Ai Thinker Technology ESP32S Wi-Fi & Bluetooth Module User Manual ESP 32S

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Users Manual

ESP-32S User ManualESP-32S User ManualREV 1.02017.3

ESP-32S User ManualFCC STATEMENTThis device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:(1) This device may not cause harmful interference.(2) This device must accept any interference received, including interference that may cause undesiredoperation.Any changes or modifications not expressly approved by the party responsible for compliance could void theuser’s authority to operate the equipment.Please notice that if the FCC identification number is not visible when the module is installed inside anotherdevice, then the outside of the device into which the module is installed must also display a label referring tothe enclosed module. This exterior label can use wording such as the following: “Contains FCC ID:2AHMR-ESP32S” any similar wording that expresses the same meaning may be used.This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. Thisequipment should be installed and operated with a minimum distance of 20cmbetween the radiator & yourbody. This transmitter must not be co-located or operating in conjunction with any other antenna ortransmitter.The module is limited to OEM installation ONLY.The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove orinstall module.The module is limited to installation in mobile application;A separate approval is required for all other operating configurations, including portable configurations withrespect to Part 2.1093 and difference antenna configurations.There is requirement that the grantee provide guidance to the host manufacturer for compliance with Part15B requirements.Copyright © 2017 Ai-Thinker Technology Co., Ltd. All rights reserved.

ESP-32S User ManualShenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com1.PrefaceESP-32S is a powerful, generic Wi-Fi +BT+BLE MCU module that targets a wide variety of applications,ranging from low-power sensor networks to the most demanding tasks, such as voice encoding, musicstreaming and MP3 decoding.At the core of this module is the ESP32-D0WDQ6 chip*, which is designed to be scalable and adaptive. Thereare two CPU cores that can be individually controlled or powered, and the clock frequency is adjustable from80 MHz to 240 MHz . The user may also power off the CPU and make use of the low-power coprocessor toconstantly monitor the peripherals for changes or crossing of thresholds. ESP32 integrates a rich set ofperipherals, ranging from capacitive touch sensors, Hall sensors, low-noise sense amplifiers, SD cardinterface, Ethernet, high speed SDIO/SPI, UART, I2S and I2C.The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can betargeted, and that the module is future proof: using Wi-Fi allows a large physical range and direct connectionto the internet through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to thephone or broadcast low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5µA, making it suitable for battery powered and wearable electronics applications. ESP-32S supports datarates of up to 150 Mbps, and 22 dBm output power at the PA to ensure the widest physical range. As suchthe chip does offer industry-leading specifications and the best performance for electronic integration, range,power consumption, and connectivity.The operating system chosen for ESP32 is free RTOS with LWIP; TLS 1.2 with hardware acceleration is built inas well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that developers can continuallyupgrade their products even after their release.Table 1 provides the specifications of ESP-32S.Table 1: ESP-32S SpecificationsCategoriesItemsSpecificationsWi-FiStandardsFCC/CE/IC/TELEC/KCC/SRRC/NCCProtocols802.11 b/g/n/d/e/i/k/r (802.11n up to 150 Mbps)A-MPDU and A-MSDU aggregation and 0.4 µs guardinterval supportFrequency range2.4 〜2.5 GHzBluetoothProtocolsBluetooth v4.2 BR/EDR and BLE specificationRadioNZIF receiver with -98 dBm sensitivityClass-1, class-2 and class-3 transmitterAFHAudioCVSD and SBC

ESP-32S User ManualShenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.comCategoriesItemsSpecificationsHardwareModule interfaceSD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM,I2S, I2C, IRGPIO, capacitive touch sensor, ADC, DAC, LNA pre-amplierOn-chip sensorHall sensor, temperature sensorOn-board clock40 MHz crystalOperating voltage2.2 〜3.6VOperating currentAverage: 80 mAOperating temperature range-40°C ~ 85°C *Ambient temperature rangeNormal temperaturePackage size18 mm x 25.5 mm x 2.8 mmSoftwareWi-Fi modeStation/SoftAP/SoftAP+Station/P2PSecurityWPA/WPA2/WPA2-Enterprise/WPSEncryptionAES/RSA/ECC/SHAFirmware upgradeUART Download / OTA (via network) / download andwrite firmware via hostSoftware developmentSupports Cloud Server Development / SDK for customfirmware developmentNetwork protocolsIPv4, IPv6, SSL, TCP/UDP/HTTP/FTP/MQTTUser configurationAT instruction set, cloud server, Android/iOS app

ESP-32S User ManualShenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com2. Pin Definitions2.1 Pin LayoutFigure 1: Top and Side View of ESP-32STable 2: ESP-32S DimensionsLengthWidthHeightPAD size (bottom)Pin pitchShielding can heightPCBthickness18 mm25.5 mm2.8± 0.1 mm0.85 mm x 0.9 mm1.27 mm2 mm±0.1mm

ESP-32S User ManualShenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com2.2 Pin DescriptionESP -32S has 39 pins. See pin definitions in Table 3.Table 3: ESP-32S Pin DefinitionsNameNo.TypeFunctionGND1PGround3V32PPower supply.EN3IChip-enable signal. Active high.SENSOR_VP4IGPI036, SENS0R_VP, ADC_H, ADC1_CH0, RTC_GPI00SENSOR_VN5IGPI039, SENS0R_VN, ADC1_CH3, ADC_H, RTC_GPI03IO346IGPI034, ADC1_CH6, RTC_GPI04IO357IGPI035, ADC1_CH7, RTC_GPI05IO328I/OGPI032, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4，T0UCH9, RTC_GPI09IO339I/OGPI033, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5,T0UCH8, RTC_GPI08IO2510I/OGPI025, DAC_1, ADC2_CH8, RTC_GPI06, EMAC_RXD0IO2611I/OGPI026, DAC_2, ADC2_CH9, RTC_GPI07, EMAC_RXD1IO2712I/OGPI027, ADC2_CH7, T0UCH7, RTC_GPI017, EMAC_RX_DVIO1413I/OGPraM，ADC2_CH6, T0UCH6,MTMS, HSPHK，HS2_CLK, SD_CLK,EMAC_TXD2IO1214I/OGPI012, ADC2_CH5, T0UCH5, RTC_GPI015, MTDL HSPIQ, HS2_DATA2,SD_DATA2, EMAC_TXD3GND15PGroundIO1316I/OGPI013, ADC2_CH4, T0UCH4, RTC_GPI014, MTCK, HSPID, HS2_DATA3,SD_DATA3, EMAC_RX_ERSHD/SD2*17I/OGPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXDSWP/SD3*18I/OGPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXDSCS/CMD*19I/OGPIO11, SD_CMD, SPICSO, HS1_CMD, U1RTSSCK/CLK*20I/OGPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTSSDO/SD0*21I/OGPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTSSDI/SD1*22I/OGPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTSIO 1523I/OGPIO15, ADC2_CH3, T0UCH3, MTD0, HSPICSO, RTC_GPI013, HS2_CMD,SD_CMD, EMAC_RXD3IO 224I/OGPIO2, ADC2_CH2, T0UCH2,HSPIWP, HS2_DATA0, SD_DATA0IO 025I/OGPIO0, ADC2_CH1, T0UCH1, CLK_0UT1, EMAC_TX_CLKIO 426I/OGPIO4,ADC2_CH0,T0UCH0, RTC_GPI010, HSPIHD, HS2_DATA1,SD_DATA1, EMAC_TX_ERIO 1627I/OGPIO16, HS1_DATA4, U2RXD, EMAC_CLK_0UTIO 1728I/OGPIO17, HS1_DATA5, U2TXD, EMAC_CLK_0UT_180IO 529I/OGPIO5, VSPICSO, HS1_DATA6, EMAC_RX_CLKIO1830I/OGPIO18, VSPHK，HS1_DATA7IO1931I/OGPIO19, VSPIQ, UOCTS, EMAC—TXDO

ESP-32S User ManualShenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.comNameNo.TypeFunctionNC32--IO2133I/OGPIO21, VSPIHD, EMAC_TX_ENRXD034I/OGPIO3, U0RXD, CLK_OUT2TXD035I/OGPIO1, U0TXD, CLK_OUT3, EMAC_RXD2IO2236I/OGPIO22, VSPIWP，U0RTS, EMAC_TXD1IO2337I/OGPIO23, VSPID, HS1_STROBEGND38PGroundGND39PGround2.3 Strapping PinsESP32-D0WDQ6 has five strapping pins. Software can read the value of these five bits from the register”GPIO_STRAPPING”. During the chip power-on reset, the latches of the strapping pins sample the voltagelevel as strapping bits of ”0” or ”1”，and hold these bits until the chip is powered down or shut down.Each strapping pin is connected with its internal pull-up/pull-down during the chip reset. Consequently, if astrap-ping pin is unconnected or the connected external circuit is high-impedance, the internal weakpull-up/pull-down will determine the default input level of the strapping pins.To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or apply thehost MCU5s GPIOs to control the voltage level of these pins when powering ESP32 on.After reset, the strapping pins work as the normal functions pins.Refer to Table 4 for detailed boot modes of configuration by strapping pins.Table 4: Strapping PinsVoltage of Internal LDO (VDD_SDIO)PinDefault3.3V1.8VMTDIPull-down01Booting ModePinDefaultSPI Flash BootDownload BootGPIO0Pull-up10GPIO2Pull-downDon’t-care0Debugging Log on U0TXD During BootingPinDefaultU0TXD TogglingU0TXD SilentMTDOPull-up10Timing of SDIO SlavePinDefaultFalling-edge InputFalling-edge OutputFalling-edge InputRising-edge OutputRising-edge InputFalling-edge OutputRising-edge InputRising-edge OutputMTDOPull-up0011GPIO5Pull-up0101Note:* Pins SCK/CLK，SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 areconnected to the integrated SPI flash integrated on ESP-32S and are not recommended for other uses.

ESP-32S User ManualShenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.comNote:Firmware can configure register bits to change the settings of ”Voltage of Internal LDO(VDD_SDIO)”and ”Timing of SDIO Slave” after booting.

ESP-32S User ManualShenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com3. Functional DescriptionThis chapter describes the modules and functions integrated in ESP-32S.3.1 CPU and Internal MemoryESP32-DOWDQ6 contains two low-power Xtensa® 32-bit LX6 microprocessors. The internal memoryincludes:•448 KB of ROM for booting and core functions.•520 KB of on-chip SRAM for data and instruction.•8KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor duringthe Deep-sleep mode.•8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessedby the main CPU during RTC Boot from the Deep-sleep mode.•1 kbit of eFuse, of which 256 bits are used for the system (MAC address and chip configuration) and theremaining 768 bits are reserved for customer applications, including Flash-Encryption and Chip-ID.3.2 External Flash and SRAMESP32-DOWDQ6 supports up to four 16-MB external QSPI flash and SRAM with hardware encryption basedon AES to protect developer’s programs and data.ESP32 can access the external QSPI flash and SRAM through high-speed caches.•Up to 16 MB of external flash are memory-mapped onto the CPU code space, supporting 8, 16 and32-bit access. Code execution is supported.•Up to 8 MB of external flash/SRAM are memory-mapped onto the CPU data space, supporting 8, 16 and32-bit access. Data-read is supported on the flash and SRAM. Data-write is supported on the SRAM.ESP-32S integrates 4 MB of external SPI flash. The 4-MB SPI flash can be memory-mapped onto the CPU codespace, supporting 8, 16 and 32-bit access. Code execution is supported. The integrated SPI flash is connectedto GPIO6, GPIO7, GPIO8, GPIO9, GPIO10 and GPIO11. These six pins cannot be used as regular GPIO.3.3 Crystal OscillatorsThe frequencies of the main crystal oscillator supported include 40 MHz, 26 MHz and 24 MHz. The accuracyof crystal oscillators applied should be ±10PPM,and the operating temperature ranges from-40°C to 85°C.When using the downloading tools, remember to select the right crystal oscillator type. In circuit design,capacitors C1 and C2 that connect to the earth are added to the input and output terminals of the crystaloscillator, respectively. The values of the two capacitors can be flexible, ranging from 6 pF to 22 pF. However,the specific capacitive values of C1 and C2 depend on further tests and adjustments of the overallperformance of the whole circuit. Normally, the capacitive values ofC1 and C2 are within 10 pF when thecrystal oscillator frequency is 26 MHz, or 10 pF<C1 and C2<22 pF when the crystal oscillator frequency is 40MHz.The frequency of the RTC crystal oscillator is typically 32 kHz or 32.768 kHz. The accuracy can be out of therange of ±20 PPM, when the internal calibration is applied to correct the frequency offset. When the chip

ESP-32S User ManualShenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.comoperates in low-power modes, the application chooses the external low-speed (32 kHz) crystal clock, ratherthan the internal RC oscillators, to achieve the accurate wakeup time.3.4 Power ConsumptionWith the advanced power management technology, ESP32-D0WDQ6 can switch between different powermodes as follows:•Power mode- Active mode: chip radio is powered on. The chip can receive, transmit, or listen.- Modem-sleep mode: the CPU is operational and the clock is configurable. Wi-Fi / Bluetoothbaseband and radio are disabled.- Light-sleep mode: the CPU is paused. The RTC and ULP-coprocessor are running. Any wake-upevents (MAC, host, RTC timer, or external interrupts) will wake up the chip.- Deep-sleep mode: Only RTC is powered on. Wi-Fi and Bluetooth connection data are stored in RTCmemory. The ULP-coprocessor can work.- Hibernation mode: The internal 8MHz oscillator and ULP-coprocessor are disabled. The RTCrecovery memory is powered down. Only one RTC timer on the slow clock and some RTC GPIOs areactive. The RTC timer or the RTC GPIOs can wake up the chip from the Hibernation mode.•Sleep Pattern- Association sleep pattern: The power mode switches between the active mode andModem-sleep/Light- sleep mode during this sleep pattern. The CPU, Wi-Fi, Bluetooth, and radiowake up at pre-determined intervals to keep Wi-Fi / BT connections on.- ULP sensor-monitored pattern: The main CPU is in the Deep-sleep mode. The ULP co-processor doessensor measurements and wakes up the main system, based on the measured data from sensors.The power consumption varies with different power modes/sleep patterns, and work status, of functionalmodules (see Table 5).Table 5: Power Consumption by Power ModesPower modeCommentPower consumptionActive mode (RF working)Wi-Fi Tx packet 13 dBm ~ 21 dBm160 〜260 mAWi-Fi / BT Tx packet 0 dBm120mAWi-Fi / BT Rx and listening80 〜90 mAAssociation sleep pattern (by Light-0.9 mA@DTIM3, 1.2 mA@DTIM1Modem-sleep modeThe CPU is powered on.Max speed: 20 mANormal: 5 〜10 mASlow speed: 3 mALight-sleep mode-0.8 mADeep-sleep modeThe ULP-coprocessor is powered on.0.15 mAULP sensor-monitored pattern25 µA@1% dutyRTC timer + RTC memories20 µAHibernation modeRTC timer only5µA

ESP-32S User ManualShenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com3.5 Peripherals and Sensors3.5.1 Peripherals and Sensors DescriptionTable 6: Peripherals and Sensors DescriptionInterfaceSignalPinFunctionADC1_CH0SENSOR_VPADC1_CH3SENSOR_VNADC1_CH4IO32ADC1_CH5IO33ADC1_CH6IO34ADC1_CH7IO35ADC2_CH0IO4ADCADC2_CH1IO0Two 12-bit SAR ADCsADC2_CH2IO2ADC2_CH3IO15ADC2_CH4IO13ADC2_CH5IO12ADC2_CH6IO14ADC2_CH7IO27ADC2_CH8IO25ADC2_CH9IO26Ultra Low NoiseSENSOR_VPIO36Provides about 60dB gain by using largerAnalog Pre-AmplifierSENSOR_VNIO39capacitors on PCBDACDAC_1IO25Two 8-bit DACsDAC_2IO26TOUCH0IO4TOUCH1IO0TOUCH2IO2TOUCH3IO15Touch SensorTOUCH4IO13Capacitive touch sensorsTOUCH5IO12TOUCH6IO14TOUCH7IO27TOUCH8IO33TOUCH9IO32

ESP-32S User ManualShenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.comInterfaceSignalPinFunctionSD/SDIO/MMC HostHS2_CLKMTMSSupports SD memory card V3.01 standardHS2_CMDMTDOHS2_DATA0IO2HS2_DATA1IO4HS2_DATA2MTDIHS2_DATA3MTCKMotor PWMPWMO_OUTO~2Any GPIOs*Three channels of 16-bit timers generatePWM1_OUT_INO~2PWM0_FLT_IN0~2PWM1_FLT_IN0~2PWM0_CAP_IN0~2PWM1_CAP_IN0~2PWM0_SYNC」N0~2PWM1_SYNC」N0~2LED PWMledc_hs_sig_out0~7Any GPIOs*16 independent channels @80MHzIedc_Is_sig_out0~7UARTU0RXD_inAny GPIOs*Two UART devices with hardwareU0CTS_inU0DSR_inU0TXD_outU0RTS_outU0DTR_outU1RXD_inU1CTS_inU1TXD_outU1RTS_outU2RXD_inU2CTS_inU2TXD_outU2RTS_outI2CI2CEXT0_SCL_inAny GPIOs*Two I2C devices in slave or master modesI2CEXT0_SDA_inI2CEXT1_SCL_inI2CEXT1_SDA_inI2CEXT0_SCL_outI2CEXT0_SDA_outI2CEXT1_SCL_outI2CEXT1_SDA_out

ESP-32S User ManualShenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.comInterfaceSignalPinFunctionI2SI2S0l_DATA_in0~15I2SOO_BCK_inI2S0O_WS_inI2S0I_BCK_inI2S0I_WS_inI2S0I_H_SYNCI2S0I_V_SYNCI2S0I_H_ENABLEI2S0O_BCK_outI2S0O_WS_outI2S0I_BCK_outI2S0I_WS_outI2S0O_DATA_out0~23I2S1l_DATA_inO~15I2S1O_BCK_inI2S1O_WS_inI2S1I_BCK_inI2S1LWS_inI2S1LH_SYNCI2S1I_V_SYNCI2S1I_H_ENABLEI2S1O_BCK_outI2S1O_WS_outI2S1l_BCK_outI2S1l_WS_outI2S1O_DATA_outO~23Any GPIOs*Stereo input and output from/to the audiocodec, and parallel LCD data outputRemote ControllerRMT_SIG_IN0~7RMT_SIG_OUTO~7Any GPIOs*Eight channels of IR transmitter andreceiver for various waveforms

ESP-32S User ManualShenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.comInterfaceSignalPinFunctionSPIHDSHD/SD2SPIWPSWP/SD3SPICS0SCS/CMDSPICLKSCK/CLKSPIQSDO/SD0SPIDSDI/SD1HSPICLKIO14HSPICS0IO15Supports Standard SPI, Dual SPI, andParallel QSPIHSPIQIO12Quad SPI that can be connected to theHSPIDIO13external flash and SRAMHSPIHDIO4HSPIWPIO2VSPICLKIO18VSPICS0IO5VSPIQIO19VSPIDIO23VSPIHDIO21VSPIWPIO22HSPIQ_in/_outStandard SPI consists of clock,HSPID_in/_outchip-select, MOSI and MISO. These SPIsHSPICLK_in/_outcan be connected to LCD and otherHSPI_CS0_in/_outexternal devices. They support theHSPI_CS1_outfollowing features:General PurposeHSPI_CS2_outAny GPIOs*• both master and slave modes;SPIVSPIQ_in/_out• 4 sub-modes of the SPI formatVSPID_in/_outtransfer that depend on the clockVSPICLK_in/_outphase (CPHA) and clock polarity(CPOL) control;• CLK frequencies by a divider;• up to 64 bytes of FIFO and DMA.VSPI_CS0_in/_outVSPI_CS1_outVSPI_CS2_outMTDIIO12JTAGMTCKIO13JTAG for software debuggingMTMSIO14MTDOIO15

ESP-32S User ManualShenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.comInterfaceSignalPinFunctionSD_CLKIO6SDIO interface that conforms to theindustry standard SDIO 2.0 cardspecification. On ESP -32S these pins areconnected to the integrated SPI flash.SD_CMDIO11SDIO SlaveSD_DATA0IO7SD_DATA1IO8SD_DATA2IO9SD_DATA3IO10EMAC_TX_CLKIO0EMAC_RX_CLKIO5EMAC_TX_ENIO21EMAC—TXDOIO19EMAC—TXD1IO22EMAC—TXD2IO14EMAC—TXD3IO12EMAC_RX_ERIO13EMAC_RX_DVIO27EMACEMAC_RXD0IO25Ethernet MAC with MII/RMII interfaceEMAC_RXD1IO26EMAC_RXD2TXDEMAC_RXD3IO15EMAC_CLK_OUTIO16EMAC_CLK_OUT_180IO17EMAC_TX_ERIO4EMAC_MDC_outAny GPIOs*EMAC_MDI_inAny GPIOs*EMAC_MDO_outAny GPIOs*EMAC_CRS_outAny GPIOs*EMAC_COL_outAny GPIOs*Note:•Functions of Motor PWM,LEDPWM,UART,l2C,l2S,general purpose SPI and Remote Controller can beconfigured to any GPIO except GPIO6,GPIO7,GPIO8,GPIO9,GPIO10 and GPIO11.•In Table6, for the items marked with ”Any GPIOs*” in the ”Pin” column, users should note thatGPIO6, GPIO7, GPIO8, GPIO9, GPIO10 and GPIO11 are connected to the integrated SPI flash ofESP-32S and are not recommended for other uses.

ESP-32S User ManualShenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com3.5.2 Peripheral SchematicsFigure 2: ESP-32S Peripheral SchematicsNote:The MTDI should be kept at low electric level.

ESP-32S User ManualShenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com4. Electrical Characteristics4.1 Absolute Maximum RatingsTable 7: Absolute Maximum RatingsRatingConditionValueUnitStorage temperature--40 ~ 85°CMaximum soldering temperature-260°CSupply voltageIPC/JEDEC J-STD-020+2.2 〜+3.6V4.2 Recommended Operating ConditionsTable 8: Recommended Operating ConditionsOperating conditionSymbolMinTypMaxUnitOperating temperature--402085°CSupply voltageVDD2.23.33.6VOperating currentIVDD0.5--A4.3 Digital Terminal CharacteristicsTable 9: Digital Terminal CharacteristicsTerminalsSymbolMinTypMaxUnitInput logic level lowVIL-0.3-0.25VDDVInput logic level highVIH0.75VDD-VDD+0.3VOutput logic level lowVOLN-0.1VDDVOutput logic level highVOH0.8VDD-NVNote:The specifications in this chapter have been tested under the following generalcondition: Vbat =3.3V’Ta=27°C，unless otherwise specified.

ESP-32S User ManualShenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com4.4 Wi-Fi RadioTable 10: Wi-Fi Radio CharacteristicsDescriptionMinTypMaxUnitGeneral CharacteristicsInput frequency2412-2484MHzInput impedance-50-QInput reflection---10dBOutput power of PA15.519.521.5dBmSensitivityDSSS, 1 Mbps--98-dBmCCK, 11 Mbps--90-dBmOFDM, 6 Mbps--93-dBmOFDM, 54 Mbps--75-dBmHT20, MCS0--93-dBmHT20, MCS7--73-dBmHT40, MCS0--90-dBmHT40, MCS7--70-dBmMCS32--91-dBmAdjacent Channel RejectionOFDM, 6 Mbps-37-dBOFDM, 54 Mbps-21-dBHT20, MCS0-37-dBHT20, MCS7-20-dB4.5 Bluetooth LE Radio4.5.1 ReceiverTable 11: Receiver Characteristics - BLEParameterConditionsMinTypMaxUnitSensitivity @0.1% BER---98-dBmMaximum received signal @0.1% BER-0--dBmCo-channel C/I--+10-dBF = F0+1 MHz--5-dBF = F0-1 MHz--5-dBAdjacent channel selectivity C/IF = F0 + 2 MHz--2 5-dBF = F0-2 MHz-- 35-dBF = F0 + 3 MHz--25-dBF = F0-3 MHz--45-dB30 MHz - 2000 MHz-10--dBmOut-of-band blocking performance2000 MHz - 2400 MHz-27--dBm2500 MHz - 3000 MHz-27--dBm3000 MHz-12.5GHz-10--dBmIntermodulation--36--dBm

ESP-32S User ManualShenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com4.5.2 TransmitTable 12: Transmit Characteristics – BLEParameterConditionsMinTypMaxUnitRF transmit power--+7.5+10dBmRF power control range--25-dBAdjacent channel transmit powerF=F0+1 MHz--14.6-dBmF=F0-1 MHz--12.7-dBmF=F0 + 2 MHz--44.3-dBmF=F0-2 MHz--38.7-dBmF=F0 + 3 MHz--49.2-dBmF=F0-3 MHz--44.7-dBmF=F0+>3 MHz--50-dBmF=F0->3 MHz--50-dBm△f1avg---265kHzA f2-247--kHz△f2avg/△f1avg---0.92--ICFT---10-kHzDrift rate--0.7-kHz/50 µsDrift--2-kHz4.6 Reflow ProfileTable 13: Reflow ProfileItemValueTs max to TL (Ramp-up Rate)3°C/second maxPreheatTemperature Min. (Ts Min.)Temperature Typ. (Ts Typ.)Temperature Min. (Ts Max.)Time (Ts)150°C175°C200°C60 ~180 secondsRamp-up rate (TL to Tp)3°C/second maxTime maintained above: -Temperature (TL)/Time (TL)217°C/60 ~150 secondsPeak temperature (Tp)260°C max, for 10 secondsTarget peak temperature (Tp Target)260°C +0/-5°CTime within 5°C of actual peak (tp)20~40 secondsTs max to TL(Ramp-down Rate)6°C/second maxTune25°C to Peak Temperature (t)8 minutes max

ESP-32S User ManualShenzhen Ai-Thinker Technology Co., Ltd http://www.ai-thinker.com5. SchematicsFigure 3: ESP-32S SchematicsNote:The capacitance of Gland C2 varies with the selection of the crystal.

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