Telit ME910G1 Data Terminal Module Datasheet
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ME910G1 HW Design Guide
User Manual
Telit Communications S.p.A. ME910G1W1 Data Terminal Module RI7ME910G1W1 RI7ME910G1W1 me910g1w1
Extracted Text
ME910G1
HW Design Guide
1VV0301593 Rev. 7 � 2021-02-02
Telit Technical Documentation
ME910G1 HW Design Guide
APPLICABILITY TABLE
ME910G1-W1 ME910G1-WW ME910G1-WWV
PRODUCTS
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CONTENTS
APPLICABILITY TABLE
CONTENTS
1.
INTRODUCTION
Scope
Audience
Contact Information, Support
Symbol Convention
Related Documents
2.
GENERAL PRODUCT DESCRIPTION
Overview
Product Variants and Frequency Bands
Target Market
Main features
TX Output Power
ME910G1-W1
ME910G1-WW and ME910G1-WWV
RX Sensitivity
ME910G1-W1
ME910G1-WW and ME910G1-WWV
Mechanical Specifications
Dimensions
Weight
Temperature Range
3.
PINS ALLOCATION
Pin-out
LGA Pads Layout
4.
POWER SUPPLY
Power Supply Requirements
Power Consumption
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3
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Idle mode ME910G1-W1 Connected Mode ME910G1-WW and ME910G1-WWV Connected Mode General Design Rules Electrical Design Guidelines of the power supply
+5V Source Power Supply Design Guidelines +12V Source Power Supply Design Guidelines Battery Source Power Supply Design Guidelines Thermal Design Guidelines Power Supply PCB layout Guidelines VAUX Power Output RTC Supply
5.
DIGITAL SECTION
Logic Levels
Power On
Power Off
Wake from deep sleep mode
Unconditional Shutdown
Fast shut down
Fast Shut Down by Hardware
Fast Shut Down by Software
Communication ports
USB 2.0 HS
SPI
SPI Connections
Serial Ports
Modem serial port 1 (USIF0)
Modem serial port 2 (USIF1)
RS232 level translation
General purpose I/O
Using a GPIO as INPUT
Using a GPIO as OUTPUT
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Indication of network service availability External SIM Holder ADC Converter
6.
RF SECTION
Antenna requirements
PCB Design guidelines
PCB Guidelines in case of FCC Certification
Transmission line design
Transmission Line Measurements
Antenna Installation Guidelines
7.
AUDIO SECTION
Electrical Characteristics
8.
GNSS SECTION
GNSS Signals Pin-out
RF Front End Design
Guidelines of PCB line for GNSS Antenna
Hardware-based solution for GNSS and LTE coexistence
GNSS Antenna Requirements
GNSS Antenna specification
GNSS Antenna � Installation Guidelines
Powering the External LNA (active antenna)
GNSS Characteristics
9.
MECHANICAL DESIGN
Drawing
10.
APPLICATION PCB DESIGN
Recommended footprint for the application
PCB pad design
Recommendations for PCB pad dimensions
Thermal performance
Stencil
Solder paste
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Solder Reflow
75
Inspection
76
11.
PACKAGING
77
Tray
77
Reel
79
Carrier Tape detail
79
Reel detail
80
Packaging detail
81
Moisture sensitivity
81
12.
CONFORMITY ASSESSMENT ISSUES
82
Approvals summary
82
RED approval
82
RED Declaration of Conformity
82
Antennas
82
FCC and ISED approval/FCC et ISDE approbation
83
FCC certificates
83
ISED Certificate/ISDE certificates
83
Applicable FCC and ISED rules/Liste des r�gles FCC et ISDE
applicables
83
FCC and ISED Regulatory notices/Avis r�glementaires de FCC et
ISDE
84
Antennas/Antennes
85
FCC label and compliance information
87
ISED label and compliance information/ �tiquette et informations
de conformit� ISDE
88
Information on test modes and additional testing requirements /
Informations sur les modes de test et les exigences de test
suppl�mentaires
88
FCC Additional testing, Part 15 Subpart B disclaimer
89
ANATEL Regulatory Notices
89
NCC Regulatory Notices
90
13.
PRODUCT AND SAFETY INFORMATION
Copyrights and Other Notices
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Copyrights
91
Computer Software Copyrights
91
Usage and Disclosure Restrictions
92
License Agreements
92
Copyrighted Materials
92
High Risk Materials
92
Trademarks
93
3rd Party Rights
93
Waiwer of Liability
93
Safety Recommendations
94
14.
GLOSSARY
95
15.
DOCUMENT HISTORY
96
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1. INTRODUCTION
Scope
Scope of this document is to give a description of some hardware solutions useful for developing a product with the Telit ME910G1 module.
Audience
This document is intended for Telit customers, in particular system integrators, who are going to implement their applications using our ME910G1 modules.
Contact Information, Support
For general contact, technical support services, technical questions and report documentation errors contact Telit Technical Support at:
� TS-EMEA@telit.com � TS-AMERICAS@telit.com � TS-APAC@telit.com Alternatively, use: http://www.telit.com/support For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit: http://www.telit.com Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Telit appreciates feedback from the users on our information.
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Symbol Convention
Danger: This information MUST be followed, or catastrophic equipment failure or personal injury may occur.
Warning: Alerts the user on important steps about the module integration.
Note/Tip: Provides advice and suggestions that may be useful when integrating the module.
Electro-static Discharge: Notifies the user to take proper grounding precautions before handling the product.
Table 1: Symbol Conventions
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
Related Documents
� 80000NT10001A - SIM INTEGRATION DESIGN GUIDES Application Note � 80000NT10060A - xE910 Global Form Factor Application Note � 80000NT10002A - ANTENNA DETECTION � 80000NT10003A - Rework procedure for BGA modules � 80000NT10028A - Event Monitor Application Note
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2. GENERAL PRODUCT DESCRIPTION
Overview
The ME910G1 module is a CATM/ NBIoT communication product which allows integrators to plan on availability for even the longest lifecycle applications, highly recommended for new designs specified for worldwide coverage. The ME910G1-WWV product is fully voice capable, the digital audio interface make it suitable for applications such as voice enabled alarm panels, mHealth patient monitors and specialty phones such as those for the elderly or sensory-impaired. The ME910G1 operates with 1.8 V GPIOs, minimizing power consumption and making it even more ideal for application with battery powered and wearable device.
Product Variants and Frequency Bands
Product
2G Band (MHz)
LTE CATM1
NBIoT
CS Voice VoLTE
Region
ME910G1-W1
-
B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B27, B28, B66, B85
B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B28, B66, B71, B85, B86*
N
Worldwide
ME910G1-WW
850, 900, 1800, 1900
B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B27, B28, B66, B85
B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B28, B66, B71, B85
N
Worldwide
ME910G1-WWV
850, 900, 1800, 1900
B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B27, B28, B66, B85
Table 2: Product Variants and Frequency Bands
-
Y
Worldwide
* See note below
Refer to "RF Section" for details information about frequencies and bands.
Note: Cellular technologies and frequency bands that are enabled may vary based on firmware version and firmware configuration used.
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Note: "B86" is not a 3GPP band, it means the following: UL range: 787-788 MHz, DL range: 757-758 MHz that is available only in module where AT#BNDOPTIONS command contains the string B86. i.e. AT#BNDOPTIONS? #BNDOPTIONS: 1,2,3,4,5,8,12,13,18,19,20,25,26,27,28,66,71,85,86
Target Market
ME910G1 can be used for telematics applications where tamper-resistance, confidentiality, integrity, and authenticity of end-user information are required, for example:
� Telematics services � Road pricing � Pay-as-you-drive insurance � Stolen vehicles tracking � Internet connectivity
Main features
Function
Features
Modem
� CATM and NBIoT technologies � SMS support (text and PDU) � Alarm management � Real Time Clock
Interfaces
� USB 2.0 HS (AT command1 , FW upgrade and module diagnostic) � USIF0 Main UART (AT command1 and FW upgrade) � USIF1 Auxiliary UART (AT Command1, AppZone diagnostic)
� 10 GPIOs
� Antenna port
Table 3: Functional features
1 Functionality depending on ports configuration
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TX Output Power
ME910G1-W1
Band
Mode
B1, B2, B3, B4, B5, B8, B12, B13, B14, B18, B19, B20, B25, B26, B27, B28, B66, B85
B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B28, B66, B71, B85, B86
Table 4: Transmission Output power
(LTE) CAT-M1 (LTE) CAT-NB2
3GPP Class 5 5
RF power (dBm) Nominal* 21
21
ME910G1-WW and ME910G1-WWV
Band
Mode
Class
RF power (dBm) Nominal*
850/900MHz
GSM/GPRS
4
32.5
EGPRS
E2
27
1800/1900MHz
GSM/GPRS
1
29.5
EGPRS
E2
26
B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B27, B28, B66, B85
(LTE) CAT-M1
3
23
B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B28, B66, B85
(LTE) CAT-NB2
3
23
B71
(LTE) CAT-NB2
5
21
Table 5: Transmission Output power ME910G1-WW and ME910G1-WWV
* Max output power tolerance range according to 3GPP TS 36.521-1 and 3GPP TS 51.010-1 or better
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RX Sensitivity
ME910G1-W1
Band
CATM1 / Band1 CAT M1 / Band2 CAT M1 / Band3 CAT M1 / Band4 CAT M1 / Band5 CAT M1 / Band8 CAT M1 / Band12 CAT M1 / Band13 CAT M1 / Band18 CAT M1 / Band19 CAT M1 / Band20 CAT M1 / Band25 CAT M1 / Band26 CAT M1 / Band27 CAT M1 / Band28 CAT M1 / Band66 CAT M1 / Band85 CAT NB2 / Band1 CAT NB2 / Band2 CAT NB2 / Band3 CAT NB2 / Band4 CAT NB2 / Band5 CAT NB2 / Band8 CAT NB2 / Band12 CAT NB2 / Band13 CAT NB2 / Band18 CAT NB2 / Band19
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REFsens (dBm) Typical -107.6 -108.0 -107.6 -107.8 -107.9 -107.8 -107.8 -108.0 -108.0 -108.0 -107.8 -108.0 -108.0 -108.0 -107.9 -107.8 -107.6 -116.8 -116.8 -116.8 -116.7 -116.7 -116.4 -116.8 -116.8 -116.8 -116.8
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REFsens (dBm)* 3GPP limit -102.7 -100.3 -99.3 -102.3 -100.8 -99.8 -99.3 -99.3 -102.3 -102.3 -99.8 -100.3 -100.8 -100.8 -108.2 -108.2 -108.2 -108.2 -108.2 -108.2 -108.2 -108.2 -108.2
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Band
REFsens (dBm) Typical
CAT NB2 / Band20
-116.6
CAT NB2 / Band25
-116.8
CAT NB2 / Band26
-116.8
CAT NB2 / Band28
-116.9
CAT NB2 / Band66
-116.6
CAT NB2 / Band71
-115.4
CAT NB2 / Band85
Table 6: RX Sensitivity ME910G1-W1
-116.8
* 3GPP TS 36.521-1 Release 15 Minimum performance requirement
REFsens (dBm)* 3GPP limit -108.2 -108.2 -108.2 -108.2 -
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ME910G1-WW and ME910G1-WWV
Band
CATM1 / Band1 CAT M1 / Band2 CAT M1 / Band3 CAT M1 / Band4 CAT M1 / Band5 CAT M1 / Band8 CAT M1 / Band12 CAT M1 / Band13 CAT M1 / Band18 CAT M1 / Band19 CAT M1 / Band20 CAT M1 / Band25 CAT M1 / Band26 CAT M1 / Band27 CAT M1 / Band28 CAT M1 / Band66 CAT M1 / Band85 CAT NB2 / Band1 CAT NB2 / Band2 CAT NB2 / Band3 CAT NB2 / Band4 CAT NB2 / Band5 CAT NB2 / Band8 CAT NB2 / Band12 CAT NB2 / Band13 CAT NB2 / Band18 CAT NB2 / Band19 CAT NB2 / Band20 CAT NB2 / Band25
REFsens (dBm) Typical -106.3 -107.3 -106.6 -106.7 -107.1 -107.3 -106.5 -107.9 -107.6 -106.8 -107.4 -107.0 -107.0 -107.4 -107.8 -106.7 -105.3 -115.4 -116.2 -116.4 -115.6 -116.5 -115.9 -116.6 -116.8 -116.6 -116.4 -116.0 -116.2
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3GPP REFsens (dBm)* 3GPP limit -102.7 -100.3 -99.3 -102.3 -100.8 -99.8 -99.3 -99.3 -102.3 -102.3 -99.8 -100.3 -100.8 -100.8 -108.2 -108.2 -108.2 -108.2 -108.2 -108.2 -108.2 -108.2 -108.2 -108.2 -
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Band
REFsens (dBm) Typical
CAT NB2 / Band26
-116.1
CAT NB2 / Band28
-116.8
CAT NB2 / Band66
-115.6
CAT NB2 / Band71
-113.7
CAT NB2 / Band85
-116.0
Table 7: RX Sensitivity ME910G1-WW and ME910G1-WWV
* 3GPP TS 36.521-1 Release 15 Minimum performance requirement
3GPP REFsens (dBm)* 3GPP limit -108.2 -108.2 -108.2 -
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Mechanical Specifications
Dimensions
The overall dimensions of ME910G1-W1, ME910G1-WW and ME910G1-WWV are: � Length: 28.2 mm � Width: 28.2 mm � Thickness: 2.4 mm
Weight
The nominal weight of the ME910G1-W1 is 3.5 gr. The nominal weight of the ME910G1-WW and ME910G1-WW is 4 gr.
Temperature Range
Temperature Range
Operating Temperature Range
�40�C to +85�C
Storage Temperature Range
Table 8: Temperature Range
�40�C to +105�C
Note
The module is fully functional (*) and compliant according to regulatory standards.
The module is not powered and not connected to power supply
Note: (*) Functional: if applicable, the module is able to make and receive voice calls, data calls, send and receive SMS and data traffic.
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3. PINS ALLOCATION
Pin-out
Pin
Signal
I/O
Function
Type
USB HS 2.0 COMMUNICATION PORT (FW upgrade and Data)
B15 USB_D+
I/O USB differential Data (+)
C15 USB_D-
I/O USB differential Data (-)
A13 VUSB
I
Enable pin for the internal USB transceiver.
5 / 3V
Asynchronous Serial Port (USIF0) (FW upgrade and Data with Flow Control)
N15 C103/TXD
I Serial data input from DTE
CMOS 1.8V
M15 C104/RXD
O Serial data output to DTE
CMOS 1.8V
M14 C108/DTR
I Input for (DTR) from DTE
CMOS 1.8V
L14 C105/RTS
I
Input for Request to send signal (RTS) from DTE
CMOS 1.8V
P15 C106/CTS
O
Output for Clear to Send signal (CTS) to DTE
CMOS 1.8V
N14 C109/DCD
O Output for (DCD) to DTE
CMOS 1.8V
P14 C107/DSR
O Output for (DSR) to DTE
CMOS 1.8V
R14 C125/RING
O Output for Ring (RI) to DTE
CMOS 1.8V
SIM Card Interface
A6 SIMCLK
O External SIM signal � Clock
1.8V
A7 SIMRST
O External SIM signal � Reset
1.8V
A5 SIMIO
I/O External SIM signal � Data I/O
1.8V
A4 SIMIN
I
External SIM signal � Presence (active low)
CMOS 1.8
A3 SIMVCC
-
External SIM signal � Power supply for the SIM
1.8V
Digital Voice Interface (DVI)
B9 DVI_WA0
I/O Digital Audio Interface (WA0)
1.8V
Comment Internal PD (100K) internal PU (100k) internal PU (100k) internal PU (100k)
Internal PU (470K)
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Pin
Signal
B6 DVI_RX
B7 DVI_TX
B8 DVI_CLK
SPI
D15 SPI_MOSI
E15 SPI_MISO
F15 SPI_CLK
H14 SPI_CS DIGITAL IO
C8 GPIO_01
C9 GPIO_02 C10 GPIO_03 C11 GPIO_04 B14 GPIO_05 C12 GPIO_06 C13 GPIO_07 K15 GPIO_08 L15 GPIO_09 G15 GPIO_10 ADC B1 ADC_IN RF SECTION 1VV0301593 Rev.7
I/O
Function
I Digital Audio Interface (RX)
I/O Digital Audio Interface (TX)
I/O Digital Audio Interface (CLK)
I/O SPI MOSI I/O SPI_MISO I/O SPI Clock I/O SPI Chip Select
I/O GPIO_01 /STAT LED I/O GPIO_02 I/O GPIO_03 I/O GPIO_04 I/O GPIO_05 I/O GPIO_06 I/O GPIO_07 I/O GPIO_08 I/O GPIO_09 I/O GPIO_10
AI Analog Digital Converter input
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Type 1.8V 1.8V 1.8V
Comment
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
STAT LED is alternate function internal PD (100K) internal PD (100K) internal PD (100K) internal PD (100K) internal PD (100K) internal PD (100K) internal PD (100K) internal PD (100K) internal PD (100K) internal PD (100K)
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ME910G1 HW Design Guide
Pin
Signal
K1 ANTENNA
GNSS Section
I/O
Function
I/O
LTE Antenna (50 ohm)
Type RF
Comment
R9 ANT_GNSS
I
GNSS Antenna (50 ohm)
RF
R7 GNSS_LNA_EN
O
External GNSS LNA Enable
Miscellaneous Functions
R13 HW_SHUTDOWN* R12 ON_OFF*/WAKE* R11 VAUX/PWRMON
I HW Unconditional Shutdown
I
Input command for power ON and to wake from deep sleep mode
O
Supply Output for external accessories / Power ON Monitor
F14 FORCED_USB_BOOT I Debug pin, connect to test point
Power Supply M1 VBATT M2 VBATT N1 VBATT_PA N2 VBATT_PA P1 VBATT_PA P2 VBATT_PA E1 GND G1 GND H1 GND J1 GND L1 GND A2 GND E2 GND F2 GND G2 GND H2 GND J2 GND 1VV0301593 Rev.7
- Main power supply (Baseband) - Main power supply (Baseband) - Main power supply (Radio PA) - Main power supply (Radio PA) - Main power supply (Radio PA) - Main power supply (Radio PA) - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground
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CMOS 1.8V
VBATT
1.8V
1.8V
CMOS 1.8V
Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power
Active low Active low Active high, internal PD (100K)
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Pin
Signal
K2 GND
L2 GND
R2 GND
M3 GND
N3 GND
P3 GND
R3 GND
D4 GND
M4 GND
N4 GND
P4 GND
R4 GND
N5 GND
P5 GND
R5 GND
N6 GND
P6 GND
R6 GND
P8 GND
R8 GND
P9 GND
P10 GND
R10 GND
M12 GND
B13 GND
P13 GND
E14 GND
RESERVED
C1 RESERVED
D1 RESERVED
F1 RESERVED
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I/O - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground - Ground
Function
- RESERVED - RESERVED - RESERVED
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Type Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power
Comment
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ME910G1 HW Design Guide
Pin
Signal
B2 RESERVED
C2 RESERVED
D2 RESERVED
B3 RESERVED
C3 RESERVED
D3 RESERVED
E3 RESERVED
F3 RESERVED
G3 RESERVED
K3 RESERVED
L3 RESERVED
B4 RESERVED
C4 RESERVED
B5 RESERVED
C5 RESERVED
C6 RESERVED
C7 RESERVED
N7 RESERVED
P7 RESERVED
N8 RESERVED
N9 RESERVED
A10 RESERVED
N10 RESERVED
N11 RESERVED
P11 RESERVED
B12 RESERVED
D12 RESERVED
N12 RESERVED
P12 RESERVED
G14 RESERVED
J14 RESERVED
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I/O - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED - RESERVED
Function
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Type
Comment
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ME910G1 HW Design Guide
Pin
Signal
I/O
K14 RESERVED
- RESERVED
N13 RESERVED
- RESERVED
L13 RESERVED
- RESERVED
J13 RESERVED
- RESERVED
M13 RESERVED
- RESERVED
K13 RESERVED
- RESERVED
H13 RESERVED
- RESERVED
G13 RESERVED
- RESERVED
F13 RESERVED
- RESERVED
B11 RESERVED
- RESERVED
B10 RESERVED
- RESERVED
A9 RESERVED
- RESERVED
A8 RESERVED
- RESERVED
E13 RESERVED
- RESERVED
D13 RESERVED
- RESERVED
D14 RESERVED
- RESERVED
A14 RESERVED
- RESERVED
A12 RESERVED
- RESERVED
A11 RESERVED
- RESERVED
H15 RESERVED
- RESERVED
J15 RESERVED
- RESERVED
C14 RESERVED
- RESERVED
H3 RESERVED
- RESERVED
J3 RESERVED
- RESERVED
Table 9: Pin-out Information
Function
Type
Comment
Warning: Reserved pins must not be connected.
Only D13-E13 pins can be connected together in order to be compatible with HE910 module. All pull-up (PU) and pull-down (PD) are about 100K
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ME910G1 HW Design Guide
LGA Pads Layout
TOP VIEW
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
A
HW_KE Y
GND
CELL_ MAIN
GND
WIFI
GND
BT
GND
GND
A
B
GND
GND
GND
GND
GND
GND
GND
GND
RES
B
C EAR+
GND C
D
RES
IO3
IO4
IO5
IO6
RES
D
E EAR-
HID1
HID2
GNSS E
F
RES
GND
GND
RES
F
G MIC+
GND
GNSS_L NA
GND G
H
TX_AUX
GND
GND
RES
H
J MIC-
K
RX_AUX
L
SIM_CL K
SD_D3 SD_D2
GNSS_ ON
GNSS_ PPS
CELL_D IV
J
USB_B OOT
K
GND
L
M
GND
WAKE
M
N SIM_IO
SD_D1
ALM
ON_OF F
N
P
SD_CLK
GND
GND
PSM
P
R
SIM_RS T
SD_D0
T
SD_CS
U
SIM_VC C
HID3
V
POW_G ND
VBATT/
W VBATT_
PA
Y
VBATT/ VBATT_
PA
POW_G ND
CS
AA
VBATT/ VBATT_
PA
POW_G ND
1
2
3
4
5
6
Figure 1: LGA Pads Layout
GND
GND
S_LED HID4
RST
R
USB_VB US
T
USB_D+ U
IO1
IO2
ADC
DAC
GND
V
USB_D- W
MISO
CTS1
RTS1
V_AUX
CTS0
RTS0
Y
CLK
MOSI
RXD1
TXD1
RXD0
TXD0
AA
7
8
9
10
11
12
13
14
15
16
17
18
19
SUPPLY AND CONTROL SIM CARD ANALOG FUNCTIONALITY GROUND DIGITAL FUNCTIONALITY
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DIGITAL COMMUNICATION RF SIGNALS RESERVED/NOT ASSIGNED/ RESERVED FOR FUTURE USE GNSS
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4. POWER SUPPLY
The power supply circuitry and the board layout are a very important part in the full product design and they strongly reflect on the product overall performances, so the requirements and the guidelines that will follow should be read carefully for a proper design.
Power Supply Requirements
The external power supply must be connected to VBATT and VBATT_PA pads and must fulfil the following requirements:
Power Supply Nominal Supply Voltage Operating Voltage Range Extended Voltange Range VBATTmin Table 10: Power Supply Requirements
3.8V 3.2 V - 4.2 V 2.6 V - 4.5 V 2.7V
Value
Warning: The range 2.6V - 3.2V can be used only if both USB and 2G are disabled.
Warning: The supply voltage of the modem must never exceed the Extended Operating Voltage Range. Wrong implementation of power supply guidelines described in this document may result in module fault.
Note: For PTCRB approval on the final products the power supply is required to be within the "Normal Operating Voltage Range".
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Note: The application's power supply section must be designed with care to avoid an excessive voltage drop during transmission peak current absorptions. If the voltage drops beyond the limits of the Extended Operating Voltage range, an unintentional module power off can occur. Note: When turning on the modem, the voltage must be at least VBATTmin. Note: HW User Guide specifications shall be fully acknowledged and correctly implemented in order to use the module in its "Extended Operating Voltage Range".
Power Consumption
Idle mode
Mode IDLE mode AT+CFUN=1
Measure (Typical)
CATM (mA)
NBIoT (mA)
2G (mA)
9.5
9.2
9.0
AT+CFUN=4
7.5
1.20
0.95
-
0.60
0.60
-
0.181
0.181
-
AT+CFUN=5
0.101
0.101
-
0.051
0.051
-
0.031
0.031
-
-
-
0.90
PSM mode
Typical (mA)
AT+CPSMS=1
3uA
Table 11: Idle and PSM Mode
Mode Description
Normal mode: full functionality of the module Disabled TX and RX; module is not registered on the network Paging cycle #256 frames (2.56s DRx cycle) 81.92s eDRx cycle length (PTW=2.56s, DRX=1.28s) 327.68s eDRx cycle length (PTW=2.56s, DRX=1.28s) 655.36s eDRx cycle length (PTW=2.56s, DRX=1.28s) 1310.72s eDRx cycle length (PTW=2.56s, DRX=1.28s) 2621.44s eDRx cycle length (PTW=2.56s, DRX=1.28s) Paging Multiframe 9
No current source or sink by any connected pin
1PSM in between eDRX
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Mode
GPS
Active State (GNSS ON, CFUN=4)
Acquisition Navigation
Active State (GNSS ON, CFUN=5 eDRX)
Table 12:GPS Mode
Acquisition Navigation
Measure* (Typical)
Mode Description
(mA)
69.3
GPS+GLO, DPO off
22
GPS+GLO, DPO on DWELL=280ms
55.9
GPS+GLO, DPO off
68.5
GPS+GLO, DPO off
15.7
GPS+GLO, DPO on DWELL=280ms
54
GPS+GLO, DPO off
*reference signal @-130 dbm with static scenario
Note: The reported LTE CAT M1 and LTE CAT NB1 values are an average among all the product variants and bands for each network wireless technology.
The support of specific network wireless technology depends on the product variant configuration.
ME910G1-W1 Connected Mode
Mode Connected mode
Measure (Typical)
Average (mA)
Peak (mA)
CATM
180
400
NBIoT
245
340
65
290
Table 13: ME910G1-W1 Connected Mode
Mode Description
1 RB, RMC, TBS=5, QPSK, 21dBm, all bands 3.75KHz, 1 SC, RU 32ms, TBS=0, BPSK, 20dBm, all bands 15KHz, 12 SC, RU 1ms, TBS=5, QPSK, 21dBm, all bands
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ME910G1-WW and ME910G1-WWV Connected Mode
Mode
Measure (Typical)
Mode Description
Connected mode
Average (mA)
Peak (mA)
380
1100
1 RB, RMC, TBS=5, QPSK, 23dBm, Band 85, 28, 12
CATM
320
900
1 RB, RMC, TBS=5, QPSK,23dBm, Band 13, 26, 5, 18, 19, 20, 8
305
800
1 RB, RMC, TBS=5, QPSK, 23dBm, Band 3, 2, 25, 4, 1, 66
240
335
3.75KHz, 1 SC, RU 32ms, TBS=0, BPSK, 20dBm, Band 71
600
1000 3.75KHz, 1 SC, RU 32ms, TBS=0, BPSK, 23dBm, Band 85, 28, 12
500
850
3.75KHz, 1 SC, RU 32ms, TBS=0, BPSK, 23dBm, Band 13, 26, 5, 18, 19, 20, 8
NBIoT
430
750
3.75KHz, 1 SC, RU 32ms, TBS=0, BPSK, 23dBm, Band 3, 2, 25, 4, 1, 66
68
300
15KHz, 12 SC, RU 1ms, TBS=5, QPSK, 21dBm, Band 71
88
950
15KHz, 12 SC, RU 1ms, TBS=5, QPSK, 23dBm, Band 85, 28, 12
78
800
15KHz, 12 SC, RU 1ms, TBS=5, QPSK, 23dBm, Band 13, 26, 5, 18, 19, 20, 8
77
730
15KHz, 12 SC, RU 1ms, TBS=5, QPSK, 23dBm, Band 3, 2, 25, 4, 1, 66
GPRS
300
2000 1TX + 1RX, CS1, GMSK, Band 850, 900
170
1000 1TX + 1RX, CS1, GMSK, Band 1800, 1900
Table 14: ME910G1-WW and ME910G1-WWV Connected Mode
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ME910G1 HW Design Guide
General Design Rules
The main guidelines for the Power Supply Design include three different design steps: � the electrical design of the power supply � the thermal design � the PCB layout
Electrical Design Guidelines of the power supply
The electrical design of the power supply strongly depends on the power source where this power is drained. We will distinguish them into three categories:
� +5V input (typically PC internal regulator output) � +12V input (typically automotive) � Battery
+5V Source Power Supply Design Guidelines
� The desired output for the power supply is 3.8V, so there's not a big difference between the input source and the desired output and a linear regulator can be used. A switching power supply will not be suited due to the low drop out requirements.
� When using a linear regulator, a proper heat sink shall be provided in order to dissipate the power generated.
� A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks close to the Module, a 100F capacitor is usually suitable.
� Make sure the low ESR capacitor on the power supply output rated at least 10V.
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Figure 2: An example of linear regulator with 5V input
+12V Source Power Supply Design Guidelines
� The desired output for the power supply is 3.8V, so due to the big difference between the input source and the desired output, a linear regulator is not suitable and shall not be used. A switching power supply will be preferable because of its better efficiency.
� When using a switching regulator, a 500kHz or more switching frequency regulator is preferable because of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption.
� In any case the frequency and Switching design selection is related to the application to be developed since the switching frequency could also generate EMC interferences.
� For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind when choosing components: all components in the power supply must withstand this voltage.
� A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100F capacitor is usually suitable.
� Make sure the low ESR capacitor on the power supply output is rated at least 10V.
� For Car applications a spike protection diode should be inserted close to the power input, in order to clean the supply from the spikes.
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Figure 3: An example of switching regulator with 12V input
Battery Source Power Supply Design Guidelines
The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the power to the Telit ME910G1 module.
� A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100F tantalum capacitor is usually suited.
� Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.
� A protection diode should be inserted close to the power input, in order to save the ME910G1 from power polarity inversion. Otherwise the battery connector should be done in a way to avoid polarity inversions when connecting the battery.
� The battery must be rated to supply peaks of current up to 0.6 A for LTE.
Note: DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with ME910G1. Their use can lead to overvoltage on the ME910G1 and damage it. You can use LI-Ion, Li-Po, , Li-FePO4 secondary batteries or hi current Lithium primary batteries.
Thermal Design Guidelines
Worst case as reference values for thermal design of ME910G1 are:
� Average current consumption: 700 mA (LTE CAT M1 and NB1 modes)
� Average current consumption: 700 mA (GPRS and EDGE modes)
� Supply voltage: 4.50V
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Note: Make PCB design in order to have the best connection of GND pads to large surfaces of copper.
Note: The ME910G1 includes a function to prevent overheating.
Power Supply PCB layout Guidelines
As seen on the guidelines for electrical design, the power supply shall have a low ESR capacitor on the output to cut the current peaks on the input to protect the supply from spikes. The placement of this component is crucial for the correct working of the circuitry. A misplaced component can be useless or can even decrease the power supply performances.
� The Bypass low ESR capacitor must be placed close to the Telit ME910G1 power input pads or, in the case the power supply is a switching type it can be placed close to the inductor to cut the ripple provided the PCB trace from the capacitor to the ME910G1 is wide enough to ensure a voltage dropless connection even during an 0.6 A (LTE) or 2A (GSM) current peak.
� The protection diode must be placed close to the input connector where the power source is drained.
� The PCB's traces from the input connector to the power regulator IC must be wide enough to ensure no voltage drops occur when an 2 A current peak is absorbed (valid only for product supporting GSM mode).
� The PCB traces to the ME910G1 and the Bypass capacitor must be wide enough to ensure no significant voltage drops occur. This is for the same reason as previous point. Try to keep this trace as short as possible.
� To reduce the EMI due to switching, it is important to keep the mesh involved very small; therefore the input capacitor, the output diode (if not embodied in the IC) and the regulator shall form a very small loop.This is done in order to reduce the radiated field (noise) at the switching frequency (100-500 kHz usually).
� A dedicated ground for the Switching regulator separated by the common ground plane is suggested.
� The placement of the power supply on the board should be done in such a way to guarantee that the high current return paths in the ground plane are not
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overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier. � The power supply input cables should be kept separate from noise sensitive lines such as microphone/earphone cables. � The insertion of EMI filter on VBATT pins is suggested in those designs where antenna is placed close to battery or supply lines. A ferrite bead like Murata BLM18EG101TN1 or Taiyo Yuden P/N FBMH1608HM101 can be used for this purpose. The below figure shows the recommended circuit:
Figure 4: Recommended Circuit
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ME910G1 HW Design Guide
VAUX Power Output
A regulated power supply output is provided to supply small devices from the module, like: level translators, audio codec, sensors, and others.
Pin R11 can be used also as PWRMON (module powered ON indication) function, because is always active when the module is powered ON and cannot be set to LOW level by any AT command.
Host can only detect deep sleep mode by monitoring of VAUX/PWRMON output pin, since there is no pin dedicated to PSM status indicator.
The operating range characteristics of the supply are:
Item
Min
Output voltage
1.78V
1.80V
Output current
-
-
Output bypass capacitor (inside the module)
1uF
Table 15: Operating range characteristics of the supply
Typical
1.82V 60mA
Max
Note: If power saving configuration is enabled by AT+CPSMS Command, VAUX during deep sleep mode period is OFF
RTC Supply
RTC is functional when ME910G1 is in PSM or OFF state and VBATT pin is supplied. RTC settings are erased if VBATT supply is temporary disconnected.
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5. DIGITAL SECTION
ME910G1 has four main operation states:
� OFF state: Vbatt is applied and only RTC is running. Baseband is switched OFF and the only change possible is the ON state.
� ON state: baseband is fully switched on and ME910G1 is ready to accept AT commands. ME910G1 can be idle or connected.
� Sleep mode state: main baseband processor is intermittently switched ON and AT commands can be processed with some latency. ME910G1 is idle with low current consumption.
� Deep sleep mode state: PSM defined in 3GPP Release 12. Baseband is switched OFF most of the time.
Logic Levels
Parameter ABSOLUTE MAXIMUM RATINGS � NOT FUNCTIONAL Input level on any digital pin (CMOS 1.8) with respect to ground Operating Range - Interface levels (1.8V CMOS) Input high level Input low level Output high level Output low level Table 16: Logic levels Minimum and maximum
Current characteristics: Output Current Input Current Table 17: Logic levels average
Parameter
Min
Max
-0.3V
2.1V
1.5V
1.9V
0V
0.35V
1.6V
1.9V
0V
0.2V
Max
1mA 1uA
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ME910G1 HW Design Guide
Power On
To turn on the ME910G1 the pad ON_OFF*/WAKE* must be tied low for at least 5 second and then released. The maximum current that can be drained from the ON_OFF*/WAKE* pad is 0,1 mA. ON_OFF*/WAKE* pad can make an asynchronous wakeup of the system from the PSM Mode, before the scheduled event of timer T3412 expired. To make asynchronous exit from PSM mode ON_OFF*/WAKE* pin must be set LOW for at least 5 seconds.
Figure 5: Power-on Circuit; illustrates a simple circuit to power on the module using an inverted buffer output.
Note: Do not use any pull up resistor on the ON_OFF*/WAKE* line, it is internally pulled up. Using pull up resistor may bring to latch up problems on the ME910G1 power regulator and improper power on/off of the module. The line ON_OFF*/WAKE* must be connected only in open collector or open drain configuration. In this document all the lines that are inverted, hence have active low signals are labelled with a name that ends with"#","*" or with a bar over the name. To check if the device has powered on, the hardware line PWRMON should be monitored.
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A flow chart showing the proper turn on procedure is displayed below:
"Modem ON Proc" START
N
VBATT>VBATTmin?
Y
Y
PWRMON=ON ?
N
ON_OFF*/WAKE* = LOW
Delay = 5 sec
ON_OFF*/WAKE*= HIGH
GO TO "HW Shutdown Unconditional"
PWRMON=ON ?
N
Y
Delay = 1 sec
GO TO "Start AT Commands""
"Modem ON Proc" END
Figure 6: Turn on procedure flow chart
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ME910G1 HW Design Guide A flow chart showing the AT commands managing procedure is displayed below:
"Start AT CMD" START
Delay = 300 msec Enter AT <CR>
AT answer in
N
1 sec ?
Y
"Start AT CMD" END
GO TO "HW Shutdown Unconditional"
GO TO "Modem ON Proc."
Figure 7: AT commands managing procedure flow chart
Note: In order to avoid a back powering it is recommended to prevent any HIGH logic level signal from being applied to the digital pins of the ME910G1 when the module is powered off or during an ON-OFF transition.
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For example: 1- Let's assume you need to drive the ON_OFF*/WAKE* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT1):
2- Let's assume you need to drive the ON_OFF*/WAKE* pad directly with an ON/OFF button:
Warning: It is recommended to set the ON_OFF*/WAKE* line LOW to power on the module only after VBATT is higher than 3.20V.In case this condition it is not satisfied you could use the HW_SHUTDOWN* line to recover it and then restart the power on activity using the ON_OFF*/WAKE* line. An example of this is described in the following diagram.
After HW_SHUTDOWN* is released you could again use the ON_OFF*/WAKE* line to power on the module.
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Power Off
Turning off of the device can be done in two ways: � via AT command (see ME910G1 Software User Guide, AT#SHDN) � pin ON_OFF*/WAKE* for at least 3 seconds
Either ways, the device issues a detach request to network informing that the device will not be reachable any more.
Note: To check if the device has been powered off or IN PSM mode, the hardware line PWRMON must be monitored. The device is powered off when PWRMON goes low. In order to avoid a back powering it is recommended to prevent any HIGH logic level signal from being applied to the digital pins of the ME910G1 when the module is powered off or during an ON-OFF transition.
Warning: Not following the recommended shut-down procedures might damage the device and consequently void the warranty.
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The following flow chart shows the proper turn off procedure:
"Modem OFF Proc." START
N
PWRMON=ON?
Y
AT
Key
OFF Mode
AT#SHDN
ON_OFF*/WAKE* = LOW Delay >= 3 sec
ON_OFF*/WAKE* = HIGH
N
PWRMON=ON?
Y N
Looping for more than 15s?
Y
GO TO "HW SHUTDOWN
Unconditional"
Figure 8: turn off procedure flow chart
"Modem OFF Proc." END
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Wake from deep sleep mode
ME910G1 supports Power Saving Mode (PSM) functionality defined in 3GPP Release 12. When Periodic Update Timer expires, ME910G1 power off until the next scheduled wakeup time.
Asynchronous event controlled by host can wake up from deep sleep mode by asserting ON_OFF*/WAKE* pin LOW for at least 5 seconds.
Host can detect deep sleep mode by polling VAUX/PWRMON pin if previously configured.
Unconditional Shutdown
HW_SHUTDOWN* is used to unconditionally shutdown the ME910G1. Whenever this signal is pulled low, the ME910G1 is reset. When the device is reset it stops any operation. After the release of the line, the ME910G1 is unconditionally shut down, without doing any detach operation from the network where it is registered. This behaviour is not a proper shut down because any cellular device is requested to issue a detach request on turn off. The HW_SHUTDOWN* is internally controlled on start-up to always achieve a proper power-on reset sequence, so there's no need to control this pin on start-up.
To unconditionally shutdown the ME910G1, the pad HW_SHUTDOWN* must be tied low for at least 200 milliseconds and then released.
The signal is internally pulled up so the pin can be left floating if not used.
If used, then it must always be connected with an open collector transistor, to permit to the internal circuitry the power on reset and under voltage lockout functions.
During PSM mode, HW_SHUTDOWN toggle has no effect. The use of HW_SHUTDOWN* pin is valid only when ME910G1 has VAUX/PWRMON output HI.
PIN DESCRIPTION
Signal
Function
HW_SHUTDOWN*
Unconditional Shutdown of the Module
Table 18: HW_SHUTDOWN* signal
I/O
PAD
I
R13
Warning: The hardware unconditional Shutdown must not be used during normal operation of the device since it does not detach the device from the network. It shall be kept as an emergency exit procedure.
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ME910G1 HW Design Guide A typical circuit is the following:
Figure 9: typical circuit
For example: Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT2):
Figure 10: typical circuit 1VV0301593 Rev.7
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ME910G1 HW Design Guide In the following flow chart the proper restart procedure is detailed:
"HW SHUTDOWN Unconditional" START
HW_SHUTDOWN* = LOW
Delay = 200ms
HW_SHUTDOWN* = HIGH
Y
PWRMON = ON
N
"HW SHUTDOWN Unconditional" END
Figure 11: restart procedure flow chart
Delay = 1s
Disconnect VBATT
Note: In order to avoid a back powering it is recommended to prevent any HIGH logic level signal from being applied to the digital pins of the ME910G1 when the module is powered off or during an ON-OFF transition.
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Note: Do not use any pull up resistor on the HW_SHUTDOWN* line nor any totem pole digital output. Using pull up resistor may bring to latch up problems on the ME910G1 power regulator and improper functioning of the module. To proper power on again the module please refer to the related paragraph ("Power ON") The unconditional hardware shutdown must always be implemented on the boards and should be used only as an emergency exit procedure.
Fast shut down
The procedure to power off ME910G1 described in Chapter 5.3 normally takes more than 1 second to detach from the network and make ME910G1 internal filesystem properly closed. In case of unwanted supply voltage loss the system can be switched off without any risk of filesystem data corruption by implementing Fast Shut Down feature. Fast Shut Down feature permits to reduce the current consumption and the time-topoweroff to minimum values.
Note: Refer to ME910G1 series AT command reference guide (Fast shut down - #FASTSHDN) in order to set up detailed AT command.
Fast Shut Down by Hardware
The fast shut down can be triggered by configuration of any GPIO. HI level to LOW level transition of GPIO commands fast shut down.
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ME910G1 HW Design Guide Example circuit:
Figure 12: example circuit
Note: Consider voltage drop under max current conditions when defining the voltage detector thereshold in order to avoid unwanted shutdown.
The capacitor is rated with the following formula:
Tip: Make the same plot during system verification to check timings and voltage levels.
Fast Shut Down by Software
The fast shut down can be triggered by AT command.
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Communication ports
Note: It is suggested to add PCB test points at non-used module's UART, UART_AUX and USB (for products that support USB), it can be useful to reflash, test and debug the application. Test points for UART or USB are fine, however we recommend placing the pads for a suitable connector to port, for convenient access for network certification testing and access during early development testing. The USB connector can be "DNP" until needed. This may be more convenient than just test points alone.
USB 2.0 HS
The ME910G1 includes one integrated universal serial bus (USB 2.0 HS) transceiver. The following table lists the available signals:
PAD
Signal
I/O
Function
NOTE
B15
USB_D+
I/O
USB differential Data (+)
C15
USB_D-
I/O
USB differential Data (-)
A13
VUSB
AI
Table 19: Available Signals
Power sense for the internal USB transceiver.
Accepted range: 3.0V to 5.5V 100K pull down
The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz, therefore signal traces should be routed carefully. Trace lengths, number of vias and capacitive loading should be minimized. The characteristic impedance value should be as close as possible to 90 Ohms differential.
ESD protection can be added to USB D+/D- lines in case of external connector for cable connection.
Proper components for USB 2.0 must be used.
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SPI
The ME910G1 Module is provided by a standard 3-wire master SPI interface + chip select control.
The following table lists the available signals:
PAD
Signal
D15
SPI_MOSI
I/O
O
SPI MOSI
Function
E15
SPI_MISO
I
F15
SPI_CLK
O
H14
SPI_CS
O
Table 20: Available Signals
SPI MISO SPI Clock SPI Chip Select
Type CMOS 1.8V
CMOS 1.8V CMOS 1.8V CMOS 1.8V
NOTE
Shared with TX_AUX
Shared with RX_AUX
Note: Due to the shared functions, SPI port and TX_AUX/RX_AUX port cannot be used simultanously.
Refer to ME910G1 series AT command reference guide for port configuration.
SPI Connections
E15 D15 F15
ME910G1
SPI_MISO SPI_MOSI
SPI_CLK
H14
SPI_CS
Figure 13: SPI Connections
Application Processor
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Serial Ports
The ME910G1 module is provided with by 2 Asynchronous serial ports:
� MODEM SERIAL PORT 1 (Main) � MODEM SERIAL PORT 2 (Auxiliary) Several configurations can be designed for the serial port on the OEM hardware, but the most common are:
� RS232 PC com port � microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit) � microcontroller UART @ 5V or other voltages different from 1.8V Depending on the type of serial port on the OEM hardware a level translator circuit may be needed to make the system work. On the ME910G1 the ports are CMOS 1.8.
Modem serial port 1 (USIF0)
The serial port 1 on the ME910G1 is a +1.8V UART with all the 7 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.
The following table is listing the available signals:
RS232 Pin
Signal
1
C109/DCD
2
C104/RXD
3
C103/TXD
4
C108/DTR
PAD
Name
N14
Data Carrier Detect
M15
Transmit line *see Note
N15
Receive line *see Note
M14
Data Terminal Ready
6
C107/DSR
P14
Data Set Ready
7
C105/RTS
L14
Request to Send
8
C106/CTS
P15
Clear to Send
9
C125/RING
R14
Table 21: Available Signals
Ring Indicator
Usage
Output from the ME910G1 that indicates the carrier presence
Output transmit line of ME910G1 UART
Input receive of the ME910G1 UART
Input to the ME910G1 that controls the DTE READY condition
Output from the ME910G1 that indicates the module is ready
Input to the ME910G1 that controls the Hardware flow control
Output from the ME910G1 that controls the Hardware flow control
Output from the ME910G1 that indicates the incoming call condition
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Note: According to V.24, some signal names are referred to the application side, therefore on the ME910G1 side these signal are on the opposite direction: TXD on the application side will be connected to the receive line (here named C103/TXD)
RXD on the application side will be connected to the transmit line (here named C104/RXD).
For a minimum implementation, only the TXD, RXD lines can be connected, the other lines can be left open provided a software flow control is implemented.
In order to avoid a back powering it is recommended to prevent any HIGH logic level signal from being applied to the digital pins of the ME910G1 when the module is powered off or during an ON/OFF transition.
Modem serial port 2 (USIF1)
The auxiliary serial port on the ME910G1 is a CMOS1.8V with only the RX and TX signals. The signals of the ME910G1 serial port are:
PAD
Signal
D15
TX_AUX
I/O
Function
O
Auxiliary UART (TX Data to DTE)
E15
RX_AUX
I
Auxiliary UART (RX Data from DTE)
Table 22: ME910G1 serial port signals
Type CMOS 1.8V CMOS 1.8V
NOTE
Shared with SPI_MOSI
Shared with SPI_MISO
Note: Due to the shared functions, TX_AUX/RX_AUX port and SPI port cannot be used simultanously.
In order to avoid a back powering it is recommended to prevent any HIGH logic level signal from being applied to the digital pins of the ME910G1 when the module is powered off or during an ON/OFF transition.
Refer to ME910G1 series AT command reference guide for port configuration.
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RS232 level translation
In order to interface the ME910G1 with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required. This level translator must:
� invert the electrical signal in both directions; � Change the level from 0/1.8V to +15/-15V. Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level translator. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required. The simplest way to translate the levels and invert the signal is by using a single chip level translator. There are a multitude of them, differing in the number of drivers and receivers and in the levels (be sure to get a true RS232 level translator not a RS485 or other standards). By convention the driver is the level translator from the 0-1.8V UART to the RS232 level. The receiver is the translator from the RS232 level to 0-1.8V UART. In order to translate the whole set of control lines of the UART you will need: � 5 drivers � 3 receivers An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver (MAX218) In this case the chipset is capable to translate directly from 1.8V to the RS232 levels (Example done on 4 signals only).
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Figure 14: example circuitry
The RS232 serial port lines are usually connected to a DB9 connector with the following layout:
Figure 15: example RS232 serial port lines
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General purpose I/O
The ME910G1 module is provided by a set of Configurable Digital Input / Output pins (CMOS 1.8V). Input pads can only be read; they report the digital value (high or low) present on the pad at the read time. The Output pads can only be written or queried and set the value of the pad output.
An alternate function pad is internally controlled by the ME910G1 firmware and acts depending on the function implemented.
The following table shows the available GPIO on the ME910G1:
PAD
Signal
I/O
Output Drive Strength
Default State
C8
GPIO_01
I/O 1mA
INPUT � PD (100K)
C9
GPIO_02
I/O 1mA
C10
GPIO_03
I/O 1mA
C11
GPIO_04
I/O 1mA
B14
GPIO_05
I/O 1mA
C12
GPIO_06
I/O 1mA
C13
GPIO_07
I/O 1mA
K15
GPIO_08
I/O 1mA
L15
GPIO_09
I/O 1mA
G15
GPIO_10
I/O 1mA
Table 23: ME910G1 available GPIO
INPUT � PD (100K) INPUT � PD (100K) INPUT � PD (100K) INPUT � PD (100K) INPUT � PD (100K) INPUT � PD (100K) INPUT � PD (100K) INPUT � PD (100K) INPUT � PD (100K)
NOTE Alternate function STAT LED
(*)
Using a GPIO as INPUT
The GPIO pads, when used as inputs, can be connected to another device's digital output and report its status, provided this device has interface levels compatible with the 1.8V CMOS levels of the GPIO.
If the digital output of the device to be connected with the GPIO input pad of ME910G1 has interface levels different from the 1.8V CMOS, then it can be buffered with an open collector transistor with a 47K pull up to 1.8V supplied by VAUX/POWERMON R11 pad.
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Note: In order to avoid a back powering it is recommended to prevent any HIGH logic level signal from being applied to the digital pins of the ME910G1 when the module is powered off or during an ON/OFF transition. Refer to ME910G1 series AT command reference guide for GPIO pins configuration.
Using a GPIO as OUTPUT
The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs, the pads have a push-pull output and therefore the pullup resistor may be omitted.
Indication of network service availability
The STAT_LED pin status shows information on the network service availability and Call status. The function is available as alternate function of GPIO_01 (to be enabled using the AT#GPIO=1,0,2 command).
In the ME910G1 modules, the STAT_LED needs an external transistor to drive an external
LED and its voltage level is defined accordingly to the table below:
Device Status Device off Not Registered Registered in idle
Registered in idle + power saving
Connecting
Table 24: LED and its status
Led Status Permanently off Permanently on Blinking 1sec on + 2 sec off It depends on the event that triggers the wakeup (In sync with network paging) Blinking 1 sec on + 2 sec off
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In the following reference schematic for LED indicator, R3 must be calculated taking in account VBATT value and LED type:
Figure 16: LED indicator reference schematic
External SIM Holder
Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a).
ADC Converter
The ME910G1 is provided by one AD converter. It is able to read a voltage level in the range of 0�1.8 volts applied on the ADC pin input, store and convert it into 10 bit word.
The input line is named as ADC_IN1 and it is available on Pad B1
The following table is showing the ADC characteristics:
Item
Min
Input Voltage range
0
AD conversion
-
Input Resistance
1
Input Capacitance
-
Table 25: ADC characteristics
Typical 1
Max 1.8 10 -
Unit Volt bits Mohm pF
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The ADC could be controlled using an AT command. The command is AT#ADC=1,2 The read value is expressed in mV Refer to SW User Guide or AT Commands Reference Guide for the full description of this function.
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6. RF SECTION
Antenna requirements
The antenna connection and board layout design are the most important aspect in the full product design as they strongly affect the general performance of the product, so read carefully and follow the requirements and the guidelines for a proper design.
The antenna and antenna transmission line on PCB for a Telit ME910G1 device shall fulfil the following requirements:
Item
Value
Frequency range
Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s)
Bandwidth
250 MHz in LTE Band 1 140 MHz in LTE Band 2, PCS1900 170 MHz in LTE Band 3, DCS1800 445 MHz in LTE Band 4 70 MHz in LTE Band 5, GSM850 80 MHz in LTE Band 8, GSM900 47 MHz in LTE Band 12 41 MHz in LTE Band 13 60 MHz in LTE Band 18 60 MHz in LTE Band 19 71 MHz in LTE Band 20 145 MHz in LTE Band 25 80 MHz in LTE Band 26 62 MHz in LTE Band 27 100 MHz in LTE Band 28 490 MHz in LTE Band 66 81 MHz in LTE Band 71 48 MHz in LTE Band 85
Impedance
50 ohm
Input power
ME910G1-W1: > 24dBm Average power ME910G1-WW: > 33dBm Average power
VSWR absolute max
10:1 (limit to avoid permanent damage)
VSWR recommended
2:1 (limit to fulfill all regulatory requirements)
Table 26: ME910G1 Antenna and Antenna transmission line on PCB
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PCB Design guidelines
When using the ME910G1, since there's no antenna connector on the module, the antenna must be connected to the ME910G1 antenna pad (K1) by means of a transmission line implemented on the PCB.
This transmission line shall fulfil the following requirements:
Item
Value
Characteristic Impedance
50 ohm (+-10%)
Max Attenuation
0,3 dB
Coupling
Coupling with other signals shall be avoided
Ground Plane
Cold End (Ground Plane) of antenna shall be equipotential to the ME910G1 ground pins
Table 27: ME910G1 Antenna pad requirements
The transmission line should be designed according to the following guidelines:
� make sure that the transmission line's characteristic impedance is 50 ohm;
� keep line on the PCB as short as possible, since the antenna line loss shall be less than about 0,3 dB;
� line geometry should have uniform characteristics, constant cross section, avoid meanders and abrupt curves;
� any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded Coplanar Waveguide...) can be used to implement the printed transmission line afferent the antenna;
� if a Ground plane is required in line geometry, that plane shall be continuous and sufficiently extended, so that the geometry can be as similar as possible to the related canonical model;
� keep, if possible, at least one layer of the PCB used only for the Ground plane; If possible, use this layer as reference Ground plane for the transmission line;
� it is advisable to surround (on both sides) the PCB transmission line with Ground, avoiding that other signal tracks face directly the antenna line track.
� avoid crossing any un-shielded transmission line footprint with other signal tracks on different layers;
� the ground surrounding the antenna line on PCB shall be strictly connected to the main Ground Plane by means of via holes (once per 2mm at least), placed close to the ground edges facing the line track;
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� place EM noisy devices as far as possible from ME910G1 antenna line; � keep the antenna line far away from the ME910G1 power supply lines; � if EM noisy devices (such as fast switching ICs, LCD and so on) are present on the
PCB hosting the ME910, take care of the shielding of the antenna line by burying it in an inner layer of PCB and surrounding it with the Ground planes, or shield it with a metal frame cover. � if EM noisy devices are not present around the line, the use of geometries such as Microstrip or Grounded Coplanar Waveguide is preferable, since they typically ensure less attenuation if compared to a Stripline of the same length.
The following image is showing the suggested layout for the Antenna pad connection:
Figure 17: Layout for the Antenna pad connection
PCB Guidelines in case of FCC Certification
In the case FCC certification is required for an application using ME910G1, according to FCC KDB 996369 for modular approval requirements, the transmission line must be similar to the one implemented on the ME910G1 interface board and described in the following chapter.
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Transmission line design
When designing the ME910G1 interface board, the placement of components was chosen properly, in order to keep the line length as short as possible, thus leading to the lowest possible power losses. A Grounded Coplanar Waveguide (G-CPW) line was chosen, since this kind of transmission line ensures good impedance control and can be implemented in an outer PCB layer as needed in this case. A SMA female connector has been used to feed the line. The interface board is made on a FR4, 4-layers PCB. The substrate material is characterized by relative permittivity r = 4.6 � 0.4 @ 1 GHz, TanD= 0.019 � 0.026 @ 1 GHz. A characteristic impedance of nearly 50 is achieved using trace width = 1.1 mm, clearance from a coplanar ground plane = 0.3 mm each side. The line uses the reference ground plane on layer 3, while copper is removed from layer 2 below the line. The height of the trace above ground plane is 1.335 mm. Calculated characteristic impedance is 51.6 , the estimated line loss is less than 0.1 dB. The line geometry is shown below:
Figure 18: Line geometry
Transmission Line Measurements
An HP8753E VNA (Full-2-port calibration) was used in this measurement session. A calibrated coaxial cable was soldered to the pad corresponding to RF output; a SMA connector was soldered to the board in order to characterize the losses of the
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transmission line including the connector itself. During Return Loss / impedance measurements, the transmission line has been terminated to 50 load. Return Loss plot of line under test is shown below:
Figure 19: Return Loss plot of line under test
Line input impedance (in Smith Chart format, once the line has been terminated to 50 load) is shown in the following figure:
Figure 20: Line input impedance
Insertion Loss of G-CPW line plus SMA connector is shown below:
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Figure 21: Insertion Loss of G-CPW line plus SMA connector
Antenna Installation Guidelines
� Install the antenna in a place covered by the LTE signal with CAT-M1 support. � The Antenna must not be installed inside metal cases. � The Antenna must be installed according Antenna manufacturer instructions. � The Antenna integration should optimize the Radiation Efficiency. Efficiency values
> 50% are recommended on all frequency bands. � The Antenna integration should not perturb the radiation pattern described in the
documentation of the Antenna manufacturer. � It is preferable to get an omnidirectional radiation pattern. � The Antenna Gain must not exceed the values indicated in regulatory requirements,
where applicable, in order to meet related EIRP limitations. Typical antenna Gain in most M2M applications does not exceed 2dBi. � If the device antenna is located farther than 20cm from the human body and there are no co-located transmitter then the Telit FCC/IC approvals can be re-used by the end product. � If the device antenna is located closer than 20cm from the human body or there are co-located transmitter then the additional FCC/IC testing may be required for the end product (Telit FCC/IC approvals cannot be reused).
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7. AUDIO SECTION
The Telit digital audio interface (DVI) of the ME910G1 Module is based on the I2S serial bus interface standard. The audio port can be connected to the end device using digital interface, or via one of the several compliant codecs (in case an analog audio is needed).
Electrical Characteristics
The product is providing the DVI on the following pins:
Pin
Signal
B9
DVI_WA0
B6
DVI_RX
B7
DVI_TX
B8
DVI_CLK
Table 28: Pins DVI
I/O
Function
I/O
Digital Audio Interface (Word Alignment / LRCLK)
I
Digital Audio Interface (RX)
O Digital Audio Interface (TX)
I/O Digital Audio Interface (BCLK)
Internal Pull Up
Type
CMOS 1.8V
CMOS 1.8V CMOS 1.8V CMOS 1.8V
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8. GNSS SECTION
The ME910G1 module includes a state-of-art receiver that can simultaneously search and track satellite signals from multiple satellite constellations. This multi-GNSS receiver uses the entire spectrum of GNSS systems available: GPS, GLONASS, BeiDou, Galileo, and QZSS.
GNSS Signals Pin-out
Pin
Signal
I/O
R9
ANT_GNSS
I
R7
GNSS_LNA_EN
O
Table 29: GNSS Signals Pin-out
Function GNSS Antenna (50 ohm) GNSS External LNA Enable
Type CMOS 1.8V
Warning: GNSS_1PPS is not currently supported by software and it will be implemented in future SW releases.
RF Front End Design
The ME910G1 Module contains a pre-select SAW filter but does not contain the LNA necessary to achieve the maximum sensitivity. Active antenna (antenna with a built-in low noise amplifier) must be used and must be supplied with a proper bias-tee circuit.
Guidelines of PCB line for GNSS Antenna
� Make sure that the antenna line impedance is 50ohm.
� Keep the antenna line on the PCB as short as possible to reduce the loss.
� The Antenna line must have uniform characteristics, constant cross section, avoid meanders and abrupt curves.
� If possible, keep one layer of the PCB used only for the Ground plane.
� Surround (on both the sides, above and below) the antenna line on PCB with Ground, avoid having other signal tracks facing directly the antenna line of track.
� The ground around the antenna line on PCB must be strictly connected to the Ground Plane by placing vias once per 2mm at least.
� Place EM noisy devices as far as possible from antenna line.
� Keep the antenna line far away from power supply lines.
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� Keep the antenna line far away from GSM RF lines. � If there are noisy EM devices around the PCB hosting the module, such as fast
switching ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes, or shielding it with a metal frame cover. � If there are not noisy EM devices around the PCB hosting the module, use a stripline on the superficial copper layer for the antenna line. The line attenuation will be lower than a buried one.
Hardware-based solution for GNSS and LTE coexistence
When a stand-alone GNSS receiver is present in the user application, the LTE transmission may desensitize the GNSS receiver in particular if the decoupling between the LTE and GNSS antennas is low. A SAW filter can be added on LTE side, to protect GNSS receiver from LTE out-of-band emissions, as described in the schematic below. When the GNSS receiver embedded in the ME910G1 module is used, there is no condition for degradation, since the LTE part and the GNSS part are never active simultaneously, therefore the filtering on the LTE side is not needed.
Figure 22: Reference schematic
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GNSS Antenna Requirements
GNSS active antenna must be used or integrated in the application.
GNSS Antenna specification
Item
Frequency range
1559.0 ~ 1610.0 MHz
Gain
15 ~ 30dB
Impedance
50 ohm
Noise Figure of LNA
< 1.5 (recommended)
DC supply voltage
DC 1.8 ~ 3.3V
VSWR
3:1 (recommended)
Table 30: GNSS Antenna specification
Value
Note: In case of GNSS antenna placed close to module 15dB gain is enough, in case of long cable the gain has to be increased up to 30dB.
GNSS Antenna � Installation Guidelines
� The antenna must be installed according to the antenna manufacturer's instructions to obtain the maximum performance of GNSS receiver.
� The antenna location must be carefully evaluated if operating in conjunction with any other antenna or transmitter.
� The antenna must not be installed inside metal cases or near any obstacle that may degrade features such as antenna lobes and gain.
Powering the External LNA (active antenna)
The LNA of active antenna needs a power source because 1.8V or 3V DC voltage required by the active antenna is not supplied by the ME910G1 module but can be easily included by the host design.
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The electrical characteristics of the GPS_LNA_EN signal are:
Level
Min
Output High Level
1.6V
Output Low Level
0V
Table 31: Electrical characteristics of the GPS_LNA_EN
Example of external antenna bias circuitry:
Max 1.9V 0.3V
Figure 23: External antenna bias circuitry example
Be aware of max bias current in case of unwanted short on the antenna cable, since the decoupling inductor may be damaged.
In case of LNA with 1.8V supply, VAUX/POWERMON pin can be used to supply active GNSS antenna
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GNSS Characteristics
The table below specifies the GNSS characteristics and expected performance:
Parameters
Tracking Sensitivity
Sensitivity
Navigation
Cold Start
Hot
TTFF
Warm
Cold
Min Navigation update rate
CEP
Table 32: GNSS characteristics
Typical Measurement -159 dBm -155 dBm -144 dBm N/A <30s <30s 1Hz <2m
Notes
It will be available in next revision GNSS Simulator test @-130dBm GNSS Simulator test @-130dBm
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9. MECHANICAL DESIGN
Drawing
PIN B1
Lead Free Alloy: Surface Finishing Ni/Au for all solder pads
Dimensions in mm
Figure 24: ME910G1 Mechanical Drawing 1VV0301593 Rev.7
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10. APPLICATION PCB DESIGN
The ME910G1 modules have been designed in order to be compliant with a standard leadfree SMT process
Recommended footprint for the application
TOP VIEW
Figure 25: Footprint
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Figure 26:: Solder resist pattern
TOP TRANSPARENT VIEW
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In order to easily rework the ME910G1 it is recommended to consider on the application a 1.5 mm placement inhibit area around the module.
It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module.
Note: In the customer application, the region under WIRING INHIBIT (see figure above) must be clear from signal or ground paths.
PCB pad design
In PCB design, the solder pads can be defined as either Solder Mask Defined (SMD) or Non-Solder Mask Defined (NSMD). The difference between these two solder mask pad definitions, is in the closeness of the solder mask to the metal pad. In SMD pads, the solder mask opening is smaller than the metal pad and overlaps the metal on all sides. The solder mask opening defines the solderable area of the pad. In NSMD pads, the solder mask opening is larger than the metal pad and does not overlap the metal. The metal edge defines the solderable area of the pad (see Figure below).
Since the metal etching process in PCB manufacture, has significantly tighter alignment and etching tolerances than the alignment registration of the solder masking process, which, a more accurate solder pad land pattern can be obtained with NSMD pads. In addition, with SMD pads, the solder mask that overlaps the metal pad introduces additional height above the metal surface that may affect solder joint adhesion and reliability. Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
Copper Pad
Solder Mask
PCB
SMD (Solder Mask Defined)
NSMD (Non Solder Mask Defined)
Figure 28: PCB solder pad recommendations
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Recommendations for PCB pad dimensions
It is not recommended to place via or micro-via not covered by solder resist in an area of 0,3 mm around the pads unless it carries the same signal of the pad itself
Inhibit area for micro-via
Figure 29: Pad dimensions recommendations
Holes in pad are allowed only for blind holes and not for through holes. Recommendations for PCB pad surfaces:
Finish
Layer Thickness (um)
Properties
Electro-less Ni / Immersion Au
3 �7 / 0.05 � 0.15
Table 33: Recommendations for PCB pad surfaces
good solder ability protection, high shear force values
The PCB must be able to resist the higher temperatures that occur during the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to the leadfree solder paste.
It is not necessary to panel the application's PCB, however in that case it is recommended to use milled contours and predrilled board breakouts; scoring or v-cut solutions are not recommended.
Thermal performance
FR4 is one of the most commonly used PCB materials, it is a flame retardant composite material, composed by fiberglass-reinforced and epoxy laminate. One of the features of the FR4, is to have a very low thermal conductivity. An inexpensive way to improve thermal
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transfer for FR-4 PCBs is to add thermal vias - plated through-holes (PTH) between the conductive layers. Vias are created by drilling holes and copper plating them, in the same way that a PTH or via is used for electrical interconnections between layers. A series of plated through-hole thermal vias, should be located in the GND area underneath Telit module of the PCB to provide a thermal connection from the PCB GND to additional metal layers of the PCB.
The application PCB layout should include plated through-hole thermal vias for efficient heat dissipation from the Telit module into the PCB. One of the following thermal via types should be used:
� Open plated through-hole vias that will provide lower PCB fabrication costs but may fill with solder.
� Plugged and capped plated through-hole vias that will provide higher PCB fabrication costs but will not fill with solder.
Telit recommends creating areas of 10 mil (0.254-mm) vias arranged on a 25 mil (0.635mm) rectilinear matrix. The reason for this choice is the combination of cost, performance and manufacturability. According to several PCB manufacturers, 10-mil holes and 25-mil spacing are reasonable and repeatable production choice.
A uniform metal plating thickness on the PCB will ensure reliable, high Telit module solder assembly yield.
Stencil
A silk-screen process will be required for the deposition of solder paste to the PCB, for reflow of the Telit module to the PCB. The silk-screen process requires the use of an aperture based metal stencil where solder paste is transferred through the apertures onto the solder pads of the application PCB. To minimize solder voids and ensure maximum electrical and thermal connectivity of the module to the PCB, large pads, solder volume, and solder straining must be considered in the stencil design. The design and fabrication of the stencil determines the quality of the solder paste deposition onto the PCB and the resulting solder joint after reflow. The primary stencil parameters are aperture size, thickness, and fabrication method. The stencil should be made from stainless steel and the apertures layout can be the same of the recommended footprint (1:1). The recommended thickness shall be 127 um (5 mil). A stencil thickness of 152 �m (6 mil) can be used as well.
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Solder paste
Various types and grades of solder paste can be used for surface mounting Telit modules. For leadfree applications, a Sn-Ag (SA) or Sn-Ag-Cu (SAC) solder paste can be used. Any Type 3 solder paste that is either water-soluble or no clean is acceptable. We recommend using only "no clean" solder paste in order to avoid the cleaning of the modules after assembly.
Solder Reflow
Recommended solder reflow profile:
Figure 30: Recommended solder reflow profile
Profile Feature
Average ramp-up rate (TL to TP)
Preheat � Temperature Min (Tsmin) � Temperature Max (Tsmax) � Time (min to max) (ts)
3�C/second max
150�C 200�C 60-180 seconds
Tsmax to TL � Ramp-up Rate
3�C/second max
Time maintained above: � Temperature (TL) � Time (tL)
217�C 60-150 seconds
Peak Temperature (Tp)
245 +0/-5�C
Time within 5�C of actual Peak Temperature (tp)
10-30 seconds
Ramp-down Rate
6�C/second max.
Time 25�C to Peak Temperature
8 minutes max.
Table 34: Profile feature recommendations
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Note: All temperatures refer to topside of the package, measured on the package body surface
Warning: THE ME910G1 MODULE WITHSTANDS ONE REFLOW PROCESS ONLY.
Warning: The above solder reflow profile represents the typical SAC reflow limits and does not guarantee adequate adherence of the module to the customer application throughout the temperature range. Customer must optimize the reflow profile depending on the overall system taking into account such factors as thermal mass and warpage.
Inspection
An inspection of the solder joint between the solder pads of the Telit module and the application PCB should be performed. The best visual inspection tool for inspection of the Telit module solder joints on the PCB is a transmission X-ray, which can identify defects such as solder bridging, shorts, opens, and large voids (Note: small voids in large solder joints are not detrimental to the reliability of the solder joint).
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11. PACKAGING
Tray
The ME910 modules are packaged on trays that can be used in SMT processes for pick & place handling.The first Marketing and Engineering samples of the ME910G1 series will be shipped with the current packaging of the xE910 modules (on trays of 20 pieces each). Please note that Telit is going to introduce a new packaging for the xE910 family, as per the Product Change Notification PCN-0000-14-0055, therefore the mass production units of ME910G1 will be shipped according to the following drawings:
Figure 31: Tray packaging 1VV0301593 Rev.7
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Figure 32: Tray dimensions
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Reel
The ME910 can be packaged on reels of 200 pieces each. See figure for module positioning into the carrier.
Figure 33: Module positioning into the carrier
Carrier Tape detail
Figure 34: Carrier Tape detail 1VV0301593 Rev.7
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Reel detail
Figure 35: Reel detail
Figure 36: Detail
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Packaging detail
Figure 37: Packaging detail
Moisture sensitivity
The ME910G1 is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40�C and <90% relative humidity (RH). b) Environmental condition during the production: 30�C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5. c) The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if condition b) "IPC/JEDEC J-STD-033D paragraph 5.2" is respected d) Baking is required if conditions b) or c) are not respected e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more
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12. CONFORMITY ASSESSMENT ISSUES
Approvals summary
Type Approval
ME910G1-W1
EU RED
Yes
US FCC
Yes
CA ISED
Yes
BRAZIL ANATEL
-
JAPAN JRF & JTBL
-
CHINA CCC
-
Table 35: Approvals summary
ME910G1-WW Yes Yes Yes Yes Yes
Ongoing
RED approval
ME910G1-WWV Yes Yes Yes -
RED Declaration of Conformity
Hereby, Telit Communications S.p.A declares that the ME910G1-W1, ME910G1-WW and ME910G1-WWV Modules are in compliance with Directive 2014/53/EU.
The full text of the EU declaration of conformity is available at the following internet address: http://www.telit.com/red
Text of 2014/53/EU Directive (RED) can be found here:
https://eur-lex.europa.eu/legal-content/EN/TXT/?uri=CELEX:32014L0053
Antennas
This radio transmitter has been approved under RED to operate with the antenna types listed below with the maximum permissible gain indicated. The usage of a different antenna in the final hosting device may need a new assessment of host conformity to RED.
Model
Antenna Type
ME910G1-W1
ME910G1-WW
Omnidirectional Antenna Gain 2.14 dBi
ME910G1-WWV
Table 36: RED Antenna Type
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Band
ME910G1-W1
GSM 900
---
DCS 1800
---
GPRS/EGPRS 900
---
GPRS/EGPRS 1800
---
FDD 1
14.84
FDD 3
14.33
FDD 8
11.45
FDD 20
11.20
FDD 28
10.47
Table 37: Max Gain for RED
Max Gain for RED (dBi) ME910G1-WW ----5.47 9.34 11.84 11.33 8.45 8.20 7.47
ME910G1-WWV TBD TBD 5.47 9.34 11.84 11.33 8.45 8.20 7.47
FCC and ISED approval/FCC et ISDE approbation
FCC certificates
The FCC Certificate is available here: https://www.fcc.gov/oet/ea/fccid
ISED Certificate/ISDE certificates
The ISED Certificate is available here / Le certificat ISDE est disponible ici:
https://smssgs.ic.gc.ca/equipmentSearch/searchRadioEquipments?execution=e1s1&lang=en
Applicable FCC and ISED rules/Liste des r�gles FCC et ISDE applicables
Model Mod�le
Applicable FCC Rules
ME910G1-W1
ME910G1-WW
47 CFR Part 2, 22, 24, 27, 90
ME910G1-WWV
Table 38: Applicable FCC and ISED rules
Applicable ISED Rules R�gles ISDE applicables
RSS: 132 Issue3, 133 Issue 6, 130 Issue 2, 139 Issue 3; RSS-Gen Issue 5
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FCC and ISED Regulatory notices/Avis r�glementaires de FCC et ISDE
Modification statement / D�claration de modification
Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user's authority to operate the equipment.
Telit n'approuve aucune modification apport�e � l'appareil par l'utilisateur, quelle qu'en soit la nature. Tout changement ou modification peuvent annuler le droit d'utilisation de l'appareil par l'utilisateur.
Interference statement / D�claration d'interf�rence
This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
Le pr�sent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autoris�e aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radio�lectrique subi, m�me si le brouillage est susceptible d'en compromettre le fonctionnement.
Wireless notice / Wireless avis
This device complies with FCC/ISED radiation exposure limits set forth for an uncontrolled environment and meets the FCC radio frequency (RF) Exposure Guidelines and RSS-102 of the ISED radio frequency (RF) Exposure rules. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body.
Le pr�sent appareil est conforme � l'exposition aux radiations FCC / ISED d�finies pour un environnement non contr�l� et r�pond aux directives d'exposition de la fr�quence de la FCC radiofr�quence (RF) et RSS-102 de la fr�quence radio (RF) ISED r�gles d'exposition. L'�metteur ne doit pas �tre colocalis� ni fonctionner conjointement avec � autre antenne ou autre �metteur. L'antenne doit �tre install�e de fa�on � garder une distance minimale de 20 centim�tres entre la source de rayonnements et votre corps.
FCC Class B digital device notice (FCC only)
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide
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reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by taking one or more of the following measures: Reorient or relocate the receiving antenna.
� Increase the separation between the equipment and receiver. � Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected. � Consult the dealer or an experienced radio/TV technician for help.
CAN ICES-3 (B) / NMB-3 (B) (ISED only) / (ISDE seulement) This Class B digital apparatus complies with Canadian ICES-003. Cet appareil num�rique de classe B est conforme � la norme canadienne ICES-003.
Antennas/Antennes
FCC This radio transmitter has been approved by FCC and ISED to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Model
Antenna Type
ME910G1-W1
ME910G1-WW
Omnidirectional Antenna Gain 2.14 dBi
ME910G1-WWV
Table 39: FCC Antenna Type
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Band
ME910G1-W1
GSM 850
---
GSM 1900
---
GPRS/EGPRS 850
---
GPRS/EGPRS 1900
---
FDD 2
11.0
FDD 4
8.0
FDD 5
12.4
FDD 12
11.6
FDD 13
12.1
FDD 25
11.0
FDD 26
12.3
FDD 66
8.0
FDD 71
11.4
FDD 85
11.6
FDD 86
12.1
Table 40: Max Gain for FCC (dBi)
Max Gain for FCC (dBi) ME910G1-WW ----6.93 10.42 12.01 12.01 9.41 8.70 9.16 12.01 9.36 12.01 11.47 8.69 ---
ME910G1-WWV 8.44 10.04 6.93 10.42 12.01 12.01 9.41 8.70 9.16 12.01 9.36 12.01 11.47 8.69 ---
ISED / ISDE
This radio transmitter has been approved by ISED to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Le pr�sent �metteur radio a �t� approuv� par ISDE pour fonctionner avec les types d'antenne �num�r�s ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est sup�rieur au gain maximal indiqu�, sont strictement interdits pour l'exploitation de l'�metteur.
Model Mod�le
Antenna Type Type d'Antenne
ME910G1-W1 ME910G1-WW ME910G1-WWV
Omnidirectional
Antenna Gain 2.14 dBi Omnidirectionelle Gain de l'antenne 2.14 dBi
Table 41: ISED Antenna Type
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Gain maximum pour ISED (dBi) / Gain maximum pour ISDE (dBi)
Bande
ME910G1-W1
ME910G1-WW
ME910G1-WWV
GSM 850
5.15
GSM 1900
10.04
GPRS/EGPRS 850
---
3.64
3.64
GPRS/EGPRS 1900
---
5.13
5.13
FDD 2
11.0
8.52
8.52
FDD 4
8.0
8.29
8.29
FDD 5
9.1
6.12
6.12
FDD 12
8.6
5.63
5.63
FDD 13
8.9
5.95
5.95
FDD 25
11.0
8.52
8.52
FDD 26
9.0
6.09
6.09
FDD 66
8.0
8.29
8.29
FDD 71
8.4
8.48
8.48
FDD 85
8.6
5.63
5.63
Table 42: Gain maximum for ISED (dBi)
FCC label and compliance information
The product has a FCC ID label on the device itself. Also, the OEM host end product manufacturer will be informed to display a label referring to the enclosed module The exterior label will read as follows: "Contains Transmitter Module FCC ID: RI7ME910G1W1" or "Contains FCC ID: RI7ME910G1W1" for ME910G1-W1 and : "Contains Transmitter Module FCC ID: RI7ME910G1WW" or "Contains FCC ID: RI7ME910G1WW" for ME910G1-WW and ME910G1-WWV
Below list of all the models and related FCC ID:
Model ME910G1-W1 ME910G1-WW ME910G1-WWV Table 43: FCC ID
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FCC ID RI7ME910G1W1 RI7ME910G1WW
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ISED label and compliance information/ �tiquette et informations de conformit� ISDE
The host product shall be properly labelled to identify the modules within the host product.
The ISED certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labelled to display the ISED certification number for the module, preceded by the word "contains" or similar wording expressing the same meaning, as follows:
Contains IC: XXXXXX-YYYYYYYYYYY
In this case, XXXXXX-YYYYYYYYYYY is the module's certification number.
Le produit h�te devra �tre correctement �tiquet�, de fa�on � permettre l'identification des modules qui s'y trouvent.
L'�tiquette d'homologation d'un module d'ISDE devra �tre appos�e sur le produit h�te � un endroit bien en vue, en tout temps. En l'absence d'�tiquette, le produit h�te doit porter une �tiquette sur laquelle figure le num�ro d'homologation du module d'ISDE, pr�c�d� du mot � contient �, ou d'une formulation similaire allant dans le m�me sens et qui va comme suit :
Contient IC : XXXXXX-YYYYYYYYYYY
Dans ce cas, XXXXXX-YYYYYYYYYYY est le num�ro d'homologation du module.
Model Mod�le
ISED Certification Number Num. de certification ISDE
ME910G1-W1
5131A-ME910G1W1
ME910G1-WW ME910G1-WWV
5131A-ME910G1WW
Table 44: ISED Certification Number
Information on test modes and additional testing requirements / Informations sur les modes de test et les exigences de test suppl�mentaires
The module has been evaluated in mobile stand-alone conditions. For different operational conditions from a stand-alone modular transmitter in a host (multiple, simultaneously transmitting modules or other transmitters in a host), additional testing may be required (collocation, retesting...)
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If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093 and IC RSS-102. Le module a �t� �valu� dans des conditions autonomes mobiles. Pour diff�rentes conditions de fonctionnement d'un �metteur modulaire autonome dans un h�te (plusieurs modules �mettant simultan�ment ou d'autres �metteurs dans un h�te), des tests suppl�mentaires peuvent �tre n�cessaires (colocalisation, retesting...) Si ce module est destin� � �tre utilis� dans un appareil portable, vous �tes responsable de l'approbation s�par�e pour satisfaire aux exigences SAR de la FCC Partie 2.1093 et IC RSS-102.
FCC Additional testing, Part 15 Subpart B disclaimer
The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end product with an embedded module may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15.
ANATEL Regulatory Notices
"Este equipamento n�o tem direito � prote��o contra interfer�ncia prejudicial e n�o pode causar interfer�ncia em sistemas devidamente autorizados" "This equipment is not entitled to protection against harmful interference and must not cause interference in duly authorized systems" ME910G1-WW, ME310G1-WW, ML865G1-WW Homologation #: 08566-20-02618
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NCC Regulatory Notices
According to NCC Taiwan requirements, the module and the packaging shall be identified as described in the following lines. Shall be added also the specified safety warning statement. Brand name: Telit Model name: ME910G1-WW Equipment name: WWAN module
NCC logo: NCC ID: CCAF20NB0050T0 NCC safety warning statement: "" NCC Note: (2G) 106 6 2G
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13. PRODUCT AND SAFETY INFORMATION
SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE
Copyrights and Other Notices
Although reasonable efforts have been made to ensure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from the use of the information contained herein. The information in this document has been carefully checked and is believed to be reliable. Telit reserves the right to make changes to any of the products described herein, to revise it and to make changes from time to time with no obligation to notify anyone of such revisions or changes. Telit does not assume any liability arising from the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others.
This document may contain references or information about Telit's products (machines and programs), or services that are not announced in your country. Such references or information do not necessarily mean that Telit intends to announce such Telit products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described herein may include or describe Telit's copyrighted material, such as computer programs stored in semiconductor memories or other media. Laws in Italy and in other countries reserve to Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive righ to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any of Telit's or its licensors' copyrighted material contained herein or described in this instruction manual, shall not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of the owner. Furthermore, the purchase of Telit's products shall not be deemed to grant in any way, neither directly nor by implication, or estoppel, any license.
Computer Software Copyrights
Telit and the 3rd Party supplied Software (SW) products, described in this instruction manual may include Telit's and other 3rd Party's copyrighted computer programs stored in semiconductor memories or other media. Laws in Italy and in other countries reserve to Telit and other 3rd Party SW exclusive rights for copyrighted computer programs,
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including � but not limited to - the exclusive right to copy or reproduce in any form the copyrighted products. Accordingly, any copyrighted computer programs contained in Telit's products described in this instruction manual shall not be copied (reverse engineered) or reproduced in any manner without the express written permission of the copyright owner, being Telit or the 3rd Party software supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or in any other way, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use arising by operation of law in the sale of a product.
Usage and Disclosure Restrictions
License Agreements
The software described in this document is owned by Telit and its licensors. It is furnished by express license agreement only and shall be used exclusively in accordance with the terms of such agreement.
Copyrighted Materials
The Software and the documentation are copyrighted materials. Making unauthorized copies is prohibited by the law. The software or the documentation shall not be reproduced, transmitted, transcribed, even partially, nor stored in a retrieval system, nor translated into any language or computer language, in any form or by any means, without prior written permission of Telit.
High Risk Materials
Components, units, or third-party goods used in the making of the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: operations of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems ("High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness eligibility for such High Risk Activities.
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Trademarks
TELIT and the Stylized T-Logo are registered in the Trademark Office. All other product or service names are property of their respective owners.
3rd Party Rights
The software may include 3rd Party's software Rights. In this case the user agrees to comply with all terms and conditions imposed in respect of such separate software rights. In addition to 3rd Party Terms, the disclaimer of warranty and limitation of liability provisions in this License, shall apply to the 3rd Party Rights software as well.
TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESSED OR IMPLIED FROM ANY 3RD PARTY REGARDING ANY SEPARATE FILES, ANY 3RD PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY 3RD PARTY MATERIALS FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY "OTHER CODES"), AND THE USE OF ANY OR ALL OTHER CODES IN CONNECTION WITH THE SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.
NO 3RD PARTY LICENSORS OF OTHER CODES MUST BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST OF PROFITS), HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODES OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Waiwer of Liability
IN NO EVENT WILL TELIT AND ITS AFFILIATES BE LIABLE FOR AY DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY INDIRECT DAMAGE OF ANY KIND WHATSOEVER, INCLUDING BUT NOT LIMITED TO REIMBURSEMENT OF COSTS, COMPENSATION OF ANY DAMAGE, LOSS OF PRODUCTION, LOSS OF PROFIT, LOSS OF USE, LOSS OF BUSINESS, LOSS OF DATA OR REVENUE, WHETHER OR NOT THE POSSIBILITY OF SUCH DAMAGES COULD HAVE BEEN REASONABLY FORESEEN, CONNECTD IN ANY WAY TO THE USE OF THE PRODUCT/S OR TO THE INFORMATION CONTAINED IN THE PRESENT DOCUMENTATION, EVEN IF TELIT AND/OR ITS AFFILIATES HAVE BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY.
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Safety Recommendations
Make sure the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and has to be avoided in areas where:
� it can interfere with other electronic devices, particularly in environments such as hospitals, airports, aircrafts, etc.
� there is a risk of explosion such as gasoline stations, oil refineries, etc. It is the responsibility of the user to enforce the country regulation and the specific environment regulation.
Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conformed to the security and fire prevention regulations. The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode.
The system integrator is responsible for the functioning of the final product. Therefore, the external components of the module, as well as any project or installation issue, have to be handled with care. Any interference may cause the risk of disturbing the GSM network or external devices or having an impact on the security system. Should there be any doubt, please refer to the technical documentation and the regulations in force. Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed carefully in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation.
The equipment is intended to be installed in a restricted area location.
The equipment must be supplied by an external specific limited power source in compliance with the standard EN 62368-1:2014.
The European Community provides some Directives for the electronic equipment introduced on the market. All of the relevant information is available on the European Community website:
https://ec.europa.eu/growth/sectors/electrical-engineering_en
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14. GLOSSARY
ADC
Analog � Digital Converter
CLK
Clock
CMOS
Complementary Metal � Oxide Semiconductor
CS
Chip Select
DAC
Digital � Analog Converter
DTE
Data Terminal Equipment
ESR
Equivalent Series Resistance
GPIO
General Purpose Input Output
HS
High Speed
HSDPA
High Speed Downlink Packet Access
HSIC
High Speed Inter Chip
HSUPA
High Speed Uplink Packet Access
I/O
Input Output
MISO
Master Input � Slave Output
MOSI
Master Output � Slave Input
PCB
Printed Circuit Board
RTC
Real Time Clock
SIM
Subscriber Identification Module
SPI
Serial Peripheral Interface
TTSC
Telit Technical Support Centre
UART
Universal Asynchronous Receiver Transmitter
UMTS
Universal Mobile Telecommunication System
USB
Universal Serial Bus
VNA
Vector Network Analyzer
VSWR
Voltage Standing Wave Radio
WCDMA
Wideband Code Division Multiple Access
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15. DOCUMENT HISTORY
Revision 7
Date 2021-02-02
6
2020-09-14
5
2020-07-22
4
2020-06-18
3
2020-06-10
2
2020-01-23
1
2019-08-29
0
2019-04-12
Changes
Reviewed template design and styles Section 2.4, update Chapter 4, update Sections 6.1, 6.2, 6.3, removed (redundant) Section 7.2, removed Section 8.4, measurements update Section 2.2, 2.5, 12.3, adding B86 update
Section 2.5, TX Power update Section 2.8, Temperature range update Chapter 12, Conformity assessment update
Conformity assessment update with ANATEL
The title of chapter 5.7.3.2 has been changed from "Modem serial port 2" in "Modem serial port 2 (USIF1)". The title of chapter 5.7.3.1 has been changed from "Modem serial port 1" in "Modem serial port 1 (USIF0)". In the table of chapter 3.1, the "Asynchronous serial port" section title has been changed in "Asynchronous serial port (USIF0)".
Conformity assessment update TX Output Power update Power Consumption section update GNSS Section update Applicability table update
Conformity assessment update Power consumption figures update RX Sensitivity figures update RF Section update Pull-up/down values update
Bands support updating Added ME910G1-WW Temperature range update Added power consumption figures Removed B14 Extended Voltage Range lower limit change
First issue
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