Anaren A10091602 Radio Transceiver Module User Manual

Anaren, Inc. Radio Transceiver Module

User Manual

Anaren Integrated Radio A1101L09x User’s Manual Release Date 11/01/11
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iii USERS MANUAL Models A1101L09A and A1101L09C Contents 1. Overview .......................................................................................................................................................... 5 1.1. A1101L09A ................................................................................................................................................. 5 1.2. A1101L09C ................................................................................................................................................. 5 1.3. Features....................................................................................................................................................... 6 1.4. Theory of Operation.................................................................................................................................. 6 1.4.1. Typical Flow ........................................................................................................................................ 9 1.5. Applications ............................................................................................................................................. 11 2. Product Approvals ........................................................................................................................................ 12 2.1. USA (Federal Communications Commission, FCC) .......................................................................... 12 2.1.1. FCC Labeling Requirements ............................................................................................................. 12 2.1.2. End User Manual .............................................................................................................................. 13 2.1.3. RF Exposure ...................................................................................................................................... 13 2.2. Canada (Industry Canada, IC) .............................................................................................................. 14 2.2.1. IC Labeling Requirements ................................................................................................................. 15 2.2.2. RF Exposure ...................................................................................................................................... 16 2.3. Potential Interference Sources ............................................................................................................... 16 2.3.1. Time critical data ............................................................................................................................... 17 2.4. Approved Usage ..................................................................................................................................... 17 2.4.1. USA & Canada ................................................................................................................................. 17 3. Electrical Characteristics .............................................................................................................................. 19 3.1. Absolute Maximum Ratings .................................................................................................................. 19 3.2. Operating Conditions ............................................................................................................................. 20 3.3. Pin Out ...................................................................................................................................................... 20 3.4. Recommended Layout ............................................................................................................................ 23 3.5. Power Supply Considerations ............................................................................................................... 25 3.6. LNA Stability Time ................................................................................................................................. 25 3.7. LNA Operation ........................................................................................................................................ 26 3.7.1. Microcontroller, Two Pins ................................................................................................................ 27 3.7.2. Microcontroller, One Pin .................................................................................................................. 27 3.7.3. Two GDO pins .................................................................................................................................. 28 3.7.4. One GDO pin .................................................................................................................................... 29 3.8. External Interference ............................................................................................................................... 30 4. Mechanical and Process ................................................................................................................................ 32 4.1. Dimensions............................................................................................................................................... 32 4.1.1. A1101L09A ....................................................................................................................................... 32 4.1.2. A1101L09C ....................................................................................................................................... 33 4.2. Packaging ................................................................................................................................................. 33 4.2.1. Matrix Tray Packaging ..................................................................................................................... 33 4.2.2. Tape-Reel Packaging ......................................................................................................................... 34 4.3. Soldering................................................................................................................................................... 35 4.3.1. Manual Mounting Procedure ........................................................................................................... 35 4.3.2. Automated Mounting Procedure ...................................................................................................... 36
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A1101L09x – Users Manual Page 5 of 40 Release Date 11/01/11 1. Overview The A1101L09A and A1101L09C are surface mount modules – each with an integrated crystal, internal voltage regulator, Low Noise Amplifier, matching circuitry and filtering. The A1101L09A has an integral antenna, whereas the A1101L09C utilizes an external antenna through a U.FL connector (see Table1.). The modules operate in the US 902 – 928MHz ISM band and are ideal for achieving low power wireless connectivity without having to deal with extensive RF, antenna design and regulatory compliance, allowing quick time to market. The modules are 100% tested to provide consistent performance. The A1101L09A and A1101L09C have received regulatory approvals for modular devices in the United States (FCC) and Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS-210 and RSS-Gen. The modular approval allows the OEM or end user to place either an A1101L09A or an A1101L09C with an approved antenna inside a finished product without having to perform costly regulatory testing for an intentional radiator. Section 2 has information on the requirements for the end user/integrator must fulfill to use the modules without intentional radiator regulatory testing. The A1101L09A and A1101L09C are based on the CC1101 transceiver IC from Texas Instruments. All control lines for the transceiver are provided at module level for full control of its operation. Please see the CC1101 data sheet (www.ti.com) for how to control the modules. Please see section 8 for the recommended register settings to achieve optimal performance and regulatory compliance. The A1101L09A measure 11x19x2.5mm and A1101L09C measures 11x14x2.5mm. 1.1. A1101L09A The A1101L09A has an integral antenna, providing high efficiency and near omni-directional radiation pattern. This approach offers the lowest system cost when the application allows collocation of radio and antenna. 1.2. A1101L09C The A1101L09C has a compact antenna connector that allows for locating the antenna away from the module due to form/function or in order to exit a metal enclosure, see figure 6 and figure 7 for more information on antenna location and enclosure considerations.
Page 6 of 40 A1101L09x – Users Manual Release Date 11/01/11 1.3. Features Features:  Frequency range: 902-928 MHz  Ultra small package size  A1101L09C : 11mm x 14mm x 2.5mm  A1101L09A : 11mm x 19mm x 2.5mm  Impedance controlled multi-layer PCB  Shielded Package  1.8 to 3.6 V operation  SPI Interface  ROHS Compliant  LGA Footprint  Low Power Consumption  Regulatory approvals for FCC  Digital RSSI output  Programmable channel filter bandwidth  Programmable output power up to +11 dBm  High sensitivity (–115 dBm at 1.2 kBaud, 2.2% packet error rate)  Low current consumption (25.2 mA in RX, 1.2kBaud, input well above sensitivity limit)  Fast startup time: 240µs from SLEEP to Rx or Tx mode  Separate 64 byte Rx and Tx FIFOs  Programmable data rate from 1.2 to 500 kBaud  Sleep state: 0.4µA  Idle State: 1.7mA Benefits Summary:  Operating temperature -40 to +85C  100% RF Tested in production  Common footprint for all family members  No RF engineering experience necessary  Only requires a 2 layer PCB implementation  Excellent receiver selectivity and blocking Performance  Suited for systems compliant with FCC CFR47 Part 15.247 (US) and Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS-210 and RSS-Gen.  No regulatory “Intentional radiator” testing required for integrating modules into end product. Simple certification labeling replaces testing. 1.4. Theory of Operation The A1101L09A and A1101L09C are for low power wireless applications in the US 902 – 928MHz ISM band. The devices can be used to implement a variety of networks, including; point to point, point to multipoint, peer to peer and mesh networks. The A1101L09A and A1101L09C both interface to an application microcontroller via an SPI bus. Physical and MAC layer functionality are accessed via the SPI bus through addressable registers as well as execution commands. Data received or to be transmitted are also accessed through the SPI bus and are implemented as a FIFO register (64 bytes each for Tx and Rx).
A1101L09x – Users Manual Page 7 of 40 Release Date 11/01/11 To transmit, a frame of data is placed in the FIFO; this may include a destination address. A transmit command is given, which will transmit the data according to the initial setup of the registers. To receive data, a receive command is given, which enables the unit to “listen” for a transmission; when such a transmission occurs, it places the received frame in the FIFO. When neither transmit nor receive are required, the device can enter either an Idle mode, from which it can quickly re-enter receive, transmit mode, or a low power sleep mode from which a crystal startup is required prior to transmit or receive operation. Below is a block diagram for each of the A1101L09A and A1101L09C modules.  Antenna o The antenna couples energy between the air and the AIR module. For applications where installations are done by an end user (non-professional), an omni-directional antenna pattern is desired; such that the application will work equally well in any direction. Similarly for peer to peer or point to multipoint applications an omni-directional pattern is desired such that all nodes have a fair chance of communicating. The A1101L09A module has an integral antenna that is near omni-directional, whereas the A1101L09C has approved antenna options ranging from near omni-directional to shaped front/back patterns (useful for inline, professional installations). Note that the end radiation patern depends not only on the antenna, but also on the ground plane, enclosure and installation environment. If the OEM or end user uses an antenna other than specified in Table 1, then the certification becomes void and it’s the OEM/end user responsibility to re-certify the complete product.  Filtering o Filtering removes spurious signals to comply with regulatory intentional radiator requirements.  Switch o Switches between transmit and receive mode which helps in reducing some loss while in transmit mode.  LNA o Amplifies the receive signal intended to reduce the noise by the gain of the amplifier and to achieve the best sensitivity. The noise of the amplifier is injected directly into the received signal.  SAW Filter o Surface Acoustic Wave (SAW) filters has been used for sharp cut off of the unwanted spurs which helps in maintaining good quality in the receive signal within the band of interest.  Matching o Matching provides the correct loading of the transmit amplifier to achieve the highest output power, as well as the correct loading for the receive LNA to achieve the best sensitivity.  Physical o The physical layer provides conversions between data, symbol and RF signal.  MAC o The MAC layer is part of the Logical Link Layer and provides frame handling, addressing and medium access services.
Page 8 of 40 A1101L09x – Users Manual Release Date 11/01/11  Microcontroller Interface o The microcontroller interface exposes registers and commands for the physical and MAC layers to a microcontroller.  Power Management o Power management ensures a stable supply for the internal functions, as well as providing means for a low power sleep mode (in which case, most of the transceiver is power off). Figure 1 The functionality of the A1101L09A, using an integral antenna Figure 2 The functionality of the A1101L09C, using an external antenna.
A1101L09x – Users Manual Page 9 of 40 Release Date 11/01/11 Figure 3 Transceiver IC block diagram. 1.4.1. Typical Flow After initial setup of registers for desired behavior, the normal operation flow diagram is shown in Figure 4. In applications of infrequent data transmissions, the transceiver would be in “sleep” mode to save power (400nA). From there it would wake up and then enter “idle” mode. As part of the wake up process the crystal oscillator is started (~240μs) and the digital microcontroller interface is powered up. Before transmit or receive, the frequency synthesizer needs to be started (“FS_Wakeup”) and, having been powered off (or idle for a while), the control loop of the VCO/PLL needs to be calibrated (“calibrate”). A data frame is loaded into the transmit FIFO and the “TX” mode is entered. The transceiver will transmit the data and enter “idle” mode after completion. When transmit is complete “RX” mode is entered to wait for the acknowledge frame. Once a frame is received, the transceiver will again enter “idle” mode. If no acknowledge frame is received within a given timeout, the data frame would be re-transmitted. If the acknowledge frame indicates that the data was received, the next data frame will be transmitted. After the last data frame has been transmitted successfully, the transceiver will again be put in “sleep” mode.
Page 10 of 40 A1101L09x – Users Manual Release Date 11/01/11 Medium access Figure 4 Transceiver state diagram
A1101L09x – Users Manual Page 11 of 40 Release Date 11/01/11 1.5. Applications Ultra low-power wireless applications, operating in the 902-928 MHz ISM band.  Wireless alarm and security systems  Industrial monitoring and control  Wireless sensor networks  AMR – Automatic Meter Reading  Home and building automation  Existing applications where simple upgrade to wireless is desired
Page 12 of 40 A1101L09x – Users Manual Release Date 11/01/11 2. Product Approvals The A1101L09A and A1101L09C have been designed to meet most national regulations for worldwide ISM-band use. In particular, the radio modules have been certified to the following standards. 2.1. USA (Federal Communications Commission, FCC) The A1101L09A, with integrated antenna, as well as the A1101L09C, used with the antenna listed in Table 1 below; have been tested to comply with FCC Part 15 – 15.247 “Intentional Radiators.” The devices meet the requirements for modular transmitter approval as detailed in FCC public notice DA 00-1407 Released: June 26, 2000. The A1101L09A and A1101L09C module can be integrated into a finished product without obtaining subsequent FCC approvals. (15.19a3) The modules comply with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Item Part Number Manufacturer Type Gain 1 Integral part of A1101L09A Anaren Integral Antenna 2 dBi 2 66089-0906 Anaren Monopole whip, 6mm lead 3 dBi Table 1 Approved Antenna 2.1.1. FCC Labeling Requirements The A1101L09A and A1101L09C modules have been labeled with their own FCC ID number and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following:
A1101L09x – Users Manual Page 13 of 40 Release Date 11/01/11 Contains Transmitter Module FCC ID: X7J-A10091602 -or- Contains FCC ID: X7J-A10091602 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. 2.1.2. End User Manual The end user manual should include the following statement: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:  Reorient or relocate the receiving antenna.  Increase the separation between the equipment and receiver.  Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.  Consult the dealer or an experienced radio/TV technician for help. 2.1.3. RF Exposure All transmitters regulated by the FCC must comply with RF exposure requirements. OET Bulletin 65 “Evaluating Compliance with FCC Guidelines for Human Exposure to Radio Frequency Electromagnetic Fields” provides assistance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). The bulletin offers guidelines and suggestions for evaluating compliance. If appropriate, compliance with exposure guidelines for mobile and unlicensed devices can be accomplished by the use of warning labels and by providing end users with information concerning minimum separation distances from transmitting structures and proper installation of antennas.
Page 14 of 40 A1101L09x – Users Manual Release Date 11/01/11 The following statement must be included as a CAUTION statement in manuals and OEM products to alert end users of FCC RF Exposure compliance: To satisfy FCC RF Exposure requirements for mobile and base station transmission devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operation at closer than this distance is not recommended. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. If the A1101L09A and A1101L09C module is used in a portable application (i.e., antenna is less than 20 cm from persons during operation), the end user is responsible for performing Specific Absorption Rate (SAR) testing in accordance with FCC rules 2.1091. 2.2. Canada (Industry Canada, IC) The A1101L09A and A1101L09C modules have been certified for use in Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS-210 and RSS-Gen. From section 3.2, RSS-Gen, Issue 3, December 2010, Modular Approval for category I Equipment or Category II Equipment: “Modular approval permits the installation of the same module in a host device or multiple host devices without the need to recertify the device. Equipment certification for a modular device may be sought for either Category I equipment or Category II equipment. Transmitters designed as modules for the installation in a host device may obtain equipment certification as a modular device provided that the applicable RSS is met and the following conditions in this section are met.” In section 7.1.2 Transmitter Antenna, it has been mentioned that the user manuals for transmitters shall display the following notice in a conspicuous location: Notice: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Avis: Sous la réglementation d'Industrie Canada, ce transmetteur radio ne peut fonctionner qu’en utilisant seulement une antenne d'un type et d’un maximum (ou moins) de gain approuvé pour l'émetteur par Industrie Canada. Pour réduire des potentielles interférences radio pour les autres utilisateurs, le type d'antenne et son gain doivent être choisis de sorte que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pas ce qui est nécessaire pour une communication réussie.
A1101L09x – Users Manual Page 15 of 40 Release Date 11/01/11 In section 7.1.2 Transmitter Antenna, it has been mentioned that the user manuals for transmitters equipped with detachable antennas shall also contain the following notice in a conspicuous location: Notice: This radio transmitter (IC: 8975A-A10091602) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Avis: Cet émetteur radio (IC: 8975A-A10091602) a été approuvé par Industrie Canada pour fonctionner avec les types d'antennes énumérés ci-dessous avec le gain maximal admissible et l’impédance d'antenne requise pour chaque type d'antenne indiqué. Les types d'antennes ne figurant pas dans cette liste, ayant un gain supérieur au gain maximal indiqué pour ce type, sont strictement interdits pour l'utilisation avec cet appareil. 2.2.1. IC Labeling Requirements From Section 3.2.1, RSS-Gen, Issue 3, December 2010, Labeling Requirements for the Host device: “The host device shall be properly labeled to identify the modules within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certification number of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording expressing the same meaning, as follows: Contains transmitter module IC: XXXXXX-YYYYYYYYYYY where XXXXXX-YYYYYYYYYYY is the module’s certification number. The applicant for equipment certification of the module shall provide with each unit of the module either a label such as described above, or an explanation and instruction to the user as to the host device labeling requirements”. Label: Contains/Contient IC: 8975A-A10091602 Notice: This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Avis: Cet appareil est conforme avec Industrie Canada RSS standard exempts de licence (s). Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences et (2) cet appareil doit accepter toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement du dispositif.
Page 16 of 40 A1101L09x – Users Manual Release Date 11/01/11 From section 7.1.4, RSS-Gen, Issue 3, December 2010, Radio Apparatus Containing Digital Circuits (ICES-003): “Radio apparatus containing digital circuitry which can function separately from the operation of a transmitter or an associated transmitter, shall comply with ICES-003. In such cases, the labeling requirements of the applicable RSS apply, rather than the labelling requirements in ICES-003.” For more information see: Industry Canada http://www.ic.gc.ca/ 2.2.2. RF Exposure All transmitters regulated by IC must comply with RF exposure limits as set forth in RSS-102, Issue 4, section 4, “Exposure Limits”. Furthermore RSS-102, Issue 4, Section 2 “Certification Requirements”, provides assistance in determining the specific requirements for compliance. If appropriate, compliance with exposure guidelines for mobile and unlicensed devices can be accomplished by the use of warning labels and by providing users with information concerning minimum separation distances from transmitting structures and proper installation of antennas. The following statement must be included as a CAUTION statement in manuals and OEM products to alert users of IC RF Exposure compliance: Notice: To satisfy IC RF Exposure requirements for mobile and base station transmission devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operation at closer than this distance is not recommended. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Avis: Pour répondre à la IC d'exposition pour les besoins de base et mobiles dispositifs de transmission de la station, sur une distance de séparation de 20 cm ou plus doit être maintenue entre l'antenne de cet appareil et les personnes en cours de fonctionnement. Pour assurer le respect, l'exploitation de plus près à cette distance n'est pas recommandée. L'antenne (s) utilisé pour cet émetteur ne doit pas être co-localisés ou fonctionner conjointement avec une autre antenne ou transmetteur. If the A1101L09A or A1101L09C module is used in a portable application (antenna is less than 20cm from persons during operation), the integrator/OEM is responsible for performing Specific Absorption Rate (SAR) testing in accordance with IC rules and methods of RSS-102 2.3. Potential Interference Sources  Alarm systems o These typically use low duty cycles and are therefore easy to avoid using acknowledge/retransmit methods  Car alarms (internal motion sensors)  Video surveillance o These are typically operated on a fixed channel determined at installation time and can be avoided by using clear channel assessment. It may be useful to change the channel used by the video surveillance equipment also, if possible.
A1101L09x – Users Manual Page 17 of 40 Release Date 11/01/11 2.3.1. Time critical data If the user requires specific time critical data throughput that cannot tolerate the delays of potentially many re-transmissions, the user is encouraged to implement an environment-aware algorithm that periodically monitors/scans the frequency band and maintain a list of “best available” channels. 2.4. Approved Usage These radio modules can be used in a variety of physical layer configurations; the following restricts the use to maintain compliance with the above referenced certification bodies. The user is encouraged to use minimum power required to establish a link, thus minimizing interference. Changes or modifications to the module and/or operation outside the limits set forth below are prohibited and could void the user’s authority to operate the modules. Uses of these radio modules are limited to the following frequency ranges and modulation settings. Using the radio modules outside of these limitations are prohibited and could void the user’s authority to operate the modules. The user should use one of the register configurations listed below. Anaren provides register setting files for optimal performance and compliance for each of the data rates given in the following at www.anaren.com. 2.4.1. USA & Canada Within the USA and Canada, the modules have been approved for use as digitally modulated transmitters. In the US, the occupied bandwidth (6dB) should be greater than 500 kHz whereas in Canada, the maximum BW (99%) should be 0.5% of the center frequency. In addition, the spectral density may not exceed 8dBm/3kHz and the total output power including antenna gain may not exceed 1W. The following table shows configurations that are compliant with this use and the expected performance. 2-FSK Modulation: Requirement Suggested Data Rate Deviation Fomin FoMax Max power Channel Rx Filter kb/s KHz MHz MHz dBm KHz KHz 1.2 228.515625 902.699799 927.293793 7 99.975586 650 38.4 228.515625 902.699799 927.293793 7 99.975586 650 100 228.515625 902.699799 927.293793 11 99.975586 650 250 228.515625 902.699799 927.293793 11 99.975586 812
Page 18 of 40 A1101L09x – Users Manual Release Date 11/01/11 MSK Modulation: Requirement Suggested Data Rate Phase Fomin FoMax Max power Channel Rx Filter kb/s deg MHz MHz dBm KHz KHz 500 0 902.799774 927.193817 11 99.975586 650 Table 2: FCC approved configurations It is encouraged to use a medium access technique which should include addressing of individual transceiver nodes; and should include a combination of a clear channel assessment, transmit and detect, or a frequency hopping method. This ensures that the un-licensed band can be shared with other systems/applications. Due to FCC power spectral density requirements, the output power must be limited by the given value for each modulation types. The given Max power in Table 2 represents the PA table setting for the module to ensure the correct maximum output power. Table 3 gives a list of available output powers that the module has along with the corresponding PA table register values. Power (dBm) PA_Table(Hex) 11 0xC0 8.9 0xC6 7 0xCC 5 0x84 0 0x8E -6 0x38 -10 0x27 -15 0x1E -20 0x0E -30 0x03 Table 3: Output Power Vs. PA Table Value
A1101L09x – Users Manual Page 19 of 40 Release Date 11/01/11 3. Electrical Characteristics 3.1. Absolute Maximum Ratings Under no circumstances must the absolute maximum ratings given in Table 4 be violated. Stress exceeding one or more of the limiting values may cause permanent damage to the device. Table 4 Absolute Maximum Ratings Caution! ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage. Caution! This assembly contains moisture sensitive devices and requires proper handling per IPC/JEDEC J-STD-033
Page 20 of 40 A1101L09x – Users Manual Release Date 11/01/11 3.2. Operating Conditions Table 5 Operating Conditions Note: As the voltage increases in pin 24 (Vctrl2) the Gain of the Module increases. It’s been recommended that in order to maintain a constant Gain a supply voltage from 2.9 to 3.1V to pin 24 (Vctrl2). 3.3. Pin Out The A1101L09A and A1101L09C radio modules share a common pin-out.
A1101L09x – Users Manual Page 21 of 40 Release Date 11/01/11 NC = NO Connection. Pin is NOT connected internally. DNC = Do Not Connect. Internal connection used during assembly, do not connect. Pin # Pin Name Pin Type Description 1 GND Ground One of ten primary ground pins 2 NC NC Pin is not connected internally, but is reserved for future expansion. It is recommended not to connect this pin to anything. 3 NC NC Pin is not connected internally, but is reserved for future expansion. It is recommended not to connect this pin to anything. 4 NC NC Pin is not connected internally, but is reserved for future expansion. It is recommended not to connect this pin to anything. 5 GND Ground One of ten primary ground pins 6 NC NC Pin is not connected internally, but is reserved for future expansion. It is recommended not to connect this pin to anything. 7 GND Ground One of ten primary ground pins 8 Vdcoup1 Analog Optional decoupling of the modules internal Vdd supply. It is recommended to not connect anything to this pin. In particular noisy environment this pin can be used to further reduce the noise on the modules internal Vdd, please see section 3.5 for further information. 9 GND Ground One of ten primary ground pins 10 SCLK Digital SPI bus clock signal
Page 22 of 40 A1101L09x – Users Manual Release Date 11/01/11 Input 11 MISO/GDO1 Digital Output SPI bus data out from radio when CSN is low, and general purpose I/O pin when CSN is high 12 MOSI Digital Input SPI bus data into radio 13 _CSN Digital Input SPI bus select (active low) 14 GDO0 Digital I/O (Analog output) General purpose port 15 GDO2 Digital I/O General purpose port 16 Vdcoup2 Analog Optional decoupling of the modules internal Vdd supply. It is recommended to not connect anything to this pin. In particular noisy environment this pin can be used to further reduce the noise on the modules internal Vdd, please see section 3.5 for further information. 17 GND Ground One of ten primary ground pins 18 GND Ground One of ten primary ground pins 19 GND Ground One of ten primary ground pins 20 NC NC Pin is not connected internally, but is reserved for future expansion. It is recommended not to connect this pin to anything. 21 Vdd Power Supply Power supply pin 22 DNC NC Internal GND connection used during testing, not recommended to connect to main GND. 23 GND Ground One of ten primary ground pins 24 Vctrl2 Power Supply Power Supply pin for the receive Mode. 25 Vctrl1 Power Supply Power Supply pin for the transmit Mode. 26 GND Ground One of ten primary ground pins 27 DNC NC Internal RF output connection used during test. Connecting this pin to anything will require recertification for intentional radiators. 28 GND Ground One of ten primary ground pins Table 6 Pin Descriptions
A1101L09x – Users Manual Page 23 of 40 Release Date 11/01/11 3.4. Recommended Layout Figure 5a. Recommended PCB Layout for A1101L09A
Page 24 of 40 A1101L09x – Users Manual Release Date 11/01/11 Figure 5b. Recommended PCB layout for A1101L09C Figure 6 Mounting the A1101L09A module in a corner Figure 7 Mounting the A1101L09A module along an edge
A1101L09x – Users Manual Page 25 of 40 Release Date 11/01/11 3.5. Power Supply Considerations Noise on the power supply line reduces the sensitivity of a receiver and modulates onto a transmitter’s signal, both of which causes a degradation of link quality and hence a reduction in range. The A1101L09A and A1101L09C radio modules each have an integral ferrite bead in the supply line from pin 21 (Vdd) and decoupling capacitance to reduce any noise on the incoming power supply line. Similarly pin 24 (Vctrl2) and pin 25 (Vctrl1) have decoupling capacitance to reduce the noise through the incoming power supply. This arrangement will eliminate most supply voltage noise. In particularly noisy environments (switching regulators, motor controls, etc.), it may be necessary to add additional noise reduction means. Pin 8 (Vdcoup1) is connected to the modules internal supply line after the decoupling capacitors and can be used to probe the noise at module level. The noise level measured on pin 8 should not exceed 120mVpp when in transmit or receive mode; it may however exceed this value when setting up or accessing data to/from the FIFOs, while not actively transmitting or receiving. If the level measured is exceeding the above limit, steps should be taken to ensure maximum range, including:  Adding decoupling capacitance to pin 8 (Vdcoup1).  Adding additional filtering in the supply line.  Adding an LDO in the supply line (the TPS731xx low Dropout Regulator from TI is recommended). 3.6. LNA Stability Time The A1101L09A and A1101L09C radio modules are equipped with LNA which takes time to stabilize itself from the time it has been triggered to turn ON and also it takes time to turn OFF. The LNA used in A1101L09A and A1101L09C radio modules takes approximately 21 µs to stabilize before it starts receiving signals and amplifying it. And similarly it takes approximately 3.5 µs to turn off completely when there is no power supply to the LNA before the radio module turns to Sleep or transmit mode.
Page 26 of 40 A1101L09x – Users Manual Release Date 11/01/11 Figure 8 LNA delay to stabilize itself from the time it has been triggered ON. Figure 9 Delay caused by LNA to turn off 3.7. LNA Operation The A1101L09A and A1101L09C radio modules are equipped with LNA which needs a control mechanism to both power the LNA and the receive side of the Tx/Rx switch (V+). It also requires an inverted voltage to control the Radio module actively in receive mode. The required states are specified below: Radio Mode V+ V- Notes Sleep 0V or Z 0V or Z Tristate is potentially the better option as there is no potential residual voltage Rx 1.8V to 3.6V 0V Tx 0V 1.8V to 3.6V Any Other State 0V or Z Any The current draw on V- is very minimal and thus it is not very critical in non-sleep radio modes Table 7: LNA Operation There are different potential methods of operation and they have been listed below.
A1101L09x – Users Manual Page 27 of 40 Release Date 11/01/11 3.7.1. Microcontroller, Two Pins USB Connector MicrocontrollerRFIC Matching CircuitSwitchLNASwitchUSBSPIGDO RX RXTXCtrl1Ctrl1Ctrl1Ctrl2Ctrl2Ctrl2 Ctrl2VDDRADIO MODULE Figure 10 Ctrl1 Ctrl2 Mode High Low Transmit Mode Low High Receive Mode Low Low Sleep Mode High High Invalid State Table 8: Microcontroller, Two pins The V+ and V- signals are controlled directly by the microcontroller which also controls the chip in the Radio Module. When the chip of the Radio Module is in Sleep Mode, both the V+ and V- signals should be either tri-stated or made low, so there is a minimum current consumption by the module during the sleep mode. This is a low cost implementation, provided that the microprocessor has spare pins that can be assigned separately to this. This solution requires more complex coding. 3.7.2. Microcontroller, One Pin USB Connector MicrocontrollerRFIC Matching CircuitSwitchLNASwitchUSBSPIGDO RX RXTXCtrl1Ctrl1Ctrl1Ctrl2Ctrl2Ctrl2 Ctrl2VDDRADIO MODULEInverterLDOVccEnable/DisableI/pO/pCtrl
Page 28 of 40 A1101L09x – Users Manual Release Date 11/01/11 Figure 11 LDO Ctrl Mode Enable High Transmit Mode Enable Low Receive Mode Disable Low Sleep Mode Table 9: Microcontroller, One pin The V+ and V- are controlled through one signal from the microcontroller and an inverter to control the other. This set up works well with the Rx and Tx mode, but in the Sleep Mode both V+ and V- control lines has to be low and hence the inverter is controlled by a Low-dropout regulator (LDO), which indeed has to be controller through a microcontroller. Alternatively the inverter could be tri-stated, but it would still draw current although it is not very much. Additionally a weak pull-down resistor would also be required on the input to the inverter in case the input was floated during sleep mode, to avoid oscillation. 3.7.3. Two GDO pins USB Connector MicrocontrollerRFIC Matching CircuitSwitchLNASwitchUSBSPIGDOxRX RXTXCtrl1Ctrl1Ctrl1Ctrl2Ctrl2Ctrl2 Ctrl2VDDRADIO MODULEGDO2GDO0 Figure 12 Ctrl1 Ctrl2 Mode High Low Transmit Mode Low High Receive Mode Low Low Sleep Mode High High Invalid State Table 10: Two GDO pins The V+ and V- signals are controlled directly by the Radio Module GDO pins 0 and 2. However one of these pins should be typically used to generate interrupts to the microcontroller. The pin assignments of GDO pins are:
A1101L09x – Users Manual Page 29 of 40 Release Date 11/01/11 GDO Description 27 (0x1B) PA_PD. Note: PA_PD wil have the same signal level in SLEEP and TX states. To control an external PA or RX/TX switch in applications where the SLEEP state is used it is recommended to use GDOx CFGx=0x2F instead. 28 (0x1C) LNA_PD. Note: LNA_PD will have the same signal level in SLEEP and RX states. To control an external LNA or RX/TX switch in applications where the SLEEP state is used it is recommended to use GDOx CFGx=0x2F instead. Table 11: GDO pin assignment However, it is clearly stated that this setting is not recommended during the sleep mode (CC1101 Data sheet http://www.ti.com/lit/ds/symlink/cc1101.pdf, Section 26, General Purpose/Test Output Control pins). The GDO pin has to be set to 2F (Inverse 6F) by the microcontroller. During the sleep mode the pins are set to 0 or high-z which leads to the scenario that the GDO pins cannot be used for signal interrupts. The code becomes more complex as these control pins are set through the SPI bus. 3.7.4. One GDO pin USB Connector MicrocontrollerRFIC Matching CircuitSwitchLNASwitchUSBSPIGDOxRX RXTXCtrl1Ctrl1Ctrl1Ctrl2Ctrl2Ctrl2 Ctrl2VDDRADIO MODULEInverterLDOVccEnable/DisableI/pO/pGDO0 Figure 13 LDO Ctrl Mode Enable High Transmit Mode Enable Low Receive Mode Disable Low Sleep Mode Table 12: One GDO pin The V+ and V- are controlled through one signal from the Radio Module GDO pin and an inverter to control the other. This has the advantage of separating the interrupt signal pin separately from the V+ and V- control signals, but on the other hand it requires a Low-dropout regulator (LDO) to control the inverter during the sleep mode. To avoid the LDO, the inverter
Page 30 of 40 A1101L09x – Users Manual Release Date 11/01/11 can be tri-stated which still draw current. A week pull-down resistor would be required to the input of the inverter to avoid oscillation. Either way, there is an additional component to it. 3.8. External Interference When an external signal with higher power level is interfered with the A1101L09A or A1101L09C radio module during its operation, it shuts down completely at that particular in-band interference frequency and the sensitivity is affected in the adjacent channels. The LNA is operated through one GDO pin method which has an inverter to control the other control line.
A1101L09x – Users Manual Page 31 of 40 Release Date 11/01/11 Figure 14 External interference at in-band frequency of 902 MHz Figure 15External interference at in-band frequency of 915 MHz Figure 16 External interference at in-band frequency of 928 MHz Figure 17 External interference at out-of-band frequency of 895 MHz Figure 18 External interference at out-of-band frequency of 890 MHz Figure 19 External interference at out-of-band frequency of 935 MHz
Page 32 of 40 A1101L09x – Users Manual Release Date 11/01/11 Figure 02 External interference at out-of-band frequency of 940 MHz Figure 21 Comparison of different interference frequency at a power level of -15 dBm Note: The sensitivity reading doesn’t correspond to the right sensitivity reading as the interference signals are connected externally with the A1101L09x radio modules. 4. Mechanical and Process 4.1. Dimensions 4.1.1. A1101L09A
A1101L09x – Users Manual Page 33 of 40 Release Date 11/01/11 4.1.2. A1101L09C 4.2. Packaging AIR modules are available in Matrix Tray and Tape & Reel packaging for high-volume assembly. Details of packaging provided below: 4.2.1. Matrix Tray Packaging A1101L09A00GM Matrix Tray Packaging Detail (27/Tray)
Page 34 of 40 A1101L09x – Users Manual Release Date 11/01/11 A1101L09C00GM Matrix Tray Packaging Detail (27/Tray) 4.2.2. Tape-Reel Packaging A1101L09A00GR Tape-Reel Packaging Detail (500/Reel) A1101L09C00GR Tape-Reel Packaging Detail (500/Reel)
A1101L09x – Users Manual Page 35 of 40 Release Date 11/01/11 4.3. Soldering AIR Modules may be mounted either manually (for prototyping or low volume production), or automatically for high-volume production. A no-clean tin/silver/copper (SAC) solder is recommended, however lead based no-clean pastes may also be used. CAUTION: AIR Modules are designed for no-clean fluxes only. DO NOT use water-based fluxes that require aqueous cleaning after solder. Spot cleaning with a flux remover and toothbrush may be performed with care. 4.3.1. Manual Mounting Procedure The recommended soldering method is reflow of a paste solder on a hot plate. This method works provided the bottom of the board where the AIR module is to be mounted is accessible, and there are no bottom-side components in the way. An aluminum or copper block may be placed on the hot plate surface to transfer heat to a localized area on the board where the AIR module is mounted - Set the hot plate to the reflow temperature solder manufacturer’s recommended - Apply solder paste to the pads on the board receiving the AIR module - Place the AIR module carefully onto the dispensed solder - Using tweezers or another holding device, carefully place board with AIR module onto the hot plate surface (or metal block) - Apply heat until reflow occurs, per solder paste manufacturer’s recommendations - Carefully remove the board and place on a heat-resistant surface to cool - Check assembly electrically to confirm there are no opens or shorts
Page 36 of 40 A1101L09x – Users Manual Release Date 11/01/11 4.3.2. Automated Mounting Procedure The AIR Radio Module recommended solder reflow profile is based on IPC/JEDEC J-STD-020.
A1101L09x – Users Manual Page 37 of 40 Release Date 11/01/11
Page 38 of 40 A1101L09x – Users Manual Release Date 11/01/11 HISTORY Date Author Change Note No./Notes 10/12/2011 Vivekanandh Elangovan Initial Draft for Rev 3 Module 10/17/2011 Vivekanandh Elangovan Recommended PCB Layout has been changed 10/20/2011 Vivekanandh Elangovan Recommended Ground pattern has been updated 10/21/2011 Vivekanandh Elangovan RF Exposure for IC has been updated 11/01/2011 Richardson Removed FCC logo
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Thank you for learning more about the Anaren Integrated Radio (AIR) module line. If you have additional questions, need samples, or would like a quote – please do not hesitate to email the AIR team at AIR@anaren.com or contact any of these authorized distributors of the AIR product line. Worldwide North America Worldwide Anaren Microwave, Inc. 6635 Kirkville Road East Syracuse, NY 13057 Tel: +1 315 432 8909 +1 800 411 6596 Fax: +1 315 432 8970 Anaren Microwave (Europe), Inc. 12 Somerset House, Suite 16 & 17 Hussar Court, Waterlooville Hampshire, England P07-7SG Tel: +44 2392 232392 Fax: +44 2392 251369 Anaren Communication Suzhou Co. Ltd. No. 5 Chun Hui Road Wei Ting, Suzhou Industrial Park Suzhou 215122, PR China Tel: +86 512 6287 6400 Fax: +86 512 6274 9283

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