iComm Semiconductor M169 WIFI Module User Manual 15 M169 UserMan

iComm Semiconductor Co.,Ltd. WIFI Module 15 M169 UserMan

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M169 WIFI Module specification

Features

 WI-FI Features

 Support 802.11 b/g/n Wireless standards

 Support WEP、WPA/WPA2

 Support Station or Soft AP mode

 Andes Technology N10 processor，128K ROM and 192KB SRAM for instruction and data

SRAM in total

 Integrate 16Mbit SPI flash in package

 Support OTA

 PCB ANT

 Operating Voltage:DC 3.0V-3.6V

 External port

2X UART（1xDebug URAT）

4X ADC

9X GPIO (include1XI2C, 4XPWM,1XSPI_M)

 Work Temperature：-20℃ ～ +80℃

 Module Size：15mmX18mm，SMD package

Application

 intelligent lighting

 Intelligent Transportation System

 Smart home appliances

 Intelligent security

 industrial automation

Contents

1. Product introduction ............................................................................................... 2

Block diagram of module hardware .................................................................. 3

1.1. Pin definition ................................................................................................. 3

1.2. Pin Assignment ............................................................................................ 5

1.3. Pin Descriptions ........................................................................................... 5

2. Electric parameter .............................................. 7

2.1 Absolute Maximum Ratings .................................... 7

2.2 Operating Conditions ......................................... 7

2.3 Environmental Ratings ........................................ 7

2.4 Storage Condition ............................................ 7

3. Module assembly ................................................. 8

3.1 Module layout ................................................ 8

1. Product introduction

The Module include WLAN MAC、Baseband、RF，and the Processor speed up 160MHz.The

WIFI SoC has 128K ROM and 192KB SRAM for instruction and data SRAM，also integrate 2MB

SPI flash 。The whole module is supplied with 3.3V power.Use SMT installation.

The following figure is the hardware block diagram of the module：

Block diagram of module hardware

1.1. Pin definition

The module uses the DIP package and stamp hole package two kinds of interface design

scheme to facilitate customer debugging。

Figure1 Machine size map

1.2. Pin Assignment

Figure2 M169 Pin Assignment

1.3. Pin Descriptions

NO.

Name

Description

 Programmable functions

GND

Ground

GPIO01

PWM1

GPIO02

PWM2

GPIO03

Debug_UART_RX

PWM3

GPIO04

Debug_UART_TX

PWM4

GPIO05

UART1_RTS

GPIO06

UART1_RXD

Reset signal and chip

enable

GPIO08

SPI_M_CLK

GPIO09

UART1_CTS

GPIO10

SPI_M_MISO

GPIO12

SPI_M_MOSI

GPIO13

SPI_M_CS

GPIO07

UART1_TXD

GPIO00

PWM0

ADC

GPIO20

ADC

GPIO21

I2C_SDA

Debug_

UART_R

ADC

GPIO22

I2C_SCL

Debug_

UART_T

ADC

VDD33

3.3V power supply

GND

Ground

2. Electric parameter

2.1 Absolute Maximum Ratings

The absolute maximum ratings in Table 2-1 indicate levels where permanent damage to the device can occur,

even if these limits are exceeded for only a brief duration. Functional operation is not guaranteed under these

conditions. Operation at absolute maximum conditions for extended periods can adversely affect long-term reliability

of the device.

Table 2-1 Absolute Maximum Rating

2.2 Operating Conditions

Table 2-2 Recommended Operating Conditions and DC Characteristics

Symbol

Description

MIN

TYP

MAX

Unit

VDD

Module input power

3.0

3.3

3.6

VIL

Input Low（VDDIO=3.3V）

-0.3

0.8

VIH

Input High（VDDIO=3.3V）

3.6

VOL

output Low（VDDIO=3.3V）

0.4

VOH

output High（VDDIO=3.3V）

2.4

2.3 Environmental Ratings

Table 2-3 Environmental Ratings

Characteristic

Conditions/Comments

Value

Units

Ambient Temperature

Functional operation

-20 to +80

°C

Max welding temperature

IPC/JEDEC J-STD-020

260

°C

2.4 Storage Condition

Characteristic

Conditions/Comments

Value

Units

Symbol

Description

Max Rating

Unit

VDD

Input power

-0.3 to 3.6

Storge Temperature

-40 to +125

°C

3. Module assembly

3.1 Module layout

When the module used the on-board antenna , it is necessary to ensure that the module antenna extends

directly from the bottom plate, and the antenna that cannot extend the bottom plate must also be hollowed out

on the bottom plate, and the distance from other metal devices should be at least 16mm.The following figure

shows the placement of the protruding edge of the module：

Figure 3 Schematic diagram of module installation position

Figure4 Antenna hollow area requirements

FCC Warning

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference

received, including interference that may cause undesired operation.

NOTE 1: This equipment has been tested and found to comply with the limits for a Class B digital device,

pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against

harmful interference in a residential installation. This equipment generates, uses and can radiate radio

frequency energy and, if not installed and used in accordance with the instructions, may cause harmful

interference to radio communications. However, there is no guarantee that interference will not occur in

a particular installation. If this equipment does cause harmful interference to radio or television

reception, which can be determined by turning the equipment off and on, the user is encouraged to try

to correct the interference by one or more of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.

-Consult the dealer or an experienced radio/TV technician for help.

NOTE 2: Any changes or modifications to this unit not expressly approved by the party responsible for

compliance could void the user's authority to operate the equipment.

FCC Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.

End users must follow the specific operating instructions for satisfying RF exposure compliance.

Note 1: This module certified that complies with RF exposure requirement under mobile or fixed

condition, this module is to be installed only in mobile or fixed applications.

A mobile device is defined as a transmitting device designed to be used in other than fixed locations and

to generally be used in such a way that a separation distance of at least 20 centimeters is normally

maintained between the transmitter's radiating structure(s) and the body of the user or nearby persons.

Transmitting devices designed to be used by consumers or workers that can be easily re-located, such as

wireless devices associated with a personal computer, are considered to be mobile devices if they meet

the 20 centimeter separation requirement.

A fixed device is defined as a device is physically secured at one location and is not able to be easily

moved to another location.

Note 2: Any modifications made to the module will void the Grant of Certification, this module is limited

to OEM installation only and must not be sold to end-users, end-user has no manual instructions to

remove or install the device, only software or operating procedure shall be placed in the end-user

operating manual of final products.

Note 3: Additional testing and certification may be necessary when multiple modules are used.

Note 4: The module may be operated only with the antenna with which it is authorized. Any antenna

that is of the same type and of equal or less directional gain as an antenna that is authorized with the

intentional radiator may be marketed with, and used with, that intentional radiator.

Note 5: To ensure compliance with all non-transmitter functions the host manufacturer is responsible

for ensuring compliance with the module(s) installed and fully operational. For example, if a host was

previously authorized as an unintentional radiator under the Supplier’s Declaration of Conformity

procedure without a transmitter certified module and a module is added, the host manufacturer is

responsible for ensuring that the after the module is installed and operational the host continues to be

compliant with the Part 15B unintentional radiator requirements. Since this may depend on the details

of how the module is integrated with the host, (iComm Semiconductor Co., Ltd.) shall provide guidance

to the host manufacturer for compliance with the Part 15B requirements.

Note 6: FCC ID label on the final system must be labeled with “Contains FCC ID: 2AQ5K-M169” or

“Contains transmitter module FCC ID: 2AQ5K-M169”.

Note 7: For all products market in US, OEM has to limit the operation channels in CH1 to CH11 for 2.4G

band by supplied firmware programming tool. OEM shall not supply any tool or info to the end-user

regarding to Regulatory Domain change.

iComm Semiconductor M169 WIFI Module User Manual 15 M169 UserMan

iComm Semiconductor Co.,Ltd. WIFI Module 15 M169 UserMan

15_M169 UserMan

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