Xplore Technologies MC7750 CELLULAR/PCS GSM/EDGE/WCDMA/CDMA+ 700 MHz LTE MODEM User Manual

Xplore Technologies CELLULAR/PCS GSM/EDGE/WCDMA/CDMA+ 700 MHz LTE MODEM

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MC7750 User Manual

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Product Technical Specification & Customer Design GuidelinesAirPrime MC77502400074Rev 4Distribution under NDA only Contents subject to change

PrefaceRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 3Important NoticeDue to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data.Safety and HazardsDo not operate the Sierra Wireless modem in areas where blasting is in progress, where explosive atmospheres may be present, near medical equipment, near life support equipment, or any equipment which may be susceptible to any form of radio interference. In such areas, the Sierra Wireless modem MUST BE POWERED OFF. The Sierra Wireless modem can transmit signals that could interfere with this equipment.Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems.Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. Sierra Wireless modems may be used at this time.The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operator's control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence.Limitation of LiabilityThe information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY.Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product.

PrefaceRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 5Revision History Revision number Release date Changes1August 2010 Initial release.2January 2011 Resolved most TBDs.Removed references to dial-up networking.Updated Figure 4-1, System block diagram, on page 24;Figure 4-2, Expanded RF block diagram, on page 25;Figure 8-2, Dimensioned view, on page 54.Updated Table 5-5, Conducted Rx (Receive) sensitivity, on page 43; Table 6-1, Averaged standby DC power consumption, on page 45;Table 6-3, Averaged call mode DC power consumption (LTE), on page 46;Table 6-4, Averaged Call Mode DC power consumption (GSM / EDGE), on page 70.Added a list of tables and list of figures.Removed unused glossary entries.3May 2011 General review and redraft4September 2011 Updated LED tableRemoved UMTS/GSM references Updated LTE power consumptionAdded suggested antenna part number

Product Technical Specification & Customer Design Guidelines6 Proprietary and Confidential - Contents subject to change 2400074

Rev 4 Sep.11 Proprietary and Confidential - Contents subject to change 7ContentsIntroduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15Supported RF bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Physical features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Application interface features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Packet mode features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16LTE features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Short Message Service (SMS) features. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Position location (GPS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Warranty and support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Supporting documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Required connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Ordering information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Integration requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Technology Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19LTE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19CDMA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191xEV-DO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .191X and IS-95A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20Standards Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23Host interface pin assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29USB interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29USB high / full speed throughput performance . . . . . . . . . . . . . . . . . . . . .29User-developed drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30

Product Technical Specification & Customer Design Guidelines8 Proprietary and Confidential - Contents subject to change 2400074SIM interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30SIM implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32Control interface (Signals) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33W_DISABLE_N — Wireless disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33WLAN_LED_N — LED output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34Digital interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35RF Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37RF connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Shielding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Antenna and cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38Ground connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39Interference and sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39Interference from other wireless devices . . . . . . . . . . . . . . . . . . . . . . . . . 39Host-generated RF interference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40Device-generated RF interference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40Methods to mitigate decreased Rx performance . . . . . . . . . . . . . . . . . . . 40Radiated Spurious Emissions (RSE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40Radiated sensitivity measurement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Sierra Wireless’ sensitivity testing and desensitization investigation . . . 41Sensitivity vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Supported frequencies. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Conducted Rx sensitivity / Tx power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42GPS specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45Module power states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47Power state transitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

ContentsRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 9Power interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49Power ramp-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49Power-up timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49Power supply noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50SED (Smart Error Detection) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50Software Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51Support tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51USB interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51TCP window size (Windows XP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51Mechanical and Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . .53Device views . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55Electrostatic discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55Thermal considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56Regulatory and Industry Approvals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59Important notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59Safety and hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59Important compliance information for North American users . . . . . . . . . . . . 60OEM integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61Application of regulatory guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61OEM device classification process . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61Antenna Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65Recommended GPS antenna specifications . . . . . . . . . . . . . . . . . . . . . . . . 67Antenna tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67Design Checklist . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71AT command entry timing requirement . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

Product Technical Specification & Customer Design Guidelines10 Proprietary and Confidential - Contents subject to change 2400074Acceptance testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71Acceptance test requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72Acceptance test procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72Certification testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72Production testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73Functional production test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73Production test procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74Testing CDMA RF Receive path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77LTE RF receive path test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78GPS standalone connector test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80Quality assurance testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80Suggested testing equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81Testing assistance provided by Sierra Wireless . . . . . . . . . . . . . . . . . . . . . 81IOT/Operator testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81Extended AT commands for testing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87Web site support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87Sierra Wireless documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87Command documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87Other Sierra documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87Industry / other documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

Rev 4 Sep.11 Proprietary and Confidential - Contents subject to change 11List of TablesTable 1-1: Supported RF bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Table 1-2: Required host-module connectors . . . . . . . . . . . . . . . . . . . . . . . . . . 18Table 3-1: Standards compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21Table 4-1: Connector pin assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26Table 4-2: Power and ground specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . 29Table 4-3: USB interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29Table 4-4: SIM interface signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30Table 4-5: Module control signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33Table 4-6: LED states (Default behavior) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34Table 4-7: GPIO signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35Table 5-1: LTE frequency band support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Table 5-2: LTE bandwidth support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Table 5-3: CDMA frequency band support . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Table 5-4: Conducted Rx (Receive) sensitivity — LTE bands . . . . . . . . . . . . . . 42Table 5-5: Conducted Rx (Receive) sensitivity — CDMA bands . . . . . . . . . . . . 42Table 5-6: Conducted Tx (Transmit) power tolerances . . . . . . . . . . . . . . . . . . . 43Table 5-7: GPS specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43Table 6-1: Averaged standby DC power consumption . . . . . . . . . . . . . . . . . . . 45Table 6-2: CDMA DC power consumption (+3.3V) . . . . . . . . . . . . . . . . . . . . . . 46Table 6-3: Averaged call mode DC power consumption (LTE) . . . . . . . . . . . . . 46Table 6-4: Miscellaneous DC power consumption . . . . . . . . . . . . . . . . . . . . . . 47Table 6-5: Module power states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47Table 6-6: Power state transitions (including voltage / temperature trigger levels). . 48Table 8-1: Mechanical and environmental specifications . . . . . . . . . . . . . . . . . 53Table A-1: Antenna requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65Table A-2: GPS standalone antenna requirements. . . . . . . . . . . . . . . . . . . . . . 67Table B-1: Hardware integration design considerations . . . . . . . . . . . . . . . . . . 69

Product Technical Specification & Customer Design Guidelines12 Proprietary and Confidential - Contents subject to change 2400074Table C-1: Test settings — Receive path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78Table C-2: Extended AT commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82Table F-1: Acronyms and definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

Rev 4 Sep.11 Proprietary and Confidential - Contents subject to change 13List of FiguresFigure 4-1: System block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24Figure 4-2: Expanded RF block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25Figure 4-3: SIM application interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31Figure 4-4: SIM card contacts (contact view) . . . . . . . . . . . . . . . . . . . . . . . . . . 31Figure 4-5: Recommended wireless disable connection . . . . . . . . . . . . . . . . . . 33Figure 4-6: Example LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34Figure 5-1: Module connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Figure 6-1: Voltage / temperature monitoring state machines . . . . . . . . . . . . . . 49Figure 6-2: Power-up timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49Figure 8-1: Top and bottom views . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54Figure 8-2: Dimensioned view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54Figure 8-3: Unit label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55Figure 8-4: Shield locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56Figure 4-1: Device placement in module tray . . . . . . . . . . . . . . . . . . . . . . . . . . 85Figure 4-2: Shipping package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

Product Technical Specification & Customer Design Guidelines14 Proprietary and Confidential - Contents subject to change 2400074

Rev 4 Sep.11 Proprietary and Confidential - Contents subject to change 1511: IntroductionThe Sierra Wireless MC7750 PCI Express Mini Card is a compact, lightweight, wireless LTE - and CDMA-based modem, designed to be Verizon Wireless certified.The MC7750 provides LTE, CDMA, and GPS connectivity for portable and handheld computers, point-of-sale devices, telemetry products and other machine-to-machine and vertical applications over several radio frequency bands.Supported RF bandsThe modem, based on Qualcomm's MDM9600 baseband processor, supports data operation on LTE and CDMA networks.Physical features•Small form factor—conforms to F1 as specified in PCI Express Mini Card Electromechanical Specification Revision 1.2.•Operating temperature range: -30 °C to +60 °CApplication interface features•USB interface (QMI )•NDIS NIC interface support for Windows 7, Windows Vista, and Windows XP platforms•Multiple non-multiplexed USB channel support•USB selective suspend to maximize power savings•AT command interface ([1] AT Command Set for User Equipment (UE) (Release 6) (Doc# 3GPP TS 27.007), plus proprietary extended AT commands)•Software Development Kit (SDK) including a Linux API (Appli-cation Program Interface)Table 1-1: Supported RF bands Technology Bands DiversityLTE •Band 13: 700 MHz (MIMO)CDMA •Cellular (800 MHz)•PCS (1900 MHz) GPS •1575.42 MHz n/a

Product Technical Specification & Customer Design Guidelines16 Proprietary and Confidential - Contents subject to change 2400074•WMC DLL support for Verizon Wireless PC-OEM (Windows)OMA DM (Open Mobile Alliance Device Management)FOTA (Firmware Over The Air)Packet mode features•LTE data rates (category 3, MIMO)·100 Mbps DL within 20 MHz bandwidth·50 Mbps UL within 20 MHz bandwidth•CDMA IS-856 (1xEV-DO Rev. A) data rates·Up to 3.1 Mbps forward channel·Up to 1.8 Mbps reverse channel•CDMA IS-2000 data rates — Up to 153 kbps, simultaneous forward and reverse channel•Circuit-switched data bearers (up to 14.4 for CDMA)LTE features•Basic cell selection and system acquisition·PSS / SSS / MIB decode·SIB1, SIB2, SIB3 decoding•NAS / AS security procedures·Snow 3G/AES security•CQI / RI reporting•Paging procedures·Paging in Idle and Connected mode•Dedicated bearer·Network-initiated dedicated bearer·UE-initiated dedicated bearer•Multiple PDN connections (IPv4 and IPv6 combinations)•Connected mode intra-LTE mobility•Idle mode intra-LTE mobility•iRAT between LTE / 2G (future release)iRAT between LTE / 3G for idle and connection release with redirection (future release)•Detach procedure·Network-initiated detach with reattach required·Network-initiated detach followed by connection release•LTE  eHRPD redirection with data continuity (IPv4/IPv6)Short Message Service (SMS) features•Mobile-terminated SMS for CDMA•Mobile-originated SMS for CDMA•Mobile-terminated SMS over IMS for LTE / eHRPD

IntroductionRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 17•Mobile-originated SMS over IMS for LTE / eHRPDPosition location (GPS)•Standalone mode•GLONASS support on GPS connector 1 (future release)•DC bias on GPS connector 1 to support external active GPS antennaWarranty and supportThe MC7750 offers the following support features:•Standard 1-year warranty•Enabling software (drivers, SDK, etc.) for Android, Linux, Windows 7, Windows Vista, and Windows XPSupporting documentsSeveral additional documents describe Mini Card design, usage, integration, and other features. See References on page 87.AccessoriesThe Universal Development Kit (UDK) is a hardware development platform for AirPrime MC-series modules. It contains hardware components for evaluating and developing with the module, including:•Development board•Cables•Antennas (Bands 17, 13, and 7 are not supported by supplied antennas)•Documentation suite•Initial allotment of support hours•Other accessoriesFor instructions on setting up the UDK, see [4] PCI Express Mini Card Dev Kit Quick Start Guide (Doc# 2130705).For over-the-air LTE testing, ensure that suitable antennas are used. (Two antennas are required for this testing; Sierra Wireless offers an LTE-capable antenna covering 700–2600 MHz BW — please order part number 6000492 (Qty 1 — this contains two antennas).)

Product Technical Specification & Customer Design Guidelines18 Proprietary and Confidential - Contents subject to change 2400074Required connectorsTab l e 1-2 describes the connectors used to integrate AirPrime MC-series modules into your host device.Ordering informationTo order, contact the Sierra Wireless Sales Desk at +1 (604) 232-1488 between 8 AM and 5 PM Pacific Time.Integration requirementsSierra Wireless provides, in the document suite, guidelines for successful Mini Card integration and offers integration support services as necessary.When integrating the MC7750 PCI-Express Mini Card, the following items need to be addressed:•Mounting—Effect on temperature, shock, and vibration performance•Power supply—Impact on battery drain and possible RF interference•Antenna location and type—Impact on RF performance•Regulatory approvals—As discussed in Regulatory and Industry Approvals on page 59.•Service provisioning—Manufacturing process •Software—As discussed in Software Interface on page 51.•Host Interface, compliance with interface voltage levelsTable 1-2: Required host-module connectors11. Manufacturers/part numbers are for reference only and are subject to change. Choose connectors that are appropriate for your own design.Connector type DescriptionRF cables •Mate with Hirose U.FL connectors (model U.FL #CL331-0471-0-10)•Two or three connector jacks, depending on module support for diversity and GPS functionality. (Note: The UDK has two connector jacks.)EDGE (52-pin) •Industry-standard mating connector•Some manufacturers include Tyco, Foxconn, Molex•Example: UDK board uses Molex 67910-0001SIM •Industry-standard connector. Type depends on how host device exposes the SIM socket•Example: UDK board uses ITT CCM03-3518

Rev 4 Sep.11 Proprietary and Confidential - Contents subject to change 1922: Technology OverviewLTELTE (Long Term Evolution) is a 4th-generation wireless standard. The 3GPP Release 8 specification outlines the features and requirements.Key features include.•Peak data rate:·100 Mbps DL within 20 MHz bandwidth(Peak DL data rate in 10 MHz bandwidth: 70 Mbps (approx.) for Cat 3 device)·50 Mbps UL within 20 MHz bandwidthActual throughput is dependent on the network configuration, bandwidth assigned to the UE, the number of users, and RF sig-nal conditions.•Up to 200 active users in a cell (5 MHz)•Less than 5 ms user-plane latency•Supported bandwidths: 5 MHz / 10 MHz•Spectrum flexibility: 1.4–20 MHz (3–20 MHz in future F/W release)•Enhanced support for end-to-end QOS•Physical layer uses:·DL: OFDMA (Orthogonal Frequency Division Multiple Access).Modulation: QPSK, 16QAM, and 64QAM·UL: Single Carrier FDMA (single carrier modulation and orthogonal frequency multiplexing)Modulation: QPSK, 16QAM•MIMO (Multi-Input Multi-Output) antenna supportCDMA1xEV-DO1xEV-DO is backwards compatible to both 1X and IS-95A/B standards. However, 1xEV-DO represents an evolutionary enhancement, specifically designed and optimized for high-speed wireless data access. This was driven by fundamental differences between voice and data traffic characteristics.

Product Technical Specification & Customer Design Guidelines20 Proprietary and Confidential - Contents subject to change 2400074eHRPD (Enhanced High Rate Packet Data) is an enhancement of 1xEV-DO that enables LTE to CDMA handover.To optimize for data, there are some fundamental characteristics and differences between 1X and 1xEV-DO, including:•The network has dedicated spectrum (1.25 MHz) for data traffic using 1xEV-DO standard, so resources don’t compete with 1X data/voice (hybrid mode used to monitor 1X carriers)•BTS always transmits at maximum available power•Each user receives data from only one base station at a time (no forward link soft handoff)•1xEV-DO lets each user use 100% of available resources, while dynamically allocating time resources among users for maximum efficiency•1xEV-DO uses time-division multiplexing of users on forward link (slots assigned for packet transmission)•Forward link supports higher order modulation (QPSK, 8-PSK and 16-QAM)•Reverse link (1xEV-DO Revision A) supports higher order modulation (8-PSK)•Mobile supports dynamic channel estimation using measured S/N to set the highest rate it can decode (uses Data Rate Control channel to communicate to network access point)•Mobiles can support Rx diversity for S/N enhancements particularly in multi-path/fading environments1X and IS-95AThe type of data connection made at any given time depends on the services available from the carrier in the given coverage area. If 1X packet services are not available, the modem connects using circuit-switched data over IS-95A technology. The modem automatically selects the fastest connection mode available when a data call is connecting.When roaming, the modem does not automatically change connection modes. If the modem connects using 1X and then roams outside of the packet service area, the connection is dropped. To resume data communication, a new connection using IS-95A has to be created. Similarly, an IS-95A call established in one area does not automatically transition to 1X when the unit enters the 3G coverage area.

Rev 4 Sep.11 Proprietary and Confidential - Contents subject to change 2133: Standards ComplianceThe MC7750 Mini Card complies with the mandatory requirements described in the following standards. The exact set of requirements supported is carrier-dependent.Table 3-1: Standards compliance Technology StandardsLTE •3GPP Release 8CDMA •TIA/EIA/IS-2000.1 through .6. cdma2000® Standards for Spread Spectrum Systems. Release 0. April 2000•TIA/EIA/IS-2000.1-1 through .6-1. cdma2000® Addendum 1. April 2000•TIA/EIA/IS-2000.1-2 through .6-2. cdma2000® Addendum 2. June 2001•TIA/EIA/IS-95-B. Mobile Station-Base Station Compatibility Standard for Dual-Mode Spread Spectrum Systems. December 4, 1998•TIA/EIA/IS-. cdma2000® High Rate Packet Data Air Interface Specification. November 2000

Product Technical Specification & Customer Design Guidelines22 Proprietary and Confidential - Contents subject to change 2400074

Rev 4 Sep.11 Proprietary and Confidential - Contents subject to change 2344: Electrical SpecificationsThe system block diagram in Figure 4-1 represents the MC7750 module integrated into a host system. The module includes the following interfaces to the host:•Power — Supplied to the module by the host.•W_DISABLE_N — Active low input from a hardware switch to the MC7750 that disables the main RF radio.•WLAN_LED_N — Active-low LED drive signal provides an indication of RADIO ON state, either WAN or GPS.•Antenna — Three U.FL RF connectors (two for Rx / Tx, and one for GPS). For details, see RF Specifications on page 37.Note that GPS can use either the dedicated GPS port, or the diversity/MIMO port. GLONASS is supported only on the dedicated GPS port.•SIM — Supported through the interface connector. The SIM cavity / connector must be placed on the host device for this feature.•USB — Interface to the host for data, control, and status infor-mation.•GPIO — Six GPIOs reserved for future use.The MC7750 has two main interface areas — the host I/O connector and the RF ports. Details of these interfaces are described in the sections that follow.

Product Technical Specification & Customer Design Guidelines24 Proprietary and Confidential - Contents subject to change 2400074Figure 4-1: System block diagramExternal NAND 1Gb NAND EBI2GPIO55GPIO56GPIO57PCB IDGPIO65GPIO66GPIO67GPIO68GPIO69GPIO70HW Rev IDHW_ID_0HW_ID_1HW_ID_2HW_ID_3HW_ID_4HW_ID_5PCB_ID_0PCB_ID_1PCB_ID_2W_DISABLE_NVCC_3.3VGPIO_1USIMHS-USBGPIO25GPIO24GPIO23MFG MODEMFG_MODE0_NMFG_MODE1_NMFG_MODE2_NGPIO_2GPIO_3GPIO_4USIM VPH/VBATKPD_PWR_NBATT_ID/MPP8BATT_THERM/MPP7WLAN_LED_NGPIO102PS_HOLDGPIO8 PM_INT_NMPM_GPIO_1MPM_GPIO_2 PMIC_SSBITCXO_ENRF + GRFC_GPIORF BLOCKMDM9600PM8028INTERFACE CONNECTORVGA_MONITORVGA_UMTS_MONITORMPP11PWM_OUTMPP4PA_BOOST_ENXTAL_19M_INXO_OUT_D0XO_OUT_A0VCTCXO_DFFTCXO_RTRVCTCXOXO_OUT_ENPM_INT_NSSBIInternal64MB DDR SDRAMUSIMGPIO_5GPIO_6

Electrical SpecificationsRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 25Figure 4-2: Expanded RF block diagramHost interface pin assignmentsThe MC7750 host I/O connector provides pins for power, serial communications, and control. Pin assignments are listed in Tabl e 4-1. See the following tables for pin details based on interface types:•Tab l e 4-2, Power and ground specifications, on page 29•Tab l e 4-3, USB interface, on page 29•Tab l e 4-4, SIM interface signal, on page 30•Tab l e 4-5, Module control signals, on page 33Note: On any given interface (USB, SIM, etc.), leave unused inputs and outputs as no-connects.DiplexerSP5TDRX_LB2B8B8PRX_LB1BC0+B5+GSM850B8+GSM900PRX_LB2PRX_MB2PRX_MB1DRX_MB1B13B13DRX_LB1DRX_MB2DRX_HB B1dBC0/B5GSM850/900GSM1800/1900TX_LB4TX_MB1TX_LB2TX_LB1TX_LB3TX_MB3RF Diversity/GPS Connector 2SP2TGPSLNAGNSSSP2TPARF Main ConnectorSP10TRTR8600B1BC1/B2SP2TPRX_I DRX_QPRX_Q DRX_IBASEBAND:MDM9600 orPMIC8028GNSS_IGNSS_QTX_I TX_Q Jammer DetTCXODAC_REF RTR_SSBGNSSConnector 1B13dBC1d + B2dBC0d + B5d + B8dPower DetB1dGSM1800 + GSM1900TX_MB4B1BC1 + B2BC0 + B5B13BC1/B2B1 PAPAPAPAPA

Product Technical Specification & Customer Design Guidelines26 Proprietary and Confidential - Contents subject to change 2400074Note: The following table describes the internal structure of the module.GPIO pins are reserved for future use. For applications not requiring GPIO functionality, leave these pins not connected on the host.Table 4-1: Connector pin assignments1 Pin Signal name Pin type2Description Direction to module Active stateVoltage levels (V)Min Typ Max1NC -No connectReserved for future use.- - - - -2VCC V3.3 V supply Input Power 3.0 3.3 3.63NC -No connectReserved for future use- - - - -4GND VGround Input Power - 0 -5NC -No connectReserved for future use- - - - -6GPIO1 -General purpose I/O Input high -1.17 1.80 2.10Input low --0.3 -0.63Output high -1.35 -1.80Output low - 0 - 0.457NC -No connect - - - - -8USIM_PWR -SIM VCC supply Output Power 2.95 (3V SIM)1.75 (1.8V SIM)3.00 (3V SIM)1.8 (1.8V SIM)3.05 (3V SIM)1.85 (1.8V SIM)9GND VGround Input Power - 0 -10 USIM_DATA -SIM IO pin Input Low -0.3 (3V SIM)-0.3 (1.8V SIM)-1.05 (3V SIM)0.63 (1.8V SIM)High 1.95 (3V SIM)1.17 (1.8V SIM)3.0 (3V SIM)1.8 (1.8V SIM)3.3 (3V SIM)2.1 (1.8V SIM)Output Low 0 - 0.45High 2.55 (3V SIM)1.35 (1.8V SIM)-3.0 (3V SIM)1.8 (1.8V SIM)11 NC -No connect - - - - -12 USIM_CLK -SIM Clock Output Low 0 - 0.45High 2.55 (3V SIM)1.35 (1.8V SIM)-3.0 (3V SIM)1.8 (1.8V SIM)13 NC -No connect - - - - -

Electrical SpecificationsRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 2714 USIM_RST -SIM Reset Output Low 0 - 0.45High 2.55 (3V SIM)1.35 (1.8V SIM)-3.0 (3V SIM)1.8 (1.8V SIM)15 GND VGround Input Power - 0 -16 GPIO2 -General purpose I/O Input high -1.17 1.80 2.10Input low --0.3 -0.63Output high -1.35 -1.80Output low - 0 - 0.4517 NC -No connect - - - - -18 GND VGround Input Power - 0 -19 NC -No connect - - - - -20 W_DISABLE_N -Wireless Disable (main RF radio) Input Low - - 0.421 GND VGround Input Power - 0 -22 NC -No connect - - - - -23 NC -No connect - - - - -24 VCC V3.3 V supply Input Power 3.0 3.3 3.625 NC -No connect - - - - -26 GND VGround Input Power - 0 -27 GND VGround Input Power - 0 -28 GPIO3 -General purpose I/O Input high -1.17 1.80 2.10Input low --0.3 -0.63Output high -1.35 -1.80Output low - 0 - 0.4529 GND VGround Input Power - 0 -30 NC -No connect - - - - -31 NC -No connect - - - - -32 NC -No connect - - - - -33 NC -No connect - - - - -34 GND VGround Input Power - 0 -35 GND VGround Input Power - 0 -36 USB_D- -USB data negative Input/Output Differential - - -Table 4-1: Connector pin assignments1 (Continued)Pin Signal name Pin type2Description Direction to module Active stateVoltage levels (V)Min Typ Max

Product Technical Specification & Customer Design Guidelines28 Proprietary and Confidential - Contents subject to change 240007437 GND VGround Input Power - 0 -38 USB_D+ -USB data positive Input/Output Differential - - -39 VCC V3.3 V supply Input Power 3.0 3.3 3.640 GND VGround Input Power - 0 -41 VCC V3.3 V supply Input Power 3.0 3.3 3.642 WLAN_LED_N -LED Driver Output Low 0 - 0.4543 GND VGround Input Power - 0 -44 GPIO4 -General purpose I/O Input high -1.17 1.80 2.10Input low --0.3 -0.63Output high -1.35 -1.80Output low - 0 - 0.4545 NC -No connect - - - - -46 GPIO5 -General purpose I/O Input high -1.17 1.80 2.10Input low --0.3 -0.63Output high -1.35 -1.80Output low - 0 - 0.4547 NC -No connect - - - - -48 GPIO6 -General purpose I/O Input high -1.17 1.80 2.10Input low --0.3 -0.63Output high -1.35 -1.80Output low - 0 - 0.4549 NC -No connect - - - - -50 GND VGround Input Power - 0 -51 NC -No connectReserved for future use- - - - -52 VCC V3.3 V supply Input Power 3.0 3.3 3.61. The host should leave all ‘NC’ (‘no connect) pins unconnected.2. A —Analog; I — Input; NP — No pull; O — Digital output; PU — Digital input (internal pull up); PD — Digital output (internal pull down); V — Power or groundTable 4-1: Connector pin assignments1 (Continued)Pin Signal name Pin type2Description Direction to module Active stateVoltage levels (V)Min Typ Max

Electrical SpecificationsRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 29Power supplyThe host provides power to the MC7750 through multiple power and ground pins as summarized in Ta bl e 4-2.The host must provide safe and continuous power at all times; the module does not have an independent power supply, or protection circuits to guard against electrical issues.USB interfaceThe USB interface is the path for communication between the host and module.The interface complies with the [12] Universal Serial Bus Specification, Rev 2.0, and the host device must be designed to the same standard. (When designing the host device, careful PCB layout practices must be followed.)USB interface features include:•Data rate: Full-speed (12 Mbps) / High-speed (480 Mbps)•Module enumeration:·Windows: Modem or COM ports, using host Windows drivers·Linux: / dev / ttyUSBn devices for Linux systems with the Sierra Wireless driver installed•USB-compliant transceivers•Selective suspend mode•Resumption initiated by host or moduleUSB high / full speed throughput performanceThis device has been designed to achieve optimal performance and maximum throughput using USB high speed mode. Although the device may operate with a full speed host, throughput performance will be on an “as is” basis and needs to Table 4-2: Power and ground specifications Name Pins Specification Min Typ Max UnitsVCC 2, 24, 39, 41, 52 Voltage range See Table 4-1 on page 26.Ripple voltage --100 mVppGND 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50- - 0 - VTable 4-3: USB interface Name Pin DescriptionUSB_D- 36 USB data negativeUSB_D+ 38 USB data positive

Product Technical Specification & Customer Design Guidelines30 Proprietary and Confidential - Contents subject to change 2400074be characterized by the OEM. Note that throughput will be reduced and may vary significantly based on packet size, host interface, and firmware revision. Sierra Wireless does not recommend using this device in USB full speed mode.User-developed driversIf you will be developing your own USB drivers, see [5] AirCard / AirPrime USB Driver Developer’s Guide (Doc# 2130634). SIM interfaceThe module supports one SIM (Subscriber Identity Module) (1.8 V or 3 V). The SIM holds account information, allowing users to use their account on multiple devices.The SIM pins (Ta b l e 4-4) provide the connections necessary to interface to a SIM socket located on the host device as shown in Figure 4-3 on page 31. Voltage levels over this interface comply with 3GPP standards. Table 4-4: SIM interface signal Name Pin Description SIM contact number1NotesUSIM_PWR 8SIM voltage 1Power supply for SIMUSIM_DATA 10 Data I/O 7Bi-directional SIM data lineUSIM_CLK 12 Serial clock 3Serial clock for SIM dataUSIM_RST 14 Reset 2Active low SIM resetUSIM_GND Ground 5Ground referenceUSIM_GND is common to module ground1. See Figure 4-4 on page 31 for SIM card contacts.

Electrical SpecificationsRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 31Figure 4-3: SIM application interfaceFigure 4-4: SIM card contacts (contact view)AirPrime embedded moduleSIM card connector(Optional. Locate near the SIM socket)47 pF, 51 4.7uFX5Rtyp(C1)USIM_PWRUSIM_CLKUSIM_DATAUSIM_RSTLocated near SIM socketLocated near SIM socket.NOTE: Carefully consider if ESD protection is required – it may increase signal rise time and lead to certification failureUSIM_GNDESD protection(C3)(C7)(C2)(C5)(Optional. Locate near the SIM socket)15 k - 30 k0.1uFC8C7C6C5C4C3C2C1GND VCCVPP RSTI/O CLKRFU RFUContact View (notched corner at top left)

Product Technical Specification & Customer Design Guidelines32 Proprietary and Confidential - Contents subject to change 2400074SIM implementationNote: For interface design requirements, refer to:(2G) 3GPP TS 51.010-1, section 27.17, or(3G) ETSI TS 102 230 V5.5.0, section 5.2.When designing the remote SIM interface, you must make sure that SIM signal integrity is not compromised.Some design recommendations include:•Total impedance of the VCC and GND connections to the SIM, measured at the module connector, should be less than 1  to minimize voltage drop (includes any trace impedance and lumped element components — inductors, filters, etc.).•Position the SIM connector 10 cm from the module. If a longer distance is required because of the host device design, use a shielded wire assembly — connect one end as close as possible to the SIM connector and the other end as close as possible to the module connector. The shielded assembly may help shield the SIM interface from system noise.•Reduce crosstalk on the USIM_DATA line to reduce the risk of failures during GCF approval testing.•Avoid routing the USIM_CLK and USIM_DATA lines in parallel over distances 2 cm — cross-coupling of these lines can cause failures.•3GPP has stringent requirements for I / O rise time (<1 µs), signal level limits, and noise immunity — consider this carefully when developing your PCB layout.·Keep signal rise time <1 µs — keep USIM signals as short as possible, and keep very low capacitance traces on the USIM_DATA and USIM_CLK signals. High capacitance increases signal rise time, potentially causing your device to fail certification tests.•Add external pull-up resistors (15 k–30 k), if required, between the USIM_DATA and USIM_PWR lines to optimize the signal rise time.•VCC line should be decoupled close to the SIM socket.•SIM is specified to run up to 5 MHz (SIM clock rate). Take note of this speed in the placement and routing of the SIM signals and connectors.•You must decide whether additional ESD protection is required for your product, as it is dependent on the application, mechanical enclosure, and SIM connector design. The SIM pins will require additional ESD protection if they are exposed to high ESD levels (i.e. can be touched by a user).•Putting an optional decoupling capacitor at USIM_PWR near the SIM socket is recommended — the longer the trace length (impedance) from the socket to the module, the greater the capacitance requirement to meet compliance tests.•Putting an optional series capacitor and resistor termination (to ground) at USIM_CLK at the SIM socket to reduce EMI and increase signal integrity is recommended if the trace length between the SIM socket and module is long — 47 pF and 50  resistor are recommended.•Test your first prototype host hardware with a Comprion IT3 SIM test device at a suitable testing facility.

Electrical SpecificationsRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 33Control interface (Signals)The MC7750 provides signals for:•Power control of the module from the host•LED driver outputThese signals are summarized in Ta b l e 4-5 and paragraphs that follow.W_DISABLE_N — Wireless disableThe host device uses W_DISABLE_N (pin 20) to enable / disable the WWAN or radio modem. When disabled, the modem cannot transmit or receive information.Letting this signal float high allows the module to operate normally. This switch follows the behavior described in [11] PCI Express Mini Card Electromechanical Specification Revision 1.2. This pin has a 20 k pull-up resistor. See Figure 4-5 on page 33 for a recommended implementation.When integrating with your host device, keep the following in mind:•The signal is an input to the module and should be driven LOW only for its active state (controlling the power state); otherwise it should be floating or (High impedance). It should never be driven to a logic high level. The module has an internal pull-up resistor to Module Power (3.3V) in place, so if the signal is floating or (high impedance), the module will power on.•Wait for two seconds after asserting W_DISABLE_N before disconnecting power.•If the host never needs to assert this power state control to the module, leave this signal unconnected from the host interface.Figure 4-5: Recommended wireless disable connectionTable 4-5: Module control signals Name Pin Description Type11. O — Digital pin Output; PU — Digital pin Input, internal pull upW_DISABLE_N 20 Wireless disable (Main RF) PUWLAN_LED_N 42 LED driver OMiniCardRWireless disable control 123Q20kHost3.3V PMIC for W_DISABLE_N

Product Technical Specification & Customer Design Guidelines34 Proprietary and Confidential - Contents subject to change 2400074WLAN_LED_N — LED outputThe module drives the LED output according to [11] PCI Express Mini Card Electromechanical Specification Revision 1.2, as described in Tab le 4-6 (below).If desired, LED behavior can be configured using AT!LEDCTRL. Figure 4-6: Example LEDTable 4-6: LED states (Default behavior)StateLED behaviorDescription !LEDCTRL indexPeriod (s) On OffOff 00% 100% Module is not powered.(W_DISABLE_N asserted with PCOFFEN=1) N/AAirplane mode 250% 50% Module is in low power mode.(W_DISABLE_N asserted with PCOFFEN=0) 4Power up 5.2 96% 4% Module is performing initial power up activities. N/ASearching 96% 4% Module is searching service. 1Connected 0.5 80% 20% Module has an active context. 3Connected, with data transfer occuring 0.5 80% 20% Module has an active context and data is being transferred. 5Error 1.6 20% 80% Device error has occurred. N/AAttached 1 100% 0% Module has attached to a network and is not currently in a call. 2Current limiting ResistorLEDVCC 3.3VMIOMiniCard

Electrical SpecificationsRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 35Digital interfaceThe MC7750 Mini Card provides the general purpose digital I/O (GPIO) signals listed in Tabl e 4-7:•By default, all GPIO pins are set as inputs.•Voltage should not be applied until > 1s after VCC is applied to the minicard.•GPIO pins are available for OEM-defined purposes but may, in future firmware releases, be allocated by Sierra Wireless for specific functionality.•For applications not requiring GPIO functionality, leave these pins not connected on the host.Table 4-7: GPIO signals Name Pin Description Type1,21. GPIO pins are initialized as PD by the firmware.2. PD — Digital pin Input, internal pull downGPIO1 6General purpose IO PDGPIO2 16 General purpose IO PDGPIO3 28 General purpose IO PDGPIO4 44 General purpose IO PDGPIO5 46 General purpose IO PDGPIO6 48 General purpose IO PD

Product Technical Specification & Customer Design Guidelines36 Proprietary and Confidential - Contents subject to change 2400074

Product Technical Specification & Customer Design Guidelines38 Proprietary and Confidential - Contents subject to change 2400074Antenna and cablingWhen selecting the antenna and cable, it is critical to RF performance to match antenna gain and cable loss.Note: For detailed electrical performance criteria, see Appendix A: Antenna Specification on page 65.Choosing the correct antenna and cablingWhen matching antennas and cabling:•The antenna (and associated circuitry) should have a nominal impedance of 50  with a return loss of better than 10 dB across each frequency band of operation.•The system gain value affects both radiated power and regulatory (FCC, IC, CE, etc.) test results.Designing custom antennasConsider the following points when designing custom antennas:•A skilled RF engineer should do the development to ensure that the RF performance is maintained.•If both CDMA and UMTS modules will be installed in the same platform, you may want to develop separate antennas for maximum performance.Determining the antenna’s locationWhen deciding where to put the antennas:•Antenna location may affect RF performance. Although the module is shielded to prevent interference in most applications, the placement of the antenna is still very important — if the host device is insufficiently shielded, high levels of broadband or spurious noise can degrade the module’s perfor-mance.•Connecting cables between the module and the antenna must have 50  impedance. If the impedance of the module is mismatched, RF performance is reduced significantly.•Antenna cables should be routed, if possible, away from noise sources (switching power supplies, LCD assemblies, etc.). If the cables are near the noise sources, the noise may be coupled into the RF cable and into the antenna. See Interference from other wireless devices on page 39.Disabling the diversity antenna•For LTE bands, use the AT command !RXDEN=0 to disable receive diversity or !RXDEN=1 to enable receive diversity.•For CDMA bands, use the AT command !DIVERSITY to enable or disable receive diversity.

RF SpecificationsRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 39Note: A diversity antenna is used to improve connection quality and reliability through redundancy. Because two antennas may experience difference interference effects (signal distortion, delay, etc.), when one antenna receives a degraded signal, the other may not be similarly affected.Ground connectionWhen connecting the module to system ground:•Prevent noise leakage by establishing a very good ground connection to the module through the host connector.•Connect to system ground using the two mounting holes at the top of the module (shown in Figure 5-1 on page 37).•Minimize ground noise leakage into the RF.Depending on the host board design, noise could potentially be coupled to the module from the host board. This is mainly an issue for host designs that have signals traveling along the length of the module, or circuitry operating at both ends of the module interconnects.Interference and sensitivitySeveral interference sources can affect the module’s RF performance (RF desense). Common sources include power supply noise and device-generated RF.RF desense can be addressed through a combination of mitigation techniques (Methods to mitigate decreased Rx performance on page 40) and radiated sensitivity measurement (Radiated sensitivity measurement on page 41).Note: The MC7750 is based on ZIF (Zero Intermediate Frequency) technologies. When performing EMC (Electromagnetic Compatibility) tests, there are no IF (Intermediate Frequency) components from the module to consider.Interference from other wireless devicesWireless devices operating inside the host device can cause interference that affects the module.To determine the most suitable locations for antennas on your host device, evaluate each wireless device’s radio system, considering the following:•Any harmonics, sub-harmonics, or cross-products of signals generated by wireless devices that fall in the module’s Rx range may cause spurious response, resulting in decreased Rx performance.•The Tx power and corresponding broadband noise of other wireless devices may overload or increase the noise floor of the module’s receiver, resulting in Rx desense.

Product Technical Specification & Customer Design Guidelines40 Proprietary and Confidential - Contents subject to change 2400074The severity of this interference depends on the closeness of the other antennas to the module’s antenna. To determine suitable locations for each wireless device’s antenna, thoroughly evaluate your host device’s design.Host-generated RF interferenceAll electronic computing devices generate RF interference that can negatively affect the receive sensitivity of the module.Proximity of host electronics to the antenna in wireless devices can contribute to decreased Rx performance. Components that are most likely to cause this include:•Microprocessor and memory•Display panel and display drivers•Switching-mode power suppliesDevice-generated RF interferenceThe module can cause interference with other devices. Wireless devices such as AirPrime embedded modules transmit in bursts (pulse transients) for set durations (RF burst frequencies). Hearing aids and speakers convert these burst frequencies into audible frequencies, resulting in audible noise. Methods to mitigate decreased Rx performanceIt is important to investigate sources of localized interference early in the design cycle. To reduce the effect of device-generated RF on Rx performance:•Put the antenna as far as possible from sources of interference. The drawback is that the module may be less convenient to use.•Shield the host device. The module itself is well shielded to avoid external interference. However, the antenna cannot be shielded for obvious reasons. In most instances, it is necessary to employ shielding on the components of the host device (such as the main processor and parallel bus) that have the highest RF emissions. •Filter out unwanted high-order harmonic energy by using discrete filtering on low frequency lines.•Form shielding layers around high-speed clock traces by using multi-layer PCBs.•Route antenna cables away from noise sources.Radiated Spurious Emissions (RSE)When designing an antenna for use with AirPrime embedded modules, the host device with an AirPrime embedded module must satisfy the radiated spurious emission (RSE) test cases described in:•(CDMA) Refer to CDMA standards for receive-only mode, and local regulatory bodies for transmit mode (transmitter is operating).

RF SpecificationsRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 41Note that antenna impedance affects radiated emissions, which must be compared against the conducted 50-ohm emissions baseline. (AirPrime embedded modules meet the 50-ohm conducted emissions requirement.)Radiated sensitivity measurementA wireless host device contains many noise sources that contribute to a reduction in Rx performance.To determine the extent of any receiver performance desensitization due to self-generated noise in the host device, over-the-air (OTA) or radiated testing is required. This testing can be performed by Sierra Wireless or you can use your own OTA test chamber for in-house testing.Sierra Wireless’ sensitivity testing and desensitization investigationAlthough AirPrime embedded modules are designed to meet carrier requirements for receiver performance, they are still susceptible to various performance inhibitors.As part of the Engineering Services package, Sierra Wireless offers modem OTA sensitivity testing and desensitization (desense) investigation. For more information, contact your account manager or the Sales Desk (see Contact Information on page 4).Note: Sierra Wireless has the capability to measure TIS (Total Isotropic Sensitivity) and TRP (Total Radiated Power) according to CTIA's published test procedure.Sensitivity vs. frequencyFor CDMA bands, sensitivity is defined as the input power level in dBm that produces a FER (Frame Error Rate) of 0.5%. Sensitivity should be measured at all CDMA frequencies across each band.For LTE bands, sensitivity is defined as the RF level at which throughput is 95% of maximum.Supported frequenciesThe MC7750 supports:•Single-band LTE — See Ta bl e 5-1 on page 42.•Dual-band CDMA — See Ta ble 5-3 on page 42.•GPS•Radio transceiver requirements for 3GPP Release 7

Product Technical Specification & Customer Design Guidelines42 Proprietary and Confidential - Contents subject to change 2400074•Inter-RAT and inter-frequency cell reselection and handover between supported frequency bands Conducted Rx sensitivity / Tx powerTable 5-1: LTE frequency band support Band FrequenciesBand 13 Tx: 777–787 MHzRx: 746–756 MHzTable 5-2: LTE bandwidth support11. Table contents are derived from 3GPP TS 36.521-1 v9.4.1, table 5.4.2.1-1.Band 1.4 MHz 3 MHz 5 MHz 10 MHz 15 MHz 20 MHzBand 13   22. Bandwidth for which a relaxation of the specified UE receiver sensitivity requirement (Clause 7.3 of 3GPP TS 36.521-1 v9.4.1) is allowed.2 Table 5-3: CDMA frequency band support Band FrequenciesPCS Tx: 1850–1910 MHzRx: 1930–1990 MHz Cellular Tx: 824–849 MHzRx: 869–894 MHzTable 5-4: Conducted Rx (Receive) sensitivity — LTE bands LTE bandsConducted Rx sensitivity (dBm)Primary(Typical) Secondary(Typical) SIMO(Typical) SIMO1(Worst case)LTE Band 13 Full RBBW: 10 MHz2-97.03-96.53-100.03-93.31. Per 3GPP specification2. Sensitivity values scale with bandwidth:x_MHz_Sensitivity = 10 MHz_Sensitivity - 10*log(10 MHz/x_MHz)3. Verizon Test MethodTable 5-5: Conducted Rx (Receive) sensitivity — CDMA bands CDMA bands Conducted Rx sensitivity (dBm)Typical Worst caseCellular (800 MHz)CDMA 1x0.5% FER -108.0 -104.0EVDO rev A0.5% PER -110.0 -105.5

RF SpecificationsRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 43GPS specificationsNote: For detailed electrical performance criteria, see Recommended GPS antenna speci-fications on page 67.PCS (1900 MHz)CDMA 1x0.5% FER -107.5 -104.0EVDO rev A0.5% PER -109.5 -105.5Table 5-6: Conducted Tx (Transmit) power tolerances Parameter Conducted transmit power (dBm)11. Preliminary valuesNotesLTELTE, Band 13 +23 dBm  1dBCDMACDMA Band Class 0 (Cellular) +24 dBm  1dBCDMA Band Class 1 (PCS) +23.5 dBm 1dB (channel 1175)+24 dBm 1dB (other channels)Table 5-7: GPS specifications 1Parameter/feature DescriptionSatellite channels 12 channel, continuous trackingProtocols NMEA 0183 V3.0Acquisition time Hot start: 1 sWarm start: 29 sCold start: 32 sAccuracy Horizontal: < 2 m (50%); < 5 m (90%)Altitude: < 4 m (50%); < 8 m (90%)Velocity: < 0.2 m/sTable 5-5: Conducted Rx (Receive) sensitivity — CDMA bands CDMA bands Conducted Rx sensitivity (dBm)Typical Worst case

Product Technical Specification & Customer Design Guidelines44 Proprietary and Confidential - Contents subject to change 2400074SensitivityTracking2: -161 dBmAcquisition3 (Assisted, non-LTE): -158 dBmAcquisition (Assisted, LTE): -153 dBmAcquisition (Standalone): -145 dBmOperational limits Altitude <6000 m or velocity <100 m/s(Either limit may be exceeded, but not both.)1. All values are preliminary.2. Tracking sensitivity is the lowest GPS signal level for which the device can still detect an in-view satellite 98% of the time when in sequential tracking mode.3. Acquisition sensitivity is the lowest GPS signal level for which the device can still detect an in-view satellite 50% of the time.Table 5-7: GPS specifications (Continued)1Parameter/feature Description

Rev 4 Sep.11 Proprietary and Confidential - Contents subject to change 4566: PowerPower consumptionNote: All specifications in these tables are prelim-inary, based on chipset published expectations.Power consumption measurements in the tables below are for the MC7750 Mini Card module connected to the host PC via USB.The module does not have its own power source and depends on the host device for power. For a description of input voltage requirements, see Power supply on page 29. Table 6-1: Averaged standby DC power consumption1 Signal Description Bands2Current3Notes / configurationTyp Max4UnitVCC Standby current consumption (Sleep mode activated5)LTE LTE Bands 5.5 8mACDMA EVDO CDMA bands 69.5 mAStandby current consumption (Sleep mode deactivated5)LTE LTE bands 55 65 mACDMA EVDO CDMA bands 58 65 mALow Power Mode (LPM) / Offline Mode (Sleep mode activated5)RF disabled, but module is operational 2.5 3.0 mALow Power Mode (LPM) / Offline Mode (Sleep mode deactivated5)RF disabled, but module is operational 67 80 mA1. 3.3V supply voltage2. For supported bands, see Table 5-1, LTE frequency band support, on page 42 and Table 5-3, CDMA frequency band support, on page 42.3. All measurements are preliminary.4. Measured at 30ºC / nominal voltage.5. Assumes USB bus is fully suspended during measurements

PowerRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 47Module power statesThe module has five power states, as described in Ta b l e 6-5. Table 6-4: Miscellaneous DC power consumption1 Signal Description Current Unit Notes / configurationTyp MaxVCCModule OFF leakage current 490 830 AFull operating temperature rangeUSB active current 18 25 mA High speed USB connection, CL = 50 pF on D+ and D- signalsInrush current 750 3000 mA•Assumes power supply turn on time > 100µs•Dependent on host power supply rise time.GPS signal connector Active bias on GPS port 3.3 (100 mA) VGPS connector 1 in Figure 5-1 on page 37.1. All measurements are preliminary valuesTable 6-5: Module power states State DetailsHost is poweredModule is poweredUSB interface activeRF enabledNormal(Default state)•Module is active•Default state when VCC is first applied in the absence of W_DISABLE_N control•Module is capable of placing / receiving calls, or establishing data connections on the wireless network•Current consumption is affected by several factors, including:•Radio band being used•Transmit power•Receive gain settings•Data rate•Number of active Tx time slots   Low power(‘Airplane mode’)•Module is active•State is controlled by host interface using software commands:•+CFUN=0 ([1] AT Command Set for User Equipment (UE) (Release 6) (Doc# 3GPP TS 27.007)))   Sleep •Normal state of module between calls or data connections•Module cycles between wake (polling the network) and sleep, at network provider-determined interval.   

Product Technical Specification & Customer Design Guidelines48 Proprietary and Confidential - Contents subject to change 2400074Power state transitionsThe module uses state machines to monitor supply voltage and operating temperature, and notifies the host when critical threshold limits are exceeded. (See Tabl e 6-6 for trigger details and Figure 6-1 for state machine behavior.)Power state transitions may occur:•Automatically, when critical supply voltage or module temperature trigger levels are encountered.•Under host control, using available AT commands in response to user choices (for example, opting to switch to airplane mode) or operating conditions.Off •Host keeps module powered off by driving W_DISABLE_N low•Module draws minimal current•See W_DISABLE_N — Wireless disable on page 33 for more information.]  Disconnected •Host power source is disconnected from the module and all voltages associated with the module are at 0 V.   Table 6-5: Module power states (Continued)State DetailsHost is poweredModule is poweredUSB interface activeRF enabledTable 6-6: Power state transitions (including voltage / temperature trigger levels)Transition Voltage Temperature1Notes Trigger V2Trigger °CNormal to Low Power VOLT_HI_CRIT 3.6 TEMP_LO_CRIT -25 •RF activity suspendedVOLT_LO_CRIT 2.9 TEMP_HI_CRIT 95Low Power to Normal VOLT_HI_NORM 3.5 TEMP_NORM_LO -15•RF activity resumedLow Power to NormalorRemain in Normal (Remove warnings)VOLT_LO_NORM 3.1 TEMP_HI_NORM 80Normal (Issue warning) VOLT_LO_WARN 3.0 TEMP_HI_WARN 85Power off / on(Host-initiated) ----•Power off recommended when supply voltage or module operating temperature is critically low or high.1. Module-reported temperatures at the printed circuit board.2. Supply voltage — 3.3V

PowerRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 49Figure 6-1: Voltage / temperature monitoring state machinesPower interfacePower ramp-upOn inital power up, inrush current depends on the power supply rise time — turn on time >100 µs is required for < 3A inrush current.The supply voltage must remain within specified tolerances while this is occurring.Power-up timingThe unit is ready to enumerate with a USB host within a maximum of 3–5 seconds after power-up. Figure 6-2 on page 49 illustrates the power-up timing sequence.Figure 6-2: Power-up timing diagramNote: Startup time is the time after power-up when the modem is ready to begin the enumeration sequence.Off modeHandled by Power State state machine.Normal modeLow power modeHandled by Power State state machine.current_vcc > VOLT_LO_NORMcurrent_temp <= TEMP_HI_NORM current_vcc < VOLT_LO_CRITcurrent_temp > TEMP_HI_CRITcurrent_vcc > VOLT_LO_NORMcurrent_temp < TEMP_HI_NORMcurrent_vcc < VOLT_LO_WARNcurrent_temp > TEMP_HI_WARNcurrent_vcc < VOLT_HI_NORMcurrent_temp > TEMP_NORM_LOcurrent_vcc > VOLT_HI_CRITcurrent_temp < TEMP_LO_CRIT(Manual transition)Host assertsW_Disable#Normal modeLow supply voltage warningorHigh temperature warningEnumeration3.3VW_Disable#USB D+Startup time

Product Technical Specification & Customer Design Guidelines50 Proprietary and Confidential - Contents subject to change 2400074Power supply noiseNoise in the power supply can lead to noise in the RF signal. The power supply ripple limit for the module is no more than 200 mVp-p 1 Hz to 100 kHz. This limit includes voltage ripple due to transmitter burst activity.Additional decoupling capacitors can be added to the main VCC line to filter noise into the device.SED (Smart Error Detection)The module uses a form of SED to track premature modem resets.•Module tracks consecutive resets occuring soon after power-on.•After a sixth consecutive reset, the module waits in boot-and-hold mode for a firmware download to resolve the power-cycle problem.

Rev 4 Sep.11 Proprietary and Confidential - Contents subject to change 5177: Software InterfaceSupport toolsThe MC7750 is compatible with the following support tools from Sierra Wireless and authorized third parties:•Firmware update utilities from Sierra Wireless•Sierra Wireless Product Support Tool (SW-PST)•CDMA Air Interface Tool (CAIT) from QUALCOMM•QXDM from QUALCOMM•QUALCOMM Product Support Tool (QPST)USB interfaceThe device supports the Qualcomm QMI interface.Please contact your Sierra Wireless account representative for QMI interface documentation.MTU sizeThe MTU (Maximum Transmission Unit) size is configured using a driver installer command line option:MTUSize=<value> (<value> is the size in bytes)Verizon Wireless requires the MTU size to be 1428 bytes.Example:driverinstaller /MTUSize=1428TCP window size (Windows XP)The TCP window size for Windows XP is 128 kB (131072 bytes).

Product Technical Specification & Customer Design Guidelines52 Proprietary and Confidential - Contents subject to change 2400074

Rev 4 Sep.11 Proprietary and Confidential - Contents subject to change 5388: Mechanical and Environmental Specifi-cationsThe MC7750 module complies with the mechanical and environmental specifications in Ta b le 8-1. Final product conformance to these specifications depends on the OEM device implementation.Table 8-1: Mechanical and environmental specifications Mode DetailsTemperature Operational -30ºC to +60ºC – Full RF complianceNon-operational -40ºC to +85ºC, 96 hours(from MIL-STD 202 Method 108)Relative humidity Non-operational 85ºC, 85% relative humidity for 48 hours (non-condensing)Vibration Non-operational Random vibration, 10 to 1000 Hz, nominal6 G rms in each of three mutually perpendicular axes. Test duration of 60 minutes for each axis, for a total test time of three hours.Shock Non-operational Half sine shock, 2 ms, 180 in/s (375 g).Tested in each of three mutually perpendicular axes, positive and negative (5 x 6, 30 bumps total).Drop Non-operational 1 m on concrete on each of six faces, two times (module only).(Electrostatic discharge (See Electrostatic discharge (ESD) on page 55.)Operational The RF port (antenna launch and RF connector) complies with the IEC 61000-4-2 standard:•Electrostatic Discharge Immunity: Test: Level3Contact Discharge: ±6 kVAir Discharge: ±8 kVNon-operational The host connector Interface complies with the following standards only:•+/- 1 kV Human Body Model (JESD22-A114-B)•+/- 125 V Charged Device Model (JESD22-C101)Thermal considerations See Thermal considerations on page 56.Form factor PCI-Express Mini Card shielded with metal and metalized fabricDimensions Length: 50.95 mm Width: 30 mmThickness: 4.75 mmWeight: Approximately 10 g

Product Technical Specification & Customer Design Guidelines54 Proprietary and Confidential - Contents subject to change 2400074Device viewsFigure 8-1: Top and bottom viewsFigure 8-2: Dimensioned viewTop view Bottom viewTop view Bottom view

Product Technical Specification & Customer Design Guidelines56 Proprietary and Confidential - Contents subject to change 2400074Thermal considerationsEmbedded modules can generate significant amounts of heat that must be dissipated in the host device for safety and performance reasons.Figure 8-4: Shield locationsThe amount of thermal dissipation required depends on:•Supply voltage — See Chapter 6: Power on page 45 for details of max power dissipation for various operating modes.•Usage — Typical power dissipation values depend on the location within the host, amount of data transferred, etc.Specific areas requiring heat dissipation are shown in Figure 8-4:•Transmitter — Top face of module near RF connectors. Likely to be the hottest area.•Baseband 1 —Top face of module, below the transmitter.•Receiver — Bottom face of module, behind the transmitter.•Baseband 2 — Bottom face of module, behind Baseband 1.To enhance heat dissipation:•Maximize airflow over / around the module.•Locate the module away from other hot components.•If possible, use the mounting holes to attach (ground) the device to the main PCB ground or a metal chassis.Note: Adequate dissipation of heat is necessary to ensure that the module functions properly, and to comply with the thermal requirements in [11] PCI Express Mini Card Electromechanical Specification Revision 1.2.Caution: Thermal putty is not recommended — incorrect application of the material could require exessive pressure to be applied when seating the board, resulting in damage to the board.TransmitterBaseband 1 Baseband 2ReceiverTop Bottom Pin 1Pin 1

Mechanical and Environmental SpecificationsRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 57Module integration testingWhen testing your integration design:•Test to your worst case operating environment conditions (temperature and voltage)•Test using worst case operation (transmitter on 100% duty cycle, maximum power)•Monitor temperature at all shield locations. Attach thermocouples to the areas indicated in Figure 8-4 on page 56 (Transmitter, Baseband 1, Receiver, Baseband 2).Note: Make sure that your system design provides sufficient cooling for the module. RF shield temperature should be kept below 90°C when integrated to prevent damage to the module’s components.(For acceptance, certification, quality, and production (including RF) test suggestions, see Testing on page 71.)

Product Technical Specification & Customer Design Guidelines58 Proprietary and Confidential - Contents subject to change 2400074

Rev 4 Sep.11 Proprietary and Confidential - Contents subject to change 5999: Regulatory and Industry ApprovalsThis module is designed to and, upon commercial release, will be certified to meet carrier requirements (e.g. Verizon Wireless).Upon commercial release, the following regulatory approvals will have been attained:•FCC•IC (Industry Canada)Upon commercial release, the following industry approvals will have been obtained:•GCF-CC (may be obtained upon customer request)Additional approvals may be obtained upon customer request — contact your Sierra Wireless account representative for details.Additional testing and certification may be required for the end product with an embedded MC7750 modem and are the responsibility of the OEM. Sierra Wireless offers professional services-based assistance to OEMs with the testing and certification process, if required.Important noticeBecause of the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless and its affiliates accept no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data.Safety and hazardsDo not operate your MC7750 modem:•In areas where blasting is in progress•Where explosive atmospheres may be present including refuelling points, fuel depots, and chemical plants•Near medical equipment, life support equipment, or any equipment which may be susceptible to any form of radio inter-ference. In such areas, the MC7750 modem MUST BE

Product Technical Specification & Customer Design Guidelines60 Proprietary and Confidential - Contents subject to change 2400074POWERED OFF. Otherwise, the MC7750 modem can transmit signals that could interfere with this equipment.In an aircraft, the MC7750 modem MUST BE POWERED OFF. Otherwise, the MC7750 modem can transmit signals that could interfere with various onboard systems and may be dangerous to the operation of the aircraft or disrupt the cellular network. Use of a cellular phone in an aircraft is illegal in some jurisdictions. Failure to observe this instruction may lead to suspension or denial of cellular telephone services to the offender, or legal action or both.Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. The MC7750 modem may be used normally at this time.Important compliance information for North American usersThe MC7750 modem has been granted modular approval for mobile applications. Integrators may use the modem in their final products without additional FCC / IC (Industry Canada) certification if they meet the following conditions. Otherwise, additional FCC / IC approvals must be obtained.•Although the MC7750 modem has been granted module approval, there are many conditions attached to this approval; final host integration will likely require additional testing. Detailed guidelines are described in OEM device classification process on page 61 to assist OEM module integrators in deter-mining the extent of additional testing necessary to comply with FCC require-ments.•The end product with an embedded MC7750 modem must be evaluated for simultaneous transmission requirements. See Simultaneous transmission evaluation on page 62 for details.•A user manual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC / IC RF exposure guidelines. See OEM product instruction manual content on page 63 for details.•To comply with FCC / IC regulations limiting both maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only exposure condition must not exceed:·Part 22 (Cellular): 7.3 dBi·Part 24 (PCS): 3 dBi·Part 27 (Band 13): 9 dBi•A label must be affixed to the outside of the end product into which the MC7750 modem is incorporated, with a statement similar to the following:· This device contains FCC ID: N7NMC7750This equipment contains equipment certified under IC: 2417C-MC7750The end product with an embedded MC7750 modem may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15.

Regulatory and Industry ApprovalsRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 61Note: If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093 and IC RSS-102.OEM integrationApplication of regulatory guidelinesBecause ‘near-body’ devices (handhelds, laptops, tablets, scanners, etc.) vary widely in design features, physical configurations, and use-models, module integrators shall follow the guidelines below regarding device classification and simultaneous transmission, and seek guidance from their preferred regulatory test lab to determine how regulatory guidelines will impact the device compliance. Proactive management of the regulatory process will minimize unexpected schedule delays and costs due to unplanned testing activities.Device classificationsThe OEM integrator must determine the minimum distance required between their device and the user’s body.The FCC provides device classification definitions to assist in making the correct determination. Note that these classifications are guidelines only; strict adherence to a device classification may not satisfy the regulatory requirement as near-body device design details may vary widely.FCC definitions:Portable: (§2.1093) — A portable device is defined as a transmitting device designed to be used so that the radiating structure(s) of the device is / are within 20 centimeters of the body of the user.Mobile: (§2.1091) (b) — A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter’s radiating structure(s) and the body of the user or nearby persons.Per §2.1091d(d)(4) In some cases (for example, modular or desktop transmitters), the potential conditions of use of a device may not allow easy classification of that device as either Mobile or Portable. In these cases, applicants are responsible for determining minimum distances for compliance for the intended use and installation of the device based on evaluation of either specific absorption rate (SAR), field strength, or power density, whichever is most appropriate.OEM device classification processThe primary factor in determining whether a device will be classified as a Portable product or as a Mobile product is antenna separation distance (body to radiating antenna element).

Product Technical Specification & Customer Design Guidelines62 Proprietary and Confidential - Contents subject to change 2400074The review process between the OEM module integrator and the preferred regulatory test lab is a crucial step in determining the appropriate device classification, as it is impractical for Sierra Wireless to define all possible combinations of design features, antennas, physical configurations, and use-models.1. Perform a device review with the preferred regulatory test lab to confirm device classification.2. Determine the Certification type (Standalone or C2PC from an existing Modular Grant).3. If the device classification is:·Portable: Preferred regulatory test lab to determine if a PBA or KDB is required.·Mobile: Preferred regulatory test lab to determine if a PBA is required.(Note: A PBA or KDB will likely be required for new technologies such as LTE or WiMAX.)4. If the device classification is Mobile, confirm the antenna does not violate the Gain Limits specific to the module grant as specified in Important compliance information for North American users on page 60.5. Outline and execute a test plan with the preferred regulatory test lab.Testing is likely to include some or all of Parts 15, 22, 24, 27, and either SAR (for Portable devices) or MPE (for Mobile devices).6. Follow product labeling requirements as described in Important compliance information for North American users on page 60. (Ref §2.925) 7. Include the OEM product instruction manual content on page 63 boilerplate text within the host product’s instruction manual.Simultaneous transmission evaluationThe MC7750 modem has not been evaluated or approved for simultaneous transmission as the number of possible multi-transmission scenarios for this device is large. Any simultaneous transmission condition established through module integration into a customer-specific product must be evaluated per the requirements in KDB447498D01(8) and KDB616217D01,D03 (for laptop, notebook, netbook, and tablet applications).These requirements include, but are not limited to:•Transmitters and modules certified for mobile or portable exposure conditions can be incorporated in mobile host devices without further testing or certifi-cation when:·The closest separation among all simultaneous transmitting antennas is 20 cm,or·Antenna separation distance and MPE compliance requirements for All simultaneous transmitting antennas have been specified in the application filing of at least one of the certified transmitters within the host device. In addition, when transmitters certified for portable use are incorporated in a mobile host device, the antenna(s) must be 5 cm from all other simulta-neous transmitting antennas.

Regulatory and Industry ApprovalsRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 63•All antennas in the final product must be at least 20 cm from users and nearby persons.OEM product instruction manual contentConsistent with §2.909(a), the following text must be included within the user’s manual or operator instruction guide for the final commercial product. (OEM-specific content is displayed in italics.)Operating Requirements and ConditionsThe design of (Product Name) complies with U.S. Federal Communications Commission (FCC) guidelines respecting safety levels of radio frequency (RF) exposure for (OEM to insert device classification: Mobile or Portable) devices.FCC ID: (Include Standalone FCC ID or Module FCC ID as required) Note: Include the following RF Exposure statement for Mobile devices only.RF Exposure - This device is only authorized for use in a mobile application. At least 20 cm (8 inches) of separation distance between the (Product Name) device and the user's body must be maintained at all times.Note: Include the following RF Exposure statement for Portable devices only.RF Exposure - This device has been tested for compliance with FCC RF exposure limits in a portable configuration. At least (Insert Required Separation Distance from RF Exposure Evaluation) cm of separation distance between the (Product Name) device and the user's body must be maintained at all times. This device must not be used with any other antenna or transmitter that has not been approved to operate in conjunction with this device.Note: Always include the following Caution statement.CAUTION: Any changes or modifications not expressly approved by (Company Name) or Sierra Wireless could void the user’s authority to operate the equipment.Note: Include the following statement if Part 15 of the FCC Rules is required. Integration into host devices containing unlicensed devices may require additional comments in this section. The OEM should confirm the extent of their user’s guide content with their preferred regulatory test lab.Note: This equipment has been tested and found to comply with the limits for a (OEM to insert device type: Class A or Class B) digital device, pursuant to Part 15 of the FCC Rules. (OEM must follow Part 15 guidelines (§15.105 and §15.19) to determine additional statements required in this section for their device class)

Product Technical Specification & Customer Design Guidelines64 Proprietary and Confidential - Contents subject to change 2400074

ARev 4 Sep.11 Proprietary and Confidential - Contents subject to change 65A: Antenna SpecificationThis appendix describes recommended electrical performance criteria for main path, diversity path, and GPS antennas used with AirPrime embedded modules.The performance specifications described in this section are valid while antennas are mounted in the host device with antenna feed cables routed in their final application configuration.Note: Antennas should be designed before the industrial design is finished to make sure that the best antennas can be developed.Table A-1: Antenna requirements aParameter Requirements CommentsAntenna system External multi-band 2x2 MIMO antenna system (Ant1 / Ant2)bIf Ant2 includes GPS, then it must also satisfy requirements in Table A-2 on page 67.Operating bands of Ant1 and Ant2c700–960 MHz1710–1990 MHz2110–2170 MHz2500–2700 MHzVSWR of Ant1 and Ant2 1:1 (ideal)< 2.5:1 (recommended) On all bands including band edgesTotal radiated efficiency of Ant1 and Ant2 > 50% on all bands •Measured at the RF connector.•Includes mismatch losses, losses in the matching circuit, and antenna losses, excluding cable loss.•Sierra Wireless recommends using antenna efficiency as the primary parameter for evaluating the antenna system.Peak gain is not a good indication of antenna performance when integrated with a host device (the antenna does not provide omni-directional gain patterns). Peak gain can be affected by antenna size, location, design type, etc. — the antenna gain patterns remain fixed unless one or more of these parameters change.Radiation patterns of Ant1 and Ant2 Nominally Omni-directional radiation pattern in azimuth plane.

Product Technical Specification & Customer Design Guidelines66 Proprietary and Confidential - Contents subject to change 2400074Envelope correlation coefficient between Ant1 and Ant2< 0.4 on 730–960 MHz band< 0.3 on 1800–1990 MHz and 2110–2170 MHz bands< 0.2 on 2600–2700 MHz bandMean Effective Gain of Ant1 and Ant2 (MEG1, MEG2) -3 dBiAnt1 and Ant2 Mean Effective Gain Imbalance I MEG1 / MEG2 I< 2 dB for MIMO operation< 6 dB for diversity operationMaximum antenna gain Must not exceed antenna gains due to RF exposure and ERP / EIRP limits, as listed in the module’s FCC grant.See Important compliance information for North American users on page 60.Isolation between Ant1 and Ant2 (S21) > 10 dB •If antennas can be moved, test all positions for both antennas.•Make sure all other wireless devices (Bluetooth or WLAN antennas, etc.) are turned OFF to avoid interference.Power handling •> 2 W RF power on low bands•> 1 W on high bands•Measure power endurance over 4 hours (estimated talk time) using a 2 W CW signal — set the CW test signal frequency to the middle of the PCS Tx band (1880 MHz for PCS).•Visually inspect device to ensure there is no damage to the antenna structure and matching components.•VSWR / TIS / TRP measurements taken before and after this test must show similar results.a. These worst-case VSWR figures for the transmitter bands may not guarantee RSE levels to be within regulatory limits. The device alone meets all regulatory emissions limits when tested into a cabled (conducted) 50 ohm system. With antenna designs with up to 2.5:1 VSWR or worse, the radiated emissions could exceed limits. The antenna system may need to be tuned in order to meet the RSE limits as the complex match between the module and antenna can cause unwanted levels of emissions. Tuning may include antenna pattern changes, pahse/delay adjustment, passive component matching. Examples of the application test limits would be included in FCC Part 22 and Part 24, test case 12.2.1 for GSM (3GPP TS 51.010), and test case 4.2.2 for WCDMA (ETSI EN 301 511).b. Ant1 — Primary, Ant2 — Secondary (Diversity / MIMO / GPS connector 2)c. Stated band ranges satisfy requirements for both Ant1 and Ant2.Table A-1: Antenna requirements (Continued)aParameter Requirements Comments

Antenna SpecificationRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 67Recommended GPS antenna specificationsAntenna testsThe following guidelines apply to the requirements described in Tabl e A-1 on page 65 and Ta bl e A-2 on page 67:•Perform electrical measurements at room temperature (+20°C to +26°C) unless otherwise specified•For main and diversity path antennas, make sure the antennas (including contact device, coaxial cable, connectors, and matching circuit with no more than six components, if required) have nominal impedances of 50  across supported frequency bands.•All tests (except isolation / correlation coefficient) —Test the main or diversity antenna with the other antenna terminated.Table A-2: GPS standalone antenna requirements Parameter Requirements CommentsFrequency range •1575.42 MHz ±2 MHz minimum•1565–1606 MHz recom-mendedField of view (FOV) •Omni-directional in azimuth•-45° to +90° in elevationPolarization(average Gv/Gh) > 0 dB Vertical linear polarization is sufficient.Free space average gain (Gv+Gh) over FOV > -6 dBi (preferably > -3 dBi) Gv and Gh are measured and averaged over -45° to +90° in elevation, and 180° in azimuth.Gain •Maximum gain and uniform coverage in the high elevation angle and zenith.•Gain in azimuth plane is not desired.Average 3D gain > -5 dBiIsolation between GPS and Ant1 > 10 dB in all uplink bandsTypical VSWR < 2.5:1Polarization Any other than LHCP (left-hand circular polarized) is acceptable.

Product Technical Specification & Customer Design Guidelines68 Proprietary and Confidential - Contents subject to change 2400074•Any metallic part of the antenna system that is exposed to the outside environment needs to meet the electrostatic discharge tests per IEC61000-4-2 (conducted discharge +8kV).•The functional requirements of the antenna system are tested and verified while the embedded module’s antenna is integrated in the host device. Note: Additional testing, including active performance tests, mechanical, and accelerated life tests can be discussed with Sierra Wireless’ engineering services. Contact your Sierra Wireless representative for assistance.

BRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 69B: Design ChecklistThis chapter provides a summary of the design considerations mentioned throughout this guide. This includes items relating to the power interface, RF integration, thermal considerations, cabling issues, and so on.Note: This is NOT an exhaustive list of design considerations. It is expected that you will employ good design practices and engineering principles in your integration.Table B-1: Hardware integration design considerations Suggestion Section where discussedComponent placementProtect the SIM socket so the SIM cannot be removed while the host is powered up.SIM implementation on page 32If an ESD suppressor is not used, allow space on the SIM connector for series resistors in layout. (Up to 100  may be used depending on ESD testing requirements).SIM implementation on page 32Minimize RF cable losses as these affect performance values listed in product specification documents.RF connections on page 37AntennasMatch the module / antenna coax connections to 50 — mismatched antenna impedance and cable loss negatively affect RF performance.RF connections on page 37If installing CDMA and UMTS modules in the same device, consider using separate antennas for maximum performance.Antenna and cabling on page 38PowerMake sure the power supply can handle the maximum current specified for the module type.Power consumption on page 45Limit the total impedance of VCC and GND connections to the SIM at the connector to less than 1  (including any trace impedance and lumped element components — inductors, filters, etc.). All other lines must have a trace impedance less than 2 .SIM implementation on page 32Decouple the VCC line close to the SIM socket. The longer the trace length (impedance) from socket to module, the greater the capacitance requirement to meet compliance tests.SIM implementation on page 32EMI / ESDInvestigate sources of localized interference early in the design cycle.Methods to mitigate decreased Rx performance on page 40

Product Technical Specification & Customer Design Guidelines70 Proprietary and Confidential - Contents subject to change 2400074Provide ESD protection for the SIM connector at the exposed contact point (in particular, the CLK, VCC, IO, and RESET lines).SIM implementation on page 32Keep very low capacitance traces on the USIM_DATA and USIM_CLK signals.SIM implementation on page 32To minimize noise leakage, establish a very good ground connection between the module and host.Ground connection on page 39Route cables away from noise sources (for example, power supplies, LCD assemblies, etc.).Methods to mitigate decreased Rx performance on page 40Shield high RF-emitting components of the host device (for example, main processor, parallel bus, etc.).Methods to mitigate decreased Rx performance on page 40Use discrete filtering on low frequency lines to filter out unwanted high-order harmonic energy.Methods to mitigate decreased Rx performance on page 40Use multi-layer PCBs to form shielding layers around high-speed clock traces.Methods to mitigate decreased Rx performance on page 40ThermalTest to worst case operating conditions — temperature, voltage, and operation mode (transmitter on 100% duty cycle, maximum power).Thermal considerations on page 56Use appropriate techniques to reduce module temperatures (for example, airflow, heat sinks, heat-relief tape, module placement, etc.).Thermal considerations on page 56Host / Modem communicationMake sure the host USB driver supports remote wakeup, resume, and suspend operations, and serial port emulation.[5] AirCard / AirPrime USB Driver Developer’s Guide (Doc# 2130634)When no valid data is being sent, do not send SOF tokens from the host (causes unnecessary power consumption).[5] AirCard / AirPrime USB Driver Developer’s Guide (Doc# 2130634)Table B-1: Hardware integration design considerations (Continued)Suggestion Section where discussed

CRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 71C: TestingNote: All AirPrime embedded modules are factory-tested to ensure they conform to published product specifications.Developers of OEM devices integrating Sierra Wireless AirPrime embedded modules should include a series of test phases in their manufacturing process to make sure that their devices work properly with the embedded modules. Suggested phases include:•Acceptance testing — Testing of modules when they are received from Sierra Wireless•Certification testing — Testing of completed devices to obtain required certifications before beginning mass production•Production testing — Testing of completed devices with the modules embedded•Quality assurance testing — Post-productionAT command entry timing requirementSome AT commands require time to process before additional commands are entered. For example, the modem will return “OK” when it receives AT!DAFTMACT. However, if AT!DASBAND is received too soon after this, the modem will return an error.When building automated test scripts, ensure that sufficient delays are embedded where necessary to avoid these errors.Acceptance testingNote: Acceptance testing is typically performed for each shipment received.When you receive a shipment from Sierra Wireless, you should make sure it is suitable before beginning production.From a random sampling of units, test that:•Units are operational•Units are loaded with the correct firmware version

Product Technical Specification & Customer Design Guidelines72 Proprietary and Confidential - Contents subject to change 2400074Acceptance test requirementsTo perform the suggested tests, you require a test system in which to temporarily install the module, and you must be able to observe the test device’s LED indicator.Acceptance test procedureThe following is a suggested acceptance testing procedure using Sierra Wireless’ Watcher™ software:Note: You can perform these tests using appro-priate AT commands.Test 1: Check power-up and initialization1. After installing the module, start the test system.2. Launch Watcher.3. Check the LED — If the LED is off, there is a problem with the module or with the connection to the LED.Test 2: Check version numbers1. From Watcher, select Help > About.2. Verify that the firmware version in the About window is correct.3. Close the About window.If the module fails either of these tests, or is not recognized by Watcher:1. Replace the module with one that is known to work correctly and repeat the tests.2. If the tests are successful, reinstall the original module and repeat the tests.If the module still does not work correctly, contact your account manager.Certification testingNote: Typically, certification testing of your device with the integrated module is required one time only.The AirPrime embedded module has been certified as described in Regulatory and Industry Approvals on page 59.When you produce a host device with a Sierra Wireless AirPrime embedded module, you must obtain certifications for the final product from appropriate regulatory bodies in the jurisdictions where it will be distributed.The following are some of the regulatory bodies from which you may require certification — it is your responsibility to make sure that you obtain all necessary certifications for your product from these or other groups:•FCC (Federal Communications Commission — www.fcc.gov)•Industry Canada (www.ic.gc.ca)•CSA (Canadian Standards Association — www.csa.ca)

TestingRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 73•Factory Mutual (FM Global — www.allendale.com)•Underwriters Laboratories Inc. (www.ul.com)•CDG (CDMA Development Group — www.cdg.org)•GCF (Global Certification Forum — www.globalcertificationforum.org) outside of North America•PTCRB (PCS Type Certification Review Board — www.ptcrb.com) in North AmericaProduction testingNote: Production testing typically continues for the life of the product.Production testing ensures that, for each assembled device, the module is installed correctly (I / O signals are passed between the host and module), and the antenna is connected and performing to specifications (RF tests).Typical items to test include:•Host connectivity•Baseband (GPIO, host / module connectors)•RF assembly (Tx and / or Rx, as appropriate)•Network availability•Host / device configuration issuesNote: The amount and types of tests to perform are your decision — the tests listed in this section are guidelines only. Make sure that the tests you perform exercise functionality to the degree that your situation requires.Use an appropriate test station for your testing environment (see Acceptance test requirements on page 72 for suggestions) and use AT commands to control the integrated module.Note: Your test location must be protected from ESD to avoid interference with the module and antenna(s), assuming that your test computer is in a disassembled state.Also, consider using an RF shielding box — local government regulations may prohibit unauthorized transmissions.Functional production testThis section presents a suggested procedure for performing a basic manual functional test on a laboratory bench using an AirPrime embedded module and a Mini Card Dev Kit. When you have become familiar with the testing method, use it to develop your own automated production testing procedures.

Product Technical Specification & Customer Design Guidelines74 Proprietary and Confidential - Contents subject to change 2400074Suggested production testsConsider the following tests when you design your production test procedures for devices with the AirPrime module installed.•Visual check of the module’s connectors and RF assemblies•Module is operational•USB connection is functional•LED is functional•W_DISABLE_N (module power down)•Firmware revision check•Rx tests on main and auxiliary paths•Tx testProduction test procedureThe following is a suggested test plan — you must decide which tests are appropriate for your product. You may wish to add additional tests that more fully exercise the capabilities of your product.Using an appropriate Dev Kit-based test station, and referring to the appropriate AT command references:1. Visually inspect the module’s connectors and RF assemblies for obvious defects before installing it in the test station.2. Ensure that the module is turned off before beginning your tests — Drive W_DISABLE_N low.3. If using Linux, determine if any USB devices are currently connected to the computer:a. Open a shell window and enter the command ls / dev / tty / USB*.b. Record the ttyUSBn values that are returned; these are the currently connected USB devices. If the command returns “no such file or directory”, there are no devices currently connected.4. Tes t W_DISABLE_N — Turn on the module by letting W_DISABLE_N float (high impedance).5. Test USB functionality — Check for USB enumeration.·(Windows systems) The Device Manager shows Sierra Wireless items under Ports (COM & LPT). The devices shown depend on the module type. For example:]·(Linux systems) Enter the command ls / dev / tty / USB* and then record and compare the results with those from Step 3. If there are any new ttyUSBn devices, then the modem has enumerated successfully. (There should be seven new devices) For example:

TestingRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 75·With one other USB device already connected and assigned to ttyUSB1:(Note: The AT port is the fourth new device — / dev / ttyUSB4.)6. Make sure your modem is connected and running, and then establish contact with the module:·Windows systems: Use a terminal emulation / communications program such as Microsoft HyperTerminal® to connect over the COM port reserved for AT commands (see listings in Step 5):a. Start HyperTerminal.b. Select File > Connection Description. The Connection Description dialog box appears. i. Typ e Sierra in the Name box and click OK. The Connect To dialog box appears. ii. Click OK without changing any of the displayed information. The Connect dialog box appears. iii. Click Cancel.Note: If necessary, use AT E1 to enable echo. iv. Typ e ATZ in the HyperTerminal window. If the connection is established, the message OK appears. ·Linux systems: Use a terminal emulation / communications program such as minicom to connect over the device handle for AT commands (see listings in Step 5):Note: If the command “minicom” is not found, then use a different program, or download minicom and repeat this step. See Downloading and configuring minicom for Linux systems on page 76 for details. i. Start minicom:·First use of the modem: From the command line, type minicom -s. (The ‘-s’ switch shows the configuration menu.)·Subsequent uses: From the command line, type minicom. (The ‘-s’ switch is assumed.)The minicom configuration details appear and the message OK appears when the connection is established.

Product Technical Specification & Customer Design Guidelines76 Proprietary and Confidential - Contents subject to change 24000747. Display the firmware version:·AT!GVER8. Test the LED — Set the LED in blinking mode using this command, then visually verify that the LED turns off and on:·AT!LEDCTRL9. Unlock the extended AT command set:·AT!ENTERCND10. Put the module in diagnostic / factory test mode:·AT!DAFTMACT11. Communicate with the SIM using +CPIN or +CIMI.When performing RF tests, use a test platform as described in Suggested testing equipment on page 81.12. Test RF transmission, if desired:·(LTE) To test the LTE transmission path, use a call box.13. Test RF reception, if desired:·(CDMA) See Testing CDMA RF Receive path on page 77.·(LTE) See LTE RF receive path test on page 78.14. Test standalone GPS functionality — See GPS standalone connector test on page 80.15. Drive W_DISABLE_N low and confirm that the module powers down:·Windows systems — The Sierra Wireless items under the Ports (COM & LPT) entry in Device Manager disappear as the module powers off.·Linux systems — Enter the command ls / dev / tty / USB*. The devices enumerated in Step 5 will not appear after the module powers off.Downloading and configuring minicom for Linux systemsNote: This procedure is for Ubuntu systems. If you are using a different Linux distribution, use the appropriate commands for your system to download minicom.To download and configure minicom in a Ubuntu system:Note: To install minicom, you must have root access, or be included in the sudoers list.1. Download and install minicom — enter the following command:sudo apt-get install minicom2. When prompted, enter your user password to begin the download and instal-lation. When minicom is installed, the shell prompt appears.3. Configure minicom to communicate with your modem:a. Start minicom with the following command:minicom -s4. Use the down-arrow key to select the Serial port setup option.5. Refer to Step 5 on page 74 to identify the device file handle ( / dev / ttyUSBn) used for AT commands.6. Indicate the file handle to use for AT commands — Enter A and then replace the serial device string with the AT file handle (for example, / dev / ttyUSB4 as shown in the example in Step 5 on page 74).7. Press Enter twice.

TestingRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 778. Use the down-arrow key to select Save setup as dfl.9. Select Exit.Testing CDMA RF Receive pathNote: This procedure segment is performed in Step 13 of the Production test procedure on page 74.To test the DUT’s receive path:Note: This procedure describes steps using the Agilent 8648C signal generator — the Rohde & Schwarz SML03 is shown for reference only.1. Set up the signal generator:Note: This example setup uses a 200 kHz offset from band center for testing using a continuous wave — you can use any appro-priate baseband frequency offset (for example, 100 kHz, 300 kHz, etc.).If using a modulated signal, set the frequency to band center with no offset.a. Press the Frequency button to set the frequency to 1960.200 MHz for PCS band, Channel 600, or 881.720 MHz for Cellular band, Channel 384b. Press the Amplitude button to set the amplitude to -55.0 dBm.c. Press the RF ON / OFF button to enable or disable the RF port of the signal generator.2. Read back the power level from the main receiver:a. AT!ENTERCND (Unlock the extended AT command set.)b. AT!DAFTMACT (Enter test mode.)c. AT!CHAN=600,1 (PCS band, channel 600)orAT!CHAN=384,0 (Cellular band, channel 384)d. AT!RX=1 (Turn on the main receiver.)e. AT!RXAGC? (Read back the power level, in dBm, from the main receiver.)Response examples:·RXAGC = 0xFFFFFF33 = -77 dBm (Signal generator’s RF port is OFF)·RXAGC = 0x0021 = -60 dBm typical (Signal generator’s RF port is ON)

Product Technical Specification & Customer Design Guidelines78 Proprietary and Confidential - Contents subject to change 2400074Note: The dBm value displayed is calculated to reflect the power at the input connector.f. AT!RX2=1 (Turn on diversity receiver.)g. AT!RX2AGC? (Read back the power level, in dBm, from the diversity receiver.)Response examples:·RX2AGC = 0xFFFFFF76 = -84 dBm (Signal generator’s RF port is OFF)·RX2AGC = 0xFFFFFFC6 = -69 dBm typical (Signal generator’s RF port is ON)h. AT!RX=0 (Turn off main receiver.)i. AT!RX2=0 (Turn off diversity receiver.)3. Test limits — Run ten or more good DUTs through this test procedure to obtain a nominal received power value.·Apply a tolerance of 5 to 6 dB to each measurement (assuming a good setup design).·Make sure the measurement is made at a high enough level that it is not influenced by DUT-generated and ambient noise.·The Signal Generator power level should be at least -50 dBm.·Monitor these limits during mass-production ramp-up to determine if further adjustments are needed.Note: The value measured by the DUT depends on the test setup and DUT design. Host RF cabling loss, antenna efficiency and pattern, test antenna efficiency and pattern, and choice of shield box all significantly influence the measurement.Note: When doing the same test over the air in an RF chamber, values are likely to be significantly lower.LTE RF receive path testNote: This procedure segment is performed in Step 13 of the Production test procedure on page 74.Tab l e C-1 contains parameters used in the suggested test procedure that follows.Table C-1: Test settings — Receive path Mode Test category BandsB13 B17 B4LTEFrequencya (MHz) 753.0 742.0 2134.5Band 36 37 42Channelb23230 23790 20175

TestingRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 79To test the DUT’s receive path (or diversity path, while connected to the diversity antenna):Note: This procedure describes steps using the Agilent 8648C signal generator — the Rohde & Schwarz SML03 is shown for reference only.1. Set up the signal generator:a. Set the amplitude to -70 dBmb. Set the frequency for the band being tested. See Ta bl e C-1 for frequency values.2. Set up the DUT:a. AT!ENTERCND (Unlock extended AT command set.)b. AT!DAFTMACT (Put modem into factory test mode.)c. AT!DASBAND=<band> (Set frequency band.)·See Ta b l e C-1 on page 78 for <band> valuesd. AT!DASCHAN=<channel> (Set modem channel)·See Ta b l e C-1 on page 78 for <channel> valuese. AT!DALGAVGAGC=<channel>,0 (Get averaged Rx AGC)·See Ta b l e C-1 on page 78 for <channel> values3. Test limits — Run ten or more good DUTs through this test procedure to obtain a nominal received power value.·Apply a tolerance of 5 to 6 dB to each measurement (assuming a good setup design).·Make sure the measurement is made at a high enough level that it is not influenced by DUT-generated and ambient noise.·The Signal Generator power level can be adjusted and new limits found if the radiated test needs greater signal strength.·Monitor these limits during mass-production ramp-up to determine if further adjustments are needed.a. All values offset from actual center channel by +2 MHzb. Channel values shown are at the center of the corresponding bands.

Product Technical Specification & Customer Design Guidelines80 Proprietary and Confidential - Contents subject to change 2400074Note: The value measured from the DUT is significantly influenced by the test setup and DUT design (host RF cabling loss, antenna efficiency and pattern, test antenna efficiency and pattern, and choice of shield box).GPS standalone connector testGPS testing should be done on devices that support a dedicated GPS connector.If the MC7750 supports a dedicated GPS connector/path (that is, not shared with the diversity connector), then GPS testing may be done by characterizing some known-good MC devices and checking for carrier to noise levels.To test the GPS path:1. Inject a carrier signal at -110dBm, frequency 1575.52 MHz into the GPS Rx path. (Note that this is 100kHz higher than the actual GPS frequency.)2. Test the signal carrier-to-noise level at the GPS receiver:a. AT!ENTERCND (Unlock extended AT command set.)b. AT!DAFTMACT (Put modem into factory test mode.)c. AT!DACGPSTESTMODE=1 (Start CGPS diagnostic task.)d. AT!DACGPSSTANDALONE=1 (Enter standalone RF mode.)e. AT!DACGPSMASKON (Enable log mask.)f. AT!DACGPSCTON (Return signal-to-noise and frequency measurements.)g. Repeat AT!DACGPSCTON five to ten times to ensure the measurements are repeatable and stable.3. Leave the RF connection to the Mini Card device intact, and turn off the signal generator.4. Take several more !DACGPSCTON readings. This will demonstrate a 'bad' signal in order to set limits for testing, if needed. This frequency offset should fall outside of the guidelines in the note below, which indicates that the CtoN result is invalid.5. (Optional) Turn the signal generator on again, and reduce the level to -120dBm. Take more !DACGPSCTON readings and use these as a reference for what a marginal / poor signal would be.Note: The response to AT!DACGPSCTON for a good connection should show CtoN within 58 +/- 5dB and Freq (frequency offset) within 100000 Hz +/- 5000 Hz .Quality assurance testingNote: QA is an ongoing process based on random samples from a finished batch of devices.The quality assurance tests that you perform on your finished products should be designed to verify the performance and quality of your devices.The following are some testing suggestions that can confirm that the antenna is interfaced properly, and that the RF module is calibrated and performs to specifications:•Module registration on cellular networks

TestingRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 81•Power consumption•Originate and terminate data and voice (if applicable) calls•Cell hand-off•Transmitter and receiver tests•FER (Frame Error Rate) as an indicator of receiver sensitivity / performance•Channel and average power measurements to verify that the device is trans-mitting within product specifications•RF sensitivity tests•CDMA:·FER testing — Test receiver sensitivity for conditions of minimum cell power. FER can be measured for the specified receiver sensitivity of -104 dBm. The objective of this test is to determine if the FER measured is within the acceptable limits for the specified receiver sensitivity of the module. Unlike the FER tests performed during production testing, this test determines the receiver performance without the influence of the noise factor (AWGN), but with extremely low cell power. The reported FER and the confidence level must be <1% and >95% respectively for the test to be considered a pass.Suggested testing equipmentTo perform production and post-production tests, you will require appropriate testing equipment. A test computer can be used to coordinate testing between the integrated module (on the development kit or host) and the measurement equipment, usually with GPIB connections. The suggested setup includes a power meter to test RF output power and a signal generator to evaluate the receiver.Testing assistance provided by Sierra WirelessExtended AT commands have been implemented to assist with performing FTA GCF tests and portions of CE Mark tests requiring radio module access. These are documented in the [2] AirCard / AirPrime UMTS Devices Supported AT Command Reference (Doc# 2130617) and [3] AirPrime MC8xxx Embedded Modules Extended AT Command Reference (Doc# 2130616).Sierra Wireless offers optional professional services based assistance to OEMs with regulatory approvals.IOT/Operator testingInteroperability and Operator/Carrier testing of the finished system is the responsibility of the OEM. The test process will be determined with the chosen network operator(s) and will be dependent upon your business relationship with them, as well as the product's application and sales channel strategy.Sierra Wireless offers assistance to OEMs with the testing process, if required.

Product Technical Specification & Customer Design Guidelines82 Proprietary and Confidential - Contents subject to change 2400074Extended AT commands for testingSierra Wireless provides proprietary AT commands that may help in hardware integration design and testing (these commands are NOT intended for use by end users):•[3] AirPrime MC8xxx Embedded Modules Extended AT Command Reference (Doc# 2130616)•[2] AirCard / AirPrime UMTS Devices Supported AT Command Reference (Doc# 2130617)Some useful commands from these documents for use in hardware integration are listed in Tabl e C-2 on page 82. Table C-2: Extended AT commands Command DescriptionPassword commands!ENTERCND Enable access to password-protected commands!SETCND Set AT command passwordModem reset and status commands!GRESET Reset the modem!GSTATUS Return the operation status of the modem (mode, band, channel, and so on)Diagnostic commands!BAND Select a set of frequency bands or reports current selection!GBAND Read / set the current operating bandTest commands!ALLUP Turn transmitter on / off and simulate ‘All UPs’!CHAN Tune synthesizer to channel / band!DAFTMACT Put the modem into FTM (Factory Test Mode)!DAFTMDEACT Put the modem into online mode!DAGGRSSI Return the RSSI (Received Signal Strength Indicator) in dBm (GSM mode)!DAGGAVGRSSI Return an averaged RSSI (Received Signal Strength Indicator) in dBm (GSM mode)!DAGGRSSIRAW Return the raw RSSI (GSM mode)!DAGINFO Return GSM mode RF information!DAGSLOCK Return the RF synthesizer lock state!DAGSRXBURST Set the GSM receiver to burst mode!DAGSRXCONT Set the GSM receiver continually on

TestingRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 83!DAGSTXBURST Set the GSM transmitter to burst mode!DAGSTXFRAME Set the GSM Tx frame structure!DALGAVGAGC Return averaged Rx AGC value (LTE)!DALGRXAGC Return Rx AGC value (LTE)!DALGTXAGC Return Tx AGC value and transmitter parameters (LTE)!DAOFFLINE Place modem offline!DASBAND Set the frequency band (UMTS / GSM)!DASCHAN Set the modem channel (frequency) (UMTS / GSM)!DASLNAGAIN Set the LNA (Low Noise Amplifier) gain state!DASPDM Set the PDM (Pulse Duration Modulation) value!DASTXOFF Turn off the Tx PA (Power Amplifier)!DASTXON Turn on the Tx PA (Power Amplifier)!DAWGAVGAGC Return averaged RX AGC value (WCDMA)!DAWGRXAGC Return the Rx AGC (Automatic Gain Control) value (UMTS)!DAWINFO Return WCDMA mode RF information!DAWSCONFIGRX Set the UMTS receiver to factory calibration settings!DAWSPARANGE Set the PA range state machine (UMTS)!DAWSCHAINTCM Place receive chain in test call mode (WCDMA)!DAWSSCHAIN Enable secondary receive chain (WCDMA)!DAWSTXCW Set the waveform used by the transmitter (UMTS)!DAWSTXPWR Set desired Tx power level (WCDMA)!IMSTESTMODE Enable / disable IMS test mode!KEYOFF Key off the transmitter!KEYON Key on the transmitter!OSDSM Display memory usage for DSM (Distributed Shared Memory) buffer pools$QCAGC Read Rx AGC (CDMA / WCDMA)!RX2 Turn second receiver on / off!RX2AGC Read second receiver Rx AGC!RXAGC Read first receiver Rx AGCTable C-2: Extended AT commands (Continued) Command Description

Product Technical Specification & Customer Design Guidelines84 Proprietary and Confidential - Contents subject to change 2400074!TX Turn transmitter on / off!TXAGC Set desired Tx AGCTable C-2: Extended AT commands (Continued) Command Description

DRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 85D: PackagingSierra Wireless AirPrime Mini Cards are shipped in sealed boxes. The standard packaging (see Figure 4-1), contains a single tray with a capacity of 100 modules . (Note that some SKUs may have custom packaging — contact Sierra Wireless for SKU-specific details.)In the standard packaging, Mini Cards are inserted, system connector first, into the bottom portion (T1) of a two-part tray. all facing the same direction. This allows the top edge of each Mini Card to contact the top of the triangular features in the top portion (T2) of the tray (see Detail A).The top and bottom portions of the tray snap together at the four connection points.Figure 4-1: Device placement in module trayThe tray is placed in a manufacturing box (T2 at the top), sealed with a security tape (P1), and a manufacturing label is placed on the bottom-right corner, above the security tape. (See Figure 4-2.) Figure 4-2: Shipping package

Product Technical Specification & Customer Design Guidelines86 Proprietary and Confidential - Contents subject to change 2400074

ERev 4 Sep.11 Proprietary and Confidential - Contents subject to change87E: ReferencesThis guide deals specifically with hardware integration issues that are unique to AirPrime embedded modules.Web site supportFor additional documents describing embedded module design, usage, and integration issues (AT command references, integration guides, etc.), visit www.sierrawireless.com/minicard. To obtain access permission, contact your Sierra Wireless account representative.Sierra Wireless documentsThe following Sierra Wireless documents are available from www.sierrawireless.com.Command documents[1] AT Command Set for User Equipment (UE) (Release 6) (Doc# 3GPP TS 27.007)[2] AirCard / AirPrime UMTS Devices Supported AT Command Reference (Doc# 2130617)[3] AirPrime MC8xxx Embedded Modules Extended AT Command Reference (Doc# 2130616)Other Sierra documents[4] PCI Express Mini Card Dev Kit Quick Start Guide (Doc# 2130705)[5] AirCard / AirPrime USB Driver Developer’s Guide (Doc# 2130634)Industry / other documentsThe following non-Sierra Wireless references are not included in your documentation package:[6] CDMA 1x Standard (CDMA 200 Series Release A (2000)) (Doc# TIA/EIA/IS-2000 Series, Release A)[7] FCC Regulations - Part 15 - Radio Frequency Devices[8] IEC-61000-4-2 level 3[9] IEC-61000-4-2 level (Electrostatic Discharge Immunity Test)[10]Mobile Station (MS) Conformance Specification; Part 4: Subscriber Interface Module (Doc# 3GPP TS 11.10-4)

Product Technical Specification & Customer Design Guidelines88 Proprietary and Confidential - Contents subject to change2400074[11] PCI Express Mini Card Electromechanical Specification Revision 1.2[12] Universal Serial Bus Specification, Rev 2.0[13] JESD22-A114-B[14] JESD22-C101

Rev 4 Sep.11 Proprietary and Confidential - Contents subject to change89FF: AcronymsTable F-1: Acronyms and definitions Acronym or term Definition1xEV-DO Single Carrier (1X) EVolution – Data Only. A high-speed standard for cellular packet data communications.Supports Internet connections with data rates up to 3.1 Mbps (downlink from the network) and 1.8 Mbps (uplink to the network). Average data rates are roughly: for Rev. A: 600 1300 kbps (downlink from the network) and 300 400 kbps (uplink to the network); for Rev. 0: 400 700 kbps (downlink from the network) and 40 80 kbps (uplink to the network). Actual speed depends on the network conditions. Compare to 1X.1X Single Carrier (1X) Radio Transmission Technology. A high-speed standard for cellular packet data communications. Supports Internet connections with data rates up to 153 kbps (simultaneously in each direction—downlink and uplink). Actual speed depends on the network conditions. Compare to 1xEV-DO.3GPP 3rd Generation Partnership Project8PSK Octagonal Phase Shift KeyingAGC Automatic Gain ControlAPI Application Programming InterfaceBER Bit Error Rate — A measure of receive sensitivityBLER Block Error Ratebluetooth Wireless protocol for data exchange over short distancesCAIT CDMA Air Interface ToolCDG CDMA Development Group—a consortium of companies that develop and promote the products and services for CDMA wireless systems.CDMA Code Division Multiple Access.A wideband spread spectrum technique used in digital cellular, personal communications services, and other wireless networks. Wide channels (1.25 MHz) are obtained through spread spectrum transmissions, thus allowing many active users to share the same channel. Each user is assigned a unique digital code, which differentiates the individual conversations on the same channel.CQI Channel Quality IndicationCOM Communication portCS Circuit-switchedCSA Canadian Standards AssociationCW Continuous waveform

Product Technical Specification & Customer Design Guidelines90 Proprietary and Confidential - Contents subject to change2400074dB Decibel = 10 x log10 (P1 / P2)P1 is calculated power; P2 is reference powerDecibel = 20 x log10 (V1 / V2)V1 is calculated voltage, V2 is reference voltagedBm A logarithmic (base 10) measure of relative power (dB for decibels); relative to milliwatts (m). A dBm value will be 30 units (1000 times) larger (less negative) than a dBW value, because of the difference in scale (milliwatts vs. watts).DCS Digital Cellular SystemA cellular communication infrastructure that uses the 1.8 GHz radio spectrum.DL Downlink (network to mobile)DRX Discontinuous ReceptionDSM Distributed Shared MemoryDUT Device Under TestEDGE Enhanced Data rates for GSM EvolutioneHRPD Evolved High Rate Packet Data — Enhances traditional 1xEV-DO to enable LTE to CDMA handover.EIRP Effective (or Equivalent) Isotropic Radiated PowerEMC Electromagnetic CompatibilityEMI Electromagnetic InterferenceERP Effective Radiated PowerESD Electrostatic DischargeFCC Federal Communications CommissionThe U.S. federal agency that is responsible for interstate and foreign communications. The FCC regulates commercial and private radio spectrum management, sets rates for communications services, determines standards for equipment, and controls broadcast licensing. Consult www.fcc.gov.FDMA Frequency Division Multiple AccessFER Frame Error Rate — A measure of receive sensitivity.firmware Software stored in ROM or EEPROM; essential programs that remain even when the system is turned off. Firmware is easier to change than hardware but more permanent than software stored on disk.FOTA Firmware Over The Air — Technology used to download firmware upgrades directly from the service provider, over the air.FOV Field Of ViewFSN Factory Serial Number—A unique serial number assigned to the mini card during manufacturing.GCF Global Certification ForumTable F-1: Acronyms and definitions (Continued)Acronym or term Definition

AcronymsRev 4 Sep.11 Proprietary and Confidential - Contents subject to change91GLONASS Global Navigation Satellite SystemGMSK Gaussian Minimum Shift Keying modulationGND GroundGPRS General Packet Radio ServiceGPS Global Positioning SystemA system that uses a series of 24 geosynchronous satellites to provide navigational data.GSM Global System for Mobile CommunicationsHost The device into which an embedded module is integratedHz Hertz = 1 cycle / secondIC Industry CanadaIF Intermediate FrequencyIMEI International Mobile Equipment IdentityIMS IP Multimedia Subsystem — Architectural framework for delivering IP multimedia services. (MC7750 supports MO / MT SMS over IMS for LTE / eHRPD.)inrush current Peak current drawn when a device is connected or powered oninter-RAT Radio Access TechnologyIOT Interoperability TestingIS Interim Standard.After receiving industry consensus, the TIA forwards the standard to ANSI for approval.IS-2000 3G radio standards for voice and data (CDMA only)IS-95 2G radio standards targeted for voice (cdmaONE)LED Light Emitting Diode.A semiconductor diode that emits visible or infrared light.LHCP Left-Hand Circular PolarizedLNA Low Noise AmplifierLPM Low Power ModeLPT Line Print TerminalLTE Long Term Evolution—a high-performance air interface for cellular mobile communication systems.MCS Modulation and Coding SchemeMHz Megahertz = 10e6 HzTable F-1: Acronyms and definitions (Continued)Acronym or term Definition

Product Technical Specification & Customer Design Guidelines92 Proprietary and Confidential - Contents subject to change2400074MEID Mobile Equipment Identifier — The unique second-generation serial number assigned to the minicard for use on the wireless network.MIMO Multiple Input Multiple Output—wireless antenna technology that uses multiple antennas at both transmitter and receiver side. This improves performance.NAS / AS Network Access ServerNC No ConnectNDIS Network Driver Interface SpecificationSpecification—a programming interfacespecification for connecting network interface cards in Windows.NIC Network Interface CardNMEA National Marine Electronics AssociationOEM Original Equipment Manufacturer—a company that manufactures a product and sells it to a reseller.OFDMA Orthogonal Frequency Division Multiple AccessOMA DM Open Mobile Alliance Device Management — A device management protocol.OTA ‘Over the air’ (or radiated through the antenna)PA Power Amplifierpacket A short, fixed-length block of data, including a header, that is transmitted as a unit in a communications network.PCB Printed Circuit BoardPCS Personal Communication SystemA cellular communication infrastructure that uses the 1.9 GHz radio spectrum.PDN Packet Data NetworkPMI Pre-coding Matrix IndexPSS Primary synchronisation signalPST Product Support ToolsPTCRB PCS Type Certification Review BoardQAM Quadrature Amplitude Modulation.This form of modulation uses amplitude, frequency, and phase to transfer data on the carrier wave.QMI Qualcomm MSM/Modem InterfaceQOS Quality of ServiceQPSK Quadrature Phase-Shift KeyingQPST Qualcomm Product Support ToolsRAT Radio Access TechnologyTable F-1: Acronyms and definitions (Continued)Acronym or term Definition

AcronymsRev 4 Sep.11 Proprietary and Confidential - Contents subject to change93RF Radio FrequencyRI Ring Indicatorroaming A cellular subscriber is in an area where service is obtained from a cellular service provider that is not the subscriber’s provider.RSE Radiated Spurious EmissionsRSSI Received Signal Strength IndicationSDK Software Development KitSED Smart Error DetectionSensitivity (Audio) Measure of lowest power signal that the receiver can measure.Sensitivity (RF) Measure of lowest power signal at the receiver input that can provide a prescribed BER / BLER / SNR value at the receiver output.SIB System Information BlockSIM Subscriber Identity Module. Also referred to as USIM or UICC.SIMO Single Input Multiple Output—smart antenna technology that uses a single antenna at the transmitter side and multiple antennas at the receiver side. This improves performance and security.SISO Single Input Single Output—antenna technology that uses a single antenna at both the transmitter side and the receiver side.SKU Stock Keeping Unit—identifies an inventory item: a unique code, consisting of numbers or letters and numbers, assigned to a product by a retailer for purposes of identification and inventory control.SMS Short Message Service.A feature that allows users of a wireless device on a wireless network to receive or transmit short electronic alphanumeric messages (up to 160 characters, depending on the service provider).S/N Signal-to-noise (ratio)SNR Signal-to-Noise RatioSOF Start of Frame — A USB function.SSS Secondary synchronisation signal.SUPL Secure User Plane LocationTIA/EIA Telecommunications Industry Association / Electronics Industry Association.A standards setting trade organization, whose members provide communications and information technology products, systems, distribution services and professional services in the United States and around the world. Consult www.tiaonline.org.TIS Total Isotropic SensitivityTable F-1: Acronyms and definitions (Continued)Acronym or term Definition

Product Technical Specification & Customer Design Guidelines94 Proprietary and Confidential - Contents subject to change2400074TRP Total Radiated PowerUDK Universal Development Kit (for PCI Express Mini Cards)UE User EquipmentUICC Universal Integrated Circuit Card (Also referred to as a SIM card.)UL Uplink (mobile to network)UL Underwriters LaboratoryUMTS Universal Mobile Telecommunications SystemUSB Universal Serial BusUSIM Universal Subscriber Identity Module (UMTS)VCC Supply voltage (3.3 V)VSWR Voltage Standing Wave RatioWAN Wide Area NetworkWCDMA Wideband Code Division Multiple Access (also referred to as UMTS)WLAN Wireless Local Area NetworkZIF Zero Insertion ForceTable F-1: Acronyms and definitions (Continued)Acronym or term Definition

Rev 4 Sep.11 Proprietary and Confidential - Contents subject to change 95IndexNumerics1Xoverview, 201xEV-DOoverview, 193D gain, averagegain3D average (GPS), 673GPP complianceLTE, 21Aacceptance tests, 71accessories, 17accuracy (GPS), 43acquisition time (GPS), 43acronyms and definitions, 89– 94antennaconnection considerations, 37connectors, 23custom, design, 38diversity antenna, disabling, 38GPS, specifications, recommended, 67limit, matching coaxial connections, 37location, considerations, 38matching, considerations, 38maximum cable loss, 37routing, 38specification, 65– 68specifications, recommended, 65testing, 67antennasdesign checklist, 69application interface features, 15approvals, regulatory and industry, 59AT commands, 82averaged call mode LTE / WCDMA / HSPA / HSPA+ DC power consumption, 46averaged standby DC power consumption, 45Bbands supported, RFsummary, 15CDMA, 42LTE, 42bearers, dedicated, 16block diagramexpanded RF, 25system, 24bottom view, 54Ccable lossantenna, maximum, 37CAIT support, 51capacitorswith SIM, 32with XIM_DATA / XIM_CLK, 32carrier/operator testing, 81CDMAbands supported, 15overview, 19frequency band support, 42TIA / EIA / IS compliance, 21cell selection, 16certification tests, 72checklist, design, 69communications, host to modemdesign checklist, 70conducted Tx power tolerances, 43connectiongrounding, 39connectors, 37connectors, requiredhost-module, 18control interface, 33CQI, 16DDC power consumptionaveraged call mode LTE / WCDMA / HSPA / HSPA+, 46averaged standby, 45CDMA, 46desense. See RFdesign checklistantennas, 69component placement, 69EMI/ESD, 69host/modem communications, 70power, 69thermal, 70detach procedure, 16Development Kit contents, 17digital interface, 35dimensioned view, 54dimensions, 53, 54Direct IP interface, 51diversity antennadisabling, 38diversity connector, location, 37drop specifications, 53

Product Technical Specification & Customer Design Guidelines96 Proprietary and Confidential - Contents subject to change 2400074EEDGEconnector, required, 18electrical specifications, 23electrostatic discharge specifications, 53electrostatic discharge. See ESDenvelope correlation coefficient, 66environmental specifications, 53– 55ESDdesign checklist, 69protection requirements, 55ESD specifications, 53EVDOoverview, 19expanded RF block diagram, 25FFCC approval, 59FER (Frame Error Rate), 41field of view, 67filtering, RF desense, 40form factor, 53FOV, 67frame error rate (FER)measure of sensitivity, 41free space average gain, 67frequencies supported, 41frequency band supportCDMA, 42LTE, 42GgainGPS, 67maximum, 60, 66mean effective, 66mean effective imbalance, 66GCF-CC approval, 59General purpose IO (GPIO), 35GLONASS, 17GPIO (General purpose IO), 35GPSantenna specifications, recommended, 67connector location, 37DC bias on connector, 17features supported, 17specifications, 43ground specifications, 29groundingconnection considerations, 39Hhost interfacepin assignments, 25humidity specifications, 53II/O connector location, 37I/O rise time requirements, 32impedancemodule–antenna, 38SIM, 32industry approvals, 59Industry Canada approval, 59integration requirements, 18interfacecontrol interface, 33digital interface, 35Direct IP, 51feature summary, 15host, pin assignments, 25QMI, 51SIM, 30software, 51USB, 29interferencedevice generated, 40host-generated, 40power supply noise, 50wireless devices, 39Interoperability testing, 81intra-LTE mobility, 16IOT testing, 81iRAT, 16IS-95Aoverview, 20isolation, 66, 67Llabeling, 55LEDexample, 34states, 34LED output, 23, 33, 34LTE3GPP compliance, 21overview, 19bands supported, 15bandwidth support, 42features, 16frequency band support, 42Mmean effective gain, 66mean effective gain imbalance, 66mechanical specifications, 53– 55MIB, 16MIMO support, 15

IndexRev 4 Sep.11 Proprietary and Confidential - Contents subject to change 97minicomdownloading and installing, 76modulepower states, 47– 49NNAS/AS security, 16NDIS NIC interface support, 15NIC interface support, 15noiseleakage, minimizing, 39RF interference, power supply, 50OOEMassistance with testing, 81labeling, 55operator/carrier testing, 81ordering information, 18Ppackaging, 85packet mode features, 16paging procedures, 16PCBmulti-layer, shielding for RF desense, 40PDN connections, multiple, 16pin assignments, host interface, 25PMI, 16polarization, 67position location, 17powerdesign checklist, 69handling, 66power-up timing, 49ramp-up timing, 49state machines, 48states, module, 47– 49supply, RF interference, 50supply, ripple limit, 50power consumption, DCaveraged call mode LTE / WCDMA / HSPA / HSPA+, 46averaged standby, 45CDMA, 46power specifications, 29power tolerances, conducted Tx, 43Product Support Tool, QUALCOMM (QPST), 51Product Support Tool, Sierra Wireless (PST), 51production tests, 73PSS, 16PST (Product Support Tool, Sierra Wireless), 51PTCRB approval, 59QQMI interface, 51QPST (QUALCOMM Product Support Tool), 51QUALCOMM Product Support Tool (QPST), 51quality assurance tests, 80QXDM support, 51Rradiated efficiency, total, 65radiated sensitivity measurement, 41radiated spurious emissions, 40radiation patterns, 65references, 87– 88regulatory approvals, 59regulatory information, 59– 63FCC, 60limitation of liability, 59safety and hazards, 59resistors, external pull-up, 32RFantenna cable loss, maximum, 37antenna connection, considerations, 37connectors, required, 18desensedevice-generated, 40harmonic energy, filtering, 40mitigation suggestions, 40shielding suggestions, 40interferenceother devices, 40power supply, 50wireless devices, 39RF bands supportedsummary, 15CDMA, 42LTE, 42RF block diagram, expanded, 25RF connector location, 37RF specifications, 37– 44RI, 16RSE, 40Rx sensitivityconducted, 42Ssalesordering, 18SEDsee Smart Error DetectionSee also W_DISABLE_N, 33sensitivityconducted, RF parameter, 42defined, 41radiated measurement, overview, 41testing, overview, 41

Product Technical Specification & Customer Design Guidelines98 Proprietary and Confidential - Contents subject to change 2400074shieldingmodule, compliance, 37reducing RF desense, 40shock specifications, 53SIB, 16signals, 33WLAN_LED_N, 34SIMcapacitor recommendations, 32card contacts, 31clock rate, 32connector, required, 18electrical specifications, 32impedance, connectors, 32interface, 30interface diagram, 31operation, 32Smart Error Detectiondetecting module reset, 50SMS features, 16Snow 3G/AES security, 16software interface, 51specificationselectrical, 23environmental specifications, 53– 55GPS, 43mechanical, 53– 55RF, 37– 44SSS, 16standalone mode, GPS, 17standby DC power consumption, averaged, 45state machines, 48supportfeatures, 17testing assistance by Sierra Wireless, 81tools, 51system acquisition, 16system block diagram, 24Ttemperature specifications, 53temperature, module. See thermaltestingoverview, 71acceptance tests, 71assistance provided by Sierra Wireless, 81certification tests, 72equipment, suggested, 81interoperability and operator/carrier testing, 81manual functional test, suggested, 73production tests, 73quality assurance tests, 80RF receive path, CDMA, 77RF receive path, LTE, 78suggestions, 71– 84thermalconsiderations, 56– 57design checklist, 70dissipation, factors affecting, 56dissipation, suggestions, 56RF shield temperature, maximum, 57testing, module, 57TIA / EIA / IS complianceCDMA, 21timingpower ramp-up, 49power-up, 49top view, 54Tx power tolerances, conducted, 43UUDK, 17Universal Development Kit, 17USBdrivers, user-developed, 30enumeration, power-up, 49high / full speed throughput performance, 29interface, 29Vvibration specifications, 53VSWR, 65, 67WW_DISABLE_N, 33warranty, 17Wireless Disable, 23, 33Wireless Disable (Main RF), 33WLAN_LED_N, 33, 34WMC DLL support, 16ZZIF (Zero Intermediate Frequency), 39