ASUSTeK Computer HSW1HEADSET Wireless Headset User Manual

ASUSTeK Computer Inc Wireless Headset

user manual

TITLE:
Product Specification for HS-W1
Revision:
001
Date:
11/30/2011
Prepared by:
Approved by:
Page: 1 of 18
本文件為美律實業股份有限公司專有之財產，非經書面許可，不准透露或使用本資料，亦不准複印，複製或轉變成任何其他形式使用。
The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
Contents
1 Appearance ...................................................................................................................... 3
2 Product dimensions & ID ................................................................................................ 4
3 Electrical section ............................................................................................................. 5
3.1 Physical Characteristics ..................................................................................................................................................... 5
3.2 Hardware Description ........................................................................................................................................................ 5
3.3 Functionality ...................................................................................................................................................................... 5
3.4 ASSEMBLY REQUIREMENTS ....................................................................................................................................... 6
3.4.1 Electrical Specifications ............................................................................................................................................ 6
3.5 Tone MMI ......................................................................................................................................................................... 7
3.6 RF ...................................................................................................................................................................................... 7
4 Acoustic ........................................................................................................................... 8
4.1 Audio Performance – General Information ....................................................................................................................... 8
4.2 Audio Performance ............................................................................................................................................................ 9
4.2.1 Summary of key audio parameters ............................................................................................................................ 9
4.2.2 Max allowed SPL @ ERP ....................................................................................................................................... 10
4.2.3 Receive THD ........................................................................................................................................................... 10
4.2.4 Idle receive noise (dBA) ......................................................................................................................................... 11
4.2.5 Send path ................................................................................................................................................................. 11
4.2.6 SLR ......................................................................................................................................................................... 11
4.2.7 Send mask ............................................................................................................................................................... 11
4.2.8 Send THD ............................................................................................................................................................... 13
4.2.9 Idle send noise ......................................................................................................................................................... 13
4.2.10 cho performance .................................................................................................................................................... 14
5 Reliability ....................................................................................................................... 15
TITLE:
Product Specification for HS-W1
Revision:
001
Date:
11/30/2011
Prepared by:
Approved by:
Page: 2 of 18
本文件為美律實業股份有限公司專有之財產，非經書面許可，不准透露或使用本資料，亦不准複印，複製或轉變成任何其他形式使用。
The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
Change history
Revisions
Sections
Updates
Remarks
001
Primary version
1.
1.
TITLE:
Product Specification for HS-W1
Revision:
001
Date:
11/30/2011
Prepared by:
Approved by:
Page: 3 of 18
本文件為美律實業股份有限公司專有之財產，非經書面許可，不准透露或使用本資料，亦不准複印，複製或轉變成任何其他形式使用。
The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
1 APPEARANCE
TITLE:
Product Specification for HS-W1
Revision:
001
Date:
11/30/2011
Prepared by:
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Page: 4 of 18
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The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
2 PRODUCT DIMENSIONS & ID
Headset
1. HEADBAND
2. R_HEADBAND_COVER
3. L_Headband_COVER
4. HEADBAND_FOAM
5. L_SLIDE_HOLDER_F
6. L_SLIDE_HOLDER_B
7. L_SLIDE_HOLDER_RING
8. L_EARCUP_HOLDER_F
9. L_EARCUP_HOLDER_B
10. L_EARCUP_HOLDER_RING
11. MIC_BOOM_F
12. MIC_BOOM_B
13. MIC_BOOM_LEDLENS
14. MIC_BOOM_COVER
15. L_ASUS_LOGO
16. MIC_FOAM_F
17. MIC_FOAM_B
18. L_EARCUP
19. L_EARCUP_COVER
20. L_EARCUP_FOAM
21. R_SLIDE_HOLDER_F
22. R_SLIDE_HOLDER_B
23. R_SLIDE_HOLDER_RING
24. R_EARCUP_HOLDER_F
25. R_EARCUP_HOLDER_B
26. R_EARCUP_HOLDER_RING
27. R_EARCUP_HOLDER_B_COVER
28. R_EARCUP_HOLDER_COVER
29. R_ASUS_LOGO
30. POWER_LEDLENS
31. POWER_KEY
32. R_EARCUP
33. R_EARCUP_COVER
34. R_EARCUP_FOAM
35. Dongle_UPPER_HOUSING
36. Dongle_BOTTOM_HOUSING
TITLE:
Product Specification for HS-W1
Revision:
001
Date:
11/30/2011
Prepared by:
Approved by:
Page: 5 of 18
本文件為美律實業股份有限公司專有之財產，非經書面許可，不准透露或使用本資料，亦不准複印，複製或轉變成任何其他形式使用。
The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
3 ELECTRICAL SECTION
3.1 Physical Characteristics
1. Indicator Lights: Provides a visual cue regarding the status of the headset
2. Power ON/OFF switch: Push button to turns headset on and off
3. Volume Control Buttons: Adjusts the speaker (receiver) volume
4. Micro-USB power connector: Allows connection to PC USB only for charging.
5. Boom Switch: Swim down to enable MIC.
3.2 Hardware Description
The Headphones contains a 2.4G module, battery, and acoustic transducers for audio
communication via the RF link to a PC or NB. A LED provides visual feedback to the users
and others about the status of the headphones. There are two user interface regions, left and
right sides, to operate all control features of the headphones, rotating boom switch, volume up
and down.
3.3 Functionality
RIGHT SIDE
Volume Control: Increase and decrease volume buttons. (volume mute a bit,pop up noise,
reset way)
Power On/Off&Pairing mode&HW reset : multi-function button
Press 2 sec Power On/Off
Press 5 sec enter pairing mode
Press 10 sec HW Reset
LED: Indicate the status of headset.
Power LED: Dual Color LED, RED and GREEN.
Green LED flash slowly in no-pairing mode.
Green LED turns on constant and turns off after 3min. when handset pairs success.
Green LED flash quickly when handset is pairing.
Red LED turns on constant when handset is charging.
TITLE:
Product Specification for HS-W1
Revision:
001
Date:
11/30/2011
Prepared by:
Approved by:
Page: 6 of 18
本文件為美律實業股份有限公司專有之財產，非經書面許可，不准透露或使用本資料，亦不准複印，複製或轉變成任何其他形式使用。
The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
Red LED turns off when battery finishes charging.
Red LED flash slowly when handset is on low-battery mode.
Red LED flash quickly when handset is error charging(Charge Suspend for temperature,
Timer Fault, Input power overvoltage, Battery short).
LEFT SIDE
Boom Switch: Rotate boom down to enable the MIC and pick up skype-in
RED LED: RED LED turns on when MIC enabled.
.
3.4 ASSEMBLY REQUIREMENTS
3.4.1 Electrical Specifications
3.4.2 Battery Specifications (For Reference Only)
Battery Type
Lithium Ion Polymer
Battery Capacity
410 mAh
Battery Voltage
3.7V (Nominal)
Operating Voltage
3.3 ~ 4.2V
Maximum Fast Charge Rate
200 mA
Battery Life Cycle
≥300 Cycles
3.4.3 Input requirements
Input DC Voltage
5V 5%
Input Current
100mA (min.), 250mA (max) Note the max current is the maximum
current allowed by the device during loss of charge control. This
loss of charge control constitutes a single fault condition of the
device. The device shall limit the current by some means to this
max limit.
Input connector
Type-B Micro USB
Charging time
3hr
TITLE:
Product Specification for HS-W1
Revision:
001
Date:
11/30/2011
Prepared by:
Approved by:
Page: 7 of 18
本文件為美律實業股份有限公司專有之財產，非經書面許可，不准透露或使用本資料，亦不准複印，複製或轉變成任何其他形式使用。
The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
3.4.4 Current Consumption
Operating Mode
Mode Description
Current Consumption
(mA)(rms) from Battery
Off Mode [X]
Headset is not active.
≤ 0.05mA
Standby Mode
Headset is active, paired and
connected to the phone.
≤ 50mA
Playing Mode
Headset is operating.
≤ 65mA
Battery Life Time
Playing music
6hr
3.5 Tone MMI
Status
Action
Enter low battery mode
Alert Tune beeps.
MIC enable and disable
Ring tone
Power On
Ring tone
RF link
Ring tone
3.6 RF
Table 1
RF General Characteristics
Parameter
Minimum
Typical
Maximum
Units
Operating Frequency
2400
2525
MHz
PLL Programming step
2
MHz
System freauency
16
MHz
Freauency deviation
+/-700
KHz
Channel spacing
2
MHz
RF Transmitter Characteristics
Maximum output power
6
8
dBm
20dB Bandwidth for modulated carrier
3
MHz
First adjacent channel transmit power
2MHz
-20
dBm
Second adjacent channel transmit
power 4MHz
-50
dBm
Maximum received signal at 0.1% BER
0
dBm
Sensitivity(0.1% BER)
-80
dBm
RF Range
10
m
TITLE:
Product Specification for HS-W1
Revision:
001
Date:
11/30/2011
Prepared by:
Approved by:
Page: 8 of 18
本文件為美律實業股份有限公司專有之財產，非經書面許可，不准透露或使用本資料，亦不准複印，複製或轉變成任何其他形式使用。
The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
4 ACOUSTIC
4.1 Audio Performance – General Information
Unless otherwise specified:
Microphone and speaker design verification testing will be done on a HATS (per
ITU-T P.58 specification) with a Type 3.3 ear with a soft pinna (per ITU-T P.57
specification).
Frequency response masks are floating, best fit masks.
DRP to ERP correction will be applied to all measurements performed using the
Type 3.3 ear as defined in the ITU-T P.58 specification.
SLR calculations are to be performed following the ITU-T P.79 specification.
Frequency response measurements must be done with a resolution of at least
1/12th octave or R40 series from 100 to 8000 Hz.
Measurements are to be performed at standard temperature and pressure of 25o C
and 1 atmosphere.
Environment setup for receiving measurement path and sending measurement
path are shown as blow Fig.
Signal input
through 2.4G
USB dongle
TITLE:
Product Specification for HS-W1
Revision:
001
Date:
11/30/2011
Prepared by:
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The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
Any deviation from the prescribed testing conditions must be called out in the design
verification reports.
4.2 Audio Performance
4.2.1 Summary of key audio parameters
Parameter
Value
Test Signal Level
Note
Max SPL @ ERP
< 120 dB SPL
-3.01 dBDrms
20Hz-20KHz, DRP-to-ERP
correction needs to be applied
RX THD
RXTHDMASK
See mask
-3.01 dBDrms
300-8000 Hz, RX THD<3%
RX Idle receive
noise
< -56 dBPa(A)
-Inf dBDrms sent
Audio connection must be active
SLR
15+/- 3
-4.7 dBPa(A) @
MRP
Artificial speech P50 test signal
must be used. The SLR is
calculated from 100-8KHz.
Send Response
TX Mask
TXMASK
See mask
-4.7 dBPa(A) @
MRP
Artificial speech test signal must be
used.
Idle send noise
< - 64 dBm0p
Psophometeric weighting used
TCLw
> 30dB
-18.2dBDrms
Real speech must be used
Signal input
through 2.4G
USB dongle
TITLE:
Product Specification for HS-W1
Revision:
001
Date:
11/30/2011
Prepared by:
Approved by:
Page: 10 of 18
本文件為美律實業股份有限公司專有之財產，非經書面許可，不准透露或使用本資料，亦不准複印，複製或轉變成任何其他形式使用。
The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
4.2.2 Max allowed SPL @ ERP
This can be measured by sweeping a -3 dBDrms tone, and measuring the response from the IEC711
coupler. Note that the DRP-to-ERP correction is to be applied. No point on the curve is to be
above 120 dB.
4.2.3 Receive THD
The Receive THD shall be measured at the maximum volume step with a -3dBDrms sweep sine
signal from 20Hz to 20KHz, and measuring the response from the IEC711 coupler. The headset
Receive THD shall fall below the upper limit given in the following Table and Figure.
Limit Curve
Frequency (Hz)
Send Response Limit
(dB) [floating level]
Upper Limit
300
3
1000
3
5000
3
8000
3
TITLE:
Product Specification for HS-W1
Revision:
001
Date:
11/30/2011
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The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
4.2.4 Idle receive noise (dBA)
The idle receive noise shall be measured at the maximum volume step. This must be measured with
a quite (all zero) signal being sent. The final ERP spectrum must be A weighted and power summed to
achieve the final dBA value. Following the ITU-T p.310 recommendation, It shall not exceed -56
dBPa(A) or 38 dBA SPL measured on an IEC711 coupler with the DRP-to-ERP correction applied.
4.2.5 Send path
The send microphone path is to be measured on a HATS with the send path representing the transfer
function from the pressure at MRP to the microphone signal. Frequently in DSP enabled headsets,
the send path cannot be measured with tones, but must be measured with a broadband artificial speech
signal into the hats mouth simulator.
The send path requirements are to be measured with an in-speech SPL of -4.7 dBPa(A) or
89.3 dBA SPL 3 dB at MRP. The signal sent into the artificial mouth must be equalized to
compensate for the non-flat response of a HATS artificial mouth to achieve a nearly flat response
between the digital representation of the test signal and the MRP pressure.
4.2.6 SLR
The SLR is the loudness loss in the send direction from the acoustic signal at the mouth reference
point to the send signal at the digital reference point. Refer to Annex A and ITU-T Recommendation
P.79.
The SLR shall be calculated using the 1/3rd octave sensitivity data collected from the send frequency
response measurement. Use equation [A1] of Annex A and bands 1 to 20, of Table 14. The terminal is
designed to have a SLR = 15 dB 3 dB
4.2.7 Send mask
The headset send frequency response shall fall between the upper limit and the lower limit given in
the following Table and Figure. The limit curves shall be determined by straight lines joining
successive co-ordinates given in the table, when frequency response is plotted on a linear dB scale
against frequency on a logarithmic scale. Note that the frequency response mask is a floating or “best
fit” mask.
TITLE:
Product Specification for HS-W1
Revision:
001
Date:
11/30/2011
Prepared by:
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The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
Limit Curve
Frequency (Hz)
Send Response Limit
(dB) [floating level]
Upper Limit
100
0
1000
0
5000
4
8000
4
Lower Limit
200
-11
250
-8
5000
-8
6300
-11
TITLE:
Product Specification for HS-W1
Revision:
001
Date:
11/30/2011
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The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
4.2.8 Send THD
This is to be measured with a -4.7 dBPa(A) measured at MRP using a sweep sine signal played from
the HATS artificial mouth. The headset send THD shall fall below the upper limit given in the
following Table and Figure.
Limit Curve
Frequency (Hz)
Send THD Limit
(%)
Upper Limit
300
3
1000
3
5000
3
8000
3
4.2.9 Idle send noise
The idle send noise from the microphone shall be
idle send noise < -64 dBm0p
per the ITU-T P.310 recommendation, where the p denotes the psophometeric weighting defined in
the ITU-T 0.41 recommendation.
TITLE:
Product Specification for HS-W1
Revision:
001
Date:
11/30/2011
Prepared by:
Approved by:
Page: 14 of 18
本文件為美律實業股份有限公司專有之財產，非經書面許可，不准透露或使用本資料，亦不准複印，複製或轉變成任何其他形式使用。
The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
4.2.10 Echo performance
The test signal level shall be -18.2 dBDrms. The TCLw is calculated according to ITU-T
Recommendation G.122 [8], annex B, clause B.4 (trapezoidal rule). For the calculation the
averaged measured echo level at each frequency band is referred to the averaged test signal
level measured in each frequency band. The length of the test signal shall be at least one
second (1,0 s).
TCLW > 30 dB
TITLE:
Product Specification for HS-W1
Revision:
001
Date:
11/30/2011
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The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
5 RELIABILITY
ID
Test Item
Specification
A. Mechanical Test
A-1
Free drop test
Heigh: Headset: 100cm; Dongle: 76cm
Concrete floor for 6 faces
B. Life Test
B-1
Sliding parts push-pull cycle life test
5000 cycles (20 cycles/min)
B-2
Latera expansioncycle life
requirement (10cm)
Latera expansion cycle life requirement (10cm)
Lateral expansion cyclelife test:
:The R-earcup and L-earcup must be capable of being
separated 100.0mm from the relaxed position, for 4000 cycles
without any physical damage to any electrical or mechanical
component. There should be no permanent deformation in the
headband spring or relaxation to the spring rate of the headband
spring. One cycle is an expansion to 100.0 mm from the relaxed
position and an immediate return to the relaxed position.(PS:allow
2.5mm change )
B-3
Volume button
10,000 times (1 times/sec) and loading: 300g
B-4
Bending Test (Cable)
2000 cycles, +/-90 degree, loading: 300g
B-5
Pull test (Cable)
3kg(both side), 60 seconds
B-6
I/O Connector Insert/Remove Test
Test Frequency: 20 times/min
Test Cycle:4000 times
B-7
Rotation life cycle test
(1)(Folding Fulcrum):The R-earcup and L-earcup must be capable
of being Normal after 3000 times (20 times/min).
(2)(Microphone):Must be capable of being Normal after 3000
times (20 times/min).
B-8
Lateral over expansioncycle life
requirement
The R-earcup and L-earcup must be capable of being separated
200.0mm from the relaxed position, for 10 cycles without
component breakage. A permanent 10% set is allowable in the
headband spring.
C. Enviromental
C-1
Operation temperature/Humidity
test
0degC, 24hrs ; 40degC, 90%RH, 24hrs
C-2
Thermal shock test
-30degC~60degC, 27cycles, 1cycle/1.5hrs
C-3
Altitude test (Non-Operation)
Non -Opeation: 40000 feet, -30degC, 8 hrs
TITLE:
Product Specification for HS-W1
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The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
C-4
Altitude test (Operation)
Operation = 15000 feet , -14.7℃ , 8hrs
C-5
Thermal Profile Measurement
25℃,35℃,40 ℃ , 2hrs (each condition)
C-6
Non-OP High
Temperature/Humidity Test
Ta=60℃ , 90% RH , 72 hrs
C-7
Non-OP Low Temperature Test
Ta= - 40℃ , 72 hours
C-8
Audio Signal Measurement
According to vender spec
D. Durability Test for Dongle
D-1
Pressure Test
Location:Top & Bottom
Disc Radius:10cm
Pressure Force:50kg
Pressure Hold Time:60 sec
Number of press: One time
D-2
I/O Connector Insert/Remove Test
Test Frequency: 20 times/min
Test Cycle:4000 times
D-3
Bending Test
Plug into the USB receptacle (face side and back side):
Diameter 12mm cylinder, Pressure / Stroke(vertical on
dongle): 5kg / 5mm, 10 cycles
D-4
Bending Life Test
Plug into the USB receptacle (face side and back side):
Cylinder diameter 12mm, Pressure / Stroke(vertical on
dongle): 2.5kg / 10mm, 1500 cycles, check function
every 100 cycles
E. Printing Test
E-1
Rubber test
Load: 500g, times: 65 cycles ;
Abrasion Resistance: EF74
E-2
Alcohol test
Load: 500g, times: 30 ;Alcohol (95%)
E-3
Adhesion test
10 X10 squares ; (pass rating: 5B)
E-4
Cosmetics test
70degC, 90%RH, 24hrs (NIVEA and Atrix cream)
F. Additional Test
F-1
Human perspiration test (SEMC)
48 hours at temperature of 45°C and 50-60 % RH
G. Package Shipment Test
F-1
Cold Storage Test
Temperature:-40℃
Duration:72 hours
F-2
Damp Heat Storage Test
Temperature:60℃/90%
Duration:72 hours
F-3
Packaging Vibration Test
5~200 hz, 60 min, 1.48Grms, 3 axes
Reference ASTM LevelⅡ Truck Spectrum
TITLE:
Product Specification for HS-W1
Revision:
001
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11/30/2011
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The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
F-4
Packaging Bump Test
Pulse Shape:Half-Sine wave
Peak Acceleration:40G
Duration: 6+-2ms
Direction : Normal position
Times:4000
F-5
Non- Packaging Bump Test
Pulse Shape:Half-Sine wave
Peak Acceleration:40G
Duration: 9ms
Direction : Normal position
Times:1000
F-6
Packaging Drop Test
Package Weight (KG) Drop Height (cm) No. Drops (Times)
0 ~ 9.1 91 10
9.2 ~ 18.2 76 10
18.3 ~ 27.2 61 10
27.3~45.4 46 10
10 Drops : 1 corner,3 edges and 6 surfaces
F-7
Package Compression Test
[((stack layer -1)+3)*(one carton loading)]+Storage test (-40
℃,48hrs+60℃/90%, 48hrs) condition.
I. EMC & RF
EMC pre-test
ESD, CS, OTA & RE
J. Performance
J-1
Listen time test
Max VOL(mA) 1K tone
J-2
Standby time test
Power on and RF function is OFF
NCC 警語
經型式認證合格之低功率射頻電機，非經許可，公司、商號或使用者均不得擅自變更頻率、加大功
率或變更原設計之特性及功能。
低功率射頻電機之使用不得影響飛航安全及干擾合法通信；經發現有干擾現象時，應立即停用，並
改善至無干擾時方得繼續使用。
前項合法通信，指依電信法規定作業之無線電通信。低功率射頻電機須忍受合法通信或工業、科學
及醫療用電波輻射性電機設備之干擾。
TITLE:
Product Specification for HS-W1
Revision:
001
Date:
11/30/2011
Prepared by:
Approved by:
Page: 18 of 18
本文件為美律實業股份有限公司專有之財產，非經書面許可，不准透露或使用本資料，亦不准複印，複製或轉變成任何其他形式使用。
The information contained herein is the property of Merry and shall not be distributed reproduced, or disclosed in whole or in part without prior written
permission of Merry.
FEDERAL COMMUNICATIONS COMMISSION INTERFERENCE STATEMENT
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/ TV technician for help.
CAUTION:
Any changes or modifications not expressly approved by the grantee of this device could void the
user's authority to operate the equipment.
Labeling requirements
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
Canada, Industry Canada (IC) Notices
This Class B digital apparatus complies with Canadian ICES-003 and RSS-210.
Operation is subject to the following two conditions: (1) this device may not cause interference, and (2)
this device must accept any interference, including interference that may cause undesired operation of the
device.
Canada, avis d'Industry Canada (IC)
Cet appareil numérique de classe B est conforme aux normes canadiennes ICES-003 et
RSS-210.
Son fonctionnement est soumis aux deux conditions suivantes : (1) cet appareil ne doit pas causer
d'interférence et (2) cet appareil doit accepter toute interférence, notamment les interférences qui peuvent
affecter son fonctionnement.

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