Infineon Wi-Fi and Bluetooth IoT Partner Module Selection Guide

Infineon Wi-Fi and Bluetooth IoT Partner Module Selection Guide

Internet of Things (IoT) Solutions

Infineon offers a broad portfolio of Wi-Fi and Wi-Fi + Bluetooth combo devices designed for the Internet of Things (IoT) industry. These solutions provide differentiated capabilities, including single and dual-band 802.11n/ac/ax SISO and MIMO devices. Infineon's Wi-Fi + Bluetooth combo chipsets integrate high-performance Wi-Fi with powerful Bluetooth/BLE, simplifying the onboarding of cloud-connected IoT devices via mobile applications. The company also provides Wi-Fi only chipsets and Wi-Fi MCUs with integrated application processors.

Key advantages of Infineon's wireless connectivity solutions include:

  • Over 1 billion Wi-Fi devices currently in the field.
  • High-performance RF architecture for extended range and improved interference rejection.
  • Ultra-low power consumption with minimal sleep, transmit, and receive currents, contributing to extended battery life.
  • Extensive vetting by security researchers, ensuring robust security for devices throughout their lifecycle.
  • Deep domain knowledge and established processes to assist customers in securing their products.

Infineon Wireless Module Partner Ecosystem

Infineon's global partner ecosystem supports the development of IoT applications, enabling projects to be completed on time, within budget, and with minimized risk. Leveraging pre-built wireless modules from partners offers several benefits:

  • Hardware: Avoids complex and costly chip-down designs by providing pre-built wireless modules with multiple antenna options and services.
  • Software: Allows developers to utilize pre-configured connectivity software for common MPUs, operating systems, and development tools.
  • Certifications: Eliminates the burden of navigating multiple global regulatory bodies, as modules come with full modular and reference certifications (e.g., CE, IC, FCC).
  • Support: Provides access to partner support and services for aspects like antenna and plastics design, and EMC testing, facilitating a smooth transition to production.

Infineon IoT Software Solutions

Infineon provides reliable and consistently updated software development platforms for flexible and rapid development of connected products.

Solutions for RTOS Designs

The ModusToolboxTM software environment offers a unified platform for compute, connectivity, and HMI capabilities. It includes multi-platform tools and middleware libraries supporting features like CapSenseTM capacitive-sensing, mesh networking, and system power optimization. ModusToolbox enables an immersive development experience for Infineon MCU and wireless devices, supporting IDEs such as the ModusToolbox Eclipse IDE, Visual Studio Code, IAR Embedded Workbench, and Keil µVision. It provides extensive support for third-party cloud ecosystems and Infineon's AnyCloud solution.

Solutions for Linux/Android Designs

Infineon partners with the open-source community to deliver integrated wireless products for Linux and Android designs, ensuring quality and secure connectivity. These solutions enable a broad set of advanced Wi-Fi and Bluetooth/Bluetooth LE features for diverse designs, supporting the latest Linux and Android distributions with backward compatibility. Infineon's RF and regulatory tools accelerate the process of bringing Linux or Android-based prototypes to production.

Partner Module Portfolios

Infineon collaborates with a wide range of partners to offer comprehensive module portfolios for various wireless connectivity needs, crucial for IoT applications. These portfolios are detailed across several categories:

802.11ac Wi-Fi + Dual-Mode Bluetooth Combo Partner Modules

This extensive section lists modules from partners including Azurewave, B-Link, Inventek, Iton, Laird Connectivity, Lantronix, Murata, and USI. The modules support 2.4/5GHz, 802.11ac, and dual-mode Bluetooth/BLE. Detailed specifications cover Part Numbers (PN), Wi-Fi/BT PNs, MCU, CPU speed, physical dimensions (Area), Regulatory compliance (FCC, CE, IC, TELEC, etc.), Linux support, available Interfaces (SDIO, UART, USB, SPI, I2C, etc.), and key Highlights such as performance, industrial temperature ratings, and specific features like MIMO or RSDB.

802.11n Wi-Fi + Dual-Mode Bluetooth Combo Partner Modules

This part of the guide details modules supporting 802.11n Wi-Fi with Bluetooth/BLE from partners such as Alinket, Azurewave, B-Link, Inventek, Iton, Laird Connectivity, Lantronix, Lierda, Murata, and USI. Specifications include Wi-Fi/BT Support (2.4GHz, 2.4/5GHz, 802.11n, BT/BLE), MCU, CPU, Area, Regulatory compliance, Linux support, Interfaces, and Highlights, often noting antenna options, memory configurations, and specific functionalities like Fast Roaming or Wi-Fi to Ethernet bridging.

Bluetooth & Bluetooth LE (Dual-Mode) Partner Modules

Focusing on Bluetooth and Bluetooth Low Energy (BLE) connectivity, this section features modules from partners including Alinket, Inventek, Iton, Laird Connectivity, Murata, Pairlink, and USI. These modules primarily support BLE or dual-mode Bluetooth. The details provided include Wi-Fi/BT PN, Wi-Fi/BT Support (BLE, BT/BLE), MCU, CPU speed, Area, Regulatory compliance, Linux support, Interfaces, and Highlights, emphasizing features like BLE Mesh, MFi support, low power consumption, and specific profiles.

Infineon and Cypress Integration

Cypress is now a part of Infineon Technologies, enhancing Infineon's advanced system-level solutions. The combined entity targets high-growth markets such as automotive, industrial, and consumer electronics. Cypress's portfolio of microcontrollers, connectivity components, software ecosystems, and high-performance memories complements Infineon's strengths in power semiconductors, automotive microcontrollers, sensors, and security solutions. This integration enables advanced solutions for emerging markets like connected appliances and autonomous cars, positioning the combined company among the top 10 semiconductor manufacturers globally.

Customer benefits from this integration include:

  • Industry-leading portfolio: A differentiated offering of MCUs, connectivity, software, and memory, highly complementary to Infineon's core technologies.
  • Enhanced global footprint: A denser network of sales offices, R&D centers, manufacturing sites, and distribution partnerships.
  • Strong technical support & know-how: Access to state-of-the-art technical support and deep technological expertise to accelerate time-to-market.

Resources and Contact Information

Connectivity Devices:

Software and Support:

Cypress Semiconductor Corporation - An Infineon Technologies Company
198 Champion Court San Jose, CA 95134 USA
Tel: +1 (408) 943-2600 Toll-free: +1 (800) 858-1810 (U.S. only)
www.cypress.com www.infineon.com

© 2016-2021 Cypress Semiconductor Corporation. All rights reserved. All other trademarks are the property of their respective owners. 002-15925 REV.*

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