 24 (GSM 1900)
• EMC (Electromagnetic Compatibility). Standards: FCC47 Part 15
This device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may
cause undesired operation.
To meet the FCC's RF exposure rules and regulations:
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• The system antenna(s) used for this transmitter must be installed to provide a separation
distance of at least 20 cm from all the persons and must not be co-located or operating in
conjunction with any other antenna or transmitter.
• The system antenna(s) used for this module must not exceed 1.4dBi (850MHz) and 3.0dBi
(1900MHz) for mobile and fixed or mobile operating configurations.
• Users and installers must be provided with antenna installation instructions and
transmitter operating conditions for satisfying RF exposure compliance.
Manufacturers of mobile, fixed or portable devices incorporating this module are advised to
clarify any regulatory questions and to have their complete product tested and approved for
FCC compliance.
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15. SAFETY RECOMMENDATIONS
NOTE:
Read this section carefully to ensure the safe operation.
Be sure the use of this product is allowed in the country and in the environment
required. The use of this product may be dangerous and has to be avoided in the
following areas:
•
Where it can interfere with other electronic devices in environments such
as hospitals, airports, aircrafts, etc
•
Where there is risk of explosion such as gasoline stations, oil refineries,
etc
It is responsibility of the user to enforce the country regulation and the specific
environment regulation.
Do not disassemble the product; any mark of tampering will compromise the
warranty validity.
We recommend following the instructions of the hardware user guides for a correct
wiring of the product. The product has to be supplied with a stabilized voltage source
and the wiring has to be conforming to the security and fire prevention regulations.
The product has to be handled with care, avoiding any contact with the pins because
electrostatic discharges may damage the product itself. Same cautions have to be
taken for the SIM, checking carefully the instruction for its use. Do not insert or
remove the SIM when the product is in power saving mode.
The system integrator is responsible of the functioning of the final product;
therefore, care has to be taken to the external components of the module, as well as
of any project or installation issue, because the risk of disturbing the GSM network or
external devices or having impact on the security. Should there be any doubt, please
refer to the technical documentation and the regulations in force.
Every module has to be equipped with a proper antenna with specific characteristics.
The antenna has to be installed with care in order to avoid any interference with
other electronic devices and has to guarantee a minimum distance from the body (20
cm). In case of this requirement cannot be satisfied, the system integrator has to
assess the final product against the SAR regulation EN 50360.
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The European Community provides some Directives for the electronic equipments
introduced on the market. All the relevant information are available on the European
Community website:
http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm
The text of the Directive 99/05 regarding telecommunication equipments is available,
while the applicable Directives (Low Voltage and EMC) are available at:
http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm
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