S/TEM for automated and manual work- flows, metrology, and elemental analysis Automated metrology (top) and automated EDS using Thermo Scientific Dual-X detectors (bottom) NEW! 17 Thermo Scientific™ Verios™ G4 SEM Extreme high resolution SEM with sub-nanometer performance from 1-30kV
Semiconductor Lab Solutions Manual Pdf - Overview - Drexel University Information Technology
Semiconductor Solutions About Thermo Fisher Scientific With approximately 70,000 employees, Thermo Fisher is unmatched in its global commercial reach. Our continued innovation is the key to our technology leadership. We are advancing materials characterization and in situ studies. Our technology depth is reflected in our deep applications expertise and our analytical technologies that provide new workflows and innovations. For semiconductor manufacturers and the electronics industry, we combine our electrical analysis solutions with SEMs, TEMs, DualBeam FIB/SEMs and advanced software suites to deliver root cause analysis with the highest success rate and productivity. Our industry-leading workflows deliver fast, accurate answers for accelerating IC design and production decisions. Our fault isolation and analysis products provide superior images, rich feature sets, cross-sectional metrology and automation to speed process defect identification, enable rootcause analysis, reduce yield loss and accelerate time-to-market for new products. Our expertise, market leadership and continued R&D commitment are paving the way to innovations in 3D gates and memory, transisitor design and advanced material integration. Thermo Fisher Scientific supplies innovative solutions for electron microscopy and microanalysis to take customers from questions to usable data by combining high-resolution imaging with physical, elemental, chemical and electrical analysis across scales and modes-- through the broadest sample types. 2 Table of Contents Localization....................................................................................... 5 Electrical Analysis................................................................................................6 Preparation........................................................................................ 8 Physical Analysis (SEM, STEM, FIB Sample Prep)................................................9 Physical Analysis (Large Area FIB processing)................................................... 11 Wafer Yield Control and Metrology...................................................................13 Analysis............................................................................................ 14 Physical Analysis (S/TEM)..................................................................................15 Physical Analysis (SEM)..................................................................................... 17 Physical Analysis (Elemental and Structural Analysis with the Electron Microscope).............................................................................18 Surface Analysis (XPS)......................................................................................20 Chemical Analysis (RAMAN and FTIR)...............................................................22 Chemical Analysis (IC, ICP-MS, GC-MS)...........................................................23 Wafer Yield Control and Metrology...................................................................24 ESD Compliance Testing...................................................................................26 Temperature Control (Recirculating Chillers / Heat Exchangers)........................28 Circuit Edit.........................................................................................................30 Digital Services............................................................................... 31 Superior Insight, Peak Performance.................................................................32 Advance and Accelerate Key Features.............................................................33 Automated Workflows.................................................................... 34 Near Line Metrology..........................................................................................35 Root-cause Analysis..........................................................................................36 CAD Navigation............................................................................... 37 CAD-to-Stage Navigation Capabilities..............................................................38 Further Reading.............................................................................. 39 3 LocalDiigzitaatlioSenrvices Circuit Edit S/TEM & SEM Metrology LIMS Analysis Atom Probe Preparation TEM Preparation Cross-Sectioning Delayering 4 Automated WorkPflorewpsaration CAD Navigation NanoprLoabseinr gAblation Optical Fault Isolation Thermal Fault Isolation ElementaDl eAfneaclytsAisnalysis Chemical & Surface Analysis ESD Testing Accelerating research and development · Solving complex analytical challenges · Increasing lab productivity and yield Localization Shrinking technology, new materials, and increasingly complex structures are driving defectivity, especially when the circuit design is sensitive to process variation. These non-visual defects reveal themselves as electrical faults that downgrade device performance, threaten reliability, and destroy yield. Additionally, high-density interconnects, wafer-level stacking, flexible electronics, and integral substrates mean that failure-inducing defects have more places to hide, making characterization more difficult, and more critical, than ever. Our electrical analysis tools clearly identify these subtle electrical issues, significantly augmenting QC and QA oversight. Localization Electrical Analysis Thermo ScientificTM ELITETM System Thermo ScientificTM MeridianTM System NEW! Thermo ScientificTM MeridianTM S System Heat-based, nondestructive electrical fault localization at the die, package or board level Electrical fault localization and circuit timing analysis at the die or wafer level, based on emission or laser stimulation Localization of electrical faults in semiconductor devices, identification of electrical shorts, areas of leakage and device activity via non-destructive analysis · Fast detection · Precise localization · 3D packaging solutions · Thermal diagnostics 6 Dynamic analysis and laser voltage imaging/probing · Sub-cell localization · Low duty cycle LVP · Higher SNR · New applications New high-sensitivity OBIRCH detects hard electrical faults Localization Electrical Analysis Thermo ScientificTM nProberTM III and flexProberTM Systems Thermo ScientificTM HyperionTM II System SEM-based nanoprobers for localization and characterization of electrical faults in transistors and interconnects AFM-based nanoprober for localization and characterization of electrical faults in transistors and interconnects Low kV SEM and stable probing platform for advanced logic and memory devices · Fast transistor probing · 7nm capable · Conductive AFM and topographic AFM 7 Preparation Advanced physical and electrical analysis is required, across a broad range of device types and technology nodes, for yield management and process control. Precise, high-quality, efficient sample preparation is a vital part of any analysis workflow and in most cases, the quality of the data depends on the quality of the sample preparation. Thermo Fisher Scientific provides industry standard sample preparation solutions based on its advanced focused ion beam (FIB) and beam chemistry techniques. These solutions are most commonly used for creating SEM cross-sections, TEM analysis, transistor nanoprobing and atom probe tomography preparation. Preparation Physical Analysis (SEM, STEM, FIB Sample Prep) Thermo ScientificTM HeliosTM 5 FX DualBeam System Thermo ScientificTM HeliosTM 5 UX and HX DualBeam Systems Highest resolution (3A) in situ STEM and lowest damage Ga FIB enables root cause analysis within one instrument Combined XHR SEM + Low kV FIB milling supports advanced cross section and TEM sample preparation workflows Top: High resolution STEM image of a 14nm device cut in across the fins of the device Bottom: Low kV SEM image of the end of a TEM lamella Visualization of a 3D volume of a 22nm Device created using Thermo Scientific AvizoTM Software 9 Preparation Physical Analysis (SEM, STEM, FIB Sample Prep) Thermo ScientificTM SciosTM 2 DualBeam Entry level DualBeamTM system offering high contrast, flexible imaging and analytical capability for failure analysis of larger devices Backscattered electron image of an OLED in cross section 10 Preparation Physical Analysis (Large Area FIB Processing) Thermo ScientificTM HeliosTM G4 PFIB CXe DualBeam SEM: Elstar UC+ (0.7nm @1keV resolution) FIB: PFIB2.0 Xe+ ion, 1pA-2.5uA 110 mm stage Large Area PFA and Materials Analysis General purpose, large area sample prep and analysis EDS/EBS imaging of 3D and advanced packaging technologies 11 Preparation Physical Analysis (Large Area FIB Processing) Thermo ScientificTM HeliosTM G4 PFIB HXe DualBeam Thermo ScientificTM HeliosTM G4 PFIB UXe DualBeam SEM: Elstar UC+ (0.7nm @1keV resolution) FIB: PFIB2.0 Xe+ ion, 1pA-2.5uA 4" UHR stage Automated delayering and large area TEM preparation SEM: Elstar UC+ (0.7nm @1keV resolution) FIB: PFIB2.0 Xe+ plasma, 1pA-2.5uA 6" Piezo stage Comprehensive delayering and large area PFA Advanced Logic and 3D NAND deprocessing and silicon trenching for nanoprobing or electrical failure analysis 12 Thick Cu deprocessing, delayering, high speed cross section analysis, chunking on advanced node devices and packaging Preparation Wafer Yield Control and Metrology Thermo ScientificTM ExSolveTM 2 Wafer TEM Prep System Fully automated, high-throughput lamella preparation for advanced logic and 3D NAND metrology Logic 3D NAND Left: ROI of 1um x 500nm @ lamella thickness > 15nm with < 5nm cut placement Right: ROI of 1um x 5um @ 30nm lamella thickness for advanced 3D NAND 13 Analysis Analytical solutions are the core of Thermo Fisher Scientific. We serve a broad range of academic, industrial, microelectronics and life science markets with automated, high-productivity, high-performance tools. The semiconductor industry is one of the most demanding of these markets, with a growing need to maximize device performance, device yield, throughput and efficiency. Our analytical tools are the process of record for almost all major manufacturers of logic, memory, display, MEMS, analog and packaged devices. Additionally, they are seen as the reference technology in a wide variety of applications such as: · Materials analysis · Device debug · Yield improvement · Defect/failure root-cause analysis · Metrology · Research and development Analysis Physical Analysis (S/TEM) Thermo ScientificTM TalosTM TEM NEW! Thermo ScientificTM SpectraTM 300 TEM Ease of use, highproductivity imaging and analysis for general semiconductor FA and production support Ultimate atomic answer for advanced semiconductor analysis and research Fast imaging and EDS on semiconductor memory devices Atomic analysis of advanced logic devices 15 Analysis Physical Analysis (S/TEM) Thermo ScientificTM MetriosTM DX TEM NEW! Thermo ScientificTM MetriosTM AX TEM TEM for automated and highthroughput metrology S/TEM for automated and manual workflows, metrology, and elemental analysis TEM image and EDS metrology 16 Automated metrology (top) and automated EDS using Thermo Scientific Dual-X detectors (bottom) Analysis Physical Analysis (SEM) Thermo ScientificTM VeriosTM G4 SEM Thermo ScientificTM ApreoTM SEM System Extreme high resolution SEM with sub-nanometer performance from 1-30kV Low voltage images of ceramic battery catalyst and hard drive reader images Top: Low voltage low magnification images of a component on a PCB Bottom: 200V image of a deprocessed 14nm device 17 Analysis Physical Analysis (Elemental and Structural Analysis with the Electron Microscope) Thermo ScientificTM UltraDryTM EDS X-ray detectors Thermo ScientificTM MagnarayTM WDS spectrometer Energy Dispersive X-ray spectrometers for accurate elemental analysis Wavelength Dispersive Spectroscopy (WDS) for the ultimate in energy resolution EDS elemental analysis of devices using principal component techniques 18 WDS spectrum of Si overlaid on EDS spectrum of Si. Analysis Physical Analysis (Elemental and Structural Analysis with the Electron Microscope) Thermo ScientificTM QuasorTM EBSD Camera Thermo ScientificTM LumisTM EBSD Detector Electron BackScatter Diffraction (EBSD) for microstructural analysis in the SEM High-sensitivity electron backscatter diffraction (EBSD) for microstructural analysis in the SEM Diffraction pattern is single crystalline Si Indexing of GaN electron backscatter pattern 19 Analysis Surface Analysis (XPS) Thermo ScientificTM K-AlphaTM X-ray Photoelectron Spectrometer (XPS) System Thermo Scientific NexsaTM X-Ray Photoelectron Spectrometer (XPS) System Fully automated XPS system with ion source for depth profiling Si0 Multi-technique surface analysis system with micro-focus X-ray source. Options for cluster ion source, UV-photoelectron spectroscopy (UPS), ISS (LEIS), REELS and Raman Pd Cu Si Understanding thin film structure and interface chemistry using the high performance ion source and high sensitivity spectrometer The small spot X-ray source enables identification of pad surface contamination, resist composition, and pad structure through depth profiling 20 Analysis Surface Analysis (XPS) Thermo ScientificTM ESCALABTM Xi+ System Configurable surface analysis platform with options for UV-PS, Auger spectroscopy, EDS and in vacuum sample preparation XPS, REELS and UVPS can be used together to understand work function and band gap properties 21 Analysis Chemical Analysis (RAMAN and FTIR) Thermo ScientificTM NicoletTM iS50 FTIR Spectrometer Thermo ScientificTM DXRTM 2xi Raman Imaging Microscope Reliable QC and characterization of Epi, BPSG, C and O in Si wafers Quantitative analysis of semiconductor gases Rapidly locate and identify organic and inorganic contaminants on circuits, displays, sensors FTIR spectral analysis of BPSG film Raman principal component analysis of strained regions in silicon 22 Analysis Chemical Analysis (IC, ICP-MS, GC-MS) Thermo ScientificTM DionexTM ICS 6000+ IC Thermo ScientificTM iCAPTM RQ ICP-MS, iCAPTM TQs ICP-MS · QA/QC of UPW and chemicals · Anions cations contamination analysis Thermo ScientificTM ISQTM GC-MS, Trace 1300 GC · QA/QC, UPW and semiconductor grade chemicals · Ultratrace elemental impurities Thermo ScientificTM ElementTM Series High-resolution ICP-MS · QA/QC of CR air and gases · Organic contamination analysis · QA/QC and research · Interference free ultratrace impurities 23 Analysis Wafer Yield Control and Metrology Thermo ScientificTM HeliosTM G4 EX/L DualBeam In-fab, semi-automated defect analysis and metrology tool through Slice and View or advanced TEM lamella preparation Slice and View TEM Prep Navigate to defect via KLARF file from defect review tool: · Slice and View defects for failure analysis · Automated recipes for TEM sample prep 24 Analysis Wafer Yield Control and Metrology Thermo ScientificTM MetriosTM DX TEM NEW! Thermo ScientificTM MetriosTM AX TEM Fully automated STEM and TEM with automated metrology and analytics Metrology Auto EDS Metrology S/TEM for automated and manual workflows, metrology, and elemental analysis The small spot X-ray source enables identification of pad surface contamination, resist composition, and pad structure through depth profiling Automated metrology (top) and automated EDS using Thermo Scientific Dual-X detectors (bottom) 25 Analysis ESD Compliance Testing Thermo ScientificTM MKTM Series Thermo ScientificTM Orion3TM System Automated ESD testing to industry standards for human body model, machine model and latch-up Charged device model testing with closed-loop feedback humidity controls for improved accuracy and precision · Parallel test up to 12 devices · Reliable relay-based design · Expandable to 2,304 pins · Small 0.6 m2 footprint 26 Easy test set-up with ScimitarTM Software and dual high resolution cameras Analysis ESD Compliance Testing Thermo ScientificTM CelestronTM System Thermo ScientificTM PegasusTM System Transmission line pulse to characterize device protection structures and predict failures 2 Pin ESD and curve tracing for wafers and packaged parts Intuitive software makes test setup and operation easy with the graphical user interface Precise 330 ohm waveform delivers results that correlate completely with ESD test standards 27 Analysis Temperature Control (Recirculating Chillers / Heat Exchangers) Thermo ScientificTM ThermoFlexTM Chillers Thermo ScientificTM MerlinTM Chillers Thermo ScientificTM ThermoChillTM Chillers · Highly configurable · -5 to 90° C · 900 to 24 kW Cooling · Semi S2 compliant · Etch · Deposition · Flourinert compatible · -15 to 35° C · 1.1 to 4.8 kW cooling · Lithography · Ion implant · Economical · -10 to 30° C · 0.7 to 2 kW cooling · Lithography · Ion implant · Microscopy · Spectrophotometry 28 Analysis Temperature Control (Recirculating Chillers / Heat Exchangers) Thermo ScientificTM Heat Exchangers Thermo ScientificTM Custom Designs · Compact · 5 to 40° C · 14 to 100 kW cooling · Microscopy · Spectrophotometry · Special requirements · -90 to 90° C · Up to 100 kW cooling · Up to ± 0.001° C stability · Test 29 Analysis Circuit Edit Thermo ScientificTM TaipanTM System NEW! Thermo ScientificTM CentriosTM System · 7nm Circuit Edit solution · 2.2nm FIB resolution · Improved secondary electron detection · Low drift (<4nm/min) · High accuracy (laser interferometer) stage · High resolution Tomahawk WDR FIB · Innovative Dual MultiChem · Superior contrast with high SNR · Planar large area delayering · Circuit Edit solution for 14nm and above design rule devices High resolution Tomahawk WDR FIB (top) opens low-level metal layer with precision and control Dual Multichem design enables (bottom) repeatable, precise and uniform process control 30 Digital Services Maximize Productivity and Optimize System Performance Root Cause Predictive Diagnostic System Monitoring Dashboard Operational Lifetime FEG 853 days 0 730 Daily operational time (4 weeks average) 24 hrs/day Time since last warm or cold start 94 days Number of starts in the last 6 months 4 FEG Temperature 43° C 0 50 One-day median FEG temperature 43° C FEG Emission Current 223 µA 0 550 Extractor Voltage Test line 3,706 V FEG IGPf Spikes Last 24 hours 0 Spikes 0 1 Last peak value N/A FEG Extractor Voltage Deviation -43 V -300 300 Extractor Voltage Test line 3,706 V Deviation Normalized Emission FEG 4 % -20 30 Normalized Emission (at 4kV) 275 µA HT Emission 0.0 µA 0 6 HT Setting Voltage 300,000 V Time since last cryocycle 14 days 0 42 Duration 143.9 hrs IGPf Current 24-hour average 0.21 µA 0.0 0.7 IGPf Current 4-weeks average 0.24 µA Extractor Voltage Changes in the last 4 weeks 24 times 0 40 Changes 95V in the last 4 weeks 24 times Acquisition mode usage Last 7 days STEM TEM LUX Other Data Analytics to Improve Performance Utilization Reports Automated Alerts / Service Response Digital Services Productivity and System Performance Operational Lifetime FEG 853 days 0 730 Daily operational time (4 weeks average) 24 hrs/day Time since last warm or cold start 94 days Number of starts in the last 6 months 4 FEG Temperature 43° C 0 50 One-day median FEG temperature 43° C FEG Emission Current 223 µA 0 550 Extractor Voltage Test line 3,706 V FEG IGPf Spikes Last 24 hours 0 Spikes 0 1 Last peak value N/A FEG Extractor Voltage Deviation -43 V -300 300 Extractor Voltage Test line 3,706 V Deviation Normalized Emission FEG 4 % -20 30 Normalized Emission (at 4kV) 275 µA HT Emission 0.0 µA 0 6 HT Setting Voltage 300,000 V Time since last cryocycle 14 days 0 42 Duration 143.9 hrs IGPf Current 24-hour average 0.21 µA 0.0 0.7 IGPf Current 4-weeks average 0.24 µA Extractor Voltage Changes in the last 4 weeks 24 times 0 40 Changes 95V in the last 4 weeks 24 times Acquisition mode usage Last 7 days STEM TEM LUX Other System monitoring Maximize uptime with our proprietary system-monitoring technology that allows us to observe key system parameters and proactively address service needs. Firewall Remote diagnostics (RAPID) Increase system performance and utilization by remotely connecting to expert support wherever you are located in the world. Remote Expert Support Team Secure Portal Firewall Firewall The Internet Customer Instrument Digital service reporting Optimize every aspect of your investment by tracking detailed information of your system utilization, service history, operators and other key indicators for your Thermo Scientific fleet. 32 Digital Services Advance and Accelerate Key Features With an Accelerate warranty uplift plan, our onsite service response will be twice as fast, and it is backed by an uptime guarantee. With an Advance service plan, we deliver greater visibility, proactive root cause analysis and improved time to resolution, ultimately maximizing productivity. Our Uptime Guarantee gives you the confidence to meet or exceed your system availability demands. With Digital Services, we monitor your system and proactively identify issues to optimize performance. Maintenance Service issues will be promptly addressed with an remote response capability coupled with an onsite response as needed. The Thermo Fisher Scientific Applications Support team will train your staff on system operation and optimally tune your system to your specific application. After-Hours Service provides support when you need it, even outside of standard coverage. 33 Automated Workflows Near Line Metrology Calibrated and distortion-free imaging is essential for precise and accurate metrology, enabling fabrication engineers to make mission critical process decisions. The ability to produce large amounts of quality automated data is fundamental to understanding how 2D and 3D structures evolve from the front to back end of the line. This data is equally important as reference metrology for optical critical dimension (OCD) models. Automated imaging and metrology enable fast, consistent and precise data at a fraction of the operator overhead. Our enhanced throughput model ((H)ETM) workflows are engineered for industry leading productivity and fastest time-to-data and are the process of record across the semiconductor world. Root-cause Analysis The management and elimination of defects during fabrication is becoming more and more challenging as they become smaller and buried in relatively large 3D structures. Thermo Fisher Scientific is the leading provider of workflow solutions to locate, isolate and study defects on a broad range of device types and scale lengths. We have developed high-yield, high-productivity solutions that can work from the millimeter to atomic scale and provide the most comprehensive chemical, structural and physical information, all with the fastest time-to-data available. 34 35 Automated Workflows Near Line Metrology Helios G4 EXL Defect navigation 7nm lamella, semi-auto TEMLink Semi-automated plucking ExSolve 2 Process control 18 nm lamella, full-auto Metrios DX Automated S/TEM Automated EDS Metrology 1% Metrology Accuracy wÅ 3 Dynamic Precision 36 Automated Workflows Root-cause Analysis Helios Plasma FIB Precise, damage-free, site-specific device delayering and cross-section imaging nProber Nanoprobing Simple, reliable fault isolation and transistor characterization at the nanometer scale Helios FIB/SEM High productivity, tools for cross-section imaging and analysis, the most trusted tools for TEM and Atom Probe sample preparation; available in small sample or wafer configuration Metrios/Spectra/Talos TEM Fastest time to data on TEM platforms that can be configured for a variety of defect analysis applications (for example S/TEM imaging, EDS, EELS, strain) CAD Navigation Workflows for physical failure analysis, electrical failure analysis, metrology and defect review all require continual improvements for enhanced productivity. Quickly and repeatably reaching the correct region of interest (ROI) is, therefore, essential. Thermo ScientificTM NEXSTM Software delivers a wide range of CAD-to-stage navigation capabilities for fault isolation, failure analysis, and sample preparation. It features easy-to-use CAD viewing and automatically drives the system stage to a precise ROI as indicated by the CAD model. Note that NEXS Software also reads the mask data from GDS2 and OASIS format files and provides connectivity options with other Thermo Scientific analytical tools. CAD Navigation CAD-to-Stage Navigation Capabilities NEXS CAD Navigation and Overlay Provides user friendly navigation to CAD coordinates on all Thermo Scientific product platforms (CE, DualBeam Systems, Meridian, etc.) Simple navigation using CAD overlay on a Thermo Scientific Helios DualBeam image 38 Further Reading Papers/presentations Electron Channeling Contrast Imaging (ECCI) for beyond Silicon materials characterization Mr. Libor Strakos, Thermo Fisher Scientific, Brno, Czech Republic Andreas Schulze, PhD, Imec, Leuven, Belgium Mr. Ondrej Machek, Thermo Fisher Scientific, Brno, Czech Republic Tomas Vystavel, PhD, Thermo Fisher Scientific, Brno, Czech Republic Mr. Matty Caymax, Imec, Leuven, Belgium Richard J. Young, PhD, Thermo Fisher Scientific, Hillsboro, OR Automated Diagonal Slice & View Solution for 3D Device Structure Analysis Sang Hoon Lee, PhD, Thermo Fisher Scientific, Hillsboro, OR Mr. Jeff Blackwood, Thermo Fisher Scientific, Hillsboro, OR Mr. Stacey Stone, Thermo Fisher Scientific, Hillsboro, OR Michael Schmidt, Thermo Fisher Scientific, Hillsboro, OR Mark Williamson, PhD, Thermo Fisher Scientific, Hillsboro, OR Woo Jun Kwon, Thermo Fisher Scientific Korea, Suwon-si, Gyeonggido, Korea, Republic of (South) Sung Jae Lee, Thermo Fisher Scientific Korea, Suwon-si, Gyeonggi-do, Korea, Republic of (South) Improved Phase Data Acquisition for Thermal Emissions Analysis of 2.5D IC Ms. Bernice Zee, Advanced Micro Devices (AMD), Singapore, Singapore Ms. Wen Qiu, Advanced Micro Devices, Singapore, Singapore Brian Lai, Thermo Fisher Scientific, Fremont, CA David Tien, Thermo Fisher Scientific, Fremont, CA Jim Vickers, Thermo Fisher Scientific, Fremont, CA Analysis of induced end-of-life failures in SRAM through nanoprobing Mr. Oberon St John Dixon-Luinenburg, Thermo Fisher Scientific, Santa Barbara, CA Mr. Jordan Fine, PhD, Thermo Fisher Scientific, Santa Barbara, CA Novel Approach of Improving Secondary Electron Detector in FIB System Steve Wang, PhD, Thermo Fisher Scientific, Fremont, CA Jim McGinn, Thermo Fisher Scientific, Fremont, CA Peter Tvarozek, Thermo Fisher Scientific, Fremont, CA Mr. Amir Weiss, Thermo Fisher Scientific, Fremont, CA High Resolution Image Fusion of Linearly Polarized Subsurface Optical Images T. Berkin Cilingiroglu, Thermo Fisher Scientific Neel Leslie, Thermo Fisher Scientific Seema Somani, Thermo Fisher Scientific Prasad Sabbineni, Thermo Fisher Scientific Use of analog simulation in failure analysis: Application to Emission microscopy and laser Voltage Probing techniques Mr. Etienne Auvray, ST Microelectronics, Grenoble Cedex, France Mr. Paul Armagnat, ST microelectronics, GRENOBLE, France Dr. Luc Saury, ST microelectronics, GRENOBLE, France Dr. Antoine Reverdy, IMS laboratory, University of Bordeaux, Talence, France Mr. Tommaso Melis, ST microelectronics, GRENOBLE, France Partner with us -- The process of record for major semiconductor manufacturers, equipment makers and service labs around the world thermofisher.com/EM-semiconductors © 2019 Thermo Fisher Scientific Inc. All rights reserved. All trademarks are the property of Thermo Fisher Scientific and its subsidiaries unless otherwise specified. BR0086-EN-10-2019Adobe PDF Library 15.0 Adobe InDesign CC 14.0 (Macintosh)