u blox LISAU230 3.75G HSPA Wireless Module User Manual LISA U series

u-blox AG 3.75G HSPA Wireless Module LISA U series

08 system integration manual

    LISA-U series 3.75G HSPA / HSPA+ Wireless Modules System Integration Manual                   Abstract This document describes the features and the system integration of LISA-U1 series HSPA and LISA-U2 series HSPA+ wireless modules. These  modules  are  complete  and  cost  efficient  3.75G  solutions offering up to six-band HSDPA/HSUPA and quad-band GSM/EGPRS voice and/or data transmission technology in a compact form factor.  www.u-blox.com   locate, communicate, accelerate
LISA-U series - System Integration Manual   3G.G2-HW-10002-A3    Page 2 of 160  Document Information Title LISA-U series Subtitle 3.75G HSPA / HSPA+ Wireless Modules  Document type System Integration Manual  Document number 3G.G2-HW-10002-A3 Document status Preliminary  Document status information Objective Specification This document contains target values. Revised and supplementary data will be published later. Advance Information This document contains data based on early testing. Revised and supplementary data will be published later. Preliminary This document contains data from product verification. Revised and supplementary data may be published later. Released This document contains the final product specification.  This document applies to the following products: Name Type number Firmware version PCN / IN LISA-U100 LISA-U100-00S-00 10.72 3G.G2-SW-11000  LISA-U100-01S-00 11.40 n.a. LISA-U110 LISA-U110-00S-00 10.72 3G.G2-SW-11000  LISA-U110-01S-00 11.40 n.a. LISA-U120 LISA-U120-00S-00 10.72 3G.G2-SW-11000  LISA-U120-01S-00 11.40 n.a. LISA-U130 LISA-U130-00S-00 10.72 3G.G2-SW-11000  LISA-U130-01S-00 11.40 n.a.  LISA-U130-01A-00 11.40 n.a. LISA-U200 LISA-U200-00S-00 21.21 n.a.  LISA-U200-01S-00 TBD n.a. LISA-U230 LISA-U230-01S-00 TBD n.a.  LISA-U230-01A-00 TBD n.a.    This document and the use of any information contained therein, is subject to the acceptance of the u-blox terms and conditions. They can be downloaded from www.u-blox.com. u-blox makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice.  u-blox reserves all rights to this document and the information contained herein. Reproduction, use or disclosure to third parties without express permission is strictly prohibited. Copyright © 2012, u-blox AG. u-blox® is a registered trademark of u-blox Holding AG in the EU and other countries. Trademark Notice Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Preface      Page 3 of 160 Preface u-blox Technical Documentation As  part  of  our  commitment  to  customer  support,  u-blox  maintains  an  extensive  volume  of  technical documentation for our products. In addition to our product-specific technical data sheets, the following manuals are available to assist u-blox customers in product design and development. AT  Commands  Manual:  This  document  provides  the  description  of  the  supported  AT  commands  by  the  LISA-U series modules to verify all implemented functionalities. System  Integration  Manual: This Manual provides hardware design instructions and information on how to set up production and final product tests. Application  Note:  document  provides  general  design  instructions  and  information  that  applies  to  all  u-blox Wireless  modules.  See  Section  Related  documents for  a  list of  Application  Notes  related  to  your  Wireless Module. How to use this Manual The  LISA-U series  System  Integration Manual  provides  the  necessary information to successfully  design  in and configure these u-blox wireless modules. This manual has a modular structure. It is not necessary to read it from the beginning to the end. The following symbols are used to highlight important information within the manual:  An index finger points out key information pertaining to module integration and performance.  A warning symbol indicates actions that could negatively impact or damage the module.  Questions If you have any questions about u-blox Wireless Integration, please:  Read this manual carefully.  Contact our information service on the homepage http://www.u-blox.com  Read the questions and answers on our FAQ database on the homepage http://www.u-blox.com Technical Support Worldwide Web Our  website  (www.u-blox.com)  is  a  rich  pool  of  information.  Product  information,  technical  documents  and helpful FAQ can be accessed 24h a day. By E-mail Contact the nearest of the Technical Support offices by email. Use our service pool email  addresses rather than any personal email address of our staff. This makes sure that your request is processed as soon as possible. You will find the contact details at the end of the document. Helpful Information when Contacting Technical Support When contacting Technical Support please have the following information ready:  Module type (e.g. LISA-U100) and firmware version  Module configuration  Clear description of your question or the problem  A short description of the application  Your complete contact details
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Contents      Page 4 of 160 Contents Preface ................................................................................................................................ 3 Contents .............................................................................................................................. 4 1 System description ....................................................................................................... 7 1.1 Overview .............................................................................................................................................. 7 1.2 Architecture .......................................................................................................................................... 9 1.2.1 Functional blocks ......................................................................................................................... 10 1.2.2 Hardware differences between LISA-U series modules ................................................................. 12 1.3 Pin-out ............................................................................................................................................... 13 1.4 Operating modes ................................................................................................................................ 17 1.5 Power management ........................................................................................................................... 19 1.5.1 Power supply circuit overview ...................................................................................................... 19 1.5.2 Module supply (VCC) .................................................................................................................. 20 1.5.3 Current consumption profiles ...................................................................................................... 28 1.5.4 RTC Supply (V_BCKP) .................................................................................................................. 32 1.5.5 Interface supply (V_INT) ............................................................................................................... 34 1.6 System functions ................................................................................................................................ 35 1.6.1 Module power-on ....................................................................................................................... 35 1.6.2 Module power-off ....................................................................................................................... 39 1.6.3 Module reset ............................................................................................................................... 40 1.7 RF connection ..................................................................................................................................... 42 1.8 (U)SIM interface .................................................................................................................................. 43 1.8.1 (U)SIM functionality ..................................................................................................................... 45 1.9 Serial communication ......................................................................................................................... 46 1.9.1 Serial interfaces configuration ..................................................................................................... 46 1.9.2 Asynchronous serial interface (UART)........................................................................................... 47 1.9.3 USB interface............................................................................................................................... 62 1.9.4 SPI interface ................................................................................................................................ 65 1.9.5 MUX Protocol (3GPP 27.010) ...................................................................................................... 69 1.10 DDC (I2C) interface .......................................................................................................................... 70 1.10.1 Overview ..................................................................................................................................... 70 1.10.2 DDC application circuit ................................................................................................................ 70 1.11 Audio Interface ............................................................................................................................... 75 1.11.1 Analog Audio interface ............................................................................................................... 75 1.11.2 Digital Audio interface ................................................................................................................. 81 1.11.3 Voiceband processing system ...................................................................................................... 86 1.12 General Purpose Input/Output (GPIO) ............................................................................................. 88 1.13 Reserved pins (RSVD) ...................................................................................................................... 97 1.14 Schematic for LISA-U series module integration .............................................................................. 98 1.15 Approvals ...................................................................................................................................... 100
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Contents      Page 5 of 160 1.15.1 R&TTED and European Conformance CE mark .......................................................................... 100 1.15.2 IC .............................................................................................................................................. 101 1.15.3 Federal communications commission notice .............................................................................. 101 1.15.4 a-tick AUS Certification ............................................................................................................. 103 2 Design-In ................................................................................................................... 104 2.1 Design-in checklist ............................................................................................................................ 104 2.1.1 Schematic checklist ................................................................................................................... 104 2.1.2 Layout checklist ......................................................................................................................... 105 2.1.3 Antenna checklist ...................................................................................................................... 105 2.2 Design Guidelines for Layout ............................................................................................................ 106 2.2.1 Layout guidelines per pin function ............................................................................................. 106 2.2.2 Footprint and paste mask .......................................................................................................... 116 2.2.3 Placement ................................................................................................................................. 118 2.3 Thermal aspects ................................................................................................................................ 119 2.4 Antenna guidelines ........................................................................................................................... 120 2.4.1 Antenna termination ................................................................................................................. 121 2.4.2 Antenna radiation ..................................................................................................................... 122 2.4.3 Antenna detection functionality ................................................................................................ 123 2.5 ESD precautions ................................................................................................................................ 126 2.5.1 ESD immunity test overview ...................................................................................................... 126 2.5.2 ESD immunity test of LISA-U series reference design.................................................................. 126 2.5.3 ESD application circuits .............................................................................................................. 128 3 Features description ................................................................................................. 131 3.1 Firmware (upgrade) Over AT (FOAT) ................................................................................................. 131 3.1.1 Overview ................................................................................................................................... 131 3.1.2 FOAT procedure ........................................................................................................................ 131 3.2 TCP/IP and UDP/IP ............................................................................................................................. 131 3.2.1 Multiple PDP contexts and sockets............................................................................................. 131 3.3 FTP and FTPS .................................................................................................................................... 132 3.4 HTTP and HTTPS ............................................................................................................................... 132 3.5 AssistNow clients and GPS integration .............................................................................................. 132 3.6 Jamming Detection ........................................................................................................................... 132 3.7 In-Band modem ................................................................................................................................ 133 3.8 Smart Temperature Management ..................................................................................................... 133 3.8.1 Smart Temperature Supervisor (STS) .......................................................................................... 134 3.8.2 Threshold Definitions ................................................................................................................. 136 3.9 Hybrid positioning and CellLocate ..................................................................................................... 136 3.9.1 Positioning through cellular information: CellLocate .................................................................. 136 3.9.2 Hybrid positioning ..................................................................................................................... 138 4 Handling and soldering ........................................................................................... 139 4.1 Packaging, shipping, storage and moisture preconditioning ............................................................. 139 4.2 Soldering .......................................................................................................................................... 139
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Contents      Page 6 of 160 4.2.1 Soldering paste.......................................................................................................................... 139 4.2.2 Reflow soldering ....................................................................................................................... 139 4.2.3 Optical inspection ...................................................................................................................... 141 4.2.4 Cleaning .................................................................................................................................... 141 4.2.5 Repeated reflow soldering ......................................................................................................... 141 4.2.6 Wave soldering.......................................................................................................................... 141 4.2.7 Hand soldering .......................................................................................................................... 141 4.2.8 Rework ...................................................................................................................................... 141 4.2.9 Conformal coating .................................................................................................................... 141 4.2.10 Casting ...................................................................................................................................... 142 4.2.11 Grounding metal covers ............................................................................................................ 142 4.2.12 Use of ultrasonic processes ........................................................................................................ 142 5 Product Testing......................................................................................................... 143 5.1 u-blox in-series production test ......................................................................................................... 143 5.2 Test parameters for OEM manufacturer ............................................................................................ 143 5.2.1 ‘Go/No go’ tests for integrated devices ...................................................................................... 144 5.2.2 Functional tests providing RF operation ..................................................................................... 144 Appendix ........................................................................................................................ 147 A Migration to LISA-U2 series wireless modules ....................................................... 147 A.1 Checklist for migration ..................................................................................................................... 147 A.2 Software migration ........................................................................................................................... 148 A.2.1 Software migration from LISA-U1 series to LISA-U2 series wireless modules .............................. 148 A.3 Hardware migration.......................................................................................................................... 148 A.3.1 Hardware migration from LISA-U1 series to LISA-U2 series wireless modules ............................. 148 A.3.2 Pin-out comparison LISA-U1 series vs. LISA-U2 series ................................................................. 149 A.3.3 Layout comparison LISA-U1 series vs. LISA-U2 series .................................................................. 155 B Glossary .................................................................................................................... 156 Related documents......................................................................................................... 158 Revision history .............................................................................................................. 159 Contact ............................................................................................................................ 160
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 7 of 160 1 System description 1.1 Overview LISA-U series wireless  modules integrate  full-feature 3G UMTS/HSxPA and  2G GSM/GPRS/EDGE protocol stack with Assisted GPS support. These SMT modules come in the compact LISA form factor, featuring Leadless Chip Carrier (LCC) packaging technology. 3G UMTS/HSDPA/HSUPA Characteristics 2G GSM/GPRS/EDGE Characteristics Class A User Equipment1 Class B Mobile Station2 UMTS Terrestrial Radio Access (UTRA) Frequency Division Duplex (FDD)  3GPP Release 6 High Speed Packet Access (HSPA) for LISA-U1 series  3GPP Release 7 Evolved High Speed Packet Access (HSPA+) for LISA-U2 series  Rx Diversity for LISA-U230 GSM EDGE Radio Access (GERA)  3GPP Release 6 for LISA-U1 series  3GPP Release 7 for LISA-U2 series  Rx Diversity for LISA-U230 2-band support for LISA-U100, LISA-U120:  Band II (1900 MHz), Band V (850 MHz) 2-band support for LISA-U110, LISA-U130:  Band I (2100 MHz), Band VIII (900 MHz) 4-band support for LISA-U200-00:  Band I (2100 MHz), Band II (1900 MHz), Band V (850 MHz), Band VI (800 MHz) 6-band support for LISA-U200-01, LISA-U230:  Band I (2100 MHz), Band II (1900 MHz), Band IV (1700 MHz), Band V (850 MHz), Band VI (800 MHz), Band VIII (900 MHz)  4-band support  GSM 850 MHz, E-GSM 900 MHz,  DCS 1800 MHz, PCS 1900 MHz WCDMA/HSDPA/HSUPA Power Class  Power Class 3 (24 dBm) for WCDMA/HSDPA/HSUPA mode GSM/GPRS Power Class  Power Class 4 (33 dBm) for GSM/E-GSM bands  Power Class 1 (30 dBm) for DCS/PCS bands EDGE Power Class  Power Class E2 (27 dBm) for GSM/E-GSM bands  Power Class E2 (26 dBm) for DCS/PCS bands PS (Packet Switched) Data Rate  HSUPA category 6, up to 5.76 Mb/s UL  HSDPA category 8 up to 7.2 Mb/s DL for LISA-U1 series, LISA-U200  HSDPA category 14 up to 21.1 Mb/s DL for LISA-U230  WCDMA PS data up to 384 kb/s DL/UL PS (Packet Switched) Data Rate  GPRS multislot class 334, coding scheme CS1-CS4,  up to 107 kb/s DL, 85.6 kb/s UL for LISA-U2 series  GPRS multislot class 124, coding scheme CS1-CS4,  up to 85.6 kb/s DL/UL for LISA-U1 for LISA-U1 series  EDGE multislot class 333, coding scheme MCS1-MCS9,  up to 296 kb/s DL, 236.8 kb/s UL for LISA-U2  EDGE multislot class 124, coding scheme MCS1-MCS9,  up to 236.8 kb/s DL/UL for LISA-U1 CS (Circuit Switched) Data Rate  WCDMA CS data up to 64 kb/s DL/UL CS (Circuit Switched) Data Rate  GSM CS data up to 9.6 kb/s DL/UL  supported in transparent/non transparent mode Table 1: LISA-U series UMTS/HSDPA/HSUPA and GSM/GPRS/EDGE characteristics Operation  modes  I  to  III are  supported  on  GSM/GPRS  network,  with  user-defined  preferred  service  selectable from GSM  to GPRS. Paging messages for GSM calls can be optionally monitored during GPRS data transfer in not-coordinating NOM II-III.                                                       1 Device  can  work  simultaneously  in  Packet  Switch  and  Circuit  Switch  mode:  voice  calls  are  possible  while  the  data  connection  is  active without any interruption in service. 2 Device can be attached to both  GPRS and GSM services (i.e. Packet Switch and Circuit Switch mode) using one  service at  a  time.  If  for example during data transmission an incoming call occurs, the data connection is suspended to allow the voice communication. Once the voice call has terminated, the data service is resumed. 3 GPRS/EDGE multislot class 33 implies a maximum of 5 slots in DL (reception) and 4 slots in UL (transmission) with 6 slots in total. 4 GPRS/EDGE multislot class 12 implies a maximum of 4 slots in DL (reception) and 4 slots in UL (transmission) with 5 slots in total.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 8 of 160 Direct Link mode is supported for TCP / UDP sockets except for LISA-U1xx-00 module versions. Regarding 3G transmit and receive data rate capability, LISA-U series modules implement 3G High-Speed Uplink Packet Access (HSUPA) category 6, LISA-U1 series and LISA-U200 modules implement 3G High Speed Downlink Packet Access (HSDPA) category 8, while LISA-U230 modules implement the 3G HSDPA category 14. HSUPA and HSDPA categories  determine the  maximum speed at which data  can be respectively transmitted and received: higher categories allowing faster data transfer rates as indicated in Table 1. The  3G  network  automatically  performs  adaptive  coding  and  modulation  using  a  choice  of  forward  error correction  code  rate  and  choice  of  modulation  type,  to  achieve  the  highest  possible  data  rate  and    data transmission robustness according to the quality of the radio channel. Regarding 2G transmit and receive data rate capability, LISA-U1 series modules implement GPRS/EGPRS class 12, while LISA-U2 series modules implement GPRS/EGPRS class 33. GPRS and EGPRS classes determine the maximum number of timeslots available for upload and download and thus the speed at which data can be transmitted and received: higher classes typically allowing faster data transfer rates as indicated in Table 1. The 2G network automatically configures the number of timeslots used for reception or transmission (voice calls take precedence over GPRS/EGPRS traffic) and channel encoding (from Coding Scheme 1 up to Modulation and Coding Scheme 9), performing link adaptation to achieve the highest possible data rate. A summary of interfaces and features provided by LISA-U series modules is described in the Table 2. Note that LISA-U130-01 and LISA-U230-01 are available in standard and automotive quality grade versions.  Module Technology Bands Interface Audio Functions  HSUPA [Mb/s] HSDPA [Mb/s] UMTS/HSPA bands [MHz] GSM/GPRS/EDGE quad-band UART SPI (5 wire) USB DDC for u-blox GPS GPIO Analog Audio Digital Audio Network indication Antenna Supervisor Jamming detection Embedded TCP/UDP stack HTTP, SSL GPS via Modem Embedded AssistNow  FW update over AT (FOAT) In-band modem Rx diversity CellLocate SIM Access Profile (SAP) LISA-U100-00 5.76 7.2 850/1900 • 1 1 1 1 5   • •  •  • •      LISA-U100-01 5.76 7.2 850/1900 • 1 1 1 1 5   • • • • • • • •   •  LISA-U110-00 5.76 7.2 900/2100 • 1 1 1 1 5   • •  •  • •      LISA-U110-01 5.76 7.2 900/2100 • 1 1 1 1 5   • • • • • • • •   •  LISA-U120-00 5.76 7.2 850/1900 • 1 1 1 1 5 1 1 • •  •  • •      LISA-U120-01 5.76 7.2 850/1900 • 1 1 1 1 5 1 1 • • • • • • • •   •  LISA-U130-00 5.76 7.2 900/2100 • 1 1 1 1 5 1 1 • •  •  • •      LISA-U130-01 5.76 7.2 900/2100 • 1 1 1 1 5 1 1 • • • • • • • • •  •  LISA-U200-00 5.76 7.2 800/850/ 1900/2100 • 1 1 1 1 9   • • • • •   •     LISA-U200-01 5.76 7.2 800/850/900/ 1700/1900/2100 • 1 1 1 1 14  2 • • • • • • • • •  • • LISA-U230-01 5.76 21.1 800/850/900/ 1700/1900/2100 • 1 1 1 1 14  2 • • • • • • • • • • • • Table 2: LISA-U series features summary
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 9 of 160 1.2 Architecture WirelessBase-bandProcessorMemoryPower Management UnitRF Transceiver26 MHz32.768 kHzSAWFilterFEM & 2G PAANTLNA3G PALNA3G PADDC (for GPS)(U)SIM CardUARTSPIUSBGPIO(s)Power OnExternal ResetV_BCKP (RTC)Vcc (Supply)V_INT (I/O)Digital Audio (I2S)AnalogAudio Figure 1: LISA-U1 series block diagram (for available options refer to the product features summary in Table 2) WirelessBase-bandProcessorMemoryPower Management Unit26 MHz32.768 kHzANTSwitch & Multi band & mode PADDC (for GPS)(U)SIM CardUARTSPIUSBGPIO(s)Power OnExternal ResetV_BCKP (RTC)Vcc (Supply)V_INT (I/O)Digital Audio (I2S)RFSWITCHRF TransceiverDuplexers& FiltersANT_DIVRFSWITCHFilterBankPA PMUTransceiver PMU Figure 2: LISA-U2 series block diagram (for available options refer to the product features summary in Table 2)
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 10 of 160 1.2.1 Functional blocks LISA-U  series  modules  consist  of  the  following  internal  functional  blocks:  RF  section,  Baseband  and  Power Management Unit section. LISA-U1 series RF section A shielding box includes the RF high-power signal circuitry, namely:  Front-End Module (FEM) with integrated quad-band 2G Power Amplifier and antenna switch multiplexer  Two single-band 3G HSPA/WCDMA Power Amplifier modules with integrated duplexers The RF antenna  pad (ANT) is directly connected to  the FEM, which dispatches  the RF signals according to the active  mode.  For  time-duplex  2G  operation,  the  incoming  signal  at  the  active  Receiver  (RX)  slot  is  applied  to integrated  SAW  filters  for  out-of-band  rejection  and  then  sent  to  the  appropriate  receiver  port  of  the  RF transceiver.  During  the  allocated  Transmitter  (TX) slots,  the  low level  signal  coming  from  the  RF transceiver  is enhanced  by  the  2G  power  amplifier  module  and  then  directed  to  the  antenna  through  the  FEM.  The  3G transmitter  and  receiver  are  instead  active  at  the  same  time  due  to  frequency-domain  duplex  operation.  The switch integrated in the FEM connects the antenna port to the passive duplexer which separates the TX and RX signal  paths.  The  duplexer  itself  provides  front-end  RF  filtering  for  RX  band  selection  while  combining  the amplified TX signal coming from the fixed gain linear power amplifier. In the same shielding box that includes the RF high-power signal circuitry there are all the low-level analog RF components, namely:  Dual-band HSPA/WCDMA and quad-band EDGE/GPRS/GSM transceiver  Voltage Controlled Temperature Compensated 26 MHz Crystal Oscillator (VC-TCXO)  Low Noise Amplifier (LNA) and SAW RF filters for 2G and 3G receivers While  operating  in  3G  mode,  the  RF  transceiver  performs  direct  up-conversion  and  down-conversion  of  the baseband I/Q signals, with the RF voltage controlled gain amplifier being used to set the uplink TX power. In the downlink path, the  external LNA enhances the  RX sensitivity while discrete inter-stage SAW filters additionally improve  the  rejection  of  out-of-band  blockers.  An  internal  programmable  gain  amplifier  optimizes  the  signal levels before delivering to the analog I/Q to baseband for further digital processing. For  2G  operations,  a  constant  gain  direct  conversion  receiver  with  integrated  LNAs  and  highly  linear  RF quadrature demodulator are used to provide the same I/Q signals to baseband as well. In transmission mode, the up-conversion  is implemented by means of a digital  sigma-delta  transmitter or polar  modulator depending on the modulation to be transmitted. In all the modes, a fractional-N sigma-delta RF synthesizer and an on-chip 3.296-4.340 GHz voltage controlled oscillator are used to generate the local oscillator signal. The frequency reference to RF oscillators is provided by the 26 MHz VC-TCXO. The same signal is buffered to the baseband as a master reference for clock generation circuits while operating in active mode. LISA-U2 series RF section A shielding box contains the RF high-power signal circuitry, including:  Multimode Single Chain Power Amplifier Module used for 3G HSPA/WCDMA and 2G EDGE/GSM operations  Power Management Unit with integrated DC/DC converter for the Power Amplifier Module The  RF  antenna pad  (ANT)  is directly connected  to the  main antenna  switch, which dispatches the  RF signals according to the active mode. For time-duplex 2G operation, the incoming signal at the active Receiver (RX) slot is applied by the main antenna switch to the duplexer SAW filter bank for out-of-band rejection and then sent to the  appropriate  receiver  port  of  the  RF  transceiver.  During  the  allocated  Transmitter  (TX)  slots,  the  low  level signal coming from the RF transceiver is enhanced by the power amplifier and then directed to the antenna pad through the main antenna switch. The 3G transmitter and receiver are active at the same time due to frequency-domain duplex operation. The switch integrated in the  main antenna switch connects the antenna port to the duplexer SAW filter bank which separates the TX and RX signal paths. The duplexer itself provides front-end RF filtering for RX band selection while combining the amplified TX signal coming from the power amplifier.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 11 of 160 A separated shielding box contains all the other analog RF components, including:  Main Antenna Switch  Duplexer SAW filter bank  Antenna Switch for diversity receiver  SAW filter bank for diversity receiver  Six-band HSPA/WCDMA and quad-band EDGE/GPRS/GSM transceiver  Power Management Unit with integrated DC/DC converter for the Power Amplifier Module  Voltage Controlled Temperature Compensated 26 MHz Crystal Oscillator (VC-TCXO) While  operating  in  3G  mode,  the  RF  transceiver  performs  direct  up-conversion  and  down-conversion  of  the baseband I/Q signals, with the RF voltage controlled gain amplifier being used to set the uplink TX power. In the downlink path, the integrated LNA enhances the RX sensitivity while discrete inter-stage SAW filters additionally improve  the  rejection  of  out-of-band  blockers.  An  internal  programmable  gain  amplifier  optimizes  the  signal levels before delivering to the analog I/Q to baseband for further digital processing. For  2G  operations,  a  constant  gain  direct  conversion  receiver  with  integrated  LNAs  and  highly  linear  RF quadrature demodulator are used to provide the same I/Q signals to the baseband as well. In transmission mode, the up-conversion is implemented by means of a digital sigma-delta transmitter or polar modulator depending on the modulation to be transmitted. The RF antenna pad for the diversity receiver (ANT_DIV) available on LISA-U230 modules is directly connected to the antenna  switch for the diversity receiver, which dispatches the incoming  RF signals to the dedicated SAW filter bank for out-of-band rejection and then to the diversity receiver port of the RF transceiver. In all the modes, a fractional-N sigma-delta RF synthesizer and an on-chip 3.296-4.340 GHz voltage controlled oscillator are used to generate the local oscillator signal. The frequency reference to RF oscillators is provided by the 26 MHz VC-TCXO. The same signal is buffered to the baseband as a master reference for clock generation circuits while operating in active mode. LISA-U series modulation techniques Modulation techniques related to radio technologies supported by LISA-U series modules, are listed as follows:  GSM      GSMK  GPRS      GMSK  EDGE      GMSK / 8-PSK  WCDMA      QPSK  HSDPA      QPSK / 16-QAM  HSUPA      QPSK / 16-QAM LISA-U series Baseband and Power Management Unit section Another shielding box of LISA-U series modules includes all the digital circuitry and the power supplies, basically the following functional blocks:  Wireless baseband processor, a mixed signal ASIC which integrates:  Microprocessor for controller functions, 2G & 3G upper layer software  DSP core for 2G Layer 1 and audio processing  3G coprocessor and HW accelerator for 3G Layer 1 control software and routines  Dedicated HW for interfaces management  Memory system in a Multi-Chip Package (MCP) integrating two devices:  NOR flash non-volatile memory  DDR SRAM volatile memory  Power Management Unit (PMU), used to derive all the system supply voltages from the module supply VCC
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 12 of 160  32.768 kHz crystal, connected to the Real Time Clock (RTC) oscillator to provide the clock reference in idle or power-off mode 1.2.2 Hardware differences between LISA-U series modules Main hardware differences between the LISA-U series modules are summarized in Table 3.  Characteristic LISA-U1 series LISA-U2 series 3G bands  LISA-U100, LISA-U120:  Band II (1900 MHz), Band V (850 MHz) LISA-U110, LISA-U130:  Band I (2100 MHz), Band VIII (900 MHz) LISA-U200-00:  Band I (2100 MHz), Band II (1900 MHz), Band V (850 MHz), Band VI (800 MHz) LISA-U200-01, LISA-U230:  Band I (2100 MHz), Band II (1900 MHz),  Band IV (1700 MHz), Band V (850 MHz),  Band VI (800 MHz), Band VIII (900 MHz) HSDPA data rate LISA-U1 series:  HSDPA category 8, up to 7.2 Mb/s DL LISA-U200:  HSDPA category 8, up to 7.2 Mb/s DL LISA-U230:  HSDPA category 14, up to 21.1 Mb/s DL EDGE/GPRS data rate EDGE multislot class 12, MCS1-MCS9,  up to 236.8 kb/s DL/UL GPRS multislot class 12, CS1-CS4,  up to 85.6 kb/s DL/UL EDGE multislot class 33, MCS1-MCS9,  up to 296 kb/s DL, 236.8 kb/s UL GPRS multislot class 33, CS1-CS4,  up to 107 kb/s DL, 85.6 kb/s UL Rx diversity LISA-U1 series:  Not supported LISA-U200:  Not supported LISA-U230:  Supported: ANT_DIV RF input for Rx diversity  Analog audio LISA-U100, LISA-U110:  Not supported LISA-U120, LISA-U130:  One differential input, one differential output LISA-U2 series:  Not supported Digital audio LISA-U100, LISA-U110:  Not supported LISA-U120, LISA-U130:  One 4-wire digital audio interface LISA-U200-00:  Not supported LISA-U200-01, LISA-U230:  Two 4-wire digital audio interfaces  CODEC_CLK clock output for external codec GPIO 5 GPIOs Up to 14 GPIOs VCC operating range VCC normal operating range: 3.4 V – 4.2 V VCC extended operating range: 3.1 V – 4.2 V VCC normal operating range: 3.3 V – 4.4 V VCC extended operating range: 3.1 V – 4.5 V V_BCKP operating range V_BCKP output: 2.3 V typ. V_BCKP input: 1.0 V – 2.5 V V_BCKP output: 1.8 V typ. V_BCKP input: 1.0 V – 1.9 V Exposed GND area One signals keep-out area on the top layer of the application board, due to one exposed GND area on the bottom layer of the module (see Figure 61) Two signals keep-out areas on the top layer of the application board, due to two exposed GND areas on the bottom layer of the module (see Figure 62) Table 3: Main hardware differences between LISA-U series modules  For additional details and minor hardware differences between the LISA-U series modules, refer to section A.3.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 13 of 160 1.3 Pin-out Table 4 lists the pin-out of the LISA-U series modules, with pins grouped by function. Function Pin Module No I/O Description Remarks Power VCC All 61, 62, 63 I Module supply input Clean and stable supply is required: low ripple and low voltage drop must be guaranteed. Voltage provided has to be always above the minimum limit of the operating range. Consider that there are large current spikes in connected mode, when a GSM call is enabled. VCC pins are internally connected, but all the available pads must be connected to the external supply in order to minimize power loss due to series resistance. See section 1.5.2  GND All 1, 3, 6, 7, 8, 17, 25, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 60, 64, 65, 66, 67, 69, 70, 71, 72, 73, 75, 76 N/A Ground GND pins are internally connected but a good (low impedance) external ground connection can improve RF performance: all GND pins must be externally connected to ground.  V_BCKP All 2 I/O Real Time Clock supply input/output V_BCKP = 2.3 V (typical) on LISA-U1 series V_BCKP = 1.8 V (typical) on LISA-U2 series generated by the module when VCC supply voltage is within valid operating range. See section 1.5.4  V_INT All 4 O Digital Interfaces supply output V_INT = 1.8V (typical) generated by the module when it is switched-on and the RESET_N (external reset input pin) is not forced to the low level. See section 1.5.5  VSIM All 50 O SIM supply output VSIM = 1.80 V typical or 2.90 V typical generated by the module according to the SIM card type. See section 1.8 RF ANT All 68 I/O RF input/output for main Tx/Rx antenna 50  nominal impedance. See section 1.7, section 2.4 and section 2.2.1.1  ANT_DIV LISA-U230 74 I RF input for Rx diversity antenna 50 Ω nominal impedance See section 1.7, section 2.4 and section 2.2.1.1 SIM SIM_IO All 48 I/O SIM data Internal 4.7 k pull-up to VSIM. Must meet SIM specifications. See section 1.8  SIM_CLK All 47 O SIM clock Must meet SIM specifications. See section 1.8  SIM_RST All 49 O SIM reset Must meet SIM specifications. See section 1.8 SPI SPI_MISO All 57 O SPI Data Line Output Module Output: module runs as an SPI slave. Shift data on rising clock edge (CPHA=1). Latch data on falling clock edge (CPHA=1). Idle high. See section 1.9.4  SPI_MOSI All 56 I SPI Data Line Input Module Input: module runs as an SPI slave. Shift data on rising clock edge (CPHA=1). Latch data on falling clock edge (CPHA=1). Idle high. Internal active pull-up to V_INT (1.8 V) enabled. See section 1.9.4
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 14 of 160 Function Pin Module No I/O Description Remarks  SPI_SCLK All 55 I SPI Serial Clock Input Module Input: module runs as an SPI slave. Idle low (CPOL=0). Internal active pull-down to GND enabled. See section 1.9.4  SPI_SRDY All 58 O SPI Slave Ready Output Module Output: module runs as an SPI slave. Idle low. See section 1.9.4  SPI_MRDY All 59 I SPI Master Ready Input Module Input: module runs as an SPI slave. Idle low. Internal active pull- down to GND enabled. See section 1.9.4 DDC SCL All 45 O I2C bus clock line Fixed open drain. External pull-up required. See section 1.10  SDA All 46 I/O I2C bus data line Fixed open drain. External pull-up required. See section 1.10 UART RxD All 16 O UART data output Circuit 104 (RxD) in ITU-T V.24. Provide access to the pin for FW update and debugging if the USB interface is connected to the application processor. See section 1.9.2  TxD All 15 I UART data input Circuit 103 (TxD) in ITU-T V.24. Internal active pull-up to V_INT (1.8 V) enabled. Provide access to the pin for FW update and debugging if the USB interface is connected to the application processor. See section 1.9.2  CTS All 14 O UART clear to send output Circuit 106 (CTS) in ITU-T V.24. Provide access to the pin for debugging if the USB interface is connected to the application processor. See section 1.9.2  RTS All 13 I UART ready to send input Circuit 105 (RTS) in ITU-T V.24. Internal active pull-up to V_INT (1.8 V) enabled. Provide access to the pin for debugging if the USB interface is connected to the application processor. See section 1.9.2  DSR All 9 O UART data set ready output Circuit 107 (DSR) in ITU-T V.24. See section 1.9.2  RI All 10 O UART ring indicator output Circuit 125 (RI) in ITU-T V.24. See section 1.9.2  DTR All 12 I UART data terminal ready input Circuit 108/2 (DTR) in ITU-T V.24. Internal active pull-up to V_INT (1.8 V) enabled. See section 1.9.2  DCD All 11 O UART data carrier detect output Circuit 109 (DCD) in ITU-T V.24. See section 1.9.2 GPIO GPIO1 All 20 I/O GPIO See section 1.12  GPIO2 All 21 I/O GPIO See section 1.12  GPIO3 All 23 I/O GPIO See section 1.12  GPIO4 All 24 I/O GPIO See section 1.12  GPIO5 All 51 I/O GPIO See section 1.12  GPIO6 LISA-U2 39 I/O GPIO See section 1.12  GPIO7 LISA-U2 40 I/O GPIO See section 1.12  GPIO8 LISA-U2 53 I/O GPIO See section 1.12  GPIO9 LISA-U2 54 I/O GPIO See section 1.12  GPIO10 LISA-U200-01 LISA-U230 55 I/O GPIO See section 1.12
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 15 of 160 Function Pin Module No I/O Description Remarks  GPIO11 LISA-U200-01 LISA-U230 56 I/O GPIO See section 1.12  GPIO12 LISA-U200-01 LISA-U230 57 I/O GPIO See section 1.12  GPIO13 LISA-U200-01 LISA-U230 58 I/O GPIO See section 1.12  GPIO14 LISA-U200-01 LISA-U230 59 I/O GPIO See section 1.12 USB VUSB_DET All 18 I USB detect input Input for VBUS (5 V typical) USB supply sense to enable USB interface. Provide access to the pin for FW update and debugging if the USB interface is not connected to the application processor. See section 1.9.3  USB_D- All 26 I/O USB Data Line D- 90 Ω nominal differential impedance Pull-up or pull-down resistors and external series resistors as required by the USB 2.0 high-speed specification [8] are part of the USB pad driver and need not be provided externally. Provide access to the pin for FW update and debugging if the USB interface is not connected to the application processor. See section 1.9.3  USB_D+ All 27 I/O USB Data Line D+ 90 Ω nominal differential impedance Pull-up or pull-down resistors and external series resistors as required by the USB 2.0 high-speed specification [8] are part of the USB pad driver and need not be provided externally. Provide access to the pin for FW update and debugging if the USB interface is not connected to the application processor. See section 1.9.3 System PWR_ON All 19 I Power-on input PWR_ON pin has high input impedance. Do not keep floating in noisy environment: external pull-up required.  See section 1.6.1  RESET_N All 22 I External reset input Internal 10 kΩ pull-up to V_BCKP. See section 1.6.3 Analog Audio  MIC_N LISA-U120 LISA-U130 39 I Differential analog audio input (negative) Differential analog input shared for all analog path modes: handset, headset, hands-free mode. Internal DC blocking capacitor. See section 1.11.1  MIC_P LISA-U120 LISA-U130 40 I Differential analog audio input (positive) Differential analog input shared for all analog path modes: handset, headset, hands-free mode. Internal DC blocking capacitor. See section 1.11.1  SPK_P LISA-U120 LISA-U130 53 O Differential analog audio output (positive) Differential analog audio output shared for all analog path modes: earpiece, headset and loudspeaker mode. See section 1.11.1  SPK_N LISA-U120 LISA-U130 54 O Differential analog audio output (negative) Differential analog audio output shared for all analog path modes: earpiece, headset and loudspeaker mode. See section 1.11.1 Digital Audio  I2S_CLK LISA-U120 LISA-U130 LISA-U200-01 LISA-U230 43 I/O First I2S clock Check device specifications to ensure compatibility to module supported modes. See section 1.11.2.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 16 of 160 Function Pin Module No I/O Description Remarks  I2S_RXD LISA-U120 LISA-U130 LISA-U200-01 LISA-U230 44 I First I2S receive data Internal active pull-down to GND enabled. Check device specifications to ensure compatibility to module supported modes. See section 1.11.2.  I2S_TXD LISA-U120 LISA-U130 LISA-U200-01 LISA-U230 42 O First I2S transmit data Check device specifications to ensure compatibility to module supported modes. See section 1.11.2.  I2S_WA LISA-U120 LISA-U130 LISA-U200-01 LISA-U230 41 I/O First I2S word alignment Check device specifications to ensure compatibility to module supported modes. See section 1.11.2.  I2S1_CLK LISA-U200-01, LISA-U230 53 I/O Second I2S clock Check device specifications to ensure compatibility to module supported modes. See section 1.11.2.  I2S1_RXD LISA-U200-01 LISA-U230 39 I Second I2S receive data Internal active pull-down to GND enabled. Check device specifications to ensure compatibility to module supported modes. See section 1.11.2.  I2S1_TXD LISA-U200-01 LISA-U230 40 O Second I2S transmit data Check device specifications to ensure compatibility to module supported modes. See section 1.11.2.  I2S1_WA LISA-U200-01 LISA-U230 54 I/O Second I2S word alignment Check device specifications to ensure compatibility to module supported modes. See section 1.11.2.  CODEC_CLK LISA-U200-01 LISA-U230 52 O Clock output Digital clock output for external audio codec See section 1.11.2. Reserved RSVD All 5 N/A RESERVED pin This pin must be connected to ground See section 1.13  RSVD LISA-U1 LISA-U200-00 52 N/A RESERVED pin Pad disabled See section 1.13  RSVD LISA-U1  LISA-U200 74 N/A RESERVED pin Do not connect See section 1.13  RSVD LISA-U100 LISA-U110 LISA-U200-00 43 N/A RESERVED pin Pad disabled See section 1.13  RSVD LISA-U100 LISA-U110 LISA-U200-00 44 N/A RESERVED pin Pad disabled See section 1.13  RSVD LISA-U100 LISA-U110 LISA-U200-00 42 N/A RESERVED pin Pad disabled See section 1.13  RSVD LISA-U100 LISA-U110 LISA-U200-00 41 N/A RESERVED pin Pad disabled See section 1.13  RSVD LISA-U100 LISA-U110 39 N/A RESERVED pin Do not connect See section 1.13  RSVD LISA-U100 LISA-U110 40 N/A RESERVED pin Do not connect See section 1.13  RSVD LISA-U100 LISA-U110 53 N/A RESERVED pin Do not connect See section 1.13  RSVD LISA-U100 LISA-U110 54 N/A RESERVED pin Do not connect See section 1.13 Table 4: LISA-U series modules pin definition, grouped by function
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 17 of 160 1.4 Operating modes LISA-U  series  modules  have  several  operating  modes.  Table  5  summarizes  the  various  operating  modes  and provides general guidelines for operation.  Operating Mode Description Features / Remarks Transition condition General Status: Power-down Not-Powered Mode VCC supply not present or below operating range. Microprocessor switched off (not operating). RTC only operates if supplied through V_BCKP pin. Module is switched off. Application interfaces are not accessible. Internal RTC timer operates only if a valid voltage is applied to V_BCKP pin. Module cannot be switched on by a low level on the PWR_ON input, by a rising edge on the RESET_N input, or by a preset RTC alarm. Module can be switched on applying VCC supply. Power-Off Mode VCC supply within operating range. Microprocessor switched off (not operating). Only RTC runs. Module is switched off: normal shutdown by AT+CPWROFF command (refer to u-blox AT Commands Manual [3]), or by PWR_ON held low for more than 1 s (LISA-U2xx-01 only). Application interfaces are not accessible. Only the internal RTC timer in operation. Module can be switched on by a low level on the PWR_ON input, by a rising edge on the RESET_N input, or by a preset RTC alarm. General Status: Normal Operation Idle-Mode Microprocessor runs with 32 kHz as reference oscillator. Module does not accept data signals from an external device. If power saving is enabled, the module automatically enters idle-mode whenever possible. Application interfaces are disabled. If hardware flow control is enabled, the CTS line to ON state indicates that the module is in active mode and the UART interface is enabled: the line is driven in the OFF state when the module is not prepared to accept data by the UART interface. If hardware flow control is disabled, the CTS line is fixed to ON state. Module by default is not set to automatically enter idle-mode whenever possible, unless power saving configuration is enabled by appropriate AT command (refer to u-blox AT Commands Manual [3], AT+UPSV). Module enters automatically idle-mode when power saving is enabled and there is no activity for the defined time interval:  Module registered with the network and power saving enabled. Periodically wakes up to active mode to monitor the paging channel for the paging block reception according to network indication  Module not registered with the network and power saving is enabled. Periodically wakes up to monitor external activity Module wakes up from idle-mode to active-mode in the following events:  Incoming voice or data call  RTC alarm occurs  Data received on UART interface (refer to 1.9.2)  RTS input line set to the ON state by the DTE if the AT+UPSV=2 command is sent to the module (refer to 1.9.2)  USB detection, applying 5 V (typ.) to the VUSB_DET pin  The connected USB host forces a remote wakeup of the module as USB device (refer to 1.9.3)  The connected SPI master indicates to the module that it is ready for transmission or reception, by the SPI/IPC SPI_MRDY input signal (refer to 1.9.4)
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 18 of 160 Operating Mode Description Features / Remarks Transition condition Active-Mode Microprocessor runs with 26 MHz as reference oscillator. The module is prepared to accept data signals from an external device. Module is switched on and is fully active. The application interfaces are enabled, unless power saving configuration is enabled by the AT+UPSV command (refer to sections 1.9.2.3, 1.9.3.2, 1.9.4.2 and u-blox AT Commands Manual [3]). Power saving is not enabled by default: it can be enabled by the AT+UPSV command (see u-blox AT Commands Manual [3]). If power saving is enabled, the module automatically enters idle-mode and application interfaces are disabled whenever possible (refer to sections 1.9.2.3, 1.9.3.2, 1.9.4.2 and u-blox AT Commands Manual [3], AT+UPSV). Connected-Mode Voice or data call enabled. Microprocessor runs with 26 MHz as reference oscillator. The module is prepared to accept data signals from an external device. The module is switched on and a voice call or a data call (2G/3G) is in progress. Module is fully active. The application interfaces are enabled, unless power saving configuration is enabled by the AT+UPSV command (see section 1.9.2.3, 1.9.3.2, 1.9.4.2 and the u-blox AT Commands Manual [3]). When call terminates, the module returns to the active operating mode. Table 5: Module operating modes summary  Transition between the different modes is described in Figure 3. Switch ON:•Apply VCCIf power saving is enabled and there is no activity for a defined time intervalAny wake up event described in the module operating modes summary table aboveIncoming/outgoing call or other dedicated device network communicationCall terminated, communication droppedRemove VCCSwitch ON:•PWR_ON•RESET_N•RTC AlarmNot poweredPower offActiveConnected IdleSwitch OFF:•AT+CPWROFF•PWR_ON (LISA-U2xx-01 only) Figure 3: Operating modes transition
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 19 of 160 1.5 Power management 1.5.1 Power supply circuit overview LISA-U series modules feature a power  management concept optimized for  the  most efficient use of supplied power. This is achieved by hardware design utilizing a power efficient circuit topology (Figure 4), and by power management software controlling the module’s power saving mode.  Baseband Processor2G/3G Power Amplifier(s)Switching Step-Down5 x 10 µF61VCC62VCC63VCC50VSIM2V_BCKP4V_INTLinear LDOLinear LDOSwitching Step-DownLinear LDOLinear LDOLinear LDOI/OEBUCOREAnalogSIMRTCNOR FlashDDR SRAMRF TransceiverMemoryPower Management Unit22 µF 10 µF (LISA-U1)220 nF (LISA-U2) 220 nF2G/3G PA PMU(LISA-U2)TransceiverPMU(LISA-U2)(LISA-U1) Figure 4: LISA-U series power management simplified block diagram Pins with supply function are reported in Table 6, Table 11 and Table 14. LISA-U series modules must be supplied via the VCC pins. There is only one main power supply input, available on the three VCC pins that must be all connected to the external power supply
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 20 of 160 The VCC pins are directly connected to the RF power amplifiers and to the integrated Power Management Unit (PMU)  within  the  module:  all  supply  voltages  needed  by  the  module  are  generated  from  the  VCC  supply  by integrated voltage regulators. V_BCKP  is the  Real  Time Clock  (RTC)  supply.  When  the  VCC  voltage  is within  the valid  operating  range,  the internal PMU supplies the Real Time Clock and the same supply voltage will be available to the V_BCKP pin. If the VCC voltage is under the minimum operating limit (for example, during not powered mode), the Real Time Clock can be externally supplied via the V_BCKP pin (see section 1.5.4). When a 1.8 V or a 3 V SIM card type is connected, LISA-U series modules automatically supply the SIM card via the VSIM pin. Activation and deactivation of the SIM interface with automatic voltage switch from 1.8 to 3 V is implemented, in accordance to the ISO-IEC 7816-3 specifications. The same voltage domain used internally to supply the digital interfaces is also available on  the V_INT pin, to allow more economical and efficient integration of the LISA-U series modules in the final application. The integrated Power Management Unit also provides the control state machine for system start up and system reset control. 1.5.2 Module supply (VCC) The  LISA-U series  modules  must  be supplied  through  the  VCC  pins  by  a  DC power  supply.  Voltages  must  be stable: during operation, the current drawn from VCC can vary by some orders of magnitude, especially due to surging consumption profile of the GSM system (described in the section 1.5.3). It is important that the system power  supply circuit  is able to  support  peak power  (refer  to LISA-U1  series  Data  Sheet [1]  and LISA-U2  series Data Sheet [2] for the detailed specifications).  Name Description Remarks VCC Module power supply input VCC pins are internally connected, but all the available pads must be connected to the external supply in order to minimize the power loss due to series resistance. Clean and stable supply is required: low ripple and low voltage drop must be guaranteed. Voltage provided must always be above the minimum limit of the operating range. Consider that during a GSM call there are large current spikes in connected mode. GND Ground GND pins are internally connected but a good (low impedance) external ground can improve RF performance: all available pads must be connected to ground. Table 6: Module supply pins   VCC  pins  ESD  sensitivity  rating  is  1  kV  (Human  Body  Model  according  to  JESD22-A114F).  Higher protection  level  can  be  required  if  the  line  is  externally  accessible  on  the  application  board.  Higher protection level can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the line connected to this pin, close to accessible point.  The  voltage  provided  to  the  VCC  pins  must  be  within  the  normal  operating  range  limits  as  specified  in  the LISA-U1  series  Data  Sheet [1] and  LISA-U2  series Data  Sheet [2].  Complete functionality of  the module  is only guaranteed within the specified minimum and maximum VCC voltage normal operating range.   The  module cannot  be switched on  if the  VCC voltage  value is  below the  specified normal  operating range  minimum  limit.  Ensure  that  the  input  voltage  at  VCC  pins  is  above  the  minimum  limit  of  the normal operating range for more than 3 s after the start of the module switch-on sequence.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 21 of 160 When  LISA-U  series  modules  are  in  operation,  the  voltage  provided  to  VCC  pins  can  go  outside  the  normal operating range limits but must be within the extended operating range limits specified in LISA-U1 series Data Sheet [1] and LISA-U2 series Data Sheet [2]. Occasional deviations from the ETSI specifications may occur when the input voltage at VCC pins is outside the normal operating range and is within the extended operating range.   LISA-U series modules switch off when VCC voltage value drops below the specified extended operating range minimum limit: ensure that the input voltage at VCC pins never drops below the minimum limit of the extended operating range when the module is switched on, not even during a GSM transmit burst, where  the  current  consumption  can  rise  up  to  maximum  peaks  of  2.5  A  in  case  of  a  mismatched antenna load.   Operation  above  the  normal  operating  range  maximum  limit  is  not  recommended  and extended exposure beyond it may affect device reliability.  Stress  beyond  the  VCC  absolute  maximum  ratings  can  cause  permanent  damage  to  the module: if necessary, voltage spikes beyond VCC absolute maximum ratings must be restricted to values within the specified limits by using appropriate protection.   When  designing  the  power  supply  for  the  application,  pay  specific  attention  to  power  losses  and transients.  The  DC power  supply  must  be able  to  provide  a voltage  profile  to  the  VCC  pins  with  the following characteristics: o Voltage drop during transmit slots must be lower than 400 mV  o No undershoot or overshoot at the start and at the end of transmit slots  o Voltage ripple during transmit slots must be minimized: lower than 70 mVpp if fripple ≤ 200 kHz lower than 10 mVpp if 200 kHz < fripple ≤ 400 kHz lower than 2 mVpp if fripple > 400 kHz  TimeundershootovershootripplerippledropVoltage3.8 V (typ)RX     slotunused slotunused slotTX     slotunused slotunused slotMON       slotunused slotRX     slotunused slotunused slotTX     slotunused slotunused slotMON   slotunused slotGSM frame             4.615 ms                                       (1 frame = 8 slots)GSM frame             4.615 ms                                       (1 frame = 8 slots) Figure 5: Description of the VCC voltage profile versus time during a GSM call   Any degradation in power supply performance (due to losses, noise or transients) will directly affect the RF  performance  of  the  module  since  the  single  external  DC  power  source  indirectly  supplies  all  the digital and analog interfaces, and also directly supplies the RF power amplifier (PA).
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 22 of 160  The voltage at the VCC pins must ramp from 2.5 V to 3.2 V within 1 ms. This VCC slope allows a proper switch on of the module when the voltage rises to the VCC normal operating range from a voltage of less than 2.25 V. If the external supply circuit cannot raise the VCC voltage from 2.5 V to 3.2 V within 1 ms RESET_N should be kept low during VCC rising edge, so that the module will switch on releasing the  RESET_N  pin  when  the  VCC  voltage  stabilizes  at  its  nominal  value  within  the  normal  operating range.  1.5.2.1 VCC application circuits LISA-U series modules must be supplied through the  VCC pins by one (and only one) proper DC power supply that must be one of the following:  Switching regulator  Low Drop-Out (LDO) linear regulator  Rechargeable Lithium-ion (Li-Ion) or Lithium-ion polymer (Li-Pol) battery  Primary (disposable) battery  Main Supply Available?BatteryLi-Ion 3.7 VLinear LDO RegulatorMain Supply Voltage >5 V?Switching Step-Down RegulatorNo, portable deviceNo, less than 5 VYes, greater than 5 VYes, always available  Figure 6: VCC supply concept selection The switching step-down regulator is the typical choice when the available primary supply source has a nominal voltage much higher (e.g. greater than 5 V) than the LISA-U series modules operating supply voltage. The use of switching step-down provides the best power efficiency for the overall application and minimizes current drawn from the main supply source. The use of an LDO linear regulator becomes convenient for  a primary supply with a relatively low voltage (e.g. less  than  5  V).  In  this  case  the  typical  90%  efficiency  of  the  switching  regulator  will  diminish  the  benefit  of voltage step-down and no true advantage will be gained in input current savings. On the opposite side, linear regulators  are  not  recommended  for  high  voltage  step-down  as  they  will  dissipate  a  considerable  amount  of energy in thermal power. If LISA-U series modules are deployed in a mobile unit where no permanent primary supply source is available, then a battery will be required to provide VCC. A standard 3-cell Li-Ion or Li-Pol battery pack directly connected to  VCC  is  the  usual  choice  for  battery-powered  devices.  During  charging,  batteries  with  Ni-MH  chemistry typically reach a maximum voltage that is above the maximum rating for VCC, and should therefore be avoided. The use of primary (not rechargeable) battery is uncommon, since the most cells available are seldom capable of delivering the burst peak current for a GSM call due to high internal resistance. Keep in mind that the use of batteries requires the implementation of a suitable charger circuit (not included in LISA-U series modules). The charger circuit should be designed in order to prevent over-voltage on VCC beyond the upper limit of the absolute maximum rating.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 23 of 160 The following sections highlight some design aspects for each of the supplies listed above. Switching regulator The characteristics of the switching regulator connected to VCC pins should meet the following requirements:  Power  capability:  the switching  regulator with  its output circuit must  be capable of  providing a  voltage value to the VCC pins within the specified operating range and must be capable of delivering 2.5 A current pulses with 1/8 duty cycle to the VCC pins  Low output ripple: the switching regulator together with its output circuit must be capable of providing a clean (low noise) VCC voltage profile  High switching frequency: for best performance and for smaller applications select a switching frequency ≥ 600 kHz (since L-C output filter is typically smaller for high switching frequency). The use of a switching regulator with a variable switching frequency  or  with a switching  frequency lower  than  600 kHz must be carefully evaluated since this can produce noise in the VCC voltage profile and therefore negatively impact GSM modulation spectrum performance. An additional L-C low-pass filter between the switching regulator output  to  VCC  supply  pins  can  mitigate  the  ripple  on  VCC,  but  adds  extra  voltage  drop  due  to  resistive losses on series inductors  PWM  mode  operation: select preferably regulators with Pulse Width Modulation (PWM) mode.  While in active mode Pulse Frequency Modulation (PFM) mode and PFM/PWM mode transitions must be avoided to reduce the noise on the VCC voltage profile. Switching regulators able to switch between low ripple PWM mode and high efficiency burst or PFM mode can be used, provided the mode transition occurs  when the module changes status from idle/active mode to connected mode (where current consumption increases to a value greater than 100 mA): it is permissible to use a regulator that switches from the PWM mode to the burst or PFM mode at an appropriate current threshold (e.g. 60 mA)  Output  voltage  slope:  the  use  of  the  soft  start  function  provided  by  some  voltage  regulator  must  be carefully evaluated, since the voltage at the VCC pins must ramp from 2.5 V to 3.2 V within 1 ms to allow a proper switch-on of the module   Figure 7 and the components listed in Table 7 show an example of a high reliability power supply circuit, where the module VCC is supplied by a step-down switching regulator capable of delivering 2.5 A current pulses with low output ripple and with fixed switching frequency in PWM mode operation greater than 1 MHz. The use of a switching  regulator  is suggested  when the  difference  from  the  available supply  rail  to  the  VCC  value  is  high: switching regulators provide good efficiency transforming a 12 V supply to the  typical 3.8 V value of the  VCC supply.  LISA-U series12VC5R3C4R2C2C1R1VINRUNVCRTPGSYNCBDBOOSTSWFBGND671095C61238114C7 C8D1 R4R5L1C3U162 VCC63 VCC61 VCCGND Figure 7: Suggested schematic design for the VCC voltage supply application circuit using a step-down regulator
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 24 of 160 Reference Description Part Number - Manufacturer C1 10 µF Capacitor Ceramic X7R 5750 15% 50 V C5750X7R1H106MB - TDK C2 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C3 680 pF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71H681KA01 - Murata C4 22 pF Capacitor Ceramic COG 0402 5% 25 V GRM1555C1H220JZ01 - Murata C5 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C6 470 nF Capacitor Ceramic X7R 0603 10% 25 V GRM188R71E474KA12 - Murata C7 22 µF Capacitor Ceramic X5R 1210 10% 25 V GRM32ER61E226KE15 - Murata C8 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 mΩ T520D337M006ATE045 - KEMET D1 Schottky Diode 40 V 3 A MBRA340T3G - ON Semiconductor L1 10 µH Inductor 744066100 30% 3.6 A 744066100 - Wurth Electronics R1 470 kΩ Resistor 0402 5% 0.1 W 2322-705-87474-L - Yageo R2 15 kΩ Resistor 0402 5% 0.1 W 2322-705-87153-L - Yageo R3 22 kΩ Resistor 0402 5% 0.1 W 2322-705-87223-L - Yageo R4 390 kΩ Resistor 0402 1% 0.063 W RC0402FR-07390KL - Yageo R5 100 kΩ Resistor 0402 5% 0.1 W 2322-705-70104-L - Yageo U1 Step Down Regulator MSOP10 3.5 A 2.4 MHz LT3972IMSE#PBF - Linear Technology Table 7: Suggested components for the VCC voltage supply application circuit using a step-down regulator  Low Drop-Out (LDO) linear regulator The  characteristics  of  the  LDO  linear  regulator  connected  to  the  VCC  pins  should  meet  the  following requirements:  Power capabilities: the LDO linear regulator with its output circuit must be capable of providing a proper voltage value to the VCC pins and of delivering 2.5 A current pulses with 1/8 duty cycle  Power dissipation: the power handling capability of the LDO linear regulator must be checked to limit its junction temperature to the maximum rated operating range (i.e. check the voltage drop from the max input voltage to the min output voltage to evaluate the power dissipation of the regulator)  Output  voltage  slope:  the  use  of  the  soft  start  function  provided  by  some  voltage  regulators  must  be carefully evaluated, since the voltage at the VCC pins must ramp from 2.5 V to 3.2 V within 1 ms to allow a proper switch-on of the module   Figure  8  and  the  components  listed  in  Table  8  show  an  example  of  a  power  supply  circuit,  where  the  VCC module  supply  is provided  by an  LDO  linear regulator  capable  of delivering  2.5 A  current pulses,  with  proper power  handling  capability.  The  use  of  a  linear  regulator  is  suggested  when  the  difference  from  the  available supply rail and the VCC value is low: linear regulators provide high efficiency when transforming a 5 V supply to the 3.8 V typical value of the VCC supply. 5VC1 R1IN OUTADJGND12453C2R2R3U1SHDNLISA-U series62 VCC63 VCC61 VCCGNDC3 Figure 8: Suggested schematic design for the VCC voltage supply application circuit using an LDO linear regulator
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 25 of 160 Reference Description Part Number - Manufacturer C1, C2 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 - Murata C3 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 mΩ T520D337M006ATE045 - KEMET R1 47 kΩ Resistor 0402 5% 0.1 W RC0402JR-0747KL - Yageo Phycomp R2 4.7 kΩ Resistor 0402 5% 0.1 W RC0402JR-074K7L - Yageo Phycomp R3 2.2 kΩ Resistor 0402 5% 0.1 W RC0402JR-072K2L - Yageo Phycomp U1 LDO Linear Regulator ADJ 3.0 A LT1764AEQ#PBF - Linear Technology Table 8: Suggested components for VCC voltage supply application circuit using an LDO linear regulator  Rechargeable Li-Ion or Li-Pol battery Rechargeable Li-Ion or Li-Pol batteries connected to the VCC pins should meet the following requirements:  Maximum pulse and DC discharge current: the rechargeable Li-Ion battery with its output circuit must be capable  of  delivering  2.5  A  current  pulses  with  1/8  duty-cycle  to  the  VCC  pins  and  must  be  capable  of delivering a DC current greater than the module maximum average current consumption to  VCC pins. The maximum  pulse  discharge  current  and  the  maximum  DC  discharge  current  are  not  always  reported  in battery data sheets, but the maximum DC discharge current is typically almost equal to the battery capacity in Amp-hours divided by 1 hour  DC series resistance: the rechargeable Li-Ion battery with its output circuit must be capable of avoiding a VCC voltage drop greater than 400 mV during transmit bursts   Primary (disposable) battery The  characteristics of  a  primary  (non-rechargeable)  battery  connected  to  VCC  pins should  meet  the  following requirements:  Maximum pulse and DC discharge current: the non-rechargeable battery with its output circuit must be capable  of  delivering  2.5  A  current  pulses  with  1/8  duty-cycle  to  the  VCC  pins  and  must  be  capable  of delivering a DC current greater than the module maximum average current consumption  at the VCC pins. The maximum pulse and the maximum DC discharge current is not always reported in battery data sheets, but  the  maximum  DC  discharge  current  is  typically  almost  equal  to  the  battery  capacity  in  Amp-hours divided by 1 hour  DC  series  resistance: the  non-rechargeable battery with its output circuit  must be capable of  avoiding a VCC voltage drop greater than 400 mV during transmit bursts
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 26 of 160 Additional recommendations for the VCC supply application circuits To  reduce  voltage  drops,  use  a  low  impedance  power  source.  The  resistance  of  the  power  supply  lines (connected to the VCC and GND pins of the module) on the application board and battery pack should also be considered and minimized: cabling and routing must be as short as possible in order to minimize power losses. Three pins are allocated for VCC supply. Another twenty pins are designated for GND connection. Even if all the VCC  pins  and  all  the  GND  pins  are  internally  connected  within  the  module,  it  is  recommended  to  properly connect all of them to supply the module in order to minimize series resistance losses. To  avoid  voltage  drop  undershoot  and  overshoot  at  the  start  and end  of  a  transmit  burst  during  a  GSM  call (when  current  consumption  on  the  VCC  supply  can  rise  up  to  as  much  as  2.5  A  in  the  worst  case),  place  a capacitor with large capacitance (more than 100 µF) and low ESR near the VCC pins, for example:  330 µF capacitance, 45 mΩ ESR (e.g. KEMET T520D337M006ATE045, Tantalum Capacitor) The use of very large capacitors (i.e. greater then 1000 µF) on the VCC line and the use of the soft start function provided by some voltage regulators must be carefully evaluated, since the voltage at the  VCC pins must ramp from 2.5 V to 3.2 V within 1 ms to allow a proper switch on of the module. To reduce voltage ripple and noise, place the following near the VCC pins:  100 nF capacitor (e.g Murata GRM155R61A104K) to filter digital logic noise from clocks and data sources  10 nF capacitor (e.g. Murata GRM155R71C103K) to filter digital logic noise from clocks and data sources  10 pF capacitor (e.g. Murata GRM1555C1E100J) to filter EMI in the 1800 / 1900 / 2100 MHz bands  39 pF capacitor (e.g. Murata GRM1555C1E390J) to filter EMI in the 850 / 900 MHz bands   Figure 9 shows the complete configuration but the mounting of each single component depends on the application design.  3V8C1 C4GNDC3C2 C5LISA-U series62 VCC63 VCC61 VCC+ Figure 9: Suggested schematic design to reduce voltage ripple and noise and to avoid undershoot/ overshoot on voltage drops Reference Description Part Number - Manufacturer C1 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 mΩ T520D337M006ATE045 - KEMET C2 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata C3 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C4 39 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1E390JA01 - Murata C5 10 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1E100JA01 - Murata Table 9: Suggested components to reduce voltage ripple and noise and to avoid undershoot/ overshoot on voltage drops
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 27 of 160 External battery charging application circuit LISA-U series modules don’t have an on-board charging circuit. An example of a battery charger design, suitable for applications that are battery powered with a Li-Ion (or Li-Polymer) cell, is provided in Figure 10. In the  application  circuit,  a  rechargeable  Li-Ion (or  Li-Polymer)  battery  cell,  that features  proper pulse  and  DC discharge current capabilities and proper DC series resistance, is directly  connected to the VCC supply input of LISA-U  series  module.  Battery  charging  is  completely  managed  by  the  STMicroelectronics  L6924U  Battery Charger IC that, from a USB power source (5.0 V typ.), charges as a linear charger the battery, in three phases:  Pre-charge constant current (active when the battery is deeply discharged): the battery is charged with a low current, set to 10% of the fast-charge current  Fast-charge constant current: the battery is charged with the maximum current, configured by the value of an external resistor to a value suitable for USB power source (~500 mA)  Constant  voltage:  when  the  battery  voltage  reaches  the  regulated  output  voltage  (4.2  V),  the  L6924U starts  to  reduce  the  current  until  the  charge  termination  is  done.  The  charging  process  ends  when  the charging current reaches the value configured by an external resistor to ~15 mA or when the charging timer reaches the value configured by an external capacitor to ~9800 s Using a battery pack with an internal NTC resistor, the L6924U can monitor the battery temperature to protect the battery from operating under unsafe thermal conditions. Alternatively the L6924U, providing input voltage range up to 12 V, can charge from an AC wall adapter. When a current-limited adapter is used, it can operate in quasi-pulse mode, reducing power dissipation. C5 C8GNDC7C6 C9LISA-U series62 VCC63 VCC61 VCC+USB SupplyC3 R4θU1IUSBIACIENDTPRGSDVINVINSNSMODEISELC2C15V0THGNDVOUTVOSNSVREFR1R2R3Li-Ion/Li-Pol Battery PackD1B1C4Li-Ion/Li-Polymer    Battery Charger IC Figure 10: Li-Ion (or Li-Polymer) battery charging application circuit Reference Description Part Number - Manufacturer B1 Li-Ion (or Li-Polymer) battery pack with 470 Ω NTC Various manufacturer C1, C4 1 µF Capacitor Ceramic X7R 0603 10% 16 V GRM188R71C105KA12 - Murata C2, C6 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata C3 1 nF Capacitor Ceramic X7R 0402 10% 50 V GRM155R71H102KA01 - Murata C5 330 µF Capacitor Tantalum D_SIZE 6.3 V 45 mΩ T520D337M006ATE045 - KEMET C7 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata C8 39 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1E390JA01 - Murata C9 10 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1E100JA01 - Murata D1 Low Capacitance ESD Protection USB0002RP or USB0002DP - AVX R1, R2 24 kΩ Resistor 0402 5% 0.1 W RC0402JR-0724KL - Yageo Phycomp R3 3.3 kΩ Resistor 0402 5% 0.1 W RC0402JR-073K3L - Yageo Phycomp R4 1.0 kΩ Resistor 0402 5% 0.1 W RC0402JR-071K0L - Yageo Phycomp U1 Single Cell Li-Ion (or Li-Polymer) Battery Charger IC for USB port and AC Adapter L6924U - STMicroelectronics Table 10: Suggested components for Li-Ion (or Li-Polymer) battery charging application circuit
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 28 of 160 1.5.3 Current consumption profiles During  operation,  the current  drawn  by  the  LISA-U  series  modules  through  the  VCC  pins  can  vary  by  several orders of magnitude. This ranges from the high peak of current consumption during GSM transmitting bursts at maximum power level in 2G connected mode, to continuous high current drawn in UMTS connected mode, to the low current consumption during power saving in idle-mode. 1.5.3.1 2G connected mode When a GSM call is established, the VCC consumption is determined by the current consumption profile typical of the GSM transmitting and receiving bursts. The current consumption peak during a transmission slot is strictly dependent on the transmitted power, which is regulated by the network. If the module is transmitting in GSM talk mode in the GSM 850 or in the E-GSM 900 band and at the maximum RF power control level (approximately 2 W or 33 dBm in the allocated transmit slot/burst) the current consumption can reach up to 2500 mA (with a highly unmatched antenna) for 576.9 µs (width of the transmit slot/burst) with a periodicity of 4.615 ms (width of 1 frame = 8 slots/burst), so with a 1/8 duty cycle according to GSM TDMA (Time Division Multiple Access). If the module is in GSM connected mode in the DCS 1800 or in the PCS 1900 band, the current consumption figures are lower than the one in the GSM 850 or in the E-GSM 900 band, due to 3GPP transmitter output power specifications (refer to refer to LISA-U1 series Data Sheet [1] and LISA-U2 series Data Sheet [2]). During a GSM call, current consumption is  in the order of 60-130 mA in receiving or in monitor bursts and  is about 10-40 mA in the inactive unused bursts (low current period). The more relevant contribution to determine the average current consumption is set by the transmitted power in the transmit slot. An example of current consumption profile of the data module in GSM talk mode is shown in Figure 11. Time [ms]RX   slotunused slotunused slotTX  slotunused slotunused slotMON       slotunused slotRX   slotunused slotunused slotTX   slotunused slotunused slotMON   slotunused slotGSM frame             4.615 ms                                       (1 frame = 8 slots)Current [A]200 mA60-130 mA2500 mAPeak current depends on TX powerGSM frame             4.615 ms                                       (1 frame = 8 slots)1.51.00.50.02.52.060-130 mA 10-40 mA Figure 11: VCC current consumption profile versus time during a GSM call (1 TX slot, 1 RX slot), with VCC=3.8 V When a GPRS connection is established there is a different VCC current consumption profile also determined by the transmitting and receiving bursts. In contrast to a GSM call, during a GPRS connection more than one slot can be used to transmit and/or more than one slot can be used to receive. The transmitted power depends on network  conditions,  which  set  the  peak  current  consumption,  but  following  the  GPRS  specifications  the maximum transmitted RF power is reduced if more than one slot is used to transmit, so the maximum peak of current consumption is not as high as can be in case of a GSM call. If the module transmits in GPRS class 12 or class 33 connected mode in the GSM 850 or in the E-GSM 900 band at  the  maximum  power  control  level,  the  current  consumption  can  reach  up  to  1600  mA  (with  unmatched
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 29 of 160 antenna). This happens for 2.307 ms (width of the 4 transmit slots/bursts) with a periodicity of 4.615 ms (width of  1  frame  =  8  slots/bursts),  so  with  a  1/2  duty  cycle,  according  to  GSM  TDMA.  If  the  module  is  in  GPRS connected mode in the DCS 1800 or in the PCS 1900 band, the current consumption figures are lower than in the GSM 850 or in the E-GSM 900 band, due to 3GPP transmitter output power specifications (refer to LISA-U1 series Data Sheet [1] and LISA-U2 series Data Sheet [2]). Figure 12 reports the current consumption profiles in GPRS class 12 connected mode, in the GSM 850 or in the E-GSM 900 band, with 4 slots used to transmit and 1 slot used to receive. Time [ms]RX   slotunused slotTX              slotTX   slotTX           slotTX                        slotMON       slotunused slotRX  slotunused slotTX                              slotTX   slotTX             slotTX                                slotMON   slotunused slotGSM frame             4.615 ms                                       (1 frame = 8 slots)Current [A]200mA60-130mAPeak current depends on TX powerGSM frame             4.615 ms                                       (1 frame = 8 slots)1.51.00.50.02.52.01600 mA60-130mA10-40mA Figure 12: VCC current consumption profile versus time during a GPRS/EDGE connection (4TX slots, 1 RX slot), with VCC=3.8 V In case of EDGE connections the VCC current consumption profile is very similar to the GPRS current profile, so the image shown in Figure 12, representing the current consumption profile in GPRS class 12 connected mode, is valid for the EDGE class 12 connected mode as well. LISA-U2 series modules support GPRS and EDGE class 33: up to 4 slots can be used to transmit, as in the class 12 mode, and up to 2 slots can be used to receive in the same frame since up to 6 slots can be used in total. So, the VCC current consumption figures in GPRS and EDGE class 33 connected modes are similar to the current profile in GPRS and EDGE class 12 connected modes, since the same number of transmit slots are used.  1.5.3.2 3G connected mode During a 3G connection, the module can transmit and receive continuously due to the Frequency Division Duplex (FDD) mode of operation with the Wideband Code Division Multiple Access (WCDMA). The current consumption depends  again  on  output  RF  power,  which  is  always  regulated  by  network  commands.  These  power  control commands are logically divided into a slot of 666 µs, thus the rate of power change can reach a maximum rate of  1.5  kHz.  There  are  no  high  current  peaks  as  in  the  2G  connection,  since  transmission  and  reception  are continuously enabled due to FDD WCDMA implemented in the 3G that differs from the TDMA implemented in the  2G  case.  In  the  worst  scenario,  corresponding  to  a  continuous  transmission  and  reception  at  maximum output power (approximately 250 mW or 24 dBm), the current drawn by the module at the VCC pins is in the order of continuous 500-800 mA (refer  to  LISA-U1 series Data  Sheet [1] and LISA-U2 series Data  Sheet [2] for detailed values). Even at lowest output RF power (approximately 0.01 µW or -50 dBm), the current still remains in the order of 200 mA due to module baseband processing and transceiver activity. An example of current consumption profile of the data module in UMTS/HSxPA continuous transmission mode is shown in Figure 13.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 30 of 160 Time [ms]3G frame  10 ms                                       (1 frame = 15 slots)Current [mA]Depends on TX power170 mA1 slot  666 µs850 mA0300200100500400600700800 Figure 13: VCC current consumption profile versus time during a UMTS/HSPA connection, with VCC=3.8 V When a packet data connection is established, the actual current profile depends on the amount of transmitted packets;  there  might  be  some periods  of  inactivity between  allocated  slots  where  current  consumption  drops about 100 mA. Alternatively, at higher data rates the transmitted power is likely to increase due to the higher quality signal required by the network to cope with enhanced data speed. 1.5.3.3 2G and 3G cyclic idle/active mode (power saving enabled) The power saving configuration is by default disabled, but it can be enabled using the appropriate AT command (refer  to  u-blox AT  Commands  Manual [3],  AT+UPSV  command).  When  power saving  is  enabled, the  module automatically enters idle-mode whenever possible. When power saving is enabled, the module is registered or attached to a network and a voice or data call is not enabled,  the  module  automatically  enters  idle-mode  whenever  possible,  but  it  must  periodically  monitor  the paging channel of the current base station (paging block reception), in accordance to GSM system requirements. When the module monitors the paging channel, it wakes up to active mode, to enable the reception of paging block. In between, the module switches to idle-mode. This is known as GSM discontinuous reception (DRX). The  module  processor  core  is  activated  during  the  paging  block  reception,  and  automatically  switches  its reference clock frequency from 32 kHz to the 26 MHz used in active-mode. The time period between two paging block receptions is defined by the network (2G or 3G). This is the paging period parameter, fixed by the base station through broadcast channel sent to all users on the same serving cell. In case of 2G network, the time interval between two paging block receptions can be from 470.76 ms (DRX = 2, i.e. width of 2 GSM multiframes = 2 x 51 GSM frames = 2 x 51 x 4.615 ms) up to 2118.42 ms (DRX = 9, i.e. width of 9 GSM multiframes = 9 x 51 frames = 9 x 51 x 4.615 ms).  In case of 3G network, the principle is similar but time interval changes from 640 ms (DRX = 6, i.e. the width of 26 x 3G frames = 64 x 10 ms = 640 ms) up to 5120 ms (DRX = 9, i.e. width of 29 x 3G frames = 512 x 10 ms = 5120 ms). An example of a module current consumption profile is shown in Figure 14: the module is registered with the network  (2G or 3G),  automatically enters  idle-mode and periodically wakes  up to active mode to monitor the paging channel for paging block reception.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 31 of 160 ~30 msIDLE MODE ACTIVE MODE IDLE MODE400-700 µAActive Mode EnabledIdle Mode Enabled400-700 µA2G case: 60-130 mA     3G case: 50-90 mA2G case: 0.44-2.09 s    3G case: 0.61-5.09 sIDLE MODE2G or 3G case: ~30 msACTIVE MODETime [s]Current [mA]150100500Time [ms]Current [mA]1501005005-10 mA 10-25 mA2G case: 60-130 mA     3G case: 50-90 mAPLL EnabledRX Enabled35-40 mADSP Enabled Figure 14: Description of VCC current consumption profile versus time when the module is registered with 2G or 3G networks: the module is in idle-mode and periodically wakes up to active mode to monitor the paging channel for paging block reception  1.5.3.4 2G and 3G fixed active mode (power saving disabled) Power saving configuration is by default disabled, or it can be disabled using the appropriate AT command (refer to u-blox AT Commands Manual [3], AT+UPSV command). When power saving is disabled, the module doesn’t automatically enter idle-mode whenever possible: the module remains in active mode. The module processor core is activated during active-mode, and the 26 MHz reference clock frequency is used. An example of the current consumption profile of the data module when power saving is disabled is shown in Figure 15: the module is registered with the network, active-mode is maintained, and the receiver and the DSP are periodically activated to monitor the paging channel for paging block reception.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 32 of 160 ACTIVE MODE10-25 mA10-25 mA2G case: 0.47-2.12 s  3G case: 0.64-5.12 sPaging periodTime [s]Current [mA]150100500Time [ms]Current [mA]15010050010-25 mARX EnabledDSP Enabled35-40 mA2G case: 60-130 mA     3G case: 50-90 mA2G case: 60-130 mA     3G case: 50-90 mA Figure 15: Description of the VCC current consumption profile versus time when power saving is disabled: the active-mode is always held, and the receiver and the DSP are periodically activated to monitor the paging channel for paging block reception  1.5.4 RTC Supply (V_BCKP) The  V_BCKP pin  connects the  supply for the  Real Time  Clock (RTC)  and Power-On  / Reset  internal logic. This supply  domain  is  internally  generated  by  a  linear  regulator  integrated  in  the  Power  Management  Unit.  The output of this linear regulator is always enabled when the main voltage supply provided to the module through VCC is within the valid operating range, with the module switched-off or powered-on.  Name Description Remarks V_BCKP Real Time Clock supply V_BCKP output voltage = 2.3 V (typical) on LISA-U1 series  V_BCKP output voltage = 1.8 V (typical) on LISA-U2 series  Generated by the module to supply Real Time Clock when VCC supply voltage is within valid operating range. Table 11: Real Time Clock supply pin  The V_BCKP pin ESD sensitivity rating is 1 kV (Human Body Model according to JESD22-A114F). Higher protection  level  could  be  required  if  the  line  is  externally  accessible  on  the  application  board.  Higher protection level can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the line connected to this pin, close to accessible point.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 33 of 160 The RTC provides the time reference (date and time) of the module, also in power-off mode, when the V_BCKP voltage is within its valid range (specified in the Input characteristics of Supply/Power pins table in LISA-U1 series Data Sheet [1] and LISA-U2 series Data Sheet [2]). The RTC timing is normally used to set the wake-up interval during  idle-mode  periods  between  network  paging,  but  is  able  to  provide  programmable  alarm  functions  by means of the internal 32.768 kHz clock. The RTC can be supplied from an external back-up battery through the V_BCKP, when the main voltage supply is not provided to the module through VCC. This lets the time reference (date and time) run  until the V_BCKP voltage is within its valid range, even when the main supply is not provided to the module. The  RTC  oscillator  doesn't  necessarily  stop  operation  (i.e.  the  RTC  counting  doesn't  necessarily  stop)  when V_BCKP voltage  value drops below the specified operating range  minimum limit (1.00 V): the RTC value  read after a system restart could be not reliable as explained in the following Table 12.  V_BCKP voltage value RTC value reliability Notes 1.00 V < V_BCKP < 1.90 V (LISA-U2 series) 1.00 V < V_BCKP < 2.50 V (LISA-U1 series) RTC oscillator doesn't stop operation RTC value read after a restart of the system is reliable V_BCKP within operating range 0.05 V < V_BCKP < 1.00 V RTC oscillator doesn't necessarily stop operation RTC value read after a restart of the system is not reliable V_BCKP below operating range 0.00 V < V_BCKP < 0.05 V RTC oscillator stops operation RTC value read after a restart of the system is reliable V_BCKP below operating range Table 12: RTC value reliability as function of V_BCKP voltage value  Consider  that  the  module  cannot  switch  on  if  a  valid  voltage  is  not  present  on  VCC  even  when  the  RTC  is supplied through V_BCKP (meaning that VCC is mandatory to switch-on the module). The RTC has very low power consumption, but is highly temperature dependent. For example at 25°C, with the V_BCKP voltage equal to the typical output value, the power consumption is approximately 2 µA (refer to the Input characteristics of  Supply/Power pins  table  in the  LISA-U1  series  Data Sheet [1] and  in the  LISA-U2  series Data  Sheet [2]  for  the  detailed  specification),  whereas  at  70°C  and an  equal  voltage  the power  consumption increases to 5-10 µA.   The  internal  regulator  for  V_BCKP is  optimized  for low  leakage  current  and very  light loads.  It is  not recommended to use V_BCKP to supply external loads.  If V_BCKP is left unconnected and the module main voltage supply is removed from VCC, the RTC is supplied from  the  bypass  capacitor  mounted  inside  the  module.  However,  this  capacitor  is  not  able  to  provide  a  long buffering time: within few milliseconds the voltage on V_BCKP will go below the valid range (1 V min). This has no impact on wireless connectivity, as all the functionalities of the module do not rely on date and time setting.   Leave V_BCKP unconnected if the RTC is not required when the VCC supply is removed. The date and time  will  not  be  updated  when  VCC  is  disconnected.  If  VCC  is  always  supplied,  then  the  internal regulator is supplied from the main supply and there is no need for an external component on V_BCKP.  If RTC is required to run for a time interval of T [s] at 25°C when VCC supply is removed, place a capacitor with a nominal capacitance of C [µF] at the V_BCKP pin. Choose the capacitor using the following formula: C [µF] = (Current_Consumption [µA] x T [s]) / Voltage_Drop [V] = 1.92 x T [s] for LISA-U1 series  = 2.50 x T [s] for LISA-U2 series  For example, a 100 µF capacitor (such as the Murata GRM43SR60J107M) can be placed at V_BCKP to provide a long buffering time. This capacitor will hold V_BCKP voltage within its valid range for around 50 s at 25°C, after the  VCC  supply  is  removed.  If  a  very  long  buffering  time  is  required,  a  70  mF  super-capacitor  (e.g.  Seiko
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 34 of 160 Instruments XH414H-IV01E) can be placed at V_BCKP, with a 4.7 k series resistor to hold the V_BCKP voltage within its valid range for approximately 10 hours at 25°C, after the VCC supply is removed. The purpose of the series resistor is to limit the capacitor charging current due to the large capacitor specifications, and also to let a fast rise time of the voltage value at the V_BCKP pin after VCC supply has been provided. These capacitors will allow the time reference to run during battery disconnection.  LISA-U seriesC1(a)2V_BCKPR2LISA-U seriesC2(superCap)(b)2V_BCKPD3LISA-U seriesB3(c)2V_BCKP Figure 16: Real time clock supply (V_BCKP) application circuits: (a) using a 100 µF capacitor to let the RTC run for ~50 s after VCC removal; (b) using a 70 mF capacitor to let RTC run for ~10 hours after VCC removal; (c) using a non-rechargeable battery Reference Description Part Number - Manufacturer C1 100 µF Tantalum Capacitor GRM43SR60J107M - Murata R2 4.7 kΩ Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp C2 70 mF Capacitor  XH414H-IV01E - Seiko Instruments Table 13: Example of components for V_BCKP buffering  If longer buffering time is required to allow the time reference to run during a disconnection of the VCC supply, then  an  external  battery  can  be  connected  to  V_BCKP  pin.  The  battery  should  be  able  to  provide  a  proper nominal  voltage  and  must  never  exceed  the  maximum  operating  voltage  for  V_BCKP  (specified  in  the  Input characteristics of Supply/Power pins table in LISA-U1 series Data Sheet [1] and in LISA-U2 series Data Sheet [2]). The  connection  of  the  battery  to  V_BCKP  should  be  done  with  a  suitable  series  resistor  for  a  rechargeable battery, or with an appropriate series diode for a non-rechargeable battery. The purpose of the series resistor is to limit the battery charging current due to the battery specifications, and also to  allow a fast rise time of the voltage value at the V_BCKP pin after the VCC supply has been provided. The purpose of the series diode is to avoid a current flow from the module V_BCKP pin to the non-rechargeable battery. Combining a  LISA-U  series wireless  module with a u-blox GPS  receiver, the  VCC supply  of the GPS receiver  is controlled by the wireless  module by  means of the GPS supply enable function provided  by the  GPIO2 of the wireless module. In this case the V_BCKP supply output of the LISA-U series wireless module can be connected to the V_BCKP backup supply input pin of the GPS receiver to provide the supply for the GPS real time clock and backup RAM when the VCC supply of the wireless module is within its operating range and the  VCC supply of the GPS receiver is disabled. This enables the u-blox GPS receiver to recover from a power breakdown with either a  Hotstart  or  a  Warmstart  (depending  on  the  duration  of  the  GPS  VCC  outage)  and  to  maintain  the configuration settings saved in the backup RAM. Refer to section 1.10 for more details regarding the application circuit with a u-blox GPS receiver.  1.5.5 Interface supply (V_INT) The same voltage domain used internally to supply the digital interfaces is also available  on the V_INT pin. The internal regulator that generates the  V_INT supply is a switching step down converter that is directly supplied from VCC. The voltage regulator output is set to 1.8 V (typical) when the module is switched on and is disabled when  the  module  is  switched  off  or  when  the  RESET_N  pin  is  forced  the  low  level.  The  switching  regulator operates in  Pulse Width Modulation (PWM) for  high output current mode  but automatically switches to  Pulse
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 35 of 160 Frequency Modulation (PFM) at low output  loads for greater efficiency, e.g. when  the module  is in  idle-mode between paging periods.  Name Description Remarks V_INT Digital Interfaces supply output V_INT = 1.8V (typical) generated by the module when it is switched-on and the RESET_N (external reset input pin) is not forced to the low level. V_INT is the internal supply for digital interfaces. The user may draw limited current from this supply rail. Table 14: Interface supply pin  The V_INT pin ESD sensitivity rating is 1 kV (Human Body Model according to  JESD22-A114F).  Higher protection  level  could  be  required  if  the  line  is  externally  accessible  on  the  application  board.  Higher protection level can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the line connected to this pin, close to accessible point.  Since it supplies internal digital circuits (see Figure 4), V_INT is not suited to directly supply any sensitive analog circuit: the voltage ripple can range from 15 mVpp during active mode (PWM), to 70 mVpp in idle-mode (PFM).   V_INT can  be used to supply external digital circuits operating at  the same voltage level as the digital interface  pins,  i.e. 1.8  V  (typical).  It is  not  recommended  to  supply  analog  circuitry  without adequate filtering for digital noise.   Don’t apply loads which  might exceed the  limit for maximum available current from  V_INT supply, as this  can  cause  malfunctions  in  internal  circuitry  supplies  to  the  same  domain.  The  detailed  electrical characteristics are described in LISA-U1 series Data Sheet [1] and LISA-U2 series Data Sheet [2].   V_INT can only be used as an output; don’t connect any external regulator on V_INT. If not used, this pin should be left unconnected.  The V_INT digital interfaces supply output is mainly used to:  Pull-up DDC (I2C) interface signals (see section 1.10.2 for more details)  Pull-up SIM detection signal (see section 1.8 for more details)  Supply voltage translators to connect digital interfaces of the module to a 3.0 V device (see section 1.9.2.4)  Indicate when the module is switched on and the RESET_N (external reset input) is not forced low   1.6 System functions 1.6.1 Module power-on The power-on sequence of LISA-U series modules is initiated in one of these ways:  Rising edge on the VCC pin to a valid voltage as module supply (i.e. applying module supply)  Low level on the PWR_ON pin (i.e. forcing to the low level the pin normally high by external pull-up)  Rising edge on the RESET_N pin (i.e. releasing from low level the pin, normally high by internal pull-up)  RTC alarm (i.e. pre-programmed scheduled time by AT+CALA command)
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 36 of 160 Name Description Remarks  PWR_ON Power-on input PWR_ON pin has high input impedance. Do not keep floating in noisy environment: external pull-up required. Table 15: Power-on pin  The PWR_ON pin ESD sensitivity rating is 1 kV (Human Body Model according to JESD22-A114F). Higher protection  level  could  be  required  if  the  line  is  externally  accessible  on  the  application  board.  Higher protection level can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the line connected to this pin, close to accessible point.  1.6.1.1 Rising edge on VCC When  a  supply  is  connected  to  VCC  pins,  the  module  supply  supervision  circuit  controls  the  subsequent activation of  the power  up  state  machines: the module is switched  on when  the voltage  rises up  to the  VCC normal operating range minimum limit starting from a voltage value lower than 2.25 V (refer to LISA-U1 series Data Sheet [1] and LISA-U2 series Data Sheet [2] for the VCC normal operating range minimum limit).   The voltage at the VCC pins must ramp from 2.5 V to 3.2 V within 1 ms to switch on the module.  1.6.1.2 Low level on PWR_ON The module power-on sequence starts when a low level is forced on the PWR_ON input for at least 5 ms. The electrical characteristics of the PWR_ON input pin are slightly different between LISA-U1 series and LISA-U2 series modules, and are different from the other digital I/O interfaces: the  pin provides different input voltage thresholds  and  is tolerant  of  voltages up to the  module  supply  level. The  detailed  electrical  characteristics  are described in LISA-U1 series Data Sheet [1] and LISA-U2 series Data Sheet [2].   The PWR_ON pin has high input impedance and is weakly pulled to the high level on the module. Avoid keeping it floating in a noisy environment. To hold the high logic level stable, the PWR_ON pin must be connected to a pull-up resistor (e.g. 100 kΩ) biased by the V_BCKP supply pin of the module.  Following are some typical examples of application circuits to turn the module on using the PWR_ON input pin. The simplest way to turn on the module is to use a  push button that shorts the PWR_ON input to ground: in this case the V_BCKP supply pin can be used to bias the pull-up resistor. If PWR_ON input is connected to an external device (e.g. application processor), it is suggested to use an open drain output on the external device with an external pull-up resistor (e.g. 100 kΩ) biased by the V_BCKP supply pin of the module. A push-pull output of an application processor can also be used: in this case the pull-up can be used to pull the PWR_ON  level  high when  the  application processor  is  switched  off.  If the  high-level  voltage of  the  push-pull output  pin  of  the  application  processor  is  greater  than  the  maximum  input  voltage  operating  range  of  the V_BCKP  pin  (refer  to  the  V_BCKP  Input  characteristics  of  Supply/Power  pins  table  in    LISA-U1  series  Data Sheet [1] and LISA-U2 series Data Sheet [2]), the V_BCKP supply cannot be used to bias the pull-up resistor: the supply rail of the application processor or the VCC supply could be used, but this will increase the V_BCKP (RTC supply) current consumption when the module is in not-powered mode (VCC supply not present). Using a push-pull  output  of  the  external  device,  take  care  to  fix  the  proper  level  in  all  the  possible  scenarios  to  avoid  an inappropriate switch-on of the module.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 37 of 160 LISA-U seriesRext2V_BCKP19 PWR_ONPower-on push buttonESDOpen Drain OutputApplication ProcessorLISA-U seriesRext2V_BCKP19 PWR_ON Figure 17: PWR_ON application circuits using a push button and an open drain output of an application processor Reference Description Remarks Rext 100 kΩ Resistor 0402 5% 0.1 W External pull-up resistor ESD CT0402S14AHSG - EPCOS Varistor array for ESD protection Table 16: Example of pull-up resistor and ESD protection for the PWR_ON application circuits  1.6.1.3 Rising edge on RESET_N LISA-U series modules can  be switched on  by means of  the RESET_N  input pin: the RESET_N signal  must be forced  low  for  at  least  50  ms  and  then  released  to  generate  a  rising  edge  that  starts  the  module  power-on sequence. RESET_N input pin can also be used to perform an “external” or “hardware” reset of the module, as described in the section 1.6.3. Electrical  characteristics  of  the  LISA-U  series  RESET_N  input  are  slightly  different  from  the  other  digital  I/O interfaces: the pin provides different input voltage thresholds. Detailed electrical characteristics are described in LISA-U1 series Data Sheet [1] and LISA-U2 series Data Sheet [2]. RESET_N  is  pulled  high  to  V_BCKP  by  an  integrated  pull-up  resistor  also  when  the  module  is  in  power-off mode. Therefore an external pull-up is not required on the application board. The  simplest  way to  switch on  the module  by means  of the  RESET_N  input pin  is to  use a  push button that shorts the RESET_N pin to ground: the module will be switched on at the release of the push button, since the RESET_N will be forced to the high level by the integrated pull-up resistor, generating a rising edge. If RESET_N is connected to an external device (e.g. an application processor on an application board) an open drain output can be directly connected without any external pull-up. A push-pull output can be used too: in this case  make  sure  that  the  high  level  voltage  of  the  push-pull  circuit  is  below  the  maximum  voltage  operating range of the  RESET_N pin (specified in the  RESET_N pin characteristics table  in LISA-U1 series  Data Sheet [1] and LISA-U2 series  Data Sheet [2]). To avoid unwanted power-on or  reset of the module make sure to fix the proper level at the RESET_N input pin in all possible scenarios. Some typical examples of application circuits using the RESET_N input pin are described in the section 1.6.3.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 38 of 160 1.6.1.4 Real Time Clock (RTC) alarm If a voltage within the operating range is maintained at the VCC pin, the module can be switched on by the RTC alarm  when  the  RTC  system  reaches  a  pre-programmed  scheduled  time  (refer  to  the  u-blox  AT  Commands Manual [3], AT+CALA command). The RTC system will then initiate the boot sequence by instructing the Power Management  Unit to  turn  on power.  Also included  in this  setup is  an  interrupt signal  from  the RTC  block  to indicate to the baseband processor that an RTC event has occurred.  1.6.1.5 Additional considerations The module is switched on when the VCC voltage rises up to the normal operating range (i.e. applying module supply): the first time that the module is used, it is switched on in this way. Then, LISA-U series modules can be switched  off  by  means  of  the  AT+CPWROFF  command.  When  the  module  is  in  power-off  mode,  i.e.  the AT+CPWROFF  command  has  been  sent  and  a  voltage  value  within  the  normal  operating  range  limits  is  still provided to the  VCC pin, the digital input-output pads of the baseband chipset (i.e. all the digital pins of the module) are locked in tri-state (i.e. floating). The power down tri-state function isolates the module pins from its environment, when no proper operation of the outputs can be guaranteed. The module can be  switched on from power-off mode  by forcing a proper start-up event  (i.e. PWR_ON low, RESET_N release  or RTC alarm). After the detection of a start-up event,  all the digital pins of the module are held in tri-state until all the internal LDO voltage regulators are turned on in a defined power-on sequence. Then, as described in Figure 18, the baseband core is still held in reset state for a time interval: the internal reset signal (which is not available on a module pin) is still low and any signal from the module digital interfaces is held in reset state. The reset state of all the digital pins is reported in the pin description table of LISA-U1 series Data Sheet [1]  and  LISA-U2  series  Data  Sheet [2].  When  the  internal  signal  is  released,  the  configuration  of  the module interfaces starts: during this phase any digital pin is set in a proper sequence from the reset state to the default operational configuration. Finally, the module is fully ready to operate when all interfaces are configured. VCCV_BCKPPWR_ONV_INTInternal ResetSystem StateBB Pads StateInternal Reset → Operational OperationalTristate / Floating Internal ResetOFFONStart-up event0 ms~5 ms~6 ms~35 ms~3 sPWR_ON can be set highStart of interface configurationAll interfaces are configured Figure 18: LISA-U series power-on sequence description   The Internal Reset signal is not available on a module pin.  Any external signal connected to the UART interface, SPI/IPC interface, I2S interfaces and GPIOs must be tri-stated when the module is in power-down mode, when the external reset is forced low and during the module power-on sequence (at least  for 3  s  after the start-up event), to avoid  latch-up of circuits
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 39 of 160 and let a proper boot of the module. If the external signals connected to the wireless module cannot be tri-stated, insert a multi channel digital switch (e.g. Texas Instruments SN74CB3Q16244, TS5A3159, or TS5A63157)  between  the  two-circuit  connections  and  set  to  high  impedance  during  module  power down mode, when external reset is forced low and during power on sequence.  1.6.2 Module power-off The correct way to switch off  LISA-U series modules  is by means of +CPWROFF AT command (more details in u-blox  AT  Commands  Manual  [3]):  in  this  way  the  current  parameter  settings  are  saved  in  the  module’s non-volatile memory and a proper network detach is performed. LISA-U2xx-01  modules  can  also be  properly  switched  off  by means of  the  PWR_ON  input  pin:  the PWR_ON signal must be held to the low logic level for more than 1 s to start the module power-off sequence. In this way, current  parameter  settings  are  saved  in  LISA-U2xx-01  module’s  non-volatile  memory  and  a  correct  network detach is performed: the same sequence is performed as by the +CPWROFF AT command. An under-voltage shutdown occurs on LISA-U series modules when the VCC supply is removed, but in this case the current parameter settings are not saved in the module’s non-volatile memory and a proper network detach cannot be performed. The power-off sequence by means of +CPWROFF AT command is described in Figure 19. When the +CPWROFF AT command is sent, the module starts the switch-off routine replying OK on the AT interface. At the end of the switch-off routine, all digital pins are locked in tri-state by the module and all the internal LDO voltage regulators except  the  RTC  supply  (V_BCKP)  are  turned  off  in  a  defined  power-off  sequence.  The  module  remains  in power-off mode as long as a switch on event doesn’t occur (i.e. applying a low level on the  PWR_ON pin, or releasing from low level the RESET_N pin, or by a pre-programmed RTC alarm), and enters not-powered mode if the supply is removed from the VCC pin. Current parameter settings are stored to the module’s non-volatile memory and a network detach is performed before the OK reply from AT+CPWROFF command on all LISA-U series modules except LISA-U1xx-00 versions. Storage  of  parameters  and  network  detach  are  performed  before  the  end  of  the  switch-off  routine,  but  not necessary before the OK reply from AT+CPWROFF command on LISA-U1xx-00 versions. Since the time to  perform a network  detach depends on the network settings, the  duration of  the  switch off routine phases can differ from the typical values reported in Figure 19.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 40 of 160 VCCV_BCKPPWR_ONV_INTInternal ResetSystem StateBB Pads State OperationalOFFTristate / Floating ONOperational → Tristate / FloatingAT+CPWROFFsent to the module0 ms~50 ms~400 msOKreplied by the module Figure 19: LISA-U series Power-off sequence description  The Internal Reset signal is not available on a module pin.  Tristated pins are always subject to floating caused by noise: to prevent unwanted effects, fix them with proper pull-up or pull down resistors to stable voltage rails to fix their level when the module is in Power down state.  Any external signal connected to the UART interface, SPI/IPC interface, I2S interfaces and GPIOs must be tri-stated when the module is in power-down mode, when the external reset is forced low and during the module power-on sequence (at least  for 3  s  after the start-up event), to avoid  latch-up of circuits and allow a proper boot of the module. If the external signals connected to the wireless module cannot be tri-stated, insert a multi channel digital switch (e.g. Texas Instruments SN74CB3Q16244, TS5A3159, or TS5A63157) between the two-circuit connections and set to high impedance during module power down mode, when external reset is forced low and during power-on sequence.  1.6.3 Module reset LISA-U series modules reset can be performed in one of 2 ways:  Forcing a low level on the RESET_N input pin, causing an “external” or “hardware” reset  Via AT command, causing an “internal” or “software” reset RESET_N input pin: force low for at least 50 ms; either an “external” or “hardware” reset is performed. This causes an asynchronous reset of the  entire module,  including the integrated  Power Management Unit,  except for the RTC internal block: the V_INT interfaces supply is switched off and all the digital pins are tri-stated, but the  V_BCKP  supply  and  the  RTC  block  are  enabled.  Forcing  an  “external”  or  “hardware”  reset,  the  current parameter  settings  are  not  saved  in  the  module’s  non-volatile  memory  and  a  proper  network  detach  is  not performed. AT+CFUN  command  (more  details  in  u-blox  AT  Commands  Manual [3]):  in  this  case  an  “internal”  or “software”  reset  is  performed,  causing  an  asynchronous  reset  of  the  baseband  processor,  excluding  the integrated Power Management Unit and the RTC internal block: the V_INT interfaces supply is enabled and each digital pin is set in its internal reset state (reported in the pin description table in LISA-U1 series Data Sheet [1] and LISA-U2 series Data Sheet [2]), the V_BCKP supply and the RTC block are enabled. Forcing an “internal” or
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 41 of 160 “software” reset, the current parameter settings are saved in the module’s non-volatile memory and a proper network detach is performed. When RESET_N is released from the low level, the module automatically starts its power-on sequence from the reset state. The same procedure is followed for the module reset via AT command after having performed the network detach and the parameter saving in non-volatile memory.  The internal reset state of all digital pins is reported in the pin description table in  LISA-U1 series Data Sheet [1] and LISA-U2 series Data Sheet [2].  Name Description Remarks RESET_N External reset input Internal 10 k pull-up to V_BCKP Table 17: Reset pin  The RESET_N pin ESD sensitivity rating is 1 kV (Human Body Model according to JESD22-A114F). Higher protection  level  could  be  required  if  the  line  is  externally  accessible  on  the  application  board.  Higher protection level can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the line connected to this pin, close to accessible point.  For more details about RESET_N circuit precautions for ESD immunity please refer to chapter 2.5.3.  The electrical characteristics of RESET_N are different from the other digital I/O interfaces. The detailed electrical characteristics are described in LISA-U1 series Data Sheet [1] and LISA-U2 series Data Sheet [2]. RESET_N is pulled high by an integrated 10 k pull-up resistor to V_BCKP. Therefore an external pull-up is not required on the application board. Following are some typical examples of application circuits using the RESET_N input pin. The simplest way to reset the module is to use a push button that shorts the RESET_N pin to ground. If RESET_N is connected to an external device (e.g. an application processor on an application board) an open drain output can be directly connected without any external pull-up. A push-pull output can be used too: in this case  make  sure  that  the  high  level  voltage  of  the  push-pull  circuit  is  below  the  maximum  voltage  operating range of the RESET_N  pin (specified  in the  RESET_N pin characteristics table  in LISA-U1 series  Data Sheet [1] and LISA-U2 series Data Sheet [2]). To avoid unwanted reset of the module make sure to fix the proper level at the RESET_N input pin in all possible scenarios. As ESD  immunity test  precaution,  a 47  pF  bypass capacitor  (e.g. Murata  GRM1555C1H470JA01) and a  series ferrite bead (e.g. Murata BLM15HD182SN1) must be added on the RESET_N line pin of LISA-U1 series modules and  an  additional  220  nF  bypass  capacitor  (e.g.  Murata  GRM155R60J224KE01)  must  be  added  as  close  as possible  to  the  RESET_N  pin  of  LISA-U2  series  modules  to  avoid  a  module  reset  caused  by  an  electrostatic discharge applied to the application board (for more details, refer to chapter 2.5.3).
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 42 of 160 LISA-U series2V_BCKP22 RESET_NReset     push buttonESDOpen Drain OutputApplication ProcessorLISA-U series2V_BCKP22 RESET_NRintRintFB1C1FB2C3C2C4 Figure 20: RESET_N application circuits using a push button and an open drain output of an application processor Reference Description Remarks ESD Varistor for ESD protection. CT0402S14AHSG - EPCOS C1, C3 47 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H470JA01 - Murata C2, C4 220 nF Capacitor Ceramic X5R 0402 10% 6.3 V GRM155R60J224KE01 - Murata FB1, FB2 Chip Ferrite Bead for Noise/EMI Suppression BLM15HD182SN1 - Murata Rint 10 kΩ Resistor 0402 5% 0.1 W Internal pull-up resistor Table 18: Example of ESD protection components for the RESET_N application circuit   Any external signal connected to the UART interface, SPI/IPC interface, I2S interfaces and GPIOs must be tri-stated when the module is in power-down mode, when the external reset is forced low and during the module power-on sequence (at least  for 3  s  after the start-up event), to avoid  latch-up of circuits and allow a proper boot of the module. If the external signals connected to the wireless module cannot be tri-stated, insert a multi channel digital switch (e.g. Texas Instruments SN74CB3Q16244, TS5A3159, or TS5A63157) between the two-circuit connections and set to high impedance during module power down mode, when external reset is forced low and during power-on sequence.  1.7 RF connection The ANT pin, provided by all LISA-U series modules, represents the main RF input/output used to transmit and receive the 2G and 3G RF signal: the main antenna must be connected to this pad. The ANT pin has a nominal characteristic impedance of  50  and must be connected to the antenna through a 50   transmission line to allow transmission and reception of radio frequency (RF) signals in the 2G and 3G operating bands. The ANT_DIV pin, provided by LISA-U230 modules, represents the RF input for the integrated diversity receiver: the antenna for the Rx diversity should be connected to this pad. The ANT_DIV pin has a nominal characteristic impedance of 50  and must be connected to the antenna for the Rx diversity through a 50  transmission line to allow reception of radio frequency (RF) signals in the 2G and 3G operating bands.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 43 of 160 Name Module Description Remarks ANT All RF input/output for main Tx/Rx antenna Zo = 50  nominal characteristic impedance. ANT_DIV LISA-U230 RF input for Rx diversity antenna Zo = 50  nominal characteristic impedance. Table 19: Antenna pins   ESD immunity rating of the ANT port of LISA-U1 series modules is 500 V (according to IEC 61000-4-2). ESD immunity rating of the ANT port of LISA-U200-00 modules is 1000 V (according to IEC 61000-4-2). Higher protection level could be required if the line is externally accessible on the application board (for further details see section 2.5.3).  Choose an antenna with optimal radiating characteristics for the best electrical performance and overall module functionality. An internal antenna, integrated on the application board, or an external antenna, connected to the application board through a proper 50  connector, can be used. See section 2.4 and section 2.2.1.1 for further details regarding antenna guidelines.   The recommendations  of the antenna producer  for correct installation and  deployment (PCB layout and matching circuitry) must be followed.  If an external antenna is used, the PCB-to-RF-cable transition must be implemented using either a suitable 50  connector, or an RF-signal solder pad (including GND) that is optimized for 50  characteristic impedance. If antenna supervisor functionality is required, the main antenna connected to the ANT pin should have a built in DC diagnostic resistor to ground to get proper detection functionality (See section 2.4.3).   If the Rx diversity is not implemented, ANT_DIV pin can be left unconnected on the application board.  1.8 (U)SIM interface High-speed  SIM/ME  interface  is  implemented  as  well  as  automatic  detection  of  the  required  SIM  supporting voltage. Both 1.8  V and  3 V SIM  types are supported:  activation and  deactivation with automatic voltage  switch from 1.8 V  to  3  V  is  implemented,  according  to  ISO-IEC  7816-3  specifications.  The  SIM  driver  supports  the  PPS (Protocol and Parameter Selection) procedure for baud-rate selection, according to the values determined by the SIM Card.  Name Description Remarks VSIM SIM supply 1.80 V typical or 2.90 V typical  Automatically generated by the module SIM_CLK SIM clock 3.25 MHz clock frequency SIM_IO SIM data Open drain, internal 4.7 k pull-up resistor to VSIM SIM_RST SIM reset  Table 20: SIM Interface pins   A  low  capacitance  (i.e.  less  than  10  pF)  ESD  protection  (e.g.  Infineon  ESD8V0L2B-03L  or  AVX USB0002RP)  must  be  placed  near  the  SIM  card  holder  on  each  line  (VSIM,  SIM_IO,  SIM_CLK, SIM_RST).  The  SIM  interface  pins  ESD  sensitivity  rating  is  1  kV  (Human  Body  Model  according  to
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 44 of 160 JESD22-A114F): higher protection level is required if the lines are connected to an SIM card connector, since they are externally accessible on the application board.  For more details about the general precautions for ESD immunity about  SIM interface pins please refer to chapter 2.5.3.  Figure 21  shows an application circuit connecting the  LISA-U series module and  the SIM card placed in a SIM card holder, using the SIM detection function provided by GPIO5 pin. Note that, as defined by ETSI TS 102 221 or ISO/IEC 7816, SIM card contacts assignment is as follows:  Contact C1 = VCC (Supply)  It must be connected to VSIM  Contact C2 = RST (Reset)  It must be connected to SIM_RST  Contact C3 = CLK (Clock)  It must be connected to SIM_CLK  Contact C4 = AUX1 (Auxiliary contact for USB interface and other uses)  It must be left not connected  Contact C5 = GND (Ground)  It must be connected to GND  Contact C6 = VPP (Programming supply)  It must be connected to VSIM  Contact C7 = I/O (Data input/output)  It must be connected to SIM_IO  Contact C8 = AUX2 (Auxiliary contact for USB interface and other uses)  It must be left not connected A SIM card can have 6 contacts (C1 = VCC, C2 = RST, C3 = CLK, C5 = GND, C6 = VPP, C7 = I/O) or 8 contacts (providing also the auxiliary contacts C4 = AUX1 and C8 = AUX2). The contacts number depends if additional features, that are not supported by the (U)SIM card interface of the LISA-U series modules, are provided by the SIM card (contacts C4 = AUX1 and C8 = AUX2 for USB interfaces and other uses). A SIM card holder can  have 6 or  8  positions if a  mechanical card presence  detector is not provided, or it can have 6+2 or 8+2 positions if two additional pins for the mechanical card presence detection are provided. Figure 21 shows an application circuit connecting a LISA-U series module and a SIM card placed in a SIM card holder with 6+2 pins (as the CCM03-3013LFT R102 connector, produced by C&K Components, which provides 2 pins for the mechanical card presence detection), using the SIM detection function provided by the  GPIO5 of LISA-U series module. This configuration allows the module to detect if a SIM card is present in the connector. The SW1 and SW2 pins of the SIM card holder are connected to a normally-open mechanical switch integrated in the SIM connector. The following cases are available   SIM card not present: the GPIO5 signal is forced low by the pull-down resistor connected to ground (i.e. the switch integrated in the SIM connector is open)  SIM card present: the GPIO5 signal is forced high by the pull-up resistor connected to V_INT (i.e. the switch integrated in the SIM connector is closed)  LISA-U seriesC1SIM CARD HOLDERCCVCC (C1)CCVPP (C6)CCIO (C7)CCCLK (C3)CCRST (C2)GND (C5)C2 C3 C5D2 D3C5C6C7C1C2C3SIM Card Bottom View (contacts side)J150VSIM48SIM_IO47SIM_CLK49SIM_RSTC4SW1SW24V_INT51GPIO5R2R1D1 Figure 21: SIM interface application circuit
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 45 of 160 Reference Description Part Number - Manufacturer C1, C2, C3, C4 33 pF Capacitor Ceramic COG 0402 5% 25 V GRM1555C1H330JZ01 - Murata C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata D1, D2, D3 Low capacitance ESD protection USB0002RP or USB0002DP - AVX R1 1 kΩ Resistor 0402 5% 0.1 W RC0402JR-071KL - Yageo Phycomp R2 470 kΩ Resistor 0402 5% 0.1 W RC0402JR-07470KL- Yageo Phycomp J1 SIM Card Holder Various Manufacturers, CCM03-3013LFT R102 - C&K Components Table 21: Example of components for SIM card connection  When connecting the module to an SIM connector, perform the following steps on the application board:  Bypass digital noise via a 100 nF capacitor (e.g. Murata GRM155R71C104K) on the SIM supply (VSIM)  To prevent RF coupling in case the module RF antenna is placed closer than 10 - 30 cm from the SIM card holder, connect a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J)  at each SIM signal (VSIM, SIM_CLK, SIM_IO, SIM_RST) to ground near the SIM connector  Mount  very  low  capacitance  (i.e.  less  than  10  pF)  ESD  protection  (e.g.  Infineon  ESD8V0L2B-03L  or  AVX USB0002) near the SIM card connector  Limit capacitance and series resistance on each SIM signal to match the requirements for the SIM interface (27.7 ns is the maximum allowed rise time on the SIM_CLK line, 1.0 µs is the maximum allowed rise time on the SIM_IO and SIM_RST lines): always route the connections to keep them as short as possible  1.8.1 (U)SIM functionality The following SIM services are supported:  Abbreviated Dialing Numbers (ADN)  Fixed Dialing Numbers (FDN)  Last Dialed Numbers (LDN)  Service Dialing Numbers (SDN)  USIM Application Toolkit (USAT) R99 is supported.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 46 of 160 1.9 Serial communication LISA-U series modules provide the following serial communication interfaces where AT command interface and Packet-Switched / Circuit-Switched Data communication are concurrently available:  One  asynchronous  serial  interface  (UART)  that  provides  complete  RS-232  functionality  conforming  to ITU-T V.24  Recommendation [4],  with  limited  data  rate.  The  UART  interface  can  be  used  for  firmware upgrade  One  Inter  Processor  Communication  (IPC)  interface  that  includes  a  synchronous  SPI-compatible  interface, with maximum data rate of 26 Mb/s  One high-speed USB 2.0 compliant interface, with maximum data rate of 480 Mb/s. The single USB interface implements several logical devices. Each device is a USB communications device class (or USB CDC), that is a composite Universal Serial Bus device class. The USB interface can be used for firmware upgrade  The  LISA-U  series  modules  are  designed  to  operate  as  an  HSPA  wireless  modem,  which  represents  the  data circuit-terminating equipment (DCE) as described by the ITU-T V.24 Recommendation [4]. A customer application processor connected to the module through one of the interfaces represents the data terminal equipment (DTE).  All the interfaces listed above are controlled and operated with:  AT commands according to 3GPP TS 27.007 [5]  AT commands according to 3GPP TS 27.005 [6]  AT commands according to 3GPP TS 27.010 [7]  u-blox AT commands   For  the complete  list  of  supported AT  commands  and  their  syntax  refer  to the  u-blox  AT  Commands Manual [3].  The following serial communication interfaces can be used for firmware upgrade:  The UART interface, using the RxD and TxD lines only  The USB interface, using all the lines provided (VUSB_DET, USB_D+ and USB_D-)   To directly enable PC (or similar) connection to the module for firmware upgrade, provide direct access on the application board to the VUSB_DET, USB_D+ and USB_D- lines of the module (or to the RxD and  TxD  lines).  Also  provide  access  to  the  PWR_ON  or  the  RESET_N  pins,  or  enable  the  DC  supply connected  to  the  VCC  pin  to  start  the  module  firmware  upgrade  (see  Firmware  Update  Application Note [17]).  The following sub-chapters describe the serial interfaces configuration and provide a detailed description of each interface for the application circuits.  1.9.1 Serial interfaces configuration UART, USB and SPI/IPC serial interfaces are available as AT command interface and for Packet-Switched / Circuit-Switched  Data  communication.  The  serial  interfaces  are  configured  as  described  in  Table  22  (for  information about further settings, please refer to the u-blox AT Commands Manual [3]).
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 47 of 160 Interface AT Settings Comments UART interface Enabled Multiplexing mode can be enabled by AT+CMUX command providing following channels:  Channel 0: control channel  Channel 1 – 5: AT commands /data connection  Channel 6: GPS tunneling All LISA-U2 series modules versions except LISA-U200-00 provide an additional channel:  Channel 7: SIM Access Profile dedicated port AT+IPR=115200 Baud rate: 115200 b/s AT+ICF=3,1 Frame format: 8 bits, no parity, 1 stop bit AT&K3 HW flow control enabled AT&S1 DSR line set ON in data mode and set OFF in command mode AT&D1 Upon an ON-to-OFF transition of DTR, the DCE enters online command state and issues an OK result code AT&C1 Circuit 109 changes in accordance with the Carrier detect status; ON if the Carrier is detected, OFF otherwise USB interface Enabled 6 CDCs are available, configured as described in the following list:  USB1: AT commands / data connection  USB2: AT commands / data connection  USB3: AT commands / data connection  USB4: GPS tunneling dedicated port  USB5: 2G and BB trace dedicated port  USB6: 3G trace dedicated port  All LISA-U2 series modules versions except LISA-U200-00 provide an additional CDC:  USB7: SIM Access Profile dedicated port AT&K3 HW flow control enabled AT&S1 DSR line set ON in data mode and set OFF in command mode AT&D1 Upon an ON-to-OFF transition of DTR, the DCE enters online command state and issues an OK result code AT&C1 Circuit 109 changes in accordance with the Carrier detect status; ON if the Carrier is detected, OFF otherwise SPI interface Enabled Multiplexing mode can be enabled by AT+CMUX command providing following channels:  Channel 0: control channel  Channel 1 – 5: AT commands /data connection  Channel 6: GPS tunneling All LISA-U2 series modules versions except LISA-U200-00 provide an additional channel:  Channel 7: SIM Access Profile dedicated port AT&K3 HW flow control enabled AT&S1 DSR line set ON in data mode and set OFF in command mode AT&D1 Upon an ON-to-OFF transition of DTR, the DCE enters online command state and issues an OK result code AT&C1 Circuit 109 changes in accordance with the Carrier detect status; ON if the Carrier is detected, OFF otherwise Table 22: Default serial interfaces configuration  1.9.2 Asynchronous serial interface (UART) The UART interface is a 9-wire unbalanced asynchronous serial interface that provides AT commands interface, PSD and CSD data communication, firmware upgrade. UART  interface  provides  RS-232  functionality  conforming  to  the  ITU-T  V.24  Recommendation  (more  details available in ITU Recommendation [4]), with CMOS compatible signal levels: 0 V for low data bit or ON state, and 1.8 V for high data bit or OFF state. Two different external voltage translators (e.g. Maxim MAX3237E and Texas Instruments  SN74AVC8T245PW)  could  be  used  to  provide  full  RS-232  (9  lines)  compatible  signal  levels.  The Texas Instruments chip provides the translation from 1.8 V to 3.3 V, while the Maxim chip provides the necessary RS-232 compatible signal towards the external connector. If a UART interface with only  5 lines is needed, the Maxim 13234E voltage level translator can be used. This chip translates the voltage levels from 1.8 V (module
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 48 of 160 side)  to  the  RS-232  standard.  For  detailed  electrical  characteristics  refer  to  LISA-U1  series  Data  Sheet [1]  and LISA-U2 series Data Sheet [2]. The  LISA-U  series  modules  are  designed  to  operate  as  an  HSPA  wireless  modem,  which  represents  the  data circuit-terminating equipment (DCE) as described by the ITU-T V.24 Recommendation [4]. A customer application processor connected to the module through the UART interface represents the data terminal equipment (DTE).   The  signal  names  of  the  LISA-U  series  modules  UART  interface  conform  to  the  ITU-T  V.24 Recommendation [4].  UART interfaces include the following lines:  Name Description Remarks DSR Data set ready Module output Circuit 107 (Data set ready) in ITU-T V.24 RI Ring Indicator Module output Circuit 125 (Calling indicator) in ITU-T V.24 DCD Data carrier detect Module output Circuit 109 (Data channel received line signal detector) in ITU-T V.24 DTR Data terminal ready Module input Circuit 108/2 (Data terminal ready) in ITU-T V.24 Internal active pull-up to V_INT (1.8 V) enabled. RTS Ready to send Module hardware flow control input Circuit 105 (Request to send) in ITU-T V.24  Internal active pull-up to V_INT (1.8 V) enabled. CTS Clear to send Module hardware flow control output  Circuit 106 (Ready for sending) in ITU-T V.24 TxD Transmitted data Module data input Circuit 103 (Transmitted data) in ITU-T V.24 Internal active pull-up to V_INT (1.8 V) enabled. RxD Received data Module data output Circuit 104 (Received data) in ITU-T V.24 GND Ground  Table 23: UART interface signals   The UART interface pins ESD sensitivity rating is 1 kV (Human Body Model according to JESD22-A114F). Higher protection level could be required if the lines are externally accessible on the application board. Higher protection level can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the lines connected to these pins, close to accessible points.  1.9.2.1 UART features All flow control handshakes are supported by the UART interface and can be set by appropriate AT commands (see u-blox AT Commands Manual [3], &K, +IFC, \Q AT commands): hardware flow control (RTS/CTS), software flow control (XON/XOFF), or none flow control.   Hardware flow control is enabled by default.  The following baud rates can be configured using AT commands:  1200 b/s  2400 b/s
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 49 of 160  4800 b/s  9600 b/s  19200 b/s  38400 b/s  57600 b/s  115200 b/s  230400 b/s  460800 b/s The default baud rate is 115200 b/s. Autobauding is not supported.  The frame format can be:  8N1 (8 data bits, No parity, 1 stop bit)  8E1 (8 data bits, even parity, 1 stop bit)  8O1 (8 data bits, odd parity, 1 stop bit)  8N2 (8 data bits, No parity, 2 stop bits)  7E1 (7 data bits, even parity, 1 stop bit)  7O1 (7 data bits, odd parity, 1 stop bit) The default frame configuration with fixed baud rate is 8N1, described in the Figure 22. D0 D1 D2 D3 D4 D5 D6 D7Start of 1-BytetransferStart Bit(Always 0)Possible Start ofnext transferStop Bit(Always 1)tbit = 1/(Baudrate)Normal Transfer, 8N1 Figure 22: UART default frame format (8N1) description  1.9.2.2 UART signal behavior (AT commands interface case) See Table 5 for a description of operating modes and states referred to in this section. At the switch on of the  module, before the initialization of the  UART interface, as described in the  power-on sequence reported in the Figure 18, each pin is first tri-stated and then is set to its relative internal reset state that is reported in the pin description table in LISA-U1 series Data Sheet [1] and LISA-U2 series Data Sheet [2]. At the end of the boot sequence, the UART interface is initialized, the module is by default in active mode and the UART interface is enabled. The configuration and the behavior of the UART signals after the boot sequence are described below.   For  a  complete  description  of  data  and  command  mode  please  refer  to  u-blox  AT  Commands Manual [3].
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 50 of 160 RxD signal behavior The module data output line (RxD) is set by default to OFF state (high level) at UART initialization. The module holds RxD in OFF state until no data is transmitted by the module.  TxD signal behavior The module data input line (TxD) is set by default to OFF state (high level) at UART initialization. The TxD line is then held  by the  module  in the  OFF state  if the  line is  not activated  by the  DTE:  an active  pull-up  is enabled inside the module on the TxD input.  CTS signal behavior The module hardware flow control output (CTS line) is set to the ON state (low level) at UART initialization. If the hardware flow control is enabled (for more details please refer to u-blox AT Commands Manual [3], AT&K, AT\Q, AT+IFC AT command) the CTS line indicates when the UART interface is enabled (data can be sent and received): the module drives the CTS line to the ON state or to the OFF state when it is either able or not able to accept data from the DTE (refer to chapter 1.9.2.3 for the complete description). If the hardware flow control is not enabled, the CTS line is always held in the ON state after UART initialization.  In case of hardware flow control enabled, when CTS line is ON the UART is enabled and the module is in active mode. Instead,  CTS line to OFF doesn’t necessary mean that the module is in idle-mode, but only that the UART is not enabled (the module could be forced to stay in active-mode for instance by USB).  When the power saving configuration is enabled and the hardware flow-control is not implemented in the DTE/DCE connection, data sent by the DTE can be lost: the first character sent when the module is in idle-mode  won’t  be  a  valid  communication  character  (refer  to  chapter  1.9.2.3  for  the  complete description).  When the MUX protocol is active on UART interface, the CTS line state is mapped to FCon / FCoff MUX command for flow control issues outside the power saving configuration while the physical  CTS line is still used as a power state  indicator. For  more details  please refer to  Mux  Implementation  Application Note [15].  RTS signal behavior The hardware flow control input (RTS line) is set by default to the OFF state (high level) at UART initialization. The RTS line is then held by the module in the OFF state if the line is not activated by the DTE: an active pull-up is enabled inside the module on the RTS input. If the HW flow control is enabled (for more details please refer to u-blox AT Commands Manual [3] AT&K, AT\Q, AT+IFC command description) the  RTS line is monitored by the module  to detect permission from the  DTE to send data to the DTE itself. If the RTS line is set to OFF state, any on-going data transmission from the module is immediately interrupted or any subsequent transmission forbidden until the RTS line changes to ON state.   The DTE must be able to still accept a certain number of characters  after the RTS line has been set to OFF  state:  the  module  guarantees  the  transmission  interruption  within  2  characters  from  RTS  state change.  If AT+UPSV=2 is set and HW flow control is disabled, the RTS line is monitored by the module to manage the power saving configuration:  When an OFF-to-ON transition occurs on the RTS input line, the UART is enabled and the module is forced to active-mode; after 20 ms from the transition the switch is completed and data can be received without loss. The module can’t enter idle-mode and the UART is keep enabled as long as the RTS input line is held in the ON state
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 51 of 160  If RTS is set to OFF state by the DTE, the module automatically enters idle-mode whenever possible as in the AT+UPSV=1 configuration (cyclic idle/active mode), but UART is disabled (held in low power mode) For more details please refer to chapter 1.9.2.3 and u-blox AT Commands Manual [3], AT+UPSV command.  DSR signal behavior If AT&S0 is set, the DSR module output line is set by default to ON state (low level) at UART initialization and is then always held in the ON state. If AT&S1 is set, the DSR module output line is set by default to OFF state (high level) at UART initialization. The DSR line is then set to the OFF state when the module is in command mode or in online command mode and is set to the ON state when the module is in data mode.   The above behavior is valid for both Packet-Switched and Circuit-Switched Data transfer.  DTR signal behavior The DTR module input line is set by default to OFF state (high level) at UART initialization. The  DTR line is then held by the module in the OFF state if the line is not activated by the DTE: an active pull-up is enabled inside the module  on  the  DTR  input.  Module  behavior  according  to  DTR  status  depends  on  the  AT  command configuration (see u-blox AT Commands Manual [3], &D AT command).  DCD signal behavior If AT&C0 is set, the DCD module output line is set by default to ON state (low level) at UART initialization and is then always held in the ON state. If AT&C1 is set, the DCD module output line is set by default to OFF state (high level) at UART initialization. The DCD line is then set by the module in accordance with the carrier detect status: ON if the carrier is detected, OFF otherwise. In case of voice call DCD is set to ON state when the call is established. For a data call there are the following scenarios:   GPRS  data  communication:  Before  activating  the  PPP  protocol  (data  mode)  a  dial-up  application  must provide the ATD*99***<context_number># to the module: with this command the module switches from command mode to data mode and can accept PPP packets. The module sets the DCD line to the ON state, then  answers  with  a  CONNECT  to  confirm  the  ATD*99  command.  Please  note  that  the  DCD  ON  is  not related to the context activation but with the data mode  CSD data call: To establish a data call the DTE can send the ATD<number> command to the module which sets  an  outgoing  data  call  to  a  remote  modem  (or  another  data  module).  Data  can  be  transparent  (non reliable) or non transparent (with the reliable RLP protocol). When the remote DCE accepts the data call, the module  DCD  line  is  set  to  ON  and  the  CONNECT  <communication  baudrate>  string  is  returned  by  the module. At this stage the DTE can send characters through the serial line to the data module which sends them through the network to the remote DCE attached to a remote DTE   In case of a voice call DCD is set to ON state on all the serial communication interfaces supporting the AT command interface. (including MUX virtual channels, if active).  DCD  is  set  to  ON  during  the  execution  of  a  command  requiring  input  data  from  the  DTE  (all  the commands  where  a  prompt  is  issued;  see  AT  commands  +CMGS,  +CMGW,  +USOWR,  +USODL, +UDWNFILE in u-blox AT Commands Manual [3]). The DCD line is set to ON state as soon as the switch to binary/text input mode is completed and the prompt is issued; DCD line is set to OFF as soon as the input mode is interrupted or completed.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 52 of 160  DCD line is kept to ON state even during the online command state to indicate that the data call is still established even if suspended, while if the module enters command mode DSR line is set to OFF state. For more details refer to DSR signal behavior description.  In case of scenarios for which the DCD line setting is requested for different reasons (e.g. SMS texting during  online  command  state),  the  DCD  line  changes  to  guarantee  the  correct  behavior  for  all  the scenarios. For instance, in case of SMS texting in online command state, if the data call is released, the DCD line will be kept to ON till the SMS command execution is completed (even if the data call release would request the DCD setting to OFF).  RI signal behavior The RI module output line is set by default to the OFF state (high level) at UART initialization. Then, during an incoming call, the RI line is switched from OFF state to ON state with a 4:1 duty cycle and a 5 s period (ON for 1 s,  OFF  for  4  s, see  Figure  23), until  the  DTE attached  to  the  module  sends  the  ATA string  and the  module accepts  the incoming  data  call. The RING  string  sent by  the module (DCE) to  the serial  port at constant time intervals is not correlated with the switch of the RI line to the ON state.   Figure 23: RI behavior during an incoming call The RI line can notify an SMS arrival. When the SMS arrives, the  RI line switches from OFF to ON for 1 s (see Figure  24),  if  the  feature  is  enabled  by  the  proper  AT  command  (please  refer  to  u-blox  AT  Commands Manual [3], AT+CNMI command).  Figure 24: RI behavior at SMS arrival This behavior allows the DTE to stay in power saving mode until the DCE related event requests service. In case of SMS arrival, if several events occur coincidently or in quick succession each event triggers the RI line independently, although the line will not be deactivated between each event. As a result, the RI line may stay to ON for more than 1 s. If an incoming call is answered within less than 1 s (with ATA or if autoanswering is set to ATS0=1) than the RI line will be set to OFF earlier. As a result:  RI line monitoring can’t be used by the DTE to determine the number of received SMSes. SMS arrives time [s] 0 RI ON RI OFF 1s SMS  time [s] 0 RI ON RI OFF 1s 1stime [s]151050RI ONRI OFFCall incomes1stime [s]151050RI ONRI OFFCall incomes
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 53 of 160  In case of multiple events (incoming call plus SMS received), the RI line can’t be used to discriminate the two events, but the  DTE must rely  on the subsequent  URCs and  interrogate the DCE with the proper commands.  1.9.2.3 UART and power-saving The  power  saving  configuration  is controlled  by  the  AT+UPSV  command  (for  the complete  description  please refer  to  u-blox  AT  Commands  Manual  [3],  AT+UPSV  command).  When  power  saving  is  enabled,  the  module automatically enters idle-mode whenever possible, otherwise the active-mode is maintained by the module. The AT+UPSV  command  sets  the  module  power  saving  configuration,  but  also  configures  the  UART  behavior  in relation to the power saving configuration. The conditions for the  module entering idle-mode also depend on the UART power saving configuration. The  different  power  saving  configurations  that  can  be  set  by  the  AT+UPSV  command  are  described  in  the following  subchapters  and  are  summarized  in  Table  24. For  more  details  on the  command  description  please refer to u-blox AT commands Manual [3].  AT+UPSV HW flow control RTS line Communication during idle-mode and wake up  0 Enabled (AT&K3) ON Data sent by the DTE will be correctly received by the module. 0 Enabled (AT&K3) OFF Data sent by the module will be buffered by the module and will be correctly received by the DTE when it will be ready to receive data (i.e. RTS line will be ON). 0 Disabled (AT&K0) ON Data sent by the DTE will be correctly received by the module. 0 Disabled (AT&K0) OFF Data sent by the module will be correctly received by the DTE if it is ready to receive data, otherwise data will be lost. 1 Enabled (AT&K3) ON Data  sent  by  the  DTE  will  be  buffered  by  the  DTE  and  will  be  correctly  received  by  the module when active-mode is entered. 1 Enabled (AT&K3) OFF Data sent by the module will be buffered by the module and will be correctly received by the DTE when it is ready to receive data (i.e. RTS line will be ON). 1 Disabled (AT&K0) ON If the module is in idle-mode, when a low-to-high transition occurs on the TxD input line, the module switches from idle-mode to active-mode after 20 ms: this is the “wake up time” of the module. As a consequence, the first character sent when the module is in idle-mode (i.e. the wake up character) won’t be a valid communication character because it can’t be recognized, and the recognition of the subsequent characters is guaranteed only after the complete wake-up (i.e. after 20 ms). 1 Disabled (AT&K0) OFF Data sent by the module will be correctly received by the DTE if it is ready to receive data, otherwise data will be lost. 2 Enabled (AT&K3) ON Not Applicable: HW flow control cannot be enabled with AT+UPSV=2. 2 Enabled (AT&K3) OFF Not Applicable: HW flow control cannot be enabled with AT+UPSV=2. 2 Disabled (AT&K0) ON The module is forced in active-mode and it can’t enter idle-mode until RTS line is set to OFF state. When a high-to-low (i.e. OFF-to-ON) transition occurs on the RTS input line, the module switches from idle-mode to active-mode after 20 ms: this is the “wake up time” of the module. 2 Disabled (AT&K0) OFF When a low-to-high transition occurs on the TxD input line, the UART is re-enabled and if the module was in idle-mode it switches from idle-mode to active-mode after 20 ms: this is the “wake up  time” of the  module.  As  a  consequence, the first character sent when the module  is  in  idle-mode  (i.e.  the  wake  up  character)  won’t  be  a  valid  communication character because it can’t be recognized, and the recognition of the subsequent characters is guaranteed only after the complete wake-up (i.e. after 20 ms). Table 24: UART and power-saving summary  AT+UPSV=0: power saving disabled, fixed active-mode The module doesn’t enter idle-mode and the UART interface is enabled (data can be sent and received): the CTS line is always held in the ON state after UART initialization. This is the default configuration.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 54 of 160 AT+UPSV=1: power saving enabled, cyclic idle/active mode The module automatically enters idle-mode whenever possible, if a voice or data call (2G or 3G) is not enabled, and periodically wakes up  from  idle-mode  to active-mode  to monitor the  paging channel of  the current base station (paging block reception), according to 2G or 3G discontinuous reception (DRX) specification. The time period between two paging receptions is defined by the current base station (i.e. by the network):  If the module is registered with a 2G network, the paging reception period can vary from ~0.47 s (DRX = 2, i.e. 2 x 51 2G-frames) up to ~2.12 s (DRX = 9, i.e. 9 x 51 2G-frames)  If the module is registered with a 3G network, the paging reception period can vary from 0.64 s (DRX = 6, i.e. 26 3G-frames) up to 5.12 s (DRX = 9, i.e. 29 3G-frames).  The  UART interface  is automatically  disabled  whenever  possible,  if data  has not  been  received  or  sent  by the UART  for  the  timeout  configured  by  the  +UPSV  AT  command,  and  is  periodically  enabled  to  receive  or  send data.  When  the  module  is  in  idle-mode,  the  UART  interface  is  always  disabled.  When  the  module  is  in active-mode or connected-mode, the UART interface is automatically disabled to reduce the consumed power, if data has not been received or sent by the UART for the configured timeout. The time period of the UART enable/disable cycle is configured differently when the module is registered with a 2G network compared to when the module is registered with a 3G network:  2G: the UART is enabled synchronously to paging receptions, but not necessarily at every paging reception (to  reduce  the  consumed  power):  the  UART  interface  is  enabled  for  20  ms  concurrently  to  a  paging reception,  and  then,  as  data  has  not  been  received  or  sent,  the  UART  is  disabled  until  the  first  paging reception that occurs after a timeout of 2.0 s, and therefore the interface is enabled again  3G: the UART is enabled asynchronously to paging receptions: the UART interface is enabled for 20 ms, and then, as data has not been received or sent, the UART is disabled for 2.5 s, and afterwards the interface is enabled again  Not registered: when the module is not registered with a network, the UART interface is enabled for 20 ms, and then, if data has not been received or sent, the UART is disabled for 2.5 s, and afterwards the interface is enabled again  When UART interface is disabled, data transmitted by the DTE will be lost if hardware flow control is disabled. If hardware flow control is enabled, data will be buffered by the DTE and will be correctly received by the module when UART interface is enabled again. When UART interface is enabled, data can be received. When a character is received, it forces the UART interface to stay enabled for a longer time and it forces the module to stay in the active-mode for a longer time. The active-mode duration depends by:  Network parameters, related to the time interval for the paging block reception (minimum of ~11 ms)  Duration of UART enable time in absence of data reception (20 ms)  Time period from the last data received at the serial port during the active-mode: the module doesn’t enter idle-mode  until  a  timeout  expires.  This  timeout  is  configured  by  the  second  parameter  of  the  +UPSV  AT command, from 40 2G-frames (i.e. 40 x 4.615 ms = 184 ms) up to 65000 2G-frames (i.e. 65000 x 4.615 ms = 300 s). Default value is 2000 2G-frames (i.e. 2000 x 4.615 ms = 9.2 s) Every subsequent character received during the active-mode, resets and restarts the timer; hence the active-mode duration can be extended indefinitely.  The hardware flow-control output (CTS line) indicates when the UART interface is enabled (data can be sent and received), if HW flow control is enabled, as illustrated in Figure 25.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 55 of 160 time [s]CTS ONCTS OFFUART disabled2G/3G: 20 msUART enabled2G/3G: ~9.2 s (default)UART enabledData input2G: 2.10-3.75 s3G: 2.50 s Figure 25: CTS behavior with power saving enabled (AT+UPSV=1) and HW flow control enabled: the CTS output line indicates when the UART interface of the module is enabled (CTS = ON = low level) or disabled (CTS = OFF = high level)  AT+UPSV=2: power saving enabled and controlled by the RTS line If the RTS line is set to OFF by the DTE the module is allowed to enter idle-mode as for UPSV=1 case. Instead, the UART is disabled as long as RTS line is set to OFF. If  the  RTS  line  is  set  to  ON  by  the  DTE  the  module  is  not  allowed to  enter  idle-mode  and  the  UART  is  kept enabled until the RTS line is set to OFF. When an OFF-to-ON transition occurs on the  RTS input line, the UART is re-enabled and the module switches from  idle-mode  to  active-mode  in  20  ms.  This  configuration  can  only  be  enabled  with  the  module  HW  flow control disabled.  Since HW flow control is disabled, the CTS line is always set to ON by the module.  When the RTS line is set to OFF by the DTE, the timeout to enter idle-mode from the last data received at the serial port during the active-mode is the one previously set with the AT+UPSV=1 configuration or it is the default value.  If the module must transmit some data (e.g. URC), the UART is temporarily enabled even if the RTS line is  set  to  OFF;  UART  wake-up  in  case  of  RTS  line  set  to  OFF  is  also  possible  via  data  reception  (as described in the following).  If the USB is connected and active, the module is forced to stay in active-mode, therefore +UPSV=1 and +UPSV=2 modes are overruled, but in any case they have effect on the UART behavior (they configure UART power saving mode, when it is enabled/disabled).  Wake up from idle-mode to active-mode via data reception If  data  is  transmitted  by  the  DTE  during  the  module  idle-mode,  it  will  be  lost  (not  correctly  received  by  the module) in the following cases:  +UPSV=1 with hardware flow control disabled  +UPSV=2 with hardware flow control disabled and RTS line set to OFF When the module is in idle-mode, the TxD input line of the module is always configured to wake up the module from idle-mode to active-mode via data reception: when a low-to-high transition occurs on the TxD input line, it causes the wake-up of the system. The module switches from idle-mode to active-mode within 20 ms from the first data reception: this is the “wake up time” of the module. As a consequence, the first character sent when the module  is  in idle-mode  (i.e. the wake  up  character)  won’t be a  valid communication character  because it can’t  be  recognized,  and  the  recognition of  the  subsequent  characters  is guaranteed  only after  the  complete wake-up (i.e. after 20 ms). Figure 26 and Figure 27 show an example of common scenarios and timing constraints:  HW  flow  control  set  in  the  DCE,  and  no  HW  flow  control  set  in  the  DTE,  needed  to  see  the  CTS  line changing on DCE
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 56 of 160  Power saving configuration is active and the timeout from last data received to idle-mode start is set to 2000 frames (AT+UPSV=1,2000)  Figure 26 shows the case where DCE is in idle-mode and a wake-up is forced. In this scenario the only character sent by the DTE is the wake-up character; as a consequence, the DCE will return to idle-mode when the timeout from last data received expires. (2000 frames without data reception). CTS OFFCTS ONActive mode is held for 2000 GSM frames (~9.2 s)time Wake up time: up to 15.6 mstime TxD module inputWake up character        Not recognized by DCE Figure 26: Wake-up via data reception without further communication Figure  27  shows the  case  where  in addition to  the wake-up  character  further  (valid)  characters  are  sent.  The wake up character wakes-up the DCE. The other characters must be sent after the “wake up time” of 20 ms. If this condition is satisfied, the characters are recognized by the DCE. The DCE is allowed to re-enter idle-mode after 2000 GSM frames from the latest data reception. CTS OFFCTS ONActive mode is held for 2000 GSM frames (~9.2s) after the last data receivedtime Wake up time: up to 15.6 mstime TxD module inputWake up character        Not recognized by DCEValid characters          Recognized by DCE Figure 27: Wake-up via data reception with further communication  LISA-U2 series modules don’t wake-up from idle-mode to active-mode via data reception by TxD input line, if HW flow control is enabled.  The “wake-up via data reception” feature can’t be disabled.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 57 of 160  The “wake-up via data reception” feature can be used in both +UPSV=1 and +UPSV=2 case (when RTS line is set to OFF).  In command  mode, if  HW  flow  control  is not  implemented  by  the DTE,  the  DTE must  always  send  a dummy  “AT”  to the  module  before each  command  line:  the first  character will not be  ignored if  the module is in active-mode (i.e. the module will reply “OK”), or it will represent the wake up character if the module is in idle-mode (i.e. the module won’t reply).  No dummy “AT” is required from the DTE during connected-mode since the module continues to be in active-mode and doesn’t need to be woken-up. Furthermore in data mode a dummy “AT” would affect the data communication.  1.9.2.4 UART application circuits Providing the full RS-232 functionality (using the complete V.24 link) For complete RS-232 functionality conforming to ITU Recommendation [4] in DTE/DCE serial communication, the complete UART interface of the module (DCE) must be connected to a 1.8V DTE as described in Figure 28.  TxDApplication Processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDLISA-U series (DCE)15 TXD12 DTR16 RXD13 RTS14 CTS9DSR10 RI11 DCDGND0 Ω0 ΩTPTP0 Ω0 ΩTPTP Figure 28: UART interface application circuit with complete V.24 link in DTE/DCE serial communication (1.8V DTE)
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 58 of 160 If a 3.0 V Application Processor is used, appropriate voltage translators must be utilized, as described in Figure 29.  4V_INTTxDApplication Processor(3.0V DTE)RxDRTSCTSDTRDSRRIDCDGNDLISA-U series (DCE)15 TXD12 DTR16 RXD13 RTS14 CTS9DSR10 RI11 DCDGND0 Ω0 ΩTPTP0 Ω0 ΩTPTP1V8B1 A1GNDU1B3A3VCCBVCCAUnidirectionalVoltage TranslatorC1 C23V0DIR3DIR2 OEDIR1VCCB2 A2B4A4DIR41V8B1 A1GNDU2B3A3VCCBVCCAUnidirectionalVoltage TranslatorC3 C43V0DIR1DIR3 OEB2 A2B4A4DIR4DIR2 Figure 29: UART interface application circuit with complete V.24 link in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2, C3, C4 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1, U2 Unidirectional Voltage Translator SN74AVC4T774 - Texas Instruments Table 25: Component for UART application circuit with complete V.24 link in DTE/DCE serial communication (3.0 V DTE)
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 59 of 160 Providing the TxD, RxD, RTS and CTS lines only (not using the complete V.24 link) If the  functionality of  the  DSR, DCD,  RI and  DTR lines  is not  required in the  application, or  the lines are  not available, the circuit with a 1.8 V Application Processor should be implemented as described in Figure 30:  Connect the module DTR input line to GND, since the module requires DTR active (low electrical level)  Leave DSR, DCD and RI lines of the module unconnected and floating  TxDApplication Processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDLISA-U series (DCE)15 TXD12 DTR16 RXD13 RTS14 CTS9DSR10 RI11 DCDGND0 Ω0 ΩTPTP0 Ω0 ΩTPTP Figure 30: UART interface application circuit with partial V.24 link (5-wire) in the DTE/DCE serial communication (1.8V DTE) If a 3.0 V Application Processor is used, proper voltage translator must be utilized, as described in Figure 31. 4V_INTTxDApplication Processor(3.0V DTE)RxDRTSCTSDTRDSRRIDCDGNDLISA-U series (DCE)15 TXD12 DTR16 RXD13 RTS14 CTS9DSR10 RI11 DCDGND0 Ω0 ΩTPTP0 Ω0 ΩTPTP1V8B1 A1GNDU1B3A3VCCBVCCAUnidirectionalVoltage TranslatorC1 C23V0DIR3DIR2 OEDIR1VCCB2 A2B4A4DIR4 Figure 31: UART interface application circuit with partial V.24 link (5-wire) in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1 Unidirectional Voltage Translator SN74AVC4T774 - Texas Instruments Table 26: Component for UART application circuit with partial V.24 link (5-wire) in DTE/DCE serial communication (3.0 V DTE)  If only TxD, RxD, RTS and CTS lines are provided, as implemented in Figure 30 and in Figure 31, the procedure to enable power saving depends on the HW flow-control status. If HW flow-control is enabled (AT&K3, that is
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 60 of 160 the default setting) power saving will be activated by AT+UPSV=1. Through this configuration, when the module is in idle-mode, data transmitted by the DTE will be buffered by the  DTE and will be correctly received by the module when active-mode is entered. If the HW flow-control is disabled (AT&K0), the power saving can be enabled by AT+UPSV=2. The module is in idle-mode  until  a  high-to-low  (i.e.  OFF-to-ON)  transition  on  the  RTS  input  line  will  switch  the  module  from idle-mode to active-mode in 20 ms. The module will be forced in active-mode if the RTS input line is held in the ON state.  Providing the TxD and RxD lines only (not using the complete V24 link) If the functionality of the CTS, RTS, DSR, DCD, RI and DTR lines is not required in the application, or the lines are not available, the circuit with a 1.8 V Application Processor should be implemented as described in Figure 32:  Connect the module  CTS output line to  the module  RTS input  line, since  the module requires RTS active (low electrical level) if HW flow-control is enabled (AT&K3, that is the default setting), and CTS is active (low electrical level) when the module is in active mode, the UART interface is enabled and the HW flow-control is enabled  Connect the module DTR input line to GND, since the module requires DTR active (low electrical level)  Leave DSR, DCD and RI lines of the module unconnected and floating  TxDApplication Processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDLISA-U series (DCE)15 TXD12 DTR16 RXD13 RTS14 CTS9DSR10 RI11 DCDGND0 Ω0 ΩTPTP0 ΩTPTP Figure 32: UART interface application circuit with partial V.24 link (3-wire) in the DTE/DCE serial communication (1.8V DTE)
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 61 of 160 If a 3.0 V Application Processor is used, proper voltage translator must be utilized, as described in Figure 33. 4V_INTTxDApplication Processor(3.0V DTE)RxDDTRDSRRIDCDGNDLISA-U series (DCE)15 TXD12 DTR16 RXD9DSR10 RI11 DCDGND0 Ω0 ΩTPTP1V8B1 A1GNDU1VCCBVCCAUnidirectionalVoltage TranslatorC1 C23V0DIR1DIR2 OEVCCB2 A2RTSCTS13 RTS14 CTS0 ΩTPTP Figure 33: UART interface application circuit with partial V.24 link (3-wire) in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1 Unidirectional Voltage Translator SN74AVC2T245 - Texas Instruments Table 27: Component for UART application circuit with partial V.24 link (3-wire) in DTE/DCE serial communication (3.0 V DTE)  If  only  TxD  and  RxD  lines  are  provided,  as  described  in  Figure  32  and  in  Figure  33,  and  HW  flow-control  is disabled (AT&K0), the power saving will be enabled by AT+UPSV=1. The module enters active-mode 20 ms after a low-to-high transition on the TxD input line, and the recognition of the subsequent characters is guaranteed until the module is in active-mode.  Data delivered by the DTE can be lost using this configuration and the following settings: o HW flow-control enabled in the module (AT&K3, that is the default setting) o Module power saving enabled by AT+UPSV=1 o HW flow-control disabled in the DTE In this case the first character sent when the  module is  in idle-mode will be a  wake-up character and won’t be a valid communication character (refer to chapter 1.9.1.3 for the complete description).  If power saving is enabled the application circuit with the TxD and RxD lines only is not recommended. During  command  mode  the  DTE  must  send  to  the  module  a  wake-up  character  or  a  dummy  “AT” before each command line (refer to chapter 1.9.1.3 for the complete description), but during data mode the wake-up character or the dummy “AT” would affect the data communication.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 62 of 160 Additional considerations  If  the  module  USB  interface  is  connected  to  the  application  processor,  it  is  highly  recommended  to provide direct access to RxD, TxD, CTS and RTS lines of the module for execution of firmware upgrade over UART and for debug purpose: testpoints can be added on the lines to accommodate the access and a 0 Ω series resistor must be mounted on each line to detach the module pin from any other connected device.  Otherwise,  if  the  USB  interface  is  not  connected  to  the  application  processor,  it  is  highly recommended to provide direct access to VUSB_DET, USB_D+, USB_D- lines for execution of firmware upgrade over USB and for debug purpose. In both cases, provide as well access to RESET_N pin, or to the  PWR_ON  pin,  or  enable  the  DC  supply  connected  to  the  VCC  pin  to  start  the  module  firmware upgrade (see Firmware Update Application Note [17]).  If the UART interface is not used, all the UART interface pins can be left unconnected, but  it is highly recommended to provide direct access to the RxD, TxD, CTS and RTS lines for execution of firmware upgrade and for debug purpose.  Any external signal connected to the UART interface must be tri-stated when the module is in power-down mode, when the external reset is forced low and during the module power-on sequence (at least for 3 s after the start-up event), to avoid latch-up of circuits and allow a proper boot of the module. If the external signals connected to the wireless module cannot be tri-stated, insert a multi channel digital switch  (e.g.  Texas  Instruments  SN74CB3Q16244,  TS5A3159,  or  TS5A63157)  between  the  two-circuit connections and set to high impedance during module power down mode, when external reset is forced low and during power-on sequence.  1.9.3 USB interface LISA-U series modules provide a high-speed USB interface at 480 Mb/s compliant with the Universal Serial Bus Revision 2.0 specification [8]. It acts as a USB device and can be connected to any USB host such as a PC or other Application Processor. The  USB-device  shall  look  for  all  upper-SW-layers  like  any  other  serial  device.  This  means  that  LISA-U  series modules emulate all serial control logical lines.  If  the  logical  DTR  line  isn't  enabled  by  the  USB  host,  the  LISA-U1xx-00  modules  don’t  answer  to  AT commands by the USB interface.  Name Description Remarks VUSB_DET USB detect input Apply 5 V typical to enable USB USB_D+ USB Data Line D+ 90 Ω nominal differential impedance. Pull-up or pull-down resistors and external series resistors as required by the USB 2.0 high-speed specification [8] are part of the USB pad driver and need not be provided externally. USB_D- USB Data Line D- 90 Ω nominal differential impedance. Pull-up or pull-down resistors and external series resistors as required by the USB 2.0 high-speed specification [8] are part of the USB pad driver and need not be provided externally. Table 28: USB pins  The USB interface pins ESD sensitivity rating is 1 kV (Human Body Model according to JESD22-A114F). Higher protection level could be required if the lines are externally accessible on the application board. Higher protection level can be achieved by mounting a very low capacitance (i.e. less or equal to 1 pF) ESD protection (e.g.  Tyco Electronics PESD0402-140  ESD protection device)  on the  lines connected  to these pins, close to accessible points.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 63 of 160 1.9.3.1 USB features LISA-U series modules simultaneously support 6  USB CDC (Communications Device  Class)  that assure multiple functionalities to the USB physical interface. The 6 available CDCs are configured as described in the following list:   USB1: AT commands / data connection  USB2: AT commands / data connection  USB3: AT commands / data connection  USB4: GPS tunneling dedicated port  USB5: 2G and BB trace dedicated port  USB6: 3G trace dedicated port All LISA-U2 series modules versions except LISA-U200-00 provide an additional USB CDC:  USB7: SIM Access Profile dedicated port The user can concurrently use AT command interface on one CDC and Packet-Switched / Circuit-Switched Data communication on another CDC. All LISA-U2 series modules versions except LISA-U200-00 support audio over USB capabilities: Audio Device Class is implemented to provide an audio streaming interface, which transfers audio data over isochronous pipes. USB drivers for Windows XP, Windows Vista, Windows 7, Windows CE 6, Windows EC 7 and Windows Mobile 6.5 are available. LISA-U1 / LISA-U2 series modules are compatible with standard Linux/Android USB kernel drivers.  LISA-U series module identifies itself by its VID (Vendor ID) and PID (Product ID) combination, included in the USB device descriptor. VID and PID of LISA-U series modules are the following:  VID = 0x1546  PID = 0x1101 for LISA-U1 series  PID = 0x1102 for LISA-U2 series If the  USB interface  of LISA-U series  module  is connected to  the host  before  the  module switch  on, or  if the module  is  reset  with  the  USB  interface  connected  to  the  host,  the  VID  and  PID  are  automatically  updated runtime, after the USB detection. First, VID and PID are the following:  VID = 0x058B  PID = 0x0041 Then, after a time period (~5 s), VID and PID are updated to the following:  VID = 0x1546  PID = 0x1101 for LISA-U1 series  PID = 0x1102 for LISA-U2 series  1.9.3.2 USB and power saving If power saving is enabled by AT command (AT+UPSV=1 or AT+UPSV=2), the LISA-U series module automatically enters the USB suspended state when the device has observed no bus traffic for a specified period (refer to the Universal Serial Bus Revision 2.0 specification [8]). In suspended state, the module maintains any internal status as USB device, including its address and configuration. In addition, the module enters the suspended state when the hub port it is attached to is disabled: this is referred to as USB selective suspend. The module exits suspend mode when there is bus activity. LISA-U  series  module  is  capable  of  USB  remote  wake-up  signaling:  i.e.  may  request  the  host  to  exit  suspend mode or selective suspend by using electrical signaling to indicate remote wake-up. This notifies the host that it
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 64 of 160 should  resume  from  its  suspended  mode,  if  necessary,  and  service  the  external  event  that  triggered  the suspended USB device to signal the host. Remote wake-up is accomplished using electrical signaling described in the Universal Serial Bus Revision 2.0 specification [8]. When the USB enters suspended state, the average VCC module current consumption of LISA-U series module is ~400 µA higher then when the USB is not attached to a USB host. If power saving is disabled by AT+UPSV=0 and the LISA-U series module is attached to a USB host as USB device, is  configured  and  is  not  suspended,  the  average  VCC  module  current  consumption  in  fixed  active  mode  is increased to ~40 mA.  1.9.3.3 USB application circuit Since  the  module  acts  as  a  USB  device,  the  USB  supply  (5.0  V  typ.)  must  be  provided  to  VUSB_DET  by  the connected USB host. The USB interface is enabled only when a valid voltage as USB supply is detected by the VUSB_DET  input.  Neither  the  USB  interface,  nor  the  whole  module  is  supplied  by  the  VUSB_DET  input:  the VUSB_DET senses the USB supply voltage and absorbs few microamperes. The USB_D+ and USB_D- lines carry the USB serial data and signaling. The lines are used in single ended mode for relatively low speed signaling handshake, as well as in differential mode for fast signaling and data transfer. USB pull-up or pull-down resistors on pins USB_D+ and USB_D- as required by the Universal Serial Bus Revision 2.0 specification [8] are part of the USB pad driver and do not need to be externally provided. External  series  resistors  on  pins  USB_D+  and  USB_D-  as  required  by  the  Universal  Serial  Bus  Revision  2.0 specification [8] are also integrated: characteristic impedance of USB_D+ and USB_D- lines is specified by the USB  standard.  The  most  important  parameter  is  the  differential  characteristic  impedance  applicable  for odd-mode electromagnetic field, which should be as close as possible to 90  differential: signal integrity may be degraded if the PCB layout is not optimal, especially when the USB signaling lines are very long.  LISA-U series VBUSD+D-GND18 VUSB_DET27 USB_D+26 USB_D-GNDC1USB DEVICE CONNECTORD1 D2 D3 Figure 34: USB Interface application circuit Reference Description Part Number - Manufacturer D1, D2, D3 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics  C2 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata Table 29: Component for USB application circuit   If the USB interface is not connected to the application processor, it is highly recommended to provide direct  access  to the  VUSB_DET,  USB_D+,  USB_D-  lines  for execution  of  firmware  upgrade  over USB and for debug purpose: testpoints can be added on the lines to accommodate the access. Otherwise, if the USB interface is connected to the application processor, it is highly recommended to provide direct access to the RxD, TxD, CTS and RTS lines for execution of firmware upgrade over UART and for debug purpose. In both cases, provide as well access to RESET_N pin, or to the PWR_ON pin, or enable the
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 65 of 160 DC  supply  connected  to  the  VCC  pin  to  start  the  module  firmware  upgrade  (see  Firmware  Update Application Note [17]).  If the USB interface is not  used, the  USB_D+, USB_D-  and VUSB_DET pins can be left unconnected, but it is highly recommended to provide direct access to the lines for execution of firmware upgrade and for debug purpose.  1.9.4 SPI interface SPI is a master-slave protocol: the module runs as an SPI slave, i.e. it accepts AT commands on its SPI interface without specific configuration. The SPI-compatible synchronous serial interface cannot be used for FW upgrade. The standard 3-wire SPI interface includes two signals to transmit and receive data (SPI_MOSI and SPI_MISO) and a clock signal (SPI_SCLK). LISA-U series modules provide two handshake signals (SPI_MRDY and SPI_SRDY), added to the standard 3-wire SPI interface, implementing the 5-wire Inter Processor Communication (IPC) interface. The  purpose  of  the  IPC  interface  is  to  achieve  high  speed  communication  (up  to  26  Mb/s)  between  two processors  following  the  same  IPC  specifications:  the  module  baseband  processor  and  an  external  processor. High speed communication  is possible only if both sides follow the same Inter Processor Communication (IPC) specifications.  Name Description Remarks SPI_MISO SPI Data Line. Master Input, Slave Output Module Output. Idle high. Shift data on rising clock edge (CPHA=1). Latch data on falling clock edge (CPHA=1). MSB is shifted first. SPI_MOSI SPI Data Line. Master Output, Slave Input Module Input. Idle high. Shift data on rising clock edge (CPHA=1). Latch data on falling clock edge (CPHA=1). MSB is shifted first. Internal active pull-up to V_INT (1.8 V) enabled. SPI_SCLK SPI Serial Clock. Master Output, Slave Input Module Input. Idle low (CPOL=0). Up to 26 MHz supported. Internal active pull-down to GND enabled. SPI_MRDY SPI Master Ready to transfer data control line. Master Output, Slave Input Module Input. Idle low. Internal active pull-down to GND enabled. SPI_SRDY SPI Slave Ready to transfer data control line. Master Input, Slave Output Module Output. Idle low. Table 30: SPI interface signals   The SPI interface  pins  ESD sensitivity  rating  is 1 kV  (Human Body Model according to  JESD22-A114F). Higher protection level could be required if the lines are externally accessible on the application board. Higher  protection  level  can  be  achieved  by  mounting  a  low  capacitance  (i.e.  less  than  10  pF)  ESD protection (e.g. AVX  USB0002  varistor array) on the  lines connected to these pins,  close to accessible points.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 66 of 160 1.9.4.1 IPC communication protocol overview The module runs as an SPI slave, i.e. it accepts AT commands on its SPI interface without specific configuration. The  SPI-device  shall  look  for  all  upper-SW-layers  like  any  other  serial  device.  This  means  that  LISA-U  series modules  emulate  all  serial  logical  lines:  the  transmission  and  the  reception  of  the  data  are  similar  to  an asynchronous device. Two  additional  signals  (SPI_MRDY  and  SPI_SRDY)  are  added  to  the  SPI  lines  to  communicate  the  state  of readiness of the two processors: they are used as handshake signals to implement the data flow. The function of the SPI_MRDY and SPI_SRDY signals is twofold:  For transmitting data the signal indicates to the data receiver that data is available to be transmitted  For receiving data the signal indicates to the transmitter that the receiver is ready to receive data Due to this setup it is possible  to  use  the control signals as interrupt lines waking up the receiving part  when data  is  available  for  transfer.  When  the  handshaking  has  taken  place,  the  transfer  occurs  just  as  if  it  were  a standard SPI interface without chip select functionality (i.e. one master - one slave setup). SPI_MRDY is used by the application processor (i.e. the master) to indicate to the module baseband processor (i.e.  the  slave)  that  it  is  ready  to  transmit  or  receive  (IPC  master  ready  signal),  and  can  also  be  used  by  the application processor to wake up the module baseband processor if it is in idle-mode. SPI_SRDY line is used by the module baseband processor (i.e. the slave) to indicate to the application processor (i.e. the master) that it is ready to transmit or receive (IPC slave ready signal), and can also be used by the module baseband processor to wake up the application processor if it is in hibernation. SPI_MRDYSPI_SRDYDATA_EXCHANGESPI_MOSISPI_MISOHeader  DataSPI_SCLK Figure 35: IPC Data Flow: SPI_MRDY and SPI_SRDY line usage combined with the SPI protocol For  the  correct  implementation  of  the  SPI  protocol,  the  frame  size  is  known  by  both  sides  before  a  packet transfer of each packet. The frame is composed by a header with fixed size (always 4 bytes) and a payload with variable length (must be a multiple of 4 bytes). The  same amount  of data  is  exchanged  in  both  directions  simultaneously.  Both  sides  set  their  readiness  lines (SPI_MRDY / SPI_SRDY) independently when they are ready to transfer data. For the correct transmission of the data the other side must wait for the activating interrupt to allow the transfer of the other side. The  master  starts  the  clock  shortly  after  SPI_MRDY  and  SPI_SRDY  are  set  to  active.  The  number  of  clock periods sent by the master is exactly that one of the frame-size to be transferred. The SPI_SRDY line will be set low after the master sets the clock line to idle state. The SPI_MRDY line is also set inactive after the clock line is set idle, but in case of a big transfer containing multiple packets, the SPI_MRDY line stays active.  1.9.4.2 IPC communication and power saving If power saving is enabled by AT command (AT+UPSV=1 or AT+UPSV=2), the LISA-U series module automatically enters idle-mode when the master indicates that it is not ready to transmit or receive by the  SPI_MRDY signal, or when the LISA-U series module itself doesn’t transfer data.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 67 of 160  1.9.4.3 IPC communication examples In the following, three IPC communication scenarios are described:  Slave initiated data transfer, with a sleeping master  Master initiated data transfer, with a sleeping slave  Slave ended data transfer  Slave initiated transfer with a sleeping master  Figure 36: Data transfer initiated by LISA-U series module (slave), with a sleeping application processor (master) When the master is sleeping (idle-mode), the following actions happen: 1. The slave indicates the master that is ready to send data by activating SPI_SRDY 2. When the master becomes ready to send, it signalizes this by activating SPI_MRDY 3. The master activates the clock and the two processors exchange the communication header and data 4. If the data  has been exchanged, the slave deactivates  SPI_SRDY to process the  received information. The master does not need to de-assert SPI_MRDY as it controls the SPI_SCLK 5. After the preparation, the slave activates again SPI_SRDY and wait for SPI_SCLK activation. When the clock is active, all the data is transferred without intervention. If there is more data to transfer (flag set in any of the headers), the process will repeat from step 3  Master initiated transfer with a sleeping slave  Figure 37: Data transfer initiated by application processor (master) with a sleeping LISA-U series module (slave) When the slave is sleeping (idle-mode), the following actions happen: 1. The Master wakes the slave by setting the SPI_MRDY line active 2. As soon as the slave is awake, it signals it by activating SPI_SRDY SPI_MRDY SPI_SRDY DATA EXCHG 1 2 4 5 Header Data Header 3 SPI_MRDY SPI_SRDY DATA EXCHG 2 4 5 Header Data Header 3 1
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 68 of 160 3. The master activates the clock and the two processors exchange the communication header and data 4. If the data  has been  exchanged, the slave deactivates  SPI_SRDY to process the  received information. The master does not need to de-assert SPI_MRDY as it controls the SPI_SCLK 5. After the preparation, the slave activates again SPI_SRDY and wait for SPI_SCLK activation. When the clock is active, all data is transferred without intervention. If there is more data to transfer (flag set in any of the headers), the process will repeat from step 3  Slave ended transfer  Figure 38: Data transfer terminated and then restarted by LISA-U series module (slave) Starting from the state where data transfer is ongoing, the following actions will happen: 1. In case of the last transfer, the master will lower its SPI_MRDY line. After the data-transfer is finished the line must be low. If the slave has already set its SPI_SRDY line, the master must raise its line to initiate the next transfer (slave-waking-procedure) 2. If the data has been exchanged, the slave will deactivate SPI_SRDY to process the received information. This is the normal behavior 3. The slave will indicate the master that is ready to send data by activating SPI_SRDY 4. When  the  master  is  ready  to  send,  it  will  signalize  this  by  activating  SPI_MRDY.  This  is  optional,  when SPI_MRDY is low before 5. The slave indicates immediately after a transfer termination that it is ready to start transmission again. In this case the slave will raise SPI_SRDY again. The SPI_MRDY line can be either high or low: the master has only to ensure that the SPI_SRDY change will be detected correctly via interrupt   For more details regarding IPC communication protocol please refer to SPI Application Note [18].  1.9.4.4 IPC application circuit SPI_MOSI is the data line input for the module since it runs as SPI slave: it  must be connected to the data line output (MOSI) of the application processor that runs as an SPI master. SPI_MISO is the data line output for the module since it runs as SPI slave: it must be connected to the data line input (MISO) of the application processor that runs as an SPI master. SPI_SCLK  is  the clock  input  for the  module  since  it  runs as  SPI  slave:  it  must  be  connected  to  the clock  line output (SCLK) of the application processor that runs as an SPI master. SPI_MRDY  is an  input for the  module able  to detect an external interrupt which  comes  from the  application processor. SPI_SRDY  is  an  output  for  the  module,  and  the  application  processor  should  be  able  to  detect  an  external interrupt which comes from the module on its connected pin. Signal integrity of the high speed data lines may be degraded if the PCB layout is not optimal, especially when the SPI lines are very long: keep routing short and minimize parasitic capacitance to preserve signal integrity. SPI_MRDY SPI_SRDY DATA EXCHG 5 2 1 Header Data 3 4
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 69 of 160  LISA-U series(SPI slave)MOSIApplication Processor(SPI master)MISOSCLKInterruptGPIOGND56 SPI_MOSI59 SPI_MRDY57 SPI_MISO55 SPI_SCLK58 SPI_SRDYGND Figure 39: IPC Interface application circuit   If direct access to the USB or the UART interfaces of the module is not provided, it is recommended to provide  direct  access  to  the  SPI_MOSI,  SPI_MISO,  SPI_SCLK,  SPI_MRDY,  SPI_SRDY  lines  of  the module for debug purpose: testpoints can be added on the lines to accommodate the access and a 0 Ω series  resistor  must  be  mounted  on  each  line  to  detach  the  module  pin  from  any  other  connected device.  If the  SPI/IPC interface  is not  used, the  SPI_MOSI, SPI_MISO,  SPI_SCLK,  SPI_MRDY, SPI_SRDY  pins can be left unconnected.  Any external signal connected to the SPI / IPC interface must be tri-stated when the module is in power-down mode, when the external reset is forced low and during the module power-on sequence (at least for 3 s after the start-up event), to avoid latch-up of circuits and allow a proper boot of the module. If the external signals connected to the wireless module cannot be tri-stated, insert a multi channel digital switch  (e.g.  Texas  Instruments  SN74CB3Q16244,  TS5A3159,  or  TS5A63157)  between  the  two-circuit connections and set to high impedance during module power down mode, when external reset is forced low and during power-on sequence.  1.9.5 MUX Protocol (3GPP 27.010) LISA-U series modules have a software layer with MUX functionality,  3GPP TS 27.010 Multiplexer Protocol [7], available  either  on  the  UART  or  on  the  SPI  physical  link.  The  USB  interface  doesn’t  support  the  multiplexer protocol. This  is  a  data  link  protocol  (layer  2  of  OSI  model)  which  uses  HDLC-like  framing  and  operates  between  the module (DCE) and the application processor (DTE) and allows a number of simultaneous sessions over the used physical  link  (UART  or  SPI):  the  user  can  concurrently  use  AT  command  interface  on  one  MUX  channel  and Packet-Switched / Circuit-Switched Data communication on another MUX channel. The multiplexer protocol can be used on one serial interface (UART or SPI) at a time.  Each session consists of a stream of bytes  transferring various kinds of data such as SMS, CBS, PSD, GPS, AT commands in general. This permits, for example, SMS to be transferred to the DTE when a data connection is in progress. The following virtual channels are defined:  Channel 0: control channel  Channel 1 – 5: AT commands /data connection  Channel 6: GPS tunneling All LISA-U2 series modules versions except LISA-U200-00 provide an additional channel:  Channel 7: SIM Access Profile dedicated port For more details please refer to GSM Mux implementation Application Note [15].
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 70 of 160 1.10 DDC (I2C) interface 1.10.1 Overview An I2C compatible Display Data Channel (DDC) interface for communication with u-blox GPS receivers is available on LISA-U series modules. The communication between a u-blox wireless module and a u-blox GPS receiver is only provided by this DDC (I2C) interface.  Name Description Remarks SCL I2C bus clock line Open drain. External pull-up required. SDA I2C bus data line Open drain. External pull-up required. Table 31: DDC pins   The  DDC  (I2C)  interface  pins  ESD  sensitivity  rating  is  1  kV  (HBM  according  to  JESD22-A114F).  Higher protection level could be required if the lines are externally accessible on the application board.  Higher protection level can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the lines connected to these pins, close to accessible points.  u-blox has implemented special features in LISA-U series wireless modules to ease the design effort required for the integration of a u-blox wireless module with a u blox GPS receiver. Combining a u-blox wireless module with a u-blox GPS receiver allows designers to have full access to the GPS receiver directly via the wireless module: it relays control messages to the GPS receiver via a dedicated DDC (I2C) interface.  A  2nd  interface  connected  to  the  GPS  receiver  is  not  necessary:  AT  commands  via  the  UART  serial interface of the wireless module allows a fully control of the GPS receiver from any host processor. LISA-U  series  modules  feature  embedded  GPS  aiding  that  is a  set  of  specific features  developed  by  u-blox  to enhance GPS performance, decreasing Time To First Fix (TTFF), thus allowing to calculate the position in a shorter time with higher accuracy.  The DDC (I2C) interface of all LISA-U2 series modules versions except LISA-U200-00 can be used to communicate with u-blox GPS receivers and at the same time to control an external audio codec: the LISA-U2 series module acts as an I2C master which can communicate to two I2C slaves as allowed by the I2C bus specifications. Refer to section 1.11.2 for an application circuit with an external audio codec.   LISA-U200-00 modules versions don’t support an I2C compatible Display Data Channel (DDC) interface for communication with u-blox GPS receivers and don’t feature embedded GPS aiding.    For more details regarding the handling of the DDC (I2C) interface and the GPS aiding features please refer  to  u-blox  AT  Commands  Manual  [3]  (AT+UGPS,  AT+UGPRF,  AT+UGPIOC  commands)  and  GPS Implementation Application Note [16].  1.10.2 DDC application circuit The DDC (I2C) interface of LISA-U series modules is used to connect the wireless module to a u-blox GPS receiver: the communication with the u-blox GPS receiver by DDC (I2C) interface is enabled by the AT+UGPS command (for more details refer to u-blox AT Commands Manual [3]). The SDA and SCL lines must be connected to the DDC (I2C) interface pins of the u-blox GPS receiver (i.e. the SDA2 and SCL2 pins of the u-blox GPS receiver) on the application board to allow the communication between the wireless module and the u-blox GPS receiver. To be compliant to the I2C bus specifications, the module bus interface pads are open drain output and pull up resistors  must  be  used.  Since  the  pull-up  resistors  are  not  mounted  on  the  module,  they  must  be  mounted
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 71 of 160 externally. Resistor values must conform to the I2C bus specifications [9]. If a LISA-U series module is connected by the DDC (I2C) bus to a u-blox GPS receiver (only one device can be connected on the DDC bus), use a pull-up resistor of  4.7 k.  Pull-ups  must be  connected to a  supply voltage  of  1.8 V (typical), since  this is  the voltage domain of the DDC pins.  V_INT digital interfaces supply output can be used to provide 1.8 V for the pull-ups (for detailed electrical characteristics see LISA-U1 series Data Sheet [1] and LISA-U2 series Data Sheet [2]). DDC Slave-mode operation is not supported, the module can act as master only. Two lines, serial data (SDA) and serial clock (SCL), carry information on the bus. SCL is used to synchronize data transfers, and SDA is the data line. Since both lines are open drain outputs, the DDC devices can only drive them low or  leave them  open. The pull-up resistor pulls the  line up to  the supply rail  if no  DDC device  is pulling it down to GND. If the pull-ups are missing, SCL and SDA lines are undefined and the DDC bus will not work. The signal shape is defined by the values of the pull-up resistors and the bus capacitance. Long wires on the bus will increase  the capacitance. If  the bus capacitance is  increased, use  pull-up resistors with  nominal resistance value lower than 4.7 k, to match the I2C bus specifications [9].regarding rise and fall times of the signals.   Capacitance and series resistance must be limited on the bus to match the I2C specifications (1.0 µs is the maximum allowed rise time on the SCL and SDA lines): route connections as short as possible.  If the pins are not used as DDC bus interface, they can be left unconnected.  LISA-U series modules support these GPS aiding types:  Local aiding  AssistNow Online  AssistNow Offline  AssistNow Autonomous The  embedded  GPS  aiding  features  can  be  used  only  if  the  DDC  (I2C)  interface  of  the  wireless  module  is connected to the u-blox GPS receivers. The GPIO pins can handle:  GPS receiver power-on/off (“GPS supply enable” function provided by GPIO2)  The  wake  up  from  idle-mode  when  the  GPS  receiver  is  ready  to  send  data  (“GPS  data  ready”  function provided by GPIO3)  The RTC synchronization signal to the GPS receiver (“GPS RTC sharing” function provided by GPIO4)   LISA-U1xx-00 modules versions don’t support the following further features related to GPS functionality: o LISA-U1xx-00 modules versions don’t enter idle-mode when the DDC (I2C) interface is enabled by the AT+UGPS command, even if power saving is enabled by the AT+UPSV command o LISA-U1xx-00 modules versions don’t support “GPS data ready” and “GPS RTC sharing” functions o LISA-U1xx-00 modules versions don’t support AssistNow Autonomous GPS aiding  The GPIO2 is by default configured to provide the “GPS supply enable” function (parameter <gpio_mode> of AT+UGPIOC command set to 3 by default), to enable or disable the supply of the u-blox GPS receiver connected to the wireless module by the AT+UGPS command. The pin is set as  Output / High, to switch on the u-blox GPS receiver, if the parameter <mode> of AT+UGPS command is set to 1  Output / Low, to switch off the u-blox GPS receiver, if the parameter <mode> of AT+UGPS command is set to 0 (default setting) The  pin  must  be  connected  to  the  active-high  enable  pin  (or  the  active-low  shutdown  pin)  of  the  voltage regulator that supplies the u-blox GPS receiver on the application board.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 72 of 160 The  “GPS  supply  enable”  function  improves  the  power  consumption  of  the  GPS  receiver.  When  the  GPS functionality  is  not  required,  the  GPS  receiver  can  be  completely  switched  off  by  the  wireless  module  that  is controlled by the application processor with AT commands.  The  GPIO3  is  by  default  configured  to  provide  the  “GPS  data  ready”  function  (parameter  <gpio_mode>  of AT+UGPIOC  command  set to 4  by default), to  sense when  the u-blox  GPS receiver connected  to the  wireless module is ready to send data by the DDC (I2C) interface. The pin will be set as  Input, to sense the line status, waking up the wireless module from idle-mode when the u-blox GPS receiver is ready to send data by the DDC (I2C) interface, if the parameter <mode> of +UGPS AT command is set to 1 and the parameter <GPS_IO_configuration> of +UGPRF AT command is set to 16  Tri-state with an internal active pull-down enabled, otherwise (default setting) The pin that provides the “GPS data ready” function must be connected to the data ready output of the u-blox GPS receiver (i.e. the pin TxD1 of the u-blox GPS receiver) on the application board. The  “GPS  data  ready”  function  provides  an  improvement  in  the  power consumption  of  the wireless  module. When power saving is enabled in the wireless module by the AT+UPSV command and the GPS receiver doesn’t send data by the DDC (I2C) interface, the module automatically enters idle-mode  whenever possible.  With the “GPS data ready” function the GPS receiver can indicate to the wireless module that it is ready to send data by the DDC (I2C) interface: the GPS receiver can wake up the wireless module if it is in idle-mode, so that data sent by the GPS receiver will not be lost by the wireless module even if power saving is enabled.  The  GPIO4  is  by  default  configured  to  provide  the  “GPS  RTC  sharing” function  (parameter  <gpio_mode>  of +UGPIOC AT command set to 5), to provide an RTC (Real Time Clock) synchronization signal at the power up of the u-blox GPS receiver connected to the wireless module. The pin will be set as  Output, to provide an RTC synchronization signal to the u-blox GPS receiver for RTC sharing if the parameter <mode>  of  AT+UGPS  command  is  set  to  1  and  the  parameter  <GPS_IO_configuration>  of  +UGPRF  AT command is set to 32  Output / Low, otherwise (default setting) The pin that provides the “GPS RTC sharing” function must be connected to the RTC synchronization signal of the u-blox GPS receiver (i.e. the pin EXTINT0 of the u-blox GPS receiver) on the application board. The “GPS RTC sharing” function provides improved GPS receiver performance, decreasing the Time To First Fix (TTFF), and thus allowing to calculate the position in a shorter time with higher accuracy. When GPS local aiding is enabled, the wireless module automatically uploads data such as position, time, ephemeris, almanac, health and ionospheric parameter from the GPS receiver into its local memory, and restores this to the GPS receiver at the next power up of the GPS receiver.  The application circuit for connecting a LISA-U series wireless module to a u-blox 1.8 V GPS receiver is illustrated in Figure 40. SDA and SCL pins of the LISA-U series wireless module are directly connected to the relative pins of the u-blox 1.8 V GPS receiver, with appropriate pull-up resistors. GPIO3 and GPIO4 pins are directly connected respectively to the  TxD1 and EXTINT0 pins of the u-blox 1.8 V GPS receiver to provide “GPS data ready” and “GPS RTC sharing” functions. A pull-down resistor is mounted on the  GPIO2 line to avoid a switch on of the GPS module when the  LISA-U series module is in the internal reset state. The  V_BCKP  supply  output  of the  LISA-U  series  wireless  module  is  connected  to  the  V_BCKP  backup  supply input pin of the GPS receiver to provide the supply for the GPS real time clock and backup RAM when the VCC supply of the wireless module is within its operating range and the VCC supply of the GPS receiver is disabled. This enables the u-blox GPS receiver to recover from a power breakdown with either a Hotstart or a Warmstart (depending  on the  duration  of  the  GPS  VCC  outage)  and  to  maintain  the configuration  settings  saved in  the backup RAM.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 73 of 160  “GPS data ready” and “GPS RTC sharing” functions are not supported by all u-blox GPS receivers HW or ROM/FW  versions.  Refer  to  the  GPS  Implementation  Application  Note  [16]  or  to  the  Hardware Integration Manual of the u-blox GPS receivers for the supported features.  Functions not supported by LISA-Uxxx-00 versionsLISA-U seriesR1INOUTGNDGPS LDORegulatorSHDNu-blox1.8 V GPS receiverSDA2SCL2R21V8 1V8VMAIN1V8U121 GPIO2SDASCLC1TxD1EXTINT0GPIO3GPIO446452324VCCR3V_BCKP V_BCKP2Functions not supported by LISA-U200-00 version Figure 40: DDC Application circuit for u-blox 1.8 V GPS receiver Reference Description Part Number - Manufacturer R1, R2  4.7 kΩ Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp R3 47 kΩ Resistor 0402 5% 0.1 W  RC0402JR-0747KL - Yageo Phycomp U1 Voltage Regulator for GPS Receiver See GPS Receiver Hardware Integration Manual Table 32: Components for DDC application circuit for u-blox 1.8 V GPS receiver  The application circuit  for the connection of  a  LISA-U series  wireless module to a  u-blox 3.0 V GPS  receiver is illustrated in Figure 41. If a u-blox 3 V GPS receiver is used, the SDA, SCL, GPIO3 and GPIO4 pins of the LISA-U series wireless module cannot be  directly connected  to the  u-blox 3  V GPS receiver: a proper  I2C-bus Bidirectional Voltage Translator must  be  used  for  the  SDA  and  SCL  signals,  and  a  general  purpose  Voltage  Translator  must  be  used  for  the GPIO3 and GPIO4 signals. The V_BCKP supply output of the wireless module can be directly connected to the V_BCKP backup supply input pin of the GPS receiver as in the application circuit for a u-blox 1.8 V GPS receiver.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 74 of 160 LISA-U seriesu-blox3.0 V GPS receiver23 GPIO324 GPIO41V8B1 A1GNDU3B2A2VCCBVCCAUnidirectionalVoltage TranslatorC4 C53V0TxD1EXTINT0R1INOUTGNDGPS LDORegulatorSHDNR2VMAIN3V0U121 GPIO246 SDA45 SCLR4 R51V8SDA1 SDA2GNDU2SCL1SCL2VREF1VREF2I2C-bus Bidirectional Voltage Translator4V_INTC1C2 C3R3SDA2SCL2VCCFunctions not supported by LISA-Uxxx-00 versionsDIR1DIR22V_BCKPV_BCKPOEFunctions not supported by LISA-U200-00 version Figure 41: DDC Application circuit for u-blox 3.0 V GPS receiver Reference Description Part Number - Manufacturer R1, R2, R4, R5 4.7 kΩ Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp R3 47 kΩ Resistor 0402 5% 0.1 W  RC0402JR-0747KL - Yageo Phycomp C2, C3, C4, C5 100 nF Capacitor Ceramic X5R 0402 10% 10V GRM155R71C104KA01 - Murata U1 Voltage Regulator for GPS Receiver See GPS Receiver Hardware Integration Manual U2 I2C-bus Bidirectional Voltage Translator PCA9306DCURG4 - Texas Instruments U3 Generic Unidirectional Voltage Translator SN74AVC2T245 - Texas Instruments Table 33: Components for DDC application circuit for u-blox 3.0 V GPS receiver
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 75 of 160 1.11 Audio Interface LISA-U120 and LISA-U130 modules provide analog and digital input/output audio interfaces:  Differential analog audio input (MIC_P, MIC_N) and differential analog audio output (SPK_P, SPK_N)  4-wire I2S digital audio interface (I2S_CLK, I2S_RXD, I2S_TXD and I2S_WA) All LISA-U2 series modules versions except LISA-U200-00 provide two digital input/output audio interfaces:  First 4-wire I2S digital audio interface (I2S_CLK, I2S_RXD, I2S_TXD and I2S_WA)  Second 4-wire I2S digital audio interface (I2S1_CLK, I2S1_RXD, I2S1_TXD and I2S1_WA)  Audio signal routing can  be controlled by  the dedicated AT command  +USPM (refer to  u-blox AT  Commands Manual [3]). This command allows setting the audio path mode, composed by the  uplink audio path  and the downlink audio path. Each  uplink  path  mode  defines  the  physical  input  (i.e.  the  analog  or  the  digital  audio  input)  and  the  set  of parameters to process the uplink audio signal (uplink gains, uplink digital filters, echo canceller parameters). For example  the  “Headset  microphone”  uplink  path  uses  the  differential  analog  audio  input  with  the  default parameters for the headset profile. Each downlink path mode defines the physical output (i.e. the analog or the digital audio output) and the set of parameters  to  process  the  downlink  audio  signal  (downlink  gains,  downlink  digital  filters  and  sidetone).  For example  the  “Mono  headset”  downlink  path  uses  the  differential  analog  audio  output  with  the  default parameters for the headset profile. The  set of parameters  to process  the  uplink or  the downlink audio  signal  can  be changed  with dedicated AT commands for each uplink or downlink path and then stored in two profiles in the non volatile memory (refer to u-blox AT Commands Manual [3] for Audio parameters tuning commands).  1.11.1 Analog Audio interface   LISA-U100, LISA-U110 and LISA-U2 series modules versions don’t support analog audio interface.  1.11.1.1 Uplink path (differential analog audio input) The pins related to the differential analog audio input are:  MIC_P / MIC_N: Differential analog audio signal inputs (positive/negative). These two pins are provided with internal series 100 nF capacitors for DC blocking that connect the module pads to the differential input of a Low  Noise  Amplifier.  The  LNA  output  is  internally  connected  to  the  digital  processing  system  by  an integrated sigma-delta analog-to-digital converter The  analog  audio  input  is  selected  when  the  parameter  <main_uplink>  in  AT+USPM  command  is  set  to “Headset  microphone”,  “Handset  microphone”  or  “Hands-free  microphone”:  the  uplink analog  path  profiles use the same physical input but have different sets of audio parameters (for more details please refer to u-blox AT Commands Manual [3], AT+USPM, AT+UMGC, AT+UUBF, AT+UHFP commands). There is no microphone supply pin available on the module: an external low noise LDO voltage regulator should be added to provide a proper supply for a microphone. Detailed electrical characteristics of the differential analog audio input can be found in the LISA-U1 series Data Sheet [1].
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 76 of 160 1.11.1.2 Downlink path (differential analog audio output) The pins related to the differential analog audio output are:  SPK_P  /  SPK_N:  Differential  analog  audio  signal  output  (positive/negative).  These  two  pins  are  internally directly connected to the differential output of a low power audio amplifier, for which the input is internally connected to the digital processing system by to an integrated digital-to-analog converter The  analog  audio  output  is  selected  when  the  parameter  <main_downlink>  in  AT+USPM  command  is  set  to “Normal  earpiece”,  “Mono  headset”  or  “Loudspeaker”:  the  downlink  analog  path  profiles  use  the  same physical  output  but  have  different  sets  of  audio  parameters  (for  more  details  please  refer  to  u-blox  AT Commands Manual [3], AT+USPM, AT+USGC, AT+UDBF, AT+USTN commands). The differential analog audio output can be directly connected to a headset earpiece or handset earpiece but is not able to drive an 8  speaker. Detailed electrical characteristics of the differential audio output can be found in LISA-U1 series Data Sheet [1].   Warning: excessive sound pressure from headphones can cause hearing loss.  Table 34 lists the signals related to analog audio functions.  Name Module Description Remarks MIC_P LISA-U120 LISA-U130 Differential analog audio input (Positive) Shared for all uplink analog path modes:  handset, headset, hands-free mode. Internal DC blocking capacitor. MIC_N LISA-U120 LISA-U130 Differential analog audio input (Negative) Shared for all uplink analog path modes:  handset, headset, hands-free mode. Internal DC blocking capacitor. SPK_P LISA-U120 LISA-U130 Differential analog audio output (Positive) Shared for all uplink analog path modes:  earpiece, headset, loudspeaker mode. SPK_N LISA-U120 LISA-U130 Differential analog audio output (Negative) Shared for all uplink analog path modes:  earpiece, headset, loudspeaker mode. Table 34: Analog audio interface pins  The audio pins ESD sensitivity rating is 1 kV (Human Body Model according to  JESD22-A114F). Higher protection level could be required if the lines are externally accessible on the application board.  Higher protection level can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the lines connected to these pins, close to accessible points.  All  corresponding  differential  audio  lines  must  be  routed  in  pairs,  be  embedded  in  GND  (have  the ground lines as close as possible to the audio lines), and maintain distance from noisy lines such as VCC and from components such as switching regulators.  If the audio pins are not used, they can be left unconnected on the application board.  1.11.1.3 Headset mode Headset  mode  is  the  default  audio  operating  mode  of  the  LISA-U120  and  LISA-U130  modules.  The  headset profile is configured when the uplink audio path is set to “Headset microphone” and the downlink audio path is set  to  “Mono  headset”  (refer  to  u-blox  AT  Commands  Manual  [3]:  AT+USPM  command:  <main_uplink>, <main_downlink> parameters):  Headset microphone must be connected to the module differential input MIC_P / MIC_N  Headset receiver must be connected to the module differential output SPK_P / SPK_N
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 77 of 160 Figure 42 shows an example of an application circuit connecting a headset (with a 2.2 k electret microphone and  a  32    receiver)  to  the  LISA-U120  and  LISA-U130  modules,  with  an  external  low  noise  LDO  voltage regulator to provide a proper supply for the microphone.  Mount an 82 nH series inductor (e.g. Murata LQG15HS82NJ02) on each microphone line, and a 27 pF bypass capacitor (e.g. Murata GRM1555C1H270J) on all audio lines to minimize RF coupling and TDMA noise.  The  physical  width  of  the  audio  outputs  lines  on  the  application  board  must  be  wide  enough  to minimize series resistance. LISA-U120/U130C2 C3 C4J1253461L254SPK_N53SPK_P39MIC_N40MIC_PD1AUDIO HEADSET CONNECTORD2INOUTGNDLow Noise LDO Regulator VMAINU1R4R1C6R3R2 C52V5Sense lines connected to GND in one star pointL1C1C7 Figure 42: Headset mode application circuit Reference Description Part Number – Manufacturer C1, C2, C3, C4 27 pF Capacitor Ceramic COG 0402 5% 25 V  GRM1555C1H270JA01 – Murata C5, C6, C7 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 – Murata D1, D2 Low Capacitance ESD Protection USB0002RP or USB0002DP – AVX L1, L2 82 nH Multilayer inductor 0402 (self resonance frequency ~1 GHz) LQG15HS82NJ02 – Murata J1 Audio Headset 2.5 mm Jack Connector SJ1-42535TS-SMT – CUI, Inc. R1, R2, R3, R4 2.2 kΩ Resistor 0402 5% 0.1 W  RC0402JR-072K2L – Yageo Phycomp U1 Low Noise LDO Linear Regulator 2.5 V 300 mA LT1962EMS8-2.5#PBF- Linear Technology Table 35: Example of components for headset jack connection  1.11.1.4 Handset mode The handset profile is configured when the uplink audio path is set to “Handset microphone” and the downlink audio  path  is  set  to  “Normal  earpiece”  (refer  to  u-blox AT  commands  manual [3]:  AT+USPM  command: <main_uplink>, <main_downlink> parameters):  Handset microphone must be connected to the module differential input MIC_P / MIC_N  Handset receiver must be connected to the module differential output SPK_P / SPK_N
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 78 of 160 Figure 43 shows an example of an application circuit connecting a handset (with a 2.2 k electret microphone and  a  32    receiver)  to  the  LISA-U120  and  LISA-U130  modules,  with  an  external  low  noise  LDO  voltage regulator to provide a proper supply for the microphone.  Mount an 82 nH series inductor (e.g. Murata LQG15HS82NJ02) on each microphone line and a 27 pF bypass capacitor (e.g. Murata GRM1555C1H270J) on all audio lines to minimize RF coupling and TDMA noise.  The  physical  width  of  the  audio  outputs  lines  on  the  application  board  must  be  wide  enough  to minimize series resistance. LISA-U120/U130C1 C2 C3 J14321L153SPK_P54SPK_N40MIC_P39MIC_ND1AUDIO HANDSET CONNECTORD2INOUTGNDLow Noise LDO RegulatorU1R4R1C6R3R2 C52V5Sense lines connected to GND in one star pointC4L2VMAINC7 Figure 43: Handset mode application circuit Reference Description Part Number – Manufacturer C1, C2, C3, C4 27 pF Capacitor Ceramic COG 0402 5% 25 V  GRM1555C1H270JA01 – Murata C5, C6, C7 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 – Murata D1, D2 Low Capacitance ESD Protection USB0002RP or USB0002DP – AVX L1, L2 82nH Multilayer inductor 0402 (self resonance frequency ~1 GHz) LQG15HS82NJ02 – Murata J1 Audio Handset Jack Connector, 4Ckt (4P4C) 52018-4416 – Molex  R1, R2, R3, R4 2.2 kΩ Resistor 0402 5% 0.1 W  RC0402JR-072K2L – Yageo Phycomp U1 Low Noise LDO Linear Regulator 2.5 V 300 mA LT1962EMS8-2.5#PBF- Linear Technology Table 36: Example of components for handset connection  1.11.1.5 Hands-free mode The  hands-free  profile  is  configured  when  the  uplink  audio  path  is  set  to  “Hands-free  microphone”  and  the downlink audio path is set to “Loudspeaker” (refer to  u-blox AT commands manual [3]: AT+USPM command: <main_uplink>, <main_downlink> parameters):  Hands-free microphone signal must be connected to the module differential input MIC_P / MIC_N  High  power  loudspeaker  must  be  connected  to  the  output  of  an  external  audio  amplifier,  for  which  the input must be connected to the module differential output SPK_P / SPK_N The  module differential  analog audio  output  is  not able  to drive  an  8    speaker:  an  external  audio amplifier must  be  provided  on  the  application  board  to  amplify  the  low  power  audio  signal  provided  by  the  module differential output SPK_P / SPK_N.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 79 of 160 Hands-free  functionality  is  implemented  using  appropriate  digital  signal  processing  algorithms  for  voice-band handling  (echo  canceller  and  automatic  gain  control),  managed  via  software  (refer  to  u-blox AT  commands manual [3], AT+UHFP command). Figure  43  shows  an  example  of  an  application  circuit  connecting  a  2.2  k  electret  microphone  and  an 8   speaker to the LISA-U120 and LISA-U130 modules, with an external low noise LDO voltage regulator to provide a proper supply for the microphone and with an external audio amplifier to amplify the low power audio signal provided by the module differential output.  Mount an 82 nH series inductor (e.g. Murata LQG15HS82NJ02) on each microphone line and a 27 pF bypass capacitor (e.g. Murata GRM1555C1H270J) on all audio lines to minimize RF coupling and TDMA noise.  The  physical  width  of  the  audio  outputs  lines  on  the  application  board  must  be  wide  enough  to minimize series resistance. C1 C2C3L139MIC_N53SPK_P40MIC_P54SPK_ND1Microphone ConnectorD2INOUTGNDLow Noise LDO RegulatorU1R4R1C6R3R2 C52V5Sense lines connected to GND in one star pointC4SPKL2MICSpeaker ConnectorOUT+IN+GNDVMAINU2OUT-IN-C8C9R5R6VDDC11C10LISA-U120/U130Audio AmplifierJ1J2VMAINC7 Figure 44: Hands-free mode application circuit Reference Description Part Number – Manufacturer C1, C2, C3, C4 27 pF Capacitor Ceramic COG 0402 5% 25 V  GRM1555C1H270JZ01 – Murata C5, C6, C7, C10 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 – Murata C8, C9 47 nF Capacitor Ceramic X7R 0402 10% 16V GRM155R71C473KA01 – Murata C11 100 nF Capacitor Ceramic X5R 0402 10% 10V GRM155R71C104KA01 – Murata D1, D2 Low Capacitance ESD Protection USB0002RP or USB0002DP – AVX J1 Microphone Connector  J2 Speaker Connector  L1, L2 82nH Multilayer inductor 0402 (self resonance frequency ~1 GHz) LQG15HS82NJ02 – Murata MIC 2.2 k Electret Microphone
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 80 of 160 Reference Description Part Number – Manufacturer R1, R2, R3, R4 2.2 kΩ Resistor 0402 5% 0.1 W  RC0402JR-072K2L – Yageo Phycomp R5, R6 0 Ω Resistor 0402 5% 0.1 W  RC0402JR-070RL – Yageo Phycomp SPK 8  Loudspeaker  U1 Low Noise LDO Linear Regulator 2.5 V 300 mA LT1962EMS8-2.5#PBF- Linear Technology U2 Filter-less Mono 2.8 W Class-D Audio Amplifier SSM2305CPZ – Analog Devices Table 37: Example of components for hands-free connection  1.11.1.6 Connection to an external analog audio device The  differential  analog  audio  input  / output  can be  used  to connect  the  module  to  an external  analog audio device.  Audio  devices  with  a  differential  analog  input  /  output  are  preferable,  as  they  are  more  immune  to external disturbances. If  the  external  analog  audio  device  is  provided  with  a  differential  analog  audio  input,  the  SPK_P /  SPK_N balanced output of the module must be connected to the differential input of the external audio device through a DC-block 10 µF series capacitor (e.g. Murata GRM188R60J106M) to decouple the bias present at the module output (see SPK_P / SPK_N common mode output voltage in the LISA-U1 series Data Sheet [1]). Use a suitable power-on  sequence  to  avoid  audio  bump  due  to  charging  of  the  capacitor:  the  final  audio  stage  should  be always enabled as last one. If the external analog audio device  is provided with a single ended analog audio input, a proper differential to single  ended  circuit  must  be  inserted  from  the  SPK_P /  SPK_N  balanced  output  of  the  module  to the  single ended  input  of  the  external  audio  device.  A  simple  application  circuit  is  described  in  Figure  45:  10  µF  series capacitors  (e.g. Murata  GRM188R60J106M)  are provided  to decouple the bias  present  at the  module output, and a voltage divider is provided to properly adapt the signal level from the module output to the external audio device input. The DC-block series capacitor acts as high-pass filter for audio signals, with cut-off frequency depending on both the  values  of  capacitor  and  on  the  input  impedance  of  the  external  audio  device.  For  example:  in  case  of differential input impedance of 600  , the two 10 µF capacitors will set the -3 dB cut-off frequency to 53 Hz, while  for  single ended  connection to  600    external  device,  the cut-off  frequency  with  just  the  single 10  µF capacitor will be 103 Hz. In  both cases the high-pass filter has a low enough cut-off  to  not  impact the audio signal frequency response. The signal levels can be adapted by setting gain using AT commands, but additional circuitry must be inserted if the SPK_P / SPK_N output level of the module is too high for the input of the audio device. If  the  external  analog  audio  device  is  provided  with  a  differential  analog  audio  output,  the  MIC_P /  MIC_N balanced input of the module must be connected directly to the differential output of the external audio device. Series capacitors are not needed since MIC_P / MIC_N pins are provided with internal 100 nF capacitors for DC blocking (see LISA-U1 series Data Sheet [1]). If the external analog audio device is provided with a single ended analog audio output, a proper single ended to differential  circuit  has  to  be  inserted  from  the  single  ended  output  of  the  external  audio  device  to  the MIC_P / MIC_N balanced input of the module.  A simple application circuit is described in Figure 45: a voltage divider is provided to properly adapt the signal level from the external audio device output to the module input. The signal levels can be adapted by setting gain using AT commands, but additional circuitry must be inserted if the output level of the audio device is too high for MIC_P / MIC_N. Please refer to Figure 45 for the application circuits.  To enable the audio path corresponding to the differential analog audio input / output, please refer to u-blox AT Commands Manual [3]: AT+USPM command.  To tune audio levels for the external device please refer to u-blox AT Commands Manual [3] (AT+USGC, AT+UMGC commands).
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 81 of 160 LISA-U120/U130C1C254SPK_N53SPK_PGND40MIC_PGNDNegative Analog INPositive Analog INNegative Analog OUTPositive Analog OUTAudio DeviceReferenceReference39MIC_NLISA-U120/U13054SPK_N53SPK_PGND40MIC_PGNDAnalog INAudio DeviceReferenceReference39MIC_NAnalog OUTC3C4 R2R1R4R3 Figure 45: Application circuits to connect the module to audio devices with proper differential or single-ended input/output Reference Description Part Number – Manufacturer C1, C2, C3, C4 10 µF Capacitor X5R 0603 5% 6.3 V  GRM188R60J106M – Murata R1, R3 0 Ω Resistor 0402 5% 0.1 W  RC0402JR-070RL – Yageo Phycomp R2, R4 Not populated  Table 38: Connection to an analog audio device  1.11.2 Digital Audio interface    LISA-U100, LISA-U110 and LISA-U200-00 modules versions don’t support digital audio interface.  LISA-U120 and LISA-U130 modules provide one bidirectional 4-wire I2S digital audio interface, while all LISA-U2 series  modules  versions  except  LISA-U200-00  provide  two  bidirectional  4-wire  I2S  digital  audio  interfaces  for connecting to remote digital audio devices. LISA-U series modules can act as an I2S master or I2S slave. In master mode the word alignment and clock signals of the I2S digital audio interface are generated by the module. In slave mode these signal must be generated by the remote device.  Table 39 lists the signals related to digital audio functions.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 82 of 160 Name Module Description Remarks I2S_TXD LISA-U120-0x LISA-U130-0x LISA-U2xx-01 I2S transmit data Module output I2S_RXD LISA-U120-0x LISA-U130-0x LISA-U2xx-01 I2S receive data Module input  I2S_CLK LISA-U120-00 LISA-U130-00 I2S clock Module output in master mode LISA-U120-01 LISA-U130-01 LISA-U2xx-01 I2S clock Module output in master mode Module input in slave mode I2S_WA LISA-U120-00 LISA-U130-00 I2S word alignment Module output in master mode LISA-U120-01 LISA-U130-01 LISA-U2xx-01 I2S word alignment Module output in master mode Module input in slave mode I2S1_TXD LISA-U2xx-01 Second I2S transmit data Module output  I2S1_RXD LISA-U2xx-01 Second I2S receive data Module input  I2S1_CLK LISA-U2xx-01 Second I2S clock Module output in master mode Module input in slave mode I2S1_WA LISA-U2xx-01 Second I2S word alignment Module output in master mode Module input in slave mode CODEC_CLK LISA-U2xx-01 Digital clock output Digital clock output for external audio codec Configurable to 26 MHz or 13 MHz Table 39: Digital audio interface pins  The I2S interfaces and CODEC_CLK pins ESD sensitivity rating is 1 kV (Human Body Model according to JESD22-A114F).  Higher  protection  level  could  be  required  if  the  lines  are  externally  accessible  on  the application  board.  Higher  protection  level  can  be  achieved  by  mounting  a  general  purpose  ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the lines connected to the I2S interfaces pins, close  to  accessible  points,  and  a  low  capacitance  (i.e.  less  than  10  pF)  ESD  protection  (e.g.  AVX USB0002) on the line connected to CODEC_CLK pin, close to accessible point.  The I2S interface can be set to two modes, by the <I2S_mode> parameter of the AT+UI2S command:  PCM mode  Normal I2S mode The I2S interface can be set to two configurations, by the <I2S_Master_Slave> parameter of AT+UI2S:  Master mode  Slave mode   LISA-U120-00 and LISA-U130-00 modules versions don’t support I2S slave mode: module acts as master only.  The sample rate of transmitted/received words can be set, by the <I2S_sample_rate> parameter of AT+UI2S, to:  8 kHz  11.025 kHz  12 kHz  16 kHz  22.05 kHz  24 kHz
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 83 of 160  32 kHz  44.1 kHz  48 kHz   The sample rate of transmitted and received words of LISA-U120-00 and LISA-U130-00 modules cannot be configured: the sample rate is fixed at 8 kHz only.  The <main_uplink> and <main_downlink> parameters of the AT+USPM command must be properly configured to select the I2S digital audio interfaces paths (for more details please refer to u-blox AT Commands Manual [3]):  <main_uplink> has to be properly set to select: o the first I2S interface (using I2S_RXD module input) o the second I2S interface (using I2S1_RXD module input)  <main_downlink> has to be properly set to select:  o the first I2S interface (using I2S_TXD module output) o the second I2S interface (using I2S1_TXD module output) Parameters  of  digital  path  can  be  configured  and  saved  as  the  normal  analog  paths,  using  appropriate  path parameter as described in the u-blox AT Commands Manual [3], +USGC, +UMGC, +USTN AT command. Analog gain parameters of microphone and speakers are not used when digital path is selected. The I2S receive data input and the I2S transmit data  output signals are respectively connected in parallel to the analog microphone input and speaker output signals, so resources available for analog path can be shared:  Digital  filters  and  digital  gains  are  available  in  both  uplink  and  downlink  direction.  They  can  be  properly configured by the AT commands  Ringer tone and service tone are mixed on the TX path when active (downlink)  The HF algorithm acts on I2S path   Refer to the u-blox AT Commands Manual [3]: AT+UI2S command for possible settings of I2S interface.  1.11.2.1 I2S interface - PCM mode Main features of the I2S interface in PCM mode:  I2S runs in PCM - short alignment mode (configurable by AT commands)  I2S word alignment signal can be configured to 8, 11.025, 12, 16, 22.05, 24, 32, 44.1, 48 kHz  I2S word alignment toggles high for 1 or 2 CLK cycles of synchronization (configurable), then toggles low for 16 CLK cycles of sample width. Frame length can be 1 + 16 = 17 bits or 2 + 16 = 18 bits  I2S  clock  frequency  depends  on  frame  length  and  <sample_rate>.  Can  be  17  x  <sample_rate>  or  18  x <sample_rate>  I2S transmit and I2S receive data are 16 bit words long with the same sampling rate as I2S word alignment, mono. Data is in 2’s complement notation. MSB is transmitted first  When I2S word alignment toggles high, the first synchronization bit is always low. Second  synchronization bit (present only in case of 2 bit long I2S word alignment configuration) is MSB of the transmitted word (MSB is transmitted twice in this case)  I2S transmit data changes on I2S clock rising edge, I2S receive data changes on I2S clock falling edge
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 84 of 160 1.11.2.2 I2S interface - Normal I2S mode Normal I2S supports:  16 bits word  Mono interface  Configurable sample rate: 8, 11.025, 12, 16, 22.05, 24, 32, 44.1, 48 kHz Main features of I2S interface in normal I2S mode:  I2S  word  alignment  signal  always  runs  at  <sample_rate>  and  synchronizes  2  channels  (timeslots  on  word alignment high, word alignment low)  I2S transmit data  is composed of 16 bit words, dual mono (the words are written on both channels). Data are in 2’s complement notation. MSB  is transmitted  first. The bits are written on  I2S clock rising  or falling edge (configurable)  I2S receive data is read as 16 bit words, mono (words are read only on the timeslot with WA high). Data  is read in 2’s complement notation. MSB is read first. The bits are read on the  I2S clock edge opposite to I2S transmit data writing edge (configurable)  I2S clock frequency is 16 bits x 2 channels x <sample_rate> The  modes  are  configurable  through  a  specific  AT  command  (refer  to  the  related  chapter  in  u-blox  AT Commands Manual [3], +UI2S AT command) and the following parameters can be set:  MSB can be 1 bit delayed or non-delayed on I2S word alignment edge  I2S transmit data can change on rising or falling edge of I2S clock signal (rising edge in this example)  I2S receive data are read on the opposite front of I2S clock signal  1.11.2.3 I2S interface application circuits LISA-U  series  I2S  digital  audio  interfaces  can  be  connected  to  an  external  digital  audio  device  for  voice applications.  The  external  digital  audio  device  must  be  properly  configured  according  to  the  wireless  module configuration, with opposite role (i.e. master vs. slave), same mode (i.e. PCM mode or Normal I2S mode), same sample rate and same voltage level. Figure 46 shows an application circuit with a generic digital audio device.  43I2S_CLK41I2S_WAI2S ClockI2S Word AlignmentLISA-U120-xxLISA-U130-xxLISA-U2xx-0142I2S_TXD44I2S_RXDI2S Data InputI2S Data OutputGND GND1.8 V Digital Audio Device Figure 46: I2S interface application circuit with a generic digital audio device  Figure 47 shows an application circuit for  I2S digital audio interfaces of LISA-U2xx-01 modules, providing voice capability using an external audio voice codec. DAC and ADC integrated in the external audio codec respectively converts  an  incoming digital  data stream to  analog  audio  output  through  a mono  amplifier  and converts  the microphone input signal to the digital bit stream over the digital audio interface.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 85 of 160 An I2S digital audio interface of the LISA-U2xx-01 modules (that acts as an I2S master) is connected to the digital audio interface of the external audio codec (that acts as an I2S slave). The first I2S interface can be used as well as the second I2S interface of the wireless module. The  CODEC_CLK  digital  output  clock  of  the  wireless  module  is  connected  to  the  clock  input  of  the  external audio codec to provide clock reference. Signal integrity of the high speed lines may be degraded if the PCB layout is not  optimal, especially when the CODEC_CLK clock line or also the I2S digital audio interface lines are very long: keep routing short and minimize parasitic capacitance to preserve signal integrity. The external audio codec is controlled by the wireless module using the DDC (I2C) interface: this interface can be used to communicate with u-blox GPS receivers and at the same time to control an external audio codec on all LISA-U2 series modules versions except LISA-U200-00. The  V_INT supply  output  of  the wireless module  provides  the  supply to  the external  audio codec,  defining  a proper voltage level for the digital interfaces. An external audio codec can be connected to the I2S digital audio interface of LISA-U120 or LISA-U130 modules as shown in the application circuit described in Figure 47. In this case the application processor should properly control the audio codec by I2C interface and should properly provide clock reference to the audio codec.  53I2S1_CLK54I2S1_WAR2R1BCLKGNDU1LRCLKC3C2LISA-U2xx-01Audio   Codec40I2S1_TXD39I2S1_RXDSDINSDOUT46SDA45SCLSDASCL52CODEC_CLK MCLKGNDIRQnR3 C1C10D2C9SPKSpeaker ConnectorOUTPOUTNJ24V_INTVDDMICBIASC4 R4C5C6L1MICLNMICLPD1Microphone ConnectorL2MICC8 C7J1MICGND R51V8 Figure 47: I2S interface application circuit with an external audio codec to provide voice capability Reference Description Part Number – Manufacturer C1 100 nF Capacitor Ceramic X5R 0402 10% 10V GRM155R71C104KA01 – Murata C2, C4, C5, C6 1 µF Capacitor Ceramic X5R 0402 10% 6.3 V GRM155R60J105KE19 – Murata C3 10 µF Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 – Murata C7, C8, C9, C10 27 pF Capacitor Ceramic COG 0402 5% 25 V  GRM1555C1H270JZ01 – Murata D1, D2 Low Capacitance ESD Protection USB0002RP or USB0002DP – AVX J1 Microphone Connector Various manufacturers  J2 Speaker Connector Various manufacturers
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 86 of 160 Reference Description Part Number – Manufacturer L1, L2 82nH Multilayer inductor 0402 (self resonance frequency ~1 GHz) LQG15HS82NJ02 – Murata MIC 2.2 k Electret Microphone Various manufacturers R1, R2  4.7 kΩ Resistor 0402 5% 0.1 W  RC0402JR-074K7L - Yageo Phycomp R3 10 kΩ Resistor 0402 5% 0.1 W  RC0402JR-0710KL - Yageo Phycomp R4, R5 2.2 kΩ Resistor 0402 5% 0.1 W  RC0402JR-072K2L – Yageo Phycomp SPK 32  Speaker Various manufacturers  U1 16-Bit Mono Audio Voice Codec MAX9860ETG+ - Maxim Table 40: Example of components for audio voice codec application circuit   If the I2S digital audio pins are not used, they can be left unconnected on the application board.  Any external signal connected to the digital audio interfaces  must be tri-stated when the module is in power-down mode, when the external reset is forced low and during the module power-on sequence (at least for  3 s after the start-up event), to avoid latch-up  of circuits and  allow a  proper boot of the module.  If  the  external  signals  connected  to  the  wireless  module  cannot  be  tri-stated,  insert  a  multi channel  digital  switch  (e.g.  Texas  Instruments  SN74CB3Q16244,  TS5A3159,  or  TS5A63157)  between the two-circuit connections and set to high impedance during power down mode, when external reset is forced low and during power-on sequence.  1.11.3 Voiceband processing system  The  voiceband  processing  on  the  LISA-U  series  modules  is  implemented  in the  DSP  core  inside  the  baseband chipset.  The  analog  audio  front-end  of  the  chipset  is  connected  to  the  digital  system  through  16  bit  ADC converters in the uplink path, and through 16 bit DAC converters in the downlink path. External digital audio devices  can  be  interfaced  directly  to  the  DSP  digital  processing  part  via  the  I2S  digital  interface.  The  analog amplifiers are skipped in this case. Available audio signal processing algorithms are:  Speech encoding (uplink) and decoding (downlink).The following speech codecs are supported in firmware on the DSP for speech encoding and decoding: GERAN GMSK codecs  GSM HR (GSM Half Rate)  GSM FR (GSM Full Rate)  GSM EFR (GSM Enhanced Full Rate)  HR AMR (GSM Half Rate Adaptive Multi Rate - Narrow Band)  FR AMR (GSM Full Rate Adaptive Multi Rate - Narrow Band)  FR AMR-WB (GSM Full Rate Adaptive Multi Rate - Wide Band) UTRAN codecs:  UMTS AMR2 (UMTS Adaptive Multi Rate version 2 – Narrow Band)  UMTS AMR-WB (UMTS Adaptive Multi Rate – Wide Band)  Mandatory sub-functions:  Discontinuous transmission, DTX (GSM 46.031, 46.041, 46.081 and 46.093 standards)  Voice activity detection, VAD (GSM 46.032, 46.042, 46.082 and 46.094 standards)  Background noise calculation (GSM 46.012, 46.022, 46.062 and 46.092 standards)  Function configurable via specific AT commands (refer to the u-blox AT Commands Manual [3])  Signal routing: +USPM command
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 87 of 160  Analog amplification, Digital amplification: +USGC, +CLVL, +CRSL, +CMUT command  Digital filtering: +UUBF, +UDBF commands  Hands-free algorithms (echo cancellation, Noise suppression, Automatic Gain control) +UHFP command  Sidetone generation (feedback of uplink speech signal to downlink path): +USTN command  Playing/mixing of alert tones: Service tones: Tone generator with 3 sinus tones +UPAR command User generated tones: Tone generator with a single sinus tone +UTGN command PCM audio files (for prompting): The storage format of PCM audio files is 8 kHz sample rate, signed 16 bits, little endian, mono  With exception of the speech encoder/decoder, this audio processing can be controlled by AT commands. This processing is implemented within the different blocks of the voiceband processing system:  Sample-based  Voice-band  Processing  (single  sample  processed  at  16  kHz  for  Wide  Band  AMR  codec  or 8 kHz for all other speech codecs)  Frame-based Voice-band Processing (frames of 320 samples for Wide Band AMR codec or 160 samples for all other speech codecs are processed every 20 ms)  These blocks are connected by buffers (circular buffer and voiceband sample buffer) and sample rate converters (for 8 / 16 to 47.6 kHz conversion). Voiceband audio processing implemented in the DSP core of LISA-U series modules is summarized in Figure 48. DACADCI2S Receive Data SwitchMIC_P/NMicrophone Analog GainUF 2/6UF 1/5Hands-freeTo Radio TXScal_MicDigital GainSidetoneSPK_P/N SwitchI2S Transmit Data Scal_Rec Digital GainHS Analog gainTone GeneratorFrom Radio RXSpeech levelI2Sx RXPCM Player18 dBUF 4/8UF 3/7DF 3/7DF 4/8DF 1/5DF 2/6Legend:UF= uplink filterDF = downlink  filterMix_AfeI2Sx TX Figure 48: Voiceband processing system block diagram
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 88 of 160 1.12 General Purpose Input/Output (GPIO) LISA-U1  series  modules  provide  5  pins  (GPIO1-GPIO5),  while  LISA-U2  series  modules  provide  up  to  14  pins (GPIO1-14) which can be configured as general purpose input or output, or can be configured to provide special functions  via  u-blox  AT  commands  (for  further  details  refer  to  u-blox  AT  Commands  Manual  [3],  +UGPIOC, +UGPIOR, +UGPIOW, +UGPS, +UGPRF, +USPM).  The following functions are available in the LISA-U series modules:   GSM Tx burst indication: GPIO1  pin  can  be  configured  by  AT+UGPIOC  to  indicate  when  a  GSM  Tx  burst/slot  occurs,  setting  the parameter <gpio_mode> of AT+UGPIOC command to 9. No GPIO pin is by default configured to provide the “GSM Tx burst indication” function. The pin configured to provide the “GSM Tx burst indication” function is set as o Output / High, since ~10 µs before the start of first Tx slot, until ~5 µs after the end of last Tx slot o Output / Low, otherwise The pin configured to provide the “GSM Tx burst indication” function can be connected on the application board to an input pin of an application processor to indicate when a GSM Tx burst/slot occurs.   GPS supply enable: The GPIO2 is by default configured by AT+UGPIOC command to enable or disable the supply of the u-blox GPS receiver connected to the wireless module. The GPIO1, GPIO3, GPIO4 or GPIO5 pins can be configured to provide the “GPS supply enable” function, alternatively to the default GPIO2 pin, setting the parameter <gpio_mode> of AT+UGPIOC command to 3. The  “GPS  supply  enable”  mode  can  be  provided  only  on  one  pin  per  time:  it  is  not  possible  to simultaneously set the same mode on another pin. The pin configured to provide the “GPS supply enable” function is set as o Output  /  High,  to  switch  on  the  u-blox  GPS  receiver,  if  the  parameter  <mode>  of  AT+UGPS command is set to 1 o Output  /  Low,  to  switch  off  the  u-blox  GPS  receiver,  if  the  parameter  <mode>  of  AT+UGPS command is set to 0 (default setting) The  pin  configured  to  provide  the  “GPS  supply  enable”  function  must  be  connected  to  the  active-high enable pin (or the active-low shutdown pin) of the voltage regulator that supplies the u-blox GPS receiver on the application board.   LISA-U200-00 modules version don’t support “GPS supply enable” function.   GPS data ready: Only the GPIO3 pin provides the “GPS data ready” function, to sense when a u-blox GPS receiver connected to the wireless module is ready to send data via the DDC (I2C) interface, setting the parameter <gpio_mode> of AT+UGPIOC command to 4. The pin configured to provide the “GPS data ready” function will be set as o Input, to sense the line status, waking up the wireless module from idle-mode when the u-blox GPS receiver is ready to send data via the DDC (I2C) interface; this is possible if the parameter <mode> of  AT+UGPS  command  is  set  to  1  and  the  parameter  <GPS_IO_configuration>  of  AT+UGPRF command is set to 16 o Tri-state with an internal active pull-down enabled, otherwise (default setting) The pin that provides the “GPS data  ready”  function must be connected to the  data ready output of  the u-blox GPS receiver (i.e. the pin TxD1 of the u-blox GPS receiver) on the application board.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 89 of 160  LISA-U1xx-00 and LISA-U200-00 modules versions don’t support “GPS data ready” function.   GPS RTC sharing: Only  the  GPIO4  pin  provides  the  “GPS  RTC  sharing”  function,  to  provide  an  RTC  (Real  Time  Clock) synchronization signal to the u-blox GPS receiver connected to the wireless module, setting the parameter <gpio_mode> of AT+UGPIOC command to 5. The pin configured to provide the “GPS RTC sharing” function will be set as o Output, to provide an RTC (Real Time Clock) synchronization signal to the u-blox GPS receiver if the parameter <mode> of AT+UGPS command is set to 1 and the parameter <GPS_IO_configuration> of AT+UGPRF command is set to 32 o Output / Low, otherwise (default setting) The pin that provides the “GPS RTC sharing” function must be connected to the RTC synchronization input of the u-blox GPS receiver (i.e. the pin EXTINT0 of the u-blox GPS receiver) on the application board.   LISA-U1xx-00 and LISA-U200-00 modules versions don’t support “GPS RTC sharing” function.   SIM card detection: The GPIO5 pin is by default configured by AT+UGPIOC command to detect SIM card presence. Only the GPIO5 pin can be configured to provide the “SIM card detection” function, setting the parameter <gpio_mode> of AT+UGPIOC command to 7 (default setting). The pin configured to provide the “SIM card detection” function is set as o Input with an internal active pull-down enabled, to sense SIM card presence The pin must be connected on the application board to SW2 pin of the SIM card holder, which must provide 2 pins for the mechanical card presence detection, with a 470 kΩ pull-down resistor. SW1 pin of the SIM card holder must be connected to V_INT pin of the module, by a 1 kΩ pull-up resistor. Refer to Figure 49 and section  1.8 for the detailed application circuit. The  GPIO5 signal will be pulled low by  the pull-down when a SIM card is not inserted in the holder,  and will be pulled high by the  pull-up when  a SIM card  is present.   Network status indication: GPIO1,  GPIO2,  GPIO3,  GPIO4  or  GPIO5  can  be  configured  to  indicate  network  status  (i.e.  no  service, registered home 2G network, registered home 3G network, registered visitor 2G network, registered visitor 3G  network,  voice  or  data  2G/3G  call  enabled),  setting  the  parameter  <gpio_mode>  of  AT+UGPIOC command to 2. No GPIO pin is by default configured to provide the “Network status indication” function. The  “Network  status  indication”  mode  can  be  provided  only  on  one  pin  per  time:  it  is  not  possible  to simultaneously set the same mode on another pin. The pin configured to provide the “Network status indication” function is set as o Continuous Output / Low, if no service (no network coverage or not registered) o Cyclic Output / High for 100 ms, Output / Low for 2 s, if registered home 2G network o Cyclic Output / High for 50 ms, Output / Low for 50 ms, Output / High for 50 ms, Output / Low for 2 s, if registered home 3G network o Cyclic Output / High for 100 ms, Output / Low for 100 ms, Output / High for 100 ms, Output / Low for 2 s, if registered visitor 2G network (roaming) o Cyclic Output / High for 50 ms, Output / Low for 50 ms, Output / High for 50 ms, Output / Low for 100 ms, if registered visitor 3G network (roaming) o Continuous Output / High, if voice or data 2G/3G call enabled
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 90 of 160 The pin configured to provide the “Network status indication” function can be connected on the application board to an input pin of an application processor or can drive a LED by a transistor with integrated resistors to indicate network status.   Module status indication: The  GPIO13  and  GPIO1  pins  can  be  configured  to  indicate  module  status  (power-off  mode,  i.e.  module switched  off,  versus  idle,  active  or  connected  mode,  i.e.  module  switched  on),  properly  setting  the parameter <gpio_mode> of AT+UGPIOC command to 10. No GPIO pin is by default configured to provide the “Module status indication”. The pin configured to provide the “Module status indication” function is set as o Output  /  High,  when  the  module  is  switched  on  (any  operating  mode  during  module  normal operation: idle, active or connected mode) o Output / Low, when the module is switched off (power off mode) The  “Module  status  indication”  mode  can  be  provided  only  on  one  pin  at  a  time:  it  is  not  possible  to simultaneously set the same mode on another pin.   LISA-U1 series modules and LISA-U200-00 modules versions don’t support “Module status indication”.   Module operating mode indication: The GPIO14 and GPIO5 pins can be configured to indicate module operating mode (idle-mode versus active or connected mode), properly setting the parameter <gpio_mode> of AT+UGPIOC command to 11. No GPIO pin is by default configured to provide the “Module operating mode indication”. The pin configured to provide the “Module operating mode indication” function is set as o Output / High, when the module is in active or connected mode o Output / Low, when the module is in idle-mode (that can be reached if power saving is enabled by +UPSV AT command: for further details refer to u-blox AT Commands Manual [3]) The “Module operating mode indication” mode can be provided only on one pin at a time: it is not possible to simultaneously set the same mode on another pin.   LISA-U1 series modules and LISA-U200-00 versions don’t support “Module operating mode indication”.   I2S digital audio interface: The GPIO6, GPIO7, GPIO8, GPIO9 pins are by default configured as the second I2S digital audio interface (I2S1_RXD, I2S1_TXD, I2S1_CLK, I2S1_WA respectively). Only these pins can be configured as the second I2S digital audio interface, correctly setting the parameter <gpio_mode> of AT+UGPIOC command to 12 (default setting).   LISA-U1 series modules and LISA-U200-00 versions don’t support the second I2S digital audio interface over GPIOs.   SPI serial interface: GPIO10,  GPIO11,  GPIO12,  GPIO13  and  GPIO14  pins  are  by  default  configured  as  the  SPI  /  IPC  serial interface (SPI_SCLK, SPI_MOSI, SPI_MISO, SPI_SRDY and SPI_MRDY respectively). Only  these  pins  can  be  configured  as  the  SPI  /  IPC  serial  interface,  correctly  setting  the  parameter <gpio_mode> of AT+UGPIOC command to 13 (default setting).
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 91 of 160  LISA-U1 series  modules and LISA-U200-00  versions don’t support  SPI / IPC serial interface over GPIOs: the SPI / IPC pins provide the SPI / IPC function only and cannot be configured as GPIO.   General purpose input: All the GPIOs can be configured as input to sense high or low digital level through AT+UGPIOR command, setting the parameter <gpio_mode> of AT+UGPIOC command to 1. The  “General  purpose  input”  mode  can  be  provided  on  more  than  one  pin  at  a  time:  it  is  possible  to simultaneously set the same mode on another pin (also on all the GPIOs). No GPIO pin is by default configured as “General purpose input”. The pin configured to provide the “General purpose input” function is set as o Input, to sense high or low digital level by AT+UGPIOR command. The pin can be connected on the application board to an output pin of an application processor to sense the digital signal level.   General purpose output: All  the  GPIOs  can  be  configured  as  output  to  set  the  high  or  the  low  digital  level  through  AT+UGPIOW command, setting the parameter <gpio_mode> of +UGPIOC AT command to 0. The  “General  purpose  output”  mode  can  be  provided  on  more  than  one  pin  per  time:  it  is  possible  to simultaneously set the same mode on another pin (also on all the GPIOs). No GPIO pin is by default configured as “General purpose output”. The pin configured to provide the “General purpose output” function is set as o Output / Low, if the parameter <gpio_out_val> of AT+UGPIOW command is set to 0 o Output / High, if the parameter <gpio_out_val> of AT+UGPIOW command is set to 1 The pin can be connected on the application board to an input pin of an application processor to provide a digital signal.   Pad disabled: All the  GPIOs can  be  configured  in tri-state  with an internal  active pull-down  enabled, as a  not used  pin, setting the parameter <gpio_mode> of +UGPIOC AT command to 255. The “Pad disabled” mode can be provided on more than one pin per time: it is  possible to simultaneously set the same mode on another pin (also on all the GPIOs). The pin configured to provide the “Pad disabled” function is set as o Tri-state with an internal active pull-down enabled  The configurations of all the GPIO pins of LISA-U series modules are described in Table 41.  Pin Module Name Description Remarks 20 LISA-U1xx-xx GPIO1 GPIO By default, the pin is configured as Pad disabled. Can be alternatively configured by the AT+UGPIOC command as  Output  Input  Network Status Indication  GPS Supply Enable  GSM Tx Burst Indication  LISA-U200-00 GPIO1 GPIO By default, the pin is configured as Pad disabled. Can be alternatively configured by the AT+UGPIOC command as  Output  Input  Network Status Indication  GSM Tx Burst Indication
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 92 of 160 Pin Module Name Description Remarks  LISA-U2xx-01 GPIO1 GPIO By default, the pin is configured as Pad disabled. Can be alternatively configured by the AT+UGPIOC command as  Output  Input  Network Status Indication  GPS Supply Enable  GSM Tx Burst Indication  Module Status Indication 21 LISA-U1xx-xx LISA-U2xx-01 GPIO2 GPIO By default, the pin is configured to provide GPS Supply Enable function. Can be alternatively configured by the +UGPIOC command as  Output  Input  Network Status Indication  Pad disabled  LISA-U200-00 GPIO2 GPIO By default, the pin is configured as Pad disabled. Can be alternatively configured by the +UGPIOC command as  Output  Input  Network Status Indication 23 LISA-U1xx-00 GPIO3 GPIO By default, the pin is configured as Pad disabled. Can be alternatively configured by the +UGPIOC command as  Output  Input  Network Status Indication  GPS Supply Enable  LISA-U200-00 GPIO3 GPIO By default, the pin is configured as Pad disabled. Can be alternatively configured by the +UGPIOC command as  Output  Input  Network Status Indication  LISA-U1xx-01 LISA-U2xx-01 GPIO3 GPIO By default, the pin is configured to provide GPS Data Ready function. Can be alternatively configured by the +UGPIOC command as  Output  Input  Network Status Indication  GPS Supply Enable  Pad disabled 24 LISA-U1xx-00 GPIO4 GPIO By default, the pin is configured as Pad disabled. Can be alternatively configured by the +UGPIOC command as  Output  Input  Network Status Indication  GPS Supply Enable  LISA-U200-00 GPIO4 GPIO By default, the pin is configured as Pad disabled. Can be alternatively configured by the +UGPIOC command as  Output  Input  Network Status Indication  LISA-U1xx-01 LISA-U2xx-01 GPIO4 GPIO By default, the pin is configured to provide GPS RTC sharing function. Can be alternatively configured by the +UGPIOC command as  Output  Input  Network Status Indication  GPS Supply Enable  Pad disabled
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 93 of 160 Pin Module Name Description Remarks 51 LISA-U1xx-xx GPIO5 GPIO By default, the pin is configured to provide SIM card detection function. Can be alternatively configured by the +UGPIOC command as  Output  Input  Network Status Indication  GPS Supply Enable  Pad disabled  LISA-U200-00 GPIO5 GPIO By default, the pin is configured to provide SIM card detection function. Can be alternatively configured by the +UGPIOC command as  Output  Input  Network Status Indication  Pad disabled  LISA-U2xx-01 GPIO5 GPIO By default, the pin is configured to provide SIM card detection function. Can be alternatively configured by the +UGPIOC command as  Output  Input  Network Status Indication  GPS Supply Enable  Module Operating Mode Indication   Pad disabled 39 LISA-U200-00 GPIO6 GPIO By default, the pin is configured as Pad disabled. Can be alternatively configured by the +UGPIOC command as  Output  Input  LISA-U2xx-01 I2S1_RXD / GPIO6 2nd I2S receive data / GPIO By default, the pin is configured as 2nd I2S receive data input. Can be alternatively configured by the +UGPIOC, +USPM commands as  Output  Input  Pad disabled 40 LISA-U200-00 GPIO7 GPIO By default, the pin is configured as Pad disabled. Can be alternatively configured by the +UGPIOC command as  Output  Input  LISA-U2xx-01 I2S1_TXD / GPIO7 2nd I2S transmit data / GPIO  By default, the pin is configured as 2nd I2S transmit data output. Can be alternatively configured by the +UGPIOC, +USPM commands as  Output  Input  Pad disabled 53 LISA-U200-00 GPIO8 GPIO By default, the pin is configured as Pad disabled. Can be alternatively configured by the +UGPIOC command as  Output  Input  LISA-U2xx-01 I2S1_CLK / GPIO8 2nd I2S clock / GPIO By default, the pin is configured as 2nd I2S clock input/output. Can be alternatively configured by the +UGPIOC, +USPM commands as  Output  Input  Pad disabled 54 LISA-U200-00 GPIO9 GPIO By default, the pin is configured as Pad disabled. Can be alternatively configured by the +UGPIOC command as  Output  Input  LISA-U2xx-01 I2S1_WA / GPIO9 2nd I2S word alignment / GPIO By default, the pin is configured as 2nd I2S word alignment input/output. Can be alternatively configured by the +UGPIOC, +USPM commands as  Output  Input  Pad disabled
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 94 of 160 Pin Module Name Description Remarks 55 LISA-U2xx-01 SPI_SCLK / GPIO10 SPI Serial Clock / GPIO By default, the pin is configured as SPI Serial Clock Input:   Idle low (CPOL=0)  Internal active pull-down to GND enabled Can be alternatively configured by the +UGPIOC command as  Output  Input  Pad disabled 56 LISA-U2xx-01 SPI_MOSI / GPIO11 SPI Data Line / GPIO By default, the pin is configured as SPI Data Line Input:  Shift data on rising clock edge (CPHA=1)  Latch data on falling clock edge (CPHA=1)  Idle high  Internal active pull-up to V_INT enabled Can be alternatively configured by the +UGPIOC command as  Output  Input  Pad disabled 57 LISA-U2xx-01 SPI_MISO / GPIO12 SPI Data Line Output / GPIO By default, the pin is configured as SPI Data Line Output:  Shift data on rising clock edge (CPHA=1)  Latch data on falling clock edge (CPHA=1)  Idle high Can be alternatively configured by the +UGPIOC command as  Output  Input  Pad disabled 58 LISA-U2xx-01 SPI_SRDY / GPIO13 SPI Slave Ready / GPIO By default, the pin is configured as SPI Slave Ready Output:  Idle low Can be alternatively configured by the +UGPIOC command as  Output  Input  Module Status Indication Pad disabled 59 LISA-U2xx-01 SPI_MRDY / GPIO14 SPI Master Ready / GPIO By default, the pin is configured as SPI Master Ready Input:  Idle low  Internal active pull-down to GND enabled Can be alternatively configured by the +UGPIOC command as  Output  Input  Module Operating Mode Indication  Pad disabled Table 41: GPIO pins   The GPIO pins ESD sensitivity rating is 1 kV  (Human Body Model according to JESD22-A114F).  Higher protection level could be required if the lines are externally accessible on the application board.  Higher protection level can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the lines connected to these pins, close to accessible points.  An application circuit for a typical GPIOs usage is described in Figure 49:  Network indication function provided by the GPIO1 pin  GPS supply enable function provided by the GPIO2 pin (function not supported by LISA-U200-00)  GPS data ready function provided by the GPIO3 pin (function not supported by LISA-Uxxx-00)  GPS RTC sharing function provided by the GPIO4 pin (function not supported by LISA-Uxxx-00)  SIM card detection function provided by the GPIO5 pin
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 95 of 160  Use transistors with at least an integrated resistor in the base pin or otherwise put a 10 kΩ resistor on the board in series to the GPIO.  If the GPIO pins are not used, they can be left unconnected on the application board.  Any external signal connected to GPIOs must be tri-stated when the module is in power-down mode, when the external reset is forced low and during the module power-on sequence (at least for 3 s after the start-up event), to avoid latch-up of circuits and allow a proper boot of the module. If the external signals connected to the  module cannot be  tri-stated,  insert a  multi channel digital switch (e.g. Texas Instruments SN74CB3Q16244, TS5A3159, or TS5A63157) between the two-circuit connections and set to  high impedance  during  module  power  down  mode,  when external  reset  is forced  low  and  during power-on sequence. SIM card holderSW1 SW2 4V_INT51GPIO5R3R2OUTINGNDLDO RegulatorSHDN3V8 1V8GPIO3GPIO4TxD1EXTINT02324R1VCCGPIO2 21LISA-U series u-blox1.8 V GPS receiverU1J1C1R4R63V8Network IndicatorR5GPS Supply EnableGPS Data ReadyGPS RTC SharingSIM Detection20GPIO1DL1T1D1Functions not supported by LISA-Uxxx-00  versionsFunction not supported by LISA-U200-00  version Figure 49: GPIO application circuit Reference Description Part Number - Manufacturer R1 47 kΩ Resistor 0402 5% 0.1 W Various manufacturers U1 Voltage Regulator for GPS Receiver See GPS Module Hardware Integration Manual R2 1 kΩ Resistor 0402 5% 0.1 W Various manufacturers R3 470 kΩ Resistor 0402 5% 0.1 W Various manufacturers D1 ESD Transient Voltage Suppressor USB0002RP or USB0002DP - AVX J1 SIM Card Holder CCM03-3013LFT R102 - C&K Components (or equivalent) R4 10 kΩ Resistor 0402 5% 0.1 W Various manufacturers R5 47 kΩ Resistor 0402 5% 0.1 W Various manufacturers R6 820 Ω Resistor 0402 5% 0.1 W Various manufacturers DL1 LED Red SMT 0603 LTST-C190KRKT - Lite-on Technology Corporation T1 NPN BJT Transistor  BC847 - Infineon Table 42: Components for GPIO application circuit
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 96 of 160 An application circuit for the module status indication function, provided by LISA-U2xx-01 GPIO13 and GPIO1 pins to indicate module status (power-off mode, i.e. module switched off, versus idle, active or connected mode, i.e. module switched on), is described in Figure 50. The logic level of the  pin  configured to provide  module status indication, that  is set high when the module is switched on and low when the module is switched off, is inverted by a transistor biased by the V_BCKP supply, which is generated by the module when a valid VCC is applied.  Input (1.8V)V_BCKP 2LISA-U2xx-01 Application ProcessorR1R3Module Status IndicationR220GPIO1 T1 Figure 50: Module status indication application circuit Reference Description Part Number - Manufacturer R1, R3 47 kΩ Resistor 0402 5% 0.1 W Various manufacturers R2 100 kΩ Resistor 0402 5% 0.1 W Various manufacturers T1 NPN BJT Transistor  BC847 - Infineon Table 43: Components for module status indication application circuit
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 97 of 160 1.13 Reserved pins (RSVD) LISA-U series modules have pins reserved for future use. All the  RSVD pins, except pin number 5,  can be left unconnected on the application board. The application circuit is illustrated in Figure 51.   Pin 5 (RSVD) must be connected to GND.  LISA-U120/U1305RSVD52RSVD74RSVDLISA-U100/U1105RSVD52RSVD74RSVD39RSVD40RSVD41RSVD42RSVD43RSVD44RSVD53RSVD54RSVDLISA-U2305RSVDLISA-U200-005RSVD52RSVD74RSVD41RSVD42RSVD43RSVD44RSVDLISA-U200-015RSVD74RSVD Figure 51: Application circuit for the reserved pins (RSVD)
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 98 of 160 1.14 Schematic for LISA-U series module integration Figure 52 is an example of a schematic diagram where a LISA-U1 series module is integrated into an application board, using all the interfaces of the module. 47pFSIM Card HolderCCVCC (C1)CCVPP (C6)CCIO (C7)CCCLK (C3)CCRST (C2)GND (C5)47pF 47pF 100nF50VSIM48SIM_IO47SIM_CLK49SIM_RST47pFSW1 SW24V_INT51GPIO5470k1kESD ESD ESD ESD ESD ESDTXDRXDRTSCTSDTRDSRRIDCDGND15 TXD12 DTR16 RXD13 RTS14 CTS9DSR10 RI11 DCDGND3V8330µF 39pF GND10nF100nF 10pFLISA-U1 series62 VCC63 VCC61 VCC+100µF2V_BCKPMOSIMISOSCLKInterruptGPIOGND56 SPI_MOSI59 SPI_MRDY57 SPI_MISO55 SPI_SCLK58 SPI_SRDYGNDVBUSD+D-GND18 VUSB_DET27 USB_D+26 USB_D-GND100nF5RSVD52RSVD74RSVDGNDRTC back-up27pF 27pF 27pF82nH54SPK_N53SPK_P39MIC_N40MIC_PESDHeadset ConnectorESDINOUTGNDLow Noise LDO Regulator 3V82.2k2.2k10µF2.2k2.2k 10µF2V5Sense lines connected  to GND in one star point82nH27pF10µFESD ESDu-blox1.8V GPS Receiver4.7kOUTINGNDLDO RegulatorSHDNSDASCL4.7k3V8 1V8_GPSSDA2SCL2GPIO3GPIO4TxD1EXTINT04645232447kVCCGPIO2 21ANT 68 Antenna1.8V DTE1.8V SPI MasterUSB 2.0 Host1.8V Digital Audio DeviceI2S_RXDI2S_CLKI2S Data OutputI2S ClockI2S_TXDI2S_WAI2S Data InputI2S Word Alligment44434241LISA-U120/ U130 only20 GPIO13V8Network Indicator22 RESET_NFerrite Bead47pFApplication ProcessorOpen Drain Output19 PWR_ON100kΩOpen Drain Output0Ω0ΩTPTPFunctions not supported by LISA-U1xx-00 versions0Ω0ΩTPTP Figure 52: Example of schematic diagram to integrate LISA-U1 series modules in an application board, using all the interfaces
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 99 of 160 Figure 53 is an example of a schematic diagram where a LISA-U2 series module is integrated into an application board, using all the interfaces of the module. TXDRXDRTSCTSDTRDSRRIDCDGND15 TXD12 DTR16 RXD13 RTS14 CTS9DSR10 RI11 DCDGND3V8330µF 39pF GND10nF100nF 10pFLISA-U2 series62 VCC63 VCC61 VCC+100µF2V_BCKPMOSIMISOSCLKInterruptGPIOGND56 SPI_MOSI59 SPI_MRDY57 SPI_MISO55 SPI_SCLK58 SPI_SRDYGNDVBUSD+D-GND18 VUSB_DET27 USB_D+26 USB_D-GND100nF5RSVD74ANT_DIVGNDRTC back-upu-blox1.8V GPS Receiver4.7kOUTINGNDLDO RegulatorSHDNSDASCL4.7k3V8 1V8_GPSSDA2SCL2GPIO3GPIO4TxD1EXTINT04645232447kVCCGPIO2 21ANT 68Main Tx/Rx  Antenna1.8V DTE1.8V SPI MasterUSB 2.0 Host20 GPIO13V8Network Indicator22 RESET_NFerrite Bead47pFApplication ProcessorOpen Drain Output19 PWR_ON100kΩOpen Drain Output0Ω0ΩTPTPFunctions not supported by LISA-U200-00 version0Ω0ΩTPTP1.8V Digital Audio DeviceI2S_RXDI2S_CLKI2S Data OutputI2S ClockI2S_TXDI2S_WAI2S Data InputI2S Word Alligment44434241V_INTBCLKLRCLK10µF1µFAudio Codec MAX9860SDINSDOUTSDASCL53I2S1_CLK54I2S1_WA40I2S1_TXD39I2S1_RXD52CODEC_CLK MCLKIRQn10k100nFVDDSPKOUTPOUTN27pF 27pF ESD ESDMICMICBIAS 1µF 2.2k1µF1µF82nHMICLNMICLP82nHMICGND2.2kESD ESD27pF27pFV_INTRx Diversity Antenna LISA-U230 only47pFSIM Card HolderCCVCC (C1)CCVPP (C6)CCIO (C7)CCCLK (C3)CCRST (C2)GND (C5)47pF 47pF 100nF50VSIM48SIM_IO47SIM_CLK49SIM_RST47pFSW1 SW24V_INT51GPIO5470k1kESD ESD ESD ESD ESD ESDV_INT Figure 53: Example of schematic diagram to integrate LISA-U2 series modules in an application board, using all the interfaces
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 100 of 160 1.15 Approvals LISA-U series modules have been or will be approved under the following schemes:  [EU] R&TTE      (Radio and Telecommunications Terminal Equipment Directive)  [EU] CE      (Conformité Européenne)  [EU] GCF – CC    (Global Certification Forum-Certification Criteria)  [EU] GCF – FT    (Global Certification Forum- Field Trials)  [USA] FCC      (Federal Communications Commission)  [USA] PTCRB    (PCS Type Certification Review Board)  [Canada] IC     (Industry Canada)  [South Africa] ICASA   (Independent Communications Authority of South Africa)  [Australia] a-tick  [Korea] KCC     (Korean Communications Commission)  [Japan] JATE     (Japan Approvals Institute for Telecommunications Equipment)  [Japan] TELEC    (Telecom Engineering Center)  [Taiwan] NCC    (National Communications Commission) LISA-U series modules will be approved by the following network operators:  [USA] AT&T  [Canada] Rogers  [EU][AUS] Vodafone  [AUS] Telstra  [EU] Tmobile  [Japan] NTTDoCoMo  [EU] Orange  1.15.1 R&TTED and European Conformance CE mark Products bearing the CE marking comply with the R&TTE Directive (99/5/EC),  EMC Directive (89/336/EEC) and the Low Voltage Directive (73/23/EEC) issued by the Commission of the European Community. Compliance with these directives implies conformity to the following European Norms:  Radio Frequency spectrum efficiency: o EN 301 511 o EN 301 908-1 o EN 301 908-2  Electromagnetic Compatibility: o EN 301 489-1 o EN 301 489-7 o EN 301 489-24  Safety o EN 60950-1: 2006 o EN62311: 2008 Notified Body identification number for LISA-U100, LISA-U110, LISA-U120 and LISA-U130 is 0890. Notified Body identification number for LISA-U200 is 0682.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 101 of 160 1.15.2 IC The IC Certification Numbers for the LISA-U series modules are:  LISA-U100: 8595A-LISAU120  LISA-U120: 8595A-LISAU120  LISA-U200: 8595A-LISAU200  1.15.3 Federal communications commission notice The FCC ID for the LISA-U series modules are  LISA-U100: XPYLISAU120  LISA-U120: XPYLISAU120  LISA-U200: XPYLISAU200  1.15.3.1 Safety Warnings review the structure  Equipment for building-in. The requirements for fire enclosure must be evaluated in the end product  The  clearance  and  creepage  current  distances  required  by  the  end  product  must  be  withheld  when  the module is installed  The cooling of the end product shall not negatively be influenced by the installation of the module  Excessive sound pressure from earphones and headphones can cause hearing loss  No natural rubbers, no hygroscopic materials nor materials containing asbestos are employed  1.15.3.2 Declaration of Conformity - United States only This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions:  this device may not cause harmful interference  this device must accept any interference received, including interference that may cause undesired operation   Radiofrequency  radiation  exposure  Information:  this  equipment complies  with FCC  radiation exposure  limits  prescribed  for  an  uncontrolled  environment  for  fixed  and  mobile  use conditions. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and the body of the user or nearby persons.  This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.  The  gain  of  the  system  antenna(s)  used  for  LISA-U200  (i.e.  the  combined  transmission  line, connector, cable losses and radiating element gain) must not exceed  4.25 dBi (850 MHz) and 2.74 dBi (1900 MHz) for mobile and fixed or mobile operating configurations.  The  gain  of  the  system  antenna(s)  used  for  LISA-U230  (i.e.  the  combined  transmission  line, connector,  cable  losses  and  radiating  element  gain)  must  not  exceed  4.78  dBi  (850  MHz), 7.55 dBi  (1700  MHz)  and  3.95  dBi  (1900  MHz)  for  mobile  and  fixed  or  mobile  operating configurations.  1.15.3.3 Modifications The  FCC requires  the  user  to  be  notified  that  any changes  or modifications  made  to this  device  that are  not expressly approved by u-blox could void the user's authority to operate the equipment.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 102 of 160  Manufacturers  of  mobile  or  fixed  devices  incorporating  the  LISA-U  series  modules  are authorized  to  use  the  FCC  Grants  and  Industry  Canada  Certificates  of  the  LISA-U  series modules for their own final products according to the conditions referenced in the certificates.  The FCC Label shall in the above case be visible from the outside, or the host device shall bear a second label stating: LISA-U100: "Contains FCC ID: XPYLISAU120" resp. LISA-U120: "Contains FCC ID: XPYLISAU120" resp. LISA-U200: "Contains FCC ID: XPYLISAU200" resp. LISA-U230: "Contains FCC ID: XPYLISAU230" resp.  The IC Label shall in the above case be visible from the outside, or the host device shall bear a second label stating: LISA-U100: "Contains IC: 8595A-LISAU120" resp. LISA-U120: "Contains IC: 8595A-LISAU120" resp. LISA-U200: "Contains IC: 8595A-LISAU200" resp.  LISA-U230: "Contains IC: 8595A-LISAU230" resp.  Canada, Industry Canada (IC) Notices This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Operation is subject to the following two conditions: o this device may not cause interference o this device must accept any interference, including interference that may cause undesired operation of the device Radio Frequency (RF) Exposure Information The radiated output power  of the u-blox Wireless  Module is below  the Industry Canada (IC) radio frequency exposure limits. The u-blox Wireless Module should be used in such a manner such that the potential for human contact during normal operation is minimized. This  device  has  been  evaluated  and  shown  compliant  with  the  IC  RF  Exposure  limits  under mobile exposure conditions (antennas are greater than 20cm from a person's body). This device has been certified for use in Canada. Status of the listing in the Industry Canada’s REL  (Radio  Equipment  List)  can  be  found  at  the  following  web  address: http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=eng Additional  Canadian  information  on  RF  exposure  also  can  be  found  at  the  following  web address: http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.html  IMPORTANT: Manufacturers of portable applications incorporating the  LISA-U series modules are  required  to  have  their  final  product  certified  and  apply  for  their  own  FCC  Grant  and Industry Canada Certificate related to the specific portable device. This is mandatory to meet the SAR requirements for portable devices. Changes  or  modifications  not  expressly  approved  by  the  party  responsible  for  compliance could void the user's authority to operate the equipment.  Canada, avis d'Industrie Canada (IC) Cet appareil numérique de classe B est conforme aux normes canadiennes ICES-003 et RSS-210. Son fonctionnement est soumis aux deux conditions suivantes: o cet appareil ne doit pas causer d'interférence o cet  appareil  doit  accepter  toute  interférence,  notamment  les  interférences  qui  peuvent affecter son fonctionnement Informations concernant l'exposition aux fréquences radio (RF) La puissance de sortie émise par l’appareil de sans fil u-blox Wireless Module est inférieure à la limite d'exposition aux fréquences radio d'Industrie Canada (IC). Utilisez l’appareil de sans fil u-blox Wireless Module de façon à minimiser les contacts humains lors du fonctionnement normal.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  System description      Page 103 of 160 Ce périphérique  a été  évalué et  démontré conforme aux limites d'exposition aux fréquences radio (RF) d'IC lorsqu'il est installé dans des produits hôtes particuliers qui fonctionnent dans des  conditions  d'exposition  à  des  appareils  mobiles  (les  antennes  se  situent  à  plus  de  20 centimètres du corps d'une personne). Ce  périphérique  est  homologué  pour  l'utilisation  au  Canada.  Pour  consulter  l'entrée correspondant  à  l’appareil  dans  la  liste  d'équipement  radio  (REL  -  Radio  Equipment  List) d'Industrie Canada rendez-vous sur: http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=fra Pour des informations supplémentaires concernant l'exposition aux RF au Canada rendez-vous sur : http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.html  IMPORTANT:  les  fabricants  d'applications  portables  contenant  les  modules  LISA-U1  series doivent  faire  certifier  leur  produit  final  et  déposer  directement  leur  candidature  pour  une certification FCC  ainsi que  pour un certificat  Industrie Canada délivré par l'organisme chargé de ce type d'appareil portable. Ceci est obligatoire afin d'être en accord avec les exigences SAR pour les appareils portables. Tout changement ou modification non expressément approuvé par la partie responsable de la certification peut annuler le droit d'utiliser l'équipement.  1.15.4 a-tick AUS Certification   The equipment may not function when mains power fail either on the packaging or with the equipment.   LISA-U200-00 and LISA-U230-01 versions are not a-tick AUS certified.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 104 of 160 2 Design-In 2.1 Design-in checklist This section provides a design-in checklist. 2.1.1 Schematic checklist The following are the most important points for a simple schematic check:  DC supply must provide a nominal voltage at VCC pin above the minimum operating range limit.  DC supply must be capable of providing 2.5 A current pulses, providing a voltage at VCC pin above the minimum operating range limit and with a maximum 400 mV voltage drop from the nominal value.  VCC supply should be clean, with very low ripple/noise: suggested passive filtering parts can be inserted.  VCC voltage must ramp from 2.5 V to 3.2 V within 1 ms to allow a proper switch-on of the module.  Connect only one DC supply to VCC: different DC supply systems are mutually exclusive.  Do not leave PWR_ON floating: add a pull-up resistor to V_BCKP.  Don’t apply loads which might exceed the limit for maximum available current from V_INT supply.  Check that voltage level of any connected pin does not exceed the relative operating range.  Capacitance and series resistance must be limited on each SIM signal to match the SIM specifications.  Insert the suggested low capacitance ESD protection and passive filtering parts on each SIM signal.  Check UART signals direction, since the signal names follow the ITU-T V.24 Recommendation [4].  Provide  appropriate  access  to  USB  interface  and/or  to  UART  RxD,  TxD  lines  and  access  to  PWR_ON and/or RESET_N lines on the application board in order to flash/upgrade the module firmware.  Provide appropriate access to USB interface and/or to UART RxD, TxD, CTS, RTS lines for debugging.  Capacitance and series resistance must be limited on each line of the SPI / IPC interface.  Add a proper pull-up resistor to a proper supply on each DDC (I2C) interface line, if the interface is used.  Capacitance and series resistance must be limited on each line of the DDC interface.  Use transistors with at least an integrated resistor in the base pin or otherwise put a 10  kΩ resistor on the board in series to the GPIO when those are used to drive LEDs.  Connect the pin number 5 (RSVD) to ground.  Insert the suggested passive filtering parts on each used analog audio line.  Check the digital audio interface specifications to connect a proper device.  Capacitance and series resistance must be limited on CODEC_CLK line and each I2S interface line.  Provide proper precautions for ESD immunity as required on the application board.  Any external signal connected to the UART interface, SPI/IPC interface, I2S interfaces and GPIOs must be tri-stated when the module is in power-down mode, when the external reset is forced low and during the module power-on sequence (at least  for 3  s  after the start-up event), to avoid latch-up of circuits and let a proper boot of the module.  All  unused  pins  can  be  left  floating  on  the  application  board  except  the  PWR_ON  pin  (must  be connected to V_BCKP by a pull-up resistor) and the RSVD pin number 5 (must be connected to GND).
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 105 of 160 2.1.2 Layout checklist The following are the most important points for a simple layout check:  Check 50   nominal characteristic  impedance  of the  RF transmission  line  connected to the  ANT  pad (main RF input/output) and to the ANT_DIV pad (RF input for Rx diversity).  Follow the recommendations of the antenna producer for correct antenna installation and deployment (PCB layout and matching circuitry).  Ensure  no  coupling  occurs  with  other  noisy  or  sensitive  signals  (primarily  analog  audio  input/output signals, SIM signals).  VCC line should be wide and short.  Route VCC supply line away from sensitive analog signals.  The high-power audio outputs lines on the application board must be wide enough to minimize series resistance.  Ensure proper grounding.  Consider “No-routing” areas for the Data Module footprint.  Optimize placement for minimum length of RF line and closer path from DC source for VCC.  Design USB_D+ / USB_D- connection as 90  differential pair.  Keep routing short and minimize parasitic capacitance on the SPI lines to preserve signal integrity.  Keep routing short and minimize parasitic capacitance on CODEC_CLK line to preserve signal integrity.  2.1.3 Antenna checklist  Antenna should have 50  impedance, V.S.W.R less than 3:1 (recommended 2:1)on operating bands in deployment geographical area.  Follow the recommendations of the antenna producer for correct antenna installation and deployment (PCB layout and matching circuitry).  Follow the additional guidelines for products marked with the FCC logo (United States only) reported in chapter 2.2.1.1 and 1.15.3.2  The  antenna  connected  to  the  ANT  pad  should  have  built  in  DC  resistor  to  ground  to  get  proper antenna detection functionality.  The antenna for the Rx diversity connected to the ANT_DIV pin should be carefully separated from the main  Tx/Rx  antenna  connected  to  the  ANT  pin  to ensure  highly  uncorrelated  receive  signals  on each antenna.  The  distance  between  the  two  antennas  should  be  greater  than  half  a  wavelength  of  the lowest used frequency (i.e. distance greater than ~20 cm, for 2G/3G low bands) to distinguish between different multipath channels, for proper spatial diversity implementation.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 106 of 160 2.2 Design Guidelines for Layout The  following  design  guidelines  must  be  met  for  optimal  integration  of  LISA-U  series  modules  on  the  final application board.  2.2.1 Layout guidelines per pin function This section groups LISA-U series modules pins by signal function and provides a ranking of importance in layout design. V_BCKPGNDV_INTRSVDGNDGNDGNDDSRRIDCDDTRGNDRTSCTSTXDRXDGNDVUSB_DETPWR_ONGPIO1GPIO2RESET_NGPIO3GPIO4GNDUSB_D-USB_D+234567891011121131415161718192021222324252627GNDVCCVCCVCCGNDSPI_MRDYSPI_SRDYSPI_MISOSPI_MOSISPI_SCLKSPK_NGNDSPK_PRSVDGPIO5VSIMSIM_RSTSIM_IOSIM_CLKSDASCLI2S_RXDI2S_CLKI2S_TXDI2S_WAMIC_PMIC_N6463626160595857565554655352515049484746454443424140392930313233343536373828GNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGND7574737271706968676676GNDRSVDGNDGNDGNDGNDGNDANTGNDGNDGNDLISA-U1 series(Top View)V_BCKPGNDV_INTRSVDGNDGNDGNDDSRRIDCDDTRGNDRTSCTSTXDRXDGNDVUSB_DETPWR_ONGPIO1GPIO2RESET_NGPIO3GPIO4GNDUSB_D-USB_D+234567891011121131415161718192021222324252627GNDVCCVCCVCCGNDSPI_MRDY / GPIO14SPI_SRDY / GPIO13SPI_MISO / GPIO12SPI_MOSI / GPIO11SPI_SCLK / GPIO10GPIO9 / I2S1_WAGNDGPIO8 / I2S1_CLKRSVD / CODEC_CLKGPIO5VSIMSIM_RSTSIM_IOSIM_CLKSDASCLRSVD / I2S_RXDRSVD / I2S_CLKRSVD / I2S_TXDRSVD / I2S_WAGPIO7 / I2S1_TXDGPIO6 / I2S1_RXD6463626160595857565554655352515049484746454443424140392930313233343536373828GNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGND7574737271706968676676GNDGNDGNDGNDGNDGNDANTGNDGNDGND/ RSVDANT_DIVLISA-U2 series(Top View)Very ImportantCareful LayoutCommon PracticeLegend: Figure 54: LISA-U1 and LISA-U2 series modules pin-out (top view) with ranked importance for layout design
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 107 of 160 Rank Function Pin(s) Layout Remarks 1st RF Antenna     Main RF input/output  Very Important Design for 50  characteristic impedance. See section 2.2.1.1  RF input for Rx diversity  Very Important Design for 50  characteristic impedance. See section 2.2.1.1 2nd Main DC Supply  Very Important VCC line should be wide and short. Route away from sensitive analog signals.  See section 2.2.1.2 3rd USB Signals   Very Important Route USB_D+ and USB_D- as differential lines: design for 90  differential impedance. See section 2.2.1.3 4th Analog Audio  Careful Layout Avoid coupling with noisy signals. See section 2.2.1.4 Audio Inputs MIC_P, MIC_N Audio Outputs SPK_P, SPK_N 5th Ground GND Careful Layout Provide proper grounding. See section 2.2.1.5 6th Sensitive Pin:  Careful Layout Avoid coupling with noisy signals. See section 2.2.1.6 Backup Voltage V_BCKP Power-On PWR_ON 7th High-speed digital pins:  Careful Layout Avoid coupling with sensitive signals. See section 2.2.1.7 SPI Signals SPI_SCLK, SPI_MISO, SPI_MOSI, SPI_SRDY, SPI_MRDY  Clock Output CODEC_CLK   8th Digital pins and supplies:  Common Practice Follow common practice rules for digital pin routing. See section 2.2.1.8 SIM Card Interface VSIM, SIM_CLK, SIM_IO, SIM_RST Digital Audio (If implemented) I2S_CLK, I2S_RXD, I2S_TXD, I2S_WA I2S1_CLK, I2S1_RXD, I2S1_TXD, I2S1_WA DDC SCL, SDA UART TXD, RXD, CTS, RTS, DSR, RI, DCD, DTR External Reset RESET_N General Purpose I/O GPIO1, GPIO2, GPIO3, GPIO4, GPIO5 GPIO6, GPIO7, GPIO8, GPIO9, GPIO10, GPIO11, GPIO12, GPIO13, GPIO14 USB detection VUSB_DET Supply for Interfaces V_INT Table 44: Pin list in order of decreasing importance for layout design  2.2.1.1 RF antenna connection  The ANT pin (main RF input/output) and the ANT_DIV pin (RF input for diversity receiver provided by LISA-U230 modules) are very critical in layout design. The PCB line must be designed to provide 50  nominal characteristic impedance and minimum loss up to radiating element.  Provide proper transition between the ANT pad and the ANT_DIV pad to application board PCB  Increase GND keep-out (i.e. clearance) for ANT and ANT_DIV pads to at least 250 µm up to adjacent pads metal definition and up to 500 µm on the area below the module, as described in Figure 55 USB_D- USB_D+ VCC ANT ANT_DIV
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 108 of 160  Add GND keep-out (i.e. clearance) on buried metal layers below  ANT and ANT_DIV  pads and  below  any other  pad  of  component  present  on  the  RF  line,  if  top-layer  to  buried  layer  dielectric  thickness  is  below 200 µm, to reduce parasitic capacitance to ground (see Figure 55 for the description of the GND keep-out area below ANT and ANT_DIV pads)  The transmission line up to antenna connector or pad may be a micro strip or a stripline. In any case must be designed to achieve 50 Ω characteristic impedance  Microstrip lines are usually easier to implement and the reduced number of layer transitions up to antenna connector simplifies the design and diminishes reflection losses. However, the electromagnetic field extends to the free air interface above the stripline and may interact with other circuitry  Buried striplines exhibit better shielding to external and internally generated interferences. They are therefore preferred for sensitive application. In case a stripline is implemented, carefully check that the via pad-stack does not couple with other signals on the crossed and adjacent layers  Minimize  the transmission  line length; the insertion loss should be  minimized  as  much as possible,  in the order of a few tenths of a dB  The transmission line should not have abrupt change to thickness and spacing to GND, but must be uniform and routed as smoothly as possible  The transmission line must be routed in a section of the PCB where minimal interference from noise sources can be expected  Route RF transmission line far from other sensitive circuits as it is a source of electromagnetic interference  Avoid coupling with VCC routing and analog audio lines  Ensure solid metal connection of the adjacent metal layer on the PCB stack-up to main ground layer  Add GND vias around transmission line  Ensure no other signals are routed parallel to transmission line, or that other signals cross on adjacent metal layer  If  the  distance  between  the  transmission  line  and  the  adjacent  GND  area  (on  the  same  layer)  does  not exceed  5  times  the  track  width  of  the  micro  strip,  use  the  “Coplanar  Waveguide”  model  for  50  Ω characteristic impedance calculation  Don’t route microstrip line below discrete component or other mechanics placed on top layer  When terminating transmission  line on  antenna  connector  (or antenna  pad) it is  very  important to strictly follow the connector manufacturer’s recommended layout  GND  layer  under  RF  connectors  and  close  to  buried  vias  should  be  cut  out  in  order  to  remove  stray capacitance and thus keep the RF line 50 Ω. In most cases the large active pad of the integrated antenna or antenna  connector  needs  to  have  a  GND  keep-out  (i.e.  clearance)  at  least  on  first  inner  layer  to  reduce parasitic  capacitance  to  ground.  Note  that  the  layout  recommendation  is  not  always  available  from connector  manufacturer:  e.g.  the  classical  SMA  Pin-Through-Hole  needs  to  have  GND  cleared  on  all  the layers around the central pin up to annular pads of the four GND posts. Check 50 Ω impedance of ANT and ANT_DIV lines  Ensure no coupling occurs with other noisy or sensitive signals  The antenna for the Rx diversity should be carefully separated from the main Tx/Rx antenna to ensure  that uncorrelated signals  are received at each antenna,  because signal improvement is dependent on the cross correlation and relative  signal strength levels between the two  received signals. The distance between the two antennas should be greater than half a wavelength of the lowest used frequency (i.e. distance greater than ~20 cm, for 2G/3G low bands) to distinguish between different multipath channels, for proper spatial diversity implementation
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 109 of 160 Min. 500 umMin. 250 umTop layer Buried metal layerGND planeMicrostrip50 ohm Figure 55: GND keep-out area on top layer around ANT and ANT_DIV pads and on buried layer below ANT and ANT_DIV pads   Any RF transmission line on PCB should be designed for 50 Ω characteristic impedance.  Ensure no coupling occurs with other noisy or sensitive signals.  Additional guidelines for products marked with the FCC logo - United States only LISA-U series modules can only be used with a host antenna circuit trace layout according to these guidelines; a host system designer must follow the guidelines to keep the original Grant of LISA-U series modules.  Strict compliance to the layout reference design already approved (described in the following guidelines) is required to ensure that only approved antenna shall be used in the host system.  If in a host system there is any difference from the trace layout already approved, it requires a Class II permissive change or a new grant as appropriate as FCC defines. Compliance of this device in all final host configurations is the responsibility of the Grantee.  The approved reference design for LISA-U series modules has a structure of 4 layers described in the following. The  Layer 1  (top layer,  see Figure  56) provides  a micro  strip line to  connect the  ANT pin  of the  LISA-U series module to the antenna connector. The ANT pin of the LISA-U series module must be soldered on the designed pad  which  is connected  to  the  antenna  connector  by  a micro  strip.  The  characteristics  of the  micro  strip  line (coplanar wave guide) are the following:  Thickness = 0.035 mm  Width = 0.26 mm  Length = 7.85 mm  Gap (signal to GND) = 0.5 mm The micro strip line must  be designed to achieve  50  Ω characteristic impedance: the  dimensions  of  the micro strip line must be calculated in a host system according to PCB characteristics provided by PCB manufacturer.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 110 of 160 Pad designed for the ANT pinAntenna connectorMicrostrip line Figure 56: Layer 1 (top layer) of u-blox approved interface board for LISA-U series modules The thickness of the dielectric (FR4 Prepreg 1080) from Layer 1 (top layer) to Layer 2 (inner layer) is 0.27 mm. The Layer 2 (inner layer, described in Figure 57) provides a GND plane. Layer 2 thickness is 0.035 mm.  Figure 57: Layer 2 (inner layer) of u-blox approved interface board for LISA-U series modules The dielectric thickness (FR4 Laminate 7628) from Layer 2 (inner layer) to Layer 3 (inner layer) is 0.76 mm. The Layer 3 (inner layer, described in Figure 58) is designed for signals routing and GND plane. Layer 3 thickness is 0.035 mm.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 111 of 160  Figure 58: Layer 3 (inner layer) of u-blox approved interface board for LISA-U series modules The dielectric thickness (FR4 Prepreg 1080) from Layer 3 (inner layer) to Layer 4 (bottom layer) is 0.27 mm. The Layer 4 (bottom layer, described in  Figure 59) is designed for signals routing,  components placement and GND plane. Layer 4 thickness is 0.035 mm.  Figure 59: Layer 4 (bottom layer) of u-blox approved interface board for LISA-U series modules  The antenna gain must not exceed the levels reported in the chapter  1.15.3.2 to preserve the original u-blox FCC ID.  The antenna must be installed and operated with a minimum distance of 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Under the requirements of FCC Section 15.212(a)-iv, the module must contain a permanently attached antenna, or contain an unique antenna connector, and be marketed and operated only with specific antenna(s).  In accordance  with FCC Section  15.203,  the  antenna  should use  a  unique coupling  connector  to  the approved  reference  design  for  LISA-U  series modules,  to  ensure that  the  design  will  not  be  deployed with antenna of different characteristic from the approved type.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 112 of 160 The use of standard SMA type connector is not permitted, as its standard usage allows easy replacement of the attached antenna. However RP-SMA (Reverse-Polarized-SMA) connector type fulfills the minimum requirements to prevent exchangeability of antenna on the reference design.  2.2.1.2 Main DC supply connection The DC supply of LISA-U series modules is very important for the overall performance and functionality of the integrated  product.  For  detailed  description,  check  the  design  guidelines  in  section  1.5.2.  Some  main characteristics are:  VCC pins are internally connected, but it is recommended to use all the available pins in order to minimize the power loss due to series resistance  VCC  connection  may  carry  a  maximum  burst  current  in  the  order  of  2.5  A.  Therefore,  it  is  typically implemented as a wide PCB line with short routing from DC supply (DC-DC regulator, battery pack, etc)  The  module  automatically  initiates  an  emergency  shutdown  if  supply  voltage  drops  below  hardware threshold. In addition, reduced supply voltage can set a worst case operation point for RF circuitry that may behave incorrectly. It follows that each voltage drop in the DC supply track will restrict the operating margin at the main DC source output. Therefore, the PCB connection must exhibit a minimum or zero voltage drop. Avoid any series component with Equivalent Series Resistance (ESR) greater than a few milliohms  Given  the  large burst  current,  VCC  line  is a  source  of  disturbance for  other  signals.  Therefore  route  VCC through a PCB area separated from sensitive analog signals. Typically it is good practice to interpose at least one layer of PCB ground between VCC track and other signal routing  The  VCC  supply  current  supply  flows  back  to  main  DC  source  through  GND  as  ground  current:  provide adequate return path with suitable uninterrupted ground plane to main DC source  A tank capacitor with low ESR is often used to smooth current spikes. This is most effective when placed as close as possible to VCC. From main DC source, first connect the capacitor and then  VCC. If the main DC source is a switching DC-DC converter, place the large capacitor close to the DC-DC output and minimize the VCC track length. Otherwise consider using separate capacitors for DC-DC converter and LISA-U series module tank capacitor. Note  that the capacitor voltage  rating may  be adequate to  withstand the  charger over-voltage if battery-pack is used  VCC is directly connected to the RF power amplifiers. Add capacitor in the pF range from VCC to GND along the supply path  Since  VCC  is  directly  connected  to  RF  Power  Amplifiers,  voltage  ripple  at  high  frequency  may  result  in unwanted spurious modulation of transmitter RF signal. This is more likely to happen with switching DC-DC converters, in which case it is better to select the highest operating frequency  for the  switcher and add a large L-C filter before connecting to the LISA-U series modules in the worst case  The large current generates a magnetic field that is not well isolated by PCB ground layers and which may interact with other analog modules (e.g. VCO) even if placed on opposite side of PCB. In this case route VCC away from other sensitive functional units  The typical GSM burst has a periodic nature of approx. 217 Hz, which lies in the audible audio range. Avoid coupling between VCC and audio lines (especially microphone inputs)  If  VCC  is  protected  by  transient  voltage  suppressor  /  reverse  polarity  protection  diode  to  ensure  that  the voltage maximum ratings are not exceeded, place the protecting device along the path from the DC source toward  the  LISA-U  series  module,  preferably  closer  to  the  DC  source  (otherwise  functionality  may  be compromised)   VCC line should be wide and short.  Route away from sensitive analog signals.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 113 of 160 2.2.1.3 USB signal The LISA-U series modules include a high-speed USB 2.0 compliant interface with a maximum throughput of 480 Mb/s (see Section 1.9.3). Signals USB_D+ / USB_D- carry the USB serial data and signaling. The lines are used in single ended mode for relatively low speed signaling handshake, as well as in differential mode for fast signaling and data transfer. Characteristic impedance of USB_D+ / USB_D- lines is specified by USB standard. The most important parameter is the differential characteristic impedance applicable for odd-mode electromagnetic field, which should be as close as possible to 90  differential: signal integrity may be degraded if PCB layout is not optimal, especially when the USB signaling lines are very long.  Route USB_D+ / USB_D- lines as a differential pair  Ensure the differential characteristic impedance is as close as possible to 90   Consider design rules for USB_D+ / USB_D- similar to RF transmission lines, being them coupled differential micro-strip or buried stripline: avoid any stubs, abrupt change of layout, and route on clear PCB area  2.2.1.4 Analog audio (LISA-U120 / LISA-U130 only) Accurate analog audio design is very important to obtain clear and high quality audio. The GSM signal burst has a repetition rate of 217 Hz that lies in the audible range. A careful layout is required to reduce the risk of noise from audio lines due to both VCC burst noise coupling and RF detection. Analog audio is separated in the two paths, 1. Audio Input (uplink path): MIC_P / MIC_N 2. Audio Outputs (downlink path): SPK_P / SPK_N  The most sensitive is the uplink path, since the analog input signals are in the microVolts range.   Avoid coupling of any noisy signals to microphone input lines  It is strongly recommended to route  MIC signals away  from battery and RF antenna lines. Try to skip fast switching digital lines as well  Keep ground separation from other noisy signals. Use  an intermediate GND layer or vias wall for coplanar signals  MIC_P  and  MIC_N  are  sensed  differentially  within  the  module.  Therefore  they  should  be  routed  as  a differential pair up to the audio signal source  Cross other signals lines on adjacent layers with 90° crossing  Place bypass capacitor for RF very close to active microphone. The preferred microphone should be designed for GSM applications which typically have internal built-in bypass capacitor for RF very close to active device. If  the  integrated  FET  detects  the  RF  burst,  the  resulting  DC  level  will  be  in  the  pass-band  of  the  audio circuitry and cannot be filtered by any other device  The bias for an external electret active microphone is not provided by the module. Verify that microphone is properly biased from an external low noise supply and verify that the supply noise is properly filtered  Output audio lines have two separated configurations.  SPK_P /  SPK_N  are  high  level  balanced  output.  They  are  DC  coupled  and  must  be  used  with  a  speaker connected in bridge configuration  Route SPK_P / SPK_N as differential pair, to reduce differential noise pick-up. The balanced configuration will help reject the common mode noise  Consider enlarging PCB lines, to reduce series resistive losses, when the audio output is directly connected to low impedance speaker transducer  Use twisted pair cables for balanced audio usage
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 114 of 160  If  DC  decoupling  is  required,  a  large  capacitor  needs  to  be  used,  typically  in  the  microFarad  range, depending on the load impedance, in order to not increase the lower cut-off frequency of its High-Pass RC filter response  2.2.1.5 Module grounding Good  connection  of  the  module  with  application  board  solid  ground  layer  is  required  for  correct  RF performance. It significantly reduces EMC issues and provides a thermal heat sink for the module.  Connect each GND pin with application board solid GND layer. It is strongly recommended that each GND pad surrounding VCC pins have one or more dedicated via down to the application board solid ground layer  The  shielding  metal tabs  are  connected  to  GND,  and  are  a  fundamental  part  of  electrical  grounding  and thermal heat-sink.  Connect  them to  board solid  ground layer,  by  soldering  them  on  the  baseboard using PCB plated through holes connected to GND net  If  the  application  board  is  a  multilayer  PCB,  then  it  is  required  to  connect  together  each  GND  area  with complete via stack down to main board ground layer  It is recommended to implement one layer of the application board as ground plane  Good grounding of GND pads will also ensure thermal heat sink. This is critical during call connection, when the real network commands the module  to transmit  at maximum  power: proper  grounding helps prevent module overheating  2.2.1.6 Other sensitive pins A few other pins on the LISA-U series modules requires careful layout.  RTC  supply  (V_BCKP): avoid injecting  noise on this voltage  domain as it may  affect the stability of sleep oscillator  Power-On (PWR_ON): is the digital input to switch-on the LISA-U series modules. Ensure that the voltage level is well defined during operation and no transient noise is coupled on this line, otherwise the module might detect a spurious power-on request  2.2.1.7 High-speed digital pins The following high speed digital pins require careful layout:  Serial  Peripheral  Interface  (SPI):  can  be  used  for  high  speed  data  transfer  (UMTS/HSPA)  between  the LISA-U  series  modules  and  the  host  processor,  with  a  data  rate  up  to  26  Mb/s  (see  Section  1.9.3).  The high-speed  data  rate  is  carried  by  signals  SPI_SCLK,  SPI_MISO  and  SPI_MOSI,  while  SPI_SRDY  and SPI_MRDY behave as handshake signals with relatively low activity  Digital  Clock  Output  (CODEC_CLK):  can  be  used  to  provide  a  26  MHz  or  13  MHz  digital  clock  to  an external audio codec Follow these hints for high speed digital pins layout:  High-speed signals become sources of digital noise, route away from RF and other sensitive analog signals Keep routing short and minimize parasitic capacitance to preserve digital signal integrity
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 115 of 160 2.2.1.8 Digital pins and supplies  External Reset (RESET_N): input for external reset, a logic low voltage will reset the module  SIM Card Interface (VSIM, SIM_CLK, SIM_IO, SIM_RST): the SIM layout may be critical if the SIM card is placed far away from the LISA-U series modules or in close proximity to the RF antenna. In the first case the long connection can cause the radiation of some harmonics of the digital data frequency. In the second case the same  harmonics can  be picked  up and create self-interference  that can reduce the  sensitivity of GSM Receiver channels whose carrier frequency is coincidental with harmonic frequencies. The latter case, placing the  RF  bypass  capacitors,  suggested  in  Figure  21,  near  the  SIM  connector  will  mitigate  the  problem.  In addition, since the SIM card is typically accessed by the end user, it can be subjected to ESD discharges: add adequate ESD protection to protect module SIM pins near the SIM connector  Digital Audio  (I2S_CLK, I2S_RX, I2S_TX, I2S_WA and I2S1_CLK, I2S1_RXD, I2S1_TXD, I2S1_WA): the I2S interface requires the same consideration regarding electro-magnetic interference as the SIM card. Keep the traces short and avoid coupling with RF line or sensitive analog inputs  DDC  (SCL,  SDA):  the  DDC  interface  requires  the  same  consideration  regarding  electro-magnetic interference as the SIM card. Keep the traces short and avoid coupling with RF line or sensitive analog inputs  UART  (TXD,  RXD,  CTS,  RTS,  DSR,  RI,  DCD,  DTR):  the  serial  interface  requires  the  same  consideration regarding electro-magnetic interference as the SIM card. Keep the traces short and avoid coupling with RF line or sensitive analog inputs  General Purpose I/O (GPIOx): the general purpose input/output pins are generally not critical for layout  Reserved pins: these pins are reserved for future use. Leave them unconnected on the baseboard  USB  detection (VUSB_DET):  this  input  will  generate  an  interrupt  to  the  baseband  processor  for  USB detection. The USB supply (5.0 V typ.) must be provided to VUSB_DET by the connected USB host to enable the USB interface of the module  Interfaces  Supply (V_INT):  this  supply  output  is  generated  by  an  integrated  switching  step  down converter, used internally to supply the digital interfaces. Because of this, it can be a source of noise: avoid coupling with sensitive signals
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 116 of 160 2.2.2 Footprint and paste mask The following figure describes the footprint and provides recommendations for the paste mask for LISA-U series modules. These are recommendations only and not specifications. Note that the copper and solder masks have the same size and position. 33.2 mm [1307.1 mil] 22.4 mm [881.9 mil]2.3 mm [90.6 mil]0.8 mm [31.5 mil]1.1 mm [43.3 mil]0.8 mm [31.5 mil]1.0 mm [39.3 mil]5.7 mm [224.4 mil]33.2 mm [1307.1 mil] 22.4 mm [881.9 mil]2.3 mm [90.6 mil]1.2 mm [47.2 mil]1.1 mm [43.3 mil]0.8 mm [31.5 mil]0.9 mm [35.4 mil]5.7 mm [224.4 mil]0.6 mm [23.6 mil]Stencil: 150 µm Figure 60: LISA-U series modules suggested footprint and paste mask To improve the wetting of the half vias, reduce the amount of solder paste under the module and increase the volume outside of the module by defining the dimensions of the paste mask to form a T-shape (or equivalent) extending beyond the copper mask. The solder paste should have a total thickness of 150 µm.   The  paste  mask  outline  needs  to  be  considered  when  defining  the  minimal  distance  to  the  next component.  The  exact  geometry,  distances,  stencil  thicknesses  and  solder  paste  volumes  must  be  adapted  to  the specific production processes (e.g. soldering etc.) of the customer.  The bottom layer of LISA-U1 series modules has one unprotected copper area for GND, shown in Figure 61. The bottom layer of LISA-U2 series modules has two unprotected copper areas for GND, shown in Figure 62.   Consider “No-routing” areas for the LISA-U series modules footprint as follows: signal keep-out area on the top layer of the application board, below  LISA-U series modules, due to GND opening on module bottom layer (see Figure 61 and Figure 62).
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 117 of 160 33.2 mm11.85 mm22.4 mm5.3 mm 5.25 mm1.4 mm1.0 mmPIN 1LISA-U1 bottom side (through module view)Exposed GND on LISA-U1 module bottom layerSignals keep-out area on application board Figure 61: Signals keep-out area on the top layer of the application board, below LISA-U1 series modules  33.2 mm5.25 mm22.4 mm5.3 mm 5.25 mm5.3 mm1.3 mm1.4 mm1.0 mmPIN 1LISA-U2 bottom side (through module view)Exposed GND on LISA-U2 module bottom layerSignals keep-out areas on application board Figure 62: Signals keep-out areas on the top layer of the application board, below LISA-U2 series modules
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 118 of 160 2.2.3 Placement Optimize placement for minimum length of RF line and closer path from DC source for VCC. Make sure that RF and analog circuits are clearly separated from any other digital circuits on the system board. Provide enough clearance between the module and any external part due to solder and paste masks design. Milled edges that are present at module PCB corners, away from module pins metallization, can slightly increase module dimensions from the width and the height described in the mechanical specifications sections of LISA-U1 series Data Sheet [1] and LISA-U2 series Data Sheet [2]: provide enough clearance between module PCB corners and any other external part mounted on the application board.   The  heat  dissipation  during  continuous  transmission  at  maximum  power  can  significantly  raise  the temperature of the application base-board below the LISA-U series modules: avoid placing temperature sensitive devices (e.g. GPS receiver) close to the module.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 119 of 160 2.3 Thermal aspects  The operating temperature range is specified in  LISA-U1 series Data Sheet [1] and LISA-U2 series Data Sheet [2].  The most critical condition concerning thermal performance is the uplink transmission at maximum power (data upload or voice call in connected mode), when the baseband processor runs at full speed, radio circuits are all active and the RF power amplifier is driven to higher output RF power. This scenario is not often encountered in real networks; however the application should be correctly designed to cope with it. During transmission at maximum RF power the LISA-U series modules generate thermal power that can exceed 2 W: this is an indicative value since the exact generated power strictly depends on operating condition such as the number of allocated TX slot and modulation (GMSK or 8PSK) or data rate (WCDMA), transmitting frequency band,  etc.  The generated  thermal  power must  be  adequately  dissipated  through  the  thermal  and mechanical design of the application. The Module-to-Ambient thermal resistance (Rth,M-A) of LISA-U series modules mounted on a 90 mm x 70 mm x 1.46 mm 4-Layers PCB with a high coverage of copper in still air conditions ranges between 9 and 12 °C/W. The spreading  of  Rth,M-A  depends  on  the  operating  condition  (e.g.  2G  or  3G  mode,  transmit  band):  the  overall temperature distribution is influenced by the configuration of the active components during the specific mode of operation and their different thermal resistance toward the case interface. With this setup, the increase of the module temperature5 referred to idle state initial condition6 is:  around 7°C during a voice call at maximum power  19°C during GPRS data transfer with 4 TX slots  16°C during EDGE data transfer with 4 TX slots  up to 25°C in UMTS connection at max TX power   Case-to-Ambient  thermal  resistance  value  will  be  different  for  other  mechanical  deployments  of  the module, e.g. PCB with different size and characteristics, mechanical shells enclosure, or forced air flow.  The increase of thermal dissipation, i.e. reducing the thermal resistance, will decrease the operating temperature for  internal  circuitry  of  LISA-U  series  modules  for  a  given  operating  ambient  temperature.  This  improves  the device long-term reliability for applications operating at high ambient temperature. A few techniques may be used to reduce the thermal resistance in the application:  Forced ventilation air-flow within mechanical enclosure  Heat sink attached to the module top side, with electrically insulated / high thermal conductivity adhesive, or on the backside of the application board, below the wireless module  Connect each GND pin with solid ground layer of the application board and connect each ground area of the multilayer application board with complete via stack down to main ground layer For example, after the installation of a robust aluminum heat-sink with forced air ventilation on the back of the same  application  board  described  above,  the  Module-to-Ambient  thermal  resistance  is  reduced  to 1.5 ÷ 3.5 °C/W. The effect of lower Rth,M-A can be seen from the module temperature which now becomes:  around 1.5°C above the ambient temperature during a voice call at maximum power  3°C during GPRS data transfer with 4 TX slots  2.5°C during EDGE data transfer with 4 TX slots  5.5°C in UMTS connection at max TX power                                                        5 Temperature is measured by internal sensor of wireless module 6 Steady state thermal equilibrium is assumed. The module’s temperature in idle state can be considered equal to ambient temperature
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 120 of 160 2.4 Antenna guidelines Antenna characteristics are essential for good functionality of the module. Antenna radiating performance has direct impact on the reliability of connections over the Air Interface. A bad termination of the ANT pin (main RF input/output) and the ANT_DIV pin (RF input for diversity receiver provided by LISA-U230 modules) can result in poor performance of the module. The following parameters should be checked:  Item Recommendations  Impedance 50 Ω nominal characteristic impedance  Frequency Range Depends on the LISA-U series module HW version and on the Mobile Network used. LISA-U100, LISA-U120:  824..960 MHz (GSM 850, GSM 900, UMTS B5)  1710..1990 MHz (GSM 1800, GSM 1900, UMTS B2) LISA-U110, LISA-U130:  824..960 MHz (GSM 850, GSM 900, UMTS B8)  1710..2170 MHz (GSM 1800, GSM 1900, UMTS B1) LISA-U200-00:  824..960 MHz (GSM 850, GSM 900, UMTS B5, UMTS B6)  1710..2170 MHz (GSM 1800, GSM 1900, UMTS B1, UMTS B2) LISA-U200-01, LISA-U230-01:  824..960 MHz (GSM 850, GSM 900, UMTS B5, UMTS B6, UMTS B8)  1710..2170 MHz (GSM 1800, GSM 1900, UMTS B1, UMTS B2, UMTS B4)  Input Power >2 W peak  V.S.W.R <2:1 recommended, <3:1 acceptable  Return Loss S11<-10 dB recommended, S11<-6 dB acceptable Table 45: General recommendation for GSM antenna  The antenna gain  shall remain  below  the levels  reported  in the  chapter  1.15.3.2  to  preserve the original u-blox FCC ID.  Please  note  that  some  2G  and  3G  bands  are  overlapping.  This  depends  on  worldwide  band  allocation  for telephony services, where different bands are deployed for different geographical regions.  If the LISA-U110, LISA-U130 or LISA-U2 series modules are planned for use on the entire supported bands, then an antenna that supports the 824..960 MHz and the 1710..2170 MHz frequency range should be selected. If the LISA-U100  or  LISA-U120  modules  are  planned  for  use  with  the  entire  range  of  supported  bands,  then  an antenna  that  supports  the  824..960  MHz  and  the  1710..1990  MHz  frequency  range  should  be  selected. Otherwise, for fixed applications in specific geographical region, antenna requirements can be relaxed for non-deployed frequency bands. Refer to the operating RF frequency bands table in LISA-U1 series Data Sheet [1] and LISA-U2 series Data Sheet [2] for the detailed uplink and downlink frequency ranges of each supported band. LISA-U230 modules provide 2G and 3G dynamic receive diversity (Rx diversity) capability to improve the quality and  reliability  of  the  wireless  link.  This  feature  can  be  optionally  used  connecting  a  second  antenna  to  the ANT_DIV pin, to receive an RF input signal that is processed by the module to increase the performance. All the antenna guidelines and recommendations reported are applicable also to the Rx diversity antenna design, even if the antenna for the Rx diversity is not used to transmit. GSM antennas are typically available as:  Linear  monopole:  typical  for  fixed  applications.  The  antenna  extends  mostly  as  a  linear  element  with  a dimension comparable to lambda/4 of the lowest frequency of the operating band. Magnetic base may be available.  Cable  or  direct  RF  connectors  are  common  options.  The  integration  normally  requires  the fulfillment of some minimum guidelines suggested by antenna manufacturer  Patch-like antenna: better suited for  integration in compact designs (e.g. mobile phone).  These are mostly custom  designs where the  exact  definition of  the PCB  and product  mechanical  design is fundamental  for tuning of antenna characteristics
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 121 of 160 For integration observe these recommendations:  Ensure 50 Ω antenna termination, minimize the V.S.W.R. or return loss, as this will optimize the electrical performance of the module. See section 2.4.1  Select antenna with best radiating performance. See section 2.4.2  If a cable is used to connect the antenna radiating element to application board, select a short cable with minimum insertion loss. The higher the additional insertion loss due to low quality or long cable, the lower the connectivity  Follow the recommendations of the antenna manufacturer for correct installation and deployment  Do not include antenna within closed metal case  Do not place the main antenna in close vicinity to end user since the emitted radiation in human tissue is limited by S.A.R. regulatory requirements  Do not use directivity antenna since the electromagnetic field radiation intensity is limited in some countries  Take care of interaction between co-located RF systems since the GSM transmitted power may interact or disturb the performance of companion systems  Place  antenna  far  from  sensitive  analog  systems  or  employ  countermeasures  to  reduce  electromagnetic compatibility issues that may arise  The  antenna  for  the  Rx  diversity  should  be  carefully  separated  from  the  main  Tx/Rx  antenna  to  ensure uncorrelated  signals  received  at  each  antenna,  because  signal  improvement  is  dependent  on  the  cross correlation and relative  signal strength levels between the two  received signals. The distance between the two antennas should be greater than half a wavelength of the lowest used frequency (i.e. distance greater than ~20 cm, for 2G/3G low bands) to distinguish between different multipath channels 2.4.1 Antenna termination The LISA-U series modules are designed to work on a 50  load. However, real antennas have no perfect 50  load on all the supported frequency bands. Therefore, to reduce as much as possible performance degradation due to antenna mismatch, the following requirements should be met: Measure the antenna termination with a network analyzer: connect the antenna through a coaxial cable to the measurement device, the |S11| indicates which portion of the power is delivered to antenna and which portion is reflected by the antenna back to the module output. A  good  antenna  should  have  an  |S11|  below  -10  dB  over  the  entire  frequency  band.  Due  to  miniaturization, mechanical constraints and other design issues, this value will not be achieved. An |S11| value of about -6 dB - (in the worst case) - is acceptable. Figure 63 shows an example of this measurement:  Figure 63: |S11| sample measurement of a penta-band antenna that covers in a small form factor the 4 GSM bands (850 MHz, 900 MHz, 1800 MHz and 1900 MHz) and the UMTS Band I
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 122 of 160 Figure 64 shows comparable measurements performed on a wideband antenna. The termination is better, but the size of the antenna is considerably larger.  Figure 64: |S11| sample measurement of a wideband antenna 2.4.2 Antenna radiation An indication of the antenna’s radiated power can be approximated by measuring the |S21| from a target antenna to  the  measurement  antenna,  using  a  network  analyzer  with  a  wideband  antenna.  Measurements  should  be done at a fixed distance and orientation, and results compared to measurements performed on a known good antenna.  Figure  65  through  Figure  66  show  measurement  results.  A wideband  log  periodic-like  antenna  was used, and the comparison was done with a half lambda dipole tuned at 900 MHz frequency. The measurements show both the |S11| and |S21| for the penta-band internal antenna and for the wideband antenna.     Figure 65: |S11| and |S21| comparison between a 900 MHz tuned half wavelength dipole (green/purple) and a penta-band internal antenna (yellow/cyan) The  half  lambda  dipole tuned at  900 MHz  is  known and  has good radiation  performance (both  for gain and directivity). Then, by comparing the |S21| measurement with antenna under investigation for the frequency where the half dipole is tuned (e.g. marker 3 in Figure 65) it is possible to make a judgment on the antenna under test: if the performance is similar then the target antenna is good.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 123 of 160  Figure  66:  |S11|  and  |S21|  comparison  between  a  900  MHz  tuned  half  wavelength  dipole  (green/purple)  and  a  wideband commercial antenna (yellow/cyan) Instead if |S21| values for the tuned dipole are much better than the antenna under evaluation (like for marker 1/2 area of Figure 66, where dipole is 5 dB better), then it can be argued that the radiation of the target antenna (the wideband dipole in this case) is considerably less. The same procedure should be repeated on other bands with half wavelength dipole re-tuned to the band under investigation.   For good antenna radiation performance, antenna dimensions should be comparable to a quarter of the wavelength. Different antenna types can be used for the module, many of them (e.g. patch antennas, monopole)  are  based  on  a  resonating  element  that  works  in  combination  with  a  ground  plane.  The ground  plane,  ideally  infinite,  can  be  reduced  down  to  a  minimum  size  that  must  be  similar  to  one quarter  of  the  wavelength  of  the  minimum  frequency  that  has  to  be  radiated  (transmitted/received). Numerical sample: frequency = 1 GHz  wavelength = 30 cm  minimum ground plane (or antenna size) = 7.5 cm. Below this size, the antenna efficiency is reduced.  2.4.3 Antenna detection functionality The internal antenna detect circuit is based on ADC measurement at ANT: the RF port is DC coupled to the ADC unit in the baseband chip which injects a DC current (10 µA for 128 µs) on ANT and measures the resulting DC voltage to evaluate the resistance from ANT pad to GND. The antenna detection is forced by the +UANTR AT command: refer to the u-blox AT Commands Manual [3] for more details on how to access this feature. To achieve antenna detection functionality, use an RF antenna with built-in resistor from ANT signal to GND, or implement  an  equivalent  solution  with  a  circuit  between  the  antenna  cable  connection  and  the  radiating element as shown in Figure 67.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 124 of 160 Application Board Antenna AssemblyDiagnostic CircuitLISA-U seriesADCCurrent SourceRF ChokeDC BlockingFront-End RF ModuleRF ChokeDC BlockingRadiating ElementZo=50 ΩResistor for DiagnosticCoaxial Antenna CableANT Figure 67: Antenna detection circuit and antenna with diagnostic resistor Examples of components for the antenna detection diagnostic circuit are reported in the following table:  Description Part Number - Manufacturer DC Blocking Capacitor  Murata GRM1555C1H220JA01 or equivalent RF Choke Inductor Murata LQG15HS68NJ02, LQG15HH68NJ02 or equivalent (Self Resonance Frequency ~1GHz) Resistor for Diagnostic  15 k 5%, various Manufacturers Table 46: Example of components for the antenna detection diagnostic circuit Please note that the DC impedance at RF port for some antennas may be a DC open (e.g. linear monopole) or a DC short to reference GND (e.g. PIFA antenna). For those antennas, without the diagnostic circuit of Figure 67, the measured DC resistance will always be at the limits of the measurement range (respectively open or short), and  there  will  be  no  mean  to  distinguish  between  a  defect  on  antenna  path  with  similar  characteristics (respectively: removal of linear antenna or RF cable shorted to GND for PIFA antenna). Furthermore, any other DC  signal injected to the RF connection from ANT connector to radiating element will alter the measurement and produce invalid results for antenna detection.  It is recommended to use an antenna with a built-in diagnostic resistor in the range from 5 kΩ to 30 kΩ to assure good antenna detection functionality and to avoid a reduction of module RF performance. The choke  inductor  should  exhibit  a  parallel  Self  Resonance  Frequency  (SRF)  in  the  range  of  1  GHz  to improve the RF isolation of load resistor.  For example: Consider a GSM antenna with built-in DC load resistor of 15 k. Using the +UANTR AT command, the module reports the resistance value evaluated from ANT connector to GND:  Reported values close  to the  used diagnostic  resistor  nominal value  (i.e. values from  13 kΩ  to 17  kΩ if  a 15 kΩ diagnostic resistor is used) indicate that the antenna is properly connected
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 125 of 160  Values  close  to  the  measurement  range  maximum  limit  (approximately  50  kΩ)  or  an  open-circuit “over range” report (see u-blox AT Commands Manual [3]) means that that the antenna is not connected or the RF cable is broken  Reported  values  below  the  measurement  range  minimum  limit  (1  kΩ)  will  highlight  a  short  to  GND  at antenna or along the RF cable  Measurement inside the valid measurement range and outside the expected range may indicate an improper connection, damaged antenna or wrong value of antenna load resistor for diagnostic  Reported  value  could  differ  from  the  real  resistance  value  of  the  diagnostic  resistor  mounted  inside  the antenna assembly due to antenna cable length, antenna cable capacity and the used measurement method
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 126 of 160 2.5 ESD precautions  2.5.1 ESD immunity test overview The  immunity  of  the  device  (i.e.  the  application  board  where  LISA-U  series  module  is  mounted)  to  the Electrostatic Discharge (ESD) must be certified in compliance to the testing standard CENELEC EN 61000-4-2 [10] and the radio equipment standards ETSI EN 301 489-1 [11], ETSI EN 301 489-7 [12], ETSI EN 301 489-24 [13], which requirements are summarized in Table 47. The ESD  immunity test is  performed  at the enclosure  port, defined  by ETSI EN  301 489-1  [11] as the  physical boundary through  which  the electromagnetic field radiates. If  the device  implements an integral antenna, the enclosure port is seen as all insulating and conductive surfaces  housing the device. If the device implements a removable antenna, the antenna port can be separated from the enclosure port. The antenna port includes the antenna element and its interconnecting cable surfaces. The applicability of ESD immunity test to the whole device depends on the device classification as defined by ETSI EN 301 489-1 [11]. Applicability of ESD immunity test to the relative device ports or the relative interconnecting cables  to  auxiliary  equipments,  depends  on  device  accessible  interfaces  and  manufacturer  requirements,  as defined by ETSI EN 301 489-1 [11]. Contact  discharges  are  performed  at  conductive  surfaces,  while  air  discharges  are  performed  at  insulating surfaces. Indirect contact discharges are performed  on the measurement setup horizontal and vertical coupling planes as defined in CENELEC EN 61000-4-2 [10].   For  the definition  of  integral  antenna,  removable  antenna,  antenna  port,  device  classification  refer  to ETSI EN 301 489-1 [11].  The contact and air discharges are defined in CENELEC EN 61000-4-2 [10].  Application Category Immunity Level All exposed surfaces of the radio equipment and ancillary equipment in a representative configuration Contact Discharge 4 kV Air Discharge 8 kV Table 47:  Electromagnetic Compatibility ESD immunity requirements as  defined by  standards CENELEC EN 61000-4-2, ETSI EN 301 489-1 V1.8.1, ETSI EN 301 489-7 V1.3.1, ETSI EN 301 489-24 V1.4.1  2.5.2 ESD immunity test of LISA-U series reference design Although  electromagnetic  compatibility  (EMC)  certification  must  be  performed  by  the  final  application  of  the radio  equipment  under  test  (i.e.  the  application  board  where  LISA-U  series  module  is  mounted),  EMC certification  (including  ESD  immunity)  have  been  successfully  performed  on  LISA-U1  series  and  LISA-U200-00 modules reference design according to CENELEC EN 61000-4-2 [10], ETSI EN 301 489-1 [11], ETSI EN 301 489-7 [12] and ETSI EN 301 489-24 [13] standards. The  EMC  approved  reference  design  consists  of  a  LISA-U1  series  or  a  LISA-U200-00  module  soldered  on  a motherboard  which  provides  an  interface  to  power  supply,  SIM  card,  headset  and  communication  port.  An external antenna is connected to an SMA connector provided on the motherboard. Since an external antenna  is used, the antenna port can be separated from the enclosure port. The reference design is not enclosed in a box so the enclosure port is not indentified with physical surfaces. Therefore, some test cases cannot be applied. Only the antenna port is identified as accessible for direct ESD exposure. The reference application  implements all precautions described  in the  section 2.5.3. ESD immunity test  results and  applicability  are  reported  in  Table  48  according  to  test  requirements  CENELEC  EN  61000-4-2  [10],  ETSI EN 301 489-1 [11], ETSI EN 301 489-7 [12] and ETSI EN 301 489-24 [13].
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 127 of 160 Category Application Immunity Level Contact Discharge to coupling planes (indirect contact discharge) Enclosure +2 kV / -2 kV +4 kV / -4 kV Contact Discharges to conducted surfaces (direct contact discharge) Enclosure port Not Applicable7 Contact Discharges to conducted surfaces (direct contact discharge) Antenna port (only antenna with completely insulating surface can be used) Not Applicable8 Air Discharge at insulating surfaces Enclosure port Not Applicable9 Air Discharge at insulating surfaces Antenna port +2 kV /   (only antenna with completely insulating surface can be used) +4 kV /   +8 kV /  Table 48: Enclosure ESD immunity level (as defined by standards CENELEC EN 61000-4-2, ETSI EN 301 489-1 V1.8.1, ETSI EN 301 489-7 V1.3.1, ETSI EN 301 489-24 V1.4.1) of LISA-U1 series and LISA-U200-00 modules application reference design                                                        7 LISA-U1 series or LISA-U200-00 module mounted on application design: Not Applicability: EUT with insulating enclosure surface, EUT without enclosure surface Applicability: EUT with conductive enclosure surface 8 LISA-U1 series or LISA-U200-00 module mounted on application design: Not Applicability: Antenna with insulating surface Applicability: Antenna with conductive surface 9 LISA-U1 series or LISA-U200-00 module mounted on application design: Applicability: EUT with insulating enclosure surface Not Applicability: EUT with conductive enclosure surface, EUT without enclosure surface
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 128 of 160 2.5.3 ESD application circuits The  application circuits  described in  this  section  should  be implemented,  depending  on  the  application  board handling, to satisfy ESD immunity test requirements. These are  defined in CENELEC EN 61000-4-2 [10], ETSI EN 301  489-1  [11]  and  ETSI  EN  301  489-7  [12],  and  performed  at  the  device  enclosure  in  compliance  to  the category level defined in ETSI EN 301 489-1 [11]. The test requirements are summarized in Table 47.  Antenna interface  With  LISA-U1  series  modules,  the  ANT  pin  provides  ESD  immunity  up  to  500  V  (contact  and  air  discharge according to IEC 61000-4-2): higher protection level  is required if the line is externally accessible on the  device (i.e. the application board where LISA-U1 series module is mounted). The  following  precautions  are  suggested  to  satisfy  ESD  immunity  test  requirements  using  LISA-U1  series modules:  If  the  device  implements  an  embedded  antenna,  the  insulating  enclosure  of  the  device  should  provide protection to direct contact discharge up to +4 kV / -4 kV and protection to air discharge up to +8 kV / -8 kV to the antenna interface  If  the  device  implements  an  external  antenna,  the  antenna  and  its  connecting  cable  should  provide  a completely insulated enclosure able to provide protection to direct contact discharge up to +4 kV / -4 kV and protection to air discharge up to +8 kV / -8 kV to the whole antenna and cable surfaces  With the LISA-U200-00 module, the ANT pin provides  ESD immunity up to 1000 V (contact and air discharge according to IEC 61000-4-2): higher protection level  is required if the line is externally accessible on the  device (i.e. the application board where LISA-U200-00 module is mounted). The  following  precautions  are  suggested  for  satisfying  ESD  immunity  test  requirements  using  LISA-U200-00 modules:  If the device implements an embedded antenna, the device insulating enclosure should provide protection to direct  contact  discharge  up  to +4  kV  /  -4 kV  and  protection  to air  discharge  up  to  +8 kV  /  -8  kV  to the antenna interface  If  the  device  implements  an  external  antenna,  the  antenna  and  its  connecting  cable  should  provide  a completely insulated enclosure able to provide protection to direct contact discharge up to +4 kV / -4 kV and protection to air discharge up to +8 kV / -8 kV to the whole antenna and cable surfaces  If  the  device  implements  an  external  antenna  and  the  antenna  and  its  connecting  cable  don’t  provide  a completely insulated enclosure able to provide protection to direct contact discharge up to +4 kV / -4 kV and protection to air discharge up to +8 kV /  -8 kV to the whole antenna and cable surfaces, an external high pass filter, consisting  of  a series 15  pF capacitor  (Murata  GRM1555C1H150JA01)  and a  shunt 39  nH coil (Murata LQG15HN39NJ102) should be implemented at the antenna port as described in Figure 68   Antenna  detection  functionality  is  not  provided  when  implementing  the  high  pass  filter  described  in Figure 68 and Table 49, as ESD protection for the LISA-U200-00 antenna port.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 129 of 160 External Antenna EnclosureApplication BoardLISA-U200-00ANTRadiating ElementZo = 50 OhmCoaxial Antenna CableAntenna PortEnclosure PortCL Figure 68: LISA-U200-00 antenna port ESD immunity protection application circuit Reference Description Part Number - Manufacturer C 15 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H150JA01 - Murata L 39 nH Multilayer Chip Inductor L0G 0402 5% LQG15HN39NJ102 - Murata Table 49: Example of components for LISA-U200-00 antenna port ESD immunity protection application circuit  With  LISA-U230  modules,  the  ANT_DIV  pin  provides  ESD  immunity  up  to  +4  kV  /  -4  kV  for  direct  Contact Discharge and up to +8 kV / -8 kV for Air Discharge: no further precaution to ESD immunity test is needed.  RESET_N pin The  following  precautions  are  suggested  for  the  RESET_N  line  of  LISA-U  series  modules,  depending  on  the application board handling, to satisfy ESD immunity test requirements:  A 47  pF bypass capacitor (e.g. Murata GRM1555C1H470JA01)  must be  mounted  on  the line  termination connected to the RESET_N pin to avoid a module reset caused by an electrostatic discharge applied to the application board enclosure  A series ferrite bead (e.g. Murata BLM15HD182SN1) must be added on the line connected to the RESET_N pin to avoid a module reset caused by an electrostatic discharge applied to the application board enclosure  An additional 220  nF bypass  capacitor (e.g. Murata  GRM155R60J224KE01)  must be mounted as  close as possible to the RESET_N pin of LISA-U2 series modules to avoid a module reset caused by an electrostatic discharge applied to the application board enclosure  It is recommended to keep the connection line to RESET_N as short as possible Maximum ESD sensitivity rating of the RESET_N pin is 1 kV (Human Body Model according to JESD22-A114F). Higher protection level could be required if the  RESET_N pin is externally accessible on the application board. The following precautions are suggested to achieve higher protection level:  A  general  purpose  ESD  protection  device  (e.g.  EPCOS  CA05P4S14THSG  varistor  array  or  EPCOS CT0402S14AHSG varistor) should be mounted on the RESET_N line, close to accessible point For the RESET_N application circuit description refer to Figure 20 and Table 18 reported in section 1.6.3.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Design-In      Page 130 of 160 SIM interface The  following  precautions  are  suggested  for  LISA-U  series  modules  SIM  interface  (VSIM,  SIM_RST,  SIM_IO, SIM_CLK pins), depending on the application board handling, to satisfy ESD immunity test requirements:  A  47  pF  bypass  capacitor  (e.g.  Murata  GRM1555C1H470J)  must  be  mounted  on  the  lines  connected  to VSIM,  SIM_RST,  SIM_IO  and  SIM_CLK  pins  to  assure  SIM  interface  functionality  when  an  electrostatic discharge is applied to the application board enclosure  It is suggested to use as short as possible connection lines at SIM pins Maximum ESD sensitivity rating of SIM interface pins is 1 kV (Human Body Model according to JESD22-A114F). Higher protection level could be required if SIM interface pins are externally accessible on the application board. The following precautions are suggested to achieve higher protection level:  A  low  capacitance  (i.e.  less  than  10  pF)  ESD  protection  device  (e.g.  Infineon  ESD8V0L2B-03L  or  AVX USB0002)  should be  mounted  on each  SIM  interface  line, close  to  accessible  points (i.e. close  to the  SIM card holder) For the SIM interface application circuit description refer to Figure 21 and Table 21 reported in section 1.8.  Other pins and interfaces All the module pins that are externally  accessible on the device (i.e. the application board where  LISA-U series module  is  mounted)  should  be  included  in  the  ESD  immunity  test  since  they  are  considered  to  be  a  port  as defined  in  ETSI  EN  301  489-1 [11].  Depending  on  applicability,  to  satisfy  ESD  immunity  test  requirements according to ESD category level, all the module pins that are externally accessible should be protected up to +4 kV  /  -4  kV  for  direct  Contact  Discharge  and  up  to  +8  kV  /  -8  kV  for  Air  Discharge  applied  to  the  enclosure surface. The maximum ESD sensitivity rating of all the other pins of the module is 1 kV (Human Body Model according to JESD22-A114F).  Higher  protection  level  could  be  required  if  the  relative  pin  is  externally  accessible  on  the application board. The following precautions are suggested to achieve higher protection level:  USB interface: a very low capacitance (i.e. less or equal to 1 pF) ESD protection device (e.g. Tyco Electronics PESD0402-140 ESD protection device) should be mounted on the USB_D+ and USB_D- lines, close to the accessible points (i.e. close to the USB connector)  SPI interface: a low capacitance (i.e. less than 10 pF) ESD protection device (e.g.  Infineon ESD8V0L2B-03L or  AVX  USB0002)  should  be  mounted  on  the  SPI_MISO,  SPI_MOSI,  SPI_SCLK,  SPI_MRDY,  SPI_SRDY lines, close to accessible points  CODEC_CLK: a low capacitance (i.e. less than 10 pF) ESD protection device (e.g. Infineon ESD8V0L2B-03L or AVX USB0001) should be mounted on the CODEC_CLK line, close to accessible point  Other pins: a general purpose ESD protection device (e.g. EPCOS CA05P4S14THSG varistor array or EPCOS CT0402S14AHSG varistor) should be mounted on the relative line, close to accessible point
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Features description      Page 131 of 160 3 Features description  3.1 Firmware (upgrade) Over AT (FOAT)   Not supported by LISA-U1xx-00 modules. 3.1.1 Overview This feature allows upgrading the module Firmware over UART and USB, using AT Commands.  AT Command AT+UFWUPD triggers a reboot followed by  the upgrade procedure at specified  a baud rate (refer to u-blox AT Commands Manual [3] for more details)  The Xmodem-1k protocol is used for downloading the new Firmware image via a terminal application  A special boot loader on the module performs firmware installation, security verifications and module reboot  Firmware authenticity verification is performed via a security signature during the download. The firmware is then  installed,  overwriting  the  current  version.  In  case  of  power  loss  during  this  phase,  the  boot  loader detects a fault at the next wake-up, and restarts the firmware download from the Xmodem-1k handshake. After completing the upgrade, the module is reset again and wakes-up in normal boot 3.1.2 FOAT procedure The application processor must proceed in the following way:  Send the AT+UFWUPD command through the UART or over the USB interface, specifying the file type and the desired baud rate  Reconfigure the serial communication at the selected baud rate, without flow control with the Xmodem-1k protocol  Send the new FW image via Xmodem-1k  3.2 TCP/IP and UDP/IP Via the AT commands it’s possible to access the TCP/IP and UDP/IP functionalities over the Packet Switched data connection. For more details about AT commands see the u-blox AT Commands Manual [3]. Direct  Link  mode  for  TCP  and  UDP  sockets  is  supported  by  all  LISA-U  series  modules  except  LISA-U1xx-00 versions. Sockets can be set in Direct Link mode to establish a transparent end-to-end communication with an already connected TCP or UDP socket via serial interface. 3.2.1 Multiple PDP contexts and sockets Two PDP context types are defined:  “external” PDP context: IP packets are built by the DTE, the MT’s IP instance runs the IP relay function only  “internal”  PDP  context:  the  PDP  context  (relying on  the  MT’s  TCP/IP  stack)  is configured,  established  and handled  via  the  data  connection  management  packet  switched  data  commands  described  in  u-blox  AT commands manual [3] Multiple  PDP  contexts  are  supported.  The  DTE  can  access  these  PDP  contexts  either  alternatively  through  the physical  serial  port,  or  simultaneously  through  the  virtual  serial  ports  of  the  multiplexer  (multiplexing  mode MUX), with the following constraints:  Using the MT’s embedded  TCP/IP stack, only 1 internal PDP context is supported. This IP instance supports up to 7 sockets
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Features description      Page 132 of 160  Using only external PDP contexts, it is possible to have at most 3 IP instances (with 3 different IP addresses) simultaneously.  If  in  addition  the  internal  PDP  context  is  used,  at  most  2  external  PDP  contexts  can  be activated Secondary  PDP  contexts  (PDP  contexts  sharing  the  IP  address  of  a  primary  PDP  context)  are  also  supported. Traffic Flow Filters for such secondary contexts shall be specified according to 3GPP TS 23.060 [19]. At most 2 secondary PDP contexts can be activated, since the maximum number of PDP contexts, both normal and secondary, is always 3.  3.3 FTP and FTPS  Not supported by LISA-U1xx-00 modules.  LISA-U series modules support the File Transfer Protocol and Secure File Transfer Protocol functionalities via AT commands. Files are read and stored in the local file system of the module. For more details about AT commands see u-blox AT Commands Manual [3].  3.4 HTTP and HTTPS  Not supported by LISA-U1xx-00 modules.  HTTP  and  HTTPS  clients  are  implemented  in  LISA-U  series  modules.  HEAD,  GET,  POST,  DELETE  and  PUT operations are available. The file size to be uploaded / downloaded depends on the free space available in the local file system (FFS) at the moment of the operation. Up to 4 client contexts can be simultaneously used. For more details about AT commands see the u-blox AT Commands Manual [3].  3.5 AssistNow clients and GPS integration  Not supported by LISA-U200-00 modules.  For customers using u-blox GPS receivers, LISA-U series wireless  modules feature embedded AssistNow clients. AssistNow A-GPS provides better GPS performance and faster Time-To-First-Fix. The clients can be enabled and disabled with an AT command (see the u-blox AT Commands Manual [3]). LISA-U  series  modules  act  as  a  stand-alone  AssistNow  client,  making  AssistNow  available  with  no  additional requirements for resources or software integration on an external host micro controller. Full access to u-blox GPS receivers is available via the LISA-U series, through a dedicated DDC (I2C) interface, while the available GPIOs can handle the GPS device power-on/off. This means that GSM/WCDMA and GPS can be controlled through a single serial port from any host processor.  3.6 Jamming Detection  Not supported by LISA-U1xx-00 modules.  In  real  network  situations  modules  can  experience  various  kind  of  out-of-coverage  conditions:  limited  service conditions  when  roaming  to  networks  not  supporting  the  specific  SIM,  limited  service  in  cells  which  are  not suitable or barred due to operators’ choices, no cell condition when moving to poorly served or highly interfered areas. In the latter case, interference can be artificially injected in the environment by a noise generator covering a given spectrum, thus obscuring the operator’s carriers entitled to give access to the GSM/UMTS service.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Features description      Page 133 of 160 The  Jamming  Detection  Feature  detects  such  “artificial”  interference  and  reports  the  start  and  stop  of  such conditions  to  the  client,  which  can  react  appropriately  by  e.g.  switching  off  the  radio  transceiver  in  order  to reduce power consumption and monitoring the environment at constant periods. The feature consists of detecting, at radio resource level, an anomalous source of interference and signaling it to the client with an unsolicited indication when the detection is entered or released. The jamming condition occurs when:  The module has lost synchronization with the serving cell and cannot select any other cell  The band scan reveals at least n carriers with power level equal or higher than threshold  On all such carriers, no synchronization is possible The number of  minimum disturbing carriers and the power level threshold can be configured by the client  by using the AT+UCD command [3]. The jamming condition is cleared when any of the above mentioned statements does not hold. The congestion (i.e. jamming) detection feature can be enabled and configured by the +UCD AT command (for more details refer to the u-blox AT Commands Manual [3]).  3.7 In-Band modem  Not supported by LISA-U100, LISA-U110, LISA-U120-00, LISA-U130-00, LISA-U200-00 modules versions.  LISA-U  series  modules  implements  the  in-Band  modem  solution  for  eCall  according  to  the  3GPP  TS  26.267 specification [14]. According to the eCall (Pan-European automatic in-vehicle emergency call system)  specification, an eCall must be  generated  automatically  or  manually  following  an  car  accident  using  GSM  cellular  service  “112”.  When activated, the in-vehicle eCall system (IVS) creates an emergency call carrying both voice and data (e.g. vehicle GPS position) directly to the nearest 112 Public Safety Answering Point (PSAP) to quickly decide upon detaching rescue services to the known position.  Figure 69: In-Band modem diagram flow In-Band modem allows the fast and reliable transmission of vehicle Minimum Set of Data (MSD - 140 bytes) and the  establishment  of  a  voice  emergency  call  using  the  same  physical  channel  (voice  channel)  without  any modifications of the existing cellular network architecture. In-Band modem is a mandatory feature to meet the eCall requirements and to develop in vehicle devices fully supporting eCall.  3.8 Smart Temperature Management  Wireless modules – independent of the specific model –always have a well defined operating temperature range. This range should be respected to guarantee full device functionality and long life span.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Features description      Page 134 of 160 Nevertheless  there  are  environmental  conditions  that  can  affect  operating  temperature,  e.g.  if  the  device  is located near a heating/cooling source, if there is/isn’t air circulating, etc. The module itself can also influence the environmental conditions; such as when it is transmitting at full power. In this case its temperature increases very quickly and can raise the temperature nearby. The best solution is always to properly design the system where the module is integrated. Nevertheless an extra check/security  mechanism  embedded  into  the  module  is  a  good  solution  to  prevent  operation  of  the  device outside of the specified range. 3.8.1 Smart Temperature Supervisor (STS) The Smart Temperature Supervisor is activated and configured by a dedicated AT+USTS command. Please refer to u-blox AT Commands Manual [3] for more details. The wireless module measures the internal temperature (Ti) and its value is compared with predefined thresholds to identify the actual working temperature range.   Temperature  measurement is done inside the  wireless module: the  measured value  could be  different from the environmental temperature (Ta). Warningareat-1 t+1 t+2t-2Valid temperature rangeSafeareaDangerousarea Dangerousarea Warningarea Figure 70: Temperature range and limits The entire temperature range is divided into sub-regions by limits (see Figure 70) named t-2, t-1, t+1 and t+2.  Within the first limit, (t-1 < Ti < t+1), the wireless module is in the normal working range, the Safe Area  In the Warning Area, (t-2 < Ti < t.1) or (t+1 < Ti < t+2), the wireless module is still inside the valid temperature range, but the measured temperature approaches the limit (upper or lower). The module sends a warning to the user (through the active AT communication interface), which can take, if possible, the necessary actions to return to a safer temperature range or simply ignore the indication. The module is still in a valid and good working condition  Outside the valid temperature range, (Ti < t-2) or (Ti > t+2), the device is working outside the specified range and  represents  a  dangerous  working  condition.  This  condition  is  indicated  and  the  device  shuts down  to avoid damage   For security reasons the shutdown is suspended in case an emergency call in progress. In this case the device will switch off at call termination.  The  user  can  decide  at  anytime  to  enable/disable  the  Smart  Temperature  Supervisor  feature.  If  the feature is disabled there is no embedded protection against disallowed temperature conditions.  Figure 71 shows the flow diagram implemented in LISA-U series modules for the Smart Temperature Supervisor.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Features description      Page 135 of 160 IF STS enabledRead temperatureIF(t-1<Ti<t+1)IF(t-2<Ti<t+2)Send notification (warning)Send notification(dangerous)Wait emergencycall terminationIFemerg. call in progressShut the device downYesNoYesYesNoNoNoYesSend shutdownnotificationFeature enabled (full logic or indication only)IF Full Logic EnabledFeature disabled: no actionTemperature is  within normal operating rangeYesTempetature  is within warning areaTempetature is outside valid temperature rangeNoFeatuere enabled in full logic modeFeature enabled in  indication only mode:no  further actionsSend notification (safe)Previously outside of Safe AreaTempetature  is back to safe areaNoNo furtheractionsYes Figure 71: Smart Temperature Supervisor (STS) flow diagram
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Features description      Page 136 of 160 3.8.2 Threshold Definitions When the application of wireless module operates at extreme temperatures with Smart Temperature Supervisor enabled, the user should note that outside the valid temperature range the device will automatically shut down as described above. The input for the algorithm  is always the temperature measured  within the  wireless module (Ti, internal). This value  can  be  higher  than  the  working  ambient  temperature  (Ta,  ambient),  since  (for  example)  during transmission at maximum power a significant fraction of DC input power is dissipated as heat This behavior is partially  compensated  by  the  definition  of  the  upper  shutdown  threshold  (t+2)  that  is  slightly  higher  than  the declared environmental temperature limit. The temperature thresholds are defined according the Table 50.  Symbol Parameter Temperature Remarks t-2 Low temperature shutdown –40 °C Equal  to  the absolute  minimum temperature rating for  the  wireless module (the lower limit of the extended temperature range) t-1 Low temperature warning –30 °C 10°C above t-2 t+1 High temperature warning +77 °C 20°C  below  t+2.  The  higher  warning  area  for  upper  range  ensures that  any  countermeasures  used  to  limit  the  thermal  heating  will become  effective,  even  considering  some  thermal  inertia  of  the complete assembly. t+2 High temperature shutdown +97 °C Equal  to  the  internal  temperature  Ti  measured  in  the  worst  case operating  condition  at  typical  supply  voltage  when  the  ambient temperature  Ta  in  the  reference  setup  (*)  equals  the  absolute maximum  temperature  rating  (upper  limit  of  the  extended temperature range) (*)LISA-U series module mounted on a 90 mm x 70 mm x 1.46 mm 4-Layers PCB with a high coverage of copper within climatic chamber Table 50: Thresholds definition for Smart Temperature Supervisor on the LISA-U series modules   The sensor measures board temperature inside the shields, which can differ from ambient temperature.  3.9 Hybrid positioning and CellLocate   Not supported by LISA-U1xx-00 and LISA-U200-00 modules versions.  Although GPS is  a widespread  technology, its  reliance  on the  visibility  of extremely  weak  GPS satellite  signals means that positioning is not always possible. Especially difficult environments for GPS are indoors, in  enclosed or  underground  parking  garages,  as  well  as  in  urban  canyons  where  GPS  signals  are  blocked  or  jammed  by multipath interference. The situation can  be improved by augmenting GPS receiver data  with cellular network information to provide positioning information even when GPS reception is degraded or absent. This additional information can benefit numerous applications.  3.9.1 Positioning through cellular information: CellLocate u-blox CellLocate enables the estimation of device position based on the parameters of the mobile network cells visible to the specific device. To estimate its position the u-blox Wireless module sends the CellLocate server the parameters  of  network  cells  visible  to  it  using  a  UDP  connection.  In  return  the  server  provides  the  estimated position based on the CellLocate database. The u-blox Wireless module can either send the parameters of the visible home network cells only (normal scan) or the parameters of all surrounding cells of all mobile operators (deep scan).
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Features description      Page 137 of 160  Normal scan is only possible in 2G mode.  The CellLocate database is compiled from the position of devices which observed, in the past, a specific cell or set of cells (historical observations) as follows:  1. Several devices reported their position to the CellLocate server when observing a specific cell (the As in the picture represent the position of the devices which observed the same cell A)    2. CellLocate server defines the area of Cell A visibility    3. If a  new device  reports the  observation  of  Cell  A  CellLocate  is able to  provide the  estimated position from the area of visibility
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Features description      Page 138 of 160 4. The visibility of multiple cells provides increased accuracy based on the intersection of areas of visibility.    CellLocate is implemented using a set of two AT commands that allow configuration of the CellLocate service (AT+ULOCCELL) and requesting position according to the user configuration (AT+ULOC). The answer is provided in the form of an unsolicited AT command including latitude, longitude and estimated accuracy.   The  accuracy  of  the  position  estimated  by  CellLocate  depends  on  the  availability  of  historical observations in the specific area.  3.9.2 Hybrid positioning With  u-blox  Hybrid  positioning  technology,  u-blox  wireless  devices  can  be  triggered  to  provide  their  current position using either a  u-blox GPS receiver  or  the position estimated  from CellLocate.  The choice depends on which positioning method provides the best and fastest solution according to the user configuration, exploiting the benefit of having multiple and complementary positioning methods. Hybrid positioning is implemented through a set of three AT commands that allow configuration of the GNSS receiver (AT+ULOCGNSS), configuration of the  CellLocate service (AT+ULOCCELL), and requesting the position according  to  the  user  configuration  (AT+ULOC).  The  answer  is  provided  in  the  form  of  an  unsolicited  AT command  including  latitude,  longitude  and  estimated  accuracy  (if  the  position  has  been  estimated  by CellLocate), and additional parameters if the position has been computed by the GNSS receiver. The  configuration  of  mobile  network  cells  does  not  remain  static  (e.g.  new  cells  are  continuously  added  or existing cells are reconfigured by the network operators). For this reason, when a Hybrid positioning method has been  triggered  and  the  GNSS  receiver  calculates  the  position,  a  database  self-learning  mechanism  has  been implemented so that these positions are sent to the server to update the database and maintain its accuracy.  The  use of  hybrid positioning  requires  a  connection  via  the DDC  (I2C)  bus between  the  LISA-U series  wireless module and the u-blox GPS receiver (Refer to chapter 1.10). Refer to GPS Implementation Application Note [16] for the complete description of the feature.   u-blox is  extremely mindful  of user  privacy. When  a position is  sent to  the CellLocate  server u-blox  is unable to track the SIM used or the specific device.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Handling and soldering      Page 139 of 160 4 Handling and soldering   No natural rubbers, no hygroscopic materials or materials containing asbestos are employed.  4.1 Packaging, shipping, storage and moisture preconditioning For  information  pertaining  to  reels  and  tapes,  Moisture  Sensitivity  levels  (MSD),  shipment  and  storage information, as well as drying for preconditioning see the LISA-U1 series Data Sheet [1], the LISA-U2 series Data Sheet [2] and u-blox Package Information Guide [21]. The LISA-U series modules are Electro-Static Discharge (ESD) sensitive devices.  Ensure ESD precautions are implemented during handling of the module.  4.2 Soldering 4.2.1 Soldering paste Use of "No Clean" soldering paste is strongly recommended, as it does not require cleaning after the soldering process has taken place. The paste listed in the example below meets these criteria. Soldering Paste:    OM338 SAC405 / Nr.143714 (Cookson Electronics) Alloy specification:  95.5% Sn / 3.9% Ag / 0.6% Cu (95.5% Tin / 3.9% Silver / 0.6% Copper)       95.5% Sn / 4.0% Ag / 0.5% Cu (95.5% Tin / 4.0% Silver / 0.5% Copper) Melting Temperature:   217°C Stencil Thickness:  150 µm for base boards  The final choice of the soldering paste depends on the approved manufacturing procedures. The paste-mask geometry for applying soldering paste should meet the recommendations in section 2.2.2  The  quality  of  the  solder  joints  on  the  connectors  (’half  vias’)  should  meet  the  appropriate  IPC specification.  4.2.2 Reflow soldering A  convection  type-soldering  oven  is  strongly  recommended  over  the  infrared  type  radiation  oven. Convection  heated  ovens  allow  precise  control  of  the  temperature  and  all  parts  will  be  heated  up  evenly, regardless of material properties, thickness of components and surface color. Consider  the  "IPC-7530  Guidelines  for  temperature  profiling  for  mass  soldering  (reflow  and wave)  processes, published 2001".  Reflow profiles are to be selected according to the following recommendations.  Failure to observe these recommendations can result in severe damage to the device!  Preheat phase Initial heating of component leads and balls. Residual humidity will be dried out. Please note that this preheat phase will not replace prior baking procedures.  Temperature rise rate: max 3°C/s  If the temperature rise is too rapid in the preheat phase it may cause excessive slumping.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Handling and soldering      Page 140 of 160  Time: 60 – 120 s  If  the  preheat  is  insufficient,  rather  large  solder  balls  tend  to  be generated.  Conversely, if  performed  excessively, fine  balls  and  large balls will be generated in clusters.  End Temperature: 150 - 200°C  If  the  temperature  is  too  low,  non-melting  tends  to  be  caused  in areas containing large heat capacity. Heating/ reflow phase The temperature rises above the liquidus temperature of 217°C. Avoid a sudden rise in temperature as the slump of the paste could become worse.  Limit time above 217°C liquidus temperature: 40 - 60 s  Peak reflow temperature: 245°C Cooling phase A  controlled  cooling  avoids  negative  metallurgical  effects  (solder  becomes  more  brittle)  of  the  solder  and possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets with a good shape and low contact angle.  Temperature fall rate: max 4°C / s   To avoid falling off, modules should be placed on the topside of the motherboard during soldering.  The  soldering  temperature  profile  chosen  at  the  factory  depends  on  additional  external  factors  like  choice  of soldering paste, size, thickness and properties of the base board, etc.   Exceeding  the  maximum  soldering  temperature  and  the  maximum  liquidus  time  limit  in  the recommended soldering profile may permanently damage the module. Preheat Heating Cooling[°C] Peak Temp. 245°C [°C]250 250Liquidus Temperature217 217200 20040 - 60 sEnd Temp.max 4°C/s150 - 200°C150 150max 3°C/s60 - 120 s100 Typical Leadfree 100Soldering Profile50 50Elapsed time [s] Figure 72: Recommended soldering profile  LISA-U series modules must not be soldered with a damp heat process.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Handling and soldering      Page 141 of 160 4.2.3 Optical inspection After  soldering  the  LISA-U  series  modules,  inspect  the  modules  optically  to  verify  that  he  module  is  properly aligned and centered. 4.2.4 Cleaning Cleaning  the  soldered  modules  is  not  recommended.  Residues  underneath  the  modules  cannot  be  easily removed with a washing process.  Cleaning with water will lead to capillary effects where water is absorbed in the gap between the baseboard and the module. The combination of residues of soldering flux and encapsulated water leads to short circuits or resistor-like interconnections between neighboring pads. Water will also damage the sticker and the ink-jet printed text.  Cleaning with alcohol or other  organic solvents can result in soldering flux residues flooding  into the two housings, areas that are not accessible for post-wash inspections. The  solvent will also damage the sticker and the ink-jet printed text.  Ultrasonic cleaning will permanently damage the module, in particular the quartz oscillators. For best results use a "no clean" soldering paste and eliminate the cleaning step after the soldering. 4.2.5 Repeated reflow soldering Only a single reflow soldering process is encouraged for boards with a LISA-U series module populated on it. The reason for this is the risk of the module falling off due to high weight in relation to the adhesive properties of the solder. 4.2.6 Wave soldering Boards with combined through-hole technology (THT) components and surface-mount technology (SMT) devices require wave soldering to solder the THT components. Only a single wave soldering process is encouraged for boards populated with LISA-U series modules. 4.2.7 Hand soldering Hand soldering is not recommended. 4.2.8 Rework The LISA-U series modules can be unsoldered from the baseboard using a hot air gun.  Avoid overheating the module. After the module is removed, clean the pads before placing.  Never  attempt  a  rework  on  the  module  itself,  e.g.  replacing  individual  components.  Such actions immediately terminate the warranty.  4.2.9 Conformal coating Certain applications employ a conformal coating of the PCB using HumiSeal® or other related coating products. These materials affect the HF properties of the LISA-U series modules and it is important to prevent them from flowing into the module.  The RF shields do not provide 100% protection for the module from coating liquids with low viscosity, therefore care is required in applying the coating.  Conformal Coating of the module will void the warranty.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Handling and soldering      Page 142 of 160 4.2.10 Casting If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such processes in combination with the LISA-U series modules before implementing this in the production.  Casting will void the warranty. 4.2.11 Grounding metal covers Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the EMI  covers  is  done  at  the  customer's  own  risk.  The  numerous  ground  pins  should  be  sufficient  to  provide optimum immunity to interferences and noise.  u-blox gives no warranty for damages to the LISA-U series modules caused by soldering metal cables or any other forms of metal strips directly onto the EMI covers. 4.2.12 Use of ultrasonic processes LISA-U  series  modules  contain  components  which  are  sensitive  to  Ultrasonic  Waves.  Use  of  any  Ultrasonic Processes (cleaning, welding etc.) may cause damage to the module.  u-blox  gives  no  warranty  against  damages  to  the  LISA-U  series  modules  caused  by  any  Ultrasonic Processes.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Product Testing      Page 143 of 160 5 Product Testing 5.1 u-blox in-series production test u-blox focuses on high quality for its products. All units produced are fully tested. Defective units are analyzed in detail to improve the production quality. This is achieved with automatic test equipment, which delivers a detailed test report for each unit. The following measurements are done:  Digital self-test (firmware download, Flash firmware verification, IMEI programming)  Measurement of voltages and currents  Adjustment of ADC measurement interfaces  Functional  tests  (Serial  interface  communication,  analog  audio  interface,  real  time  clock,  battery  charger, temperature sensor, antenna detection, SIM card communication)  Digital tests (GPIOs, digital interfaces)  Measurement and calibration of RF characteristics in all supported bands (Receiver S/N verification, frequency tuning of reference clock, calibration of transmitter and receiver power levels)  Verification  of  RF  characteristics  after  calibration  (modulation  accuracy,  power  levels  and  spectrum performance are checked to be within tolerances when calibration parameters are applied)   Figure 73: Automatic test equipment for module tests  5.2 Test parameters for OEM manufacturer Because  of  the  testing  done  by  u-blox  (with  100%  coverage),  an  OEM  manufacturer  doesn’t  need  to  repeat firmware tests or measurements of the module RF performance or tests over analog and digital interfaces in their production test. An OEM manufacturer should focus on:  Module assembly on the device; it should be verified that: o Soldering and handling process did not damaged the module components o All module pins are well soldered on device board o There are no short circuits between pins
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Product Testing      Page 144 of 160  Component assembly on the device; it should be verified that: o Communication with host controller can be established o The interfaces between module and device are working o Overall RF performance test of the device including antenna  Dedicated  tests  can  be  implemented  to  check  the  device.  For  example,  the  measurement  of  module  current consumption when set in a specified status can detect a short circuit if compared with a “Golden Device” result. Module AT commands are used to perform functional tests (communication with host controller, check SIM card interface, check communication between module and GPS, GPIOs, etc.) and to perform RF performance tests. 5.2.1 ‘Go/No go’ tests for integrated devices A ‘Go/No go’ test is to compare the signal quality with a “Golden Device” in a position with excellent 2G/3G network coverage and after having dialed a call (refer to u-blox AT Commands Manual [3], AT+CSQ command: <rssi>, <ber> parameters).   These kinds of test may be useful as a ‘go/no go’ test but not for RF performance measurements.  This test is suitable to check the communication with host controller and SIM card, the audio and power supply functionality and verify if components at antenna interface are well soldered.  5.2.2 Functional tests providing RF operation Overall RF performance test of the device including antenna can be performed with basic instruments such as a standard spectrum analyzer and signal generator using an AT interface and AT+UTEST command. The AT+UTEST command gives a simple interface to set the module  to Rx and Tx  test modes  ignoring  2G/3G signaling protocol. The command can set the module:  In transmitting mode in a specified channel and power level in all supported modulation schemes (single slot GMSK, single slot 8PSK, WCDMA) and bands 2G, 3G  In receiving mode in a specified channel to returns the measured power level in all supported bands 2G, 3G   The AT+UTEST command used to perform these functional tests is available on all LISA-U series modules versions except LISA-U1xx-00.  Refer to u-blox AT Commands Manual [3], for AT+UTEST command syntax description.  Refer  to  End  user  test  Application  Note [20],  for  AT+UTEST  command  user  guide,  limitations  and examples of use.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Product Testing      Page 145 of 160 Application BoardLISA-U seriesANTApplication Processor AT   CommandsWireless AntennaSpectrum  AnalyzerINWideband AntennaTXApplication BoardLISA-U seriesANTApplication Processor AT   CommandsWireless AntennaSignalGeneretorOUTWideband AntennaRX Figure 74: Setup with spectrum analyzer and signal generator for radiated measurement   This feature allows the measurement of the transmitter and receiver power levels to check component assembly related  to  the  module  antenna  interface  and  to  check  other  device  interfaces  from  which  depends  the  RF performance.   To  avoid  module  damage  during  transmitter  test,  a  proper  antenna  according  to  module specifications or a 50 Ω termination must be connected to ANT pin.  To avoid module damage during receiver test the maximum power level received at ANT pin must meet module specifications.  The  AT+UTEST  command sets the  module  to  emit RF  power ignoring  2G/3G  signalling  protocol. This emission  can  generate  interference  that  can  be prohibited  by  law  in some  countries.  The  use  of  this feature  is intended  for testing  purpose  in controlled  environments  by qualified user and  must not  be used  during  the  normal  module  operation.  Follow  instructions  suggested  in  u-blox  documentation. u-blox assumes no responsibilities for the inappropriate use of this feature.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Product Testing      Page 146 of 160 Example of production tests for OEM manufacturer:  1. Trigger TX GMSK burst at low Power Control Level (lower than 15) or a RX measure reporting to check: o If ANT pin is soldered o If ANT pin is in short circuit o If module was damaged during soldering process or during handling (ESD, mechanical shock…) o If antenna matching components on application board are soldered o If integrated antenna is correctly connected  To  avoid  module  damage  during  transmitter  test  when  good  antenna  termination  is  not guaranteed, use a low Power Control Level (i.e. PCL lower or equal to 15). u-blox assumes no responsibilities for module damaging caused by an inappropriate use of this feature.  2. Trigger TX GMSK burst at maximum PCL: o To check if the power supply is correctly assembled and is able to deliver the required current  3. Trigger TX GMSK and 8PSK burst and WCDMA signal: o To measure current consumption o To check if module components was damaged during soldering process or during handling (ESD, mechanical shock,…)  4. Trigger RX measurement: o To test receiver signal level. Assuming that there are no losses between ANT pin or ANT_DIV pin and  input  power  source,  be  aware  that  the  power  level  estimated  by  the  module  can  vary approximately within 3GPP tolerances for the average value o To  check  if  module  was  damaged  during  soldering process  or  during  handling  (ESD,  mechanical shock…)  5. Trigger TX GMSK and 8PSK burst and WCDMA signal and RX measurement to check: o Overall RF performance of the device including antenna measuring TX and RX power levels
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Appendix      Page 147 of 160 Appendix A Migration to LISA-U2 series wireless modules Migrating  LISA-U1  series designs  to  LISA-U2  series modules  is a  fairly  straightforward procedure.  Nevertheless there are some points to be considered during the migration.   Not all of the functionalities available with LISA-U1 series modules are supported by all LISA-U2 series modules versions. These include: o Analog Audio Interfaces are not supported by all LISA-U2 series modules o Digital Audio Interfaces are supported by all LISA-U2 series modules versions except LISA-U200-00 o Embedded AssistNow Software, GPS via Modem, Hybrid positioning and CellLocate functionalities are supported by all LISA-U2 series modules versions except LISA-U200-00 o In-Band modem is supported by all LISA-U2 series modules versions except LISA-U200-00  A.1 Checklist for migration Have you chosen the optimal module?  For HSDPA category 14, 6-band 3G, Digital Audio Interfaces support, select the LISA-U230-01 version.  For HSDPA category 8, 6-band 3G, Digital Audio Interfaces support, select the LISA-U200-01 version.  For HSDPA category 8, 4-band 3G support, select the LISA-U200-00 version.  Check LISA-U2 series Hardware Requirements  Check  the  supported  3G  bands  for  proper  antenna  circuit  development,  since  LISA-U2  supports different 3G bands in comparison to LISA-U1 series wireless modules.  Check audio requirements, since Analog Audio Interfaces are not supported by LISA-U2 series.  Check audio requirements,  since Digital  Audio Interfaces  are  supported by  all LISA-U2  series modules versions except LISA-U200-00.  Check the PWR_ON input voltage thresholds, since they are slightly changed in comparison to LISA-U1 series modules. By the  way, this is not relevant driving  the  PWR_ON input by an  open drain  or open collector driver as recommended.  Check the PWR_ON behavior, since LISA-U2xx-01 can be switched off forcing PWR_ON pin to the low level for at least 1 s.  Check the RESET_N input voltage thresholds, since they are slightly changed in comparison to LISA-U1 series modules.  By the way,  this is not relevant  driving the  RESET_N input by an  open drain or  open collector driver as recommended.  Check the V_BCKP operating characteristics, since they are slightly changed in comparison to LISA-U1 series modules.  Check board layout, since additional signals keep-out area must be implemented on the top layer of the application board, below LISA-U2 modules, due to GND opening on module bottom layer.  Check section A.3 Hardware migration.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Appendix      Page 148 of 160 Check LISA-U2 series Software Requirements  Not  all  of  the  functionalities  available  with  LISA-U1  series  modules  are  supported  by  all  the  LISA-U2 series modules versions. These include: o Analog Audio Interfaces are not supported by all LISA-U2 series modules o Digital Audio Interfaces are supported by all LISA-U2 series modules versions except LISA-U200-00 o Embedded AssistNow Software, GPS via Modem, Hybrid positioning and CellLocate  functionalities are supported by all LISA-U2 series modules versions except LISA-U200-00 o In-band modem is supported by all LISA-U2 series modules versions except LISA-U200-00  Check section A.2 Software migration.  A.2 Software migration A.2.1 Software migration from LISA-U1 series to LISA-U2 series wireless modules Software  migration  from  LISA-U1  series  to  LISA-U2  series  wireless  modules  is  a  straightforward  procedure. Nevertheless  there  are  some  differences  to  be  considered  with  firmware  version.  Like  predecessors,  LISA-U2 series  wireless  module  supports  AT  commands  according  to  3GPP  standards:  TS  27.007 [5],  TS 27.005 [6], TS 27.010 [7]  and  the  u-blox  AT  command  extension.  Backward  compatibility  has  been  maintained  as  far  as possible.   For the complete list of supported AT commands and their syntax see u-blox AT Commands Manual [3].  A.3 Hardware migration A.3.1 Hardware migration from LISA-U1 series to LISA-U2 series wireless modules LISA-U2  series  wireless  modules  have  been  designed  with  backward  compatibility  in  mind  but  some  minor differences  were  unavoidable.  These  minor  differences  will  however  not  be  relevant  for  the  majority  of  the LISA-U1 series designs.  Clean and stable supply is required by LISA-U2 as by LISA-U1 series: low ripple and low voltage drop  must  be guaranteed  at  VCC  pins.  The  voltage  provided  has  to  be  within  the  normal  operating  range  limits  to  allow module switch-on  and has  to be  above  the  minimum limit  of the  extended  operating  range  to avoid  module switch-off. Consider that there are large current spikes in connected mode, when a GSM call is enabled. LISA-U2 series provide wider VCC input voltage range compared to LISA-U1 series.  The ANT pin has 50 Ω nominal characteristic impedance and must be connected to the antenna through a 50 Ω transmission line to allow transmission and reception of radio frequency (RF) signals in the 2G and 3G operating bands. The recommendations of the antenna producer for correct installation and deployment (PCB layout and matching circuitry) must be followed. The  antenna  and  the  whole  RF  circuit  must  provide  optimal  radiating  characteristics  on  the  entire  supported bands: note that LISA-U2 supports different 3G bands in comparison to LISA-U1 series wireless modules. LISA-U230  modules provide  the RF  antenna  input for  Rx diversity on  the pin  74 (named  ANT_DIV): it  has an impedance of 50 Ω. The same pad is a reserved pin on LISA-U1 series and LISA-U200 modules.  Analog  audio  interfaces  are  not  supported  by  LISA-U2  series  modules,  but  a  second  4-wire  I2S  digital  audio interface  is  provided  instead  of  the  4  analog  audio  pins  on  all  LISA-U2  series  modules  versions  except LISA-U200-00. The same 4 pins can be configured as GPIO on all LISA-U2 series modules versions.
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Appendix      Page 149 of 160 Digital audio interfaces are supported by all LISA-U2 series modules versions except LISA-U200-00: the relative pins are configured as pad disabled on LISA-U200-00 version.  PWR_ON and RESET_N input voltage thresholds are slightly changed in comparison to LISA-U1 series modules, but this is not relevant driving PWR_ON and RESET_N inputs by open drain / collector drivers as recommended. LISA-U2xx-01 modules can be switched off forcing PWR_ON pin to the low level for at least 1 s.  V_BCKP operating characteristics are slightly changed in comparison to LISA-U1 series modules.  The 5 pins of the SPI / IPC Serial Interface can be configured as GPIOs on LISA-U2xx-01 modules.  LISA-U2 series wireless modules are SMT modules and come in the same compact form factor of LISA-U1 series, featuring Leadless Chip Carrier (LCC) packaging technology. Additional signals keep-out area must be implemented on the top layer of the application board, below LISA-U2 modules, due to GND opening on module bottom layer.  Detailed pinout and layout comparisons between LISA-U1 series and LISA-U2 series modules, with remarks for migration, are provided in the subsections A.3.2 and A.3.3. For  more information  regarding  LISA-U1  and  LISA-U2 series  modules  electrical  characteristics  refer  to  LISA-U1 series Data Sheet [1] and LISA-U2 series Data Sheet [2].  A.3.2 Pin-out comparison LISA-U1 series vs. LISA-U2 series 65646362616059585756555453525150494847464544434241GNDVCCVCCVCCGNDSPI_MRDYSPI_SRDYSPI_MISOSPI_MOSISPI_SCLKRSVD / SPK_NGNDRSVD / SPK_PRSVDGPIO5VSIMSIM_RSTSIM_IOSIM_CLKSDASCLRSVD / I2S_RXDRSVD / I2S_CLKRSVD / I2S_TXDRSVD / I2S_WA12345678910111213141516171819202122232425V_BCKPGNDV_INTRSVDGNDGNDGNDDSRRIDCDDTRGNDRTSCTSTXDRXDGNDVUSB_DETPWR_ONGPIO1GPIO2RESET_NGPIO3GPIO4GND2627USB_D-USB_D+4039RSVD / MIC_PRSVD / MIC_N2829303132333435363738GNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGND 7675747372717069686766GNDRSVDGNDGNDGNDGNDGNDANTGNDGNDGNDLISA-U1Top View Figure 75: LISA-U1 series pin assignment 65646362616059585756555453525150494847464544434241GNDVCCVCCVCCGNDSPI_MRDY / GPIO14SPI_SRDY / GPIO13SPI_MISO / GPIO12SPI_MOSI / GPIO11SPI_SCLK / GPIO10GPIO9 / I2S1_WAGNDGPIO8 / I2S1_CLKRSVD / CODEC_CLKGPIO5VSIMSIM_RSTSIM_IOSIM_CLKSDASCLRSVD / I2S_RXDRSVD / I2S_CLKRSVD / I2S_TXDRSVD / I2S_WA12345678910111213141516171819202122232425V_BCKPGNDV_INTRSVDGNDGNDGNDDSRRIDCDDTRGNDRTSCTSTXDRXDGNDVUSB_DETPWR_ONGPIO1GPIO2RESET_NGPIO3GPIO4GND2627USB_D-USB_D+4039GPIO7 / I2S1_TXDGPIO6 / I2S1_RXD2829303132333435363738GNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGND 7675747372717069686766GNDRSVD / ANT_DIVGNDGNDGNDGNDGNDANTGNDGNDGNDLISA-U2Top View Figure 76: LISA-U2 series pin assignment  (highlighted name/function changes)
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Appendix      Page 150 of 160  LISA-U1  LISA-U2   No Name Description Name Description Remarks for Migration 1 GND Ground GND Ground  2 V_BCKP RTC supply input/output V_BCKP RTC supply input/output V_BCKP operating characteristics difference:  LISA-U1: o V_BCKP output = 2.3V typ. o V_BCKP input = 1.0V min / 2.5V max  LISA-U2: o V_BCKP output = 1.8V typ. o V_BCKP input = 1.0V min / 1.9V max 3 GND Ground GND Ground  4 V_INT Digital Interfaces supply output V_INT Digital Interfaces supply output No difference: V_INT output = 1.8V typ. 5 RSVD RESERVED pin RSVD RESERVED pin No difference: This pin must be connected to GND  6 GND Ground GND Ground  7 GND Ground GND Ground  8 GND Ground GND Ground  9 DSR UART data set ready output DSR UART data set ready output No difference: Circuit 107 (DSR) in ITU-T V.24. 10 RI UART ring indicator output RI UART ring indicator output No difference: Circuit 125 (RI) in ITU-T V.24. 11 DCD UART data carrier detect output DCD UART data carrier detect output No difference: Circuit 109 (DCD) in ITU-T V.24. 12 DTR UART data terminal ready input DTR UART data terminal ready input No difference: Circuit 108/2 (DTR) in ITU-T V. 24. 13 RTS UART ready to send input RTS UART ready to send input No difference: Circuit 105 (RTS) in ITU-T V.24. 14 CTS UART clear to send output CTS UART clear to send output No difference: Circuit 106 (CTS) in ITU-T V.24. 15 TXD UART transmitted data input TXD UART transmitted data input No difference: Circuit 103 (TxD) in ITU-T V.24. 16 RXD UART received data output RXD UART received data output No difference: Circuit 104 (RxD) in ITU-T V.24. 17 GND Ground GND Ground  18 VUSB_DET USB detect input VUSB_DET USB detect input No difference:  Input for VBUS (5V typical) USB supply sense. 19 PWR_ON Power-on input PWR_ON Power-on input Forcing PWR_ON to the low level for at least 5 ms causes a switch-on of LISA-U1 and LISA-U2. PWR_ON operating voltage difference:  LISA-U1: o L-level input = -0.30V min / 0.65V max o H-level input = 2.00 min / 4.20V max o External pull-up (e.g. to V_BCKP) required  LISA-U2: o L-level input = -0.30V min / 0.65V max o H-level input = 1.50V min / 4.40V max o External pull-up (e.g. to V_BCKP) required Additional feature provided by LISA-U2: LISA-U2xx-01 can be switched-off forcing PWR_ON pin to the low level for at least 1 s. 20 GPIO1 GPIO  GPIO1 GPIO By default, the pin is configured as Pad disabled, and can be alternatively configured to provide the GSM Tx Burst Indication, Network Status Indication or as GPIO Additional features provided by LISA-U2xx-01: the pin can be alternatively configured to provide Module Status Indication
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Appendix      Page 151 of 160  LISA-U1  LISA-U2   No Name Description Name Description Remarks for Migration 21 GPIO2 GPIO GPIO2 GPIO No difference from LISA-U1xx-0x to LISA-U2xx-01: By default, the pin is configured to provide the GPS Supply Enable function, and can be alternatively configured as GPIO Different configuration on LISA-U200-00: By default, the pin is configured as Pad disabled, and can be alternatively configured as GPIO 22 RESET_N External reset input RESET_N External reset input Forcing RESET_N to the low level for at least 50 ms causes a hardware reset of LISA-U1 and LISA-U2. RESET_N operating voltage difference:  LISA-U1: o L-level input = -0.30V min / 0.65V max o H-level input = 1.69V min / 2.48V max o Internal 10kΩ pull-up to V_BCKP (2.3V typ)  LISA-U2: o L-level input = -0.30V min / 0.51V max o H-level input = 1.32V min / 2.01V max o Internal 10kΩ pull-up to V_BCKP (1.8V typ) 23 GPIO3 GPIO GPIO3 GPIO No difference from LISA-U1xx-00 to LISA-U2xx-00:  By default, the pin is configured as Pad disabled, and can be alternatively configured as GPIO  No difference from LISA-U1xx-01 to LISA-U2xx-01:  By default, the pin is configured to provide the GPS Tx Data Ready function, and can be alternatively configured as GPIO. 24 GPIO4 GPIO GPIO4 GPIO No difference from LISA-U1xx-00 to LISA-U2xx-00:  By default, the pin is configured as Pad disabled, and can be alternatively configured as GPIO  No difference from LISA-U1xx-01 to LISA-U2xx-01:  By default, the pin is configured to provide the GPS RTC sharing (time aiding) function, and can be alternatively configured as GPIO. 25 GND Ground GND Ground  26 USB_D- USB Data Line D- input/output USB_D- USB Data Line D- input/output No difference:  90 Ω nominal differential impedance. Pull-up/down & series resistors provided internally. 27 USB_D+ USB Data Line D+ input/output USB_D+ USB Data Line D+ input/output No difference:  90 Ω nominal differential impedance. Pull-up/down & series resistors provided internally. 28 GND Ground GND Ground  29 GND Ground GND Ground  30 GND Ground GND Ground  31 GND Ground GND Ground  32 GND Ground GND Ground  33 GND Ground GND Ground  34 GND Ground GND Ground  35 GND Ground GND Ground  36 GND Ground GND Ground  37 GND Ground GND Ground  38 GND Ground GND Ground  39 RSVD LISA-U100-0x,  LISA-U110-0x: RESERVED pin  GPIO6 LISA-U200-00: GPIO New feature provided by LISA-U2: By default, the pin is configured as Pad disabled, and can be alternatively configured as GPIO   MIC_N LISA-U120-0x,  LISA-U130-0x: Differential analog audio input (neg.) I2S1_RXD / GPIO6 LISA-U200-01,  LISA-U230-01: 2nd I2S receive data input / GPIO Different features provided by LISA-U2: By default, the pin is configured as receive data input of the second digital audio interface, and can be alternatively configured as GPIO
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Appendix      Page 152 of 160  LISA-U1  LISA-U2   No Name Description Name Description Remarks for Migration 40 RSVD LISA-U100-0x,  LISA-U110-0x: RESERVED pin GPIO7 LISA-U200-00: GPIO New feature provided by LISA-U2: By default, the pin is configured as Pad disabled, and can be alternatively configured as GPIO  MIC_P LISA-U120-0x,  LISA-U130-0x: Differential analog audio input (pos.) I2S1_TXD / GPIO7 LISA-U200-01,  LISA-U230-01: 2nd I2S transmit data output / GPIO  Different features provided by LISA-U2: By default, the pin is configured as transmit data output of the second digital audio interface, and can be alternatively configured as GPIO 41 RSVD LISA-U100-0x,  LISA-U110-0x: RESERVED pin RSVD LISA-U200-00: RESERVED pin No difference: Pad disabled on LISA-U200-00.  I2S_WA LISA-U120-0x,  LISA-U130-0x: I2S word alignment  I2S_WA LISA-U200-01,  LISA-U230-01: 1st I2S word alignment input/output No difference: I2S word alignment input/output 42 RSVD LISA-U100-0x,  LISA-U110-0x: RESERVED pin RSVD LISA-U200-00: RESERVED pin No difference: Pad disabled on LISA-U200-00.  I2S_TXD LISA-U120-0x,  LISA-U130-0x: I2S transmit data output I2S_TXD LISA-U200-01,  LISA-U230-01: 1st I2S transmit data output No difference: I2S transmit data output 43 RSVD LISA-U100-0x,  LISA-U110-0x: RESERVED pin RSVD LISA-U200-00: RESERVED pin No difference:  Pad disabled on LISA-U200-00.  I2S_CLK LISA-U120-0x,  LISA-U130-0x: I2S clock  I2S_CLK LISA-U200-01,  LISA-U230-01: 1st I2S clock input/output No difference:  I2S clock input/output 44 RSVD LISA-U100-0x,  LISA-U110-0x: RESERVED pin RSVD LISA-U200-00: RESERVED pin No difference:  Pad disabled on LISA-U200-00.  I2S_RXD LISA-U120-0x,  LISA-U130-0x: I2S receive data input I2S_RXD LISA-U200-01,  LISA-U230-01: 1st I2S receive data input No difference:  I2S receive data input 45 SCL I2C bus clock line output SCL I2C bus clock line output No difference:  Fixed open drain.  External pull-up resistor (e.g. to V_INT) required 46 SDA I2C bus data line input/output SDA I2C bus data line input/output No difference:  Fixed open drain.  External pull-up resistor (e.g. to V_INT) required 47 SIM_CLK SIM clock output SIM_CLK SIM clock output No difference:  3.25 MHz clock frequency for SIM card 48 SIM_IO SIM data input/output SIM_IO SIM data input/output No difference:  Internal 4.7 kΩ pull-up resistor to VSIM. 49 SIM_RST SIM reset output SIM_RST SIM reset output No difference:  Reset output for SIM card 50 VSIM SIM supply output VSIM SIM supply output No difference:  VSIM output = 1.80 V typ or 2.90 V typ 51 GPIO5 GPIO GPIO5 GPIO By default, the pin is configured to provide the SIM card presence detection function. Additional features provided by LISA-U2xx-01: The pin can be alternatively configured to provide Module Operating Mode Indication
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Appendix      Page 153 of 160  LISA-U1  LISA-U2   No Name Description Name Description Remarks for Migration 52 RSVD RESERVED pin RSVD LISA-U200-00: RESERVED pin No difference:  Pad disabled on LISA-U200-00.    CODEC_CLK LISA-U200-01,  LISA-U230-01: Clock output New feature provided by LISA-U2: Digital clock output for external audio codec 53 RSVD LISA-U100-0x,  LISA-U110-0x: RESERVED pin GPIO8 LISA-U200-00: GPIO New feature provided by LISA-U2: By default, the pin is configured as Pad disabled, and can be alternatively configured as GPIO  SPK_P LISA-U120-0x,  LISA-U130-0x: Differential analog audio output (pos.) I2S1_CLK / GPIO8 LISA-U200-01,  LISA-U230-01: 2nd I2S clock input/output / GPIO Different features provided by LISA-U2: By default, the pin is configured as clock input/output of the second digital audio interface, and can be alternatively configured as GPIO 54 RSVD LISA-U100-0x,  LISA-U110-0x: RESERVED pin GPIO9 LISA-U200-00: GPIO New feature provided by LISA-U2: By default, the pin is configured as Pad disabled, and can be alternatively configured as GPIO  SPK_N LISA-U120-0x,  LISA-U130-0x: Differential analog audio output (neg.) I2S1_WA / GPIO9 LISA-U200-01,  LISA-U230-01: 2nd I2S word alignment input/output / GPIO Different features provided by LISA-U2: By default, the pin is configured as word alignment input/output of the second digital audio interface, and can be alternatively configured as GPIO 55 SPI_SCLK SPI Serial Clock Input SPI_SCLK / GPIO10 SPI Serial Clock Input / GPIO SPI / IPC Clock Input (CPOL=0, internal pull-down) by default on LISA-U1 and LISA-U2 Additional features provided by LISA-U2xx-01: The pin can be alternatively configured as GPIO 56 SPI_MOSI SPI Data Line Input SPI_MOSI / GPIO11 SPI Data Line Input / GPIO SPI / IPC Data Line Input, (CPHA=1, internal pull-up) by default on LISA-U1 and LISA-U2. Additional features provided by LISA-U2xx-01: The pin can be alternatively configured as GPIO 57 SPI_MISO SPI Data Line Output SPI_MISO / GPIO12 SPI Data Line Output / GPIO SPI / IPC Data Line Output (CPHA=1, idle high) by default on LISA-U1 and LISA-U2. Additional features provided by LISA-U2xx-01: The pin can be alternatively configured as GPIO 58 SPI_SRDY SPI Slave Ready Output SPI_SRDY / GPIO13 SPI Slave Ready Output / GPIO SPI / IPC Slave Ready Output (idle low) by default on LISA-U1 and LISA-U2 Additional features provided by LISA-U2xx-01: The pin can be alternatively configured to provide Module Status Indication or as GPIO 59 SPI_MRDY SPI Master Ready Input SPI_MRDY / GPIO14 SPI Master Ready Input / GPIO SPI / IPC Master Ready Input (Internal pull-down, Idle low) by default on LISA-U1 and LISA-U2. Additional features provided by LISA-U2xx-01: The pin can be alternatively configured to provide Module Operating Mode Indication or as GPIO 60 GND Ground GND Ground  61 VCC Module supply input VCC Module supply input VCC operating voltage difference:  LISA-U1: o VCC normal range = 3.4 V min / 4.2 V max o VCC extended range = 3.1 V min / 4.2 V max  LISA-U2: o VCC normal range = 3.3 V min / 4.4 V max o VCC extended range = 3.1 V min / 4.5 V max 62 VCC Module supply input VCC Module supply input VCC operating voltage difference:  LISA-U1: o VCC normal range = 3.4 V min / 4.2 V max o VCC extended range = 3.1 V min / 4.2 V max  LISA-U2: o VCC normal range = 3.3 V min / 4.4 V max o VCC extended range = 3.1 V min / 4.5 V max
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Appendix      Page 154 of 160  LISA-U1  LISA-U2   No Name Description Name Description Remarks for Migration 63 VCC Module supply input VCC Module supply input VCC operating voltage difference:  LISA-U1: o VCC normal range = 3.4 V min / 4.2 V max o VCC extended range = 3.1 V min / 4.2 V max  LISA-U2: o VCC normal range = 3.3 V min / 4.4 V max o VCC extended range = 3.1 V min / 4.5 V max 64 GND Ground GND Ground  65 GND Ground GND Ground  66 GND Ground GND Ground  67 GND Ground GND Ground  68 ANT RF antenna ANT RF input/output for main Tx/Rx antenna RF antenna input/output 50 Ω nominal impedance 3G band support difference:  LISA-U100/U120: o Band II (1900), Band V (850)  LISA-U110/U130: o Band I (2100), Band VIII (900)   LISA-U200: o Band I (2100), Band II (1900),  Band V (850), Band VI (800)   LISA-U230: o Band I (2100), Band II (1900), Band IV (1700), Band V (850), Band VI (800), Band VIII (900) 69 GND Ground GND Ground  70 GND Ground GND Ground  71 GND Ground GND Ground  72 GND Ground GND Ground  73 GND Ground GND Ground  74 RSVD RESERVED pin RSVD LISA-U200-0x: RESERVED pin No difference:  Leave unconnected.    ANT_DIV LISA-U230-01: RF input for  Rx diversity antenna New feature provided by LISA-U2: RF antenna input for Rx diversity 50 Ω nominal impedance 75 GND Ground GND Ground  76 GND Ground GND Ground  Table 51: Pinout comparison LISA-U1 series vs. LISA-U2 series
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Appendix      Page 155 of 160 A.3.3 Layout comparison LISA-U1 series vs. LISA-U2 series Additional signals keep-out area must be implemented on the top layer of the application board, below LISA-U2 modules, due to GND opening on module bottom layer, as described in Figure 77 and Figure 78.  33.2 mm11.85 mm22.4 mm5.3 mm 5.25 mm1.4 mm1.0 mmPIN 1LISA-U1 bottom side (through module view)Exposed GND on LISA-U1 module bottom layerSignals keep-out area on application board Figure 77: Signals keep-out area on the top layer of the application board, below LISA-U1 series modules 33.2 mm5.25 mm22.4 mm5.3 mm 5.25 mm5.3 mm1.3 mm1.4 mm1.0 mmPIN 1LISA-U2 bottom side (through module view)Exposed GND on LISA-U2 module bottom layerSignals keep-out areas on application board Figure 78: Signals keep-out areas on the top layer of the application board, below LISA-U2 series modules
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Appendix      Page 156 of 160 B Glossary  ADC Analog to Digital Converter AP Application Processor AT AT Command Interpreter Software Subsystem, or attention CBCH Cell Broadcast Channel CS Coding Scheme CSD Circuit Switched Data CTS Clear To Send DC Direct Current  DCD Data Carrier Detect DCE Data Communication Equipment DCS Digital Cellular System DDC Display Data Channel DSP Digital Signal Processing DSR Data Set Ready DTE Data Terminal Equipment DTM Dual Transfer Mode DTR Data Terminal Ready  EBU External Bus Interface Unit EDGE Enhanced Data rates for GSM Evolution E-GPRS Enhanced GPRS FDD Frequency Division Duplex FEM Front End Module FOAT Firmware Over AT commands FTP File Transfer Protocol FTPS FTP Secure GND Ground GPIO General Purpose Input Output GPRS General Packet Radio Service GPS Global Positioning System GSM Global System for Mobile Communication HF Hands-free HSDPA High Speed Downlink Packet Access HTTP HyperText Transfer Protocol  HTTPS Hypertext Transfer Protocol over Secure Socket Layer HW Hardware I/Q In phase and Quadrature I2C Inter-Integrated Circuit I2S Inter IC Sound IP Internet Protocol IPC Inter Processor Communication
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Appendix      Page 157 of 160 LNA Low Noise Amplifier MCS Modulation Coding Scheme  NOM Network Operating Mode PA Power Amplifier PBCCH Packet Broadcast Control Channel  PCM Pulse Code Modulation PCS Personal Communications Service PFM Pulse Frequency Modulation PMU Power Management Unit RF Radio Frequency RI Ring Indicator RTC Real Time Clock RTS Request To Send RXD RX Data SAW Surface Acoustic Wave SIM Subscriber Identification Module SMS Short Message Service SMTP Simple Mail Transfer Protocol SPI Serial Peripheral Interface SRAM Static RAM TCP Transmission Control Protocol TDMA Time Division Multiple Access  TXD TX Data UART Universal Asynchronous Receiver-Transmitter UDP User Datagram Protocol  UMTS Universal Mobile Telecommunications System USB Universal Serial Bus UTRA UMTS Terrestrial Radio Access  VC-TCXO Voltage Controlled - Temperature Compensated Crystal Oscillator WCDMA Wideband CODE Division Multiple Access
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Related documents      Page 158 of 160 Related documents [1] u-blox LISA-U1 series Data Sheet, Docu No 3G.G1-HW-10001 [2] u-blox LISA-U2 series Data Sheet, Docu No 3G.G1-HW-11004 [3] u-blox AT Commands Manual, Docu No WLS-SW-11000 [4] ITU-T Recommendation V.24, 02-2000. List of definitions for interchange circuits between data terminal equipment (DTE) and data circuit-terminating equipment (DCE).  http://www.itu.int/rec/T-REC-V.24-200002-I/en [5] 3GPP TS 27.007 - AT command set for User Equipment (UE) (Release 1999) [6] 3GPP TS 27.005 - Use of Data Terminal Equipment - Data Circuit terminating; Equipment (DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) (Release 1999) [7] 3GPP TS 27.010 - Terminal Equipment to User Equipment (TE-UE) multiplexer protocol (Release 1999) [8] Universal Serial Bus Revision 2.0 specification, http://www.usb.org/developers/docs/  [9] I2C-Bus Specification Version 2.1 Philips Semiconductors (January 2000), http://www.nxp.com/acrobat_download/literature/9398/39340011_21.pdf [10] CENELEC  EN  61000-4-2  (2001):  "Electromagnetic  compatibility  (EMC)  -  Part  4-2:  Testing  and measurement techniques - Electrostatic discharge immunity test". [11] ETSI  EN  301  489-1  V1.8.1:  “Electromagnetic  compatibility  and  Radio  spectrum  Matters  (ERM); ElectroMagnetic  Compatibility  (EMC)  standard  for  radio  equipment  and  services;  Part  1:  Common technical requirements” [12] ETSI  EN  301  489-7  V1.3.1  “Electromagnetic  compatibility  and  Radio  spectrum  Matters  (ERM); ElectroMagnetic  Compatibility  (EMC)  standard  for  radio  equipment  and  services;  Part  7:  Specific conditions  for  mobile  and  portable  radio  and  ancillary  equipment  of  digital  cellular  radio telecommunications systems (GSM and DCS)“ [13] ETSI  EN  301  489-24  V1.4.1  "Electromagnetic  compatibility  and  Radio  spectrum  Matters  (ERM); ElectroMagnetic  Compatibility  (EMC)  standard  for  radio  equipment  and  services;  Part  24:  Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment" [14] 3GPP TS 26.267 - Technical Specification Group Services and System Aspects; eCall Data Transfer; In-band modem solution; General description (Release 9) [15] GSM Mux Implementation Application Note, Docu No WLS-CS-11002 [16] GPS Implementation Application Note, Docu No GSM.G1-CS-09007 [17] Firmware Update Application Note, Docu No WLS-CS-11001 [18] SPI Interface application Note, Docu No 3G.G2-CS-11000 [19] 3GPP  TS 23.060  -  Technical  Specification Group  Services  and System  Aspects;  General Packet  Radio Service (GPRS); Service description [20] End user test Application Note, Docu No TBD [21] u-blox Package Information Guide, Docu. No GPS-X-11004  Some of the above documents can be downloaded from u-blox web-site (http://www.u-blox.com).
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Revision history      Page 159 of 160 Revision history Revision Date Name Status / Comments - 21/10/2010 sses Initial Release 1 11/01/2011 sses Thickness information added GPIO description improved 2 26/04/2011 lpah Update to Advance Information status 3 07/07/2011 lpah Update to Preliminary status A 26/10/2011 sses Changed status to Objective Specification  Initial release for LISA-U series From LISA-U1xx-00 system integration manual, added description and integration of LISA-U1xx-01, LISA-U200-00, LISA-U2xx-01 Added notes regarding VCC normal and extended operating ranges Added RTC value reliability as function of V_BCKP voltage value Added recommendation regarding any external signal connected to the UART interface, SPI/IPC interface, I2S interfaces and GPIOs when the module is in power-down mode, when the external reset is forced low and during the module power-on sequence: must be tri-stated to avoid latch-up of circuits and let a proper boot of the module. A1 22/11/2011 sses Update to Advance Information status Updated module behavior during power-off sequence. Added LISA-U200-00 ESD application circuit for antenna port. Added application circuit for the module status indication function. A2 02/02/2012 sses Update to Preliminary status Updated Federal Communications Commission notice Updated LISA-U2 features in module power off and GPIO sections A3 25/05/2012 gcom Updated values for antenna gain
LISA-U series - System Integration Manual 3G.G2-HW-10002-A3  Preliminary  Contact      Page 160 of 160 Contact For complete contact information visit us at www.u-blox.com  u-blox Offices     North, Central and South America u-blox America, Inc. Phone:  +1 (703) 483 3180 E-mail:  info_us@u-blox.com  Regional Office West Coast: Phone:  +1 (703) 483 3184 E-mail:  info_us@u-blox.com Technical Support: Phone:  +1 (703) 483 3185 E-mail:  support_us@u-blox.com  Headquarters Europe, Middle East, Africa u-blox AG  Phone:  +41 44 722 74 44 E-mail:  info@u-blox.com  Support:   support @u-blox.com   Asia, Australia, Pacific u-blox Singapore Pte. Ltd. Phone:  +65 6734 3811 E-mail:  info_ap@u-blox.com Support:  support_ap@u-blox.com  Regional Office China: Phone:  +86 10 68 133 545 E-mail:  info_cn@u-blox.com  Support:  support_cn@u-blox.com Regional Office Japan: Phone:  +81 3 5775 3850 E-mail:  info_jp@u-blox.com  Support:  support_jp@u-blox.com  Regional Office Korea: Phone:  +82 2 542 0861 E-mail:  info_kr@u-blox.com  Support:  support_kr@u-blox.com Regional Office Taiwan: Phone:  +886 2 2657 1090 E-mail:  info_tw@u-blox.com  Support:  support_tw@u-blox.com

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