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REN A-0312-02 PCN 20031203 Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054
PRODUCT/PROCESS CHANGE NOTICE (PCN)
PCN #: A-0312-02
DATE: 12/5/2003
Product Affected: SSOP package family
(see attachment for affected part #s).
Date Effective: 3/5/2004 Contact: Geoffrey Cortes Title: Manager, Corporate Quality & Reliability Phone #: (408) 492-8321 Fax #: (408) 727-2328 E-mail: Geoffrey.Cortes@idt.com
MEANS OF DISTINGUISHING CHANGED DEVICES:
Product Mark
Back Mark Date Code
Lot Number will have "N1" suffix
Other
Attachment:
Yes
No
Samples: See attachment
DESCRIPTION AND PURPOSE OF CHANGE:
Die Technology
Wafer Fabrication Process
Assembly Process
Equipment Material Testing Manufacturing Site Data Sheet
IDT has qualified the SSOP (Shrink Small Outline Package) package family using a new die attach material Ablestik 8290. This notification is to advise our customer of qualification and addition of new assembly material. The new die attach material can meet 260ºC peak reflow temperature requirements. Please see attachment for qualification data and additional details.
Other
RELIABILITY/QUALIFICATION SUMMARY: Please see attached reliability qualification data.
CUSTOMER ACKNOWLEDGMENT OF RECEIPT: IDT records indicate that you require written notification of this change. Please use the acknowledgement below or E-Mail to grant approval or request additional information. If IDT does not receive acknowledgement within 30 days of this notice it will be assumed that this change is acceptable. IDT reserves the right to ship either version manufactured after the process change effective date until the inventory on the earlier version has been depleted.
Customer:
Approval for shipments prior to effective date.
Name/Date:
E-Mail Address:
Title:
Phone# /Fax# :
CUSTOMER COMMENTS:
IDT ACKNOWLEDGMENT OF RECEIPT: RECD. BY:
IDT FRA-1509-01 REV. 00 09/18/01
DATE: Page 1 of 1
Refer To QCA-1795
Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054
PRODUCT/PROCESS CHANGE NOTICE (PCN)
ATTACHMENT - PCN #: A-0312-02
PCN Type: Data Sheet Change: Detail Of Change:
Assembly Material Change
None
A new die attach material has been qualified for SSOP (Shrink Small Outline Package) package family. The successful completion of this qualification has improved IDT's support of current and future production needs for components that meet 260ºC peak reflow temperature. There is no change in Moisture Sensitive Level (MSL). Products will be shipped at the existing MSL and each shipment is labeled with the correct MSL. Please refer to the label for MSL information.
Description
Die Attach Material
Material
Existing
Add
Ablestik 8390, Ablestik 84-1LMISR4
Ablestik 8290
Please see attachment for affected part #s (Appendix - 1).
Samples are not built ahead of the change and are limited to selective devices. Please contact your local field sales representative for sample availability and additional information.
Page 1 of 9
Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054
PRODUCT/PROCESS CHANGE NOTICE (PCN)
ATTACHMENT - PCN #: A-0312-02
Qualification Plan #: P02-11-09
Test Vehicle:
IDTQS5LV919
Qualification Test Plan and Results:
Test Description
Test Method
* High Accelerated Stress Test (Biased, 130 °C/85% RH, 100 Hrs)
* Temperature Cycling (-65 °C to 150 °C, 500 cycle)
* Auto Clave (121 °C, 2 ATM, 168 Hrs)
High Temp Bake (1000 Hrs @150 °C)
Moisture Sensitivity Classification
JESD22-A110-B JESD22-A104-B JESD22-A102-C JESD22-A103-B
J-STD-020B
Internal Visual Inspection
MIL-STD-883, M2010
External Visual Inspection
JESD22-B101
X-ray Examination
MIL-STD-883, M2015
Bond Pull Test
MIL-STD-883, M2011
Resistance to Solvents Solderability Test Bake & Ball Shear Strength
JESD22-B107
JESD22-B102-C J-STD-002
JESD22-B116
Physical Dimensions
JESD22-B100-B
Die Shear Strength
MIL-STD-883, M2019
Notes: * Test requires moisture pre-conditioning sequence per JESD22-A113C.
Test Results IDTQS5LV919 (SS / # of Fails)
45/0
45/0
45/0
77/0 90/0 5/0 25/0 45/0 5/0 3/0 5/0 5/0 5/0 5/0
Page 2 of 9
Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054
PRODUCT/PROCESS CHANGE NOTICE (PCN)
ATTACHMENT - PCN #: A-0312-02
Appendix - 1
IDT29FCT2052ATQ IDT49FCT806PY
IDT74CBTLV16245PV
IDT74FCT162240CTPV IDT74FCT162823CTPV
IDT29FCT2052BTQ IDT5993A-2Q
IDT74CBTLV16292PV
IDT74FCT162244ATPV IDT74FCT162827ATPV
IDT29FCT2052CTQ IDT5993A-5QI
IDT74CBTLV16800PV
IDT74FCT162244CTPV IDT74FCT162827CTPV
IDT29FCT520ATPY IDT5993A-7QI
IDT74CBTLV3125Q
IDT74FCT162244ETPV IDT74FCT162841ATPV
IDT29FCT520ATQ
IDT5V925QI
IDT74CBTLV3126Q
IDT74FCT162245ATPV IDT74FCT162841CTPV
IDT29FCT520BTPY IDT5V993A-2Q
IDT74CBTLV3244PY
IDT74FCT162245CTPV IDT74FCT162952ATPV
IDT29FCT520BTQ
IDT5V993A-5QI
IDT74CBTLV3244Q
IDT74FCT162260ATPV IDT74FCT162952CTPV
IDT29FCT520CTPY IDT5V993A-7QI
IDT74CBTLV3245PY
IDT74FCT162260CTPV IDT74FCT162952ETPV
IDT29FCT520CTQ IDT72V8980PV
IDT74CBTLV3245Q
IDT74FCT162260ETPV IDT74FCT162H244ATPV
IDT29FCT52ATPY
IDT72V8985PV
IDT74CBTLV3251PY
IDT74FCT162344ATPV IDT74FCT162H244CTPV
IDT29FCT52ATQ
IDT74ALVC04PY
IDT74CBTLV3251Q
IDT74FCT162344CTPV IDT74FCT162H245ATPV
IDT29FCT52BTPY
IDT74ALVC08PY
IDT74CBTLV3253PY
IDT74FCT162344ETPV IDT74FCT162H245CTPV
IDT29FCT52BTQ
IDT74ALVC125PY
IDT74CBTLV3253Q
IDT74FCT162373ATPV IDT74FCT162H272ATPV
IDT29FCT52CTPY IDT74ALVC162244PV
IDT74CBTLV3257PY
IDT74FCT162373CTPV IDT74FCT162H272CTPV
IDT29FCT52CTQ
IDT74ALVC162245PV
IDT74CBTLV3257Q
IDT74FCT162373ETPV IDT74FCT162H501ATPV
IDT29FCT52DTPY IDT74ALVC16244APV
IDT74CBTLV3383PY
IDT74FCT162374ATPV IDT74FCT162H501CTPV
IDT29FCT52DTQ
IDT74ALVC16245PV
IDT74CBTLV3383Q
IDT74FCT162374CTPV IDT74FCT162H952ATPV
IDT49FCT20805PYI IDT74ALVC162836PV
IDT74CBTLV3384PY
IDT74FCT162374ETPV IDT74FCT162H952CTPV
IDT49FCT20805QI IDT74ALVC164245PV
IDT74CBTLV3384Q
IDT74FCT16240ATPV
IDT74FCT162H952ETPV
IDT49FCT3805APY IDT74ALVC244PY
IDT74CBTLV3861PY
IDT74FCT16240CTPV
IDT74FCT163244APV
IDT49FCT3805APYI IDT74ALVC244Q
IDT74CBTLV3861Q
IDT74FCT16240ETPV
IDT74FCT163244CPV
IDT49FCT3805AQ
IDT74ALVCH162244PV IDT74CBTLV3862PY
IDT74FCT16244ATPV
IDT74FCT163245APV
IDT49FCT3805AQI IDT74ALVCH162245PV IDT74CBTLV3862Q
IDT74FCT16244CTPV
IDT74FCT163245CPV
IDT49FCT3805DPYI IDT74ALVCH162373PV IDT74CBTLV6800PY
IDT74FCT16245ATPV
IDT74FCT163344APV
IDT49FCT3805DQI IDT74ALVCH162374PV IDT74CBTLV6800Q
IDT74FCT16245CTPV
IDT74FCT163344CPV
IDT49FCT3805EPYI IDT74ALVCH16244PV
IDT74CBTLVR16292PV IDT74FCT16245ETPV
IDT74FCT163373APV
IDT49FCT3805EQI IDT74ALVCH16245PV
IDT74CBTLVR3384PY
IDT74FCT162500ATPV IDT74FCT163373CPV
IDT49FCT3805PY
IDT74ALVCH16260PV
IDT74CBTLVR3384Q
IDT74FCT162500CTPV IDT74FCT163374APV
IDT49FCT3805PYI IDT74ALVCH16270PV
IDT74CBTLVR3861PY
IDT74FCT162501ATPV IDT74FCT163374CPV
IDT49FCT3805Q
IDT74ALVCH16276PV
IDT74CBTLVR3861Q
IDT74FCT162501CTPV IDT74FCT163501APV
IDT49FCT3805QI
IDT74ALVCH16373PV
IDT74CBTLVR3862PY
IDT74FCT162511ATPV IDT74FCT163501CPV
IDT49FCT805APY
IDT74ALVCH16374PV
IDT74CBTLVR3862Q
IDT74FCT162511CTPV IDT74FCT163543APV
IDT49FCT805APYI IDT74ALVCH16501PV
IDT74FCT138ATQ
IDT74FCT162543ATPV IDT74FCT163543CPV
IDT49FCT805BTPY IDT74ALVCH16601PV
IDT74FCT138CTQ
IDT74FCT162543CTPV IDT74FCT163646APV
IDT49FCT805BTQ
IDT74ALVCH16646PV
IDT74FCT139ATQ
IDT74FCT16260ATPV
IDT74FCT163646CPV
IDT49FCT805CTPY IDT74ALVCH16721PV
IDT74FCT139CTQ
IDT74FCT16260CTPV
IDT74FCT16373ATPV
IDT49FCT805CTQ IDT74ALVCH16903PV
IDT74FCT151ATQ
IDT74FCT16260ETPV
IDT74FCT16373CTPV
IDT49FCT805PY
IDT74ALVCH16952PV
IDT74FCT151CTQ
IDT74FCT162646ATPV IDT74FCT16374ATPV
IDT49FCT805PYI
IDT74ALVCHR162245PV IDT74FCT157ATQ
IDT74FCT162646CTPV IDT74FCT16374CTPV
IDT49FCT806APY
IDT74ALVCHR162269APV IDT74FCT157CTQ
IDT74FCT162652ATPV IDT74FCT16374ETPV
IDT49FCT806BTPY IDT74CBTLV16210PV
IDT74FCT157DTQ
IDT74FCT162652CTPV IDT74FCT163827APV
IDT49FCT806BTQ
IDT74CBTLV16211PV
IDT74FCT161ATQ
IDT74FCT162701ATPV IDT74FCT163827CPV
IDT49FCT806CTPY IDT74CBTLV16212PV
IDT74FCT161CTQ
IDT74FCT162701TPV
IDT74FCT163952APV
IDT49FCT806CTQ IDT74CBTLV16214PV
IDT74FCT162240ATPV IDT74FCT162823ATPV IDT74FCT163952CPV
Note: For T & R (shipping method) "8" is added to the part number and for industrial grade, letter "I" is added to the part number.
Page 3 of 9
Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054
PRODUCT/PROCESS CHANGE NOTICE (PCN)
ATTACHMENT - PCN #: A-0312-02
Appendix - 1
IDT74FCT163ATQ
IDT74FCT240ATQ
IDT74FCT3574AQ
IDT74FCT541CTPY
IDT74FCT827CTPY
IDT74FCT163CTQ IDT74FCT240CTPY
IDT74FCT3574Q
IDT74FCT541CTQ
IDT74FCT827CTQ
IDT74FCT164245TPV IDT74FCT240CTQ
IDT74FCT373ATPY
IDT74FCT543ATPY
IDT74FCT841ATPY
IDT74FCT16500ATPV IDT74FCT244ATPY
IDT74FCT373ATQ
IDT74FCT543ATQ
IDT74FCT841ATQ
IDT74FCT16500CTPV IDT74FCT244ATQ
IDT74FCT373CTPY
IDT74FCT543CTPY
IDT74FCT841CTPY
IDT74FCT16501ATPV IDT74FCT244CTPY
IDT74FCT373CTQ
IDT74FCT543CTQ
IDT74FCT841CTQ
IDT74FCT16501CTPV IDT74FCT244CTQ
IDT74FCT374ATPY
IDT74FCT543DTPY
IDT74FCT88915TT100PY
IDT74FCT16543ATPV IDT74FCT245ATPY
IDT74FCT374ATQ
IDT74FCT543DTQ
IDT74FCT88915TT133PY
IDT74FCT16543CTPV IDT74FCT245ATQ
IDT74FCT374CTPY
IDT74FCT573ATPY
IDT74FCT88915TT55PY
IDT74FCT16543ETPV IDT74FCT245CTPY
IDT74FCT374CTQ
IDT74FCT573ATQ
IDT74FCT88915TT70PY
IDT74FCT166244ATPV IDT74FCT245CTQ
IDT74FCT377ATQ
IDT74FCT573CTPY
IDT74FST163209PV
IDT74FCT166244CTPV IDT74FCT2541ATQ
IDT74FCT377CTQ
IDT74FCT573CTQ
IDT74FST163212PV
IDT74FCT166245ATPV IDT74FCT2541CTQ
IDT74FCT377DTQ
IDT74FCT574ATPY
IDT74FST163214PV
IDT74FCT166245TPV IDT74FCT2543ATQ
IDT74FCT3807APY
IDT74FCT574ATQ
IDT74FST163232PV
IDT74FCT16646ATPV IDT74FCT2543CTQ
IDT74FCT3807APYI
IDT74FCT574CTPY
IDT74FST163233PV
IDT74FCT16646CTPV IDT74FCT2573ATQ
IDT74FCT3807AQ
IDT74FCT574CTQ
IDT74FST163244PV
IDT74FCT16646ETPV IDT74FCT2573CTQ
IDT74FCT3807AQI
IDT74FCT646ATPY
IDT74FST163245PV
IDT74FCT16652ATPV IDT74FCT2574ATQ
IDT74FCT3807DPYI
IDT74FCT646ATQ
IDT74FST32XL384PV
IDT74FCT16652CTPV IDT74FCT2574CTQ
IDT74FCT3807DQI
IDT74FCT646CTPY
IDT74FST6800Q
IDT74FCT16823ATPV IDT74FCT257ATQ
IDT74FCT3807EPYI
IDT74FCT646CTQ
IDT74GTLP16612PV
IDT74FCT16823CTPV IDT74FCT257CTQ
IDT74FCT3807EQI
IDT74FCT652ATQ
IDT74LVC07APY
IDT74FCT16823ETPV IDT74FCT257DTQ
IDT74FCT3807PY
IDT74FCT652CTQ
IDT74LVC08APY
IDT74FCT16827ATPV IDT74FCT2646ATQ
IDT74FCT3807PYI
IDT74FCT807BTPY
IDT74LVC11APY
IDT74FCT16827CTPV IDT74FCT2646CTQ
IDT74FCT3807Q
IDT74FCT807BTPYI
IDT74LVC125APY
IDT74FCT16841ATPV IDT74FCT2652ATQ
IDT74FCT3807QI
IDT74FCT807BTQ
IDT74LVC138APY
IDT74FCT16841CTPV IDT74FCT2652CTQ
IDT74FCT3811PYI
IDT74FCT807BTQI
IDT74LVC138AQ
IDT74FCT16952ATPV IDT74FCT273ATPY
IDT74FCT3827AQ
IDT74FCT807CTPY
IDT74LVC157APY
IDT74FCT16952CTPV IDT74FCT273ATQ
IDT74FCT3827BQ
IDT74FCT807CTPYI
IDT74LVC157AQ
IDT74FCT16952ETPV IDT74FCT273CTPY
IDT74FCT388915T100PY IDT74FCT807CTQ
IDT74LVC161APY
IDT74FCT20807PYI IDT74FCT273CTQ
IDT74FCT388915T133PY IDT74FCT807CTQI
IDT74LVC161AQ
IDT74FCT20807QI IDT74FCT2827ATQ
IDT74FCT388915T150PY IDT74FCT810BTPY
IDT74LVC162244APV
IDT74FCT2240ATQ IDT74FCT2827CTQ
IDT74FCT388915T70PY IDT74FCT810BTQ
IDT74LVC162245APV
IDT74FCT2240CTQ IDT74FCT299ATQ
IDT74FCT521ATPY
IDT74FCT810CTPY
IDT74LVC162374APV
IDT74FCT2244ATQ IDT74FCT299CTQ
IDT74FCT521ATQ
IDT74FCT810CTQ
IDT74LVC16244APV
IDT74FCT2244CTQ IDT74FCT3244APY
IDT74FCT521CTPY
IDT74FCT821ATPY
IDT74LVC16245APV
IDT74FCT2245ATQ IDT74FCT3244AQ
IDT74FCT521CTQ
IDT74FCT821ATQ
IDT74LVC16344APV
IDT74FCT2245CTQ IDT74FCT3244PY
IDT74FCT534ATQ
IDT74FCT821CTPY
IDT74LVC16373APV
IDT74FCT2257ATQ IDT74FCT3244Q
IDT74FCT534CTQ
IDT74FCT821CTQ
IDT74LVC16374APV
IDT74FCT2257CTQ IDT74FCT3245APY
IDT74FCT540ATPY
IDT74FCT823ATPY
IDT74LVC16501APV
IDT74FCT2373ATQ IDT74FCT3245AQ
IDT74FCT540ATQ
IDT74FCT823ATQ
IDT74LVC16601APV
IDT74FCT2373CTQ IDT74FCT3245PY
IDT74FCT540CTPY
IDT74FCT823CTPY
IDT74LVC16646APV
IDT74FCT2374ATQ IDT74FCT3245Q
IDT74FCT540CTQ
IDT74FCT823CTQ
IDT74LVC16823APV
IDT74FCT2374CTQ IDT74FCT3573AQ
IDT74FCT541ATPY
IDT74FCT827ATPY
IDT74LVC16827APV
IDT74FCT240ATPY IDT74FCT3573Q
IDT74FCT541ATQ
IDT74FCT827ATQ
IDT74LVC16952APV
Note: For T & R (shipping method) "8" is added to the part number and for industrial grade, letter "I" is added to the part number.
Page 4 of 9
Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054
PRODUCT/PROCESS CHANGE NOTICE (PCN)
ATTACHMENT - PCN #: A-0312-02
Appendix - 1
IDT74LVC2244APY IDT74LVCH16373APV
IDTQS32X245Q2
IDTQS3VH16245PV
IDTQS74FCT2240CTQ
IDT74LVC2244AQ
IDT74LVCH16374APV
IDTQS32X2861Q1
IDTQS3VH16800PV
IDTQS74FCT2240TQ
IDT74LVC2245APY IDT74LVCH16501APV
IDTQS32X383Q1
IDTQS3VH16861PV
IDTQS74FCT2244ATQ
IDT74LVC2245AQ
IDT74LVCH16543APV
IDTQS32X384Q1
IDTQS3VH16862PV
IDTQS74FCT2244CTQ
IDT74LVC244APY
IDT74LVCH16601APV
IDTQS32X861Q1
IDTQS3VH2245Q
IDTQS74FCT2244TQ
IDT74LVC244AQ
IDT74LVCH16646APV
IDTQS32XL383Q1
IDTQS3VH244Q
IDTQS74FCT2245ATQ
IDT74LVC245APY
IDT74LVCH16652APV
IDTQS32XL384Q1
IDTQS3VH245Q
IDTQS74FCT2245CTQ
IDT74LVC245AQ
IDT74LVCH16827APV
IDTQS32XR245Q2
IDTQS3VH251Q
IDTQS74FCT2245TQ
IDT74LVC257APY
IDT74LVCH2244AQ
IDTQS32XR861Q1
IDTQS3VH253Q
IDTQS74FCT2257ATQ
IDT74LVC257AQ
IDT74LVCH2245AQ
IDTQS32XR862Q1
IDTQS3VH257Q
IDTQS74FCT2257CTQ
IDT74LVC273APY
IDT74LVCH244APY
IDTQS32XV245Q2
IDTQS3VH2861Q
IDTQS74FCT2257TQ
IDT74LVC273AQ
IDT74LVCH244AQ
IDTQS32XVH2245Q2
IDTQS3VH2862Q
IDTQS74FCT251ATQ
IDT74LVC32APY
IDT74LVCH245APY
IDTQS32XVH245Q2
IDTQS3VH383Q
IDTQS74FCT253ATQ
IDT74LVC373APY
IDT74LVCH245AQ
IDTQS32XVH384Q1
IDTQS3VH384Q
IDTQS74FCT2541ATQ
IDT74LVC373AQ
IDT74LVCHR162245APV IDTQS3383Q
IDTQS3VH800Q
IDTQS74FCT2541CTQ
IDT74LVC374APY
IDT74LVCHR16501APV IDTQS3384Q
IDTQS3VH861Q
IDTQS74FCT2541TQ
IDT74LVC374AQ
IDT74LVCR162245APV IDTQS3388Q
IDTQS3VH862Q
IDTQS74FCT2573ATQ
IDT74LVC377APY
IDT74LVCR2245APY
IDTQS3389Q
IDTQS4A101Q
IDTQS74FCT2573TQ
IDT74LVC377AQ
IDT74LVCR2245AQ
IDTQS3390Q
IDTQS4A105Q
IDTQS74FCT2574ATQ
IDT74LVC4245APY IDT82V3001APV
IDTQS33X253Q1
IDTQS4A110Q
IDTQS74FCT2574CTQ
IDT74LVC4245AQ
IDT82V3001PV
IDTQS33X257Q1
IDTQS4A201Q
IDTQS74FCT2574TQ
IDT74LVC541APY
IDT82V3002APV
IDTQS34X2245Q3
IDTQS4A205Q
IDTQS74FCT2821ATQ
IDT74LVC541AQ
IDT82V3002PV
IDTQS34X245Q3
IDTQS4A210Q
IDTQS74FCT2821BTQ
IDT74LVC573APY
IDT82V3011PV
IDTQS34X383Q3
IDTQS4A215Q1
IDTQS74FCT2821CTQ
IDT74LVC573AQ
IDT82V3012PV
IDTQS34XR245Q3
IDTQS5917T-100TQ
IDTQS74FCT2823ATQ
IDT74LVC574APY
IDT82V3155PV
IDTQS34XV245Q3
IDTQS5917T-132TQ
IDTQS74FCT2823BTQ
IDT74LVC574AQ
IDTQS3125Q
IDTQS34XVH2245Q3
IDTQS5917T-70TQ
IDTQS74FCT2827ATQ
IDT74LVC74APY
IDTQS3126Q
IDTQS34XVH245Q3
IDTQS5930-50TQ
IDTQS74FCT2827BTQ
IDT74LVC823APY
IDTQS316211PV
IDTQS3800Q
IDTQS5930-66TQ
IDTQS74FCT2827CTQ
IDT74LVC823AQ
IDTQS316212PV
IDTQS3861Q
IDTQS5LV919-100Q
IDTQS74FCT2828ATQ
IDT74LVC827APY
IDTQS316233PV
IDTQS3L383Q
IDTQS5LV919-133Q
IDTQS74FCT2828BTQ
IDT74LVC827AQ
IDTQS316245PV
IDTQS3L384Q
IDTQS5LV919-160Q
IDTQS74FCT2841ATQ
IDT74LVCC3245APY IDTQS32245Q
IDTQS3R245Q
IDTQS5LV919-55Q
IDTQS74FCT2841BTQ
IDT74LVCC3245AQ IDTQS32257Q
IDTQS3R384Q
IDTQS5LV919-70Q
IDTQS74FCT2841CTQ
IDT74LVCC4245APY IDTQS32384Q
IDTQS3R861Q
IDTQS5LV931-50Q
IDT74LVCC4245AQ IDTQS32390Q
IDTQS3R862Q
IDTQS5LV931-66Q
IDT74LVCH162244APV IDTQS3244Q
IDTQS3V245Q
IDTQS5LV931-80Q
IDT74LVCH162245APV IDTQS3245Q
IDTQS3VH125Q
IDTQS74FCT153ATQ
IDT74LVCH162373APV IDTQS3251Q
IDTQS3VH126Q
IDTQS74FCT153CTQ
IDT74LVCH162374APV IDTQS3253Q
IDTQS3VH16210PV
IDTQS74FCT158ATQ
IDT74LVCH16244APV IDTQS3257Q
IDTQS3VH16211PV
IDTQS74FCT158CTQ
IDT74LVCH16245APV IDTQS32861Q
IDTQS3VH16212PV
IDTQS74FCT2157ATQ
IDT74LVCH16260APV IDTQS32X2245Q2
IDTQS3VH16233PV
IDTQS74FCT2157CTQ
IDT74LVCH16276APV IDTQS32X2384Q1
IDTQS3VH16244PV
IDTQS74FCT2240ATQ
Note: For T & R (shipping method) "8" is added to the part number and for industrial grade, letter "I" is added to the part number.
Page 5 of 9
ABLEBOND® 8290
MEDIUM STRESS DIE ATTACH ADHESIVE
DESCRIPTION Ablebond® 8290 medium stress die attach adhesive is designed for high reliability leadframe packaging applications. This
electrically conductive adhesive offers improved JEDEC performance and can be used in a variety of package sizes.
FEATURES · Low stress · Improved JEDEC performance · Use for a variety of die sizes
TYPICAL UNCURED PROPERTIES
TEST DESCRIPTION
TEST METHOD
Filler Type Viscosity @ 25°C Thixotropic Index Work Life @ 25oC Estimated Storage Life @ -40oC
Silver 9,000 cP 5.9 24 hours 1 year
Brookfield CP-51 @ 5 rpm Viscosity @ 0.5 rpm/Viscosity @ 5 rpm 25% increase in viscosity @ RT
PT-42 PT-61 PT-59 PT-13
CURE PROCESS DATA Weight Loss on Cure
2.5%
10mm x 10mm Si die on glass slide
PT-80
Recommended Cure Condition Ramp 30 minutes to 175ºC and hold 15 minutes
Alternate Cure Condition1
Ramp 30 minutes to 175ºC and hold 60 minutes
1 Alternate cure recommended for larer die sizes for void minimization.
Typical properties are not intended to be used as specification limits. If you need to write a specification, ask for our Standard Release Specification.
12/01
PHYSIOCHEMICAL PROPERTIES POST CURE
TEST DESCRIPTION
Ablebond 8290
TEST METHOD
Ionics
Chloride
Sodium
Potassium
Glass Transition Temperature
Coefficient of Thermal Expansion
Below Tg
Above Tg
Dynamic Tensile Modulus
@ 25oC
@ 150oC
@ 250oC
Moisture Absorption @ Saturation
16 ppm 12 ppm 1 ppm 38°C
81 ppm/°C 181 ppm/°C
3100 MPa (440 Kpsi) 140 MPa (20 Kpsi) 120 MPa (17 Kpsi) 0.71%
Teflon flask 5 gm sample 20-40 mesh 50 gm DI water 100oC for 24 hours TMA penetration mode TMA expansion mode
Dynamic mechanical thermal analysis using <0.5mm thick sample
Dynamic vapor sorption after 85oC/85% RH exposure
CT-13 MT-14 MT-9 MT-12
PT-65
THERMAL ELECTRICAL PROPERTIES POST CURE
Thermal Conductivity Volume Resistivity
1.6 W/mK
Laser Flash
0.008 ohm-cm 4-point probe
PT-96 PT-46
MECHANICAL PROPERTIES -
POST CURE
Die Shear Strength @ 25°C
15 kgf /die
Chip Warpage vs. Post Cure Thermal Process
Post Cure
+ Post Mold Bake (4 hours @ 175oC)
18 µm
32 µm
2x2mm Si die Ag/Cu LF (80 x 80 mil) 12.7 x 12.7 x 0.38 mm Si die (500 x 500 x 15mil) on 0.2mm thick leadframe
MT-4 MT-15
Typical properties are not intended to be used as specification limits. If you need to write a specification,
ask for our Standard Release Specification.
APPLICATION GUIDELINES SHIPMENT This Ablestik product is packed and shipped in dry ice at -80°C. Inside every dry ice shipment of Ablestik's products is a small packet containing the ABLECUBE. This is a small blue cube which retains its shape at -40°C. If the ABLECUBE is exposed to temperatures higher than -40°C, the cube will melt.
Please check the state of the ABLECUBE to ensure the integrity of the shipment. If the ABLECUBE has melted upon Receiving Inspection, place the entire shipment in a -40°C freezer and contact your Ablestik Customer Service or Sales Representative.
UNPACKING Transfer the syringes from the dry ice to a -40°C freezer without ANY delays. Freezethaw voids will form in the syringes if the syringes are repeatedly thawed and refrozen.
STORAGE This Ablestik product must be stored at -40°C. The shelf life of the material is only valid when the material has been stored at the specified storage condition. Incorrect storage conditions will degrade the performance of the material in both handling (e.g. dispensing or screen printing) and final cured properties.
ABLEBOND® 8290
MEDIUM STRESS DIE ATTACH ADHESIVE
THAWING Allow the container to reach room temperature before use. After removing from the freezer, set the syringes to stand vertically while thawing. Refer to Syringe Thaw Time chart below for the thaw time recommendation.
DO NOT open the container before contents reach ambient temperature. Any moisture that collects on the thawed container should be removed prior to opening the container.
DO NOT re-freeze. Once thawed to room temperature, the adhesive should not be refrozen.
Silver-Filled Adhesive Syringe Thaw Time
30
20
1 CC
3 CC
10 CC
30 CC
10
Temperature (°C)
0
-10
-20
-30
-40 0
10
20
30
40
50
Time (minutes)
Apply enough adhesive to achieve a 25-50 µm (1-2 mil) wet bondline thickness, dispensed with approximately 25% - 50% filleting on all sides of the die. Alternate dispense amounts may be used depending on the application requirements. Star or cross-shaped dispense patterns will yield fewer bondline voids than the matrix style of dispense pattern. Contact Ablestik Technical Service Department for detailed recommendation on adhesive application, including dispensing.
CURE Ablebond 8290 adhesive can be cured in conventional box ovens per the recommended cure condition. Refer to the Cure Process Data section of the Technical Data Sheet for the recommended cure cycles.
AVAILABILITY Ablebond adhesives are packaged in syringes or jars per customer specification. Available package sizes range from 1cc to 30cc and 1 ounce to 1 pound. For details, refer to the Ablestik Standard Package Data Set or contact your Customer Service representative.
ADHESIVE APPLICATION Thawed adhesive should be immediately placed on dispense equipment for use. If the adhesive is transferred to a final dispensing reservoir, care must be exercised to avoid entrapment of contaminants and/or air into the adhesive. Adhesive must be completely used within the product's recommended worklife of 24 hours. Silver-resin separation may occur if the adhesive is left out at ambient beyond the recommended worklife.
ABLEBOND® 8290
CAUTION
This product may cause skin irritation in sensitive persons. Avoid skin contact. If contact does occur,
wash area immediately with soap and water. Please refer to Material Safety Data Sheet (OSHA) for more details.
NATIONAL STARCH MAKES NO REPRESENTATIONS OR WARRANTIES, EXPRESSED OR IMPLIED, CONCERNING THE SUITABILITY OF THESE MATERIALS FOR USE IN IMPLANTATION IN THE HUMAN BODY OR FOR ANY OTHER USE. These materials are not designed or manufactured for use in implantation in the human body. National Starch has not performed clinical testing of these materials for implantation. National Starch has neither sought, nor received, approval from the FDA for the use of these materials in implantation in the human body.
20021 Susana Road, Rancho Dominguez, CA 90221 (310) 764-4600 Fax 310-764-2545 CUSTOMER SERVICE FAX 310-764-1783
www.ablestik.com
DISCLAIMER: All statements, technical informa- obligation shall be to replace such quantity of the to his intended use, and user assumes all risk tion and recommendations contained herein are product proved to be defective. Neither seller nor and liability whatsoever in connection therebased on tests we believe to be accurate, but the manufacturer shall be liable for any injury, loss or with. No statement or recommendation not accuracy or completeness therof is not guaran- damage, direct or consequential, arise from the contained herein shall have any force or teed, and the following is made in lieu of warranty use or inability to use the product. Before using, effect unless in an agreement signed by express or implied. Seller and manufacturer's user shall determine the suitability of the product officers of seller and manufacturer.
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