fibocom FM350-GL 5G NR Sub-6GHz M.2 Module User Guide

User Guide for fibocom models including: FM350GL, ZMOFM350GL, FM350-GL 5G NR Sub-6GHz M.2 Module, 5G NR Sub-6GHz M.2 Module

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User Manual

Fibocom Wireless Inc. FM350GL 5G Module ZMOFM350GL ZMOFM350GL fm350gl

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FM350-GL Hardware Guide _General
Version: V1.0.5 Date: 2020-03-12

Applicability Table

No.

Product model

FM350-GL-00

Description NA

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Copyright
Copyright © 2020 Fibocom Wireless Inc. All rights reserved. Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or distribute the document in any form.

Notice
The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide. All the statements, information and suggestions contained in the document do not constitute any explicit or implicit guarantee.

Trademark

The trademark is registered and owned by Fibocom Wireless Inc.

Change History
Version Author V1.0.5 Randy V1.0.4 Xiaodequan V1.0.3 Leidaijun V1.0.2 Xiaodequan
V1.0.1 Leidaijun
V1.0.0 Leidaijun

Date 2021-03-12 2021-02-06 2020-11-11 2020-09-15
2020-6-30
2020-4-30

Remark Update LTE UL to Release 15
Update Phase2 feature
Update Power Sequence Update n25, n30 Update PCIe impedance requirement Update pin definition Update FCPO# and RESET# recommended design Update WWAN M.2 module type configuration Draft version

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Contents

1 Foreword ....................................................................................................................... 7 1.1 Introduction................................................................................................................... 7 1.2 Reference Standard ..................................................................................................... 7 1.3 Related Documents ...................................................................................................... 8
2 Overview ....................................................................................................................... 8 2.1 Introduction................................................................................................................... 8 2.2 Specification ................................................................................................................. 8 2.3 Application Block ........................................................................................................ 10 2.4 Hardware Block Diagram ............................................................................................ 11 2.5 Antenna Configuration ................................................................................................ 11
3 Application Interface ...................................................................................................13 3.1 M.2 Interface .............................................................................................................. 13
Pin Map ......................................................................................................................... 13 Pin Definition ................................................................................................................. 14 3.2 Power Supply ............................................................................................................. 18 Power Supply ................................................................................................................ 18 Logic level ..................................................................................................................... 19 3.3 Control Signal ............................................................................................................. 20 Module Start-Up ............................................................................................................ 20
3.3.1.1 Start-up Circuit........................................................................................................................... 20

3.3.1.2 Start-up Timing Sequence ......................................................................................................... 21
Module Shutdown ......................................................................................................... 22 Module Reset ................................................................................................................ 22 PCIe Link State ............................................................................................................. 24
3.3.4.1 D0 L1.2 ...................................................................................................................................... 24

3.3.4.2 D3cold L2..................................................................................................................................... 25
Timing application ......................................................................................................... 26 3.4 PCIe Interface ............................................................................................................ 26
PCIe Interface Definition ............................................................................................... 27 PCIe Interface Application............................................................................................. 27 3.5 USIM Interface............................................................................................................ 29 USIM Pins ..................................................................................................................... 29 USIM Interface Circuit ................................................................................................... 30

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3.5.2.1 N.C. SIM Card Slot .................................................................................................................... 30
3.5.2.2 N.O. SIM Card Slot .................................................................................................................... 30
USIM Hot-Plug .............................................................................................................. 31 USIM Design ................................................................................................................. 31 3.6 Status Indicator........................................................................................................... 32 LED#1 Signal ................................................................................................................ 32 WOWWAN# .................................................................................................................. 33 3.7 Interrupt Control.......................................................................................................... 34 W_DISABLE1#.............................................................................................................. 34 BODYSAR..................................................................................................................... 34 3.8 ANT Tunable Interface................................................................................................ 34 3.9 Configuration Interface ............................................................................................... 35
4 Radio Frequency .........................................................................................................36 4.1 RF Interface................................................................................................................ 36
RF Interface Functionality ............................................................................................. 36 RF Connector Characteristic......................................................................................... 36 RF Connector Dimension.............................................................................................. 37 RF Connector Assembly ............................................................................................... 38 4.2 Operating Band .......................................................................................................... 39 4.3 Transmitting Power ..................................................................................................... 41 4.4 Antenna Design .......................................................................................................... 43
5 ESD Characteristics ....................................................................................................46 6 Structure Specification ...............................................................................................47
6.1 Product Appearance ................................................................................................... 47 6.2 Dimension of Structure ............................................................................................... 47 6.3 M.2 Interface Model .................................................................................................... 48 6.4 M.2 Connector ............................................................................................................ 49 6.5 Storage....................................................................................................................... 50
Storage Life ................................................................................................................... 50 6.6 Packing ...................................................................................................................... 50
Tray Package ................................................................................................................ 50 Tray size ........................................................................................................................ 52
7 CE Conformance information.....................................................................................53 8 FCC Conformance information ..................................................................................53

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9 ISED Conformance information .................................................................................56

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1 Foreword
1.1 Introduction
The document describes the electrical characteristics, RF performance, dimensions and application environment, etc. of FM350-GL (hereinafter referred to as FM350). With the assistance of the document and other instructions, the developers can quickly understand the hardware functions of FM350 modules and develop products.
1.2 Reference Standard
The design of the product complies with the following standards: 3GPP TS 38.300 V15.5.0 : 3rd Generation Partnership Project; Technical Specification Group Radio
Access Network; NR; NR and NG-RAN Overall Description; Stage 2 3GPP TS 38.521-1 V15.2.0 : User Equipment (UE) conformance specification; Radio transmission
and reception; Part 1: Range 1 Standalone 3GPP TS 38.521-3 V15.2.0 :User Equipment (UE) conformance specification; Radio transmission
and reception; Part 3: Range 1 and Range 2 Interworking operation with other radios 3GPP TS 34.121-1 V8.11.0: User Equipment (UE) conformance specification; Radio transmission
and reception (FDD);Part 1: Conformance specification 3GPP TS 34.122 V14.0.0: Technical Specification Group Radio Access Network; Radio transmission
and reception (TDD) 3GPP TS 36.521-1 V14.0.0: User Equipment (UE) conformance specification; Radio transmission
and reception; Part 1: Conformance testing 3GPP TS 21.111 V10.0.0: USIM and IC card requirements 3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment (SIM-
ME) interface 3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)
application 3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit(USAT) 3GPP TS 36.124 V10.3.0: Electro Magnetic Compatibility (EMC) requirements for mobile terminals
and ancillary equipment 3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE) 3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment
(DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) PCI Express M.2 Specification Rev1.2

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1.3 Related Documents
FIBOCOM Design Guide_RF Antenna

2 Overview
2.1 Introduction
FM350 is a highly integrated 5G Sub-6 WWAN module which uses M.2 form factor interface. It supports NR/LTE /WCDMA systems and can be applied to most cellular networks of mobile carrier in the world.

2.2 Specification

Specification
Operating Band
GNSS NR LTE UMTS

LTE FDD: B1, B2, B3, B4, B5, B7, B8, B12, B13, B14, B17, B18, B19, B20, B25, B26, B28, B29, B30, B32, B66, B71 LTE TDD: B34, B38, B39, B40, B41, B42, B43, B46, B48 NR: n1, n2, n3, n5, n7, n8, n20, n25, n28, n30, n38, n40, n41, n481), n66, n71, n77, n78, n79 WCDMA/HSPA+: Band 1, 2, 4, 5, 8
Support GPS, GLONASS, Galileo, BDS, QZSS
3GPP Release 15
3GPP Release 15
3GPP Release 8 NR: DL 4*4 MIMOn1, n2, n3, n7, n25, n30, n38, n40, n41, n48, n66, n77, n78, n79 UL 2*2 MIMOn41, n77, n78, n79

Feature

LTE: DL 4*4 MIMOB1, B2, B3, B4, B7, B25, B30, B34, B38, B39, B40, B41, B42, B43, B48, B66
NSA and SA supported
SRS: n41, n77, n78, n79, Support: 1T2R, 1T4R, 2T4R
HPUE: B41, n41, n772), n78, n79
TX Switching WCDMA: B1, B2, B4 LTE: B1, B2, B3, B4, B7, B25, B30, B34, B38, B39, B40, B41, B42, B43, B48, B66 NR: n1, n2, n3, n7, n25, n30, n38, n40, n41,n48, n66, n77, n78, n79

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Specification

SA 5G/NR Sub-6 Peak DL 4.67Gbps/ UL 1.25Gbps3)

NSA Peak

DL 3.74Gbps/ UL 835Mbps4)

Data Transmission LTE

DL 1.6Gbps (CAT19)/ UL 211Mbps(CAT18) 5)

UMTS/HSPA+

DL UMTS:384 kbps/ UL 384 kbps DL DC-HSPA+:42 Mbps (CAT24)/ UL 11.5 Mbps (CAT7)

LTE DL 5CA, UL 2CA Carrier Aggregation NR DL 2CA, UL 2CA
ENDC DL LTE 5CA+ NR 1CA, LTE 3CA+ NR 2CA , UL LTE 2CA+ NR 1CA

Power Supply

DC 3.135V4.4V, Typical 3.3V

Temperature

Normal operating temperature: -10°C +55°C Extended operating temperature: -30°C +75°C
Storage temperature: -40°C+85°C

Physical Characteristics

Interface: M.2 Key-B Dimension30 x 52 x 2.3mm Weight: 8g

Interface

WWAN Antenna x 4 Antenna Connector
Support 4x4 MIMO

Dual SIM (one built-in eSIM), 1.8V/3V

PCIe Gen3 X1 USB 2.0 (For debug)

USB 3.1 Gen1 (Reserved)

W_Disable# Function Interface
BodySAR

LED

Tunable antenna

I2C (Reserved)

UART (Reserved)

Software

Protocol Stack

IPV4/IPV6

AT Commands

3GPP TS 27.007 and 27.005

Firmware Update PCIe

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Specification

Other Feature

Multiple carrier Windows update

1) Disabled for FCC cannot certify currently, will enable in future after FCC can certify

2) n77 support HPUE, target power is 25+1/-1dBm

3) NR UL 2.5Gbps is under investigating for future

4) NSA DL 4.45Gbps is under investigating for future

5) LTE UL 225Mbps(CAT20) is under investigating for future

Note: When temperature goes beyond normal operating temperature range of -10°C~+55°C, RF performance of module may be slightly off 3GPP specifications.

2.3 Application Block

The peripheral applications for FM350 module are shown in Figure 2-1:

ANT3(D/G)

ANT2(M2)

ANT1(M1)

ANT0(M)

Module

Power Supply

ON/OFF# RESET#

SIM1

eSIM

PCIe

USB2.0/ USB3.0

EINT

Indicator

Control

SIM Card
Figure2-1 Application Block

Host application

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2.4 Hardware Block Diagram
The hardware block diagram in Figure 2-2 shows the main hardware functions of FM350 module, including base band and RF functions.

Baseband contains the followings: 5G NR/LTE/UMTS controller PMU MCP (NAND+LPDDR4 RAM) Application interface

RF contains the followings: RF Transceiver RF ET Power/PA RF PAMid/Front end RF SW RF Multi-plexer/Filter

M.2 Key-B 75pin interface

+3.3V
FUL_CARD_POWER_OFF#
RESET# PCIe
USB2.0 USB 3.0
USIM1 EINT
WOWWAN# LED I2C
UART ANT_TUNER_1V8
MIPI_RFFE
Tunable ANT

TCXO

PMU

Baseband
(NR/LTE FDD/LTE TDD/UMTS
controller)

DRF MIPI RFFE

eSIM

MCP (NAND+LPDDR4)

RF Transceiver

GNSS Receiver

RF Part

PRX TXA0
PRX2 TXA1 DRX2

PA ET0 DCDC
PA ET1 DCDC

DPDT

LB PAMiD
Multiplexer MB/HB PAMiD

DPDT

SAW/ UHB/XB DRX LNA (4x4 MIMO)

UHB Comp PAMid
UHB Main PAMid

N41 PA
M/HB FEM (4x4 MIMO)

SPDT

SP3T SPDT
DPDT

DRX

SPDT

SAW/ LNA

UHB/XB DRX (4x4 MIMO)

GNSS SAW

GNSS LNA

GNSS Extractor

Figure 2-2 Hardware block diagram

Triplexer

Diplexer Diplexer

Triplexer

ANT0 (M)
ANT1 (M1)
ANT2 (M2)
ANT3 (D/G)

2.5 Antenna Configuration
FM350 module supports four antennas and the configuration is as below table:

Antenna Connector Function Description Band configuration

ANT0(Main) ANT1(M1) ANT2(M2) ANT3(D/G)

Main antenna port for TRX and SRS Antenna port for RX and SRS Antenna port for TRX and SRS Diversity & GNSS ANT and SRS

All supported bands transmit & receive and SRS 4x4 MIMO supported bands receive and SRS Transmit, 4x4 MIMO receive and SRS All supported bands and GNSS receive, SRS

Frequency Rang (MHz)
617~5925
1805~5000
1452~5000
617~5925

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3 Application Interface
3.1 M.2 Interface
The FM350 module applies standard M.2 Key-B interface, with a total of 75 pins.
Pin Map

Figure 3-1 Pin Map Note: Pin "Notch" represents the gap of the gold fingers.

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Pin Definition

The pin definition is as below table:

Pin Pin Name 1 CONFIG_3 2 +3.3V

I/O Reset Value O NC PI -

Pin Description

Level

NC, FM350 M.2 module is configured as the WWAN PCIe Gen3, USB3.1 Gen1 interface type

Power input

Power Supply

3 GND

- -

GND

Power Supply

4 +3.3V

PI -

Power input

Power Supply

5 GND

FULL_CARD_ POWER_OFF#

7 USB D+

- I PU I/O -

GND
Power enable, module power on input, internal pull up(350K) USB data plus

Power Supply 3.3/1.8V 0.3---3V

8 W_DISABLE1# I

WWAN disable, active low

3.3/1.8V

9 USB D10 LED1# 11 GND

I/O OD - -

USB data minus System status LED, output open drain, 3.3V GND

0.3---3V 3.3V Power Supply

12 Notch

Notch

13 Notch

Notch

14 Notch

Notch

15 Notch

Notch

16 Notch

Notch

17 Notch

Notch

18 Notch

Notch

19 Notch 20 GPIO 21 CONFIG_0

I/O O NC

22 UART_TX

O -

23 WOWWAN#

O -

24 ANT_TUNER_1V8 O -

Notch

GPIO. Reserved
GND, FM350 M.2 module is configured as the WWAN PCIe Gen3, USB3.1 Gen1 interface type
UART TXD output, can mux as ANT_TUNER_CFG or GPIO. Reserved

1.8V 1.8V

Wake up host, Reserved

1.8V

1.8V power output for antenna tuner, can mux as GPIO.

1.8V

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Pin Pin Name
25 DPR 26 W_DISABLE2# 27 GND
28 UART_RX
29 USB3.0_TX30 UIM_RESET 31 USB3.0_TX+ 32 UIM_CLK 33 GND 34 UIM_DATA 35 USB3.0_RX36 UIM_PWR 37 USB3.0_RX+ 38 NC 39 GND 40 I2C_SCL 41 PETn0 42 I2C_SDA 43 PETp0 44 I2C_IRQ# 45 GND 46 NC 47 PERn0 48 NC 49 PERp0
50 PERST#

I/O Reset Value

I I - -

O -

- -

I/O

O -

- -

O -

I/O O I - - -

- -

Pin Description Reserved

Level

Dynamic power reduction - Body SAR control signal (SAR_BACK_OFF)

3.3/1.8V

GNSS disable, active low, Reserved

3.3/1.8V

GND
UART RXD input, can mux as DPR2 or GPIO. Reserved
USB3.0 transmit data minus, reserved

Power Supply 1.8V -

SIM reset signal

1.8V/3V

USB3.0 transmit data plus, reserved -

SIM clock Signal

1.8V/3V

GND

Power Supply

SIM data input/output

1.8V/3V

USB3.0 receive data minus, reserved -

SIM power supply, 1.8V/3V

1.8V/3V

USB3.0 receive data plus, reserved

GND

Power Supply

I2C master clock PCIe TX differential signals negative
I2C master data

1.8V 1.8V

PCIe TX differential signals positive

I2C interrupt request

1.8V

GND

Power Supply

PCIe RX differential signals negative

PCIe RX differential signals positive

Asserted to reset module PCIe interface default. If module went into core dump, it 3.3/1.8V will reset whole module, not only PCIe

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Pin Pin Name
51 GND
52 CLKREQ#
53 REFCLKN
54 PEWAKE#
55 REFCLKP 56 RFFE_SCLK 57 GND 58 RFFE_SDATA 59 ANTCTL0 60 COEX3 61 ANTCTL1 62 COEX_RXD 63 ANTCTL2 64 COEX_TXD 65 ANTCTL3

I/O Reset Value - I/O -

O PD

O -

I/O O I/O O I O O O -

Pin Description

Level

interface. Active low, internal pull up(10K)

GND

Power Supply

Asserted by device to request a PCIe reference clock be available (active clock

state) in order to transmit data. It also used by L1 PM Sub states mechanism, asserted by either host or device to

3.3/1.8V

initiate an L1 exit. Active low, open drain output and should add external pull up on platform

PCIe reference clock signal

Negative

Asserted to wake up system and reactivate PCIe link from L2 to L0, it

depends on system whether supports wake up functionality.

3.3/1.8V

Active low, open drain output and should

add external pull up on platform

PCIe reference clock signal Positive

MIPI interface tunable ANT, RFFE clock

1.8V

GND

Power Supply

MIPI interface tunable ANT, RFFE data

1.8V

Tunable ANT CTRL0

1.8V

Wireless coexistence between WWAN and WiFi/BT modules, based on BT-SIG coexistence protocol. COEX_EXT_FTA, Reserved

1.8V

Tunable ANT CTRL1

1.8V

Wireless coexistence between WWAN and WiFi/BT modules, based on BT-SIG coexistence protocol. UART receive signal(WWAN module side), Reserved

1.8V

Tunable ANT CTRL2

1.8V

Wireless coexistence between WWAN and WiFi/BT modules, based on BT-SIG coexistence protocol. UART transmit signal(WWAN module side), Reserved

1.8V

Tunable ANT CTRL3

1.8V

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Pin Pin Name 66 SIM1_DETECT 67 RESET# 68 NC 69 CONFIG_1 70 +3.3V 71 GND 72 +3.3V
73 VIO_CFG
74 +3.3V 75 CONFIG_2

I/O Reset Value I -

- -

O GND

PI - PI -

- NC

PI O NC

Pin Description
SIM1 detect, internal pull up(390K), active high WWAN reset input, active low, internal pull up(350K)
NC
GND, FM350 M.2 module is configured as the WWAN PCIe Gen3, USB3.1 Gen1 interface type
Power input

Level 1.8V 1.8V Power Supply

GND

Power Supply

Power input
Configuration of PCIe sideband signals power domain NC: support 1.8V/3.3V; GND: support 3.3V
Power input
GND, FM350 M.2 module is configured as the WWAN PCIe Gen3, USB3.1 Gen1 interface type

Power Supply Power Supply -

Reset Value: The initial status after module reset, not the status when working. H: High Voltage Level L: Low Voltage Level PD: Pull-Down PU: Pull-Up T: Tristate OD: Open Drain PI: Power Input PO: Power Output

Note: Digital IO pins cannot be connected to power directly. The unused pins can be left floating.

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3.2 Power Supply
The power interface of FM350 module as shown in the following table:

Pin Name I/O

Pin Description

2, 4, 70, 72, 74 +3.3V

UIM_PWR PO

Power supply input USIM power supply

DC Parameter (V)

Minimum Typical

Value

3.135

3.3

1.8V/3V

Maximum Value 4.4
-

The Power rating table is as below table:

Pin Name I/O

Pin Description

2, 4, 70, 72, 74 +3.3V

Power supply input

UIM_PWR PO

USIM power supply

Current Consumption Limit Max Avg(mA) 3500
200

FM350 module uses PCIe interface, according to the PCIe specification, the PCIe Vmain should be used as the +3.3V power source, not the Vaux. The Vaux is the PCIe backup power source and it is not sufficient as the power supply. In addition, the DC/DC power supply other than PCIe ports should not be used as the external power cannot control the module status through the PCIe protocol.

Power Supply
The FM350 module should be powered through the +3.3V pins, and the power supply design is shown in Figure 3-2:

Figure 3-2 Power supply design The filter capacitor design for power supply as shown in the following table:

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Recommended capacitance
220uF x 2
1uF, 100nF 39pF, 33pF 18pF, 10pF, 8.2pF, 6.8pF, 3.9pF

Application

Description

Voltage-stabilizing capacitors
Digital signal noise 700/800, 850/900 MHz frequency band 1500/1800, 2100/2300, 2600MHz, 3500/3600/3700MHz, 5GHz

Reduce power fluctuations of the module in operation, requiring capacitors with low ESR. LDO or DC/DC power supply requires the
capacitor of no less than 440uF The capacitor for battery power supply
can be reduced to 100~200uF Filter out the interference generated from the clock and digital signals
Filter out low frequency band RF interference
Filter out medium/high frequency band RF interference

The stable power supply can ensure the normal operation of FM350 module; and the ripple of the power supply should be less than 300mV in design. Module supports 5G NR Sub-6 download, when module operates with the maximum data transfer throughput, the peak current can reach to upper 3500mA. It requests the power source voltage should not be lower than 3.135V, otherwise module may shut down or restart. The power supply requirement is shown in Figure 3-3:

Burst transmit

Power supply min:3.135V

Ripple300mV Drop VBAT3.135V
Figure 3-3 Power supply requirement

Logic level
The FM350 module 1.8V logic level definition as shown in the following table:

Parameters

Minimum

Typical

Maximum

Unit

1.8V logic level

1.71

1.8

1.89

VIH

1.3

1.8

1.89

VIL

-0.3

0.3

The FM350 module 3.3V logic level definition as shown in the following table:

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Parameters 3.3V logic level VIH VIL

Minimum 3.135 2.3 -0.3

Typical 3.3 3.3 0

Maximum

Unit

3.465

0.3

3.3 Control Signal

The FM350 module provides two control signals for power on/off and reset operations, the pin defined as shown in the following table:

Pin Pin Name

I/O Reset Value Functions

Level

FULL_CARD_POWER _OFF#

67 RESET#

50 PERST# Note

Module power on/off input, internal pull up(350K) Power on: High/Floating Power off: Low

3.3/1.8V

WWAN reset input, active low, internal pull up(350K)

1.8V

Asserted to reset module PCIe interface default. If module went into core dump, it will reset whole module, not only PCIe interface. Active low, internal pull up(10K)

3.3/1.8V

RESET# and PERST# need to be controlled by independent GPIO, and not shared with other

devices on the host.

Module Start-Up
3.3.1.1 Start-up Circuit
The FCPO#( FULL_CARD_POWER_OFF #) pin needs an external 3.3V or 1.8V pull up for booting up. AP (Application Processor) controls the module start-up. The recommended design is using a default PD port to control FCPO#. It also should reserve a 100K pull down resistor on AP side. The circuit design is shown in Figure 3-4:

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Figure 3-4 Circuit for module start-up controlled by AP
3.3.1.2 Start-up Timing Sequence
When power supply is ready, the PMU of module will power on and start initialization process by pulling high FCPO# signal. After about 20s, module will complete initialization process. The start-up timing is shown in Figure 3-5:

tpr +3.3V

FCPO# RESET# PERST# Module State

ton1

ton2

typical 20s

OFF

Initialization

Activation(AT Command Ready)

Figure 3-5 Timing control for start-up

Index Min. Recommended Max.

tpr

0ms -

ton1 20ms 20ms

ton2 50ms 100ms

Comments The delay time of power supply rising from 0V up to 3.3V.If power supply always ready, it can be ignored
RESET# should be de-asserted after FCPO#
The time delay of PERST# de-asserted after FCPO#, PERST# must always be the last to get de-asserted

The minimum detection time of PCIe link is about 23ms after PERST# de-asserted.

Note When USB is used as data transfer interface, follow timing above in PERST# connecting with host, otherwise don't control PERST# in PERST# floating condition.

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Module Shutdown

Module can be shut down by following control:

Shutdown Control Action

Software

Sending AT+CFUN=0 command

Hardware

Pull down FCPO# pin

Condition
Normal shutdown(recommend) Only used when a hardware exception occurs and the software control cannot be used.

Module can be shut down by sending AT+CFUN=0 command. When the module receives the software shutdown command, the module will start the finalization process (the reverse process of initialization), and it will be completed after tsd time (tsd is the time which AP receive OK of "AT+CFUN=0", if there is no response, the max tsd is 5s). In the finalization process, the module will save the network, SIM card and some other parameters from memory, then clear the memory and shut down PMU. The software control timing is shown in Figure 3-6:

+3.3V

tpd

FCPO# RESET# PERST# Module State

AT+CFUN=0 Activation

tsd
Finalization

toff2 toff1
OFF

Index Min.

Figure 3-6 Software control power off timing Recommended Max. Comments

toff1 16ms 20ms

RESET# should be asserted after PERST#

toff2 2ms 10ms

tpd

10ms 100ms

FCPO# should be asserted after RESET#

+3.3V power supply goes down time. If power supply is -
always on, it can be ignored

Module Reset
The FM350 module can reset to its initial status by pulling down the RESET# signal for more than 2ms (10ms is recommended), and module will restart after RESET# signal is released. When customer executes RESET# function, the PMU remains its power inside the module. The recommended circuit design is shown in the Figure 3-7:

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Figure 3-7 Recommended design for reset circuit
There are two reset control timings as below: Reset timing 1st in Figure 3-8, PMU of module internal always on in reset sequence, recommend using in FW upgrade and module recovery; Reset timing 2nd in Figure 3-9, PMU of module internal will be off in reset sequence (including whole power off and power on sequence, tsd can refer section 3.3.2), recommend using in system warm boot.

+3.3V FCPO# RESET# PERST# Module State

toff2

Activation

typical 20s

Baseband reset

Initialization

Figure 3-8 Reset control timing1st

Activation

+3.3V

toff FCPO#

RESET# PERST# Module State

AT+CFUN=0

toff2 toff1

ton1 ton2

tsd

Activation Finalization

OFF

typical 20s
Initialization

Activation

Figure 3-9 Reset control timing2nd

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Index Min. Recommended Max.

toff1 16ms 20ms

toff2 2ms 10ms

toff

500ms 500ms

ton1 20ms 20ms

ton2 50ms 100ms

Comments
RESET# should be asserted after PERST#, refer section 3.3.2 FCPO# should be asserted after RESET#, refer section 3.3.2 Time to allow the WWAN module to fully discharge any residual voltages before the pin could be de-asserted again. This is required for both Pre-OS as well as Runtime flow RESET# should be de-asserted after FCPO#, refer section 3.3.1.2
The time delay of PERST# de-asserted after FCPO#, PERST# must always be the last to get de-asserted, refer section 3.3.1.2

PCIe Link State

Modem has the lowest power consumption in D0 L1.2 PCIe link state, D3cold L2 will increase extra

about power consumption. CLKREQ# can assert or de-assert in D3cold L2, but CLKREQ#

shouldn't be changed again during D3cold L2. When CLKREQ# asserts in D3cold L2, it will

increase extra power consumption compared with CLKREQ# de-asserted in D3cold L2, we

recommend keep CLKREQ# de-asserted in D3cold L2.

Power Consumption

PCIe Link State PERST# CLKREQ#

Description

(mA)

D0 L1.2

Isleep

Refer 3.2.3 Power Consumption

D3cold L2

Isleep Isleep

The extra is consumed on PERST# pull down The extra is consumed on CLKREQ# pull down

3.3.4.1 D0 L1.2
Module supports PCIe goes into D0 L1.2 state in Win10 OS. The D0 L0@S0/S0ix D0 L1.2@S0/S0ixD0 L0@S0/S0ix timing is shown in figure 3-10:

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+3.3V FCPO# RESET# PERST# CLKREQ# Module State

D0 L0@S0/S0ix

D0 L1.2@S0/S0ix

Figure 3-10 D0 L1.2 timing

D0 L0@S0/S0ix

3.3.4.2 D3cold L2
Module supports PCIe goes into D3cold L2 state in Win10 system. In D3cold L2 state, PCIe link can be wakeup by both modem and host. The D0 L0@S0/S0ixD3cold L2@S0/S0ixD0 L0@S0/S0ix timing is shown in Figure 3-11 and Figure 3-12:

+3.3V FCPO# RESET# PERST# CLKREQ# PEWAKE# Module State

Host assert

Host de-assert

D0 L0@S0/S0ix

D3cold L2@S0/S0ix

D0 L0@S0/S0ix

Figure 3-11 D3cold L2 timing (Host wakeup)

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+3.3V FCPO# RESET# PERST# CLKREQ# PEWAKE# Module State

Host assert

Host de-assert

D0 L0@S0/S0ix

Modem assert D3cold L2@S0/S0ix

Modem de-assert D0 L0@S0/S0ix

Figure 3-12 D3cold L2 timing (Modem wakeup)

Timing application
The recommended timing application in Win10 OS is as below table:

System status

Timing Application

S0ix (Modem standby)
S3, S4, S5

D0 L1.2
D3cold L2 Power on (back to S0) Power off (out of S0)

Refer to section 3.3.4.1 Figure 3-10 D0 L1.2 Timing Refer to section 3.3.4.2 Figure 3-11/3-12 D3cold L2 timing Refer to section 3.3.1.2 Figure 3-5 Timing control for start-up
Refer to section 3.3.2 Figure 3-6 Software power off timing

G3 boot

Power on Refer to section 3.3.1.2 Figure 3-5 Timing control for start-up

Warm boot
Modem FW upgrade / Modem recovery

Refer to section 3.3.3 Figure 3-9 Reset timing 2nd Refer to section 3.3.3 Figure 3-8 Reset timing 1st

3.4 PCIe Interface

FM350 module supports PCIe as IPC interface for data transfer. The PCIe supports Gen3, one lane for

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data transmission channel, it is also compatible with PCIe Gen2 and Gen1. BIOS configuration must follow X86 platform BKC (Best Know Configuration) reference design. PCIe interface initialized with host driver, then mapped MBIM & GNSS port in Win10 OS and RMNET & AT port in Chrome/Linux/Android OS. The MBIM and RMNET interfaces are used for data transfer, GNSS port is used for receiving GNSS data, AT port is used for AT command.

PCIe Interface Definition

PCIe interface is defined as below table: Pin# Pin Name I/O Reset Value Description

Level

41 PETn0

O -

PCIe TX Differential signals, negative

43 PETP0

O -

PCIe TX Differential signals, positive

47 PERn0

I -

PCIe RX Differential signals, negative

49 PERP0

I -

53 REFCLKN I -

55 REFCLKP I -

50 PERST# I PU

52 CLKREQ# I/O

54 PEWAKE# O PD

PCIe RX Differential signals, positive

PCIe Reference Clock signal -
Negative

PCIe Reference Clock signal

Positive

Asserted to reset module PCIe interface

default. If module went into coredump, it will reset whole module, not only PCIe interface.

3.3/1.8V

Active low, internal pull up(10K)

Asserted by device to request a PCIe

reference clock be available (active clock

state) in order to transmit data. It also used by

L1 PM Sub states mechanism, asserted by 3.3/1.8V

either host or device to initiate an L1 exit. Active low, open drain output and should add external pull up on platform

Asserted to wake up system and reactivate

PCIe link from L2 to L0, it depends on system

whether supports wake up functionality.

3.3/1.8V

Active low, open drain output and should add

external pull up on platform

PCIe Interface Application
The reference circuit is shown in Figure 3-13:

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M.2 Key-B 75pin Connector

AP side

PERn0 PERP0
PETn0 PETP0

AC Caps

REFCLKN REFCLKP

+3.3V/1.8V

Module side
AC Caps
PETn0(pin41) PETP0(pin43)
PERn0(pin47) PERP0(pin49)
REFCLKN(pin53) REFCLKP(pin55)

PERST# CLKREQ#
WAKE#

100K 10K

PERST#(pin50) CLKREQ#(pin52)
PEWAKE#(pin54)

Figure 3-13 Reference Circuit for PCIe Interface

FM350 module supports PCIe Gen3/one lane, including three difference pairs: transmit pair TXP/N, receiving pair RXP/N and clock pair CLKP/N. PCIe can achieve the maximum transmission rate of 8 GT/s, and must strictly follow the rules below in PCB Layout: The differential signal pair lines shall be parallel and equal in length; The differential signal pair lines shall be short if possible and be controlled within 7 inch(177.8 mm)
for AP end; The impedance of differential pair lines are recommended to be 85. All the impedance of differential
pair should meet PCIe Gen3 protocol requirement of 70100. ; It shall avoid the discontinuous reference ground, such as segment and space; When the differential signal lines go through different layers, the via hole of grounding signal should
be in close to that of signal, and generally, each pair of signals require 1-3 grounding signal via holes and the lines shall never cross the segment of plane; Try to avoid bended lines and avoid introducing common-mode noise in the system, which will influence the signal integrity and EMI of difference pair. As shown in Figure 3-14, the bending angle of all lines should be equal or greater than 135°, the spacing between difference pair lines should be larger than 20mil, and the line caused by bending should be greater than 1.5 times line width at least. When a serpentine line is used for length match with another line, the bended length of each segment shall be at least 3 times the line width ( 3W). The largest spacing between the bended part of the serpentine line and another one of the differential lines must be less than 2 times the spacing of normal differential lines (S1 < 2S);

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3W W
PCIe Difference Pair 1 S S1<2S

1.5W 135°

20mil

PCIe Difference Pair 2
Figure 3-14 Requirement of PCIe line The difference in length of two data lines in difference pair should be within 5mil, and the length match
is required for all parts. When the length match is conducted for the differential lines, the designed position of correct match should be close to that of incorrect match, as shown in Figure 3-15. However, there is no specific requirements for the length match of transmit pair and receiving pair, which means the length match is only required by intra differential pair rather than inter differential pair.
Correct match

Dismatched end

Matched end
Incorrect match

Figure 3-15 Length match design of PCIe difference pair

3.5 USIM Interface

The FM350 module supports dual SIM, one is a built-in eSIM and another is a SIM card interface. The SIM interface supports 1.8V and 3V SIM cards.
USIM Pins

The USIM1 pins description as shown in the following table:

Pin Pin Name

I/O Reset Value Description

Level

36 UIM_PWR

PO -

USIM power supply

1.8V/3V

30 UIM_RESET

O PD

USIM reset

1.8V/3V

32 UIM_CLK

O PD

USIM clock

1.8V/3V

34 UIM_DATA

I/O PD

USIM data, internal pull up(4.7K) 1.8V/3V

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Pin Pin Name 66 SIM_DETECT

I/O Reset Value Description

Level

I PD

USIM card detect, internal 390K pullup. Active high, and high level indicates 1.8V SIM card is inserted; and low level indicates SIM card is detached.

USIM Interface Circuit
3.5.2.1 N.C. SIM Card Slot
The reference circuit design for N.C. (Normally Closed) SIM card slot is shown in Figure 3-16:

Figure 3-16 Reference circuit for N.C. SIM card slot The principles of the N.C.SIM card slot are described as follows: When the SIM card is detached, it connects the short circuit between CD and SW pins, and drives
the SIM_DETECT pin low. When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives the
SIM_DETECT pin high.
3.5.2.2 N.O. SIM Card Slot
The reference circuit design for N.O. (Normally Open) SIM card slot is shown in Figure 3-17:

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Figure 3-17 Reference circuit for N.O. SIM card slot The principles of the N.O.SIM card slot are described as follows: When the SIM card is detached, it connects an open circuit between CD and SW pins, and drives
the SIM_DETECT pin low. When the SIM card is inserted, it connects the short circuit between CD and SW pins, and drives the
SIM_DETECT pin high.

USIM Hot-Plug

The FM350 module supports the SIM card hot-plugging function, which determines whether the SIM card

is inserted or detached by detecting the SIM_DETECT pin state of the SIM card slot.

The SIM card hot-plugging function can be configured by "AT+MSMPD" command, and the description for

AT command as shown in the following table:

AT Command

Hot-plugging Detection

AT+MSMPD=1 Enable

AT+MSMPD=0 Disable

Function Description
Default value, the SIM card hot-plugging detection function is enabled. The module can detect whether the SIM card is inserted or not through the SIM_DETECT pin state. The SIM card hot-plugging detect function is disabled. The module reads the SIM card when starting up, and the SIM_DETECT status will not be detected.

Note: SIM_DETECT is active high, it can be swapped to active low by AT CMD.
USIM Design

The SIM card circuit design should meet the EMC standards and ESD requirements with the improved capability to resist interference, to ensure that the SIM card can work stably. The following guidelines

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should be noted in design: The SIM card slot should be placed as close as possible to the module, and away from the RF antenna,
DC/DC power supply, clock signal lines, and other strong interference sources. The SIM card slot with a metal shielding housing can improve the anti-interference ability. The trace length between the SIM card slot and the module should not exceed 100mm, or it could
reduce the signal quality. The UIM_CLK and UIM_DATA signal lines should be isolated by GND to avoid crosstalk interference.
If it is difficult for the layout, the whole SIM signal lines should be wrapped with GND as a group at least. The filter capacitors and ESD devices for SIM card signals should be placed near to the SIM card slot, and the ESD devices with 22~33pF capacitance should be used.

3.6 Status Indicator

The FM350 module provides two signals to indicate the operating status of the module, and the status indicator pins as shown in the following table:

Pin Pin Name

I/O Reset Value Pin Description

Level

10 LED1#

O T

System status LED, drain output.

3.3V

23 WOWWAN#

Wake up host, Reserved

1.8V

LED#1 Signal

The LED#1 signal is used to indicate the operating status of the module, and the detailed description as shown in the following table:

Module Status

LED1# Signal

RF function ON

Low level (LED On)

RF function OFF

High level (LED Off)

The LED driving circuit is shown in figure 3-18:

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Figure 3-18 LED driving circuit Note: The resistance of LED current-limiting resistor is selected according to the driving voltage and the driving current.

WOWWAN#

The WOWWAN# signal is used to wake the Host (AP) when there comes the data request. The definition of WOWWAN# signal is as follows:

Operating Mode

WOWWAN# Signal

SMS or data requests

Pull low 1s then pull high (pulse signal).

Idle/Sleep

High level

The WOWWAN# timing is shown in Figure 3-19:
WOWWAN#
1S

Status Idle/Sleep

Call/SMS/Data

Figure 3-19 WOWWAN# timing

Idle/Sleep

Note: WOWWAN# is disabled in default, it can be enabled by AT CMD: AT+GTSMSFILTERWUPEN=1

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3.7 Interrupt Control

The FM350 module provides four interrupt signals, and the pin definition is as follows:

Pin Pin Name

I/O

Reset Value

Pin Description

Level

8 W_DISABLE1#

Enable/Disable RF network

3.3/1.8V

25 DPR

26 W_DISABLE2#

Dynamic Power Reduction - Body SAR control signal (SAR_BACK_OFF)
GNSS Disable signal Reserved

3.3/1.8V 3.3/1.8V

W_DISABLE1#

The module provides a hardware pin to enable/disable WWAN RF function, and the function can also be controlled by the AT command. The module enters the Flight mode after the RF function is disabled. The definition of W_DISABLE1# signal is as below table:

W_DISABLE1# signal Function

High/Floating

WWAN function is enabled, the module exits the Flight mode.

Low

WWAN function is disabled, the module enters Flight mode.

Note The function of W_DISABLE1# is enabled by default. It can be disabled by customer's request.

BODYSAR
The FM350 module supports Body SAR function by detecting the DPR pin. The voltage level of DPR is high by default, and when the SAR sensor detects the closing human body, the DPR signal will be pulled down. As the result, the module then lowers down its emission power to its default threshold value, thus reducing the RF radiation on the human body. The threshold of emission power can be set by the AT Commands. The definition of DPR signal as shown in the following table:

DPR signal High/Floating Low

Function The module keeps the default emission power Lower the maximum emission power to the threshold value of the module.

3.8 ANT Tunable Interface

The module supports ANT Tunable interfaces with two different control modes, i.e. MIPI interface and 4bit

GPO interface. Through cooperating with external antenna adapter switch via ANT tunable, it can flexibly

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configure the bands of LTE antenna to improve the antenna's working efficiency and save space for the antenna. Module also support 1.8V output for antenna tuner. The pin definition is as below table:

Pin Pin Name

I/O

24 ANT_TUNER_1V8 O

56 RFFE_SCLK

58 RFFE_SDATA

I/O

59 ANTCTL0

61 ANTCTL1

63 ANTCTL2

65 ANTCTL3

Pin Description

Level

1.8V power output for antenna tuner, can mux as

GPIO.

1.8V

Reserved

Tunable ANT control, MIPI Interface, RFFE clock

1.8V

Tunable ANT control, MIPI Interface, RFFE data

1.8V

Tunable ANT control, GPO interface, Bit0

1.8V

Tunable ANT control, GPO interface, bit1

1.8V

Tunable ANT control, GPO interface, Bit2

1.8V

Tunable ANT control, GPO interface, Bit3

1.8V

3.9 Configuration Interface

The FM350 module provides four pins for the configuration as the WWAN-PCIe, type M.2 module:

Pin Pin Name I/O Reset Value Pin Description

Level

1 CONFIG_3 O -

21 CONFIG_0 O -

69 CONFIG_1 O L

Internally connected to GND

75 CONFIG_2 O -

The M.2 module configuration as the following table:

Config_0 Config_1 Config_2 Config_3

Module Type and

(pin21) (pin69) (pin75) (pin1)

Main Host Interface

GND

WWANPCIe Gen3, USB3.1

Gen1

Please refer to PCI Express M.2 Specification Rev1.2" for more details.

Port Configuration Vendor defined

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4 Radio Frequency
4.1 RF Interface
RF Interface Functionality
The FM350 module supports four RF connectors used for external antenna connection. As the Figure 41 shows, "M" is for Main antenna, used to receive and transmit RF signals, "D/G" is for Diversity antenna, used to receive the diversity RF signals. "M1" and "M2" are used for supporting 4x4 MIMO data transfer.

Figure 4-1 RF connectors

RF Connector Characteristic

Rated Condition Frequency Range Characteristic Impedance

DC~6GHz 50

Environment Condition Temperature Range: 40°C~+85°C

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RF Connector Dimension
FM350 module uses standard M.2 RF connectors. The RF connector part number is 818004607 manufactured by ECT Corporation, and the connector size is 2x2x0.6m. The connector dimension is shown as following picture:
Figure 4-2 RF connector dimensions

Figure 4-3 0.81mm coaxial antenna dimensions

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Figure 4-4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector
RF Connector Assembly
Mate RF connector parallel refer Figure 4-5, do not slant mate with strong force.

Figure 4-5 Mate RF connector
To avoid damage in RF connector unmating, it is recommended using pulling JIG as Figure 4-6, and the pulling JIG must be lifted up vertically to PCB surface (see Figure 4-7 and 4-8).

Figure 4-6 Pulling JIG

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Figure 4-7 Lift up pulling JIG

Figure 4-8 Pulling direction

4.2 Operating Band

The FM350 module operating bands of the antennas are as follows:

Operating Band Description RAT

TX (MHz)

Band 1

2100MHz LTE FDD/WCDMA

1920 - 1980

Band 2

1900MHz LTE FDD/WCDMA

1850 - 1910

Band 3

1800MHz LTE FDD

1710 - 1785

Band 4

1700MHz LTE FDD/WCDMA

1710 - 1755

Band 5

850MHz

LTE FDD/WCDMA

824 - 849

RX (MHz) 2110 - 2170 1930 - 1990 1805 - 1880 2110 - 2155 869 - 894

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Operating Band Description RAT

TX (MHz)

RX (MHz)

Band 7

2600Mhz

LTE FDD

2500 - 2570

2620 - 2690

Band 8

900MHz

LTE FDD/WCDMA

880 - 915

925 - 960

Band 12

700MHz

LTE FDD

699 - 716

729 - 746

Band 13

700MHz

LTE FDD

777 - 787

746 - 756

Band 14

700MHz

LTE FDD

788 - 798

758 - 768

Band 17

700MHz

LTE FDD

704 - 716

734 - 746

Band 18

800MHz

LTE FDD

815 - 830

860 - 875

Band 19

850MHz

LTE FDD

830 - 845

875 - 890

Band 20

800MHz

LTE FDD

832 - 862

791 - 821

Band 25

1900MHz LTE FDD

1850 - 1915

1930 - 1995

Band 26

850MHz

LTE FDD

814 - 849

859 - 894

Band 28

700MHz

LTE FDD

703 - 748

758 - 803

Band 29

700MHz

LTE FDD

N/A

717 - 728

Band 30

2300MHz LTE FDD

2305 - 2315

2350 - 2360

Band 32

1500MHz LTE FDD

N/A

1452 - 1496

Band 34

2000MHz LTE TDD

2010 -2025

Band 38

2600MHz LTE TDD

2570 - 2620

Band 39

1900MHZ LTE TDD

1880 - 1920

Band 40

2300MHz LTE TDD

2300 - 2400

Band 41

2500MHz LTE TDD

2496 - 2690

Band 42

3500MHZ LTE TDD

3400 - 3600

Band 43

3700MHz LTE TDD

3600 - 3800

Band 46

5200MHZ LTE TDD

N/A

5150 - 5925

Band 48

3600MHz LTE TDD

3550 3700

Band 66

1700MHz LTE FDD

1710 - 1780

2110 - 2200

Band 71

600MHz

LTE FDD

663 -698

617 - 652

2100MHz NR FDD

1900MHz

NR FDD

1800MHz

NR FDD

1920 - 1980 1850 - 1910 1710 - 1785

2110 - 2170 1930 - 1990 1805 - 1880

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Operating Band Description

850MHz

2600Mhz

900MHz

n20

800MHz

RAT NR FDD NR FDD NR FDD NR FDD

n25

1900MHz NR FDD

n28

700MHz

NR FDD

n30

2300MHz NR FDD

n38

2600MHz

NR TDD

n40

2300MHz

NR TDD

n41

2500MHz

NR TDD

n48

3500MHz

NR TDD

n66

1700MHz

NR FDD

n71

600MHz

NR FDD

n77

NR TDD

n78

NR TDD

n79

NR TDD

GPS L1

GLONASS G1 -

Galileo E1

BDS B1

TX (MHz)

RX (MHz)

824 - 849

869 - 894

2500 - 2570

2620 - 2690

880 - 915

925 - 960

832 - 862

791 - 821

1850 - 1915

1930 - 1995

703 - 748

758 - 803

2305 - 2315

2350 - 2360

2570 - 2620

2300 - 2400

2496 - 2690

3550 - 3700

1710 - 1780

2110 - 2200

663 - 698

617 - 652

3300 - 4200

3300 - 3800

4400 - 5000

1575.42±1.023

1602.5625±4

1575.42±2.046

1561.098±2.046

4.3 Transmitting Power

The transmitting power for each band of the FM350 module as shown in the following table:

RAT

Band

3GPP Requirement(dBm) Tx Power(dBm) Note

Band 1 24+1.7/-3.7

23.5±1

Band 2 24+1.7/-3.7

23.5±1

WCDMA Band 4 24+1.7/-3.7

23.5±1

Band 5 24+1.7/-3.7

23.5+1/-1

Band 8 24+1.7/-3.7

23.5+1/-1

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RAT

Band

3GPP Requirement(dBm) Tx Power(dBm) Note

Band 1 23±2.7

23±1

10MHz Bandwidth, 1 RB

Band 2 23±2.7

23±1

10MHz Bandwidth, 1 RB

Band 3 23±2.7

23±1

10MHz Bandwidth, 1 RB

Band 4 23±2.7

23±1

10MHz Bandwidth, 1 RB

Band 5 23±2.7

23+2/-1

10MHz Bandwidth, 1 RB

Band 7 23±2.7

23±1

10MHz Bandwidth, 1 RB

Band 8 23±2.7

23+2/-1

10MHz Bandwidth, 1 RB

Band 12 23±2.7

23+2/-1

10MHz Bandwidth, 1 RB

Band 13 23±2.7

23+2/-1

10MHz Bandwidth, 1 RB

Band 14 23±2.7

23+2/-1

10MHz Bandwidth, 1 RB

Band 17 23±2.7

23+2/-1

10MHz Bandwidth, 1 RB

Band 18 23±2.7

23+2/-1

10MHz Bandwidth, 1 RB

Band 19 23±2.7

23+2/-1

10MHz Bandwidth, 1 RB

Band 20 23±2.7 LTE
Band 25 23±2.7

23+2/-1 23±1

10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB

Band 26 23±2.7

23+2/-1

10MHz Bandwidth, 1 RB

Band 28 23+2.7/-3.2

23+2/-1

10MHz Bandwidth, 1 RB

Band 30 23±2.7

22±1

10MHz Bandwidth, 1 RB

Band 34 23±2.7

23±1

10MHz Bandwidth, 1 RB

Band 38 23±2.7

23±1

10MHz Bandwidth, 1 RB

Band 39 23±2.7

23±1

10MHz Bandwidth, 1 RB

Band 40 23±2.7

23±1

10MHz Bandwidth, 1 RB

Band 41 26±2

26+1/-1

10MHz Bandwidth, 1 RB

Band 42 23+3/-4

23±1

10MHz Bandwidth, 1 RB

Band 43 23+3/-4

23±1

10MHz Bandwidth, 1 RB

Band 48 23+2.7/-3.7*

21±1

10MHz Bandwidth, 1 RB

Band 66 23±2.7

23±1

10MHz Bandwidth, 1 RB

Band 71 23±2.7

23+2/-1

10MHz Bandwidth, 1 RB

23±2.7

23±1

15MHz BW, Inner RB

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RAT

Band n2 n3 n5 n7 n8 n20 n25 n28 n30 n38 n40 n41 n48 n66 n71 n77 n78 n79

3GPP Requirement(dBm) Tx Power(dBm) Note

23±2.7

23±1

15MHz BW, Inner RB

23±2.7

23±1

15MHz BW, Inner RB

23±2.7

23+2/-1

15MHz BW, Inner RB

23±2.7

23±1

15MHz BW, Inner RB

23±2.7

23+2/-1

15MHz BW, Inner RB

23±2.7

23+2/-1

15MHz BW, Inner RB

23±2.7

23±1

15MHz BW, Inner RB

23±2.7

23+2/-1

15MHz BW, Inner RB

22±1

23±2.7

23±1

15MHz BW, Inner RB

23±2.7

23±1

15MHz BW, Inner RB

26+2.7/-3.7

26±1

60MHz BW, Inner RB

23+2.7/-3.7*

21±1

23±2.7

23±1

20MHz BW, Inner RB

23±2.7

23+2/-1

10MHz BW, Inner RB

23±2.7

25+2/-1

50MHz BW, Inner RB

26+3/-4

26±1

50MHz BW, Inner RB

26+3/-4

26±1

60MHz BW, Inner RB

4.4 Antenna Design
The FM350 module provides four antenna interfaces, and the antenna design requirements is shown in the following table:

FM350 module Main antenna requirements

Frequency range Bandwidth(WCDMA) Bandwidth(LTE)

The most proper antenna to adapt the frequencies should be used.

WCDMA band 1(2100): WCDMA band 2(1900): WCDMA band 4(1700): WCDMA band 5(850): WCDMA band 8(900):

250MHz 140MHz 445MHz 70MHz 80MHz

LTE band 1(2100): 250MHz

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FM350 module Main antenna requirements

LTE band 2(1900): 140MHz LTE Band 3(1800): 170MHz LTE band 4(1700): 445MHz LTE band 5(850): 70MHz LTE band 7(2600): 190MHz LTE Band 8(900): 80MHz LTE band 12(700): 47MHz LTE band 13(700): 41MHz LTE band 14(700): 40MHz LTE band 17(700): 42MHz LTE band 18(800): 80MHz LTE band 19(850) : 80MHz LTE band 20(800): 71MHz LTE band 25(1900): 145MHz LTE band 26(850): 80MHz LTE band 28(700): 100MHz LTE band 29(700): 11MHz LTE band 30(2300): 55MHz LTE band 32(1500): 44MHz LTE band 34(2000): 15MHz LTE band 38(2600): 50MHz LTE band 39(1900): 40MHz LTE band 40(2300): 100MHz LTE band 41(2500): 110MHz LTE band 42(3500): 200MHz LTE band 43(3700): 200MHz LTE band 46(5500): 775MHz LTE band 48(3600): 150MHz LTE band 66(1700): 490MHz LTE band 71(600): 81MHz

n1(2100): 250MHz

n2(1900): 140MHz

n3(1800): 170MHz

n5(850): 70MHz

n7(2600): 190MHz

n8(900): 80MHz

n20(800): 71MHz

n25(1900): 145MHz n30(2300): 55MHz

n28(700): 100MHz

n38(2600): 50MHz

n40(2300): 100MHz

n41(2500): 110MHz

n66(1700): 490MHz

n71(600): 35MHz

n77(3750): 900MHz

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FM350 module Main antenna requirements

Bandwidth(GNSS)

n78(3500): 500MHz n79(5500): 600MHz
GPS: 2MHz GLONASS: 8MHz Galileo: 8MHz BDS: 4MHz

Impedance
Input power Recommended standing-wave ratio (SWR)

50 > 28dBm average power WCDMA & LTE & NR 2:1

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5 ESD Characteristics

The module is generally not protected against Electrostatic Discharge (ESD). ESD handling precautions

that apply to ESD sensitive components should be strictly followed. Proper ESD handling procedures

must be applied throughout the processing, handling, assembly and operation of any application with

module. The ESD characteristics are shown in the following table (Temperature: 25°C, Relative Humidity:

40%).

Interface

Contact Discharge

Air Discharge

GND Antenna Interface Golden Finger

±8 kV ±8 kV ±2 kV

±15 kV NA NA

Note ESD performance is based on EVB-M2 development board.

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6 Structure Specification
6.1 Product Appearance
The product appearance for FM350 module is shown in Figure 6-1:
Figure 6-1 Module appearance
6.2 Dimension of Structure
The structural dimension of the FM350 module is shown in Figure 6-2:

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Figure 6-2 Dimension of structure (unit: mm)
6.3 M.2 Interface Model
The FM350 M.2 module adopts 75-pin gold finger as external interface, where 67 pins are signal pins and 8 pins are notch pins as shown in Figure 3-1. For module dimension, please refer to Figure 6-2 Dimension of Structure. Based on the M.2 interface definition, FM350 module adopts Type 3052-S3-B interface (30x52mm, the component maximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B).

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Figure 6-3 M.2 interface model
6.4 M.2 Connector
FM350 module connects with host by M.2 connector which is built in host. The recommended part number is APCI0026-P001A manufactured by LOTES Corporation, and the dimensions is shown in Figure 6-4. The package of connector, please refer to the specification.

Figure 6-4 M.2 Dimension of structure

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6.5 Storage
Storage Life
Storage Conditions (recommended): Temperature is 23 ± 5 , relative humidity is less than RH 60%. Storage period: Under the recommended storage conditions, the storage life is 12 months.
6.6 Packing
The FM350 module uses the tray sealed packing, combined with the outer packing method using the hard cartoon box, so that the storage, transportation and the usage of modules can be protected to the greatest extent.
Note The module is a precision electronic product, and may suffer permanent damage if no correct electrostatic protection measures are taken.
Tray Package
The FM350 module uses tray package, 20 pcs are packed in each tray, with 5 trays including one empty tray on top in each box and 5 boxes in each case. Tray packaging process is shown in Figure 6-5:

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Figure 6-5 Tray packaging process

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Tray size
The pallet size is 330x170x6.5mm, and is shown in Figure 6-6:
Figure 6-6 Tray size (Unit: mm)

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7 CE Conformance information
The device could be used with a separation distance of 20cm to the human body.
Hereby, [Fibocom Wireless Inc.] declares that the radio equipment type [FM350-GL] is in compliance with Directive 2014/53/EU.

8 FCC Conformance information
Important Notice to OEM integrators
1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.
Important Note
notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Fibocom Wireless Inc. that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application.

End Product Labeling
When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a

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second label must be placed on the outside of the final device that contains the following text: "Contains FCC ID:ZMOFM350GL" "Contains IC: 21374-FM350GL " The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met.
Antenna Installation
(1) The antenna must be installed such that 20 cm is maintained between the antenna and users, (2) The transmitter module may not be co-located with any other transmitter or antenna. (3) Only antennas of the same type and with equal or less gains as shown below may be used with this module. Other types of antennas and/or higher gain antennas may require additional authorization for operation.

Antenna Type PIFA

Bands WCDMA B2 WCDMA B4 WCDMA B5
LTE B2 LTE B4 LTE B5 LTE B7 LTE B12 LTE B13 LTE B14 LTE B17 LTE B25 LTE B26 LTE B30 LTE B38

Peak Gain 4 3 3 4 3 3 4 3 3 3 3 4 3 1 4

Antenna Type PIFA

Bands LTE B41 LTE B48 LTE B66 LTE B71 5G NR n2 5G NR n5 5G NR n7 5G NR n25 5G NR n30 5G NR n38 5G NR n41 5G NR n66 5G NR n71 5G NR n77 5G NR n78

Peak Gain 4 1 3 3 4 3 4 4 1 4 4 3 3 3 3

In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.

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Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user's manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

List of applicable FCC rules
This module has been tested and found to comply with part 22, part 24, part 27, part 90,part 96, part 15B requirements for Modular Approval. The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also

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contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
This device is intended only for OEM integrators under the following conditions: (For module device use)
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.
9 ISED Conformance information
Industry Canada Statement
This device complies with Industry Canada's licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement."

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Radiation Exposure Statement
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.

Déclaration d'exposition aux radiations:
Cet équipement est conforme aux limites d'exposition aux rayonnements ISED établies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps.

This device is intended only for OEM integrators under the following conditions: (For module device use)
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module)
1) L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et les utilisateurs, et 2) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.

Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité supplémentaires requis pour ce module installé.

IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate Canada authorization.

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NOTE IMPORTANTE:
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: "Contains IC:21374-FM350GL".
Plaque signalétique du produit final
Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l'antenne peut être installée de telle sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les utilisateurs. Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC: 21374-FM350GL".
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user's manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
Manuel d'information à l'utilisateur final
L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué dans ce manuel.

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