Telit Communications S p A LE910C1NS Wireless Module User Manual 1VV0301298 LE910Cx Hardware User Guide r1 04

Telit Communications S.p.A. Wireless Module 1VV0301298 LE910Cx Hardware User Guide r1 04

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LE910C1NS User Manual HTML Version

Users Guide

LE910Cx

Hardware User Guide

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Applicability Table

This documentation applies to the following products:

Table 1: Applicability Table

Module Name Description

LE910C1-NA North America – AT&T with global

roaming

LE910C1-NS North America - Sprint variant

LE910C1-AP APAC variant

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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Notice

While reasonable efforts have been made to assure the accuracy of this document, Telit assumes

no liability resulting from any inaccuracies or omissions in this document, or from use of the

information obtained herein. The information in this document has been carefully checked and is

believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or

omissions. Telit reserves the right to make changes to any products described herein and reserves

the right to revise this document and to make changes from time to time in the content hereof with

no obligation to notify any person of revisions or changes. Telit does not assume any liability arising

out of the application or use of any product, software, or circuit described herein; neither does it

convey any license under its patent rights or the rights of others.

It is possible that this publication may contain references to, or information about Telit products

(machines and programs), programming, or services that are not announced in your country. Such

references or information must not be construed to mean that Telit intends to announce such Telit

products, programming, or services in your country.

Copyrights

This instruction manual and the Telit products described in this instruction manual may be, include,

or describe copyrighted Telit material, such as computer programs stored in semiconductor

memories or other media. Laws in Italy and other countries preserve for Telit and its licensors

certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in

any form, distribute, and make derivative works of the copyrighted material. Accordingly, any

copyrighted material of Telit and its licensors contained herein or in the Telit products described in

this instruction manual may not be copied, reproduced, distributed, merged, or modified in any

manner without the express written permission of Telit. Furthermore, the purchase of Telit

products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any

license under the copyrights, patents or patent applications of Telit, as arises by operation of law

in the sale of a product.

Computer Software Copyrights

Telit and third-party software (SW) products described in this instruction manual may include

copyrighted Telit and other third-party computer programs stored in semiconductor memories or

other media. Laws in Italy and other countries preserve for Telit and other third-party SW certain

exclusive rights for copyrighted computer programs, including the exclusive right to copy or

reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or

other third-party SW computer programs contained in the Telit products described in this

instruction manual may not be copied (reverse engineered) or reproduced in any manner without

the express written permission of Telit or the third-party SW supplier. Furthermore, the purchase

of Telit products shall not be deemed to grant either directly or by implication, estoppel, or

otherwise, any license under the copyrights, patents or patent applications of Telit or other third-

party SW, except for the normal non-exclusive, royalty free license to use that arises by operation

of law in the sale of a product.

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Usage and Disclosure Restrictions

License Agreements

The software described in this document is the property of Telit and its licensors. It is furnished by

an express license agreement only and may be used only in accordance with the terms of such an

agreement.

Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is prohibited

by law. No part of the software or documentation may be reproduced, transmitted, transcribed,

stored in a retrieval system, or translated into any language or computer language, in any form or

by any means, without prior written permission of Telit.

High Risk Materials

Components, units, or third-party products used in the product described herein are NOT fault-

tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in

the following hazardous environments requiring fail-safe controls: the operation of nuclear

facilities, aircraft navigation or aircraft communication systems, air traffic control, life support, or

weapons systems (“high risk activities"). Telit and its supplier(s) specifically disclaim any expressed

or implied warranty of fitness for such high risk activities.

Trademarks

TELIT and the stylized T logo are trademarks and/or registered trademarks of Telit Communications

S.p.A. in the Unites States and/or other countries. All other product or service names are the

property of their respective owners.

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Contents

Introduction ..................................................................................................... 13

1.1.

Scope ................................................................................................................ 13

1.2.

Audience .......................................................................................................... 13

1.3.

Contact Information, Support .......................................................................... 13

1.4.

Text Conventions ............................................................................................. 14

1.5.

Related Documents .......................................................................................... 15

1.6.

Abbreviations ................................................................................................... 16

General Product Description ............................................................................ 17

2.1.

Overview .......................................................................................................... 17

2.2.

Applications ..................................................................................................... 17

2.3.

General Functionality and Main Features ....................................................... 18

2.4.

Block Diagram .................................................................................................. 21

2.5.

Environmental Requirements .......................................................................... 22

2.5.1.

Temperature Range .............................................................................. 22

2.5.2.

RoHS Compliance.................................................................................. 22

2.6.

Frequency Bands .............................................................................................. 23

2.6.1.

RF Bands per Regional Variant ............................................................. 23

2.6.2.

Reference Table of RF Bands Characteristics ....................................... 24

2.7.

Sensitivity ......................................................................................................... 26

2.8.

LE910Cx Mechanical Specifications ................................................................. 27

2.8.1.

Dimensions ........................................................................................... 27

2.8.2.

Weight .................................................................................................. 27

LE910Cx Module Connections ........................................................................... 28

3.1.

Pin-out .............................................................................................................. 28

3.2.

LE910Cx - Signals That Must Be Connected ..................................................... 39

3.3.

LGA Pads Layout ............................................................................................... 41

3.4.

Backward Compatibility to xE910 Family ........................................................ 42

Electrical Specifications .................................................................................... 43

4.1.

Absolute Maximum Ratings – Not Operational ............................................... 43

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4.2.

Recommended Operating Conditions ............................................................. 43

4.3.

Logic Level Specifications ................................................................................. 44

4.3.1.

1.8V Pads - Absolute Maximum Ratings ............................................... 44

4.3.2.

1.8V Standard GPIOs ............................................................................ 44

4.3.3.

1.8V SD Card Pads ................................................................................. 45

4.3.4.

1.8V SIM Card Pads ............................................................................... 45

4.3.5.

Dual Voltage Pads - Absolute Maximum Ratings ................................. 46

4.3.6.

SD Card Pads @ 2.95V .......................................................................... 46

4.3.7.

SIM Card Pads @2.95V ......................................................................... 47

Hardware Commands ....................................................................................... 48

5.1.

Turning on the LE910Cx Module ...................................................................... 48

5.2.

Initialization and Activation State .................................................................... 48

5.3.

Turning OFF the LE910Cx Module ................................................................... 50

5.3.1.

Shutdown by Software Command ....................................................... 50

5.3.2.

Hardware Shutdown ............................................................................. 51

5.3.4.

Unconditional Hardware Shutdown ..................................................... 52

Power Supply ................................................................................................... 53

6.1.

Power Supply Requirements............................................................................ 53

6.2.

General Design Rules ....................................................................................... 55

6.2.1.

Electrical Design Guidelines .................................................................. 55

6.2.1.1.

+ 5V Input Source Power Supply – Design Guidelines ......... 55

6.2.1.2.

+ 12V Input Source Power Supply – Design Guidelines ....... 56

6.2.1.3.

Battery Source Power Supply – Design Guidelines .............. 58

6.2.2.

Thermal Design Guidelines ................................................................... 59

6.2.3.

Power Supply PCB Layout Guidelines ................................................... 60

Antenna(s) ....................................................................................................... 61

7.1.

GSM/WCDMA/LTE Antenna Requirements ..................................................... 61

7.2.

GSM/WCDMA/LTE Antenna – PCB Line Guidelines ......................................... 62

7.3.

GSM/WCDMA/LTE Antenna – Installation Guidelines .................................... 63

7.4.

Antenna Diversity Requirements ..................................................................... 63

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7.5.

GNSS Antenna Requirements .......................................................................... 64

7.5.1.

Combined GNSS Antenna ..................................................................... 64

7.5.2.

Linear and Patch GNSS Antenna ........................................................... 64

7.5.3.

Front End Design Considerations ......................................................... 64

7.5.4.

GNSS Antenna – PCB Line Guidelines ................................................... 65

7.5.5.

GNSS Antenna – Installation Guidelines ............................................... 66

Hardware Interfaces......................................................................................... 67

8.1.

USB Port ........................................................................................................... 68

8.2.

HSIC Interface .................................................................................................. 69

8.3.

SGMII Interface (optional) ............................................................................... 69

8.3.1.

Ethernet Control interface ................................................................... 69

8.4.

Serial Ports ....................................................................................................... 70

8.4.1.

Modem Serial Port 1 Signals ................................................................. 71

8.4.2.

Modem Serial Port 2 ............................................................................. 72

8.4.3.

RS232 Level Translation ........................................................................ 73

8.5.

Peripheral Ports ............................................................................................... 75

8.5.1.

SPI – Serial Peripheral Interface ........................................................... 75

8.5.2.

I2C - Inter-integrated Circuit ................................................................ 76

8.5.3.

SD/MMC Card Interface ....................................................................... 76

8.5.4.

WiFi SDIO Interface .............................................................................. 78

8.6.

Audio Interface ................................................................................................ 80

8.6.1.

Digital Audio ......................................................................................... 80

8.6.1.1.

Short Frame Timing Diagrams .............................................. 81

8.6.1.2.

Long Frame Timing Diagrams ............................................... 83

8.7.

General Purpose I/O ........................................................................................ 85

8.7.1.

Using a GPIO Pad as Input .................................................................... 87

8.7.2.

Using a GPIO Pad as an interrupt / Wakeup source ............................. 87

8.7.3.

Using a GPIO Pad as Output ................................................................. 87

Miscellaneous Functions .................................................................................. 89

9.1.

Indication of Network Service Availability ....................................................... 89

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9.2.

Indication of Software Ready ........................................................................... 90

9.3.

RTC – Real Time Clock ...................................................................................... 90

9.4.

VAUX Power Output ........................................................................................ 90

9.5.

ADC Converter ................................................................................................. 91

9.5.1.

Description............................................................................................ 91

9.5.2.

Using the ADC Converter ...................................................................... 91

9.6.

Using the Temperature Monitor Function ...................................................... 91

9.7.

GNSS Characteristics ........................................................................................ 92

10.

Mounting the Module on your Board ............................................................... 93

10.1.

General ............................................................................................................. 93

10.2.

Finishing & Dimensions .................................................................................... 93

10.3.

Recommended Footprint for the Application ................................................. 96

10.4.

Stencil ............................................................................................................... 97

10.5.

PCB Pad Design ................................................................................................ 97

10.6.

Recommendations for PCB Pad Dimensions (mm) .......................................... 98

10.7.

Solder Paste ..................................................................................................... 99

10.7.1.

Solder Reflow ........................................................................................ 99

11.

Application Guide ........................................................................................... 101

11.1.

Debug of the LE910Cx Module in Production ................................................ 101

11.2.

Bypass Capacitor on Power Supplies ............................................................. 102

11.3.

SIM Interface .................................................................................................. 103

11.3.1.

SIM Schematic Example ...................................................................... 103

11.4.

EMC Recommendations ................................................................................. 104

11.5.

Download and Debug Port ............................................................................. 105

11.5.1.

Fast Boot mode................................................................................... 105

11.5.2.

Recovery Boot Mode .......................................................................... 105

12.

Packing System ............................................................................................... 106

12.1.

Packing system – Tray .................................................................................... 106

12.2.

Tape & Reel .................................................................................................... 108

12.3.

Moisture Sensitivity ....................................................................................... 110

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13.

Safety Recommendations ................................................................................ 111

14.

Conformity assessment issues ......................................................................... 112

14.1.

FCC/ISED Regulatory notices ........................................................................ 112

15.

Document History ........................................................................................... 115

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List of Tables

Table 1: Applicability Table ................................................................................................................. 2

Table 2: Related Documents ............................................................................................................ 15

Table 3: RF Bands per Regional Variant ............................................................................................ 23

Table 4: RF Bands Characteristics ..................................................................................................... 24

Table 5: LE910Cx Pin-out .................................................................................................................. 28

Table 6: Mandatory Signals .............................................................................................................. 39

Table 7: Absolute Maximum Ratings – Not Operational .................................................................. 43

Table 8: Recommended Operating Conditions ................................................................................ 43

Table 9: Absolute Maximum Ratings - Not Functional ..................................................................... 44

Table 10: Operating Range – Interface Levels (1.8V CMOS) ............................................................ 44

Table 11: Operating Range – SD Card Pads Working at 1.8V ........................................................... 45

Table 12: Operating Range – SIM Pads Working at 1.8V.................................................................. 45

Table 13: Absolute Maximum Ratings - Not Functional ................................................................... 46

Table 14: Operating Range – For SD Card Pads Operating at 2.95V ................................................ 46

Table 15: Operating Range – For SIM Pads Operating at 2.95V ....................................................... 47

Table 16: Power Supply Requirements ............................................................................................ 53

Table 17: LE910Cx Current Consumption ......................................................................................... 53

Table 18: GSM / WCDMA/ LTE Antenna Requirements ................................................................... 61

Table 19: Antenna Line on PCB Requirements ................................................................................. 61

Table 20: Antenna Diversity Requirements ...................................................................................... 63

Table 21: Antenna Line on PCB Requirements ................................................................................. 65

Table 22: LE910Cx Hardware Interfaces ........................................................................................... 67

Table 23: USB Interface Signals ........................................................................................................ 68

Table 25: Ethernet Control Interface Signals .................................................................................... 69

Table 24: Modem Serial Port 1 Signals ............................................................................................. 71

Table 25 Modem Serial Port 2 Signals .............................................................................................. 72

Table 26: SPI Signals ......................................................................................................................... 75

Table 27: SD Card Signals .................................................................................................................. 77

Table 28: WiFi SDIO Interface Signals ............................................................................................... 78

Table 29: Digital Audio Interface (DVI) Signals ................................................................................. 80

Table 30: PCM_CODEC Timing Parameters ...................................................................................... 82

Table 31: AUX_PCM_CODEC Timing Parameters ............................................................................. 84

Table 32: Primary GPIOs ................................................................................................................... 85

Table 33: Network Service Availability Indication ............................................................................ 89

Table 34: Operating Range – VAUX Power Supply ........................................................................... 90

Table 35: ADC Parameters ................................................................................................................ 91

The values are related to typical environment and conditions Table 36 GNSS Characteristics....... 92

Table 37: Recommendations for PCB Pad Surfaces ......................................................................... 98

Table 38: Solder Profile Characteristics .......................................................................................... 100

Table 39: SIM Interface – C1 Range ................................................................................................ 103

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Table 40: EMC Recommendations ................................................................................................. 104

Table 41: Document Revision History ............................................................................................ 115

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List of Figures

Figure 1: LE910Cx Block Diagram ..................................................................................................... 21

Figure 2: LGA Pads Layout ................................................................................................................ 41

Figure 3: LE910Cx vs. LE910 Pin-out Comparison (top view) ........................................................... 42

Figure 4: Power-on Circuit ................................................................................................................ 48

Figure 5: LE910Cx Initialization and Activation ................................................................................ 49

Figure 6: Shutdown by Software Command ..................................................................................... 50

Figure 7: Hardware Shutdown .......................................................................................................... 51

Figure 8: Circuit for Unconditional Hardware Shutdown ................................................................. 52

Figure 9 Power down timing using HW_SHUTDOWN_N ................................................................. 52

Figure 10: Example of Linear Regulator with 5V Input ..................................................................... 56

Figure 11: Example of Switching Regulator with 12V Input – Part 1 ................................................ 57

Figure 12: Example of Switching Regulator with 12V Input – Part 2 ................................................ 57

Figure 13: RS232 Level Adaption Circuitry Example ......................................................................... 73

Figure 14: RS232 Serial Port Lines Connection Layout ..................................................................... 74

Figure 15: SPI Signal Connectivity ..................................................................................................... 75

Figure 16: SD/MMC Interface Connectivity ...................................................................................... 77

Figure 17: Primary PCM Timing ........................................................................................................ 81

Figure 18: Auxiliary PCM Timing ....................................................................................................... 83

Figure 19: GPIO Output Pad Equivalent Circuit ................................................................................ 88

Figure 20: Status LED Reference Circuit ........................................................................................... 89

Figure 21: LE910Cx Mechanical Dimensions (bottom view) ............................................................ 93

Figure 22: LE910Cx Mechanical Dimensions (Top view) .................................................................. 94

Figure 23: LE910Cx Mechanical Dimensions (Side view) .................................................................. 95

Figure 24: Recommended Footprint - Top View, 181 pads (dimensions are in mm, top view). ...... 96

Figure 25: PCB Pad Design ................................................................................................................ 97

Figure 26: PCB Pad Dimensions ........................................................................................................ 98

Figure 27: Solder Reflow Profile ....................................................................................................... 99

Figure 28: SIM Schematics .............................................................................................................. 103

Figure 29: Packing ........................................................................................................................... 106

Figure 30: Tray Drawing .................................................................................................................. 107

Figure 31: Module Positioning into the Carrier .............................................................................. 108

Figure 32: Carrier Tape Detail ......................................................................................................... 108

Figure 33: Reel Detail ...................................................................................................................... 109

Figure 34: Reel Box Detail ............................................................................................................... 110

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1. Introduction

1.1. Scope

This document introduces the Telit LE910Cx module and presents possible and recommended

hardware solutions for developing a product based on the LE910Cx module. All the features and

solutions detailed in this document are applicable to all LE910Cx variants, where “LE910Cx” refers

to the variants listed in the applicability table.

If a specific feature is applicable to a specific product only, it will be clearly marked.

NOTE:

LE910Cx refers to all modules listed in the Applicability Table.

This document takes into account all the basic functions of a wireless module; a valid hardware

solution is suggested for each function, and incorrect solutions and common errors to be avoided

are pointed out.

Obviously, this document cannot embrace every hardware solution or every product that can be

designed. Obviously, avoiding invalid solutions must be considered mandatory. Where the

suggested hardware configurations need not be considered mandatory, the information given

should be used as a guide and a starting point for properly developing your product with the Telit

LE910Cx module.

NOTE:

The integration of the GSM/GPRS/EGPRS/WCDMA/HSPA+/LTE LE910Cx cellular module within a

user application must be done according to the design rules described in this manual.

1.2. Audience

This document is intended for Telit customers, especially system integrators, about to implement

their applications using the Telit LE910Cx module.

1.3. Contact Information, Support

For general contact, technical support, to report documentation errors and to order manuals,

contact Telit’s Technical Support Center (TTSC) at:

• TS-EMEA@telit.com

• TS-AMERICAS@telit.com

• TS-APAC@telit.com

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Alternatively, use:

http://www.telit.com/en/products/technical-support-center/contact.php

For detailed information about where you can buy the Telit modules or for recommendations on

accessories and components, visit:

http://www.telit.com

To register for product news and announcements or for product questions contact Telit’s

Technical Support Center (TTSC).

Our aim is to make this guide as helpful as possible. Keep us informed of your comments and

suggestions for improvements.

Telit appreciates feedback from the users about the information provided.

1.4. Text Conventions

The following conventions are used to emphasize specific types of information:

Danger:

This information MUST be followed or catastrophic equipment failure or bodily injury may

occur.

Caution or Warning:

Alerts the user to important points about integrating the module. If these points are not

followed, the module and end user equipment may fail or malfunction.

NOTE:

Tip or Information – Provides advice and suggestions that may be useful when integrating the

module.

All dates are in ISO 8601 format, that is, YYYY-MM-DD.

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1.5. Related Documents

Table 2: Related Documents

Document Title Document Number

Ref 1: LE9x0 AT Command User Guide 80407ST10116A

Ref 2: Telit EVB HW User Guide 1VV0301249

Ref 3: LE910Cx Interface Board HW User Guide 1VV0301323

Ref 4: LE910/LE920 Digital Voice Interface Application Note 80000NT11246A

Ref 5: Telit_LE920A4_LE910Cx_Wi-Fi_Interface_Application_Note_r1 80490NT11511A

Ref 6: Antenna Detection Application Note 80000NT10002A

Ref 7: High-Speed Inter-Chip USB Electrical Specification, version 1.0

(a supplement to the USB 2.0 specification, Section 3.8.2)

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1.6. Abbreviations

Term Definition

ADC Analog-to-digital converter

AE Application-enabled

DAC Digital-to-analog converter

DTE Data Terminal Equipment

FDD Frequency division duplex

GLONASS Global orbiting navigation satellite system

GNSS Global navigation satellite system

GPIO General-purpose input/output

GPRS General packet radio services

GPS Global positioning system

GSM Global system for mobile communications

HSIC High-speed inter-chip

I2C Inter-integrated circuit

LTE Long term evolution

SD Secure digital

SGMII Serial Gigabit media-independent interface

SIM Subscriber identity module

SOC System-on-Chip

SPI Serial peripheral interface

UART Universal asynchronous receiver transmitter

UMTS Universal mobile telecommunications system

USB Universal serial bus

WCI Wireless Coexistence Interface

WCDMA Wideband code division multiple access

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2. General Product Description

2.1. Overview

LE910Cx is Telit’s new LTE series for IoT applications.

In its most basic use case, LE910Cx can be applied as a wireless communication front-end for

telematics products, offering GNSS and mobile communication features to an external host CPU

through its rich interfaces.

LE910Cx is available in hardware variants as listed in Table 1: Applicability Table. For differences in

the designated RF band sets – refer to Section 2.6.1, RF Bands per Regional Variant.

2.2. Applications

LE910Cx can be used for telematics applications where tamper-resistance, confidentiality, integrity,

and authenticity of end-user information are required, for example:

• Emergency call

• Telematics services

• Road pricing

• Pay-as-you-drive insurance

• Stolen vehicles tracking

• Internet connectivity

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2.3. General Functionality and Main Features

The LE910Cx series of cellular modules features LTE and multi-RAT modem together with an on-

chip powerful application processor and a rich set of interfaces.

The major functions and features are listed below:

Function Features

Modem • Multi-RAT cellular modem for voice and data communication

o LTE FDD Cat1 (Other variants) (10/5Mbps DL/UL).

o Carrier aggregation is not supported

o GSM/GPRS/EDGE

o WCDMA up to DC HSPA+, Rel.9

• Support for European eCall , US E911, and ERA Glonass

• Support for SIM profile switching

• Regional variants with optimal choice of RF bands for worldwide

coverage of countries and MNOs

• State-of-the-art GNSS solution with

GPS/GLONASS/BeiDou/Galileo/QZSS receiver

Digital audio

subsystem

• PCM/I2S digital audio interface

• Up to 48 kHz sample rate, 16 bit words

Two USIM ports –

dual voltage

• Class B and Class C support

• Hot swap support

• Clock rates up to 4 MHz

Application

processor

Application processor to run customer application code

• 32 bit ARM Cortex-A7 up to 1.3 GHz running the Linux operating

system

• Flash + DDR are large enough to allow for customer’s own

software applications

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Function Features

Interfaces Rich set of interfaces, including:

• SD/MMC Card Interface supporting SD3.0 standard

• SDIO for external WiFi transceiver supporting SDIO3.0 standard

• SGMII for external Ethernet transceiver (optional)

o Compliant with IEEE802.3

o Full duplex operation at 1 Gbps

o Half/full duplex operation at 10/100 Mbps

o Support for VLAN tagging

o Support for IEEE1588, PTP (Precision Time Protocol)

• USB2.0 – USB port is typically used for:

o Flashing of firmware and module configuration

o Production testing

o Accessing the Application Processor’s file system

o AT command access

o High-speed WWAN access to external host

o Diagnostic monitoring and debugging

o Communication between Java application environment and an

external host CPU

o NMEA data to an external host CPU

• HSIC

o High-speed 480 Mbps (240 MHz DDR) USB transfers are 100% host

driver compatible with traditional USB cable connected topologies

o Bidirectional data strobe signal (STROBE)

o Bidirectional data signal (DATA)

o No power consumption unless a transfer is in progress

o Maximum trace length 10 cm

o Signals driven at 1.2V standard LVCMOS levels

• Peripheral Ports – SPI, I2C, UART

• GPIOs

• Antenna ports

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Function Features

Form factor Form factor (28x28mm), accommodating the multiple RF bands in each

region variant

Environment and

quality

requirements

The entire module is designed and qualified by Telit for satisfying the

environment and quality requirements.

Single supply

module

The module generates all its internal supply voltages.

RTC No dedicated RTC supply, RTC is supplied by VBATT

Operating

temperature

Range -40 °C to +85 °C (conditions as defined in Section 2.5.1, Temperature

Range).

NOTE:

The following interfaces are unique for the LE910Cx and may not be supported on other (former

or future) xE910 family. Special care must be taken when designing the application board if

future compatibility is required:

- SGMII for Ethernet connectivity

- SDIO for WIFI connectivity

- SD/MMC for SD Card connectivity

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2.4. Block Diagram

Figure 1 shows an overview of the internal architecture of the LE910Cx module.

It includes the following sub-functions:

• Application processor, Modem subsystem and Location processing with their external

interfaces. These three functions are contained in a single SOC.

• RF front end, including antenna diagnosis circuitry

• Analog Audio codec for attaching external speaker amplifier and microphone

• Rich IO interfaces. Depending on which LE910Cx software features are enabled, some of its

interfaces that are exported due to multiplexing may be used internally and thus may not

be usable by the application.

• PMIC with the RTC function inside

Figure 1: LE910Cx Block Diagram

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2.5. Environmental Requirements

2.5.1. Temperature Range

Operating

temperature range

-20 ~ +55°C.

This range is defined by 3GPP (the global standard for wireless mobile

communication). Telit guarantees its modules to comply with all the

3GPP requirements and to have full functionality of the module with

in this range.

-40 ~ +85°C.

Telit guarantees full functionality within this range as well. However,

there may possibly be some performance deviations in this extended

range relative to 3GPP requirements, which means that some RF

parameters may deviate from the 3GPP specification in the order of a

few dB. For example: receiver sensitivity or maximum output power

may be slightly degraded.

Even so, all the functionalities, such as call connection, SMS, USB

communication, UART activation etc., will be maintained, and the

effect of such degradations will not lead to malfunction.

Storage and non-

operating

temperature range

–40°C ~ +85°C

2.5.2. RoHS Compliance

As a part of the Telit corporate policy of environmental protection, the LE910Cx complies with the

RoHS (Restriction of Hazardous Substances) directive of the European Union (EU directive

2011/65/EU).

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2.6. Frequency Bands

The operating frequencies in GSM850, EGSM900, DCS1800, PCS1900, WCDMA & LTE modes

conform to the 3GPP specifications.

2.6.1. RF Bands per Regional Variant

Table 3 summarizes all region variants within the LE910Cx family, showing the supported band

sets in each variant.

Table 3: RF Bands per Regional Variant

Region

Variant

LTE FDD LTE TDD HSPA+ TD-

SCDMA

LE910C1-NA 2, 4, 12 - 1, 2, 4, 5, 8 - 2, 3, 5, 8

LE910C1-NS 2, 4, 5, 12, 25, 26 - - - -

LE910C1-AP 1, 3, 5, 8, 28 - 1, 5, 8 - -

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2.6.2. Reference Table of RF Bands Characteristics

Table 4: RF Bands Characteristics

Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset

PCS 1900 1850.2 ~ 1909.8 1930.2 ~ 1989.8 512 ~ 810 80 MHz

DCS 1800 1710 ~ 1785 1805 ~ 1880 512 ~ 885 95 MHz

GSM 850 824.2 ~ 848.8 869.2 ~ 893.8 128 ~ 251 45 MHz

EGSM 900 890 ~ 915 935 ~ 960 0 ~ 124 45 MHz

880 ~ 890 925 ~ 935 975 ~ 1023 45 MHz

WCDMA 2100 –

1920 ~ 1980 2110 ~ 2170 Tx: 9612 ~ 9888

Rx: 10562 ~ 10838

190 MHz

WCDMA 1900 –

1850 ~ 1910 1930 ~ 1990 Tx: 9262 ~ 9538

Rx: 9662 ~ 9938

80 MHz

WCDMA 1800 –

1710 ~ 1785 1805 ~ 1880 Tx: 937 ~ 1288

Rx: 1162 ~ 1513

95 MHz

WCDMA AWS –

1710 ~ 1755 2110 ~ 2155 Tx: 1312 ~ 1513

Rx: 1537 ~ 1738

400 MHz

WCDMA 850 – B5 824 ~ 849 869 ~ 894 Tx: 4132 ~ 4233

Rx: 4357 ~ 4458

45 MHz

WCDMA 900 – B8 880 ~ 915 925 ~ 960 Tx: 2712 ~ 2863

Rx: 2937 ~ 3088

45 MHz

WCDMA 1800 –

1750 ~ 1784.8 1845 ~ 1879.8 Tx: 8762 ~ 8912

Rx: 9237 ~ 9387

95 MHz

WCDMA 800 –

B19

830 ~ 845 875 ~ 890 Tx: 312 ~ 363

Rx: 712 ~ 763

45 MHz

TDSCDMA 2000 –

B34

2010 ~ 2025 2010 ~ 2025 Tx: 10054 ~ 10121

Rx: 10054 ~ 10121

0 MHz

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Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset

TDSCDMA 1900 –

B39

1880 ~ 1920 1880 ~ 1920 Tx: 9404 ~ 9596

Rx: 9404 ~ 9596

0 MHz

LTE 2100 – B1 1920 ~ 1980 2110 ~ 2170 Tx: 18000 ~ 18599

Rx: 0 ~ 599

190 MHz

LTE 1900 – B2 1850 ~ 1910 1930 ~ 1990 Tx: 18600 ~ 19199

Rx: 600 ~ 1199

80 MHz

LTE 1800 – B3 1710 ~ 1785 1805 ~ 1880 Tx: 19200 ~ 19949

Rx: 1200 ~ 1949

95 MHz

LTE AWS – B4 1710 ~ 1755 2110 ~ 2155 Tx: 19950 ~ 20399

Rx: 1950 ~ 2399

400 MHz

LTE 850 – B5 824 ~ 849 869 ~ 894 Tx: 20400 ~ 20649

Rx: 2400 ~ 2649

45 MHz

LTE 2600 – B7 2500 ~ 2570 2620 ~ 2690 Tx: 20750 ~ 21449

Rx: 2750 ~ 3449

120 MHz

LTE 900 – B8 880 ~ 915 925 ~ 960 Tx: 21450 ~ 21799

Rx: 3450 ~ 3799

45 MHz

LTE 1800 – B9 1749.9 ~ 1784.9 1844.9 ~ 1879.9 Tx: 21800 ~ 2149

Rx: 3800 ~ 4149

95 MHz

LTE AWS+ – B10 1710 ~ 1770 2110 ~ 2170 Tx: 22150 ~ 22749

Rx: 4150 ~ 4749

400 MHz

LTE 700a – B12 699 ~ 716 729 ~ 746 Tx : 23010 ~ 23179

Rx : 5010 ~ 5179

30 MHz

LTE 700c – B13 777 ~ 787 746 ~ 756 Tx : 27210 ~ 27659

Rx : 9210 ~ 9659

-31 MHz

LTE 700b – B17 704 ~ 716 734 ~ 746 Tx: 23730 ~ 23849

Rx: 5730 ~ 5849

30 MHz

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Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset

LTE 800 – B19 830 ~ 845 875 ~ 890 Tx: 24000 ~ 24149

Rx: 6000 ~ 6149

45 MHz

LTE 800 – B20 832 ~ 862 791 ~ 821 Tx: 24150 ~ 24449

Rx: 6150 ~ 6449

-41 MHz

LTE 1500 – B21 1447.9 ~ 1462.9 1495.9 ~ 1510.9 Tx: 24450 ~ 24599

Rx: 6450 ~ 6599

48 MHz

LTE 1900+ – B25 1930 ~ 1995 1850 ~ 1915 Tx: 26040 ~ 26689

Rx: 8040 ~ 8689

80 MHz

LTE 850+ – B26 814 ~ 849 859 ~ 894 Tx: 26690 ~ 27039

Rx: 8690 ~ 9039

45 MHz

LTE 700 – B28 703 ~ 748 758 ~ 803 Tx : 27210 ~ 27659

Rx : 9210 ~ 9659

45 MHz

LTE TDD 2600 –

B38

2570 ~ 2620 2570 ~ 2620 Tx: 37750 ~ 38250

Rx: 37750 ~ 38250

0 MHz

LTE TDD 1900 –

B39

1880 ~ 1920 1880 ~ 1920 Tx: 38250 ~ 38650

Rx: 38250 ~ 38650

0 MHz

LTE TDD 2300 –

B40

2300 ~ 2400 2300 ~ 2400 Tx: 38650 ~ 39650

Rx: 38650 ~ 39650

0 MHz

LTE TDD 2500 –

B41

2496 ~ 2690 2496 ~ 2690 Tx: 39650 ~ 41590

Rx: 39650 ~ 41590

0 MHz

2.7. Sensitivity

LE910Cx maximum sensitivity levels are as follow:

• -108 dBm (TBD) @ 2G

• -111 dBm (TBD) @ 3G

• -102 dBm (TBD) @ 4G FDD (BW=5 MHz)

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2.8. LE910Cx Mechanical Specifications

2.8.1. Dimensions

The LE910Cx module’s overall dimensions are:

• Length: 28.2 mm, +/- 0.15 mm Tolerance

• Width: 28.2 mm, +/- 0.15 mm Tolerance

• Thickness: 2.2 mm, +/- 0.22 mm Tolerance

2.8.2. Weight

The nominal weight of the LE910Cx module is 9.0 gram.

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3. LE910Cx Module Connections

3.1. Pin-out

Table 5: LE910Cx Pin-out

PAD Signal I/O Function Type Comment

USB HS 2.0 Communication Port

B15 USB_D+ I/O USB differential Data(+)

C15 USB_D- I/O USB differential Data(-)

A13 USB_VBUS AI Power sense for the internal USB

transceiver

Power 2.5V – 5.5V

A14 USB_ID AI USB ID See note below

Asynchronous UART

N15 C103/TXD I Serial data input (TXD) from DTE 1.8V

M15 C104/RXD O Serial data output to DTE 1.8V

L14 C105/RTS I Input for Request to send signal (RTS)

from DTE

1.8V

P15 C106/CTS O Output for Clear to send signal (CTS) to

DTE

1.8V

P14 C107/DSR O Output for Data Set Ready (DSR) to DTE 1.8V Alternate Fn GPIO_32

M14 C108/DTR I Input for Data Terminal Ready (DTR)

from DTE

1.8V Alternate Fn GPIO_34

N14 C109/DCD O Output for Data Carrier Detect (DCD) to

DTE

1.8V Alternate Fn GPIO_33

R14 C125/RING O Output for Ring Indication (RI) to DTE 1.8V Alternate Fn GPIO_31

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SPI – Serial Peripheral Interface / AUX UART

F15 SPI_CLK O SPI Clock output 1.8V

E15 SPI_MISO/ RX_AUX I SPI data Master Input Slave output /

RX_AUX

1.8V

D15 SPI_MOSI/TX_AUX O SPI data Master Output Slave input/

TX_AUX

1.8V

H14 SPI_CS/GPIO11 O SPI Chip select output / GPIO11 1.8V See note below

SD/MMC Card Digital I/O

J12 SD/MMC_CMD O SD Command 1.8/2.95V

F12 SD/MMC_CLK O SD Card Clock 1.8/2.95V

E12 SD/MMC_DATA0 I/O SD Serial Data 0 1.8/2.95V

G12 SD/MMC_DATA1 I/O SD Serial Data 1 1.8/2.95V

K12 SD/MMC_DATA2 I/O SD Serial Data 2 1.8/2.95V

H12 SD/MMC_DATA3 I/O SD Serial Data 3 1.8/2.95V

G13 SD/MMC_CD I SD card detect input 1.8V Active Low

F13 VMMC - Power supply for MMC card pull-up

resistors

1.8/2.95V

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WiFi (SDIO) Interface

N13 WiFi_SD_CMD O Wi-Fi SD Command 1.8V

L13 WiFi_SD_CLK O Wi-Fi SD Clock 1.8V

J13 WiFi_SD_DATA0 I/O Wi-Fi SD Serial Data 0 1.8V

M13 WiFi_SD_DATA1 I/O Wi-Fi SD Serial Data 1 1.8V

K13 WiFi_SD_DATA2 I/O Wi-Fi SD Serial Data 2 1.8V

H13 WiFi_SD_DATA3 I/O Wi-Fi SD Serial Data 3 1.8V

L12 WiFi_SDRST O Wi-Fi Reset / Power enable control 1.8V Active Low

M11 WLAN_SLEEP_CLK

O Wi-Fi Sleep clock output 1.8V

M10 RFCLK2_QCA

O Wi-Fi low noise RF clock output 1.8V

LTE-WiFi Coexistence

M8 WCI_TX O Wireless coexistence interface TXD 1.8V

M9 WCI_RX

I Wireless coexistence interface RXD 1.8V

SIM Card Interface 1

A6 SIMCLK1 O External SIM 1 signal – Clock 1.8/2.85V

A7 SIMRST1 O External SIM 1 signal – Reset 1.8/2.85V

A5 SIMIO1 I/O External SIM 1 signal - Data I/O 1.8/2.85V Internally PU 20 kΩ

to SIMVCC1

A4 SIMIN1 I External SIM 1 signal - Presence 1.8V Active low

A3 SIMVCC1 - External SIM 1 signal – Power supply for

SIM 1

1.8/2.85V

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SIM Card Interface 2

C1 SIMCLK2 O External SIM 2 signal – Clock 1.8/2.85V

D1 SIMRST2 O External SIM 2 signal – Reset 1.8/2.85V

C2 SIMIO2 I/O External SIM 2 signal – Data I/O 1.8/2.85V Internally PU

20kΩ to SIMVCC2

G4 SIMIN2 I External SIM 2 signal – Presence 1.8V Active low

D2 SIMVCC2 - External SIM 2 signal – Power supply for SIM 2 1.8/2.85V

Digital Voice Interface (DVI)

B9 DVI_WAO O Digital Voice interface (WAO master output) 1.8V

B6 DVI_RX I Digital Voice interface (Rx) 1.8V

B7 DVI_TX O Digital Voice interface (Tx) 1.8V

B8 DVI_CLK O Digital Voice interface (CLK master output) 1.8V

B12 REF_CLK O Reference clock for external Codec 1.8V See Note below

General Purpose Digital I/O

C8 GPIO_01 I/O GPIO_01 / STAT_LED 1.8V Alternate Fn I2C

C9 GPIO_02 I/O GPIO_02 1.8V Alternate Fn I2C

C10 GPIO_03 I/O GPIO_03 1.8V Alternate Fn I2C

C11 GPIO_04 I/O GPIO_04 1.8V Alternate Fn I2C

B14 GPIO_05 I/O GPIO_05 1.8V Alternate Fn I2C

C12 GPIO_06 I/O GPIO_06 1.8V Alternate Fn I2C

C13 GPIO_07 I/O GPIO_07 1.8V Alternate Fn I2C

K15 GPIO_08 I/O GPIO_08 / SW_RDY 1.8V Alternate Fn I2C

L15 GPIO_09 I/O GPIO_09 1.8V Alternate Fn I2C

G15 GPIO_10 I/O GPIO_10 1.8V Alternate Fn I2C

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RF Section

K1 Antenna I/O GSM/EDGE/UMTS/LTE Main antenna

(50 Ohm)

F1 ANT_DIV I UMTS/LTE antenna diversity input (50 Ohm) RF

GPS Section

R9 ANT_GPS I GPS antenna (50 Ohm) RF

R7 GPS_LNA_EN O Enables the external regulator for GPS LNA 1.8V

N9 GPS_SYNC O GPS sync signal for Dead Reckoning 1.8V

Miscellaneous Functions

R12 ON_OFF_N I Power ON / Power OFF input Active low

R13 HW_SHUTDOWN_N I Unconditional Shutdown input Active low

R11 VAUX/PWRMON O Supply output for external accessories /

Power ON monitor

1.8V

B1 ADC_IN1 AI Analog/Digital Converter Input 1 Analog

H4 ADC_IN2 AI Analog/Digital Converter Input 2 Analog

D7 ADC_IN3 AI Analog/Digital Converter Input 3 Analog

SGMII Interface

E4 SGMII_RX_P AI SGMII receive – plus PHY

F4 SGMII_RX_M AI SGMII receive – minus PHY

D5 SGMII_TX_P AO SGMII transmit – plus PHY

D6 SGMII_TX_M AO SGMII transmit - minus PHY

HSIC Interface

A12 HSIC_DATA I/O High-speed inter-chip interface - data 1.2V

A11 HSIC_STB I/O High-speed inter-chip interface - strobe 1.2V

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I2C Interface

B11 I2C_SCL I/O I2C clock 1.8V Internally PU

2.2kΩ to 1.8V

B10 I2C_SDA I/O I2C Data 1.8V Internally PU

2.2kΩ to 1.8V

Power Supply

M1 VBATT - Main Power Supply (Digital Section) Power

M2 VBATT - Main Power Supply (Digital Section) Power

N1 VBATT_PA - Main Power Supply (RF Section) Power

N2 VBATT_PA - Main Power Supply (RF Section) Power

P1 VBATT_PA - Main Power Supply (RF Section) Power

P2 VBATT_PA - Main Power Supply (RF Section) Power

A2 GND - Ground

B13 GND Ground

D4 GND - Ground

E1 GND - Ground

E2 GND - Ground

E14 GND - Ground

F2 GND - Ground

G1 GND - Ground

G2 GND - Ground

G7 GND - Ground

G8 GND - Ground

G9 GND - Ground

H1 GND - Ground

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H2 GND - Ground

H7 GND - Ground

H8 GND - Ground

H9 GND - Ground

J1 GND - Ground

J2 GND - Ground

J7 GND - Ground

J8 GND - Ground

J9 GND - Ground

K2 GND - Ground

L1 GND - Ground

L2 GND - Ground

M3 GND - Ground

M4 GND - Ground

M12 GND - Ground

N3 GND - Ground

N4 GND - Ground

N5 GND - Ground

N6 GND - Ground

P3 GND - Ground

P4 GND - Ground

P5 GND - Ground

P6 GND - Ground

P8 GND - Ground

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P9 GND - Ground

P10 GND - Ground

P13 GND - Ground

R2 GND - Ground

R3 GND - Ground

R5 GND - Ground

R6 GND - Ground

R8 GND - Ground

R10 GND - Ground

Reserved

A8 Reserved - Reserved

A9 Reserved - Reserved

A10 Reserved - Reserved

B2 Reserved - Reserved

B3 Reserved - Reserved

B4 Reserved - Reserved

B5 Reserved - Reserved

C3 Reserved - Reserved

C4 Reserved - Reserved

C5 Reserved - Reserved

C6 Reserved - Reserved

C7 Reserved - Reserved

C14 Reserved - Reserved

D3 Reserved - Reserved

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D8 Reserved - Reserved

D9 Reserved - Reserved

D10 Reserved - Reserved

D11 Reserved - Reserved

D12 Reserved - Reserved

D13 Reserved - Reserved

D14 Reserved - Reserved

E3 Reserved - Reserved

E13 Reserved - Reserved

F3 Reserved - Reserved

F14 Reserved - Reserved

G3 Reserved - Reserved

G14 Reserved - Reserved

H3 Reserved - Reserved

H15 Reserved - Reserved

J3 Reserved - Reserved

J4 Reserved - Reserved

J14 Reserved - Reserved

J15 Reserved - Reserved

K3 Reserved - Reserved

K4 Reserved - Reserved

K14 Reserved - Reserved

L3 Reserved - Reserved

L4 Reserved - Reserved

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M5 Reserved - Reserved

M6 Reserved - Reserved

M7 Reserved - Reserved

N7 Reserved - Reserved

N8 Reserved - Reserved

N10 Reserved - Reserved

N11 Reserved - Reserved

N12 Reserved - Reserved

P7 Reserved - Reserved

P11 Reserved - Reserved

P12 Reserved - Reserved

Reserved for future use

R4 RFU - Reserved for future use. Not connected

internally

Can be tied to

GND

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Caution:

GPIO_09 and WCI_RX are used as special HW flags during boot.

If they are used as GPIOs, they must be connected via a 3-state buffer to avoid any undesirable

effect during the boot.

NOTE:

When the UART signals are used as the communication port between the Host and the Modem,

RTS must be connected to GND (on the module side) if flow control is not used.

If the UART port is not used, UART signals can be left floating.

NOTE:

Unless otherwise specified, RESERVED pins must be left unconnected (Floating).

NOTE:

The following pins are unique for the LE910Cx and may not be supported on other (former or

future) xE910 family. Special care must be taken when designing the application board if future

compatibility is required

REF_CLK

SPI_CS

USB_ID

I2C_SCL

I2C_SDA

ADC_IN2

ADC_IN3

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3.2. LE910Cx - Signals That Must Be Connected

Table 6 specifies the LE910Cx signals that must be connected even if not used by end application:

Table 6: Mandatory Signals

PAD Signal Notes

M1, M2, N1, N2, P1, P2 VBATT &

VBATT_PA

A2, B13, D4, E1, E2, E14, F2, G1, G2, G7, G8, G9,

H1, H2, H7, H8, H9, J1, J2, J7, J8, J9, K2, L1, L2, M3,

M4, M12, N3, N4, N5, N6, P3, P4, P5, P6, P8, P9,

P10, P13, R2, R3, R5, R6, R8, R10

GND

R12 ON/OFF Main power on off signal

R13 HW_SHUTDOWN_N Emergency power off

B15 USB_D+ If not used, connect to a Test Point or an

USB connector

C15 USB_D- If not used, connect to a Test Point or an

USB connector

A13 USB_VBUS If not used, connect to a Test Point or an

USB connector

N15 C103/TXD If not used, connect to a Test Point

M15 C104/RXD If not used, connect to a Test Point

L14 C105/RTS If flow control is not used, connect to

GND

P15 C106/CTS If not used, connect to a Test Point

D15 TX_AUX If not used, connect to a Test Point

E15 RX_AUX If not used, connect to a Test Point

K1 Antenna MAIN antenna

F1 ANT_DIV DIV antenna

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PAD Signal Notes

R9 ANT_GPS GPS antenna

C4, C5, C6, C7, D3, E3, G3, K4, L4, P11 Reserved Connect to a Test Point for Telit internal

use

L15 GPIO_09 If not used, connect to a Test Point

M9 WCI_RX If not used, connect to a Test Point

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3.3. LGA Pads Layout

Figure 2: LGA Pads Layout

A B C D E F G H J K L M N P R

1 ADC_IN1 SIMCLK2 SIMRST2 GND ANT_DIV GND GND GND ANT_MAIN GND VBATT VBATT_PA VBATT_PA

2 GND RES SIMIO2 SIMVCC2 GND GND GND GND GND GND GND VBATT VBATT_PA VBATT_PA GND

3 SIMVCC RES RES RES RES RES RES RES RES RES RES GND GND GND GND

4 SIMIN RES RES GND SGMII_RX_P SGMII_RX_M SIMIN2 ADC_IN2 RES RES RES GND GND GND RFU

5 SIMIO RES RES SGMII_TX_P RES GND GND GND

6 SIMCLK DVI_RX RES SGMII_TX_M RES GND GND GND

7 SIMRST DVI_TX RES ADC_IN3 GND GND GND RES RES RES GPS_LNA_EN

8RES DVI_CLK GPIO_01 RES GND GND GND WCI_TXD_TGPIO24 RES GND GND

9RES DVI_WA0 GPIO_02 RES GND GND GND WCI_RXD_TGPIO25 GPS_SYNC GND ANT_GPS

10 RES I2C_SDA GPIO_03 RES RFCLK2_QCA RES GND GND

11 HSIC_STB I2C_SCL GPIO_04 RES WLAN_SLEEP_CLK RES RES VAUX/PWRMON

12 HSIC_DATA REF_CLK GPIO_06 RES MMC_DAT0 MMC_CLK MMC_DAT1 MMC_DAT3 MMC_CMD MMC_DAT2 WIFI_SDRST GND RES RES ON_OFF*

13 VUSB GND GPIO_07 RES RES VMMC MMC_CD WIFI_SD3 WIFI_SD0 WIFI_SD2 WIFI_SDCLK WIFI_SD1 WIFI_SDCMD GND HW_SHUTDOWN*

14 USB_ID GPIO_05 RES RES GND RES RES SPI_CS / GPIO_11 RES RES C105/RTS C108/DTR C109/DCD C107/DSR C125/RING

15 USB_D+ USB_D- SPI_MOSI

/ TX_AUX

SPI_MISO

/RX_AUX SPI_CLK GPIO_10 RES RES GPIO_8 GPIO_9 C104/RXD C103/TXD C106/CTS

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3.4. Backward Compatibility to xE910 Family

The LE910Cx is a new series in the xE910 form factor

The LE910Cx is fully backward compatible to the previous xE910 in terms of:

• Mechanical dimensions

• Package and pin-map

To support the extra features and additional interfaces, the LE910Cx introduces more pins

compared to the xE910.

The extra pins of the LE910Cx can be considered as optional if not needed and can be left

unconnected (floating) if not used.

In this case, the new LE910Cx can be safely mounted on existing carrier boards designed for the

previous xE910.

The additional pins of the LE910Cx are shown in Figure 3 (marked as Green)

Figure 3: LE910Cx vs. LE910 Pin-out Comparison (top view)

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4. Electrical Specifications

4.1. Absolute Maximum Ratings – Not Operational

A deviation from the value ranges listed below may harm the LE910Cx module.

Table 7: Absolute Maximum Ratings – Not Operational

Symbol Parameter Min Max Unit

VBATT Battery supply voltage on pin

VBATT

-0.5 +6.0 [V]

VBATT TRANSIENT Transient voltage on pin

VBATT (< 10 ms)

-0.5 +7.0 [V]

VBATT_PA Battery supply voltage on pin

VBATT_PA

-0.3 +6.0 [V]

4.2. Recommended Operating Conditions

Table 8: Recommended Operating Conditions

Symbol Parameter Min Typ Max Unit

amb

Ambient temperature -40 +25 +85 [°C]

VBATT Battery supply voltage

on pin VBATT

3.4 3.8 4.2 [V]

VBATT_PA Battery supply voltage

on pin VBATT_PA

3.4 3.8 4.2 [V]

BATT_PA +

BATT

Peak current to be used

to dimension

decoupling capacitors

on pin VBATT_PA

- 80 2000 [mA]

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4.3. Logic Level Specifications

Unless otherwise specified, all the interface circuits of the LE910Cx are 1.8V CMOS logic.

Only few specific interfaces (such as USIM and SD Card) are capable of dual voltage I/O.

The following tables show the logic level specifications used in the LE910Cx interface circuits. The

data specified in the tables below is valid throughout all drive strengths and the entire temperature

ranges.

NOTE:

Do not connect LE910Cx’s digital logic signal directly to OEM’s digital logic signal with a level

higher than 2.7V for 1.8V CMOS signals.

4.3.1. 1.8V Pads - Absolute Maximum Ratings

Table 9: Absolute Maximum Ratings - Not Functional

Parameter Min Max

Input level on any

digital pin when on

-0.3V +2.16V

Input voltage on

analog pins when on

-0.3V +2.16 V

4.3.2. 1.8V Standard GPIOs

Table 10: Operating Range – Interface Levels (1.8V CMOS)

Pad Parameter Min Max Unit Comment

Input high level 1.25V -- [V]

Input low level -- 0.6V [V]

Output high level 1.4V -- [V]

Output low level -- 0.45V [V]

Low-level input leakage current -1 -- [uA] No pull-up

High-level input leakage current -- +1 [uA] No pull-down

Pull-up resistance 30 390 [kΩ]

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Pad Parameter Min Max Unit Comment

Pull-down resistance 30 390 [kΩ]

Input capacitance -- 5 [pF]

NOTE:

Pull-Up and Pull-Down resistance of GPIO3, GPIO7 and GPIO8 is different than above mentioned

GPIO3 pull resistance is specified as 10KΩ to 50KΩ

4.3.3. 1.8V SD Card Pads

Table 11: Operating Range – SD Card Pads Working at 1.8V

Pad Parameter Min Max Unit Comment

Input high level 1.27V 2V [V]

Input low level -0.3V 0.58V [V]

Output high level 1.4V -- [V]

Output low level 0 0.45V [V]

Low-level input leakage current -2 - [uA] No pull-up

High-level input leakage current - 2 [uA] No pull-down

Pull-up resistance 10 100 [kΩ]

Pull-down resistance 10 100 [kΩ]

Input capacitance 5 [pF]

4.3.4. 1.8V SIM Card Pads

Table 12: Operating Range – SIM Pads Working at 1.8V

Pad Parameter Min Max Unit Comment

Input high level 1.35V 2V [V]

Input low level -0.3V 0.43V [V]

Output high level 1.35V 1.875V [V]

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Pad Parameter Min Max Unit Comment

Output low level 0V 0.4V [V]

Low-level input leakage current -2 - [uA] No pull-up

High-level input leakage current - 2 [uA] No pull-down

Pull-up resistance 10 100 [kΩ]

Pull-down resistance 10 100 [kΩ]

Input capacitance 5 [pF]

4.3.5. Dual Voltage Pads - Absolute Maximum Ratings

Table 13: Absolute Maximum Ratings - Not Functional

Parameter Min Max

Input level on any

digital pin when on

-0.3V +3.6V

Input voltage on

analog pins when on

-0.3V +3.6 V

4.3.6. SD Card Pads @ 2.95V

Table 14: Operating Range – For SD Card Pads Operating at 2.95V

Pad Parameter Min Max Unit Comments

Input high level 1.9V 3.1V [V]

Input low level -0.3V 0.7V [V]

Output high level 2.1V 3.05V [V]

Output low level 0V 0.4V [V]

Low-level input leakage current -10 [uA] No pull-up

High-level input leakage current 10 [uA] No pull-down

Pull-up resistance 10 100 [kΩ]

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Pad Parameter Min Max Unit Comments

Pull-down resistance 10 100 [kΩ]

Input capacitance 5 [pF]

4.3.7. SIM Card Pads @2.95V

Table 15: Operating Range – For SIM Pads Operating at 2.95V

Pad Parameter Min Max Unit Comment

Input high level 2.1V 3.1V [V]

Input low level -0.3V 0.55V [V]

Output high level 2.25V 3.1V [V]

Output low level 0V 0.4V [V]

Low-level input leakage current -10 [uA] No pull-up

High-level input leakage current 10 [uA] No pull-down

Pull-up resistance 10 100 [kΩ]

Pull-down resistance 10 100 [kΩ]

Input capacitance 5 [pF]

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5. Hardware Commands

5.1. Turning on the LE910Cx Module

To turn on the LE910Cx module, the ON/OFF# pad must be asserted low for at least 1 second and

then released.

The maximum current that can be drained from the ON/OFF # pad is 0.1 mA. This pin is internally

pulled up; customers should expect to see ~ 800 mV on the output.

Figure 4 illustrates a simple circuit to power on the module using an inverted buffer output.

Figure 4: Power-on Circuit

NOTE:

Recommended values R2 = 47kΩ, R1 = 10kΩ.

5.2. Initialization and Activation State

After turning on the LE910Cx module, the LE910Cx is not yet activated because the SW initialization

process of the LE910Cx module is still in process internally. It takes some time to fully complete the

HW and SW initialization of the module.

For this reason, it is impossible to access LE910Cx during the Initialization state.

As shown in Figure 5, the LE910Cx becomes operational (in the Activation state) at least 20 seconds

after the assertion of ON_OFF.

NOTE:

During the Initialization state, AT commands are not available. The DTE host must wait for the

Activation state prior to communicating with the LE910Cx.

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Figure 5: LE910Cx Initialization and Activation

NOTE:

SW_RDY signal is available on GPIO_08 (by default GPIO_08 functions as SW_RDY)

NOTE:

To check if the LE910Cx has completely powered on, monitor the SW_RDY signal. When SW_RDY

goes high, the module has completely powered on and is ready to accept AT commands.

NOTE:

During SW initialization of the LE910Cx, the SW configures all pads and interfaces to their desired

mode. When PWRMON goes high, this indicates that the initialization of all I/O pads is completed.

NOTE:

Do not use any pull-up resistor on the ON/OFF# line as it is internally pulled up. Using a pull-up

resistor may cause latch-up problems on the LE910Cx power regulator and improper powering

on/off of the module. The ON/OFF# line must be connected only in an open-collector

configuration.

NOTE:

Active low signals are labeled with a name that ends with "#" or with “_N”

NOTE:

To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal

applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition.

1 Sec < T_Hold < 2 Sec

VBATT

ON_OFF

SW_RDY

T_RDY < 20 Sec

V_AUX

PWRMON

18 Sec < T_PWRMON < 20 Sec

OFF State Initialization State Active State

OK to Send AT

commands

All interfaces and pins

configured

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5.3. Turning OFF the LE910Cx Module

Turning OFF the device can be done in four different ways:

• AT#SHDN software command

• Hardware shutdown using ON/OFF# pad

• Hardware Unconditional Shutdown using the HW_SHUTDOWN_N

When the device is shut down by a software command or a hardware shutdown, it issues a detach

request to the network, informing the network that the device will not be reachable any more.

NOTE:

To check if the device has powered off, monitor the PWRMON hardware line. When PWRMON

goes low, this indicates that the device has powered off.

NOTE:

To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal

applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition.

5.3.1. Shutdown by Software Command

The LE910Cx module can be shut down by a software command.

When a shutdown command is sent, LE910Cx goes into the Finalization state and at the end of the

finalization process shuts down PWRMON.

The duration of the finalization state can differ according to the current situation of the module, so

a value cannot be defined.

Usually, it will take more than 15 seconds from sending a shutdown command until reaching a

complete shutdown. The DTE should monitor the status of PWRMON to observe the actual power-

off.

Figure 6: Shutdown by Software Command

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NOTE:

To check whether the device has powered OFF, monitor the PWRMON hardware line. When

PWRMON goes low, the device has powered OFF.

5.3.2. Hardware Shutdown

To turn off LE910Cx module, the ON/OFF# pad must be asserted low for at least 2.5 seconds and

then released. Use the same circuitry and timing for power-on.

When the hold time of ON/OFF# is above 2.5 seconds, LE910Cx goes into the Finalization state and

in the end shuts down PWRMON.

The duration of the Finalization state can differ according to the current situation of the module,

so a value cannot be defined.

Usually, it will take more than 15 seconds from sending a shutdown command until reaching a

complete shutdown. DTE should monitor the status of PWRMON to observe the actual power-off.

Figure 7: Hardware Shutdown

NOTE:

To check whether the device has powered off, monitor the PWRMON hardware line. When

PWRMON goes low, the device has powered off.

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5.3.4. Unconditional Hardware Shutdown

To unconditionally shut down the LE910Cx module, the HW_SHUTDOWN_N pad must be tied low

for at least 200 milliseconds and then released.

A simple circuit for applying unconditional shutdown is shown below:

Figure 8: Circuit for Unconditional Hardware Shutdown

The system power down timing for using HW_SHUTDOWN_N is shown below

Figure 9 Power down timing using HW_SHUTDOWN_N

NOTE:

Recommended values R2 = 47kΩ, R1 = 10kΩ.

NOTE:

Do not use any pull-up resistor on the HW_SHUTDOWN_N line or any totem pole digital

output. Using a pull-up resistor may cause latch-up problems on the LE910Cx power

regulator and improper functioning of the module. The HW_SHUTDOWN_N line must be

connected only in an open-collector configuration.

NOTE:

The Unconditional Hardware Shutdown must always be implemented on the boards, but the

software must use it only as an emergency exit procedure, and not as a normal power-off

operation.

200mS Sec < T_Hold

VBATT

SHDN_N

SW_RDY

T_RDY ~0 Sec

V_AUX

PWRMON

T_PWRMON ~0 Sec

OFF StateActive State

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6. Power Supply

The power supply circuitry and board layout are very important parts of the full product design,

with critical impact on the overall product performance. Read the following requirements and

guidelines carefully to ensure a good and proper design.

6.1. Power Supply Requirements

The LE910Cx power requirements are as follows:

Table 16: Power Supply Requirements

Nominal supply voltage 3.8V

Supply voltage range 3.4V – 4.2V

Max ripple on module input supply 30mV

Table 17 provides typical current consumption values of LE910Cx for various operation modes.

Table 17: LE910Cx Current Consumption

Mode Average [Typical] Mode Description

1) Switched Off

Switched off 25µA Module is powered but switched Off (RTC On)

2) IDLE Mode (Standby Mode; No Call in Progress)

AT+CFUN=4 1.0mA

Tx and Rx are disabled ; module is not registered on the

network (Flight mode)

DRX

GSM 2.0mA DRx2

1.4mA DRx5

WCDMA 1.4mA DRx7

1.2mA DRx8

LTE

1.8mA Paging cycle #128 frames (1.28 sec DRx cycle)

1.4mA Paging cycle #256 frames (2.56 sec DRx cycle)

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Mode Average [Typical] Mode Description

3) Operative Mode (LTE)

LTE (0 dBm) 190mA LTE CAT 4 channel BW 20 MHz, RB=1, Tx = 0 dBm

(Test case: BAND 1, Channel 300)

LTE (22 dBm) 500mA LTE CAT 4 channel BW 20 MHz, RB=1, Tx = 22 dBm

(Test case: BAND 1, Channel 300)

4) Operative Mode (WCDMA)

WCDMA Voice 200mA WCDMA voice call (Tx = 10 dBm)

WCDMA HSDPA (0 dBm) 150mA WCDMA data call (Cat 14, Tx = 0 dBm, Max throughput)

WCDMA HSDPA (22 dBm) 310mA WCDMA data call (Cat 14, Tx = 22 dBm, Max throughput)

5) Operative Mode (GSM)

GSM Tx and Rx mode

GSM900 PL5 250mA

GSM voice call

DCS1800 PL0 170mA

GPRS 4 Tx + 1 Rx

GSM900 PL5 430mA

GPRS Sending Data mode (CS-4)

DCS1800 PL0 340mA

* Worst/best case current values depend on network configuration - not under module control.

NOTE:

The electrical design for the power supply must ensure a peak current output of at least 2A.

NOTE:

In GSM/GPRS mode, RF transmission is not continuous, but is packed into bursts at a base

frequency of about 216 Hz with relative current peaks as high as about 2A. Therefore, the power

supply must be designed to withstand these current peaks without big voltage drops. This means

that both the electrical design and the board layout must be designed for this current flow.

If the layout of the PCB is not well designed, a strong noise floor is generated on the ground. This

will reflect on all the audio paths producing an audible annoying noise at 216 Hz.

If the voltage drops during the peaks, current absorption is too high. The device may even shut

down as a consequence of the supply voltage drop.

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6.2. General Design Rules

The principal guidelines for the Power Supply Design embrace three different design steps:

• Electrical design

• Thermal design

• PCB layout

6.2.1. Electrical Design Guidelines

The electrical design of the power supply depends strongly on the power source where this power

is drained. Power sources can be distinguished by three categories:

• +5V input (typically PC internal regulator output)

• +12V input

• Battery

6.2.1.1. + 5V Input Source Power Supply – Design Guidelines

• The desired output for the power supply is 3.8V. So, the difference between the input

source and the desired output is not big, and therefore a linear regulator can be used. A

switching power supply is preferred to reduce power consumption.

• When using a linear regulator, a proper heat sink must be provided to dissipate the power

generated.

• A bypass low ESR capacitor of adequate capacity must be provided to cut the current

absorption peaks close to the LE910Cx module. A 100 μF tantalum capacitor is usually

suitable (on both VBATT and VBATT_PA together).

• Make sure that the low ESR capacitor on the power supply output (usually a tantalum one)

is rated at least 10V.

• A protection diode must be inserted close to the power input to protect the LE910Cx

module from power polarity inversion.

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Figure 10 shows an example of linear regulator with 5V input.

Figure 10: Example of Linear Regulator with 5V Input

6.2.1.2. + 12V Input Source Power Supply – Design Guidelines

• The desired output for the power supply is 3.8V. Due to the big difference between the

input source and the desired output, a linear regulator is unsuitable and must not be used.

A switching power supply is preferable because of its better efficiency, especially with the

2A peak current load which is expected during GSM Tx.

• When using a switching regulator, a 500-kHz or higher switching frequency regulator is

preferable because of its smaller inductor size and its faster transient response. This allows

the regulator to respond quickly to the current peaks absorption.

• In any case, the selection of the frequency and switching design is related to the application

to be developed due to the fact that the switching frequency can also generate EMC

interference.

• For car batteries (lead-acid accumulators) the input voltage can rise up to 15.8V. This must

be kept in mind when choosing components: all components in the power supply must

withstand this voltage.

• A bypass low ESR capacitor of adequate capacity must be provided to cut the current

absorption peaks. A 100μF tantalum capacitor is usually suitable (on both VBATT and

VBATT_PA together).

• Make sure that the low ESR capacitor on the power supply output (usually a tantalum one)

is rated at least 10V.

• For automotive applications, a spike protection diode must be inserted close to the power

input to clean the supply of spikes.

• A protection diode must be inserted close to the power input to protect the LE910Cx

module from power polarity inversion. This can be the same diode as for spike protection.

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Figure 11 and Figure 12 show an example of switching regulator with 12V input.

Figure 11: Example of Switching Regulator with 12V Input – Part 1

Figure 12: Example of Switching Regulator with 12V Input – Part 2

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6.2.1.3. Battery Source Power Supply – Design Guidelines

• The desired nominal output for the power supply is 3.8V, and the maximum allowed

voltage is 4.2V. Hence, a single 3.7V Li-Ion cell battery type is suitable for supplying the

power to the LE910Cx module.

NOTE:

Do not use any Ni-Cd, Ni-MH, and Pb battery types directly connected to the LE910Cx module.

Their use can lead to overvoltage on the LE910Cx and damage it. Use only Li-Ion battery types.

• A bypass low ESR capacitor of adequate capacity must be provided to cut the current

absorption peaks; a 100μF tantalum capacitor is usually suitable (on both VBATT and

VBATT_PA together).

• Make sure that the low ESR capacitor (usually a tantalum one) is rated at least 10V.

• A protection diode must be inserted close to the power input to protect the LE910Cx

module from power polarity inversion. Otherwise, the battery connector must be done in

a way to avoid polarity inversions when connecting the battery.

• The battery capacity must be at least 900 mAh to withstand the current peaks of 2A.

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6.2.2. Thermal Design Guidelines

The thermal design for the power supply heat sink must be done with the following specifications:

• Average current consumption during RF transmission @PWR level max in LE910Cx as

shown in Table 17

• Average current consumption during Class12 GPRS transmission @PWR level max as shown

in Table 17

• Average GPS current during GPS ON (Power Saving disabled) : mA (TBD)

NOTE:

The average consumption during transmission depends on the power level at which the device is

requested to transmit via the network. Therefore, the average current consumption varies

significantly.

NOTE:

The thermal design for the power supply must be made keeping an average consumption at the

max transmitting level during calls of (LTE/HSPA)/GPRS plus average consumption in GPS Tracking

mode.

Considering the very low current during Idle, especially if the Power Saving function is enabled, it

is possible to consider from the thermal point of view that the device absorbs significant current

only during an Active Call or Data session.

For the heat generated by the LE910Cx module, consider it to be 2W max during transmission at

Class12 GPRS upload. The generated heat is mostly conducted to the ground plane under the

LE910Cx module. Ensure that your application can dissipate heat.

In LTE/WCDMA/HSPA mode, the LE910Cx emits RF signals continuously during transmission.

Therefore, you must pay special attention how to dissipate the heat generated.

Application board design needs to make sure the area under the LE910Cx module is as large as

possible. Make sure that the LE910Cx is mounted on the large ground area of application board and

provide many ground vias to dissipate the heat.

Even though peak current consumption in GSM mode is higher than in LTE/WCDMA/HSPA,

considerations for the heat sink are more important in the case of WCDMA due to the continuous

transmission conditions.

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6.2.3. Power Supply PCB Layout Guidelines

As seen in the electrical design guidelines, the power supply must have a low ESR capacitor on the

output to cut the current peaks and a protection diode on the input to protect the supply from

spikes and polarity inversion. The placement of these components is crucial for the correct

operation of the circuitry. A misplaced component can be useless or can even decrease the power

supply performances.

• The bypass low ESR capacitor must be placed close to the LE910Cx power input pads, or if

the power supply is of a switching type, it can be placed close to the inductor to cut the

ripple, as long as the PCB trace from the capacitor to LE910Cx is wide enough to ensure a

drop-less connection even during the 2A current peaks.

• The protection diode must be placed close to the input connector where the power source

is drained.

• The PCB traces from the input connector to the power regulator IC must be wide enough

to ensure that no voltage drops occur during the 2A current peaks.

Note that this is not done to save power loss but especially to avoid the voltage drops on the

power line at the current peaks frequency of 216 Hz that will reflect on all the components

connected to that supply (also introducing the noise floor at the burst base frequency.)

For this reason while a voltage drop of 300-400 mV may be acceptable from the power loss

point of view, the same voltage drop may not be acceptable from the noise point of view. If

your application does not have an audio interface but only uses the data feature of the LE910Cx,

this noise is not so disturbing, and the power supply layout design can be more forgiving.

• The PCB traces to LE910Cx and the bypass capacitor must be wide enough to ensure that

no significant voltage drops occur when the 2A current peaks are absorbed. This is needed

for the same above-mentioned reasons. Try to keep these traces as short as possible.

• The PCB traces connecting the switching output to the inductor and the switching diode

must be kept as short as possible by placing the inductor and the diode very close to the

power switching IC (only for the switching power supply). This is done to reduce the

radiated field (noise) at the switching frequency (usually 100-500 kHz).

• Use a good common ground plane.

• Place the power supply on the board in a way to guarantee that the high current return

paths in the ground plane do not overlap any noise sensitive circuitry, such as the

microphone amplifier/buffer or earphone amplifier.

• The power supply input cables must be kept separate from noise sensitive lines, such as

microphone/earphone cables.

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7. Antenna(s)

Antenna connection and board layout design are the most important parts in the full product

design, and they have a strong influence on the product’s overall performance. Read carefully and

follow the requirements and guidelines for a good and proper design.

7.1. GSM/WCDMA/LTE Antenna Requirements

The antenna for the LE910Cx device must meet the following requirements:

Table 18: GSM / WCDMA/ LTE Antenna Requirements

Frequency range The customer must use the most suitable antenna band width for

covering the frequency bands provided by the network operator and

also supported by the car OEM while using the Telit module.

The bands supported by each variant of the LE910Cx module family

are provided in Section 2.6.1, RF Bands per Regional Variant.

Gain Gain < 3 dBi

Impedance 50 Ohm

Input power > 33 dBm(2 W) peak power in GSM

> 24 dBm average power in WCDMA & LTE

VSWR absolute max <= 10:1

VSWR recommended <= 2:1

Since there is no antenna connector on the LE910Cx module, the antenna must be connected to

the LE910Cx antenna pad (K1) by a transmission line implemented on the PCB.

If the antenna is not directly connected to the antenna pad of the LE910Cx, a PCB line is required

to connect to it or to its connector.

This transmission line must meet the following requirements:

Table 19: Antenna Line on PCB Requirements

Characteristic impedance 50 Ohm

Max attenuation 0.3 dB

Avoid coupling with other signals.

Cold End (Ground Plane) of the antenna must be equipotential to the LE910Cx ground pads.

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Furthermore, if the device is developed for the US and/or Canada market, it must comply with the

FCC and/or IC approval requirements.

NOTE:

This device is to be used only for mobile and fixed application. The antenna(s) used for this

transmitter must be installed to provide a separation distance of at least 20 cm from all persons

and must not be co-located or operating in conjunction with any other antenna or transmitter.

End-Users must be provided with transmitter operation conditions for satisfying RF exposure

compliance. OEM integrators must ensure that the end user has no manual instructions to remove

or install the LE910Cx module. Antennas used for this OEM module must not exceed 3dBi gain for

mobile and fixed operating configurations.

7.2. GSM/WCDMA/LTE Antenna – PCB Line Guidelines

• Make sure that the transmission line’s characteristic impedance is 50 Ohm.

• Keep the line on the PCB as short as possible since the antenna line loss should be less than

around 0.3 dB.

• Line geometry should have uniform characteristics, constant cross sections, and avoid

meanders and abrupt curves.

• Any suitable geometry/structure can be used for implementing the printed transmission

line affecting the antenna.

• If a ground plane is required in the line geometry, this plane must be continuous and

sufficiently extended so the geometry can be as similar as possible to the related canonical

model.

• Keep, if possible, at least one layer of the PCB used only for the ground plane. If possible,

use this layer as reference ground plane for the transmission line.

• Surround the PCB transmission line with ground (on both sides). Avoid having other signal

tracks facing the antenna line track directly.

• Avoid crossing any un-shielded transmission line footprint with other tracks on different

layers.

• The ground surrounding the antenna line on the PCB must be strictly connected to the main

Ground plane by means of via-holes (once per 2 mm at least) placed close to the ground

edges facing the line track.

• Place EM-noisy devices as far as possible from LE910Cx antenna line.

• Keep the antenna line far away from the LE910Cx power supply lines.

• If EM-noisy devices are present on the PCB hosting the LE910Cx, such as fast switching ICs,

take care to shield them with a metal frame cover.

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• If EM-noisy devices are not present around the line, geometries like Micro strip or

Grounded Coplanar Waveguide are preferred because they typically ensure less

attenuation compared to a Strip line having the same length.

7.3. GSM/WCDMA/LTE Antenna – Installation Guidelines

• Install the antenna in a location with access to the network radio signal.

• The antenna must be installed such that it provides a separation distance of at least 20 cm

from all persons and must not be co-located or operating in conjunction with any other

antenna or transmitter.

• The antenna must not be installed inside metal cases.

• The antenna must be installed according to the antenna manufacturer’s instructions.

7.4. Antenna Diversity Requirements

This product includes an input for a second Rx antenna to improve radio sensitivity. The function

is called Antenna Diversity.

Table 20: Antenna Diversity Requirements

Frequency range The customer must use the most suitable antenna band width for

covering the frequency bands provided by the network operator

and also supported by the car OEM while using the Telit module.

The bands supported by each variant of the LE910Cx module

family are provided in Section 2.6.1, RF Bands per Regional Variant

Impedance 50Ω

VSWR recommended ≤ 2:1

Since there is no antenna connector on the LE910Cx module, the antenna must be connected to

the LE910Cx diversity antenna pad (F1) by means of a transmission line implemented on the PCB.

If the antenna is not directly connected at the antenna pad of the LE910Cx, a PCB line is required

to connect to it or to its connector.

The second Rx antenna must not be located in close vicinity of the main antenna. To improve

diversity gain and isolation and to reduce mutual interaction, the two antennas should be located

at the maximum reciprocal distance possible, taking into consideration the available space within

the application.

NOTE:

If Rx Diversity is not used/connected, disable the Diversity functionality using the AT#RXDIV

command (refer to the AT User guide) and leave the Diversity pad F1 unconnected.

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7.5. GNSS Antenna Requirements

LE910Cx supports an active antenna.

It is recommended to use antennas as follow:

• An external active antenna (GPS only)

• An external active antenna plus GNSS pre-filter

NOTE:

The external GNSS pre-filter is required for the GLONASS application.

The GNSS pre-filter must meet the following requirements:

Source and load impedance = 50 Ohm

• Insertion loss (1575.42–1576.42 MHz) = 1.4 dB (Max)

• Insertion loss (1565.42–1585.42 MHz) = 2.0 dB (Max)

• Insertion loss (1597.5515–1605.886 MHz) = 2.0 dB (Max)

NOTE:

It is recommended to add a DC block to the customer’s GPS application to prevent damage to the

LE910Cx module due to unwanted DC voltage.

7.5.1. Combined GNSS Antenna

The use of a combined RF/GNSS antenna is NOT recommended. This solution can generate an

extremely poor GNSS reception. In addition, the combination of antennas requires an additional

diplexer, which adds significant power loss in the RF path.

7.5.2. Linear and Patch GNSS Antenna

Using this type of antenna introduces at least 3 dB of loss compared to a circularly polarized (CP)

antenna. Having a spherical gain response instead of a hemispherical gain response can aggravate

the multipath behavior and create poor position accuracy.

7.5.3. Front End Design Considerations

Since there is no antenna connector on the LE910Cx module, the antenna must be connected to

the LE910Cx through the PCB to the antenna pad.

If the antenna is not directly connected at the antenna pad of the LE910Cx, a PCB line is required.

This line of transmission must meet the following requirements:

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Table 21: Antenna Line on PCB Requirements

Characteristic impedance 50 Ohm

Max attenuation 0.3 dB

Avoid coupling with other signals.

Cold End (Ground Plane) of the antenna must be equipotential to the LE910Cx ground pads.

Furthermore, if the device is developed for the US and/or Canada market, it must comply with the

FCC and/or IC requirements.

This device is to be used only for mobile and fixed application.

7.5.4. GNSS Antenna – PCB Line Guidelines

• Ensure that the antenna line impedance is 50 Ohm.

• Keep the line on the PCB as short as possible to reduce the loss.

• The antenna line must have uniform characteristics, constant cross section, avoiding

meanders and abrupt curves.

• Keep one layer of the PCB used only for the Ground plane; if possible.

• Surround (on the sides, over and under) the antenna line on the PCB with Ground. Avoid

having other signal tracks directly facing the antenna line track.

• The Ground around the antenna line on the PCB must be strictly connected to the main

Ground plane by placing vias at least once per 2mm.

• Place EM-noisy devices as far as possible from LE910Cx antenna line.

• Keep the antenna line far away from the LE910Cx power supply lines.

• If EM-noisy devices are around the PCB hosting the LE910Cx, such as fast switching ICs,

ensure shielding the antenna line by burying it inside the layers of PCB and surrounding it

with Ground planes; or shield it with a metal frame cover.

• If you do not have EM-noisy devices around the PCB of LE910Cx, use a Micro strip line on

the surface copper layer for the antenna line. The line attenuation will be lower than a

buried one.

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7.5.5. GNSS Antenna – Installation Guidelines

• The LE910Cx, due to its sensitivity characteristics, is capable of performing a fix inside

buildings. (In any case, the sensitivity could be affected by the building characteristics i.e.

shielding.)

• The antenna must not be co-located or operating in conjunction with any other antenna or

transmitter.

• The antenna must not be installed inside metal cases.

• The antenna must be installed according to the antenna manufacturer’s instructions.

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8. Hardware Interfaces

Table 22 summarizes all the hardware interfaces of the LE910Cx module.

Table 22: LE910Cx Hardware Interfaces

Interface LE910Cx

SGMII For Ethernet support

HSIC x1

SD/MMC x1 dual voltage interface for supporting SD/MMC card

SDIO For WIFI support (1.8V only)

USB USB2.0, OTG support

SPI Master only, up to 50 MHz

I2C For sensors, audio control

UART 2 HS-UART (up to 4 Mbps)

Audio I/F I2S/PCM, Analog I/O

GPIO 10 ~ 27 (10 dedicated + 17 multiplexed with other signals)

USIM x2, dual voltage each (1.8V/2.85V)

ADC Up to x3

Antenna ports 2 for Cellular, 1 for GNSS

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8.1. USB Port

The LE910Cx module includes a Universal Serial Bus (USB) transceiver, which operates at USB high-

speed (480 Mbits/sec). It can also operate with USB full-speed hosts (12 Mbits/sec).

It is compliant with the USB 2.0 specification and can be used for control and data transfers as well

as for diagnostic monitoring and firmware update.

The USB port is typically the main interface between the LE910Cx module and OEM hardware.

NOTE:

The USB_D+ and USB_D- signals have a clock rate of 480 MHz. The signal traces must be routed

carefully. Minimize trace lengths, number of vias, and capacitive loading. The impedance value

should be as close as possible to 90 Ohms differential.

Table 23 lists the USB interface signals.

Table 23: USB Interface Signals

Signal Pad No Usage

USB_VBUS A13 Power and cable detection for the internal USB transceiver.

Acceptable input voltage range 2.5V – 5.5V @ max 5 mA consumption

USB_D- C15 Minus (-) line of the differential, bi-directional USB signal to/from the

peripheral device

USB_D+ B15 Plus (+) line of the differential, bi-directional USB signal to/from the

peripheral device

USB_ID A14 Used for USB OTG in order to determine host or client mode

NOTE:

USB_VBUS input power is internally used to detect the USB port and start the enumeration process. It is

not used for supplying power to the internal LE910Cx USB HW block. Therefore, only a maximum of 5 mA

is required.

NOTE:

Even if USB communication is not used, it is still highly recommended to place an optional USB connector

on the application board.

At least test points of the USB signals are required since the USB physical communication is needed in

the case of SW update.

NOTE

An external 5V power supply is required on the application board for supporting USB OTG

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8.2. HSIC Interface

The application processor exposes a High-Speed Inter-Chip (HSIC). HSIC eliminates the analog

transceiver from a USB interface for lower voltage operation and reduced power dissipation.

• High-speed 480 Mbps (240 MHz DDR) USB transfers are 100% host driver compatible with

traditional USB cable connected topologies

• Bidirectional data strobe signal (STROBE)

• Bidirectional data signal (DATA)

• No power consumption unless a transfer is in progress

Further details will be provided in a future release of this document.

8.3. SGMII Interface (optional)

The SOC optionally includes an integrated Ethernet MAC with an SGMII interface, having the

following key features:

• The SGMII interface can be used connect to an external Ethernet PHY, or an external switch.

• When enabled, an additional network interface will be available to the Linux kernel’s

router.

8.3.1. Ethernet Control interface

When using an external PHY for Ethernet connectivity, the LE910C1 also includes the control

interface for managing the external PHY

The table below lists the signals for controlling the external PHY

Table 24: Ethernet Control Interface Signals

PAD Signal I/O

Function Type COMMENT

C2 MAC_MDC O MAC to PHY Clock 2.85V

C1 MAC_MDIO

I/O MAC to PHY Data 2.85V

D1 ETH_RST_N O Reset to Ethernet PHY 2.85V

G4 ETH_INT_N I Interrupt from Ethernet PHY 2.85V

NOTE:

The Ethernet control interface is shared with USIM2 port!

When Ethernet PHY is used, USIM2 port cannot be used (and vice versa).

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8.4. Serial Ports

The serial port is typically a secondary interface between the LE910Cx module and OEM hardware.

Two serial ports are available on the module:

• MODEM SERIAL PORT 1(Main)

• MODEM SERIAL PORT 2 (Auxiliary)

Several configurations can be designed for the serial port on the OEM hardware. The most common

are:

• RS232 PC com port

• Microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit)

• Microcontroller UART @ 3.3V/5V or other voltages different from 1.8V

Depending on the type of serial port on the OEM hardware, a level translator circuit may be needed

to make the system operate. The only configuration that does not need level translation is the 1.8V

UART.

The levels for LE910Cx UART are the CMOS levels as described in Section 4.3, Logic Level

Specifications.

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8.4.1. Modem Serial Port 1 Signals

Serial Port 1 on LE910Cx is a +1.8V UART with 7 RS232 signals. It differs from the PC-RS232 in signal

polarity (RS232 is reversed) and levels.

Table 25 lists the signals of LE910Cx Serial Port 1.

Table 25: Modem Serial Port 1 Signals

RS232

Pin No.

Signal LE910Cx

Pad No.

Name Usage

1 DCD -

DCD_UART

N14 Data Carrier

Detect

Output from the LE910Cx that

indicates carrier presence

2 RXD -

TX_UART

M15 Transmit line

*see Note

Output transmit line of the LE910Cx

UART

3 TXD -

RX_UART

N15 Receive line

*see Note

Input receive line of the LE910Cx

UART

4 DTR -

DTR_UART

M14 Data Terminal

Ready

Input to LE910Cx that controls the

DTE READY condition

5 GND A2, B13,

D4…

Ground Ground

6 DSR -

DSR_UART

P14 Data Set

Ready

Output from the LE910Cx that

indicates that the module is ready

7 RTS -

RTS_UART

L14 Request to

Send

Input to LE910Cx controlling the

Hardware flow control

8 CTS -

CTS_UART

P15 Clear to Send Output from LE910Cx controlling the

Hardware flow control

9 RI - RI_UART R14 Ring Indicator Output from LE910Cx indicating the

Incoming call condition

NOTE:

DCD, DTR, DSR, RI signals that are not used for UART functions can be configured as GPIO using AT

commands.

NOTE:

To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal

applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition.

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NOTE:

For minimum implementations, only the TXD and RXD lines need be connected. The other lines

can be left open provided a software flow control is implemented.

NOTE:

According to V.24, Rx/Tx signal names refer to the application side; therefore, on the LE910Cx side,

these signal are in the opposite direction: TXD on the application side will be connected to the

receive line (here named TXD/ RX_UART) of the LE910Cx serial port and vice versa for Rx.

NOTE:

DTR pin must not be pulled low in order not to prevent the UART and the entire module from

entering low power mode.

DTR can be left floating if not used.

8.4.2. Modem Serial Port 2

Serial Port 2 on the LE910Cx is a +1.8V UART with RX and TX signals only.

The UART functionality is shared with SPI thus simultaneous of SPI and UART is not supported.

The below table lists the signals of LE910Cx Serial Port 2.

Table 26 Modem Serial Port 2 Signals

PAD Signal I/O

Function Type COMMENT

D15 TX_AUX O Auxiliary UART (Tx Data to DTE) 1.8V Shared with SPI_MOSI

E15 RX_AUX I Auxiliary UART (Rx Data to DTE) 1.8V Shared with SPI_MISO

NOTE:

To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal

applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition.

NOTE:

The Auxiliary UART is used as the SW main debug console. It is required to place test points on this

interface even if not used.

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8.4.3. RS232 Level Translation

To interface the LE910Cx with a PC com port or a RS232 (EIA/TIA-232) application, a level translator

is required. This level translator must:

• Invert the electrical signal in both directions

• Change the level from 0/1.8V to +15/-15V

The RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the

RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level translator. Note

that the negative signal voltage must be less than 0V and hence some sort of level translation is

always required.

The simplest way to translate the levels and invert the signal is by using a single chip-level

translator. There are a multitude of them, differing in the number of drivers and receivers and in

the levels (be sure to get a true RS232 level translator, not a RS485 or other standards).

By convention, the driver is the level translator from the 0-1.8V UART to the RS232 level. The

receiver is the translator from the RS232 level to 0-1.8V UART.

To translate the whole set of control lines of the UART, the following is required:

• 2 drivers

• 2 receivers

NOTE:

The digital input lines operating at 1.8V CMOS have an absolute maximum input voltage of 2.7V.

Therefore, the level translator IC must not be powered by the +3.8V supply of the module. Instead,

it must be powered from a dedicated +1.8V power supply.

An example of RS232 level adaption circuitry could use a MAXIM transceiver (MAX218).

In this case, the chipset is capable of translating directly from 1.8V to the RS232 levels (Example on

4 signals only).

Figure 13: RS232 Level Adaption Circuitry Example

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NOTE:

In this case, the length of the lines on the application must be taken into account to avoid problems

in the case of High-speed rates on RS232.

The RS232 serial port lines are usually connected to a DB9 connector as shown in Figure 14. Signal

names and directions are named and defined from the DTE point of view.

Figure 14: RS232 Serial Port Lines Connection Layout

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8.5. Peripheral Ports

In addition to the LE910Cx serial ports, the LE910Cx supports the following peripheral ports:

• SPI – Serial Peripheral Interface

• I2C - Inter-integrated circuit

• SD/MMC Card Interface

• SDIO Interface

8.5.1. SPI – Serial Peripheral Interface

The LE910Cx SPI supports the following:

• Master Mode only

• 1.8V CMOS level

• Up to 50 MHz clock rate

NOTE:

SPI is supported only on the Linux side.

The LE910Cx module supports Master mode only and cannot be configured as Slave mode.

NOTE:

Simultaneous / Concurrent usage of AUX UART and SPI is not supported.

Table 27: SPI Signals

PAD Signal I/O Function Type Comment

F15 SPI_CLK O SPI clock output 1.8V

E15 SPI_MISO I SPI data Master input Slave output 1.8V Shared with RX_AUX

D15 SPI_MOSI O SPI data Master output Slave input 1.8V Shared with TX_AUX

H14 SPI_CS/GPIO11 O SPI chip-select output 1.8V

Figure 15: SPI Signal Connectivity

LE910Cx

SPI_CS

SPI_CLK

SPI_MO

SPI_MISO

Host (Slave)

SPI_CS

SPI_CLK

SPI_MOSI

SPI_MISO

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8.5.2. I2C - Inter-integrated Circuit

The LE910Cx supports an I2C interface on the following pins:

• B11 - I2C_SCL

• B10 - I2C_SDA

The I2C can also be used externally by the end customer application.

In addition, SW emulated I2C functionality can be used on GPIO 1-10 pins.

Any GPIO (among GPIO 1-10) can be configured as SCL or SDA.

LE910Cx supports I2C Master Mode only.

NOTE:

SW emulated I2C on GPIO lines is supported only from the Modem side.

For more information, refer to the LE910Cx AT SW manual for command settings.

NOTE:

For keeping backward compatibility with previous LE910 products it is recommended to keep

using the SW emulated I2C available on GPIO’s 1-10.

8.5.3. SD/MMC Card Interface

The LE910Cx provides an SD port supporting the SD3.0 specification, which can be used to support

standard SD/MMC memory cards with the following features:

• Interface with SD/MMC memory cards up to 2 TB

• Max clock @ 2.95V - 50 MHz SDR

• Max Data: 25 MB/s

• SD standard: HS-SDR25 at 2.95V

• Max clock @ 1.8V - 200 MHz SDR

• Max Data: 100 MB/s

• SD standard: UHS-SDR104 at 1.8 V

• Max clock @ 1.8V - 50 MHz DDR

• Max Data: 50 MB/s

• SD standard: UHS-DDR50 at 1.8 V

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Table 28 lists the LE910Cx SD card signals.

Table 28: SD Card Signals

PAD Signal I/O Function Type Comments

J12 SD/MMC_CMD O SD command 1.8/2.95V

F12 SD/MMC_CLK O SD card clock 1.8/2.95V

E12 SD/MMC_DATA0 I/O SD Serial Data 0 1.8/2.95V

G12 SD/MMC_DATA1 I/O SD Serial Data 1 1.8/2.95V

K12 SD/MMC_DATA2 I/O SD Serial Data 2 1.8/2.95V

H12 SD/MMC_DATA3 I/O SD Serial Data 3 1.8/2.95V

G13 SD/MMC_CD I SD card detect input 1.8V Active Low

F13 VMMC - Power supply for MMC

card pull-up resistors

1.8/2.95V Max Current is

50mA

Figure 16 shows the recommended connection diagram of the SD interface.

Figure 16: SD/MMC Interface Connectivity

SD/MMC_DATA2

SD/MMC_DATA3

SD/MMC_CMD

SD/M

MC_CLK

SD/MMC_DATA0

SD/MMC_DATA1

LE910Cx

SD/MMC Interface

SD/MMC_CD

DATA2

DATA3

CMD

VDD

VSS

DATA0

DATA1

MicroSD

MMC_CD

GND

C=100nF

GND

External PS 3V VMMC

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NOTE:

SD/MMC is supported only on the Linux side.

The power supply to the SD/MMC card is to be provided by the Host application board. The

LE910Cx does not provide a dedicated power supply for the SD/MMC card.

VMMC Supply is limited to 50mA thus can only supply the MMC card external pull-up resistors.

Pull-up resistors must be placed on the host application board.

The card detection input has an internal pull-up resistor.

VMMC can be used for enabling of the external power supply (LDO Enable signal)

8.5.4. WiFi SDIO Interface

The LE910Cx provides an SDIO port supporting the SDIO3.0 specification, which can be used to

interface with a WiFi chipset (Qualcomm QCA6574 chipset or other WiFi solutions)

The LE910Cx module includes an integrated SW driver for supporting the Qualcomm QCA6574

chipset

The LE910Cx SDIO port supports the SDIO 3.0 specification at 1.8V CMOS only, thus cannot be used

as an external SD/MMC card connection.

The LE910Cx module supports an LTE/WiFi coexistence mechanism via the WCI (Wireless

Coexistence Interface) port, which connects between the module and the external WiFi IC.

For a detailed explanation, refer to Ref 5:

Table 29: WiFi SDIO Interface Signals

PAD Signal I/O Function Type Comments

N13 WIFI_SD_CMD O WiFi SD Command 1.8V

L13 WIFI_SD_CLK O WiFi SD Clock 1.8V 200 MHz max.

J13 WIFI_SD_DATA0 I/O WiFi SD Serial Data 0 1.8V

M13 WIFI_SD_DATA1 I/O WiFi SD Serial Data 1 1.8V

K13 WIFI_SD_DATA2 I/O WiFi SD Serial Data 2 1.8V

H13 WIFI_SD_DATA3 I/O WiFi SD Serial Data 3 1.8V

L12 WIFI_SDRST O WiFi Reset / Power enable control 1.8V Active Low

M8 WCI_TX O Wireless coexistence interface TXD 1.8V

M9 WCI_RX I Wireless coexistence interface RXD 1.8V

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NOTE:

It is recommended that WiFi_SDRST be equipped with a pull-up resistor to 1.8V on the host

application to disable WiFi reset function if needed.

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8.6. Audio Interface

The LE910Cx module support digital audio interface.

8.6.1. Digital Audio

The LE910Cx module can be connected to an external codec through the digital interface.

The product provides a single Digital Audio Interface (DVI) on the following pins:

Table 30: Digital Audio Interface (DVI) Signals

PAD Signal I/O Function Type COMMENT

B9 DVI_WAO O Digital Audio Interface (WAO) B-PD 1.8V PCM_SYNC

B6 DVI_RX I Digital Audio Interface (RX) B-PD 1.8V PCM_DIN

B7 DVI_TX O Digital Audio Interface (TX) B-PD 1.8V PCM_DOUT

B8 DVI_CLK O Digital Audio Interface (CLK) B-PD 1.8V PCM_CLK

B12 REF_CLK O Audio Master Clock B-PD 1.8V I2S_MCLK

LE910Cx DVI has the following characteristics:

• PCM Master mode using short or long frame sync modes

• 16 bit linear PCM format

• PCM clock rates of 256 kHz, 512 kHz, 1024 kHz and 2048 kHz (Default)

• Frame size of 8, 16, 32, 64, 128 & 256 bits per frame

• Sample rates of 8 kHz and 16 kHz

In addition to the DVI port, the LE910Cx module provides a master clock signal (REF_CLK on Pin

B12) which can either provide a reference clock to an external codec or form an I2S interface

together with the DVI port where the REF_CLK acts as the I2S_MCLK.

The REF_CLK default frequency is 12.288 MHz.

When using the DVI with REF_CLK as an I2S interface, 12.288 MHz is 256 x fs (where fs = 48 kHz)

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8.6.1.1. Short Frame Timing Diagrams

Figure 17: Primary PCM Timing

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Table 31: PCM_CODEC Timing Parameters

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8.6.1.2. Long Frame Timing Diagrams

Figure 18: Auxiliary PCM Timing

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Table 32: AUX_PCM_CODEC Timing Parameters

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8.7. General Purpose I/O

The general-purpose I/O pads can be configured to act in three different ways:

• Input

• Output

• Alternate function (internally controlled)

Input pads can only be read and report digital values (high or low) present on the pad at the read

time. Output pads can only be written or queried and set the value of the pad output. An

alternate function pad is internally controlled by LE910Cx firmware and acts depending on the

implemented function.

The following GPIOs are always available as a primary function on the LE910Cx.

Table 33: Primary GPIOs

PAD Signal I/O Function Type Drive Strength

C8 GPIO_01 I/O Configurable GPIO CMOS 1.8V 2-16 mA

C9 GPIO_02 I/O Configurable GPIO CMOS 1.8V 2-16 mA

C10 GPIO_03 I/O Configurable GPIO CMOS 1.8V 2-16 mA

C11 GPIO_04 I/O Configurable GPIO CMOS 1.8V 2-16 mA

B14 GPIO_05 I/O Configurable GPIO CMOS 1.8V 2-16 mA

C12 GPIO_06 I/O Configurable GPIO CMOS 1.8V 2-16 mA

C13 GPIO_07 I/O Configurable GPIO CMOS 1.8V 2-16 mA

K15 GPIO_08 I/O Configurable GPIO CMOS 1.8V 2-16 mA

L15 GPIO_09 I/O Configurable GPIO CMOS 1.8V 2-16 mA

G15 GPIO_10 I/O Configurable GPIO CMOS 1.8V 2-16 mA

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The additional GPIOs below can be used in case their initial functionality is not used:

PAD Signal I/O Initial Function Alternate Function Type Drive Strength

L12 GPIO_13 I/O WIFI_SDRST Configurable GPIO CMOS 1.8V 2-16 mA

N13 GPIO_14 I/O WIFI_SDIO_CMD Configurable GPIO CMOS 1.8V 2-16 mA

J13 GPIO_15 I/O WIFI_SDIO_D0 Configurable GPIO CMOS 1.8V 2-16 mA

M13 GPIO_16 I/O WIFI_SDIO_D1 Configurable GPIO CMOS 1.8V 2-16 mA

K13 GPIO_17 I/O WIFI_SDIO_D2 Configurable GPIO CMOS 1.8V 2-16 mA

H13 GPIO_18 I/O WIFI_SDIO_D3 Configurable GPIO CMOS 1.8V 2-16 mA

L13 GPIO_19 I/O WIFI_SDIO_CLK Configurable GPIO CMOS 1.8V 2-16 mA

M8 GPIO_24 I/O WCI_TXD Configurable GPIO CMOS 1.8V 2-16 mA

M9 GPIO_25 I/O WCI_RXD Configurable GPIO CMOS 1.8V 2-16 mA

R14 GPIO_31 I/O UART_RI Configurable GPIO CMOS 1.8V 2-16 mA

P14 GPIO_32 I/O UART_DSR Configurable GPIO CMOS 1.8V 2-16 mA

N14 GPIO_33 I/O UART_DCD Configurable GPIO CMOS 1.8V 2-16 mA

M14 GPIO_34 I/O UART_DTR Configurable GPIO CMOS 1.8V 2-16 mA

F15 GPIO_35 I/O SPI_CLK Configurable GPIO CMOS 1.8V 2-16 mA

E15 GPIO_36 I/O SPI_MISO Configurable GPIO CMOS 1.8V 2-16 mA

D15 GPIO_37 I/O SPI_MOSI Configurable GPIO CMOS 1.8V 2-16 mA

H14 GPIO_11 I/O SPI_CS Configurable GPIO CMOS 1.8V 2-16 mA

NOTE:

To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal

applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition.

NOTE:

LE910Cx GPIO 1~10 can also be used as alternate I2C function.

Refer to Section 0,

LE910Cx Hardware User Guide

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I2C

Inter

integrated

Circuit

8.7.1. Using a GPIO Pad as Input

GPIO pads, when used as inputs, can be connected to a digital output of another device and

report its status, provided this device has interface levels compatible with the 1.8V CMOS levels

of the GPIO.

If the digital output of the device is connected with the GPIO input, the pad has interface levels

different from the 1.8V CMOS. It can be buffered with an open collector transistor with a 47 kΩ

pull-up resistor to 1.8V.

8.7.2. Using a GPIO Pad as an interrupt / Wakeup source

GPIO pads which are used as input can also be used as an interrupt source for the software.

In general all GPIO pads can be also used as interrupts.

However, not all GPIO’s can be used as a wakeup source of the module (wakeup from sleep)

Only the following GPIO’s can be used for waking up the system from sleep

• GPIO1

• GPIO4

• GPIO5

• GPIO8

8.7.3. Using a GPIO Pad as Output

GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware.

When set as outputs, the pads have a push-pull output, and therefore the pull-up resistor can be

omitted.

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Figure 19: GPIO Output Pad Equivalent Circuit

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9. Miscellaneous Functions

9.1. Indication of Network Service Availability

The STAT_LED signal shows information on the network service availability and call status. In the

LE910Cx modules, the STAT_LED usually needs an external transistor to drive an external LED.

The STAT_LED does not have a dedicated pin. The STAT_LED functionality is available on GPIO_01

pin (by default GPIO_01 functions as STAT_LED)

The table below shows the device status corresponding to the pin status:

Table 34: Network Service Availability Indication

LED Status Device Status

Permanently off Device off

Fast blinking (Period 1s, T

0,5s) Net search / Not registered / Turning off

Slow blinking (Period 3s, T

0,3s) Registered full service

Permanently on A call is active

Figure 20: Status LED Reference Circuit

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9.2. Indication of Software Ready

The SW_RDY signal provides indication about the ability of the module to receive commands

As long as the SW_RDY is asserted low it indicates that the LE910Cx has not yet finished booting

Once the SW_RDY is asserted high, it indicates that the LE910Cx is ready to receive commands

The SW_RDY does not have a dedicated pin

The SW_RDY functionality is available on GPIO_08 pin (by default GPIO_08 functions as SW_RDY

9.3. RTC – Real Time Clock

The RTC within the LE910Cx module does not have a dedicated RTC supply pin.

The RTC block is supplied by the VBATT supply.

If the battery is removed, RTC is not maintained so if maintaining an internal RTC is needed,

VBATT must be supplied continuously.

In Power OFF mode, the average current consumption is ~25uA.

9.4. VAUX Power Output

A regulated power supply output is provided to supply small devices from the module. This

output is active when the module is ON and goes OFF when the module is shut down. The

operating range characteristics of the supply are as follows:

Table 35: Operating Range – VAUX Power Supply

Min Typical Max

Output voltage 1.75V 1.80V 1.85V

Output current 100 mA

Output bypass capacitor

(inside the module)

1 μF

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9.5. ADC Converter

9.5.1. Description

The LE910Cx module provides three 8-bit Analog to Digital converters. Each ADC reads the

voltage level applied on the relevant pin, converts it, and stores it into an 8-bit word.

Table 36 shows the ADC characteristics.

Table 36: ADC Parameters

Min Max Units

Input voltage range 0.1 1.7 Volt

AD conversion - 8 bits

Resolution - < 6.6 mV

9.5.2. Using the ADC Converter

An AT command is available to use the ADC function.

The command is AT#ADC=1,2. The read value is expressed in mV.

Refer to LE9x0 AT Command User Guide 0 for the full description of this function.

9.6. Using the Temperature Monitor Function

The Temperature Monitor permits to control the module’s internal temperature and, if properly

set (see the #TEMPMON command in LE9x0 AT Command User Guide

(

, raises a GPIO to High Logic

level when the maximum temperature is reached.

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9.7. GNSS Characteristics

The table below specifies the GNSS characteristics and expected performance

The values are related to typical environment and conditions Table 37 GNSS Characteristics

Parameters Typical

Measurement Notes

Sensitivity

Standalone or MS Based

Tracking Sensitivity -162.3 dBm

Acquisition -162.3 dBm

Cold Start Sensitivity -157.5 dBm

TTFF

Hot 1.1s GPS+GLONASS Simulator test

Warm 22.1s GPS+GLONASS Simulator test

Cold 29.94s GPS+GLONASS Simulator test

Accuracy 0.8 m GPS+GLONASS Simulator test

Min Navigation update rate 1Hz

Dynamics 2g

A-GPS Supported

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10. Mounting the Module on your Board

10.1. General

The LE910Cx module was designed to be compliant with a standard lead-free SMT process.

10.2. Finishing & Dimensions

Figure 21 shows the mechanical dimensions of the LE910Cx module.

Figure 21: LE910Cx Mechanical Dimensions (bottom view)

Lead-free Alloy:

Surface finishing Ni/Au for all solder pads

4 x Route

Inhibit

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Figure 22: LE910Cx Mechanical Dimensions (Top view)

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Figure 23: LE910Cx Mechanical Dimensions (Side view)

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10.3. Recommended Footprint for the Application

Figure 24 shows the recommended footprint for the application board (dimensions are in mm).

To facilitate replacing the LE910Cx module if necessary, it is suggested to design the application

with a 1.5 mm placement inhibit area around the module.

It is also suggested, as a common rule for an SMT component, to avoid having a mechanical part of

the application in direct contact with the module.

NOTE:

In the customer application, the region marked as INHIBIT in Figure 24 must be clear of any signal

wiring or ground polygons.

Figure 24: Recommended Footprint - Top View, 181 pads (dimensions are in mm, top view).

4 x Route

Inhibit

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10.4. Stencil

Stencil’s apertures layout can be the same as the recommended footprint (1:1). The suggested

thickness of stencil foil is greater than 120 µm.

10.5. PCB Pad Design

The solder pads on the PCB are recommended to be of the Non Solder Mask Defined (NSMD) type.

Figure 25: PCB Pad Design

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10.6. Recommendations for PCB Pad Dimensions (mm)

Figure 26: PCB Pad Dimensions

It is not recommended to place around the pads a via or micro-via that is not covered by solder

resist in an area of 0.15 mm unless it carries the same signal as the pad itself. Micro via inside the

pads are allowed.

Holes in pad are allowed only for blind holes and not for through holes.

Table 38: Recommendations for PCB Pad Surfaces

Finish Layer Thickness (um) Properties

Electro-less Ni / Immersion Au 3-7 / 0.05-0.15 Good solder ability

protection, high shear force

values

The PCB must be able to resist the higher temperatures, which occur during the lead-free process.

This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder

paste on the described surface plating is better compared to lead-free solder paste.

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10.7. Solder Paste

We recommend using only “no clean” solder paste to avoid the cleaning of the modules after

assembly.

10.7.1. Solder Reflow

Figure 27 shows the recommended solder reflow profile.

Figure 27: Solder Reflow Profile

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Table 39: Solder Profile Characteristics

Profile Feature Pb-Free Assembly

Average ramp-up rate (T

to T

) 3°C/second max

Preheat

– Temperature min (Tsmin)

– Temperature max (Tsmax)

– Time (min to max) (ts)

150°C

200°C

60-180 seconds

Tsmax to TL

– Ramp-up rate

3°C/second max

Time maintained above:

– Temperature (TL)

– Time (tL)

217°C

60-150 seconds

Peak temperature (Tp) 245 +0/-5°C

Time within 5°C of actual peak

Temperature (tp)

10-30 seconds

Ramp-down rate 6°C/second max

Time 25°C to peak temperature 8 minutes max

NOTE:

All temperatures refer to topside of the package, measured on the package body surface.

Warning:

The LE910Cx module withstands one reflow process only.

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11. Application Guide

11.1. Debug of the LE910Cx Module in Production

To test and debug the mounting of the LE910Cx module, we strongly recommend to add several

test pads on the host PCB for the following purposes:

• Checking the connection between the LE910Cx itself and the application

• Testing the performance of the module by connecting it with an external computer

Depending on the customer application, these test pads include, but are not limited to the following

signals:

• TXD

• RXD

• ON/OFF

• HW_SHUTDOWN_N

• GND

• VBATT

• TX_AUX

• RX_AUX

• USB_VBUS

• USB_D+

• USB_D-

• GPIO_09

• WCI_RX

In addition, the following signals are also recommended (but not mandatory):

• PWRMON

• GPIO_01 (STAT_LED)

• GPIO_08 (SW_RDY)

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11.2. Bypass Capacitor on Power Supplies

When a sudden voltage step is asserted to or a cut from the power supplies, the steep transition

causes some reactions such as overshoot and undershoot. This abrupt voltage transition can affect

the device causing it to not operate or to malfunction.

Bypass capacitors are needed to alleviate this behavior. The behavior can appear differently

depending on the various applications. Customers must pay special attention to this issue when

they design their application board.

The length and width of the power lines must be considered carefully and the capacitance of the

capacitors must be selected accordingly.

The capacitor will also prevent ripple of the power supplies and the switching noise caused in TDMA

systems such as GSM.

Especially, a suitable bypass capacitor must be mounted on the following lines on the application

board:

• VBATT & VBATT_PA (M1, M2, N1, N2, P1, P2)

• USB_VBUS (Pad A13)

Recommended values are:

• 100uF for both VBATT and VBATT_PA together

• 4.7uF for USB_VBUS (including the 1uF capacitor inside the module)

Customers must still consider that the capacitance mainly depends on the conditions of their

application board.

Generally, more capacitance is required when the power line is longer.

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11.3. SIM Interface

This section presents the recommended schematics for the design of SIM interfaces on the

application boards. The LE910Cx supports two external SIM interfaces.

11.3.1. SIM Schematic Example

Figure 28 illustrates in particular how the application side should be designed, and what values the

components should have.

Figure 28: SIM Schematics

NOTE:

The resistor value on SIMIO pulled up to SIMVCC must be defined to be compliant with the 3GPP

specification for USIM electrical testing.

The LE910Cx module contains an internal pull-up resistor of 20K Ω on SIMIO.

However, the un-mounted option in the application design can be recommended to tune R1 if

necessary.

Table 40 lists the values of C1 to be adopted with the LE910Cx product:

Table 40: SIM Interface – C1 Range

Product P/N C1 Range (nF)

LE910Cx 100 nF

Refer to the following document for details:

• Error! Reference source not found.

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11.4. EMC Recommendations

All LE910Cx signals are provided with some EMC protection. Nevertheless, the accepted level

differs according to the specific pin. Table 41 lists the characteristics.

Table 41: EMC Recommendations

Pad Signal I/O Function Contact

Air

All Pins

All pins All functions ± 4KV ± 8KV

Antenna

F1,K1,R9 Antenna

pads

Analog

I/O

Antenna pad ± 4KV ± 4KV

Appropriate series resistors must be considered to protect the input lines from overvoltage.

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11.5. Download and Debug Port

Chose one of the following options in the design of host system to download or upgrade the Telit

software and debug the LE910Cx module when it is already mounted on a host system.

• UART and USB interfaces

Users who use both UART and USB interfaces to communicate with the LE910Cx module must

implement a USB download method in the host system to upgrade the LE910Cx when it is

mounted.

• USB interface only

Users who use a USB interface only to communicate with the LE910Cx module must arrange

for a USB port in the host system to debug or upgrade the LE910Cx when it is mounted.

• UART interface only

Users who use a UART interface only to communicate with the LE910Cx module must arrange

for a UART port in the host system to debug or upgrade the LE910Cx when it is mounted.

11.5.1. Fast Boot mode

Fast boot mode is normally used by Telit SW to enter SW download mode

Fastboot is triggered by GPIO_09 (PAD L15). Asserting this signal high (1.8V) during boot will force

the system into Fastboot

11.5.2. Recovery Boot Mode

Emergency boot download mode is used in case of corrupted boot image was flashed into the

device or in case all other recovery modes failed to work

Emergency download mode is triggered by WCI_RX signal (PAD M9). Asserting this signal high

(1.8V) during boot will force the system into Emergency download.

NOTE:

Application board must support accessible test pads on GPIO_09 and WCI_RX signal in order to

enable download recovery modes mentioned above

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12. Packing System

12.1. Packing system – Tray

The LE910Cx modules are packaged on trays of 36 pieces each as shown in Figure 29.

These trays can be used in SMT processes for pick & place handling.

Figure 29: Packing

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Figure 30: Tray Drawing

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12.2. Tape & Reel

The LE910Cx can be packaged on reels of 200 pieces each.

See figure for module positioning into the carrier.

Figure 31: Module Positioning into the Carrier

Figure 32: Carrier Tape Detail

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Figure 33: Reel Detail

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Figure 34: Reel Box Detail

12.3. Moisture Sensitivity

The LE910Cx module is a Moisture Sensitive Device Level 3, in accordance with standard IPC/JEDEC

J-STD-020. Observe all of the requirements for using this kind of components.

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13. Safety Recommendations

READ CAREFULLY

Be sure that the use of this product is allowed in your country and in the environment required.

The use of this product may be dangerous and must be avoided in the following areas:

• Where it can interfere with other electronic devices in environments such as hospitals,

airports, aircrafts, etc.

• Where there is risk of explosion, such as gasoline stations, oil refineries, etc.

It is the responsibility of the user to enforce the country regulations and the specific environment

regulations.

Do not disassemble the product; any mark of tampering will compromise the warranty validity.

We recommend following the instructions of the hardware user guides for correct wiring of the

product. The product must be supplied with a stabilized voltage source and the wiring conform to

the security and fire prevention regulations.

The product must be handled with care, avoiding any contact with the pins because electrostatic

discharges may damage the product itself. The same caution must be taken for the SIM, checking

carefully the instructions for its use. Do not insert or remove the SIM when the product is in power

saving mode.

The system integrator is responsible for the functioning of the final product; therefore, care must

be taken of the external components of the module, as well as of any project or installation issue,

because of the risk of disturbing the GSM network or external devices or having any impact on

safety. Should there be any doubt, refer to the technical documentation and the regulations in

force.

Every module must be equipped with a proper antenna with the specified characteristics. The

antenna must be installed with care to avoid any interference with other electronic devices and

must be installed with the guarantee of a minimum 20 cm distance from a human body. If this

requirement cannot be satisfied, the system integrator must assess the final product against the

SAR regulation.

The European Community provides some Directives for electronic equipment introduced on the

market. All the relevant information is available on the European Community website:

http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm

The text of the Directive 99/05 regarding telecommunication equipment is available, while the

applicable Directives (Low Voltage and EMC) are available at:

http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm

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14. Conformity assessment issues

14.1. FCC/ISED Regulatory notices

Modification statement

Telit has not approved any changes or modifications to this device by the user. Any changes or

modifications could void the user’s authority to operate the equipment.

Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la

nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par

l’utilisateur.

Interference statement (if it is not placed in the device)

This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS

standard(s). Operation is subject to the following two conditions: (1) this device may not cause

interference, and (2) this device must accept any interference, including interference that may

cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio

exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne

doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage

radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Wireless notice

This device complies with FCC/ISED radiation exposure limits set forth for an uncontrolled

environment and meets the FCC radio frequency (RF) Exposure Guidelines and RSS-102 of the ISED

radio frequency (RF) Exposure rules.

Antenna gain must be below:

Frequency Band Freq [MHz] LE910C1 NA Gain

[dBi] LE910C1 NS Gain

[dBi]

850 MHZ 850 0.63 6.08

1900 MHZ 1900 2.51 8.01

1700 MHZ 1700 5.00 5.00

900 MHZ 900 5.00 N/A

700 MHZ 700 5.63 5.63

This transmitter must not be co-located or operating in conjunction with any other antenna or

transmitter.

Le présent appareil est conforme à l'exposition aux radiations FCC / ISED définies pour un

environnement non contrôlé et répond aux directives d'exposition de la fréquence de la FCC

radiofréquence (RF) et RSS-102 de la fréquence radio (RF) ISED règles d'exposition. Gain de

l'antenne doit être ci-dessous:

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Frequency Band Freq [MHz] LE910C1 NA Gain

[dBi] LE910C1 NS Gain

[dBi]

850 MHZ 850 0.63 6.08

1900 MHZ 1900 2.51 8.01

1700 MHZ 1700 5.00 5.00

900 MHZ 900 5.00 N/A

700 MHZ 700 5.63 5.63

L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne

ou autre émetteur.

FCC Class B digital device notice

This equipment has been tested and found to comply with the limits for a Class B digital device,

pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection

against harmful interference in a residential installation. This equipment generates, uses and can

radiate radio frequency energy and, if not installed and used in accordance with the instructions,

may cause harmful interference to radio communications. However, there is no guarantee that

interference will not occur in a particular installation. If this equipment does cause harmful

interference to radio or television reception, which can be determined by turning the equipment

off and on, the user is encouraged to try to correct the interference by one or more of the following

measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver

is connected.

- Consult the dealer or an experienced radio/TV technician for help.

Labelling Requirements for the Host device

The host device shall be properly labelled to identify the modules within the host device. The

certification label of the module shall be clearly visible at all times when installed in the host device,

otherwise the host device must be labelled to display the FCC ID and IC of the module, preceded

by the words "Contains transmitter module", or the word "Contains", or similar wording expressing

the same meaning, as follows:

LE910C1 NA

Contains FCC ID: RI7LE910C1NA

Contains IC:

5131A-LE910C1NA

LE910C1 NS

Contains FCC ID: RI7LE910C1NS

Contains IC:

5131A-LE910C1NS

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L'appareil hôte doit être étiqueté comme il faut pour permettre l'identification des modules qui s'y

trouvent. L'étiquette de certification du module donné doit être posée sur l'appareil hôte à un

endroit bien en vue en tout temps. En l'absence d'étiquette, l'appareil hôte doit porter une étiquette

donnant le FCC ID et le IC du module, précédé des mots « Contient un module d'émission », du mot

« Contient » ou d'une formulation similaire exprimant le même sens, comme suit:

LE910C1 NA

Contains FCC ID: RI7LE910C1NA

Contains IC:

5131A-LE910C1NA

LE910C1 NS

Contains FCC ID: RI7LE910C1NS

Contains IC:

5131A-LE910C1NS

CAN ICES-3 (B) / NMB-3 (B)

This Class B digital apparatus complies with Canadian ICES-003.

Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.

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15. Document History

Table 42: Document Revision History

Revision

Date Changes

0.1 2016-08-30 First Draft

0.2 2016-09-05 Minor edits

0.3 2016-11-13 Added information for GPIO usage as Interrupt

Added clarification for AUX_UART location and backward

compatibility

0.4 2016-11-30 Updated band support table

Updated WIFI application note doc info

Added note related to future compatibility related to few pins

Updated section 3.2 - Signals That Must Be Connected

Updated pinout and pin description

Updated pinout layout (Figure 2)

Remove HW RESET description section

Updated serial port 2 section

Updated SPI port section

Updated 1.8V pads pull info

Updated AUX UART section

Updated GPIO section

Updated mechanical drawing (Cosmetic)

0.5 2016-12-02 Added section 9.2 to better describe SW_RDY signal

Minor modifications per typos and improved description

Renaming of SHDN_N pin

0.6 2016-12-07 Remove all China variant related information

1.0 2016-12-22 Section 1.5 - Updated “Related Documents” table

Section 5.3.4 – Added Figure for SHDN_N power down timing

Section 8.5.3 – Added clarification about VMMC

Section 9.7 - Added GNSS characteristics

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Revision

Date Changes

1.01 2017-02-16 Adding Section 14: FCC/ISED Regulatory notices

Changing Document History section from 14 to 15

1.02 2017-04-03 Section 14.1 – updated column “Band” to “Frequency Band” in

Wireless notice table

Section 8.4.1 - Added note regarding DTR

1.03 2017-04-23 Section 11.4 – Updated ESD values

Updated Reference document table

Section 8.3 - Updated Ethernet control interface information

Section 8.5.2 – Added note related to I2C

Section 2.6.2 – Updated table 4 with B25 information.

Section 14.1 – Added LE910C1 NS Max antenna gain.

Added LE910C1 NS FCC ID & IC number.

1.04 2017-05-25 Section 14.1 – Added Labelling Requirements for the Host device

Telit Communications S p A LE910C1NS Wireless Module User Manual 1VV0301298 LE910Cx Hardware User Guide r1 04

Telit Communications S.p.A. Wireless Module 1VV0301298 LE910Cx Hardware User Guide r1 04

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