Telit Communications S p A LE866SV1 LTE Module User Manual LE910 V2 Hardware User Guide

Telit Communications S.p.A. LTE Module LE910 V2 Hardware User Guide

HW user guide

1vv0301210 Rev.1 2015-09-02 LE866 HARDWARE USER GUIDE PRELIMINARY
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 2 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved APPLICABILITY TABLE PRODUCTS LE866-SV1
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 3 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved DISCLAIMER LEGAL NOTICE These Specifications are general guidelines pertaining to product selection and application and may not be appropriate for your particular project. Telit (which hereinafter shall include, its agents, licensors and affiliated companies) makes no representation as to the particular products identified in this document and makes no endorsement of any product. Telit disclaims any warranties, expressed or implied, relating to these specifications, including without limitation, warranties or merchantability, fitness for a particular purpose or satisfactory quality. Without limitation, Telit reserves the right to make changes to any products described herein and to remove any product, without notice. It is possible that this document may contain references to, or information about Telit products, services and programs, that are not available in your region. Such references or information must not be construed to mean that Telit intends to make available such products, services and programs in your area. USE AND INTELLECTUAL PROPERTY RIGHTS These Specifications (and the products and services contained herein) are proprietary to Telit and its licensors and constitute the intellectual property of Telit (and its licensors). All title and intellectual property rights in and to the Specifications (and the products and services contained herein) is owned exclusively by Telit and its licensors. Other than as expressly set forth herein, no license or other rights in or to the Specifications and intellectual property rights related thereto are granted to you. Nothing in these Specifications shall, or shall be deemed to, convey license or any other right under Telit’s patents, copyright, mask work or other intellectual property rights or the rights of others. You may not, without the express written permission of Telit: (i) copy, reproduce, create derivative works of, reverse engineer, disassemble, decompile, distribute, merge or modify in any manner these Specifications or the products and components described herein; (ii) separate any component part of the products described herein, or separately use any component part thereof on any equipment, machinery, hardware or system; (iii) remove or destroy any proprietary marking or legends placed upon or contained within the products or their components or these Specifications; (iv) develop methods to enable unauthorized parties to use the products or their components; and (v) attempt to reconstruct or discover any source code, underlying ideas, algorithms, file formats or programming or interoperability interfaces of the products or their components by any means whatsoever. No part of these Specifications or any products or components described herein may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without the prior express written permission of Telit.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 4 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved HIGH RISK MATERIALS Components, units, or third-party products contained or used with the products described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (“High Risk Activities"). Telit, its licensors and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities. TRADEMARKS You may not and may not allow others to use Telit or its third party licensors’ trademarks. To the extent that any portion of the products, components and any accompanying documents contain proprietary and confidential notices or legends, you will not remove such notices or legends. THIRD PARTY RIGHTS The software may include Third Party Right software. In this case you agree to comply with all terms and conditions imposed on you in respect of such separate software. In addition to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this License shall apply to the Third Party Right software. TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE. NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Copyright © Telit Communications PLC.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 5 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved CONTENTS 1 Introduction 8 Scope 8 Audience 8 Contact Information, Support 8 List of acronyms 9 Text Conventions 10 1.6. Related Documents 10 2 Overview 11 3 Pins Allocation 12 Pin-out 12 LGA Pads Layout 17 4 Power Supply 18 Power Supply Requirements 18 Power Consumption 19 General Design Rules 20 Electrical Design Guidelines 20 4.3.1.1 +5V Source Power Supply Design Guidelines 20 4.3.1.2 + 12V input Source Power Supply Design Guidelines 21 4.3.1.3 Battery Source Power Supply Design Guidelines 22 4.3.1.4 Thermal Design Guidelines 23 4.3.1.5 Power Supply PCB layout Guidelines 24 RTC 25 VAUX Power Output 25 5 Digital Section 26 Logic Levels Specification 26 Power on 27 Power off 29 Reset 30 Communication ports 33 USB 2.0 HS 33 Serial Ports 34 5.5.2.1 MODEM SERIAL PORT 1 (USIF0) 34 5.5.2.2 MODEM SERIAL PORT 2 (USIF1) 36 5.5.2.3 RS232 LEVEL TRANSLATION 36
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 6 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved General Purpose I/O 38 Using a GPIO as INPUT 39 Using a GPIO as OUTPUT 39 Indication of network service availability 39 SIMIN Detection 40 External SIM Holder 41 ADC Converter 42 DAC Converter 43 Enabling DAC 43 LOW Pass filter Example 44 6 RF Section 45 Bands Variants 45 TX Output Power 45 RX Sensitivity 45 Antenna Requirements 46 Main Antenna 46 RX Diversity Antenna 47 PCB design guidelines 47 PCB Guidelines in case of FCC Certification 49 6.4.4.1 Transmission line design 49 6.4.4.2 Transmission Line Measurements 50 6.4.4.3 Antenna Installation Guidelines 51 7 Audio Section 52 Overview 52 Digital Voice Interface 52 CODEC Examples 52 8 Mechanical Design 53 Drawing 53 9 Application Design 54 Footprint 54 PCB pad design 55 PCB pad dimensions 55 Stencil 57 Solder paste 57 Solder reflow 57 10 Packaging 59 Tray 59
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 7 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved Moisture sensitivity 61 11 SAFETY RECOMMANDATIONS 62 12 FCC/IC Regulatory notices 63 13 Document History 66 Revisions 66
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 8 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved 1 INTRODUCTION Scope The aim of this document is the description of some hardware solutions useful for developing a product with the Telit LE866 module. Audience This document is intended for Telit customers, who are integrators, about to implement their applications using our LE866 modules. Contact Information, Support For general contact, technical support services, technical questions and report documentation errors contact Telit Technical Support at: TS-EMEA@telit.com TS-AMERICAS@telit.com TS-APAC@telit.com Alternatively, use: http://www.telit.com/support For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit: http://www.telit.com Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Telit appreciates feedback from the users of our information.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 9 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved List of acronyms Acronym Description TTSC Telit Technical Support Centre USB Universal Serial Bus HS High Speed DTE Data Terminal Equipment LTE Long Term Evolution WCDMA Wideband Code Division Multiple Access HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access UART Universal Asynchronous Receiver Transmitter HSIC High Speed Inter Chip SIM Subscriber Identification Module SPI Serial Peripheral Interface ADC Analog – Digital Converter DAC Digital – Analog Converter I/O Input Output GPIO General Purpose Input Output CMOS Complementary Metal – Oxide Semiconductor MOSI Master Output – Slave Input MISO Master Input – Slave Output CLK Clock MRDY Master Ready SRDY Slave Ready CS Chip Select RTC Real Time Clock PCB Printed Circuit Board ESR Equivalent Series Resistance VSWR Voltage Standing Wave Radio VNA Vector Network Analyzer
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 10 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved Text Conventions Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction. Tip or Information – Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, i.e. YYYY-MM-DD. 1.6. Related Documents  Digital Voice Interface Application Note 80000NT10050A  SPI Port Application Note 80000NT10053A  SIM Holder Design Guides 80000NT10001A  LE866 AT Commands Reference Guide 80471ST10691A  Telit EVK2 User Guide 1vv0300704
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 11 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved 2 OVERVIEW The aim of this document is the description of some hardware solutions useful for developing a product with the Telit LE866 module. In this document all the basic functions of a mobile phone will be taken into account; for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced. Obviously this document cannot embrace the whole hardware solutions and products that may be designed. The wrong solutions to be avoided shall be considered as mandatory, while the suggested hardware configurations shall not be considered mandatory, instead the information given shall be used as a guide and a starting point for properly developing your product with the Telit LE866 module. For further hardware details that may not be explained in this document refer to the Telit LE866 Product Description document where all the hardware information is reported. NOTICE: (EN) The integration of the LTE LE866 cellular module within user application shall be done according to the design rules described in this manual. (IT) L’integrazione del modulo cellulare LTE LE866 all’interno dell’applicazione dell’utente dovrà rispettare le indicazioni progettuali descritte in questo manuale. (DE) Die Integration des LE866 LTE Mobilfunk-Moduls in ein Gerät muß gemäß der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen. (SL) Integracija LTE LE866 modula v uporabniški aplikaciji bo morala upoštevati projektna navodila, opisana v tem priročniku. (SP) La utilización del modulo LTE LE866 debe ser conforme a los usos para los cuales ha sido deseñado descritos en este manual del usuario. (FR) L’intégration du module cellulaire LTE LE866 dans l’application de l’utilisateur sera faite selon les règles de conception décrites dans ce manuel. (HE) The information presented in this document is believed to be accurate and reliable. However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in Telit products. This document is subject to change without notice. LE866
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 12 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved 3 PINS ALLOCATION Pin-out Pin Signal I/O Function Type Comment USB HS 2.0 COMMUNICATION PORT E5 USB_D+ I/O USB differential Data (+) - E6 USB_D- I/O USB differential Data (-) - Asynchronous Serial Port (USIF0) - Prog. / Data + HW Flow Control A4 C103/TXD I Serial data input (TXD) from DTE CMOS 1.8V A5 C104/RXD O Serial data output to DTE CMOS 1.8V A2 C108/DTR GPI_E I Input for (DTR) from DTE Alternate Function: GPIO CMOS 1.8V A1 C105/RTS GPI_F I Input for Request to send signal (RTS) from DTE Alternate Function: GPIO CMOS 1.8V B1 C106/CTS GPO_D O Output for Clear to send signal (CTS) to DTE Alternate Function: GPIO CMOS 1.8V B2 C109/DCD GPO_A O Output for (DCD) to DTE Alternate function: GPIO CMOS 1.8V A3 C107/DSR GPO_C O Output for (DSR) to DTE Alternate function: GPIO CMOS 1.8V B3 C125/RING GPO_B O Output for Ring (RI) to DTE Alternate Function: GPIO CMOS 1.8V Asynchronous Auxiliary Serial Port (USIF1) C1 TX_AUX O Auxiliary UART (TX Data to DTE) CMOS 1.8V C2 RX_AU I Auxiliary UART (RX Data from DTE) CMOS 1.8V SIM card interface C7 SIMVCC - External SIM signal – Power supply for the SIM 1.8V Only B7 SIMRST O External SIM signal – Reset CMOS 1.8 A7 SIMCLK O External SIM signal – Clock CMOS 1.8 A6 SIMIO I/O External SIM signal – Data I/O CMOS 1.8 X SIMIN I Presence SIM input CMOS 1.8 See next chapters DIGITAL IO C5 GPIO_01 DVI_WA0 SIM_IN I/O INT Main Function: GPIO01 Configurable GPIO Alternate function 1: Digital Audio Interface (WA0) Alternate Function 2: SIM_IN CMOS 1.8V C6 GPIO_02 DVI_RX JDR SIM_IN I/O INT Main Function: GPIO02 Configurable GPIO Alternate Function 1: Digital Audio Interface (RX) Alternate Function 2: SIM_IN CMOS 1.8V
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 13 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved D6 GPIO_03 DVI_TX SIM_IN I/O INT General Purpose IO Alternate Function 1: Digital Audio Interface (TX) Alternate Function 2: SIM_IN CMOS 1.8V D5 GPIO_04 DVI_CLK TX_DISABLE SIM_IN I/O INT Main Function: GPIO04 Configurable GPIO Alternate Function1: Digital Audio Interface (CLK) Alternate Function 2: TX Disable input Alternate Function 3: SIM_IN CMOS 1.8V B5 GPIO_05 RF_TX_MON SIM_IN I/O INT Main Function: GPIO05 Configurable GPIO Alternate Function 1: RF_TX_MON Alternate Function 2: SIM_IN CMOS 1.8V B4 GPIO_06 ALARM SIM_IN I/O INT Main Function: GPIO06 Configurable GPIO Alternate Function 1: ALARM Alternate Function 2: SIM_IN CMOS 1.8V C4 GPIO_07 STAT_LED SIM_IN I/O INT Main Function: GPIO07 Configurable GPIO Alternate Function 1: STATLED Alternate Function 2: SIM_IN CMOS 1.8V D8 VDDIO_IN I IO bus Supply input Power To be connected to VAUX (pad G6) ADC and DAC F4 ADC_IN1 AI Analog/Digital converter input A/D Accepted values 0 to 1.0V DC E4 DAC_OUT AO Digital/Analog converter output D/A RF SECTION G2 MAIN_ANT I/O LTE Main Antenna (50 ohm) RF C0 DIV_ANT I LTE RX Diversity Antenna (50 ohm) RF Miscellaneous Functions G4 RESET* I Reset Input VBATT Pull up to VBATT (10Kohm) G6 VAUX PWRMON O 1.8V stabilized output Power ON monitor Power Power Supply E2 VBATT - Main power supply (Baseband) Power E0 VBATT_PA - Main power supply (Radio PA) Power E1 VBATT_PA - Main power supply (Radio PA) Power B0 GND - Ground Power D0 GND - Ground Power F0 GND - Ground Power G0 GND - Ground Power D1 GND - Ground Power F1 GND - Ground Power G1 GND - Ground Power D2 GND - Ground Power F2 GND - Ground Power C3 GND - Ground Power
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 14 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved E3 GND - Ground Power F3 GND - Ground Power G3 GND - Ground Power F6 GND - Ground Power A8 GND - Ground Power G8 GND - Ground Power A11 GND - Ground Power G11 GND - Ground Power RESERVED A0 RESERVED - RESERVED D3 RESERVED - RESERVED G5 RESERVED - RESERVED B6 RESERVED - RESERVED D7 RESERVED - RESERVED E7 RESERVED - RESERVED F7 RESERVED - RESERVED G7 RESERVED - RESERVED B8 RESERVED - RESERVED C8 RESERVED - RESERVED E8 RESERVED - RESERVED F8 RESERVED - RESERVED A9 RESERVED - RESERVED B9 RESERVED - RESERVED C9 RESERVED - RESERVED D9 RESERVED - RESERVED E9 RESERVED - RESERVED F9 RESERVED - RESERVED G9 RESERVED - RESERVED A10 RESERVED - RESERVED B10 RESERVED - RESERVED C10 RESERVED - RESERVED D10 RESERVED - RESERVED E10 RESERVED - RESERVED F10 RESERVED - RESERVED G10 RESERVED - RESERVED
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 15 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved WARNING: Reserved pins must not be connected B11 RESERVED - RESERVED C11 RESERVED - RESERVED D4 RESERVED - RESERVED F5 RESERVED - RESERVED F11 RESERVED - RESERVED E11 RESERVED - RESERVED D11 RESERVED - RESERVED
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 16 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved If not used, almost all pins should be left disconnected. The only exceptions are the following pins: PAD Signal Note E2 VBATT E0 VBATT_PA E1 VBATT_PA B0, D0, F0, G0, D1, F1, G1, D2, F2, C3, E3, F3, G3, F6, A8, G8, A11, G11 GND G2 Main Antenna C0 Diversity Antenna A4 C103/TXD If not used should be connected to a Test Point A5 C104/RXD If not used should be connected to a Test Point A1 C105/RTS If not used should be connected to a Test Point B1 C106/CTS If not used should be connected to a Test Point G6 VAUX / PWRMON G4 RESET* C1 TXD_AUX If not used should be connected to a Test Point C2 RXD_AUX If not used should be connected to a Test Point E5 USB D+ If not used should be connected to a Test Point or an USB connector E6 USB D- If not used should be connected to a Test Point or an USB connector C7 SIMVCC B7 SIMRST A7 SIMCLK A6 SIMIO D8 VDDIO_IN To be connected to VAUX (R0 resistor in series for debug purposes) RTS pin should be connected to the GND (on the module side) if flow control is not used. The above pins are also necessary to debug the application when the module is assembled on it so we recommend connecting them also to dedicated test point.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 17 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved LGA Pads Layout TOP VIEW A B C D E F G 0 RESERVED GND DIV ANT GND VBATT_PA GND GND 1 C105/RTS C106/CTS TX AUX GND VBATT_PA GND GND 2 C108/DTR C109/DCD RX AUX GND VBATT GND MAIN ANT 3 C107/DSR C125/RING GND RESERVED GND GND GND 4 C103/TXD GPIO_06 GPIO_07 RESERVED DAC_OUT ADC_IN1 RESET* 5 C104/RXD GPIO_05 GPIO_01 GPIO_04 USB_D+ RESERVED RESERVED 6 SIMIO RESERVED GPIO_02 GPIO_03 USB_D- GND VAUX/PWRMON 7 SIMCLK SIMRST SIMVCC RESERVED RESERVED RESERVED RESERVED 8 GND RESERVED RESERVED VDDIO_IN RESERVED RESERVED GND 9 RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED 10 RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED 11 GND RESERVED RESERVED RESERVED RESERVED RESERVED GND
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 18 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved 4 POWER SUPPLY The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design. Power Supply Requirements The external power supply must be connected to VBATT & VBATT_PA signals and must fulfil the following requirements: Power Supply Value Nominal Supply Voltage 3.8V Normal Operating Voltage Range 3.40 V÷ 4.20 V Extended Operating Voltage Range 3.10 V÷ 4.50 V NOTE: The Operating Voltage Range MUST never be exceeded; care must be taken when designing the application’s power supply section to avoid having an excessive voltage drop. If the voltage drop is exceeding the limits it could cause a Power Off of the module. Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage (regarding MIN Extended Operating Voltage) MUST never be exceeded; The “Extended Operating Voltage Range” can be used only with completely assumption and application of the HW User guide suggestions.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 19 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved Power Consumption Mode Average (mA) Mode Description AT+CFUN=5 TBD Disabled TX and RX; DRX7 LTE Voice Call TBD Max Power LTE Data Call (Max Power) TBD LTE data call LTE Data Call (Min Power) TBD LTE data call NOTE: The electrical design for the Power supply should be made ensuring it will be capable of a peak current output of at least 1 A.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 20 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved General Design Rules The principal guidelines for the Power Supply Design embrace three different design steps:  the electrical design  the thermal design  the PCB layout. Electrical Design Guidelines The electrical design of the power supply depends strongly from the power source where this power is drained. We will distinguish them into three categories:  +5V input (typically PC internal regulator output)  +12V input (typically automotive)  Battery 4.3.1.1 +5V Source Power Supply Design Guidelines  The desired output for the power supply is 3.8V, hence there's not a big difference between the input source and the desired output and a linear regulator can be used. A switching power supply will not be suited because of the low drop out requirements.  When using a linear regulator, a proper heat sink shall be provided in order to dissipate the power generated.  A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks close to the Module, a 100μF capacitor is usually suited.  Make sure the low ESR capacitor on the power supply output rated at least 10V. An example of linear regulator with 5V input is:
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 21 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved 4.3.1.2 + 12V input Source Power Supply Design Guidelines  The desired output for the power supply is 3.8V, hence due to the big difference between the input source and the desired output, a linear regulator is not suited and shall not be used. A switching power supply will be preferable because of its better efficiency.  When using a switching regulator, a 500kHz or more switching frequency regulator is preferable because of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption.  In any case the frequency and Switching design selection is related to the application to be developed due to the fact the switching frequency could also generate EMC interferences.  For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind when choosing components: all components in the power supply must withstand this voltage.  A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100μF capacitor is usually suited.  Make sure the low ESR capacitor on the power supply output is rated at least 10V.  For Car applications a spike protection diode should be inserted close to the power input, in order to clean the supply from spikes. An example of switching regulator with 12V input is in the below schematic:
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 22 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved 4.3.1.3 Battery Source Power Supply Design Guidelines The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the power to the Telit LE866 module.  A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100μF tantalum capacitor is usually suited.  Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.  A protection diode should be inserted close to the power input, in order to save the LE866 from power polarity inversion. Otherwise the battery connector should be done in a way to avoid polarity inversions when connecting the battery.  The battery capacity must be at least 500mAh in order to withstand the current peaks of 2A; the suggested capacity is from 500mAh to 1000mAh. WARNING: The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB types MUST NOT BE USED DIRECTLY since their maximum voltage can rise over the absolute maximum voltage for the LE866 and damage it. NOTE: DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with LE866. Their use can lead to overvoltage on the LE866 and damage it. USE ONLY Li-Ion battery types.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 23 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved 4.3.1.4 Thermal Design Guidelines The thermal design for the power supply heat sink should be done with the following specifications:  Average current consumption during LTE transmission @PWR level max : 600 mA  Average current during idle: 1.5 mA Considering the very low current during idle, especially if Power Saving function is enabled, it is possible to consider from the thermal point of view that the device absorbs current significantly only during calls. If we assume that the device stays into transmission for short periods of time (let's say few minutes) and then remains for a quite long time in idle (let's say one hour), then the power supply has always the time to cool down between the calls and the heat sink could be smaller than the calculated one for 700mA maximum RMS current, or even could be the simple chip package (no heat sink). Moreover in the average network conditions the device is requested to transmit at a lower power level than the maximum and hence the current consumption will be less than the 700mA, being usually around 150mA. For these reasons the thermal design is rarely a concern and the simple ground plane where the power supply chip is placed can be enough to ensure a good thermal condition and avoid overheating. The generated heat will be mostly conducted to the ground plane under the LE866; you must ensure that your application can dissipate it. NOTE: The average consumption during transmissions depends on the power level at which the device is requested to transmit by the network. The average current consumption hence varies significantly.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 24 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved 4.3.1.5 Power Supply PCB layout Guidelines As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on the output to cut the current peaks on the input to protect the supply from spikes The placement of this component is crucial for the correct working of the circuitry. A misplaced component can be useless or can even decrease the power supply performances.  The Bypass low ESR capacitor must be placed close to the Telit LE866 power input pads or in the case the power supply is a switching type it can be placed close to the inductor to cut the ripple provided the PCB trace from the capacitor to the LE866 is wide enough to ensure a dropless connection even during an 1A current peak.  The protection diode must be placed close to the input connector where the power source is drained.  The PCB traces from the input connector to the power regulator IC must be wide enough to ensure no voltage drops occur when an 1A current peak is absorbed.  The PCB traces to the LE866 and the Bypass capacitor must be wide enough to ensure no significant voltage drops occur. This is for the same reason as previous point. Try to keep this trace as short as possible.  To reduce the EMI due to switching, it is important to keep very small the mesh involved; thus the input capacitor, the output diode (if not embodied in the IC) and the regulator have to form a very small loop.This is done in order to reduce the radiated field (noise) at the switching frequency (100-500 kHz usually).  A dedicated ground for the Switching regulator separated by the common ground plane is suggested.  The placement of the power supply on the board should be done in such a way to guarantee that the high current return paths in the ground plane are not overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier.  The power supply input cables should be kept separate from noise sensitive lines such as microphone/earphone cables.  The insertion of EMI filter on VBATT pins is suggested in those designs where antenna is placed close to battery or supply lines. A ferrite bead like Murata BLM18EG101TN1 or Taiyo Yuden P/N FBMH1608HM101 can be used for this purpose. The below figure shows the recommended circuit:
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 25 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved RTC The LE866 module is provided by an internal RTC section but its reference supply is VBATT. So, in order to maintain active the RTC programming, VBATT should not be removed VAUX Power Output A regulated power supply output is provided in order to supply small devices from the module. The signal is present on Pad G6 and it is in common with the PWRMON (module powered ON indication) function. This output is always active when the module is powered ON. The operating range characteristics of the supply are: Item Min Typical Max Output voltage 1.7V 1.80V 1.9V Output current - - 60mA Output bypass capacitor (inside the module) TBD NOTE: The Output Current MUST never be exceeded; care must be taken when designing the application section to avoid having an excessive current consumption. If the Current is exceeding the limits it could cause a Power Off of the module.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 26 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved 5 DIGITAL SECTION Logic Levels Specification ABSOLUTE MAXIMUM RATINGS – NOT FUNCTIONAL: OPERATING RANGE - INTERFACE LEVELS (1.8V CMOS): Parameter Min Max Input high level 1.55V 1.9V Input low level 0V 0.35V Output high level 1.35V 1.8V Output low level 0V 0.8V CURRENT CHARACTERISTICS: Parameter AVG Output Current TBD Input Current TBD Parameter Min Max Input level on any digital pin (CMOS 1.8) with respect to ground -0.3V 2.1V
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 27 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved Power on The LE866 will automatically power on itself when VBATT & VBATT_PA are applied to the module. VAUX / PWRMON pin will be at the high logic level and the module can be considered fully operating after 5 seconds. The following flow chart shows the proper turn on procedure: NOTE: The power supply must be applied either at the same time on pins VBATT and VBATT_PA. PWRMON=ON ? “Modem ON Proc” START PWR Supply ON PWRMON=ON ? Delay = 300 ms AT Init Sequence Enter AT<CR> N Delay 1s – 5s for Low Voltage Operating Y Y N Y Delay = 1 sec N Start AT CMD AT Answer in 1sec? Modem Reset Proc N Y
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 28 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved A flow chart showing the AT commands managing procedure is displayed below: NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the LE866 when the module is powered off or during an ON/OFF transition. “Start AT CMD” START Delay = 300 msec Enter AT <CR> Disconnect PWR Supply AT answer in 1 sec ? GO TO “Modem ON Proc.” “Start AT CMD” END Y N
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 29 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved Power off The following flowchart shows the proper Turn-off procedure: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the LE866 when the module is powered off or during an ON/OFF transition. “Modem OFF Proc” AT#SYSHALT 10s Timeout Disconnect PWR Supply “Modem ON Proc.” Delay 1.5s
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 30 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved Reset To unconditionally reboot the LE866, the pad RESET* must be tied low for at least 200 milliseconds and then released. The maximum current that can be drained from the RESET* pad is 0,15 mA. The hardware unconditional Restart must not be used during normal operation of the device since it does not detach the device from the network. It shall be kept as an emergency exit procedure to be done in the rare case that the device gets stuck waiting for some network or SIM responses. Do not use any pull up resistor on the RESET* line nor any totem pole digital output. Using pull up resistor may bring to latch up problems on the LE866 power regulator and improper functioning of the module. The line RESET* must be connected only in open collector configuration; the transistor must be connected as close as possible to the RESET* pin. The unconditional hardware restart must always be implemented on the boards and the software must use it as an emergency exit procedure. PIN DESCRIPTION Signal Function I/O PAD RESET* Unconditional Reset of the Module I G4 OPERATING LEVELS The RESET* line is connected to VBATT with a Pull Up so the electrical levels are on this pin are aligned to the main supply level. WARNING: The hardware unconditional Reset must not be used during normal operation of the device since it does not detach the device from the network. It shall be kept as an emergency exit procedure.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 31 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved A typical circuit is the following: NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the LE866 when the module is powered off or during an ON/OFF transition.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 32 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved In the following flow chart is detailed the proper restart procedure: NOTE: Do not use any pull up resistor on the RESET* line nor any totem pole digital output. Using pull up resistor may bring to latch up problems on the LE866 power regulator and improper functioning of the module. To proper power on again the module please refer to the related paragraph (“Power ON”) The unconditional hardware shutdown must always be implemented on the boards and should be used only as an emergency exit procedure. Modem RESET Proc. RESET* = LOW Delay = 200ms Start At CMD RESET* = HIGH Delay = 1s
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 33 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved Communication ports USB 2.0 HS The LE866 includes one integrated universal serial bus (USB 2.0 HS) transceiver. The following table is listing the available signals: PAD Signal I/O Function Type NOTE E5 USB_D+ I/O USB differential Data (+) 3.3V E6 USB_D- I/O USB differential Data (-) 3.3V The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz. The signal traces should be routed carefully. Trace lengths, number of vias and capacitive loading should be minimized. The characteristic impedance value should be as close as possible to 90 Ohms differential. In case there is a need to add an ESD protection, the suggested connection is the following:
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 34 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved Serial Ports The LE866 module is provided with by 2 Asynchronous serial ports:  MODEM SERIAL PORT 1 (Main)  MODEM SERIAL PORT 2 (Auxiliary) Several configurations can be designed for the serial port on the OEM hardware, but the most common are:  RS232 PC com port  microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit)  microcontroller UART @ 5V or other voltages different from 1.8V Depending from the type of serial port on the OEM hardware a level translator circuit may be needed to make the system work. On the LE866 the ports are CMOS 1.8. 5.5.2.1 MODEM SERIAL PORT 1 (USIF0) The serial port 1 on the LE866 is a +1.8V UART with all the 7 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels. The following table is listing the available signals: RS232 Pin Signal Pad Name Usage 1 C109/DCD Data Carrier Detect Output from the LE866 that indicates the carrier presence 2 C104/RXD Transmit line *see Note Output transmit line of LE866 UART 3 C103/TXD Receive line *see Note Input receive of the LE866 UART 4 C108/DTR Data Terminal Ready Input to the LE866 that controls the DTE READY condition 5 GND D1, F1, G1, D2, F2, C3, E3, F3, G3, F6, A8, G8, A11, G11Ground Ground 6 C107/DSR Data Set Ready Output from the LE866 that indicates the module is ready 7 C106/CTS Clear to Send Output from the LE866 that controls the Hardware flow control 8 C105/RTS Request to Send Input to the LE866 that controls the Hardware flow control 9 C125/RING Ring Indicator Output from the LE866 that indicates the incoming call condition
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 35 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved NOTE: According to V.24, some signal names are referred to the application side, therefore on the LE866 side these signal are on the opposite direction: TXD on the application side will be connected to the receive line (here named C103/TXD) RXD on the application side will be connected to the transmit line (here named C104/RXD) For a minimum implementation, only the TXD, RXD lines can be connected, the other lines can be left open provided a software flow control is implemented. In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the LE866 when the module is powered off or during an ON/OFF transition.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 36 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved 5.5.2.2 MODEM SERIAL PORT 2 (USIF1) The secondary serial port on the LE866 is a CMOS1.8V with only the RX and TX signals. The signals of the LE866 serial port are: PAD Signal I/O Function Type NOTE C1 TX_AUX O Auxiliary UART (TX Data to DTE) CMOS 1.8V Shared with SPI_MOSI C2 RX_AUX I Auxiliary UART (RX Data from DTE) CMOS 1.8V Shared with SPI_MISO NOTE: Due to the shared pins, when the Modem Serial port is used, it is not possible to use the SPI functions. In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the LE866 when the module is powered off or during an ON/OFF transition. 5.5.2.3 RS232 LEVEL TRANSLATION
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 37 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved In order to interface the LE866 with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required. This level translator must:  invert the electrical signal in both directions;  Change the level from 0/1.8V to +15/-15V. Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level translator. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required. The simplest way to translate the levels and invert the signal is by using a single chip level translator. There are a multitude of them, differing in the number of drivers and receivers and in the levels (be sure to get a true RS232 level translator not a RS485 or other standards). By convention the driver is the level translator from the 0-1.8V UART to the RS232 level. The receiver is the translator from the RS232 level to 0-1.8V UART. In order to translate the whole set of control lines of the UART you will need:  5 drivers  3 receivers An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver (MAX218) In this case the chipset is capable to translate directly from 1.8V to the RS232 levels (Example done on 4 signals only). The RS232 serial port lines are usually connected to a DB9 connector with the following layout:
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 38 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved General Purpose I/O The LE866 module is provided by a set of Configurable Digital Input / Output pins (CMOS 1.8V) Input pads can only be read; they report the digital value (high or low) present on the pad at the read time. Output pads can only be written or queried and set the value of the pad output. An alternate function pad is internally controlled by the LE866 firmware and acts depending on the function implemented. The following table shows the available GPIO on the LE866: PAD Signal I/O Drive Strength Default State NOTE C5 GPIO_01 I/O TBD mA INPUT Alternate functions: Digital Audio Interface (WA0 C6 GPIO_02 I/O TBD mA INPUT Alternate functions: Digital Audio Interface (RX) D6 GPIO_03 I/O TBD mA INPUT Alternate functions: Digital Audio Interface (TX) D5 GPIO_04 I/O TBD mA INPUT Alternate functions: TX Disable Digital Audio Interface (CLK) B5 GPIO_05 I/O TBD mA INPUT Alternate functions: TX_Monitor B4 GPIO_06 I/O TBD mA INPUT Alternate functions: ALARM C4 GPIO_07 I/O TBD mA INPUT Alternate functions: STAT LED NOTE: The internal GPIO’s pull up/pull down could be set to the preferred status for the application using the AT#GPIO command. Please refer for the AT Commands User Guide for the detailed command Syntax. WARNING: During power up the GPIOs may be subject to transient glitches.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 39 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved Also the UART’s control flow pins can be usable as GPIO: PAD Signal I/O Input/output current Default State ON_OFF state Reset State NOTE B2 GPO_A O TBD INPUT 0 0 Alternate function C109/DCD B3 GPO_B O TBD INPUT 0 0 Alternate function C125/RING A3 GPO_C O TBD INPUT 0 0 Alternate function C107/DSR A2 GPI_E I TBD INPUT 0 0 Alternate function C108/DTR A1 GPI_F I TBD INPUT 0 0 Alternate function C105/RTS B1 GPO_D O TBD INPUT 0 0 Alternate function C106/CTS Using a GPIO as INPUT The GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the 1.8V CMOS levels of the GPIO. If the digital output of the device to be connected with the GPIO input pad has interface levels different from the 1.8V CMOS, then it can be buffered with an open collector transistor with a 47K pull up to VAUX. NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the LE866 when the module is powered off or during an ON/OFF transition. The V_AUX / PWRMON pin can be used for input pull up reference or/and for ON monitoring. Using a GPIO as OUTPUT The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up resistor may be omitted. Indication of network service availability The STAT_LED pin status shows information on the network service availability and Call status. The function is available as alternate function of GPIO_07 (to be enabled using the AT#GPIO=7,0,2 command).
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 40 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved In the LE866 modules, the STAT_LED needs an external transistor to drive an external LED. Therefore, the status indicated in the following table is reversed with respect to the pin status. Device Status Led Status Device off Permanently off Not Registered Permanently on Registered in idle Blinking 1sec on + 2 sec off Registered in idle + power saving It depends on the event that triggers the wakeup (In sync with network paging) Voice Call Active Permanently on Dial-Up Blinking 1 sec on + 2 sec off A schematic example could be: SIMIN Detection All the GPIO pins can be used as SIM DETECT input. The AT Command used to enable the function is:
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 41 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved AT#SIMINCFG Use the AT command AT#SIMDET=2 to enable the SIMIN detection Use the AT command AT&W0 and AT&P0 to store the SIMIN detection in the common profile. NOTE: Don’t use the SIM IN function on the same pin where the GPIO function is enabled and vice versa! External SIM Holder Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a).
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 42 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved ADC Converter The LE866 is provided by one AD converter. It is able to read a voltage level in the range of 0÷1.2 volts applied on the ADC pin input, store and convert it into 10 bit word. The input line is named as ADC_IN1 and it is available on Pad F4 The following table is showing the ADC characteristics: Item Min Typical Max Unit Input Voltage range 0 - 1.0 Volt AD conversion - - 10 bits Input Resistance TBD - - Mohm Input Capacitance - TBD - pF The ADC could be controlled using an AT command. The command is AT#ADC=1,2 The read value is expressed in mV Refer to SW User Guide or AT Commands Reference Guide for the full description of this function.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 43 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved DAC Converter The LE866 provides a Digital to Analog Converter. The signal (named DAC_OUT) is available on pin E4 of the LE866. The on board DAC is a 10 bit converter, able to generate an analogue value based on a specific input in the range from 0 up to 1023. However, an external low-pass filter is necessary The following table is showing the ADC characteristics: Item Min Max Unit Voltage range (filtered) 0 1.8 Volt Range 0 1023 Steps The precision is 10 bits so, if we consider that the maximum voltage is 2V, the integrated voltage could be calculated with the following formula: Integrated output voltage = (2 *value) / 1023 DAC_OUT line must be integrated (for example with a low band pass filter) in order to obtain an analog voltage. Enabling DAC An AT command is available to use the DAC function. The command is: AT#DAC= [<enable> [, <value>]] <value> - scale factor of the integrated output voltage (0..1023 - 10 bit precision) it must be present if <enable>=1 Refer to SW User Guide or AT Commands Reference Guide for the full description of this function. NOTE: The DAC frequency is selected internally. D/A converter must not be used during POWERSAVING.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 44 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved LOW Pass filter Example
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 45 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved 6 RF SECTION Bands Variants The following table is listing the supported Bands: TX Output Power RX Sensitivity Product Supported 3G bands LE866-SV1 FDD B4, B13 Band Power Class FDD B4, B13 Class 3 (0.2W) Band Sensitivity FDD B4, B13 -102dBm
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 46 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved Antenna Requirements Main Antenna The antenna connection and board layout design are the most important aspect in the full product design as they strongly affect the product overall performances, hence read carefully and follow the requirements and the guidelines for a proper design. The antenna and antenna transmission line on PCB for a Telit LE866 device shall fulfil the following requirements: Item Value Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) Bandwidth LTE Band IV(1700) : 445 MHz LTE Band XIII(700) : 41 MHz Impedance 50 ohm Input power > 24dBm Average power VSWR absolute max ≤ 10:1 (limit to avoid permanent damage) VSWR recommended ≤ 2:1 (limit to fulfill all regulatory requirements)
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 47 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved RX Diversity Antenna This product is including an input for a second RX antenna to improve the data throughput. The function is called Antenna Diversity (downlink MIMO) in LTE. The second Rx antenna should not be located in the close vicinity of main antenna. In order to improve Diversity Gain, Isolation and reduce mutual interaction, the two antennas should be located at the maximum reciprocal distance possible, taking into consideration the available space into the application. For the same reason, the Rx antenna should also be cross-polarized with respect to the main antenna. Isolation between main antenna and Rx antenna must be at least 10 dB in all uplink frequency bands. Envelope Correlation Coefficient (ECC) value should be as close as possible to zero, for best diversity performance. ECC values below 0.5 on all frequency bands are recommended. PCB design guidelines When using the LE866, since there's no antenna connector on the module, the antenna must be connected to the LE866 antenna pad by means of a transmission line implemented on the PCB. In the case the antenna is not directly connected at the antenna pad of the LE866, then a PCB line is needed in order to connect with it or with its connector. This transmission line shall fulfil the following requirements: The transmission line should be designed according to the following guidelines: Item Value Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) Bandwidth LTE Band IV(1700) : 45 MHz LTE Band XIII(700) : 10 MHz Impedance 50 ohm VSWR recommended ≤ 2:1 (recommended for the best sensitivity performance) Item Value Characteristic Impedance 50 ohm Max Attenuation 0,3 dB Coupling Coupling with other signals shall be avoided Ground Plane Cold End (Ground Plane) of antenna shall be equipotential to the LE866 ground pins
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 48 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved  Ensure that the antenna line impedance is 50 ohm;  Keep the antenna line on the PCB as short as possible, since the antenna line loss shall be less than 0,3 dB;  Antenna line must have uniform characteristics, constant cross section; avoid meanders and abrupt curves;  Keep, if possible, one layer of the PCB used only for the Ground plane;  Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid having other signal tracks facing directly the antenna line track;  The ground around the antenna line on PCB has to be strictly connected to the Ground Plane by placing vias every 2mm at least;  Place EM noisy devices as far as possible from LE866 antenna line;  Keep the antenna line far away from the LE866 power supply lines;  If you have EM noisy devices around the PCB hosting the LE866, such as fast switching ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes, or shield it with a metal frame cover.  If you don't have EM noisy devices around the PCB of LE866, by using a micro strip on the superficial copper layer for the antenna line, the line attenuation will be lower than a buried one; The following image is showing the suggested layout for the Antenna pad connection:
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 49 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved PCB Guidelines in case of FCC Certification In the case FCC certification is required for an application using LE866-N3G, according to FCC KDB 996369 for modular approval requirements, the transmission line has to be similar to that implemented on LE866 interface board and described in the following chapter. 6.4.4.1 Transmission line design During the design of the LE866 interface board, the placement of components has been chosen properly, in order to keep the line length as short as possible, thus leading to lowest power losses possible. A Grounded Coplanar Waveguide (G-CPW) line has been chosen, since this kind of transmission line ensures good impedance control and can be implemented in an outer PCB layer as needed in this case. A SMA female connector has been used to feed the line. The interface board is realized on a FR4, 4-layers PCB. Substrate material is characterized by relative permittivity εr = 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @ 1 GHz. A characteristic impedance of nearly 50 Ω is achieved using trace width = 1.1 mm, clearance from coplanar ground plane = 0.3 mm each side. The line uses reference ground plane on layer 3, while copper is removed from layer 2 underneath the line. Height of trace above ground plane is 1.335 mm. Calculated characteristic impedance is 51.6 Ω, estimated line loss is less than 0.1 dB. The line geometry is shown below:
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 50 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved 6.4.4.2 Transmission Line Measurements An HP8753E VNA (Full-2-port calibration) has been used in this measurement session. A calibrated coaxial cable has been soldered at the pad corresponding to RF output; a SMA connector has been soldered to the board in order to characterize the losses of the transmission line including the connector itself. During Return Loss / impedance measurements, the transmission line has been terminated to 50 Ω load. Return Loss plot of line under test is shown below: Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load) is shown in the following figure:
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 51 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved Insertion Loss of G-CPW line plus SMA connector is shown below: 6.4.4.3 Antenna Installation Guidelines Install the antenna in a place covered by the LTE signal. If the device antenna is located farther than 20cm from the human body and there are no co-located transmitter then the Telit FCC/IC approvals can be re-used by the end product. If the device antenna is located closer than 20cm from the human body or there are co-located transmitter then the additional FCC/IC testing may be required for the end product (Telit FCC/IC approvals cannot be reused). Antenna shall not be installed inside metal cases. Antenna shall be installed also according to antenna manufacturer instructions.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 52 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved 7 AUDIO SECTION Overview The LE866 is provided by one Digital Audio Interface. Digital Voice Interface The LE866 Module is provided by one DVI digital voice interface. The Signals are available on the following Pads and alternate function of the GPIOs: PAD Signal I/O Function C5 DVI_WA0 I/O Digital Voice Interface (Word Alignment / LRCLK) C6 DVI_RX I Digital Voice Interface (RX) D6 DVI_TX O Digital Voice Interface (TX) D5 DVI_CLK I/O Digital Voice Interface (BCLK) CODEC Examples Please refer to the Digital Audio Application note.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 53 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved 8 MECHANICAL DESIGN Drawing The Dimensions are in mm
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 54 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved 9 APPLICATION DESIGN The LE866 modules have been designed in order to be compliant with a standard lead-free SMT process. Footprint TBD In order to easily rework the LE866 is suggested to consider on the application a 1.5 mm placement inhibit area around the module. It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module. NOTE: In the customer application, the region under WIRING INHIBIT (see figure above) must be clear from signal or ground paths.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 55 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved PCB pad design Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB. PCB pad dimensions The recommendation for the PCB pads dimensions are described in the following image (dimensions in mm) Solder resist openings PCB Copper PadSolder Mask SMD (Solder Mask Defined) NSMD (Non Solder Mask Defined)
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 56 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved It is not recommended to place via or micro-via not covered by solder resist in an area of 0,3 mm around the pads unless it carries the same signal of the pad itself (see following figure). Holes in pad are allowed only for blind holes and not for through holes. Recommendations for PCB pad surfaces: Finish Layer Thickness (um) Properties Electro-less Ni / Immersion Au 3 –7 / 0.05 – 0.15 good solder ability protection, high shear force values The PCB must be able to resist the higher temperatures which are occurring at the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste. It is not necessary to panel the application’s PCB, however in that case it is suggested to use milled contours and predrilled board breakouts; scoring or v-cut solutions are not recommended. Inhibit area for micro-via
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 57 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved Stencil Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120 µm. Solder paste Item Lead Free Solder Paste Sn/Ag/Cu We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after assembly. Solder reflow Recommended solder reflow profile:
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 58 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max Preheat – Temperature Min (Tsmin) – Temperature Max (Tsmax) – Time (min to max) (ts) 150°C 200°C 60-180 seconds Tsmax to TL – Ramp-up Rate 3°C/second max Time maintained above: – Temperature (TL) – Time (tL) 217°C 60-150 seconds Peak Temperature (Tp) 245 +0/-5°C Time within 5°C of actual Peak Temperature (tp) 10-30 seconds Ramp-down Rate 6°C/second max. Time 25°C to Peak Temperature 8 minutes max. NOTE: All temperatures refer to topside of the package, measured on the package body surface WARNING: THE LE866 MODULE WITHSTANDS ONE REFLOW PROCESS ONLY.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 59 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved 10 PACKAGING Tray The LE866 modules are packaged on trays of 20 pieces each. These trays can be used in SMT processes for pick & place handling.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 60 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 61 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved Moisture sensitivity The LE866 is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH). b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5. c) The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected d) Baking is required if conditions b) or c) are not respected e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 62 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved 11 SAFETY RECOMMANDATIONS READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas: Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc Where there is risk of explosion such as gasoline stations, oil refineries, etc It is responsibility of the user to enforce the country regulation and the specific environment regulation. Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for a correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conforming to the security and fire prevention regulations. The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode. The system integrator is responsible of the functioning of the final product; therefore, care has to be taken to the external components of the module, as well as of any project or installation issue, because the risk of disturbing the LTE network or external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force. Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation. The European Community provides some Directives for the electronic equipments introduced on the market. All the relevant information’s are available on the European Community website: http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm The text of the Directive 99/05 regarding telecommunication equipments is available, while the applicable Directives (Low Voltage and EMC) are available at: http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 63 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved 12 FCC/IC REGULATORY NOTICES Modification statement Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur. Interference statement This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Wireless notice This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled environment. The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body. Antenna gain must be below: Frequency Band Gain Band 4 (1700 MHz) TBD Band 13 (700 MHz) TBD This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 64 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved Cet appareil est conforme aux limites d'exposition aux rayonnements de la IC pour un environnement non contrôlé. L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et votre corps. Gain de l'antenne doit être ci-dessous: Bande de fréquence Gain Band 4 (1700 MHz) TBD Band 13 (700 MHz) TBD L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur. FCC Class B digital device notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Labelling Requirements for the Host device The host device shall be properly labelled to identify the modules within the host device. The certification label of the module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the FCC ID and IC of the module, preceded by the words "Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning, as follows: Contains FCC ID: RI7LE866SV1 Contains IC: 5131A-LE866SV1
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 65 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved L'appareil hôte doit être étiqueté comme il faut pour permettre l'identification des modules qui s'y trouvent. L'étiquette de certification du module donné doit être posée sur l'appareil hôte à un endroit bien en vue en tout temps. En l'absence d'étiquette, l'appareil hôte doit porter une étiquette donnant le FCC ID et le IC du module, précédé des mots « Contient un module d'émission », du mot « Contient » ou d'une formulation similaire exprimant le même sens, comme suit : Contains FCC ID: RI7LE866SV1 Contains IC: 5131A-LE866SV1 CAN ICES-3 (B) / NMB-3 (B) This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.
LE866 HARDWARE USER GUIDE 1vv0301210 Rev.0 – Preliminary • 2015-09-02 66 of 68 Reproduction forbidden without Telit Communications PLC written authorization – All Rights Reserved 13 DOCUMENT HISTORY Revisions Revision Date Changes 0 2015-03-27 Preliminary Version 1 2015-09-02 Updated chapters 3.1, 3.1.1

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