Telit Communications S p A LE910NA LTE/3G/2G Module User Manual HE910 Hardware User Guide

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Date Submitted	2014-07-02 00:00:00
Date Available	2014-12-29 00:00:00
Creation Date	2014-06-19 17:51:02
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Document Title	HE910 Hardware User Guide
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
Applicability Table
PRODUCT
LE910-EUG
LE910-NAG
LE910-NVG
LE910-SVG
LE910-SKG
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable efforts have been made to assure the accuracy of this document, Telit assumes
no liability resulting from any inaccuracies or omissions in this document, or from use of the
information obtained herein. The information in this document has been carefully checked and is
believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or
omissions. Telit reserves the right to make changes to any products described herein and
reserves the right to revise this document and to make changes from time to time in content
hereof with no obligation to notify any person of revisions or changes. Telit does not assume
any liability arising out of the application or use of any product, software, or circuit described
herein; neither does it convey license under its patent rights or the rights of others.
It is possible that this publication may contain references to, or information about Telit products
(machines and programs), programming, or services that are not announced in your country.
Such references or information must not be construed to mean that Telit intends to announce
such Telit products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit
and its licensors certain exclusive rights for copyrighted material, including the exclusive right
to copy, reproduce in any form, distribute and make derivative works of the copyrighted
material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in
the Telit products described in this instruction manual may not be copied, reproduced,
distributed, merged or modified in any manner without the express written permission of Telit.
Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by
implication, estoppel, or otherwise, any license under the copyrights, patents or patent
applications of Telit, as arises by operation of law in the sale of a product.
Computer Software Copyrights
The Telit and 3rd Party supplied Software (SW) products described in this instruction manual
may include copyrighted Telit and other 3rd Party supplied computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit
and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs,
including the exclusive right to copy or reproduce in any form the copyrighted computer
program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs
contained in the Telit products described in this instruction manual may not be copied (reverse
engineered) or reproduced in any manner without the express written permission of Telit or the
3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant
either directly or by implication, estoppel, or otherwise, any license under the copyrights,
patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal
non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.
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page 3 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
Usage and Disclosure Restrictions
License Agreements
The software described in this document is the property of Telit and its licensors. It is furnished
by express license agreement only and may be used only in accordance with the terms of such
an agreement.
Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or computer language,
in any form or by any means, without prior written permission of Telit
High Risk Materials
Components, units, or third-party products used in the product described herein are NOT faulttolerant and are NOT designed, manufactured, or intended for use as on-line control equipment
in the following hazardous environments requiring fail-safe controls: the operation of Nuclear
Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life
Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically
disclaim any expressed or implied warranty of fitness for such High Risk Activities.
Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service
names are the property of their respective owners.
Copyright © Telit Communications S.p.A. 2014
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
INTRODUCTION ......................................................................................................................................................... 7
1.1 SCOPE ................................................................................................................................................................................ 7
1.2 AUDIENCE ........................................................................................................................................................................... 7
1.3 CONTACT INFORMATION, SUPPORT .......................................................................................................................................... 7
1.4 DOCUMENT ORGANIZATION ................................................................................................................................................... 8
1.5 TEXT CONVENTIONS .............................................................................................................................................................. 9
1.6 RELATED DOCUMENTS........................................................................................................................................................... 9
1.7 DOCUMENT HISTORY .......................................................................................................................................................... 10
OVERVIEW .............................................................................................................................................................. 11
LE910 MODULE CONNECTIONS................................................................................................................................ 12
3.1 PIN-OUT ......................................................................................................................................................................... 12
3.1.1 LGA Pads Layout..................................................................................................................................................... 17
HARDWARE COMMANDS ........................................................................................................................................ 18
4.1 TURNING ON THE LE910 .................................................................................................................................................... 18
4.2 INITIALIZATION AND ACTIVATION STATE................................................................................................................................... 20
4.3 TURNING OFF THE LE910 ................................................................................................................................................... 21
4.3.1 Shutdown by Software Command .......................................................................................................................... 21
4.3.2 Hardware Shutdown .............................................................................................................................................. 22
4.4 LE910 UNCONDITIONAL SHUTDOWN ..................................................................................................................................... 23
4.5 SUMMARY OF TURNING ON AND OFF THE MODULE ................................................................................................................. 26
POWER SUPPLY ....................................................................................................................................................... 27
5.1 POWER SUPPLY REQUIREMENTS ............................................................................................................................................ 27
5.2 POWER CONSUMPTION ....................................................................................................................................................... 28
5.3 GENERAL DESIGN RULES ...................................................................................................................................................... 29
5.3.1 Electrical Design Guidelines ................................................................................................................................... 29
5.3.2 Thermal Design Guidelines ..................................................................................................................................... 33
5.3.3 Power Supply PCB layout Guidelines ...................................................................................................................... 34
GSM/WCDMA/LTE RADIO SECTION......................................................................................................................... 36
6.1 LE910 PRODUCT VARIANTS ................................................................................................................................................. 36
6.2 TX OUTPUT POWER ............................................................................................................................................................ 36
6.3 GSM/WCDMA/LTE ANTENNA REQUIREMENTS .................................................................................................................... 37
6.4 GSM/WCDMA/LTE - PCB LINE GUIDELINES......................................................................................................................... 40
6.5 GSM/WCDMA/LTE ANTENNA - INSTALLATION GUIDELINES .................................................................................................... 41
6.6 ANTENNA DIVERSITY REQUIREMENTS ..................................................................................................................................... 41
GNSS RECEIVER ....................................................................................................................................................... 43
7.1 GNSS SIGNALS PINOUT ....................................................................................................................................................... 43
7.2 GPS/GLONASS ANTENNA REQUIREMENTS............................................................................................................................ 43
7.2.1 GNSS Antenna - PCB Line Guidelines ...................................................................................................................... 44
7.2.2 RF Trace Losses....................................................................................................................................................... 44
7.2.3 GNSS Antenna - Installation ................................................................................................................................... 45
LOGIC LEVEL SPECIFICATIONS .................................................................................................................................. 46
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
UNCONDITIONAL SHUTDOWN ................................................................................................................................ 47
10
USB PORT ................................................................................................................................................................ 48
10.1 USB 2.0 HS DESCRIPTION ................................................................................................................................................. 48
11
SERIAL PORTS .......................................................................................................................................................... 49
11.1 MODEM SERIAL PORT 1 ............................................................................................................................................... 50
11.2 MODEM SERIAL PORT 2 (USIF1) ................................................................................................................................... 51
11.3 RS232 LEVEL TRANSLATION................................................................................................................................................ 52
12
AUDIO SECTION OVERVIEW .................................................................................................................................... 54
12.1 ELECTRICAL CHARACTERISTICS ............................................................................................................................................. 54
13
GENERAL PURPOSE I/O ........................................................................................................................................... 55
13.1 GPIO LOGIC LEVELS .......................................................................................................................................................... 56
13.2 USING A GPIO PAD AS INPUT ........................................................................................................................................... 56
13.3 USING A GPIO PAD AS OUTPUT ........................................................................................................................................ 56
13.4 INDICATION OF NETWORK SERVICE AVAILABILITY ..................................................................................................................... 57
13.5 RTC BYPASS OUT ............................................................................................................................................................. 58
13.6 VAUX POWER OUTPUT..................................................................................................................................................... 58
13.7 ADC CONVERTER ............................................................................................................................................................. 59
13.7.1 Description ........................................................................................................................................................... 59
13.7.2 Using ADC Converter ............................................................................................................................................ 59
14
MOUNTING THE LE910 ON THE APPLICATION ......................................................................................................... 60
14.1 GENERAL ........................................................................................................................................................................ 60
14.2 MODULE FINISHING & DIMENSIONS ..................................................................................................................................... 60
14.3 RECOMMENDED FOOT PRINT FOR THE APPLICATION ................................................................................................................. 62
14.4 STENCIL .......................................................................................................................................................................... 63
14.5 PCB PAD DESIGN .............................................................................................................................................................. 63
14.6 PCB PAD DIMENSIONS ....................................................................................................................................................... 64
14.7 SOLDER PASTE .................................................................................................................................................................. 66
14.7.1 LE910 Solder reflow .............................................................................................................................................. 66
14.8 PACKING SYSTEM (TRAY) .................................................................................................................................................... 68
14.9 PACKING SYSTEM (REEL) .................................................................................................................................................... 70
14.9.1 Carrier Tape Detail ............................................................................................................................................... 70
14.9.2 Reel Detail ............................................................................................................................................................ 71
14.9.3 Packaging Detail .................................................................................................................................................. 72
14.10 MOISTURE SENSITIVITY .................................................................................................................................................... 72
15
SAFETY RECOMMANDATIONS ................................................................................................................................. 73
16
CONFORMITY ASSESSMENT ISSUES ......................................................................................................................... 74
16.1 1999/5/EC DIRECTIVE ..................................................................................................................................................... 74
16.2 FCC/IC REGULATORY NOTICES ............................................................................................................................................ 77
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page 6 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The aim of this document is the description of some hardware solutions useful for developing a
product with the Telit LE910 module.
This document is intended for Telit customers, who are integrators, about to implement their
applications using our LE910 modules.
For general contact, technical support, to report documentation errors and to order manuals,
contact Telit’s Technical Support Center (TTSC) at:
TS-EMEA@telit.com
TS-NORTHAMERICA@telit.com
TS-LATINAMERICA@telit.com
TS-APAC@telit.com
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where you can buy the Telit modules or for recommendations on
accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit’s
Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your comments and
suggestions for improvements.
Telit appreciates feedback from the users of our information.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 7 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
This document contains the following chapters:
Chapter 1: “Introduction” provides a scope for this document, target audience, contact and
support information, and text conventions.
Chapter 2: “Overview” provides an overview of the document.
Chapter3: “LE910 Module Connections” deals with the pin out configuration and layout.
Chapter 4: “Hardware Commands” How to operate on the module via hardware.
Chapter 5: “Power supply” Power supply requirements and general design rules.
Chapter 6: “GSM/WCDMA Radio” The antenna connection and board layout design are the
most important parts in the full product design.
Chapter 7: “GNSS Receiver” This section describes the GNSS receiver.
Chapter 8: “Logic Level specifications” Specific values adopted in the implementation of logic
levels for this module.
Chapter 9: “USB Port” The USB port on the Telit LE910 is the core of the interface between the
module and OEM hardware
Chapter 10: “SPI port” Refers to the SPI port of the Telit LE910
Chapter 11: “Serial ports” Refers to the serial ports of the Telit LE910
Chapter 12: “Audio Section overview” Refers to the audio blocks of the Base Band Chip of the
LE910 Telit Modules.
Chapter 13: “General Purpose I/O” How the general purpose I/O pads can be configured.
Chapter 14: “Mounting the LE910 on the application board” Mechanical dimensions and
recommendations on how to mount the module on the user’s board.
Chapter 15: “Safety Recommendations” Information related to the Safety topics.
Chapter 16: “Conformity Assessment Issues” Information related to the Conformity
Assessments.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 8 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
Danger – This information MUST be followed or catastrophic equipment failure or bodily
injury may occur.
Caution or Warning – Alerts the user to important points about integrating the module, if
these points are not followed, the module and end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful when integrating
the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.




LE910 Product description
SIM Holder Design Guides
AT Commands Reference Guide
Telit EVK2 User Guide
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
80421ST10587a
80000NT10001a
80421ST10585A
1vv0300704
page 9 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
Revision
ISSUE#0
ISSUE#1
Da t e
2013-11-07
2013-12-20
ISSUE#2
2014-05-12
ISSUE#3
2014-06-19
Changes
Preliminary Version
Updated schematics & tray drawing;
Added LE910-SVG and LE910-SKG; LE910-EUG now Dual Band 2G
(900/1800); added B5 WCDMA on LE910-EUG.
Added Conformity assessment issues section for LE910-NVG, SVG and
NAG; updated chapter 10 (USB).
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 10 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The aim of this document is the description of some hardware solutions useful for developing a
product with the Telit LE910 module.
In this document all the basic functions of a mobile phone will be taken into account; for each
one of them a proper hardware solution will be suggested and eventually the wrong solutions
and common errors to be avoided will be evidenced. Obviously this document cannot embrace
the whole hardware solutions and products that may be designed. The wrong solutions to be
avoided shall be considered as mandatory, while the suggested hardware configurations shall not
be considered mandatory, instead the information given shall be used as a guide and a starting
point for properly developing your product with the Telit LE910 module. For further hardware
details that may not be explained in this document refer to the Telit LE910 Product Description
document where all the hardware information is reported.
NOTICE:
(EN) The integration of the GSM/GPRS/WCDMA/LTE LE910 cellular module within user application
shall be done according to the design rules described in this manual.
(IT) L’integrazione del modulo cellulare GSM/GPRS/WCDMA/LTE LE910 all’interno dell’applicazione
dell’utente dovrà rispettare le indicazioni progettuali descritte in questo manuale.
(DE) Die Integration des LE910 GSM/GPRS/WCDMA/LTE Mobilfunk-Moduls in ein Gerät muß gemäß
der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.
(SL) Integracija GSM/GPRS/WCDMA/LTE LE910 modula v uporabniški aplikaciji bo morala upoštevati
projektna navodila, opisana v tem priročniku.
(SP) La utilización del modulo GSM/GPRS/WCDMA/LTE LE910 debe ser conforme a los usos para los
cuales ha sido deseñado descritos en este manual del usuario.
(FR) L’intégration du module cellulaire GSM/GPRS/WCDMA/LTE LE910 dans l’application de
l’utilisateur sera faite selon les règles de conception décrites dans ce manuel.
(HE)
LE910
The information presented in this document is believed to be accurate and reliable. However, no
responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or
other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in
Telit products. This document is subject to change without notice.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 11 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
PAD
Signal
I/O
Function
USB differential Data (+)
Type
COMMENT
USB HS 2.0 COMMUNICATION PORT
B15
USB_D+
I/O
C15
USB_D-
I/O
USB differential Data (-)
Power sense for the internal USB
transceiver.
VUSB
A13
Asynchronous Serial Port (USIF0) – Prog. / Data + HW Flow Control
N15
C103/TXD
Serial data input from DTE
CMOS 1.8V
M15
C104/RXD
Serial data output to DTE
CMOS 1.8V
M14
C108/DTR
Input for (DTR) from DTE
CMOS 1.8V
Input for Request to send signal
(RTS) from DTE
Output for Clear to Send signal
(CTS) to DTE
L14
C105/RTS
CMOS 1.8V
P15
C106/CTS
N14
C109/DCD
Output for (DCD) to DTE
CMOS 1.8V
P14
C107/DSR
Output for (DSR) to DTE
CMOS 1.8V
R14
C125/RING
Output for Ring (RI) to DTE
CMOS 1.8V
Auxiliary UART (TX Data to DTE)
Auxiliary UART (RX Data from
DTE)
CMOS 1.8V
CMOS 1.8V
Asynchronous Auxiliary Serial Port (USIF1)
D15
TX_AUX
E15
RX_AUX
CMOS 1.8V
SIM card interface
A6
SIMCLK
External SIM signal – Clock
1.8 / 3V
A7
SIMRST
External SIM signal – Reset
1.8 / 3V
A5
SIMIO
I/O
External SIM signal – Data I/O
1.8 / 3V
A4
SIMIN
A3
SIMVCC
External SIM signal – Presence
(active low)
External SIM signal – Power supply
for the SIM
CMOS 1.8
1.8 / 3V
Digital Voice Interface (DVI)
B9
DVI_WA0
I/O
Digital Audio Interface (WA0)
1.8V
B6
DVI_RX
Digital Audio Interface (RX)
1.8V
B7
DVI_TX
I/O
Digital Audio Interface (TX)
1.8V
B8
DVI_CLK
I/O
Digital Audio Interface (CLK)
1.8V
C8
GPIO_01
I/O
GPIO_01 /STAT LED
CMOS 1.8V
C9
GPIO_02
I/O
GPIO_02
CMOS 1.8V
C10
GPIO_03
I/O
GPIO_03
CMOS 1.8V
C11
GPIO_04
I/O
GPIO_04
CMOS 1.8V
DIGITAL IO
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
Alternate Function STAT LED
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
B14
GPIO_05
I/O
GPIO_05
CMOS 1.8V
C12
GPIO_06
I/O
GPIO_06
CMOS 1.8V
C13
GPIO_07
I/O
GPIO_07
CMOS 1.8V
K15
GPIO_08
I/O
GPIO_08
CMOS 1.8V
L15
GPIO_09
I/O
GPIO_09
CMOS 1.8V
G15
GPIO_10
I/O
GPIO_10
CMOS 1.8V
ADC_IN1
AI
Analog / Digital converter input
A/D
K1
ANTENNA
I/O
F1
ANT_DIV
ADC
B1
RF SECTION
GSM/EDGE/UMTS Antenna
(50 ohm)
Antenna Diversity Input
(50 ohm)
RF
RF
GNSS SECTION (see NOTE1)
ANT_GNSS
R9
GNSS_LNA_EN
R7
GNSS Antenna (50 ohm)
RF
Output enable for External LNA
supply
CMOS 1.8V
Miscellaneous Functions
R13
R12
C14
HW_SHUTDOWN*
ON_OFF*
VRTC
HW Unconditional Shutdown
Input command for power ON
VRTC Backup capacitor
1.8V
1.8V
Power
R11
VAUX/PWRMON
Supply Output for external
accessories / Power ON Monitor
1.8V
M1
VBATT
Main power supply (Baseband)
Power
M2
VBATT
Main power supply (Baseband)
Power
N1
VBATT_PA
Main power supply (Radio PA)
Power
N2
VBATT_PA
Main power supply (Radio PA)
Power
P1
VBATT_PA
Main power supply (Radio PA)
Power
Active low
Active low
backup for the embedded RTC supply
Power Supply
P2
VBATT_PA
Main power supply (Radio PA)
Power
E1
GND
Ground
Power
G1
GND
Ground
Power
H1
GND
Ground
Power
J1
GND
Ground
Power
L1
GND
Ground
Power
A2
GND
Ground
Power
E2
GND
Ground
Power
F2
GND
Ground
Power
G2
GND
Ground
Power
H2
GND
Ground
Power
J2
GND
Ground
Power
K2
GND
Ground
Power
L2
GND
Ground
Power
R2
GND
Ground
Power
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
M3
GND
Ground
Power
N3
GND
Ground
Power
P3
GND
Ground
Power
R3
GND
Ground
Power
D4
GND
Ground
Power
M4
GND
Ground
Power
N4
GND
Ground
Power
P4
GND
Ground
Power
R4
GND
Ground
Power
N5
GND
Ground
Power
P5
GND
Ground
Power
R5
GND
Ground
Power
N6
GND
Ground
Power
P6
GND
Ground
Power
R6
GND
Ground
Power
P8
GND
Ground
Power
R8
GND
Ground
Power
P9
GND
Ground
Power
P10
GND
Ground
Power
R10
GND
Ground
Power
M12
GND
Ground
Power
B13
GND
Ground
Power
P13
GND
Ground
Power
E14
GND
Ground
Power
C1
RESERVED
RESERVED
D1
RESERVED
RESERVED
B2
RESERVED
RESERVED
C2
RESERVED
RESERVED
D2
RESERVED
RESERVED
B3
RESERVED
RESERVED
C3
RESERVED
RESERVED
D3
RESERVED
RESERVED
E3
RESERVED
RESERVED
RESERVED
F3
RESERVED
RESERVED
G3
RESERVED
RESERVED
H3
RESERVED
RESERVED
J3
RESERVED
RESERVED
K3
RESERVED
RESERVED
L3
RESERVED
RESERVED
B4
RESERVED
RESERVED
C4
RESERVED
RESERVED
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
B5
RESERVED
RESERVED
C5
RESERVED
RESERVED
C6
RESERVED
RESERVED
C7
RESERVED
RESERVED
N7
RESERVED
RESERVED
P7
RESERVED
RESERVED
N8
RESERVED
RESERVED
N9
RESERVED
RESERVED
A10
RESERVED
RESERVED
N10
RESERVED
RESERVED
N11
RESERVED
RESERVED
P11
RESERVED
RESERVED
B12
RESERVED
RESERVED
D12
RESERVED
RESERVED
N12
RESERVED
RESERVED
P12
RESERVED
RESERVED
F14
RESERVED
RESERVED
G14
RESERVED
RESERVED
H14
RESERVED
RESERVED
J14
RESERVED
RESERVED
K14
RESERVED
RESERVED
N13
RESERVED
RESERVED
L13
RESERVED
RESERVED
J13
RESERVED
RESERVED
M13
RESERVED
RESERVED
K13
RESERVED
RESERVED
H13
RESERVED
RESERVED
G13
RESERVED
RESERVED
F13
RESERVED
RESERVED
A11
RESERVED
RESERVED
A12
RESERVED
RESERVED
B11
RESERVED
RESERVED
B10
RESERVED
RESERVED
A9
RESERVED
RESERVED
A8
RESERVED
RESERVED
D14
RESERVED
RESERVED
A14
RESERVED
RESERVED
D13
RESERVED
RESERVED
E13
RESERVED
RESERVED
F15
RESERVED
RESERVED
H15
RESERVED
RESERVED
J15
RESERVED
RESERVED
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page 15 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
WARNING:
Reserved pins must not be connected.
If not used, almost all pins should be left disconnected. The only exceptions are the following
pins:
PAD
M1,M2,N1,N2,P1,P2
E1,G1,H1,J1,L1,A2,E2,F2,G2,H2,
J2,K2,L2,R2,M3,N3,P3,R3,D4,M4,
N4,P4,R4,N5,P5,R5,N6,P6,R6,P8,
R8,P9,P10,R10,M12,B13,P13,E14
R12
R13
B15
Signal
VBATT & VBATT_PA
C15
USB_D-
A13
VUSB
N15
M15
Notes
GND
ON/OFF*
HW_SHUTDOWN*
USB_D+
C103/TXD
C104/RXD
D15
TXD_AUX
E15
RXD_AUX
K1
F1
MAIN ANTENNA
ANT_DIV
R9
ANT_GNSS
If not used should be connected to a
Test Point or an USB connector
If not used should be connected to a
Test Point or an USB connector
If not used should be connected to a
Test Point or an USB connector
If not used should be connected to a
Test Point
If not used should be connected to a
Test Point
If not used should be connected to a
Test Point
If not used should be connected to a
Test Point
If the GNSS is not used it could be
left unconnected
RTS pin should be connected to the GND (on the module side) if flow control is not used.
The above pins are also necessary to debug the application when the module is assembled on it so we
recommend connecting them also to dedicated test point.
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
ADC_IN1
RES
RES
GND
ANT_DIV
GND
GND
GND
ANT
GND
VBATT
VBATT_
PA
VBATT_
PA
GND
RES
RES
RES
GND
GND
GND
GND
GND
GND
GND
VBATT
VBATT_
PA
VBATT_
PA
GND
SIMVC
RES
RES
RES
RES
RES
RES
RES
RES
RES
RES
GND
GND
GND
GND
SIMIN
RES
RES
GND
GND
GND
GND
GND
SIMIO
RES
RES
GND
GND
GND
SIMCLK
DVI_RX
RES
GND
GND
GND
SIMRS
DVI_TX
RES
RES
RES
GNSS_L
NA_EN
RES
DVI_CLK
GPIO_01
RES
GND
GND
RES
DVI_WA
GPIO_02
RES
GND
ANT_GN
SS
10
RES
RES
GPIO_03
RES
GND
GND
11
RES
RES
GPIO_04
RES
RES
VAUX/P
WRMON
12
RES
RES
GPIO_06
RES
GND
RES
RES
ON_OFF
13
VUSB
GND
GPIO_07
VDD_IO
1V8_SEL
RES
RES
RES
RES
RES
RES
RES
RES
GND
HW_SH
UTDOW
N*
14
RES
GPIO_05
VRTC
RES
GND
RES
RES
RES
RES
RES
C105/RT
C108/DT
C109/DC
C107/DS
C125/RI
NG
USB_D+
USB_D-
TX AUX
RX AUX
RES
GPIO_10
RES
RES
GPIO_08
GPIO_09
C104/RX
C103/TX
C106/CT
15
NOTE:
The pin defined as RES has to be considered RESERVED and not connected on any pin in the
application.
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page 17 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
To turn on the LE910 the pad ON_OFF* must be tied low for at least 1 seconds and then
released.
The maximum current that can be drained from the ON_OFF* pad is 0,1 mA.
A simple circuit to do it is:
NOTE:
Don’t use any pull up resistor on the ON_OFF* line, it is internally pulled up. Using pull up
resistor may bring to latch up problems on the LE910 power regulator and improper power
on/off of the module. The line ON_OFF* must be connected only in open collector or open
drain configuration.
NOTE:
In this document all the lines that are inverted, hence have active low signals are labelled with a
name that ends with”#”,”*” or with a bar over the name.
TIP:
To check if the device has powered on, the hardware line PWRMON should be monitored.
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
For example:
1- Let’s assume you need to drive the ON_OFF* pad with a totem pole output of a +3/5 V
microcontroller (uP_OUT1):
2- Let’s assume you need to drive the ON_OFF* pad directly with an ON/OFF button:
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page 19 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
Upon turning on LE910 module, The LE910 is not activated yet because the boot sequence of
LE910 is still going on internally. It takes about 10 seconds to complete the initializing the
module internally.
For this reason, it would be useless to try to access LE910 during the Initialization state as
below.
To get the desirable stability, the LE910 needs at least 15 seconds after the PWRMON goes high
to become operational by reaching the activation state.
NOTE:
Don’t use any pull up resistor on the ON_OFF* line, it is internally pulled up. Using pull up
resistor may bring to latch up problems on the LE910 power regulator and improper power
on/off of the module. The line ON_OFF* must be connected only in open collector or open
drain configuration.
In this document all the lines that are inverted, hence have active low signals are labelled with a
name that ends with”#”,”*” or with a bar over the name.
During the Initialization state, any kind of AT-command is not available. DTE must be waiting
for the Activation state to communicate with LE910.
To check if the device has powered on, the hardware line PWRMON should be monitored.
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page 20 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
Turning off of the device can be done in two ways:

via AT command (see LE910 Software User Guide, AT#SHDN)

by tying low pin ON_OFF*
Either ways, the device issues a detach request to network informing that the device will not
be reachable any more.
LE910 can be shut down using the AT#SHDN command.
When a shutdown command is sent, LE910 goes into the finalization state and finally will shut
down PWRMON at the end of this state.
The period of the finalization state can differ according to the situation in which the LE910 is so
it cannot be fixed definitely.
Normally it will be above 15 seconds later from sending a shutdown command and DTE should
monitor the status of PWRMON to see the actual power off.
TIP:
To check if the device has been powered off, the hardware line PWRMON must be monitored.
The device is powered off when PWRMON goes low.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the LE910 when the module is powered off or during
an ON/OFF transition.
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page 21 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
To turn OFF LE910 the pad ON/OFF# must be tied low for at least 2 seconds and then
released. Same circuitry and timing for the power on must be used.
When the hold time of ON/OFF# is above 2 seconds, LE910 goes into the finalization state
and finally will shut down PWRMON at the end of this state.
The period of the finalization state can differ according to the situation in which the LE910 is
so it cannot be fixed definitely.
Normally it will be above 15 seconds later from releasing ON/OFF# and DTE should monitor
the status of PWRMON to see the actual power off.
TIP:
To check if the device has been powered off, the hardware line PWRMON must be monitored.
The device is powered off when PWRMON goes low.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the LE910 when the module is powered off or during
an ON/OFF transition.
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page 22 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The Unconditional Shutdown of the module could be activated using the
HW_SHUTDOWN* line (pad R13).
WARNING:
The hardware unconditional Shutdown must not be used during normal operation of the device
since it does not detach the device from the network. It shall be kept as an emergency exit
procedure.
To unconditionally shutdown the LE910, the pad HW_SHUTDOWN* must be tied low for at
least 200 milliseconds and then released.
NOTE:
Do not use any pull up resistor on the HW_SHUTDOWN* line nor any totem pole digital
output. Using pull up resistor may bring to latch up problems on the LE910 power regulator and
improper functioning of the module. The line HW_SHUTDOWN* must be connected only in
open collector configuration.
The HW_SHUTDOWN* is generating an unconditional shutdown of the module without an
automatic restart.
The module will shutdown, but will NOT perform the detach from the cellular network.
To proper power on again the module please refer to the related paragraph (“Powering ON the
HE910”)
TIP:
The unconditional hardware shutdown must always be implemented on the boards and should be
used only as an emergency exit procedure.
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page 23 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
A typical circuit is the following:
For example:
1- Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole output of
a +3/5 V microcontroller (uP_OUT2):
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page 24 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The below flow chart is describing the HW Shutdown procedure:
“HW SHUTDOWN
Unconditional”
START
HW_SHDN = LOW
Delay 1s
Delay 200ms
Disconnect
VBATT
HW_SHDN = HIGH
PWRMON = ON
“HW SHUTDOWN
Unconditional”
END
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page 25 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
Below chart describes the overall sequences for Turning ON and OFF.
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page 26 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The power supply circuitry and board layout are a very important part in the full product design
and they strongly reflect on the product overall performances, hence read carefully the
requirements and the guidelines that will follow for a proper design.
The external power supply must be connected to VBATT & VBATT_PA signals and must fulfil
the following requirements:
POWER SUPPLY
Nominal Supply Voltage
Normal Operating Voltage Range
Extended Operating Voltage Range
3.8 V
3.40 V÷ 4.20 V
3.30 V÷ 4.20 V
NOTE:
The Operating Voltage Range MUST never be exceeded; care must be taken when designing the
application’s power supply section to avoid having an excessive voltage drop.
If the voltage drop is exceeding the limits it could cause a Power Off of the module.
The Power supply must be higher than 3.3 V to power on the module
NOTE:
Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage
(regarding MIN Extended Operating Voltage) MUST never be exceeded;
The “Extended Operating Voltage Range” can be used only with completely assumption and
application of the HW User guide suggestions.
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page 27 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
LE910 current consumption
Mode
Average (mA)
Mode description
SWITCHED OFF
Module supplied but Switched Off
Switched Off
40uA
IDLE mode (GSM/EDGE)
WCDMA
16
AT+CFUN=1
GSM
16
Normal mode: full functionality of the module
LTE
16
Disabled TX and RX; module is not registered on the
AT+CFUN=4
10
network
WCDMA
1.7
AT+CFUN=5
Full functionality with power saving;
GSM
1.9
Operative mode (LTE)
LTE (0dBm)
203
LTE data call (channel BW 5MHz, RB=1, TX=0dBm)
LTE (22dBm)
540
LTE data call (channel BW 5MHz, RB=1, TX=22dBm)
Operative mode (WCDMA)
WCDMA Voice
185
WCDMA voice call (TX = 10dBm)
WCDMA HSDPA (0dBm)
100
WCDMA data call (RMC, TX = 0dBm)
WCDMA HSDPA (22dBm)
390
WCDMA data call (RMC, TX = 22dBm)
Operative mode (EDGE)
EDGE 4TX+1RX
LOW Band PL5
255
EDGE Sending data mode
High Band PL0
240
Operative mode (GSM)
GSM TX and RX mode
LOW Band CSD PL5
290
GSM VOICE CALL
High Band CSD PL0
170
GPRS 4TX+1RX
LOW Band PL5
410
GPRS Sending data mode
High Band PL0
320
The GSM system is made in a way that the RF transmission is not continuous, else it is packed into
bursts at a base frequency of about 216 Hz, and the relative current peaks can be as high as about 2A.
Therefore the power supply has to be designed in order to withstand with these current peaks without
big voltage drops; this means that both the electrical design and the board layout must be designed for
this current flow. If the layout of the PCB is not well designed a strong noise floor is generated on the
ground and the supply; this will reflect on all the audio paths producing an audible annoying noise at
216 Hz; if the voltage drop during the peak current absorption is too much, then the device may even
shutdown as a consequence of the supply voltage drop.
NOTE: The electrical design for the Power supply should be made ensuring it will be capable of
a peak current output of at least 2A.
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page 28 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The principal guidelines for the Power Supply Design embrace three different design steps:
 the electrical design
 the thermal design
 the PCB layout.
The electrical design of the power supply depends strongly from the power source where this
power is drained. We will distinguish them into three categories:
 +5V input (typically PC internal regulator output)
 +12V input (typically automotive)
 Battery
 The desired output for the power supply is 3.8V, hence there’s not a big difference between
the input source and the desired output and a linear regulator can be used. A switching
power supply will not be suited because of the low drop out requirements.
 When using a linear regulator, a proper heat sink shall be provided in order to dissipate the
power generated.
 A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the
current absorption peaks close to the LE910, a 100μF tantalum capacitor is usually suited.
 Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is
rated at least 10V.
 A protection diode should be inserted close to the power input, in order to save the LE910
from power polarity inversion.
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
An example of linear regulator with 5V input is:
 The desired output for the power supply is 3.8V, hence due to the big difference between the
input source and the desired output, a linear regulator is not suited and shall not be used. A
switching power supply will be preferable because of its better efficiency especially with the
2A peak current load represented by the LE910.
 When using a switching regulator, a 500kHz or more switching frequency regulator is
preferable because of its smaller inductor size and its faster transient response. This allows
the regulator to respond quickly to the current peaks absorption.
 In any case the frequency and Switching design selection is related to the application to be
developed due to the fact the switching frequency could also generate EMC interferences.
 For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind
when choosing components: all components in the power supply must withstand this
voltage.
 A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the
current absorption peaks, a 100μF tantalum capacitor is usually suited.
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
 Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is
rated at least 10V.
 For Car applications a spike protection diode should be inserted close to the power input, in
order to clean the supply from spikes.
 A protection diode should be inserted close to the power input, in order to save the LE910
from power polarity inversion. This can be the same diode as for spike protection.
An example of switching regulator with 12V input is in the below schematic:
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page 31 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The desired nominal output for the power supply is 3.8V and the maximum voltage
allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the
power to the Telit LE910 module.
WARNING:
The three cells Ni/Cd or Ni/MH 3,6 V Nom. Battery types or 4V PB types MUST NOT BE
USED DIRECTLY since their maximum voltage can rise over the absolute maximum voltage
for the LE910 and damage it.
NOTE:
DON’T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with LE910. Their use
can lead to overvoltage on the LE910 and damage it. USE ONLY Li-Ion battery types.




A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current
absorption peaks, a 100μF tantalum capacitor is usually suited.
Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.
A protection diode should be inserted close to the power input, in order to save the LE910 from
power polarity inversion. Otherwise the battery connector should be done in a way to avoid
polarity inversions when connecting the battery.
The battery capacity must be at least 500mAh in order to withstand the current peaks of 2A; the
suggested capacity is from 500mAh to 1000mAh.
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The thermal design for the power supply heat sink should be done with the following
specifications:

Average current consumption during HSPA transmission @PWR level max in LE910:
640mA (TBD)

Average current consumption during class12 GPRS transmission @PWR level max:
680mA (TBD)

Average GPS current during GPS ON (Power Saving disabled) : 65mA (TBD)
NOTE:
The average consumption during transmissions depends on the power level at which the device
is requested to transmit by the network. The average current consumption hence varies
significantly.
The thermal design for the Power supply must be made keeping an average consumption at the
max transmitting level during calls of 640mA(HSPA)/680mA(GPRS) rms plus 65mA rms for
GPS in tracking mode.
Considering the very low current during idle, especially if Power Saving function is enabled, it
is possible to consider from the thermal point of view that the device absorbs current
significantly only during calls.
If we assume that the device stays in transmission for short periods of time (let us say few
minutes) and then remains for quite a long time in idle (let us say one hour), then the power
supply has always the time to cool down between the calls and the heat sink could be smaller
than the calculated for 640mA (HSPA)/680mA (GPRS) maximum RMS current. There could
even be a simple chip package (no heat sink).
Moreover in average network conditions the device is requested to transmit at a lower power
level than the maximum and hence the current consumption will be less than 640mA (HSPA)
/680mA (GPRS) (being usually around 250mA).
For these reasons the thermal design is rarely a concern and the simple ground plane where the
power supply chip is placed can be enough to ensure a good thermal condition and avoid
overheating.
For the heat generated by the LE910, you can consider it to be during transmission 2W max
during class12 GPRS upload. This generated heat will be mostly conducted to the ground plane
under the LE910; you must ensure that your application can dissipate heat.
In the WCDMA/HSPA mode, since LE910 emits RF signals continuously during transmission,
you must pay special attention how to dissipate the heat generated.
The current consumption will be up to about 640mA in HSPA (630mA in WCDMA)
continuously at the maximum TX output power (23dBm). Thus, you must arrange the PCB area
as large as possible under LE910 which you will mount. You must mount LE910 on the large
ground area of your application board and make many ground vias to dissipate the heat.
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page 33 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The peak current consumption in the GSM mode is higher than that in WCDMA. However,
considering the heat sink is more important in case of WCDMA.
As mentioned before, a GSM signal is bursty, thus, the temperature drift is more insensible than
WCDMA. Consequently, if you prescribe the heat dissipation in the WCDMA mode, you don’t
need to think more about the GSM mode.
As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on
the output to cut the current peaks and a protection diode on the input to protect the supply from
spikes and polarity inversion. The placement of these components is crucial for the correct
working of the circuitry. A misplaced component can be useless or can even decrease the power
supply performances.

The Bypass low ESR capacitor must be placed close to the Telit LE910 power input
pads or in the case the power supply is a switching type it can be placed close to the
inductor to cut the ripple provided the PCB trace from the capacitor to the LE910 is
wide enough to ensure a dropless connection even during the 2A current peaks.

The protection diode must be placed close to the input connector where the power
source is drained.

The PCB traces from the input connector to the power regulator IC must be wide
enough to ensure no voltage drops occur when the 2A current peaks are absorbed.
Note that this is not made in order to save power loss but especially to avoid the
voltage drops on the power line at the current peaks frequency of 216 Hz that will
reflect on all the components connected to that supply, introducing the noise floor at
the burst base frequency. For this reason while a voltage drop of 300-400 mV may
be acceptable from the power loss point of view, the same voltage drop may not be
acceptable from the noise point of view. If your application doesn’t have audio
interface but only uses the data feature of the Telit LE910, then this noise is not so
disturbing and power supply layout design can be more forgiving.

The PCB traces to the LE910 and the Bypass capacitor must be wide enough to
ensure no significant voltage drops occur when the 2A current peaks are absorbed.
This is for the same reason as previous point. Try to keep this trace as short as
possible.

The PCB traces connecting the Switching output to the inductor and the switching
diode must be kept as short as possible by placing the inductor and the diode very
close to the power switching IC (only for switching power supply). This is done in
order to reduce the radiated field (noise) at the switching frequency (100-500 kHz
usually).
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014

The use of a good common ground plane is suggested.

The placement of the power supply on the board should be done in such a way to
guarantee that the high current return paths in the ground plane are not overlapped
to any noise sensitive circuitry as the microphone amplifier/buffer or earphone
amplifier.

The power supply input cables should be kept separate from noise sensitive lines
such as microphone/earphone cables.

The insertion of EMI filter on VBATT pins is suggested in those designs where
antenna is placed close to battery or supply lines.
A ferrite bead like Murata BLM18EG101TN1 or Taiyo Yuden P/N
FBMH1608HM101 can be used for this purpose.
The below figure shows the recommended circuit:
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page 35 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The following table is listing the main differences between the LE910 variants:
Product
Supported 2G Bands
Supported 3G bands
Supported LTE bands
B20 (800), B3 (1800), B7
(2600)
B17(700), B5(850),
B4(1700), B2(1900)
GNSS
LE910-EUG
GSM 900, DCS1800
B5(850), B8 (900), B1 (2100)
LE910-NAG
GSM 850, PCS 1900
B5(850), B2(1900)
LE910-NVG
Not supported
B5(850), B2(1900)
B13(700), B4(1700)
YES
LE910-SVG
Not supported
Not supported
B13(700), B4(1700)
YES
LE910-SKG
Not supported
Not supported
B3 (1800), B5(850)
YES
Band
GSM 850 / 900
DCS1800 / PCS 1900
EDGE, 850/900 MHz
EDGE, 1800/1900 MHz
WCDMA FDD B1, B2, B4, B5, B8
LTE FDD B2, B3, B4, B5, B7, B13, B17, B20
YES
YES
Power Class
4 (2W)
1 (1W)
E2 (0.5W)
Class E2 (0.4W)
Class 3 (0.25W)
Class 3 (0.2 W)
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page 36 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The antenna connection and board layout design are the most important aspect in the full
product design as they strongly affect the product overall performances, hence read carefully
and follow the requirements and the guidelines for a proper design.
The antenna and antenna transmission line on PCB for a Telit LE910 device shall fulfil the
following requirements:
ANTENNA REQUIREMENTS for LE910-EUG
Depending by frequency band(s) provided by the network operator, the
Frequency range
customer shall use the most suitable antenna for that/those band(s)
GSM900 : 80 MHz
Bandwidth (GSM/EDGE)
GSM1800(DCS) : 170 MHz
WCDMA band I(2100) : 250 MHz
Bandwidth
WCDMA band V(850) : 70 MHz
(WCDMA)
WCDMA band VIII(900) : 80 MHz
LTE band III(1800) : 170 MHz
Bandwidth
LTE Band VII(2600) : 190 MHz
(LTE)
LTE Band XX(800) : 71 MHz
50 ohm
Impedance
> 33dBm(2 W) peak power in GSM
Input power
> 24dBm Average power in WCDMA & LTE
≤ 10:1 (limit to avoid permanent damage)
VSWR absolute max
≤ 2:1 (limit to fulfil all regulatory requirements)
VSWR recommended
ANTENNA REQUIREMENTS for LE910-NAG
Depending by frequency band(s) provided by the network operator, the
Frequency range
customer shall use the most suitable antenna for that/those band(s)
GSM850 : 70 MHz
Bandwidth (GSM/EDGE)
GSM1900(PCS) : 140 MHz
WCDMA band II(1900) : 140 MHz
Bandwidth
WCDMA band V(850) : 70 MHz
(WCDMA)
LTE Band II(1900) : 140 MHz
LTE Band IV(1700) : 445 MHz
Bandwidth
LTE Band V (850) : 70 MHz
(LTE)
LTE Band XVII(700) : 42 MHz
50 ohm
Impedance
> 33dBm(2 W) peak power in GSM
Input power
> 24dBm Average power in WCDMA & LTE
≤ 10:1 (limit to avoid permanent damage)
VSWR absolute max
≤ 2:1 (limit to fulfil all regulatory requirements)
VSWR recommended
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page 37 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
Frequency range
Bandwidth
(WCDMA)
Bandwidth
(LTE)
Impedance
Input power
VSWR absolute max
VSWR recommended
Frequency range
Bandwidth
(LTE)
Impedance
Input power
VSWR absolute max
VSWR recommended
Frequency range
Bandwidth
(LTE)
Impedance
Input power
VSWR absolute max
VSWR recommended
ANTENNA REQUIREMENTS for LE910-NVG
Depending by frequency band(s) provided by the network operator, the
customer shall use the most suitable antenna for that/those band(s)
WCDMA band II(1900) : 140 MHz
WCDMA band V(850) : 70 MHz
LTE Band IV(1700) : 445 MHz
LTE Band XIII(700) : 41 MHz
50 ohm
> 24dBm Average power in WCDMA & LTE
≤ 10:1 (limit to avoid permanent damage)
≤ 2:1 (limit to fulfil all regulatory requirements)
ANTENNA REQUIREMENTS for LE910-SVG
Depending by frequency band(s) provided by the network operator, the
customer shall use the most suitable antenna for that/those band(s)
LTE Band IV(1700) : 445 MHz
LTE Band XIII(700) : 41 MHz
50 ohm
> 24dBm Average power
≤ 10:1 (limit to avoid permanent damage)
≤ 2:1 (limit to fulfil all regulatory requirements)
ANTENNA REQUIREMENTS for LE910-SKG
Depending by frequency band(s) provided by the network operator, the
customer shall use the most suitable antenna for that/those band(s)
LTE band III(1800) : 170 MHz
LTE Band V (850) : 70 MHz
50 ohm
> 24dBm Average power
≤ 10:1 (limit to avoid permanent damage)
≤ 2:1 (limit to fulfil all regulatory requirements)
When using the LE910, since there's no antenna connector on the module, the antenna must
be connected to the LE910 antenna pad (K1) by means of a transmission line implemented on
the PCB.
In the case the antenna is not directly connected at the antenna pad of the LE910, then a PCB
line is needed in order to connect with it or with its connector.
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page 38 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
This transmission line shall fulfil the following requirements:
ANTENNA LINE ON PCB REQUIREMENTS
Characteristic Impedance
50 ohm
Max Attenuation
0,3 dB
Coupling with other signals shall be avoided
Cold End (Ground Plane) of antenna shall be equipotential to
the LE910 ground pins
Furthermore if the device is developed for the US market and/or Canada market, it shall
comply with the FCC and/or IC approval requirements:
This device is to be used only for mobile and fixed application. In order to re-use the Telit
FCC/IC approvals the antenna(s) used for this transmitter must be installed to provide a
separation distance of at least 20 cm from all persons and must not be co-located or operating
in conjunction with any other antenna or transmitter. If antenna is installed with a separation
distance of less than 20 cm from all persons or is co-located or operating in conjunction with
any other antenna or transmitter then additional FCC/IC testing may be required. End-Users
must be provided with transmitter operation conditions for satisfying RF exposure
compliance.
Antennas used for this OEM module must not exceed the gains for mobile and fixed
operating configurations as described in “FCC/IC Regulatory notices” chapter.
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page 39 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
 Make sure that the transmission line’s characteristic impedance is 50ohm ;
 Keep line on the PCB as short as possible, since the antenna line loss shall be less than
around 0,3 dB;
 Line geometry should have uniform characteristics, constant cross section, avoid meanders
and abrupt curves;
 Any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded
Coplanar Waveguide...) can be used for implementing the printed transmission line afferent
the antenna;
 If a Ground plane is required in line geometry, that plane has to be continuous and
sufficiently extended, so the geometry can be as similar as possible to the related canonical
model;
 Keep, if possible, at least one layer of the PCB used only for the Ground plane; If possible,
use this layer as reference Ground plane for the transmission line;
 It is wise to surround (on both sides) the PCB transmission line with Ground, avoid having
other signal tracks facing directly the antenna line track.
 Avoid crossing any un-shielded transmission line footprint with other signal tracks on
different layers;
 The ground surrounding the antenna line on PCB has to be strictly connected to the main
Ground Plane by means of via holes (once per 2mm at least), placed close to the ground
edges facing line track;
 Place EM noisy devices as far as possible from LE910 antenna line;
 Keep the antenna line far away from the LE910 power supply lines;
 If EM noisy devices are present on the PCB hosting the LE910, such as fast switching ICs,
take care of the shielding of the antenna line by burying it inside the layers of PCB and
surround it with Ground planes, or shield it with a metal frame cover.
 If EM noisy devices are not present around the line, the use of geometries like Microstrip or
Grounded Coplanar Waveguide has to be preferred, since they typically ensure less
attenuation if compared to a Stripline having same length;
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page 40 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
 Install the antenna in a place covered by the GSM signal.
 If the device antenna is located greater then 20cm from the human body and there are no colocated transmitter then the Telit FCC/IC approvals can be re-used by the end product
 If the device antenna is located less than 20cm from the human body or there are no colocated transmitter then the additional FCC/IC testing may be required for the end product
(Telit FCC/IC approvals cannot be reused)
 Antenna shall not be installed inside metal cases
 Antenna shall be installed also according Antenna manufacturer instructions.
This product is including an input for a second RX antenna to improve the radio sensitivity.
The function is called Antenna Diversity.
DIVERSITY ANTENNA REQUIREMENTS for LE910-EUG
Depending by frequency band(s) provided by the network operator, the
Frequency range
customer shall use the most suitable antenna for that/those band(s)
WCDMA band I(2100) : 250 MHz
Bandwidth
WCDMA band V(850) : 70 MHz
(WCDMA)
WCDMA band VIII(900) : 80 MHz
LTE band III(1800) : 170 MHz
Bandwidth
LTE Band VII(2600) : 190 MHz
(LTE)
LTE Band XX(800) : 71 MHz
50 ohm
Impedance
≤ 2:1 (limit to fulfil all regulatory requirements)
VSWR recommended
DIVERSITY ANTENNA REQUIREMENTS for LE910-NAG
Depending by frequency band(s) provided by the network operator, the
Frequency range
customer shall use the most suitable antenna for that/those band(s)
WCDMA band II(1900) : 140 MHz
Bandwidth
WCDMA band V(850) : 70 MHz
(WCDMA)
LTE Band II(1900) : 140 MHz
LTE Band IV(1700) : 445 MHz
Bandwidth
LTE Band V (850) : 70 MHz
(LTE)
LTE Band XVII(700) : 42 MHz
50 ohm
Impedance
≤ 2:1 (limit to fulfil all regulatory requirements)
VSWR recommended
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page 41 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
DIVERSITY ANTENNA REQUIREMENTS for LE910-NVG
Depending by frequency band(s) provided by the network operator, the
Frequency range
customer shall use the most suitable antenna for that/those band(s)
WCDMA band II(1900) : 140 MHz
Bandwidth
WCDMA band V(850) : 70 MHz
(WCDMA)
LTE Band IV(1700) : 445 MHz
Bandwidth
LTE Band XIII(700) : 41 MHz
(LTE)
50 ohm
Impedance
≤ 2:1 (limit to fulfil all regulatory requirements)
VSWR recommended
DIVERSITY ANTENNA REQUIREMENTS for LE910-SVG
Depending by frequency band(s) provided by the network operator, the
Frequency range
customer shall use the most suitable antenna for that/those band(s)
LTE Band IV(1700) : 445 MHz
Bandwidth
LTE Band XIII(700) : 41 MHz
(LTE)
50 ohm
Impedance
≤ 2:1 (limit to fulfil all regulatory requirements)
VSWR recommended
DIVERSITY ANTENNA REQUIREMENTS for LE910-SKG
Depending by frequency band(s) provided by the network operator, the
Frequency range
customer shall use the most suitable antenna for that/those band(s)
LTE band III(1800) : 170 MHz
Bandwidth
LTE Band V (850) : 70 MHz
(LTE)
50 ohm
Impedance
≤ 2:1 (limit to fulfil all regulatory requirements)
VSWR recommended
When using the LE910, since there's no antenna connector on the module, the antenna must be
connected to the LE910 antenna pad (F1) by means of a transmission line implemented on the
PCB.
In the case the antenna is not directly connected at the antenna pad of the LE910, then a PCB
line is needed in order to connect with it or with its connector.
The second Rx antenna should not be located in the close vicinity of main antenna. In order to
improve Diversity Gain, Isolation and reduce mutual interaction, the two antennas should be
located at the maximum reciprocal distance possible, taking into consideration the available
space into the application.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 42 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The LE910 module is integrating a GNSS receiver that could be used in Autonomous or in A-GPS
(assisted GPS) mode.
The module includes already an LNA (13.5dB gain typ.) so it could be used with a passive antenna.
The Pads related to this function are the following:
PAD
Signal
I/O
Function
Type
R9
ANT_GNSS
GNSS Antenna (50 ohm)
RF
R7
GNSS_LNA_EN
Output enable for External LNA supply
CMOS 1.8V
It is recommended to use antennas as follow:
• An external passive antenna (GPS only)
• An external passive antenna, GNS pre-Filter
The external pre-Filter shall be required for GLONASS application.
The Glonass pre-Filter requirement shall fulfil the following requirements:
 Source and Load Impedance = 50Ohm
 Insertion Loss (1575.42 – 1576.42MHz) = 1.4dB (Max)
 Insertion Loss (1565.42 – 1585.42MHz) = 1.4dB (Max)
 Insertion Loss (1597.5515 – 1605.886MHZ) = 2.0dB (Max)
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page 43 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014

Ensure that the antenna line impedance is 50ohm.

Keep the antenna line on the PCB as short as possible to reduce the loss.

Antenna line must have uniform characteristics, constant cross section, avoid meanders and
abrupt curves.

Keep one layer of the PCB used only for the Ground plane, if possible.

Surround (on the sides, over and under) the antenna line on PCB with Ground, avoid having
other signal tracks facing directly the antenna line of track.

The ground around the antenna line on PCB has to be strictly connected to the Ground Plane
by placing vias once per 2mm at least.

Place EM noisy devices as far as possible from LE910 antenna line.

Keep the antenna line far away from the LE910 power supply lines.

Keep the antenna line far away from the LE910 GSM RF lines.

If you have EM noisy devices around the PCB hosting the LE910, such as fast switching ICs,
take care of the shielding of the antenna line by burying it inside the layers of PCB and
surround it with Ground planes, or shield it with a metal frame cover.

If you do not have EM noisy devices around the PCB of LE910, use a strip-line on the
superficial copper layer for the antenna line. The line attenuation will be lower than a buried
one.
RF Trace losses are difficult to estimate on a PCB without having the appropriate tables or RF
simulation software to estimate what the losses would be. A good rule of thumb would be to keep the
RF traces as short as possible, make sure they are 50 ohms impedance and don’t contain any sharp
bends.
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page 44 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014

The LE910 due to its characteristics of sensitivity is capable to perform a Fix inside the
buildings. (In any case the sensitivity could be affected by the building characteristics i.e.
shielding).

The Antenna must not be co-located or operating in conjunction with any other antenna or
transmitter.

Antenna must not be installed inside metal cases.

Antenna must be installed also according to the Antenna manufacturer instructions.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 45 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The following table shows the logic level specifications used in the LE910 interface circuits:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital pin (CMOS 1.8) with respect
to ground
-0.3V
2.16V
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level
1.5V
2.1V
Input low level
0V
0.5V
Output high level
1.35V
1.8
Output low level
0V
0.45V
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page 46 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
Signal
Function
I/O
PAD
HW_SHUTDOWN*
Unconditional Shutdown of the Module
R13
HW_SHUTDOWN* is used to unconditionally shutdown the LE910. Whenever this signal is
pulled low, the LE910 is reset. When the device is reset it stops any operation. After the release
of the line, the LE910 is unconditionally shut down, without doing any detach operation from
the network where it is registered. This behaviour is not a proper shut down because any GSM
device is requested to issue a detach request on turn off. For this reason the HW_SHUTDOWN*
signal must not be used to normally shutting down the device, but only as an emergency exit in
the rare case the device remains stuck waiting for some network response.
The HW_SHUTDOWN* is internally controlled on start-up to achieve always a proper poweron reset sequence, so there's no need to control this pin on start-up.
It may only be used to reset a device already on that is not responding to any command.
NOTE:
Do not use this signal to power off the LE910. Use the ON/OFF signal to perform this function
or the AT#SHDN command.
Unconditional Shutdown Signal Operating levels:
Signal
HW_SHUTDOWN*
Input high
HW_SHUTDOWN*
Input low
Min
Max
1.5V
2.1V
0V
0.5V
* this signal is internally pulled up so the pin can be left floating if not used.
If unused, this signal may be left unconnected. If used, then it must always be connected with
an open collector transistor, to permit to the internal circuitry the power on reset and under
voltage lockout functions.
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page 47 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The LE910 module includes a Universal Serial Bus (USB) transceiver, which operates at
USB full-speed (12Mbits/sec) and USB high-speed (480Mbits/sec).
It is compliant with the USB 2.0 specification and can be used for diagnostic monitoring,
control and data transfers.
The following table is listing the available signals:
PAD
Signal
I/O
Function
Type
B15
USB_D+
I/O
USB differential Data (+)
3.3V
C15
USB_D-
I/O
USB differential Data (-)
3.3V
AI
Power sense for the internal USB
transceiver.
5V
A13
VUSB
NOTE
The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz.
The signal traces should be routed carefully. Trace lengths, number of vias and capacitive
loading should be minimized. The characteristic impedance value should be as close as
possible to 90 Ohms differential.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 48 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The LE910 module is provided with by 2 Asynchronous serial ports:
 MODEM SERIAL PORT 1 (Main)
 MODEM SERIAL PORT 2 (Auxiliary)
Several configurations can be designed for the serial port on the OEM hardware, but the most
common are:
 RS232 PC com port
 microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit)
 microcontroller UART @ 5V or other voltages different from 1.8V
Depending from the type of serial port on the OEM hardware a level translator circuit may be
needed to make the system work.
On the LE910 the ports are CMOS 1.8.
The electrical characteristics of the Serial ports are explained in the following tables:
Absolute Maximum Ratings -Not Functional
Parameter
Input level on any digital pin (CMOS 1.8) with
respect to ground
Min
Max
-0.3V
2.16V
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level
1.5V
2.1V
Input low level
0V
0.5V
Output high level
1.35V
1.8
Output low level
0V
0.45V
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page 49 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The serial port 1 on the LE910 is a +1.8V UART with all the 7 RS232 signals.
It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.
RS232
Pin #
Signal
C109/DCD
LE910
Pad Number
N14
C104/RXD
M15
C103/TXD
N15
C108/DTR
Name
Usage
Data Carrier Detect
Transmit line *see
Note
Receive line *see
Note
Data Terminal Ready
Output from the LE910 that indicates the carrier presence
GND
C107/DSR
M14
M12, B13, P13,
E14 …
P14
C106/CTS
P15
Clear to Send
Output transmit line of LE910 UART
Input receive of the LE910 UART
Input to the LE910 that controls the DTE READY condition
Ground
Ground
Data Set Ready
Output from the LE910 that indicates the module is ready
Output from the LE910 that controls the Hardware flow
control
Input to the LE910 that controls the Hardware flow control
Output from the LE910 that indicates the incoming call
condition
C105/RTS
L14
Request to Send
C125/RING
R14
Ring Indicator
NOTE:
According to V.24, some signal names are referred to the application side, therefore on the
LE910 side these signal are on the opposite direction:
TXD on the application side will be connected to the receive line (here named C103/TXD)
RXD on the application side will be connected to the transmit line (here named C104/RXD)
NOTE:
For a minimum implementation, only the TXD, RXD lines can be connected, the other lines can
be left open provided a software flow control is implemented.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the LE910 when the module is powered off or during
an ON/OFF transition.
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page 50 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The secondary serial port on the LE910 is composed by only the RX and TX lines.
The signals of the LE910 serial port are:
PAD
Signal
I/O
Function
Type
D15
TX_AUX
Auxiliary UART (TX Data to DTE)
1.8V
E15
RX_AUX
Auxiliary UART (RX Data from DTE)
1.8V
COMMENT
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the LE910 when the module is powered off or during
an ON/OFF transition.
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page 51 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
In order to interface the LE910 with a PC com port or a RS232 (EIA/TIA-232) application a
level translator is required. This level translator must:

invert the electrical signal in both directions;

Change the level from 0/1.8V to +15/-15V.
Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower
levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level
translator. Note that the negative signal voltage must be less than 0V and hence some sort of
level translation is always required.
The simplest way to translate the levels and invert the signal is by using a single chip level
translator. There are a multitude of them, differing in the number of drivers and receivers and in
the levels (be sure to get a true RS232 level translator not a RS485 or other standards).
By convention the driver is the level translator from the 0-1.8V UART to the RS232 level. The
receiver is the translator from the RS232 level to 0-1.8V UART.
In order to translate the whole set of control lines of the UART you will need:
 5 drivers
 3 receivers
NOTE:
The digital input lines working at 1.8V have an absolute maximum input voltage of 2.7V;
therefore the level translator IC shall not be powered by the VBATT supply of the module to
avoid damaging the LE910 digital signals.
Instead it has to be supplied by a dedicated 1.8V power supply.
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page 52 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver
(MAX218)
In this case the chipset is capable to translate directly from 1.8V to the RS232 levels (Example
done on 4 signals only).
NOTE:
In this case the length of the lines on the application has to be carefully checked to avoid
problems in case of High Speed data rates on RS232.
The RS232 serial port lines are usually connected to a DB9 connector with the following layout:
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 53 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The Audio of the LE910 Module is carried by DVI digital audio interface.
The audio port can be directly connected to end device using digital interface, or via one of the
several compliant codecs (in case an analog audio is needed).
The product is providing the Digital Audio Interface (DVI) on the following Pins:
PAD
B9
B6
B7
B8
Signal
DVI_WA0
DVI_RX
DVI_TX
DVI_CLK
I/O
I/O
I/O
Digital Voice Interface (DVI)
Function
Digital Audio Interface (WA0)
Digital Audio Interface (RX)
Digital Audio Interface (TX)
Digital Audio Interface (BCLK)
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
Note
Type
B-PD 1.8V
B-PD 1.8V
B-PD 1.8V
B-PD 1.8V
page 54 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The LE910 module is provided by a set of Digital Input / Output pins
Input pads can only be read; they report the digital value (high or low) present on the pad at the
read time.
Output pads can only be written or queried and set the value of the pad output.
An alternate function pad is internally controlled by the LE910 firmware and acts depending on
the function implemented.
The following table shows the available GPIO on the LE910:
PAD
Signal
I/O
Function
C8
GPIO_01
I/O
Configurable GPIO
C9
GPIO_02
I/O
Configurable GPIO
C10
GPIO_03
I/O
Configurable GPIO
C11
GPIO_04
I/O
Configurable GPIO
B14
GPIO_05
I/O
Configurable GPIO
C12
GPIO_06
I/O
Configurable GPIO
C13
GPIO_07
I/O
Configurable GPIO
K15
GPIO_08
I/O
Configurable GPIO
L15
GPIO_09
I/O
Configurable GPIO
G15
GPIO_10
I/O
Configurable GPIO
Type
BH-PD (*)
1.8V
BH-PD (*)
1.8V
BH-PD (*)
1.8V
BH-PD (*)
1.8V
BH-PD (*)
1.8V
BH-PD (*)
1.8V
BH-PD (*)
1.8V
BH-PD (*)
1.8V
BH-PD (*)
1.8V
BH-PD (*)
1.8V
Drive
strength
Note
1 mA
1 mA
1 mA
1 mA
1 mA
1 mA
1 mA
1 mA
1 mA
1 mA
(*) BH-PD - Bidirectional digital with CMOS input; High-voltage tolerant; Contains an internal
pull-down device.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the LE910 when the module is powered off or during
an ON/OFF transition.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 55 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels.
The following table shows the logic level specifications used in the LE910 interface circuits:
Absolute Maximum Ratings -Not Functional
Parameter
Input level on any digital pin (CMOS 1.8) with
respect to ground
Min
Max
-0.3V
2.16V
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level
1.5V
2.1V
Input low level
0V
0.5V
Output high level
1.35V
1.8
Output low level
0V
0.45V
The GPIO pads, when used as inputs, can be connected to a digital output of another device and
report its status, provided this device has interface levels compatible with the 1.8V CMOS levels
of the GPIO. If the digital output of the device to be connected with the GPIO input pad has
interface levels different from the 1.8V CMOS, then it can be buffered with an open collector
transistor with a 10K pull up to 1.8V.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the LE910 when the module is powered off or during
an ON/OFF transition.
The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible
hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up
resistor may be omitted.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 56 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The STAT_LED pin status shows information on the network service availability and Call
status. The function is available as alternate function of GPIO_01 (to be enabled using the
AT#GPIO=1,0,2 command).
In the LE910 modules, the STAT_LED needs an external transistor to drive an external LED.
Therefore, the status indicated in the following table is reversed with respect to the pin status.
Device Status
Device off
Net search / Not registered / turning
off
Registered full service
Voice Call Active
LED status
Permanently off
Fast blinking
(Period 1s, Ton 0,5s)
Slow blinking
(Period 3s, Ton 0,3s)
Permanently on
A schematic example could be:
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the
digital part, allowing having only RTC going on when all the other parts of the device are off.
To this power output a backup capacitor can be added in order to increase the RTC autonomy
during power off of the battery.
NO Devices must be powered from this pin.
A regulated power supply output is provided in order to supply small devices from the module.
The signal is present on Pad R11 and it is in common with the PWRMON (module powered ON
indication) function.
This output is always active when the module is powered ON.
The operating range characteristics of the supply are:
Level
Output voltage
Output current
Output bypass capacitor
(inside the module)
Min
Typical
Max
1.75V
1.80V
1.85V
100mA
1uF
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The LE910 is provided by one AD converter.
It is able to read a voltage level in the range of 0÷1.7 volts applied on the ADC pin input, store
and convert it into 8 bit word.
The following table is showing the ADC characteristics:
Input Voltage range
AD conversion
Resolution
Min
Max
1.7
< 6,6
Units
Volt
bits
mV
The input line is named as ADC_IN1 and it is available on Pad B1
An AT command is available to use the ADC function.
The command is AT#ADC=1,2
The read value is expressed in mV
Refer to SW User Guide or AT Commands Reference Guide for the full description of this
function.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The LE910 modules have been designed in order to be compliant with a standard lead-free
SMT process.
Pin B1
Bottom view
Dimensions in mm
Lead-free Alloy:
Surface finishing Ni/Au for all solder pads
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LE910 Hardware User Guide
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
TOP VIEW
In order to easily rework the LE910 is suggested to consider on the application a 1.5 mm
placement inhibit area around the module.
It is also suggested, as common rule for an SMT component, to avoid having a mechanical
part of the application in direct contact with the module.
NOTE:
In the customer application, the region under WIRING INHIBIT (see figure above) must
be clear from signal or ground paths.
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we
suggest a thickness of stencil foil ≥ 120 µm.
Non solder mask defined (NSMD) type is recommended for the solder pads on the
PCB.
Copper Pad
Solder Mask
PCB
SMD
(Solder Mask Defined)
NSMD
(Non Solder Mask Defined)
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The recommendation for the PCB pads dimensions are described in the following image
(dimensions in mm)
Solder resist openings
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
It is not recommended to place via or micro-via not covered by solder resist in an
area of 0,3 mm around the pads unless it carries the same signal of the pad itself
(see following figure).
Inhibit area for micro-via
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
Electro-less Ni / Immersion
Au
Layer thickness [µm]
3 –7 / 0.05 – 0.15
Properties
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the
lead-free process. This issue should be discussed with the PCB-supplier. Generally,
the wettability of tin-lead solder paste on the described surface plating is better
compared to lead-free solder paste.
It is not necessary to panel the application’s PCB, however in that case it is
suggested to use milled contours and predrilled board breakouts; scoring or v-cut
solutions are not recommended.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
Solder paste
Lead free
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules
after assembly.
Recommended solder reflow profile:
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
Tsmax to TL
– Ramp-up Rate
Time maintained above:
– Temperature (TL)
– Time (tL)
Peak Temperature (Tp)
Time within 5°C of actual Peak
Temperature (tp)
Ramp-down Rate
Time 25°C to Peak Temperature
Pb-Free Assembly
3°C/second max
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
245 +0/-5°C
10-30 seconds
6°C/second max.
8 minutes max.
NOTE:
All temperatures refer to topside of the package, measured on the package body surface
WARNING:
The LE910 module withstands one reflow process only.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The LE910 modules are packaged on trays of 20 pieces each. These trays can be used in
SMT processes for pick & place handling.
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LE910 Hardware User Guide
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The LE910 can be packaged on reels of 200 pieces each.
See figure for module positioning into the carrier.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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LE910 Hardware User Guide
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Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The LE910 is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC JSTD-020, take care all the relatives requirements for using this kind of components.
Moreover, the customer has to take care of the following conditions:
a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).
b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC
J-STD-033A paragraph 5.
c) The maximum time between the opening of the sealed bag and the reflow process must be
168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected
d) Baking is required if conditions b) or c) are not respected
e) Baking is required if the humidity indicator inside the bag indicates 10% RH
or more
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 72 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
READ CAREFULLY
Be sure the use of this product is allowed in the country and in the environment required. The use of this
product may be dangerous and has to be avoided in the following areas:
 Where it can interfere with other electronic devices in environments such as hospitals, airports,
aircrafts, etc
 Where there is risk of explosion such as gasoline stations, oil refineries, etc
It is responsibility of the user to enforce the country regulation and the specific environment regulation.
Do not disassemble the product; any mark of tampering will compromise the warranty validity.
We recommend following the instructions of the hardware user guides for a correct wiring of the product.
The product has to be supplied with a stabilized voltage source and the wiring has to be conforming to the
security and fire prevention regulations.
The product has to be handled with care, avoiding any contact with the pins because electrostatic
discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully
the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode.
The system integrator is responsible of the functioning of the final product; therefore, care has to be taken
to the external components of the module, as well as of any project or installation issue, because the risk
of disturbing the GSM network or external devices or having impact on the security. Should there be any
doubt, please refer to the technical documentation and the regulations in force.
Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to
be installed with care in order to avoid any interference with other electronic devices and has to guarantee
a minimum distance from the body (20 cm). In case of this requirement cannot be satisfied, the system
integrator has to assess the final product against the SAR regulation.
The European Community provides some Directives for the electronic equipments introduced on the
market. All the relevant information’s are available on the European Community website:
http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm
The text of the Directive 99/05 regarding telecommunication equipments is available, while the applicable
Directives (Low Voltage and EMC) are available at:
http://europa.eu.int/comm/enterprise/electr_equipment/index_en.htm
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 73 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The LE910-EUG module has been evaluated against the essential requirements of the 1999/5/EC
Directive.
Bulgarian
Czech
Danish
Dutch
English
Estonian
German
Greek
Hungarian
Finnish
French
Icelandic
С настоящето Telit Communications S.p.A. декларира, че 2G/3G/LTE module
отговаря на съществените изисквания и другите приложими изисквания на
Директива 1999/5/ЕС.
Telit Communications S.p.A. tímto prohlašuje, že tento 2G/3G/LTE module je ve shodě
se základními požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES.
Undertegnede Telit Communications S.p.A. erklærer herved, at følgende udstyr
2G/3G/LTE module overholder de væsentlige krav og øvrige relevante krav i direktiv
1999/5/EF.
Hierbij verklaart Telit Communications S.p.A. dat het toestel 2G/3G/LTE module in
overeenstemming is met de essentiële eisen en de andere relevante bepalingen van
richtlijn 1999/5/EG.
Hereby, Telit Communications S.p.A., declares that this 2G/3G/LTE module is in
compliance with the essential requirements and other relevant provisions of Directive
1999/5/EC.
Käesolevaga kinnitab Telit Communications S.p.A. seadme 2G/3G/LTE module
vastavust direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele
asjakohastele sätetele.
Hiermit erklärt Telit Communications S.p.A., dass sich das Gerät 2G/3G/LTE module in
Übereinstimmung mit den grundlegenden Anforderungen und den übrigen einschlägigen
Bestimmungen der Richtlinie 1999/5/EG befindet.
ΜΕ ΤΗΝ ΠΑΡΟΥΣΑ Telit Communications S.p.A. ΔΗΛΩΝΕΙ ΟΤΙ 2G/3G/LTE module
ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ ΟΥΣΙΩΔΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ ΤΙΣ ΛΟΙΠΕΣ ΣΧΕΤΙΚΕΣ
ΔΙΑΤΑΞΕΙΣ ΤΗΣ ΟΔΗΓΙΑΣ 1999/5/ΕΚ.
Alulírott, Telit Communications S.p.A. nyilatkozom, hogy a 2G/3G/LTE module megfelel
a vonatkozó alapvetõ követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak.
Telit Communications S.p.A. vakuuttaa täten että 2G/3G/LTE module tyyppinen laite on
direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden ehtojen
mukainen.
Par la présente Telit Communications S.p.A. déclare que l'appareil 2G/3G/LTE module
est conforme aux exigences essentielles et aux autres dispositions pertinentes de la
directive 1999/5/CE.
Hér með lýsir Telit Communications S.p.A. yfir því að 2G/3G/LTE module er í samræmi
við grunnkröfur og aðrar kröfur, sem gerðar eru í tilskipun 1999/5/EC
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 74 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
Italian
Con la presente Telit Communications S.p.A. dichiara che questo 2G/3G/LTE module è
conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva
1999/5/CE.
Latvian
Ar šo Telit Communications S.p.A. deklarē, ka 2G/3G/LTE module atbilst Direktīvas
1999/5/EK būtiskajām prasībām un citiem ar to saistītajiem noteikumiem.
Lithuanian Šiuo Telit Communications S.p.A. deklaruoja, kad šis 2G/3G/LTE module atitinka
esminius reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas.
Maltese
Hawnhekk, Telit Communications S.p.A., jiddikjara li dan 2G/3G/LTE module
jikkonforma mal-ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fidDirrettiva 1999/5/EC.
Norwegian Telit Communications S.p.A. erklærer herved at utstyret 2G/3G/LTE module er i samsvar
med de grunnleggende krav og øvrige relevante krav i direktiv 1999/5/EF.
Polish
Niniejszym Telit Communications S.p.A. oświadcza, że 2G/3G/LTE module jest zgodny
z zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami Dyrektywy
1999/5/EC
Portuguese Telit Communications S.p.A. declara que este 2G/3G/LTE module está conforme com
os requisitos essenciais e outras disposições da Directiva 1999/5/CE.
Slovak
Telit Communications S.p.A. týmto vyhlasuje, že 2G/3G/LTE module spĺňa základné
požiadavky a všetky príslušné ustanovenia Smernice 1999/5/ES.
Slovenian Telit Communications S.p.A. izjavlja, da je ta 2G/3G/LTE module v skladu z bistvenimi
zahtevami in ostalimi relevantnimi določili direktive 1999/5/ES.
Spanish
Por medio de la presente Telit Communications S.p.A. declara que el 2G/3G/LTE
module cumple con los requisitos esenciales y cualesquiera otras disposiciones
aplicables o exigibles de la Directiva 1999/5/CE.
Swedish
Härmed intygar Telit Communications S.p.A. att denna 2G/3G/LTE module står I
överensstämmelse med de väsentliga egenskapskrav och övriga relevanta
bestämmelser som framgår av direktiv 1999/5/EG.
In order to satisfy the essential requirements of 1999/5/EC Directive, the LE910-EUG module is
compliant with the following standards:
RF spectrum use (R&TTE art. 3.2)
EMC (R&TTE art. 3.1b)
Health & Safety (R&TTE art. 3.1a)
EN 300 440-2 V1.4.1
EN 301 511 V9.0.2
EN 301 908-1 V6.2.1
EN 301 908-2 V5.4.1
EN 301 908-13 V5.2.1
EN 301 489-1 V1.9.2
EN 301 489-3 V1.6.1
EN 301 489-7 V1.3.1
EN 301 489-24 V1.5.1
EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 +
AC:2011
EN 62311:2008
EN 62479:2010
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
The conformity assessment procedure referred to in Article 10 and detailed in Annex IV of Directive
1999/5/EC has been followed with the involvement of the following Notified Body:
AT4 wireless, S.A.
Parque Tecnologico de Andalucía
C/ Severo Ochoa 2
29590 Campanillas – Málaga
SPAIN
Notified Body No: 1909
Thus, the following marking is included in the product:
1909
The full declaration of conformity can be found on the following address:
http://www.telit.com/
There is no restriction for the commercialisation of the LE910-EUG modules in all the countries of the
European Union.
Final product integrating this module must be assessed against essential requirements of the 1999/5/EC
(R&TTE) Directive. It should be noted that assessment does not necessarily lead to testing. Telit
Communications S.p.A. recommends carrying out the following assessments:
RF spectrum use (R&TTE art. 3.2)
It will depend on the antenna used on the final product.
EMC (R&TTE art. 3.1b)
Testing
Health & Safety (R&TTE art. 3.1a)
Testing
Alternately, assessment of the final product against EMC (Art. 3.1b) and Electrical safety (Art. 3.1a)
essential requirements can be done against the essential requirements of the EMC and the LVD Directives:
 Low Voltage Directive 2006/95/EC and product safety
 Directive EMC 2004/108/EC for conformity for EMC
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 76 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
Modification statement
Telit has not approved any changes or modifications to this device by the user. Any changes or modifications
could void the user’s authority to operate the equipment.
Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout
changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur.
Interference statement
This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s).
Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this
device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de
brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement.
Wireless notice
This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled
environment. The antenna should be installed and operated with minimum distance of 20 cm between
the radiator and your body. Antenna gain must be below:
Frequency band LE910-NAG LE910-NVG LE910-SVG
700 MHz
8.74 dBi
9.16 dBi
9.16 dBi
850 MHz
6.93 dBi
9.42 dBi
N/A
1700 MHz
5.00 dBi
5.00 dBi
5.00 dBi
1900 MHz
2.51 dBi
8.01 dBi
N/A
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
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page 77 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
Cet appareil est conforme aux limites d'exposition aux rayonnements de la IC pour un environnement non
contrôlé. L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la source
de rayonnements et votre corps. Gain de l'antenne doit être ci-dessous:
Bande de fréquence LE910-NAG LE910-NVG LE910-SVG
9.16 dBi
9.16 dBi
700 MHz
8.74 dBi
850 MHz
6.93 dBi
9.42 dBi
N/A
1700 MHz
5.00 dBi
5.00 dBi
5.00 dBi
1900 MHz
2.51 dBi
8.01 dBi
N/A
L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.
FCC Class B digital device notice
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses and can radiate
radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
Labelling Requirements for the Host device
The host device shall be properly labelled to identify the modules within the host device. The certification label
of the module shall be clearly visible at all times when installed in the host device, otherwise the host device
must be labelled to display the FCC ID and IC of the module, preceded by the words "Contains transmitter
module", or the word "Contains", or similar wording expressing the same meaning, as follows:
LE910-NAG
Contains FCC ID: RI7LE910NA
Contains IC: 5131A-LE910NA
LE910-NVG
Contains FCC ID: RI7LE910NV
Contains IC: 5131A-LE910NV
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page 78 of 79
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
LE910-SVG
Contains FCC ID: RI7LE910SV
Contains IC: 5131A-LE910SV
L'appareil hôte doit être étiqueté comme il faut pour permettre l'identification des modules qui s'y trouvent.
L'étiquette de certification du module donné doit être posée sur l'appareil hôte à un endroit bien en vue en tout
temps. En l'absence d'étiquette, l'appareil hôte doit porter une étiquette donnant le FCC ID et le IC du module,
précédé des mots « Contient un module d'émission », du mot « Contient » ou d'une formulation similaire
exprimant le même sens, comme suit :
LE910-NAG
Contains FCC ID: RI7LE910NA
Contains IC: 5131A-LE910NA
LE910-NVG
Contains FCC ID: RI7LE910NV
Contains IC: 5131A-LE910NV
LE910-SVG
Contains FCC ID: RI7LE910SV
Contains IC: 5131A-LE910SV
CAN ICES-3 (B) / NMB-3 (B)
This Class B digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 79 of 79

---

Source Exif Data:

File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.5
Linearized                      : No
Language                        : it-IT
Tagged PDF                      : Yes
XMP Toolkit                     : Adobe XMP Core 5.2-c001 63.139439, 2010/09/27-13:37:26
Format                          : application/pdf
Creator                         : F D
Title                           : HE910 Hardware User Guide
Create Date                     : 2014:06:19 17:51:02+02:00
Creator Tool                    : Microsoft® Word 2010
Modify Date                     : 2014:06:25 15:09:01+02:00
Metadata Date                   : 2014:06:25 15:09:01+02:00
Producer                        : Microsoft® Word 2010
Document ID                     : uuid:ad828f23-9ba0-489c-a78d-db48dbb9c2b2
Instance ID                     : uuid:b83621f6-64ba-4190-8ac2-f494380b9b0e
Page Count                      : 79
Author                          : F D

EXIF Metadata provided by EXIF.tools