AzureWave Technologies CM389NF IEEE 802.11 2X2 MIMO a/b/g/n/ac Wireless LAN + Bluetooth + NFC NGFF Module User Manual AW AH691A

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Date Submitted	2014-07-09 00:00:00
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AW-CM389NF
IEEE 802.11 2X2 MIMO a/b/g/n/ac Wireless
LAN + Bluetooth + NFC
NGFF Module
Datasheet
Version 0.9
-1-
Document
release
Date
Modification
Initials
Approved
Kai
Wu
Chihhao
Liao
Chihhao
Liao
Version0.1
2013/08/13 Initial version
Version0.2
2013/10/08
Version0.3
1. Update Pin Map
2013/11/07 2. Update Pin Definition
3. Update Dimension
Alex Yu
Chihhao
Liao
Version0.4
1. Update “2 Electrical Characteristic”
2. Update “3-1 SDIO Interface”
3. Update “4 Pin Definition”
2013/11/19
4. Update “5 Mechanical Information”
5. Add “2-2.1 The interface pins power
supply”
Alex Yu
Chihhao
Liao
Version0.5
2013/12/03 Add “4 Pin Definition’s Notes”
Alex Yu
Version0.6
2013/12/05 Update “4 Pin Definition’s Notes”
Alex Yu
Version0.7
1. Update “1-2 Block Diagram”
2013/12/11 2. Update “5-2 Module Footprint”
Alex Yu
Chihhao
Liao
Version0.8
1. Update “1-4 Bluetooth Standard”
2. Update “5-1 Mechanical Information”
2014/03/20 3. Update “2-3 Clock Specification”
4. Update “5-2 Module Footprint”
5. Add “7. Shipping Information”
Alex Yu
Chihhao
Liao
Version0.9
2014/04/14
1. Update “1-4 Specifications Table”
2. Update “5-1 Mechanical Information”
Alex Yu
Chihhao
Liao
1. Update Pin Map
2. Update Interface Configuration straps
-2-
Alex Yu
Chihhao
Liao
Chihhao
Liao
1. General Description
1-1. Product Overview and Functional Description
AzureWave Technologies, Inc. introduces the IEEE 802.11ac/a/b/g/n 2X2 MIMO WLAN & Bluetooth &
NFC NGFF module --- AW-CM389NF. The module is targeted to mobile devices including Notebook,
TV, Tablet and Gaming Device which need small package module, low power consumption, multiple
interfaces and OS support. By using AW-CH389, the customers can easily enable the Wi-Fi, and BT
embedded applications with the benefits of high design flexibility, short development cycle, and
quick time-to-market.
Compliance with the IEEE 802.11ac/a/b/g/n standard, the AW-CM389NF uses Direct Sequence Spread
Spectrum (DSSS), Orthogonal Frequency Division Multiplexing (OFDM), DBPSK, DQPSK, CCK and
QAM baseband modulation technologies. A high level of integration and full implementation of the power
management functions specified in the IEEE 802.11 standard minimize the system power requirements
by using AW-CH389. In addition to the support of WPA/WPA2 and WEP 64-bit and 128-bit encryption,
the AW-CM389NF also supports the IEEE 802.11i security standard through the implementation of
Advanced Encryption Standard (AES)/Counter Mode CBC-MAC Protocol (CCMP), Wired Equivalent
Privacy (WEP) with Temporal Key Integrity Protocol (TKIP), Advanced Encryption Standard
(AES)/Cipher-Based Message Authentication Code (CMAC), and WLAN Authentication and Privacy
Infrastructure (WAPI) security mechanisms.
For the video, voice and multimedia applications the AW-CM389NF support 802.11e Quality of Service
(QoS). The device also supports 802.11h Dynamic Frequency Selection (DFS) for detecting radar
pulses when operating in the 5GHz range.
For Bluetooth operation, AW-CM389NF is Bluetooth 4.0 (supports Low Energy).
AW-CM389NF supports SDIO, PCIE, USB, and high speed UART interfaces for WLAN and Bluetooth
to the host processor.
AW-CM389NF is suitable for multiple mobile processors for different applications with the support
cellular phone co-existence.
AW-CM389NF module adopts Marvell’s latest highly-integrated dual-band WLAN & Bluetooth SoC--88W8897. All the other components are implemented by all means to reach the mechanical specification
required.
-3-
1-2. Block Diagram
Note: Interface supports and combinations as shown below:
Scenario
WLAN
BT/NFC
BT_AMPS
Firmware
Download I/F
Firmware
Download Mode
Configuration*
SDIO
SDIO
SDIO
SDIO
Serial
CON[3:0]=b'0111
SDIO
SDIO
--
SDIO
Serial
CON[3:0]=b'0001
SDIO
UART
SDIO
SDIO or UART
Serial
CON[3:0]=b'1101
SDIO
UART
SDIO
SDIO + UART
Parallel
CON[3:0]=b'0010
SDIO
UART
--
SDIO or UART
Serial
CON[3:0]=b'0100
USB
USB
USB
USB
Serial
CON[3:0]=b'0110
USB
UART
USB
USB or UART
Serial
CON[3:0]=b'1010
USB
UART
--
USB + UART
Parallel
CON[3:0]=b'1000
PCIe
UART
--
PCIe + UART
Parallel
CON[3:0]=b'1111
10
PCIe
UART
--
PCIe or UART
Serial
CON[3:0]=b'1100
11
PCIe
USB
USB
PCIe
Serial
CON[3:0]=b'1110
-4-
*Configuration pins:
Configuration
Pin No
Pin Name
CON[3]
13
CONFIG_HOST[3]
CON[2]
10
CONFIG_HOST[2]
CON[1]
CONFIG_HOST[1]
CON[0]
CONFIG_HOST[0]
1-3. Key feature:
Small footprint: 12mm(L) x 16mm(W) x 1.4 mm(H)
SDIO3.0, G-SPI, USB interfaces support for WLAN
High speed UART,PCM/Inter-IC Sound(I2S) and SDIO3.0, USB for Bluetooth
Bluetooth 4.0 complaint with Bluetooth 2.1 + Enhanced Data
Rate (EDR)
Audio Codec interface support
Cellular phone co-existence support
Multiple power saving modes for low power consumption
IEEE 802.11i for advanced security
Quality of Service (QoS) support for multimedia applications
Drip-in WLAN Linux drivers are Android ready and validated on Android based
systems.
Support for Linux kernel versions up to 2.6.32.
Support for BlueZ v4.47 Bluetooth profiles stack used in Android Éclair
Simultaneous AP-STA
Support China WAPI
Lead-free design
-5-
1-4. Specifications Table
Model Name
AW-CM389NF
Product Description
2x2 MIMO Wireless LAN + Bluetooth + NFC Combo Module
WLAN Standard
IEEE 802.11 a/b/g/n/ac, Wi-Fi compliant
Bluetooth Standard
Bluetooth 4.0 complaint with Bluetooth 2.1+Enhanced Data Rate (EDR)
NFC Standard
Full protocol support for ISO 14443A/B, ISO 18092, ISO 15693, NFCIP-1,
NFC Forum, EMV contactless targets with data rates up to 848 Kbps
Host Interface
USB 2.0 for WLAN and Bluetooth
Major Chipset
Marvell 88W8897
Dimension
12mm x 16mm x 1.4mm
Weight
TBD
Package
LGA
Operating Conditions
Voltage
3.3V+- 10%
Temperature
Operating: -20 ~ 70 C ; Storage: -40 ~ 85 C
Electrical Specifications
Frequency Range
2.4 GHz ISM radio band / 5 GHz Unlicensed National Information
Infrastructure (U-NII) band
Number of Channels
802.11a: USA, Taiwan – 12/4
Most European Countries –19
Japan – 4
802.11b: USA, Canada and Taiwan – 11
Most European Countries – 13
France – 4
802.11g: USA, Canada and Taiwan – 11
Most European Countries – 13
Japan – 13
802.11n(HT20): Channel 1~14(2412~2484)
802.11n(HT40): Channel 1~7(2422~2472)
Modulation
DSSS, OFDM, DBPSK, DQPSK, CCK, 16-QAM, 64-QAM for WLAN
GFSK (1Mbps), /4 DQPSK (2Mbps) and 8DPSK (3Mbps) for Bluetooth
WLAN G band:
11b:16dBm +/- 2dBm(11M)
11g:14dBm +/- 2dBm (54M)
11n:HT20 13dBm +/- 2dBm(MCS7)
HT40 11dBm +/- 2dBm(MCS7)
Output Power
WLAN A band:
11a: 13dBm +/- 2dBm(54M)
11n:HT20 12dBm +/- 2dBm(MCS7)
HT40 10dBm +/- 2dBm(MCS7)
11ac: 8dBm +/- 2dBm(MCS9)
Bluetooth:
Class 2
-6-
Main Connector: WLAN
Aux Connector: WLAN + BT
WLAN G band :
11b:-83dBm (11M)
11g:-72dBm (54M)
11n:HT20 -68dBm (MCS7)
HT40 -65dBm (MCS7)
WLAN A band:
11a: -67dBm (54M)
11n:HT20 -67dBm (MCS7)
HT40 -64dBm(MCS7)
11ac: -54dBm(MCS9)
Bluetooth:
DH1:-70dBm
3DH5:-70dBm
CSMA/CA with ACK
WLAN
802.11b: 1, 2, 5.5, 11Mbps
802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54Mbps
802.11n: up to 150Mbps-single
802.11n: up to 300Mbps-2x2 MIMO
802.11ac:up to 192.6Mbps (20MHz channel)
802.11ac:up to 400Mbps (40MHz channel)
802.11ac:up to 866.7Mbps (80MHz channel)
Bluetooth
Bluetooth 2.1+EDR data rates of 1,2, and 3Mbps
NFC
NFC data rates up to 848Kbps
TBD
Open Space: ~300m ; Indoor: ~100m for WLAN
Minimum 10 m indoor for Bluetooth
The transmission speed may vary according to the environment)
WAPI
WEP 64-bit and 128-bit encryption with H/W TKIP processing
WPA/WPA2 (Wi-Fi Protected Access)
AES-CCMP hardware implementation as part of 802.11i security
standard
Linux(Android), Windows, More information please contact Azurewave
FAE.
Bluetooth and cell phone(GSM/DCS/WCDMA/UMTS/3G) co-existence
-7-
2. Electrical Characteristic
2-1. Absolute Maximum Ratings
Symbol
Pin73/ VIO
Parameter
Host I/O power supply
Condition
Min
Typ
Max
--
--
1.8
2.2
--
--
2.5
3.0
--
--
3.3
4.0
--
--
1.8
2.2
--
--
3.3
4.0
Units
Pin44/ VIO_SD
SDIO power supply
Pin5/ 3V3_VBAT
LDO VBAT input
--
--
3.3
5.0
Pin72/ 3V3_USB
LDO USB VBAT input
--
--
3.3
4.0
Pin4/ 3V3_RF
LDO RF VBAT input
--
--
3.3
4.0
Condition
Min
Typ
Max
Units
--
1.62
1.8
1.98
--
2.25
2.5
2.75
--
2.97
3.3
3.63
1.8V/3.3V digital I/O
--
1.62
1.8
1.98
SDIO power supply
--
2.97
3.3
3.63
2-2. Recommended Operating Conditions
Symbol
Pin73/ VIO
Pin44/ VIO_SD
Parameter
1.8V/2.5V/3.3V digital
I/O power supply
Pin5/ 3V3_VBAT
LDO VBAT input
--
2.7
3.3
5.0
Pin72/ 3V3_USB
LDO USB VBAT input
--
2.97
3.3
3.63
Pin4/ 3V3_RF
LDO RF VBAT input
--
2.97
3.3
3.63
2-2.1 The interface pins power supply
The NFC interface pins are powered from the module’s chip LDO 1.8V voltage supply internal.
The SDIO host interface pins are powered from the chip VIO_SD (pin 44) 1.8V/3.3V voltage supply.
SDIO Defauld Speed, High Speed Modes (3.3V)
SDR12, SDR25, SDR50 Modes (up to 100MHz) (1.8V)
SDR104 Mode (208MHz) (1.8V)
The PCI Express host interface pins are powered from the module’s chip LDO 1.8V voltage supply internal.
The USB2.0 host interface pins are powered from the 3V3_USB (pin 72) 3.3V voltage supply.
The UART Tx and Rx pins are powered from the VIO (pin 73) voltage supply.
The GPIO pins are powered from the VIO (pin 73) voltage supply (GPIO [9:8] from 3.3V voltage internal).
The clocked serial pins are powered from the module’s chip LDO 1.8V voltage supply internal.
The audio pins are powered from the chip VIO (pin 73) voltage supply.
-8-
2-3. Clock Specifications
2-3.1 External Sleep Clock Timing
External Sleep Clock is necessary for two reasons:
1. Auto frequency Detection.
This is where the internal logic will bin the Ref clock source to figure out what is the reference clock
frequency is. This is done so no strapping is needed for telling 8897 what the ref clock input is.
2. Allow low current modes for BT to enter sleep modes such as sniff modes.
The AW-CM389NF external sleep clock pin is powered from the 3.3V voltage supply.
Symbol
Parameter
CLK
Clock Frequency Range
THIGH
Clock high time
TLOW
Min
Typ
Max
Units
32 or 32.768
32 or 32.768 +50ppm
KHz
40
--
--
ns
Clock low time
40
--
--
ns
TRISE
Clock rise time
--
--
ns
TFALL
Clock fall time
--
--
ns
32 or 32.768 50ppm
2-4. Reset Configuration
The AW-CM389NF is reset to its default operating state under the following conditions:
Power-on reset (POR)
Software/Firmware reset
External pin reset (RESETn)
2-4-1. Internal Reset
The AW-CM389NF device is reset, and the internal CPU begins the boot sequence when any of the following
internal reset events occur:
Device receives power and VDDL supplies rise (triggers internal POR circuit)
External pin (PDn) assertion will generate POR
2-4-2. External Reset
The AW-CM389NF is reset when PDn pin is asserted low and the internal CPU begins the boot sequence when
the PDn pin transitions from low to high.
-9-
2-5. Power up Timing Sequence
- 10 -
3. Host Interfaces
3-1. SDIO Interface
The AW-CM389NF supports a SDIO device interface that conforms to the industry standard SDIO Full-Speed card
specification and allows a host controller using the SDIO bus protocol to access the Wireless module device.
The AW-CM389NF acts as the device on the SDIO bus. The host unit can access registers of the SDIO interface
directly and can access shared memory in the device through the use of BARs and a DMA engine.
The SDIO device interface main features include:
Supports SDIO 3.0 Standard
On-chip memory used for CIS
Supports SPI, 1-bit SDIO, and 4-bit SDIO transfer modes
Special interrupt register for information exchange
Allows card to interrupt host
3-1-1. SDIO Interface Signal Description
Signal
Pin Name
Name
SD_CLK
CLK
Type
Description
I/O
SDIO 1-bit mode: Clock
SDIO SPI mode: Clock
SD_CMD
CMD
I/O
SDIO 1-bit mode: Command line
SDIO SPI mode: Data input
SD_DAT[3]
DAT3
I/O
SDIO 4-bit mode: Data line bit [3]
SDIO 1-bit mode: Not used
SDIO SPI mode: Chip select (active low)
SD_DAT[2]
DAT2
I/O
SDIO 4-bit mode: Data line bit [2] or Read Wait (optional)
SDIO 1-bit mode: Read Wait (optional)
SDIO SPII mode: Reserved
SD_DAT[1]
DAT1
I/O
SDIO 4-bit mode: Data line bit [1]
SDIO 1-bit mode: Interrupt
SDIO SPI mode: Interrupt
SD_DAT[0]
DAT0
I/O
SDIO 4-bit mode: Data line bit [0]
SDIO 1-bit mode: Data line
SDIO SPI mode: Data output
- 11 -
3-1-2. Default Speed, High Speed Modes (3.3V)
SDIO Protocol Timing Diagram – Default Speed Mode (3.3V)
SDIO Protocol Timing Diagram – HighSpeed Mode (3.3V)
Table shows SDIO Timing Data—Default Speed, High Speed Modes (3.3V)
NOTE: Over full range of values specified in the Recommended Operating Conditions unless otherwise specified.
- 12 -
- 13 -
3-1-3. SDR12, SDR25, SDR50 Modes (up to 100MHz) (1.8V)
SDIO Protocol Timing Diagram – SDR12,SDR25,SDR50 Modes (up to 100MHz) (1.8V)
Table shows SDIO Timing Data—SDR12,SDR25,SDR50 Modes (up to 100MHz) (1.8V)
- 14 -
3-1-4. SDR104 Modes (208MHz) (1.8V)
SDIO Protocol Timing Diagram –SDR104 Mode (208MHz)
Table shows SDIO Timing Data—SDR104 Mode (208MHz)
- 15 -
3-2. PCI Express Interface
3-2-1 Differential Tx Output Electricals
- 16 -
3-2-2 Differential Rx Output Electricals
3-3. USB Interface
The USB device interface is compliant with the Universal Serial Bus Specification, Revision 2.0, April 27, 2000. A
USB host uses the USB cable bus and the USB 2.0 device interface to communicate with the chip.
The main features of the USB device interface include:
High/full speed operation (480/12 Mbps)
Suspend/host resume/device resume (remote wake-up)
Built-in DMA engine that reduces interrupt loads on the embedded processor and reduces the system bus
bandwidth requirement for serving the USB device operation
The USB 2.0 device interface is designed with 3.3V signal level pads.
- 17 -
3-3-1. USB 2.0 Device Interface Description
Table shows the signal mapping between the AW-CM389NF and the USB Specification, Revision 2.0.
3-3-2. USB 2.0 Device Functional Description
The device controller uses internal Scatter/Gather DMA engine to transfer the transmit packet from internal SRAM
to USB and the receive packet from USB to internal SRAM. The Device IN Endpoint DMA (DIEPDMAn) and Device
OUT Endpoint DMA (DOEPDMAn) registers are used by the DMA engine to access the base descriptor. The
application is interrupted after the programmed transfer size extracted from the descriptors is transmitted or
received. By using registers, interrupts, and special data structures, the device controller can communicate with the
device controller driver (application/software) about bus states, host request, and data transfer status. The device
controller driver also has all of the routines to respond to the device framework commands issued by a USB host,
so it controls the attachment, configuration, operation, and detachment of the device.
3-4. High-Speed UART Interface
The AW-CH389 supports a high-speed Universal Asynchronous Receiver/Transmitter (UART) interface, compliant
to the industry standard 16550 specification. High-speed baud rates are supported to provide the physical transport
between the device and the host for exchanging Bluetooth data. Table shows the rates supported.
The UART interface features include:
FIFO mode permanently selected for transmit and receive operations
Two pins for transmit and receive operations
Two flow control pins
Interrupt triggers for low-power, high throughput operation
The UART interface operation includes:
Upload boot code to the internal CPU (for debug purposes)
Support diagnostic tests
Support data input/output operations for peripheral devices connected through a standard UART interface
- 18 -
3-4-1. UART Interface Signal Description
Table shows the standard UART signal names on the device.
3-4-2. UART Interface Functional Description
3-3-2-1. Booting from UART
When booting from the UART, the AW-CH389 device has the following requirements:
- 19 -
3-4-2-2. UART as Test Port
Test diagnostic programs may be uploaded to the CPU through the UART interface. During execution, the
diagnostic program transmits performance and status information through the UART by performing a write to the
PBU address space designated to the UART.
3-5. PCM Interface
3-5-1. PCM Timing Specification – Master Mode
- 20 -
3-5-2. PCM Timing Specification – Slave Mode
- 21 -
4. Pin Definition
Pin No
Definition
TMS
JTAG controller select
TCK
JTAG test clock
TDI
JTAG test data(input)
3V3_RF
3.3V Analog RF Power Supply
3V3_VBAT
3.3V VBAT system power supply input
GND
System Ground Pin
TDO
JTAG test data(output)
CONFIG_HOST[0]
Configuration: CONFIG_HOST[0]
CONFIG_HOST[1]
Configuration: CONFIG_HOST[1]
10
CONFIG_HOST[2]
Configuration: CONFIG_HOST[2]
11
GPIO[1]/LTE_SOUT
12
13
14
Basic Description
Type
UART_LTE_SOUT (output)
GPIO[2]/LTE_SIN
UART_LTE_SIN (input)
CONFIG_HOST[3]
Configuration: CONFIG_HOST[3]
GPIO[10]/NFC_NOT_ALLO
GPIO[10] (input/output)
WED(I)
SE I/O for NFC-WI or DCLB, depending on the configuration
I/O
Supply from device to UICC thru integrated power switch CSP only
I/O
15
NFC_WI_IN
16
NFC_SW1_VDDIN
17
GND
18
NFC_SWP2_IO
SE I/O for SWP, NFC-WI, or DCLB, depending on the
configuration
I/O
19
NFC_SWP1_IO
UICC Single Wire Protocol I/O CSP only
I/O
20
GND
21
NFC_SWP1_Vout
Supply to UICC from device thru integrated power switch CSP only.
I/O
22
NFC_SWP2_Vout
Supply from NFC to embedded SE CSP only.
I/O
23
GND
24
NFC_ANTN
Antenna Interface, negative input/output
I/O
25
NFC_ANTP
Antenna Interface, positive input/output
I/O
26
GND
27
SLP_CLK
System Ground Pin
System Ground Pin
System Ground Pin
System Ground Pin
Sleep Clock Input
Used for WLAN and Bluetooth lowpower modes. External sleep clock of 32.768 KHz must be used for auto
reference clock calibration and for WLAN/Bluetooth low power operation.
- 22 -
Pin No
28
Definition
Type
GPIO[13]/NFC/BT IRQ(O) GPIO[13] (input/output)
29
PCIE_WAKEn
30
PCIE_CLKREQn
31
Basic Description
PCIe wake signal (output) (active low)
PCIe clock request (input/output) (active low)
I/O
GPIO[12]/PCIE_PERSTn PCIe host indication to reset the device (input) (active low)
32
GND
33
PCIE_RCLK_N
PCI Express Differential Clock Input—Negative
34
PCIE_RCLK_P
PCI Express Differential Clock Input—Positive
35
GND
36
PCIE_TX_N
PCI Express Transmit Data—Negative
37
PCIE_TX_P
PCI Express Transmit Data—Positive
38
GND
39
PCIE_RX_N
PCI Express Receive Data—Negative
40
PCIE_RX_P
PCI Express Receive Data—Positive
41
GND
42
GPIO[0]/CLK_REQ
43
System Ground Pin
System Ground Pin
System Ground Pin
System Ground Pin
GPIO[0] (input/output)
GPIO[11]/NFC_ACTIVE(O) GPIO[11] (input/output)
44
VIO_SD
1.8V/3.3V Digital I/O SDIO Power Supply
45
PDn
Full Power Down (input) (active low)
46
GPIO[3]/WLAN IRQ(O)
GPIO[3] (input/output)
47
SD_DAT[3]
SDIO Data line Bit[3]
I/O
48
SD_DAT[2]
SDIO Data line Bit[2]
I/O
49
SD_DAT[1]
SDIO Data line Bit[1]
I/O
50
SD_DAT[0]
SDIO Data line Bit[0]
I/O
51
SD_CMD
SDIO Command/response (input/output)
I/O
52
SD_CLK
SDIO Clock input
53
NC
54
GPIO[6]
UART_CTSn (input)
55
GPIO[4]
UART_SOUT (output)
56
GPIO[5]
UART_SIN (input)
57
GPIO[7]
UART_RTSn (output)
58
GPIO[22]/PCM_SYNC
GPIO[22] (input/output)
I/O
No Connect
- 23 -
Pin No
Definition
Basic Description
Type
59
GPIO[19]/PCM_IN
GPIO[19] (input/output)
60
GPIO[20]/PCM_OUT
GPIO[20] (input/output)
61
GPIO[21]/PCM_CLK
GPIO[21] (input/output)
I/O
62
GND
63
GPIO[14]
64
GPIO[8]/WLAN_LED
65
GPIO[9]/BT_LED
66
System Ground Pin
GPIO[14] (input/output)
LED_OUT_WLAN (output)
LED_OUT_BT (output)
NFC_SDA
I/O for external EEPROM using 2-wire protocol CSP only.
I/O
67
NFC_CLK
Serial clock for external EEPROM using 2-wire protocol CSP only.
I/O
68
GND
69
USB_DM
USB Serial Differential Data Negative
I/O
70
USB_DP
USB Serial Differential Data Positive
I/O
71
GND
System Ground Pin
72
3V3_USB
3.3V Power Supply
73
VIO
Digital I/O Power Supply
74
GND
System Ground Pin
75
GND
System Ground Pin
76
GND
System Ground Pin
77
GND
System Ground Pin
78
GND
System Ground Pin
79
GND
System Ground Pin
80
GND
System Ground Pin
81
GND
System Ground Pin
82
GND
System Ground Pin
83
GND
System Ground Pin
84
GND
System Ground Pin
85
GND
System Ground Pin
86
GND
System Ground Pin
87
GND
System Ground Pin
88
GND
System Ground Pin
89
GND
System Ground Pin
System Ground Pin
- 24 -
Pin No
Definition
Basic Description
90
GND
System Ground Pin
91
GND
System Ground Pin
92
GND
System Ground Pin
93
GND
System Ground Pin
94
GND
System Ground Pin
95
GND
System Ground Pin
96
GND
System Ground Pin
G1
GND
System Ground Pin
G2
GND
System Ground Pin
G3
GND
System Ground Pin
G4
GND
System Ground Pin
G5
GND
System Ground Pin
G6
GND
System Ground Pin
G7
GND
System Ground Pin
G8
GND
System Ground Pin
G9
GND
System Ground Pin
G10
GND
System Ground Pin
G11
GND
System Ground Pin
G12
GND
System Ground Pin
G13
GND
System Ground Pin
G14
GND
System Ground Pin
G15
GND
System Ground Pin
G16
GND
System Ground Pin
G17
GND
System Ground Pin
G18
GND
System Ground Pin
G19
GND
System Ground Pin
G20
GND
System Ground Pin
G21
GND
System Ground Pin
G22
GND
System Ground Pin
G23
GND
System Ground Pin
G24
GND
System Ground Pin
- 25 -
Type
Pin No
Definition
Basic Description
G25
GND
System Ground Pin
G26
GND
System Ground Pin
G27
GND
System Ground Pin
G28
GND
System Ground Pin
G29
GND
System Ground Pin
G30
GND
System Ground Pin
G31
GND
System Ground Pin
G32
GND
System Ground Pin
G33
GND
System Ground Pin
G34
GND
System Ground Pin
G35
GND
System Ground Pin
G36
GND
System Ground Pin
Type
Notes:
1. SDIO signals should have 50 ohm impedances.
2. For SDIO interface, 33ohm inline resistor may be needed to help with signal integrity.
3. For GPIO[8] ,it's internal pull up to VIO-RF(3.3V).
4. For GPIO[9] ,it's internal pull up to VIO-RF(3.3V).
5. For PDn pin ,please pull up resistor(51k ohm) to hots or VBAT(3V3).
6. For SDIO interface, the pull up value is between 10K to 100K ohm according to the SDIO v3.0 SPEC.
7. PCIE Impedance targets: Single-ended Z of 60 ohms +- 15% . Differential Impedance of ~100 ohm +- 20%.
8. USB Impedance targets: D+/D- are differential and should have 90ohms impedance.
9. For NFC _SWP1_VDDIN ,please reserve a bypass capacitor(0.1 uF 0402) on the main board.
10. For GPIO[3] pin ,please pull up resistor(10k ohm) to VIO.
- 26 -
4-1 Pin Map
AW-CM389NF Top View Pin Map
- 27 -
5. Mechanical Information
5-1. Package Outline Drawing
- 28 -
5-2. Module Footprint
AW-CM389NF PCB Layout Footprint
- 29 -
6. Package Information
6-1. Recommended Reflow Profile
Reflow Soldering Profile
No
Temperature(ɗ
ɗ)
Time(sec)
Time of above 220ɗ
35~55sec
260ɗ max
Item
Reflow Time
Peak-Temp
Note:
1. Recommend to supply N2 for reflow oven
2. N2 atmosphere during reflow (O2<300ppm)
- 30 -
7. Shipping Information
7-1
1 UNIT DESICCANT
䓇ṏ㞯䬦
HUMIDITY INDICATOR CARD
AFFIX PACKING LABEL
7-2
䓇ṏ㞯䬦
䓇ṏ㞯䬦
AFFIX PACKING LABEL
AFFIX PACKING LABEL
- 31 -
7-3
PINK BUBBLE WRAP
7-4
䓇ṏ㞯䬦
AFFIX PACKING LABEL
7-5
1 Carton= 5 Boxes
TRANSPARENT SEALING TAPE
AFFIX PACKING LABEL
- 32 -
7-6
↢峏㞯䬦
䓇ṏ㞯䬦
AFFIX PACKING LABEL
Note: 1 tape reel = 1 box = 1,500pcs
1 carton = 5 boxes = 5 * 1,500pcs=7,500pcs
- 33 -
Federal Communication Commission Interference Statement
5. Demo board schematic
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device
may not cause harmful interference, and (2) this device must accept any interference received, including interference
that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference
to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to
try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Operations in the 5.15-5.25GHz band are restricted to indoor usage only.
Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment
should be installed and operated with minimum distance 20cm between the radiator & your body.
This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still
responsible for testing their end-product for any additional compliance requirements required with this module installed
IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be
used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end
product (including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may
be maintained between the antenna and users. The final end product must be labeled in a visible area with the
following: “Contains FCC ID: TLZ-AM691NF”. The grantee's FCC ID can be used only when all FCC compliance
requirements are met.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this
RF module in the user's manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
- 42 -
- 45 -
Industry Canada statement:
This device complies with RSS-210 of the Industry Canada Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Ce dispositif est conforme à la norme CNR-210 d'Industrie Canada applicable aux appareils radio exempts de licence.
Son fonctionnement est sujet aux deux conditions suivantes: (1) le dispositif ne doit pas produire de brouillage
préjudiciable, et (2) ce dispositif doit accepter tout brouillage reçu, y compris un brouillage susceptible de provoquer
un fonctionnement indésirable.
Radiation Exposure Statement:
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment
should be installed and operated with minimum distance 20cm between the radiator & your body.
Déclaration d'exposition aux radiations:
Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un environnement non
contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de
rayonnement et votre corps.
This device is intended only for OEM integrators under the following conditions: (For module device use)
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still
responsible for testing their end-product for any additional compliance requirements required with this module
installed.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour utilisation
de dispositif module)
1) L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et les utilisateurs,
et
2) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas
nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes
exigences de conformité supplémentaires requis pour ce module installé.
IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or co-location with another
transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final
product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including
the transmitter) and obtaining a separate Canada authorization.
NOTE IMPORTANTE:
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur
portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme
valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de
réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada.
- 43 -
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be
maintained between the antenna and users. The final end product must be labeled in a visible area with the following:
“Contains IC: 6100A-AM691NF”.
Plaque signalétique du produit final
Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l'antenne peut être installée de
telle sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les utilisateurs. Le produit final doit être
étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC: 6100A-AM691NF".
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF
module in the user's manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
Manuel d'information à l'utilisateur final
L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon d'installer ou
de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module.
Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme
indiqué dans ce manuel.
- 44 -

---

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