Telit Communications S p A LE940B6NA LE940B6-NA User Manual

Telit Communications S.p.A. LE940B6-NA

User Manual

LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 2 of 104 This documentation applies to the following products: Table 1: Applicability Table Module Name Description LE940B6-NA AUTO North America regional variant (AT&T and T-Mobile) LE940B6-NV AUTO North America region variant (Verizon, AT&T and T-Mobile) LE940B6-RW AUTO Rest of World variant (Europe, APAC, Latin America and more) LE940B6-CN AUTO China variant Note: NV variant - to be developed
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 3 of 104 SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Notice While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in the content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey any license under its patent rights or the rights of others. It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country. Copyrights This instruction manual and the Telit products described in this instruction manual may be, include, or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute, and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged, or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product. Computer Software Copyrights Telit and third-party software (SW) products described in this instruction manual may include copyrighted Telit and other third-party computer programs stored in semiconductor memories or other media. Laws in Italy and other countries preserve for Telit and other third-party SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other third-party SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the third-party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other third-party SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 4 of 104 Usage and Disclosure Restrictions License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by an express license agreement only and may be used only in accordance with the terms of such an agreement. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit. High Risk Materials Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of nuclear facilities, aircraft navigation or aircraft communication systems, air traffic control, life support, or weapons systems (“high risk activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such high risk activities. Trademarks TELIT and the stylized T logo are trademarks and/or registered trademarks of Telit Communications S.p.A. in the Unites States and/or other countries. All other product or service names are the property of their respective owners. Copyright © 2016 Telit Communications S.p.A.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 5 of 104 Contents 1. Introduction ..................................................................................................... 12 1.1. Scope ................................................................................................................ 12 1.2. Audience .......................................................................................................... 12 1.3. Contact Information, Support .......................................................................... 12 1.4. Text Conventions ............................................................................................. 13 1.5. Related Documents .......................................................................................... 14 1.6. Abbreviations ................................................................................................... 14 1.7. Document Organization ................................................................................... 15 2. General Product Description ............................................................................ 17 2.1. Overview .......................................................................................................... 17 2.2. Applications ..................................................................................................... 17 2.3. General Functionality and Main Features ....................................................... 18 2.4. Environmental Requirements .......................................................................... 19 2.4.1. Temperature Range .............................................................................. 19 2.4.2. RoHS Compliance.................................................................................. 19 2.5. Operating Frequency Bands............................................................................. 20 2.5.1. RF Bands per Regional Variant ............................................................. 20 2.5.2. Reference Table of RF Bands Characteristics ....................................... 21 2.6. Sensitivity ......................................................................................................... 24 2.7. LE940B6 Mechanical Specifications ................................................................. 25 2.7.1. Dimensions ........................................................................................... 25 2.7.2. Weight .................................................................................................. 25 3. LE940B6 Module Connections .......................................................................... 26 3.1. Pin-out .............................................................................................................. 26 3.2. LE940B6 Signals That Must Be Connected ...................................................... 36 3.3. LGA Pads Layout ............................................................................................... 38 4. Electrical Specifications .................................................................................... 39 4.1. Absolute Maximum Ratings – Not Operational ............................................... 39
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 6 of 104 4.2. Recommended Operating Conditions ............................................................. 39 4.3. Logic Level Specifications ................................................................................. 40 4.3.1. 1.8V Standard GPIOs ............................................................................ 40 4.3.2. 1.8V I2C Pads ........................................................................................ 41 4.3.3. 1.2V EMIC Pads ..................................................................................... 41 4.3.4. 1.8V/2.9V SIM Pads .............................................................................. 42 4.3.5. USB........................................................................................................ 42 4.3.6. 2.5V/3.3V EMAC Interface for RMII and RGMII ................................... 43 5. Hardware Commands ....................................................................................... 44 5.1. Turning on the LE940B6 Module ..................................................................... 44 5.2. Initialization and Activation State .................................................................... 44 5.3. Turning off the LE940B6 Module ..................................................................... 48 5.3.1. Shutdown by Software Command ....................................................... 48 5.3.2. Hardware Shutdown ............................................................................. 50 5.3.3. Unconditional Hardware Reset (RESET_N)........................................... 51 5.3.4. Unconditional Hardware Shutdown ..................................................... 52 6. Power Supply ................................................................................................... 54 6.1. Power Supply Requirements............................................................................ 54 6.2. General Design Rules ....................................................................................... 57 6.2.1. Electrical Design Guidelines .................................................................. 57 6.2.1.1. + 5V Input Source Power Supply – Design Guidelines ......... 57 6.2.1.2. + 12V Input Source Power Supply – Design Guidelines ....... 58 6.2.1.3. Battery Source Power Supply – Design Guidelines .............. 60 6.2.2. Thermal Design Guidelines ................................................................... 61 6.2.3. Power Supply PCB Layout Guidelines ................................................... 61 7. Antenna(s) ....................................................................................................... 63 7.1. GSM/WCDMA/TD-SCDMA/LTE Antenna Requirements ................................. 63 7.2. GSM/WCDMA/TD-SCDMA/LTE Antenna – PCB Line Guidelines ..................... 63 7.3. GSM/WCDMA/TD-SCDMA/LTE Antenna – Installation Guidelines ................. 65 7.4. Secondary Antenna Requirements .................................................................. 65
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 7 of 104 7.5. PCB Guidelines in case of FCC certification ..................................................... 65 7.5.1. Transmission line design....................................................................... 65 7.5.2. Transmission line measurements ......................................................... 66 8. Hardware Interfaces......................................................................................... 69 8.1. USB Port ........................................................................................................... 70 8.2. Serial Ports ....................................................................................................... 71 8.2.1. Modem Serial Port 1 ............................................................................. 72 8.2.2. Modem Serial Port 2 ............................................................................. 73 8.2.3. Modem Serial Port 3 ............................................................................. 73 8.2.4. RS232 Level Translation ........................................................................ 74 8.3. Peripheral Ports ............................................................................................... 76 8.3.1. SPI – Serial Peripheral Interface ........................................................... 76 8.3.2. I2C - Inter-integrated Circuit ................................................................ 77 8.4. Ethernet Interface ............................................................................................ 77 8.5. Audio Interface ................................................................................................ 78 8.5.1. Analog Audio ........................................................................................ 78 8.5.2. Digital Audio ......................................................................................... 79 8.6. General Purpose I/O ........................................................................................ 79 8.6.1. Using a GPIO Pad as Input .................................................................... 80 8.6.2. Using a GPIO Pad as Output ................................................................. 80 9. Miscellaneous Functions .................................................................................. 82 9.1. Indication of Network Service Availability ....................................................... 82 9.2. RTC – Real Time Clock ...................................................................................... 83 9.3. VAUX Power Output ........................................................................................ 83 9.4. ADC Converter ................................................................................................. 83 9.4.1. Description............................................................................................ 83 9.4.2. Using the ADC Converter ...................................................................... 83 9.5. Using the Temperature Monitor Function ...................................................... 84 9.6. Fuel Gauge (TBD) ............................................................................................. 84 9.7. eFuse ................................................................................................................ 84
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 8 of 104 10. Mounting the Module on your Board ............................................................... 85 10.1. General ............................................................................................................. 85 10.2. Finishing & Dimensions .................................................................................... 85 10.3. Recommended Footprint for the Application ................................................. 86 10.4. Stencil ............................................................................................................... 87 10.5. PCB Pad Design ................................................................................................ 87 10.6. Recommendations for PCB Pad Dimensions (mm) .......................................... 88 10.7. Solder Paste ..................................................................................................... 89 10.7.1. Solder Reflow ........................................................................................ 89 11. Application Guide ............................................................................................ 91 11.1. Debug of the LE940B6 Module in Production ................................................. 91 11.2. Bypass Capacitor on Power Supplies ............................................................... 92 11.3. SIM Interface .................................................................................................... 93 11.3.1. SIM Schematic Example ........................................................................ 93 11.4. EMC Recommendations ................................................................................... 94 11.5. Download and Debug Port ............................................................................... 94 11.6. Antenna Detection ........................................................................................... 95 12. Packing System ................................................................................................ 96 12.1. Tray Drawing .................................................................................................... 98 12.2. Moisture Sensitivity ......................................................................................... 98 13. Conformity Assessment Issues ......................................................................... 99 13.1. FCC/IC Regulatory Notices ............................................................................... 99 14. Safety Recommendations ................................................................................ 101 15. Document History ........................................................................................... 102
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 9 of 104 List of Tables Table 1: Applicability Table ................................................................................................................. 2 Table 2: Related Documents ............................................................................................................ 14 Table 3: Document Structure ........................................................................................................... 15 Table 4: RF Bands per Regional Variant ............................................................................................ 20 Table 5: RF Bands Characteristics ..................................................................................................... 21 Table 6: LE940B6 Pin-out .................................................................................................................. 26 Table 7: Mandatory Signals .............................................................................................................. 36 Table 8: Absolute Maximum Ratings – Not Operational .................................................................. 39 Table 9: Recommended Operating Conditions ................................................................................ 39 Table 10: Absolute Maximum Ratings – Not Functional .................................................................. 40 Table 11: Operating Range – Interface Levels (1.8V CMOS) ............................................................ 40 Table 12: Operating Range – 1.8V I2C Pads ..................................................................................... 41 Table 13: Operating Range – 1.2V EMIC Pads .................................................................................. 41 Table 14: Operating Range – 1.8V SIM Pads .................................................................................... 42 Table 15: Operating Range – 2.9V SIM Pads .................................................................................... 42 Table 16: Operating Range – USB_D+, USB_D- Pads ........................................................................ 42 Table 17: Absolute Maximum Ratings – 3.3V EMAC Interface......................................................... 43 Table 18: Operating Range – 2.5V EMAC Interface .......................................................................... 43 Table 19: Operating Range – 3.3V EMAC Interface .......................................................................... 43 Table 20: Power Supply Requirements ............................................................................................ 54 Table 21: LE940B6 Current Consumption ........................................................................................ 54 Table 22: Primary Antenna Requirements ...................................................................................... 63 Table 23: Antenna Line on PCB Requirements ................................................................................. 64 Table 24: LE940B6 Hardware Interfaces .......................................................................................... 69 Table 25: USB Interface Signals ........................................................................................................ 70 Table 26: Modem Serial Port 1 Signals ............................................................................................. 72 Table 27: Modem Serial Port 2 Signals ............................................................................................. 73 Table 28: Modem Serial Port 3 Signals ............................................................................................. 73 Table 29: SPI Signals ......................................................................................................................... 76 Table 30: Ethernet Interface ............................................................................................................. 77 Table 31: Analog Audio Signals ......................................................................................................... 78 Table 32: Digital Audio Interface (DVI) Signals ................................................................................. 79 Table 33: GPIOs ................................................................................................................................ 79 Table 34: Network Service Availability Indication ............................................................................ 82 Table 35: Operating Range – VAUX Power Supply ........................................................................... 83 Table 36: ADC Parameters ................................................................................................................ 83 Table 37: Recommendations for PCB Pad Surfaces ......................................................................... 88 Table 38: Solder Profile Characteristics ............................................................................................ 90 Table 39: SIM Interface – C1 Range .................................................................................................. 93
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 10 of 104 Table 40: EMC Recommendations ................................................................................................... 94 Table 41: Tray Packing ...................................................................................................................... 96 Table 42: Packing Quantities ............................................................................................................ 96 Table 43: Document Revision History ............................................................................................ 102
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 11 of 104 List of Figures Figure 1: LE940B6 High-level Functionality ...................................................................................... 18 Figure 2: LGA Pads Layout LE940B6 334 Pads Top View .................................................................. 38 Figure 3: Power-on Circuit ................................................................................................................ 44 Figure 4: LE940B6 Initialization and Activation ................................................................................ 45 Figure 5: Power-up Flow Chart ......................................................................................................... 46 Figure 6: AT Command Managing Flow Chart .................................................................................. 47 Figure 7: Shutdown by Software Command ..................................................................................... 49 Figure 8: Hardware Shutdown .......................................................................................................... 50 Figure 9: Circuit for Unconditional Hardware Reset ........................................................................ 51 Figure 10: Circuit for Unconditional Hardware Shutdown ............................................................... 52 Figure 11: Turn Off Procedure .......................................................................................................... 53 Figure 12: Example of Linear Regulator with 5V Input ..................................................................... 58 Figure 13: Example of Switching Regulator with 12V Input – Part 1 ................................................ 59 Figure 14: Example of Switching Regulator with 12V Input – Part 2 ................................................ 59 Figure 15: ESD Protection for USB2.0 ............................................................................................... 71 Figure 16: RS232 Level Adaption Circuitry Example ......................................................................... 75 Figure 17: RS232 Serial Port Lines Connection Layout ..................................................................... 75 Figure 18: SPI Signal Connectivity ..................................................................................................... 76 Figure 19: GPIO Output Pad Equivalent Circuit ................................................................................ 81 Figure 20: Status LED circuit example .............................................................................................. 82 Figure 21: Fuel Gauge Connectivity Example ................................................................................... 84 Figure 22: Application Module Top View ......................................................................................... 86 Figure 23: PCB Pad Design ................................................................................................................ 87 Figure 24: PCB Pad Dimensions ........................................................................................................ 88 Figure 25: Inhibit Area for Micro-via ................................................................................................ 88 Figure 26: Solder Reflow Profile ....................................................................................................... 89 Figure 27: SIM Schematics ................................................................................................................ 93 Figure 28: Tray Packing ..................................................................................................................... 97 Figure 29: Tray Drawing .................................................................................................................... 98
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 12 of 104 1. Introduction 1.1. Scope This document introduces the Telit LE940B6 module and presents possible and recommended hardware solutions for developing a product based on the LE940B6 module. All the features and solutions detailed in this document are applicable to all LE940B6 variants, where “LE940B6” refers to the variants listed in the applicability table. If a specific feature is applicable to a specific product only, it will be clearly marked. NOTE: LE940B6 refers to all modules listed in the Applicability Table. This document takes into account all the basic functions of a wireless module; suggests a valid hardware solution for each function, and points out incorrect solutions and common errors to be avoided. Obviously, this document cannot embrace every hardware solution or every product that can be designed. Obviously, avoiding invalid solutions must be considered mandatory. Where the suggested hardware configurations need not be considered mandatory, the information given should be used as a guide and a starting point for properly developing your product with the Telit LE940B6 module. NOTE: The integration of the GSM/GPRS/EGPRS/WCDMA/HSPA+/LTE LE940B6 cellular module within a user application must be done according to the design rules described in this manual. 1.2. Audience This document is intended for Telit customers, especially system integrators, about to implement their applications using the Telit LE940B6 module. 1.3. Contact Information, Support For general contact, technical support, to report documentation errors and to order manuals, contact Telit’s Technical Support Center (TTSC) at: • TS-EMEA@telit.com • TS-NORTHAMERICA@telit.com • TS-LATINAMERICA@telit.com • TS-APAC@telit.com
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 13 of 104 Alternatively, use: http://www.telit.com/en/products/technical-support-center/contact.php For detailed information about where you can buy the Telit modules or for recommendations on accessories and components, visit: http://www.telit.com To register for product news and announcements or for product questions contact Telit’s Technical Support Center (TTSC). Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Telit appreciates feedback from the users about the information provided. 1.4. Text Conventions The following conventions are used to emphasize specific types of information: Danger: This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning: Alerts the user to important points about integrating the module. If these points are not followed, the module and end user equipment may fail or malfunction. NOTE: Tip or Information – Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, that is, YYYY-MM-DD.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 14 of 104 1.5. Related Documents Table 2: Related Documents Document Title Document Number Ref 1: LE940B6 AT Command Reference Guide 80514ST10767A Ref 2: LE940B6 SW User Guide 1VV0301296 Ref 3: Telit EVK2 User Guide 1vv0300704 Ref 4: SIM Integration Design Guide 80000NT10001A 1.6. Abbreviations Table 3: Table of Abbreviations Term Definition ADC Analog-to-digital converter AE Application-enabled DAC Digital-to-analog converter FDD Frequency division duplex GLONASS Global orbiting navigation satellite system GNSS Global navigation satellite system GPIO General-purpose input/output GPRS General packet radio services GPS Global positioning system GSM Global system for mobile communications I2C Inter-integrated circuit LTE Long term evolution SD Secure digital
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 15 of 104 Term Definition RGMII Reduced Gigabit media-independent interface SIM Subscriber identity module SOC System-on-Chip SMX SmartMX SPI Serial peripheral interface UART Universal asynchronous receiver transmitter UMTS Universal mobile telecommunications system USB Universal serial bus WCI Wireless Coexistence Interface WCDMA Wideband code division multiple access 1.7. Document Organization This document contains the following chapters: Table 3: Document Structure Chapter# Chapter Title Description 1 Introduction Provides the scope of this document, target audience, contact and support information, and text conventions 2 General Product Description An overview of the product features 3 LE940B6 Module Connections Pinout configuration and layout 4 Electrical Specifications Specifies electrical values of logic levels for this module 5 Hardware Commands Instructs how to control the module via hardware 6 Power Supply Supply lines and current consumption
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 16 of 104 Chapter# Chapter Title Description 7 Antenna(s) Describes the antenna connections and related aspects of board layout design, which are most critical for the overall product design 8 Hardware Interfaces Specifies the peripheral and audio interfaces 9 Miscellaneous Functions 10 Mounting the Module on your Board 11 Application Guide 12 Packing System 13 Conformity Assessment Issues 14 Safety Recommendations 15 Document History
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 17 of 104 2. General Product Description 2.1. Overview LE940B6 is Telit’s platform for automotive telematics on-board units (OBU's) for applications, such as automotive telematics and eCall, based on the following technologies: • 4G cellular for voice and data communication • GNSS (optional) - GPS, GLONASS, BeiDou, Galileo, QZSS, for positioning service • Embedded security • Designed for automotive markets1 quality needs In its most basic use case, LE940B6 can be applied as a wireless communication front-end for telematics products, offering GNSS and mobile communication features to an external host CPU through its rich interfaces. LE940B6 can further support customer software applications and security features. LE940B6 is based on a Yocto Linux system running on an application processor. Thanks to a dedicated application processor and embedded security resources, product developers and manufacturers can create products that guarantee fraud prevention and tamper evidence without extra effort for additional security precautions. LE940B6 can be self-sufficient and serve as a fully integrated solution for applications, such as location-based cellular telematics, navigation, road pricing and eCall. In such a case, the customer would simply complement the module with a power supply, speaker amplifier, microphone, antennas, and an HMI (if applicable). LE940B6 is offered with different regional variants according to the list in Table 1: Applicability Table. 2.2. Applications LE940B6 can be used for telematics applications where tamper-resistance, confidentiality, integrity, and authenticity of end-user information are required, for example: • Emergency call • Telematics services • Road pricing • Pay-as-you-drive insurance • Stolen vehicles tracking • Internet connectivity 1 In accordance with Telit’s Robustness Validation, using AEC-Q100-defined qualification tests
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 18 of 104 2.3. General Functionality and Main Features The LE940B6 family of automotive cellular modules features an LTE and multi-RAT modem together with a powerful on-chip application processor and a rich set of interfaces. The major functions and features are listed below: • Multi-RAT with LTE carrier aggregation (Rel. 10, Cat. 6) • Flash + DDR large enough to allow the space for customer’s own software applications • Advanced security features • FOTA (optional) • Several region variants with optimal choice of RF bands in each for worldwide coverage of countries and MNOs • Well-designed form factor (40x40mm), accommodating the multiple RF bands in each region variant • Digital audio and analog audio codec • A GNSS function is not included within the module, but can be supported with the proper interface while mounted on the customer board • The entire module is designed by Telit for satisfying the environment and quality requirements of the automotive market Figure 1 shows the high-level functionality of the LE940B6 module. Figure 1: LE940B6 High-level Functionality
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 19 of 104 2.4. Environmental Requirements 2.4.1. Temperature Range Operating temperature range -20 ~ +55°C. This range is defined by 3GPP (the global standard for wireless mobile communication). Telit guarantees its modules to comply with all the 3GPP requirements and to have full functionality of the module with in this range. -40 ~ +85°C. Telit guarantees full functionality within this range as well. However, there may possibly be some performance deviations in this extended range relative to 3GPP requirements, which means that some RF parameters may deviate from the 3GPP specification in the order of a few dB. For example: receiver sensitivity or maximum output power may be slightly degraded. Even so, all the functionalities, such as call connection, SMS, USB communication, UART activation etc., will be maintained, and the effect of such degradations will not lead to malfunction. –40°C ~ +95°C. eCall must be functional (until the module is broken) Storage and non-operating temperature range –40°C ~ +95°C 2.4.2. RoHS Compliance As a part of the Telit corporate policy of environmental protection, the LE940B6 complies with the RoHS (Restriction of Hazardous Substances) directive of the European Union (EU directive 2011/65/EU).
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 20 of 104 2.5. Operating Frequency Bands The operating frequencies in WCDMA and LTE modes conform to the 3GPP specifications. 2.5.1. RF Bands per Regional Variant Table 4 summarizes all region variants within the LE940B6 family, showing the supported band sets in each variant and the supported band pairs for 2x carrier aggregation. Table 4: RF Bands per Regional Variant Band 41M for China: 2,555 - 2,655 MHz Region Variant LTE FDD LTE TDD HSPA+ TD-SCDMA 2G LE940B6-NA 2, 4, 5, 7, 12, 29(DL) - 2, 4, 5 - 2, 5 LTE Carrier Aggregation 2+5, 2+12, 2+29, 4+4, 4+5, 4+12, 4+29 LE940B6-NV 2, 4, 5, 7, 12, 13, 29(DL) - 2, 4, 5 - 2, 5 LTE Carrier Aggregation 2+5, 2+12, 2+13, 2+29, 4+4, 4+5, 4+12, 4+13, 4+29, LE940B6-RW 1, 2, 3, 4, 5, 7, 8, 19, 20, 21, 26, 28, 32(DL) - 1, 2, 3, 4, 5, 8, 19 - 2, 3, 5, 8 LTE Carrier Aggregation 1+5, 1+8, 1+19, 1+21, 1+26, 3+3, 3+5, 3+7, 3+19, 3+20, 3+26, 3+28, 4+4, 7+20, 7+28, 19+21, 20+32 LE940B6-CN 1, 3, 5, 8, 26 38, 39, 40, 41M 1, 3, 5, 8 34, 39 3, 8 LTE Carrier Aggregation 1+26, 3+3, 3+5, 3+26, 39+41, 40+40, 41+41
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 21 of 104 2.5.2. Reference Table of RF Bands Characteristics Table 5: RF Bands Characteristics Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset PCS 1900 1850.2 ~ 1909.8 1930.2 ~ 1989.8 512 ~ 810 80 MHz DCS 1800 1710.2 ~ 1784.8 1805.2 ~ 1879.8 512 ~ 885 95 MHz GSM 850 824.2 ~ 848.8 869.2 ~ 893.8 128 ~ 251 45 MHz EGSM 900 880.2 ~ 914.8 925.2 ~ 959.8 975 ~ 1023, 1 ~ 124 45 MHz WCDMA 2100 – B1 1920 ~ 1980 2110 ~ 2170 Tx: 9612 ~ 9888 Rx: 10562 ~ 10838 190 MHz WCDMA 1900 – B2 1850 ~ 1910 1930 ~ 1990 Tx: 9262 ~ 9538 Rx: 9662 ~ 9938 80 MHz WCDMA 1800 – B3 1710 ~ 1785 1805 ~ 1880 Tx: 937 ~ 1288 Rx: 1162 ~ 1513 95 MHz WCDMA AWS – B4 1710 ~ 1755 2110 ~ 2155 Tx: 1312 ~ 1513 Rx: 1537 ~ 1738 400 MHz WCDMA 850 – B5 824 ~ 849 869 ~ 894 Tx: 4132 ~ 4233 Rx: 4357 ~ 4458 45 MHz WCDMA 900 – B8 880 ~ 915 925 ~ 960 Tx: 2712 ~ 2863 Rx: 2937 ~ 3088 45 MHz WCDMA 1800 –B9 1750 ~ 1784.8 1845 ~ 1879.8 Tx: 8762 ~ 8912 Rx: 9237 ~ 9387 95 MHz WCDMA 800 – B19 830 ~ 845 875 ~ 890 Tx: 312 ~ 363 Rx: 712 ~ 763 45 MHz TDSCDMA 2000 – B34 2010 ~ 2025 2010 ~ 2025 Tx: 10050 ~ 10125 Rx: 10050 ~ 10125 0 MHz
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 22 of 104 Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset TDSCDMA 1900 – B39 1880 ~ 1920 1880 ~ 1920 Tx: 9400 ~ 9600 Rx: 9400 ~ 9600 0 MHz LTE 2100 – B1 1920 ~ 1980 2110 ~ 2170 Tx: 18000 ~ 18599 Rx: 0 ~ 599 190 MHz LTE 1900 – B2 1850 ~ 1910 1930 ~ 1990 Tx: 18600 ~ 19199 Rx: 600 ~ 1199 80 MHz LTE 1800 – B3 1710 ~ 1785 1805 ~ 1880 Tx: 19200 ~ 19949 Rx: 1200 ~ 1949 95 MHz LTE AWS – B4 1710 ~ 1755 2110 ~ 2155 Tx: 19950 ~ 20399 Rx: 1950 ~ 2399 400 MHz LTE 850 – B5 824 ~ 849 869 ~ 894 Tx: 20400 ~ 20649 Rx: 2400 ~ 2649 45 MHz LTE 2600 – B7 2500 ~ 2570 2620 ~ 2690 Tx: 20750 ~ 21449 Rx: 2750 ~ 3449 120 MHz LTE 900 – B8 880 ~ 915 925 ~ 960 Tx: 21450 ~ 21799 Rx: 3450 ~ 3799 45 MHz LTE 1800 – B9 1749.9 ~ 1784.9 1844.9 ~ 1879.9 Tx: 21800 ~ 2149 Rx: 3800 ~ 4149 95 MHz LTE AWS+ – B10 1710 ~ 1770 2110 ~ 2170 Tx: 22150 ~ 22749 Rx: 4150 ~ 4749 400 MHz LTE 700a – B12 699 ~ 716 729 ~ 746 Tx : 23010 ~ 23179 Rx : 5010 ~ 5179 30 MHz LTE 700c – B13 777 ~ 787 746 ~ 756 Tx : 23180 ~ 23279 Rx : 5180 ~ 5279 -31 MHz LTE 700b – B17 704 ~ 716 734 ~ 746 Tx: 23730 ~ 23849 Rx: 5730 ~ 5849 30 MHz
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 23 of 104 Mode Freq. Tx (MHz) Freq. Rx (MHz) Channels Tx-Rx Offset LTE 800 – B19 830 ~ 845 875 ~ 890 Tx: 24000 ~ 24149 Rx: 6000 ~ 6149 45 MHz LTE 800 – B20 832 ~ 862 791 ~ 821 Tx: 24150 ~ 24449 Rx: 6150 ~ 6449 -41 MHz LTE 1500 – B21 1447.9 ~ 1462.9 1495.9 ~ 1510.9 Tx: 24450 ~ 24599 Rx: 6450 ~ 6599 48 MHz LTE 850+ – B26 814 ~ 849 859 ~ 894 Tx: 26690 ~ 27039 Rx: 8690 ~ 9039 45 MHz LTE 700 – B28 703 ~ 748 758 ~ 803 Tx : 27210 ~ 27659 Rx : 9210 ~ 9659 45 MHz LTE 700d – B29 Downlink only 717 ~ 728 Rx: 9660 ~ 9769 0 MHz LTE 1500 – B32 Downlink only 1452 ~ 1496 Rx: 9920 ~ 10359 0 MHz LTE TDD 2600 – B38 2570 ~ 2620 2570 ~ 2620 Tx: 37750 ~ 38249 Rx: 37750 ~ 38249 0 MHz LTE TDD 1900 – B39 1880 ~ 1920 1880 ~ 1920 Tx: 38250 ~ 38649 Rx: 38250 ~ 38649 0 MHz LTE TDD 2300 – B40 2300 ~ 2400 2300 ~ 2400 Tx: 38650 ~ 39649 Rx: 38650 ~ 39649 0 MHz LTE TDD 2500 – B41 2496 ~ 2690 2496 ~ 2690 Tx: 39650 ~ 41589 Rx: 39650 ~ 41589 0 MHz
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 24 of 104 2.6. Sensitivity LE940B6 maximum sensitivity levels are as follows (exact performance figures will be specified at a later stage): • < 3GPP @ 2G • < 3GPP @ 3G • < 3GPP @ 4G FDD (BW=5 MHz) • < 3GPP @ 4G TDD (BW=5 MHz)
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 25 of 104 2.7. LE940B6 Mechanical Specifications 2.7.1. Dimensions The LE940B6 module’s overall dimensions are: • Length: 40 mm, +/- 0.20 mm tolerance • Width: 40 mm, +/- 0.20 mm tolerance • Thickness: 3.0 mm, +/- 0.15 mm tolerance (with label) 2.7.2. Weight The nominal weight of the LE940B6 module is 11 gram.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 26 of 104 3. LE940B6 Module Connections 3.1. Pin-out Table 6: LE940B6 Pin-out PAD Signal I/O Function Type COMMENT USB HS 2.0 Communication Port A18 USB_VBUS AI Power sense for the internal USB transceiver D19 USB_D+ I/O USB differential Data (+) F19 USB_D- I/O USB differential Data (-) Asynchronous UART AH19 C103/TXD I Serial data input (TXD) from DTE 1.8V AF19 C104/RXD O Serial data output (RXD) to DTE 1.8V AA18 C105/RTS I Input for Request To Send signal (RTS) from DTE 1.8V AK19 C106/CTS O Output for Clear To Send signal (CTS) to DTE 1.8V AG18 C107/DSR O Output for Data Set Ready signal (DSR) to DTE 1.8V AC18 C108/DTR I Input for Data Terminal Ready signal (DTR) from DTE 1.8V AE18 C109/DCD O Output for Data Carrier Detect signal (DCD) to DTE 1.8V AJ18 C125/RING O Output for Ring Indicator signal (RI) to DTE 1.8V Asynchronous Auxiliary UART AB19 TXD_AUX O Auxiliary UART (Tx Data to DTE) 1.8V AD19 RXD_AUX I Auxiliary UART (Rx Data from DTE) 1.8V Asynchronous UART3 AM9 UART3_TXD I Serial data input (TXD) from DTE 1.8V AM11 UART3_RXD O Serial data output (RXD) to DTE 1.8V AM13 UART3_RTS I Input for Request To Send (RTS) from DTE 1.8V AM15 UART3_CTS O Output for Clear To Send (CTS) to DTE 1.8V JTAG – Joint Test Action Group E4 JTAG_TDI I JTAG_TDI 1.8V F3 JTAG_RESOUT_N O JTAG_RESOUT* 1.8V F5 JTAG_TRIGOUT - JTAG_TRIGOUT 1.8V G2 JTAG_RTCK O JTAG_RTCK 1.8V
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 27 of 104 H3 JTAG_TCK I JTAG_TCK 1.8V J2 JTAG_TRST_N I JTAG_TRST* 1.8V K3 JTAG_TDO O JTAG_TDO 1.8V L2 JTAG_TMS I JTAG_TMS 1.8V M3 JTAG_TRIGIN - JTAG_TRIGIN 1.8V JTAG - MiPi 34 Interface L4 JTAG_PTI_CLK O MiPi Clock 1.8V N4 JTAG_PTI_DATA0 I/O MiPi Data 0 1.8V R4 JTAG_PTI_DATA1 I/O MiPi Data 1 1.8V T4 JTAG_PTI_DATA2 I/O MiPi Data 2 1.8V V4 JTAG_PTI_DATA3 I/O MiPi Data 3 1.8V SIM Card Interface A8 SIMVCC1 - External SIM signal – Power supply for the SIM 1.8/2.9V A10 SIMCLK1 O External SIM signal – Clock 1.8/2.9V B7 SIMIN1 I External SIM signal – Presence 1.8V Active Low B9 SIMIO1 I/O External SIM signal – Data I/O 1.8/2.9V B11 SIMRST1 O External SIM signal – Reset 1.8/2.9V SIM Card Interface 2 D15 SIMVCC2 - External SIM signal – Power supply for the SIM 1.8/2.9V C16 SIMCLK2 O External SIM signal – Clock 1.8/2.9V C18 SIMIN2 I External SIM signal – Presence (active low) 1.8V Active Low E16 SIMIO2 I/O External SIM signal – Data I/O 1.8/2.9V D17 SIMRST2 O External SIM signal – Reset 1.8/2.9V Analog Audio Interface B5 EAR1_MT+ AO Earphone signal output, phase + A4 EAR1_MT- AO Earphone signal output, phase - B3 MIC1_MT+ AI Microphone input, phase + A2 MIC1_MT- AI Microphone input, phase - G6 MIC_BIAS AO Microphone Bias Power Digital Voice Interface (DVI) C8 DVI_RX I Digital Voice interface (Rx) 1.8V C10 DVI_CLK O Digital Voice interface (CLK master output) 1.8V D9 DVI_TX O Digital Voice interface (Tx) 1.8V D11 DVI_WA0 O Digital Voice interface (WA0 master output) 1.8V SPI – Serial Peripheral Interface K19 SPI_MOSI O SPI data Master output Slave input 1.8V M19 SPI_MISO I SPI data Master input Slave output 1.8V
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 28 of 104 N18 SPI_CS O SPI Chip select output 1.8V P19 SPI_CLK O SPI Clock output 1.8V I2C Interface C14 I2C_SCL I/O I2C Clock 1.8V D13 I2C_SDA I/O I2C Data 1.8V Digital I/O F9 GPIO_01 I/O GPIO_01 1.8V E10 GPIO_02 I/O GPIO_02 1.8V F11 GPIO_03 I/O GPIO_03 1.8V E12 GPIO_04 I/O GPIO_04 1.8V F13 GPIO_05 I/O GPIO_05 1.8V E14 GPIO_06 I/O GPIO_06 1.8V R18 GPIO_07 I/O GPIO_07 1.8V S19 GPIO_08 I/O GPIO_08 1.8V U19 GPIO_09 I/O GPIO_09 1.8V W19 GPIO_10 I/O GPIO_10 1.8V L18 GPIO_11 I/O GPIO_11 1.8V J18 GPIO_12 I/O GPIO_12 1.8V AN4 GPIO_20 I/O GPIO_20 1.8V H1 GPIO_21 I/O GPIO_21 1.8V K1 GPIO_22 I/O GPIO_22 1.8V Analog to Digital Converter D5 ADC_IN1 AI Analog to Digital Converter Input 1 Analog E6 ADC_IN2 AI Analog to Digital Converter Input 2 Analog F7 ADC_IN3 AI Analog to Digital Converter Input 3 Analog Ethernet MAC/PHY Signals G14 MAC_MDC O Management Data Clock 2.5/3.3V G12 MAC_MDIO I/O Management Data I/O 2.5/3.3V V16 MAC_TXD[0] O RGMII or RMII TXD[0] 2.5/3.3V T16 MAC_TXD[1] O RGMII or RMII TXD[1] 2.5/3.3V R16 MAC_TXD[2] O RGMII TXD[2] 2.5/3.3V N16 MAC_TXD[3] O RGMII TXD[3] 2.5/3.3V L16 MAC_GTX_CLK O RGMII Transmit Clock 2.5/3.3V G16 MAC_TXEN_ER O RGMII Transmit Enable / Error or RMII Transmit Enable 2.5/3.3V AL16 MAC_RXD[0] I RGMII or RMII RXD[0] 2.5/3.3V AJ16 MAC_RXD[1] I RGMII or RMII RXD[1] 2.5/3.3V AG16 MAC_RXD[2] I RGMII RXD[2] 2.5/3.3V AE16 MAC_RXD[3] I RGMII RXD[3] 2.5/3.3V AC16 MAC_RX_CLK I RGMII Receive Clock 2.5/3.3V
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 29 of 104 X16 MAC_RXDV_ER I RGMII Receive Data Available/Error or RMII Receive Error 2.5/3.3V G10 ETH_INT_N I Ethernet PHY Interrupt 2.5/3.3V G8 ETH_RST_N O Ethernet PHY Reset Output 2.5/3.3V RF Section AD1 ANT_1 I/O Primary Antenna 1 RF AU9 ANT_DIV_1 I Diversity Antenna 1 RF S1 ANT_GPS I GPS Antenna RF Miscellaneous Functions F17 VRTC AI VRTC Backup capacitor - K17 VIO_1.8V O VIO_1.8V for reference voltage 1.8V AN8 RESET_N I Reset Input Active low AN10 SW_RDY O Indicates that the boot sequence completed successfully 1.8V AN12 SHDN_N I Unconditional Shutdown Input Active low AS1 ON_OFF_N I Power ON/OFF Input Active low AU3 STAT_LED O Status Indicator LED 1.8V P17 VAUX/PWRMON O Supply output for external accessories / Power ON Monitor 1.8V H17 VPP I Vpp for eFuse Power Supply AP17 VBATT - Main Power Supply (Digital Section) Power AP19 VBATT - Main Power Supply (Digital Section) Power AR18 VBATT - Main Power Supply (Digital Section) Power AR20 VBATT - Main Power Supply (Digital Section) Power AS17 VBATT_PA - Main Power Supply (RF Transmit Power Section) Power AS19 VBATT_PA - Main Power Supply (RF Transmit Power Section) Power AT18 VBATT_PA - Main Power Supply (RF Transmit Power Section) Power AU17 VBATT_PA - Main Power Supply (RF Transmit Power Section) Power AU19 VBATT_PA - Main Power Supply (RF Transmit Power Section) Power AT20 VBATT_PA - Main Power Supply (RF Transmit Power Section) Power Ground A6 GND - Ground Ground A12 GND - Ground Ground B13 GND - Ground Ground B15 GND - Ground Ground
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 30 of 104 B17 GND - Ground Ground C4 GND - Ground Ground C6 GND - Ground Ground D3 GND - Ground Ground D7 GND - Ground Ground E18 GND - Ground Ground F1 GND - Ground Ground G18 GND - Ground Ground H19 GND - Ground Ground M1 GND - Ground Ground N2 GND - Ground Ground P1 GND - Ground Ground P3 GND - Ground Ground R2 GND - Ground Ground T2 GND - Ground Ground T18 GND - Ground Ground U1 GND - Ground Ground V18 GND - Ground Ground W1 GND - Ground Ground X2 GND - Ground Ground X18 GND - Ground Ground Y1 GND - Ground Ground Y19 GND - Ground Ground AA2 GND - Ground Ground AB1 GND - Ground Ground AC2 GND - Ground Ground AE2 GND - Ground Ground AF1 GND - Ground Ground AG2 GND - Ground Ground AH1 GND - Ground Ground AJ2 GND - Ground Ground AK1 GND - Ground Ground AK17 GND - Ground Ground AL18 GND - Ground Ground AM17 GND - Ground Ground AM19 GND - Ground Ground AN16 GND - Ground Ground AN18 GND - Ground Ground AP3 GND - Ground Ground AP5 GND - Ground Ground
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 31 of 104 AP7 GND - Ground Ground AP9 GND - Ground Ground AP11 GND - Ground Ground AP13 GND - Ground Ground AP15 GND - Ground Ground AR2 GND - Ground Ground AR4 GND - Ground Ground AR6 GND - Ground Ground AR8 GND - Ground Ground AR10 GND - Ground Ground AR12 GND - Ground Ground AR14 GND - Ground Ground AR16 GND - Ground Ground AS5 GND - Ground Ground AS7 GND - Ground Ground AS9 GND - Ground Ground AS11 GND - Ground Ground AS13 GND - Ground Ground AS15 GND - Ground Ground AT4 GND - Ground Ground AT6 GND - Ground Ground AT8 GND - Ground Ground AT10 GND - Ground Ground AT12 GND - Ground Ground AT14 GND - Ground Ground AT16 GND - Ground Ground AU1 GND - Ground Ground AU5 GND - Ground Ground AU7 GND - Ground Ground AU11 GND - Ground Ground AU15 GND - Ground Ground AL2 GND - Ground Ground AN2 GND - Ground Ground L20 GND - Ground Ground N20 GND - Ground Ground ZZ19 GND - Ground Ground A20 GND - Ground Ground AV20 GND - Ground Ground ZZ1 GND - Ground Ground A0 GND - Ground Ground
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 32 of 104 AV0 GND - Ground Ground N0 GND - Ground Ground R0 GND - Ground Ground T0 GND - Ground Ground V0 GND - Ground Ground X0 GND - Ground Ground AA0 GND - Ground Ground AC0 GND - Ground Ground AE0 GND - Ground Ground AG0 GND - Ground Ground AJ0 GND - Ground Ground AL0 GND - Ground Ground AN0 GND - Ground Ground AR0 GND - Ground Ground AV8 GND - Ground Ground AV10 GND - Ground Ground AV12 GND - Ground Ground AV14 GND - Ground Ground AV16 GND - Ground Ground AV18 GND - Ground Ground T8 GND - Ground Ground V8 GND - Ground Ground X8 GND - Ground Ground AA8 GND - Ground Ground U9 GND - Ground Ground W9 GND - Ground Ground Y9 GND - Ground Ground T10 GND - Ground Ground V10 GND - Ground Ground X10 GND - Ground Ground AA10 GND - Ground Ground U11 GND - Ground Ground W11 GND - Ground Ground Y11 GND - Ground Ground T12 GND - Ground Ground V12 GND - Ground Ground X12 GND - Ground Ground AA12 GND - Ground Ground ZZ101 GND - Ground Ground B101 GND - Ground Ground
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 33 of 104 D101 GND - Ground Ground U101 GND - Ground Ground W101 GND - Ground Ground Y101 GND - Ground Ground AR101 GND - Ground Ground AT101 GND - Ground Ground AV101 GND - Ground Ground ZZ102 GND - Ground Ground B102 GND - Ground Ground D102 GND - Ground Ground U102 GND - Ground Ground W102 GND - Ground Ground Y102 GND - Ground Ground AR102 GND - Ground Ground AT102 GND - Ground Ground AV102 GND - Ground Ground Reserved B19 Reserved - Reserved C20 Reserved - Reserved E20 Reserved - Reserved G20 Reserved - Reserved J20 Reserved - Reserved AN14 Reserved - Reserved E8 Reserved - Reserved E2 Reserved - Reserved D1 Reserved - Reserved C2 Reserved - Reserved B1 Reserved - Reserved C12 Reserved - Reserved J4 Reserved - Reserved G4 Reserved - Reserved AE4 Reserved - Reserved AC4 Reserved - Reserved Y3 Reserved - Reserved AB3 Reserved - Reserved AD3 Reserved - Reserved AF3 Reserved - Reserved AH3 Reserved - Reserved AK3 Reserved - Reserved AM3 Reserved - Reserved
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 34 of 104 AG4 Reserved - Reserved AJ4 Reserved - Reserved AL4 Reserved - Reserved AM5 Reserved - Reserved X4 Reserved - Reserved AA4 Reserved - Reserved S17 Reserved - Reserved U17 Reserved - Reserved AH17 Reserved - Reserved Y17 Reserved - Reserved AF17 Reserved - Reserved AB17 Reserved - Reserved W17 Reserved - Reserved AD17 Reserved - Reserved R20 Reserved - Reserved T20 Reserved - Reserved V20 Reserved - Reserved X20 Reserved - Reserved AA20 Reserved - Reserved AC20 Reserved - Reserved AE20 Reserved - Reserved AG20 Reserved - Reserved AJ20 Reserved - Reserved AA16 Reserved - Reserved J16 Reserved - Reserved ZZ11 Reserved - Reserved ZZ13 Reserved - Reserved ZZ15 Reserved - Reserved ZZ17 Reserved - Reserved ZZ9 Reserved - Reserved ZZ7 Reserved - Reserved ZZ5 Reserved - Reserved ZZ3 Reserved - Reserved C0 Reserved - Reserved E0 Reserved - Reserved G0 Reserved - Reserved J0 Reserved - Reserved AM1 Reserved - Reserved AU13 Reserved - Reserved V2 Reserved - Reserved
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 35 of 104 W3 Reserved - Reserved A14 Reserved - Reserved A16 Reserved - Reserved F15 Reserved - Reserved AP1 Reserved - Reserved M17 Reserved - Reserved AN6 Reserved - Reserved AS3 Reserved - Reserved AT2 Reserved - Reserved S3 Reserved - Reserved U3 Reserved - Reserved L0 Reserved - Reserved AM7 Reserved - Reserved AL20 Reserved - Reserved AN20 Reserved - Reserved AT0 Reserved - Reserved AV6 Reserved - Reserved AV2 Reserved - Reserved AV4 Reserved - Reserved NOTE: When the UART signals are used as the communication port between the host and the modem: • The DTR pin must be connected to enter LE940B6 power saving mode. • The RI pin must be connected to wake up the host when a call is coming while the host is in Sleep mode. • The RTS must be connected to GND (on the module side) if flow control is not used. If the UART port is not used, all UART signals can be left disconnected. NOTE: Unless otherwise specified, RESERVED pins must be left unconnected (floating). The only exceptions are in the following Section: 3.2 LE940B6 Signals That Must Be Connected.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 36 of 104 3.2. LE940B6 Signals That Must Be Connected Table 7 lists the LE940B6 signals that must be connected even if not used by the end application: Table 7: Mandatory Signals PAD Signal Notes AP17, AP19, AR18, AR20, AS17, AS19, AT18, AU17, AU19, AT20 VBATT & VBATT_PA A6, A12, B13, B15, B17, C4, C6, D3, D7, E18, F1, G18, H19, M1, N2, P1, P3, R2, T2, T18, U1, V18, W1, X2, X18, Y1, Y19, AA2, AB1, AC2, AE2, AF1, AG2, AH1, AJ2, AK1, AK17, AL18, AM17, AM19, AN16, AN18, AP3, AP5, AP7, AP9, AP11, AP13, AP15, AR2, AR4, AR6, AR8, AR10, AR12, AR14, AR16, AS5, AS7, AS9, AS11, AS13, AS15, AT4, AT6, AT8, AT10, AT12, AT14, AT16, AU1, AU5, AU7, AU11, AU15, AL2, AN2, L20, N20, ZZ19, A20, AV20, ZZ1, A0, AV0, N0, R0, T0, V0, X0, AA0, AC0, AE0, AG0, AJ0, AL0, AN0, AR0, AV8, AV10, AV12, AV14, AV16, AV18, T8, V8, X8, AA8, U9, W9, Y9, T10 ,V10, X10, AA10, U11, W11, Y11, T12, V12, X12, AA12 GND AS1 ON/OFF* AN12 SHDN_N D19 USB_D+ If not used, connect to a test point or a USB connector F19 USB_D- If not used, connect to a test point or a USB connector A18 USB_VBUS If not used, connect to a test point or a USB connector C20 USB_SS_RX_P If not used, connect to a test point or a USB connector E20 USB_SS_RX_M If not used, connect to a test point or a USB connector G20 USB_SS_TX_P If not used, connect to a test point or a USB connector
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 37 of 104 J20 USB_SS_TX_M If not used, connect to a test point or a USB connector AH19 C103/TXD If not used, connect to a test point AF19 C104/RXD If not used, connect to a test point AA18 C105/RTS If flow control is not used, connect to GND AK19 C106/CTS If not used, connect to a test point AB19 TXD_AUX If not used, connect to a test point AD19 RXD_AUX If not used, connect to a test point AD1 ANT_1 If not used, connect to a 50 Ohm termination AU9 ANT_DIV_1 If not used, connect to a 50 Ohm termination S1 ANT_GPS If not used, connect to a 50 Ohm termination E4, F3, F5, G2, H3, J2, K3, L2, M3, L4, N4, R4, T4, V4 For Analysis Recommended to connect to test points for analysis
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 38 of 104 3.3. LGA Pads Layout Figure 2: LGA Pads Layout LE940B6 334 Pads Top View (*) MMC is not supported, and the pins assigned for it became Reserved NOTE: The pin defined as RFU must be considered RESERVED and not connected to any pin in the application. The related area on the application must be kept empty. ZZ A B C D E F G H J K L M N P R S T U V W X Y AA AB AC AD AE AF AG AH AJ AK AL AM AN AP AR AS AT AU AV101GND GND GN D GND GND GND GND GND GN D1010GND RFU RFU RFU RFU RFU GND GND GND GND GND GND GND GND GND GND GND GND GND RFU GND01GND RFU RFU GND GPIO_21GPIO_22GND GND ANT_GPSGND GND GND GND ANT_1 GND GND GND RFU RFU ON_OFF_N GND12MIC1_MT- RFU RFU JTAG_RTCKJTAG_TRST_NJTAG_TMS GND GND GND RFU GND GND GND GND GND GND GND GND GND RFU RFU23RFU MIC1_MT+ GNDJTAG_RESOUT_NJTAG_TCKJTAG_TDOJTAG_TRIGIN GND RFU RFU RFU RFU RFU RFU RFU RFU RFU RFU GND RFU ST AT_LED34EAR1_MT- GND JTAG_TDI RFU RFU JTAG_PTI_CLKJTAG_PTI_DATA0JTAG_PTI_DATA1JTAG_PTI_DATA2JTAG_PTI_DATA3RFU RFU RFU RFU RFU RFU RFU GPIO_20GND GND RFU45RFU EAR1_MT+ADC_IN1JTAG_TRIGOUT RFU GND GND GND56GND GND ADC_IN2MIC_BIASRFU GND GND RFU67RFU SIMIN1 GND ADC_IN3RFU GND GND GND78SIMVCC1DVI_RX RFU ETH_RST_N GND GND GND GND RESET_NGND GND GND89RFU SIMIO1 DVI_TX GPIO_01GND GND GND UART3_TXD GND GND ANT_DIV_1910SIMCLK1DVI_CLKGPIO_02ETH_INT_N GND GND GND GND SW_RDY GND GND GND1011RFU SIMRST1DVI_WA0GPIO_03GND GND GND UART3_RXD GND GND GND1112GND RFU GPIO_04MAC_MDIO GND GND GND GND SHDN_N GND GND GND1213RFU GND I2C_SDA GPIO_05UART3_RTS GND GND RFU1314RFU I2C_SCL GPIO_06MAC_MDCRFU GND GND GND1415RFU GND SIMVCC2RFU UART3_CTS GND GND GND1516RFU SIMCLK2SIMIO2 MAC_TXEN_ER RFU MAC_GTX_CLKMAC_TXD[3]MAC_TXD[2]MAC_TXD[1]MAC_TXD[0]MAC_RXDV_ER RFU MAC_RX_CLKMAC_RXD[3]MAC_RXD[2]MAC_RXD[1]MAC_RXD[0] GND GND GND GND1617RFU GND SIMRST2VRTC VPP VIO _1.8VRFU VAUX/PWRMON RFU RFU RFU RFU RFU RFU RFU RFU GND GND VBATT VBATT_PAVBATT_PA1718USB_VBUS SIMIN2 GND GND GPIO_12GPIO_11SPI_CS GP IO_07GND GND GND C105/RTSC108/DTRC109/DCDC107/DSRC125/RING GND GND VBATT VBATT_PA GND1819GND RFU USB_D+ USB_D- GND SPI _MOSISPI_ MISOSPI_CLKGPIO_08GPIO_09GPIO_10GND TXD_AUXRXD_AUXC104/RXDC103/TXDC106/CTSGND VBATT VBATT_PAVBATT_PA1920GND RFU RFU RFU RFU GND GND RFU RFU RFU RFU RFU RFU RFU RFU RFU RFU RFU VBATT VBATT_PA GND20102GND GND GN D GND GND GND GND GND GN D102ZZ A B C D E F G H J K L M N P R S T U V W X Y AA AB AC AD AE AF AG AH AJ AK AL AM AN AP AR AS AT AU AVLE940B6 (40 mm X 40 mm) Form Factor Pin MAPTOP VIEW
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 39 of 104 4. Electrical Specifications 4.1. Absolute Maximum Ratings – Not Operational Caution: A deviation from the value ranges listed below may harm the LE940B6 module. Table 8: Absolute Maximum Ratings – Not Operational Symbol Parameter Min Max Unit VBATT Battery supply voltage on pin VBATT -0.3 +6.0 [V] VBATT_PA Battery supply voltage on pin VBATT_PA -0.3 +6.0 [V] 4.2. Recommended Operating Conditions Table 9: Recommended Operating Conditions Symbol Parameter Min Typ Max Unit Tamb Ambient temperature -40 +25 +85 [°C] VBATT Battery supply voltage on pin VBATT 3.4 3.8 4.2 [V] VBATT_PA Battery supply voltage on pin VBATT_PA 3.4 3.8 4.2 [V] IBATT_PA + IBATT Peak current to be used to dimension decoupling capacitors on pin VBATT_PA - 80 2000 [mA]
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 40 of 104 4.3. Logic Level Specifications Unless otherwise specified, all the interface circuits of the LE940B6 are 1.8V CMOS logic. Only few specific interfaces (such as MAC, USIM and SD Card) are capable of dual voltage I/O. The following tables show the logic level specifications used in the LE940B6 interface circuits. The data specified in the tables below is valid throughout all drive strengths and the entire temperature ranges. NOTE: Do not connect LE940B6 digital logic signals directly to OEM digital logic signals with a level higher than 2.7V for 1.8V CMOS signals. 4.3.1. 1.8V Standard GPIOs Table 10: Absolute Maximum Ratings – Not Functional Parameter Min Max Input level on standard GPIOs when on -0.3V +2.3V Table 11: Operating Range – Interface Levels (1.8V CMOS) Parameter Min Max Input high level 1.26V 2.0V Input low level -0.2V 0.36V Output high level 1.6V --- Output low level --- 0.2V
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 41 of 104 4.3.2. 1.8V I2C Pads Table 12: Operating Range – 1.8V I2C Pads Parameter Min Max Input high level 1.26V 2.3V Input low level -0.3V 0.54V Output high level --- --- Output low level --- 0.36V 4.3.3. 1.2V EMIC Pads Table 13: Operating Range – 1.2V EMIC Pads Parameter Min Max Input high level 0.84V 1.4V Input low level -0.2V 0.24V Output high level 1.0V --- Output low level --- 0.2V
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 42 of 104 4.3.4. 1.8V/2.9V SIM Pads Table 14: Operating Range – 1.8V SIM Pads Parameter Min Max Input high level 1.26V 2.1V Input low level -0.3V 0.36V Output high level 1.26V 2.1V Output low level -0.3V 0.36V Table 15: Operating Range – 2.9V SIM Pads Parameter Min Max Input high level 2.03V 3.1V Input low level -0.3V 0.58V Output high level 2.03V 3.1V Output low level -0.3V 0.58V 4.3.5. USB Table 16: Operating Range – USB_D+, USB_D- Pads Parameter Min Max Input high level 2.0V --- Input low level --- 0.8V Output high level 2.8V --- Output low level --- 0.3V
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 43 of 104 4.3.6. 2.5V/3.3V EMAC Interface for RMII and RGMII Table 17: Absolute Maximum Ratings – 3.3V EMAC Interface Parameter Min Max Input level on 3.3V EMAC when on -0.3V 3.6V Table 18: Operating Range – 2.5V EMAC Interface Parameter Min Max Input high level 1.7V 2.5V Input low level -0.3V 0.7V Output high level 2V --- Output low level --- 0.4V Table 19: Operating Range – 3.3V EMAC Interface Parameter Min Max Input high level 2V 3.3V Input low level -0.3V 0.8V Output high level 2.6V --- Output low level --- 0.5V
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 44 of 104 5. Hardware Commands 5.1. Turning on the LE940B6 Module To turn on the LE940B6 module, the ON_OFF_N pad must be asserted low in the range of 80 - 120 milliseconds and then released. Figure 3 illustrates a simple circuit to power on the module using an inverted buffer output. Figure 3: Power-on Circuit GNDR1R2Q1Power ON Impulse80ms < Hold Time < 120msON_OFF_N NOTE: In case VBATT need to be removed and applied again. The application must take into account the decay time of the power supply after removal of VBATT. VBATT input must be at zero volt prior to the reapplication of VBATT." 5.2. Initialization and Activation State After turning on the LE940B6 module, a predefined internal boot sequence performs the HW and SW initialization of the module, which takes some time to fully complete. During this process, the LE940B6 is not accessible. As shown in Figure 4, the LE940B6 becomes operational at least 25 seconds after PWRMON goes HIGH. NOTE: During the Initialization state, AT commands are not available. The DTE host must wait for the Activation state prior to communicating with the LE940B6.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 45 of 104 Figure 4: LE940B6 Initialization and Activation NOTE: To check whether the LE940B6 has completely powered on, monitor the SW_RDY hardware line. When SW_RDY goes high, the module has completely powered on and is ready to accept AT commands. NOTE: Do not use any pull-up resistor on the ON_OFF_N line as it is internally pulled up. Using a pull-up resistor may cause latch-up problems on the LE940B6 power regulator and improper powering on/off of the module. The ON_OFF_N line must be connected only in an open-collector configuration. NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 46 of 104 Figure 5 shows a flow chart for the proper power-up procedure: Figure 5: Power-up Flow Chart Modem ON ProcedureSTARTVBATT > 3.4V ?VAUX/PWRMON = ON?ON_OFF_N = LOW80 ms < Hold Time < 120 msON_OFF_N = HIGHVAUX/PWRMON = ON?Delay = 25 secGo toStart AT CMDModem ON ProcedureENDNYYNGo toHW SHUTDOWNUnconditionalNY
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 47 of 104 Figure 6 shows a flow chart illustrating the AT commands managing procedure. Figure 6: AT Command Managing Flow Chart Start AT CMDSTARTDelay 300 msEnter AT <CR>AT Answer in1 sec ?Start AT CMDENDYGo toModem ON ProcedureGo toHW SHUTDOWNUndonditionalN
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 48 of 104 5.3. Turning off the LE940B6 Module Turning off the device can be done in four different ways: • Shutdown by software command using AT#SHDN command • Hardware shutdown using ON_OFF_N pad • Hardware Unconditional Reset using the RESET_N pad • Hardware Unconditional Shutdown using the SHDN_N pad When the device is shut down by a software command or a hardware shutdown, it issues a detach request to the network, informing the network that the device will not be reachable any more. NOTE: To check if the device has powered off, monitor the VAUX/PWRMON hardware line. When VAUX/PWRMON goes low, this indicates that the device has powered off. NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. NOTE: VBATT must be never removed before the proper OFF procedure is performed. NOTE: In case VBATT need to be removed and applied again. The application must take into account the decay time of the power supply after removal of VBATT. VBATT input must be at zero volt prior to the reapplication of VBATT.” 5.3.1. Shutdown by Software Command The LE940B6 module can be shut down by a software command. When a shutdown command is sent, LE940B6 goes into the Finalization state and at the end of the finalization process shuts down VAUX/PWRMON. The duration of the Finalization state can differ according to the current situation of the module, so a value cannot be defined. Usually, it will take more than 6 seconds from sending a shutdown command until reaching a complete shutdown. The DTE host should monitor the status of VAUX/PWRMON to observe the actual power-off.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 49 of 104 Figure 7: Shutdown by Software Command Finalization State OFF StateInternal StateVAUX/PWRMONVBATTActivation StateAT#SHDNVariable Above6 secMonitoring Status NOTE: To check whether the device has powered off, monitor the VAUX/PWRMON hardware line. When VAUX/PWRMON goes low, the device has powered off.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 50 of 104 5.3.2. Hardware Shutdown To turn off the LE940B6 module, the ON_OFF_N pad must be asserted low in the range of 1150 - 1250 milliseconds and then released. Use the same circuitry and timing for power-on. When the ON_OFF_N is asserted low for a period in the range 1150 - 1250 milliseconds and then released, LE940B6 goes into the Finalization state and in the end shuts down VAUX/PWRMON. The duration of the Finalization state can differ according to the current situation of the module, so a value cannot be defined. Usually, it will take more than 6 seconds from sending a shutdown command until reaching a complete shutdown. The DTE host should monitor the status of VAUX/PWRMON to observe the actual power-off. Figure 8: Hardware Shutdown OFF StateInternal StateVAUX/PWRMONVBATTActivation StateVariable Above6 secMonitoring StatusON_OFF_N1150ms < Hold Time < 1250msFinalization State NOTE: To check whether the device has powered off, monitor the VAUX/PWRMON hardware line. When VAUX/PWRMON goes low, the device has powered off.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 51 of 104 5.3.3. Unconditional Hardware Reset (RESET_N) To unconditionally restart the LE940B6 module, the RESET_N pad must be tied low in the range 1300 - 1800 milliseconds and then released. Figure 9 shows a simple circuit for this action. Figure 9: Circuit for Unconditional Hardware Reset GNDR1R2Q1UnconditionalReset Impulse1300ms < Hold Time < 1800msRESET_N NOTE: The Unconditional Hardware Reset must always be implemented on the boards, but the software must use it only as an emergency exit procedure, and not as a normal power-off operation. NOTE: Do not use any pull-up resistor on the RESET_N line or any totem pole digital output. Using a pull-up resistor may cause latch-up problems on the LE940B6 power regulator and improper functioning of the module. The RESET_N line must be connected only in an open-collector configuration.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 52 of 104 5.3.4. Unconditional Hardware Shutdown To unconditionally shut down the LE940B6 module, the SHDN_N pad must be tied low for at least 200 milliseconds and then released. Figure 10 shows a simple circuit for applying an unconditional shutdown. Figure 10: Circuit for Unconditional Hardware Shutdown GNDR1R2Q1UnconditionalShutdown ImpulseAt least 200msSHDN_N To check whether the device has powered off, monitor the VAUX/PWRMON hardware line. When VAUX/PWRMON goes low, the device has powered off. NOTE: Do not use any pull-up resistor on the SHDN_N line or any totem pole digital output. Using a pull-up resistor may cause latch-up problems on the LE940B6 power regulator and improper functioning of the module. The SHDN_N line must be connected only in an open-collector configuration. NOTE: The Unconditional Hardware Shutdown (SHDN_N) must always be implemented on the boards, but the software must use it only as an emergency exit procedure, and not as a normal power-off operation.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 53 of 104 Figure 11 shows a flow chart of the proper turn off procedure. Figure 11: Turn Off Procedure Modem OFF ProcedureSTARTVAUX/PWRMON = ON?OFF ModeON_OFF_N = LOWDelay = 200 msON_OFF_N = HIGHAT#SHDNVAUX/PWRMON = ON?Looping for more6 secModem OFF ProcedureENDGo toStart AT CMDYHW SHUTDOWNSW SHUTDOWNYYNNN
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 54 of 104 6. Power Supply The power supply circuitry and board layout are very important parts of the full product design, with critical impact on the overall product performance. Read the following requirements and guidelines carefully to ensure a good and proper design. 6.1. Power Supply Requirements The LE940B6 power requirements are as follows: Table 20: Power Supply Requirements Nominal supply voltage 3.8V Supply voltage range 3.4V – 4.2V Max ripple on module input supply 30 mV Table 21 provides typical current consumption values of LE940B6 for the various available modes. Table 21: LE940B6 Current Consumption Mode Average (Typ.) Mode Description Switched Off Switched off 0.1 mA Module supplied but switched Off Idle Mode (Standby Mode; No Call in Progress) AT+CFUN=4 2.5 mA Tx and Rx disabled ; module is not registered on the network (Flight mode) DRx GSM 4.7 mA DRx5 WCDMA 4.7 mA DRx6 3.6 mA DRx7 3.1 mA DRx8 2.8 mA DRx9 LTE 7.7 mA Paging cycle #32 frames (0.32 sec DRx cycle) 5.1 mA Paging cycle #64 frames (0.64 sec DRx cycle)
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 55 of 104 Mode Average (Typ.) Mode Description 3.8 mA Paging cycle #128 frames (1.28 sec DRx cycle) 3.2 mA Paging cycle #256 frames (2.56 sec DRx cycle) Operative Mode (LTE) LTE (0dBm) 300 mA LTE data call (Non-CA BW 5 MHz, RB=1) 500 mA LTE data call (CA BW 20 + 20MHz, Full RB, B4+B4 Intra CA, FDD 300 Mbps DL / 50 Mbps UL) without Ethernet 750 mA LTE data call (CA BW 20 + 20MHz, Full RB, B4+B4 Intra CA, FDD 300 Mbps DL / 50 Mbps UL) with Ethernet LTE (23dBm) 760 mA LTE data call (Non-CA BW 5MHz, RB=1) 1000 mA LTE data call (CA BW 20 + 20MHz, Full RB, B4+B4 Intra CA, FDD 300 Mbps DL / 50 Mbps UL) without Ethernet 1250 mA LTE data call (CA BW 20 + 20MHz, Full RB, B4+B4 Intra CA, FDD 300 Mbps DL / 50 Mbps UL) with Ethernet Operative Mode (WCDMA) WCDMA Voice 690 mA WCDMA voice call (Tx = 23 dBm) WCDMA HSDPA (0 dBm) 300 mA WCDMA data call (DC-HSDPA up to 42 Mbps, Max Throughput) without Ethernet 550 mA WCDMA data call (DC-HSDPA up to 42 Mbps, Max Throughput) with Ethernet WCDMA HSDPA (23 dBm) 700 mA WCDMA data call (DC-HSDPA up to 42 Mbps, Max Throughput) without Ethernet 950 mA WCDMA data call (DC-HSDPA up to 42 Mbps, Max Throughput) with Ethernet Operative Mode (GSM) GSM Tx and Rx mode GSM 850/900 PL5 360 mA GSM voice call
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 56 of 104 Mode Average (Typ.) Mode Description GSM 1800/1900 PL0 300 mA GPRS 4 Tx + 1 Rx GSM 850/900 PL5 750 mA GPRS Sending Data mode (CS-4) DCS 1800/1900 PL0 550 mA EGPRS 4 Tx + 1 Rx GSM 850/900 PL8 550 mA GPRS Sending Data mode (MCS-5) DCS 1800/1900 PL2 500 mA * Worst/best case current values depend on network configuration, not under module control. ** Applied MPR –2dB 16-QAM full RB *** 3.8V voltage/room temperature NOTE: Differences in measurement technique, equipment, or temperature can cause variations in current consumption measurements. NOTE: The electrical design for the power supply must ensure a peak current output of at least 2.0A. NOTE: In GSM/GPRS mode, RF transmission is not continuous, but is packed into bursts at a base frequency of about 216 Hz with relative current peaks as high as about 2.0A. Therefore, the power supply must be designed to withstand these current peaks without big voltage drops. This means that both the electrical design and the board layout must be designed for this current flow. If the layout of the PCB is not well designed, a strong noise floor is generated on the ground. This will reflect on all the audio paths producing an audible annoying noise at 216 Hz. If the voltage drops during the peaks, current absorption is too high. The device may even shut down as a consequence of the supply voltage drop.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 57 of 104 6.2. General Design Rules The principal guidelines for the Power Supply Design embrace three different design steps: • Electrical design • Thermal design • PCB layout 6.2.1. Electrical Design Guidelines The electrical design of the power supply depends strongly on the power source where this power is drained. Power sources can be distinguished by three categories: • +5V input (typically PC internal regulator output) • +12V input (typically automotive) • Battery 6.2.1.1. + 5V Input Source Power Supply – Design Guidelines • The desired output for the power supply is 3.8V. So, the difference between the input source and the desired output is not big, and therefore a linear regulator can be used. A switching power supply is preferred to reduce power consumption. • When using a linear regulator, a proper heat sink must be provided to dissipate the power generated. • A bypass low ESR capacitor of adequate capacity must be provided to cut the current absorption peaks close to the LE940B6 module. A 100 μF tantalum capacitor is usually suitable on both VBATT and VBATT_PA power lines. • Make sure that the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V. • A protection diode must be inserted close to the power input to protect the LE940B6 module from power polarity inversion. Figure 12 shows an example of linear regulator with 5V input.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 58 of 104 Figure 12: Example of Linear Regulator with 5V Input 6.2.1.2. + 12V Input Source Power Supply – Design Guidelines • The desired output for the power supply is 3.8V. Due to the big difference between the input source and the desired output, a linear regulator is unsuitable and must not be used. A switching power supply is preferable because of its better efficiency, especially with the 2A peak current load expected when working with the LE940B6. • When using a switching regulator, a 500-kHz or higher switching frequency regulator is preferable because of its smaller inductor size and its faster transient response. This allows the regulator to respond quickly to the current peaks absorption. • In any case, the selection of the frequency and switching design is related to the application to be developed due to the fact that the switching frequency can also generate EMC interference. • For car batteries (lead-acid accumulators) the input voltage can rise up to 15.8V. This must be kept in mind when choosing components: all components in the power supply must withstand this voltage. • A bypass low ESR capacitor of adequate capacity must be provided to cut the current absorption peaks. A 100μF tantalum capacitor is usually suitable on VBATT & VBATT_PA power lines. • Make sure that the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V. • For automotive applications, a spike protection diode must be inserted close to the power input to clean the supply of spikes. • A protection diode must be inserted close to the power input to protect the LE940B6 module from power polarity inversion. This can be the same diode as for spike protection.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 59 of 104 Figure 13 and Figure 14 show an example of switching regulator with 12V input. Figure 13: Example of Switching Regulator with 12V Input – Part 1 Figure 14: Example of Switching Regulator with 12V Input – Part 2
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 60 of 104 6.2.1.3. Battery Source Power Supply – Design Guidelines • The desired nominal output for the power supply is 3.8V, and the maximum allowed voltage is 4.2V. Hence, a single 3.7V Li-Ion cell battery type is suitable for supplying the power to the LE940B6 module. NOTE: Do not use any Ni-Cd, Ni-MH, and Pb battery types directly connected to the LE940B6 module. Their use can lead to overvoltage on the LE940B6 and damage it. Use only Li-Ion battery types. • A bypass low ESR capacitor of adequate capacity must be provided to cut the current absorption peaks; a 100μF tantalum capacitor is usually suitable. • Make sure that the low ESR capacitor (usually a tantalum one) is rated at least 10V. • A protection diode must be inserted close to the power input to protect the LE940B6 module from power polarity inversion. Otherwise, the battery connector must be done in a way to avoid polarity inversions when connecting the battery. • The battery capacity must be at least 500 mAh to withstand the current peaks of 2A. The suggested capacity is from 500 mAh to 1000 mAh.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 61 of 104 6.2.2. Thermal Design Guidelines The thermal design for the power supply heat sink must be done with the following specifications: • Average current consumption during LTE 2xCA DL Max throughput @PWR level max in LE940B6: 1250 mA NOTE: The average consumption during transmission depends on the power level at which the device is requested to transmit via the network. Therefore, the average current consumption varies significantly. In LTE mode, the LE940B6 emits RF signals continuously during transmission. Therefore, pay special attention to how the generated heat is dissipated. The current consumption is up to about 1250 mA in 2xCA Max throughput, and 1250 mA in LTE continuously at the maximum Tx output power 23.0 dBm. The current consumption is up to about 1250 mA continuously at the maximum Tx output power (23 dBm). Therefore, make sure on the PCB used to mount LE940B6, that the area under the LE940B6 module is as large as possible. Make sure that the LE940B6 is mounted on the large ground area of application board and provide many ground vias to dissipate the heat. 6.2.3. Power Supply PCB Layout Guidelines As seen in the electrical design guidelines, the power supply must have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct operation of the circuitry. A misplaced component can be useless or can even decrease the power supply performances. • The bypass low ESR capacitor must be placed close to the LE940B6 power input pads, or if the power supply is of a switching type, it can be placed close to the inductor to cut the ripple, as long as the PCB trace from the capacitor to LE940B6 is wide enough to ensure a drop-less connection even during the 2A current peaks. • The protection diode must be placed close to the input connector where the power source is drained. • The PCB traces from the input connector to the power regulator IC must be wide enough to ensure that no voltage drops occur during the 2A current peaks. Note that this is not done to save power loss but especially to avoid the voltage drops on the power line at the current peaks frequency of 216 Hz that will reflect on all the components connected to that supply (also introducing the noise floor at the burst base frequency.) For this reason while a voltage drop of 300-400 mV may be acceptable from the power loss point of view, the same voltage drop may not be acceptable from the noise point of view. If your application does not have an audio interface but only uses the data feature of the LE940B6, this noise is not so disturbing, and the power supply layout design can be more forgiving.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 62 of 104 • The PCB traces to LE940B6 and the bypass capacitor must be wide enough to ensure that no significant voltage drops occur when the 2A current peaks are absorbed. This is needed for the same above-mentioned reasons. Try to keep these traces as short as possible. • The PCB traces connecting the switching output to the inductor and the switching diode must be kept as short as possible by placing the inductor and the diode very close to the power switching IC (only for the switching power supply). This is done to reduce the radiated field (noise) at the switching frequency (usually 100-500 kHz). • Use a good common ground plane. • Place the power supply on the board in a way to guarantee that the high current return paths in the ground plane do not overlap any noise sensitive circuitry, such as the microphone amplifier/buffer or earphone amplifier. • The power supply input cables must be kept separate from noise sensitive lines, such as microphone/earphone cables.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 63 of 104 7. Antenna(s) Antenna connection and board layout design are the most important parts in the full product design, and they have a strong influence on the product’s overall performance. Read carefully and follow the requirements and guidelines for a good and proper design. 7.1. GSM/WCDMA/TD-SCDMA/LTE Antenna Requirements The antenna for the LE940B6 device must meet the following requirements: Table 22: Primary Antenna Requirements Gain Gain < 3 dBi Impedance 50 Ohm Input power > 33 dBm(2 W) peak power in GSM > 24 dBm average power in WCDMA & LTE VSWR absolute max <= 10:1 VSWR recommended <= 2:1 The antenna for a specific car model must support a given set of RF bands. This set is determined by the region variant and the specific set of bands within (either the full band set offered by Telit or a subset per the customer choice). The antenna must have the proper bandwidth to support the required set of bands and meet the other performance figures according to the Table 22, along the full bandwidth. The RF bands supported in each region variant are detailed in Section 2.5.1, RF Bands per Regional Variant. Since there is no antenna connector on the LE940B6 module, the antenna must be connected to the LE940B6 antenna pad (AD1) by a transmission line implemented on the PCB. If the antenna is not directly connected to the antenna pad of the LE940B6, a PCB line is required to connect to it or to its connector. 7.2. GSM/WCDMA/TD-SCDMA/LTE Antenna – PCB Line Guidelines • Make sure that the transmission line’s characteristic impedance is 50 Ohm. • Keep the line on the PCB as short as possible since the antenna line loss should be less than around 0.3 dB. • Line geometry should have uniform characteristics, constant cross sections, and avoid meanders and abrupt curves. • Any suitable geometry/structure can be used for implementing the printed transmission line affecting the antenna.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 64 of 104 • If a ground plane is required in the line geometry, this plane must be continuous and sufficiently extended so the geometry can be as similar as possible to the related canonical model. • Keep, if possible, at least one layer of the PCB used only for the ground plane. If possible, use this layer as reference ground plane for the transmission line. • Surround the PCB transmission line with ground (on both sides). Avoid having other signal tracks facing the antenna line track directly. • Avoid crossing any un-shielded transmission line footprint with other tracks on different layers. • The ground surrounding the antenna line on the PCB must be strictly connected to the main Ground plane by means of via-holes (once per 2 mm at least) placed close to the ground edges facing the line track. • Place EM-noisy devices as far as possible from LE940B6 antenna line. • Keep the antenna line far away from the LE940B6 power supply lines. • If EM-noisy devices are present on the PCB hosting the LE940B6, such as fast switching ICs, take care to shield them with a metal frame cover. • If EM-noisy devices are not present around the line, geometries like Micro strip or Grounded Coplanar Waveguide are preferred because they typically ensure less attenuation compared to a Strip line having the same length. This transmission line must meet the following requirements: Table 23: Antenna Line on PCB Requirements Characteristic impedance 50 Ohm Max attenuation 0.3 dB Avoid coupling with other signals. Cold End (Ground Plane) of the antenna must be equipotential to the LE940B6 ground pads. Furthermore if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC approval requirements: This device is to be used only for mobile and fixed application. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-Users must be provided with transmitter operation conditions for satisfying RF exposure compliance. OEM integrators must ensure that the end user has no manual instructions to remove or install the LE940B6 module. Antennas used for this OEM module must not exceed 3dBi gain for mobile and fixed operating configurations.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 65 of 104 7.3. GSM/WCDMA/TD-SCDMA/LTE Antenna – Installation Guidelines • Install the antenna in a location with access to the network radio signal. • The antenna must be installed such that it provides a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. • The antenna must not be installed inside metal cases. • The antenna must be installed according to the antenna manufacturer’s instructions. 7.4. Secondary Antenna Requirements This product includes an input for a second Rx antenna to improve radio sensitivity. The function is called Antenna Diversity. Since there is no antenna connector on the LE940B6 module, the antenna must be connected to the LE940B6 antenna pad by means of a transmission line implemented on the PCB. If the antenna is not directly connected at the antenna pad of the LE940B6 (AU9), a PCB line is required to connect to it or to its connector. The second Rx antenna must not be located in close vicinity of the main antenna. To improve diversity gain and isolation and to reduce mutual interaction, the two antennas should be located at the maximum reciprocal distance possible, taking into consideration the available space within the application. NOTE: If Rx Diversity is not used/connected, disable the Diversity functionality using the AT+XRXDIV command (refer to Ref 1: LE940B6 AT Command Reference Guide) and connect the Diversity pad AU9 to a 50 Ohm termination. 7.5. PCB Guidelines in case of FCC certification In the case FCC certification is required for an application using LE940B6-NA, according to FCC KDB 996369 for modular approval requirements, the transmission line has to be similar to that implemented on module’s interface board and described in the following chapter. 7.5.1. Transmission line design During the design of the interface board, the placement of components has been chosen properly, in order to keep the line length as short as possible, thus leading to lowest power losses possible. A Grounded Coplanar Waveguide (G-CPW) line has been chosen, since this kind of transmission line ensures good impedance control and can be implemented in an outer PCB layer as needed in this case. A SMA female connector has been used to feed the line.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 66 of 104 The interface board is realized on a FR4, 4-layers PCB. Substrate material is characterized by relative permittivity εr = 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @ 1 GHz. A characteristic impedance of nearly 50 Ω is achieved using trace width = 1.1 mm, clearance from coplanar ground plane = 0.3 mm each side. The line uses reference ground plane on layer 3, while copper is removed from layer 2 underneath the line. Height of trace above ground plane is 1.335 mm. Calculated characteristic impedance is 51.6 Ω, estimated line loss is less than 0.1 dB. The line geometry is shown below: 7.5.2. Transmission line measurements E5071C NA (Full-4-port calibration) has been used in this measurement session. A calibrated coaxial cable has been soldered at the pad corresponding to RF output; a SMA connector has been soldered to the board in order to characterize the losses of the transmission line including the connector itself. During Return Loss / impedance measurements, the transmission line has been terminated to 50 Ω load. Return Loss plot of line under test is shown below:
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 67 of 104 Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load) is shown in the following figure:
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 68 of 104 Insertion Loss of G-CPW line plus SMA connector is shown below:
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 69 of 104 8. Hardware Interfaces Table 24 summarizes all the hardware interfaces of the LE940B6 module. Table 24: LE940B6 Hardware Interfaces LE940B6 (XMM7272 CAT6) Ethernet RMII/RGMII USB USB2.0 SPI Master only, up to 26 MHz (104 MHz @ Kernel CLK/4) I2C For sensors, audio control UART x1 UART for AT (up to 4.8 Mbps) x1 UART for diagnosis (up to 4.8 Mbps) x1 UART for GNSS or external controller (up to 4.8 Mbps) Audio I/F I2S/PCM, Analog audio GPIO 15 dedicated GPIO USIM X2, dual voltage each (1.8/2.9V); SIM chip integration not possible ADC Up to x3 Antenna ports 2 for Cellular, 1 for GNSS
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 70 of 104 8.1. USB Port The LE940B6 module includes a Universal Serial Bus (USB) transceiver, which operates at USB high-speed (480Mbits/sec). It can also operate with USB full-speed hosts (12Mbits/sec). It is compliant with the USB 2.0 specification and can be used for control and data transfers as well as for diagnostic monitoring and firmware update. NOTE: With the LE940B6 module, firmware updates by the host are only possible via USB and not possible via UART. The reason is that Telit considers it impractical to transfer firmware binaries exceeding 100Mb via UART. The USB port is typically the main interface between the LE940B6 module and OEM hardware. NOTE: The USB_D+ and USB_D- signals have a clock rate of 480 MHz. The signal traces must be routed carefully. Minimize trace lengths, number of vias, and capacitive loading. The impedance value should be as close as possible to 90 Ohms differential. The pull-up, pull-down and series resistors on pins USB_D+ and USB_D- as required by the USB 2.0 specification are included inside the module. Table 25 lists the USB interface signals. Table 25: USB Interface Signals Signal Pad No. Usage USB_VBUS A18 Power and cable detection for the internal USB transceiver. Acceptable input voltage range 2.5V – 5.5V @ max 5 mA consumption USB_D- F19 Minus (-) line of the differential, bi-directional USB signal to/from the peripheral device USB_D+ D19 Plus (+) line of the differential, bi-directional USB signal to/from the peripheral device NOTE: USB_VBUS input power is internally used to detect the USB port and start the enumeration process. It is not used for supplying power to the internal LE940B6 USB HW block.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 71 of 104 NOTE: Even if USB communication is not used, it is still highly recommended to place an optional USB connector on the application board. At least test points of the USB signals are required since the USB physical communication is needed in the case of SW update. Warning: Consider placing low-capacitance ESD protection device to protect LE940B6 against ESD strikes. If an ESD protection should be added, the suggested connectivity is as follows: Figure 15: ESD Protection for USB2.0 8.2. Serial Ports The serial port is typically a secondary interface between the LE940B6 module and OEM hardware. The following serial ports are available on the module: • Modem Serial Port 1 (Main) • Modem Serial Port 2 (Auxiliary) • Modem Serial Port 3 (GNSS) Several serial port configurations can be designed for the OEM hardware. The most common are: • RS232 PC com port • Microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit) • Microcontroller UART @ 3.3V/5V or other voltages different from 1.8V Depending on the type of serial port on OEM hardware, level translator circuits may be needed to make the system operate. The only configuration that does not need level translation is the 1.8V UART. The LE940B6 UART has CMOS levels as described in Section 4.3.1, 1.8V Standard GPIOs.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 72 of 104 8.2.1. Modem Serial Port 1 Serial Port 1 is a +1.8V UART, having all the 8 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels. Table 26 lists the signals of LE940B6 Serial Port 1. Table 26: Modem Serial Port 1 Signals RS232 Pin # Signal Pad No. Name Usage 1 DCD - DCD_UART AE18 Data Carrier Detect Output from LE940B6 that indicates carrier presence 2 RXD - TX_UART AF19 Transmit line *see Note Output transmit line of LE940B6 UART 3 TXD -RX_UART AH19 Receive line *see Note Input receive line of LE940B6 UART 4 DTR - DTR_UART AC18 Data Terminal Ready Input to LE940B6 that controls the DTE READY condition 5 DSR - DSR_UART AG18 Data Set Ready Output from LE940B6 that indicates that the module is ready 6 RTS - RTS_UART AA18 Request to Send Input to LE940B6 controlling the Hardware flow control 7 CTS - CTS_UART AK19 Clear to Send Output from LE940B6 controlling the Hardware flow control 8 RI - RI_UART AJ18 Ring Indicator Output from LE940B6 indicating the Incoming call condition NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. NOTE: For minimum implementations, only the TXD and RXD lines need be connected. The other lines can be left open provided a software flow control is implemented. NOTE: According to V.24, Rx/Tx signal names refer to the application side; therefore, on the LE940B6 side, these signal are in the opposite direction: TXD on the application side will be connected to the receive line (here named TXD/ RX_UART) of the LE940B6 serial port and vice versa for Rx.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 73 of 104 8.2.2. Modem Serial Port 2 On the LE940B6, Serial Port 2 is a +1.8V UART with Rx and Tx signals only. Table 27 lists the signals of the LE940B6 Serial Port 2. Table 27: Modem Serial Port 2 Signals PAD Signal I/O Function Type COMMENT AB19 TXD_AUX O Auxiliary UART (Tx Data to DTE) 1.8V AD19 RXD_AUX I Auxiliary UART (Rx Data to DTE) 1.8V NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. NOTE: The Auxiliary UART is used as the SW main debug console. It is required to place test points on this interface even if not used. 8.2.3. Modem Serial Port 3 Serial port 3 is a +1.8V UART with all 4 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels. Table 28 lists the signals of the LE940B6 Serial Port 3. Table 28: Modem Serial Port 3 Signals PAD Signal I/O Function Type Comment AM9 UART3_TXD I Serial data input (TXD) from DTE 1.8V AM11 UART3_RXD O Serial data output (RXD) to DTE 1.8V AM13 UART3_RTS I Input for Request to Send (RTS) from DTE 1.8V AM15 UART3_CTS O Output for Clear to Send (CTS) to DTE 1.8V NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 74 of 104 8.2.4. RS232 Level Translation To interface the LE940B6 with a PC COM port or an RS232 (EIA/TIA-232) application, a level translator is required. This level translator must perform the following actions: • Invert the electrical signal in both directions • Change the level from 0/1.8V to +15/-15V The RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level translator. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required. The simplest way to translate the levels and invert the signal is by using a single chip-level translator. There are a multitude of them, differing in the number of drivers and receivers and in the levels (be sure to get a true RS232 level translator, not a RS485 or other standards). By convention, the driver is the level translator from the 0-1.8V UART to the RS232 level. The receiver is the translator from the RS232 level to 0-1.8V UART. To translate the whole set of control lines of the UART, the following is required: • 2 drivers • 2 receivers Warning: The digital input lines, operating at 1.8V CMOS levels, have absolute maximum input voltage of 2.0V. The level translator IC outputs on the module side (i.e. LE940B6 inputs) will cause damage to the module inputs if the level translator is powered with +3.8V power. So the level translator IC must be powered from a dedicated +1.8V power supply.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 75 of 104 As an example of RS232 level adaption circuitry could use a MAXIM transceiver (MAX218). In this case, the chipset is capable of translating directly from 1.8V to the RS232 levels (Example on 4 signals only). Figure 16: RS232 Level Adaption Circuitry Example NOTE: In this case, the length of the lines on the application must be taken into account to avoid problems in the case of High-speed rates on RS232. The RS232 serial port lines are usually connected to a DB9 connector as shown in Figure 17. Signal names and directions are named and defined from the DTE point of view. Figure 17: RS232 Serial Port Lines Connection Layout
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 76 of 104 8.3. Peripheral Ports In addition to the LE940B6 serial ports, the LE940B6 supports the following peripheral ports: • SPI – Serial Peripheral Interface • I2C - Inter-integrated circuit • Ethernet – Ethernet PHY Interface 8.3.1. SPI – Serial Peripheral Interface The LE940B6 SPI supports the following: • Master Mode only • 1.8V CMOS level • Up to 26 MHz clock rate NOTE: SPI is supported only on the Linux side. The LE940B6 module supports Master mode only and cannot be configured as Slave mode. Table 29: SPI Signals PAD Signal I/O Function Type Comment P19 SPI_CLK O SPI clock output 1.8V M19 SPI_MISO I SPI data Master input Slave output 1.8V K19 SPI_MOSI O SPI data Master output Slave input 1.8V N18 SPI_CS O SPI chip-select output 1.8V Figure 18: SPI Signal Connectivity LE940B6 (Master) SPI_CS SPI_CLK SPI_MOSI SPI_MISO Host (Slave) SPI_CS SPI_CLK SPI_MOSI SPI_MISO
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 77 of 104 8.3.2. I2C - Inter-integrated Circuit The LE940B6 I2C is an alternate function of GPIO 1-15 pins. Available only from Modem side as SW emulation of I2C on GPIO lines. Any GPIO can be configured as SCL or SDA. LE940B6 supports I2C Master Mode only. NOTE: SW emulated I2C on GPIO lines is supported only from the modem side. For more information, refer to Ref 1: LE940B6 AT Command Reference Guide for command settings. 8.4. Ethernet Interface The LE940B6 has an integrated Ethernet interface to an external Ethernet PHY supporting 10M / 100M and 1G speed modes via a RGMII interface. The Ethernet interface is target to be compliant with the RGMII and RMII specifications. The supported RGMII and RMII specification versions are: • RGMII: Version 1.3, dated 12/10/2000, supporting up to 1000 Mbps operation • RMII: Version 1.2, dated 03/20/1998, supporting up to 100 Mbps operation NOTE: Customer should carefully design the Ethernet interface depending on PHY chipset; Please contact Telit R&D for more details and guidelines. Table 30: Ethernet Interface PAD Signal I/O Function Type COMMENT G14 MAC_MDC O Management Data Clock 2.5/3.3V G12 MAC_MDIO I/O Management Data I/O 2.5/3.3V V16 MAC_TXD[0] O RGMII or RMII TXD[0] 2.5/3.3V T16 MAC_TXD[1] O RGMII or RMII TXD[1] 2.5/3.3V R16 MAC_TXD[2] O RGMII TXD[2] 2.5/3.3V N16 MAC_TXD[3] O RGMII TXD[3] 2.5/3.3V L16 MAC_GTX_CLK O RGMII Transmit Clock 2.5/3.3V G16 MAC_TXEN_ER O RGMII Transmit Enable /Error or RMII Transmit Enable 2.5/3.3V
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 78 of 104 PAD Signal I/O Function Type COMMENT AL16 MAC_RXD[0] I RGMII or RMII RXD[0] 2.5/3.3V AJ16 MAC_RXD[1] I RGMII or RMII RXD[1] 2.5/3.3V AG16 MAC_RXD[2] I RGMII RXD[2] 2.5/3.3V AE16 MAC_RXD[3] I RGMII RXD[3] 2.5/3.3V AC16 MAC_RX_CLK I RGMII Receive Clock 2.5/3.3V X16 MAC_RXDV_ER I RGMII Receive Data Available/Error or RMII Receive Error 2.5/3.3V G10 ETH_INT_N I Ethernet PHY Interrupt 2.5/3.3V G8 ETH_RST_N O Ethernet PHY Reset Output 2.5/3.3V 8.5. Audio Interface The LE940B6 module supports analog and digital audio interfaces. 8.5.1. Analog Audio The LE940B6 module provides an analog audio interface; a single differential input for the audio to be transmitted (Uplink), and a balanced output for the received audio (Downlink). The analog interface is on the following pins: Table 31: Analog Audio Signals PAD Signal I/O Function Type Comments B5 EAR1_MT+ AO Earphone signal output, phase + Audio A4 EAR1_MT- AO Earphone signal output, phase - Audio B3 MIC1_MT+ AI Microphone signal input, phase + Audio A2 MIC1_MT- AI Microphone signal input, phase - Audio G6 MICBIAS AO Microphone bias is 1.9~2.2V Power For more details, Application Note will be prepared for the Audio Settings.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 79 of 104 8.5.2. Digital Audio The LE940B6 module can be connected to an external codec through the digital interface. The product provides a single Digital Audio Interface (DVI) on the following pins: Table 32: Digital Audio Interface (DVI) Signals PAD Signal I/O Function Type Comments D11 DVI_WA0 O Digital Audio Interface (WA0) B-PD 1.8V PCM_SYNC C8 DVI_RX I Digital Audio Interface (RX) B-PD 1.8V PCM_DIN D9 DVI_TX O Digital Audio Interface (TX) B-PD 1.8V PCM_DOUT C10 DVI_CLK O Digital Audio Interface (CLK) B-PD 1.8V PCM_CLK 8.6. General Purpose I/O The general-purpose I/O pads can be configured to act in three different ways: • Input • Output • Alternative function (internally controlled) Input pads can only be read, reporting digital values (high / low) present at the reading time. Output pads can only be written or queried and set values on the pad output. Alternative function can be internally controlled by LE940B6 firmware and act according to the implementation. The type of GPIO can be set to Open-drain signaling; default type is CMOS mode. Table 33: GPIOs PAD Signal I/O Function Type Drive Strength F9 GPIO_01 I/O Configurable GPIO CMOS 1.8V 1 mA E10 GPIO_02 I/O Configurable GPIO CMOS 1.8V 1 mA F11 GPIO_03 I/O Configurable GPIO CMOS 1.8V 3 mA E12 GPIO_04 I/O Configurable GPIO CMOS 1.8V 3 mA F13 GPIO_05 I/O Configurable GPIO CMOS 1.8V 1 mA E14 GPIO_06 I/O Configurable GPIO CMOS 1.8V 3 mA
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 80 of 104 PAD Signal I/O Function Type Drive Strength R18 GPIO_07 I/O Configurable GPIO CMOS 1.8V 3 mA S19 GPIO_08 I/O Configurable GPIO CMOS 1.8V 3 mA U19 GPIO_09 I/O Configurable GPIO CMOS 1.8V 3 mA W19 GPIO_10 I/O Configurable GPIO CMOS 1.8V 3 mA L18 GPIO_11 I/O Configurable GPIO CMOS 1.8V 3 mA J18 GPIO_12 I/O Configurable GPIO CMOS 1.8V 3 mA AN4 GPIO_20 I/O Configurable GPIO CMOS 1.8V 3 mA H1 GPIO_21 I/O Configurable GPIO CMOS 1.8V 3 mA K1 GPIO_22 I/O Configurable GPIO CMOS 1.8V 4 mA NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. NOTE: LE940B6 GPIOs can also be used as alternate I2C function. Refer to Section 8.3.2, I2C - Inter-integrated Circuit. 8.6.1. Using a GPIO Pad as Input GPIO pads, when used as inputs, can be connected to a digital output of another device and report its status, provided this device has interface levels compatible with the 1.8V CMOS levels of the GPIO. If the digital output of the device is connected with the GPIO input, the pad has interface levels different from the 1.8V CMOS. It can be buffered with an open collector transistor with a 10 kΩ pull-up resistor to 1.8V. 8.6.2. Using a GPIO Pad as Output GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs, the pads have a push-pull output, and therefore the pull-up resistor can be omitted.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 81 of 104 Figure 19: GPIO Output Pad Equivalent Circuit
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 82 of 104 9. Miscellaneous Functions 9.1. Indication of Network Service Availability The STAT_LED pin status shows information on the network service availability and call status. In the LE940B6 module, the STAT_LED usually needs an external transistor to drive an external LED. The status indicated in Table 34 is configurable. Refer to Ref 1: LE940B6 AT Command Reference Guide for the full description of this function. Table 34: Network Service Availability Indication LED Status Device Status Permanently off Device off Fast blinking (Period depends on network condition) Registered with power saving Slow blinking (Period 3s, Ton 1s) Registered with full service Permanently on A call is active Figure 20: Status LED circuit example
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 83 of 104 9.2. RTC – Real Time Clock The VRTC pin is used to power the RTC only when the main battery voltage level is too low or missing. 9.3. VAUX Power Output A regulated power supply output is provided to supply small devices from the module. This output is active when the module is ON and goes OFF when the module is shut down. The operating range characteristics of the supply are as follows: Table 35: Operating Range – VAUX Power Supply Min Typical Max Output voltage 1.75V 1.80V 1.85V Output current 100 mA Output bypass capacitor (within the module) 1 μF 9.4. ADC Converter 9.4.1. Description The LE940B6 module provides three on-board 12-bit Analog to Digital converters. Each ADC reads the voltage level applied on the relevant pin, converts it and stores it into a 16-bit word. Table 36: ADC Parameters Min Max Units Input voltage range 0 1.2 Volt AD conversion - 12 bits 9.4.2. Using the ADC Converter An AT command is available to use the ADC function. The command is AT#ADC=1,2. The read value is expressed in mV. Refer to Ref 1: LE940B6 AT Command Reference Guide for the full description of this function.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 84 of 104 9.5. Using the Temperature Monitor Function The Temperature Monitor supports temperature monitoring by giving periodic temperature indications, to execute some function at extreme state. If properly set (see the #TEMPMON command in the Ref 1: LE940B6 AT Command Reference Guide), it raises a GPIO to High Logic level when the maximum temperature is reached. 9.6. Fuel Gauge (TBD) The LE940B6 module can optionally support an external Fuel Gauge solution. In this case, an external IC that is capable of measuring the current flow in and out of the module must be added on the carrier board. Figure 21 shows an example of a typical connectivity of such an external fuel gauge to the LE940B6 module. Detailed design - TBD Figure 21: Fuel Gauge Connectivity Example 9.7. eFuse The LE940B6 needs 1.8 +/- 0.05V applied on pad VPP(H17) for eFuses being programmed. The fuse voltage should be applied to VPP(H17) prior to the fuse script being started, and should be removed after the fuse operation has been completed. Warning: Fuse voltage must never be supplied when the module is not powered up.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 85 of 104 10. Mounting the Module on your Board 10.1. General The LE940B6 module is designed to be compliant with a standard lead-free soldering process as defined in JESD22b102d, table 3b. The number of reflows must not exceed two. This limits Tmax to 245 °C. 10.2. Finishing & Dimensions
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 86 of 104 10.3. Recommended Footprint for the Application Figure 22 shows the top view of the module, which has 334 pads (dimensions are in mm). To facilitate replacing the LE940B6 module if necessary, it is suggested to design the application board with a 1.5 mm placement inhibit area around the module. These regions are highlighted in Figure 22. It is also suggested, as a common rule for an SMT component, to avoid having a mechanical part of the application board in direct contact with the module. NOTE: In the customer application, the region marked as INHIBIT WIRING in Figure 22 must be clear of signal wiring or ground polygons. Figure 22: Application Module Top View
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 87 of 104 10.4. Stencil Stencil’s apertures layout can be the same as the recommended footprint (1:1). The suggested thickness of stencil foil is greater than 120 µm. 10.5. PCB Pad Design The solder pads on the PCB are recommended to be of the Non Solder Mask Defined (NSMD) type. Figure 23: PCB Pad Design
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 88 of 104 10.6. Recommendations for PCB Pad Dimensions (mm) Figure 24: PCB Pad Dimensions It is not recommended to place around the pads a via or micro-via that is not covered by solder resist in an area of 0.3 mm unless it carries the same signal as the pad itself (see Figure 25). Figure 25: Inhibit Area for Micro-via Holes in pad are allowed only for blind holes and not for through holes. Table 37: Recommendations for PCB Pad Surfaces Finish Layer Thickness (um) Properties Electro-less Ni / Immersion Au 3-7 / 0.05-0.15 Good solder ability protection, high shear force values
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 89 of 104 The PCB must be able to resist the higher temperatures, which occur during the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste. 10.7. Solder Paste We recommend using only “no clean” solder paste to avoid the cleaning of the modules after assembly. 10.7.1. Solder Reflow Figure 26 shows the recommended solder reflow profile. Figure 26: Solder Reflow Profile
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 90 of 104 Table 38: Solder Profile Characteristics Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max Preheat – Temperature min (Tsmin) – Temperature max (Tsmax) – Time (min to max) (ts) 150°C 200°C 60-180 seconds Tsmax to TL – Ramp-up rate 3°C/second max Time maintained above: – Temperature (TL) – Time (tL) 217°C 60-150 seconds Peak temperature (Tp) 245 +0/-5°C Time within 5°C of actual peak Temperature (tp) 10-30 seconds Ramp-down rate 6°C/second max Time 25°C to peak temperature 8 minutes max NOTE: All temperatures refer to topside of the package, measured on the package body surface. Warning: The LE940B6 module withstands one reflow process only.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 91 of 104 11. Application Guide 11.1. Debug of the LE940B6 Module in Production To test and debug the mounting of the LE940B6 module, we strongly recommend to add several test pads on the application board design for the following purposes: • Checking the connection between the LE940B6 itself and the application • Testing the performance of the module by connecting it with an external computer Depending on the customer application, these test pads include, but are not limited to the following signals: • TXD • RXD • ON_OFF_N • SHUTDOWN_N • RESET_N • GND • VBATT • VAUX/PWRMON • TXD_AUX • RXD_AUX • USB_VBUS • USB_D+ • USB_D- • Signals for analysis
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 92 of 104 11.2. Bypass Capacitor on Power Supplies When a sudden voltage step is asserted to or a cut from the power supplies, the steep transition causes some reactions such as overshoot and undershoot. This abrupt voltage transition can affect the device causing it to not operate or to malfunction. Bypass capacitors are needed to alleviate this behavior. The behavior can appear differently depending on the various applications. Customers must pay special attention to this issue when they design their application board. The length and width of the power lines must be considered carefully and the capacitance of the capacitors must be selected accordingly. The capacitor will also prevent ripple of the power supplies and the switching noise caused in TDMA systems. Especially, a suitable bypass capacitor must be mounted on the following lines on the application board: • VBATT & VBATT_PA (Pads AP17,AP19,AR18,AR20,AS17,AS19,AT18,AU17,AU19,AT20) Recommended values are: • 100 uF for VBATT & VBATT_PA Customers must still consider that the capacitance mainly depends on the conditions of their application board. Generally, more capacitance is required when the power line is longer.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 93 of 104 11.3. SIM Interface This section presents the recommended schematics for the design of SIM interfaces on the application boards. The LE940B6 supports two external SIM interfaces. 11.3.1. SIM Schematic Example Figure 27 illustrates in particular how to design the application side, and what values the components should have. Figure 27: SIM Schematics NOTE: An external pull-up resistor on SIMIO is not required. The LE940B6 module contains an internal pull-up resistor on SIMIO. Table 39 lists the values of C1 to be adopted with the LE940B6 product: Table 39: SIM Interface – C1 Range Product P/N C1 Range (nF) LE940B6 100 nF Refer to the following document for details: • Ref 4: SIM Integration Design Guide
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 94 of 104 11.4. EMC Recommendations All LE940B6 signals are provided with some EMC protection. Nevertheless, the accepted level differs according to the specific pin. Table 40 lists the characteristics. Table 40: EMC Recommendations Pad Signal I/O Function Contact Air Antenna AD1, AU9 Antenna pads I/O Antenna pads ± 4 KV ± 8 KV All other pins have the following characteristics: • HBM JESD22-A114-B ± 1000 V • CDM JESD22-C101-C ± 250 V Warning: Do not touch without proper electrostatic protective equipment. The product must be handled with care, avoiding any contact with the pins because electrostatic discharge may damage the product. 11.5. Download and Debug Port This section provides recommendations for the design of the host system used to download or upgrade the Telit software and to debug the LE940B6 module when it is already mounted on a host system. • For downloading or upgrading the Telit software In the LE940B6 module, firmware updates by the host are only possible via USB and not via UART. So even if USB interface is not used, it is still highly recommended to place an optional USB connector on the application board.At the minimum, test points of the USB signals are required to enable SW update. • For debugging of the LE940B6 module USB, Auxiliary UART and JTAG interfaces can be used for debugging the LE940B6 module. Even if USB or JTAG are not used for debugging, it is recommended to have at least the Auxiliary UART pins exposed to outside for debugging purposes.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 95 of 104 11.6. Antenna Detection The LE940B6 module provides an antenna detection application. Many automotive applications require to detect if the antenna is shorted to ground or the battery of the vehicle for fault tracing. Basically, antenna detection is performed by means of its DC characteristics, splitting the DC and RF paths. Refer to Telit 80000NT10002a - Antenna Detection Application Note.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 96 of 104 12. Packing System The LE940B6 module is packed on trays. The tray is JEDEC compliant, injection molded antistatic Modified Polyphenylene ether (MPPO). It has good thermal characteristics and can withstand the standard baking temperature of up to 125°C, thereby avoiding the need of handling the modules if baking is required. The trays are rigid, thus providing mechanical protection against transport stress. In addition, they are re-usable and so environmentally sustainable. There are 2 (two) antistatic rubber bands that enclose each envelope. The carton box is rigid, thus offering mechanical protection. The carton box has one flap across the entire top surface. It is sealed with tape along the edges of the box. Table 41: Tray Packing Modules per Tray Trays per Envelope Modules per Envelope Envelopes per Carton Box Modules per Box 21 5+ 1 empty 105 4 420 Table 42: Packing Quantities Order Type Quantity Minimum Order Quantity (MOQ) 21 Standard Packing Quantity (SPQ) 420
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 97 of 104 Each tray contains 24 modules as shown in Figure 28. Figure 28: Tray Packing
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 98 of 104 12.1. Tray Drawing The Telit LE940B6 is packaged on trays. Each tray contains 21 pieces with the following dimensions: Figure 29: Tray Drawing Warning: These trays can withstand a maximum temperature of 125°C 12.2. Moisture Sensitivity The LE940B6 module is a Moisture Sensitive Device Level 3, in accordance with standard IPC/JEDEC J-STD-020. Observe all of the requirements for using this kind of components. Calculated shelf life in sealed bag: 4 months at <40°C and <90% relative humidity (RH).
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 99 of 104 13. Conformity Assessment Issues 13.1. FCC/IC Regulatory Notices Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. CAN ICES-3(B)/ NMB-3(B) Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement." This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 100 of 104 - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Radiation Exposure Statement This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body. End Product Labeling When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: RI7LE940B6NA”, “Contains IC: 5131A-LE940B6NA.” The grantee's FCC/IC ID can be used only when all FCC/IC compliance requirements are met. This device is intended only for OEM integrators under the following conditions: (1) The antenna must be installed such that 20 cm is maintained between the antenna and users, (2) The transmitter module may not be co-located with any other transmitter or antenna. (3) To comply with FCC/IC regulations limiting both maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile exposure condition must not exceed: 3.0 dBi in Cellular band 3.5 dBi in PCS band 3.5 dBi in AWS band 3.0 dBi in 700 MHz band 4.0 dBi in 2500MHz band In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 101 of 104 14. Safety Recommendations READ CAREFULLY Be sure that the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and must be avoided in the following areas: • Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc. • Where there is risk of explosion, such as gasoline stations, oil refineries, etc. It is the responsibility of the user to enforce the country regulations and the specific environment regulations. Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for correct wiring of the product. The product must be supplied with a stabilized voltage source and the wiring conform to the security and fire prevention regulations. The product must be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. The same caution must be taken for the SIM, checking carefully the instructions for its use. Do not insert or remove the SIM when the product is in power saving mode. The system integrator is responsible for the functioning of the final product; therefore, care must be taken of the external components of the module, as well as of any project or installation issue, because of the risk of disturbing the cellular network or external devices or having any impact on safety. Should there be any doubt, refer to the technical documentation and the regulations in force. Every module must be equipped with a proper antenna with the specified characteristics. The antenna must be installed with care to avoid any interference with other electronic devices and must be installed with the guarantee of a minimum 20 cm distance from a human body. If this requirement cannot be satisfied, the system integrator must assess the final product against the SAR regulation. The European Community provides some Directives for electronic equipment introduced on the market. All the relevant information is available on the European Community website: http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm The text of the Directive 99/05 regarding telecommunication equipment is available, while the applicable Directives (Low Voltage and EMC) are available at: http://europa.eu.int/comm/enterprise/rtte/dir99-5.htm
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 102 of 104 15. Document History Table 43: Document Revision History Revision Date Changes Rev. 1.8 2017-03-10 Sec. 5.1: Added Note Sec. 5.3: Added Note Sec. 6.1: Updated table 21 LE940B6 Current Consumption Sec. 7.5: Added new sub chapter Sec. 13: Added Conformity Assessment Issues Rev. 1.7 2017-01-25 Sec. 5: Figures and charts revised Sec. 6: Current consumption table updated
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 103 of 104 Revision Date Changes v. 1.6 2016-11-15 Official Release Sec. 2.7: Updated the Mechanical Specifications Sec. 3.1: Added VPP pin for eFuse Sections 3.1, 3.3, 4.3.6, 8: SD / MMC interfaces were deleted - they are not supported by the chipset vendor. Sec. 5: Updated the specifications and charts of Hardware Commands (Boot-up/Shutdown time, On/Shutdown key hold time) Sec. 5.1: Updated the Power on Hold time. Sec. 5.3.2: Updated the section of Hardware Shutdown Sec. 5.3.3: Updated the Unconditional reset Hold time. Sec. 6.1: Updated Table 21 – Current Consumption in various modes Sec. 6.2.2: Updated the Thermal Design Guidelines Sec. 8.1: USB 3.0 interface is deleted - it is not supported by the chipset vendor. Sec. 8.3.3: WiFi (SDIO) is deleted - it is not supported by the chipset vendor. Sec. 8.6: Table 35 (Additional GPIO) is deleted - it is not supported by the chipset vendor. Sec. 9.7: eFuse section was added. Sec. 11.4: Updated the EMC Recommendations
LE940B6 Hardware User Guide 1VV0301331 Rev. 1.8 - 2017-03-15 Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved Telit Confidential Information, provided under NDA Page 104 of 104 Revision Date Changes Rev. 1.5 2016-09-20 (Interim version) Page 2, Table 1: Updated the Applicability table Sec. 2: Updated the General Product Description Sec. 2.5.1, 2.5.2: Updated the RF bands tables Sec. 3.1: Updated the pin description in the Pin-out table Sec. 4.3: Added tables of logic level specifications Sec. 5: Updated the Turning On and Off trigger times, figures and flow charts Sec. 6.1: Added Table 20 - Power Supply Requirements Sec. 8: Gathered the description of all hardware interfaces into this section Sec. 8.1: Updated note and figure for USB Sec: 8.2: Various updates about the Serial Ports Sec. 8.4: Updates about the Ethernet interface Sec. 8.6: Updated the GPIO drive strength Sec 11.5: Updated the Download and Debug Port section Sec 12: Updated Packing System information Rev. 1.3 2016-06-22 (Interim version) Sec. 2.4.1: The Storage Temperature range is –40°C ~ +95°C Sec. 3.1: Corrected and Updated the Pin out table (Added GPIO_11/12, MIC_BIAS, VRTC, Removed GPIO_23/24) Sec. 4: Added electrical specifications Sec. 9.4.1: Modified the ADC table Sec. 11.4: Added ESD specifications Preliminary 2016-03-15 First issue

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