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VT-MKW41Z Module Datasheet

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BLUETOOTH® LOW ENERGY,

IEEE® 802.15.4

VT-MKW41Z MODULE

PRODUCT MANUAL

REVISION 0.4

VT-MKW41Z Module Datasheet

Volansys Technologies Page | 2

The information contained in this document is the proprietary information of Volansys Technologies Pvt.,

Ltd. The contents are confidential and any disclosure to persons other than the officers, employees,

agents or subcontractors of the owner or licensee of this document, without the prior written consent of

Volansys, is strictly prohibited.

Further, no portion of this document may be reproduced, stored in a retrieval system, or transmitted in

any form or by any means, electronic or mechanical, including photocopying and recording, without the

prior written consent of Volansys, the copyright holder.

Volansys publishes this document without making any warranty as to the content contained herein.

Further Volansys reserves the right to make modifications, additions and deletions to this document due

to typographical errors, inaccurate information, or improvements to products mentioned in the document

at any time and without notice. Such changes will, nevertheless be incorporated into new editions of this

document.

VT-MKW41Z Module Datasheet 
 
Rev 0.4  Confidential  Copyright © 2017 Volansys 
  Volansys Technologies  Page | 3 
TABLE OF CONTENTS 
DOCUMENT DETAILS ...................................................................................................................6 
1 REVISION HISTORY ............................................................................................................................. 6 
2 REFERENCES ..................................................................................................................................... 6 
INTRODUCTION ..........................................................................................................................7 
PRODUCT OVERVIEW ..................................................................................................................8 
MODULE PINOUTS ......................................................................................................................9 
HARDWARE DESCRIPTION ......................................................................................................... 14 
1 HARDWARE BLOCK DIAGRAM ............................................................................................................ 14 
2 ANTENNA ....................................................................................................................................... 15 
3 MODULE RESET ............................................................................................................................... 15 
4 CLOCK ........................................................................................................................................... 15 
5 DEBUG AND PROGRAMMING ............................................................................................................. 16 
ELECTRICAL CHARACTERISTICS .................................................................................................. 17 
1 ABSOLUTE MAXIMUM RATINGS ......................................................................................................... 17 
2 RECOMMENDED (OPERATING CONDITION) .......................................................................................... 17 
3 DC-DC CONVERTER ......................................................................................................................... 17 
3.1 Buck mode ........................................................................................................................... 18 
3.2 Bypass Mode ....................................................................................................................... 18 
3.3 Boost Mode ......................................................................................................................... 18 
4 DC ELECTRICAL CHARACTERISTICS ...................................................................................................... 18 
5 DIGITAL I/O SPECIFICATION............................................................................................................... 19 
6 ANALOG AND VREF ......................................................................................................................... 19 
7 RF CHARACTERISTICS ....................................................................................................................... 20 
MODULE DIMENSION ............................................................................................................... 21 
1 MKW41Z MODULE DIMENSION ....................................................................................................... 21 
2 RECOMMENDED PCB LAYOUT PATTERN .............................................................................................. 22 
CERTIFICATIONS ....................................................................................................................... 23 
REGULATORY STATEMENTS ...................................................................................................... 24 
1 FCC STATEMENT .......................................................................................................................... 24 
2 FCC RADIATION EXPOSURE STATEMENT .............................................................................................. 24 
3 ORIGINAL EQUIPMENT MANUFACTURER (OEM) NOTES ............................................................ 24 
4 IC STATEMENT ................................................................................................................................ 25 
5 CE REGULATORY ............................................................................................................................. 26 
RECOMMENDED REFLOW PROFILE ........................................................................................ 27 

VT-MKW41Z Module Datasheet

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11 APPLICATION NOTE ............................................................................................................... 28

11.1 SAFETY PRECAUTIONS ...................................................................................................................... 28

11.2 DESIGN ENGINEERING NOTES ............................................................................................................ 28

11.3 STORAGE CONDITIONS ..................................................................................................................... 28

11.4 SHIPMENT ...................................................................................................................................... 28

11.5 HANDLING ...................................................................................................................................... 29

12 APPENDIX-A.......................................................................................................................... 30

12.1 ACRONYMS & GLOSSARY .................................................................................................................. 30

VT-MKW41Z Module Datasheet

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LIST OF FIGURES

Figure 1: Module Overview ................................................................................................................9

Figure 2: MKW41Z Module Hardware Block Diagram ........................................................................ 14

Figure 3: MKW41Z Module Physical Dimensions ............................................................................... 21

Figure 4: PCB Layout Pattern Dimensions .......................................................................................... 22

Figure 5: Reflow Soldering Profile ..................................................................................................... 27

VT-MKW41Z Module Datasheet

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1 DOCUMENT DETAILS

1.1 Revision History

Rev.

Date

Description

Prepared By

Reviewed By

Approved By

0.1

24-Aug-16

Initial draft version

released

Volansys

0.2

01-Dec-16

Rx and Tx mode power

consumption details

updated

Volansys

0.3

05-APR-17

Initial draft - as per new

module design -

Changes in Module pin-

out, configuration, PCB

form factor and layout

footprint suggestions

Volansys

0.4

13-Jun-17

FCC, IC and CE

regulatory statement

added

Volansys

1.2 References

Documents

Revision

MKW41Z512DS Datasheet - NXP

0.2

VT-MKW41Z Module Datasheet

Volansys Technologies Page | 7

2 INTRODUCTION

This document describes the Volansys MKW41Z module. Which has been designed to be easily integrated

into another device and to provide fast and low cost proven wireless network.

The MKW41Z module is ultra-compact, low power high sensitivity module. It is based on NXP’s

MKW41Z512VHT4 SoC combined with Bluetooth Low energy and IEEE 802.15.4 network stacks like

Thread, Zigbee pro etc.

No RF experience or expertise is required to add this powerful wireless networking capability to your

products. This series of modules offer fast integration opportunities and the shortest possible time to

market for your product.

VT-MKW41Z Module Datasheet

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3 PRODUCT OVERVIEW

The MKW41Z Module is a fully self-contained, small form factor Bluetooth Low Energy 4.2 and IEEE

802.15.4 compliant module with low complexity and low power features. Based on NXP’s Kinetis MCU

wireless hardware platform, MKW41Z offers superior low power radio performance.

The MKW41Z module employs low power architecture and it has been optimized for all kind of application

in home automation, smart grid, smart lighting, also networked building control, Medical equipment and

Home automation application, HVAC and security.

For evaluation and development, Volansys also offers a complete set of evaluation and development

tools.

Module Features

 Small form factor, SMT module 19mm x

11.51mm

 Integrated chip antenna

 Max output power: +3.5 dbm

 Typical Receiver Sensitivity (BLE) = -96 dBm

 Typical Receiver Sensitivity (802.15.4) = -100

dBm

 32bit ARM® Cortex-M0+ MCU with 64K SRAM

and 512K Flash

 Up to 48 MHz ARM® Cortex-M0+ core

 Integrated DC-DC converter enables a wide

operating range from 0.9 V to 4.2 V

 Supports Buck and boost power mode with

easy hardware configuration

 Extended Operation temp range: -40 °C to

+105 °C

 Hardware supported encryption AES 128-bit,

TRNG Supported

 9 MCU Low-power modes to provide power

optimization based on application

requirements.

 Low Power Mode (VLLS0) Current: ≈180 nA

 All MCU pins accessible

 Serial wire debug(SWD) Interface and Micro

Trace buffer

 On module 32MHz crystal

 External RTC 32KHz support

 RoHS compliant

 Peripheral Interfaces: 2xSPI, 1xUART, 2xI2C,

CMT, SWD, 16-bit ADC, Timers

Suggested Applications

 Extremely low-power embedded systems

 Portable health care devices

 Wearable sports

 Fitness devices

 Computer keyboards and mice

 Gaming controllers

 Access control

 Security systems

 Smart energy

 Home area networks

 Automated meter reading

 Medical Network

 HVAC Control

 Lighting control

 Asset tracking

 Environment monitoring and control

VT-MKW41Z Module Datasheet

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4 MODULE PINOUTS

Figure 1: Module Overview

MKW41Z module has 31 edge pin for connections as below:

Module

PIN#

MKW41Z512

PIN#

Name

Default

Use

Alternate Function

Remarks

26, 49 to 64

GND

PTC1

DISABLED

PTC1,

ANT_B,

I2C0_SDA,

UART0_RTS_b,

TPM0_CH2,

RF_ACTIVE

PTC2

DISABLED

TSI0_CH14/DIAG1,

PTC2/LLWU_P10,

TX_SWITCH,

I2C1_SCL,

UART0_RX,

CMT_IRO,

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DTM_RX

PTC3

DISABLED

TSI0_CH15/DIAG2,

PTC3/LLWU_P11,

RX_SWITCH,

I2C1_SDA,

UART0_TX,

TPM0_CH1,

DTM_TX

PTC4

DISABLED

TSI0_CH0/DIAG3,

PTC4/LLWU_P12,

ANT_A,

EXTRG_IN,

UART0_CTS_b,

TPM1_CH0,

BSM_DATA

PTC5

DISABLED

TSI0_CH1/DIAG4,

PTC5/LLWU_P13,

RF_OFF,

LPTMR0_ALT2,

UART0_RTS_b,

TPM1_CH1,

BSM_CLK

PTC6

DISABLED

TSI0_CH2,

PTC6/LLWU_P14/XTAL_OU

T_EN,

I2C1_SCL,

UART0_RX,

TPM2_CH0,

BSM_FRAME

PTC7

DISABLED

TSI0_CH3,

PTC7/LLWU_P15,

SPI0_PCS2,

I2C1_SDA,

UART0_TX,

TPM2_CH1,

BSM_DATA

PTC16

DISABLED

TSI0_CH4,

PTC16/LLWU_P0,

SPI0_SCK,

I2C0_SDA,

UART0_RTS_b,

TPM0_CH3

PTC17

DISABLED

TSI0_CH5,

PTC17/LLWU_P1,

SPI0_SOUT,

I2C1_SCL,

UART0_RX,

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BSM_FRAME,

DTM_RX

PTC18

DISABLED

TSI0_CH6,

PTC18/LLWU_P2,

SPI0_SIN,

I2C1_SDA,

UART0_TX,

BSM_DATA,

DTM_TX

PTC19

DISABLED

TSI0_CH7,

PTC19/LLWU_P3,

SPI0_PCS0,

I2C0_SCL,

UART0_CTS_b,

BSM_CLK,

RF_ACTIVE

PTA0

SWD_DIO

TSIO_CH8,

PTA0,

SPI0_PCS1,

TPM1_CH0,

SWD_DIO

Provide 10K pull

PTA1

SWD_CLK

TSI0_CH9,

PTA1,

SPI1_PCS0,

TPM1_CH1,

SWD_CLK

Provide 10K ohm

pull-down

PTA2/

RESET_b

PTA2,

TPM0_CH3,

RESET_b

Provide 10K pull

PTA16

DISABLED

TSI0_CH10

PTA16/LLWU_P4,

SPI1_SOUT,

TPM0_CH0

PTA17

DISABLED

TSI0_CH11,

PTA17/LLWU_P5/RF_RESET

SPI1_SIN,

TPM_CLKIN1

26, 49 to 64

GND

10, 8

VIN

Supply

Input

PTA18

DISABLED

TSI0_CH12,

PTA18/LLWU_P6,

SPI1_SCK,

TPM2_CH0

PTA19

DISABLED

TSI0_CH13/ADC0_SE5,

PTA19/LLWU_P7,

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SPI1_PCS0,

TPM2_CH1

PSWITCH

VIN

DCDC_CFG

DCDC_LP

26, 49 to 64

GND

VDD_1P8OUT

VDD_1P5OUT

_PMCIN

PTB0

DISABLED

PTB0/LLWU_P8/XTAL_OUT

_EN,

PTB0,

I2C0_SCL,

CMP0_OUT,

TPM0_CH1,

CLKOUT

PTB1

DISABLED

ADC0_SE1/CMP0_IN5,

PTB1,

DTM_RX,

I2C0_SDA,

LPTMR0_ALT1,

TPM0_CH2,

CMT_IRO

PTB2

DISABLED

ADC0_SE3/CMP0_IN3,

PTB2,

RF_OFF,

DTM_TX,

TPM1_CH0

PTB3

DISABLED

ADC0_SE2/CMP0_IN4,

PTB3,

CLKOUT,

TPM1_CH1,

RTC_CLKOUT

EXTAL32K

EXTAL32K,

PTB16,

I2C1_SCL,

TPM2_CH0

XTAL32K

XTAL32K,

PTB17,

I2C1_SDA,

TPM2_CH1,

BSM_CLK

PTB18

NMI_b

DAC0_OUT/ADC0_SE4/CM

P0_IN2,

PTB18,

I2C1_SCL,

TPM_CLKIN0,

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TPM0_CH0,

NMI_b

ADC0_DP0

CMP0_IN0

ADC0_DP0 / CMP0_IN0

ADC0_DM0

CMP0_IN1

ADC0_DM0/ CMP0_IN1

XTAL_OUT

Note:

- Provided pull up at Reset_b pin.

- Provide Pull down at SWD_CLK pin.

- Provide Pull up at SWD_DIO pin.

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5 HARDWARE DESCRIPTION

5.1 Hardware Block Diagram

Figure 2: MKW41Z Module Hardware Block Diagram

The MKW41Z512 Module families are based on the NXP’s Kinetis MCU family MKW41Z512VHT4. MKW41Z

module are fully integrated 2.4GHz Bluetooth Low Energy (BLE 4.2) and IEEE 802.15.4 compliant

transceiver and a powerful 32-bit ARM® Cortex M0+ MCU, up to 512kB flash and 128kB SRAM memory

and rich peripherals. The industry standard Micro trace buffer and serial wire SWD programming and

debugging interfaces together with the standard ARM system debug components help to streamline any

custom software development.

Module has inbuilt chip antenna. These antenna supports BLE and IEEE 802.15.4 protocol ISM Band

(2.4GHz). The voltages are monitored (brown-out detection) and the built in power-on-reset circuit

eliminates the need for any external monitoring circuitry. This module has support of external RTC

32/32.768 kHz watch crystal. The MKW41Z512 module have fully integrated DC-DC converter with Buck,

Boost and Bypass modes. Module can be easily configured for Buck and Boost mode power operations.

For more details please check DCDC converter section.

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5.2 Antenna

The MKW41z Module includes an integrated chip antenna. The MKW41Z Module should be mounted with

the PCB chip antenna overhanging the edge of the host board. To further improve performance, a ground

plane may be placed on the host board under the module up to the antenna keep out area. The installation

of an uninterrupted ground plane on a layer directly beneath the module will also allow you to run traces

under this layer.

The chip antenna is compact and highly efficient. To maximize range, an adequate ground plane must be

provided on the host PCB. Correctly positioned, the ground plane on the host PCB will contribute

significantly to the antenna performance; it should not be directly under the chip antenna. The position

of the module on the host board and overall design of the product enclosure contribute to antenna

performance. Poor design affects radiation patterns and can result in reflection, diffraction and/or

scattering of the transmitted signal.

A few design guidelines to help ensure antenna performance:

• Never place the ground plane or route copper traces directly underneath the antenna portion of the

module

• Never place the antenna close to metallic objects

• In the overall design, ensure that wiring and other components are not placed near the antenna

• Do not place the antenna in a metallic or metalized plastic enclosure

• Keep plastic enclosures 1cm or more away from the antenna in any direction

5.3 Module Reset

Pin 15 is used as an external reset. The reset pin only contains an active pull down device. This pin can be

used for other functions, such as GPIO, by setting the RESET_PIN_CFG option bit of the FTFA_FPORT

disabled and configured as a GPIO output, it operates as a pseudo open drain output.

5.4 Clock

The MKW41z Module requires two clock system.

On module 32MHz crystal used for RF reference oscillator. The clock is used by the RF, analog and digital

section interfaces. It can be used also by the MCU core and as a clock source for some internal peripherals.

For normal run modes, an internal oscillator can provide the low frequency clock. However, to make full

use of reduced power modes an external crystal must be present.

The MKW41z Module supports external 32/32.768KHz crystal. This is used as the clock for the RTC and

the deep-sleep clock.

Symbol

Parameter

Typ.

Max.

Unit

FNOM_LFXO

Crystal frequency

32/32.768

KHz

FTOL_LFXO_BLE

Frequency tolerance, BLE applications

±20

±250

ppm

CL_LFXO

Load Capacitance

12.5

Note: External capacitors are not required for 32KHz crystal.

VT-MKW41Z Module Datasheet

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5.5 Debug and Programming

The MKW41z module supports the two pin Serial Wire Debug (SWD) interface and offers flexible

mechanisms for non-intrusive debugging of program code. The R41Z also supports Micro Trace Buffer

(MTB) which provides a lightweight program trace capabilities using system RAM.

VT-MKW41Z Module Datasheet

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6 ELECTRICAL CHARACTERISTICS

6.1 Absolute Maximum Ratings

The absolute maximum ratings given below should under no circumstances be violated. Exceeding one

or more of the limiting values may cause permanent damage to the device.

Description

Module

Unit

Min

Max

Power Supply Voltage (VIN)

-0.3

4.2

Voltage on I/O line

-0.3

VDD+0.3

RF Input power

+3.5

dbm

Storage temperature

-40

105

°C

6.2 Recommended (Operating Condition)

Description

Module

Unit

Min

Typ

Max

Bypass Mode Supply

Voltage(Digital) (VIN)

1.71

3.6

Boost Mode Supply Voltage (VIN)

0.9

1.795

Buck Mode Supply Voltage (VIN)1

2.1

4.2

RF Input Frequency

2360

2480

MHz

RF Output Power

3.5

dBm

SPI Clock Rate

12.0

MHz

Logic Input High voltage

0.7*VDD_1V83

Logic Input Low voltage

0.3*VDD_1V8

DC-DC Converter Output Power

125

Ambient temperature

-40

105

°C

Note:

1. In Buck mode, DC-DC converter needs 2.1V min to start, the supply can drop to 1.8V after DC-DC

converter settles

2. Analog supply voltage is same as VDD_IO (VDD_1P8OUT)

3. VDD_1V8 is internal configurable LDO output referred as VDD_1P8OUT.

6.3 DC-DC Converter

The MKW41z module contains an integrated DCDC converter which allows for three modes of operation

without additional components. When operating in DCDC Buck mode, power consumption from using

the radio can be reduced compared to DCDC Bypass mode. DCDC Boost mode allows the use of a single

alkaline or other low voltage source. While it is possible to switch between these modes in a single

design.

VT-MKW41Z Module Datasheet

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6.3.1 Buck mode

Pin No#

Net name

Connection

Power Supply Voltage (VIN)

1.8V - 4.2V VIN

DCDC_CFG

1.8V - 4.2V VIN

DCDC_LP

PSWITCH1

1.8V - 4.2V VIN

V1P8

NC / 1.8V - 3.0 Output voltage2

V1P5

Note 1: DCDC converter enables once PSWITCH connected with VIN supply. Once DCDC converter

started PSWITCH can be reconnected to GND without disrupting the DCDC converter operation.

Note 2: While DCDC converter is running in either Buck or boost mode, V1P8 is I/O level for MKW41z.

In Buck mode, V1P8 cannot output voltage greater than VIN supply voltage. V1P8 can provide a

limited number of additional peripheral devices which connect directly to the MKW41z’s IO due to

low output current. Please refer MKW41z datasheet for output current.

6.3.2 Bypass Mode

Pin No#

Net name

Connection

Power Supply Voltage (VIN)

1.71V - 3.6V VIN

DCDC_CFG

1.71V - 3.6V VIN

DCDC_LP

PSWITCH

Ground

V1P8

1.71V - 3.6V VIN

V1P5

1.45V - 3.6V VIN

6.3.3 Boost Mode

Pin No#

Net name

Connection

Power Supply Voltage (VIN)

0.9V - 1.8V VIN

DCDC_CFG

Ground

DCDC_LP

0.9V - 1.8V VIN

PSWITCH

0.9V - 1.8V VIN

V1P8 Out

NC / 1.8V - 3.0V Output voltage1

V1P5

Note 1: While DCDC converter is running in either Buck or boost mode, V1P8 is I/O level for MKW41z.

V1P8 can provide a limited number of additional peripheral devices which connect directly to the

MKW41z’s IO due to low output current. Please refer MKW41z datasheet for output current.

6.4 DC Electrical Characteristics

Buck Mode, VIN=3.6V, Tamb = 25°C, unless otherwise Specified

Description

Module

Unit

Min

Typ

Max

Transmit mode current @

+TBDdBm

TBD

Receive mode current @max

sensitivity

TBD

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Idle mode- Normal run, CPU at

48MHz

Please Note:

- The average current consumption during operation is dependent on the firmware and the network load.

6.5 Digital I/O Specification

Digital I/Os of MKW41Z512 Module, VIN = 3.3V, Tamb = 25°C, unless otherwise Specified

Symbol

Description

Module

Unit

Min

Typ

Max

VOH

Output high voltage — high drive

strength

• 2.7 V ≤ VDD ≤ 3.6 V, IOH = -20 mA

• 1.71 V ≤ VDD ≤ 2.7 V, IOH = -10 mA

VDD-0.5

Output high voltage — low drive

strength

• 2.7 V ≤ VDD ≤ 3.6 V, IOH = -5 mA

• 1.71 V ≤ VDD ≤ 2.7 V, IOH = -2.5 mA

VDD-0.5

IOHT

IOHT Output high current total for all

ports

100

VOL

Output low voltage — high drive

strength

• 2.7 V ≤ VDD ≤ 3.6 V, IOL = 20 mA

• 1.71 V ≤ VDD ≤ 2.7 V, IOL = 10 mA

0.5

Output low voltage — low drive

strength

• 2.7 V ≤ VDD ≤ 3.6 V, IOL = 5 mA

• 1.71 V ≤ VDD ≤ 2.7 V, IOL = 2.5 mA

0.5

VOLT

IOLT Output low current total for all

ports

100

RESET_b

Reset Pulse width to guarantee a reset

100

6.6 Analog and VREF

The ADC analog system VDDA powered with 1.8V supply through filtering circuit onboard the MKW41z

module. The voltage reference VREF, has two sourcing options: internal and external supply. When

externally supplied, VREF should be referenced to VDDA. And for internal reference voltage, buffered

reference is available internally for use with on chip peripherals such as ADCs and DACs. The Voltage

Reference output can be trimmed with a resolution of 0.5mV

Symbol

Description

Module

Unit

Min

Typ

Max

VDDA

Analog supply voltage

1.71

1.8

VREFH

ADC reference voltage high

1.13

VDDA

VREF_OUT

Voltage reference output

1.19

1.195

1.2

VADIN

16-bit differential mode

GND

31/32 × VREFH

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All other modes

GND

VREFH

VAIN

Analog input voltage

GND - 0.3

VDD

VAIO

Analog input offset voltage

IDDHS

Supply current, High-speed mode

200

IDDLS

Supply current, low-speed mode

VCMPOh

Comparator output high

VDD - 0.5

VCMPOl

Comparator output low

0.5

6.7 RF Characteristics

Description

Module

Unit

Min

Typ

Max

RF Frequency range

2400

2483.5

MHz

Tx Power

-30

+3.5

dBm

BLE Rx Sensitivity

-96

dBm

IEEE 802.15.4 Rx Sensitivity

-100

dBm

GFSK Rx Sensitivity (250 kbps GFSK-

BT=0.5, h=0.5)

-100

dBm

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7 MODULE DIMENSION

7.1 MKW41z Module Dimension

Figure 3: MKW41Z Module Physical Dimensions

Symbol

Description

Typical Distance

Length of Module

19mm

Width of Modules

11.51mm

SMD pad pitch

1.27mm

Distance between board edge to center of pad

2.26

Distance between board edge to center of pad

1.94

Circular pad keepout from board edge

8.84mm

Circular pad keepout from board edge

2mm

Keepout circular pad size

0.3mm

Keepout zone from corner of PCB

6.5mm

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Keepout zone from corner of PCB

6.5mm

B x37

Rectangular SMD Pad size (All Pads are placed on board edges)

0.76mm x 0.50mm

For ideal RF performance when using the on-board antenna, the antenna should be located at the corner

of the carrier PCB. There should be no components, tracks or copper planes in the Keep-out area which

should be as large as possible.

When placing the module please either locate the antenna in the corner edge of PCB. So that the

recommended antenna keep out zone is being followed, or add a no copper zone as mentioned keep out

area.

7.2 Recommended PCB layout pattern

Figure 4: PCB Layout Pattern Dimensions

Symbol

Description

Typical Distance

SMD pad pitch

1.27mm

Distance between board edge to center of pad

2.26

Distance between board edge to center of pad

1.94

Circular pad keep-out from board edge

8.84mm

Circular pad keep-out from board edge

2mm

circular pad Keepout area

1mm

Keepout zone from corner of PCB

6.5mm

Keepout zone from corner of PCB

6.5mm

B x37

Rectangular SMD Pad size (All Pads are placed on board edges)

1mm x 0.50mm

VT-MKW41Z Module Datasheet

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8 CERTIFICATIONS

FCC: FCC part 15 modular certification ID: 2AKNO-MKW41Z

IC: Industry Canada RSS-247 modular certification IC:22256-MKW41Z

CE: EN 60950-1: 2006 + A11 :2009 + A1:2010 + A12:2011 + A2:2013

EN 301 489-1 V2.2.0 (2017-03)

EN 301 489-17 V3.2.0 (2017-03)

EN 300 328 V2.1.1

VT-MKW41Z Module Datasheet

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9 REGULATORY STATEMENTS

9.1 FCC STATEMENT

1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two

conditions:

(1) This device may not cause harmful interference.

(2) This device must accept any interference received, including interference that may cause

undesired operation.

2. Changes or modifications not expressly approved by the party responsible for compliance

could void the user's authority to operate the equipment.

NOTE: This equipment has been tested and found to comply with the limits for a Class B digital

device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable

protection against harmful interference in a residential installation.

This equipment generates uses and can radiate radio frequency energy and, if not installed and

used in accordance with the instructions, may cause harmful interference to radio

communications.

However, there is no guarantee that interference will not occur in a installation. If this

equipment does cause harmful interference to radio or television reception, which can be

determined by turning the equipment off and on, the user is encouraged to try to correct the

interference by one or more of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.

Consult the dealer or an experienced radio/TV technician for help.

9.2 FCC Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled

environment. This equipment should be installed and operated with minimum distance 20cm

between the radiator & your body

9.3 ORIGINAL EQUIPMENT MANUFACTURER (OEM) NOTES

 The OEM must certify the final end product to comply with unintentional radiators (FCC

Sections 15.107 and 15.109) before declaring compliance of the final product to Part 15

of the FCC rules and regulations. Integration into devices that are directly or indirectly c

onnected to AC lines must add with Class II Permissive Change.

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 The OEM must comply with the FCC labeling requirements. If the module’s label is not

visible when installed, then an additional permanent label must be applied on the outside

of the finished product which states: “Contains transmitter module FCC ID: 2AKNO-

MKW41Z Additionally, the following statement should be included on the label and in

the final product’s user manual: “This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions: (1) This device may not cause

harmful interferences, and (2) this device must accept any interference received,

including interference that may cause undesired operation.”

 The module is limited to installation in mobile or fixed applications. Separate approval is

required for all other operating configurations, including portable configuration with re

spect to Part 2.1093 and different antenna configurations.

 module or modules can only be used without additional authorizations if they have been

tested and granted under the same intended end‐se operational conditions, including

simultaneous transmission operations. When they have not been tested and granted in

this manner, additional testing and/or FCC application filing may be required. The most

straightforward approach to address additional testing conditions is to have the grantee

responsible for the certification of at least one of the modules submit a permissive change

application.When having a module grantee file a permissive change is not practical or

feasible, the following guidance provides some additional options for host manufacturers.

Integrations using modules where additional testing and/or FCC application filing(s) may

be required are: (A) a module used in devices requiring additional RF exposure compliance

information (e.g., MPE evaluation or SAR testing); (B) limited and/or split modules not

meeting all of the module requirements; and (C) simultaneous transmissions for

independent collocated transmitters not previously granted together.

This Module is full modular approval; it is limited to OEM installation ONLY.

Integration into devices that are directly or indirectly connected to AC lines must add with Class II

Permissive Change.

(OEM) Integrator must assure compliance of the entire end product include the integrated

Module.

Additional measurements (15B) and/or equipment authorizations (e.g Verification) may need to

be addressed depending on co-location or simultaneous transmission issues if applicable.

(OEM) Integrator is reminded to assure that these installation instructions will not be made

available to the end user of the final host device.

9.4 IC Statement

This device complies with Industry Canada license‐exempt RSS standard(s). Operation is subject to

the following two conditions: (1) This device may not cause interference, and (2) This device must

accept any interference, including interference that may cause undesired operation of the device.

This device complies with RSS‐247 of Industry Canada. Operation is subject to the condition that

VT-MKW41Z Module Datasheet

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this device does not cause harmful interference. This Class B digital apparatus complies with

Canadian ICES‐003 (Cet appareil numérique de la Classe B conforme à la norme NMB‐003 du

Canada).

This equipment(IC:22256-MKW41Z) complies with IC radiation exposure limits set forth for an

uncontrolled environment. This equipment should be installed and operated with minimum

distance of 20 cm between the radiator and your body. This transmitter must not be co-located or

operating in conjunction with any other antenna or transmitter.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio

exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne

doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage

radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Cet équipement (IC: 22256-MKW41Z) est conforme aux limites IC d'exposition aux radiations

définies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec une

distance minimale de 20 cm entre le radiateur et votre corps. Cet émetteur ne doit pas être situé

ou opérant en conjonction avec une autre antenne ou émetteur.

9.5 CE Regulatory

Max RF power:

BLE（2402-2480MHz）: 3.8dBm

Thread（2400-2483.5MHz）: 3.1dBm

RF exposure information: The Maximum Permissible Exposure (MPE) level has been calculated

based on a distance of d=20 cm between the device and the human body. To maintain compliance

with RF exposure requirement, use product that maintain a 20cm distance between the device and

human body.

Regulatory Conformance:

Hereby, VOLANSYS TECHNOLOGIES PVT. LTD. that the radio equipment type [VT-KW41Z]

is in compliance with Directive 2014/53/EU.

EU declaration of conformity is available at the following internet address: www.volansys.com

Notice: Observe the national local regulations in the location where the device is to be used. This

device may be restricted for use in some or all member states of the European Union (EU)

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10 RECOMMENDED REFLOW PROFILE

Recommended Reflow Profile

Parameters Values

Ramp Up Rate (from T soak max to T peak)

3°/sec max

Minimum Soak Temperature

150°C

Maximum Soak Temperature

200°C

Soak Time

90 30 sec

T Liquids

220°C

Time above TL

60-150 sec

T peak

250°C

Time within 5º of T peak

20-30 sec

Time from 25° to T peak

8 min max

Ramp Down Rate

6°C/sec max

Figure 5: Reflow Soldering Profile

Use of “No-Clean” solder paste is recommended to avoid the requirement for a cleaning process. Cleaning

the module is strongly discouraged because it will be difficult to ensure no cleaning agent and other

residuals are remaining underneath the shielding can as well as in the gap between the module and the

host board.

Please Note:

Maximum number of reflow cycles: 2

Opposite-side reflow is prohibited: Do not place the module on the bottom / underside of your PCB and

re-flow

VT-MKW41Z Module Datasheet

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11 APPLICATION NOTE

11.1 Safety Precautions

These specifications are intended to preserve the quality assurance of products as individual components.

Before use, check and evaluate the module’s operation when mounted on your products. Abide by these

specifications when using the products. These products may short-circuit. If electrical shocks, smoke, fire,

and/or accidents involving human life are anticipated when a short circuit occurs, then provide the

following failsafe functions as a minimum:

(1) Ensure the safety of the whole system by installing a protection circuit and a protection device.

(2) Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a

single fault causing an unsafe status.

11.2 Design Engineering Notes

(1) Heat is the major cause of shortening the life of the modules. Avoid assembly and use of the target

equipment in conditions where the product’s temperature may exceed the maximum allowable.

(2) Failure to do so may result in degrading of the product’s functions and damage to the product.

(3) If pulses or other transient loads (a large load applied in a short time) are applied to the products,

before use, check and evaluate their operation when assembled onto your products.

(4) These products are not intended for other uses, other than under the special conditions shown below.

Before using these products under such special conditions, check their performance and reliability under

the said special conditions carefully, to determine whether or not they can be used in such a manner.

(5) In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash.

In direct sunlight, outdoors, or in a dusty environment. In an environment where condensation occurs. In

an environment with a high concentration of harmful gas (ex. salty air, HCl, Cl2, SO2, H2S, NH3, and NOx)

(6) If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace

these products with new products because they may not be able to provide normal performance even if

their electronic characteristics and appearances appear satisfactory.

(7) Mechanical stress during assembly of the board and operation has to be avoided.

(8) Pressing on parts of the metal cover or fastening objects to the metal cover is not permitted.

11.3 Storage Conditions

(1) The module must not be stressed mechanically during storage.

(2) Do not store these products in the following conditions or the performance characteristics of the

product, such as RF performance, may well be adversely affected:

(3) Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S,

NH3, SO2, or NOX

(4) Storage (before assembly of the end product) of the modules for more than one year after the date of

delivery at your company even if all the above conditions (1) to (3) have been met, should be avoided.

11.4 Shipment

The MKW41Z Modules are delivered in trays of TBD.

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11.5 Handling

<TBD> The MKW41Z Modules are designed and packaged to be processed in an automated assembly line.

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12 APPENDIX-A

12.1 Acronyms & Glossary

The following terms are used in this document

Sr No#

Terms

Definition

MCU

Microcontroller Unit

CPU

Central Processing Unit

BLE

Bluetooth Low Energy

PWM

Pulse width Modulation

ADC

Analog to Digital Convertor

TBD

To Be Define

MCU

Micro Controller Unit

SRAM

Static Random Access Memory

RTC

Real Time Clock

10.

No Connection

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