Wistron TXE01 3D RF TX MODULE User Manual Wistron 3D Shutter Eyeglasses
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Confidential Wistron 3D RF Tx Module: TXE01 RF Tx Dongle: TXD01 Rev 0.01 Wistron Corporation HEAD OFFICE: 21F, 88, Sec. 1, Hsin Tai Wu Rd; Hsichih, Taipei Hsien (221) Taiwan, R.O.C. TEL: 886-2-6612-2390, FAX: 886-2-6612-2384 . Wistron 3D RF Tx Module and Tx Dongle Copyright Wistron 3D Radio Frequency Tx module and Tx Dongle operational description and design guide. 26 Oct 2011. Copyright © 2011 Wistron Corporation. All Rights Reserved. Disclaimer The programs are provided "as is" without warranty of any kind either expressed or implied, including but not limited to the implied warranties of merchantability and fitness for a particular purpose. This publication could contain technical inaccuracies or typographical errors. Changes are periodically made to the information herein; these changes will be incorporated in new editions of this publication. Wistron Corporation is without obligation to notify any person of such revisions or changes. Page 1 27 October 2011 . Wistron 3D RF Tx Module and Tx Dongle Revision History Date Revision Revised 10/26/2011 0.01 Earnest Chan Changes Initial Release. Page 2 27 October 2011 . Wistron 3D RF Tx Module and Tx Dongle Table of Contents 1 Overview…………………………………………………………………………………..…………….4 1.1 Environmental Protection……………………………………………………………………..4 1.1.1 Restricted Substances and Environmental Requirements……………………………...4 1.1.2 RoHS………………………………………………………………………………………….4 1.2 Product Specification………………………………………………………………………….5 1.2.1 3D RF Tx Module…………………………………...……………………………………….5 1.2.2 3D RF Tx Dongle……………………..……………………………………………………..5 1.3 Physical Description and Specification………………………………………………………5 1.3.1 Hardware Specification……………………………………………………………………..5 1.3.2 Hardware Block Diagram…………………………………………………………………...6 1.3.3 Subsystem……………………………………………………………………………………7 1.4 Operational Concept……………………………………………………………………...…..9 1.5 Packing…………………………………………………………………………………………9 2 Reliability……………………………………………………………………………………………….11 2.1 Purpose………………………………………………………………………………………..11 2.2 Scope…………………………………………………………………………………………..11 2.3 Testing Condition……………………………………………………………………………..11 3 Certification.…………………………………………………………………………………………...12 Page 3 27 October 2011 . Wistron 3D RF Tx Module and Tx Dongle Overview As 3D display device getting more and more popular, the 3D active shutter demand is speedy increased. Different from the traditional 3D shutter glasses using IR technology, Wistron 3D Tx module and Tx dongle are using RF technology. RF technology will not be limited by the direction and can support multi-3D RF Rx module at the same time. 1.1 Environmental Protection 1.1.1 Restricted Substances and Environmental Requirements All the materials and manufacturing process used to produce 3D RF Tx module and RF Tx dongle must comply with RoHS requirements. 1.1.2 RoHS All materials contained in the 3D RF Tx module and 3D RF Tx dongle complies with RoHS. Page 4 27 October 2011 . 1.2 Wistron 3D RF Tx Module and Tx Dongle Product Specification 1.2.1 3D RF Tx Module: Dimension: (L)23 x (W)9.1 x (H)3.55 mm +/-0.1mm 2.4GHz Trigger frequency: support 50~60hz, switchable Power: 1 set power for 3.3V (3.3V/150mA) RF triggle signal power: 3.3V RF performance: 10m 1 3D RF Tx module can support up to 10 3D RF Rx module at one time Wire connector: 1 pcs for 4 pin Power INT Paring GND 1.2.2 3D RF Tx Dongle: Dimension: (L)28.2 x (W)15.14 x (H)6.44 mm +/-0.1mm 2.4GHz Trigger frequency: support 50~60hz, switchable Power: 1 set power for 5V (5V/100mA) RF triggle signal power: 3.3V RF performance: 10m 1 Tx USB dongle can support up to 10 Rx module at one time Connector: 2 pcs 1 for 4 pin USB 2.0 type-A Another 1 for paring button 1.3 Physical Description and Specification 1.3.1 Hardware Specification 3D RF Tx Module Specification Connector: 4 pin connector: System power source and 3D trigger signal. Electronics module: Page 5 27 October 2011 . Power: Wistron 3D RF Tx Module and Tx Dongle Microprocessor. Trigger signal. 2.4G RF circuitry 3.3V power source. 3D RF Tx Dongle Specification Connector: USB 2.0 type A connector: System power source and 3D trigger signal. Electronics module: Microprocessor. Trigger signal. 2.4G RF circuitry Power: 5V power source 1.3.2 Hardware Block Diagram 3D RF Tx Module Block Diagram 3D system RF IC Page 6 27 October 2011 . Wistron 3D RF Tx Module and Tx Dongle 3D RF Tx Dongle Block Diagram 1.3.3 Subsystem 3D RF Tx Module Connector: 4 pin connector: System power source and 3D trigger signal. Pin1 3.3V Pin2 3D trigger signal Pin3 paring Pin4 GND Electronics module: Microprocessor. There shall be GPIO that is used to trigger 3D signal. Immediately via 2.4G RF wireless output the 3D signal to radio. Firmware and paring ID upgrades support. Trigger signal. Voltage : 3.3V +- 5% Pulse 2.4G RF circuitry Connectivity supporting: frequency hopping with 3 channels. RF performance: 10 meters 1 3D RF Tx module can support up to 10 3D RF Rx module at one time Page 7 27 October 2011 . Wistron 3D RF Tx Module and Tx Dongle 3D RF Tx Dongle Connector: USB 2.0 type A connector: System power source and 3D trigger signal. Pin1 5V Pin2 3D Trigger Signal Pin3 Paring Pin4 GND Electronics module: Microprocessor. There shall be GPIO that is used to trigger 3D signal. Immediately via 2.4G RF wireless output the 3D signal to radio. Firmware and paring ID upgrades support. Trigger signal. Voltage : 3.3V +- 5% Pulse 2.4G RF circuitry Connectivity supporting: frequency hopping with 3 channel RF performance: 10 meters 1 3D RF Tx dongle can support up to 10 3D RF Rx module at one time Page 8 27 October 2011 . ‧1.4 1.5 Wistron 3D RF Tx Module and Tx Dongle Operational Concept Packing 3D RF Tx Module and 3D RF Tx Dongle Packing Material Description CTN AB B/R 323*290*136MM PAD B 310*275MM PARTITION B 312*52MM PARTITION B 279*52MM BAG CONDUCTIVE GRID 70*60MM Q'ty 0.0028 0.0085 0.0966 0.6818 Page 9 Remark 350 pcs in 1 carton 27 October 2011 . Wistron 3D RF Tx Module and Tx Dongle Packing photo Reliability 2.1 Purpose To insure the quality of Wistron 3D radio frequency product which developed, designed and Page 10 27 October 2011 . Wistron 3D RF Tx Module and Tx Dongle produced meet requirements of customers. 2.2 Scope This document defines an applicable set of tasks necessary for an effective 3D RF Tx module and 3D RF Tx dongle verification qualification program. 2.3 Testing Condition Test item Condition 1 Operation Temp/Hum Cycle Test Temp: 0~40C, Humidity: 90% , Test duration : 24hrs 2 Cold and hot start Test Cold start: Temp:0C, 5 times Warm start: Temp:40C, 5 times 3 Climatic tests on non-packed product (testing under non-operation) –Cyclic humidity test –Damp heat steady state test –Dry heat test –Cold test 4 Package Vibration Test X,Y axis Test Time: 30 minutes Random Vibration:Grms =1.04 5 Package Drop Test 1000mm for 1 worse case of concer 3 edges cartons damage. 6 EMI Test Follow up CE standard 7 ESD Test Air ±8kV 8 RF Performance Test RF performance-conductive & air test 9 Antenna Performance Test in band (2400~2483.5MHz) - antenna efficiency - Antenna Return loss 10 EE Basic Function Test Test coverage: - Quick Scan - System All Clock Check - RF function - DC Distribution At Device Power Line - System Power consumption - Room temperature System Long Run 11 Angles of receive signal Different angles from Tx or Tx dongle by 360 degrees 12 Button Test (Tx dongle) 13 USB Con Require ±4kV Normal performance within the specification limits (B) Pairing mode by manual - 100 times - TX USB dongle - detect and remove on NB 20 times 14 RF performance - Paired glasses and device distance 10M - 1 Tx to 10 Rx and distance 10M 15 FW & ID reflash - Follow reflash SOP 16 Button and Switch Life Test (only for Tx USB dongle paring button) Power switch Button:20000times 17 Tx Dongle Connector Life Test Plug in and out system for 2000 times Page 11 27 October 2011 . Wistron 3D RF Tx Module and Tx Dongle Certification Country logo USA FCC EU CE TW NCC China Japan SRRC Telec Standard FCC pasrt 15C FCC ID fee short term confidentiality EN 300 440 EN 301 489-1-3 EN 62311 ( MPE) notification 31 countries LP0002 ID fee RF Telec Page 12 27 October 2011 Deral Communication Commission interference state-ment : This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. FCC Caution This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation RF exposure warning: The equipment complies with RF exposure limits set forth for an uncontrolled environment. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. You are cautioned that changes or modifications not expressly approved by the party responsible for compliance could void your authority to operate the equipment.
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