Telit Communications S p A ME910C1NV ME910C1-NV LTE Module CAT M User Manual Users guide
Telit Communications S.p.A. ME910C1-NV LTE Module CAT M Users guide
Users guide
[04.2016]
Mod. 0805 2016-08 Rev.5
ME910C1
HW User Guide
1VV03001351 Rev. 2 – 2017-07-19
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SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE
NOTICE
While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products
described herein and reserves the right to revise this document and to make changes from
time to time in content hereof with no obligation to notify any person of revisions or changes.
Telit does not assume any liability arising out of the application or use of any product,
software, or circuit described herein; neither does it convey license under its patent rights
or the rights of others.
It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in
your country. Such references or information must not be construed to mean that Telit
intends to announce such Telit products, programming, or services in your country.
COPYRIGHTS
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit, as arises by operation of law in the sale
of a product.
COMPUTER SOFTWARE COPYRIGHTS
The Telit and 3rd Party supplied Software (SW) products described in this instruction
manual may include copyrighted Telit and other 3rd Party supplied computer programs
stored in semiconductor memories or other media. Laws in the Italy and other countries
preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted
computer programs, including the exclusive right to copy or reproduce in any form the
copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party
supplied SW computer programs contained in the Telit products described in this instruction
manual may not be copied (reverse engineered) or reproduced in any manner without the
express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase
of Telit products shall not be deemed to grant either directly or by implication, estoppel, or
otherwise, any license under the copyrights, patents or patent applications of Telit or other
3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that
arises by operation of law in the sale of a product.
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USAGE AND DISCLOSURE RESTRICTIONS
I. License Agreements
The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.
II. Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, without prior written permission of Telit
III. High Risk Materials
Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the
operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air
Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its
supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High
Risk Activities.
IV. Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.
V. Third Party Rights
The software may include Third Party Right software. In this case you agree to comply with
all terms and conditions imposed on you in respect of such separate software. In addition
to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this
License shall apply to the Third Party Right software.
TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED
FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY
MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM
WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE
USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE,
INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY
QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.
NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR
ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL
DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED
AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY,
ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE
OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS
LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
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APPLICABILITY TABLE (REMOVE UNUSED)
PRODUCTS
ME910C1-NA
ME910C1-NV
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Contents
NOTICE 2
COPYRIGHTS ................................................................................................ 2
COMPUTER SOFTWARE COPYRIGHTS ...................................................... 2
USAGE AND DISCLOSURE RESTRICTIONS ............................................... 3
I. License Agreements ..................................................................... 3
II. Copyrighted Materials ................................................................... 3
III. High Risk Materials ....................................................................... 3
IV. Trademarks .................................................................................. 3
V. Third Party Rights ......................................................................... 3
APPLICABILITY TABLE (REMOVE UNUSED) ............................................. 4
CONTENTS .................................................................................................... 5
1. INTRODUCTION .......................................................................... 8
Scope ........................................................................................... 8
Audience....................................................................................... 8
Contact Information, Support ........................................................ 8
Text Conventions .......................................................................... 9
Related Documents ...................................................................... 9
2. OVERVIEW ................................................................................ 10
3. PINS ALLOCATION ................................................................... 12
Pin-out ........................................................................................ 12
LGA Pads Layout ........................................................................ 20
4. POWER SUPPLY ....................................................................... 21
Power Supply Requirements ....................................................... 21
Power Consumption* .................................................................. 23
General Design Rules ................................................................. 24
4.3.1. Electrical Design Guidelines ....................................................... 24
4.3.1.1. +5V Source Power Supply Design Guidelines ............................ 24
4.3.1.2. +12V Source Power Supply Design Guidelines .......................... 25
4.3.1.3. Battery Source Power Supply Design Guidelines ........................ 26
4.3.2. Thermal Design Guidelines ......................................................... 27
4.3.3. Power Supply PCB layout Guidelines ......................................... 27
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VAUX Power Output ................................................................... 29
5. DIGITAL SECTION .................................................................... 30
Logic Levels ................................................................................ 30
Power On.................................................................................... 30
Power Off.................................................................................... 36
Unconditional Shutdown ............................................................. 38
Fast power down ........................................................................ 41
5.5.1. Fast Shut Down by Hardware ..................................................... 41
5.5.2. Fast Shut Down by Software....................................................... 43
Communication ports .................................................................. 44
5.6.1. USB 2.0 HS ................................................................................ 44
5.6.2. SPI.............................................................................................. 45
5.6.2.1. SPI Connections ......................................................................... 45
5.6.2.2. Modem serial port 1 (USIF0) ....................................................... 46
5.6.2.3. Modem serial port 2 (USIF1) ....................................................... 48
5.6.2.4. RS232 level translation ............................................................... 48
General purpose I/O ................................................................... 49
5.7.1. Using a GPIO as INPUT ............................................................. 50
5.7.2. Using a GPIO as OUTPUT ......................................................... 51
5.7.3. Indication of network service availability ..................................... 51
External SIM Holder .................................................................... 53
ADC Converter ........................................................................... 53
6. RF SECTION .............................................................................. 54
Bands Variants ........................................................................... 54
TX Output power ......................................................................... 54
RX Sensitivity ............................................................................. 54
Antenna requirements................................................................. 54
6.4.1. PCB Design guidelines ............................................................... 56
6.4.2. PCB Guidelines in case of FCC Certification .............................. 58
6.4.2.1. Transmission line design ............................................................ 58
6.4.2.2. Transmission Line Measurements .............................................. 59
6.4.2.3. Antenna Installation Guidelines ................................................... 61
7. AUDIO SECTION ....................................................................... 62
Electrical Characteristics ............................................................. 62
Codec examples ......................................................................... 62
8. MECHANICAL DESIGN ............................................................. 63
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Drawing ...................................................................................... 63
9. APPLICATION PCB DESIGN .................................................... 64
Footprint ..................................................................................... 64
PCB pad design .......................................................................... 65
PCB pad dimensions .................................................................. 66
Stencil ......................................................................................... 67
Solder paste ............................................................................... 67
Solder Reflow ............................................................................. 68
10. PACKAGING .............................................................................. 70
Tray ............................................................................................ 70
Reel ............................................................................................ 71
Carrier Tape detail ...................................................................... 72
Reel detail ................................................................................... 73
Packaging detail ......................................................................... 74
Moisture sensitivity ..................................................................... 74
11. CONFORMITY ASSESSMENT ISSUES .................................... 75
FCC/ISED Regulatory notices ..................................................... 75
12. SAFETY RECOMMENDATIONS................................................ 78
READ CAREFULLY .................................................................... 78
13. ACRONYMS ............................................................................... 79
14. DOCUMENT HISTORY .............................................................. 80
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1. INTRODUCTION
Scope
Scope of this document is to give a description of some hardware solutions useful for
developing a product with the Telit ME910C1 module.
Audience
This document is intended for Telit customers, who are integrators, about to implement
their applications using our ME910C1 modules.
Contact Information, Support
For general contact, technical support services, technical questions and report
documentation errors contact Telit Technical Support at:
TS-EMEA@telit.com
TS-AMERICAS@telit.com
TS-APAC@telit.com
TS-SRD@telit.com
Alternatively, use:
http://www.telit.com/support
For detailed information about where you can buy the Telit modules or for recommendations
on accessories and components visit:
http://www.telit.com
Our aim is to make this guide as helpful as possible. Keep us informed of your comments
and suggestions for improvements.
Telit appreciates feedback from the users of our information.
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Text Conventions
Danger – This information MUST be followed or catastrophic
equipment failure or bodily injury may occur.
Caution or Warning – Alerts the user to important points about
integrating the module, if these points are not followed, the module and
end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be
useful when integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
Related Documents
Telit_xE910_Global_Form_Factor_Application_Note_r13
Telit_Modem_Integration_Design_Guide_r0
SIM Holder Design Guides, 80000NT10001a
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ME910C1
2. OVERVIEW
The aim of this document is the description of some hardware solutions useful for
developing a product with the Telit ME910C1 module. In this document all the basic
functions of a m2m module will be taken into account; for each one of them a proper
hardware solution will be suggested and eventually the wrong solutions and common errors
to be avoided will be evidenced. Obviously this document cannot embrace the whole
hardware solutions and products that may be designed. The wrong solutions to be avoided
shall be considered as mandatory, while the suggested hardware configurations shall not
be considered mandatory, instead the information given shall be used as a guide and a
starting point for properly developing your product with the Telit ME910C1 module. For
further hardware details that may not be explained in this document refer to the Telit
ME910C1 Product Description document where all the hardware information is reported.
NOTE:
(EN) The integration of the ME910C1 cellular module within user
application shall be done according to the design rules described in
this manual.
(IT) L’integrazione del modulo cellulare ME910C1 all’interno
dell’applicazione dell’utente dovrà rispettare le indicazioni progettuali
descritte in questo manuale.
(DE) Die Integration des ME910C1 Mobilfunk-Moduls in ein Gerät
muß gemäß der in diesem Dokument beschriebenen
Kunstruktionsregeln erfolgen.
(SL) Integracija ME910C1 modula v uporabniški aplikaciji bo morala
upoštevati projektna navodila, opisana v tem priročniku.
(SP) La utilización del modulo ME910C1 debe ser conforme a los
usos para los cuales ha sido deseñado descritos en este manual del
usuario.
(FR) L’intégration du module cellulaire ME910C1 dans l’application
de l’utilisateur sera faite selon les règles de conception décrites dans
ce manuel.
(HE)
The information presented in this document is believed to be accurate and reliable.
However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor any
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infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent rights of Telit
Communications S.p.A. other than for circuitry embodied in Telit products. This document
is subject to change without notice.
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3. PINS ALLOCATION
Pin-out
Pin Signal I/O Function Type Comment
USB HS 2.0 COMMUNICATION PORT
B15 USB_D+ I/O USB differential Data (+)
C15 USB_D- I/O USB differential Data (-)
A13 VUSB I Power sense for the
internal USB transceiver.
Asynchronous Serial Port (USIF0) - Prog. / Data + HW Flow Control
N15 C103/TXD I Serial data input from DTE CMOS 1.8V
M15 C104/RXD O Serial data output to DTE CMOS 1.8V
M14 C108/DTR I Input for (DTR) from DTE CMOS 1.8V
L14 C105/RTS I Input for Request to send
signal (RTS) from DTE
CMOS 1.8V
P15 C106/CTS O Output for Clear to Send
signal (CTS) to DTE
CMOS 1.8V
N14 C109/DCD O Output for (DCD) to DTE CMOS 1.8V
P14 C107/DSR O Output for (DSR) to DTE CMOS 1.8V
R14 C125/RING O Output for Ring (RI) to
DTE
CMOS 1.8V
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SIM Card Interface
A6 SIMCLK O External SIM signal – Clock 1.8 / 3V
A7 SIMRST O External SIM signal – Reset 1.8 / 3V
A5 SIMIO I/O External SIM signal – Data
I/O 1.8 / 3V
A4 SIMIN I External SIM signal –
Presence (active low) CMOS 1.8 Internal
pullup (47K)
A3 SIMVCC - External SIM signal –
Power supply for the SIM 1.8 / 3V
Digital Voice Interface (DVI)
B9 DVI_WA0 I/
O
Digital Audio Interface
(WA0) 1.8V
B6 DVI_RX I Digital Audio Interface (RX) 1.8V
B7 DVI_TX I/
O Digital Audio Interface (TX) 1.8V
B8 DVI_CLK I/
O
Digital Audio Interface
(CLK) 1.8V
SPI
D15 SPI_MOSI I SPI MOSI CMOS 1.8V
E15 SPI_MISO O SPI_MISO CMOS 1.8V
F15 SPI_CLK I SPI Clock CMOS 1.8V
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DIGITAL IO
C8 GPIO_01 I/O GPIO_01 /STAT LED CMOS 1.8V
STAT LED
is alternate
function
C9 GPIO_02 I/O GPIO_02 CMOS 1.8V
C10 GPIO_03 I/O GPIO_03 CMOS 1.8V
C11 GPIO_04 I/O GPIO_04 CMOS 1.8V
B14 GPIO_05 I/O GPIO_05 CMOS 1.8V
C12 GPIO_06 I/O GPIO_06 CMOS 1.8V
C13 GPIO_07 I/O GPIO_07 CMOS 1.8V
K15 GPIO_08 I/O GPIO_08 CMOS 1.8V
L15 GPIO_09 I/O GPIO_09 CMOS 1.8V
G15 GPIO_10 I/O GPIO_10 CMOS 1.8V
RF SECTION
K1 ANTENNA I/O LTE Antenna
(50 ohm) RF
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GNSS Section
R9 ANT_GNSS I GNSS Antenna
(50 ohm) RF
R7 GNSS_LNA_ENA O External GNSS LNA
Enable CMOS 1.8V
Miscellaneous Functions
R13 HW_SHUTDOWN* I HW Unconditional
Shutdown 1.8V Active low
R12 ON_OFF* I Input command for power
ON 1.8V Active low
R11 VAUX/PWRMON O
Supply Output for external
accessories / Power ON
Monitor
1.8V
Power Supply
M1 VBATT - Main power supply
(Baseband) Power
M2 VBATT - Main power supply
(Baseband) Power
N1 VBATT_PA - Main power supply (Radio
PA) Power
N2 VBATT_PA - Main power supply (Radio
PA) Power
P1 VBATT_PA - Main power supply (Radio
PA) Power
P2 VBATT_PA - Main power supply (Radio
PA) Power
E1 GND - Ground Power
G1 GND - Ground Power
H1 GND - Ground Power
J1 GND - Ground Power
L1 GND - Ground Power
A2 GND - Ground Power
E2 GND - Ground Power
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F2 GND - Ground Power
G2 GND - Ground Power
H2 GND - Ground Power
J2 GND - Ground Power
K2 GND - Ground Power
L2 GND - Ground Power
R2 GND - Ground Power
M3 GND - Ground Power
N3 GND - Ground Power
P3 GND - Ground Power
R3 GND - Ground Power
D4 GND - Ground Power
M4 GND - Ground Power
N4 GND - Ground Power
P4 GND - Ground Power
R4 GND - Ground Power
N5 GND - Ground Power
P5 GND - Ground Power
R5 GND - Ground Power
N6 GND - Ground Power
P6 GND - Ground Power
R6 GND - Ground Power
P8 GND - Ground Power
R8 GND - Ground Power
P9 GND - Ground Power
P10 GND - Ground Power
R10 GND - Ground Power
M12 GND - Ground Power
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B13 GND - Ground Power
P13 GND - Ground Power
E14 GND - Ground Power
RESERVED
C1 RESERVED - RESERVED
D1 RESERVED - RESERVED
F1 RESERVED - RESERVED
B2 RESERVED - RESERVED
C2 RESERVED - RESERVED
D2 RESERVED - RESERVED
B3 RESERVED - RESERVED
C3 RESERVED - RESERVED
D3 RESERVED - RESERVED
E3 RESERVED - RESERVED
F3 RESERVED - RESERVED
G3 RESERVED - RESERVED
K3 RESERVED - RESERVED
L3 RESERVED - RESERVED
B4 RESERVED - RESERVED
C4 RESERVED - RESERVED
B5 RESERVED - RESERVED
C5 RESERVED - RESERVED
C6 RESERVED - RESERVED
C7 RESERVED - RESERVED
N7 RESERVED - RESERVED
P7 RESERVED - RESERVED
N8 RESERVED - RESERVED
N9 RESERVED - RESERVED
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A10 RESERVED - RESERVED
N10 RESERVED - RESERVED
N11 RESERVED - RESERVED
P11 RESERVED - RESERVED
B12 RESERVED - RESERVED
D12 RESERVED - RESERVED
N12 RESERVED - RESERVED
P12 RESERVED - RESERVED
F14 RESERVED - RESERVED
G14 RESERVED - RESERVED
H14 RESERVED - RESERVED
J14 RESERVED - RESERVED
K14 RESERVED - RESERVED
N13 RESERVED - RESERVED
L13 RESERVED - RESERVED
J13 RESERVED - RESERVED
M13 RESERVED - RESERVED
K13 RESERVED - RESERVED
H13 RESERVED - RESERVED
G13 RESERVED - RESERVED
F13 RESERVED - RESERVED
B11 RESERVED - RESERVED
B10 RESERVED - RESERVED
A9 RESERVED - RESERVED
A8 RESERVED - RESERVED
E13 RESERVED - RESERVED
D13 RESERVED - RESERVED
D14 RESERVED - RESERVED
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WARNING:
Reserved pins must not be connected.
A14 RESERVED - RESERVED
A12 RESERVED - RESERVED
A11 RESERVED - RESERVED
H15 RESERVED - RESERVED
J15 RESERVED - RESERVED
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LGA Pads Layout
TOP VIEW
A B C D E F G H J K L M N P R
1 ADC_IN1 RES RES GND RES GND GND GND ANT GND VBATT VBATT_
PA
VBATT_
PA
2 GND RES RES RES GND GND GND GND GND GND GND VBATT VBATT_
PA
VBATT_
PA GND
3 SIMVC
C RES RES RES RES RES RES RES RES RES RES GND GND GND GND
4 SIMIN RES RES GND GND GND GND GND
5 SIMIO RES RES GND GND GND
6 SIMCLK DVI_RX RES GND GND GND
7 SIMRS
T DVI_TX RES RES RES GNSS_L
NA_EN
8 RES DVI_CLK GPIO_01 RES GND GND
9 RES DVI_WA
0 GPIO_02 RES GND ANT_GN
SS
10 RES RES GPIO_03 RES GND GND
11 RES RES GPIO_04 RES RES VAUX/P
WRMON
12 RES RES GPIO_06 RES GND RES RES ON_OFF
*
13 VUSB GND GPIO_07 RES RES RES RES RES RES RES RES RES RES GND
HW_SH
UTDOW
N*
14 RES GPIO_05 RES RES GND RES RES RES RES RES C105/RT
S
C108/DT
R
C109/DC
D
C107/DS
R
C125/RI
NG
15 USB_D+ USB_D- TX AUX RX AUX SPI_CLK GPIO_10 RES RES GPIO_08 GPIO_09 C104/RX
D
C103/TX
D
C106/CT
S
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4. POWER SUPPLY
The power supply circuitry and board layout are a very important part in the full product
design and they strongly reflect on the product overall performances, hence read carefully
the requirements and the guidelines that will follow for a proper design.
Power Supply Requirements
The external power supply must be connected to VBATT & VBATT_PA signals and must
fulfil the following requirements:
Power Supply Value
Nominal Supply Voltage 3.8V
Normal Operating Voltage
Range
3.40 V÷ 4.20 V
Extended Operating
Voltage Range
3.10 V÷ 4.50 V
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NOTE:
The Operating Voltage Range MUST never be exceeded;
care must be taken when designing the application’s
power supply section to avoid having an excessive voltage
drop. If the voltage drop is exceeding the limits it could
cause a Power Off of the module.
The Power supply must be higher than 3.10 V to power on
the module.
Overshoot voltage (regarding MAX Extended Operating
Voltage) and drop in voltage (regarding MIN Extended
Operating Voltage) MUST never be exceeded;
The “Extended Operating Voltage Range” can be used only
with completely assumption and application of the HW
User guide suggestions.
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Power Consumption*
*Preliminary data
NOTE: The electrical design for the Power supply should be made
ensuring it will be capable of a peak current output of at least:
0.8 A for LTE mode (3.80V supply).
Mode Average
(mA)
Mode Description
Switched off 0.007mA Module supplied but switched off
IDLE mode
AT+CFUN=1 11.80 mA Normal mode: full functionality of the module
AT+CFUN=4 11.80 mA Disabled TX and RX; module is not registered on
the network
AT+CFUN=5 1.20 mA 2.56 secs DRx cycle
0.90 mA 81.92 secs DRx cycle
11.80mA RRC_CONNECTED (10.24 secs C-DRX)
0.70 mA RRC_IDLE (43.69 minutes I-DRx cycle)
Operative Mode
LTE Data call 130mA Channel BW 10MHz, RB=1, TX=0dBm
145mA Channel BW 10MHz, RB=1, TX=20dBm
190mA Channel BW 10MHz, RB=1, TX=23dBm
PSM Mode
AT#PSM=1 0.007mA No current drain from PSM pins
GPS
GNSS 29.00 mA GNSS Standalone 1Hz Tracking ( Non-Dpo)
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NOTE: The reported values are an average among all the product
variants and bands for each network wireless technology.
The support of specific network wireless technology depends on
product variant configuration.
General Design Rules
The principal guidelines for the Power Supply Design embrace three different design
steps:
the electrical design
the thermal design
the PCB layout.
4.3.1. Electrical Design Guidelines
The electrical design of the power supply depends strongly from the power source where
this power is drained. We will distinguish them into three categories:
+5V input (typically PC internal regulator output)
+12V input (typically automotive)
Battery
4.3.1.1. +5V Source Power Supply Design Guidelines
The desired output for the power supply is 3.8V, hence there's not a big difference
between the input source and the desired output and a linear regulator can be used.
A switching power supply will not be suited because of the low drop out
requirements.
When using a linear regulator, a proper heat sink shall be provided in order to
dissipate the power generated.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut
the current absorption peaks close to the Module, a 100μF capacitor is usually
suited.
Make sure the low ESR capacitor on the power supply output rated at least 10V.
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An example of linear regulator with 5V input is:
Guidelines
4.3.1.2. +12V Source Power Supply Design Guidelines
The desired output for the power supply is 3.8V, hence due to the big difference
between the input source and the desired output, a linear regulator is not suited and
shall not be used. A switching power supply will be preferable because of its better
efficiency.
When using a switching regulator, a 500kHz or more switching frequency regulator
is preferable because of its smaller inductor size and its faster transient response.
This allows the regulator to respond quickly to the current peaks absorption.
In any case the frequency and Switching design selection is related to the
application to be developed due to the fact the switching frequency could also
generate EMC interferences.
For car PB battery the input voltage can rise up to 15,8V and this should be kept in
mind when choosing components: all components in the power supply must
withstand this voltage.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut
the current absorption peaks, a 100μF capacitor is usually suited.
Make sure the low ESR capacitor on the power supply output is rated at least 10V.
For Car applications a spike protection diode should be inserted close to the power
input, in order to clean the supply from spikes.
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An example of switching regulator with 12V input is in the below schematic:
4.3.1.3. Battery Source Power Supply Design Guidelines
The desired nominal output for the power supply is 3.8V and the maximum voltage
allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the
power to the Telit ME910C1 module.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut
the current absorption peaks, a 100μF tantalum capacitor is usually suited.
Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.
A protection diode should be inserted close to the power input, in order to save the
ME910C1 from power polarity inversion. Otherwise the battery connector should be
done in a way to avoid polarity inversions when connecting the battery.
The battery must be rated to supply peaks of current up to 0.8 A for LTE.
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NOTE:
DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly
connected with ME910C1. Their use can lead to overvoltage on the
ME910C1 and damage it. USE ONLY Li-Ion battery types.
4.3.2. Thermal Design Guidelines
Worst case as reference values for thermal design of ME910C1 are:
Average current consumption: 800 mA
Supply voltage: 3.80V
NOTE:
Make PCB design in order to have the best connection of GND pads
to large surfaces.
NOTE:
The ME910C1 includes a function to prevent overheating.
4.3.3. Power Supply PCB layout Guidelines
As seen on the electrical design guidelines the power supply shall have a low ESR
capacitor on the output to cut the current peaks on the input to protect the supply from
spikes The placement of this component is crucial for the correct working of the circuitry.
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A misplaced component can be useless or can even decrease the power supply
performances.
The Bypass low ESR capacitor must be placed close to the Telit ME910C1 power
input pads or in the case the power supply is a switching type it can be placed close
to the inductor to cut the ripple provided the PCB trace from the capacitor to the
ME910C1 is wide enough to ensure a dropless connection even during an 0.8 A
current peak.
The protection diode must be placed close to the input connector where the power
source is drained.
The PCB traces from the input connector to the power regulator IC must be wide
enough to ensure no voltage drops occur when an 2 A current peak is absorbed
(worst case of GSM mode).
The PCB traces to the ME910C1 and the Bypass capacitor must be wide enough to
ensure no significant voltage drops occur. This is for the same reason as previous
point. Try to keep this trace as short as possible.
To reduce the EMI due to switching, it is important to keep very small the mesh
involved; thus the input capacitor, the output diode (if not embodied in the IC) and
the regulator have to form a very small loop.This is done in order to reduce the
radiated field (noise) at the switching frequency (100-500 kHz usually).
A dedicated ground for the Switching regulator separated by the common ground
plane is suggested.
The placement of the power supply on the board should be done in such a way to
guarantee that the high current return paths in the ground plane are not overlapped
to any noise sensitive circuitry as the microphone amplifier/buffer or earphone
amplifier.
The power supply input cables should be kept separate from noise sensitive lines
such as microphone/earphone cables.
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The insertion of EMI filter on VBATT pins is suggested in those designs where
antenna is placed close to battery or supply lines. A ferrite bead like Murata
BLM18EG101TN1 or Taiyo Yuden P/N FBMH1608HM101 can be used for this
purpose.
The below figure shows the recommended circuit:
VAUX Power Output
A regulated power supply output is provided in order to supply small devices from the
module. The signal is present on Pad R11 and it is in common with the PWRMON
(module powered ON indication) function.
This output is always active when the module is powered ON.
The operating range characteristics of the supply are:
Item Min Typical Max
Output voltage 1.78V 1.80V 1.82V
Output current - - 60mA
Output bypass capacitor
(inside the module) 1uF
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5. DIGITAL SECTION
Logic Levels
Power On
To turn on the ME910C1 the pad ON_OFF* must be tied low for at least 1 second and
then released.
The maximum current that can be drained from the ON_OFF* pad is 0,1 mA.
Figure 1 illustrates a simple circuit to power on the module using an inverted buffer output.
Figure 1: Power-on Circuit
Parameter Min Max
ABSOLUTE MAXIMUM RATINGS – NOT FUNCTIONAL
Input level on any digital pin (CMOS 1.8) with respect to ground -0.3V 2.1V
Operating Range - Interface levels (1.8V CMOS)
Input high level 1.5V 1.9V
Input low level 0V 0.35V
Output high level 1.6V 1.9V
Output low level 0V 0.2V
Parameter AVG
CURRENT CHARACTERISTICS:
Output Current 1mA
Input Current 1uA
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NOTE:
Don't use any pull up resistor on the ON_OFF* line, it is
internally pulled up. Using pull up resistor may bring to
latch up problems on the ME910C1 power regulator and
improper power on/off of the module. The line ON_OFF*
must be connected only in open collector or open drain
configuration.
In this document all the lines that are inverted, hence have
active low signals are labelled with a name that ends
with”#",”*” or with a bar over the name.
To check if the device has powered on, the hardware line
PWRMON should be monitored.
It is mandatory to avoid sending data to the serial ports
during the first 200ms of the module start-up.
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A flow chart showing the proper turn on procedure is displayed below:
When the USB is connected or after the firmware updating,
Delay must be equal at least to 10 seconds.
“Modem ON Proc”
START
VBATT >
3.10V ?
ON_OFF* = LOW
PWRMON=ON
?
Delay = 5 sec (see note
below)
ON_OFF* = HIGH
GO TO
“HW Shutdown
Unconditional”
PWRMON=ON
?
Delay = 1 sec
GO TO
“Start AT Commands””
“Modem ON Proc”
END
N
N
Y
Y
Y
N
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A flow chart showing the AT commands managing procedure is displayed below:
NOTE:
In order to avoid a back powering effect it is recommended
to avoid having any HIGH logic level signal applied to the
digital pins of the ME910C1 when the module is powered
off or during an ON/OFF transition.
“Start AT CMD”
START
Delay = 300 msec
Enter AT <CR>
GO TO
“HW Shutdown
Unconditional”
AT answer in
1 sec ?
GO TO
“Modem ON Proc.”
“Start AT CMD”
END
Y
N
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For example:
1- Let's assume you need to drive the ON_OFF* pad with a totem pole output of a +3/5 V
microcontroller (uP_OUT1):
2- Let's assume you need to drive the ON_OFF* pad directly with an ON/OFF button:
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WARNING
It is recommended to set the ON_OFF* line LOW to power
on the module only after VBATT is higher than 3.10V.
In case this condition it is not satisfied you could use the
HW_SHUTDOWN* line to recover it and then restart the
power on activity using the ON_OFF * line.
An example of this is described in the following diagram.
Power ON diagram:
After HW_SHUTSDOWN* is released you could again use the ON_OFF* line to power on
the module.
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Power Off
Turning off of the device can be done in two ways:
• via AT command (see ME910C1 Software User Guide, AT#SHDN)
• by tying low pin ON_OFF*
Either ways, the device issues a detach request to network informing that the device will
not be reachable any more.
To turn OFF the ME910C1 the pad ON_OFF* must be tied low for at least 3 seconds and
then released.
NOTE:
To check if the device has been powered off, the hardware
line PWRMON must be monitored. The device is powered
off when PWRMON goes low.
In order to avoid a back powering effect it is recommended
to avoid having any HIGH logic level signal applied to the
digital pins of the ME910C1 when the module is powered
off or during an ON/OFF transition.
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The following flow chart shows the proper turn off procedure:
“Modem OFF Proc.”
START
ON_OFF* = LOW
PWRMON=ON?
Delay >= 3 sec
ON_OFF* = HIGH
PWRMON=ON?
GO TO
“HW SHUTDOWN
Unconditional”
“Modem OFF Proc.”
END
N
Y
Y
N
OFF Mode
AT#SHDN
Looping for more
than 15s?
Y
N
Key
AT
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Unconditional Shutdown
HW_SHUTDOWN* is used to unconditionally shutdown the ME910C1. Whenever this
signal is pulled low, the ME910C1 is reset. When the device is reset it stops any
operation. After the release of the line, the ME910C1 is unconditionally shut down, without
doing any detach operation from the network where it is registered. This behaviour is not a
proper shut down because any WCDMA device is requested to issue a detach request on
turn off. The HW_SHUTDOWN* is internally controlled on start-up to achieve always a
proper power-on reset sequence, so there's no need to control this pin on start-up.
To unconditionally shutdown the ME910C1, the pad HW_SHUTDOWN* must be tied low
for at least 200 milliseconds and then released.
The signal is internally pulled up so the pin can be left floating if not used.
If used, then it must always be connected with an open collector transistor, to permit
to the internal circuitry the power on reset and under voltage lockout functions.
PIN DESCRIPTION
Signal Function I/O PAD
HW_SHUTDOWN*
Unconditional Shutdown of
the Module I R13
OPERATING LEVELS
Signal Status Min Max
HW_SHUTDOWN* Input high 1.5V 1.9V
HW_SHUTDOWN* Input low 0V 0.35V
WARNING:
The hardware unconditional Shutdown must not be used during
normal operation of the device since it does not detach the device
from the network. It shall be kept as an emergency exit procedure.
A typical circuit is the following:
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For example: Let us assume you need to drive the HW_SHUTDOWN* pad with a totem
pole output of a +3/5 V microcontroller (uP_OUT2):
In the following flow chart is detailed the proper restart procedure:
NOTE:
In order to avoid a back powering effect it is recommended to avoid
having any HIGH logic level signal applied to the digital pins of the
ME910C1 when the module is powered off or during an ON/OFF
transition.
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NOTE:
Do not use any pull up resistor on the HW_SHUTDOWN* line nor any
totem pole digital output. Using pull up resistor may bring to latch up
problems on the ME910C1 power regulator and improper functioning
of the module.
To proper power on again the module please refer to the related
paragraph (“Power ON”)
The unconditional hardware shutdown must always be implemented
on the boards and should be used only as an emergency exit
procedure.
“
HW SHUTDOWN
Unconditional”
START
HW_SHUTDOWN* = LOW
Delay = 200ms
PWRMON = ON
Disconnect
VBATT
Y
N
“
HW SHUTDOWN
Unconditional”
END
HW_SHUTDOWN* = HIGH
Delay = 1s
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Fast power down
The procedure to power off ME910C1 described in Chapter 5.3 normally takes more than
1 second to detach from network and make ME910C1 internal filesystem properly closed.
In case of unwanted supply voltage loss the system can be switched off without any risk of
filesystem data corruption by implementing Fast Shut Down feature.
Fast Shut Down feature permits to reduce the current consumption and the time-to-
poweroff to minimum values.
NOTE:
Refer to ME910C1 series AT command reference guide (Fast power
down - #FASTSHDN) in order to set up detailed AT command.
5.5.1. Fast Shut Down by Hardware
The Fast Power Down can be triggered by configuration of any GPIO. HI level to LOW
level transition of GPIO commands fast power down.
Example circuit:
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NOTE:
In case of power on with slow ramp-up of Vbatt supply voltage while
ON/OFF* is tied to GND (case possibile if timing are not properly
controlled), HW_SHUTDOWN* line has to be used according to
power on diagram in chapter 5.2.
NOTE:
Consider voltage drop under max current conditions when defining
the voltage detector thereshold in order to avoid unwanted shutdown.
Tipical timings are reported in the plot above when testing the example circuit with
Ctank=47mF.
The capacitor is rated with the following formula:
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where 80mA is a typical current during fast shut down procedure, 300ms is the typical
time to execute the shutdown and 0.5V is the minimum voltage marging from threshold of
ME910C1 hardware reset.
TIP:
Make the same plot during system verification to check timings and
voltage levels.
5.5.2. Fast Shut Down by Software
The Fast Power Down can be triggered by AT command.
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Communication ports
5.6.1. USB 2.0 HS
The ME910C1 includes one integrated universal serial bus (USB 2.0 HS) transceiver.
The following table is listing the available signals:
PAD Signal I/O Function Type NOTE
B15 USB_D+ I/O USB differential Data (+) 3.3V
C15 USB_D- I/O USB differential Data (-) 3.3V
A13 VUSB AI Power sense for the internal USB
transceiver. 5V Accepted range:
4.4V to 5.25V
The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz.
The signal traces should be routed carefully. Trace lengths, number of vias and capacitive
loading should be minimized. The characteristic impedance value should be as close as
possible to 90 Ohms differential.
In case there is a need to add an ESD protection, the suggested connection is the
following:
NOTE:
VUSB pin should be disconnected before activating the
Power Saving Mode.
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5.6.2. SPI
The ME910C1 Module is provided by a standard 3-wire master SPI interface.
The following table is listing the available signals:
NOTE: Final Position of SPI still under definition
PAD Signal I/O Function Type NOTE
D15 SPI_MOSI O SPI MOSI CMOS
1.8V
Shared
with
TX_AUX
E15 SPI_MISO I SPI MISO CMOS
1.8V
Shared
with
RX_AUX
F15 SPI_CLK O SPI Clock CMOS
1.8V
NOTE:
Due to the shared functions, when the SPI port is used, it is
not possible to use the AUX_UART port.
5.6.2.1. SPI Connections
SPI_MISO
SPI_MOSI
SPI_CLK
E15
D15
F15
ME910C1
AP
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Serial Ports
The ME910C1 module is provided with by 2 Asynchronous serial ports:
• MODEM SERIAL PORT 1 (Main)
• MODEM SERIAL PORT 2 (Auxiliary)
Several configurations can be designed for the serial port on the OEM hardware, but the
most common are:
• RS232 PC com port
• microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit)
• microcontroller UART @ 5V or other voltages different from 1.8V
Depending from the type of serial port on the OEM hardware a level translator circuit may
be needed to make the system work. On the ME910C1 the ports are CMOS 1.8.
5.6.2.2. Modem serial port 1 (USIF0)
The serial port 1 on the ME910C1 is a +1.8V UART with all the 7 RS232 signals. It differs
from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.
The following table is listing the available signals:
RS232
Pin
Signal PAD Name Usage
1 C109/DCD N14 Data Carrier Detect
Output from the ME910C1
that indicates the carrier
presence
2 C104/RXD M15 Transmit line *see
Note
Output transmit line of
ME910C1 UART
3 C103/TXD N15 Receive line *see Note Input receive of the ME910C1
UART
4 C108/DTR M14 Data Terminal Ready
Input to the ME910C1 that
controls the DTE READY
condition
5 GND
M12
,
B13,
P13,
E14
Ground Ground
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6 C107/DSR P14 Data Set Ready
Output from the ME910C1
that indicates the module is
ready
7 C106/CTS P15 Clear to Send
Output from the ME910C1
that controls the Hardware
flow control
8 C105/RTS L14 Request to Send
Input to the ME910C1 that
controls the Hardware flow
control
9 C125/RING R14 Ring Indicator
Output from the ME910C1
that indicates the incoming
call condition
NOTE:
According to V.24, some signal names are referred to the
application side, therefore on the ME910C1 side these
signal are on the opposite direction:
TXD on the application side will be connected to the
receive line (here named C103/TXD)
RXD on the application side will be connected to the
transmit line (here named C104/RXD)
For a minimum implementation, only the TXD, RXD lines
can be connected, the other lines can be left open provided
a software flow control is implemented.
In order to avoid a back powering effect it is recommended
to avoid having any HIGH logic level signal applied to the
digital pins of the ME910C1 when the module is powered
off or during an ON/OFF transition.
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5.6.2.3. Modem serial port 2 (USIF1)
The secondary serial port on the ME910C1 is a CMOS1.8V with only the RX and TX
signals.
The signals of the ME910C1 serial port are:
PAD Signal I/O Function Type NOTE
D15 TX_AUX O Auxiliary UART (TX Data to
DTE)
CMOS
1.8V
Shared
with
SPI_MOSI
E15 RX_AUX I Auxiliary UART (RX Data from
DTE)
CMOS
1.8V
Shared
with
SPI_MISO
NOTE:
Due to the shared pins, when the Modem Serial port is
used, it is not possible to use the SPI functions.
In order to avoid a back powering effect it is recommended
to avoid having any HIGH logic level signal applied to the
digital pins of the ME910C1 when the module is powered
off or during an ON/OFF transition.
5.6.2.4. RS232 level translation
In order to interface the ME910C1 with a PC com port or a RS232 (EIA/TIA-232)
application a level translator is required. This level translator must:
• invert the electrical signal in both directions;
• Change the level from 0/1.8V to +15/-15V.
Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with
lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio
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on the level translator. Note that the negative signal voltage must be less than 0V and
hence some sort of level translation is always required.
The simplest way to translate the levels and invert the signal is by using a single chip level
translator. There are a multitude of them, differing in the number of drivers and receivers
and in the levels (be sure to get a true RS232 level translator not a RS485 or other
standards).
By convention the driver is the level translator from the 0-1.8V UART to the RS232 level.
The receiver is the translator from the RS232 level to 0-1.8V UART.
In order to translate the whole set of control lines of the UART you will need:
• 5 drivers
• 3 receivers
An example of RS232 level
adaptation circuitry could be done
using a MAXIM transceiver
(MAX218)
In this case the chipset is capable
to translate directly from 1.8V to
the RS232 levels (Example done
on 4 signals only).
The RS232 serial port lines are usually connected to a DB9 connector with the following
layout:
General purpose I/O
The ME910C1 module is provided by a set of Configurable Digital Input / Output pins
(CMOS 1.8V). Input pads can only be read; they report the digital value (high or low)
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present on the pad at the read time. Output pads can only be written or queried and set
the value of the pad output.
An alternate function pad is internally controlled by the ME910C1 firmware and acts
depending on the function implemented.
The following table shows the available GPIO on the ME910C1:
PAD Signal I/O Drive
Strength
Default
State
NOTE
C8 GPIO_01 I/O (TBD) mA INPUT Alternate function STAT LED
C9 GPIO_02 I/O (TBD) mA INPUT
C10 GPIO_03 I/O (TBD) mA INPUT
C11 GPIO_04 I/O (TBD) mA INPUT
B14 GPIO_05 I/O (TBD) mA INPUT
C12 GPIO_06 I/O (TBD) mA INPUT
C13 GPIO_07 I/O (TBD) mA INPUT
K15 GPIO_08 I/O (TBD) mA INPUT
L15 GPIO_09 I/O (TBD) mA INPUT
G15 GPIO_10 I/O (TBD) mA INPUT
5.7.1. Using a GPIO as INPUT
The GPIO pads, when used as inputs, can be connected to a digital output of another
device and report its status, provided this device has interface levels compatible with the
1.8V CMOS levels of the GPIO.
If the digital output of the device to be connected with the GPIO input pad has interface
levels different from the 1.8V CMOS, then it can be buffered with an open collector
transistor with a 47K pull up to 1.8V supplied by VAUX/POWERMON R11 pad.
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NOTE:
In order to avoid a back powering effect it is recommended
to avoid having any HIGH logic level signal applied to the
digital pins of the ME910C1 when the module is powered
off or during an ON/OFF transition.
5.7.2. Using a GPIO as OUTPUT
The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or
compatible hardware. When set as outputs, the pads have a push-pull output and
therefore the pull-up resistor may be omitted.
5.7.3. Indication of network service availability
The STAT_LED pin status shows information on the network service availability and Call
status.
The function is available as alternate function of GPIO_01 (to be enabled using the
AT#GPIO=1,0,2 command).
In the ME910C1 modules, the STAT_LED needs an external transistor to drive an
external
LED and its voltage level is defined accordingly to the table below:.
Device Status Led Status
Device off Permanently off
Not Registered Permanently on
Registered in idle Blinking 1sec on + 2 sec off
Registered in idle + power saving It depends on the event that triggers the
wakeup (In sync with network paging)
Connecting Blinking 1 sec on + 2 sec off
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The reference schematic for LED indicator,
R3 must be calculated taking in account VBATT value and LED type. :
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External SIM Holder
Please refer to Error! Reference source not found. the related User Guide (SIM Holder
Design Guides, 80000NT10001a).
ADC Converter
The ME910C1 is provided by one AD converter. It is able to read a voltage level in the
range of 0÷1.2 volts applied on the ADC pin input, store and convert it into 10 bit word.
The input line is named as ADC_IN1 and it is available on Pad B1
The following table is showing the ADC characteristics:
Item Min Typical Max Unit
Input Voltage range 0 - 1.2 Volt
AD conversion - - 10 bits
Input Resistance 1 - - Mohm
Input Capacitance - 1 - pF
The ADC could be controlled using an AT command.
The command is AT#ADC=1,2
The read value is expressed in mV
Refer to SW User Guide or AT Commands Reference Guide for the full description of this
function.
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6. RF SECTION
Bands Variants
Product LTE bands
ME910C1-NV B4,B13
ME910C1-NA B2,B4,B12
TX Output power
Band dBm
LTE All bands 23(+-2)
RX Sensitivity
Measurement setup
Band
LTE Throughput >95& 10 Mhz
ME910C1-NA
ME910C1-NV
Band dBm
Band 2 -103.0 ( Preliminary)
Band 4 -102.5 ( Preliminary)
Band 12 -103.0 (Preliminary)
Band 13 -103.0 (Preliminary)
Antenna requirements
The antenna connection and board layout design are the most important aspect in the full
product design as they strongly affect the product overall performances, hence read
carefully and follow the requirements and the guidelines for a proper design.
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The antenna and antenna transmission line on PCB for a Telit ME910C1 device shall fulfil
the following requirements:
ME910C1-NA
ME910C1-NV
Item Value
Frequency range
Depending by frequency band(s) provided by the network
operator, the customer shall use the most suitable antenna for
that/those band(s)
Bandwidth
140 MHz in LTE Band 2
445 MHz in LTE Band 4
47 MHz in LTE Band 12
41 MHz in LTE Band 13
Impedance 50 ohm
Input power > 24dBm Average power
VSWR absolute max ≤ 10:1 (limit to avoid permanent damage)
VSWR recommended ≤ 2:1 (limit to fulfill all regulatory requirements)
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6.4.1. PCB Design guidelines
When using the ME910C1, since there's no antenna connector on the module, the
antenna must be connected to the ME910C1 antenna pad (K1) by means of a
transmission line implemented on the PCB.
This transmission line shall fulfil the following requirements:
Item Value
Characteristic
Impedance 50 ohm (+-10%)
Max Attenuation 0,3 dB
Coupling Coupling with other signals shall be avoided
Ground Plane Cold End (Ground Plane) of antenna shall be equipotential to
the ME910C1 ground pins
The transmission line should be designed according to the following guidelines:
• Make sure that the transmission line’s characteristic impedance is 50ohm ;
• Keep line on the PCB as short as possible, since the antenna line loss shall be less than about 0,3 dB;
• Line geometry should have uniform characteristics, constant cross section, avoid meanders and abrupt
curves;
• Any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded Coplanar
Waveguide...) can be used for implementing the printed transmission line afferent the antenna;
• If a Ground plane is required in line geometry, that plane has to be continuous and sufficiently
extended, so the geometry can be as similar as possible to the related canonical model;
• Keep, if possible, at least one layer of the PCB used only for the Ground plane; If possible, use this
layer as reference Ground plane for the transmission line;
• It is wise to surround (on both sides) the PCB transmission line with Ground, avoid having other signal
tracks facing directly the antenna line track.
• Avoid crossing any un-shielded transmission line footprint with other signal tracks on different layers;
• The ground surrounding the antenna line on PCB has to be strictly connected to the main Ground
Plane by means of via holes (once per 2mm at least), placed close to the ground edges facing line
track;
• Place EM noisy devices as far as possible from ME910C1 antenna line;
• Keep the antenna line far away from the ME910C1 power supply lines;
• If EM noisy devices (such as fast switching ICs, LCD and so on) are present on the PCB hosting the
ME910, take care of the shielding of the antenna line by burying it in an inner layer of PCB and surround
it with Ground planes, or shield it with a metal frame cover.
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• If EM noisy devices are not present around the line, the use of geometries like Microstrip or Grounded
Coplanar Waveguide has to be preferred, since they typically ensure less attenuation if compared to a
Stripline having same length;
The following image is showing the suggested layout for the Antenna pad
connection:
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6.4.2. PCB Guidelines in case of FCC Certification
In the case FCC certification is required for an application using ME910C1, according to
FCC KDB 996369 for modular approval requirements, the transmission line has to be
similar to that implemented on ME910C1 interface board and described in the following
chapter.
6.4.2.1. Transmission line design
During the design of the ME910C1 interface board, the placement of components has
been chosen properly, in order to keep the line length as short as possible, thus leading to
lowest power losses possible. A Grounded Coplanar Waveguide (G-CPW) line has been
chosen, since this kind of transmission line ensures good impedance control and can be
implemented in an outer PCB layer as needed in this case. A SMA female connector has
been used to feed the line.
The interface board is realized on a FR4, 4-layers PCB. Substrate material is
characterized by relative permittivity εr = 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @ 1
GHz.
A characteristic impedance of nearly 50 Ω is achieved using trace width = 1.1 mm,
clearance from coplanar ground plane = 0.3 mm each side. The line uses reference
ground plane on layer 3, while copper is removed from layer 2 underneath the line. Height
of trace above ground plane is 1.335 mm. Calculated characteristic impedance is 51.6 Ω,
estimated line loss is less than 0.1 dB. The line geometry is shown below:
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6.4.2.2. Transmission Line Measurements
An HP8753E VNA (Full-2-port calibration) has been used in this measurement session.
A calibrated coaxial cable has been soldered at the pad corresponding to RF output; a
SMA connector has been soldered to the board in order to characterize the losses of the
transmission line including the connector itself. During Return Loss / impedance
measurements, the transmission line has been terminated to 50 Ω load.
Return Loss plot of line under test is shown below:
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Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω
load) is shown in the following figure:
Insertion Loss of G-CPW line plus SMA connector is shown below:
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6.4.2.3. Antenna Installation Guidelines
Install the antenna in a place covered by the LTE signal.
Antenna must not be installed inside metal cases
Antenna shall also be installed according Antenna manufacturer instructions
Antenna integration should optimize the Radiation Efficiency. Efficiency values >
50% are recommended on all frequency bands
Antenna integration should not dramatically perturb the radiation pattern. It is
preferable to get, after antenna installation, an omnidirectional radiation pattern, at
least in one pattern cut
Antenna Gain must not exceed values indicated in regulatory requirements, where
applicable, in order to meet related EIRP limitations. Typical antenna Gain in most
M2M applications does not exceed 2dBi
If the device antenna is located farther than 20cm from the human body and there
are no co-located transmitter then the Telit FCC/IC approvals can be re-used by the
end product
If the device antenna is located closer than 20cm from the human body or there are
co-located transmitter then the additional FCC/IC testing may be required for the
end product (Telit FCC/IC approvals cannot be reused)
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7. AUDIO SECTION
The Telit digital audio interface (DVI) of the ME910C1 Module is based on the I2S serial
bus interface standard. The audio port can be directly connected to end device using
digital interface, or via one of the several compliant codecs (in case an analog audio is
needed).
Electrical Characteristics
The product is providing the DVI on the following pins:
Pin Signal I/O Function Internal
Pull Up
Type
B9 DVI_WA0
I/O Digital Audio Interface (Word
Alignment / LRCLK)
CMOS 1.8V
B6 DVI_RX I Digital Audio Interface (RX) CMOS 1.8V
B7 DVI_TX O Digital Audio Interface (TX) CMOS 1.8V
B8 DVI_CLK I/O Digital Audio Interface (BCLK) CMOS 1.8V
Codec examples
Please refer to the Digital Audio Application note.
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8. MECHANICAL DESIGN
Drawing
Dimensions in
mm
PIN B1
Lead Free Alloy:
Surface Finishing Ni/Au for all solder pads
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9. APPLICATION PCB DESIGN
The ME910C1 modules have been designed in order to be compliant with a standard lead-
free SMT process
Footprint
TOP VIEW
In order to easily rework the ME910C1 is suggested to consider on the application a 1.5
mm placement inhibit area around the module.
It is also suggested, as common rule for an SMT component, to avoid having a
mechanical part of the application in direct contact with the module.
NOTE:
In the customer application, the region under WIRING
INHIBIT (see figure above) must be clear from signal or
ground paths.
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PCB pad design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
PCB
Copper
Pad
Solder Mask
SMD
(Solder Mask Defined)
NSMD
(Non Solder Mask Defined)
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PCB pad dimensions
The recommendation for the PCB pads dimensions are described in the following image
(dimensions in mm)
It is not recommended to place via or micro-via not covered by solder resist in an area of
0,3 mm around the pads unless it carries the same signal of the pad itself
Solder resist openings
Inhibit area for micro-via
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Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish Layer Thickness (um) Properties
Electro-less Ni /
Immersion Au
3 –7 / 0.05 – 0.15 good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-
free process. This issue should be discussed with the PCB-supplier. Generally, the
wettability of tin-lead solder paste on the described surface plating is better compared to
lead-free solder paste.
It is not necessary to panel the application’s PCB, however in that case it is suggested to
use milled contours and predrilled board breakouts; scoring or v-cut solutions are not
recommended
Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we
suggest a thickness of stencil foil ≥ 120 µm.
Solder paste
Item Lead Free
Solder Paste Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly
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Solder Reflow
Recommended solder reflow profile:
Profile Feature Pb-Free Assembly Free
Average ramp-up rate (TL to TP) 3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate
3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp) 245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate 6°C/second max.
Time 25°C to Peak Temperature 8 minutes max.
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NOTE:
All temperatures refer to topside of the package, measured
on the package body surface
WARNING:
THE ME910C1 MODULE WITHSTANDS ONE REFLOW
PROCESS ONLY.
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10. PACKAGING
Tray
The ME910 modules are packaged on trays that can be used in SMT processes for pick &
place handling.The first Marketing and Engineering samples of the ME910C1 series will
be shipped with the current packaging of the xE910 modules (on trays of 20 pieces each).
Please note that Telit is going to introduce a new packaging for the xE910 family, as per
the Product Change Notification PCN-0000-14-0055, therefore the mass production units
of ME910C1 will be shipped according to the following drawings:
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Reel
The ME910 can be packaged on reels of 200 pieces each. See figure for module
positioning into the carrier.
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Carrier Tape detail
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Reel detail
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Packaging detail
Moisture sensitivity
The ME910C1 is a Moisture Sensitive Device level 3, in according with standard
IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of
components.
Moreover, the customer has to take care of the following conditions:
a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity
(RH).
b) Environmental condition during the production: 30°C / 60% RH according to
IPC/JEDEC J-STD-033A paragraph 5.
c) The maximum time between the opening of the sealed bag and the reflow process must
be 168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected
d) Baking is required if conditions b) or c) are not respected
e) Baking is required if the humidity indicator inside the bag indicates 10% RH
or more
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11. CONFORMITY ASSESSMENT ISSUES
FCC/ISED Regulatory notices
Modification statement
Telit has not approved any changes or modifications to this device by the user. Any
changes or modifications could void the user’s authority to operate the equipment.
Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en
soit la nature. Tout changement ou modification peuvent annuler le droit d’utilisation de
l’appareil par l’utilisateur.
Interference statement
This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt
RSS standard(s). Operation is subject to the following two conditions: (1) this device may
not cause interference, and (2) this device must accept any interference, including
interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils
radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1)
l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.
Wireless notice
This device complies with FCC/ISED radiation exposure limits set forth for an uncontrolled
environment and meets the FCC radio frequency (RF) Exposure Guidelines and RSS‐102
of the ISED radio frequency (RF) Exposure rules.
Antenna gain must be below:
Band ME910C1-NA ME910C1-NV
FDD 4 6,00 dBi 6,00 dBi
FDD 2 9,01 dBi --
FDD 12 6,63 dBi --
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FDD 13 -- 6,94 dBi
This transmitter must not be co-located or operating in conjunction with any other antenna
or transmitter.
Le présent appareil est conforme à l'exposition aux radiations FCC / ISED définies
pour un environnement non contrôlé et répond aux directives d'exposition de la
fréquence de la FCC radiofréquence (RF) et RSS
‐
102 de la fréquence radio (RF)
ISED règles d'exposition.
Gain de l’antenne doit étre ci-dessous :
Band ME910C1-NA ME910C1-NV
FDD 4 6,00 dBi 6,00 dBi
FDD 2 9,01 dBi --
FDD 12 6,63 dBi --
FDD 13 -- 6,94 dBi
L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre
antenne ou autre émetteur.
FCC Class B digital device notice
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
CAN ICES-3 (B) / NMB-3 (B)
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This Class B digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003.
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12. SAFETY RECOMMENDATIONS
READ CAREFULLY
Be sure the use of this product is allowed in the country and in the environment required.
The use of this product may be dangerous and has to be avoided in the following areas:
Where it can interfere with other electronic devices in environments such as
hospitals, airports, aircrafts, etc.
Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is the
responsibility of the user to enforce the country regulation and the specific
environment regulation.
Do not disassemble the product; any mark of tampering will compromise the warranty
validity. We recommend following the instructions of the hardware user guides for correct
wiring of the product. The product has to be supplied with a stabilized voltage source and
the wiring has to be conformed to the security and fire prevention regulations. The product
has to be handled with care, avoiding any contact with the pins because electrostatic
discharges may damage the product itself. Same cautions have to be taken for the SIM,
checking carefully the instruction for its use. Do not insert or remove the SIM when the
product is in power saving mode.
The system integrator is responsible for the functioning of the final product; therefore, care
has to be taken to the external components of the module, as well as any project or
installation issue, because the risk of disturbing the GSM network or external devices or
having impact on the security. Should there be any doubt, please refer to the technical
documentation and the regulations in force. Every module has to be equipped with a proper
antenna with specific characteristics. The antenna has to be installed with care in order to
avoid any interference with other electronic devices and has to guarantee a minimum
distance from the body (20 cm). In case this requirement cannot be satisfied, the system
integrator has to assess the final product against the SAR regulation.
The European Community provides some Directives for the electronic equipment
introduced on the market. All of the relevant information is available on the European
Community website:
http://ec.europa.eu/enterprise/sectors/rtte/documents/
The text of the Directive 99/05 regarding telecommunication equipment is available,
while the applicable Directives (Low Voltage and EMC) are available at:
http://ec.europa.eu/enterprise/sectors/electrical/
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13. ACRONYMS
TTSC Telit Technical Support Centre
USB Universal Serial Bus
HS High Speed
DTE Data Terminal Equipment
UMTS Universal Mobile Telecommunication System
WCDMA Wideband Code Division Multiple Access
HSDPA High Speed Downlink Packet Access
HSUPA High Speed Uplink Packet Access
UART Universal Asynchronous Receiver Transmitter
HSIC High Speed Inter Chip
SIM Subscriber Identification Module
SPI Serial Peripheral Interface
ADC Analog – Digital Converter
DAC Digital – Analog Converter
I/O Input Output
GPIO General Purpose Input Output
CMOS Complementary Metal – Oxide Semiconductor
MOSI Master Output – Slave Input
MISO Master Input – Slave Output
CLK Clock
CS Chip Select
RTC Real Time Clock
PCB Printed Circuit Board
ESR Equivalent Series Resistance
VSWR Voltage Standing Wave Radio
VNA Vector Network Analyzer
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14. DOCUMENT HISTORY
Revision Date Changes
0 2017-01-16 First issue (preliminary)
1
2
2017-02-10
2017-07-20
Power consumption and Pinout clarification
Added par.11 – Conformity Assesment Issues
[04.2016]
Mod. 0805 2016-08 Rev.5