Silicon Laboratories Finland EM358X ETRX3581, ETRX3582, ETRX3585, ETRX3586, ETRX3587, ETRX3588, ETRX3581HR, ETRX3582HR, ETRX3585HR, ETRX3586HR, ETRX3587HR, ETRX3588HR User Manual TG PM 0509 ETRX358x r5

Telegesis

TG-PM-0509-ETRX358x r5

ETRX358x and ETRX358xHR Product Manual

ETRX358x ZIGBEE

®

MODULES

PRODUCT MANUAL

ETRX358x

Table of Contents

1 INTRODUCTION ................................................................................................................ 5

1.1 Hardware Description ...................................................................................................... 5

2 PRODUCT APPROVALS ................................................................................................... 6

2.1 FCC Approvals ................................................................................................................ 6

2.1.1 FCC Labelling Requirements ........................................................................................... 6

2.2 IC (Industry Canada) Approvals ....................................................................................... 7

2.2.1 IC Labelling Requirements .............................................................................................. 8

2.3 European Certification (ETSI) .......................................................................................... 8

2.4 Declarations of Conformity .............................................................................................. 9

2.5 IEEE 802.15.4 ................................................................................................................. 9

2.6 The ZigBee Protocol ...................................................................................................... 10

3 MODULE PINOUT ............................................................................................................ 11

4 HARDWARE DESCRIPTION ........................................................................................... 13

4.1 Hardware Interface ........................................................................................................ 13

5 FIRMWARE DESCRIPTION ............................................................................................. 14

5.1 Token Settings .............................................................................................................. 15

5.2 Custom Firmware .......................................................................................................... 15

6 ABSOLUTE MAXIMUM RATINGS ................................................................................... 16

6.1 Environmental Characteristics ....................................................................................... 16

6.2 Recommended Operating Conditions ............................................................................ 16

7 DC ELECTRICAL CHARACTERISTICS .......................................................................... 17

8 DIGITAL I/O SPECIFICATIONS ....................................................................................... 19

9 A/D CONVERTER CHARACTERISTICS ......................................................................... 20

10 AC ELECTRICAL CHARACTERISTICS .......................................................................... 20

10.1 TX Power Characteristics .............................................................................................. 22

10.2 Power Settings for Regulatory Compliance .................................................................... 24

11 PHYSICAL DIMENSIONS ................................................................................................ 25

12 RECOMMENDED REFLOW PROFILE ............................................................................ 26

13 PRODUCT LABEL DRAWING ......................................................................................... 27

14 RECOMMENDED FOOTPRINT ....................................................................................... 28

14.1 Recommended Placement ............................................................................................ 30

14.2 Example carrier board ................................................................................................... 32

15 RELIABILITY TESTS ....................................................................................................... 33

16 APPLICATION NOTES .................................................................................................... 33

16.1 Safety Precautions ........................................................................................................ 33

ETRX358x

16.2 Design Engineering Notes ............................................................................................. 33

16.3 Storage Conditions ........................................................................................................ 34

17 PACKAGING .................................................................................................................... 35

17.1 Embossed Tape ............................................................................................................ 35

17.2 Component Orientation .................................................................................................. 36

17.3 Reel Dimensions ........................................................................................................... 36

17.4 Packaging ...................................................................................................................... 37

18 ORDERING INFORMATION ............................................................................................ 38

19 TRADEMARKS ................................................................................................................ 38

20 DISCLAIMER ................................................................................................................... 39

21 ROHS DECLARATION .................................................................................................... 39

22 DATA SHEET STATUS .................................................................................................... 39

23 LIFE SUPPORT POLICY ................................................................................................. 39

24 RELATED DOCUMENTS ................................................................................................. 40

25 CONTACT INFORMATION .............................................................................................. 40

ETRX358x

The Telegesis ETRX358x and ETRX358xHR series modules

are small outline, low power 2.4GHz ZigBee modules, based on

the latest Silicon Labs EM358x family of single chip ZigBee

®

solutions.

These 4

th

generation modules have been designed to be

integrated into any device without the need for RF experience

and expertise. Utilizing the market’s premier EmberZNet

ZigBee

®

stack, the ETRX358x series enables you to add

powerful wireless networking capability to your products and

quickly bring them to market.

For custom application development the ETRX358x series

integrates with ease into Ember Desktop development

environment.

Image not shown actual size; enlarged to show detail.

Module Featu

res

• Small form factor, SMT module 25mm x 19mm

• Same footprint and pin-out as ETRX357

• Side Castellations for easy soldering and optical

inspection

• Two antenna options: Integrated chip antenna or U.FL

coaxial connector

• Based on 32-bit ARM® Cortex-M3

• Operation at 6, 12 or 24MHz

• Industry standard JTAG Programming and real time

packet tracing via the Ember Debug Port

• Up to 512kB of flash and 64kbytes of RAM

• Lowest Deep Sleep Current of 1µA with retained RAM

and GPIO and multiple sleep modes

• Wide supply voltage range (2.1 to 3.6V)

• Optional 32.768kHz watch crystal can be added

externally

• Can act as an End Device, Router or Coordinator

• 24 general-purpose I/O lines including analogue inputs

(all GPIOs of the EM358x SoC are accessible)

• Firmware upgrades via serial port or over the air using

the Ember standalone bootloader

• Hardware supported encryption (AES-128)

• CE, FCC and IC compliance, FCC modular approval

• Operating temperature range: -40

°

C to +85

°

C

• Long range version with a link budget of up to 124dB

available in the same form factor

Radio Features

• Based on the Silicon Labs EM358x family of single chip

ZigBee®

SoCs

• 2.4GHz ISM Band

• 250kbit/s over the air data rate

• 16 channels (IEEE802.15.4 Channel 11 to 26)

• +3dBm output power ( +8dBm in boost mode)

• High sensitivity of -100dBm (-102dBm in boost mode)

typically @ 1% packet error rate

• RX Current: 27mA, TX Current: 32mA at 3dBm

• Robust Wi-Fi and Bluetooth coexistence

Suggested Applications

• ZigBee Smart Energy applications

• Wireless Alarms and Security

• Home/Building Automation

• Wireless Sensor Networks

• M2M Industrial Controls

• Lighting and ventilation control

• Remote monitoring

• Environmental monitoring and control

Development Kit

• ETRX3587 Expansion Pack for ETRX357 Development

Kit

• ETRX357 Development kit containing everything

required to set up a mesh network quickly and evaluate

range and performance of the ETRX357 series and its

long-range version.

• Custom software development available upon request.

ETRX358X

1 Introduction

This document describes the Telegesis ETRX358x and ETRX358xHR family of ZigBee modules

which have been designed to be easily integrated into another device and to provide a fast, simple

and low cost wireless mesh networking interface.

The Telegesis ETRX3 series modules are based on the Silicon Labs ZigBee compliant platform

consisting of the single chip family of EM358x SoCs combined with the ZigBee PRO compliant

EmberZNet meshing stack. The ETRX358x and ETRX358xHR modules represent an ideal

platform for custom firmware development in conjunction with the Silicon Labs ZigBee

development kits.

No RF experience or expertise is required to add this powerful wireless networking capability to

your products. The ETRX358x and ETRX358xHR series of modules offer fast integration

opportunities and the shortest possible time to market for your product.

1.1 Hardware Description

The main building blocks of the ETRX358x and ETRX358xHR modules are the single chip

EM358x SoC from Silicon Labs, a 24MHz reference crystal and RF front-end circuitry optimized for

best RF performance. The modules are available with on-board antenna or alternatively a U.FL

coaxial connector for attaching external antennae. Modules with the U.FL connector are identified

by the “HR” suffix.

The integrated antenna is an Antenova Rufa, and details of the radiation pattern are available from

the Antenova website [5].

Module

Chip

Flash

RAM

Antenna

USB

ETRX3581

1

EM3581 256kB 32kB Chip No

ETRX3581HR

1

EM3581 256kB 32kB External No

ETRX3582

1

EM3582 256kB 32kB Chip Yes

ETRX3582HR

1

EM3582 256kB 32kB External Yes

ETRX3585

1

EM3585 512kB 32kB Chip No

ETRX3585HR

1

EM3585 512kB 32kB External No

ETRX3586

1

EM3586 512kB 32kB Chip Yes

ETRX3586HR

1

EM3586 512kB 32kB External Yes

ETRX3587

EM3587

512kB

64kB

Chip

No

ETRX3587HR

EM3587

512kB

64kB

External

No

ETRX3588

1

EM3588 512kB 64kB Chip Yes

ETRX3588HR

1

EM3588 512kB 64kB External Yes

Table 1: Module Variants

The ETRX358x and ETRX358xHR are used for ZigBee

(www.zigbee.org) applications. In case it is

desired to develop custom firmware, the Silicon Labs toolchain, consisting of Ember Desktop

together with a comprehensive integrated development environment (IDE), is required.

1

MOQ and Lead Time applies. Only stocked modules are ETRX3587 and ETRX3587HR

ETRX358X

2 Product Approvals

The ETRX358x and ETRX358xHR have been designed to meet all national regulations for world-

wide use. In particular the following certifications have been obtained:

2.1 FCC Approvals

The Telegesis ETRX358x family integrated Antenna as well as the ETRX358xHR family including

the antennas listed in Table 2 and the power levels listed in section 10.2 have been tested to

comply with FCC CFR Part 15 (USA) The devices meet the requirements for modular transmitter

approval as detailed in the FCC public notice DA00.1407.transmitter.

FCC statement:

This device complies with Part 15 of the FCC rules. Operation is subject to the following

two conditions: (1) this device may not cause harmful interference, and (2) this device must

accept any interference received, including interference that may cause undesired

operation.

Item

Part No.

Manufacturer

Type

Impedance

Gain

1 BT-Stubby (straight) EAD Ltd. [6] ¼ Wave 50Ω 0dBi

2 BT-Stubby (right-

angle) EAD Ltd. [6] ¼ Wave 50Ω 0dBi

3 CJ-2400-6603 Chang Jia ½ Wave 50 Ω 2.0dBi

4 Rufa (on board) Antenova Chip 50Ω 2.1dBi

(peak)

Table 2: Approved Antennae

While the applicant for a device into which the ETRX358x or ETRX358xHR with an antenna listed

in Table 2 is installed is not required to obtain a new authorization for the module, this does not

preclude the possibility that some other form of authorization or testing may be required for the end

product depending upon local territorial regulations.

The FCC requires the user to be notified that any changes or modifications made to this device

that are not expressly approved by Telegesis (UK) Ltd. may void the user's authority to operate the

equipment.

When using the ETRX358xHR family with approved antennae, it is required to prevent end-users

from replacing them with non-approved ones.

2.1.1 FCC Labelling Requirements

When integrating the ETRX358x or ETRX358xHR families into a product it must be ensured that

the FCC labelling requirements are met. This includes a clearly visible label on the outside of the

finished product specifying the Telegesis FCC identifier (FCC ID: S4GEM358X) as well as the

FCC notice shown on the previous page. This exterior label can use wording such as “Contains

Transmitter Module FCC ID: S4GEM358X” or “Contains FCC ID: S4GEM358X” although any

similar wording that expresses the same meaning may be used.

FCC ID

:

S4GEM358X

ETRX358X

2.2 IC (Industry Canada) Approvals

The Telegesis ETRX358x family with integrated Antenna as well as the ETRX358xHR family have

been approved by Industry Canada to operate with the antenna types listed in Table 2 with the

maximum permissible gain and required antenna impedance for each antenna type indicated.

Antenna types not included in this list, having a gain greater than the maximum gain indicated for

that type, are strictly prohibited for use with this device.

IC-ID: 8735A-EM358X

• This device complies with Industry Canada license-exempt RSS standard(s).

Operation is subject to the following two conditions: (1) this device may not cause

interference, and (2) this device must accept any interference, including interference

that may cause undesired operation of the device.

• Under Industry Canada regulations, this radio transmitter may only operate using an

antenna of a type and maximum (or lesser) gain approved for the transmitter by

Industry Canada. To reduce potential radio interference to other users, the antenna

type and its gain should be so chosen that the equivalent isotropically radiated

power (e.i.r.p.) is not more than that permitted for successful communication.

•

and must not be co-located or operating in conjunction with any other antenna or

transmitterThis device has been designed to operate with the power levels shown in

section 10.2 with the antennas listed in Table 2, and having a maximum gain of 2.1

dBi. Antennas not included in this list or having a gain greater than 2.1 dBi are

strictly prohibited for use with this device. The required antenna impedance is 50

ohms.

French Statements

• Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut

fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour

l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage

radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain

de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité

nécessaire à l'établissement d'une communication satisfaisante.

• Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils

radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1)

l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout

brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le

fonctionnement.

OEM Responsibilities

The ETRX358x and ETRX358x families of module have been certified for integration into products only

by OEM integrators under the following condition:

1. The transmitter module must not be co-located or operating in conjunction with any other

antenna or transmitter.

As long as the two conditions above are met, further transmitter testing will not be required.

However, the OEM integrator is still responsible for testing their end-product for any additional

compliance requirements required with this module installed (for example, digital device emissions,

PC peripheral requirements, etc.).

ETRX358X

IMPORTANT NOTE: In the event that these conditions can not be met (for certain configurations

or co-location with another transmitter), then Industry Canada certification is no longer considered

valid and the IC Certification Number can not be used on the final product. In these circumstances,

the OEM integrator will be responsible for re-evaluating the end product (including the transmitter)

and obtaining a separate Industry Canada authorization.

2.2.1 IC Labelling Requirements

The ETRX358x and ETRX358xHR family modules are labelled with its own IC Certification Number. If

the IC Certification Number is not visible when the module is installed inside another device, then the

outside of the device into which the module is installed must also display a label referring to the enclosed

module. In that case, the final end product must be labelled in a visible area with the following:

“Contains Transmitter Module IC: 8735A-EM358X“

or

“Contains IC: 8735A-EM358X“

The OEM of the ETRX358x and ETRX358xHR family modules must only use the approved antenna(s)

listed above, which have been certified with this module.

The OEM integrator has to be aware not to provide information to the end user regarding how to

install or remove this RF module or change RF related parameters in the user’s manual of the end

product.

The user’s manual for the end product must include the following information in a

prominent location:

“To comply with Industry Canada RF radiation exposure limits for general population, the

transmitter must not be co-located or operating in conjunction with any other antenna or

transmitter.”

2.3 European Certification (ETSI)

The ETRX358x and ETRX358xHR families are compliant to the following standards:

• Radio: EN 300 328:V1.7.1

• EMC: EN 301 489-17:V2.2.1

• Safety: EN 60950-1:2006/A12:2011

If the ETRX358x and ETRX358xHR families of modules are incorporated into an OEM product, the

OEM product manufacturer must ensure compliance of the final product to the European

Harmonised EMC, and low voltage/safety standards. A Declaration of Conformity must be issued

for each of these standards and kept on file as described in Annex II of the R&TTE Directive. The

final product must not exceed the specified power ratings, antenna specifications and installation

requirements as specified in this user manual. If any of these specifications are exceeded in the

final product then a submission must be made to a notified body for compliance testing to all of the

required standards.

ETRX358X

The ‘CE’ marking must be applied to a visible location on any OEM product. For more information

please refer to http://ec.europa.eu/enterprise/faq/ce-mark.htm. Customers assume full

responsibility for learning and meeting the required guidelines for each country in their distribution

market.

2.4 Declarations of Conformity

Telegesis (UK) Ltd will issue Declarations of Conformity for all ETRX3 series ZigBee RF Modules,

which cover RoHS, Radio Emissions, EMC and Safety. These documents will be available from

our website or on request.

2.5 IEEE 802.15.4

IEEE 802.15.4 is a standard for low data-rate, wireless networks (raw bit-rate within a radio packet

of 250kbps @2.4GHz) which focuses on low cost, low duty cycle, long primary battery life

applications as well as mains-powered applications. It is the basis for the open ZigBee Protocol.

ETRX358X

2.6 The ZigBee Protocol

The ZigBee Protocol is a set of standards for wireless connectivity for use between any devices

over short to medium distances. The specification was originally ratified in December 2004, paving

the way for companies to start making low-power networks a reality.

ZigBee uses the IEEE 802.15.4 radio specification running on the 2.4GHz band, plus three

additional layers for networking, security and applications. What makes the specification unique is

its use of a mesh network architecture which, in bucket chain style, passes data from one node to

the next until it lands at its destination. The network is self-healing and adapts its routing as link

quality changes or nodes move. Furthermore, nodes can be defined as End Devices which do not

act as routers, but can therefore be put into a low-power sleep state.

The enhanced version of the ZigBee standard (or ZigBee 2006) was released in December 2006,

adding new features and improvements to the only global wireless communication standard

enabling the development of easily deployable low-cost, low-power, monitoring and control

products for homes, commercial buildings and industrial plant monitoring. In 2007 the ZigBee

Alliance introduced the PRO featureset which offers advantages over earlier versions, including

• Truly self-healing mesh networking

• Messages can now travel up to 30 hops

• Source-Routing for improved point to multipoint message transmission

• Improved security including Trust-Centre link keys

• New message types and options

ETRX358X

3 Module Pinout

Figure 1: ETRX3 series Module Pinout (top view)

The table below gives details about the pin assignment for direct SMD soldering of the ETRX3

series modules to the application board. For more information on the alternate functions please

refer to [2].

All GND pads are connected within the module, but for best RF performance all of them should be

grounded externally ideally to a ground plane.

“Important Note: If designers would like to keep open the option of using either standard or long

range modules in the same product please note the following. The ETRX358x series and the

ETRX358x-LRS series of modules are footprint compatible, but on the ETRX358x-LRS series pins

PB0 and PC5 of the EM358x are used internally to control the front-end module and are not

available to the user.”

ETRX358X

ETRX35

8x

Pad

Name

EM35

8x

Default use

Alternate Functions

1 GND GND GND

2 PC5 {1} 11 TX_ACTIVE

3 PC6 13 I/O OSC32B, nTX_ACTIVE

4 PC7 14 I/O OSC32A, OSC32_EXT

5 PA7 {4} 18 I/O TIM1C4

6 PB3 {2} 19 I/O, CTS SC1nCTS, SC1SCLK, TIM2C3

7 nReset {5} 12 nReset

8 PB4 {2} 20 I/O, RTS TIM2C4, SC1nRTS, SC1nSSEL

9 PA0 21 I/O TIM2C1, SC2MOSI, USBDM{7]

10 PA1 22 I/O TIM2C3, SC2SDA, SC2MISO, USBDP{6}

11 PA2 24 I/O TIM2C4, SC2SCL, SC2SCLK

12 PA3 25 I/O SC2nSSEL, TIM2C2

13 GND GND GND

14 PA4 26 I/O ADC4, PTI_EN, TRACEDATA

15 PA5 {3} 27 I/O ADC5, PTI_DATA, nBOOTMODE, TRACEDATA3

16 PA6 {4} 29 I/O TIM1C3

17 PB1 30 TXD SC1MISO, SC1MOSI, SC1SDA, SC1TXD, TIM2C1

18 PB2 31 RXD SC1MISO, SC1MOSI, SC1SCL, SC1RXD, TIM2C2

19 GND GND GND

20 GND GND GND

21 JTCK 32 SWCLK

22 PC2 33 I/O JTDO, SWO, TRACEDATA0

23 PC3 34 I/O JTDI, TRACECLK

24 PC4 35 I/O JTMS, SWDIO

25 PB0 36 I/O, IRQ VREF, IRQA, TRACEDATA2, TIM1CLK, TIM2MSK

26 PC1 38 I/O ADC3, TRACEDATA0

27 PC0 {4} 40 I/O JRST, IRQD, TRACEDATA1

28 PB7 {4} 41 I/O ADC2, IRQC, TIM1C2

29 PB6 {4} 42 I/O ADC1, IRQB, TIM1C1

30 PB5 43 I/O ADC0, TIM2CLK, TIM1MSK

31 GND GND GND

32 Vcc Vcc Vcc

33 GND GND GND

Table 3: Pin Information

Notes:

{1} When the alternate function is selected, TX_ACTIVE becomes an output that indicates that the

EM358x radio circuit is in transmit mode. PC5 is not usable on the long range version of the

ETRX358x as this GPIO is used internally as TX_ACTIVE to control the external RF frontend.

{2} The serial UART connections TXD, RXD, CTS and RTS are PB1, PB2, PB3 and PB4 respectively

{3} If PA5 is driven low at power-up or reset the module will boot up in the bootloader

{4} PA6, PA7, PB6, PB7 and PC0 can drive high current (see section 8)

{5} nRESET is level-sensitive, not edge-sensitive. The module is held in the reset state while nRESET

is low.

{6} ETRX3588, ETRX3586, ETRX3582 and ETRX3588HR, ETRX3586HR, ETRX3582HR variants only

See also the table “Module pads and functions” in the ETRX357 Development Kit Product

Manual. Refer to the Silicon Labs EM358x manual for details of the alternate functions and pin

names.

ETRX358X

4 Hardware Description

24MHz

* Not available on all Types

EM358x

I/O

UART

USB*

I / O

programming

5

JTAG

V

cc

V

reg

RESET

BALUN

integrated

antenna

U.FL socket

rf

terminal

selection,

filtering and

matching

circuitry

LDO

1V8

1,8Vdc

A/D

LDO

1V25

Figure 2: Hardware Diagram

The ETRX358x and ETRX358xHR families are based on the Silicon Labs EM358x family of

ZigBee SoCs. The EM358x and EM358xHR are fully integrated 2.4GHz ZigBee transceivers with a

32-bit ARM

®

Cortex M3

TM

microprocessor, flash and RAM memory, and peripherals.

The industry standard serial wire and JTAG programming and debugging interfaces together with

the standard ARM system debug components help to streamline any custom software

development.

In addition to this a number of MAC functions are also implemented in hardware to help

maintaining the strict timing requirements imposed by the ZigBee and IEEE802.15.4 standards.

The new advanced power management features allow faster wakeup from sleep and new power

down modes allowing this 4

th

generation module to offer a longer battery life than any 1

st

and 2

nd

generation modules on the market.

The EM358x modules have fully integrated voltage regulators for both required 1.8V and 1.25V

supply voltages. The voltages are monitored (brown-out detection) and the built in power-on-reset

circuit eliminates the need for any external monitoring circuitry. An optional 32.768 kHz watch

crystal can be connected externally to pads 3 and 4 in case more accurate timing is required. To

utilize the external watch crystal custom firmware is required.

4.1 Hardware Interface

All GPIO pins of the EM358x chips are accessible on the module’s pads. Whether signals are

used as general purpose I/Os, or assigned to a peripheral function like ADC is set by the firmware.

When developing custom firmware please refer to the EM358x datasheet [2].

ETRX358X

5 Firmware Description

By default, the modules will be pre-loaded with a standalone bootloader which supports over-the-

air bootloading as well as serial bootloading of new firmware.

In order to enter the standalone bootloader using a hardware trigger pull PA5 to ground and

power-cycle or reset the module. To avoid entering the standalone bootloader unintentionally

make sure not to pull this pin down during boot-up unless the resistance to ground is >10kΩ. (A

pull-up is not required).

Each module comes with a unique 64-bit 802.15.4 identifier which is stored in non-volatile memory.

A router is typically a mains powered device whilst a sleepy end device (SED) can be battery

powered.

The module is also able to act as a coordinator and Trust Centre through external host control.

ETRX358X

5.1 Token Settings

The ETRX358x Series Modules’ manufacturing tokens will be pre-programmed with the settings

shown in the table below.

Token Description TG Default

MFG_CIB_OBS Option Bytes <not written>

MFG_CUSTOM_VERSION Optional Version Number <not written>

MFG_CUSTOM_EUI_64 Custom EUI <not written>

MFG_STRING Device Specific String TELEGESIS

MFG_BOARD_NAME Hardware Identifier <Order Code>

MFG_MANUF_ID Manufacturer ID 0x1010

MFG_PHY_CONFIG Default Power Settings 0xFF26

MFG_BOOTLOAD_AES_KEY Bootloader Key <not written>

MFG_EZSP_STORAGE EZSP related <not written>

MFG_CBKE_DATA SE Security <not written>

MFG_INSTALLATION_CODE SE Installation <not written>

MFG_OSC24M_BIAS_TRIM Crystal Bias <not written>

MFG_SYNTH_FREQ_OFFSET Frequency offset <not written>

MFG_OSC24M_SETTLE_DELAY Crystal Stabilizing Time <not written>

MFG_SECURITY_CONFIG Security Settings <not written>

MFG_CCA_THRESHOLD CCA Threshold <not written>

MFG_SECURE_BOOTLOADER_KEY

Secure Bootloader Key <not written>

Table 4. Manufacturing tokens

5.2 Custom Firmware

The ETRX358x series of modules is an ideal platform for developing custom firmware. In order to

develop custom firmware the Silicon Labs Ember toolchain is required.

ETRX358X

6 Absolute Maximum Ratings

No.

Item

Symbol

Absolute Maximum Ratings

Unit

1 Supply voltage V

CC

-0.3 to +3.6 Vdc

2 Voltage on any Pad V

in

-0.3 to V

CC

+0.3 Vdc

3

Voltage on any Pad pin (PA4, PA5, PB5,

PB6, PB7, PC1), when used as an input

to the general purpose ADC with the

low voltage range selected

V

in

-0.3 to +2.0 Vdc

4 Storage temperature range T

stg

-40 to +105 °C

5 Operating temperature range T

op

-40 to +85 °C

6 Input RF level P

max

15 dBm

8 Reflow temperature T

Death

Please refer to chapter 12 °C

Table 5: Absolute Maximum Ratings

The absolute maximum ratings given above should under no circumstances be violated.

Exceeding one or more of the limiting values may cause permanent damage to the device.

Caution! ESD sensitive device. Precautions should be used when handling the device

in order to prevent permanent damage.

6.1 Environmental Characteristics

No.

Item

Symbol

Absolute Maximum Ratings

Unit

1 ESD on any pad according to

Human Body Model (HBM) circuit

description V

THHBM

±2 kV

2 ESD on non-RF pads according to

Charged Device Model (CDM) circuit

description V

THCDM

±400 V

3 ESD on RF terminal according to

Charged Device Model (CDM) circuit

description

V

THCDM

±225 V

4 Moisture Sensitivity Level MSL MSL3, per J-STD-033

Table 6: Absolute Maximum Ratings

6.2 Recommended Operating Conditions

No.

Item

Condition /

Remark Symbol Value Unit

Min

Typ

Max

1 Supply voltage V

CC

2.1 3.6 Vdc

2 RF Input Frequency f

C

2405 2480 MHz

3 RF Input Power p

IN

0 dBm

4 Operating temperature

range T

op

-40 +85 °C

Table 7: Recommended Operating Conditions

ETRX358X

7 DC Electrical Characteristics

V

CC

= 3.0V, T

AMB

= 25°C, NORMAL MODE (non-Boost) unless otherwise stated

No. Item

Condition /

Remark Symbol Value Unit

Min

Typ

Max

1 Module supply voltage V

CC

2.1 3.6 Vdc

Deep Sleep Current

2 Quiescent current,

internal RC oscillator

disabled, 4kB RAM retained I

SLEEP

1.0 µA

3 Quiescent current,

internal RC oscillator

enabled 4kB RAM retained I

SLEEP

1.25 µA

4 Quiescent current,

including

32.768kHz oscillator 4kB RAM retained I

SLEEP

1.6 µA

5

Quiescent current

including internal RC

oscillator and 32.768kHz

oscillator

4kB RAM retained I

SLEEP

1.9 µA

6 Additional current per

4kB block of RAM

retained I

RAMSLEEP

0,067 µA

Reset Current

7 Quiescent current

nReset asserted I

RESET

2 3 mA

Processor and Peripheral Currents

8 ARM

®

Cortex

TM

M3,

RAM and flash memory 25°C, 12MHz

Core clock I

MCU

7.5 mA

9 ARM

®

Cortex

TM

M3,

RAM and flash memory 25°C, 24MHz

Core clock I

MCU

8.5 mA

10 ARM

®

Cortex

TM

M3,

RAM and flash memory

sleep current

25°C, 12MHz

Core clock I

MCU

4.0 mA

11 ARM

®

Cortex

TM

M3,

RAM and flash memory

sleep current

25°C, 6MHz Core

clock I

MCU

2.5 mA

12 Serial controller current Per serial

controller at max.

clock rate I

SC

0.2 mA

13 General purpose timer

current Per timer at max.

clock rate I

TIM

0.25 mA

14 General purpose ADC

current Max. Sample rate,

DMA I

ADC

1.1 mA

15 USB Active Current I

USB

1 mA

16 USB Suspend Mode

Current I

USBSUSP

2.5 mA

RX Current

17 Radio receiver MAC and

Baseband ARM

®

Cortex

TM

M3 sleeping. I

RX

23.5 mA

18 Receive current

consumption Total, 12MHz

clock speed I

RX

27 mA

19 Receive current

consumption Total, 24MHz

clock speed I

RX

28 mA

20 Receive current

consumption

BOOST MODE

Total, 12MHz

clock speed I

RX

29 mA

21 Receive current

consumption

BOOST MODE

Total, 24MHz

clock speed I

RX

30 mA

ETRX358X

TX Current

22 Transmit current

consumption

at +3dBm module

output power,

CPU at 12MHz I

TXVCC

31.5 mA

23 Transmit Current

consumption

BOOST MODE

at +8dBm module

output power,

CPU at 12MHz I

TXVCC

44 mA

24 Transmit current

consumption

at +0dBm module

output power,

CPU at 12MHz I

TXVCC

29 mA

25 Transmit current

consumption

at min. module

output power,

CPU at 12MHz I

TXVCC

24 mA

26 Transmit current

consumption

at +8dBm module

output power,

CPU at 24MHz I

TXVCC

45 mA

26 Wake time from deep

sleep

From wakeup

event to 1

st

instruction 110 µs

27 Shutdown time From last

instruction into

deep sleep 5 µs

Table 8: DC Electrical Characteristics

Please Note: The average current consumption during operation is dependent on the firmware

and the network load.

ETRX358X

8 Digital I/O Specifications

The digital I/Os of the ETRX35x module

V

CC

= 3.0V, T

AMB

= 25°C, NORMAL MODE unless otherwise stated

No.

Item

Condition /

Remark Symbol Value Unit

Min

Typ

Max

1 Low Schmitt switching

threshold

Schmitt input

threshold going

from high to low V

SWIL

0.42 x V

CC

0.5 x V

CC

Vdc

2 High Schmitt switching

threshold

Schmitt input

threshold going

from low to high V

SWIH

0.62 x V

CC

0.8 x V

CC

Vdc

3 Input current for logic 0 I

IL

-0.5 µA

4 Input current for logic 1 I

IH

0.5 µA

5 Input Pull-up resistor

value R

IPU

24 29 34 kΩ

6 Input Pull-down resistor

value R

IPD

24 29 34 kΩ

7 Output voltage for logic 0 I

OL

= 4mA (8mA) for

standard (high

current) pads V

OL

0 0.18 x V

CC

V

8 Output voltage for logic 1 I

OH

= 4mA (8mA)for

standard (high

current) pads V

OH

0.82 x V

CC

V

CC

V

9 Output Source Current Standard current

pad I

OHS

4 mA

10 Output Sink current Standard current

pad I

OLS

4 mA

11 Output Source Current High current pad (1) I

OHH

8 mA

12 Output Sink current High current pad (1) I

OLH

8 mA

13 Total output current I

OH

+ I

OL

40 mA

Table 9. Digital I/O Specifications

No.

Item

Condition /

Remark Symbol Value Unit

Min

Typ

Max

1 Low Schmitt switching

threshold

Schmitt input

threshold going

from high to low V

SWIL

0.42 x V

CC

0.5 x V

CC

Vdc

2 High Schmitt switching

threshold

Schmitt input

threshold going

from low to high V

SWIH

0.62 x V

CC

0.68 x V

CC

Vdc

3 Input current for logic 0 I

IL

-0.5 µA

4 Input current for logic 1 I

IH

0.5 µA

5 Input Pull-up resistor

value Chip not reset R

IPU

24 29 34 kΩ

6 Input Pull-up resistor

value Chip reset R

IPURESET

12 14.5 17 kΩ

Table 10. nReset Pin Specifications

Notes

1) High current pads are PA6, PA7, PB6, PB7, PC0

ETRX358X

9 A/D Converter Characteristics

The ADC is a first-order sigma-delta converter. For additional information on the ADC please refer

to the EM358x datasheet.

No.

Item

1 A/D resolution Up to 14 bits

2 A/D sample time for 7-bit conversion 5.33µs (188kHz)

3 A/D sample time for 14-bit conversion 682µs

4 Reference Voltage 1.2V

Table 11. A/D Converter Characteristics

10 AC Electrical Characteristics

V

CC

= 3.0V, T

AMB

= 25°C, NORMAL MODE measured at 50Ω terminal load connected to the U.FL socket

No.

Receiver Value Unit

Min

Typ

Max

1 Frequency range 2400 2500 MHz

2 Sensitivity for 1% Packet Error Rate (PER) -100 -94 dBm

3 Sensitivity for 1% Packet Error Rate (PER) BOOST MODE -102 -96 dBm

4 Saturation (maximum input level for correct operation) 0 dBm

5 High-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 35 dB

6 Low-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 35 dB

7 2

nd

High-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 46 dB

8 2

nd

Low-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 46 dB

9 Channel Rejection for all other channels

(1% PER and desired signal –82dBm acc. to [1]) 40 dB

10 802.11g rejection centred at +12MHz or –13MHz

(1% PER and desired signal –82dBm acc. to [1]) 36 dB

11 Co-channel rejection

(1% PER and desired signal –82dBm acc. to [1]) -6 dBc

12 Relative frequency error

(2x40ppm required by [1]) -120 120 ppm

13 Relative timing error

(2x40ppm required by [1]) -120 120 ppm

14 Linear RSSI range 40 dB

15 Output power at highest power setting

NORMAL MODE

BOOST MODE

0

3

8 dBm

16 Output power at lowest power setting -55 dBm

17 Error vector magnitude as per IEEE802.15.4 5 15 %

18 Carrier frequency error -40 40 ppm

19 PSD mask relative

3.5MHz distance from carrier -20 dB

20 PSD mask absolute

3.5MHz distance from carrier -30 dBm

Table 12. RF Electrical Characteristics

ETRX358X

Please Note: For the relationship between EM358x power settings and module output power

please relate to chapter 10.1 of this document. When developing custom firmware the output

power settings described in this document relate directly to the EM358x power settings accessible

via the Ember stack API.

No.

Synthesiser Characteristics

Limit

Unit

Min

Typ

Max

22 Frequency range 2400 2500

MHz

23 Frequency resolution 11.7 kHz

24 Lock time from off state, with correct VCO DAC settings 100 µs

25 Relock time, channel change or Rx/Tx turnaround 100 µs

26 Phase noise at 100kHz offset -75dBc/Hz

27 Phase noise at 1MHz offset -100dBc/Hz

28 Phase noise at 4MHz offset -108dBc/Hz

29 Phase noise at 10MHz offset -114dBc/Hz

Table 13: Synthesiser Characteristics

No.

Power On Reset (POR) Specifications

Limit

Unit

Min

Typ

Max

30 V

CC

POR release 0.62 0.95 1.2 Vdc

31 V

CC

POR assert 0.45 0.65 0.85 Vdc

Table 14: Power On Reset Specifications

No.

nRESET Specifica

tions

Limit

Unit

Min

Typ

Max

32 Reset Filter Time constant 2.1 12 16 µs

33 Reset Pulse width to guarantee a reset 26 µs

34 Reset Pulse width guaranteed not to cause reset 0 1 µs

Table 15: nReset Specifications

ETRX358X

10.1 TX Power Characteristics

The diagrams below show the typical output power and module current in dependency on module

EM3588 power setting. Power settings above 3dBm have Boost Mode enabled. Please note that

the output power is independent of the supply voltage as the radio is supplied by an internally

regulated voltage.

Figure 3: Output Power vs. Power Setting (BOOST mode activated from Power setting of 4 upwards)

ETRX358X

Figure 4: Module Current vs. Power Setting (BOOST mode activated from Power setting of 4 upwards)

ETRX358X

10.2 Power Settings for Regulatory Compliance

Due to national restrictions the maximum power levels of the ETRX358x and ETRX358xHR family

of modules need to be adjusted as shown in the tables below. The default power setting of the

EmberZNet stack is +3dBm.

Antenna Channels 11-18 Channels 19-24 Channel 25 Channel 26

1/2 Wave 8dBm boost 8dBm boost 8dBm boost 8dBm boost

1/4 Wave 8dBm boost 8dBm boost 8dBm boost 8dBm boost

On Board 8dBm boost 8dBm boost 8dBm boost 8dBm boost

Table 10: Maximum Power Settings for European Compliance

Finally Table 11 lists the maximum Power settings for FCC, IC and C-Tick compliance.

Antenna Channels 11-18 Channels 19-24 Channel 25 Channel 26

1/2 Wave 8dBm boost 8dBm boost 7dBm boost -2dBm normal

1/4 Wave 8dBm boost 8dBm boost 7dBm boost -2dB normal

On Board 8dBm boost 8dBm boost 7dBm boost -2dB normal

Table 11: Maximum Power Settings for FCC, IC Compliance

ETRX358X

11 Physical Dimensions

Figure 5: ETRX3 Physical Dimensions

Symbol

Explanation

Typical

Distance

L Length of the module 25.0mm

W Width of the module 19.0mm

H Height of the module 3.8mm

A1 Distance centre of pad PCB edge 0.9mm

A2 Pitch 1.27mm

R1 Keep-out Zone from corner of PCB 17.5mm

R2 Keep-out Zone from corner of PCB 4.1mm

X1 Distance centre of Antenna connector PCB edge 3.8mm

X2 Distance centre of Antenna connector PCB edge 2.8mm

Table 12: ETRX3 Physical Dimensions

For ideal RF performance when using the on-board antenna, the antenna should be located at the

corner of the carrier PCB. There should be no components, tracks or copper planes in the keep-

out area which should be as large as possible. When using the U.FL RF connector the keep-out

area does not have to be obeyed. Note: The modules’ transmit/receive range will depend on the

antenna used and also the housing of the finished product.

ETRX358X

12 Recommended Reflow Profile

Recommended temperature profile

for reflow soldering

Temp

.[°C]

Time [s]

230°C -250°C max.

220°C

150°C – 200°C

90 ±30s

60 +60-20s

Figure 6. Recommended Reflow Profile

Use of “No-Clean” solder paste is recommended to avoid the requirement for a cleaning process.

Cleaning the module is strongly discouraged because it will be difficult to ensure no cleaning agent

and other residuals are remaining underneath the shielding can as well as in the gap between the

module and the host board.

Please Note:

Maximum number of reflow cycles: 2

Opposite-side reflow is prohibited due to the module’s weight. (i.e. you must not place the

module on the bottom / underside of your PCB and re-flow).

ETRX358X

13 Product Label Drawing

Figure 7: Product Label

The label dimensions are 16.0mm x 14.0 mm. The label will withstand temperatures and

chemicals used during a typical manufacturing process.

Example imprint

Description

ETRX358xHR

Module Order code Possible codes are:

- ETRX3581

- ETRX3581HR

- ETRX3582

- ETRX3582HR

- ETRX3585

- ETRX3585HR

- ETRX3586

- ETRX3586HR

- ETRX3587

- ETRX3587HR

- ETRX3588

- ETRX3588HR

000001 Indication for the serial number.

090101 Production Date Code in the format YYMMDD, e.g. 090602

01 Indication for factory ID

02 Indication for the hardware revision

FCC ID: S4GEM358X FCC ID code for this product

IC: 8735A-EM358X The IC ID

CE The CE Mark

2D-Barcode

Information in the Datamatrix 2D-Barcode are the serial number [6 characters], the Part-Order

code [12 characters], identifier for the batch number [2 characters], the identifier for the

hardware release [2 characters] and the production date code in the format Year-Month-Day

[6 characters], all separated by a semicolon.

Table 13: ETRX358x Label Details

ETRX358X

14 Recommended Footprint

In order to surface mount an ETRX3 series module, we recommend that you use pads which are

1mm wide and 1.2mm high. You must retain the keep-out zone shown in section 11, and ensure

that this keep-out area is free of components, copper tracks and/or copper planes/layers.

You must also ensure that there is no exposed copper on your layout which may contact with the

underside of the ETRX3 series module.

For best RF performance it is required to provide good ground connections to the ground pads of

the module. It is recommended to use multiple vias between each ground pad and a solid ground

plane to minimize inductance in the ground path.

Figure 8: Recommended Footprint

The land pattern dimensions above serve as a guideline.

We recommend that you use the same pad dimensions for the solder paste screen as you have for

the copper pads. However these sizes and shapes may need to be varied depending on your

soldering processes and your individual production standards. We recommend a paste screen

thickness of 120µm to 150µm.

Figure 9 shows the typical pad dimensions of the module and Figure 10-Figure 12 in section 14.1

show examples of how to align the module on its host PCB.

ETRX358X

Although the undersides of the ETRX3 series modules are fully coated, no exposed copper, such

as uncovered through-hole vias, planes or tracks on your board component layer, should be

located below the ETRX3 series module in order to avoid ‘shorts’. All ETRX3 series modules use

a multilayer PCB containing an inner RF shielding ground plane, therefore there is no need to have

an additional copper plane directly under the ETRX3 series module.

Figure 9. Typical pad dimensions

Finally it is recommended to use no clean flux when soldering the ETRX358x family of modules

and to not use a washing process after reflow. If the process does require washing then care must

be taken that no washing agent is trapped underneath the shielding can after the drying process

has completed.

ETRX358X

14.1 Recommended Placement

When placing the module please either locate the antenna in the corner as shown in Figure 10 so

that the recommended antenna keepout zone is being followed, or add a no copper zone as

indicated in Figure 12.

Figure 10. Typical placement

Figure 11. How to not place the Module

ETRX358X

Figure 12. Adding a no copper / no component area

ETRX358X

14.2 Example carrier board

Since the RF performance of the module with the on board antenna is strongly dependent on the

proper location of the module on its carrier board, Figure 13 shows the reference carrier board

which was used during testing by Telegesis.

Figure 13. Reference Board

For best performance it is recommended to locate the antenna towards the corner of the carrier

board and to respect the recommended keep-out areas as described in section 11.

Finally to provide a good reference ground to the on board antenna, the carrier board should have

a ground plane spanning no less than 40 x 40mm. In many cases a smaller ground plane will

suffice, but degradation in radio performance could be the result.

ETRX358X

15 Reliability Tests

The measurements below have been conducted on random samples out of mass production and

passed after the module has been exposed to standard room temperature and humidity for 1 hour.

No

Item

Limit

Condition

1 Vibration test Electrical parameter should be

in specification

Freq.:40Hz,Amplitude:1.5mm

20min. / cycle,1hrs. each of X and Y axis

2 Shock test the same as the above Dropped onto hard wood from height of

50cm for 10 times

3 Heat cycle test the same as the above -40°C for 30min. and +85°C for 30min.;

each temperature 300 cycles

5 Low temp. test the same as the above -40°C, 300h

6 High temp. test the same as the above +85°C, 300h

Table 14: Reliability Tests

16 Application Notes

16.1 Safety Precautions

These specifications are intended to preserve the quality assurance of products as individual

components.

Before use, check and evaluate the module’s operation when mounted on your products.

Abide by these specifications when using the products. These products may short-circuit. If

electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a

short circuit occurs, then provide the following failsafe functions as a minimum:

(1) Ensure the safety of the whole system by installing a protection circuit and a protection

device.

(2) Ensure the safety of the whole system by installing a redundant circuit or another

system to prevent a single fault causing an unsafe status.

16.2 Design Engineering Notes

(1) Heat is the major cause of shortening the life of the modules. Avoid assembly and use

of the target equipment in conditions where the product’s temperature may exceed the

maximum allowable.

(2) Failure to do so may result in degrading of the product’s functions and damage to the

product.

(3) If pulses or other transient loads (a large load applied in a short time) are applied to the

products, before use, check and evaluate their operation when assembled onto your

products.

(4) These products are not intended for other uses, other than under the special conditions

shown below. Before using these products under such special conditions, check their

performance and reliability under the said special conditions carefully, to determine

whether or not they can be used in such a manner.

ETRX358X

(5) In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where

liquid may splash.

(6) In direct sunlight, outdoors, or in a dusty environment

(7) In an environment where condensation occurs.

(8) In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2,

SO2, H2S, NH3, and NOx)

(9) If an abnormal voltage is applied due to a problem occurring in other components or

circuits, replace these products with new products because they may not be able to

provide normal performance even if their electronic characteristics and appearances

appear satisfactory.

(10) Mechanical stress during assembly of the board and operation has to be avoided.

(11) Pressing on parts of the metal cover or fastening objects to the metal cover is not

permitted.

16.3 Storage Conditions

(1) The module must not be stressed mechanically during storage.

(2) Do not store these products in the following conditions or the performance

characteristics of the product, such as RF performance, may well be adversely

affected:

(3) Storage in salty air or in an environment with a high concentration of corrosive gas,

such as Cl2, H2S, NH3, SO2, or NOX

(4) Storage (before assembly of the end product) of the modules for more than one year

after the date of delivery at your company even if all the above conditions (1) to (3)

have been met, should be avoided.

ETRX358X

17 Packaging

17.1 Embossed Tape

(1) Dimensions of the tape

(2) Cover tape peel force

Force direction

Speed = 300mm/min.

Cover tape peel force

=0.098～0.68N (10～70g)

θ= 10deg

(3) Empty pockets

NB: Empty pockets in the populated area will be less than two per reel and those empty pockets

will not be consecutive.

Empty pockets

more

Components

Empty pockets

Top cover

tape

Direction of

feed

g

ETRX358X

17.2 Component Orientation

Top cover tape will not obstruct the carrier tape holes and will not extend beyond the edges

of the carrier tape

(top view)

Component Orientation

Part No.

Direction

17.3 Reel Dimensions

(4) Quantity per reel: 600 pieces

(5) Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code will be on

the reel

ETRX358X

17.4 Packaging

(6) Each reel will be packed in a hermetically-sealed bag

(7) Marking: Reel / Antistatic Packaging / Reel Box and outer Box will carry the following

label

Imprint Description

MFG P/N: 99X902DL Internal use

Lot: 00 Internal use

P/N:ETRX3587 Telegesis Module Order Code.

Quantity:600 Quantity of modules inside the reel/carton

Reel No: 000001 Six digit unique Reel number counting up from 000001

Date:120824

Date Code in the format YYMMDD, e.g. 120824

P/C: ETRX3587-R308 Module product code with reference to firmware/module type selected during ATE. If

needed multiline.

2D-Barcode

Information in the 32x32 Datamatrix 2D-Barcode are and identifier “!REEL” [5

characters], the reel number [6 characters], the Module Order code [max 18 characters

], the quantity [max 4 characters] , the date code in the format Year-Month-Day [6

characters] and the product code [max 40 characters] , all separated by a semicolon.

ETRX358X

18 Ordering Information

19 Trademarks

All trademarks, registered trademarks and products names are the sole property of their respective

owners.

2

MOQ and Lead Time applies. Only stocked modules are ETRX3587 and ETRX3587HR

Ordering/Product Code

Description

ETRX3581

2

ETRX3582

2

ETRX3585

2

ETRX3586

2

ETRX3587

ETRX3588

2

Telegesis Wireless Mesh Networking Module with Silicon

Labs ZigBee Technology:

• Based on Silicon Labs EM358x SoCIntegrated 2.4GHz

Antenna

ETRX3581HR

2

ETRX3582HR

2

ETRX3585HR

2

ETRX3586HR

2

ETRX3587HR

ETRX3588HR

2

Telegesis Wireless Mesh Networking Module with Silicon

Labs ZigBee

Technology:

• Based on Silicon Labs EM358x SoCU.FL coaxial

Antenna Connector

ETRX3

5

7DVK

Telegesis Development Kit with:

• 3 x ETRX3DVK Development Boards

• 3 x USB cables

• 2 x ETRX357 on carrier boards

• 2 x ETRX357HR on carrier boards

• 2 x ETRX357-LRS on carrier boards

• 2 x ETRX357HR-LRS on carrier boards

• 1 x ETRX3USB USB stick

• 2 x ½-wave antennae2 x ¼-wave antennae

ETRX3587 Expansion Pack

•

2 x ETRX3587 on carrier boards

• 2 x ETRX3587HR on carrier boards

• 2 x ETRX3587-LRS on carrier boards

• 2 x ETRX3587HR-LRS on carrier boards

Notes:

• Customers’ PO’s must state the Ordering/Product Code.

• There is no “blank” version of the ETRX358x modules available.

ETRX358X

20 Disclaimer

Product and company names and logos referenced may either be trademarks or registered

trademarks of their respective companies. We reserve the right to make modifications and/or

improvements without prior notification. All information is correct at time of issue. Telegesis (UK)

Ltd does not convey any license under its patent rights or assume any responsibility for the use of

the described product

21 RoHS Declaration

Declaration of environmental compatibility for supplied products:

Hereby we declare to our best present knowledge based on the declaration of our suppliers that

this product does not contain any of the substances which are banned by Directive 2011/65/EU

(RoHS)

22 Data Sheet Status

Telegesis (UK) Ltd. reserves the right to change the specification without notice, in order to

improve the design and supply the best possible product. Please consult the most recently issued

data sheet before initiating or completing a design.

23 Life Support Policy

This product is not designed for use in life support appliances, devices, or systems where

malfunction can reasonably be expected to result in a significant personal injury to the user, or as a

critical component in any life support device or system whose failure to perform can be reasonably

expected to cause the failure of the life support device or system, or to affect its safety or

effectiveness. Customers using or selling these products for use in such applications do so at their

own risk and agree to fully indemnify Telegesis (UK) Ltd. for any damages resulting.

ETRX358X

24 Related Documents

[1] IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical

Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-

WPANs)

[2] Datasheet EM358x, Silicon Labs. (www.silabs.com)

[3] Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors -

Low Profile 1.9mm or 2.4mm Mated Height

[4] The ZigBee specification (www.zigbee.org)

[5] Specification for Antenova Rufa Antenna (www.antenova.com)

[6] Embedded Antenna design Ltd. (EAD Ltd.) (www.ead-ltd.com)

25 Contact Information

Website: www.telegesis.com

E-mail sales@telegesis.com

Telegesis (UK) Limited

Abbey Barn Business Centre

Abbey Barn Lane

High Wycombe

Bucks

HP10 9QQ

UK

Tel: +44 (0)1494 510199

Fax: +44 (0)5603 436999

Silicon Laboratories Finland EM358X ETRX3581, ETRX3582, ETRX3585, ETRX3586, ETRX3587, ETRX3588, ETRX3581HR, ETRX3582HR, ETRX3585HR, ETRX3586HR, ETRX3587HR, ETRX3588HR User Manual TG PM 0509 ETRX358x r5

Telegesis (UK) Ltd ETRX3581, ETRX3582, ETRX3585, ETRX3586, ETRX3587, ETRX3588, ETRX3581HR, ETRX3582HR, ETRX3585HR, ETRX3586HR, ETRX3587HR, ETRX3588HR TG PM 0509 ETRX358x r5

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