Telit Communications S p A HE910 WWAN Module User Manual HE910 Hardware User Guide

Telit Communications S.p.A. WWAN Module HE910 Hardware User Guide

User Manual

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Document ID1654383
Application ID5HkmE9zT1dNqHaMilSVs/Q==
Document DescriptionUser Manual
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Date Submitted2012-03-13 00:00:00
Creation Date2012-02-08 17:44:11
Producing SoftwareMicrosoft® Office Word 2007
Document Lastmod2012-02-08 17:44:11
Document TitleHE910 Hardware User Guide
Document CreatorMicrosoft® Office Word 2007
Document Author: F D

HE910 Hardware User Guide
1vv03700925 Rev.9
07-02-2012
HE910 Hardware User Guide
1vv0300925 Rev.9 – 07-02-2012
Applicability Table
PRODUCT
HE910
HE910-GA
HE910-D
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 2 of 80
HE910 Hardware User Guide
1vv0300925 Rev.9 – 07-02-2012
DISCLAIMER
The information contained in this document is the proprietary information of Telit
Communication
any disclosure to persons other than the officers, employees, agents or subcontractors
of the owner or licensee of this document, without the prior written consent of Telit, is
strictly prohibited.
Telit makes every effort to ensure the quality of the information it makes available.
Notwithstanding the foregoing, Telit does not make any warranty as to the information
contained herein, and does not accept any liability for any injury, loss or damage of any
kind incurred by use of or reliance upon the information.
Telit disclaims any and all responsibility for the application of the devices characterized
in this document, and notes that the application of the device must comply with the
safety standards of the applicable country, and where applicable, with the relevant
wiring rules.
Telit reserves the right to make modifications, additions and deletions to this document
due to typographical errors, inaccurate information, or improvements to programs
and/or equipment at any time and without notice. Such changes will, nevertheless be
incorporated into new editions of this application note.
All rights reserved.
© 2011, 2012 Telit Communications S.p.A.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 3 of 80
HE910 Hardware User Guide
1vv0300925 Rev.9 – 07-02-2012
Contents
INTRODUCTION ......................................................................................................................................................... 6
1.1 SCOPE ................................................................................................................................................................................ 6
1.2 AUDIENCE ........................................................................................................................................................................... 6
1.3 CONTACT INFORMATION, SUPPORT .......................................................................................................................................... 6
1.4 DOCUMENT ORGANIZATION ................................................................................................................................................... 7
1.5 TEXT CONVENTIONS .............................................................................................................................................................. 8
1.6 RELATED DOCUMENTS........................................................................................................................................................... 8
1.7 DOCUMENT HISTORY ............................................................................................................................................................ 9
OVERVIEW .............................................................................................................................................................. 10
HE910 MODULE CONNECTIONS ............................................................................................................................... 11
3.1 PIN-OUT ......................................................................................................................................................................... 11
3.1.1 LGA Pads Layout (HE910 and HE910-GA) .............................................................................................................. 17
3.1.2 LGA Pads Layout (HE910-D) ................................................................................................................................... 18
HARDWARE COMMANDS ........................................................................................................................................ 19
4.1 TURNING ON THE HE910 ................................................................................................................................................... 19
4.2 TURNING OFF THE HE910 .................................................................................................................................................. 24
4.3 HE910 UNCONDITIONAL SHUTDOWN .................................................................................................................................... 27
POWER SUPPLY ....................................................................................................................................................... 30
5.1 POWER SUPPLY REQUIREMENTS ............................................................................................................................................ 30
5.2 POWER CONSUMPTION ....................................................................................................................................................... 31
5.3 GENERAL DESIGN RULES ...................................................................................................................................................... 32
5.3.1 Electrical Design Guidelines ................................................................................................................................... 32
5.3.2 Thermal Design Guidelines ..................................................................................................................................... 36
5.3.3 Power Supply PCB layout Guidelines ...................................................................................................................... 37
GSM/WCDMA ANTENNA......................................................................................................................................... 38
6.1 GSM/WCDMA ANTENNA REQUIREMENTS ............................................................................................................................ 38
6.2 GSM/WCDMA - PCB LINE GUIDELINES ................................................................................................................................ 40
6.3 GSM/WCDMA ANTENNA - INSTALLATION GUIDELINES ........................................................................................................... 41
6.4 ANTENNA DIVERSITY REQUIREMENTS ..................................................................................................................................... 42
6.5 GPS ANTENNA REQUIREMENTS (HE910 AND HE910-GA) ....................................................................................................... 43
6.5.1 Combined GPS Antenna ......................................................................................................................................... 43
6.5.2 Linear and Patch GPS Antenna ............................................................................................................................... 43
6.5.3 LNA and Front End Design Considerations ............................................................................................................. 43
6.5.4 GPS Antenna - PCB Line Guidelines ........................................................................................................................ 44
6.5.5 GPS Antenna - Installation Guidelines .................................................................................................................... 45
LOGIC LEVEL SPECIFICATIONS .................................................................................................................................. 46
7.1 RESET SIGNAL .................................................................................................................................................................... 47
USB PORT ................................................................................................................................................................ 48
8.1 USB 2.0 HS ...................................................................................................................................................................... 48
SPI PORT ................................................................................................................................................................. 49
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HE910 Hardware User Guide
1vv0300925 Rev.9 – 07-02-2012
9.1 SPI CONNECTIONS .............................................................................................................................................................. 50
10
SERIAL PORTS .......................................................................................................................................................... 51
10.1 MODEM SERIAL PORT 1 (USIF0) ................................................................................................................................... 52
10.2 MODEM SERIAL PORT 2 (USIF1) ................................................................................................................................... 54
10.3 RS232 LEVEL TRANSLATION................................................................................................................................................ 55
11
AUDIO SECTION OVERVIEW .................................................................................................................................... 57
11.1 ELECTRICAL CHARACTERISTICS ............................................................................................................................................. 57
11.1.1 CODEC Examples .................................................................................................................................................. 57
12
GENERAL PURPOSE I/O ........................................................................................................................................... 58
12.1 GPIO LOGIC LEVELS .......................................................................................................................................................... 59
12.2 USING A GPIO PAD AS INPUT ........................................................................................................................................... 60
12.3 USING A GPIO PAD AS OUTPUT ........................................................................................................................................ 60
12.4 INDICATION OF NETWORK SERVICE AVAILABILITY ..................................................................................................................... 61
12.5 RTC BYPASS OUT ............................................................................................................................................................. 62
12.6 EXTERNAL SIM HOLDER IMPLEMENTATION ........................................................................................................................... 62
12.7 VAUX POWER OUTPUT..................................................................................................................................................... 62
13
MOUNTING THE HE910 ON THE APPLICATION ........................................................................................................ 63
13.1 GENERAL ........................................................................................................................................................................ 63
13.2 MODULE FINISHING & DIMENSIONS ..................................................................................................................................... 63
13.3 RECOMMENDED FOOT PRINT FOR THE APPLICATION ................................................................................................................. 64
13.4 STENCIL .......................................................................................................................................................................... 65
13.5 PCB PAD DESIGN .............................................................................................................................................................. 65
13.6 RECOMMENDATIONS FOR PCB PAD DIMENSIONS (MM): .......................................................................................................... 66
13.7 SOLDER PASTE .................................................................................................................................................................. 68
13.7.1 HE910 Solder reflow ............................................................................................................................................. 68
14
PACKING SYSTEM .................................................................................................................................................... 70
14.1 MOISTURE SENSITIVITY ...................................................................................................................................................... 72
15
SAFETY RECOMMANDATIONS ................................................................................................................................. 73
16
CONFORMITY ASSESSMENT ISSUES ......................................................................................................................... 75
16.1 1999/5/EC DIRECTIVE ..................................................................................................................................................... 75
16.2 FCC/IC REGULATORY NOTICES ............................................................................................................................................ 79
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page 5 of 80
HE910 Hardware User Guide
1vv0300925 Rev.9 – 07-02-2012
1 Introduction
1.1 Scope
The aim of this document is the description of some hardware solutions useful for
developing a product with the Telit HE910 module.
1.2 Audience
This document is intended for Telit customers, who are integrators, about to implement
their applications using our HE910 modules.
1.3 Contact Information, Support
For general contact, technical support, to report documentation errors and to order
Center (TTSC) at:
TS-EMEA@telit.com
TS-NORTHAMERICA@telit.com
TS-LATINAMERICA@telit.com
TS-APAC@telit.com
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where you can buy the Telit modules or for
recommendations on accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact
ical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your
comments and suggestions for improvements.
Telit appreciates feedback from the users of our information.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 6 of 80
HE910 Hardware User Guide
1vv0300925 Rev.9 – 07-02-2012
1.4 Document Organization
This document contains the following chapters:
provides a scope for this document, target audience, contact
and support information, and text conventions.
provides an overview of the document.
Chapter3 HE910 Module Connections
Chapter 4
Chapter 5
How to operate on the module via hardware.
Power supply requirements and general design rules.
Chapter 6
The antenna connection and board layout design are the most
important parts in the full product design.
Chapter 7
logic levels for this module.
Specific values adopted in the implementation of
Chapter 8
The USB port on the Telit HE910 is the core of the interface
between the module and OEM hardware
PI port Refers to the SPI port of the Telit HE910
Chapter 10
Refers to the serial ports of the Telit HE910
Chapter 11
of the HE910 Telit Modules.
Chapter 12
configured.
Chapter 13
recomm
Refers to the audio blocks of the Base Band Chip
How the general purpose I/O pads can be
HE910
Mechanical dimensions and
Chapter 14 Conformity Assessment Issues Information related to the Conformity
Assessments.
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page 7 of 80
HE910 Hardware User Guide
1vv0300925 Rev.9 – 07-02-2012
1.5 Text Conventions
Danger This information MUST be followed or catastrophic equipment failure or
bodily injury may occur.
Caution or Warning Alerts the user to important points about integrating the
module, if these points are not followed, the module and end user equipment may
fail or malfunction.
Tip or Information
Provides advice and suggestions that may be useful when
integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
1.6 Related Documents
HE910 Digital Voice Interface Application Note
HE910 SPI Port Application Note
HE910 Product description
SIM Holder Design Guides
AT Commands Reference Guide
Telit EVK2 User Guide
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
80000NT10050A
80000NT10053A
80378ST10085a
80000NT10001a
80378ST10091A
1vv0300704
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HE910 Hardware User Guide
1vv0300925 Rev.9 – 07-02-2012
1.7 Document History
R e v i si o n
Date
Changes
ISSUE#0
ISSUE#1
ISSUE#2
ISSUE#3
ISSUE#4
ISSUE#5
ISSUE#6
2011-03-31
2011-05-19
2011-05-25
2011-07-25
2011-07-29
2011-10-18
2011-12-22-
ISSUE#7
ISSUE#8
ISSUE#9
2012-01-16
2012-02-03
2012-02-07
Preliminary Version
Updated pinout on UART1
Update chapter 13
Added DVI app note references; chapter 4.1
Updated audio, on_off/reset and digital sections
Added STAT_LED info, Updated SPI pinout
Pads A8, A9, D14, A14 now reserved
Power supply extended to 3.3 V
USIF0 USIF1 names added to Main and AUX serial ports
Updated IO logic levels
IO levels selection 1.8/1.2 removed (now only 1.8)
Added HE910-GA and D; added Conformity assessment chapter
Chapter 5.1 updated
Chapter 4.2 updated
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 9 of 80
HE910 Hardware User Guide
1vv0300925 Rev.9 – 07-02-2012
2 Overview
The aim of this document is the description of some hardware solutions useful for
developing a product with the Telit HE910 module.
In this document all the basic functions of a mobile phone will be taken into account;
for each one of them a proper hardware solution will be suggested and eventually the
wrong solutions and common errors to be avoided will be evidenced. Obviously this
document cannot embrace the whole hardware solutions and products that may be
designed. The wrong solutions to be avoided shall be considered as mandatory, while
the suggested hardware configurations shall not be considered mandatory, instead the
information given shall be used as a guide and a starting point for properly developing
your product with the Telit HE910 module. For further hardware details that may not be
explained in this document refer to the Telit HE910 Product Description document
where all the hardware information is reported.
NOTICE:
(EN) The integration of the GSM/GPRS/WCDMA HE910 cellular module within user application
shall be done according to the design rules described in this manual.
/WCDMA HE910
azioni progettuali descritte in questo manuale.
(DE) Die Integration des HE910 GSM/GPRS/WCDMA Mobilfunk-Moduls in ein Gerät muß gemäß
der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.
(SL) Integracija GSM/GPRS/WCDMA HE910 modula v uporabniški aplikaciji bo morala
upoštevati projektna navodila, opisana v tem priročniku.
(SP) La utilización del modulo GSM/GPRS/WCDMA HE910 debe ser conforme a los usos para los
cuales ha sido deseñado descritos en este manual del usuario.
du module cellulaire GSM/GPRS/WCDMA HE910
(HE)
HE910
The information presented in this document is believed to be accurate and reliable. However, no
responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of
patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent rights of Telit Communications S.p.A. other than for
circuitry embodied in Telit products. This document is subject to change without notice.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 10 of 80
HE910 Hardware User Guide
1vv0300925 Rev.9 – 07-02-2012
3 HE910 module connections
3.1 PIN-OUT
PAD
Signal
I/O
Function
USB differential Data (+)
Type
COMMENT
USB HS 2.0 COMMUNICATION PORT
B15
USB_D+
I/O
C15
USB_D-
I/O
USB differential Data (-)
Power sense for the internal USB
transceiver.
A13
VUSB
Asynchronous Serial Port (USIF0) - Prog. / Data + HW Flow Control
N15
C103/TXD
Serial data input from DTE
CMOS 1.8V
M15
C104/RXD
Serial data output to DTE
CMOS 1.8V
M14
C108/DTR
Input for (DTR) from DTE
CMOS 1.8V
Input for Request to send signal
(RTS) from DTE
Output for Clear to Send signal
(CTS) to DTE
L14
C105/RTS
P15
C106/CTS
N14
C109/DCD
Output for (DCD) to DTE
CMOS 1.8V
P14
C107/DSR
Output for (DSR) to DTE
CMOS 1.8V
R14
C125/RING
Output for Ring (RI) to DTE
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
Asynchronous Auxiliary Serial Port (USIF1)
D15
TX_AUX
Auxiliary UART (TX Data to DTE)
CMOS 1.8V
E15
RX_AUX
Auxiliary UART (RX Data from
DTE)
CMOS 1.8V
D13
VDD_IO1
IO1 SUPPLY Input
E13
VIO1_1V8
VIO1 Supply output (1.8V)
External SIM signal – Clock
1.8 / 3V
This pin has to be connected
to E13
To be used only to supply
VDD_IO1
SIM card interface
A6
SIMCLK
A7
SIMRST
External SIM signal – Reset
1.8 / 3V
A5
SIMIO
I/O
External SIM signal – Data I/O
1.8 / 3V
A4
SIMIN
A3
SIMVCC
External SIM signal – Presence
(active low)
External SIM signal – Power
supply for the SIM
CMOS 1.8
1.8 / 3V
Digital Voice Interface (DVI) (See NOTE 1)
B9
DVI_WA0
I/O
Digital Audio Interface (WA0)
CMOS 1.8V
B6
DVI_RX
I/O
Digital Audio Interface (RX)
CMOS 1.8V
B7
DVI_TX
I/O
Digital Audio Interface (TX)
CMOS 1.8V
B8
DVI_CLK
I/O
Digital Audio Interface (CLK)
CMOS 1.8V
SPI_MOSI
SPI MOSI
CMOS 1.8V
Shared with TX_AUX
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SPI
D15
HE910 Hardware User Guide
1vv0300925 Rev.9 – 07-02-2012
E15
SPI_MISO
SPI_MISO
CMOS 1.8V
F15
SPI_CLK
SPI Clock
CMOS 1.8V
H15
SPI_MRDY
SPI_MRDY
CMOS 1.8V
J15
SPI_SRDY
SPI_SRDY
CMOS 1.8V
C8
GPIO_01
I/O
GPIO_01 /STAT LED
CMOS 1.8V
C9
GPIO_02
I/O
GPIO_02
CMOS 1.8V
C10
GPIO_03
I/O
GPIO_03
CMOS 1.8V
C11
GPIO_04
I/O
GPIO_04
CMOS 1.8V
B14
GPIO_05
I/O
GPIO_05
CMOS 1.8V
C12
GPIO_06
I/O
GPIO_06
CMOS 1.8V
C13
GPIO_07
I/O
GPIO_07
CMOS 1.8V
K15
GPIO_08
I/O
GPIO_08
CMOS 1.8V
L15
GPIO_09
I/O
GPIO_09
CMOS 1.8V
G15
GPIO_10
I/O
GPIO_10
CMOS 1.8V
K1
ANTENNA
I/O
F1
ANT_DIV
Shared with RX_AUX
DIGITAL IO
Alternate Function STAT LED
RF SECTION
GSM/EDGE/UMTS Antenna
(50 ohm)
Antenna Diversity Input
(50 ohm)
RF
RF
GPS SECTION (see NOTE1)
R9
R7
ANT_GPS
GPS_LNA_EN
GPS Antenna (50 ohm)
RF
Output enable for External LNA
supply
CMOS 1.8V
Miscellaneous Functions
R13
RESET*
Reset input
CMOS 1.8V
Active low
R12
ON_OFF*
Input command for power ON
CMOS 1.8V
Active low
C14
VRTC
VRTC Backup capacitor
Power
backup for the embedded
RTC supply
R11
VAUX/PWRMON
Supply Output for external
accessories / Power ON Monitor
1.8V
Power Supply
M1
VBATT
Main power supply (Baseband)
Power
M2
VBATT
Main power supply (Baseband)
Power
N1
VBATT_PA
Main power supply (Radio PA)
Power
N2
VBATT_PA
Main power supply (Radio PA)
Power
P1
VBATT_PA
Main power supply (Radio PA)
Power
P2
VBATT_PA
Main power supply (Radio PA)
Power
E1
GND
Ground
Power
G1
GND
Ground
Power
H1
GND
Ground
Power
J1
GND
Ground
Power
L1
GND
Ground
Power
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HE910 Hardware User Guide
1vv0300925 Rev.9 – 07-02-2012
A2
GND
Ground
Power
E2
GND
Ground
Power
F2
GND
Ground
Power
G2
GND
Ground
Power
H2
GND
Ground
Power
J2
GND
Ground
Power
K2
GND
Ground
Power
L2
GND
Ground
Power
R2
GND
Ground
Power
M3
GND
Ground
Power
N3
GND
Ground
Power
P3
GND
Ground
Power
R3
GND
Ground
Power
D4
GND
Ground
Power
M4
GND
Ground
Power
N4
GND
Ground
Power
P4
GND
Ground
Power
R4
GND
Ground
Power
N5
GND
Ground
Power
P5
GND
Ground
Power
R5
GND
Ground
Power
N6
GND
Ground
Power
P6
GND
Ground
Power
R6
GND
Ground
Power
P8
GND
Ground
Power
R8
GND
Ground
Power
P9
GND
Ground
Power
P10
GND
Ground
Power
R10
GND
Ground
Power
M12
GND
Ground
Power
B13
GND
Ground
Power
P13
GND
Ground
Power
E14
GND
Ground
Power
C1
RESERVED
RESERVED
D1
RESERVED
RESERVED
B2
RESERVED
RESERVED
C2
RESERVED
RESERVED
D2
RESERVED
RESERVED
B3
RESERVED
RESERVED
C3
RESERVED
RESERVED
RESERVED
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HE910 Hardware User Guide
1vv0300925 Rev.9 – 07-02-2012
D3
RESERVED
RESERVED
E3
RESERVED
RESERVED
F3
RESERVED
RESERVED
G3
RESERVED
RESERVED
H3
RESERVED
RESERVED
J3
RESERVED
RESERVED
K3
RESERVED
RESERVED
L3
RESERVED
RESERVED
B4
RESERVED
RESERVED
C4
RESERVED
RESERVED
B5
RESERVED
RESERVED
C5
RESERVED
RESERVED
C6
RESERVED
RESERVED
C7
RESERVED
RESERVED
N7
RESERVED
RESERVED
P7
RESERVED
RESERVED
N8
RESERVED
RESERVED
N9
RESERVED
RESERVED
A10
RESERVED
RESERVED
N10
RESERVED
RESERVED
N11
RESERVED
RESERVED
P11
RESERVED
RESERVED
B12
RESERVED
RESERVED
D12
RESERVED
RESERVED
N12
RESERVED
RESERVED
P12
RESERVED
RESERVED
F14
RESERVED
RESERVED
G14
RESERVED
RESERVED
H14
RESERVED
RESERVED
J14
RESERVED
RESERVED
K14
RESERVED
RESERVED
N13
RESERVED
RESERVED
L13
RESERVED
RESERVED
J13
RESERVED
RESERVED
M13
RESERVED
RESERVED
K13
RESERVED
RESERVED
H13
RESERVED
RESERVED
G13
RESERVED
RESERVED
F13
RESERVED
RESERVED
A11
RESERVED
RESERVED
A12
RESERVED
RESERVED
B1
RESERVED
RESERVED
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HE910 Hardware User Guide
1vv0300925 Rev.9 – 07-02-2012
B11
RESERVED
RESERVED
B10
RESERVED
RESERVED
A9
RESERVED
RESERVED
A8
RESERVED
RESERVED
D14
RESERVED
RESERVED
A14
RESERVED
RESERVED
WARNING:
Reserved pins must not be connected.
NOTE1:
The Audio and GPS functions are not supported on HE910-D
The following PADS have to be considered as RESERVED:
B6, B7, B8, B9, R7, R9
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HE910 Hardware User Guide
1vv0300925 Rev.9 – 07-02-2012
NOTE:
If not used, almost all pins should be left disconnected. The only exceptions are the
following pins:
PAD
M1,M2,N1,N2,P1,P2
E1,G1,H1,J1,L1,A2,E2,F2,G2,H2,
J2,K2,L2,R2,M3,N3,P3,R3,D4,M4,
N4,P4,R4,N5,P5,R5,N6,P6,R6,P8,
R8,P9,P10,R10,M12,B13,P13,E14
R12
R13
B15
C15
A13
N15
M15
L14
P15
D15
E15
D13
E13
signal
VBATT & VBATT_PA
GND
ON/OFF*
RESET*
USB_D+
USB_DVUSB
C103/TXD
C104/RXD
C105/RTS
C106/CTS
TXD_AUX
RXD_AUX
VDD_IO1
VIO1_1V8
RTS pin should be connected to the GND (on the module side) if flow control is not used.
The above pins are also necessary to debug the application when the module is assembled on it.
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page 16 of 80
HE910 Hardware User Guide
1vv0300925 Rev.9 – 07-02-2012
3.1.1 LGA Pads Layout (HE910 and HE910-GA)
TOP VIEW
RES
RES
RES
GND
ANT_DIV
GND
GND
GND
ANT
GND
VBATT
VBATT_
PA
VBATT_
PA
GND
RES
RES
RES
GND
GND
GND
GND
GND
GND
GND
VBATT
VBATT_
PA
VBATT_
PA
GND
SIMVC
RES
RES
RES
RES
RES
RES
RES
RES
RES
RES
GND
GND
GND
GND
SIMIN
RES
RES
GND
GND
GND
GND
GND
SIMIO
RES
RES
GND
GND
GND
SIMCLK
DVI_RX
RES
GND
GND
GND
SIMRS
DVI_TX
RES
RES
RES
GPS_LN
A_EN
RES
DVI_CLK
GPIO_01
RES
GND
GND
RES
DVI_WA
GPIO_02
RES
GND
ANT_GP
10
RES
RES
GPIO_03
RES
GND
GND
11
RES
RES
GPIO_04
RES
RES
VAUX/P
WRMON
12
RES
RES
GPIO_06
RES
GND
RES
RES
ON_OFF
13
VUSB
GND
GPIO_07
VDD_IO
VIO1_1V
RES
RES
RES
RES
RES
RES
RES
RES
GND
RESET*
14
RES
GPIO_05
VRTC
RES
GND
RES
RES
RES
RES
RES
C105/RT
C108/DT
C109/DC
C107/DS
C125/RI
NG
USB_D+
USB_D-
TX AUX
RX AUX
SPI_CLK
GPIO_10
SPI_MR
DY
SPI_SR
DY
GPIO_08
GPIO_09
C104/RX
C103/TX
C106/CT
15
NOTE:
The pin defined as RES has to be considered RESERVED and not connected on any pin
in the application.
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3.1.2 LGA Pads Layout (HE910-D)
TOP VIEW
RES
RES
RES
GND
ANT_DIV
GND
GND
GND
ANT
GND
VBATT
VBATT_
PA
VBATT_
PA
GND
RES
RES
RES
GND
GND
GND
GND
GND
GND
GND
VBATT
VBATT_
PA
VBATT_
PA
GND
SIMVC
RES
RES
RES
RES
RES
RES
RES
RES
RES
RES
GND
GND
GND
GND
SIMIN
RES
RES
GND
GND
GND
GND
GND
SIMIO
RES
RES
GND
GND
GND
SIMCLK
RES
RES
GND
GND
GND
SIMRS
RES
RES
RES
RES
RES
RES
RES
GPIO_01
RES
GND
GND
RES
RES
GPIO_02
RES
GND
RES
10
RES
RES
GPIO_03
RES
GND
GND
11
RES
RES
GPIO_04
RES
RES
VAUX/P
WRMON
12
RES
RES
GPIO_06
RES
GND
RES
RES
ON_OFF
13
VUSB
GND
GPIO_07
VDD_IO
VIO1_1V
RES
RES
RES
RES
RES
RES
RES
RES
GND
RESET*
14
RES
GPIO_05
VRTC
RES
GND
RES
RES
RES
RES
RES
C105/RT
C108/DT
C109/DC
C107/DS
C125/RI
NG
USB_D+
USB_D-
TX AUX
RX AUX
SPI_CLK
GPIO_10
SPI_MR
DY
SPI_SR
DY
GPIO_08
GPIO_09
C104/RX
C103/TX
C106/CT
15
NOTE:
The pin defined as RES has to be considered RESERVED and not connected on any pin
in the application.
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HE910 Hardware User Guide
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4 Hardware Commands
4.1 Turning ON the HE910
To turn on the HE910 the pad ON_OFF* must be tied low for at least 5 seconds and then
released.
The maximum current that can be drained from the ON# pad is 0,1 mA.
A simple circuit to do it is:
NOTE:
Don't use any pull up resistor on the ON_OFF* line, it is internally pulled up. Using pull
up resistor may bring to latch up problems on the HE910 power regulator and improper
power on/off of the module. The line ON_OFF* must be connected only in open
collector or open drain configuration.
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NOTE:
In this document all the lines that are inverted, hence have active low signals are
labelled with a name that ends with
or with a bar over the name.
TIP:
To check if the device has powered on, the hardware line PWRMON should be
monitored.
NOTE:
It is mandatory to avoid sending data to the serial ports during the first 200ms of the
module start-up.
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A flow chart showing the proper turn on procedure is displayed below:
Modem ON Proc.
PWMON = ON?
DELAY= 300mSec
Enter AT
ON_OFF = LOW
Delay = 5 Sec
AT answer in 1Sec ?
ON_OFF = HIGH
PWMON = ON?
AT init sequence.
HW unconditional
SHUTDOWN
Delay 1s
Start AT CMD.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH
logic level signal applied to the digital pins of the HE910 when the module is powered
off or during an ON/OFF transition.
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A flow chart showing the AT command managing procedure is displayed below:
Start AT CMD.
DELAY= 300mSec
Enter AT
AT answer in
1Sec ?
AT init sequence.
HW unconditional
SHUTDOWN
Modem ON Proc.
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HE910 Hardware User Guide
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For example:
1- Let's assume you need to drive the ON# pad with a totem pole output of a +3/5 V
microcontroller (uP_OUT1):
2- Let's assume you need to drive the ON# pad directly with an ON/OFF button:
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HE910 Hardware User Guide
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4.2 Turning OFF the HE910
Turning off of the device can be done in two ways:
via AT command (see HE910 Software User Guide, AT#SHDN)
by tying low pin ON_OFF*
Either ways, the device issues a detach request to network informing that the device will not
be reachable any more.
To turn OFF the HE910 the pad ON_OFF* must be tied low for at least 2 seconds and then
released.
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HE910 Hardware User Guide
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The following flow chart shows the proper turnoff procedure:
Modem OFF Proc.
PWMON = ON?
ON_OFF = LOW
Delay = 2 Sec
ON_OFF = HIGH
Modem ON Proc.
PWMON = ON?
Delay 15s
PWMON = ON?
HW unconditional
SHUTDOWN
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HE910 Hardware User Guide
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TIP:
To check if the device has been powered off, the hardware line PWRMON must be
monitored. The device is powered off when PWRMON goes low.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH
logic level signal applied to the digital pins of the HE910 when the module is powered
off or during an ON/OFF transition.
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HE910 Hardware User Guide
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4.3 HE910 Unconditional Shutdown
The Unconditional Shutdown of the module could be activated using the RESET* line
(pad R13).
WARNING:
The hardware unconditional Shutdown must not be used during normal operation of
the device since it does not detach the device from the network. It shall be kept as an
emergency exit procedure.
To unconditionally shutdown the HE910, the pad RESET* must be tied low for at
least 200 milliseconds and then released.
NOTE:
Do not use any pull up resistor on the RESET* line nor any totem pole digital output.
Using pull up resistor may bring to latch up problems on the HE910 power regulator
and improper functioning of the module. The line RESET* must be connected only in
open collector configuration.
The RESET* is generating an unconditional shutdown of the module without an
automatic restart.
TIP:
The unconditional hardware shutdown must always be implemented on the boards and
should be used only as an emergency exit procedure.
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HE910 Hardware User Guide
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A typical circuit is the following:
For example:
1- Let us assume you need to drive the RESET* pad with a totem pole output of a +3/5
V microcontroller (uP_OUT2):
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH
logic level signal applied to the digital pins of the HE910 when the module is powered
off or during an ON/OFF transition.
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HE910 Hardware User Guide
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In the following flow chart is detailed the proper restart procedure:
HW unconditional
SHUTDOWN
Reset# = LOW
Delay 200ms
Reset# = HIGH
PWRMON = ON
Modem ON Proc.
Delay 1s
Disconnect PWR
supply
Modem ON Proc.
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HE910 Hardware User Guide
1vv0300925 Rev.9 – 07-02-2012
5 Power Supply
The power supply circuitry and board layout are a very important part in the full product
design and they strongly reflect on the product overall performances, hence read
carefully the requirements and the guidelines that will follow for a proper design.
5.1 Power Supply Requirements
The external power supply must be connected to VBATT & VBATT_PA signals and must
fulfil the following requirements:
POWER SUPPLY
Nominal Supply Voltage
Normal Operating Voltage Range
Extended Operating Voltage Range
3.8 V
3.40 V÷ 4.20 V
3.20 V÷ 4.20 V
NOTE:
The Operating Voltage Range MUST never be exceeded; care must be taken in order to
fulfil min/max voltage requirement.
NOTE:
Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage
(regarding MIN Extended Operating Voltage) MUST never be exceeded;
ely assumption
and application of the HW User guide suggestions.
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5.2 Power Consumption
The HE910 power consumptions are described in the following table
(Preliminary values):
HE910
Average
Mode
Mode description
(mA)
Stand by mode (WCDMA)
Disabled TX and RX; module is not registered on the
Stand By 3G
1.2*
network; DRX7
IDLE mode (GSM)
Disabled TX and RX; module is not registered on the
Stand By 2G
1.1*
network, DRX5
Operative mode (WCDMA)
WCDMA Voice
538
WCDMA voice call (23.5dBm; High Band)
HSDPA
557
HSDPA data call (23.5dBm; High Band, CAT10)
Operative mode (GSM)
CSD TX and RX mode
GSM900 CSD PL5
209
GSM VOICE CALL
DCS1800 CSD PL0
176
* depending on network configuration and not under module control.
The GSM system is made in a way that the RF transmission is not continuous, else it is
packed into bursts at a base frequency of about 216 Hz, and the relative current peaks
can be as high as about 2A. Therefore the power supply has to be designed in order to
withstand with these current peaks without big voltage drops; this means that both the
electrical design and the board layout must be designed for this current flow.
If the layout of the PCB is not well designed a strong noise floor is generated on the
ground and the supply; this will reflect on all the audio paths producing an audible
annoying noise at 216 Hz; if the voltage drop during the peak current absorption is too
much, then the device may even shutdown as a consequence of the supply voltage drop.
NOTE:
The electrical design for the Power supply should be made ensuring it will be capable
of a peak current output of at least 2 A.
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HE910 Hardware User Guide
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5.3 General Design Rules
The principal guidelines for the Power Supply Design embrace three different design
steps:
the electrical design
the thermal design
the PCB layout.
5.3.1 Electrical Design Guidelines
The electrical design of the power supply depends strongly from the power source
where this power is drained. We will distinguish them into three categories:
+5V input (typically PC internal regulator output)
+12V input (typically automotive)
Battery
5.3.1.1 + 5V input Source Power Supply Design Guidelines
The desired output for the power supply is 3.8V, hence there's not a big difference
between the input source and the desired output and a linear regulator can be used. A
switching power supply will not be suited because of the low drop out requirements.
When using a linear regulator, a proper heat sink shall be provided in order to dissipate
the power generated.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the
current absorption peaks close to the HE910, a 100μF tantalum capacitor is usually
suited.
Make sure the low ESR capacitor on the power supply output (usually a tantalum one)
is rated at least 10V.
A protection diode should be inserted close to the power input, in order to save the
HE910 from power polarity inversion.
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An example of linear regulator with 5V input is:
5.3.1.2 + 12V input Source Power Supply Design Guidelines
The desired output for the power supply is 3.8V, hence due to the big difference
between the input source and the desired output, a linear regulator is not suited and
shall not be used. A switching power supply will be preferable because of its better
efficiency especially with the 2A peak current load represented by the HE910.
When using a switching regulator, a 500kHz or more switching frequency regulator is
preferable because of its smaller inductor size and its faster transient response. This
allows the regulator to respond quickly to the current peaks absorption.
In any case the frequency and Switching design selection is related to the application to
be developed due to the fact the switching frequency could also generate EMC
interferences.
For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind
when choosing components: all components in the power supply must withstand this
voltage.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the
current absorption peaks, a 100μF tantalum capacitor is usually suited.
Make sure the low ESR capacitor on the power supply output (usually a tantalum one)
is rated at least 10V.
For Car applications a spike protection diode should be inserted close to the power
input, in order to clean the supply from spikes.
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A protection diode should be inserted close to the power input, in order to save the
HE910 from power polarity inversion. This can be the same diode as for spike
protection.
An example of switching regulator with 12V input is in the below schematic:
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HE910 Hardware User Guide
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5.3.1.3 Battery Source Power Supply Design Guidelines
The desired nominal output for the power supply is 3.8V and the maximum voltage
allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the
power to the Telit HE910 module.
WARNING:
The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB types MUST NOT BE
USED DIRECTLY since their maximum voltage can rise over the absolute maximum
voltage for the HE910 and damage it.
NOTE:
DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with HE910.
Their use can lead to overvoltage on the HE910 and damage it. USE ONLY Li-Ion battery
types.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the
current absorption peaks, a 100μF tantalum capacitor is usually suited.
Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.
A protection diode should be inserted close to the power input, in order to save the
HE910 from power polarity inversion. Otherwise the battery connector should be done
in a way to avoid polarity inversions when connecting the battery.
The battery capacity must be at least 500mAh in order to withstand the current peaks
of 2A; the suggested capacity is from 500mAh to 1000mAh.
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5.3.2 Thermal Design Guidelines
The thermal design for the power supply heat sink should be done with the following
specifications:
Average current consumption during HSDPA transmission @PWR level max :
600 mA
Average current during idle:
1.5 mA
NOTE:
The average consumption during transmissions depends on the power level at which
the device is requested to transmit by the network. The average current consumption
hence varies significantly.
Considering the very low current during idle, especially if Power Saving function is
enabled, it is possible to consider from the thermal point of view that the device
absorbs current significantly only during calls.
If we assume that the device stays into transmission for short periods of time (let's say
few minutes) and then remains for a quite long time in idle (let's say one hour), then the
power supply has always the time to cool down between the calls and the heat sink
could be smaller than the calculated one for 600mA maximum RMS current, or even
could be the simple chip package (no heat sink).
Moreover in the average network conditions the device is requested to transmit at a
lower power level than the maximum and hence the current consumption will be less
than the 600mA, being usually around 150mA.
For these reasons the thermal design is rarely a concern and the simple ground plane
where the power supply chip is placed can be enough to ensure a good thermal
condition and avoid overheating.
For the heat generated by the HE910, you can consider it to be during transmission 1W
max during CSD/VOICE calls and 2W max during class10 GPRS upload.
This generated heat will be mostly conducted to the ground plane under the HE910; you
must ensure that your application can dissipate it.
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HE910 Hardware User Guide
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5.3.3 Power Supply PCB layout Guidelines
As seen on the electrical design guidelines the power supply shall have a low ESR
capacitor on the output to cut the current peaks and a protection diode on the input to
protect the supply from spikes and polarity inversion. The placement of these
components is crucial for the correct working of the circuitry. A misplaced component
can be useless or can even decrease the power supply performances.
The Bypass low ESR capacitor must be placed close to the Telit HE910 power input
pads or in the case the power supply is a switching type it can be placed close to the
inductor to cut the ripple provided the PCB trace from the capacitor to the HE910 is
wide enough to ensure a dropless connection even during the 2A current peaks.
The protection diode must be placed close to the input connector where the power
source is drained.
The PCB traces from the input connector to the power regulator IC must be wide
enough to ensure no voltage drops occur when the 2A current peaks are absorbed.
Note that this is not made in order to save power loss but especially to avoid the voltage
drops on the power line at the current peaks frequency of 216 Hz that will reflect on all
the components connected to that supply, introducing the noise floor at the burst base
frequency. For this reason while a voltage drop of 300-400 mV may be acceptable from
the power loss point of view, the same voltage drop may not be acceptable from the
noise point of view. If your application doesn't have audio interface but only uses the
data feature of the Telit HE910, then this noise is not so disturbing and power supply
layout design can be more forgiving.
The PCB traces to the HE910 and the Bypass capacitor must be wide enough to ensure
no significant voltage drops occur when the 2A current peaks are absorbed. This is for
the same reason as previous point. Try to keep this trace as short as possible.
The PCB traces connecting the Switching output to the inductor and the switching diode
must be kept as short as possible by placing the inductor and the diode very close to
the power switching IC (only for switching power supply). This is done in order to
reduce the radiated field (noise) at the switching frequency (100-500 kHz usually).
The use of a good common ground plane is suggested.
The placement of the power supply on the board should be done in such a way to
guarantee that the high current return paths in the ground plane are not overlapped to
any noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier.
The power supply input cables should be kept separate from noise sensitive lines such
as microphone/earphone cables.
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HE910 Hardware User Guide
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6 GSM/WCDMA Antenna
The antenna connection and board layout design are the most important aspect in the
full product design as they strongly affect the product overall performances, hence
read carefully and follow the requirements and the guidelines for a proper design.
6.1 GSM/WCDMA Antenna Requirements
As suggested on the Product Description the antenna and antenna transmission line on
PCB for a Telit HE910 device shall fulfil the following requirements:
Frequency range
Bandwidth
(GSM/EDGE)
Bandwidth
(WCDMA)
Impedance
Input power
VSWR absolute max
VSWR recommended
ANTENNA REQUIREMENTS
Depending by frequency band(s) provided by the
network operator, the customer shall use the most
suitable antenna for that/those band(s)
70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in
DCS & 140 MHz PCS band
70 MHz in WCDMA Band V
80 MHz in WCDMA Band VIII
460 MHz in WCDMA Band IV (see NOTE1)
140 MHz in WCDMA Band II
250 MHz in WCDMA Band I
50 ohm
> 33dBm(2 W) peak power in GSM
> 24dBm Average power in WCDMA
≤ 5:1 (limit to avoid permanent damage)
≤ 2:1 (limit to fulfil all regulatory requirements)
When using the HE910, since there's no antenna connector on the module, the antenna
must be connected to the HE910 antenna pad (K1) by means of a transmission line
implemented on the PCB.
In the case the antenna is not directly connected at the antenna pad of the HE910, then
a PCB line is needed in order to connect with it or with its connector.
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HE910 Hardware User Guide
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This transmission line shall fulfil the following requirements:
ANTENNA LINE ON PCB REQUIREMENTS
Characteristic Impedance
50 ohm
Max Attenuation
0,3 dB
Coupling with other signals shall be avoided
Cold End (Ground Plane) of antenna shall be equipotential to
the HE910 ground pins
Furthermore if the device is developed for the US market and/or Canada market, it
shall comply with the FCC and/or IC approval requirements:
This device is to be used only for mobile and fixed application. In order to re-use the
Telit FCC/IC approvals the antenna(s) used for this transmitter must be installed to
provide a separation distance of at least 20 cm from all persons and must not be colocated or operating in conjunction with any other antenna or transmitter. If antenna is
installed with a separation distance of less than 20 cm from all persons or is co-located
or operating in conjunction with any other antenna or transmitter then additional
FCC/IC testing may be required. End-Users must be provided with transmitter
operation conditions for satisfying RF exposure compliance.
Antennas used for this OEM module must not exceed the following gains for mobile and
fixed operating configurations:
GSM 850/FDD V: 5.22 dBi
PCS 1900/FDD II: 3.31 dBi
FDD IV: 6.45 dBi
NOTE1:
The HE910-GA is not supporting the FDD BAND IV
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HE910 Hardware User Guide
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6.2 GSM/WCDMA - PCB line Guidelines
Make sure that the
impedance is 50ohm ;
Keep line on the PCB as short as possible, since the antenna line loss shall be less
than around 0,3 dB;
Line geometry should have uniform characteristics, constant cross section, avoid
meanders and abrupt curves;
Any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded
Coplanar Waveguide...) can be used for implementing the printed transmission line
afferent the antenna;
If a Ground plane is required in line geometry, that plane has to be continuous and
sufficiently extended, so the geometry can be as similar as possible to the related
canonical model;
Keep, if possible, at least one layer of the PCB used only for the Ground plane; If
possible, use this layer as reference Ground plane for the transmission line;
It is wise to surround (on both sides) the PCB transmission line with Ground, avoid
having other signal tracks facing directly the antenna line track.
Avoid crossing any un-shielded transmission line footprint with other signal tracks on
different layers;
The ground surrounding the antenna line on PCB has to be strictly connected to the
main Ground Plane by means of via holes (once per 2mm at least), placed close to the
ground edges facing line track;
Place EM noisy devices as far as possible from HE910 antenna line;
Keep the antenna line far away from the HE910 power supply lines;
If EM noisy devices are present on the PCB hosting the HE910, such as fast switching
ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB
and surround it with Ground planes, or shield it with a metal frame cover.
If EM noisy devices are not present around the line, the use of geometries like
Microstrip or Grounded Coplanar Waveguide has to be preferred, since they typically
ensure less attenuation if compared to a Stripline having same length;
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HE910 Hardware User Guide
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6.3 GSM/WCDMA Antenna - Installation Guidelines
Install the antenna in a place covered by the GSM signal.
If the device antenna is located greater then 20cm from the human body and there are
no co-located transmitter then the Telit FCC/IC approvals can be re-used by the end
product
If the device antenna is located less then 20cm from the human body or there are no
co-located transmitter then the additional FCC/IC testing may be required for the end
product (Telit FCC/IC approvals cannot be reused)
Antenna shall not be installed inside metal cases
Antenna shall be installed also according Antenna manufacturer instructions.
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HE910 Hardware User Guide
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6.4 Antenna Diversity Requirements
This product is including an input for a second RX antenna to improve the radio
sensitivity. The function is called Antenna Diversity.
Frequency range
Bandwidth
(GSM/EDGE)
Bandwidth
(WCDMA)
Impedance
ANTENNA REQUIREMENTS
Depending by frequency band(s) provided by the
network operator, the customer shall use the most
suitable antenna for that/those band(s)
70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in
DCS & 140 MHz PCS band
70 MHz in WCDMA Band V
80 MHz in WCDMA Band VIII
460 MHz in WCDMA Band IV (see NOTE1)
140 MHz in WCDMA Band II
250 MHz in WCDMA Band I
50 ohm
When using the HE910, since there's no antenna connector on the module, the antenna
must be connected to the HE910 antenna pad (F1) by means of a transmission line
implemented on the PCB.
In the case the antenna is not directly connected at the antenna pad of the HE910, then
a PCB line is needed in order to connect with it or with its connector.
The second Rx antenna should not be located in the close vicinity of main antenna. In
order to improve Diversity Gain, Isolation and reduce mutual interaction, the two
antennas should be located at the maximum reciprocal distance possible, taking into
consideration the available space into the application.
NOTE1:
The HE910-GA is not supporting the FDD BAND IV
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6.5 GPS Antenna Requirements (HE910 and HE910-GA)
The HE910 module is already provided with an internal LNA amplifier so it is also possible to
develop an application including a passive Antenna.
The use of an active antenna is required to achieve a better performance especially when
the GPS antenna distance from the module is quite high.
The module is provided of a Digital Output signal to enable the external LNA (pad R7)
6.5.1 Combined GPS Antenna
The use of combined GPS antennas is NOT recommended; this solution could generate an
extremely poor GPS reception and also the combination antenna requires additional diplexer
and adds a loss in the RF route.
In addition, the combination of antennas requires an additional diplexer, which adds
significant power losses in the RF path.
6.5.2 Linear and Patch GPS Antenna
Using this type of antenna introduces at least 3 dB of loss if compared to a circularly
polarized (CP) antenna. Having a spherical gain response instead of a hemispherical gain
response could aggravate the multipath behaviour & create poor position accuracy.
6.5.3 LNA and Front End Design Considerations
The optional external LNA (embedded or not inside antenna) should be dimensioned to
compensate antenna line losses and to avoid an excessive LNA gain that can introduce
jamming spurs, degrade 3IP, and saturate the receiver.
The external active antenna for a Telit HE910 device must fulfill the following requirements:
Antenna Requirements
Frequency range
Bandwidth
Impedance
1575.42 MHz (GPS L1)
± 1.023 MHz
50ohm
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When using the Telit HE910, since there is no antenna connector on the module, the
antenna must be connected to the HE910 through the PCB with the antenna pad.
In the case that the antenna is not directly developed on the same PCB, hence directly
connected at the antenna pad of the HE910, then a PCB line is needed in order to
connect with it or with its connector.
This line of transmission must fulfill the following requirements:
Antenna Line on PCB Requirements
Impedance
50 ohm
No coupling with other signals allowed
Cold End (Ground Plane) of antenna must be equipotential to
the HE910 ground pins
Furthermore if the device is developed for the US and/or Canada market, it must comply with
the FCC and/or IC approval requirements:
This device is to be used only for mobile and fixed application.
6.5.4 GPS Antenna - PCB Line Guidelines
Ensure that the antenna line impedance is 50ohm.
Keep the antenna line on the PCB as short as possible to reduce the loss.
Antenna line must have uniform characteristics, constant cross section,
avoid meanders and abrupt curves.
Keep one layer of the PCB used only for the Ground plane, if possible.
Surround (on the sides, over and under) the antenna line on PCB with
Ground, avoid having other signal tracks facing directly the antenna line of
track.
The ground around the antenna line on PCB has to be strictly connected to
the Ground Plane by placing vias once per 2mm at least.
Place EM noisy devices as far as possible from HE910 antenna line.
Keep the antenna line far away from the HE910 power supply lines.
Keep the antenna line far away from the HE910 GSM RF lines.
If you have EM noisy devices around the PCB hosting the HE910, such as fast
switching ICs, take care of the shielding of the antenna line by burying it
inside the layers of PCB and surround it with Ground planes, or shield it with
a metal frame cover.
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If you do not have EM noisy devices around the PCB of HE910, use a stripline on the superficial copper layer for the antenna line. The line attenuation
will be lower than a buried one.
6.5.5 GPS Antenna - Installation Guidelines
The HE910 due to its characteristics of sensitivity is capable to perform a Fix
inside the buildings. (In any case the sensitivity could be affected by the
building characteristics i.e. shielding).
The Antenna must not be co-located or operating in conjunction with any
other antenna or transmitter.
Antenna must not be installed inside metal cases.
Antenna must be installed also according to the Antenna manufacturer
instructions.
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HE910 Hardware User Guide
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7 Logic level specifications
The following table shows the logic level specifications used in the HE910 interface
circuits:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital pin (CMOS 1.8) with
respect to ground
-0.3V
3.1V
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level
1.5V
1.9V
Input low level
0V
0.35V
Output high level
1.6V
1.9
Output low level
0V
0.2V
Current characteristics (Preliminary values)
Level
Typical
Output Current
100uA
Input Current
1uA
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HE910 Hardware User Guide
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7.1 Reset signal
Signal
Function
I/O
PAD
RESET*
Phone reset
R13
RESET* is used to reset the HE910. Whenever this signal is pulled low, the HE910 is
reset. When the device is reset it stops any operation. After the release of the reset
HE910 is unconditionally shut down, without doing any detach operation from the
network where it is registered. This behaviour is not a proper shut down because any
GSM device is requested to issue a detach request on turn off. For this reason the
Reset signal must not be used to normally shutting down the device, but only as an
emergency exit in the rare case the device remains stuck waiting for some network
response.
The RESET* is internally controlled on start-up to achieve always a proper power-on
reset sequence, so there's no need to control this pin on start-up. It may only be used
to reset a device already on that is not responding to any command.
NOTE:
Do not use this signal to power off the HE910. Use the ON/OFF signal to perform this
function or the AT#SHDN command.
Reset Signal Operating levels:
Signal
Min
Max
RESET Input high
1.5V
1.9V
RESET Input low
0V
0.35V
* this signal is internally pulled up so the pin can be left floating if not used.
If unused, this signal may be left unconnected. If used, then it must always be
connected with an open collector transistor, to permit to the internal circuitry the
power on reset and under voltage lockout functions.
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HE910 Hardware User Guide
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8 USB Port
The HE910 includes one integrated universal serial bus (USB) transceiver:
USB 2.0 HS
8.1 USB 2.0 HS
This port is compliant with the USB 2.0 specifications.
The following table is listing the available signals:
PAD
Signal
I/O
Function
Type
B15
USB_D+
I/O
USB differential Data (+)
3.3V
C15
USB_D-
I/O
USB differential Data (-)
3.3V
A13
VUSB
AI
Power sense for the internal USB
transceiver.
5V
NOTE
Accepted range:
4.4V to 5.25V
The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz. The signal
traces should be routed carefully. Trace lengths, number of vias and capacitive
loading should be minimized. The impedance value should be as close as possible
to 90 Ohms differential.
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9 SPI port
The HE910 Module is provided by one SPI interface.
The SPI interface defines two handshake lines for flow control and mutual wake-up of the
modem and the Application Processor: SRDY (slave ready) and MRDY (master ready).
The AP has the master role, that is, it supplies the clock.
The following table is listing the available signals:
PAD
Signal
I/O
Function
Type
D15
E15
SPI_MOSI
SPI MOSI
CMOS 1.8V
Shared with TX_AUX
SPI_MISO
SPI MISO
CMOS 1.8V
Shared with RX_AUX
F15
SPI_CLK
SPI Clock
CMOS 1.8V
H15
SPI_MRDY
SPI_MRDY
CMOS 1.8V
J15
SPI_SRDY
SPI_SRDY
CMOS 1.8V
COMMENT
The signal VIO1_1V8 must be connected to the VDD_IO1 input pin to properly supply this
digital section.
NOTE:
Due to the shared functions, when the SPI port is used, it is not possible to use the
AUX_UART port.
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9.1 SPI Connections
SPI_MISO
E15
SPI_MOSI
D15
SPI_CLK
F15
SPI_MRDY
H15
HE910
VDD_IO1
SPI_SRDY
J15
AP
D13
VIO1_1V8 E13
D14
nc
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10 Serial Ports
The HE910 module is provided with by 2 Asynchronous serial ports:
MODEM SERIAL PORT 1 (Main)
MODEM SERIAL PORT 2 (Auxiliary)
Several configurations can be designed for the serial port on the OEM hardware, but
the most common are:
RS232 PC com port
microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit)
microcontroller UART @ 5V or other voltages different from 1.8V
Depending from the type of serial port on the OEM hardware a level translator circuit
may be needed to make the system work.
On the HE910 the ports are CMOS 1.8..
The electrical characteristics of the Serial ports are explained in the following tables:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital pin (CMOS 1.8) with
respect to ground
-0.3V
3.1V
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level
1.5V
1.9V
Input low level
0V
0.35V
Output high level
1.6V
1.9
Output low level
0V
0.2V
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HE910 Hardware User Guide
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10.1 MODEM SERIAL PORT 1 (USIF0)
The serial port 1 on the HE910 is a +1.8V UART with all the 7 RS232 signals.
It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.
RS232
Pin #
Signal
HE910
Pad Number
Name
C109/DCD
N14
Data Carrier Detect
C104/RXD
C103/TXD
M15
N15
Transmit line *see Note
Receive line *see Note
C108/DTR
M14
Data Terminal Ready
GND
C107/DSR
P14
Data Set Ready
C106/CTS
P15
Clear to Send
C105/RTS
L14
Request to Send
C125/RING
R14
Ring Indicator
M12, B13, P13,
Usage
Output from the HE910 that indicates the carrier
presence
Output transmit line of HE910 UART
Input receive of the HE910 UART
Input to the HE910 that controls the DTE READY
condition
Ground
Ground
Output from the HE910 that indicates the module is
ready
Output from the HE910 that controls the Hardware
flow control
Input to the HE910 that controls the Hardware flow
control
Output from the HE910 that indicates the incoming
call condition
The following table shows the typical input value of internal pull-up resistors for RTS
DTR and TXD input lines and in all module states:
RTS DTR TXD
STATE
ON
OFF
RESET
POWER
SAVING
5K to 12K
Schottky diode
Schottky diode
5K to 12K
Pull up tied to
1V8
1V8
Line in OFF and RESET state can be treated as in picture below
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NOTE:
According to V.24, some signal names are referred to the application side, therefore on
the HE910 side these signal are on the opposite direction:
TXD on the application side will be connected to the receive line (here named
C103/TXD)
RXD on the application side will be connected to the transmit line (here named
C104/RXD)
NOTE:
For a minimum implementation, only the TXD, RXD lines can be connected, the other
lines can be left open provided a software flow control is implemented.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH
logic level signal applied to the digital pins of the HE910 when the module is powered
off or during an ON/OFF transition.
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10.2 MODEM SERIAL PORT 2 (USIF1)
The secondary serial port on the HE910 is a CMOS1.8V with only the RX and TX
signals.
The signals of the HE910 serial port are:
PAD
Signal
I/O
Function
Type
COMMENT
D15
TX_AUX
Auxiliary UART (TX Data to DTE)
CMOS 1.8V
SHARED WITH
SPI_MTSR
E15
RX_AUX
Auxiliary UART (RX Data from
DTE)
CMOS 1.8V
SHARED WITH
SPI_MRST
The signal VIO1_1V8 must be connected to the VDD_IO1 input pin to
supply this digital section.
properly
NOTE:
Due to the shared pins, when the Modem Serial port is used, it is not possible to use the
SPI functions.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH
logic level signal applied to the digital pins of the HE910 when the module is powered
off or during an ON/OFF transition.
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HE910 Hardware User Guide
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10.3 RS232 level translation
In order to interface the HE910 with a PC com port or a RS232 (EIA/TIA-232) application
a level translator is required. This level translator must:
invert the electrical signal in both directions;
Change the level from 0/1.8V to +15/-15V.
Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with
lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio
on the level translator. Note that the negative signal voltage must be less than 0V and
hence some sort of level translation is always required.
The simplest way to translate the levels and invert the signal is by using a single chip
level translator. There are a multitude of them, differing in the number of drivers and
receivers and in the levels (be sure to get a true RS232 level translator not a RS485 or
other standards).
By convention the driver is the level translator from the 0-1.8V UART to the RS232 level.
The receiver is the translator from the RS232 level to 0-1.8V UART.
In order to translate the whole set of control lines of the UART you will need:
5 drivers
3 receivers
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An example of RS232 level adaptation circuitry could be done using a MAXIM
transceiver (MAX218)
In this case the chipset is capable to translate directly from 1.8V to the RS232 levels
(Example done on 4 signals only).
The RS232 serial port lines are usually connected to a DB9 connector with the following
layout:
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HE910 Hardware User Guide
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11 Audio Section Overview
The Audio of the HE910 Module is carried by DVI digital audio interface.
The audio port can be directly connected to end device using digital interface, or via one
of the several compliant codecs (in case an analog audio is needed).
NOTE: Audio Supported by HE910 and HE910-GA only
11.1 Electrical Characteristics
The product is providing the Digital Audio Interface (DVI) on the following Pins:
Digital Voice Interface (DVI)
PAD
Signal
I/O
B9
DVI_WA0
I/O
B6
DVI_RX
Function
Digital Audio Interface (Word Alignment /
LRCLK)
Digital Audio Interface (RX)
Note
Type
B7
DVI_TX
Digital Audio Interface (TX)
CMOS 1.8V
B8
DVI_CLK
I/O
Digital Audio Interface (BCLK)
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
11.1.1 CODEC Examples
Please refer to the HE910 Digital Audio Application note.
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12 General Purpose I/O
The HE910 module is provided by a set of Digital Input / Output pins
Input pads can only be read; they report the digital value (high or low) present on the
pad at the read time.
Output pads can only be written or queried and set the value of the pad output.
An alternate function pad is internally controlled by the HE910 firmware and acts
depending on the function implemented.
The following table shows the available GPIO on the HE910:
PAD
Signal
I/O
Function
Type
Drive
strength
Default
State
Note
C8
GPIO_01
I/O
Configurable GPIO
CMOS 1.8V
0.1 mA
INPUT
Alternate function STAT LED
C9
GPIO_02
I/O
Configurable GPIO
CMOS 1.8V
0.1 mA
INPUT
C10
GPIO_03
I/O
Configurable GPIO
CMOS 1.8V
0.1 mA
INPUT
C11
GPIO_04
I/O
Configurable GPIO
CMOS 1.8V
0.1 mA
INPUT
B14
GPIO_05
I/O
Configurable GPIO
CMOS 1.8V
0.1 mA
INPUT
C12
GPIO_06
I/O
Configurable GPIO
CMOS 1.8V
0.1 mA
INPUT
C13
GPIO_07
I/O
Configurable GPIO
CMOS 1.8V
0.1 mA
INPUT
K15
GPIO_08
I/O
Configurable GPIO
CMOS 1.8V
0.1 mA
INPUT
L15
GPIO_09
I/O
Configurable GPIO
CMOS 1.8V
0.1 mA
INPUT
G15
GPIO_10
I/O
Configurable GPIO
CMOS 1.8V
0.1 mA
INPUT
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VDD_IO1 has to be connected
to VIO1_1V8
VDD_IO1 has to be connected
to VIO1_1V8
VDD_IO1 has to be connected
to VIO1_1V8
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HE910 Hardware User Guide
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12.1 GPIO Logic levels
Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels.
The following table shows the logic level specifications used in the HE910 interface
circuits:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital pin (CMOS 1.8) with
respect to ground
-0.3V
3.1V
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level
1.5V
1.9V
Input low level
0V
0.35V
Output high level
1.6V
1.9
Output low level
0V
0.2V
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12.2 Using a GPIO Pad as INPUT
The GPIO pads, when used as inputs, can be connected to a digital output of another
device and report its status, provided this device has interface levels compatible with
the 1.8V CMOS levels of the GPIO.
If the digital output of the device to be connected with the GPIO input pad has interface
levels different from the 1.8V CMOS, then it can be buffered with an open collector
transistor with a 47K pull up to 1.8V.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH
logic level signal applied to the digital pins of the HE910 when the module is powered
off or during an ON/OFF transition.
12.3 Using a GPIO Pad as OUTPUT
The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or
compatible hardware. When set as outputs, the pads have a push-pull output and
therefore the pull-up resistor may be omitted.
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12.4 Indication of network service availability
The STAT_LED pin status shows information on the network service availability and
Call status. The function is available as alternate function of GPIO_01
In the HE910 modules, the STAT_LED needs an external transistor to drive an external
LED.
Therefore, the status indicated in the following table is reversed with respect to the pin
status.
LED status
Permanently off
Fast blinking
(Period 1s, Ton 0,5s)
Slow blinking
(Period 3s, Ton 0,3s)
Permanently on
Device Status
Device off
Net search / Not registered
/ turning off
Registered full service
a call is active
A schematic example could be:
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12.5 RTC Bypass out
The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of
the digital part, allowing having only RTC going on when all the other parts of the device
are off.
To this power output a backup capacitor can be added in order to increase the RTC
autonomy during power off of the battery. NO Devices must be powered from this pin.
12.6 External SIM Holder Implementation
Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a).
12.7 VAUX Power Output
A regulated power supply output is provided in order to supply small devices from the
module. The signal is present on Pad R11 and it is in common with the PWRMON
(module powered ON indication) function.
This output is always active when the module is powered ON.
The operating range characteristics of the supply are:
Level
Output voltage
Output current
Output bypass
capacitor
(inside the module)
Min
Typical
Max
1.78V
1.80V
1.82V
60mA
1uF
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HE910 Hardware User Guide
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13 Mounting the HE910 on the application
13.1 General
The HE910 modules have been designed in order to be compliant with a standard
lead-free SMT process.
13.2 Module finishing & dimensions
Pad B1
Lead Free Alloy
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13.3 Recommended foot print for the application
Top View
In order to easily rework the HE910 is suggested to consider on the application a 1.5 mm
placement inhibit area around the module.
It is also suggested, as common rule for an SMT component, to avoid having a mechanical
part of the application in direct contact with the module.
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HE910 Hardware User Guide
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13.4 Stencil
suggest a thickness of stencil foil ≥ 120 µm.
13.5 PCB pad design
Non solder mask defined (NSMD) type is recommended for the solder pads on the
PCB.
Copper Pad
Pad
Solder Mask
PCB
SMD
(Solder Mask Defined)
NSMD
(Non Solder Mask Defined)
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HE910 Hardware User Guide
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13.6 Recommendations for PCB pad dimensions (mm):
Solder resist openings
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HE910 Hardware User Guide
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It is not recommended to place via or micro-via not covered by solder resist in an area of 0,3
mm around the pads unless it carries the same signal of the pad itself (see following figure).
Inhibit area for micro-via
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
Electro-less Ni / Immersion
Au
Layer thickness [µm]
3 7 / 0.05
0.15
Properties
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the
lead-free process. This issue should be discussed with the PCB-supplier. Generally,
the wettability of tin-lead solder paste on the described surface plating is better
compared to lead-free solder paste.
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HE910 Hardware User Guide
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13.7 Solder paste
Solder paste
Lead free
Sn/Ag/Cu
modules after assembly.
13.7.1 HE910 Solder reflow
The following is the recommended solder reflow profile
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HE910 Hardware User Guide
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Profile Feature
Average ramp-up rate (TL to TP)
Preheat
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (min to max) (ts)
Tsmax to TL
Ramp-up Rate
Time maintained above:
Temperature (TL)
Time (tL)
Peak Temperature (Tp)
Time within 5°C of actual Peak
Temperature (tp)
Ramp-down Rate
Time 25°C to Peak Temperature
Pb-Free Assembly
3°C/second max
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
245 +0/-5°C
10-30 seconds
6°C/second max.
8 minutes max.
NOTE:
All temperatures refer to topside of the package, measured on the package
body surface
WARNING:
The HE910 module withstands one reflow process only.
NOTE:
It is not allowed to apply any pressure on the top surface of the module when
used in the application
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HE910 Hardware User Guide
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14 Packing system
The HE910 modules are packaged on trays of 20 pieces each. These trays can be used in SMT
processes for pick & place handling.
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HE910 Hardware User Guide
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HE910 Hardware User Guide
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WARNING:
These trays can withstand at the maximum temperature of 65° C.
14.1 Moisture sensitivity
The HE910 is a Moisture Sensitive Device level 3, in according with standard
IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of
components.
Moreover, the customer has to take care of the following conditions:
a) Calculated shelf life in sealed bag: 4 months at <40°C and <90% relative
humidity (RH).
b) Environmental condition during the production: 30°C / 60% RH according to
IPC/JEDEC J-STD-033A paragraph 5.
c) The maximum time between the opening of the sealed bag and the reflow process
-STDis
respected
d) Baking is required if conditions b) or c) are not respected
e) Baking is required if the humidity indicator inside the bag indicates 10% RH
or more
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HE910 Hardware User Guide
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15 SAFETY RECOMMANDATIONS
READ CAREFULLY
Be sure the use of this product is allowed in the country and in the environment
required. The use of this product may be dangerous and has to be avoided in the
following areas:
 Where it can interfere with other electronic devices in environments such as
hospitals, airports, aircrafts, etc
 Where there is risk of explosion such as gasoline stations, oil refineries, etc
It is responsibility of the user to enforce the country regulation and the specific
environment regulation.
Do not disassemble the product; any mark of tampering will compromise the warranty
validity.
We recommend following the instructions of the hardware user guides for a correct
wiring of the product. The product has to be supplied with a stabilized voltage source
and the wiring has to be conforming to the security and fire prevention regulations.
The product has to be handled with care, avoiding any contact with the pins because
electrostatic discharges may damage the product itself. Same cautions have to be
taken for the SIM, checking carefully the instruction for its use. Do not insert or remove
the SIM when the product is in power saving mode.
The system integrator is responsible of the functioning of the final product; therefore,
care has to be taken to the external components of the module, as well as of any
project or installation issue, because the risk of disturbing the GSM network or external
devices or having impact on the security. Should there be any doubt, please refer to the
technical documentation and the regulations in force.
Every module has to be equipped with a proper antenna with specific characteristics.
The antenna has to be installed with care in order to avoid any interference with other
electronic devices and has to guarantee a minimum distance from the body (20 cm). In
case of this requirement cannot be satisfied, the system integrator has to assess the
final product against the SAR regulation.
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HE910 Hardware User Guide
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The European Community provides some Directives for the electronic equipments
Community website:
http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm
The text of the Directive 99/05 regarding telecommunication equipments is available,
while the applicable Directives (Low Voltage and EMC) are available at:
http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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HE910 Hardware User Guide
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16 Conformity assessment issues
16.1 1999/5/EC Directive
The HE910, HE910-D and HE910-GA modules have been evaluated against the essential
requirements of the 1999/5/EC Directive.
Bulgarian
Czech
Danish
Dutch
English
Estonian
German
Greek
Hungarian
Finnish
French
Icelandic
Italian
С настоящето Telit Communications S.p.A. декларира, че 2G/3G module отговаря на
съществените изисквания и другите приложими изисквания на Директива
1999/5/ЕС.
Telit Communications S.p.A. tímto prohlašuje, že tento 2G/3G module je ve shodě se
základními požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES.
Undertegnede Telit Communications S.p.A. erklærer herved, at følgende udstyr 2G/3G
module overholder de væsentlige krav og øvrige relevante krav i direktiv 1999/5/EF.
Hierbij verklaart Telit Communications S.p.A. dat het toestel 2G/3G module in
overeenstemming is met de essentiële eisen en de andere relevante bepalingen van
richtlijn 1999/5/EG.
Hereby, Telit Communications S.p.A., declares that this 2G/3G module is in compliance
with the essential requirements and other relevant provisions of Directive 1999/5/EC.
Käesolevaga kinnitab Telit Communications S.p.A. seadme 2G/3G module vastavust
direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele
asjakohastele sätetele.
Hiermit erklärt Telit Communications S.p.A., dass sich das Gerät 2G/3G module in
Übereinstimmung mit den grundlegenden Anforderungen und den übrigen einschlägigen
Bestimmungen der Richtlinie 1999/5/EG befindet.
ΜΕ ΣΗΝ ΠΑΡΟΤ΢Α Telit Communications S.p.A. ΔΗΛΩΝΕΙ ΟΣΙ 2G/3G module
΢ΤΜΜΟΡΦΩΝΕΣΑΙ ΠΡΟ΢ ΣΙ΢ ΟΤ΢ΙΩΔΕΙ΢ ΑΠΑΙΣΗ΢ΕΙ΢ ΚΑΙ ΣΙ΢ ΛΟΙΠΕ΢ ΢ΥΕΣΙΚΕ΢
ΔΙΑΣΑΞΕΙ΢ ΣΗ΢ ΟΔΗΓΙΑ΢ 1999/5/ΕΚ.
Alulírott, Telit Communications S.p.A. nyilatkozom, hogy a 2G/3G module megfelel a
vonatkozó alapvetõ követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak.
Telit Communications S.p.A. vakuuttaa täten että 2G/3G module tyyppinen laite on
direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden ehtojen
mukainen.
Par la présente Telit Communications S.p.A. déclare que l'appareil 2G/3G module est
conforme aux exigences essentielles et aux autres dispositions pertinentes de la
directive 1999/5/CE.
Hér með lýsir Telit Communications S.p.A. yfir því að 2G/3G module er í samræmi við
grunnkröfur og aðrar kröfur, sem gerðar eru í tilskipun 1999/5/EC
Con la presente Telit Communications S.p.A. dichiara che questo 2G/3G module è
conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva
1999/5/CE.
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HE910 Hardware User Guide
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Ar šo Telit Communications S.p.A. deklarē, ka 2G/3G module atbilst Direktīvas
1999/5/EK būtiskajām prasībām un citiem ar to saistītajiem noteikumiem.
Lithuanian Šiuo Telit Communications S.p.A. deklaruoja, kad šis 2G/3G module atitinka esminius
reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas.
Maltese
Hawnhekk, Telit Communications S.p.A., jiddikjara li dan 2G/3G module jikkonforma
mal-ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-Dirrettiva
1999/5/EC.
Norwegian Telit Communications S.p.A. erklærer herved at utstyret 2G/3G module er i samsvar
med de grunnleggende krav og øvrige relevante krav i direktiv 1999/5/EF.
Polish
Niniejszym Telit Communications S.p.A. oświadcza, że 2G/3G module jest zgodny z
zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami Dyrektywy
1999/5/EC
Portuguese Telit Communications S.p.A. declara que este 2G/3G module está conforme com os
requisitos essenciais e outras disposições da Directiva 1999/5/CE.
Slovak
Telit Communications S.p.A. týmto vyhlasuje, že 2G/3G module spĺňa základné
požiadavky a všetky príslušné ustanovenia Smernice 1999/5/ES.
Slovenian Telit Communications S.p.A. izjavlja, da je ta 2G/3G module v skladu z bistvenimi
zahtevami in ostalimi relevantnimi določili direktive 1999/5/ES.
Spanish
Por medio de la presente Telit Communications S.p.A. declara que el 2G/3G module
cumple con los requisitos esenciales y cualesquiera otras disposiciones aplicables o
exigibles de la Directiva 1999/5/CE.
Swedish
Härmed intygar Telit Communications S.p.A. att denna 2G/3G module står I
överensstämmelse med de väsentliga egenskapskrav och övriga relevanta
bestämmelser som framgår av direktiv 1999/5/EG.
Latvian
In order to satisfy the essential requirements of 1999/5/EC Directive, the HE910 and
HE910-GA modules are compliant with the following standards:
RF spectrum use (R&TTE art. 3.2)
EMC (R&TTE art. 3.1b)
Health & Safety (R&TTE art. 3.1a)
EN 300 440-2 V1.4.1
EN 301 511 V9.0.2
EN 301 908-1 V4.2.1
EN 301 908-2 V4.2.1
EN 301 489-1 V1.8.1
EN 301 489-3 V1.4.1
EN 301 489-7 V1.3.1
EN 301 489-24 V1.5.1
EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011
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HE910 Hardware User Guide
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The HE910-D module is compliant with the following standards:
RF spectrum use (R&TTE art. 3.2)
EMC (R&TTE art. 3.1b)
Health & Safety (R&TTE art. 3.1a)
EN 301 511 V9.02
EN 301 908-1 V4.2.1
EN 301 908-2 V4.2.1
EN 301 489-1 V1.8.1
EN 301 489-7 V1.3.1
EN 301 489-24 V1.5.1
EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011
The conformity assessment procedure referred to in Article 10 and detailed in Annex IV of
Directive 1999/5/EC has been followed with the involvement of the following Notified Body:
AT4 wireless, S.A.
Parque Tecnologico de Andalucía
C/ Severo Ochoa 2
29590 Campanillas Málaga
SPAIN
Notified Body No: 1909
Thus, the following marking is included in the product:
1909
The full declaration of conformity can be found on the following address:
http://www.telit.com/
There is no restriction for the commercialisation of the HE910, HE910-D and HE910-GA modules
in all the countries of the European Union.
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HE910 Hardware User Guide
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Final product integrating this module must be assessed against essential requirements of the
1999/5/EC (R&TTE) Directive. It should be noted that assessment does not necessarily lead to
testing. Telit Communications S.p.A. recommends carrying out the following assessments:
RF spectrum use (R&TTE art. 3.2)
EMC (R&TTE art. 3.1b)
It will depend on the antenna used on the final
product.
Testing
Health & Safety (R&TTE art. 3.1a)
Testing
Alternately, assessment of the final product against EMC (Art. 3.1b) and Electrical safety (Art.
3.1a) essential requirements can be done against the essential requirements of the EMC and the
LVD Directives:
Low Voltage Directive 2006/95/EC and product safety
Directive EMC 2004/108/EC for conformity for EMC
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 78 of 80
HE910 Hardware User Guide
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16.2 FCC/IC Regulatory notices
Modification statement
Telit has not approved any changes or modifications to this device by the user. Any changes
Interference statement
This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS
standard(s). Operation is subject to the following two conditions: (1) this device may not cause
interference, and (2) this device must accept any interference, including interference that
may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils
radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1)
l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.
Wireless notice
This equipment complies with FCC and IC radiation exposure limits set forth for an
uncontrolled environment. The antenna should be installed and operated with minimum
distance of 20 cm between the radiator and your body. Antenna gain must be below:
GSM 850/FDD V: 5.22 dBi
PCS 1900/FDD II: 3.31 dBi
FDD IV: 6.45 dBi (not applicable to HE910-GA module)
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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HE910 Hardware User Guide
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Cet appareil est conforme aux limites d'exposition aux rayonnements de la IC pour un
environnement non contrôlé. L'antenne doit être installé de façon à garder une distance
minimale de 20 centimètres entre la source de rayonnements et votre corps. Gain de
l'antenne doit être ci-dessous:
GSM 850/FDD V: 5.22 dBi
PCS 1900/FDD II: 3.31 dBi
au module HE910-GA)
L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou
autre émetteur.
FCC Class B digital device notice
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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