Ai Thinker Technology ESP32S Wi-Fi & Bluetooth Module User Manual ESP 32S

Shenzhen Ai-Thinker Technology co., LTD Wi-Fi & Bluetooth Module ESP 32S

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Users Manual

Download: Ai Thinker Technology ESP32S Wi-Fi & Bluetooth Module User Manual ESP 32S
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Document ID3390377
Application IDO2Tv2e2Xyyg121d/GQ2oZA==
Document DescriptionUsers Manual
Short Term ConfidentialNo
Permanent ConfidentialNo
SupercedeNo
Document TypeUser Manual
Display FormatAdobe Acrobat PDF - pdf
Filesize42.25kB (528083 bits)
Date Submitted2017-05-15 00:00:00
Date Available2017-05-23 00:00:00
Creation Date2017-05-09 11:48:46
Document Lastmod2017-05-09 11:48:46
Document TitleESP-32S User Manual
Document CreatorWPS Office 个人版
Document Author: Ai-Thinker

ESP-32S User Manual
ESP-32S User Manual
REV 1.0
2017.3
ESP-32S User Manual
FCC STATEMENT
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause undesired
operation.
Any changes or modifications not expressly approved by the party responsible for compliance could void the
user’s authority to operate the equipment.
Please notice that if the FCC identification number is not visible when the module is installed inside another
device, then the outside of the device into which the module is installed must also display a label referring to
the enclosed module. This exterior label can use wording such as the following: “Contains FCC ID:
2AHMR-ESP32S” any similar wording that expresses the same meaning may be used.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with a minimum distance of 20cmbetween the radiator & your
body. This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
The module is limited to OEM installation ONLY.
The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or
install module.
The module is limited to installation in mobile application;
A separate approval is required for all other operating configurations, including portable configurations with
respect to Part 2.1093 and difference antenna configurations.
There is requirement that the grantee provide guidance to the host manufacturer for compliance with Part
15B requirements.
Copyright © 2017 Ai-Thinker Technology Co., Ltd. All rights reserved.
ESP-32S User Manual
Contents
1.Preface................................................................................................................................................ 1
2. Pin Definitions....................................................................................................................................3
2.1 Pin Layout.................................................................................................................................3
2.2 Pin Description......................................................................................................................... 4
2.3 Strapping Pins...........................................................................................................................5
3. Functional Description.......................................................................................................................7
3.1 CPU and Internal Memory........................................................................................................7
3.2 External Flash and SRAM..........................................................................................................7
3.3 Crystal Oscillators.....................................................................................................................7
3.4 Power Consumption.................................................................................................................8
3.5 Peripherals and Sensors........................................................................................................... 9
3.5.1 Peripherals and Sensors Description.............................................................................9
3.5.2 Peripheral Schematics.................................................................................................14
4. Electrical Characteristics..................................................................................................................15
4.1 Absolute Maximum Ratings................................................................................................... 15
4.2 Recommended Operating Conditions....................................................................................15
4.3 Digital Terminal Characteristics............................................................................................. 15
4.4 Wi-Fi Radio............................................................................................................................. 16
4.5 Bluetooth LE Radio................................................................................................................. 16
4.5.1 Receiver.......................................................................................................................16
4.5.2 Transmit...................................................................................................................... 17
4.6 Reflow Profile......................................................................................................................... 17
5. Schematics....................................................................................................................................... 18
ESP-32S User Manual
1.Preface
ESP-32S is a powerful, generic Wi-Fi +BT+BLE MCU module that targets a wide variety of applications,
ranging from low-power sensor networks to the most demanding tasks, such as voice encoding, music
streaming and MP3 decoding.
At the core of this module is the ESP32-D0WDQ6 chip*, which is designed to be scalable and adaptive. There
are two CPU cores that can be individually controlled or powered, and the clock frequency is adjustable from
80 MHz to 240 MHz . The user may also power off the CPU and make use of the low-power coprocessor to
constantly monitor the peripherals for changes or crossing of thresholds. ESP32 integrates a rich set of
peripherals, ranging from capacitive touch sensors, Hall sensors, low-noise sense amplifiers, SD card
interface, Ethernet, high speed SDIO/SPI, UART, I2S and I2C.
The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be
targeted, and that the module is future proof: using Wi-Fi allows a large physical range and direct connection
to the internet through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the
phone or broadcast low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5
µA, making it suitable for battery powered and wearable electronics applications. ESP-32S supports data
rates of up to 150 Mbps, and 22 dBm output power at the PA to ensure the widest physical range. As such
the chip does offer industry-leading specifications and the best performance for electronic integration, range,
power consumption, and connectivity.
The operating system chosen for ESP32 is free RTOS with LWIP; TLS 1.2 with hardware acceleration is built in
as well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that developers can continually
upgrade their products even after their release.
Table 1 provides the specifications of ESP-32S.
Table 1: ESP-32S Specifications
Categories
Wi-Fi
Items
Specifications
Standards
FCC/CE/IC/TELEC/KCC/SRRC/NCC
802.11 b/g/n/d/e/i/k/r (802.11n up to 150 Mbps)
A-MPDU and A-MSDU aggregation and 0.4 µs guard
interval support
2.4 〜2.5 GHz
Protocols
Frequency range
Protocols
Bluetooth
Radio
Audio
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Bluetooth v4.2 BR/EDR and BLE specification
NZIF receiver with -98 dBm sensitivity
Class-1, class-2 and class-3 transmitter
AFH
CVSD and SBC
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ESP-32S User Manual
Categories
Items
Module interface
Hardware
Software
On-chip sensor
On-board clock
Operating voltage
Operating current
Operating temperature range
Ambient temperature range
Package size
Wi-Fi mode
Security
Encryption
Firmware upgrade
Software development
Network protocols
User configuration
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Specifications
SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM,
I2S, I2C, IR
GPIO, capacitive touch sensor, ADC, DAC, LNA preamplier
Hall sensor, temperature sensor
40 MHz crystal
2.2 〜3.6V
Average: 80 mA
-40°C ~ 85°C *
Normal temperature
18 mm x 25.5 mm x 2.8 mm
Station/SoftAP/SoftAP+Station/P2P
WPA/WPA2/WPA2-Enterprise/WPS
AES/RSA/ECC/SHA
UART Download / OTA (via network) / download and
write firmware via host
Supports Cloud Server Development / SDK for custom
firmware development
IPv4, IPv6, SSL, TCP/UDP/HTTP/FTP/MQTT
AT instruction set, cloud server, Android/iOS app
http://www.ai-thinker.com
ESP-32S User Manual
2. Pin Definitions
2.1 Pin Layout
Figure 1: Top and Side View of ESP-32S
Table 2: ESP-32S Dimensions
Length
Width
Height
PAD size (bottom)
Pin pitch
Shielding can height PCBthickness
18 mm
25.5 mm 2.8± 0.1 mm 0.85 mm x 0.9 mm
1.27 mm
2 mm
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±0.1mm
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ESP-32S User Manual
2.2 Pin Description
ESP -32S has 39 pins. See pin definitions in Table 3.
Table 3: ESP-32S Pin Definitions
Name
GND
3V3
EN
SENSOR_VP
SENSOR_VN
IO34
IO35
No.
Type
IO32
I/O
IO33
I/O
IO25
IO26
IO27
10
11
12
I/O
I/O
I/O
IO14
13
I/O
IO12
14
I/O
GND
15
IO13
16
I/O
SHD/SD2*
SWP/SD3*
SCS/CMD*
SCK/CLK*
SDO/SD0*
SDI/SD1*
17
18
19
20
21
22
I/O
I/O
I/O
I/O
I/O
I/O
IO 15
23
I/O
IO 2
IO 0
24
25
I/O
I/O
IO 4
26
I/O
IO 16
27
I/O
Function
Ground
Power supply.
Chip-enable signal. Active high.
GPI036, SENS0R_VP, ADC_H, ADC1_CH0, RTC_GPI00
GPI039, SENS0R_VN, ADC1_CH3, ADC_H, RTC_GPI03
GPI034, ADC1_CH6, RTC_GPI04
GPI035, ADC1_CH7, RTC_GPI05
GPI032, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
T0UCH9, RTC_GPI09
GPI033, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5,
T0UCH8, RTC_GPI08
GPI025, DAC_1, ADC2_CH8, RTC_GPI06, EMAC_RXD0
GPI026, DAC_2, ADC2_CH9, RTC_GPI07, EMAC_RXD1
GPI027, ADC2_CH7, T0UCH7, RTC_GPI017, EMAC_RX_DV
GPraM,ADC2_CH6, T0UCH6,MTMS, HSPHK, HS2_CLK, SD_CLK,
EMAC_TXD2
GPI012, ADC2_CH5, T0UCH5, RTC_GPI015, MTDL HSPIQ, HS2_DATA2,
SD_DATA2, EMAC_TXD3
Ground
GPI013, ADC2_CH4, T0UCH4, RTC_GPI014, MTCK, HSPID, HS2_DATA3,
SD_DATA3, EMAC_RX_ER
GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD
GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD
GPIO11, SD_CMD, SPICSO, HS1_CMD, U1RTS
GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS
GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS
GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS
GPIO15, ADC2_CH3, T0UCH3, MTD0, HSPICSO, RTC_GPI013, HS2_CMD,
SD_CMD, EMAC_RXD3
GPIO2, ADC2_CH2, T0UCH2,HSPIWP, HS2_DATA0, SD_DATA0
GPIO0, ADC2_CH1, T0UCH1, CLK_0UT1, EMAC_TX_CLK
GPIO4,ADC2_CH0,T0UCH0, RTC_GPI010, HSPIHD, HS2_DATA1,
SD_DATA1, EMAC_TX_ER
GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_0UT
IO 17
28
I/O
GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_0UT_180
IO 5
29
I/O
GPIO5, VSPICSO, HS1_DATA6, EMAC_RX_CLK
IO18
30
I/O
GPIO18, VSPHK,HS1_DATA7
IO19
31
I/O
GPIO19, VSPIQ, UOCTS, EMAC—TXDO
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ESP-32S User Manual
Name
NC
IO21
RXD0
TXD0
IO22
IO23
GND
GND
No.
32
33
34
35
36
37
38
39
Type
I/O
I/O
I/O
I/O
I/O
Function
GPIO21, VSPIHD, EMAC_TX_EN
GPIO3, U0RXD, CLK_OUT2
GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
GPIO22, VSPIWP,U0RTS, EMAC_TXD1
GPIO23, VSPID, HS1_STROBE
Ground
Ground
Note:
* Pins SCK/CLK,SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are
connected to the integrated SPI flash integrated on ESP-32S and are not recommended for other uses.
2.3 Strapping Pins
ESP32-D0WDQ6 has five strapping pins. Software can read the value of these five bits from the register
”GPIO_STRAPPING”. During the chip power-on reset, the latches of the strapping pins sample the voltage
level as strapping bits of ”0” or ”1”,and hold these bits until the chip is powered down or shut down.
Each strapping pin is connected with its internal pull-up/pull-down during the chip reset. Consequently, if a
strap-ping pin is unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of the strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or apply the
host MCU5s GPIOs to control the voltage level of these pins when powering ESP32 on.
After reset, the strapping pins work as the normal functions pins.
Refer to Table 4 for detailed boot modes of configuration by strapping pins.
Table 4: Strapping Pins
Voltage of Internal LDO (VDD_SDIO)
Pin
Default
3.3V
MTDI
Pull-down 0
Booting Mode
Pin
Default
SPI Flash Boot
GPIO0
Pull-up
GPIO2
Pull-down Don’t-care
Debugging Log on U0TXD During Booting
Pin
Default
U0TXD Toggling
MTDO
Pull-up
Timing of SDIO Slave
Falling-edge Input
Pin
Default
Falling-edge Output
MTDO
Pull-up
GPIO5
Pull-up
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1.8V
Download Boot
U0TXD Silent
Falling-edge Input
Rising-edge Output
Rising-edge Input
Falling-edge Output
Rising-edge Input
Rising-edge Output
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ESP-32S User Manual
Note:
Firmware can configure register bits to change the settings of ”Voltage of Internal LDO(VDD_SDIO)”
and ”Timing of SDIO Slave” after booting.
Shenzhen Ai-Thinker Technology Co., Ltd
http://www.ai-thinker.com
ESP-32S User Manual
3. Functional Description
This chapter describes the modules and functions integrated in ESP-32S.
3.1 CPU and Internal Memory
ESP32-DOWDQ6 contains two low-power Xtensa® 32-bit LX6 microprocessors. The internal memory
includes:
• 448 KB of ROM for booting and core functions.
• 520 KB of on-chip SRAM for data and instruction.
• 8KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor during
the Deep-sleep mode.
• 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed
by the main CPU during RTC Boot from the Deep-sleep mode.
• 1 kbit of eFuse, of which 256 bits are used for the system (MAC address and chip configuration) and the
remaining 768 bits are reserved for customer applications, including Flash-Encryption and Chip-ID.
3.2 External Flash and SRAM
ESP32-DOWDQ6 supports up to four 16-MB external QSPI flash and SRAM with hardware encryption based
on AES to protect developer’s programs and data.
ESP32 can access the external QSPI flash and SRAM through high-speed caches.
• Up to 16 MB of external flash are memory-mapped onto the CPU code space, supporting 8, 16 and
32-bit access. Code execution is supported.
• Up to 8 MB of external flash/SRAM are memory-mapped onto the CPU data space, supporting 8, 16 and
32-bit access. Data-read is supported on the flash and SRAM. Data-write is supported on the SRAM.
ESP-32S integrates 4 MB of external SPI flash. The 4-MB SPI flash can be memory-mapped onto the CPU code
space, supporting 8, 16 and 32-bit access. Code execution is supported. The integrated SPI flash is connected
to GPIO6, GPIO7, GPIO8, GPIO9, GPIO10 and GPIO11. These six pins cannot be used as regular GPIO.
3.3 Crystal Oscillators
The frequencies of the main crystal oscillator supported include 40 MHz, 26 MHz and 24 MHz. The accuracy
of crystal oscillators applied should be ±10PPM,and the operating temperature ranges from-40°C to 85°C.
When using the downloading tools, remember to select the right crystal oscillator type. In circuit design,
capacitors C1 and C2 that connect to the earth are added to the input and output terminals of the crystal
oscillator, respectively. The values of the two capacitors can be flexible, ranging from 6 pF to 22 pF. However,
the specific capacitive values of C1 and C2 depend on further tests and adjustments of the overall
performance of the whole circuit. Normally, the capacitive values ofC1 and C2 are within 10 pF when the
crystal oscillator frequency is 26 MHz, or 10 pF3 MHz
F=F0->3 MHz
Min
247
Typ
+7.5
25
-14.6
-12.7
-44.3
-38.7
-49.2
-44.7
-50
-50
-0.92
-10
0.7
Max
+10
265
Unit
dBm
dB
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
kHz
kHz
kHz
kHz/50 µs
kHz
4.6 Reflow Profile
Table 13: Reflow Profile
Item
Ts max to TL (Ramp-up Rate)
Preheat
Temperature Min. (Ts Min.)
Temperature Typ. (Ts Typ.)
Temperature Min. (Ts Max.)
Time (Ts)
Ramp-up rate (TL to Tp)
Time maintained above: -Temperature (TL)/Time (TL)
Peak temperature (Tp)
Target peak temperature (Tp Target)
Time within 5°C of actual peak (tp)
Ts max to TL (Ramp-down Rate)
Tune25°C to Peak Temperature (t)
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Value
3°C/second max
150°C
175°C
200°C
60 ~180 seconds
3°C/second max
217°C/60 ~150 seconds
260°C max, for 10 seconds
260°C +0/-5°C
20~40 seconds
6°C/second max
8 minutes max
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ESP-32S User Manual
5. Schematics
Figure 3: ESP-32S Schematics
Note:
The capacitance of Gland C2 varies with the selection of the crystal.
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http://www.ai-thinker.com

Source Exif Data:
File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.7
Linearized                      : No
Page Count                      : 21
Create Date                     : 2017:05:09 11:48:46+00:00
Modify Date                     : 2017:05:09 11:48:46+00:00
Title                           : ESP-32S User Manual
Author                          : Ai-Thinker
Creator                         : WPS Office 个人版
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FCC ID Filing: 2AHMR-ESP32S

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