iFIT Health and Fitness BMD1 BMD-ICN-1 User Manual BMD 200

Icon Health and Fitness, Inc. BMD-ICN-1 BMD 200

User Manual

BMD-ICN-1 Datasheet v1.0 CONFIDENTIAL Page 1 of 11 BMD-ICN-1 Module for Bluetooth 4.1 LE Table of Contents 1. QUICK SPECIFICATIONS ................................................................................................................................................ 2 2. PIN DESCRIPTIONS ....................................................................................................................................................... 3 3. ELECTRICAL SPECIFICATIONS ........................................................................................................................................ 4 3.1. ABSOLUTE MAXIMUM RATINGS ............................................................................................................................ 4 3.2. OPERATING CONDITIONS....................................................................................................................................... 4 3.3. GENERAL PURPOSE I/O .......................................................................................................................................... 4 3.4. DEBUG & PROGRAMMING .................................................................................................................................... 5 3.5. CLOCKS .................................................................................................................................................................. 5 4. MECHANICAL DATA ...................................................................................................................................................... 6 4.1. MODULE DIMENSIONS .......................................................................................................................................... 6 4.2. RECOMMENDED PCB LAND PAD ............................................................................................................................ 6 5. MODULE MARKING ...................................................................................................................................................... 7 5.1. MECHANICAL ENCLOSURE ..................................................................................................................................... 7 6. REGULATORY STATEMENTS ......................................................................................................................................... 8 6.1. FCC STATEMENT: ................................................................................................................................................... 8 6.2. FCC IMPORTANT NOTES: ........................................................................................................................................ 8 6.3. IC STATEMENT: ...................................................................................................................................................... 9 6.4. IC IMPORTANT NOTES: ........................................................................................................................................ 10 6.5. CE REGULATORY: ................................................................................................................................................. 10 7. SOLDER REFLOW TEMPERATURE-TIME PROFILE ......................................................................................................... 11
BMD-ICN-1 Datasheet v1.0 CONFIDENTIAL Page 2 of 11 1. Quick Specifications Bluetooth Version 4.1 (Bluetooth Smart) Peripheral/Central (S130) Security AES-128 LE connections up to 3 as Central, up to one a Peripheral (S130, simultaneous) Radio Frequency 2.402GHz to 2.480GHz Modulations GFSK at 250 kbps, 1 Mbps (BLE), 2 Mbps data rates Transmit power +4 dBm Receiver sensitivity -93 dBm (BLE mode) Antenna PCB Trace Antenna Current Consumption TX only @ +4 dBm, 0 dBm, -4 dBm 16 mA, 10.5 mA, 8 mA RX only @ 2 Mbps, 1 Mbps, 250 kbps 13.4 mA, 13 mA, 12.6 mA CPU @ 16MHz from flash, from RAM 4.4 mA, 2.4 mA System Off , w/ 16K RAM, 8K RAM, no RAM retention 1.8 uA, 1.2 uA, 0.6 uA Dimensions Length 18.5mm Width 13.25 mm Height 2.0 mm Hardware Interface SPI Master/Slave, UART, Two-Wire Master, GPIO Power supply 1.8V to 3.6V Temperature Range -25 to +75°C Certifications FCC FCC part 15 modular qualification – FCC ID: OMCBMD1 IC Industry Canada RSS-210 modular qualification – IC: 3673A-BMD1 CE EN 60950-1: 2011-01 3.1 (a) : Health and Safety of the User EN 301 489-17 V2.2.1 3.1 (b) : Electromagnetic Compatibility EN 300 328 V1.8.1 3.2 : Effective use of spectrum allocated Bluetooth End Product with S130 1.0.0 – DID: TBD Table 1- Quick Specifications
BMD-ICN-1 Datasheet v1.0 CONFIDENTIAL Page 3 of 11 2. Pin Descriptions Figure 1- Pin out (Top View) Pin description Name Pin Direction Description P0.21 7 In/Out GPIO P0.22 8 In/Out GPIO P0.23 9 In/Out GPIO P0.24 10 In/Out GPIO P0.25 11 In/Out GPIO P0.26 12 In/Out GPIO P0.27 13 In/Out GPIO P0.28 14 In/Out GPIO P0.29 15 In/Out GPIO P0.30 19 In/Out GPIO P0.00 20 In/Out DTM UART RX P0.01 21 In/Out DTM UART TX P0.02 22 In/Out GPIO P0.03 23 In/Out GPIO P0.04 24 In/Out GPIO P0.05 25 In/Out GPIO P0.06 26 In/Out GPIO P0.07 27 In/Out GPIO P0.08 28 In/Out GPIO P0.09 31 In/Out GPIO P0.10 32 In/Out GPIO P0.11 33 In/Out GPIO P0.12 34 In/Out GPIO P0.13 35 In/Out GPIO P0.14 36 In/Out GPIO P0.15 37 In/Out GPIO P0.16 38 In/Out GPIO SWDIO 39 In/Out SWDIO/ RESET̅̅̅̅̅̅̅̅̅ SWCLK 40 In SW Clock P0.17 41 In/Out GPIO P0.18 42 In/Out GPIO P0.19 43 In/Out GPIO P0.20 44 In/Out GPIO VCC 17 Pwr +1.8 to +3.6VDC input GND 1, 2, 3, 4, 5, 6, 16, 18, 29, 30, 45, 46, 47 Pwr Electrical Ground Table 2 – Pin Descriptions Note 1: An external capacitor for VCC is not strictly required, however using a 1µF - 4.7µF ceramic capacitor is recommended. 123456789101112131415161718192021222324252627282930 3132333435363738394041424344454647
BMD-ICN-1 Datasheet v1.0 CONFIDENTIAL Page 4 of 11 3. Electrical Specifications 3.1. Absolute Maximum Ratings Symbol Parameter Min. Max. Unit VCC_MAX Voltage on supply pin -0.3 3.9 V VIO_MAX Voltage on GPIO pins -0.3 VCC + 0.3 V TS Storage Temperature Range -40 125 °C Table 3 – Absolute Maximum Ratings 3.2. Operating Conditions Symbol Parameter Min. Typ. Max. Unit VCC Operating supply voltage 1.8 3.0 3.6 V TR_VCC Supply rise time (0V to 1.8V) - - 60 ms TA Operating Ambient Temperature Range -25 25 75 °C TAext Extended Operating Temperature Range 1 -25 25 85 °C Note 1: VCC range reduced to 1.9V to 3.6V. Some degradation in RF performance. See Nordic Semiconductor’s ‘nRF51822 specification for Industrial Temperature Range’ Addendum for full details (QFAC variant). Table 4 – Operating Conditions 3.3. General Purpose I/O The general purpose I/O is organized as one port enabling access and control of the 31 available GPIO pins through one port. Each GPIO can be accessed individually with the following user configurable features:  Input/output direction  Output drive strength  Internal pull-up and pull-down resistors  Wake-up from high or low level triggers on all pins  Trigger interrupt on all pins  All pins can be used by the PPI task/event system; the maximum number of pins that can be interfaced through the PPI at the same time is limited by the number of GPIOTE channels  All pins can be individually configured to carry serial interface or quadrature demodulator signals Symbol Parameter Min. Typ. Max. Unit VIH Input High Voltage 0.7 x VCC - VCC V VIL Input Low Voltage VSS - 0.3 x VCC V VOH Output High Voltage VCC – 0.3 - VCC V VOL Output Low Voltage VSS - 0.3 V RPU Pull-up Resistance 11 13 16 kΩ RPD Pull-down Resistance 11 13 16 kΩ Table 5 - GPIO Note: GPIO have a standard drive strength of 0.5 mA, and a high drive strength of 5 mA. Maximum number of high drive strength pins is 3.
BMD-ICN-1 Datasheet v1.0 CONFIDENTIAL Page 5 of 11 3.4. Debug & Programming The BMD-ICN-1 supports the two pin Serial Wire Debug (SWD) interface and allows for debugging of program code. Breakpoints, single stepping, and instruction trace capture of code execution flow are part of this support. 3.5. Clocks The BMD-ICN-1 module requires two clocks, a high frequency clock and a low frequency clock. The high frequency clock is provided internally by a high-accuracy 16-MHz crystal as required by the nRF51822 for radio operation. The low frequency clock can be provided internally by an RC oscillator or synthesized from the fast clock; or externally by a 32.768 kHz crystal. An external crystal provides the lowest power consumption. The internal RC oscillator is sufficient for BLE operation and most designs, unless more accurate time keeping is required. 32.768 kHz Crystal Specification Requirements Symbol Parameter Typ. Max. Unit fnom Crystal frequency 32.768 - kHz Ftol,BLE Frequency tolerance, Bluetooth low energy applications. ±250 - ppm Cl Load Capacitance - 12.5 pF Co Shunt Capacitance - 2 pF Rs Equivalent series resistance 50 80 kΩ Cpin Input Capacitance on XTAL1 & XTAL2 5 - pF Table 6 - 32.768 kHz Crystal 32.768 kHz Oscillator Comparison Symbol Parameter Typ. Max. Unit IX32k Current for 32.768kHz Crystal Oscillator 0.4 1 uA IRC32k Current for 32.768kHz RC Oscillator 0.8 1.1 uA ISYNT32k Current for 32.768kHz Synthesized Oscillator 15 - uA FTOL,X32k Frequency Tolerance, 32.768kHz Crystal Oscillator - ±250 ppm F TOL,RC32k Frequency Tolerance, 32.768kHz RC Oscillator ±2 - % F TOL,SYNT32k Frequency Tolerance, 32.768kHz Synthesized Oscillator ±34 - ppm Table 7 - 32.768 kHz Oscillator Note: FTOL,X32k is max tolerance allowed for BLE applications. Actual tolerance depends on the crystal used.
BMD-ICN-1 Datasheet v1.0 CONFIDENTIAL Page 6 of 11 4. Mechanical Data 4.1. Module Dimensions Figure 2- Module Dimensions (All dimensions are in mm) 4.2. Recommended PCB Land Pad Figure 3- Module Dimensions
BMD-ICN-1 Datasheet v1.0 CONFIDENTIAL Page 7 of 11 (All dimensions are in mm) 5. Module Marking Figure 4 – Module Marking – Rev A – BMD-ICN-1-A (16kB) Figure 5- Recommended RF Layout 5.1. Mechanical Enclosure Care should be taken when designing and placing the module into an enclosure. Metal should be kept clear from the antenna area, both above and below. Any metal around the module can negatively impact RF performance. The module is designed and tuned for the antenna and RF components to be in free air. Any potting, epoxy fill, plastic overmolding, or conformal coating can negatively impact RF performance and must be evaluated by the customer.
BMD-ICN-1 Datasheet v1.0 CONFIDENTIAL Page 8 of 11 6. Regulatory Statements 6.1. FCC Statement: This device has been tested and found to comply with part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:  Reorient or relocate the receiving antenna.  Increase the separation between the equipment and the receiver  Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.  Consult the dealer or an experienced radio/TV technician for help. Operation is subjected to the following two conditions: (1) This device may no cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: Modification to this product will void the user’s authority to operate this equipment. Note: Modification to this product will void the users’ authority to operate this equipment. 6.2. FCC Important Notes: (1) FCC Radiation Exposure Statement This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This equipment complies with Part 15 of the FCC Rules. Operation is subject the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. The devices must be installed and used in strict accordance with the manufacturer’s instructions as described in the user documentation that comes with the product. Caution! The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications to this equipment. Such modification could void the user authority to operate the equipment. (2) Co-location Warning: This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. (3) OEM integration instructions： This device is intended only for OEM integrators under the following conditions: The antenna and transmitter must not be co-located with any other transmitter or antenna. The module shall
BMD-ICN-1 Datasheet v1.0 CONFIDENTIAL Page 9 of 11 be only used with the integral antenna(s) that has been originally tested and certified with this module. As long as the two (2) conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements with this module installed (for example, digital device emission, PC peripheral requirements, etc.) In the event that these conditions cannot be met (for example certain laptop configuration or co-location with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer considered valid and the FCC ID of the module cannot be used on the final product. In these and circumstance, the OEM integrator will be responsible for re-evaluating. The end product (including the transmitter) and obtaining a separate FCC authorization. Caution! The OEM is still responsible for verifying compliance with FCC Part 15, subpart B limits for unintentional radiators through a qualified test house. (4) End product labeling： The final end product must be labeled in a visible area with the following: “Contains FCC ID: OMCBMD1”. Any similar wording that expresses the same meaning may be used. The FCC Statement below should also be included on the label. When not possible, the FCC Statement should be included in the User Manual of the host device. “This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions. (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation.” (5) Information regarding the end user manual： The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual (Section 15.2(4)). 6.3. IC Statement: This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. RF exposure warning: The equipment complies with RF exposure limits set forth for an uncontrolled environment. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Avertissement d'exposition RF: L'équipement est conforme aux limites d'exposition aux RF établies pour un incontrôlés environnement. L'antenne (s) utilisée pour ce transmetteur ne doit pas être co-localisés ou onctionner en conjonction avec toute autre antenne ou transmetteur .
BMD-ICN-1 Datasheet v1.0 CONFIDENTIAL Page 10 of 11 6.4. IC Important Notes: 1. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual which is provided by OEM integrators for end users must include the following information in a prominent location. 2. To comply with IC RF exposure compliance requirements, the antenna used for this transmitter must not be co‐located or operating in conjunction with any other antenna or transmitter, except in accordance with IC multi‐transmitter product procedures. 3. The final system integrator must ensure there is no instruction provided in the user manual or customer documentation indicating how to install or remove the transmitter module except such device has implemented two‐ways authentication between module and the host system. 4. The host device shall be properly labelled to identify the module within the host device. The final end product must be labeled in a visible area with the following: “Contains IC: 3673A-BMD1”. Any similar wording that expresses the same meaning may be used. The IC Statement below should also be included on the label. When not possible, the IC Statement should be included in the User Manual of the host device. “This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le onctionnement.” 6.5. CE Regulatory: This device has been tested and have been found compliant against the following standards. OEM integrators should consult with qualified test house to verify all regulatory requirements have been met for their complete device. From Directive 2006/95/EC:  EN 60950-1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 From R&TTE Directive 1999/5/EC:  ETSI EN 300 440-1 V 1.6.1  ETSI EN 300 440-2 V 1.4.1  EN 62479:2010 From Directive 2004/108/EC:  ETSI EN 301 489-3 V1.6.1  ETSI EN 301 489-1 V1.9.2
BMD-ICN-1 Datasheet v1.0 CONFIDENTIAL Page 11 of 11 7. Solder Reflow Temperature-Time Profile Figure 6 - Reflow Profile for Lead Free Solder

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