Telit Wireless Solutions MS Bluetooth LE module User Manual Stollmann Dokumentation
Stollmann E+V GmbH Bluetooth LE module Stollmann Dokumentation
user manual
BlueMod+S/AI
Hardware Reference
Release r00d01
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Hardware Reference
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Note
This device was developed for the purpose of communication in an office environment. It is
intended solely for our industrial clients for physical integration into their own technical products
after careful examination by experienced technical personnel for its suitability for the intended
purpose. The device was not developed for or intended for use in any specific customer
application. The firmware of the device may have to be adapted to the specific intended modalities
of use or even replaced by other firmware in order to ensure flawless function in the respective
areas of application. Performance data (range, power requirements, etc.) may depend on the
operating environment, the area of application, the configuration, and method of control, as well as
on other conditions of use; these may deviate from the technical specifications, the Design Guide
specifications, or other product documentation. The actual performance characteristics can be
determined only by measurements subsequent to integration. Variations in the performance data of
mass-produced devices may occur due to individual differences between such devices. Device
samples were tested in a reference environment for compliance with the legal requirements
applicable to the reference environment. No representation is made regarding the compliance with
legal, regulatory, or other requirements in other environments. No representation can be made and
no warranty can be assumed regarding the suitability of the device for a specific purpose as
defined by our customers. Stollmann reserves the right to make changes to the hardware or
firmware or to the specifications without prior notice or to replace the device with a successor
model. Of course, any changes to the hardware or firmware of any devices for which we have
entered into a supply agreement with our customers will be made only if, and only to the extent
that, such changes can reasonably be expected to be acceptable to our customers. No general
commitment will be made regarding periods of availability; these must be subject to individual
agreement. All agreements are subject to our Terms and Conditions for Deliveries and Payments,
a copy of which is available from Stollmann.
Copyright © 2013 Stollmann E+V GmbH
Trademarks
The Bluetooth® word mark and logos are owned by the Bluetooth SIG, Inc. and any use of such
marks by Stollmann E+V GmbH is under license. Other trademarks and trade names are those of
their respective owners.
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Table of contents
1 Introduction .............................................................................................................................. 8
1.1 Feature Summary ............................................................................................................. 8
1.2 Applications ...................................................................................................................... 9
Support for any additional profile is possible on request........................................................... 9
1.2.1 General Cable Replacement ...................................................................................... 9
1.2.2 Industry ...................................................................................................................... 9
1.2.3 POS/Advertising ........................................................................................................ 9
1.2.4 Healthcare and Medical ............................................................................................. 9
1.2.5 Sports and Fitness ..................................................................................................... 9
1.2.6 Entertainment ............................................................................................................ 9
2 Block Diagram ....................................................................................................................... 10
3 Application Interface .............................................................................................................. 11
3.1 Power Supply ................................................................................................................. 11
3.2 Power-up Slew-Rate ....................................................................................................... 11
3.3 Reset .............................................................................................................................. 12
3.4 Serial Interface................................................................................................................ 14
3.4.1 3-Wire Serial Interface ............................................................................................. 15
3.4.2 Baudrate Deviation .................................................................................................. 16
3.5 GPIO Interface ................................................................................................................ 17
3.6 I2C Interface .................................................................................................................... 17
3.7 SPI Serial Peripheral Interface ........................................................................................ 18
3.8 Bluetooth Radio Interface ............................................................................................... 18
3.9 Slow Clock Interface ....................................................................................................... 19
3.9.1 SLCK Specification (External Supplied Signal) ........................................................ 19
3.9.2 32,768 kHz Crystal Oscillator Specification (32k XOSC) .......................................... 19
3.9.3 Connection of an External 32,768 kHz Crystal ......................................................... 20
3.10 Test Mode Enable ........................................................................................................... 20
3.11 Operating in a Power-Switched Environment .................................................................. 21
3.12 Serial Wire Interface ....................................................................................................... 21
4 Module Pins ........................................................................................................................... 22
4.1 Pin Numbering ................................................................................................................ 22
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4.2 Pin Description................................................................................................................ 23
4.2.1 General Pin Description ........................................................................................... 23
4.2.2 Application Specific Pin Description ......................................................................... 24
4.2.2.1 TIO Pin Configuration ........................................................................................... 24
4.3 Handling of Unused Signals ............................................................................................ 25
5 Electrical Characteristics ........................................................................................................ 26
5.1 Absolute Maximum Ratings ............................................................................................ 26
5.2 Electrical Requirements .................................................................................................. 26
5.3 Operating Conditions ...................................................................................................... 26
5.4 Environmental Requirements .......................................................................................... 27
5.5 DC Parameter ................................................................................................................. 27
5.5.1 General Purpose I/O (GPIO) .................................................................................... 27
5.5.2 EXT-RES# ............................................................................................................... 28
5.5.3 External Slow Clock SLCK ....................................................................................... 28
5.6 Power Consumption and Power Down Modes ................................................................ 29
5.6.1 Terminal I/O Configuration ....................................................................................... 29
5.7 RF Performance ............................................................................................................. 31
5.7.1 BLE Receiver ........................................................................................................... 31
5.7.2 BLE Transmitter ....................................................................................................... 32
5.7.3 Antenna-Gain and Radiation Pattern ....................................................................... 34
5.8 Power-Up Time ............................................................................................................... 34
6 Mechanical Characteristics .................................................................................................... 35
6.1 Dimensions ..................................................................................................................... 35
6.2 Recommended Land Pattern .......................................................................................... 35
6.3 Re-flow Temperature-Time Profile .................................................................................. 36
6.4 Placement Recommendation .......................................................................................... 37
6.5 Housing Guidelines ......................................................................................................... 37
6.6 Antenna Issues ............................................................................................................... 37
6.7 Safety Guidelines ............................................................................................................ 38
7 Application Diagram ............................................................................................................... 39
8 Approvals/Certifications ......................................................................................................... 40
8.1 Declaration of Conformity CE .......................................................................................... 40
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8.2 FCC Compliance ............................................................................................................ 40
8.2.1 FCC Grant ............................................................................................................... 41
8.2.2 FCC Statement ........................................................................................................ 42
8.2.3 FCC Caution ............................................................................................................ 42
8.2.4 FCC Warning ........................................................................................................... 42
8.2.5 FCC RF-exposure Statement ................................................................................... 42
8.2.6 FCC Labeling Requirements for the End Product .................................................... 43
8.3 IC Compliance ................................................................................................................ 44
8.3.1 IC Grant ................................................................................................................... 44
8.3.2 IC Statement ............................................................................................................ 44
8.3.3 IC Caution ................................................................................................................ 44
8.3.4 IC RF-exposure Statement ...................................................................................... 45
8.3.5 IC Labeling Requirements for the End Product ........................................................ 45
8.3.6 IC Label Information BlueMod+S ............................................................................. 45
8.4 Bluetooth Qualification .................................................................................................... 45
8.5 RoHS Declaration ........................................................................................................... 46
9 Related Documents ............................................................................................................... 47
10 Packing ............................................................................................................................... 48
10.1 Tape ............................................................................................................................... 49
10.2 Reel ................................................................................................................................ 49
10.3 Package Label ................................................................................................................ 50
11 Ordering Information ........................................................................................................... 51
11.1 Part Numbers.................................................................................................................. 51
11.2 Standard Packing Unit .................................................................................................... 51
11.3 Evaluation Kit .................................................................................................................. 51
12 History ................................................................................................................................. 51
List of Figures
Figure 1: BlueMod+S/AI Block Diagram ........................................................................................ 10
Figure 2: BlueMod+S Example Power Supply with LDO ............................................................... 11
Figure 3: BlueMod+S Example Reset ........................................................................................... 12
Figure 4: Serial Interface Signals .................................................................................................. 14
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Figure 5: BlueMod+S Example Serial Interface (RS-232) Supporting UICP .................................. 15
Figure 6: BlueMod+S Example Serial Interface (Mixed Signal Level) ............................................ 16
Figure 7: BlueMod+S I2C Interface ................................................................................................ 17
Figure 8: BlueMod+S SPI Interface (Example: Master Mode) ....................................................... 18
Figure 9: BlueMod+S connection of external XTAL ....................................................................... 20
Figure 10: BlueMod+S Pin Numbering (Top View) ........................................................................ 22
Figure 11: Typical Antenna Radiation Pattern at 2402MHz ........................................................... 34
Figure 12: Typical Antenna Radiation Pattern at 2441MHz ........................................................... 34
Figure 13: Typical Antenna Radiation Pattern at 2480MHz ........................................................... 34
Figure 14: BlueMod+S/AI Dimensions .......................................................................................... 35
Figure 15: BlueMod+S Land Pattern ............................................................................................. 35
Figure 16: Soldering Temperature-Time Profile (For Reflow Soldering) ........................................ 36
Figure 17: BlueMod+S/AI Placement Recommendation ................................................................ 37
Figure 18: Typical Application Schematics .................................................................................... 39
List of Tables
Table 1: Power up Rise Time Requirements ................................................................................. 11
Table 2: Pin States during Reset ................................................................................................... 13
Table 3: Deviation of Baudrates .................................................................................................... 16
Table 4: 32,768kHz Crystal Oscillator ........................................................................................... 19
Table 5: General Pin Assignment .................................................................................................. 23
Table 6: Application Specific Pin Assignments, TIO ...................................................................... 24
Table 7: Absolute Maximum Ratings ............................................................................................. 26
Table 8: Electrical Requirements .................................................................................................. 26
Table 9: DC Operating Conditions ................................................................................................ 26
Table 10: Environmental Requirements ........................................................................................ 27
Table 11: DC Characteristics, Digital IO ........................................................................................ 27
Table 12: DC Characteristics, EXT-RES# ..................................................................................... 28
Table 13: DC Characteristics, SLCK ............................................................................................. 28
Table 14: Supply Current Sleep Modes, no Radio Activity ............................................................ 29
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Table 15: Supply Current BLE Terminal I/O Profile, Peripheral Device Role ................................. 30
Table 16: RF Performance BLE Receiver ..................................................................................... 31
Table 17: RF Performance BLE Transmitter ................................................................................. 33
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1 Introduction
This Hardware Reference documents how the BlueMod+S/AI can be integrated into customer
systems. It addresses hardware specifications of the BlueMod+S/AI and requirements of the
hardware environments for the BlueMod+S/AI.
Notation: The term BlueMod+S refers to the BlueMod+S/AI and is used as an abbreviation.
For detailed information about software interfaces refer to [5].
For the latest version of this document please check the following URL:
http://www.stollmann.de/en/support/downloads/bluetooth-adapter/bluemod-s.html
1.1 Feature Summary
• Bluetooth specification V4.0 compliant
• Supports Bluetooth low energy
• Fully qualified Bluetooth V4.0 Single Mode LE
• CE certified
• FCC and IC certified
• Nordic nRF51822 inside
• Fast Connection Setup
• RF output power -30 up to +3dBm
• RSSI
• High sensitivity design
• Supply voltage range 1,8V to 3,6V
• Internal crystal oscillator (16 MHz)
• LGA Surface Mount type. BlueMod+S: 17 x 10 x 2.6 mm3
• Pin compatible to Stollmann BlueMod+SR dual mode module
• Shielded to be compliant to FCC full modular approval
• Flexible Power Management
• 128-bit AES encryption
• High-speed UART interface
• I2C Master
• SPI Master/Slave interface
• Low power comparator
• Real Time Counter
• Up to 19 digital IO’s for individual usage by embedded software
• Up to 6 anlog inputs for individual usage by embedded software
• 8/9/10bit ADC
• Arm® CortexTM-M0 core for embedded profiles or application software
• Manufactured in conformance with RoHS2
• Operating temperature -25 ... +75 °C
• Weight: tbd. g
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1.2 Applications
The BlueMod+S is designed to be used in low power applications, like sensor devices. Some
typical applications are described in this chapter.
Supported profiles are:
LE:
• Terminal IO
• any GATT based LE-profile
Support for any additional profile is possible on request.
1.2.1 General Cable Replacement
In case there is no standardized application specific profile available the BlueMod+S offers
Stollmann’s Terminal I/O profile, which allows transparent data transfer over UART and supports
Secure Simple Pairing, making the pairing process easy and the connection secure. Terminal I/O
is available for iOS and Android as well as implemented in Stollmann’s dual mode module
BlueMod+SR.
1.2.2 Industry
BlueMod+S can be used to monitor and control motors, actuators, values and entire processes.
1.2.3 POS/Advertising
BlueMod+S supports iBeacon or similar applications.
1.2.4 Healthcare and Medical
Usage of Bluetooth is aimed mainly at devices that are used for monitoring vital data. Typical
devices are blood glucose meter, blood pressure cuffs and pulse ox meters. Bluetooth BR/EDR
and low energy were chosen by the Continua Health Alliance as transports for interoperable end to
end communication.
1.2.5 Sports and Fitness
In the sports and fitness segment the BlueMod+S is used in devices for positioning as well as
monitoring vital data. Typical devices in this market are heart rate monitors, body temperature
thermometers, pedometers, cadence meters, altimeter, positioning / GPS tracking and watches
displaying information from sensors.
1.2.6 Entertainment
Bluetooth technology is already used in a wide variety of devices in the entertainment sector,
namely set-top boxes / gaming consoles. BlueMod+S is especially suited for use in remote
controls, gaming controller and wireless mouse/keyboard applications.
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3 Application Interface
3.1 Power Supply
BlueMod+S require a power supply with the following characteristics:
Typical: 3,0VDC, min.: 1,8VDC, max.: 3,6VDC, thereby delivering > 25 mA peak
BlueMod+S is designed to be powered from 3V coin cell batteries e.g. CR2032 directly, or any
other power source complying with the given requirements. For optimal performance a stable
supply is recommended.
BlueMod+S
XC6204B-3.3
E-6,F-6
VSUP
GND:
A-7,E-7,F-7,B-[5:8],
C-[5:8],D-8,E-8,F-8
10µ + 100n
1µ
VOUT
VSS
VIN
CE
5 1
3
2
+5VDC
Figure 2: BlueMod+S Example Power Supply with LDO
3.2 Power-up Slew-Rate
Parameter Min Max Unit
VSUP rise time rate
(1), (2)
0 60 ms
(1) 0V to 1,8V
(2) The on-chip power-on reset circuitry may not function properly for rise times outside the
specified interval
Table 1: Power up Rise Time Requirements
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3.3 Reset
BlueMod+S are equipped with circuitry for generating power-up reset from the supply voltage
VSUP, as well as brownout detection.
During power-up, reset is kept until the supply voltage VSUP has reached the minimal operating
voltage. VSUP risetime has to comply with Table 1 for power-up reset to function properly. A reset
is also generated when VSUP falls below the threshold of the brownout detector (1,6V .. 1,7V with
a hysteresis of about 30mV), and is released when VSUP rises above that threshold.
By holding pin B-1 (EXT-RES#) at ≤ VSUP*0,3V for tHOLDRESETNORMAL ≥ 0,2µs, an external reset (pin
reset) is generated. This pin has a fixed internal pull-up resistor (RPU = 11kΩ ... 16kΩ). EXT-RES#
may be left open if not used.
Note:
The reset-functionality associated with pin EXT-RES# is shared with the serial wire debug
feature (refer to 3.12). Inside the BlueMod+S module, EXT-RES# is connected to SWDIO via a
150R resistor. During a debug session the external reset function is not available; asserting of
EXT-RES# to any level should be avoided.
BlueMod+S
E-6,F-6
VSUP
GND
+3V3
EXT-RES# B-1
Reset-Switch is optional
Please Note: EXT-RES# of BlueMod+S has approx. 13k internal pullup.
1k
Reset signal is optional
Host MCU
GPIO
VDD
Figure 3: BlueMod+S Example Reset
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The following table shows the pin states of BlueMod+S during reset active.
Pin Name State: BlueMod+S
EXT-RES# Input with pull-up
(1)
XL-IN/SLCK Input floating (disconnected)
XL-OUT Input floating (disconnected)
UART-TXD Input floating (disconnected)
UART-RXD Input floating (disconnected)
UART-RTS# Input floating (disconnected) with pull-up resistor 470kΩ
(2)
UART-CTS# Input floating (disconnected)
IUR-OUT# Input floating (disconnected)
IUR-IN# Input floating (disconnected)
GPIO[0:14] Input floating (disconnected)
TESTMODE# Input floating (disconnected)
BOOT0 Input floating (disconnected)
SWDIO Input with pull-up
(1)
SWCLK Input with pull-down
(1)
(1) pull-up, pull-down: RPU, RPD is typ. 13kΩ (11kΩ to 16kΩ)
(2) a discrete resistor is used
Table 2: Pin States during Reset
The pin states as indicated in Table 2 are kept until hardware initialization has started.
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3.4 Serial Interface
The serial interface of BlueMod+S is a high-speed UART interface supporting RTS/CTS flow
control and interface-up/down mechanism according to the UICP+ protocol (refer to [3] ). Electrical
interfacing is at CMOS levels (defined by VSUP; see chapter 5.5.1).
• Transmission speeds are 9600 – 921600 bps and 1Mbps (asynchronous)
• Character representation: 8 Bit, no parity, 1 stop bit (8N1)
• Hardware flow-control with RTS and CTS (active low)
Note: Transmission speed may be limited by firmware. See corresponding command reference
[5] for further information.
BlueMod+S
Host
UART-RXD
UART-TXD
UART-CTS#
UART-RTS#
IUR-IN#
IUR-OUT#
Figure 4: Serial Interface Signals
The basic serial interface (with RTS/CTS flow control) uses only four signal lines (UART-RXD,
UART-TXD, UART-CTS#, UART-RTS#). IUR-IN#, IUR-OUT# and GPIO[4] (see below) can be left
unconnected.
A substantially saving of power during idle phases can be achieved (see 5.6.1) when the UICP
protocol is used (refer to [3] ). This protocol should be implemented on the host side as well.
Signals IUR-IN# and IUR-OUT# should be connected to the host and may be mapped to DSR and
DTR, if an RS232-style (DTE-type) interface is used (see Figure 5).
When using the TIO firmware and applications, call control can be supported by GPIO[4]. Driving
GPIO[4] to logic High level during a data transfer phase will “hang up” the connection and
disconnect the Bluetooth link. This signal may be mapped to DSR, if an RS232-style (DTE-type)
interface is used. Please refer to [5] for a functional specification. GPIO[4] can be left unconnected
if this feature is not used.
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3.4.1 3-Wire Serial Interface
When using only GND and UART-RXD, UART-TXD serial lines, leave UART-RTS# and UART-
CTS# open.
Note: It is strongly recommended to use hardware flow control. Not using flow control can cause
a loss of data.
2
BlueMod+S
GND
MAX3241
14
+3V3
22
23
2
3
7
8
4
6
1
9
TXD
RXD
RTS#
CTS#
IUR-OUT#
IUR-IN#
TXD
RXD
RTS
CTS
DTR
DSR
DCD
RI
RS232
DSUB9 (male)
DTE style connector pinout
9
4
10
5
11
6
7
8
19
13
18
12
17
16
15
F-4
D-2
D-7
F-3
B-4
D-5
UART_TXD
UART_RXD
UART_RTS#
UART_CTS#
IUR-OUT#
IUR-IN#
SHDN#
EN#
100n
100n
28
24
1
+3V3
100n 100n 100n
26
3
27
25
V+
VCC
V -
GND
C2+
C2-
C1+
C1-
220R
220R
220R
220R
220R
220R
5
SigGND
can be left open
VSUP
+3V3
Figure 5: BlueMod+S Example Serial Interface (RS-232) Supporting UICP
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VDDIO
(+1.2V .. +3.6V)
BlueMod+S
GND
D-2
F-4
F-3
D-7
UART_RXD
UART_TXD
UART_CTS#
UART_RTS#
10µ+100n+1n
SN74AVC4T245
User Host System
VSUP
XC6204B-3.3
VOUT
VSS
VIN
CE 1µ
100k
100k
VCCB
1B1
1B2
2B1
2B2 2A2
2A1
1A2
1A1
VCCA
1DIR
1OE
2DIR
2OE
(GPIO, Out,
no pu/pd)
(GPIO, Out,
no pu/pd)
TXD
RTS#
RXD
CTS#
+5VDC
OE_DRV#
BT_ENABLE
VDD_HOST (+1.2 .. +3.6V)
+3V3_switched
Figure 6: BlueMod+S Example Serial Interface (Mixed Signal Level)
3.4.2 Baudrate Deviation
The following table shows the deviation in percent of the standard data rates. The deviation may
be caused by the inaccuracy of the crystal oscillator or granularity of the baud rate generator.
Data Rate (bits/s) Deviation (%)
9600
±1%
19200
38400
57600
115200
230400
460800
921600
1000000
Table 3: Deviation of Baudrates
Note: The total deviation of sender and receiver shall not exceed 2,5% to prevent loss of data.
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3.5 GPIO Interface
It is possible to use the programmable digital I/Os GPIO[0:14] on the BlueMod+S. Their behavior
has to be defined project specific in the firmware.
Unused GPIO pins shall be left unconnected to stay compatible. There may be functions assigned
to some in future versions of the firmware.
3.6 I2C Interface1
The I2C bus interface serves as an interface between the internal microcontroller and the serial I2C
bus. BlueMod+S is the master and controls all I2C bus specific sequencing, protocol and timing. It
supports standard (100kHz) and fast (400kHz) speed modes. The BlueMod+S as an I2C master
must be the only master of the I2C bus (no multimaster capability). Clock stretching is supported.
GPIO[1]/I2C-SDA and GPIO[0]/I2C-SCL can be used to form an I2C interface. It is required to
connect 4k7 pull-up resistors on I2C-SCL and I2C-SDA when this interface is used.
I2C-SCL
I2C-SDA
GPIO[0]/I2C-SCL
GPIO[1]/I2C-SDA
BlueMod+S
VSUP
Rpu
+3.3V
B-2
D-3
E-6,F-6
+3.3V
Rpu
+3.3V
4k7
4k7
Figure 7: BlueMod+S I2C Interface
1 subject to firmware support, contact Stollmann for current status
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3.7 SPI Serial Peripheral Interface2
The serial peripheral interface (SPI) allows for full-duplex, synchronous, serial communication with
external devices. The interface can be configured as the master and then provides the
communication clock (SCK) to the external slave device(s), or as the slave. The SPI Interface
supports SPI-modes 0 through 3. Module pins are used as follows:
• GPIO[2]: SPI-MOSI
• GPIO[5]: SPI-MISO
• GPIO[8]: SPI-SCK
GPIO[8]/SPI-SCK
GPIO[2]/SPI-MOSI
BlueMod+S
E-2
SPI-Master
connected device
SPI-Slave
GPIO[5]/SPI-MISO
D-1
F-2
SCK, SPI_CLK
SDI, MOSI
SDO, MISO
typical signals:
Figure 8: BlueMod+S SPI Interface (Example: Master Mode)
3.8 Bluetooth Radio Interface
The BlueMod+S/AI presents an integrated ceramic antenna.
It is highly recommended that you follow the design rule given in the Stollmann Application Note on
Antenna design [4].
2 subject to firmware support, contact Stollmann for current status
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3.9 Slow Clock Interface
Even though an external slow clock is not required for BLE operation, consumption of power during
power-down modes can be reduced by feeding the module with an optional 32,768 kHz slow clock
at pin XL-IN/SLCK, or connecting an XTAL (32,768kHz) and two capacitors C1, C2 at pins XL-IN
and XL-OUT.
3.9.1 SLCK Specification (External Supplied Signal)
• 32,768 kHz +/-250ppm; duty cycle 30...70%.
• Signal may be a sine wave, a clipped sine wave, a square wave or a rail-to-rail digital
signal. The amplitude must be at least 200mVpp. DC offset is not an issue as long as the
input voltage is between VSS and VDD at all times.
• connect signal SLCK to XL-IN/SLCK (A6) and leave XL-OUT (A5) open
3.9.2 32,768 kHz Crystal Oscillator Specification (32k XOSC)
Symbol Item Condition Limit Unit
Min Typ Max
fNOM Crystal Frequency Tamb = 25°C 32,768 kHz
fTOL Frequency Tolerance for
BLE applications including temperature
and aging (1) +/-250 ppm
CL Load Capacitance 9 12,5 pF
C0 Shunt Capacitance 2 pF
RS Equivalent Series Resistor 50 80 kΩ
PD Drive Level 1 µW
Cpin Input Cap. on XL-IN and
XL-OUT 4 pF
(1) adjust crystal frequency by choosing correct value for C1, C2 (value depends on C
L
of crystal
and layout)
Table 4: 32,768kHz Crystal Oscillator
The module’s firmware will detect the presence of a slow clock during the boot process and switch
behavior appropriately.
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3.9.3 Connection of an External 32,768 kHz Crystal
Connect the 32,768 kHz crystal and two capacitors C1, C2 at pins A-6 (XL-IN/SLCK) and A-5 (XL-
OUT). The crystal has to comply with specifications given in Table 1. The exact value of C1 and C2
depends on the crystal and the stray capacitance of the layout. Select C1, C2 such that the slow
clock oscillator operates at the exact frequency at room temperature (25°C). The crystal and the
capacitors shall be located close to pins A-5, A-6. Avoid long signal traces.
CL = (C1+Cpin+Cs) * (C2+Cpin+Cs) / (C1+C2+2*Cpin+2*Cs)
Cpin: see Table 4
Cs: stray capacitance, depends on layout
Figure 9: BlueMod+S connection of external XTAL
3.10 Test Mode Enable
For homologation purposes the ability of testmode operation like "Direct two wire UART Testmode"
is mandatory. The Direct Test Mode (as defined by the Bluetooth SIG) and additional test functions
are part of the BlueMod+S TIO-Firmware. Please refer to [7] and [8].
To enter and use test modes or DTM, access to the following signals is required:
• BOOT0
• TESTMODE#
• UART-RXD
• UART-TXD
• UART-CTS#
• GND
These pins shall be routed to some test pads on an outer layer, but can be left open during normal
operation when not used.
Please note the UART is required for operation of test modes. During the homologation process,
UART-RXD and UART-TXD must be freely accessible and connected via some RS232 level shifter
to the test equipment (like R&S CBT), whereas UART-CTS# must be set "active" (continuous low-
level) to allow serial communication.
XL-IN/SLCK
BlueMod+S
A-6
Slow Clock
XL-OUT
A-5
32,768kHz
CL: 9pF
C1
C2
C1, C2 ~ 12pF
BlueMod+S/AI
www.stollmann.de Page 21 of 52
3.11 Operating in a Power-Switched Environment
A potential "back feeding" problem may arise, if the module is operated in an environment where
its power supply (VSUP) is switched off by the application. This might be done to save some power
in times Bluetooth is not needed.
As stated in Table 7, the voltage on any I/O pin must not exceed VSUP by more than 0,3V at any
time. Otherwise some current IINJ flows through the internal protection diodes. This may damage
the module (please refer to chapter 5.1 for limits).
There is no problem if the application circuit design and programming can assure that all signals
directed towards BlueMod+S are set to low (U < 0,3V) before and while VSUP is turned off. If this
is not guaranteed, at least a series resistor (about 1k) must be inserted into each signal path. This
does protect the module but obviously cannot prevent from an unwanted, additional current flow in
case of such signal being at high-level. It may be necessary to use driver chips in such appli-
cations, that gate off these signals while VSUP is not present.
3.12 Serial Wire Interface
The Serial Wire interface (SWDIO, SWCLK) is normally not used in a customer’s product. It is
reserved for debugging purposes.
Leave SWDIO, SWCLK unconnected. Only if you intend to use them for debugging purposes,
make them available. Please be aware of the nRF51822 pin sharing SWDIO/nRESET (refer to [1]).
On the BlueMod+S module, pin EXT-RES# is decoupled from SWDIO by a 150 Ω resistor; SWDIO
is connected directly to pin SWDIO/nRESET of the nRF51822 chip. Nevertheless, avoid driving
EXT-RES# to any logic level while in debug mode, since EXT-RES# will also be driven by the
BlueMod+S or the debugger, when SDIO is driven by either of these.
During any debugging session the external pushbutton reset functionality is not available. Please
use the correct reset options of your serial wire debugger. Alternatively, power-off the system,
remove the debugger and power-up again (refer to [1], Chapter 10 Debugger Interface (DIF)).
BlueMod+S/AI
www.stollmann.de Page 23 of 52
4.2 Pin Description
4.2.1 General Pin Description
Type: PU - pull-up; PD – pull-down; PWR – Power; I – Input; O – Output; I/O – bidir.; OD – open drain; PP – push/pull;
RF: RadioFreq; I-DIS – Input Buffer Disconnected
Pin Name
Signal
Type
Act
Function
Alternate Function
E-6
VSUP1
PWR
+3,0V nom.
F-6
VSUP2
PWR
+3,0V nom
C-1
not connected
none
A-7, E-7, F-7,
B-[5,6,7,8],
C-[5,6,7,8],
D-8, E-8, F-8
GND PWR Ground
A-8
ANT
RF (4)
reserved
reserved
B-1
EXT-RES#
I-PU
L
User Reset
A-6
XL-IN/SLCK
I/O (3,5)
32,768kHz Slow Clock / XTAL
AIN1
F-4
UART-TXD
O-PP
IUR Data OUT (6)
D-2
UART-RXD
I-PU
IUR Data IN (6)
D-7
UART-RTS#
O-PU (1)
L
Flow Control/IUC
F-3
UART-CTS#
I-PD
L
Flow Control/IUC (6)
B-4
IUR-OUT#
O-PP
L
UICP Control
D-5
IUR-IN#
I-PD
L
UICP Control
D-3
GPIO[0]
I/O (3,5)
GPIO (3)
I2C-SCL, AIN7, AREF1
B-2
GPIO[1]
I/O (3,5)
GPIO (3)
I2C-SDA, AIN6
D-1
GPIO[2]
I/O (3,5)
GPIO (3)
SPI-MOSI
E-4
GPIO[3]
I/O (3,5)
GPIO (3)
D-4
GPIO[4]
I/O (3,5)
GPIO (3)
F-2
GPIO[5]
I/O (3,5)
GPIO (3)
SPI-MISO, AREF0
C-4
GPIO[6]
I/O (3,5)
GPIO (3)
C-3
GPIO[7]
I/O (3,5)
GPIO (3)
E-2
GPIO[8]
I/O (3,5)
GPIO (3)
SPI-SCK, AIN2
A-3
not connected
none
A-1
GPIO[10]
I/O (3,5)
GPIO (3)
A-4
not connected
none
A-2
GPIO[9]
I/O (3,5)
GPIO (3)
F-1
TESTMODE#
I-PU
L
Testmode Enable (6)
AIN3
E-1
BOOT0
I-PD
reserved (6)
AIN4
E-3
SWDIO
I/O-PU
serial wire
D-6
SWCLK
I-PD
serial wire
C-2
GPIO[13]
I/O (3,5)
GPIO (3)
B-3
GPIO[11]
I/O (3,5)
GPIO (3)
AIN5
A-5
XL-OUT
I/O (3,5)
GPIO (3) / ext. XTAL 32,768kHz
AIN0
F-5
GPIO[14]
I/O (3,5)
GPIO (3)
E-5
GPIO[12]
I/O (3,5)
GPIO (3)
Notes:
(1) a discrete resistor is used
(3) function depends on firmware
(4) DNU: Do Not Use, Do Not Connect
(5) GPIO pin. These pins may be programmed as analog-in, i-disconnected, i-float, i-pu, i-pd, o-pp (output push/pull),
o-od (output open drain), o-os (output open source) or some alternate function; refer to [1], [2]
(6) signal must be accessible for homologation purposes. Refer to 3.10 Test Mode Enable
Table 5: General Pin Assignment
BlueMod+S/AI
www.stollmann.de Page 24 of 52
4.2.2 Application Specific Pin Description
4.2.2.1 TIO Pin Configuration
Type: PU – Pull-up; PD – pull-down; PWR – Power; I – Input; O – Output; I/O – bidir.; OD – open drain: PP – push/pull;
RF: RadioFreq; I-DIS – Input Buffer Disconnected
Pin Name
Signal
TIO-Function
Type
Act
Description
E-6
VSUP1
Power
PWR
+3,3V nom.
F-6
VSUP2
Power
PWR
+3,3V nom
C-1
not connected
none
A-7,E-7,F-7,
B-[5,6,7,8],
C-[5,6,7,8],
D-8, E-8, F-8
GND Power PWR Ground
A-8
ANT
DNU (4)
RF
leave open
B-1
EXT-RES#
Reset
I-PU
L
User Reset
A-6
XL-IN/SLCK
SLCK / XTAL
I
32,768kHz Slow Clock (optional)
F-4
UART-TXD
TXD
O-PP
IUR Data OUT (6)
D-2
UART-RXD
RXD
I-PU
IUR Data IN (6)
D-7
UART-RTS#
/RTS
O-PP (1)
L
Flow Control/IUC; refer to [3]
F-3
UART-CTS#
/CTS
I-PD
L
Flow Control/IUC; refer to [3] (6)
B-4
IUR-OUT#
/IUR-OUT
O-PP (3)
L
UICP Control; refer to [3]
D-5
IUR-IN#
/IUR-IN
I (3)
L
UICP Control; refer to [3]
D-3 SCL
GPIO[0]
GPIO[0] (3)
I/O (3)
GPIO (3) [I2C-SCL]
B-2 SDA
GPIO[1]
GPIO[1] (3)
I/O (3)
GPIO (3) [I2C-SDA]
D-1 IOC
GPIO[2]
IOC (3)
I/O (3)
GPIO (3) [SPI-MOSI]
E-4 IOB
GPIO[3]
IOB (3)
I/O (3)
GPIO (3)
D-4
GPIO[4]
HANGUP
I-PD
optional; refer to [5]
F-2 IOD
GPIO[5]
IOD (3)
I/O (3)
GPIO (3) [SPI-MISO]
C-4
GPIO[6]
reserved
I-DIS
GPIO (3)
C-3
GPIO[7]
GPIO7
I-DIS
GPIO (3)
E-2 IOA
GPIO[8]
IOA (3)
I/O (3)
GPIO (3) [SPI-SCK] [DEVICE READY#]
A-3
not connected
none
none
A-1
GPIO[10]
DNU (4)
I-DIS
leave open
A-4
not connected
none
none
A-2
GPIO[9]
DNU (4)
I-DIS
leave open
F-1
TESTMODE#
reserved
I-PU
L
connect to test pad (6)
E-1
BOOT0
reserved
I-PD
connect to test pad (6)
E-3
SWDIO
reserved
I/O-PU
leave open (serial wire)
D-6
SWCLK
reserved
I-PD
leave open (serial wire)
C-2
GPIO[13]
DNU (4)
I-DIS
leave open
B-3
GPIO[11]
DNU (4)
I-DIS
leave open
A-5
XL-OUT
XTAL
I-DIS
leave open if no ext. XTAL is connected
F-5
GPIO[14]
DNU (4)
I-DIS
leave open
E-5
GPIO[12]
DNU (4)
I-DIS
leave open
Notes:
(1) a discrete resistor is used
(3) function depends on firmware. If function can be enabled using an AT-command, type is I-DIS when not enabled
(4) DNU: Do Not Use, Do Not Connect
(6) signal must be accessible for homologation purposes. Refer to 3.10 Test Mode Enable
Table 6: Application Specific Pin Assignments, TIO
BlueMod+S/AI
www.stollmann.de Page 25 of 52
4.3 Handling of Unused Signals
Depending on the application, not all signals of BlueMod+S may be needed. The following list
gives some hints how to handle unused signals.
• EXT-RES# If no external Reset is needed: Leave open
• BOOT0 leave open (1)
• XL-IN/SLCK If no external slow clock is provided: Leave open
• XL-OUT If no external XTAL is connected: Leave open
• UART-RTS#, UART-CTS# If neither flow control nor UICP is used: Leave open (1)
• IUR-OUT#, IUR-IN# If UICP is not used: leave open
• TESTMODE# Leave open (1)
• unused GPIOs Leave open
• SWDIO, SWCLK Leave open. Only needed for debug purposes.
Please note, to keep compatibility with future feature enhancements, unused signals shall not be
connected directly to VSUP or GND. Leave open.
(1) Signals must be accessible during the homologation process, refer to 3.10 Test Mode Enable.
BlueMod+S/AI
www.stollmann.de Page 26 of 52
5 Electrical Characteristics
5.1 Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage
to the device. These are stress ratings only, and functional operation of the device at these or any
other conditions beyond those indicated under “Electrical Requirements” is not implied. Exposure
to absolute-maximum-rated conditions for extended periods may affect device reliability.
Item Symbol Absolute Maximum Ratings Unit
Supply voltage VSUP -0,3 to +3,6 V
Voltage on any pin VPin -0,3 to VSUP+0,3 V
Injected current into
any GPIO pin
Max. per package
IINJ
IINJ_package
40
100
mA
mA
Table 7: Absolute Maximum Ratings
5.2 Electrical Requirements
VSUP = 3,3V, Tamb = 25°C if nothing else stated
Item Condition Limit Unit
Min Typ Max
Frequency Range 2400 2483.5 MHz
Load impedance Measured with network
analyzer in the frequency
range at antenna pin 50 Ohm
Output return loss Receive Mode to 50Ω load
Transmit Mode to 50Ω load
-10
-10 dB
Table 8: Electrical Requirements
5.3 Operating Conditions
Tamb = 25°C
Item Condition Limit Unit
Min Typ Max
Supply voltage VSUP normal mode (DC/DC not enabled) 1,8 3,0 3,6 VDC
Table 9: DC Operating Conditions
BlueMod+S/AI
www.stollmann.de Page 27 of 52
5.4 Environmental Requirements
Item Symbol Absolute Maximum Ratings Unit
Storage temperature range Tstg -40 to +85 °C
Operating temperature range Top -25 to +75 °C
Table 10: Environmental Requirements
5.5 DC Parameter
All Module I/O pins are connected directly to the Nordic nRF51822 chip without signal conditioning
except for some pull-up/pull-down resistors (as indicated). Therefore the electrical characteristics
are as documented in the Nordic nRF51822 data sheet [2].
5.5.1 General Purpose I/O (GPIO)
Tamb = 25°C
Symbol
Item
Condition
Limit
Unit
Min Typ Max
VIL Low-Level Input Voltage VSUP = 1,8 to 3,6V VSS - VSUP*0,3 V
VIH High-Level Input Voltage VSUP = 1,8 to 3,6V VSUP*0,7 - VSUP V
VOL Low-Level Output
Voltage
IOL = 0,5mA
(1)
IOL = 5,0mA (2), (3)
VSS
VSS - 0,3
0,3 V
VOH High-Level Output
Voltage
IOH = -0,5mA
(1)
IOH = -5,0mA (2), (3)
VSUP-0,3
VSUP-0,3 - VSUP
VSUP V
IOL Low -Level Output
Current VOL ≤ 0,3V - - -0,5mA
(1)
-5,0mA (2), (3) mA
IOH High-Level Output
Current VSUP-0,3V ≤ VOH ≤
VSUP - - 0,5mA
(1)
5,0mA (2), (3) mA
RPU pull-up resistor 11 13 16 kΩ
RPD pull-down resistor 11 13 16 kΩ
Ilc I/O pad leakage current -3,5 0,01 +3,5 nA
Cl Input Capacitance 2,5 pF
(1) drive = std
(2) drive = hi
(3) maximal number of pins (per package) with high drive is 3
Table 11: DC Characteristics, Digital IO
BlueMod+S/AI
www.stollmann.de Page 28 of 52
5.5.2 EXT-RES#
Input EXT-RES# has a Schmitt-Trigger characteristic and an internal pull-up resistor.
Tamb = 25°C
Symbol Item Condition Limit Unit
Min Typ Max
VIL Low-Level Threshold VSUP = 1,8 to 3,6V 0,34*VSUP V
VIH High-Level Threshold VSUP = 1,8 to 3,6V 0,62*VSUP V
VHYST Hysteresis VSUP = 3,0V 800 mV
RPU pull-up resistor 11 13 16 kΩ
Cl Input Capacitance 2,5 pF
Table 12: DC Characteristics, EXT-RES#
5.5.3 External Slow Clock SLCK
The following table is applicable if an external slow clock signal is fed into XL-IN/SLCK. This may
be a square wave, a clipped sine wave, a sine wave or a rail-to-rail digital signal. Frequency must
be 32,768kHz +/-250ppm (refer to 3.9). DC offset is not an issue as long as the input voltage is
between VSS and VSUP at all times. Firmware will detect presence of external slow clock signal at
startup; signal has to stay active as long as the BlueMod+S is powered.
Tamb = 25°C
Symbol Item Condition Limit Unit
Min Typ Max
VSLCKL Low-Level Input Voltage VSUP = 1,8 to 3,6V 0,0 - VSUP-VSLCK V
VSLCKH High-Level Input Voltage VSUP = 1,8 to 3,6V VSUP-VSLCK - VSUP V
VSLCK (1) Amplitude (peak_peak) VSUP = 1,8 to 3,6V 0,2 - VSUP V
Cl Input Capacitance 4 pF
(1) input voltage required between VSS and VSUP at all times
Table 13: DC Characteristics, SLCK
BlueMod+S/AI
www.stollmann.de Page 29 of 52
5.6 Power Consumption and Power Down Modes
5.6.1 Terminal I/O Configuration
The following values are typical power consumption values in the different states.
VSUP = 3,0V, Tamb = 25°C, all GPIOs open, UART inputs at VSUP or GND, SLCK: 32,768 kHz
Condition Note Slow
clock
SLCK
Current
Consumption Unit
IAvg
Advertising Off, UICP not active or serial interface up
internal
ext. sig.
ext. XTAL
tbd.
tbd.
1,1
mA
Advertising Off, UICP active, serial interface down (1)
internal
ext. sig.
ext. XTAL
tbd.
tbd.
4
µA
Device in reset (2) 0,625 mA
(1) IUR-IN# and UART-CTS# signals connected to CMOS high level
(2) same current consumption w. internal or external slow clock
Table 14: Supply Current Sleep Modes, no Radio Activity
BlueMod+S/AI
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The following table shows the average power consumption of BlueMod+S operating in the
peripheral device role.
VSUP = 3,0V, Tamb = 25°C, all GPIO lines left open, SLCK: 32,768 kHz
Condition Note Slow
clock
SLCK
Current
Consumption Unit
Tx power (dBm)
(8)
max (+4) min (-30)
IAvg IAvg
Standby, Advertising on 3 channels, advertising interval: 1,28s, UICP
not active or serial interface up (5)
internal (7)
ext. sig.
ext. XTAL
tbd.
tbd.
1,2
tbd.
tbd.
1,2
mA
Standby, Advertising on 3 channels, advertising interval: 1,28s, UICP
active and serial interface down (1)
internal (7)
ext. sig.
ext. XTAL
tbd.
tbd.
28
tbd.
tbd.
9,5
µA
Connected, connection interval: 7,5 ms, no data traffic (2,3) (6) 2,2 1,95 mA
Connected, connection interval: 7,5 ms, data traffic 115 kbit/s at the
serial port, central to peripheral (2) (6) 5,2 4,7 mA
Connected, connection interval: 7,5 ms, data traffic 115 kbit/s at the
serial port, peripheral to central (2) (6) 3,4 3,2 mA
Connected, connection interval: 37,5ms, no data traffic (2,4)
internal (7)
ext. sig.
ext. XTAL
tbd.
tbd.
1,4
tbd.
tbd.
1,4
mA
Connected, connection interval: 37,5ms, data traffic 115 kbit/s at the
serial port, peripheral to central (2,4) (6) 2,0 1,9 mA
(1) UART-CTS#, IUR-IN#, UART-RXD driven to CMOS high level, all UART output lines left open
(2) connection parameters are setup by the central device when connection is established
(3) no data to be transmitted, central device sends an empty packet (80 bit) then peripheral device
answers (empty packet: 80 bit)
(4) these are a typical connection parameters used by an iPhone, iPad or iPad mini device in the
central device role
(5) UART-inputs connected to GND or VSUP; UART output lines left open
(6) same current consumption w. internal or external slow clock
(7) RC oscillator internal to nRF51822, periodically trimmed by S-device
(8) Tx power as set by AT command
Table 15: Supply Current BLE Terminal I/O Profile, Peripheral Device Role
BlueMod+S/AI
www.stollmann.de Page 31 of 52
5.7 RF Performance
5.7.1 BLE Receiver
VSUP = 1,8V to 3,6V, Tamb = +20°C
Measured conducted according to BT specification RF-PHY.TS/4.0.1
Receiver Frequ
/GHz Min Typ Max BT
Spec Unit
Sensitivity at 30,8% PER
2,402
-88,5
-70
≤ -70 dBm
2,440
-88,5
-70
2,480
-88,5
-70
Reported PER during PER
report integrity test 2,426 50 50 65,4
50
< PER
< 65,4
%
Maximum received signal at 30,8% PER
-10
0
≥ -10
dBm
Continuous power required to
block Bluetooth reception at
-67dBm with 0,1% BER
0,030 - 2,000
-30
tbd.
-30
dBm
2,000 - 2,400
-35 tbd. -35
2,500 - 3,000
-35 tbd. -35
3,000 - 12,75
-30
tbd.
-30
C/I co-channel
10
21
≤21
dB
Adjacent channel
Selectivity C/I
F = F
0
+ 1 MHz
1
15
≤15
dB
F = F
0
- 1 MHz
1
15
≤15
dB
F = F
0
+ 2 MHz
-25
-17
≤-17
dB
F = F
0
- 2 MHz
-25 -15 ≤-15 dB
F = F
0
+ 3 MHz
-51
-27
≤-27
dB
F = F
0
- 5 MHz
-51
-27
≤-27
dB
F = F
image
-30
-9
≤-9
dB
Maximum level of intermodulation interferers
-50
-36
≥-50
dBm
VSUP = 1,8V to 3,6V, Tamb = -25°C
Measured conducted according to BT specification RF-PHY.TS/4.0.1
Receiver Frequ
/GHz Min Typ Max BT
Spec Unit
Sensitivity at 30,8% PER
2,402
-88,5
-70
≤ - 70 dBm
2,440
-88,5
-70
2,480
-88,5
-70
Reported PER during PER
report integrity test 2,426 50 n/a 65,4
50
< PER
< 65,4
%
Maximum received signal at 30,8% PER
-10
n/a
≥ -10
dBm
VSUP = 1,8V to 3,6V, Tamb = +75°C
Measured conducted according to BT specification RF-PHY.TS/4.0.1
Receiver Frequ
/GHz Min Typ Max BT
Spec Unit
Sensitivity at 30,8% PER
2,402
-88,5
-70
≤ . 70 dBm
2,440
-88,5
-70
2,480
-88,5
-70
Reported PER during PER
report integrity test 2,426 50 n/a 65,4
50
< PER
< 65,4
%
Maximum received signal at 30,8% PER
-10
n/a
≥ -10
dBm
Table 16: RF Performance BLE Receiver
BlueMod+S/AI
www.stollmann.de Page 32 of 52
5.7.2 BLE Transmitter
VSUP = 1,8V to 3,6V, Tamb = +20°C
Measured conducted according to BT specification RF-PHY.TS/4.0.1
Transmitter Frequ
/GHz Min Typ Max BT
Spec Unit
RF Transmit Power
2,402
-20 2,6 10 -20 to
+10 dBm
2,440
-20
3,0
10
2,480
-20
2,8
10
ACP
F = F
0
± 2MHz
-42
≤ -30
dBm
F = F
0
± 3MHz
-50
≤ -30
F = F
0
± > 3MHz
<-55
≤ -30
∆f
1avg
maximum modulation
225 246 275
225
< f1avg
< 275
kHz
∆f
2max
minimum modulation (test threshold 185 kHz)
99,9 100 ≥ 99,9 %
∆f
2avg
/ ∆f
1avg
0,8 0,91 ≥ 0,8
Frequency Offset
-150
±20
+150
± 150
kHz
Carrier drift rate
9 20 ≤ 20
kHz/
50µs
Carrier drift
16
50
≤ 50
kHz
BlueMod+S/AI
www.stollmann.de Page 33 of 52
VSUP = 1,8V to 3,6V, Tamb = -25°C
Measured conducted according to BT specification RF-PHY.TS/4.0.1
Transmitter Frequ
/GHz
Min Typ Max BT
Spec
Unit
RF transmit Power
2,402
-20
3,0
10
-20 to
+10 dBm
2,440
-20
3,5
10
2,480
-20
3,1
10
ACP
F = F
0
± 2MHz
-37 ≤ -30
dBm
F = F
0
± 3MHz
-46 ≤ -30
F = F
0
± > 3MHz
<-51
≤ -30
Frequency Offset
-150
±35
+150
± 150
kHz
Carrier drift rate
10 20 ≤ 20
kHz/
50µs
Carrier drift
25
50
≤ 50
kHz
VSUP = 1,8V to 3,6V, Tamb = +75°C
Measured conducted according to BT specification RF-PHY.TS/4.0.1
Transmitter Frequ
/GHz Min Typ Max BT
Spec Unit
RF transmit Power
2,402
-20
1,5
10
-20 to
+10 dBm
2,440
-20
1,9
10
2,480
-20 1,7 10
ACP
F = F
0
± 2MHz
-42 -20 ≤ -30
dBm
F = F
0
± 3MHz
-50
-40
≤ -30
F = F
0
± > 3MHz
<-53
-30
≤ -30
Frequency Offset
-150
±35
+150
± 150
kHz
Carrier drift rate
10 20 ≤ 20
kHz/
50µs
Carrier drift
20
50
≤ 50
kHz
Table 17: RF Performance BLE Transmitter
BlueMod+S/AI
www.stollmann.de Page 34 of 52
5.7.3 Antenna-Gain and Radiation Pattern
If BlueMod+S/AI is integrated into an end product while the recommendations depicted in 6.4
Placement Recommendation are maintained, the following typical antenna radiation patterns can
be expected.
Radiation Pattern will depend on the end products PCB size, masses in the antenna environment,
housing material and geometrics.
tbd.
Figure 11: Typical Antenna Radiation Pattern at 2402MHz
tbd.
Figure 12: Typical Antenna Radiation Pattern at 2441MHz
tbd.
Figure 13: Typical Antenna Radiation Pattern at 2480MHz
5.8 Power-Up Time
The time until the BlueMod+S is able to accept link requests or serial data depends on the
firmware version. In the TIO firmware version tbd. the module is command ready after at least tbd.
s. Bluetooth links are accepted tbd. s after reset.
Note: For further information refer to the document BlueMod+S_Startup_Timing
BlueMod+S/AI
www.stollmann.de Page 35 of 52
6 Mechanical Characteristics
6.1 Dimensions
17,0
+0,2
-0,0
FCC ID RFRMS
stollmann
BlueMod+S
2,510,0
+0,2
-0,0
0,1
+0,1
-0,1
0,1
+0,1
-0,1
Verbleibende Stege nach Nutzentrennung/
remaining break tabs after separation
2,6
Figure 14: BlueMod+S/AI Dimensions
6.2 Recommended Land Pattern
F1
E1
D1
C1
B1
A1 A2 A3 A4 A5 A6 A7 A8
F2
E2
D2
C2
B2
F3
E3
D3
C3
B3
F4
E4
D4
C4
B4
F5
E5
D5
C5
B5
F6
E6
D6
C6
B6
F7
E7
D7
C7
B7
F8
E8
D8
C8
B8
1,25
1,25
7x1,5=10,5
5x1,5=7,5
0,9
17,0
10,0
Figure 15: BlueMod+S Land Pattern
Note: All dimensions are in mm.
BlueMod+S/AI
www.stollmann.de Page 36 of 52
6.3 Re-flow Temperature-Time Profile
The data here is given only for guidance on solder and has to be adapted to your process and
other re-flow parameters for example the used solder paste. The paste manufacturer provides a re-
flow profile recommendation for his product.
Figure 16: Soldering Temperature-Time Profile (For Reflow Soldering)
Preheat Main Heat Peak
tsmax tLmax tpmax
Temperature Time Temperature Time Temperature Time
[°C] [sec] [°C] [sec] [°C] [sec]
150
100
217 90 260
10
230 50
Average ramp-up rate [°C / sec] 3
Average ramp-down rate [°C / sec] 6
Max. Time 25°C to Peak
Temperature [min.] 8
Opposite side re-flow is prohibited due to module weight.
Devices will withstand the specified profile and will withstand up to 1 re-flows to a maximum
temperature of 260°C. The reflow soldering profile may only be applied if the BlueMod+S resides
on the PCB side looking up. Heat above the solder eutectic point while the BlueMod+S is mounted
facing down may damage the module permanently.
BlueMod+S/AI
www.stollmann.de Page 37 of 52
6.4 Placement Recommendation
To achieve best radio performance for BlueMod+S/AI, it is recommended to use the placement
shown in Figure 17. This is a “corner placement” meaning the BlueMod+S/AI is placed such that
the antenna comes close to the corner of the application PCB (red area). So, the yellow area is
outside the PCB and regards to the housing, too (refer to 6.5).
Please note that for best possible performance the antenna should be directed away from the
application PCB as shown in Figure 17.
max.0,5 4,5
10
10
max.0,5
10
15
no bare copper (exept solder pads for module)
no copper and components on any layer
no components on any layer
provide solid ground plane(s) as large as possible around
17
do not place any conductive parts in this area
20
20
40
area
Applic. PCB
Figure 17: BlueMod+S/AI Placement Recommendation
6.5 Housing Guidelines
The individual case must be checked to decide whether a specific housing is suitable for the use of
the internal antenna. A plastic housing must at least fulfill the following requirements:
• Non-conductive material, non-RF-blocking plastics
• No metallic coating
• ABS is suggested
6.6 Antenna Issues
BlueMod+S/AI comprises a ceramic antenna which as a component is soldered to the circuit
board. This solution is functional for a BlueMod+S/AI integrated into a plastic housing.
The performance of the antenna has to be checked within the final integration environment.
Adjacent PCBs, components, cables, housings etc. could otherwise influence the radiation pattern
or be influenced by the radio wave energy. It must be ensured that the antenna is not co-located or
operating in conjunction with any other antennas, transmitters, cables or connectors.
BlueMod+S/AI
www.stollmann.de Page 39 of 52
7 Application Diagram
The following schematic shows a typical application of BlueMod+S. The module is connected to
some MCU running the application layer. MCU and BlueMod+S use the same 3,3V power supply.
The serial interface has RTS/CTS flow control and UICP support in this example. The optional
hangup feature to close down the link is provided. As an option to save power, there is an external
slow clock oscillator. All other module pins may be left unconnected.
Host MCU
VDD
GND
+3V3
GPIO (o)
In this example BlueMod+S is connected to an MCU supporting UICP, RTS/CTS flow control and Hangup.
The slow clock oscillator (32,768kHz ) is optional; it helps to save power during power down states.
1k
BlueMod+S/AI
E-6,F-6 VSUP
B-1 EXT-RES#
UART-RXD
UART-TXD
UART-CTS#
UART-RTS#
GPIO[4]/Hangup
TXD (o)
RXD (i)
RTS# (o)
CTS# (i)
GPIO (o)
XL-IN/SLCK
32,768kHz square
or clipped sine
+3V3
The oscillator is optional. Leave A-6 open
if the oscillator is not present.
You can also connect an 32,768kHz XTAL
and two capacitors at A-6 and A-5.
B-4
D-4
A-6
all GND pads (14) must be connected.
Blocking capacitors not shown.
pushpull or OD
pushpull
A-5 XL-OUT
D-2
F-4
F-3
D-7
IUR-IN#
D-5
IUR-OUT#
GPIO/DSR# (o)
GPIO/DTR# (i)
Figure 18: Typical Application Schematics
BlueMod+S/AI
www.stollmann.de Page 40 of 52
8 Approvals/Certifications
The BlueMod+S/AI has been tested to comply to the appropriate EU, FCC and IC directives.
CE testing is intended for end products only. Therefore CE testing is not mandatory for a Bluetooth
Module sold to OEM’s. However Stollmann E+V GmbH provides CE tested Modules for customers
in order to ease CE compliance assessment of end products and to minimize test effort.
8.1 Declaration of Conformity CE
The BlueMod+S/AI fully complies with the essential requirements of the following EU directives:
• R&TTE 1999/5/EC
• RoHS 2011/65/EC
The actual version of EU Declaration of Conformity (EU DoC) can be downloaded from the
qualification section on the product page via the following link:
http://www.stollmann.de/en/support/downloads/bluetooth-adapter/bluemod-s.html
The above link may expire, because a new version of the EU DoC is available. Please look up the
EU DoC from the Stollmann web site directly then.
8.2 FCC Compliance
The BlueMod+S/AI has been tested to fulfill the FCC requirements. Test reports are available on
request. Grants of the Full Modular Approval will be shown below.
BlueMod+S/AI
www.stollmann.de Page 42 of 52
8.2.2 FCC Statement
This device complies with 47 CFR Part 2 and Part 15 of the FCC Rules and with.
Operation is subject to the following two conditions:
(1) this device my not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause
undesired operation.
8.2.3 FCC Caution
Warning: Changes or modifications made to this equipment not expressly approved by Stollmann
Entwicklungs- und Vertriebs- GmbH may void the FCC authorization to operate this equipment.
8.2.4 FCC Warning
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the following
measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
Consult the dealer or an experienced radio/TV technician for help.
8.2.5 FCC RF-exposure Statement
The BlueMod+S/AI complies with the FCC/IC RF radiation exposure limits set forth for an
uncontrolled environment.
The output power is < 10mW EIRP and therefore according to “FCC KDB 447498 D01 General RF
Exposure Guidance v05” Appendix A, table “SAR Exclusion Threshold”, excluded from SAR testing
for test separation distances ≥ 5mm and if it is not used in co-locations with other antennas. If the
product implementing the BlueMod+S/AI has other antennas in co-location or separation distances
< 5mm an FCC TCB should be asked for a Class II Permissive Change.
BlueMod+S/AI
www.stollmann.de Page 44 of 52
8.3 IC Compliance
The BlueMod+S/AI has been tested to fulfill the IC requirements. Test reports RSS-210 of Industry
Canada are available on request. Grants of the Full Modular Approval will be shown below.
8.3.1 IC Grant
tbd
8.3.2 IC Statement
(i) Ce dispositif doit être installé et exploité dans une enceinte entièrement fermée afin de prévenir
les rayonnements RF qui pourraient autrement perturber la navigation aéronautique. L’installation
doit être effectuée par des installateurs qualifiés, en pleine conformité avec les instructions du
fabricant.
(ii) Ce dispositif ne peut être exploité qu'en régime de non-brouillage et de non-protection, c’est-à-
dire que l’utilisateur doit accepter que des radars de haute puissance de la même bande de
fréquences puissent brouiller ce dispositif ou même l’endommager. D’autre part, les capteurs de
niveau à propos desquels il est démontré qu’ils perturbent une exploitation autorisée par licence de
fonctionnement principal doivent être enlevés aux frais de leur utilisateur.
This device complies with Industry Canada license-exempt RSS standard(s).
Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired
operation of the device.
NOTICE:
This Class B digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.
8.3.3 IC Caution
Warning: Changes or modifications made to this equipment not expressly approved by Stollmann
Entwicklungs- und Vertriebs-GmbH may void the IC authorization to operate this equipment.
Cet appareil est conforme avec Industrie Canada RSS exemptes de licence standard(s).
Son fonctionnement est soumis aux deux conditions suivantes:
(1) cet appareil ne peut pas provoquer d'interférences, et
(2) cet appareil doit accepter toute interférence, y compris celles pouvant causer un mauvais
fonctionnement de l'appareil.
BlueMod+S/AI
www.stollmann.de Page 45 of 52
8.3.4 IC RF-exposure Statement
This equipment is portable device. The output power of this device is less than 20mW.
The SAR test is not required.
8.3.5 IC Labeling Requirements for the End Product
Any end product integrating the BlueMod+S/AI must be labeled with at least the following
information:
This device contains transmitter with
FCC ID: RFRMS
IC-ID: 4957A-MS
8.3.6 IC Label Information BlueMod+S
The BlueMod+S shows no IC-ID on the product label, because there is no space available. IC
allows on request to state the IC-ID in the product manual. This product has been granted to do so.
Model: BlueMod+S
The IC-ID is: 4957A-MS
8.4 Bluetooth Qualification
The BlueMod+S is a qualified design according to the Bluetooth Qualification Program Reference
Document (PRD) V2.1. The Qualified Design ID (QDID) is:
tbd
For further information about marking requirements of your product attention should be paid the
Bluetooth Product Marking Guide at
https://www.bluetooth.org/Download/Marking_Guide_20060601.pdf
According to the Bluetooth SIG rules (Qualification Program Reference Document – PRD V2.1)
you are required to perform the mandatory End Product Listing (EPL) for your product. For further
information see www.Bluetooth.org or contact Stollmann.
BlueMod+S/AI
www.stollmann.de Page 46 of 52
8.5 RoHS Declaration
The actual version of RoHS Supplier Declaration according to the EU Directive 2011/65/EC can be
downloaded from the qualification section on product web site via the following link:
http://www.stollmann.de/en/support/downloads/bluetooth-adapter/bluemod-s.html
BlueMod+S/AI
www.stollmann.de Page 47 of 52
9 Related Documents
[1] nordic: nRF51_Series_Reference_Manual_v2.1.pdf 2013-11-20 (nRF51822_Reference)
[2] nordic: nRF51822_PS v2.0.pdf (nRF51822_Datasheet)
[3] Stollmann: UICP_UART_Interface_Control_Protocol_r01.pdf
[4] Stollmann: AppNote_B0601_Antenna_Design_V1_0.pdf
[5] Stollmann: BlueMod+S AT Command Reference
[6] Stollmann: BlueMod+S_Startup_Timing.pdf
[7] Stollmann: BlueMod+S_Testmode_Reference
[8] Bluetooth SIG: Core_v4.1.pdf
BlueMod+S/AI
www.stollmann.de Page 48 of 52
10 Packing
The BlueMod+S modules are packed using carrier tape.
Abzugrichtung von der Rolle/
pull off direction from reel
25 Leertaschen Vorspann pro Verpackungseinheit/
25 empty pockets as leader per packing unit
15 Leertaschen Nachspann pro Verpackungseinheit/
15 empty pockets as trailer per packing unit
FCC ID RFRMS
stollmann
BlueMod+S
stollmann
BlueMod+S
FCC ID RFRMS
stollmann
BlueMod+S
FCC ID RFRMS
stollmann
BlueMod+S
FCC ID RFRMS
BlueMod+S/AI
www.stollmann.de Page 50 of 52
10.3 Package Label
Package box, dry shield bag and reel are each marked with the following label:
Stollmann E+V GmbH
name
p/n
firmware
fw p/n
trace
quantity
designed and manufactured in Germany
xxxxxxxxxxxxx
aaaaa-aa
b/c
ddddd-dd
mwwyy
q
Field Description
name Name of product
p/n Product number
firmware Firmware version
fw p/n Product number of firmware
trace [Manufacturer m (optional)]Date (CalendarWeekYear) wwyy
quantity Number of contained modules
If the label on the package box is different to the label described please contact Stollmann for
detailed information.
BlueMod+S/AI
www.stollmann.de Page 51 of 52
11 Ordering Information
11.1 Part Numbers
BlueMod+S is available in the following variants:
Name Antenna Order No. MOQ /
units Comments
BlueMod+S/AI internal 53275-xx 50
BlueEva+S Internal 53276-xx 1 Evaluation Kits
Other variants on request, please contact Stollmann sales department.
11.2 Standard Packing Unit
The standard packing unit is 400 pieces Tape and Reel
11.3 Evaluation Kit
The kit BlueEva+S is available to evaluate functionality and start your firmware implementation.
12 History
Version Release Date By Change description
r01 20.02.2014 MW/JW First preliminary release
