Datasheet for QUECTEL models including: 2021EC25ADL, XMR2021EC25ADL, EC25 Mini PCIe LTE Standard Module Series, LTE Standard Module Series, EC25 Mini PCIe
Quectel Wireless Solutions Company Limited 2021EC25ADL LTE Module XMR2021EC25ADL XMR2021EC25ADL 2021ec25adl
EC25 Mini PCIe Hardware Design LTE Standard Module Series Rev. EC25_Mini_PCIe_Hardware_Design_V2.4 Date: 2019-12-18 Status: Released www.quectel.com LTE Standard Module Series EC25 Mini PCIe Hardware Design Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai, China 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/sales.htm For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/technical.htm Or email to: support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS' REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved. EC25_Mini_PCIe_Hardware_Design 1 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design About the Document Revision History Revision 1.0 Date 2016-06-07 1.1 2017-01-24 2.0 2019-04-30 Author Description Mountain ZHOU/ Frank WANG Lyndon LIU/ Frank WANG Nathan LIU/ Frank WANG/ Ward WANG/ Ethan SHAN Initial 1. Deleted description of EC25-AUT Mini PCIe in Table 1. 2. Added description of EC25-AU and EC25-J Mini PCIe in Table 1. 3. Updated key features of EC25 Mini PCIe in Table 2. 4. Added current consumption in Chapter 4.7. 5. Updated conducted RF receiving sensitivity of EC25-A Mini PCIe in Table 17. 6. Added conducted RF receiving sensitivity of EC25-J Mini PCIe in Table 18. 1. Added new variants EC25-AF Mini PCIe, EC25-EU Mini PCIe, EC25-EC Mini PCIe, EC25-EUX Mini PCIe, EC25-MX Mini PCIe and their related information. 2. Updated LTEUMTS and GSM features, and added storage temperature range in Table 2. 3. Added pin definition and description of pin 3, 5, 44 in Figure 2 and Table 4. 4. Modified the reference circuit of USB interface in Figure 6. 5. Updated the mechanical dimension of EC25 Mini PCIe in Figure 18. 6. Added USIM_PRESENCE in (U)SIM interface and updated the reference circuit in Chapter 3.4. 7. Added COEX UART interface (under development) as UART interface in Chapter EC25_Mini_PCIe_Hardware_Design 2 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 3.6. 8. Modified description of W_DISABLE# signal in Chapter 3.8.3. 9. Modified description of LED_WWAN# signal in Chapter 3.8.5. 10. Updated description of antenna connection in Chapter 5. 11. Added thermal consideration in Chapter 6.7. 12. Added operating frequencies in Table 16. 13. Added GNSS frequency in Table 17. 14. Updated antenna requirements in Table 18. 15. Updated EC25 Mini PCIe conducted RF output power in Table 21. 16. Updated conducted RF receiving sensitivity of EC25-A Mini PCIe in Table 22. 17. Added conducted RF receiving sensitivity of EC25-AU Mini PCIe in Table 23. 18. Updated conducted RF receiving sensitivity of EC25-J Mini PCIe in Table 24. 19. Updated conducted RF receiving sensitivity of EC25-E Mini PCIe in Table 25. 20. Updated conducted RF receiving sensitivity of EC25-V Mini PCIe in Table 26. 21. Added conducted RF receiving sensitivity of EC25-AF Mini PCIe in Table 27. 22. Added conducted RF receiving sensitivity of EC25-EU Mini PCIe in Table 28. 23. Added conducted RF receiving sensitivity of EC25-EC Mini PCIe in Table 29. 24. Added conducted RF receiving sensitivity of EC25-EUX Mini PCIe in Table 30. 25. Added current consumption of EC25-AU Mini PCIe in Table 33. 26. Added current consumption of EC25-J Mini PCIe in Table 34. 27. Added current consumption of EC25-AF Mini PCIe in Table 37. 28. Added current consumption of EC25-EC Mini PCIe in Table 38. 29. Added current consumption of EC25-EUX Mini PCIe in Table 39. 1. Added EC25-AFX/-AUX Mini PCIe and 2.1 2019-07-05 Fanny CHEN/ Ethan SHAN related information. 2. Updated supported protocols and USB serial EC25_Mini_PCIe_Hardware_Design 3 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design drivers in Table 2. 3. Added EC25-AFX Mini PCIe conducted RF receiving sensitivity in Table 28. 4. Updated conducted RF receiving sensitivity of EC25-EU Mini PCIe in Table 29. 5. Updated EC25-AF Mini PCIe current consumption in Table 39. 6. Added EC25-AFX Mini PCIe current consumption in Table 42. 7. Added EC25-MX Mini PCIe conducted RF receiving sensitivity in Table 32. 8. Added EC25-MX Mini PCIe current consumption in Table 43. 1. Deleted the information of GNSS supported on EC25-EC Mini PCIe in Table 1. 2. Updated conducted RF receiving sensitivity of EC25-AU Mini PCIe in Table 24. 3. Updated conducted RF receiving sensitivity of EC25-EU Mini PCIe in Table 30. 4. Added conducted RF receiving sensitivity of 2.2 2019-08-19 Ward WANG/ Owen WEI EC25-AUX Mini PCIe in Table 34. 5. Updated current consumption of EC25-J Mini PCIe in Table 38. 6. Added current consumption of EC25-AUX Mini PCIe in Table 45. 7. Added current consumption of EC25-EU Mini PCIe in Table 46. 8. Deleted current consumption of EC21-EC Mini PCIe, and the data will be updated in the future version. 1. Removed the related information of ThreadX OS because the baseline has been updated. 2. Updated the supported protocols and USB serial drivers in Table 2. 3. Added operating modes of module in Chapter 2.3 2019-11-26 Fanny CHEN 3.3. 4. Updated description of W_DISABLE# in Chapter 3.10.3. 5. Updated the notes for GNSS performance in Chapter 4.2. 6. Updated the Mini PCI Express connector type in Figure 21. 2.4 2019-12-18 Ward WANG 1. Modified the I/O parameters definition of the I2C interface as OD in Table 4 and 11. EC25_Mini_PCIe_Hardware_Design 4 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 2. Modified the current consumption of EC25-EUX Mini PCIe in Table 43. EC25_Mini_PCIe_Hardware_Design 5 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Contents About the Document..................................................................................................................................................2 Contents........................................................................................................................................................................ 6 Table Index................................................................................................................................................................... 8 Figure Index............................................................................................................................................................... 10 1 Introduction....................................................................................................................................................... 11 1.1. Safety Information.................................................................................................................................14 2 Product Concept...............................................................................................................................................15 2.1. General Description..............................................................................................................................15 2.2. Description of Module Series..............................................................................................................16 2.3. Key Features......................................................................................................................................... 18 2.4. Functional Diagram.............................................................................................................................. 20 3 Application Interfaces.....................................................................................................................................21 3.1. Pin Assignment..................................................................................................................................... 21 3.2. Pin Description...................................................................................................................................... 22 3.3. Operating Modes.................................................................................................................................. 25 3.4. Power Saving........................................................................................................................................ 25 3.4.1. Sleep Mode................................................................................................................................. 25 3.4.2. Airplane Mode.............................................................................................................................26 3.5. Power Supply........................................................................................................................................ 26 3.6. (U)SIM Interface....................................................................................................................................27 3.7. USB Interface........................................................................................................................................ 29 3.8. UART Interfaces....................................................................................................................................30 3.8.1. Main UART Interface................................................................................................................. 30 3.8.2. COEX UART Interface*............................................................................................................. 31 3.9. PCM and I2C Interfaces...................................................................................................................... 32 3.10. Control and Indication Signals............................................................................................................35 3.10.1. RI Signal...................................................................................................................................... 35 3.10.2. DTR Signal.................................................................................................................................. 36 3.10.3. W_DISABLE# Signal................................................................................................................. 36 3.10.4. PERST# Signal...........................................................................................................................36 3.10.5. LED_WWAN# Signal................................................................................................................. 37 3.10.6. WAKE# Signal............................................................................................................................ 38 4 GNSS Receiver..................................................................................................................................................39 4.1. General Description..............................................................................................................................39 4.2. GNSS Performance..............................................................................................................................39 4.3. GNSS Frequency..................................................................................................................................40 5 Antenna Connection........................................................................................................................................41 5.1. Antenna Connectors............................................................................................................................ 41 5.1.1. Operating Frequency.................................................................................................................41 EC25_Mini_PCIe_Hardware_Design 6 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 5.2. Antenna Requirements........................................................................................................................ 43 5.3. Recommended Mating Plugs for Antenna Connection.................................................................. 44 6 Electrical, Reliability and Radio Characteristics.....................................................................................46 6.1. General Description..............................................................................................................................46 6.2. Power Supply Requirements.............................................................................................................. 46 6.3. I/O Requirements..................................................................................................................................47 6.4. RF Characteristics................................................................................................................................ 47 6.5. ESD Characteristics............................................................................................................................. 55 6.6. Current Consumption...........................................................................................................................55 6.7. Thermal Consideration........................................................................................................................ 75 7 Dimensions and Packaging...........................................................................................................................77 7.1. General Description..............................................................................................................................77 7.2. Mechanical Dimensions of EC25 Mini PCIe.................................................................................... 77 7.3. Standard Dimensions of Mini PCI Express...................................................................................... 78 7.4. Packaging Specifications.................................................................................................................... 79 8 Appendix A References..................................................................................................................................80 EC25_Mini_PCIe_Hardware_Design 7 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Table Index TABLE 1: DESCRIPTION OF EC25 MINI PCIE...........................................................................................................16 TABLE 2: KEY FEATURES OF EC25 MINI PCIE........................................................................................................ 18 TABLE 3: I/O PARAMETERS DEFINITION.................................................................................................................. 22 TABLE 4: PIN DESCRIPTION.........................................................................................................................................22 TABLE 5: OVERVIEW OF OPERATING MODES........................................................................................................25 TABLE 6: DEFINITION OF VCC_3V3 AND GND PINS..............................................................................................26 TABLE 7: PIN DEFINITION OF (U)SIM INTERFACE................................................................................................. 27 TABLE 8: PIN DEFINITION OF USB INTERFACE......................................................................................................29 TABLE 9: PIN DEFINITION OF MAIN UART INTERFACE........................................................................................ 31 TABLE 10: PIN DEFINITION OF COEX UART INTERFACE.....................................................................................31 TABLE 11: PIN DEFINITION OF PCM AND I2C INTERFACES................................................................................32 TABLE 12: PIN DEFINITION OF CONTROL AND INDICATION SIGNALS............................................................ 35 TABLE 13: AIRPLANE MODE CONTROLLED BY HARDWARE METHOD........................................................... 36 TABLE 14: AIRPLANE MODE CONTROLLED BY SOFTWARE METHOD............................................................ 36 TABLE 15: INDICATIONS OF NETWORK STATUS (AT+QCFG="LEDMODE",0, DEFAULT SETTING)...........38 TABLE 16: INDICATIONS OF NETWORK STATUS (AT+QCFG="LEDMODE",2).................................................38 TABLE 17: GNSS PERFORMANCE.............................................................................................................................. 39 TABLE 18: GNSS FREQUENCY.................................................................................................................................... 40 TABLE 19: OPERATING FREQUENCIES.................................................................................................................... 41 TABLE 20: ANTENNA REQUIREMENTS......................................................................................................................43 TABLE 21: POWER SUPPLY REQUIREMENTS.........................................................................................................46 TABLE 22: I/O REQUIREMENTS................................................................................................................................... 47 TABLE 23: CONDUCTED RF OUTPUT POWER OF EC25 MINI PCIE.................................................................. 47 TABLE 24: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-A MINI PCIE............................................... 48 TABLE 25: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-AU MINI PCIE............................................ 48 TABLE 26: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-J MINI PCIE................................................ 49 TABLE 27: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-E MINI PCIE............................................... 49 TABLE 28: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-V MINI PCIE............................................... 50 TABLE 29: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-AF MINI PCIE.............................................50 TABLE 30: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-AFX MINI PCIE.......................................... 51 TABLE 31: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-EU MINI PCIE............................................ 51 TABLE 32: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-EC MINI PCIE............................................ 52 TABLE 33: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-EUX MINI PCIE..........................................53 TABLE 34: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-MX MINI PCIE............................................53 TABLE 35: CONDUCTED RF RECEIVING SENSITIVITY OF EC25-AUX MINI PCIE..........................................54 TABLE 36: ESD CHARACTERISTICS OF EC25 MINI PCIE.....................................................................................55 TABLE 37: CURRENT CONSUMPTION OF EC25-A MINI PCIE............................................................................. 55 TABLE 38: CURRENT CONSUMPTION OF EC25-AU MINI PCIE.......................................................................... 56 TABLE 39: CURRENT CONSUMPTION OF EC25-J MINI PCIE.............................................................................. 59 TABLE 40: CURRENT CONSUMPTION OF EC25-E MINI PCIE............................................................................. 61 TABLE 41: CURRENT CONSUMPTION OF EC25-V MINI PCIE............................................................................. 63 EC25_Mini_PCIe_Hardware_Design 8 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design TABLE 42: CURRENT CONSUMPTION OF EC25-AF MINI PCIE...........................................................................63 TABLE 43: CURRENT CONSUMPTION OF EC25-EUX MINI PCIE........................................................................65 TABLE 44: CURRENT CONSUMPTION OF EC25-AFX MINI PCIE........................................................................ 67 TABLE 45: CURRENT CONSUMPTION OF EC25-MX MINI PCIE.......................................................................... 68 TABLE 46: CURRENT CONSUMPTION OF EC25-AUX MINI PCIE........................................................................69 TABLE 47: CURRENT CONSUMPTION OF EC25-EU MINI PCIE.......................................................................... 72 TABLE 48: GNSS CURRENT CONSUMPTION OF EC25 MINI PCIE SERIES MODULE...................................75 TABLE 49: RELATED DOCUMENTS.............................................................................................................................80 TABLE 50: TERMS AND ABBREVIATIONS................................................................................................................. 80 EC25_Mini_PCIe_Hardware_Design 9 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM............................................................................................................................ 20 FIGURE 2: PIN ASSIGNMENT....................................................................................................................................... 21 FIGURE 3: REFERENCE CIRCUIT OF POWER SUPPLY........................................................................................27 FIGURE 4: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR.28 FIGURE 5: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR....28 FIGURE 6: REFERENCE CIRCUIT OF USB INTERFACE........................................................................................30 FIGURE 7: REFERENCE CIRCUIT OF POWER SUPPLY........................................................................................31 FIGURE 8: TIMING IN PRIMARY MODE......................................................................................................................33 FIGURE 9: TIMING IN AUXILIARY MODE................................................................................................................... 34 FIGURE 10: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC.........................................34 FIGURE 11: RI BEHAVIORS........................................................................................................................................... 35 FIGURE 12: TIMING OF RESETTING MODULE........................................................................................................ 37 FIGURE 13: LED_WWAN# SIGNAL REFERENCE CIRCUIT DIAGRAM............................................................... 37 FIGURE 14: WAKE# BEHAVIOR....................................................................................................................................38 FIGURE 15: DIMENSIONS OF THE RECEPTACLE RF CONNECTORS (UNIT: MM).........................................44 FIGURE 16: MECHANICALS OF U.FL-LP MATING PLUGS.................................................................................... 44 FIGURE 17: SPACE FACTOR OF MATING PLUGS (UNIT: MM)............................................................................. 45 FIGURE 18: REFERENCED HEATSINK DESIGN...................................................................................................... 76 FIGURE 19: MECHANICAL DIMENSIONS OF EC25 MINI PCIE.............................................................................77 FIGURE 20: STANDARD DIMENSIONS OF MINI PCI EXPRESS...........................................................................78 FIGURE 21: DIMENSIONS OF THE MINI PCI EXPRESS CONNECTOR (MOLEX 679105700).......................79 EC25_Mini_PCIe_Hardware_Design 10 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 1 Introduction This document defines EC25 Mini PCIe module, and describes its air interfaces and hardware interfaces which are connected with customers' applications. This document helps customers quickly understand module interface specifications, electrical characteristics, mechanical specifications and other related information of the module. To facilitate application designs, it also includes some reference designs for customers' reference. The document, coupled with application notes and user guides, makes it easy to design and set up wireless applications with EC25 Mini PCIe. FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user's body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2021EC25ADL 4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed: LTE Band 2 :9.500dBi LTE Band 4:6.500dBi LTE Band 12 :10.197dB 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. EC25_Mini_PCIe_Hardware_Design 11 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs: A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the module's FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: "Contains Transmitter Module FCC ID: XMR2021EC25ADL" or "Contains FCC ID: XMR2021EC25ADL" must be used. The host OEM user manual must also contain clear instructions on how end users can find and/or access the module and the FCC ID. The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The user's manual or instruction manual for an intentional or unintentional radiator shall caution the user that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the user's authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Supplier's Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user's manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. IC Statement IRSS-GEN "This device complies with Industry Canada's licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device." or "Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : 1) l'appareil ne doit pas produire de brouillage; 2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement." Déclaration sur l'exposition aux rayonnements RF L'autre utilisé pour l'émetteur doit être installé pour fournir une distance de séparation d'au moins 20 cm de toutes EC25_Mini_PCIe_Hardware_Design 12 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word "Contains" or similar wording expressing the same meaning, as follows: "Contains IC: 10224A-2021EC25ADL" or "where: 10224A-2021EC25ADLis the module's certification number". Le produit hôte doit être correctement étiqueté pour identifier les modules dans le produit hôte. L'étiquette de certification d'Innovation, Sciences et Développement économique Canada d'un module doit être clairement visible en tout temps lorsqu'il est installédans le produit hôte; sinon, le produit hôte doit porter une étiquette indiquant le numéro de certification d'Innovation, Sciences et Développement économique Canada pour le module, précédé du mot «Contient» ou d'un libellé semblable exprimant la même signification, comme suit: "Contient IC: 10224A-2021EC25ADL" ou "où: 10224A-2021EC25ADLest le numéro de certification du module". LTE Band 2 :9.500dBi LTE Band 4:6.500dBi LTE Band 12 :7.11dBi EC25_Mini_PCIe_Hardware_Design 13 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC25 Mini PCIe module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers' failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft. Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities. Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength. The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc. EC25_Mini_PCIe_Hardware_Design 14 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 2 Product Concept 2.1. General Description EC25 Mini PCIe module provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks with PCI Express Mini Card 1.2 standard interface. It supports embedded operating systems such as Linux, Android, etc., and also provides audio, high-speed data transmission and GNSS functionalities for customers' applications. EC25 Mini PCIe module can be applied in the following fields: PDA and Laptop Computer Remote Monitor System Vehicle System Wireless POS System Intelligent Meter Reading System Wireless Router and Switch Other Wireless Terminal Devices This chapter generally introduces the following aspects of EC25 Mini PCIe module: Product Series Key Features Functional Diagram NOTE EC25 Mini PCIe contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. EC25_Mini_PCIe_Hardware_Design 15 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 2.2. Description of Module Series EC25 Mini PCIe series contains 12 variants, and are listed in the following table. Table 1: Description of EC25 Mini PCIe Module Series EC25-A Mini PCIe EC25-AU Mini PCIe3) EC25-J Mini PCIe EC25-E Mini PCIe EC25-V Mini PCIe EC25-AF Mini PCIe Description Support LTE-FDD: B2/B4/B12 Support WCDMA: B2/B4/B5 Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B1/B2/B3/B4/B5/B7/B8/B28 Support LTE-TDD: B40 Support WCDMA: B1/B2/B5/B8 Support GSM: 850/900/1800/1900MHz Support LTE/WCDMA receive diversity3) Support GNSS1) Support digital audio2) Support LTE-FDD: B1/B3/B8/B18/B19/B26 Support LTE-TDD: B41 Support WCDMA: B1/B6/B8/B19 Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B1/B3/B5/B7/B8/B20 Support LTE-TDD: B38/B40/B41 Support WCDMA: B1/B5/B8 Support GSM: 900/1800MHz Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B4/B13 Support LTE receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B2/B4/B5/B12/B13/B14/B66/B71 Support WCDMA: B2/B4/B5 Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) EC25_Mini_PCIe_Hardware_Design 16 / 80 EC25-EU Mini PCIe EC25-EC Mini PCIe EC25-EUX Mini PCIe EC25-MX Mini PCIe EC25-AFX Mini PCIe EC25-AUX Mini PCIe3) LTE Standard Module Series EC25 Mini PCIe Hardware Design Support LTE-FDD: B1/B3/B7/B8/B20/B28A Support LTE-TDD: B38/B40/B41 Support WCDMA: B1/B8 Support GSM: 900/1800MHz Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B1/B3/B7/B8/B20/B28A Support WCDMA: B1/B8 Support GSM: 900/1800MHz Support LTE/WCDMA receive diversity Support digital audio2) Support LTE-FDD: B1/B3/B7/B8/B20/B28A Support LTE-TDD: B38/B40/B41 Support WCDMA: B1/B8 Support GSM: 900/1800MHz Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B2/B4/B5/B7/B28/B66 Support WCDMA: B2/B4/B5 Support LTE/WCDMA receive diversity Support digital audio2) Support LTE-FDD: B2/B4/B5/B12/B13/B14/B66/B71 Support WCDMA: B2/B4/B5 Support LTE/WCDMA receive diversity Support GNSS1) Support digital audio2) Support LTE-FDD: B1/B2/B3/B4/B5/B7/B8/B283) Support LTE-TDD: B40 Support WCDMA: B1/B2/B4/B5/B8 Support GSM: 850/900/1800/1900MHz Support LTE/WCDMA receive diversity3) Support GNSS1) Support digital audio2) NOTES 1. 1) GNSS function is optional. 2. 2) Digital audio (PCM) function is only supported on Telematics version. 3. 3) B2 on EC25-AU and EC25-AUX Mini PCIe does not support Rx-diversity. EC25_Mini_PCIe_Hardware_Design 17 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 2.3. Key Features The following table describes the detailed features of EC25 Mini PCIe module. Table 2: Key Features of EC25 Mini PCIe Features Function Interface Power Supply Transmitting Power LTE Features UMTS Features GSM Features Description PCI Express Mini Card 1.2 Standard Interface Supply voltage: 3.0V~3.6V Typical supply voltage: 3.3V Class 4 (33dBm±2dB) for GSM850 Class 4 (33dBm±2dB) for EGSM900 Class 1 (30dBm±2dB) for DCS1800 Class 1 (30dBm±2dB) for PCS1900 Class E2 (27dBm±3dB) for GSM850 8-PSK Class E2 (27dBm±3dB) for EGSM900 8-PSK Class E2 (26dBm±3dB) for DCS1800 8-PSK Class E2 (26dBm±3dB) for PCS1900 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm±2dB) for LTE-FDD bands Class 3 (23dBm±2dB) for LTE-TDD bands Support up to 3GPP R8 non-CA Cat 4 FDD and TDD Support 1.4/3/5/10/15/20MHz RF bandwidth Support MIMO in DL direction LTE-FDD: Max 150Mbps (DL)/Max 50Mbps (UL) LTE-TDD: Max 130Mbps (DL)/Max 30Mbps (UL) Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16-QAM and 64-QAM modulation DC-HSDPA: Max 42Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL) GPRS: Support GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107Kbps (DL)/Max 85.6Kbps (UL) EDGE: Support EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 EC25_Mini_PCIe_Hardware_Design 18 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Max 296Kbps (DL)/Max 236.8Kbps (UL) Internet Protocol Features SMS Support TCP/UDP/PPP/FTP/FTPS/HTTP/HTTPS/NTP/PING/QMI/NITZ/ SMTP/SSL/MQTT/CMUX/SMTPS/MMS*/FILE* protocols Support protocols PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) which are usually used for PPP connection Text and PDU modes Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default (U)SIM Interface Support USIM/SIM card: 1.8V, 3.0V UART Interfaces Audio Features PCM Interface USB Interface Antenna Connectors Main UART: Support RTS and CTS hardware flow control Baud rate can reach up to 230400bps, 115200bps by default Used for AT command communication and data transmission COEX UART*: LTE/WLAN&BT coexistence UART Support one digital audio interface: PCM interface GSM: HR/FR/EFR/AMR/AMR-WB WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame synchronization Compliant with USB 2.0 specification (slave only); the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, firmware upgrade, software debugging, GNSS NMEA output and voice over USB. Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6~5.4, Android 4.x/5.x/6.x/7.x/8.x/9.x, etc. Include main antenna, diversity antenna and GNSS antenna receptacle connectors Rx-diversity (Optional) Support LTE/WCDMA Rx-diversity GNSS Features AT Commands Gen8C Lite of Qualcomm Protocol: NMEA 0183 Data update rate: 1Hz by default Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands EC25_Mini_PCIe_Hardware_Design 19 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Physical Characteristics Temperature Range Firmware Upgrade RoHS Size: (51.0±0.15)mm × (30.0±0.15)mm × (4.9±0.2)mm Weight: approx. 9.8g Operation temperature range: -35°C to +75°C1) Extended temperature range: -40°C to +80°C2) Storage temperature range: -40°C to +90°C Upgrade via USB interface or DFOTA All hardware components are fully compliant with EU RoHS directive NOTES 1. 1) Within operation temperature range, the module is 3GPP compliant. 2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call*, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP specifications again. 3. "*" means under development. 2.4. Functional Diagram The following figure shows the block diagram of EC25 Mini PCIe. Mini PCI Express Interface VCC Boost Circuit USB PCM&I2C UART (U)SIM W_DISABLE# PERST# DTR WAKE# RI LED_WWAN# VBAT EC25 Module Ma in Antenna Connector GNSS Antenna Connector Diversity Antenna Connector Main Antenna GNSS Antenna Diversity Antenna Figure 1: Functional Diagram EC25_Mini_PCIe_Hardware_Design 20 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 3 Application Interfaces The physical connections and signal levels of EC25 Mini PCIe comply with PCI Express Mini Card Electromechanical Specification. This chapter mainly describes the definition and application of the following interfaces/pins of EC25 Mini PCIe. Power supply (U)SIM interface USB interface UART interfaces PCM and I2C interfaces Control and indication pins 3.1. Pin Assignment The following figure shows the pin assignment of EC25 Mini PCIe module. The top side contains EC25 module and antenna connectors. Figure 2: Pin Assignment EC25_Mini_PCIe_Hardware_Design 21 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 3.2. Pin Description The following tables show the pin definition and description of the 52 pins on EC25 Mini PCIe. Table 3: I/O Parameters Definition Type DI DO IO OC PI PO OD Description Digital Input Digital Output Bidirectional Open Collector Power Input Power Output Open drain Table 4: Pin Description Pin No. Mini PCI Express Standard Name EC25 Mini PCIe Pin Name 1 WAKE# WAKE# 2 3.3Vaux VCC_3V3 3 COEX1 4 GND 5 COEX2 6 1.5V 7 CLKREQ# COEX_UART_RX GND COEX_UART_TX NC RESERVED I/O Description Comment OC Output signal used to wake up the host. PI 3.0V~3.6V, typically 3.3V DC supply LTE/WLAN&BT DI coexistence receive signal It is prohibited to be pulled up high before startup. Mini card ground DO LTE/WLAN&BT coexistence transmitting signal It is prohibited to be pulled up high before startup. Not connected Reserved EC25_Mini_PCIe_Hardware_Design 22 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 8 UIM_PWR 9 GND 10 UIM_DATA USIM_VDD GND USIM_DATA 11 REFCLK- UART_RX 12 UIM_CLK USIM_CLK 13 REFCLK+ UART_TX 14 UIM_RESET USIM_RST 15 GND GND PO Power supply for the (U)SIM card Mini card ground IO Data signal of (U)SIM card DI UART receive data DO Clock signal of (U)SIM card DO UART transmit data DO Reset signal of (U)SIM card Mini card ground Connect to DTE's TX. Connect to DTE's RX. 16 UIM_VPP RESERVED Reserved 17 RESERVED RI DO Ring indication 18 GND GND Mini card ground 19 RESERVED RESERVED Reserved Pulled up by 20 W_DISABLE# W_DISABLE# DI Airplane mode control default. Active low. 21 GND GND Mini card ground 22 PERST# 23 PERn0 PERST# UART_CTS DI Fundamental reset signal DI UART clear to send Pulled up by default. Active low. Connect to DTE's RTS. 24 3.3Vaux RESERVED Reserved 25 PERp0 UART_RTS DO UART request to send Connect to DTE's CTS. 26 GND GND Mini card ground 27 GND GND Mini card ground 28 1.5V NC Not connected 29 GND GND Mini card ground EC25_Mini_PCIe_Hardware_Design 23 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 30 SMB_CLK 31 PETn0 32 SMB_DATA 33 PETp0 I2C_SCL DTR I2C_SDA RESERVED OD I2C serial clock DI Sleep mode control OD I2C serial data Reserved Require external pull-up to 1.8V. Require external pull-up to 1.8V. 34 GND GND Mini card ground 35 GND GND Mini card ground 36 USB_D- USB_DM Require IO USB differential data (-) differential impedance of 90. 37 GND GND Mini card ground 38 USB_D+ 39 3.3Vaux USB_DP VCC_3V3 Require IO USB differential data (+) differential impedance of 90. PI 3.0V~3.6V, typically 3.3V DC supply 40 GND GND Mini card ground 41 3.3Vaux VCC_3V3 PI 3.0V~3.6V, typically 3.3V DC supply LED signal for indicating 42 LED_WWAN# LED_WWAN# OC the network status of Active low the module 43 GND GND Mini card ground 44 LED_WLAN# USIM_PRESENCE DI (U)SIM card insertion detection 45 RESERVED PCM_CLK1) IO PCM clock signal 46 LED_WPAN# RESERVED Reserved 47 RESERVED PCM_DOUT1) DO PCM data output 48 1.5V NC Not connected 49 RESERVED PCM_DIN1) DI PCM data input EC25_Mini_PCIe_Hardware_Design 24 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 50 GND 51 RESERVED 52 3.3Vaux GND PCM_SYNC1) VCC_3V3 Mini card ground IO PCM frame synchronization PI 3.0V~3.6V, typically 3.3V DC supply NOTES 1. 1) The digital audio (PCM) function is only supported on Telematics version. 2. Keep all NC, reserved and unused pins unconnected. 3.3. Operating Modes The following table briefly outlines the operating modes to be mentioned in the following chapters. Table 5: Overview of Operating Modes Mode Normal Operation Minimum Functionality Mode Airplane Mode Sleep Mode Details Idle Software is active. The module has registered on the network, and it is ready to send and receive data. Talk/Data Network connection is ongoing. In this mode, the power consumption is decided by network setting and data transfer rate. AT+CFUN command can set the module to a minimum functionality mode without removing the power supply. In this case, both RF function and (U)SIM card will be invalid. AT+CFUN command or W_DISABLE# pin can set the module to airplane mode. In this case, RF function will be invalid. In this mode, the current consumption of the module will be reduced to the minimal level. In this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. 3.4. Power Saving 3.4.1. Sleep Mode EC25 Mini PCIe is able to reduce its current consumption to a minimum value in sleep mode. There are three preconditions must be met to make the module enter sleep mode. EC25_Mini_PCIe_Hardware_Design 25 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Execute AT+QSCLK=1 to enable sleep mode. Ensure the DTR is kept at high level or be kept open. The host's USB bus, which is connected with the module's USB interface, enters suspend state. 3.4.2. Airplane Mode When the module enters airplane mode, the RF function will be disabled, and all AT commands related to it will be inaccessible. For more details, please refer to Chapter 3.10.3. 3.5. Power Supply The following table shows pin definition of VCC_3V3 pins and ground pins. Table 6: Definition of VCC_3V3 and GND Pins Pin Name VCC_3V3 GND Pin No. I/O 2, 39, 41, 52 PI 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50 Power Domain 3.0V~3.6V Description Typically 3.3V DC supply Mini card ground The typical supply voltage of EC25 Mini PCIe is 3.3V. In the 2G network, the input peak current may reach 2.7A during the transmitting time. Therefore, the power supply must be able to provide a rated output current of 2.7A at least, and a bypass capacitor of no less than 470µF with low ESR should be used to prevent the voltage from dropping. If the switching power supply is used to supply power to the module, the power device and power supply routing traces of the switching power supply should avoid the antennas as much as possible to prevent EMI interference. The following figure shows a reference design of power supply where R2 and R3 are 1% tolerance resistors and C3 is a low-ESR capacitor. EC25_Mini_PCIe_Hardware_Design 26 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Figure 3: Reference Circuit of Power Supply 3.6. (U)SIM Interface EC25 Mini PCIe's (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.0V (U)SIM cards are supported. The following table shows the pin definition of (U)SIM interface. Table 7: Pin Definition of (U)SIM Interface Pin Name USIM_VDD USIM_DATA USIM_CLK USIM_RST USIM_PRESENCE Pin No. I/O 8 PO 10 IO 12 DO 14 DO 44 DI Power Domain 1.8V/3.0V 1.8V/3.0V 1.8V/3.0V 1.8V/3.0V 1.8V Description Power supply for (U)SIM card Data signal of (U)SIM card Clock signal of (U)SIM card Reset signal of (U)SIM card (U)SIM card insertion detection EC25 Mini PCIe supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections. By default, It is disabled, and can be configured via AT+QSIMDET command. Please refer to document [2] for details about the command. The following figure shows a reference design for (U)SIM interface with an 8-pin (U)SIM card connector. EC25_Mini_PCIe_Hardware_Design 27 / 80 Module GND USIM_VDD USIM_RST 0R USIM_CLK 0R USIM_PRESENCE USIM_DATA 0R USIM_VDD 15K LTE Standard Module Series EC25 Mini PCIe Hardware Design 100nF (U)SIM Card Connector VCC RST CLK GND VPP IO 33pF 33pF 33pF GND GND GND Figure 4: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. Module GND USIM_VDD USIM_RST USIM_CLK USIM_DATA USIM_VDD 15K 0R 0R 0R 33pF 33pF 33pF 100nF (U)SIM Card Connector VCC RST CLK GND VPP IO GND GND Figure 5: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector EC25_Mini_PCIe_Hardware_Design 28 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design In order to enhance the reliability and availability of the (U)SIM card in customers' applications, please follow the criteria below in (U)SIM circuit design: Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible. Keep (U)SIM card signals away from RF and power supply traces. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground. In order to offer good ESD protection, it is recommended to add a TVS diode with parasitic capacitance not exceeding 15pF. The 0 resistors should be added in series between the module and the (U)SIM card connector so as to facilitate debugging. The 33pF capacitors are used for filtering interference of EGSM900. Please note that the (U)SIM peripheral circuit should be close to the (U)SIM card connector. The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace and sensitive occasion are applied, and should be placed close to the (U)SIM card connector. 3.7. USB Interface EC25 Mini PCIe provides one integrated Universal Serial Bus (USB) interface which complies with USB 2.0 specification. It can only be used as a slave device. Meanwhile, it supports high speed (480Mbps) mode and full speed (12Mbps) mode. The USB interface is used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB. The following table shows the pin definition of USB interface. Table 8: Pin Definition of USB Interface Pin Name USB_DM USB_DP Pin No. I/O Description 36 IO USB differential data (-) 38 IO USB differential data (+) Comment Require differential impedance of 90 Require differential impedance of 90 The following figure shows a reference circuit of USB interface. EC25_Mini_PCIe_Hardware_Design 29 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Module Minimize these stubs Test Points R3 NM_0R R4 NM_0R MCU USB_DM USB_DP GND L1 ESD Array Close to Module USB_DM USB_DP GND Figure 6: Reference Circuit of USB Interface A common mode choke L1 is recommended to be added in series between the module and customer's MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default. In order to ensure the integrity of USB data line signal, L1/R3/R4 components must be placed close to the module, and also these resistors should be placed close to each other. The extra stubs of trace must be as short as possible. The following principles should be complied with when design the USB interface, so as to meet USB 2.0 specification. It is important to route the USB signal traces as differential pairs with total grounding. The impedance of USB differential trace is 90. Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is important to route the USB differential traces in inner layer with ground shielding on not only upper and lower layers but also right and left sides. Keep the ESD protection components to the USB connector as close as possible. 3.8. UART Interfaces The following table shows the pin definition of the main UART and COEX UART* interfaces. 3.8.1. Main UART Interface The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps and 230400bps baud rates, and the default is 115200bps. This interface supports RTS and CTS hardware flow control, and be used for AT command communication and data transmission. EC25_Mini_PCIe_Hardware_Design 30 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design The following table shows the pin definition of the main UART interface. Table 9: Pin Definition of Main UART Interface Pin Name UART_RX UART_TX UART_CTS UART_RTS Pin No. I/O 11 DI 13 DO 23 DI 25 DO Power Domain 3.3V 3.3V 3.3V 3.3V Description UART receive data UART transmit data UART clear to send UART request to send The signal level of main UART interface is 3.3V. When connecting to the peripheral MCU/RAM, customers need to pay attention to the signal direction. The reference circuit is as follows: MCU/ARM TXD RXD RTS CTS GND Module UART_TXD UART_RXD UART_RTS UART_CTS GND Voltage level: 3.3V Voltage level: 3.3V Figure 7: Reference Circuit of Power Supply 3.8.2. COEX UART Interface* The following table shows the pin definition of the COEX UART interface. Table 10: Pin Definition of COEX UART Interface Pin No. Pin Name I/O 3 COEX_UART_RX DI Power Domain 1.8V Description LTE/WLAN&BT coexistence receive signal. It is prohibited to be pulled up high EC25_Mini_PCIe_Hardware_Design 31 / 80 5 COEX_UART_TX DO 1.8V LTE Standard Module Series EC25 Mini PCIe Hardware Design before startup. LTE/WLAN&BT coexistence transmitting signal. It is prohibited to be pulled up high before startup. NOTES 1. AT+IPR command can be used to set the baud rate of the main UART, and AT+IFC command can be used to set the hardware flow control (hardware flow control is disabled by default). Please refer to document [2] for details. 2. "*" means under development. 3.9. PCM and I2C Interfaces EC25 Mini PCIe provides one Pulse Code Modulation (PCM) digital interface and one I2C interface. The following table shows the pin definition of PCM and I2C interfaces that can be applied in audio codec design. Table 11: Pin Definition of PCM and I2C Interfaces Pin Name PCM_CLK PCM_DOUT PCM_DIN PCM_SYNC I2C_SCL I2C_SDA Pin No. I/O 45 IO 47 DO 49 DI 51 IO 30 OD 32 OD Power Domain 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V Description PCM clock signal PCM data output PCM data input PCM frame synchronization I2C serial clock. Require external pull-up to 1.8V. I2C serial data. Require external pull-up to 1.8V. EC25 Mini PCIe provides one PCM digital interface, which supports 16-bit linear data format and the following modes: Primary mode (short frame synchronization, works as either master or slave) EC25_Mini_PCIe_Hardware_Design 32 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Auxiliary mode (long frame synchronization, works as master only) NOTE The digital audio (PCM) function is only supported on Telematics version. In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK at 8kHz PCM_SYNC, and also supports 4096kHz PCM_CLK at 16kHz PCM_SYNC. The following figure shows the timing relationship in primary mode with 8kHz PCM_SYNC and 2048kHz PCM_CLK. Figure 8: Timing in Primary Mode In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC rising edge represents the MSB. In this mode, the PCM interface operates with a 256kHz, 512kHz, 1024kHz or 2048kHz PCM_CLK and an 8KHz, 50% duty cycle PCM_SYNC. The following figure shows the timing relationship in auxiliary mode with 8kHz PCM_SYNC and 256kHz PCM_CLK. EC25_Mini_PCIe_Hardware_Design 33 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Figure 9: Timing in Auxiliary Mode Clock and mode can be configured by AT command, and the default configuration is master mode using short frame synchronization format with 2048kHz PCM_CLK and 8kHz PCM_SYNC. In addition, EC25 Mini PCIe's firmware has integrated the configuration on some PCM codec's application with I2C interface. Please refer to document [2] for details about AT+QDAI command. The following figure shows a reference design of PCM interface with an external codec IC. Figure 10: Reference Circuit of PCM Application with Audio Codec NOTE Digital audio (PCM) function is only supported on Telematics version. EC25_Mini_PCIe_Hardware_Design 34 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 3.10. Control and Indication Signals The following table shows the pin definition of control and indication signals. Table 12: Pin Definition of Control and Indication Signals Pin Name RI DTR W_DISABLE# PERST# LED_WWAN# WAKE# Pin No. I/O 17 DO 31 DI 20 DI 22 DI 42 OC 1 OC Power Domain Description 3.3V Output signal used to wake up the host 3.3V 3.3V 3.3V Sleep mode control Airplane mode control; Pulled up by default; Active low. Fundamental reset signal; Active low. LED signal for indicating the network status of the module; Active low. Output signal to wake up the host. 3.10.1. RI Signal The RI signal can be used to wake up the host. When a URC returns, there will be the following behaviors on the RI pin after executing AT+QCFG="risignaltype","physical". Figure 11: RI Behaviors EC25_Mini_PCIe_Hardware_Design 35 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 3.10.2. DTR Signal The DTR signal is used for sleep mode control. It is pulled up by default. When module is in sleep mode, driving it to low level can wake up the module. For more details about the preconditions for module to enter sleep mode, please refer to Chapter 3.4.1. 3.10.3. W_DISABLE# Signal EC25 Mini PCIe provides a W_DISABLE# signal to disable or enable the RF function (excluding GNSS). The W_DISABLE# pin is pulled up by default. Its control function for airplane mode is disabled by default, and AT+QCFG="airplanecontrol",1 can be used to enable the function. Driving it to low level can make the module enter airplane mode. The RF function can also be enabled or disabled through AT commands AT+CFUN, and the details are as follows. Table 13: Airplane Mode Controlled by Hardware Method W_DISABLE# High level Low level RF Function Status RF enabled RF disabled Module Operation Mode Normal mode Airplane mode Software method can be controlled by AT+CFUN, and the details are as follows. Table 14: Airplane Mode Controlled by Software Method AT+CFUN=? 0 1 4 RF Function Status RF and (U)SIM disabled RF enabled RF disabled Module Operation Mode Minimum functionality mode Normal mode Airplane mode 3.10.4. PERST# Signal The PERST# signal can be used to force a hardware reset on the card. The module can be reset by driving the PERST# signal low for 150ms~460ms and then releasing it. The PERST# signal is sensitive to interference. The traces should be as short as possible and be surrounded with ground. The reset scenario is illustrated in the following figure. EC25_Mini_PCIe_Hardware_Design 36 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Figure 12: Timing of Resetting Module 3.10.5. LED_WWAN# Signal The LED_WWAN# signal of EC25 Mini PCIe is used to indicate the network status of the module, and can absorb a current up to 40mA. According to the following circuit, in order to reduce the current of the LED, a resistor must be placed in series with the LED. The LED is emitting light when the LED_WWAN# output signal is low. Figure 13: LED_WWAN# Signal Reference Circuit Diagram There are two indication modes for LED_WWAN# signal to indicate network status, which can be switched through following AT commands: AT+QCFG="ledmode",0 (Default setting) AT+QCFG="ledmode",2 The following tables show the detailed network status indications of the LED_WWAN# signal. EC25_Mini_PCIe_Hardware_Design 37 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Table 15: Indications of Network Status (AT+QCFG="ledmode",0, Default Setting) Pin Status Flicker slowly (200ms Low/1800ms High) Flicker slowly (1800ms Low/200ms High) Flicker quickly (125ms Low/125ms High) Always Low Description Network searching Idle Data transfer is ongoing Voice calling Table 16: Indications of Network Status (AT+QCFG="ledmode",2) Pin Status Low Level (Light ON) High Impedance (Light OFF) Description Registered on network successfully No network coverage or not registered W_DISABLE# signal is at low level. (Disable RF) AT+CFUN=0, AT+CFUN=4 3.10.6. WAKE# Signal The WAKE# signal is an open collector signal which is similar to RI signal, but a host pull-up resistor and AT+QCFG="risignaltype","physical" command are required. When a URC returns, a 120ms low level pulse will be outputted. The state of WAKE# signal is shown as below. Figure 14: WAKE# Behavior EC25_Mini_PCIe_Hardware_Design 38 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 4 GNSS Receiver 4.1. General Description EC25 Mini PCIe includes a fully integrated global navigation satellite system solution that supports Qualcomm Gen8C Lite (GPS, GLONASS, BeiDou/Compass, Galileo and QZSS). Additionally, it supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EC25 Mini PCIe GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, please refer to document [3]. 4.2. GNSS Performance The following table shows the GNSS performance of EC25 Mini PCIe. Table 17: GNSS Performance Parameter Sensitivity (GNSS) Description Cold start Reacquisition Tracking Cold start @open sky TTFF (GNSS) Warm start @open sky Hot start @open sky Conditions Autonomous Autonomous Autonomous Autonomous XTRA enabled Autonomous XTRA enabled Autonomous XTRA enabled Typ. -146 -157 -157 35 18 26 2.2 2.5 1.8 Unit dBm dBm dBm s s s s s s EC25_Mini_PCIe_Hardware_Design 39 / 80 Accuracy (GNSS) CEP-50 LTE Standard Module Series EC25 Mini PCIe Hardware Design Autonomous @open sky <2.5 m NOTES 1. Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously). 2. Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock. 3. Cold start sensitivity: the minimum GNSS signal power at which the module can fix position successfully within 3 minutes after executing cold start command. 4.3. GNSS Frequency The following table shows the GNSS frequency of EC25 Mini PCIe. Table 18: GNSS Frequency Type GPS GLONASS Galileo BeiDou (Compass) QZSS Frequency 1575.42±1.023 1597.5~1605.8 1575.42±2.046 1561.098±2.046 1575.42 Unit MHz MHz MHz MHz MHz EC25_Mini_PCIe_Hardware_Design 40 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 5 Antenna Connection 5.1. Antenna Connectors EC25 Mini PCIe is mounted with three antenna connectors for external antenna connection: a main antenna connector, an Rx-diversity antenna connector, and a GNSS antenna connector. And Rx-diversity function is enabled by default. The impedance of the antenna connectors is 50. 5.1.1. Operating Frequency Table 19: Operating Frequencies 3GPP Band GSM850 EGSM900 DCS1800 PCS1900 WCDMA B1 WCDMA B2 WCDMA B4 WCDMA B5 WCDMA B6 WCDMA B8 WCDMA B19 LTE-FDD B1 LTE-FDD B2 Transmit 824~849 880~915 1710~1785 1850~1910 1920~1980 1850~1910 1710~1755 824~849 830~840 880~915 830~845 1920~1980 1850~1910 Receive 869~894 925~960 1805~1880 1930~1990 2110~2170 1930~1990 2110~2155 869~894 875~885 925~960 875~890 2110~2170 1930~1990 Unit MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz EC25_Mini_PCIe_Hardware_Design 41 / 80 LTE-FDD B3 LTE-FDD B4 LTE-FDD B5 LTE-FDD B7 LTE-FDD B8 LTE-FDD B12 LTE-FDD B13 LTE-FDD B14 LTE-FDD B18 LTE-FDD B19 LTE-FDD B20 LTE-FDD B26 LTE-FDD B28 LTE-TDD B38 LTE-TDD B40 LTE-TDD B41 LTE-FDD B66 LTE-FDD B71 1710~1785 1710~1755 824~849 2500~2570 880~915 699~716 777~787 788~798 815~830 830~845 832~862 814~849 703~748 2570~2620 2300~2400 2555~2655 1710~1780 663~698 LTE Standard Module Series EC25 Mini PCIe Hardware Design 1805~1880 2110~2155 869~894 2620~2690 925~960 729~746 746~756 758~768 860~875 875~890 791~821 859~894 758~803 2570~2620 2300~2400 2555~2655 2100~2200 617~652 MHz MHz MHz MHz MHz MHz MHz MHZ MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz EC25_Mini_PCIe_Hardware_Design 42 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 5.2. Antenna Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 20: Antenna Requirements Type GNSS1) GSM/UMTS/LTE Requirements Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0dBi Active antenna noise figure: < 1.5dB Active antenna gain: > 0dBi Active antenna embedded LNA gain: < 17dB VSWR: 2 Efficiency: > 30% Max input power: 50W Input impedance: 50 Cable insertion loss: < 1dB (GSM850, EGSM900, WCDMA B5/B6/B8/B19, LTE-FDD B5/B8/B12/B13/B14/B18/B19/B20/B26/B28/B71) Cable insertion loss: < 1.5dB (DCS1800, PCS1900, WCDMA B1/B2/B4, LTE-FDD B1/B2/B3/B4/B66) Cable insertion loss: < 2dB (LTE-FDD B7, LTE-TDD B38/B40/B41) NOTES 1. It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 2. Since the GNSS port has a 2.85V voltage output, a passive antenna that causes shorting to GND, such as PIFA antenna is not recommended. EC25_Mini_PCIe_Hardware_Design 43 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 5.3. Recommended Mating Plugs for Antenna Connection EC25 Mini PCIe is mounted with RF connectors (receptacles) for convenient antenna connection. The dimensions of the antenna connectors are shown as below. Figure 15: Dimensions of the Receptacle RF Connectors (Unit: mm) U.FL-LP mating plugs listed in the following figure can be used to match the receptacles. Figure 16: Mechanicals of U.FL-LP Mating Plugs EC25_Mini_PCIe_Hardware_Design 44 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design The following figure describes the space factor of mating plugs. Figure 17: Space Factor of Mating Plugs (Unit: mm) For more details of the recommended mating plugs, please visit http://www.hirose.com. EC25_Mini_PCIe_Hardware_Design 45 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. General Description This chapter mainly describes the following electrical and radio characteristics of EC25 Mini PCIe: Power supply requirements I/O requirements RF characteristics ESD characteristics Current consumption Thermal consideration 6.2. Power Supply Requirements The input voltage of EC25 Mini PCIe is 3.0V~3.6V, as specified by PCI Express Mini CEM Specifications 1.2. The following table shows the power supply requirements of EC25 Mini PCIe. Table 21: Power Supply Requirements Parameter Description Min. Typ. Max. Unit VCC_3V3 Power Supply 3.0 3.3 3.6 V EC25_Mini_PCIe_Hardware_Design 46 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 6.3. I/O Requirements The following table shows the I/O requirements of EC25 Mini PCIe. Table 22: I/O Requirements Parameter Description Min. Max. Unit VIH Input High Voltage 0.7 × VCC_3V3 VCC_3V3 + 0.3 V VIL Input Low Voltage -0.3 0.3 × VCC_3V3 V VOH Output High Voltage VCC_3V3 - 0.5 VCC_3V3 V VOL Output Low Voltage 0 0.4 V NOTES 1. The PCM and I2C interfaces belong to 1.8V power domain and other I/O interfaces belong to VCC_3V3 power domain. 2. The maximum voltage value of VIL for PERST# signal and W_DISABLE# signal is 0.5V. 6.4. RF Characteristics The following tables show the conducted RF output power and receiving sensitivity of EC25 Mini PCIe module. Table 23: Conducted RF Output Power of EC25 Mini PCIe Frequency Bands GSM850/EGSM900 DCS1800/PCS1900 GSM850/EGSM900 (8-PSK) DCS1800/PCS1900 (8-PSK) WCDMA bands Max. 33dBm±2dB 30dBm±2dB 27dBm±3dB 26dBm±3dB 24dBm+1/-3dB Min. 5dBm±5dB 0dBm±5dB 5dBm±5dB 0dBm±5dB < -49dBm EC25_Mini_PCIe_Hardware_Design 47 / 80 LTE-FDD bands LTE-TDD bands LTE Standard Module Series EC25 Mini PCIe Hardware Design 23dBm±2dB 23dBm±2dB < -39dBm < -39dBm Table 24: Conducted RF Receiving Sensitivity of EC25-A Mini PCIe Frequency Bands Primary WCDMA B2 -110.0dBm WCDMA B4 -110.0dBm WCDMA B5 -110.5dBm LTE-FDD B2 (10MHz) -98.0dBm LTE-FDD B4 (10MHz) -97.5dBm LTE-FDD B12 (10MHz) -97.2dBm Diversity / / / -98.0dBm -99.0dBm -98.0dBm SIMO1) / / / -101.0dBm -101.0dBm -101.0dBm 3GPP (SIMO) -104.7dBm -106.7dBm -104.7dBm -94.3dBm -96.3dBm -93.3dBm Table 25: Conducted RF Receiving Sensitivity of EC25-AU Mini PCIe Frequency Bands Primary GSM850 -109.0dBm EGSM900 -109.0dBm DCS1800 -109.0dBm PCS1900 -109.0dBm WCDMA B1 -110.0dBm WCDMA B2 -110.0dBm WCDMA B5 -111.0dBm WCDMA B8 -111.0dBm LTE-FDD B1 (10MHz) -97.2dBm LTE-FDD B2 (10MHz) -98.2dBm LTE-FDD B3 (10MHz) -98.7dBm Diversity / / / / -109dBm / -112dBm -111dBm -97.5dBm / -98.6dBm SIMO1) / / / / -112dBm / -113dBm -113dBm -100.2dBm / -102.2dBm 3GPP (SIMO) -102.0dBm -102.0dBm -102.0dBm -102.0dBm -106.7dBm -104.7dBm -104.7dBm -103.7dBm -96.3dBm -94.3dBm -93.3dBm EC25_Mini_PCIe_Hardware_Design 48 / 80 LTE-FDD B4 (10MHz) -97.7dBm LTE-FDD B5 (10MHz) -98.0dBm LTE-FDD B7 (10MHz) -97.7dBm LTE-FDD B8 (10MHz) -99.2dBm LTE-FDD B28 (10MHz) -98.6dBm LTE-TDD B40 (10MHz) -97.2dBm -97.4dBm -98.2dBm -97.7dBm -98.2dBm -98.7dBm -98.4dBm LTE Standard Module Series EC25 Mini PCIe Hardware Design -100.2dBm -101.0dBm -101.2dBm -102.2dBm -102.0dBm -101.2dBm -96.3dBm -94.3dBm -94.3dBm -93.3dBm -94.8dBm -96.3dBm Table 26: Conducted RF Receiving Sensitivity of EC25-J Mini PCIe Frequency Bands Primary WCDMA B1 -110.0dBm WCDMA B6 -110.5dBm WCDMA B8 -110.5dBm WCDMA B19 -110.5dBm LTE-FDD B1 (10MHz) -97.5dBm LTE-FDD B3 (10MHz) -96.5dBm LTE-FDD B8 (10MHz) -98.4dBm LTE-FDD B18 (10MHz) -99.5dBm LTE-FDD B19 (10MHz) -99.2dBm LTE-FDD B26 (10MHz) -99.5dBm LTE-TDD B41 (10MHz) -95.0dBm Diversity / / / / -98.7dBm -97.1dBm -99.0dBm -99.0dBm -99.0dBm -99.0dBm -95.7dBm SIMO1) / / / / -100.2dBm -100.5dBm -101.2dBm -101.7dBm -101.4dBm -101.5dBm -99.0dBm 3GPP (SIMO) -106.7dBm -106.7dBm -103.7dBm -106.7dBm -96.3dBm -93.3dBm -93.3dBm -96.3dBm -96.3dBm -93.8dBm -94.3dBm Table 27: Conducted RF Receiving Sensitivity of EC25-E Mini PCIe Frequency Bands EGSM900 DCS1800 Primary -109.0dBm -109.0dBm Diversity / / SIMO1) / / 3GPP (SIMO) -102.0dBm -102.0dbm EC25_Mini_PCIe_Hardware_Design 49 / 80 WCDMA B1 -110.5dBm WCDMA B5 -110.5dBm WCDMA B8 -110.5dBm LTE-FDD B1 (10MHz) -98.0dBm LTE-FDD B3 (10MHz) -96.5dBm LTE-FDD B5 (10MHz) -98.0dBm LTE-FDD B7 (10MHz) -97.0dBm LTE-FDD B8 (10MHz) -97.0dBm LTE-FDD B20 (10MHz) -97.5dBm LTE-TDD B38 (10MHz) -95.0dBm LTE-TDD B40 (10MHz) -96.3dBm LTE-TDD B41 (10MHz) -94.5dBm / / / -98.0dBm -98.5dBm -98.5dBm -97.0dBm -97.0dBm -99.0dBm -97.0dBm -98.0dBm -97.0dBm LTE Standard Module Series EC25 Mini PCIe Hardware Design / / / -101.5dBm -101.5dBm -101.0dBm -99.5dBm -101.0dBm -102.5dBm -98.9dBm -101.0dBm -98.5dBm -106.7dBm -104.7dBm -103.7dBm -96.3dBm -93.3dBm -94.3dBm -94.3dBm -93.3dBm -93.3dBm -96.3dBm -96.3dBm -94.3dBm Table 28: Conducted RF Receiving Sensitivity of EC25-V Mini PCIe Frequency Bands Primary LTE-FDD B4 (10MHz) -97.5dBm LTE-FDD B13 (10MHz) -97.7dBm Diversity -99.0dBm -97.0dBm SIMO1) -101.0dBm -100.0dBm 3GPP (SIMO) -96.3dBm -93.3dBm Table 29: Conducted RF Receiving Sensitivity of EC25-AF Mini PCIe Frequency Bands WCDMA B2 WCDMA B4 WCDMA B5 LTE-FDD B2 (10MHz) LTE-FDD B4 (10MHz) Primary -109.5dBm -109.6dBm -110.5dBm -98.0dBm -97.5dBm Diversity -110dBm -110dBm -110dBm -98.5dBm -98.2dBm SIMO1) -110.4dBm -110.6dBm -110.7dBm -100.5dBm -99.5dBm 3GPP (SIMO) -104.7dBm -106.7dBm -104.7dBm -94.3dBm -93.3dBm EC25_Mini_PCIe_Hardware_Design 50 / 80 LTE-FDD B5 (10MHz) -98.0dBm LTE-FDD B12 (10MHz) -99.0dBm LTE-FDD B13 (10MHz) -98.5dBm LTE-FDD B14 (10MHz) -99.4dBm LTE-FDD B66 (10MHz) -97.5dBm LTE-FDD B71 (10MHz) -98.6dBm -98.5dBm -99.5dBm -99.5dBm -99.5dBm -98.5dBm -99.5dBm LTE Standard Module Series EC25 Mini PCIe Hardware Design -100.5dBm -100.5dBm -100.7dBm -100.9dBm -99.6dBm -100dBm -94.3dBm -93.3dBm -93.3dBm -93.3dBm -95.8dBm -93.5dBm Table 30: Conducted RF Receiving Sensitivity of EC25-AFX Mini PCIe Frequency Bands Primary WCDMA B2 -109.6dBm WCDMA B4 -109.6dBm WCDMA B5 -110.5dBm LTE-FDD B2 (10MHz) -98.0dBm LTE-FDD B4 (10MHz) -97.6dBm LTE-FDD B5 (10MHz) -98.0dBm LTE-FDD B12 (10MHz) -99.0dBm LTE-FDD B13 (10MHz) -98.5dBm LTE-FDD B14 (10MHz) -99.4dBm LTE-FDD B66 (10MHz) -97.5dBm LTE-FDD B71 (10MHz) -98.8dBm Diversity -110dBm -110dBm -110dBm -98.5dBm -98.2dBm -98.5dBm -99.5dBm -99.7dBm -99.5dBm -98.5dBm -99.7dBm SIMO1) -110.4dBm -110.6dBm -110.7dBm -100.5dBm -99.5dBm -100.5dBm -100.5dBm -100.8dBm -100.9dBm -99.6dBm -100.5dBm 3GPP (SIMO) -104.7dBm -106.7dBm -104.7dBm -94.3dBm -93.3dBm -94.3dBm -93.3dBm -93.3dBm -93.3dBm -95.8dBm -93.5dBm Table 31: Conducted RF Receiving Sensitivity of EC25-EU Mini PCIe Frequency Bands EGSM900 DCS1800 Primary -108dBm -108.6dBm Diversity / / SIMO1) / / 3GPP (SIMO) -102.0dBm -102.0dbm EC25_Mini_PCIe_Hardware_Design 51 / 80 WCDMA B1 -110dBm WCDMA B8 -110dBm LTE-FDD B1 (10MHz) -98.2dBm LTE-FDD B3 (10MHz) -97.7dBm LTE-FDD B7 (10MHz) -96.7dBm LTE-FDD B8 (10MHz) -98.2dBm LTE-FDD B20 (10MHz) -98.2dBm LTE-FDD B28 (10MHz) -98.2dBm LTE-TDD B38 (10MHz) -95dBm LTE-TDD B40 (10MHz) -95.9dBm LTE-TDD B41 (10MHz) -94.8dBm -109dBm -111dBm -99.0dBm -99.8dBm -98.5dBm -100.4dBm -100.8dBm -100.5dBm -97.0dBm -98.0dBm -97.0dBm LTE Standard Module Series EC25 Mini PCIe Hardware Design / / -101.2dBm -101.0dBm -100.2dBm -101.7 dBm -101.7dBm -101.7dBm -99.7dBm -100.2dBm -99.7dBm -106.7dBm -103.7dBm -96.3dBm -93.3dBm -94.3dBm -93.3dBm -93.3dBm -94.8dBm -96.3dBm -96.3dBm -94.3dBm Table 32: Conducted RF Receiving Sensitivity of EC25-EC Mini PCIe Frequency Bands Primary EGSM900 -108.8dBm DCS1800 -109.0dBm WCDMA B1 -110.5dBm WCDMA B8 -110.5dBm LTE-FDD B1 (10MHz) -98.0dBm LTE-FDD B3 (10MHz) -96.5dBm LTE-FDD B7 (10MHz) -97.0dBm LTE-FDD B8 (10MHz) -97.0dBm LTE-FDD B20 (10MHz) -97.5dBm LTE-FDD B28 (10MHz) -98.6dBm Diversity / / / / -98.0dBm -98.5dBm -95.5dBm -97.0dBm -99.0dBm -98.7dBm SIMO1) / / / / -101.0dBm -100.0dBm -99.5dBm -101.0dBm -101.0dBm -101.5dBm 3GPP (SIMO) -102.0dBm -102.0dbm -106.7dBm -103.7dBm -96.3dBm -93.3dBm -94.3dBm -93.3dBm -93.3dBm -94.8dBm EC25_Mini_PCIe_Hardware_Design 52 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Table 33: Conducted RF Receiving Sensitivity of EC25-EUX Mini PCIe Frequency Bands Primary EGSM900 -109.0dBm DCS1800 -109.0dBm WCDMA B1 -110.5dBm WCDMA B8 -110.5dBm LTE-FDD B1 (10MHz) -98.0dBm LTE-FDD B3 (10MHz) -96.5dBm LTE-FDD B7 (10MHz) -97.0dBm LTE-FDD B8 (10MHz) -97.0dBm LTE-FDD B20 (10MHz) -97.5dBm LTE-FDD B28 (10MHz) -98.6dBm LTE-TDD B38 (10MHz) -96.3dBm LTE-TDD B40 (10MHz) -96.9dBm LTE-TDD B41 (10MHz) -95.3dBm Diversity / / / / -98.0dBm -98.5dBm -94.5dBm -97.0dBm -99.0dBm -98.7dBm -97dBm -98.0dBm -97.5dBm SIMO1) / / / / -101dBm -99.5dBm -99.5dBm -100.0dBm -101.5dBm -101.0dBm -98.5dBm -99.1dBm -98.0dBm 3GPP (SIMO) -102.0dBm -102.0dbm -106.7dBm -103.7dBm -96.3dBm -93.3dBm -94.3dBm -93.3dBm -93.3dBm -94.8dBm -96.3dBm -96.3dBm -94.3dBm Table 34: Conducted RF Receiving Sensitivity of EC25-MX Mini PCIe Frequency Bands Primary WCDMA B2 -110dBm WCDMA B4 -109.5dBm WCDMA B5 -110dBm LTE-FDD B2 (10MHz) -98.2dBm LTE-FDD B4 (10MHz) -97.2dBm LTE-FDD B5 (10MHz) -98.2dBm LTE-FDD B7 (10MHz) -95.7dBm Diversity -110dBm -110dBm -110dBm -99.1dBm -98.2dBm -99.2dBm -98.5dBm SIMO1) / / / -101.5dBm -101.2dBm -102.2dBm -100.2dBm 3GPP (SIMO) -104.7dBm -106.7dBm -104.7dBm -94.3dBm -96.3dBm -94.3dBm -94.3dBm EC25_Mini_PCIe_Hardware_Design 53 / 80 LTE-FDD B28 (10MHz) -97.2dBm LTE-FDD B66 (10MHz) -97.2dBm -99.3dBm -98.4dBm LTE Standard Module Series EC25 Mini PCIe Hardware Design -101.7dBm -101.2dBm -94.8dBm -95.8dBm Table 35: Conducted RF Receiving Sensitivity of EC25-AUX Mini PCIe Frequency Bands Primary GSM850 -109.0dBm EGSM900 -109.0dBm DCS1800 -109.0dBm PCS1900 -109.0dBm WCDMA B1 -110.0dBm WCDMA B2 -110.5dBm WCDMA B4 -110.0dBm WCDMA B5 -111.0dBm WCDMA B8 -111.0dBm LTE-FDD B1 (10MHz) -98.0dBm LTE-FDD B2 (10MHz) -98.5dBm LTE-FDD B3 (10MHz) -99.0dBm LTE-FDD B4 (10MHz) -97.7dBm LTE-FDD B5 (10MHz) -98.5dBm LTE-FDD B7 (10MHz) -97.7dBm LTE-FDD B8 (10MHz) -99.0dBm LTE-FDD B28 (10MHz) -98.0dBm LTE-TDD B40 (10MHz) -97.5dBm Diversity / / / / -109.5dBm / -110dBm -112dBm -112dBm -97.7dBm / -98.8dBm -97.6dBm -98.2dBm -97.7dBm -98.5dBm -98.7dBm -98.2dBm SIMO1) / / / / -112dBm / -112dBm -113dBm -113dBm -101.2dBm / -102.2dBm -100.2dBm -101.0dBm -101.2dBm -102.2dBm -101.5dBm -101.2dBm 3GPP (SIMO) -102.0dBm -102.0dBm -102.0dBm -102.0dBm -106.7dBm -104.7dBm -104.7dBm -104.7dBm -103.7dBm -96.3dBm -94.3dBm -93.3dBm -96.3dBm -94.3dBm -94.3dBm -93.3dBm -94.8dBm -96.3dBm EC25_Mini_PCIe_Hardware_Design 54 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design NOTE 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve RX performance. 6.5. ESD Characteristics The following table shows the ESD characteristics of EC25 Mini PCIe. Table 36: ESD Characteristics of EC25 Mini PCIe Tested Interfaces Power Supply and GND Antenna Interfaces USB Interface (U)SIM Interface Others Contact Discharge Air Discharge Unit +/-5 +/-10 kV +/-4 +/-8 kV +/-4 +/-8 kV +/-4 +/-8 kV +/-0.5 +/-1 kV 6.6. Current Consumption The following tables describe the current consumption of EC25 Mini PCIe series module. Table 37: Current Consumption of EC25-A Mini PCIe Parameter Description IVBAT Sleep state Conditions AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) Typ. Unit 3.6 mA 4.4 mA 3.8 mA 5.9 mA 4.8 mA EC25_Mini_PCIe_Hardware_Design 55 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA PF=64 (USB disconnected) Idle state WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) WCDMA B2 HSDPA @22.63dBm WCDMA B2 HSUPA @23.19dBm WCDMA data transfer (GNSS OFF) WCDMA B4 HSDPA @22.45dBm WCDMA B4 HSUPA @22.57dBm WCDMA B5 HSDPA @22.49dBm WCDMA B5 HSUPA @22.43dBm LTE data transfer (GNSS OFF) LTE-FDD B2 @22.92dBm LTE-FDD B4 @23.42dBm LTE-FDD B12 @23.39dBm WCDMA B2 @23.59dBm WCDMA voice call WCDMA B4 @23.47dBm WCDMA B5 @23.46dBm 27.0 mA 40.0 mA 43.0 mA 59.0 mA 764.0 mA 741.0 mA 745.0 mA 752.0 mA 616.0 mA 637.0 mA 977.0 mA 1094.0 mA 847.0 mA 861.0 mA 812.0 mA 683.0 mA Table 38: Current Consumption of EC25-AU Mini PCIe Parameter Description Conditions AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) IVBAT Sleep state WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) Typ. Unit 2.6 mA 4.3 mA 3.1 mA 3.8 mA 3.3 mA 4.2 mA EC25_Mini_PCIe_Hardware_Design 56 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) Idle state WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) EGSM900 4DL/1UL @33.10dBm EGSM900 3DL/2UL @32.93dBm EGSM900 2DL/3UL @31.15dBm EGSM900 1DL/4UL @29.94dBm DCS1800 4DL/1UL @30.35dBm DCS1800 3DL/2UL @30.25dBm GPRS data transfer (GNSS OFF) DCS1800 2DL/3UL @30.18dBm DCS1800 1DL/4UL @29.93dBm GSM850 1UL/4DL @32.53dBm GSM850 2UL/3DL @32.34dBm GSM850 3UL/2DL @30.28dBm GSM850 4UL/1DL @29.09dBm PCS1900 1UL/4DL @29.61dBm PCS1900 2UL/3DL @29.48dBm 3.5 mA 4.5 mA 3.7 mA 22.0 mA 34.0 mA 22.0 mA 33.0 mA 29.0 mA 42.0 mA 30.0 mA 42.0 mA 385.0 mA 631.0 mA 730.0 mA 830.0 mA 255.0 mA 392.0 mA 527.0 mA 667.0 mA 232.0 mA 384.0 mA 441.0 mA 511.0 mA 174.0 mA 273.0 mA EC25_Mini_PCIe_Hardware_Design 57 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design PCS1900 3UL/2DL @29.32dBm PCS1900 4UL/1DL @29.19dBm EGSM900 4DL/1UL @27.54dBm EGSM900 3DL/2UL @27.38dBm EGSM900 2DL/3UL @27.27dBm EGSM900 1DL/4UL @27.17dBm DCS1800 4DL/1UL @27.64dBm DCS1800 3DL/2UL @27.45dBm DCS1800 2DL/3UL @27.34dBm EDGE data transfer (GNSS OFF) DCS1800 1DL/4UL @27.29dBm GSM850 1UL/4DL @27.09dBm GSM850 2UL/3DL @26.94dBm GSM850 3UL/2DL @26.64dBm GSM850 4UL/1DL @26.53dBm PCS1900 1UL/4DL @25.65dBm PCS1900 2UL/3DL @25.63dBm PCS1900 3UL/2DL @25.54dBm PCS1900 4UL/1DL @25.26dBm WCDMA B1 HSDPA @22.45dBm WCDMA B1 HSUPA @21.75dBm WCDMA data transfer (GNSS OFF) WCDMA B2 HSDPA @22.51dBm WCDMA B2 HSUPA @22. 14dBm WCDMA B5 HSDPA @22.41dBm WCDMA B5 HSUPA @22.13dBm WCDMA B8 HSDPA @21.34dBm 367.0 mA 465.0 mA 264.0 mA 368.0 mA 498.0 mA 634.0 mA 223.0 mA 333.0 mA 449.0 mA 573.0 mA 154.0 mA 245.0 mA 328.0 mA 416.0 mA 148.0 mA 232.0 mA 313.0 mA 401.0 mA 815.0 mA 804.0 mA 610.0 mA 594.0 mA 755.0 mA 775.0 mA 619.0 mA EC25_Mini_PCIe_Hardware_Design 58 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA B8 HSUPA @21.07dBm LTE-FDD B1 @23.28dBm LTE-FDD B2 @23.34dBm LTE-FDD B3 @23.2dBm LTE data transfer (GNSS OFF) LTE-FDD B4 @22.9dBm LTE-FDD B5 @23.45dBm LTE-FDD B7 @22.84dBm LTE-FDD B8 @22.92dBm LTE-FDD B28 @23.23dBm LTE-TDD B40 @23.3dBm GSM850 PCL5 @32.66dBm GSM voice call EGSM900 PCL5 @32.59dBm DCS1800 PCL0 @29.72dBm PCS1900 PCL0 @29.82dBm WCDMA B1 @23.27dBm WCDMA voice call WCDMA B2 @23.38dBm WCDMA B5 @23.38dBm WCDMA B8 @23.32dBm 634.0 mA 817.0 mA 803.0 mA 785.0 mA 774.0 mA 687.0 mA 843.0 mA 689.0 mA 804.0 mA 429.0 mA 228.0 mA 235.0 mA 178.0 mA 170.0 mA 687.0 mA 668.0 mA 592.0 mA 595.0 mA Table 39: Current Consumption of EC25-J Mini PCIe Parameter Description Conditions AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) IVBAT Sleep state WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) Typ. Unit 3.2 mA 4.3 mA 3.8 mA 5.0 mA EC25_Mini_PCIe_Hardware_Design 59 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) Idle state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) WCDMA B1 HSDPA @22.55dBm WCDMA B1 HSUPA @22.25dBm WCDMA B6 HSDPA @22.79dBm WCDMA data transfer (GNSS OFF) WCDMA B6 HSUPA @22.59dBm WCDMA B8 HSDPA @22.71dBm WCDMA B8 HSUPA @22.63dBm WCDMA B19 HSDPA @22.77dBm WCDMA B19 HSUPA @22.53dBm LTE-FDD B1 @23.15dBm LTE-FDD B3 @23.29dBm LTE data transfer (GNSS OFF) LTE-FDD B8 @23.29dBm LTE-FDD B18 @23.82dBm LTE-FDD B19 @23.78dBm LTE-FDD B26 @23.22dBm WCDMA voice call LTE-TDD B41 @22.95dBm WCDMA B1 @23.39dBm 4.4 mA 5.1 mA 4.4 mA 31.5 mA 43.5 mA 32.3 mA 45.4 mA 32.3 mA 43.3 mA 829.0 mA 848.2 mA 649.2 mA 661.4 mA 691.0 mA 700.0 mA 644.2 mA 657.6 mA 1045.0 mA 1070.0 mA 867.3 mA 947.7 mA 955.1 mA 924.9 mA 609.6 mA 969.6 mA EC25_Mini_PCIe_Hardware_Design 60 / 80 WCDMA B6 @23.36dBm WCDMA B8 @23.54dBm WCDMA B19 @23.29dBm LTE Standard Module Series EC25 Mini PCIe Hardware Design 692.3 mA 763.9 mA 682.1 mA Table 40: Current Consumption of EC25-E Mini PCIe Parameter Description Conditions AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) IVBAT GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) Idle state WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) GPRS data transfer (GNSS OFF) EGSM900 4DL/1UL @33.08dBm EGSM900 3DL/2UL @31.03dBm Typ. Unit 3.9 mA 5.1 mA 4.3 mA 5.5 mA 4.8 mA 5.8 mA 5.0 mA 5.8 mA 4.9 mA 30.0 mA 43.0 mA 31.0 mA 45.0 mA 31.0 mA 44.0 mA 32.0 mA 44.0 mA 372.0 mA 626.0 mA EC25_Mini_PCIe_Hardware_Design 61 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design EGSM900 2DL/3UL @29.86dBm EGSM900 1DL/4UL @29.44dBm DCS1800 4DL/1UL @30.39dBm DCS1800 3DL/2UL @30.19dBm DCS1800 2DL/3UL @30.02dBm DCS1800 1DL/4UL @29.86dBm EGSM900 4DL/1UL @27.59dBm EGSM900 3DL/2UL @27.45dBm EDGE data transfer (GNSS OFF) EGSM900 2DL/3UL @27.31dBm EGSM900 1DL/4UL @27.14dBm DCS1800 4DL/1UL @26.24dBm DCS1800 3DL/2UL @26.13dBm DCS1800 2DL/3UL @25.97dBm DCS1800 1DL/4UL @25.82dBm WCDMA B1 HSDPA @22.49dBm WCDMA B1 HSUPA @21.87dBm WCDMA data transfer (GNSS OFF) WCDMA B5 HSDPA @22.66dBm WCDMA B5 HSUPA @21.99dBm WCDMA B8 HSDPA @22.23dBm WCDMA B8 HSUPA @21.68dBm LTE-FDD B1 @23.12dBm LTE data transfer (GNSS OFF) LTE-FDD B3 @22.75dBm LTE-FDD B5 @22.92dBm LTE-FDD B7 @23.42dBm LTE-FDD B8 @22.97dBm 706.0 mA 767.0 mA 262.0 mA 417.0 mA 564.0 mA 709.0 mA 233.0 mA 370.0 mA 500.0 mA 623.0 mA 224.0 mA 334.0 mA 440.0 mA 553.0 mA 798.0 mA 788.0 mA 781.0 mA 770.0 mA 655.0 mA 659.0 mA 940.0 mA 989.0 mA 962.0 mA 1188.0 mA 911.0 mA EC25_Mini_PCIe_Hardware_Design 62 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD B20 @22.51dBm LTE-TDD B38 @22.58dBm LTE-TDD B40 @22.31dBm LTE-TDD B41 @22.03dBm GSM voice call EGSM900 PCL=5 @33.31dBm DCS1800 PCL=0 @29.48dBm WCDMA B1 @23.18dBm WCDMA voice call WCDMA B5 @22.62dBm WCDMA B8 @23.02dBm 946.0 mA 686.0 mA 576.0 mA 611.0 mA 367.0 mA 248.0 mA 868.0 mA 808.0 mA 728.0 mA Table 41: Current Consumption of EC25-V Mini PCIe Parameter Description Conditions AT+CFUN=0 (USB disconnected) Sleep state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) IVBAT LTE-FDD PF=64 (USB disconnected) Idle state LTE-FDD PF=64 (USB connected) LTE data transfer (GNSS OFF) LTE-FDD B4 @23.3dBm LTE-FDD B13 @22.13dBm Table 42: Current Consumption of EC25-AF Mini PCIe Parameter Description IVBAT Sleep state Conditions AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) Typ. Unit 3.4 mA 4.8 mA 4.3 mA 30.0 mA 42.0 mA 873.0 mA 638.0 mA Typ. Unit 2.2 mA 3.1 mA 2.8 mA EC25_Mini_PCIe_Hardware_Design 63 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) Idle state WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) WCDMA B2 HSDPA @22.63dBm WCDMA B2 HSUPA @22.49dBm WCDMA data transfer (GNSS OFF) WCDMA B4 HSDPA @22.45dBm WCDMA B4 HSUPA @22.57dBm WCDMA B5 HSDPA @22.49dBm WCDMA B5 HSUPA @22.43dBm LTE-FDD B2 @22.92dBm LTE-FDD B4 @23.12dBm LTE data transfer (GNSS OFF) LTE-FDD B5 @22.98dBm LTE-FDD B12 @23.42dBm LTE-FDD B13 @22.92dBm LTE-FDD B14 @23.42dBm LTE-FDD B66 @23.35dBm LTE-FDD B71 @23.39dBm WCDMA B2 @23.59dBm WCDMA voice call WCDMA B4 @23.47dBm WCDMA B5 @23.46dBm 3.7 mA 3.1 mA 21.7 mA 32.5 mA 25.0 mA 38.0 mA 560.0 mA 564.0 mA 601.0 mA 610.0 mA 603.0 mA 617.0 mA 758.0 mA 770.0 mA 700.0 mA 808.0 mA 790.0 mA 795.0 mA 816.0 mA 801.0 mA 585.0 mA 610.0 mA 605.0 mA EC25_Mini_PCIe_Hardware_Design 64 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Table 43: Current Consumption of EC25-EUX Mini PCIe Parameter Description Sleep state IVBAT Idle state GPRS data transfer (GNSS OFF) Conditions AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) EGSM900 4DL/1UL @32.5dBm EGSM900 3DL/2UL @31.56dBm EGSM900 2DL/3UL @29.63dBm EGSM900 1DL/4UL @28.76dBm DCS1800 4DL/1UL @29.06dBm DCS1800 3DL/2UL @28.33dBm DCS1800 2DL/3UL @26.88dBm Typ. Unit 1.69 mA 2.59 mA 1.97 mA 2.52 mA 2.25 mA 3.01 mA 2.4 mA 3.08 mA 2.46 mA 18.51 mA 37.56 mA 20.5 mA 38.42 mA 19.29 mA 38.46 mA 19.41 mA 37.21 mA 293.0 mA 464.0 mA 534.5 mA 644.6 mA 182.5 mA 283.4 mA 368.3 mA EC25_Mini_PCIe_Hardware_Design 65 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design EDGE data transfer (GNSS OFF) WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) GSM voice call WCDMA voice call DCS1800 1DL/4UL @25.74dBm EGSM900 4DL/1UL @25.54dBm EGSM900 3DL/2UL @25.41dBm EGSM900 2DL/3UL @23.51dBm EGSM900 1DL/4UL @22.94dBm DCS1800 4DL/1UL @25.05dBm DCS1800 3DL/2UL @25.07dBm DCS1800 2DL/3UL @22.54dBm DCS1800 1DL/4UL @21.92dBm WCDMA B1 HSDPA @21.72dBm WCDMA B1 HSUPA @21.52dBm WCDMA B8 HSDPA @21.87dBm WCDMA B8 HSUPA @20.79dBm LTE-FDD B1 @20.81dBm LTE-FDD B3 @20.73dBm LTE-FDD B7 @20.04dBm LTE-FDD B8 @21.05dBm LTE-FDD B20 @21.01dBm LTE-FDD B28A @20.92dBm LTE-TDD B38 @20.65dBm LTE-TDD B40 @20.52dBm LTE-TDD B41 @20.64dBm EGSM900 PCL=5 @32.17dBm DCS1800 PCL=0 @29.09dBm WCDMA B1 @22.64dBm 455.8 mA 200.1 mA 343.4 mA 471.5 mA 607.8 mA 183.1 mA 291.0 mA 392.0 mA 502.2 mA 681.1 mA 728.0 mA 638.0 mA 636.0 mA 879.0 mA 955.4 mA 970.8 mA 815.3 mA 952.1 mA 1007.0 mA 458.3 mA 409.0 mA 451.4 mA 276.9 mA 174.3 mA 762.1 mA EC25_Mini_PCIe_Hardware_Design 66 / 80 WCDMA B8 @22.17dBm LTE Standard Module Series EC25 Mini PCIe Hardware Design 689.3 mA Table 44: Current Consumption of EC25-AFX Mini PCIe Parameter Description Sleep state IVBAT Idle state WCDMA data transfer (GNSS OFF) Conditions AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) WCDMA PF=128 (USB disconnected) WCDMA PF=256 (USB disconnected) WCDMA PF=512 (USB disconnected) LTE-FDD PF=32 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-FDD PF=128 (USB disconnected) LTE-FDD PF=256 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) WCDMA B2 HSDPA @22.45dBm WCDMA B2 HSUPA @22.23dBm WCDMA B4 HSDPA @22.42dBm WCDMA B4 HSUPA @22.11dBm WCDMA B5 HSDPA @22.02dBm WCDMA B5 HSUPA @22.10dBm Typ. Unit 1.67 mA 2.51 mA 2.93 mA 2.16 mA 2.07 mA 1.88 mA 4.29 mA 3.04 mA 3.23 mA 2.39 mA 2.06 mA 22.0 mA 43.0 mA 22.0 mA 42.8 mA 691.0 mA 605.0 mA 628.0 mA 630.0 mA 618.0 mA 634.0 mA EC25_Mini_PCIe_Hardware_Design 67 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design LTE data transfer (GNSS OFF) WCDMA voice call LTE-FDD B2 @23.01dBm LTE-FDD B4 @22.58dBm LTE-FDD B5 @23.2dBm LTE-FDD B12 @22.94dBm LTE-FDD B13 @23.18dBm LTE-FDD B14 @23.44dBm LTE-FDD B66 @23.2dBm LTE-FDD B71 @22.82dBm WCDMA B2 @23.27dBm WCDMA B4 @23.22dBm WCDMA B5 @23.02dBm 743.0 mA 816.0 mA 751.0 mA 825.0 mA 815.0 mA 849.0 mA 850.0 mA 788.0 mA 672.0 mA 663.0 mA 680.0 mA Table 45: Current Consumption of EC25-MX Mini PCIe Parameter Description IVBAT Sleep state Conditions AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) WCDMA PF=128 (USB disconnected) WCDMA PF=256 (USB disconnected) WCDMA PF=512 (USB disconnected) LTE-FDD PF=32 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-FDD PF=128 (USB disconnected) LTE-FDD PF=256 (USB disconnected) Typ. Unit 1.55 mA 2.82 mA 2.98 mA 2.33 mA 2.13 mA 1.97 mA 4.36 mA 3.14 mA 3.33 mA 2.55 mA 2.38 mA EC25_Mini_PCIe_Hardware_Design 68 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Idle state WCDMA data transfer (GNSS OFF) LTE data transfer (GNSS OFF) WCDMA voice call WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) WCDMA B2 HSDPA @22.75dBm WCDMA B2 HSUPA @22.3dBm WCDMA B4 HSDPA @23.34dBm WCDMA B4 HSUPA @23.11dBm WCDMA B5 HSDPA @22.53dBm WCDMA B5 HSUPA @22.58dBm LTE-FDD B2 @23.09dBm LTE-FDD B4 @23.12dBm LTE-FDD B5 @22.28dBm LTE-FDD B7 @22.56dBm LTE-FDD B28 @22.41dBm LTE-FDD B66 @23.94dBm WCDMA B2 @23.97dBm WCDMA B4 @23.92dBm WCDMA B5 @23.00dBm 20.0 mA 41.1 mA 20.5 mA 40.7 mA 848.0 mA 818.0 mA 813.0 mA 774.0 mA 759.0 mA 717.0 mA 918.0 mA 933.0 mA 706.0 mA 1011.0 mA 793.0 mA 937.0 mA 967.0 mA 825.0 mA 844.0 mA Table 46: Current Consumption of EC25-AUX Mini PCIe Parameter Description Conditions AT+CFUN=0 (USB disconnected) IVBAT Sleep state GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) Typ. Unit 1.9 mA 2.9 mA 2.4 mA EC25_Mini_PCIe_Hardware_Design 69 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) Idle state WCDMA PF=64 (USB connected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) GSM850 4DL/1UL @32.88dBm GSM850 3DL/2UL @31.99dBm GSM850 2DL/3UL @29.94dBm GSM850 1DL/4UL @28.73dBm GPRS data transfer (GNSS OFF) EGSM900 4DL/1UL @33.75dBm EGSM900 3DL/2UL @32.18dBm EGSM900 2DL/3UL @29.90dBm EGSM900 1DL/4UL @28.70dBm DCS1800 4DL/1UL @30.02dBm DCS1800 3DL/2UL @29.12dBm DCS1800 2DL/3UL @26.98dBm 3.8 mA 3.4 mA 4.5 mA 3.9 mA 4.5 mA 3.7 mA 23.4 mA 43.4 mA 24.2 mA 45.6 mA 28.7 mA 43.7 mA 30.4 mA 43.9 mA 368.0 mA 565.5 mA 636.7 mA 733.7 mA 419.3 mA 591.5 mA 631.4 mA 725.3 mA 221.8 mA 319.6 mA 384.8 mA EC25_Mini_PCIe_Hardware_Design 70 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design DCS1800 1DL/4UL @25.80dBm PCS1900 4DL/1UL @30.22dBm PCS1900 3DL/2UL @28.93dBm PCS1900 2DL/3UL @27.00dBm PCS1900 1DL/4UL @25.86dBm GSM850 4DL/1UL @27.45dBm GSM850 3DL/2UL @26.29dBm GSM850 2DL/3UL @23.96dBm GSM850 1DL/4UL @22.72dBm EGSM900 4DL/1UL @27.63dBm EGSM900 3DL/2UL @26.45dBm EGSM900 2DL/3UL @24.27dBm EDGE data transfer (GNSS OFF) EGSM900 1DL/4UL @22.99dBm DCS1800 4DL/1UL @26.55dBm DCS1800 3DL/2UL @25.90dBm DCS1800 2DL/3UL @23.91dBm DCS1800 1DL/4UL @22.61dBm PCS1900 4DL/1UL @26.67dBm PCS1900 3DL/2UL @25.88dBm PCS1900 2DL/3UL @23.85dBm PCS1900 1DL/4UL @22.73dBm WCDMA B1 HSDPA @21.54dBm WCDMA data transfer (GNSS OFF) WCDMA B1 HSUPA @21.82dBm WCDMA B2 HSDPA @22.10dBm WCDMA B2 HSUPA @21.84dBm 468.3 mA 243.2 mA 336.9 mA 398.3 mA 478.0 mA 253.6 mA 389.8 mA 515.4 mA 647.6 mA 257.2 mA 399.1 mA 515.3 mA 642.0 mA 196.7 mA 304.4 mA 408.8 mA 524.3 mA 194.7 mA 299.1 mA 399.7 mA 510.1 mA 679.4 mA 721.1 mA 723.0 mA 708.6 mA EC25_Mini_PCIe_Hardware_Design 71 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design WCDMA B5 HSDPA @23.27dBm WCDMA B5 HSUPA @22.93dBm WCDMA B8 HSDPA @21.70dBm WCDMA B8 HSUPA @21.12dBm LTE-FDD B1 @23.50dBm LTE-FDD B2 @22.95dBm LTE-FDD B3 @23.27dBm LTE data transfer (GNSS OFF) LTE-FDD B4 @23.28dBm LTE-FDD B5 @23.09dBm LTE-FDD B7 @23.09dBm LTE-FDD B8 @23.64dBm LTE-FDD B28 @22.79dBm LTE-TDD B40 @23.70dBm GSM850 PCL5 @32.75dBm GSM voice call EGSM900 PCL5 @33.53dBm DCS1800 PCL0 @30.03dBm PCS1900 PCL0 @29.94dBm WCDMA B1 @23.75dBm WCDMA voice call WCDMA B2 @23.07dBm WCDMA B5 @23.31dBm WCDMA B8 @22.65dBm 672.6 mA 672.0 mA 667.9 mA 674.5 mA 963.9 mA 941.7 mA 856.4 mA 817.1 mA 724.5 mA 945.2 mA 888.3 mA 964.5 mA 428.9 mA 346.9 mA 385.3 mA 210.2 mA 219.6 mA 785.1 mA 804.5 mA 701.8 mA 739.7 mA Table 47: Current Consumption of EC25-EU Mini PCIe Parameter Description Conditions EC25_Mini_PCIe_Hardware_Design Typ. Unit 72 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) GSM DRX=5 (USB disconnected) GSM DRX=5 (USB connected) WCDMA PF=64 (USB disconnected) IVBAT WCDMA PF=64 (USB connected) Idle state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=64 (USB connected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=64 (USB connected) EGSM900 4DL/1UL @32.54dBm EGSM900 3DL/2UL @31.96dBm EGSM900 2DL/3UL @29.59dBm GPRS data transfer (GNSS OFF) EGSM900 1DL/4UL @28.34dBm DCS1800 4DL/1UL @29.63dBm DCS1800 3DL/2UL @28.59dBm DCS1800 2DL/3UL @26.62dBm DCS1800 1DL/4UL @25.29dBm 3.4 mA 5.2 mA 4.1 mA 4.9 mA 4.4 mA 5.3 mA 4.6 mA 5.3 mA 4.5 mA 23.3 mA 35.4 mA 23.9 mA 36.3 mA 24.1 mA 36.4 mA 24.1 mA 36.3 mA 379.0 mA 610.0 mA 654.0 mA 734.0 mA 236.0 mA 343.0 mA 413.0 mA 498.0 mA EC25_Mini_PCIe_Hardware_Design 73 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design EGSM900 4DL/1UL @27.51dBm EGSM900 3DL/2UL @27.23dBm EDGE data transfer (GNSS OFF) EGSM900 2DL/3UL @27.08dBm EGSM900 1DL/4UL @26.81dBm DCS1800 4DL/1UL @26.29dBm DCS1800 3DL/2UL @26.18dBm DCS1800 2DL/3UL @26.05dBm DCS1800 1DL/4UL @25.35dBm WCDMA B1 HSDPA @22.01dBm WCDMA data transfer (GNSS OFF) WCDMA B1 HSUPA @22.79dBm WCDMA B8 HSDPA @22.21dBm WCDMA B8 HSUPA @22.04dBm LTE-FDD B1 @23.63dBm LTE-FDD B3 @22.78dBm LTE-FDD B7 @22.31dBm LTE data transfer (GNSS OFF) LTE-FDD B8 @23.35dBm LTE-FDD B20 @22.71dBm LTE-FDD B28A @21.79dBm LTE-TDD B38 @22.85dBm LTE-TDD B40 @22.96dBm LTE-TDD B41 @22.69dBm GSM voice call EGSM900 PCL=5 @32.80dBm DCS1800 PCL=0 @29.51dBm WCDMA voice WCDMA B1 @22.96dBm call WCDMA B8 @23.21dBm 234.0 mA 372.0 mA 501.0 mA 628.0 mA 199.0 mA 309.0 mA 415.0 mA 503.0 mA 755.0 mA 776.0 mA 670.6 mA 692.6 mA 918.7 mA 914.0 mA 985.2 mA 886.5 mA 909.1 mA 898.1 mA 587.8 mA 460.6 mA 571.2 mA 370.0 mA 221.0 mA 829.5 mA 752.9 mA EC25_Mini_PCIe_Hardware_Design 74 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Table 48: GNSS Current Consumption of EC25 Mini PCIe Series Module Parameter Description Conditions IVBAT (GNSS) Searching Cold start @Passive Antenna (AT+CFUN=0) Lost state @Passive Antenna Instrument environment Tracking (AT+CFUN=0) Open Sky @Passive Antenna Open Sky @Active Antenna Typ. Unit 75.0 mA 74.0 mA 44.0 mA 53.0 mA 58.0 mA 6.7. Thermal Consideration In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration: On customers' PCB design, please keep placement of the PCI Express Mini Card away from heating sources. Do not place components on the PCB area where the module is mounted, in order to facilitate adding of heatsink. Do not apply solder mask on the PCB area where the module is mounted, so as to ensure better heat dissipation performance. The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation. Add a heatsink on the top of the module and the heatsink should be designed with as many fins as possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module. Add a thermal pad with appropriate thickness at the bottom of the module to conduct the heat to PCB. The following figure shows the referenced heatsink design. EC25_Mini_PCIe_Hardware_Design 75 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design Figure 18: Referenced Heatsink Design NOTES 1. The module offers the best performance when the internal BB chip stays below 105°C. When the maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115°C. Therefore, the thermal design should be maximally optimized to make sure the maximum BB chip temperature always maintains below 105°C. Customers can execute AT+QTEMP command and get the maximum BB chip temperature from the first returned value. 2. For more detailed guidelines on thermal design, please refer to document [4]. EC25_Mini_PCIe_Hardware_Design 76 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 7 Dimensions and Packaging 7.1. General Description This chapter mainly describes mechanical dimensions as well as packaging specification of EC25 Mini PCIe module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.05mm unless otherwise specified. 7.2. Mechanical Dimensions of EC25 Mini PCIe 8.25±0.10 5.45±0.10 6.38±0.10 6.35±0.10 30.00±0.15 24.20±0.20 3x3.00±0.10 5.98±0.10 2x2.60±0.1 0.61±0.05 2.35±0.10 34.30±0.20 48.05±0.20 4.90±0.20 50.95±0.15 1.40±0.10 9.90±0.10 4.00±0.10 Pin1 10.35±0.10 Top View Pin51 7.26±0.10 1.00±0.10 Side View Figure 19: Mechanical Dimensions of EC25 Mini PCIe EC25_Mini_PCIe_Hardware_Design 77 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 7.3. Standard Dimensions of Mini PCI Express The following figure shows the standard dimensions of Mini PCI Express. Please refer to document [1] for Detail A and Detail B. Figure 20: Standard Dimensions of Mini PCI Express EC25_Mini_PCIe_Hardware_Design 78 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design EC25 Mini PCIe adopts a standard Mini PCI Express connector which compiles with the directives and standards listed in the document [1]. The following figure takes the Molex 679105700 as an example. Figure 21: Dimensions of the Mini PCI Express Connector (Molex 679105700) 7.4. Packaging Specifications EC25 Mini PCIe modules are packaged in a tray. Each tray contains 10 modules. The smallest package of EC25 Mini PCIe contains 100 modules. EC25_Mini_PCIe_Hardware_Design 79 / 80 LTE Standard Module Series EC25 Mini PCIe Hardware Design 8 Appendix A References Table 49: Related Documents SN Document Name Remark [1] PCI Express Mini Card Electromechanical Specification Revision 1.2 PCI Express Mini Card Electromechanical Specification [2] Quectel_LTE_Standard_AT_Commands_ Manual AT commands manual for LTE Standard modules [3] Quectel_LTE_Standard_GNSS_Application_Note GNSS application note for LTE Standard modules [4] Quectel_LTE_Module_Thermal_Design_Guide Thermal design guide for LTE standard, LTE-A and Automotive modules Table 50: Terms and Abbreviations Abbreviation AMR bps BT CS CTS DC-HSPA+ DFOTA DL DTE DTR EFR Description Adaptive Multi-rate Bits Per Second Bluetooth Coding Scheme Clear to Send Dual-carrier High Speed Packet Access Delta Firmware Upgrade Over-The-Air Down Link Data Terminal Equipment Data Terminal Ready Enhanced Full Rate EC25_Mini_PCIe_Hardware_Design 80 / 80 EMI ESD ESR FDD FR GLONASS GMSK GNSS GPS GSM HR HSPA HSUPA kbps LED LTE Mbps MCU ME MIMO MMS MO MT NMEA PCM LTE Standard Module Series EC25 Mini PCIe Hardware Design Electro Magnetic Interference Electrostatic Discharge Equivalent Series Resistance Frequency Division Duplexing Full Rate GLObalnaya Navigatsionnaya Sputnikovaya Sistema, the Russian Global Navigation Satellite System Gaussian Minimum Shift Keying Global Navigation Satellite System Global Positioning System Global System for Mobile Communications Half Rate High Speed Packet Access High Speed Uplink Packet Access Kilo Bits Per Second Light Emitting Diode Long-Term Evolution Million Bits Per Second Micro Control Unit Mobile Equipment Multiple-Input Multiple-Output Multimedia Messaging Service Mobile Originated Mobile Terminated National Marine Electronics Association Pulse Code Modulation EC25_Mini_PCIe_Hardware_Design 81 / 80 PDA PDU POS PPP RF RTS Rx SIMO SMS TX TVS UART UL URC USB (U)SIM WCDMA WLAN LTE Standard Module Series EC25 Mini PCIe Hardware Design Personal Digital Assistant Protocol Data Unit Point of Sale Point-to-Point Protocol Radio Frequency Ready To Send Receive Single Input Multiple Output Short Message Service Transmitting Direction Transient Voltage Suppressor Universal Asynchronous Receiver & Transmitter Uplink Unsolicited Result Code Universal Serial Bus (Universal) Subscriber Identification Module Wideband Code Division Multiple Access Wireless Local Area Networks EC25_Mini_PCIe_Hardware_Design 82 / 80Microsoft: Print To PDF