Ai Thinker Technology ESP32S Wi-Fi & Bluetooth Module User Manual ESP 32S
Shenzhen Ai-Thinker Technology co., LTD Wi-Fi & Bluetooth Module ESP 32S
Contents
- 1. Users Manual
- 2. User manual
Users Manual
ESP-32S User Manual ESP-32S User Manual REV 1.0 2017.3 ESP-32S User Manual FCC STATEMENT This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Please notice that if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains FCC ID: 2AHMR-ESP32S” any similar wording that expresses the same meaning may be used. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cmbetween the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The module is limited to OEM installation ONLY. The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. The module is limited to installation in mobile application; A separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and difference antenna configurations. There is requirement that the grantee provide guidance to the host manufacturer for compliance with Part 15B requirements. Copyright © 2017 Ai-Thinker Technology Co., Ltd. All rights reserved. ESP-32S User Manual Contents 1.Preface................................................................................................................................................ 1 2. Pin Definitions....................................................................................................................................3 2.1 Pin Layout.................................................................................................................................3 2.2 Pin Description......................................................................................................................... 4 2.3 Strapping Pins...........................................................................................................................5 3. Functional Description.......................................................................................................................7 3.1 CPU and Internal Memory........................................................................................................7 3.2 External Flash and SRAM..........................................................................................................7 3.3 Crystal Oscillators.....................................................................................................................7 3.4 Power Consumption.................................................................................................................8 3.5 Peripherals and Sensors........................................................................................................... 9 3.5.1 Peripherals and Sensors Description.............................................................................9 3.5.2 Peripheral Schematics.................................................................................................14 4. Electrical Characteristics..................................................................................................................15 4.1 Absolute Maximum Ratings................................................................................................... 15 4.2 Recommended Operating Conditions....................................................................................15 4.3 Digital Terminal Characteristics............................................................................................. 15 4.4 Wi-Fi Radio............................................................................................................................. 16 4.5 Bluetooth LE Radio................................................................................................................. 16 4.5.1 Receiver.......................................................................................................................16 4.5.2 Transmit...................................................................................................................... 17 4.6 Reflow Profile......................................................................................................................... 17 5. Schematics....................................................................................................................................... 18 ESP-32S User Manual 1.Preface ESP-32S is a powerful, generic Wi-Fi +BT+BLE MCU module that targets a wide variety of applications, ranging from low-power sensor networks to the most demanding tasks, such as voice encoding, music streaming and MP3 decoding. At the core of this module is the ESP32-D0WDQ6 chip*, which is designed to be scalable and adaptive. There are two CPU cores that can be individually controlled or powered, and the clock frequency is adjustable from 80 MHz to 240 MHz . The user may also power off the CPU and make use of the low-power coprocessor to constantly monitor the peripherals for changes or crossing of thresholds. ESP32 integrates a rich set of peripherals, ranging from capacitive touch sensors, Hall sensors, low-noise sense amplifiers, SD card interface, Ethernet, high speed SDIO/SPI, UART, I2S and I2C. The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted, and that the module is future proof: using Wi-Fi allows a large physical range and direct connection to the internet through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable for battery powered and wearable electronics applications. ESP-32S supports data rates of up to 150 Mbps, and 22 dBm output power at the PA to ensure the widest physical range. As such the chip does offer industry-leading specifications and the best performance for electronic integration, range, power consumption, and connectivity. The operating system chosen for ESP32 is free RTOS with LWIP; TLS 1.2 with hardware acceleration is built in as well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that developers can continually upgrade their products even after their release. Table 1 provides the specifications of ESP-32S. Table 1: ESP-32S Specifications Categories Wi-Fi Items Specifications Standards FCC/CE/IC/TELEC/KCC/SRRC/NCC 802.11 b/g/n/d/e/i/k/r (802.11n up to 150 Mbps) A-MPDU and A-MSDU aggregation and 0.4 µs guard interval support 2.4 〜2.5 GHz Protocols Frequency range Protocols Bluetooth Radio Audio Shenzhen Ai-Thinker Technology Co., Ltd Bluetooth v4.2 BR/EDR and BLE specification NZIF receiver with -98 dBm sensitivity Class-1, class-2 and class-3 transmitter AFH CVSD and SBC http://www.ai-thinker.com ESP-32S User Manual Categories Items Module interface Hardware Software On-chip sensor On-board clock Operating voltage Operating current Operating temperature range Ambient temperature range Package size Wi-Fi mode Security Encryption Firmware upgrade Software development Network protocols User configuration Shenzhen Ai-Thinker Technology Co., Ltd Specifications SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, I2C, IR GPIO, capacitive touch sensor, ADC, DAC, LNA preamplier Hall sensor, temperature sensor 40 MHz crystal 2.2 〜3.6V Average: 80 mA -40°C ~ 85°C * Normal temperature 18 mm x 25.5 mm x 2.8 mm Station/SoftAP/SoftAP+Station/P2P WPA/WPA2/WPA2-Enterprise/WPS AES/RSA/ECC/SHA UART Download / OTA (via network) / download and write firmware via host Supports Cloud Server Development / SDK for custom firmware development IPv4, IPv6, SSL, TCP/UDP/HTTP/FTP/MQTT AT instruction set, cloud server, Android/iOS app http://www.ai-thinker.com ESP-32S User Manual 2. Pin Definitions 2.1 Pin Layout Figure 1: Top and Side View of ESP-32S Table 2: ESP-32S Dimensions Length Width Height PAD size (bottom) Pin pitch Shielding can height PCBthickness 18 mm 25.5 mm 2.8± 0.1 mm 0.85 mm x 0.9 mm 1.27 mm 2 mm Shenzhen Ai-Thinker Technology Co., Ltd ±0.1mm http://www.ai-thinker.com ESP-32S User Manual 2.2 Pin Description ESP -32S has 39 pins. See pin definitions in Table 3. Table 3: ESP-32S Pin Definitions Name GND 3V3 EN SENSOR_VP SENSOR_VN IO34 IO35 No. Type IO32 I/O IO33 I/O IO25 IO26 IO27 10 11 12 I/O I/O I/O IO14 13 I/O IO12 14 I/O GND 15 IO13 16 I/O SHD/SD2* SWP/SD3* SCS/CMD* SCK/CLK* SDO/SD0* SDI/SD1* 17 18 19 20 21 22 I/O I/O I/O I/O I/O I/O IO 15 23 I/O IO 2 IO 0 24 25 I/O I/O IO 4 26 I/O IO 16 27 I/O Function Ground Power supply. Chip-enable signal. Active high. GPI036, SENS0R_VP, ADC_H, ADC1_CH0, RTC_GPI00 GPI039, SENS0R_VN, ADC1_CH3, ADC_H, RTC_GPI03 GPI034, ADC1_CH6, RTC_GPI04 GPI035, ADC1_CH7, RTC_GPI05 GPI032, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, T0UCH9, RTC_GPI09 GPI033, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, T0UCH8, RTC_GPI08 GPI025, DAC_1, ADC2_CH8, RTC_GPI06, EMAC_RXD0 GPI026, DAC_2, ADC2_CH9, RTC_GPI07, EMAC_RXD1 GPI027, ADC2_CH7, T0UCH7, RTC_GPI017, EMAC_RX_DV GPraM,ADC2_CH6, T0UCH6,MTMS, HSPHK, HS2_CLK, SD_CLK, EMAC_TXD2 GPI012, ADC2_CH5, T0UCH5, RTC_GPI015, MTDL HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3 Ground GPI013, ADC2_CH4, T0UCH4, RTC_GPI014, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD GPIO11, SD_CMD, SPICSO, HS1_CMD, U1RTS GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS GPIO15, ADC2_CH3, T0UCH3, MTD0, HSPICSO, RTC_GPI013, HS2_CMD, SD_CMD, EMAC_RXD3 GPIO2, ADC2_CH2, T0UCH2,HSPIWP, HS2_DATA0, SD_DATA0 GPIO0, ADC2_CH1, T0UCH1, CLK_0UT1, EMAC_TX_CLK GPIO4,ADC2_CH0,T0UCH0, RTC_GPI010, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_0UT IO 17 28 I/O GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_0UT_180 IO 5 29 I/O GPIO5, VSPICSO, HS1_DATA6, EMAC_RX_CLK IO18 30 I/O GPIO18, VSPHK,HS1_DATA7 IO19 31 I/O GPIO19, VSPIQ, UOCTS, EMAC—TXDO Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com ESP-32S User Manual Name NC IO21 RXD0 TXD0 IO22 IO23 GND GND No. 32 33 34 35 36 37 38 39 Type I/O I/O I/O I/O I/O Function GPIO21, VSPIHD, EMAC_TX_EN GPIO3, U0RXD, CLK_OUT2 GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 GPIO22, VSPIWP,U0RTS, EMAC_TXD1 GPIO23, VSPID, HS1_STROBE Ground Ground Note: * Pins SCK/CLK,SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connected to the integrated SPI flash integrated on ESP-32S and are not recommended for other uses. 2.3 Strapping Pins ESP32-D0WDQ6 has five strapping pins. Software can read the value of these five bits from the register ”GPIO_STRAPPING”. During the chip power-on reset, the latches of the strapping pins sample the voltage level as strapping bits of ”0” or ”1”,and hold these bits until the chip is powered down or shut down. Each strapping pin is connected with its internal pull-up/pull-down during the chip reset. Consequently, if a strap-ping pin is unconnected or the connected external circuit is high-impedance, the internal weak pull-up/pull-down will determine the default input level of the strapping pins. To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or apply the host MCU5s GPIOs to control the voltage level of these pins when powering ESP32 on. After reset, the strapping pins work as the normal functions pins. Refer to Table 4 for detailed boot modes of configuration by strapping pins. Table 4: Strapping Pins Voltage of Internal LDO (VDD_SDIO) Pin Default 3.3V MTDI Pull-down 0 Booting Mode Pin Default SPI Flash Boot GPIO0 Pull-up GPIO2 Pull-down Don’t-care Debugging Log on U0TXD During Booting Pin Default U0TXD Toggling MTDO Pull-up Timing of SDIO Slave Falling-edge Input Pin Default Falling-edge Output MTDO Pull-up GPIO5 Pull-up Shenzhen Ai-Thinker Technology Co., Ltd 1.8V Download Boot U0TXD Silent Falling-edge Input Rising-edge Output Rising-edge Input Falling-edge Output Rising-edge Input Rising-edge Output http://www.ai-thinker.com ESP-32S User Manual Note: Firmware can configure register bits to change the settings of ”Voltage of Internal LDO(VDD_SDIO)” and ”Timing of SDIO Slave” after booting. Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com ESP-32S User Manual 3. Functional Description This chapter describes the modules and functions integrated in ESP-32S. 3.1 CPU and Internal Memory ESP32-DOWDQ6 contains two low-power Xtensa® 32-bit LX6 microprocessors. The internal memory includes: • 448 KB of ROM for booting and core functions. • 520 KB of on-chip SRAM for data and instruction. • 8KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor during the Deep-sleep mode. • 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed by the main CPU during RTC Boot from the Deep-sleep mode. • 1 kbit of eFuse, of which 256 bits are used for the system (MAC address and chip configuration) and the remaining 768 bits are reserved for customer applications, including Flash-Encryption and Chip-ID. 3.2 External Flash and SRAM ESP32-DOWDQ6 supports up to four 16-MB external QSPI flash and SRAM with hardware encryption based on AES to protect developer’s programs and data. ESP32 can access the external QSPI flash and SRAM through high-speed caches. • Up to 16 MB of external flash are memory-mapped onto the CPU code space, supporting 8, 16 and 32-bit access. Code execution is supported. • Up to 8 MB of external flash/SRAM are memory-mapped onto the CPU data space, supporting 8, 16 and 32-bit access. Data-read is supported on the flash and SRAM. Data-write is supported on the SRAM. ESP-32S integrates 4 MB of external SPI flash. The 4-MB SPI flash can be memory-mapped onto the CPU code space, supporting 8, 16 and 32-bit access. Code execution is supported. The integrated SPI flash is connected to GPIO6, GPIO7, GPIO8, GPIO9, GPIO10 and GPIO11. These six pins cannot be used as regular GPIO. 3.3 Crystal Oscillators The frequencies of the main crystal oscillator supported include 40 MHz, 26 MHz and 24 MHz. The accuracy of crystal oscillators applied should be ±10PPM,and the operating temperature ranges from-40°C to 85°C. When using the downloading tools, remember to select the right crystal oscillator type. In circuit design, capacitors C1 and C2 that connect to the earth are added to the input and output terminals of the crystal oscillator, respectively. The values of the two capacitors can be flexible, ranging from 6 pF to 22 pF. However, the specific capacitive values of C1 and C2 depend on further tests and adjustments of the overall performance of the whole circuit. Normally, the capacitive values ofC1 and C2 are within 10 pF when the crystal oscillator frequency is 26 MHz, or 10 pF3 MHz F=F0->3 MHz Min 247 Typ +7.5 25 -14.6 -12.7 -44.3 -38.7 -49.2 -44.7 -50 -50 -0.92 -10 0.7 Max +10 265 Unit dBm dB dBm dBm dBm dBm dBm dBm dBm dBm kHz kHz kHz kHz/50 µs kHz 4.6 Reflow Profile Table 13: Reflow Profile Item Ts max to TL (Ramp-up Rate) Preheat Temperature Min. (Ts Min.) Temperature Typ. (Ts Typ.) Temperature Min. (Ts Max.) Time (Ts) Ramp-up rate (TL to Tp) Time maintained above: -Temperature (TL)/Time (TL) Peak temperature (Tp) Target peak temperature (Tp Target) Time within 5°C of actual peak (tp) Ts max to TL (Ramp-down Rate) Tune25°C to Peak Temperature (t) Shenzhen Ai-Thinker Technology Co., Ltd Value 3°C/second max 150°C 175°C 200°C 60 ~180 seconds 3°C/second max 217°C/60 ~150 seconds 260°C max, for 10 seconds 260°C +0/-5°C 20~40 seconds 6°C/second max 8 minutes max http://www.ai-thinker.com ESP-32S User Manual 5. Schematics Figure 3: ESP-32S Schematics Note: The capacitance of Gland C2 varies with the selection of the crystal. Shenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com
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