Telit Communications S p A LE920A4NA Wireless Module User Manual HW User Guide

Telit Communications S.p.A. Wireless Module HW User Guide

Contents

User Manual

LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 2 of 120 Applicability Table This documentation applies to the following products: Table 1: Applicability Table Module Name Description LE920A4-NA North America regional variant (AT&T, T-Mobile) LE920A4-NV North America regional variant (Verizon) LE920A4-EU Europe regional variant HE920A-EU Non-LTE Europe variant LE920A4-CN China variant LE920A4-AP APAC variant
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 3 of 120 SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Notice While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in the content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey any license under its patent rights or the rights of others. It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country. Copyrights This instruction manual and the Telit products described in this instruction manual may be, include, or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute, and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged, or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product. Computer Software Copyrights Telit and third-party software (SW) products described in this instruction manual may include copyrighted Telit and other third-party computer programs stored in semiconductor memories or other media. Laws in Italy and other countries preserve for Telit and other third-party SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other third-party SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the third-party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other third-party SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 4 of 120 Usage and Disclosure Restrictions License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by an express license agreement only and may be used only in accordance with the terms of such an agreement. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit. High Risk Materials Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of nuclear facilities, aircraft navigation or aircraft communication systems, air traffic control, life support, or weapons systems (“high risk activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such high risk activities. Trademarks TELIT and the stylized T logo are trademarks and/or registered trademarks of Telit Communications S.p.A. in the Unites States and/or other countries. All other product or service names are theproperty of their respective owners.Copyright © 2016 Telit Communications S.p.A.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 5 of 120 Contents 1. Introduction ..................................................................................................... 13 1.1. Scope ................................................................................................................ 13 1.2. Audience .......................................................................................................... 13 1.3. Contact Information, Support .......................................................................... 13 1.4. Text Conventions ............................................................................................. 14 1.5. Related Documents .......................................................................................... 15 1.6. Abbreviations ................................................................................................... 15 2. General Product Description ............................................................................ 17 2.1. Overview .......................................................................................................... 17 2.2. Applications ..................................................................................................... 17 2.3. General Functionality and Main Features ....................................................... 18 2.4. Block Diagram .................................................................................................. 21 2.5. Environmental Requirements .......................................................................... 22 2.5.1. Temperature Range .............................................................................. 22 2.5.2. RoHS Compliance.................................................................................. 22 2.6. Frequency Bands .............................................................................................. 23 2.6.1. RF Bands per Regional Variant ............................................................. 23 2.6.2. Reference Table of RF Bands Characteristics ....................................... 24 2.7. Sensitivity ......................................................................................................... 26 2.8. LE920A4 Mechanical Specifications ................................................................. 27 2.8.1. Dimensions ........................................................................................... 27 2.8.2. Weight .................................................................................................. 27 3. LE920A4 Module Connections .......................................................................... 28 3.1. Pin-out .............................................................................................................. 28 3.2. LE920A4 Signals That Must Be Connected ...................................................... 44 3.3. LGA Pads Layout ............................................................................................... 46 3.4. Backward Compatibility to LE920 .................................................................... 47 4. Electrical Specifications .................................................................................... 48 4.1. Absolute Maximum Ratings – Not Operational ............................................... 48
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 6 of 120 4.2. Recommended Operating Conditions ............................................................. 48 4.3. Logic Level Specifications ................................................................................. 49 4.3.1. 1.8V Pads - Absolute Maximum Ratings ............................................... 49 4.3.2. 1.8V Standard GPIOs ............................................................................ 49 4.3.3. 1.8V SD Card Pads ................................................................................. 50 4.3.4. 1.8V SIM Card Pads ............................................................................... 50 4.3.5. Dual Voltage Pads - Absolute Maximum Ratings ................................. 51 4.3.6. SD Card Pads @ 2.95V .......................................................................... 51 4.3.7. SIM Card Pads @2.95V ......................................................................... 52 5. Hardware Commands ....................................................................................... 53 5.1. Turning on the LE920A4 Module ..................................................................... 53 5.2. Initialization and Activation State .................................................................... 53 5.3. Turning off the LE920A4 Module ..................................................................... 55 5.3.1. Shutdown by Software Command ....................................................... 55 5.3.2. Hardware Shutdown ............................................................................. 56 5.3.3. Unconditional Hardware Reset ............................................................ 57 5.3.4. Unconditional Hardware Shutdown ..................................................... 58 6. Power Supply ................................................................................................... 59 6.1. Power Supply Requirements............................................................................ 59 6.2. General Design Rules ....................................................................................... 61 6.2.1. Electrical Design Guidelines .................................................................. 61 6.2.1.1. + 5V Input Source Power Supply – Design Guidelines ......... 61 6.2.1.2. + 12V Input Source Power Supply – Design Guidelines ....... 62 6.2.1.3. Battery Source Power Supply – Design Guidelines .............. 64 6.2.2. Thermal Design Guidelines ................................................................... 65 6.2.3. Power Supply PCB Layout Guidelines ................................................... 66 7. Antenna(s) ....................................................................................................... 67 7.1. GSM/WCDMA/LTE Antenna Requirements ..................................................... 67 7.2. GSM/WCDMA/LTE Antenna – PCB Line Guidelines ......................................... 68 7.3. GSM/WCDMA/LTE Antenna – Installation Guidelines .................................... 69
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 7 of 120 7.4. Antenna Diversity Requirements ..................................................................... 69 7.5. GNSS Antenna Requirements .......................................................................... 70 7.5.1. Combined GNSS Antenna ..................................................................... 70 7.5.2. Linear and Patch GNSS Antenna ........................................................... 70 7.5.3. Front End Design Considerations ......................................................... 70 7.5.4. GNSS Antenna – PCB Line Guidelines ................................................... 71 7.5.5. GNSS Antenna – Installation Guidelines ............................................... 71 8. Hardware Interfaces......................................................................................... 72 8.1. USB Port ........................................................................................................... 73 8.2. HSIC Interface .................................................................................................. 74 8.3. Ethernet Connectivity (optional) ..................................................................... 74 8.3.1. SGMII Interface ..................................................................................... 74 8.3.2. Ethernet Control interface ................................................................... 74 8.4. Serial Ports ....................................................................................................... 75 8.4.1. Modem Serial Port 1 Signals ................................................................. 75 8.4.2. Modem Serial Port 2 ............................................................................. 76 8.4.3. RS232 Level Translation ........................................................................ 77 8.5. Peripheral Ports ............................................................................................... 78 8.5.1. SPI – Serial Peripheral Interface ........................................................... 79 8.5.2. I2C - Inter-integrated Circuit ................................................................ 79 8.5.3. SD/MMC Card Interface ....................................................................... 81 8.5.4. WiFi SDIO Interface .............................................................................. 83 8.6. Audio Interface ................................................................................................ 84 8.6.1. Analog Audio ........................................................................................ 84 8.6.2. Digital Audio ......................................................................................... 85 8.6.2.1. Short Frame Timing Diagrams .............................................. 86 8.6.2.2. Long Frame Timing Diagrams ............................................... 88 8.7. General Purpose I/O ........................................................................................ 90 8.7.1. Using a GPIO Pad as Input .................................................................... 92 8.7.2. Using a GPIO Pad as an interrupt ......................................................... 92
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 8 of 120 8.7.3. Using a GPIO Pad as Output ................................................................. 92 9. Miscellaneous Functions .................................................................................. 93 9.1. Indication of Network Service Availability ....................................................... 93 9.2. RTC – Real Time Clock ...................................................................................... 94 9.3. VAUX Power Output ........................................................................................ 94 9.4. ADC Converter ................................................................................................. 94 9.4.1. Description............................................................................................ 94 9.4.2. Using the ADC Converter ...................................................................... 95 9.5. Using the Temperature Monitor Function ...................................................... 95 9.6. Fuel Gauge (optional) ...................................................................................... 95 9.7. GNSS Characteristics ........................................................................................ 96 10. Mounting the Module on your Board ............................................................... 97 10.1. General ............................................................................................................. 97 10.2. Finishing & Dimensions .................................................................................... 97 10.3. Recommended Footprint for the Application ................................................. 98 10.4. Stencil ............................................................................................................... 99 10.5. PCB Pad Design ................................................................................................ 99 10.6. Recommendations for PCB Pad Dimensions (mm) ........................................ 100 10.7. Solder Paste ................................................................................................... 101 10.7.1. Solder Reflow ...................................................................................... 101 11. Application Guide ........................................................................................... 103 11.1. Debug of the LE920A4 Module in Production ............................................... 103 11.2. Bypass Capacitor on Power Supplies ............................................................. 104 11.3. SIM Interface .................................................................................................. 105 11.3.1. SIM Schematic Example ...................................................................... 105 11.4. EMC Recommendations ................................................................................. 106 11.5. Download and Debug Port ............................................................................. 106 11.5.1. Fast Boot Mode .................................................................................. 106 11.5.2. Recovery Boot Mode .......................................................................... 106 11.6. Antenna Detection ......................................................................................... 107
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 9 of 120 12. Packing System ............................................................................................... 108 12.1. Tray ................................................................................................................ 108 12.2. Tape & Reel .................................................................................................... 111 12.3. Moisture Sensitivity ....................................................................................... 112 13. Safety Recommendations ................................................................................ 113 14. Conformity assessment issues ......................................................................... 114 14.1. FCC/ISED Regulatory notices ......................................................................... 114 15. Document History ........................................................................................... 117
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 10 of 120 List of Tables Table 1: Applicability Table ................................................................................................................. 2 Table 2: Related Documents ............................................................................................................ 15 Table 3: Main Features ..................................................................................................................... 18 Table 4: RF Bands per Regional Variant ............................................................................................ 23 Table 5: RF Bands Characteristics ..................................................................................................... 24 Table 6: LE20A4 Pin-out .................................................................................................................... 28 Table 7: Mandatory Signals .............................................................................................................. 44 Table 8: Absolute Maximum Ratings – Not Operational .................................................................. 48 Table 9: Recommended Operating Conditions ................................................................................ 48 Table 10: Absolute Maximum Ratings - Not Functional ................................................................... 49 Table 11: Operating Range – Interface Levels (1.8V CMOS) ............................................................ 49 Table 12: Operating Range – SD Card Pads Working at 1.8V ........................................................... 50 Table 13: Operating Range – SIM Pads Working at 1.8V.................................................................. 50 Table 14: Absolute Maximum Ratings - Not Functional ................................................................... 51 Table 15: Operating Range – For SD Card Pads Operating at 2.95V ................................................ 51 Table 16: Operating Range – For SIM Pads Operating at 2.95V ....................................................... 52 Table 17: Power Supply Requirements ............................................................................................ 59 Table 18: LE920A4 Current Consumption ........................................................................................ 59 Table 19: GSM / WCDMA/ LTE Antenna Requirements ................................................................... 67 Table 20: Antenna Line on PCB Requirements ................................................................................. 67 Table 21: Antenna Diversity Requirements ...................................................................................... 69 Table 22: Antenna Line on PCB Requirements ................................................................................. 71 Table 23: LE920A4 Hardware Interfaces .......................................................................................... 72 Table 24: USB Interface Signals ........................................................................................................ 73 Table 25: Ethernet Control Interface Signals .................................................................................... 74 Table 26: Modem Serial Port 1 Signals ............................................................................................. 75 Table 27: Modem Serial Port 2 Signals ............................................................................................. 77 Table 28: SPI Signals ......................................................................................................................... 79 Table 29: SD Card Signals .................................................................................................................. 81 Table 30: WiFi SDIO Interface ........................................................................................................... 83 Table 31: Analog Audio Signals ......................................................................................................... 84 Table 32: Digital Audio Interface (DVI) Signals ................................................................................. 85 Table 33: PCM_CODEC Timing Parameters ...................................................................................... 87 Table 34: AUX_PCM_CODEC Timing Parameters ............................................................................. 89 Table 35: Primary GPIOs ................................................................................................................... 90 Table 36: Additional GPIOs ............................................................................................................... 91 Table 37: Network Service Availability Indication ............................................................................ 93 Table 38: Operating Range – VAUX Power Supply ........................................................................... 94 Table 39: ADC Parameters ................................................................................................................ 94
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 11 of 120 Table 40: GNSS Characteristics ......................................................................................................... 96 Table 41: Recommendations for PCB Pad Surfaces ....................................................................... 100 Table 42: Solder Profile Characteristics .......................................................................................... 102 Table 43: SIM Interface – C1 Range ................................................................................................ 105 Table 44: EMC Recommendations ................................................................................................. 106 Table 45: Tray Packing .................................................................................................................... 108 Table 46: Tray Packing Quantities .................................................................................................. 108 Table 47: Document Revision History ............................................................................................ 117
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 12 of 120 List of Figures Figure 1: LE920A4 Block Diagram ..................................................................................................... 21 Figure 2: LGA Pads Layout ................................................................................................................ 46 Figure 3: LE920A4 vs. LE920 Pin-out Comparison ............................................................................ 47 Figure 4: Power-on Circuit ................................................................................................................ 53 Figure 5: LE920A4 Initialization and Activation ................................................................................ 54 Figure 6: Shutdown by Software Command ..................................................................................... 55 Figure 7: Hardware Shutdown via ON_OFF ...................................................................................... 56 Figure 8: Circuit for Unconditional Hardware Reset ........................................................................ 57 Figure 9: Alternate Connection of RESET_N Pad .............................................................................. 57 Figure 10: Circuit for Unconditional Hardware Shutdown ............................................................... 58 Figure 11 Power down timing using SHDN_N .................................................................................. 58 Figure 12: Example of Linear Regulator with 5V Input ..................................................................... 62 Figure 13: Example of Switching Regulator with 12V Input – Part 1 ................................................ 63 Figure 14: Example of Switching Regulator with 12V Input – Part 2 ................................................ 63 Figure 15: RS232 Level Adaption Circuitry Example ......................................................................... 78 Figure 16: RS232 Serial Port Lines Connection Layout ..................................................................... 78 Figure 17: SPI Signal Connectivity ..................................................................................................... 79 Figure 18: SD Interface Connectivity ................................................................................................ 82 Figure 19: Primary PCM Timing ........................................................................................................ 86 Figure 20: Auxiliary PCM Timing ....................................................................................................... 88 Figure 21: GPIO Output Pad Equivalent Circuit ................................................................................ 92 Figure 22: Status LED Reference Circuit ........................................................................................... 93 Figure 23: Fuel Gauge Connectivity Example ................................................................................... 95 Figure 24: LE920A4 Mechanical Dimensions .................................................................................... 97 Figure 25: Recommended Footprint (Top View) .............................................................................. 98 Figure 26: PCB Pad Design ................................................................................................................ 99 Figure 27: PCB Pad Dimensions ...................................................................................................... 100 Figure 28: Solder Reflow Profile ..................................................................................................... 101 Figure 29: SIM Schematics .............................................................................................................. 105 Figure 30: Tray Packing ................................................................................................................... 109 Figure 31: Tray Drawing .................................................................................................................. 110 Figure 32: Module Positioning into the Carrier .............................................................................. 111 Figure 33: Carrier Tape Detail ......................................................................................................... 111 Figure 34: Reel Detail ...................................................................................................................... 112 Figure 35: Reel Box Detail ............................................................................................................... 112
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 13 of 120 1. Introduction 1.1. Scope This document introduces the Telit LE920A4 module and presents possible and recommended hardware solutions for developing a product based on the LE920A4 module. All the features and solutions detailed in this document are applicable to all LE920A4 variants, where “LE920A4” refers to the variants listed in the applicability table. If a specific feature is applicable to a specific product only, it will be clearly marked. NOTE: LE920A4 refers to all modules listed in the Applicability Table. This document takes into account all the basic functions of a wireless module; a valid hardware solution is suggested for each function, and incorrect solutions and common errors to be avoided are pointed out. Obviously, this document cannot embrace every hardware solution or every product that can be designed. Obviously, avoiding invalid solutions must be considered mandatory. Where the suggested hardware configurations need not be considered mandatory, the information given should be used as a guide and a starting point for properly developing your product with the Telit LE920A4 module. NOTE: The integration of the GSM/GPRS/EGPRS/WCDMA/HSPA+/LTE LE920A4 cellular module within a user application must be done according to the design rules described in this manual. 1.2. Audience This document is intended for Telit customers, especially system integrators, about to implement their applications using the Telit LE920A4 module. 1.3. Contact Information, Support For general contact, technical support, to report documentation errors and to order manuals, contact Telit’s Technical Support Center (TTSC) at:  TS-EMEA@telit.com  TS-NORTHAMERICA@telit.com  TS-LATINAMERICA@telit.com  TS-APAC@telit.com
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 14 of 120 Alternatively, use: http://www.telit.com/en/products/technical-support-center/contact.php For detailed information about where you can buy the Telit modules or for recommendations on accessories and components, visit: http://www.telit.com To register for product news and announcements or for product questions contact Telit’s Technical Support Center (TTSC). Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Telit appreciates feedback from the users about the information provided. 1.4. Text Conventions The following conventions are used to emphasize specific types of information: DANGER: This information MUST be followed or catastrophic equipment failure or bodily injury may occur. CAUTION or WARNING: Alerts the user to important points about integrating the module. If these points are not followed, the module and end user equipment may fail or malfunction. NOTE: Tip or Information – Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, that is, YYYY-MM-DD.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 15 of 120 1.5. Related Documents Table 2: Related Documents Document Title Document Number Ref 1: LE920A4 AT Command User Guide 80490ST10778A Ref 2: LE920A4 Software Guide 1VV0301332 Ref 3: Generic EVB HW User Guide 1VV0301249 Ref 4: LE920A4 Interface Board HW User Guide 1VV0301248 Ref 5: xE920 Audio Settings Application Note 80404NT10095A Ref 6: LE920 Hardware User Guide 1VV0301026 Ref 7: SIM Integration Design Guide Application Note Rev10 80000NT10001A Ref 8: Telit_LE920A4_LE910Cx_Wi-Fi_Interface_Application_Note_r1 80490NT11511A Ref 9: Antenna Detection Application Note 80000NT10002A Ref 10: High-Speed Inter-Chip USB Electrical Specification, version 1.0 (a supplement to the USB 2.0 specification, Section 3.8.2) 1.6. Abbreviations Term Definition ADC Analog-to-digital converter AE Application-enabled DAC Digital-to-analog converter DTE Data Terminal Equipment FDD Frequency division duplex GLONASS Global orbiting navigation satellite system GNSS Global navigation satellite system GPIO General-purpose input/output
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 16 of 120 Term Definition GPRS General packet radio services GPS Global positioning system GSM Global system for mobile communications HSIC High-speed inter-chip I2C Inter-integrated circuit LTE Long term evolution SD Secure digital SGMII Serial Gigabit media-independent interface SIM Subscriber identity module SOC System-on-Chip SMX SmartMX SPI Serial peripheral interface UART Universal asynchronous receiver transmitter UMTS Universal mobile telecommunications system USB Universal serial bus WCI Wireless Coexistence Interface WCDMA Wideband code division multiple access
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 17 of 120 2. General Product Description 2.1. Overview LE920A4 is Telit’s platform for automotive telematics on-board units (OBU's) for applications, such as automotive telematics and eCall, based on the following technologies:  4G cellular for voice and data communication  GNSS - GPS, GLONASS, BeiDou, Galileo, QZSS, for positioning service  Embedded security o ARM Trust Zone services o Hardware security processor (optional)  Designed for automotive markets1 quality needs In its most basic use case, LE920A4 can be applied as a wireless communication front-end for telematics products, offering GNSS and mobile communication features to an external host CPU through its rich interfaces. LE920A4 can further support customer software applications and security features. LE920A4 provides a software application development environment with sufficient system resources for creating rich on-board applications. Thanks to a dedicated application processor and embedded security resources, product developers and manufacturers can create products that guarantee fraud prevention and tamper evidence without extra effort for additional security precautions. LE920A4 can be self-sufficient and serve as a fully integrated solution for applications, such as location-based cellular telematics, navigation, road pricing and eCall. In such a case, the customer would simply complement the module with a power supply, speaker amplifier, microphone, antennas, and an HMI (if applicable). LE920A4 is available in hardware variants as listed in Table 1: Applicability Table. The designated RF band sets per each variant are detailed in Section 2.6.1, RF Bands per Regional Variant. 2.2. Applications LE920A4 can be used for telematics applications where tamper-resistance, confidentiality, integrity, and authenticity of end-user information are required, for example:  Emergency call  Telematics services  Road pricing  Pay-as-you-drive insurance  Stolen vehicles tracking  Internet connectivity 1 In accordance with Telit’s Robustness Validation, using AEC-Q100-defined qualification tests.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 18 of 120 2.3. General Functionality and Main Features The LE920A4 family of automotive cellular modules features LTE and multi-RAT modem together with an on-chip powerful application processor and a rich set of interfaces. The major functions and features are listed below. Table 3: Main Features Function Features Modem  Multi-RAT cellular modem for voice and data communication o LTE FDD/TDD Cat4 (150/50 Mbps DL/UL) o GSM/GPRS/EDGE o WCDMA up to DC HSPA+, Rel.9 o TD-SCDMA (China variant only)  Support for European eCall , US E911, and ERA Glonass  Support for SIM profile switching  Regional variants with optimal choice of RF bands for worldwide coverage of countries and MNOs  State-of-the-art GNSS solution with GPS/GLONASS/BeiDou/Galileo/QZSS receiver Audio subsystem  Embedded analog codec with two microphone inputs  Embedded analog codec with one stereo or two mono outputs  PCM/I2S digital audio interface  Up to 48 kHz sample rate, 16 bit words Two USIM ports – dual voltage  Class B and Class C support  Hot swap support  Clock rates up to 4 MHz Application processor Application processor to run customer application code  32 bit ARM Cortex-A7 up to 1.2 GHz running the Linux operating system  Flash + DDR are large enough to allow for customer’s own software applications  Default memory configuration is 4Gb (512MB) Flash + 2Gb (256MB) RAM  Other memory configuration can be supported upon request, for example: 2Gbit Flash + 2Gbit DDR, 4Gbit Flash + 4Gbit DDR.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 19 of 120 Function Features Interfaces Rich set of interfaces, including:  SD/MMC Card Interface supporting SD3.0 standard  SDIO for external WiFi transceiver supporting SDIO3.0 standard  SGMII for external Ethernet transceiver (optional) o Compliant with IEEE802.3 o Full duplex operation at 1 Gbps o Half/full duplex operation at 10/100 Mbps o Support for VLAN tagging o Support for IEEE1588, PTP (Precision Time Protocol)  USB2.0 – USB port is typically used for: o Flashing of firmware and module configuration o Production testing o Accessing the Application Processor’s file system o AT command access o High-speed WWAN access to external host o Diagnostic monitoring and debugging o Communication between Java application environment and an external host CPU o NMEA data to an external host CPU  HSIC o High-speed 480 Mbps (240 MHz DDR) USB transfers are 100% host driver compatible with traditional USB cable connected topologies o Bidirectional data strobe signal (STROBE) o Bidirectional data signal (DATA) o No power consumption unless a transfer is in progress o Maximum trace length 10 cm o Signals driven at 1.2V standard LVCMOS levels  Peripheral Ports – SPI, I2C, UART  GPIOs  Analog audio I/F  Antenna ports
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 20 of 120 Function Features Major software features  Advanced security features o Boot integrity of firmware up to customer applications o Disable/secure re-enable of debug o Embedded security  FOTA (optional)  Telit Unified AT command set  Java VM (optional) with the following features: o Rich and standardized application environment for customer applications o State-of-the-art and high performance Java SE8 embedded Virtual Machine o Oracle Java SE8 Embedded, Compact Profile 1 o JIT-enabled Form factor Form factor (40x34mm), accommodating the multiple RF bands in each region variant Environment and quality requirements The entire module is designed and qualified by Telit for satisfying the environment and quality requirements for use in automotive applications2. Single supply module The module generates all its internal supply voltages. RTC RTC is maintained as long as VBATT is supplied Operating temperature Range -40 °C to +85 °C (conditions as defined in Section 2.5.1, Temperature Range) 2 In accordance with Telit’s Robustness Validation, using AEC-Q100-defined qualification tests
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 21 of 120 2.4. Block Diagram Figure 1 shows an overview of the internal architecture of the LE920A4 module. It includes the following sub-functions:  Application processor, Modem subsystem and Location processing with their external interfaces. These three functions are contained in a single SOC.  RF front end, including antenna diagnosis circuitry  Analog Audio codec for attaching external speaker amplifier and microphone  Rich IO interfaces. Depending on which LE920A4 software features are enabled, some of its interfaces that are exported through multiplexing may be used internally and thus may not be usable by the application.  PMIC with the RTC function inside Figure 1: LE920A4 Block Diagram ANT DIAGMemoriesRFFrontendGNSS AntennnaGPIOCellular Antenna 1Cellular Antenna 2MicrophoneEar / Line outPCM In/outSIMGNSS_SyncApplication ProcessorModemLocationHSICI2CANT DIAGUSB2.0SGMIISPIUARTJTAGAudio CODEC2xSDIOPMIC VBATTADCVBATT_PARTC
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 22 of 120 2.5. Environmental Requirements 2.5.1. Temperature Range Operating temperature range -20 ~ +55°C This range is defined by 3GPP (the global standard for wireless mobile communication). Telit guarantees its modules to comply with all the 3GPP requirements and to have full functionality of the module with in this range. -40 ~ +85°C Telit guarantees full functionality within this range as well. However, there may possibly be some performance deviations in this extended range relative to 3GPP requirements, which means that some RF parameters may deviate from the 3GPP specification in the order of a few dB. For example: receiver sensitivity or maximum output power may be slightly degraded. Even so, all the functionalities, such as call connection, SMS, USB communication, UART activation etc., will be maintained, and the effect of such degradations will not lead to malfunction. –40°C ~ +95°C eCall must be functional (until the module is broken) Storage and non-operating temperature range –40°C ~ +105°C 2.5.2. RoHS Compliance As a part of the Telit corporate policy of environmental protection, the LE920A4 complies with the RoHS (Restriction of Hazardous Substances) directive of the European Union (EU directive 2011/65/EU).
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 23 of 120 2.6. Frequency Bands The operating frequencies in GSM850, EGSM900, DCS1800, PCS1900, WCDMA & LTE modes conform to the 3GPP specifications. 2.6.1. RF Bands per Regional Variant Table 4 summarizes all region variants within the LE920A4 family, showing the supported band sets in each variant. Table 4: RF Bands per Regional Variant Region Variant LTE FDD LTE TDD HSPA+ TD-SCDMA 2G LE920A4-NA 2, 4, 5, 7(*), 12 - 2, 4, 5 - 2, 5 LE920A4-NV (TBD) 2, 4, 5, 7(*), 13 - 2, 5 - - LE920A4-EU 1, 3, 5(*), 7, 8, 20, 28(*) - 1, 3, 5(*), 8 - 3, 8 HE920A-EU (Non-LTE, TBD) - - 1, 3, 5, 8 - 2, 3, 5, 8 LE920A4-CN 1, 3, 5, 8, 26 38, 39, 40, 41M 1, 5, 8 34, 39 3, 8 LE920A4-AP (TBD) 1, 3, 5, 7, 8, 19, 21, 26, 28 - 1, 3, 5, 8, 19 - 2, 3, 5, 8 (*) Indicates optional bands, with a different schedule than the standard configuration Band 41M for China: 2,555-2,655 MHz
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 24 of 120 2.6.2. Reference Table of RF Bands Characteristics Table 5: RF Bands Characteristics Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset PCS 1900 1850.2 ~ 1909.8 1930.2 ~ 1989.8 512 ~ 810 80 MHz DCS 1800 1710 ~ 1785 1805 ~ 1880 512 ~ 885 95 MHz GSM 850 824.2 ~ 848.8 869.2 ~ 893.8 128 ~ 251 45 MHz EGSM 900 890 ~ 915 935 ~ 960 0 ~ 124 45 MHz 880 ~ 890 925 ~ 935 975 ~ 1023 45 MHz WCDMA 2100 – B1 1920 ~ 1980 2110 ~ 2170 Tx: 9612 ~ 9888 Rx: 10562 ~ 10838 190 MHz WCDMA 1900 – B2 1850 ~ 1910 1930 ~ 1990 Tx: 9262 ~ 9538 Rx: 9662 ~ 9938 80 MHz WCDMA 1800 – B3 1710 ~ 1785 1805 ~ 1880 Tx: 937 ~ 1288 Rx: 1162 ~ 1513 95 MHz WCDMA AWS – B4 1710 ~ 1755 2110 ~ 2155 Tx: 1312 ~ 1513 Rx: 1537 ~ 1738 400 MHz WCDMA 850 – B5 824 ~ 849 869 ~ 894 Tx: 4132 ~ 4233 Rx: 4357 ~ 4458 45 MHz WCDMA 900 – B8 880 ~ 915 925 ~ 960 Tx: 2712 ~ 2863 Rx: 2937 ~ 3088 45 MHz WCDMA 1800 – B9 1750 ~ 1784.8 1845 ~ 1879.8 Tx: 8762 ~ 8912 Rx: 9237 ~ 9387 95 MHz WCDMA 800 – B19 830 ~ 845 875 ~ 890 Tx: 312 ~ 363 Rx: 712 ~ 763 45 MHz TDSCDMA 2000 – B34 2010 ~ 2025 2010 ~ 2025 Tx: 10054 ~ 10121 Rx: 10054 ~ 10121 0 MHz
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 25 of 120 Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset TDSCDMA 1900 – B39 1880 ~ 1920 1880 ~ 1920 Tx: 9404 ~ 9596 Rx: 9404 ~ 9596 0 MHz LTE 2100 – B1 1920 ~ 1980 2110 ~ 2170 Tx: 18000 ~ 18599 Rx: 0 ~ 599 190 MHz LTE 1900 – B2 1850 ~ 1910 1930 ~ 1990 Tx: 18600 ~ 19199 Rx: 600 ~ 1199 80 MHz LTE 1800 – B3 1710 ~ 1785 1805 ~ 1880 Tx: 19200 ~ 19949 Rx: 1200 ~ 1949 95 MHz LTE AWS – B4 1710 ~ 1755 2110 ~ 2155 Tx: 19950 ~ 20399 Rx: 1950 ~ 2399 400 MHz LTE 850 – B5 824 ~ 849 869 ~ 894 Tx: 20400 ~ 20649 Rx: 2400 ~ 2649 45 MHz LTE 2600 – B7 2500 ~ 2570 2620 ~ 2690 Tx: 20750 ~ 21449 Rx: 2750 ~ 3449 120 MHz LTE 900 – B8 880 ~ 915 925 ~ 960 Tx: 21450 ~ 21799 Rx: 3450 ~ 3799 45 MHz LTE 1800 – B9 1749.9 ~ 1784.9 1844.9 ~ 1879.9 Tx: 21800 ~ 2149 Rx: 3800 ~ 4149 95 MHz LTE AWS+ – B10 1710 ~ 1770 2110 ~ 2170 Tx: 22150 ~ 22749 Rx: 4150 ~ 4749 400 MHz LTE 700a – B12 699 ~ 716 729 ~ 746 Tx : 23010 ~ 23179 Rx : 5010 ~ 5179 30 MHz LTE 700c – B13 777 ~ 787 746 ~ 756 Tx : 27210 ~ 27659 Rx : 9210 ~ 9659 -31 MHz LTE 700b – B17 704 ~ 716 734 ~ 746 Tx: 23730 ~ 23849 Rx: 5730 ~ 5849 30 MHz
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 26 of 120 Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset LTE 800 – B19 830 ~ 845 875 ~ 890 Tx: 24000 ~ 24149 Rx: 6000 ~ 6149 45 MHz LTE 800 – B20 832 ~ 862 791 ~ 821 Tx: 24150 ~ 24449 Rx: 6150 ~ 6449 -41 MHz LTE 1500 – B21 1447.9 ~ 1462.9 1495.9 ~ 1510.9 Tx: 24450 ~ 24599 Rx: 6450 ~ 6599 48 MHz LTE 850+ – B26 814 ~ 849 859 ~ 894 Tx: 26690 ~ 27039 Rx: 8690 ~ 9039 45 MHz LTE 700 – B28 703 ~ 748 758 ~ 803 Tx : 27210 ~ 27659 Rx : 9210 ~ 9659 45 MHz LTE TDD 2600 – B38 2570 ~ 2620 2570 ~ 2620 Tx: 37750 ~ 38250 Rx: 37750 ~ 38250 0 MHz LTE TDD 1900 – B39 1880 ~ 1920 1880 ~ 1920 Tx: 38250 ~ 38650 Rx: 38250 ~ 38650 0 MHz LTE TDD 2300 – B40 2300 ~ 2400 2300 ~ 2400 Tx: 38650 ~ 39650 Rx: 38650 ~ 39650 0 MHz LTE TDD 2500 – B41 2496 ~ 2690 2496 ~ 2690 Tx: 39650 ~ 41590 Rx: 39650 ~ 41590 0 MHz 2.7. Sensitivity LE920A4 maximum sensitivity levels are as follow:  -108 dBm (TBD) @ 2G  -111 dBm (TBD) @ 3G  -102 dBm (TBD) @ 4G FDD (BW=5 MHz)
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 27 of 120 2.8. LE920A4 Mechanical Specifications 2.8.1. Dimensions The LE920A4 module’s overall dimensions are:  Length: 34 mm, +/- 0.15 mm tolerance  Width: 40 mm, +/- 0.15 mm tolerance  Thickness: 2.9 mm, +/- 0.15 mm tolerance 2.8.2. Weight The nominal weight of the LE920A4 module is 9.0 gram.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 28 of 120 3. LE920A4 Module Connections 3.1. Pin-out Table 6: LE20A4 Pin-out PAD Signal I/O Function Type Comment USB HS 2.0 Communication Port D19 USB_D+ I/O USB differential data(+) F19 USB_D- I/O USB differential data(-) A18 USB_VBUS AI Power sense for the internal USB transceiver Power 2.5V-5.5V B19 USB_ID AI USB ID for supporting USB2.0 OTG Asynchronous UART AH19 C103/TXD I Serial data input (TXD) from DTE 1.8V AF19 C104/RXD O Serial data output to DTE 1.8V AA18 C105/RTS I Input for Request To Send signal (RTS) from DTE 1.8V AK19 C106/CTS O Output for Clear To Send signal (CTS) to DTE 1.8V AG18 C107/DSR O Output for Data Set Ready (DSR) to DTE 1.8V Alternate Fn GPIO_32 AC18 C108/DTR I Input for Data Terminal Ready (DTR) from DTE 1.8V Alternate Fn GPIO_34 AE18 C109/DCD O Output for Data Carrier Detect (DCD) to DTE 1.8V Alternate Fn GPIO_33 AJ18 C125/RING O Output for Ring Indication (RI) to DTE 1.8V Alternate Fn GPIO_31 Asynchronous Auxiliary UART AB19 TX_AUX O Auxiliary UART (Tx Data to DTE) 1.8V AD19 RX_AUX I Auxiliary UART (Rx Data from DTE) 1.8V
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 29 of 120 PAD Signal I/O Function Type Comment SPI – Serial Peripheral Interface P19 SPI_CLK O SPI clock output 1.8V M19 SPI_MISO I SPI data Master Input Slave Output 1.8V K19 SPI_MOSI O SPI data Master Output Slave Input 1.8V N18 SPI_CS O SPI chip select output 1.8V SD/MMC Card Interface AH17 SD/MMC_CMD O SD command 1.8/2.95V AD17 SD/MMC_CLK O SD card clock 1.8/2.95V Y17 SD/MMC_DATA0 I/O SD Serial Data 0 1.8/2.95V AF17 SD/MMC_DATA1 I/O SD Serial Data 1 1.8/2.95V AB17 SD/MMC_DATA2 I/O SD Serial Data 2 1.8/2.95V W17 SD/MMC_DATA3 I/O SD Serial Data 3 1.8/2.95V U17 SD/MMC_CD I SD card detect input 1.8V Active Low S17 VMMC - Power supply for MMC card pull-up resistors 1.8/2.95V WiFi (SDIO) Interface AB3 WiFi_SD_CMD O WiFi SD command 1.8V AM3 WiFi_SD_CLK O WiFi SD clock 1.8V AD3 WiFi_SD_DATA0 I/O WiFi SD Serial Data 0 1.8V AF3 WiFi_SD_DATA1 I/O WiFi SD Serial Data 1 1.8V AH3 WiFi_SD_DATA2 I/O WiFi SD Serial Data 2 1.8V AK3 WiFi_SD_DATA3 I/O WiFi SD Serial Data 3 1.8V Y3 WiFi_SDRST O WiFi Reset / Power enable control 1.8V Active Low AA4 WLAN_SLEEP_CLK O WiFi Sleep clock output 1.8V
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 30 of 120 PAD Signal I/O Function Type Comment X4 RFCLK2_QCA O WiFi low-noise RF clock output 1.8V LTE-WiFi Coexistence AS3 WCI_TX O Wireless coexistence interface TXD 1.8V AT2 WCI_RX I Wireless coexistence interface RXD 1.8V SIM Card Interface 1 A10 SIMCLK1 O External SIM 1 signal – Clock 1.8/2.85V B11 SIMRST1 O External SIM 1 signal – Reset 1.8/2.85V B9 SIMIO1 I/O External SIM 1 signal - Data I/O 1.8/2.85V Internally PU 20 kΩ to SIMVCC1 B7 SIMIN1 I External SIM1 signal - Presence 1.8V Active low A8 SIMVCC1 - External SIM1 signal – power supply for SIM1 1.8/2.85V E8 Reserved for ESIM_RST I Reserved for eSIM signal – Reset 1.8/2.85V Reserved SIM Card Interface 2 C16 SIMCLK2 O External SIM 2 signal – Clock 1.8/2.85V D17 SIMRST2 O External SIM 2 signal – Reset 1.8/2.85V E16 SIMIO2 I/O External SIM 2 signal – Data I/O 1.8/2.85V Internally PU 20kΩ to SIMVCC2 C18 SIMIN2 I External SIM 2 signal – Presence 1.8V Active low D15 SIMVCC2 - External SIM2 signal – Power supply for SIM2 1.8/2.85V Analog Audio interface B5 EAR1_MT+ AO Earphone signal output1, phase + Audio A4 EAR1_MT- AO Earphone signal output1, phase - Audio
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 31 of 120 PAD Signal I/O Function Type Comment B3 MIC1_MT+ AI Mic signal input1, phase + Audio A2 MIC1_MT- AI Mic signal input1, phase - Audio G6 MICBIAS AO Mic BIAS Audio E2 EAR2_MT+ AO Earphone signal output2, phase + Audio D1 EAR2_MT- AO Earphone signal output2, phase - Audio C2 MIC2_MT+ AI Mic signal input2, phase + Audio B1 MIC2_MT- AI Mic signal input2, phase - Audio Digital Voice Interface (DVI) D11 DVI_WA0 O Digital Voice interface (WA0 master output) 1.8V C8 DVI_RX I Digital Voice interface (Rx) 1.8V D9 DVI_TX O Digital Voice interface (Tx) 1.8V C10 DVI_CLK O Digital Voice interface (CLK master output) 1.8V C12 REF_CLK O Reference clock for external Codec 1.8V General Purpose Digital I/O F9 GPIO_01 I/O GPIO_01 1.8V Alternate Fn I2C E10 GPIO_02 I/O GPIO_02 1.8V Alternate Fn I2C F11 GPIO_03 I/O GPIO_03 1.8V Alternate Fn I2C E12 GPIO_04 I/O GPIO_04 1.8V Alternate Fn I2C F13 GPIO_05 I/O GPIO_05 1.8V Alternate Fn I2C E14 GPIO_06 I/O GPIO_06 1.8V Alternate Fn I2C
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 32 of 120 PAD Signal I/O Function Type Comment W19 GPIO_10 I/O GPIO_10 1.8V Alternate Fn I2C AN4 GPIO_20 I/O GPIO_20 1.8V RF Section AD1 Antenna I/O GSM/EDGE/UMTS/LTE main antenna (50 Ohm) RF AU9 ANT_DIV I UMTS/LTE antenna diversity input (50 Ohm) RF GPS Section S1 ANT_GPS I GPS antenna (50 Ohm) RF V2 GPS_LNA_EN O Enables the external regulator for GPS LNA 1.8V W3 GPS_SYNC O GPS sync signal for Dead Reckoning 1.8V Miscellaneous Functions AN8 RESET_N I Reset input Active low AS1 ON_OFF_N I Power ON / Power OFF input Active low AN12 SHDN_N I Unconditional Shutdown input Active low P17 VAUX/PWRMON O Supply output for external accessories / Power ON monitor 1.8V D5 ADC_IN1 AI Analog/Digital Converter Input 1 Analog E6 ADC_IN2 AI Analog/Digital Converter Input 2 Analog F7 ADC_IN3 AI Analog/Digital Converter Input 3 Analog AU3 STAT_LED O Status Indicator LED 1.8V AN10 SW_RDY O Indicates that the boot sequence has completed successfully 1.8V SGMII Interface ZZ11 SGMII_RX_P AI SGMII receive - plus PHY
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 33 of 120 PAD Signal I/O Function Type Comment ZZ13 SGMII_RX_M AI SGMII receive - minus PHY ZZ15 SGMII_TX_P AO SGMII transmit - plus PHY ZZ17 SGMII_TX_M AO SGMII transmit - minus PHY Ethernet PHY Control Interface G14 MAC_MDC O MAC to PHY Clock 2.85V G12 MAC_MDIO I/O MAC to PHY Data 2.85V G8 ETH_RST_N O Ethernet PHY Reset 2.85V G10 ETH_INT_N I Ethernet PHY Interrupt 2.85V HSIC Interface A14 HSIC_DATA I/O High-speed inter-chip interface - data 1.2V A16 HSIC_STB I/O High-speed inter-chip interface - strobe 1.2V I2C Interface C14 I2C_SCL I/O I2C clock 1.8V Internally PU 2.2kΩ to 1.8V D13 I2C_SDA I/O I2C Data 1.8V Internally PU 2.2kΩ to 1.8V Power Supply AP17 VBATT - Main Power Supply (Digital Section) Power AP19 VBATT - Main Power Supply (Digital Section) Power AR18 VBATT - Main Power Supply (Digital Section) Power AR20 VBATT - Main Power Supply (Digital Section) Power AS17 VBATT_PA - Main Power Supply (RF Section) Power AS19 VBATT_PA - Main Power Supply (RF Section) Power AT18 VBATT_PA - Main Power Supply (RF Section) Power
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 34 of 120 PAD Signal I/O Function Type Comment AU17 VBATT_PA - Main Power Supply (RF Section) Power AU19 VBATT_PA - Main Power Supply (RF Section) Power AT20 VBATT_PA - Main Power Supply (RF Section) Power A0 GND - Ground N0 GND Ground R0 GND - Ground T0 GND - Ground V0 GND - Ground X0 GND - Ground AA0 GND - Ground AC0 GND - Ground AE0 GND - Ground AG0 GND - Ground AJ0 GND - Ground AL0 GND - Ground AN0 GND - Ground AR0 GND - Ground AV0 GND - Ground ZZ1 GND - Ground F1 GND - Ground M1 GND - Ground P1 GND - Ground U1 GND - Ground
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 35 of 120 PAD Signal I/O Function Type Comment W1 GND - Ground Y1 GND - Ground AB1 GND - Ground AF1 GND - Ground AH1 GND - Ground AK1 GND - Ground AU1 GND - Ground N2 GND - Ground R2 GND - Ground T2 GND - Ground X2 GND - Ground AA2 GND - Ground AC2 GND - Ground AE2 GND - Ground AG2 GND - Ground AJ2 GND - Ground AL2 GND - Ground AN2 GND - Ground AR2 GND - Ground D3 GND - Ground P3 GND - Ground AP3 GND - Ground C4 GND - Ground
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 36 of 120 PAD Signal I/O Function Type Comment AR4 GND - Ground AT4 GND - Ground AP5 GND - Ground AS5 GND - Ground AU5 GND - Ground A6 GND - Ground C6 GND - Ground AR6 GND - Ground AT6 GND - Ground D7 GND - Ground AP7 GND - Ground AS7 GND - Ground AU7 GND - Ground T8 GND - Ground V8 GND - Ground X8 GND - Ground AA8 GND - Ground AR8 GND - Ground AT8 GND - Ground AV8 GND - Ground U9 GND - Ground W9 GND - Ground Y9 GND - Ground
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 37 of 120 PAD Signal I/O Function Type Comment AP9 GND - Ground AS9 GND - Ground T10 GND - Ground V10 GND - Ground X10 GND - Ground AA10 GND - Ground AR10 GND - Ground AT10 GND - Ground AV10 GND - Ground U11 GND - Ground W11 GND - Ground Y11 GND - Ground AP11 GND - Ground AS11 GND - Ground AU11 GND - Ground A12 GND - Ground T12 GND - Ground V12 GND - Ground X12 GND - Ground AA12 GND - Ground AR12 GND - Ground AT12 GND - Ground AV12 GND - Ground
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 38 of 120 PAD Signal I/O Function Type Comment B13 GND - Ground AP13 GND - Ground AS13 GND - Ground AR14 GND - Ground AT14 GND - Ground AV14 GND - Ground B15 GND - Ground AP15 GND - Ground AS15 GND - Ground AU15 GND - Ground AN16 GND - Ground AR16 GND - Ground AT16 GND - Ground AV16 GND - Ground B17 GND - Ground AK17 GND - Ground AM17 GND - Ground E18 GND - Ground G18 GND - Ground T18 GND - Ground V18 GND - Ground X18 GND - Ground AL18 GND - Ground
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 39 of 120 PAD Signal I/O Function Type Comment AN18 GND - Ground AV18 GND - Ground ZZ19 GND - Ground H19 GND - Ground Y19 GND - Ground AM19 GND - Ground A20 GND - Ground L20 GND - Ground N20 GND - Ground AV20 GND - Ground Reserved C0 Reserved - Reserved E0 Reserved - Reserved G0 Reserved - Reserved J0 Reserved - Reserved L0 Reserved - Reserved AT0 Reserved - Reserved K1 Reserved - Reserved AM1 Reserved - Reserved G2 Reserved - Reserved J2 Reserved - Reserved L2 Reserved - Reserved AV2 Reserved - Reserved
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 40 of 120 PAD Signal I/O Function Type Comment ZZ3 Reserved - Reserved F3 Reserved - Reserved H3 Reserved - Reserved K3 Reserved - Reserved M3 Reserved - Reserved S3 Reserved - Reserved U3 Reserved - Reserved E4 Reserved - Reserved G4 Reserved - Reserved J4 Reserved - Reserved L4 Reserved - Reserved N4 Reserved - Reserved R4 Reserved - Reserved T4 Reserved - Reserved V4 Reserved - Reserved AG4 Reserved - Reserved AJ4 Reserved - Reserved AL4 Reserved - Reserved AV4 Reserved - Reserved ZZ5 Reserved - Reserved F5 Reserved - Reserved AM5 Reserved - Reserved AN6 Reserved - Reserved
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 41 of 120 PAD Signal I/O Function Type Comment AV6 Reserved - Reserved ZZ7 Reserved - Reserved AM7 Reserved - Reserved AP1 Reserved - Reserved for RESET_N in case that backward compatibility to LE920 is needed (instead of Pad AN8) Refer to Sec. 5.3.3,Unconditional Hardware Reset ZZ9 Reserved - Reserved AM9 Reserved - Reserved AM11 Reserved - Reserved AM13 Reserved - Reserved AU13 Reserved - Reserved AN14 Reserved - Reserved F15 Reserved - Reserved AM15 Reserved - Reserved G16 Reserved - Reserved J16 Reserved - Reserved L16 Reserved - Reserved N16 Reserved - Reserved R16 Reserved - Reserved T16 Reserved - Reserved V16 Reserved - Reserved X16 Reserved - Reserved AA16 Reserved - Reserved
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 42 of 120 PAD Signal I/O Function Type Comment AC16 Reserved - Reserved AE16 Reserved - Reserved AG16 Reserved - Reserved AJ16 Reserved - Reserved AL16 Reserved - Reserved F17 Reserved - Reserved H17 Reserved - Reserved K17 Reserved - Reserved M17 Reserved - Reserved C20 Reserved - Reserved E20 Reserved - Reserved G20 Reserved - Reserved J20 Reserved - Reserved R20 Reserved - Reserved T20 Reserved - Reserved V20 Reserved - Reserved X20 Reserved - Reserved AA20 Reserved - Reserved AC20 Reserved - Reserved AE20 Reserved - Reserved AG20 Reserved - Reserved AJ20 Reserved - Reserved AL20 Reserved - Reserved
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 43 of 120 PAD Signal I/O Function Type Comment AN20 Reserved - Reserved R18 Reserved - Reserved S19 Reserved - Reserved U19 Reserved - Reserved L18 Reserved - Reserved J18 Reserved - Reserved H1 Reserved - Reserved AE4 Reserved - Reserved AC4 Reserved - Reserved NOTE: GPIO_20 and WCI_RX are used as special HW flags during boot. If they are used as GPIOs, they must be connected via a 3-state buffer to avoid any undesirable effect during the boot. NOTE: When the UART signals are used as the communication port between the Host and the Modem, RTS must be connected to GND (on the module side) if flow control is not used. If the UART port is not used, UART signals can be left floating. NOTE: Unless otherwise specified, RESERVED pins must be left unconnected (Floating).
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 44 of 120 3.2. LE920A4 Signals That Must Be Connected Table 7 specifies the LE920A4 signals that must be connected even if not used by the end application: Table 7: Mandatory Signals PAD Signal Notes AP17, AP19, AR18, AR20, AS17, AS19, AT18, AU17, AU19, AT20 VBATT & VBATT_PA A0, N0, R0, T0, V0, X0, AA0, AC0, AE0, AG0, AJ0, AL0, AN0, AR0, AV0, ZZ1, F1, M1, P1, U1, W1, Y1, AB1, AF1, AH1, AK1, AU1, N2, R2, T2, X2, AA2, AC2, AE2, AG2, AJ2, AL2, AN2, AR2, D3, P3, AP3, C4, AR4, AT4, AP5, AS5, AU5, A6, C6, AR6, AT6, D7, AP7, AS7, AU7, T8, V8, X8, AA8, AR8, AT8, AV8, U9, W9, Y9, AP9, AS9, T10, V10, X10, AA10, AR10, AT10, AV10, U11, W11, Y11, AP11, AS11, AU11, A12, T12, V12, X12, AA12, AR12, AT12, AV12, B13, AP13, AS13, AR14, AT14, AV14, B15, AP15, AS15, AU15, AN16, AR16, AT16, AV16, B17, AK17, AM17, E18, G18, T18, V18, X18, AL18, AN18, AV18, ZZ19, H19, Y19, AM19, A20, L20, N20, AV20 GND AS1 ON/OFF Main power on off signal AN12 SHDN_N Emergency power off D19 USB_D+ If not used, connect to a test point or an USB connector F19 USB_D- If not used, connect to a test point or an USB connector A18 USB_VBUS If not used, connect to a test point or an USB connector AH19 C103/TXD If not used, connect to a test point AF19 C104/RXD If not used, connect to a test point
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 45 of 120 PAD Signal Notes AA18 C105/RTS If flow control is not used, connect to GND AK19 C106/CTS If not used, connect to a test point AB19 TX_AUX If not used, connect to a test point AD19 RX_AUX If not used, connect to a test point AD1 Antenna MAIN antenna AU9 ANT_DIV S1 ANT_GPS J2, L2, F3, H3, K3, E4, AN14 Reserved Connect to a test point for Telit internal use AN4 GPIO_20 If not used, connect to a test point AT2 WCI_RX If not used, connect to a test point
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 46 of 120 3.3. LGA Pads Layout Figure 2: LGA Pads Layout zz A B C D E F G H J K L M N P R S T U V W X Y AA AB AC AD AE AF AG AH AJ AK AL AM AN AP AR AS AT AUAV0GNDRESERVEDRESERVEDRESERVEDRESERVEDRFU GND GND GND GND GND GND GND GND GND GND GND GND GND RFU GND1GNDMIC2_MT-EAR2_MT-GNDTGPIO_21TGPIO_22GND GNDANT_GPSGND GND GND GND ANT 1 GND GND GND ANT 2RESERVEDON_OFF*GND2MIC1_MT-MIC2_MT+EAR2_MT+RESERVEDRESERVEDRESERVEDGND GND GNDGPS_LNA_ENGND GND GND GND GND GND GND GND GNDWCI_RXDRFU3RESERVEDMIC1_MT+GNDRESERVEDRESERVEDRESERVEDJTAG_TORIGINGNDRESERVEDRESERVEDGPS_PPSWiFi_SDRST_TGPIOWiFi_SDCMD_TGPIO14WiFi_SD0_TGPIO15WiFi_SD1_TGPIO16WiFi_SD2_TGPIO17WiFi_SD3_TGPIO18WiFi_SDCLK_TGPIO19GNDWCI_TXDSTAT_LED4EAR1_MT-GNDRESERVEDRESERVEDRESERVEDRFU RFU RFU RFU RFURFCLK2_QCAWLAN_SLEEP_CLKI2C_SDA_AUXI2C_SCL_AUXRESERVEDRESERVEDRESERVEDTGPIO_20GND GNDRFU5RESERVEDEAR1_MT+ADC_IN1RESERVEDRESERVEDGND GND GND6GND GNDADC_IN2MIC_BIASLED_DRVGND GNDRFU7RESERVEDSIMIN1 GNDADC_IN3RFU GND GND GND8SIMVCC1DVI_RXeSIMRSTETH_RST_NGND GND GND GNDRESET_NGND GND GND9RESERVEDSIMIO1DVI_TXTGPIO_01GND GND GNDRESERVEDGND GNDANT_DIV 110 SIMCLK1DVI_CLKTGPIO_02ETH_IN_NGND GND GND GNDSW_RDYGND GND GND11SGMII_RX_PSIMRST1DVI_WAOTGPIO_03GND GND GNDRESERVEDGND GND GND12 GNDREF_CLKTGPIO_04MAC_MDIOGND GND GND GND SHDN GND GND GND13SGMII_RX_MGNDI2CSDATGPIO_05RESERVEDGND GNDANT_DIV 214HSIC_DATAI2C_SCLTGPIO_06MAC_MDCJTAG_PS_HOLDGND GND GND15SGMII_TX_PGND SIMVCC2HW_KEYRESERVEDGND GND GND16HSIC_STBSIMCLK2 SIMIO2RESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDGND GND GND GND17SGMII_TX_MGNDSIMRST2VRTCRESERVEDRESERVEDLED_DRV_ENVAUX/PWRMONVMMCMMC_CDMMC_DAT3MMC_DAT0MMC_DAT2MMC_CLKMMC_DAT1MMC_CMDGND GND VBATTVBATT_PAVBATT_PA18USB_VBUSSIMIN2 GND GNDTGPIO_12TGPIO_11SPI_CS*TGPIO_07GND GND GNDC105/RTS*C108/DTR*C109/DCDC107/DSR*C125/RING*GND GND VBATTVBATT_PAGND19 GNDUSB_IDUSB_D+USB_D- GNDSPI_MOSISPI_MISOSPI_CLKTGPIO_08TGPIO_09TGPIO_10GNDTX_AUXRX_AUXC104/RXDC103/TXDC106/CTS*GND VBATTVBATT_PAVBATT_PA20 GNDRESERVEDRESERVEDRESERVEDRESERVEDGND GNDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRFU RFU VBATTVBATT_PAGNDNew xE920 (34 mm X 40 mm) Form Factor Pin MAP
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 47 of 120 3.4. Backward Compatibility to LE920 The LE920A4 is the successor of LE920 and is fully backward compatible to the previous LE920 in terms of:  Mechanical dimensions  Package and pin-map To support the extra features and additional interfaces, the LE920A4 introduces more pins compared to the LE920. The extra pins of the LE920A4 can be considered as optional if not needed and can be left unconnected (floating) if not used. In this case, the new LE920A4 can be safely mounted on existing carrier boards designed for the previous LE920. The additional pins of the LE920A4 are shown in Figure 3 (marked as Green) Figure 3: LE920A4 vs. LE920 Pin-out Comparison
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 48 of 120 4. Electrical Specifications 4.1. Absolute Maximum Ratings – Not Operational CAUTION: A deviation from the value ranges listed below may harm the LE920A4 module. Table 8: Absolute Maximum Ratings – Not Operational Symbol Parameter Min Max Unit VBATT Battery supply voltage on pin VBATT -0.5 +6.0 [V] VBATT TRANSIENT Transient voltage on pin VBATT (< 10 ms) -0.5 +7.0 [V] VBATT_PA Battery supply voltage on pin VBATT_PA -0.3 +6.0 [V] 4.2. Recommended Operating Conditions Table 9: Recommended Operating Conditions Symbol Parameter Min Typ Max Unit Tamb Ambient temperature -40 +25 +85 [°C] VBATT Battery supply voltage on pin VBATT 3.4 3.8 4.2 [V] VBATT_PA Battery supply voltage on pin VBATT_PA 3.4 3.8 4.2 [V] IBATT_PA + IBATT Peak current to be used to dimension decoupling capacitors on pin VBATT_PA - 80 2000 [mA]
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 49 of 120 4.3. Logic Level Specifications Unless otherwise specified, all the interface circuits of the LE920A4 are 1.8V CMOS logic. Only few specific interfaces (such as USIM and SD Card) are capable of dual voltage I/O. The following tables show the logic level specifications used in the LE920A4 interface circuits. The data specified in the tables below is valid throughout all drive strengths and the entire temperature ranges. CAUTION: Do not connect LE920A4’s digital logic signal directly to OEM’s digital logic signal with a level higher than 2.7V for 1.8V CMOS signals. 4.3.1. 1.8V Pads - Absolute Maximum Ratings Table 10: Absolute Maximum Ratings - Not Functional Parameter Min Max Input level on any digital pin when on -0.3V +2.16V Input voltage on analog pins when on -0.3V +2.16 V 4.3.2. 1.8V Standard GPIOs Table 11: Operating Range – Interface Levels (1.8V CMOS) Pad Parameter Min Max Unit Comment VIH Input high level 1.25V -- [V] VIL Input low level -- 0.6V [V] VOH Output high level 1.4V -- [V] VOL Output low level -- 0.45V [V] IIL Low-level input leakage current -1 -- [uA] No pull-up IIH High-level input leakage current -- +1 [uA] No pull-down RPU Pull-up resistance 30 390 [kΩ] See Note
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 50 of 120 Pad Parameter Min Max Unit Comment RPD Pull-down resistance 30 390 [kΩ] See Note Ci Input capacitance -- 5 [pF] NOTE: Pull-Up and Pull-Down resistance of GPIO5 is different than above mentioned GPIO5 pull resistance is specified as 10KΩ to 50KΩ 4.3.3. 1.8V SD Card Pads Table 12: Operating Range – SD Card Pads Working at 1.8V Pad Parameter Min Max Unit Comment VIH Input high level 1.27V 2V [V] VIL Input low level -0.3V 0.58V [V] VOH Output high level 1.4V -- [V] VOL Output low level 0 0.45V [V] IIL Low-level input leakage current -2 - [uA] No pull-up IIH High-level input leakage current - 2 [uA] No pull-down RPU Pull-up resistance 10 100 [kΩ] RPD Pull-down resistance 10 100 [kΩ] Ci Input capacitance 5 [pF] 4.3.4. 1.8V SIM Card Pads Table 13: Operating Range – SIM Pads Working at 1.8V Pad Parameter Min Max Unit Comment VIH Input high level 1.35V 2V [V] VIL Input low level -0.3V 0.43V [V]
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 51 of 120 Pad Parameter Min Max Unit Comment VOH Output high level 1.35V 1.875V [V] VOL Output low level 0V 0.4V [V] IIL Low-level input leakage current -2 - [uA] No pull-up IIH High-level input leakage current - 2 [uA] No pull-down RPU Pull-up resistance 10 100 [kΩ] RPD Pull-down resistance 10 100 [kΩ] Ci Input capacitance 5 [pF] 4.3.5. Dual Voltage Pads - Absolute Maximum Ratings Table 14: Absolute Maximum Ratings - Not Functional Parameter Min Max Input level on any digital pin when on -0.3V +3.6V Input voltage on analog pins when on -0.3V +3.6 V 4.3.6. SD Card Pads @ 2.95V Table 15: Operating Range – For SD Card Pads Operating at 2.95V Pad Parameter Min Max Unit Comments VIH Input high level 1.9V 3.1V [V] VIL Input low level -0.3V 0.7V [V] VOH Output high level 2.1V 3.05V [V] VOL Output low level 0V 0.4V [V] IIL Low-level input leakage current -10 [uA] No pull-up IIH High-level input leakage current 10 [uA] No pull-down
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 52 of 120 Pad Parameter Min Max Unit Comments RPU Pull-up resistance 10 100 [kΩ] RPD Pull-down resistance 10 100 [kΩ] Ci Input capacitance 5 [pF] 4.3.7. SIM Card Pads @2.95V Table 16: Operating Range – For SIM Pads Operating at 2.95V Pad Parameter Min Max Unit Comment VIH Input high level 2.1V 3.1V [V] VIL Input low level -0.3V 0.55V [V] VOH Output high level 2.25V 3.1V [V] VOL Output low level 0V 0.4V [V] IIL Low-level input leakage current -10 [uA] No pull-up IIH High-level input leakage current 10 [uA] No pull-down RPU Pull-up resistance 10 100 [kΩ] RPD Pull-down resistance 10 100 [kΩ] Ci Input capacitance 5 [pF]
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 53 of 120 5. Hardware Commands 5.1. Turning on the LE920A4 Module To turn on the LE920A4 module, the ON/OFF pad must be asserted low for at least 1 second and then released. The maximum current that can be drained from the ON/OFF pad is 0.1 mA. This pin is internally pulled up; customers should expect to see ~ 800 mV on the output. Figure 4 illustrates a simple circuit to power on the module using an inverted buffer output. Figure 4: Power-on Circuit 5.2. Initialization and Activation State After turning on the LE920A4 module, the LE920A4 is not yet activated because the SW initialization process of the LE920A4 module is still in process internally. It takes some time to fully complete the HW and SW initialization of the module. For this reason, it is impossible to access LE920A4 during the Initialization state. As shown in Figure 5, the LE920A4 becomes operational (in the Activation state) at least 20 seconds after the assertion of ON_OFF. NOTE: During the Initialization state, AT commands are not available. The DTE host must wait for the Activation state prior to communicating with the LE920A4.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 54 of 120 Figure 5: LE920A4 Initialization and Activation NOTE: To check if the LE920A4 has completely powered on, monitor the SW_RDY hardware line. When SW_RDY goes high, the module has completely powered on and is ready to accept AT commands. NOTE: During SW initialization of the LE920A4, the SW configures all pads and interfaces to their desired mode. When PWRMON goes high, this indicates that the initialization of all I/O pads is completed. NOTE: Do not use any pull-up resistor on the ON/OFF line as it is internally pulled up. Using a pull-up resistor may cause latch-up problems on the LE920A4 power regulator and improper powering on/off of the module. The ON/OFF line must be connected only in an open-collector configuration. NOTE: Active low signals are labeled with a name that ends with “_N” NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. 1 Sec < T_Hold < 2 SecVBATTON_OFFSW_RDYT_RDY < 20 SecV_AUXPWRMON18 Sec < T_PWRMON < 20 SecOFF State Initialization State Active StateOK to Send AT commandsAll interfaces and pins configured
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 55 of 120 5.3. Turning off the LE920A4 Module Turning off the device can be done in four different ways:  AT#SHDN software command  Hardware shutdown using ON/OFF pad  Hardware Unconditional Shutdown using the SHDN_N When the device is shut down by a software command or a hardware shutdown, it issues a detach request to the network, informing the network that the device will not be reachable any more. NOTE: To check if the device has powered off, monitor the PWRMON hardware line. When PWRMON goes low, this indicates that the device has powered off. NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. NOTE: Using the RESET_N for resetting the LE920A4 is not recommended 5.3.1. Shutdown by Software Command The LE920A4 module can be shut down by a software command. When a shutdown command is sent, LE920A4 goes into the Finalization state and at the end of the finalization process shuts down PWRMON. The duration of the finalization state can differ according to the current situation of the module, so a value cannot be defined. Usually, it will take more than 15 seconds from sending a shutdown command until reaching a complete shutdown. The DTE should monitor the status of PWRMON to observe the actual power-off. Figure 6: Shutdown by Software Command
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 56 of 120 NOTE: To check whether the device has powered off, monitor the PWRMON hardware line. When PWRMON goes low, the device has powered off. 5.3.2. Hardware Shutdown To turn off LE920A4 module, the ON/OFF pad must be asserted low for at least 2.5 seconds and then released. Use the same circuitry and timing for power-on. When the hold time of ON/OFF is above 2.5 seconds, LE920A4 goes into the Finalization state and in the end shuts down PWRMON. The duration of the Finalization state can differ according to the current situation of the module, so a value cannot be defined. Usually, it will take more than 15 seconds from sending a shutdown command until reaching a complete shutdown. DTE should monitor the status of PWRMON to observe the actual power-off. Figure 7: Hardware Shutdown via ON_OFF NOTE: To check whether the device has powered off, monitor the PWRMON hardware line. When PWRMON goes low, the device has powered off.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 57 of 120 5.3.3. Unconditional Hardware Reset To unconditionally restart the LE920A4 module, the RESET_N pad must be asserted low for a period of 500-2000 milliseconds and then released. Figure 8 shows a simple circuit for this action. Figure 8: Circuit for Unconditional Hardware Reset For keeping backward compatibility to LE920, it is recommended to prepare an alternate connection of the RESET_N pad also to Pad AP1 while keeping Pad AN8 as the default connection as is shown in Figure 9. Figure 9: Alternate Connection of RESET_N Pad LE920A4AP1AN8DNP0 OhmRESET# NOTE: In general, using RESET_N is not recommended. The Unconditional Hardware Reset must always be implemented on the boards, but the software must use it only as an emergency exit procedure, and not as a normal Reset operation. NOTE: Do not use any pull-up resistor on the RESET_N line or any totem pole digital output. Using a pull-up resistor may cause latch-up problems on the LE920A4 power regulator and improper functioning of the module. The RESET_N line must be connected only in an open-collector configuration. NOTE: Asserting tRESET low for period longer than 2000 milliseconds will cause the module to shut down.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 58 of 120 5.3.4. Unconditional Hardware Shutdown To unconditionally shut down the LE920A4 module, the SHDN_N pad must be tied low for at least 200 milliseconds and then released. A simple circuit for applying unconditional shutdown is shown below: Figure 10: Circuit for Unconditional Hardware Shutdown The system power down timing for using SHDN_N is shown below Figure 11 Power down timing using SHDN_N NOTE: Do not use any pull-up resistor on the SHDN_N line or any totem pole digital output. Using a pull-up resistor may cause latch-up problems on the LE920A4 power regulator and improper functioning of the module. The SHDN_N line must be connected only in an open-collector configuration. NOTE: The Unconditional Hardware Shutdown must always be implemented on the boards, but the software must use it only as an emergency exit procedure, and not as a normal power-off operation. 200mS Sec < T_Hold VBATTSHDN_NSW_RDYT_RDY ~0 SecV_AUXPWRMONT_PWRMON ~0 SecOFF StateActive State
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 59 of 120 6. Power Supply The power supply circuitry and board layout are very important parts of the full product design, with critical impact on the overall product performance. Read the following requirements and guidelines carefully to ensure a good and proper design. 6.1. Power Supply Requirements The LE920A4 power requirements are as follows: Table 17: Power Supply Requirements Nominal supply voltage 3.8V Supply voltage range 3.4V – 4.2V Maximum ripple on module input supply 30 mV Table 18 provides typical current consumption values of LE920A4 for various operation modes. Table 18: LE920A4 Current Consumption Mode Average [Typ.] Mode Description Switched Off Switched off 25 µA Module is powered but switched off (RTC is on) IDLE Mode (Standby Mode; No Call in Progress) AT+CFUN=4 1.0 mA Tx and Rx are disabled; module is not registered on the network (Flight mode) DRX GSM 2.0 mA DRx2 1.4 mA DRx5 WCDMA 1.4 mA DRx7 1.2 mA DRx8 LTE 1.8 mA Paging cycle #128 frames (1.28 sec DRx cycle) 1.4 mA Paging cycle #256 frames (2.56 sec DRx cycle)
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 60 of 120 Mode Average [Typ.] Mode Description Operative Mode (LTE) LTE (0 dBm) 190 mA LTE CAT 4 channel BW 20 MHz, RB=1, Tx = 0 dBm (Test case: BAND 1, Channel 300) LTE (22 dBm) 500 mA LTE CAT 4 channel BW 20 MHz, RB=1, Tx = 22 dBm (Test case: BAND 1, Channel 300) Operative Mode (WCDMA) WCDMA Voice 200 mA WCDMA voice call (Tx = 10 dBm) WCDMA HSDPA (0 dBm) 150 mA WCDMA data call (Cat 14, Tx = 0 dBm, Max throughput) WCDMA HSDPA (22 dBm) 310 mA WCDMA data call (Cat 14, Tx = 22 dBm, Max throughput) Operative Mode (GSM) GSM Tx and Rx mode GSM900 PL5 250 mA GSM voice call DCS1800 PL0 170 mA GPRS 4 Tx + 1 Rx GSM900 PL5 430 mA GPRS Sending Data mode (CS-4) DCS1800 PL0 340 mA * Worst/best case current values depend on network configuration - not under module control. NOTE: The electrical design for the power supply must ensure a peak current output of at least 2A.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 61 of 120 NOTE: In GSM/GPRS mode, RF transmission is not continuous, but is packed into bursts at a base frequency of about 216 Hz with relative current peaks as high as about 2A. Therefore, the power supply must be designed to withstand these current peaks without big voltage drops. This means that both the electrical design and the board layout must be designed for this current flow. If the layout of the PCB is not well designed, a strong noise floor is generated on the ground. This will reflect on all the audio paths producing an audible annoying noise at 216 Hz. If the voltage drops during the peaks, current absorption is too high. The device may even shut down as a consequence of the supply voltage drop. 6.2. General Design Rules The principal guidelines for the Power Supply Design embrace three different design steps:  Electrical design  Thermal design  PCB layout 6.2.1. Electrical Design Guidelines The electrical design of the power supply depends strongly on the power source where this power is drained. Power sources can be distinguished by three categories:  +5V input (typically PC internal regulator output)  +12V input (typically automotive)  Battery 6.2.1.1. + 5V Input Source Power Supply – Design Guidelines  The desired output for the power supply is 3.8V. So, the difference between the input source and the desired output is not big, and therefore a linear regulator can be used. A switching power supply is preferred to reduce power consumption.  When using a linear regulator, a proper heat sink must be provided to dissipate the power generated.  A bypass low ESR capacitor of adequate capacity must be provided to cut the current absorption peaks close to the LE920A4 module. A 100 μF tantalum capacitor is usually suitable (on both VBATT and VBATT_PA together).  Make sure that the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V.  A protection diode must be inserted close to the power input to protect the LE920A4 module from power polarity inversion.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 62 of 120 Figure 12 shows an example of linear regulator with 5V input. Figure 12: Example of Linear Regulator with 5V Input 6.2.1.2. + 12V Input Source Power Supply – Design Guidelines  The desired output for the power supply is 3.8V. Due to the big difference between the input source and the desired output, a linear regulator is unsuitable and must not be used. A switching power supply is preferable because of its better efficiency, especially with the 2A peak current load which is expected during GSM Tx.  When using a switching regulator, a 500-kHz or higher switching frequency regulator is preferable because of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption.  In any case, the selection of the frequency and switching design is related to the application to be developed due to the fact that the switching frequency can also generate EMC interference.  For car batteries (lead-acid accumulators) the input voltage can rise up to 15.8V. This must be kept in mind when choosing components: all components in the power supply must withstand this voltage.  A bypass low ESR capacitor of adequate capacity must be provided to cut the current absorption peaks. A 100μF tantalum capacitor is usually suitable (on both VBATT and VBATT_PA together).  Make sure that the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V.  For automotive applications, a spike protection diode must be inserted close to the power input to clean the supply of spikes.  A protection diode must be inserted close to the power input to protect the LE920A4 module from power polarity inversion. This can be the same diode as for spike protection.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 63 of 120 Figure 13 and Figure 14 show an example of switching regulator with 12V input. Figure 13: Example of Switching Regulator with 12V Input – Part 1 Figure 14: Example of Switching Regulator with 12V Input – Part 2
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 64 of 120 6.2.1.3. Battery Source Power Supply – Design Guidelines  The desired nominal output for the power supply is 3.8V, and the maximum allowed voltage is 4.2V. Hence, a single 3.7V Li-Ion cell battery type is suitable for supplying the power to the LE920A4 module. CAUTION: Do not use any Ni-Cd, Ni-MH, and Pb battery types directly connected to the LE920A4 module. Their use can lead to overvoltage on the LE920A4 and damage it. Use only Li-Ion battery types.  A bypass low ESR capacitor of adequate capacity must be provided to cut the current absorption peaks; a 100μF tantalum capacitor is usually suitable (on both VBATT and VBATT_PA together).  Make sure that the low ESR capacitor (usually a tantalum one) is rated at least 10V.  A protection diode must be inserted close to the power input to protect the LE920A4 module from power polarity inversion. Otherwise, the battery connector must be done in a way to avoid polarity inversions when connecting the battery.  The battery capacity must be at least 900 mAh to withstand the current peaks of 2A.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 65 of 120 6.2.2. Thermal Design Guidelines The thermal design for the power supply heat sink must be done with the following specifications:  Average current consumption during RF transmission @PWR level max in LE920A4 as shown in Section 6.1, Table 18  Average current consumption during Class12 GPRS transmission @PWR level max as shown in Section 6.1, Table 18  Average GPS current during GPS ON (Power Saving disabled) : mA (TBD) NOTE: The average consumption during transmission depends on the power level at which the device is requested to transmit via the network. Therefore, the average current consumption varies significantly. NOTE: The thermal design for the power supply must be made keeping an average consumption at the maximum transmitting level during calls of LTE/HSPA/GPRS plus average consumption in GPS Tracking mode. Considering the very low current during Idle, especially if the Power Saving function is enabled, it is possible to consider from the thermal point of view that the device absorbs significant current only during an Active Call or Data session. For the heat generated by the LE920A4 module, consider it to be 2W max during transmission at Class12 GPRS upload. The generated heat is mostly conducted to the ground plane under the LE920A4 module. Ensure that your application can dissipate heat. In LTE/WCDMA/HSPA mode, the LE920A4 emits RF signals continuously during transmission. Therefore, you must pay special attention how to dissipate the heat generated. While designing the application board, the designer must make sure that the LE920A4 module is mounted on a large ground area of the application board, with many ground vias available beneath the module for effective heat dissipation. Even though peak current consumption in GSM mode is higher than in LTE/WCDMA/HSPA, considerations for heat sink are more important in the case of WCDMA due to the continuous transmission conditions.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 66 of 120 6.2.3. Power Supply PCB Layout Guidelines As seen in the electrical design guidelines, the power supply must have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct operation of the circuitry. A misplaced component can be useless or can even decrease the power supply performances.  The bypass low ESR capacitor must be placed close to the LE920A4 power input pads, or if the power supply is of a switching type, it can be placed close to the inductor to cut the ripple, as long as the PCB trace from the capacitor to LE920A4 is wide enough to ensure a drop-less connection even during the 2A current peaks.  The protection diode must be placed close to the input connector where the power source is drained.  The PCB traces from the input connector to the power regulator IC must be wide enough to ensure that no voltage drops occur during the 2A current peaks. Note that this is not done to save power loss but especially to avoid the voltage drops on the power line at the current peaks frequency of 216 Hz that will reflect on all the components connected to that supply (also introducing the noise floor at the burst base frequency.) For this reason while a voltage drop of 300-400 mV may be acceptable from the power loss point of view, the same voltage drop may not be acceptable from the noise point of view. If your application does not have an audio interface but only uses the data feature of the LE920A4, this noise is not so disturbing, and the power supply layout design can be more forgiving.  The PCB traces to LE920A4 and the bypass capacitor must be wide enough to ensure that no significant voltage drops occur when the 2A current peaks are absorbed. This is needed for the same above-mentioned reasons. Try to keep these traces as short as possible.  The PCB traces connecting the switching output to the inductor and the switching diode must be kept as short as possible by placing the inductor and the diode very close to the power switching IC (only for the switching power supply). This is done to reduce the radiated field (noise) at the switching frequency (usually 100-500 kHz).  Use a good common ground plane.  Place the power supply on the board in a way to guarantee that the high current return paths in the ground plane do not overlap any noise sensitive circuitry, such as the microphone amplifier/buffer or earphone amplifier.  The power supply input cables must be kept separate from noise sensitive lines, such as microphone/earphone cables.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 67 of 120 7. Antenna(s) Antenna connection and board layout design are the most important parts in the full product design, and they have a strong influence on the product’s overall performance. Read carefully and follow the requirements and guidelines for a good and proper design. 7.1. GSM/WCDMA/LTE Antenna Requirements The antenna for the LE920A4 device must meet the following requirements: Table 19: GSM / WCDMA/ LTE Antenna Requirements Frequency range The customer must use the most suitable antenna band width for covering the frequency bands provided by the network operator and also supported by the car OEM while using the Telit module. The bands supported by each variant of the LE920A4 module family are provided in Section 2.6.1, RF Bands per Regional Variant. Gain Gain < 3 dBi Impedance 50 Ohm Input power > 33 dBm(2 W) peak power in GSM > 24 dBm average power in WCDMA & LTE VSWR absolute max <= 10:1 VSWR recommended <= 2:1 Since there is no antenna connector on the LE920A4 module, the antenna must be connected to the LE920A4 antenna pad (AD1) by a transmission line implemented on the PCB. If the antenna is not directly connected to the antenna pad of the LE920A4, a PCB line is required to connect to it or to its connector. This transmission line must meet the following requirements: Table 20: Antenna Line on PCB Requirements Characteristic impedance 50 Ohm Max attenuation 0.3 dB Avoid coupling with other signals. Cold End (Ground Plane) of the antenna must be equipotential to the LE920A4 ground pads.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 68 of 120 Furthermore, if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC approval requirements. NOTE: This device is to be used only for mobile and fixed application. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-Users must be provided with transmitter operation conditions for satisfying RF exposure compliance. OEM integrators must ensure that the end user has no manual instructions to remove or install the LE920A4 module. Antennas used for this OEM module must not exceed 3dBi gain for mobile and fixed operating configurations. 7.2. GSM/WCDMA/LTE Antenna – PCB Line Guidelines  Make sure that the transmission line’s characteristic impedance is 50 Ohm.  Keep the line on the PCB as short as possible since the antenna line loss should be less than around 0.3 dB.  Line geometry should have uniform characteristics, constant cross sections, and avoid meanders and abrupt curves.  Any suitable geometry/structure can be used for implementing the printed transmission line affecting the antenna.  If a ground plane is required in the line geometry, this plane must be continuous and sufficiently extended so the geometry can be as similar as possible to the related canonical model.  Keep, if possible, at least one layer of the PCB used only for the ground plane. If possible, use this layer as reference ground plane for the transmission line.  Surround the PCB transmission line with ground (on both sides). Avoid having other signal tracks facing the antenna line track directly.  Avoid crossing any un-shielded transmission line footprint with other tracks on different layers.  The ground surrounding the antenna line on the PCB must be strictly connected to the main Ground plane by means of via-holes (once per 2 mm at least) placed close to the ground edges facing the line track.  Place EM-noisy devices as far as possible from LE920A4 antenna line.  Keep the antenna line far away from the LE920A4 power supply lines.  If EM-noisy devices are present on the PCB hosting the LE920A4, such as fast switching ICs, take care to shield them with a metal frame cover.  If EM-noisy devices are not present around the line, geometries like Micro strip or Grounded Coplanar Waveguide are preferred because they typically ensure less attenuation compared to a Strip line having the same length.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 69 of 120 7.3. GSM/WCDMA/LTE Antenna – Installation Guidelines  Install the antenna in a location with access to the network radio signal.  The antenna must be installed such that it provides a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.  The antenna must not be installed inside metal cases.  The antenna must be installed according to the antenna manufacturer’s instructions. 7.4. Antenna Diversity Requirements This product includes an input for a second Rx antenna to improve radio sensitivity. The function is called Antenna Diversity. Table 21: Antenna Diversity Requirements Frequency range The customer must use the most suitable antenna band width for covering the frequency bands provided by the network operator and also supported by the car OEM while using the Telit module. The bands supported by each variant of the LE920A4 module family are provided in Section 2.6.1, RF Bands per Regional Variant Impedance 50Ω VSWR recommended ≤ 2:1 Since there is no antenna connector on the LE920A4 module, the antenna must be connected to the LE920A4 antenna pad by means of a transmission line implemented on the PCB. If the antenna is not directly connected at the antenna pad of the LE920A4, a PCB line is required to connect to it or to its connector. The second Rx antenna must not be located in close vicinity of the main antenna. To improve diversity gain and isolation and to reduce mutual interaction, the two antennas should be located at the maximum reciprocal distance possible, taking into consideration the available space within the application. NOTE: If Rx Diversity is not used/connected, disable the Diversity functionality using the AT#RXDIV command (refer to the AT User guide) and leave the Diversity pad AU9 unconnected.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 70 of 120 7.5. GNSS Antenna Requirements LE920A4 supports an active antenna. It is recommended to use antennas as follow:  An external active antenna (GPS only)  An external active antenna plus GNSS pre-filter NOTE: The external GNSS pre-filter is required for the GLONASS application. The GNSS pre-filter must meet the following requirements:  Source and load impedance = 50 Ohm  Insertion loss (1575.42–1576.42 MHz) = 1.4 dB (Max)  Insertion loss (1565.42–1585.42 MHz) = 2.0 dB (Max)  Insertion loss (1597.5515–1605.886 MHz) = 2.0 dB (Max) NOTE: It is recommended to add a DC block to the customer’s GPS application to prevent damage to the LE920A4 module due to unwanted DC voltage. 7.5.1. Combined GNSS Antenna The use of a combined RF/GNSS antenna is NOT recommended. This solution can generate an extremely poor GNSS reception. In addition, the combination of antennas requires an additional diplexer, which adds significant power loss in the RF path. 7.5.2. Linear and Patch GNSS Antenna Using this type of antenna introduces at least 3 dB of loss compared to a circularly polarized (CP) antenna. Having a spherical gain response instead of a hemispherical gain response can aggravate the multipath behavior and create poor position accuracy. 7.5.3. Front End Design Considerations Since there is no antenna connector on the LE920A4 module, the antenna must be connected to the LE920A4 through the PCB to the antenna pad. If the antenna is not directly connected at the antenna pad of the LE920A4, a PCB line is required. This line of transmission must meet the following requirements:
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 71 of 120 Table 22: Antenna Line on PCB Requirements Characteristic impedance 50 Ohm Max attenuation 0.3 dB Avoid coupling with other signals. Cold End (Ground Plane) of the antenna must be equipotential to the LE920A4 ground pads. Furthermore, if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC requirements. This device is to be used only for mobile and fixed application. 7.5.4. GNSS Antenna – PCB Line Guidelines  Ensure that the antenna line impedance is 50 Ohm.  Keep the line on the PCB as short as possible to reduce the loss.  The antenna line must have uniform characteristics, constant cross section, avoiding meanders and abrupt curves.  Keep one layer of the PCB used only for the Ground plane; if possible.  Surround (on the sides, over and under) the antenna line on the PCB with Ground. Avoid having other signal tracks directly facing the antenna line track.  The Ground around the antenna line on the PCB must be strictly connected to the main Ground plane by placing vias at least once per 2mm.  Place EM-noisy devices as far as possible from LE920A4 antenna line.  Keep the antenna line far away from the LE920A4 power supply lines.  If EM-noisy devices are around the PCB hosting the LE920A4, such as fast switching ICs, ensure shielding the antenna line by burying it inside the layers of PCB and surrounding it with Ground planes; or shield it with a metal frame cover.  If you do not have EM-noisy devices around the PCB of LE920A4, use a Micro strip line on the surface copper layer for the antenna line. The line attenuation will be lower than a buried one. 7.5.5. GNSS Antenna – Installation Guidelines  The LE920A4, due to its sensitivity characteristics, is capable of performing a fix inside buildings. (In any case, the sensitivity could be affected by the building characteristics i.e. shielding.)  The antenna must not be co-located or operating in conjunction with any other antenna or transmitter.  The antenna must not be installed inside metal cases.  The antenna must be installed according to the antenna manufacturer’s instructions.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 72 of 120 8. Hardware Interfaces Table 23 summarizes all the hardware interfaces of the LE920A4 module. Table 23: LE920A4 Hardware Interfaces Interface LE920A4 SGMII For Ethernet PHY support Ethernet Control For controlling an external Ethernet PHY HSIC x1 SDIO x2 (for SD/MMC card and for WLAN) USB USB2.0, OTG support SPI Master only, up to 50 MHz I2C For sensors, audio control UART 2 HS-UART (up to 4 Mbps) Audio I/F I2S/PCM, Analog I/O GPIO 8 ~ 23 (8 dedicated + 15 multiplexed with other signals) USIM x2, dual voltage each (1.8V/2.85V) ADC Up to x3 Antenna ports 2 for Cellular, 1 for GNSS
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 73 of 120 8.1. USB Port The LE920A4 module includes a Universal Serial Bus (USB) transceiver, which operates at USB high-speed (480 Mbits/sec). It can also operate with USB full-speed hosts (12 Mbits/sec). It is compliant with the USB 2.0 specification and can be used for control and data transfers as well as for diagnostic monitoring and firmware update. The USB port is typically the main interface between the LE920A4 module and OEM hardware. NOTE: The USB_D+ and USB_D- signals have a clock rate of 480 MHz. The signal traces must be routed carefully. Minimize trace lengths, number of vias, and capacitive loading. The impedance value should be as close as possible to 90 Ohms differential. Table 24 lists the USB interface signals. Table 24: USB Interface Signals Signal LE920A4 Pad No. Usage USB_VBUS A18 Power and cable detection for the internal USB transceiver. Acceptable input voltage range 2.5V – 5.5V @ max 5 mA consumption USB_D- F19 Minus (-) line of the differential, bi-directional USB signal to/from the peripheral device USB_D+ D19 Plus (+) line of the differential, bi-directional USB signal to/from the peripheral device USB_ID B19 USB ID signal for supporting USB2.0 OTG (see note below) NOTE: USB_VBUS input power is internally used to detect the USB port and start the enumeration process. It is not used for supplying power to the internal LE920A4 USB HW block. Therefore, only a maximum of 5 mA is required. NOTE: Even if USB communication is not used, it is still highly recommended to place an optional USB connector on the application board. At least test points of the USB signals are required since the USB physical communication is needed in the case of SW update. NOTE: For supporting USB OTG an additional 5V power supply should be added externally
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 74 of 120 8.2. HSIC Interface The application processor exposes a High-Speed Inter-Chip (HSIC). HSIC eliminates the analog transceiver from a USB interface for lower voltage operation and reduced power dissipation. The HSIC interface is compliant with Ref 10: High-Speed Inter-Chip USB Electrical Specification, version 1.0 (a supplement to the USB 2.0 specification, Section 3.8.2), and supports the following:  High-speed 480 Mbps (240 MHz DDR) USB transfers are 100% host driver compatible with traditional USB cable connected topologies  Bidirectional data strobe signal (STROBE)  Bidirectional data signal (DATA)  No power consumption unless a transfer is in progress Further details will be provided in a future release of this document. 8.3. Ethernet Connectivity (optional) Ethernet connectivity can be optionally added to LE920A4 by adding an external PHY PHY connectivity uses SGMII interface for Data and few additional signals for PHY control 8.3.1. SGMII Interface The LE920A4 includes an integrated Ethernet MAC with an SGMII interface, having the following key features:  The SGMII interface can be used connect to an external Ethernet PHY, or an external switch.  When enabled, an additional network interface will be available to the Linux kernel’s router. 8.3.2. Ethernet Control interface When using an external PHY for Ethernet connectivity, the LE920A4 also includes the control interface for managing this external PHY The table below lists the signals for controlling the external PHY Table 25: Ethernet Control Interface Signals PAD Signal I/O Function Type COMMENT G14 MAC_MDC O MAC to PHY Clock 2.85V G12 MAC_MDIO I/O MAC to PHY Data 2.85V G8 ETH_RST_N O Reset to Ethernet PHY 2.85V G10 ETH_INT_N I Interrupt from Ethernet PHY 2.85V
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 75 of 120 NOTE: The Ethernet control interface is internally (inside SoC) shared with USIM2 port! When Ethernet PHY is used, USIM2 port cannot be used (and vice versa). 8.4. Serial Ports The serial port is typically a secondary interface between the LE920A4 module and OEM hardware. Two serial ports are available on the module: MODEM SERIAL PORT 1(Main)MODEM SERIAL PORT 2 (Auxiliary)Several configurations can be designed for the serial port on the OEM hardware. The most common are: RS232 PC com portMicrocontroller UART @ 1.8V (Universal Asynchronous Receive Transmit)Microcontroller UART @ 3.3V/5V or other voltages different from 1.8VDepending on the type of serial port on the OEM hardware, a level translator circuit may be needed to make the system operate. The only configuration that does not need level translation is the 1.8V UART. The levels for LE920A4 UART are the CMOS levels as described in Section 4.3, Logic Level Specifications. 8.4.1. Modem Serial Port 1 Signals Serial Port 1 on LE920A4 is a +1.8V UART with 7 RS232 signals. It differs from the PC-RS232 in signal polarity (RS232 is reversed) and levels. Table 26 lists the signals of LE920A4 Serial Port 1. Table 26: Modem Serial Port 1 Signals RS232 Pin No. Signal LE920A4 Pad No. Name Usage 1 DCD - DCD_UART AE18 Data Carrier Detect Output from the LE920A4 that indicates carrier presence 2 RXD - TX_UART AF19 Transmit line *see NoteOutput transmit line of the LE920A4 UART 3 TXD -RX_UART AH19 Receive line *see NoteInput receive line of the LE920A4 UART
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 76 of 120 RS232 Pin No. Signal LE920A4 Pad No. Name Usage 4 DTR - DTR_UART AC18 Data Terminal Ready Input to LE920A4 that controls the DTE READY condition 5 GND A6, A12, B13, B15… Ground Ground 6 DSR - DSR_UART AG18 Data Set Ready Output from the LE920A4 that indicates that the module is ready 7 RTS - RTS_UART AA18 Request to Send Input to LE920A4 controlling the Hardware flow control 8 CTS - CTS_UART AK19 Clear to Send Output from LE920A4 controlling the Hardware flow control 9 RI - RI_UART AJ18 Ring Indicator Output from LE920A4 indicating the Incoming call condition NOTE: DCD, DTR, DSR, RI signals that are not used for UART functions can be configured as GPIO using AT commands. NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. NOTE: For minimum implementations, only the TXD and RXD lines needs be connected. The other lines can be left open provided a software flow control is implemented. NOTE: According to V.24, Rx/Tx signal names refer to the application side; therefore, on the LE920A4 side, these signal are in the opposite direction: TXD on the application side will be connected to the receive line (here named TXD/ RX_UART) of the LE920A4 serial port and vice versa for Rx. 8.4.2. Modem Serial Port 2 Serial Port 2 on the LE920A4 is a +1.8V UART with Rx and Tx signals only. Table 27 lists the signals of LE920A4 Serial Port 2.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 77 of 120 Table 27: Modem Serial Port 2 Signals PAD Signal I/O Function Type COMMENT AB19 TX_AUX O Auxiliary UART (Tx Data to DTE) 1.8V AD19 RX_AUX I Auxiliary UART (Rx Data to DTE) 1.8V NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. NOTE: The Auxiliary UART is used as the SW main debug console. It is required to place test points on this interface even if not used. 8.4.3. RS232 Level Translation To interface the LE920A4 with a PC com port or a RS232 (EIA/TIA-232) application, a level translator is required. This level translator must:  Invert the electrical signal in both directions  Change the level from 0/1.8V to +15/-15V The RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level translator. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required. The simplest way to translate the levels and invert the signal is by using a single chip-level translator. There are a multitude of them, differing in the number of drivers and receivers and in the levels (be sure to get a true RS232 level translator, not a RS485 or other standards). By convention, the driver is the level translator from the 0-1.8V UART to the RS232 level. The receiver is the translator from the RS232 level to 0-1.8V UART. To translate the whole set of control lines of the UART, the following is required:  2 drivers  2 receivers NOTE: The digital input lines operating at 1.8V CMOS have an absolute maximum input voltage of 2.7V. Therefore, the level translator IC must not be powered by the +3.8V supply of the module. Instead, it must be powered from a dedicated +1.8V power supply.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 78 of 120 Figure 15: RS232 Level Adaption Circuitry Example NOTE: In this case, the length of the lines on the application must be taken into account to avoid problems in the case of High-speed rates on RS232. For example, RS232 level adaption circuitry could use a MAXIM transceiver (MAX218). This chip as shown in Figure 15, is capable of translating directly from 1.8V to the RS232 levels (Example on 4 signals only). The RS232 serial port lines are usually connected to a DB9 connector as shown in Figure 16. Signal names and directions are named and defined from the DTE point of view. Figure 16: RS232 Serial Port Lines Connection Layout 8.5. Peripheral Ports In addition to the LE920A4 serial ports, the LE920A4 supports the following peripheral ports:  SPI – Serial Peripheral Interface  I2C - Inter-integrated circuit  SD/MMC Card Interface  SDIO Interface
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 79 of 120 8.5.1. SPI – Serial Peripheral Interface The LE920A4 SPI supports the following: Master Mode only1.8V CMOS levelUp to 50 MHz clock rateNOTE: SPI is supported on Linux side only. Master mode only is supported, no Slave mode configuration. Table 28: SPI Signals PAD Signal I/O Function Type Comment P19 SPI_CLK O SPI clock output 1.8V M19 SPI_MISO I SPI data Master input Slave output 1.8V K19 SPI_MOSI O SPI data Master output Slave input 1.8V N18 SPI_CS O SPI chip-select output 1.8V Figure 17: SPI Signal Connectivity 8.5.2. I2C - Inter-integrated Circuit The LE920A4 supports an I2C interface on the following pins: C14 - I2C_SCLD13 - I2C_SDAThe I2C interface is used for controlling peripherals inside the module (such as codec, etc.). The I2C can also be used externally by the end customer application. However, to avoid conflicts, the following addresses must not be used externally by the customer: Address 0x30 (8 bit, write), 0x31 (8 bit, read)LE920A4 (Master) SPI_CS SPI_CLK SPI_MOSI SPI_MISO Host (Slave) SPI_CS SPI_CLK SPI_MOSI SPI_MISO
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 80 of 120  Address 0x90 (8 bit, write), 0x91 (8 bit, read) In addition, SW emulated I2C functionality can be used on GPIO 1-6 pins. Any GPIO (among GPIO 1-6) can be configured as SCL or SDA. LE920A4 supports I2C Master mode only. NOTE: SW emulated I2C on GPIO lines is supported only from the Modem side. For more information, refer to the LE920A4 AT SW manual for command settings.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 81 of 120 8.5.3. SD/MMC Card Interface The LE920A4 provides an SD port supporting the SD3.0 specification, which can be used to support standard SD/MMC memory cards with the following features:  Interface with SD/MMC memory cards up to 2 Tera Byte  Max clock @ 2.95V - 50 MHz SDR o Max Data: 25 MByte/s o SD standard: HS-SDR25 at 2.95V  Max clock @ 1.8V - 200 MHz SDR o Max Data: 100 MByte/s o SD standard: UHS-SDR104 at 1.8 V  Max clock @ 1.8V - 50 MHz DDR o Max Data: 50 MByte/s o SD standard: UHS-DDR50 at 1.8 V Table 29 lists the LE920A4 SD card signals. Table 29: SD Card Signals PAD Signal I/O Function Type Comments AH17 SD/MMC_CMD O SD command 1.8/2.95V AD17 SD/MMC_CLK O SD card clock 1.8/2.95V Y17 SD/MMC_DATA0 I/O SD Serial Data 0 1.8/2.95V AF17 SD/MMC_DATA1 I/O SD Serial Data 1 1.8/2.95V AB17 SD/MMC_DATA2 I/O SD Serial Data 2 1.8/2.95V W17 SD/MMC_DATA3 I/O SD Serial Data 3 1.8/2.95V U17 SD/MMC_CD I SD card detect input 1.8V Active Low S17 VMMC - Power supply for MMC card pull-up resistors 1.8/2.95V Max Current is 50mA
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 82 of 120 Figure 18 shows the recommended connection diagram of the SD interface. Figure 18: SD Interface Connectivity NOTE: SD/MMC is supported only on the Linux side. The VMMC supply is limited to 50mA max and can be used only to supply the MMC card external pull-up resistors. Pull-up resistors must be placed on the host application board. The card detection input has an internal pull-up resistor. NOTE: The power supply to the SD/MMC card VCC is to be provided by the Host application board. The LE920A4 does not provide a dedicated power supply for the SD/MMC card. VMMC can be used for enabling of the external power supply (LDO Enable signal) SD/MMC_DATA2 SD/MMC_DATA3 SD/MMC_CMD SD/MMC_CLK SD/MMC_DATA0 SD/MMC_DATA1 LE920A4 SDIO Interface SD/MMC_CD DATA2 DATA3 CMD VDD VSS DATA0 DATA1 MicroSD MMC_CD GND GND 10K 10K 10K 10K 10K C=100nF GND External PS 3V VMMC
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 83 of 120 8.5.4. WiFi SDIO Interface The LE920A4 provides an SDIO port supporting the SDIO3.0 specification, which can be used to interface with a WiFi chipset (a Qualcomm QCA65x4 chipset or other WiFi solutions - TBD) The LE920A4 module includes an integrated SW driver for supporting the Qualcomm QCA65x4 chipset. The SDIO port supports the SDIO 3.0 specification at 1.8V CMOS only, thus cannot be used as an external SD/MMC card connection. The LE920A4 module supports an LTE/WiFi coexistence mechanism via the WCI (Wireless Coexistence Interface) port, which connects between the module and the external WiFi IC. For a detailed explanation, refer to 0. Table 30: WiFi SDIO Interface Pad Signal I/O Function Type Comments AB3 WIFI_SD_CMD O WiFi SD Command 1.8V AM3 WIFI_SD_CLK O WiFi SD Clock 1.8V 200 MHz max. AD3 WIFI_SD_DATA0 I/O WiFi SD Serial Data 0 1.8V AF3 WIFI_SD_DATA1 I/O WiFi SD Serial Data 1 1.8V AH3 WIFI_SD_DATA2 I/O WiFi SD Serial Data 2 1.8V AK3 WIFI_SD_DATA3 I/O WiFi SD Serial Data 3 1.8V Y3 WIFI_SDRST O WiFi Reset / Power enable control 1.8V Active Low AS3 WCI_TX O Wireless coexistence interface TXD 1.8V AT2 WCI_RX I Wireless coexistence interface RXD 1.8V NOTE: It is recommended that WIFI_RST_CTR be equipped with a pull-up resistor to 1.8V on the host application to disable WiFi reset function if needed.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 84 of 120 8.6. Audio Interface The LE920A4 module supports analog and digital audio interfaces. 8.6.1. Analog Audio The LE920A4 module provides a single analog audio path for transmitting and receiving on the following pins: Table 31: Analog Audio Signals PAD Signal I/O Function Type Comments B5 EAR1_MT+ AO Earphone signal output1, phase + Analog A4 EAR1_MT- AO Earphone signal output1, phase - Analog B3 MIC1_MT+ AI Mic signal input1, phase + Analog A2 MIC1_MT- AI Mic signal input1, phase - Analog G6 MICBIAS AO Mic bias Analog E2 EAR2_MT+ AO Earphone signal output2, phase + Analog D1 EAR2_MT- AO Earphone signal output2, phase - Analog C2 MIC2_MT+ AI Mic signal input2, phase + Analog B1 MIC2_MT- AI Mic signal input2, phase - Analog For more details, refer to Ref 5: xE920 Audio Settings Application Note. WARNING: The LE920A4 Analog audio implementation uses an internal CODEC (inside the module). The internal codec uses the same signals as the external LE920A4 Digital audio interface. Therefore, applications that use analog audio (that is, the codec inside the module) must make sure that the digital audio interface is either not connected, or set to Hi-Z, or set to ‘input’ at the Host application.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 85 of 120 8.6.2. Digital Audio The LE920A4 module can be connected to an external codec through the digital interface. The product provides a single Digital Audio Interface (DVI) on the following pins: Table 32: Digital Audio Interface (DVI) Signals PAD Signal I/O Function Type COMMENT D11 DVI_WA0 O Digital Audio Interface (WA0) B-PD 1.8V PCM_SYNC/I2S WS C8 DVI_RX I Digital Audio Interface (RX) B-PD 1.8V PCM_DIN/I2S_DATA_IN D9 DVI_TX O Digital Audio Interface (TX) B-PD 1.8V PCM_DOUT/I2S_DATA_OUT C10 DVI_CLK O Digital Audio Interface (CLK) B-PD 1.8V PCM_CLK/I2S_CLK C12 REF_CLK O Codec Reference Clock B-PD 1.8V I2S_MCLK LE920A4 DVI has the following characteristics:  PCM Master mode using short or long frame sync modes  16 bit linear PCM format  PCM clock rates of 256 kHz, 512 kHz, 1024 kHz and 2048 kHz (Default)  Frame size of 8, 16, 32, 64, 128 & 256 bits per frame  Sample rates of 8 kHz and 16 kHz In addition to the DVI port, the LE920A4 module provides a master clock signal (REF_CLK on Pin C12) which can either provide a reference clock to an external codec or form an I2S interface together with the DVI port where the REF_CLK acts as the I2S_MCLK. The REF_CLK default frequency is 12.288 MHz. When using the DVI with REF_CLK as an I2S interface, 12.288 MHz is 256 x fs (where fs = 48 kHz).
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 86 of 120 8.6.2.1. Short Frame Timing Diagrams Figure 19: Primary PCM Timing
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 87 of 120 Table 33: PCM_CODEC Timing Parameters
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 88 of 120 8.6.2.2. Long Frame Timing Diagrams Figure 20: Auxiliary PCM Timing
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 89 of 120 Table 34: AUX_PCM_CODEC Timing Parameters
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 90 of 120 8.7. General Purpose I/O The general-purpose I/O pads can be configured to act in three different ways:  Input  Output  Alternate function (internally controlled) Input pads can only be read and report digital values (high or low) present on the pad at the read time. Output pads can only be written or queried and set the value of the pad output. An alternate function pad is internally controlled by LE920A4 firmware and acts depending on the implemented function. The following GPIOs are always available as a primary function on the LE920A4. Table 35: Primary GPIOs PAD Signal I/O Function Type Drive Strength F9 GPIO_01 I/O Configurable GPIO CMOS 1.8V 2-16 mA E10 GPIO_02 I/O Configurable GPIO CMOS 1.8V 2-16 mA F11 GPIO_03 I/O Configurable GPIO CMOS 1.8V 2-16 mA E12 GPIO_04 I/O Configurable GPIO CMOS 1.8V 2-16 mA F13 GPIO_05 I/O Configurable GPIO CMOS 1.8V 2-16 mA E14 GPIO_06 I/O Configurable GPIO CMOS 1.8V 2-16 mA W19 GPIO_10 I/O Configurable GPIO CMOS 1.8V 2-16 mA AN4 GPIO_20 I/O Configurable GPIO CMOS 1.8V 2-16 mA
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 91 of 120 The additional GPIOs below can be used if their initial functionality is not used. Table 36: Additional GPIOs PAD Signal I/O Initial Function Alternate Function Type Drive Strength Y3 GPIO_13 I/O WIFI_SDRST Configurable GPIO CMOS 1.8V 2-16 mA AB3 GPIO_14 I/O WIFI_SDIO_CMD Configurable GPIO CMOS 1.8V 2-16 mA AD3 GPIO_15 I/O WIFI_SDIO_D0 Configurable GPIO CMOS 1.8V 2-16 mA AF3 GPIO_16 I/O WIFI_SDIO_D1 Configurable GPIO CMOS 1.8V 2-16 mA AH3 GPIO_17 I/O WIFI_SDIO_D2 Configurable GPIO CMOS 1.8V 2-16 mA AK3 GPIO_18 I/O WIFI_SDIO_D3 Configurable GPIO CMOS 1.8V 2-16 mA AM3 GPIO_19 I/O WIFI_SDIO_CLK Configurable GPIO CMOS 1.8V 2-16 mA AJ18 GPIO_31 I/O UART_RI Configurable GPIO CMOS 1.8V 2-16 mA AG18 GPIO_32 I/O UART_DSR Configurable GPIO CMOS 1.8V 2-16 mA AE18 GPIO_33 I/O UART_DCD Configurable GPIO CMOS 1.8V 2-16 mA AC18 GPIO_34 I/O UART_DTR Configurable GPIO CMOS 1.8V 2-16 mA P19 GPIO_35 I/O SPI_CLK Configurable GPIO CMOS 1.8V 2-16 mA M19 GPIO_36 I/O SPI_MISO Configurable GPIO CMOS 1.8V 2-16 mA K19 GPIO_37 I/O SPI_MOSI Configurable GPIO CMOS 1.8V 2-16 mA N18 GPIO_38 I/O SPI_CS Configurable GPIO CMOS 1.8V 2-16 mA NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. NOTE: LE920A4 GPIOs can serve as alternate I2C. Refer to Section 8.5.2, I2C - Inter-integrated Circuit.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 92 of 120 8.7.1. Using a GPIO Pad as Input GPIO pads, when used as inputs, can be tied to a digital output of another device and report its status, provided the device interface levels are compatible with the GPIO 1.8V CMOS levels. If a digital output of a device is tied to GPIO input, the pad has interface levels different than 1.8V CMOS. It can be buffered with an open collector transistor with a 47 kΩ pull-up resistor to 1.8V. 8.7.2. Using a GPIO Pad as an interrupt GPIO pads which are used as input can also be used as an interrupt source for the software. In general all GPIO pads can be also used as interrupts. However, not all GPIO’s can be used as a wakeup source of the module (wakeup from sleep) Only the following GPIO’s can be used for waking up the system from sleep  GPIO1  GPIO4  GPIO5 8.7.3. Using a GPIO Pad as Output GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs, the pads have a push-pull output, and therefore the pull-up resistor can be omitted. Figure 21: GPIO Output Pad Equivalent Circuit
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 93 of 120 9. Miscellaneous Functions9.1. Indication of Network Service AvailabilityThe STAT_LED pin status shows information on the network service availability and call status. In the LE920A4 modules, the STAT_LED usually needs an external transistor to drive an external LED. The table below shows the device status corresponding to the pin status: Table 37: Network Service Availability Indication LED Status Device Status Permanently off Device off Fast blinking (Period 1s, Ton 0,5s) Net search / Not registered / Turning off Slow blinking (Period 3s, Ton 0,3s) Registered full service Permanently on A call is active Figure 22: Status LED Reference Circuit
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 94 of 120 9.2. RTC – Real Time Clock The RTC within the LE920A4 module does not have a dedicated RTC supply pin. The RTC block is supplied by the VBATT supply. If the battery is removed, RTC is not maintained so if maintaining an internal RTC is needed, VBATT must be supplied continuously. In Power OFF mode, the average current consumption is ~25 uA. 9.3. VAUX Power Output A regulated power supply output is provided to supply small devices from the module. This output is active when the module is ON and goes OFF when the module is shut down. The operating range characteristics of the supply are as follows: Table 38: Operating Range – VAUX Power Supply Min Typical Max Output voltage 1.75V 1.80V 1.85V Output current 100 mA Output bypass capacitor (inside the module) 1 μF 9.4. ADC Converter 9.4.1. Description The LE920A4 module provides three 8-bit Analog to Digital converters. Each ADC reads the voltage level applied on the relevant pin, converts it, and stores it into an 8-bit word. Table 39 shows the ADC characteristics. Table 39: ADC Parameters Min Max Units Input voltage range 0.1 1.7 Volt AD conversion - 8 bits Resolution - < 6.6 mV
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 95 of 120 9.4.2. Using the ADC Converter An AT command is available to use the ADC function. The command is AT#ADC=1,2. The read value is expressed in mV. Refer to Ref 1: LE920A4 AT Command User Guide for the full description of this function. 9.5. Using the Temperature Monitor Function The Temperature Monitor permits to control the module’s internal temperature and, if properly set (see the #TEMPMON command in Ref 1: LE920A4 AT Command User Guide), raises a GPIO to High Logic level when the maximum temperature is reached. 9.6. Fuel Gauge (optional) The LE920A4 module can optionally support an external Fuel Gauge solution. In this case, an external IC that is capable of measuring the current flow in and out of the module must be added on the carrier board. Figure 23 shows an example of a typical connectivity of such an external fuel gauge to the LE920A4 module. Detailed design - TBD Figure 23: Fuel Gauge Connectivity Example Telit ModuleVBATT_INI2CGPIO (Wake up)I2CAlert OutSENSE- SENSE+HOST Power Supply 50mohm RsenseHigh side current sensing
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 96 of 120 9.7. GNSS Characteristics The table below specifies the GNSS characteristics and expected performance The values are related to typical environment and conditions. Table 40: GNSS Characteristics Parameters Typical Measurement Notes Sensitivity Standalone or MS Based Tracking Sensitivity -162.3 dBm Acquisition -162.3 dBm Cold Start Sensitivity -157.5 dBm TTFF Hot 1.1s GPS+GLONASS Simulator test Warm 22.1s GPS+GLONASS Simulator test Cold 29.94s GPS+GLONASS Simulator test Accuracy 0.8 m GPS+GLONASS Simulator test Min Navigation update rate 1Hz Dynamics 2g Operation Limits 515 m/sec A-GPS Supported
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 97 of 120 10. Mounting the Module on your Board10.1. General The LE920A4 module was designed to be compliant with a standard lead-free SMT process. 10.2. Finishing & Dimensions Figure 24 shows the mechanical dimensions of the LE920A4 module. Figure 24: LE920A4 Mechanical Dimensions
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 98 of 120 10.3. Recommended Footprint for the Application Figure 25 shows the recommended footprint for the application board (dimensions are in mm). To facilitate replacing the LE920A4 module if necessary, it is suggested to design the application with a 1.5 mm placement inhibit area around the module. It is also suggested, as a common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module. NOTE: In the customer application, the 5 crowns marked as INHIBIT in Figure 25 must be clear of any signal wiring or ground polygons. The 5 crown pads should not exist on the customer application board Figure 25: Recommended Footprint (Top View)
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 99 of 120 10.4. Stencil Stencil’s apertures layout can be the same as the recommended footprint (1:1). The suggested thickness of stencil foil is greater than 120 µm. 10.5. PCB Pad Design The solder pads on the PCB are recommended to be of the Non Solder Mask Defined (NSMD) type. Figure 26: PCB Pad Design
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 100 of 120 10.6. Recommendations for PCB Pad Dimensions (mm) Figure 27: PCB Pad Dimensions It is not recommended to place around the pads a via or micro-via that is not covered by solder resist in an area of 0.15 mm unless it carries the same signal as the pad itself. Micro via inside the pads are allowed. Holes in pad are allowed only for blind holes and not for through holes. Table 41: Recommendations for PCB Pad Surfaces Finish Layer Thickness (um) Properties Electro-less Ni / Immersion Au 3-7 / 0.05-0.15Good solder ability protection, high shear force values The PCB must be able to resist the higher temperatures, which occur during the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 101 of 120 10.7. Solder Paste We recommend using only “no clean” solder paste to avoid the cleaning of the modules after assembly. 10.7.1. Solder Reflow Figure 28 shows the recommended solder reflow profile. Figure 28: Solder Reflow Profile
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 102 of 120 Table 42: Solder Profile Characteristics Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max Preheat –Temperature min (Tsmin)–Temperature max (Tsmax)–Time (min to max) (ts)150°C 200°C 60-180 seconds Tsmax to TL –Ramp-up rate3°C/second max Time maintained above: –Temperature (TL)–Time (tL)217°C 60-150 seconds Peak temperature (Tp) 245 +0/-5°C Time within 5°C of actual peak Temperature (tp) 10-30 seconds Ramp-down rate 6°C/second max Time 25°C to peak temperature 8 minutes max NOTE: All temperatures refer to topside of the package, measured on the package body surface. WARNING: The LE920A4 module withstands one reflow process only.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 103 of 120 11. Application Guide11.1. Debug of the LE920A4 Module in ProductionTo test and debug the mounting of the LE920A4 module, we strongly recommend to add several test pads on the host PCB for the following purposes: Checking the connection between the LE920A4 itself and the applicationTesting the performance of the module by connecting it with an external computerDepending on the customer application, these test pads include, but are not limited to the following signals: TXDRXDON/OFFSHDN_NRESET_NGNDVBATTTX_AUXRX_AUXUSB_VBUSUSB_D+USB_D-GPIO20WCI_RXIn addition, the following signals are also recommended (but not mandatory): PWRMONSTAT_LEDSW_RDY
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 104 of 120 11.2. Bypass Capacitor on Power Supplies When a sudden voltage step is asserted to or a cut from the power supplies, the steep transition causes some reactions such as overshoot and undershoot. This abrupt voltage transition can affect the device causing it to not operate or to malfunction. Bypass capacitors are needed to alleviate this behavior. The behavior can appear differently depending on the various applications. Customers must pay special attention to this issue when they design their application board. The length and width of the power lines must be considered carefully, and the capacitance of the capacitors must be selected accordingly. The capacitor will also prevent ripple of the power supplies and the switching noise caused in TDMA systems such as GSM. Especially, a suitable bypass capacitor must be mounted on the following lines on the application board: VBATT & VBATT_PA (Pads AP17,AP19,AR18,AR20,AS17,AS19,AT18,AU17,AU19,AT20)USB_VBUS (Pad A18)Recommended values are: 100uF for both VBATT and VBATT_PA together4.7uF for USB_VBUS (including the 1uF capacitor inside the module)Customers must still consider that the capacitance mainly depends on the conditions of their application board. Generally, more capacitance is required when the power line is longer.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 105 of 120 11.3. SIM Interface This section presents the recommended schematics for the design of SIM interfaces on the application boards. The LE920A4 supports two external SIM interfaces. 11.3.1. SIM Schematic Example Figure 29 illustrates in particular how the application side should be designed, and what values the components should have. Figure 29: SIM Schematics NOTE: The resistor value on SIMIO pulled up to SIMVCC must be defined to be compliant with the 3GPP specification for USIM electrical testing. The LE920A4 module contains an internal pull-up resistor of 20K Ω on SIMIO. However, the un-mounted option in the application design can be recommended to tune R1 if necessary. Table 43 lists the values of C1 to be adopted with the LE920A4 product: Table 43: SIM Interface – C1 Range Product P/N C1 Range (nF) LE920A4 100 nF Refer to the following document for details:  Ref 7: SIM Integration Design Guide Application Note Rev10
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 106 of 120 11.4. EMC Recommendations All LE920A4 signals are provided with some EMC protection. Nevertheless, the accepted level differs according to the specific pin. Table 44 lists the characteristics. Table 44: EMC Recommendations Pad Signal I/O Function Contact Air All Pins All ± TBD ± TBD Antenna AD1,AU9,S1 Antenna pads Analog I/O Antenna pad ± TBD ± TBD Appropriate series resistors must be considered to protect the input lines from overvoltage. 11.5. Download and Debug Port Chose one of the following options in the design of the host system to download or upgrade the Telit software and debug the LE920A4 module when it is already mounted on a host system.  UART and USB interfaces Users who use both UART and USB interfaces to communicate with LE920A4 must implement a USB download method in the host system to upgrade the LE920A4 when it is mounted.  USB interface only Users who use a USB interface only to communicate with the LE920A4 module must arrange for a USB port in the host system to debug or upgrade the LE920A4 when it is mounted.  UART interface only Users who use a UART interface only to communicate with the LE920A4 module must arrange for a UART port in the host system to debug or upgrade the LE920A4 when it is mounted. 11.5.1. Fast Boot Mode Fast Boot mode is normally used by Telit software to enter SW Download mode. Fast Boot mode is triggered by GPIO20 (PAD AN4). Asserting this signal high (1.8V) during boot will force the system into Fast Boot mode. 11.5.2. Recovery Boot Mode An Emergency Boot Download mode is used if a corrupted boot image was flashed into the device or if all other recovery modes failed. Emergency Boot Download mode is triggered by the WCI_RX signal (PAD AT2). Asserting this signal high (1.8V) during boot will force the system into Emergency Boot Download mode.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 107 of 120 NOTE: The application board must support accessible test pads on the GPIO20 and WCI_RX signals to enable the download recovery modes mentioned above. 11.6. Antenna Detection The LE920A4 module provides an antenna detection application, indicating for each of the cellular and GNSS antennas whether it is shorted to ground or open. Refer to Ref 9: Antenna Detection Application Note.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 108 of 120 12. Packing System12.1. TrayThe LE920A4 module is packed on trays. The tray is JEDEC compliant, injection molded antistatic Modified Polyphenylene ether (MPPO). It has good thermal characteristics and can withstand the standard baking temperature of up to 125°C, thereby avoiding the need of handling the modules if baking is required. The trays are rigid, thus providing more mechanical protection against transport stress. In addition, they are re-usable and so environmentally sustainable. There are 2 (two) antistatic rubber bands that enclose each envelope. The carton box is rigid, thus offering mechanical protection. The carton box has one flap across the entire top surface. It is sealed with tape along the edges of the box. Table 45: Tray Packing Modules per Tray Trays per Envelope Modules per Envelope Envelopes per Carton Box Modules per Box 24 5+ 1 empty 120 4 480 Table 46: Tray Packing Quantities Order Type Quantity Minimum Order Quantity (MOQ) 120 Standard Packing Quantity (SPQ) 480
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 109 of 120 Each tray contains 24 modules as shown in Figure 30. Figure 30: Tray Packing
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 110 of 120 Figure 31: Tray Drawing
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 111 of 120 12.2. Tape & Reel The LE920A4 can be packed on tape & reels of 200 pieces each. Figure 32: Module Positioning into the Carrier Figure 33: Carrier Tape Detail
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 112 of 120 Figure 34: Reel Detail Figure 35: Reel Box Detail 12.3. Moisture Sensitivity The LE920A4 module is a Moisture Sensitive Device Level 3, in accordance with standard IPC/JEDEC J-STD-020. Observe all of the requirements for using this kind of component.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 113 of 120 13. Safety Recommendations READ CAREFULLY Be sure that the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and must be avoided in the following areas:  Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc.  Where there is risk of explosion, such as gasoline stations, oil refineries, etc. It is the responsibility of the user to enforce the country regulations and the specific environment regulations. Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for correct wiring of the product. The product must be supplied with a stabilized voltage source and the wiring conform to the security and fire prevention regulations. The product must be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. The same caution must be taken for the SIM, checking carefully the instructions for its use. Do not insert or remove the SIM when the product is in power saving mode. The system integrator is responsible for the functioning of the final product; therefore, care must be taken of the external components of the module, as well as of any project or installation issue, because of the risk of disturbing the GSM network or external devices or having any impact on safety. Should there be any doubt, refer to the technical documentation and the regulations in force. Every module must be equipped with a proper antenna with the specified characteristics. The antenna must be installed with care to avoid any interference with other electronic devices and must be installed with the guarantee of a minimum 20 cm distance from a human body. If this requirement cannot be satisfied, the system integrator must assess the final product against the SAR regulation. The European Community provides some Directives for electronic equipment introduced on the market. All the relevant information is available on the European Community website: http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm The text of the Directive 99/05 regarding telecommunication equipment is available, while the applicable Directives (Low Voltage and EMC) are available at: http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 114 of 120 14. Conformity assessment issues14.1. FCC/ISED Regulatory noticesModification statement Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur. Interference statement (if it is not placed in the device) This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Wireless notice This device complies with FCC/ISED radiation exposure limits set forth for an uncontrolled environment and meets the FCC radio frequency (RF) Exposure Guidelines and RSS‐102 of the ISED radio frequency (RF) Exposure rules. Antenna gain must be below: Frequency Band Freq [MHz] Gain [dBi] 850 MHz 850 0.63 1900 MHz 1900 2.511700 MHz 1700 5.002500 MHz 2500 8.01 700 MHz 700 5.63
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 115 of 120 This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Le présent appareil est conforme à l'exposition aux radiations FCC / ISED définies pour un environnement non contrôlé et répond aux directives d'exposition de la fréquence de la FCC radiofréquence (RF) et RSS‐102 de la fréquence radio (RF) ISED règles d'exposition. Gain de l'antenne doit être ci-dessous: L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur. FCC Class B digital device notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna.-Increase the separation between the equipment and receiver.-Connect the equipment into an outlet on a circuit different from that to which the receiveris connected.-Consult the dealer or an experienced radio/TV technician for help.LE920A4 NA Contains FCC ID: RI7LE920A4NA Contains IC: 5131A-LE920A4NA Frequency Band Freq [MHz] Gain [dBi] 850 MHz 850 0.63 1900 MHz 1900 2.511700 MHz 1700 5.002500 MHz 2500 8.01 700 MHz 700 5.63
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 116 of 120 CAN ICES-3 (B) / NMB-3 (B) This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 117 of 120 15. Document History Table 47: Document Revision History Revision Date Changes 3.31 2017-02-16 Adding Section 14: FCC/ISED Regulatory notices Changing Document History section from 14 to 15 3.3 2017-01-03 Remove “Preliminary” label Section 1.5: Updated “Related Documents” table Section 2.3: Added more info on memory supported options Section 3.1: Added PHY control interface Section 3.3: Updated LGA “PinMap” Drawing Section 5.3.3: Added clarification about RESET_N usage Section 5.3.4: Added Figure for SHDN_N power down timing Section 8.1: Added info related to USB OTG Section 8.3: Added info related to PHY control interface Section 8.5.3: Added clarification about VMMC Section 8.6.2: Added clarification about I2S support Section 9.2: Added clarification about RTC Section 9.7: Added GNSS characteristics Section 10.2: Updated mechanical drawing Section 10.3: Updated application footprint drawing 3.2 2016-12-16 Updated Applicability table 3.1 2016-11-27 Section 4.3.2 : Added note regarding pull resistance of special GPIO’s. Section 8.7.2 : Added info regarding wakeup from GPIO’s. Section 10.3 : Updated application board footprint drawing Section 1.5 : Updated link to WIFI application note
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 118 of 120 Revision Date Changes 3.0 2016-09-01 Official Release; Merged and updated the Applicability table (p.2) based on previous Section 1.6 Section 1.5 : Updated the table of related documents Section 2.6.1 : Updated the table of RF bands Section 3.1 : Few updates in the table of pin-out Section 6.1 : Added voltage ripple requirement Section 6.1: Table 18 : Added current consumption values Section 9.1: Updated description Section 9.2: Updated the RTC consumption Section 9.4.1: Updated description Section 11.5: Added sub-sections 11.5.1 and 11.5.2 Section 12: Updated table Section 12.2 : Added information about Tape & Reel packing General editing and formatting
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 119 of 120 Revision Date Changes 2.7 2016-06-15 Official Release; Sec. 2.5.1: Storage temp. is 105 deg.C max. Sec. 3.1 : Updates about pads E8, AN8 Previous Sec. 4.2 (Limiting Values) – Removed New Sec. 4.2 : Updated min. supply voltage levels Sec 4.3 : Updated Logic Level Specification Sec 5.3.3: Updated Reset connection (added future support) Sec 5.2: Updated “Initialization and Activation state” Sec. 5.3.3 : Added recommendation and diagram for future compatibility Sec. 8 : All hardware interfaces are gathered under this section A summary table of the module interfaces is presented Updated number of available GPIO’s inside the summary table Sec. 8.6.2 : Updated the Digital Audio specifications Sec. 9.4.1 : Updated the ADC range of input level Sec. 10.3 : Updated the “Recommended footprint” figure (was previously mistaken) Added “PRELIMINARY” on top of each page 2.2 2016-04-12 Official Release; Moved RoHS paragraph from 2.8.3 to 2.5.1 Sections 4.3 & 6.1: VBAT min is 3.4V (not 3.3V) Added Sec. 15.5 (now 9.5): Temperature Monitor Function
LE920A4 Auto Hardware User Guide 1VV0301261 Rev. 3.31 - 2017-02-16 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 120 of 120 Revision Date Changes 2.0 2016-03-23 Official Release; General update – Added Datasheet related sections Added Sec. 1.6: Product Variants Added Sec. 2.2: Applications Added Sec. 2.3: General Functionality Added Sec. 2.4: Block Diagram Modified Sec. 2.6: Frequency Bands Added Sec. 3: Functional Description Changed ESD values to TBD (until tested) Added Sec. 5: Backward compatibility to LE920 Modified Sec. 7.5 : GNSS Antenna Requirements Added Sec. 15.6 (now 9.6): Fuel Gauge Added Sec. 17.6 (now 11.6): Antenna Detection 1.0 2016-02-14 Official Release; Section 2.5.1: Channels corrected for WCDMA B4. Section 2.5.1: LTE B17 replaced by LTE B12 Section 2.5.2: Added table for LE920A4 -EU Section 2.6: Sensitivity typical values updated Section 7.1: Main antenna requirements updated Section 7.4: Diversity antenna requirements updated 0.5 2015-12-20 First Draft

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