Wireless Integrity Sensing Platform (WISP)-EVAL To improve avionic asset availability, ADI developed a passive wireless integrity sensing platform (WISP). WISPs are postage stamp-sized crack sensors that use carbon nanotube technology. These sensors can be placed in difficult to access locations on aircraft where cracks are likely to occur (so-called hot spots). The passive sensor status is read wirelessly over an ultra low power Bluetooth® connection by a securely paired handheld reader that also provides wireless power to the sensor. With no batteries and no wires, WISPs are ready to be installed on new or aging structures. The first sensor to be integrated with WISP nodes is a carbon nanotube crack gauge, which can provide unprecedented accurate sub-millimeter fatigue crack measurements, even in harsh operating and environmental conditions. Other structural health monitoring (SHM) sensors are also in development. These sensors have well-understood physics, and, when coupled with WISP nodes, they offer a remote inspection alternative for many applications. More generally, WISP architecture will help enable condition-based maintenance for a more efficient approach to sustainment. FCS#001=0.00 mm FCS#002=0.00 mm FCS#003=0.00 mm FCS#004=0.00 mm Port Aft Fore Starboard For more information, contact CNT_Marketing_Support@analog.com Fatigue Crack Check Key Features Easy installation: no rewiring or redesign of aircraft needed--can apply immediately to hot spots No power necessary: sensor records via permanent physical changes Carbon nanotube (CNT) polymer nanocomposite for smart, multifunctional sensing material No cables, connectors, or batteries needed for data acquisition Internet of Things (IoT) RFID-like operation FCS#005=0.05 mm FCS#006=0.00 mm FCS#007=0.55 mm FCS#008=0.00 mm VISIT ANALOG.COM CNT Sensing Element ADC Complete Signal Chain for Structural Health Monitoring WISP Sensor Node RF Energy Transfer WISP Reader and RF Energy Exciter M4 Core + BLE Transceiver PMU and Load Switch RF to DC and Energy Storage Impedance Matching Antenna VCO PA RF Exciter Module iOS/Android Phone/Tablet System Components Assembled WISP-Sensing Element on Flex Exciter WISP Sensing Element on Flex Specifications Crack sensing element: Thickness: ~200 micron Mass: ~10 mg/cm2 Bend radius: ~5 mm Size: 25.4 mm × 25.4 mm Crack length accuracy 0.1 mm to 10 mm: 0.1 mm PoD 90% with 95% confidence level: 1 mm Crack length sensitivity: 0.1 mm BLE transmit power: 20 dBm to +2 dBm BLE data link frequency: 2.4 GHz Platform form factor: 24 mm × 30 mm × 6 mm RF exciter frequency: 5.8 GHz Operating temperature range: 10°C to +65°C Range of operation: 0.5 m to 1 m Engage with the ADI technology experts in our online support community. Ask your tough design questions, browse FAQs, or join a conversation. Circuits from the Lab reference designs are built and tested by ADI engineers with comprehensive documentation and factory-tested evaluation hardware. Visit ez.analog.com For more information, contact CNT_Marketing_Support@analog.com For regional headquarters, sales, and distributors or to contact customer service and technical support, visit analog.com/contact. Ask our ADI technology experts tough questions, browse FAQs, or join a conversation at the EngineerZone Online Support Community. Visit ez.analog.com. ©2020 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. BR22421-11/20(B) Visit analog.com/cftl VISIT ANALOG.COMAdobe PDF Library 15.0